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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 59969. Отображено 100.
05-01-2012 дата публикации

Hybrid laser arc welding process and apparatus

Номер: US20120000892A1
Принадлежит: General Electric Co

A welding method and apparatus for welding workpieces together by conducting a laser beam welding process on a joint region that includes a weld seam defined by and between faying surfaces of the workpieces, and then conducting a hybrid laser arc welding process on the joint region. The laser beam welding process entails causing a first laser beam to travel along the joint region, penetrate the weld seam and form a weldment. The hybrid laser arc welding process remelts the weldment by simultaneously causing an electric arc and a second laser beam to overlap and travel along the joint region and form a weld pool in the weldment. On cooling, a weld joint is formed within the joint region and its weld seam.

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05-01-2012 дата публикации

High Throughput Solar Cell Ablation System

Номер: US20120003788A1
Принадлежит: Individual

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

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28-02-2017 дата публикации

Установка для лазерной обработки кольцевым пучком

Номер: RU0000168922U1

Полезная модель относится к оборудованию для лазерной обработки и может быть использована для изготовления шайб из тугоплавких металлических или изоляционных неметаллических пластин.Техническим результатом полезной модели, совпадающим с задачей, на решение которой она направлена, является повышение производительности установки для лазерной обработки при изготовлении шайб.Технический результат достигается тем, что в установке для лазерной обработки кольцевым пучком, содержащей лазер и расположенные на оси лазерного пучка телескопический преобразователь диаметра лазерного пучка, состоящий из отрицательной линзы и положительной линзы, коническую линзу и фокусирующую линзу, коническая линза выполнена монолитной, состоящей из конуса с углом при его основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внутренний диаметр получаемой в результате обработки шайбы, и усеченного конуса с углом при его большем основании, рассчитываемом по уравнению, связывающему фокусное расстояние фокусирующей линзы, показатель преломления материала конической линзы и внешний диаметр получаемой в результате обработки шайбы, радиус меньшего основания усеченного конуса равен радиусу основания конуса, радиус большего основания усеченного конуса выполняют не менее радиуса пучка лазерного излучения после телескопического преобразователя, который рассчитывают по формуле, связывающей радиус конуса, внешний и внутренний диаметр получаемой шайбы. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 168 922 U1 (51) МПК B23K 26/00 (2014.01) B23K 26/064 (2014.01) B23K 26/073 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016125274, 24.06.2016 (24) Дата начала отсчета срока действия патента: 24.06.2016 (72) Автор(ы): Коваленко Александр Фёдорович (RU) Дата регистрации: 28.02.2017 Приоритет(ы): (22) Дата подачи заявки: 24.06.2016 ...

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24-03-2017 дата публикации

Герметичный корпус

Номер: RU0000169601U1

Полезная модель представляет собой герметичный корпус и может быть использована при изготовлении герметичного ввода лазерного излучения в рабочий объем технологических установок, осуществляющих обработку материалов в вакууме или в среде инертных газов. Стенка герметичного корпуса через прокладку с двухсторонней отбортовкой, выполненную из титана, с обеих сторон которой расположена алюминиевая фольга, соединена по всему периметру с входным окном. Окно выполнено из прозрачного в заданном оптическом диапазоне материала и имеет конусоцилиндросферическую форму, коническая поверхность входного окна обращена навстречу лазерному пучку, а сферическая поверхность - внутрь герметичного корпуса. Техническим результатом является расширение функциональных возможностей корпуса за счет фокусировки лазерного излучения в кольцо. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 169 601 U1 (51) МПК B23K 26/067 (2006.01) H01J 17/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21)(22) Заявка: 2016120886, 27.05.2016 (24) Дата начала отсчета срока действия патента: 27.05.2016 24.03.2017 Приоритет(ы): (22) Дата подачи заявки: 27.05.2016 Адрес для переписки: 101000, Москва, Моспочтамт, а/я 918, ФГУП "ВНИИА", начальнику отдела 36, С.В. Жмайло (56) Список документов, цитированных в отчете о поиске: RU156784U1, 20.11.2015. RU119935U1, 27.08.2012. RU156783U1, 20.11.2015. RU155777U1, 20.10.2015. 1 6 9 6 0 1 (45) Опубликовано: 24.03.2017 Бюл. № 9 (73) Патентообладатель(и): Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт автоматики им. Н.Л. Духова" (ФГУП "ВНИИА") (RU) R U Дата регистрации: (72) Автор(ы): Вышинский Павел Николаевич (RU), Коваленко Александр Фёдорович (RU), Федорищев Олег Николаевич (RU), Осипов Геннадий Станиславович (RU) 1 6 9 6 0 1 R U (57) Формула полезной модели Герметичный корпус с входным окном для ввода лазерного излучения в установку для обработки ...

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11-10-2017 дата публикации

Устройство одновременного сканирования двумя лазерными пучками

Номер: RU0000174390U1

Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими лазерные пучки на всей плоскости ростовой зоны. Технический результат заключается в расширении технологических возможностей обработки и изготовления деталей при обеспечении их высокого качества и точности обработки за счет обеспечения полного перекрытия рабочей зоны. 3 з.п. ф-лы. Ц 1 174390 ко РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) (2 за зао 0 (51) МПК В23К 26/08 (2014.01) СО2В 26/10 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (21)(22) Заявка: 2016144179, 10.11.2016 (24) Дата начала отсчета срока действия патента: 10.11.2016 Дата регистрации: 11.10.2017 Приоритет(ы): (22) Дата подачи заявки: 10.11.2016 (45) Опубликовано: 11.10.2017 Бюл. № 29 Адрес для переписки: 197046, Санкт-Петербург, пр-кт Каменноостровский, 1-3, пом. 30, ООО "Юридическая фирма Городисский и Партнеры" (72) Автор(ы): Орлов Андрей Евгеньевич (КО), Смоленцев Сергей Сергеевич (КО), Тимофеев Владимир Андреевич (КО), Ксенофонтов Алексей Олегович (КП) (73) Патентообладатель(и): Российская Федерация в лице Министерства промышленности и торговли Российской Федерации (Минпромторг России) (КП) (56) Список документов, цитированных в отчете о поиске: У\О 2016128287 А1, 18.08.2016. ГР 2001075039 А, 23.03.2001. 0$ 20040129685 АТ, 08.07.2004. \УО 2013061587 А1, 02.05.2013. (54) УСТРОЙСТВО ОДНОВРЕМЕННОГО СКАНИРОВАНИЯ ДВУМЯ ЛАЗЕРНЫМИ ПУЧКАМИ (57) Реферат: Устройство одновременного сканирования двумя лазерными пучками включает в себя два механических сканирующих устройства, которые установлены рядом так, чтобы области сканирования каждого полностью перекрывали ростовую зону установки. Оба сканирующих устройства оснащены вариофокальными объективами, фокусирующими ...

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28-05-2018 дата публикации

Устройство удаления газообразных и твердых продуктов лазерной резки

Номер: RU0000179866U1

Полезная модель относится к области удаления газообразных и твердых продуктов при лазерной обработке и может быть использована при лазерной резке органических листовых материалов.Технический результат - повышение эффективности.Достигается тем, что устройство удаления газообразных и твердых продуктов лазерной резки содержит набор параллельных коробов, размещенных под обрабатываемым материалом, снабженный средством откачки воздуха из них, и дополнительно установленный неподвижно набор форсунок для поочередной подачи импульсов сжатого воздуха в короба с их противоположной стороны от размещения средства откачки воздуха. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 179 866 U1 (51) МПК B22D 19/10 (2006.01) B23K 26/00 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B22D 19/10 (2006.01); B23K 26/00 (2006.01) (21)(22) Заявка: 2017127493, 01.08.2017 (24) Дата начала отсчета срока действия патента: Дата регистрации: Приоритет(ы): (22) Дата подачи заявки: 01.08.2017 (45) Опубликовано: 28.05.2018 Бюл. № 16 2325251 C2, 27.05.2008. RU 75601 U1, 20.08.2008. US 6727457 B1, 27.04.2004. (54) Устройство удаления газообразных и твердых продуктов лазерной резки (57) Реферат: Полезная модель относится к области резки содержит набор параллельных коробов, удаления газообразных и твердых продуктов при размещенных под обрабатываемым материалом, лазерной обработке и может быть использована снабженный средством откачки воздуха из них, при лазерной резке органических листовых и дополнительно установленный неподвижно материалов. набор форсунок для поочередной подачи Технический результат повышение импульсов сжатого воздуха в короба с их эффективности. противоположной стороны от размещения Достигается тем, что устройство удаления средства откачки воздуха. 1 ил. газообразных и твердых продуктов лазерной R U 1 7 9 8 6 6 (56) Список документов, цитированных в отчете о поиске: RU 105605 U1, 20.06.2011. RU Стр.: 1 U 1 U 1 Адрес для ...

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22-05-2019 дата публикации

Устройство для армирования металлического покрытия при послойном лазерном синтезе

Номер: RU0000189345U1

Полезная модель относится к оборудованию для лазерной обработки материалов, а именно к устройствам перемещения сфокусированного лазерного луча по двухмерной траектории, с дозатором для подачи порошка и сопла газопорошковой струи с целью послойной лазерной наплавки порошковых материалов на поверхность металлической заготовки с армированием покрытий, для создания анизотропных композитных материалов, а также послойного выращивания изделия по 3D модели. Устройство позволяет осуществлять возможность регулирования анизотропии упругих и прочностных свойств, при заданной схеме нагрузок и благодаря известному расположению армирующего наполнителя, получить анизотропные структуры, обладающие желаемыми механическими характеристиками в любом направлении с возможностью усиления особо нагруженных участков.Технический результат, на который направлена полезная модель, заключается в создании наплавленного металлического покрытия, армированного волоконными материалами для создания анизотропных композитных материалов.Данный технический результат достигается за счет того, что устройство для армирования металлического покрытия при послойном лазерном синтезе содержит блок подачи волоконного материала через боковое сканирующее сопло непосредственно в зону обработки. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 189 345 U1 (51) МПК B23K 26/00 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/00 (2019.02) (21)(22) Заявка: 2018139289, 08.11.2018 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Зябрев Игорь Александрович (RU) Дата регистрации: 22.05.2019 180500 U1, 14.06.2018. RU 172337 U1, 04.07.2017. RU 167356 U1, 10.01.2017. RU 154588 U1, 27.08.2015. (45) Опубликовано: 22.05.2019 Бюл. № 15 1 8 9 3 4 5 R U (54) УСТРОЙСТВО ДЛЯ АРМИРОВАНИЯ МЕТАЛЛИЧЕСКОГО ПОКРЫТИЯ ПРИ ПОСЛОЙНОМ ЛАЗЕРНОМ СИНТЕЗЕ (57) Реферат: Полезная модель относится к оборудованию желаемыми механическими характеристиками в для лазерной ...

