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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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05-01-2012 дата публикации

High-temperature activation process

Номер: US20120000247A1

Автор: Daniel Burgard, James Hinkle, Joshua Conley, Stephen Murphy, Thomas Truman

Принадлежит: Individual

A method for processing a coated glass substrate may include a high-temperature activation process.

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Номер записи: 1

05-01-2012 дата публикации

High Throughput Solar Cell Ablation System

Номер: US20120003788A1

Автор: Gabriel Harley, John Viatella, Peter John Cousins, Thomas Pass

Принадлежит: Individual

A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

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Номер записи: 2

19-01-2012 дата публикации

Method for Cutting C-Mn Steel with a Fiber Laser

Номер: US20120012570A1

Автор: Francis Briand, Hakim Maazaoui, Karim Chouf

Принадлежит: La Soudure Autogene Francaise, LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude

The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 μ m, preferably 1.07 μ m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO 2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H 2 and CH 4 .

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Номер записи: 3

02-02-2012 дата публикации

Method to dice back-contact solar cells

Номер: US20120025837A1

Автор: Douglas H. Rose, Karen Elizabeth Wilson, Zachary Kinyon

Принадлежит: SunPower Corp

A method of processing of solar cells includes determining that a back-contact solar cell is defective. The back-contact solar cell includes a first plurality of interconnect pads at a first edge thereof, and a second plurality of interconnect pads at a second, opposed thereof, the first and second pluralities of interconnect pads having opposite operational charges. The back-contact solar cell is then diced to define at least first and second back-contact solar cell sections. The first back-contact solar cell section has at least two interconnect pads, of the plurality of interconnect pads, at respective opposed edges thereof.

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Номер записи: 4

02-02-2012 дата публикации

Methods of temporally varying the laser intensity during scribing a photovoltaic device

Номер: US20120028404A1

Автор: Jonathan Mack Frey

Принадлежит: Primestar Solar Inc

Methods for laser scribing a film stack including a plurality of thin film layers on a substrate are provided. A pulse of a laser beam is applied to the film stack, where the laser beam has a power that varies as a function of time during the pulse according to a predetermined power cycle. For example, the pulse can have a pulse lasting about 0.1 nanoseconds to about 500 nanoseconds. This pulse of the laser beam can be repeated across the film stack to form a scribe line through at least one of the thin film layers on the substrate. Such methods are particularly useful in laser scribing a cadmium telluride thin-film based photovoltaic device.

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Номер записи: 5

16-02-2012 дата публикации

Polymer tubing laser micromachining

Номер: US20120037609A1

Автор: David Gaudiosi, Gordon Masor, Michael Greenberg, Michael Mielke, Tim Booth

Принадлежит: Individual

An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

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Номер записи: 6

01-03-2012 дата публикации

Apparatus and method for laser scribing

Номер: US20120052605A1

Автор: Yu Sung JANG

Принадлежит: JANG Yu Sung

Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

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Номер записи: 7

31-05-2012 дата публикации

Laser processing method

Номер: US20120131958A1

Автор: Hideki Shimoi, Keisuke Araki

Принадлежит: Hamamatsu Photonics KK

A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole.

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Номер записи: 8

31-05-2012 дата публикации

Orthogonal integrated cleaving device

Номер: US20120132628A1

Автор: Mark T. Kosmowski, Mehmet E. Alpay

Принадлежит: Electro Scientific Industries Inc

An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

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Номер записи: 9

31-05-2012 дата публикации

Pollution control device and inorganic fiber sheet material with a fused edge

Номер: US20120135205A1

Автор: Richard P. Merry

Принадлежит: 3M Innovative Properties Co

Inorganic fiber mounting and insulating sheet materials for use in pollution control devices with at least one edge of the inorganic fiber sheet material having at least one group of two or more fibers fused together. A pollution control device comprising such a sheet material. A process for cutting at least one section from a sheet containing inorganic fiber material, where the sheet material is suitable for use in a pollution control device. The fibrous sheet material is cut so that the cut edge has at least one group of two or more fibers fused together. A laser beam can be used to cut the desired section out of the inorganic fiber sheet material.

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Номер записи: 10

31-05-2012 дата публикации

Method and apparatus for cutting a brittle-material substrate, and window glass for vehicle obtained by the method

Номер: US20120135847A1

Автор: Akinori Matsumoto, Isao Saito, Yasuji Fukasawa

Принадлежит: Asahi Glass Co Ltd

A method for cutting a brittle-material substrate by irradiating a converged laser beam on a brittle-material substrate along first and second cutting lines intersecting each other at least at one point, includes forming scribe lines along the first and the second cutting lines on a surface of the brittle-material substrate, and relatively moving an irradiation position of the laser beam on the surface of the brittle-material substrate along the scribe lines to cut the brittle-material substrate at a forward position of the irradiation position in the moving direction of the irradiation position. The irradiation of the laser beam is limited in a region in the vicinity of an intersection where the first and the second cutting lines intersect.

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Номер записи: 11

19-07-2012 дата публикации

Method and System for Mitigation of Particulate Inclusions in Optical Materials

Номер: US20120180527A1

Автор: John Allyn Caird, Kathleen Irene SCHAFFERS

Принадлежит: Lawrence Livermore National Security LLC

A method of fabricating an optical material includes providing input materials having a material softening temperature, melting the input materials, and flowing the melted input materials into a laser inclusion mitigation system. The melted input materials comprise one or more inclusions. The method also includes irradiating the input materials using a laser beam, fragmenting the one or more inclusions in response to the irradiating, and reducing a temperature of the input materials to less than the material softening temperature. The method further includes forming an optical material and annealing the optical material.

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Номер записи: 12

09-08-2012 дата публикации

Method for making an opening in a substrate

Номер: US20120198977A1

Автор: Christian Kohlmeier, Florian Roick, Stefan Boenigk

Принадлежит: LPKF Laser and Electronics AG

A method for making an opening in a substrate includes creating a cutting path in the substrate for cutting out a polygonal area along predetermined side paths which enclose the opening and are connected to each other via respective corner points. The cutting path is started in an internal region of the polygonal area at a distance from the side paths. The cutting path is continued in a recess in the internal region to a start point on a first one of the side paths, the start point being disposed along the first one of the side paths at a substantial distance from each of the respective corner points so as to divide the first one of the side paths into a long side path portion and a short side path portion. The cutting path is continued, from the start point, along each of the side paths.

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Номер записи: 13

09-08-2012 дата публикации

Method and apparatus for forming the separating lines of a photovoltaic module with series-connected cells

Номер: US20120202313A1

Автор: Walter Psyk

Принадлежит: SCHOTT SOLAR AG

For forming the separating lines, ( 5, 6, 7 ) which are produced in the functional layers ( 2, 3, 4 ) deposited on a transparent substrate ( 1 ) during manufacture of a photovoltaic module with series-connected cells (C 1 , C 2 , . . . ), there are used laser scanners ( 8 ) whose laser beam ( 14 ) produces in the field ( 17 ) scanned thereby a plurality of adjacent separating line sections ( 18 ) in the functional layer ( 2, 3, 4 ). The laser scanners ( 8 ) are then moved relative to the coated substrate ( 1 ) in the direction (Y) of the separating lines ( 5, 6, 7 ) by a distance corresponding at the most to the length (L) of the scanned field ( 17 ) to thereby form continuous separating lines ( 5, 6, 7 ) through mutually flush separating line sections ( 18 ).

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Номер записи: 14

06-09-2012 дата публикации

Laser processing method and laser processing device

Номер: US20120223061A1

Автор: Etsuji Ohmura, Takafumi Atsumi, Yuji Ikeda

Принадлежит: Aisin Seiki Co Ltd

A laser processing method for forming a modification region serving as a starting point of cutting inside a member to be cut along a planned cutting line by relatively moving an optical axis of a condenser lens along the planned cutting line of the member and by irradiating the member with focused laser light, wherein a plurality of cross-sectional focused spots is simultaneously formed on a section which is perpendicular to the optical axis of the condenser lens at positions having a predetermined depth from a surface of the member and which is parallel to the surface and, at that time, at least one cross-sectional focused spot of the plurality of cross-sectional focused spots is formed on a projection line of the planned cutting line onto the cross section to form one or more inside modification regions having a desired shape.

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Номер записи: 15

13-09-2012 дата публикации

Apparatus and method for optical isolation

Номер: US20120229910A1

Автор: Michael Kevan Durkin, Stewart Thomas Ingram

Принадлежит: SPI LASERS UK LTD

Provided herein is an apparatus for optically isolating a light beam from a laser, comprising an optical isolator configured to isolate a light beam having a beam quality; a reference plane; an output connector disposed at the output of the optical isolator, wherein the output connector is configured with a common collimator interface to connect to a collimator which is capable of being mechanically referenced to the reference plane; a first lens arrangement disposed proximal to a distal end of the output connector, wherein the first lens arrangement is selected to provide an output light beam having a predetermined divergence. The laser can be selected from the group consisting of a fiber laser, a disk laser and a rod laser. Also provided herein are a system, a plurality of lasers, and a method of providing a light beam that has a consistent divergence and distance from a reference plane.

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Номер записи: 16

27-09-2012 дата публикации

Wafer dividing method

Номер: US20120244682A1

Автор: Kei Tanaka

Принадлежит: Disco Corp

In a wafer dividing method, a wafer is held by a chuck table of a laser beam processing apparatus. A modified layer is formed by radiating a laser beam having a wavelength that transmits the laser beam through the wafer, while adjusting the beam convergence point to a position inside of the wafer, so as to form a pair of modified layers the interval of which is greater than the width of a cutting edge of a cutting blade and smaller than the width of planned dividing lines, on the back side of the wafer at both sides of each of the planned dividing lines. The wafer is adhered to a dicing tape and divided into individual devices by cutting along the dividing lines.

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Номер записи: 17

18-10-2012 дата публикации

Method for producing semiconductor light-emitting chip and semiconductor light-emitting chip

Номер: US20120261678A1

Автор: Daisuke Hiraiwa, Takehiko OKABE

Принадлежит: Showa Denko KK

In producing a semiconductor light-emitting chip whose substrate is composed of a sapphire single crystal, cracking in semiconductor light-emitting elements in the obtained semiconductor light-emitting chip is suppressed. A semiconductor light-emitting chip is obtained by forming, on an element-group formation substrate on a front surface of which semiconductor light-emitting elements are formed, the front surface being composed of a C-plane of a sapphire single crystal, dividing grooves extending toward a first direction along an M-plane of the sapphire single crystal and the front surface of the substrate from a substrate front surface side (step 103 ), forming first modified regions extending toward the first direction and second modified regions extending along the substrate front surface and toward a second direction different from the first direction in the substrate (step 104 and step 105 ), and dividing the element-group formation substrate using the first modified regions and the second modified regions (step 106 ).

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Номер записи: 18

25-10-2012 дата публикации

Method for dicing wafer stack

Номер: US20120267351A1

Автор: Shih-Tsun Huang

Принадлежит: Lingsen Precision Industries Ltd

A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.

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Номер записи: 19

29-11-2012 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20120302122A1

Автор: Harvey KALWEIT, Neil L. Sbar

Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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Номер записи: 20

20-12-2012 дата публикации

Water soluble mask for substrate dicing by laser and plasma etch

Номер: US20120322233A1

Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Applied Materials Inc

Methods of dicing substrates having a plurality of ICs. A method includes forming a mask comprising a water soluble material layer over the semiconductor substrate. The mask is patterned with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then etched through the gaps in the patterned mask to singulate the IC and the water soluble material layer washed off.

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Номер записи: 21

20-12-2012 дата публикации

In-situ deposited mask layer for device singulation by laser scribing and plasma etch

Номер: US20120322234A1

Автор: AJAY Kumar, Banqiu Wu, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Applied Materials Inc

Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.

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Номер записи: 22

20-12-2012 дата публикации

Laser and plasma etch wafer dicing using water-soluble die attach film

Номер: US20120322238A1

Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Wei-Sheng Lei

Принадлежит: Individual

Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. A method includes forming a mask above the semiconductor wafer. The semiconductor wafer is disposed on a water-soluble die attach film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The water-soluble die attach film is then patterned with an aqueous solution.

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Номер записи: 23

27-12-2012 дата публикации

Laser processing method

Номер: US20120329247A1

Автор: Takeshi Sakamoto

Принадлежит: Hamamatsu Photonics KK

For modulating laser light for forming a modified region SD 3 at an intermediate position between a position closer to a rear face 21 and a position closer to a front face 3 with respect to an object 1, a quality pattern J having a first brightness region extending in a direction substantially orthogonal to a line 5 and second brightness regions located on both sides of the first brightness region in the extending direction of the line 5 is used. After forming modified regions SD 1, SD 2 at positions closer to the rear face 21 but before forming modified regions SD 4, SD 5 at positions closer to the rear face 21 while using the front face 3 as a laser light entrance surface, the modified region SD 3 is formed at the intermediate position by irradiation with laser light modulated according to a modulation pattern including the quality pattern J.

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Номер записи: 24

17-01-2013 дата публикации

Laser processing machine

Номер: US20130015166A1

Автор: Chun-Hao Li

Принадлежит: Individual

A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

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Номер записи: 25

17-01-2013 дата публикации

Device for cutting plastic products provided in a continuous plastic band for use in the medical sector

Номер: US20130017289A1

Автор: Heinz Kieburg, Reiner Franzke

Принадлежит: B Braun Melsungen AG

Devices for cutting interconnected plastic products for use in the medical sector provided in a continuous band of plastic, comprising a laser, a laser control system and an optical acquisition and data processing unit are disclosed. Devices for the manufacture of plastic products, such as fillable or filled plastic containers for use in the medical sector, comprising a device for cutting interconnected plastic products provided in a continuous band of plastic as well as a process for cutting interconnected plastic products provided in a continuous band of plastic are disclosed. The optical acquisition unit may determine positional data for the interconnected plastic products provided in the band. From the positional data a cutting pattern may be calculated and transmitted to the laser control system. According to this cutting pattern, the position, intensity and focal point of the laser may be controlled by the laser control system, which may comprise a focusing optic, a deflection means and a beam-forming means.

