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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 4888. Отображено 100.
03-01-2013 дата публикации

Polyetherimide resins with very low levels of residual contamination

Номер: US20130003227A1
Принадлежит: SABIC INNOVATIVE PLASTICS IP BV

Compositions and methods for producing compositions comprising a monoamine-endcapped polyimide component. Based on a gas chromatography mass spectroscopy analysis of a surface rinse of the composition performed at room temperature, the composition can have at least one surface with less than or equal to 5 ppb releasable phosphorous residuals, and less than or equal to 5 ppb releasable volatile organic compound residuals. The composition can also comprise less than or equal to 10 ppb combined releasable residuals. Because of the very low levels of residual contamination, the compositions can be used to produce a variety of articles, including a disk drive.

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03-10-2013 дата публикации

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Номер: US20130260125A1
Принадлежит: SABIC INNOVATIVE PLASTICS IP B.V.

Polyetherimide compositions of formula (1) are described wherein the polyetherimide compositions comprise a polyetherimide comprising a reacted combination of alkali metal salts comprising an alkali metal salt of a dihydroxy aromatic compound and an alkali metal salt of a monohydroxy aromatic compound with a bis(halophthalimide), wherein the alkali metal salt of the monohydroxy aromatic compound is included in an amount of more than 0 and less than 5 mole percent, based on the total moles of the alkali metal salts, and the polyetherimide has a weight average molecular weight greater than or equal to 43,000 Daltons. The polyetherimide exhibits lower levels of chlorine and chlorine end groups, lower levels of bis(halophthalimide) and bis(phthalimide), and low plate-out during manufacturing. 3. The polyetherimide composition of claim 1 , wherein the polyetherimide comprises from 0.5 to 4 weight percent of a monohydroxy aromatic compound substituent claim 1 , based on the total weight of the polyetherimide.4. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) and residual bis(phthalimide) is less than 0.05 weight percent claim 1 , based on the total weight of the polyetherimide.5. The polyetherimide composition of claim 1 , wherein a total content of residual bis(halophthalimide) is less than 600 ppm claim 1 , based on the total weight of the polyetherimide.6. The polyetherimide composition of claim 1 , wherein a content of chloride is less than 3000 ppm claim 1 , based on the total weight of the polyetherimide.7. The polyetherimide composition of claim 1 , wherein the polyetherimide has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a 100° F. (37.8° C.) mold having the dimensions of 5×6×0.16 inches (12.7×15.2×0.4 cm).8. The polyetherimide composition of claim 1 , wherein the polyetherimide has a plate-out weight of less than 1.1 mg claim 1 , when determined using 200 shots from a ...

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31-10-2013 дата публикации

POLYIMIDE POWDER, POLYIMIDE SOLUTION, AND METHOD FOR PRODUCING POLYIMIDE POWDER

Номер: US20130289204A1
Автор: Kanazawa Chikao
Принадлежит:

It is possible to provide polyimide powder which has an average size of 25 μm or less and is free from metal impurities which would otherwise be produced due to abrasion of a machine used for mechanical milling. 1. Polyimide powder comprising an aggregate of fine particles produced through precipitation of polyimide dissolved in a treatment solution containing a basic substance , whereina residual amount of alkali metal derived from the basic substance contained in the treatment solution is 1% or less of a total amount of the polyimide powder.2. The polyimide powder according to claim 1 ,wherein polyamic acid contained in the fine particles is polymerized by heating to form polyimide.3. A polyimide solution defined by a solution of the polyimide powder according to dissolved or dispersed in a solvent.4. A method for producing polyimide powder comprising the steps of:dissolving polyimide in a treatment solution containing a basic substance;obtaining powder by precipitation of fine particles of polyimide by the means of mixing the resultant treatment solution with an acidic substance; andremoving, from the powder, alkali metal derived from the basic substance until a residual amount of alkali metal is 1% or less of a total amount of the polyimide powder.5. The method for producing polyimide powder according to claim 4 ,wherein the basic substance is potassium hydroxide.6. A polyimide solution defined by a solution of the polyimide powder according to dissolved or dispersed in a solvent. The present invention relates to: polyimide powder and a polyimide solution which are available for a heat-resistant electric part, an automobile part, a mold for forming a screw of a glass bin, and an adhesive; and a method for producing the polyimide powder.In the past, to recycle and utilize a large number of polyimide films discarded as industrial waste, such polyimide films have been crushed into powder by a mill. Alternatively the waste polyimide films have been subjected to ...

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14-11-2013 дата публикации

CHLORO-SUBSTITUTED POLYETHERIMIDES HAVING IMPROVED RELATIVE THERMAL INDEX

Номер: US20130303698A1
Принадлежит: SABIC INNOVATIVE PLASTICS IP B.V.

A polyetherimide having an OH content that is greater than 0 and equal or less than 100 ppm; and a chlorine content that is greater than 0 ppm is disclosed herein. A method for preparing the polyetherimide is also disclosed. 1. A polymer comprising a polyetherimide having an OH content that is greater than 0 and less than or equal to 100 parts per million by weight (ppm) and a chlorine content that is greater than 0 ppm.3. The polyetherimide of claim 1 , wherein chlorine content is present in an amount greater than 0 to 4 claim 1 ,000 ppm.4. The polyetherimide of claim 1 , wherein the polyetherimide has a flame retardant rating of V0 at 1.5 mm.5. The polyetherimide of claim 3 , wherein the polyetherimide has a flame retardant rating of V0 at 0.8 mm.7. A composition comprising the polyetherimide of claim 6 , and an additional polymer.8. The composition of claim 6 , wherein the polymer is selected from the group consisting of polyesters claim 6 , polycarbonates claim 6 , polyolefins claim 6 , polysulfones claim 6 , polyphenylene sulfides claim 6 , polyetheretherketones claim 6 , polyethersulfones claim 6 , polyamides claim 6 , polyamideimides claim 6 , polyimides other than the polyetherimide of claim 6 , and combinations thereof.9. A composition comprising the polyetherimide of and an additional polymer.10. The composition of claim 1 , wherein the polymer is selected from the group consisting of polyesters claim 1 , polycarbonates claim 1 , polyolefins claim 1 , polysulfones claim 1 , polyphenylene sulfides claim 1 , polyetheretherketones claim 1 , polyethersulfones claim 1 , polyamides claim 1 , polyamideimides claim 1 , polyimides other than the polyetherimide of claim 1 , and combinations thereof.11. A method for preparing the polyetherimide of claim 1 , which comprises contacting claim 1 , in o-dichlorobenzene or anisole as diluent claim 1 , substantially equimolar amounts of a disodium salt of a dihydroxy compound of formula HO—R′—OH claim 1 , and a slurry of a ...

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16-01-2014 дата публикации

Polyetherimide resins with very low levels of residual contamination

Номер: US20140016450A1
Принадлежит: SABIC INNOVATIVE PLASTICS IP BV

Compositions and methods for producing compositions comprising a monoamine-endcapped polyimide component. Based on a gas chromatography mass spectroscopy analysis of a surface rinse of the composition performed at room temperature, the composition can have at least one surface with less than or equal to 5 ppb releasable phosphorous residuals, and less than or equal to 5 ppb releasable volatile organic compound residuals. The composition can also comprise less than or equal to 10 ppb combined releasable residuals. Because of the very low levels of residual contamination, the compositions can be used to produce a variety of articles including a disk drive.

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06-01-2022 дата публикации

Polyimide component, polyimide film, and polyimide copper clad laminate

Номер: US20220002490A1
Принадлежит: Zhen Ding Technology Co Ltd

A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is:The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.

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07-01-2016 дата публикации

Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device

Номер: US20160002407A1
Принадлежит: TORAY INDUSTRIES INC

The present invention is based on a polyimide precursor having unit structures represented by general formula (1) and unit structures represented by general formula (2), provides a polyimide precursor for which film whitening, cracking and bubbling do not occur regardless of film baking conditions, and provides a flexible TFT array, a flexible color filter, and a flexible substrate with a gas barrier layer using the polyimide precursor, and a flexible display device, etc. using same. (In general formulas (1) and (2), X 1 -X 4 each independently represents a hydrogen atom, C1 to C10 monovalent organic group or C1 to C10 monovalent alkylsilyl group. R 1 is represented by general formula (3) and R 2 is represented by general formula ( 4 ).) (In general formula (4), R 3 and R 4 each independently represents a C1 to C10 monovalent organic group.)

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01-01-2015 дата публикации

POLYIMIDE RESINS CONTAINING POLYMALEIC ANHYDRIDE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20150004862A1
Принадлежит:

The invention relates to a polyimide containing polymaleic anhydride having the formula: 2. A polyimide resin containing polymaleic anhydride , the polymaleic anhydride acting as a main chain , and the polymaleic anhydride grafting with a plurality of short chains at side chain positions , wherein each short chain has polyimide structure.3. A method for manufacturing a polyimide resin containing polymaleic anhydride comprising steps of: (a) dissolving and reacting a dianhydride with a diamine in a solvent to form polyamic acid; (b) reacting polymaleic anhydride with the polyamic acid produced by the step (a) to form the polymaleic anhydride grafting with —NH—CO— group and oligomer having carboxylic acid group at side chains; and (c) carrying out a chemical ring-closure of the polyamic acid by adding a catalyst.4. The method for manufacturing a polyimide resin containing polymaleic anhydride of claim 3 , further comprising before the step (c) claim 3 , crosslinking the polymaleic anhydride grafting with —NH—CO— group and oligomer having carboxylic acid group at side chains with another polymaleic anhydride grafting with —NH—CO— group and oligomer having carboxylic acid group at side chains.5. The method for manufacturing a polyimide resin containing polymaleic anhydride of claim 3 , wherein the solvent is N-methyl pyrrolidin ketone claim 3 , N claim 3 ,N-dimethyl-formylamide claim 3 , N claim 3 ,N-dimethyl-acetamide or diethylene glycol monomethyl ether.6. The method for manufacturing a polyimide resin containing polymaleic anhydride of claim 3 , wherein the catalyst of the step (c) is pyridine and beta-picoline.7. The method for manufacturing a polyimide resin containing polymaleic anhydride of claim 3 , wherein to the step (c) claim 3 , a dehydrating agent is added.8. The method for manufacturing a polyimide resin containing polymaleic anhydride of claim 7 , wherein the dehydrating agent is acetic anhydride claim 7 , propionic anhydride claim 7 , butyric anhydride ...

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04-01-2018 дата публикации

LAMINATED BODY COMPRISING METAL WIRE LAYER, AND MANUFACTURING METHOD THEREFOR

Номер: US20180007799A1
Принадлежит: LG CHEM, LTD.

The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape. 1. A laminate structure comprising a carrier substrate , a debonding layer disposed on at least one surface of the carrier substrate and comprising a polyimide resin , a metal wiring layer disposed in contact with the debonding layer , and a flexible substrate layer disposed in contact with the metal wiring layer wherein the adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer.2. The laminate structure according to claim 1 , wherein the debonding layer has a thickness of 0.05 to 5 μm.3. The laminate structure according to claim 1 , wherein the metal wiring layer comprises a plurality of metal wires and the flexible substrate layer surrounds the metal wires and is in contact with the debonding layer to embed the metal wires therein.4. The laminate structure according to claim 3 , wherein the metal wires are arranged at intervals ...

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14-01-2021 дата публикации

Polyamic acid and method for producing same, polyamic acid solution, polyimide, polyimide film, laminate and method for producing same, and flexible device and method for producing same

Номер: US20210009760A1
Принадлежит: Kaneka Corp

A polyamic acid according to one or more embodiments of the present invention contains a structural unit represented by general formula (1) and a structural unit represented by general formula (2). In general formula (1), the plurality of R 1 s are each independently a hydrogen atom, a monovalent aliphatic group or an aromatic group. In general formula (2), the plurality of R 2 s are each independently an alkyl group having 1-3 carbon atoms or an aryl group having 6-10 carbon atoms. In general formulas (1) and (2), X is a tetravalent organic group. In general formula (2), the plurality of Ys are each independently an alkylene group having 1-3 carbon atoms or an arylene group having 6-10 carbon atoms, and m is an integer of 51-199.

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11-01-2018 дата публикации

PHOTOSENSITIVE COLORED RESIN COMPOSITION

Номер: US20180011404A1
Принадлежит: Toray Industries, Inc.

The invention aims to provide a photosensitive colored resin composition and a heat resistant colored resin film produced therefrom that has the function of absorbing light in the shorter visible wavelength range with high sensitivity to serve effectively as planarizing film, insulation layer, and barrier rib used in organic luminescence apparatuses and display elements and the function of reducing external light reflection. The photosensitive colored resin composition includes an alkali-soluble resin (a), a photosensitive compound (b), and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm, the photosensitive compound (b) containing a photosensitive compound (b1), the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less. 1. A photosensitive colored resin composition comprising an alkali-soluble resin (a) , a photosensitive compound (b) , and a compound (c) having an absorption maximum in the wavelength range of 400 nm or more and less than 490 nm , the photosensitive compound (b) containing a photosensitive compound (b 1) , the photosensitive compound (b1) being such that its maximum absorption wavelength in the range of 350 nm or more and 450 nm or less is located within the wavelength range of 350 nm or more and 390 nm or less.2. A photosensitive colored resin composition as set forth in claim 1 , wherein the photosensitive compound (b1) accounts for 5 parts by mass or more of the total quantity claim 1 , which accounts for 100 parts by mass claim 1 , of the photosensitive compound (b).3. A photosensitive colored resin composition as set forth in either claim 1 , wherein the photosensitive compound (b1) is a 4-naphthoquinone diazide sulfonyl ester compound.4. A photosensitive colored resin composition as set forth in claim 1 , wherein the alkali-soluble resin ...

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09-01-2020 дата публикации

WAVELENGTH-CONVERTING COMPONENT, PROJECTION APPARATUS AND MANUFACTURING METHOD OF THE WAVELENGTH-CONVERTING COMPONENT

Номер: US20200012179A1
Автор: KAO WEI-HUA, Tsai Yu-Lin
Принадлежит:

A wavelength-converting component includes a substrate, a wavelength-converting layer and a reflective layer. The wavelength-converting layer is disposed on the substrate. The reflective layer is disposed between the substrate and the wavelength-converting layer. The reflective layer includes a plurality of diffuse reflection particles and a first organic adhesive. The diffuse reflection particles are mixed in the first organic adhesive. The first organic adhesive includes an aromatic polyimide. The invention further provides a projection apparatus using the wavelength-converting component and provides a manufacturing method of the wavelength-converting component. The wavelength-converting component of the invention can improve mechanical properties such as shear strength, tensile strength and fatigue strength, temperature resistance and reflectivity, and can reduce rates of moisture absorption. The projection apparatus of the invention can reduce degradation in image brightness. 1. A wavelength-converting component , comprising:a substrate;a wavelength-converting layer, disposed on the substrate; anda reflective layer, disposed between the substrate and the wavelength-converting layer, the reflective layer comprises a plurality of diffuse reflection particles and a first organic adhesive, the diffuse reflection particles are mixed in the first organic adhesive, and the first organic adhesive comprises an aromatic polyimide.2. The wavelength-converting component according to claim 1 , wherein curing temperatures of the first organic adhesive are from 200° C. to 300° C.3. The wavelength-converting component according to claim 1 , wherein the wavelength-converting layer comprises a wavelength-converting material and a second organic adhesive claim 1 , the wavelength-converting material is mixed in the second organic adhesive claim 1 , and the second organic adhesive comprises an aromatic polyimide.4. The wavelength-converting component according to claim 3 , wherein ...

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28-01-2016 дата публикации

POLYIMIDE PRECURSOR COMPOSITION, METHOD FOR PREPARING POLYIMIDE PRECURSOR, POLYIMIDE MOLDED ARTICLE, AND METHOD FOR PREPARING POLYIMIDE MOLDED ARTICLE

Номер: US20160024255A1
Принадлежит:

A polyimide precursor composition includes a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride containing a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded, and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; and a first aqueous solvent containing water and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent, or a second aqueous solvent containing a water-soluble alcohol solvent and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent and a water-soluble ketone solvent, wherein the polyimide precursor is dissolved in the first aqueous solvent or the second aqueous solvent. 1. A polyimide precursor composition , comprising:a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride containing a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded, and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; anda first aqueous solvent containing water and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent, a water-soluble ketone solvent, and a water-soluble alcohol solvent, ora second aqueous solvent containing a water-soluble alcohol solvent and at least one water-soluble organic solvent selected from the group consisting of a water-soluble ether solvent and a water-soluble ketone solvent,wherein the polyimide precursor is dissolved in the first aqueous solvent or the second aqueous solvent.3. The polyimide precursor composition according to claim 1 , wherein the second tetracarboxylic dianhydride is a tetracarboxylic dianhydride ...

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28-01-2016 дата публикации

POLYIMIDE PRECURSOR COMPOSITION, METHOD FOR PREPARING POLYIMIDE PRECURSOR, POLYIMIDE MOLDED ARTICLE, AND METHOD FOR PREPARING POLYIMIDE MOLDED ARTICLE

Номер: US20160024256A1
Принадлежит:

A polyimide precursor composition includes a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride composed of a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound; a tertiary amine compound; and a water-soluble solvent containing at least one kind selected from the group consisting of water and aqueous alcohol, wherein the polyimide precursor and the tertiary amine compound are dissolved in the water-soluble solvent. 1. A polyimide precursor composition , comprising:a polyimide precursor including a condensation polymer of a tetracarboxylic dianhydride composed of a first tetracarboxylic dianhydride having a benzene ring to which two carboxylic anhydride groups are bonded and a second tetracarboxylic dianhydride other than the first tetracarboxylic dianhydride, and a diamine compound;a tertiary amine compound; anda water-soluble solvent containing at least one kind selected from the group consisting of water and aqueous alcohol,wherein the polyimide precursor and the tertiary amine compound are dissolved in the water-soluble solvent.3. The polyimide precursor composition according to claim 1 , wherein the second tetracarboxylic dianhydride is a tetracarboxylic dianhydride having two benzene rings to which one carboxylic anhydride group is bonded.4. The polyimide precursor composition according to claim 2 , wherein the second tetracarboxylic dianhydride is a tetracarboxylic dianhydride having two benzene rings to which one carboxylic anhydride group is bonded.5. The polyimide precursor composition according to claim 1 , wherein the tetracarboxylic dianhydrides include the first tetracarboxylic dianhydride in an amount of 40% by mole to 95% by mole.6. The polyimide precursor composition according to claim 2 , wherein the tetracarboxylic dianhydrides include the first ...