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31-07-2019 дата публикации

Лазерная оптическая головка

Номер: RU0000191258U1

Полезная модель относится к области обработки материалов лазерным лучом, а именно к процессам лазерной сварки, резки, сверления отверстий. При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вниз осуществляется ручным штурвалом (5). При выполнении технологического режима - лазерной резки или сверлении отверстий движение внутреннего подвижного корпуса (3) с внутренним соплом (4) вверх происходит аналогичным образом. Перемещение осуществляется по рейке (13), установленной на внутреннем подвижном корпусе (3), где шестерня (12) закреплена на валу (10). Длина хода рейки (13) достигает до 10±0,025 мм, которая получена опытным путем. Для обеспечения резки или сверления отверстий металлов толщиной от 1 мм до 20 мм длина хода рейки (13) равна 5÷10 мм, при этом расстояние между срезом внутреннего сопла (4) и зоной обработки равно диаметру съемной насадки (17) 0,2±0,02 мм. Для обеспечения резки металлов толщиной от 20 мм до 40 мм длина хода рейки (13) равной 1÷5 мм, при этом расстояние между срезом внутреннего сопла 4 и зоной обработки равно диаметру съемной насадки (17) 0,5±0,02 мм. Для обеспечения сварки металлов толщиной от 1 мм до 20 мм расстояние между срезом внутреннего сопла (4) и зоной сварки равно двойному диаметру съемной насадки (17) 0,4±0,02 мм. Уменьшая или увеличивая размер фокусного пятна можно добиться высокого качества обрабатываемых деталей, выполненных резкой, сверлением отверстий или сваркой. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 191 258 U1 (51) МПК B23K 26/14 (2014.01) B23K 26/064 (2014.01) B23K 26/70 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/14 (2019.05); B23K 26/064 (2019.05); B23K 26/70 (2019.05) (21)(22) Заявка: 2019113412, 29.04.2019 (24) Дата начала отсчета срока действия патента: 31.07.2019 Приоритет(ы): (22) Дата подачи заявки: 29.04.2019 (45) Опубликовано: 31.07.2019 Бюл. № ...

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05-02-2021 дата публикации

Станок лазерной резки с жестким закреплением защитного кожуха

Номер: RU0000202164U1

Заявляемая полезная модель относится к станкам, и, в частности к станкам, использующим обработку лазерным лучом для резки и образования отверстий в материале.Станок лазерной резки с жестким закреплением защитного кожуха включает станину, рабочий стол, продольные и поперечные направляющие, ролики, траверсу, раму, защитный кожух, лазерную головку и механизм ее перемещения. Рабочий стол закрепляется на станине. К рабочему столу, при помощи роликов на продольных направляющих, закреплена траверса, при этом рама расположена над рабочим столом и прикрыта защитным кожухом, снабженным дверцами и смотровыми окнами, лазерная головка с механизмом ее перемещения установлена на продольной направляющей непосредственно внутри защитного кожуха. Он содержит дополнительную траверсу, а защитный кожух охватывает продольные направляющие сверху; при этом обе траверсы расположены параллельно и жестко закреплены внутри кожуха. Технический результат заключается в обеспечении повышенной надежности конструкции.Заявляемый станок может найти широкое применение при осуществлении лазерной резки металлов и других твердых материалов. 11 з.п. ф-лы, 2 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 202 164 U1 (51) МПК B23K 26/00 (2014.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК B23K 26/00 (2020.08) (21)(22) Заявка: 2020129550, 07.09.2020 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Общество с ограниченной ответственностью "СПЕЦВЕНТРЕШЕНИЕ" (RU) Дата регистрации: 05.02.2021 (45) Опубликовано: 05.02.2021 Бюл. № 4 2 0 2 1 6 4 R U (54) СТАНОК ЛАЗЕРНОЙ РЕЗКИ С ЖЕСТКИМ ЗАКРЕПЛЕНИЕМ ЗАЩИТНОГО КОЖУХА (57) Реферат: Заявляемая полезная модель относится к снабженным дверцами и смотровыми окнами, станкам, и, в частности к станкам, использующим лазерная головка с механизмом ее перемещения обработку лазерным лучом для резки и установлена на продольной направляющей образования отверстий в материале. непосредственно внутри ...

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12-01-2012 дата публикации

Particle Embedded Polymer Stent and Method of Manufacture

Номер: US20120010691A1
Автор: Gerry Clarke
Принадлежит: Medtronic Vascular Inc

A particle embedded polymer stent and method of manufacture, which includes a stent delivery system having a catheter; a balloon operably attached to the catheter; and a polymer stent disposed on the balloon, the stent comprising struts interconnected to form a tubular body. Each of the struts includes in cross section a drug-free core region; and a drug region surrounding and immediately adjacent to the core region, the drug region including drug particles. The drug-free core region and the drug region are made of a single polymer, the single polymer having a drug-safe softening temperature.

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19-01-2012 дата публикации

Laser irradiation apparatus

Номер: US20120012568A1
Принадлежит: Samsung Mobile Display Co Ltd

A laser irradiation apparatus for irradiating a laser beam to a semiconductor layer including a plurality of pixel areas, the apparatus includes a laser generator generating the laser beam, and an optical switching unit time-dividing the laser beam generated from the laser generator and transmitting a plurality of time-divided laser beams to a plurality of optical systems. The apparatus includes a first optical system of the plurality of optical systems that receives a first time-divided laser beam and irradiates a first laser slit beam along a first irradiation direction, and a second optical system of the plurality of optical systems that receives a second time-divided laser beam and irradiates a second laser slit beam along a second irradiation direction that is parallel with the first irradiation direction. The first laser slit beam and the second laser slit beam crystallize partial areas at a same location in the respective pixel areas.

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19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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19-01-2012 дата публикации

Automated beam marker

Номер: US20120013661A1
Автор: James M. Smelser
Принадлежит: Individual

A beam marking system is disclosed for marking on beams with a marking device. The beam marking system includes a beam marking device configured to mark on the surface of a beam. A movable arm is coupled to the marking device. The movable arm has at least three movable components that collectively move the beam marking device along or about at least three axes. A controller is in electronic communication with the movable arm and the marking device. The controller controlling the movement of the at least three movable components of the movable arm and controlling the operation of the marking device. In some instances, the beam marking system can automatically mark beams, such as metal beams used in heavy construction projects in a rapid and accurate manner.

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19-01-2012 дата публикации

Laser marking method

Номер: US20120013699A1
Принадлежит: Nidek Co Ltd, Shikibo Ltd, Shizuoka Prefecture

This invention provides a laser marking method that can form a very minute mark of a predetermined shape, such as a letter or pattern, with clarity and high solidity, on the surface of a substrate. The laser marking method of the invention comprises the steps of (1) depositing a coloring material on the surface of a substrate of thermoplastic material to form a thin film of the coloring material, and (2) applying a laser beam to the thin film of the coloring material in conformity with a predetermined marking shape to cause the portions of the substrate irradiated with the laser beam to soften and to cause the thus softened portions to mix with the coloring material, thereby developing the predetermined marking shape on the surface of the substrate.

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26-01-2012 дата публикации

Optical device and laser beam machining apparatus having optical device

Номер: US20120018412A1
Автор: Yusaku Ito
Принадлежит: Disco Corp

An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.

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02-02-2012 дата публикации

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Номер: US20120028404A1
Автор: Jonathan Mack Frey
Принадлежит: Primestar Solar Inc

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

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23-02-2012 дата публикации

Laser processing method and laser processing apparatus

Номер: US20120043474A1
Принадлежит: Qmc Co Ltd

The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

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01-03-2012 дата публикации

Apparatus and method for laser scribing

Номер: US20120052605A1
Автор: Yu Sung JANG
Принадлежит: JANG Yu Sung

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

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22-03-2012 дата публикации

Laser irradiation apparatus, laser irradiation method, fabrication method for thin film semiconductor device and fabrication method for display apparatus

Номер: US20120067856A1
Принадлежит: Sony Corp

A laser irradiation apparatus, including: an optical system configured to form laser light of a linear cross section to be irradiated on an irradiation object; and a cutting member having a light blocking portion configured to block the laser light formed in the linear cross section by the optical system to cut the laser light so as to have a predetermined length along a line longitudinal direction; the light blocking portion having a plurality of fins provided on the light blocking portion thereof so as to fetch and absorb the laser light.

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22-03-2012 дата публикации

Defect correcting apparatus and defect correcting method

Номер: US20120071056A1
Принадлежит: Sony Corp

The present disclosure provides a defect correcting apparatus including a defect detecting device configured to detect a defect within a repetitive pattern in a multilayer substrate a defect correcting device configured to correct the defect in the multilayer substrate by a specified defect correcting method, and a control device configured to, when the defect detected by the defect detecting device is detected overlapping a region in which occurrence of an interlayer short-circuit defect is assumed, generate an object corresponding to the defect correcting method for the interlayer short-circuit defect, and controlling the defect correcting device for correcting the defect using the generated object.

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29-03-2012 дата публикации

Tubular beam with single center leg

Номер: US20120074720A1
Принадлежит: Shape Corp

A reinforcement beam for a vehicle bumper system comprises a single sheet deformed to define first and second tubes sharing a common single center wall. A channel rib is formed on each tubes and a crevice rib over the center leg forms a third rib. Edges of the sheet are deformed to a radius so that their surface consistently engages an associated radiused corner formed on ends of the center leg, which facilitates consistent abutting line engagement of material surfaces, and thus facilitates consistent welding. In a preferred beam, front wall sections of each tube are coplanar and form a face of the beam, with each channel rib and crevice rib providing added stiffness to the beam, and yet nothing extends forward of the coplanar front wall sections. Related apparatus and methods are also disclosed.

