Methods of bonding articles together and the articles formed thereby

A method of bonding at least two articles together, the method includes forming a mold, wherein the mold is formed at least in part from the articles; and depositing a curable composition in the mold, wherein the curable composition polymerizes through metathesis polymerization to form a molded polymer joint that bonds the two articles together; and the article formed thereby. An article that includes a first portion; a second portion; and a molded polymer joint, wherein the molded polymer joint bonds the first portion to the second portion, the molded polymer joint has a thickness of at least about 1.3 mm, the molded polymer joint includes a metathesis polymer, and both the first and second portions have different compositions than the molded polymer joint.

Process for the Acetylation of Wood Elements

A composite wood product containing acetylated wood elements characterised by an average value in thickness swelling not exceeding 5% after subjection to 25 wet-dry/freeze-thaw cycles as described in Table II. Alternative characterisations include moduli of elasticity and rupture, and bending strength. A two stage process for the acetylation of wood elements is also described. 1. A composite wood product containing acetylated wood elements characterised by an average value in thickness swelling not exceeding 5% after subjection to 25 wet-dry/freeze-thaw cycles as described in Table II.2. A composite wood product containing acetylated wood elements characterised by retaining an average value of at least 90% of its modulus of elasticity after subjection to 25 wet-dry/freeze-thaw cycles as described in Table II.3. A composite wood product containing acetylated wood elements characterised by retaining an average value of at least 90% of its bending strength after subjection to 25 wet-dry/freeze-dry cycles as described in Table II.4. A composite wood product containing acetylated wood elements characterised by retaining at least 70% of its modulus of rupture after soaking for 48 hours in water at ambient temperature.5. A composite wood product containing acetylated wood elements characterised by two or more of an average value in thickness swelling not exceeding 5% after subjection to 25 wet-dry/freeze-thaw cycles as described in Table II , retaining an average value of at least 90% of its modulus of elasticity after subjection to 25 wet-dry/freeze-thaw cycles as described in Table II , retaining an average value of at least 90% of its bending strength after subjection to 25 wet-dry/freeze-dry cycles as described in Table II or retaining at least 70% of its modulus of rupture after soaking for 48 hours in water at ambient temperature.6. The composite of characterised by the use of polymeric di-phenylmethane diisocyanate adhesive.7. Use of polymeric di-phenylmethane ...

ADHESIVE AGENT, ADHESION METHOD AND MANUFACTURING METHOD OF ADHERED MATERIAL

The purpose of the present invention is to improve adhesion failure associated with “a bubble formation phenomenon” that may occur in an adhesive layer when the thickness of an adhesive agent is increased and “Cratering” which may be caused in the adhesive layer by contaminants or the like present on a material to be adhered. 1. A powdery adhesive agent used for adhesion between a metal plate and a porous material , the powdery adhesive agent comprising:thermosetting adhesive particles; anda surface control agent,wherein a contained amount of the surface control agent is 0.1 to 5.0 parts by mass relative to 100 parts by mass of the thermosetting adhesive particles.2. The powdery adhesive agent according to claim 1 , wherein the surface control agent is a leveling agent.3. The powdery adhesive agent according to claim 1 , wherein the surface control agent is a defoaming agent.4. A method of adhering a porous material to a metal plate claim 1 , the method comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claims 1'}, {'@idref': 'CLM-00003', '3'}], 'electrostatically applying the powdery adhesive agent according to one of to to a metal plate, and pre-curing the powdery adhesive agent; and'}pressurizing and heating a porous material on the pre-cured powdery adhesive agent.5. A method of manufacturing an adhered material of a metal plate and a porous material claim 1 , the method comprising:{'claim-ref': [{'@idref': 'CLM-00001', 'claims 1'}, {'@idref': 'CLM-00003', '3'}], 'electrostatically applying the powdery adhesive agent according to one of to to a metal plate, and pre-curing the powdery adhesive agent; and'}pressurizing and heating a porous material on the pre-cured powdery adhesive agent. The invention relates to an adhesive agent. More particularly, the invention relates to a powdery adhesive agent containing thermosetting adhesive particles, and an adhesion method and a manufacturing method of an adhered material using the powdery adhesive agent.Regarding a ...

Pressure-sensitive adhesive sheet

Disclosed is a pressure-sensitive adhesive sheet that has a transparent film substrate and, on at least one side thereof, an acrylic pressure-sensitive adhesive layer. The transparent film substrate has a top coat layer having a specific configuration with an average thickness and a thickness variation being controlled. The acrylic pressure-sensitive adhesive layer is formed from a water-dispersible acrylic pressure-sensitive adhesive composition. The composition includes, as components, an acrylic emulsion polymer derived from constitutive monomers in a specific formulation; a polyether compound having a specific structure; and a specific acetylenic diol. The pressure-sensitive adhesive sheet is found to be highly resistant to scratches and static electrification, to have superior visual quality and satisfactory resistance to adhesive strength increase, and to less cause stains.

PRESSURE SENSITIVE ADHESIVE AND IMAGE DISPLAY DEVICE USING THE SAME

The pressure sensitive adhesive of the present invention includes an acryl-based base polymer and a hydrogenated terpene phenolic resin having a softening point of 70° C. to 150° C. The hydrogenated terpene phenolic resin preferably has a terpene molar ratio of 0.1 to 0.7. The content of acryl-based base polymer is preferably 45 to 95 parts by weight based on total 100 parts by weight of the pressure sensitive adhesive composition. In addition, total content of the acryl-based base polymer and the hydrogenated terpene phenolic resin is preferably 70 parts by weight or more. The pressure sensitive adhesive of the present invention is hardly clouded even under a high-temperature and high-humidity environment, and has level difference followability, thus can be used by disposing between a front transparent plate and a touch panel, between a front transparent plate and an image display panel or between a touch panel and an image display panel. 1. A pressure sensitive adhesive configured to be disposed between a front transparent plate and a touch panel , between a front transparent plate and an image display panel or between a touch panel and an image display panel , whereinthe pressure sensitive adhesive contains an acryl-based base polymer, and a hydrogenated terpene phenolic resin having a softening point of 70° C. to 150° C.,the hydrogenated terpene phenolic resin has a terpene molar ratio of 0.1 to 0.7, andbased on total 100 parts by weight of a pressure sensitive adhesive composition, a content of the acryl-based base polymer is 45 to 95 parts by weight, and a total content of the acryl-based base polymer and the hydrogenated terpene phenolic resin is 70 parts by weight or more.2. The pressure sensitive adhesive according to claim 1 , whereinthe acryl-based base polymer has a polar monomer unit content of 3 to 50% by weight based on a total amount of constituent monomer components.3. An image display device comprising: an image display panel; at least one of a ...

METHODS FOR ENHANCING THE BONDING STRENGTH OF THERMOSET ADHESIVES AND SEALANTS VIA DISULFIDE DYNAMIC CHEMISTRY

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants. 2. The composition of claim 1 , wherein the polymer is poly[(phenyl glycidyl ether)-co-formaldehyde].3. The composition of claim 1 , wherein the poly[(phenyl glycidyl ether)-co-formaldehyde] has a number average molecular weight of at least 320.4. The composition of claim 2 , wherein the poly[(phenyl glycidyl ether)-co-formaldehyde] has a number average molecular weight in the range from 320 to 6000.5. The composition of claim 1 , wherein the crosslinker has the structure HN—X—S—S—X—NH claim 1 , wherein X represents an aliphatic or aromatic hydrocarbon group having from one to ten carbon atoms.6. The composition of claim 5 , wherein the crosslinker is cystamine.7. The composition of claim 1 , wherein the at least two reactive amine groups are hydrazine groups.8. The composition of claim 1 , wherein the crosslinker is cystamine.9. The composition of claim 1 , wherein the mole ratio of amine groups on the crosslinker to epoxy groups on the polymer is at least 1:2.11. The polymer film of claim 10 , wherein the polymer is poly[(phenyl glycidyl ether)-co-formaldehyde].12. The polymer film of claim 11 , wherein the poly[(phenyl glycidyl ether)-co-formaldehyde] has a number average molecular weight in the range from 320 to 6000.13. The polymer film of claim 10 , wherein the crosslinker has the structure HN—X—S—S—X—NH claim 10 , wherein X represents an aliphatic or aromatic hydrocarbon group having from one to ten carbon atoms.14. The polymer film of claim 10 , wherein the crosslinker is cystamine.15. The composition of claim 12 ...

Adhesive sheet and electronic device

An object to be achieved by the present invention is to provide an industrially useful adhesive sheet that can be used to bond various adherends and has excellent peel adhesion, excellent push strength, and excellent holding power under static load. The object of the present invention can be achieved by an adhesive sheet having, on one side or both side of a substrate, an adhesive layer (A) having a tensile strength of 6 N/cm 2 or more as determined from a stress-strain curve (a so-called S-S curve) at a strain of 100%.

METHODS FOR SEALING MICROCELL CONTAINERS WITH PHENETHYLAMINE MIXTURES

A method for sealing a container having an opening by contacting the opening with a mixture including a phenethylamine and a first polymer, adding a fluid to be contained to the container, and then adding a second mixture, comprising a second polymer, whereupon an interaction between the first and second polymer mixtures result in a seal being formed over the opening, thereby containing the fluid. The first polymer is typically a water-swellable polymer and the second polymer is typically a hydrophilic polymer that will form an interpenetrating network with the swellable polymer. 1. A layered display medium comprising an electrophoretic material including a plurality of electrically charged particles disposed in a fluid and capable of moving through the fluid under the influence of an electric field , wherein two layers of the display medium are joined with a mixture comprising a phenethylamine and a swellable polymer.2. The layered display medium of claim 1 , wherein the phenethylamine is dopamine claim 1 , epinephrine claim 1 , phenylephrine claim 1 , norepinephrine claim 1 , 3 claim 1 ,4-dihydroxyphenylalanine claim 1 , or 3 claim 1 ,4-dihydroxyphenylacetic acid.3. The layered display medium of claim 1 , wherein the swellable polymer is selected from the group consisting of pyrrolidones claim 1 , polysaccharides claim 1 , collagen claim 1 , polyamides claim 1 , polyesters claim 1 , acrylates claim 1 , polyurethanes claim 1 , polyethers claim 1 , and polyvinyl alcohols.4. The layered display medium of claim 1 , wherein the electrophoretic material is held in a container constructed from acrylates claim 1 , (meth)acrylates claim 1 , vinylethers claim 1 , esters claim 1 , epoxides claim 1 , polyethylene terephthalate (PET) claim 1 , high-density polyethylene (HDPE) claim 1 , polypropylene (PPE) claim 1 , polyvinyl chloride (PVC) claim 1 , or cellulose.5. The layered display medium of claim 4 , wherein the container is a microcell claim 4 , a delayed release drug ...

HYDROCARBON-BASED POLYMERS BEARING TWO ALKOXYSILANE END GROUPS

Hydrocarbon-based polymer of formula (1) bearing alkoxysilane end groups: 2. The hydrocarbon-based polymer comprising two alkoxysilane end groups as claimed in claim 1 , said polymer being such that the group of formula —[Z]—Si(R)(OR′)is chosen from —Si(OCH); —SiCH(OCH); —CHSi(OCH); —CHSiCH(OCH); —CO—O—(CH)Si(OCH)); and —CO—O—(CH)SiCH(OCH)).9. The preparation process as claimed in claim 8 , such that the chain-transfer agent has the formula CH═CH—[Z]—Si(R)(OR′)in which:R and R′, which may be identical or different, each represent a linear or branched alkyl group comprising from 1 to 4 carbon atoms,Z is a divalent group chosen from alkylene groups, optionally interrupted with an ester function, and comprising from 1 to 22 carbon atoms,q is an integer equal to 0 or 1, andr is an integer equal to 0, 1 or 2.10. The preparation process as claimed in claim 8 , such that the chain-transfer agent is chosen from: CH═CH—Si(OCH); CH═CH—SiCH(OCH); CH═CH—CHSi(OCH); CH═CH—CHSiCH(OCH); CH═CH—CO—O—(CH)Si(OCH); and CH═CH—CO—O—(CH)SiCH(OCH).11. The preparation process as claimed in claim 8 , said process being such that the mole ratio of the CTA to the compound comprising at least one hydrocarbon-based ring is within a range from 1 to 10 mol %.12. The preparation process as claimed in claim 8 , said process also comprising at least one additional hydrogenation of double bonds.13. The preparation process as claimed in claim 12 , such that the additional hydrogenation is performed by catalytic hydrogenation claim 12 , under hydrogen pressure and in the presence of a hydrogenation catalyst.14. An adhesive composition comprising at least one polymer as claimed in and from 0.01% to 3% by weight of at least one crosslinking catalyst.15. A process for bonding by assembly of two substrates claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00014', 'claim 14'}, 'the coating of an adhesive composition as claimed in , in liquid form, preferably in the form of a layer with a thickness in a range ...

COMPOSITE OPTICAL REFLECTIVE FILM AND PREPARATION METHOD THEREFOR

The present invention provides a composite optical reflective film for a backlight source system and a preparation method therefor. The composite optical reflective film comprises a transparent diaphragm and a reflective diaphragm, wherein the reflective diaphragm is spliced to the transparent diaphragm through an adhesive, and the other face of the reflective diaphragm is coated with a reflective coating. The composite optical reflective film has good dimension stability, is not easy to warp and deform, has a higher reflectivity, has a simple preparation process and is easy to operate. 1. A composite optical reflective film , wherein the reflective film comprises a transparent diaphragm and a reflective diaphragm having two sides; the reflective diaphragm is spliced on one side to the transparent diaphragm with an adhesive , and the other side of the reflective diaphragm is coated with a reflective coating; and the adhesive consists of a phenolic resin , an inorganic powder filler , and a solvent.2. The composite optical reflective film according to claim 1 , wherein the reflective diaphragm is a white reflective diaphragm claim 1 , and the reflective coating is an ultraviolet-resistant highly reflective coating.3. The composite optical reflective film according to claim 2 , wherein the material of the ultraviolet-resistant highly reflective coating comprises silane-crosslinked polyolefin claim 2 , zinc oxide and/or titanium dioxide; and the content of zinc oxide and/or titanium dioxide is 50-70% (weight percentage).4. The composite optical reflective film according to claim 2 , wherein the weight ratio of the phenolic resin claim 2 , inorganic powder filler and solvent is 100:80-150:40-80.5. The composite optical reflective film according to claim 2 , wherein the material of the white reflective diaphragm comprises polyethylene terephthalate (PET) claim 2 , and 10-25% of nano-modified inorganic fillers are homogeneously dispersed in the material; and the material ...