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26-01-2017 дата публикации

LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL DISPLAY ELEMENT

Номер: US20170022419A1
Автор: Chiou Shin-Rong
Принадлежит:

A liquid crystal alignment agent capable of forming a liquid crystal alignment film having good pre-tilt angle light stability, the liquid crystal alignment film, and a liquid crystal display element having the liquid crystal alignment film are provided. The liquid crystal alignment agent includes a polymer (A), a photosensitive polysiloxane (B), and a solvent (C). The polymer (A) is obtained by reacting a mixture, wherein the mixture includes a tetracarboxylic dianhydride component (a1) and a diamine component (a2). The diamine component (a2) includes a diamine compound (a2-1) represented by formula (1). The photosensitive polysiloxane (B) is obtained by reacting a silane compound (b1-1) containing an epoxy group and a cinnamic acid derivative (b2). 4. The liquid crystal alignment agent of claim 1 , wherein based on a usage amount of 100 moles of the diamine component (a2) claim 1 , a usage amount of the diamine compound (a2-1) is 0.5 moles to 20 moles.5. The liquid crystal alignment agent of claim 1 , wherein based on 100 parts by weight of the polymer (A) claim 1 , a usage amount of the photosensitive polysiloxane (B) is 3 parts by weight to 30 parts by weight; and a usage amount of the solvent (C) is 800 parts by weight to 4000 parts by weight.6. The liquid crystal alignment agent of claim 1 , wherein a molar equivalent ratio (b2)/(b1−1) of the cinnamic acid derivative (b2) to the silane compound (b1−1) containing an epoxy group is 0.1 to 0.7.7. The liquid crystal alignment agent of claim 1 , wherein an imidization ratio of the polymer (A) is 3% to 50%.8. A liquid crystal alignment film formed by the liquid crystal alignment agent of .9. A liquid crystal display element claim 8 , comprising the liquid crystal alignment film of . This application claims the priority benefit of Taiwan application serial no. 104123417, filed on Jul. 20, 2015. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this ...

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25-01-2018 дата публикации

BIS(AZOBENZENE) DIAMINES AND PHOTOMECHANICAL POLYMERS MADE THEREFROM

Номер: US20180022872A1

Bis(azo-benzene) diamine monomers and a method of synthesizing the monomers are provided. The bis(azo-benzene) diamine monomers, in combination with amine reactive monomers, form polymers, such as polyimides and copolyimides, having photomechanical and thermomechanical properties. 3. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —O—.4. The bis(azobenzene)-containing copolyimide of claim 2 , wherein L is —S—. This application is a divisional of U.S. application Ser. No. 15/584,464 (pending), filed May 2, 2017, which was a divisional of U.S. application Ser. No. 14/845,450, filed Sep. 4, 2015, which claims benefit of and priority to U.S. Provisional Patent Application Serial Nos. 62/046,433 and 62/046,372, each of which was filed on Sep. 5, 2014. The disclosure of each of these applications is incorporated herein by reference, in its entirety.The invention described herein may be manufactured and used by or for the Government of the United States for all governmental purposes without the payment of any royalty.The invention generally relates to bis(azobenzene)-containing diamines, as well as the polymers and copolymers made therefrom. More particularly, the invention relates to bis(azobenzene)-containing diamines, which are useful for preparing polyimide, polyamide, and poly(amide-imide) polymers and copolymers having photomechanical properties and methods of making the same.Photomechanical polymers are a special class of stimuli-responsive materials that can transduce light into mechanical work. Photo-initiated shape adaptivity or force generation (actuation) are particularly intriguing due to the salient features of light, namely, remote and wireless (contactless) triggering with ease of spatial, temporal, directional (through polarization), and magnitude (with intensity) control.Considerable effort has been undertaken in both the synthesis of photoresponsive polymers and the characterization of their photomechanical outputs. To date, ...

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22-01-2015 дата публикации

COMPOSITION, POLYMER FILM, AND DISPLAY DEVICE

Номер: US20150025200A1
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A composition including a diamine compound and a dianhydride compound, wherein the diamine compound includes a first diamine compound represented by Chemical Formula 1, 4. The composition of claim 1 , wherein the diamine compound further comprises a second diamine compound that is different from the first diamine compound.5. The composition of claim 1 , wherein the first diamine compound is included in a ratio of about 0.01 to about 1 mole based on a total of 1 mole of the dianhydride compound.6. The composition of claim 5 , wherein the first diamine compound is included in a ratio of about 0.01 to 0.4 moles based on 1 mole of the dianhydride compound.7. A polymer film comprising a polymer claim 1 , wherein the polymer is a polymerization product of the composition of .8. The polymer film of claim 7 , wherein the polymer is a polyamic acid claim 7 , a polyimide claim 7 , or a combination thereof.10. A display device comprising the polymer film of .11. The display device of claim 10 , wherein the polymer film is a substrate.12. The display device of claim 11 , further comprising a thin film transistor claim 11 , a liquid crystal device claim 11 , an organic light emitting diode claim 11 , or a combination thereof disposed on a side of the polymer film.20. The composition of claim 19 , wherein the dianhydride compound is at least one selected from 3 claim 19 ,3 claim 19 ,4 claim 19 ,4′-biphenyl tetracarboxylic dianhydride claim 19 , bicyclic[2.2.2]oct-7-ene-2 claim 19 ,3 claim 19 ,5 claim 19 ,6-tetracarboxylic dianhydride claim 19 , 3 claim 19 ,3′ claim 19 ,4 claim 19 ,4′-diphenylsulfone tetracarboxylic dianhydride claim 19 , 4 claim 19 ,4′-(hexafluoroisopropylidene)diphthalic anhydride claim 19 , 4 claim 19 ,4′-oxydiphthalic anhydride claim 19 , pyromellitic dianhydride claim 19 , and 4-(2 claim 19 ,5-dioxotetrahydrofuran-3-yl)-1 claim 19 ,2 claim 19 ,3 claim 19 ,4-tetrahydronaphthalene-1 claim 19 ,2-dicarboxylic anhydride. This application claims priority to Korean ...

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10-02-2022 дата публикации

Polyimide Film and Flexible Display Panel Including the Same

Номер: US20220041821A1
Принадлежит:

Provided are a polyimide-based film, a window cover film, and a display device including the same. More particularly, a polyimide-based based film which has a modulus of 5 GPa or more as measured using a universal testing machine (UTM) in accordance with ASTM D882, plastically deforms at a strain of 4% or more during stretching, and has a difference between a modulus in a machine direction Mmd and a modulus in a width direction Mtd satisfying the following Equation 1, is provided: 1. A polyimide-based film which has a modulus of 5 GPa or more as measured using a universal testing machine (UTM) in accordance with ASTM D882 , plastically deforms at a strain of 4% or more during stretching , and has a difference between a modulus in a machine direction Mmd and a modulus in a width direction Mtd satisfying the following Equation 1:{'br': None, 'i': 'Mmd−Mtd|≤', '|0.7 GPa.\u2003\u2003[Equation 1]'}2. The polyimide-based film of claim 1 , wherein an amount of energy required per a unit thickness μm of the polyimide-based film is 30 J/mor more claim 1 , at a point where plastic deformation occurs claim 1 , in a stress-strain curve measured using a universal testing machine (UTM).3. The polyimide-based film of claim 2 , wherein the amount of energy required per a unit thickness μm of the polyimide-based film is 30 to 100 J/m.4. The polyimide-based film of claim 1 , wherein a stress of the polyimide-based film is 1000 kgf/cmor more claim 1 , at a point where plastic deformation occurs.5. The polyimide-based film of claim 1 , wherein the polyimide-based film has a total light transmittance of 87% or more as measured at 400 to 700 nm in accordance with ASTM D1746 claim 1 , a light transmittance of 5% or more as measured at 388 nm in accordance with ASTM D1746 claim 1 , a haze of 2.0% or less claim 1 , and a yellow index of 5.0 or less.6. The polyimide-based film of claim 1 , wherein an elongation at break of the polyimide-based film is 15% or more in accordance with ASTM D882. ...

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25-01-2018 дата публикации

TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM

Номер: US20180024434A1
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

The present invention provides a tetracarboxylic acid diester compound shown by the following general formula (1), 2. The tetracarboxylic acid diester compound according to claim 1 , wherein Yin the general formula (2) is a linear or branched divalent organic group having 1 to 6 carbon atoms.13. A negative photosensitive resin composition comprising:{'claim-ref': {'@idref': 'CLM-00010', 'claim 10'}, '(A) the polyimide precursor polymer according to ;'}(B) a photo-radical initiator; and(D) a solvent.14. A negative photosensitive resin composition comprising:{'claim-ref': {'@idref': 'CLM-00009', 'claim 9'}, '(A′) the polyimide precursor polymer according to ;'}(B) a photo-radical initiator;(C) a crosslinking agent having two or more photo-polymerizable unsaturated linking groups per molecule; and(D) a solvent.15. A negative photosensitive resin composition comprising:{'claim-ref': {'@idref': 'CLM-00010', 'claim 10'}, '(A′) the polyimide precursor polymer according to ;'}(B) a photo-radical initiator;(C) a crosslinking agent having two or more photo-polymerizable unsaturated linking groups per molecule; and(D) a solvent.18. A patterning process comprising:{'claim-ref': {'@idref': 'CLM-00013', 'claim 13'}, '(1) applying the negative photosensitive resin composition according to onto a substrate to form a photosensitive material film;'}(2) exposing the photosensitive material film to a high energy beam having a wavelength of 190 to 500 nm or an electron beam via a photomask after a heat treatment; and(3) performing development with a developer of an organic solvent.19. The patterning process according to claim 18 , further comprising performing post-exposure bake between the exposing step and the development step.20. A method for forming a cured film claims 18 , comprising baking a film having a pattern formed by the patterning process according to at 100 to 300° C. and post-curing the film. The present invention relates to a tetracarboxylic acid diester compound useful ...

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23-01-2020 дата публикации

METHODS OF MANUFACTURE FOR POLYETHERIMIDE

Номер: US20200024398A1
Принадлежит:

A method of making polyetherimide includes: reacting a diamine having four bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic anhydride at an imidization reaction temperature and pressure in the presence of a solvent and a polymer additive to produce a mixture including 3,3′-bis(halophthalimide), 3,4′-bis(halophthalimide), 4,4′-bis(halophthalimide), solvent, and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 95:05 to 60:40; reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than 6 weight percent, based on the total weight of the polyetherimide, a glass transition temperature greater than or equal to 220° C., and a weight average molecular weight greater than or equal to 25,000 Daltons; wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure. 1. A method of making polyetherimide comprising: reacting a diamine having four bonds between the amine groups , 4-halophthalic anhydride and 3-halophthalic anhydride at an imidization reaction temperature and pressure in the presence of a solvent and a polymer additive to produce a mixture comprising 3 ,3′-bis(halophthalimide) , 3 ,4′-bis(halophthalimide) , 4 ,4′-bis(halophthalimide) , solvent , and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 95:05 to 60:40; reacting the mixture with alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 6 weight percent based on the total weight of the polyetherimide , a glass transition temperature greater than or equal to 220° C. , and a weight average molecular weight greater than or equal to 25 ,000 Daltons; wherein the polymer additive dissolves in the solvent at a temperature less than or equal to the imidization reaction temperature and ...

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01-02-2018 дата публикации

POLYIMIDE MIXTURE AND GAS SEPARATION MEMBRANE

Номер: US20180028984A1
Принадлежит: TAIWAN TEXTILE RESEARCH INSTITUTE

A polyimide mixture including a polyimide and an amino-containing silica particle is provided. The polyimide includes a repeating unit represented by formula 1: 2. The polyimide mixture of claim 1 , wherein based on a total weight of the polyimide claim 1 , a content of the amino-containing silica particle is 3 wt % to 30 wt %.3. The polyimide mixture of claim 1 , wherein based on a total weight of the polyimide claim 1 , a content of the amino-containing silica particle is 3 wt % to 20 wt %.4. The polyimide mixture of claim 1 , wherein an equivalent number of an amino in the amino-containing silica particle is 5 mmole/g to 10 mmole/g.5. The polyimide mixture of claim 1 , wherein the alkoxysilane shown in formula 2 comprises tetramethoxysilane claim 1 , tetraethoxysilane claim 1 , tetrapropoxysilane claim 1 , or tetrabutoxysilane claim 1 , and the alkoxysilane shown in formula 3 comprises 3-aminopropyltrimethoxysilane claim 1 , 3-aminopropyltriethoxysilane claim 1 , 3-aminoethylaminopropyltrimethoxysilane claim 1 , or 3-aminoethylaminopropyltriethoxysilane.6. The polyimide mixture of claim 1 , wherein the alkoxysilane shown in formula 2 comprises tetraethoxysilane claim 1 , and the alkoxysilane shown in formula 3 comprises 3-aminopropyltriethoxysilane.8. The polyimide mixture of claim 1 , wherein an intrinsic viscosity of the polyimide is 0.5 dL/g to 1.5 dL/g.9. A gas separation membrane made from the polyimide mixture of . This application claims the priority benefit of Taiwan application serial no. 105123560, filed on Jul. 26, 2016. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.The invention is related to a mixture, and more particularly, to a polyimide mixture and a gas separation membrane made from the polyimide mixture.The gas separation membrane selects gases mainly based on the difference of diffusion rates of those gases in the gas separation membrane. Therefore, the ...

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02-02-2017 дата публикации

METHODS OF MANUFACTURE OF SALTS OF HYDROXY-SUBSTITUTED AROMATIC COMPOUNDS AND POLYETHERIMIDES

Номер: US20170029568A1
Автор: CHAULAGAIN Mani Raj
Принадлежит:

A method for the manufacture of a metal salt of a hydroxy-substituted aromatic compound comprises reacting a hydroxy-substituted aromatic compound with a base comprising a metal cation in an aqueous medium to provide a mixture comprising water and a metal salt of the hydroxy-substituted aromatic compound; contacting the mixture with a substantially water-immiscible solvent at a temperature greater than the boiling point of water at a prevailing pressure; introducing an optionally substituted C1-6 aliphatic alcohol; and removing water and the alcohol to provide a slurry comprising the metal salt of the hydroxy-substituted aromatic compound and the water-immiscible solvent. 1. A method for the manufacture of a metal salt of a hydroxy-substituted aromatic compound , the method comprising:reacting a hydroxy-substituted aromatic compound with a base comprising a metal cation in an aqueous medium to provide a mixture comprising water and a metal salt of the hydroxy-substituted aromatic compound;contacting the mixture with a substantially water-immiscible solvent at a temperature greater than the boiling point of water at a prevailing pressure;{'sub': '1-6', 'introducing an optionally substituted Caliphatic alcohol; and'}removing water and the alcohol to provide a slurry comprising the metal salt of the hydroxy-substituted aromatic compound and the water-immiscible solvent.2. A method for the manufacture of a metal salt of a hydroxy-substituted aromatic compound , the method comprising:reacting a hydroxy-substituted aromatic compound with a base comprising a metal cation in an aqueous medium to provide a mixture comprising water and a metal salt of the hydroxy-substituted aromatic compound;contacting the mixture with a substantially water-immiscible solvent at a temperature greater than the boiling point of water at a prevailing pressure;partially removing water and the water-immiscible solvent from the contacted mixture to provide a water-immiscible, solvent-rich phase ...

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02-02-2017 дата публикации

METHODS OF MANUFACTURE OF SALTS OF HYDROXY-SUBSTITUTED AROMATIC COMPOUNDS AND POLYETHERIMIDES

Номер: US20170029569A1
Принадлежит:

A method for the manufacture of a metal salt of a hydroxy-substituted aromatic compound comprises: contacting a hydroxy-substituted aromatic compound with a base comprising a metal cation in molten diphenyl sulfone or sulfolane to provide a mixture comprising water, diphenyl sulfone or sulfolane, and a metal salt of the hydroxy-substituted aromatic compound; and removing water from the mixture in the absence of an azeotrope solvent to provide the metal salt of the hydroxy-substituted aromatic compound that contains less than 3,000 ppm of water. 1. A method for the manufacture of a metal salt of a hydroxy-substituted aromatic compound , the method comprising:contacting a hydroxy-substituted aromatic compound with a base comprising a metal cation in molten diphenyl sulfone or sulfolane to provide a mixture comprising water, diphenyl sulfone, or sulfolane, and a metal salt of the hydroxy-substituted aromatic compound; andremoving water from the mixture in the absence of an azeotrope solvent to form the metal salt of the hydroxy-substituted aromatic compound, wherein the metal salt of the hydroxy-substituted aromatic compound comprises less than 3,000 ppm of water.3. The method of claim 1 , wherein the hydroxyl-substituted aromatic compound is 2 claim 1 ,2-bis(4-hydroxyphenyl)propane or 4 claim 1 ,4′-dihydroxybiphenyl.4. The method of claim 1 , wherein the base is an alkali hydroxide claim 1 , an alkali carbonate claim 1 , an alkali bicarbonate claim 1 , or a combination comprising at least one of the foregoing.5. The method of claim 1 , wherein the base is sodium hydroxide or potassium hydroxide.6. The method of claim 1 , wherein the base and the hydroxy-substituted aromatic compound are present in amounts corresponding to a molar ratio of the base to the hydroxy-substituted aromatic compound which deviates from ideal stoichiometry by no more than 5 mole %.8. The method of claim 1 , wherein the contacting is carried out at a temperature in a range from 140° C. to 250° ...

