METHOD FOR MANUFACTURING BOTH-FACE COPPER-CLAD LAMINATE SUBSTRATE USING CASTING AND SPUTTERING

The present invention relates to a method for manufacturing a both-face copper-clad laminate substrate, wherein a copper film formed on one surface of a copper-clad laminate substrate is formed using a casting step, and a copper film formed on the other surface thereof is formed by the formation of a Ni/Cr seed layer and a Cu sputtering layer by using a sputtering and a Cu plating step, thereby improving the adhesion of the copper films, and making it possible to easily manufacture a thin copper-clad laminate substrate.