Ultrasonic bonder joining wires to electronic chips - binds tape to chip, cuts to length and transfer to planar circuits
Номер патента: DE4024687A1
Опубликовано: 06-02-1992
Автор(ы): Helmut Kuhrmann
Принадлежит: Telefunken Systemtechnik AG
Опубликовано: 06-02-1992
Автор(ы): Helmut Kuhrmann
Принадлежит: Telefunken Systemtechnik AG
Реферат: The electronic chips are supplied in a magazine (3), the top chip being in contact with the probe (1) of an ultrasonic bonding head. Bonding tape (11) is provided from a spool (12) mounted on carriage (15) assembly comprising main and cross slides adjustable by separate leadscrews (14,20). The tape passes over guides and locates between cutting blades (8) and a gripper (9). Electro magnets (EMI-III) provide forces to handle the tape and clip during bonding, cutting and transfer. ADVANTAGE - Allows bonding wires of short length to be produced on chip.
Electronic chip with ubm-type metallization
Номер патента: US20240113054A1. Автор: Ludovic Dupre,Clément LOBRE,Eva Serres. Владелец: Commissariat a lEnergie Atomique et aux Energies Alternatives CEA. Дата публикации: 2024-04-04.