Antenna structure and plasma generating device

An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded.

Spindle motor

Disclosed herein is a spindle motor including: a turn table made of a deformable iron based material; a turn table inner diameter part provided at the center of the turn table, having a hollow part, and including a coupling part formed in an inner peripheral surface thereof; and a shaft inserted into the hollow part of the turn table inner diameter part to thereby contact the coupling part and rotate in an axial direction.

PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. 1. A printed circuit board (PCB) comprising:a body resin layer having lower and upper surfaces;a wire pattern on or in one of the upper and lower surfaces of the body resin layer;at least one through-hole contact extending from the wire pattern through the body resin layer; and if the solder ball land is on the wire pattern, the bump land is on the at least one through-hole contact, and', 'if the bump land is on the wire pattern, the solder ball land is on the at least one through-hole contact., 'a solder resist on the upper and lower surfaces of the body resin layer, the solder resist defining openings corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a device, wherein'}2. The PCB of claim 1 , wherein if the wire pattern is on the upper surface of the body resin layer claim 1 , the bump land is in the wire pattern claim 1 , and if the wire pattern is on the lower surface of the body resin layer claim 1 , the solder ball land is in the wire pattern.3. The PCB of claim 1 , wherein if the wire pattern is on the lower surface of the body resin layer claim 1 , the at least one through-hole contact ...

SPINDLE MOTOR

Disclosed herein is a spindle motor including: a turn table made of a deformable iron based material; a turn table inner diameter part provided at the center of the turn table, having a hollow part, and including a coupling part formed in an inner peripheral surface thereof; and a shaft inserted into the hollow part of the turn table inner diameter part to thereby contact the coupling part and rotate in an axial direction. 1. A spindle motor comprising:a turn table made of a deformable iron based material;a turn table inner diameter part provided at the center of the turn table, having a hollow part, and including a coupling part formed in an inner peripheral surface thereof; anda shaft inserted into the hollow part of the turn table inner diameter part to thereby contact the coupling part and rotate in an axial direction.2. The spindle motor as set forth in claim 1 , wherein the coupling part has a groove shape or an embossing shape.3. The spindle motor as set forth in claim 1 , wherein the coupling part has an inner diameter that is equal to or smaller than an outer diameter of the shaft.4. The spindle motor as set forth in claim 1 , wherein the coupling part has shapes and sizes that are changed according to a longitudinal position of the turn table inner diameter part.5. The spindle motor as set forth in claim 1 , wherein the shaft has hardness larger than that of the turn table inner diameter part.6. The spindle motor as set forth in claim 1 , wherein the turn table inner diameter part is made of a deformable iron based material claim 1 , and the coupling part formed in the turn table inner diameter part is deformed when the shaft is inserted thereinto.7. The spindle motor as set forth in claim 1 , wherein the shaft is inserted into the turn table inner diameter part claim 1 , and the shaft and the coupling part include a bonding material filled in a space therebetween.8. A spindle motor comprising:a turn table made of a deformable iron based material, having a ...

PRINTED CIRCUIT BOARD HAVING WIRE PATTERN

A printed circuit board (PCB) includes a wire pattern having first and second surfaces facing in opposite directions from each other, the wire pattern including a first region having a first thickness and a second region having a second thickness greater than the first thickness; a core insulation layer on the second surface in the first region, the core insulation layer having a third surface adjacent to the second surface in the first region and a fourth surface facing in an opposite direction from the third surface, the fourth surface being connected to the second surface; and a first protection layer covering a portion of the fourth surface of the core insulation layer and a portion of the second surface in the second region. 1. A printed circuit board (PCB) , comprising:a wire pattern having first and second surfaces facing in opposite directions from each other, the wire pattern including a first region having a first thickness and a second region having a second thickness greater than the first thickness;a core insulation layer on the second surface in the first region, the core insulation layer having a third surface adjacent to the second surface in the first region and a fourth surface facing in an opposite direction from the third surface, the fourth surface being connected to the second surface; anda first protection layer covering a portion of the fourth surface of the core insulation layer and a portion of the second surface in the second region.2. The PCB as claimed in claim 1 , wherein:the first protection layer includes an opening exposing another portion of the second surface in the second region, anda width of the opening is smaller than a width of the second region.3. The PCB as claimed in claim 2 , further comprising a first external connection terminal on the second surface in the second region claim 2 , the first external connection terminal extending through the opening.4. The PCB as claimed in claim 3 , further comprising a second external ...

