HALOGEN-FREE FLAME RETARDANT TYPE RESIN COMPOSITION

The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition. 1. A halogen-free flame-retardant resin composition , based on the weight parts of organic solids , comprising (A) from 1 to 10 parts by weight of bismaleimide resin , (B) from 30 to 60 parts by weight of benzoxazine resin , (C) from 10 to 40 parts by weight of polyepoxy compound , (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant , and (E) from 1 to 25 parts by weight of curing agent , which is amine curing agent and/or phenolic resin curing agent.3. The composition according to claim 1 , characterized in that the benzoxazine resin is any one selected from the group consisting of bisphenol-A benzoxazine resin claim 1 , bisphenol-F benzoxazine resin claim 1 , phenolphthalein benzoxazine resin and MDA benzoxazine resin claim 1 , or a combination of at least two selected therefrom.4. The composition according to claim 1 , characterized in that the polyepoxy compound is any one selected from the group consisting of bisphenol-A epoxy resin claim 1 , bisphenol-F epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , o-cresol formaldehyde epoxy resin claim 1 , bisphenol-A novolac epoxy resin claim 1 , epoxy resin having biphenyl structure claim 1 , epoxy resin having aralkyl structure claim 1 , dicyclopentadiene epoxy resin claim 1 , halogen-free epoxy resin having oxazolidinone ring or epoxidised polybutadiene claim 1 , or ...

Graft Polymers for Dispersing Graphene and Graphite

Disclosed herein are graft polymers having a copolymer backbone and polycyclic aromatic hydrocarbon branches for use as a nanofiller dispersant and methods for making the same. Also disclosed are elastomeric nanocomposite compositions comprising a halobutyl rubber matrix, nanoparticles of graphite or grapheme, and the graft polymer. Such elastomeric nanocomposite compositions are suitable as tire innerliners or innertubes. 1. A polymer comprising:(a) a copolymer backbone comprising units derived from an isoolefin having from 4 to 7 carbons and an alkylstyrene; and 'wherein the one or more branches are directly bonded to an aromatic moiety of the copolymer backbone.', '(b) one or more branches comprising a polycyclic aromatic hydrocarbon,'}2. The polymer of claim 1 , wherein the polycyclic aromatic hydrocarbon is polynuclear.3. The polymer of claim 2 , wherein the polycyclic aromatic hydrocarbon is selected from the group consisting of naphthalenes claim 2 , anthracenes claim 2 , phenanthrenes claim 2 , pyrenes claim 2 , benzopyrenes claim 2 , coronenes claim 2 , ovalenes claim 2 , and combinations thereof.4. The polymer of claim 1 , wherein the copolymer backbone is poly(isobutylene-co-p-methylstyrene) (IMSM).5. The polymer of claim 1 , wherein the one or more branches are covalently bound to the aromatic moiety via a ketone group.6. The polymer of claim 5 , wherein the polymer comprises the reaction product of:(a) a copolymer comprising units derived from an isoolefin having from 4 to 7 carbons and an alkylstyrene; and(b) an acyl halide and/or acid anhydride functionalized polycyclic aromatic hydrocarbon.7. A method comprising:(a) contacting (i) a copolymer comprising units derived from an isoolefin having from 4 to 7 carbons and an alkylstyrene and (ii) an acyl halide and/or acid anhydride functionalized polycyclic aromatic hydrocarbon in the presence of a catalyst at a temperature of about 80° C. to about 200° C.; and(b) recovering a polymer product.8. The method ...

Halogen Free Flame Retardant Polycarbonate/Thermoplastic Polyester Molding Compositions with Polymeric Phosphorus Flame Retardant

This disclosure relates to halogen-free flame retardant polycarbonate/thermoplastic polyester molding compositions with improved mechanical properties and increased polyester loading level. More particularly, the disclosure relates to halogen-free polycarbonate/thermoplastic polyester resin alloys with polymeric phosphorus flame retardant additive and siloxane impact modifier. Also included are methods for preparing such compositions and articles there from. 113-. (canceled)15. The thermoplastic composition of claim 14 , wherein the polycarbonate is a bisphenol A-based polycarbonate.16. The thermoplastic composition of claim 15 , comprising from 20 to 65 weight percent of a bisphenol A-based polycarbonate.17. The thermoplastic composition of claim 14 , wherein the terephthalate-based polyester is a polyethylene terephthalate or a poly(1 claim 14 ,4-butylene) terephthalate or a mixture thereof.18. The thermoplastic composition of claim 17 , comprising from 15 to 40 weight percent of poly(1 claim 17 ,4-butylene terephthalate) (PBT) or poly(ethylene terephthalate) (PET) or a mixture thereof.19. The thermoplastic composition of claim 14 , wherein the silicone material is selected form the group consisting of polycarbonate-polysiloxane copolymers claim 14 , methacrylate-acrylate-siloxane copolymers claim 14 , and mixtures thereof.20. The thermoplastic composition of claim 19 , comprising from 20 to 40 weight percent of a polycarbonate-polysiloxane copolymer claim 19 , wherein the polycarbonate is a bisphenol A-based polycarbonate.21. The thermoplastic composition of claim 19 , comprising from 1 to 5 weight percent of a methacrylate-acrylate-siloxane copolymer.26. An article prepared from the composition of .27. The thermoplastic composition of claim 14 , wherein the bisphenol A-based polyphosphonate homopolymer flame retardant is a reaction product of bisphenol A and tetraphenyl phosphonium phenolate.28. The thermoplastic composition of claim 14 , wherein the composition ...

Thermosetting resin composition

Provided in the present invention is a thermosetting resin composition, comprising phosphorus-containing active ester and epoxy resin, the phosphorus-containing active ester being copolymerised using bis-aromatic formyl chloride hydrocarbyl phosphine oxide and one of bis-hydroxyl aromatic hydrocarbyl phosphine oxide, bis-hydroxyl aromatic oxyhydrocarbyl phosphine oxide, or hydroxylated DOPO, and then obtained from aromatic formyl chloride end capping; the thermosetting resin composition provided in the present invention has the advantages of good thermal stability, humidity resistance and heat resistance, a low dielectric constant and dielectric loss tangent, a low rate of water absorption, and halogen-free flame-retardant properties, and has excellent machinability; also provided in the present invention are applications of the thermosetting resin composition for resin sheet material, resin composite metal foil, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit boards.

Novel phosphorus compounds, synthesis method thereof, and polycarbonate resin composition including them

The present disclosure relates to a phosphorus compound represented by the following Chemical Formula 1. In the above Chemical Formula 1, Ar is aryl and R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are each independently H, substitutable linear or branched C 1 -C 20 alkyl and substitutable C 6 -C 20 aryl, the aryl includes a member selected from the group consisting of phenyl, biphenyl, naphthalene, fluorene, anthracene, phenanthrene, pyrene, fluoranthen, chrysene, benzofluoranthen, perylene, quinoline, indenoanthracene, indenophenanthrene, hydroanthracene, dibenzothiophen, dibenzofuran, and combinations thereof, and the substitution is substitution with C 1 -C 6 alkyl or C 6 -C 20 aryl, but may not be limited thereto.

Low-smoke, halogen-free flexible cords

Halogen-free flexible cords are disclosed. The cables include one or more conductors, each surrounded by an insulation layer and a nylon layer. The flexible cords exhibit low smoke when burned. Methods of making and using the cables are also disclosed.

FLUORINE-FREE OIL REPELLENT COATING, METHODS OF MAKING SAME, AND USES OF SAME

Provided are fluorine-free, oleophobic layers including one more or polydimethylsiloxane resin layers. The layers can be disposed on a portion of or all of a surface of a substrate. Also provided are methods of making and using same. 2. The layer of claim 1 , wherein the one or more poly(dimethylsiloxane) comprises linear poly(dimethylsiloxane) moiet(ies) claim 1 , branched poly(dimethylsilioxane)s moiet(ies) claim 1 , or a combination thereof.4. The layer of claim 1 , wherein at least one of the one or more poly(dimethylsiloxane) or linear or branched poly(dimethylsiloxane) has one or more crosslinkable groups.5. The layer of claim 4 , wherein the crosslinkable groups are selected from acrylate claim 4 , methacrylate claim 4 , allyl claim 4 , vinyl claim 4 , thiol claim 4 , hydroxyl claim 4 , silanol claim 4 , carboxylic acid claim 4 , aldehyde claim 4 , amine claim 4 , isocyanate claim 4 , azide claim 4 , alkyne claim 4 , epoxy claim 4 , halide claim 4 , hydrogen claim 4 , and combinations thereof.6. The layer of claim 1 , the pendant branched PDMS is formed by polymerization of one or more tris(trialkylsiloxy)silyl vinyl compound and trimethoxysilane vinyl compound claim 1 , wherein the alkyl moieties are independently at each occurrence Cto Calkyl moieties.7. The layer of claim 6 , wherein the alkyl moieties are independently at each occurrence Cto C claim 6 , Cto Calkyl moieties or Cto Calkyl moieties.9. The layer of claim 1 , wherein the number of ROSi repeat units of the one or more poly(dimethylsiloxane) moiet(ies) or the linear or branched poly(dimethylsiloxane)(s) backbone is 0 to 400.11. The layer of claim 1 , wherein the layer is cured.12. The layer of claim 1 , wherein the layer further comprises at least one crosslink between two polymer chains of a PDMS resin claim 1 , wherein the two polymer chains of a PDMS resin may be the same or different claim 1 , and or at least one crosslink between a polymer chain of a PDMS resin claim 1 , wherein the polymer ...

Halogen-free thermosetting resin composition, prepreg, laminate and printed circuit board comprising the same

The present invention provides a halogen-free thermosetting resin composition, a prepreg, a laminate and a printed circuit board comprising the same. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free thermosetting resin, (B) from 10 to 35 parts by weight of a phenolic curing agent, and (C) a phosphorus-containing flame retardant. The prepregs, laminates and printed circuit boards prepared from the halogen-free thermosetting resin composition of the present invention have excellent dimensional stability and dielectric properties, high adhesive force, high heat resistance, low water absorption and better processability, and can achieve halogen-free flame retardancy and reach UL94 V-0.

Resin composition, prepreg containing same, and laminate board and printed circuit board

The present disclosure provides a resin composition, as well as a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 48-54 parts by weight of a halogen-free epoxy resin, 16-31 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group; and 15-32 parts by weight of a cyanate ester resin. The prepreg, laminate and printed circuit board prepared from the resin composition have a low coefficient of thermal expansion.

CYANATE RESIN COMPOSITION AND USE THEREOF

The present invention relates to a cyanate resin composition, and a prepreg, a laminate, a metal foil clad laminate and a printed circuit board prepared by using same. The cyanate resin composition comprises a cyanate resin (A), an epoxy resin (B) with a structure of formula (I) and a maleimide compound (C). The cyanate resin composition of the present invention, and the prepreg, the laminate and the metal foil clad laminate prepared by using the cyanate resin composition have good moisture resistance, heat resistance, flame retardancy and reliability, and are suitable for being used as a substrate material for manufacturing a high-density printed circuit board. 2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. The cyanate resin composition as claimed in claim 1 , characterized in that n in the epoxy resin (B) with a structure of formula (I) is an integer of 1-10.12. The cyanate resin composition as claimed in claim 1 , characterized in that R is selected from the group consisting of phenyl claim 1 , naphthyl and biphenyl.13. The cyanate resin composition as claimed in claim 1 , characterized in that the epoxy resin (B) with a structure of formula (I) has a melt viscosity of 1.0 Pa·s or less at 150° C.14. The cyanate resin composition as claimed in claim 1 , characterized in that the cyanate resin (A) is selected from the group consisting of cyanates or cyanate prepolymers containing at least two cyanate radicals in the molecular structure thereof.15. The cyanate resin composition as claimed in claim 1 , characterized in that the cyanate resin (A) is any one or a mixture of at least two selected from the group consisting of bisphenol-A cyanate resin claim 1 , bisphenol-F cyanate resin claim 1 , tetramethylbisphenol-F cyanate resin claim 1 , bisphenol-M cyanate resin claim 1 , bisphenol-S cyanate resin claim 1 , bisphenol-E cyanate resin claim 1 , bisphenol-P cyanate resin claim 1 , linear ...

