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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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02-02-2012 дата публикации

Curable adhesive compositions, process, and applications

Номер: US20120029116A1

Автор: Chung-Jen Hou, John J. McNamara, Rong-Chang Liang, Yurong Ying

Принадлежит: Trillion Science Inc

The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

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Номер записи: 1

08-03-2012 дата публикации

Branched polymer, method for making the same, and applications thereof

Номер: US20120058399A1

Автор: Chia-Chun Wang, Chiu-Ya Wang, Kuo-Chung Cheng, Shao-Hsuan Lo, Wen-Wu Li

Принадлежит: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY

A branched polymer represented by formula (I): wherein at least one of L 1 , L 2 , L 3 , and L 4 is a univalent organic group represented by formula (II): wherein L 5 , L 6 and L 7 are independently hydrogen or a univalent organic group, D 1 , D 2 and D 3 being independently a single bond or a divalent group, at least one of D 1 , D 2 , and D 3 containing in which R 1 is hydrogen or a methyl group and n is an integer ranging from 1 to 1000; and the remainder of L 1 , L 2 , L 3 , and L 4 being independently hydrogen or a univalent organic group represented by formula (III): wherein R is a univalent end group, with the proviso that, when one of the remainder is hydrogen, the others of the remainder cannot be hydrogen.

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Номер записи: 2

29-03-2012 дата публикации

Epoxy Resin Composition

Номер: US20120077904A1

Автор: Guangchao XIE, Xingming CHENG

Принадлежит: Henkel China Investment Co Ltd

The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R 1 and R 2 are independently hydrogen or alkyl of C 1 -C 6 ; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture.

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Номер записи: 3

05-07-2012 дата публикации

Curable epoxy resin compositions and composites made therefrom

Номер: US20120172493A1

Автор: Bernd Hoevel, Gary A. Hunter, Ha Q. Pham, Martine Rousse, Marvin L. Dettloff, Susan K. Falcone-Potts

Принадлежит: Individual

A curable epoxy resin composite composition including a reinforcing material and an epoxy resin composition, and a process for preparing a composite from such composition; wherein a combination of at least one alkanolamine and at least one styrenated phenol are present in the epoxy resin composition in a sufficient amount to increase the rate of reaction of the at least one epoxy resin and the at least one alkanolamine curing agent while maintaining the thermal and mechanical properties of the composite upon curing of the epoxy resin composition.

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Номер записи: 4

26-07-2012 дата публикации

Composite surfacing film with ultraviolet light and abrasion resistance

Номер: US20120190773A1

Автор: Dalip Kumar Kohli

Принадлежит: CYTEC TECHNOLOGY CORP

The present invention is a one-part ultraviolet light and abrasion resistant pigmented surfacing film composition adapted for co-curing with an amine cured composite prepreg material using a chain extended base cycloaliphatic epoxy resin. The chain extended cycloaliphatic epoxy resin is formed through the pre-reaction of a base cycloaliphatic epoxy resin with a chain extension agent such as bisphenol and a high molecular weight elastomer in the presence of triphenyl phosphine to chain link the base cycloaliphatic epoxy resin to form a film formable cycloaliphatic resin prereact capable of low temperature curing when added to a latent amine based epoxy curing agent; an amine catalyst; at least one filler; at least one pigment; and a flow control agent to form surfacing film composition. The surfacing film composition adapted for co-curing with an amine curable composite from about 180° F. to about 350° F.

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Номер записи: 5

30-08-2012 дата публикации

Furan-Based Curable Compound Derived from Biomass, Solvent-Free Curable Composition, and Method for Preparing Same

Номер: US20120220742A1

Автор: Baek Jin Kim, Bo Ra Kim, Do Hoon LEE, Jae Soung Lee, Jae Won Jung, Jin Ku Cho, Sang Hyeup Lee, Sang Yong Kim

Принадлежит: Korea Institute of Industrial Technology KITECH

The present invention relates to a furan-based curable compound derived from carbohydrate-based biomass, to a solvent-free curable composition, and to a method for preparing thereof, wherein the furan-based curable compound derived from biomass according to the present invention includes two epoxide functional groups bonded to at least one furan-based compound. The present invention may provide an environmentally friendly next-generation curable compound comprising a novel furan-based compound derived from biomass, which may be substituted for curable materials derived from oil resources, as a basic backbone, as well as a composition containing the same. According to the present invention, a curable material, which has a low contraction ratio during curing as compared to conventional radical-type curing materials, may be obtained, and a compound applied to the novel curing material may be prepared with a combination of excellent efficiency and cost-effectiveness.

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Номер записи: 6

15-11-2012 дата публикации

Composite compositions

Номер: US20120289624A1

Автор: Bernd Hoevel, Guillaume Metral, Joseph Gan, Michael J. Mullins

Принадлежит: Individual

A curable resin composition for composites and electrical laminates including (I) at least one thermoset resin composition; (II) at least one hardener; and (III) at least one reinforcing material; wherein the composite or electrical laminate has a balance of properties including a combination of (a) a Tg of at least about 150° C.; and (b) a water uptake of less than about 2.5 wt %.

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Номер записи: 7

29-11-2012 дата публикации

Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same

Номер: US20120302667A1

Автор: Eun Jung Lee, Ju Mi Kim, Seung Han, Sung Su Park

Принадлежит: Cheil Industries Inc

An epoxy resin composition for encapsulating a semiconductor device includes a curing agent, a curing accelerator, inorganic fillers, and an epoxy resin, the epoxy resin including a first resin represented by Formula 1: wherein R1 and R2 are each independently hydrogen or a C1 to C4 linear or branched alkyl group, and n is a value from 1 to 9 on average.

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Номер записи: 8

11-04-2013 дата публикации

Nanoimprint resist, nanoimprint mold and nanoimprint lithography

Номер: US20130087528A1

Автор: Li-Hui Zhang, Mo Chen, Qun-Qing Li, zhen-dong Zhu

Принадлежит: Individual

A nanoimprint lithography method includes the following steps. First, a first sacrifice layer, a second sacrifice layer and a nanoimprint resist are formed on a substrate. The nanoimprint resist includes a hyperbranched polyurethane oligomer, a perfluoropolyether; a methylmethacrylate, and a diluent solvent. Second, a master stamp with a first nanopattern formed by a number of projecting portions and gaps is provided, and the first nanopattern is pressed into the nanoimprint resist to form a second nanopattern in the nanoimprint resist. Third, the second nanopattern is transferred to the substrate.

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Номер записи: 9

25-04-2013 дата публикации

Sealant, inkjet recording head using sealant, and method for manufacturing the same

Номер: US20130100210A1

Автор: Isao Imamura, Kouji Harada, Tadayoshi Inamoto

Принадлежит: Canon Inc

A sealant contains a dicyclopentadiene type epoxy resin represented by formula 1 below, a hydrogenated bisphenol A epoxy resin, and a photo-induced cationic polymerization initiator, in which the content of the dicyclopentadiene type epoxy resin is 15 to 40 parts by mass relative to 100 parts by mass of the total mass of epoxy resins contained in the sealant. where n represents an integer of 0 to 2.

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Номер записи: 10

02-05-2013 дата публикации

Epoxy resin composition

Номер: US20130109786A1

Автор: Guangchao XIE, Xingming CHENG

Принадлежит: Henkel China Investment Co Ltd

The present invention provides an epoxy resin composition comprising epoxy resin, phenolic resin, a cure accelerator and an inorganic filler; said epoxy resin comprises: (1) 20-50% of Formula I; (2) 10-40% of Formula II; and (3) 0-30% of Formula III and/or 0-40% of Formula IV, wherein Formula III and Formula IV are not 0% simultaneously; and wherein, R 1 and R 2 are independently hydrogen or alkyl of C 1 -C 6 ; n is an integer from 0 to 50 in Formula I; the ratio of the number of phenolic hydroxyls in said phenolic resin to the number of epoxy groups in the epoxy resin mixture is 0.8-1.3; all said percentages are percentages relative to the total mass of the epoxy resin mixture. The present invention provides a green, environmentally friendly epoxy resin composition with high reliability and low warpage properties that can satisfy the requirement of lead-free high temperature reflux process.

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Номер записи: 11

18-07-2013 дата публикации

Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions

Номер: US20130184378A1

Автор: Bernhard Kainz, Carola Rosenthal, Emile C. Trottier, Joseph Gan, Matthieu M. Eckert

Принадлежит: Dow Global Technologies LLC

An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.

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Номер записи: 12

01-08-2013 дата публикации

Liquid epoxy resin composition and semiconductor device

Номер: US20130197129A1

Автор: Hideki Akiba, Kazuaki Sumita, Shinsuke Yamaguchi, Yasuo Kimura

Принадлежит: Shin Etsu Chemical Co Ltd

Disclosed is a liquid epoxy resin composition containing: (A) a liquid epoxy resin comprising at least one liquid epoxy resin represented by the following general formula (1) or (2): (B) a phenolic curing agent, (C) an accelerator in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of component (A), and (D) an inorganic filler in an amount of 20 to 900 parts by weight based on 100 parts by weight of component (A).

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Номер записи: 13

08-08-2013 дата публикации

Resin composition, cured resin product, wiring board, and manufacturing method for wiring board

Номер: US20130199830A1

Автор: Konatsu Nakamura, Masaki Morita, Shin Takanezawa

Принадлежит: Hitachi Chemical Co Ltd

By producing a resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule thereof and containing a hexanediol structure, (B) an ultraviolet ray active ester group-containing compound, and (C) an epoxy resin curing accelerator, even in a state where an irregular shape of the surface of an insulating resin layer is small, a high adhesive force to a wiring conductor can be easily revealed.

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Номер записи: 14

10-10-2013 дата публикации

Structural hybrid adhesives

Номер: US20130267136A1

Автор: Dmitriy Salnikov, Ilya Gorodisher, Michael A. Kropp

Принадлежит: 3M Innovative Properties Co

Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

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Номер записи: 15

24-10-2013 дата публикации

Coating Compositions for Packaging Articles and Methods of Coating

Номер: US20130280455A1

Автор: Benoit Prouvost, Grant Schutte, Jeffrey Niederst, Kevin Romagnoli, Paul Stenson, Richard H. Evans, Robert M. O'brien, Tom Van Kuren

Принадлежит: Valspar Sourcing Inc

This invention provides a polymer that is useful in a variety of applications, including as a binder polymer of a coating composition, and especially a packaging coating composition. Packaging articles (e.g., containers) comprising the polymer and methods of making such packaging articles are also provided.

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Номер записи: 16

14-11-2013 дата публикации

Quasicrystalline structures and uses thereof

Номер: US20130302922A1

Автор: Paul Joseph Steinhardt, Paul Michael Chaikin, Weining Man

Принадлежит: PRINCETON UNIVERSITY

This invention relates generally to the field of quasicrystalline structures. In preferred embodiments, the stopgap structure is more spherically symmetric than periodic structures facilitating the formation of stopgaps in nearly all directions because of higher rotational symmetries. More particularly, the invention relates to the use of quasicrystalline structures for optical, mechanical, electrical and magnetic purposes. In some embodiments, the invention relates to manipulating, controlling, modulating and directing waves including electromagnetic, sound, spin, and surface waves, for pre-selected range of wavelengths propagating in multiple directions.

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Номер записи: 17

21-11-2013 дата публикации

Epoxy resin composition, and prepreg and printed circuit board usng the same

Номер: US20130306357A1

Автор: Hsien Te Chen, Hsuan Hao HSU, Jiun Jie Huang, Mei Ling Chu

Принадлежит: Taiwan Union Technology Corp

Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

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Номер записи: 18

05-12-2013 дата публикации

Epoxy resin composition and light emitting apparatus

Номер: US20130320393A1

Автор: Jae Hun Jeong, Min Young Kim, Sang In YOON, Sung Bae Moon

Принадлежит: Kukdo Chemical Co Ltd, LG Innotek Co Ltd

Disclosed are an epoxy resin composition and a light emitting apparatus. The epoxy resin composition includes a triazine derivative epoxy resin and a silicon-containing alicyclic epoxy resin

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Номер записи: 19

20-02-2014 дата публикации

Epoxy resin compound and radiant heat circuit board using the same

Номер: US20140048316A1

Автор: Gun Young Gil, Hyuk Soo Lee, In Hee Cho, Jae Man Park, Jeung Ook PARK, Jin Hwan Kim, Jong Heum YOON, Jong Sik LEE, Myeong Jeong Kim, Sung Jin YUN, Thanh Kieu GIANG

Принадлежит: LG Innotek Co Ltd

There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

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Номер записи: 20

27-03-2014 дата публикации

BISPHENOL A (BPA) FREE EPOXY RESINS

Номер: US20140088289A1

Автор: Schmidt Daniel

Принадлежит: UNIVERSITY OF MASSACHUSETTS LOWELL

An epoxy resin is provided that includes a diglycidyl ether of a substituted cycloaliphatic diol or bis-thiol, and a thermoset epoxy polymer is provided employing the same. The epoxy resin is bisphenol A free, and capable of forming thermoset epoxy polymers with fewer associated health and environmental concerns than conventional epoxies based on phenolic compounds. 2. The epoxy resin composition of further comprising a second monomer claim 1 , a curative compound claim 1 , or both.3. The epoxy resin composition of wherein the second monomer is a flexible molecule selected from the group consisting of an aliphatic claim 2 , cycloaliphatic or polyetheric molecule comprising at least two functional groups.6. The epoxy resin composition of claim 1 , wherein A and A′ are both either O or S; wherein W claim 1 , X claim 1 , Y and Z are each independently selected from the group consisting of a bond and C;{'sub': 1', '12', '1', '6, 'wherein R-Rare each independently selected from hydrogen, C-Cstraight chain or branched alkyl or alkenyl group; and'}{'sub': 2', '3', '2, 'wherein the alkyl, alkenyl is optionally substituted with one or more substituents, each of which is independently selected from NH, OH, CF, CN, COH, C(O) or halogen.'}7. The epoxy resin composition of claim 1 , wherein A and A′ are both O; wherein W claim 1 , X claim 1 , Y and Z are each independently selected from the group consisting of a bond and C;{'sub': 1', '12', '1', '6, 'wherein R-Rare each independently selected from hydrogen, C-Cstraight chain or branched alkyl.'}8. The epoxy resin composition of claim 1 , wherein R-Rare each independently selected from methyl or ethyl groups.9. The epoxy resin composition of claim 1 , wherein the resin is derived from a diglycidyl ether of a diol selected from the group consisting of 3 claim 1 ,3 claim 1 ,4 claim 1 ,4-tetramethyl-1 claim 1 ,2-cyclobutanediol; 2 claim 1 ,2 claim 1 ,4 claim 1 ,4-tetramethyl-1 claim 1 ,3-cyclobutanediol; 3 claim 1 ,3 claim 1 ,4 ...

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Номер записи: 21

06-01-2022 дата публикации

Method of lining a structure with a delayed curing resin composition

Номер: US20220002470A1

Автор: Danny Warren

Принадлежит: Warren Environmental and Coating LLC

A resin composition and method for installing a pipe liner that allows the liner to be fully wet out with a resin and activator and stored for a period of up to six months prior to installation and curing. A method of lining a pipe with a delayed curing resin composition is also provided that includes fully wetting out a liner with a blended two part epoxy composition such that the liner can be transported in a wet out fashion, placed in a pipe to be lined and repositioned as needed without concern for the resin composition to begin curing.

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Номер записи: 22

06-01-2022 дата публикации

DECOMPOSABLE AND RECYCLABLE EPOXY THERMOSETTING RESINS

Номер: US20220002472A1

Автор: ABU-OMAR Mahdi M., Zhao Shou

Принадлежит: The Regents of the University of California

A thermoset precursor composition includes a backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain, and at least one of: an epoxy group terminating the backbone or an aldehyde group terminating the backbone. The thermoset precursor can have at least two epoxy groups, one epoxy group and one aldehyde group, or two aldehyde groups. 114.-. (canceled)15. A thermoset composition , comprising:a first backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain; anda second backbone comprising an imine bond bonding at least one of: 1) aromatic compounds together, or 2) bonding an aromatic compound to an aliphatic chain; anda cross-link bond between the first backbone and the second backbone.16. The thermoset composition of claim 15 , wherein the cross-link bond comprises an imine bond.17. The thermoset composition of claim 15 , further one or more fillers disposed in the thermoset composition claim 15 , wherein the one or more filler comprise: a monomer claim 15 , a polymer claim 15 , a plasticizer claim 15 , a carbon fiber claim 15 , a glass fiber claim 15 , a metal claim 15 , a glass claim 15 , wood claim 15 , a flame retardant claim 15 , a pigment claim 15 , a dye claim 15 , a lubricant claim 15 , an antioxidant claim 15 , or a combination thereof.18. A thermoset composition of claim 15 , wherein the thermoset composition is configured to have a water resistance based on a hydrophobicity of the thermoset precursor claim 15 , a hydrophobicity of a hardener in the thermoset claim 15 , or both.19. The thermoset composition of claim 15 , wherein the thermoset composition is configured to have a water resistance based on a concentration of the cross-link bonds between the first backbone and the second backbone.20. The thermoset composition of claim 15 , further comprising a water-resistant coating ...

