Farbstrahldruckkopf, Farbstrahldruckkopfpatrone, Farbstrahlauszeichnungsapparat und Verfahren zum Herstellen des Kopfes

Tintenstrahlkopfherstellungsverfahren

Tintenstrahlaufzeichnungskopf und Aufzeichnungsgerät damit versehen

Verfahren zur Herstellung eines Farbstrahlaufzeichnungskopfes

CHIP DES PIEZOELEKTRISCHEN/ELEKTROSTRIKTIVEN TYPES

Herstellungsverfahren eines piezoelektrischen Schichtenelementes

STRUKTUR EINER TINTENSTRAHLPATRONE

Piezoelectrically driven ink-jet print head.

An ink jet printer head including a pair of body plates (13, 14) bonded together; recess portions (18) formed on at least one of the body plates, the recess portion forming a plurality of pressure chambers and a plurality of orifices respectively communicating with the pressure chambers; a pressure generating section having a plurality of driving portions (19) formed from a piezoelectric member (28), the driving portions having pressure applying surfaces respectively opposed to the pressure chambers; and a resin (14) molded so as to fill in the interstices between the driving portions and a base (20) such that the assembly constitutes a unitary body plate (18). The pressure chambers and "molded-in" transducers may be formed in one of the plates, and the other plate may merely comprise a planar cove therefor. ...

Droplet deposition apparatus and method for manufacturing the same

A manifold component 201 is elongate in an array direction and comprises a first manifold chamber 220 and a second manifold chamber 210. The first and second manifold chambers 220, 210 extend side by side in an array direction (101, Fig.8) and the first manifold chamber 220 is fluidically connected to the second manifold 210 chamber via fluid chambers. The cross-sectional area of at least one of the first manifold and the second manifold chambers 220, 210 tapers with distance in the array direction (101, Fig.8) and the cross-sectional shape of the manifold component perpendicular to the array direction (101, Fig.8) varies with distance in the array direction (101, Fig.8). The first manifold chamber 220 may also extend beyond at least one of the first and second longitudinal ends of the fluid chambers in the array direction (101, Fig.8). The manifold component 201 may also include a third manifold chamber 230 wherein the first manifold chamber 220 is fluidically connected to the second manifold ...

METHOD OF MANUFACTURING A MULTIPLE-NOZZLE INK JET PRINTHEAD

INK RADIATION PRINT HEAD MANUFACTURING PROCESS

LIQUID OUTPUT HEAD

PROCEDURE FOR THE PRODUCTION OF AN MICRO-ELECTROMECHANICAL MECHANISM WITH PIEZOELECTRIC BLOCKS

INK RADIATION RECORDING SYSTEM

INK RADIATION RECORDING

INK RADIATION PRINT HEAD, - CARTRIDGE AND - EQUIPMENT.

INK RADIATION RECORDING HEAD

MANUFACTURING PROCESS OF A COLOR RADIATION RECORDING HEAD AND COLOR RADIATION RECORDING HEAD

PROCEDURE FOR THE PRODUCTION OF AN INK RADIATION RECORDING HEAD

Modular printer and printhead assembly therefore

A Print Engine for an Inkjet Printer

Printhead

Abstract A printhead (10) comprising a monolithic semiconductor body defining a flow path and an impedance feature.

Cartridge unit having negatively pressurized ink storage

INK JET RECORDING HEAD, CARTRIDGE AND APPARATUS

PROCESSING OF IMAGES FOR HIGH VOLUME PAGEWIDTH PRINTING

MOLDED ORIFICE PLATE ASSEMBLY FOR AN INK JET RECORDER AND METHOD OF MANUFACTURE

BFN 6828 MOLDED ORIFICE PLATE ASSEMBLY FOR AN INK JET RECORDER AND METHOD OF MANUFACTURE An orifice plate (10) for use in an ink jet recorder is integrally cast with an orifice plate holder(12), The orifice plate is formed having a flat, tapered bottom portion containing at least one row of orifices and has sidewalls extending outwardly from the bottom portion at acute angles from horizontal. The orifice plate holder (12) is formed from a castable plastic material which serves as a damping material. The holder is cast over and around the sidewalls (11) of the orifice plate to define, with the bottom portion of the orifice plate, a portion of an ink supply manifold. The damping action of the holder isolates the orifice plate (10) from spurious vibrations which could adversely affect the quality of printing from the ink jet recorder. Only the desired vibration from the stimulation transducer reaches the orifice plate. The mass and rigidity of the holder confines the traveling wave induced ...

DISPENSING NOZZLE

Dispensing nozzle (15), comprising an essentially flat base member (17) having two essentially parallel surfaces. At least one fluid channel (16) is provided therein with an inlet opening and an outlet opening. The channel is oriented substantially perpendicularly in relation to the general extension of the base member (15). A surface surrounding at least one of said openings has a high wetting angle for the fluid to be dispensed.

INK JET RECORDING APPARATUS

... an ink jet recording head includes a plurality of ink ejection outlets, a first member having a plurality of grooves in fluid communication with the ejection outlets, respectively, a second member having a plurality of energy generating elements for producing energy for ejecting ink in the grooves through the ejection outlets, and a clamping unit for clamping the first member with the second member to constitute ink passages with the grooves, wherein the clamping unit has a plurality of pressure regulating mechanism pressure regulating mechanisms, which are independently operable.

Ink Jet Recording Apparatus

... an ink jet recording head includes a plurality of ink ejection outlets, a first member having a plurality of grooves in fluid communication with the ejection outlets, respectively, a second member having a plurality of energy generating elements for producing energy for ejecting ink in the grooves through the ejection outlets, and a clamping unit for clamping the first member with the second member to constitute ink passages with the grooves, wherein the clamping unit has a plurality of pressure regulating mechanism pressure regulating mechanisms, which are independently operable.

Ink Jet Recording Apparatus

Method of making a composite device

A method of making a composite device, includes providing a first part including a first set of components at a first pitch; along with providing a second part including a second set of components at a second pitch, different from the first pitch. The first part is fastened to the second part to make a composite device. The composite device includes a subset of the first set of components that are substantially aligned to a subset of the second set of components to form a corresponding subset of substantially aligned composite components.

Molded fluid flow structure

Liquid injection device and for the production method of the liquid ejection apparatus

Precision liquid dispenser e.g. for ink-jet printer has ejector plate and moulded polymer one-piece plate and spacer

La présente invention concerne un dispositif dispensateur de fluide comprenant une plaque d'éjection de fluide présentant au moins un orifice de sortie (112) du fluide et des moyens de commande de l'éjection de fluide reliés à la plaque par au moins un espaceur pour ménager un canal d'adduction du fluide vers l'orifice, caractérisé en ce qu'il comprend une pièce moulée (110) formant d'un seul tenant la plaque et l'espaceur. Application à aux imprimantes.

PROCESSING OF IMAGES FOR HIGH VOLUME PAGEWIDTH PRINTING

프린트헤드

... 프린트헤드는 몰딩가능한 기판 내에 몰딩된 다수의 잉크젯 슬라이버를 포함한다. 오버몰딩된 잉크젯 슬라이버는 하나 이상의 다이를 형성한다. 프린트헤드는 또한 잉크젯 슬라이버를 사이드 커넥터에 전기적으로 결합시키는 다수의 와이어 본드를 포함한다. 사이드 커넥터는 잉크젯 슬라이버를 인쇄 장치의 제어기에 전기적으로 결합시킨다.

HIGH SPEED DIGITAL PRINTER UNIT

An printer unit is provided comprising a body having a media input assembly for supporting media for printing (34), a media output assembly for collecting printed media and a print engine (70) adapted to be mounted to said body and having a printhead for printing an image on a surface of the media. The printhead being a pagewidth printhead that is removable from the print engine. © KIPO & WIPO 2008 ...

MOLDED INK MANIFOLD WITH POLYMER COATING

A printhead assembly includes a molded ink manifold, a plurality of printhead integrated circuits, and an adhesive film sandwiched between the ink manifold and the printhead integrated circuits. A manifold bonding surface of the molded ink manifold includes a polymer coating. The polymer coating plugs fissures resulting from a molding process used to mold the ink manifold.

A MICROFLUIDIC DEVICE AND A FLUID EJECTION DEVICE INCORPORATING THE SAME

A microfluidic device (10) includes first and second glass substrates (12, 42) bonded together. The first glass substrate (12) has first and second opposed surfaces (14, 16). A die pocket (18) is formed in the first opposed surface (14), and a through slot (22) extends from the die pocket (18) to the second opposed surface (16). The second glass substrate (42) is bonded to the second opposed surface (16) of the first glass substrate (12) whereby an outlet (O2) of a channel (48) formed in the second glass substrate (42) substantially aligns with the through slot (22). The channel (48) of the second glass substrate (42) has an inlet (I2) that is larger than the outlet (O2).

A FLUID EJECTOR

A fluid ejecting device includes a substrate (110) having a first surface (111) and a second surface (112) located opposite the first surface. A nozzle plate (140) is formed over the first surface of the substrate. The nozzle plate has a nozzle (152) through which fluid is ejected. A drop forming mechanism (151) is situated at the periphery of the nozzle. A fluid chamber (113) is in fluid communication with the nozzle and has a first wall and a second wall with the first wall (116) and the second wall (117) being positioned at an angle relative to each other. A fluid delivery channel (115) is formed in the substrate and extends from the second surface of the substrate to the fluid chamber. The fluid delivery channel is in fluid communication with the fluid chamber. A source of fluid impedance (114) comprises a physical structure located between the nozzle and the fluid delivery channel.

LOW VOLTAGE INK JET PRINTING MODULE

A method of manufacturing an ink jet printing module can include forming a piezoelectric element having a stiffened surface.

GAS ASSISTED INK JET APPARATUS AND METHOD

A gas assisted liquid jet apparatus, suitable for use in ink jet printers, includes a transducer housing having a plurality of ink passages and is designed to be used with solid or hot melt ink. The apparatus operates with a compressed air source to provide a laminar air flow through an orifice from where ink is ejected. As a result, ink ligaments and droplets uniformly accelerate toward the printing medium, and the high speed laminar flow reduces friction at the orifice, thus reducing the formation of ink ligaments or satellite droplets. The apparatus may be made by attaching different layered members together. This improves the efficiency and ease of fabrication of multiple array liquid jet apparatus. Because of the layered structure, ink passages and air chambers each may be placed in a selected layered member or in more than one layered member. The location of the ink passages in the same layer or structure, such as the transducer housing, as a heater provides improved heating capabilities ...

Data storage device incorporating a two-dimensional code

A data storage device includes a data carrier having at least one planar surface. An array of detectable items is positioned on the planar surface and is detectable with a sensing device. The array is configured to represent a two-dimensional code that defines at least executable instructions and redundancy encoding to impart fault tolerant characteristics to the code. The executable instructions include image processing algorithms.

LIQUID EJECTING HEAD AND MANUFACTURING METHOD THEREOF, AND LIQUID EJECTING APPARATUS

A liquid ejecting head includes a first flow channel member that configures part of the wall surface of a liquid flow channel, a second flow channel member that configures a different part of the wall surface of the liquid flow channel than the part configured by the first flow channel member, and an integral molded member, formed around the liquid flow channel, that joins the first flow channel member with the second flow channel member through integral molding. An elastic member that is sandwiched between the first flow channel member and the second flow channel member and is more elastically deformable than the first flow channel member and the second flow channel member, is provided around the liquid flow channel, and the integral molded member is formed on the outside of the elastic member sandwiched between the first flow channel member and the second flow channel member.

MOLDED FLUID FLOW STRUCTURE WITH SAW CUT CHANNEL

In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.

Printer with motor driven maintenance station

An inkjet printer comprising: a printhead with an array of nozzles; a maintenance assembly for moving between a capped position where the assembly covers the array of nozzles, and an uncapped position spaced from the array of nozzles; and, a motorized drive for moving the maintenance assembly between the capped position and the uncapped position; wherein the maintenance assembly has a capper for covering the array and a cleaner for wiping the array, such that the motorized drive uses a cam shaft arrangement for moving the cleaner relative to the capper.

Inkjet printer with replaceable printhead requiring zero-insertion-force

An inkjet printer comprising: a replaceable pagewidth printhead with an array of nozzles and printhead contacts for transmitting power and print data to the nozzles; and, corresponding contacts for supplying the power and print data to the printhead contacts; and, a selective biasing mechanism; such that, the printhead contacts and the corresponding contacts are biased into engagement during printing and released from biased engagement when installing or removing the printhead.

Method of fabricating printhead for ejecting ink supplied under pulsed pressure

A method of fabricating a printhead is provided in which sacrificial material is deposited on a drive circuitry substrate and etched to define first zones, thermally expandable material is deposited on the first zones and etched with the substrate to define second zones, conductive material is deposited on the second zones and etched to define heating circuitry and connections between the heating and drive circuitry, thermally expandable material is deposited to embed the heating circuitry in the thermally expandable materials and etched to define thermally expandable actuator arms and closure members, chamber material is deposited and etched to form nozzle chambers having inkjet ports and associated actuator arms and closure members, the sacrificial material is etched so that each actuator arm has ends connected between the substrate and the associated closure member, and the substrate is etched to form ink supply channels for supply of ink under pulsed pressure.

MST device for attachment to an adhesive surface

A MST device for attachment to an adhesive surface, the MST device comprising: an attachment surface for abutting the adhesive surface; a first fluid conduit connected to a first aperture in the attachment surface; and, a recess in the attachment surface adjacent the first aperture to hold adhesive displaced from between the attachment surface and the adhesive surface when the MST device is attached such that displaced adhesive does not block fluid flow in the first conduit. By profiling the attachment surface so there is a recess next to the first aperture, there is less risk that adhesive will be squeezed into the conduit and impair fluid flow.

Inkjet printhead integrated circuit

An inkjet printhead integrated circuit is provided. The integrated circuit comprises a plurality of nozzle arrangements, each nozzle arrangement comprising a nozzle chamber and an ink ejection member positioned in the nozzle chamber. The ink ejection member is displaceable with respect to the substrate. An actuator is connected to drive circuitry in the integrated circuit and is reciprocally displaceable upon receipt of an electrical signal. A lever mechanism interconnects the ink ejection member and the actuator. The lever mechanism comprises: (a) an effort end operatively connected to the actuator, the effort end being separate from the substrate; (b) a load end operatively connected to the ink ejection member; and (c) a fulcrum positioned between the effort end and the load end. The lever mechanism is pivotal with respect to the substrate about the fulcrum such that movement of the effort end due to the actuator imparts reciprocal movement to the load end. The reciprocal movement is, ...

Liquid discharge head and method for manufacturing such head

The present invention provides a liquid discharge head and a method for manufacturing such a head, in which a discharging speed of a liquid droplet can be increased, a discharging amount of the liquid droplet can be stabilized and discharging efficiency of the liquid droplet can be enhanced. The liquid discharge head comprises a heater, an element substrate on which the heater is provided, a nozzle including a discharge port portion having a discharge port for discharging the liquid droplet and a bubbling chamber and a supply path for supplying the liquid to the bubbling chamber and a supply chamber for supplying the liquid to the nozzle and an orifice substrate and, the bubbling chamber includes a first bubbling chamber and a second bubbling chamber above the first bubbling chamber and the discharge port portion is communicated with the second bulling chamber via a stepped portion and a side wall of the second bubbling chamber is converged toward the discharge port with inclination of ...

Method of fabricating inkjet nozzle

A method of fabricating an inkjet nozzle on a wafer substrate is provided. The nozzle comprises a nozzle chamber, an actuator and control circuitry for controlling the actuator. The method comprises the steps of: (a) providing a wafer substrate having control circuitry formed thereon; (b) depositing first sacrificial material on the wafer; (c) forming the actuator on the first sacrificial layer such that the actuator electrically connects with the control circuitry; (d) depositing second sacrificial material over the actuator; (e) defining openings in the second sacrificial material, the openings defining the positions of chamber sidewalls; (f) depositing roof material over the second sacrificial material and into the openings; (g) defining an aperture in the roof material; and (h) removing the first and second sacrificial materials.

Pagewidth inkjet printhead assembly with an integrated printhead circuit

An inkjet printhead assembly includes an elongate chassis that spans a printing zone. An ink supply arrangement is mounted on the chassis and has an ink distribution assembly and a housing enclosing the ink distribution assembly. At least one elongate integrated printhead circuit is mounted on the ink distribution assembly to receive ink from the ink distribution assembly and to span the printing zone. Power and ground busbars are arranged on the housing. A tape automated bond strip interconnects the busbars and the, or each, integrated printhead circuit.

Process for producing ink-jet recording head

The process of the present invention for producing an ink-jet recording head is simple and does not require an additional solid layer on a first solid layer. The process comprises the steps of forming a solid layer in a space for forming a liquid path and a part of a liquid chamber on a first supporting member having thereon a discharge pressure-generating element used for discharging an ink, forming an opening portion at a position for forming an ink-supply opening in a second supporting member, placing the second supporting member on the first supporting member, providing a curable or thermoplastic resin for forming walls of the liquid path and the liquid chamber onto the first supporting member so that the solid layer formed on the first supporting member is covered with the resin, curing the resin in such a state that the resin is interposed between the first and second supporting members, cutting from the above the cured resin of the opening portion formed in the second supporting ...

Method of manufacturing printing heads for ink jet printers

A bundle of parallel glass tubes (27) is passed through openings (29) in parallel alignment plates (5) which divide the bundle into a central portion (31) in a zone between the two alignment plates and two end portions (33) beyond this zone. Subsequently, the tubes are softened by heating and the central portion of the bundle is constricted. Subsequently, the central portion is embedded in a moulding compound which, when set, forms two coupling pieces (1) for printing heads, which coupling pieces can be separated from one another along a separating plane (37) which extends parallel to the alignment plates. Thus, important parts of at least two printing heads are manufactured simultaneously.

Method for producing a layered piezoelectric element

A method of producing a layered piezoelectric element for producing a pressure fluctuation within a cavity of an ink jet print head to eject ink from within the cavity, the production method comprising the steps of screen printing a slurry of powdered piezoelectric material to form a piezoelectric ceramic layer; screen printing a conductive paste to form an internal electrode layer on the piezoelectric ceramic layer; and repeating in alternation the steps of screen printing the slurry of powdered piezoelectric material and screen printing the conductive paste to obtain a layered body with piezoelectric ceramic layers and internal electrode layers layered in alternation.

Camera unit incoporating program script scanner

A camera unit includes a display for displaying an image to be captured; an image sensor for digitally capturing the displayed image; a card reader having a linear scanner for scanning a surface of a removable card to sense a plurality of dots printed on the surface of the removable card, the plurality of dots representing a bit pattern encoding a program script; a card interface for receiving a signal from the card reader indicative of the sensed plurality of dots printed on the surface of the card, and decoding the sensed plurality of dots into the program script; and a printer configured to print a distorted image on print media, the distorted image being a version of the captured image distorted in accordance with the program script.

Ink cartridge unit for an inkjet printer with an ink refill facility

Provided is an ink cartridge unit for an inkjet printer. The cartridge unit includes a main body defining a number of ink reservoirs, each reservoir having a layered stack of absorbent material forming a micro-capillary array for suspending ink inside said reservoir. The unit also includes a lid assembly covering the main body to seal ink inside the ink reservoirs, and a printhead assembly operatively fed with ink from the ink reservoirs in the main body. The unit further includes a capper assembly for operatively capping the printhead assembly to prevent damage to micro-electromechanical nozzle arrangements defined on a printing surface of the printhead assembly. The lid assembly includes a refill facility whereby the ink reservoirs are refillable with ink from a suitable ink refill unit.