SEALING COMPOUNDS WITH BARRIER PROPERTIES

The invention relates to a polymer compound for a PVC-free sealing system for container closures, which is equipped with at least one oxygen-consuming compound, in which the Shore D hardness of the polymer compound is at least 20 and the polymer compound has a melt flow index (190° C., 5 kg) of at least 5. 1. A polymer compound for a PVC-free sealing insert of a container closure , provided with at least one oxygen-depleting compound , characterized in that the polymer compound has a Shore D hardness of least 20 and a melt flow index (190° C. , 5 kg) of at least 5.2. The polymer compound according to claim 1 , which is composed so that the compound essentially comprises a combination of (rubbery) barrier polymer such as butyl rubber claim 1 , polyisoprene claim 1 , polyisobutylene claim 1 , SIBS claim 1 , or polybutene and polyolefin claim 1 , but no oil.3. The compound according to claim 1 , characterized in that the compound has a Shore D hardness of from 20 to 60 and particularly preferably of from 40 to 50.4. The compound according to claim 1 , characterized in that the compound contains sodium sulfite as an oxygen-depleting compound claim 1 , preferably having a mean particle size of less than 20 microns claim 1 , more preferably having a mean particle size of less than 12 microns and even more preferably a mean particle size of less than 7 microns.5. The compound according to claim 1 , characterized in that the compound contains between 1% to 10% of sodium sulfite claim 1 , preferably from 4% to 8% of sodium sulfite as an oxygen-depleting compound.6. The polymer compound for a PVC-free sealing insert of container closures containing at least one polyolefin and at least one (rubbery) barrier polymer according to claim 2 , but containing substantially no oil claim 2 , wherein the polymer compound contains at least one further different polymer claim 2 , which reduces the total hardness (Shore D) of the compound claim 2 , as compared to a corresponding compound ...

INSULATED WIRE AND CABLE USING HALOGEN-FREE FLAME-RETARDANT RESIN COMPOSITION

An insulated wire includes a conductor, and an insulation layer covering an outer periphery of the conductor. The insulation layer includes a halogen-free flame-retardant resin composition including a base polymer, not less than 1 part by mass and not more than 10 parts by mass of an amorphous silica and not less than 10 parts by mass and not more than 150 parts by mass of a halogen-free flame retardant relative to 100 parts by mass of the base polymer. The base polymer includes not less than 50 parts by mass and not more than 90 parts by mass of either an ethylene-vinyl acetate copolymer or an ethylene-butene copolymer and not less than 10 parts by mass and not more than 50 parts by mass of a low-density polyethylene. 1. An insulated wire , comprising:a conductor; andan insulation layer covering an outer periphery of the conductor,wherein the insulation layer comprises a halogen-free flame-retardant resin composition comprising a base polymer, not less than 1 part by mass and not more than 10 parts by mass of an amorphous silica and not less than 10 parts by mass and not more than 150 parts by mass of a halogen-free flame retardant relative to 100 parts by mass of the base polymer, andwherein the base polymer comprises not less than 50 parts by mass and not more than 90 parts by mass of either an ethylene-vinyl acetate copolymer or an ethylene-butene copolymer and not less than 10 parts by mass and not more than 50 parts by mass of a low-density polyethylene.2. The insulated wire according to claim 1 , wherein the halogen-free flame-retardant resin composition further comprises not less than 1 part by mass and not more than 40 parts by mass of carbon black relative to 100 parts by mass of the base polymer.3. A cable claim 1 , comprising:an insulated wire comprising a conductor and an insulation layer covering an outer periphery of the conductor; anda sheath formed around the insulated wire,wherein the sheath comprises a sheath halogen-free flame-retardant resin ...

Environmental friendly flame retardant moulding compositions based on thermoplastic impact modified styrenic polymers

Object of the present invention is to provide halogen-free highly flame retardant styrene impact modified polymers able to perform V0 classification on thin items, according to international standard UL-94. 1. Halogen free flame retardant impact modified styrenic thermoplastic composition consisting of:a) at least a thermoplastic impact modified styrenic polymer;b) a first flame retardant (FR) component comprising at least a hypophosphorous acid metal salt with a phosphorus valence state being equal to +1;c) at least an aromatic phosphorus ester, being a second flame retardant (FR) component;d) at least an antidripping agent;e) at least one of fillers and reinforcing fibers; andconventional additives.2. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein said conventional additives are selected from the group consisting of processing aids claim 1 , heat and process stabilizers claim 1 , UV stabilizers claim 1 , pigments claim 1 , dispersing agents claim 1 , mold release additives claim 1 , nucleating agents and their mixtures.3. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein said hypophosphorus acid metal salt is aluminium hypophosphite.4. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein said aromatic phosphorus ester is Resorcinol bis (2.6-dixylenyl phosphate).5. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein said antidripping agent is based on polytetrafluoroethylene PTFE.6. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein said styrene impact modified thermoplastic polymer is acrylonitryle butadiene styrene copolymer ABS.7. The halogen free flame retardant impact modified styrenic thermoplastic composition according to claim 1 , wherein ...

Halogen-Free Resin Composition and Prepreg and Laminated Board Prepared Therefrom

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board. 2. The halogen-free resin composition according to claim 1 , wherein the epoxy resin is any one selected from the group consisting of bisphenol-A epoxy resin claim 1 , bisphenol-F epoxy resin claim 1 , biphenyl epoxy resin claim 1 , alkyl novolac epoxy resin claim 1 , dicyclopentadiene epoxy resin claim 1 , bisphenol-A novolac epoxy resin claim 1 , o-cresol novolac epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , trifunctional epoxy resin claim 1 , tetrafunctional epoxy resin claim 1 , isocyanate-modified epoxy resin claim 1 , naphthalene epoxy resin and phosphorus-containing epoxy resin claim 1 , or a mixture of at least two selected therefrom.4. The halogen-free resin composition according to claim 1 , wherein the polyphenyl ether has a number average molecular weight of 1000-4000.5. The halogen-free resin composition according to claim 1 , wherein the halogen-free flame retardant is any one selected form the group consisting of phosphazene claim 1 , ammonium polyphosphate claim 1 , tris(2-carboxyethyl)phosphine claim 1 , tri(isopropylchloro)phosphate claim 1 , trimethyl phosphate claim 1 , dimethyl-methyl phosphate claim 1 , resorcinol bis-xylyl phosphate claim 1 , ...

Nonhalogen flame retardant resin composition and flame retardant resin molded article manufactured therefrom

The present invention relates to a nonhalogen flame retardant resin composition having excellent flame retardancy and improved thermal deformation properties, and a flame retardant resin molded article manufactured therefrom, and provides a nonhalogen flame retardant resin composition including a) a base resin including a polyarylene ether-based polymer; an aromatic vinyl-based polymer and a copolymer of vinylcyan-based monomer-conjugated-based diene monomer-aromatic vinyl-based monomer; b) an organophosphorus-based flame retardant; c) a hypophosphite compound; and d) a sulfur-containing compound including at least two sulfur atoms, wherein b) the organophosphorus-based flame retardant, c) the hypophosphite compound and d) the sulfur-containing compound are included in a weight ratio of 15 to 24:2 to 4:2 to 5.

HALOGEN-FREE EPOXY RESIN COMPOSITION HAVING LOW DIELECTRIC LOSS

The present invention discloses a halogen-free epoxy resin composition having low dielectric loss, comprises: (A) 100 parts by weight of an epoxy resin; (B) 10-30 parts by weight of a DOPO modified curing agent; (C) 1-10 parts by weight of benzoxazine resin; (D) 60-90 parts by weight of an active ester compound; (E) 20-50 parts by weight of a flame retardant; and (F) 0.5-10 parts by weight of a curing accelerator. The halogen-free epoxy resin composition uses active ester as a curing agent of the epoxy resin to ensure that the hardening product has characteristics such as low dielectric constant (Dk), low dielectric loss (Df), high heat resistance, low water absorption, flame retardant and halogen-free. The halogen-free epoxy resin composition of the present invention is used for manufacturing semi-cured prepregs or resin-coated films, and is applied toward manufacturing metal clad laminates and printed circuit boards. 1. A halogen-free epoxy resin composition having low dielectric loss , comprises:(A) 100 parts by weight of an epoxy resin;(B) 10-30 parts by weight of a DOPO modified curing agent;(C) 1-10 parts by weight of benzoxazine resin;(D) 60-90 parts by weight of an active ester;(E) 20-50 parts by weight of a flame retardant; and(F) 0.5-10 parts by weight of a curing accelerator.2. The halogen-free epoxy resin composition having low dielectric loss of claim 1 , wherein the epoxy resin is selected from one of the group consisting of bisphenol A type epoxy resin claim 1 , bisphenol F type epoxy resin claim 1 , bisphenol S type epoxy resin claim 1 , phenol novolac type epoxy resin claim 1 , cresol novolac type epoxy resin claim 1 , bisphenol A novolac type epoxy resin claim 1 , bisphenol F novolac type epoxy resin claim 1 , diphenylenthylene type epoxy resin claim 1 , epoxy resin having triazine skeleton claim 1 , epoxy resin having fluorene skeleton claim 1 , triphenylmethane type epoxy resin claim 1 , biphenyl type epoxy resin claim 1 , xylylene type epoxy ...

HALOGEN-FREE RESIN COMPOSITION AND USES THEREOF

Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect. 1. A halogen-free resin composition , comprising the following:(A) 40-80 parts by weight of allyl modified benzoxazine resin;(B) 10-20 parts by weight of hydrocarbon resin;(C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; and(D) 0.01-3 parts by weight of initiating agent.2. The halogen-free resin composition according to claim 1 , wherein the allyl modified benzoxazine resin is selected from the group consisting of allyl modified bisphenol-A benzoxazine resin claim 1 , allyl modified bisphenol-F benzoxazine resin claim 1 , allyl modified dicyclopentadiene phenol benzoxazine resin claim 1 , allyl modified bisphenol-S benzoxazine resin or diamine benzoxazine resin claim 1 , or a mixture of at least two of them.3. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon resin is a hydrocarbon resin which consists of carbon and hydrogen and has a number average molecular weight less than 11000 and a vinyl content greater than 60% and is liquid at room temperature.4. The halogen-free resin composition according to claim 1 , wherein the hydrocarbon resin is a hydrocarbon resin which has a number average molecular ...

Phenoxycyclotriphosphazene active ester, halogen-free resin composition and uses thereof

The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.

HALOGEN-FREE RESIN COMPOSITION, AND A PREPREG AND A LAMINATE USED FOR PRINTED CIRCUIT USING THE SAME

The technology discloses a halogen-free resin composition and a prepreg and a laminate used for a printed circuit. The resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin, alkyl phenol novolac curing agent, and phosphorus-containing flame retardant. The alkyl phenol epoxy resin has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties, a higher glass transition temperature, low water absorption, and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With an alkyl phenol novolac curing agent, the molecular structure will have many alkyls, excellent dielectric properties and low water absorption. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constants, dielectric loss factors, and water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance. 1. A halogen-free resin composition , comprising:(A) an alkyl phenol epoxy resin;(B) a benzoxazine resin;(C) an alkyl phenol novolac curing agent; and(D) a phosphorus-containing flame retardant.2. The halogen-free resin composition of claim 1 , wherein claim 1 , based on 100 parts by weight of the organic solid matters claim 1 , the addition amount of the alkyl phenol epoxy resin is about 10 to about 50 parts by weight.4. The halogen-free resin composition of claim 1 , wherein claim 1 , based on 100 parts by weight of the organic solid matters claim 1 , the addition amount of the benzoxazine resin is about 10 to about 70 parts by weight.5. The halogen-free resin composition of claim 1 , wherein claim 1 , the benzoxazine resin is any one of bisphenol-A benzoxazine resin claim 1 , bisphenol-F benzoxazine resin claim 1 , MDA benzoxazine resin claim 1 , phenolphthalein benzoxazine resin or ...

Halogen-free resin composition and use thereof

The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND LAMINATE USING SAME

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance. 2. The halogen-free epoxy resin composition according to claim 1 , characterized in that the halogen-free epoxy resin is selected from the group consisting of biphenyl novolac epoxy resin claim 1 , DCPD novolac epoxy resin claim 1 , alkylene novolac epoxy resin claim 1 , bisphenol A novolac epoxy resin claim 1 , bisphenol F epoxy resin claim 1 , bisphenol Z epoxy resin claim 1 , bisphenol AP epoxy resin claim 1 , bisphenol TMC epoxy resin claim 1 , biphenyl-containing epoxy resin claim 1 , tetramethyl biphenyl epoxy resin claim 1 , phenol novolac epoxy resin claim 1 , cresol novolac epoxy resin claim 1 , triphenyl methane epoxy resin claim 1 , tetraphenyl ethane epoxy resin claim 1 , dicyclopentadiene-phenol addition reaction epoxy resin claim 1 , phenol aralkyl epoxy resin claim 1 , naphthol novolac epoxy resin claim 1 , naphthol aralkyl epoxy resin claim 1 , naphthol-phenol co-condensation novolac epoxy resin claim 1 , naphthol-cresol co-condensation novolac epoxy resin claim 1 , aromatic hydrocarbon formaldehyde resin-modified novolac epoxy resin claim 1 , biphenyl-modified novolac epoxy resin or imide-modified epoxy resin claim 1 , or a mixture of at least two selected therefrom.3. The halogen-free epoxy resin composition according ...

