СПОСОБ ПОЛУЧЕНИЯ УГЛЕВОДОРОДНЫХ СМОЛ И ПРОДУКТОВ ИХ ГИДРИРОВАНИЯ

Группа изобретений относится к углеводородной смоле из по меньшей мере одного циклического диолефинового компонента и по меньшей мере одного ароматического компонента с этиленовой ненасыщенностью и способу ее получения, а также к ее применению в качестве добавки к лаку, модификатора пластика, для улучшения механических и динамических характеристик каучуковых продуктов, добавки и/или гидрофобизатора в битуме, модификатора и/или гидрофобизатора в полипропиленовых пленках, в частности BOPP-пленках, в косметических средствах, в печатных красках, усилителя клейкости для термоклея для применения в промышленности гигиенических изделий и для использования в упаковках для пищевых продуктов. Способ включает смесь мономеров, которая содержит по меньшей мере один циклический диолефиновый компонент и по меньшей мере один ароматический компонент с этиленовой ненасыщенностью с 8-13 атомами углерода, нагревают со скоростью нагревания от 0,5 до 10°С/с до температуры по меньшей мере 180°С. Причем смесь мономеров ...

ТЕРМОПЛАВКИЙ КЛЕЙ ДЛЯ ПОЛИОЛЕФИНОВЫХ ПЛЕНОК

Группа изобретений относится к клеевой промышленности и может быть использована для склеивания пленкообразных подложек, текстильных тканей и нетканых материалов. Термоплавкий клей содержит: а) от 50 до 85 вес.% по меньшей мере одного полиолефинового полимера; b) от 1 до 40 вес.% по меньшей мере одной придающей клейкость смолы; с) от 0 до 15 вес.% по меньшей мере одного пластификатора; и d) от 0 до 30 вес.% по меньшей мере одной добавки и/или присадки. Полиолефиновый полимер представляет собой смесь из полиолефинового полимера с молекулярной массой M<10000 г/моль в количестве от 20 до 80 вес.% и второго полиолефинового полимера с молекулярной массой M>10000 г/моль в количестве от 20 до 80 вес.%. Обеспечивается высокая безопасность продукта за счет исключения веществ с высокой миграционной способностью с одновременным сохранением адгезии и гибкости. 5 н. и 7 з.п. ф-лы, 4 пр.

КЛЕЙ ДЛЯ КОНЕЧНОЙ ОТДЕЛКИ ШВА

Изобретение относится к клеевой композиции для укрепления панельных швов в строительстве. Техническим результатом является устранение необходимости наложения многослойного покрытия шовного герметика и уменьшение времени монтажа стены. Технический результат достигается клеевой композицией, содержащей полимерное вяжущее, наполнитель и ассоциативный загуститель. Вяжущее представляет собой комбинацию поливинилацетата с поливиниловым спиртом в количестве от 10 до 40% по массе композиции. Наполнитель представляет собой комбинацию аттапульгитовой глины в количестве от 0,5 до 1,5% по массе композиции и каолиновой глины в количестве от 5 до 15% по массе композиции. Модификатор реологии состоит по меньшей мере из одного модификатора реологии на основе целлюлозы в количестве от 0,01 до 15% по массе композиции. Ассоциативный загуститель состоит из по меньшей мере одного ассоциативного загустителя на основе полиакрилата и используется в количестве от 0,01 до 5% по массе композиции. При этом вязкость ...

ЧУВСТВИТЕЛЬНЫЕ К ДАВЛЕНИЮ КЛЕИ

Изобретение относится к чувствительным к давлению клеевым (ЧДК) композициям. Композиция содержит водную эмульсионную латексную систему, приготовленную из полимера по меньшей мере одного этиленовоненасыщенного мономера, который является твердым или мягким, и эффективного для стабилизации латексной системы водорастворимого защитного коллоида со среднечисленной мол. массой менее приблизительно 75000, причем количество мягкого мономера в латексном полимере больше, чем твердого при соотношении твердых мономеров к мягким мономерам в латексном полимере, которое выбирается так, чтобы при создаваемой температуре образовалась сплошная латексная пленка с температурой стеклования от приблизительно - 100oС до приблизительно - 3oС и со значением сопротивления к сдвигу на стали 1 кг выше, чем 2000 мин в отсутствие поверхностно-активного вещества. 23 з.п. ф-лы, 8 табл.

Клеевая композиция на основе модифицированной полиуретаном эпоксидной смолы холодного отверждения для фиксации двухслойных покрытий из полиизопреновой резины

Изобретение относится к области промышленного и гражданского строительства. Предложена клеевая композиция, которая включает эластифицированный диглицидиловый эфир бисфенола-A/F с эпоксидным эквивалентом 374-416 г/моль (30,0-32,0 мас. ч.), минеральный наполнитель (53,0-55,0 мас. ч.), диспергатор (0,5-0,6 мас. ч.), реологическую добавку (0,5-0,7 мас. ч.), пигмент (0,5-0,9 мас. ч.), отвердитель на основе модифицированного циклоалифатического полиамина (9,9-10,5 мас. ч.) и растворитель (1,5-2,3 мас. ч.). Технический результат – получение клеевого материала, который позволяет надежно фиксировать спортивное покрытие к бетонным и асфальтовым поверхностям, а также получать клеевой слой, сохраняющий гибкость при температуре до -30°С, что позволяет использовать состав на спортивных объектах, эксплуатируемых в зимнее время. 3 з.п. ф-лы, 1 табл., 1 пр.

КОМПОЗИЦИИ НИЗКОТЕМПЕРАТУРНЫХ ОТВЕРЖДАЕМЫХ ПОКРЫТИЙ

Изобретение относится к композиции покрытия, содержащей пленкообразующий полимер, содержащий активные водородсодержащие функциональные группы; блокированный полиизоцианатный отверждающий агент, содержащий блокирующую группу, полученную из блокирующего агента, содержащего альфа-гидроксиамид, сложный эфир или тиоэфир; и катализатор отверждения, который не содержит олова, свинца, железа, цинка или марганца. Также раскрыты покрытия, подложки с покрытием и способы нанесения покрытия на подложку. Изобретение позволяет получить композиции для покрытий, которые отверждаются при низких температурах. 5 н. и 20 з.п. ф-лы.

СПОСОБ ИЗГОТОВЛЕНИЯ ЧУВСТВИТЕЛЬНЫХ К ДАВЛЕНИЮ КЛЕЕВЫХ КОМПОЗИЦИЙ НА ВОДНОЙ ОСНОВЕ

ДВУХКОМПОНЕНТНАЯ КОМПОЗИЦИЯ НА ОСНОВЕ СОЕДИНЕНИЙ, ПО МЕНЬШЕЙ МЕРЕ, С ДВУМЯ ЭКЗО-ВИНИЛЕНОВЫМИ ЦИКЛИЧЕСКИМИ КАРБОНАТНЫМИ ЗВЕНЬЯМИ

ОТВЕРЖДАЕМЫЕ СОСТАВЫ ДЛЯ ЛАМИНИРУЮЩИХ АДГЕЗИВОВ

Material for permanent or temporary bonding to other material without adhesive, especially in dentistry

Material for permanent or temporary bonding to other materials without adhesive is treated with an adhesion promoter before polymerization.

Haftklebemasse, diese enthaltende Selbstklebeprodukte und Verbunde

Die Erfindung betrifft eine Blockcopolymerhaltige Haftklebemasse enthaltend e) 52 Gew.-% bis 65 Gew.-%, bevorzugt 55 Gew.-% bis 62 Gew.-% einer Elastomerkomponente, f) 30 Gew.-% bis 45 Gew.-%, bevorzugt 35 Gew.-% bis 42 Gew.-% zumindest eines Klebharzes, g) 0 Gew.-% bis 15 Gew.-%, bevorzugt bis 10 Gew.-% zumindest eines Weichharze und h) 0 Gew.-% bis 18 Gew.-%, bevorzugt bis 10 Gew.-% an weiteren Additiven, wobei die Elastomerkomponente (a) zu mindestens 90 Gew.-% aus Polyvinylaromat-Polybutadien-Blockcopolymeren besteht, wobei die Polyvinylaromat-Polybutadien-Blockcopolymeren zumindest eine Sorte eines Diblockcopolymers (a1) und zumindest eine Sorte eines Tri- oder Multiblockcopolymers (a2) umfassen, das zumindest eine Diblockcopolymer (a1) einen Vinylaromatenanteil von 15 Gew.-% bis 45 Gew.-% aufweist, innerhalb der Elastomerkomponente (a) der Anteil an Tri- oder Multiblockcopolymer (a2) zwischen 25 Gew.-% und 50 Gew.-%, bevorzugt zwischen 30 Gew.-% und 45 Gew.-% beträgt, das Tri- oder ...

Klebeband und Verfahren zu dessen Herstellung

Klebeband (10) umfassend:eine Basisschicht (20) ausgebildet aus einer ungedehnten Folie aus einem Polyolefinharz und umfassend eine unregelmäßige Fläche (22) an einer Seite der Basisschicht (20), umfassend eine Mehrzahl von Nuten (23, 23'), die entlang einer Richtung senkrecht zu einer Längsrichtung des Klebebands (10) verlaufen und die mit einem vorgegebenen Abstand zueinander ausgebildet sind undeine Klebeschicht (30, 30') gebildet auf der unregelmäßigen Fläche (22, 22') der Basisschicht (20) undFaserbruchstücke (32), die in der Basisschicht (20) und in der Klebeschicht (30, 30') dispergiert sind, derart, dass das Klebeband (10) eine Luftdurchlässigkeit hat durch Luftströmungswege, die durch die dispergierten Faserbruchstücke (32) bereitgestellt werden.

Corrosion prevention tape

A kind of coating adhesive corn starch adhesive production device

Sealant tape comprising offsetting particles

Epoxy resin adhesives

A curable epoxy resin adhesive comprising an epoxy resin and a separate curing agent, wherein a mixture of both components at a curing temperature causes resin curing. The epoxy resin comprises at least one epoxide-containing resin (e.g. DGEBA), and a first toughening component. The curing agent comprises at least one amine curing agent, and a second toughening component. First and second tougheners are selected from glass particles and a rubber, and are different from each other, whereby the final curable mixture comprises both glass particles and rubber toughener. The rubber may comprise a core-shell impact modifier. Also claimed is a method of manufacturing a wind turbine blade, comprising: providing and mixing epoxy resin and curing agent to form a curable mixture; providing the curable mixture between adjacent structural parts comprising a spar car and a shear web, and/or opposed edges of blade outer shells; heating at a curing temperature for bonding parts together. Also claimed is ...

TENSIDE ON TERPENHARZUND HYDROCARBON RESIN BASIS AS WELL AS AQUEOUS DISPERSION FROM KLEBRIGMACHER

WITH THERMOPLASTIC ADHESIVE COATING, SILICONE OIL-REJECTING PRODUCT OF PAPER

VERPACKUNGSELEMENT

The invention relates to a tape-like packaging element made from a polyester-based plastic tape, the plastic tape comprising at least one splicing inhibitor, wherein the splicing inhibitor is a thermoplastic, styrene-based polymer.

PROCEDURE FOR THE IMPROVEMENT OF PRESSURE-SENSITIVE STICKING MEANS

DETENTION ADHESIVE WITH A FASERFÖRMIGEN REINFORCEMENT MATERIAL

POLYMERE ONE COMPOSITIONS, ARTICLES WITH ANISOTROPIC LIGHT SCATTERING AS WELL AS PROCEDURE FOR THEIR PRODUCTION AND USE

ADHESIVES ON THE BASIS OF POLYOLEFINS

Applications and methods for the preparation of fatty acid esters of polysaccharides

Adhesive compositions and constructions with outstanding cutting performance

Adhesive composition

The present disclosure provides a composition. In an embodiment a composition is provided and includes: (A) an ethylene-based interpolymer having the following: (i) a density from 0.860 g/cc to 0.900 g/cc; and (ii) a melt viscosity, at 177℃, less than, or equal to, 50, 000 mP•a·s; and (B) a rosin ester containing the following: (i) greater than, or equal to, 75 mol% aliphatic carbon, based on total moles of carbon in the rosin ester; and (ii) less than, or equal to, 3.0 mol% ester group carbon, based on total moles of carbon in the rosin ester.

ADHESIVE, PREPARATION METHOD THEREOF, AND USE OF THE SAME IN VEGETABLE FIBERBOARD OR ARTIFICIAL BOARD

The present invention discloses an adhesive which is mainly prepared from the following components in parts by mass: 50-60 parts of an aqueous solution of sodium silicate; 10-20 parts of a brine; 20-30 parts of a nano silicon dioxide; 6-8 parts of a filler; 0.4-0.6 parts of a modifier and 0.1-0.3 parts of a stabilizer. A method for preparing the adhesive includes: firstly mixing to dissolve magnesium chloride and magnesium sulfate according to a certain molar ratio, and then obtaining a brine after stirring thoroughly; adding an aqueous solution of sodium silicate into the prepared brine, and then adding a nano silicon dioxide into the prepared sodium silicate-brine mixture to obtain a mixture; adding a filler into the mixture, and uniformly stirring to obtain a semi-finished product; and adding a modifier and a stabilizer into the semi-finished product to obtain a finished product of the adhesive. The adhesive of the present invention can be used as an inorganic adhesive in a vegetable ...

Sizing composition for mineral wool containing a reducing saccharide and a hydrogenated saccharide, and resulting insulating products

The present invention relates to a sizing composition for insulating products containing mineral wool, in particular stone wool or glass wool, which includes: at least one reducing saccharide; at least one hydrogenated saccharide; and at least one polyfunctional cross-linking agent, the hydrogenated saccharide(s) accounting for 10 to 90% of the total weight of reducing saccharide(s) and hydrogenated saccharide(s). The invention also relates to the resulting mineral-fiber insulating products and to the method for manufacturing same.

Multilayer film for resealable packaging having improved resealing

... 1) Multilayer film comprising two thin layers D and E of a thermoplastic material bonded to one another by a continuous layer A consisting of a hot-melt pressure-sensitive adhesive composition comprising: - from 40 to 70% by weight of a composition formed of styrene block copolymers 0 consisting of a mixture of diblock and triblock copolymers; and - from 30 to 60% by weight of one or more tackifying resins with a softening temperature of between 5 and 140'C; said multilayer film being such that the adhesive layer A is: - connected to the layer D via a tie layer B, and 5 - connected to the layer E via a tie layer C, each of the two layers B and C being respectively composed of a composition comprising a polyethylene or polypropylene which are modified by a cyclic anhydride of an unsaturated acid having from 4 to 8 carbon atoms. 2) Process for the manufacture of said film by coextrusion. 0 3) Use of said film for the manufacture of resealable packagings.

Composition of hot-melt, self-adhesive particles and sticking method using same

Improved sealant strip and method of forming lap joints

The present invention relates to a form of lap joint (2) for forming a water-tight joint between sheet materials (10, 20) comprising a sealant strip (40) between 2 sheets of material (10, 20), the sheets of material being held about the sealant strip by means of a plurality of fasteners (30, 30'). The sealant strip comprises a pliable sealant material in which is embedded, along the length of the strip, one or more elastomeric cords (52, 52'). The invention provides an improved form of construction such that sealant in a non-hardened form, such as before setting or when of a non-setting form is not extruded from a joint overtime and thus the integrity of the joint is maintained.

Adhesive compositon

The present disclosure provides an adhesive composition. The adhesive composition includes: A) a propylene based plastomer or elastomer (PBPE) comprising up to 15 wt % units derived from ethylene and having (i) a Koenig B-value less than 1.0; (ii) a total unsaturation per mole of propylene from 0.010% to 0.030%; (iii) a density from 0.860 g/cc to 0.890 g/cc; (iv) a melt viscosity at 177°C from 1,000 mPa.s to 15,000 mPa.s; and (v) a weight average molecular weight from 20,000 to 50,000 g/mole.

