Stud bumps for post-measurement qubit frequency modification
Номер патента: EP3928262A1
Опубликовано: 29-12-2021
Автор(ы): Eric Peter Lewandowski, Jae-Woong Nah, Jared Barney Hertzberg, Nicholas Torleiv Bronn
Принадлежит: International Business Machines Corp
Опубликовано: 29-12-2021
Автор(ы): Eric Peter Lewandowski, Jae-Woong Nah, Jared Barney Hertzberg, Nicholas Torleiv Bronn
Принадлежит: International Business Machines Corp
Реферат: According to an embodiment of the present invention, a method of producing a quantum computer chip includes performing a frequency measurement on a qubit chip bonded to a test interposer chip for qubits on the qubit chip at an operating temperature of the qubit chip. The method further includes pulling the qubit chip apart from the test interposer chip after performing the frequency measurement, and modifying a frequency of a subset of qubits after pulling the qubit chip apart from the test interposer chip. The method further includes bonding the qubit chip to a device interposer chip after modifying the frequency of the subset of qubits.
Stud bumps for post-measurement qubit frequency modification
Номер патента: AU2020224954B2. Автор: Jae-Woong Nah,Jared Barney Hertzberg,Nicholas Torleiv Bronn,Eric Peter Lewandowski. Владелец: International Business Machines Corp. Дата публикации: 2023-06-22.