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Номер записи: 23

06-01-2022 дата публикации

POLYORGANOSILSESQUIOXANE, HARD COAT FILM, ADHESIVE SHEET, AND LAMINATE

Номер: US20220002494A1

Автор: Harada Nobuhiko, Kuwana Akihiro, MAETANI Shinji, MASUI Maya, Takase Ichiro, TSUJI Naoko

Принадлежит: Daicel Corporation

Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity (weight-average molecular weight to number-average molecular weight ratio) of 1.0 to 3.0. 2. The adhesive layer according to claim 1 ,the polyorganosilsesquioxane further comprising {'br': None, 'sup': '2', 'sub': '3/2', '[RSiO]\u2003\u2003(2)'}, 'a constitutional unit represented by Formula (2){'sup': '2', 'wherein Ris selected from a substituted or unsubstituted aryl group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted cycloalkyl group, a substituted or unsubstituted alkyl group, and a substituted or unsubstituted alkenyl group.'}4. The adhesive layer according to claim 2 ,{'sup': '2', 'wherein Ris a substituted or unsubstituted aryl group.'}5. The adhesive layer according to claim 1 ,the curable composition further comprisinga curing catalyst.6. The adhesive layer according to claim 5 ,wherein the curing catalyst comprises a cationic photoinitiator.7. The adhesive layer according to claim 5 ,wherein the curing catalyst comprises a cationic thermal initiator.8. The adhesive ...

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Номер записи: 24

05-01-2017 дата публикации

PROCESS FOR PRODUCING ISOHEXIDE GLYCIDYL ETHERS, PRODUCTS THUS OBTAINED, AND USES THEREOF

Номер: US20170002132A1

Автор: Buffe Clothilde, DOLENEC Amelie, Ibert Mathias

Принадлежит:

A process for producing bis-anhydrohexitol ether compositions and in particular isohexide glycidyl ether compositions, one of the originalities of which is azeotropic distillation carried out under reduced pressure. Such compositions are used to produce epoxy resins, the function thereof being to form a three-dimensional macromolecular network. The compositions obtained according to the process are rich in diepoxy derivatives of isosorbide to the detriment of monoepoxy derivatives, only the first participating in the formation of the three-dimensional network. The crosslinking density is therefore increased, thereby making it possible to obtain a material which is more chemically resistant and mechanically stronger and which has a higher glass transition temperature (Tg), compared with the same materials obtained with bis-anhydrohexitol ether compositions according to the prior art. 19-. (canceled)10. A process for producing bis-anhydrohexitol ether compositions , comprising the following steps:a) bringing a dianhydrohexitol into contact with an organic halide,b) placing the resulting mixture of dianhydrohexitol and organic halide under vacuum so as to obtain a negative pressure of between 100 mbar and 1000 mbar,c) heating the mixture under vacuum at a temperature of between 50° C. and 120° C. and thus carrying out an azeotropic distillation,d) then adding to said mixture a basic reagent for a period of between 1 hour and 10 hours and then continuing the azeotropic distillation,e) recovering the bis-anhydrohexitol ether composition after a filtration step, concentration of the filtering and optionally a purification step.11. The process as claimed in claim 10 , wherein the dianhydrohexitol is an isohexitol claim 10 , more preferentially chosen from isosorbide claim 10 , isomannide and isoidide claim 10 , and is claim 10 , more preferentially claim 10 , isosorbide.12. The process as claimed in claim 10 , wherein the organic halide is chosen from epibromohydrin claim ...

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Номер записи: 25

02-01-2020 дата публикации

EPOXY RESIN COMPOSITION, CURED PRODUCT AND COMPOSITE MATERIAL

Номер: US20200002464A1

Автор: FUKUDA Kazumasa, Takezawa Yoshitaka, Yoshida Yuka

Принадлежит:

An epoxy resin composition that comprises an epoxy resin and a curing agent, the epoxy resin comprising an epoxy compound that has, in one molecule, two or more structural units represented by the following Formula (I) and two or more epoxy groups, and the curing agent comprising a compound having two or more amino groups that are directly bound to an aromatic ring. 2. The epoxy resin composition according to claim 1 , wherein the epoxy compound has two structural units represented by Formula (I).3. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition is capable of forming a smectic structure in a cured state.4. A cured product of the epoxy resin composition according to .5. A composite material comprising the cured product according to and a reinforcing material.6. The composite material according to claim 5 , wherein the reinforcing material comprises a carbon material. The invention relates to an epoxy resin composition, a cured product and a composite material.Epoxy resin is widely used as a matrix resin of fiber-reinforced plastics (FRPs). Recently, epoxy resin is also used as a matrix resin of FRPs for aerospace industries which require a high level of properties such as fracture toughness, elasticity and heat resistance. However, although thermosetting resins, such as epoxy resin, have superior heat resistance, they tend to have less fracture toughness as compared with thermoplastic resins.For the purpose of improving the fracture toughness of a cured product of epoxy resin, a method of using an epoxy resin having a high molecular weight or a curing agent having a high molecular weight, a method of obtaining a cured product of epoxy resin in which molecules are oriented by introducing a mesogenic group thereto, and the like have been proposed (see, for example, Patent Document 1 and Patent Document 2).[Patent Document 1] Japanese Patent Application Laid-Open (JP-A) No. 2004-225034[Patent Document 2] Japanese Patent ...

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Номер записи: 26

02-01-2020 дата публикации

RESIN COMPOSITION, MOLDED ARTICLE, LAMINATE, COATING MATERIAL, AND ADHESIVE

Номер: US20200002465A1

Автор: Aizawa Takafumi, Ebina Takeo, Harada Tomoaki, Ishii Ryo, Nakashima Michiya, Usami Yusho

Принадлежит:

A resin composition contains an epoxy compound and a smectite with partially immobilized lithium. 1. A resin composition comprising an epoxy compound and a smectite with partially immobilized lithium.2. The resin composition according to claim 1 , wherein the epoxy compound has an epoxy equivalent weight of 50 to 3000 g/eq.3. The resin composition according to claim 1 , wherein the epoxy compound has at least one structure of an aromatic ring structure and an aliphatic ring structure.4. The resin composition according to claim 1 , wherein the smectite with partially immobilized lithium has a cation exchange capacity of 1 to 70 meq/100 g.5. The resin composition according to claim 1 , further comprising at least one curing agent.6. The resin composition according to claim 5 , wherein the curing agent is at least one curing agent selected from the group consisting of acid anhydride-based curing agents claim 5 , phenolic curing agents claim 5 , and amide-based curing agents.7. The resin composition according to claim 1 , wherein the smectite with partially immobilized lithium is present in an amount of 3% to 70% by mass based on total nonvolatile content of the resin composition.8. An article molded from a resin composition according to .9. A laminate comprising a substrate and a molded article according to on the substrate.10. A gas barrier material comprising a resin composition according to .11. A coating material comprising a resin composition according to .12. An adhesive comprising a resin composition according to . The present invention relates to a resin composition, a molded article, a laminate, a coating material, and an adhesive.Packaging materials used to package food or similar things are required to have functions such as the protection of their contents, retort resistance, heat resistance, transparency, and workability. To keep the contents in good condition, gas barrier properties are particularly important. Recently, not only packaging materials but ...

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Номер записи: 27

02-01-2020 дата публикации

LOW DIELECTRIC CONSTANT POROUS EPOXY-BASED DIELECTRIC

Номер: US20200002497A1

Автор: Engler Anthony, Jiang Jisu, Kohl Paul A., Phillips Oluwadamilola, SCHWARTZ JARED

Принадлежит:

Disclosed herein are compositions comprising an epoxy-functionalized sacrificial polymer, wherein the sacrificial polymer decomposes into one or more gaseous decomposition products at a temperature of 180° C. or less for a period of time of 24 hrs or less. Also disclosed are compositions comprising a copolymer derived from an epoxy resin; an epoxy-functionalized sacrificial polymer; and optionally a crosslinker. The epoxy-functionalized sacrificial polymer can be derived from a polycarbonate. Methods of preparing the copolymers described herein are also disclosed. Porous films derived from the copolymers described herein, wherein a majority of the sacrificial polymer in the composition has been degraded to form pores in the porous film are also disclosed. 1. A composition comprising a copolymer derived from:a) an epoxy resin;b) an epoxy-functionalized sacrificial polymer; andc) optionally a crosslinker.2. A composition comprising a copolymer derived from:a) an epoxy resin;b) a polycarbonate sacrificial polymer; andc) optionally a crosslinker.3. The composition of claim 1 , wherein the sacrificial polymer is derived from a polycarbonate claim 1 , a polyaldehyde claim 1 , a polysulfone claim 1 , a polynobornene claim 1 , a polycarbamate claim 1 , or a combination thereof.5. (canceled)6. (canceled)7. The composition of claim 1 , wherein the sacrificial polymer has a molecular weight of from 1 claim 1 ,000 Da to 10 claim 1 ,000 Da.8. (canceled)9. The composition of claim 1 , wherein the sacrificial polymer is present in an amount of from 5% to 35% claim 1 , based on the total weight of the polymers in the composition.10. (canceled)11. The composition of claim 1 , wherein the optional crosslinker is present and comprises an amine claim 1 , mercaptan claim 1 , or an anhydride functional group.12. (canceled)13. (canceled)15. (canceled)16. (canceled)18. A method of preparing a copolymer according to comprising:(i) blending an expoxidized sacrificial polymer with an epoxy ...

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Номер записи: 28

03-01-2019 дата публикации

LIQUID COMPOSITION FOR A WATERPROOFING MEMBRANE

Номер: US20190002627A1

Автор: BECQUET Jeremy, MAYER Andre

Принадлежит: BOSTIK SA

The invention relates to a liquid bi-component composition comprising a silylated polymer having alkoxysilane functions, an epoxy resin, an amine catalyst for the epoxy and a catalyst for silanol condensation, and an adhesion promoter or a coupling agent. After crosslinking, the liquid composition according to the invention makes it possible to obtain a waterproofing membrane suitable for pedestrian and/or vehicle traffic. 3. The liquid composition as claimed in claim 1 , wherein the catalyst (A2-1) comprises at least one phenolic ring substituted by at least two —(CH)—N(CH)functions claim 1 , these two —(CH)—N(CH)functions preferably being in the ortho position to the OH group.5. The liquid composition as claimed in claim 1 , wherein the catalyst (A2-2) different from the catalyst (A2-1) is chosen from the aromatic compounds comprising at least one hydroxyl function or at least one —(CH)—N(CH)function.7. The liquid composition as claimed in claim 1 , wherein the catalyst (A2) comprises a mixture of 2 claim 1 ,4 claim 1 ,6-tri(dimethylaminomethyl)phenol as catalyst (A2-1) and of dimethylbenzylamine as catalyst (A2-2).9. The liquid composition as claimed in claim 1 , wherein the epoxy resin (B1) is derived from diglycidyl ether claim 1 , preferably a derivative of bisphenol A diglycidyl ether.10. The liquid composition as claimed in claim 1 , wherein the coupling agent (A3) is a bifunctional compound comprising at least one first function capable of reacting with the silylated polymer (A1) and one second function capable of reacting with the epoxy resin (B1).11. A ready-to-use kit comprising the liquid composition as claimed in claim 1 , the compositions A and B being packaged in two separate compartments.12. The use of the liquid composition as claimed in claim 1 , or of the kit as claimed in for the formation of a waterproofing membrane.13. A waterproofing membrane obtained by crosslinking the liquid composition as claimed in .14. A process for waterproofing a ...

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Номер записи: 29

03-01-2019 дата публикации

EPOXY-FIBER REINFORCED COMPOSITES, METHOD TO FORM THE COMPOSITES AND EPOXY RESIN COMPOSITION USED THEREFOR

Номер: US20190002686A1

Автор: Balijepalli Bharati, Bank David H., Schmitt Adam K, Schneider Daniel

Принадлежит:

A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite. 1. An epoxy resin composition comprisingAn epoxy resin comprised of at least one solid epoxy resin;a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers;an epoxy hardener; andan epoxy soluble latent catalyst.2. The epoxy resin composition of claim 1 , wherein the epoxy hardener is dicyandiamide particles having a particle distribution in which 98 percent of the dicyandiamide particles have a diameter less than 10 microns claim 1 , and at least 35% of the dicyandiamide particles have a particle size of less than 2 microns.3. The epoxy resin composition of claim 1 , wherein the epoxy resin is further comprised of a liquid epoxy resin and the solid epoxy resin is comprised of an epoxy resin containing oxazolidone.4. The epoxy resin composition of claim 3 , wherein the solid epoxy resin comprises from 19 to 54 weight percent claim 3 , the amount of liquid epoxy resin is from 11 to 61 weight percent based on the total weight of all epoxy resin components in the epoxy resin composition.5. The epoxy resin composition of claim 3 , wherein the liquid epoxy resin is comprised of at least one of a diglycidyl ether of bisphenol A and an epoxy novolac resin.6. ...

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Номер записи: 30

02-01-2020 дата публикации

RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT

Номер: US20200004145A1

Автор: Fujimura Makoto

Принадлежит: ZEON CORPORATION

Provided is a radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2). 1. A radiation-sensitive resin composition comprising:a cycloolefin polymer (A-1) including a protonic polar group;a cycloolefin polymer (A-2) including a protonic polar group;a difunctional epoxy compound (B); anda radiation-sensitive compound (C), whereinthe cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000, andcontent of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).3. The radiation-sensitive resin composition according to claim 1 , wherein content of the difunctional epoxy compound (B) is 150 parts by mass or more per 100 parts by mass of the cycloolefin polymer (A-2).4. The radiation-sensitive resin composition according to claim 1 , further comprising either or both of a compound including at least two alkoxymethyl groups and a compound including at least two methylol groups.5. The radiation-sensitive resin composition ...

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Номер записи: 31

20-01-2022 дата публикации

ROOM TEMPERATURE STABLE ONE-PART VOID FILLER

Номер: US20220017684A1

Автор: Elgimiabi Sohaib, Neuroth Frank

Принадлежит:

A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms. 1. A curable void filler composition comprising:(a) at least one epoxy resin;(b) at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; {'br': None, 'Glycidoxy-R1Si(OR2)(OR3)(OR4)\u2003\u2003formula (1)'}, '(c) at least one epoxysilane compound according to formula (1)'}whereinR1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms;R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.2. The curable void filler composition according to claim 1 , wherein R1 of the at least one epoxysilane compound is selected from linear or branched ethyl claim 1 , propyl claim 1 , butyl claim 1 , pentyl claim 1 , hexyl claim 1 , heptyl and octyl.3. The curable void filler composition according to claim 1 , wherein R2 claim 1 , R3 claim 1 , and R4 of the at least one epoxysilane compound are independently selected from linear or branched ethyl claim 1 , propyl claim 1 , butyl claim 1 , pentyl claim 1 , hexyl claim 1 , heptyl and octyl.4. The curable void filler composition according to claim 1 , wherein the at least one epoxysilane compound is contained in an amount of from 0.1 to 20 wt.-%.5. The curable void filler composition according to claim 1 , wherein the at least one bicyclic carboxylic acid anhydride is a sterically hindered bicyclic compound.6. The curable void filler composition according to claim 5 , wherein the at ...

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Номер записи: 32

12-01-2017 дата публикации

CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND WAFER LEVEL LENS

Номер: US20170009003A1

Автор: ISHIDA Kyohei, Takenaka Hiroki

Принадлежит: Daicel Corporation

Provided is a curable composition that is rapidly cured to form a cured product. The cured product resists yellowing, successfully maintains excellent transparency over a long time even in a high-temperature environment, and is advantageously usable as or in a wafer-level lens. The curable composition according to the present invention includes a cycloaliphatic epoxide (A), a siloxane compound (B), and a curing agent (C). The cycloaliphatic epoxide (A) is represented by Formula (1). The siloxane compound (B) contains two or more glycidyl groups per molecule. In the formula, X is selected from a single bond and a linkage group. 2. The curable composition according to claim 1 ,wherein the cycloaliphatic epoxide (A) comprises at least one of bis(3,4-epoxycyclohexylmethyl) ether and 2,2-bis(3,4-epoxycyclohex-1-yl)propane.3. The curable composition according to claim 1 ,wherein the curable composition comprises the cycloaliphatic epoxide (A) in a content of 5 to 70 weight percent based on the total amount (100 weight percent) of the curable composition.4. The curable composition according to claim 1 , for a wafer-level lens.5. A cured product of the curable composition according to .6. A method for producing a wafer-level lens claim 1 , the method comprising{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'subjecting the curable composition according to to molding.'}7. A wafer-level lens obtained by the method according to for producing a wafer-level lens.8. A camera comprising{'claim-ref': {'@idref': 'CLM-00007', 'claim 7'}, 'the wafer-level lens according to .'}9. The curable composition according to claim 2 ,wherein the curable composition comprises the cycloaliphatic epoxide (A) in a content of 5 to 70 weight percent based on the total amount (100 weight percent) of the curable composition.10. The curable composition according to claim 2 , for a wafer-level lens.11. The curable composition according to claim 3 , for a wafer-level lens.12. A cured product of the ...

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Номер записи: 33

12-01-2017 дата публикации

CURING METHOD FOR POLYETHER

Номер: US20170009004A1

Автор: CUNLIFFE Anthony Vernon, TOD David Arthur, TORRY Simon Andrew

Принадлежит:

This invention relates to a novel curing method of oligomers, using metal triflates, and particularly to the curing of hydroxyl terminated elastomers to achieve crosslinked polymers. The method finds particular use as an alternative cure methodology to replace isocyanate curing. There is further provided a cured and crosslinked polymer binder, which is particularly suitable and compatible for use with energetic materials. 125.-. (canceled)27. A method according to claim 26 , wherein at least one of the at least one hydroxy terminated oligomer and the at least one epoxy terminated oligomer comprises at least 5 to 10% w/w of an oligomer which has 3 to 5 functional groups selected from the group consisting of hydroxyl and epoxy functional groups.27. A method according to claim 26 , wherein the admixture comprises a further epoxy terminated oligomer claim 26 , which contains an average of 2.5 to 4 epoxy groups per oligomer chain claim 26 , and is present in the range of from 5-10% w/w.28. A method according to wherein the metal of the at least one metal catalyst is a lanthanide or group III metal.29. A method according to wherein the metal of the at least one metal catalyst is scandium or yttrium.30. A method according to claim 26 , wherein the curing step is carried out in the temperature range of from 40 to 85° C.31. A method according to claim 30 , wherein the curing step is carried out in the temperature range of from 40 to 60° C.32. A method according to claim 26 , wherein the catalyst is added to the admixture in a minimum quantity of a volatile solvent claim 26 , wherein said solvent is removed prior to curing the admixture.33. A method according to claim 26 , wherein the admixture is formed in the substantial absence of solvent.34. A method according to wherein the catalyst is present in an amount of from 0.01% to 2% by mass of the reaction mixture.35. A method according to wherein the admixture further comprises at least one filler material.36. A method ...