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Номер записи: 26

17-01-2013 дата публикации

Method of processing optical device wafer

Номер: US20130017640A1

Автор: Hiroshi Morikazu, Yoko Nishino

Принадлежит: Disco Corp

A method of processing an optical device wafer having an optical device layer including an n-type semiconductor layer and a p-type semiconductor layer stacked over a sapphire substrate, a buffer layer therebetween, allowing peeling of the sapphire substrate. The method includes joining a transfer substrate to the optical device layer, breaking the buffer layer by irradiation with a pulsed laser beam from the sapphire substrate side of the wafer with the transfer substrate joined to the optical device layer, and peeling the sapphire substrate from the optical device wafer with the buffer layer broken, transferring the optical device layer onto the transfer substrate. The pulsed laser beam has a wavelength longer than an absorption edge of the sapphire substrate and shorter than an absorption edge of the buffer layer, and a pulse width set so that a thermal diffusion length will be not more than 200 nm.

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Номер записи: 27

14-03-2013 дата публикации

Limiting energy leakage during laser scoring of vehicle airbag coverings

Номер: US20130065041A1

Автор: Aaron Wisniewski, Mathew Barr

Принадлежит: Faurecia Interior Systems Inc

A covering for use over a vehicle airbag includes a skin layer and an attached foam layer. The foam layer is constructed from a polymer-based material that includes a polymer portion and an additive, and the additive may be selected to affect the energy transmission characteristics of the foam layer material when the covering is subjected to a laser scoring process that uses a laser light beam having a characteristic wavelength. The additive may decrease the amount of light energy transmitted through the material at the characteristic wavelength to limit the amount of energy leakage from one cut location to another during laser scoring. The decrease in light transmission through the material may be accompanied by an increase in the light absorption of the material, an increase in the amount of light reflected by the material, and/or an increase in a laser cutting rate of the material per unit energy.

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Номер записи: 28

21-03-2013 дата публикации

Systems and processes that singulate materials

Номер: US20130068736A1

Автор: Michael Mielke, Ramanujapuram A. Srinivas, Thor Wilbanks, Tim Booth

Принадлежит: Individual

Systems and methods for material singulation. According to some embodiments, methods for material singulation may include applying a first laser output to the material, the first laser output causing a modification of a material property of the material when exposed to the first laser output; and applying a second laser output to the material that was exposed to the first laser output to cause singulation of the material in such a way that surfaces created by the singulation of the material are substantially free from defects.

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Номер записи: 29

28-03-2013 дата публикации

LASER CRYSTALLIZATION OF THIN FILMS ON VARIOUS SUBSTRATES AT LOW TEMPERATURES

Номер: US20130075377A1

Автор: Cheng Gary J., Zhang Martin Y.

Принадлежит: PURDUE RESEARCH FOUNDATION

A method and system are provided for crystallizing thin films with a laser system. The method includes obtaining a thin film comprising a substrate and a target layer that contains nano-scale particles and is deposited on the substrate. The heat conduction between the target layer and the substrate of the thin film is determined based on thermal input from the laser system to identify operating parameters for the laser system that cause crystallization of the nano-scale particles of the target layer in an environment at near room temperature with the substrate remaining at a temperature below the temperature of the target layer. The laser system is then operated with the determined operating parameters to generate a laser beam that is transmitted along an optical path to impinge the target layer. The laser beam is pulsed to create a localized rapid heating and cooling of the target layer. 1. A method of inducing crystallization in thin films with a laser system , the method comprising:obtaining a thin film comprising a substrate and a target layer deposited on the substrate, wherein the target layer comprises nano-scale particles;determining the heat conduction between the target layer and the substrate of the thin film based on thermal input from the laser system to identify operating parameters for the laser system that cause crystallization of the nano-scale particles of the target layer in an environment at near room temperature with the substrate remaining at a temperature below the temperature of the target layer;transmitting a laser beam of the laser system along an optical path to impinge the target layer of the thin film; and thenpulsing the laser beam to create a localized rapid heating and cooling of the target layer, wherein the laser system is operated at the operating parameters identified in the determining step to crystallize the nano-scale particles of the target layer and maintain the substrate at a temperature below the temperature of the target ...

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Номер записи: 30

11-04-2013 дата публикации

Ablation method for die attach film

Номер: US20130087949A1

Автор: Nobuyasu Kitahara

Принадлежит: Disco Corp

An ablation method of applying a laser beam to a die attach film to perform ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a fine powder of oxide having absorptivity to the wavelength of the laser beam to at least a subject area of the die attach film to be ablated, thereby forming a protective film containing the fine powder on at least the subject area of the die attach film, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the die attach film after performing the protective film forming step.

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Номер записи: 31

18-04-2013 дата публикации

Transparent material processing with an ultrashort pulse laser

Номер: US20130095260A1

Автор: Alan Y. Arai, Fumiyo Yoshino, James Bovatsek

Принадлежит: IMRA America Inc

Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

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Номер записи: 32

13-06-2013 дата публикации

Anti-spatter composition

Номер: US20130146571A1

Автор: Gigi P. Streeter, James M. Noe, Michael G. Palmiter

Принадлежит: Barnes Group Inc

An anti-spatter composition for use with the laser cutting of titanium or titanium containing materials. The anti-spatter composition includes Lecithin and one or more organic solvents. The one or more organic solvents are absent halogen and halogen containing compound. The anti-spatter composition can also include surfactant and water. The surfactant is generally halogen free.

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Номер записи: 33

20-06-2013 дата публикации

OVERLAY WELDING METHOD AND OVERLAY WELDING APPARATUS

Номер: US20130153543A1

Автор: Tsubota Shuho, Tsuruta Yohei

Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

To facilitate overlay welding while securing a certain hardness of an overlaid portion and preventing welding defects, an overlay welding method for performing overlay welding on a surface P to be overlaid of a base material includes a preparing step of forming a bottomed depression with the surface P to be overlaid being a circumferential surface thereof, and an overlaying step at which a filler material is fed toward a bottom face of the depression and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion W reaching the surface P to be overlaid, while filling the bottom face of the depression with a melted filler material. 1. An overlay welding method for performing overlay welding on a surface to be overlaid of a base material , the method comprising:a preparing step of forming a bottomed depression, with the surface to be overlaid being a circumferential surface thereof; andan overlaying step at which a filler material is fed toward a bottom face of the depression, and a laser beam as a heat source is irradiated on the bottom face of the depression to which the filler material is fed, thereby forming an overlaid portion reaching the surface to be overlaid, while filling the bottom face of the depression with the melted filler material.2. The overlay welding method according to claim 1 , wherein a new overlaid portion is further layered on the formed overlaid portion at the overlaying step.3. The overlay welding method according to claim 1 , wherein the filler material is heated and fed at the overlaying step.4. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , the base material is preheated before forming the overlaid portion claim 1 , and the base material is post-heated after the overlaid portion is formed.5. The overlay welding method according to claim 1 , wherein at the overlaying step claim 1 , feeding of the filler ...

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Номер записи: 34

27-06-2013 дата публикации

MOVING ENCLOSURES FOR LASER EQUIPMENT

Номер: US20130161300A1

Автор: Zeygerman Leonid, Zimmermann Christian

Принадлежит: Trumpf, Inc.

Moving enclosures for laser equipment are provided. A machine tool installation is disclosed, including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head; (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head. 1. A machine tool comprising:a laser head configured to be movable in two orthogonal directions with respect to a workpiece support and to direct laser light onto a workpiece positioned on the workpiece support;a skirt mounted to move with the laser head in at least a first of the two orthogonal directions and positioned to intercept laser light reflecting in the first of the two orthogonal directions from the workpiece, the skirt defining an opening arranged to permit light reflecting from the workpiece in the second of the two orthogonal directions; anda protective cover mounted to move with the laser head in the first of the two orthogonal directions while permitting relative movement of the laser head with respect to the protective cover in the second of the two orthogonal directions, the protective cover positioned to intercept light reflected off of the workpiece in the second of the two orthogonal directions.2. The machine tool of wherein the skirt is configured to move vertically with the laser head.3. The machine tool of wherein the skirt is configured to move vertically independently of the laser head.4. The machine tool of wherein the skirt is configured to move horizontally claim 1 , in a second direction orthogonal to said lateral movement claim 1 , ...

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Номер записи: 35

18-07-2013 дата публикации

Methods and systems for laser processing of coated substrates

Номер: US20130183837A1

Автор: Alan Y. Arai, Gyu Cheon Cho, Jingzhou Xu

Принадлежит: IMRA America Inc

Examples of methods and systems for laser processing of materials are disclosed. Methods and systems for singulation of a wafer comprising a coated substrate can utilize a laser outputting light that has a wavelength that is transparent to the wafer substrate but which may not be transparent to the coating layer(s). Using techniques for managing fluence and focal condition of the laser beam, the coating layer(s) and the substrate material can be processed through ablation and internal modification, respectively. The internal modification can result in die separation.

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Номер записи: 36

25-07-2013 дата публикации

Processing method for wafer

Номер: US20130189806A1

Автор: Hitoshi Hoshino

Принадлежит: Disco Corp

A wafer has, on a front face thereof, a device region in which a device is formed in regions partitioned by a plurality of scheduled division lines. An outer peripheral region surrounds the device region. A reflecting film of a predetermined width is formed from the outermost periphery of the wafer on a rear face of the wafer corresponding to the outer peripheral region. The front face side of the wafer is held in a chuck table, and a focal point of a pulsed laser beam of a wavelength having permeability through the wafer is positioned in the inside of the wafer corresponding to the scheduled division lines. The pulsed laser beam is irradiated from the rear face side of the wafer to form modified layers individually serving as a start point of division along the scheduled division lines in the inside of the wafer.

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Номер записи: 37

08-08-2013 дата публикации

METHOD FOR MANUFACTURING A COMPONENT BY SELECTIVE LASER MELTING

Номер: US20130199013A1

Автор: Graichen Andreas

Принадлежит:

A method of manufacturing a component by selective laser melting and to provide heat treatment to the component is provided. The method includes building a heat treatment device adapted to provide a heat treatment to the component as part of the same selective laser melting for manufacturing the component and providing a heat treatment to the component by the heat treatment device. 115-. (canceled)16. A method for manufacturing a component by selective laser melting , comprising:building a heat treatment device adapted to provide a heat treatment to the component as part of the same selective laser melting for manufacturing the component; andproviding a heat treatment to the component by the heat treatment device.17. The method according to claim 16 ,wherein the heat treatment device is spatially positioned in relation to the component, such that the heat treatment device is adapted to provide the heat treatment to the component.18. The method according to claim 16 ,wherein the component is made of an electrically and thermally conductive material.19. The method according to claim 16 ,wherein the heat treatment device is coil shaped.20. The method according to claim 16 ,wherein the coil shaped heat treatment device circumferentially encircles the component.21. The method according to claim 16 ,wherein the component is manufactured onto a device, for repairing the device.22. The method according to claim 21 , further comprising:providing cooling to the device by a cooling arrangement.23. The method according to claim 22 ,wherein the cooling arrangement further comprises a holder for holding the component and having an integrated cooling channel through which a cooling medium flows.24. The method according to claim 23 ,wherein the holder is made of an electrically and magnetically insulating material.25. The method according to claim 22 ,wherein cooling is provided to the device during SLM of the component and heat treatment of the component.26. The method according ...

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Номер записи: 38

08-08-2013 дата публикации

Methods for scribing of semiconductor devices with improved sidewall passivation

Номер: US20130203239A1

Автор: Bernard F. Phlips, Hartmut F.W. Sadrozinski, Marc Christophersen, Vitaliy Fadeyev

Принадлежит: CALIFORNIA (SANTA CRUZ), University of, Regents of, US Naval Research Laboratory NRL

A method of singulating semi-conductor devices in the close proximity to active structures by controlling interface charge of semiconductor device sidewalls is provided that includes forming a scribe on a surface of a semi-conductor devices, where the scribe is within 5 degrees of a crystal lattice direction of the semi-conductor device, cleaving the semiconductor device along the scribe, where the devices are separated, using a coating process to coat the sidewalls of the cleaved semiconductor device with a passivation material, where the passivation material is disposed to provide a fixed charge density at a semiconductor interface of the sidewalls, and where the fixed charge density interacts with charge carriers in the bulk of the material.

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Номер записи: 39

15-08-2013 дата публикации

In situ inductive ablation meter

Номер: US20130206738A1

Автор: Charles E. Wickersham

Принадлежит: First Solar Inc

Real time monitoring and detection of the depths of laser scribes used during pulsed laser ablation processes. During a laser scribing process, sensors are used to determine in real time an amount of ablated material from a substrate undergoing the process. Laser scribing can be terminated when the amount of ablated material as detected by the sensors corresponds to a desired scribe depth.

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Номер записи: 40

29-08-2013 дата публикации

Apparatus and method for repair of defects in an electronic energy control or display device

Номер: US20130225027A1

Автор: Harvey KALWEIT, Neil L. Sbar

Принадлежит: Sage Electrochromics Inc

An apparatus for repair of a defect in an electronic energy control device may include a position indicating means for indicating a position at which to fixedly position a mounting unit relative to a portion of an electronic energy control device including a defect to be repaired, where the device is fixed in position. An imaging and repair assembly of the apparatus has an optical imaging range and a laser repair range. When the mounting unit is mounted to a support surface to fixedly position the mounting unit at the position indicated by the position indicating means and the imaging and repair assembly is attached to the mounting unit, the portion of the electronic energy control device is within the imaging range and the repair range.

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Номер записи: 41

26-09-2013 дата публикации

DECORATIVE GLASS CONTAINER AND METHOD FOR MANUFACTURING DECORATIVE GLASS CONTAINER

Номер: US20130248528A1

Автор: Fushimi Kunihiro

Принадлежит: KOA GLASS CO., LTD.

Provided are a decorative glass container having clear boundary lines and good adhesion properties, and a method for manufacturing such a decorative glass container. The decorative glass container having, a lower layer including a thick wall portion and a thin wall portion, a vapor-deposition layer patterned by a forming region and a non-forming region, and an overcoat layer made of a UV curable resin, on the upper part of the glass container in order, and the method for manufacturing the decorative glass container, in which the forming region of the vapor-deposition layer is disposed on the upper part of the thick wall portion of the lower layer, the non-forming region of the vapor-deposition layer is disposed on the upper part of the thin wall portion of the lower layer by means of laser processing or the like, and a contact region is provided in which the lower layer and the overcoat layer are in direct contact with each other by way of the non-forming region of the vapor-deposition layer. 1. A decorative glass container comprising:a lower layer including a thick wall portion and a thin wall portion;a vapor-deposition layer patterned by a forming region and a non-forming region; andan overcoat layer made of a UV curable resin, on the upper part of the glass container in order,wherein the forming region of the vapor-deposition layer is disposed on the upper part of the thick wall portion of the lower layer, the non-forming region of the vapor-deposition layer is disposed on the upper part of the thin wall portion of the lower layer by a laser processing, and a contact region is formed in which the lower layer and the overcoat layer are in direct contact with each other by way of the non-forming region of the vapor-deposition layer.2. The decorative glass container according to claim 1 , further comprising a patterned decorative layer which is formed between the patterned vapor-deposition layer and overcoat layer and is overlapped with the patterned vapor- ...

