Поисковая фраза, не более 6 слов. Направление перевода. Размерность языковой модели.

Результаты перевода.
Найдено патентов - 1 шт. Доступно для просмотра - 1 шт. Ссылка на API. Ссылка на расширенную таблицу B.6.1 по ГОСТ Р 15.011-2022

Apparatus for manufacturing printed wiring board and method for manufacturing printed wiring board using the same

Номер патента: WO2001052610A1. Автор: Kazutomo Higa. Владелец: Matsushita Electric Industrial Co.,Ltd. Дата публикации: 19-07-2001.
An apparatus for manufacturing a printed wiring board (112) comprises nozzle pipes and piping pipes. The nozzle pipes (102c, 102d) in the central part out of the piping pipes have diameters larger than those of the nozzle pipes on both sides of the nozzle pipes (102c, 102d), the piping pipes (104c, 104d) connected to the nozzle pipes (102c, 102c) out of the piping pipes have diameters larger than those of the piping pipes on both sides of the piping pipes (104c, 104d), or the interval between adjacent nozzle pipes is smaller than that between adjacent piping pipes farther away from the center. Alternatively the individual intervals between adjacent nozzle pipes can be varied and the nozzle pipes can be moved vertically. The spraying pressure, the swinging angle, and the swinging speed of each nozzle pipe can be determined separately, and can be automatically determined separately. A printed wiring board with high density and high precision can be manufactured at good yield without lowering the productivity, while uniforming the etching precisions of the upper and lower sides of the printed wiring board, by using the manufacturing apparatus, and by a manufacturing method using such a manufacturing apparatus.
1