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05-04-2012 дата публикации

Beam guiding bellows for laser cutting machine, and method of manufacturing beam guiding bellows for laser cutting machine

Номер: US20120081808A1
Принадлежит: Individual

Disclosed are a novel beam guiding bellows for laser cutting machine, and a method of manufacturing the beam guiding bellows for laser cutting machine, which no longer need a process of placing any special plates such as reflective plates, therefore enabling manufacturing in a shorter time at low costs. The beam guiding bellows is configured by a plurality of stacked sheet bodies integrally folded so as to alternately form hill sections and valley sections, and is thereby made freely expandable and retractable in the overall length as angles of the hill sections and valley sections vary, wherein the inner sheet body disposed innermostly is composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light having been scattered or reversed, or having, formed on the inner surface thereof, a protective layer composed of a material capable of protecting the inner sheet body by absorbing or reflecting the laser light, and the inner sheet body has protruding flaps which are formed, automatically in the process of folding it together with the other sheet bodies to thereby form the hill sections and the valley sections alternately, so as to project further inwardly from the apexes of the valley sections.

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12-04-2012 дата публикации

Device for simultaneously processing the circumference of a workpiece with laser beams

Номер: US20120085740A1
Принадлежит: JENOPTIK Automatisierungstechnik GmbH

A device for simultaneously processing a circumference of a workpiece includes a plurality of laser-lens modules and a waveguide. The modules each include a diode laser and a lens system and is configured to emit a laser beam radially in a shared radiation plane. The waveguide includes a lower part and an upper part that together form a cavity enclosing the radiation plane. The laser-lens modules are configured so that the laser is reflected repeatedly between a bottom surface and a cover surface and propagates in an unaffected manner within the radiation plane so as to form a beam spot that strikes the workpiece with a homogeneous energy distribution. The beam spot has a height based on a distance between the surfaces and a width based on a divergence angle in the radiation plane and a distance of the module from the workpiece surface.

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12-04-2012 дата публикации

Method of detecting pattern formed on non-exposed surface of workpiece

Номер: US20120086797A1
Автор: Kenji Furuta
Принадлежит: Disco Corp

A method of detecting an object of detection formed in the inside of or on a non-exposed surface of a workpiece having a rugged exposed surface, the detection being made on the exposed surface side of the workpiece by use of an imaging unit. The detecting method includes: a flattening step of coating the exposed surface of the workpiece with a liquid resin transmissive to the wavelength of light to be detected by the imaging unit so as to flatten the exposed surface of the workpiece; and a detecting step of detecting the object of detection formed in the inside of or on the non-exposed surface of the workpiece by use of the imaging unit on the exposed surface side of the workpiece coated with the liquid resin, after the flattening step.

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19-04-2012 дата публикации

Niobium based superconducting radio frequency(scrf) cavities comprising niobium components joined by laser welding, method and apparatus for manufacturing such cavities

Номер: US20120094839A1
Принадлежит: India Atomic Energy Department of

Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities involving atleast one laser beam welded components in the SCRF cavity welded from inside surface of the wall of cavity directed to achieving more than half the thickness to full depth penetration with minimum HAZ, minimizing distortion and shrinkage. The method ensures improved weld quality and surface finish substantially free of any weld defects. Also disclosed is the welding nozzle system and welding rigs adapted to facilitate such laser welding of the Niobium or its alloy based Superconducting Radio Frequency (SCRF) Cavities. The invention is thus directed to enhancing productivity, ensuring consistent quality and reliability, enhanced weld penetration with minimum HAZ, smooth finish of weld joints at possible reduced costs.

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03-05-2012 дата публикации

Substrate with shaped cooling holes and methods of manufacture

Номер: US20120102959A1
Принадлежит: General Electric Co

A substrate having one or more shaped effusion cooling holes formed therein. Each shaped cooling hole has a bore angled relative to an exit surface of the combustor liner. One end of the bore is an inlet formed in an inlet surface of the combustor liner. The other end of the bore is an outlet formed in the exit surface of the combustor liner. The outlet has a shaped portion that expands in only one dimension. Also methods for making the shaped cooling holes.

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31-05-2012 дата публикации

Orthogonal integrated cleaving device

Номер: US20120132628A1
Принадлежит: Electro Scientific Industries Inc

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

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07-06-2012 дата публикации

Holding arrangement for an optical element

Номер: US20120140341A1

A holding arrangement for an optical element includes a basic structure surrounding an optical element and a mounting device by which the optical element can be supported on the basic structure with two degrees of freedom for a rotational movement about an optical axis and a translational movement along a first axis which extends perpendicularly to the optical axis and intersects the optical axis in a center. The mounting device includes four joint locations arranged point-symmetrically with respect to the center and at least one parallel rocker which is displaceable parallel to the first axis. A manipulator unit includes a holding arrangement.

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14-06-2012 дата публикации

Laser processing system and overlay welding method

Номер: US20120145683A1
Принадлежит: HITACHI LTD

A laser processing system includes a laser processing head, a powder supply device, and a controller. The powder supply device supplies powder to the laser processing head. The laser processing head includes: a laser emission unit which irradiates a workpiece with laser light; and a powder supply unit which receives the powder supplied from a powder supply device to the laser processing head, and can supply the powder to a laser spot on the workpiece. The powder supply unit includes: a powder discharge unit which can discharge the powder toward the laser spot on the workpiece; and a powder-supply control mechanism which controls the amount of the powder to be supplied to the powder discharge unit, by distributing to the powder discharge unit at least a part of a flow of the powder supplied from the powder supply device. The controller controls the distributing by the powder-supply control mechanism.

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14-06-2012 дата публикации

On-The-Fly Manipulation Of Spot Size And Cutting Speed For Real-Time Control Of Trench Depth And Width In Laser Operations

Номер: US20120145686A1
Принадлежит: Electro Scientific Industries Inc

Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

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28-06-2012 дата публикации

Cutting apparatus

Номер: US20120160816A1
Автор: Anton W. HUBERT
Принадлежит: Individual

The invention relates to a cutting apparatus. A carrying device has a carrying bar extending above the cutting table and can be moved by an undercarriage transversely to the longitudinal axis of the carrying bar parallel to the plane of the cutting table. At least one cutting carriage is guided displaceably on the carrying bar in the direction of the longitudinal axis parallel to the plane of the cutting table and on which there is positioned a cutting device for generating a cutting beam directed at the cutting table. A protective housing being provided to cover the cutting beam and encloses the cutting device on all sides and relative to which the cutting carriage can be moved. The protective housing being provided on the carrying device and being moveable over the cutting table with the carrying device.

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19-07-2012 дата публикации

Method and System for Mitigation of Particulate Inclusions in Optical Materials

Номер: US20120180527A1

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

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26-07-2012 дата публикации

Laser engraver capable of automatic defocusing

Номер: US20120187097A1
Автор: Jang-Yie WU, Po-Hung Lin
Принадлежит: Great Computer Corp

A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing.

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09-08-2012 дата публикации

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

Номер: US20120202313A1
Автор: Walter Psyk
Принадлежит: SCHOTT SOLAR AG

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

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16-08-2012 дата публикации

Scanned laser light source

Номер: US20120205347A1
Принадлежит: Applied Materials Inc

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

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16-08-2012 дата публикации

Method and device for welding parts with spot contact or short line contact in the joining region and joining device

Номер: US20120205350A1
Автор: Uwe Stadtmueller
Принадлежит: Individual

Parts are welded by way of a laser beam, wherein the parts are oriented and fixed relative to each other, a laser beam is introduced into an upper part from above and centered relative to a joint point and fuses only the inner region directly above the joint point, while the upper part and the lower part are pressed against each other and therefore move toward one another, wherein the fused region of the upper part penetrates the material of the particular lower part, which has likewise fused in the meantime. Laser welding makes it possible to weld the parts so as to form products having nearly any type of geometry with much less effort than with resistance welding or capacitor discharge welding. The welding device needs only hold and fix the parts to be welded, and apply the slight surface pressure required.

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16-08-2012 дата публикации

Laser machining apparatus with switchable laser system and laser machining method

Номер: US20120205356A1
Автор: Christoph Plüss
Принадлежит: Individual

A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.

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30-08-2012 дата публикации

Laser processing method and apparatus

Номер: US20120219031A1
Автор: Tadashi TOKIWA
Принадлежит: NHK Spring Co Ltd

A laser processing method processes spots on an object in a scan area with a laser beam emitted from a laser emitter. The method includes steps of covering the scan area in such a way as to transmit the laser beam and define a closed space over the scan area, jetting an inert gas into the closed space so that the jetted inert gas forms a gas curtain sweeping along the scan area in the closed space, and discharging the inert gas from the closed space while maintaining a positive pressure in the closed space, thereby removing plumes from the spots processed with the laser beam and preventing the spots from oxidizing. The method is capable of stably laser-processing the object without changing the color of the processed spots.

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06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1
Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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06-09-2012 дата публикации

Annealing method and annealing apparatus

Номер: US20120225568A1
Принадлежит: Tokyo Electron Ltd

An annealing method irradiates a target object, having a film formed on its surface, with a laser beam to perform an annealing process to the target object. The surface of the target object is irradiated with the laser beam obliquely at an incident angle that is determined to achieve an improved laser absorptance of the film.

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20-09-2012 дата публикации

Method and Device for Machining a Workpiece

Номер: US20120234888A1
Принадлежит: Continental Automotive GmbH

A method and related device for machining a workpiece is provided, wherein material of the workpiece is removed in a machining region by a non-contact removal process. The workpiece is excited by means of an excitation oscillation having a natural resonant frequency of the workpiece, or a composite comprising the workpiece and a coupling element that is rigidly coupled to the workpiece is excited by means of an excitation oscillation having a joint natural resonant frequency of the workpiece and the coupling element. The natural resonant frequency is selected such that in the machining region an oscillation occurs that has a maximum oscillation amplitude in relation to the excitation amplitude of the excitation oscillation.

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27-09-2012 дата публикации

Wafer dividing method

Номер: US20120244682A1
Автор: Kei Tanaka
Принадлежит: Disco Corp

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

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18-10-2012 дата публикации

Method for Printing a Substrate Using an Anilox Roll, an Anilox Roll for a Printing Method and a Printing Apparatus

Номер: US20120260812A1
Принадлежит: Apex Europe BV

The invention relates to an anilox roll for a printing apparatus. The anilox roll comprises a cylinder having a surface. The surface comprises a fluid distribution structure for receiving, distributing and transferring a fluid such as an ink. The fluid distribution structure comprises a channel formed in the surface having channel walls. This channel is arranged for distributing the fluid over the fluid distribution structure. The channel comprises channel parts, wherein the courses of connected channel parts are at an angle with respect to each other for preventing a linear distribution of the fluids to be received in a course direction of the channel, allowing a meandering distribution of the fluid to be received in the channel. Side walls of the channel are arranged for allowing a meandering flow of the fluid throughout the fluid distribution surface.