Antimicrobial and biologically active polymer composites and related methods, materials and devices

Biologically activated ion-exchange polymer salts are made by exchanging biologically active ionic agents onto ion-exchange polymers. The activated polymers are uniquely surface active and stable to thermal degradation and chemical and other forms of decomposition. The activated ion-exchange polymer salts may be processed and combined with polymer precursors using novel methods and materials to produce stable, biologically activated polymer composites, including antimicrobial and antifouling polymer composites.

Adhesive compositions containing modified ethylene-based polymers and compatible tackifiers

The invention provides a composition comprising the following components: A) an anhydride and/or carboxylic acid functionalized ethylene/alpha-olefin interpolymer having the following properties: i) a melt viscosity (177C) less than, or equal to, 50,000 cP, ii) a density from 0.855 to 0.900 g/cc; B) a tackifier selected from the following: a) a hydrocarbon tackifier that has a cloud point (DACP) temperature greater than, or equal to, 20C, b) a rosin ester tackifier with an acid number of less than 25, c) a terpene tackifier, or d) a combination thereof.

Improved binder compositions and uses thereof

The present invention relates to new aqueous binder compositions comprising an aqueous curable binder composition comprising starting materials required for forming a thermoset resin upon curing and a matrix polymer, wherein the starting materials required for forming a thermoset resin upon curing comprise (i) a polyhydroxy component and a polycarboxylic acid component, or an anhydride, ester or salt derivative thereof and/or reaction product thereof, or (ii) a carbohydrate component and a nitrogen containing component and/or a reaction product thereof.

Self-adhesive bituminous sheath for building and bitumen modifier for self-adhesive bituminous sheath

An adhesive bituminous sheath for building comprises bitumen and an adhesivizing additive mixed with the bitumen, characterized in that the said ahesivizing additive is an aliphatic and cycloaliphatic resin.

Adhesive using bark

Provided is an adhesive having a simple composition and using bark, whereby the ratio of bark is increased and the bark is efficiently utilized, the ratio of phenol resin is suppressed, and the solid content of a paste liquid is reduced. The present invention is an adhesive using bark, including a resol-type phenol resin and a radiata pine bark powder, the adhesive including 30-40 parts by mass of the radiata pine bark powder with respect to a combined total of 100 parts by mass of the radiata pine bark powder and the solid content of the resol-type phenol resin. Alternatively, the present invention is an adhesive using bark, including a resol-type phenol resin and a radiata pine bark powder, the adhesive including 20-50 parts by mass of wheat flour and the radiata pine bark powder with respect to a combined total of 100 parts by mass of the wheat flour, the radiata pine bark powder, and the solid content of the resol-type phenol resin, the mass ratio of the radiata pine bark powder and ...

POLYESTER PLASTICIZERS WITH BENZOIC ACID END-CAPS

Polyester plasticizer compositions for adhesives, caulk, sealants, vinyl and other polymeric compositions comprising low molecular weight oligomeric dibenzoates prepared by end-capping a polyester plasticizer, having alternating units of glycols or diols and dibasic acids, with benzoic acid. Improved methods for preparing oligomeric dibenzoates include use of a non-halogen based catalyst, early ramping of temperature, pressure reduction and steps to reduce or eliminate residual hydroxyl content and improve plasticizer performance by adding acetic anhydride are also disclosed. Propylene glycol adipate and propylene glycol succinate polyesters with benzoic acid end-caps are particularly useful, as are hybrid benzoate/acetate end-capped polyesters formed in the process with acetic anhydride. Caulks, adhesives, sealants, and vinyl compositions, among others, comprising the oligomeric end-capped polyesters of the invention are also contemplated. 3428073v2 ...

Agglomerates for the production of an aqueous binder system

Wood laminates with aramid fibers in the glue line and processes for making

Pressure sensitive adhesives

Articles that include a polymer foam and method for preparing same

Adhesive and coating formulations for flexible packaging

ADHESIVE COMPOSITION AND METHOD FOR ADHERING TEXTILES TO EPDM RUBBER

An improved adhesive composition and method for adhering textile reinforcing elements to rubber, particularly ethylene-propylene-diene rubber, in the manufacture of rubber articles such as power transmission belts, wherein the adhesive composition comprises a latex of a hydrogenated styrene-butadiene rubber, a carboxylated hydrogenated styrene-butadiene rubber, a hydrogenated nitrile-butadiene rubber, a carboxylated hydrogenated nitrile-butadiene rubber, a chlorosulfonated polyethylene or blends thereof; an aqueous solution of a half-ester of maleinized liquid poybutadiene; and, optionally, up to about 15% by weight carbon black in an aqueous solution.

A HEAT SENSITIVE ADHESIVE SHEET

A hot-melt adhesive particle dispersion in which the hot-melt adhesive particles are less apt to sediment; and products of even quality obtained with the dispersion. The dispersion is one obtained by dispersing particles of a hot-melt adhesive in water, and is characterized by containing a thickener of the alkali thickening type, desirably an acrylic copolymer emulsion of the alkali thickening type or a slightly crosslinked polyacrylic acid.

CAUSTIC REMOVABLE HOT MELT ADHESIVE FORMULATIONS

The invention relates firstly to a hot melt adhesive additive, particularly comprising a low molecular weight styrene-maleic anhydride (SMA) and a low molecular weight maleated polybutadiene imparting caustic removability to a conventional hot melt adhesive composition comprising the said additive. It relates also to a caustic removable hot melt adhesive composition comprising said adhesive additive and further comprising an adhesive resin of the group consisting of styrene-isoprene-styrene block copolymers, tackifying resins, polyacrylate resins, poly ethylene vinyl acetate resins, polystyrene butadiene resins, styrene-butadiene-styrene block copolymers, and process oil, or mixtures thereof. It covers also a caustic removable hot melt adhesive label which comprises said caustic removable hot melt adhesive composition.

ADHESIVE COMPOSITIONS CONTAINING LOW MOLECULAR WEIGHT POLYMER ADDITIVES

ADHESIVE COMPOSITIONS CONTAINING LOW MOLECULAR WEIGHT POLYMER ADDITIVES INVENTORS: JUDITH L. WHITMIRE, PATRICIA M. LESKO, and TIMOTHY G. WOOD DN86-06 CWB/tjm Adhesive compositions containing a polymeric additive which is polymerized from monomers selected from C1-C20 alkyl and cycloalkyl acrylate, C1-C20 alkyl and cycloalkyl methacrylate, free-radical polymerizable olefinic acids, and optionally other ethylenically unsaturated monomers wherein said polymeric additive has a number average molecular weight less than about 35,000 and a softening point greater than about 40.degree.C.

RADIATION HARDENABLE ADHESIVE COMPOSITION CONTAINING DISPERSED NATURAL RUBBER FINE PARTICLES

An adhesive composition having natural rubber fine particles uniformly dispersed in a radiation hardenable compound. The adhesive composition, when subjected to radiation hardening to thereby form a pressure sensitive adhesive layer on a substrate, exhibits satisfactory bonding strength. The adhesive composition can be satisfactorily compounded with various fillers, and drying time after coating can be short. Both overall surface coating and pattern coating can be easily performed, and the adhesive composition can be applied to various substrates, realizing satisfactory bonding strength between the substrate and the pressure sensitive adhesive layer. The adhesive composition can be produced by mixing water base emulsion (31) containing natural rubber fine particles (30) with radiation hardenable compound (32) and heating the mixture under agitation so as to evaporate off water from the water base emulsion, with the result that the medium wherein natural rubber fine particles are dispersed ...

ADHESIVE COMPOSITION AND METHOD FOR ADHERING TEXTILES TO EPDM RUBBER

An improved adhesive composition and method for adhering textile reinforcing elements to rubber, particularly ethylene-propylene-diene rubber, in the manufacture of rubber articles such as power transmission belts, wherein the adhesive composition comprises a latex of a hydrogenated styrene-butadiene rubber, a carboxylated hydrogenated styrene-butadiene rubber, a hydrogenated nitrile-butadiene rubber, a carboxylated hydrogenated nitrile-butadiene rubber, a chlorosulfonated polyethylene or blends thereof; an aqueous solution of a half-ester of maleinized liquid poybutadiene; and, optionally, up to about 15% by weight carbon black in an aqueous solution.

ADHESIVE COMPOSITIONS

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer and/or silicone polyurea block copolymer and a silicate tackifying resin. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer and a silicate tackifying resin in an amount of between about 0.1 wt% and about 20 wt%; or a silicone polyurea block copolymer and a silicate tackifying resin in an amount of between about 0.1 wt% and about 30 wt%.

RAPID CURING AND HIGH THIXOTROPY EPOXY ADHESIVE COMPOSITIONS

The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa x 1/s, when measured at 23C according to the test method described in the experimental section. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding small parts ...

MICROFIBRILLATED CELLULOSE AS A CROSSLINKING AGENT

The present invention relates to a composition for use as an adhesive, paint, coating, resin, (surface) size, composite, gel or hydrogel, said composition comprising microfibrillated cellulose ("MFC"). In addition to microfibrillated cellulose, these compositions comprise at least one solvent, said solvent preferably comprising or consisting of water, and at least one compound that is (a) capable of polymerizing, or has already partly or fully, polymerized, and that (b) has at least two groups available for hydrogen bonding, preferably OH groups, that are capable of crosslinking with at least one functional group of the microfibrillated cellulose. In these compositions, the microfibrillated cellulose primarily functions as a crosslinking agent (while it is by no means excluded that the microfibrillated cellulose additionally has other functionalities, such as acting as viscosity modifier and/or thixotropic additive), integrating the compound that (a) is capable of polymerizing or that has ...

A SEALING TAPE WITH A FUNCTIONAL LAYER

The invention is directed to a sealing device comprising a waterproofing layer (2), a functional layer (3), and an adhesive layer (4) coated on and at least partially covering the first major surface of the waterproofing layer (2) opposite the side of the functional layer (3). The invention is also directed to a method for producing a sealing device, to a method for waterproofing a substrate, and to use of the sealing device for sealing lapped joints formed between overlapping portions of waterproofing membranes and for patching of breaches in waterproofing membranes.

LOW DENSITY AEROSPACE COMPOSITIONS AND SEALANTS

Low-density sealant compositions are disclosed. The low-density compositions include thiol-terminated polythioethers, a polyepoxide curing agent, and low-density microcapsules having a coating of an aminoplast resin. The compositions have a volume percent content of the coated low-density microcapsules from 35 vol% to 55 vol% and the compositions have a specific gravity less than 0.9. Cured sealants prepared from the compositions meet aerospace performance requirements.

LIQUID ADHESIVE CONCENTRATE

Provided herein are compositions and methods of preparing a liquid adhesive concentrate and a liquid adhesive formulation for use as an adhesive in installing insulation on the outside or inside surface of a duct or ductwork.

ADHESIVE COMPOSITION AND FIXATION ELEMENT FOR HUMAN SKIN

L'invention a pour objet une composition adhésive destinée à assurer la fixation sur la peau humaine, comprenant une phase continue et une phase discontinue d'hydrocolloïdes, la phase continue comprenant en poids, sur la base du poids total de la composition adhésive : (i) 1 à 12% en poids d'un polymère séquencé de type styrène-isoprène-styrène ou styrène-butadiène-styrène, (i i) (a) 1 à 15% d'un polymère de type élastomère butyl, éventuellement en mélange avec jusqu'à 25% en poids de d'un polymère de type polyisobutylène, ou (b) plus de 10% à 30% d'un polymère de type polyisobutylène, exempt de polymère de type élastomère butyl, (iii) 1 à moins de 10% d'un polymère de type éthylène vinyl acétate, la somme de ces trois types de polymères représentant de 10 à 40%. 11 ...

FARNESENE-BASED TACKIFYING RESINS AND ADHESIVE COMPOSITION CONTAINING THE SAME

A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition.

POLYESTER PLASTICIZERS WITH BENZOIC ACID END-CAPS

Polyester plasticizer compositions for adhesives, caulk, sealants, vinyl and other polymeric compositions comprising low molecular weight oligomeric dibenzoates prepared by end-capping a polyester plasticizer, having alternating units of glycols or diols and dibasic acids, with benzoic acid. Methods for preparing oligomeric dibenzoates include steps to reduce or eliminate residual hydroxyl content and improve plasticizer performance by adding acetic anhydride are also disclosed. Propylene glycol adipate and propylene glycol succinate polyesters with benzoic acid end-caps are particularly useful, as are hybrid benzoate/acetate end-capped polyesters formed in the process with acetic anhydride. Caulks, adhesives, sealants, and vinyl compositions comprising the oligomeric end-capped polyesters of the invention are also contemplated.

COMPOSITE POLYMER MATERIALS FOR MODIFICATION OF ADHESIVE COMPOSITIONS AND ASSOCIATED METHODS OF MANUFACTURE

The present description provides composite polymer compositions comprising a plastomeric material, an elastomeric material or a combination thereof, and an additive, for example, a dispersant or surface active agent (i.e., surfactant). The description also provides methods of manufacturing and using the same, e.g., to improve or modify the performance of adhesive materials, such as, for example, asphalt.

ADHESIVE TAPE FEATURING ADHESIVE WITH CONTINUOUS POLYMER PHASE

The invention relates to an adhesive tape containing an adhesive comprising - at least one polymer - optionally a tackifier resin - at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin - at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

PROCESS FOR MAKING PRESSURE-SENSITIVE ADHESIVE AND DUCT TAPE

A continuous process for making a pressure-sensitive adhesive is disclosed. A mixture comprising natural rubber having a Mooney viscosity of 85 to 100, a tackifier, a filler, and 0.1 to 5 wt.% of an added C12-C24 fatty acid based on the amount of mixture is masticated in a first section of a single- or twin-screw extruder. Mastication of the mixture continues in at least one subsequent extruder section in the presence of additional tackifier. The product is a homogeneous, reduced-viscosity pressure-sensitive adhesive. The minor proportion of added C12-C24 fatty acid aids mastication of the rubber and enables high throughput without addition of peptizers. Duct tapes made from the adhesives display improved adhesion to steel, better adhesion bond strength, and enhanced seven-day clean removability from even difficult substrates such as marble or ceramic tile.

HOT-MELT ADHESIVE AGENT

The present invention provides a hot-melt adhesive agent which is capable of applying at low temperature, and has an excellent adhesiveness to a polyolefin substrate, and a disposable product obtained by employing the hot-melt adhesive agent. A hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25°C as a 25% (by weight) toluene solution of not more than 250 mPas; and (A2) a styrene block copolymer having a styrene content of less than 30% by weight, and having a viscosity at 25°C as a 25% (by weight) toluene solution of more than 250 mPas.

PRODUCT FOR AND METHOD OF PROTECTING AND INCREASING FRICTION OF ANIMAL PAWS

An adhesive and solid particulates adhered to the pads of an animal's paw, the adhesive being cured, thereby increasing the friction of the surface of the pads; and a method of increasing the friction of an animal's paw by applying to clean, dry pads of the animal's paw a layer of uncured adhesive, and while the adhesive layer is uncured, contacting the paw with particulates to adhere the particulates to the pad, then curing the adhesive.

COMPOSITION OF HOT-MELT, SELF-ADHESIVE PARTICLES AND STICKING METHOD USING SAME

L'invention concerne une composition de particules, dites particules thermofusibles auto-agrippantes (10, 20), de matière thermoplastique fusible adaptée pour le collage de pièces et présentant des pointes (21) et/ou des barbelures (11, 22) propres à s'accrocher en surface d'au moins une pièce à coller -notamment dans les fibres d'au moins une face des dites pièces à coller-. L'invention concerne également un procédé de collage mettant en uvre une telle composition.

