Sound detecting mechanism
Опубликовано: 26-02-2007
Автор(ы): Kenichi Kagawa, Mamoru Yasuda, Masatsugu Komai, Shinichi Saeki, Yoshiaki Ohbayashi
Принадлежит: Hosiden Corp, Tokyo Electron Ltd
Реферат: The invention provides a sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process. Acoustic holes corresponding to perforations Ba are formed on a front surface of a substrate A. A second protective film 406, a sacrificial layer D (407) and a metal film 408 are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate A is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening E. Subsequently, by effecting an etching from the back surface of the substrate A through the acoustic holes, the sacrificial layer 407 is removed and there are formed a void area F between the diaphragm C made of the metal film408 and the substrate A and formed the perforations Ba. The sacrificial layer 407 remaining after the etching is used as a spacer D for maintaining a gap between the back electrode B and the diaphragm C.
Sound detecting mechanism and process for manufacturing the same
Номер патента: KR100716637B1. Автор: 요시아키 오바야시,신이치 사에키,마모루 야스다,마사쓰구 고마이,겐이치 가가와. Владелец: 호시덴 가부시기가이샤. Дата публикации: 2007-05-09.