Novel hydrocarbon-based polymers bearing dithiocyclocarbonate end groups

1) Hydrocarbon-based polymer of formula (I): 2. Hydrocarbon-based polymer according to claim 1 , characterized in that:{'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'R, R, R, R, R, R, Rand Rrepresent a hydrogen atom or an alkyl radical comprising from 1 to 14 carbon atoms;'}the integers x and y are within a range extending from 0 to 2, the sum x+y being within a range extending from 0 to 2;x is equal to 1 and y is equal to 1;{'sup': 9', '10', '11', '12, 'R, R, Rand Rrepresent a hydrogen atom or a radical, the hydrocarbon-based part of which comprises from 1 to 14 carbon atoms;'}z is an integer equal to 1 or 2; and/orthe number-average molecular mass Mn is within a range extending from 1000 to 50 000 g/mol.3. Hydrocarbon-based polymer according to claim 1 , characterized in that:when m is non-zero and when n1 and n2 are each equal to 0, then the ratio: m/(p1+p2+m) is within the interval ranging from 30 to 70%; or{'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'when m is equal to 0 and when the sum n1+n2 is non-zero, then at least one of the groups R, R, R, R, R, R, Rand Ris other than a hydrogen atom, and the ratio: (n1+n2)/(p1+p2+n1+n2) is within the interval ranging from 30 to 70%; or'}{'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'when m is non-zero, when the sum n1+n2 is non-zero and when each of the groups R, R, R, R, R, R, Rand Ris a hydrogen atom, then the ratio: m/(p1+p2+n1+n2+m) is within the interval ranging from 30 to 70%; or'}{'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'when m is non-zero, when the sum n1+n2 is non-zero and when at least one of the groups R, R, R, R, R, R, Rand Ris other than a hydrogen atom, then the ratio: (m+n1+n2)/(p1+p2+n1+n2+m) is within the interval ranging from 30 to 70%.'}11. Hydrocarbon-based polymer according to claim 1 , characterized in that the radical A represents a methylene radical; and/or Z is such that the divalent group -A-Z— is the group -A-OC(═O)— and the divalent group —Z-A- is the group —C(═O)O-A-.12. Hydrocarbon- ...

POLYARYLETHER KETONE IMIDE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): 2. The method of claim 1 , wherein introducing the aluminum chloride into the reactor comprises introducing the aluminum chloride into the reactor at a temperature of about −10° C. claim 1 , followed by allowing a temperature of the composition to increase to about 10° C. claim 1 , followed by cooling the composition to a temperature of about −10° C.3. The method of claim 1 , further comprising introducing a solvent into the reactor claim 1 , wherein the composition comprises the solvent.4. The method of claim 3 , wherein the solvent is selected from the group consisting of o-dichlorobenzene claim 3 , dichloromethane claim 3 , dichloroethane claim 3 , and mixture(s) thereof.5. The method of claim 3 , wherein introducing the solvent is performed by preheating the solvent before introducing the solvent into the reactor.6. The method of claim 5 , wherein preheating is performed at a temperature of from about 160° C. to about 190° C.7. The method of claim 1 , wherein mixing is performed at a temperature of from about −30° C. to about 25° C.8. The method of claim 1 , wherein obtaining the polymer comprises introducing water and ammonia to the composition.10. The method of claim 9 , wherein the molecular weight of the polymer is from about 90 kDa to about 110 kDa.11. The method of claim 9 , wherein the polymer is a random copolymer.12. The method of claim 9 , wherein the polymer is a block copolymer.14. The method of claim 13 , wherein the molecular weight of the polymer is from about 90 kDa to about 110 kDa.15. The method of claim 13 , wherein the polymer is a random copolymer.16. The method of claim 13 , wherein the polymer is a block copolymer.17. The method of claim 13 , wherein the adherend is selected from the group consisting of a thermoset composite claim 13 , a thermoplastic composite claim 13 ...

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE CONDUCTIVE ADHESIVE COMPOSITION, AND ELECTRONIC DEVICE CONTAINING PHOTOSENSITIVE CONDUCTIVE ADHESIVE COMPOSITION

The disclosure provides a photosensitive adhesive composition including 10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group, 10 parts by weight to 90 parts by weight of a tertiary amine polymer, and 0.5 parts by weight to 10 parts by weight of a photoacid initiator. The weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000. The disclosure also provides a photosensitive conductive adhesive composition and an electronic device containing the photosensitive conductive adhesive composition. 1. A photosensitive adhesive composition , comprising:10 parts by weight to 90 parts by weight of a monomer having a vinyl ether functional group;10 parts by weight to 90 parts by weight of a tertiary amine polymer; and0.5 parts by weight to 10 parts by weight of a photoacid initiator,wherein a weight-average molecular weight of the tertiary amine polymer is between 2000 and 20000.2. The photosensitive adhesive composition of claim 1 , whereinthe monomer having the vinyl ether functional group is 30 parts by weight to 70 parts by weight, the tertiary amine polymer is 30 parts by weight to 70 parts by weight, and the photoacid initiator is 1 part by weight to 5 parts by weight.5. The photosensitive adhesive composition of claim 1 , wherein the photoacid initiator is a diazonium salt claim 1 , a phosphonium salt claim 1 , a sulfonium salt claim 1 , an iodonium salt claim 1 , a sulfonate compound claim 1 , or a combination of the above.6. The photosensitive adhesive composition of claim 1 , further comprising a thermally conductive powder.7. The photosensitive adhesive composition of claim 6 , wherein the thermally conductive powder is 200 parts by weight to 1000 parts by weight.8. The photosensitive adhesive composition of claim 7 , wherein the thermally conductive powder is a metal oxide claim 7 , a ceramic claim 7 , a diamond claim 7 , a charcoal claim 7 , boron nitride claim 7 , aluminum oxide claim 7 , ...

TIRE

A tire () including: a circular tire frame () formed from a resin material; and a reinforcing metal cord member () that is wound on an outer circumference of the tire frame (), at least a portion of the reinforcing metal cord member () being covered, via an adhesion layer including a solvent-based adhesive, with a covering composition that includes at least one thermoplastic material selected from the group consisting of a thermoplastic resin and a thermoplastic elastomer. 1. A tire comprising:a circular tire frame formed from a resin material; anda reinforcing metal cord member that is wound on an outer circumference of the tire frame, at least a portion of the reinforcing metal cord member being covered, via an adhesion layer including a solvent-based adhesive, with a covering composition that comprises at least one thermoplastic material selected from the group consisting of a thermoplastic resin and a thermoplastic elastomer.2. The tire of claim 1 , wherein the solvent-based adhesive comprises at least one selected from the group consisting of an epoxy-based resin claim 1 , a phenol-based resin claim 1 , an olefin-based resin claim 1 , and a vinyl-based resin.3. The tire of claim 1 , wherein the thermoplastic material included in the covering composition is at least one selected from the group consisting of a polyamide-based thermoplastic resin claim 1 , a polyester-based thermoplastic resin claim 1 , a polyamide-based thermoplastic elastomer claim 1 , and a polyester-based thermoplastic elastomer.4. The tire of claim 1 , wherein the thermoplastic material included in the covering composition is at least one selected from the group consisting of a polyamide-based thermoplastic elastomer and a polyester-based thermoplastic elastomer.5. The tire of claim 1 , wherein the solvent-based adhesive comprises at least one selected from the group consisting of an epoxy-based resin and a phenol-based resin.6. The tire of claim 1 , wherein the resin material that forms the ...

HOT MELT ADHESIVE

An object of the present invention is to provide a hot melt adhesive being environmentally-friendly, having excellent adhesion property to various substrates such as paper substrate and polyolefin substrate, as well having excellent thermal stability. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin. 1. A hot melt adhesive comprising:(A) a polar functional group-modified polymer,(B) an aliphatic polyester-based resin,(C) an olefin-based polymer, and(D) a tackifier resin.2. The hot melt adhesive according to claim 1 , wherein the polar functional group is at least one functional group selected from the group consisting of an acid anhydride group claim 1 , a maleic acid group claim 1 , a carboxyl group claim 1 , an amino group claim 1 , an imino group claim 1 , an alkoxysilyl group claim 1 , a silanol group claim 1 , a silyl ether group claim 1 , a hydroxyl group and an epoxy group.3. The hot melt adhesive according to claim 2 , wherein the polar functional group is at least one functional group selected from a maleic acid group or an amino group.4. The hot melt adhesive according to claim 1 , wherein the aliphatic polyester-based resin (B) comprises at least one selected from a polylactic acid-based resin and poly(butylene succinate).5. The hot melt adhesive according to claim 1 , comprising 5 to 60 parts by weight of component (C) to 100 parts by weight of total weight of components (A) to (D).6. The hot melt adhesive according to comprising:(A) an amino group group-modified SEBS polymer,(B) a polylactic acid resin,(C) an ethylene copolymer having propylene, butane or octane comonomers, and(D) a tackifier resin.7. An article comprising the adhesive of .8. The article of which is a vehicle interior. The present invention relates to a hot melt adhesive and more specifically to a hot melt adhesive which has ...

Soft magnetic thermosetting adhesive film, magnetic film laminate circuit board, and position detection device

A soft magnetic thermosetting adhesive film includes a magnetic layer and a surface layer laminated on one side of the magnetic layer. The magnetic layer is formed from a magnetic composition containing acrylic resin, epoxy resin, phenol resin, and soft magnetic particles. The surface layer is formed from a surface layer composition containing acrylic resin, epoxy resin, and phenol resin and not substantially containing soft magnetic particles.

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film. 1. A package structure , comprising:a semiconductor die; and a patterned conductive layer;', 'a dielectric layer, disposed on the patterned conductive layer; and', 'an inter-layer film, sandwiched between the dielectric layer and the patterned conductive layer, wherein the patterned conductive layer is separated from the dielectric layer through the inter-layer film., 'a redistribution circuit structure, disposed on and electrically connected to the semiconductor die, and comprising2. The package structure of claim 1 , further comprising:a seed layer, wherein the patterned conductive layer is disposed on the seed layer, and the patterned conductive layer is wrapped by the seed layer and the inter-layer film.3. The package structure of claim 1 , wherein a first surface of the inter-layer film is in physical contact with the patterned conductive layer claim 1 , a second surface of the inter-layer film is in physical contact with the dielectric layer claim 1 , and the first surface is opposite to the second surface.5. The package structure of claim 4 , wherein a thickness of the inter-layer film is greater than or substantially equal to 50 nm and is less than or substantially equal to 350 nm.6. The package structure of claim 1 , wherein the inter-layer film comprises a nanostructure layer claim 1 , and the nanostructure layer comprises a nanostructure layer of poly-crystalline CuO.7. The package structure of claim 6 , wherein ...

LOW SURFACE ENERGY ADHESIVE

Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20° C. and the low glass transition temperature tackifier has a Tg of less than 0° C. 2. The adhesive according to claim 1 , wherein the adhesive comprises 40 to 55% by weight total tackifier content based on the total weight of the acrylic copolymer claim 1 , the high Tg tackifier and the low Tg tackifier.3. The adhesive according to claim 1 , further comprising a crosslinker.4. The adhesive of claim 3 , wherein the crosslinker is a covalent crosslinker selected from the group consisting of bisamides claim 3 , epoxies claim 3 , and melamines.5. The adhesive of claim 3 , wherein the crosslinker is an ionic crosslinking agent claim 3 , wherein the ionic crosslinking agent is selected from the group consisting of multifunctional amines claim 3 , metal oxides claim 3 , and organo-metallic chelating agents.6. The adhesive according to claim 1 , further comprising an additional component selected from the group consisting of fillers claim 1 , dyes claim 1 , pigments claim 1 , antioxidants claim 1 , UV-stabilizers.7. The adhesive according to claim 1 , wherein the glass transition temperature of the adhesive is no greater than 260 K claim 1 , as calculated using the Fox Equation.8. The adhesive according to claim 6 , wherein the fillers are fumed silica.9. The adhesive according to claim 6 , wherein the fillers are nanoparticles.10. The adhesive according to claim 9 , wherein the nanoparticles ...

HOT-MELT ADHESIVE COMPOSITION FOR ELASTIC ATTACHMENTS

The present invention relates to a hot-melt adhesive composition comprising a propylene homopolymer, an alpha-olefin copolymer, a carboxylic acid- and/or anhydride-functionalized olefin compound and a tackifying resin. The present invention also relates to a laminate comprising the hot-melt adhesive composition according to the invention that can be used in disposable hygiene articles. 3. The hot-melt adhesive composition according to claim wherein the mass ratio between the propylene homopolymer (A) and the alpha-olefin copolymer (B) is higher than or equal to 0.8.4. The hot-melt adhesive composition according to claim 1 , wherein the alpha-olefin copolymer (B) comprises at least one propylene monomer.5. The hot-melt adhesive composition according to claim 1 , wherein the carboxylic acid- and/or anhydride-modified polyolefin compound (C) comprises at least one monomer selected from propylene and ethylene claim 1 , and at least one monomer selected from butylene claim 1 , pentene or hexene.6. The hot-melt adhesive composition according to claim 1 , wherein the carboxylic acid- and/or anhydride-modified polyolefin compound (C) comprises from 0.5 to 10% by weight of carboxylic acid and/or anhydride functions claim 1 , based on the total weight of the carboxylic acid- and/or anhydride-modified polyolefin compound.7. The hot-melt adhesive composition according to claim 1 , wherein the carboxylic acid- and/or anhydride-modified polyolefin compound (C) is selected from a carboxylic acid- and/or anhydride-modified polyolefin copolymer having a molecular weight higher than 10000 g/mol and having a density higher than or equal to 0.890 g/cm(C1).8. The hot-melt adhesive composition according to claim 7 , further comprising at least one carboxylic acid- and/or anhydride-modified polyolefin wax having a molecular weight ranging from 100 to 10000 (C2).9. Laminate comprising at least one elastic material and at least two substrates claim 1 , said elastic material being inserted ...

Borated benzoxazine for use in the synthesis of polybenzoxazine

in which: Z represents an at least divalent, aliphatic, cycloaliphatic or aromatic, bonding group comprising at least one carbon atom and optionally at least one heteroatom chosen from O, S and P; and R1, R2, R3 and R4, which are identical or different, represent hydrogen or an alkyl comprising from 1 to 12 carbon atoms, it being possible for R1 and R2, on the one hand, and R3 and R4, on the other hand, optionally to form a heterocycle with the two oxygen atoms and the boron atom to which they are respectively bonded.

