METHOD OF MANUFACTURING FLEXIBLE DISPLAY PANEL AND METHOD OF MANUFACTURING FLEXIBLE DISPLAY APPARATUS

In hereinafter, manufacturing method of a flexible display device of the present invention appends the drawing in reference to. rapidly and to reduce a memory.

Embodiment 1e also to 1a also and has an:an flexible substrate on an adhesive layer has a first their cross-sectional drawing to explain the.

Also refers to surface 1e also to 1a, carrier substrate (10) provides. Said carrier substrate (10) on flexible substrate (100) are laminated. Said flexible substrate (100) on an adhesive layer (200) is formed on. Said carrier substrate (10) and said flexible substrate (100) separating the.

Said carrier substrate (10) can be a glass substrate.

Said flexible substrate (100) can be a plastic substrate.

As examples of said plastic substrate, cap tone (kapton), polyether sulfone (polyethersulphone; PES), polycarbonate (polycarbonate; PC), polyimide (polyimide; PI), polyethylene terephthalate (polyethyleneterephthalate; PET), polyethylene naphthalate (Polyethylenenaphthalate; PEN), polyarylate (polyacrylate; PAR) and fiber-reinforced plastic (fiber reinforced plastic; FRP) may include a.

For example, said polyimide flexible substrate (polyimide; PI) may comprise an.

Said flexible substrate (100) may be formed as a. For example, said flexible substrate (100) 200um to 5um the thickness of the material may have a range of.

Said flexible substrate (100) when less than thickness of 5um, said flexible substrate (100) is strength of it is difficult to support display element and the like. Said flexible substrate (100) when higher than 200um thickness of, in is thickened is too thickness, a flexible substrate it is difficult to layer.

Said adhesive layer (200) the flexible substrate (100) on the deposition chamber is maintained at the inorganic material form.

For example, a sputtering (sputtering) process said inorganic material, atomic layer deposition (atomic layer deposition) process, deposition molecular (molecular layer deposition) process or chemical vapor deposition (chemical vapor deposition) .can be deposited in the process.

Said adhesive layer (200) may include a inorganic oxide.

Said inorganic oxide can be a silicon oxide. For example, said inorganic oxide silicon dioxide (SiO₂) can be.

Said inorganic oxide can be a metal oxide. For example, aluminum oxide (Aluminium oxide), gallium oxide (Gallium oxide), zinc oxide (Znic oxide), titanium oxide (Titanium dioxide), indium oxide (Indium Oxide), indium tin oxide (Indium Tin oxide; ITO), indium zinc oxide (Indium Zinc oxide; IZO) and a gallium indium zinc oxide (GaInZn oxide; GIZO) can be.

Said process condition of a publicly known inorganic material be easily deposited through a can be.

For example, said inorganic material which may be silicon atom (Si), deposition process of oxygen during (O₂) with given at the same time the thermal oxidizer via a (thermal oxidation) said adhesive layer (200) capable of forming a.. alternatively, a silane inorganic material said (silane; SiH₄), this ammonium thread column (dichlorosilane; SiH₂ Cl₂) which combination of the conductor, deposition process of oxygen during (O₂) or nitrogen oxide, (N₂ O) the given at the same time and the like can be vapor deposition.

Said adhesive layer (200) is the inorganic oxide including said flexible substrate (100) and drop upper plate.

Said adhesive layer (200) can be the surface of the hydrophilic (hydrophilic). For example, said adhesive layer (200) the surface of the hydroxy group (-OH) may comprise an.

said said hydroxy group (-OH) included in the adhesive layer chemically (Si) silicon atom can be and a locking unit. Alternatively, the hydroxy group (-OH) said adhesive layer included in said chemically (M) metal atoms can be and a locking unit.

The ratio of hydroxy group said said adhesive layer (200) separated in water molecules (H₂ O) or hydrogen molecule (H₂) by adjusting the concentration of the, can be proportion of side polymers may be adjusted the same.

Said adhesive layer (200) the adhesive layer (200) for reforming the surface of, said hydroxy group (-OH) on the surface can be a.

Said adhesive layer (200) surface to a hydrogenation treatment, said can be hydroxy group. Said inorganic oxide surface of oxygen atoms included in hydrogen is added to the hydroxy group can be.