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31-01-2019 дата публикации

MONOMER, POLYMER, COMPENSATION FILM, OPTICAL FILM, AND DISPLAY DEVICE

Номер: US20190031831A1
Принадлежит:

A monomer is represented by Chemical Formula 1: 7. A polymer being a product of reactants that comprises the monomer of and a diamine.8. The polymer of claim 7 , wherein the diamine is represented by Chemical Formula 5:{'br': None, 'sub': 2', '2, 'sup': 'c', 'NH—R—NH\u2003\u2003Chemical Formula 5'}wherein, in Chemical Formula 5,{'sup': 'c', 'sub': 2', '3', '2', '2', 'p', '2', 'q', '3', '2', '3', '2, 'Ris a substituted or unsubstituted C6 to C30 aromatic organic group, wherein the substituted or unsubstituted C6 to C30 aromatic organic group is present as a single aromatic ring; a fused ring including two or more aromatic rings; or a ring system including two or more of the single aromatic ring and/or the fused ring that are linked by a single bond, or a functional group selected from a fluorenylene group, a substituted or unsubstituted C1 to C10 cycloalkylene group, a substituted or unsubstituted C6 to C15 arylene group, —O—, —S—, —C(═O)—, —CH(OH)—, —S(═O)—, —Si(CH)—, —(CH)— (wherein, 1≤p≤10), —(CF)— (wherein, 1≤q≤10), —C(CH)—, —C(CF)—, —C(═O)NH—, or a combination thereof.'}10. The polymer of claim 9 , wherein the diamine represented by Chemical Formula 5 comprises at least one of the diamine represented by Chemical Formula 7 and the diamine represented by Chemical Formula 8.11. The polymer of claim 10 , wherein the diamine represented by Chemical Formula 7 comprises 2 claim 10 ,2′-bis(trifluoromethyl)benzidine (TFDB) claim 10 , and the diamine represented by Chemical Formula 8 comprises 4 claim 10 ,4′-diaminodiphenyl sulfone (DADPS).14. The polymer of claim 10 , wherein the polymer is a product of reactants comprising the monomer of claim 10 , and at least one of the dianhydride represented by Chemical Formula 10 and the dianhydride represented by Chemical Formula 11 in a mole ratio of about 90:10 to about 10:90.16. The polymer of claim 15 , wherein in Chemical Formula 12 claim 15 , Ris at least one of an unsubstituted phenylene group and an unsubstituted ...

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12-02-2015 дата публикации

POLYAMIDE ACID AND RESIN COMPOSITION CONTAINING SAME

Номер: US20150045502A1
Принадлежит: Toray Industries, Inc.

The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), δ represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and Rand Rrepresent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms. 5. A resin composition comprising: (a) polyamic acid as described in and (b) a solvent.6. A production method for polyamic acid as described in comprising:a step for reacting an amino group of a multivalent amine compound containing 3 or more primary amino groups with a compound that reacts with an amino group to form a structure as represented by chemical formula (1) given above, to form a multivalent amine derivative containing 2 or more primary amino groups and a structure as represented by chemical formula (1) anda step for polymerizing the multivalent amine derivative with tetracarboxylic acid or a derivative thereof.7. A production method for polyamic acid as described in comprising:a step for reacting an amino group of a diamine compound with a compound that reacts with an amino group to form a structure as represented by chemical formula (1) given above, to form a diamine derivative containing a primary amino group and a structure as represented by chemical formula (1) anda step for polymerizing the diamine derivative with tetracarboxylic acid or a derivative thereof.8. A production method for polyamic acid as described in comprising:a step for ...

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18-02-2021 дата публикации

POLYMER COMPOSITION

Номер: US20210047464A1
Принадлежит:

The present invention provides a composition containing an electron-donating polymer (D) and an electron-withdrawing polymer (A), wherein the electron-donating polymer (D) has a constitutional unit represented by the following formula (1a), Yin the following formula (1a) is a divalent group represented by the following formula (3a), and the electron-withdrawing polymer (A) has a constitutional unit represented by the following formula (4a): 2. The composition according to claim 1 , wherein Xis a divalent group represented by the formula (2a).4. The composition according to claim 3 , wherein Xis a divalent group represented by the formula (2a).5. The composition according to claim 3 , wherein an amount of the constitutional unit represented by the formula (1a) is 80-98 mol per 100 mol of the total of the constitutional unit represented by the formula (1a) and the constitutional unit represented by and the formula (1b).6. The composition according to claim 1 , wherein R-Rare each independently a Calkyl group optionally substituted by a halogen atom claim 1 , a Calkoxy group optionally substituted by a halogen atom claim 1 , a halogen atom claim 1 , a nitro group claim 1 , a formyl group claim 1 , a cyano group claim 1 , a sulfo group claim 1 , a phenyl group optionally substituted by W claim 1 , a thienyl group optionally substituted by W claim 1 , or a furyl group optionally substituted by W claim 1 , and Wis a Calkyl group optionally substituted by a halogen atom claim 1 , a Calkoxy group optionally substituted by a halogen atom claim 1 , a halogen atom claim 1 , a nitro group claim 1 , a formyl group claim 1 , a cyano group or a sulfo group.7. The composition according to claim 1 , wherein Xis a tetravalent group represented by the formula (5a).8. The composition according to claim 1 , wherein Yis a divalent group represented by the formula (7a).10. The composition according to claim 1 , wherein the electron-donating polymer (D) and the electron-withdrawing polymer ...

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16-02-2017 дата публикации

Poly(amic acid) composition and polyimide composition

Номер: US20170044321A1
Автор: Hiroaki Mori, Youhei Inoue
Принадлежит: JFE Chemical Corp

There is provided a polyimide composition that is useful for electronic substrate materials, retains high heat resistance and mechanical strength intrinsic to polyimides, and has a lower dielectric constant and dielectric loss tangent. A polyimide composition for use in electronic substrate materials, containing a polyimide produced by polymerization between a diamine component containing 5-(4-aminophenoxy)-3-[4-(4-aminophenoxy)phenyl]-1,1,3-trimethylindan and an acid component containing 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride.

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15-02-2018 дата публикации

Polyamic acid resin, polyamideimide film, and method for preparing the same

Номер: US20180044475A1
Принадлежит: SK Innovation Co Ltd

Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, a polyamideimide film capable of implementing high modulus and excellent optical properties while implementing excellent mechanical properties, heat properties, and electrical properties, and a method for preparing the same.

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15-02-2018 дата публикации

ANODE ELECTRODE MATERIAL AND LITHIUM ION BATTERY USING THE SAME

Номер: US20180047987A1
Принадлежит:

An anode electrode material and a lithium ion battery are disclosed. The anode electrode material includes an anode binder. The anode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. At least one of the dianhydride monomer and the diamine monomer includes a silicon-containing monomer. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the anode electrode includes an anode active material, a conducting agent, and the anode binder. 1. An anode electrode material comprising an anode binder , the anode binder comprising a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer , wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-containing monomer.10. The anode electrode material of claim 1 , wherein a molar ratio of a total amount of the silicon-containing monomer to a total amount of the silicon-free monomer is in a range from 1:100 to 10:1.11. The anode electrode material of claim 1 , wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-free monomer claim 1 , a molar ratio of all of the silicon-containing monomer to all of the silicon-free monomer is in a range from 1:20 to 1:1.12. The anode electrode material of claim 1 , wherein a molar ratio of all of the dianhydride monomer to all of the diamine monomer is in a range from 1:2 to 4:1.13. The anode electrode material of claim 1 , wherein a molecular weight of the polymer obtained by polymerizing the dianhydride monomer with the diamine monomer is in a range from about 10000 to about 600000.14. The anode electrode material of claim 1 , wherein a mass percentage of the anode binder in the anode electrode material is in a range from about 0.5% to about 8%.15. A lithium ion battery comprising:a cathode electrode;an electrolyte;a separator; andan anode electrode, the anode electrode comprising an anode active ...

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25-02-2021 дата публикации

LAMINATE FOR MANUFACTURING FLEXIBLE DISPLAY, AND FLEXIBLE DISPLAY MANUFACTURING METHOD USING SAME

Номер: US20210053328A1
Принадлежит: LG CHEM, LTD.

The present invention employs a polyimide film, which has a coefficient of thermal expansion (CTE) that is a negative number at a temperature equal to or greater than 350° C., as a debonding layer for separating a flexible substrate and a carrier substrate, and thus can easily separate a flexible substrate from a carrier substrate by using a detaching phenomenon caused by a difference in residual stress between the flexible substrate and the debonding layer after a high-temperature process for producing an element on the flexible substrate. Therefore, the present invention can separate the flexible substrate without causing chemical or physical damage to the element formed on the flexible substrate, thereby minimizing problems that may occur during a stripping process. 1. A laminate comprising:a carrier substrate;a debonding layer formed on the carrier substrate and comprising a polyimide having a negative value of coefficient of thermal expansion (CTE) at a temperature of 350° C. or higher; anda flexible substrate layer formed on the debonding layer.2. The laminate according to claim 1 , wherein the debonding layer has a first area having a surface opposite side of the carrier substrate claim 1 , and the flexible substrate layer has a second area claim 1 , wherein the second area is larger than the first area and completely covers the first area of the debonding layer.3. The laminate according to claim 1 , wherein the polyimide in the debonding layer comprises a polymerization and curing product of a diamine and a dianhydride claim 1 , wherein the diamine is in excess of the equivalent ratio relative to the dianhydride.4. The laminate according to claim 1 , wherein the debonding layer comprises a polymerization and curing product of a dianhydride comprising biphenyl tetracarboxylic dianhydride (BPDA) and a diamine comprising phenylenediamine (PDA).5. The laminate according to claim 4 , wherein the dianhydride further comprises pyromellitic dianhydride (PMDA) claim ...

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22-02-2018 дата публикации

CONDUCTIVE AROMATIC POLYIMIDE POROUS FILM AND METHOD FOR PRODUCING SAME

Номер: US20180051172A1
Принадлежит:

An easily producible electroconductive aromatic polyimide porous film comprising an aromatic polyimide porous film and carbon nanotubes dispersed in the film has a resistance in the thickness direction of 100 mΩ·cmor less and a Gurley air permeation resistance of 300 seconds/100 cc or less and exhibits especially high conductivity and high air permeability as a gas diffusion layer of a membrane-electrode assembly of a fuel cell. 1. An electroconductive aromatic polyimide porous film comprising an aromatic polyimide porous film and carbon nanotubes dispersed in the film which has a resistance in the thickness direction of not higher than 100 mΩ·cmand a Gurley air permeation resistance of not higher than 300 seconds/100 cc.2. The electroconductive aromatic polyimide porous film of claim 1 , which has a resistance in the thickness direction of not higher than 50 mΩ·cm.3. The electroconductive aromatic polyimide porous film of claim 1 , which has a Gurley air permeation resistance of not higher than 100 seconds/100 cc.4. The electroconductive aromatic polyimide porous film of claim 1 , which has a resistance in the thickness direction of not less than 0.01 mΩ·cm.5. The electroconductive aromatic polyimide porous film of claim 1 , which has a Gurley air permeation resistance of not less than 0.1 second/100 cc.6. The electroconductive aromatic polyimide porous film of claim 1 , in which the aromatic polyimide porous film is made of an aromatic polyimide obtained by poly-condensation of an aromatic tetracarboxylic acid compound and an aromatic amine compound and imide-forming reaction of the polycondensated product.7. The electroconductive aromatic polyimide porous film of claim 1 , in which the carbon nanotubes are multi-layer carbon nanotubes.8. The electroconductive aromatic polyimide porous film of claim 1 , which contains the carbon nanotubes in an amount of 10 to 50 wt. %.9. A membrane-electrode-assembly comprising a polyelectrolyte membrane claim 1 , a catalyst ...

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22-02-2018 дата публикации

MULTILAYER OPTICAL COMPENSATION FILM HAVING REVERSED WAVELENGTH DISPERSION

Номер: US20180052271A1
Принадлежит: AKRON POLYMER SYSTEMS, INC.

Disclosed is a multilayer optical compensation film comprising a first layer comprising a positive C-plate material and a second layer comprising a polyimide, as well as polymer compositions and resins and solutions containing said polymer compositions. The optical compensation film has a reversed wavelength dispersion that is capable of providing an achromatic (or broadband) retardation compensation. The optical film can be used in optical devices such as liquid crystal displays (LCD) or organic light emitting diode (OLED) displays. 1. A multilayer optical compensation film comprising , a first layer comprising a positive C-plate material and a second layer comprising a polyimide , wherein said multilayer optical compensation film has positive out-of-plane retardations that satisfy the relations of 0.7 Подробнее

03-03-2022 дата публикации

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

Номер: US20220071025A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A resin composition of the present invention contains: a maleimide compound (A) having a transmittance of 5% or more at a wavelength of 405 nm (h-line); a particular carboxylic acid containing compound (B); and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

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22-02-2018 дата публикации

ELECTRODE BINDER, CATHODE ELECTRODE MATERIAL, AND LITHIUM ION BATTERY

Номер: US20180053938A1
Принадлежит:

An electrode binder, a cathode electrode material and a lithium ion battery are disclosed. The cathode electrode material includes the cathode binder. The cathode binder includes a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer. At least one of the dianhydride monomer and the diamine monomer includes a silicon-containing monomer. The lithium ion battery includes an anode electrode, an electrolyte, a separator, and the cathode electrode, the cathode electrode includes a cathode active material, a conducting agent, and the cathode binder. 1. An electrode binder of a lithium ion battery , the electrode binder comprising a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer , wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-containing monomer.10. The electrode binder of claim 1 , wherein a molar ratio of a total amount of the silicon-containing monomer to a total amount of the silicon-free monomer is in a range from 1:100 to 10:1.11. The electrode binder of claim 1 , wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-free monomer claim 1 , a molar ratio of all of the silicon-containing monomer to all of the silicon-free monomer is in a range from 1:20 to 1:1.12. The electrode binder of claim 1 , wherein a molar ratio of all of the dianhydride monomer to all of the diamine monomer is in a range from 1:2 to 4:1.13. The electrode binder of claim 1 , wherein a molecular weight of the polymer obtained by polymerizing the dianhydride monomer with the diamine monomer is in a range from about 10000 to about 600000.14. A cathode electrode material comprising a cathode binder claim 1 , the cathode binder comprising a polymer obtained by polymerizing a dianhydride monomer with a diamine monomer claim 1 , wherein at least one of the dianhydride monomer and the diamine monomer comprises a silicon-containing monomer.15. The cathode electrode ...

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10-03-2022 дата публикации

Method of making a biphenol dianhydride composition, method for purification of a biphenol dianhydride, and poly(etherimide)s derived from the biphenol dianhydride

Номер: US20220073483A1
Принадлежит: SHPP Global Technologies BV

A method of making a biphenol dianhydride composition includes heating a first solution including a biphenol tetraacid of the formula (I) wherein Ra, Rb, p and q are as defined herein; at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions; and a non-halogenated solvent. The first solution is heated under conditions effective to provide a second solution including the corresponding biphenol dianhydride, the at least one of sodium ions, potassium ions, calcium ions, zinc ions, aluminum ions, iron ions, phosphate ions, sulfate ions, chloride ions, nitrate ions, and nitrite ions, and the non-halogenated solvent.

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10-03-2022 дата публикации

POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POROUS POLYIMIDE FILM

Номер: US20220073743A1
Принадлежит: FUJIFILM Business Innovation Corp.

A polyimide precursor solution contains a polyimide precursor, resin particles having a core and a coating resin layer, the coating resin layer contains a melamine resin, and a solvent. 1. A polyimide precursor solution comprising:a polyimide precursor;resin particles having a core and a coating resin layer, the coating resin layer containing a melamine resin; anda solvent.2. The polyimide precursor solution according to claim 1 , wherein a ratio of the coating resin layer is 1% by mass or more and 30% by mass or less with respect to all of the resin particles.3. The polyimide precursor solution according to claim 2 , wherein the ratio of the coating resin layer is 10% by mass or more and 20% by mass or less with respect to all of the resin particles.4. A polyimide precursor solution comprising:a polyimide precursor;resin particles having a swelling degree within ±10% after immersion in methanol for 1 hour; anda solvent.5. The polyimide precursor solution according to claim 1 , wherein the solvent contains water claim 1 , and a content of the water is 70% by mass or more with respect to the solvent.6. The polyimide precursor solution according to claim 2 , wherein the solvent contains water claim 2 , and a content of the water is 70% by mass or more with respect to the solvent.7. The polyimide precursor solution according to claim 3 , wherein the solvent contains water claim 3 , and a content of the water is 70% by mass or more with respect to the solvent.8. The polyimide precursor solution according to claim 4 , wherein the solvent contains water claim 4 , and a content of the water is 70% by mass or more with respect to the solvent.9. The polyimide precursor solution according to claim 1 , wherein the solvent contains an organic solvent.10. The polyimide precursor solution according to claim 2 , wherein the solvent contains an organic solvent.11. The polyimide precursor solution according to claim 3 , wherein the solvent contains an organic solvent.12. The ...

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20-02-2020 дата публикации

POLYIMIDE RESIN AND POLYIMIDE RESIN COMPOSITION

Номер: US20200055987A1
Принадлежит: MITSUBISHI GAS CHEMICAL COMPANY, INC.

A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes a structural unit (A-1) derived from a compound represented by the following formula (a-1), and the structural unit B includes a structural unit (B-1) derived from a compound represented by the following formula (b-1): 5. A polyimide resin composition comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polyimide resin according to ; and'}inorganic particles having a refractive index of 2.0 or more and an average particle diameter D50 of 20 nm or less.6. The polyimide resin composition according to claim 5 , wherein the inorganic particles are zirconium oxide particles and/or titanium oxide particles.7. A polyimide film comprising a cured product of the polyimide resin according to .8. A polyimide film comprising a cured product of the polyimide resin composition according to . The present invention relates to a polyimide resin and a polyimide resin composition.A polyimide resin has excellent mechanical properties, heat resistance, and chemical resistance, and has been widely used in the electric and electronic fields and the like, particularly as a material for an optical member. The material used for an optical member needs to have excellent optical properties (such as high refractive index) and transparency in addition to excellent heat resistance, mechanical properties and the like.For example, PTL 1 has proposed a high refractive-index material composition containing a polyimide resin having a predetermined structure and inorganic microparticles. PTL 1 has reported that there can be provided a high refractive-index material composition having a refractive index as high as 1.70 or more, excellent heat resistance, and a glass transition temperature of 200° C. or higher.PTL 1: JP-A-2001-348477However, the high refractive-index material composition described in PTL 1 ...

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02-03-2017 дата публикации

Monomer, polymer, compensation film, optical film, and display device

Номер: US20170059755A1
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A monomer represented by Chemical Formula 1-1 wherein in Chemical Formula 1-1, Z, L 1 , L 2 , R 1 to R 6 , n, m, p, and a to f are the same as defined in the detailed description.