STABILIZATION OF HOT MELT ADHESIVES

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes a component (B), which is a polymeric sterically hindered amine, and a component (C), which is a specific sterically hindered phenol. 23-. (canceled)4: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition consists of components (B) and (C).5: The stabilized hot melt adhesive according to claim 1 , wherein a weight ratio between components (B) and (C) is between 1:5 and 5:1.69-. (canceled)14: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition further comprises:one or more additives selected from the group consisting of a phosphite, a thioether, a secondary arylamine, a hydroxyl-amine based stabilizer, a UV-absorber, and an inorganic stabilizer.17: The stabilized hot melt adhesive according to claim 16 , wherein the stabilizer composition consists of components (B) and (C).18: The stabilized hot melt adhesive according to claim 16 , wherein a weight ratio between components (B) and (C) is between 1:5 and 5:1.23: The stabilized hot melt adhesive according to claim 16 , wherein the stabilizer composition further comprises:one or more additives selected from the group consisting of a phosphite, a thioether, a secondary arylamine, a hydroxyl-amine based stabilizer, a UV-absorber, and an inorganic stabilizer.25: The stabilized hot melt adhesive according to claim 1 , wherein the hot melt adhesive comprises a polyolefin claim 1 , and ...

COMPOSITION FOR BONDING WINDINGS OR CORE LAMINATES IN AN ELECTRICAL MACHINE, AND ASSOCIATED METHOD

A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented. 2. The curable composition of claim 1 , wherein a cured composition of the curable composition shows thermal dimensional stability such that the cured composition has less than 60 percent mean density change after being heated at a temperature greater than about 280° C. for a time period greater than about 500 hours.3. The curable composition of claim 1 , wherein the polyfunctional cyanate ester comprises phenolic novolac cyanate ester claim 1 , dicylopentadiene novolac cyanate ester claim 1 , 1 claim 1 ,2 claim 1 ,3-tris(4-cyanatophenyl)-propane claim 1 , or combinations thereof.5. The curable composition of claim 1 , wherein the second difunctional cyanate ester comprises a prepolymer of a difunctional cyanate ester having a formula (V):{'br': None, 'sup': 4', '4', '4, 'NCO—Ar—R—Ar—OCN,\u2003\u2003(V)'}{'sup': 4', '4, 'sub': 5', '30', '3', '20, 'wherein Aris a C-Caromatic radical, and Ris C-Caliphatic radical.'}7. The curable composition of claim 1 , wherein the curable composition has a viscosity less than about 1000 centiPoise at 70° C.8. The curable composition of claim 1 , wherein the cured composition has a crack resistance of such that the average number of cracks having a dimension greater than 2 mm in length is equal to or less than one.9. The curable composition of claim 1 , wherein the composition is substantially free of a solvent.10. The curable composition of claim 1 , wherein the composition further comprises a solvent.11. An impregnating resin comprising a ...

ADHESIVE, AND TRANSPARENT SUBSTRATE USING SAME

An adhesive is provided that shows excellent adhesion under high temperature even when any one of a glass and a thermoplastic resin is used as an adherend. An adhesive according to an embodiment is used for an adherend that includes a glass and/or a resin layer including a thermoplastic resin (A), and the adhesive including: 1. An adhesive to be used for an adherend that comprises a glass and/or a resin layer comprising a thermoplastic resin (A) , the adhesive comprising:a thermoplastic resin (b);a thermosetting monomer (c); anda curing catalyst,wherein:the thermoplastic resin (b) comprises an aromatic thermoplastic resin (b1) having a glass transition temperature (Tg) of more than 200° C. and/or an alicyclic thermoplastic resin (b2) having a glass transition temperature (Tg) of more than 200° C.;the thermosetting monomer (c) has compatibility with the thermoplastic resin (b); anda content of the thermosetting monomer (c) is from 5 parts by weight to 50 parts by weight with respect to 100 parts by weight of the thermoplastic resin (b).2. An adhesive according to claim 1 , wherein the thermoplastic resin (b) has compatibility with the thermoplastic resin (A).3. An adhesive according to claim 1 , wherein the thermoplastic resin (b) has a weight-average molecular weight of 18×10or less.4. An adhesive according to claim 1 , wherein the thermosetting monomer (c) has an epoxy group and/or an oxetanyl group.5. An adhesive according to claim 1 , wherein the thermosetting monomer (c) has an alkoxysilane group claim 1 , a silicate group claim 1 , and/or a siloxane group.6. An adhesive according to claim 1 , wherein a content of the curing catalyst is from 1 part by weight to 30 parts by weight with respect to 100 parts by weight of the thermosetting monomer (c).7. An adhesive according to claim 1 , wherein the curing catalyst comprises a thermally latent curing catalyst.8. An adhesive according to claim 7 , wherein the curing catalyst comprises an imidazole-based catalyst.9. ...

HYDROCARBON-BASED POLYMERS BEARING TWO ALKOXYSILANE END GROUPS

Hydrocarbon-based polymer of formula (1) bearing alkoxysilane end groups: 2. The hydrocarbon-based polymer comprising two alkoxysilane end groups as claimed in claim 1 , said polymer being such that the group of formula —[Z]—Si(R)(OR′)is chosen from —Si(OCH); —SiCH(OCH); —CHSi(OCH); —CHSiCH(OCH); —CO—O—(CH)Si(OCH)); and —CO—O—(CH)SiCH(OCH)).9. The preparation process as claimed in claim 8 , such that the chain-transfer agent has the formula CH═CH—[Z]—Si(R)(OR′)in which:R and R′, which may be identical or different, each represent a linear or branched alkyl group comprising from 1 to 4 carbon atom,Z is a divalent group chosen from alkylene groups, optionally interrupted with an ester function, and comprising from 1 to 22 carbon atoms,q is an integer equal to 0 or 1, andr is an integer equal to 0, 1 or 2.10. The preparation process as claimed in claim 8 , such that the chain-transfer agent is chosen from: CH═CH—Si(OCH); CH═CH—SiCH(OCH); CH═CH—CHSi(OCH); CH═CH—CHSiCH(OCH); CH═CH—CO—O—(CH)Si(OCH); and CH═CH—CO—O—(CH)SiCH(OCH).11. The preparation process as claimed in claim 8 , said process being such that the mole ratio of the CTA to the compound comprising at least one hydrocarbon-based ring is within a range from 1 to 10 mol %.12. The preparation process as claimed in claim 8 , said process also comprising at least one additional hydrogenation of double bonds.13. The preparation process as claimed in claim 12 , such that the additional hydrogenation is performed by catalytic hydrogenation claim 12 , under hydrogen pressure and in the presence of a hydrogenation catalyst.14. An adhesive composition comprising at least one polymer as claimed in and from 0.01% to 3% by weight of at least one crosslinking catalyst.15. A process for bonding by assembly of two substrates claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00014', 'claim 14'}, 'the coating of an adhesive composition as claimed in , in liquid form, preferably in the form of a layer with a thickness in a range ...

STABILIZATION OF HOT MELT ADHESIVES

The present invention pertains to a stabilized hot melt adhesive containing a) one or more hot melt adhesive materials and b) a stabilizer composition. The one or more hot melt adhesive materials a) include a polyolefin, a styrene-isoprene-styrene block co-polymer, a styrene-butadiene-styrene block co-polymer, a polyacrylate, an acryl-copolymer, an ethylene vinyl acetate, a polyamide, a polyester, a polyurethane, a polyimide, a silane terminated polyolefin, a silane terminated poly-ether, and a silane terminated polyurethane. The stabilizer composition includes two or three of a component (A) which is a specific sterically hindered amine, a component (B) which is a polymeric sterically hindered amine, and a component (C) which is a specific sterically hindered phenol. 2: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition comprises components (A) and (C).3: The stabilized hot melt adhesive according to claim 1 , wherein a weight ratio between components (A) and (C) is between 1:5 and 5:1.4: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition comprises components (B) and (C).5: The stabilized hot melt adhesive according to claim 4 , wherein a weight ratio between components (B) and (C) is between 1:5 and 5:1.6: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition comprises components (A) claim 1 , (B) and (C).7: The stabilized hot melt adhesive according to claim 6 , wherein a weight ratio between components (A) claim 6 , (B) and (C) is between 8:1:1 and 1:8:1 and 1:1:8.14: The stabilized hot melt adhesive according to claim 1 , wherein the stabilizer composition further comprises one or more additives selected from the group consisting of: a phosphite claim 1 , a thioether claim 1 , a secondary arylamine claim 1 , a hydroxyl-amine based stabilizer claim 1 , a UV-absorber and an inorganic stabilizer. The present invention pertains to a stabilized hot ...

WAFER LAMINATE AND MAKING METHOD

A wafer laminate has an adhesive layer () sandwiched between a transparent substrate () and a water (), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer () includes a first cured resin layer () disposed adjacent the substrate and having light-shielding properties and a second cured resin layer () disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition. 1. A wafer laminate comprising a transparent substrate , an adhesive layer formed on the substrate , and a wafer bonded to the adhesive layer , with a circuit-forming surface of the wafer facing the adhesive layer ,the adhesive layer including a first cured resin layer (A) disposed adjacent the substrate and having light-shielding properties and a second cured resin layer (B) disposed adjacent the wafer and comprising a cured product of a thermosetting resin composition.2. The wafer laminate of wherein the first cured resin layer (A) having light-shielding properties has a transmittance of up to 15% at wavelength 500 nm and substantial absorption at wavelength up to 500 nm.4. The wafer laminate of wherein the resin composition of the first cured resin layer (A) further comprises at least one of a crosslinker claim 3 , an acid generator and an organic solvent.5. The wafer laminate of wherein the second cured resin layer (B) is a cured product of a thermosetting resin composition based on a silicone resin polymer and/or epoxy resin polymer claim 1 , the cured product having a resin modulus of 10 to 1 claim 1 ,000 MPa at 25° C.6. The wafer laminate of wherein the thermosetting resin composition is based on a phenol-modified silicone resin and/or epoxy-modified silicone resin.9. The wafer laminate of wherein the first cured resin layer (A) has a thickness of 0.1 to 30 μm claim 1 , and the second cured resin layer (B) has a thickness of 1 to 200 μm.10. A method for preparing the wafer laminate of by bonding the wafer at its circuit-forming ...

FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, METHOD FOR PRODUCING FILM FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR SEMICONDUCTOR DEVICE PRODUCTION

The present invention relates to a film for semiconductor device production, which includes: a separator; and a plurality of adhesive layer-attached dicing tapes each including a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator, in which the separator has a cut formed along the outer periphery of the dicing tape, and the depth of the cut is at most ⅔ of the thickness of the separator. 1. A film for semiconductor device production , which comprises:a separator; anda plurality of adhesive layer-attached dicing tapes each comprising a dicing tape and an adhesive layer laminated on the dicing tape, which are laminated on the separator at a predetermined interval in such a manner that the adhesive layer attaches to the separator,wherein the separator has a cut formed along the outer periphery of the dicing tape,wherein the depth of the cut is at most ⅔ of the thickness of the separator, and wherein the film for semiconductor device production is in a form of being wound as a roll.3. A method for producing a semiconductor device by using the film for semiconductor device production according to claim 1 , the method comprising:peeling the separator from the film for semiconductor device production, andattaching a semiconductor wafer onto the adhesive layer.4. A film for semiconductor device production claim 1 , which comprises:a separator; anda plurality of dicing tapes laminated on a separator at a predetermined interval,wherein the separator is processed to have a cut formed along the outer periphery of the dicing tape,wherein the depth of the cut is at most ⅔ of the thickness of the separator, and wherein the film for semiconductor device production is in a form of being wound as a roll.6. A method for producing a semiconductor device by using the film for semiconductor device production according to claim 4 , the method ...

REACTIVE TWO-COMPONENT HOTMELT ADHESIVE COMPOSITION

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150° C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190° C. in which it can melt and chemically crosslink, the second temperature being above the first temperature. 2. The melt adhesive according to claim 1 , wherein the melting temperature and the crosslinking temperature are separated from one another by at least 30° C.3. The melt adhesive according to claim 1 , wherein the composition contains up to 80 wt % nonreactive polymers and/or resins.4. The melt adhesive according to claim 1 , wherein the reactive polymers A and/or B have a viscosity from 10 claim 1 ,000 to 2 claim 1 ,000 claim 1 ,000 mPas or an MFI from 2 to 2500 g/10 min in the first temperature range.5. The melt adhesive according to claim 1 , wherein the melt adhesive contains EVA as an inert polymer.6. The melt adhesive according to claim 1 , wherein functionalized ethylene/(meth)acrylate copolymers are employed as polymer A and B.7. The melt adhesive according to claim 1 , wherein functionalized ethylene/(meth)acrylate copolymers which contain multiple functional groups per molecule chain are employed as polymer A and B.8. The melt adhesive according to claim 1 , wherein the adhesive has a viscosity from 10 claim 1 ,000 to 500 claim 1 ,000 mPas in the second temperature range.9. The melt adhesive ...

Allyl-containing resin and uses of the same

An allyl-containing resin is provided. The allyl-containing resin comprises a repeating unit comprising a structural unit represented by the following formula (I): wherein, R 1 to R 3 in formula (I) are as defined in the specification; the Fourier transform infrared spectrum of the allyl-containing resin has a signal intensity “a” from 1650 cm −1 to 1630 cm −1 and a signal intensity “b” from 1620 cm −1 to 1560 cm −1 , and 0<a/b≤1.20; and the quantitative 1 H-NMR spectrum of the allyl-containing resin has a signal intensity “c” from 3.2 ppm to 6.2 ppm and a signal intensity “d” from 6.6 ppm to 7.4 ppm, and 0<c/d≤1.20.

