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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 8061. Отображено 100.
19-04-2012 дата публикации

Clear magnetic intaglio printing ink

Номер: US20120091701A1
Автор: Andrea V. Firth, Christine Reinhard, Claude-Alain Despland, Jessica Krueger, Pierre Degott
Принадлежит: Bank of Canada, SICPA HOLDING SA

The invention discloses an ink for the engraved steel die printing process, having a viscosity at 40° C. between 3 Pa.s to 15 Pa.s, preferably 5 to 10 Pa.s, and comprising a polymeric organic binder and magnetic pigment particle, characterized in that said magnetic pigment particles comprises a magnetic core material which is surrounded by at least one layer of another material. The surrounding layers, single or in combination, confer the pigment particle particular optical properties in the visible and/or in the near IR, chosen from high specular or diffuse reflectance, spectrally selective absorption or reflection, and angle-dependent absorption or reflection, and allow for the formulation of inks having a large gamut of color and other optical functionalities.

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Номер записи: 1
26-04-2012 дата публикации

Method of manufacturing sintered silver alloy body and copper oxide-containing clay-like composition

Номер: US20120098168A1
Автор: Shinji Otani, Takashi Yamaji, Yasuo Ido
Принадлежит: Mitsubishi Materials Corp

A method of manufacturing a sintered silver alloy body of the present invention includes steps of adding copper oxide to a silver-containing clay-like composition that contains silver-containing metal powder containing silver, a binder, and water to manufacture a clay-like composition for forming a sintered silver alloy body; making an object by making the clay-like composition for forming a sintered silver alloy body into an arbitrary shape; and baking the object in a reduction atmosphere or a non-oxidizing atmosphere after the object is dried.

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Номер записи: 2
13-09-2012 дата публикации

Conductive adhesive, method for manufacturing the same, and electronic device including the same

Номер: US20120228560A1
Автор: Seung Jun Jang, Soon Ho Joeng, Sung Chul Kim, Yong Cheol Chu, Yong Un Jang, Yoon Sang Son
Принадлежит: Duk San Tekopia Co Ltd

The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.

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Номер записи: 3
28-03-2013 дата публикации

Nano-particle coated genuine leather floor

Номер: US20130078451A1
Автор: Ruofei Zhang
Принадлежит: Individual

A nano-particle coated genuine leather floor including genuine leather, a leather pigment, and nano-powder. The nano-powder is a mixture of nano-silver and sub-nanometer SiO 2 with a weight ratio of 1:33 to 1:5. The nano-powder is added into the leather pigment and the resulting mixture is coated on genuine leather. The nano-particle coated genuine leather floor has high degree of wear resistance, moisture resistance, good antibacterial property, and long service lifetime.

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Номер записи: 4
24-10-2013 дата публикации

Thermally conductive adhesive

Номер: US20130279118A1
Автор: Taichi Koyama, Takayuki Saito
Принадлежит: Dexerials Corp

A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

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Номер записи: 5
07-01-2021 дата публикации

BIOELECTRODE AND METHOD FOR PRODUCING BIOELECTRODE

Номер: US20210000371A1
Автор: FUTASHIMA Ryo, UDA Toru, YOSHITOMI Takumi
Принадлежит:

A bioelectrode and a method for producing the bioelectrode are provided. The bioelectrode has a non-complicated structure, satisfactory elasticity, and is capable of preventing an increase of contact impedance due to an increase of the number of times of usage. The bioelectrode includes a support member, which is an electrically conductive member, and at least one electrode member, which is a member projecting from the support member. At least the electrode member is molded from an electrically conductive rubber containing a silicone rubber and treated metal particles containing a crosslinkable functional group on a surface thereof. 1. A bioelectrode comprising:a support member, which is an electrically conductive member; andat least one electrode member, which is a member projecting from the support member,wherein at least the electrode member is molded from an electrically conductive rubber, the electrically conductive rubber containing a silicone rubber and metal particles containing a crosslinkable functional group on a surface thereof.2. The bioelectrode according to claim 1 , wherein the crosslinkable functional group is at least one group selected from the group consisting of a hydrolyzable silyl group claim 1 , a silanol group claim 1 , a (meth)acryloyl group claim 1 , an amino group claim 1 , a ureide group claim 1 , an isocyanurate group claim 1 , an isocyanate group claim 1 , and an epoxy group.3. The bioelectrode according to claim 1 , wherein the metal particles are silver particles.4. The bioelectrode according to claim 1 , wherein the silicone rubber is a room temperature-curable liquid silicone rubber.5. The bioelectrode according to claim 1 , wherein the electrode member has a tip end part in a pointed shape.6. The bioelectrode according to claim 5 , wherein the electrode member has an inclined face claim 5 , which is a face formed by removal in the tip end part inclinedly to an extending direction.7. A method for producing a bioelectrode comprising ...

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Номер записи: 6
04-01-2018 дата публикации

Coating Compositions for Security Elements and Holograms

Номер: US20180002551A1
Автор: Michelle Richert, Nikolay A. Grigorenko
Принадлежит: BASF SE

The present invention relates to the use of coating compositions, comprising shaped transition metal, especially silver, particles and a binder, wherein the ratio of pigment to binder is preferably such that the resulting coating shows an angle dependent colour change, for the production of security elements and holograms. When the coating compositions of the present invention are used in coating a hologram the obtained products show a an angle dependent colour change (flip/flop effect), different colours in reflection and transmission, an extremely bright OVD image and extremely strong rainbow effect, high purity and contrast.

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Номер записи: 7
02-01-2020 дата публикации

SELF-HEALING COMPOSITE AND DEVICE INCLUDING SELF-HEALING FILM

Номер: US20200002501A1
Автор: Bao Zhenan, Kang Jiheong, Son Donghee, Vardoulis Orestis, YUN Youngjun
Принадлежит:

A self-healing composite includes a matrix including an elastomer and conductive nanostructures embedded in the matrix, wherein the elastomer includes a polymer main chain, a —HN—C(═O)—NH— containing first structural unit capable of forming a strong hydrogen bond, and a —HN—C(═O)—NH— containing second structural unit capable of forming a weak hydrogen bond. 1. A self-healing composite comprisinga matrix including an elastomer, andconductive nanostructures embedded in the matrixwherein the elastomer comprises a polymer main chain,a —HN—C(═O)—NH— containing first structural unit capable of forming a strong hydrogen bond, anda —HN—C(═O)—NH— containing second structural unit capable of forming a weak hydrogen bond.2. The self-healing composite of claim 1 , wherein the polymer main chain comprises at least one of polysiloxane claim 1 , polydialkylsiloxane wherein claim 1 , the alkyl is a C1 to C6 alkyl claim 1 , for example polydimethylsiloxane claim 1 , polyethylene oxide (PEO) claim 1 , polypropylene oxide (PPO) claim 1 , polybutylene oxide (PBO) claim 1 , perfluoropolyether (PFPE) claim 1 , polyolefin claim 1 , poly(ethylene-co-1-butylene) claim 1 , polybutadiene claim 1 , hydrogenated poly(butadiene) claim 1 , a (poly(ethylene oxide)-poly(propylene oxide) copolymer claim 1 , poly(hydroxyalkanoate) claim 1 , a styrene-butadiene copolymer (SB) claim 1 , a styrene-butadiene-styrene copolymer (SBS) claim 1 , a styrene-ethylene-butylene-styrene copolymer (SEBS) claim 1 , an ethylene propylene diene rubber (EPDR) claim 1 , an acrylic rubber claim 1 , a polychloroprene rubber claim 1 , polyurethane claim 1 , a fluoro-rubber claim 1 , a butyl rubber claim 1 , or a silicone rubber.3. The self-healing composite of claim 2 , wherein the polyolefin is one of polyethylene (PE) claim 2 , polypropylene (PP) claim 2 , polybutylene (PB) claim 2 , a copolymer thereof claim 2 , or a mixture thereof.5. The self-healing composite of claim 4 , wherein the arylene group is a single ...

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Номер записи: 8
03-01-2019 дата публикации

THERMALLY CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

Номер: US20190002694A1
Автор: AKIBA Shota, TSUJI Kenichi
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

The composition is a thermally conductive silicone composition containing the following components (A) to (C) and (D). The component (A) is an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm/s at 25° C., and is represented by an average composition formula (1) 2. The thermally conductive silicone composition according to claim 1 , wherein the thermally conductive filler as the component (C) is an aluminum powder having a tap density of 0.5 to 2.6 g/cmand a specific surface area of 0.15 to 3.0 m/g.3. The thermally conductive silicone composition according to claim 1 , wherein the thermally conductive filler as the component (C) has an aspect ratio of 1.0 to 3.0.4. The thermally conductive silicone composition according to claim 1 , wherein α/β which is a ratio of a mass α of the silver powder as the component (B) to a mass β of the aluminum powder as the component (C) is 3 to 150.5. The thermally conductive silicone composition according to claim 1 , wherein the whole or part of the component (A) is: an organopolysiloxane as a component (E) that has at least two silicon atom-bonded alkenyl groups in one molecule; and/or an organohydrogenpolysiloxane as a component (F) that has at least two silicon atom-bonded hydrogen atoms in one molecule.7. A semiconductor device comprising a heat-generating electronic part and a heat dissipator with the thermally conductive silicone composition as set forth in being interposed between the heat-generating electronic part and the heat dissipator.8. A method for producing a semiconductor device claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'heating the thermally conductive silicone composition as set forth in to 80° C. or higher with a pressure of not lower than 0.01 MPa being applied thereto, with the thermally conductive silicone composition being sandwiched between a heat-generating electronic part and a heat dissipator.'} The present invention relates to a silicone composition ...

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Номер записи: 9
03-01-2019 дата публикации

Fast Conductivity Polymer Silver

Номер: US20190002723A1
Автор: Cruz Ben E., Graddy, JR. G. Edward
Принадлежит:

A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate. 1. A lead , cadmium , and phthalate free conductive paste comprising 60-90 wt % conductive material including silver particles , and 10-30 wt % of a binder system , 10-20 wt % thermoplastic polymer resin comprising polyvinyl butyral,', '5-20 wt % plasticizer comprising triethylene glycol bis(2-ethylhexanoate), and', '60-85 wt % solvent,, 'wherein 100 wt % of the binder system includeswherein the thermoplastic polymer resin is dissolved in the solvent,wherein a weight ratio of the amount of thermoplastic polymer resin to the amount of plasticizer is 1.25 to 1.75, andwherein when the conductive paste is applied to an associated substrate, 0.5-1 wt % of the solvent evaporates from the conductive paste at ambient temperature within 5 minutes.2. The conductive paste according to claim 1 , further comprising 0.5-1.5 wt % of a thixotrope.3. The conductive paste according to claim 1 , further comprising 0.05-0.15 wt % defoamer.4. The conductive paste according to claim 1 , further comprising 0.05-1 wt % of a gelling agent.5. The conductive paste according to claim 4 , wherein the gelling agent comprises dibenzylidene sorbitol.6. The conductive paste according to claim 1 , wherein the solvent comprises a mixture of isopropyl alcohol and denatured ethyl alcohol.7. The conductive paste according to claim 1 , wherein the solvent is a mixture of a first solvent having an evaporation rate of less than 0.5 times the evaporation rate of n- ...

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Номер записи: 10
05-01-2017 дата публикации

Biodegradable printed circuit boards and methods for making the printed circuit boards

Номер: US20170006701A1
Автор: Vincenzo Casasanta, III
Принадлежит: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Biodegradable printed circuit boards, or PCBs, may be produced from substrate sheets that include at least one biodegradable polymer. In addition, the electrical traces used on the PCBs, may also include a biodegradable polymer incorporated with an electrically conductive material. The PCBs may be composted to degrade the PCBs, and the

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Номер записи: 11
20-01-2022 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Номер: US20220017793A1
Автор: KUNIMUNE Teppei, KURAMOTO Masafumi
Принадлежит: NICHIA CORPORATION

Disclosed is an electrically conductive adhesive containing: 1. A method of producing an electrically conductive material , comprising hardening , at a temperature in a range of 120° C. to 300° C. , an electrically conductive adhesive comprising:(A) a polyether polymer having: {'br': None, 'sup': '1', '—R—O—'}, 'a backbone comprising a repeating unit of the formula{'sup': '1', 'wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and'}(B) silver particles.2. The method according to claim 1 , wherein the hardening is performed at 160° C. to 250° C. in the air for 30 to 120 minutes.3. The method according to claim 1 , wherein the hydrolyzable silyl group in the polyether polymer (A) is of the formula:{'br': None, 'sup': 1', '2, 'sub': n', '3-n, '-si(—X)(—X)'}{'sup': '1', 'wherein Xis a hydrolyzable group,'}{'sup': '2', 'Xa hydrocarbon group having 1 to 12 carbon atoms, and'}n is 1, 2 or 3.4. The method according to claim 3 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 3 , an alkoxy group claim 3 , a halogen group claim 3 , an acyloxy group claim 3 , a ketoxymate group claim 3 , an aminoxy group claim 3 , an amide group claim 3 , an amino group and a mercapto group.5. The method according to claim 1 , wherein the electrically conductive adhesive further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.6. The method according to claim 5 , wherein the amount of particles of the other metal is at most 30% by weight claim 5 , based the total of the silver particles (B) and the other metal particles.7. The method according to claim 1 , wherein the silver particles (B) are flake-shaped particles.8. The method according to claim 1 , wherein the average particle diameter (median diameter) of ...

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Номер записи: 12
12-01-2017 дата публикации

ORGANIC-INORGANIC COMPOSITE, STRUCTURAL BODY, AND METHOD FOR PRODUCING ORGANIC-INORGANIC COMPOSITE

Номер: US20170009047A1
Автор: Kinoshita Naoto, NODA Kenichi, Shibata Hiroyuki
Принадлежит: NGK Insulators, Ltd.

The organic-inorganic composite of the present invention includes an organic compound having a carbonyl group, an inorganic compound containing a metal component, and a silver component. The ratio of the number of metal atoms in the inorganic compound to the number of carbon atoms in the organic compound is from 0.04 to 1.60, and the ratio of the number of silver atoms in the silver component to the number of carbon atoms in the organic compound is from 0.07 to 0.55. The organic-inorganic composite may include, for example, an inorganic compound having a metal matrix structure containing a metal M and oxygen, an organic compound having a carbonyl group, and silver ions. The carbonyl group is bonded to a side chain Rof the organic compound and has an end group R. 1. An organic-inorganic composite comprising:an organic compound having a carbonyl group,an inorganic compound containing a metal component, anda silver component,wherein the ratio of the number of metal atoms in the inorganic compound to the number of carbon atoms in the organic compound is from 0.04 to 1.60, and the ratio of the number of silver atoms in the silver component to the number of carbon atoms in the organic compound is from 0.07 to 0.55.2. The organic-inorganic composite according to claim 1 , wherein the inorganic compound is a compound containing O and at least one selected from Si claim 1 , Ti claim 1 , Al claim 1 , and Zr.3. The organic-inorganic composite according to claim 1 , wherein the inorganic compound is a hydrolysate of a metal alkoxide.4. The organic-inorganic composite according to claim 1 , wherein the organic compound includes a carbon structure in which carbon atoms are bonded and the carbonyl group bonded to the carbon structure.5. The organic-inorganic composite according to claim 1 , wherein the organic compound is a polymer having the carbonyl group.6. The organic-inorganic composite according to claim 1 , wherein the organic-inorganic composite has the function of ...

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Номер записи: 13
27-01-2022 дата публикации

STEREOLITHOGRAPHIC RESIN COMPOSITION AND THREE-DIMENSIONAL SHAPED OBJECT

Номер: US20220025157A1
Автор: Saitoh Terunobu, Tomizuka Manami
Принадлежит:

Provided is a stereolithographic resin composition that suppresses sedimentation of the filler during shaping, has good handleability, and has high thermal conductance of the cured product. A stereolithographic resin composition containing a photocurable resin and a filler, wherein the filler is a metal-coated particle having a base particle including a polymer material and having a metal layer coating the surface of the base particle, and a density of the metal-coated particle is 1.5 g/cmto 4.0 g/cm. 1. A stereolithographic resin composition comprising a photocurable resin and a filler ,wherein the filler is a metal-coated particle having a base particle including a polymer material, and a metal layer coating a surface of the base particle, and{'sup': 3', '3, 'a density of the metal-coated particle is 1.5 g/cmto 4.0 g/cm.'}2. The stereolithographic resin composition according to claim 1 , further comprising boron nitride claim 1 , wherein the metal layer contains copper.3. The stereolithographic resin composition according to claim 2 , wherein a mass ratio of the metal-coated particle to the boron nitride claim 2 , the metal-coated particle:the boron nitride is 3:97 to 66:34.4. The stereolithographic resin composition according to claim 1 , wherein the metal-coated particle has a volume average particle diameter of 0.5 μm to 30 μm.5. The stereolithographic resin composition according to claim 1 , wherein a content of the metal-coated particle is 4% by mass to 65% by mass.6. The stereolithographic resin composition according to claim 1 , wherein the photocurable resin contains at least an epoxy-based compound and an acryl-based compound.7. The stereolithographic resin composition according to claim 1 , wherein the polymer material is selected from a group consisting of an acrylic resin claim 1 , methacrylic resin claim 1 , polyamide claim 1 , polyimide claim 1 , a melamine resin claim 1 , polystyrene claim 1 , an ABS resin claim 1 , polypropylene claim 1 , and ...

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Номер записи: 14
09-01-2020 дата публикации

METHOD FOR MANUFACTURING FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE AND FINE-PITCH ANISOTROPIC CONDUCTIVE ADHESIVE MANUFACTURED BY SAME METHOD

Номер: US20200010738A1
Автор: LEE Kyung Sub
Принадлежит:

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked. 1. A method for preparing an anisotropic conductive adhesive for fine pitch , the method comprising:(i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent;(ii) removing moisture generated in step (i); and(iii) preparing the anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed in steps (i) and (ii) with a binder resin,a. wherein step (iii) is performed in a state where a contact with oxygen is blocked.2. The method of claim 1 , wherein the anisotropic conductive adhesive in step (iii) further includes a second reducing agent for preventing further oxidation of the solder particles.3. The method of claim 2 , wherein an amount of the second reducing agent is 0.01 to 3 parts by weight with respect to 100 parts by weight of the anisotropic conductive adhesive in step (iii).4. The method of claim 1 , wherein the first reducing agent is at least one selected from the group consisting of 3-butenoic acid (BA) claim 1 , 1 claim 1 ,3-bis( ...

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Номер записи: 15
14-01-2021 дата публикации

Low-haze transparent conductors

Номер: US20210012920A1
Автор: Frank Wallace, Jelena Sepa
Принадлежит: Cambrios Film Solutions Corp

This disclosure is related to low-haze transparent conductors, ink compositions and method for making the same.