STRUCTURAL HYBRID ADHESIVES

Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

MECHANICAL AND ANTICORROSIVE PROTECTION VINYL TAPE

Pressure sensitive tape for anticorrosion steel pipe protection used primarily in cases of repair and maintenance, comprising vinyl base-tape laminated with a nitrile rubber-based adhesive of the following composition: about 30.7 to about 34.0% (w/w) solid butadiene acrylonitrile rubber (NBR); about 0.57 to about 0.63% (w/w) antioxidant; about 9.7 to about 12.9% (w/w) hydrocarbon resin; about 1.52 to about 1.68% (w/w) zinc oxide; about 8.7 to about 9.5% (w/w) liquid butadiene acrylonitrile rubber.(NBR); about 4.0 to about 4.4% (w/w) aluminium hydrosilicate; about 5.5 to about 7.5% (w/w) diisononyl phthalate; about 0.66 to about 0.74% (w/w) carbon black; about 1.5 to about 1.7% (w/w) amorphous silica; and about 25.8 to about 38.8% (w/w) magnesium and calcium carbonate. The tape exhibits a good ability to conform to irregular surfaces, good elasticity, good impact resistance, excellent pipe adhesion and good cathodic detachment. The tape is ideally used in conjunction with a primer that improves ...

CHLOROSULFONATED POLYETHYLENE LATEX

Provided is a chlorosulfonated polyethylene latex which is safe to the human body and the environment, and which is used as a latex element of a resorcinol-formalin-latex adhesive. This chlorosulfonated polyethylene latex includes an aqueous dispersion medium, chlorosulfonated polyethylene, a polyoxy-alkylene alkyl ether sulfate represented by formula (I) as an emulsifier, and a fatty acid salt, and has excellent static stability and mechanical stability. In the formula (I), R1 represents an alkyl group with a carbon number of 6-20; R2 represents hydrogen or a methyl group; n is an integer of 2-40; and M represents an alkaline metal, respectively. R1-O-(CH2CHR2-O)n-SO3M (I) ...

HOT MELT ADHESIVES FOR DISPOSABLE PRODUCTS

The present invention provides a hot melt adhesive which is excellent in high-speed coating and spiral coating at low temperature, and is also excellent in adhesion to a polyolefin film and a nonwoven fabric; and provides disposable products obtainable by using the hot melt adhesive. Disclosed is a hot melt adhesive including: (A) a thermoplastic block copolymer which is a copolymer of a vinyl-based aromatic hydrocarbon with a conjugated diene compound; (B) a propylene homopolymer having a melting point of 100°C or lower which is obtainable by polymerizing propylene using a metallocene catalyst; and (C) an ethylene/a-olefin copolymer. The hot melt adhesive is excellent in high-speed coating and spiral coating at low temperature, and is also excellent in adhesion to a polyolefin film and a nonwoven fabric.

CROSSLINKABLE PRESSURE-SENSITIVE ADHESIVE CONSTRUCTION CONTAINING A DIORGANOPOLYSILOXANE AND AN ACYLOXYSILANE

ADHESIVES COMPRISING OLEFIN POLYMERS

Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/.alpha.-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.

HYDROPHILIC HOT MELT ADHESIVE

Hydrophilic hot melt adhesive compositions suitable for a variety of applications, especially in nonwoven disposable articles, are prepared by blending various adhesive components with a surfactant. The surfactant has a hydrophile-lipophile balance (HLB) number of less than 15, and is incorporated into the composition in an amount such tha t the resultant adhesive has a contact angle of 75.degree. or less, and preferably less than about 40.degree.. A low contact angle is desirable so that water, urine or other water-based discharges, upon contacting a laminate bound together by the adhesive, wets out rather than beads up resulting in the fluid being directed away from the adhesive and towards an absorbent core of the disposable article.

Composite hot melt adhesive film and method of manufacturing the same network.

Ein Verbund-Heissschmelz-Klebenetzfilm und Herstellungsverfahren desselben, insbesondere, ein Verbund-Heissschmelz-Klebenetzfilm und Herstellungsverfahren desselben zum Anhaften eines Metalls an ein unpolares Material werden offenbart. Der Netzfilm wird aus einem polaren Polyamid-Heissschmelz-Kleber und einem unpolaren Polyolefin-Heissschmelz-Klebenetzfilm zusammengesetzt, der einen Vermittler enthält, und eine hohe Klebkraft sowie eine anhaltende und stabile Haftung aufweist, besonders geeignet für das Verbinden und Zusammensetzen metallischer Materialien, wie Edelstahl, Aluminium und Kupfer, und unpolarer Polymere, wie Polyethylen und Polypropylen. Das Herstellungsverfahren wird in einem einzigen Herstellungsverfahrenssatz von Rohstoffvorbehandlung bis zur abschliessenden Herstellung des Heissschmelz-Klebenetzfilmprodukts abgeschlossen, wodurch Herstellungsfehler grösstenteils ausgeschlossen, die Herstellungseffizienz erhöht und die Kosten gesenkt werden.

Hot melt adhesive and process for producing the same.

Ein Schmelzkleber und ein Verfahren zu seiner Herstellung werden offenbart, insbesondere ein Schmelzkleber zum Verkleben von Aluminium, Edelstahl und anderen metallischen Werkstoffen und PVC-Kunststoffen. Zunächst wird das jeweilige Copolyamid vom Typ Nylon durch Zusammenstellen von bestimmten Rohstoffen und deren Prozentanteilen hergestellt, und in Kombination mit günstigen Bindungseigenschaften des Copolyamids vom Typ Nylon für Metalle und günstigen Bindungseigenschaften des Perchlorethylenharzes für PVC wird ein Doppelschneckenextruder verwendet, um eine ausreichende Schmelzmischung des Copolyamids vom Typ Nylon und des Perchlorethylenharzes unter den synergistischen Wirkungen entsprechender Hilfsmittel durchzuführen, sodass der erhaltene neuartige Schmelzkleber günstige Bindungseigenschaften sowohl für Metalle als auch für PVC hat.

nevulkanizirovannyi adhesive waterproof material using regenerated rubber and method of its preparation

КЛЕЯЩАЯ КОМПОЗИЦИЯ ДЛЯ СНАБЖЕНИЯ ПОКРЫТИЕМ ИЗДЕЛИЙ ПЛОСКОЙ ФОРМЫ С ПРИМЕНЕНИЕМ ТЕПЛА И ДАВЛЕНИЯ (ЕЕ ВАРИАНТЫ)

Описывается клеящая композиция для снабжения покрытием изделий плоской формы с применением тепла и давления кроме термопластичного полимера, содержащая полиэтиленовый воск в количестве от 0,1 до 6 вес.%.

JOINT FINISHING ADHESIVE

METHOD FOR PRODUCING WOOD MATERIAL PANELS, IN PARTICULAR OSB WOOD MATERIAL PANELS, AND WOOD MATERIAL PANEL THAT CAN BE PRODUCED IN ACCORDANCE WITH SAID METHOD

SIZING COMPOSITION FOR MINERAL WOOL BASED ON REDUCING SACCHARIDE AND HYDROGENATED SACCHARIDE AND OBTAINED INSULATING PRODUCTS

POLYMER COMPOSITION FOR USE AS ADHESIVE

Powder- and Paste-like Adhesive Composition to Apply Under Heat and Pressure to Flat Article

High-refractive index methyl phenyl LED (light-emitting diode) packaging silicone rubber material and preparation method thereof

Special adhesive for ABS pressure-bearing equipment and preparation method of adhesive

High-wear-resistance TPU/silica gel composite material and preparation method thereof

Silica gel and protective film thereof

Adhesive composition and adhesive sheet

Epoxy resin composition

HOT-MELT ADHESIVE AGENT

Special packaging glue for EB curing, preparation method thereof, and method for packaging thin film capacitor

Environment-friendly composite plant adhesive and preparation method thereof

Adhesive, double-sided adhesive sheet and display

The invention relates to an adhesive which enables to form an adhesive layer that is hardly separated from an object to which it is adhered even when the object is deformed. The adhesive exhibits sufficient adhesion even when the thickness of the adhesive layer is reduced to as thin as about 10 mu m. Specifically disclosed is an adhesive characterized by containing an acrylate resin having a weight average molecular weight of 500,000-1,500,000 in terms of polystyrene as determined by GPC, a tackifying resin having an alcoholic hydroxy group and a hydroxyl number of not less than 35, and a terpene phenol resin. This adhesive is also characterized by having a gel fraction of 5-40% by weight.

Strong waterproof water-based sealant and preparation method thereof

Sealant for filling and sealing cracks of asphalt pavement

Reactive hot melt adhesive

REMOVABLE PRESSURE-SENSITIVE ADHESIVE STRIP

Three-layer composite hot melt adhesive film for bonding metal and polar functional plastic and processing technique thereof

Epoxy resin sealant and preparation method and application thereof

Office strong glue

Acrylate pressure-sensitive adhesive containing multi-functional-group compound and preparation method thereof

Adhesive sheet and method of backgrinding semiconductor wafer

After an adhesive sheet is pasted on a semiconductor wafer, an adhesive of the sheet increases tight attachment to the semiconductor wafer because wetting spreads over time. Due to this, at the time of peeling the adhesive sheet from the ground semiconductor wafer, the semiconductor wafer used to be damaged. This phenomenon is likely to occur for a thinner semiconductor wafer. The present invention resides in an adhesive sheet including a substrate and an adhesive layer disposed on the substrate. The substrate is formed of an ethylene/vinyl acetate copolymer having a vinyl acetate content of 10% by mass or less. The adhesive layer contains 100 parts by mass of a (meth)acrylate ester copolymer, 1 to 10 parts by mass of a cross-linker, 0.05 to 5 parts by mass of a silicone compound. The (meth)acrylate ester copolymer is formed of a copolymer produced by polymerizing a (meth)acrylate ester monomer and a functional-group-containing monomer.

Thermoplastic reinforcement materials

The present invention relates to novel thermoplastic reinforcement materials, particularly for the shoe industry, and a method for the production thereof. The novel thermoplastic reinforcement materials are obtained by a preliminary production step of pre-agglomeration of plant fiber filler materials and thermoplastic hot-melt adhesives, so-called filler-plastic compounds, allowing filler material originating from very inexpensive, naturally occurring plant fibers of varying origins to be used, but in an amount up to 65% by weight, without losing the required material properties, such as strength under heat, good flexural rigidity, and surface adhesion.

Optically diffusive adhesive and method of making the same

A method of making an optically diffusive adhesive comprises: preparing a first adhesive composition comprising first particles dispersed in an optically clear adhesive matrix; determining a first haze and a first clarity of the first adhesive composition; and based upon the first haze and the first clarity, preparing a second adhesive composition that comprises the optically clear adhesive matrix, the first particles, and second particles dispersed in the optically clear adhesive matrix. An optically diffusive adhesive comprises first and second particles dispersed in an optically clear adhesive matrix is also disclosed. The first and second particles have a higher refractive index than the optically clear adhesive matrix. Articles comprising the optically diffusive adhesive are also disclosed.

Pressure sensitive adhesive tear tape

A tape that includes a cellulosic substrate defining a first surface and an opposing second surface; a pressure sensitive adhesive disposed on the first surface of the cellulosic substrate; and an encapsulated fibrous material disposed on the first surface of the cellulosic substrate or the second surface of the cellulosic substrate.

CONDENSATION PRODUCTS OF AMINO-FUNCTIONAL POLYMERS

A condensation product of at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine and a process for the preparation thereof and the use thereof in the curing of epoxy resin systems are described. 2. The condensation product according to claim 1 , wherein the polyoxyalkylene diamine comprises units based on ethylene oxide claim 1 , propylene oxide claim 1 , or ethylene oxide and propylene oxide.5. The condensation product according to claim 1 , wherein the polyoxyalkylene diamine has a molecular weight of 220 to 10 claim 1 ,000 g/mol.6. A process for preparing a condensation product claim 1 , wherein at least one (hydroxymethyl)phenol is reacted with at least one polyoxyalkylene diamine.8. The process according to claim 6 , further including a polyoxyalkylene diamine that comprises units based on ethylene oxide claim 6 , propylene oxide claim 6 , or ethylene oxide and propylene oxide.9. The process according to claim 6 , comprising the following process steps:(i) Introducing at least one (hydroxymethyl)phenol and at least one polyoxyalkylene diamine at a temperature of 15 to 100° C., preferably 20 to 90° C., especially preferably 20 to 70° C., into a reaction vessel;(ii) Raising the temperature to 120 to 190° C., preferably 120 to 180° C., especially preferably 120 to 170° C.10. The process according to claim 9 , wherein the process is carried out for a time period of 1 to 10 hours.11. The process according to claim 6 , wherein the at least one (hydroxymethyl)phenol is reacted with the at least one polyoxyalkylene diamine in a stoichiometric ratio of 1 to 30.12. A condensation product obtainable according to a process according to .13. An epoxy resin composition that includes the condensation product of .14. An epoxy resin adhesive that includes the epoxy resin composition of claim 13 , wherein the condensation product accelerates the curing of the epoxy resin adhesive improves the adhesion and/or peel strength of the epoxy resin adhesive.15. A ...

Anti-Foaming Agents for Hot-Melt Adhesives

A polyamide hot melt adhesive composition is described comprising the polyamide condensation product of substantially equimolar quantities of: (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and (b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and (c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein the defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing the condensation product and (d) an acid based catalyst. 1. A polyamide hot melt adhesive composition comprising the polyamide condensation product of substantially equimolar quantities of:(a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids, and(b) an amine component consisting essentially of one or more cyclic aliphatic diamines, one or more non-cyclic aliphatic diamines in which the amine groups are bonded to odd-numbered carbon atoms on the aliphatic chain, and one or more alkylene diamines, and(c) an anti-foaming or defoaming agent comprised of a water based silicone compound comprising 5% solids in water wherein said defoaming agent reduces or eliminates foaming occurring during the condensation reaction providing said condensation product, and(d) an acid based catalyst.2. The polyamide composition of claim 1 , wherein said anti-foaming or defoaming agent reduces said foaming by at least a multiple of twenty in comparison with condensation reactions not using said anti-foaming agent.3. The polyamide composition of claim 1 , wherein said water based silicone compound is an emulsion with the tradename CT-GW1®.4. The polyamide composition of wherein the ratio of ...

Structural hybrid adhesives

Adhesive compositions are provided comprising: a) a base resin comprising an epoxy resin; b) a first epoxy curative; and c) a second epoxy curative; wherein the first and second epoxy curatives are chosen such that the second epoxy curative may remain substantially unreacted in the composition under conditions of temperature and duration that render the first epoxy curative substantially reacted with epoxy resin in the composition. In some embodiments, the first epoxy curative is substantially reacted with epoxy resin in the composition and the second epoxy curative is substantially unreacted in the composition. In some embodiments, the adhesive composition is used in the form of an adhesive film.

Transparent conductive film, electronic device, and method for manufacturing electronic device

The present invention provides a transparent conductive film which is low in terms of surface resistivity and high in terms of transparency. The transparent conductive film according to the present invention includes an adhesive conductive layer in openings of a conductive metal mesh layer provided on at least one surface of a transparent base material, wherein the conductive layer is composed of a conductive adhesive composition containing (A) a water-soluble vinyl polymer, (B) an organic additive, and (C) a conductive organic polymer compound, the organic additive (B) is at least one member selected among water-soluble polyhydric alcohols, water-soluble pyrrolidones, and hydrophilic aprotic solvents, and the conductive organic polymer compound (C) is at least one member selected among polyanilines, polypyrroles, polythiophenes, and derivatives thereof. In addition, the present invention provides an electronic device having the foregoing transparent conductive film and a method for manufacturing an electronic device including forming a photoelectric conversion layer on an anodic layer and sticking the conductive layer of the transparent conductive film and a surface of the photoelectric conversion layer to each other at a temperature at which the foregoing conductive adhesive composition is softened or higher.