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28-02-2019 дата публикации

ORTHO-SUBSTITUTED TRIPTYCENE-BASED DIAMINES, MONOMERS, AND POLYMERS, METHODS OF MAKING AND USES THEREOF

Номер: US20190062504A1
Принадлежит:

Described herein are ortho-dimethyl-substituted and tetramethyi-substituted triptycene-containing diamine monomers and microporous triptycene-based poiyimides and poiyamides, and methods of making the monomers and polymers. 23-. (canceled)67-. (canceled)8. The structure comprising a polyimide of claim 5 , wherein the structure is a film or membrane in a fluid separation system.912-. (canceled)13. The substituted triptycene-containing diamine of claim 1 , wherein the aromatic moiety comprises an aryl group.14. The substituted triptycene-containing diamine of claim 1 , wherein the aromatic moiety comprises a heteroaryl group.15. The triptycene-based polyimide of claim 4 , wherein the tetravalent radical comprises a C5 to C12 ring.16. The triptycene-based polyimide of claim 4 , wherein the tetravalent radical comprises a multi ring.17. The triptycene-based polyimide of claim 16 , wherein the multi ring comprises an aryl group and a heteroaryl group.18. The composition of claim 5 , wherein the aromatic moiety comprises an aryl group.19. The composition of claim 5 , wherein the aromatic moiety comprises an heteroaryl group. This application claims the benefit of and priority to U.S. Provisional Application Ser. No. 62/238,747, having the title “ORTHO-SUBSTITUTED TRIPTYCENE-BASED DIAMINES, MONOMERS, AND POLYMERS, METHODS OF MAKING AND USES THEREOF,” filed on Oct. 8, 2015, the disclosure of which is incorporated herein in by reference in its entirety.Polyimides are high performance materials that can be used in a range of applications due to their thermal and chemical stability, mechanical robustness, superior film-forming properties, and structural diversity. Recently, polyimides of intrinsic microporosity (PIM-PIs) demonstrated promising properties for membrane-based gas separation applications including air separations (O/N), efficient hydrogen recovery (H/Nand H/CH), natural gas sweetening (CO/CH) and carbon capture from flue gas (CO/N). Gas separation is an emerging ...

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17-03-2022 дата публикации

MODIFIED BISMALEIMIDE RESIN, METHOD FOR PREPARING THE SAME, PREPREG, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD

Номер: US20220081514A1
Принадлежит:

A modified bismaleimide resin, a method for preparing the same, a prepreg, a copper clad laminate, and a printed circuit board are provided. The modified bismaleimide resin is formed by a reaction between a diamine compound having a nonpolar backbone structure and maleic anhydride, and a molecular structure thereof contains a greater amount of non-polar and hydrophobic groups. 2. The modified bismaleimide resin according to claim 1 , wherein the modified bismaleimide resin has a dielectric constant (Dk) of less than 2.6 and a dissipation factor (Df) of less than 0.003 at 10 GHz.3. The modified bismaleimide resin according to claim 1 , wherein a water absorption rate of the modified bismaleimide resin is from 0.1% to 0.3%.4. The modified bismaleimide resin according to claim 1 , wherein the modified bismaleimide resin has a solubility in acetone of 42% and a solubility in butanone of 40%.5. A prepreg obtained by applying a resin material that includes the modified bismaleimide resin as claimed in onto a substrate and curing the resin material.6. A copper clad laminate claim 5 , comprising the prepreg as claimed in and a copper foil layer attached to the prepreg.7. A printed circuit board obtained by patterning the copper foil layer of the copper clad laminate as claimed in into a circuit.8. A method for preparing the modified bismaleimide resin as claimed in claim 1 , comprising:providing a reactor;placing a reaction solution into the reactor, wherein the reaction solution includes a diamine compound, maleic anhydride, and a solvent, and a molar ratio of the diamine compound to the maleic anhydride is 1:2-20; andadding a catalyst into the reaction solution to carry out a synthesis reaction between the diamine compound and the maleic anhydride.10. The method according to claim 8 , wherein the synthesis reaction is carried out from 40° C. to 200° C. for 1 to 8 hours.11. The method according to claim 8 , wherein the solvent is acetone claim 8 , toluene claim 8 , N claim ...

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28-02-2019 дата публикации

POLYIMIDE-BASED SOLUTION AND POLYIMIDE-BASED FILM PRODUCED USING SAME

Номер: US20190062590A1
Принадлежит: LG CHEM, LTD.

The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes. 125-. (canceled)27. The display substrate comprising a polyimide-based film according to claim 26 , wherein X comprises a tetravalent organic group having a fluorine atom-containing substituent claim 26 , Y comprises a divalent organic group having a fluorine atom-containing substituent claim 26 , or each of X and Y comprises an organic group having a fluorine atom-containing substituent.28. The display substrate comprising a polyimide-based film according to claim 26 , wherein the divalent organic groups are each independently selected from divalent aromatic organic groups claim 26 , divalent alicyclic organic groups claim 26 , divalent aliphatic organic groups claim 26 , and combinations thereof and the tetravalent organic groups are each independently selected from tetravalent aromatic organic groups claim 26 , tetravalent alicyclic organic groups claim 26 , tetravalent aliphatic organic groups claim 26 , and combinations thereof.29. The display substrate comprising a polyimide-based film according to claim 26 , wherein Y in each of the polyimide and the polyamic acid comprises both a divalent organic group having a fluorine atom-containing substituent and a divalent organic group having no fluorine atom-containing substituent.30. The display substrate comprising a polyimide-based film according to claim 28 , wherein the molar ratio of the divalent organic group having a fluorine atom-containing substituent to all divalent organic groups in Y is from 0.1:1 to 1:1.31. The display substrate comprising a polyimide-based film according to claim 26 , wherein Y comprises a divalent ...

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27-02-2020 дата публикации

POLYIMIDE AND POLYIMIDE FILM, PREPARED THEREFROM, FOR FLEXIBLE DISPLAY

Номер: US20200062904A1
Принадлежит: LG CHEM, LTD.

Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate. 2. The polyimide according to claim 1 , wherein the composition comprises the diamine selected from formulae 1a to 1e in an amount of 30 to 100 mol % based on the total content of the diamine.3. The polyimide according to claim 1 , wherein a coefficient of thermal expansion (CTE) is 50 ppm/° C. or less as measured in the range of 100 to 250° C.4. The polyimide according to claim 1 , wherein a glass transition temperature (Tg) is 330° C. or higher.6. A polyimide film for a flexible display comprising the polyimide of .13. The polyimide according to claim 1 , wherein a molar ratio of a total content of the tetracarboxylic dianyhydride to a total content of the diamine is 1:0.99 to 0.99:1.14. The polyimide according to claim 1 , wherein a weight average molecular weight of the polyimide is 10 claim 1 ,000 to 200 claim 1 ,000 g/mol.15. The polyimide according to claim 1 , wherein a molecular weight distribution of the polyimide is 1.1 to 2.5.16. A method of preparing the polyimide of comprising polymerizing the tetracarboxylic dianhydride with the diamine to form a polymerized product and imidizing the polymerized product. This application claims the benefit of priority to Korean Patent Application Nos. 10-2017-0013726, filed on Jan. 31, 2017 and 10-2017-0167165, filed on Dec. 7, 2017, the entire disclosures of which are incorporated herein by reference.The present invention relates to a polyimide having improved heat resistance and thermal stability, and a polyimide film for a flexible display containing same.Polyimide (PI) is a polymer having a relatively low crystallinity or mostly amorphous structure. It is easy to be synthesized and prepared as a thin film. It is a polymer material ...

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11-03-2021 дата публикации

POLYIMIDE PRECURSOR SOLUTION AND METHOD FOR PRODUCING POLYIMIDE FILM

Номер: US20210070939A1
Принадлежит: FUJI XEROX CO., LTD.

A polyimide precursor solution includes a polyimide precursor, an aqueous solvent containing dimethyl sulfoxide and water, and particles. The content of the dimethyl sulfoxide relative to the particles is within a range of 0.15 to 2.00 in terms of mass ratio. 1. A polyimide precursor solution comprising:a polyimide precursor;an aqueous solvent containing dimethyl sulfoxide and water; andparticles,wherein a content of the dimethyl sulfoxide relative to the particles is within a range of 0.15 to 2.00 in terms of mass ratio.2. The polyimide precursor solution according to claim 1 , wherein a content of the water relative to the aqueous solvent is within a range of 60% by mass to 90% by mass.3. The polyimide precursor solution according to claim 1 , wherein the polyimide precursor solution contains the particles within a range of 40% by volume to 80% by volume relative to a total volume of a solid content of the polyimide precursor and the particles.4. The polyimide precursor solution according to claim 3 , wherein a content of the particles is within a range of 50% by volume to 70% by volume.5. The polyimide precursor solution according to claim 1 , wherein the content of the dimethyl sulfoxide relative to the water is within a range of 5% by mass to 20% by mass.6. The polyimide precursor solution according to claim 1 , wherein the aqueous solvent contains an organic amine compound.7. The polyimide precursor solution according to claim 6 , wherein the organic amine compound selected from the group consisting of triethylamine claim 6 , N-alkylpiperidine claim 6 , 2-dimethylaminoethanol claim 6 , and a tertiary cyclic amine compound.8. The polyimide precursor solution according to claim 7 , wherein the tertiary cyclic amine compound is a morpholine compound.9. The polyimide precursor solution according to claim 8 , wherein the morpholine compound is N-methylmorpholine.10. The polyimide precursor solution according to claim 1 , wherein the particles are resin particles.11 ...

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12-03-2015 дата публикации

POLYETHERIMIDES, METHODS OF MANUFACTURE, AND ARTICLES FORMED THEREFROM

Номер: US20150073116A1
Принадлежит: Sabic Global Technologies B.V.

A polyetherimide manufactured by reaction of an alkali metal salt of a dihydroxy aromatic compound of the formula 2. The method of claim 1 , wherein X is chlorine.4. The method of claim 1 , wherein Z is 2 claim 1 ,2-(4-phenylene)isopropylidene and R is m-phenylene claim 1 , p-phenylene claim 1 , p-phenylene diarylsulfone claim 1 , or a combination thereof.5. The method of claim 1 , wherein the bis(halophthalimide) composition comprisesfrom 45 to less than 55 weight percent of the (3,3′-bis(halophthalimide),less than 10 weight percent of the 3,4′-bis(halophthalimide), andfrom 45 to 55 weight percent of the 4,4′-bis(halophthalimide).7. The method of claim 6 , wherein the polyetherimide hasa heat deflection temperature of at least 218° C., determined by DMA on a film samplea heat deflection temperature at least 10° C. higher than a heat deflection temperature of the same polyetherimide manufactured using a bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide), each determined DMA on a film sample,at least 20% lower stiffness than the stiffness of the same polyetherimide manufactured using the bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide), each determined by DMA over 30° C. to 110° C., on a film sample, anda ratio of a low shear rate viscosity to a high shear rate viscosity that is at least 30% higher than the same ratio of the same polyetherimide manufactured using the bis(halophthalimide) composition comprising more than 10 weight percent of 3,4′-bis(halophthalimide) and more than 55 weight percent of the 4,4′-bis(halophthalimide), each determined by parallel plate rheometry.8. The method of claim 6 , wherein the polyetherimide comprises less than 3000 parts per million of a halide claim 6 , based on the total parts of the polyetherimide.9. The method of claim 6 , wherein the polyetherimide comprises less than 5 weight percent of a cyclic byproduct claim 6 , based on ...

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15-03-2018 дата публикации

Optical compensation film having reversed wavelength dispersion

Номер: US20180072882A1
Принадлежит: Akron Polymer Systems Inc

Disclosed is an optical compensation film made of a solution cast of a polymer blend comprising a nitrated styrenic fluoropolymer and a polyimide. The compensation film is a positive-C plate having reversed wavelength dispersion that is capable of providing an achromatic (or broadband) retardation compensation. The optical film of the invention can be used in an optical device such as liquid crystal display (LCD) or organic light emitting diode (OLED) display.

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07-03-2019 дата публикации

Polyimide precursor solution and polyimide shaped article

Номер: US20190071569A1
Принадлежит: Fuji Xerox Co Ltd

A polyimide precursor solution contains a polyimide precursor, wherein in the case where the polyimide precursor is analyzed by gel permeation chromatography, the elution curve of the polyimide precursor has a region A including a higher-molecular-weight peak and a region B including a lower-molecular-weight peak; a weight average molecular weight determined from the region A in terms of polystyrene is approximately 10,000 or more, and a weight average molecular weight determined from the region B in terms of polystyrene is approximately less than 10,000; and when the area of the region A is a and the area of the region B is b, the polyimide precursor satisfies Equation (1) a /( a+b )=approximately from 0.70 to 0.98.  Equation 1:

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15-03-2018 дата публикации

Polyimide precursor solution, polyimide precursor, polyimide resin, mixture slurry, electrode, mixture slurry production method, and electrode formation method

Номер: US20180076461A1

A method for forming an electrode for a lithium ion battery is disclosed. The method includes preparing a mixture slurry, coating the mixture slurry onto a current collector body, and heating the mixture slurry coating to form an active substance layer. The slurry mixture can be prepared by mixing a polyimide precursor solution and active substance particles. The polyimide resin in the active substance layer is porous due to the method.

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18-03-2021 дата публикации

POLYIMIDE FILMS AND ELECTRONIC DEVICES

Номер: US20210079181A1
Принадлежит:

In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. The polyimide film is formed by: (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution; (b) imidizing the polyamic acid solution to form a substantially imidized solution; (c) casting the substantially imidized solution to form a film; and (d) drying the film. 1. A polyimide film comprising: the dianhydride, the diamine or both the dianhydride and the diamine comprise an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer; and', 'the polyimide film has a b* of 1.25 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm; and', (a) polymerizing the dianhydride and the diamine in the presence of a first solvent to obtain a polyamic acid solution;', '(b) imidizing the polyamic acid solution to form a substantially imidized solution;', '(c) casting the substantially imidized solution to form a film; and', '(d) drying the film., 'the polyimide film is formed by], 'a dianhydride and a diamine, wherein2. The polyimide film of claim 1 , wherein after (b) and before (c) claim 1 , the substantially imidized solution is filtered to remove insoluble constituents of the solution.3. The polyimide film of claim 1 , wherein the dianhydride is selected form the group consisting of 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyltetracarboxylic dianhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-benzophenonetetracarboxylic dianhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfonetetracarboxylic dianhydride and ...

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18-03-2021 дата публикации

POLYIMIDE FILMS AND ELECTRONIC DEVICES

Номер: US20210079182A1
Принадлежит:

In a first aspect, a polyimide film includes a dianhydride and a diamine. The dianhydride, the diamine or both the dianhydride and the diamine include an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer. The polyimide film has a tensile modulus of 5.5 GPa or more, a b* of 1.4 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm. In a second aspect, an electronic device includes the polyimide film of the first aspect. 1. A polyimide film comprising: the dianhydride, the diamine or both the dianhydride and the diamine comprise an alicyclic monomer, an aliphatic monomer or both an alicyclic monomer and an aliphatic monomer; and', 'the polyimide film has a tensile modulus of 5.5 GPa or more, a b* of 1.4 or less and a yellowness index of 2.25 or less for a film thickness of 50 μm., 'a dianhydride and a diamine, wherein2. The polyimide film of claim 1 , further comprising a sub-micron filler.3. The polyimide film of claim 2 , wherein the sub-micron filler is selected from the group consisting of silicon oxide claim 2 , aluminum oxide claim 2 , titanium oxide claim 2 , zirconium oxide claim 2 , and mixtures thereof.4. The polyimide film of claim 2 , wherein the sub-micron filler has a size of less than 100 nm in at least one dimension.5. The polyimide film of claim 1 , wherein the dianhydride is selected form the group consisting of 4 claim 1 ,4′-(hexafluoroisopropylidene)diphthalic anhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyltetracarboxylic dianhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-benzophenonetetracarboxylic dianhydride claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenylsulfonetetracarboxylic dianhydride and mixtures thereof.6. The polyimide film of claim 5 , wherein the dianhydride further comprises an alicyclic dianhydride selected from the group consisting of cyclobutane-1 claim 5 ,2 claim 5 ,3 claim 5 ,4-tetracarboxylic dianhydride claim 5 , cyclohexane ...

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14-03-2019 дата публикации

Polyamic Acid Resin and Polyamideimide Film

Номер: US20190077960A1
Принадлежит:

Provided are a polyamic acid resin derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride, and a polyamideimide film including polyamideimide derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride. 2. The polyamideimide film of claim 1 , wherein the aromatic diamine includes 2 claim 1 ,2′-bis(trifluoromethyl)-benzidine.3. The polyamideimide film of claim 1 , wherein the aromatic dianhydride includes 4 claim 1 ,4′-hexafluoroisopropylidene diphthalic anhydride and biphenyltetracarboxylic dianhydride.4. The polyamideimide film of claim 1 , wherein the aromatic diacid dichloride includes terephthaloyl dichloride.5. The polyamideimide film of claim 1 , wherein a content of the aromatic diacid dichloride is more than 50 mol claim 1 , based on 100 mol of the aromatic diamine.6. The polyamideimide film of claim 1 , wherein a content of the aromatic dianhydride is 10 to 50 mol claim 1 , based on 100 mol of the aromatic diamine.7. The polyamideimide film of claim 3 , wherein a content of the aromatic dianhydride is 5 to 25 mol of 4 claim 3 ,4′-hexafluoroisopropylidene diphthalic anhydride and 5 to 25 mol of biphenyltetracarboxylic dianhydride claim 3 , based on 100 mol of the aromatic diamine.8. The polyamideimide film of claim 1 , wherein a content of the cycloaliphatic dianhydride is 5 to 30 mol claim 1 , based on 100 mol of the aromatic diamine.9. The polyamideimide film of claim 1 , wherein the polyamideimide film has a modulus of 5.0 GPa or more claim 1 , as measured at an extension speed of 25 mm/min using UTM 3365 available from Instron.10. The polyamideimide film of claim 1 , wherein the polyamideimide film has a yellow index of 3.0 or less claim 1 , as measured in accordance with the ASTM E313 standard.11. The polyamideimide film of claim 9 , wherein the polyamideimide film has a modulus of 5.0 GPa or more claim 9 , as measured at an ...