ANTENNA STRUCTURE AND PLASMA GENERATING DEVICE

An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded. 1. An antenna structure for plasma generation , comprising:four induction antennas which have the same structure, are connected in parallel with one another, and are disposed to be overlapped,wherein the induction antennas comprises:an external upper section disposed on a first quadrant of a first layer;an internal upper section connected to the external upper section and disposed on a second quadrant of the first layer;an internal lower section connected to the internal upper section and disposed on a third quadrant of a second layer disposed at a lower part of the first layer; andan external lower section connected to the internal lower section and disposed on a fourth quadrant of the second layer,wherein one ends of the external upper sections are supplied with an RF power and the other ends of the external lower sections are grounded.2. The antenna structure of claim 1 , further comprising:an upper branch connecting the other end of the external upper section and one end of the internal upper section;a vertical branch connecting the other end of the internal upper section and one end of the internal lower section; anda lower branch connecting the other end of the internal lower section and one ...

NON-CONTACT MULTI-TRANSFER APPARATUS AND METHOD FOR REMOVING DUST BY USING THE SAME

Disclosed herein is a non-contact multi-transfer apparatus, including: an air module spraying and sucking air to an object to be transferred; a lower housing having an opening corresponding to the air module and mounting the air module thereon; an upper housing engaged with an upper portion of the lower housing and having a connection part on one side of an upper surface thereof; and a transfer guide part provided at both sides or one side of the upper housing or the lower housing for a transfer. 1. A non-contact multi-transfer apparatus , comprising:an air module spraying and sucking air to an object to be transferred;a lower housing having an opening corresponding to the air module and mounting the air module thereon;an upper housing engaged with an upper portion of the lower housing and having a connection part on one side of an upper surface thereof; anda transfer guide part provided at both sides or one side of the upper housing or the lower housing for a transfer.2. The non-contact multi-transfer apparatus as set forth in claim 1 , wherein the air module includes:at least one air outlet spraying the air to the object to be transferred at a tilt angle; andat least one inlet sucking the dust of the object to be transferred,wherein a lower end of the air outlet is provided with an air spraying structure and the air inlet is provided with a sucking part.3. The non-contact multi-transfer apparatus as set forth in claim 2 , wherein the air spraying structure includes a passage inclined at the tilt angle in order to spray the air at the tilt angle.4. The non-contact multi-transfer apparatus as set forth in claim 2 , wherein the air inlet and the air outlet are provided so as to intercross with each other and the air outlet is provided along an edge of the air module.5. The non-contact multi-transfer apparatus as set forth in claim 2 , further comprising:a duct connected to the air inlet and extended to the outside through an inner portion of the connection part; anda ...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

A semiconductor package includes a package substrate, at least one semiconductor chip mounted on the package substrate, and a molding member that surrounds the at least one semiconductor chip. The molding member includes fillers. Each of the fillers includes a core and a coating layer that surrounds the core. The core includes a non-electromagnetic material and the coating layer includes an electromagnetic material. The molding member includes regions respectively have different distributions of the fillers. 1. A semiconductor package comprising:a package substrate;at least one semiconductor chip mounted on the package substrate; and the molding member including fillers,', 'each of the fillers including a core and a coating layer that surrounds the core,', 'the core including a non-electromagnetic material,, 'a molding member that surrounds the at least one semiconductor chip,'} 'the molding member including regions that respectively have different distributions of the fillers.', 'the coating layer including an electromagnetic material, and'}2. The semiconductor package of claim 1 , whereinthe at least one semiconductor chip is electrically connected to the package substrate using solder bumps, andthe fillers in the molding member are placed around each of the solder bumps, with a relatively high distribution in a region between the at least one semiconductor chip and the package substrate among the regions in the molding member.3. The semiconductor package of claim 1 ,wherein the fillers in the molding member are placed in a relatively high distribution at a peripheral region of the at least one semiconductor chip.4. The semiconductor package of claim 1 ,wherein the fillers are spaced apart from the semiconductor chip and placed, in a relatively high distribution, in an upper region of the molding member among the regions in the molding member.5. The semiconductor package of claim 1 , whereinthe fillers in the molding member are configured to be moved in a ...

