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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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22-09-2015 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0009138913B2
Автор: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida, ARAI ALAN Y, CHO GYU C, XU JINGZHOU, YOSHINO FUMIYO, ZHANG HAIBIN, BOVATSEK JAMES, YOSHIDA MAKOTO, ARAI ALAN Y., CHO GYU C.
Принадлежит: IMRA AMERICA, INC., ARAI ALAN Y, CHO GYU C, XU JINGZHOU, YOSHINO FUMIYO, ZHANG HAIBIN, BOVATSEK JAMES, YOSHIDA MAKOTO, IMRA AMERICA INC, ARAI ALAN Y., CHO GYU C.

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

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Номер записи: 1
04-02-2010 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20100025387A1
Автор: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida
Принадлежит: IMRA AMERICA, INC.

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

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Номер записи: 2
05-03-2013 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0008389891B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA America, Inc., BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, IMRA AMERICA INC, ARAI ALAN Y., IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused ...

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Номер записи: 3
05-09-2012 дата публикации

Laser patterning using a structured optical element and focused beam

Номер: CN102656421A
Автор: Alan Y. Arai, Fumiyo Yoshino
Принадлежит:

Various embodiments provide for laser patterning using a structured optical element and a focused beam. In some embodiments a structured optical element may be integrally formed on a single substrate. In some embodiments, multiple optical components may be combined in an optical path to provide a desired pattern. In at least one embodiment, a projection mask is utilized to control exposure of an object to a laser output, in combination with the controlled motion of the projection mask, the controlled motion of the object and the controlled motion of the laser beam. In some embodiments, a projection mask is utilized to control exposure of an object, and the projection mask may absorb, scatter, reflect, or attenuate a laser output. In some embodiments, the projection mask may include optical elements that vary the optical power and polarization of the transmitted laser beam over regions of the projection mask.

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Номер записи: 4
16-11-2017 дата публикации

LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS

Номер: US20170326688A1
Автор: Mark Turner, Alan Y. Arai, Michiharu Ota
Принадлежит:

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements. 1. A liquid-assisted laser-based system for processing a workpiece , the system comprising:a laser source configured to generate a pulsed laser output;a multiple beam generator (MBG) configured to receive the pulsed laser output, said MBG configured such that a plurality of discrete beams are produced at an output thereof;a beam scanner and delivery system configured to deliver and focus said plurality of discrete beams to locations on or within said workpiece;a liquid circulation system configured to circulate a liquid, wherein a portion of said workpiece is in contact with said liquid when said liquid circulation system circulates said liquid; anda controller operatively connected to at least said laser source, said MBG, said liquid circulation system, and said beam scanner and delivery system.2. The liquid-assisted laser-based system of claim 1 , said system comprising a pre-scanner disposed between said laser source and said MBG claim 1 , said pre-scanner arranged to steer said pulsed laser output along a pre-determined path.3. The liquid-assisted laser-based system of claim 2 , wherein said pre-scanner comprises a linear galvanometric scanner or a resonant scanner.4. The liquid-assisted laser-based system of claim 1 , wherein said laser source comprises an ultrashort pulse laser (USP) and wherein said pulsed laser output comprises a laser pulse having a pulse width in the range from about 100 fs to 100 ps.5. The liquid-assisted laser-based system of claim 1 , wherein said ...

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Номер записи: 5
04-02-2014 дата публикации

Femtosecond laser processing system with process parameters controls and feedback

Номер: US0008644356B2
Автор: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter, SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J.
Принадлежит: Imra America, Inc., SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, IMRA AMERICA INC, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J., IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 6
29-09-2015 дата публикации

Femtosecond laser processing system with process parameters controls and feedback

Номер: US0009147989B2
Автор: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter, SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J.
Принадлежит: IMRA AMERICA, INC., IMRA AMERICA INC

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 7
08-04-2010 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20100086741A1
Автор: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA America, Inc.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

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Номер записи: 8
20-11-2012 дата публикации

Methods and systems for laser welding transparent materials with an ultrashort pulsed laser

Номер: US0008314359B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA America, Inc., BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, IMRA AMERICA INC, ARAI ALAN Y., IMRA AMERICA, INC.

Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.

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Номер записи: 9
02-05-2017 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0009636773B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, Bovatsek James, Arai Alan Y., Yoshino Fumiyo
Принадлежит: IMRA AMERICA, INC., IMRA AMERICA INC, IMRA America, Inc.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.