Water Repellent, Soil Resistant, Fluorine-Free Compositions

The present invention pertains to a fluorine-free composition for treating textile articles being water repellant, sol resistant and stain resistant, especially carpets comprising a first composition comprising an aqueous silicone emulsion, an aqueous dispersion of a silane quaternary ammonium salt and water and a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers. 1. A fluorine-free composition comprising: [{'sub': '50', 'i. An aqueous silicone emulsion having a non-volatile silicone content of from 10 to 30 wt. %, based on the total weight of said aqueous emulsion, and having a particle size, d, from 25 to 100 nm,'}, 'ii. an aqueous dispersion of a silane quaternary ammonium salt having a solid content of from 1.0 to 7.0 wt %, based on the total weight of said dispersion, and', 'iii. water, whereby the mixing ratio is from 0.5 to 4.0 volume parts for (i), from 0.7 to 1.5 volume parts for (ii), and from 1.0 to 4.0 volume parts for (iii), and, 'a. A first composition comprising'}b. a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers, and which has an overall cationic or anionic charge, and that are of average particle size between 25 and 400 nm.2. The composition according to claim 1 , wherein the combination of (i) and (ii) has an average particle size diameter of from 10 to 400 nm as determined using the Particle Size test method.3. The composition according to claim 1 , wherein the combination of (i) and (ii) has an average zeta potential of 0.07 according to the Zeta Potential Test.4. The composition according to claim 1 , wherein the silicone is an aminopolysiloxanes of Formula I:{'br': None, 'sup': 1', '2', '3, 'sub': b', 'c', '(4-a-b-c), 'RR(OR)SiO/2\u2003\u2003(I)'}wherein:{'sup': '1', 'sub': 1', '6, 'Rmeans identical or different monovalent, nitrogen-free, optionally halogen substituted, SiC-bonded C-Calkyl ...

HIGH-CTI AND HALOGEN-FREE EPOXY RESIN COMPOSITION FOR COPPER-CLAD PLATES AND USE THEREOF

A high-CTI and halogen-free epoxy resin composition for copper-clad plates and uses thereof is provided. The formula of the high-CTI and halogen-free epoxy resin composition for copper-clad plates comprises 100˜140 parts of halogen-free phosphorous epoxy resin, 10˜35 parts of dicyclopentadiene phenolic epoxy resin, 32˜60 parts of benzoxazine, 1˜5 parts of phenolic resin, 0.05˜0.5 parts of accelerants; and 25˜70 parts of fillers, by weight. The copper-clad plates, prepared according to embodiments of the present invention, can reach the requirements of high CTI (CTI≧500V), high heat resistance(Tg≧150 ° C., PCT, 2 h>6 min) and the level of flame retardance of UL-94 V0, and they are widely used in the electronic materials of electric machines, electric appliances, white goods and so on. 110-. (canceled)11. A high-CTI and halogen-free epoxy resin composition for copper-clad plates , has a formula comprising:halogen-free phosphorous epoxy resin 100˜140 parts;dicyclopentadiene phenolic epoxy resin 10˜35 parts;phenolic resin 1˜5 parts;benzoxazine 32˜60 parts;accelerant 0.05˜0.5 parts; andfiller 25˜70 parts, by weight.12. The high-CTI and halogen-free epoxy resin composition for copper-clad plates according to claim 11 , wherein the halogen-free phosphorous epoxy resin is synthesized as following steps:(1) weighting the ingredients according to the formula which comprises:epoxy resin 55˜75%;reactive phosphorous compound 25˜45%,by weight; wherein,the epoxy resin is straight-chain epoxy resin;(2) preparation of the halogen-free phosphorous epoxy resin, by adding the straight-chain epoxy resin and the reactive phosphorous compound into the reactor to dissolve them at an increased temperature; adding the accelerant at 110˜130° C., raising the temperature to 170˜190° C., to keep a reaction for 2˜4 hours, and adding solvents for dissolution after the temperature is decreased, thus to obtain the halogen-free phosphorous epoxy resin with a solid content of 65˜75%, a phosphorus ...

HALOGEN-FREE FLAME RETARDANT POLYAMIDE MOULDING COMPOSITIONS WITH INCREASED GLOW WIRE AND FIRE RESISTANCE

The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance. 2. Composition according to claim 1 , wherein phosphorus valence state is equal to +1 in said inorganic Phosphinate and in that in said organic phosphinates metal salt phosphorus atoms are linked to carbon atom and phosphorus valence state is equal to +1.3. Polyamide thermoplastic composition according to claim 1 , wherein said conventional additives are selected among: processing aids claim 1 , heat and process stabilizers claim 1 , UV stabilizers claim 1 , antidripping agents claim 1 , pigments claim 1 , dispersing agents claim 1 , mould release additives claim 1 , nucleating agents claim 1 , partially crosslinked elastic polymers used as impact modifiers claim 1 , and their mixtures.4. Polyamide thermoplastic composition according to claim 1 , wherein said thermoplastic polyamide polymer is polyamide 6.5. Polyamide thermoplastic composition according to claim 4 , wherein said thermoplastic polyamide polymer is glass reinforced polyamide 6.6. Polyamide thermoplastic composition according to claim 4 , wherein said thermoplastic polyamide polymer is selected as Polyamide 6 claim 4 ,10 or Polyamide 6 claim 4 ,11 or Polyamide 1010 or Polyamide 11 or Polyamide 12 or Polyamide 6 claim 4 ,12 or their mixtures.7. Polyamide thermoplastic composition according to claim 1 , wherein said first flame retardant (1FR) component is Aluminium Hypophosphite.8. Polyamide thermoplastic ...

Halogen-Free Epoxy Resin Composition, Prepreg, Laminate and Printed Circuit Board Containing the Same

The present invention relates to a halogen-free epoxy resin composition, a prepreg, a laminate and a printed circuit board containing the same. The halogen-free epoxy resin composition comprises an epoxy resin and a curing agent. Taking the total equivalent amount of the epoxy groups in the epoxy resin as 1, the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95. By controlling the equivalent ratio of the epoxy groups in the epoxy resin to the active groups in the curing agent to be 0.5-0.95, the present invention ensures the Df value stability of prepregs under different curing temperature conditions while maintaining a low dielectric constant and a low dielectric loss. The prepregs and laminates prepared from the resin composition have comprehensive performances, such as low dielectric constant, low dielectric loss, excellent flame retardancy, heat resistance, cohesiveness, low water absorption and moisture resistance, and are suitable for use in halogen-free multilayer circuit boards. 1. A halogen-free epoxy resin composition comprising an epoxy resin and a curing agent , wherein taking the total equivalent amount of the epoxy groups in the epoxy resin as 1 , the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.5-0.95.2. The halogen-free epoxy resin composition claimed in claim 1 , wherein taking the total equivalent amount of the epoxy groups in the epoxy resin as 1 claim 1 , the active groups in the curing agent which react with the epoxy groups have an equivalent amount of 0.7-0.85.3. The halogen-free epoxy resin composition claimed in claim 1 , wherein the curing agent is styrene-maleic anhydride and benzoxazine resin.4. The halogen-free epoxy resin composition claimed in claim 3 , wherein taking the total equivalent amount of the epoxy groups in the epoxy resin as 1 claim 3 , the benzoxazine resin has an equivalent amount of 0.3-0.55 claim 3 , and the ...

Flame-retardant thermoplastic material and expanded beads thereof

The invention relates to a flame-retardant thermoplastic material, comprising thermoplastic base resin, a flame retardant, and an optional antioxidant, wherein the flame retardant comprises a complex of phosphine oxide and a transition metal salt. The invention also relates to flame-retardant thermoplastic expanded beads. A foam molding prepared from the flame-retardant thermoplastic expanded beads has good flame-retardant and antistatic properties, has excellent mechanical properties and is widely used.

Halogen Free Flame Retardant Polycarbonate/Thermoplastic Polyester Molding Compositions with Polymeric Phosphorus Flame Retardant

This disclosure relates to halogen-free flame retardant polycarbonate/thermoplastic polyester molding compositions with improved mechanical properties and increased polyester loading level. More particularly, the disclosure relates to halogen-free polycarbonate/thermoplastic polyester resin alloys with polymeric phosphorus flame retardant additive and siloxane impact modifier. Also included are methods for preparing such compositions and articles there from.

Halogen-free solid flame retardant mixture and its use

Die Erfindung betrifft halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 85 bis 99,995 Gew.-% eines festen Diethylphosphinsäuresalzes der Metalle Mg, Ca, Al, Sb, SN, Ge, Ti, Fe, Zr, Zn, Ce, Bi, Sr, Mn, Li, Na, K und/oder einer protonierten Stickstoffbase und 0,005 bis 15 Gew.-% nicht-brennbare Zusätze enthält und es sich bei der Komponente B um Aluminiumphosphit handelt. The invention relates to a halogen-free flame retardant mixture comprising 1 to 99% by weight of a component A and 1 to 99% by weight of a component B, where component A is from 85 to 99.995% by weight of a solid diethylphosphinic acid salt of the metals Mg, Ca, Al, Sb, SN, Ge, Ti, Fe, Zr, Zn, Ce, Bi, Sr, Mn, Li, Na, K and / or a protonated nitrogen base and 0.005 to 15 wt .-% non-combustible additives and it contains at Component B is aluminum phosphite.

Halogenfreie feste flammschutzmittelmischung und ihre verwendung

Die Erfindung betrifft Halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 92 bis 99,9 Gew.-% eines festen Aluminiumdiethylphosphinsäuresalz und 0,5 bis 8 Gew.-% nicht-brennbare Zusätze enthält wobei es sich bei den Zusätzen um Sulfate handelt, und dass es sich bei den Sulfaten um Verbindungen mit Kationen der Alkalimetalle, der Erdalkalimetalle, der dritten Hauptgruppe, der Nebengruppen des Periodensystems und/oder von protonierten Stickstoffbasen handelt; und es sich bei der Komponente B um Aluminiumphosphit handelt, wobei es sich bei den bei den Aluminiumphosphiten um solche der Formeln (I), (II) und/oder (III)         Al(HPO)x (HO)     (I)in derbedeutet,         AlM(HPO)(OH)x (HO)     (II)in derbedeutet,         Al(HPO)(HPO)x (HO)     (III)in derbedeutet,und/oder um Mischungen von Aluminiumphosphit der Formel (I) mit schwerlöslichen Aluminiumsalzen und stickstofffreien Fremdionen, um Mischungen von Aluminiumphosphit der Formel (III) mit Aluminiumsalzen, um Aluminiumphosphit [Al(H2PO)], um sekundäres Aluminiumphosphit [Al(HPL)], um basisches Aluminiumphosphit [Al(OH)(HPO)*2aq], um Aluminiumphosphittetrahydrat [Al(HPO)*4aq], um Aluminiumphosphonat, um Al(HPO)(OH)(1,6-Hexandiamin)*12HO, um Al(HPO)*xAlO*nHO mit x = 2,27 - 1, um AlHPOund/oder um Mischungen von 0 - 99,9 Gew.-% Al(HPO)*nHO mit 0,1 - 100 Gew.-% Natriumaluminiumphosphit handelt.