LIQUID HYDROCARBON COPOLYMERS COMPRISING TWO ALKOXYSILANE END GROUPS, AND PRODUCTION METHOD THEREOF

Hydrocarbon copolymer P comprising 2 alkoxysilane end groups Fand Fof formulae: —F: (R′O)RSi—R″—NH—C(O)O—(CH)g— and F2: —(CH)—OC(O)—NH—R″—SiROR′); or —F: (R′O)RSi—R″—NR′″—C(O)—NH—(CH)— and F: —(CH)—NH—C(O)—NR′″—R″—SiR(OR′); or —F1: (R′O)RSi—R″—NR′″—C(O)—(CH)— and F: —(CH)C(O)—NR′″—R″—SiR(OR′); wherein t is 0, 1 or 2; g1 and d1 are 1, 2 or 3; g2 and d2 are 0, 1, 2 or 3; R and R′ represent a C-Calkyl; R″ is a C-Calkylene radical; R′″ is method for producing the copolymer, by heating a statistical bipolymer A: poly(butadiene-isoprene), poly(butadiene-myrcene) or poly(butadiene-farnesene); and heating the formed product, in the presence of a chain transfer agent of formula (C) and adhesive composition of the copolymer and a crosslinking catalyst. 2. The copolymer P as claimed in claim 1 , characterized in that its main chain essentially consists of the repeating unit (I) of formula (I) claim 1 , of the repeating unit (II) of formula (II) and claim 1 , optionally claim 1 , of the repeating unit (III) of formula (III).3. The copolymer P as claimed in claim 1 , characterized in that the number p of units (I) and the number n of units (II) are such that:p/(n+p) is between 45% and 95%, andn/(n+p) is between 5% and 55%.7. The copolymer P as claimed in claim 1 , characterized in that the radical Rof the unit (II) represents a methyl radical.8. The copolymer P as claimed in claim 1 , characterized in that Fis (R′O)RSi—R″—NH—C(O)O—(CH)— and Fis —(CH)—OC(O)—NH—R″—SiR(OR′) claim 1 , with:{'sub': 2', '3, 'R″═—(CH)— and;'}g1=d1=1.10. The process as claimed in claim 9 , characterized in that step (i) leads to the formation of a macrocyclic cooligomer O comprising:{'sup': 0', '0, 'the unit of formula (I′) repeated p′times, p′being an integer other than 0;'}{'sup': 0', '0, 'the unit of formula (II′) repeated n′times, n′being an integer other than 0;'}{'sup': 0', '0, 'and, optionally, the unit of formula (III′) repeated m′times, m′being an integer greater than or equal to 0;'}{'sup': 0 ...

Low Molecular Weight Sterically Encumbered Oligomers

Low molecular weight, high Tg resins, with applications including tire additives and adhesives. An oligomer is obtained by ring opening metathesis polymerization (ROMP) of a sterically encumbered cyclic monomer with an olefinic chain transfer agent. The sterically encumbered cyclic monomer and the olefinic chain transfer agent are present in the polymerization at a molar ratio of from 2:1 to about 40:1. Also, methods for making the oligomer by ROMP.

SURFACE PROTECTIVE FILM, MAKING METHOD, AND SUBSTRATE PROCESSING LAMINATE

A surface protective film comprising a base film and a resin film thereon can be bonded to a substrate having a circuit-forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a silphenylene-siloxane skeleton-containing resin, (B) a compound capable of reacting with an epoxy group in the resin to form a crosslinked structure, (C) a curing catalyst, and (D) a parting agent. 2. The surface protective film of wherein in formula (1) claim 1 , a+c=0.5 and b+d=0.5.3. The surface protective film of wherein the resin film-forming composition further comprises at least one component of (E) a flame retardant claim 1 , (F) an antioxidant claim 1 , and (G) a filler.4. The surface protective film of wherein the base film is formed of polyester claim 1 , polyimide claim 1 , polyamide claim 1 , polyamide-imide claim 1 , polyetherimide claim 1 , triacetate cellulose claim 1 , polyethersulfone or polyphenylene sulfide.5. A substrate processing laminate comprising a substrate and the surface protective film of disposed on at least one surface of the substrate.7. The method of wherein in formula (1) claim 6 , a+c=0.5 and b+d=0.5.8. The method of wherein the surface protective resin composition further comprises at least one component of (E) a flame retardant claim 6 , (F) an antioxidant claim 6 , and (G) a filler.9. The method of wherein the base film is formed of polyester claim 6 , polyimide claim 6 , polyamide claim 6 , polyamide-imide claim 6 , polyetherimide claim 6 , triacetate cellulose claim 6 , polyethersulfone or polyphenylene sulfide.10. A method for protecting a substrate having a circuit-forming surface claim 1 , comprising the steps of attaching the surface protective film of to the circuit-forming surface of the substrate claim 1 , and heat curing the resin film to bond the surface protective film to the substrate. This non-provisional application claims priority under 35 U.S.C. §119(a) on Patent ...

TEMPORARY BONDING OF SUBSTRATES WITH LARGE ROUGHNESS USING MULTILAYERS OF POLYELECTROLYTES

Articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a multilayered modification (coating) layer, for example an alternating cationic/anionic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤400° C.) processing while also preventing formation of a permanent bond between the sheets during such processing. 2. The method of claim 1 , wherein the cationic polymer is water soluble.3. The method of claim 1 , wherein the cationic polymer comprises a polyalkyl backbone.4. The method of claim 1 , wherein the cationic polymer comprises a positively charged nitrogen.5. The method claim 4 , wherein the positively charged nitrogen is an ammonium cation.6. The method of claim 1 , wherein the anionic polymer is water soluble.7. A modification layer for temporarily bonding a thin sheet to a carrier claim 1 , the modification layer comprisingone or more cationic layers comprising one or more cationic polymers; and,one or more anionic layers comprising one or more anionic polymers, the one or more anionic layers overlaying at least one of the one or more cationic layers.8. The modification layer of claim 7 , wherein the cationic polymer is water soluble.9. The modification layer of claim 7 , wherein the cationic polymer comprises a polyalkyl backbone.10. The modification layer of claim 7 , wherein the cationic polymer comprises a positively charged nitrogen.11. The modification layer of claim 10 , wherein the positively charged nitrogen is an ammonium cation.12. The modification layer of claim 7 , wherein the anionic polymer is water soluble.13. The modification layer ...

CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL

A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure. 2. The curable composition according to claim 1 ,wherein the reactive compound (B) contains the compound (B1) having one or more functional groups selected from a hydroxyl group and a carboxyl group, andthe compound (B1) having one or more functional groups selected from a hydroxyl group and a carboxyl group further contains a (meth)acryloyl group.3. The curable composition according to claim 1 , wherein the epoxy compound (A) is an aliphatic epoxy compound.4. The curable composition according to claim 2 , wherein the epoxy compound (A) is an aliphatic epoxy compound.5. An adhesive which is formed from the curable composition according to .6. A method of producing a fiber-reinforced composite material claim 1 , comprising curing the curable composition according to claim 1 , which is impregnated into reinforced fibers claim 1 , by heating.7. A fiber-reinforced composite material comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a matrix formed of a cured material of the curable composition according to ; and'}reinforced fibers. This application claims priority to Japanese Patent Application No. 2014-045668, filed Mar. 7, 2014; and Japanese Patent Application No. 2014-189390, filed Sep. 17, 2014, the contents of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to a curable composition that contains a polymerizable compound (A) having predetermined kinds of polymerizable functional groups and a reactive compound (B) having predetermined kinds of reactive functional groups; an adhesive formed of ...

Under-Fill Material and Method for Producing Semiconductor Device

The present invention provides an under-fill material with which a semiconductor device having a high connection reliability can be provided while securing a usable material by reducing a difference in thermal-responsive behavior between a semiconductor element and an adherend, and a method for producing a semiconductor device using the under-fill material. In the under-fill material of the present invention, a storage elastic modulus E′ [MPa] and a thermal expansion coefficient α [ppm/K] after carrying out a heat-curing treatment at 175° C. for an hour satisfy the following formula (1) at 25° C.: 1. A sheet-like sealing composition comprising:a thermoplastic resin having a weight average molecular weight of 100000 or more;an epoxy resin;a curing accelerator; anda carboxyl group-containing compound having a pKa of 3.5 or more.2. The sealing resin composition according to claim 1 , wherein the carboxyl group-containing compound is at least one selected from the group consisting of:an aromatic carboxylic acid having in each molecule at least one substituent selected from the group consisting of an alkyl group, an alkoxy group, an aryloxy group, an aryl group and an alkylamino group, andan aliphatic carboxylic acid having in each molecule one or more carboxyl group and having a carbon number of 8 or more.3. The sealing resin composition according to claim 2 , wherein the aromatic carboxylic acid is a benzoic acid derivative in which at least one hydrogen atom at 2- claim 2 , 4- or 6-positions is independently substituted with an alkyl group claim 2 , an alkoxy group claim 2 , an aryloxy group claim 2 , an aryl group or an alkylamino group.4. The sealing resin composition according to claim 3 , wherein the benzoic acid derivative is a benzoic acid derivative in which a hydrogen atom at the 2- or 4-position is substituted with a methoxy group claim 3 , a phenoxy group claim 3 , a phenyl group or a dimethylamino group.5. The sealing resin composition according to claim 3 ...

Polyarylether ketone imide adhesives

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV):

Polyarylether ketone imide sulfone adhesives

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III):

Liquid hydrocarbon-based copolymers bearing two cyclocarbonate ester end groups

1) Hydrocarbon-based copolymer comprising two end groups preceded by an ester function and chosen from a 2-oxo-1,3-dioxolan-4-yl (or cyclocarbonate), a dithiocyclocarbonate, an exo-vinylene cyclocarbonate and a 2-oxo-1,3-dioxolen-4-yl, the main chain of which comprises units (I) and (II) in which R 0 is notably a methyl radical; and the number-average molecular mass Mn of which is between 400 and 100 000 g/mol. 2) Process for preparing said copolymer, comprising: (i) a step of heating a statistical bipolymer A chosen from a poly(butadiene-isoprene), a poly(butadiene-myrcene) and a poly(butadiene-farnesene); and then (ii) a step of heating the product formed, in the presence of a chain-transfer agent. 3) Use as adhesive, as a mixture with an amine compound comprising at least two amine groups.

UV-CROSSLINKABLE, RESIN-MODIFIED ADHESIVE

The aim is to reduce the flagging tendency of an adhesive bond using a UV-crosslinkable adhesive. This aim is accomplished by provision of a composition which comprises at least one UV-crosslinkable polyacrylate and at least one terpene-phenolic resin, the total concentration of the terpene-phenolic resins being 1 to 5 wt %, based on the total weight of the composition. The invention additionally relates to a pressure-sensitive adhesive produced on the basis of this composition, an adhesive tape based on said adhesive and the use of said tape for wrapping elongate material such as cable harnesses, for example. 1. Composition comprising at least one UV-crosslinkable polyacrylate and at least one terpene-phenolic resin , the total concentration of the terpene-phenolic resins being 1 to 5 wt % based on the total weight of the composition.2. Composition according to claim 1 , wherein the total concentration of the terpene-phenolic resins is 2 to 4 wt % claim 1 , based on the total weight of the composition.3. Composition according to claim 1 , wherein the total concentration of the terpene-phenolic resins is 2.5 to 3.5 wt % claim 1 , based on the total weight of the composition.4. Composition according to claim 1 , wherein the terpene-phenolic resin has a softening temperature (Ring & Ball softening point claim 1 , measured in accordance with ASTM E28-99) of at least 90° C.5. Pressure-sensitive adhesive obtainable by UV-crosslinking a composition according to .6. Pressure-sensitive adhesive according to claim 5 , wherein the UV crosslinking takes place at a UV dose of <100 mJ/cm.7. Adhesive tape obtained by applying a composition according to from the melt to a carrier and UV-crosslinking the composition.8. Adhesive tape according to claim 7 , wherein the composition is applied with a weight per unit area of 20 to 120 g/m.9. Adhesive tape according to claim 7 , wherein the UV crosslinking takes place at a UV dose of <100 mJ/cm.10. Adhesive tape according to claim 7 , ...

Toughened arylcyclobutene polymers

Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Resin material and resin film

A resin material including a hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in a weight ratio (hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer:hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer) of 100:0 to 1:99, the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer being obtained by melt-mixing a hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer, a radical initiator, and a polar group-containing compound that includes an ethylenically unsaturated bond, the resin material including a structural unit derived from the polar group-containing compound that includes an ethylenically unsaturated bond in a ratio of 0.05 to 3.0 parts by weight based on 100 parts by weight of the hydrogenated crystalline polar group-containing dicyclopentadiene ring-opening polymer and the hydrogenated crystalline non-polar dicyclopentadiene ring-opening polymer in total; and a resin film including the resin material; and a laminate film including the resin film.

METHODS OF FORMING STRUCTURES FOR DOWNHOLE APPLICATIONS

A method of forming a structure for a downhole application comprises forming an interfacial material comprising at least one of self-reinforced polyphenylene, polyphenylene sulfide, polysulfone, and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate. A downhole structure and a downhole assembly are also described. 1. A method of forming a structure for a downhole application , comprising forming an interfacial material comprising at least one of self-reinforced polyphenylene , polyphenylene sulfide , polysulfone , and polyphenylsulfone between opposing surfaces of a first substrate and a second substrate.2. The method of claim 1 , wherein the interfacial material comprises at least two of self-reinforced polyphenylene claim 1 , polyphenylene sulfide claim 1 , polysulfone claim 1 , and polyphenylsulfone.3. The method of claim 1 , wherein forming an interfacial material between opposing surfaces of a first substrate and a second substrate comprises:forming a precursor material by mixing at least one solvent and particles of the at least one of self-reinforced polyphenylene, polysulfone, and polyphenylsulfone;providing the precursor material between the opposing surfaces of the first substrate and the second substrate; andremoving the solvent from the precursor material after providing the precursor material between the opposing surfaces of the first substrate and the second substrate.4. The method of claim 3 , wherein forming a precursor material comprises selecting the at least one solvent to comprise at least one of water claim 3 , N-methylpyrrolidone claim 3 , dimethyl sulfoxide claim 3 , tetrahydrofuran claim 3 , diemethylformamide claim 3 , dimethylacetamide claim 3 , pyridine claim 3 , a N-substituted pyrrole claim 3 , a pyrrolidine claim 3 , a piperidine claim 3 , a morpholine claim 3 , chloroform claim 3 , 1-methoxy-2-propanol acetate claim 3 , a glycol claim 3 , a glycol ether claim 3 , and an alcohol.5. The method of ...

Photocurable composition and anthracene derivative used with the same

The invention provides a material having a structure including three or more anthracene structures per molecule as a photosensitive unit. That structure allows the material to remain in a liquid state at room temperature due to its reduced crystallinity. After coated on an application member in a liquid state, it is irradiated with light from outside so that it can be cured by way of photocrosslinking, and when heated, it returns back to the original state as the linkage is cleaved. By use of this material it is possible to form a reversibly detachable layer that serves as an adhesive layer at an interface to an application member and a coating layer at the surface of the application member.