Method and apparatus for manufacturing a liquid ejection head

A metallic plate member having at least one through hole to be a part a common liquid reservoir of a liquid ejection head is provided. In a first die, a plurality of first projections are arrayed in a first direction with a fixed pitch. Each of the first projections is elongated in a second direction perpendicular to the first direction. The plate member is mounted on a second die, and a regulating member is inserted into the through hole. The first projections are pressed against a first region in a first face of the plate member which is adjacent to the through hole in the second direction, so as to generate a plastic flow of a material in the plate member into gaps defined between the first projections, while the plastic flow is regulated by the regulating member. A plurality of recesses formed by the first projections and a plurality of partition walls formed by the material flown into the gaps constitutes a part of the pressure generating chambers.

Liquid ejecting head manufacturing method

A method of manufacturing a liquid ejecting head that ejects a liquid supplied from a liquid storing member through a liquid supply path. The method includes positioning a filter to a first or second supply member by using positioning pins upon disposing the filter between first and second liquid supply paths. The first supply member has the first liquid supply path. The second supply member has the second liquid supply path on the side of one surface of the first supply member to communicate with the first liquid supply path. At least the first supply member and the second supply member are integrated such that a fixed portion is molded by injecting a resin material from an injection portion of a mold at a position where the first and second liquid supply paths are interposed between the positioning pins.

Printing cartridge with a data-carrying integrated circuit device

A printing cartridge includes a housing in which a supply of media is receivable. An integrated circuit device is positioned on the housing. The integrated circuit device has memory circuitry carrying data relating to the media.

Inkjet print head and inkjet printing apparatus

A print head having high printing reliability, in which temperature unevenness is suppressed even when printing is performed using a print head having an increased length and density of an ejection opening array, can be provided. Specifically, a temperature equalizing member such as a heat pipe and a cooling liquid passage is disposed between a first support substrate and each of second support substrates or is disposed inside the first support substrate. This makes it possible to equalize temperature among the plurality of second support substrates and further equalize temperature among the printing element substrates bonded to these support substrates. In addition, the temperature equalizing member is made close to the printing element substrate, thus making it possible to efficiently equalize temperature.

Piezoelectric ceramic thick film element, array of elements, and devices

A piezoelectric thick film element array includes at least one piezoelectric element structure having a thickness between 10 mum to 100 mum formed by a deposition process. The at least one piezoelectric element is patterned during the deposition process, and includes a first electrode deposited on a first surface of the piezoelectric elements structure, and a second electrode deposited on a second surface of the piezoelectric element structure. In a further embodiment, several devices are provided using a piezoelectric element or an array having a piezoelectric element structure with a thickness of between 10 mum to 100 mum formed by a deposition process. These devices include microfluidic ejectors, transducer arrays and catheters.

Inkjet printhead assembly with an ink storage and distribution assembly

A printhead assembly includes an ink storage and distribution assembly connectable to an ink supply. An elongate printhead integrated circuit is mounted on the ink storage and distribution assembly to receive ink therefrom. A housing is positioned on the ink storage and distribution assembly. A pair of busbars is mounted on the housing. A tape automated bonding strip is connected between each busbar and the printhead integrated circuit to provide power and control signals to the printhead integrated circuit.

Fluid structure with compression molded fluid channel

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment.

Fluid ejection die and glass-based support substrate

Examples include a glass-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises nozzles for dispensing printing material. The glass-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.

Wide-format printer with a pagewidth printhead assembly

A printer includes a pair of feet upon which the printer can rest. A pair of spaced apart and upright legs extends from respective feet. A supply spool is rotationally mounted between the legs and is configured to carry a wound length of print media. A printhead assembly is fast between the legs and defines a passage through which print media unwound from the supply spool can pass. The printhead assembly includes a printhead which can eject ink onto the print medium passing through the passage. An uptake spool is rotationally mounted between the legs and the printed print medium can be wound thereon.

Wide format pagewidth inkjet printer

A print assembly for a wide format pagewidth inkjet printer includes an elongate carrier that is mountable on a support structure of the printer and is positioned an operative distance from a platen of the printer. A number of printhead chips are mounted on the carrier. The printhead chips are provided in a number and configuration such that the printhead chips define a printing zone between the carrier and the platen, the printing zone having a length of at least 36 inches (914 mm). Each printhead chip is of the type that incorporates a plurality of nozzle arrangements, each nozzle arrangement being in the form of a micro electromechanical system to achieve the ejection of ink from the nozzle arrangement. Control circuitry is positioned on the carrier and is operatively connected to the printhead chips to control operation of the printhead chips.

Ink supply system for a printhead

An ink supply system, suitable for supplying ink to a printhead contained in a portable electronic device, is provided. The ink supply system comprises: (a) at least one ink reservoir; (b) a corresponding ink chamber for each ink reservoir, each ink chamber being in fluid communication with its respective reservoir, wherein each ink chamber comprises a plurality of baffles for minimizing ink flow fluctuations in the ink supply system; and (c) an ink manifold in fluid communication with each ink chamber, the ink manifold comprising a plurality of ink channels configured to distribute ink from each ink chamber to a plurality of ink inlets in a printhead.

Ink refill unit with sequential valve actuators

A refill unit for refilling an ink storage compartment with an interface for releasably engaging with the refill unit, the interface having valves for controlling ink flows into, and out of, the storage compartment, the refill unit comprising: a body containing a quantity of ink; an ink outlet; and, valve actuators for actuating the valves when the refill unit engages the interface; such that, the valve actuators actuate the valves in a predetermined sequence.

NOZZLE ARRANGEMENT WITH AN ACTUATOR HAVING IRIS VANES

A nozzle arrangement for an inkjet printhead includes a substrate; a plurality of posts extending from the substrate; a roof portion defining an ejection port, the roof portion supported by the plurality of posts; a plurality of vanes extending from the substrate and arranged to define a chamber with the substrate and the roof portion; and a plurality of thermal bend actuators respectively positioned at a base of each vane, each thermal bend actuator including a rigid arm and an expandable arm attached to an end of the rigid arm. Each expandable arm contains therewithin a heater element. The plurality of thermal bend actuator are adapted to bend the vanes inwards with respect to the chamber in response to an electrical signal applied to each heater element, the plurality of thermal bend actuators bending the vanes in an iris-type manner to reduce a volume of the chamber.

Liquid ejection head

A metallic cavity unit is formed with liquid flow passages respectively continued from a common liquid reservoir to nozzle orifices via pressure chambers. In an actuator unit, a plurality of piezoelectric elements are supported on a fixation plate in a cantilevered manner. A resin casing is formed with a first face onto which the cavity unit is bonded, and an actuator chamber which accommodates the actuator unit therein such that free ends of the piezoelectric elements are abutted onto the cavity unit. A metallic reinforcement member is integrally molded with the casing such that at least a part thereof is buried in the casing at the vicinity of the first face.

Inkjet printhead having nozzle plate supported by encapsulated photoresist

An inkjet printhead is provided. The printhead comprises a plurality of nozzles formed on a substrate, and at least one nozzle plate spaced apart from the substrate. The nozzle plate is supported, at least partially, by encapsulated photoresist. Hence, the nozzle plate has improved robustness.

Method of manufacturing a microscale nozzle

Method of manufacturing a microscale nozzle, comprising the steps of forming a microscale channel in the top surface of a substrate, said microscale channel comprising an inlet end and a nozzle-end, depositing a nozzle-forming layer in a section of the microscale channel, and removing material from the substrate at the nozzle-end of the microscale channel to expose at least a portion of said nozzle-forming layer. The manufactured microscale nozzle may be used for transferring a liquid sample form a microchip fluidic system into an external analytical device.

ELEMENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

An element substrate includes a substrate including a supply port configured to supply liquid, and a discharge port forming member including a discharge port configured to discharge the liquid supplied from the supply port. The discharge port forming member includes a liquid flow path communicating between the discharge port and the supply port on a surface opposed to a surface where the discharge port is provided. The discharge port forming member includes thick film portions and thin film portions in a region where the liquid flow path is formed. The thick film portions are lined up in a first direction so as to sandwich the discharge port therebetween and thicker than an adjacent portion adjacent to the discharge port. The thin film portions are lined up in a second direction intersecting with the first direction so as to sandwich the discharge port therebetween and thinner than the adjacent portion. 1. An element substrate comprising:a substrate including a supply port configured to supply liquid; anddischarge port forming member including a discharge port configured to discharge the liquid supplied from the supply port,wherein the discharge port forming member includes, on a surface opposed to a surface where the discharge port is provided, a liquid flow path communicating between the discharge port and the supply port, and includes thick film portions and thin film portions in a region where the liquid flow path is formed, the thick film portions being lined up in a first direction so as to sandwich the discharge port therebetween and thicker than an adjacent portion adjacent to the discharge port, the thin film portions being lined up in a second direction intersecting with the first direction so as to sandwich the discharge port therebetween and thinner than the adjacent portion.2. The element substrate according to claim 1 , wherein the second direction is orthogonal to the first direction.3. The element substrate according to claim 1 , wherein the liquid ...

Liquid ejection head

A liquid ejection head includes a substrate having an ejection opening through which a liquid is ejected, a recessed member having a wall defining a recess in which the substrate is disposed away from the wall with a gap therebetween, and a sealing member filling the gap. The sealing member includes a cured product of a composition containing a first polyol compound, an isocyanate compound having an isocyanate group, and a second polyol compound that is more reactive with the isocyanate group than the first polyol compound.

Printing cartridge with capacitive sensor identification

A printing cartridge ( 1230 ) includes a housing ( 1231 ). An actuating formation ( 1240 ) is positioned on the housing and is capable of actuating a number of capacitive sensors ( 1238 ) in an array of such sensors. The actuating formation is configured to represent data relating to at least one of: a serial number of the cartridge, a media and a media colorant, so that the capacitive sensors, when actuated, together generate a signal carrying such data ...

Flexible display assembly having flexibly connected screen

A flexible display assembly is provided comprising a flexible display screen, PCB's arranged on the screen and flexible connectors connecting the PCB's to the screen. The screen has a foldable region and a series of connection points arranged on either side of the foldable region. The PCB's are positioned on either side of the foldable region. Each PCB has a series of connection points arranged for electrical connection to respective connection points of the screen. The flexible connectors are arranged as a series on either side of the foldable region. Each series of flexible connectors comprises connectors of progressively longer lengths arranged from the connection points closest to the foldable region to the connection points furthest from the foldable region.

Molded nozzle plate with alignment features for simplified assembly

An ink jet print head includes a molded nozzle plate, the molded nozzle plate further including molded die alignment features. The molded die alignment features can be registered to the apertures of the print head die.

INKJET PRINTHEAD HAVING THERMAL BEND ACTUATOR HEATING ELEMENT ELECTRICALLY ISOLATED FROM NOZZLE CHAMBER INK

An ink jet printhead includes a number of nozzle devices formed on a substrate. Each nozzle device has a nozzle chamber, a nozzle opening through which ink from the nozzle chamber is ejected, a movable element in contact with ink in the nozzle chamber to cause the ejection of ink and thermal bend actuator. The thermal bend actuator has a proximal end anchored to the substrate and a distal end connected to the movable element. The actuator includes a first portion adjacent the proximal end and having a conducting heating circuit layer for heating the actuator. A second end portion of the actuator extends to the movable element and is in contact with ink in the chamber. A dielectric slot electrically isolates the first and second portions so that electric energy in the heating circuit layer is not conducted by the actuator to the ink in the chamber.

FLUID EJECTION DEVICE AND METHOD OF MANUFACTURING A FLUID EJECTION DEVICE

A mold (40) configured to be coupled to a fluid ejection head die (30) to allow a protective material (38) to be molded around a plurality of contact pads (34) on the die (30) is disclosed. The mold (40) includes a molding surface (43) configured to cover the contact pads (34), wherein the molding surface (43) is configured to support and shape the protective material (38) during molding, and at least one side (45) extending away from the molding surface (43), wherein the side (45) is configured to contain the protective material (38) during molding.

Ink jet recording head and method of manufacture therefor, and laser processing apparatus and ink jet recording apparatus

A common recess, grooves, and common recess and/or column members (7) in the grooves are formed on a base board at the same time, and such board is made a second base board (5), which is coupled to a first base board (2) on which elements (1) for liquid discharging energy are formed; hence obtaining an ink jet recording head provided with a filter unit in an arbitrary position in the region formed by the ink paths and the common liquid chamber (4). The filter unit (8) can be processed by a single processing in the ink paths and/or the common liquid chamber (4) to make it possible to prevent disabled discharge from taking place due to dust particles intermingled at the time of head manufacture. In this way, the discharging stability is enhanced, making a high-speed printing possible. A work is efficiently processed by a single processing which is performed to process a three-dimensional configuration with respect to the direction in which the laser beam is irradiated. ...

Ink jet recording head and ink jet recording apparatus

Method for producing a layered piezoelectric element

In a method of manufacturing a layered piezoelectric element 38 constructed from alternately stacked piezoelectric ceramic layers 40 and internal electrode layers 42, 44 and having a plurality of fine actuator portions 46, wherein the layered piezoelectric element 38 deforming the actuator portions 46 in the direction in which they are stacked, slit-shaped holes 52 are formed using ultrasonic wave abrasive particle machining after sintering the stacked body of green sheets 50, 51. The holes 52 are formed as through holes in the layered piezoelectric element 38. The actuator portions 46 are formed so as to be connected by non-through-hole portions 48 at both ends. ...

Piezoelectric/electrostrictive film element having convex diaphragm portions and method of producing the same

A piezoelectric/electrostrictive film element which includes a ceramic substrate (2, 22) having at least one window (6, 36) and a diaphragm portion (10) for closing each window, and a film-like piezoelectric/electrostrictive unit (18, 24) formed on the diaphragm portion. The diaphragm portion has a convex shape and protrudes outwards, in a direction away from the corresponding window. The piezoelectric/electrostrictive unit includes a lower electrode (12, 40), a piezoelectric/electrostrictive layer (14, 42) and an upper electrode (16, 44), which are formed in lamination in the order of description on a convex outer surface of the diaphragm portion by a film-forming method. Also disclosed is a method of producing the piezoelectric/electrostrictive film element as described above. ...

A method for manufacturing a liquid jet recording head, a liquid jet recording head manufactured by such method, and a liquid jet recording apparatus having such head mounted thereon

MOLDED PRINT BAR

MANUFACTURE OF MULTINOZZLE HEAD

PURPOSE: To obtain the captioned head by a method wherein wires are wound round a specific supporting member and, after being put together with a metal mold and hardened by the injection of resin, various kinds of specific treatment such as oxygen plasma etching processing are applied thereto, thereby minute orifices being formed with high accuracy on even a thick plate. CONSTITUTION: Wires 7 are continuously wound round the supporting member 1 through an intermediary of its guide part 2 and an injection metal mold 8 is laid on the member 1. Next, in both space parts 6 and 12 of 1 and 8 a substrate material 13 such as resin is filled up and hardened, being pulled out as a substrate material 14 with wires. Then, a ground surface 16 is formed by grinding one surface perpendicular to the wires 7 and etching is applied in an oxygen plasma environment to the surface 16, thereby the wires 7 being exposed as projections. Next, conductivity treatment is applied to the surface 17 of the substrate ...

FORMING METHOD OF NOZZLE OF INK JET RECORDING HEAD

PURPOSE: To obtain a nozzle capable of atomizing ink stably and causing atomized ink particles to fly stably by such as arrangement wherein when the nozzle of an ink jet head is molded by electroforming, a spiral projection or groove is formed around its core. CONSTITUTION: For example, on the outer surface of a core 1 of 30μm in diameter, a pair of straight grooves 1a, 1b of 2W5μm in depth are formed in its axial direction, and this core is installed between the hook 8a of a supporting member 3 and a twisting member 4 and this assembly is set in an electrodeposit tank 2, and after that the twisting member 4 is twisted and spiral grooves 1a, 1b are formed on the outer surface of the core 1. An electrodeposit layer 10 is formed on the core 1 by electroforming method, and after that, the core 1 is removed (e.g.; by dissolution). The electrodeposit layer 10 thus obtained is cut into a desired size to obtain the titled nozzle. COPYRIGHT: (C)1983,JPO&Japio ...

ФОРМОВАННАЯ ПРОТОЧНАЯ ДЛЯ ТЕКУЧЕЙ СРЕДЫ СТРУКТУРА

Проточная для текучей среды структура печатающей головки, содержащая монолитное формованное изделие, микроустройство, заформованное в формованном изделии, при этом микроустройство содержит по меньшей мере один электрический вывод. Проводник, электрически соединенный с упомянутым по меньшей мере одним электрическим выводом и внедренный в монолитное формованное изделие. Канал, ограниченный в монолитном формованном изделии, по которому текучая среда течет непосредственно к микроустройству. Предложенное решение способствует снижению себестоимости в чернильно-струйных принтерах с печатающей головкой во всю ширину подложки. 4 н. и 10 з.п. ф-лы, 31 ил.

Druckkopf und Verfahren zum Kontrollieren der Ausbreitung eines Fluids um eine Düsenöffnung

Polymerzusammensetzung für Transfer-Giessen zur Herstellung eines Farbstrahlaufzeichnungskopfes und unter deren Verwendung hergestellter Farbstrahlaufzeichnungskopf

Droplet deposition apparatus and method for manufacturing the same

INK JET RECORDING SYSTEM

Method of and apparatus for manufacturing a jet-nozzle plate for an ink-jet printer

To manufacture a jet nozzle, the nozzle plate is first drawn through a drawing ring of spring steel in one operation by a press and punch die having the internal dimensions of the jet nozzle, the plate subsequently being punched during further drawing in a hard elastic plastic block which serves as a cutting cushion. The drawing ring is then slightly pressed into the plastic. All parts of the press and punch tool which are subject to the pressure exerted by the die and the die itself have been polished to be free from hair lines.

INK RADIATION RECORDING HEAD, RECORDING DEVICE AND MANUFACTURING PROCESS AND DEVICE FOR THE PRODUCTION OF THE HEAD

EQUIPMENT FOR THE PRODUCTION OF INK RADIATION PRINT HEADS

POLYMER COMPOSITION FOR TRANSFER POURING FOR THE PRODUCTION OF A COLOR RADIATION RECORDING HEAD AND UNDER THEIR USE OF MANUFACTURE COLOR RADIATION RECORDING HEAD

PROCEDURE FOR THE PRODUCTION OF A COLOR RADIATION RECORDING HEAD

Ink ejection nozzle with thermal actuator coil

A printhead for an inkjet printer is disclosed. The printhead has ink nozzles formed on a print face of the printhead. Each ink nozzle has an ink chamber with an ink ejection port and an ink inlet port. A paddle device is arranged inside each chamber. Each ink nozzle further has a bi-layer thermal actuator coil with a fee end connected to the paddle device. Heating of the thermal actuator coil displaces the paddle device, causing ejection of an ink droplet through the ink ejection port.

Handheld imaging device with image processor provided with multiple parallel processing units

A handheld imaging device includes an image sensor for sensing an image; a micro-controller integrating therein a dedicated image processor for processing the sensed image, a bus interface, and an image sensor interface; and a plurality of processing units connected in parallel by a crossbar switch, the plurality of processing units provided within the micro-controller to form a multi-core processing unit for the processor. The image sensor interface provides communication between the micro-controller and the image sensor. The bus interface provides communication between the micro-controller and devices external to the micro-controller other than the image sensor.

