PHOTO-CURABLE RESIN COMPOSITION FOR PRINTING PROCESS

The present invention relates to a photo-curable resin composition for a printing process and more specifically to a photo-curable resin composition comprising a polysilazane compound. The composition according to the invention comprises the polysilazane compound, thereby ensuring an excellent adhesive force to a substrate, heat resistance, durability (against high temperature, high pressure, and high humidity) and lower layer protection property while maintaining high permeability even after high temperature treatment. Therefore, the photo-curable resin composition can be useful in the formation of a fine pattern and a protective layer.