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Номер записи: 16
03-02-2022 дата публикации

ANTIMICROBIAL POLYMER COMPOSITION FOR SHELF-LIFE EXTENSION

Номер: US20220033594A1
Автор: ALEXANDRE Edson Alexandre Marçal, MACHADO Beatriz Valfogo
Принадлежит: CLARIANT INTERNATIONAL LTD

Polymer composition are provided comprising a thermoplastic polymer matrix, 50 to 6000 ppm of zinc pyrithione, 50 to 6000 ppm of silver, 100 to 6000 ppm of a zeolite, and optionally 0 to 5% by weight of one or more polymer additives. The invention also relates to a masterbatch and a method for preparing such polymer composition. The present invention further relates to a food packaging comprising or consisting of such polymer composition and to the use thereof for increasing shelf-life of foodstuff such as baked goods. 1. A polymer composition comprising:(A) a thermoplastic polymer matrix (component A);(B) 50 to 6000 ppm, related to the polymer composition, of zinc pyrithione (component B);(C) 50 to 6000 ppm, related to the polymer composition, of silver, optionally in uncharged form or in ionic form comprised in a silver salt (component C);(D) 100 to 6000 ppm, related to the polymer composition, of a zeolite (component D); and optionally(E) 0 to 5% by weight, related to the polymer composition, of one or more polymer additives (component E).2. The polymer composition of claim 1 , wherein the polymer matrix A comprises or consists of at least one olefinic polymer.3. The polymer composition of claim 1 , wherein the polymer matrix A is selected from the group consisting of polyethylene claim 1 , polypropylene claim 1 , ethylene-vinyl acetate copolymer claim 1 , and blends of two or more thereof.4. The polymer composition of claim 1 , wherein said polymer composition comprises components B:C in a mass ratio in the range of 1.5:1 to 20:1.5. The polymer composition of claim 1 , wherein the zeolite (component D) is a hydrophobic particulate zeolite having a mean average particle size in the range of 0.5 to 50 μm.6. The polymer composition of claim 1 , wherein said polymer composition comprises:(A) a thermoplastic polymer matrix (component A) consisting of an olefinic polymer or a blend of olefinic polymers;(B) 50 to 6000 ppm, related to the polymer composition, of zinc ...

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Номер записи: 17
19-01-2017 дата публикации

STABILIZED NANOPARTICLES AND DISPERSIONS OF THE STABILIZED NANOPARTICLES AND METHODS OF APPLICATION

Номер: US20170015804A1
Автор: Bashir Mubasher A., Bu Lujia, Creamer Marianne P., De Graaf Michael A., Scieranka Kinga
Принадлежит:

Compositions of nanoparticles are stabilized by capping agents which are composed of methacrylic acid and n-butylmethacrylate random copolymers having hydrophobic and hydrophilic moieties and low molecular weight. The nanoparticle compositions have low viscosity, high nanoparticle loading and may be selectively applied to substrates by methods such as inkjet, aerosol and electrospinning 1. A composition comprising nanoparticles comprising metal and one or more capping agents composed of random copolymers of methacrylic acid and n-butylmethacrylate having hydrophobic and hydrophilic segments.2. The composition of claim 1 , wherein a methacrylic acid moiety is from 47 mole % to 83 mole % and an n-butylmethacrylate moiety is from 17 mole % to 53 mole %.3. The composition of claim 2 , wherein the methacrylic acid moiety is from 47 mole % to 62 mole % and the n-butylmethacrylate moiety is from 38 mole % to 53 mole %.4. The composition of claim 1 , wherein the one or more capping agents have weight average molecular weights of 3000 g/mole to less than 20 claim 1 ,000 g/mole.5. The composition of claim 4 , wherein the one or more capping agents have weight average molecular weights of 3500 g/mole to 10 claim 4 ,000 g/mole.6. The composition of claim 5 , wherein the one or more capping agents have weight average molecular weights of 3500 g/mole to 5500 g/mole.7. The composition of claim 1 , wherein the composition further comprises water and one or more organic solvents.8. The composition of claim 1 , wherein a loading of the nanoparticles are 50 wt % or greater.9. The composition of claim 1 , wherein the metal of the nanoparticles is chosen from aluminum claim 1 , silver claim 1 , gold claim 1 , platinum claim 1 , palladium claim 1 , indium claim 1 , rubidium claim 1 , ruthenium claim 1 , rhodium claim 1 , osmium claim 1 , iridium claim 1 , copper claim 1 , cobalt claim 1 , nickel claim 1 , iron and tin.10. The composition of claim 1 , wherein nanoparticle size ...

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Номер записи: 18
18-01-2018 дата публикации

ANTIBACTERIAL LAYER-ATTACHED BASE MATERIAL AND FILM FOR DISPLAY

Номер: US20180015691A1
Автор: NAGASAKI Hideo, OKAZAKI Kentaro
Принадлежит: FUJIFILM Corporation

Provided are an antibacterial layer-attached base material, which has excellent anti-glare characteristics and in which rainbow unevenness and warping are suppressed, and a film for a display using the antibacterial layer-attached base material. The antibacterial layer-attached base material includes: a base material having optical anisotropy, and an antibacterial layer which is disposed on at least a part of a surface of the base material, in which the antibacterial layer contains antibacterial agent fine particles and a binder, an average particle diameter of the antibacterial agent fine particles is 0.05 to 1 μm, the thickness of the antibacterial layer is greater than 5 μm and smaller than or equal to 15 μm, and a tensile strength of the base material is greater than or equal to 200 MPa. 1. An antibacterial layer-attached base material comprising:a base material having optical anisotropy; andan antibacterial layer which is disposed on at least a part of a surface of the base material,wherein the antibacterial layer contains antibacterial agent fine particles and a binder,wherein an average particle diameter of the antibacterial agent fine particles is 0.05 to 1 μm,wherein a thickness of the antibacterial layer is greater than 5 μm and smaller than or equal to 15 μm, andwherein a tensile strength of the base material is greater than or equal to 200 MPa.2. The antibacterial layer-attached base material according to claim 1 ,wherein the binder is a polymer having a hydrophilic group.3. The antibacterial layer-attached base material according to claim 1 ,wherein a content of the antibacterial agent fine particles in the antibacterial layer is greater than or equal to 2.0 mass % with respect to a total mass of the antibacterial layer.4. The antibacterial layer-attached base material according to claim 2 ,wherein a content of the antibacterial agent fine particles in the antibacterial layer is greater than or equal to 2.0 mass % with respect to a total mass of the ...

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Номер записи: 19
18-01-2018 дата публикации

METAL-CONTAINING PHOTOPOLYMER RESINS GENERATED BY REDUCTION OF DISSOLVED METAL SALTS

Номер: US20180016680A1
Автор: Duoss Eric, GOLOBIC Alexandra, Jackson Julie A., Pascall Andrew
Принадлежит:

According to one embodiment, a three-dimensional structure includes: at least one photopolymer having at least one metal dispersed throughout at least portions of a bulk of the structure. The structure is characterized by features having a horizontal and/or vertical feature resolution in a range from several hundred nanometers to several hundred microns. The portions of the bulk throughout which metal is dispersed may optionally be selectively determined. In more embodiments, the structure may have electroless plated metal formed on surfaces thereof, alternatively or in addition to the metal dispersed throughout the bulk of the structure. The electroless plating may be achieved without the use of a surface activation bath. Corresponding methods for forming various embodiments of such three dimensional structures are also disclosed. 1. A three-dimensional structure , comprising:at least one photopolymer having at least one metal dispersed throughout at least portions of a bulk of the structure; andwherein the structure is characterized by features having a horizontal and/or vertical feature resolution in a range from several hundred nanometers to several hundred microns.2. The structure as recited in claim 1 , wherein the metal is selected from a group consisting of: palladium claim 1 , platinum claim 1 , gold claim 1 , nickel claim 1 , copper claim 1 , and silver.3. The structure as recited in claim 1 , wherein the structure comprises a plurality of layers of the at least one photopolymer claim 1 , each layer having a thickness in a range from about 10 nm to about 500 μm.4. The structure as recited in claim 1 , wherein the at least portions of the bulk of the structure throughout which the metal is dispersed comprises a continuous pathway defining a circuit claim 1 , wherein the continuous pathway is conductive.5. A method for forming a three-dimensional metallized structure claim 1 , the method comprising:dissolving at least one metal salt in a resin comprising one ...

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Номер записи: 20
21-01-2021 дата публикации

CONDUCTIVE COMPOSITION FOR MOLDED FILM, MOLDED FILM, MOLDED ARTICLE, AND METHOD FOR PRODUCTION THEREOF

Номер: US20210016541A1
Автор: NAKAZATO Atsushi, TOSAKI Kouichi
Принадлежит: TOYO INK SC HOLDINGS CO., LTD.

Provided is a conductive composition for molded film that enables production of a molded film for which tensile force-induced reductions in conductivity are suppressed. The conductive composition for molded film contains a resin (A), conductive fine particles (B), and a solvent (C), wherein the solvent (C) contains, in 100 parts by mass of the solvent (C), at least 40 parts by mass of a solvent (C′) that satisfies the following condition (1) and condition (2). (1) A boiling point of 180° C. to 270° C. (2) At least one of the following is satisfied: the polar parameter δp of the Hansen solubility parameter (HSP) is 0≤δp≤5.0, and the hydrogen-bond parameter δh of the Hansen solubility parameter (HSP) is 9.8≤δh≤4.0. 1. A conductive composition for molded film , comprising: a resin (A) , conductive fine particles (B) , and a solvent (C) ,wherein the solvent (C) comprises, in 100 parts by mass of the solvent (C), 40 parts by mass or more of a solvent (C′) that satisfies the following condition (1) and at least one of conditions (2-1) and (2-2):(1) a boiling point is 180° C. or higher and 270° C. or lower(2-1) a polar parameter δp of a Hansen solubility parameter (HSP) is 0≤δp≤5.0(2-2) a hydrogen-bond parameter δh of the Hansen solubility parameter (HSP) is 9.8≤δh≤24.0.2. The conductive composition for molded film according to claim 1 , wherein the solvent (C′) further satisfies the following condition (2-3):(2-3) a dispersion parameter δd of the Hansen solubility parameter (HSP) is 14.0≤δd≤20.0.3. The conductive composition for molded film according to claim 1 , wherein the conductive fine particles (B) comprise one or more types of conductive fine particles selected from silver powder claim 1 , copper powder claim 1 , silver-coated powder claim 1 , copper alloy powder claim 1 , conductive oxide powder claim 1 , and carbon fine particles.4. The conductive composition for molded film according to claim 1 , wherein the resin (A) comprises one or more types of substituents ...

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Номер записи: 21
26-01-2017 дата публикации

Anti-Bacterial Aqueous Ink Compositions Comprising Metal Ion Composite Ionomer Resins

Номер: US20170022370A1
Автор: Chi Wendy, Farrugia Valerie M.
Принадлежит:

An aqueous ink composition including water; an optional co-solvent; an optional colorant; and a composite nanoparticle comprising a core and a shell; wherein the core comprises a styrene/acrylate polymer core resin, optionally comprising a metal; and wherein the shell comprises a metal. An aqueous ink composition including water; an optional co-solvent; an optional colorant; and an ionic polymer-metal composite; wherein the ionic-polymer metal composite nanoparticle acts as a reservoir for the delivery of metal ions for anti-bacterial effect, antifungal effect, antiviral biocide effect, or a combination thereof. A process comprising incorporating an aqueous ink into an ink jet printing apparatus; ejecting droplets of ink in an imagewise pattern onto an intermediate transfer member or directly onto a final image receiving substrate; optionally, heating the image; and optionally, when an intermediate transfer member is used, transferring the ink in the imagewise pattern from the intermediate transfer member to a final substrate. 1. An aqueous ink composition comprising:water;an optional co-solvent;an optional colorant; anda composite nanoparticle comprising a core and a shell;wherein the core comprises a styrene/acrylate polymer core resin, optionally comprising a metal; andwherein the shell comprises a metal.2. The aqueous ink composition of claim 1 , wherein the composite nanoparticle core resin is selected from the group consisting of styrene acrylates claim 1 , styrene butadienes claim 1 , styrene methacrylates and combinations thereof.3. The aqueous ink composition of claim 1 , wherein the composite nanoparticle core resin is selected from the group consisting of poly(styrene-alkyl acrylate) claim 1 , poly(styrene-1 claim 1 ,3-diene) claim 1 , poly(styrene-alkyl methacrylate) claim 1 , poly(styrene-alkyl acrylate-acrylic acid) claim 1 , poly(styrene-1 claim 1 ,3-diene-acrylic acid) claim 1 , poly(styrene-alkyl methacrylate-acrylic acid) claim 1 , poly(alkyl ...

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Номер записи: 22
28-01-2021 дата публикации

Denture Material Having Anti-Microbial Properties

Номер: US20210024677A1
Автор: Baker Reid, Liu Maggie Xiaoxia, Miller Nicole Lee, Thaiyalan Bharathy
Принадлежит:

Antimicrobial polymer composite materials are disclosed that are suitable for making oral devices used in dental applications, such as denture bases. Acrylic resin composite materials comprising antimicrobial polymers and antimicrobial fillers provide reduction in common oral microorganisms after long-term aging, with reduced release rate of antimicrobial agents from the composite material. Antimicrobial polymers are prepared from compositions comprising acrylate and/or methacrylate monomers and polymerizable quaternary ammonium silicon-containing compounds. 1 i. a poymerizable acrylate monomer;', 'ii. an antimicrobial monomer comprising at least two functional groups, an ethylenically unsaturated group and a quaternary ammonium compound (QAC) group, one or both of which comprise a crosslinking group; and', 'iii. a co-initiator;, 'a. providing a first part of a two-part polymerizable system that comprises'} i. a powder comprising polymethylmethacrylate (PMMA);', 'ii. antimicrobial particles; and', 'iii. an initiator;, 'b. providing a second part of the two-part polymerizable system that comprises'}c. combining the first part of the two-part polymerizable system with the second part of the two-part polymerizable system and polymerizing the combination in a mold to form the intraoral device.. A method of making an intraoral device that reduces bacterial growth and biofilm formation, comprising: This application claims the benefit of and priority to U.S. Provisional Patent Application No. 62/876,893, filed Jul. 22, 2019. The entirety of the foregoing application is incorporated herein by reference.Intraoral devices that reduce bacterial growth and biofilm formation are highly desirable. Approaches for imparting antimicrobial activity have included applying an antimicrobial coating on a surface of an acrylic-based substrate, incorporating silver particles into an acrylic resin, and forming acrylic-based materials that leach small molecule antimicrobial agents, such as ...

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Номер записи: 23
28-01-2021 дата публикации

Electroconductive Coating Material and Method for Producing Shielded Package Using Said Electroconductive Coating Material

Номер: US20210024758A1
Автор: Hajime NAKAZONO, Kazuhiro Matsuda
Принадлежит: Tatsuta Electric Wire and Cable Co Ltd

The present invention provides a conductive coating material curable at low temperatures. The present invention relates to a conductive coating material containing: 100 parts by weight of an epoxy resin-containing binder component (A); 500 to 2500 parts by weight of metal particles (B); 1 to 150 parts by weight of a curing agent (C); 20 to 800 parts by weight of a solvent (D); and 0.5 to 5 parts by weight of a curing catalyst (E).

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Номер записи: 24
10-02-2022 дата публикации

THERMAL CONDUCTIVE SILICONE COMPOSITION AND SEMICONDUCTOR DEVICE

Номер: US20220044983A1
Автор: AKIBA Shota, TSUJI Kenichi, YAMADA Kunihiro
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains: 1. A thermal conductive silicone composition comprising:{'sup': '2', 'claim-text': {'br': None, 'sup': '1', 'sub': a', '(4-a)/2, 'RSiO\u2003\u2003(1)'}, '(A) 100 parts by mass of an organopolysiloxane that has a kinetic viscosity of 10 to 100,000 mm/s at 25° C., and is represented by the following average composition formula (1)'}{'sup': '1', 'wherein Rrepresents a hydrogen atom, a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms or a hydroxy group, and a represents a number satisfying 1.8≤a≤2.2;'}{'sup': 3', '2, '(B) a silver powder having a tap density of not lower than 3.0 g/cm, a specific surface area of not larger than 2.0 m/g and an aspect ratio of 1 to 30, the component (B) being in an amount of 300 to 11,000 parts by mass per 100 parts by mass of the component (A);'}(C) an elemental gallium and/or gallium alloy having a melting point of 0 to 70° C., the component (C) being in an amount of 1 to 1,200 parts by mass per 100 parts by mass of the component (A) and present at a mass ratio [Component (C)/{Component (B)+Component (C)}] of 0.001 to 0.1; and(D) a catalyst selected from the group consisting of a platinum-based catalyst, an organic peroxide and a catalyst for condensation reaction, the component (D) being in a catalytic amount.2. The thermal conductive silicone composition according to claim 1 , wherein part of or the whole component (A) is:an organopolysiloxane containing in one molecule at least two silicon atom-bonded alkenyl groups; and/oran organohydrogenpolysiloxane containing in one molecule at least two silicon atom-bonded hydrogen atoms.3. The thermal conductive silicone composition according to claim 1 , further comprising: {'br': None, 'sup': 2', '3, 'sub': b', '4-b, 'RSi(OR)\u2003\u2003(2)'}, '(G) an ...

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Номер записи: 25
28-01-2021 дата публикации

CONDUCTIVE RESIN COMPOSITION AND CONDUCTIVE STRUCTURE USING SAME

Номер: US20210027909A1
Автор: Abe Takatoshi, FUKAO Tomohiro, SAWADA Tomoaki
Принадлежит: Panasonic Intellectual Property Management Co., Ltd.

A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin. 1. A conductive composition at least comprising an acrylic resin and a conductive powder ,wherein the acrylic resin contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, andan amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.2. The conductive composition according to claim 1 , wherein an epoxy equivalent of the polymer unit (A) based on a total amount of the acrylic resin is in a range of 400 to 10 claim 1 ,000 g/eq.3. The conductive composition according to claim 1 , wherein the acrylic resin further contains a polymer unit (C) of a (meth)acrylate having a nitrile group.4. The conductive composition according to claim 1 , comprising 5.0 parts by mass or more and 30.0 parts by mass or less of the polymer unit (C) based on 100 parts by mass of the acrylic resin.5. The conductive composition according to claim 1 , further comprising a curing agent (D).6. The conductive composition according to claim 1 , further comprising a curing accelerator (E).7. The conductive composition according to claim 1 , further comprising a dispersant (F).8. The conductive composition according to claim 1 , further comprising a non-conductive powder (G).9. The conductive composition according to claim 1 , wherein a mass ratio of the acrylic resin to the conductive powder is in a range of 30:70 to 5:95.10. A conductive structure comprising the conductive composition according to . The present invention ...

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Номер записи: 26
01-02-2018 дата публикации

COMPOSITE MATERIALS

Номер: US20180029686A1
Автор: Frulloni Emiliano, Lenzi Fiorenzo, Restuccia Carmelo Luca
Принадлежит: CYTEC TECHNOLOGY CORP.

A composite material that includes a layer of reinforcing fibres impregnated with a curable resin matrix and a plurality of electrically conductive composite particles positioned adjacent or in proximity to the reinforcing fibres. Each of the electrically conductive composite particles is composed of a conductive component and a polymeric component, wherein the polymeric component includes one or more polymers that are initially in a solid phase and are substantially insoluble in the curable resin, but is able to undergo at least partial phase transition to a fluid phase during a curing cycle of the composite material. 1. A curable composite material comprising:i) at least one structural layer of reinforcing fibres impregnated with a curable resin matrix; and{'sub': 'g', 'ii) at least one electrically conductive composite particle adjacent or in proximity to said reinforcing fibres, said conductive composite particle comprising a conductive component and a polymeric component, wherein the polymeric component of the conductive composite particle comprises one or more thermoplastic polymers that are initially in a solid phase and substantially insoluble in the curable resin matrix prior to curing of the composite material, but is able to undergo at least partial phase transition to a fluid phase by dissolving in the resin matrix during a curing cycle of the composite material, and wherein the one or more thermoplastic polymers has/have a glass transition temperature (T) of greater than 200° C.'}2. The composite material of claim 1 , wherein said curable resin matrix is a thermoset composition in which at least 50% of the polymeric component of the conductive composite particle is soluble in the resin matrix during curing of the composite material claim 1 , and wherein the phase transition to the fluid phase occurs by dissolution of the polymeric component in the resin matrix.3. The composite material of claim 1 , wherein the conductive component of each electrically ...