Halogenfreie feste flammschutzmittelmischung und ihre verwendung

Die Erfindung betrifft halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 92 bis 99,9 Gew.-% eines festen Aluminiumdiethylphosphinsäuresalz und 0,5 bis 8 Gew.-% nicht-brennbare Zusätze enthält wobei es sich bei den Zusätzen um Ethyl-Butylphosphinsäuresalze, Butyl-Butylphosphinsäuresalze, Ethyl-Hexylphosphinsäuresalze, Butyl-Hexylphosphinsäuresalze und/oder Hexyl-Hexylphosphinsäuresalze handelt und es sich bei der Komponente B um Aluminiumphosphit handelt, wobei es sich bei den bei den Aluminiumphosphiten um solche der Formeln (I), (II) und/oder (III)         Al(HPO)x (HO)     (I)in derq0 bis 4bedeutet,         AlM(HPO)(OH)x (HO)     (II)in derMAlkalimetallionenz0,01 bis 1,5y2,63 bis 3,5v0 bis 2 undw0 bis 4bedeutet,         Al(HPO)(HPO)x (HO)     (III)in deru2 bis 2,99t2 bis 0,01 unds0 bis 4bedeutet,und/oder um Mischungen von Aluminiumphosphit der Formel (I) mit schwerlöslichen Aluminiumsalzen und stickstofffreien Fremdionen, um Mischungen von Aluminiumphosphit der Formel (III) mit Aluminiumsalzen, um Aluminiumphosphit [Al(H2PO)], um sekundäres Aluminiumphosphit [Al(HPO)], um basisches Aluminiumphosphit [Al(OH)(HPO)*2aq], um Aluminiumphosphittetrahydrat [Al(HPO)*4aq], um Aluminiumphosphonat, um Al(HPO)(OH)(1,6-Hexandiamin)*12HO, um Al(HPO)*xAlO*nHO mit x = 2,27 - 1, um AlHPOund/oder um Mischungen von 0 - 99,9 Gew.-% Al(HPO)*nHO mit 0,1 - 100 Gew.-% Natriumaluminiumphosphit handelt.

Halogen-free fixed flame retardant mixture and its use

Die Erfindung betrifft halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 92 bis 99,9 Gew.-% eines festen Aluminiumdiethylphosphinsäuresalz und 0,5 bis 8 Gew.-% nicht-brennbare Zusätze enthält wobei es sich bei den Zusätzen um Phosphate handelt, und dass es sich bei den Phosphaten um Verbindungen mit Kationen der Alkalimetalle, der Erdalkalimetalle, der dritten Hauptgruppe, der Nebengruppen des Periodensystems und/oder von protonierten Stickstoffbasen handelt; und es sich bei der Komponente B um Aluminiumphosphit handelt, wobei es sich bei den bei den Aluminiumphosphiten um solche der Formeln (I), (II) und/oder (III)         Al(HPO)x (HO)     (I)in derq0 bis 4bedeutet,         AlM(HPO)(OH)x (HO)     (II)in derMAlkalimetallionenz0,01 bis 1,5y2,63 bis 3,5v0 bis 2 undw0 bis 4bedeutet,         Al(HPO)(HPO)x (HO)     (III)in deru2 bis 2,99t2 bis 0,01 unds0 bis 4bedeutet,und/oder um Mischungen von Aluminiumphosphit der Formel (I) mit schwerlöslichen Aluminiumsalzen und stickstofffreien Fremdionen, um Mischungen von Aluminiumphosphit der Formel (III) mit Aluminiumsalzen, um Aluminiumphosphit [Al(H2PO)], um sekundäres Aluminiumphosphit [Al(HPO)], um basisches Aluminiumphosphit [Al(OH)(HPO)*2aq], um Aluminiumphosphittetrahydrat [Al(HPO)*4aq], um Aluminiumphosphonat, um Al(HPO)(OH)(1,6-Hexandiamin)*12HO, um Al(HPO)*xAlO*nHO mit x = 2,27 - 1, um AlHPOund/oder um Mischungen von 0 - 99,9 Gew.-% Al(HPO)*nHO mit 0,1 - 100 Gew.-% Natriumaluminiumphosphit handelt. The invention relates to a halogen-free flame retardant mixture comprising 1 to 99% by weight of a component A and 1 to 99% by weight of a component B, component A being 92 to 99.9% by weight of a solid aluminum diethylphosphinic salt and 0.5 to 8 % By weight contains non-combustible additives, the additives being phosphates, and the phosphates being compounds with cations of the alkali metals, the alkaline earth metals, the third ...

Halogen-free fixed flame retardant mixture and its use

Die Erfindung betrifft halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 92 bis 99,9 Gew.-% eines festen Aluminiumdiethylphosphinsäuresalz und 0,5 bis 8 Gew.-% nicht-brennbare Zusätze enthält wobei es sich bei den Zusätzen um Nitrate, Sulfite und/oder Acetate handelt, und dass es sich bei den Nitraten, Sulfiten und/oder Acetaten um Verbindungen mit Kationen der Alkalimetalle, der Erdalkalimetalle, der dritten Hauptgruppe, der Nebengruppen des Periodensystems und/oder von protonierten Stickstoffbasen handelt; und es sich bei der Komponente B um Aluminiumphosphit handelt, wobei es sich bei den bei den Aluminiumphosphiten um solche der Formeln (I), (II) und/oder (III)         Al(HPO)x (HO)     (I)in derq0 bis 4bedeutet,         AlM(HPO)(OH)x (HO)     (II)in derMAlkalimetallionenz0,01 bis 1,5y2,63 bis 3,5v0 bis 2 undw0 bis 4bedeutet,         Al(HPO)(HPO)x (HO)     (III)in deru2 bis 2,99t2 bis 0,01 unds0 bis 4bedeutet,und/oder um Mischungen von Aluminiumphosphit der Formel (I) mit schwerlöslichen Aluminiumsalzen und stickstofffreien Fremdionen, um Mischungen von Aluminiumphosphit der Formel (III) mit Aluminiumsalzen, um Aluminiumphosphit [Al(H2PO)], um sekundäres Aluminiumphosphit [Al(HPO)], um basisches Aluminiumphosphit [Al(OH)(HPO)*2aq], um Aluminiumphosphittetrahydrat [Al(HPO)*4aq], um Aluminiumphosphonat, um Al(HPO)(OH)(1,6-Hexandiamin),*12HO, um Al(HPO)*xAlO*nHO mit x = 2,27 - 1, um AlHPOund/oder um Mischungen von 0 - 99,9 Gew.-% Al(HPO)*nHO mit 0,1 - 100 Gew.-% Natriumaluminiumphosphit handelt. The invention relates to a halogen-free flame retardant mixture comprising 1 to 99% by weight of a component A and 1 to 99% by weight of a component B, component A being 92 to 99.9% by weight of a solid aluminum diethylphosphinic salt and 0.5 to 8 % By weight contains non-combustible additives, the additives being nitrates, sulfites and / or acetates, and the nitrates, sulfites ...

Halogen-free fixed flame retardant mixture and its use

Die Erfindung betrifft halogenfreie Flammschutzmittelmischung, enthaltend 1 bis 99 Gew.-% einer Komponente A und 1 bis 99 Gew.-% einer Komponente B, wobei Komponente A 92 bis 99,9 Gew.-% eines festen Aluminiumdiethylphosphinsäuresalz und 0,5 bis 8 Gew.-% nicht-brennbare Zusätze enthält wobei es sich bei den Zusätzen um Phosphonate handelt, und dass es sich bei den Phosphonaten um Verbindungen mit Kationen der Alkalimetalle, der Erdalkalimetalle, der dritten Hauptgruppe, der Nebengruppen des Periodensystems und/oder von protonierten Stickstoffbasen handelt; und es sich bei der Komponente B um Aluminiumphosphit handelt, wobei es sich bei den bei den Aluminiumphosphiten um solche der Formeln (I), (II) und/oder (III)         Al(HPO)x(HO)     (I)in derq0 bis 4bedeutet,         AlM(HPO)(OH)x(HO)     (II)in derMAlkalimetallionenz0,01 bis 1,5y2,63 bis 3,5v0 bis 2 undw0 bis 4bedeutet,         Al(HPO)(H2PO)x(HO)     (III)in deru2 bis 2,99t2 bis 0,01 unds0 bis 4bedeutet, und/oder um Mischungen von Aluminiumphosphit der Formel (I) mit schwerlöslichen Aluminiumsalzen und stickstofffreien Fremdionen, um Mischungen von Aluminiumphosphit der Formel (III) mit Aluminiumsalzen, um Aluminiumphosphit [Al(H2PO)], um sekundäres Aluminiumphosphit [Al(HPO)], um basisches Aluminiumphosphit [Al(OH)(HPO)*2aq], um Aluminiumphosphittetrahydrat [Al(HPO)*4aq], um Aluminiumphosphonat, um Al(HPO)(OH)(1,6-Hexandiamin)*12HO, um Al(HPO)*xAlO*nHO mit x = 2,27 - 1, um AlHPOund/oder um Mischungen von 0 - 99,9 Gew.-% Al(HPO)*nHO mit 0,1 - 100 Gew.-% Natriumaluminiumphosphit handelt. The invention relates to a halogen-free flame retardant mixture comprising 1 to 99% by weight of a component A and 1 to 99% by weight of a component B, component A being 92 to 99.9% by weight of a solid aluminum diethylphosphinic salt and 0.5 to 8 % By weight contains non-combustible additives, the additives being phosphonates, and the phosphonates being compounds with cations of the alkali metals, the alkaline earth metals, ...

Flame-retardant polycarbonate resin compositions

一种高性能增强型无卤无红磷阻燃pbt工程塑料材料及其制备方法

本发明公开了一种高性能增强型无卤无红磷阻燃PBT工程塑料材料及其制备方法，属于高分子复合材料领域。本发明采用大分子偶联技术显著提高材料的机械性能，具体为以甲基丙烯酸缩水甘油酯二元共聚物为大分子偶联剂提升本塑料的热混相容性，改善所用无机物、有机原料之间的界面作用，强化整体的力学性能；同时采用无机填充物蛭石，显著降低材料燃烧时的烟密度和成型产品时的翘曲性。本发明提供的无卤阻燃增强PBT材料的力学性能与玻纤增强溴锑阻燃PBT材料相比性能相当或更优，且具有更低的烟密度，可以实现在电子电器领域无卤材料对有卤材料的替代。

一种低烟密度高性能无卤阻燃增强pbt复合物及其制备方法

本发明公开了一种低烟密度高性能无卤阻燃增强PBT复合物及其制备方法。所述低烟密度高性能无卤阻燃增强PBT复合物包括如下重量份的组分：PBT 36.5～58.7份，有机次磷酸铝14～16.5份，三聚氰胺聚磷酸盐3.5～7份，玻璃纤维10～30份，环氧树脂0.3～0.8份，氰尿酸三聚氰胺盐3～8份，钼酸盐3～5份，反应型抑烟剂2～4份，抗氧剂0.2～0.5份。本发明将PBT、有机次磷酸铝、三聚氰胺聚磷酸盐、玻璃纤维、氰尿酸三聚氰胺盐、钼酸盐、反应型抑烟剂及其他组分互相配合制备得到低烟密度高性能无卤阻燃增强PBT复合物，该低烟密度高性能无卤阻燃增强PBT复合物抑烟性能优异，同时维持了良好的力学性能。

一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板

本发明涉及一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板。所述无卤环氧树脂组合物，其包括环氧树脂和固化剂，以环氧树脂的环氧基总当量数为1，固化剂中与环氧基团发生反应的活性基团的当量数为0.5～0.95。本发明通过控制环氧树脂中环氧基和固化剂中活性基团的当量比为0.5～0.95，在保持低介电常数和低介质损耗的同时，保证了预浸料在不同固化温度条件下Df值的稳定性。此外，使用该树脂组合物制备的预浸料及层压板，具有低介电常数、低介质损耗、优异的阻燃性、耐热性、粘结性、低的吸水率及优异的耐湿性等综合性能，适合在无卤高多层电路板中使用。

一种无卤树脂组合物及包含其的挠性覆铜板

本发明提供一种无卤树脂组合物及包含其的挠性覆铜板，所述无卤树脂组合物包括如下组分：环氧化聚丁二烯20～30重量份、多官能环氧树脂18～25重量份、含羧基饱和聚酯树脂10～20重量份、聚酯多元醇5～10重量份、固化剂20～30重量份和阻燃剂15～25重量份；各组分之间的多重化学反应能够实现体系的中温快速固化，且固化后形成致密稳定的互穿交联网络，赋予所述无卤树脂组合物较长的适用期、适宜的触粘性、极低的吸湿性和优异的粘结稳定性，适用于挠性覆铜板的卷对卷制备工艺。包含所述无卤树脂组合物的挠性覆铜板具有优异的剥离强度、耐热性、次表观以及耐化学性，可以满足挠性印制电路的稳定性和可靠性需求。

一种无卤树脂组合物及包含其的挠性覆铜板

本发明提供一种无卤树脂组合物及包含其的挠性覆铜板，所述无卤树脂组合物包括如下组分：环氧化聚丁二烯20～30重量份、多官能环氧树脂18～25重量份、含羧基饱和聚酯树脂10～20重量份、聚酯多元醇5～10重量份、固化剂20～30重量份和阻燃剂15～25重量份；各组分之间的多重化学反应能够实现体系的中温快速固化，且固化后形成致密稳定的互穿交联网络，赋予所述无卤树脂组合物较长的适用期、适宜的触粘性、极低的吸湿性和优异的粘结稳定性，适用于挠性覆铜板的卷对卷制备工艺。包含所述无卤树脂组合物的挠性覆铜板具有优异的剥离强度、耐热性、次表观以及耐化学性，可以满足挠性印制电路的稳定性和可靠性需求。

Phosphorus-modified epoxy resin mixtures of epoxy resins, phosphorus-containing compounds and a hardener, process for their preparation and their use

Phosphormodifizierte Epoxidharzmischungen aus Epoxidharzen, phosphorhaltigen Verbindungen und einem Härter, ein Verfahren zu deren Herstellung und ihre Verwendung

一种阻燃增强pa6复合材料及其制备方法

本发明公开了一种阻燃增强PA6复合材料及其制备方法。本发明的阻燃增强PA6复合材料，按重量份数计，包含尼龙6树脂60‑80份，改性MPP 10‑20份，玻璃纤维20‑40份，抗氧剂0.3‑0.6份，润滑剂0.3‑0.6份，其中，所述改性MPP的制备方法包括：将纳米二氧化硅、磷酸加入到高压反应釜中，反应2‑4h时间后再加入MPP，保持压力不变将温度控制在100±5℃，再加入MA，得到改性MPP。本发明通过对普通市售的MPP进行改性处理既能提升其在基体树脂中的相容性又提升了其本身的刚性，制得的复合材料具有密度低、烟密度低以及CTI值高等特点，成品绿色环保。

Polyolefin based formulations for membranes and fabrics

The invention provides halogen-free, flame-retardant flexible polyolefin-based formulations.

