Adhesive sheet for processing of semiconductor wafter

An adhesive sheet for processing of a semiconductor wafer has an adhesive layer disposed on at least one surface of a base substrate, the adhesive layer includes a base polymer, a plasticizer and a surfactant, an SP value of the plasticizer and the surfactant satisfies the relationship: 0.9≦(the plasticizer SP value)/(the surfactant SP value)≦1.0. The present invention has the object of providing an adhesive sheet for processing of a semiconductor wafer that exhibits superior storage stability under a range of environments, and that prevents contamination of the adherend after use.

Dual cure adhesive formulations

An adhesive composition comprising as principal components, a polymerizable component, an ambient temperature radical polymerization catalyst system and a photoinitiator. The adhesive may optionally comprise an adhesion promoter, a toughener, an epoxy, and a filler material. Further, a two-part reactive adhesive comprising, a first part comprising, (i) at least one free radical-polymerizable monomer, (ii) at least one reducing agent, and (iii) a photoinitiator, and a second part comprising an oxidizing agent that is reactive at ambient temperature with the reducing agent to produce free radicals that are capable of initiating and propagating free radical polymerization.

Fiber, fiber aggregate and adhesive having the same

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Fiber, fiber aggregate and adhesive having the same

Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

Pressure sensitive adhesive tear tape

A tape that includes a cellulosic substrate defining a first surface and an opposing second surface; a pressure sensitive adhesive disposed on the first surface of the cellulosic substrate; and an encapsulated fibrous material disposed on the first surface of the cellulosic substrate or the second surface of the cellulosic substrate.

Polyester adhesive composition

The present invention has an object to provide a solvent-free polyester-based adhesive composition having good coatability and capable of forming an adhesive that shows good adhesion performance. The present invention provides a polyester-based adhesive composition containing a polyester having Mw of from 1×10 3 to 20×10 3 as a main component and a trifunctional or more polyepoxy compound as a crosslinking agent, and containing substantially no organic solvent. The molar number, m OH , of hydroxyl group contained in a polyalcohol component constituting the polyester is from 0.5 to 0.98 times of the molar number, m COOH , of carboxyl group contained in a polycarboxylic acid component. The composition has a viscosity at 23° C. of at most 80 Pa·s.

Solar cell backsheet

A solar cell backsheet is disposed to contact a sealing material on a cell side of a substrate at which solar cell elements are sealed with the sealing material, and includes a support that satisfies Equation (1) and an adhesive layer including a binder and inorganic fine particles in an amount of from 50% to 200% by volume of the total volume of the binder, peeling strength between the sealing material and the adhesive layer being 10 N/20 mm or more after the solar cell backsheet is stored in an 85° C. and 85% RH atmosphere for 1,000 hours. Equation (1): 1.0≧(ELBA)/(ELBB)≧0.5 (ELBA and ELBB respectively denote elongation at break after and before 50 hours of storage in a 120° C. and 100% RH atmosphere.) The backsheet has excellent adhesion to a sealing material in a wet and hot environment.

Tactiles connector

Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface.

Polymer film and its application in a lighting assembly

Present embodiments provide for a polymer film with a reflective ratio equal to or above about 80%, comprising a white polyimide layer and a white adhesive layer disposed on a surface of the white polyimide layer The white adhesive layer including an adhesive agent and a white filler distributed in the adhesive agent. Present embodiments also provide for a lighting assembly that comprises a substrate, a lighting component disposed on the substrate, and a reflective surface formed by the polymer film.

Seal and method of sealing aspects of a boiler for high temperature environment of a boiler assembly

A seal comprising a high temperature silicone adhesive sealant layer; a first non-ceramic layer mounted to the silicone adhesive sealant layer; a first expanded metal layer mounted to the first non-ceramic layer; a first silicone cloth layer mounted to the first expanded metal layer; a metal reinforcement layer mounted to the first silicone cloth layer to provide structural integrity without the use of ceramic materials; a second expanded metal layer mounted to the metal reinforcement layer; a second non-ceramic layer mounted to the second expanded metal layer; a turbine mesh layer mounted to the second non-ceramic layer; a second silicone cloth layer mounted to the turbine mesh layer; a sealing castable applied over the second silicone cloth layer to provide a covering; and, a high temperature bonding adhesive disposed between each layer following the first non-ceramic layer to bind the layers together.

Activatable Linerless Labels and Activatable Adhesives, Systems, Machines and Methods Therefor

A print and apply system configured to facilitate the application of a flow of activatable labels with variable length to a flow of items, including a roll of activatable label stock with a facestock and an activatable adhesive layer; a software program configured to create a layout for each of the flow of activatable labels with variable length; a printer configured to print on the facestock; a cutter configured to cut off a specific length from the roll of activatable label stock to form the flow of activatable labels according to the layout; an activation unit to activate the adhesive layer to turn it tacky; and, an applicator unit configured to receive and place the labels with activated adhesive onto a flow of items to be labeled. Related methods and uses are described.

Pressure-sensitive adhesives with onium-epoxy crosslinking system

A pre-adhesive composition is described comprising an acid- and epoxy-functional (meth)acryloyl copolymer, which when crosslinked with or without using an ionic photoacid generator (PAG) provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles having desirable properties.

Utensil Mat

The Utensil Mat is a paper product or a thin plastic film attached to or laid upon a table for the protection of silverware or eating utensils to keep them from being exposed to germs or bacteria before and during a dining experience. Design specifically for silverware only.

Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer

Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity.

Pressure-sensitive adhesive sheets

The present invention provides a pressure-sensitive adhesive sheet having an adequate adhesion so as not to cause blistering and peeling with the lapse of time and is excellent in re-peeling property and workability. The pressure-sensitive adhesive sheet provided is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer formed using a pressure-sensitive adhesive composition on one or both surfaces of a supporting film, in which the shift length after 30 minutes from a creep test carried out at 23° C. and a shearing load of 500 g by bonding an adhesive area of 200 mm 2 of the pressure-sensitive adhesive layer to a TAC polarizing plate is 2.5 mm or less, and the adhesion at a peeling rate of 0.3 m/min after 30 minute-bonding of a pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer to a TAC surface at 23° C. is 0.3 N/25 mm or less.

Anchor-layer-forming coating liquid, pressure-sensitive adhesive layer-carrying optical film and method for producing the film

A coating liquid for forming an anchor layer interposed between an optical film and a pressure-sensitive adhesive layer, comprising a polythiophene based polymer, a polyoxyalkylene-group-containing polymer, and a mixed solvent comprising 65 to 100% by weight of water and 0 to 35% by weight of an alcohol.

Surface protective sheet

Provided is a surface protective sheet which satisfactorily adheres even to a coated surface having a rough surface, and not only does not cause an adhesive residue that can be observed with eyes but also does not impair the self-cleaning property of the surface of a coated plate. The surface protective sheet includes: a base material layer; and a pressure-sensitive adhesive layer, in which: the pressure-sensitive adhesive layer has an adhesion for a coated steel plate having a ten-point average surface roughness Rz of 8.0 μm of 0.05 N/20 mm or more; a main component in a pressure-sensitive adhesive for constructing the pressure-sensitive adhesive layer includes a polymer P obtained by cross-linking a polymer A; the polymer A has a weight-average molecular weight Mw of 500,000 or more; the polymer A has a distribution degree Mw/Mn of 8.0 or less; and an insoluble content of the polymer P in ethyl acetate is 90 wt % or more.

