Seal for microelectronic assembly

17-12-2019 дата публикации

Номер:

US10508030B2

Автор: Cyprian Emeka Uzoh, Guilian Gao, Ilyas Mohammed, Liang Wang, Rajesh Katkar, Shaowu HUANG

Принадлежит: Invensas Bonding Technologies Inc

Контакты:

Номер заявки:

Дата заявки:

CPC - классификация

B B8 B81 B81B B81B7 B81B7/B81B7/0 B81B7/00 B81B7/003 B81B7/0032 B81B7/007 B81B7/0074 B81C B81C1 B81C1/B81C1/0 B81C1/00 B81C1/002 B81C1/0026 B81C1/00261 B81C1/00269 B81C1/0029 B81C1/00293 B81C1/003 B81C1/0033 B81C1/00333 B81C2 B81C22 B81C220 B81C2203 B81C2203/B81C2203/0 B81C2203/01 B81C2203/010 B81C2203/0109 B81C2203/011 B81C2203/0118 B81C2203/019 B81C2203/03 B81C2203/035 B81C2203/036 B81C2203/038 H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/0 H01L23/02 H01L23/04 H01L23/05 H01L23/053 H01L23/1 H01L23/10

IPC - классификация

H H0 H01 H01L H01L2 H01L23 H01L23/H01L23/0 H01L23/04 H01L23/05 H01L23/053 H01L23/1 H01L23/10

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