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Номер записи: 10
18-07-2013 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20130183474A1
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
Принадлежит: IMRA America, Inc.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. 1. A method of scribing a transparent material , comprising:using a single pass of a focused beam of ultrashort laser pulses to create a surface groove in said material and at least one modified region within the bulk of said material during motion of said transparent material relative to said focused laser beam,wherein an intensity of said focused beam produces non-linear absorption within a material region, and said ultrashort pulses are generated at a repetition rate sufficiently high such that spatial overlap between said pulses, and interaction between said laser pulses and a modified region, creates at least one additional region of material modification within the material,wherein said surface groove and said at least one modified region are each formed by interaction of said focused beam with said material, said surface groove in said material and said at least one modified region within the bulk being formed along a beam propagation direction, andwherein said surface groove and said at least one modified region are discontinuous and separated in depth.2. The method according to claim 1 , wherein a location of said surface groove and said at least one modified region are separated by a determined distance.3. The method according to claim 1 , wherein said transparent material comprises sapphire.4. A method for scribing a transparent material claim 1 , comprising:using a single pass of a focused beam of ultrashort laser pulses to create a plurality of modified regions within the bulk of said material during motion of said transparent material relative to the focused laser beam, wherein said method comprises ...

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Номер записи: 11
27-11-2018 дата публикации

Laser-based modification of transparent materials

Номер: US0010137527B2
Автор: Michiharu Ota, Alan Y. Arai, Zhenlin Liu, OTA MICHIHARU, ARAI ALAN Y, LIU ZHENLIN, Ota, Michiharu, Arai, Alan Y., Liu, Zhenlin
Принадлежит: IMRA America, Inc., IMRA AMERICA INC

In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

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Номер записи: 12
22-03-2011 дата публикации

Femtosecond laser processing system with process parameters, controls and feedback

Номер: US0007912100B2
Автор: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter, SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J.
Принадлежит: IMRA America, Inc., IMRA AMERICA INC, IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 13
17-02-2009 дата публикации

Pulsed laser processing with controlled thermal and physical alterations

Номер: US0007491909B2
Автор: Tadashi Yamamoto, Donald J. Harter, Rajesh S. Patel, Alan Y. Arai, YAMAMOTO TADASHI, HARTER DONALD J, PATEL RAJESH S, ARAI ALAN Y, HARTER DONALD J., PATEL RAJESH S., ARAI ALAN Y.
Принадлежит: IMRA America, Inc., IMRA AMERICA INC, IMRA AMERICA, INC.

A method for laser machining of material using a burst comprised of laser pulses. The method tailors the pulse width, pulse separation duration, wavelength and polarization of the multiple laser pulses included in a burst to maximize the positive effect of thermal and physical changes achieved by previous pulses that have impinged upon the machined material.

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Номер записи: 14
08-04-2010 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20100084384A1
Автор: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA America, Inc.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused ...

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Номер записи: 15
01-12-2009 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0007626138B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: Imra America, Inc., IMRA AMERICA INC, IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

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Номер записи: 16
03-03-2015 дата публикации

Methods and systems for laser processing of coated substrates

Номер: US0008969220B2
Автор: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu, ARAI ALAN Y, CHO GYU CHEON, XU JINGZHOU, ARAI ALAN Y.
Принадлежит: IMRA America, Inc., IMRA AMERICA INC, IMRA AMERICA, INC.

Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

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Номер записи: 17
16-04-2009 дата публикации

FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS, CONTROLS AND FEEDBACK

Номер: US20090097514A1
Автор: Lawrence SHAH, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter
Принадлежит: IMRA America, Inc.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 18
21-05-2015 дата публикации

METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES

Номер: US20150136744A1
Автор: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu, ARAI ALAN Y, CHO GYU CHEON, XU JINGZHOU, ARAI ALAN Y.
Принадлежит:

Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation. 1. A system for processing a workpiece , the workpiece comprising a substrate and a layer formed on the substrate , the layer having an ablation threshold that is less than an ablation threshold of the substrate , the system comprising:a laser source configured to provide laser pulses having a pulse energy and a wavelength, wherein the substrate is substantially transparent to the laser pulses at the wavelength;a beam delivery system configured to deliver the laser pulses to the workpiece;focusing optics; and (1) intensity of the laser pulses in or near the layer is at or above the ablation threshold of the layer and below the ablation threshold of the substrate, and', '(2) intensity of the laser pulses near a focal spot in the substrate is at or above the ablation threshold of the substrate., 'a controller configured to adjust fluence of the laser pulses and to adjust the focusing optics to provide desired focal conditions of the laser pulses at the layer and at a focal spot inside the substrate such that2. The system of claim 1 , wherein the substrate is substantially transparent to the laser pulses at the wavelength.3. The system of claim 1 , wherein said layer comprises a conductive film.4. The system of claim 3 , wherein said conductive film comprises ITO.5. The system of claim 3 , wherein said conductive film comprises gold.6. The system of claim 3 , further comprising at least one dielectric ...

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Номер записи: 19
05-09-2017 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0009751154B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, Bovatsek James, Arai Alan Y., Yoshino Fumiyo
Принадлежит: IMRA AMERICA, INC., IMRA AMERICA INC

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

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Номер записи: 20
10-05-2016 дата публикации

Apparatus for generating high contrast optical signals, and exemplary applications

Номер: US0009333900B2
Автор: Alan Y. Arai, ARAI ALAN Y, ARAI ALAN Y.
Принадлежит: IMRA AMERICA, INC., IMRA AMERICA INC

A display apparatus generates a high visibility optical signal, such as an ICON, the ICON comprising a symbol, shape, or other image-like representation. The ICON becomes visible at an observation point during an illumination ON-state. The ICON may be formed as a portion of display medium, for example as a machined portion of a mirror capable of forming images of a scene by reflection in normal operation. The visibility of the ICON in the illumination OFF-state from an observation point is sufficiently low such that the normal operation of the display medium is maintained. The display apparatus may be used in a blind spot warning system for a vehicle. Visible wavelength LEDs, RGB LEDs and/or diode lasers may be utilized as an illumination source. Ultrashort laser processing or other methods for material modification may be utilized to form microscopic features which distribute incident light, increasing the visibility of the optical signal at an observation point in an ON-state, with very low visibility in the OFF-state and minimal effect on the image in the display medium in the OFF state.

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Номер записи: 21
10-09-2013 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US0008530786B2
Автор: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA America, Inc., BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, IMRA AMERICA INC, ARAI ALAN Y., IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused ...

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Номер записи: 22
21-01-2010 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20100012631A1
Автор: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
Принадлежит: IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused ...

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Номер записи: 23
03-04-2014 дата публикации

FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS CONTROLS AND FEEDBACK

Номер: US20140092927A1
Автор: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter, SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J.
Принадлежит: IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities. 1. A system , comprising:a source of laser pulses, wherein said laser pulses comprise bursts of composite laser pulses, said composite pulses comprising two or more pulses overlapped in time, or spaced very closely in time, at least one of said two or more pulses comprising an ultrashort pulse, said source comprising at least one fiber amplifier;a controller to control said source; anda beam manipulator to monitor one or more pulse characteristics of said laser pulses and to generate feedback data for said controller,wherein said pulse characteristics comprise an output power, a pulse energy, a pulse width, a wavelength, a repetition rate, a polarization, a temporal delay, a temporal phase, a spatial phase, or a combination thereof,wherein said controller receives signals representative of said one or more pulse characteristics and generates control signals to vary at least one of said pulse characteristics, said controller being networked to at least one computing means via a physical link and/or wireless link.2. The system of claim 1 , wherein at least a portion of said beam manipulator is disposed downstream from said source of pulses claim 1 , and arranged to manipulate laser pulses directed downstream from said source and toward a material processing beam path for application to target material.3. The system of claim 1 , wherein said source is capable of generating output pulses at a variable repetition rate.4. The system of claim 1 , wherein said source comprises a fiber-based chirped ...

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Номер записи: 24
18-04-2013 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20130095260A1
Автор: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
Принадлежит: IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

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Номер записи: 25
02-10-2012 дата публикации

Femtosecond laser processing system with process parameters, controls and feedback

Номер: US0008279903B2
Автор: Lawrence Shah, James M. Bovatsek, Alan Y. Arai, Tadashi Yamamoto, Rajesh S. Patel, Donald J. Harter, SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J.
Принадлежит: Imra America, Inc., SHAH LAWRENCE, BOVATSEK JAMES M, ARAI ALAN Y, YAMAMOTO TADASHI, PATEL RAJESH S, HARTER DONALD J, IMRA AMERICA INC, BOVATSEK JAMES M., ARAI ALAN Y., PATEL RAJESH S., HARTER DONALD J., IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 26
02-01-2014 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20140004318A1
Автор: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino, BOVATSEK JAMES, ARAI ALAN Y, YOSHINO FUMIYO, ARAI ALAN Y.
Принадлежит: IMRA AMERICA, INC.