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Номер записи: 27
01-02-2018 дата публикации

THERMALLY DECOMPOSABLE BINDER

Номер: US20180030203A1
Автор: Fujimoto Nobutaka, Nakano Koji, NISHIOKA Kiyoshi, Suzuki Masahiro
Принадлежит:

A thermally decomposable binder containing an aliphatic polycarbonate resin containing a constituting unit represented by the formula (1): 2. The thermally decomposable binder according to claim 1 , wherein the content of the constituting unit represented by the formula (1) is from 0.001 to 30% by mol in the entire constituting units constituting the aliphatic polycarbonate resin.4. The thermally decomposable binder according to claim 1 , wherein a mass loss percentage after keeping at 160° C. for 1 hour in a thermogravimetric analysis is 90% or more.6. The fine inorganic particle-dispersed paste composition according to claim 5 , wherein the content of the aliphatic polycarbonate resin is from 0.001 to 20 parts by mass claim 5 , based on 100 parts by mass of the fine inorganic particles.7. The fine inorganic particle-dispersed paste composition according to or claim 5 , wherein the fine inorganic particles are made of at least one member selected from the group consisting of electroconductive particles claim 5 , ceramic powders claim 5 , glass powders claim 5 , and fine inorganic phosphor particles.9. The aliphatic polycarbonate resin according to claim 8 , wherein the content of the constituting unit represented by the formula (1) is from 0.001 to 30% by mol in the entire constituting units constituting the aliphatic polycarbonate resin.11. The aliphatic polycarbonate resin according to claim 8 , wherein a mass loss percentage after keeping at 160° C. for 1 hour in a thermogravimetric analysis is 90% or more. The present invention relates to a thermally decomposable binder containing an aliphatic polycarbonate resin and a fine inorganic particle-dispersed paste composition.In recent years, fine inorganic particle-dispersed paste compositions in which fine inorganic particles of electroconductive particles, ceramics, glass, a phosphor or the like are dispersed in a binder resin have been used for obtaining sintered bodies of various shapes. For example, a paste ...

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Номер записи: 28
04-02-2021 дата публикации

CORROSION INHIBITOR COMPOSITION AND METHODS OF INHIBITING CORROSION DURING ACID PICKLING

Номер: US20210032759A1
Автор: SOLOMON Moses M., UMOREN Saviour M.
Принадлежит: KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS

A corrosion inhibitor composition, which includes i) an aqueous alcohol base fluid, ii) a mixture of at least three polysaccharides selected from carboxymethyl cellulose, gum arabic, pectin, a salt of alginic acid, chitosan, dextran, hydroxyethyl cellulose, and soluble starch, with each polysaccharide that is present in the mixture being present in an amount of 0.05 to 0.5 wt. %, based on a total weight of the corrosion inhibitor composition, iii) silver nanoparticles, and iv) a pineapple leaves extract. A method of inhibiting corrosion of metal during acid cleaning/pickling whereby the metal is treated with an acidic treatment fluid containing an acid and the corrosion inhibitor composition. 1. A corrosion inhibitor composition , comprising:a base fluid comprising water and an alcohol;a mixture of at least three polysaccharides selected from the group consisting of carboxymethyl cellulose, gum arabic, pectin, a salt of alginic acid, chitosan, dextran, hydroxyethyl cellulose, and soluble starch, with each polysaccharide that is present in the mixture being present in an amount of 0.05 to 0.5 wt. %, based on a total weight of the corrosion inhibitor composition;silver nanoparticles; anda pineapple leaves extract.2. The corrosion inhibitor composition of claim 1 , wherein the alcohol is a monoalcohol.3. The corrosion inhibitor composition of claim 1 , wherein the alcohol is isopropanol.4. The corrosion inhibitor composition of claim 1 , wherein a ratio of water to the alcohol by volume is 2:1 to 1:2.5. The corrosion inhibitor composition of claim 1 , wherein three polysaccharides are present in the mixture.6. The corrosion inhibitor composition of claim 5 , wherein each of the three polysaccharides is present in an amount of 30 to 40 wt. % claim 5 , based on a total weight of the mixture.7. The corrosion inhibitor composition of claim 1 , wherein the mixture consists of carboxymethyl cellulose claim 1 , gum arabic claim 1 , and pectin.8. The corrosion inhibitor ...

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Номер записи: 29
09-02-2017 дата публикации

HOOF REPAIR COATING

Номер: US20170037275A1
Автор: JOHNSTON ALLEN D.
Принадлежит:

The present invention relates to curable coatings for treatment and repair of the ungulate hoof. These coatings are very easy to apply to the hoof of the animal, and cure to a tack-free hard coating as the animal walks around in direct sunlight or upon short exposure to ultraviolet light. Regular treatment of the coating to the hoof prevents hoof cracks in the long run and improves the health of the animal. 2. The composition of claim 1 , further comprising at least one pigment.4. The composition of claim 1 , wherein the at least one acrylated urethane comprises about 55 to about 95 weight percent (wt %) based on the total weight of the composition.5. The composition of claim 1 , wherein the at least one acrylated urethane comprises about 65 to 85-wt % based on the total weight of the composition.6. The composition of claim 1 , wherein the at least one adhesion promoter is 2-hydroxyethyl acrylate phthalate.7. The composition of claim 1 , wherein the at least one adhesion promoter is 2-hydroxyethyl acrylate.8. The composition of claim 1 , wherein the at least one adhesion promoter comprises 0.5 to about 30 wt % based on the total weight of the composition.9. The composition of claim 1 , wherein the at least one adhesion promoter comprises 10 to about 25 wt % based on the total weight of the composition.10. The composition of claim 1 , wherein the at least one filler comprises silica.11. The composition of claim 1 , wherein the at least one filler comprises 0.9 to about 3.5 wt % based on the total weight of the composition.12. The composition of claim 1 , wherein the at least one photoinitiator comprises ethyl(2 claim 1 ,4 claim 1 ,6-trimethylbenzoyl)phenyl phosphonate.13. The composition of claim 1 , wherein the at least one photoinitiator comprises 2 claim 1 ,4 claim 1 ,6-trimethylbenzoyldiphenyl phosphine oxide.14. The composition of claim 1 , wherein the at least one photoinitiator comprises 3 to about 10 wt % based on the total weight of the composition.15. The ...

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Номер записи: 30
08-02-2018 дата публикации

Anti-Bacterial Aqueous Ink Compositions Comprising Metal Ion Composite Ionomer Resins

Номер: US20180037750A1
Автор: Chi Wendy, Farrugia Valerie M.
Принадлежит:

An aqueous ink composition including water; an optional co-solvent; an optional colorant; and a composite nanoparticle comprising a core and a shell; wherein the core comprises a styrene/acrylate polymer core resin, optionally comprising a metal; and wherein the shell comprises a metal. An aqueous ink composition including water; an optional co-solvent; an optional colorant; and an ionic polymer-metal composite; wherein the ionic-polymer metal composite nanoparticle acts as a reservoir for the delivery of metal ions for anti-bacterial effect, antifungal effect, antiviral biocide effect, or a combination thereof. A process comprising incorporating an aqueous ink into an ink jet printing apparatus; ejecting droplets of ink in an imagewise pattern onto an intermediate transfer member or directly onto a final image receiving substrate; optionally, heating the image; and optionally, when an intermediate transfer member is used, transferring the ink in the imagewise pattern from the intermediate transfer member to a final substrate. 1. An aqueous ink composition comprising:water;an optional co-solvent;an optional colorant; andan ionic polymer-metal composite nanoparticle;wherein the ionic-polymer metal composite nanoparticle acts as a reservoir for the delivery of metal ions for anti-bacterial effect, antifungal effect, antiviral biocide effect, or a combination thereof.2. The aqueous ink composition of claim 1 , wherein the ionic-polymer metal composite nanoparticle comprises a core and a shell;wherein the core comprises a polymer core resin, optionally comprising a metal; andwherein the shell comprises a metal ion polymer resin.3. The aqueous ink composition of claim 1 , wherein the ionic-polymer metal composite nanoparticle comprises a resin selected from the group consisting of styrene claim 1 , acrylates claim 1 , styrene butadienes claim 1 , styrene methacrylates and combinations thereof.4. The aqueous ink composition of claim 1 , wherein the ionic-polymer metal ...

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Номер записи: 31
30-01-2020 дата публикации

CONVERSION MATERIAL

Номер: US20200035895A1
Автор: Raccis Riccardo
Принадлежит:

The present invention provides a conversion material including a first phase providing a matrix and a second phase comprising a nanoscale or microscale material providing electron mobility. The conversion material converts heat from a single macroscopic reservoir into voltage. 1. A thermal energy to electrical energy conversion material comprising:a first phase providing a matrix; anda second phase comprising a nanoscale or microscale material providing electron mobility, the second phase comprising particles with an aspect ratio greater than 1,wherein the second phase provides electrical conducting channels throughout the conversion material wherein, andthe second phase comprises barbed tendrils, with a majority of the barbed tendrils pointing in one direction.2. The conversion material according to claim 1 , wherein the first phase comprises an insulator.3. The conversion material according to claim 1 , wherein the second phase comprises a semiconducting material or a conducting material.4. The conversion material according to claim 3 , wherein:the semiconducting material is selected from carbon nanotubes and graphene; andthe conducting material is selected from a material in which charge carriers move freely within a stationary structure.5. The conversion material according to claim 1 , wherein the first phase comprises a non-conductive polymer.6. The conversion material according to claim 1 , wherein the second phase comprises particles with a dimension of 100 μm or less.7. (canceled)8. The conversion material according to claim 5 , wherein the first phase comprises an acrylic polymer.9. A conversion element claim 5 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the conversion material according to ; and'}two electrodes connected to the conversion element.10. A conversion module claim 5 , comprising:{'claim-ref': {'@idref': 'CLM-00009', 'claim 9'}, 'the conversion element according to .'}11. A generator claim 9 , comprising: the conversion ...

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Номер записи: 32
24-02-2022 дата публикации

STRETCHABLE CONDUCTIVE FLUOROELASTOMER PASTE COMPOSITION

Номер: US20220056283A1
Автор: LIANG YU TENG
Принадлежит:

The invention relates to a polymer thick film (PTF) conductive paste composition comprising a conductive powder, a fluoroelastomer, a silane coupling agent, and one or solvents. The PTF conductive paste composition can be used to form a printed conductor and to form an electrically conductive adhesive on various articles. The PTF conductive paste composition is provides a stretchable electrical conductor for wearables. 1. An wearable garment comprising a printed conductor formed from a polymer thick film conductive paste composition wherein the polymer thick film conductive paste comprises:a) 45-65 wt % conductive powder;b) 10-20 wt % fluoroelastomer;c) 0.1-3 wt % silane coupling agent;d) 0-35 wt % of one or more solvents selected from the group consisting of 2-(2-ethoxyethoxy)ethyl acetate, diethylene glycol monobutyl ether acetate, ethylene glycol diacetate, dibasic esters and c11; ande) 1-35 wt % of one or more solvents selected from the group consisting of triethyl phosphate, acetone, 4-methyl-2-pentanone, 2,6-dimethyl-4-heptanone and cyclohexane, wherein the wt % are based on the total weight of the paste composition.2. The wearable garment of claim 1 , wherein the fluoroelastomer is a vinylidene fluoride containing fluoroelastomer copolymer.3. The wearable garment of claim 2 , wherein the fluoroelastomer is a terpolymer of vinylidene fluoride claim 2 , hexafluoropropylene and tetrafluoroethlyene.4. The wearable garment of claim 2 , wherein the fluoroelastomer is a dipolymer of vinylidene fluoride and hexafluoropropylene.5. The wearable garment of claim 1 , wherein the conductive powder is an electrically conductive powder of one or more of Ag claim 1 , Cu claim 1 , Au claim 1 , Pd claim 1 , Pt claim 1 , Sn claim 1 , Al claim 1 , Ni claim 1 , C claim 1 , alloys thereof and mixtures thereof.6. The wearable garment of claim 5 , wherein the conductive powder is silver powder.7. The wearable garment of claim 6 , wherein the silver powder is in the form of silver ...

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Номер записи: 33
09-02-2017 дата публикации

WAVELENGTH CONVERSION BONDING MEMBER, WAVELENGTH CONVERSION HEAT DISSIPATION MEMBER, AND LIGHT-EMITTING DEVICE

Номер: US20170040502A1
Автор: FUJII Hironaka, SHIRAKAWA Masahiro
Принадлежит: NITTO DENKO CORPORATION

A wavelength conversion bonding member includes a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element, wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, and the bonding layer has a reflectivity of 90% or more. 1. A wavelength conversion bonding member including a phosphor ceramic element and a bonding layer provided on one side of the phosphor ceramic element ,wherein the bonding layer has a thermal conductivity of more than 0.20 W/m·K, andthe bonding layer has a reflectivity of 90% or more.2. The wavelength conversion bonding member according to claim 1 , wherein the bonding layer is formed from a ceramic ink.3. The wavelength conversion bonding member according to claim 1 , wherein the bonding layer is formed from a curable resin composition containing a curable resin claim 1 , and at least one inorganic particle selected from inorganic oxide particles and metal particles.4. The wavelength conversion bonding member according to claim 1 , wherein the bonding layer has a thickness of 80 μm or more and 1000 μm or less.5. A wavelength conversion heat dissipation member including the wavelength conversion bonding member according to claim 1 , and a heat diffusion retention member claim 1 ,wherein the heat diffusion retention member is bonded to the phosphor ceramic element through the bonding layer.6. A light-emitting device including a light source that applies light to one side claim 1 ,a reflection mirror that is disposed on one side to face the light source in spaced-apart relation and in which a through hole for allowing the light to pass through is formed, and{'claim-ref': {'@idref': 'CLM-00005', 'claim 5'}, 'the wavelength conversion heat dissipation member according to disposed on one side to face the reflection mirror in spaced-apart relation so that the light is applied to the phosphor ceramic element.'} The present invention relates to a wavelength conversion bonding member, a ...

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Номер записи: 34
07-02-2019 дата публикации

Conductive adhesive tape using compressible conductive powder and manufacturing method thereof

Номер: US20190040286A1
Автор: Ho Seup Moon
Принадлежит: Truss Co Ltd

Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.

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Номер записи: 35
16-02-2017 дата публикации

PROCESS FOR FORMING A SOLDERABLE POLYIMIDE-BASED POLYMER THICK FILM CONDUCTOR

Номер: US20170044382A1
Автор: SUH SEIGI
Принадлежит:

The invention is directed to a process for forming a solderable polyimide-based polymer thick film conductor in which a paste composition comprising an electrically conductive metal, a polyimide and an organic solvent is cured by heating at a temperature of 280 to 320° C. The invention is also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed by the process of the invention. 1. A process for forming a solderable polyimide-based polymer thick film conductor , comprising the steps of:(j) providing a substrate; (a) 60-95 wt % of an electrically conductive metal powder;', '(c) 2-6 wt % of a polyimide polymer; and', 'wherein the wt % are based on the total weight of said paste composition, said electrically conductive metal powder is dispersed in and said polyimide polymer is dissolved in said organic solvent and the ratio of said electrically conductive metal powder to said polyimide is between 13 and 40;', '(c) an organic solvent,'}], '(ii) preparing a paste composition comprising(iii) applying said paste composition in the desired pattern onto said substrate; and(iv) curing the paste composition applied in step (iii) by heating at a temperature of 280 to 320° C. for at least 30 minutes, with the proviso that if the ratio of the weight of the electrically conductive metal powder to the weight of the polyimide polymer is greater than 30, curing can be done by heating at a temperature of 250 to 320° C. for at least 30 minutes.2. The process of claim 1 , wherein after step (iii) but before step (iv) said paste composition applied in step (iii) is dried by heating at a temperature sufficient to remove said organic solvent.3. The process of claim 1 , said paste composition comprising: 75-90 wt % of an electrically conductive metal powder.4. The process of claim 1 , wherein said electrically conductive metal is selected from the group consisting of Ag claim 1 , Cu claim 1 , Au claim 1 , Pd claim 1 , Pt claim 1 , Sn ...

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Номер записи: 36
14-02-2019 дата публикации

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing Flat Inorganic Particle Fillers and Method of Use

Номер: US20190048238A1
Автор: Fraivillig James B.
Принадлежит:

A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of flat particulate inorganic ceramic and/or metallic electrically insulating, and/or electrically conducting, and/or thermally conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures, such particles resulting in the reduction of the occurrence and size of gas voids within the adhesive bondline. 1. The process of reducing the occurrence and size of gas voids in a bondline formed by the thermoplastic polyimide adhesive interface bonding of two surfaces , said process comprising in combination: 1. a quantity of polar aprotic organic solvent;', '2. a quantity of TPI precursor polyamic-acid polymer (PAA) synthesized and dissolved in said solvent wherein said polyamic-acid polymer comprises a mixture of diamine and dianhydride monomers, said monomers selected, in combination, to result in a thermoplastic polyimide having the characteristic of being insoluble in an organic solvent in the fully imidized, fully cured state, and', '3. a quantity of flat particulate filler; said filler comprising an inorganic material having a particle size of between 0.1 and 2.0 um in thickness, and 1.0 and 20.0 um in width and wherein the width of said particles is greater than the thickness;, 'A. providing an adhesive solution consisting of an A-staged uncured thermoplastic-polyimide (TPI) solution, said thermoplastic polyimide having the characteristic of being insoluble in an organic solvent in the fully imidized, fully cured state, in the form of a viscous liquid solution containing in combinationB. applying said uncured solution to at least one of said surfaces;C. applying ...

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Номер записи: 37
25-02-2021 дата публикации

POSS-TX NANO-PHOTO-INITIATOR SYNTHESIS AND IN SITU PHOTOCHEMICAL AG NANO-PARTICLE SYNTHESIS WITH THE HELP OF POSS-TX AND WRINKLED SURFACE FORMATION

Номер: US20210054110A1
Автор: ARSU Nergis, BATIBAY Gonul Saadet, GUNKARA Omer Tahir, OCAL Nuket
Принадлежит:

The present invention particularly relates to synthesizing photo-initiators having poly-oligo-silsesquioxane (POSS) structure and realizing photo-polymerization by using these photo-initiators and simultaneous and in-situ synthesis of Ag nano-particles in polymer matrix comprising POSS structure and obtaining wrinkled surfaces as a result of self-arranging thereof. 1. A method for obtaining an antibacterial and wrinkled surface which is in nano-composite structure comprising Ag nano-particle in a rapid manner by means of in situ single vessel method , in order to be used in flexible electronic materials and optical devices; characterized by comprising the steps of:{'sub': '3', 'a) Mixing POSS-TX and AgNOsalt and acrylic based oligomer and/or monomer at room temperature,'}b) Subjecting the obtained acrylic based mixture to homogenization and degassing processes respectively,c) Spreading the obtained mixture onto a glass or metal surface so as to form a layer with thickness of 20-40 μm,d) Subjecting the acrylic based mixture, spread on the surface, to UV light,e) Determining that the silver nano-particles are formed by means of observing that peak occurs between 400-450 nm at UV-Vis absorption spectrum.2. The method for obtaining an antibacterial and wrinkled surface according to claim 1 , wherein in process step e claim 1 , said acrylic-based oligomer and monomer is poly(ethylene glycol) diacrylate claim 1 , poly(ethylene glycol) mono-acrylate and poly(ethylene glycol) methyl ether acrylate.3. The method for obtaining an antibacterial and wrinkled surface according to claim 1 , wherein in process step f claim 1 , said process of leaving to ultrasonic bath is realized for 15 minutes at room temperature.4. The method for obtaining an antibacterial and wrinkled surface according to claim 1 , wherein in process step g claim 1 , said mixing process is realized for 1-2 minutes.5. A nano-composite surface comprising an Ag-nano-particle obtained by means of the method ...