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18-10-2012 дата публикации

Method and Apparatus for Forming an Anilox Roll

Номер: US20120261394A1
Принадлежит: Apex Europe BV

The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.

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18-10-2012 дата публикации

Annealing apparatus using two wavelengths of continuous wave laser radiation

Номер: US20120261395A1
Принадлежит: Individual

A thermal processing apparatus and method in which a first laser source, for example, a CO 2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO 2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

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18-10-2012 дата публикации

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

Номер: US20120261678A1
Принадлежит: Showa Denko KK

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

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25-10-2012 дата публикации

Method for dicing wafer stack

Номер: US20120267351A1
Автор: Shih-Tsun Huang
Принадлежит: Lingsen Precision Industries Ltd

A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.

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01-11-2012 дата публикации

Laser match honing system and method

Номер: US20120273471A1
Принадлежит: ROBERT BOSCH GMBH

A laser match honing system and method are provided for processing one of a pair of mechanically matching components ( 1, 2 ) having matching portions ( 12, 22, 16, 26 ) that will be fitted with each other. A dimension of the matching portion ( 12, 16 ) of the first component ( 1 ) is measured and is then used for calculating the desired dimension of the corresponding matching portion ( 22, 26 ) of the second component ( 2 ). An actual dimension of the matching portion ( 22, 26 ) of the second component ( 2 ) is also measured. Then, the matching portion ( 22, 26 ) of the second component ( 2 ) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

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01-11-2012 дата публикации

Laser processing systems and methods for beam dithering and skiving

Номер: US20120273472A1
Принадлежит: Electro Scientific Industries Inc

A laser processing system includes a first positioning system for imparting first relative movement of a beam path along a beam trajectory with respect to a workpiece, a processor for determining a second relative movement of the beam path along a plurality of dither rows, a second positioning system for imparting the second relative movement, and a laser source for emitting laser beam pulses. The system may compensate for changes in processing velocity to maintain dither rows at a predetermined angle. For example, the dither rows may remain perpendicular to the beam trajectory regardless of processing velocity. The processing velocity may be adjusted to process for an integral number of dither rows to complete a trench. A number of dither points in each row may be selected based on a width of the trench. Fluence may be normalized by adjusting for changes to processing velocity and trench width.

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29-11-2012 дата публикации

Printing Method With a Printing Apparatus Provided With an Anilox Roll

Номер: US20120298002A1
Принадлежит: Apex Europe BV

A printing apparatus has a printing device having a supply for a substrate to be printed and a supply for ink. The printing device has a printing roll with an image and an anilox roll mounted in a bearing. The anilox roll comprising a cylinder having a surface with a fluid distribution structure for receiving the fluid. The fluid distribution structure has a channel formed in the surface for distributing the fluid over the fluid distribution structure. The channel having a course and opposite channel walls positioned next to each other in a relative parallel oscillating fashion. Printing in a first operational mode, heavy layers of ink on said substrate with relatively large fluid droplets and Printing in a second operational mode, details on said substrate with relatively small fluid droplets.

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29-11-2012 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20120302122A1
Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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06-12-2012 дата публикации

Assembly for Precision Datum Alignment and Method of Use

Номер: US20120305807A1
Принадлежит: US Conec Ltd

A calibration assembly has a base and mounting elements to mount the base to a laser. The base has a front, middle and rear portions that are used to align the calibration assembly to the laser to cleave optical fibers with the laser. The front portion has a channel to receive the optical fibers, the middle portion has openings to confirm alignment of the laser; and the rear portion has a rear opening used to adjust the pitch and roll of the laser.

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06-12-2012 дата публикации

Pulsed light generation method

Номер: US20120307850A1
Принадлежит: Sumitomo Electric Industries Ltd

The present invention relates to a method of enabling generation of pulsed lights each having a narrow pulse width and high effective pulse energys. A pulse light source has a MOPA structure, and comprises a single semiconductor laser, a bandpass filter and an optical fiber amplifier. The single semiconductor laser outputs two or more pulsed lights separated by a predetermined interval, for each period given according to a predetermined repetition frequency. The bandpass filter attenuates one of the shorter wavelength side and the longer wavelength side, in the wavelength band of input pulsed lights.

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20-12-2012 дата публикации

Optical measuring device for monitoring a joint seam, joining head and laser welding head with same

Номер: US20120318775A1
Автор: Joachim Schwarz
Принадлежит: Precitec KG

An optical measuring device for monitoring a joint seam, joining head and laser welding head. The optical measuring device monitors a joining region in a workpiece and has at least one light-section device with a first light source for casting a light fan in the direction of the workpiece to be joined, making a triangulation light line within the joining region which intersects a joint seam. An illumination device with a second light source homogeneously illuminates the joining region. A first optical sensor with a first observation beam path for spatially resolved imaging of the triangulation light line is projected onto the joint seam. A second optical sensor with a second observation beam path for spatially resolved imaging of the joint seam is coaxially coupled with the first observation beam path. The readout rate of the first and second optical sensors is >1 kHz and <500 Hz, respectively.

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20-12-2012 дата публикации

Water soluble mask for substrate dicing by laser and plasma etch

Номер: US20120322233A1
Принадлежит: Applied Materials Inc

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

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20-12-2012 дата публикации

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Номер: US20120322234A1
Принадлежит: Applied Materials Inc

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

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20-12-2012 дата публикации

Laser and plasma etch wafer dicing using water-soluble die attach film

Номер: US20120322238A1
Принадлежит: Individual

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

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03-01-2013 дата публикации

Laser ablation tooling via distributed patterned masks

Номер: US20130003030A1
Автор: Thomas R.J. Corrigan
Принадлежит: 3M Innovative Properties Co

A distributed patterned mask for use in a laser ablation process to image a complete pattern onto a substrate. The mask has a plurality of apertures for transmission of light and non-transmissive areas around the apertures. When the apertures for the distributed pattern are repeatedly imaged on a substrate, structures within the distributed pattern merge within different areas of the imaged pattern to create the complete pattern with distributed stitch lines in order to reduce or eliminate the stitching effect in laser ablation. The mask can also form a sparse and distributed pattern including apertures that individually form merging portions of the complete pattern and collectively form a distributed pattern.

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17-01-2013 дата публикации

Laser processing machine

Номер: US20130015166A1
Автор: Chun-Hao Li
Принадлежит: Individual

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

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17-01-2013 дата публикации

Method of processing optical device wafer

Номер: US20130017640A1
Принадлежит: Disco Corp

A method of processing an optical device wafer having an optical device layer including an n-type semiconductor layer and a p-type semiconductor layer stacked over a sapphire substrate, a buffer layer therebetween, allowing peeling of the sapphire substrate. The method includes joining a transfer substrate to the optical device layer, breaking the buffer layer by irradiation with a pulsed laser beam from the sapphire substrate side of the wafer with the transfer substrate joined to the optical device layer, and peeling the sapphire substrate from the optical device wafer with the buffer layer broken, transferring the optical device layer onto the transfer substrate. The pulsed laser beam has a wavelength longer than an absorption edge of the sapphire substrate and shorter than an absorption edge of the buffer layer, and a pulse width set so that a thermal diffusion length will be not more than 200 nm.

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31-01-2013 дата публикации

Laser Diode Array with Fiber Optic Terminaton for Surface Treatment of Materials

Номер: US20130025325A1
Принадлежит: IPG Photonics Corp

Individually operable laser diodes in an array are associated with optical fibers for treatment of a material. Each laser diode has a generally Gaussian or similar profile. A guide block receives optical fiber terminal distal ends and enables irradiation of a surface for treatment with overlapping profiles. A control system controls individual laser diodes to achieve desired illumination profiles for a given process. The process is performed in a suitable environment which may include a vacuum system, controlled gaseous environment, or in a doping medium such as a surface coating or even a liquid. Optional relay optics interposed between the terminal distal ends and the treatment material allows distant relaying and reimaging. An optical isolator assembly may be interposed between the relay optics and the treatment material. The system and related methods allow direct irradiation from laser diodes to treat materials.

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07-02-2013 дата публикации

Laser Processing Machines

Номер: US20130032583A1
Принадлежит: TRUMPF MASCHINEN GRUESCH AG

A laser processing machine includes a workpiece support, a movement unit that is movable relative to the workpiece support, the movement unit being configured to move a laser processing head over the workpiece support, and a switch cabinet in which one or more control components of the laser processing machine are provided. An arrangement of the switch cabinet provides a free movement space disposed underneath at least a portion of the switch cabinet, wherein at least a portion of the movement unit is disposed within the free movement space.

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14-02-2013 дата публикации

System and method for component material addition

Номер: US20130040074A1
Принадлежит: Individual

A system is disclosed for depositing material on a component. The system includes a deposition device operatively coupled to a fiber optic Nd:YAG laser. The deposition device includes a focusing prism that focuses the Nd:YAG laser at a focal area on a bladed disk, where the focal area on the bladed disk is between two blades of the disk. The system further includes an imaging means that views the focal area of the component. The imaging means and the fiber optic Nd:YAG laser each are positioned in a substantially similar optical relationship to the focal area on the bladed disk. The system further includes an additive material delivery means that delivers additive material to the component at the focal area on the component.

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21-02-2013 дата публикации

Serial irradiation of a substrate by multiple radiation sources

Номер: US20130043412A1
Принадлежит: International Business Machines Corp

A system for configuring and utilizing J electromagnetic radiation sources (J≧2) to serially irradiate a substrate. Each source has a different function of wavelength and angular distribution of emitted radiation. The substrate includes a base layer and I stacks (I≧2; J≦I) thereon. P j denotes a normally incident energy flux on each stack from source j. In each of I independent exposure steps, the I stacks are concurrently exposed to radiation from the J sources. V i and S i respectively denote an actual and target energy flux transmitted into the substrate via stack i in exposure step i (i=1, . . . , I). t(i) and P t(i) are computed such that: V i is maximal through deployment of source t(i) as compared with deployment of any other source for i=1, . . . , I; and an error E being a function of |V 1 −S 1 |, |V 2 −S 2 |, . . . , |V I −S I | is about minimized with respect to P i (i=1, . . . , I).