Polyolefin based formulations for membranes and fabrics

Resin composition and process for producing a wire material for a vehicle

Harzzusammensetzung, umfassend:eine Mischung aus einem Basisharz und einem Magnesiumhydroxid-Flammhemmmittel;ein Antioxidans; undein Gleitmittel,worin die Harzzusammensetzung eine Menge von 2 bis 5 Gew.-Teilen des Antioxidans und eine Menge von 0,5 bis 2 Gew.-Teilen des Gleitmittels in Bezug auf 100 Gew.-Teile der Mischung umfasst,worin die Mischung eine Menge von 40 bis 60 Gew.% des Basisharzes und eine Menge von 60 bis 40 Gew.% des Magnesiumhydroxid-Flammhemmmittels auf Basis des Gesamtgewichts der Mischung umfasst,worin die Oberfläche des Magnesiumhydroxid-Flammhemmmittel mit Silan oder aliphatischen oder polymeren Fettsäuren behandelt ist,worin das Basisharz 100 Gew.-Teile eines hoch-kristallinen Polypropylenharzes, eine Menge von 5 bis 10 Gew.-Teilen eines modifizierten Polypropylens und eine Menge von 15 bis 20 Gew.-Teilen eines Elastomers umfasst,worin das hoch-kristalline Polypropylenharz eine Menge von 60 bis 90 Gew.% eines hoch-kristallinen Homo-Polypropylenharzes und eine Menge von 10 bis 40 Gew.% eines hoch-kristallinen Block-Polypropylenharzes auf Basis des Gesamtgewichts des hoch-kristallinen Polypropylenharzes umfasst,worin das Basisharz ferner Maleinsäure in einer Menge von 0,1 bis 3 Gew.-Teilen in Bezug auf 100 Gew.-Teile des Basisharzes; und einen Initiator umfasst. A resin composition comprising:a mixture of a base resin and a magnesium hydroxide flame retardant;an antioxidant; anda lubricant,wherein the resin composition comprises an amount of 2 to 5 parts by weight of the antioxidant and an amount of 0.5 to 2 parts by weight of the lubricant with respect to 100 parts by weight of the mixture,wherein the mixture contains an amount from 40 to 60% by weight of the base resin and an amount of 60 to 40% by weight of the magnesium hydroxide flame retardant based on the total weight of the mixture,wherein the surface of the magnesium hydroxide flame retardant is treated with silane or aliphatic or polymeric fatty acids,wherein the Base resin comprises ...

一种用于电线电缆的高耐温tpe及其制备方法

本发明公开的属于电线电缆技术领域，具体为一种用于电线电缆的高耐温TPE及其制备方法，该用于电线电缆的高耐温TPE的原料包括SEBS、白矿油、共聚PP、聚乙烯、聚烯烃弹性体、聚苯醚、磷氮阻燃剂、有机硅酮母粒、主抗氧剂和辅抗氧剂，该用于电线电缆的高耐温TPE的制备方法的具体步骤如下：S1：制备充油SEBS；S2：向充油SEBS中加入其它原料；S3：将混合原料挤出成型，增塑剂白矿油选用聚a烯烃基础油，抗老化性能突出，PP耐高温但热老化性能不好；免辐照交联，高耐温、无卤高效阻燃、机械性能好，热塑性可回收。

Resin composition for automotive wire material and electric wire using it

본 발명은 자동차용 전선소재용 수지 조성물과 이를 이용한 전선에 관한 것으로서, 더욱 상세하게는 전선소재용 수지조성물을 구성함에 있어서 베이스 수지 중의 폴리프로필렌 함량과 난연제의 함량 등을 조절하고 베이스 수지에 고결정성 Homo 폴리프로필렌(PP) 수지와 고결정성 Block PP 수지를 소정 비율로 함유시켜서 세경화 전선에 적용할 경우 경량화 효과를 가지면서 내마모성 및 내굴곡성 등 물성이 우수한 수지 조성물과 이를 피복재로 이용한 전선에 관한 것이다. The present invention relates to a resin composition for automobile wire material and a wire using the resin composition. More particularly, the present invention relates to a resin composition for wire material, The present invention relates to a resin composition which is excellent in physical properties such as abrasion resistance and bending resistance while having a light weight effect when a homo polypropylene (PP) resin and a highly crystalline block PP resin are contained in a predetermined ratio and applied to a thin wire .

Moisture-curable compositions comprising silane-grafted polyolefin elastomer and halogen-free flame retardant

Compositions useful as coatings for wire and cable comprise, in weight percent (wt%) based on the weight of the composition: (A) 10 to 62 wt% of a silane-grafted ethylene polymer (Si-g-PE) having a silane content of 0.5 to 5 wt% based on the weight of the Si-g-PE, wherein the Si-g-PE is made from an ethylene polymer (base resin) having the following properties. (1) Density of 0.875 to 0.910 g/cc; (2) Melt index (MI, I2) of 8 to 50 g/10 min (190°C/2.16 kg); and (B) 38 to 90 wt% of a halogen-free flame retardant (HFFR); (C) 0 to 0.3 wt% of an antioxidant; and (D) 0 to 1 wt% of a silanol condensation catalyst.

Method for producing flame retardant thermoplastic elastomer composition

Halogen-free flame retardant compositions with improved tensile properties

A composition for use in jacketing or insulation materials is disclosed, the composition comprising from 42 to 54 percent by weight of a halogen-free flame retardant, from 26 to 46 percent by weight of an ethylene alkyl acrylate copolymer, such as ethylene ethyl acrylate, optionally from 0 to 15 percent by weight of an ethylene-based polymer, optionally from 0 to 12 percent by weight of a coupling agent, and optionally from 0 to 1 percent by weight of an antioxidant. A cable insulation layer, a cable protective outer jacket, a cable core sheath, and cable comprising the jacketing material composition are also disclosed. Components comprising the composition exhibit balanced and improved melt rheological, tensile, and flame-retardant properties.

一种无卤阻燃聚酰胺复合材料及其制备方法和应用

本发明公开了一种无卤阻燃聚酰胺复合材料，包括以下组分：短碳链脂肪族聚酰胺树脂20份~80份；无卤阻燃剂15份~20份；甲基三烯丙基异氰脲酸酯0.01份~10份；玻璃纤维10份~50份。所述的无卤阻燃聚酰胺复合材料中聚酰胺分子间具有交联结构。本发明选用短碳链的脂肪族聚酰胺，通过特定配比的无卤阻燃剂，与特定量的甲基三烯丙基异氰脲酸酯协效并用，进行辐照交联处理，不仅能够满足阻燃的需求，而且耐热压性能、耐老化性能和耐热性能都显著提升。

无卤导电tpe电缆料及其制备方法

本发明提供一种无卤导电TPE电缆料及其制备方法，其由氢化苯乙烯‑丁二烯‑苯乙烯、乙烯‑丙烯共聚物、聚丙烯、超导电炭黑、石墨烯、导电碳纤维及可塑剂组成，且更包含表面活性剂、安定剂和润滑剂等，以上各原料在适当的重量配比下混合造粒，制备工艺流程如下：先将部分原料在搅拌机中搅拌混合15‑20分钟，加入超导电炭黑等原料经密炼机密炼、再经过双螺杆挤出、拉条水冷、风干、切粒和打包；采用此配方及工艺制作的无卤导电TPE电缆料，具有导电性能优良、机械强度高、抗撕裂性能优异、生产方式清洁高效等特点。

一种柔性低烟无卤阻燃绝缘粉末及其制备方法

本发明公开了一种柔性低烟无卤阻燃绝缘粉末涂料，其原料包括如下组分：改性环氧树脂A:30~60份，改性环氧树脂B:10~30份，固化剂：15~40份，填料:0~30份，阻燃剂:5~20份，颜料:1~5份，助剂:2~6份，其中固化剂为双氰胺或酚羟基树脂，所述份数为重量份数，本发明柔性低烟无卤阻燃绝缘粉末克服了传统环氧绝缘粉末硬脆的缺点，完美的应用到非标准件及弯头的涂覆上，具有较强的机械性能，同时具有高阻燃性，真正实现了低烟无卤。

无卤树脂组合物以及由其制备的胶膜、覆盖膜和覆铜板

本发明提供一种无卤树脂组合物以及由其制备的胶膜、覆盖膜和覆铜板。所述无卤树脂组合物包含：60至100重量份的含羧基聚酯树脂；5至30重量份的多官能环氧树脂；0.5至10重量份的含氮环氧化合物；10至40重量份的阻燃剂；和40至100重量份的溶剂。通过采用根据本发明的无卤树脂组合物制备的胶膜、覆盖膜和覆铜板具有无卤、耐高温、耐老化、柔韧性优并且剥离强度高的优点。

邻苯二甲酰亚胺改性室温硫化防火硅橡胶及其制备方法

本发明涉及一种邻苯二甲酰亚胺改性室温硫化防火硅橡胶及其制备方法，该改性室温硫化防火硅橡胶通过特定比例的邻苯二甲酰亚胺改性端羟基聚硅氧烷聚合物、阻燃填料、补强填料、增塑剂、色浆、阻燃促进剂、交联剂、复合型硅烷偶联剂、催化剂制备而成。该邻苯二甲酰亚胺改性的防火硅酮胶能够满足各类门窗、幕墙堵漏及密封防火要求，对基材的粘接强度达到2.0MPa以上，产品机械性能优异；尤其是邻苯二甲酰亚胺改性端羟基聚硅氧烷聚合物中N元素的引入及配方中添加的环保阻燃填料和阻燃促进剂，三者共同协同下使得产品阻燃等级达到FV0级。

石油平台用辐照交联耐泥浆无卤阻燃电缆料及其制备方法

本发明一种石油平台用辐照交联耐泥浆阻燃电缆料及其制备方法，原料配方由下列重量份的材料组成：乙烯醋酸乙烯共聚物25~55份，乙烯‑醋酸乙烯‑一氧化碳三元共聚物10~20份，聚乙烯25~45份，聚乙烯接枝马来酸酐的共聚物5～15份，炭黑8~10份，无卤阻燃剂120~160份，偶联剂0.7~1.8份，交联敏化剂1.5~3份，抗氧剂1.4~2.4份，硅酮2~4份，润滑剂0.5~1.2份；其中，所述乙烯醋酸乙烯共聚物中的醋酸乙烯VA含量为33%，此乙烯醋酸乙烯共聚物的熔体指数为0.2g/10min。本发明低烟无毒、委托辐照加工简便、投入成本低的石油平台用辐照交联耐泥浆无卤阻燃电缆料及其制备方法，并且可以生产满足挪威NEK606海上平台用无卤/防泥浆电缆标准的无卤阻燃耐泥浆护套料。

一种交联无卤阻燃绝缘电缆料及其制备方法

本发明公开了一种交联无卤阻燃绝缘电缆料，其特征在于，由下列重量份的原料制成：低密度聚乙烯45-50、ABS高胶粉12-14、纳米二氧化硅23-26、菜籽油4-6、钛酸酯偶联剂TMC-TTS2-3、氧化锌1-2、环氧亚麻子油14-16、硬脂酸钙2-3、二甲基二巯基乙酸异辛酯锡1-2、醋酸乙烯酯4-6、氢氧化铝8-10、三氧化二锑5-8、助剂6-8；本发明电缆料的抗拉强度高，适应的温度范围广，不会因有毒气体造成人生命财产的损坏，而且生产成本低。

Epoxy Resin Compound for Sealing Semiconductive Device

본 발명은 반도체소자 밀봉용 에폭시 수지 조성물에 관한 것으로, 보다 상세하게는 올소크레졸 노볼락계 에폭시 수지; 디글리시딜 헥사메틸 바이페닐계 에폭시 수지; 페놀 노볼락 및 사이클로 펜타디엔으로 이루어진 군으로부터 선택된 1종 이상의 경화제; 경화촉진제; 보조촉매; 및 무기 충전제를 포함하는 반도체소자 밀봉용 에폭시 수지 조성물에 있어서, 포스파젠계 난연제를 포함하는 것을 특징으로 하는 반도체 소자 밀봉용 에폭시 수지 조성물에 관한 것이며, 본 발명에 의해 칩과 봉지재간의 접착특성을 향상시키면서 할로겐이 포함되지 않아 친환경성이 증진되고, 신뢰성이 우수한 반도체 소자 밀봉용 에폭시 수지 조성물을 제공할 수 있다. The present invention relates to an epoxy resin composition for sealing semiconductor devices, and more particularly, to an allsocresol novolac epoxy resin; Diglycidyl hexamethyl biphenyl epoxy resin; At least one curing agent selected from the group consisting of phenol novolac and cyclopentadiene; Curing accelerators; Cocatalyst; And an epoxy resin composition for sealing semiconductor elements comprising an inorganic filler, wherein the epoxy resin composition for sealing semiconductor elements comprises a phosphazene-based flame retardant. It is possible to provide an epoxy resin composition for sealing a semiconductor device, which is environmentally friendly and has excellent reliability because halogen is not included while improving.