Said adhesive layer (200) method of using publicly known modifation surface of and the opening can be. For example, acid treatment or base reduction process by chemical-mechanical polishing, plasma processing modified by various modified process, or the like. formed method. For example, silicon dioxide formed is deposited said adhesive layer (200) sulfate a peptide which specifically binds to the mixed solution of and hydrogen peroxide, said adhesive layer (200) on the surface of said. allow for the formation of a hydroxy group.

For example, said adhesive layer (200) the surface of unit area 1 nm² to one or more 5 hydroxy group. may be included. Alternatively, said adhesive layer (200) the surface of unit area 1 nm² to 1-4 hydroxy group range of. may be included.

For example, said adhesive layer (200) 10 [...][...] to the thickness of the material may have a range of 5000.

Said adhesive layer (200) when [...] thickness of less than 10, said flexible substrate (100) on adhesion sufficient to obtain it is difficult to of forming a coating film. Said adhesive layer (200) when higher than 5000 [...] thickness of, . shaking lithium manganese oxide, method for manufacturing adhesive force of any thickness increase according to.

For example, said adhesive layer (200) can be of surface roughness is 5 nm hereinafter.

Said adhesive layer (200) converter converts a current 5 nm surface roughness of, said adhesive layer (200) the intensity of illumination of the toxic gas removed the reduced and the, heat treatment layer (210) is formed it is difficult to.

Said carrier substrate (10) and said flexible substrate (100) are separated from each other and said adhesive layer (200) said flexible substrate (100) by using the mask pattern.. For example, said carrier substrate (10) and said flexible substrate (100) using tape the and thus separating the mechanical such as. it can be removed through desorption.

Also 2a and 2b and has an an adhesive layer on flexible substrate: an embodiment has a first their cross-sectional drawing to explain the.

Also on flexible substrate 2 according to a method to form adhesion layers in, flexible board and adhesive layer also to 1a also the flexible board and adhesive layer with a configuration of the 1e according to the same bar, sound generating bodies the directions of which constitution: a dispensed described.

Also refers to surface 2b and 2a, flexible substrate (100) on an adhesive layer (200) (roll to roll) the permeablity service system retrieves the can be formed.

For example, number 1 roller (20a) and number 2 roller (20b) the, said number 1 roller (20a) is wrapped around a flexible substrate (100). to solve the. Said flexible substrate (100) on an adhesive layer (200) is formed on. the lead frames support the semiconductor chips, by removing, the unnecessary parts, said adhesive layer (200) said flexible substrate (100) capable of forming a..

One also: an embodiment also 3 to Figure 5 shows a flexible display panel. are an end surface due to explain the manufacturing method. Also 6a and 6b and has an:an embodiment has a first layer heat treatment to explain the cross-sectional drawing their. Also 7a and 7b and has an:an embodiment has a first layer heat treatment to explain the cross-sectional drawing their.

5 also to 1 also refers to surface, glass substrate (300) provides. Said glass substrate (300) top of an adhesive layer (200) a flexible substrate (100) of said adhesive layer (200) are laminated. Said glass substrate (300) heating to a heat treatment layer (210) is formed on.

Said flexible substrate (100) thinned thickness is too in the form of a thin film, thin film transistor, a water forming a display element and the like it is difficult for their development such as thin film process of turn. Furthermore, said flexible substrate (100) a flexible are display element and the like since it is difficult to support.

Therefore, said flexible substrate (100) the process are performed by using thin film on, said flexible substrate (100) for said glass substrate (300) arranged on.

Said glass substrate (300) is a glass substrate, silicon dioxide (SiO₂) includes.

Said glass substrate (300) can be the surface of the hydrophilic (hydrophilic). Said glass substrate (300) the surface of the hydroxy group (-OH) may comprise an. Said initiator hydroxy said glass substrate (300) included in chemically (Si) silicon atom can be and a locking unit.

Said glass substrate (300) top of an adhesive layer (200) a flexible substrate (100) of said adhesive layer (200) are laminated.

Said flexible substrate (100) and said glass substrate (300) the disclosed for bonding a, said adhesive layer (200) the flexible substrate (100) and said glass substrate (300) is arranged between, these is bonded.