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Номер записи: 34

12-01-2017 дата публикации

FURAN-BASED AMINES AS CURING AGENTS FOR EPOXY RESINS IN LOW VOC APPLICATIONS

Номер: US20170009005A1

Автор: SCHÄFFELER Nina, Urban Claus

Принадлежит: SIKA TECHNOLOGY AG

A room temperature or low temperature curable epoxy formulation including a) an epoxy component including at least one epoxy resin and b) a hardener component including at least one compound of formula (I) 3. The room temperature or low temperature curable epoxy formulation according to claim 2 , wherein claim 2 , in formula (II) claim 2 , Rand Rare both H (IIa); Ris H and Ris methyl (IIb); Ris H and Ris Phenyl (IIc); Rand Rare both methyl (IId); Ris methyl and Ris ethyl (IIe); or Ris methyl and Ris isobutyl (IIf).4. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation has a TVOC content after 3 days (TVOC) of less than 50 mg/m claim 1 , when measured as defined in the AgBB evaluation scheme of 2010.5. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation has a benzyl alcohol content of less than 5% by weight.6. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the amine hydrogen to epoxy equivalent ratio is 0.8 to 1.2.7. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the hardener component further comprises at least one further polyamine claim 1 , and/or at least one epoxy-amine adduct thereof claim 1 , and/or at least one accelerator.8. The room temperature or low temperature curable epoxy formulation according to claim 1 , wherein the epoxy formulation is an epoxy coating composition claim 1 , an epoxy flooring material claim 1 , an epoxy adhesive claim 1 , an epoxy grout or potting material claim 1 , an epoxy sealant claim 1 , a waterproofing coating composition or an epoxy composite material.911-. (canceled)12. A method for coating or adhering substrates or for preparing composites using a room temperature or low temperature curable epoxy formulation according to claim 1 , the method comprisinga) mixing the epoxy component and the ...

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Номер записи: 35

12-01-2017 дата публикации

Resin composition, backing material for ultrasonic vibrator, ultrasonic vibrator, and ultrasonic endoscope

Номер: US20170009072A1

Автор: Koji Kobayashi, Kunihisa Obi, Takae Hayashi

Принадлежит: Olympus Corp

A resin composition of the present invention contains: an epoxy resin (A); a hardener (B); and an ion exchanger (C). At least one of the epoxy resin (A) and the hardener (B) contains a modified silicone (S), and the epoxy resin (A) is at least one type selected from the group consisting of a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, and an epoxy-modified silicone.

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Номер записи: 36

08-01-2015 дата публикации

ELECTRICAL INSULATING RESIN BASED ON ISOHEXIDEDIOL DIGLYCIDYL ETHERS

Номер: US20150010697A1

Автор: Baumgarten Gunther, LIENERT Klaus-Wilhelm, Soncini Giancarlo

Принадлежит: Elantas GmbH

Electrical insulating resin comprising 113-. (canceled)14. A method of use of an electrical insulating resin comprisingA) isohexidediol diglycidyl etherB) a hardenerC) an optional fillerD) further optional additives,comprising the step of introducing the electrical insulating resin, into the windings of an electrical machine by dipping, dip rolling, trickling, pouring, vacuum or vacuum-pressure impregnation, followed by therman curing.15. A method of use according to claim 14 , characterized in that the isohexidediol diglycidyl ether is an isosorbide diglycidyl ether claim 14 , isomannide diglycidyl ether or isoidide diglycidyl ether.16. A method of use according to claim 14 , characterized in that the hardener B) comprises one or more dicarboxylic or dicarboxylic anhydrides.17. A method of use according to claim 16 , characterized in that the hardener B) comprises methyltetrahydrophthalic anhydride or methylhexahydrophthalic anhydride.18. A method of use according to claim 14 , characterized in that the resin comprises a reaction accelerator.19. A method of use according to claim 14 , characterized in that the resin comprises a filler.20. A method of use according to claim 19 , characterized in that the filler is selected from the group consisting of dolomite claim 19 , chalk claim 19 , fused silica claim 19 , quartz flour claim 19 , aluminium hydroxide claim 19 , magnesium hydroxide and mixtures thereof.21. A method of use according to claim 14 , characterized in that the hardener B) comprises a Lewis acid.22. A method of use according to claim 21 , characterized in that the hardener B) comprises a boron trichloride-amine complex.23. A method of use according to for impregnating electrical machines.24. A method of use for impregnating high-voltage electrical machines.25. A method of use according to for encapsulating transformers claim 14 , coils claim 14 , for fully encapsulating electric motors and for producing high-voltage insulators.26. A method of use ...

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Номер записи: 37

27-01-2022 дата публикации

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

Номер: US20220025106A1

Автор: Kato Hirofumi, Takeuchi Kenichi

Принадлежит: Sumitomo Chemical Company, Limited

An epoxy resin composition and a cured product thereof are provided, the epoxy resin composition comprising an epoxy resin (A), a curing agent (B) comprising a compound represented by the following formula (B-1) (wherein Rrepresents a hydrogen atom, a halogen atom, a methoxy group or a hydrocarbon group having 1 to 12 carbon atoms), and an imidazole adduct-type curing accelerator (C), wherein the molar ratio of the content of a phenolic hydroxide group to the content of an epoxy group in the epoxy resin composition is 0.25 to 0.67. 2. The epoxy resin composition according to claim 1 , wherein the epoxy resin (A) comprises an epoxy resin having two epoxy groups in one molecule.3. The epoxy resin composition according to claim 1 , wherein the compound has a melting point of 150° C. or less.4. The epoxy resin composition according to claim 1 , wherein the molar ratio is 0.35 to 0.5.6. A cured product of an epoxy resin composition according to .7. A prepreg claim 1 , comprising an epoxy resin composition according to claim 1 , and a fiber.8. A composition claim 1 , comprising a cured product of an epoxy resin composition according to claim 1 , and a fiber. The present invention relates to an epoxy resin composition and a cured product thereof.Epoxy resins are applied to various applications such as for fiber reinforcing materials, electronic components, adhesive agents, coating materials and the like since cured products thereof are excellent in heat resistance, strength, chemical resistance, adhesiveness and the like.In various applications, compositions containing an epoxy resin (hereinafter, referred to as “epoxy resin compositions”) usually contain a curing agent to cure the compositions, and in some cases, further contain a curing accelerator (for example, Japanese Patent Laid-Open No. 2015-083634 (Patent Literature 1) and Japanese Patent Laid-Open No. 2013-032510 (Patent Literature 2)).For the epoxy resin compositions, properties according to applications thereof ...

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Номер записи: 38

27-01-2022 дата публикации

ADDITIVES FOR WINTERIZATION OF PARAFFIN INHIBITORS

Номер: US20220025245A1

Автор: Baron Holly, Felipe Mary Jane Legaspi, Mangadlao Joey Dacula, ZHANG LEI

Принадлежит: Baker Hughes Oilfield Operations LLC

A winterized paraffin inhibitor, which is capable of being used for preventing the deposition of paraffins in hydrocarbon streams and capable of withstanding freezing or crystallization at freezing or sub-freezing temperatures, may be formed by adding an oxyalkylated branched aliphatic compound having 12 or more carbons to a high molecular weight aliphatic polymer paraffin inhibitor, the oxyalkylated branched aliphatic compound having 12 or more carbons being produced by the oxyalkylation of the branched aliphatic compound having 12 or more carbon atoms in which the branched aliphatic compound having 12 or more carbon atoms is grafted with a polyether via a ring-opening reaction, wherein the polyether is a polymer of ethylene oxide, propylene oxide, butylene oxide, and combinations thereof. 1. A method for winterizing a paraffin inhibitor , the method comprising:introducing an oxyalkylated linear or branched aliphatic compound having 12 or more carbon atoms into a paraffin inhibitor composed of a high molecular weight aliphatic polymer in an amount effective to therebypreventing the freezing or crystallization of the paraffin inhibitor at temperatures ranging from about 0° C. to −40° C.2. The method of claim 1 , wherein the oxyalkylated linear or branched aliphatic compound is formed by the oxyalkylation of a linear or branched aliphatic compound having 12 or more carbon atoms.3. The method of claim 2 , wherein the linear or branched aliphatic compound having 12 or more carbon atoms is a branched aliphatic compound comprising branches containing functional groups having 2 to 28 carbon atoms.4. The method of claim 3 , wherein the branched aliphatic compound having 12 or more carbon atoms comprises branches containing functional groups selected from the group consisting of alkyl groups claim 3 , arylalkyl groups claim 3 , cycloalkyl groups claim 3 , and combinations thereof.5. The method of claim 2 , wherein the linear or branched aliphatic compound having 12 or more ...

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Номер записи: 39

11-01-2018 дата публикации

CATALYTIC SYSTEMS FOR THERMOSETTING RESINS WHICH ARE DEFORMABLE IN THE THERMOSET STATE

Номер: US20180009912A1

Автор: DUQUENNE Christophe, Leibler Ludwik, Melas Michel

Принадлежит:

The invention relates to a composition containing at least one catalyst (C1) containing at least one atom of an element (M1) chosen from: Al, Sc, Ti, Mg, Mn, Fe, Co, Ni, Cu, Zn, Zr, Sn, Hf, Pb, Si, Sb and In; a catalyst (C2) comprising at least one atom of an element (M2) chosen from alkali metals and alkaline-earth metals; a thermosetting resin and/or a hardener for a thermosetting resin. The invention also relates to the use of this composition for rendering a resin which is in the thermoset state hot-deformable and nevertheless free of any residual stress after the deformation thereof; such a resin will advantageously retain its shape even if it is subsequently subjected to high temperatures. The invention relates, moreover, to kits for preparing the composition, to a thermoset-resin-based object obtained from a composition of the invention, to a process for manufacturing objects, to a process for hot-deformation of objects and to various possible uses of the compositions and objects of the invention. 121.-. (canceled)22. A composition comprising at least:a catalyst (C1) comprising at least one atom of an element (M1) selected from the group consisting of: Ti, Zn, Zr, and Bi,a catalyst (C2) comprising at least one atom of an element (M2) selected from the group consisting of alkali metals and alkaline-earth metals, andat least one thermosetting resin wherein the thermosetting resin comprises at least one epoxide function and optionally at least one free hydroxyl and/or ester function, andat least one thermosetting resin hardener, wherein the thermosetting resin hardener is selected from the group consisting of carboxylic acids comprising at least two —C(O)OH functions, carboxylic acid anhydrides comprising at least one —C(O)—O—C(O)— function, and mixtures thereof;wherein catalyst (C1) and catalyst (C2) are each present in amounts effective to provide a weight ratio of catalyst (C1) : catalyst (C2) of from 1:10 to 10:1, (C1) and (C2) being present in the ...

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Номер записи: 40

11-01-2018 дата публикации

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

Номер: US20180009935A1

Автор: HIRAMATSU Sotaro, Kobayashi Takashi, Takano Kentaro

Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1): 2. The resin composition according to claim 1 , comprising 1 to 90% by mass of the epoxy resin (B) represented by the general formula (1) based on a total amount (100% by mass) of resin solids in the resin composition.3. The resin composition according to claim 1 , further comprising a filler (C).4. The resin composition according to claim 1 , further comprising one or two or more selected from the group consisting of an epoxy resin other than the epoxy resin (B) represented by the general formula (1) claim 1 , a maleimide compound claim 1 , a phenolic resin claim 1 , an oxetane resin claim 1 , a benzoxazine compound claim 1 , and a compound having a polymerizable unsaturated group.5. The resin composition according to claim 3 , comprising 50 to 1600 parts by mass of the filler (C) based on the total amount (100 parts by mass) of the resin solids in the resin composition.6. A prepreg comprising a base material; and the resin composition according to with which the base material is impregnated or coated.7. A metal foil-clad laminate comprising one of the prepreg according to ; and metal foil laminate-molded on one surface or both surfaces of the prepreg.8. A resin sheet comprising a sheet base material; and the resin composition according to applied and dried on one surface or both surfaces of the sheet base material.9. A printed wiring board comprising an insulating layer comprising the resin composition according to ; and a conductor layer formed on one surface or both surfaces of the insulating layer.10. A metal foil-clad laminate comprising two or more of the prepregs according to laminated; and metal foil laminate-molded on one surface or both surfaces of the prepreg. The present invention relates to a resin composition, a prepreg, a metal foil-clad laminate, a resin sheet, and a printed wiring board.In recent years, ...

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Номер записи: 41

11-01-2018 дата публикации

THERMOSETTING RESIN COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, AND ELECTRONIC COMPONENT

Номер: US20180009983A1

Автор: DEYAMA Yoshihiro, Hirota Takayuki, ITAMI SETSUO, MOROKOSHI Shinta, MUROTANI Atsushi, SUGIHARA Katsuyuki, Takahashi Toshiyuki

Принадлежит:

Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition. 1. A thermosetting resin composition , comprising polyester amide acid (A) , epoxy compound (B) having a fluorene skeleton , epoxy curing agent (C) and colorant (D).2. The thermosetting resin composition according to claim 1 , wherein an epoxy equivalent in epoxy compound (B) having the fluorene skeleton is 200 to 550 g/eq.3. The thermosetting resin composition according to claim 1 , comprising epoxy curing agent (C) in an amount of 1 to 380 parts by weight based on 100 parts by weight of epoxy compound (B) having the fluorene skeleton.4. The thermosetting resin composition according to claim 1 , comprising epoxy compound (B) having the fluorene skeleton in an amount of 10 to 400 parts by weight based on 100 parts by weight of polyester amide acid (A).5. The thermosetting resin composition according to claim 1 , wherein epoxy curing agent (C) is an anhydride curing agent.6. The thermosetting resin composition according to claim 1 , wherein a weight average molecular weight of polyester amide acid (A) is 2 claim 1 ,000 to 30 claim 1 ,000.8. The thermosetting resin composition according claim 1 , wherein polyester amide acid (A) is a compound obtained by allowing tetracarboxylic dianhydride (a1) claim 1 , diamine (a2) and polyvalent hydroxy compound (a3) to react thereamong as essential components.9. The thermosetting resin composition according to claim 1 , wherein polyester amide acid (A) is a compound obtained by allowing tetracarboxylic dianhydride (a1) claim 1 , diamine (a2) claim 1 , polyvalent hydroxy compound (a3) and monohydric alcohol (a4) to react ...

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Номер записи: 42

14-01-2021 дата публикации

CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT SUBSTRATE, INTERLAYER INSULATING MATERIAL, AND PRINTED WIRING BOARD

Номер: US20210009749A1

Автор: BABA Susumu, HAYASHI Tatsushi, KAWAHARA Yuko, OATARI Yuta, SHINDO Masami, SHINJO Takashi, Takeda Kohei, WAKIOKA Sayaka

Принадлежит: Sekisui Chemical Co., Ltd.

A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided. 1. A curable resin composition comprising:a curable resin; anda curing agent containing an imide oligomer,the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less.2. The curable resin composition according to claim 1 ,wherein the aliphatic diamine residue and/or the aliphatic triamine residue are/is an aliphatic diamine residue and/or an aliphatic triamine residue derived from a dimer acid and/or a trimer acid.3. The curable resin composition according to claim 1 ,wherein the proportion of the aliphatic diamine residue and/or aliphatic triamine residue in the polyvalent amine residues contained in the entire imide oligomer is 5 mol % or more.4. The ...

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Номер записи: 43

10-01-2019 дата публикации

Methods for coating inner surfaces of pipes and coatd pipes formed thereby

Номер: US20190010352A1

Автор: Ian Robinson, Martin A. Hutchinson

Принадлежит: 3M Innovative Properties Co

Methods of coating an inner surface of a pipe and the pipes coated thereby; the methods including mixing a first composition with a second composition to form a coating composition, the first composition including epoxy resin and diluent; and the second composition including a curing agent, the curing agent including a phenalkamide curing agent; and applying the coating composition to the inner surface of the pipe.

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Номер записи: 44

09-01-2020 дата публикации

Epoxy tannin reaction product compositions

Номер: US20200010664A1

Автор: Jeffrey Paul Youngblood, John A. Howarter, Matthew N. Korey

Принадлежит: PURDUE RESEARCH FOUNDATION

The present application generally relates to epoxy/tannin reaction product compositions, and methods of making and using the epoxy tannin reaction product compositions. The epoxy/tannin reaction product compositions are hardened thermosetting polymeric materials, are substantially homogeneous and substantially free of visible clumps, and have a glass transition temperature of at least 140° C.

