METHOD FOR PACKAGING LOW-K CHIP

24-01-2013 дата публикации

Номер:

WO2013010352A1

Автор: ZHANG, Li, LAI, Zhiming, CHEN, Dong, CHEN, Jinhui

Принадлежит: 江阴长电先进封装有限公司

Контакты:

Номер заявки: CN11-08-201112

Дата заявки: 21-10-2011

[0000]

Provided is a method for packaging a low-k chip, comprising: attaching onto a carrier wafer a layer of temporary strippable film; arranging inversely a chip (2-1) onto the carrier wafer via the temporary strippable film; attaching thin film layer I (2-4) onto the carrier wafer for packaging; bonding a support wafer (2-5) onto the thin film layer I (2-4) and solidifying; forming a reconstructed wafer consisting of the chip (2-1), thin film layer I (2-4), and the support wafer; detaching the reconstructed wafer from the carrier wafer; completing a rewired metal wiring (2-6) on thin film layer I (2-4); forming a metal column (2-7) at an end of the rewired metal wiring (2-6); attaching thin film layer II (2-8) onto a surface of the metal column (2-7), packaging, and solidifying; coating a metal layer (2-9) on the top of the metal column (2-7), forming BGA solder balls (2-10) on the metal layer (2-9) by means of printing or ball planting; and finally slicing into individual BGA packages the reconstructed wafer having formed the BGA solder balls (2-10).

[1]

CPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/5 H01L21/56 H01L21/561 H01L21/568 H01L22 H01L222 H01L2224 H01L2224/H01L2224/0 H01L2224/02 H01L2224/023 H01L2224/0237 H01L2224/02379 H01L2224/03 H01L2224/033 H01L2224/0333 H01L2224/03334 H01L2224/038 H01L2224/0382 H01L2224/039 H01L2224/0391 H01L2224/04 H01L2224/040 H01L2224/0401 H01L2224/041 H01L2224/0410 H01L2224/04105 H01L2224/05 H01L2224/050 H01L2224/0500 H01L2224/05005 H01L2224/055 H01L2224/0554 H01L2224/05541 H01L2224/0555 H01L2224/05558 H01L2224/0556 H01L2224/05569 H01L2224/0557 H01L2224/05572 H01L2224/1 H01L2224/12 H01L2224/121 H01L2224/1210 H01L2224/12105 H01L2224/13 H01L2224/130 H01L2224/1300 H01L2224/13006 H01L2224/1302 H01L2224/13023 H01L2224/131 H01L2224/16 H01L2224/162 H01L2224/1622 H01L2224/16225 H01L2224/3 H01L2224/32 H01L2224/322 H01L2224/3222 H01L2224/32225 H01L2224/7 H01L2224/73 H01L2224/732 H01L2224/7320 H01L2224/73204 H01L2224/8 H01L2224/81 H01L2224/811 H01L2224/8119 H01L2224/81191 H01L2224/818 H01L2224/8181 H01L2224/81815 H01L2224/83 H01L2224/831 H01L2224/8319 H01L2224/83192 H01L2224/9 H01L2224/94 H01L23 H01L23/H01L23/3 H01L23/31 H01L23/310 H01L23/3107 H01L23/4 H01L23/49 H01L23/495 H01L23/4958 H01L23/49582 H01L24 H01L24/H01L24/0 H01L24/03 H01L24/05 H01L24/1 H01L24/11 H01L24/13 H01L24/9 H01L24/95 H01L24/96 H01L29 H01L292 H01L2924 H01L2924/H01L2924/0 H01L2924/00 H01L2924/000 H01L2924/0001 H01L2924/00014 H01L2924/0002 H01L2924/1 H01L2924/12 H01L2924/120 H01L2924/1204 H01L2924/12042 H01L2924/15 H01L2924/153 H01L2924/1531 H01L2924/15311 H01L2924/157 H01L2924/1578 H01L2924/15788

IPC - классификация

H H0 H01 H01L H01L2 H01L21 H01L21/H01L21/4 H01L21/44 H01L21/6 H01L21/60 H01L23 H01L23/H01L23/4 H01L23/48

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