用于制备阻燃热塑性弹性体组合物的方法

本发明涉及一种用于制备阻燃热塑性弹性体组合物的方法，其中所述方法包括：通过将含有(A)乙烯-α-烯烃系共聚橡胶、(B)丙烯系聚合物和(C)矿物油系软化剂的热塑性弹性体组合物前体在(D)交联剂的存在下动态硫化制备热塑性弹性体组合物的步骤，以及将热塑性弹性体组合物、(E)无卤素阻燃剂、(F)氧化锌及任选的(G)多羟基化合物捏合的步骤。

一种含离子液体的纳米磷腈微球及其制备方法和应用

本发明公开了一种含离子液体的纳米磷腈微球及其制备方法，具体制备方法包括：将六氯环三磷腈溶于溶剂中，加入N‑烷基咪唑，在反应温度为30～40℃、超声功率为140～160W条件下超声反应0.5～1.5h；继续加入交联剂和缚酸剂，在反应温度为0～5℃、超声功率为240～260W条件下继续超声反应2～5h，经过后处理得到含离子液体的纳米磷腈微球。本发明方法不仅提高了产物的产率，还极大的简化了制备工艺，制得的纳米磷腈微球对聚烯烃材料具有良好的阻燃作用，加入10％的纳米磷腈微球可将PE和PP的LOI分别提高到28.7％和28.2％。

Non-halogen varnish and a prepreg and a laminated substrate thereof

가공성이 우수한 프리프레그가 얻어지는 할로겐 프리 에폭시 수지 조성물을 제공한다. 할로겐 프리 에폭시 수지 조성물로서, 성분(A): 적어도 하나의 할로겐 프리 에폭시 수지와; 성분(B): 경화제와; 성분(C): 난연 경화제와; 성분(D): 경화 촉진제와; 성분(E): 적어도 실리카, 알루미늄 화합물, 산화나트륨, 산화칼륨, 및 산화마그네슘을 포함하는 복합 무기 분체로 이루어지는 충전재와; 성분(F): 메타크릴로일옥시기(methacryloyloxy)와 메톡시실란을 가지는 실란커플링제인 계면제를 포함하는 할로겐 프리 에폭시 수지 조성물. The halogen-free epoxy resin composition from which the prepreg excellent in workability is obtained is provided. As a halogen free epoxy resin composition, Component (A): at least one halogen-free epoxy resin; Component (B): a curing agent; Component (C): a flame retardant curing agent; Component (D): a curing accelerator; Component (E): a filler consisting of a composite inorganic powder comprising at least silica, an aluminum compound, sodium oxide, potassium oxide, and magnesium oxide; Component (F): The halogen-free epoxy resin composition containing the surfactant which is a silane coupling agent which has a methacryloyloxy group and a methoxysilane.

一种高熔指无卤阻燃聚丙烯材料及其制备方法

本发明涉及高熔指无卤阻燃聚丙烯材料及其制备方法，包括以下组分及重量份含量：聚丙烯基材60‑80份；焦磷酸哌嗪0.1‑20份；表面改性聚磷酸铵0.1‑20份；三聚氰胺或其盐0‑10份；偶联剂0.1‑3份；相容剂0.1‑3份；抗氧剂0.1‑3份；光稳定剂0.1‑3份；白油0.1‑1份。按重量份称取原料，将烘干的聚丙烯基材和白油在双运动混合机中预混合5‑8分钟，实现均匀混合；按重量份再加入焦磷酸哌嗪、表面改性聚磷酸铵、三聚氰胺或其盐、偶联剂、相容剂、抗氧剂、光稳定剂，继续混合5‑8分钟，得到均匀混合物；置于双螺杆挤出机加料口，物料经螺杆混炼挤出后，从模头挤出。与现有技术相比，本发明无卤聚丙烯材料能有效解决传统三嗪成炭剂体系高污染、阻燃剂与基体相容性差、阻燃效率低等问题。

Flame retardant thermoplastic resin composition based on polycarbonate

PURPOSE: A flame retardant thermoplastic resin composition based on polycarbonate is provided to prevent the generation of stress crack and the generation of liquid impurities by the volatilization of the flame retardant. CONSTITUTION: The flame retardant thermoplastic resin composition comprises: (A) 50 to 95 wt% of a thermoplastic polycarbonate resin containing no halogens; (B) 5 to 50 wt% of a rubber-modified and styrene-containing graft copolymer resin which contains no halogens; (C) 0 to 30 wt% of a styrene-containing copolymer resin which contains no halogens; (D) an alkylated triphenylphosphate consisting of 1 to 20 wt% of a trialkyl phenyl phosphate, 10 to 50 wt% of a dialkyl phenyl monophenyl phosphate, 15 to 60 wt% of a monoalkyl phenyl diphenyl phosphate and less than 2 wt% of triphenyl phosphate; and (E) a fluorinated polyolefin resin, wherein (D) and (E) are used in the amount of 3 to 20 wt% and 0 to 2 wt%, respectively, based on 100 wt% of (A)+(B)+(C).

一种3d打印用光固化组合物及光固化件

本申请涉及一种3D打印用光固化组合物及光固化件，光固化组合物，包括含磷丙烯酸酯低聚物或含磷丙烯酸酯单体、活性稀释剂、酰基氧化膦类光引发剂、热交联剂、含有反应性羟端基的氧化膦衍生物及无卤膨胀型阻燃剂；其中，所述热交联剂为封闭型异氰酸酯，封闭型异氰酸酯加热后能够生成可与羟基反应的反应型异氰酸酯；所述活性稀释剂为带有丙烯酸酯基团的单体、带有乙烯基的单体、带有马来酰亚胺基团的化合物中的一种或几种；所述光固化件由以下方法制备而成：将光固化组合物经立体光固化成型后得到固化物，之后对固化物进行清洗、UV光固化处理和热固化处理；本发明制备的光固化件阻燃效果好，力学性能优异。

低翘曲率的无卤阻燃碳纤维增强尼龙合金材料及制备方法

本发明属于碳纤维增强尼龙材料技术领域，公开了一种低翘曲率的无卤阻燃碳纤维增强尼龙合金材料及其制备方法和在电子电器、航空航天、交通运输、电动工具等领域中的应用，特别适用于一些薄壁且对材料力学性能要求较高的电子器件和电动工具。该材料包含以下质量百分数的组分：尼龙32.5～57.7％；丙烯腈-丁二烯-苯乙烯塑料5～15％；碳纤维5～25％；玻璃纤维5～25％；无卤阻燃剂5～12％；阻燃协效剂1～5％；相容剂0～5％；其他助剂0.1～0.3％。本发明利用PA/ABS作为合金基体，玻璃纤维和碳纤维复配增强，获得优异力学性能的同时，降低密度，提高流动性，降低内应力，降低薄壁制品的翘曲率。

一种阻燃型聚烯烃高分子复合材料及其制备方法

本发明公开一种阻燃型聚烯烃高分子复合材料，其是由聚烯烃70～94wt％、有机磷氮阻燃剂5～25wt％以及无机阻燃剂0.5～15wt％制成。本发明还公开所述阻燃型聚烯烃高分子复合材料的制备方法。本发明有益效果是：有机磷氮阻燃剂具有笼状优良结构，无卤、低毒且阻燃性能高效，可以用于替代卤系阻燃材料；使用有机磷氮阻燃剂与无机阻燃剂复配，两种阻燃剂协同增效，大大加强了聚烯烃与阻燃剂的相互作用，提升了整体的阻燃性，热释放速率下降60～80％；极限氧指数提升130～200％，可广泛应用于电缆、开关等家电家具及需阻燃的其他器件。

一种低烟无卤硅烷自然交联聚烯烃电缆料及其制备方法

本发明提供了一种低烟无卤硅烷自然交联聚烯烃电缆料，由下列重量份的组分原料制备而得：线性低密度聚乙烯？20-40、高密度聚乙烯？10-20、聚乙烯辛烯共弹性体？20-40、乙烯-醋酸乙烯共聚物？10-20、PVC糊树脂10-15、硫代二丙酸二月桂酯2-3、月桂酸马来酸二正丁基锡1-2、次磷酸铝20-25、三聚氰胺焦磷酸盐1-2、氢氧化镁10-15、硼酸锌5-10、双（3,5-三级丁基-4-羟基苯基）硫醚？1-3、聚乙烯蜡2-4、聚四氟乙烯1-2、改性填料5-10、乙烯基三(2-甲氧基乙氧基)硅烷3-5、N-水杨酰胺基邻苯二酰亚胺1-2、过氧化二苯甲酰1-3。本发明与普通的低烟无卤聚烯烃电缆料相比,提高了产品的耐温等级,提高了机械性能,消除了普通低烟无卤聚烯烃电缆料易开裂的问题。

一种无卤阻燃剂的制备方法及其阻燃聚烯烃组合物

本发明公开了一种无卤阻燃剂的制备方法及其阻燃聚烯烃组合物，属于阻燃剂制备领域。其中，二磷酸哌嗪的制备方法为使按比例的磷酸和哌嗪反应后，通过喷雾干燥处理制备得到二磷酸哌嗪；焦磷酸哌嗪的制备方法为结合上述二磷酸哌嗪的制备方法，将得到的二磷酸哌嗪在隋性气氛或真空条件下进行脱水缩合反应后得到。本发明还提供了一种阻燃聚烯烃组合物，该组合物包括100质量份的聚烯烃树脂、10~100质量份所述方法制备的焦磷酸哌嗪等。所述制备方法制备二磷酸哌嗪的收率>95%，焦磷酸哌嗪具有>90的以W值表示的白度。所述阻燃聚烯烃组合物具有优良的阻燃性能，焦磷酸哌嗪的添加量少，且具有优异的着色性能，具有极佳的工业应用前景。

一种无卤阻燃pc/abs合金料及其制备方法

本发明公开了一种无卤阻燃PC/ABS合金料及其制备方法，合金料由如下重量百分比的组分组成：PC树脂70％‑80％；ABS树脂10％‑20％；相容剂1％‑4％；无卤磷酸酯阻燃剂2％‑4％；石墨烯2％‑4％；硅酸盐耐热剂1％‑2％；抗滴落剂0.2％‑0.4％；助剂0.5％‑1％。本发明的无卤阻燃PC/ABS合金料能够大幅减少无卤阻燃剂的添加量，又能提高PC/ABS合金材料的耐热性能的同时不降低其力学性能，使其阻燃等级也可以达到1.5mm V‑0级。