Gentle to skin adhesive

Electron beam and gamma radiation crosslinked, silicone gel adhesives are described. Both nonfunctional and functional poly diorganosiloxanes are used. Methods of forming the adhesives, and medical articles incorporating such adhesives are also described.

Process for preparing adhesive using planetary extruder

A continuous process for preparing a pressure sensitive adhesive using a planetary roller extruder is described. The continuous process includes introducing at least one non-thermoplastic elastomer into a planetary roller extruder and initially compounding the non-thermoplastic elastomer in the planetary roller extruder to form an initially masticated non-thermoplastic elastomer. Then, a solid raw material, a liquid material, or both are introduced into the initially masticated non-thermoplastic elastomer in the planetary roller extruder, and subsequent compounding of the initially masticated non-thermoplastic elastomer with these additional components occurs to form an adhesive composition.

Tamper Evident Tabbed Sealing Member Having A Foamed Polymer Layer

A pull-tab sealing member for a container providing a foamed polymer layer positioned within the sealing member for effective heat sealing to the container together with a lower laminate below a tab capable of tearing to provide a tamper evident structure below the tab.

Biodegradable sheets

The present invention relates to sheets. The sheets include a base layer, a resin layer formed on the base layer, and a printed layer formed on the resin layer. The resin layer includes a polylactic acid (PLA) resin. The sheets are biodegradable.

Scanned, pulsed electron-beam polymerization

A method including: a. coating at least a portion of at least one major surface of a substrate with a polymerizable composition to obtain a coated surface; b. initiating polymerization of the polymerizable composition by scanning a first electron-beam focused on the coated surface across at least a portion of the coated surface, thereby irradiating the coated surface at a frequency selected to achieve an exposure duration of greater than 0 and no greater than 10 microseconds, and a dark time between each exposure duration of at least one millisecond, thereby producing an at least partially polymerized composition. A pressure sensitive adhesive article and a cross-linked silicone release liner made according to the method are also disclosed.

Multilayer thermally restorable article

Provided is a thermally restorable article which has a good filling property when thermally shrunk to improve adhesiveness with a base to be treated, and in which the variation in the thickness of an adhesive layer during extrusion molding can be reduced. A multilayer thermally restorable article includes an adhesive layer composed of an adhesive composition that contains a thermoplastic resin having a melt flow rate of 15 g/10 min or more and 1,000 g/10 min or less at 190° C. and at a load of 2.16 kg, and an organically treated layered silicate, and that has a shear viscosity of 1,000 Pa·s or more at a temperature of 150° C. and at a shear rate of 0.1 s −1 ; and an outer layer disposed on an outer periphery of the adhesive layer. More preferably, a shear viscosity of the adhesive composition at a temperature of 150° C. and at a shear rate of 100 s −1 is 200 Pa·s or less.

Self adhesive fouling release coating composition

A multilayer self-adhesive fouling release coating composition includes an optional removable underlying liner; an adhesive layer applied over and to the optional underlying liner when the latter is present; and a synthetic material layer applied over and to the adhesive layer. Optionally, an intermediate silicone tie coat is applied over and to the synthetic material layer. A silicone fouling release top coat is applied over and to the synthetic material layer, or, when present, over and to the intermediate silicone tie coat. Optionally, a removable polymeric film is applied over and to the fouling release top coat.

FLEXIBLE CORNER TRIM PRODUCT

A trim piece for sealing a work surface including a body having a first side, a second side, and a span disposed between the first side and the second side, wherein the first side and the second side are joined at a junction defining an angle between the first side and the second side of between 80 degrees and 100 degrees, a topcap is affixed to the span of the body, wherein the topcap includes a left side having a first wing and a right side having a second wing, an adhesive is bonded to the first side of the body and an aperture is disposed within the body. 1. (canceled)2. A trim piece for sealing a joint in a work surface , the trim piece comprising:an elongated unitary structure of indeterminate length which when viewed in cross section, includes:a body having a top cap and an extrusion nipple extending centrally downwardly from the top cap;the top cap including a first portion and a second portion extending outwardly away relative to the extrusion nipple in a first direction and a second direction, an extent of the top cap being generally equal in the first direction and the second direction, each of the first portion and the second portion being bounded respectively by a first radius portion and a second radius portion;the extrusion nipple including a first portion having parallel sides and a second portion which narrows from a width of the parallel sides to a smaller width at a distal end thereof; andthe first radius portion and the second radius portion facilitating flexibility of the first portion and the second portion.3. The trim piece as claimed in claim 2 , further comprising at least a 1 pair of sidewardly extending structures extending outwardly away from the extrusion nipple.4. The trim piece as claimed in claim 2 , further comprising a third radius portion and a fourth radius portion on opposing sides of a junction between the top cap and the extrusion nipple.5. The trim piece as claimed in claim 2 , wherein the trim piece is formed from a material ...

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FROM THE SAME

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like. 1. (canceled)2. An anisotropic conductive polymer sphere comprising a polymeric core having at least a portion of an outer surface of the sphere coated with at least one down-converting material that responds to X-ray photons.3. The anisotropic conductive polymer sphere of claim 2 , further comprising an outer coating of silica.4. The anisotropic conductive polymer sphere of claim 2 , wherein the at least one down-converting material is in a form of nanoparticles.5. An anisotropic conductive polymer sphere comprising a polymeric core having at least a portion of an outer surface of the sphere coated with at least one up-converting material that responds to near infrared photons.6. The anisotropic conductive polymer sphere of claim 5 , further comprising an outer coating of silica.7. The anisotropic conductive polymer sphere of claim 5 , wherein the at least one up-converting material is in a form of nanoparticles.8. An X-ray unit that simultaneously causes down-converting particles of ACA spheres to radiate at a selected ...

Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization

A method of rendering a substrate catalytic to electroless metal deposition comprising the steps of: (a) depositing a ligating chemical agent on the substrate, which is capable of both binding to the substrate and ligating to an electroless plating catalyst; and (b) ligating the electroless plating catalyst to the ligating chemical agent, wherein the ligating chemical agent has the chemical structure: wherein n and m are each between about 1 and about 100.