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Номер записи: 38
25-02-2021 дата публикации

ACRYLIC RESIN, METHOD FOR PRODUCING SAME, AND FINE METAL PARTICLE DISPERSION

Номер: US20210054224A1
Автор: WATANABE Koji, Yamaguchi Yoshiyuki
Принадлежит: Nagase Chemtex Corporation

Disclosed is an acrylic resin and a metal fine particle dispersion including the acrylic resin. The acrylic resin contains a unit of a (meth)acrylate monomer A having a polyalkylene glycol moiety and has at least at one end a carboxylic acid group and/or a carboxylic acid salt group. 1. A metal fine particle dispersion comprising an acrylic resin , fine particles of a metal , and a dispersion medium ,the acrylic resin containing a unit of a (meth)acrylate monomer A having a polyalkylene glycol moiety, the acrylic resin having at least at one end a functional group selected from the group consisting of a carboxylic acid group and a carboxylic acid salt group,the metal including at least one selected from silver and copper, andthe metal fine particles having an average diameter of 5 nm to 500 nm.2. The metal fine particle dispersion of claim 1 , wherein the number of repeating alkylene glycol units in the polyalkylene glycol moiety is 4 to 120.3. The metal fine particle dispersion of claim 1 , wherein the polyalkylene glycol moiety contains a polyethylene glycol moiety.4. The metal fine particle dispersion of claim 1 , wherein the acrylic resin further contains a unit of a (meth)acrylate monomer B having a hydrophobic group.5. The metal fine particle dispersion of claim 4 , wherein the hydrophobic group is an alkyl group.6. The metal fine particle dispersion of claim 4 , wherein a content of the unit of the (meth)acrylate monomer A in the acrylic resin is 10 to 50 mass %.7. The metal fine particle dispersion of claim 1 , wherein the acrylic resin has a weight-average molecular weight of 5 claim 1 ,000 to 100 claim 1 ,000.8. The metal fine particle dispersion of claim 1 , wherein the acrylic resin further contains a unit of a monomer C having a heterocycle claim 1 , andthe acrylic resin at least contains a unit of a (meth)acrylate monomer of a hydroxy compound having a heterocycle, as the unit of the monomer C.9. The metal fine particle dispersion of claim 8 , wherein ...

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Номер записи: 39
13-02-2020 дата публикации

THERMAL-BONDING SHEET AND THERMAL-BONDING SHEET-ATTACHED DICING TAPE

Номер: US20200048504A1
Автор: Honda Satoshi, Shimoda Mayu, Sugo Yuki
Принадлежит:

Provided are: a thermal bonding sheet suitable for actually providing sinter bonding between bonding targets while reducing misalignment of the bonding targets, and a dicing tape with such a thermal bonding sheet. This thermal bonding sheet includes a pressure-sensitive adhesive layer including sinterable particles containing a conductive metal. The pressure-sensitive adhesive layer has a shear bond strength of 0.1 MPa or more determined at 70° C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70° C., 0.5 MPa, and 1 second. The thermal bonding sheet-associated dicing tape includes a dicing tape and the thermal bonding sheet. The dicing tape has a multilayer structure including a base and a pressure-sensitive adhesive layer. The thermal bonding sheet is disposed on the pressure-sensitive adhesive layer of the dicing tape. 1. A thermal bonding sheet comprisinga pressure-sensitive adhesive layer including sinterable particles containing a conductive metal,the pressure-sensitive adhesive layer having a first shear bond strength of 0.1 MPa or more, where the first shear bond strength is a shear bond strength determined at 70° C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70° C., 0.5 MPa, and 1 second.2. The thermal bonding sheet according to claim 1 ,wherein the pressure-sensitive adhesive layer has a second shear bond strength and has a ratio of the second shear bond strength to the first shear bond strength of 5 to 40, where the first shear bond strength is a shear bond strength determined at 70° C. with respect to a silver plane to which the pressure-sensitive adhesive layer as a 5-mm square piece has been compression-bonded under compression bonding conditions of 70° C., 0.5 MPa, and 1 second, and where the second shear ...

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Номер записи: 40
03-03-2022 дата публикации

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND CONDUCTIVE PASTE FOR THE SAME

Номер: US20220068518A1
Автор: MATSUURA YUMI, YOSHIIKE YUKA
Принадлежит:

The invention relates to a method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof; mounting an electrical component on the applied conductive paste; and heating the conductive paste to bond the electrically conductive layer and the electrical component. 1. A method of manufacturing an electronic device comprising the steps of:preparing a substrate comprising an electrically conductive layer;applying a conductive paste on the electrically conductive layer, wherein the conductive paste comprises 100 parts by weight of a metal powder, 5 to 20 parts by weight of a solvent and 0.01 to 5 parts by weight of a dispersant and wherein the dispersant is selected from the group consisting of allyl ether copolymer, polyhydroxy fatty acid and a mixture thereof;mounting an electrical component on the applied conductive paste; andsubsequent to the step of mounting the electrical component on the applied conductive paste, preheating the applied conductive paste at 80 to 180° C.;subsequent to the step of preheating the applied conductive paste, heating the conductive paste to bond the electrically conductive layer and the electrical component at 180 to 350° C.2. The method of claim 1 , wherein particle diameter (D50) of the metal powder is 0.01 to 3 μm.3. The method of claim 1 , wherein the metal powder is selected from the group consisting of silver claim 1 , copper claim 1 , gold claim 1 , nickel claim 1 , palladium claim 1 , platinum claim 1 , rhodium claim 1 , aluminum claim 1 , an alloy thereof and a mixture thereof.4. The method of claim 1 , ...

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Номер записи: 41
10-03-2022 дата публикации

SILVER PASTE

Номер: US20220072607A1
Автор: MASHIMA Hiroshi, Nishimura Kousuke, Shindo Naoto
Принадлежит:

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, in which a value C/Sis 2.0 to 3.4 where S(m/g) represents a specific surface area of the silver powder, and C(% by mass) represents a content percentage of the binder resin based on the silver powder, a copper content of the silver powder is 10 to 5000 ppm by mass, and the silver paste has a dry film density of 7.50 g/cmor more. The present invention can provide a silver paste containing a powder in a high concentration and excellent in printability, and accordingly provide a silver conductor film that has a high filling factor and a high film density, exhibits high electrical conductivity, and is excellent in migration resistance. 1. A silver paste , comprising at least a silver powder , a binder resin , and an organic solvent ,{'sub': BND', 'BET', 'BET', 'BND, 'sup': '2', 'wherein a value C/Sis 2.00 to 3.40, where S(m/g) represents a specific surface area of the silver powder, and C(% by mass) represents a content percentage of the binder resin based on the silver powder,'}a copper content of the silver powder is 10 to 5000 ppm by mass, and{'sup': '3', 'the silver paste has a dry film density of 7.50 g/cmor more.'}2. The silver paste according to claim 1 , wherein the dry film density is 7.60 g/cmor more.3. The silver paste according to or claim 1 , wherein the value C/Sis 2.50 to 3.10.4. The silver paste according to claim 1 , wherein the silver powder contains copper in a content of 30 to 500 ppm by mass.5. The silver paste according to claim 1 , wherein a content Cof the silver powder based on the silver paste is 80.00 to 97.00% by mass.6. The silver paste according to claim 5 , wherein the content Cof the silver powder based on the silver paste is 92.00 to 96.00% by mass.7. The silver paste according to claim 1 , wherein the specific surface area Sof the silver powder is 0.10 to 0.30 m/g.8. The silver paste according to claim 1 , wherein ...

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Номер записи: 42
10-03-2022 дата публикации

Curable silicone-based compositions and applications thereof

Номер: US20220073746A1
Автор: Haigang Kang, Murali MG, Shreedhar Bhat, Titash MONDAL
Принадлежит: Momentive Performance Materials Inc

The present technology provides a curable silicone-based composition comprising a hybrid silicone polymer, a catalyst, and a filler. The present technology provides a curable silicone composition comprising a polymer A comprising an organic molecule or a siloxane molecule comprising an alkoxy radical, a hydroxyl radical, an isocyanate radical, a primary amine, or a carboxylic radical; optionally a polymer B comprising an organic molecule, a siloxane molecule, or a hybrid-siloxane molecule; a catalyst; and a filler.

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Номер записи: 43
10-03-2022 дата публикации

SUPERHYDROPHILIC COATING COMPOSITION

Номер: US20220073782A1
Автор: Lai Qianxi, ZHANG Yiling, Zhou Jiadong
Принадлежит:

A composition, coating and/or method of facilitating the spreading of an aqueous solution upon a substrate includes coating the substrate with a composition comprising waterborne polymer, hydrophobic surface modified particles, and an amphiphilic compound, such that fluids that adhere to the coated substrate may be more easily removed from the substrate than from an uncoated substrate. 1. A superhydrophilic polymer composite comprising:i. a waterborne polymer;ii. a plurality of hydrophobic surface modified particles; andiii. an amphiphilic compound;wherein the superhydrophilic polymer composite is a uniform mixture.2. The superhydrophilic polymer composite of claim 1 , wherein the waterborne polymer comprises an aqueous polyurethane dispersion.3. The superhydrophilic polymer composite of claim 2 , wherein the aqueous polyurethane dispersion is a polyether polyurethane dispersion.4. The superhydrophilic polymer composite of claim 2 , wherein the aqueous polyurethane dispersion is an aliphatic polycarbonate polyurethane dispersion.5. The superhydrophilic polymer composite of claim 1 , wherein the hydrophobic surface modified particles comprise a modified fumed silica.6. The superhydrophilic polymer composite of claim 5 , wherein the modified fumed silica is modified with polydimethylsiloxane.7. (canceled)8. The superhydrophilic polymer composite of claim 1 , wherein the amphiphilic compound comprises a polydimethylsiloxane polymer modified with hydrophilic side chains.9. The superhydrophilic polymer composite of claim 8 , wherein the polydimethylsiloxane polymer is modified with polyether side chains.10. The superhydrophilic polymer composite of claim 1 , wherein the amphiphilic compound comprises polysorbate 80.11. The superhydrophilic polymer composite of claim 1 , further comprising an acrylic polymer.12. The superhydrophilic polymer composite of claim 1 , further comprising an antimicrobial agent.13. The superhydrophilic polymer composite of claim 12 , wherein the ...

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Номер записи: 44
02-03-2017 дата публикации

Accessory Preparation Toy

Номер: US20170056781A1
Автор: KUBOTA Sakuya, Suzuki Hiromi, Yamada Satoshi
Принадлежит:

With a view to providing an accessory preparation toy which can prepare accessories of various sizes, colors, patterns and shapes easily and simply with joy, a storage container includes a main material storage portion, an auxiliary material storage portion and a mixing chamber. A main material and an auxiliary material which make up a mixed curable resin material are stored separately in the main material storage portion and the auxiliary material storage portion. Opening portions of the main material storage portion and the auxiliary material storage portion are formed so as to be opened by pressing the main material or the auxiliary material stored therein with fingers. Lamé flakes which represent a decorative material are mixed into the main material. 1. An accessory preparation toy having:a mixed curable resin material which is made up of a main material and an auxiliary material; anda storage container which stores the main material and the auxiliary material separately, whereina decorative material is mixed into the main material or the auxiliary material.2. The accessory preparation toy according to claim 1 , whereinthe mixed curable resin material is a two-pack silicone resin.3. The accessory preparation toy according to claim 1 , whereinthe decorative material is made up of a lamé material, a pearlescent material, a flake or powder of glass, metal or silica, a resin chip, ground stone, a ground wood material or a coloring liquid material, or a combination of any or some of them.4. The accessory preparation toy according to claim 2 , whereinthe decorative material is made up of a lamé material, a pearlescent material, a flake or powder of glass, metal or silica, a resin chip, ground stone, a ground wood material or a coloring liquid material, or a combination of any or some of them.5. The accessory preparation toy according to claim 1 , whereinthe storage container has a main material storage portion where the main material is stored, an auxiliary material ...

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Номер записи: 45
03-03-2016 дата публикации

Nanoparticle ink compositions, process and applications

Номер: US20160060474A1
Автор: Gunther Dreezen, Jianping Chen, Rudolf W. Oldenzijl
Принадлежит: Henkel AG and Co KGaA, Henkel IP and Holding GmbH

Provided herein are conductive ink compositions having a good balance between adhesion to substrate, nanoparticle stability, the ability to be sintered at relatively low temperatures, and good electrical conductivity. In one aspect, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, such conductive networks are suitable for use in touch panel displays. In certain aspects, the invention relates to methods for adhering nanoparticulate silver to a non-metallic substrate. In certain aspects, the invention relates to methods for improving the adhesion of nanoparticulate silver-filled formulation to a non-metallic substrate.

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Номер записи: 46
02-03-2017 дата публикации

Composite Cables

Номер: US20170058098A1
Автор: Michael Fripp, Sean Gregory THOMAS
Принадлежит: Halliburton Energy Services Inc

Disclosed are composite cables suitable for use in conjunction with wellbore tools. One cable may include a polymer composite that includes dopants dispersed in a polymer matrix and continuous fibers extending along an axial length of the cable through the polymer matrix, wherein the cable is characterized by at least one of the following: (1) at least a portion of the cable having a density greater than about 2 g/cm 3 , wherein at least some of the dopants have a density of about 6 g/cm 3 or greater, (2) at least a portion of the cable having a density less than about 2 g/cm 3 , wherein at least some of the dopants have a density of about 0.9 g/cm 3 or less, (3) at least some of the dopants are ferromagnetic, or (4) at least some of the dopants are hydrogen getters.

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Номер записи: 47
04-03-2021 дата публикации

MALEIMIDE RESIN FILM AND COMPOSITION FOR MALEIMIDE RESIN FILM

Номер: US20210061955A1
Автор: IGUCHI Hiroyuki, Kashiwagi Tsutomu, TSUTSUMI Yoshihiro
Принадлежит: SHIN-ETSU CHEMICAL CO., LTD.

Provided is a maleimide resin film highly filled with inorganic particles and having a superior adhesion force. The maleimide resin film contains: 3. The maleimide resin film according to claim 1 , wherein the component (b) which is the (meth)acrylate having not less than 10 carbon atoms has at least one aliphatic ring having not less than 5 carbon atoms.4. The maleimide resin film according to claim 1 , wherein the inorganic particles as the component (c) are at least one selected from the group consisting of electrically conductive particles claim 1 , thermally conductive particles claim 1 , a phosphor claim 1 , magnetic particles claim 1 , white particles claim 1 , hollow particles and electromagnetic wave-absorbing particles.5. The maleimide resin film according to claim 1 , wherein the inorganic particles as the component (c) are at least one kind of electrically conductive particles selected from elemental metal particles that are gold particles claim 1 , silver particles claim 1 , copper particles claim 1 , palladium particles claim 1 , aluminum particles claim 1 , nickel particles claim 1 , iron particles claim 1 , titanium particles claim 1 , manganese particles claim 1 , zinc particles claim 1 , tungsten particles claim 1 , platinum particles claim 1 , lead particles and tin particles; and alloy particles that are solder particles claim 1 , steel particles and stainless steel particles.6. The maleimide resin film according to claim 1 , wherein the inorganic particles as the component (c) are at least one kind of thermally conductive particles selected from the group consisting of boron nitride particles claim 1 , aluminum nitride particles claim 1 , silicon nitride particles claim 1 , beryllium oxide particles claim 1 , magnesium oxide particles claim 1 , zinc oxide particles claim 1 , aluminum oxide particles claim 1 , silicon carbide particles claim 1 , diamond particles and graphene particles.7. The maleimide resin film according to claim 1 , wherein ...

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Номер записи: 48
04-03-2021 дата публикации

CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH

Номер: US20210062047A1
Автор: Ti Yang, Wu Qili, Yao Wei, Zhao Jiawen
Принадлежит:

This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured. 1. A curable adhesive composition , comprising ,(1) a thermosetting or thermoplastic resin component,{'sub': '50', '(2) a plurality of particles of a first metal or alloy having a melting point no higher than 300° C. and a Dparticle size of from 10 μm to 100 μm,'}{'sub': '50', '(3) a plurality of particles of a second metal or alloy having a melting point higher than 300° C., and a Dparticle size of from 0.1 μm to less than 10 μm, and'}(4) optionally a curing agent.2. The curable adhesive composition according to claim 1 , wherein the thermosetting or thermoplastic resin component is selected from epoxy monomer claim 1 , epoxy oligomer claim 1 , epoxy polymer claim 1 , (meth)acrylic monomer claim 1 , (meth)acrylic oligomer claim 1 , (meth)acrylic polymer claim 1 , phenol-formaldehyde resin claim 1 , polyurethane claim 1 , cyanate ester claim 1 , polyvinyl alcohol claim 1 , a polyester claim 1 , polyurea claim 1 , polyvinyl acetal resin claim 1 , phenoxy resin claim 1 , maleimide claim 1 , bismaleimide claim 1 , nadimide claim 1 , itaconamide claim 1 , polyimide claim 1 , and mixture thereof.3. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy has a melting point from 50° C. to 300° C.4. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy comprise at least one of indium (In) claim 1 , germanium (Ga) claim 1 , bismuth (Bi) claim 1 , or tin (Sn).5. The curable adhesive composition according to claim 1 , wherein the particles of the first metal or alloy comprise essentially no lead (Pb) and cadmium (Cd) claim 1 , preferably comprise no Pb and Cd.6. The curable adhesive composition according to ...

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Номер записи: 49
20-02-2020 дата публикации

EPOXY PASTE COMPOSITION INCLUDING A SILVER-COATED COPPER NANOWIRE HAVING CORE-SHELL STRUCTURE, AND CONDUCTIVE FILM INCLUDING SAME

Номер: US20200056010A1
Автор: Kim Jae Ha, Kim JiEun, KIM Jun Pyo, Park Han Oh
Принадлежит:

The present invention relates to an epoxy paste composition including silver-coated copper nanowires having a core-shell structure, and a conductive film including the same. 1. An epoxy paste composition comprising:55 to 70 wt % of a silver-coated copper nanowire having a core-shell structure;1 to 35 wt % of an epoxy resin; and 1 to 35 wt % of a curing agent.2. The epoxy paste composition of claim 1 , wherein an amount of silver is 2 to 60 parts by weight based on 100 parts by weight of a total amount of the silver-coated copper nanowire.3. The epoxy paste composition of claim 1 , wherein a ratio (f/a) of the largest diameter (f) of a cross section of the silver-coated copper nanowire perpendicular to a length direction to a length (a) of the silver-coated copper nanowire is 0.0001 to 0.06.4. The epoxy paste composition of claim 1 , wherein the curing agent is any one or two or more selected from the group consisting of an acid anhydride-based curing agent claim 1 , a phenol-based curing agent claim 1 , an imidazole-based curing agent claim 1 , and an amino-based curing agent.5. The epoxy paste composition of claim 1 , wherein the epoxy resin is any one or two or more selected from the group consisting of a bisphenol A type epoxy resin claim 1 , a bisphenol F type epoxy resin claim 1 , a bisphenol S type epoxy resin claim 1 , a phenol novolac type epoxy resin claim 1 , a cresol novolac type epoxy resin claim 1 , an alkylphenol novolac type epoxy resin claim 1 , a biphenyl type epoxy resin claim 1 , a naphthalene type epoxy resin claim 1 , a dicyclopentadiene type epoxy resin claim 1 , triglycidyl isocyanate claim 1 , an urethane-modified epoxy resin claim 1 , and a non-aromatic epoxy resin.6. The epoxy paste composition of claim 1 , further comprising a diluent claim 1 , wherein the diluent is any one or two or more selected from the group consisting of acetone claim 1 , methyl ethyl ketone claim 1 , methyl alcohol claim 1 , ethyl alcohol claim 1 , isopropyl alcohol ...