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. 1. A laser-based method for generating visible patterns of optical defects comprising marks formed below the surface of a transparent material , said patterns having controllable contrast and visibility , said method comprising:forming a plurality of marks at different depths within the material using tightly focused ultrashort pulsed laser outputs, said tightly focused outputs having controllably varied focal points and sufficient fluence so as to create regions of material modification at said different depths below said surface, such that marks at different depths are arranged in such a way as to prevent shadowing where a first mark prevents directional illumination from impinging a second mark, and wherein said marks are sufficiently small and smooth to decrease visibility under ambient light while ...

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Номер записи: 27
18-07-2013 дата публикации

METHODS AND SYSTEMS FOR LASER PROCESSING OF COATED SUBSTRATES

Номер: US20130183837A1
Автор: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu
Принадлежит: IMRA AMERICA, INC.

Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

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Номер записи: 28
03-11-2016 дата публикации

LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS

Номер: US20160318122A1
Автор: Michiharu Ota, Alan Y. Arai, Zhenlin Liu, OTA MICHIHARU, ARAI ALAN Y, LIU ZHENLIN, Ota Michiharu, Arai Alan Y., Liu Zhenlin
Принадлежит:

In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources. 1. A method for laser-based material processing of a material , the method comprising:generating a first series of laser pulses, each pulse of said first series having a pulse width of at least about 1 ns;generating a second series of laser pulses, each pulse of said second series having an ultrashort pulse width;setting a relative temporal spacing between a pulse of said first series with an ultrashort pulse of said second series such that one or more of said ultrashort pulses facilitates depthwise material modification of said material with a combination of said first series of pulses and said second series of laser pulses;focusing and delivering said first series of pulses and said second series of pulses to said material along a common propagation direction,wherein substantially no material modification occurs with said first laser pulse series alone, and substantially more depthwise material modification occurs with said combination of first series and second series than with either individual pulse series.2. The method of claim 1 , wherein said ultrashort ...

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Номер записи: 29
03-01-2013 дата публикации

FEMTOSECOND LASER PROCESSING SYSTEM WITH PROCESS PARAMETERS CONTROLS AND FEEDBACK

Номер: US20130003065A1
Автор: ARAI Alan Y., Bovatsek James M., HARTER Donald J., PATEL RAJESH S., SHAH Lawrence, Yamamoto Tadashi
Принадлежит: IMRA AMERICA, INC.

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities. 1. A system , comprising:a fiber-based source of ultrashort laser pulses, said fiber-based source comprising at least one fiber amplifier;a controller to control said fiber-based source; anda beam manipulator to monitor one or more pulse characteristics of said laser pulses and to generate feedback data for said controller,wherein said pulse characteristics comprise an output power, a pulse energy, a pulse width, a wavelength, a repetition rate, a polarization, a temporal delay, a temporal phase, a spatial phase, or a combination thereof,wherein said controller receives signals representative of said one or more pulse characteristics and generates control signals to vary at least one of said pulse characteristics, said controller being networked to at least one computing means via a physical link and/or wireless link.2. The system of claim 1 , wherein at least a portion of said beam manipulator is disposed downstream from said fiber-based source of ultrashort pulses claim 1 , and arranged to manipulate ultrashort laser pulses directed downstream from said fiber-based source and toward a material processing beam path for application to target material.3. The system of claim 1 , wherein said fiber-based source is capable of generating ultrashort output pulses at a variable repetition rate.4. The system of claim 3 , wherein said repetition rate is variable in the range from 10 kHz to 50 MHz.5. The system of claim 1 , wherein said ultrashort output pulses comprise at least one pulse having a ...

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Номер записи: 30
18-04-2013 дата публикации

APPARATUS FOR HIGH CONTRAST OPTICAL SIGNALING, AND EXEMPLARY APPLICATIONS

Номер: US20130093581A1
Автор: ARAI Alan Y.
Принадлежит: IMRA AMERICA, INC.