WATERPROOF SHEET AND WATERPROOF TREATMENT

A waterproof sheet comprising a rubber base and a pressure-sensitive adhesive layer of silicone resin or gel thereon is applicable to the boundary between an outdoor tank and a concrete pedestal. The waterproof sheet maintains waterproofness over a long period of time and is in long-term service without degradation of physical properties. 2. The method of claim 1 , wherein the pressure-sensitive adhesive layer has a hardness of 1 to 40 on the Asker C hardness scale.3. The method of claim 1 , wherein components (A) and (B) are compounded in such amounts that component (A) is 30 to 90 parts by weight and component (B) is 10 to 70 parts by weight of said addition cure silicone rubber composition.4. The method of claim 1 , wherein component (D) is a resinous copolymer predominantly comprising R″HSiOunits and SiOunits or is a resinous copolymer predominantly comprising R″HSiOunits claim 1 , R″SiOunits claim 1 , and SiOunits claim 1 , wherein R″ is a substituted or unsubstituted monovalent hydrocarbon group free of alkenyl moieties claim 1 , and wherein a molar ratio of R″HSiOand R″SiOunits to SiOunits is 0.5/1 to 1.5/1.5. The method of claim 1 , wherein said addition cure silicone rubber composition further comprises{'sub': 3', '1/2', '2', '3', '1/2', '2, '(C) a resinous copolymer predominantly comprising R′SiOunits and SiOunits, a molar ratio of R′SiOunits to SiOunits being in a range of 0.5 to 1.5, wherein R′ is a halogen atom or cyano radical-substituted or unsubstituted monovalent hydrocarbon group, and R′ does not contain or contains alkenyl in a total amount of less than 0.0001 mol/g, in an amount of 0 to 400 parts by weight relative to 100 parts by weight of components (A) and (B) combined, the amount being such that a molar ratio of silicon-bonded hydrogen in component (D) to silicon-bonded alkenyl group in components (A), (B), and (C) is in a range of 0.32 to 0.75 when component (C) contains alkenyl.'}6. The method of claim 1 , wherein the addition cure silicone ...

Waterproof sheet for use in bridge pier repair and waterproof working method using the same

When a bridge pier is reinforced or repaired by wrapping a reinforcement around the pier, a waterproof sheet having a sufficient flexibility to attach to and cover the interface between the pier and the reinforcement in a liquid-tight manner is useful. The waterproof sheet is attached to the interface between the pier and the reinforcement to prevent water from penetrating into the interface for thereby preventing the reinforcement from deterioration.

Temporary adhesive for production of semiconductor device, and adhesive support and production method of semiconductor device using the same

The invention is directed to a temporary adhesive for production of semiconductor device, containing (A) a polymer compound having an acid group, (B) a diluent, and (C) a solvent, an adhesive support including a substrate and an adhesive layer formed from the temporary adhesive for production of semiconductor device, and a production method of semiconductor device having a member processed including: adhering a first surface of a member to be processed to a substrate through an adhesive layer formed from the temporary adhesive for production of semiconductor device as claimed; conducting a mechanical or chemical processing on a second surface which is different from the first surface of the member to be processed to obtain the member processed; and releasing the first surface of the member processed from the adhesive layer.

Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates

A silicone composition and more particularly to a silicone composition comprising at least one organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, at least one silicone resin having the formula (R 1 R 4 R 5 SiO 1/2 ) w (R 1 2 SiO 2/2 ) x (R 4 SiO 3/2 ) y (SiO 4/2 ) z (II), wherein R 1 is C 1 to C 10 hydrocarbyl or C 1 to C 10 halogen-substituted hydrocarbyl, both free of aliphatic unsaturation, R 4 is C 2 to C 4 alkenyl, R 5 is R 1 or R 4 , w is from 0.01 to 0.6, x is from 0 to 0.5, y is from 0.1 to 0.95, z is from 0 to 0.4, and w+x+y+z)=1, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of the silicone composition, and a coated substrate and a laminated substrate, each comprising the silicone adhesive.

ADHESIVE BONDING COMPOSITION AND ELECTRONIC COMPONENTS PREPARED FROM THE SAME

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like. 1. (canceled)2. An inkjet cartridge , comprising a printhead and a cartridge body , wherein the printhead and cartridge body are held together by a cured adhesive composition obtained by curing of a curable adhesive composition , wherein the curable adhesive composition comprises an organic vehicle comprising at least one polymerizable monomer; at least one photo-initiator responsive to a selected wavelength of light; and at least one energy converting material selected to emit said wavelength of light when exposed to a selected imparted radiation.3. The inkjet cartridge of claim 2 , wherein said at least one energy converting material is an upconverting material.4. The inkjet cartridge of claim 3 , wherein said imparted radiation is near infrared.5. The inkjet cartridge of claim 2 , wherein said at least one energy converting material is a downconverting material.6. The inkjet cartridge of claim 5 , wherein said imparted radiation is ionizing radiation.7. The inkjet cartridge of claim 2 , wherein said cured adhesive ...

Adhesive tape for use with paints having low or no volatile organic compounds

An adhesive tape comprising a substrate having a top surface and a bottom surface, and an adhesive applied to the top or the bottom surface of the substrate. The adhesive comprises a tackifying resin. The tackifying resin comprises a rosin resin, a rosin resin derivative, a terpene resin, a heat reactive phenolic resin, a petroleum-based resin, or a combination thereof. Rosin resin derivatives include a rosin ester, a rosin metal salt, a hydrogenated rosin ester, a partially hydrogenated rosin, or a combination thereof. In another aspect, the adhesive is a pressure sensitive adhesive, and the adhesive tape is a masking tape. The adhesive tape is particularly suitable for adhesion to surfaces painted with paint having low or no volatile organic compounds.

Electrically conductive adhesive compound and adhesive tape

A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

DECORATIVE DECAL ASSEMBLY FOR A WEIGHT PLATE

The decorative decal assembly () is configured to be secured within a recessed surface () of a weight plate () and includes an adhesive layer (), a printable surface () of an adjacent ink protective printing layer (), and one or more print decals () secured to the printable surface () and between an upper support surface () of the adhesive layer () and the ink protective layer (). The recessed surface () defines a display area () surrounded on all sides by an expansion zone () extending between the display area () and the shoulders () of the weight plate () that define the recessed surface () to permit limited expansion of perimeter edges (A, B) of the decal assembly () into the expansion zone () without contacting the shoulders () whenever the weight plate () experiences a bounce shock. 112-. (canceled)13. A decal assembly for attachment with a rubber substrate comprising:an adhesive layer having a contact surface for attachment with a surface of the rubber substrate; andone or more decals disposed along a surface of the adhesive layer that is opposite the adhesive layer support surface.14. The decal assembly as recited in wherein the one or more decals are attached to a display portion of a rubber substrate claim 13 , and wherein the one or more decals may be of one or more colors and/or shapes.15. The decal assembly as recited in further comprising an intermediate layer interposed between the adhesive layer and the one or more decals.16. The decal assembly as recited in wherein the intermediate layer is a protective layer interposed between the one or more decals and the adhesive layer support surface.17. The decal assembly as recited in further comprising a protective layer disposed over an outer surface of the one or more decals.18. The decal assembly as recited in comprising a plurality of the decals positioned adjacent one another along a display surface of the rubber substrate.19. The decal assembly as recited in comprising at least two decals wherein a ...