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26-03-2015 дата публикации

NORBORNANE-2-SPIRO-a-CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC DIANHYDRIDE, NORBORNANE-2-SPIRO-a- CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC ACID AND ESTER THEREOF, METHOD FOR PRODUCING NORBORNANE-2-SPIRO-a-CYCLOALKANONE-a'-SPIRO-2"-NORBORNANE-5,5",6,6"-TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE OBTAINED BY USING THE SAME, AND METHOD FOR PRODUCING POLYIMIDE

Номер: US20150086753A1
Принадлежит: JX NIPPON OIL & ENERGY CORPORATION

A norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic dianhydride represented by the following general formula (1): 8. The polyamic acid according to claim 6 , wherein the polyamic acid has an intrinsic viscosity [η] of 0.05 to 3.0 dL/g claim 6 , the intrinsic viscosity [η] being measured with a kinematic viscometer under a temperature condition of 30° C. by using a solution of the polyamic acid at a concentration of 0.5 g/dL obtained by dissolving the polyamic acid in N claim 6 ,N-dimethylacetamide.10. A film comprising the polyimide according to .11. A flexible printed wiring board comprising the polyimide according to .12. A liquid crystal orientation film comprising the polyimide according to .13. A transparent electrode substrate comprising the polyimide according to .14. A transparent electrode substrate of an organic EL claim 4 , comprising the polyimide according to .15. A transparent electrode substrate of a solar cell claim 4 , comprising the polyimide according to .16. A transparent electrode substrate of an electronic paper claim 4 , comprising the polyimide according to .17. A heat resistant insulating tape comprising the polyimide according to .18. An enamel for a wire claim 4 , comprising the polyimide according to .19. A protective coating of a semiconductor claim 4 , comprising the polyimide according to .20. A transfer belt comprising the polyimide according to .21. An interlayer dielectric film comprising the polyimide according to .22. A substrate for a sensor claim 4 , comprising the polyimide according to .23. A solution comprising the polyamic acid according to claim 6 , and an organic solvent. The present invention relates to a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic dianhydride; a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″-norbornane-5,5″,6,6″-tetracarboxylic acid and an ester thereof; a method for producing a norbornane-2-spiro-α-cycloalkanone-α′-spiro-2″- ...

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21-03-2019 дата публикации

Polyimide Dispersants and Methods of Making and Using Thereof

Номер: US20190085129A1
Принадлежит:

Provided herein are polyimide dispersants, as well as methods for producing polyimide dispersants. The polyimides can be defined by the formula below 2. The compound of claim 1 , wherein Y is claim 1 , individually for each occurrence claim 1 , chosen from alkylene claim 1 , heteroalkylene claim 1 , cycloalkylene claim 1 , heterocycloalkylene claim 1 , arylene claim 1 , heteroarylene claim 1 , alkylarylene claim 1 , alkylheteroarylene claim 1 , polyalkyleneoxy claim 1 , or polyalkenylamino.3. The compound of claim 1 , wherein Y claim 1 , individually for each occurrence claim 1 , comprises from 2 to 30 carbon atoms.4. The compound of claim 1 , wherein B comprises an aryl group.5. The compound of claim 1 , wherein the first cyclic imide group comprises a five-membered cyclic imide ring and a second cyclic imide group comprises a five-membered cyclic imide ring.7. The compound of claim 1 , wherein the first cyclic imide group comprises a six-membered cyclic imide ring and a second cyclic imide group comprises a six-membered cyclic imide ring.9. The compound of claim 1 , wherein n is an integer from 1-6.10. The compound of claim 1 , wherein R is a hydrophobic moiety.11. The compound of claim 1 , wherein R is chosen from a polyolefin group claim 1 , a polyetheramine group; a polyalkenylamine group; a polyalkyleneoxy group claim 1 , or a combination thereof.12. The compound of claim 1 , wherein R comprises a polyolefin group terminated by an initiator residue.13. The compound of claim 1 , wherein R comprises a polyisobutylene group terminated by an initiator residue.14. The compound of claim 1 , wherein L is absent.15. The compound of claim 14 , where the compound is defined by Formula IA below{'br': None, 'sup': x', 'a', 'a', 'x, 'sub': 'n', 'R—R—Y-\ue8a0A-Y\ue8a0—R—R\u2003\u2003Formula IA'} A and n are as defined above with respect to Formula I,', {'sup': 'x', 'Ris an initiator residue; and'}, {'sup': 'a', 'Ris a polyolefin group;'}], 'wherein'}17. The compound of ...

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21-03-2019 дата публикации

Polyimide, dianhydride monomers, and polymers, methods of making and uses thereof

Номер: US20190085132A1

Embodiments of the present disclosure include, a dianhydride monomer, a polyimide, a method of making a dianhydride, a method of making a polyimide, and the like. Embodiments of the present disclosure can be used in membrane-based gas separation applications.

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29-03-2018 дата публикации

PHOTOSENSITIVE RESIN COMPOSITION, BLACK PIXEL DEFINING LAYER USING THE SAME AND DISPLAY DEVICE

Номер: US20180088465A1
Принадлежит:

A photosensitive resin composition, a pixel defining layer, and a display device, the composition including a binder resin; a photopolymerizable monomer; a photopolymerization initiator including a first photopolymerization initiator and a second photopolymerization initiator; a black colorant; and a solvent, wherein the first photopolymerization initiator is represented by Chemical Formula 1, the second photopolymerization initiator has a different maximum absorption wavelength from the first photopolymerization initiator, and the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of about 3:7 to about 7:3, 2. The photosensitive resin composition as claimed in claim 1 , wherein the first photopolymerization initiator and the second photopolymerization initiator are included in a weight ratio of about 4:6 to about 6:4.3. The photosensitive resin composition as claimed in claim 1 , wherein the first photopolymerization initiator has maximum absorbance in a wavelength region of about 270 nm to about 300 nm or about 390 nm to about 450 nm.5. The photosensitive resin composition as claimed in claim 1 , wherein the binder resin includes at least two selected from a polyamic acid-polyimide copolymer claim 1 , a cardo-based binder resin claim 1 , and an acryl-based binder resin.6. The photosensitive resin composition as claimed in claim 5 , wherein:the binder resin includes the polyamic acid-polyimide copolymer, andthe polyamic acid-polyimide copolymer includes a polyamic acid repeating unit and a polyimide repeating unit, the polyamic acid repeating unit and polyimide repeating unit being included in a mole ratio of about 5:5 to about 9:1.7. The photosensitive resin composition as claimed in claim 5 , wherein:the binder resin includes the polyamic acid-polyimide copolymer, andthe polyamic acid-polyimide copolymer has a weight average molecular weight of about 5,000 g/mol to about 20,000 g/mol.8. The ...

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30-03-2017 дата публикации

Polyimide substrate and method for preparing the same, and flexible display

Номер: US20170088747A1
Автор: Hua Huang
Принадлежит: BOE Technology Group Co Ltd

The present invention relates to the field of displays and discloses a polyimide substrate, which is manufactured by reacting lignin, polyimide and a free radical initiator. Because lignin contains various active groups, for example, hydroxyl, carboxyl and aryl, etc., when it is introduced into the polymer structure of polyimide, the maximum absorption peak of the polymer can be made to redshift from less than or equal to 280 nm to less than or equal to 380 nm, so that a certain absorption and screening action may be laid on the light wave during a subsequent Laser Lift Off process, and the substrate and the liquid crystal may be prevented from being damaged during a Laser Lift Off process of the glass base substrate, thereby guaranteeing the display quality of the flexible display.

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07-04-2016 дата публикации

POLYIMIDES, PROCESSES FOR PRODUCING SAID POLYIMIDES AND ARTICLES OBTAINED FROM SAID POLYIMIDES

Номер: US20160096928A1
Автор: Jeol Stéphane
Принадлежит:

The present invention relates to (co)polymers comprising at least one imide function, making use of at least one diamine chosen from 2,5-bis(aminomethyl)furan and 2,5-bis(aminomethyl)tetrahydrofuran, or diisocyanate equivalents thereof. These (co)polymers can be converted into articles by various methods. 3. The (co)polymer as claimed in claim 2 , wherein compound A is pyromellitic anhydride or pyromellitic acid.5. The (co)polymer as claimed in claim 4 , wherein compound D is selected from:trimellitic anhydride,tricarboxylic acids selected from trimellitic acid, tricarballylic acid, citric acid, aconitic acid, 1,2,4-butanetricarboxylic acid and 1,2,3-benzentricarboxylic acid,diacid monoesters, monoacid diesters or triesters of said tricarboxylic acids,trimellitic anhydride chloride.7. The (co)polymer as claimed in claim 1 , wherein the (co)polymer is obtained by polymerization of at least the compound A or D and of at least the diamine B or of at least the diisocyanate B′ claim 1 , in the presence of at least one diamine C or of at least one diisocyanate C′ of formula IV or IV′ below:{'br': None, 'sub': 2', '3', '2, 'NH—R—NH\u2003\u2003(IV)'}{'br': None, 'sub': '3', 'O═C═N—R—N═C═O \u2003\u2003(IV′)'}{'sub': '3', 'with Rbeing a hydrocarbon-based divalent radical which is aliphatic, cycloaliphatic or arylaliphatic, and saturated and/or unsaturated, aromatic or alkylaromatic, and which optionally comprises heteroatoms.'}12. A composition comprising the (co)polymer as defined in and fillers and/or additives.13. A process for producing an article based on (co)polymer as claimed in claim 1 , the process comprising shaping by extrusion claim 1 , molding or blow molding of said (co)polymer in molten form when it has a melting point below 350° C. for a semi-crystalline (co)polymer or a glass transition temperature below 300° C. for an amorphous (co)polymer.15. An article obtained from the (co)polymer as defined in .16. The article as claimed in claim 15 , wherein the article ...

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05-04-2018 дата публикации

RESIN COMPOSITION, POLYIMIDE RESIN FILM, AND METHOD FOR PRODUCING SAME

Номер: US20180093461A1
Принадлежит: ASAHI KASEI KABUSHIKI KAISHA

Provided is a resin composition characterized by containing (a) a polyimide precursor that has a nm absorbance of 0.1-0.8 when formed into 0.1-μm-thick polyimide resin film by heating for one hour at 350° C., and (b) an alkoxysilane compound having a 308 nm absorbance of 0.1-1.0 at a solution thickness of 1 cm when made into a 0.001-mass % NMP solution. 1. A resin composition , comprising(a) a polyimide precursor having absorbance at 308 nm of 0.1 to 0.8 when heated for 1 hour at 350° C. to form a polyimide resin film having a film thickness of 0.1 μm, and(b) an alkoxysilane compound having absorbance at 308 nm of 0.1 to 1.0 when in the form of a 0.001% by weight NMP solution at a solution thickness of 1 cm.6. The resin composition according to claim 5 , wherein the molar ratio of the structural unit represented by the formula (5-1) to the structural unit represented by the formula (5-2) is 90/10 to 50/50.8. A polyimide resin film claim 1 , which is a cured product of the resin composition according to .9A resin film claim 8 , comprising the polyimide resin film according to .10. A method for producing a polyimide resin film claim 8 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a step for coating the resin composition according to on the surface of a support,'}a step for drying the coated resin composition and removing the solvent,a step for heating the support and the resin composition to form a polyimide resin film, anda step for separating the polyimide resin film from the support.11. The method for producing a polyimide resin film according to claim 10 , wherein the step for separating the polyimide resin film from the support comprises a step for separating the polyimide resin film after irradiating with laser light from the support side.12. A laminate comprising a support and a polyimide resin film which is a cured product of the resin composition according to on the surface of the support.13. A method for producing a laminate claim 1 , ...

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01-04-2021 дата публикации

HIGH MODULUS COLORLESS POLYIMIDE FILM AND METHOD OF PREPARATION

Номер: US20210095076A1
Принадлежит:

A polyimide precursor solution is disclosed, and a colorless transparent polyimide film manufactured from the polyimide precursor solution. The polyimide precursor solution has diamines, a first dianhydride represented by biphenyl dianhydride, a second dianhydride represented by rigid alicyclic dianhydride, a third dianhydride represented by non-alicyclic dianhydrides and organic solvent. The colorless polyimide films have a modulus of 4.5 GPa or higher, a glass-transition temperature (T) of 370° C. or higher, and a yellow index of 3.0 or lower. These polyimide films can be used as substrates for thin film transistor (TFT), touch sensor panel (TSP), and cover window applications in flexible display such as organic light-emitting diode (OLED), flexible liquid crystal display (LCD) and other fields. 1. A polyimide precursor solution manufactured by reacting , in an organic solvent:one or more diamines;a first dianhydride represented by biphenyl dianhydride;a second dianhydride represented by rigid alicyclic dianhydride, anda third dianhydride represented by non-alicyclic dianhydride;wherein relative to all dianhydrides which can be considered as 100 mol %, the first dianhydride containing biphenyl structure is in an amount of 10 to 80 mol %;the second dianhydride represented by rigid alicyclic dianhydride is in an amount of 10 to 80 mol %; andthe third dianhydride represented by non-alicyclic dianhydride is in an amount of 10 to 80 mol %.2. The polyimide precursor solution of claim 1 , wherein:the one or more diamines are selected from the group consisting of: 1,3-diamino-2,4,5,6-tetrafluorobenzene, 2-(trifluoromethyl) benzene-1,4-diamine, 4,4′-diaminooctafluorobiphenyl, 2,2′-bis(trifluoromethyl) benzidine and combinations thereof.4. The polyimide precursor solution of claim 1 , wherein the organic solvent is selected from the group consisting of: N-methyl-2-pyrrolidone (NMP) claim 1 , dimethylacetamide (DMAc) claim 1 , dimethyl sulfoxide (DMSO) claim 1 , ...

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28-03-2019 дата публикации

Methods of manufacture of bis(ether anhydride)s and polyetherimides

Номер: US20190092726A1
Принадлежит: SABIC Global Technologies BV

A method for the manufacture of a bis(ether anhydride) comprises contacting an N-substituted bis(ether phthalimide) with a base under conditions effective to ring open the imides to provide a ring-opened product; and contacting the ring-opened product with an acid under conditions effective to provide a composition comprising the bis(ether anhydride).

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26-06-2014 дата публикации

Dinitro monomer, diamine monomer, polyimide and modified polyimide

Номер: US20140179878A1
Принадлежит: TAIWAN TEXTILE RESEARCH INSTITUTE

A polyimide including a structure shown as Formula II is provided, wherein X is halogen, A 1 is selected from one of Formula 1 to Formula 18, and n is from 2 to 500,

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04-04-2019 дата публикации

POLYAMIDE ACID, THERMOPLASTIC POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE AND CIRCUIT BOARD

Номер: US20190100624A1

A polyamide acid which contains at least one diamine compound selected from among diamine compounds represented by general formula (8) within the range of 3-60 parts by mole in total per 100 parts by mole of all diamine components, while containing a biphenyl tetracarboxylic acid dianhydride within the range of 40-100 parts by mole and a pyromellitic acid dianhydride within the range of 0-60 parts by mole per 100 parts by mole of all acid anhydride components; and a thermoplastic polyimide which is obtained curing this polyamide acid. 3. A resin film that including a single layer or a plurality of polyimide layers ,{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'wherein at least one layer among the polyimide layers is formed of the thermoplastic polyimide according to .'}4. A metal-clad laminate including an insulating resin layer and a metal layer ,wherein the insulating resin layer includes a single layer or a plurality of polyimide layers, and{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'wherein a polyimide layer in contact with the metal layer is formed of the thermoplastic polyimide according to .'}5. The metal-clad laminate according to claim 4 ,wherein a ten-point average roughness (Rz) of a surface of the metal layer in contact with the insulating resin layer is within the range of 0.05 to 1.0 μm.6. A circuit board obtained by processing the metal layer of the metal-clad laminate according to into a wiring. The present invention relates to a polyimide that is useful as an adhesive layer in a circuit board such as a flexible printed wiring board and use thereof.In recent years, along with advances in reductions in size and weight, and space saving in electronic devices, the demand for a flexible printed wiring board (flexible printed circuit (FPC)) that is thin and lightweight, has flexibility, and has excellent durability even if bending is repeated is increasing. Since FPCs can be mounted three-dimensionally and with a high density even in a limited ...

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21-04-2016 дата публикации

NOVEL ACID DIANHYDRIDE, METHOD FOR PREPARING SAME, AND POLYIMIDE PREPARED THEREFROM

Номер: US20160108014A1
Принадлежит: KOLON INDUSTRIES, INC.

The present invention relates to a novel acid dianhydride, a method for preparing the same, and a polyimide prepared therefrom. More specifically, the acid dianhydride according to the present invention is useful as a colorless transparent polyimide unit exhibiting excellent thermal stability and a low dielectric ratio, and the polyimide of the present invention has excellent solubility to an organic solvent compared with the conventional polyimide. 3. The method of claim 2 , wherein the base catalyst of step (a) is selected from the group consisting of potassium hydroxide claim 2 , sodium hydroxide claim 2 , barium hydroxide claim 2 , calcium hydroxide claim 2 , aluminum hydroxide claim 2 , magnesium hydroxide claim 2 , and a combination thereof.4. The method of claim 2 , wherein the ring-closing dehydration of step (b) is conducted at 40˜100° C. for 4˜28 hrs.5. The method of claim 2 , wherein the dehydrating agent of step (b) is used in an amount of 2˜10 moles per mole of the compound of Chemical Formula 3.6. The method of claim 2 , wherein the dehydrating agent of step (b) is selected from the group consisting of acetic anhydride claim 2 , pyridine claim 2 , isoquinoline claim 2 , a tertiary amine claim 2 , and a combination thereof.8. A polyimide 7 , prepared from the polyamic acid of claim by ring-closing dehydration. The present invention relates to an acid dianhydride, a preparation method thereof, and a polyimide prepared therefrom.Polyimide finds a wide spectrum of applications in the electronic material industry including protecting materials, insulation materials, color filters, etc. for liquid crystal displays and semiconductors by virtue of its high mechanical strength, thermal resistance, and solvent resistance. In addition, expectation has recently been made of the use of polyimide as a material for optical telecommunication and as a substrate for mobile phones.With the recent advances in these industries, materials having advanced properties are ...

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21-04-2016 дата публикации

POLYAMIDES COMPRISING ME-BHT, COMPOSITIONS COMPRISING SUCH A POLYAMIDE, SHAPED ARTICLES COMPRISING SUCH A POLYAMIDE OR SUCH A COMPOSITION

Номер: US20160108174A1
Принадлежит:

The invention concerns a polymer, chosen from polyamide, polyimide and polyamideimide, obtained through polymerisation of at least one or several alkyl-BHT diamine chosen from methyl-bis hexamethylene triamine, ethyl-bis hexamethylene triamine, n-propyl-bis hexamethylene triamine and/or i-propyl-bis hexamethylene triamine, and one or several polycarboxylic acid, chosen from aliphatic polycarboxylic acids, aryl polycarboxylic acids, alkylaryl polycarboxylic acids and arylalkyi polycarboxylic acids, said polymer comprising a minimum amount of alkyl-BHT diamine of 1 mol % relative to the total mole amount of diamine monomers comprised in the polymer, a composition comprising such a polyamide, a shaped article comprising such a composition or such a polyamide, a powder comprising particles comprising such a polyamide and a method of obtaining a shaped article comprising such a polyamide. 1. A polymer selected from polyamide polymers , polyimide polymers and polyamideimide polymers , obtained through polymerisation of monomers comprising at least:a. one or more alkyl-BHT diamines selected from methyl-bis hexamethylene triamine, ethyl-bis hexamethylene triamine, n-propyl-bis hexamethylene triamine, and i-propyl-bis hexamethylene triamine, andb. one or more polycarboxylic acids selected from aliphatic polycarboxylic acids, aryl polycarboxylic acids, alkylaryl polycarboxylic acids, and arylalkyl polycarboxylic acids,wherein the polymer comprises a minimum amount of recurring units derived from the one more alkyl-BHT diamines of 1 mol % relative to the total mole amount of recurring units of the polymer derived from diamine monomers, andwhen the polymer is an aliphatic homopolyamide, then the one or more dicarboxylic acids each comprise at least 8 carbon atoms.2. A polymer according to claim 1 , wherein the amount of the one or more alkyl-BHT diamines claim 1 , ismore or equal to 10 mol %, more or equal to 20 mol %, more or equal to 30 mol %, more or equal to 40 mol %, more ...

