ELECTRONIC COMPONENT INSPECTION APPARATUS AND ELECTRONIC COMPONENT MOUNTING APPARATUS USING THE SAME

An electronic component mounting apparatus includes: a transfer unit picking up an upper surface of a light emitting device package having a front surface on which a light emitting diode chip is disposed, and transferring the light emitting device package to a printed circuit board, a light source unit disposed on a transfer path of the light emitting device package, and irradiating measurement light onto the front surface of the light emitting device package, a camera capturing an image of the light emitting device package to which the measurement light is irradiated, and a control unit image-processing the image to identify excitation light, emitted when the measurement light is excited from the light emitting diode chip, in the image, and controlling the transfer unit to mount the light emitting device package on the printed circuit board when identifying the excitation light.