COATED AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF

30-06-2004 дата публикации

Номер:

AU2003298904A1

Автор: GRIEGO THOMAS P, THOMAS, P. GRIEGO

Принадлежит: Surfect Technologies Inc

Контакты:

Номер заявки: 89-29-200304

Дата заявки: 05-12-2003

[1]

(19)AUSTRALIAN PATENT OFFICE(54) Title COAI bD AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF(21) Application No: 2003298904 (22) Application Date: 2003.12.05 (87) WIPONo: WO04/052547 (30) Priority Data (31) Number (32) Date 60/431,315 2002.12.05 60/447,175 2003.02.12 60/519,813 2003.11.12 (33) Country US USus(43) Publication Date : 2004.06.30 (43) Publication Journal Date : 2004.08.05 (71) Applicant(s) SURFECT IbCHNOLOGIES, INC.(72)Inventor(s)GRIEGO, Thomas, P. (H) Application No_AU2003298904 A1(19)AUSTRALIAN PATENT OFFICE(54) Title COAI bD AND MAGNETIC PARTICLES AND APPLICATIONS THEREOF(21) Application No: 2003298904 (22) Application Date: 2003.12.05 (87) WIPONo: WO04/052547 (30) Priority Data (31) Number (32) Date 60/431,315 2002.12.05 60/447,175 2003.02.12 60/519,813 2003.11.12 (33) Country US USus(43) Publication Date : 2004.06.30 (43) Publication Journal Date : 2004.08.05 (71) Applicant(s) SURFECT IbCHNOLOGIES, INC.(72)Inventor(s)GRIEGO, Thomas, P.

[2]

A method of using coated and/or magnetic particles to deposit structures including solder joints, bumps, vias, bond rings, and the like. The particles may be coated with a solderable material. For solder joints, after reflow the solder material may comprise unmelted particles in a matrix, thereby increasing the strength of the joint and decreasing the pitch of an array of joints. The particle and coating may form a higher melting point alloy, permitting multiple subsequent reflow steps. The particles and/or the coating may be magnetic. External magnetic fields may be applied during deposition to precisely control the particle loading and deposition location. Elements with incompatible electropotentials may thereby be electrodeposited in a single step. Using such fields permits the fill of high aspect ratio structures such as vias without requiring complete seed metallization of the structure. Also, a catalyst consisting of a magnetic particle coated with a catalytic material, optionally including an intermediate layer.

CLAIMS What is claimed is: 1. A method of making a solder joint, the method comprising the steps of: depositing particles comprising at least one coating on a substrate; and reflowing the particles to at least partially melt the coating, thereby forming a substantially continuous solidified solder material.

2. The method of claim 1 wherein the depositing step comprises depositing via a process selected from the group consisting of electrodeposition, electrophoresis, electroplating, evaporation, screen printing, and photostencil bumping.

3. The method of claim 1 wherein the depositing step comprises blending the particles into a paste or ink.

4. The method of claim 1 wherein the depositing step comprises electrodepositing in one deposition step at least two materials with incompatible electropotentials.

5. The method of claim 1 wherein the solder material comprises unmelted particles in a solidified matrix.

6. The method of claim 5 wherein the unmelted particles increase at least one strength of the solder material.

7. The method of claim 6 wherein the strength is selected from the group consisting of shear strength and compressive strength.

8. The method of claim 6 wherein the solder material is reinforced by the unmelted particles.

9. The method of claim 1 wherein the reflowing step comprises forming an alloy.

10. The method of claim 9 wherein the reflowing step comprises forming an alloy which comprises substantially all of the coating of the particles.

11. The method of claim 10 wherein the alloy has a substantially higher melting temperature than the coating.

12. The method of claim 9 wherein the solder material contains a substantially uniform distribution of stoichiometries.

13. The method of claim 12 wherein the solder material is substantially uniform in composition.

14. The method of claim 1 wherein the depositing step comprises controlling a concentration of the particles, thereby reducing a size of the solder joint in directions parallel to the substrate surface.

15. The method of claim 14 further comprising the step of decreasing the pitch of solder joints on the substrate.

16. The method of claim 1 wherein the particles are magnetic.

17. The method of claim 16 wherein the depositing step comprises controlling a particle loading with at least one external magnetic field.

18. The method of claim 16 wherein the depositing step comprises controlling a deposition location with at least one external magnetic field.

19. The method of claim 16 wherein the reflowing step comprises controlling a particle distribution in the solder joint with at least one external magnetic field.

20. A solder material comprising particles that were coated before being deposited on a substrate.

21. A method of co-depositing particles comprising the steps of: suspending the particles in a suspension; applying at least one magnetic field to the particles; co-depositing the particles along with at least one component of the suspension; and forming a desired structure.

22. The method of claim 21 wherein the applying step comprises controlling at least one deposition location of the particles.

23. The method of claim 21 wherein the applying step comprises controlling a particle loading.

24. The method of claim 21 wherein the particles are magnetic.

25. The method of claim 22 wherein the particles have been coated with at least one coating.

26. The method of claim 25 wherein the coating is magnetic.

27. The method of claim 21 wherein the suspending step comprises suspending the particles in an electrolytic solution.

28. The method of claim 27 wherein the co-depositing step comprises co-depositing in one deposition step at least two materials with incompatible electropotentials.