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Номер записи: 45

15-01-2015 дата публикации

RESIN COMPOSITION FOR PRINTED WIRING BOARD MATERIAL, AND PREPREG, RESIN SHEET, METAL FOIL CLAD LAMINATE, AND PRINTED WIRING BOARD USING SAME

Номер: US20150014032A1

Автор: Hasebe Keiichi, Kashima Naoki, Mabuchi Yoshinori, SHIKA Seiji

Принадлежит:

A resin composition forms a roughened surface with low roughness on an insulating layer regardless of roughening conditions when used as an insulating layer of a printed wiring board, and is excellent in adhesion between the insulating layer and a plated conductor layer, and also has low thermal expansion coefficient (linear expansion coefficient) and high glass transition temperature and is also excellent in moist heat resistance. The resin composition includes an epoxy compound, a cyanate ester compound and an inorganic filler, wherein the cyanate ester compound is at least selected from a naphthol aralkyl type cyanate ester compound, an aromatic hydrocarbon formaldehyde type cyanate ester compound, a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound; and the content of the epoxy compound is 60 to 75% by weight based on the total amount of the epoxy compound and the cyanate ester compound. 1. A resin composition which is used as a material of an insulating layer of a printed wiring board including the insulating layer , and a conductor layer formed by plating on a surface of the insulating layer , comprising an epoxy compound (A) , a cyanate ester compound (B) and an inorganic filler (C) , wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound , an aromatic hydrocarbon formaldehyde type cyanate ester compound , a biphenyl aralkyl type cyanate ester compound and a novolak type cyanate ester compound , and the content of the epoxy compound (A) is 60 to 75% by weight based on the total amount of the epoxy compound (A) and the cyanate ester compound (B).2. The resin composition according to claim 1 , wherein the cyanate ester compound (B) is at least one selected from the group consisting of a naphthol aralkyl type cyanate ester compound claim 1 , an aromatic hydrocarbon formaldehyde type cyanate ester compound and a biphenyl aralkyl type cyanate ...

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Номер записи: 46

03-02-2022 дата публикации

Curing agent composition for an epoxy resin compound, epoxy resin compound and multi-component epoxy resin system

Номер: US20220033570A1

Автор: BEHRENS Nicole

Принадлежит: Hilti Aktiengesellschaft

A curing agent composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. Methods for the chemical fastening of construction elements in boreholes and the use of a salt (S) as an accelerator in an epoxy resin compound for chemical fastening are provided, the epoxy resin compound including a benzoxazine-amine adduct and an amine which is reactive to epoxy groups. 2: The curing agent composition according to claim 1 , wherein Rand Reach represent H.3: The curing agent composition according to claim 1 , wherein Z is selected from the group consisting of a direct bond claim 1 , —C(R)(R)— claim 1 , —C(R)(aryl)- claim 1 , —C(O)— claim 1 , —S— claim 1 , —O— claim 1 , —S(O)— claim 1 , —S(O)— claim 1 , a divalent heterocycle and —[C(R)(R)]-arylene-[C(R)(R)]— claim 1 , where m and n are each independently between 0 and 5.4: The curing agent composition (B) according to claim 1 , wherein Rand Reach represent H claim 1 , and wherein Z is selected from a direct bond or —C(R)(R)— claim 1 , where Rand Rare each independently selected from H or C-Calkyl groups claim 1 , or together form a lactone group.6: The curing agent composition according to claim 1 , wherein the amine reactive to epoxy groups is selected from the group consisting of 2 claim 1 ,2 claim 1 ,4- or 2 claim 1 ,4 claim 1 ,4-trimethyl-1 claim 1 ,6-diaminohexane and mixtures thereof claim 1 , 3-aminomethyl-3 claim 1 ,5 claim 1 ,5-trimethylcyclohexane (IPDA) claim 1 , 1 claim 1 ,3-bis(aminomethyl)-cyclohexane (1 claim 1 ,3-BAC) claim 1 , 1 claim 1 ,4-bis(aminomethyl)-cyclohexane (1 claim 1 ,4-BAC) claim 1 , 2-methyl-1 claim 1 ,5-pentanediamine (DYTEK A) claim 1 , (3(4) claim 1 ,8(9)bis(aminomethyl)dicyclo[5.2.1.02 claim 1 ,6]decane and isomer mixtures thereof (TCD-diamine) claim 1 , aminomethyltricyclo[5.2.1.02.6]decane and isomer mixtures thereof (TCD-amine) claim 1 , 1 claim 1 ,6-hexamethylene ...

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Номер записи: 47

03-02-2022 дата публикации

EPOXY RESIN COMPOSITIONS, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIALS

Номер: US20220033640A1

Автор: Arai Nobuyuki, Hughes Jonathan, Tun Swezin Than

Принадлежит: Toray Industries, Inc.

An epoxy resin composition is provided which includes a poly-naphthalene-based epoxy resin having two or more epoxy groups per molecule combined with a non-linear multi-phenyl epoxy resin and an additional epoxy resin having an epoxy functionality of 3 or more, as well as a prepreg, and a fiber-reinforced composite material prepared using the epoxy resin composition. More specifically, an epoxy resin composition is provided which contains a combination of particular types of epoxy resins and curatives that, when cured, provides high flexural modulus and that is suitable for preparing a fiber-reinforced composite material capable of withstanding extreme use environments such as low-temperature environments and high-temperature moisture-absorbing environments. In addition, epoxy resin systems are provided which are capable of achieving a high Tg along with good thermal stability for long periods of time at elevated temperatures (e.g., 180° C. or more) when cured at 210° C. for 2 hours. 1. An epoxy resin composition for a fiber-reinforced composite material comprising component (A) , component (B) , component (C) , and component (D) , wherein the epoxy resin composition when cured has a weight loss of less than 1.0% when thermally soaked at 180° C. for 1000 hours , and wherein:component (A) comprises at least one poly-naphthalene-based epoxy resin;component (B) comprises at least one non-linear multi-phenyl epoxy resin in a total amount of from 10 to 35 PHR per 100 PHR of total epoxy resin;component (C) comprises at least one epoxy resin having an epoxy functionality of at least three which is neither a poly-naphthalene-based epoxy resin nor a non-linear multi-phenyl epoxy resin; andcomponent (D) comprises at least one amine curing agent.3. The epoxy resin composition according to claim 1 , wherein component (B) comprises at least one non-linear multi-phenyl epoxy resin having a structure corresponding to Formula (II):{'br': None, 'sup': 1', '2, 'X—C(Y)(Z)—X\u2003\ ...

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Номер записи: 48

10-01-2019 дата публикации

Metal-clad laminate, metal member with resin, and wiring board

Номер: US20190014661A1

Автор: Tatsuya Arisawa, Yuki Inoue, Yuki Kitai

Принадлежит: Panasonic Intellectual Property Management Co Ltd

The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 μm or less.

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Номер записи: 49

19-01-2017 дата публикации

OXAZOLIDONE RING CONTAINING ADDUCTS

Номер: US20170015778A1

Автор: Gan Joseph, Trottier Emile C.

Принадлежит:

Embodiments include oxazolidone ring containing adducts obtainable by combining an aliphatic epoxy compound, an aromatic epoxy compound, and a diisocyanate. Embodiments further include a curable powder coating composition including a resin component and a hardener component, where the resin component includes the oxazolidone ring containing adduct. 1. An oxazolidone ring containing adduct obtainable by combining:an aliphatic epoxy compound;an aromatic epoxy compound; anda diisocyanate.2. The oxazolidone ring containing adduct of claim 1 , where combining the aliphatic epoxy compound claim 1 , the aromatic compound claim 1 , and the diisocyanate includes a first stage and a second stage.3. The oxazolidone ring containing adduct of claim 1 , where the aliphatic epoxy compound is 20 weight percent (wt %) to 60 wt % of a total weight of the oxazolidone ring containing adduct.4. The oxazolidone ring containing adduct of claim 1 , where the oxazolidone ring containing adduct has an epoxide equivalent weight of 800 grams/equivalent (g/eq) to 1300 g/eq.5. The oxazolidone ring containing adduct of claim 1 , where the aliphatic epoxy compound is selected from the group consisting of a diglycidyl ether of polypropylene glycol claim 1 , 1 claim 1 ,4-butanediol diglycidyl ether claim 1 , 1 claim 1 ,6-hexanediol diglycidyl ether claim 1 , and combinations thereof.6. The oxazolidone ring containing adduct of where the first stage includes adding the aliphatic epoxy compound to the diisocyanate to obtain a first stage adduct.7. The oxazolidone ring containing adduct of where the second stage includes adding the aromatic epoxy compound to the first stage adduct to form the oxazolidone ring containing adduct.8. The oxazolidone ring containing adduct of where the aromatic epoxy compound is 20 wt % to 40 wt % of the total weight of the oxazolidone ring containing adduct.9. The oxazolidone ring containing adduct of where the diisocyanate is 10 wt % to 40 wt % of the total weight of the ...

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Номер записи: 50

18-01-2018 дата публикации

TREATED POROUS MATERIAL

Номер: US20180015635A1

Автор: Chen Xue, Da Cruz Rui Vogt Alves, King Stephen W., Marks Maurice J.

Принадлежит:

A treated cellulosic material comprising a cellulosic material having a porous structure defining a plurality of pores, at least a portion of the pores containing a treating agent comprising a cured low viscosity epoxy resin. The present disclosure further describes a method for preparing a treated cellulosic material comprising (a) providing a cellulosic material; and (b) a first treatment protocol comprising impregnating the cellulosic material with a liquid epoxy resin. 1. A treated cellulosic material comprising: 'a thermoset comprising a cured low viscosity epoxy resin.', 'a cellulosic material having a porous structure defining a plurality of pores, at least a portion of the pores containing a treating agent comprising2. The treated cellulosic material of claim 1 , wherein the treated cellulosic material is prepared by (1) impregnating the cellulosic material with a low viscosity epoxy resin claim 1 , and (2) impregnating the cellulosic material with a modifying agent.3. The treated cellulosic material of any one of - claim 1 , wherein the low-viscosity epoxy resin comprises claim 1 , a divinylarene dioxide comprising any substituted or unsubstituted arene nucleus bearing one or more vinyl groups in any ring position claim 1 , the arene portion of the divinylarene dioxide comprises benzene claim 1 , substituted benzenes claim 1 , (substituted) ring-annulated benzenes or homologously bonded (substituted) benzenes claim 1 , or mixtures thereof.4. The treated cellulosic material of any one of - claim 1 , the epoxy resin comprises claim 1 , a liquid epoxy resin having a viscosity less than or equal to 20 cP at 25° C.5. The treated cellulosic material of any one of - claim 1 , wherein the epoxy resin comprises divinylbenzene dioxide.6. The treated cellulosic material of any one of - claim 1 , wherein the modifying agent is capable of curing the epoxy resin.7. The treated cellulosic material of claim 6 , wherein the modifying agent comprises a catalytic curing agent ...

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Номер записи: 51

03-02-2022 дата публикации

RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE

Номер: US20220035085A1

Автор: FUJII Hironaka, WENG Yufeng

Принадлежит: NITTO DENKO CORPORATION

The present invention relates to a resin composition containing a transparent resin and a light absorber, wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm. 1. A resin composition containing a transparent resin and a light absorber ,wherein a cured product of the resin composition has an absorption maximum wavelength in a wavelength range of 550 to 720 nm.2. The resin composition according to claim 1 , wherein the light absorber is an inorganic pigment that does not have an absorption maximum wavelength in a visible light region.3. The resin composition according to claim 1 , wherein the content of the light absorber is 0.001 to 10% by mass.4. The resin composition according to claim 1 , further containing a dye claim 1 , wherein the dye is at least one selected from dyes having an absorption maximum wavelength in a wavelength range of 550 to 720 nm.5. The resin composition according to claim 1 , further containing a dye claim 1 , wherein the dye is at least one selected from dyes having an absorption maximum wavelength in a wavelength range of 590 to 600 nm.6. The resin composition according to claim 5 , wherein the content of the dye is 0.0005 to 5% by mass.7. The resin composition according to claim 1 , wherein the transparent resin is at least one selected from an epoxy resin and a silicone resin. The present invention relates to a resin composition used in encapsulation and the like of an optical semiconductor element, and an optical semiconductor element and optical semiconductor device using the resin composition.A white optical semiconductor device is conventionally known as an optical semiconductor device that can emit high energy light. For example, a diode substrate supplying electric power to LED, LED (light emitting diode) emitting blue light mounted on the diode substrate, and a phosphor layer that can convert blue light into yellow light and covers LED are provided on the white ...

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Номер записи: 52

21-01-2016 дата публикации

Epoxide-Based Composition

Номер: US20160017087A1

Автор: Boyce Stephen Michael, Lal Gauri Sankar, Patel Pritesh G., Shah Dilipkumar Nandlal

Принадлежит: AIR PRODUCTS AND CHEMICALS, INC.

An epoxide based composition that can be cured at a temperature of less than about 70 C is disclosed. The composition is a liquid at ambient conditions and, therefore, can be used to rehabilitate the interior surfaces of pipelines. The epoxide-based composition comprises at least one epoxide component (component A) and at least one curing agent component (component B) wherein

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Номер записи: 53

18-01-2018 дата публикации

An Epoxy Resin Composition, Prepreg and Laminate Prepared Therefrom

Номер: US20180016387A1

Автор: HE Liexiang, XU Haosheng, Zeng Xianping

Принадлежит:

The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance. 4. The epoxy resin composition according to claim 1 , characterized in that R and R′ are the same.5. The epoxy resin composition according to claim 1 , characterized in that the component (B) active ester curing agent is obtained by reacting a phenolic compound linked via aliphatic cyclic hydrocarbon structure claim 1 , a difunctional carboxylic aromatic compound or an acidic halide with a monohydroxy compound.6. The epoxy resin composition according to claim 1 , characterized in that the epoxy resin composition further comprises cyanate ester resin.7. The epoxy resin composition according to claim 1 , characterized in that the epoxy resin composition further comprises a filler which is an organic filler or/and an inorganic filler.8. A prepreg comprising a reinforcing material and the epoxy resin composition according to attached thereon after impregnation and drying.9. A laminate comprising at least one sheet of the prepreg according to .10. (canceled)11. The epoxy resin composition according to claim 1 , characterized in that the component (A) epoxy resin containing oxazolidinone structure is an epoxy resin containing oxazolidinone structure and having bisphenol-A and/or tetrabromobisphenol-A structure.12. The epoxy resin composition according to claim 1 , characterized in that the component (A) epoxy resin containing oxazolidinone structure and the component (B) active ester curing agent have an epoxide equivalent/ ...

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Номер записи: 54

15-01-2015 дата публикации

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND OPTICAL COMPONENT

Номер: US20150018447A1

Автор: Iwahama Takahiro, Kubo Takashi, Son Tamaki

Принадлежит: Daicel Corporation

Provided is a photosensitive resin composition that is, after being applied to an adherend surface, rapidly cured by photoirradiation to form a cured product having excellent light-shielding ability and adhesiveness (preferably, further having excellent reflow heat resistance). The photosensitive resin composition includes components (A), (C), and (D) and preferably further includes a component (B) as follows: 1. A photosensitive resin composition comprising components as follows:(A) a cationically polymerizable compound at least comprising a compound containing an alicyclic epoxy group and devoid of ester bonds;(C) a photo-cationic polymerization initiator; and(D) a light-shielding material.2. The photosensitive resin composition according to claim 1 , further comprising a component as follows:(B) a hydroxyl-containing compound having a molecular weight of 500 or more.4. The photosensitive resin composition according to claim 2 , wherein the component (B) comprises a hydroxyl-containing compound comprising a skeleton selected from polycarbonate claim 2 , polyester claim 2 , and polydiene skeletons.5. The photosensitive resin composition according to claim 1 , wherein the component (C) comprises at least one compound selected from the group consisting of iodonium salt compounds and sulfonium salt compounds.6. The photosensitive resin composition according to claim 1 , wherein the component (C) comprises a photo-cationic polymerization initiator comprising:a cationic moiety; andan anionic moiety comprising a fluoroalkyl group.8. The photosensitive resin composition according to claim 1 , wherein the component (D) is a carbon black.9. A cured product of the photosensitive resin composition of .10. An optical component comprising the cured product of .12. The photosensitive resin composition according to claim 3 , wherein the component (B) comprises a hydroxyl-containing compound comprising a skeleton selected from polycarbonate claim 3 , polyester claim 3 , and ...

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Номер записи: 55

21-01-2021 дата публикации

Coating Compositions

Номер: US20210017379A1

Автор: Fortman David J., Jr. Marvin M., Kriley Joseph P., Maksimovic Ljiljana, Nakajima Masayuki, Pagnotti Loubna, Pollum, Powell Adam B., Rearick Brian K.

Принадлежит: PPG Industries Ohio, Inc.

Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 μm measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention. 1. A composition , comprising:an epoxy-containing component;elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; anda curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 μm measured by dynamic light scattering.2. The composition of claim 1 , wherein the elastomeric particles are phase-separated from the epoxy-containing component.3. The composition of claim 1 , wherein the epoxy-containing component comprises bisphenol A polyepoxide claim 1 , bisphenol F polyepoxide claim 1 , a novolac resin claim 1 , or combinations thereof.4. The composition of claim 1 , wherein the epoxy-containing component is present in an amount of 45% to 90% by weight based on total weight of the composition.5. The composition of claim 1 , wherein the epoxy-containing component has an average epoxide functionality of greater than 1.0 and less than 3.2.6. The composition of claim 1 , wherein at least 50% by weight of the elastomeric particles comprise a styrene butadiene core based on total weight of the elastomeric particles claim 1 , at least 50% of the ...

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Номер записи: 56

26-01-2017 дата публикации

EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE

Номер: US20170022356A1

Автор: ABE Nobuyuki, KOHARA Kazuyuki, OKOSHI Kodai, YAMAZAWA Tomoya

Принадлежит:

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; (D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and (E) 0.1 to 8 mass % of elastomer, wherein the component (C) and the component (D) are contained by 50.1 to 77 mass % in total. 1. An epoxy resin composition comprising:(A) epoxy resin;(B) a curing agent;(C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less;(D) 47 to 75 mass % of silica filler with an average particle size of 0.3 μm or more and 2 μm or less; and(E) 0.1 to 8 mass % of elastomer, whereinthe component (C) and the component (D) are contained by 50.1 to 77 mass % in total.2. The epoxy resin composition according to claim 1 , wherein at least one of the component (C) and the component (D) is subjected to surface processing with a silane coupling agent.4. The epoxy resin composition according to claim 1 , wherein the component (B) is included by 0.5 equivalents or more and 1.8 equivalents or less relative to 1 equivalent of epoxy group of the component (A).5. The epoxy resin composition according to claim 1 , wherein the component (B) is an acid anhydride curing agent claim 1 , a phenolic resin curing agent claim 1 , or an amine curing agent.6. The epoxy resin composition according to claim 1 , wherein the component (A) includes at least one of bisphenol F epoxy resin claim 1 , bisphenol A epoxy resin claim 1 , naphthalene epoxy resin claim 1 , and aminophenol epoxy resin.7. The epoxy resin composition according to claim 1 , wherein the component (E) includes at least one of butadiene elastomer claim 1 , silicone elastomer claim 1 , acrylic copolymer claim 1 , styrene butadiene elastomer claim 1 , butadiene acrylonitrile 2 claim 1 ,3-epoxypropyl methacrylate divinylbenzene copolymer claim 1 , butadiene acrylonitrile methacrylic ...