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Номер записи: 42

26-09-2013 дата публикации

Piezoelectric substrate for the study of biomolecules

Номер: US20130249530A1

Автор: Minrui Yu, Robert H. Blick

Принадлежит: WISCONSIN ALUMNI RESEARCH FOUNDATION

A method of forming extremely small pores in a substrate may be used to produce, for example, an apparatus for the study of biological molecules, by providing a small pore in a piezoelectric substrate having electrodes, the latter that may be energized to change the pore dimensions.

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Номер записи: 43

26-09-2013 дата публикации

BATTERY ELECTRODE AND METHOD FOR PRODUCING SAME

Номер: US20130252086A1

Автор: Kasper Michael, STERN Rainer

Принадлежит: Zentrum Fuer Sonnenenergie- und Wasserstoff-Forsch ung Baden-Wuerttemberg Gemeinnuetzige Stiftung

In order to allow for maximum freedom of design in the selection of an electrode or battery shape, a compact configuration and low production costs, the invention specifies a battery electrode and a method for producing same, wherein a collector substrate is coated with a coating film and at least one arrester region is produced thereon by removing the coating film by means of laser ablation. 1. A method for producing a battery electrode , the method comprising:forming a coating film on a first side of a collector substrate, including applying an ink-like coating film on the first side of the collector substrate;drying and curing the applied coating film;calendering the coated collector substrate; andforming at least one arrester region on the first side of the collector substrate including by removing the coating film using laser ablation.2. The method as claimed in claim 1 , further comprising forming the coating film on a second side of the collector substrate claim 1 , the second side of the collector substrate opposite the first side of the collector substrate.3. The method as claimed in claim 2 , further comprising forming at least one arrester region on the second side of the collector substrate claim 2 , including removing the coating film on the second side of the collector substrate using laser ablation.4. The method as claimed in claim 1 , wherein the step of removing the coating film on the first side of the collector substrate includes removing a layer of the collector substrate from its first side using the laser ablation in the arrester region on the first side of the collector substrate.5. The method as claimed in claim 4 , further comprising contacting the collector substrate in the at least one arrester region on the first side of the collector substrate using by a connection lug immediately after forming the at least one arrester region on the first side of the collector substrate.6. The method as claimed in claim 5 , further comprising laser ...

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Номер записи: 44

03-10-2013 дата публикации

DEVICE FOR CUTTING A STRUCTURE INCLUDING WIRE-LIKE NANOSCALE OBJECTS, AND RELATED METHOD

Номер: US20130256280A1

Автор: Boulanger Pascal, Gobert Olivier, Sublemontier Olivier

Принадлежит: Commissariat A L'Energie Atomique Et Aux Energies Alternatives

A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure. 114-. (canceled)15. A device for cutting a structure including wire-like nanoscale objects roughly aligned in a same axis , comprising:a laser source configured to emit a laser beam in a form of laser pulses of a width of between 1 femtosecond and 300 femtoseconds;means to adjust energy of each laser pulse emitted to between 0.1 μJ and 10 mJ;means to set a repetition frequency of the emitted laser pulses to between 10 Hz and 10 kHz;means to polarize the emitted laser pulses linearly such that a laser pulse includes a first component in the axis of the nanoscale objects and/or of a second component in an axis perpendicular to the axis of the nanoscale objects;means to focus, on the structure, the linearly polarized laser pulses over a distance of centimeters, wherein a focal spot of the beam of laser pulses is between 10 μm and 500 μm, and a) an observation port transparent to the wavelength of the laser pulses,', 'b) a bracket on which the structure to be cut is positioned,', 'c) means to move the bracket so as to cause a relative displacement of the laser beam relative to the wire-like nanoscale objects of the structure, and', 'd) means to remove from the enclosure debris resulting from a cutting., 'a containment enclosure including16. A device according to claim 15 , in which the means to adjust the energy of each laser pulse emitted between 0.1 μJ and 10 mJ includes a half-wave lens and a polarizer claim 15 , and the means to adjust a frequency of repetition of the laser pulses emitted between 10 Hz and 10 kHz includes a Pockels cell.17. A device according to claim 15 , in which the means to evacuate claim 15 , out of the enclosure claim 15 , ...

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Номер записи: 45

17-10-2013 дата публикации

SYSTEM, METHOD AND APPARATUS FOR FIBER CEMENT UNDERLAYMENT OR BACKERBOARD

Номер: US20130269289A1

Автор: Battles Robert E., GILBERT Thomas C., Steele David H.

Принадлежит:

A building sheet includes a substantially flat board having a front surface, a back surface and a thickness defined therebetween. At least one of the front and back surfaces defines a surface direction. The thickness defines a thickness direction that is substantially perpendicular to the surface direction. Recesses are formed in at least one of the front and back surfaces. The recesses have a maximum dimension in the surface direction of less than 3/8 inch, such that each recess is too small to receive a head of the fastener. 1. A building sheet , comprising:a substantially flat board having a front surface, a back surface and a thickness defined therebetween, at least one of the front and back surfaces defines a surface direction and the thickness defines a thickness direction that is substantially perpendicular to the surface direction; andrecesses formed in said at least one of the front and back surfaces, the recesses have a maximum dimension in the surface direction of less than ⅜ inch, such that each recess is too small to receive a head of a fastener.2. A building sheet according to claim 1 , wherein the recesses are discontinuous and spaced apart from each other by flats that extend in the surface direction.3. A building sheet according to claim 1 , wherein the recesses are configured to be crushed upon installation of fasteners therein claim 1 , such that heads of the fasteners are substantially flush with the board in the surface direction upon installation.4. A building sheet according to claim 1 , wherein the building sheet is a fiber cement product.5. A building sheet according to claim 1 , wherein the building sheet is a backer board or an underlayment claim 1 , and the thickness is about ¼ inch to about ½ inch.6. A building sheet according to claim 1 , wherein the recesses have three-dimensional shapes comprising pyramidal shapes claim 1 , semi-spherical shapes claim 1 , conical shapes claim 1 , or any combination thereof.7. A building sheet ...

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Номер записи: 46

31-10-2013 дата публикации

Method and Apparatus to Fabricate Vias in Substrates for Gallium Nitride MMICs

Номер: US20130288489A1

Автор: Donald Ronning, Paul Hoff

Принадлежит: Translith Systems LLC

A system for fabricating vias in SiC and CVD diamond substrates through controlled laser ablation using short pulse lengths and short wavelengths.

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Номер записи: 47

07-11-2013 дата публикации

METHOD FOR PRODUCING AN RFID TRANSPONDER

Номер: US20130291375A1

Автор: Tavilampi Matti, VIRTANEN JUHANI

Принадлежит: SMARTRAC IP B.V.

A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet. 122-. (canceled)23. A method for producing an RFID transponder , the method comprising:attaching an RFID chip onto a conductive sheet; andcutting a portion of an antenna element from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet.24. The method according to claim 23 , further comprising:forming a first electrical connection between a first contact element of the chip and the conductive sheet;forming a second electrical connection between a second contact element of the chip and the conductive sheet; andcutting a region of the conductive sheet located between said contact elements by at least one of heating or ablating the conductive material of the sheet with the laser beam after the electrical connections have been formed.25. The method according to claim 24 , wherein the laser beam is arranged to propagate through a groove cut in the conductive sheet such that an intensity of laser radiation at a surface of the chip is smaller than 10% of a maximum intensity of the laser beam during cutting the region of the conductive sheet located between said contact elements.26. The method according to claim 25 , wherein a part of the laser radiation impinges on the surface of the chip claim 25 , and the intensity of the laser radiation impinging on the surface of the chip is limited to be smaller than or equal to 10% of the maximum intensity of the laser beam impinging on the conductive sheet.27. The method according to claim 25 , wherein a divergence angle of the laser beam and a distance between the conductive sheet and the chip have been selected such that a width of an area of the chip exposed to laser radiation is greater than three times a width of the laser spot on the ...

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Номер записи: 48

14-11-2013 дата публикации

WORKPIECE DIVIDING METHOD

Номер: US20130298744A1

Автор: Kumazawa Satoshi

Принадлежит: DISCO CORPORATION

A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips. The workpiece dividing method includes a workpiece preparing step of preparing the platelike workpiece, at least one side of the workpiece being formed as a mat surface, a holding step of holding the workpiece on a holding surface of a chuck table in the condition where the mat surface of the workpiece is exposed, a cut groove forming step of cutting the mat surface of the workpiece held on the holding surface of the chuck table by using a cutting blade to thereby form a cut groove with a remaining portion, and a laser cutting step of applying a laser beam to the workpiece along the cut groove to thereby cut the remaining portion. 1. A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips , said workpiece dividing method comprising:a workpiece preparing step of preparing said platelike workpiece, at least one side of said workpiece being formed as a mat surface;a holding step of holding said workpiece on a holding surface of a chuck table in the condition where said mat surface of said workpiece is exposed;a cut groove forming step of cutting said mat surface of said workpiece held on said holding surface of said chuck table by using a cutting blade to thereby form a cut groove with a remaining portion having a predetermined thickness measured from a back side of said workpiece; anda laser cutting step of applying a laser beam having an absorption wavelength to said workpiece along said cut groove formed by said cut groove forming step to thereby cut said remaining portion;whereby chipping occurring in cutting a front side of said workpiece by using said cutting blade is suppressed by said mat surface; anddebris generated in said laser cutting step is accommodated in said cut groove to suppress the exposure of said debris to the front side of said workpiece.2. The workpiece dividing method according to claim 1 , wherein the ...

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Номер записи: 49

14-11-2013 дата публикации

Odor reduction in laser processed material

Номер: US20130299491A1

Автор: Chow Christopher, Lindahl Brian, Miller Daniel B.

Принадлежит:

The present invention includes methods for treating a laser-processed material that produces an odor due to the laser processing. The present method includes treating the laser-processed material with heat to dissipate the odor from the material. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser processed material. The invention also includes an article made according to the method and apparatus for laser processing with the produced article having substantially reduced odor. 1. A method of reducing odors from a material , the odor caused by laser processing , the method comprising heating the material to a temperature sufficient to substantially reduce the odor.2. The method of wherein the material is a cellulosic claim 1 , fibrous or paper based material.3. The method of wherein the material is treated to more than one cycle of heating and cooling.4. The method of wherein the heating comprises the use of heat gun claim 1 , hot plate claim 1 , heated roller claim 1 , laser claim 1 , oven claim 1 , heat lamp claim 1 , heated gas claim 1 , microwaves or combinations thereof.5. The method of wherein the material is heated above 210° F.6. The method of wherein the material is heated to between about 210° F. and about 500° F.7. The method of wherein the material is heated to below a scorching temperature of the material.8. The method of wherein the odor is reduced by at least 90% compared to non heat treated material.9. The method of wherein the heating is performed after processing by the laser converting system.10. The method of wherein the heating is performed concurrently with the laser processing.11. An article comprising material processed using a laser wherein an odor generated by the laser processing is substantially reduced or eliminated with heat treatment.12. The article of wherein the article is ...

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Номер записи: 50

14-11-2013 дата публикации

Odor reduction in laser processed material with curl reduction

Номер: US20130299492A1

Автор: Chow Christopher, Lindahl Brian, Miller Daniel B.

Принадлежит:

The present invention includes methods for treating laser-processed materials having an odor generated during the laser processing. The present method includes treating the laser-processed materials with heat to dissipate the odor from the material. The laser processed material may be secured to avoid curling during the heating process. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser-processed material. The invention also includes articles made according to the method and apparatus for producing laser processed materials having substantially reduced odor. 1. A method of reducing odors from a material generated from laser processing , the method comprising heating the material to a temperature sufficient to substantially reduce the odor , and retaining the material in a substantially flat position prior to heating to reduce curling.2. The method of wherein the material comprises natural or organic material.3. The method of wherein the material is cellulosic claim 2 , fibrous claim 2 , paper based material claim 2 , silk claim 2 , leather claim 2 , flax or combinations thereof.4. The method of wherein the material comprises manmade polymers.5. The method of wherein the material comprises polycarbonate claim 4 , acrylic claim 4 , polyester or combinations thereof.6. The method of wherein the material is a food product.7. The method of wherein the method further comprises cooling of the material.8. The method of wherein the heating comprises the use of infrared sources of heat claim 1 , heat gun claim 1 , hot plate claim 1 , heated roller claim 1 , laser claim 1 , oven claim 1 , heat lamp claim 1 , heated gas claim 1 , microwaves or combinations thereof.9. The method of wherein the material is heated above 210° F.10. The method of wherein the material is treated to more than one cycle of heating and cooling. ...

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Номер записи: 51

21-11-2013 дата публикации

METHOD AND SYSTEM FOR CUTTING SHEET-LIKE OR PLATE-LIKE OBJECTS

Номер: US20130306608A1

Автор: Schaefer Tim

Принадлежит: LI-TEC BATTERY GMBH

What is described is: a method for cutting leaf-like or plate-like objects, in particular electrodes and/or separators for constructing an electrochemical energy store or parts of such electrodes or separators, wherein the cutting method has the following steps: (S) leading the objects to be cut () up to a laser cutting apparatus (), (S) cutting the objects () with the laser cutting apparatus (), and (S) performing processing operations at the cutting edges () in order to reduce micro-short-circuits. The step (S) of performing operations at the cutting edges () for reducing micro-short-circuits can comprise (S) structuring of the cutting edges () and/or application of support materials to the cutting edges (). Also described is: a system () for cutting leaf-like or plate-like objects (), in particular for cutting electrodes and/or separators for constructing an electrochemical energy store or parts of such electrodes or separators, wherein the cutting system () has a transport apparatus (), which is designed to lead the objects () to be cut up to a laser cutting apparatus (), a laser cutting apparatus () which is designed to cut the objects (), and a processing apparatus () which is designed to perform processing operations at the cutting edges () so as to reduce micro-short-circuits. 11. A method for cutting sheet-like or plate-shaped objects () , particularly electrodes and/or separators for the purpose of constructing an electrochemical energy storage or parts of such electrodes or separators , wherein the cutting method comprises the steps:{'b': 1', '1', '2, '(S) advancing the objects () to be cut to a laser cutting apparatus (),'}{'b': 2', '1', '2, '(S) cutting the objects () with the laser cutting apparatus (), and'}{'b': 3', '3, '(S) performing processing operations at the cutting edges () so as to reduce micro short-circuits.'}233. The method according to claim 1 , characterized in that the step (S) of performing processing operations at the cutting edges () ...

