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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Применить Всего найдено 3. Отображено 3.
02-05-2023 дата публикации

Three-dimensional chip packaging structure, chip packaging method, chip and electronic equipment

Номер: CN116053245A
Автор: DU SHUAN, HAN YANAN, LIN SHAOFANG, YANG GUANGLIN, MENG FANXIAO
Принадлежит:

The embodiment of the invention discloses a three-dimensional chip packaging structure, a chip packaging method, a chip and electronic equipment, relates to the technical field of integrated circuit packaging, is used for high-bandwidth interconnection communication between crystal grains, and aims to reduce the cost and improve the density and the performance of a chip transistor in a unit packaging area. The three-dimensional chip packaging structure comprises a first packaging substrate, a second packaging substrate and at least two chip structures, and the first packaging substrate comprises a first interconnection layer; the second packaging substrate is arranged in the cavity on the first interconnection layer and comprises a second interconnection layer, and a dielectric layer of the second interconnection layer comprises an organic material; each chip structure comprises at least two crystal grains which are stacked and connected up and down, and each chip structure is coupled with ...

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Номер записи: 1
02-05-2023 дата публикации

Semiconductor packaging device and packaging method

Номер: CN116053237A
Автор: DU SHUAN, QIAN XIAOFENG, LIN SHAOFANG, MENG FANXIAO, HAN YANAN
Принадлежит:

The embodiment of the invention discloses a semiconductor packaging device and a packaging method, relates to the technical field of semiconductors, and is convenient for reducing power consumption loss on a power supply link. Comprising a packaging substrate; the packaging substrate is provided with an interconnection wire and a rewiring layer substrate; the rewiring layer substrate is arranged on the packaging substrate; a grain unit; one part of the crystal grain unit is connected to the rewiring layer substrate, and the other part of the crystal grain unit is connected to the packaging substrate; a power supply module; the power supply module is located on the periphery of the crystal grain unit, and the power supply module is electrically connected with the crystal grain unit through the interconnection wire. The method is suitable for packaging scenes of devices such as chips and the like.

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Номер записи: 2
07-04-2023 дата публикации

Reactor control rod and control rod assembly

Номер: CN115938617A
Автор: LIU WEICHAO, LYU ZHIPENG, LIN SHAOFANG, LI CHANGZHENG, ZHANG ANLONG, ZHANG LIBIN, CAO JIN, REN QISEN, NIE LIHONG
Принадлежит:

The invention relates to a reactor control rod and a control rod assembly. The reactor control rod comprises an upper absorption unit, a middle absorption unit and a lower absorption unit which are connected in sequence, the upper absorption unit comprises an upper wrapping shell and an upper absorption body arranged in the upper wrapping shell, the middle absorption unit comprises a middle wrapping shell and a middle absorption body arranged in the middle wrapping shell, and the lower absorption unit comprises a lower wrapping shell and a lower absorption body arranged in the lower wrapping shell; the upper absorber is supported by the middle cladding, and the middle cladding is supported by the lower cladding. The reactor control rod is divided into three units by arranging the middle cladding, the upper absorber is supported by the middle cladding, the lower cladding supports the middle cladding, the pressure stress borne by the lower absorber is reduced, and the extrusion creep borne ...

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Номер записи: 3