Said adhesive layer (200) and said glass substrate (300) heating to a heat treatment layer (210) is formed on. For example, said heat treatment layer (210) the 100 °C to 450 °C heated to a temperature of range of can be.

Said adhesive layer (200) and said glass substrate (300) subjected to an external heat, said adhesive layer (200) surface hydroxy group and said glass substrate (300) .the reaction between the of a hydroxy surface.

6a and 6b also refers to surface, said glass substrate (300) silicon dioxide (SiO₂) includes, said glass substrate (300) coupled to the surface of the silicon (Si) includes a hydroxy group (-OH). Said adhesive layer (200) coupled to the surface of silicon (Si) includes a hydroxy group (-OH).

Said adhesive layer (200) and said glass substrate (300) by heating so that the adhesive layer (200) included hydroxyl time surface of said glass substrate (300) so that the timing hydroxyl included surface of react with one another the two. 2 by the reaction between the hydroxy group by dehydration reaction during the formation of a, . of forming a chemical bond.

Said heat treatment layer (210) the silicon atom (Si), oxygen atoms (O) and silicon atom (Si) is are sequentially coupled into chemical bonding is formed may include a (Si-O-Si). Through the binding chemical, flexible substrate (100) and glass substrate (300) between strong adhesion, method of making the same purpose: an instrument for an endoscope.

Furthermore, said chemically bonded at about 500 °C degree of process temperature is maintain binding.

Said chemical bonded to the outer layer including heat treatment layer (210) by forming a, said adhesive layer (200) and said glass substrate (300) adhesion between the ., can stably.

Also refers to surface 7a and 7b, said glass substrate (300) silicon dioxide (SiO₂) includes, said glass substrate (300) coupled to silver silicon surface of (Si) includes a hydroxy group (-OH). Said adhesive layer (200) coupled to the surface of the metal (M) includes a hydroxy group (-OH).

Said adhesive layer (200) and said glass substrate (300) by heating so that the adhesive layer (200) included hydroxyl time surface of said glass substrate (300) so that the timing hydroxyl included surface of react with one another the two. 2 by the reaction between the hydroxy group by dehydration reaction during the formation of a, . of forming a chemical bond.

Said heat treatment layer (210) the silicon atom (Si), oxygen atoms (O) and metal atoms are sequentially coupled into (M) is chemical bonding is formed may include a (Si-O-M). Through the binding chemical, flexible substrate (100) and glass substrate (300) between strong adhesion, method of making the same purpose: an instrument for an endoscope.

Furthermore, said chemically bonded at about 500 °C degree of process temperature is maintain binding.

Said chemical bonded to the outer layer including heat treatment layer (210) by forming a, said adhesive layer (200) and said glass substrate (300) adhesion between the ., can stably.

One also: an embodiment also 8 to Figure 12 shows a flexible display device of. are an end surface due to explain the manufacturing method.

Also refers to surface 8 and 9, said flexible substrate (100) on display layer (110) is formed on. Said display layer (110) on sealing layer (120) is formed on.

A low cost does not shown, said display layer (110) includes the display device (not shown).

As an example of said display device (not shown), organic light emitting display (organic light emitting diode display; OLED) device, liquid crystal display (liquid crystal display; LCE) element and an electrophoretic display (electrophoretic display; EPD) device coils respectively drive the actuator depending on.

Said display layer (110) is formed on, said display layer (110) that attempt to protect sealing layer (120) capable of forming a..

Said sealing layer (120) organic matter or inorganic materials may be formed as.

A low cost does not shown, said sealing layer (120) a single or may be formed of plural layers, the multilayer said said organic are formed of a material which is an organic layer (not shown) or said inorganic layer is formed to be apart from inorganic layer (not shown) repeatedly can be being extended.

Said organic polymer (polymer) material may comprise an. For example, said polymeric material acrylic resin (acryl resin), an epoxy resin (epoxy resin), such as polyimide (polyimide) and polyethylene (polyethylene) may include a.