POLYARYLETHER KETONE IMIDE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formula (IV): 2. The polymer of claim 1 , wherein the molecular weight of the polymer is between about 90 kDa and about 110 kDa.7. The composition of claim 6 , wherein the fiber material is selected from the group comprising graphite claim 6 , fiberglass claim 6 , nylon claim 6 , aramid polymers claim 6 , and mixtures thereof.8. The composition of claim 6 , wherein the polymer has a glass transition temperature between about 135° C. and about 190° C.9. The composition of claim 6 , wherein the polymer has a melting temperature between about 200° C. and about 450° C.10. The composition of claim 10 , wherein the molecular weight of the polymer is between about 90 kDa and about 110 kDa.17. The composition of claim 6 , wherein the polymer is a block copolymer.18. The composition of claim 6 , wherein the polymer is a random copolymer.19. A vehicle component including the composition of .20. The vehicle component of claim 20 , wherein the vehicle component is a tail cone claim 20 , a panel claim 20 , a coated lap joint between two or more panels claim 20 , a wing-to-fuselage assembly claim 20 , structural aircraft composite claim 20 , fuselage body-joint or wing rib-to-skin joint. This application is a continuation of U.S. patent application Ser. No. 15/068,249 filed Mar. 11, 2016, which is hereby incorporated by reference in its entirety.Aspects of the present disclosure generally relate to polyarylether ketones and methods of use.A vehicle, such as an aircraft, contains many components adhered to one another by adhesives and/or fasteners. Adhesives and fasteners must withstand chemical, thermal, and physical conditions experienced by the vehicle. Adhesives offer greater performance, better design efficiency, and lower weight as compared to fasteners used for connecting the vehicle/aircraft components to one another ...

NEW HYDROCARBON POLYMERS WITH EXO-VINYLENE CYCLOCARBONATE END GROUPS

1) Hydrocarbon polymer of formula (I): 2. Hydrocarbon polymer according to claim 1 , characterized in that:g or d are equal to 0;A represents a C1-C3 alkylene divalent radical;{'sup': 17', '17, 'X is an oxygen atom or a nitrogen group NRwhere Ris a C1-C3 alkyl group;'}{'sup': '14', 'Ris a hydrogen atom;'}{'sup': 15', '16, 'Rand R, identical or different, each represent a C1-C3 alkyl group;'}{'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'R, R, R, R, R, R, Rand Rrepresent a hydrogen atom or an alkyl radical comprising from 1 to 14 carbon atoms;'}the integers x and y are in a range from 0 to 2, the sum x+y ranging from 0 to 2;{'sup': 9', '10', '1', '12, 'R, R, Rand Rrepresent a hydrogen atom or a radical the hydrocarbon portion of which comprises from 1 to 14 carbon atoms;'}z is an integer equal to 1 or 2; and/orthe number-average molecular weight Mn ranges from 1000 to 50,000 g/mol, and the polydispersity index ranges from 1.4 to 2.0.3. Hydrocarbon polymer according to claim 1 , characterized in that: [{'sup': 2', '3', '4', '5', '6', '7', '8, 'when m is equal to 0 and the sum n1+n2 is non-zero, then at least one of the groups R, R, R, R, R, R, Rand Ris other than a hydrogen atom, and ratio: (n1+n2)/(p1+p2+n1+n2) ranges from 30 to 70%; or'}, {'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'when m is non-zero, the sum n1+n2 is non-zero and that each of the groups R, R, R, R, R, R, Rand Ris a hydrogen atom, then the ratio: m/(p1+p2+n1+n2+m) is in the range of 30 to 70%;'}, {'sup': 1', '2', '3', '4', '5', '6', '7', '8, 'when m is equal to non-zero and the sum n1+n2 is non-zero, then at least one of the groups R, R, R, R, R, R, Rand Ris other than a hydrogen atom, thus the ratio: (m+n1+n2)/(p1+p2+n1+n2+m) ranges from 30 to 70%.'}], 'when m is non-zero and n1 and n2 are each equal to 0, then the ratio: m/(p1+p2+m) ranges from 30 to 70%; or'}12. A hydrocarbon polymer adhesive comprising a polymer as defined in claim 1 , in a mixture with an amine compound comprising at least ...

POLYBENZOXAZINE THAT CAN BE USED FOR COATING METAL AND FOR THE BONDING OF SAME TO RUBBER

Polybenzoxazine comprises repeat units which comprise at least one unit corresponding to the formulae (I) or (II): 112.-. (canceled)1412. The polybenzoxazine according to claim , wherein Z , Z , or both Zand Z , which are identical or different , represent an aliphatic group comprising from 1 to 20 carbon atoms or a cycloaliphatic group comprising from 3 to 20 carbon atoms , and optionally at least one heteroatom chosen from O , S , N and P.15. The polybenzoxazine according to claim 14 , wherein Z claim 14 , Z claim 14 , or both Zand Z claim 14 , which are identical or different claim 14 , represent an alkylene group comprising from 1 to 20 carbon atoms claim 14 , and optionally at least one heteroatom chosen from O claim 14 , S claim 14 , N and P.16. The polybenzoxazine according to claim 13 , wherein Z claim 13 , Z claim 13 , or both Zand Z claim 13 , which are identical or different claim 13 , represent an aromatic group comprising from 6 to 30 carbon atoms claim 13 , and optionally at least one heteroatom chosen from O claim 13 , S claim 13 , N and P.17. The polybenzoxazine according to claim 13 , wherein Z claim 13 , Z claim 13 , or both Zand Z claim 13 , which are identical or different claim 13 , comprise a group selected from the group consisting of —(CH)— claim 13 , —CH-Ph-CH— claim 13 , —(CH—CH—X)— and —(CH(CH)—CH—X)— claim 13 , andwherein x and n are integers from 1 to 20, Ph represents a benzene ring, and X represents at least one heteroatom chosen from oxygen, sulfur, nitrogen and phosphorus.18. A coating for a substrate claim 13 , at least the surface of which is at least partially metallic claim 13 , comprising a polybenzoxazine according to .19. A method of bonding metal to rubber comprising:{'claim-ref': {'@idref': 'CLM-00013', 'claim 13'}, 'coating a substrate, at least the surface of which is at least partially metallic, with a substrate coating comprising a polybenzoxazine according to .'}20. A substrate claim 13 , at least the surface of which ...

HOT MELT ADHESIVE COMPOSITION

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melting point of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g. 1. A hot melt adhesive composition comprising:{'sup': '3', 'a first copolymer comprising an ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter (g/cm);'}a second copolymer comprising styrene block copolymer;tackifying agent;synthetic wax having a melting point of at least 70° C. and a heat of fusion of at least 200 Joules/gram (J/g); and ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % polar co-monomer,', 'propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, having a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and a polydispersity index of no greater than 10, and', 'propylene homopolymer having a heat of fusion of from at least 5 J/g to no greater than 60 J/g., 'at least 5% by weight of a third polymer selected from the group consisting of'}2. The hot melt adhesive composition of claim 1 , wherein the synthetic wax is a wax derived from ethylene claim 1 , a Fischer Tropsch wax claim 1 , or a combination thereof.3. The hot melt adhesive composition of claim 1 , wherein the composition exhibits a set time of no greater than 1 second. ...

POLYARYLETHER KETONE IMIDE SULFONE ADHESIVES

Aspects of the present disclosure generally describe polyarylether ketones and methods of use. In some aspects, a composition includes one or more polymers of formulae (I), (II), or (III): 2. The composition of claim 1 , wherein the fiber material is selected from the group comprising graphite claim 1 , fiberglass claim 1 , nylon claim 1 , aramid polymers claim 1 , and mixtures thereof.3. The composition of claim 1 , wherein the polymer has a glass transition temperature between about 135° C. and about 190° C.4. The composition of claim 1 , wherein the polymer has a melting temperature between about 200° C. and about 450° C.5. The composition of claim 1 , wherein the molecular weight of the polymer is between about 10 kDa and about 150 kDa.6. The composition of claim 5 , wherein the molecular weight of the polymer is between about 50 kDa and about 120 kDa.7. The composition of claim 6 , wherein the molecular weight of the polymer is between about 90 kDa and about 110 kDa.14. The composition of claim 1 , wherein the polymer is a block copolymer.15. The composition of claim 1 , wherein the polymer is a random copolymer.19. A vehicle component including the composition of .20. The vehicle component of claim 20 , wherein the vehicle component is a tail cone claim 20 , a panel claim 20 , a coated lap joint between two or more panels claim 20 , a wing-to-fuselage assembly claim 20 , structural aircraft composite claim 20 , fuselage body-joint or wing rib-to-skin joint. This application is a U.S. continuation patent application that claims priority to U.S. non-provisional patent application Ser. No. 15/247,275, filed Aug. 25, 2016, which claims the benefit of U.S. provisional patent application serial number 62/307,310, filed Mar. 11, 2016. The aforementioned related patent applications are herein incorporated by reference in their entirety.Aspects of the present disclosure generally relate to polyarylether ketones and methods of use.A vehicle, such as an aircraft, ...

COMPOSITION FOR BONDING WINDINGS OR CORE LAMINATES IN AN ELECTRICAL MACHINE, AND ASSOCIATED METHOD

A curable composition for bonding windings or core laminates in an electrical machine is presented. The curable composition includes: (A) about 10 weight percent to about 25 weight percent of a polyfunctional cyanate ester; (B) about 35 weight percent to about 65 weight percent of a first difunctional cyanate ester, or a prepolymer thereof; (C) about 15 weight percent to about 40 weight percent of a second difunctional cyanate ester, or a prepolymer thereof. An associated method is also presented. 2. The curable composition of claim 1 , wherein a cured composition of the curable composition shows thermal dimensional stability such that the cured composition has less than 60 percent mean density change after being heated at a temperature greater than about 280° C. for a time period greater than about 500 hours.3. The curable composition of claim 1 , wherein the polyfunctional cyanate ester comprises phenolic novolac cyanate ester claim 1 , dicylopentadiene novolac cyanate ester claim 1 , 1 claim 1 ,2 claim 1 ,3-tris(4-cyanatophenyl)-propane claim 1 , or combinations thereof.5. The curable composition of claim 1 , wherein the second difunctional cyanate ester comprises a prepolymer of a difunctional cyanate ester having a formula (V):{'br': None, 'sup': 4', '4', '4, 'NCO—Ar—R—Ar—OCN,\u2003\u2003(V)'}{'sup': 4', '4, 'sub': 5', '30', '3', '20, 'wherein Aris a C-Caromatic radical, and Ris C-Caliphatic radical.'}7. The curable composition of claim 1 , wherein the curable composition has a viscosity less than about 1000 centiPoise at 70° C.8. The curable composition of claim 1 , wherein the cured composition has a crack resistance of such that the average number of cracks having a dimension greater than 2 mm in length is equal to or less than one.9. The curable composition of claim 1 , wherein the composition is subtantially free of a solvent.10. The curable composition of claim 1 , wherein the composition further comprises a solvent.11. An impregnating resin comprising a ...

HYDROCARBON-CONTAINING POLYMERS WITH TWO ALKOXYSILANE END GROUPS

The invention relates to a hydrocarbon polymer containing two alcoxysilane end groups having the following Formula (I). The invention also relates to a method for preparing said polymer, to an adhesive composition containing said polymer, and to the use of said adhesive composition. 4. Hydrocarbon-containing polymer comprising two alkoxysilane end groups according to claim 1 , in which F1 is (R′O)RSi—(CH)— and F2 is —(CH)—SiR(OR′) claim 1 , with p1=1 or q1=1 claim 1 , preferably p1=q1=1.5. Hydrocarbon-containing polymer comprising two alkoxysilane end groups according to claim 4 , in which R′ is a methyl claim 4 , z=0 claim 4 , p1=1 and q1=1.6. Hydrocarbon-containing polymer comprising two alkoxysilane end groups according to claim 1 , in which F1 is (R′O)RSi—R″—OOC—(CH)— and Fis —(CH)—COO—R″—SiR(OR′) claim 1 , with p2=0 or q2=0 claim 1 , preferably p2=q2=0.7. Hydrocarbon-containing polymer comprising two alkoxysilane end groups according to claim 6 , in which R′ is a methyl claim 6 , R″ is the —(CH)— group claim 6 , z=0 claim 6 , p2=0 and q2=0.9. Preparation process according to claim 8 , said process being such that the molar ratio of the CTA to the sum of the compounds of formulae (A) and (B) is comprised in a range from 0.01 to 0.10 claim 8 , preferably from 0.05 to 0.10.11. Preparation process according to claim 8 , said process being such that the CTA is selected from the group formed by bis(propyltrimethoxysilyl)fumarate and trans-1 claim 8 ,4-bis(trimethoxysilyl)but-2-ene.12. Preparation process according to claim 8 , said process moreover comprising at least one additional step of hydrogenation of double bonds.13. Preparation process according to claim 12 , such that the additional hydrogenation step is implemented by catalytic hydrogenation claim 12 , under hydrogen pressure and in the presence of a hydrogenation catalyst such as a carbon-supported palladium catalyst (Pd/C).14. Adhesive composition comprising at least one polymer according to and from 0.01 ...

STACK, METHOD FOR TREATING SUBSTRATE MATERIAL, TEMPORARY FIXING COMPOSITION, AND SEMICONDUCTOR DEVICE

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond. 1. A stack comprising a substrate material fixed temporarily on a support via a temporary fixing material , a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and', 'a temporary fixing material layer (II) formed on the support-facing surface of the layer (I),, 'wherein the temporary fixing material comprises'}wherein the temporary fixing material layer (I) is formed of a temporary fixing composition comprising a polymer (A) and a release agent (B) which comprises a functional group capable of reacting with the polymer (A) to form a chemical bond.2. The stack according to claim 1 , wherein the release agent (B) is at least one selected from a silicone release agent (B1) claim 1 , a fluorinated release agent (B2) claim 1 , and an aliphatic release agent (B3).3. The stack according to claim 1 , wherein the release agent (B) comprises at least one of structure selected from a diaryl silicone structure claim 1 , a dialkyl silicone structure claim 1 , a fluoridated alkyl structure claim 1 , a fluoridated alkenyl structure claim 1 , and a Cor higher alkyl structure claim 1 , and comprises a functional group capable of reacting with the polymer (A) to form a chemical bond.4. The stack according to claim 1 , wherein the functional group which is contained in the release agent (B) and is capable of reacting with the ...