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Номер записи: 57

25-01-2018 дата публикации

FLAME-RETARDANT RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, FLAME-RETARDANT ENGINEERING PLASTIC AND COMPOSITE METAL SUBSTRATE

Номер: US20180022898A1

Автор: PAN Qingchong

Принадлежит:

The present invention provides a flame-retardant resin composition, a thermosetting resin composition, a flame-retardant engineering plastic and a composite metal substrate. The flame-retardant resin composition comprises a sulfur-containing flame retardant, a phosphorus-containing flame retardant and/or a nitrogen-containing flame retardant, and a halogen-free epoxy resin. The sulfur-containing flame retardant, phosphorus-containing flame retardant and nitrogen-containing flame retardant in the flame-retardant resin composition of the present invention play a synergistic effect, making the prepared copper clad laminate have good flame retardancy, and also good heat resistance, water resistance, adhesion, mechanical properties and electrical properties, and making the prepared engineering plastic have good flame retardancy and good mechanical properties, and thus the flame-retardant resin composition of the present invention is a kind of flame-retardant composition with large economy and friendly environment. 1. A flame-retardant resin composition , characterized in that the flame-retardant resin composition comprises a sulfur-containing flame retardant , a phosphorus-containing flame retardant and/or a nitrogen-containing flame retardant , and a halogen-free epoxy resin.2. The flame-retardant resin composition of claim 1 , characterized in that the weight percentage of the sulfur element in the flame-retardant resin composition is 5% or less.3. The flame-retardant resin composition of claim 1 , characterized in that the weight percentage of the phosphorus element in the flame-retardant resin composition is 0.1% or higher.4. The flame-retardant resin composition of claim 1 , characterized in that the weight percentage of the nitrogen element in the flame-retardant resin composition is 0.1% or higher.5. The flame-retardant resin composition of claim 1 , characterized in that the sulfur-containing flame retardant is p-benzenedithiol and/or 4 claim 1 ,4′- ...

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Номер записи: 58

22-01-2015 дата публикации

AMINE CURABLE EPOXY RESIN COMPOSITION

Номер: US20150025178A1

Автор: Handyside Timothy Marc, Jiang Derek Jingui, Wang Peter Congxiao, Zhao Iris Chunbin

Принадлежит:

The present invention relates to an amine curable epoxy resin composition comprising: (A) epoxy resin component comprising: 8-31 wt % of diglycidyl ether of bisphenol A, 3-14 wt % of diglycidyl ether of bisphenol F, 1-5 wt % of monoglycidylether, 0.6-5 wt % of alkylsulphonic phenyl ester, 0.16-1 wt % of wetting and dispersing agent, 0.16-1 wt % of defoamer, and 5-40 wt % of barium sulfate; (B) hardener component comprising: 3-18 wt % of first amine based composition, and 2-12 wt % of second amine based composition, wherein the first amine based composition comprises N,N′-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine represented by the following formula (I) and m-xylylenediamine, and the second amine based composition comprises the reaction products of m-xylylenediamine and styrene represented by the following formula (II) and m-xylylenediamine, wherein A is phenylene, and each of R, Rand Rindependently represents hydrogen or phenylethyl; wherein the sum of each component content is 100 wt %, and each weight percentage is based on the total weight of the amine curable epoxy resin composition. The invention also relates to use of the amine curable epoxy resin composition as primer, topcoat and screeds for application on concrete. 2. The amine curable epoxy resin composition according to claim 1 , wherein the content of N claim 1 ,N′-bis(3-aminomethylbenzyl)-2-hydroxytrimethylenediamine is 72-76 wt % of the first amine based composition and the content of m-xylylenediamine is 24-28 wt % of the first amine based composition in the first amine based composition.3. The amine curable epoxy resin composition according to claim 2 , wherein the content of m-xylylenediamine is less than 1 wt % of the second amine based composition in the second amine based composition.4. The amine curable epoxy resin composition according to claim 1 , further comprises silica sand.5. The amine curable epoxy resin composition according to claim 1 , wherein the hardener component further ...

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Номер записи: 59

10-02-2022 дата публикации

Use of salts as accelerators in an epoxy resin compound for chemical fastening

Номер: US20220041797A1

Автор: BEHRENS Nicole, BORNSCHLEGL Alexander, PFEIL Armin

Принадлежит: Hilti Aktiengesellschaft

A method includes using at least one salt (S) selected from the salts of nitric acid, salts of nitrous acid, salts of halogens or salts of trifluoromethanesulfonic acid as an accelerator in a multi-component epoxy resin compound for the chemical fastening of construction elements and/or anchoring means. Another method includes the chemical fastening of construction elements and anchoring elements, such as anchor rods, anchor bolts, rods, sleeves, reinforcing bars, screws and the like in boreholes in various substrates. 1: A method , comprising:accelerating an epoxy resin compound with at least one salt (S) selected from the group consisting of salts of nitric acid, salts of nitrous acid, salts of halogens, salts of trifluoromethanesulfonic acid and combinations thereof.2: The method according to claim 1 , wherein the epoxy resin compound is a multi-component epoxy resin compound.3: The method according to claim 2 , wherein the multi-component epoxy resin compound comprises an epoxy resin component (A) which contains at least one curable epoxy resin claim 2 , and a curing agent component (B) which contains at least one amine which is reactive to epoxy groups claim 2 , andwherein the epoxy resin component (A) and the curing agent component (B) are separate from one another so as to prevent a reaction.4: The method Use according to claim 3 , wherein the multi-component epoxy resin compound is present in cartridges or film pouches which comprise two or more separate chambers in which the epoxy resin component (A) and the curing agent component (B) are separately arranged so as to prevent a reaction.5: The method Use according to further comprising:chemical fastening with the epoxy resin compound of construction element or anchoring means in a borehole.6: The method according to wherein the at least one salt (S) is selected from the group consisting of nitrate (NO) claim 1 , iodide (I) claim 1 , triflate (CFSO) and mixtures thereof.7: The method according to claim 1 , ...

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Номер записи: 60

10-02-2022 дата публикации

POLYOL-EPOXIDE POLYMERS FOR NVH DAMPING APPLICATIONS

Номер: US20220041798A1

Автор: "OBrien Michael E.", GANG Calvin, KAPLAN Warren A., WESTFALL Jennifer S., WOLEK Sarah

Принадлежит:

Noise, vibration, or harshness (NVH) properties of an industrial or consumer product are reduced by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition. The PEEP compositions are one-component or two-component reaction products of a polyepoxide compound and a polyol composition. The PEEP compositions have a glass-transition temperature within the range of −50° C. to 50° C. and a loss factor of at least 0.5 by ASTM D5992 over a temperature range of at least 15 Celsius degrees at one or more frequencies within the range of 0.1 to 10,000 Hz. The PEEP compositions provide NVH damping over a broad temperature range, have improved flexibility compared with conventional epoxy technologies, avoid amine and isocyanate reactants, and can be tailored to meet target specifications. 1. A method which comprises reducing noise , vibration , or harshness properties of an industrial or consumer product by incorporating therein an effective amount of a polyether- or polyester-epoxide polymer (PEEP) composition , wherein the PEEP composition comprises a one-component or two-component reaction product of:(a) a polyepoxide compound having an equivalent weight within the range of 115 to 250 g/eq.; and(b) a polyol composition comprising:(i) a polyester polyol having a hydroxyl value within the range of 28 to 400 mg KOH/g, an average hydroxyl functionality within the range of 1.5 to 4.0, and an acid number less than 5 mg KOH/g; or(ii) a polyether polyol having a hydroxyl value within the range of 28 to 800 mg KOH/g and an average hydroxyl functionality within the range of 1.8 to 8.0; or(iii) a combination of (i) and (ii);wherein the ratio of epoxy equivalents of the polyepoxide compound to hydroxyl equivalents of the polyol composition is within the range of 0.5 to 4.0;wherein the PEEP composition has a glass-transition temperature as measured by differential scanning calorimetry within the range of −50° C. to 50° C.; andwherein the ...

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Номер записи: 61

10-02-2022 дата публикации

EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE

Номер: US20220041856A1

Автор: KAMIMURA Iho, ODAKA Kazuyoshi, ONOMOTO Hiroshi, Otani Go

Принадлежит: MITSUBISHI CHEMICAL CORPORATION

These vinyl-based polymerizable group-containing silane compounds may be used alone, or two or more thereof may be used in combination. The content of the vinyl-based polymerizable group-containing silane compound is 1% by mass or more and 10% by mass or less, and preferably 1% by mass or more and 5% by mass or less, in 100% by mass of the organosiloxane mixture. When the amount of the vinyl-based polymerizable group-containing silane compound is the lower limit value or more, the peeling force and impact resistance of the obtained cured product tend to be high. When the amount of the vinyl-based polymerizable group-containing silane compound is the upper limit value or less, the peeling force and impact resistance of the obtained cured product tend to be high. 1. An epoxy resin composition , comprising:a rubber-containing polymer, andan epoxy resin, whereinthe rubber-containing polymer contains at least one rubbery polymer and at least one vinyl monomer part, andthe vinyl monomer part has a unit based on a monomer (a) described below, a unit based on a monomer (b) described below, and a unit based on a monomer (c) described below, whereinthe monomer (a) is a polyfunctional (meth)acrylate, the monomer (b) is at least one monomer selected from a group consisting of epoxy group-containing (meth)acrylates and aromatic vinyl monomers, and the monomer (c) is an alkyl (meth)acrylate.2. The epoxy resin composition according to claim 1 , whereinthe rubbery polymer is at least one selected from a group consisting of a diene rubber, a diene-acrylic composite rubber, an acrylic rubber, a silicone rubber, and an acrylic-silicone composite rubber.3. The epoxy resin composition according to claim 1 , whereina proportion of the unit based on the monomer (a) is 1% by mass or more and 45% by mass or less, and a proportion of the unit based on the monomer (b) is 1% by mass or more and 50% by mass or less, with respect to a total mass of the vinyl monomer part.4. A curable resin ...

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Номер записи: 62

23-01-2020 дата публикации

Novel compound having isocyanuric skeleton and composition in which said compound is included

Номер: US20200024241A1

Автор: Eiji Sakamoto, Hisashi Mitsuhashi, Kaori Ozawa, Masatoshi Nose, Saya Nii, Tsuneo Yamashita

Принадлежит: Daikin Industries Ltd

The invention aims to provide a novel compound to be suitably used for antifouling agents. The compound of the invention is represented by the following formula (1): wherein R 1 is a monovalent organic group containing a polyether chain; X 1 and X 2 are each individually a monovalent group; and the polyether chain is a chain represented by the following formula: —(OC 6 F 12 ) m11 —(OC 5 F 10 ) m12 —(OC 4 F 8 ) m13 —(OC 3 X 10 6 ) m14 —(OC 2 F 4 ) m15 —(OCF 2 ) m16 —, wherein m11, m12, m13, m14, m15, and m16 are each individually an integer of 0 or 1 or greater; X 10 s are each individually H, F, or Cl; and the repeating units are present in any order.

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Номер записи: 63

23-01-2020 дата публикации

Composition for curable resin, cured product of said composition, method of producing said composition and said cured product, and semiconductor device

Номер: US20200024426A1

Автор: Masaki Minami, Yoshinori Nishitani

Принадлежит: JXTG Nippon Oil and Energy Corp

Provided is a curable resin composition for obtaining a cured product that can satisfy both high heat resistance and high adhesiveness to metal, a cured product thereof, and methods of producing the curable resin composition and the cured product, and a semiconductor device using the cured product as a sealant. A curable resin composition containing (A) a multifunctional benzoxazine compound having two or more benzoxazine rings, (B) a multifunctional epoxy compound having at least one norbornane structure and at least two epoxy groups, (C) a curing agent, (D) a triazole-based compound, and optionally (E) a curing accelerator and (F) an inorganic filler, a cured product thereof, and methods of producing the curable resin composition and the cured product. A semiconductor device in which a semiconductor element is disposed in a cured product obtained by curing a curable resin composition containing components (A) to (D), and optionally components (E) and (F).

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Номер записи: 64

28-01-2021 дата публикации

Compositions for Use in Impregnation of Paper Bushings

Номер: US20210024684A1

Автор: Baer Daniel, Beisele Christian, Wilbers Hubert

Принадлежит:

The disclosure relates to a curable mixture for use in impregnation of paper bushings comprising a resin mixture of a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE), methyltetrahydrophthalic anhydride (MTHPA) as hardener, and an accelerator selected from the group consisting of tertiary alkylamine aminoethylalcohols and corresponding ethers thereof as well as paper bushings impregnated with such mixture and uses of such mixture. 1. A curable mixture for use in impregnation of paper bushings comprising (i) a resin mixture comprising a bisphenol-A-diglycidylether (BADGE) and a bisphenol-F-diglycidylether (BFDGE) , (ii) methyltetrahydrophthalic anhydride (MTHPA) as hardener , and (iii) an accelerator selected from tertiary alkylamine aminoethylalcohols and/or corresponding ethers thereof.2. The curable mixture according to claim 1 , wherein the epoxy index according to ISO 3001 of the BADGE is in the range between 3 and 5 eq/kg.3. The curable mixture according to claim 2 , wherein the epoxy index according to ISO 3001 of the BADGE is in the range between 3.5 and 4.5 eq/kg.4. The curable mixture according to any of the preceding claims claim 2 , wherein the epoxy index according to ISO 3001 of the BFDGE is in the range between 5 and 6.45 eq/kg.5. The curable mixture according to claim 4 , wherein the epoxy index according to ISO 3001 of the BFDGE is in the range between 5.3 and 6.3 eq/kg.6. The curable mixture according to any of the preceding claims claim 4 , wherein the BADGE and the BFDGE are present in the resin mixture at a weight ratio between 1:10 to 10:1.7. The curable mixture according to any of the preceding claims claim 4 , wherein the curable mixture contains MTHPA in an amount corresponding to 80 wt. % to 120 wt. % of the stoichiometric amount based on the resin mixture.8. The curable mixture according to claim 7 , wherein the curable mixture contains MTHPA in amount corresponding to the stoichiometric amount based on the ...

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Номер записи: 65

28-01-2021 дата публикации

CURED PRODUCT OF RESIN COMPOSITION, LAMINATE, AND RESIN COMPOSITION

Номер: US20210024752A1

Автор: HIRANUMA Yuji, NAKAMURA Koichiro

Принадлежит:

A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200° C. is expressed as α1 [K], at least one of requirements α1/α2≥10 and (α1−α2)×10≥0.4 is satisfied, where a reference value α2 is 350×10[K] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09≤Ia/Ib≤3.0 and 0.04≤Ic/Ib≤1.0 are satisfied. 1. A cured product of a resin composition , the cured product comprising at least silsesquioxane , wherein{'sup': −1', '2', '8', '−6', '−1, 'when the average thermal expansion coefficient of the cured product at 30 to 200° C. is expressed as α1 [K], at least one of requirements α1/α2≥10 and (α1−α2)×10≥0.4 is satisfied, where a reference value α2 is 350×10[K] or less, and'}requirements 0.09≤Ia/Ib≤3.0 and 0.04≤Ic/Ib≤1.0 are satisfied when an absorbance derived from a siloxane bond in which two silicon atoms are bonded to one oxygen atom, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer.2. The cured product according to claim 1 , wherein a requirement 0.06≤Ic/Ib≤0.08 or 0.09≤Ic/Ib≤0.10 is further satisfied.3. The cured product according to claim 1 , wherein the silsesquioxane is a polymer of silsesquioxane having an oxetanyl group.4. The cured product according to claim 1 , wherein a relationship Ia/Id≥45 is further satisfied when an absorbance derived from an oxetanyl group and determined by attenuated total reflection using Fourier ...

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Номер записи: 66

28-01-2021 дата публикации

Coating compositions for packaging articles and methods of coating

Номер: US20210024774A1

Автор: Benoit Prouvost, Grant Schutte, Jeffrey Niederst, Kevin Romagnoli, Paul Stenson, Richard H. Evans, Robert M. O'brien, Tom Van Kuren

Принадлежит: SWIMC LLC

This invention provides a polymer that is useful in a variety of applications, including as a binder polymer of a coating composition, and especially a packaging coating composition. Packaging articles (e.g., containers) comprising the polymer and methods of making such packaging articles are also provided.