SIMPLE COACERVATES AND METHODS OF USE THEREOF

Described herein is the synthesis of adhesive from simple adhesive coacervates and their uses thereof. The adhesives are composed of (a) a polyanion in the absence of a polycation, wherein the polyanion comprises at least one crosslinking group capable of covalently crosslinking with itself, and (b) a sufficient amount of a complimentary multivalent cation or multivalent anion to produce the simple coacervate. The adhesives have numerous medical and non-medical applications. 1. An adhesive comprising a simple coacervate , wherein the simple coacervate comprises (a) a polyanion in the absence of a polycation , wherein the polyanion comprises at least one crosslinking group capable of covalently crosslinking with itself , and (b) a sufficient amount of a complimentary multivalent cation or multivalent anion to produce the simple coacervate.2. The adhesive of claim 1 , wherein the polyanion comprises a synthetic or naturally-occurring polymer comprising one or more sulfate claim 1 , sulfonate claim 1 , carboxylate claim 1 , borate claim 1 , boronate claim 1 , phosphonate claim 1 , phosphate groups claim 1 , or any combination thereof.3. The adhesive of claim 1 , wherein the polyanion comprises a polysaccharide claim 1 , a protein claim 1 , or a synthetic polypeptide.4. The adhesive of claim 1 , wherein the polyanion comprises an inorganic polyphosphate compound.7. The adhesive of claim 6 , wherein Ris methyl claim 6 , Ris hydrogen claim 6 , and n is 2.8. The adhesive of claim 2 , wherein the complimentary multivalent cation is Mg.9. The adhesive of claim 1 , wherein the crosslinking group comprises an actinically crosslinkable group.10. The adhesive of claim 9 , wherein the actinically crosslinkable comprises an acryloyl group or a methacryloyl group.11. The adhesive of claim 1 , wherein the simple coacervate further comprises one or more bioactive agents.12. The adhesive of claim 1 , wherein the simple coacervate further comprises one or more contrast agents.13. The ...

Adhesive for electronic component

An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.

Swelling tape for filling gap

A swelling tape for filling a gap and a method of filling a gap are provided. The swelling tape can be applied within the gap having a fluid to realize a 3D shape thereby filling the gap, and be used to fix a subject forming the gap as necessary.

Light guide tape

A light guide tape for using on bus bars of solar panels to increase the utilization efficiency of the incident sunlight is disclosed. The light guide tape includes a flexible transparent substrate with a plurality of light guide micro-structures on the side of the incident sunlight, and an adhesive layer. The incident sunlight shielded by the bus bars of the solar cells can transfer to generating regions of both sides of the bus bars through the plurality of light guide micro-structures to increase the utilization efficiency of the incident sunlight.

Tamper Evident Tabbed Sealing Member Having A Foamed Polymer Layer

A pull-tab sealing member for a container providing a foamed polymer layer positioned within the sealing member for effective heat sealing to the container together with a lower laminate below a tab capable of tearing to provide a tamper evident structure below the tab. 17.-. (canceled)8. A two-piece liner and tamper indicating tabbed seal for sealing to a rim of a container , the liner and seal comprising:a liner having a lower surface thereof and a releasable layer configured to temporarily bond the tamper indicating tabbed seal to the liner;a tamper indicating tabbed seal having an upper surface releasably bonded to the liner and a lower surface configured for bonding to a container rim, the tamper indicating tabbed seal includinga lower laminate including a heat sealable layer and an induction heating layer, the lower laminate configured for heat sealing the tamper indicating tabbed seal portion to a container rim;an upper laminate at least partially bonded to the lower laminate to form a gripping tab defined within a perimeter of the lower laminate, the upper laminate including a foamed polymer layer, one or more polymer support layers bonded to the foamed polymer layer, and a bonding layer forming the at least partial bond between the upper laminate and the lower laminate;the lower laminate and the upper laminate have a construction effective to permit tearing of the lower laminate in response to a removal force applied to the gripping tab such that a first portion of the lower laminate including the heat sealable layer and the induction heating layer is configured to remain bonded to a container rim and a second portion of the lower laminate including the heat sealable layer and the induction heating layer is configured to remain bonded the upper laminate; andwherein a tear strength of the upper laminate and the bond of the upper laminate to the lower laminate is greater than a tear strength of the lower laminate such that, when bonded to a container rim, the ...

Modular Carpet Systems

A modular carpet system includes a carpet tile and an adhesive. The carpet tile is operative for resisting deformation, even under adverse conditions. In some embodiments, the adhesive may comprise a silicone-based adhesive or a urethane-based adhesive. 1. A modular carpet system , comprising:a carpet tile having a face and a backing, wherein the backing is for being positioned in a facing relationship with an installation surface, wherein the backing comprises a polymer having at least 50% amorphous content, wherein the polymer having at least 50% amorphous content comprises polyvinyl butyral, a moisture vapor emission rate of at least about 4 lb/24 hr/1000 sq. ft.,', 'an in situ relative humidity of at least about 80%, and', 'a surface moisture pH of at least about 8; and, 'wherein the carpet tile is operative for remaining dimensionally stable under adverse conditions, the adverse conditions comprising at least one of'}an adhesive tape separate from the carpet tile, wherein the adhesive tape is for securing the carpet tile to at least one of an adjacent carpet tile and the installation surface, wherein the adhesive tape comprises a silicone-based adhesive supported on a polymer film.2. The modular carpet system of claim 1 , wherein the backing comprises from about 25 to about 60 wt % polyvinyl butyral and from about 40 to about 75 wt % filler.3. The modular carpet system of claim 1 , wherein the silicone-based adhesive has a shear strength of at least about 21.7 lb-f/sq. in. prior to exposure to adverse conditions.4. The modular carpet system of claim 1 , wherein the silicone-based adhesive has an adhesive tack of greater than 3.5 lb-f/sq. in. prior to exposure to adverse conditions and at least one of:an adhesive tack of greater than 2.0 lb-f/sq. in. after being immersed in water for about 1 day, andan adhesive tack of greater than 2.7 lb-f/sq. in. after being immersed in a pH 12 solution for about 1 day.5. The modular carpet system of claim 1 , wherein the ...

Flexible corner trim product

A trim piece for sealing a work surface including a body having a first side, a second side, and a span disposed between the first side and the second side, wherein the first side and the second side are joined at a junction defining an angle between the first side and the second side of between 80 degrees and 100 degrees, a topcap is affixed to the span of the body, wherein the topcap includes a left side having a first wing and a right side having a second wing, an adhesive is bonded to the first side of the body and an aperture is disposed within the body.

Adhesive article and method of making the same

Adhesive articles that include a substrate and a silicone adhesive are disclosed. The articles also include a polymer containing poly(propylene oxide) units and optionally poly(ethylene oxide) units and having a number average molecular weight of at least 1000 grams per mole. The polymer may either be incorporated into the substrate or may be used as a primer on the substrate. If the polymer includes poly(ethylene oxide) units, the copolymer typically has a weight ratio of poly(ethylene oxide) to poly(propylene oxide) of up to 3:1, or if the copolymer has a number average molecular weight of at least 10,000 grams per mole, the weight ratio of poly(ethylene oxide) to poly(propylene oxide) is up to 2:1. Methods of making the adhesive articles are also disclosed.