29. The method of claim 21 wherein the suspending step comprises suspending the particles in an ink or paste.

30. The method of claim 22 wherein the forming step comprises filling a via.

31. The method of claim 30 wherein the forming step comprises accelerating a fill rate by controlling particle loading.

32. The method of claim 30 wherein the forming step further comprises controlling the particle location with at least one external magnetic field, thereby permitting fill electrodeposition within the via without the presence of prior seed metallization of an entire surface of the via.

33. A method of making a via comprising the steps of: providing seed metallization to only a portion of a surface of the via; filling the via with a material comprising conducting particles.

34. A via comprising a seed metallization layer only partially coating a surface of the via.

35. A catalyst comprising a magnetic particle coated with at least one catalytic material.

36. An electrode comprising at least one surface layer deposited using the catalyst of claim 35.

37. The catalyst of claim 35 further comprising a first coating of the particle, wherein said first coating comprises a stable barrier to prevent diffusion of elements comprising the particle into the catalytic material.

CPC - классификация

B B2 B22 B22F B22F2 B22F29 B22F299 B22F2998 B22F2998/B22F2998/0 B22F2998/00 B22F2999 B22F2999/B22F2999/0 B22F2999/00 B23 B23K B23K3 B23K35 B23K35/B23K35/0 B23K35/02 B23K35/024 B23K35/0244 C C2 C25 C25D C25D1 C25D15 C25D15/C25D15/0 C25D15/00 C25D15/02 C25D7 C25D7/C25D7/1 C25D7/12 C25D7/123 H H0 H01 H01F H01F4 H01F41 H01F41/H01F41/1 H01F41/16 H01F41/2 H01F41/20 H01F41/26 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/288 H01L21/2885 H01L21/7 H01L21/76 H01L21/768 H01L21/7687 H01L21/76877 H01L21/7689 H01L21/76898 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/05 H01L2224/055 H01L2224/0556 H01L2224/05568 H01L2224/0557 H01L2224/05571 H01L2224/05573 H01L2224/1 H01L2224/11 H01L2224/113 H01L2224/1132 H01L2224/1133 H01L2224/11334 H01L2224/114 H01L2224/1147 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13009 H01L2224/1309 H01L2224/13099 H01L2224/16 H01L24 H01L24/H01L24/1 H01L24/11 H01L24/12 H01L24/13 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/01 H01L2924/010 H01L2924/0100 H01L2924/01005 H01L2924/01006 H01L2924/0101 H01L2924/01012 H01L2924/01013 H01L2924/0102 H01L2924/01027 H01L2924/01029 H01L2924/0103 H01L2924/01033 H01L2924/0104 H01L2924/01044 H01L2924/01046 H01L2924/01047 H01L2924/0105 H01L2924/01056 H01L2924/0106 H01L2924/0107 H01L2924/01078 H01L2924/01079 H01L2924/0108 H01L2924/01082 H01L2924/013 H01L2924/0132 H01L2924/01322 H01L2924/01327 H01L2924/014 H01L2924/09 H01L2924/097 H01L2924/0970 H01L2924/09701 H01L2924/1 H01L2924/14 H01L2924/143 H01L2924/1433 H01L2924/15 H01L2924/157 H01L2924/1578 H01L2924/15787 H01L2924/19 H01L2924/190 H01L2924/1904 H01L2924/19041 H01L2924/19042 H01L2924/19043 H01L2924/3 H01L2924/30 H01L2924/301 H01L2924/3010 H01L2924/30107 H05 H05K H05K2 H05K22 H05K220 H05K2201 H05K2201/H05K2201/0 H05K2201/02 H05K2201/021 H05K2201/0215 H05K2201/0218 H05K2201/08 H05K2201/083 H05K2201/09 H05K2201/095 H05K2201/0957 H05K2201/09572 H05K2203 H05K2203/H05K2203/0 H05K2203/04 H05K2203/042 H05K2203/0425 H05K2203/043 H05K2203/1 H05K2203/10 H05K2203/104 H05K3 H05K3/H05K3/3 H05K3/34 H05K3/347 H05K3/3473 H05K3/348 H05K3/3485 Y Y1 Y10 Y10T Y10T4 Y10T42 Y10T428 Y10T428/Y10T428/1 Y10T428/12 Y10T428/120 Y10T428/1206 Y10T428/12063

IPC - классификация

B B2 B23 B23K B23K3 B23K35 B23K35/B23K35/0 B23K35/02 C C2 C25 C25D C25D1 C25D17 C25D17/C25D17/1 C25D17/16 C25D7 C25D7/C25D7/1 C25D7/12 H H0 H01 H01F H01F4 H01F41 H01F41/H01F41/1 H01F41/16 H01F41/2 H01F41/20 H01F41/26 H01L H01L2 H01L21 H01L21/H01L21/2 H01L21/28 H01L21/288 H01L21/6 H01L21/60 H01L21/7 H01L21/76 H01L21/768 H01L23 H01L23/H01L23/4 H01L23/48 H01L23/485 H05 H05K H05K3 H05K3/H05K3/3 H05K3/34