Handheld imaging device with multi-core image processor integrating image sensor interface

A handheld imaging device includes an image sensor for sensing an image; a processor for processing the sensed image; a multi-core processing unit provided in the processor, the multi-core processing unit having a plurality of processing units connected in parallel by a crossbar switch; and an image sensor interface for converting signals from the image sensor to a format readable by the multi-core processing unit, the image sensor interface sharing a wafer substrate with the processor. A transfer of data from the image sensor interface to the plurality of processing units is conducted entirely on the shared wafer substrate.

Handheld imaging device with vliw image processor

A handheld imaging device includes an image sensor for sensing an image: a Very Long Instruction Word (VLIW) processor for processing the sensed image; a plurality of processing units provided in the VLIW processor, the plurality of processing units connected in parallel by a crossbar switch to form a multi-core processing unit for the VLIW processor; and an image sensor interface for receiving signals from the image sensor and converting the signals to a format readable by the VLIW processor, the image sensor interface sharing a wafer substrate with the VLIW processor. A transfer of data from the image sensor interface to the VLIW processor is conducted entirely on the shared wafer substrate.

Camera system with color display and processor for reed-solomon decoding

A camera system including: a substrate having a coding pattern printed thereon and a handheld digital camera device. The camera device includes: a digital camera unit having a first image sensor for capturing images and a color display for displaying captured images to a user; an integral processor configured for: controlling operation of the first image sensor and color display; decoding an imaged coding pattern printed on a substrate, the printed coding pattern employing Reed-Solomon encoding; and performing an action in the handheld digital camera device based on the decoded coding pattern. The decoding includes the steps of: detecting target structures defining the extent of the data area; determining the data area using the detected target structures; and Reed-Solomon decoding the coding pattern contained in the determined data area.

PROCESS FOR PRODUCING A LIQUID EJECTION HEAD

Provided is a process for producing a liquid ejection head which includes a substrate having an energy generating element and a wall member joined with the substrate to form an ejection orifice which ejects liquid and a flow path which communicates to the ejection orifice, the process including, in the following order, the steps of (B) forming, on the substrate, a flow path pattern form for forming the flow path, (C) forming, around the flow path pattern form, a cover resin layer for forming the wall member, and (D) transferring a surface form of the substrate to a surface of the cover resin layer so as to correspond to a pattern of the surface form of the substrate. 1. A process for producing a liquid ejection head which includes a substrate having an energy generating element and a wall member joined with the substrate to form an ejection orifice which ejects liquid and a flow path which communicates to the ejection orifice , the process comprising , in the following order , the steps of:(B) forming, on the substrate, a flow path pattern form for forming the flow path;(C) forming, around the flow path pattern form, a cover resin layer for forming the wall member; and(D) transferring a surface form of the substrate to a surface of the cover resin layer so as to correspond to a pattern of the surface form of the substrate.2. A process for producing a liquid ejection head according to claim 1 , further comprising claim 1 , prior to the step (B) claim 1 , a step (A) of producing a replica mold to which the surface form of the substrate has been transferred by being pressed against a surface of the substrate claim 1 ,wherein the step (D) comprises a step of pressing the replica mold against the surface of the cover resin layer so that a pattern transferred to the replica mold and the pattern of the surface form of the substrate correspond to each other.3. A process for producing a liquid ejection head according to claim 2 , wherein the step (B) comprises in the ...

Process for production of functional device, process for production of ferroelectric material layer, process for production of field effect transistor, thin film transistor, field effect transistor, and piezoelectric inkjet head

A method of producing a functional device according to the present invention includes, in this order: the functional solid material precursor layer formation step of applying a functional liquid material onto a base material to form a precursor layer of a functional solid material; the drying step of heating the precursor layer to a first temperature in a range from 80° C. to 250° C. to preliminarily decrease fluidity of the precursor layer; the imprinting step of imprinting the precursor layer that is heated to a second temperature in a range from 80° C. to 300° C. to form an imprinted structure on the precursor layer; and the functional solid material layer formation step of heat treating the precursor layer at a third temperature higher than the second temperature to transform the precursor layer into a functional solid material layer.

MANUFACTURING METHOD OF LIQUID EJECTION HEAD, LIQUID EJECTION HEAD, AND INKJET PRINTING APPARATUS

In the case where a slit is provided in a projection portion of an outlet plate, patterning property of a slit can be improved, and a desired slit can be formed. The present invention is a manufacturing method of a liquid ejection head including a substrate; an ejection outlet plate; a channel; and the supply ports formed between the substrate and the ejection outlet plate by joining of the ejection outlet plate onto the substrate; and a projection portion having a slit at a position facing the supply port of the ejection outlet plate, the method including the steps of: forming a first member on the substrate; forming a mold material for forming the slit between first member on the substrate; forming a second member serving as the ejection outlet plate on the mold material; forming the projection portion by removing the mold material. 1. A manufacturing method of a liquid ejection head including a substrate on which a plurality of elements each generating energy for ejecting liquid is aligned and which has a supply port extending in an alignment direction of the plurality of elements; an ejection outlet plate provided with a plurality of ink ejection outlets each ejecting liquid; a channel communicating with the plurality of ejection outlets and the supply ports formed between the substrate; and the ejection outlet plate by joining of the ejection outlet plate onto the substrate; and a projection portion having a slit at a position facing the supply port of the ejection outlet plate , the method comprising the steps of:forming a first member on the substrate;forming a mold material for forming the slit between first member on the substrate;forming a second member serving as the ejection outlet plate on the mold material; andforming the projection portion by removing the mold material.2. The manufacturing method of a liquid ejection head according to claim 1 , whereinthe mold material for forming a slit is provided at a position in contact with the first member.3. ...

MANUFACTURING METHOD OF SUBSTRATE FOR LIQUID EJECTION HEAD

Provided is a method for manufacturing a substrate for liquid ejection head including an ejection energy generating element and a nozzle layer including an ejection port and a liquid channel. The method includes the steps of: forming, on the substrate including the element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface to planarize a surface of the nozzle layer; coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer; exposing the resin layer to ultraviolet rays, thus forming the ejection port; and selectively removing the mold for the liquid channel, thus forming the liquid channel. 1. A method for manufacturing a substrate for liquid ejection head including an ejection energy generating element to generate energy to eject liquid , and a nozzle layer including an ejection port to eject liquid and a liquid channel communicating with the ejection port , the liquid channel being configured to dispose liquid on the ejection energy generating element , the method comprising the steps of:(1) forming, on the substrate including the ejection energy generating element, a metal mold member made of metal and having a flat surface, the metal mold member making up at least a part of a mold for the liquid channel, and a planarization layer made of the metal and having a flat surface, the planarization layer being configured to planarize a surface of the nozzle layer;(2) coating the mold for the liquid channel and the planarization layer with negative-type photosensitive resin, thus forming a negative-type photosensitive resin layer to be the nozzle layer;(3) exposing the negative-type photosensitive resin layer to ultraviolet rays, thus forming the ejection port; and(4) selectively ...

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME

Provided is a liquid ejection head, including: a substrate including: a supply port that is a through hole for supplying liquid; an energy generating element for generating energy to be used for ejecting the liquid; a first film that covers the energy generating element; and a second film formed on the first film; and a flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice, in which when viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film. 1. A liquid ejection head comprising: a supply port that is a through hole for supplying liquid;', 'an energy generating element for generating energy to be used for ejecting the liquid;', 'a first film that covers the energy generating element; and', 'a second film formed on the first film; and, 'a substrate comprisinga flow path forming member bonded to the substrate, for forming a flow path for supplying the liquid supplied from the supply port to an ejection orifice,wherein, when viewed from a direction perpendicular to the substrate, an end portion of the first film extends inwardly from an opening edge of the supply port, and an end portion of the second film is located between the opening edge of the supply port and the end portion of the first film.2. The liquid ejection head according to claim 1 , wherein the second film is made of a material having hardness lower than hardness of the flow path forming member.3. The liquid ejection head according to claim 1 , wherein claim 1 , when viewed from the direction perpendicular to the substrate claim 1 , the end portion of the second film extends inwardly from the opening edge of the supply port.4. The liquid ejection head according to claim 1 , wherein the ...

MOLDING A FLUID FLOW STRUCTURE

In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device. 1. A process for making a print bar , comprising:arranging multiple printhead die slivers on a carrier in a pattern for a print bar, each die sliver having an inlet through which fluid may enter the die sliver and a front with orifices through which fluid may be dispensed from the die sliver, and the die slivers arranged on the carrier with the front of each die sliver facing the carrier;molding a body of material around each die sliver without covering the orifices on the front of the die sliver;forming openings in the body at the inlets;removing the die slivers from the carrier; andseparating groups of die slivers into print bars.2. The process of claim 1 , further comprising:applying a pattern of electrical conductors to the carrier;connecting an electrical terminal on each die sliver to a conductor; andmolding the body around the conductors simultaneously with molding the body around each die sliver.3. The process of claim 1 , wherein forming the openings comprises molding the openings into the body simultaneously with molding the body around each die sliver.4. The process of claim 1 , wherein forming the openings comprises applying a pre-molding form to the die slivers in a pattern defining the openings and then molding the body of material around the die slivers.5. The process of claim 1 , wherein molding the body comprises molding a monolithic body of material simultaneously around all of the die slivers.6. The process of claim 5 , wherein molding the body simultaneously around each die sliver comprises transfer molding a monolithic body of material simultaneously around all of the die slivers.7. The process of claim 1 , wherein removing the die slivers is performed after separating groups of die slivers into print bars.8. A process ...

Molded printhead

In one example, a molded printhead includes a printhead die embedded in a molding and an external electrical contact electrically connected to the printhead die and exposed outside the molding to connect to circuitry external to the printhead. The molding has a channel therein through which fluid may pass to the back part of the die. The front part of the die is exposed outside the molding and the back part of the die is covered by the molding except at the channel and the thickness of the molding varies from a lesser thickness around the die to a greater thickness away from the die.

PRINTHEAD CARTRIDGE MOLDED WITH NOZZLE HEALTH SENSOR

In some examples, a print cartridge includes a monolithic molding, and a printhead die embedded into a molding. The printhead die has a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid is to pass directly to the back surface. The printhead die also has a nozzle health sensor molded into the molding to detect defective nozzles in the printhead die. 1. A print cartridge comprising:a monolithic molding;a printhead die embedded into the molding, the printhead die having a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid is to pass directly to the back surface; anda nozzle health sensor molded into the molding to detect defective nozzles in the printhead die.2. The print cartridge of claim 1 , wherein the nozzle health sensor comprises:a light illuminator molded into the molding;an optical detector molded into the molding to sense light emitted by the light illuminator.3. The print cartridge of claim 2 , wherein the optical detector comprises an imaging sensor selected from the group consisting of a charge coupled device (CCD) claim 2 , a complementary metal oxide semiconductor (CMOS) device claim 2 , a photomultiplier tube (PMT) claim 2 , a contact image sensor (CIS) claim 2 , and a photodiode.4. The print cartridge of claim 2 , wherein the light illuminator comprises a light emitting diode.5. The print cartridge of claim 1 , wherein the nozzle health sensor comprises:an illumination array molded into a first side of the molding;a detection array molded into a second side of the molding to sense light emitted by the illumination array; andan optical component to direct light emitted by the illumination array across the front surface of the printhead die to the detection array.6. The print ...

PRINTHEAD

A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device. 1. A printhead comprising:a number of inkjet slivers molded into a moldable substrate, the overmolded inkjet slivers forming at least one printhead die; anda number of wire bonds electrically coupling the inkjet slivers to a side connector, the side connector to electrically couple the inkjet slivers to a controller of a printing device.2. The printhead of claim 1 , wherein the side connector comprises a printed circuit board (PCB) side connector.3. The printhead of claim 2 , wherein the PCB side connector is molded into the moldable substrate.4. The printhead of claim 1 , wherein the side connector comprises a lead frame embedded into the moldable substrate claim 1 , the lead frame comprising:a number of electrical traces from the wire bonds; anda number of connection pads coupled to the electrical traces;wherein the connection pads electrically couple the inkjet slivers to the controller of the printing device.5. The printhead of claim 1 , further comprising an encapsulating cover disposed on the wire bonds.6. The printhead of claim 1 , wherein the moldable substrate is an epoxy molding compound (EMC).7. The printhead of claim 1 , wherein the side connector is electrically coupled to the inkjet slivers at an edge of each of the inkjet slivers.8. A printhead die comprising:a moldable substrate;a number of inkjet slivers molded into the moldable substrate; anda number of electrical wire leads connecting the slivers to an edge connector coupled to the moldable substrate.9. The printhead die of claim 8 , wherein the edge connector comprises:a printed circuit board (PCB) embedded within the moldable substrate;a first set of ...

LIQUID EJECTION HEAD

A liquid ejection head is provided with a recording element substrate having a plurality of ejection orifices for ejecting a liquid, the plurality of ejection orifices being arranged to form a row of the ejection orifices. In at least some of the plurality of the ejection orifices, the area of an inner wall of the ejection orifices is set to be larger on the other side than on one side, the other side and the one side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles and extends along the direction of the depth of the ejection orifice. 1. A liquid ejection head comprising:a recording element substrate which has a plurality of ejection orifices for ejecting a liquid,wherein the plurality of the ejection orifices are arranged to form a row of the ejection orifices, andin at least some of the plurality of the ejection orifices, the area of an inner wall of each of the ejection orifices is set to be larger on the other side than on one side, the other side and the one side being defined by a plane which passes through the center of the ejection orifice, intersects with the row of the ejection orifices at right angles, and extends along the direction of the depth of the ejection orifice.2. The liquid ejection head according to claim 1 , wherein claim 1 , in at least some of the plurality of the ejection orifices claim 1 , at least one projection is provided on the other side of the inner wall.3. The liquid ejection head according to claim 1 , wherein the plurality of the ejection orifices are symmetrical relative to an axis which passes through the center of the ejection orifice and which is parallel to the row of the ejection orifices claim 1 , as observed from a surface of the recording element substrate in which the plurality of the ejection orifices are formed.4. The liquid ejection head according to claim 1 , wherein the one side is a side closer to the center of the row ...

Applying mold chase structure to end portion of fluid ejection die

A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.

TRANSFER MOLDED FLUID FLOW STRUCTURE

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel. 1. A fluid flow structure , comprising:a micro device embedded in a molding;a fluid feed hole formed through the micro device; anda transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.2. A structure as in claim 1 , wherein the channel has a shape with contours that inversely follow a topography of a mold chase used to form the channel.3. A structure as in claim 1 , wherein the channel comprises first and second sidewalls that diverge from one another as they extend away from the micro device and converge toward one another as they near the micro device.4. A structure as in claim 1 , wherein the channel comprises first and second straight side walls that are substantially parallel to one another.5. A structure as in claim 1 , wherein the channel comprises first and second straight side walls that are tapered with respect to one another.6. A structure as in claim 1 , wherein the channel comprises first and second curved side walls that mirror one another.7. A structure as in claim 1 , wherein the channel comprises first and second side walls claim 1 , each side wall having multiple contours selected from the group consisting of a straight contour claim 1 , a tapered contour claim 1 , and a curved contour.8. A structure as in claim 7 , wherein the multiple contours of the first side wall mirror the multiple contours of the second side wall.9. A fluid flow structure comprising:a monolithic body transfer molded around multiple printhead sliver substrates; andmultiple transfer molded fluid channels in the body through which fluid can flow directly to one or more of the substrates.10. A structure as in claim 9 , wherein the channels have different shapes.11. A structure ...

MOLDED PRINTHEAD

In one example, a printhead includes: a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel; an electrical contact exposed outside the molding to connect to circuitry external to the printhead; a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; and an electrical connection between the die and the printed circuit board conductor fully encapsulated in the molding. 1. A printhead , comprising:a printhead die having a front face along which fluid may be dispensed from the die, the die molded into a monolithic molding having a channel therein through which fluid may pass directly to a back part of the die, the front face of the die exposed outside the molding and the back part of the die covered by the molding except at the channel;an electrical contact exposed outside the molding to connect to circuitry external to the printhead;a printed circuit board molded into the molding, the printed circuit board having an exposed front face co-planar with and surrounding the exposed front face of the die and a conductor electrically connected to the contact; andan electrical connection between the die and the printed circuit board conductor.2. The printhead of claim 1 , wherein the exposed front face of the die claim 1 , the exposed front face of the printed circuit board claim 1 , and a front face of the molding together form a continuous planar surface defining a front face of the printhead.3. The printhead of claim 2 , wherein the electrical connection is between the back part of the die and the printed circuit board ...

LIQUID EJECTION HEAD MANUFACTURE METHOD AND LIQUID EJECTION HEAD

When a filter for example is provided in a liquid supply path in the manufacture of a liquid ejection head, the filter can be prevented from being displaced or deformed. A manufacture method of a liquid ejection head having a liquid ejection unit for ejecting liquid and a liquid supply unit for supplying liquid to the liquid ejection unit has a processing of abutting a filter to a melting unit provided in the liquid supply unit and applying heat to the melting unit via the filter to melt the melting unit to thereby fix the filter to the melting unit, and a processing of burying the melting unit fixed to the filter by molding material. 1. A manufacture method of a liquid ejection head having a liquid ejection unit for ejecting liquid and a liquid supply unit for supplying liquid to the liquid ejection unit , comprising:a step of abutting a filter to a melting unit provided in the liquid supply unit and applying heat to the melting unit via the filter to melt the melting unit to thereby fix the filter to the melting unit; anda step of burying the melting unit fixed to the filter by molding material.2. The manufacture method of the liquid ejection head according to claim 1 , wherein:the melting unit has a projection-like shape protruding from a position at which the melting unit is provided in the liquid supply unit.3. The manufacture method of the liquid ejection head according to claim 1 , wherein:the filter is fixed between liquid supply members that constitute the liquid supply unit and that are opposed to each other and the melting unit is provided in one of the opposed liquid supply members.4. The manufacture method of the liquid ejection head according to claim 3 , wherein:the burying step is a step that is performed, in a step of using a mold to mold the liquid supply unit, in a step of ejecting molding material after a mold clamping step for joining the opposed liquid supply members.5. The manufacture method of the liquid ejection head according to claim 4 , ...

Printhead with non-epoxy mold compound

A printhead may include a non-epoxy mold compound layer and a number of slivers overmolded into the non-epoxy mold compound layer. A media wide array may include a number of printhead dies and a layer of moldable material, wherein the moldable material includes a non-epoxy mold compound overmolded onto the number of printhead dies.

LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING SAME

A liquid ejection head is equipped with a substrate having therethrough a supply path to be supplied with a liquid, a top plate placed opposite to the substrate, having an ejection orifice for ejecting the liquid and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice and a columnar member extending from the top plate to the inside of the supply path through the flow path. An end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice. 1. A liquid ejection head , comprising:a substrate having therethrough a supply path to be supplied with a liquid;a top plate placed opposite to the substrate, equipped with an ejection orifice for ejecting the liquid, and constituting, between the top plate and the substrate, a flow path communicated with the supply path and the ejection orifice; anda columnar member extending from the top plate to an inside of the supply path through the flow path,wherein an end surface of the columnar member positioned in the supply path is tilted relative to the top plate in a direction away from the ejection orifice.2. The liquid ejection head according to claim 1 , further comprising:other columnar members extending from the top plate to an inside of the supply path through the flow path,wherein the columnar member and the other columnar members are each placed along a wall surface of the supply path.3. The liquid ejection head according to claim 1 , further comprising:other columnar members extending from the top plate to an inside of the supply path through the flow path,wherein the columnar member and the other columnar members are placed at equal intervals in two directions orthogonal to each other.4. The liquid ejection head according to claim 1 ,wherein a tilt angle of the end surface to a side surface of the columnar member is smaller with an increase in a distance from a center ...