Activatable Linerless Labels and Activatable Adhesives, Systems, Machines and Methods Therefor

A print and apply system configured to facilitate the application of a flow of activatable labels with variable length to a flow of items, including a roll of activatable label stock with a facestock and an activatable adhesive layer; a software program configured to create a layout for each of the flow of activatable labels with variable length; a printer configured to print on the facestock; a cutter configured to cut off a specific length from the roll of activatable label stock to form the flow of activatable labels according to the layout; an activation unit to activate the adhesive layer to turn it tacky; and, an applicator unit configured to receive and place the labels with activated adhesive onto a flow of items to be labeled. Related methods and uses are described. 1. A print and apply system configured to facilitate the application of a flow of activatable labels to a flow of items , the system comprising:a roll of activatable label stock with a facestock and an activatable adhesive layer;a cutter configured to cut off a predetermined length or a predetermined shape from the roll of activatable label stock to form the flow of activatable labels;an activation unit to activate the adhesive layer to turn it tacky; and,an applicator unit configured to receive and place the labels with activated adhesive onto a flow of items to be labeled;wherein the predetermined length and the predetermined shape of any given label can be variable such that the lengths or shapes or both are different for at least two of the activatable labels.2. The print and apply system as in claim 1 , wherein the system is configured to create a layout including the predetermined length and shape for each of the activatable labels.3. The print and apply system as in claim 2 , further comprising at least one printer configured to print on the facestock according to the layout.4. The print and apply system as in claim 2 , wherein the printer is at least one of an inline printer claim 2 , an ...

Silicone adhesive composition, a method for the preparation thereof and an adhesive film

One of the purposes of the present invention is to provide an silicone adhesive composition which comprises no antioxidant, has sufficient adhesive, tack properties and excellent heat resistance, and provides a silicone adhesive composition which has no adhesive residue in a test described below. The other purpose of the present invention is to provide an adhesive film and an adhesive tape having a cured layer obtained from the composition. The present invention provides an addition curable or peroxide curable silicone adhesive composition, wherein the addition curable silicone adhesive composition comprises (A1) a diorganopolysiloxane having an alkenyl group and a viscosity at 25 degrees C. of 100,000 mPa·s or more, (B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atoms, (C) an organchydrogenpolysiloxane having at least three SiH groups, (D) optionally an addition reaction inhibitor, (E) a platinum group metal catalyst for an addition reaction, and (F) an organic solvent, and the peroxide curable silicone adhesive composition comprises (A2) a diorganopolysiloxane having a viscosity at 25 degrees C. of 100,000 mPa·s or more and may or may not have an alkenyl group, (B) an organopolysiloxane having R 1 3 SiO 0.5 units and SiO 2 units, wherein R 1 is a substituted or unsubstituted, monovalent hydrocarbon group having 1 to 10 carbon atom, (F) an organic solvent, and (G) an organic peroxide, and components (A1) and (A2) may be accompanied with octamethylcyclotetrasiloxane and/or decamethylcyclopentasiloxane and each content of octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane is less than 0.1 mass %, based on a total amount of component (A1) or (A2), component (B) and octamethylcyclotetrasiloxane and decamethylcyclopentasiloxane.

PRESSURE-SENSITIVE ADHESIVES INCLUDING EXPANDABLE GRAPHITE

A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite.

PRESSURE-SENSITIVE ADHESIVES INCLUDING EXPANDABLE GRAPHITE

A building material comprising a substrate layer and a pressure-sensitive adhesive layer, where the pressure-sensitive adhesive layer includes expandable graphite. 1. A method of preparing a composite , the method comprising the steps of:i. providing a polymeric sheet;ii. applying a pressure-sensitive adhesive having a first and second planar surfaces to the polymeric sheet; andiii. applying expandable graphite to the second planar surface of the pressure-sensitive adhesive to form a concentrated region of expandable graphite.2. The method of wherein the concentrated region of expandable graphite is discontinuous to thereby allow the pressure-sensitive adhesive to be exposed.3. The method of wherein the first planar surface of the pressure-sensitive adhesive is fixedly attached to the polymeric sheet.4. The method of wherein a release liner is removably attached to the second planar surface of the pressure-sensitive adhesive.5. The method of wherein said concentrated region of expandable graphite is proximate to the release liner relative to the polymeric sheet.6. The method of wherein the first planar surface of the pressure-sensitive adhesive is substantially devoid of expandable graphite.7. The method of wherein the concentrated region of expandable graphite has a thickness of from about 10 μm to about 3 mm.8. The method of wherein the polymeric sheet includes a thermoplastic sheet.9. The method of wherein the polymeric sheet includes a thermoset sheet.10. The method of wherein the concentrated region of expandable graphite is formed to by dropping expandable graphite on to the second planar surface of the pressure-sensitive adhesive.11. The method of wherein the expandable graphite is at least partially embedded within the pressure-sensitive adhesive.12. The method of claim 11 , where the concentrated region of expandable graphite is partially dispersed within said pressure-sensitive adhesive to form a concentration gradient whereby the concentration of the ...

Object with Selectable Adhesion

A surface with selectable adhesion is achieved by a shape memory alloy that is at least partly coated with a polymer forming a surface structure, thus allowing the adhesion force of the surface to be controlled.

Adhesive bonding composition and electronic components prepared from the same

A polymerizable composition includes at least one monomer, a photoinitiator capable of initiating polymerization of the monomer when exposed to light, and a phosphor capable of producing light when exposed to radiation (typically X-rays). The material is particularly suitable for bonding components at ambient temperature in situations where the bond joint is not accessible to an external light source. An associated method includes: placing a polymerizable adhesive composition, including a photoinitiator and energy converting material, such as a down-converting phosphor, in contact with at least two components to be bonded to form an assembly; and, irradiating the assembly with radiation at a first wavelength, capable of conversion (down-conversion by the phosphor) to a second wavelength capable of activating the photoinitiator, to prepare items such as inkjet cartridges, wafer-to-wafer assemblies, semiconductors, integrated circuits, and the like.

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board

The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin (A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

Pressure sensitive adhesive blends comprising (meth) acrylate polymers and articles therefrom

The present invention relates to a blend of at least one (meth)acrylate polymer and at least one amorphous propylene-derived polymer, and an optional tackifier that provide pressure sensitive adhesive compositions in which improved peel adhesion to at least one of low and relatively high surface energy substrates can be achieved.

Co-extrudable multi-layer polymer

The present invention provides a multi-layer polymer composition having a polar outer layer and a non-polar second outer layer. The polar outer layer is preferably PVC and the non-polar outer layer, polypropylene. The adhesive tie layer is a unique blend of a copolyester elastomer, a non-polar polymer, and a copolymer that contains functional groups capable of reaction with the functional end groups of the copolyester elastomer and that is totally or partially miscible with the non-polar polymer in the second outer layer. The multi-layer polymer can be advantageously coextruded. The non-polar outer layer can comprise the bulk of a fabricated part, with only a thin layer of polar polymer, providing desired attributes of the polar polymer at a lower cost.