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Номер записи: 50
10-03-2022 дата публикации

SEALER, METHOD OF ITS PRODUCTION AND ALL-SOLID-STATE SECONDARY BATTERY

Номер: US20220077529A1
Автор: Imoda Daisuke, KOBAYSHI Tomokazu, NAKANO Shuji
Принадлежит:

A sealer for use in an all-solid-state secondary battery provided with a sulfur-containing solid electrolyte, characterized in that the sealer contains a resin and a particulate fatty acid metal salt dispersed in the resin, and the particulate fatty acid metal salt is a particulate fatty acid metal salt in which a fatty acid is coordinated on the surfaces of the metal particles having a mean particle diameter of not more than 1000 nm. The all-solid-state secondary battery is capable of suppressing the generation of the hydrogen sulfide. 1. A sealer for use in an all-solid-state secondary battery provided with a sulfur-containing solid electrolyte , characterized in that:the sealer contains a resin and a particulate fatty acid metal salt dispersed in the resin; andthe particulate fatty acid metal salt is a particulate fatty acid metal salt in which a fatty acid is coordinated on the surfaces of the metal particles having a mean particle diameter of not more than 1000 nm.2. The sealer according to claim 1 , wherein the particulate fatty acid metal salt is contained in the sealer in an amount of from 0.0005 to 5% by mass.3. The sealer according to claim 1 , wherein the resin is at least the one selected from the group consisting of polyimide claim 1 , polyamide-imide claim 1 , polyether ether ketone (PEEK) and liquid crystal polymer (LCP).4. The sealer according to claim 1 , wherein the fatty acid in the fatty acid metal salt is at least the one selected from the group consisting of lauric acid claim 1 , myristic acid claim 1 , palmitic acid claim 1 , oleic acid claim 1 , linoleic acid claim 1 , linolenic acid claim 1 , stearic acid claim 1 , arachidic acid and behenic acid.5. The sealer according to claim 1 , wherein the metal in the fatty acid metal salt is at least the one selected from the group consisting of silver claim 1 , copper claim 1 , nickel claim 1 , cobalt claim 1 , gold and palladium.6. An all-solid-state secondary battery comprising a positive electrode ...

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Номер записи: 51
02-03-2017 дата публикации

FILM FOR TRANSPARENT SCREEN AND METHOD FOR MANUFACTURE THEREOF, AND TRANSPARENT SCREEN COMPRISING SAME

Номер: US20170059982A1
Автор: Matsuo Akira, Nishimura Suzushi, Sakajiri Koichi, Watanabe Junji, YAMAKI Kousuke
Принадлежит:

Provided is a film for a transparent screen which can clearly display merchandise information, advertisement, or the like on a transparent partition or the like by projection without compromising the transmission visibility. A film for a transparent screen according to the present invention includes: a resin layer; and inorganic particles at least a portion of which is contained in an aggregated state in the resin layer, wherein primary particles of the inorganic particles have a median diameter of 0.1 to 50 nm and a maximum particle size of 10 to 500 nm, and the content of the inorganic particles is 0.015 to 1.2% by mass with respect to the resin. 1. A film for a transparent screen comprising:a resin layer; andinorganic particles at least a portion of which is contained in an aggregated state in the resin layer, whereinprimary particles of the inorganic particles have a median diameter of 0.1 to 50 nm and a maximum particle size of 10 to 500 nm, andthe content of the inorganic particles is 0.015 to 1.2% by mass with respect to the resin.2. The film for a transparent screen according to claim 1 , whereinthe inorganic particles are metal particles.3. The film for a transparent screen according to claim 1 , whereinthe inorganic particles are at least one selected from the group consisting of zirconium oxide particles, titanium oxide particles, cerium oxide particles, barium titanate particles, barium sulfate particles, and silver particles.4. The film for a transparent screen according to claim 1 , whereinthe resin layer comprises a thermoplastic resin.5. The film for a transparent screen according to claim 4 , whereinthe thermoplastic resin comprises at least one selected from the group consisting of an acrylic resin, a polyester resin, a polyolefin resin, a cellulose resin, a vinyl resin, a polycarbonate resin, and a polystyrene resin.6. The film for a transparent screen according to claim claim 4 , whereinthe thermoplastic resin comprises at least one selected from ...

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Номер записи: 52
05-03-2015 дата публикации

Adhesive using wire pigment and manufacturing method thereof

Номер: US20150065602A1
Автор: Dae Jun Kim, Jong Sik Kim, Yoon Min Lee
Принадлежит: Samsung Electro Mechanics Co Ltd

The present invention relates to an adhesive using wire pigments and a manufacturing method thereof. According to an embodiment of the present invention, an adhesive using wire pigments, which includes an adhesive resin composition including a photocurable adhesive material; and wire pigments formed in a nano-sized wire structure to be immersed in the adhesive resin composition and having light shielding properties, is provided. Further, a manufacturing method of an adhesive using wire pigments is provided.

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Номер записи: 53
17-03-2022 дата публикации

INSTRINSICALLY ANTIMICROBIAL POROSIC MATRIX COMPOSITES AND METHOD OF MANUFACTURE THEREOF

Номер: US20220079145A1
Автор: WILSON John Paul
Принадлежит:

A method of manufacturing a flexible intrinsically antimicrobial absorbent porosic composite controlling for an effective pore size using removable pore-forming substances and physically incorporated, non-leaching antimicrobials. A flexible intrinsically antimicrobial absorbent porosic composite controlled for an effective pore size composited physically incorporated, high-surface area, non-leaching antimicrobials, optionally in which the physically incorporated non-leaching antimicrobial exposes nanopillars on its surface to enhance antimicrobial activity. A kit that enhances the effectiveness of the intrinsically antimicrobial absorbent porosic composite by storing the composite within an antimicrobial container. 1. A method of manufacturing an absorbent non-leaching antimicrobial porous matrix composite , comprising:making or obtaining a flexible porous solid matrix substrate that forms a pore-containing solid matrix, wherein the pores of the solid substrate have an average size of under 3 mm in width at their narrowest dimensionphysically incorporating a non-leachable antimicrobial within or upon a pore-containing solid matrix, wherein the non-leachable antimicrobial has exposure to the interior of the matrix pores; removing any non-physically incorporated non-leachable antimicrobial from the pore-containing solid matrix.2. The method of claim 1 , wherein the non-leaching antimicrobial porous matrix composite is made by further steps comprising: 'and wherein the solidifiable matrix is solidified while physically enveloping the pore-forming substance to form the pore-containing solid matrix;', 'mixing a solidifiable matrix in a flowable form with a removable pore-forming substance, wherein the pore-forming substance is evenly distributed and physically enveloped within the solidifiable matrix,'} 'and wherein the pores formed in the pore-containing solid matrix have an average size of under 3 mm in width at their narrowest dimension.', 'removing the pore-forming ...

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Номер записи: 54
01-03-2018 дата публикации

USE OF A CARBON COMPOSITE MATERIAL FOR MANUFACTURING ELECTRICAL CONTACT ELEMENTS FOR A FUEL PUMP, AND CONTACT ELEMENT

Номер: US20180062338A1
Автор: HUBER Florian, MAURER Martin
Принадлежит:

The invention relates to the use of a carbon composite material for manufacturing electrical contact elements of a fuel pump operated in a fuel environment, the contact elements being designed as carbon molds, wherein, in addition to carbon, the carbon composite material comprises a thermosetting or thermoplastic binder and a metal content that amounts to more than 0.5% and less than 25% of the total mass of the carbon composite material. 1. A method for manufacturing electrical contact elements of a fuel pump operated in a fuel environment , the method comprising forming a carbon composite material from carbon , at least one of a thermosetting and a thermoplastic binder , and a metal content comprising no more than 0.5% and less that 25% of the total mass of the carbon composite material; and forming contact elements from the carbon composite material in carbon molds.2. The method of claim 1 , further comprising the step of connecting the contact elements of the fuel pump to an automobile on-board electrical system having a line voltage of 12 V.3. The method according to wherein the metal content amounts to a maximum of 20% of the total mass of the carbon composite material.4. The method of claim 1 , wherein the metal content is added to the carbon composite material in the form of powder.5. The method of claim 4 , wherein the metal content comprises metal particles having a particle diameter of up to 1 mm.6. The method of claim 5 , wherein more than 80% of the metal particles have a particle diameter of up to 1 mm.7. The method of claim 5 , wherein more than 95% of the metal particles have a particle diameter of up to 1 mm.8. The method of claim 1 , wherein the metal content comprises at least one metal of the group comprising aluminum claim 1 , zinc and silver.9. The method according to claim 8 , wherein the metal content is formed by aluminum or an aluminum alloy claim 8 , and the metal content amounts to more than 0.5% and less than 20% of the total mass of the ...

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Номер записи: 55
27-02-2020 дата публикации

INORGANIC PARTICLE DISPERSION

Номер: US20200062989A1
Автор: ARAKAWA Takayasu, GOTO Hideyuki, YAMABAYASHI Yoshiaki
Принадлежит: Harima Chemicals, Inc.

An inorganic particle dispersion having high spinnability is provided. The inorganic particle dispersion according to one embodiment includes an inorganic powder, hydrophilic fumed silica, and a resin having a hydroxyl group. 1. An inorganic particle dispersion comprisingan inorganic powder,hydrophilic fumed silica, anda resin having a hydroxyl group.2. The inorganic particle dispersion according to claim 1 , wherein the resin having a hydroxyl group comprises a modified acrylic resin claim 1 , an epoxy resin claim 1 , a urethane resin claim 1 , a phenolic resin claim 1 , ethyl cellulose claim 1 , a butyral resin or a gelatin resin having a hydroxyl group.3. The inorganic particle dispersion according to claim 1 , wherein the inorganic powder comprises a glass powder claim 1 , a gold powder claim 1 , a silver powder claim 1 , a copper powder claim 1 , an iron powder claim 1 , a stainless steel powder claim 1 , a titanium powder claim 1 , a nickel powder claim 1 , a chromium powder claim 1 , a tungsten powder or a molybdenum powder.4. The inorganic particle dispersion according to claim 1 , further comprising a dispersant or a leveling agent.5. The inorganic particle dispersion according to claim 1 , further comprising an acrylic resin claim 1 , a polybutadiene rubber claim 1 , a polyisoprene rubber claim 1 , a butyl rubber or a urethane rubber.6. The inorganic particle dispersion according to claim 1 , whereinthe inorganic powder is a glass powder, andthe inorganic particle dispersion further comprises a component adjusting agent for the glass powder.7. The inorganic particle dispersion according to claim 1 , further comprising an organic solvent for adjusting a viscosity of the inorganic particle dispersion.8. A process for producing an inorganic particle dispersion claim 1 , comprisinga first step of mixing at least fumed silica and a resin having a hydroxyl group in prescribed amounts and stirring them,a second step of adding a prescribed amount of an inorganic ...

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Номер записи: 56
09-03-2017 дата публикации

CONDUCTIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING THE SAME, SEALANT AND DISPLAY PANEL

Номер: US20170066945A1
Автор: QIN Yifeng, ZHOU Yongshan
Принадлежит:

The embodiments of the present disclosure relate to the field of display technologies and provide a conductive adhesive composition, a method for producing the same, a sealant and a display panel, so as to improve the dispersion evenness of conductive particles in the adhesive and ensure excellent conductivity of the conductive adhesive composition, as well as avoid influencing the normal throughput of the adhesive during coating when the doping percentage of conductive particles is high. The conductive adhesive composition comprises: a primary adhesive material; and carrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon. The present disclosure is applicable to manufacture a conductive adhesive composition as well as a sealant and a display panel comprising the conductive adhesive composition. 1. A conductive adhesive composition , comprising:a primary adhesive material; andcarrier granules dispersed in the primary adhesive material and having conductive particles adsorbed thereon.2. The conductive adhesive composition according to claim 1 , wherein the carrier granules comprise on their surfaces first functional groups which are organophilic.3. The conductive adhesive composition according to claim 2 , whereinthe primary adhesive material is composed of a resin material; andthe first functional groups comprise at least one of amino, mercapto, vinyl, epoxy, cyano and methacryloyloxy.4. The conductive adhesive composition according to claim 1 , wherein the carrier granules comprise on their surfaces second functional groups carrying positive charges or negative charges.5. The conductive adhesive composition according to claim 1 , wherein the conductive particles are made of at least one material of gold claim 1 , silver claim 1 , copper claim 1 , aluminum claim 1 , nickel and tin.6. The conductive adhesive composition according to claim 1 , wherein the conductive particles are spherical.7. The conductive adhesive ...

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Номер записи: 57
11-03-2021 дата публикации

VISIBILITY IMPROVING FILM FOR DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAME

Номер: US20210070963A1
Автор: BYUN Jinseok, CHANG Yeongrae, Lee Hanna, SEO Kwangseok
Принадлежит: LG CHEM, LTD.

The present invention relates to a visibility improving film for a display panel and a display device including the same. More specifically, the present invention relates to a visibility improving film for a display panel capable of exhibiting excellent physical and optical properties particularly while enhancing the visibility of a laser pointer, by including metal-coated inorganic oxide fine particles dispersed in the photocurable resin layer, and a display device including the same. 1. A visibility improving film for a display panel , comprising: a substrate; and a photocurable resin layer provided on at least one side of the substrate , wherein the photocurable resin layer includes a photocurable resin and metal-coated inorganic oxide fine particles having an average particle size of 1 to 10 μm dispersed in the photocurable resin , and wherein the visibility improving film improves visibility of a laser pointer light on the display panel compared with a display panel without the film and has a visibility evaluation value relative to a reference film as represented by Formula 1 of at least 4 ,{'br': None, 'i': B', 'A, 'Visibility Evaluation Value=1/1 \u2003\u2003[Formula 1]'}wherein, in the Formula 1,A1 is a luminance value measured from the front side of the reference, film bonded to a glass slide, then placed on a black acrylic plate by irradiating a laser light at 45° with respect to the normal direction, the reference film having—a transmittance of 80 to 100 as measured according to JIS K 7361 and a haze value of 20 to 25 as measured according to JIS K 7136 andB1 is a luminance value measured from the front side of the visibility improving film for a display panel bonded to a glass slide, then placed on a black acrylic plate by irradiating the same laser light at 45° with respect to the normal direction.2. The visibility improving film for a display panel according to claim 1 , wherein the metal-coated inorganic oxide fine particles have an average particle ...

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Номер записи: 58
08-03-2018 дата публикации

Circuit board having conductive polymer

Номер: US20180070437A1
Автор: Hsiao-Ting Hsu, Ming-Jaan Ho
Принадлежит: Avary Holding Shenzhen Co Ltd, Hongqisheng Precision Electronics Qinhuangdao Co Ltd

A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.

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Номер записи: 59
24-03-2022 дата публикации

Security element

Номер: US20220088957A1
Автор: Michelle Richert, Nikolay A. Grigorenko
Принадлежит: BASF SE

The present invention relates to security elements, comprising (a) a substrate, (b) on at least part of the substrate surface a metal layer, (c) optionally on at least part of the metal layer a dielectric layer, (d) on at least part of the metal layer, or the dielectric layer, a layer obtained by overcoating the metal layer, or the dielectric layer with a composition, comprising (i) silver nanoparticles, (ii) a solvent, (iii) (surface) stabilizing agent(s) and (iv) optionally a binder, and (e) a protective layer on top of layer (d). The maximum absorption wavelength of the silver nanoparticles in layer (d) is controlled by the amount of (surface) stabilizing agent(s) and optionally binder relative to the amount of silver nanoparticles to be preferably in the range of 700 to 1600 nm.

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Номер записи: 60
15-03-2018 дата публикации

METAL-POLYMER COMPOSITE MATERIAL

Номер: US20180072907A1
Автор: BALAN Lavinia Maria
Принадлежит:

The present invention relates to composite material comprising a matrix and a metallic layer located at at least one surface of said composite material, said matrix comprising at least one polymer and a first population of particles of at least one electronically conducting metal, said layer comprising a second population of particles of at least one electronically conducting metal, a method for preparing such composite material and applications thereof. 1. A composite material comprising a matrix and a metallic layer located at at least one surface of said composite material , said matrix comprising at least one polymer and a first population of particles of at least one electronically conducting metal , said layer comprising a second population of particles of at least one electronically conducting metal , the concentration of the particles of said second population in said layer being greater than the concentration of the particles of the first population in said matrix.2. A composite material comprising a matrix and a metallic layer located at at least one surface of said composite material said matrix comprising at least one polymer and a first population of particles of at least one electronically conducting metal , said layer comprising a second population of particles of at least one electronically conducting metal , said layers located at at least one surface of said composite material being an electronically conducting layer.3. A composite material comprising a matrix and a metallic layer located at at least one surface of said composite material said matrix comprising at least one polymer and a first population of particles of at least one electronically conducting metal , said layer comprising a second population of particles of at least one electronically conducting metal , said layers located at at least one surface of said composite material forming a metallic mirror surface.4. The composite material according to claim 1 , wherein said layer of ...

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Номер записи: 61
15-03-2018 дата публикации

Conductive Paste For Bonding

Номер: US20180072923A1
Автор: Yumi Matsuura
Принадлежит: EI Du Pont de Nemours and Co

The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

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Номер записи: 62
05-06-2014 дата публикации

Conductive compositions and methods of using them

Номер: US20140153167A1
Автор: Deborah Makita, James Hurley, Jose Quinones, Martin Sobczak, Rajan Hariharan, Senthil Kanagavel
Принадлежит: Alpha Metals Inc

A conductive composition includes a mono-acid hybrid that includes an unprotected, single reactive group. The mono-acid hybrid may include substantially non-reactive groups elsewhere such that the mono-acid hybrid is functional as a chain terminator. Methods and devices using the compositions are also disclosed.

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Номер записи: 63
24-03-2022 дата публикации

CONDUCTIVE INK COMPOSITIONS

Номер: US20220089895A1
Автор: Granek Filip, LYSIEN Mateusz, WIATROWSKA Aneta, ZlEBA Maciej
Принадлежит: XTPL S.A.

A conductive ink composition includes metallic nanoparticles, a first non-aqueous polar protic solvent, and a second non-aqueous polar protic solvent. The metallic nanoparticles can be silver nanoparticles. The silver nanoparticles can have an average particle size in a range of 20 nm to 80 nm. Polyvinylpyrrolidone is present on the metallic nanoparticle surfaces. The first solvent has a boiling point of at least 110° C. and a viscosity of at least 10 cP at 25° C. The second solvent has a boiling point of at least 200° C. and a viscosity of at least 100 cP at 25° C. The conductive ink composition contains the metallic nanoparticles in a range of 10 wt %to 75 wt %. The concentration of the second solvent in the conductive ink composition is 11.0% by volume or greater. 1. A conductive ink composition , comprising:metallic nanoparticles;a first non-aqueous polar protic solvent having a first boiling point of at least 110° C. and a first viscosity of at least 10 cP at 25° C.; anda second non-aqueous polar protic solvent having a second boiling point of at least 200° C. and a second viscosity of at least 100 cP at 25° C.;wherein the conductive ink composition contains the metallic nanoparticles in a range of 10 wt % to 75 wt %;the concentration of the second non-aqueous polar protic solvent in the conductive ink composition is 11.0% by volume or greater; anda concentration, in aggregate, of water, methanol, ethanol, 1-propanol, and 2-propanol, in the conductive ink composition does not exceed 10.0% by volume.28-. (canceled)9. The conductive ink composition of claim 1 , wherein a concentration claim 1 , in aggregate claim 1 , of solvents other than the first non-aqueous polar protic solvent and the second non-aqueous polar protic solvent claim 1 , in the conductive ink composition does not exceed 10.0% by volume.1015-. (canceled)16. A conductive ink composition claim 1 , comprising:silver nanoparticles;a first non-aqueous polar protic solvent having two hydroxyl groups; ...