CURVED FLUID EJECTION DEVICES

A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device. 1. A curved fluid ejection device , comprising:a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC), each of the fluid ejection dies and the EMC comprising a coefficient of thermal expansion (CTE),wherein the combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.2. The curved fluid ejection device of claim 1 , wherein the curve matches a radius of a print medium over a roller within a printing device.3. The curved fluid ejection device of claim 1 , wherein: a first layer of EMC comprising a first CTE, and', 'a second layer of EMC comprising a second CTE., 'the at least one layer of EMC comprises two layers of EMC, the two layers of EMC comprising4. The curved fluid ejection device of claim 3 , wherein the degree of curvature of the curved fluid ejection device is defined by a thickness of a silicon layer of the ejection dies claim 3 , a CTE of the silicon layer claim 3 , a thickness of the first layer of EMC claim 3 , the first CTE of the first layer of EMC claim 3 , a thickness of the second layer of EMC claim 3 , the second CTE of the second layer of EMC claim 3 , a sequence of the first layer of EMC and the second layer of EMC within the curved fluid ejection device claim 3 , a Young's modulus of the materials used within the layers of the fluid ejection device claim 3 , changes in temperature during and after a curing process claim 3 , the locations and relative positions of the layers of the fluid ejection device claim 3 , or ...

FLUID EJECTION DEVICE WITH FLUID FEED HOLES

A fluid ejection die has a substrate through which an array of fluid feed holes is formed. The fluid feed holes are separated by ribs. Each fluid feed hole is to guide fluid to an array of drop generators. 1. A fluid ejection device , comprising:a fluid ejection die having a fluidics layer to dispense fluid and a substrate with a front surface on which the fluidics layer is formed and a back surface to receive fluid;an array of fluid feed holes through the substrate, the fluid feed holes separated by ribs between the fluid feed holes, each fluid feed hole to guide fluid from the back surface to the fluidics layer; andan array of drop generators in the fluidics layer downstream of and parallel to the array of fluid feed holes.2. The fluid ejection device of claim 1 , comprisinga molding, andan elongate channel in the molding to convey fluid to the back surface of the substrate to the fluid feed holes, wherein the ribs extend across the channel.3. The fluid ejection device of comprising a plurality of fluid ejection dies arranged parallel to one another laterally across the molding.4. A fluid ejection assembly comprising a plurality of fluid ejection devices of claim 3 , each device including a plurality of dies in parallel claim 3 , wherein the devices are arranged along the molding in a parallel and staggered configuration in which end portions of adjacent devices overlap.5. A fluid ejection assembly comprising a plurality of fluid ejection devices of claim 2 , wherein a printed circuit board is mounted to the fluid ejection device around the fluid ejection dies.6. The fluid ejection device of claim 1 , further comprising a manifold formed in the fluidics layer claim 1 , the separate fluid feed holes opening into the manifold claim 1 , the manifold extending along the at least one drop generator array to supply fluid to the drop generators.7. The fluid ejection device of wherein the die is between about 150 and 550 microns wide.8. The fluid ejection device as in ...

LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING SAME

A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material. 1. A liquid ejection head , comprising:a substrate;an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid;sidewall members of a liquid flow path; andan ejection port forming member that defines an ejection port from which the liquid is ejected, whereinsidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member,the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member,the covering member covers the front surface of the substrate, andthe ejection port forming member is formed of an inorganic material.2. The liquid ejection head according to claim 1 , wherein the core member is formed of at least one of novolac resin claim 1 , polyimide claim 1 , polyetheretherketone claim 1 , polyamide claim 1 , polyamide-imide claim 1 , polyether amide claim 1 , polyether imide claim 1 , epoxy resin claim 1 , polyphenylene sulfide claim 1 , polyarylate claim 1 , polysulfone claim 1 ...

FLUID STRUCTURE WITH COMPRESSION MOLDED FLUID CHANNEL

In an embodiment, a fluid flow structure includes a micro device embedded in a molding, and a fluid feed hole formed through the micro device. A fluid channel is fluidically coupled to the fluid feed hole and includes a first compression molded channel segment and a second material ablated channel segment. 1. A method of making a fluid channel in a printhead structure , comprising:positioning a printhead die on a carrier;compression molding the die into a molded printhead structure;compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die;materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.2. A method as in claim 1 , further comprising using the first segment of the channel as a mask during the ablating.3. A method as in claim 1 , wherein the materially ablating comprises removing a residual layer of molding material from between the first segment of the channel and the die.4. A method as in claim 3 , wherein the materially ablating further comprises removing material from a cap on the die to expose the fluid feed hole.5. A method as in claim 4 , wherein removing material from the cap comprises removing a material selected from the group consisting of silicon claim 4 , polymer claim 4 , metal claim 4 , and dielectric.6. A method as in claim 1 , wherein materially ablating comprises removing material using a process selected from the group consisting of powder blasting claim 1 , etching claim 1 , lasering claim 1 , milling claim 1 , drilling claim 1 , and electrical discharge machining.7. A fluid flow structure claim 1 , comprising:a micro device embedded in a molding;a fluid feed hole formed through the micro device; anda fluid channel fluidically coupled to the fluid feed hole that comprises a first compression molded channel segment and a second material ablated channel segment.8. A structure as in claim 7 , wherein the ...

PRINTBARS AND METHODS OF FORMING PRINTBARS

A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out. 1. A method of forming a printbar module , comprising:providing a solid printed circuit board (PCB) that does not include an opening extending through the PCB, wherein the PCB includes a recess extending partially into the PCB but not through the PCB and a dam surrounding the recess;applying an adhesive material to the recess;positioning a printhead die sliver in the recess;bonding the printhead die sliver with the PCB with an adhesive material disposed on a bottom surface of the recess;encapsulating the printhead die sliver and the PCB with a molding; andin response to encapsulating, forming a slot extending through the PCB and a portion of the adhesive material to the printhead die sliver, wherein the slot is in fluidic communication with a fluid feed hole of the printhead die sliver to provide direct fluidic communication without fan-out.2. The method of claim 1 , wherein forming includes forming the slot using a plunge-cut saw.3. The method of claim 1 , wherein bonding includes wire bonds coupling conductive elements of the PCB to conductive elements of the printhead die sliver.4. The method of claim 1 , wherein applying the adhesive material to the PCB includes applying adhesive material only to the recess of the PCB.5. The method of claim 1 , wherein forming includes forming the slot such ...

PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS

In an example, a fluid injection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity. 1. A fluid ejection apparatus comprising:a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity; anda printhead die electrically connected to the conductor layer and embedded in a molding material in the cavity such that the molding material is level with the cover layer.2. The apparatus of claim 1 , wherein the cover layer comprises a polymer.3. The apparatus of claim 2 , wherein the cover layer comprises polyimide claim 2 , polyethylene naphthalate claim 2 , or polyethylene terephthalate.4. The apparatus of claim 1 , wherein the cover layer is coupled to the conductor layer by an adhesive.5. The apparatus of claim 1 , wherein the cover layer comprises a polyimide film and an epoxy adhesive between the polyimide film and the conductor layer.6. The apparatus of claim 1 , wherein the cover layer is a first cover layer forming a first surface of the printed circuit board and wherein the printed circuit board includes a second cover layer forming a second surface claim 1 , opposite the first surface claim 1 , of the printed circuit board.7. The apparatus of claim 1 , wherein the cover layer includes an opening exposing a bond pad of the conductor layer and wherein the printhead die is electrically connected to the bond pad of the conductor layer.8. The apparatus of claim 7 , wherein printhead die is electrically connected to the bond pad of the printed circuit board by a wire bond and wherein the apparatus further comprises an encapsulant material encapsulating the wire bond.9. The apparatus of claim 1 , wherein the printhead die includes a through-silicon via extending to a bottom surface to electrically connect the printhead die to the conductor ...

METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE

There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer. 1. A method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member , the liquid discharge head substrate having a base , a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid , and a supply port for supplying the liquid to the pressure generation portion , and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion , the method comprising:providing a sacrificial layer on the front surface of the base;providing a cover layer at the front surface of the base, the cover layer covering the sacrificial layer and including an end covering portion for covering an end of the sacrificial layer;providing a resin layer for covering the end covering portion;providing a flow path mold member on a front surface of the cover layer and a front surface of the resin layer;providing the flow path forming member on a front surface of the flow path mold member; andremoving the sacrificial layer by etching the ...

PRINTHEAD

A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device. 1. An apparatus comprising:a moldable substrate formed of an epoxy molding compound that includes an epoxide; and a first portion to provide electrical connection to couple the die sliver; and', 'a second portion to provide electrical connection to couple the first portion and the controller, the first portion and second portion including electrical conductors., 'a connector embedded into the moldable substrate to couple a die sliver to a controller of a liquid dispensing device, the connector including2. The apparatus of claim 1 , wherein the connector includes a lead frame embedded into the moldable substrate to couple to the die sliver to an electrical contact of the controller via an electrical interconnect of the die sliver that connects to the first portion of the connector.3. The apparatus of claim 1 , wherein the connector further includes a third portion that is laterally between the first portion and the second portion.4. A system that includes the apparatus of and the liquid dispensing device claim 1 , wherein the apparatus is to interface with the controller of the liquid dispensing device via the second portion of the connector.5. The apparatus of claim 1 , wherein the connector further includes a third portion that is laterally between the first portion and the second portion claim 1 , and the first claim 1 , second and third portions include electrical traces that form a contiguous connection to couple to a wire bond of the die sliver claim 1 , and the connector further includes:a connection pad connected to the electrical traces, the connection pad to electrically couple the die sliver to the controller of the ...

Method of working small recess portion, method of fabricating liquid ejection head and liquid ejection head

The invention is directed to a method of working a small recess portion. In the method, prior to press-forming small recess portions arrayed in a row by pressing a predetermined number of pieces of aligned male dies to a metal base plate, the metal base plate is previously formed with a highly rigid portion at a predetermined portion at a vicinity of an imaginary line extending in a row direction along end portions of predicted press portions to which the respective male dies are pressed.

FLUID EJECTION DEVICE WITH BREAK(S) IN COVER LAYER

In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material. 1. A fluid ejection device , comprising:a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors;a cover layer adjacent the fluid ejection die and formed with a second material that is different than the first material, wherein the cover layer includes a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors, wherein the first and second regions are separated by a break in the cover layer; anda third material that is different than one or both of the first and second material, wherein the third material fills the break separating the first and second regions of the cover layer.2. The fluid ejection device of claim 1 , wherein the cover layer comprises a plurality of sublayers constructed with the first material.3. The fluid ejection device of claim 2 , wherein the break between the first and second regions comprises a break in top hat and chamber sublayers of the plurality of sublayers.4. The fluid ejection device of claim 1 , wherein the first region of the cover layer comprises a wall formed with the second material that surrounds and prevents fluid from contacting the bondpad.5. The fluid ejection device of claim 1 , wherein the second material comprises SU-8.6. The fluid ejection device of claim 5 , wherein the third material ...

PROCESS FOR PRODUCING A LIQUID EJECTION HEAD

A process for producing a liquid ejection head including a silicon substrate having a supply port to supply a liquid to a flow path, and an ejection-orifice-forming member forming the flow path between the ejection-orifice-forming member and the silicon substrate and having an ejection orifice to eject the liquid in the flow path. The process includes forming an etching protection film so as to cover the ejection-orifice-forming member; forming the supply port passing through the silicon substrate by anisotropic etching using an alkaline aqueous solution; and removing the etching protection film. The etching protection film includes an organic polymer material having a storage modulus at 80° C. of 1.0×10Pa or higher. 1. A process for producing a liquid ejection head including a silicon substrate having a supply port to supply a liquid to a flow path , and an ejection-orifice-forming member forming the flow path between the ejection-orifice-forming member and the silicon substrate and having an ejection orifice to eject the liquid in the flow path , the process comprising:forming an etching protection film so as to cover the ejection-orifice-forming member;forming the supply port passing through the silicon substrate by anisotropic etching using an alkaline aqueous solution; andremoving the etching protection film,{'sup': '6', 'wherein the etching protection film comprises an organic polymer material having a storage modulus at 80° C. of 1.0×10Pa or higher.'}2. The process for producing a liquid ejection head according to claim 1 , wherein the organic polymer material has a storage modulus at 80° C. of 2.0×10Pa or higher and 9.0×10Pa or lower.3. The process for producing a liquid ejection head according to claim 1 , wherein the organic polymer material has no hydroxyl group.4. The process for producing a liquid ejection head according to claim 1 , wherein the organic polymer material is a copolymer of a monomer mixture comprising styrene and acrylonitrile.6. The ...

LIQUID DISCHARGE HEAD AND METHOD OF MANUFACTURING THE SAME

A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica. 1. A liquid discharge head including comprising:a substrate; anda member provided with discharge ports, the liquid discharge head configured to discharge liquid, whereina discharge port surface of the member having the discharge ports arrayed thereon includes fumed silica.2. The liquid discharge head according to claim 1 , wherein{'sup': '2', 'the fumed silica has an average particle diameter not larger than 20 nm, and a relative surface area of not smaller than 90 m/g.'}3. A method of manufacturing a liquid discharge head including discharging ports configured to discharge liquid claim 1 , the method comprising:forming a mold member on a substrate in an area which becomes a flow channel configured to introduce liquid to the discharge ports,providing a member including fumed silica and having photosensitivity so as to cover the substrate and the mold member;forming latent image of the discharge ports by performing exposure and baking on the member;forming the discharge ports by developing an unexposed portion of the member;forming a through hole penetrating through the substrate and reaching the mold member; andremoving the mold member.4. A method of manufacturing a liquid discharge head including discharging ports configured to discharge liquid claim 1 , the method comprising:forming a mold member on a substrate in an area which becomes a flow channel configured to introduce liquid to the discharge ports,providing a lower layer member having photosensitivity so as to cover the substrate and the mold member;providing an upper layer member including fumed silica on the lower layer member,forming latent image of the discharge ports by performing exposure and baking on the lower layer member and the upper layer member;forming the discharge ports ...

MOLDED PRINTHEAD

In one example, a molded printhead includes a printhead die in a molding having a channel therein through which fluid may pass directly to a back part of the die. The front part of the die is exposed outside the molding surrounding the die. Electrical connections are made between terminals at the front part of the die and contacts to connect to circuitry external to the printhead. 1. An ink cartridge comprising:a cartridge housing having an ink chamber including an ink supply integrated in the ink chamber;a molding; andat least one die sliver embedded in the molding, the at least one die sliver having a back part to which ink of the ink supply passes.2. The cartridge of claim 1 , wherein the at least one die sliver comprises a liquid ejection die.3. The cartridge of claim 1 , further comprising a fluid channel fluidly connecting the ink supply with the back part of the at least one die sliver claim 1 , the fluid channel being formed in the molding in which the at least one die sliver is embedded for delivering liquid to the at least one die sliver.4. The cartridge of claim 1 , wherein a surface of the at least one die sliver is coplanar with a surface of the molding.5. The cartridge of claim 1 , wherein further comprising conductors running between a plurality of die slivers and electrical contacts claim 1 , the conductors being disposed along a surface of the molding.6. The cartridge of claim 1 , wherein:the at least one die sliver comprises a plurality of liquid ejection die slivers; andthe molding comprises a molded panel of molded material in which the plurality of ejection die slivers is embedded, wherein the liquid ejection die slivers are arranged end to end along a length of the panel, with ejection orifices of each liquid ejection die being exposed at a first surface of the panel.7. The cartridge of claim 6 , wherein a face of the molded panel and a face of each of the liquid ejection die slivers forms a single claim 6 , uninterrupted planar surface ...

PROCESS FOR MAKING A MOLDED DEVICE ASSEMBLY AND PRINTHEAD ASSEMBLY

In one example, a process for making a micro device assembly includes placing a micro device on a front part of a printed circuit board, molding a molding on the printed circuit board surrounding the micro device, and then forming a channel to the micro device in a back part of the printed circuit board. 1. A process for making a micro device assembly , comprising:placing a micro device on a front part of a printed circuit board;molding a molding on the printed circuit board surrounding the micro device; and thenforming a channel to the micro device in a back part of the printed circuit board.2. The process of claim 1 , wherein the forming includes cutting through the back part of the printed circuit board and into the micro device.3. The process of claim 2 , wherein the cutting includes sawing through the back part of the printed circuit board and into the micro device to open a fluid passage in the micro device to the channel.4. The process of claim 3 , wherein the sawing includes plunging a saw blade through the back part of the printed circuit board and into the micro device.5. The process of claim 4 , wherein the molding includes molding a single monolithic molding on the printed circuit board and over the micro device.6. The process of claim 5 , wherein the molding includes molding the single monolithic molding over part of the micro device.7. A process for making a printhead assembly claim 5 , comprising:arranging printhead dies on a front face of a printed circuit board;electrically connecting the dies to the printed circuit board;molding a cover on the printed circuit board surrounding exposed fluid dispensing nozzles on each die; and thenforming channels to the dies in a back part of the printed circuit board.8. The process of claim 7 , further comprising opening fluid passages in each die simultaneously with forming a channel in the printed circuit board.9. The process of claim 8 , wherein the forming and the opening include sawing through the back part ...

FLEXIBLE CARRIER

The present disclosure includes a flexible carrier along with a system and a method including the flexible carrier. 1. A system , comprisinga flexible carrier;a flex circuit including a carrier wafer, wherein the carrier wafer is bonded to the flexible carrier with thermal release tape; anda printhead flow structure including the flex circuit.2. The system of claim 1 , wherein the flexible carrier includes an elastomer material.3. The system of wherein the printhead flow structure includes a plurality of printhead dies molded into an elongated claim 1 , monolithic body.4. The system of claim 1 , wherein the flexible carrier includes a cured epoxy composition.5. A method of making a printhead flow structure claim 1 , comprising:bonding a flex circuit to a flexible carrier with a thermal release tape;placing a printhead die in an opening on the flexible carrier;molding a channel in a molding, wherein the molding partially encapsulates the printhead die; anddebonding a printhead flow structure from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier, wherein the printhead flow structure includes the flex circuit and the channel.8. The method of claim 5 , wherein debonding occurs at a temperature of at least 15 Celsius (C.) below the release temperature of the thermal release tape.7. The method of claim 5 , wherein debonding includes flexing the flexible carrier in at least a direction perpendicular to a bonding axis sufficient to debond the printhead flow structure and return the flexible carrier to its original shape when the printhead flow structure is debonded.8. The method of claim 5 , wherein bonding the flex circuit to the flexible carrier includes bonding a carrier wafer to the flexible carrier.9. The method of claim 5 , including coupling a conductor on the flexible carrier to a terminal on the printhead die.10. The method of claim 5 , wherein molding includes molding at a temperature in ...

Printed circuit board fluid ejection apparatus

In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow o the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.