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Номер записи: 67

24-01-2019 дата публикации

ANISOTROPIC CONDUCTIVE FILM

Номер: US20190027267A1

Автор: HAYASHI Shinichi, TOKUHISA Kenji, YAMAGUCHI Etsuko

Принадлежит: DEXERIALS CORPORATION

A cationically polymerizable anisotropic conductive film is provided. The cationically polymerizable anisotropic conductive film includes an alicyclic epoxy compound and achieves storage life property better than known anisotropic conductive films while ensuring curing temperature and connection reliability equivalent to known anisotropic conductive films. The anisotropic conductive film contains a binder composition containing a film forming component and a cationically polymerizable component, a cationic polymerization initiator, and conductive particles. The anisotropic conductive film contains a quaternary ammonium salt-based thermal acid generator as a cationic polymerization initiator and an alicyclic epoxy compound and a low polarity oxetane compound as a cationically polymerizable component. 1. An anisotropic conductive film comprising:a binder composition containing a film forming component and a cationically polymerizable component;a cationic polymerization initiator; andconductive particles, whereinthe cationic polymerization initiator is a quaternary ammonium salt-based thermal acid generator, andthe cationically polymerizable component contains an alicyclic epoxy compound and a low polarity oxetane compound.2. The anisotropic conductive film according to claim 1 , wherein a compounded proportion of the alicyclic epoxy compound and the low polarity oxetane compound is from 25:75 to 60:40 on a mass basis.3. The anisotropic conductive film according to claim 1 , wherein a compounded proportion of the alicyclic epoxy compound and the low polarity oxetane compound is from 45:55 to 60:40 on a mass basis.4. The anisotropic conductive film according to claim 1 , wherein the quaternary ammonium salt-based thermal acid generator is a salt of quaternary ammonium cation and hexafluoroantimonate anion claim 1 , hexafluorophosphate anion claim 1 , trifluoromethanesulfonate anion claim 1 , perfluorobutanesulfonate anion claim 1 , dinonylnaphthalenesulfonate anion ...

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Номер записи: 68

02-02-2017 дата публикации

STORAGE STABLE HEAT ACTIVATED QUATERNARY AMMONIUM CATALYSTS FOR EPOXY CURE

Номер: US20170029558A1

Автор: Bach on Thomas, Holtgrewe Christian, Schoenfeld Rainer, Walter Pablo

Принадлежит:

The present invention relates to a catalyst composition for curing epoxy group containing compounds comprising a base and a quaternary ammonium salt, of Formula (I): 4. The catalyst composition according to claim 1 , wherein R claim 1 , Rand/or Rare methyl or ethyl claim 1 , preferably ethyl.5. The catalyst composition according to claim 1 , wherein the anion X is selected from the group consisting of dicyandiamide-anion claim 1 , F claim 1 , Cl claim 1 , Br claim 1 , I claim 1 , OH claim 1 , HSO claim 1 , SO claim 1 , SO claim 1 , NO claim 1 , NO claim 1 , PO claim 1 , BF claim 1 , SbF claim 1 , PF claim 1 , CIO claim 1 , acetate claim 1 , citrate claim 1 , formiate claim 1 , glutarate claim 1 , lactate claim 1 , malate claim 1 , malonate claim 1 , oxalate claim 1 , pyruvate claim 1 , and tartrate claim 1 , preferably is a non-coordinating anion selected from the group consisting of Cl claim 1 , Br claim 1 , I claim 1 , OH claim 1 , HSO claim 1 , SO claim 1 , SO claim 1 , NO claim 1 , NO claim 1 , PO claim 1 , BF claim 1 , SbF claim 1 , PF claim 1 , CIOand acetate6. The catalyst composition according to claim 1 , wherein{'sup': 5', '6', '7', '5', '7', '6', '5', '6, 'sub': 1', '20, '(a) the ammonium compound is a compound represented by Formula (II) and R, Rand Rare hydrogen, or Rand Rare hydrogen and Ris —C(O)OR, with R being C-Calkyl, preferably ethyl, Rand Rcombine to form together with the carbon atoms to which they are attached a substituted or unsubstituted phenyl ring;'}{'sup': '5', 'sub': 1-20', '1-4, '(b) the ammonium compound is a compound represented by Formula (III) and Ris independently selected from the group consisting of substituted or unsubstituted phenyl or Calkoxy, preferably Calkoxy, more preferably ethoxy; or'}(c) the ammonium compound is selected from the group consisting triethylallyl ammonium, triethylbenzyl ammonium, triethyl (4-bromo-benzyl) ammonium, triethyl (4-nitro-benzyl) ammonium, triethyl (4-crotonic acid ethyl ester)ammonium, ...

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Номер записи: 69

17-02-2022 дата публикации

EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND COMPOSITE MATERIAL

Номер: US20220049046A1

Автор: FUKUDA Kazumasa, HIGASHIUCHI Tomoko, Katagi Hideyuki, Maruyama Naoki, Nakamura Yuki, Takezawa Yoshitaka

Принадлежит:

An epoxy resin includes an epoxy compound having a mesogenic structure, a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C., a fracture toughness of 1.0 MPa·mor more, and a glass transition temperature of 150° C. or higher. 1. An epoxy resin , comprising an epoxy compound having a mesogenic structure , a cured product of the epoxy resin having a flexural modulus of 3.0 GPa or more at 23° C. , a fracture toughness of 1.0 MPa·mor more , and a glass transition temperature of 150° C. or higher.7. An epoxy resin composition claim 1 , comprising the epoxy resin according to and a curing agent.8. The epoxy resin composition according to claim 7 , wherein the curing agent includes a compound having two or more amino groups that are directly bonded to an aromatic ring.9. The epoxy resin composition according to claim 7 , wherein the curing agent includes 3 claim 7 ,3′-diaminodiphenyl sulfone.10. An epoxy resin cured product claim 7 , comprising a cured product of the epoxy resin composition according to .11. A composite material claim 10 , comprising the epoxy resin cured product according to and a reinforcing material.12. The composite material according to claim 11 , wherein the reinforcing material includes a carbon material. The present disclosure relates to an epoxy resin, an epoxy resin composition, an epoxy resin cured product and a composite material.Epoxy resin is used in various applications owing to its high thermal resistance, and fiber-reinforced composite materials using epoxy resin have recently been increasingly applied to structural materials. Fiber-reinforced composite materials are used for structural frameworks of airplanes and the like, and therefore, are required to have excellent thermal resistance and strength. Various efforts are being made on epoxy resin as a resin material of fiber-reinforced composite materials since epoxy resin can form a cross-linked structure thereby exhibiting excellent thermal resistance ...

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Номер записи: 70

17-02-2022 дата публикации

EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND COMPOSITE MATERIAL

Номер: US20220049047A1

Автор: FUKUDA Kazumasa, HIGASHIUCHI Tomoko, Katagi Hideyuki, Maruyama Naoki, Nakamura Yuki, TIAN Lin

Принадлежит:

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group. 1. An epoxy resin comprising a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.2. The epoxy resin according to claim 1 , wherein the compound having a naphthalene structure and a functional group that is reactive with an epoxy group includes a dihydroxynaphthalene compound.3. The epoxy resin according to claim 2 , wherein the dihydroxynaphthalene compound includes at least one selected from the group consisting of 1 claim 2 ,5-dihydroxynaphthalene and 2 claim 2 ,6-dihydroxynaphthalene.4. The epoxy resin according to any one of claim 1 , wherein the epoxy compound includes an epoxy compound having a mesogenic structure.7. The epoxy resin according to claim 6 , wherein claim 6 , in General Formula (a) claim 6 ,{'sup': '1', 'Ris a monovalent group having a structure derived from a first epoxy compound,'}{'sup': '2', 'Ris a monovalent group having a structure derived from a second epoxy compound and the compound having a naphthalene structure and a functional group that is reactive with an epoxy group, and'}{'sup': '3', 'Ris a monovalent group having a structure derived from a third epoxy compound,'}wherein the first epoxy compound, the second epoxy compound and the third epoxy compound may be the same as or different from each other, andwherein at least one of the first epoxy compound, the second epoxy compound or the third epoxy compound has a mesogenic structure.8. The epoxy resin according to claim 1 , wherein claim 1 , in an 80-minute continuous measurement of dynamic shear viscosity at a temperature of 80° C. using a viscoelastometer with a gap between a parallel plate and a stage of 0.05 mm claim 1 , a frequency of 0.5 Hz and a strain of 8000% claim 1 , a value of η′2/η′1 is 3 or less claim ...

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Номер записи: 71

17-02-2022 дата публикации

Reinforcing resin composition, electronic component, method for manufacturing electronic component, mounting structure, and method for manufacturing mounting structure

Номер: US20220049085A1

Автор: Hirohisa Hino, Shigeru Yamatsu, Yasuhiro Suzuki

Принадлежит: Panasonic Intellectual Property Management Co Ltd

A reinforcing resin composition includes an epoxy resin (A), a phenolic resin (B), and a benzoxazine compound (C).

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Номер записи: 72

31-01-2019 дата публикации

CURABLE COMPOSITION, CURED FILM, DISPLAY PANEL OR OLED LIGHT, AND METHOD FOR PRODUCING CURED PRODUCT

Номер: US20190031818A1

Автор: Misumi Koichi, Shiota Dai, SOMEYA Kazuya, Suzuki Issei

Принадлежит:

A curable composition which is capable of forming a cured product having satisfactory heat resistance and adhesion to a base material, and has satisfactory curability, a cured film obtained from a cured product of the curable composition, a display panel or an OLED light provided with the cured film, and a method for producing a cured product using the curable composition. The composition includes a curable compound and a cationic polymerization initiator, and contains a cationic polymerizable compound having, as the main skeleton, a fused ring in which three or more rings including an aromatic ring are fused, and a salt including a gallium-containing anion as the cationic polymerization initiator. 2. The curable composition according to claim 1 ,further comprising a cationic polymerization initiator (C).4. The curable composition according to claim 3 , wherein both the Rand the Rin the formula (c1) are a phenyl group.5. The curable composition according to claim 3 , wherein the Ain the formula (c1) is S.6. A cured film obtained from a cured product of a curable composition according to .7. A display panel for an image display device or an OLED light claim 6 , provided with the cured film according to .8. The display panel for an image display device or the OLED light according to claim 7 , wherein the display panel is flexible.9. A method for producing a cured product claim 7 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'forming a curable composition according to into a predetermined shape; and'}subjecting the formed curable composition to heating, or to light exposure and heating.10. The method for producing a cured product according to claim 9 , wherein forming of the curable composition is formation of a coating film claim 9 , and the coating film is subjected to at least one of light exposure and heating.11. An image display device comprising the display panel or the OLED light according to . This application claims priority to Japanese Patent ...

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Номер записи: 73

30-01-2020 дата публикации

RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET, AND PRINTED WIRING BOARD

Номер: US20200031987A1

Автор: KOGA Shota, NAKAZUMI Yoshihiro, Takano Kentaro

Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A resin composition having an epoxy resin (A) represented by general formula (1); and a cyanate compound (B). 2. The resin composition according to claim 1 , wherein a content of the epoxy resin (A) in the resin composition is 1 to 90 parts by mass based on 100 parts by mass of a resin solid content.3. The resin composition according to claim 1 , further comprising one or more selected from the group consisting of an epoxy resin other than the epoxy resin (A) claim 1 , a maleimide compound claim 1 , a phenolic resin claim 1 , an oxetane resin claim 1 , a benzoxazine compound claim 1 , and a compound having a polymerizable unsaturated group.4. The resin composition according to claim 1 , wherein the cyanate compound (B) is one or more selected from the group consisting of a phenol novolac-based cyanate compound claim 1 , a naphthol aralkyl-based cyanate compound claim 1 , a biphenyl aralkyl-based cyanate compound claim 1 , a naphthylene ether-based cyanate compound claim 1 , a xylene resin-based cyanate compound claim 1 , an adamantane skeleton-based cyanate compound claim 1 , and a cyanate compound containing an allyl group or a propenyl group.5. The resin composition according to claim 4 , wherein the cyanate compound (B) comprises the naphthol aralkyl-based cyanate compound.6. The resin composition according to claim 1 , further comprising a filler (C).7. The resin composition according to claim 6 , wherein a content of the filler (C) in the resin composition is 50 to 1600 parts by mass based on 100 parts by mass of the resin solid content.8. A prepreg comprising a base material; and the resin composition according to with which the base material is impregnated or coated.9. A metal foil-clad laminate comprising at least one or more of the prepregs according to laminated; and a metal foil disposed on one surface or both surfaces of the prepreg.10. A resin sheet comprising the resin composition according to .11. A printed wiring board comprising an insulating layer; ...

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Номер записи: 74

30-01-2020 дата публикации

CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND ROTARY DEVICE

Номер: US20200032046A1

Автор: Mabuchi Takahiro, OSAWA Azusa, YASUDA Naoki

Принадлежит: Mitsubishi Electric Corporation

A curable composition (X) includes: an epoxy resin (A); a curing agent (B); a curing promoter (C); and hydrophilic inorganic particles (D). The epoxy resin (A) includes a first epoxy resin (a1) and a second epoxy resin (a2). The first epoxy resin (a1) is a chain aliphatic epoxy resin having a hydrophilic group, and an aqueous dissolution rate of the first epoxy resin (a1) is not less than 20 mass % and not more than 99 mass %. The second epoxy resin (a2) includes at least one selected from the group consisting of a cyclic aliphatic epoxy resin, an aromatic epoxy resin and a heterocyclic epoxy resin. 1. A curable composition comprising:an epoxy resin;a curing agent;a curing promoter; andhydrophilic inorganic particles,wherein:the epoxy resin comprises a first epoxy resin and a second epoxy resin,the first epoxy resin is a chain aliphatic epoxy resin having a hydrophilic group, and an aqueous dissolution rate of the first epoxy resin is 20 mass % to 99 mass %,the first epoxy resin comprises an unsaturated polyester resin including two or more (meth)acryloyl groups in one molecule and having a hydrophilic group, wherein the unsaturated polyester resin is an epoxy acrylate resin obtained by introducing a (meth)acryloyl group, andthe second epoxy resin comprises at least one selected from the group consisting of a cyclic aliphatic epoxy resin, an aromatic epoxy resin and a heterocyclic epoxy resin.2. The curable composition according to claim 1 , wherein the first epoxy resin is a glycidyl ether compound.3. The curable composition according to claim 1 , wherein the first epoxy resin is a polyglycidyl ether compound having a glycerol skeleton.4. The curable composition according to claim 1 , wherein a ratio of the first epoxy resin to a total of the first epoxy resin and the second epoxy resin is in a range of 26 volume % to 54 volume %.5. The curable composition according to claim 1 , wherein the first epoxy resin has a viscosity of 20 mPa·s to 21200 mPa·s.67-. (canceled ...

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Номер записи: 75

30-01-2020 дата публикации

SHEET MOLDING COMPOUND AND FIBER-REINFORCED COMPOSITE MATERIAL

Номер: US20200032047A1

Автор: Ichino Masahiro, OTA Akira, Teranishi Takuya

Принадлежит: MITSUBISHI CHEMICAL CORPORATION

A sheet molding compound which is a thickened material of an epoxy resin composition, including a component (A), a component (B), and a component (C), in which the component (A) is an epoxy resin staying at a liquid state at 25° C., the component (B) is an acid anhydride, the component (C) is an epoxy resin curing agent, and in the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester. 1. A sheet molding compound which is a thickened material of an epoxy resin composition , comprising:a component (A);a component (B); anda component (C),wherein the component (A) is an epoxy resin staying in a liquid state at 25° C.,the component (B) is an acid anhydride,the component (C) is an epoxy resin curing agent, andin the thickened material, at least some of epoxy groups of the component (A) and at least some of carboxy groups derived from the component (B) form ester.2. The sheet molding compound according to claim 1 , further comprising:reinforcing fiber.3. The sheet molding compound according to claim 1 ,wherein a viscosity of the epoxy resin composition that is measured by viscometry (a) at 30° C. 30 minutes after the preparation of the composition described below is 0.5 to 15 Pa·s,viscometry (a): immediately after being prepared, the epoxy resin composition is put and sealed into an airtightable container and left to stand for 30 minutes at 23° C., and then a viscosity of the epoxy resin composition at 30° C. is measured.4. The sheet molding compound according to claim 1 ,wherein a viscosity of the epoxy resin composition that is measured by viscometry (b) at 30° C. 10 days after the preparation of the composition described below is 2,000 to 55,000 Pa·s,viscometry (b): immediately after being prepared, the epoxy resin composition is put and sealed into an airtightable container and left to stand for 10 days at 23° C., and then a viscosity of the epoxy resin composition at 30° C. ...

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Номер записи: 76

04-02-2021 дата публикации

Nitride ceramic resin composite body

Номер: US20210032171A1

Автор: Eri Sasaki, Ryo YOSHIMATU, Ryuji Koga, Saori INOUE, Toshitaka Yamagata, Yoshitaka MINAKATA

Принадлежит: Denka Co Ltd

A nitride-based ceramics resin composite body having thermal conductivity, electrical insulation, and adhesion to adherends equal to conventional products, and having improved heat resistance reliability during the reflow process, and a thermal conductive insulating adhesive sheet using the same are provided. A nitride-based ceramics resin composite body in which a thermosetting resin composition is impregnated in a porous nitride-based ceramics sintered body is provided. The thermosetting resin composition includes a specific epoxy resin and a bismaleimide triazine resin, and a water absorption of the thermosetting resin composition in a completely cured state measured in accordance with method A in JIS K7209 (2000) is 1% by mass or less.

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Номер записи: 77

04-02-2021 дата публикации

Epoxy resin composition and cured product

Номер: US20210032400A1

Автор: Koichi Hattori, Naoki Yokoyama

Принадлежит: Nippon Steel Chemical and Materials Co Ltd

Provided is a polyurethane-modified epoxy resin composition having satisfactory operability of processing, such as casting or impregnation, in a composition state. The epoxy resin composition includes, as essential components, the following components (A) to (D): (A) a low-concentration polyurethane-modified epoxy resin containing a polyurethane having an epoxy resin added to each of both terminals thereof and/or one terminal thereof; (B) a polyurethane-unmodified epoxy resin that is liquid at 30° C.; (C) a solid epoxy resin having a bisphenol structure, the resin having a glass transition temperature or a melting point of 50° C. or more; and (D) an amine-based curing agent that is dicyandiamide or a derivative thereof, wherein the epoxy resin composition includes the component (A) at from 3.0 wt % to 30.0 wt %, and the component (C) at from 0.1 wt % to 40.0 wt % with respect to the total of the components (A) to (D).