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14-03-2013 дата публикации

Method of Verifying Seam Quality during a Laser Welding Process

Номер: US20130062324A1
Принадлежит: Trumpf Werkzeugmaschinen SE and Co KG

This disclosure relates to verifying a seam quality during a laser welding process. In certain aspects, a method includes detecting, in a spatially resolved manner, a first amount of radiation emerging from a workpiece in a first wavelength range, determining a first geometric parameter of a seam characteristic based on the first amount of radiation detected in the first wavelength range, detecting, in a spatially resolved manner, a second amount of radiation emerging from the workpiece in a second wavelength range, the second wavelength range being different than the first wavelength range, determining a second geometric parameter of the seam characteristic based on the second amount of radiation detected in the second wavelength range, comparing the first and second geometric parameters to respective reference values or to respective tolerance intervals to provide respective comparison results, and logically combining the respective comparison results to verify the seam quality.

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14-03-2013 дата публикации

Limiting energy leakage during laser scoring of vehicle airbag coverings

Номер: US20130065041A1
Принадлежит: Faurecia Interior Systems Inc

A covering for use over a vehicle airbag includes a skin layer and an attached foam layer. The foam layer is constructed from a polymer-based material that includes a polymer portion and an additive, and the additive may be selected to affect the energy transmission characteristics of the foam layer material when the covering is subjected to a laser scoring process that uses a laser light beam having a characteristic wavelength. The additive may decrease the amount of light energy transmitted through the material at the characteristic wavelength to limit the amount of energy leakage from one cut location to another during laser scoring. The decrease in light transmission through the material may be accompanied by an increase in the light absorption of the material, an increase in the amount of light reflected by the material, and/or an increase in a laser cutting rate of the material per unit energy.

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21-03-2013 дата публикации

Method and Apparatus for Three Dimensional Large Area Welding and Sealing of Optically Transparent Materials

Номер: US20130068384A1
Автор: Huan Huang, Jian Liu
Принадлежит: PolarOnyx Inc

Methods and systems for three dimensional large area welding and sealing of optically transparent materials are disclosed, including generating a beam of ultra-short pulses from an ultra-short pulsed laser; directing the beam to an acoustic-optic modulator to control the repetition rate of the beam; directing the beam to an attenuator after passing through the acoustic-optic modulator to control the energy of the beam; directing the beam to a focusing lens after passing through the attenuator to focus the beam between a top substrate and a bottom substrate in order to weld the top substrate to the bottom substrate, wherein the top substrate and the bottom substrate are in intimate contact; and controlling the position of the top substrate and the bottom substrate relative to the beam using a three-axis stage in order to weld the top substrate to the bottom substrate at different points. Other embodiments are described and claimed.

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21-03-2013 дата публикации

Systems and processes that singulate materials

Номер: US20130068736A1
Принадлежит: Individual

Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

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21-03-2013 дата публикации

Laser machining device and laser machining method

Номер: US20130068742A1
Принадлежит: Hamamatsu Photonics KK

A laser machining device 1 comprises a laser light source 10 , a spatial light modulator 20 , a controller 22 , a converging optical system 30 , and a shielding member 40 . The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10 , displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91 , and machines an object to be machined 90.

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04-04-2013 дата публикации

Method and apparatus for irradiating a semiconductor material surface by laser energy

Номер: US20130082195A1
Принадлежит: EXCICO FRANCE

An apparatus for irradiating semiconductor material is disclosed having, a laser generating a primary laser beam, an optical system and a means for shaping the primary laser beam, comprising a plurality of apertures for shaping the primary laser beam into a plurality of secondary laser beams. Wherein the shape and/or size of the individual apertures corresponds to that of a common region of a semiconductor material layer to be irradiated. The optical system is adapted for superposing the secondary laser beams to irradiate said common region. Further, the use of such an apparatus in semiconductor device manufacturing is disclosed.

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04-04-2013 дата публикации

Method for patterning nano particles

Номер: US20130084451A1
Принадлежит: UChicago Argonne LLC

The invention provides a simple and inexpensive method to assemble nanomaterials into millimeter lengths. The method can be used to generate optical, sensing, electronic, magnetic and or catalytic materials. Also provided is a substrate comprised of fused nanoparticles. The invention also provides a diode comprised of assembled nanoparticles.

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11-04-2013 дата публикации

METHOD AND DEVICE FOR LASER-JOINING SHEET METAL PARTS

Номер: US20130087538A1
Принадлежит: SCANSONIC MI GMBH

The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts () are joined into one connecting flange. The device has a clamping device () for clamping the sheet metal parts () to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (). Moreover, the device has a compensation shaft () which tracks the laser beam () according to a relative movement between the connecting flange and a guidance apparatus. 1. A device for joining sheet metal parts each with a flange , by laser , wherein the flanges of the sheet metal parts are joined into one connecting flange , in which the flanges of the sheets to be joined abut flat against each other and thus form a joint with a flange planewherein the device has clamping device to clamp the sheet metal parts to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam which is designed to route a laser beam substantially parallel to the connecting flange and transverse to the clamping direction to a front side of at least one of the flanges of the sheet metal parts to be joined,whereinthe device further comprises a compensation shaft which, when the device is connected to a guidance apparatus, tracks the laser beam according to a relative motion between the connecting flange and the guidance apparatuscharacterized in that the beam guidance system has at least one optical element with which a beam angle at which the laser beam runs on a plane perpendicular to the main clamping direction is to be influenced in such a way that switching between different beam angles is possible in the area of a possible processing point such that in each instance a lateral angle is produced away from a sheet part projecting beyond the joint andthat the device has an apparatus for monitoring the ...

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11-04-2013 дата публикации

SYSTEMS AND METHODS FOR REMOVING INSULATION DISPOSED OVER CONDUCTORS OF IMPLANTABLE ELECTRIC STIMULATION SYSTEMS

Номер: US20130087541A1
Автор: McDonald Matthew Lee

A method for forming a lead or lead extension includes forming an arrangement of elongated conductors. Each of the conductors extends from a proximal end of the arrangement to a distal end of the arrangement. Each of the conductors includes a layer of insulation disposed over a conductive core. A conductor-separating element is disposed over either the proximal end or the distal end of the arrangement. The conductor-separating element includes a plurality of ablation windows defined in a body. An end of at least one of the elongated conductors is radially extended over a portion of the conductor-separating element such that a portion of the at least one elongated conductor extends across at least one of the ablation windows. Insulation from the portion of the at least one conductor extending across the ablation window is ablated to expose a portion of the conductive core of the elongated conductor. 1. A kit for making a lead or lead extension , the kit comprisingan elongated bundle of conductor wires, each conductor wire comprising a conductive core and a layer of insulation disposed over the conductive core; a solid body defining a center, an outer rim, and a plurality of windows disposed circumferentially around the body,', 'a mounting aperture configured and arranged to receive the bundle of conductor wires, wherein the mounting aperture is positioned at the center of the body,', 'a plurality of retention devices disposed around the outer rim of the body, each retention device configured and arranged to receive, and retain, an end of one of the conductor wires which passes through the center aperture and is bent over, and extended along, the body of the conductor-separating element,', 'wherein, the plurality of windows are positioned such that, when a one of the conductors is extended along the body of the conductor-separating element and received in a one of the retention devices, the one of the conductors has a portion that is entirely exposed through a one of ...

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18-04-2013 дата публикации

HIGH SPEED LASER CRYSTALLIZATION OF PARTICLES OF PHOTOVOLTAIC SOLAR CELLS

Номер: US20130092664A1
Принадлежит: PURDUE RESEARCH FOUNDATION

A system and method for enhancing the conversion efficiency of thin film photovoltaics. The thin film structure includes a photovoltaic absorbent layer covered by a confinement layer. A laser beam passes through the confinement layer and hits the photovoltaic absorbent layer. The laser can be pulsed to create localized rapid heating and cooling of the photovoltaic absorbent layer. The confinement layer confines the laser induced plasma plume creating a localized high-pressure condition for the photovoltaic absorbent layer. The laser beam can be scanned across specific regions of the thin film structure. The laser beam can be pulsed as a series of short pulses. The photovoltaic absorbent layer can be made of various materials including copper indium diselenide, gallium arsenide, and cadmium telluride. The photovoltaic absorbent layer can be sandwiched between a substrate and the confinement layer, and a molybdenum layer can be between the substrate and the photovoltaic absorbent layer. 1. A system for fabricating thin film photovoltaics , the system comprising:a thin film structure comprising a photovoltaic absorbent layer covered by a confinement layer;a laser generating a laser beam that travels along an optical path to hit the photovoltaic absorbent layer by passing through the confinement layer, the confinement layer being substantially transparent to the laser beam;wherein the confinement layer confines a laser induced plasma plume and creates a localized high-pressure condition for the photovoltaic absorbent layer.2. The system of claim 1 , wherein the laser beam is pulsed to create localized rapid heating and cooling of the photovoltaic absorbent layer.3. The system of claim 1 , wherein the photovoltaic absorbent layer comprises at least one of a copper indium diselenide layer claim 1 , a gallium arsenide layer claim 1 , and a cadmium telluride layer.4. The system of claim 1 , wherein the thin film structure further comprises a substrate claim 1 , the ...

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18-04-2013 дата публикации

Laser crystallization apparatus and laser crystallization method using the same

Номер: US20130094534A1
Автор: Hiroshi Okumura
Принадлежит: Samsung Display Co Ltd

A laser crystallization device is provided, which includes a vibration device vibrating a laser beam along its long axis, wherein a vibration frequency at which the laser beam vibrates is satisfied by Equation 1 below. F<(P*f)/ (2*W)   Equation 1 where F is the mirror vibration frequency, W is the laser beam width, P is the laser scan pitch, and f is the laser pulse frequency.

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18-04-2013 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US20130095260A1
Принадлежит: IMRA America Inc

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

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25-04-2013 дата публикации

Laser machining apparatus

Номер: US20130098876A1
Принадлежит: Honda Motor Co Ltd

A laser machining apparatus is provided with: a workpiece support unit; a machining head; and a machining head moving unit. The workpiece support unit includes: an end support part that supports a width end of a workpiece; and an inside support part that supports an inside portion of the workpiece in a width direction. The end support part is movable in a longitudinal direction independently from the inside support part in response to a movement of the machining head.