A display apparatus generates a high visibility optical signal, such as an ICON, the ICON comprising a symbol, shape, or other image-like representation. The ICON becomes visible at an observation point during an illumination ON-state. The ICON may be formed as a portion of display medium, for example as a machined portion of a mirror capable of forming images of a scene by reflection in normal operation. The visibility of the ICON in the illumination OFF-state from an observation point is sufficiently low such that the normal operation of the display medium is maintained. The display apparatus may be used in a blind spot warning system for a vehicle. Visible wavelength LEDs, RGB LEDs and/or diode lasers may be utilized as an illumination source. Ultrashort laser processing or other methods for material modification may be utilized to form microscopic features which distribute incident light, increasing the visibility of the optical signal at an observation point in an ON-state, with very low visibility in the OFF-state and minimal effect on the image in the display medium in the OFF state. 1. An optical signaling apparatus , comprising:a controllable first source of illumination capable of providing ON and OFF illumination states; andan optical medium arranged to receive illumination from said controllable first source and capable of receiving illumination from a second source, wherein a region of said medium is arranged in such a way that a detectable optical signal is visible therefrom during an illumination ON state of said controllable first source, and wherein said region of said medium is indistinguishable from other parts of the medium during an OFF illumination state of said controllable first source, notwithstanding the arrangement of said region.2. The optical signaling apparatus of claim 1 , wherein said region of said medium forms an image with said illumination from said second source.3. The optical signaling apparatus of claim 1 , wherein said region ...

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Номер записи: 31
10-03-2016 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20160067822A1
Автор: ARAI Alan Y., Bovatsek James, CHO Gyu C., Xu Jingzhou, YOSHIDA Makoto, Yoshino Fumiyo, ZHANG Haibin
Принадлежит: IMRA AMERICA, INC.

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed. 1. A laser-based system for modification of a transparent material , comprising:a pulsed laser apparatus generating a pulsed laser output comprising at least one pulse having a pulse width in the range from about 10 fs to 100 ps;a multifocus beam generator receiving said output, said generator configured to form a plurality of focused beams using said pulsed laser output, each focused beam having a beam waist, said beam waists spaced depthwise relative to said material, at least one beam waist of said plurality of focused beams being within said material and causing modification of said material, said plurality of focused beams comprising different polarizations or different wavelengths generated in different optical paths;a motion system to produce relative movement between said material and said focused beams; anda controller coupled to said pulsed laser apparatus and to said motion system, and controlling said system in such a way that said ...

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Номер записи: 32
06-07-2017 дата публикации

TRANSPARENT MATERIAL PROCESSING WITH AN ULTRASHORT PULSE LASER

Номер: US20170190000A1
Автор: ARAI Alan Y., Bovatsek James, Yoshino Fumiyo
Принадлежит: IMRA AMERICA, INC.

A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. 1. A method of scribing a transparent material , comprising: using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a surface groove in said material and at least one modified region within the bulk of said material.2. A method for scribing a transparent material comprising using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a plurality of modification regions within the bulk of said material in its depth direction.3. A transparent material scribed at two or more locations in a depth direction thereof by a single scan of a focused beam of ultrashort laser pulses.4. The transparent material according to claim 3 , wherein said two or more locations include a surface of said material having a groove formed therein.5. A system for scribing a transparent material claim 3 , comprising: an ultrashort laser source to generate a beam of ultrashort pulses; an optical system to focus and deliver said beam of ultrashort pulses to said material with optical intensity sufficiently high so as to produce non-linear absorption within said material and to modify said material so as to produce scribe features; and a motion system operatively connected to said ultrashort source and said optical system.6. The system according to claim 5 , wherein said scribe features are formed with spatially overlapping ultrashort pulses. This is a divisional of application Ser. No. 13/766,357, filed Feb. 13, 2013, which is a continuation of application Ser. No. 12/580,739, filed Oct. 16, 2009, now issued as U.S. Pat. No. 8,389,891 on Mar. 5, 2013 which is a divisional of ...