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Номер записи: 64
18-03-2021 дата публикации

SILVER POWDER AND METHOD FOR PRODUCING SAME

Номер: US20210078081A1
Автор: EBARA Atsushi, Inoue Kenichi, Michiaki Yoshiyuki, Yamada Takahiro, YOSHIDA Masahiro
Принадлежит: DOWA ELECTRONICS MATERIALS CO., LTD.

There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 μm·% (preferably 1.5 to 10.5 μm·%). 12-. (canceled)3. A silver powder which has an average particle diameter of 1 to 6 μm and a shrinkage percentage of not higher than 8% at 500 and wherein a product of the average particle diameter and the shrinkage percentage at 500° C. is 1 to 11 μm·%.4. A silver powder as set forth in claim 3 , wherein a value obtained by dividing a product of a BET specific surface area (m/g) and a tap density (g/m) by a crystallite diameter (m) is 1×10to 6×10(m).5. A silver powder as set forth in claim 3 , which has a carbon content of not higher than 0.1% by weight.6. A conductive paste which contains a solvent claim 3 , a resin and a conductive powder which is a silver powder as set forth in . The present invention relates generally to a silver powder and a method for producing the same. More specifically, the invention relates to a silver powder for a conductive paste for use in electronic parts, such as internal electrodes of laminated capacitors or inductors, conductive patterns of circuit boards, and electrodes and circuits of substrates for display panels, and a method for producing the same.As a conventional conductive paste for use in electronic parts, such ...

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Номер записи: 65
22-03-2018 дата публикации

INSTRINSICALLY ANTIMICROBIAL POROSIC MATRIX COMPOSITES AND METHOD OF MANUFACTURE THEREOF

Номер: US20180077925A1
Автор: WILSON John Paul
Принадлежит:

A method of manufacturing a flexible intrinsically antimicrobial absorbent porosic composite controlling for an effective pore size using removable pore-forming substances and physically incorporated, non-leaching antimicrobials. A flexible intrinsically antimicrobial absorbent porosic composite controlled for an effective pore size composited physically incorporated, high-surface area, non-leaching antimicrobials, optionally in which the physically incorporated non-leaching antimicrobial exposes nanopillars on its surface to enhance antimicrobial activity. A kit that enhances the effectiveness of the intrinsically antimicrobial absorbent porosic composite by storing the composite within an antimicrobial container. 1. A method of manufacturing an absorbent non-leaching antimicrobial porous matrix composite , comprising:making or obtaining a flexible porous solid matrix substrate that forms a pore-containing solid matrix, wherein the pores of the solid substrate have an average size of under 3 mm in width at their narrowest dimensionphysically incorporating a non-leachable antimicrobial within or upon a pore-containing solid matrix, wherein the non-leachable antimicrobial has exposure to the interior of the matrix pores;removing any non-physically incorporated non-leachable antimicrobial from the pore-containing solid matrix.2. The method of claim 1 , wherein the non-leaching antimicrobial porous matrix composite is made by further steps comprising:mixing a solidifiable matrix in a flowable form with a removable pore-forming substance, wherein the pore-forming substance is evenly distributed and physically enveloped within the solidifiable matrix, and wherein the solidifiable matrix is solidified while physically enveloping the pore-forming substance to form the pore-containing solid matrix;removing the pore-forming substance from the solid matrix by melting or dissolution, wherein pores in the solid matrix are formed by the removal of the solid pore-forming ...

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Номер записи: 66
31-03-2022 дата публикации

Induction-Compatible Sol-Gel Coating

Номер: US20220095829A1
Автор: Berrux Aurelien
Принадлежит: SEB S.A.

The present invention relates to a sol-gel coating composition comprising conductive fillers, intended to make a culinary article compatible with induction. 1. A sol-gel coating composition comprising conductive fillers , for making a culinary article induction-compatible.2. The composition according to claim 1 , wherein the conductive fillers are ferromagnetic claim 1 , diamagnetic or paramagnetic.3. The composition according to claim 1 , wherein the conductive fillers are selected from silver claim 1 , copper claim 1 , aluminum claim 1 , iron claim 1 , nickel claim 1 , cobalt claim 1 , stainless steel claim 1 , carbon black and mixtures thereof.4. The composition according to claim 1 , wherein it comprises from 40 to 90% conductive fillers claim 1 , percentages expressed by mass based on the total mass of the sol-gel coating composition.5. The composition according to claim 1 , wherein it comprises at least one sol-gel precursor selected from metal or metalloid alkoxylate type precursors and metal or metalloid polyalkoxylate type sol-gel precursors.6. The composition according to claim 5 , wherein the sol-gel precursor is selected from tetraethoxysilane (TEOS) claim 5 , methyltriethoxysilane (MTES) claim 5 , methyltrimethoxysilane (MTMS) and mixtures thereof.7. A sol-gel coating comprising at least one layer of the sol-gel coating composition according to .8. A culinary article comprising a support coated with the sol-gel coating according to .9. The culinary article according to claim 8 , wherein said support is of inorganic material or of organic material.10. The culinary article according to claim 8 , wherein an outer face of the support of the article is coated with the sol-gel coating.11. A process for manufacturing an induction-compatible culinary article comprising the following successive steps:(i) provide a support;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, '(ii) apply to the support the sol-gel coating composition according to ;'}(iii) apply a ...

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Номер записи: 67
22-03-2018 дата публикации

HEAT INSULATION PAINT

Номер: US20180079917A1
Автор: KIYOTO Naoharu
Принадлежит:

A heat insulation paint includes fibrous conductive particles and a binder that would exhibit an average transmittance of 50% or more for far infrared rays having a wavelength of 5 μm to 25 μm when the binder is formed into a coated film having a film thickness of 2 μm, and the content of the fibrous conductive particles with respect to the total solid content is from 2% by mass to 30% by mass. 1. A heat insulation paint , comprising:fibrous conductive particles; anda binder that would exhibit an average transmittance of 50% or more for far infrared rays having a wavelength of 5 μm to 25 μm when the binder is formed into a coated film having a film thickness of 2 μm,wherein a content of the fibrous conductive particles with respect to a total solid content is from 2% by mass to 30% by mass.2. The heat insulation paint according to claim 1 , wherein the heat insulation paint would exhibit a surface electrical resistance thereof of 1000Ω/square or more when the heat insulation paint is formed into a coated film having a film thickness of 500 nm.3. The heat insulation paint according to claim 1 , wherein an average long axis length of the fibrous conductive particles is from 5 μm to 50 μm.4. The heat insulation paint according to claim 3 , wherein an average long axis length of the fibrous conductive particles is from 5 μm to 20 μm.5. The heat insulation paint according to claim 1 , wherein a content of the fibrous conductive particles is from 5% by mass to 25% by mass with respect to the total solid content.6. The heat insulation paint according to claim 1 , wherein the binder includes at least one inorganic oxide binder selected from silicon oxide claim 1 , zirconium oxide claim 1 , titanium oxide claim 1 , or aluminum oxide claim 1 , or a content of the inorganic oxide binder exceeds 50% by mass with respect to the total content of the binder contained in the heat insulation paint.7. The heat insulation paint according to claim 1 , wherein the binder includes at ...

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Номер записи: 68
22-03-2018 дата публикации

UV CURABLE INTERLAYER COMPOSITION FOR PRINTED ELECTRONICS APPLICATION

Номер: US20180079926A1
Автор: Abraham Biby Esther, CHOPRA Naveen, Chretien Michelle N., Hu Nan-Xing, SONG Guiqin
Принадлежит:

UV-curable interlayer compositions are provided. An interlayer composition may contain a polyallyl isocyanurate compound, an ester of β-mercaptopropionic acid, a monofunctional (meth)acrylate monomer having one or more cyclic groups, and a photoinitiator. Processes of using the interlayer compositions to form multilayer structures and the multilayer structures are also provided. 1. (canceled)2. (canceled)3. (canceled)4. The multilayer structure of claim 10 , wherein the interlayer composition does not include a polymeric component or an oligomeric component.5. The multilayer structure of claim 15 , wherein the one or more cyclic groups comprise cyclic alkyl groups or cyclic alkenyl groups.6. (canceled)7. The multilayer structure of claim 10 , wherein the monofunctional (meth)acrylate monomer is selected from tetrahydrofurfuryl methacrylate claim 10 , tetrahydrofurfuryl acrylate claim 10 , 3 claim 10 ,3 claim 10 ,5-trimethylcyclohexyl acrylate claim 10 , 3 claim 10 ,3 claim 10 ,5-trimethylcyclohexyl methacrylate claim 10 , and combinations thereof.8. The multilayer structure of claim 10 , wherein the polyallyl isocyanurate compound and the ester of β-mercaptopropionic acid are provided in the form of a blend claim 10 , and the composition comprises from about 30% to about 85% by weight of the blend claim 10 , from about 15% to about 70% by weight of the monofunctional (meth)acrylate monomer claim 10 , and from about 0.05% to about 10% by weight of the photoinitiator.9. The multilayer structure of claim 10 , wherein the ester of β-mercaptopropionic acid is selected from an alkyl 3-mercaptopropionate claim 10 , trimethylolpropane tris(3-mercaptopropionate) claim 10 , pentaerythritol tetrakis(3-mercaptopropionate) claim 10 , ethylene glycol bis(3-mercaptopropionate) claim 10 , dipentaerythritol hexakis(3-mercaptopropionate) claim 10 , and combinations thereof;the polyallyl isocyanurate compound is selected from 1,3,5-triallyl-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,4,6 ...

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Номер записи: 69
18-03-2021 дата публикации

Field effect-transistor, method for manufacturing same, wireless communication device using same, and product tag

Номер: US20210083214A1
Автор: Daisuke SAKII, Junji Wakita, Seiichiro Murase
Принадлежит: TORAY INDUSTRIES INC

A field-effect transistor including at least: a substrate; a source electrode; a drain electrode; a gate electrode; a semiconductor layer in contact with the source electrode and with the drain electrode; and a gate insulating layer insulating between the semiconductor layer and the gate electrode, wherein the semiconductor layer contains a carbon nanotube, and the gate insulating layer contains a polymer having inorganic particles bound thereto. Provided is a field-effect transistor and a method for producing the field-effect transistor, wherein the field-effect transistor causes decreased leak current and furthermore enables a semiconductor solution to be uniformly applied.

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Номер записи: 70
31-03-2022 дата публикации

SECURITY ELEMENT

Номер: US20220097437A1
Автор: Grigorenko Nikolay A., Richert Michelle
Принадлежит:

The present invention relates to security, or decorative elements, comprising a transparent, or translucent substrate, which may contain indicia or other visible features in or on its surface, and on at least part of the substrate surface, a first layer, comprising transition metal particles having an average diameter of from 5 nm to 500 nm and a binder, on at least part of the first layer a second layer, comprising an organic material and having a refractive index of from 1.2 to 2.3 and having a thickness of from 20 to 1000 nm, wherein the transition metal is silver, copper, gold and palladium, wherein the weight ratio of transition metal particles to binder in the first layer is in the range from 20:1 to 1:2 in case the binder is a polymeric binder, or wherein the weight ratio of transition metal particles to binder in the first layer is in the range from 5:1 to 1:15 in case the binder is an UV curable binder. The security or decorative element show a certain color in transmission and a different color in reflection and a color flop on the coating side. The color in reflection and the color flop of the security or decorative elements are controlled by adjusting the refractive index and thickness of the second layer. 1. A security , or decorative element , comprising a transparent , or translucent substrate , which may contain indicia or other visible features in or on its surface , and{'claim-text': 'having an average diameter of from 5 nm to 500 nm and a binder,', '#text': 'on at least part of the substrate surface, a first layer, comprising transition metal particles'}{'claim-text': ['having a refractive index of from 1.2 to 2.3, and', 'having a thickness of from 20 to 1000 nm, wherein the transition metal is selected from the group consisting of silver, copper, gold and palladium, wherein the weight ratio of transition metal particles to binder in the first layer is in the range from 20:1 to 1:2 in case the binder is a polymeric binder, or wherein the weight ...

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Номер записи: 71
12-03-2020 дата публикации

ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION

Номер: US20200079980A1
Автор: Hirakawa Makoto, Yamada Masashi
Принадлежит: TOAGOSEI CO., LTD.

The present invention is an adhesive composition that is characterized by containing (A) a modified polyolefin resin and (B) an epoxy compound, and is also characterized in that: the modified polyolefin resin (A) is obtained by graft modifying a polyolefin resin with use of a modifying agent that contains an α,β-unsaturated carboxylic acid or a derivative thereof; the content of the epoxy compound (B) is 1-20 parts by mass relative to 100 parts by mass of the modified polyolefin resin (A); and the epoxy compound is composed of two or more types of epoxy compounds. 1. An adhesive composition , comprising:(A) a modified polyolefin-based resin; and(B) an epoxy resin,wherein the modified polyolefin-based resin (A) is a resin in which a polyolefin resin is graft-modified with a modifier comprising an α, β-unsaturated carboxylic acid or a derivative thereof,a content of the epoxy resin (B) is in a range of from 1 to 20 parts by mass based on 100 parts by mass of the modified polyolefin-based resin (A), andthe epoxy resin (B) comprises two or more types of epoxy resins.2. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises a novolak type epoxy resin.3. The adhesive composition of claim 2 , wherein the epoxy resin (B) comprises a bisphenol A novolak type epoxy resin.4. The adhesive composition of claim 1 , wherein the epoxy resin (B) comprises an epoxy resin having an alicyclic skeleton.5. The adhesive composition of claim 1 , wherein the modified polyolefin-based resin (A) comprises a modified polypropylene resin.6. The adhesive composition of claim 1 , wherein the derivative of the α claim 1 , β-unsaturated carboxylic acid is at least one compound selected from the group consisting of an itaconic anhydride claim 1 , a maleic anhydride claim 1 , an aconitic anhydride and a citraconic anhydride.7. The adhesive composition of claim 1 , wherein a content proportion of a graft portion derived from the α claim 1 ,β-unsaturated carboxylic acid or the ...

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Номер записи: 72
23-03-2017 дата публикации

SILVER DIFFUSION BARRIER MATERIAL, SILVER DIFFUSION BARRIER, AND SEMICONDUCTOR DEVICE USING THE SAME

Номер: US20170084538A1
Автор: Chikyo Toyohiro, HORVATH Barbara, KAWAKITA Jin
Принадлежит: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

By using silicon oxynitride with an oxygen content of 4.2 to 37.5 at % as a material for a barrier layer, adhesiveness similar to that of silicon oxide and an Ag diffusion prevention property similar to that of silicon nitride can be realized. In particular, in a semiconductor device in which a plurality of silicon chips is vertically stacked by through-silicon vias, Ag is prevented from being diffused into Si and adhesiveness to Si becomes favorable when an Ag/polypyrrole complex is used as a conductive filling material used for the formation of a barrier layer provided on the inner surface of the via. 1. A silver diffusion barrier material comprising silicon oxynitride with an oxygen content ranging from 4.2 at % to 37.5 at %.2. A silver diffusion barrier comprising the silver diffusion barrier material according to .3. The silver diffusion barrier according to claim 2 , being formed on a silicon substrate.4. The silver diffusion barrier according to claim 3 , being brought into contact with a material containing silver.5. The silver diffusion barrier according to having a thickness of 10 nm or more.6. A semiconductor device in which a plurality of silicon chips is vertically stacked by through-silicon vias claim 2 , the semiconductor device comprising:{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'the silver diffusion barrier according to provided on an inner surface of the via for achieving electrical connection between the plurality of silicon chips.'}7. The semiconductor device according to claim 6 , wherein a silver/polypyrrole complex material is filled in the via provided with the silver diffusion layer. The present invention relates to a silver diffusion barrier material which prevents diffusion of silver (Ag) into silicon (Si) and a silver diffusion barrier using the material, and further relates to a semiconductor device using the barrier.As a direct consequence of Moore's law, there is a continuing demand for higher-density packaging and lower ...

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Номер записи: 73
25-03-2021 дата публикации

Recyclable Conductive Adhesive Composition for Led Packaging and Preparation Method Thereof, Recycling Method and Recycled Conductive Silver Powder

Номер: US20210087441A1
Автор: Liu Wanshuang, Luo Hebin, Wei Yi
Принадлежит:

The present invention refers to a recyclable conductive adhesive composition for LED packaging and preparation method thereof, and its recycling method and the obtained recycled conductive silver powder, wherein the recyclable conductive adhesive composition for LED packaging comprises epoxy resin, epoxy resin diluent, curing agent containing imine bond, amine curing agent, curing accelerator, wetting dispersant, coupling agent, defoamer and conductive silver powder. The epoxy curing agent containing imine bond adopted in the present invention can introduce the dynamic imine chemical bond into the epoxy resin matrix of the conductive adhesive by curing reaction, and can endow the epoxy resin matrix with degradable function by its imine bond's feature of occurring dynamic exchange reaction with amine solvent under heating condition, therefore the conductive silver powder in the conductive adhesive can be recycled and reused. 2. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the epoxy resin diluent is one selected from ethylene glycol diglycidyl ether claim 1 , butanediol diglycidyl ether and neopentyl glycol diglycidyl ether.3. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the polyether amine curing agent is at least one selected from D-205 claim 1 , D-230 and D-400 claim 1 , and the alicyclic amine curing agent is at least one selected from isophorone diamine claim 1 , 1 claim 1 ,3-bis(aminomethyl)cyclohexane claim 1 , 1-methyl-2 claim 1 ,4-cyclohexanediamine and 4 claim 1 ,4′-diaminodicyclohexylmethane.4. The recyclable conductive adhesive composition for LED packaging of claim 1 , characterized in that claim 1 , the curing accelerator is one selected from 2-ethyl-4-methylimidazole claim 1 , 1-benzyl-2-methylimidazole claim 1 , 1-cyanoethyl-2-ethyl-4-methylimidazole and DMP-30.5. The recyclable conductive adhesive composition for LED ...

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Номер записи: 74
12-03-2020 дата публикации

ELASTIC CONDUCTOR, PASTE FOR FORMING ELASTIC CONDUCTOR, AND METHOD FOR PRODUCING ELASTIC CONDUCTOR

Номер: US20200082957A1
Автор: Inoue Daishi, Matsuhisa Naoji, SOMEYA Takao
Принадлежит: JAPAN SCIENCE AND TECHNOLOGY AGENCY

The invention provides an elastic conductor which is excellent in stretchability and hardly causes a decrease in conductivity even when stretched. The elastic conductor includes an elastomer and two types of conductive particles, wherein the two types of conductive particles are flake-like particles and nanoparticles, and the conductive particles are dispersed throughout the elastomer. 1. An elastic conductor comprising:an elastomer,two types of conductive particles,wherein the two types of conductive particles are flake-like particles and nanoparticles, andthe nanoparticles are dispersed throughout the elastomer.2. The elastic conductor according to claim 1 ,wherein the conductive particles are dispersed throughout the elastomer.3. The elastic conductor according to claim 1 ,wherein the elastomer is a fluororubber.4. The elastic conductor according to claim 1 ,wherein the flake-like particles have a particle diameter of 0.2 to 50 μm, andthe nanoparticles have a particle diameter of 0.5 to 100 nm.5. The elastic conductor according to claim 1 ,wherein an aspect ratio (a ratio of a long axis to a thickness) of the flake-like particles is 2 to 100.6. The elastic conductor according to claim 1 ,wherein a mass composition ratio of the elastomer is 10% to 50% by mass with respect to the elastic conductor, anda mass composition ratio of the conductive particles is 50% to 90% by mass with respect to the elastic conductor.7. The elastic conductor according to claim 1 ,further comprising a surfactant.8. The elastic conductor according to claim 7 ,wherein the surfactant is a fluorosurfactant.9. The elastic conductor according to claim 1 ,wherein the elastic conductor has an electrical conductivity of 200 S/cm or more.10. A paste for forming an elastic conductor claim 1 , comprising:an elastomer,at least two types of conductive particles, andan organic solvent,wherein the two types of conductive particles are flake-like particles and nanoparticles.11. The paste for forming an ...

