Encapsulating a metal inlay with thermosetting resin and method for making a metal transaction card
Номер патента: WO2023034642A1
Опубликовано: 09-03-2023
Автор(ы): Daniel PIERRARD, Darren Molloy, David Finn
Принадлежит: Metaland Llc
Опубликовано: 09-03-2023
Автор(ы): Daniel PIERRARD, Darren Molloy, David Finn
Принадлежит: Metaland Llc
Реферат: Metal layers (650, 730, 750, 830, 850) of a smartcard (SC, 600, 700, 800) have module openings (614, 712, 714, 812, 814) for receiving a transponder chip module (TCM). Thermosetting resin (TR, 668B, 768A, 768B, 868A, 868B) coats (encapsulates) the bottom surfaces and fills the module openings of the metal layers. A first metal layer (650, 750, 850) may have a slit (S; 620, 720B, 820) which may also be filled by the thermosetting resin. A second metal layer (ML, 730) disposed above the first metal layer (750) may have a slit (S, 720A) which may also be filled by the thermosetting resin. A booster antenna circuit (BAC, 844) may be disposed between the first and second metal layers, with magnetic shielding material (842) disposed between the booster antenna circuit and the second metal layer (730).
Substrates including tape and radio frequency identification devices, and methods and apparatus for making the same
Номер патента: US20060250242A1. Автор: Matthew Groves,Jorge Nash,Wieslaw Drapala,Joseph Renzetti. Владелец: Linear Products Inc. Дата публикации: 2006-11-09.