VEHICLE DOOR COUPLING DEVICE

The present disclosure relates to a vehicle door coupling device, and more specifically, to a vehicle door coupling device for mechanically coupling together a first member having a first hole and a second member having a second hole at a position corresponding to the first hole. The vehicle door coupling device includes: a stopper configured to support the first member; and a shaft including a crossbar configured to support the second member and couple the second member to the first member when the shaft is rotated to a final coupling position, and a hook portion configured to cause the shaft to be caught on the first member in a temporary coupling position, the shaft being connected to support the stopper and the crossbar, wherein the shaft is shaped such that the shaft is inserted into the first hole of the first member and the second hole of the second member and rotatably passes therethrough, and an material for airtight is provided on the shaft to maintain airtightness between the shaft and the first hole of the first member in the final coupling position. 1. A vehicle door coupling device for mechanically coupling together a first member having a first hole inside which an engaging protrusion is provided and a second member having a second hole at a position corresponding to the first hole , the vehicle door coupling device comprising:a shaft shaped to be fitted into the first hole of the first member and the second hole of the second member and rotatably pass therethrough, the shaft extending in a vertical direction;a stopper provided on a side of the shaft and configured to support the first member;a crossbar provided on another side of the shaft and configured such that when the shaft is rotated to a final coupling position, the crossbar fixedly couples the second member to the first member while supporting the second member; anda position maintaining structure provided on the shaft, the position maintaining structure being configured to allow the shaft to ...

Package substrate for semiconductor package, semiconductor package including the same and method of manufacturing the same

A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.

Printed circuit boards having metal layers and semiconductor packages including the same

Printed circuit boards are provided. The printed circuit board includes an insulation layer, an interconnection portion and a metal layer. The insulation layer has a flat plate shape and includes a top surface and a bottom surface. The interconnection portion is disposed on at least one of the top and bottom surfaces of the insulation layer. The interconnection portion includes a plurality of interconnection patterns. The metal layer covers the plurality of interconnection patterns of the interconnection portion. Related semiconductor packages are also provided.

DRIVING CIRCUIT OF DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME

A driving circuit of a display device and a method for driving the same are disclosed. The driving circuit includes a timing controller configured to receive external image data and to output corrected image data by subtracting predetermined compensation data from the received image data, and a data driver configured to generate a data voltage for the image data based on the corrected image data received from the timing controller. 1. A driving circuit of a display device , comprising:a timing controller configured to receive external image data and to output corrected image data by subtracting predetermined compensation data from the received image data; anda data driver configured to generate a data voltage for the image data based on the corrected image data received from the timing controller.2. The driving circuit according to claim 1 , wherein the timing controller comprises:a bit controller configured to determine whether the received external image data satisfies a predetermined reference bit number, to simply output the received external image data, if the number of bits of the image data is equal to the reference bit number, and to adjust the number of bits of the image data to be equal to the reference bit number, if the number of bits of the image data is different from the reference bit number;a register configured to store the compensation data; anda data corrector configured to receive the image data from the bit controller and the compensation data from the register and to generate the corrected image data by subtracting the compensation data from the image data.3. The driving circuit according to claim 2 , wherein if the number of bits of the received external image data is smaller than the reference bit number by k (k is a natural number) claim 2 , the bit controller adds k dummy bits as Least Significant Bits (LSBs) to the image data.4. The driving circuit according to claim 3 , wherein if the number of bits of the received external image data is ...

ANTENNA STRUCTURE AND PLASMA GENERATING DEVICE

An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded. 1. An antenna structure for plasma generation , comprising:two induction antennas which have the same structure, are connected in parallel with one another, and are disposed to be overlapped,wherein the induction antennas comprises:an external upper section disposed over a first quadrant and a second quadrant of a first layer;an internal upper section connected to the external upper section and disposed over a third quadrant and a fourth quadrant of the first layer;an internal lower section connected to the internal upper section and disposed over a first quadrant and a second quadrant of a second layer disposed at a lower part of the first layer; andan external lower section connected to the internal lower section and disposed over a third quadrant and a fourth quadrant of the second layer,wherein one end of the external upper section is supplied with an RF power, and the other end of the external lower section is grounded.2. The antenna structure of claim 1 , further comprising:an upper branch connecting the other end of the external upper section and one end of the internal upper section;a vertical branch connecting the other end of the internal upper section and one end of the internal lower ...

