METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND FILM TO MANUFACTURE PRINTED CIRCUIT BOARD

Provided are a method of manufacturing a printed circuit board (PCB) and a film to prepare the printed circuit board. The method of manufacturing the printed circuit board comprises: a step of preparing plate net and exposure films to which a pattern and a marker are applied in a state which a pattern and the marker to be applied to the PCB are determined respectively; a step of applying the pattern and the marker to a plate net using one of a plurality of films; a step of printing photosensitive solution on the PCB in a pattern using the plate net to which the pattern and the marker are applied; a step of radiating ultraviolet rays to the PCB to apply the pattern formed on an exposure working film to the PCB in a state which the film and the PCB are aligned to a position of the pattern using the marker; a step of immersing a non-patterned copper foil of the PCB exposed to ultraviolet rays in a ferric chloride solution to melt the non-patterned copper foil; and a step of drying the PCB ...