Double-sided adhesive tape or sheet, and adherend processing method

The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate, and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a tensile pressure-sensitive adhesive strength of 2.0 to 20 N/20 mm in width and an amount of displacement of 0.3 mm/20 mm in width or less, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.

Geopolymer and epoxy simultaneous interpenetrating polymer network composition, and methods for the same

A simultaneous interpenetrating polymer network—geopolymer epoxy composition includes a first component comprised of a waterborne epoxy curing agent and an alkaline silicate solution, and a second component comprised of an epoxy resin and an aluminosilicate. The two components are mixed to produce a SIN-GE composition that cures at ambient temperatures. The SIN-GE composition may be a low-viscosity, sprayable composition, or may be a higher-viscosity composition. The compositions may be used as coatings, adhesives, mortars, casting materials, and the like.

CHLOROSULFONATED POLYETHYLENE LATEX

A chlorosulfonated polyethylene latex, which is safe for living bodies and the environment and can be used as a latex component in a resorcin-formalin-latex adhesive, contains an aqueous dispersion medium, chlorosulfonated polyethylene, and an emulsifying agent of a polyoxyalkylene alkyl ether sulfate of formula (I) below and a fatty acid salt. The latex is excellent in standing stability and mechanical stability. In formula (I), R, R, n, and M represent an alkyl group of 6 to 20 carbon atoms, hydrogen or a methyl group, an integer of 2 to 40, and an alkali metal, respectively. 1. A chlorosulfonated polyethylene latex , comprising:an aqueous dispersion medium,chlorosulfonated polyethylene, [{'br': None, '[Chem. 1]'}, {'br': None, 'sup': 1', '2, 'sub': 2', 'n', '3, 'R—O—(CHCHR—O)—SOM\u2003\u2003(I)'}], 'a polyoxyalkylene alkyl ether sulfate represented by formula (I) below, and a fatty acid salt.'}{'sup': 1', '2, '(in formula (I), Rrepresents an alkyl group of 6 to 20 carbon atoms, Rrepresents hydrogen or a methyl group, n represents an integer of 2 to 40, and M represents an alkali metal.)'}2. The chlorosulfonated polyethylene latex according to claim 1 , which comprises 0.3 to 12 parts by mass of the polyoxyalkylene alkyl ether sulfate and 0.1 to 2.5 parts by mass of the fatty acid salt claim 1 , relative to 100 parts by mass of the chlorosulfonated polyethylene.3. The chlorosulfonated polyethylene latex according to claim 1 , further comprising polyvinylpyrrolidone.4. The chlorosulfonated polyethylene latex according to claim 3 , which comprises 0.3 to 12 parts by mass of the polyoxyalkylene alkyl ether sulfate claim 3 , 0.1 to 2.5 parts by mass of the fatty acid salt and 0.01 to 10 parts by mass of the polyvinylpyrrolidone claim 3 , relative to 100 parts by mass of the chlorosulfonated polyethylene.5. The chlorosulfonated polyethylene latex according to claim 1 , wherein the polyoxyalkylene alkyl ether sulfate is at least one selected from the group consisting of ...

Adhesive having structural integrity and insulative properties

An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.

Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

Optical Adhesive With Diffusive Properties

Optical adhesives that also diffuse visible light include a blend of an adhesive matrix which is an optical adhesive and a block copolymer. The adhesive may be a pressure sensitive adhesive and contains either acid or basic functionality. The block copolymer, which may be a diblock copolymer, contains a high Tg block and a functional block, the functionality of the functional block is complimentary to the functionality of the adhesive matrix to form an acid-base interaction. The adhesive may also contain a crosslinking agent.

PROPYLENE POLYMER-BASED HOT MELT ADHESIVE COMPOSITION EXHIBITING FAST SET TIME AND ARTICLES INCLUDING THE SAME

A hot melt adhesive composition that includes at least 35% polymer, from about 15% by weight, to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from 0 mole % to about 37.5% by weight of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g, from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm, and from 18% by weight to about 37% by weight of a wax component that exhibits a melting point greater than 80° C. and a heat of fusion of at least 200 J/g. 1. A hot melt adhesive composition comprising:at least 35% by weight polymer;from about 15% by weight to no greater than 75% by weight propylene polymer derived from at least 50% by weight propylene and from about 0 mole % to about 37.5 mole % of an alpha-olefin comonomer other than propylene, the propylene polymer exhibiting a heat of fusion of from about 5 Joules per gram (J/g) to 60 J/g;{'sup': '3', 'from 5% by weight to about 50% by weight ethylene alpha-olefin copolymer derived from at least 50% by weight ethylene and at least one alpha-olefin comonomer having at least three carbon atoms, the ethylene alpha-olefin copolymer having a density of no greater than 0.90 g/cm; and'}from 18% by weight to about 37% by weight of a wax component exhibiting a melting point greater than 80° C. and a heat of fusion of at least 200 J/g,the composition exhibiting a set time of no greater than 1.5 seconds at an application temperature of at least 149° C.2. The hot melt adhesive composition of claim 1 , wherein the propylene polymer exhibits a theft temperature of no greater than 126° C.3. The hot melt adhesive composition of claim 1 , wherein the propylene polymer exhibits a ...

THERMALLY CROSSLINKABLE COMPOSITION

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C. 1. A thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C. , an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C. , a tackifier resin , and a curing agent , wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.2. The thermally crosslinkable composition according to comprising 30 to 200 parts by mass of the acid-modified polymer B based on 100 parts by mass of the acid-modified polymer A claim 1 , and 20 to 200 parts by mass of the tackifier resin and 0.2 to 3 parts by mass of the curing agent based on 100 parts by mass of a total amount of the acid-modified polymers A and B.3. The thermally crosslinkable composition according to claim 1 , wherein a content of the tackifier resin having an acid value of 5 or less is 20 to 100% by mass based on 100% by mass of a whole tackifier resin.4. The thermally crosslinkable composition according to claim 3 , wherein the tackifier resin having an acid value of 5 or less is selected from the group consisting of rosin types claim 3 , terpene types and petroleum resin types.5. The thermally crosslinkable composition according to claim 1 , wherein the curing agent is a solid polyamine compound having a melting point of 150° C. or higher.6. The thermally crosslinkable composition according to claim 5 , wherein the solid polyamine compound having a melting point ...

WATERBORNE ADHESIVES FOR REDUCED BASIS WEIGHT MULTILAYER SUBSTRATES AND USE THEREOF

The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates. 1. A method of making an article with improved structural integrity , comprising the steps of:(a) providing a first substrate having a first and a second side;(b) preparing an adhesive composition by combining (i) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, vinylacrylic, styrene acrylic, acrylic, styrene butyl rubber, polyurethane and mixtures thereof; (ii) about 0.5% to about 5%, based on the total weight of the adhesive, of a plurality of microspheres;(c) applying the adhesive onto the first side of the first substrate;(d) providing a second substrate having a first and a second side;(e) contacting the first side of the second substrate directly on the adhesive to form the article;(f) applying heat or radiation to expand the expandable microspheres; and(g) drying the adhesive to form a bond adhering the first and the second substrates;wherein the article has substantially similar thermal insulation loss with up to about 26% decrease in substrate basis weight than an article without the microspheres.2. The method of wherein the substrate is a fiberboard claim 1 , corrugated board claim 1 , SBS claim 1 , kraft paper claim 1 , coated paper claim 1 , oriented polypropylene film.3. The method of wherein the basis weight of the substrate ranges from 2 to 35 pounds per 1000 ft.4. The method of claim 1 , wherein the boards and papers comprise a portion of recycled fiber. The present invention relates to an adhesive and article that comprises a waterborne adhesive ...

CURABLE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE, AND THE METHOD FOR MAKING THE SAME

Curable adhesive compositions that can be used to prepare the pressure-sensitive adhesives, and methods of making the pressure-sensitive adhesives are provided. More particularly, the pressure-sensitive adhesives contain (a) a (meth)acrylate copolymer having a weight average molecular weight greater than 500,000 grams/mole (Daltons), (b) a high glass transition temperature (meth)acrylate polymer tackifier having a Tg of at least 5° C. and (c) a low glass transition temperature (meth)acrylate polymer tackifier having a Tg no greater than 0° C. The pressure-sensitive adhesives advantageously are prepared by ultraviolet (UV) curing a curable adhesive composition that contains minimal or no organic solvents. 1. A curable adhesive composition comprising: (1) a non-tertiary alkyl acrylate; and', '(2) an acid-functionalized ethylenically unsaturated monomer; and, '(a) a first syrup polymer formed from a first reaction mixture, the first reaction mixture comprising'} (i) 1 to 30 weight percent of a partially polymerized acid-functionalized (meth)acrylate copolymer based on a total weight of monomers in the first reaction mixture, wherein the partially polymerized acid-functionalized (meth)acrylate copolymer has a weight average molecular weight greater than 500,000 grams/mole (Daltons); and', '(ii) 70 to 99 weight percent of un-reacted monomers based on the total weight of monomers in the first reaction mixture; and, 'wherein the first syrup polymer comprises'}(b) a high glass transition temperature (meth)acrylate polymer tackifier having a glass transition temperature of at least 5° C.; and(c) a low glass transition temperature (meth)acrylate polymer tackifier having a glass transition temperature no greater than 0° C.; and(d) an ultraviolet photoinitiator.2. The curable adhesive composition of claim 1 , wherein the weight average molecular weight of the high glass transition temperature (meth)acrylate polymer tackifier is in a range of 10 claim 1 ,000 to 150 claim 1 ,000 ...

FILM BACKINGS FOR PEEL RELEASE MOUNTING

A peelable adhesive article capable of adhering to a substrate wherein subsequent removal of the adhesive does not damage the substrate, and methods of making and using said peelable adhesive article. The adhesive articles comprise a peelable adhesive adjacent to a major surface of a backing, wherein the backing has a modulus of elasticity and/or modulus of secant between 100 to 18,000 psi as measured by ASTM D638-14 and/or ASTM D412-06a. The backing may be a multilayer backing comprising a core layer and at least one skin layer in a ratio of 2:1 to 100:1. 1. An adhesive article , comprising: a core layer comprising at least one of an elastomeric material, an elastomeric polymer, SEBS, SEPS, SIS, SBS, polyurethane, ethyl vinylacetate (EVA), ethyl methyl acrylate (EMA) ultra low linear density polyethylene (ULLDPE), hydrogenated polypropylene, and combinations or blends thereof;', 'a first skin layer comprising at least one of polypropylene, polyethylene, high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), a polyurethane, EVA, EMA, an adhesive, and combinations or blends thereof; and, 'a multilayer backing comprisinga peelable adhesive adjacent to a major surface of the multilayer backing;wherein the backing has a core to skin ratio of between about 2:1 and about 100:1; andwherein the backing has a modulus of elasticity and/or a modulus of secant of between about 100 psi and about 18,000 psi as determined by at least one of ASTM D638-14 and ASTM D412-06a.2. The adhesive article of claim 1 , further comprising:a second skin layer comprising at least one of polypropylene, polyethylene, high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), a polyurethane, EVA, and combinations or blends thereof.3. The adhesive article of claim 1 , wherein the backing has a thickness of between about 2 mils and about 40 mils.4. The adhesive article of claim 1 , wherein a force of ...

ANAEROBICALLY CURABLE COMPOSITIONS

An anaerobically curable composition comprising a hydroxy-functionalized mono(meth)acrylate compound, an aromatic mono(meth)acrylate compound which is not the same as the hydroxy-functionalized mono(meth)acrylate compound, a (meth)acrylate functionalised polyurethane resin, and an anaerobic cure inducing component. 1. An anaerobically curable composition comprising:(i) a hydroxy-functionalized mono(meth)acrylate compound,(ii) an aromatic mono(meth)acrylate compound which is not the same compound as the hydroxy-functionalized mono(meth)acrylate compound,(iii) a (meth)acrylate functionalised polyurethane resin, and(iv) an anaerobic cure inducing component.2. The composition of wherein the hydroxy-functionalized mono(meth)acrylate compound comprises hydroxyethyl methacrylate.3. The composition of wherein the hydroxy-functionalized mono(meth)acrylate compound is present in an amount from about 5% to about 30% by weight based on the total weight of the composition.4. The composition of wherein the hydroxy-functionalized mono(meth)acrylate compound is present in an amount from about 7% to about 15% by weight based on the total weight of the composition.5. The composition of wherein the hydroxy-functionalized mono(meth)acrylate compound has a molecular weight below about 1000 g/mol claim 1 , or below about 800 g/mol claim 1 , or below about 600 g/mol claim 1 , or below about 400 g/mol claim 1 , or below about 200 g/mol.6. The composition of wherein the hydroxy-functionalized mono(meth)acrylate compound has a molecular weight of from about 100 g/mol to about 150 g/mol.7. The composition of wherein the aromatic mono(meth)acrylate compound comprises benzyl methacrylate claim 1 , tetrahydrofurfuryl methacrylate or combinations thereof.8. The composition of wherein the aromatic mono(meth)acrylate compound is present in an amount from about 5% to about 60% by weight based on the total weight of the composition.9. The composition of wherein the aromatic mono(meth)acrylate ...

ELECTRICALLY PEELABLE ADHESIVE COMPOSITION AND ELECTRICALLY PEELABLE ADHESIVE SHEET, AND METHOD FOR USING ELECTRICALLY PEELABLE ADHESIVE SHEET

An electrically peelable pressure sensitive adhesive composition, which contains an acrylic polymer (A), a (poly)alkylene polyol (B) having a number average molecular weight of no greater than 2000, and an ammonium salt (C), has a high adhesiveness before voltage application, but the adhesiveness can decrease effectively by voltage application for a short time. 1. An electrically peelable pressure sensitive adhesive composition comprising an acrylic polymer (A) , a (poly)alkylene polyol (B) having a number average molecular weight of 2000 or less , and an ammonium salt (C).2. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component(C) is an ammonium sulfonate.3. The electrically peelable pressure sensitive adhesive composition according to claim 2 , wherein the ammonium sulfonate is a compound represented by the following general formula (c-1):{'br': None, '[Chem. 1]'}{'br': None, 'sup': 1', '2, 'sub': n', '3', '4, 'RO\ue8a0RO\ue8a0SONH\u2003\u2003(c-1)'}{'sup': 1', '2, 'wherein Rrepresents any of an alkyl group that may have a substituent, an alkenyl group that may have a substituent, and an aryl group that may have a substituent, and a polycyclic aromatic hydrocarbon group is also included in the aryl group; Rrepresents an alkylene group having 1 to 10 carbon atoms that may have a substituent; and n represents a real number of 1 or more.'}4. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein a content of the component(C) is 3 to 250 parts by mass based on 100 parts by mass of the component(A).5. The electrically peelable pressure sensitive adhesive composition according to claim 1 , wherein the component(B) comprises a (poly)alkylene glycol.6. The electrically peelable pressure sensitive adhesive composition according to claim 5 , wherein the (poly)alkylene glycol is a compound represented by the following general formula (b-1):{'br': None, '[Chem. 2]'}{'br': None, ...