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Номер записи: 75
29-03-2018 дата публикации

ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL

Номер: US20180086950A1
Автор: KUNIMUNE Teppei, KURAMOTO Masafumi
Принадлежит: NICHIA CORPORATION

Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R—O— wherein Ris a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive. 3. The electrically conductive adhesive according to claim 2 , wherein the hydrolyzable group in the polyether polymer (A) is at least one group selected from a hydride group claim 2 , an alkoxy group claim 2 , a halogen group claim 2 , an acyloxy group claim 2 , a ketoxymate group claim 2 , an aminoxy group claim 2 , an amide group claim 2 , an amino group and a mercapto group.4. The electrically conductive adhesive according to claim 1 , which further comprises particles of another metal which is at least one selected from gold claim 1 , copper claim 1 , platinum claim 1 , palladium claim 1 , rhodium claim 1 , ruthenium claim 1 , iridium and osmium.5. The electrically conductive adhesive according to claim 1 , wherein the amount of particles of the other metal is at most 30% by weight claim 1 , based the total of the silver particles (B) and the other metal particles.6. The electrically conductive adhesive according to claim 1 , wherein the silver particles (B) are flake-shaped particles.7. The electrically conductive adhesive according to claim 1 , wherein the average particle diameter (median diameter) of the silver particles (B) is from 0.3 micrometers to 5 micrometers.8. The electrically conductive adhesive according to claim 1 , wherein the silver particles (B) are sintered after the hardening of the adhesive.9. The electrically conductive adhesive according to claim 1 , wherein the content of the silver particles (B) is 70% to 99% by weight claim 1 , based on the electrically conductive adhesive.10. The electrically conductive adhesive according ...

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Номер записи: 76
30-03-2017 дата публикации

SILVER NANOPLATE COMPOSITIONS AND METHODS

Номер: US20170087183A1
Автор: Harris Todd J., Miranda Martin, Oldenburg Steven J., Sebba David S.
Принадлежит:

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density. 1adding a stabilizing agent to a pre-concentrated solution,wherein the pre-concentrated solution comprises silver nanoplates,wherein each of the silver nanoplates has a plate shape,wherein the pre-concentrated solution has a peak optical density at a first wavelength;wherein the stabilizing agent comprises a polyvinyl based polymer and a borate; andincreasing a concentration of the silver nanoplates in the pre-concentrated solution to generate a concentrated solution,wherein the concentrated solution has a peak optical density at a second wavelength,wherein the peak optical density of the concentrated solution is greater than the peak optical density of the pre-concentrated solution, andwherein at least a portion of the silver nanoplates in the pre-concentrated solution retain the plate shape in the concentrated solution.. A process for making concentrated silver nanoplates that preserve shape post-concentration while increasing optical density, the process comprising: This application is a continuation of U.S. application Ser. No. 14/947,508, filed Nov. 20, 2015 and issued as U.S. Pat. No. 9,526,745, which is a continuation of U.S. application Ser. No. 14/681,379, filed Apr. 8, 2015 and issued as U.S. Pat. No. 9,212,294, which is a continuation of ...

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Номер записи: 77
21-03-2019 дата публикации

DEVELOPMENT OF A SOL-GEL ANTICORROSION TREATMENT

Номер: US20190085175A1
Автор: CAMBON Jean-Baptiste, ESTEBAN Julien, MAFOUANA Roland Rodrigue, RUETSCH Jean-Philippe
Принадлежит:

The invention relates to a process for treating a metal alloy part, characterized in that it comprises the following steps: —producing a stock formulation by mixing, in equal molar parts of silicon, an alcoholic solution of hydrolysed epoxysilane and an alcoholic solution of hydrolysed aminosilane, —mixing the stock formulation with a suspension comprising conductive nanowires in an amount by weight of between 0.1% and 10% relative to the total weight of the stock formulation in order to obtain a dilute formulation, and —depositing the dilute formulation on the part in order to obtain the coating. 1. A treatment process for a metal alloy part comprising the following steps:produce a stock formulation by mixing, in equal molar parts of silicon, an alcoholic solution of hydrolyzed epoxysilane and an alcoholic solution of hydrolyzed aminosilane,mix the stock formulation with a suspension comprising conductive nanowires in an amount by weight between 0.1% and 10% based on the total weight of the stock formulation to obtain a dilute formulation, anddeposit the dilute formulation on the part to obtain the coating.2. The process according to claim 1 , wherein the conductive nanowires comprise silver nanowires claim 1 , carbon nanowires and/or copper nanowires.3. The process according to claim 1 , wherein the conductive nanowires comprise silver nanowires claim 1 , the suspension of silver nanowires being produced by centrifugation of a suspension of nanowires and silver particles at a speed between 2000 and 6000 revolutions per minute.4. The process according to claim 3 , wherein the suspension of silver nanowires is obtained in accordance with the following sub-steps:dissolve polyvinyl pyrrolidone in ethylene glycol to obtain a solution,heat the solution thus obtained to a temperature between 100° C. and 160° C., andafter temperature stabilization, add a solution of sodium chloride and iron(II) acetylacetonate, then add a solution of silver nitrate in ethylene glycol.5. ...

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Номер записи: 78
21-03-2019 дата публикации

ELECTRICALLY CONDUCTIVE, HOT-MELT ADHESIVE OR MOULDING COMPOSITION

Номер: US20190085219A1
Автор: Briers David, CAI Jeffrey, Chapman Anthony, Dreezen Gunther, Poole Callum, Starkey Dale R.
Принадлежит:

The present invention is related to an electrically conductive, hot-melt adhesive or molding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide, copolyamide, polyolefins, poly(meth)acrylates, polystyrene, polyurethanes, polyesters, ethylene copolymers, ethylene vinyl copolymers, styrenic block copolymers, polylactic acid, silicones, epoxies and polyols; and, b) a conductive filler comprising particles (p1) which have a mass median diameter (D50) of ≤100 microns and which are selected from the group consisting of flakes, platelets, leaf-like particles, dendritic particles, rods, tubes, fibres, needles and mixtures thereof, wherein said composition has a melt viscosity of from 2500 to 25000 mPa·s as measured at 210° C. and is further characterized in that said particles (p1) constitute from 15 to 70 wt. %, by weight of the composition. Preferably, the binding agent comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide and copolyamide. 2. The composition according to claim 1 , wherein the binding agent comprises at least one (co)polymer selected from the group consisting of polyamide claim 1 , thermoplastic polyamide and copolyamide.3. The composition according to claim 2 , wherein the binding agent comprises from 80 to 100 wt. % claim 2 , by weight of the binding agent claim 2 , of at least one (co)polymer selected from the group consisting of polyamide claim 2 , thermoplastic polyamide or copolyamide.4. The composition according to claim 1 , wherein said polyamide claim 1 , thermoplastic polyamide or copolyamide is characterized by a softening point in the range from 130° C. to 200° C.5. The composition according to claim 1 , wherein said polyamide claim 1 , thermoplastic polyamide or copolyamide is characterized by a melt viscosity of from 1000 to 10000 mPa·s.6. The composition according to ...

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Номер записи: 79
30-03-2017 дата публикации

SLIDING RESIN COMPOSITION, AND SLIDING MEMBER

Номер: US20170088791A1
Автор: KOBAYAKAWA Hiroki, YASUDA Erina
Принадлежит:

A resin composition for use in a sliding member, which has higher seizing resistance while maintaining abrasion resistance. The sliding resin composition includes: a resin binder; a solid lubricant; and a protecting and reinforcing agent that is harder and brittler than the resin binder. As the protecting and reinforcing agent, aggregates of particles harder than the resin binder are used. The amount of the protecting and reinforcing agent contained is 1 vol. % or more but 20 vol. % or less of the entire sliding resin composition. The particles harder than the resin binder have an average particle diameter of 10 nm or more but 100 nm or less that is smaller than that of the solid lubricant. 1. A sliding resin composition comprising:a resin binder;a solid lubricant; anda protecting and reinforcing agent that is harder and brittler than the resin binder.2. The sliding resin composition according to claim 1 , wherein the resin binder claim 1 , the solid lubricant claim 1 , and the protecting and reinforcing agent have the following relationship in terms of threshold stress:{'br': None, 'solid lubricant≦protecting and reinforcing agent Подробнее

Номер записи: 80
30-03-2017 дата публикации

SLIDING RESIN COMPOSITION, AND SLIDING MEMBER

Номер: US20170088792A1
Автор: KOBAYAKAWA Hiroki, YASUDA Erina
Принадлежит:

A resin composition used for a sliding member to improve seizing resistance. The sliding resin composition includes: a resin binder; a solid lubricant; and aggregates of particles. A coupling force between the particles in the aggregates is smaller than a threshold stress of the resin binder so that the aggregates exposed at a surface of the resin binder are partially detached with a force smaller than the threshold stress of the resin binder. The aggregates of the particles harder than the resin binder are used as a protecting and reinforcing agent, and the amount of the particles contained in the sliding resin composition is 1 vol. % or more but 20 vol. % or less of the entire sliding resin composition. The particles harder than the resin binder have an average particle diameter of between 10 nm and 100 nm that is smaller than that of the solid lubricant. 1. A sliding resin composition comprising: a resin binder; a solid lubricant; and a protecting and reinforcing agent , whereinthe protecting and reinforcing agent comprises aggregates of particles, and whereina coupling force between the particles in the aggregates is smaller than a threshold stress of the resin binder so that the aggregates exposed at a surface of the resin binder are partially detached with a force smaller than the threshold stress of the resin binder.2. The sliding resin composition according to claim 1 , wherein the particles are harder than the resin binder.3. The sliding resin composition according to claim 1 , wherein the resin binder claim 1 , the solid lubricant claim 1 , and the aggregates have the following relationship in terms of threshold stress:solid lubricant≦aggregates Подробнее

Номер записи: 81
05-05-2022 дата публикации

TRANSPARENT CONDUCTIVE FILM, AND TOUCH PANEL INCLUDING SAME

Номер: US20220139591A1
Автор: TOBA Masahiko, Yamaki Shigeru, YONEDA Shuhei
Принадлежит: SHOWA DENKO K.K.

Provided is a transparent conductive film having a preferable optical property and an electric property, and in addition, a superior durability of folding. A transparent conductive film comprising: a transparent substrate, a transparent conductive layer having a binder resin and conductive fibers and formed on at least one of the main faces of the transparent substrate, and a protective layer formed on the transparent conductive layer, wherein the protective layer is a cured layer of a curable resin composite and has a thickness of more than 100 nm and 1 μm or less.

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Номер записи: 82
05-05-2022 дата публикации

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

Номер: US20220139864A1
Автор: Hidemichi Fujiwara, Norzafriza Nitta, Yoshihiro Sato
Принадлежит: Furukawa Electric Co Ltd

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

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Номер записи: 83
19-03-2020 дата публикации

EPOXY STABILIZATION USING METAL NANOPARTICLES AND NITROGEN-CONTAINING CATALYSTS, AND METHODS

Номер: US20200087447A1
Автор: Joly Guy D., Lin Ying, Sahouani Hassan
Принадлежит:

The present disclosure provides a curable, one-part epoxy/thiol resin composition. The composition comprises an epoxy/thiol resin mixture including: an epoxy resin component including an epoxy resin having at least two epoxide groups per molecule, a thiol component including a polythiol compound having at least two primary thiol groups, and a nitrogen-containing catalyst for the epoxy resin. The epoxy/thiol resin mixture further includes metal nanoparticles (e.g., silver nanoparticles, copper nanoparticles, or both), dispersed in the epoxy/thiol resin mixture. The present disclosure provides a method of curing a curable, one-part epoxy/thiol resin composition, including providing a curable, one-part epoxy/thiol resin composition and heating the composition to a temperature of at least 50° C. 1. A curable , one-part epoxy/thiol resin composition comprising: an epoxy resin component comprising an epoxy resin having at least two epoxide groups per molecule;', 'a thiol component comprising a polythiol compound having at least two primary thiol groups; and', 'a nitrogen-containing catalyst for the epoxy resin; and, 'an epoxy/thiol resin mixture comprisingsilver nanoparticles, copper nanoparticles, or both, dispersed in the epoxy/thiol resin mixture.2. The curable claim 1 , one-part epoxy/thiol resin composition of which is curable at a temperature of at least 50° C.3. The curable claim 1 , one-part epoxy/thiol resin composition of wherein the epoxy resin comprises a polyglycidyl ether of a polyhydric phenol claim 1 , a reaction product of a polyhydric alcohol with epichlorohydrin claim 1 , an epoxidised (poly)olefinic resin claim 1 , an epoxidised phenolic novolac resin claim 1 , an epoxidised cresol novolac resin claim 1 , a cycloaliphatic epoxy resin claim 1 , a glycidyl ether ester claim 1 , a polyglycidyl ester claim 1 , a urethane modified epoxy resin claim 1 , or a combination of two or more thereof.4. The curable claim 1 , one-part epoxy/thiol resin composition of ...

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Номер записи: 84
01-04-2021 дата публикации

Composite material and method of manufacturing the same

Номер: US20210095100A1
Автор: Ming-Chih Tsai, Yu-Hsuan Ho
Принадлежит: Winbond Electronics Corp

A composite material including a nanocellulose core and a metal shell is provided. The metal shell covers a surface of the nanocellulose core. The composite material is nanosized and has high mechanical strength. Additionally, a method of manufacturing the composite material is also provided.

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Номер записи: 85
05-04-2018 дата публикации

THERMAL INTERFACE MATERIALS WITH LOW SECANT MODULUS OF ELASTICITY AND HIGH THERMAL CONDUCTIVITY

Номер: US20180094183A1
Автор: BRUZDA Karen, CANCAR Kathryn
Принадлежит:

Disclosed are exemplary embodiments of thermal interface materials with low secant modulus of elasticity and high thermal conductivity. 1. A thermal interface material comprising a matrix or base resin loaded with thermally-conductive filler , wherein the thermal interface material has a thermal conductivity of at least 6 Watts per meter per Kelvin and a secant modulus of elasticity of no more than 620 kilopascals (kPa) at 50% strain for 1.5 millimeter (mm) initial thickness material.2. The thermal interface material of claim 1 , wherein:the matrix or base resin is loaded with the thermally-conductive filler such that the thermal interface material includes at least 90 weight % of the thermally-conductive filler; and a polydimethylsiloxane (PDMS); or', 'silicone polymer with platinum catalyst and silicone polymer with SiH crosslinking oligomer; or', 'a process oil., 'the matrix or base resin comprises3. The thermal interface material of claim 1 , wherein the thermally-conductive filler comprises alumina.4. The thermal interface material of claim 1 , wherein:the matrix or base resin is loaded with the thermally-conductive filler such that the thermal interface material includes at least 80 weight % of the thermally-conductive filler; and a polydimethylsiloxane (PDMS); or', 'silicone polymer with platinum catalyst and silicone polymer with SiH crosslinking oligomer; or', 'a process oil., 'the matrix or base resin comprises5. The thermal interface material of claim 4 , wherein:the matrix or base resin is loaded with the thermally-conductive filler such that the thermal interface material includes at least 90 weight % of the thermally-conductive filler; andthe thermally-conductive filler comprises one or more of alumina, aluminum, zinc oxide, boron nitride, silicon nitride, aluminum nitride, iron, metallic oxides, graphite, silver, copper, and ceramic.6. The thermal interface material of claim 1 , wherein:the matrix or base resin is loaded with the thermally-conductive ...

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Номер записи: 86
12-05-2022 дата публикации

Thermoplastic polymer composition for micro 3d printing and uses thereof

Номер: US20220145059A1
Автор: Milica Radisic, Qinghua Wu, Yimu Zhao
Принадлежит: Individual

A composition for extrusion and deposition by a three-dimensional (3D) printer is provided. The composition comprises a thermoplastic elastomer (TPE), particulate matter having particles in the range of about 5 nm to about 10 μm in diameter, and a solvent. Uses of the composition for 3D printing microstructures, including multiwall plate devices, are also provided.

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Номер записи: 87
28-03-2019 дата публикации

Method of making silver-containing dispersions with nitrogenous bases

Номер: US20190092907A1
Автор: Deepak Shukla, Kevin Donovan
Принадлежит: Eastman Kodak Co

A method is used to prepare silver nanoparticle cellulosic polymer composites. A cellulosic polymer, reducible silver ions in an amount of a weight ratio to the cellulosic polymer of 5:1 to 50:1, and an organic solvent are mixed. Each organic solvent has a boiling point at atmospheric pressure of 100° C. to 500° C. The Hansen parameter (δ T Polymer ) of the cellulosic polymer is less than or equal to the Hansen parameter (δ T Solvent ) of the organic solvent. The resulting premix solution is heated to at least 75° C., and a (d) nitrogenous base is added to provide a concentration of the nitrogenous base in an equimolar amount or in molar excess in relation to the amount of reducible silver ions, thereby forming a silver nanoparticle cellulosic polymer composite. After cooling, the silver nanoparticle cellulosic polymer composite is isolated and re-dispersed in an organic solvent to provide a non-aqueous silver-containing dispersion.

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Номер записи: 88
28-03-2019 дата публикации

SILVER-CONTAINING NON-AQUEOUS COMPOSITION CONTAINING CELLULOSIC POLYMERS

Номер: US20190092923A1
Автор: Donovan Kevin M., Shukla Deepak
Принадлежит:

A non-aqueous silver precursor composition is composed of (a) one or more cellulosic polymers; (b) reducible silver ions that are present at a weight ratio to the one or more cellulosic polymers of 5:1 to 50:1; (c) an organic solvent that has a boiling point at atmospheric pressure of at least 100° C. and up to but less than 500° C.; and (d) a nitrogenous base having a pKa in acetonitrile of at least 15 and up to and including 25 at 25° C. The Hansen parameter (δ) of each cellulosic polymer is less than or equal to the Hansen parameter (δ) each organic solvent. In addition, the (d) nitrogenous base is present in an equimolar amount or molar excess in relation to the amount of (b) reducible silver ions. 1. A non-aqueous silver precursor composition consisting essentially of:(a) one or more polymers selected from one or more of cellulose acetate, cellulose acetate phthalate, cellulose acetate butyrate, cellulose acetate propionate, cellulose acetate trimellitate, hydroxypropylmethyl cellulose phthalate, methyl cellulose, ethyl cellulose, hydroxyethyl cellulose, hydroxypropylmethyl cellulose, and carboxymethyl cellulose;(b) reducible silver ions that are present at a weight ratio to the one or more (a) polymers of at least 5:1 and up to and including 50:1;{'sub': T', 'T, 'sup': Polymer', 'Solvent, '(c) one or more organic solvents, each of which has a boiling point at atmospheric pressure of at least 100° C. and up to but less than 500° C., wherein the Hansen parameter (δ) of each of the one or more polymers is less than or equal to the Hansen parameter (δ) of each of the one or more organic solvents; and'}(d) a nitrogenous base having a pKa in acetonitrile of at least 15 and up to and including 25 at 25° C., the (d) nitrogenous base being present in an equimolar amount or molar excess in relation to the amount of (b) reducible silver ions.2. The non-aqueous silver precursor composition of claim 1 , wherein the (b) reducible silver ions are present at a weight ratio to ...