DOUBLE SIDED FLEX FOR IMPROVED BUMP INTERCONNECT

A printhead including a plurality of embossed first flex circuit pads and a first plurality of first active traces on a first side of a dielectric substrate, and a plurality of embossed second flex circuit pads on a second side of the dielectric substrate. The plurality of embossed first flex circuit pads are configured to be electrically active as part of an electric circuit during operation of the printhead, while the plurality of embossed second flex circuit pads may be configured to be electrically active or electrically inactive during operation of the printhead. 1. A printhead , comprising:a dielectric substrate comprising a first side and a second side opposite the first side;a plurality of first active traces on the first side of the dielectric substrate;a plurality of embossed first flex circuit pads on the first side of the dielectric substrate; anda plurality of embossed second flex circuit pads on the second side of the dielectric substrate,wherein at least a portion of each embossed second flex circuit pad directly overlies a corresponding first flex circuit pad.2. The printhead of claim 1 , further comprising a plurality of second active traces on the second side of the dielectric substrate claim 1 , wherein the plurality of second active traces are directly interposed between the plurality of second flex circuit pads.3. The printhead of claim 1 , wherein:the plurality of embossed first flex circuit pads are configured to be electrically active during operation of the printhead; andthe plurality of embossed second flex circuit pads are configured to be electrically inactive during operation of the printhead.4. The printhead of claim 1 , wherein:the plurality of embossed flex circuit pads are configured to be electrically active during operation of the printhead; andthe plurality of embossed second flex circuit pads are configured to be electrically active during operation of the printhead.5. The printhead of claim 1 , wherein the plurality of embossed ...

LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, FLOW PATH MEMBER, AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

An opposed surface of a first flow path forming member has a groove portion forming a supply passage, and a protruding portion protruding from the edge of the groove portion to form the side wall of the groove portion. An opposed surface of a second flow path forming member has a lid portion that abuts against the protruding portion of the first flow path forming member to cover the opening of the groove portion in the first flow path forming member. A joining member is formed by injection-molding of a resin to abut against an outer surface of the protruding portion of the first flow path forming member and the opposed surfaces of the first and second flow path forming members. 1. A liquid ejection head comprising a liquid supply unit having a supply passage of liquid formed therein; and a liquid ejection unit capable of ejecting the liquid supplied through the supply passage from an ejection port ,wherein the liquid supply unit includes first and second flow path forming members having first and second opposed surfaces opposed to each other, and a joining member which joins the first and second flow path forming members,the first opposed surface has a groove portion which forms the supply passage, and a protruding portion protruding from the first opposed surface to form a side wall of the groove portion,the second opposed surface has a lid portion which abuts against the protruding portion to cover the opening of the groove portion, andthe joining member is formed of a resin to come into contact with an outer surface of the protruding portion, the first opposed surface, and the second opposed surface.2. The liquid ejection head according to claim 1 , wherein at least some parts of a range of the groove portion in a depth direction and a range of the joining member in a thickness direction overlap each other in a direction in which the protruding portion protrudes.3. The liquid ejection head according to claim 1 , wherein the lid portion is located in a recessed ...

Monolithic carrier structure for digital dispensing

A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

MANUFACTURE METHOD OF LIQUID EJECTION HEAD

A mold unit and base units are formed on a substrate. A covering resin layer is formed by coating a liquid-like resin composition to cover the surfaces of the mold unit and the base unit. When interval between one end of the base unit and the mold unit adjacent thereto is δ1, the interval of the plurality of base units is δ2, a distance between the center of the ejection opening and the other end of the base unit is L, the height of the unevenness between the surface of the base unit and the surface of the mold unit is ΔH, and the covering resin layer has a thickness H2, when the base unit is established to δ2≦30 μm, the base unit and the covering resin layer are formed so that the relations δ1≦30 μm and ΔH=0 μm or H2/ΔH≧3 are satisfied. 1. A method of manufacturing a liquid ejection head in which an orifice plate having an ejection opening for ejecting liquid and a flow path communicating with the ejection opening is formed on a surface of a substrate , comprising:a first step of forming, on the surface of the substrate, a mold unit for forming the flow path and a plurality of base units including a base unit adjacent to the mold unit, anda second step of forming, on the surface of the substrate, a covering resin layer for forming the orifice plate by applying liquid-like resin composition so as to cover the surface of the mold unit and the surface of the base unit,in a case where in a direction parallel to the surface of the substrate, an interval between one end of the base unit and the mold unit adjacent thereto is δ1, the interval of the plurality of base units is δ2, a distance between the center of the ejection opening and the other end of the base unit is L, in a case where in a direction vertical to the surface of the substrate, the height of the unevenness caused between the surface of the base unit and the surface of the mold unit is ΔH, and a thickness of the covering resin layer is H2,when the base unit is formed so that δ2≦30 μm is established, the ...

COPLANAR MODULAR PRINTBARS

In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies. 1. A molding system , comprising:a lower mold cavity to receive modular fluid ejection subassemblies aligned such that an upper surface of a substrate of each modular fluid ejection subassembly is coplanar with an upper surface of a substrate of an adjacent modular fluid ejection subassembly;an upper mold cavity planarly aligned with the coplanar upper surfaces of the substrates of the modular fluid ejection subassemblies;a runner to convey a mold material between the lower mold cavity and the upper mold cavity proximate a seam between two adjacent modular fluid ejection subassemblies; anda delivery device to deliver the mold material into the runner to fill the seam between the adjacent modular fluid ejection subassemblies,wherein the upper mold cavity constrains the delivered mold material coplanar with the upper substrate surfaces of the modular fluid ejection subassemblies.2. The molding system of claim 1 , wherein each of the modular fluid ejection subassemblies comprises an S-module fluid ejection subassembly with two rows of fluidic dies offset from one another in an S-shape configuration.3. The molding system of claim 2 , wherein each fluidic die comprises a thermal ink jet (TIJ) fluidic die.4. The molding system of claim 2 , wherein each fluidic die comprises an array of piezo ink jet (PIJ) fluidic dies.5. The molding system of claim 1 , wherein the mold material comprises epoxy mold compound (EMC) with a coefficient of thermal expansion (CTE) equal to that of the substrates of the modular fluid ejection subassemblies claim 1 , andwherein the delivery device comprises a ...

LIQUID EJECTION HEAD AND METHOD FOR PRODUCING THE SAME

A liquid ejection head including a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid; an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber. The orifice plate is formed of an inorganic material. The liquid ejection head includes a plurality of liquid chambers; and an elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber. The upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall. 1. A liquid ejection head comprising:a substrate having an ejection-energy-generating element for generating energy for ejecting a liquid;an orifice plate including at least an ejection-orifice-forming wall that constitutes an ejection orifice for ejecting the liquid and an upper wall of a liquid chamber communicating with the ejection orifice, and a liquid chamber side wall that constitutes a side wall of the liquid chamber, whereinthe orifice plate is formed of an inorganic material,the liquid ejection head comprises:a plurality of liquid chambers; andan elastic member filled into a depressed portion formed between the liquid chamber side wall of one liquid chamber of the liquid chambers adjacent to each other and the liquid chamber side wall of the other liquid chamber, andan upper end of the elastic member is arranged in a position higher than an upper face of the ejection-orifice-forming wall.2. The liquid ejection head according to claim 1 , wherein the elastic member is arranged also on the ejection-orifice-forming wall.3. The liquid ejection head according to claim 2 , ...

MOLDED PRINTHEAD STRUCTURE

In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies. 1. A method , comprising:attaching a printed circuit board to a carrier;attaching multiple printhead die slivers to the carrier in a window in the printed circuit board;encapsulating the die slivers and the printed circuit board in a molding to form a printhead;removing the printhead from the carrier; andforming multiple slots in the molding in direct fluidic communication with fluid feed holes in the die slivers.2. The method of claim 1 , where each die sliver has a thickness of 100 μm or less.3. The method of claim 1 , where each die sliver has a ratio of length to width of at least 52.4. The method of claim 1 , comprising forming wire bonds to electrically couple conductive elements of the printed circuit board to conductive elements of the die slivers.5. The method of claim 4 , comprising encapsulating the wire bonds with a protective film.6. The method of claim 1 , comprising attaching the printhead to a support structure having a manifold such that fluid passages of the manifold are in direct fluidic communication with the slots.7. The method of claim 4 , where the encapsulating comprises encapsulating the die slivers and the printed circuit board in a monolithic molding.8. The method of claim 1 , where the forming comprises cutting multiple slots in the molding in fluidic communication with fluid feed holes in the die slivers.9. The method of claim 6 , where the cutting comprises plunge cutting multiple slots in the molding in fluidic communication with fluid feed holes in the die slivers. This is a divisional of application Ser. No. 15/372,366 filed Dec. 7, 2016, which is a divisional of application Ser. No. 15/021,522 filed Mar. 11, ...

FLUID DISPENSER

A fluid dispenser may include fluid dispensing dies in an end-to-end staggered arrangement, a non-fluid dispensing die electronic device and a molding covering the fluid dispensing dies and the electronic device. 1. A fluid dispenser comprising:fluid dispensing dies in an end-to-end staggered arrangement;a non-fluid dispensing die electronic device; anda molding covering the fluid dispensing dies and the electronic device.2. The fluid dispenser of claim 1 , wherein the fluid dispensing dies comprise:a first set of parallel fluid dispensing dies;a second set of parallel fluid dispensing dies; anda third set of parallel fluid dispensing dies, wherein the first set, the second set and the third set are in an end-to-end staggered arrangement.3. The fluid dispenser of claim 2 , wherein the first set of parallel fluid dispensing dies comprises fluid dispensing dies of a same length claim 2 , the fluid dispensing dies of the first set having aligned ends.4. The fluid dispenser of claim 2 , wherein each of the first set claim 2 , the second set and the third set comprises three fluid dispensing dies.5. The fluid dispenser of claim 2 , wherein each of the first set claim 2 , the second set in the third set comprises four fluid dispensing dies.6. The fluid dispenser of further comprising a printed circuit board comprising a first opening claim 2 , a second opening and a third opening receiving the first set claim 2 , the second set and the third set claim 2 , respectively.7. The fluid dispenser of claim 6 , wherein the molding fills first opening claim 6 , the second opening and the third opening.8. The fluid dispenser of claim 1 , wherein the molding is monolithic.9. The fluid dispenser of further comprising external electrical contacts electrically connected to respective fluid dispensing dies and exposed outside the molding claim 1 , wherein the non-fluid dispensing die electronic device is buried in the molding and is electrically connected to the external electrical ...

METHOD OF MANUFACTURING FLOW PATH MEMBER, FLOW PATH MEMBER, AND LIQUID EJECTING HEAD

A method of manufacturing a flow path member which forms a flow path such that a concave portion provided on a first surface of a first member is covered with a second surface of a second member, the method includes introducing a part of a fused director to an inner side of the concave portion when viewed from a direction in which the first member and the second member are laminated; and fixing the first member and the second member by curing the fused director in a state where the concave portion is covered with the second surface to form a flow path. 1. A method of manufacturing a flow path member which forms a flow path such that a concave portion provided on a first surface of a first member is covered with a second surface of a second member , the method comprising:introducing a part of a fused director to an inner side of the concave portion when viewed from a direction in which the first member and the second member are laminated; andfixing the first member and the second member by curing the fused director in a state where the concave portion is covered with the second surface to form a flow path.2. The method of manufacturing a flow path member according to claim 1 ,wherein in a case where the first surface is combined with the second surface, the fused director flows with respect to a portion of which a cross-section has an acute angle, when viewed from a direction perpendicular to the lamination direction.3. The method of manufacturing a flow path member according to claim 1 ,wherein the concave portion has a shape in which a width of the cross-section becomes the largest at an opening portion, when viewed from a direction perpendicular to the lamination direction.4. The method of manufacturing a flow path member according to claim 3 ,wherein the concave portion has a vertex at a side opposite to the second member.5. The method of manufacturing a flow path member according to claim 1 ,wherein the director to be fused is provided on the first member and ...

MOLDED PRINTHEAD STRUCTURE

In one example, a printhead structure includes multiple printhead dies and a printed circuit board embedded in a single monolithic molding with fully encapsulated wire bonds that electrically connect the dies to conductive routing in the printed circuit board. Fluid may pass through a slot in the molding directly to the dies. 1. A method , comprising:attaching a printed circuit board to a carrier;attaching multiple printhead die slivers to the carrier in a window in the printed circuit board;encapsulating the die slivers and the printed circuit board in a molding to form a printhead;removing the printhead from the carrier; andforming multiple slots in the molding in direct fluidic communication with fluid feed holes in the die slivers.2. The method of claim 1 , where each die sliver has a thickness of 100 μm or less.3. The method of claim 1 , where each die sliver has a ratio of length to width of at least 52.4. The method of claim 1 , comprising forming wire bonds to electrically couple conductive elements of the printed circuit board to conductive elements of the die slivers.3. The method of claim 4 , comprising encapsulating the wire bonds with a protective film.4. The method of claim 1 , comprising attaching the printhead to a support structure having a manifold such that fluid passages of the manifold are in direct fluidic communication with the slots.5. The method of claim 4 , where the encapsulating comprises encapsulating the die slivers and the printed circuit board in a monolithic molding.6. The method of claim 1 , where the forming comprises cutting multiple slots in the molding in fluidic communication with fluid feed holes in the die slivers.7. The method of claim 6 , where the cutting comprises plunge cutting multiple slots in the molding in fluidic communication with fluid feed holes in the die slivers.8. A printhead structure claim 6 , comprising:a printhead die having a front part along which fluid may be dispensed from the die, the die molded into ...

Droplet Deposition Apparatus and Method for Manufacturing the Same

A droplet deposition apparatus, such as an inkjet printhead, that includes an integrally-formed manifold component and one or more actuator components; these actuator components provide an first array of fluid chambers, each of which has a piezoelectric actuator element and a nozzle, with this piezoelectric actuator element being able to cause the release in a deposition direction of fluid droplets through the nozzle in response to electrical signals; the first array of fluid chambers extends in an array direction from a first longitudinal end to a second, opposite longitudinal end, this array direction being perpendicular to the deposition direction; in addition, the manifold component is elongate in the array direction and includes a first and second manifold chambers, with these manifold chambers extending side-by-side in the array direction and the first manifold chamber being fluidically connected to the second manifold chamber via each of the fluid chambers in the first array; the cross-sectional area of at least one of these manifold chambers is tapered with distance in the array direction, for example to improve purging of the chambers during start-up; the cross-sectional shape of the integrally-formed manifold component perpendicular to the array direction varies with distance in the array direction such that the centroid of the cross-section remains a substantially constant distance, in said deposition direction, from said array of fluid chambers over the length of the first array of fluid chambers, with the integrally-formed manifold component thus being essentially self-stiffening. 1. Droplet deposition apparatus comprising an integrally-formed manifold component and one or more actuator components;wherein said one or more actuator components provide first and second arrays of fluid chambers, each fluid chamber having a piezoelectric actuator element and a nozzle, said piezoelectric actuator element being operable to cause the release in a deposition ...

PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS

In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die. 1. A method for making a fluid ejection apparatus , comprising:providing a printhead die having a first surface including at least one drop ejector and a back surface including at least one fluid passage opening;forming a molding material on the back surface of the printhead die over the at least one fluid passage opening;embedding the printhead die and the molding material in an encapsulant in a cavity in a printed circuit board;removing at least a portion of the encapsulant at a back side of the printed circuit board to expose the molding material; andremoving the molding material to form a fluid feed slot through which fluid may flow to the at least one fluid passage opening in the printhead die.2. The method of claim 1 , wherein the cavity extends from a front side of the printed circuit board to the back side of the printed circuit board claim 1 , and wherein said embedding comprises embedding the printhead die such that the at least one drop ejector is exposed at the front side of the printed circuit board3. The method of claim 1 , wherein said removing the at least the portion of the encapsulant comprises plunge-cutting into the encapsulant at the back side of the printed circuit board to expose the molding material.4. The method of claim 1 , wherein said removing the at least the portion of the encapsulant comprises back grinding claim 1 , laser ablating claim 1 , or ...

Printhead assembly

A printhead assembly may include a first set of distinct parallel printhead dies in a second set of distinct parallel printhead dies. The first set of distinct parallel printhead dies may have respective major dimensions extending in a longitudinal direction and respective ends that are aligned in a transverse direction. The second set of distinct parallel printhead dies may have respective major dimensions extending in the longitudinal direction and respective ends aligned in the transverse direction. The second set of distinct parallel printhead dies may partially overlap the first set of distinct parallel printhead dies in the transverse direction.

MOLDED FLUID FLOW STRUCTURE

A method of manufacturing a fluid flow structure may include coupling a flex circuit to a carrier. The flex circuit may include at least one conductor. The method may include coupling an orifice side of a fluidic die to the carrier at an opening on the carrier. The fluidic die may include at least one electrical terminal. The method may include coupling the electrical terminal to the conductor, and overmolding the fluid flow structure with a moldable material. The overmolded fluid flow structure may include a channel molded therein, and the channel may be fluidically coupled to the fluidic die. The conductor may be surrounded by the moldable material. 1. A method of manufacturing a fluid flow structure , comprising:coupling a flex circuit to a carrier, the flex circuit comprising at least one conductor;coupling an orifice side of a fluidic die to the carrier at an opening on the carrier, the fluidic die comprising at least one electrical terminal;coupling the electrical terminal to the conductor;overmolding the fluid flow structure with a moldable material, the overmolded fluid flow structure comprising a channel molded therein, the channel being fluidically coupled to the fluidic die,wherein the conductor is surrounded by the moldable material.2. The method of claim 1 , wherein the channel is formed in the moldable material using a molding tool.3. The method of claim 1 , comprising releasing the carrier from the fluidic die.4. The method of claim 3 , wherein the fluidic die is coupled to the carrier using a thermal release tape.5. The method of claim 4 , wherein releasing the carrier from the fluidic die comprises applying heat to the thermal release tape.6. The method of claim 1 , wherein the fluidic die comprises:a substrate;at least one fluid port defined in the substrate, the fluid port extending from a first surface of the substrate to a second surface of the substrate; andan orifice plate coupled to the second side of the substrate.7. The method of claim 6 , ...

METHOD OF MANUFACTURING LIQUID SUPPLY UNIT AND METHOD OF MANUFACTURING LIQUID EJECTING HEAD

In a molding step, at least a first member, which constitutes a liquid supply unit together with a second member, is injection molded by using an injection mold including first and second molds being made openable and closable. In a mold opening step, the first and second molds are opened while leaving the first member, which is injection molded in the molding step, on the first mold. In a first bonding step, a third member constituting the liquid supply unit is bonded to the first member left on the first mold. 1. A method of manufacturing a liquid supply unit to form a liquid passage to supply a liquid to a liquid ejecting head , comprising:a molding step of injection molding at least a first member, which constitutes the liquid supply unit together with a second member, by using an injection mold including first and second molds being made openable and closable;a mold opening step of opening the first and second molds while leaving the first member, which is injection molded in the molding step, on the first mold; anda first bonding step of bonding a third member constituting the liquid supply unit to the first member left on the first mold.2. The method of manufacturing a liquid supply unit according to claim 1 , whereinthe first and second members are injection molded in the molding step, andthe first and second molds are opened in the mold opening step, while leaving the first member, injection molded in the molding step, on the first mold and leaving the second member, injection molded in the molding step, on the second mold.3. The method of manufacturing a liquid supply unit according to claim 2 , further comprising:a moving step of, after the mold opening step and before or after the first bonding step, relatively moving the first and second molds such that the first member left on the first mold and the second member left on the second mold are opposed to each other; anda second bonding step of, after the first bonding step and the moving step, closing the ...