AQUEOUS DISPERSIONS COMPRISING POLYURETHANE AND ETHYLNENIC COPOLYMERS FOR HEAT SEALABLE COATINGS

A film forming aqueous dispersion having utility as heat seal coatings for blister packaging applications comprises a blend of 10-90% by weight of one or more polyurethane dispersions; 90-10% by weight one or more compatible ethylenic copolymer dispersions/emulsions; an anti-blocking additive at 0.1-12 weight % of the total solids; and optional additives including wetting, defoaming, thickener, antifungal additives. The heat seal coating compositions provide enhanced and balanced properties such as a reduction of organic solvents, a tack free coating surface off the press, good press runnability, easy clean-up, antiblocking from ambient temperature to 50° C., heat-activation with no pot life at elevated temperatures, and, heat sealability to various plastic substrates including Virgin Poly(ethylene terephthalate) (PET), recycle PET (RPET), Amorphous PET (APET), PET-Glycol modified (PETG), PETG/APET/PETG (GAG) and Polyvinyl chloride (PVC). 1. A film forming aqueous dispersion coating composition having utility as a heat seal coating for blister packaging applications comprising:A) 10% to 90% by weight of one or more polyurethane dispersions having a melting point in the range of −30° C. to 120° C.;B) 90% to 10% by weight of one or more compatible ethylenic copolymer dispersions/emulsions;C) an anti-blocking additive at 0.1-12 weight % of total solids; and{'sup': 4', '5, 'D) optionally one or more wetting, defoaming, thickener, or antifungal additives; the heat seal coating when dried having a shear storage modulus G′ at a heat seal activation range of 170° F.- 240° in the range of 3.5×10to 6.0 ×10Pascals; the ethylenic copolymer dispersion having a glass transition temperature Tg in the range of −30° C. to 130° C.'}2. The coating of wherein a solid resin weight ratio between A and B is in a range of 15/85 to 85/15.3. The coating of claim 1 , wherein the polyurethane dispersion has a melting point or softening point in the range of −30° C. to 120° C.4. The coating of ...

Novel hot-melt adhesive and preparation method therefor

A novel hot-melt adhesive and a preparation method thereof are disclosed, and in particular a hot-melt adhesive for bonding aluminum, stainless steel or other metal materials and PVC plastics is disclosed. The specific nylon-type copolyamide is firstly prepared by designing specific raw materials and percentage thereof, and in combination with favorable bonding properties of the nylon-type copolyamide for metals and favorable bonding characteristics of the perchloroethylene resin for PVC, a double screw extruder is utilized to perform sufficient melt blending on the nylon-type copolyamide and the perchloroethylene resin under the synergistic actions of related aids, so that the obtained novel hot-melt adhesive has favorable bonding properties for both metals and PVC.

Method for producing polymer latex

A method for producing a polymer latex, includes a step of emulsifying a polymer solution of a synthetic polyisoprene and/or a styrene-isoprene-styrene block copolymer, in water in the presence of a rosin and/or a rosin metal salt, thereby obtaining an emulsified liquid, wherein the rosin and/or the rosin metal salt to be used have/has a total content rate of abietic acid, neoabietic acid and palustric acid, and salts thereof, of 5% by weight or less.

METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE ADHESIVE INCLUDING GAPPER AND METHOD FOR MOUNTING COMPONENT USING GAPPER

Provided relates to a method for manufacturing an anisotropic conductive adhesive and a method for mounting a component using an anisotropic conductive adhesive, and provides a method for manufacturing an anisotropic conductive adhesive, including: a process of removing a first oxide film on solder particles by using a first reducing agent; and a process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin. 1. A method for manufacturing an anisotropic conductive adhesive including a gapper , comprising:a process of removing a first oxide film on solder particles by using a first reducing agent; anda process of manufacturing an anisotropic conductive adhesive by mixing the solder particles, a gapper, and an adhesive resin.2. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 1 ,wherein the gapper includes at least one material selected from the group consisting of a polymer bead, a polymer particle, an inorganic particle, and mixtures thereof.3. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the polymer bead includes at least one material selected from the group consisting of polymethyl methacrylate, polystyrene, polyurethane, polyethylene, polyethyleneimine, polypropylene, and polyisobutylene.4. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the polymer particle includes Teflon or polyethylene.5. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 2 ,wherein the inorganic particle includes at least one material selected from the group consisting of alumina, silica, glass, and silicon carbide.6. The method for manufacturing an anisotropic conductive adhesive including a gapper of claim 1 ,wherein in the process of manufacturing the anisotropic conductive adhesive, the gapper is mixed at 2 vol % to 60 vol % relative ...

Hot-melt Adhesives Processable with High Speed Processes

A new hot-melt adhesive formulations having improved processability and that are easily processable even with processes at high speed and in particular with Spraying or Fiberization processes. Said hot-melt adhesive formulations comprise, as their main polymer component, at least one isotactic metallocene butene-1 polymer composition, that has a low viscosity, and that has a substantially bimodal composition, directly obtained during polymerization, in two consecutive and separate reaction steps, where the first polymer (polymer A) of said compositionally bimodal polymer composition is an isotactic butene-1 homopolymer or an isotactic butene-1 copolymer with another olefin, while the second polymer (polymer B) is an isotactic copolymer of butene-1, with another olefin, with a chemical composition obviously different from A, qualitatively and/or quantitatively; said hot-melts further comprising a viscosity modifier that is not solid at room temperature.

Terminated covered electric wire, wire harness, and anticorrosive agent

The object is to provide a terminated covered electric wire and a wire harness in which an anticorrosive agent comes into intimate contact with the surface of a terminal fitting and a high anticorrosive performance is exhibited in an electrical connection portion between an electric wire conductor and the terminal fitting even when oil adheres to the surface of the terminal fitting, and to provide an anticorrosive agent capable of exhibiting such a high anticorrosive performance. An electrical connection portion in which a terminal fitting having a surface to which processing oil adheres and an electric wire conductor of a covered electric wire are electrically connected to each other is covered with an anticorrosive agent containing an adhesive resin and an oil-adsorbing organic macromolecule to configure a terminated covered electric wire.

ADHESIVE AGENT AND ADHESIVE SHEET

An adhesive agent produced by crosslinking an adhesive agent composition containing a polyester resin (i) having a structural portion derived from a polycarboxylic acid compound (a) and a structural portion derived from a polyol component (b), wherein the polyester resin (i) contains a structural portion derived from at least one selected from the group consisting of a dimer acid compound, a sebacic acid compound, and a dimer diol in a proportion of not less than 60 wt. % based on the weight of the polyester resin (i), wherein the polyol component (b) includes a glycol (b1) having an even carbon number (excluding the dimer diol), wherein the polyester resin (i) has an ester group concentration of not less than 2 mmol/g. The adhesive agent has an adhesive force (α) of not less than 1 N/25 mm as measured under predetermined conditions. 1. An adhesive agent comprising a crosslinked adhesive agent composition which comprises a polyester resin (i) having a structural portion derived from a polycarboxylic acid compound (a) and a structural portion derived from a polyol component (b) ,wherein not less than 60 wt. % of a total weight of the polyester resin (i) comprises a structural portion derived from at least one selected from the group consisting of a dimer acid compound, a sebacic acid compound, and a dimer diol,wherein the polyol component (b) comprises a glycol (b1) having an even carbon number, excluding the dimer diol, andwherein the polyester resin (i) has an ester group concentration of not less than 2 mmol/g,the adhesive agent having an adhesive force (α) of not less than 1 N/25 mm as measured as a 180-degree peel strength (N/25 mm) by forming an adhesive agent layer of the adhesive agent on a substrate to provide an adhesive sheet, bonding the adhesive sheet to an adherend of a bright annealed stainless steel plate, allowing the resulting structure to stand still at 23° C. at 50% RH for 30 minutes, and peeling the adhesive sheet from the adherend at a peel rate ...

IMPROVEMENTS IN AND RELATING TO POLYMER MATERIALS

Polyurethane material for indicating pH at a locus, preferably as indication of presence of microbes, comprising a polyurethane network having immobilised therein one or more hydrophilic copolymers, the or each said copolymer comprising:

PRESSURE-SENSITIVE ADHESIVE LAYER, PRESSURE-SENSITIVE ADHESIVE TAPE, AND DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE

The purpose of the present invention is to provide: a polyester-based pressure-sensitive adhesive layer, for which a pressure-sensitive adhesive composition (pressure-sensitive adhesive solution) without any acrylic pressure-sensitive adhesive or the like which needs a large amount of an organic solvent and is difficult to apply thickly; to provide a polyester-based pressure-sensitive adhesive layer that is friendly to the global environment, can be applied thickly, has a high level of cost effectiveness and workability, and also has a high level of adhesion, retention, and repulsion resistance; and to provide a pressure-sensitive adhesive tape or double-sided pressure-sensitive adhesive tape having such a pressure-sensitive adhesive layer. The invention is directed to a polyester-based pressure-sensitive adhesive layer including a product made from a polyester-based pressure-sensitive adhesive composition including: a polyester obtained by polycondensation of at least a dicarboxylic acid component and a diol component; and a tackifier, the polyester-based pressure-sensitive adhesive layer having a gel fraction of 15% by weight or more to less than 40% by weight.

ADHESIVE MATERIAL AND METHOD OF USE THEREOF

An adhesive material which comprises an epoxy component including a first flame retardant and a curing component which includes an adhesion promoter and a second flame retardant The epoxy component and curing component are present in a ratio of about 1:1 and the adhesive is formed when the epoxy component is combined with the curing component 1. A composition comprising:a. an epoxy component including a first flame retardant; andb. a curing component which includes an adhesion promoter and a second flame retardant;wherein an adhesive is formed when the epoxy component is combined with the curing component.2. The composition of claim 1 , wherein after cure claim 1 , upon applying a flame for about 80-seconds the material composition has about a 6.0″ burn length or less claim 1 , the flame takes about 15 seconds or less to extinguish claim 1 , and drippings from the adhesive do not continue to flame for more than about 3 seconds after falling claim 1 ,3. The composition of claim 1 , wherein after cure claim 1 , upon applying a flame to the material composition for 12-seconds the material composition has about a 8.0″ burn length or less claim 1 , the flame takes about 15 seconds or less to extinguish claim 1 , and drippings from the adhesive do not continue to flame for more than about 3 seconds after falling claim 1 ,4. The composition of claim 1 , wherein the adhesive has a gel time greater than or equal to about three minutes and less than or equal to about 60 minutes after the epoxy component and the curing component have been combined.5. The composition of claim 2 , wherein the adhesive has a gel time greater than or equal to about three minutes and less than or equal to about 10 minutes after the epoxy component and the curing component have been combined.6. The composition of wherein the adhesive has a gel time greater than or equal to about 5 minutes and less than or equal to about 20 minutes after the epoxy component and the curing component have been combined ...

OPTICAL LAYERED BODY AND METHOD FOR MANUFACTURING SAME

An optical layered body including a substrate and an adhesive layer formed on the substrate, wherein the adhesive layer includes an acrylic adhesive composition containing an acrylic polymer, and a light scattering particle, the acrylic polymer is a copolymer of a copolymerizing component [I] which contains 40% by weight to 93% by weight of an aromatic ring-containing monomer (a1), and 7% by weight to by weight of a hydroxyl group-containing monomer (a2), the acrylic polymer has a weight-average molecular weight of 200,000 or less, the light scattering particle has a volume concentration V relative to the adhesive layer of 3% to 35%, the acrylic adhesive composition has a refractive index of 1.52 to 1.67, and the light scattering particle has a refractive index of 1.4 to 1.49. 1. An optical layered body comprising a substrate and an adhesive layer formed on the substrate , whereinthe adhesive layer includes an acrylic adhesive composition containing an acrylic polymer, and a light scattering particle,the acrylic polymer is a copolymer of a copolymerizing component [I] which contains 40% by weight to 93% by weight of an aromatic ring-containing monomer (a1), and 7% by weight to 60% by weight of a hydroxyl group-containing monomer (a2),the acrylic polymer has a weight-average molecular weight of 200,000 or less,the light scattering particle has a volume concentration V relative to the adhesive layer of 3% to 35%,the acrylic adhesive composition has a refractive index of 1.52 to 1.67, andthe light scattering particle has a refractive index of 1.4 to 1.49.2. The optical layered body according to claim 1 , wherein the light scattering particle is a silicone particle or an acryl particle.3. The optical layered body according to claim 1 , wherein at least ¼ in volume of the light scattering particle contained in the adhesive layer has a particle diameter of 0.1 μm to 1 μm.4. The optical layered body according to claim 1 , whereinthe light scattering particle has an average ...

Hot-melt adhesive composition

The present invention provides a hot melt adhesive composition comprising (A) an ethylene copolymer obtained by copolymerizing ethylene and α-olefin using a single-site catalyst and (B) a rosin ester, in a hydrolyzate of which a dehydroabietic acid content is 30 wt % or less and an abietic acid content is 10 wt % or less, and in a methylated product of the hydrolyzate of which a content of components having a molecular weight of 320 is equal to or greater than 10 wt % of a total amount of components having a molecular weight of 314 to 320.

Stimuli-Responsive Micro-Reservoirs for Release of Encapsulants

This invention relates to polymer-based partially-open, hollow reservoirs in the nano-size to micro-size range that encapsulate an additive, which can be released from the reservoirs using specific event stimuli such as reduction-oxidation and voltage change, or at will, using the same stimuli. This invention also relates to method preparing such reservoirs, and for releasing the additive. This invention further relates to matrix that comprises such reservoirs and the method of preparing such matrix. This invention also relates to applications, for example in corrosion inhibition, lubrication, and adhesion, that benefit from using such a controlled release of an additive.

ADHESIVE COMPOSITION

An adhesive composition having excellent life properties is provided. This adhesive composition achieves excellent life properties by containing an epoxy compound, an aluminum chelating agent, and a hindered amine compound. This is presumably because the aluminum chelating agent stably exists due to the coordination of the nitrogen atom of the hindered amine compound with aluminum of the aluminum chelating agent. 1. An adhesive composition comprising an epoxy compound , an aluminum chelating agent , and a hindered amine compound.2. The adhesive composition according to claim 1 , wherein the aluminum chelating agent is an aluminum chelating latent curing agent held in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound.3. The adhesive composition according to claim 1 , wherein the aluminum chelating agent is an aluminum chelating latent curing agent that is held in a porous resin obtained by interfacial polymerization of a polyfunctional isocyanate compound and simultaneous radical polymerization of divinylbenzene.4. The adhesive composition according to claim 2 , wherein the content of the hindered amine compound is 0.05 to 15 parts by mass with respect to 100 parts by mass of the total of the epoxy compound and the aluminum chelating latent curing agent.5. The adhesive composition according to claim 2 , wherein the aluminum chelating latent curing agent is obtained by impregnating the porous resin with a silanol compound.6. The adhesive composition according to claim 2 , wherein the aluminum chelating latent curing agent is obtained by impregnating the porous resin with a silanol compound.7. The adhesive composition according to claim 1 , wherein an exothermic onset temperature measured at a heating rate of 10° C./min by a differential scanning calorimetry is 80 to 90° C.8. The adhesive composition according to claim 2 , wherein the exothermic onset temperature measured at a heating rate of 10° C./min by a differential ...

SILANE-MODIFIED POLYETHER SEALANT AND PREPARATION METHOD AND USE THEREOF

Silane-modified polyether sealant and preparation methods and uses thereof The silane-modified polyether sealant includes the following raw materials: a silane-modified polyether resin, a plasticizer, a drilling agent, a filler, an adhesion promoter and a catalyst. In the present invention, various coupling agents are hydrolyzed and cross-linked to form an oligomer as the adhesion promoter. Compared with ordinary silane coupling agents, the oligomer coupling agent has higher activity to promote deep curing of the adhesive. In addition, compared with ordinary catalysts, the catalyst prepared by the present invention has higher catalytic activity. It accelerates the hydrolysis, crosslinking and curing of the adhesive, thus helping to obtain a uniformly dispersed, thixotropic single-component silane-modified polyether sealant. 1. A silane-modified polyether sealant , comprising the following parts by weight of raw materials: 15-30 parts of silane-modified polyether resin , 10-20 parts of plasticizer , 0.5-2 parts of drying agent , 30-70 parts of filler , 1-3 parts of adhesion promoter and 0.1-0.5 parts of catalyst.2. The silane-modified polyether sealant according to claim 1 , wherein the plasticizer is at least one of diisononyl phthalate (DINP) claim 1 , diisodecyl phthalate (DIDP) claim 1 , diisononyl cyclohexane 1 claim 1 ,2-dicarboxylate (DINCH) and polypropylene glycol (PPG); the drying agent is vinyl trimethoxysilane (VTMS).3. The silane-modified polyether sealant according to claim 1 , wherein the filler is at least one of ground calcium carbonate (GCC) claim 1 , nano calcium carbonate (NCC) claim 1 , quartz powder claim 1 , silica claim 1 , titanium dioxide (TD) and carbon black.4. A silane-modified polyether sealant comprising the following parts by weight of raw materials: 15-30 parts of a silane-terminated polyether with hydrolysable trimethoxy as a terminal group claim 1 , 10-20 parts of plasticizer claim 1 , 0.5-2 parts of drying agent claim 1 , 30-70 ...