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Номер записи: 78

04-02-2021 дата публикации

THERMOPLASTIC POLYESTER RESIN COMPOSITION AND MOLDED ARTICLE

Номер: US20210032402A1

Автор: Okunaga Kenichi, Tojo Yusuke, Umetsu Hideyuki, Yokoe Makito

Принадлежит:

A thermoplastic polyester resin composition includes a thermoplastic polyester resin (A), an epoxy compound (B) having an epoxy equivalent of from 200 to 3,000 g/eq, and a hydroxy group-containing resin (C) having a number average molecular weight of from 2,000 to 500,000 and a halogen element content of 1,000 ppm or less, wherein the epoxy compound (B) is blended in an amount of from 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C). The thermoplastic resin composition and a molded article achieve both long-term hydrolysis resistance and heat aging resistance at a high level, and can further suppress bleed-out to the surface of the molded article during heat-dry and heat-moisture treatments. 112.-. (canceled)13. A thermoplastic polyester resin composition comprising a thermoplastic polyester resin (A) , an epoxy compound (B) having an epoxy equivalent of 200 to 3 ,000 g/eq , and a hydroxy group-containing resin (C) having a number average molecular weight of 2 ,000 to 500 ,000 and a halogen element content of 1 ,000 ppm or less , wherein the epoxy compound (B) is blended in an amount of 0.05 to 10 parts by weight with respect to 100 parts by weight in total of 70 to 99.9 parts by weight of the thermoplastic polyester resin (A) and 0.1 to 30 parts by weight of the hydroxy group-containing resin (C).14. The thermoplastic polyester resin composition according to claim 13 , wherein the thermoplastic polyester resin (A) has a melting point higher than 200° C.15. The thermoplastic polyester resin composition according to claim 13 , wherein the epoxy compound (B) includes an epoxy compound having two or more epoxy groups in one molecule.16. The thermoplastic polyester resin composition according to claim 13 , wherein the hydroxy group-containing resin (C) has a hydroxy group value of 3 to 20 eq/kg.17. The ...

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Номер записи: 79

04-02-2021 дата публикации

Adhesive for euv mask, cleaning method of the same, and reusing method of euv mask using the same

Номер: US20210032514A1

Автор: Byungchul YOO, Byunghoon Lee, Changyoung Jeong, Jeonghwan MIN, Jikang KIM, Kyoungchae SEO, Myungjun KIM

Принадлежит: Fine Semitech Corp

An adhesive for an EUV mask includes an epoxy resin composition in an amount of 50 wt % to 80 wt % based on a total weight of the adhesive, the epoxy resin composition including an epoxy resin, a hardener, a toughening agent, a filler, and a curing accelerator, and an inorganic filler in an amount of 20 wt % to 50 wt % based on the total weight of the adhesive, the inorganic filler including one or more of aluminum hydroxide or calcium carbonate.

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Номер записи: 80

12-02-2015 дата публикации

Curable epoxy resin composition

Номер: US20150041846A1

Автор: Hirose Suzuki

Принадлежит: Daicel Corp

Provided is a curable epoxy resin composition capable of forming a cured product that has heat resistance, light resistance, and thermal shock resistance at high levels and particularly offers excellent reflow resistance after moisture absorption. The curable epoxy resin composition includes an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by Formula (1), a curing agent (C), and a curing accelerator (D). The composition includes methylnorbornane-2,3-dicarboxylic anhydride as an essential component of the curing agent (C) and has a succinic anhydride content of 0.4 percent by weight or less based on the total amount of the curing agent (C): wherein R 1 and R 2 are identical or different and each represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.

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Номер записи: 81

24-02-2022 дата публикации

PREPARATION METHOD FOR EMULSIFIER, EMULSIFIER, AQUEOUS EPOXY RESIN DISPERSION AND FORMULATION METHOD

Номер: US20220055000A1

Автор: Deng Junying, Ji Xueshun, Li Weifei, Qu Rui, Sun Jiakuan, Wang Xiao

Принадлежит:

A preparation method for an emulsifier, an emulsifier, an aqueous epoxy resin dispersion, and a formulation method. The preparation method for an emulsifier comprises reacting aminosulfonic acid and/or a sulfamate as a first reaction raw material with an epoxy resin in the presence of water, so as to obtain an ionic active emulsifier. The ionic active emulsifier molecule comprises at least one epoxy group from an epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material. The aqueous epoxy resin dispersion prepared by using the emulsifier has the characteristics of good stability and good corrosion resistance after curing, and can be used in the fields of coatings, adhesives, etc. 1. A preparation method for an ionic active emulsifier , comprising: reacting sulfamic acid and/or sulfamate as a first reaction raw material with an epoxy resin to obtain the ionic active emulsifier , wherein the molecule of the ionic active emulsifier comprises at least one epoxy group from the epoxy resin and at least one sulfonic acid or sulfonate group from the first reaction raw material.2. The preparation method according to claim 1 , wherein in the reaction system for preparing the ionic active emulsifier claim 1 , the molar ratio of the total amount of epoxy groups provided by the epoxy resin to the total amount of active hydrogens comprised in the amino (amine) groups in the first reaction raw material is at least 2:1.313-. (canceled)14. The preparation method according to claim 1 , wherein in the reaction system for preparing the ionic active emulsifier claim 1 , the mass ratio of water to the first reaction raw material is not less than 1:20.15. The preparation method according to claim 1 , wherein in the process of preparing the ionic active emulsifier claim 1 , after the first reaction raw material is mixed with water claim 1 , the mixture is reacted with the epoxy resin optionally in the presence of a solvent used for reducing the ...

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Номер записи: 82

24-02-2022 дата публикации

EPOXY COMPOUND, COMPOSITION PREPARED THEREFROM, SEMICONDUCTOR DEVICE PREPARED THEREFROM, ELECTRONIC DEVICE PREPARED THEREFROM, ARTICLE PREPARED THEREFROM, AND METHOD OF PREPARING ARTICLE

Номер: US20220056197A1

Автор: Kim In, Pang Kyeong, PARK Dahye, WON Jonghoon

Принадлежит:

An epoxy compound including a 5-membered aromatic heterocyclic ring represented by Formula 1 or Formula 2, a composition prepared using the epoxy compound, a semiconductor device prepared using the epoxy compound, an electronic device prepared using the epoxy compound, an article prepared using the epoxy compound, and a method of preparing the article: 2. The epoxy compound of claim 1 , wherein the epoxy compound represented by Formula 1 is represented by one of Formulae 5a to 5f:{'br': None, 'E1-M1-L7-M3-L8-M2-E2\u2003\u2003Formula 5a'}{'br': None, 'E1-M1-L7-M3-E2\u2003\u2003Formula 5b'}{'br': None, 'E1-M3-L8-M2-E2\u2003\u2003Formula 5c'}{'br': None, 'E1-M1-M3-M2-E2\u2003\u2003Formula 5d'}{'br': None, 'E1-M1-M3-E2\u2003\u2003Formula 5e'}{'br': None, 'E1-M3-M2-E2\u2003\u2003Formula 5f'}wherein, in Formulae 5a to 5f,M1 and M2 are each independently an arylene group represented by Formulae 3a to 3e,M3 is a heteroarylene group represented by Formulae 4a to 4r,L7 and L8 are each independently —O—, —C(═O)—, —C(═O)O—, or —O—C(═O)O—, andE1 and E2 are each independently an epoxy-containing group.4. The epoxy compound of claim 3 , wherein A1 is a butylene group claim 3 , a pentylene group claim 3 , a hexylene group claim 3 , a heptylene group claim 3 , an octylene group claim 3 , a nonylene group claim 3 , a decylene group claim 3 , an undecylene group claim 3 , a dodecylene group claim 3 , a butadienylene group claim 3 , a pentadienylene group claim 3 , a hexadienylene group claim 3 , a heptadienylene group claim 3 , an octadienylene group claim 3 , a nonadienylene group claim 3 , a decadienylene group claim 3 , an undecadienylene group claim 3 , or a dodecadienylene group.9. The epoxy compound of claim 1 , wherein a melting point of the epoxy compound represented by Formula 1 or Formula 2 is about 30° C. to about 200° C.10. An epoxy resin composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the epoxy compound of ; and'}a curing agent.11. The epoxy ...

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Номер записи: 83

24-02-2022 дата публикации

FIRE RETARDANT EPOXY RESIN

Номер: US20220056261A1

Автор: Biswas Bhaskar, Lally Jack V.

Принадлежит:

A composition formed of an epoxy resin incorporating a fire retardant. 1. A composition formed of an epoxy resin incorporating a fire retardant.2. The composition of wherein the fire retardant is one or more of the following: aluminum trihydrate (ATH) claim 1 , magnesium hydroxide (MgOH) claim 1 , ammonium polyphosphate claim 1 , melamine phosphate claim 1 , organophosphorus claim 1 , red phosphorus claim 1 , intumescent claim 1 , melamines claim 1 , melamine cyanuratecyanides claim 1 , polyhydro oligomeric silsesquioxane claim 1 , zinc borate claim 1 , decabromo diphenyl ether claim 1 , tetrabromophenol claim 1 , phosphonic acid claim 1 , phosphate ester claim 1 , phosphonate claim 1 , phosphinate claim 1 , Triphenyl phosphate claim 1 , Tritolyl phosphate claim 1 , tricresyl phosphate claim 1 , triaryl phosphate claim 1 , resorcinol bis(diphenyl phosphate) claim 1 , bisphenol A bis(diphenyl phosphate) claim 1 , polyphosphonate claim 1 , phosphinic acid salts claim 1 , red phosphorus; Ammonium phosphate claim 1 , diammonium phosphate claim 1 , triammonium phosphate claim 1 , ammonium poly phosphate claim 1 , melamine phosphate claim 1 , melamine polyphaste claim 1 , melamine pyrophosphate claim 1 , Guanidine phosphate claim 1 , 9 claim 1 , 10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) claim 1 ,—polyhedral oligomeric silsesquioxane (POSS); zinc borate claim 1 , sodium borate claim 1 , ammonium borate claim 1 , barium metaborate; aluminum trihydrate claim 1 , magnesium hydroxide claim 1 , mica claim 1 , zeolite claim 1 , bentonite claim 1 , iron oxide; pentaerythritol based FRs and expandable graphites.3. A mixture of the composition of further with a curing agent.4. A liquid mixture of an epoxide resin having incorporated therein a fire retardant claim 1 , and a curing agent.5. The composition of wherein the resin is cured and the resultant material used as a composite material for aircraft construction.7. A process for making a composite comprising the ...

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Номер записи: 84

24-02-2022 дата публикации

Method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering

Номер: US20220056305A1

Автор: Campbell C. Garrett, Celina Mathias C.

Принадлежит:

The invention is directed to a method of controlled conversion of thermosetting resins and additive manufacturing thereof by selective laser sintering. Partial curing of a thermosetting formulation can be used to increase the Tof the resin and minimize the additional cure needed to cross-link a printed object. After printing, the partially cured material is finally cured via a slow temperature ramp maintained just below the material's evolving T. 1. A method for printing a thermosetting polymer , comprisingproviding a partially cured resin material,producing a resin powder from the partially cured resin material,printing and sintering the resin powder on a print bed at a bed temperature near a glass transition temperature of the resin powder to provide a printed part, andcuring the printed part according to a post-print cure schedule to provide a cured printed part.2. The method of claim 1 , wherein the resin material comprises a stoichiometrically balanced formulation comprising a thermosetting resin and a curing agent.3. The method of claim 2 , wherein the thermosetting resin comprises an epoxy.4. The method of claim 3 , wherein the epoxy comprises difunctional bisphenol A/epichlorohydrine epoxy.5. The method of claim 2 , wherein the thermosetting resin comprises a bismaleimide claim 2 , cyanate ester claim 2 , alkyne claim 2 , alkene claim 2 , acrylate claim 2 , anhydride claim 2 , carboxylic acid claim 2 , isocyanate claim 2 , or halide.6. The method of claim 2 , wherein the curing agent comprises an amine.7. The method of claim 6 , wherein the amine comprises 4 claim 6 ,4′-diaminodiphenylsulphone.8. The method of claim 2 , wherein the curing agent comprises a thiol claim 2 , alkene claim 2 , anhydride claim 2 , azide claim 2 , carboxylic acid claim 2 , or hydroxyl.9. The method of claim 1 , wherein the step of providing a partially cured resin material comprisesmixing a thermosetting resin with a curing agent to provide a thermosetting resin formulation, ...

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Номер записи: 85

07-02-2019 дата публикации

TOUGHENED EPOXY RESIN COMPOSITION

Номер: US20190040182A1

Автор: MIYATAKE Nobuo

Принадлежит: KANEKA CORPORATION

A toughened epoxy resin composition includes an end-capped polyalkylene oxide (A), an epoxy resin (B), an epoxy curing agent (C), and a core shell polymer (D). The end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000, and 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group. A weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10. The core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight and the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer. 1. A toughened epoxy resin composition comprising:an end-capped polyalkylene oxide (A);an epoxy resin (B);an epoxy curing agent (C); anda core shell polymer (D),wherein the end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000,wherein 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group,wherein a weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10,wherein the core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight per 100% by weight of the core shell polymer (D), andwherein the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer.2. The composition according to claim 1 , wherein the end-capped polyalkylene oxide (A) is at least one selected from the group consisting of a polypropylene oxide claim 1 , a polybutylene oxide claim 1 , and an oxy-3-methyltetramethylene/oxybutylene copolymer.3. The ...

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Номер записи: 86

07-02-2019 дата публикации

EPOXY RESIN COMPOSITION, SEMI-CURED EPOXY RESIN COMPOSITION, CURED EPOXY RESIN COMPOSITION, MOLDED ARTICLE, AND CURED MOLDED ARTICLE

Номер: US20190040183A1

Автор: AMANO Yoshihiro, Katagi Hideyuki, KOSUGI Shinichi, SUE Haruaki, Takezawa Yoshitaka, Tanaka Kenji, Yoshida Yuka

Принадлежит:

Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole. 8. The epoxy resin composition according to claim 6 , wherein claim 6 , in the curing agent claim 6 , a content ratio of a monomer claim 6 , which is the same as a phenol compound constituting the novolac resin claim 6 , is from 10% by mass to 50% by mass.9. The epoxy resin composition according to claim 1 , further comprising an inorganic filler.10. The epoxy resin composition according to claim 9 , wherein the inorganic filler comprises at least one selected from the group consisting of alumina claim 9 , boron nitride claim 9 , aluminum nitride claim 9 , silica claim 9 , and magnesium oxide.11. The epoxy resin composition according to or claim 9 , wherein a content ratio of the inorganic filler is from 60% by volume to 90% by volume with respect to solid content.12. The epoxy resin composition according to claim 1 , further comprising a silane coupling agent.13. The epoxy resin composition according to claim 12 , wherein the silane coupling agent comprises a phenyl group-containing silane coupling agent.14. A semi-cured epoxy resin composition claim 1 , which is a semi-cured product of the epoxy resin composition according to .15. A cured epoxy resin composition claim 1 , which is a cured product of the epoxy resin composition according to .16. A molded article produced by press-molding the epoxy resin composition according to .17. A cured molded article produced by post-curing the molded ...

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Номер записи: 87

09-02-2017 дата публикации

FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS

Номер: US20170042043A1

Автор: ANANTHAKRISHNAN NISHA, MIRPURI KABIRKUMAR J., NAGARAJAN Sivakumar, RAZDAN SANDEEP, WEINMAN CRAIG J.

Принадлежит:

A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5. 1. A method comprising: one or more epoxy resins having multiple functional groups and an epoxy equivalent weight (EEW) of 150-1,000;', 'a curing agent having a functional group selected from the group consisting of anhydride, acid and amine; and', 'a fluxing agent having a mono-carboxylic acid or di-carboxylic acid, and a pKa of 4-5., 'forming a fluxing-encapsulant material comprising2. The method of claim 1 , wherein the fluxing-encapsulant material further comprises 60-70% by weight of a filler having a surface coating which is non-reactive with the multiple functional groups of the one or more epoxy resins.3. The method of claim 1 , wherein the one or more epoxy resins is a di-functional epoxy resin or a tri-functional epoxy resin.4. The method of claim 1 , wherein the one or more epoxy resins comprises a mixture of a di-functional epoxy resin and a tri-functional epoxy resin.5. The method of claim 1 , wherein the curing agent is a cyclic acid anhydride.6. The method of claim 5 , wherein the cyclic acid anhydride is selected from the group consisting of succinic anhydride claim 5 , benzoic anhydride and phthalic anhydride claim 5 , and their hydrogenated versions.7. The method of claim 2 , wherein:the one or more epoxy resins comprises a di-functional epoxy resin or tri-functional epoxy resin;the cyclic acid anhydride is selected from the group consisting of succinic anhydride, benzoic anhydride and phthalic anhydride; andthe filler has a maximum particle size less than 5 ...

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Номер записи: 88

06-02-2020 дата публикации

PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, STACKED STRUCTURE, METHOD FOR FABRICATING THE STACKED STRUCTURE, AND DISPLAY DEVICE

Номер: US20200040131A1

Автор: FUKAMOTO Yusuke, MATSUKAWA Yozo, MATSUNO Koso, NAKATANI Morio, Yoshida Shinsuke

Принадлежит: Panasonic Intellectual Property Management Co., Ltd.