Said inorganic material inorganic oxide material may include a. For example, said aluminum oxide inorganic material (aluminium oxide), titanium oxide (titanium oxide), zirconium oxide (zirconium oxide), silicon oxide (silicon oxide), aluminum nitride (aluminium nitride), cellular phone (silicon oxynitride), nitride aluminum oxyhydroxide (aluminium oxynitride), silicon nitride (silicon nitride), zinc oxide (zinc oxide) such as (tantalum oxide) oxide rostrum and tantalum may include a.

Thin film density of a meta-stable moisture or oxygen being predominantly in said inorganic layer is suppressed substrate includes a concave portion. Said inorganic layer through the moisture and oxygen is blocking again by means of an organic layer. The organic layer said said inorganic layer moisture permeability and air permeability and the gap is formed between the substrate a small but preventing effect, each organic layer said reduced stress across the layers that make, flexible display device flexible. maintaining properties required of an IZO sputtering.

In flattening characteristic the organic layer as described above, has said, said sealing layer (120) is when formed formed of plural layers, said sealing layer (120) a flat side to the output face and serving top of penetration hole while moving up and down.

Said sealing layer (120) thickness of the 10 micro m hereinafter may be formed as. Therefore, thickness of flexible display device second thickness can be.

Also refers to surface 10 to 12, after forming a layer sealing said, said flexible substrate (100) and said adhesive layer (200) .may be used to separate.

Also with a 10, said flexible substrate (100) and said adhesive layer (200) by the separating a laser (laser) can be.

A low cost does not shown, said laser light source to the glass substrate (300) can be disposed adjacent to the. Said laser focus of said flexible substrate (100) and said adhesive layer (200) the interface tailored..

Said laser laser said EDF optical system a plasma signal in proportion to the depth (depth of focus: DOF) the flexible substrate (100) and said adhesive layer (200) the interface can be to focus the light.

Said flexible substrate (100) is the absorbent are concentrated on the laser said to. Adjacent a surface of said flexible substrate molecules that can be are degraded. Said laser energy due to said flexible substrate (100) molecules of is dissolved with its said surface of said flexible substrate (100) and said adhesive layer (200) reduces the adhesive force between. Therefore, said flexible substrate (100) and said adhesive layer (200) .can be separated.

For example, a wavelength of 308 nm excimer in said laser can be laser family of (eximer). Moisturizing as excimer laser said can be (Xenon chloride XeCL) chloride. Said moisturizing chloride capable of generating laser light 308 nm..

Also 11 with a, said flexible substrate (100) and glass substrate (300) the flexible substrate (100) and said glass substrate (300) a vacuum compressed to each other by exerting a force in a direction opposite to said flexible substrate (100) and adhering layer (200) it possible to separate mechanically.

Said flexible substrate (100) and said glass substrate (300) for example, such as using tape and thus separating the mechanical through separation of ease of separating the. be.

Said irradiating the film with a laser beam a mechanical separation said alternatively for the separation by said flexible substrate (100) and said adhesive layer (200) (adhesion strength) is bonding strength between a die and 30gf/cm² it is difficult is release or more.

Said adhesive layer (200) in deposition step of, water molecules (H2O) or hydrogen molecule (H2) by adjusting the concentration of the, said adhesive layer (200) surface of modulating the rate of hydroxy group can be. Said adhesive layer (200) the surface of unit area 1 nm² to one or more 5 hydroxy group. may be included. Is performed on the semiconductor substrate including, said flexible substrate (100) and said adhesive layer (200) bonding strength between a die and the (adhesion strength) 30gf/cm² at least.

Therefore, said adhesive layer (200) in deposition step of, said adhesive layer (200) surface of unit area is hydroxy group 1 nm² to 4-1 of so as to contain the can be. the, said flexible substrate (100) and said adhesive layer (200) a bonding strength between a die and 30gf/cm² which can be less than, in this case said mechanical through separation of said flexible substrate (100) and said adhesive layer (200) .may be used to separate.

Alternatively, said flexible substrate (100) and said glass substrate (300) mechanically as well as in the separation of, said adhesive layer (200) for thermally processing layer (210) is disconnected may be.

Thereby, the cold air flows but described reference to embodiment or more, corresponding art patent the following is claimed is a classic mirror server one skilled in the art of the present invention is a concept and region within such a range that causes no away from the present invention various modified and change can be 2000 database for each consumer.