PRODUCING A PRESSURE-SENSITIVE ADHESIVE BASED ON SOLID EPDM RUBBER

A process for the continuous and solvent-free production of a pressure-sensitive adhesive based on solid EPDM rubber, the pressure-sensitive adhesive produced thereby, and an adhesive tape containing the pressure-sensitive adhesive. The pressure-sensitive adhesive is produced in a continuously operating assembly in the form of a planetary roller extruder having a filling section and a compounding section, the compounding section consisting of at least two coupled roller cylinders, by 1. A process for the continuous and solvent-free production of a pressure-sensitive adhesive based on solid EPDM rubber in a continuously operating assembly in the form of a planetary roller extruder having a filling section and a compounding section , the compounding section consisting of at least two coupled roller cylinders , bya) feeding the solid EPDM rubber and any further components into the filling section of the planetary roller extruder,b) transferring the components from the filling section into the compounding section,c) adding liquid EPDM rubber, plasticizer, tackifier resin, and any further components to the compounding section, andd) discharging the resultant pressure-sensitive adhesive,which process comprisesfeeding the solid EPDM rubber as a melt into the filling section.2. The process as claimed in claim 1 ,whereinthe solid EPDM rubber(i) is composed to an extent of 30 to 80 wt of ethylene,and/or(ii) is composed to an extent of 20 to 60 wt % of propylene, and/or(iii) is composed to an extent of up to 20 wt % of diene,based in each case on the total weight of the parent monomer composition.3. The process as claimed in claim 1 ,whereinthe solid EPDM rubber as well as ethylene and propylene comprises as diene ethylidene-norbornene (ENB), dicyclopentadiene or 1,4-hexadiene.4. The process as claimed in claim 1 ,whereinthe Mooney viscosity (ML 1+4/125° C.) of the solid EPDM rubber as measured according to DIN 53523 is at least 20 to 120.5. The process as claimed in claim 1 , ...

PRESSURE-SENSITIVE ADHESIVE SHEET AND PRESSURE-SENSITIVE ADHESIVE COMPOSITION

Provided is a PSA sheet that provides reliable adhesion even upon contact with grease. Provided is an adhesively double-faced PSA sheet having a PSA layer. The PSA sheet has an initial push-peel strength of 0.5 MPa or greater. It has an adhesive strength retention rate of 25% or higher, determined as the ratio of the push-peel strength at 24 hours after artificial sebum application to the push-peel strength before the artificial sebum application. 1. A portable electronic device having a touch panel whose display also serves as an input device , whereinthe touch panel can be operated by direct finger touch,the portable electronic device has components bonded with a pressure-sensitive adhesive sheetthe pressure-sensitive adhesive sheet is an adhesively double-faced PSA sheet having a pressure-sensitive adhesive layer,the pressure-sensitive adhesive sheet has an initial push-peel strength of 0.5 MPa or greater,the pressure-sensitive adhesive sheet has a push-peel strength at 24 hours after artificial sebum application, retaining at least 25% of the initial push-peel strength.2. The portable electronic device according to claim 1 , that is a portable phone.3. The portable electronic device according to claim 1 , that is a smartphone.4. The portable electronic device according to claim 1 , that is a tablet PC.5. The portable electronic device according to claim 1 , that is a wearable device.6. The portable electronic device according to claim 1 , that is a digital camera.7. The portable electronic device according to claim 1 , that is a portable music player.8. The portable electronic device according to claim 1 , that is a portable game device.9. The portable electronic device according to claim 1 , that is an electronic dictionary.10. The portable electronic device according to claim 1 , that is an electronic book.11. An adhesively double-faced pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer claim 1 ,having an initial push-peel strength of ...

Polymeric Materials Formed Using Controlled Radical Initiators

Controlled radical initiators, reaction mixtures containing the controlled radical initiators and various ethylenically unsaturated monomers, polymeric materials formed from the reaction mixtures, crosslinkable compositions containing the polymeric materials, and crosslinked compositions formed from the crosslinkable compositions are provided. The controlled radical initiators are bis-dithiocarbamate or bis-dithiocarbonate compounds having a single carbon between the two dithiocarbamate or dithiocarbonate groups. 2. The polymeric material of claim 1 , wherein y is equal to 1 and z is in a range of 0 to 1.3. The polymeric material of claim 1 , wherein y is equal to 2 and z is in a range of 0 to 2.4. The polymeric material of claim 1 , wherein y is equal to 3 and z is in a range of 0 to 3.5. The polymeric material of claim 1 , wherein Ris —(CO)OR.7. The crosslinkable composition of claim 6 , wherein the second monomer composition further comprises a monomer having a single ethylenically unsaturated group.8. The crosslinkable composition of claim 6 , wherein the crosslinkable composition comprises 1) 5 to 99.99 weight percent polymeric material of Formula (II) and 2) a second monomer composition comprising a) 0.01 to 20 weight percent crosslinking monomer having at least two ethylenically unsaturated groups claim 6 , and b) 0 to 95 weight percent monomer having a single ethylenically unsaturated group claim 6 , wherein each amount is based on a total weight of polymerized and polymerizable material.9. The crosslinkable composition of claim 6 , wherein the crosslinkable composition further comprises a photoinitiator.10. The crosslinkable composition of claim 6 , wherein the polymeric material is an elastomeric material and wherein the crosslinkable composition further comprises a tackifier.12. An article comprising a first substrate and a crosslinked composition layer adjacent to the first substrate claim 11 , wherein the crosslinked composition layer includes a cured ...

ADHESIVE COMPOSITION

The present invention relates to an adhesive composition comprising an α-olefin homopolymer, an α-olefin copolymer having a melting point of 90° C. or higher, a tackifier resin, a wax, and a liquid softener, wherein a complex shear modulus (I) measured immediately after heating the adhesive composition to 180° C. and cooling the same to 20° C. is 1 MPa or less. 1. An adhesive composition comprising:an α-olefin homopolymer;an α-olefin copolymer having a melting point of 90° C. or higher;a tackifier resin;a wax; anda liquid softener,wherein a complex shear modulus (I) measured immediately after heating the adhesive composition to 180° C. and cooling the same to 20° C. is 1 MPa or less.2. The adhesive composition according to claim 1 , wherein the α-olefin homopolymer contains at least one of a 1-butene homopolymer and a propylene homopolymer.3. The adhesive composition according to claim 1 , wherein the α-olefin copolymer contains at least one of a 1-butene/α-olefin copolymer and a propylene/α-olefin copolymer.4. The adhesive composition according to claim 1 , wherein the tackifier resin contains at least one selected from the group consisting of a terpene phenol resin claim 1 , a hydrogenated terpene resin claim 1 , and a hydrogenated petroleum resin.5. The adhesive composition according to claim 1 , wherein the wax contains a polypropylene-based wax.6. The adhesive composition according to having a melt viscosity of 100 Pa·s or less at 180° C.7. The adhesive composition according to claim 1 , wherein a peeling length is 10 mm or less when performing a thermal creep resistance test with a load of 100 g for 24 hours in an atmosphere of 80° C. after bonding adherends via the adhesive composition with an open time of 45 seconds. The present invention relates to a solvent-free non-reactive adhesive composition for automotive interior, which is used when bonding a molded product made of polyolefin or the like and a covering material such as a fabric lined with a ...

Lightweight environment-friendly polypropylene composite floor and preparation process thereof

The present invention provides is a lightweight environment-friendly polypropylene composite floor comprising, from top to bottom: 1) a scratch-resistant coating layer, 2) a super-transparent wear-resistant layer, 3) a decorative layer, 4) a first substrate layer, 5) a second substrate layer, 6) a bottom connective layer, and optionally 7) a back adhesive layer. Also provided is a preparation process of the composite floor.

EPOXY RESIN COMPOSITIONS FOR PRE-GEL OVENS

An epoxy adhesive composition is provided that has superior wash-off resistance after pre-gelling, and may be used, for example, in manufacturing processes, for example, in the automobile industry. The composition also provides unique viscosity profile after pre-gelling to significantly reduce failure mode in subsequent processing steps. In preferred embodiments the adhesive composition comprises an epoxy type resin and a gelling agent selected from polyesterdiols and polyvinyl butyrals. 1. A process of pre-gelling an article comprisinga) providing an adhesive composition to various joints of the article; andb) passing the article through a pre-gel oven;wherein the adhesive composition after the pre-gel oven exhibits a viscosity below 500 Pas at 80° C.2. An adhesive composition that exhibit a lower viscosity and storage modulus values after the pre-gelling process than those before the pre-gelling process.3. The adhesive composition according to comprising polyesterdiols as gelling agent.4. The adhesive composition according to wherein the composition comprises less than 7 wt % of gelling agent claim 3 , based on total weight of the composition.5. The adhesive composition according to comprising polyvinyl butyrals as gelling agent.6. The adhesive composition according to wherein the composition comprises less than 5 wt % of gelling agent claim 5 , based on total weight of the composition.7. The process of pre-gelling an article according to wherein the adhesive composition after the pre-gel oven exhibits a viscosity below 400 Pas at 80° C.8. The process of pre-gelling an article according to wherein the adhesive composition after the pre-gel oven exhibits a viscosity below 400 Pas at 100° C.9. The process of pre-gelling an article according to wherein the adhesive composition after the pre-gel oven exhibits a viscosity below 300 Pas at 80° C. The present invention relates to epoxy adhesive systems, including, for example, epoxy adhesives that have good wash-off ...

Improved low-temperature impact resistance in ptmeg-based polyurethane impact modifiers

An impact modifier, which is an isocyanate-terminated polymer, the isocyanate groups of which are partially or completely blocked by reaction with a blocking agent, wherein the isocyanate-terminated polymer is a reaction product of a) one or more polyols including polytetramethylene ether glycol in a fraction of at least 95 wt %, with respect to the total weight of the polyols, and b) two or more polyisocyanates, which include at least one diisocyanate and at least one polyisocyanate having an average isocyanate functionality of 2.5 or more, wherein the molar ratio of isocyanate groups of the one or more diisocyanates to isocyanate groups of the one or more polyisocyanates having an average isocyanate functionality of 2.5 or more lies in the range of 2 to 1 to 20 to 1. The impact modifier is suitable in one-component epoxide resin formulations, one-component epoxide resin glues, but also in two-component epoxide resin formulations.

ACRYLIC ADHESIVE AND PROTECTIVE FILM INCLUDING THE SAME

Disclosed is an acrylic adhesive, including an acrylic polymer obtained by polymerizing a mixture of about 120 parts by weight to about 250 parts by weight of acrylic monomers with about 0.1 parts by weight to about 1 parts by weight of an azo initiator, about 0.5 parts by weight to about 1 parts by weight of a filler, about 1.5 parts by weight to about 2.5 parts by weight of a crosslinking agent, and about 0.5 parts by weight to 1 parts by weight of an anti-static agent. 1. An acrylic adhesive composition , comprising:an acrylic polymer obtained by polymerizing a mixture of about 120 parts by weight to about 250 parts by weight of acrylic monomers with about 0.1 parts by weight to about 1 parts by weight of an azo initiator, about 0.5 parts by weight to about 1 parts by weight of a filler, about 1.5 parts by weight to about 2.5 parts by weight of a crosslinking agent, and about 0.5 parts by weight to about 1 parts by weight of an anti-static agent.2. The acrylic adhesive composition as claimed in claim 1 , wherein the acrylic monomers include 2-ethylhexylacrylate and 2-(2-ethoxyethoxy)ethyl acrylate.3. The acrylic adhesive composition as claimed in claim 2 , wherein the acrylic monomers include about 100 parts by weight of the 2-ethylhexylacrylate and about 5 parts by weight to about 45 parts by weight of the 2-(2-ethoxyethoxy)ethyl acrylate.4. The acrylic adhesive composition as claimed in claim 2 , wherein the acrylic monomers further include butylacrylate.5. The acrylic adhesive composition as claimed in claim 4 , wherein the acrylic monomers include about 10 parts by weight to about 60 parts by weight of the butylacrylate.6. The acrylic adhesive composition as claimed in claim 4 , wherein the acrylic monomers further include hydroxyethylacrylate.7. The acrylic adhesive composition as claimed in claim 6 , wherein the acrylic monomers include about 4 parts by weight to about 45 parts by weight of the hydroxyethylacrylate.8. The acrylic adhesive composition as ...

HMPSA INCORPORATING A PLASTICISER MADE FROM A RENEWABLE RAW MATERIAL

1) An HMPSA composition comprising: 115-. (canceled)16. An HMPSA composition which comprises , on the basis of the total weight of said composition:from 20% to 50% by weight of a composition (a1) of styrene block copolymers which comprise at least one elastomer block;from 35% to 65% by weight of one or more tackifying resins (a2); andfrom 7% to 25% by weight of a plasticizer (a3);wherein the plasticizer (a3) has a composition (a3) comprising a stand oil (a3-1) of a vegetable oil.17. The HMPSA composition as claimed in claim 16 , wherein the composition (a1) of styrene block copolymers comprises claim 16 , on the basis of its total weight:from 30% to 90% by weight of at least one diblock copolymer selected from the group consisting of SI, SIB, SB, SEB and SEP, andfrom 10% to 70% by weight of at least one triblock copolymer selected from the group consisting of SIS, SIBS, SBS, SEBS and SEPS;wherein the total content of styrene units of said composition (a1) ranges from 10% to 40% by weight on the basis of the total weight of (a1).18. The HMPSA composition as claimed in claim 16 , wherein the tackifying resin (a2) comprises:(i) rosins of natural origin or modified rosins and derivatives thereof which are hydrogenated, dehydrogenated, dimerized, polymerized or esterified with monoalcohols or polyols;(ii) resins obtained by hydrogenation, polymerization or copolymerization (with an aromatic hydrocarbon) of mixtures of unsaturated hydrocarbons having around 5, 9 or 10 carbon atoms derived from petroleum cuts;(iii) terpene resins resulting from the polymerization of terpene hydrocarbons in the presence of Friedel-Crafts catalysts, which are optionally modified by the action of phenols; or(iv) copolymers based on natural terpenes.19. The HMPSA composition as claimed in claim 16 , wherein the vegetable oil stand oil (a3-1) is obtained by a process comprising a step of heating said vegetable oil in the absence of dioxygen at a temperature above 200° C.20. The HMPSA ...