ANTENNA STRUCTURE AND PLASMA GENERATING DEVICE

An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded. 1. A plasma generating device comprising:The plasma generating device isa vacuum container;a dielectric unit disposed at a part of the vacuum container; andan antenna structure for plasma generation disposed on the dielectric unit comprises,wherein the antenna structure includes four induction antennas which have the same structure, are connected in parallel with one another, and are disposed to be overlapped,wherein the induction antennas comprises:an external upper section disposed on a first quadrant of a first layer;an internal upper section connected to the external upper section and disposed on a second quadrant of the first layer;an internal lower section connected to the internal upper section and disposed on a third quadrant of a second layer disposed at a lower part of the first layer; andan external lower section connected to the internal lower section and disposed on a fourth quadrant of the second layer, andwherein one ends of the external upper sections are supplied with an RF power and the other ends of the external lower sections are grounded.2. The plasma generating device of claim 1 , wherein the antenna structure comprises a first antenna structure and a second antenna structure ...

Non-contact substrate transfer turner

Disclosed herein is a non-contact substrate transfer turner capable of performing a transfer and a turn-over of a substrate in a non-contact state. The non-contact substrate transfer turner includes a transfer member moving along a guide rail; a substrate supporting member installed at the transfer member and non-contact supporting a substrate by drag force and lift force; and a power transmitting member providing power to the substrate supporting member to rotate the substrate supporting member.

Method of manufacturing circuit board and semiconductor package

A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.

Semiconductor package

There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package. 1. A stack package , comprising:a first semiconductor package including a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate; anda second semiconductor package stacked on the first semiconductor package, the second semiconductor package including a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate, the first modulus being greater than the second modulus.2. The stack package of claim 1 , wherein the second modulus is within a range of about 1 GPa to about 7 GPa.3. The stack package of claim 1 , wherein the second substrate includes at least one of polyimide and poly ethylene terephthalate.4. The stack package of claim 1 , wherein a glass transition temperature of the second substrate is greater than a glass transition temperature of the first substrate.5. The stack package of claim 1 , wherein a glass transition temperature of the second substrate is greater than or equal to 250 degrees Celsius.6. The stack package of claim 1 , wherein the first semiconductor package further comprises:a first molding member covering the first ...

SEMICONDUCTOR PACKAGE

A semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a second substrate disposed on the first semiconductor chip, a second semiconductor chip disposed on the second substrate, and a mold layer disposed between the first substrate and the second substrate. The second substrate includes a recess formed at an edge, the mold layer fills the recess, and the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate. 1. A semiconductor package , comprising:a first substrate;a first semiconductor chip disposed on the first substrate;a second substrate disposed on the first semiconductor chip, wherein the second substrate includes a recess formed at an edge;a second semiconductor chip disposed on the second substrate; anda mold layer disposed between the first substrate and the second substrate, wherein the mold layer fills the recess,wherein the recess protrudes concavely inward from the edge of the second substrate toward a center of the second substrate.2. The semiconductor package of claim 1 , wherein a level of an uppermost surface of the mold layer in the recess is higher than a level of a bottom surface of the second substrate.3. The semiconductor package of claim 2 , wherein the uppermost surface of the mold layer in the recess is coplanar with an upper surface of the second substrate.4. The semiconductor package of claim 1 , wherein an upper surface of the second substrate comprises a first upper surface that is parallel to a lower surface of the second semiconductor chip claim 1 , and a second upper surface connected to an edge of the first upper surface claim 1 , andwherein the second upper surface of the second substrate is inclined with respect to the first upper surface of the second substrate.5. The semiconductor package of claim 1 , further comprising:a trench formed at the edge of the second substrate, wherein the trench protrudes concavely inward ...

PACKAGE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND METHOD OF MANUFACTURING THE SAME

A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole. 1. A package substrate for a semiconductor package , comprising:a substrate core including a through-hole penetrating the substrate core in a chip mounting region; anda plurality of wiring patterns on a top surface of the substrate core, each of the plurality of wiring patterns including a landing pad and an extension portion connected to the corresponding landing pad, wherein with respect to a top down view, at least some of the landing pads extend toward the through-hole in the chip mounting region and a spacing between adjacent ones of the landing pads decreases as the landing pads get closer to the through-hole.2. The package substrate of claim 1 , wherein first ends of the landing pads adjacent to the through-hole are spaced apart at a first pitch and second ends of the landing pads connected to the corresponding extending portions and opposite to the corresponding first ends are spaced apart at a second pitch greater than the first pitch.3. The package substrate of claim 1 , wherein each of the landing pads comprises a terminal of a respective one of the plurality of wiring patterns.4. The package substrate of claim 1 , wherein the landing pads are radially disposed with respect to the through-hole.5. The package substrate of claim 1 , wherein claim 1 , with respect to a top down view claim 1 , the landing pads are symmetrically ...

