Thermography measurement system for conducting thermal characterization of integrated circuits
Реферат: A system and method to folly characterize the thermal behavior of complex 3D submicron electronic devices. The system replaces and/or supplements laser-based surface temperature scanning with a CCD camera-based approach. A CCD camera records multiple points of light energy reflected from an integrated circuit to obtain a static temperature measurement. The system is used to non-invasively measure with submicron resolution the 2D surface temperature field of an activated device. A CW laser illuminates a single point on the surface of an active device and a photodetector records the reflected light energy to obtain a transient temperature measurement. The measured 2D temperature field is used as input for an ultra- fast inverse computational solution to folly characterize the thermal behavior of the complex 3D device. The system extracts geometric features of a known device, assessing the system's ability to combine measured results and computations to folly characterize complex 3D electronic devices.
Thermography measurement system for conducting thermal characterization of integrated circuits
Номер патента: WO2008039621A2. Автор: Peter E. Raad. Владелец: Raad Peter E. Дата публикации: 2008-04-03.