Polyester-containing biaxially-oriented polypropylene films

Polyester-containing multilayer biaxially-oriented polypropylene films are provided. According to the invention, a two- or three-layer polyester-containing cap layer is bonded to a monoaxially oriented polypropylene core, followed by orientation of the resulting composite in a direction transverse to the direction of orientation of the core layer. At least one tie layer is interposed between the core and the polyester. Advantageously, the polyester contains silicone fluid as a processing aid.

Patent DE4222849C1

Glass laminates for reduction of sound transmission

The present invention is a glass laminate having sound attenuation properties that make it suitable for use as acoustic glazing in architectural applications and/or in vehicles.

Cross-linked polyolefin foam

The invention relates to polymer tapes that are blends including at least one silane-grafted single-site initiated polyolefin resin. The silane-grafted single-site initiated polyolefin resin generally is a copolymer of ethylene and a C3-C20 alpha-olefin that has a molecular weight distribution between about 1.5 and about 3.5. The polymer tapes include an adhesive on at least one face of the polymer. The polymer tapes can be foamed.

Asymmetric multilayered polymeric film and label stock and label thereof

A polymeric film for labeling articles comprises an asymmetric multilayered film comprising specialized skin and core layers whose compositions address multiple needs including adhesion of a printing ink and an adhesive and die-cuttability. The polymeric film provides improved performance in the conversion to an adhesive containing label stock and adhesive label.

Improved combination of elastomeric film composition and adhesive for a stretch laminate

A structure comprising an elastic film layer and an adhesive in contact therewith is disclosed. The elastomeric film layer may include a plasticizer and greater than 7 percent by weight of a tackifier. The elastomeric film formulation provides reduced loss of adhesion strength with the adhesive over time, providing for improvement in mechanical performance of the stretch laminate over time.

Cross-linked polyolefin tape

The invention relates to polymer tapes that are blends including at least one silane-grafted single-site initiated polyolefin resin. The silane-grafted single-site initiated polyolefin resin generally is a copolymer of ethylene and a C 3 -C 20 alpha-olefin that has a molecular weight distribution between about 1.5 and about 3.5. The polymer tapes include an adhesive on at least one face of the polymer. The polymer tapes can be foamed.

Adhesive compositions based on blends of grafted substantially linear polyethylenes and non-grafted conventional polyethylenes

Laminated films comprising at least one structural layer, at least one adhesive layer and optionally at least one barrier layer made by a high speed or fast quench film process, where the adhesive compositions are blends of acid-grafted substantially linear polyethylenes and conventional-linear polyethylene homopolymer or copolymer or low density polyethylene.

Cross-linked polyolefin tape

The invention relates to polymer tapes that are blends including at least one silane-grafted single-site initiated polyolefin resin. The silane-grafted single-site initiated polyolefin resin generally is a copolymer of ethylene and a C3-C20 alpha-olefin that has a molecular weight distribution between about 1.5 and about 3.5. The polymer tapes include an adhesive on at least one face of the polymer. The polymer tapes can be foamed.

Method for joinning substrates and objects

A method to join a substrate to an object is disclosed using a curable one or two part adhesive composition comprising an effective amount of a stabilized organoborane amine complex initiator and one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization.

Method for joining substrates and objects

A method to join a substrate to an object is disclosed using a curable one or two part adhesive composition comprising an effective amount of a stabilized organoborane amine complex initiator and one or more monomers, oligomers, polymers or mixtures thereof having olefinic unsaturation which is capable of polymerization by free radical polymerization.

Interdraw pretreatment for polyester film

An oriented polyester film coated on at least one surface with a coating that improves its adhesion to gelatin is disclosed. The dry coating contains one or more sulfopolyesters; one or more tetrablock copolymer resins; and one or more non-volatile polyamines. Other ingredients, such as particulate materials and surfactants, may be present in the coating. The coating is preferably applied at the interdraw stage.

Coated abrasive article

A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable preferably, melt-processable resin containing an epoxy resin, an ethylene-vinyl acetate copolymer, and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The above binder precursors of the invention are preferably free of homopolymers and copolymers of olefinic monomers. In another aspect, the invention also describes an energy curable first binder precursor containing an epoxy resin, an ethylene-vinyl acetate copolymer, a polyfunctional acrylate component and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The invention also relates to a method of producing such coated abrasive articles and a surface-treated backing material.

Interdraw pretreatment for polyester film

An orientated polyester film coated on at least one surface with a coating that improves its adhesion to gelatin is disclosed. The dry coating contains one or more sulfopolyesters; one or more tetrablock copolymer resins; and one or more non-volatile polyamines. Other ingredients, such as particulate materials and surfactants, may be present in the coating. The coating is preferably applied at the interdraw stage.

Coated abrasive article

A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable, preferably melt-processable resing containing an epoxy resin, an ethylene-vinyl acetate copolymer, and a curing agent for cross-linking the epoxy resin that is cured to provide a cross-linked make coating. The above binder precursors of the invention are preferably free of homopolymers and copolymers of olefinic monomers. In another aspect, the invention also describes an energy curable first binder precursor containing an epoxy resin, an ethylene-vinyl acetate copolymer, a polyfunctional acrylate component and a curing agent for cross-linking the epoxy resin that is cured to provide a cross-linked make coating. The invention also relates to a method of producing such coated abrasive articles and a surface-treated backing material.

Microwave radiation absorbing adhesive

A microwave radiation absorbing adhesive comprises dissipative particles bound in a thermoplastic or thermosetting adhesive The absorbing adhesive may be applied directly to the surface of any object, or to an irregularly shaped object, or into cracks or crevices in or between objects, including conventional absorbers. Several types of dissipative particles and adhesives may be used.

Prepreg, printed wiring board, multilayer circuit board and process for manufacturing printed wiring board

(A) 에폭시 수지, (B) 경화제, (C) 경화 촉진제, (D) 페녹시 수지, 및 (E) 무기 충전재를 함유하는 에폭시 수지 조성물을 기재에 함침하고, 반경화시켜 얻어지는 프리프레그로서, 상기 무기 충전재(E)의 평균 입자 직경이 3μm 이하인 것을 특징으로 하는 프리프레그를 이용한다. 이러한 프리프레그로 이루어지는 절연체 기재 표면에 도금 프로세스에 의한 회로 형성 방법을 이용해 배선 간격이 좁은 회로를 형성했을 경우, 회로의 윤곽의 주변부의 절연체 기재 표면의 도금의 잔류량을 저감시킬 수 있다. 그 결과, 회로간의 절연 저항이 안정되고, 프린트 배선판의 수율이 향상한다. As a prepreg obtained by impregnating and semi-hardening an epoxy resin composition containing (A) an epoxy resin, (B) hardening | curing agent, (C) hardening accelerator, (D) phenoxy resin, and (E) inorganic filler, The average particle diameter of the said inorganic filler (E) is 3 micrometers or less, The prepreg is used. When a circuit having a narrow wiring interval is formed on the surface of an insulator substrate made of such prepreg by using a circuit forming method by a plating process, the amount of plating remaining on the surface of the insulator substrate in the periphery of the outline of the circuit can be reduced. As a result, the insulation resistance between circuits is stabilized, and the yield of a printed wiring board improves.