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Номер записи: 52

28-11-2013 дата публикации

Methods and Systems for Separating an Edge Portion of a Workpiece Using a Laser

Номер: US20130313235A1

Автор: Demel Peter, Grill Markus, Hagenlocher Tobias, Kohlloeffel Ralf, von Driesch Ralf, Wadehn Wolf

Принадлежит: TRUMPF LASER- UND SYSTEMTECHNIK GMBH

A method for cutting off an edge portion of a workpiece includes applying a laser to the workpiece to form multiple individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the multiple individual severing cuts being arranged together along the edge portion. Applying the laser to the workpiece to form the multiple individual severing cuts includes, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, in which the translation of the laser cutting head or the workpiece continues at least until the edge is detected. 112-. (canceled)13. A method for cutting off an edge portion of a workpiece , the method comprising:applying a laser to the workpiece to form a plurality of individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the plurality of individual severing cuts being arranged together along the edge portion,wherein applying the laser to the workpiece to form the plurality of individual severing cuts comprises, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, wherein the translation of the laser cutting head or the workpiece continues at least until the edge is detected.14. A method according to claim 13 , wherein claim 13 , for each individual severing cut claim 13 , the translation of the laser cutting head or the workpiece relative to one another continues for a predefined distance after the edge of the workpiece is detected.15. A method according to claim 13 , wherein the plurality of individual severing cuts comprises a first individual severing cut and a subsequent second individual severing cut claim 13 , and wherein a start position for the subsequent second individual severing cut corresponds to a ...

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Номер записи: 53

05-12-2013 дата публикации

Cutting Device with Endless Conveyor Belt and at least One Laser

Номер: US20130319983A1

Автор: Begemann Edwin, De Bruijne Jan Frederik Marco

Принадлежит: De Bruijne Delden Holding B.V.

A transport apparatus including an endless conveyor belt which is drivable by drive means, of which conveyor belt at least the outer side is embodied in a material which can withstand irradiation by the infrared laser radiation used to cut flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material present on the active upper part of the conveyor belt and carried along by this part. The invention further relates to a cutting device, comprising said transport apparatus. The transport apparatus is also used in a method for cutting flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material. 1. Cutting device , comprising a transport apparatus , which transport apparatus comprises an endless conveyor belt which is drivable by drive means , and comprising a laser for producing infrared laser radiation for cutting thin materials such as textile , non-woven , sandpaper , cardboard , plastic film material present on an active upper part of the conveyor belt and carried along by this part , wherein said laser is arranged such that a first part of said infrared laser radiation is radiated on said material held in front of the conveyor belt as seen from the transport direction for cutting a first part of said material , and a second part of said infrared laser radiation is radiated on said material arranged on said conveyor belt for cutting a second part of said material.2. Cutting device as claimed in claim 1 , comprising a supply roll for supplying said flat claim 1 , thin material to said conveyor belt claim 1 , which supply roll is arranged in front of the conveyor belt as seen from the transport direction claim 1 , and wherein said supply roll holds said material in front of the conveyor belt for cutting said first part of said material.3. Cutting device according to claim 1 , further comprising a suction device for sucking said first part of said material from said material.4. Cutting device according to ...

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Номер записи: 54

12-12-2013 дата публикации

METHOD OF GENERATING HIGH QUALITY HOLE, RECESS OR WELL IN SUBSTRATE

Номер: US20130330506A1

Автор: CHAIZE Adrien, DITTMANN Leander, HOYER Svend, Schmidt Christian

Принадлежит: ASAHI GLASS CO., LTD.

A method of generating a hole or well in an electrically insulating or semiconducting substrate, a hole or well in a substrate generated by this method, and an array of holes or wells in a substrate generated by the method. 1. A method of generating a hole , recess or well in a substrate , the method comprising:a) providing a substrate which is electrically insulating or semiconducting at room temperature, and placing it between at least two electrodes connected to a user-controlled voltage supply;b) melting substrate material in a region of the substrate where the hole, recess or well is to be generated by heating the region using a laser beam; andc) applying, by means of the user-controlled voltage supply, and the electrodes, a voltage of a user-defined magnitude across the region of the substrate, the voltage being sufficient to give rise to an increase in electrical current through the substrate or the region, thereby applying a defined amount of electrical energy to the substrate, and dissipating it from the substrate,wherein the substrate is sandwiched between a first and second modulation layer, the first and second modulation layer being located on opposite sides of the substrate,the first modulation layer being located on a side of the substrate which, in step b), is exposed to the laser beam,the first modulation layer allowing to define the size of the region where the hole, recess or well is to be generated, allowing to avoid surface contamination and/or redeposition of molten substrate material, and allowing to shield substrate surface from heat, the second modulation layer being located on a side opposite of the side on which the first modulation layer is located, andthe second modulation layer allowing to avoid surface contamination and/or redeposition of molten substrate material and allowing to shield substrate surface from heat.2. The method according to claim 1 , wherein the first and second modulation layer are made of a material which has a ...

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Номер записи: 55

02-01-2014 дата публикации

Substrate cores for laser through hole formation

Номер: US20140004361A1

Автор: Chong Zhang, Islam A. Salama, NIKHIL Sharma, Tao Wu

Принадлежит: Intel Corp

Substrate cores for laser through hole formation are described. Substrate core embodiments include a plurality of reinforcement material layers and a microfiller loaded resin disposed between the plurality of reinforcement material layers. Microfiller and reinforcement materials are selected to reduce opto-thermal mismatch for a laser of a predetermined bandwidth. In embodiments, the reinforcement material may include a fibrous polymer, reducing the thermal contrast with the microfiller loaded resin, and/or include a chromophore that absorbs within the laser bandwidth. In further embodiments, the microfiller is of a material having a high melting temperature to reduce thermal contrast with the reinforcement material.

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Номер записи: 56

09-01-2014 дата публикации

Multi-layer mask for substrate dicing by laser and plasma etch

Номер: US20140011337A1

Автор: Brad Eaton, James M. Holden, Saravjeet Singh, Todd Egan, Wei-Sheng Lei

Принадлежит: Individual

Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a first mask material layer soluble in a solvent over the semiconductor substrate and a second mask material layer, insoluble in the solvent, over the first mask material layer. The multi-layered mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is then plasma etched through the gaps in the patterned mask to singulate the IC with the second mask material layer protecting the first mask material layer for at least a portion of the plasma etch. The soluble material layer is dissolved subsequent to singulation to remove the multi-layered mask.

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Номер записи: 57

16-01-2014 дата публикации

SPECTACLE LENS AND METHOD AND APPARATUS FOR MAKING THE SAME

Номер: US20140016083A1

Автор: Holtmann Simon, Macionczyk Frank

Принадлежит:

A spectacle lens has a colored mark, a colored graphics image with a predeterminable color and brightness impression. The spectacle lens includes a lens body having a light-refracting effect and having a surface with an interference layer system arranged on the surface. 1. A spectacle lens for a wearer of spectacles , the spectacle lens comprising:a lens body having a light refracting effect and a surface;an interference layer system arranged on said surface;{'sub': '10', 'said interference layer system having a first surface region made up of a first layer stack having a first stack thickness (D);'}{'sub': 1', '1, 'said first layer stack having a first thin layer having a first layer thickness (d) and said first thin layer being made of an optically transparent first material having a first refractive index (n);'}said interference layer system having a second surface region different than said first surface region and said second surface region including a second layer stack;{'sub': 20', '10, 'said second layer stack having a second stack thickness (D) different than said first stack thickness (D) and said second layer stack further including said first layer stack;'}said interference layer system having a third surface region different than said first surface region and said second surface region;{'sub': 30', '10', '20, 'said third surface region including a third layer stack having a third stack thickness (D) different from said first stack thickness (D) and said second stack thickness (D);'}{'sub': '3', 'said third layer stack including said second layer stack and a second thin layer having a second layer thickness (d);'}said second thin layer being made of an optically transparent second material; and,{'sub': 2', '2, 'said second material being different from the adjacent optically transparent material of said second layer stack and having a second index of refraction (n) different from the index of refraction (n) of the adjacent optically transparent material ...

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Номер записи: 58

16-01-2014 дата публикации

Laser scribing and plasma etch for high die break strength and clean sidewall

Номер: US20140017881A1

Автор: AJAY Kumar, Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Tong Liu, Wei-Sheng Lei

Принадлежит: Individual

In embodiments, a hybrid wafer or substrate dicing process involving an initial laser scribe and subsequent plasma etch is implemented for die singulation. The laser scribe process may be used to cleanly remove a mask layer, organic and inorganic dielectric layers, and device layers. The laser etch process may then be terminated upon exposure of, or partial etch of, the wafer or substrate. In embodiments, a multi-plasma etching approach is employed to dice the wafers where an isotropic etch is employed to improve the die sidewall following an anisotropic etch. The isotropic etch removes anisotropic etch byproducts, roughness, and/or scalloping from the anisotropically etched die sidewalls after die singulation.

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Номер записи: 59

27-02-2014 дата публикации

CUTTING TOOL AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME

Номер: US20140054275A1

Автор: Enami Teruhiro, Kobayashi Yutaka, Murase Hiroyuki, Nakamae Kazuo, Ono Mamoru, Sakata Toshimitsu, TANAKA Katsuyuki, Yamamoto Katsuko

Принадлежит:

Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance. Provided are a cutting tool manufacturing method in which a cutting tool material is cut by using, as a laser beam, a laser beam formed by combining two linearly polarized laser beams so that the directions of polarization of the two linearly polarized laser beams are at right angles to each other; a cutting tool manufacturing method in which a circularly polarized laser beam is used as a laser beam; a cutting tool manufacturing method in which a randomly polarized laser beam is used as a laser beam; a cutting tool manufactured by the manufacturing method; a cutting tool manufacturing apparatus that includes means for generating a combined laser beam formed of two linearly polarized laser beams, the directions of polarization of the two linearly polarized laser beams being at right angles to each other and an optical system that guides the combined laser beam to the cutting tool material; a cutting tool manufacturing apparatus that includes means for generating a circularly polarized laser beam; and a cutting tool manufacturing apparatus that includes means for generating a randomly polarized laser beam. 120.-. (canceled)21. A cutting tool manufacturing method for manufacturing a cutting tool by cutting a cutting tool material into a predetermined shape by causing a laser beam to scan the cutting tool material ,wherein a cutting-edge ridgeline is formed by forming a horning surface on a ridge line along which a surface of the cutting tool material on a side where the laser beam enters and a processed surface of the cutting tool material processed by the laser beam intersect.22. The cutting tool manufacturing method according to claim 21 ,wherein the cutting tool material is cut by using, as the laser beam, a laser beam formed by combining two linearly polarized laser beams so ...

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Номер записи: 60

06-03-2014 дата публикации

Leads incorporating a laser processed electrode

Номер: US20140067031A1

Автор: Eric M. Petersen, Steven R. Larsen

Принадлежит: Cardiac Pacemakers Inc

Medical devices may include an electrode that has been processed to increase its surface area. In some cases, an electrode may be processed using an ultrafast laser to produce an electrode surface that includes macrostructures formed within the electrode surface and nanostructures formed on the macrostructures. The nanostructures may be formed of material that was removed from the electrode surface in forming the macrostructures.

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Номер записи: 61

13-03-2014 дата публикации

Method for processing edge surface and edge surface processing apparatus

Номер: US20140073224A1

Автор: Daisuke Yamashita

Принадлежит: Toshiba Corp

An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including grinding a second surface of a wafer, the second surface opposite to a first surface of the wafer being stuck with a surface protection material, forming a protective film on the first surface, irradiating a portion including an outside edge of the wafer with laser light to remove the portion including the outside edge in a state that the wafer is rotating and an irradiation position of the laser light is approaching to a rotation axis of the wafer, an absorption ratio of the wafer to the laser light being higher than an absorption ratio of the surface protection material to the laser light, and removing the protective film.

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Номер записи: 62

20-03-2014 дата публикации

System and method for manufacturing an airfoil

Номер: US20140076868A1

Автор: Douglas Anthony Serieno, Jane Marie Lipkin, Sharon Trombly Swede, Zhaoli Hu

Принадлежит: General Electric Co

A system for manufacturing an airfoil includes a laser beam and a first fluid column surrounding the laser beam to create a confined laser beam directed at the airfoil. A liquid flowing inside the airfoil disrupts the first fluid column inside the airfoil. A method for manufacturing an airfoil includes confining a laser beam inside a first fluid column to create a confined laser beam and directing the confined laser beam at a surface of the airfoil. The method further includes creating a hole through the surface of the airfoil with the confined laser beam, flowing a liquid inside the airfoil, and disrupting the first fluid column with the liquid flowing inside the airfoil.

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Номер записи: 63

27-03-2014 дата публикации

METHODS AND SYSTEMS FOR IMAGING AND CUTTING SEMICONDUCTOR WAFERS AND OTHER SEMICONDUCTOR WORKPIECES

Номер: US20140083270A1

Автор: Clawson Paul J., Farnworth Warren M., Muntifering Tom A.

Принадлежит: MICRON TECHNOLOGY, INC.

Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes. 1. A system for singulating microelectronic devices from a microelectronic substrate , the microelectronic substrate having an infrared inhibiting layer covering at least a portion of one side of the microelectronic substrate , the system comprising:an X-ray source configured to emit X-rays;an X-ray detector spaced apart from the X-ray source, wherein the X-ray detector is configured to receive at least a portion of the X-rays from the X-ray source when the infrared inhibiting layer of the microelectronic substrate is positioned between the X-ray source and the X-ray detector; anda cutting device configured to respond to operating signals based at least in part on X-ray image information received from the X-ray detector, the operating signals controlling the path of the cutting device as the cutting device cuts the microelectronic substrate into the individual dies.2. The system of wherein the cutting device moves independently of the X-ray source.3. The system of claim 1 , further comprising a wafer holder configured to support the microelectronic ...

