ELECTRONIC DEVICE INCLUDING OUTER HOUSING PLATED WITH CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREFOR

A method for manufacturing an electronic device according to various embodiments disclosed in the present document may comprise: a trench step of forming a trench in a plating area which is at least part of a first surface exposed to the outside of an external housing forming at least part of the external appearance of the electronic device; a first plating step of forming, in the plating area, a first plating layer including a first metal material; a polishing step of polishing the plating area; and a coating step of forming a coating layer on the first surface of the external housing. Various other embodiments are possible.