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device package-on-package (PoP) includes a first package, a second package, an interposer, a first molding layer, and a second molding layer. The first package includes a first substrate and a first semiconductor chip on the first substrate. The second package is disposed on the first package and includes a second substrate and a second semiconductor chip on the second substrate. The interposer is disposed between the first package and the second package and connects the first package and the second package. A first molding layer fills a space between the first package and the interposer. A second molding layer covers an upper surface of the interposer. 1. A semiconductor device package-on-package (PoP) comprising:a first package including a first substrate and a first semiconductor chip on the first substrate;a second package on the first package, the second package including a second substrate and a second semiconductor chip on the second substrate;an interposer between the first package and the second package, the interposer electrically connecting the first package and the second package;a first molded layer filling a space between the first package and the interposer; anda second molded layer covering an upper surface of the interposer.2. The semiconductor device PoP of claim 1 , wherein the first molded layer and the second molded layer are of the same material.3. The semiconductor device PoP of claim 1 , wherein a thickness of the second molded layer is smaller than a distance between the interposer and the second substrate.4. The semiconductor device PoP of claim 1 , wherein the first substrate includes a trench having a bottom situated within the first substrate claim 1 , andthe first semiconductor chip is mounted on a surface of the first substrate defining the bottom of the trench.5. The semiconductor device PoP of claim 4 , wherein the first package further includes a passive electronic component claim 4 , and the passive electronic ...

Plasma generation apparatus

A plasma generation apparatus includes: a chamber having a chamber lid and defining an airtight reaction region; a susceptor in the chamber; a gas supplier supplying a process gas to the chamber; and a toroidal core vertically disposed with respect to the susceptor through the chamber lid, including: a toroidal ferromagnetic core combined with the chamber, the toroidal ferromagnetic core having a first portion outside the chamber and a second portion inside the chamber, the second portion having an opening portion; a radio frequency (RF) power supply connected to the chamber; an induction coil electrically connected to the RF power supply, the induction coil rolling the first portion; and a matching circuit matching an impedance between the RF power supply and the induction coil.

Apparatus using hybrid coupled plasma

A hybrid coupled plasma type apparatus includes: a chamber having a gas-injecting unit; an electrostatic chuck in the chamber; an insulating plate over the gas-injecting unit; a high frequency generator; an impedance matching circuit connected to the high frequency generator; first and second antennas connected to the impedance matching circuit in parallel, a power of the high frequency generator being supplied to the first and second antennas; an electrode of a plate shape connected to one of the first and second antennas in serial, the power of the high frequency generator being supplied to the electrode; and a power distributor between the high frequency generator and one of the first and second antennas.

Deposition apparatus and deposition method using the same

A deposition apparatus includes a shield member having a lattice shape in a plan view, the lattice shape including short side edges extending along a first direction and long side edges extending along a second direction, the short side edges including first and second short side edges, a bracket member including a first bracket member coupled to the first short side edge, and a second bracket member coupled to the second short side edge, a plurality of anode bars extending along the second direction and stably placed on each of the first bracket member and the second bracket member, and a target member covering the plurality of anode bars. An anode bar of the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, and the anode bar is physically separated from the shield member by the bracket member.

WEC with floats pivoted with 2 degrees of freedom

A wave energy apparatus comprises floating bodies 118 which are connected together by a connection unit 101 which has two pivoted shafts 105, 106 to allow relative movement in 2 directions. The relative movement actuates hydraulic pumps 108 to supply fluid for electricity generation. The bodies may contain variable liquid column oscillators (figures 4-6) to enhance oscillation and hence power generation efficiency.

Plasma processing apparatus

Disclosed is an inductively coupled plasma processing apparatus which has a very-high-frequency parallel antenna producing inductively-coupled plasma for a large substrate. This plasma processing apparatus includes a very high frequency power source in order to generate the high dense plasma, and parallel-connected antenna units that receive the very high frequency power from the very high frequency source. The very high frequency power has a frequency of 20 MHz to 300 MHz. According to present invention, while the plasma density can be raised, the electron temperature can be lowered. Thus, when the dry etch process is conducted using CF x , the CF x /F ratio can be adjusted to have the low density of fluorine radical. And also, it is possible to have the high radical density of CF 2 , CF 3 and the like. As a result, the proper radical ratio, which is relative to increase selection ratio, enhances the dry etch process excellently.