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25-04-2013 дата публикации

HIGH-POWER LASER FOCUSING APPARATUS WITH PRESSURIZED HOUSING AND AERODYNAMIC WINDOW

Номер: US20130100979A1
Автор: REAM Stanley L.
Принадлежит: EDISON WELDING INSTITUTE, INC.

A high-powered laser beam focusing apparatus for use in laser welding applications that includes a laser having a beam delivery fiber for generating a laser beam and a housing adapted to receive the beam delivery fiber. The housing further includes a first internal chamber adapted to receive a flow of pressurized gas; a second internal chamber; and an aerodynamic window positioned between the first chamber and the second chamber. 1. A high-powered laser beam focusing apparatus , comprising;(a) a laser beam delivery fiber for transmitting a laser beam; (i) a first chamber, wherein the first chamber is adapted to receive a flow of pressurized gas;', '(ii) a second chamber; and', '(iii) an aerodynamic window positioned between the first chamber and the second chamber., '(b) a housing adapted to receive the beam delivery fiber, wherein the housing further includes2. The apparatus of claim 1 , further comprising a focusing optic connected to the housing and facing into the first chamber claim 1 , wherein the focusing optic is operative to receive claim 1 , focus claim 1 , and redirect the laser beam into the aerodynamic window.3. The apparatus of claim 2 , further comprising a reimaging optic connected to the housing and facing into the second chamber claim 2 , wherein the reimaging optic is operative to receive the laser beam exiting the aerodynamic window and reimage and redirect the laser beam onto a work surface.4. The apparatus of claim 3 , further comprising a source of pressurized gas connected to the first chamber claim 3 , wherein the flow of gas into the first chamber and the geometric characteristics of the aerodynamic window are operative to prevent debris generated at the work surface from passing through the aerodynamic window and entering the first chamber.5. The apparatus of claim 1 , wherein the laser is a high-power YAG laser claim 1 , fiber laser claim 1 , or disk laser.6. The apparatus of claim 2 , wherein the focusing optic is an asymmetric asphere ...

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02-05-2013 дата публикации

LASER CRYSTALLIZATION AND POLYCRYSTAL EFFICIENCY IMPROVEMENT FOR THIN FILM SOLAR

Номер: US20130109122A1
Автор: MOFFATT STEPHEN
Принадлежит:

Apparatus and methods of thermally processing semiconductor substrates are disclosed. Aspects of the apparatus include a source of intense radiation and a rotating energy distributor that distributes the intense radiation to a rectifier. The rectifier directs the radiation toward the substrate. Aspects of the method include using a rotating energy distributor to distribute pulsed energy to a substrate for processing. The rotational rate of the energy distributor is set based on the pulse repetition rate of the energy source. A substrate may be continuously translated with respect to the energy distributor at a rate set based on the pulse repetition rate of the energy source. 1. An apparatus for thermal processing of semiconductor substrates , comprising:a source of a rectangular laser light field;a rotating polygonal mirror disposed in an optical path of the rectangular laser light field and generating a plurality of reflected laser pulses having a rectangular shape and angularly distributed across a reflection field; anda rectifier disposed across the reflection field and above a work surface, and having one or more light-directing elements that direct the rectangular laser pulses from the reflection field toward the work surface.2. The apparatus of claim 1 , wherein the rectifier is a linear member disposed along an axis perpendicular to the optical path of the laser light field incident on the rotating polygonal mirror.3. The apparatus of claim 2 , wherein the rectifier comprises a plurality of optical elements.4. The apparatus of claim 2 , wherein the work surface comprises a conveyor movable in a direction substantially parallel to the optical path of the laser light incident on the rotating polygonal mirror.5. The apparatus of claim 3 , wherein the rectifier comprises a plurality of mirrors.6. The apparatus of claim 5 , wherein the rectifier further comprises a plurality of lenses.7. The apparatus of claim 6 , wherein each of the plurality of lenses has an ...

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09-05-2013 дата публикации

Device for Adjusting a Beam Profile, Laser Processing Machine and Method for Producing The Device

Номер: US20130114285A1
Принадлежит: Trumpf Laser Gmbh

The invention relates to a device for adjusting a beam profile of a laser beam, which is guided in a light guide of a fibre optic cable provided with a protective sleeve, wherein the device comprises a deformation device for deforming the light guide in a section of the fibre optic cable not enclosed by the protective sleeve, a housing, which is designed to surround the light guide at least in the section not enclosed by the protective sleeve, and also two holders provided at opposite ends of the housing for fixing in each case one end of a section of the protective sleeve, wherein the holders each comprise an opening for feeding the light guide to the deformation device. The invention also relates to a laser processing machine having such a device and to an associated production method.

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16-05-2013 дата публикации

Method and Device for Laser Material Processing of a Workpiece

Номер: US20130119026A1
Принадлежит: TRUMPF WERKZEUGMASCHINEN GMBH + CO. KG

Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam. 1. A method for cutting a workpiece with a laser beam , the method comprising:using the laser beam to melt and/or vaporize at least a portion of the workpiece;moving at least one of the workpiece and the laser beam relative to one another in an advancing direction to form a cutting front on the workpiece,wherein the laser beam comprises either at least two different radially polarized beam portions offset relative to each other along the advancing direction, or a plurality of laser beam strips extending along the advancing direction, wherein each laser beam strip has a different linear polarization direction, and wherein the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.2. The method according to claim 1 , wherein the laser beam comprises the plurality of laser beam strips claim 1 , the linear polarization direction of each laser beam strip subtends a corresponding angle to a longitudinal center plane of the laser beam claim 1 , and an angle size increases from the beam strips arranged near the longitudinal center plane toward the beam strips arranged furthest from the longitudinal center plane.3. The method according to claim 1 , wherein the laser beam comprises the two different radially polarized beam portions claim 1 ,wherein the at ...

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16-05-2013 дата публикации

DEVICE FOR PROCESSING PIPES BY MEANS OF A LASER BEAM

Номер: US20130119028A1
Принадлежит:

The invention relates to a device for processing pipes or other elongated materials () by means of a laser beam () produced by a laser beam source (), comprising a retaining element for retaining a tool or cutting element, wherein said retaining element is mounted so as to be slidable and rotatable relative to a machine bed (). The material () to be processed passes through an opening () surrounded by the retaining element. Favorable and flexible processing of widely varying materials is enabled in that the rotatably and slidably mounted retaining element is an elongated rotational element, on the inside of which the laser beam source () for the laser beam () is arranged as the tool or cutting element. 1. A device for processing pipes or other elongate materials by means of a laser beam generated by a laser beam source , comprisinga machine bed,a holding element, mounted so as to be displaceable relative to said machine bed and rotatable, for holding a tool or cutting means,an opening surrounded by the holding element, through which opening the material to be machined passes during processing,wherein the rotatably and displaceably mounted holding element is an elongate, hollow rotational body, on which the laser beam source for the laser beam is arranged on the inside as the tool or the cutting means.2. A device according to claim 1 , wherein a tunnel for accommodating the material to be machined is provided in the longitudinal direction in the elongate claim 1 , hollow rotational body.3. A device according to claim 1 , wherein the elongate claim 1 , hollow rotational body is a drum claim 1 , the opening being a central opening of the drum.4. A device according to claim 1 , wherein the laser beam is supplied freely to the material to be machined.5. A device according to claim 1 , wherein the elongate claim 1 , hollow rotational body is mounted rotatably about the center axis of the material to be machined on a bearing block claim 1 , which is arranged displaceably ...

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16-05-2013 дата публикации

DEVICE AND METHOD FOR MATERIAL PROCESSING BY MEANS OF LASER RADIATION

Номер: US20130119029A1
Принадлежит: CARL ZEISS MEDITEC AG

A device for material processing by laser radiation, including a source of laser radiation emitting pulsed laser radiation for interaction with the material, optics focusing the pulsed processing laser radiation to a center of interaction in the material, and a scanning unit shifting the positions of the center of interaction within the material. Each processing laser pulse interacting with the material in a zone surrounding the center of interaction assigned to the laser pulse so that material is separated in the zones of interaction. A control unit controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction. The control unit controls the source of laser radiation and the scanning unit such that adjacent centers of interaction are located at a spatial distance a ≦10 μm from each other. 1. A device for material processing by laser radiation , said device comprising:a source of laser radiation emitting pulsed laser radiation for interaction with the material;optics focusing the pulsed laser radiation to a center of interaction in the material;a scanning unit shifting positions of the center of interaction within the material, wherein each laser pulse interacts with the material in a zone surrounding the center of interaction assigned to said laser pulse so that material is separated in the zones of interaction;and a control unit which controls the scanning unit and the source of laser radiation such that a cut surface is produced in the material by sequential arrangement of zones of interaction, wherein the spatial distance a of the centers of interaction of two subsequent laser pulses is smaller than a size d of the focus so that sequentially produced zones of interaction overlap in the material and the fluence F of each laser pulse is below a threshold value M, above which an optical breakthrough forms in the material.2. The device as claimed in claim 1 , wherein ...

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16-05-2013 дата публикации

Method and apparatus for heat treating the wafer-shaped base material of a solar cell, in particular a crystalline or polycrystalline silicon solar cell

Номер: US20130119030A1
Автор: Paul Alexander Harten
Принадлежит: Limo Patentverwaltung GmbH and Co KG

A method and an apparatus for heat treating a wafer-shaped base material of a solar cell, in particular of a crystalline or polycrystalline silicon solar cell, wherein the device comprises at least one laser light source ( 4 a, 4 b ).

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16-05-2013 дата публикации

LASER LIFT-OFF METHOD AND LASER LIFT-OFF APPARATUS

Номер: US20130119031A1
Принадлежит: USHIO INC.