一种无卤隔氧层电缆料及其制备方法和用途

本发明提供一种无卤隔氧层电缆料及其制备方法和用途，所述无卤隔氧电缆料包括如下重量份的原料组分：基体树脂30～50份，基体阻燃剂100～150份，含硅成壳助剂5～15份，润滑助剂4～8份，抗氧剂1～2份，色母或色粉1～3份。本申请中提供一种新的无氧隔氧电缆料及其制备方法，其有效地避免了材料在燃烧过程中产生的熔滴和膨胀现象，且具有较低的热释放速率和热释放总量，产烟量也不大，并且电缆料在保持一定的机械性能的情况下，还具有良好的挤出性能。

一种耐油无卤阻燃tpe电缆料及其制备方法

本发明涉及一种耐油无卤阻燃TPE电缆料及其制备方法，其特征在于，按重量份数包含如下组分：苯乙烯系热塑性弹性体20‑70份；相容剂2‑15份；耐油及加工性能改性剂10‑30份；聚烯烃弹性体10‑50份；PP 5‑25份；PPO 5‑25份；阻燃剂15‑35份；填充油5‑50份；润滑剂0.2‑5份；抗氧剂0.2‑2份；上述各组分含量之和约为100份。本发明的电缆料耐热、耐油、耐老化、综合性能优异，适用于电动汽车车载充电线或充电桩充电线绝缘、护套料。

一种低烟无卤阻燃抗开裂电缆料及其制备方法

本发明公开了一种低烟无卤阻燃抗开裂电缆料及其制备方法，其由下列重量份的原料配制而成：高密度聚乙烯65‑75、乙烯‑醋酸乙烯共聚物30‑40、烷基磺酸苯酯7‑9、二乙醇胺硼酸酯4‑6、二甲基丙烯酸镁3‑5、氢氧化镁8‑10、甲苯基二苯基磷酸酯40‑50、3‑氨丙基三乙氧基硅烷4‑7、三甲基硅烷基笼形聚倍半硅氧烷7‑9、有机锑稳定剂6‑8、对苯二胺5‑7、纳米硬硼钙石30‑40、奥米矿物纤维8‑10、六氯环三磷腈8‑10、巴西棕榈蜡6‑8、聚芳醚醚腈10‑12、碳化锆7‑8、麻刀灰5‑8、次磷酸钙4‑6、高耐磨炭黑8‑12。本发明的电缆料具有很好的阻燃效果，而且发烟少，同时还具有很好的抗开裂性能。

用于低烟无毒阻燃耐油型电缆料的制造工艺

本发明一种用于低烟无毒阻燃耐油型电缆料的制造工艺，包括以下步骤：步骤一、按配方称取所述聚烯烃热塑性弹性体、乙烯基聚合物接枝聚醚多元醇、乙华平橡胶、马来酸酐接枝无定形聚烯烃、氢氧化铝、分子筛、有机聚硅氧烷偶联剂、环烷基橡胶油、主抗氧剂、辅助抗氧剂，经高速混合机混合5~10分钟后，通过密炼机捏合，捏合温度为140~160℃；步骤二、再通过双螺杆挤出机挤出造粒成型，挤出温度为140~160℃。本发明抗张强度和断裂伸长率均得到显著改善同时，热释放速率、烟释放速率也大幅度降低，并且增加炭层的坚硬密实程度、降低了烟的释放。

防粘连耐刮擦光缆用绝缘料

本发明公开一种防粘连耐刮擦光缆用绝缘料，其特征在于：所述防粘连耐刮擦光缆用绝缘料由以下重量份的组分组成：乙烯‑醋酸乙烯酯共聚物65~75份，高压茂金属聚乙烯20~30份，改性聚乙烯10~20份，氢氧化铝70~110份；氢氧化镁30份，硅酮母料4.5份，聚乙烯蜡 1.8份，流动剂30份，抗氧剂0.45份，黑母料4份；所述乙烯‑醋酸乙烯酯共聚物的VA含量在20~28%，母料炭黑含量45%~50%。本发明解决了使得光缆外径均匀，从而保证了光缆芯的收缩完整性，信号在其中传输过程中不会出现大幅度衰减；同时，降低产品在挤出时的流动性，提高产品加工性能。

一种无卤阻燃pet材料及其制备方法

本发明涉及PET材料的技术领域，提供了一种无卤阻燃PET材料，按重量百分比计，原料至少包含：7‑15％次磷酸锌，4‑12％氮系阻燃剂，聚烯烃塑料补充余量。该方法可使PET复合材料的阻燃性能达到UL‑94V‑0级，保持良好热稳定性的同时避免了高添加量Zn‑MEP对材料力学性能的消极影响。

一种耐候性电缆绝缘材料及其制备方法

本发明公开了一种耐候性电缆绝缘材料及其制备方法，该绝缘材料按照重量份的原料包括：氟硅树脂15‑30份、增韧剂1‑10份、钛酸丁酯0.1‑3份、玻璃纤维1‑8份、防老剂1‑5份、滑石粉5‑20份、硬脂酸0.1‑3份、过氧化二异丙苯1‑8份、白炭黑15‑45份、乙烯基三甲氧基硅烷1‑5份、防辐射剂5‑35份、交联剂1‑15份、稳定剂1‑8份。将氟硅树脂与玻璃纤维密炼；加入剩余原料混炼，再在开练机薄通1‑2次，过滤，三辊压延机压延、室温存放、混炼；在开炼机薄通1‑2次，三辊压延机压延开条出片、冷却即得。本发明具有优异的力学性能和耐高温性能，低烟无卤阻燃，环保安全，老化性能优异，使用寿命长。且该制备方法步骤简单，原料易得。

一种含有新型胶囊阻燃剂的低烟无卤电缆料及其制备

本发明涉及一种含有新型胶囊阻燃剂的低烟无卤电缆料及其制备，所述电缆料由包含以下组分及其重量份含量的原料制备而成：乙烯‑醋酸乙烯共聚物40‑60份、氟硅橡胶20‑40份、萜烯树脂10‑20份、茂金属聚乙烯20‑30份、胶囊阻燃剂25‑40份、相容剂15‑25份、补强剂5‑10份、稳定剂3‑9份、过氧化物交联剂0.3‑0.8份、润滑剂0.5‑1份以及抗氧剂0.2‑1份。与现有技术相比，本发明电缆料的制备工艺简单，具有很好的成型加工性，且耐油污、耐候性好，具有突出的阻燃抑烟效果，兼具良好的机械强度和韧性，保证了电缆的工作性能和使用寿命，大大提高了电缆使用时的安全性和可靠性。

一种紫外光交联低烟无卤阻燃电缆料及其制备方法

本发明提供一种紫外光辐照交联低烟无卤阻燃电缆料，所述电缆料包含聚烯烃、相容剂、无机阻燃剂、有机磷氮系阻燃剂、阻燃协效剂、光引发剂、助交联剂、表面活性剂、抗氧剂和润滑剂；所述聚烯烃含有重量份配比为10-25：20-35：55-65的低密度聚乙烯，乙烯-辛烯共聚物和乙烯-醋酸乙烯酯共聚物；相容剂为用马来酸酐接枝的聚乙烯；无机阻燃剂选自氢氧化镁和氢氧化铝；有机磷氮系阻燃剂含有重量份配比为10-20：4-8：15-30的多聚磷酸胺、季戊四醇和三聚氰胺；和阻燃协效剂含有硼酸锌和/或聚二甲基硅氧烷。本发明的电缆料耐热老化性能好，能够在125℃条件下长期使用，综合机械性能优越，阻燃性能较好。

光缆用抗粘连低烟无卤阻燃电缆料

本发明公开一种光缆用抗粘连低烟无卤阻燃电缆料，由以下重量份的组分组成：乙烯‑醋酸乙烯酯共聚物65~75份，高压茂金属聚乙烯20~30份，改性聚乙烯10~20份，氢氧化铝70~110份，氢氧化镁20~30份，硅酮母料2~5份，聚乙烯蜡1~3份，流动剂30~50份，抗氧剂0.15~0.45份，黑母料2~5份；所述乙烯‑醋酸乙烯酯共聚物的VA含量在20~28%；所述高压茂金属聚乙烯在190℃、2.16Kg下熔融指数≤3g/10min，密度小于0.92g/cm³。本发明解决了使得光缆外径均匀，从而保证了光缆芯的收缩完整性，信号在其中传输过程中不会出现大幅度衰减；同时，电缆拉伸强度≥13MPa，断裂伸长率≥250%，氧指数≥34%，具有优异的机械性能。

阻燃防静电聚丙烯组合物和由其制备的发泡珠粒

本发明主要提供了一种阻燃聚丙烯组合物、一种阻燃防静电聚丙烯组合物以及一种阻燃(防静电)聚丙烯发泡珠粒，及其制备方法和应用。其中，所述阻燃抗静电聚丙烯发泡珠粒由包含高熔体强度聚丙烯基础树脂、阻燃抗静电组合物、泡孔成核剂以及任选的抗氧剂等助剂的阻燃抗静电聚丙烯组合物经过发泡工艺制备而成，所述聚丙烯基础树脂包括丙烯均聚物组分和乙烯‑1‑丁烯共聚物组分。由所述阻燃抗静电聚丙烯发泡珠粒制备的成型体具有良好的阻燃、抗静电性能，同时具有优良的力学性能，用途广泛。

无卤高阻燃电缆料、电缆及其制备方法

本发明公开了一种无卤高阻燃电缆料，所述电缆料的各组分及重量份数如下：基础树脂 85份；工程母粒15份；氢氧化铝和氢氧化镁的组合物 150～180份；加工助剂 3～5份；抗氧剂 1～2份；润滑剂1～2份；偶联剂1.5～3份；补强剂5～8份；交联剂2～4份；所述的基础树脂为两种乙酸乙烯含量不同的乙烯‑乙酸乙烯共聚物的组合；其中一种乙酸乙烯含量为40%，另一种乙酸乙烯含量为14%；两者的重量组分比为(55～65)：(20～30)；所述工程母粒为EVA接枝马来酸酐相容剂。本发明采用两种乙酸乙烯含量不同的乙烯‑乙酸乙烯共聚物的组合以及EVA接枝马来酸酐相容剂配合使用，解决了现有的无卤高阻燃电缆料机械性能较差、以及不耐老化和不耐应力开裂的缺陷。

核电站通信光缆用1e级k1类无卤阻燃电缆料及其制备工艺

本发明公开一种核电站通信光缆用1E级K1类无卤阻燃电缆料及其制备工艺，由硅烷接枝弹性体和阻燃催化剂母粒组成，硅烷接枝弹性体由以下重量份的组分熔融接枝后获得：乙烯‑丙烯酸乙酯共聚物、聚乙烯辛烯共聚物、乙烯基三甲氧基硅烷、过氧化二异丙基苯；所述阻燃催化剂母粒由以下重量份的组分熔融共混获得：乙烯‑丙烯酸乙酯共聚物、氢氧化镁、硼酸锌、纳米蒙脱土、二月桂酸二正辛基锡、抗氧剂、防老剂MBZ、光稳定剂770、润滑剂。本发明K1类硅烷交联无卤阻燃电缆料可以方便的控制材料的交联程度，通过调整阻燃催化剂母粒的添加比例可以调整阻燃性能和交联速度，使整个材料方便可控。

绝缘电线和电缆

本发明提供一种绝缘电线和电缆，目的在于提供具备低温特性、可挠性、耐油性、耐寒性、阻燃性以及机械特性的绝缘电线和电缆。绝缘电线具备导体和形成于所述导体外周的绝缘层的，绝缘层由无卤阻燃性树脂组合物构成，其中相对于含有乙烯-乙酸乙烯酯共聚物的基础聚合物添加金属氢氧化物，金属氢氧化物含有氢氧化镁，基础聚合物的乙酸乙烯含量为20质量％以上且小于50质量％。所述绝缘层具有优良的阻燃性、机械特性、低温特性和耐寒性。

一种汽车线用热塑性低烟无卤高阻燃材料及其制备方法

本发明公开了一种汽车线用热塑性低烟无卤高阻燃材料及其制备方法，其中热塑性低烟无卤高阻燃材料包括如下重量份数的各组分：聚烯烃基材80～90份；相容剂10～20份；抗氧剂0.5～1.5份；阻燃剂150～170份；润滑剂1～3份；硅烷偶联剂1～3份；无卤色母粒0～6份；所述的聚烯烃基材与相容剂的总重量份数为100份。本发明提供的材料无需辐照就能达到很好的耐油耐磨效果，从而降低了成本，同时阻燃等级能达到很高的水平，该材料特别在耐矿物油、耐汽油和耐导热油方面性能优异。该热塑性低烟无卤阻燃材料耐磨、耐高温、耐油、高阻燃且无害，可很好的用于汽车线；同时本发明提供的制备方法，其步骤简便且容易操作。