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02-06-2022 дата публикации

Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide film

Номер: US20220169851A1
Принадлежит: Zhen Ding Technology Co Ltd

A transparent polyimide mixture is disclosed. The transparent polyimide mixture includes a transparent polyimide, an additive, and a solvent. A molecular chain of the transparent polyimide includes an active hydrogen atom. The additive includes a carbodiimide group. An equivalent ratio of the active hydrogen atom and the carbodiimide group is in a range of 1:0.8 to 1:1.2. A method for preparing the transparent polyimide mixture, a transparent polyimide film, and a method for preparing a transparent polyimide film are also disclosed.

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02-06-2022 дата публикации

Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device

Номер: US20220171285A1
Принадлежит: Fujifilm Corp

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

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19-04-2018 дата публикации

POLYAMIDE ACID COMPOSITION AND POLYIMIDE COMPOSITION

Номер: US20180105648A1
Автор: INOUE Youhei, Mori Hiroaki
Принадлежит: JFE CHEMICAL CORPORATION

A polyamide acid composition and a polyimide composition are obtained from a tetracarboxylic acid compound containing an aromatic tetracarboxylic acid compound having a naphthalene skeleton and a diamine compound containing an aromatic diamine compound having a biphenyl skeleton. 1. A polyamide acid composition comprising: tetracarboxylic acid compound containing 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, and', 'a diamine compound containing 95 to 75 mol % of p-phenylenediamine and 5 to 25 mol % of o-tolidine and/or 2,2′-bis(trifluoromethyl)benzidine., 'a polyamide acid obtained by polymerization of a2. The polyamide acid composition according to claim 1 , wherein the tetracarboxylic acid compound contains less than 100 mol % and 50 mol % or more of the 2 claim 1 ,3 claim 1 ,6 claim 1 ,7-naphthalenetetracarboxylic acid dianhydride and contains 50 mol % or less and more than 0 mol % of 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyltetracarboxylic acid dianhydride.3. A polyamide acid obtained by polymerization of a:tetracarboxylic acid compound containing 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, anda diamine compound containing 95 to 75 mol % of p-phenylenediamine and 5 to 25 mol % of o-tolidine and/or 2,2′-bis(trifluoromethyl)benzidine.4. The polyamide acid according to claim 3 , wherein the tetracarboxylic acid compound contains less than 100 mol % and 50 mol % or more of the 2 claim 3 ,3 claim 3 ,6 claim 3 ,7-naphthalenetetracarboxylic acid dianhydride and contains 50 mol % or less and more than 0 mol % of 3 claim 3 ,3′ claim 3 ,4 claim 3 ,4′-biphenyltetracarboxylic acid dianhydride.5. A polyimide composition comprising:a polyamide acid obtained by polymerization of a:tetracarboxylic acid compound containing 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, anda diamine compound containing 95 to 75 mol % of p-phenylenediamine and 5 to 25 mol % of o-tolidine and/or 2,2′-bis(trifluoromethyl)benzidine.6. The polyimide composition according to ...

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20-04-2017 дата публикации

ULTRA-THIN POLYIMIDE FILM, AND MANUFACTURE AND ASSEMBLY THEREOF

Номер: US20170107400A1
Автор: Huang Yen-Po
Принадлежит:

A polyimide film structure includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer. The base layer includes a polyimide, and a filler made of a siloxane polymer present at a weight ratio between about 5 wt % and about 40 wt % based on the total weight of the base layer. Moreover, the present application also describes a method of fabricating the polyimide film structure, and its assembly on a substrate. 1. A polyimide film structure comprising:a polyimide layer having a first and a second surface opposite to each other; anda base layer containing a polyimide that is peelably adhered to the first surface of the polyimide layer, the base layer comprising a filler made of a siloxane polymer dispersed therein, the filler being present at a weight ratio between about 5 wt % and about 40 wt % based on the total weight of the base layer.2. The polyimide film structure according to claim 1 , wherein the polyimide layer has a thickness less than 6 micrometers.3. The polyimide film structure according to claim 1 , wherein the filler is in the form of particles.4. The polyimide film structure according to claim 1 , wherein the peeling strength between the polyimide layer and the base layer is between 0.004 and 0.1 kgf/cm.5. The polyimide film structure according to claim 1 , wherein the polyimide of the base layer is formed by condensation reaction of diamine monomers with dianhydride monomers claim 1 , the diamine monomers being selected from the group consisting of 4 claim 1 ,4′-oxydianiline (4 claim 1 ,4′-ODA) claim 1 , phenylenediamine (p-PDA) and 2 claim 1 ,2′-Bis(trifluoromethyl)benzidine (TFMB) claim 1 , and the dianhydride monomers being selected from the group consisting of pyromellitic dianhydride (PMDA) claim 1 , 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-biphenyl-tetracarboxylic dianhydride (BPDA) claim 1 , and 2 claim 1 ,2-bis[4-(3 claim 1 ,4dicarboxyphenoxy) ...

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02-04-2020 дата публикации

POLY(AMIC ACID), POLY(AMIC ACID) SOLUTION, POLYIMIDE, POLYIMIDE FILM, LAYERED PRODUCT, FLEXIBLE DEVICE, AND PRODUCTION METHOD FOR POLYIMIDE FILM

Номер: US20200102423A1
Принадлежит: KANEKA CORPORATION

A polyamic acid that has a fluorine atom content of 25 wt % or less and an amount of a fluorine-containing diamine in the polyamic acid is 70 mol % or more with respect to 100 mol % of a sum of diamine components. The total number of moles of tetracarboxylic acid component in the polyamic acid is 0.960 times or more and less than 1.000 time total number of moles of diamine component. The polyamic acid preferably has the structural unit represented by formula (1) and the structural unit represented by formula (2). The polyamic acid may contain trans-1,4-cyclohexanediamine as the diamine component. 2. The polyamic acid according to claim 1 , wherein a total amount of the first structural unit and the second structural unit is 70 mol % or more.3. The polyamic acid according to claim 1 , wherein the diamine component comprises 1 to 30 mol % of trans-1 claim 1 ,4-cyclohexanediamine.4. A polyamic acid solution claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polyamic acid according to ; and'}an organic solvent.5. A polyimide that is a cyclodehydration product of the polyamic acid according to .6. A polyimide film claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00005', 'claim 5'}, 'the polyimide according to .'}7. The polyimide film according to claim 6 , wherein a haze of the polyimide film is 1% or less claim 6 , and a coefficient of thermal expansion of the polyimide film when temperature rise from 100° C. to 300° C. is 15 ppm/K or less.8. The polyimide film according to claim 6 , wherein a yellow index of the polyimide film is 10 or less.9. A laminate claim 6 , comprising:a support; and{'claim-ref': {'@idref': 'CLM-00006', 'claim 6'}, 'the polyimide film according to disposed on the support.'}10. A flexible device claim 6 , comprising:{'claim-ref': {'@idref': 'CLM-00006', 'claim 6'}, 'the polyimide film according to ; and'}an electronic element disposed on the polyimide film.11. A method for manufacturing a polyimide film claim 6 , ...

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11-04-2019 дата публикации

POROUS CROSS-LINKED PARTIALLY ALIPHATIC POLYIMIDE NETWORKS

Номер: US20190106541A1
Принадлежит:

Porous cross-linked partially aliphatic polyimide networks are provided. The polyimide networks comprise a polyamic acid oligomer that (i) comprises a repeating unit of a dianhydride and a diamine and terminal functional groups, (ii) has an average degree of polymerization of 10 to 70, (iii) has been cross-linked via a cross-linking agent, comprising three or more cross-linking groups, at a balanced stoichiometry of the cross-linking groups to the terminal functional groups, and (iv) has been chemically imidized to yield the porous cross-linked polyimide network. The polyimide networks are partially aliphatic based on (a) the diamine comprising a first diamine and a second diamine, wherein the first diamine comprises a linear aliphatic backbone chain, and the second diamine does not, and/or (b) the dianhydride comprising a first dianhydride and a second dianhydride, wherein the first dianhydride comprises a linear aliphatic backbone chain, and the second dianhydride does not. 1. A porous cross-linked partially aliphatic polyimide network comprising a polyamic acid oligomer that (i) comprises a repeating unit of a dianhydride and a diamine and terminal functional groups , (ii) has an average degree of polymerization of 10 to 70 , (iii) has been cross-linked via a cross-linking agent , comprising three or more cross-linking groups , at a balanced stoichiometry of the cross-linking groups to the terminal functional groups , and (iv) has been chemically imidized to yield the porous cross-linked polyimide network , wherein the polyimide network is partially aliphatic based on one or both of the following:(a) the diamine comprises: (i) a first diamine at 5 to 95% (mol %) and (ii) a second diamine at 5 to 95% (mol %), wherein (1) the first diamine comprises a first diamine linear aliphatic backbone chain comprising carbon atoms and optionally one or more oxygen atoms therein, extending a length of 3 to 30 atoms, and having a ratio of carbon:oxygen of 2:1 to 3:0, and (2) ...

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28-04-2016 дата публикации

NOVEL ACID DIANHYDRIDE, METHOD FOR PREPARING SAME, AND POLYIMIDE PREPARED THEREFROM

Номер: US20160115144A1
Принадлежит: KOLON INDUSTRIES, INC.

The present invention relates to a novel acid dianhydride, a method for preparing the same, and a polyimide prepared therefrom. More specifically, the acid dianhydride according to the present invention is useful as a colorless transparent polyimide unit exhibiting excellent thermal stability and a low dielectric ratio, and the polyimide of the present invention has excellent solubility to an organic solvent compared with the conventional polyimide. 3. The method of claim 2 , wherein the reaction of step (a) is a Michael addition reaction.4. The method of claim 2 , wherein the compound of Chemical Formula 2 is reacted at a molar ratio 1:0.45 to 1:0.55 with piperazine in step (a).5. The method of claim 2 , wherein the base catalyst of step (b) is selected from the group consisting of potassium hydroxide claim 2 , sodium hydroxide claim 2 , barium hydroxide claim 2 , calcium hydroxide claim 2 , aluminum hydroxide claim 2 , magnesium hydroxide claim 2 , and a combination thereof.6. The method of claim 2 , wherein the hydrolysis of step (b) is conducted at 40˜120° C. for 1˜6 hrs.7. The method of claim 2 , wherein the dehydrating agent of step (c) is selected from the group consisting of acetic anhydride claim 2 , pyridine claim 2 , isoquinoline claim 2 , a tertiary amine claim 2 , and a combination thereof.8. The method of claim 2 , wherein the ring-closing dehydration of step (c) is conducted at 40˜100° C. for 4˜28 hrs.9. The method of claim 2 , wherein the dehydrating agent of step (c) is used in an amount of 2˜10 moles per mole of the compound of Chemical Formula 4.11. A polyimide claim 10 , prepared from the polyamic acid of by ring-closing dehydration. The present invention relates to an acid dianhydride, a preparation method thereof, and a polyimide prepared therefrom.Polyimide finds a wide spectrum of applications in the electronic material industry including protecting materials, insulation materials, color filters, etc. for liquid crystal displays and ...

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26-04-2018 дата публикации

Aerogel materials and methods for their production

Номер: US20180112054A1
Принадлежит: Aerogel Technologies LLC

The present disclosure generally relates to aerogel materials and methods for producing them.

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18-04-2019 дата публикации

Pai-based coating composition

Номер: US20190112501A1
Принадлежит: Cymer-Dayton LLC

A process for PAI-based coating compositions. An embodiment of a method includes manufacturing a coating composition, the manufacturing of the coating composition including mixing a first solvent, the first being solvent being N-formyl morpholine (NFM), with a second solvent to form a first solution; dissolving polyamideimide or polyamide amic acid resin polymer (PAI) in the first solution; precipitating a PAI compound from to mixture of MEK and the first solution; and dissolving the PAI compound in a second solution to generate a coating solution.

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25-08-2022 дата публикации

Polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film

Номер: US20220267527A1
Принадлежит: FUJIFILM BUSINESS INNOVATION CORP

A polyimide precursor solution contains: an aqueous solvent containing water; particles; and a polyimide precursor, wherein the polyimide precursor has a high molecular weight region A containing a high molecular weight side maximum value and a low molecular weight region B containing a low molecular weight side maximum value in an elution curve obtained by gel permeation chromatography, a weight average molecular weight in the high molecular weight region A is 50,000 or more, a weight average molecular weight in the low molecular weight region B is 10,000 or more and 30,000 or less, and a value of a/(a+b) is 0.60 or more and 0.98 or less in which a represents an area of the high molecular weight region A and b represents an area of the low molecular weight region B.

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16-04-2020 дата публикации

COMPOSITIONS AND ARTICLES MADE FROM BRANCHED POLYETHERIMIDES

Номер: US20200115502A1
Принадлежит:

A branched polyimide of the formula (I) wherein G is a group having a valence of t, present in an amount of 0.01 to 10 mol %, or 0.05 to 5 mol %, or 0.1 to 4 mol %, or 0.1 to 3 mol %, each of Q, M, D, V, and R are as defined herein, q is 0 or 1, m is 0 or 1, d is 0 or 1, p is 1 or 2, t is 2 to 6, preferably 2 to 4, and each n is independently the same or different, and is 1 to 1,000, provided that the total of all values of n is greater than 4, wherein the branched polyimide has a zero-shear viscosity in a range from 500 to 15,000 Pa·s, a rheology ratio of 1.1 to 5, and a strain hardening ratio of 1 to 6. 2. The branched polyimide of claim 1 , wherein the branched polyimide has G is present in an amount of 0.3 to 0.5 mole percent, the rheology ratio is 1.1 to 1.5 and the strain hardening ratio is 1.1 to 1.5; or', 'G is present in an amount of 0.5 to 2 mole percent, the rheology ratio is 1.3 to 1.7, and the strain hardening ratio is 1.5 to 2.5; or', 'G is present in an amount of 2 to 3 mole percent, the rheology ratio is 1.6 to 2, and the strain hardening ratio is 2.5 to 3., 'a weight average molecular weight of 30,000 to 40,000 grams per mole, as measured by gel permeation chromatography using a triple point detector, wherein'}3. The branched polyimide of claim 1 , wherein the branched polyimide hasa weight average molecular weight of 40,100 to 52,000 grams per mole, as measured by gel permeation chromatography using a triple point detector, G is present in an amount of 0.3 to 0.5 mole percent, the rheology ratio is 1.5 to 2.5 and the strain hardening ratio is 3 to 4; or', 'G is present in an amount of 0.5 to 2 mole percent, the rheology ratio is 2 to 2.5, and the strain hardening ratio is 4 to 5; or', 'G is present in an amount of 2 to 3 mole percent, the rheology ratio is 2.5 to 3, and the strain hardening ratio is 4.5 to 5., 'wherein'}4. The branched polyimide of claim 1 , wherein the branched polyimide hasa weight average molecular weight of 52,100 to 68,000 ...

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31-07-2014 дата публикации

Preparation and properties of perylene and naphthalene polyimides and other rigid conjugated polymers via soluble amide-ester precursor

Номер: US20140209879A1
Автор: Daniel M. Knauss
Принадлежит: COLORADO SCHOOL OF MINES

This invention relates to a method for making soluble precursors to imides, polyimides, and polymers containing imide groups, and a method of making thin films of the same by solution casting and then removing the solubilizing group to produce thermally stable and insoluble materials.

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10-05-2018 дата публикации

POLYETHERIMIDE OF IMPROVED COLOR AND PROCESS OF PREPARING

Номер: US20180127546A1
Принадлежит:

A polyetherimide of improved color and processes for preparing the polyetherimide are disclosed. 2. The method of claim 1 , wherein the reactor is mixed using an agitator with two sets of pitched turbine blades claim 1 , with a blade to vessel diameter ratio range of about 0.45 to 0.65 claim 1 , at a speed in a range from about 40 to about 90 revolutions per minute claim 1 , in a reactor with a volume range from about 20 to 35 cubic meters claim 1 , and a cylindrical height to diameter ratio range of about 1.3 to about 1.6.3. The method of claim 2 , wherein the agitator has two sets of 45° pitched turbine blades with a blade to vessel diameter ratio of about 0.54 at a speed in a range from about 70 to about 86 revolutions per minute in a reactor with volume of about 28 cubic meters with a cylindrical height to diameter ratio of about 1.45.4. The method of claim 1 , further comprising quenching the polymerization with an acid at a temperature of from 130° C. to 200° C. claim 1 , or from 145° C. to 155° C.5. The method of claim 4 , wherein the acid is phosphoric acid.8. The method of claim 1 , further comprising up to 15 mole % of a capping agent.11. The method of claim 1 , whereinthe contacting the bis(phthalimide) is at an oil temperature of 150° C. to 320° C., in the presence of a catalyst and up to 15 mole % of a capping agent, based on the total moles of the alkali salt the dihydroxy aromatic compound and the capping agent;the reactor contents are mixed using an agitator with two sets of pitched turbine blades, with a blade to vessel diameter ratio range of about 0.45 to 0.65, at a speed in a range from about 40 to about 90 revolutions per minute, in a reactor with a volume range from about 20 to 35 cubic meters, and a cylindrical height to diameter ratio range of about 1.3 to about 1.6;the method further comprises quenching the polymerization with an acid at a temperature of from 130° C. to 200° C.; andthe polyetherimide has a -Yellowness Index of from less than ...

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01-09-2022 дата публикации

POLYIMIDE RESIN COMPOSITION, POLYIMIDE RESIN ADHESIVE LAYER, LAMINATE, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

Номер: US20220275205A1
Принадлежит: eChem Solutions Corp.