MOLDED FLUID FLOW STRUCTURE

A fluid flow structure may include a micro device embedded in a monolithic molding. The molding may include a channel therein through which fluid flows directly into the micro device. The micro device may include a fluid flow passage connected directly to the channel, a silicon substrate, and a fluid port formed in the silicon substrate and fluidically coupled to the channel. A fluid is feedable through the fluid port. The channel is wider than the fluid port. The channel includes an open channel exposed to an external surface of the micro device. 1. A fluid flow structure , comprising: a fluid flow passage connected directly to the channel;', 'a silicon substrate; and', 'a fluid port formed in the silicon substrate and fluidically coupled to the channel, a fluid feedable through the fluid port, and wherein the channel is wider than the fluid port,, 'a micro device embedded in a monolithic molding, the molding comprising a channel therein through which fluid flows directly into the micro device, the micro device comprisingwherein the channel comprises an open channel exposed to an external surface of the micro device.2. The fluid flow structure of claim 1 , wherein the micro device comprises:an electronic device that comprises an electrical terminal, and wherein the fluid flow structure comprises a conductor connected to the terminal and embedded in the molding.3. The fluid flow structure of claim 2 , wherein the electronic device comprises a printhead die sliver that comprises a fluid flow passage connected directly to the channel.4. The fluid flow structure of claim 1 , wherein:at least a second micro device is embedded into the monolithic molding, andthe molding comprises at least a second channel through which fluid flows directly into the second micro device.5. The fluid flow structure of claim 4 , wherein the second channel contacts edges of the second micro device.6. The fluid flow structure of claim 3 , wherein:the monolithic molding molded around a ...

MOLDED FLUID FLOW STRUCTURE

A fluid flow structure may include a fluid dispensing micro device comprising a tapered fluid port to feed fluid to the micro device, and a monolithic molding comprising a tapered channel defined in the molding through which fluid may flow directly into the micro device. The channel may be fluidically coupled to the fluid port. The micro device is embedded in the molding. The micro device is a printhead die having a thickness less than or equal to 650 μm. The channel is wider than the fluid port. 1. A fluid flow structure , comprising:a fluid dispensing micro device comprising a tapered fluid port to feed fluid to the micro device; anda monolithic molding comprising a tapered channel defined in the molding through which fluid may flow directly into the micro device, the channel being fluidically coupled to the fluid port,wherein the micro device is embedded in the molding,wherein the micro device is a printhead die having a thickness less than or equal to 650 μm, andwherein the channel is wider than the fluid port.2. The fluid flow structure of claim 1 , wherein the channel is molded into the molding.3. The fluid flow structure of claim 1 , wherein the channel comprises an open channel exposed to an external surface of the micro device.4. The fluid flow structure of claim 1 , wherein the micro device comprises an electronic device that comprises an electrical terminal claim 1 , and the structure comprises a conductor connected to the terminal and embedded in the molding.5. The fluid flow structure of claim 4 , wherein the micro device comprises a printhead die sliver that comprises a fluid manifold connected directly to the fluid port.6. The fluid flow structure of claim 5 , wherein multiple printhead die slivers are provided claim 5 , and the monolithic body is molded around the multiple printhead die slivers claim 5 , the body comprising a tapered channel molded therein through which fluid may flow directly to the slivers.7. The fluid flow structure of claim 6 , ...

METHOD OF MANUFACTURING LIQUID EJECTING HEAD, AND LIQUID EJECTING HEAD

A method of manufacturing a liquid ejecting method includes: a first step of injection molding passage members collectively constituting a passage for a liquid in the liquid ejecting head; a second step of moving the passage members to bring the passage members into contact with each other; and a third step of injecting a sealing material into a space between the passage members held in contact with each other, and filling the space with the sealing material. The sealing material is injected and filled, from a gate on a longitudinal side of the passage members, in a direction intersecting with a longitudinal direction of the passage members. 1. A method of manufacturing a liquid ejecting head , comprising:a first step of injection molding a plurality of passage members that collectively constitute a passage for a liquid in the liquid ejecting head;a second step of moving the passage members to bring the passage members into contact with each other; anda third step of bonding the passage members to each other by injecting a sealing material into a space between the passage members held in contact with each other, whereinthe sealing material is injected from a gate provided on one longitudinal side of the passage members and is injected in a direction intersecting with a longitudinal direction of the passage members.2. The method of manufacturing a liquid ejecting head according to claim 1 , wherein the first claim 1 , second claim 1 , and third steps are performed inside an identical mold.3. The method of manufacturing a liquid ejecting head according to claim 2 , wherein the mold includes a plurality of plates.4. The method of manufacturing a liquid ejecting head according to claim 3 , wherein the plurality of plates include a fixed plate and a movable plate.5. The method of manufacturing a liquid ejecting head according to claim 1 , wherein the sealing material is injected into an inflow passage communicating with the gate.6. The method of manufacturing a liquid ...

Method of manufacturing liquid supply unit

A method of manufacturing a liquid supply unit includes a first molding step and a second molding step. In a first molding step, a resin is injected into different positions inside a mold assembly and a first member having a first contact portion, a second member having a second contact portion and an intermediate passage member having a passage structure to connect the first contact portion to the second contact portion are molded. In a second molding step, the mold assembly is disassembled, a die slide mold disposed inside the mold assembly is moved for positioning the members. Then, the mold assembly is clamped again and a resin is injected into the mold assembly. The first contact portion and the second contact portion are respectively held on the same surfaces inside the mold assembly during a period from the first molding step to completion of the second molding step.

METHOD OF MANUFACTURING LIQUID EJECTING HEAD

A method of manufacturing a liquid ejecting head has a first molding step, a step of performing positioning and a second molding step. In the first molding step, a first member, a second member, and a third member are molded by injecting a resin at different locations inside of a set of a fixed mold, an intermediate movable mold, and a movable mold. In the step of performing positioning, the set is detached in a first direction and the intermediate movable mold and the movable mold are moved in a second direction. In the second molding step, a resin is injected to the inside of the set that is clamped to bond. During a period from the first molding step to completion of the second molding step, the first member, the second member, and the third member are held by insert mold pieces used for molding the members, respectively, in the first molding step. 1. A method of manufacturing a liquid ejecting head havinga liquid ejecting module provided with arrayed elements to eject a liquid, anda passage member to supply the liquid to the liquid ejecting module,the method comprising:a first molding step of molding a first member, a second member, and a third member, which collectively form the passage member, at different locations inside of a set of a fixed mold, an intermediate movable mold, and a movable mold being made detachable from one another in a first direction, the set being clamped together in the first direction, by injecting a resin to the different locations inside;a step of performing positioning among the first member, the second member, and the third member in a second direction different from the first direction after the first molding step, by moving the intermediate movable mold and the movable mold in the first direction to detach the fixed mold, the intermediate movable mold, and the movable mold from one another, and moving the intermediate movable mold and the movable mold in the second direction; anda second molding step after the step of performing ...

PRINTHEAD WITH BOND PAD SURROUNDED BY DAM

In an embodiment, a printhead includes a fluidic die molded into a moldable material. The die has a front surface exposed outside the moldable material to dispense fluid and an opposing back surface covered by the moldable material except at a channel in the moldable material through which fluid may pass directly to the back surface. The die has a first bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad. 1. A fluid ejection device , comprising:a fluidic die molded into a moldable material, the fluidic die comprising a front surface exposed outside the moldable material to dispense fluid; andat least one bond pad on the front surface surrounded by a first dam to prevent the moldable material from contacting the first bond pad.2. The fluid ejection device of claim 1 , wherein the first dam prevents the moldable material from contacting the first bond pad during deposition of the moldable material onto the fluidic die.3. The fluid ejection device of claim 1 , wherein the moldable material covers a back surface of the fluidic die and comprises a fluid channel defined in the moldable material through which a fluid may pass to the back surface of the fluidic die.4. The fluid ejection device of claim 1 , wherein the fluidic die comprises:a silicon substrate; anda fluidics layer formed on the substrate as the front surface of the die,wherein the first dam comprises a recess in the fluidics layer.5. The fluid ejection device of claim 3 , wherein the fluidic die comprises:a silicon sliver substrate; anda fluidics layer formed on the substrate as the front surface of the die,wherein the fluid channel is formed in at least a portion of the fluidics layer.6. The fluid ejection device of claim 4 , wherein: a chamber layer with a fluid chamber on the substrate; and', 'an orifice layer over the chamber layer comprising an orifice through which fluid may be dispensed from the fluid chamber; and, 'the fluidics ...

PRINTBARS AND METHODS OF FORMING PRINTBARS

A method of forming a printbar module may include providing a printed circuit board (PCB) having a plurality of recesses extending partially through the PCB and a plurality of dams surrounding the plurality of recesses. An adhesive material may be applied to each of the plurality of recesses and a plurality of printhead die slivers may be positioned in the plurality of recesses. The Plurality of printhead die slivers may be bonded with the PCB and the plurality of printhead die slivers and the PCB may be encapsulated with a molding compound. In response to encapsulating, a plurality of slots, extending through the PCB and the adhesive material may be formed, wherein the plurality of slots are in fluidic communication with fluid feed holes of the plurality of printhead die slivers to provide direct fluidic communication without fan-out. 1. A method of forming a printbar module , comprising:providing a printed circuit board (PCB) including a plurality of recesses extending partially through the PCB and a plurality of dams surrounding the plurality of recesses;applying an adhesive material to each of the plurality of recesses;positioning a plurality of printhead die slivers in the plurality of recesses;bonding the plurality of printhead die slivers with the PCB;encapsulating the plurality of printhead die slivers and the PCB with a molding compound; andin response to encapsulating, forming a plurality of slots, extending through the PCB and the adhesive material, wherein the plurality of slots are in fluidic communication with fluid feed holes of the plurality of printhead die slivers to provide direct fluidic communication without fan-out.2. The method of claim 1 , wherein forming includes forming the plurality of slots using a plunge-cut saw.3. The method of claim 1 , wherein bonding includes wire bonds coupling conductive elements of the PCB to conductive elements of the printhead die slivers.4. The method of claim 1 , wherein applying the adhesive material to the ...

RESIN MOLDING METHOD AND LIQUID EJECTION HEAD MANUFACTURING METHOD

The present invention provides a resin molding method that can produce a molded product that is inexpensive and represents a small linear expansion coefficient, a high degree of resistance to various liquids and an excellent mold releasability as well as a high degree of dimensional accuracy. The resin molding method includes a step of plasticizing thermosetting resin (S) and injecting the plasticized thermosetting resin into the cavity of a metal mold apparatus (S), a step of curing the thermosetting resin in the cavity (S) and a step of opening the mold (S). The step of opening the mold (S) is executed when the mold that forms the cavity is at a temperature not lower than the glass transition point Tg of the thermosetting resin. 1. A resin molding method comprising:a step of plasticizing thermosetting resin and injecting the plasticized thermosetting resin into the cavity of a metal mold apparatus;a step of curing the thermosetting resin in the cavity; anda step of opening the mold forming the cavity when the mold is at a temperature not lower than the glass transition point of the thermosetting resin.2. The method according to claim 1 , whereinthe step of opening the mold is executed when the mold is at the temperature where the thermosetting resin gets into the rubber elasticity area.3. The method according to claim 1 , whereinthe thermosetting resin is epoxy resin.4. The method according to claim 1 , whereinin the step of injecting the thermosetting resin into the cavity, the thermosetting resin that has been heated in a heating chamber and plasticized is injected into the cavity for transfer molding by way of the resin flow path arranged in the mold in a state where the mold is closed.5. The method according to claim 1 , whereinthe thermosetting resin does not contain any internal mold releasing agent.6. The method according to claim 1 , whereinthe thermosetting resin does not contain any fatty acid metal salt.7. The method according to claim 1 , whereinthe ...

PRINTED CIRCUIT BOARD WITH RECESSED POCKET FOR FLUID DROPLET EJECTION DIE

A printed circuit board includes a recessed pocket. A fluid droplet ejection die is within recessed pocket. 1. An apparatus comprising:a printed circuit board comprising a recessed pocket;an fluid droplet ejection die within the recessed pocket.2. The apparatus of claim 1 , wherein the recessed pocket extends into a face of the printed circuit board and wherein the fluid droplet ejection die has a face substantially flush with the face of the printed circuit board.3. The apparatus of claim 1 , wherein the recessed pocket extends into a face of the printed circuit board that faces in a first direction and wherein the fluid droplet ejection die has a face facing in the first direction and recessed within the recessed pocket.4. The apparatus of further comprising a second fluid droplet ejection die within the recessed pocket.5. The apparatus of claim 1 , wherein the printed circuit board comprises a second recessed pocket having a second floor claim 1 , the apparatus further comprising a second fluid droplet ejection die supported within the second recessed pocket.6. The apparatus of claim 1 , wherein the recessed pocket has a depth of at least 150 μm.7. The apparatus of claim 1 , wherein the printed circuit board comprises:a first core layer;first electrically conductive traces on the first core layer;a second core layer;second electrically conductive traces on the second core layer; anda binding layer joining the first core layer to the second core layer.8. The apparatus of claim 1 , wherein the printed circuit board comprises a first layer along a face of the printed circuit board and a second layer adjacent the first layer and wherein the recessed pocket overlies the second layer.9. The apparatus of claim 1 , wherein the recessed pocket extends into a first face of the printed circuit board and wherein the printed circuit board further comprises a fluid passage extending into a second face of the printed circuit board claim 1 , the fluid passage being connected to ...

METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD, LIQUID DISCHARGE HEAD, AND METHOD FOR MANUFACTURING LIQUID DISCHARGE HEAD SUBSTRATE

There is provided a method for manufacturing a liquid discharge head including a liquid discharge head substrate and a flow path forming member, the liquid discharge head substrate having a base, a pressure generation portion provided at a front surface of the base to generate pressure for discharging a liquid, and a supply port for supplying the liquid to the pressure generation portion, and the flow path forming member forming a flow path for feeding the liquid supplied from the supply port to the pressure generation portion. The method includes removing a sacrificial layer by etching the base from a back surface of the base, in a state in which an end covering portion of a cover layer for covering the sacrificial layer is covered with the resin layer. The method suppresses formation of a crack in the end covering portion that covers the end portion of the sacrificial layer. 1. A liquid discharge head comprising:a liquid discharge head substrate having a base, a pressure generation portion provided at a side of a front surface of the base to generate pressure for discharging a liquid, a cover layer provided at the side of the front surface of the base, and a supply port passing through the base and the cover layer to supply the liquid to the pressure generation portion;a flow path forming member provided at the side of the front surface of the base to form a flow path for feeding the liquid supplied from the supply port to the pressure generation portion; anda resin layer provided on a front surface of the cover layer facing the flow path forming member and provided over an opening edge portion of the supply port provided on the front surface of the cover layer,wherein the resin layer includes a part contacting the front surface of the cover layer, and a step portion located at inside of the supply port as viewed from a direction orthogonal to the front surface of the base and the step portion includes a step coming closer to the flow path forming member than the ...

DIE CONTACT FORMATIONS

Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel. 1. A fluid device comprising:a fluid die including a substrate having a first surface;a molded panel in which the fluid die is embedded, the molded panel surrounding sides of the fluid die such that a first surface of the fluid die is disposed below a top surface of the molded panel; anda raised contact formation disposed on the first surface of the substrate such that the raised contact formation extends at least up to the top surface of the molded panel.2. The fluid device of claim 1 , wherein the top surface of the molded panel defines a hole through which the raised contact formation extends.3. The fluid device of claim 1 , further comprising:a conductive member to connect to the raised contact formation at a location above the top surface of the molded panel.4. The fluid device of claim 1 , wherein the raised contact formation is comprised of at least one of gold claim 1 , copper claim 1 , silver claim 1 , and aluminum.5. The fluid device of claim 1 , further comprising:an electrical contact pad disposed on the first surface of the substrate to couple to the raised contact formation.6. The fluid device of claim 5 , wherein the electrical contact pad is comprised of at least one of aluminum claim 5 , gold claim 5 , silver claim 5 , and copper.7. The fluid device of claim 5 , wherein the electrical contact pad has a width less than 100 micrometers (100 μm).8. A fluid ejection device comprising:a fluid ejection die comprising a substrate having a first surface, the substrate including an array of nozzles extending therethrough;a molded panel in which the fluid ejection die is ...

Fluidic ejection dies with enclosed cross-channels

In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.

MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES

In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding. 1. A printhead die comprising:a molding; anda die sliver molded into the molding, a front surface of the die sliver to dispense fluid and being flush with the molding.2. The printhead die of claim 1 , wherein a back surface of the die sliver is flush with the molding and is to receive the fluid.3. The printhead die of claim 1 , wherein the front surface and a back surface of the die sliver are exposed outside the molding and flush with the molding.4. The printhead die of claim 1 , wherein the molding includes a non-epoxy material.5. The printhead die of claim 1 , wherein the molding includes an epoxy material.6. The printhead die of claim 1 , wherein the molding includes a thermal plastic material.7. The printhead die of claim 1 , wherein the printhead die further includes edges that connect the molding to form a joint between the die sliver and the molding.8. An apparatus comprising:a printhead die that includes a front surface having a plurality of nozzles; anda layer of molding material, wherein the molding material is molded onto the printhead die and the layer of molding material is flush with the front surface of the printhead die.9. The apparatus of claim 8 , the apparatus including a media wide print bar and wherein the printhead die includes a plurality of die slivers.10. The apparatus of claim 9 , wherein a plurality of ejection fluid slots are defined in the molding material to feed an ejection fluid to the plurality of die slivers.11. The apparatus claim 8 , wherein the molding material includes a non-epoxy molding material.12. The apparatus of claim 8 , further ...

FLUID EJECTION DEVICE WITH A CARRIER HAVING A SLOT

A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm. 115-. (canceled)16. A fluid ejection device , comprising:a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion, wherein the fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion; anda carrier attached to the fluid ejection die, wherein the carrier includes a slot to provide fluid to the fluid actuation device, wherein the slot extends longitudinally along the fluid ejection portion to a first slot end, and wherein a length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.17. The fluid ejection device of claim 16 , wherein the first end is a first longitudinal end of the fluid ejection die.18. The fluid ejection device of claim 16 , wherein the length from the first slot end to the first end of the fluid ejection die is less than 1.3 mm.19. The fluid ejection device of claim 16 , wherein the length from the first slot end to the first end of the fluid ejection die is less than 1.1 mm.20. The fluid ejection device of claim 16 , wherein the slot decreases in width from a first width along the fluid ejection portion to a second claim 16 , smaller ...

PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS

In an example, a fluid ejection apparatus includes a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board, and a cavity. A printhead die may be embedded in a molding material in the cavity. 1. A fluid ejection apparatus comprising:a printed circuit board including a conductor layer, a cover layer forming a surface of the printed circuit board; anda plurality of printhead die electrically connected to the conductor layer and embedded in a molding material, each printhead die disposed in a cavity in the printed circuit board;wherein the plurality of fluid ejection dies are arranged in a staggered, end-to-end pattern along a width of the printed circuit board.2. The apparatus of claim 1 , wherein each printhead die includes a through-silicon via extending to a bottom surface to electrically connect that printhead die to the conductor layer.3. The apparatus of claim 1 , wherein the cover layer comprises a polymer.4. The apparatus of claim 3 , wherein the cover layer comprises polyimide claim 3 , polyethylene naphthalate claim 3 , or polyethylene terephthalate.5. The apparatus of claim 1 , wherein the cover layer is coupled to the conductor layer by an adhesive.6. The apparatus of claim 1 , wherein the cover layer comprises a polyimide film and an epoxy adhesive between the polyimide film and the conductor layer.7. The apparatus of claim 1 , wherein the cover layer is a first cover layer forming a first surface of the printed circuit board and wherein the printed circuit board includes a second cover layer forming a second surface claim 1 , opposite the first surface claim 1 , of the printed circuit board.8. The apparatus of claim 1 , wherein the printhead die comprises an arrangement of printhead die slivers each disposed in a corresponding cavity in the printed circuit board.9. The apparatus of claim 1 , wherein each printhead die comprises multiple die slivers.10. The apparatus of claim 1 , further comprising ...