パッケージオンパッケージ装置の製造方法及びこれによって製造された装置

【課題】歪みの問題を改善すると同時に厚さを薄くすることができるパッケージオンパッケージ装置の製造方法及びこれによって製造された装置を提供する。 【解決手段】本発明におけるパッケージオンパッケージ装置の製造方法は、下部パッケージ基板上に下部半導体チップをフリップチップボンディング方式によって実装する段階と、前記下部半導体チップの少なくとも側面を覆い、前記下部パッケージ基板を覆う下部モールディング膜を形成する段階と、グラインディング工程を実施して前記下部モールディング膜の上部と前記下部半導体チップの上部とを除去する段階を含む下部半導体パッケージを製造する段階と、前記下部半導体パッケージ上に上部半導体パッケージを実装する段階と、を含む。本発明の方法によれば、モールディング膜形成工程の後にグラインディング工程を実施することで、半導体パッケージ全体の厚さを減少させると同時に歪み問題を改善することができる。 【選択図】図１

Magazine supporting equipment and semiconductor manufacturing apparatus including the same

The present disclosure provides a magazine supporting equipment for supporting a magazine with multiple input ports. The magazine supporting equipment comprises a contact plate, a first sidewall plate, and a second sidewall plate. The contact plate is in contact with the magazine. The first sidewall plate extends vertically from one end of the contact plate. The second sidewall plate parallel is to the first sidewall plate and extends vertically from one end to the other end of the contact plate. The first sidewall plate extends along at least a part of a first sidewall of the magazine. The second sidewall plate extends along at least a part of a second sidewall of the magazine. The first sidewall plate and the second sidewall plate include control openings through which gas flows in and out.

Semiconductor package including landing pads extending at an oblique angle toward a through-hole in the package substrate

A semiconductor package includes a package substrate including at least one through-hole in a chip mounting region, a plurality of wiring patterns at a top surface of the package substrate. The wiring patterns include respective extension portions and respective landing pads. At least some of the landing pads obliquely extend toward the through-hole. Conductive bumps are formed on corresponding landing pads to connect to a semiconductor chip mounted on the chip mounting region of the package substrate. A molding material extends between the top surface of the package substrate and the semiconductor chip and fills the through-hole.

Vehicle door coupling device

The present disclosure relates to a vehicle door coupling device, and more specifically, to a vehicle door coupling device for mechanically coupling together a first member having a first hole and a second member having a second hole at a position corresponding to the first hole. The vehicle door coupling device includes: a stopper configured to support the first member; and a shaft including a crossbar configured to support the second member and couple the second member to the first member when the shaft is rotated to a final coupling position, and a hook portion configured to cause the shaft to be caught on the first member in a temporary coupling position, the shaft being connected to support the stopper and the crossbar, wherein the shaft is shaped such that the shaft is inserted into the first hole of the first member and the second hole of the second member and rotatably passes therethrough, and an material for airtight is provided on the shaft to maintain airtightness between the shaft and the first hole of the first member in the final coupling position.

Molding apparatus for fabricating semiconductor package and molding method of semiconductor package

A molding apparatus for fabricating a semiconductor package includes an upper mold including an upper cavity, a first side cavity at a first side of the upper cavity, a second side cavity formed at an opposite second side of the upper cavity, and a first driving part connected to the first side cavity and configured to move the first side cavity in a first direction, and a bottom mold including a bottom cavity configured to receive a molding target including a package substrate and at least one semiconductor chip. A width in the first direction between the first side cavity and the second side cavity may be smaller than a width of the package substrate in the first direction and greater than a width in the first direction between a first boundary and a second boundary of the at least one semiconductor chip.

Coupling apparatus for car door

A coupling apparatus for a car door mechanically couples a first member having a first hole to a second member having a second hole at a position corresponding to the first hole. The coupling apparatus includes a stop portion configured to support the first member, a crossbar configured to support the second member and couple the second member to the first member when rotated to a final coupling position, and a shaft configured to support the stop portion and the crossbar and including a hook portion configured to hook the shaft to the first member at a temporary coupling position. The shaft is shaped to enter and rotatably pass through the first and second holes of the first and second members. The shaft is provided with an airtight member to maintain airtightness between the shaft and the first hole of the first member at the final coupling position.