HYDROCARBONATED POLYMERS WITH TWO ALCOXYSILANE END GROUPS

The invention relates to 1) a hydrocarbonated polymer comprising two alcoxysilane end groups of formula (1), and 2) a method for producing said polymer, an adhesive composition comprising said polymer and the use of said adhesive composition. 115-. (canceled)17. The hydrocarbon polymer of claim 16 , wherein x=y=1.20. The hydrocarbon polymer of claim 16 , wherein Fis (R′O)RSi—R″—NH—COO—(CH)— and Fis —(CH)—OOC—NH—R″—SiR(OR′) claim 16 , with p1=1 or q1=1.21. The hydrocarbon polymer of claim 20 , wherein R′ is a methyl claim 20 , R″ is a —CH— or —(CH)— group claim 20 , z=0 claim 20 , p1=1 and q1=1.22. The hydrocarbon polymer of claim 16 , wherein Fis (R′O)RSi—R″—NH—CO—NH—(CH)— and Fis —(CH)—NH—CO—NH—R″—SiR(OR′) claim 16 , with p1=1 or q1=1.23. The hydrocarbon polymer of claim 22 , wherein R′ is a methyl claim 22 , R″ is a —CH— or —(CH)— group claim 22 , z=0 claim 22 , p1=1 and q1=1.24. The hydrocarbon polymer of claim 16 , wherein Fis (R′O)RSi—R″—NH—CO—(CH)— and Fis —(CH)—CONH—R″—SiR(OR′) claim 16 , with p2=0 or q2=0.25. The hydrocarbon polymer of claim 24 , wherein R′ is a methyl claim 24 , R″ is a —CH— or —(CH)— group claim 24 , z=0 claim 24 , p2=0 and q2=0.27. The process of claim 26 , wherein the molar ratio of the CTA to the compound of formula (A) claim 26 , or to the sum of the compounds of formulae (A) and (B) if the compound of formula (B) is present claim 26 , is within a range from 0.01 to 0.10.29. An adhesive composition comprising the polymer of and from 0.01 to 3% by weight of at least one crosslinking catalyst claim 16 , with respect to the weight of the adhesive composition.30. A process for adhesive bonding by assembling two substrates claim 16 , comprising:{'claim-ref': {'@idref': 'CLM-00029', 'claim 29'}, 'coating the adhesive composition of , in the liquid form, onto a surface of at least one of the two substrates; and'}bringing the two substrates into contact along their faying surfaces. A subject matter of the present invention is hydrocarbon ...

Metathesis-active adhesion agents and methods for enhancing polymer adhesion to surfaces

The invention discloses an adhesion agent composition comprising at least one C 3 -C 200 olefin compound having at least one metathesis active double bond, wherein the olefin is substituted or unsubstituted; and at least one compatibilizing functionality for interacting with a substrate surface. The substrate surface can be any surface, for example, silicate glasses, silicate minerals, metals, metal alloys, ceramics, natural stones, plastics, carbon, silicon, and semiconductors. The invention also discloses articles of manufacture utilizing these adhesion agents as well as methods for adhering a polyolefin to a substrate surface.

Wafer stack and manufacturing method thereof

含有氧杂环丁烷的树脂、使用该树脂的粘接剂以及抗蚀剂

本发明提供一种热固性树脂，所述树脂用于制造汽车部件、电制品、纤维用途的层叠体，特别是使用于多层布线板或扁平电缆，适合粘接时显示粘接所需的流动性但在热或光的作用下急剧固化的潜在热固化性粘接剂，并且焊锡耐热性优异，还提供一种树脂以及由该树脂形成的粘接剂和抗蚀剂，所述树脂即使不使用卤素也呈现优异的阻燃性，呈现在热或光的作用下急剧固化的潜在固化性。一种含有氧杂环丁烷的树脂、由该树脂得到的粘接剂以及抗蚀剂，所述树脂的特征在于，数均分子量为2000以上，并且，在主链具有选自酯键、尿烷键、酰胺键或醚键中的1种以上的结合基，在分子中具有100～10000当量/吨的氧杂环丁烷基以及300～5000当量/吨的羧基，0.1重量％以上的磷原子或者100～2000当量/吨的乙烯性不饱和双键。

MICHAEL-ADDITION-HARDENING SYNTHETIC RESIN FOR CHEMICAL FIXING TECHNOLOGY

Use of a synthetic resin system as an adhesive for chemical fixing technology, especially for fixing anchoring means in drilled holes, which synthetic resin system includes a) a reaction resin based on α, β-unsaturated compounds, b) a reaction resin based on compounds that include CH-acidic methylene groups, and c) a catalyst, and to related subject matter. 1. A method of using a synthetic resin system as an adhesive for chemical fixing technology , wherein the synthetic resin system includes a) a reaction resin based on α ,β-unsaturated compounds , b) a reaction resin based on compounds that include CH-acidic methylene groups , and c) a catalyst.2. The method according to claim 1 , wherein the reaction resin based on α claim 1 ,β-unsaturated compounds has an average functionality 2 and the reaction resin based on compounds that include CH-acidic methylene groups has an average functionality ≥4.3. The method according to wherein it has a crosslinking index ≥3.4. The method according to claim 1 , wherein the synthetic resin system is a multi-component system.5. The method according to claim 1 , wherein the synthetic resin system is in the form of a two-component kit.6. The method according to claim 1 , wherein it has a crosslinking index ≥3.5.7. The method according to in the form of a multi-component kit claim 1 , wherein (i) the reaction resin based on α claim 1 ,β-unsaturated compounds and the reaction resin based on compounds that include CH-acidic methylene groups are present in one component (K1) claim 1 , while the catalyst is present on its own or together with a non-reactive solvent/diluent/plasticiser and/or adhesion promoter in a different component (K2) (which component is not capable of mixing claim 1 , that is to say is kept separate claim 1 , in the stored state); or(ii) constituents a), b) and the epoxy moiety of an epoxy/tert-amine catalyst are present in one component, and constituent c) is present together with the tert-amine moiety of an epoxy/ ...

Functionalized resins obtained via olefin metathesis

This invention relates to a reaction product obtained by contacting a polymer comprising units derived from dicyclopentadiene with a vinyl terminated macromonomer, a vinyl monomer or a vinylene monomer, in the presence of a metathesis catalyst, where the vinyl monomer or vinylene monomer is represented by the formula (I): wherein each X is, independently, -C0 2 R, -CONR 1 R 2 , CN, a C 1 to a C 20 alkyl group; R is a C 1 to a C 20 alkyl group or an aromatic group; each R 1 and R 2 is, independently, a hydrogen, a C 1 to a C 20 alkyl group, or an aromatic group; each R 5 is, independently, a hydrogen atom or a C 1 to a C 40 alkyl group; each Ar is, independently, an aromatic group; and each n is, independently, from 0 to 40.

Functionalized resins obtained via olefin metathesis

This invention relates to a reaction product obtained by contacting a polymer comprising units derived from dicyclopentadiene with a vinyl terminated macromonomer, a vinyl monomer or a vinylene monomer, in the presence of a metathesis catalyst, where the vinyl monomer or vinylene monomer is represented by the formula: wherein each X is, independently, —CO 2 R, —CONR 1 R 2 , CN, a C 1 to a C 20 alkyl group; R is a C 1 to a C 20 alkyl group or an aromatic group; each R 1 and R 2 is, independently, a hydrogen, a C 1 to a C 20 alkyl group, or an aromatic group; each R 5 is, independently, a hydrogen atom or a C 1 to a C 40 alkyl group; each Ar is, independently, an aromatic group; and each n is, independently, from 0 to about 40.

Hot melt adhesive compositions

This invention relates to hot melt adhesive compositions which include a neutralized sulfonated elastomeric polymer, wherein the neutralized sulfonated elastomeric polymer has about 10 to about 100 meq. of neutralized sulfonate groups per 100 grams of the neutralized sulfonated elastomeric polymer, and about 25 to about 200 parts by weight of a hydrocarbon resin of a petroleum or coal tar distillate, aliphatic dienes and mono- and di-olefins, cyclic olefins of 5 to 6 carbon atoms and hydrogenated poly cyclics per 100 parts by weight of the neutralized sulfonated elastomeric polymer. The hot melt adhesive composition can further include an unsaturated hydrocarbon resin such as polyisoprene.

핫 멜트 접착제

본 발명의 목적은 탁월한 열 안정성을 가질 뿐만 아니라 환경 친화적이고 종이 기판 및 폴리올레핀 기판과 같은 각종 기판에 대한 탁월한 부착 특성을 갖는 핫 멜트 접착제를 제공하는 것이다. 본 발명은 하기를 포함하는 핫 멜트 접착제에 관한 것이다: (A) 극성 관능기-개질된 폴리머, (B) 지방족 폴리에스테르-기재 수지, (C) 올레핀-기재 폴리머, 및 (D) 점착부여제 수지.

交联性组合物和交联体

本发明提供一种交联性组合物，含有在聚合物链末端具有反应性基团且重均分子量(Mw)为1000～50000的液状的单环状烯烃开环聚合物(A)、以及分子内具有2个以上能够与所述单环状烯烃开环聚合物(A)的聚合物链末端的反应性基团反应的官能团的交联性化合物(B)。

Alkylated resins from polycyclic aromatic compounds

Adhesives comprising polyindane resins

The present invention is generally related to various types of compositions that comprise a polyindane resin. In particular, the polyindane resins may be utilized in various polymer-based and elastomer-based formulations in order to enhance several properties and characteristics of those formulations. More specifically, adhesive formulations are provided that comprise at least one polyindane resin, which may be used to replace or enhance the functionality of existing hydrocarbon resins typically used in adhesive formulations. Compositions comprising at least one thermoplastic elastomer and at least one polyindane resin are also provided.

Low surface energy adhesive

Adhesives suitable for use with low surface energy materials are described. The adhesive contain an acrylic copolymer, a high glass transition temperature tackifier and a low glass transition temperature tackifier. The acrylic copolymer is the reaction product of a first alkyl(meth)acrylate having at least 5 carbon atoms in the alkyl group, a second alkyl(meth)acrylate having 1 to 4 carbon atoms in the alkyl group, and a vinyl carboxylic acid. Both tackifiers have a Tg greater than the Tg of the acrylic copolymer. The high glass transition temperature tackifier has a Tg of at least 20° C. and the low glass transition temperature tackifier has a Tg of less than 0° C.

Adhesive comprising polyindan resin

본 발명은 일반적으로, 폴리인단 수지를 포함하는 다양한 유형의 조성물에 관한 것이다. 특히, 상기 폴리인단 수지는 이들 제제의 여러 특성 및 특징을 향상시키기 위해 다양한 중합체계 및 엘라스토머계 제제에 사용될 수 있다. 보다 구체적으로, 접착제 제제에 전형적으로 사용되는 기존의 탄화수소 수지의 기능을 대체하거나 향상시키기 위해 사용될 수 있는 하나 이상의 폴리인단 수지를 포함하는 접착제 제제가 제공된다. 하나 이상의 열가소성 엘라스토머 및 하나 이상의 폴리인단 수지를 포함하는 조성물이 또한 제공된다. The present invention relates generally to various types of compositions comprising polyindan resins. In particular, the polyindane resin can be used in a variety of polymer-based and elastomeric-based formulations to improve various properties and characteristics of these formulations. More specifically, adhesive formulations comprising one or more polyindane resins that can be used to replace or enhance the function of existing hydrocarbon resins typically used in adhesive formulations are provided. Also provided are compositions comprising at least one thermoplastic elastomer and at least one polyindan resin.

Hot melt adhesive composition

本发明涉及一种热熔融粘合剂组合物，该热熔融粘合剂组合物包含具有不大于0.90克每立方厘米密度的第一乙烯‑α‑烯烃共聚物；第二苯乙烯嵌段共聚物；增粘剂；具有至少70℃熔点和至少200焦耳/克熔化热的合成蜡；以及第三聚合物，该第三聚合物选自衍生自至少90摩尔％乙烯和不大于10摩尔％共聚单体的乙烯‑极性共聚单体共聚物、表现出至少5J/g至不大于60J/g的熔化热并具有不大于10的多分散指数的衍生自至少8摩尔％共聚单体的丙烯‑α‑烯烃共聚物、以及表现出至少5J/g至不大于60J/g熔化热的丙烯均聚物。

Crosslinkable resin composition and resin formed body produced therefrom

本发明提供一种与金属的密合性或耐热性优异的交联性树脂组合物。该交联性树脂组合物包括环烯烃树脂(A)和自由基发生剂(B)，所述环烯烃树脂(A)是在分子内具有2个或2个以上乙烯基的化合物的存在下，经过易位聚合环烯烃单体而得到的。通过加热该交联性树脂组合物使之交联从而得到交联性树脂成型体。

Hot melt adhesive composition

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melt temperature of at least 70° C. and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

Hot-melt adhesive composition for elastic attachments

The present invention relates to a hot-melt adhesive composition comprising a propylene homopolymer, an alpha-olefin copolymer, a carboxylic acid- and/or anhydride-functionalized olefin compound and a tackifying resin. The present invention also relates to a laminate comprising the hot-melt adhesive composition according to the invention that can be used in disposable hygiene articles.

Hot melt adhesive

Hot melt packaging adhesive compositions consisting essentially of 20 to 50% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 10; 30 to 60% of an aliphatic or cycloaliphatic hydrocarbon resin or hydrogenated derivative thereof or a hydrogenated aromatic hydrocarbon resin; and 10 to 30% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability. Further, the adhesive is characterized by a low density and consequently is readily filterable in recycling systems.

Polymers, methods of manufacture and uses thereof

Hot melt adhesive composition

A hot melt adhesive composition that includes a first ethylene alpha-olefin copolymer having a density of no greater than 0.90 grams per cubic centimeter, a second styrene block copolymer, tackifying agent, synthetic wax having a melting point of at least 70 °C and a heat of fusion of at least 200 Joules/gram, and a third polymer selected from the group consisting of ethylene-polar comonomer copolymer derived from at least 90 mole % ethylene and no greater than 10 mole % co-monomer, propylene-alpha-olefin copolymer derived from at least 8 mole % co-monomer, exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g, and having a polydispersity index of no greater than 10, and propylene homopolymer exhibiting a heat of fusion of from at least 5 J/g to no greater than 60 J/g.

