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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 6. Отображено 6.
28-06-2012 дата публикации

SUBSTRATE HEAT TREATMENT APPARATUS

Номер: WO2012086012A1
Автор: OKADA Takuji, NAKAZAWA Toshikazu, SUZUKI Naoyuki
Принадлежит:

The present invention provides a substrate heat treatment apparatus, which is capable of reducing breakage of a configuration member due to heat expansion even at a high temperature, and uniformly heating a substrate at a high speed. One embodiment of the present invention is a substrate heat treatment apparatus for heat-treating a substrate, which is provided with: an outer circumferential ring (4), which can support the substrate; a lift apparatus (20), which has a connection ring (6), and brings up and down the outer circumferential ring (4); balls (12), which have heat conductivity lower than that of the outer circumferential ring (4); and a lamp (11), which heats the substrate supported by the outer circumferential ring (4). The balls (12) are members different from both the outer circumferential ring (4) and the connection ring (6). The lift apparatus (20) brings up and down the outer circumferential ring (4) between a first position close to the lamp (11) and a second position far ...

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Номер записи: 1
10-01-2019 дата публикации

PLACING TABLE STRUCTURE AND TREATMENT DEVICE

Номер: WO2019009118A1
Автор: ORIMOTO, Shinji, NAKAGAWASAI, Manabu, MAEDA, Kouji, MIKI, Hiroshi, SUZUKI, Naoyuki
Принадлежит:

The placing table structure according to one embodiment of the present invention has: a refrigeration heat transfer body that is fixedly disposed; a rotatable outer pipe that is disposed around the refrigeration heat transfer body; and a placing table, which is connected to the outer pipe, and is disposed on the upper surface of the refrigeration heat transfer body by having a gap therebetween.

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Номер записи: 2
04-01-2018 дата публикации

SCENT HOLDING MEMBER AND AROMA SUPPLY DEVICE

Номер: WO2018003218A1
Автор: FUJITA, Shuji, SAMUKAWA, Tsunetoshi, NOMOTO, Koya, ISHIGAKI, Yuji, NAKANO, Hideki, TANAKA, Keita, SUZUKI, Naoyuki
Принадлежит:

... [Problem] To provide a scent holding member and an aroma supply device in which the persistence of an aroma can be improved while avoiding an increase in size of the device. [Solution] A scent holding member is provided with a holding space for holding a scent, the holding space being provided in a body, and a first opening and a second opening via which the holding space opens to the outside of the body. The holding space, the first opening, and the second opening constitute an air-flow passage.

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Номер записи: 3
14-06-2018 дата публикации

METHOD FOR FORMING FILM ON SUBSTRATE, AND FILM-FORMING SYSTEM

Номер: WO2018105427A1
Автор: TAKEI Junichi, SUZUKI Naoyuki, MIYASHITA Tetsuya
Принадлежит:

A film-forming system used in a method according to one embodiment of the present invention is provided with a film-forming device and a transfer module. The film-forming device has: a chamber main body that provides a treatment chamber; and a holder that holds a target, said holder being provided in the treatment chamber. The transfer module has: another chamber main body that provides a transfer chamber that can be connected to the treatment chamber; and a transfer device for transferring a substrate. The method includes: a step for transferring the substrate from the transfer chamber to the treatment chamber by means of the transfer device; and a step for discharging particles from the target for the purpose of forming a film on the substrate in a state wherein the transfer device is supporting the substrate and linearly moving the substrate in the treatment chamber.

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Номер записи: 4
09-01-2014 дата публикации

SUBSTRATE PROCESSING EQUIPMENT

Номер: WO2014006804A1
Автор: GOMI, Atsushi, MIYASHITA, Tetsuya, FURUKAWA, Shinji, MAEDA, Koji, HARA, Masamichi, SUZUKI, Naoyuki, MIKI, Hiroshi, HIRATA, Toshiharu
Принадлежит:

The objective of the present invention is to reduce the number of discarded wafers (W) by enabling the processing of substrates to continue without stopping the operation of the equipment when a processing module becomes unusable. The present invention is equipped with a row of wafer transfer mechanisms (3), which receive and hand off wafers (W) in a transfer chamber, and rows of process modules (PMs), which are arranged on the left and the right of this row of wafer transfer mechanisms, and perform processes on the wafers (W). The rows of process modules (PMs) are constructed such that each process in the series of processes can be performed by at least two of the process modules (PMs). Therefore, if one of the process modules (PMs) becomes unusable, the wafers (W) can be transferred quickly to another process module (PM) that performs the same process as the process in question. Accordingly, the processing of the wafers (W) can continue without stopping the operation of the equipment ...

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Номер записи: 5
02-01-2020 дата публикации

SPUTTER DEVICE

Номер: WO2020004104A1
Автор: TAKEI, Junichi, WATANABE, Naoki, SONE, Hiroshi, SUZUKI, Naoyuki
Принадлежит:

The sputter device according to one embodiment of the present invention has: a treatment vessel in which a substrate is housed; a slit plate which is disposed above the substrate inside the treatment vessel so as to be located parallel to a surface of the substrate and which has formed therein an opening that penetrates in the plate-thickness direction; and a heat-receiving plate which is formed of a material having a higher heat resistance than the slit plate and which is placed on top of the slit plate beneath a target material provided at a slant with respect the slit plate.

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Номер записи: 6