Semiconductor package

There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

ディスク駆動モーター

【課題】ディスクの回転方向と反対の方向に形成された溝部がディスク回転の際に内部空気を外部に排出して圧力差による吸入力を発生させることで、ディスクの振動現象を防止する簡単な構造のディスク駆動モーターを提供する。 【解決手段】駆動部によって回転駆動され、上面にディスクが搭載されるターンテーブル；及び前記ターンテーブルの上部に付着されて前記ディスクを支持し、前記ディスクの回転方向と反対の方向に斜めに形成された溝部が形成された支持部材；を含む。 【選択図】図４

Semiconductor package

There is provided a semiconductor package capable of preventing damage to an interposer to improve reliability. The semiconductor package includes a first substrate including a first insulating layer and first conductive patterns, an interposer disposed on a top surface of the first substrate and including a second insulating layer and second conductive patterns, first connecting members in contact with the top surface of the first substrate and a bottom surface of the interposer, and supporting members including solder parts, which are in contact with the top surface of the first substrate and the bottom surface of the interposer, and core parts, which are disposed in the solder parts and include a different material from the solder parts. The first connecting members electrically connect the first conductive patterns and the second conductive patterns, and the supporting members do not electrically connect the first conductive patterns and the second conductive patterns.

Kopplungsvorrichtung für eine Autotür

Eine Kopplungsvorrichtung (1) für eine Autotür koppelt mechanisch ein erstes Element (500) mit einem ersten Loch (501) an ein zweites Element (600) mit einem zweiten Loch (601) an einer mit dem ersten Loch (501) korrespondierenden Position. Die Kopplungsvorrichtung (1) weist auf einen Anschlagabschnitt (300), der so konfiguriert ist, dass er das erste Element (500) stützt, eine Querstange (400), die so konfiguriert ist, dass sie das zweite Element (600) stützt und das zweite Element (600) mit dem ersten Element (500) verbindet, wenn diese in eine endgültige Kopplungsposition gedreht wird, und eine Welle (200), die so konfiguriert ist, dass sie den Anschlagabschnitt (300) und die Querstange (400) stützt, und einen Hakenteil aufweist, der so konfiguriert ist, dass er die Welle (200) in einer vorübergehenden Kopplungsposition am ersten Element einhakt. Die Welle (200) ist so geformt, dass sie in das erste und das zweite Loch (501, 601) des ersten und des zweiten Elements (500, 600) eintritt und drehbar hindurchgeführt wird. Die Welle (200) ist mit einem luftdichten Element versehen, um die Luftdichtheit zwischen der Welle (200) und dem ersten Loch (501) des ersten Elements (500) in der endgültigen Kopplungsposition zu gewährleisten.

Semiconductor package aligning interposer and substrate

A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.

Deposition apparatus and deposition method using the same

A deposition apparatus includes a shield member having a lattice shape in a plan view, the lattice shape including short side edges extending along a first direction and long side edges extending along a second direction, the short side edges including first and second short side edges, a bracket member including a first bracket member coupled to the first short side edge, and a second bracket member coupled to the second short side edge, a plurality of anode bars extending along the second direction and stably placed on each of the first bracket member and the second bracket member, and a target member covering the plurality of anode bars. An anode bar of the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, and the anode bar is physically separated from the shield member by the bracket member.

Semiconductor package with a molding member

Deposition apparatus and deposition method using the same

A deposition apparatus includes a shield member having a lattice shape in a plan view, the lattice shape including short side edges extending along a first direction and long side edges extending along a second direction, the short side edges including first and second short side edges, a bracket member including a first bracket member coupled to the first short side edge, and a second bracket member coupled to the second short side edge, a plurality of anode bars extending along the second direction and stably placed on each of the first bracket member and the second bracket member, and a target member covering the plurality of anode bars. An anode bar of the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, and the anode bar is physically separated from the shield member by the bracket member.

Vehicle door coupling device

Driving circuit of display device for compensating image data and method for driving the same

A driving circuit of a display device and a method for driving the same are disclosed. The driving circuit includes a timing controller configured to receive external image data and to output corrected image data by subtracting predetermined compensation data from the received image data, and a data driver configured to generate a data voltage for the image data based on the corrected image data received from the timing controller.