一种阻燃剂选择性分布的无卤阻燃聚苯乙烯及其制备方法

一种阻燃剂选择性分布的无卤阻燃聚苯乙烯及其制备方法，它涉及一种无卤阻燃聚苯乙烯及其制备方法。本发明是要解决现有无卤阻燃聚苯乙烯中阻燃剂阻燃效率低，在火灾中燃烧产生大量熔滴，增加了火灾蔓延带来的威胁和消防救援过程中火灾的扑灭难度。阻燃剂选择性分布的无卤阻燃聚苯乙烯按重量份数由聚苯乙烯、阻燃剂、成炭剂和阻燃协效剂制成。方法：按配比称量聚苯乙烯、阻燃剂、成炭剂、阻燃协效剂加入到由液氮包裹的粉碎腔中，粉碎获得阻燃剂包覆的聚苯乙烯粒子，将上述粒子加入模具热压成型获得阻燃剂选择性分布的无卤阻燃聚苯乙烯。本发明用于制备阻燃剂选择性分布的无卤阻燃聚苯乙烯。

一种高效无卤膨胀阻燃橡胶体系及其制备方法

本发明提供的高效无卤膨胀阻燃橡胶体系包含的组分及配比按质量份计如下：橡胶100份，补强剂30～50份，结构控制剂0～10份，硫化剂0.5～2份，促进剂0.1～2份，阻燃剂1～20份，协效剂1～20份，该橡胶体系的拉伸强度为5.4～33.8MPa，LOI为28.9～45.5％，UL-94为V-1～V-0。本发明还提供了制备方法。本发明提供的橡胶体系因添加有与之匹配的阻燃剂和阻燃协效剂，不仅添加量少，对机械性能影响很小，且还能同时达到很好的阻燃效果。

一种光伏电缆用无卤阻燃绝缘料

本发明涉及到一种光伏电缆用无卤阻燃绝缘料，属于电缆新材料技术领域。该光伏电缆用无卤阻燃绝缘料包括以下组分及重量份数：基础树脂100份；阻燃剂10～45份；稳定剂1～8份；交联敏化剂1～8份。本发明解决了现有电缆材料在太阳能发电站恶劣的环境下现有的光伏电缆用无卤阻燃绝缘料的拉伸强度、断裂伸长率等机械性能较差、耐热老化性能较差、使用寿命较短等问题。本绝缘材料的生产成本低，机械性能得到改善，尤其是耐高温，耐候性得到明显的改善。

Flame-retardant thermoplastic material and expanded beads thereof

본 발명은 열가소성 베이스 수지, 난연제 및 선택적인 항산화제를 포함하는 난연성의 열가소성 물질에 관한 것으로서, 난연제는 포스핀 옥사이드와 전이 금속 염의 착물을 포함한다. 또한, 본 발명은 난연성의 열가소성 발포 비드 (flame-retardant thermoplastic expanded bead)에 관한 것이다. 난연성의 열가소성 발포 비드로부터 제조되는 폼 몰딩 (foam molding)은 난연성과 대전방지성이 양호하며, 기계적 특성이 우수하고, 널리 사용된다. The present invention relates to a flame retardant thermoplastic material comprising a thermoplastic base resin, a flame retardant and an optional antioxidant, the flame retardant comprising a complex of a phosphine oxide and a transition metal salt. The present invention also relates to a flame-retardant thermoplastic expanded bead. Foam molding produced from flame-retardant thermoplastic foam beads has good flame retardancy and antistatic properties, has excellent mechanical properties, and is widely used.

一种高阻燃无卤聚烯烃电缆料及其制备方法

一种高阻燃无卤聚烯烃电缆料及其制备方法。所述高阻燃无卤聚烯烃电缆料，由如下组份组成：乙烯共聚物20～70份；聚乙烯5～30份；金属氢氧化物10～60份；有机磷酸盐阻燃剂3～20份；三聚氰胺化合物3～30份；相容剂4～10；其它助剂2～5。制备方法如下（1）首先将粒状原料投入高速混合机中，在低速搅拌30秒后添加液体助剂高速混合3分钟后停机，之后加入粉状原料高速混合3分钟后停机，得到预混料。（2）将上述的预混料加入密炼机混炼15分钟后，再经同向双螺杆混炼，最后经单螺杆挤出风冷热切造粒，挤出温度设定为90～130℃之间。

一种耐析出无卤阻燃聚丙烯复合材料及其制备方法

本发明涉及一种耐析出无卤阻燃聚丙烯复合材料及其制备方法，所述复合材料包括聚丙烯、阻燃剂、成炭剂等。本发明的聚丙烯复合材料具有优异的阻燃性能与机械性能，同时在高温高湿条件下长时间存放后仍能保持良好的外观和阻燃性能，可以应用于对阻燃材料的综合要求较高的新能源汽车行业。

低烟无卤阻燃电缆料

本发明提供了低烟无卤阻燃电缆料，由下列重量份的原料制成：聚乙烯30-40、EVA20-30、氢氧化镁40-60、纳米碳化硅5-6、纳米氮化铝粉0.2-0.4、水滑石4-6、钼酸锌2-3、乙烯-辛烯共聚物接枝马来酸酐2-4、磷酸三甲苯酯0.1-1、硬脂酸钙1-2、硬脂酸0.5-1.0、紫外线吸收剂UV-531？0.2-0.4、改性填料8-10。本发明的电缆料不仅具有优异阻燃性和不延燃性；燃烧时发烟量非常少，不产生有毒气体，不产生腐蚀性气体，而且同时具有良好的耐低温、耐油性、抗紫外线性。

一种无析出无卤素阻燃剂组合物

本发明涉及的一种无析出无卤素阻燃剂组合物，各组分及其质量含量如下：哌嗪无机酸盐为30～80％；PAN‑DCD和/或FB为15～55％；金属氧化物和/或金属盐为5～10％；有机硅材料为0～5％；PAN‑DCD的结构式如下： FB的结构式如下： 式中，w为大于或等于10的整数，k、m、n、p和q为大于或等于1的整数，A ‑ 为金属含氧酸给出质子后形成的离子，含量为28wt％的包含该组合物的阻燃聚丙烯制品，在70℃纯净水浸泡168小时后，表面无白色析出物出现。本发明的组合物具有热稳定性好、阻燃效率高、与聚合物相容性好、成炭性和综合性能优异等特点，可以实现绿色环保生产，具有极好的推广价值。

一种聚烯烃绝缘料及其制备方法和用途

本申请涉及一种聚烯烃绝缘料及其制备方法和用途，更特别地涉及一种具有低成本、较好的耐温性(耐125℃)，较高放线速度，以及电缆绝缘层薄壁特性的硅烷交联低烟无卤阻燃聚烯烃绝缘料及其制备方法和用途，属于电线电缆料技术领域。本申请的聚烯烃绝缘料具有较好的机械性能，较好的电性能，最大优势是绝缘层交联均匀，具有优异的耐温性，防止线缆粘连，且抗预交联效果好。在高速放线情况下，线缆表面无熔体破裂、光滑。更适合耐温等级高，线缆表面要求高，且绝缘层薄的低烟无卤阻燃电缆。

阻燃剂、阻燃防静电组合物和阻燃防静电聚丙烯发泡珠粒

本发明提供了一种阻燃剂和复合阻燃剂、阻燃抗静电组合物、阻燃抗静电聚丙烯组合物和阻燃抗静电聚丙烯发泡珠粒，及其制备方法和应用。其中，所述阻燃抗静电聚丙烯发泡珠粒由包含高熔体强度聚丙烯基础树脂、阻燃抗静电组合物、泡孔成核剂以及任选的抗氧剂等助剂的阻燃抗静电聚丙烯组合物经过发泡工艺制备而成，优选所述聚丙烯基础树脂包括丙烯均聚物组分和丙烯‑乙烯共聚物组分。由所述阻燃抗静电聚丙烯发泡珠粒制备的成型体具有良好的阻燃、抗静电性能，同时具有优良的力学性能，用途广泛。

一种高导热高灼热丝无卤阻燃尼龙复合材料及其制备方法

本发明提供了一种高导热高灼热丝无卤阻燃尼龙复合材料及其制备方法，采用的大片径石墨烯和纳米氧化铝作为导热添加剂，极大提升了复合材料导热性能；用超细粉体纳米层状滑石粉和氧化锌作为灼热丝协效剂，提升了复合材料的灼热丝起燃温度；用异丁基次磷酸铝和氢氧化镁作为阻燃剂，阻燃效率高，同时避免了含卤阻燃剂在阻燃过程中释放出具有强致癌作用的卤化氢气体危害；抗氧剂的加入，避免了尼龙树脂因氧化导致力学性能下降；氨基硅烷偶联剂的加入提升了尼龙复合材料的力学性能；乙撑双硬脂酰胺和季戊四醇作为加工润滑剂，极大提升了改性填料的改性效率；总而言之，本发明产品同时具备高导热、高灼热丝、高力学性能以及无卤阻燃的特性。

一种耐刮擦阻燃pp改性材料及其制备方法

本发明属于高分子材料技术领域，尤其涉及一种耐刮擦阻燃PP改性材料，包括以下质量份的组成：嵌段共聚聚丙烯35～60份、无规共聚聚丙烯10～20份、耐刮擦助剂3～8份、增韧改性剂1～5份、无卤阻燃剂2～7份、阻燃协效剂1～2份、润滑剂1～3份和抗氧剂1～2份；所述耐刮擦助剂为纳米氧化铝和聚丙烯接枝高分子量聚有机硅氧烷；所述增韧改性剂为丙烯酸‑聚硅氧烷橡胶‑甲基丙烯酸甲酯多元共聚物和/或丙烯酸‑乙丙橡胶‑甲基丙烯酸甲酯多元共聚物。相比于现有技术，本发明的PP改性材料在具有耐刮擦性能的同时，其韧性和阻燃性能也相应得到改善。

低烟无卤阻燃电缆料及其制备方法

本发明公开了一种低烟无卤阻燃电缆料，所述电缆料原料按重量份数包括如下组分：基础树脂120~160份、无卤阻燃剂200~300份、硅烷表面改性剂2~4份、相容剂20~35份、抗氧剂2~4份。本发明制备的低烟无卤阻燃电缆料，在保证电缆料绝缘性能和机械性能的基础上，阻燃效果好，而且无卤，燃烧不会有害烟气。并且，本发明的电缆料中加入了抗氧剂，可以提高电缆料的耐温及耐老化性能。同时，本发明的电缆料在制备过程中不需要先将原料进行密炼而直接混合后进行挤出造粒，通过增大造粒机的长径比以及增加相容剂、硅烷表面活性剂含量来保证其捏合效果。制备方法简单、成本低、实用性强。

一种低添加量无卤阻燃聚丙烯材料及其制备方法

本发明公开一种低添加量无卤阻燃聚丙烯材料及其制备方法，所述阻燃聚丙烯材料具体涉及以下组成成分：聚丙烯，膨胀型阻燃剂和阻燃协效剂。其中，膨胀型阻燃剂的质量分数为14％～18％，阻燃协效剂的质量分数为0.5％～3％，整个阻燃体系的添加量不超过20％。该阻燃聚丙烯材料可以达到UL‑94的V‑0级别，氧指数可达33.5％，且具有优异的力学性能和低廉的成本。

一种低烟无卤中高压直流电缆用聚烯烃电缆料及制备方法

本发明公开了一种低烟无卤中高压直流电缆用聚烯烃电缆料及制备方法。由交联聚乙烯、改性复合基础阻燃剂、改性复合协效阻燃剂、复合润滑剂、增容剂、分散剂、偶联剂、复合交联剂、抗氧剂混合后，利用三螺杆挤出机熔融共混挤出得到的产品；所述熔融共混的各组分的质量分数为：交联聚乙烯（XLPE）60~80份、改性复合基础阻燃剂10~20份、改性复合协效阻燃剂5~10份、复合润滑剂3~7份、增容剂2~5份、偶联剂1~3份、分散剂0.5~1.5份、复合交联剂0.5~1.5份、抗氧剂0.1~0.3份。

一种低烟无卤高刚性的阻燃pc/abs材料及其制备方法

本发明提供一种低烟无卤高刚性的阻燃PC/ABS材料，包括以下原料按重量份制备而成：ABS高胶粉3‑10份、中流动PC5‑30份、高流动PC50‑70份、抗氧剂0.1‑1份、阻燃剂10‑30份、抗滴落剂0.2‑1.4份、抗紫外线剂0.1‑0.5份、润滑剂0.2‑1份。本发明得到的PC/ABS材料与现有技术相比的优点包括：PC/ABS材料阻燃性能大幅度提高，制备工艺简单。