POWDER ADHESIVE AND BONDED ARTICLE

The powder adhesive comprises a thermoplastic resin and particles of an aromatic compound, wherein the particles of an aromatic compound are particles of a compound that has an aromatic ring and an azo bond bonded to the aromatic ring, or are particles of a compound comprising a heteroaromatic ring comprising nitrogen atom; the thermoplastic resin comprises an ester group; and, designating Es (mmol/g) as an ester group concentration in the thermoplastic resin, M (mass %) as a content of the aromatic compound particles in the powder adhesive, and N (mmol/g) as a nitrogen atom concentration in the aromatic compound particles, Es is from 1.0 mmol/g to 4.5 mmol/g, M is from 1.0×10mass % to 1.0×10mass %, and N is from 5.0 mmol/g to 15.0 mmol/g. 2. The powder adhesive according to claim 1 , wherein Es claim 1 , M claim 1 , and D satisfy formula (1) below where D (nm) is a number-average particle diameter of the particle:{'br': None, 'sup': 3', '4, 'i': ≤Es', 'D/M, '1.0×10×()≤3.0×10\u2003\u2003(1).'}3. The powder adhesive according to claim 1 , wherein D is 30 to 200 nm where D (nm) is a number-average particle diameter of the particle.4. The powder adhesive according to claim 1 , wherein the aromatic compound is the compound comprising the aromatic ring and the azo bond bonded to the aromatic ring.6. The powder adhesive according to claim 5 , wherein the compound comprising the structure represented by the formula (4) is a pigment.7. The powder adhesive according to claim 1 , wherein the thermoplastic resin comprises a copolymer of monomers comprisinga styrenic polymerizable monomer, andat least one selected from the group consisting of acrylate esters and methacrylate esters.8. The powder adhesive according to claim 7 , wherein a content of the copolymer in the thermoplastic resin is 70 to 100 mass %.9. The powder adhesive according to claim 1 , wherein the aromatic compound is at least one selected from the group consisting of C. I. Pigment Yellow 74 claim 1 , C. I. ...

MATERIALS FOR USE AS ADHESIVE AND FOR SURFACE SEALING

Materials from the group consisting of 1. The use of one or more materials from the group consisting ofa) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another, in combination with one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates, wherein hybrid material and inorganic sol are crosslinked,b) one or more hybrid materials containing an organic polymer from the group of the polyamides, polyimides and epoxy resins and an inorganic oligo- or polymer from the group of the oligo- and polysiloxanes and heterocondensates of Si with Ti, Zr and/or Al, wherein the organic and the inorganic component are covalently bound to one another,c) one or more inorganic sols based on silyl alkoxylates and/or titanium alkoxylates andd) one or more polyamides, polyimides and/or epoxy resins mixed with oxidic and/or non-oxidic metal and/or metalloid particles, preferably from the group of the oxides, nitrides, carbides and mixtures thereof,as adhesive for the bonding of metals, plastics, concrete and/or ceramics.2. The use according to claim 1 , wherein one or more materials from the group a) are used.3. The use according to claim 1 , wherein one or more materials from the group b) are used.4. The use according to claim 1 , wherein one or more materials from the group c) are used.5. The use according to claim 1 , wherein one or more materials from the group d) are used.6. The use according to claim 1 , wherein the adhesive contains encapsulated curing accelerators claim 1 , preferably selected from the group consisting of water claim 1 , Lewis acids claim 1 , Lewis bases and mixtures of these components.7. The use according to claim 1 , wherein the adhesive is doped with magnetic ...

HIGH-PERFORMANCE REPAIR TAPE FOR BACKBOARD OF PHOTOVOLTAIC MODULE, AND MANUFACTURING METHOD THEREFOR

Disclosed is a high-performance repair tape for a backboard of a photovoltaic module. The tape comprises a base material layer, a functional adhesive layer, and a release material layer provided in sequence from top to bottom; the base material layer is formed of a polyester thin film material; the functional adhesive layer is formed of a high weather-resistance adhesive. According to the high-performance repair tape for a backboard of a photovoltaic module, and a manufacturing method therefor provided by the present invention, by selecting a weather-resistant base material layer, effects, such as water resisting, insulation, and ultraviolet radiation resistance, can be achieved, and a backboard independence effect is achieved; by selecting a weather-resistant adhesive for the functional adhesive layer, the weather resistance, high temperature resistance, and yellowing resistance of the tape can be improved; the tape has a strong bonding strength and is not easy to peel off, and the tape is easy to fit and facilitates construction. 1. A high-performance repair tape for a backboard of a photovoltaic module , comprising a base material layer , a functional adhesive layer , and a release material layer provided in sequence from top to bottom , wherein the base material layer is made up of a polyester film material , and the functional adhesive layer is made up of a high weather-resistance adhesive.2. The high-performance repair tape for a backboard of a photovoltaic module according to claim 1 , wherein the base material layer is any one selected from the group consisting of a composite polyester film claim 1 , a coated polyester film or a polymer co-extruded resin film.3. The high-performance repair tape for a backboard of a photovoltaic module according to claim 2 , wherein the composite polyester film comprises a core layer positioned in the middle and weather-resistant polymer films adhered to two sides of the core layer claim 2 , or comprises a core layer in the ...

Detachable adhesive composition systems and methods

A detachable adhesive composition for selectively adhering to an object and detaching therefrom, including an adhesive compound and a plurality of selectively activated particles. The composition is configured to adhere to an object when the selectively activated particles are inactive, and the plurality of selectively activated particles are configured to be activated upon exposure to and absorption of energy causing the selectively activated particles to flow and expand so as to form micro-cracks in the adhesive compound, flow into the micro-cracks, and react with the adhesive compound by at least one of at least partially chemically reacting with adhesive compound so as to at least partially digest the adhesive compound, and lubricating the adhesive compound so as to allow the detachable adhesive composition to detach from the object.

Polyamide compositions for sealants and high solids paints

A polyamide composition for use in sealants, adhesives and high solids coatings.

FARNESENE-BASED TACKIFYING RESINS AND ADHESIVE COMPOSITIONS CONTAINING THE SAME

A tackifying resin includes a farnesene-based polymer having monomeric units derived from a farnesene monomer and one or more optional comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics and has a softening point greater than or equal to 80 degrees Celsius. A method of making the farnesene-based polymer includes combining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, and polymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel. The tackifying resin may be combined with an elastomer to form a hot melt adhesive composition. 1. An adhesive composition comprising an elastomer and a tackifying resin ,wherein the tackifying resin comprises a polymer derived from monomers comprising farnesene,the polymer made according to a method comprisingcombining a farnesene monomer and a solvent and optionally adding one or more comonomers selected from the group consisting of dienes, branched mono-olefins, and vinyl aromatics, to provide a monomer feed, andpolymerizing the monomer feed by combining the monomer feed with a Friedel-Crafts catalyst in a vessel.2. The adhesive composition of claim 1 , wherein polymerizing the monomer feed comprises continuously feeding both the monomer feed and the Friedel-Crafts catalyst to the vessel.3. The adhesive composition of claim 1 , wherein the Friedel-Crafts catalyst is selected from the group consisting of BF claim 1 , AlCl claim 1 , SnCl claim 1 , and TiCl.4. The adhesive composition of claim 1 , wherein the Friedel-Crafts catalyst is at least one of AlCland BF.5. The adhesive composition of claim 4 , wherein the monomer feed includes 0 to 90 mol. % of the comonomer based on the total moles of monomer.6. The adhesive composition of claim 4 , wherein the monomer feed includes 0 to 40 mol. % of the ...

Adhesive Composition with Retarding Additive

The present disclosure relates to an adhesive composition comprising one or more (meth)acrylate ester monomers, a catalyst system and a retarding additive, wherein the retarding additive is a secondary amine; and to the use of secondary amines as retarding agents for adhesive compositions comprising methacrylate monomers. 1. An adhesive composition comprising one or more (meth)acrylate ester monomers , a catalyst system and a retarding additive , wherein the retarding additive is a secondary amine.2. The adhesive composition according to claim 1 , wherein the secondary amine is a secondary amine comprising more than one secondary amine group.3. The adhesive composition according to claim 2 , wherein the secondary amine is a secondary aryl amine.5. The adhesive composition according to claim 1 , wherein the retarding additive is selected from cyclic secondary amines.6. The adhesive composition according to claim 5 , wherein the cyclic secondary amine is a 2 claim 5 ,2 claim 5 ,4-trimethyl-1 claim 5 ,2-dihydroquinoline polymer.7. The adhesive composition according to any of the preceding claims claim 5 , wherein the retarding additive is comprised in an amount of 1% to 5% by weight claim 5 , based on the total weight of the adhesive composition.8. The adhesive composition according to any of the preceding claims claim 5 , wherein the one or more methacrylate ester monomers are comprised in an amount of 10% to 90% by weight claim 5 , based on the total weight of the adhesive composition.9. Use of a secondary amine or a mixture of secondary amines as a retarding additive for an adhesive composition comprising methacrylate monomers. The present disclosure generally relates to adhesive compositions, in particular adhesive compositions comprising one or more methacrylate monomers, a catalyst system and a retarding additive.Adhesive formulations based on methyl methacrylate (MMA) have been extensively investigated over the past decades resulting in a number of improvements ...

Adhesive sheet

The adhesive sheet can be easily peeled off by stretching even if the direction of the stretching is the perpendicular direction with respect to an attached surface of an attached object, and is less likely to break even when a substrate of the adhesive sheet is thin, and is excellent in impact resistance, shear adhesive strength, and cleavage adhesive strength. The present invention relates to an adhesive sheet including an adhesive layer and a substrate layer. The adhesive layer contains filler particles and an adhesive resin. The content of the filler particles in the adhesive layer is 10 parts by weight to 90 parts by weight relative to 100 parts by weight of the adhesive resin. The volume ratio of the filler particles to the adhesive layer is 4% to 40%. The adhesive sheet has a stress at 25% elongation of 0.15 Mpa to 82 Mpa.

HYDROGENATED COPOLYMER COMPOSITION, ADHESIVE MATERIAL COMPOSITION, AND ADHESIVE FILM

An object of the present invention is to provide a hydrogenated copolymer composition and the like having an excellent balance among initial tack strength, suppression of increase in tackiness, and suppression of uneven thicknesses of a tacky layer. The object can be achieved with the following hydrogenated copolymer composition. 2. The hydrogenated copolymer composition according to claim 1 , wherein the component (a)/the component (b) in terms of mass proportion is 60/40 to 10/90.3. The hydrogenated copolymer composition according to claim 1 ,wherein a vinyl bond content of the conjugated diene monomer unit included in the hydrogenated copolymer composition is 40 mol % to 70 mol %.4. The hydrogenated copolymer composition according to claim 3 , wherein the vinyl bond content is 40 mol % to 61.9 mol %.5. The hydrogenated copolymer composition according to claim 1 , wherein the component (a) and the component (b) are each represented by the following formulas:{'br': None, 'B2-A1-B1 and/or B2-A1-B1-X\u2003\u2003component (a){'br': None, 'sub': 'n', '(B2-A1-B1)X\u2003\u2003component (b)whereinA1 is a polymer block comprising a vinyl aromatic monomer unit as a main component,B1 and B2 are each independently a polymer block comprising a conjugated diene monomer unit as a main component,n is an integer of 2 or greater, andX is a residue of a coupling agent.6. The hydrogenated copolymer composition according to claim 5 , wherein a content of B2 included in the hydrogenated copolymer composition is 3 to 10 mass % based on the composition.7. An adhesive material composition comprising the hydrogenated copolymer composition according to and a tackifier.8. An adhesive film comprising the adhesive material composition according to . The present invention relates to a hydrogenated copolymer composition, an adhesive material composition, and an adhesive film.Block copolymers comprising a vinyl aromatic monomer unit and a conjugated diene monomer unit, which have elasticity ...

CURABLE POLYMERIC COMPOSITIONS HAVING IMPROVED OXYGEN BARRIER PROPERTIES

Curable polymeric compositions with improved barrier property to oxygen suitable to be used on flexible substrates containing a bisphenol F epoxy resin, at least an epoxy acrylate component and at least a rubber modified bisphenol and further comprising EVOH capsules or beads dispersed therein. The polymeric compositions are applicable either by a melt or liquid coating technique and undergo curing upon exposure to heat, showing viscoelastic properties and suitable to provide a cured product having high durability. 1. A curable composition comprising a bisphenol F epoxy resin , at least one rubber-modified epoxy resin , and at least one epoxy acrylate component , wherein ethylene-vinyl alcohol copolymer capsules are dispersed in said composition and a weight ratio between the bisphenol F epoxy resin and said capsules is comprised between 1 and 10.2. The curable composition according to claim 1 , wherein said composition further comprises a second bisphenol epoxy resin other than bisphenol F epoxy resin.3. The curable composition according to claim 2 , wherein a weight ratio of the bisphenol F epoxy resin with respect to the second bisphenol epoxy resin is comprised between 2 and 10.4. The curable composition according to claim 1 , wherein said bisphenol F epoxy resin is a liquid epoxy resin having number average molecular weights lower than 700 gr/mol.5. The curable composition according to claim 1 , wherein a weight ratio of said ethylene-vinyl alcohol copolymer capsules and said at least one rubber-modified epoxy resin is comprised between 0.5 and 5.6. The curable composition according to claim 1 , wherein a weight ratio of said at least one epoxy acrylate component with respect to said at least one rubber-modified epoxy resin is comprised between 0.1 and 1.7. The curable composition according to claim 1 , wherein said rubber-modified epoxy resin is present in amount of 1 to 10 parts by weight claim 1 , based on 100 parts by weight of the whole curable composition ...

ROOFING PUTTY, METHODS AND SYSTEMS UTILIZING THE SAME

Some embodiments of the present disclosure relate to a roofing putty. In some embodiments, the roofing putty is a formulation that comprises at least one polysiloxane, at least one silane, and at least one filler. Some embodiments of the present disclosure relate to a system comprising the roofing putty and at least one roof substrate. Some embodiments of the present disclosure relate to a method of using the roofing putty, such as, but not limited to, by disposing the roofing putty on at least one roof substrate. 1. A roofing system , comprising:a roof substrate; and wherein the roofing putty is present on the roof substrate,', at least one polysiloxane in an amount ranging from 50 wt % to 70 wt % based on a total weight of the roofing putty;', 'at least one filler; and', 'at least one silane,', 'wherein the at least one filler and the at least one silane are present in the roofing putty in a weight ratio of the at least one filler to the at least one silane ranging from 1:1 to 3:1;, 'wherein the roofing putty is a formulation that comprises], 'roofing putty,'}wherein the roofing putty exhibits an elongation ranging from 90% to 500%, when tested according to ASTM D2370.2. The roofing system of claim 1 , wherein the roof substrate comprises at least a first roof substrate and a second roof substrate claim 1 , wherein the second roof substrate is parallel to the first roof substrate claim 1 , wherein the roofing putty is disposed between the second roof substrate and the first roof substrate.3. The roofing system of claim 1 , wherein the roof substrate comprises at least a first roof substrate and a second roof substrate claim 1 , wherein the second roof substrate is co-planar with or transverse to the first roof substrate claim 1 , wherein the roofing putty is present on an interface between the second roof substrate and the first roof substrate.4. The roofing system of claim 1 , wherein the roof substrate is a plywood roof substrate claim 1 , a glass roof substrate ...

Ephemeral bonding

Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided.