An adhesive contains: (A) a monofunctional epoxy compound having one epoxy group per molecule; (B) a polyfunctional epoxy compound having two or more epoxy groups per molecule; (C) a photo cation generator; (D) an acrylic compound; (E) a photo-radical generator; and at least one compound selected from the group consisting of (F) a monofunctional oxetane compound and (H) a polyfunctional oxetane compound. 1. An adhesive comprising:a monofunctional epoxy compound having one epoxy group per molecule as Component (A);a polyfunctional epoxy compound having two or more epoxy groups per molecule as Component (B);a photo cation generator as Component (C);an acrylic compound as Component (D);a photo-radical generator as Component (E); andat least one compound selected from the group consisting of a monofunctional oxetane compound as Component (F) and a polyfunctional oxetane compound as Component (H).2. The adhesive of claim 1 , whereinthe Component (A) includes at least one compound selected from the group consisting of: polyethylene glycol monoglycidyl ether; polypropylene glycol monoglycidyl ether; and polytetramethylene glycol monoglycidyl ether, andthe Component (B) includes at least one compound selected from the group consisting of: polyethylene glycol diglycidyl ether; polypropylene glycol diglycidyl ether; and polytetramethylene glycol diglycidyl ether.3. The adhesive of claim 1 , whereina ratio by mass of total content of the Components (A) and (B) to content of the Component (D) falls within a range from 5:95 to 90:10.4. A stacked structure comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a cured product of the adhesive of ;'}a first member; anda second member,the first member and the second member being fixed together with the cured product.5. A method for fabricating a stacked structure claim 1 , the method comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'an arrangement step of arranging an uncured coating of the adhesive of on at least ...

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Номер записи: 89

06-02-2020 дата публикации

METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS

Номер: US20200040215A1

Автор: BURCKHARDT Urs, KASEMI Edis, KRAMER Andreas, STADELMANN Ursula

Принадлежит: SIKA TECHNOLOGY AG

A process for preparing a curing agent for epoxy resins, in which an amine mixture including at least one parent amine of the formula (I) and at least one alkylated amine of the formula (II) is reacted or adducted with at least one glycidyl ether of the formula (III). The amine mixture is especially a reaction mixture from the partial alkylation of the amine of the formula (I). The process described enables, with low energy expenditure and high space-time yield, curing agents of low odor, low toxicity, low viscosity and high reactivity for epoxy resins and epoxy resin products that cure rapidly at ambient temperatures and especially also under cold conditions and at the same time enable high-quality coatings having an even, shiny surface. 2. The process as claimed in claim 1 , wherein A is an alkylene radical having 2 to 6 carbon atoms.3. The process as claimed in claim 1 , wherein X is a hydrogen radical.4. The process as claimed in claim 1 , wherein the amine mixture claim 1 , as well as at least one monoalkylated amine of the formula (II) in which X is a hydrogen radical claim 1 , additionally contains at least one dialkylated amine of the formula (II) in which X is Y.6. The process as claimed in claim 1 , wherein Y is selected from the group consisting of cyclohexylmethyl claim 1 , benzyl claim 1 , 1-phenylethyl and 1-naphthylmethyl.7. The process as claimed in claim 1 , wherein Z is the residue of o- claim 1 , m- or p-cresyl glycidyl ether claim 1 , bisphenol A diglycidyl ether claim 1 , bisphenol F diglycidyl ether or bisphenol A/F diglycidyl ether after removal of the glycidoxy groups.8. The process as claimed in claim 1 , wherein the primary amino groups are present in a stoichiometric excess over the epoxy groups.9. The process as claimed in claim 1 , wherein the molar ratio between the parent amine of the formula (I) and the epoxy groups is in the range from 1/1 to 15/1.10. The process as claimed in claim 1 , wherein parent amine of the formula (I) that ...

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Номер записи: 90

18-02-2021 дата публикации

Epoxy Resin Material, Preparation Method Therefor And Application Thereof

Номер: US20210047459A1

Автор: Changkun Chu, Congying ZHANG, Meng Zhou, Qingmei JIANG, Xiaoli Sun, Xin Li, Xiucai Du, Zhaoxing Liu

Принадлежит: Wanhua Chemical Group Co Ltd

The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85° C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

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Номер записи: 91

18-02-2021 дата публикации

Fast-cure resin formulations with consistent handling characteristics

Номер: US20210047460A1

Автор: Andrew Gibbs, Lewis Williams, Stephen CORDEN

Принадлежит: Cytec Industries Inc

The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20° C. and 60° C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

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Номер записи: 92

18-02-2016 дата публикации

ORGANIC VEGETABLE OIL BASED RESIN AND PREPARATION METHOD THEREOF

Номер: US20160046759A1

Автор: Katzakian Arthur, Katzakian Craig

Принадлежит:

Disclosed are organic, UV resistant epoxy resins derived largely from vegetable oil based materials. More specifically, the present invention provides a virtually non-toxic, hypoallergenic UV resistant resin and method of producing and using the same that gives off substantially no VOCs and no disagreeable odors. The composition comprises a vegetable oil-based polyfunctional carboxylic acid, a cycloaliphatic anhydride, and an epoxy compound either of bicyclic difunctional epoxy resin, epoxidized vegetable oil or epoxidized polymer chains. The composition further comprises a catalyst and a wetting agent. In its cured state the material is leather like and exhibits high tensile strength as well as unusually high, totally reversible elongation. In an alternative embodiment, the resin comprises a cyclic anhydride (Lindride 16E). With increased amounts of cyclic anhydride, increased heat distortion temperature is exhibited; all while maintaining a high reversible elongation and high tensile strength In an additional alternative, an increased amount of Chromium III Octoate is used and in another alternative Phosphoric Acid. 1. An epoxy resin composition comprising:a) from 15 to 55 weight percent trimer acid;b) from 10 to 30 weight percent Lindride 16E;c) from 40 to 50 weight percent epoxidized linseed oil;d) from 3 to 6 weight percent 2-ethylhexanoic acid salt of Chromium III; ande) from 0.5 to 1 weight percent Mapeg 400.2. The epoxy resin composition according to further comprising a phosphoric acid solution claim 1 , wherein said phosphoric acid solution is in a ratio by weight of phosphoric acid solution to epoxidized linseed oil from 1:75 to 1:25.3. The epoxy resin composition according to wherein the epoxy compound comprises bicyclic difunctional epoxy resin.4. The epoxy resin composition according to wherein the bicyclic difunctional epoxy resin is CY179.5. An epoxy resin composition comprising:about 15%-55% by weight of trimer and/or dimer acids;about 10%-30% by ...

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Номер записи: 93

01-05-2014 дата публикации

ADDUCTS AS TOUGHENERS IN THERMOSETTABLE EPOXY SYSTEMS

Номер: US20140121299A1

Автор: Feng Yan L., Gan Joseph, Yan Patrick P., Zhang Wayne Y.

Принадлежит: Dow Global Technologies LLC

A liquid adduct consisting essentially of a reaction product of (a) an aliphatic epoxy resin, and (b) an isocyanate compound, wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C. is disclosed. The adduct can be used in an epoxy resin composition. 1. A liquid adduct consisting essentially of a reaction product of(a) an aliphatic epoxy resin, and(b) an isocyanate compound; wherein the viscosity of the adduct comprises less than about 60 Pa-s at about 25° C.2. The adduct of claim 1 , wherein the epoxy resin comprises a polyglycol epoxy resin.3. The adduct of claim 1 , wherein the polyglycol epoxy resin comprises polypropylene glycol claim 1 , polyethylene glycol claim 1 , and mixtures thereof.4. (canceled)5. The adduct of wherein the isocyanate compound is a polyfunctional isocyanate compound.6. (canceled)7. The adduct of including (c) a catalyst.8. The adduct of wherein the weight ratio of (a) to (b) is between 60 to 98 for component (a) and 40 to 2 for component (b).9. The adduct of wherein the isocyanate compound is selected from the group consisting of MDI claim 1 , TDI claim 1 , hydrogenated MDI claim 1 , hydrogenated TDI claim 1 , and combinations thereof.10. The adduct of wherein the polyglycol epoxy resin is selected from the group consisting of poly propyleneglycol diglycidyl ether claim 1 , dipropyleneglycol diglycidyl ether claim 1 , 1 claim 1 ,6-Hexanediol diglycidyl ether claim 1 , 1 claim 1 ,4-Butanediol diglycidyl ether and combinations thereof.12. The adduct of wherein the catalyst is selected from the group consisting of 2-methyl imidazole claim 7 , 2-phenyl imidazole claim 7 , an imidazole derivative claim 7 , 1 claim 7 ,8-diazabicyclo[5.4.0]undec-7-ene (DBU) claim 7 , 2-methylimidazole-epoxy adduct claim 7 , an isocyanate-amine adduct claim 7 , and combinations thereof.13. A composition comprising (a) the adduct of ; (b) at least one epoxy resin; and (c) at least one hardener.14. The composition according to claim 13 ...

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Номер записи: 94

16-02-2017 дата публикации

ALICYCLIC DIEPOXY COMPOUND HAVING BIS-SPIRONORBORNANE STRUCTURE, METHOD FOR PRODUCING THE SAME, AND USE THEREOF

Номер: US20170044179A1

Автор: Matsumoto Takaya, Watanabe Daisuke

Принадлежит: JX NIPPON OIL & ENERGY CORPORATION

An alicyclic diepoxy compound represented by the following general formula (1): 2. The alicyclic diepoxy compound according to claim 1 , whereinn in the general formula (1) is 2 or 3.3. The alicyclic diepoxy compound according to claim 1 , whereinn in the general formula (1) is 2.5. The method for producing an alicyclic diepoxy compound according to claim 4 , whereinn in the general formula (1) is 2 or 3.6. The method for producing an alicyclic diepoxy compound according to claim 4 , whereinn in the general formula (1) is 2.7. The method for producing an alicyclic diepoxy compound according to claim 4 , whereinan epoxidation reaction is conducted in the presence of a hydrogen peroxide solution, a heteropoly acid catalyst, and a surfactant.9. The alicyclic monoepoxy compound according to claim 8 , whereinn in the general formula (3) is 2 or 3.10. The alicyclic monoepoxy compound according to claim 8 , whereinn in the general formula (3) is 2.11. A monomer for producing a polymer material claim 1 , comprising the alicyclic diepoxy compound according to . The present invention relates, in particular, to a multifunctional compound usable for a polymer material obtained through a condensation reaction or a curing reaction, wherein the multifunctional compound is an alicyclic diepoxy compound which gives a polymer material excellent in transparency and heat resistance, as well as a method for producing the alicyclic diepoxy compound and a production intermediate of the alicyclic diepoxy compound. In addition, the alicyclic diepoxy compound relating to the present invention can be chemically modified, and hence can also be used as a reaction intermediate of various compounds.Recent high-performance polymer materials used in the field of optics have been required to have both high transmittance of and light resistance (weatherability) against blue light to ultraviolet light (with wavelengths of 500 nm to 380 nm) mainly from the viewpoint of their mode of use and heat ...

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Номер записи: 95

16-02-2017 дата публикации

COMPOSITION FOR MANUFACTURING EPOXY/ANHYDRIDE VITRIMER RESINS INCLUDING AN ORGANIC CATALYST

Номер: US20170044305A1

Автор: Disson Jean-Pierre, DUQUENNE Christophe, Gentilhomme Philippe, Melas Michel

Принадлежит: Arkema France

The present invention relates to a composition containing, in addition to a thermosetting epoxy resin and an anhydride hardener, at least one vitrimer-effect organic catalyst. Said composition enables vitrimer resins to be manufactured, i.e., resins that are deformable in the thermoset state. Said invention also relates to a kit for manufacturing said composition, to an object obtained from said composition and to a kit for manufacturing said object. 2. The composition as claimed in claim 1 , wherein Rand Rform claim 1 , together and with the atoms to which they are bonded claim 1 , a saturated or unsaturated heterocycle claim 1 , and wherein Rand Rform claim 1 , together and with the atoms to which they are bonded claim 1 , a saturated or unsaturated heterocycle.3. The composition as claimed in claim 1 , wherein the catalyst is triazabicyclodecene (TBD).4. The composition as claimed in claim 1 , wherein the catalyst represents from 0.1 to less than 5 mol % claim 1 , relative to the molar amount of epoxy functions contained in said thermosetting resin.5. The composition as claimed in claim 1 , wherein the thermosetting resin is bisphenol A diglycidyl ether (DGEBA).6. The composition as claimed in claim 1 , wherein the amount of curing agent is such that the number of moles of epoxide functions of the thermosetting resin ranges from 50% to 300% claim 1 , relative to the number of moles of anhydride functions of the curing agent.7. The composition as claimed in claim 1 , wherein the content of thermosetting resin and of curing agent ranges from 10% to 90% by weight claim 1 , relative to the total weight of the composition claim 1 , the remainder to 100% being provided by the catalyst and optionally by one or more additional compounds selected from the group consisting of: polymers claim 1 , pigments claim 1 , dyes claim 1 , fillers claim 1 , plasticizers claim 1 , long or short claim 1 , woven or nonwoven fibers claim 1 , flame retardants claim 1 , antioxidants claim ...

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Номер записи: 96

16-02-2017 дата публикации

USE OF A VITRIMER-TYPE THERMOSETTING RESIN COMPOSITION FOR MANUFACTURING ELECTRICAL INSULATION PARTS

Номер: US20170047142A1

Автор: Disson Jean-Pierre, DUQUENNE Christophe, Melas Michel

Принадлежит: Arkema France

The present invention relates to the use, for manufacturing electrical insulation parts, of a composition including, in addition to an epoxy-type thermosetting resin and a hardening agent, at least one organic catalyst having a vitrimer effect. Said composition allows the production of vitrimer resins, i.e., resins that are deformable in the thermoset state, which have properties that are suitable for use in electrical insulation parts. The invention also relates to a method for preparing electrical insulation parts using the aforementioned composition. 2. The process as claimed in claim 1 , wherein the thermosetting resin is bisphenol A diglycidyl ether (BADGE).3. The process as claimed in claim 1 , wherein the curing agent is selected from the group consisting of carboxylic acid anhydrides comprising at least one —C(O)—O—C(O)— functional group and acids comprising at least two carboxylic acid —C(O)OH functional groups.4. The process as claimed in claim 1 , wherein the vitrimer-effect catalyst is selected from triazabicyclodecane (TBD) claim 1 , di(ortho-tolyl)guanidine (DOTG) or 1 claim 1 ,3-diphenyiguanidine (DPG).5. The process as claimed in claim 1 , wherein the catalyst represents from 0.1 to less than 5 mol % claim 1 , relative to the molar amount of epoxy functional groups present in said thermosetting resin.6. The process as claimed claim 1 , wherein the composition additionally comprises at least one filler selected from the group consisting of: inorganic oxides claim 1 , inorganic hydroxides and inorganic oxyhydroxides; calcium carbonate; nitrides; carbides; whiskers; and their mixtures.7. The process as claimed in claim 6 , wherein the fillers represent from 5 to 80% by weight claim 6 , with respect to the total weight of the composition.8. The process as claimed in claim 1 , wherein the electrical insulation part is selected from: an electrical insulator of electrical or electronic components claim 1 , in the molded form or in the form of a matrix claim ...

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Номер записи: 97

19-02-2015 дата публикации

MODIFIED EPOXY RESIN COMPOSITION USED IN HIGH SOLIDS COATING

Номер: US20150051317A1

Автор: CHEN CHEN, SHEN Yue, Wu Yan, Yang Yurun

Принадлежит:

This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating. 2. The epoxy resin composition according to which comprises claim 1 , based on the total weight of the composition claim 1 , from 30% to 70% by weight of the compound of formula (I) claim 1 , and from 30% to 70% by weight of the compound of formula (V).4. The epoxy resin composition according to wherein the compound of formula (VI) is in the range of from 15% to 55% by weight claim 3 , based on the total weight of the composition.7. The epoxy resin composition according to wherein n is 0.8. The epoxy resin composition according to wherein x is 1.9. A low VOC high solids coating composition comprising the epoxy resin composition according to claim 1 , which further includes from 20% to 90% by weight claim 1 , based on the total weight of the epoxy resin composition claim 1 , a phenalkamine hardener.10. A low VOC high solids coating composition comprising the modified epoxy resin composition according to claim 1 , which further includes one or more of a hardener claim 1 , an organic solvent claim 1 , a pigment claim 1 , a filler claim 1 , and a flow control agent. This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, and its application in low volatile organic compounds (VOC) high solids coating.Epoxy based anti-corrosion coatings are widely used for the protection of metal and concrete substrates. Due to increasing awareness of environmental protection and severe environmental requirements, low VOC coating system attracted more and more attention from both paint producer and end customers. From technical view of point, one approach to achieve low VOC coating is to prepare high solids coating with reduced solvent addition using ...

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Номер записи: 98

03-03-2022 дата публикации

Cationically curable composition and method for the joining, casting and coating of substrates using the composition

Номер: US20220064367A1

Автор: ANSELMENT Timo, KREUL Kilian, SCHOLZ Michael, UHL Gerald, ZINK Sebastian

Принадлежит:

The invention relates to a cationically curable composition with at least one cationically polymerizable component, a first photoinitiator releasing an acid when irradiated with actinic radiation of a first wavelength λ, and a second photoinitiator releasing an acid when irradiated with actinic radiation of a second wavelength λ, wherein the second wavelength λis shorter than the first wavelength λ, and wherein the second photoinitiator, after irradiation of the composition with actinic radiation of the first wavelength λ, shows an absorption of actinic radiation of the second wavelength λin the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.

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Номер записи: 99

03-03-2022 дата публикации

Coating composition and wood article manufactured therefrom

Номер: US20220064455A1

Автор: Hongbin Chen, Shigang Fan, Song Niu, Xi Zhao

Принадлежит: Guangdong Huarun Paints Co Ltd

The present application relates to a coating composition and wood article manufactured therefrom, the coating composition comprising: (A) a film-forming resin composition comprising a reactive donor capable of providing two or more nucleophilic carbanions, and a reactive acceptor comprising two carbon-carbon double bonds; (B) a catalyst for catalyzing the Michael addition crosslinking reaction between the reactive donor and the reactive acceptor, wherein at least one of the reactive acceptor and the reactive donor comprises an aromatic ring structure, and wherein the polymer formed by homopolymerization of the reactive acceptor has a Tg of 100° C. or higher.

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Номер записи: 100