A polyimide resin composition, a polyimide resin adhesive layer, a laminate, and a manufacturing method of an electronic component are provided. The polyimide resin composition includes a polyimide resin. The polyimide resin is obtained by the polymerization reaction of a diamine (A) and a tetracarboxylic dianhydride (B). The diamine (A) includes a diamine (A-1) represented by following Formula (I-1) and a diamine (A-2) represented by following Formula (I-2). A molar ratio ((A-1):(A-2)) of the diamine (A-1) to the diamine (A-2) is 0.1:0.2 to 0.6. 334. The polyimide resin composition according to claim 1 , wherein the diamine (A) further comprises claim 1 ,′-diaminodiphenyl ether.4. The polyimide resin composition according to claim 1 , wherein the tetracarboxylic dianhydride (B) comprises 3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-diphenyl ether tetracarboxylic dianhydride.11. A polyimide resin adhesive layer claim 1 , formed by the polyimide resin composition according to .12. A laminate claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00011', 'claim 11'}, 'the polyimide resin adhesive layer according to , having a first surface and a second surface opposite to each other;'}a first substrate, bonded to the first surface of the polyimide resin adhesive layer;a release layer, having a third surface and a fourth surface opposite to each other, wherein the third surface of the release layer is bonded to the second surface of the polyimide resin adhesive layer;a second substrate, bonded to the fourth surface of the release layer; andan electronic component, embedded in the polyimide resin adhesive layer and connected to the release layer.13. A manufacturing method of an electronic component claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00012', 'claim 12'}, 'providing the laminate according to ;'}removing the release layer and the second substrate from the laminate to expose the second surface of the polyimide resin adhesive layer and a part of the electronic component; ...

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19-05-2016 дата публикации

Polymide precursor and polymide

Номер: US20160137787A1
Принадлежит: UBE Industries Ltd

A polyimide precursor consisting of a repeating unit represented by the following chemical formula (1): and a repeating unit represented by the following chemical formula (2): in which A is a tetravalent group of a tetracarboxylic acid, from which carboxyl groups have been removed; B is a divalent group of a diamine, from which amino groups have been removed; with the proviso that the A group and the B group contained in each repeating unit may be the same as, or different from each other; and X 1 and X 2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, the amount of the repeating unit represented by the chemical formula (2) is 30 mol % or more and 90 mol % or less relative to the total repeating units, 50 mol % or more of the total amount of the B group in the chemical formula (1) and the chemical formula (2) is p-phenylene group and/or a specific divalent group containing two or more benzene rings, the polyimide precursor is produced by thermal imidization.

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03-06-2021 дата публикации

Adhesive film and flexible printed circuit board

Номер: US20210163790A1
Принадлежит: Nippon Mektron KK

An adhesive film includes: a resin film layer; and an adhesive layer laminated to the resin film layer, in which the adhesive layer includes an adhesive agent, the adhesive layer is in a B stage state, an oxygen transmission rate at 200° C. of the resin film layer, measured in accordance with JIS K7126-1, is 1.50×10−10 cc·cm/cm2·sec·cmHg or less, and a 3% thermal weight reduction temperature of the adhesive agent is 320° C. or higher.

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21-05-2015 дата публикации

POROUS CROSS-LINKED POLYIMIDE NETWORKS

Номер: US20150141544A1
Принадлежит:

Porous cross-linked polyimide networks are provided. The networks comprise an anhydride end-capped polyamic acid oligomer. The oligomer (i) comprises a repeating unit of a dianhydride and a diamine and terminal anhydride groups, (ii) has an average degree of polymerization of 10 to 50, (iii) has been cross-linked via a cross-linking agent, comprising three or more amine groups, at a balanced stoichiometry of the amine groups to the terminal anhydride groups, and (iv) has been chemically imidized to yield the porous cross-linked polyimide network. Also provided are porous cross-linked polyimide aerogels comprising a cross-linked and imidized anhydride end-capped polyamic acid oligomer, wherein the oligomer comprises a repeating unit of a dianhydride and a diamine, and the aerogel has a density of 0.10 to 0.333 g/cmand a Young's modulus of 1.7 to 102 MPa. Also provided are thin films comprising aerogels, and methods of making porous cross-linked polyimide networks. 1. A porous cross-linked polyimide network comprising an anhydride end-capped polyamic acid oligomer , wherein the oligomer (i) comprises a repeating unit of a dianhydride and a diamine and terminal anhydride groups , (ii) has an average degree of polymerization of 10 to 50 , (iii) has been cross-linked via a cross-linking agent , comprising three or more amine groups , at a balanced stoichiometry of the amine groups to the terminal anhydride groups , and (iv) has been chemically imidized to yield the porous cross-linked polyimide network.2. The network of claim 1 , wherein the dianhydride is selected from the group consisting of benzophenone-3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-tetracarboxylic dianhydride and biphenyl-3 claim 1 ,3′ claim 1 ,4 claim 1 ,4′-tetracarboxylic dianhydride.3. The network of claim 1 , wherein the diamine is selected from the group consisting of 3 claim 1 ,4-oxydianiline claim 1 , 4 claim 1 ,4′-oxydianiline claim 1 , p-phenylene diamine claim 1 , 2 claim 1 ,2′-dimethylbenzidine ...

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03-06-2021 дата публикации

Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern

Номер: US20210165327A1
Принадлежит: Mitsubishi Gas Chemical Co Inc

An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. The problem described above can be solved by the following film forming material for lithography. A film forming material for lithography comprising:a compound having a group of formula (0A):(In formula (0A),RA is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; andRB is an alkyl group having 1 to 4 carbon atoms.); anda compound having a group of formula (0B):

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09-05-2019 дата публикации

METHOD FOR SYNTHESIZING ADDITIVE OF LITHIUM BATTERY AND CATHODE THEREOF

Номер: US20190140282A1
Принадлежит:

The present disclosure provides an additive of a lithium ion battery. The additive is an oligomer prepared by mixing maleimides and thiobarbituric acid and reacting the mixture of maleimides and thiobarbituric acid at 80° C.-130° C. for 0.5-24 hours. The present disclosure also provides a cathode of the lithium battery with the additive. The additive is 0.5-10 wt % based on the total weight of the cathode active material and the additive. 1. A method for manufacturing an additive of a lithium battery , the method comprising:mixing a maleimide and a thiobarbituric acid in a solvent to form a mixture, wherein a molar ratio of the maleimide to the thiobarbituric acid is from 2:1 to 1:1; andreacting the mixture to form an oligomer.2. The method of claim 1 , wherein the maleimide is monomaleimide or bismaleimide.3. The method of claim 2 , wherein the monomaleimide comprises N-phenylmaleimide claim 2 , N-(ortho-methylphenyl)-maleimide claim 2 , N-(meta-methylphenyl)-maleimide claim 2 , N-(para-methylphenyl)-maleimide claim 2 , N-cyclohexylmaleimide claim 2 , maleimidophenol claim 2 , maleimidobenzocyclobutene claim 2 , phosphorus-containing maleimide claim 2 , phosphoric maleimide claim 2 , siloxy maleimide claim 2 , N-(tetrahydropyranyl-oxyphenyl)-maleimide claim 2 , 2 claim 2 ,6-xylylmaleimide or a combination thereof.5. The method of claim 1 , wherein the solvent comprises N-methyl-2-pyrrolidone.6. The method of claim 1 , wherein reacting the mixture to form the oligomer is performed in an environment at a temperature of 80° C.-130° C.7. The method of claim 1 , wherein a duration of reacting the mixture to form the oligomer is 0.5-24 hours.9. The cathode of the lithium battery of claim 8 , further comprising:a cathode active material;a conductive material;an adhesive; anda conductive substrate, wherein the adhesive, the cathode active material, the conductive material and the adhesive are disposed on the conductive substrate.10. The cathode of the lithium battery of ...

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02-06-2016 дата публикации

CROSS-LINKED POLYIMIDE GAS SEPARATION MEMBRANE, METHOD OF MANUFACTURING THE SAME, AND USE OF THE SAME

Номер: US20160151738A1
Принадлежит:

A membrane having a polyimide-containing separation layer in which —OH groups on a backbone of the polyimide are cross-linked with a cross-linking agent to form urethane linkages between the adjacent chains. 1. A method of manufacturing a crosslinked polyimide membrane , comprising the steps of:forming a membrane having a polyimide-containing separation layer, the polyimide including —OH groups on a backbone thereof; andcrosslinking at least some of the adjacent chains of the polyimide with a crosslinking agent at the —OH groups to form urethane linkages between said adjacent chains, the crosslinking agent being selected from the group consisting of monomeric diisocyanates, monomeric triisocyanates, and polymeric isocyanates.3. The method of claim 2 , wherein Ris the molecular segment of formula (C).4. The method of claim 3 , wherein Z is the molecular segment of formula (j).5. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (1).6. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (2).7. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (3).8. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (4).9. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (5).10. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (6).11. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (7).12. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (8).13. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (9).14. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (10).15. The method of claim 2 , wherein 10-100% of the R's are the molecular segments of formula (11).16. The membrane produced by the method of .17. ...

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02-06-2016 дата публикации

Dianhydrides, polyimides, methods of making each, and methods of use

Номер: US20160152630A1

Embodiments of the present disclosure provide for an aromatic dianhydride, a method of making an aromatic dianhydride, an aromatic dianhydride-based polyimide, a method of making an aromatic dianhydride-based polyimide, and the like.

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31-05-2018 дата публикации

FABRICATION OF A ROLL OF A GRAPHITE FILM BASED ON A ROLLED POLYIMIDE FILM

Номер: US20180148339A1
Автор: Lai Yu-Chen, Wu Jia-Hao
Принадлежит:

A process of fabricating a graphite film includes providing a roll of a polyimide film, applying a first thermal treatment so that the roll of the polyimide film is carbonized to form a roll of a carbon film, and applying a second thermal treatment so that the roll of the carbon film is converted to a roll of a graphite film. The rolled polyimide film has a thickness between 10 μm and 150 μm, and includes polyimide derived from reaction of diamine monomers with dianhydride monomers, the dianhydride monomers including pyromellitic dianhydride (PMDA), the diamine monomers including 4,4′-oxydianiline (4,4′-ODA) and phenylenediamine (PDA) with a ODA:PDA diamine molar ratio being 50:50 to 80:20. 1. A process of fabricating a graphite film , comprising:providing a roll of a polyimide film, the polyimide film being formed from reaction of diamine monomers with dianhydride monomers, the dianhydride monomer including pyromellitic dianhydride (PMDA), the diamine monomers including 4,4′-oxydianiline (4,4′-ODA) and phenylenediamine (PDA) with a molar ratio of ODA:PDA being 50:50 to 80:20, and the polyimide film having a thickness between about 10 μm and about 150 μm;applying a first thermal treatment so that the roll of the polyimide film is carbonized to form a roll of a carbon film; andapplying a second thermal treatment so that the roll of the carbon film is converted to a roll of a graphite film.2. The process according to claim 1 , wherein the polyimide film has a Young's modulus between about 330 kgf/mmand about 480 kgf/mm.3. The process according to claim 1 , wherein the molar ratio of ODA:PDA is 70:30 to 50:50 claim 1 , and the polyimide film has a thickness between about 10 μm and about 25 μm.4. The process according to claim 1 , wherein the molar ratio of ODA:PDA is 75:25 to 60:40 claim 1 , and the polyimide film has a thickness between about 25 μm and about 38 μm.5. The process according to claim 1 , wherein the molar ratio of ODA:PDA is 80:20 to 65:35 claim 1 , and ...

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01-06-2017 дата публикации

Polyimide and polyimide film

Номер: US20170152348A1
Принадлежит: Taiflex Scientific Co Ltd

A polyimide is provided. The polyimide includes a repeating unit represented by formula 1. In formula 1, Ar is a tetravalent residue obtainable from a tetracarboxylic dianhydride containing a fluorine-containing aromatic group or an oxygen-containing aromatic group, and A is

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01-06-2017 дата публикации

WATER-SOLUBLE POLYAMIC ACID, METHOD OF PREPARING THE SAME, BINDER COMPOSITION FOR LITHIUM BATTERY INCLUDING THE SAME, AND LITHIUM BATTERY MANUFACTURED USING THE BINDER COMPOSITION

Номер: US20170155151A1
Принадлежит:

A water-soluble partially lithiated polyamic acid having an acid equivalent of less than 300 grams per equivalent and a degree of lithium ion substitution of from about 0.2 equivalents to about 1.0 equivalent with respect to carboxylic acid groups, which is a product of a polyamic acid and lithium hydroxide. 1. A water-soluble partially lithiated polyamic acid having an acid equivalent of less than 300 grams per equivalent and a degree of lithium ion substitution of from about 0.2 equivalents to about 1.0 equivalent with respect to carboxylic acid groups , which is a product of a polyamic acid and lithium hydroxide.2. The water-soluble partially lithiated polyamic acid of claim 1 , wherein the acid equivalent of the polyamic acid is between about 50 grams per equivalent and about 250 grams per equivalent.3. The water-soluble partially lithiated polyamic acid of claim 1 , wherein the water-soluble polyamic acid has a pH of from about 4 to about 7.4. The water-soluble partially lithiated polyamic acid of claim 1 , wherein the water-soluble polyamic acid has an imidization ratio of from about 50% to about 90% at a curing temperature of 150° C. or less.5. A binder composition for a lithium battery claim 1 , comprising the water-soluble partially lithiated polyamic acid according to and a solvent.6. The binder composition of claim 5 , wherein the solvent is water claim 5 , a polar organic solvent claim 5 , or a combination thereof.7. The binder composition of claim 6 , wherein the polar organic solvent is at least one solvent selected from N claim 6 ,N-dimethylformamide claim 6 , N claim 6 ,N-dimethylacetamide claim 6 , methyl ethyl ketone claim 6 , cyclohexanone claim 6 , ethyl acetate claim 6 , butyl acetate claim 6 , cellosolve acetate claim 6 , propylene glycol monomethyl ether acetate claim 6 , methyl cellosolve claim 6 , butyl cellosolve claim 6 , methyl carbitol claim 6 , butyl carbitol claim 6 , propylene glycol monomethyl ether claim 6 , diethylene glycol ...

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07-06-2018 дата публикации

THERMOPLASTIC (CO)POLYIMIDES AND SYNTHESIS METHODS

Номер: US20180155498A1
Автор: Jeol Stéphane
Принадлежит: Rhodia Operations

A salt composition includes at least one ammonium carboxylate salt obtained from: (a) at least one aromatic compound comprising 2 anhydride functional groups and/or its carboxylic acid and/or ester derivatives; and (b) one or more aliphatic diamines in which said aliphatic diamine or diamines are chosen from the diamines of formula (I) NH—R—NHwith R being a saturated aliphatic divalent hydrocarbon radical, the two amine functional groups of which are separated by 4 to 6 carbon atoms and 1 or 2 hydrogen atoms of the divalent radical of which are replaced by 1 or 2 methyl and/or ethyl groups; and optionally the diamines of formula (II) NH—R′—NHwith R′ being a saturated or unsaturated and aliphatic, cycloaliphatic or arylaliphatic divalent hydrocarbon radical, which optionally comprises heteroatoms; and at least one chain-limiting compound chosen from monoamines, monoacids or diacids in the α,β positions. 117.-. (canceled)18. A salt composition , comprising: (a) at least one aromatic compound comprising 2 anhydride functional groups and/or its carboxylic acid and/or ester derivatives; and', {'sub': 2', '2', '2', '2, '(b) one or more aliphatic diamines in which said aliphatic diamine or diamines are chosen from the diamines of formula (I) NH—R—NHwith R being a saturated aliphatic divalent hydrocarbon radical, the two amine functional groups of which are separated by 4 to 6 carbon atoms and 1 or 2 hydrogen atoms of the divalent radical of which are replaced by 1 or 2 methyl and/or ethyl groups; and optionally the diamines of formula (II) NH—R′—NHwith R′ being a saturated or unsaturated and aliphatic, cycloaliphatic or arylaliphatic divalent hydrocarbon radical, which optionally comprises heteroatoms; and'}], 'at least one ammonium carboxylate salt obtained fromat least one chain-limiting compound chosen from monoamines, monoacids or diacids in the α,β positions such that they can form an anhydride functional group by a dehydration reaction.19. The salt composition as ...

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22-09-2022 дата публикации

POWDER COMPOSITION COMPRISING POLYIMIDE PARTICLES, THREE-DIMENSIONAL POLYIMDE-BASED BODY, AND METHOD OF FORMING THE BODY

Номер: US20220298303A1
Принадлежит:

In one embodiment, a powder composition can comprise polyimide particles, wherein the polyimide particles can have a glass transition temperature of not greater than 200° C. and a crystallinity of not greater than 20%. The powder composition can be adapted for forming a three-dimensional polyimide-based body in a powder-based additive manufacturing process. In one aspect, the polyimide particles can have an average particle size (D50) of at least 20 microns and not greater than 120 microns, an amount of the polyimide particles can be at least 60 wt % based on the total weight of the powder composition; and a material of the polyimide particles is a polymerization product of at least one diamine monomer and at least one dianhydride monomer. 4. The powder composition of claim 1 , wherein a glass transition temperature of the polyimide particles is at least 130° C. and not greater than 200° C.5. The powder composition of claim 1 , wherein a difference between the onset melting temperature (T) and the glass transition temperature (T) of the polyimide particles is not greater than 20° C.6. The powder composition of claim 1 , wherein a molecular weight of the polyimide particles is at least 10 claim 1 ,000 g/mol and not greater than 800 claim 1 ,000 g/mol.7. The powder composition of claim 1 , further comprising an additive claim 1 , the additive including a thermally conductive filler claim 1 , an electrically conductive filler claim 1 , a flow aid claim 1 , a flame retardant claim 1 , an IR absorber claim 1 , a stabilizer claim 1 , a color dye claim 1 , an electrostatic dissipative (ESD) additive claim 1 , or any combination thereof.8. The powder composition of claim 7 , wherein the additive is selected from carbon fibers claim 7 , glass fibers claim 7 , glass beads claim 7 , hollow glass beads claim 7 , a UV stabilizer claim 7 , a heat stabilizer claim 7 , a ceramic claim 7 , a mineral claim 7 , mica claim 7 , wollastonite claim 7 , carbon nano tubes claim 7 , graphite ...

