16-03-2017 дата публикации
Номер: US20170073485A1
A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO.yMg(OH).zHO wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet. 1. A prepreg , comprising:a base material; and [ [{'br': None, 'sub': 3', '2', '2, 'xMgCO.yMg(OH).zHO \u2003\u2003(1)'}, 'wherein x:y:z is', '4:1:4,', '4:1:5,', '4:1:6,', '4:1:7,', '3:1:3, or', '3:1:4, '(A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1), 'the resin composition comprising, (B) an epoxy resin; and', '(C) a curing agent., 'and huntite;'}], 'a resin composition impregnated into or coated on said base material,'}2. A laminated sheet comprising a lamination-molded product of a prepreg according to .3. A metal foil-clad laminated sheet comprising{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a lamination-molded product of a prepreg according to and'}a metal foil provided on the prepreg.4. The prepreg according to claim 1 , wherein the hydromagnesite represented by formula (1) is one represented by formula (2):{'br': None, 'sub': 3', '2', '2, '4MgCO.Mg(OH).4HO \u2003\u2003(2)'}5. The prepreg according to claim 1 , wherein the hydromagnesite:huntite weight ratio in the inorganic filler (A) is in the range of 10:90 to 45:55.6. The prepreg according to claim 1 , wherein the curing agent (C) is at least one material selected from the group consisting of cyanate ester compounds claim 1 , BT resins claim 1 , and phenolic resins.8. The prepreg according to claim 6 , wherein ...
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