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Номер записи: 64

10-04-2014 дата публикации

Laser processing method and device

Номер: US20140097163A1

Автор: Fumitsugu Fukuyo, Kazuhiro Atsumi, Kenshi Fukumitsu, Koji Kuno, Masayoshi Kusunoki, Tatsuya Suzuki

Принадлежит: Hamamatsu Photonics KK

A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided. This laser processing method comprises a preparatory step of holding a lens at an initial position set such that a converging point is located at a predetermined position within the object; a first processing step (S 11 and S 12 ) of emitting a first laser beam for processing while holding the lens at the initial position, and moving the lens and the object relative to each other along a main surface so as to form a modified region in one end part of a line to cut; and a second processing step (S 13 and S 14 ) of releasing the lens from being held at the initial position after forming the modified region in the one end part of the line to cut, and then moving the lens and the object relative to each other along the main surface while adjusting the gap between the lens and the main surface after the release, so as to form the modified region.

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Номер записи: 65

07-01-2016 дата публикации

Systems and Methods for Restoring Blood Flow to a Vessel

Номер: US20160000450A1

Автор: Yu Yongyi Alan

Принадлежит:

In one illustrative embodiment, a thrombectomy device is disclosed. The thrombectomy device includes a treatment portion, comprising a reversibly-expandable framework configured to be deployed from within a microcatheter into a selected vasculature for removing thrombus or embolus. The thrombectomy device further includes a substantially tubular connection member disposed on a proximal end portion of the treatment portion configured to receive a terminal portion of a delivery member for positioning the treatment portion within the vasculature. The framework comprises structural features for engaging the thrombus or embolus including one or more of: framework peaks and valleys along a long axis of the treatment portion or a plurality of strut members. 1. A device for removing an occlusion within a biological vasculature , comprising: a substantially cylindrical, self-expandable cage capable of being shifted between a compact delivery configuration and an expanded treatment configuration;', 'wherein said self-expandable cage comprises a plurality of interconnected, elongate-rectangular, twisted cage struts configured to form a series of substantially diamond-shaped repeat units along a long axis of said cage in said expanded treatment configuration;', 'wherein intersecting corners of said diamond-shaped repeat units are configured to capturingly engage a portion of said occlusion for removal from said biological vasculature;', 'wherein when said cage is in said expanded configuration, proximal and distal end portions of said cage converge inwardly to form substantially close-ended proximal and distal cage end portions respectively; and, 'a treatment portion coupled with a distal end of a delivery wire, said treatment portion comprisinga hollow catheter configured to house said treatment portion and a portion of said delivery wire, and further configured for delivering said treatment portion in said delivery configuration to an occlusion site within said biological ...

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Номер записи: 66

06-01-2022 дата публикации

WIRE ARC ADDITIVE MANUFACTURING METHOD FOR HIGH-STRENGTH ALUMINUM ALLOY COMPONENT, EQUIPMENT AND PRODUCT

Номер: US20220001476A1

Автор: Liu Sheng, Zhang Chen, ZHANG DONGBIN, ZHU Junkai

Принадлежит:

The disclosure relates to the field of wire arc additive manufacturing, and specifically discloses a wire arc additive manufacturing method for a high-strength aluminum alloy component, equipment and a product. A high-strength aluminum alloy is modified by using a MXene nanomaterial, and wire arc additive manufacturing is performed by using the modified high-strength aluminum alloy as a raw material, and a nanosecond laser beam is applied during the wire arc additive manufacturing to achieve an enhanced arc cathode atomization cleanup function to remove impurities, thus obtaining a high-strength aluminum alloy component without defects. The disclosure can solve the problem of very difficult forming in wire arc additive manufacturing of a high-strength aluminum alloy, and also solve the problems of many pores, liability to crack and lots of impurities during additive manufacturing of the high-strength aluminum alloy, so that a high-strength aluminum alloy component without defects can be produced. 1. A wire arc additive manufacturing method for a high-strength aluminum alloy component , comprising:modifying a high-strength aluminum alloy by using a MXene nanomaterial;using the modified high-strength aluminum alloy as raw material for wire arc additive manufacturing;applying a nanosecond laser beam when manufacturing to achieve an enhanced arc cathode atomization cleanup function to remove impurities, andobtaining a high-strength aluminum alloy component without defects.2. The wire arc additive manufacturing method for a high-strength aluminum alloy component according to claim 1 , further comprising:S1: mixing the high-strength aluminum alloy with the MXene nanomaterial to obtain a MXene-modified high-strength aluminum alloy filler wire;S2: conveying the MXene-modified high-strength aluminum alloy filler wire to a specified position and performing arc starting to form a molten pool, and at the same time providing a nanosecond pulse laser beam for scanning movement to ...

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Номер записи: 67

07-01-2021 дата публикации

THIN-FILM DEVICES AND FABRICATION

Номер: US20210001426A1

Автор: Dixit Abhishek Anant, Martin Todd William, Pradhan Anshu A., Rozbicki Robert T., Strong Fabian

Принадлежит: VIEW, INC.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations. 122-. (canceled)23. A method of fabricating an optical device , the method comprising , in the following order:depositing a lower transparent conductor layer on a substantially transparent substrate;depositing a defect mitigation insulating (DMIL) layer on the lower transparent conductor layer;removing material down to the DMIL and a predefined depth of material from the lower transparent conductor layer in regions at predefined locations in a bus bar expose area along a side of the substantially transparent substrate;depositing an electrochromic device stack over the substantially transparent substrate; andremoving the electrochromic device stack at the predefined locations to expose the lower transparent conductor layer.24. The method of fabricating the optical device of claim 23 , wherein removing the electrochromic device stack at the predefined locations forms spaced punch through areas penetrating into the lower transparent conductor layer; and further comprising filling the spaced punch through areas with a material to form a bus bar.25. The method of fabricating the optical device of claim 24 ,wherein the spaced punch through areas form a plurality of separated scribe lines along the side of the substantially transparent substrate; andwherein the electrochromic device stack is at least partially intact between the separated scribe lines.26. The method of fabricating the optical device of claim 23 , wherein the bus bar ...

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Номер записи: 68

07-01-2021 дата публикации

METHODS OF USING LASER ENERGY TO REMOVE PARTICLES FROM A SURFACE

Номер: US20210001429A1

Автор: SCOGGINS Troy

Принадлежит:

Described are methods of using laser energy to remove particles from a surface, such as a porous surface, optionally without causing ablation to the surface. 1. A method of removing particles from a surface , the method comprising:applying laser energy to the surface at locations that include particles, so that an amount of applied laser energy is sufficient to cause the particles to separate from the surface, wherein the surface is porous and is either carbonaceous or ceramic.2. The method of wherein the particles are separated from the surface without causing substantial ablation of the surface.3. The method of claim 1 , wherein the laser energy applied is effective to reduce a measured value indicating an amount of particles at the surface claim 1 , by at least 50 percent claim 1 , as measured by a tape test method claim 1 , compared to the surface before applying the laser energy.4. The method of the applied laser energy is below a level that would remove 10 microns of material from the surface as measured using a digital optical microscope.5. The method of claim 1 , wherein the surface comprises a solid matrix that defines pores and the particles are derived from material of the solid matrix.6. The method of claim 1 , wherein the surface comprises porous graphite.7. The method of wherein the surface comprises porous alumina.8. The method of wherein the laser energy has a wavelength below 1200 nanometers.9. The method of wherein the surface is a surface of a component of an interior of a vacuum chamber.10. The method of comprising claim 1 , after applying the laser energy claim 1 , cleaning the surface using with ultrasonic cleaning.11. The method of comprising forming the surface by a machining process claim 1 , the particles are generated by the machining process.12. The method of claim 1 , wherein the particles comprise a carbonaceous material or ceramic.13. The method of claim 1 , wherein the particles comprise graphite.14. A surface prepared by a method ...

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Номер записи: 69

07-01-2016 дата публикации

LASER SYSTEM AND METHOD FOR PROCESSING SAPPHIRE

Номер: US20160001398A1

Автор: Kancharla Vijay, MAYNARD Steven, Mendes Marco, SARRAFI Rouzbeh, Sercel Jeffrey P., Shiner William

Принадлежит:

Laser processing of sapphire is performed using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm (hereinafter “QCW laser”). Laser processing of sapphire using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 10%) and in an inert gas atmosphere such as argon or helium. Laser processing of sapphire using a QCW laser may further include the use of an assist laser having a shorter wavelength and/or pulse duration to modify a property of the sapphire substrate to form absorption centers, which facilitate coupling of the laser light pulses of the QCW laser into the sapphire. 1. A method for laser processing a sapphire substrate , the method comprising:periodically switching on a power source to pulse a continuous wave laser, thereby operating the laser in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm;focusing the pulses of laser light at the sapphire substrate; andlaser processing the sapphire substrate with the pulses of laser light.2. The method of further comprising supplying inert gas in a vicinity of the sapphire substrate.3. The method of claim 2 , wherein the inert gas is selected from the group consisting of argon and helium.4. The method of claim 1 , wherein laser processing the sapphire substrate is selected from the group consisting of cutting claim 1 , scribing claim 1 , and drilling.5. The method of claim 1 , wherein laser processing includes cutting with a speed between about 10 and 40 inches per minute claim 1 , and wherein the sapphire substrate has a thickness between about 0.1 and about 1 mm.6. The method of claim 1 , wherein the laser is an ytterbium fiber laser.7. The method of claim 1 , wherein the laser is operated with a duty cycle ranging between about 1% and about 10%.8. The method of claim 1 , wherein ...

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Номер записи: 70

07-01-2016 дата публикации

PATTERNING CONDUCTIVE FILMS USING VARIABLE FOCAL PLANE TO CONTROL FEATURE SIZE

Номер: US20160001402A1

Автор: Dittli Adam, Gross Ken, Martinsen Robert J.

Принадлежит: NLIGHT PHOTONICS CORPORATION

A processing system directs a laser beam to a composite including a substrate, a conductive layer, and a conductive border. The location of a focus of the laser beam can be controlled to bring the laser beam into focus on the surfaces of the conductive materials. The laser beam can be used to ablatively process the conductive border and non-ablatively process the conductive layer by translating a focus-adjust optical system so as to vary laser beam diameter. 1. An optical processing system comprising:an objective lens situated to direct a processing optical beam to a target surface;a scanning system situated to scan the processing optical beam across the target surface;a focus-adjust optical system that includes a focus-adjust optical element and a focus actuator, the focus-adjust optical element situated to direct the optical beam to the objective lens, wherein the focus actuator is coupled to the focus-adjust optical element so as to translate the focus-adjust optical element along an axis of the objective lens so as to maintain a focus of the processing beam as the processing beam is scanned across the target surface; anda beam diameter actuator situated to translate the focus-adjust optical system so as to define a processing beam diameter at the target surface.2. The system of claim 1 , further comprising a controller coupled to the focus actuator so as to maintain the focus of the processing beam during scanning across the target surface.3. The system of claim 2 , further comprising a substrate stage that includes a stage actuator situated to position the target surface along the axis of the objective lens.4. The system of claim 3 , wherein the controller is coupled to the beam diameter actuator and the stage actuator and the controller translates the focus adjust optical system and the substrate stage based on a selected beam diameter.5. The system of claim 4 , wherein the beam diameter actuator produces stepwise translations of the focus adjust optical ...

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Номер записи: 71

05-01-2017 дата публикации

SYSTEMS AND METHODS FOR PERFORATING MATERIALS

Номер: US20170001265A1

Автор: Braden Robert L., Kruckenberg Teresa, Pujar Vijay V., Tiwari Sean

Принадлежит: Rohr, Inc.

Systems and methods for manufacturing laser-perforated nanoreinforced materials are disclosed. A honeycomb core may utilize a perforated top sheet and a microperforated overlay film coupled to the perforated top sheet. The perforated top sheet and/or the microperforated film may include thermally conductive nanomaterials. The perforations in the top sheet and the microperforations in the film may be laser drilled. The nanomaterials may dissipate heat generated by the laser drilling, allowing for increased perforation speeds. 1. A method of manufacturing an acoustic structure comprising:drilling a first plurality of holes in an overlay film, wherein the overlay film comprises nanoparticles;drilling a second plurality of holes in a composite substrate; andcoupling the overlay film to the composite substrate.2. The method of claim 1 , wherein the composite substrate comprises a composite ply and a surface film.3. The method of claim 1 , wherein the composite substrate comprises nanoparticles.4. The method of claim 1 , wherein a diameter of the second plurality of holes is at least five times greater than a diameter of the first plurality of holes.5. The method of claim 1 , wherein the nanoparticles comprise at least one of carbon nanotubes claim 1 , carbon nanofibers claim 1 , and graphene nanoplatelets.6. The method of claim 1 , wherein the coupling overlay film to the composite substrate is performed prior to the drilling the second holes.7. The method of claim 2 , wherein the surface film comprises nanoparticles.8. The method of claim 1 , wherein the first plurality of holes and the second plurality of holes are drilled with a laser. The present application is a divisional of, and claims priority to, U.S. application Ser. No. 14/261,154 entitled “SYSTEMS AND METHODS FOR PERFORATING MATERIALS” and filed on Apr. 24, 2014, the contents of which are incorporated by reference herein in their entirety.The present disclosure relates to perforating fiber reinforced ...

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Номер записи: 72

05-01-2017 дата публикации

ENHANCING STRENGTH IN LASER CUTTING OF CERAMIC COMPONENTS

Номер: US20170001266A1

Автор: Chinnakaruppan Palaniappan, Hum Phillip W., Li Michael M., Rammah Marwan, Sun Yulei

Принадлежит:

A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material. 1. A method for forming a ceramic component , comprising:irradiating a ceramic material using a laser-based process to form a cut;heating a region of the ceramic material adjacent to the cut; andremoving the region of the ceramic material.2. The method of claim 1 , wherein the operation of irradiating and the operation of heating occur at different times.3. The method of claim 1 , wherein:the operation of heating heats the region of the ceramic material with an outer portion of a laser beam used in the laser-based process; andthe outer portion has an energy insufficient to cut the ceramic material during the operation of irradiating.4. The method of claim 1 , wherein the operation of heating the region of the ceramic material forms a defect in the ceramic material.5. The method of claim 1 , wherein the operation of heating the region of the ceramic material forms micro-cracks in the ceramic material.6. The method of claim 5 , wherein the operation of removing the region of the ceramic material removes the micro-cracks in the ceramic material.7. The method of claim 5 , wherein the operation of removing the region of the ceramic material introduces additional micro-cracks in the ceramic material that are smaller than the micro-cracks.8. The method of claim 1 , wherein the operation of removing the region of the ceramic material removes a section of the ceramic material having a depth of approximately 15-25 microns.9. The ...