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14-05-2020 дата публикации

DIANHYDRIDES, POLYIMIDES DERIVED FROM BISCATECOL, METHODS OF MAKING, AND METHODS OF USE

Номер: US20200148825A1
Автор: Ma Xiaohua
Принадлежит:

The present disclosure provides for a multi-anhydride, a polyimide, a method of making a dianhydride, a method making a multi-anhydride, a method of making a polyimide, and the like. 3. The method of claim 2 , wherein the first step comprises dissolving the reactants under alkaline pH using a solvent selected from the group consisting of dichloromethane claim 2 , chloroform claim 2 , tetrahydrofuran claim 2 , dimethylformamide and dimethylacetamide.4. The method of claim 3 , wherein the solvent is dichloromethane.5. The method of claim 2 , wherein step two comprises reacting in the presence of a catalyst selected from the group consisting of zinc cyanide claim 2 , palladium(II) chloride claim 2 , palladium(II) acetate claim 2 , and tris(dibenzylideneacetone)dipalladium(0).6. The method of claim 2 , wherein the second step comprises reacting in the presence of a ligand selected from the group consisting of triphenylphosphine (PPh) claim 2 , dibenzylideneacetone claim 2 , 1 claim 2 ,2-Bis(diphenylphosphino)ethane (dppe) 1 claim 2 ,3-Bis(diphenylphosphino)propane (dppp) claim 2 , and 1 claim 2 ,1′-Bis(diphenylphosphino)ferrocene (dppf).7. The method of claim 2 , wherein the third step comprises refluxing in a mixture of ethanol and water claim 2 , wherein the ratio ethanol to water is within the range of about 10:1 to about 1:10 (v/v).8. The method of claim 2 , wherein the fourth step comprises refluxing for about 1 hour to about 48 hours within a temperature range of about 100° C. to 140° C.11. The method of claim 10 , comprising reacting the anhydride and the diamine in a solvent selected from the group consisting of N-Methyl-2-pyrrolidone (NMP) claim 10 , m-Cresol claim 10 , Dimethyl Sulfoxide (DMSO) claim 10 , and Dimethylacetamide (DMAc).12. The method of claim 10 , wherein the diamine is 2 claim 10 ,3 claim 10 ,5 claim 10 ,6-Tetramethyl-p-phenylenediamine.14. The composition of claim 13 , wherein the composition is in the form of a membrane.15. The composition of ...

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24-06-2021 дата публикации

THIN FILM MATERIAL AND MANUFACTURING METHOD OF THIN FILM MATERIAL

Номер: US20210189077A1
Автор: Wang Yamin
Принадлежит:

The present disclosure provides a thin film material and a manufacturing method thereof. The manufacturing method of the thin film material comprises: a compound A and a first reactant reacting to form a compound B; the compound B and a second reactant reacting to form a compound C; the compound C and a third reactant reacting to form a polymer D; the polymer D reacting to obtain a mixture including a polymer F or a polymer H; and a solution including the polymer F or the polymer H forming the polymer F or the polymer H on a substrate. 31. The manufacturing method of the thin film material according to claim 1 , wherein the step S comprises:{'b': '11', 'S: providing a first container containing a first solvent dissolving with the compound A; and'}{'b': '12', 'S: adding the first reactant to the first container drop by drop and forming a compound B1 at a first reaction temperature for a first reaction time or'}adding the first reactant to the first container at one time and forming a compound B2 at a first reaction temperature for a first reaction time.6. The manufacturing method of the thin film material according to claim 3 , wherein the first reactant comprises sodium nitrite.71. The manufacturing method of the thin film material according to claim 3 , wherein the step S comprises:{'b': '13', 'S: adding a first volume of a first separating agent in the first container, then stirring, and setting aside;'}{'b': '14', 'S: adding a second volume of a second separating agent in the first container, then extracting, collecting an organic layer, and rotarily evaporating to obtain a first crude product including the compound B1 or the compound B2; and'}{'b': '15', 'S: leaching the first crude product by a first eluent and rotarily evaporating to obtain the purified compound B1 or the purified compound B2.'}82. The manufacturing method of the thin film material according to claim 1 , wherein the step S comprises:{'b': '21', 'S: providing a second container containing a ...

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30-05-2019 дата публикации

Polyimide resin

Номер: US20190161581A1
Принадлежит: Mitsubishi Gas Chemical Co Inc

A polyimide resin including a structural unit A derived from a tetracarboxylic dianhydride and a structural unit B derived from a diamine compound, wherein the structural unit A includes at least one of a structural unit (A-1) derived from a compound represented by the following formula (a-1), a structural unit (A-2) derived from a compound represented by the following formula (a-2), and a structural unit (A-3) derived from a compound represented by the following formula (a-3), the structural unit B comprises a structural unit (B-1) derived from a compound represented by the following formula (b-1), a proportion of the structural unit (B-1) in the structural unit B is 60 mol % or more, and the polyimide resin has a glass transition temperature of higher than 410° C.: wherein X and Y in the formula (b-1) each independently are a hydrogen atom, a methyl group, a chlorine atom, or a fluorine atom.

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30-05-2019 дата публикации

MONOMER, POLYMER, COMPENSATION FILM, OPTICAL FILM, AND DISPLAY DEVICE

Номер: US20190162888A1
Принадлежит:

A monomer represented by Chemical Formula 1-1 This application is a divisional of U.S. patent application Ser. No. 15/242,862 filed in the United States Patent and Trademark Office on Aug. 22, 2016, which claims priority to Korean Patent Application No. 10-2015-0121502 filed in the Korean Intellectual Property Office on Aug. 28, 2015, and all the benefits accruing therefrom under 35 U.S.C. § 119, the contents of both applications being incorporated herein in their entireties by reference.A monomer, a polymer, a compensation film, an optical film, and a display device are disclosed.A flat panel displays may be classified into a light-emitting display device emitting light by itself and a non-emissive display device requiring a separate light source, and a compensation film or an optical film is frequently employed for improving the image quality thereof. There still remains a need in novel polymers, which can improve the properties of the existing compensation and optical films.An embodiment provides a novel monomer that is applicable to a compensation film.Another embodiment provides a polymer including a moiety derived from the novel monomer by polymerization of the novel monomer.Yet another embodiment provides a compensation film including the polymer.Still another embodiment provides an optical film including the compensation film.A further embodiment provides a display device including the compensation film or the optical film.According to an embodiment, a monomer represented by Chemical Formula 1-1 is provided.In Chemical Formula 1-1,Z is —O—, —C═O—, —(C═O)O—, —O(C═O)—, —CHO—, —CFO—, —OC(═O)O—, —C≡C—, —CH═CH—, —CF═CF—, or —C(═O)NR—,Land Lare independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C1 to C20 oxyalkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group, a substituted or unsubstituted C3 to C20 oxycycloalkylene group, a substituted or unsubstituted C6 to C20 arylene ...

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06-06-2019 дата публикации

NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS

Номер: US20190169211A1
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1). 3. The tetracarboxylic dianhydride according to claim 1 , wherein Z in the general formula (1) is a divalent organic group shown by the following general formula (4) claim 1 ,{'br': None, 'sub': 2', 'm', 'l', '2', 'm, 'sup': '15', '\ue8a0CH\ue8a0O\ue8a0R—O\ue8a0\ue8a0CH\ue8a0\u2003\u2003(4)'}{'sup': '15', 'wherein Rrepresents a linear or branched alkylene group having 2 to 15 carbon atoms; “1” represents an integer of 1 to 50; and “m” represents an integer of 2 to 15.'}8. A positive type photosensitive resin composition comprising:{'claim-ref': {'@idref': 'CLM-00004', 'claim 4'}, '(A) the polyimide resin according to ;'}(B) a photosensitive agent which generates an acid by light to increase a dissolution rate in an aqueous alkaline solution and is a compound having a quinonediazide structure; and(D) a solvent.11. A patterning process comprising the steps of:{'claim-ref': {'@idref': 'CLM-00008', 'claim 8'}, '(1) coating the positive type photosensitive resin composition according to onto a substrate to form a film of a photosensitive material;'}(2) after heat treatment, exposing the film of the photosensitive material by a high energy beam with a wavelength of 190 to 500 nm or an electron beam through a photomask; and(3) developing the film using a developing solution of an aqueous alkaline solution.12. A patterning process comprising the steps of:{'claim-ref': {'@idref': 'CLM-00009', ...

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04-06-2020 дата публикации

Binder resin for electrodes, electrode mixture paste, electrode and method for producing electrode

Номер: US20200172731A1
Принадлежит: UBE Industries Ltd

A binder resin for electrodes consisting of a polyimide-based resin having a melting point of 300° C. or lower, an electrode mixture paste including the binder resin for electrodes, an electrode active material, and a solvent; and an electrode including an electrode mixture layer including the binder resin for electrodes and an electrode active material; and a method for producing the electrode.

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29-06-2017 дата публикации

LIQUID CRYSTAL DISPLAY ELEMENT, LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL ALIGNMENT TREATMENT AGENT

Номер: US20170184923A1
Принадлежит: NISSAN CHEMICAL INDUSTRIES, LTD.

To provide a liquid crystal display device, in which the vertical alignment property of the liquid crystal is high, favorable transparency when no voltage is applied and favorable scattering property when a voltage is applied are achieved, and the adhesion between the liquid crystal layer and the vertical liquid crystal alignment film is high. 2. The liquid crystal display device according to claim 1 , wherein the liquid crystal aligning agent is a liquid crystal aligning agent comprising a polyimide precursor obtained by a reaction of a diamine component comprising a diamine having the side chain structure represented by the formula [1-1] or [1-2] and a diamine having the side chain structure represented by the formula [2] claim 1 , and a tetracarboxylic acid component claim 1 , or a polyimide obtained by imidizing the polyimide precursor.3. The liquid crystal display device according to claim 2 , wherein the proportion of the diamine having the side chain structure represented by the formula [1-1] or [1-2] is from 10 to 80 mol % based on the diamine component.4. The liquid crystal display device according to claim 2 , wherein the proportion of the diamine having the side chain structure represented by the formula [2] is from 1 to 50 mol % based on the diamine component.9. The liquid crystal display device according to claim 1 , wherein the liquid crystal aligning agent comprises at least one generator selected from the group consisting of a photo-radical generator claim 1 , a photo-acid generator and a photo-base generator.11. The liquid crystal display device according to claim 1 , wherein the liquid crystal aligning agent comprises a compound having at least one group selected from the group consisting of an epoxy group claim 1 , an isocyanate group claim 1 , an oxetane group claim 1 , a cyclocarbonate group claim 1 , a hydroxy group claim 1 , a hydroxyalkyl group and a lower alkoxyalkyl group.13. The liquid crystal display device according to claim 1 , wherein ...

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05-07-2018 дата публикации

CURABLE BENZOXAZINE COMPOSITIONS

Номер: US20180186730A1
Принадлежит:

The present disclosure provides a curable composition containing a benzoxazine, reactive diluent and a soluble polyimide. The curable composition, upon curing, renders an article having well balanced thermal, chemical and mechanical properties and may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components. 1. A curable composition comprising:(a) a benzoxazine;(b) a reactive diluent; and(c) a soluble polyimide derived from (i) a phenylindane diamine and (ii) a phenylindane dianhydride and/or dianhydride.4. The curable composition of wherein the reactive diluent is an epoxy reactive diluent.5. The curable composition of wherein the epoxy reactive diluent is selected from vinylcyclohexene dioxide claim 4 , limonene dioxide claim 4 , dicyclopentadiene dioxide claim 4 , 3 claim 4 ,4-epoxydihydrodicyclopentadienyl glycidyl ether claim 4 , a bis(3 claim 4 ,4-epoxydihydrodicyclopentadienyl) ether of ethylene glycol claim 4 , 3 claim 4 ,4-epoxycyclohexylmethyl 3 claim 4 ,4′-epoxycyclohexanecarboxylate claim 4 , a 6 claim 4 ,6′-dimethyl derivative of 3 claim 4 ,4-epoxycyclohexylmethyl 3 claim 4 ,4′-epoxycyclohexanecarboxylate claim 4 , a bis(3 claim 4 ,4-epoxycyclohexanecarboxylate) of ethylene glycol claim 4 , an acetal formed between 3 claim 4 ,4-epoxycyclohexanecarboxyaldehyde and 1 claim 4 , 1-bis(hydroxymethyl)-3 claim 4 ,4-epoxycyclohexane and bis(2 claim 4 ,3-epoxycyclopentyl)ether.8. The curable composition of claim 1 , wherein the soluble polyimide is derived from 5(6)-amino-1(4′-aminophenyl)1 claim 1 ,1 claim 1 ,3-trimethylindande and benzophenone tetracarboxylic acid dianhydride (BTDA).9. The curable composition of further comprising one or more additives.10. A process for producing a curable composition comprising (a) mixing a soluble polyimide derived from (i) a phenylindane diamine and (ii) a phenylindane dianhydride and/or a dianhydride with a reactive diluent and ...

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06-07-2017 дата публикации

COMPOSITION FOR PREPARING TRANSPARENT POLYMER FILM, TRANSPARENT POLYMER FILM, AND ELECTRONIC DEVICE INCLUDING SAME

Номер: US20170190880A1
Принадлежит:

A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) at least one of (i) a polyimide, a polyamic acid, or a poly(imide-amic acid) including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a poly(imide-amide) copolymer, a poly(amic acid-amide) copolymer, or a poly(imide and amic acid-amide) copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a compound having a maximum absorption wavelength at about 570 nm or more in a visible radiation region: 2. The composition of claim 1 , wherein the compound having a maximum absorption wavelength at about 570 nanometers or more in a visible radiation region is included in an amount of about 1 part per million or greater based on a total weight of (i) the polyimide claim 1 , the polyamic acid claim 1 , or the poly(imide-amic acid) claim 1 , and/or (ii) the poly(imide-amide) copolymer claim 1 , the poly(amic acid-amide) copolymer claim 1 , or the poly(imide and amic acid-amide) copolymer.3. The composition of claim 1 , wherein the compound having a maximum absorption wavelength at about 570 nanometers or more in a visible radiation region comprises at least one blue pigment selected from a metal phthalocyanine pigment claim 1 , an indanthrone pigment claim 1 , and an indophenol pigment claim 1 , or at least one violet pigment selected from dioxazine violet claim 1 , first violet B claim 1 , methyl violet claim 1 , and indanthrene brilliant violet.4. The composition of claim 1 , wherein the composition comprises the compound having a maximum absorption wavelength at about 570 nanometers or more in a visible radiation region in an amount of about 1 part per million to about 100 parts per million based ...

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11-06-2020 дата публикации

SOLID ELECTROLYTE COMPOSITION, BINDER FOR ALL-SOLID-STATE SECONDARY BATTERIES, AND ELECTRODE SHEET FOR BATTERIES AND ALL-SOLID-STATE SECONDARY BATTERY EACH USING SAID SOLID ELECTROLYTE COMPOSITION

Номер: US20200181308A1
Принадлежит: FUJIFILM Corporation

Provided are a solid electrolyte composition including: an inorganic solid electrolyte having conductivity of an ion of metal belong to Group 1 or 2 in the periodic table; and a high polymer binder, in which the high polymer binder is formed of a polymer having a hard segment and a soft segment, a binder for all-solid-state secondary batteries, and an electrode sheet for batteries and an all-solid-state secondary battery each using the solid electrolyte composition. 1. A solid electrolyte composition comprising:an inorganic solid electrolyte having conductivity of an ion of metal belong to Group 1 or 2 in the periodic table; anda high polymer binder,wherein the high polymer binder is formed of a polymer having a hard segment and a soft segment and further having, as a third component other than the hard segment and the soft segment, a repeating unit having a hetero atom-containing group having at least one functional group selected from the group consisting of a carboxylic acid group, a sulfonic acid group, a tertiary amino group, a cyano group, a hydroxyl group, and a metal alkoxide group.2. The solid electrolyte composition according to claim 1 ,wherein a content of the repeating unit having the hetero atom-containing group is 5 mol % to 30 mol %.3. The solid electrolyte composition according to claim 1 ,wherein the hard segment forming the high polymer binder contains at least any one bond of an amide bond, an urea bond, an urethane bond, and an imide bond.4. The solid electrolyte composition according to claim 1 ,wherein the soft segment forming the high polymer binder contains at least any one of a polyalkylene oxide chain, a polycarbonate chain, a polyester chain, and a silicone chain.5. The solid electrolyte composition according to claim 1 ,wherein the polymer forming the high polymer binder includes a carbon-carbon unsaturated group.9. The solid electrolyte composition according to claim 1 , further comprising:an electrode active substance.10. The solid ...

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11-06-2020 дата публикации

RENEWABLE FURAN BASED POLYIMIDES FOR COMPOSITE APPLICATIONS

Номер: US20200181329A1
Принадлежит:

A renewable polyimide or polyamic acid formed from a reaction comprising one or more furfurylamine compounds of Formula (I) or Formula (II) and one or more dianhydride or diacid compounds and heating to a temperature of up to 350° C., as well as methods of forming thereof, and polymers comprising the polyimide or polyamic acid compounds. The renewable furan based polyimides which demonstrate excellent processability, large temperature windows for processing of resin systems, and are less toxic. 4. The polyimide or polyamic acid of claim 1 , wherein:{'sup': '1', 'R and Rare each independently selected from the group consisting ofhydrogen, an optionally substituted alkyl group having 8 to 18 carbon atoms, an optionally substituted alkene group having 4 to 18 carbon atoms, and an optionally substituted cycloalkyl group having 3 to 8 carbon atoms, wherein the alkyl group, alkene group, or cycloalkyl group can be substituted with 1 to 5 substituents independently selected from the group consisting of a halogen, hydroxy, amino, nitro, cyano, carboxy, an alkyl group having 1 to 8 carbons, and an alkoxy group having 1 to 8 carbon atoms; and{'sup': '1', 'only one of R and Rcan be a hydrogen.'}8. The polyimide or polyamic acid of claim 1 , wherein there is a 1:2 to 2:1 molar ratio of the one or more difuran-diamine monomers to the one or more dianhydride or diacid compounds.9. (canceled)13. The method of forming the polyimide or polyamic acid according to claim 12 , wherein the one or more furfurylamine compounds of Formula (I) or Formula (II) and dianhydride monomers are heated in the presence of at least one organic solvent selected from the group consisting of dimethylacetamide claim 12 , acetonitrile claim 12 , ethyl acetate claim 12 , isopropyl acetate claim 12 , hydrocarbon alcohols claim 12 , polar substances claim 12 , aromatic hydrocarbons claim 12 , organic ethers claim 12 , ketone hydrocarbons claim 12 , hydrocarbons containing chlorine claim 12 , furan ...

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