Organopolysiloxane compositions having pressure-sensitive adhesive properties

Curable adhesive compositions

The invention is directed to the use of multifunctional thiol compounds as adhesion promoters and/or primers to enhance the adhesion of photo or electron beam curable polymers, coatings, adhesives, or sealants to gold, other precious metals, and their alloys. Actinic radiation and electron beam (“EB”) radiation can be used to cure such compositions. The resulting cured compositions are optically clear, low T g (≦30° C.), high refractive index (>1.50 at 1541 nm), thermally, oxidatively, and hydrolytically stable adhesives and/or coatings for glass and/or metal. The adhesive compositions containing such multifunction thiols can survive, without delamination or separation, testing conditions of 85° C. and 85% relative humidity (“RH”) for a time in excess of 500 hours. In particular embodiments the invention is directed to the use of oligomers or prepolymers formed from the reaction of one or a plurality of multifunctional maleimide compounds with one or a plurality of multifunctional thiols to form materials for use in adhesives or compositions suitable for adhesive use in optical communications.

Curable pressure sensitive adhesive compositions

Curable pressure sensitive adhesive compositions comprising an acrylate copolymer, a mono-acrylate oligomer, a multi-acrylate oligomer having from 2 to 5 acrylate functional groups per molecule, and a photoinitiator, the adhesive exhibiting pressure sensitive adhesive characteristics and forms at least a semi-interpenetrating polymer network when cured; wherein the semi-IPN has an average molecular weight between crosslinks (M c ) greater than about 3000, and the cured adhesive has a peel strength greater than about 40 N/dm. Embodiments of the adhesive compositions, when cured, are optically clear and resistant to heat and moisture.

Klebstoffdispersion zum stromlosen Plattieren, sowie Verwendung zur Herstellung einer gedruckten Schaltung

Klebstoffdispersion zum stromlosen Plattieren, umfassend 1.) wenigstens ein gehärtetes, wärmebeständiges Teilchen, das in einem Oxidationsmittel leicht löslich ist, und 2.) ein wärmebeständiges Harz, das kaum lösliche Eigenschaften gegenüber einem Oxidationsmittel durch eine Aushärtungsbehandlung aufweist dadurch gekennzeichnet, dass die gehärteten, wärmebeständigen Teilchen aus der Gruppe, bestehend aus (a) einer Mischung aus wärmebeständigen Harzteilchen mit einer durchschnittlichen Teilchengröße von 2 bis 10 μm und einem wärmebeständigen feinen Harzpulver mit einer durchschnittlichen Teilchengröße von nicht mehr als 2 μm, (b) Quasiteilchen, erhalten durch Kleben eines wärmebeständigen feinen Harzpulvers mit einer durchschnittlichen Teilchengröße von nicht mehr als 2 μm und/oder eines anorganischen feinen Pulvers mit einer durchschnittlichen Teilchengröße von nicht mehr als 2 μm, auf Oberflächen von wärmebeständigen Teilchen mit einer durchschnittlichen Teilchengröße von 2 bis 10 μm, und (c) Agglomeratteilchen, erhalten durch Agglomerieren eines wärmebeständigen feinen Harzpulvers mit einer durchschnittlichen Teilchengröße von nicht mehr als 2 μm zu...

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member (3) to be used when a semiconductor chip (6) is mounted on an organic supporting substrate (4) and which has storage moduli at 25 °C and at 260 °C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.

Wiring circuit board

Polyolefin Surface Pressure Sensitive Adhesive

본 발명은 거의 무용매의 하기 (a) 내지 (c) 성분을 포함하는 출발 물질의 중합 반응 생성물을 함유하는 감압성 접착제를 제공한다: The present invention provides a pressure sensitive adhesive containing a polymerization reaction product of a starting material comprising substantially the following solvents (a) to (c): (a) 알킬기가 탄소 원자를 4 내지 20 개 포함하는 1 종 이상의 비3차 알킬 알콜의 아크릴 또는 메타크릴 에스테르 50 내지 100 중량부; (a) 50 to 100 parts by weight of an acrylic or methacrylic ester of at least one non-tertiary alkyl alcohol containing 4 to 20 carbon atoms in the alkyl group; (b) 상기 (a) 성분과 공중합 가능한 1종 이상의 보강 단량체 0 내지 50 중량부(상기 (a)와 (b) 성분의 합량은 100 중량부임); 및 (b) 0 to 50 parts by weight of one or more reinforcing monomers copolymerizable with component (a) (the total amount of components (a) and (b) is 100 parts by weight); And (c) 상기 (a)와 (b) 성분의 합량 100 중량부 당 거의 가용성인 염화 폴리올레핀 0.1 내지 15 중량부. (c) 0.1 to 15 parts by weight of a nearly soluble chloride polyolefin per 100 parts by weight of the total of the components (a) and (b).

Acrylic heat conductive composition and heat conductive sheet

Radiation-curable adhesive compositions

A radiation-curable adhesive composition comprising at least one tackifier resin and at least one radiation-curable composition is provided wherein the tackifier resin comprises monomer repeating units from at least one aromatic monomer and at least one acrylate monomer. Processes to produce the radiation-curable adhesive composition as well as articles comprising the radiation-curable adhesive compositions are also provided.

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board

The invention relates to a prepreg, obtained by impregnating a base material with an epoxy resin composition containing an epoxy resin(A), a curing agent (B), an accelerator (C), a phenoxy resin (D), and an inorganic filler (E) and semi-hardening the impregnated material, wherein the inorganic filler (E) has an average particle diameter of 3 μm or less. When a circuit with a narrow wire distance is formed on a surface of a insulator substrate composed of such a prepreg by using a method of forming the circuit by plating process, an amount of the plating remaining on the insulator substrate surface at the circuit contour periphery can be reduced. As a result, it leads to stabilization of inter-circuit insulation resistance and increase in a yield during production of printed wiring boards.

Method for electrically and mechanically connecting at least two conductive layers

A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.

Polycarbodiimide resin-containing adhesive and flexible printed circuit board

Described is an adhesive containing a polycarbodiimide resin having repeating units represented by the following formula: .paren open-st.R--N═C═N.paren close-st..sub.n wherein R is a divalent hydrocarbon group and n is an integer of 5 to 250, and also described is a flexible printed circuit board and a coverlay film fabricated using the above-described polycarbodiimide resin-containing adhesive.

Flame-retardant adhesive film and flat cable

A flame-retardant adhesive film comprises an insulating substrate film, a flame-retardant interlayer provided on the insulating substrate film, and a flame-retardant adhesive layer provided on the flame-retardant interlayer. The flame-retardant interlayer has higher flame retardance than the flame-retardant adhesive layer. The flame-retardant adhesive layer contains a nitrogen-containing organic flame retardant, and the flame-retardant interlayer contains a non-halogen-based flame retardant with better flame retardance than the nitrogen-containing organic flame retardant.

Fire-retardant adhesive, fire-retardant adhesive film using the same, and flat cable

A fire-retardant adhesive and a fire-retardant adhesive film, which are suitable for producing flat cables using a non-halogen flame-retardant and have fire-retardant properties rivaling those of halogen flame-retardants while maintaining good electrical insulating properties, comprises (A) a polyester resin, (B) a nitrogen-containing organic flame-retardant and (C) a boron compound.