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Номер записи: 89
28-03-2019 дата публикации

COMPOSITE THERMAL INTERFACE MATERIALS, THERMAL INTERFACE COMPONENTS, AND METHODS FOR MAKING THE SAME

Номер: US20190092994A1
Автор: Gwin Paul
Принадлежит: Intel Corporation

Technologies for facilitating the transfer of heat from a first location to a second location. In embodiments, the technologies include composite thermal interface materials, thermal interface components, and methods for making such composites and components. The thermal interface materials may include a core including a first b-stage matrix and first thermally conductive particles, and a skinning layer including a second b-stage matrix and second thermally conductive particles. The thermal interface components may be formed from or include the composite thermal interface material, and may include one or more convex surfaces. 2. The composite thermal interface material of claim 1 , wherein:the first b-stage polymer is a first b-stage epoxy; andthe second b-stage polymer is a second b-stage epoxy that is same or different from the first b-stage epoxy.3. The composite thermal interface material of claim 1 , further comprising a second skinning layer comprising a third b-stage polymer and third thermally conductive particles claim 1 , wherein:the core is in the form of a layer;the first skinning layer is on the first surface of the core layer;the second skinning layer is on the second surface of the core layer;the second b-stage polymer is compositionally the same as or different from the third b-stage polymer; andthe second thermally conductive particles are compositionally the same as or different from the third thermally conductive particles.4. The composite thermal interface material of claim 3 , wherein the third thermally conductive particles have a third average particle size that is smaller than the first average particle size.5. The composite thermal interface material of claim 3 , wherein:the first b-stage polymer is a first b-stage epoxy;the second b-stage polymer is a second b-stage epoxy;the third b-stage polymer is a third b-stage epoxy; andthe first, second, and third b-stage epoxies are the same as or different from one another.6. The composite thermal ...

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Номер записи: 90
12-05-2022 дата публикации

SENSOR

Номер: US20220146342A1
Автор: LIU Wing Chung, WATT Andrew
Принадлежит:

The invention relates to a force sensor which comprises a sensor material which comprises a plurality of metal nanowires dispersed within a matrix; and a measurement device configured to measure an electrical property of the sensor material, wherein the electrical property is one which changes in response to the application of a force to the sensor material. 1. A force sensor which comprises a sensor material which comprises a plurality of metal nanowires dispersed within a matrix; and a measurement device configured to measure an electrical property of the sensor material , wherein the electrical property is one which changes in response to application of a force to the sensor material.2. A force sensor according to wherein the electrical property is one which changes in response to an internal stress in the sensor material caused by application of a force to the sensor material.3. The force sensor according to or wherein the electrical property is resistance or capacitance.4. The force sensor according to any one of to wherein the electrical property is resistance and the force is a compressive force.5. The force sensor according to any one of to wherein the electrical property is resistance and the internal stress in the sensor material is tensile stress caused by application of the force to the sensor material.6. The force sensor according to any one of the preceding claims wherein the electrical property is capacitance and the force is a compressive force.7. The force sensor according to any one of the preceding claims wherein the sensor material is not transparent.8. The force sensor according to any preceding claim further comprising a first electrical connector and a second electrical connector claim 1 , wherein the first and second electrical connectors form an electrical connection between the sensor material and the measurement device claim 1 , optionally wherein the first and second electrical connectors are connected to two opposing regions of the ...

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Номер записи: 91
06-04-2017 дата публикации

Thermal conductive silicone composition and semiconductor device

Номер: US20170096591A1
Автор: Kenichi Tsuji, Kunihiro Yamada, Shota Akiba
Принадлежит: Shin Etsu Chemical Co Ltd

Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains: (A) an organopolysiloxane that exhibits a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C., and is represented by the following average composition formula (1) R 1 a SiO (4-a)/2   (1) wherein R 1 represents a hydrogen atom or at least one group selected from a hydroxy group and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms, and a satisfies 1.8≦a≦2.2; and (B) a silver powder having a tap density of not lower than 3.0 g/cm 3 and a specific surface area of not larger than 2.0 m 2 /g, such silver powder being in an amount of 300 to 11,000 parts by mass with respect to 100 parts by mass of the component (A).

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Номер записи: 92
14-04-2016 дата публикации

SECURITY ELEMENTS AND METHOD FOR THEIR MANUFACTURE

Номер: US20160101642A1
Автор: Grigorenko Nikolay A., Richert Michelle, SEEGER Oliver
Принадлежит:

The present invention relates to complex security elements based on liquid crystal coatings which are subsequently coated with specific metallic nano-shaped metal particles, a method for their manufacture, in particular on a glass, paper or on a plastic substrate and a security product obtainable using the security element. The security element may contain additionally an embossed surface relief microstructure, especially an optically variable image (an optically variable device, OVD), such as a hologram. A further aspect of the invention is the use of such a security element for the prevention of counterfeit or reproduction of a document of value. 1. A security element comprising:a) a substrate with a surface side and a reverse side,b) a coating on at least a portion of the substrate, the coating including at least one liquid crystal compound, wherein the coating is applied on the reverse side of the substrate if the substrate is transparent or translucent, or on the surface side if the substrate is transparent, translucent, reflective or opaque and; 'the another coating comprising platelet shaped transition metal particles having a longest dimension of edge length of from 5 nm to 1000 nm, and a thickness of from 2 nm to 100 nm.', 'c) another coating on at least a portion of the coating that includes the liquid crystal compound, or on the surface side of the substrate if the coating that includes the liquid crystal compound is placed on the reverse side of the substrate,'}2. A security element according to claim 1 , wherein the substrate istransparent, translucent, reflective or opaque,the coating is applied to the surface side of the substrate, andthe another coating is applied on at least a portion of the coating containing the liquid crystal compound, the further coating having a longest dimension of edge length of from from 5 nm to 600 nm, and a thickness of from 2 to 40 nm.3. The security element according to further comprising an embossed surface relief ...

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Номер записи: 93
26-03-2020 дата публикации

CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION

Номер: US20200095370A1
Автор: Adachi Daisuke, Kanematsu Masanori, Tamai Hitoshi
Принадлежит: KANEKA CORPORATION

A conductive paste composition includes 1 to 10 parts by weight of a binder (A), 2 to 20 parts by weight of an epoxy monomer (B), 1 to 20 parts by weight of a crosslinking agent (C), and 70 to 95 parts by weight of a conductive filler (D). The binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and including a plurality of oxirane rings as an organic group. The epoxy monomer (B) includes an oxirane ring. The total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight. 1. A conductive paste composition comprising:1 to 10 parts by weight of a binder (A);2 to 20 parts by weight of an epoxy monomer (B);1 to 20 parts by weight of a crosslinking agent (C); and70 to 95 parts by weight of a conductive filler (D),wherein the binder (A) is a reactive oligomer having a siloxane bond as a main skeleton and comprising a plurality of oxirane rings as an organic group,wherein the epoxy monomer (B) comprises an oxirane ring, andwherein the total amount of the binder (A), the epoxy monomer (B), the crosslinking agent (C), and the conductive filler (D) is 100 parts by weight.2. The conductive paste composition according to claim 1 , wherein the epoxy monomer (B) comprises at least one selected from the group consisting of a bifunctional monomer having a glycol structure and a monofunctional monomer having an aliphatic structure.3. The conductive paste composition according to claim 1 , wherein the crosslinking agent (C) is a compound having a heat latent property.4. The conductive paste composition according to claim 1 , wherein the crosslinking agent (C) contains at least one selected from the group consisting of an imidazole compound claim 1 , a hydrazine compound claim 1 , and an acid anhydride.5. The conductive paste composition according to claim 1 , further comprising a dehydrating agent (E).6. The conductive paste composition according to claim 5 , wherein the dehydrating agent ...

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Номер записи: 94
26-03-2020 дата публикации

Water-Containing Hydrogel Composition Comprising Elemental Silver Particles

Номер: US20200095421A1
Автор: KETTEL Markus
Принадлежит: Paul Hartmann AG

The invention relates to a water-containing hydrogel composition comprising elemental silver particles and to a multi-layered wound dressing comprising the hydrogel composition. The multi-layered wound dressing is used especially in the inflammation and/or granulation phases in the treatment of, for example, burns and/or chronic wounds. In addition, the invention relates to a process for preparing the hydrogel composition. 1. A water-containing hydrogel composition comprising elemental silver particles with an average particle diameter of 5-20 nm , determined by transmission electron microscopy (TEM) , and a particle size distribution of D90≤25 nm , determined by laser diffractometry , wherein the silver content , based on the total weight of the hydrogel composition , is between 15 and 500 ppm.2. The water-containing hydrogel composition as claimed in claim 1 , wherein the average particle diameter is 9-18 nm.3. The water-containing hydrogel composition as claimed in claim 1 , wherein the silver content claim 1 , based on the total weight of the hydrogel composition claim 1 , is between 25 and 250 ppm.4. The water-containing hydrogel composition as claimed in claim 1 , wherein the hydrogel composition comprises a hydrophilic polyurethane foam.5. The water-containing hydrogel composition as claimed in claim 1 , wherein the hydrogel composition comprises a polyurethane-polyurea copolymer.6. The water-containing hydrogel composition as claimed in claim 1 , wherein the hydrogel composition further comprises a non-ionic surfactant.7. The water-containing hydrogel composition as claimed in claim 6 , wherein the surfactant is selected from Tween 20 claim 6 , polyethylene glycol claim 6 , sorbitol and polyvinyl pyrrolidone claim 6 , or mixtures thereof.8. The water-containing hydrogel composition as claimed in claim 1 , further comprising 5 to 30% by weight claim 1 , based on the total weight of the hydrogel composition claim 1 , of a polyhydric alcohol selected from ...

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Номер записи: 95
21-04-2016 дата публикации

Composite Materials

Номер: US20160107739A1
Автор: Frulloni Emiliano, Lenzi Fiorenzo, Restuccia Carmelo Luca
Принадлежит: CYTEC TECHNOLOGY CORP.

A composite material that includes a layer of reinforcing fibres impregnated with a curable resin matrix and a plurality of electrically conductive composite particles positioned adjacent or in proximity to the reinforcing fibres. Each of the electrically conductive composite particles is composed of a conductive component and a polymeric component, wherein the polymeric component includes one or more polymers that are initially in a solid phase and are substantially insoluble in the curable resin, but is able to undergo at least partial phase transition to a fluid phase during a curing cycle of the composite material. 1. A curable composite material comprising:i) at least one structural layer of reinforcing fibres impregnated with a curable resin matrix; andii) at least one electrically conductive composite particle adjacent or in proximity to said reinforcing fibres, said conductive composite particle comprising a conductive component and a polymeric component, wherein the polymeric component of the conductive composite particle comprises one or more polymers that are initially in a solid phase and substantially insoluble in the curable resin matrix prior to curing of the composite material, but is able to undergo at least partial phase transition to a fluid phase by dissolving in the resin matrix during a curing cycle of the composite material.2. The composite material of claim 1 , wherein said curable resin matrix is a thermoset composition in which at least 50% of the polymeric component of the conductive composite particle is soluble in the resin matrix during curing of the composite material claim 1 , and wherein the phase transition to the fluid phase occurs by dissolution of the polymeric component in the resin matrix.3. The composite material of claim 1 , wherein the conductive component of each electrically conductive composite particle comprises one or more conductive materials having an electrical conductivity greater than 1×10S/M.4. The composite ...

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Номер записи: 96
12-04-2018 дата публикации

CONNECTING A FLEXIBLE CIRCUIT TO OTHER STRUCTURES

Номер: US20180103544A1
Автор: Dickey Michael David, Fassler Andrew L., HOLBERY James David, MA SIYUAN
Принадлежит: Microsoft Technology Licensing, LLC

One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species. 1. A device , comprising:a circuit structure comprising a conductive path enclosed in an encapsulant;a polymer circuit support comprising a polymer having a functional species available for a condensation reaction; anda cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.2. The device of claim 1 , wherein the encapsulant is a siloxane-based encapsulant claim 1 , and wherein the cross-linking agent comprises a siloxane functional group covalently linked to the siloxane-based encapsulant and a second functional group covalently linked to the siloxane functional group and the functional species of the polymer circuit support.3. The device of claim 2 , wherein the conductive path comprises one or more of liquid metal and a polymer embedded with conductive particulate material claim 2 , wherein the siloxane functional group comprises one or more of polydimethylsiloxane claim 2 , polydimethylsiloxane claim 2 , and polydimethylsiloxane claim 2 , wherein the second functional group comprises one or more of an amine claim 2 , a sulfide claim 2 , and a phosphide claim 2 , and wherein the polymer circuit support comprises one or more of polycarbonate claim 2 , polyethylene terephthalate claim 2 , polyvinyl chloride claim 2 , and polyimide.4. The device of claim 1 , further comprising an electrical coupling between the conductive path of the circuit structure and a circuit element on the polymer circuit support.5. The device of claim 4 , wherein the electrical coupling comprises aligned magnetic particles embedded in the encapsulant.6. The device of claim 4 , wherein the ...

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Номер записи: 97
08-04-2021 дата публикации

CONDUCTIVE COMPOSITION AND METHOD FOR FABRICATING MICRO LIGHT-EMITTING DIODE DISPLAY

Номер: US20210104339A1
Автор: CHIOU Kuo-Chan, HO Shou-Yi, Lin Hsien-Kuang, Liu Yen-Chun
Принадлежит: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

A conductive composition and a method for fabricating a micro light-emitting diode (LED) display are provided. The conductive composition includes 5-90 parts by weight of monomer, 10-95 parts by weight of epoxy resin, and 50-150 parts by weight of conductive powder. The total weight of the monomer and the epoxy resin is 100 parts by weight. The monomer has n reactive functional groups, wherein n is 1, 2, 3 or 4. The monomer has a molecular weight equal to or less than 350. The epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq. Furthermore, there is a specific relationship among the weight of monomer, the number of reactive functional groups, the molecular weight of monomer, the weight of epoxy resin, and the epoxy equivalent weight of epoxy resin. 1. A conductive composition , comprising:{'b': 1', '1, 'a monomer, wherein the monomer has a weight (W) of 5 to 90 parts by weight, wherein the monomer has n reactive functional groups, and n is 1, 2, 3, or 4, wherein the monomer has a molecular weight Mw equal to or less than 350;'}{'b': 2', '1', '2', '1', '1', '2, 'claim-text': {'br': None, 'sup': '2', 'i': n', 'W', 'W', 'W, '16.90≤Ln[(EEW)×(Mw1/)×(2/(1+2)]≤18.90; and'}, 'an epoxy resin, wherein the epoxy resin has a weight W of 10 to 95 parts by weight, wherein the epoxy resin has an epoxy equivalent weight (EEW) from 160 g/Eq to 3500 g/Eq, and in particular, the total weight (W+W) of the monomer and the epoxy resin is 100 parts by weight, wherein the weight W, the number n, the molecular weight Mw, the weight W, and the epoxy equivalent weight (EEW) satisfy the following relationship50 to 150 parts by weight of conductive powder.2. The conductive composition as claimed in claim 1 , wherein the reactive functional group of the monomer is oxiranyl group claim 1 , cyclohexene oxide group claim 1 , oxetanyl group claim 1 , vinyloxy group claim 1 , allyloxy group claim 1 , acrylate group claim 1 , or methacrylate group.3. The conductive composition ...

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Номер записи: 98
21-04-2016 дата публикации

SILVER NANOPARTICLE INKS COMPRISING AMINOMETHYLSILANES

Номер: US20160108271A1
Автор: Abraham Biby Esther, GAGNON Yvan, Liu Ping, SONG Guiqin, Wu Yiliang
Принадлежит:

An ink includes a plurality of silver nanoparticles, an aminomethylsilane viscosifier, and a hydrocarbon solvent. A method includes providing an ink including a plurality of silver nanoparticles, an aminomethylsilane viscosifier, and a hydrocarbon solvent, the method including printing an image on a substrate with the ink, and annealing the image on the substrate. An ink includes organoamine-stabilized silver nanoparticles, a viscosifier comprising N-(6-aminohexyl)aminomethyltriethoxysilane, and a hydrocarbon solvent. 1. An ink comprising:a plurality of silver nanoparticles;an aminomethylsilane viscosifier; anda hydrocarbon solvent.2. The ink of claim 1 , wherein the silver nanoparticles are stabilized.3. The ink of claim 2 , wherein the stabilized silver nanoparticles comprise an organoamine.4. The ink of claim 1 , wherein the silver nanoparticles are present from about 20 to about 80 weight percent.5. The ink of claim 1 , wherein the aminomethylsilane viscosifier is present in an amount from about 0.01 weight percent to about 3.0 weight percent of the plurality of silver nanoparticles.7. The ink of claim 8 , wherein R′ is H and R″ an aliphatic group optionally substituted with amino or an optionally substituted phenyl group.8. The ink of claim 1 , wherein the aminomethylsilane is N-(6-aminohexyl)aminomethyltriethoxysilane or N-(6-aminohexyl)aminomethyltrimethoxysilane.9. The ink of claim 1 , wherein the ink is an inkjet ink claim 1 , a fleoxographic ink claim 1 , a gravure ink claim 1 , or a screen ink.10. The ink of claim 1 , wherein when the ink is annealed in a film claim 1 , the film has a conductivity in a range from about 1.0×10S/cm to about 5.0×10S/cm.11. The ink of claim 1 , having a viscosity in a range from about 5 cps to about 5 claim 1 ,000 cps.12. A method comprising: a plurality of silver nanoparticles;', 'an aminomethylsilane viscosifier; and', 'a hydrocarbon solvent;, 'providing an ink comprisingprinting an image on a substrate with the ink; ...

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Номер записи: 99
19-04-2018 дата публикации

COMPOSITION COMPRISING SILVER NANOWIRES IN AN ALCOHOL/WATER MIXTURE AND DISPERSED STYRENE/(METH)ACRYLIC COPOLYMERS FOR THE PREPARATION OF ELECTROCONDUCTIVE TRANSPARENT LAYERS

Номер: US20180105713A1
Автор: DIETSCH Herve, SEYFRIED Danny, Sturm Thomas, Zhang Rui
Принадлежит: BASF SE

Described is a composition suitable for the preparation of an electroconductive transparent layer, said composition comprising a mixture of water and one or more alcohols, electroconductive nanoobjects and one or more dissolved styrene/(meth)acrylic copolymers. 1. A composition , comprising: (A-1) water, and', '(A-2) one or more alcohols selected from the group consisting of methanol, ethanol, n-propanol, i-propanol, n-butanol, i-butanol and t-butanol,, '(A) a mixture comprising'} said electroconductive nanoobjects (B) having two external dimensions ranging from 1 nm to 100 nm and a third external dimension ranging from 1 μm to 100 μm,', 'wherein a total weight fraction of said electroconductive nanoobjects (B) ranges from 0.01 wt.-% to 1 wt-% based on a total weight of the composition, and, '(B) electroconductive nanoobjects,'} said dissolved copolymers (C) each having a number average molecular weight ranging from 500 g/mol to 22000 g/mol,', 'wherein a total weight fraction of said dissolved copolymers (C) ranges from 0.02 wt.-% to 5 wt.-%, based on the total weight of the composition., '(C) dissolved in mixture (A), one or more styrene/(meth)acrylic copolymers,'}2. The composition according to claim 1 , wherein said electroconductive nanoobjects (B) havea length ranging from 1 μm to 100 μm, anda diameter ranging from 1 nm to 100 nm,wherein said electroconductive nanoobjects (B) comprise one or more materials selected from the group consisting of silver, copper, gold and carbon.3. The composition according to claim 1 , wherein said electroconductive nanoobjects (B) are selected from the group consisting of nanowires and nanotubes.4. The composition according to claim 1 , wherein the ratio between the total weight of said electroconductive nanoobjects (B) and the total weight of said dissolved copolymers (C) ranges from 1:20 to 20:1.5. The composition according to claim 1 , wherein the mixture (A) consists of(A-1) from 70% to <100% of water, and(A-2) from >0% to 30 ...

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Номер записи: 100