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Номер записи: 73

04-01-2018 дата публикации

MULTI-LASER SYSTEM AND METHOD FOR CUTTING AND POST-CUT PROCESSING HARD DIELECTRIC MATERIALS

Номер: US20180001425A1

Автор: Hannon Mathew, Mendes Marco, SARRAFI Rouzbeh, SCHOENLY Joshua, Sercel Jeffrey P., SOKOL Miroslaw, SONG Xiangyang

Принадлежит:

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser). 1. A method for laser cutting and post-cut processing a part from a hard dielectric material , the method comprising:cutting at least one part from a hard dielectric material using at least a first laser beam, wherein the first laser beam is emitted from a continuous wave laser operating in a quasi-continuous wave (“QCW”) mode so as to emit consecutive pulses of laser light at a wavelength ranging between about 1060 nm and about 1070 nm; andpost-cut processing cut edges of the at least one part using at least a second laser beam to bevel and/or polish the cut edges of the at least one part such that edge defects are reduced.2. The method of wherein the second laser beam is emitted from the continuous wave laser operating in the QCW mode.3. The method of wherein the second laser beam forms an angle of incidence relative to a surface of the cut part claim 1 , wherein the angle of incidence is greater than 0°.4. The method of wherein the second laser beam forms an angle of incidence relative to a surface of the cut part claim 1 , wherein the angle of incidence is in the ...

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Номер записи: 74

03-01-2019 дата публикации

METHOD AND SYSTEM FOR ADDITIVE-ABLATIVE FABRICATION

Номер: US20190001580A1

Автор: Gilan Ziv, Zenou Michael

Принадлежит: IO Tech Group Ltd.

A system of solid free form fabrication (SFF) is disclosed. The system comprises: receiving SFF data collectively pertaining to a three-dimensional shape of the object and comprising a plurality of slice data each defining a layer of the object. The system also comprises, for each of at least a few of the layers, dispensing a building material on a receiving medium, straightening the building material, and selectively ablating the building material according to respective slice data. 1. A system for solid free form fabrication (SFF) , the system comprising:an input for receiving SFF data, collectively pertaining to a three-dimensional shape of the object, said SFF data comprising a plurality of slice data each defining a layer of the object;a dispensing head configured for dispensing a building material;a leveling device for straightening said building material;an ablation system; anda controller for controlling said ablation system to selectively ablate said building material, for each of at least a few of said layers, according to slice data corresponding to said layer.2. The system according to claim 1 , further comprising at least one additional dispensing head configured for dispensing at least one additional building material onto said building material claim 1 , to fill vacant regions formed in said layer by said selective ablation claim 1 , wherein a resolution of said dispensing of said additional building material is less than a resolution of said selective ablation.3. The system according to claim 2 , wherein said additional building material is curable claim 2 , and said controller is configured to operate said ablation system also for at least partially curing said additional building material.4. The system according to any of claim 2 , wherein said controller is configured for operating said ablation system to remove a debris deposition of said additional building material on non-vacant regions.5. The system according to any of claim 2 , wherein said ...

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Номер записи: 75

03-01-2019 дата публикации

METHOD OF LASER CLEANING A TIRE INNER SURFACE, AND A TIRE

Номер: US20190001597A1

Автор: GRIFFOIN Jean-Claude Patrice Philippe, HELFEN Thomas Benedikt

Принадлежит:

The present invention is directed to a method of cleaning an innermost surface of a pneumatic tire, the surface having a residue deposited thereon, comprising the steps of: activating a laser to generate laser radiation; directing a pulse of laser radiation to impinge on an area of the innermost surface, the pulse of radiation having a pulse width and a fluence sufficient to remove at least part of the residue in the area to form a cleaned area; repeating the step of directing the pulse of radiation sequentially over the innermost surface to form a sequence of cleaned areas, the sequence of cleaned areas defining a stripe, the stripe following a continuous nonlinear path extending at least one circumference about the inner surface, the stripe having a stripe width W. The invention is further directed to a tire made by the method. 114-. (canceled)15. A pneumatic tire having a radially innermost circumferential innerliner surface , the surface comprising first regions covered by a residual material , and a plurality of stripe regions axially bounding the first regions , the stripe regions substantially devoid of the residual material; the stripe regions each having a stripe width; each stripe region circumscribing a nonlinear circumferential path along the innerliner surface; wherein the plurality of continuous nonlinear circumferential stripe regions are disposed in axial sequence across a predetermined axial width.16. The pneumatic tire of claim 15 , wherein the residual matter comprises a tire release agent.17. The pneumatic tire of claim 15 , wherein the nonlinear circumferential path comprises a sinusoidal path having a period and an amplitude.18. The pneumatic tire of claim 15 , wherein the ratio of period distance to amplitude distance ranges from 1.5 to 2.5 claim 15 , and the ratio of the amplitude to the stripe width ranges from 2.5 to 3.5 claim 15 , and the stripe width ranges from 5 mm to 15 mm.19. The pneumatic tire of claim 15 , wherein the nonlinear ...

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Номер записи: 76

05-01-2017 дата публикации

EDGE CHAMFERING METHODS

Номер: US20170001900A1

Автор: Marjanovic Sasha, Pastel David Andrew, Piech Garrett Andrew, Quintal Jose Mario, Schillinger Helmut, Tsuda Sergio, Wagner Robert Stephen, Yeary Andrea Nicole

Принадлежит:

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange. 1. A method of chamfering a material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;directing the laser beam focal line into the material at a first angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the material;directing the laser beam focal line into the material at a second angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a second plane at the second angle within the material, the second plane intersecting the first plane, andseparating the material along the first plane and the second plane by applying an ion-exchange process to the material, wherein during separating of the material along the first plane and the second plane the ion-exchange process is applied to the material for time t, wherein 10 min≦t≦120 min.2. The method of claim 1 , wherein directing the laser beam focal line into the material at a first angle of incidence to the material is directed to a first surface of the material and directing the laser beam focal ...

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Номер записи: 77

05-01-2017 дата публикации

Laser Cutting Strengthened Glass

Номер: US20170002601A1

Автор: Howard S. Bergh, Nicolas TIMMERMAN

Принадлежит: Kinestral Technologies Inc

Methods for cutting strengthened glass are disclosed. The methods can include using a laser. The strengthened glass can include chemically strengthened, heat strengthened, and heat tempered glass. Strengthened glass with edges showing indicia of a laser cutting process are also disclosed. The strengthened glass can include an electrochromic film.

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Номер записи: 78

07-01-2021 дата публикации

Optically Transparent Silk Hydrogels

Номер: US20210002335A1

Автор: Kaplan David L., MARELLI Benedetto, Mitropolous Alexander Nicholas, OMENETTO Fiorenzo G.

Принадлежит:

The present application relates to silk fibroin-based hydrogels, methods for making and using the same. 161-. (canceled)62. A composition comprising:a plurality of crystalized silk fibroin spheres, wherein the crystalized silk fibroin spheres have an average diameter of between about 10 nm and about 150 nm,the plurality of crystalized silk fibroin spheres arranged together to form a freestanding hydrogel structure having at least 60% optical transmittance in the visible spectrum.63. The composition of claim 62 , the freestanding hydrogel structure having at least 95% transmittance in the visible spectrum.64. The composition of claim 62 , the freestanding hydrogel structure having a compressive modulus of between about 2 kPa and about 20 kPa when measured with a crosshead speed of about 2.0 mm/hr.65. The composition of claim 62 , wherein the silk fibroin is crosslinked.66. The composition of claim 65 , wherein the silk fibroin is crosslinked with a crosslinking agent.67. The composition of claim 66 , wherein the crosslinking agent is an amine-to-amine crosslinker claim 66 , amine-to-sulfhydryl crosslinker claim 66 , carboxyl-to-amine crosslinker claim 66 , photoreactive crosslinker claim 66 , sulfhydryl-to-carbohydrate crosslinker claim 66 , sulfhydryl-to-hydroxyl crosslinker claim 66 , sulfhydryl-to-sulfhydryl crosslinker claim 66 , or any combination thereof.68. The composition of claim 66 , wherein the crosslinking agent is EDTA.69. A composition comprising:nanosized crystalline particles comprising silk fibroin polypeptides having an average molecular weight of between about 3.5 kDa and about 120 kDa,the nanosized crystalline particles having an average diameter of between about 10 nm and about 150 nm,the nanosized crystalline particles arranged together to form a freestanding hydrogel structure having at least 60% optical transmittance in the visible spectrum.70. The composition of claim 69 , the silk fibroin polypeptides having an average molecular weight of ...

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Номер записи: 79

13-01-2022 дата публикации

Method for the Lacquer-Removing Laser Machining of a Painted Workpiece

Номер: US20220009037A1

Автор: Lacour Thomas

Принадлежит: Marelli Automotive Lighting Reutlingen (Germany) GmbH

A method for the material-removing laser machining of a workpiece, comprising a substrate element made from a plastic with a surface, and a lacquer coating applied to the surface prior to the laser machining, wherein the lacquer coating can be removed from a workpiece with a three-dimensional extent in a large-area region of the surface. 1. A method for the material-removing laser machining of a workpiece , comprising a substrate element made from a plastic with a surface , and a lacquer coating applied to the surface prior to the laser machining , wherein the laser machining is carried out by a laser machining device which comprises a laser unit and a control unit for controlling the laser unit , the method comprising:arranging the workpiece in a machining position in a work region of the laser unit,generating values for operating parameters for operating the laser unit,{'b': '4', 'generating and emitting a laser beam by the laser unit () according to the generated values for the operating parameters,'}applying the emitted laser beam to the workpiece arranged in the machining position at a machining point in the region of the surface of the workpiece provided with the lacquer coating, so that material of the lacquer coating is removed locally at the machining point,moving the laser beam and thus also the machining point according to the generated values for the operating parameters by the laser unit relative to the workpiece along a work path in the region of the surface of the workpiece provided with the lacquer coating, so that material of the lacquer coating is removed along the work path,wherein the machining point is moved along a plurality of adjacent work paths, wherein adjacent work paths are so close to one another that a machining point of the laser beam on one work path adjoins or partially overlaps a machining point of the laser beam on an adjacent work path in order to remove material of the lacquer coating over a large region, and that the laser unit ...

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Номер записи: 80

13-01-2022 дата публикации

INTEGRATED ADDITIVE MANUFACTURING AND LASER PROCESSING SYSTEMS AND METHODS FOR CERAMIC, GLASS, AND SILICON CARBIDE APPLICATIONS

Номер: US20220009124A1

Автор: Bordia Rajendra, Brinkman Kyle S., Hong Yuzhe, HUANG HUA, Lei Jincheng, Mu Shenglong, Peng Fei, Tong Jianhua, Xiao Hai

Принадлежит:

A method for fabricating a protonic ceramic energy device includes: coating an electrolyte layer on an anode layer; and densifying the electrolyte layer by a rapid laser reactive sintering (RLRS) process on the electrolyte layer and/or the anode layer to form a half-cell comprising a dense electrolyte and a porous anode. 120-. (canceled)21. A method for fabricating a protonic ceramic energy device , the method comprising:coating an electrolyte layer on an anode layer; anddensifying the electrolyte layer by a rapid laser reactive sintering (RLRS) process on the electrolyte layer and/or the anode layer to form a half-cell comprising a dense electrolyte and a porous anode.22. The method of further comprising depositing a cathode layer on the electrolyte layer or the dense electrolyte.23. The method of further comprising treating the half-cell and cathode layer in a furnace to form a single cell comprising the dense electrolyte claim 22 , the porous anode claim 22 , and a porous cathode.24. The method of wherein the RLRS process comprises a one-step tri-sintering of the anode layer claim 22 , the electrolyte layer claim 22 , and the cathode layer to form a single cell.25. The method of wherein the RLRS process comprises a one-step co-sintering of the anode layer and the electrolyte layer.26. The method of wherein the RLRS process is carried out using a COlaser.27. The method of further comprising preheating the anode layer and the electrolyte layer before the RLRS process.28. The method of wherein the porous anode comprises a nanoporous anode.29. The method of wherein the anode layer comprises a pre-sintered anode.30. The method of wherein the RLRS process allows for the rapid manufacturing of the protonic ceramic half-cell with desired crystal structure claim 21 , microstructure claim 21 , and thickness.31. A method for manufacturing at least one component for a protonic ceramic energy device claim 21 , the method comprising:depositing a precursor on a build surface; ...

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Номер записи: 81

03-01-2019 дата публикации

DEVICE AND METHOD FOR PLACEMENT OF LIGHT SOURCE ON A HEAT SINK

Номер: US20190003695A1

Автор: BLANDIN Jonathan, DUARTE Marc, GUINN Brian, ROUSE Chase

Принадлежит: Valeo North America, Inc.

According to aspects of the disclosed subject matter, a method of placing a solid state light source on a heat sink can include coating a surface of the heat sink with an anodized coating or an e-coating, for example. A portion of the coated surface can be treated via laser ablation for placing the solid state light source. Additionally, the laser ablation parameters can be adjusted to provide a predetermined roughness to the treated portion of the coated surface. 1. A method of treating a heat sink for a light element , comprising:providing a heat sink having a coated surface;treating a mounting region of the coated surface by laser ablation, wherein the mounting region is for placing a light element on the heat sink; andadjusting parameters of the laser ablation treating to adapt the mounting region for mechanical coupling and thermal coupling of the light element to the heat sink.2. The method of claim 1 , wherein the heat sink is aluminum.3. The method of claim 1 , wherein the coated surface of the heat sink includes an anodized coating ranging in thickness from 6 micrometers to 8 micrometers.4. The method of claim 1 , wherein the scale with which laser ablation can treat the anodized surface is in micrometers.5. The method of claim 1 , wherein the predetermined roughness of the treated portion of the anodized surface includes predetermined patterns.6. The method of claim 5 , wherein the adjusting comprises adjusting the laser ablation to provide a predetermined pattern adapted for adhesion of the light element to the heat sink.7. The method of claim 1 , wherein the coated surface includes an anodized coating claim 1 , an e-coating claim 1 , or paint.8. The method of claim 1 , wherein the light element is a solid state light source.9. The method of claim 1 , wherein the laser parameters include marking times claim 1 , marking speed (mm/s) claim 1 , air conditioning speed (mm/s) claim 1 , Q frequency/KHz claim 1 , Q release/second claim 1 , and power (%).10. The ...