Polymerizable composition, thermoplastic resin composition, crosslinked resin and crosslinked resin composite material

Low surface energy adhesive

本发明描述了适用于低表面能材料的粘合剂。所述粘合剂包含丙烯酸类共聚物、高玻璃化转变温度增粘剂以及低玻璃化转变温度增粘剂。所述丙烯酸类共聚物为其中烷基具有至少5个碳原子的第一(甲基)丙烯酸烷基酯、其中烷基具有1至4个碳原子的第二(甲基)丙烯酸烷基酯以及乙烯基羧酸的反应产物。两种增粘剂的玻璃化转变温度都大于所述丙烯酸类共聚物的玻璃化转变温度。所述高玻璃化转变温度增粘剂具有至少20℃的玻璃化转变温度，而所述低玻璃化转变温度增粘剂具有低于0℃的玻璃化转变温度。

Light emitting composition and device

A light-emitting composition comprises a polymer and a phosphorescent light-emitting material wherein the polymer comprises conjugating repeat units of formula (I) and up to 20 mol % of conjugation-blocking repeat units of repeat units of formula (II): wherein Ar 1 represents an aryl or heteroaryl group; R 1 , which may be the same or different in each occurrence, is a substituent; p is 0, 1, 2, 3 or 4; Ar 2 in each occurrence independently represents a substituted or unsubstituted aryl or heteroaryl group; and Sp 1 represents an acyclic spacer group that does not provide any conjugation path between the two groups Ar 2 . Preferably, Ar 1 is unsubstituted or substituted with one or more C 1-30 hydrocarbyl substituents.

Light emitting composition and device

A light-emitting composition comprises a polymer and a phosphorescent light-emitting material. The polymer comprises conjugating repeat units of formula (I) and up to 20 mol % of conjugation-blocking repeat units of repeat units of formula (II): Ar 1 represents an aryl or heteroaryl group; R 1 , which may be the same or different in each occurrence, is a substituent; p is 0 or an integer; Ar 2 in each occurrence independently represents a substituted or unsubstituted aryl or heteroaryl group; and Sp 1 represents an acyclic spacer group that does not provide any conjugation path between the two groups Ar 2 . Optionally, p is 0, 1, 2, 3 or 4 and each R 1 is a non-polar substituent. Each R 1 is advantageously selected from C 1-30 hydrocarbyl substituents. A light-emitting device comprises an anode, a cathode and a light-emitting layer between the anode and the cathode, the light-emitting layer comprising a light-emitting composition as described.

Polymer, polymer composition and organic light-emitting device

A composition comprising a polymer and at least one phosphorescent light-emitting dopant wherein: the polymer comprises a polymer backbone and charge transporting groups pendant from the polymer backbone; the polymer backbone is partially conjugated; and the polymer has a triplet energy level of at least 2.4 eV.

Hot melt adhesive

본 발명의 목적은 탁월한 열 안정성을 가질 뿐만 아니라 환경 친화적이고 종이 기판 및 폴리올레핀 기판과 같은 각종 기판에 대한 탁월한 부착 특성을 갖는 핫 멜트 접착제를 제공하는 것이다. 본 발명은 하기를 포함하는 핫 멜트 접착제에 관한 것이다: (A) 극성 관능기-개질된 폴리머, (B) 지방족 폴리에스테르-기재 수지, (C) 올레핀-기재 폴리머, 및 (D) 점착부여제 수지. It is an object of the present invention to provide a hot melt adhesive having excellent thermal stability as well as environmentally friendly and excellent adhesion properties to various substrates such as paper substrates and polyolefin substrates. The present invention relates to a hot melt adhesive comprising: (A) a polar functional group-modified polymer, (B) an aliphatic polyester-based resin, (C) an olefin-based polymer, and (D) a tackifier resin. .

Biomass based Michael addition compositions

提供官能混合物和聚合物组合物，它们各自包括至少一种多官能迈克尔受体、至少一种多官能迈克尔供体和至少一种催化剂，其中供体或受体或供体和受体的组合中至少25％来自生物基材料。

FILM TAPE, WINDOW FRAME WITH THIS TAPE AND APPLICATION OF THIS TAPE

РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2017 111 573 A (51) МПК C09J 7/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2017111573, 09.09.2015 (71) Заявитель(и): ХЕНКЕЛЬ АГ УНД КО. КГАА (DE) Приоритет(ы): (30) Конвенционный приоритет: 09.09.2014 EP 14184148.6 29 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 10.04.2017 EP 2015/070643 (09.09.2015) (87) Публикация заявки PCT: R U Адрес для переписки: 129090, Москва, ул. Б. Спасская, 25, стр. 3, ООО "Юридическая фирма Городисский и Партнеры" (54) ПЛЕНОЧНАЯ ЛЕНТА, ОКОННАЯ РАМА С ДАННОЙ ЛЕНТОЙ И ПРИМЕНЕНИЕ ДАННОЙ ЛЕНТЫ (57) Формула изобретения 1. Многослойная пленочная лента для строительной области, которая предпочтительно является от диффузионно-открытой до диффузионно-закрытой, состоящая из полимерного материала, в частности, предпочтительно, термопластичного полимера в качестве среднего слоя и позволяющего наносить штукатурку внешнего слоя, который выбирают из нетканого материала, ткани, технического трикотажа, вязаного полотна, стекловолокна, усиленной бумаги, пленки или их комбинаций и самоприклеивающегося слоя, который нанесен на не лежащую на среднем слое поверхность внешнего слоя, отличающаяся тем, что самоприклеивающийся слой представляет собой контактный термоклей, который содержит: a) по меньшей мере один стирол-изопрен-стирольный (SIS) блок-сополимер; b) по меньшей мере один стирол-бутадиеновый каучук (SBR); и c) по меньшей мере одну придающую клейкость смолу. 2. Пленочная лента по п. 1, отличающаяся тем, что контактный термоклей кроме того содержит d) по меньшей мере один пластификатор; и Стр.: 1 A 2 0 1 7 1 1 1 5 7 3 A WO 2016/038106 (17.03.2016) 2 0 1 7 1 1 1 5 7 3 (86) Заявка PCT: R U (43) Дата публикации заявки: 11.10.2018 Бюл. № (72) Автор(ы): НИЛЬГЕС Хайнц-Йозеф (DE), РУППИЧ Кристиан (AT) A 2 0 1 7 1 1 1 5 7 3 A R U 2 0 1 7 1 1 1 5 7 3 Стр.: 2 R U e) при необходимости по меньшей мере одну добавку. 3. Пленочная лента по п. 1 ...

Low-surface energy adhesive

FIELD: chemistry. SUBSTANCE: invention relates to an adhesive which is suitable for use with low-surface energy materials. The adhesive contains an acrylic copolymer, an adhesive reagent with a high glass transition point (Tg) and an adhesive reagent with a low glass transition point. The acrylic copolymer is a ternary copolymer of 2-ethylhexyl acrylate, butyl acrylate and acrylic acid. The adhesive reagents with a high glass transition point and a low glass transition point are terpenes, terpene-phenol-formaldehyde resins, rosin ester and modified C 5 -C 9 aliphatic and aromatic hydrocarbons. Both adhesive reagents have Tg greater than Tg of the acrylic copolymer. EFFECT: adhesive reagent with a high glass transition point has Tg of at least 20°C and the adhesive reagent with a low glass transition point has Tg of less than 0°C. 14 cl, 1 dwg, 10 tbl РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 525 904 C2 (51) МПК C09J 133/00 (2006.01) C09J 133/02 (2006.01) C09J 133/08 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2010154626/05, 10.06.2009 (24) Дата начала отсчета срока действия патента: 10.06.2009 Приоритет(ы): (30) Конвенционный приоритет: (43) Дата публикации заявки: 10.08.2012 Бюл. № 22 (45) Опубликовано: 20.08.2014 Бюл. № 23 (73) Патентообладатель(и): ЗМ Инновейтив Пропертиз Компани (ЗМ Innovative Properties Company) (US) 2008070386 A 12.06.2008; . US 2003008140 A1 09.01.2003 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 02.02.2011 (86) Заявка PCT: 2 5 2 5 9 0 4 (56) Список документов, цитированных в отчете о поиске: RU 2208030 C2 10.07.2003; . WO R U 02.07.2008 US 61/077,745 (72) Автор(ы): МА Джингджинг (US), ЧЕН Жонг (US), ЛЕХМАНН Меган П. (US), ТУМЕЙ Майкл Л. (US), ЖУ Донг-Вей (US) 2 5 2 5 9 0 4 R U (87) Публикация заявки PCT: WO 2010/002557 (07.01.2010) Адрес для переписки: 125009, Москва, Романов переулок, 4, строение 2, Сквайр Сандерс Москва ЛЛС, Безруковой О.М. (54) КЛЕЙ С ...

Biomass based Michael addition compositions

각각 적어도 하나의 다작용성 마이클 수용체(Michael acceptor), 적어도 하나의 다작용성 마이클 도너(Michael donor) 및 적어도 하나의 촉매를 포함하고, 마이클 도너 또는 수용체 또는 이들의 배합물의 적어도 25%가 바이오-기초 물질로부터 유도되는 기능성 혼합물 및 폴리머 조성물이 제공된다. Each comprising at least one multifunctional Michael acceptor, at least one multifunctional Michael donor and at least one catalyst, wherein at least 25% of the Michael donor or acceptor or combination thereof is a bio-based material Functional mixtures and polymer compositions derived from are provided.

Biomass based Michael addition compositions

提供官能混合物和聚合物组合物，它们各自包括至少一种多官能迈克尔受体、至少一种多官能迈克尔供体和至少一种催化剂，其中供体或受体或供体和受体的组合中至少25％来自生物基材料。

UV-crosslinkable, resin modified adhesive mass

Die Abflaggtendenz einer mit einer UV-vernetzbaren Klebemasse bewirkten Verklebung soll verringert werden. Dies gelingt durch Zurverfügungstellung einer Zusammensetzung, die mindestens ein UV-vernetzbares Polyacrylat und mindestens ein Terpenphenolharz enthält, wobei die Gesamtkonzentration der Terpenphenolharze, bezogen auf das Gesamtgewicht der Zusammensetzung, 1 bis 5 Gew.-% beträgt. Die Erfindung betrifft darüber hinaus eine auf Basis dieser Zusammensetzung hergestellte Haftklebemasse, ein darauf basierendes Klebeband und dessen Verwendung zum Ummanteln von langgestrecktem Gut wie beispielsweise Kabelsätzen. The tendency for a UV-crosslinkable adhesive to cause sticking tendency should be reduced. This is achieved by providing a composition containing at least one UV-crosslinkable polyacrylate and at least one terpene-phenolic resin, the total concentration of terpene-phenolic resins, based on the total weight of the composition, being from 1 to 5% by weight. The invention further relates to a pressure-sensitive adhesive prepared on the basis of this composition, an adhesive tape based thereon and its use for covering elongated material, such as, for example, cable harnesses.

UV-crosslinkable, resin-modified adhesive

Die Abflaggtendenz einer mit einer UV-vernetzbaren Klebemasse bewirkten Verklebung soll verringert werden. Dies gelingt durch Zurverfügungstellung einer Zusammensetzung, die mindestens ein UV-vernetzbares Polyacrylat und mindestens ein Terpenphenolharz enthält, wobei die Gesamtkonzentration der Terpenphenolharze, bezogen auf das Gesamtgewicht der Zusammensetzung, 1 bis 5 Gew.-% beträgt. Die Erfindung betrifft darüber hinaus eine auf Basis dieser Zusammensetzung hergestellte Haftklebemasse, ein darauf basierendes Klebeband und dessen Verwendung zum Ummanteln von langgestrecktem Gut wie beispielsweise Kabelsätzen. The tendency to flag off a bond caused by a UV-crosslinkable adhesive should be reduced. This is achieved by providing a composition which contains at least one UV-crosslinkable polyacrylate and at least one terpene-phenolic resin, the total concentration of the terpene-phenolic resins, based on the total weight of the composition, being 1 to 5% by weight. The invention further relates to a pressure-sensitive adhesive produced on the basis of this composition, an adhesive tape based thereon, and the use thereof for sheathing elongated goods, such as cable sets.

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

본 발명은 세퍼레이터; 및 각각 다이싱 테이프 및 상기 다이싱 테이프 상에 적층된 접착제 층을 포함하고 상기 접착제 층이 상기 세퍼레이터에 접착하는 방식으로 상기 세퍼레이터 상에 소정의 간격으로 적층되는 복수의 접착제 층-부착된 다이싱 테이프를 포함하는 반도체 장치 제조용 필름으로서, 상기 세퍼레이터는 상기 다이싱 테이프의 바깥 둘레를 따라 형성된 절입부를 갖고 상기 절입부의 깊이는 상기 세퍼레이터 두께의 2/3 이하인 반도체 장치 제조용 필름에 관한 것이다. The present invention provides a separator comprising: a separator; And a plurality of adhesive layers each of which is laminated on the separator at a predetermined interval in such a manner that the adhesive layer is adhered to the separator, the adhesive layer comprising a dicing tape and an adhesive layer laminated on the dicing tape, Wherein the separator has a cut-in portion formed along an outer periphery of the dicing tape, and the depth of the cut-in portion is 2/3 or less of the thickness of the separator.

Biomass-based Michael addition composite

提供官能混合物和聚合物组合物，它们各自包括至少一种多官能迈克尔受体、至少一种多官能迈克尔供体和至少一种催化剂，其中供体或受体或供体和受体的组合中至少25%来自生物基材料。

Curable composition for an electrical machine, and associated method

전기 기계에서 권선 또는 코어 라미네이트를 본딩시키기 위한 경화성 조성물이 제공된다. 경화성 조성물은 (A) 약 10 중량% 내지 약 25 중량%의 다작용성 시아네이트 에스테르; (B) 약 35 중량% 내지 약 65 중량%의 제1의 이작용성 시아네이트 에스테르, 또는 이의 프리폴리머; (C) 약 15 중량% 내지 약 40 중량%의 제2의 이작용성 시아네이트 에스테르, 또는 이의 프리폴리머를 포함한다. 전기 기계에서 부품들을 봉지하기 위한 경화성 조성물이 또한 제공된다. 관련 방법들이 또한 제공된다.

Polymerizable composition, cycloolefin-based polymer, cycloolefin-based resin molded body, and laminate

본 발명은 하기 식 (Ⅰ) 로 나타내는 시클로올레핀계 모노머, 및 중합 촉매를 함유하는 중합성 조성물, 이 중합성 조성물을 중합시킴으로써 얻어지는 시클로올레핀계 중합체, 상기 중합성 조성물을 괴상 중합시킴으로써 얻어지는 시클로올레핀계 수지 성형체, 및, 금속박과, 그 금속박에 인접하고 상기 중합성 조성물을 괴상 중합시킴으로써 형성된 시클로올레핀계 수지층을 갖는 적층체이다. [R 1 은 탄소수 1 ∼ 10 의 탄화수소기, 할로겐 원자 등을 나타낸다. m 은 0 이상, 6n ＋ 6 이하의 정수이다. n 은 1 ∼ 3 의 정수를 나타낸다.] 본 발명에 의하면, 금속과의 밀착성이 우수한 시클로올레핀계 수지 성형체의 제조 원료로서 유용한 중합성 조성물, 이 중합성 조성물로부터 얻어지는, 시클로올레핀계 중합체, 시클로올레핀계 수지 성형체, 및, 금속박과 그 금속박에 인접하는 시클로올레핀계 수지층을 갖는 적층체가 제공된다.