A substrate is separated from a material layer formed on the substrate without generating cracks in the material layer formed on the substrate. In order to separate the material layer from the substrate at a boundary between the substrate () and the material layer (), pulsed laser light (L) is applied, through the substrate (), to a workpiece () having the material layer () formed on the substrate (), while from moment to moment changing an irradiation region with respect to the workpiece (), in such a manner that the adjacent irradiation regions overlap each other on the workpiece (). The region where the pulsed laser light (L) is applied to the work () is set to satisfy the relationship of S/0.125, where S (mm) is the area of the irradiation region, and L (mm) is the circumferential length of the irradiation region. Consequently, the material layer can be reliably separated from the substrate without generating cracks in the material layer formed on the substrate. 1. A laser lift-off method wherein a work piece , in which a crystalline layer is formed on a base plate , is irradiated with pulsed laser light through the base plate , so that edge portions of irradiation regions , which adjoin each other in an irradiation moving direction , are overlapped each other , and edge portions of irradiation regions , which adjoin each other in a direction perpendicular to the irradiation moving direction , are overlapped each other , whereby the crystalline layer is separated from the base plate on a boundary face between the base plate and the crystalline layer , while changing a region of the workpiece to be irradiated with the pulsed laser light , andwherein the overlapped end portions of irradiation regions, are irradiated with pulsed laser light whose energy which exceeds a breakdown threshold required for separating crystalline layer from the base plate,wherein each of the irradiation regions of the workpiece, which is irradiated with the pulsed laser light, is ...

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16-05-2013 дата публикации

Method of and apparatus for personalising a series of portable objects

Номер: US20130120515A1
Принадлежит: Datacard Corp

Embodiments of the invention provide a method of and apparatus for graphically marking a series of portable objects, such as a card, each portable object being graphically marked on a respective zone by a respective marking device, wherein the marking devices are configured to perform the same marking operation simultaneously on a plurality of portable objects.

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23-05-2013 дата публикации

Method and Device for Machining a Workpiece by Means of a Laser

Номер: US20130126491A1
Автор: Janssen Ruth, Veit Thomas
Принадлежит: OSRAM Opto Semiconductors GmbH

The invention relates to a method for machining a workpiece by means of a laser, wherein a laser beam of the laser irradiates the workpiece, the laser beam remains stationary and the workpiece is moved when a central region of the workpiece is irradiated, and the laser beam and the workpiece are moved at least intermittently when an edge region of the workpiece is irradiated. 113-. (canceled)14. A method for machining a workpiece , the method comprising:irradiating the workpiece with a laser beam of a laser;during irradiation of a central region of the workpiece, keeping the laser beam stationary and moving the workpiece; andduring irradiation of an edge region of the workpiece, moving the laser beam and the workpiece at least intermittently.15. The method according to claim 14 , wherein the relative velocity between laser beam and workpiece during the irradiation of the edge region is at least intermittently equal to the relative velocity between laser beam and workpiece during the irradiation of the central region.16. The method according to claim 14 , wherein the laser is operated in a pulsed fashion claim 14 , wherein the duration of the pulses is at most 100 ns.17. The method according to claim 14 , wherein the laser is operated in a pulsed fashion claim 14 , wherein the duration of the pulses is at most 100 ps.18. The method according to claim 14 , wherein material of the workpiece is removed in places during the machining of the workpiece.19. The method according to claim 14 , wherein claim 14 , during the machining of the workpiece claim 14 , the workpiece is severed into at least two parts along a line running along a relative movement between laser beam and workpiece.20. The method according to claim 14 , wherein claim 14 , during the machining of the workpiece claim 14 , the workpiece is severed into at least two parts along a plane that the laser beam intersects at least in the extension thereof.21. The method according to claim 14 , wherein the ...

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23-05-2013 дата публикации

METHOD OF MATERIAL PROCESSING BY LASER FILAMENTATION

Номер: US20130126573A1
Принадлежит: FILASER INC.

A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation, increasing the filament length, thermally annealing of the filament modification zone to minimize collateral damage, improving process reproducibility, and increasing the processing speed compared with the use of low repetition rate lasers. 1. A method of preparing a substrate for cleavage , the method comprising the steps of:irradiating the substrate with a burst of pulses of a focused laser beam, wherein the substrate is transparent to the focused laser beam, wherein a time delay between successive pulses in the burst of pulses is less than a time duration over which relaxation of one or more material modification dynamics occurs, and wherein the burst of pulses have an energy and pulse duration selected to produce a filament within the substrate;translating the substrate relative to the focused laser beam to irradiate the substrate and produce an additional filament at one or more additional locations;wherein the filaments form an array defining an internally scribed path for cleaving the substrate.2. The method according to wherein substrate is translated relative to the focused laser beam with a rate selected to produce a filament spacing on a ...

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23-05-2013 дата публикации

Semiconductor Device and Method of Laser-Marking Laminate Layer Formed Over EWLB With Tape Applied to Opposite Surface

Номер: US20130127039A9
Принадлежит: Stats Chippac Pte Ltd

A semiconductor device has a semiconductor die with a plurality of bumps formed on contact pads disposed over its active surface. An encapsulant is formed over the semiconductor die. An interconnect structure is formed over the semiconductor die and encapsulant. The semiconductor die is mounted to a translucent tape with the bumps embedded in the translucent tape. The translucent tape has layers of polyolefin, acrylic, and polyethylene terephthalate. A back surface of the semiconductor die undergoes backgrinding to reduce die thickness. The tape undergoes UV curing. A laminate layer is formed over the back surface of the semiconductor die. The laminate layer undergoes oven curing. The laminate layer is laser-marked while the tape remains applied to the bumps. The tape is removed after laser-marking the laminate layer. Alternately, the tape can be removed prior to laser-marking. The tape reduces die warpage during laser-marking.

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23-05-2013 дата публикации

LASER LIFT-OFF APPARATUS

Номер: US20130128910A1
Принадлежит: USHIO INC.

In order to separate a material layer from a substrate at the boundary face between the substrate and the material layer, a laser light is applied to a workpiece from the substrate side through a mask, the work having the material layer formed on the substrate. The laser beam is split into a plurality of small area laser light by the mask , and two or more irradiation regions are formed on the workpiece. Adjacent irradiation regions are separated from each other, and an edge part of each irradiation region and an edge part of an adjacent irradiation region, which extend in a direction parallel to the relative moving direction of the workpiece, are arranged such that the edge of the irradiation region and the edge of the adjacent irradiation region are sequentially overlapped each other as the work is moved. 1. A laser lift-off apparatus comprising:a laser source for irradiating a workpiece, in which a base plate is formed on a material layer, with laser light passing through the base plate;a conveyance mechanism in which the workpiece and the laser source are moved relatively with respect to each other, anda laser light formation unit, which divides laser light emitted from the laser source into two or more laser lights, so that two or more irradiation regions, which are separated from each other by the respective divided laser light, are formed on the workpiece,{'sup': '2', 'wherein the two or more irradiation regions formed by the laser light formation unit, the area of which is 0.25 mmor less, are arranged so that end portions of adjoining irradiation regions which extend in a direction parallel to a moving direction of the workpiece, are overlapped each other in series and end portions of adjoining irradiation regions which extends in a direction perpendicular to the moving direction, are overlapped, workpiece is moved in a one direction relatively to the laser source and an entire face of the workpiece is irradiated with the laser light.'}2. The laser lift-off ...

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30-05-2013 дата публикации

LASER PROCESSING APPARATUS

Номер: US20130134142A1
Автор: Morikazu Hiroshi
Принадлежит: DISCO CORPORATION

A laser processing apparatus includes a beam diameter adjusting unit provided between a laser oscillator and a focusing unit, an imaging unit for detecting the beam diameter of the laser beam directed to a detection path, an optical path length changing unit for moving the imaging unit along the detection path to thereby change an optical path length, and a controller for controlling the imaging unit, the beam diameter adjusting unit, and the optical path length changing unit. The controller operates to move the imaging unit to two positions where different optical path lengths are provided, detect the beam diameters of the laser beam at the two positions, and controls the beam diameter adjusting unit according to the two beam diameters detected above so that the two beam diameters have a predetermined relation. 1. A laser processing apparatus comprising:a chuck table for holding a workpiece;laser beam applying means for applying a laser beam to said workpiece held on said chuck table, said laser beam applying means having a laser oscillator for oscillating said laser beam and focusing means for focusing said laser beam oscillated by said laser oscillator;beam diameter adjusting means provided between said laser oscillator and said focusing means for adjusting the beam diameter of said laser beam oscillated by said laser oscillator;an optical path changing mirror for changing an optical path of said laser beam passed through said beam diameter adjusting means into an optical path toward said focusing means;mirror positioning means for selectively positioning said optical path changing mirror at an operative position where said laser beam passed through said beam diameter adjusting means is directed toward said focusing means and at an inoperative position where said laser beam passed through said beam diameter adjusting means is allowed to travel straight toward a detection path;optical attenuating means provided on said detection path for attenuating said laser ...

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30-05-2013 дата публикации

Optical irradiation device for a system for producing three-dimensional work pieces by irradiating powder layers of a powdered raw material using laser radiation

Номер: US20130134637A1
Принадлежит: SLM Solutions Group AG

An optical irradiation device is provided which includes a multimode optical fiber suitable for the central wavelength of a beam of light having a first beam profile which enters through an input connection for multimode guidance; a switching device, which can be switched between a first and second light conducting state and is configured to conduct the beam of light entering through the input connection in the first light conducting state to an output connection, such that the beam of light has the first beam profile on emerging from the output connection, and guides the beam of light entering the input connection to the output connection by the multimode optical fiber in the second light conducting state, so that the beam of light has a second beam profile different from the first beam profile on emerging from the output connection by the multimode guidance in the multimode optical fiber.

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30-05-2013 дата публикации

Electrosurgical unit with micro/nano structure and the manufacturing method thereof

Номер: US20130138103A1

An electrosurgical unit having micro/nano structure formed thereon and the manufacturing method thereof are disclosed, in which the electrosurgical unit is formed by the irradiation of a laser beam upon a blade so as to have a hybrid of micro/nano elements formed on the surface of the blade. The application of the hybrid of micro/nano elements on the surface of the blade has proven to be a valuable asset not only in providing a non-stick surface and a good heat dissipation ability to the blade, but also in providing a electrosurgical blade that will not release any toxic material under high temperature.

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30-05-2013 дата публикации

EVALUATION METHOD AND EVALUATION SYSTEM FOR IMPACT FORCE OF LASER IRRADIATION DURING LASER PEENING AND LASER PEENING METHOD AND LASER PEENING SYSTEM

Номер: US20130138363A1
Принадлежит: SINTOKOGIO, LTD.