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Номер записи: 82

07-01-2021 дата публикации

METHOD FOR MANUFACTURING AN OPTICAL DEVICE

Номер: US20210003770A1

Автор: Ayi-Yovo Folly Eli, Durand Cédric, Gianesello Frédéric

Принадлежит:

An embodiment optical device includes a glass plate, a first trench disposed in the glass plate, and a second trench disposed in the glass plate. The second trench crosses the first trench, and the first trench has an open end in a first wall of the second trench. The optical device includes a waveguide disposed inside the first trench, where the waveguide is formed of a material having a refractive index different from that of the glass plate, and a mirror on a second wall of the second trench opposite the first wall and waveguide. The optical device includes an encapsulation layer filling the second trench and covering all of an upper surface of the waveguide and having a refractive index that is different from the waveguide and the glass plate.

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Номер записи: 83

03-01-2019 дата публикации

PROTECTIVE FILM MATERIAL FOR LASER PROCESSING AND WAFER PROCESSING METHOD USING THE PROTECTIVE FILM MATERIAL

Номер: US20190006295A1

Автор: HIROSE Masafumi, TADANO Tsuyoshi, TOMITA Daisuke

Принадлежит:

A protective film material for laser processing comprises a solution of a water-soluble adhesive and a water-soluble laser beam absorbent added to adjust absorbance at a wavelength of 355 nm (absorbance as calculated as a 200-times diluted solution) to 0.3 to 3. The protective film effectively absorbs an irradiated laser beam, reduces generation of debris during laser beam irradiation, and can be removed by washing with water after completion of the laser processing treatment, thereby providing reliable processing. The water-soluble adhesive is preferably a blend of polyvinyl alcohol and poly-N-vinyl acetamide, which are preferably blended at a ratio of 100 to 200:1 in terms of amounts of respective components. 1. A protective film material for laser processing , comprising a solution of a water-soluble adhesive and a water-soluble laser beam absorbent , the water-soluble laser beam absorbent being present in an amount effective to adjust absorbance at a wavelength of 355 nm (absorbance as calculated as a 200-times diluted solution) to 0.3 to 3.2. The protective film material for laser processing according to claim 1 , wherein the water-soluble adhesive of the solution is a blend of polyvinyl alcohol and poly-N-vinyl acetamide.3. The protective film material for laser processing according to claim 1 , wherein the polyvinyl alcohol and poly-N-vinyl acetamide are blended at a ratio of 100 to 200:1 in terms of amounts of respective components.4. The protective film material for laser processing according to claim 1 , wherein the water-soluble adhesive is a blend of polyvinyl alcohol and poly-N-vinyl acetamide claim 1 , and the poly-N-vinyl acetamide has an absolute molecular weight of about 10 claim 1 ,000 to 1 claim 1 ,800 claim 1 ,000.5. The protective film material for laser processing according to claim 1 , wherein the water-soluble adhesive is a blend of polyvinyl alcohol and poly-N-vinyl acetamide at a ratio of 100 to 200:1 in terms of amounts of respective ...

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Номер записи: 84

20-01-2022 дата публикации

METHOD OF LASER CUTTING A STEEL

Номер: US20220016732A1

Автор: MANOHAR Murali

Принадлежит:

A method for laser cutting a steel alloy sheet/plate having a composition including, in wt. %: C: 0.0-0.29; Mn: 0.50-1.35; P: 0.04 max; S: 0.05 max; Si: 0.40 max; Cr: 0.5-0.75, and the remainder being iron and impurities, the steel alloy is free from intentional additions of Cu and Ni and containing less than 0.05% of total cumulated amounts of Cu and Ni. 110-. (canceled)11. A method for laser cutting a steel alloy sheet/plate , the method comprising the steps of:providing a steel cutting laser;providing a laser cuttable steel alloy sheet/plate, the steel alloy sheet/plate having a composition comprises, in wt. %:C: 0.01-0.29; Mn: 0.50-1.35; P: 0.04 max; S: 0.05 max; Si: 0.40 max; Cr: 0.5-0.75, and a remainder being iron and impurities, the steel alloy being free from intentional additions of Cu and Ni and containing less than 0.05% of total cumulated amounts of Cu and Ni;directing a laser beam from the steel cutting laser to the laser cuttable steel alloy sheet/plate; andcutting said laser cuttable steel alloy sheet/plate with the laser beam.12. The method as recited in wherein the steel comprises Si: 0.15-0.40.13. The method as recited in wherein the steel comprises C: 0.10-0.25.14. The method as recited in wherein the steel comprises Mn: 0.8-1.2.15. The method as recited in wherein said steel comprises Si: max 0.15.16. The method as recited in wherein the steel comprises Cr: 0.55-0.75.17. The method as recited in wherein the steel comprises C: 0.12-0.23.18. The method as recited in wherein the steel comprises Mn: 0.8-1.05.19. The method as recited in wherein the steel comprises Si: 0.02-0.14.20. The method as recited in wherein the steel comprises Cr: 0.55-0.72. The present invention relates to a method of laser cutting mild/low alloy steels and more particularly a method of cutting mild/low alloy steels suitable for laser cutting. Specifically, the present intention relates to a method for laser cutting mild/low alloy steels suitable for laser cutting with ...

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Номер записи: 85

20-01-2022 дата публикации

Workpiece management method and sheet cutting machine

Номер: US20220020696A1

Автор: Daisuke Yamashita, Yoshinobu Saito

Принадлежит: Disco Corp

A workpiece management method includes a frame unit forming step of forming a frame unit with a workpiece supported in an opening of an annular frame via a resin sheet, a printing step of, after performing the frame unit forming step, printing identification information of the workpiece on the resin sheet in an area between an outer periphery of the workpiece and an inner periphery of the annular frame, a processing step of processing the workpiece by a processing machine, a separation step of separating the processed workpiece from the resin sheet, and a storage step of storing the resin sheet from which the workpiece has been separated. A sheet cutting machine suitable for use in the workpiece management method is also disclosed.

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Номер записи: 86

14-01-2016 дата публикации

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

Номер: US20160008923A1

Автор: Astle David James, Child Tyler Christensen, Kasagani Vimal Kumar, Loose Cameron LaMar, Sorenson Max Ernest, Stevens Blake LeRoy

Принадлежит:

A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed. 1. A method for selectively removing a protective coating from a substrate , comprising:applying a protective coating to a substrate; andselectively cutting at least a portion of the protective coating with a removal medium comprising a laser light.2. The method of claim 1 , wherein applying the protective coating comprises applying a polyp-xylylene) coating to the substrate.3. The method of claim 1 , wherein selectively cutting at least the portion of the protective coating comprises exposing a periphery of at least one portion of the substrate through the protective coating.4. The method of claim 1 , wherein exposing the periphery of the at least one portion of the substrate comprises exposing a periphery of a selected feature and/or component of the substrate.5. The method of claim 3 , wherein exposing at least the periphery of the at least one portion of the substrate comprises exposing the protective coating to a laser beam.6. The method of claim 5 , further comprising:exposing an area of the substrate delineated by the periphery of the at least one portion of the substrate.7. The method of claim 6 , wherein the area is exposed by scanning the laser beam across a region of the protective coating located over the area of the substrate.8. The method of claim 7 , wherein scanning comprises raster scanning the laser beam across the region of the protective coating.9. The method of claim 1 , wherein selectively cutting comprises selectively cutting at least the portion of the protective ...

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Номер записи: 87

14-01-2016 дата публикации

PRECOATED STEEL PLATE, WELDED BLANK, PART AND METHODS

Номер: US20160008924A1

Автор: Canourgues Jean-Francois, Ehling Wolfram, Pic Aurelien, Thommes Bernd, Verrier Pascal, Vierstraete Rene

Принадлежит:

A method of fabricating a precoated steel plate, the method including coating a steel plate by dipping the steel plate in a molten bath to obtain a precoat upon the steel plate, wherein the precoat includes an intermetallic alloy layer and a metal alloy layer. The intermetallic alloy layer is topped by the metal alloy layer. On at least one face of the plate, the metal alloy layer is removed in an area at a periphery of the plate using a laser beam, while leaving at least part of the intermetallic alloy layer in the area. The at least part of the intermetallic layer in the area has a thickness between 3 and 10 micrometers thick. 1. A method of fabricating a precoated steel plate , the method comprising:(A) coating a steel plate by dipping the steel plate in a molten bath to obtain a precoat upon the steel plate, wherein the precoat consists of (i) an intermetallic alloy layer and (ii) a metal alloy layer, wherein the intermetallic alloy layer (i) is topped by the metal alloy layer (ii); and(B) on at least one face of the plate, removing the metal alloy layer (ii) in an area at a periphery of the plate using a laser beam, while leaving at least part of the intermetallic alloy layer (i) in the area, the at least part of the intermetallic layer in the area having a thickness between 3 and 10 micrometers thick.2. The method as recited in wherein a width of the area from which the metal alloy layer (ii) has been removed is between 0.2 and 2.2 mm.3. The method as recited in wherein the coating is effected by dip coating with aluminum.4. The method as recited in wherein the metal alloy layer (ii) comprises aluminum claim 1 , and claim 1 , by weight:from 8 to 11% of silicon; andfrom 2 to 4% of iron.5. The method as recited in wherein the metal alloy layer (ii) is removed while leaving all of the intermetallic alloy layer (i) in the area.6. The method as recited in wherein the thickness is 5 micrometers. This is a continuation of U.S. patent application Ser. No. 14/070,132, ...

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Номер записи: 88

12-01-2017 дата публикации

EDGE CHAMFERING BY MECHANICALLY PROCESSING LASER CUT GLASS

Номер: US20170008793A1

Автор: Bankaitis Jonas, Uhlig Kevin William

Принадлежит: CORNING INCORPORATED

Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser that is followed by mechanical polishing with a compliant polishing wheel. 1. A method of processing a workpiece comprising the steps of:(i) focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction;(ii) directing the laser beam focal line into the workpiece at a first angle of incidence to the workpiece, the first angle intersecting an edge of the workpiece, the laser beam focal line generating an induced absorption within the workpiece, the induced absorption producing a defect line along the laser beam focal line within the workpiece;(ii) translating the workpiece and the laser beam relative to each other, thereby laser drilling a plurality of defect lines along a first plane at the first angle within the workpiece, each of said defect lines having a diameter of not greater than 5 μm; and(iv) separating the workpiece along the plane to create a laser cut workpiece with at least one cut surface; and(v) processing the workpiece by polishing the cut surface of the laser cut workpiece with a polishing wheel, wherein the polishing wheel has a bulk modulus of elasticity of 0.1 GPa to 5 GPa.3. A method of laser processing a glass material comprising:focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction; andlaser drilling a plurality of defect lines along each of N planes within the material by, for each of the N planes:directing the laser beam focal line into the material at a corresponding angle of incidence to the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line ...

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Номер записи: 89

14-01-2016 дата публикации

METHODS AND APPARATUSES FOR FABRICATING GLASS ARTICLES

Номер: US20160009585A1

Автор: Bookbinder Dana Craig, Logunov Stephan Lvovich, Nieber Albert Roth, Tandon Pushkar, Tsuda Sergio

Принадлежит:

Methods of fabricating formed glass articles are described herein. In one embodiment, a method for fabricating a formed glass article may include forming a glass ribbon, forming a parson, and shaping the parson to form a glass article. The glass article may be attached to the glass ribbon at an attachment region defining an edge of the glass article. The process may also include contacting the attachment region with a focal line of a laser beam and separating the glass article from the glass ribbon at the attachment region. The attachment region may be perforated by the laser beam and the focal line may be substantially perpendicular to the plane of the glass ribbon. 1. A method of fabricating a formed glass article , the method comprising:forming a glass ribbon comprising a substantially planar topside and a substantially planar underside;forming a parson comprising glass of the glass ribbon, the parson attached to the glass ribbon at an aperture formed in the glass ribbon, wherein the parson is hollow with an opening at the aperture of the glass ribbon and extends from the underside of the glass ribbon;shaping the parson to form a glass article, the glass article attached to the glass ribbon at an attachment region, the attachment region comprising an area proximate the edges of the aperture, the attachment region defining an edge of the glass article; andcontacting the attachment region with a focal line of a laser beam such that the attachment region is perforated by the laser beam, wherein the focal line is substantially perpendicular to a plane of the glass ribbon; andseparating the glass article from the glass ribbon at the attachment region.2. The method of claim 1 , wherein the formed glass article is a substantially hollow container comprising an opening claim 1 , wherein the opening was the aperture in the glass ribbon.3. The method of claim 1 , wherein the attachment region is cylindrically shaped and defines an outer edge of a mouth of the glass article ...

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Номер записи: 90

14-01-2016 дата публикации

COATED PANE WITH PARTIALLY DE-COATED REGIONS

Номер: US20160009592A1

Автор: Arslan Ilkay, BEHMKE Michael, Droste Stefan, Von Der Weiden Ingo, Wohlfeil Dirk

Принадлежит:

A coated pane with a communication window includes a base pane, a metal-containing coating on the base pane, a grid area made of intersecting, de-coated inner gridlines in the metal-containing coating, wherein the grid area has a grid area edge, and the grid area edge has intersecting outer gridlines, wherein the outer gridlines have interruptions increasing in size from the outer edge of the grid area all the way to the end of the grid surface edge. 1. Coated pane with a communication window comprising:a base pane;a metal-containing coating on the base pane;a grid area made of intersecting, de-coated inner gridlines in the metal-containing coating, wherein the grid area has a grid area edge, andthe grid area edge has intersecting outer gridlines, wherein the outer gridlines have interruptions increasing in size from an outer edge of the grid area all the way to an end of the grid area edge.2. Coated pane according to claim 1 , wherein the outer gridlines include extensions of the inner gridlines.3. Coated pane according to claim 2 , wherein the outer gridlines further include gridlines that are arranged parallel to the outermost grid line bordering the grid area.4. Coated pane according to claim 1 , wherein the gridlines have a width from 30 μm to 200 μm.5. Coated pane according to claim 1 , wherein the gridlines form squares claim 1 , rhombuses claim 1 , parallelograms claim 1 , and/or rectangles.6. Coated pane according to claim 1 , wherein the gridlines are from 0.1 mm to 15 mm apart.7. Coated pane according to claim 1 , wherein the grid area edge has a width from 1 mm to 30 mm.8. Coated pane according to claim 1 , wherein the base pane comprises float glass.9. Coated pane according to claim 8 , wherein the inner gridlines and the outer gridlines have an angle of 30° to 60° relative to the float glass production direction of the base pane.10. Windshield comprising a coated pane according to .11. Method for producing a coated pane with a communication window ...