Alkylated Resin Prepared from Polycyclic Aromatic Compounds

본 발명은 알킬화 수지는 ⒜ 비치환 또는 치환된 다중환상 방향족 화합물 1종 이상과 ⒝산 촉매의 존재하에 알킬화에 의해 다중환상 방향족 화합물과 반응하는 탄소-탄소 이중결합 2개 이상을 갖는 에틸렌형 불포화 탄화수소 단량체 1종 이상의 알킬화 반응 생성물을 포함한다. 이때, 수징중 ⒜대 ⒝의 중량비는 1:9 내지 3:1이다. 수지는 크기 배제 크로마토그래피에 의해 측정된 10,000 미만의 중량평균 분자량 50°내지 250℃의 링 앤드 볼(Ring & Ball)연화점을 갖는다. 높은 연화점 및 낮은 분자량으로 인해 수지는 엔지니어링 중합체용 유량개질제, 접착제용 점착제 및 잉크용 플러싱제 같은 다양한 용도에서 유용하다.

NOVEL HYDROCARBON POLYMERS WITH TWO ALCOXYSILANE TERMINAL GROUPS

1) Polymère hydrocarboné comprenant deux groupements terminaux alcoxysilanes de formule (I) : dans laquelle : - F1 est (R'O)3-tRtSi-R"-NH-COO-(CH2)g1- et F2 est -(CH2)d1-OCO-NH-R"-SiRt(OR')3-t ; ou bien - F1 est (R'O)3-tRtSi-R"-NH-CO-NH-(CH2)g1- et F2 est -(CH2)d1-NH-CO-NH-R"-SiRt(OR')3-t ; ou bien - F1 est (R'O)3-tRtSi-R"-NH-CO-(CH2)g2- et F2 est -(CH2)d2-CO-NH-R"-SiRt(OR')3-t ; où t est un nombre entier égal à 0, 1 ou 2 ; g1 et d1 sont un nombre entier égal à 1, 2 ou 3 ; g2 et d2 sont un nombre entier égal à 0, 1, 2 ou 3 ; R et R' représentent un radical alkyle linéaire ; R" représente un radical alkylène linéaire ; - R1 à R12 représentent un atome d'hydrogène ou un radical alkyle comprenant de 1 à 14 atomes de carbone ; - x et y sont des entiers tels que la somme x + y est comprise dans une fourchette allant de de 0 à 2 ; - n1 et n2 sont un nombre entier ou nul et m est un nombre entier supérieur ou égal à 0; - p1 et p2 sont un nombre entier ou nul dont la somme p1 + p2 est non nulle et vérifie l'équation: p1 + p2 = q x (z + 1) dans laquelle q est un nombre entier supérieur à 0 et z est un nombre entier égal à 1 ou 2. 2) Procédé de préparation de ce polymère par polymérisation par ouverture de cycle par métathèse 3) Composition adhésive comprenant ledit polymère et de 0,01 à 3% en poids d'un catalyseur de réticulation. 1) hydrocarbon polymer comprising two alkoxysilane end groups of formula (I): in which: F1 is (R'O) 3-tRtSi-R "-NH-COO- (CH2) g1- and F2 is - (CH2) d1 -OCO-NH-R "-SiRt (OR ') 3-t; or F1 is (R'O) 3-tRtSi-R "-NH-CO-NH- (CH2) g1- and F2 is - (CH2) d1-NH-CO-NH-R" -SiRt (OR ') ) 3-t; or F1 is (R'O) 3-tRtSi-R "-NH-CO- (CH2) g2- and F2 is - (CH2) d2-CO-NH-R" -SiRt (OR ') 3-t ; where t is an integer equal to 0, 1 or 2; g1 and d1 are an integer of 1, 2 or 3; g2 and d2 are an integer of 0, 1, 2 or 3; R and R 'represent a linear alkyl ...

HYDROCARBON POLYMERS WITH TWO ALCOXYSILANE TERMINAL GROUPS

ALTERNATE BLOCK HYDROCARBON COPOLYMERS AND ALCOXYSILANE TERMINAL GROUPS

1)Copolymère à blocs alternés de formule (I): dans laquelle : - F1 et F2 sont 2 groupements de type alcoxysilane ; - R1 à R12 représentent un atome d'hydrogène ou un radical alkyle comprenant de 1 à 22 atomes de carbone ; - A représente O ou le groupe NR14 où R14 est un atome d'hydrogène ou un radical alkyle comprenant de 1 à 20 atomes de carbone ; - X représente un radical divalent comprenant un radical polymérique divalent T qui est relié directement ou indirectement à A, ledit radical T comprenant lui-même au moins un radical polyéther ; - x et y sont des entiers allant de 0 à 6, la somme x + y étant comprise dans une fourchette allant de 0 à 6 ; n1 et n2 sont un nombre entier ou nul ; m est un entier supérieur ou égal à 0 ; p1 et p2 sont un nombre entier ou nul dont la somme p1 + p2 est non nulle 2) Procédé de préparation dudit copolymère à partir de cyclooctadiène, d'un polymère (B) à groupes terminaux diacrylate, et d'un agent de transfert de chaîne (G) comprenant 2 groupements alcoxysilane. 3) Composition adhésive comprenant ledit copolymère et de 0,01 à 3% en poids d'un catalyseur de réticulation.

HYDROCARBON POLYMERS WITH TWO ALCOXYSILANE TERMINAL GROUPS

HYDROCARBON POLYMERS WITH 2-OXO-1,3-DIOXOLAN-4-YL TERMINATION

Adhesive articles, adhesive compositions, and methods comprising polymer and polymerizable cyclic olefin

本发明描述了粘合剂组合物和制品，所述制品包括载体基底(例如，剥离衬垫或背衬)和设置在所述载体基底上的粘合剂组合物。所述粘合剂组合物包含至少20重量％的聚合物；未聚合的环状烯烃；和(例如潜伏性)开环易位聚合催化剂或其预催化剂。所述聚合物可具有小于25℃的Tg并且/或者可为丙烯酸类聚合物。还描述了一种粘结方法。

HYDROCARBON POLYMERS WITH TWO ALCOXYSILANE TERMINAL GROUPS

1) Polymère hydrocarboné comprenant deux groupements terminaux alcoxysilanes de formule (1) : dans laquelle F1 est (R'O)3-zRzSi-R''-NH-COO-(CH2)p1- et F2 est -(CH2)q1-OOC-NH-R''-SiRz(OR')3-z ; ou bien F1 est (R'O)3-zRzSi-R''-NH-CO-NH-(CH2)p1- et F2 est -(CH2)q1-NH-CO-NH-R''-SiRz(OR')3-z ; ou bien F1 est (R'O)3- zRzSi-R''-NH-CO-(CH2)p2- et F2 est -(CH2)q2-CO-NH-R''-SiRz(OR')3-z ; où z est 0, 1, 2 ou 3 ; p1 et q1 sont indépendamment 1, 2 ou 3 ; p2 et q2 sont indépendamment 0, 1, 2 ou 3 ; R, R' et R'' sont indépendamment un alkyle C1-C4 ; et: • chaque liaison est double ou simple ; • R1, R2, R3, R4, R5, R6, R7 et R8 sont un hydrogène, un atome d'halogène, un alkyle, un hétéroalkyle ou un alcoxycarbonyle ; • x et y sont des entiers de 0 à 5 ; • R14, R15, R16 et R17 sont un hydrogène, un atome d'halogène, un alkyle, un hétéroalkyle, un alcoxycarbonyle ; • R20 est CH2, O, S, et • n est supérieur ou égal à 2 et m est supérieur ou égal à 0, n et m étant tels que Mn est compris de 400 à 50 000 g/mol. 2) Procédé de préparation dudit polymère, composition adhésive le comprenant ce polymère et utilisation de cette composition adhésive. 1) hydrocarbon polymer comprising two alkoxysilane end groups of formula (1): in which F1 is (R'O) 3 -ZRzSi-R '' - NH-COO- (CH2) p1- and F2 is - (CH2) q1- OOC-NH-R '' - SiRz (OR ') 3-z; or F1 is (R'O) 3 -ZRzSi-R '' - NH-CO-NH- (CH2) p1- and F2 is - (CH2) q1-NH-CO-NH-R '' - SiRz (OR ') 3-z; or F1 is (R'O) 3- zRzSi-R '' - NH-CO- (CH2) p2- and F2 is - (CH2) q2-CO-NH-R '' - SiRz (OR ') 3- z; where z is 0, 1, 2 or 3; p1 and q1 are independently 1, 2 or 3; p2 and q2 are independently 0, 1, 2 or 3; R, R 'and R' 'are independently C1-C4 alkyl; and: • each link is double or single; R1, R2, R3, R4, R5, R6, R7 and R8 are hydrogen, a halogen atom, an alkyl, a heteroalkyl or an ...

HYDROCARBON POLYMERS WITH TWO ALCOXYSILANE TERMINAL GROUPS AND PROCESSES FOR PREPARING THE SAME

1) Polymère hydrocarboné comprenant deux groupements terminaux alcoxysilanes de formule (I) : dans laquelle : - F1 est : (R'O)3-tRtSi-(CH2)g1- et F2 est : -(CH2)d1-SiRt(OR')3-t ; ou bien F1 est : (R'O)3-tRtSi-R''-OOC-(CH2)g2- et F2 est : -(CH2)d2-COO-R''-SiRt(OR')3-t ; où t est un nombre entier égal à 0, 1 ou 2 ; g1 et d1 sont un nombre entier égal à 1, 2 ou 3 ; g2 et d2 sont un nombre entier égal à 0, 1, 2 ou 3 ; R et R' représentent un radical alkyle linéaire ; R" représente un radical alkylène linéaire ; - R1 à R12 représentent un atome d'hydrogène ou un radical alkyle comprenant de 1 à 14 atomes de carbone ; - x et y sont des entiers tels que la somme x + y est comprise dans une fourchette allant de de 0 à 2 ; n1 et n2 sont un nombre entier ou nul et m est un nombre entier supérieur ou égal à 0 ; p1 et p2 sont un nombre entier ou nul dont la somme p1 + p2 est non nulle et vérifie l'équation : p1 + p2 = q x (z + 1) dans laquelle q est un nombre entier supérieur à 0 et z est un nombre entier égal à 1 ou 2. 2) Procédé de préparation de ce polymère à partir de cyclooctadiène ou cyclododecatriène 3) Procédé de préparation de ce polymère à partir d'un polybutadiène à haute teneur en motif cis-1,4 4) Composition adhésive comprenant ledit polymère et de 0,01 à 3% en poids d'un catalyseur de réticulation. 1) hydrocarbon polymer comprising two alkoxysilane end groups of formula (I): in which: F1 is: (R'O) 3-tRtSi- (CH2) g1- and F2 is: - (CH2) d1-SiRt (OR ' ) 3-t; or F1 is: (R'O) 3-tRtSi-R '' - OOC- (CH2) g2- and F2 is: - (CH2) d2-COO-R '' - SiRt (OR ') 3-t; where t is an integer equal to 0, 1 or 2; g1 and d1 are an integer of 1, 2 or 3; g2 and d2 are an integer of 0, 1, 2 or 3; R and R 'represent a linear alkyl radical; R "represents a linear alkylene radical; - R1 to R12 represent a hydrogen atom or an alkyl radical comprising from 1 to 14 carbon atoms; - x and y are integers ...

Melt adhesives - contg chlorinated polyphenyls, vinyl polymers or polyolefins and rosin

The adhesives consist of (a) 45-70 wt.% chlorinated polyphenyl, (B) 18-30 wt.% thermoplasts based on vinyl polymers or copolymers, polyolefins, and (C) 2-10 wt.% rosin. They pref. also contain 1-15 wt.% inorg. filler e.g. kaolin. The melt adhesives are suitable for sticking wood, paper, textiles, leather, rubber or plastics, esp. in furniture mfr. They have increased strength esp. at higher temps. and can be heated at 100 degrees C for short periods without damage. They can be exposed to temps. of over 200 degrees C in the containers of continuous bonding machines.

Acetylation of wood parts

FIELD: process engineering. SUBSTANCE: invention can be used in construction. Claimed process comprises the steps that follow. a) Wood part is processed with acetic anhydride at 30-190°C and pressure from barometric to 15 bar exc. for up to 80 minutes. b) It is heated in inert gas to be mixed with acetic anhydride or with the mix thereof with acetic acid at 130-145°C or 150-190°C and 1-5 bar exc. for 5-300 minutes. Produced elements of acetylated wood mixed with synthetic resin as a binder make a wood composite. EFFECT: wood-based composites of longer life, higher mechanical strength, smooth surface after wetting or application of primer. 15 cl, 10 tbl, 1 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 569 536 C2 (51) МПК C08L 97/02 (2006.01) B27K 3/34 (2006.01) C08H 8/00 (2010.01) C08G 18/64 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2012137514/05, 04.02.2011 (24) Дата начала отсчета срока действия патента: 04.02.2011 (72) Автор(ы): МАС Михел (NL), ПОЛ Бено (NL) (73) Патентообладатель(и): ТАЙТЕН ВУД ЛИМИТЕД (GB) Приоритет(ы): (30) Конвенционный приоритет: R U 04.02.2010 GB 1001750.7; 30.12.2010 GB 1022090.3 (43) Дата публикации заявки: 10.03.2014 Бюл. № 7 (56) Список документов, цитированных в отчете о поиске: US 6632326 B1, 14.10.2003. GB 2456915 A, 05.08.2009. WO 9523168 A1, 31.08.1995. ПОД РЕД. КНУНЯНЦ, Химическая энциклопедия, Москва, Советская энциклопедия, 1990, том 2, с.877. (86) Заявка PCT: C 2 C 2 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 04.09.2012 GB 2011/050202 (04.02.2011) (87) Публикация заявки PCT: 2 5 6 9 5 3 6 WO 2011/095824 (11.08.2011) R U 2 5 6 9 5 3 6 (45) Опубликовано: 27.11.2015 Бюл. № 33 Адрес для переписки: 109012, Москва, ул. Ильинка, 5/2, ООО "Союзпатент" (54) СПОСОБ АЦЕТИЛИРОВАНИЯ ДЕРЕВЯННЫХ ДЕТАЛЕЙ (57) Реферат: Изобретения могут быть использованы в Полученные элементы из ацетилированной области строительства. Способ ацетилирования древесины в ...