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Номер записи: 33
03-02-2009 дата публикации

Femtosecond laser processing system with process parameters, controls and feedback

Номер: US7486705B2
Автор: Alan Y Arai, Donald J. Harter, James M Bovatsek, Lawrence Shah, Rajesh S. Patel, Tadashi Yamamoto
Принадлежит: IMRA America Inc

A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

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Номер записи: 34
17-09-2009 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: WO2009114375A2
Автор: Alan Y. Arai, Fumiyo Yoshino, Gyu C. Cho, Haibin Zhang, James Bovatsek, Jingzhou Xu
Принадлежит: IMRA AMERICA, INC.

Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

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Номер записи: 35
23-07-2015 дата публикации

Laser-based modification of transparent materials

Номер: WO2015108991A2
Автор: Alan Y. Arai, Michiharu Ota, Zhenlin Liu
Принадлежит: IMRA AMERICA, INC.

In certain embodiments a method and system for laser-based material processing of a material is disclosed. In at least one preferred implementation temporally overlapping pulse series are generated with separate pulsed laser sources, for example nanosecond (NS) and ultrashort pulse (USP) sources (NS-USP). Pulses are delivered to the material as a series of spatially and temporally overlapping pulse pairs. The material can, but need not, be a transparent material. In some applications of transparent material processing, it was found the combination of pulses both substantially more material modification and high machining quality than obtainable with either individual pulse series taken alone. Other micromachining methods and arrangement are disclosed for formation of fine features on or within a substrate. Such methods and arrangements may generally be applied with a NS-USP combination, or with other sources.

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Номер записи: 36
18-04-2013 дата публикации

Apparatus for high contrast optical signaling, and exemplary applications

Номер: WO2013055741A1
Автор: Alan Y. Arai
Принадлежит: IMRA AMERICA, INC.

A display apparatus generates a high visibility optical signal, such as an ICON, the ICON comprising a symbol, shape, or other image like representation. The ICON becomes visible at an observation point during an illumination ON-state. The ICON may be formed as a portion of display medium, for example as a machined portion of a mirror capable of forming images of a scene by reflection in normal operation. The visibility of the ICON in the illumination OFF -state from an observation point is sufficiently low such that the normal operation of the display medium is maintained. Ultrashort laser processing or other methods for material modification may be utilized to form microscopic features which distribute incident light, increasing the visibility of the optical signal at an observation point in an ON-state, with very low visibility in the OFFstate and minimal effect on the image in the display medium in the OFF state.

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Номер записи: 37
01-11-2007 дата публикации

Laser material micromachining with green femtosecond pulses

Номер: WO2006079083A3
Автор: Alan Y Arai, Fumiyo Yoshino, James Bovatsek, Lawrence Shah
Принадлежит: Alan Y Arai, Fumiyo Yoshino, IMRA America Inc, James Bovatsek, Lawrence Shah

Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.

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Номер записи: 38
28-09-2006 дата публикации

Laser material micromachining with green femtosecond pulses

Номер: WO2006079083A9
Автор: Alan Y Arai, Fumiyo Yoshino, James Bovatsek, Lawrence Shah
Принадлежит: Alan Y Arai, Fumiyo Yoshino, IMRA America Inc, James Bovatsek, Lawrence Shah

Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.

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Номер записи: 39
04-11-2016 дата публикации

超短パルスレーザでの透明材料処理

Номер: JP2016187835A
Автор: Alan Y Arai, Fumiyo Yoshino, James Michael Bovatsek, マイケル ボヴァツェック ジェームズ, マイケル ボヴァツェック ジェームズ, ヨシノ フミヨ, ワイ． アライ アラン
Принадлежит: IMRA America Inc

【課題】透明材料をスクライビングする方法・システムを提供する。 【解決手段】透明材料をスクライビングするための方法であって、材料の表面溝と材料のバルク内の少なくとも一つの修飾領域とを創るために材料が透明となるレーザ波長を有する超短レーザパルスの集光ビームのシングルパスを使用するステップを有し、集光ビームの強度が、ビームウエストを含む３次元強度分布によって規定される領域内の非線形吸収となり、表面溝及び修飾領域が、それぞれ集光ビームの材料との相互作用によって形成され、材料の表面溝及び修飾領域が、ビーム伝搬方向に沿って形成され、表面溝と修飾領域とが、不連続で深さ方向に離れており、超短レーザパルスのエネルギーと集光ビームの集光幾何学とが、ビームウエストが位置する材料のバルク内だけでなく光学伝搬軸の別のポイントにもアブレーションまたは修飾を同時に起こすための十分な強度があるように選ばれる、方法。 【選択図】図２

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Номер записи: 40