Area bonding conductive adhesive preforms

Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and other electronic devices.

Double-sided adhesive tape or sheet for printed circuit board and printed circuit board

Prepreg, printed wiring board, multilayer circuit board and process for manufacturing printed wiring board

Use is made of a prepreg obtained by impregnating a base material with an epoxy resin composition containing epoxy resin (A), hardening agent (B), hardening accelerator (C), phenoxy resin (D) and inorganic filler (E) and semihardening the impregnated material, characterized in that the inorganic filler (E) has an average particle diameter of 3 μm or less. In the forming of a circuit with narrow wire space on a surface of insulator substrate consisting of the above prepreg in accordance with a circuit forming technique by plating process, there can be attained reduction of the amount of plating remaining on the insulator substrate surface at circuit contour periphery. As a result, there can be attained stabilization of inter-circuit insulation resistance and enhancing of printed wiring board yield.

Prepreg, printed wiring board, multilayer circuit board, and method for manufacturing printed wiring board

[UNK]

Prepreg, printed wiring board, multilayer circuit board and process for manufacturing printed wiring board

Prepreg, printed wiring board, multilayer circuit board, and method for manufacturing printed wiring board

（Ａ）エポキシ樹脂、（Ｂ）硬化剤、（Ｃ）硬化促進剤、（Ｄ）フェノキシ樹脂、及び（Ｅ）無機充填材を含有するエポキシ樹脂組成物を基材に含浸し、半硬化させて得られるプリプレグであって、前記無機充填材（Ｅ）の平均粒子径が３μｍ以下であることを特徴とするプリプレグを用いる。このようなプリプレグからなる絶縁体基材表面にメッキプロセスによる回路形成方法を用いて配線間隔の狭い回路を形成した場合、回路の輪郭の周辺部の絶縁体基材表面のメッキの残留量を低減させることができる。その結果、回路間の絶縁抵抗が安定し、プリント配線板の歩留まりが向上する。 (A) An epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a phenoxy resin, and (E) an epoxy resin composition containing an inorganic filler is impregnated into a base material and semi-cured. A prepreg obtained, wherein the inorganic filler (E) has an average particle size of 3 μm or less is used. When a circuit with a narrow wiring interval is formed on the surface of an insulator base material made of such a prepreg by using a circuit forming method by a plating process, the amount of plating remaining on the surface of the insulator base material at the periphery of the circuit outline is reduced. Can be made. As a result, the insulation resistance between the circuits is stabilized, and the yield of the printed wiring board is improved.

Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive

A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device. The thermoplastic adhesive is heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board. There is also provided a thermoplastic adhesive composition having at least the following components: (A) from 5% to 98% by weight of a functionalized polyolefin, and (B) from 2% to 95% by weight of a polyamide compound.

Tiras vedantes de plastico,processo para sua preparacao e sua utilizacao

Patent JPH0160416B2

Transfer Film and Synthetic Resin Product Decorated With the Transfer Film

The technical problem to be solved by this invention is to give the transfer film a laminar structure that gives no damage to the decorative layer and is resistant to impact, a long period of use, and extensive deformation caused by repeated squeezes. The objects of this invention are to provide the transfer film in which the decorativeness is never damaged by the cracking, abrasion, or peeling during the period of use and also to provide synthetic resin molded products decorated with this transfer film. The solution to the above-described technical problem is a transfer film comprising a base film of a synthetic resin, a protective film of another synthetic resin peelably laminated to the base film, an adhering layer to be adhered to an article to be decorated, and a printed or vapor-deposited decorative layer sandwiched between the protective film and the adhering layer.

Transfer film and synthetic resin product decorated with the transfer film

The technical problem to be solved by this invention is to give the transfer film a laminar structure that gives no damage to the decorative layer and is resistant to impact, a long period of use, and extensive deformation caused by repeated squeezes. The objects of this invention are to provide the transfer film in which the decorativeness is never damaged by the cracking, abrasion, or peeling during the period of use and also to provide synthetic resin molded products decorated with this transfer film. The solution to the above-described technical problem is a transfer film comprising a base film of a synthetic resin, a protective film of another synthetic resin peelably laminated to the base film, an adhering layer to be adhered to an article to be decorated, and a printed or vapor-deposited decorative layer sandwiched between the protective film and the adhering layer.

转印膜及具有由转印膜形成的装饰的合成树脂制成型品

本发明涉及一种即使受到冲击、长期使用或经受挤压变形等反复施加负荷产生的大的变形也不影响其装饰性的转印膜的层结构，其目的在于提供一种使用过程中不发生由于裂纹、磨损或剥离损害其装饰性的转印膜、及具有由转印膜形成的装饰的合成树脂制成型品。实现上述目的的手段为转印膜具有合成树脂制基材膜、可剥离地层叠在该基材膜上的合成树脂制保护膜、粘合在被装饰体上的粘合层，在保护膜与粘合层之间通过印刷或蒸镀等形成装饰层。

Combination of elastomeric film composition and adhesive for a stretch laminate

A structure comprising an elastic film layer and an adhesive in contact therewith is disclosed. The elastomeric film layer may include a plasticizer and greater than 7 percent by weight of a tackifier. The elastomeric film formulation provides reduced loss of adhesion strength with the adhesive over time, providing for improvement in mechanical performance of the stretch laminate over time.

Asymmetric Multilayered Polymeric Film And Label Stock And Label Thereof

A polymeric film for labeling articles comprises an asymmetric multilayered film comprising specialized skin and core layers whose compositions address multiple needs including adhesion of a printing ink and an adhesive and die-cuttability. The polymeric film provides improved performance in the conversion to an adhesive containing label stock and adhesive label.

Films having enhanced sealing characteristics and packages containing same

Films containing a sealant layer composition comprising: (1) polyethylene homopolymer, and ethylene/alpha-olefin copolymer, ethylene vinyl acetate copolymer, and ethylene/acrylate copolymer; and (2) elastomer, plastomer, ionomer, and carboxyl-modified polyethylene; when sealed to another outer film layer comprising at least one member selected from the group consisting of ionomer, ethylene/acid copolymer, ethylene/vinyl acetate copolymer and ethylene/acrylate copolymer, have been discovered to provide a seal strength comparable to an ionomer to ionomer seal.

High-viscosity elastomeric adhesive composition

High-viscosity elastomeric adhesive compositions including a high softening point tackifier resin in combination with a base polymer can be used to create elastomeric composite laminates having effective adhesion and elastic properties. The elastomeric adhesive compositions suitably have a viscosity between about 100,000 and about 500,000 cps at between about 300 degrees Fahrenheit (149 degrees Celsius) and about 350 degrees Fahrenheit (177 degrees Celsius). Facing layers, such as nonwoven webs, films, elastic strands, fastening material, absorbent material, and the like, can be laminated to one or both surfaces of the elastomeric compositions to form elastomeric composite laminates. A method of making such compositions and laminates involves forming the compositions into elastomeric adhesive films and/or strands.