A method of evaluating impact force input to a workpiece member with a laser irradiated in laser peening processing is provided. This evaluation method includes a signal acquiring step, an input function calculating step, and an evaluating step. In the signal acquiring step, a detected waveform is acquired. The detected waveform is output during the laser peening processing by an AE sensor that detects an elastic wave generated in the workpiece member. In the input function calculating step, an input function I(t) by laser irradiation is calculated. In the evaluating step, impact force is evaluated using the input function I(t) by the laser irradiation. 122-. (canceled)23. A laser peening method obtaining a shock wave by causing ablation by a laser in a liquid , generating cavitation bubbles by a pressure change that occurs in the liquid , and obtaining a shock wave due to collapse of the cavitation bubbles to obtain two step of peening process.24. The laser peening method according to claim 23 , wherein the ablation is caused in the liquid in order to obtain a shock wave due to cavitation bubbles claim 23 , the liquid is water claim 23 , a vector of a shock wave due to the ablation is changed by water confining the shock wave due to the ablation claim 23 , not allowing the shock wave due to the ablation to be dispersed to the outside claim 23 , and a wavelength of the laser is 532 nm as a second harmonic of 1064 nm such that the laser is not attenuated in the water and the water does not cause ablation.2527-. (canceled)29. The laser peening method according to claim 28 , wherein claim 28 , in the input function calculating step claim 28 , the input function I(t) is calculated using at least an AE waveform including a first peak amplitude value claim 28 , which is an amplitude value of a peak detected first in the detected waveform acquired in the signal acquiring step.30. The laser peening method according to claim 29 , wherein claim 29 , in the input function ...

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06-06-2013 дата публикации

HIGH POWER LASER SYSTEM

Номер: US20130140283A1
Принадлежит:

A modulation device for directing a mobile tracking device away from an asset is provided. The modulation device includes a continuous wave laser source whose output is directed at a seeker head of the mobile tracking device. The modulation device causes the generation of localized sources within the mobile tracking device and confuses the mobile tracking device as to the true location of the asset. A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut. 1. An apparatus for interacting with a mobile tracking device , the apparatus comprising:a body;at least one propulsion device supported by the body;a plurality of sensor modules supported by the body which monitor the environment surrounding the body;a controller operatively connected to the plurality of sensor modules, the controller determining a presence of the mobile tracking device in the environment surrounding the body based on information collected by the plurality of sensor modules and a current location of the mobile tracking device;a modulation system which receives the current location of the mobile tracking device from the controller, orients a tracking system of the modulation system based on the current location of the mobile tracking device, detects the mobile tracking device, updates the location of the mobile tracking device, and directs a continuous beam of optical energy at the mobile tracking device, the continuous beam of optical energy being produced by a plurality of semiconductor lasers whose output are combined.2. The apparatus of claim 1 , wherein the plurality of semiconductor lasers are quantum cascade ...

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06-06-2013 дата публикации

APPARATUS, SYSTEM AND METHOD FOR DETERMINING COMPLIANT USE OF AN INTRAORAL APPLIANCE

Номер: US20130140289A1
Принадлежит: RESMED SAS

A compliance monitoring system () for an intraoral appliance comprises a power source (), a detector () for detecting when the intraoral appliance is positioned in the mouth for use, a recorder () configured to record measurement data, and a transponder () configured to communicate the measurement data. The monitoring system is adjustable based on a particular property of a patient or a group of patients. 240. The compliance monitoring system () of claim 1 , wherein the monitoring system is configured for being adjustable based on a unique characteristic of a patient or a group of patients.340. The compliance monitoring system () of claim 1 , wherein the particular property is a physical property including one or more of the group consisting of colour (gum claim 1 , teeth claim 1 , inside of cheek) claim 1 , teeth enamel claim 1 , temperature claim 1 , distance claim 1 , angle claim 1 , shape.440. The compliance monitoring system () of claim 1 , wherein the monitoring system claim 1 , preferably the detector claim 1 , comprises at least one signal emitter and/or at least one signal receiver.540. The compliance monitoring system () of claim 4 , wherein the signal emitter is a light emitter claim 4 , preferably an infrared-light emitter claim 4 , and wherein the signal receiver is a light receiver claim 4 , preferably an infrared-light receiver.640. The compliance monitoring system () of claim 4 , wherein the signal emitter is a sound emitter claim 4 , preferably an ultra sound emitter claim 4 , and wherein the signal receiver is a sound receiver claim 4 , preferably an ultra sound receiver.740. The compliance monitoring system () of claim 4 , wherein the signal emitter is a current emitter claim 4 , preferably a respectively driven electrode claim 4 , and wherein the signal receiver is a voltage receiver claim 4 , preferably respectively driven electrode.840. The compliance monitoring system () in accordance with claim 4 , wherein the at least one signal emitter and/ ...

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06-06-2013 дата публикации

METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES

Номер: US20130143013A1
Принадлежит: ELECTRO SCIENTIFIC INDUSTRIES, INC.

The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds. 1. A laser marking apparatus adapted to mark metal specimens with desired properties , said laser marking system having laser pulse parameters including laser fluence and laser geometry and a controller , said adaptations comprising:said laser fluence adapted to be within the optimal marking range for producing said mark with said desired properties;said laser geometry adapted to deliver said laser fluence to said metal specimen within the optimal marking range for producing said mark with said desired properties; andsaid controller adapted to store said adapted laser pulse parameters associated with said adapted laser fluence and laser geometry and thereafter direct said laser marking system to mark said metal specimens using said adapted laser pulse parameters thereby marking said metal specimens with said desired properties.2. The apparatus of wherein said desired properties comprise size claim 1 , shape claim 1 , location claim 1 , color and optical density.3. The apparatus of wherein said laser fluence comprises pulse width claim 1 , wavelength claim 1 , number of pulses claim 1 , pulse temporal shape claim 1 , and pulse fluence.4. The apparatus of wherein said laser geometry comprises spot location claim 1 , spot size claim 1 , spot shape claim 1 , and spot height claim 1 , bite size claim 1 , pitch and speed.5. The apparatus of wherein said desired color is black.6. The apparatus of wherein said ...

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13-06-2013 дата публикации

LASER CUTTING DEVICE AND LASER CUTTING METHOD

Номер: US20130146572A1
Автор: Watanabe Masao
Принадлежит:

An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of COlaser light. With a laser cutting device (), a laser emitting unit () emits a laser beam (YAG-based laser light whose wavelength is shorter than that of COlaser light) for cutting a processing item (), an optical system () focuses the laser beam so that the laser beam has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item () progresses, and thus, the elliptically-focused laser beam contributes to raising the temperature of a molten pool inside the processing item (). 1. A laser cutting device comprising:{'sub': '2', 'an emitting unit for emitting a laser beam for cutting a processing item that has a thickness to form a molten pool inside thereof when irradiated with a laser beam, whose wavelength is shorter than that of COlaser light; and'}a focusing unit for focusing the laser beam so that the laser beam emitted from the emitting unit has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item progresses.2. The laser cutting device according to claim 1 , wherein the focusing unit includes:a cylindrical lens that focuses the laser beam so that the laser beam emitted from the emitting unit has an elliptical cross-sectional shape; anda rotating unit for rotating the cylindrical lens so that a long-axis direction of the laser beam focused by the cylindrical lens is aligned with the direction in which cutting of the processing item progresses.3. The laser cutting device according to claim 1 , wherein the laser beam is fiber laser light.4. The laser cutting device according to claim 1 , wherein the laser beam is disk laser light.5. A laser cutting method comprising:{'sub': '2', 'a first stage of ...

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20-06-2013 дата публикации

OVERLAY WELDING METHOD AND OVERLAY WELDING APPARATUS

Номер: US20130153543A1
Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

To facilitate overlay welding while securing a certain hardness of an overlaid portion and preventing welding defects, an overlay welding method for performing overlay welding on a surface P to be overlaid of a base material includes a preparing step of forming a bottomed depression with the surface P to be overlaid being a circumferential surface thereof, and an overlaying step at which a filler material is fed toward a bottom face of the depression and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion W reaching the surface P to be overlaid, while filling the bottom face of the depression with a melted filler material. 1. An overlay welding method for performing overlay welding on a surface to be overlaid of a base material , the method comprising:a preparing step of forming a bottomed depression, with the surface to be overlaid being a circumferential surface thereof; andan overlaying step at which a filler material is fed toward a bottom face of the depression, and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion reaching the surface to be overlaid, while filling the bottom face of the depression with the melted filler material.2. The overlay welding method according to claim 1 , wherein a new overlaid portion is further layered on the formed overlaid portion at the overlaying step.3. The overlay welding method according to claim 1 , wherein the filler material is heated and fed at the overlaying step.4. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , the base material is preheated before forming the overlaid portion claim 1 , and the base material is post-heated after the overlaid portion is formed.5. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , feeding of the filler ...

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20-06-2013 дата публикации

Apparatus for Laser Processing a Light Guide Plate and Having Constant Light Path Distance of a Laser Beam

Номер: US20130153546A1
Принадлежит: LASERLIGHTING

Provided is a laser processing apparatus for a light guide plate capable of providing a high-quality light guide plate by maintaining a light path at a constant level. The laser processing apparatus includes a plurality of reflecting mirrors that reflect a laser mirror; and a path adjustment block transported in a direction a distance of the light path is reduced when a laser emitting unit is transported in a direction in which the distance of the light path is increased, wherein at least one of the plurality of reflecting mirrors is installed in the path adjustment block, thereby maintaining the distance of the entire light path on which the laser beam propagates at a constant level. 1. A laser processing apparatus for a light guide plate comprising:a frame;a laser oscillating unit which generates a laser beam and is installed to be fixed to the frame;a laser emitting unit which is transported to linearly reciprocate on the frame, and receives the laser beam from the laser oscillating unit to emit the laser beam and form a predetermined pattern on a light guide plate which is a processing object;a laser transmitting unit which forms a transmission path of the laser beam between the laser emitting unit and the laser oscillating unit; anda transport surface plate which is transported to linearly reciprocate in a direction intersecting a transport direction of the laser emitting unit on the frame and supports the light guide plate which is the processing object,wherein the laser transmitting unit includes a plurality of reflecting mirrors that reflect the laser beam and a path adjustment block that is transported in a direction in which a distance of the light path is reduced when the laser emitting unit are transported in a direction in which the distance of the light path is increased, and at least one of the plurality of reflecting mirrors being installed in the path adjustment block.2. The laser processing apparatus for a light guide plate according to claim 1 , ...

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