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Номер записи: 91

27-01-2022 дата публикации

LASER APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE

Номер: US20220023976A1

Автор: HAN Jae Ku, JEONG Jae Yoon, NOH Sung Ho, SIM Jun Ho

Принадлежит:

A laser apparatus and a method for manufacturing a display device are provided. A laser apparatus includes: a stage; a laser providing unit above the stage and configured to provide a laser beam; a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; and a control unit to control an operation of the scanner, and the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation. 1. A laser apparatus comprising:a stage;a laser providing unit above the stage and configured to provide a laser beam;a scanner configured to adjust an optical path of the laser beam such that the laser beam is irradiated to an irradiation line formed above the stage; anda control unit to control an operation of the scanner,wherein the scanner includes a shutter located on an optical path of the laser beam emitted from the laser providing unit and configured to perform an opening/closing operation.2. The laser apparatus of claim 1 , wherein the control unit calculates a processing area to which the laser beam is irradiated and a non-processing area to which the laser beam is not irradiated.3. The laser apparatus of claim 2 , wherein claim 2 , when a position of a target aiming point of the laser beam is located in the processing area claim 2 , the control unit controls to open the shutter if a moving speed of the target aiming point of the laser beam is higher than or equal to a reference speed claim 2 , and to close the shutter if the moving speed of the target aiming point of the laser beam is lower than the reference speed.4. The laser apparatus of claim 3 , wherein the control unit controls to close the shutter when the position of the target aiming point of the laser beam is located in the non-processing area.5. The laser apparatus of claim 3 , wherein a number of scans of the laser beam per ...

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Номер записи: 92

14-01-2021 дата публикации

METHOD FOR LASER CARVING OF PAINT ON AN OUTER SURFACE OF A VEHICLE WHEEL

Номер: US20210008667A1

Автор: ANDREEN ANDREAS, CHANG CHING JUI, KAO JUI LUNG, ROBERTSSON VIKTOR, WANG YUNG SHENG, ZHAO Juan

Принадлежит:

A method for laser carving of paint on an outer surface of a vehicle wheel includes a step of priming: priming an outer surface of the wheel to form a painted surface; a step of laser carving: carving the primer from a selected area of the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, and a step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area. The painted surface on the wheel can be quickly removed to disclose a selected area with metallic luster, while the wheel is prevented from corrosion so as to reduce manufacturing cost and increase precision. 1. A method for laser carving of paint on an outer surface of a vehicle wheel , comprising:a step of priming: applying a primer on an outer surface of the wheel to form a painted surface;a step of laser carving: carving a selected area of the primer from the wheel by laser to remove the painted surface from the selected area, the selected area having an exposed area with metallic luster, anda step of fine-polish: polishing the outer surface of the wheel to form a fine-polished area at the exposed area.2. The method as claimed in claim 1 , wherein the outer surface of the wheel is applied with the primer in the step of priming so as to form an first layer or undercoat claim 1 , a color layer is applied on the primer and combined with the primer to obtain a colored painted surface.3. The method as claimed in claim 2 , wherein the selected area in the step of laser carving is located on one of spokes of the wheel claim 2 , the selected area of the painted surface is removed by way of carving to form patterns on the exposed area.4. The method as claimed in further comprising a step of first painting added between the step of priming and the step of laser carving claim 3 , the step of first painting comprising:applying a protective paint to the painted surface of the wheel to form a ...

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Номер записи: 93

11-01-2018 дата публикации

PACKING BAG AND MANUFACTURING METHOD FOR THE PACKING BAG

Номер: US20180009574A1

Автор: OZAKI Ikuko, TAKASHIRO Takeo

Принадлежит: MUPACK OZAKI CO., LTD.

A packing bag to store a stored article Z with tight seal by a welded sheet material of resin in which a separation-prepared line portion separable by predetermined tensile force F by human hands to take out the stored article Z, is provided along an opening-prepared side portion the sheet material has a layered unit construction in which first and second welding resin layers A and B are disposed on both sides, and a barrier layer is disposed on a middle position, the separation-prepared line portion is composed of a half-cut first laser-worked groove A concaved on the first welding resin layer A and a half-cut second laser-worked groove B concaved on the second welding resin layer B, and, the first and second laser-worked grooves A and B are formed barely damaging the barrier layer 1. A packing bag to store a stored article with tight seal by a welded sheet material of resin comprising a construction in which:{'sup': '-', 'a separation-prepared line portion, separable by predetermined tensile force by human hands to take out the stored article, is provided along an openingprepared side portion;'}the sheet material has a layered unit construction in which first and second welding resin layers are disposed on both sides, and a barrier layer is disposed on a middle position;the separation-prepared line portion is composed of a half-cut first laser-worked groove concaved on the first welding resin layer and a half-cut second laser-worked groove concaved on the second welding resin layer; andthe first and second laser-worked grooves are formed barely damaging the barrier layer.2. The packing bag as set forth in claim 1 , wherein at least one of the first laser-worked groove and the second laser-worked groove is formed concavo-convex wave.3. A manufacturing method of packing bag to make a packing bag having a separation-prepared line portion claim 1 , separable by predetermined tensile force by human hands claim 1 , along an opening-prepared side portion claim 1 , ...

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Номер записи: 94

10-01-2019 дата публикации

METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE WITH PICOLASER

Номер: US20190009362A1

Автор: ROGG Alexander, WACKER Richard

Принадлежит: Heraeus Deutschland GmbH & Co. KG

One aspect relates to a method of processing metallized ceramic substrates and to a metal-ceramic substrate obtained by this method. 115-. (canceled)16. A method for processing of metal-ceramic substrates , comprising:generating a laser scribing line as a predetermined breaking line in the metal-ceramic substrate using a laser beam; orat least partially cutting through the metal-ceramic substrate using a laser beam;wherein the processing is carried out using a laser and when generating the laser scribing line as a predetermined breaking line or when cutting through, a pulse duration of the laser is used which is chosen such that essentially no melting phases of the ceramic material are formed.17. The method according to claim 16 , wherein the laser scribing line is formed continuously or discontinuously.18. The method according to claim 16 , wherein the laser is a p-sec laser.19. The method according to claim 16 , wherein the laser has a pulse duration of 0.1 to 100 ps.20. The method according to claim 16 , wherein claim 16 , during the generation of the laser scribing line as a predetermined breaking line claim 16 , the laser scribing line is generated in several crossings of the laser and/or the at least partially cutting through of the metal-ceramic substrate occurs in several crossings of the laser.21. The method according to claim 16 , wherein the laser is an IR laser.22. The method according to claim 21 , wherein the IR laser has a power of 60 to 160 watts.23. The method according to claim 21 , wherein the frequency of the IR laser is 350 to 650 kHz.24. The method according to any claim 21 , wherein the pulse energy of the IR laser is 100 to 300 μJ.25. The method according to claim 21 , wherein the spot diameter of the IR laser is 20 to 100 μm.26. The method according to claim 16 , wherein the method is carried out in a device having a suction device that absorbs dusts claim 16 , which result from the laser processing.27. A metallized ceramic substrate ...

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Номер записи: 95

09-01-2020 дата публикации

PROCESSING METHOD, PROCESSING SYSTEM, AND PROCESSING PROGRAM

Номер: US20200009683A1

Автор: Maeda Toshio, Ueda Jun, YOSHIDA Makoto

Принадлежит:

A processing method for forming an object by processing a material using a cutting tool and a laser beam, including forming, by projecting the laser beam to an unnecessary portion of the material, one or more cleavage regions in the unnecessary portion, and cutting, using the cutting tool, the unnecessary portion including the one or more cleavage regions that have been formed. 1. A processing method for forming an object by processing a material using a cutting tool and a laser beam , the processing method comprising:a projection step of forming, by projecting the laser beam to an unnecessary portion of the material, one or more cleavage regions in the unnecessary portion; anda cutting step of cutting, using the cutting tool, the unnecessary portion including the one or more cleavage regions that have been formed.2. The processing method according to claim 1 , wherein two or more cleavage regions are formed in a first direction from a surface of the material by projecting the laser beam.3. The processing method according to claim 2 , wherein an additional two or more cleavage regions are formed in a second direction by projecting the laser beam claim 2 , the second direction being perpendicular to the first direction.4. The processing method according to claim 1 , wherein the one or more cleavage regions are formed claim 1 , by the laser beam claim 1 , in the unnecessary portion using a non-thermal processing when the material is a light-transmitting material claim 1 , and the one or more cleavage regions are formed claim 1 , by the laser beam claim 1 , in the unnecessary portion using a thermal processing when the material is an opaque material.5. The processing method according to claim 1 , wherein claim 1 , when process sites corresponding to the one or more cleavage regions are layered in a direction of projection of the laser beam claim 1 , the laser beam is projected to the layered process sites in a descending order of distance from a material surface ...

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Номер записи: 96

09-01-2020 дата публикации

LASER CUTTING DEVICE, CONTROL METHOD AND CONTROL APPARATUS

Номер: US20200009689A1

Автор: HU Qingyu, KIM Yong Sub, Liu Ping

Принадлежит:

A laser cutting device, a control method and a control apparatus, the device comprising: a conveying mechanism () comprising a feeding end and a discharging end; a working platform () disposed at the discharging end of the conveying mechanism (); a first counter () and a second counter () oppositely disposed at a side of the working platform () near the discharging end of the conveying mechanism () and driven respectively by two opposite side edges of a substrate () to rotate for counting; a laser cutter () disposed above the working platform (); a control device () for determining a modified cutting motion path of the laser cutter according to a set cutting path, and starting and ending times of counting values of the first counter () and second counter (), and for controlling the laser cutter to cut the substrate () according to the modified cutting motion path. 1. A laser cutting device , comprising:a conveying component, comprising a feed end and a discharge end;a work table, arranged at the discharge end of the conveying component;a first counter and a second counter, arranged opposite to each other on a side, proximate to the discharge end of the conveying component, of the work table, and respectively driven by two opposite side edges of a conveyed substrate to rotate for counting;a laser cutter, arranged above the work table; anda control apparatus, connected with the first counter, the second counter and the laser cutter and configured to determine a corrected cutting motion track of the laser cutter according to a set cutting track, and counting start and stop time points and counted values of the first counter and the second counter, and to control the laser cutter to cut the substrate according to the corrected cutting motion track.2. The laser cutting device according to claim 1 , wherein the first counter comprises an absolute value rotary coding counter or an incremental rotary coding counter claim 1 , and the second counter comprises an absolute ...

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Номер записи: 97

09-01-2020 дата публикации

Laser processing hydrogel materials

Номер: US20200009690A1

Автор: Arvey Ken, Hill Kimberly, Miller Daniel B., Swanson Alexandra

Принадлежит:

A method of forming one or more perforations, holes, or capillaries in a hydrogel material, hydrocolloid material, hydrogel adhesive or silicone adhesive comprising directing a focal point of a laser beam to a surface of the material or adhesive at one or more locations to form one or more perforations, holes, or capillaries having a selected diameter. The perforated hydrogel material or adhesive can be used in wound care dressings, wearable sensors, or devices intended to contact living tissue. The perforated material or adhesive may also be provided in contact with an exudate holding mechanism such as an open cell foam material to further increase the exudate absorbance of the hydrogel or hydrocolloid wound care dressing. 1. A method of forming one or more perforations , holes , or capillaries in a material in a non-contact manner comprising directing a focal point of a laser beam to a surface of the material and vaporizing the material at one or more locations to form one or more perforations , holes , or capillaries having a selected diameter , wherein the material is one of a hydrogel material , a hydrocolloid material , or a silicone adhesive.2. The method of claim 1 , wherein the material comprises a wound care dressing or component.3. The method of claim 1 , wherein the material comprises a body contact sensor.4. The method of claim 1 , wherein a laser energy of the laser beam is sufficient to cauterize the material when forming the one or more perforations claim 1 , holes claim 1 , or capillaries such that the one or more perforations claim 1 , holes claim 1 , or capillaries substantially retain their laser processed shape and diameter and resist closing.5. A method of forming one or more perforations claim 1 , holes claim 1 , or capillaries in an adhesive material comprising directing a focal point of a laser beam to a surface of the adhesive material and vaporizing the adhesive material at one or more locations to form one or more perforations claim 1 , ...

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Номер записи: 98

09-01-2020 дата публикации

Method for producing at least one recess in a material by means of electromagnetic radiation and subsequent etching process

Номер: US20200009691A1

Автор: Arne Schnoor, Daniel Dunker, Norbert Ambrosius, Roman Ostholt

Принадлежит: LPKF Laser and Electronics AG

A method for creating at least one recess, in particular an aperture, in a transparent or transmissive material, includes: selectively modifying the material along a beam axis by electromagnetic radiation; and creating the at least one recess by one or more etching steps, using different etching rates in a modified region and in non-modified regions. The electromagnetic radiation produces modifications having different characteristics in the material along the beam axis such that the etching process in the material is heterogeneous and the etching rates differ from one another in regions modified with different characteristics under unchanged etching conditions.

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Номер записи: 99

11-01-2018 дата публикации

Grain-oriented electrical steel plate and production method therefor

Номер: US20180010206A1

Автор: Hyun-Chul Park, Jae-Kyoum KIM, Jong-Tae Park, Jung Hun PARK, Oh-Yeoul Kwon, Se Min Park, Seong-Kyu SEE, Seung Gon LEE, Sung-Yeun WON

Принадлежит: Posco Co Ltd

Provided is an oriented electrical steel sheet including a groove existing on the surface of the electrical steel sheet and a forsterite layer formed on a part or all of the surface of the electrical steel sheet, in which forsterite which is extended from the forsterite layer and penetrates to a base steel sheet in an anchor form is present on the surface of the side of the groove.

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Номер записи: 100