Printbar and method of forming same

A printbar module and method of forming the same are described. In an example, a printbar module includes a printed circuit board (PCB), a plurality of printhead die slivers, and a manifold. The printhead die slivers are embedded in molding and attached to the PCB. The molding has a plurality of slots in fluidic communication with fluid feed holes of the printhead die slivers. The manifold is in direct fluidic communication with the slots to supply fluid thereto.

PRINTHEAD WITH S-SHAPED DIE

A printhead may include a number of s-shaped dies embedded in a moldable substrate. An medium-wide array may include a number of printheads with each printhead including a number of s-shaped dies and an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies. An s-shaped die of a printhead may include a number of columns of nozzles and an electrical interconnect coupled to a number of firing chambers associated with each of the nozzles, the electrical interconnect positioned adjacent to the number of columns. 1. A printhead comprising:a number of s-shaped dies embedded in a moldable substrate.2. The printhead of claim 1 , further comprising at least one electrical interconnect coupled at one location to each of the s-shaped dies.3. The printhead of claim 2 , wherein the number of s-shaped dies forms a medium-wide array.4. The printhead of claim 1 , wherein the s-shaped dies each comprise a number columns of nozzles.5. The printhead of claim 4 , wherein the number of columns of nozzles overlap and the overlapping nozzles cooperatively operate to eject ink to form an image on a substrate.6. The printhead of claim 1 , wherein the electrical interconnects are coupled to a common circuit assembly.7. The printhead of claim 1 , further comprising a number of ejection fluid feed slots wherein the ejection fluid feed slots provide a single type of ejection fluid to the number of s-shaped dies.8. A medium-wide array claim 1 , comprising: a number of s-shaped dies; and', 'an ejection fluid feed slot to provide a single type of ejection fluid to the s-shaped dies., 'a number of printheads, each printhead comprising9. The medium-wide array of claim 8 , further comprising a number of wirebond connections defined along a side of the s-shaped dies.10. The medium-wide array of claim 8 , wherein the number of printheads equals the number of colors provided by a printing device implementing the number of printheads.11. The medium-wide array of claim 8 ...

PROCESS FOR PRODUCING A LIQUID EJECTION HEAD

A process for producing a liquid ejection head having a substrate and an ejection orifice forming member having an ejection orifice for ejecting liquid, including forming, on the substrate, a photocationically polymerizable resin layer which includes a photocationically polymerizable resin material and becomes the ejection orifice forming member; laminating, on the uncured photocationically polymerizable resin layer, a layer containing a condensation product of a hydrolyzable silane compound having a cationically polymerizable epoxy group and a hydrolyzable silane compound having a fluorine-containing group; laminating a water-repellent layer including a hydrolyzable silane compound having a perfluoropolyether group on the condensation-product-containing layer; subjecting the photocationically polymerizable resin layer, condensation-product-containing layer, and water-repellent layer to pattern exposure; collectively curing exposed portions of the photocationically polymerizable resin layer, condensation-product-containing layer, and water-repellent layer; and removing non-exposed portions of the photocationically polymerizable resin layer, condensation-product-containing layer, and water-repellent layer to form the ejection orifice. 1. A process for producing a liquid ejection head comprising a substrate and an ejection orifice forming member having an ejection orifice for ejecting liquid , comprising the steps of:1) forming, on the substrate, a photocationically polymerizable resin layer which includes a photocationically polymerizable resin material and becomes the ejection orifice forming member;2) laminating, on the uncured photocationically polymerizable resin layer, a layer containing a condensation product obtained by condensation of a hydrolyzable silane compound having a cationically polymerizable epoxy group and a hydrolyzable silane compound having a fluorine-containing group;3) laminating a water-repellent layer comprising a hydrolyzable silane compound ...

PRINTHEAD

A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies. 1. A printhead comprising:a moldable substrate; 'a number of rows of nozzles, the rows of nozzles forming the dies within the printhead,', 'a number of dies molded into the moldable substrate, the dies comprisingwherein the moldable substrate comprises a non-rectangular shape.2. The printhead of claim 1 , wherein the non-rectangular shaped moldable substrate comprises an S-shape claim 1 , a stepped edge shape claim 1 , a staired edge shape claim 1 , a slopped edge shape claim 1 , a chamfered edge shape claim 1 , a pentangle edge shape claim 1 , or combinations thereof.3. The printhead of claim 1 , wherein a plurality of dies are molded in the moldable substrate claim 1 , the plurality of dies being arranged within the moldable substrate to conform to the non-rectangular shape of the moldable substrate.4. The printhead of claim 1 , wherein the number of dies molded into the moldable substrate comprises a plurality of dies claim 1 , and wherein the non-rectangular shaped moldable substrate are arranged in a stitching configuration wherein ejection of fluid from a number of nozzles within overlapping portions of the plurality of dies is adjusted.5. The printhead of claim 1 , wherein a plurality of die are overmolded together in the same moldable substrate.6. The printhead of claim 1 , wherein the moldable substrate comprises a number of fluid slots defined within the moldable substrate to feed fluid to the dies claim 1 , wherein the fluid slots defined within the moldable substrate are narrower than a width of the dies ...

PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD

Printheads and methods of fabricating printheads are disclosed. An example printhead includes a substrate and a printhead die disposed on a surface of the substrate, where a top surface of the printhead die projects a first distance from the surface of the substrate. The example printhead also includes a barrier at least partially surrounding the printhead die. A top surface of the barrier projects a second distance from the surface of the substrate, where the first distance is less than the second distance. 1. A printhead comprising:a substrate;a printhead die disposed on a surface of the substrate, a top surface of the printhead die projecting a first distance from the surface of the substrate; anda barrier at least partially surrounding the printhead die, a top surface of the barrier projecting a second distance from the surface of the substrate, the first distance being less than the second distance.2. The printhead of claim 1 , wherein the difference between the first distance and the second distance is about 10 micrometers to about 500 micrometers.3. The printhead of claim 1 , wherein the first printhead die is partially embedded in the substrate.4. The printhead of claim 1 , wherein the printhead die is a first printhead die claim 1 , and further including:a ridge extending from the substrate; anda second printhead die disposed on the ridge, a top surface of the second printhead die spaced a third distance from the surface of the substrate, the third distance being less than the second distance.5. The printhead of claim 4 , wherein the first printhead die is a first microelectromechanical systems (MEMS) device and the second printhead die is a second MEMS device different than the first MEMS device.6. The printhead of claim 1 , further including a cap having a substantially flat bottom surface claim 1 , when the cap is coupled to the top surface of the barrier claim 1 , the bottom surface of the cap is spaced apart from the top surface of the printhead die.7. ...

PRINTHEAD ELECTRICAL INTERCONNECTS

In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate. 1. A method comprising:applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process; andapplying a passivation layer over the electrical interconnect as a dry film laminate.2. The method of claim 1 , wherein the direct patterning additive process comprises:placing a shadow mask over the printhead; andapplying a conductive material via one of an evaporation, a sputtering, or a screen printing to form the electrical interconnect in a region of the printhead defined by the shadow mask.3. The method of claim 2 , wherein the shadow mask is to cover a portion of the printhead die containing a printhead nozzle and at least a portion of the electrical fan out structure.4. The method of claim 1 , wherein the direct patterning additive process comprises:a jet dispensing of a conductive material to form the electrical interconnect.5. The method of claim 1 , wherein the applying the electrical interconnect comprises depositing a conductive material over a surface of the printhead claim 1 , the surface comprising: a contact pad of the printhead die claim 1 , a portion of the molding claim 1 , and a contact pad of the electrical fan out structure.6. The method of claim 1 , wherein the electrical fan out structure comprises one of:a printed circuit assembly;a flex circuit; ora lead frame.7. The method of claim 1 , wherein the molding comprises an epoxy mold compound.8. The method of claim 1 , wherein the passivation layer comprises a negative photo-resist.9. The method of claim 8 , wherein the ...

CONDUCTIVE ELEMENTS ELECTRICALLY COUPLED TO FLUIDIC DIES

An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element. 1. A fluidic device comprising:a fluidic die;a support element comprising a fluid channel to define a fluid path through the support element and a fluid aperture of the fluidic die;a conductive element on a surface the fluid path and separated from the fluidic die; anda conductive lead to provide an electrical coupling between a ground of the fluidic die and the conductive element.2. The fluidic device of claim 1 , wherein the conductive lead is embedded a substrate connected to the support element.3. The fluidic device of further comprising a chip package comprising a printed circuit board (PCB) claim 2 , molded interconnect device claim 2 , or molded lead frame device coupled to the substrate claim 2 , and comprising a ground electrically coupled to the conductive lead.4. The fluidic device of further comprising a substrate connected to the support element claim 1 , the substrate also comprising a fluid channel to further define the fluid path claim 1 , and wherein the conductive element is arranged on a surface of the fluid channel of the substrate.5. The fluidic device of claim 1 , wherein the conductive element comprises Au claim 1 , Pt claim 1 , Ni claim 1 , or a combination thereof.6. The fluidic device of claim 1 , wherein the conductive element is arranged to be out of direct physical contact with the fluidic die.7. The fluidic device of claim 1 , wherein the electrical coupling between the conductive element and the ground of the fluidic die is to form an electrochemical cell in response to contact ...

FLUID EJECTION DIE INTERLOCKED WITH MOLDED BODY

A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die. 1. A fluid ejection device , comprising:a fluid ejection die including a substrate and a fluid architecture supported by the substrate; anda molded body molded around the fluid ejection die, the molded body interlocked with the fluid architecture of the fluid ejection die.2. The fluid ejection device of claim 1 , the fluid architecture including a barrier layer supported by the substrate and an orifice layer supported by the barrier layer claim 1 , the barrier layer including a plurality of fluid ejection chambers claim 1 , the orifice layer including a plurality of fluid ejection orifices communicated with the fluid ejection chambers claim 1 , and the molded body interlocked with the fluid architecture at at least one of the barrier layer and the orifice layer.3. The fluid ejection device of claim 2 , the barrier layer recessed relative to the orifice layer claim 2 , and the molded body interlocked with the fluid architecture at the barrier layer.4. The fluid ejection device of claim 2 , the orifice layer recessed relative to the barrier layer claim 2 , and the molded body interlocked with the fluid architecture at the orifice layer.5. The fluid ejection device of claim 2 , the barrier layer recessed relative to the orifice layer claim 2 , the orifice layer recessed relative to the barrier layer claim 2 , and the molded body interlocked with the fluid architecture at the barrier layer and the orifice layer.6. A fluid ejection device claim 2 , comprising:a molded body; anda fluid ejection die molded into the molded body,the fluid ejection die including a substrate and a fluid architecture supported by the substrate,the fluid architecture including a recessed feature at an edge thereof, and the ...

PRINT CARTRIDGES WITH ONE-PIECE PRINTHEAD SUPPORTS

In some examples, a print cartridge includes a housing, a one-piece printhead support attached to the housing, a printhead supported on a head-land surface area, and a trench in the printhead support surrounding the head-land surface area on at least two sides. 1. A print cartridge comprising:a housing;a one-piece printhead support attached to the housing;a printhead supported on a head-land surface area; anda trench in the printhead support surrounding the head-land surface area on at least two sides.2. The print cartridge of claim 1 , wherein the printhead support comprises:fluid channels in the head-land surface area to supply fluid to the printhead; andfluid inlets fluidically coupled with the fluid channels through the printhead support.3. The print cartridge of claim 2 , wherein the printhead support is attached to a first side of the housing claim 2 , and the fluid inlets are on a second side of the housing claim 2 , the second side different from the first side.4. The print cartridge of claim 1 , further comprising a fluid reservoir within the housing claim 1 , the fluid reservoir in fluid communication with the fluid inlets.5. The print cartridge of claim 4 , wherein the fluid reservoir comprises a plurality of isolated chambers.6. The print cartridge of claim 1 , wherein the printhead comprises a printhead die.7. The print cartridge of claim 1 , wherein the trench is selected from the group consisting of a two-sided trench that surrounds the head-land surface area on two sides claim 1 , a three-sided trench that surrounds the head-land surface area on three sides claim 1 , and a four-sided trench that surrounds the head-land surface area on four sides.8. The print cartridge of claim 1 , wherein the trench comprises a three-sided trench that surrounds the head-land surface area on three sides forming a peninsular-shaped head-land surface area.9. The print cartridge of claim 1 , wherein the one-piece printhead support comprises a chiclet portion molded to a ...

SERVICE STRUCTURES IN PRINT HEADS

In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die. 1. An apparatus , comprising:an epoxy molded compound (EMC);at least one print head die embedded in the EMC; anda service structure within the EMC located adjacent to the at least one print head die.2. The apparatus of claim 1 , wherein the service structure comprises a texture embedded in the EMC.3. The apparatus of claim 2 , wherein the texture comprises a plurality of nano-structures.4. The apparatus of claim 2 , wherein the texture comprises a plurality of ridges.5. The apparatus of claim 1 , wherein the service structure comprises an embedded service material having a low surface energy.6. The apparatus of claim 5 , wherein the embedded service material is co-planer with the at least one print head die.7. The apparatus of claim 5 , wherein the embedded service material comprises at least one of: a polyhexafluoroethylene claim 5 , a polytetrafluoroethylene (PTFE) claim 5 , a poly(vinylidene fluoride) (PVF) claim 5 , a poly(chlorotrifluoroethylene) claim 5 , a polyethylene (PE) claim 5 , a polypropylene (PP) claim 5 , or a silica filler with a low surface energy coating in an epoxy matrix.8. The apparatus of claim 1 , wherein the service structure is located within 1 millimeter or less to the at least one print head die.9. A method claim 1 , comprising:providing a structured carrier having a service structure;applying a thermal release tape over the structured carrier;applying at least one print head die on the thermal release tape;encapsulating the at least one print head die and an area that includes the service structure with an epoxy molding compound (EMC); andremoving the structured carrier and the thermal release tape, wherein the service structure is transferred ...

DROPLET EJECTION APPARATUS

A flow path unit is formed by laminating a plurality of lamination plates, and has a first damper chamber extending in a manner overlapping with a plurality of pressure chambers with a longitudinal direction in which the plurality of pressure chambers is aligned, seen from an opening side of a plurality of nozzles. The first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, in a height along the laminating direction in which the plurality of lamination plates is laminated, and a first support part is provided inside the first damper chamber. 1. A droplet ejection apparatus comprising: a flow path unit having formed therein a liquid flow path including a plurality of nozzles , a plurality of pressure chambers respectively in communication with each of the plurality of nozzles , and a common liquid chamber in communication with the plurality of pressure chambers; and an actuator configured to selectively apply pressure on liquid in the plurality of pressure chambers , whereinthe flow path unit is formed by laminating a plurality of lamination plates;the flow path unit further has a first damper chamber extending in a manner overlapping with the plurality of pressure chambers with a longitudinal direction in which the plurality of pressure chambers is aligned, seen from an opening side of the plurality of nozzles;the first damper chamber is provided at a height between the pressure chamber and the common liquid chamber, in a height along the laminating direction in which the plurality of lamination plates is laminated; anda first support part is provided inside the first damper chamber.2. The droplet ejection apparatus according to claim 1 , wherein the first support part is provided in a plural number inside the first damper chamber.3. The droplet ejection apparatus according to claim 2 , wherein the plurality of first support parts is arranged with a same pitch as that of the plurality of pressure chambers.4. The ...

PRESSING METHOD FOR SURFACE OF RESIN LAYER

A pressing method for pressing a surface of a resin layer includes pressing a surface of a resin layer of a wafer using a pressing member, which is to be divided into a plurality of liquid ejection head chips, the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate. The pressing of the surface of the resin layer is performed by positioning a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer. 1. A pressing method for pressing a surface of a resin layer , the method , comprising pressing a surface of a resin layer of a wafer with a pressing member , which is to be divided into a plurality of liquid ejection head chips , the wafer including a substrate and the resin layer to serve as an ejection port forming member provided on the substrate ,wherein the pressing of the surface of the resin layer is performed by placing a structure closer to a circumference of the wafer than to an area that becomes the plurality of liquid ejection head chips on the substrate, the structure being in contact with the resin layer.2. The pressing method for pressing a surface of a resin layer according to claim 1 , wherein a transfer member including a supporting member and the resin layer supported by the supporting member is prepared to face the substrate claim 1 , and the surface of the resin layer is pressed across the supporting member with the resin layer of the transfer member transferred onto the substrate by the pressing member.3. The pressing method for pressing a surface of a resin layer according to claim 2 , wherein the transfer member is a dry film.4. The pressing method for pressing a surface of a resin layer according to claim 2 , wherein photosensitive resin is applied on the supporting member and pattern exposure is performed on the photosensitive resin to form the ...

FLUID EJECTION DEVICE

Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles. 1. A fluid ejection device comprising:a fluid ejection die comprising a substrate, the substrate including an array of nozzles extending therethrough, the substrate having a first surface in which nozzle orifices are formed, and the substrate having a second surface opposite the first surface in which nozzle inlet openings are formed; anda molded panel in which the fluid ejection die is embedded, the molded panel surrounding sides of the fluid ejection die such that the first surface of the substrate is approximately planar with a top surface of the molded panel, the molded panel having a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.2. The fluid ejection device of claim 1 , wherein the fluid ejection die further comprises:thin film layers formed on the second surface of the substrate, the thin film layers including fluid ejection actuators associated with the nozzles of the array of nozzles.3. The fluid ejection device of claim 2 , wherein each fluid ejection actuator is positioned proximate a respective nozzle inlet opening.4. The fluid ejection device of claim 2 , wherein the fluid ejection die further comprises:a thin film layer coupled to the second surface of the substrate, the thin film layer having a respective ejection chamber formed therein for each ...

Fluid ejection die molded into molded body

A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.

LIQUID EJECTION APPARATUS AND METHOD FOR MANUFACTURING LIQUID EJECTION APPARATUS

A liquid ejection apparatus comprising: a nozzle; a pressure chamber communicating with the nozzle; a laminated body including a piezoelectric element, the laminated body covering the pressure chamber, the laminated body defining a communications opening therethrough; a reservoir communicating with the pressure chamber via the communication opening; a wall extending from the laminated body so as to extend around the communication opening, the wall including a conductive portion; a drive contact electrically connected to the piezoelectric element by a conductor including the conductive portion of the wall. 1. A liquid ejection apparatus comprising:a nozzle;a pressure chamber communicating with the nozzle;a laminated body including a piezoelectric element, the laminated body covering the pressure chamber, the laminated body defining a communications opening therethrough;a reservoir communicating with the pressure chamber via the communication opening;a wall extending from the laminated body so as to extend around the communication opening, the wall including a conductive portion;a drive contact electrically connected to the piezoelectric element by a conductor including the conductive portion of the wall.2. A liquid ejection apparatus according to claim 1 , further comprising:a plurality of the nozzles;a plurality of the pressure chambers, each pressure chamber communicating with a respective one of the nozzles;a plurality of the communications openings defined by the laminated body, wherein the reservoir communicates with the plurality of pressure chambers via respective communications openings;a plurality of the walls surrounding respective communications openings, each of the walls including a conductive portion;a plurality of the piezoelectric elements;a plurality of the drive contacts.3. A liquid ejection apparatus according to claim 2 , wherein:a first one of the piezoelectric elements is electrically connected to a respective drive contact by a respective ...

MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF LIQUID SUPPLY COMPONENT, AND LIQUID EJECTION HEAD

An orifice portion and a reservoir portion are formed between a mold and a surface of either of a second constituent component and second constituent component. Molten resin flowing from between a first constituent component and the second constituent component flows into the reservoir portion through the orifice portion. 1. A manufacturing method of a liquid supply component in which a liquid supply path is formed between a first constituent component and a second constituent component that are joined with molten resin , the method comprising:a first step of preparing the first constituent component and the second constituent component;a second step of causing the first constituent component and the second constituent component to face each other and forming an orifice portion and a reservoir portion between a mold and a surface of either of the first constituent component and the second constituent component; anda third step of pouring the molten resin between the first constituent component and the second constituent component so that the molten resin flowing from between the first constituent component and the second constituent component flows into the reservoir portion through the orifice portion.2. The manufacturing method of a liquid supply component according to claim 1 , wherein the orifice portion is located at a merging portion where a plurality of flows of the molten resin merge together in the third step.3. The manufacturing method of a liquid supply component according to claim 1 , whereina wall portion provided on the surface is located between the reservoir portion and a joining portion of the first constituent component and the second constituent component joined with the molten resin, andthe orifice portion is formed between the mold and a notch provided on the wall portion.4. The manufacturing method of a liquid supply component according to claim 3 , whereinin the second step, a projection portion provided in the mold is brought into contact ...

PRINTHEAD ASSEMBLY

In one example, a printhead assembly includes a molding with multiple printhead dies exposed at a front part of the molding and channels in a back part of the molding to carry printing fluid to the dies. The printhead assembly also includes a printed circuit board affixed to the back part of the molding, not covering any of the channels, and an electrical connection between each die and the printed circuit board.

Three-dimensional features formed in molded panel

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING THE SAME

A liquid ejection head has a plurality of ejection ports for ejecting a liquid, and a housing provided with a pair of liquid chambers which supply the liquid to a corresponding ejection port. A method for manufacturing the liquid ejection head includes: arranging a pair of mold pieces, of which width decreases gradually, to adjoin in the width direction thereof with the width decreasing in the opposite directions, molding a housing, and forming the pair of liquid chambers by drawing the pair of mold pieces from the molded housing in the direction in which the width increases. 1. A method for manufacturing a liquid ejection head which has a plurality of ejection ports for ejecting a liquid , and a housing provided with a pair of liquid chambers which supply the liquid to a corresponding ejection port , the method comprising:arranging a pair of mold pieces, of which width decreases gradually, to adjoin in the width direction thereof with the width decreasing in the opposite directions;molding a housing; andforming the pair of liquid chambers by drawing the pair of mold pieces from the molded housing in the direction in which the width increases.2. The method for manufacturing a liquid ejection head according to claim 1 , wherein the pair of liquid chambers are molded using second mold pieces which are the pair of mold pieces claim 1 , a first mold piece and a third mold piece which are drawn from the housing in directions different from the direction in which the second mold pieces are drawn.3. The method for manufacturing a liquid ejection head according to claim 1 , wherein the liquid ejection head has a filter communicating with the liquid chamber claim 1 , and the filter extends in a direction in which the width of the mold piece decreases.4. The method for manufacturing a liquid ejection head according to claim 2 , wherein the second mold piece has a slope at an end portion in the direction in which the width decreases claim 2 , and a wide portion extending in ...

LIQUID EJECTION HEAD, LIQUID EJECTION MODULE, AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD

In a liquid ejection head, a substrate is provided with a first inflow port located on an upstream side of a pressure chamber in a direction of flow of liquids in a liquid flow passage and configured to allow a first liquid to flow into the liquid flow passage, a second inflow port located on the upstream side of the first inflow port and configured to allow a second liquid to flow into the liquid flow passage, and a lateral wall extending in a direction of extension of the liquid flow passage. At least part of the lateral wall is located above the first inflow port. In the pressure chamber, the first liquid flows in contact with a pressure generating element while the second liquid flows closer to the ejection port than the first liquid does. 1. A liquid ejection head comprising:a substrate including a pressure generating element configured to apply pressure to a first liquid;a member provided with an ejection port configured to eject a second liquid;a pressure chamber including the ejection port and the pressure generating element; anda liquid flow passage formed by using the substrate and the member stacked on the substrate, the liquid flow passage including the pressure chamber and extending in a direction of flow of at least the first liquid and the second liquid, wherein a first inflow port located on an upstream side of the pressure chamber in the direction of flow of the liquids in the liquid flow passage and configured to allow the first liquid to flow into the liquid flow passage,', 'a second inflow port located on the upstream side of the first inflow port and configured to allow the second liquid to flow into the liquid flow passage, and', 'a lateral wall extending in a direction of extension of the liquid flow passage, at least part of the lateral wall being located above the first inflow port, and, 'the substrate includes'}in the pressure chamber, the first liquid flows in contact with the pressure generating element and the second liquid flows closer ...

PRINTING ELEMENT AND METHOD FOR MANUFACTURING SAME

A printing element is used, which includes a substrate, an intermediate layer, and a channel forming member layered in this order. The substrate has a common liquid chamber. The channel forming member has a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface. The first surface is formed with a plurality of ejection ports that eject liquid from the common liquid chamber. The second surface is formed with a plurality of channels that make each of the plurality of ejection ports and the common liquid chamber communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween. 1. A printing element comprising a substrate , an intermediate layer , and a channel forming member , layered in this order ,the substrate including a common liquid chamber,the channel forming member having a second surface that is a surface facing the substrate via the intermediate layer, and a first surface that is an opposite surface to the second surface,the first surface being formed with a plurality of ejection ports that eject liquid from the common liquid chamber,the second surface being formed with a plurality of channels that make each of the plurality of ejection ports and the common liquid chamber communicate with each other, and a plurality of substantially parallel beam structures, the plurality of beam structures forming a slit portion therebetween, andthe intermediate layer being provided with a plurality of first opening portions that make the common liquid chamber and each of the plurality of channels communicate with each other, and a plurality of second opening portions that make the slit portion and the common liquid chamber communicate with each other.2. The printing element according to claim 1 , wherein the intermediate layer collects a foreign substance flowing from the common liquid ...

LIQUID DISCHARGE CARTRIDGE MANUFACTURING METHOD AND LIQUID DISCHARGE HEAD

A liquid discharge cartridge manufacturing method includes a first step of individually shaping a first shaped member and a second shaped member that form a housing of a liquid discharge cartridge, and a second step of joining the first shaped member and the second shaped member to be bonded to each other with molten resin. The first step includes shaping a wall section in the first shaped member, the wall section forming a recess for accommodating the molten resin, and shaping a projection in the second shaped member, the projection extending such that the projection is located at the outer side of the wall section and adjacent to the wall section, with a predetermined gap being formed between the projection and the wall section, when the first and second shaped members are joined. 1. A liquid discharge cartridge manufacturing method comprising:a first step of individually shaping a first shaped member and a second shaped member that form a housing of a liquid discharge cartridge; anda second step of joining the first shaped member and the second shaped member to be bonded to each other with molten resin,wherein the first step includes:shaping a wall section in the first shaped member, the wall section forming a recess for accommodating the molten resin; andshaping a projection in the second shaped member, the projection extending such that the projection is located at an outer side of the wall section and adjacent to the wall section, with a predetermined gap being formed between the projection and the wall section when the first and second shaped members are joined.2. The method according to claim 1 ,wherein the wall section comprises a pair of wall sections projecting toward the second shaped member, and the recess is formed between the wall sections,wherein the projection comprises a pair of projections extending toward the first shaped member, andwherein when the first and second shaped members are joined in the second step, the pair of wall sections is ...

MOLDED DIE SLIVERS WITH EXPOSED FRONT AND BACK SURFACES

In an example implementation, a printhead includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding and flush with the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding. 1. A process for making a molded printhead die , comprising:attaching a die sliver to a carrier, the die sliver having a front surface facing the carrier and a back surface with a cap layer, the cap layer covering fluid feed holes that extend from the back surface to the front surface;molding the die sliver into a molding material to form a molded die sliver;releasing the carrier from the molded die sliver; and,thinning the molded die sliver to remove molding material and the cap layer from the back surface of the molded die sliver.2. The process of claim 1 , wherein attaching a die sliver to a carrier comprises:positioning the front surface of the die sliver downward toward the carrier; and,pressing the front surface against a thermal release tape attached to the carrier.3. The process of claim 2 , wherein thinning the molded die sliver comprises:releasing the carrier from the thermal release tape;removing the thermal release tape from the molded die sliver; and, grinding off the molding material from the back surface of the die sliver.4. The process of claim 3 , wherein thinning the molded die sliver further comprises grinding off the cap layer from the back surface of the die sliver to enable fluid to flow through the fluid feed holes from the back surface to the front surface.5. The process of claim 2 , wherein molding the die sliver into a molding material comprises molding the die sliver in a compression molding process or a transfer molding process.6. The process of claim 5 , wherein molding the die sliver in a compression molding process comprises:preheating the molding ...

MOLDED FLUID FLOW STRUCTURE

In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device. 1. A fluid flow structure , comprising a micro device sliver embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.2. The structure of claim 1 , where the micro device sliver comprises a single printhead die sliver.3. The structure of claim 2 , where the channel is exposed to an external surface of the printhead die sliver.4. The structure of claim 2 , where the printhead die sliver includes an electrical terminal and the structure comprises a conductor connected to the terminal and embedded in the molding.5. The structure of claim 1 , where the printhead die sliver comprises multiple printhead die slivers.6. The structure of claim 5 , where the channel is exposed to an external surface of each printhead die sliver.7. The structure of claim 5 , where each printhead die sliver includes an electrical terminal and the structure comprises a conductor connected to the terminal and embedded in the molding.8. The structure of claim 5 , where the channel comprises multiple channels through each of which fluid may flow directly to at least one of the die slivers.9. A fluid flow structure claim 5 , comprising a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.10. The structure of claim 9 , where the channel is molded into the molding.11. The structure of claim 10 , where the micro device includes a fluid flow passage connected directly to the channel.12. The structure of claim 9 , where the channel is exposed to an external surface of the micro device.13. The structure of claim 9 , where the channel comprises an open channel exposed to an external surface of the micro device14. The structure of claim 9 , where the micro device comprises an electronic device or a ...

MOLDED PRINTHEAD

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

FLUID STRUCTURE WITH COMPRESSION MOLDED FLUID CHANNEL

A method of making a fluid channel in a printhead structure includes positioning a printhead die on a carrier; compression molding the die into a molded printhead structure; compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; and materially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die. 1. A method of making a fluid channel in a printhead structure , comprising:positioning a printhead die on a carrier;compression molding the die into a molded printhead structure;compression molding a first segment of a fluid channel into the molded printhead structure simultaneously with compression molding the die; andmaterially ablating a second segment of the fluid channel to couple the channel with a fluid feed hole in the die.2. A method as in claim 1 , further comprising using the first segment of the channel as a mask during the ablating.3. A method as in claim 1 , wherein the materially ablating comprises removing a residual layer of molding material from between the first segment of the channel and the die.4. A method as in claim 3 , wherein the materially ablating further comprises removing material from a cap on the die to expose the fluid feed hole.5. A method as in claim 4 , wherein removing material from the cap comprises removing a material selected from the group consisting of silicon claim 4 , polymer claim 4 , metal claim 4 , and dielectric.6. A method as in claim 1 , wherein materially ablating comprises removing material using a process selected from the group consisting of powder blasting claim 1 , etching claim 1 , lasering claim 1 , milling claim 1 , drilling claim 1 , and electrical discharge machining. This application is a continuation of U.S. application Ser. No. 14/770,425, filed Aug. 25, 2015, which is itself a 35 U.S.C. 371 national stage filing of international application S.N. PCT/US2013/052512, filed Jul. 29 ...

METHOD OF MANUFACTURING INKJET PRINTHEAD

A method of forming an inkjet printhead. The method includes the steps of: providing a metal alloy shim having a plurality of shim apertures; nitriding a surface of the shim; bonding the shim to a rigid elongate manifold having ink supply channels, such that each shim aperture is in fluid communication with a respective ink supply channel; and bonding printhead chips to the shim, thereby forming the inkjet printhead. 1. A method of forming an inkjet printhead , said method comprising the steps of:providing a metal alloy shim having a plurality of shim apertures;nitriding a surface of the shim;bonding the shim to a rigid elongate manifold having one or more ink supply channels, such that each shim aperture is in fluid communication with a respective ink supply channel; andbonding one or more printhead chips to the shim, thereby forming the inkjet printhead.2. The method of claim 1 , wherein the shim is comprised of a metal alloy having a coefficient of thermal expansion (CTE) of 5 ppm/° C. or less.3. The method of claim 1 , wherein the shim is comprised of an alloy of iron and at least one other metal selected from the group consisting of: nickel claim 1 , cobalt and chromium.4. The method of claim 1 , wherein the shim is comprised of Invar 36.5. The method of claim 1 , wherein the manifold is a one-piece structure.6. The method of claim 1 , wherein the manifold is comprised of a same metal alloy as the shim.7. The method of comprising the further step of nitriding the manifold.8. The method of claim 1 , wherein the shim has a thickness in the range of 100 to 1000 microns. The present application is a continuation of U.S. application Ser. No. 16/051,319 filed Jul. 31, 2018, which is a continuation-in-part of U.S. application Ser. No. 15/888,852, filed Feb. 5, 2018, which claims the benefit of priority under 35 U.S.C. § 119(e) of U.S. Provisional Application No. 62/455,346, filed Feb. 6, 2017, the contents of each of which are hereby incorporated by reference in their ...

FLUID EJECTION DEVICE INCLUDING INTEGRATED CIRCUIT

Examples include a fluid ejection device comprising a molded panel, an ejection die molded in the molded panel, and an integrated circuit molded in the molded panel. The ejection die comprises ejection nozzles to selectively dispense printing material. The integrated circuit receives nozzle data and controls the selective dispensation of printing material by the ejection nozzles based at least in part on the nozzle data. The molded panel has a fluid communication channel formed therethrough and fluidly connected to the ejection die. 1. A fluid ejection device comprising:a molded panel having a fluid communication channel formed therethrough;at least one ejection die molded to the molded panel, the at least one ejection die comprising a plurality of ejection nozzles that are fluidly connected to the fluid communication channel, each ejection nozzle to selectively dispense printing material received from the fluid communication channel; and 'receive nozzle data and control selective dispensation of printing material via the plurality of ejection nozzles based at least in part on the nozzle data.', 'an integrated circuit molded into the panel and electrically connected to the ejection die, the integrated circuit to2. The fluid ejection device of claim 1 , wherein the at least one ejection die comprises a temperature sensor and at least one heating element claim 1 , and the integrated circuit is further to receive sensor data from the temperature sensor and control the at least one heating element of the at least one ejection die based at least in part on the sensor data.3. The fluid ejection device of claim 1 , wherein the integrated circuit and the at least one fluid ejection die are electrically connected in a tape automated bonding process.4. The fluid ejection device of claim 1 , wherein the integrated circuit translates the received nozzle data to updated nozzle data that corresponds to an arrangement of the plurality of ejection nozzles of the at least one ...

LIQUID DISCHARGE HEAD AND LIQUID DISCHARGE APPARATUS

A cover member includes two end regions located at two ends in a first direction, and two beam portions which extend in the first direction and connect the two end regions together and which, together with the two end regions, form a single opening that exposes a plurality of discharge ports. When a width of the opening is denoted as a [mm], a minimum length in the first direction of the end regions is denoted as c [mm], a modulus of longitudinal elasticity of the cover member is denoted as E [GPa], and a thickness of the cover member is denoted as t [mm], the following expression is established. 2. The liquid discharge head according to claim 1 , wherein c≧8 mm.31212. The liquid discharge head according to claim 1 , wherein when widths in the second direction of the two beam portions are denoted as b and b claim 1 , respectively claim 1 , a>b and a>b.412. The liquid discharge head according to claim 3 , wherein the widths b and b are each 5 mm or more and 10 mm or less.5. The liquid discharge head according to claim 1 , wherein a plurality of the recording element substrates are arranged in a row in the first direction.6. The liquid discharge head according to claim 5 , wherein the second direction is along a conveyance direction of a recording medium claim 5 , and a length in the first direction of the opening is longer than a printing width in the first direction onto the recording medium.7. The liquid discharge head according to claim 5 , wherein two electrical wiring members that supply electric power for discharging liquid are connected to two sides of each recording element substrate claim 5 , the two sides opposing to the beam portions.8. The liquid discharge head according to claim 7 , further comprising:a flow path member which is located on an opposite side to the cover member of each recording element substrate, and in which a flow path that supplies a liquid to each recording element substrate is formed,wherein the flow path member comprises, on both ...

PRINTHEAD DIES MOLDED WITH NOZZLE HEALTH SENSOR

In an implementation, a printhead includes a printhead die molded into a molding. The die has a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface. The die also has a nozzle health sensor molded into the molding to detect defective nozzles in the printhead die. 1. A printhead , comprising:a printhead die molded into a molding, the die having a front surface exposed outside the molding to dispense fluid drops through nozzles and an opposing back surface covered by the molding except at a channel in the molding through which fluid may pass directly to the back surface; and,a nozzle health sensor molded into the molding to detect defective nozzles in the printhead die.2. A printhead as in claim 1 , wherein the nozzle health sensor comprises:an illumination array molded into a first side of the molding;a detection array molded into a second side of the molding to sense light emitted by the illumination array; andoptical components to direct light emitted by the illumination array across the front surface of the die to the detection array.3. A printhead as in claim 2 , wherein the optical components comprise:an optical component associated with the illumination array; andan optical component associated with the detection array.4. A printhead as in claim 2 , wherein the detection array comprises imaging sensors selected from the group consisting of charge coupled devices (COD's) claim 2 , complementary metal oxide semiconductor (CMOS) devices claim 2 , a photomultiplier tube (PMT) claim 2 , a contact image sensor (CIS) claim 2 , and photodiodes.5. A printhead as in claim 2 , wherein the illumination array comprises an array of light emitting diodes.6. A printhead as in claim 2 , wherein the optical component is selected from the group consisting of mirrors claim 2 , lenses claim 2 , and combinations ...

Flexible carrier for fluid flow structure

In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.

PRINTING FLUID CARTRIDGE

In some examples, printing fluid cartridge comprises a housing and an assembly supported by the housing. The assembly comprises a molding and a non-fluid dispensing die electronic device embedded in the molding. 1. A printing fluid cartridge comprising:a housing; and a molding; and', 'a non-fluid dispensing die electronic device embedded in the molding., 'an assembly supported by the housing and comprising2. The printing fluid cartridge of claim 1 , wherein the assembly further comprises:a first external electrical contact on a surface of the molding and exposed outside the molding to connect to circuitry external to the assembly,wherein the non-fluid dispensing die electronic device is electrically connected to the first external electrical contact.3. The printing fluid cartridge of claim 1 , wherein the molding includes a channel to receive a printing fluid.4. The printing fluid cartridge of claim 1 , wherein:a thickness of the molding varies at different locations of the molding, andthe non-fluid dispensing die electronic device is buried in a thicker part of the molding.5. The printing fluid cartridge of claim 1 , wherein the assembly comprises a plurality of external electrical contacts exposed outside the molding.6. The printing fluid cartridge of claim 1 , further comprising a printed circuit board claim 1 , wherein the non-fluid dispensing die electronic device is electrically connected to the printed circuit board.7. The printing fluid cartridge of claim 1 , wherein the printed circuit board is embedded in the molding.8. The printing fluid cartridge of claim 1 , wherein the non-fluid dispensing die electronic device is mounted on the printed circuit board.9. The printing fluid cartridge of claim 1 , further comprising a port to fluidically connect to a printing fluid supply.10. The printing fluid cartridge of claim 1 , wherein the assembly comprises a plurality of external electrical contacts including the first external electrical contact claim 1 , and the ...