ANAEROBICALLY CURABLE (METH)ACRYLATE COMPOSITIONS

Anaerobically curable (meth)acrylate compositions, methods for their preparation, and uses thereof. The anaerobically curable compositions proved effective at bonding a wide variety of substrates, and the tensile strength performance of said compositions is excellent. 1. An anaerobically curable one-part composition comprising:(a) at least one (meth)acrylate component;(b) an anaerobic cure inducing component; and(c) a toughening agent selected from (i) a combination of a styrene butadiene block copolymer and methacrylate functionalized polybutadiene; or (ii) propoxylated bisphenol A fumarate polyester, or combinations of (i) and (ii).2. An anaerobically curable composition according to wherein the methacrylate component is a (meth)acrylate monomer having the formula: HC═CGCO2R claim 1 , wherein G may be hydrogen claim 1 , halogen or alkyl groups having from 1 to about 4 carbon atoms claim 1 , and Rmay be selected from alkyl claim 1 , cycloalkyl claim 1 , alkenyl claim 1 , cycloalkenyl claim 1 , alkaryl claim 1 , aralkyl or aryl groups having from 1 to about 16 carbon atoms claim 1 , any of which may be optionally substituted or interrupted as the case may be with silane claim 1 , silicon claim 1 , oxygen claim 1 , halogen claim 1 , carbonyl claim 1 , hydroxyl claim 1 , ester claim 1 , carboxylic acid claim 1 , urea claim 1 , urethane claim 1 , polyurethane claim 1 , carbonate claim 1 , amine claim 1 , amide claim 1 , sulfur claim 1 , sulfonate claim 1 , and sulfone.3. An anaerobically curable composition according to wherein the toughening agent is a combination of a styrene butadiene block copolymer and methacrylate functionalized polybutadiene and the styrene butadiene block copolymer is present in an amount of about 5 to about 30 wt %.4. An anaerobically curable composition according to wherein the toughening agent is a combination of a styrene butadiene block copolymer and methacrylate functionalized polybutadiene and the methacrylate functionalized ...

EPHEMERAL BONDING

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer. 1. A composition comprising a curable adhesive material and a polyether release additive , wherein the release additive is free of silicon , wherein the release additive is not completely soluble in the curable adhesive material , and wherein the release additive phase separates from the adhesive material during curing of the adhesive material.2. The composition of wherein the curable adhesive material is chosen from polyarylene oligomers claim 1 , cyclic-olefin oligomers claim 1 , aryl cyclobutene oligomers claim 1 , vinyl aromatic oligomers claim 1 , and mixtures thereof.3. The composition of wherein the curable adhesive material is chosen from arylcyclobutene oligomers.4. The composition of wherein the release additive is chosen from the group consisting of polyalkylene oxide homopolymers and polyalkylene oxide copolymers.5. The composition of wherein the release additive comprises terminal groups chosen from the group consisting of hydroxy claim 1 , alkoxy claim 1 , aryloxy claim 1 , and mixtures thereof.6. The composition of wherein the release additive is chosen from polyethylene glycol claim 1 , polypropyleneglycol claim 1 , poly(1 claim 1 ,3-propanediol) claim 1 , polybutyleneglycol claim 1 , poly(tetrahydrofuran) claim 1 , ethylene glycol-propylene glycol copolymers claim 1 , and mixtures thereof.7. The composition of wherein after curing of the adhesive material claim 1 , the release additive is relatively more hydrophilic than the cured adhesive material.8. The composition of further comprising an organic solvent. This application is a divisional of application Ser. No. 14/993,123, filed on ...

COATING FILM FORMING COMPOSITION, COATING FILM, AND ADHESIVE SHEET

An object of the present invention is to provide a coating film forming composition that can form a coating film stably exhibiting an inhibiting effect on the adhesion of aquatic organisms even in the presence of physical factors, for example, water flow in the water. The present invention relates to a coating film forming composition for forming a coating film, the coating film forming composition containing a silicone resin and a silicone oil, wherein a coating film formed of the coating film forming composition satisfies the following (1) and (2). (1) A water contact angle of the coating film after the elapse of 5 minutes after dropping water on the coating film is 80° or less. (2) A water contact angle of the coating film after the elapse of 5 minutes after bringing the coating film into contact with methanol for 3 hours, followed by dropping water on the coating film is 80° or less. 1. A coating film forming composition for forming a coating film , the coating film forming composition containing a silicone resin and a silicone oil ,wherein a coating film formed of the coating film forming composition satisfies the following (1) and (2):(1) a water contact angle of the coating film after the elapse of 5 minutes after dropping water on the coating film is 80° or less; and(2) a water contact angle of the coating film after the elapse of 5 minutes after bringing the coating film into contact with methanol for 3 hours, followed by dropping water on the coating film is 80° or less.2. The coating film forming composition as claimed in claim 1 , wherein the water contact angle of the coating film after the elapse of 5 minutes after bringing the coating film into contact with methanol for 3 hours claim 1 , followed by dropping water on the coating film in (2) is 60° or less.3. The coating film forming composition as claimed in claim 1 , wherein the silicone oil contains a hydrophilic silicone oil.4. The coating film forming composition as claimed in claim 3 , wherein ...

Brittle acrylic films and forgery prevention labels comprising the same

Brittle acrylic films are made from impact-modified polyalkyl (meth)acrylate and are useful in forgery prevention labels containing the same. The films can be advantageously prepared by extrusion and, depending on the desired purpose, can be designed to be translucent or entirely non-transparent e.g. white. Ideally, the brittle acrylic films and the forgery prevention labels have no intended break points such as slits, perforation etc. 2: The forgery prevention label according to claim 1 , wherein the polyalkyl(meth)acrylate has an average molar weight Mw of from 50 000 g/mol to 300 000 g/mol and is obtainable by polymerization of a composition whose polymerizable constituents comprise claim 1 , based on the weight of the polymerisable composition:(a) from 50.0 wt.-% to 99.9 wt.-% of methyl methacrylate,{'sub': 1', '4, '(b) from 0.1 wt.-% to 50.0 wt.-% of an acrylic acid ester of a C-Calcohol, and'}(c) from 0.0 wt.-% to 10.0 wt.-% of at least one further monomer copolymerizable with the monomers (a) and (b).3: The forge prevention label according to claim 1 , wherein the polyalkyl(meth)acrylate film hasa thickness of from 15 μm to 120 μm,an elongation at break, measured according to ASTM D1004-13, of from 0.5% to 15%, andan initial tear resistance, measured according to ASTM D1004-13, of from 0.1 N to 30.0 N.4: The forgery prevention label according to claim 1 , wherein the polyalkyl(meth)acrylate film has a resistance to tear propagation claim 1 , measured according to ASTM D1938-14 claim 1 , of from 0.01 N to 1.00 N.5: The forgery prevention label according to claim 1 , wherein the content claim 1 , in wt.-% claim 1 , of the one or several impact modifiers nin the polyalkyl(meth)acrylate film is described by the following relationship:{'br': None, 'i': n', ' Подробнее

DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE

Provided is a double-sided pressure-sensitive adhesive tape that can express excellent impact resistance. The double-sided pressure-sensitive adhesive tape is a double-sided pressure-sensitive adhesive tape for use in fixing a member to be included in a mobile device, the double-sided pressure-sensitive adhesive tape including a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition, and wherein the pressure-sensitive adhesive composition contains an organic hollow filler. 1. A double-sided pressure-sensitive adhesive tape for use in fixing a member to be included in a mobile device ,the double-sided pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer,wherein the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition, andwherein the pressure-sensitive adhesive composition contains an organic hollow filler.2. The double-sided pressure-sensitive adhesive tape according to claim 1 , wherein the organic hollow filler has a specific gravity of from 0.01 to 1.2.3. The double-sided pressure-sensitive adhesive tape according to claim 1 , wherein the organic hollow filler has an average particle diameter of from 5 μm to 70 μm.4. The double-sided pressure-sensitive adhesive tape according to claim 3 , wherein the organic hollow filler is an acrylonitrile-based hollow filler.5. The double-sided pressure-sensitive adhesive tape according to claim 1 , wherein the double-sided pressure-sensitive adhesive tape has a thickness of 100 μm or more.6. The double-sided pressure-sensitive adhesive tape according to claim 1 , wherein the pressure-sensitive adhesive composition contains at least one kind selected from a monomer component (m) and a polymer component (P) obtained by polymerizing the monomer component (m) claim 1 , and the monomer component (m) contains an alkyl (meth)acrylate having an alkyl group having 4 to 18 carbon atoms at an ...

AQUEOUS ADHESIVE FOR INORGANIC MATERIALS

To provide an aqueous adhesive for an inorganic material with excellent adhesiveness to the inorganic material. An adhesive improver (J) for an aqueous adhesive of an inorganic material including a (co) polymer (A) containing an unsaturated (poly) carboxylic acid (anhydride) (al) as a constituent monomer, wherein a weight-average molecular weight of the (co) polymer (A) is 6,000 to 200,000; and an aqueous adhesive for an inorganic material (X) including the adhesive improver (J) for an aqueous adhesive of an inorganic material, a saccharide (B), a polycarboxylic acid (C) having 4 to 24 carbon atoms, and water. 1. An adhesive improver (J) for an aqueous adhesive of an inorganic material comprising a (co) polymer (A) containing an unsaturated (poly) carboxylic acid (anhydride) (a1) as a constituent monomer , wherein a weight-average molecular weight of the (co) polymer (A) is 6 ,000 to 200 ,000.2. An aqueous adhesive for an inorganic material (X) comprising the adhesive improver (J) according to claim 1 , a saccharide (B) claim 1 , a polycarboxylic acid (C) having 4 to 24 carbon atoms claim 1 , and water.3. The aqueous adhesive of claim 2 , wherein a weight ratio [(B)/(C)] of the saccharide (B) and polycarboxylic acid (C) is 25/75 to 75/25.4. The aqueous adhesive of claim 2 , wherein the weight of the (co) polymer (A) is 1 to 20 wt. % based on the total weight of the saccharide (B) and polycarboxylic acid (C).5. An adhesive article of an inorganic material bonded with a cured material of the aqueous adhesive (X) of . This application is a continuation of International Patent Application No. PCT/JP2019/016197 filed on Apr. 15, 2019, which claims priority to Japanese Patent Application No. 2018-079770 filed on Apr. 18, 2018, the entire disclosures of which are incorporated herein by reference.The present invention relates to an aqueous adhesive for an inorganic material.Conventionally, heat resistant inorganic fiber stacks are composed from inorganic fiber such as glass ...

CURABLE COMPOSITION, BONDED STRUCTURE, AND SEALING STRUCTURE

A curable composition is provided which includes a liquid first agent and microcapsules dispersed in the first agent. Each of the microcapsules includes a coating film and a second liquid agent encapsulated inside the coating film. A strength of each of the microcapsules is 15 N or less. The curable composition is configured to be cured by contact between the first agent and the second agent. 1. A curable composition comprising:a liquid first agent; andmicrocapsules dispersed in the first agent, whereineach of the microcapsules includes a coating film and a second liquid agent encapsulated inside the coating film,{'b': '3', 'a strength of each of the microcapsules is 15 N or less, and'}the curable composition is configured to be cured by contact between the first agent and the second agent.2. The curable composition according to claim 1 , whereinan average diameter of the microcapsules is 0.1 mm or more and 1.0 mm or less.3. The curable composition according to claim 1 , whereina mass of the coating film is equal to or less than 30 mass % of a mass of the microcapsule.4. The curable composition according to claim 1 , whereinthe coating film includes a first layer contacting the second agent and a second layer laminated on the first layer.5. The curable composition according to claim 1 , whereina viscosity of the second agent is 200 Pa·s or less.6. A bonded structure comprising:a first adherend;a second adherend; andan adhesive that intervenes between the first adherend and the second adherend and bonds the first adherend and the second adherend together, wherein{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the adhesive includes a cured product of the curable composition according to .'}7. A sealing structure comprising:an object to be sealed;a case that houses the object to be sealed; anda casting material with which the case is filled, wherein{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the casting material includes a cured product of the curable ...

ADDITIVE COMPOSITION FOR CAUSTIC REMOVABLE HOT MELT ADHESIVES AND FORMULATIONS CONTAINING THE SAME

An additive composition for imparting caustic removability to a hot melt adhesive includes an ester functionalized polymer having a polymeric backbone and, pendent thereon, one or more dicarboxylic acid moieties in at least partial ester form. The polymeric backbone has a weight average molecular weight less than 50,000. The ester functionalized polymer may be, for example, an at least partial ester of a maleated hydrocarbon. The additive may further include a low molecular weight α,β ethylenically unsaturated anhydride-containing or acid-containing polymer. A caustic removable hot melt adhesive composition comprises a hot melt adhesive additive and a conventional hot melt adhesive resin. A caustic removable adhesive label comprises a substrate and a caustic removable hot melt adhesive composition which includes an additive composition. The caustic removable hot melt adhesives can be used on labels for articles, such as glass bottles. 1. An additive composition for imparting caustic removability to a hot melt adhesive , said additive composition comprising:an ester functionalized polymer comprising a polymeric backbone and, pendent thereon, one or more dicarboxylic acid moieties in at least partial ester form; andan at least partial ester of a low molecular weight α,β ethylenically unsaturated anhydride-containing or acid-containing polymer selected from the group consisting of a partial ester of a low molecular weight maleic anhydride homopolymer, a partial ester of a low molecular weight maleic anhydride olefin copolymer, and partial ester of a low molecular weight maleic anhydride vinyl aromatic copolymer.2. The additive composition of claim 1 , wherein a portion of the polymeric backbone is aliphatic.3. The additive composition of claim 1 , wherein the polymeric backbone has a weight average molecular weight less than 50 claim 1 ,000.4. The additive composition of claim 1 , wherein the polymeric backbone is a homopolymer of a C3 to C16 monomer or a copolymer of ...

Adhesive Properties

Various adhesive compositions are described which may optionally comprise one or more active agents such as pharmaceutical agents. The incorporation of one or more absorbents in combination with one or more crystallization inhibitors improves adhesive characteristics of the compositions. Also described are related methods of improving adhesive characteristics of adhesive compositions with the use of a combination of absorbent and inhibitor. Also described are related methods of using the compositions and articles incorporating such compositions.

PRIMER FOR SOLAR CELL MODULE AND SOLAR CELL MODULE

Provided is a primer for a solar cell module which makes it possible to prevent peeling of a surface protective material from a sealing material over a long time, and a solar cell module manufactured using this primer. The primer includes 40 to 95 parts by mass of a polymerizable ester, 5 to 60 parts by mass of an adhesion promoter, and a polymerization initiator. The polymerizable ester includes at least one of an acryloyl group and a methacryloyl group. The adhesion promoter includes a functional group improvable is adhesion to an acrylic resin or a methacrylic resin, and an alkoxysilyl group. The polymerization initiator is configured to be able to initiate polymerization of the polymerizable ester. The content of the polymerization initiator is 0.1 to 10 parts by mass based on 100 parts by mass as a total of the polymerizable ester and the adhesion promoter. 1. A primer for a solar cell module , comprising:40 to 95 parts by mass of a polymerizable ester including at least one of an acryloyl group and a methacryloyl group;5 to 60 parts by mass of an adhesion promoter including a functional group that is improvable in adhesion to an acrylic resin or a methacrylic resin, and an alkoxysilyl group; anda polymerization initiator for initiating polymerization of the polymerizable ester, the content of which being 0.1 to 10 parts by mass based on 100 parts by mass as a total of the polymerizable ester and the adhesion promoter.2. The primer for a solar cell module according to claim 1 , wherein the adhesion promoter includes at least one of an acryloyl group and a methacryloyl group as the functional group.3. A solar cell module comprising:a solar cell provided with a light receiving face;a sealing material that is composed of a transparent resin including a silage coupling agent and covers the periphery of the solar cell;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'as adhesive material that is composed of a cured product of the primer according to , and is ...

COMPOSITION FOR FORMING ADHESIVE LAYER OF DICING FILM, AND DICING FILM

There are provided a composition for forming an adhesive layer of a dicing film including: a silicon compound oil including at least one reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the silicon compound oil including at least one reactive functional group to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film. 1. A composition for forming an adhesive layer of a dicing film , comprising:a silicon compound oil comprising at least one reactive functional group; an adhesive binder; and a photoinitiator,wherein a weight ratio of the silicon compound oil comprising at least one reactive functional group to the adhesive binder is 0.01% to 4.5%.2. The composition for forming an adhesive layer of a dicing film according to claim 1 ,wherein the reactive functional group includes at least one functional group selected from the group consisting of a hydroxyl group, a carbinol group, an epoxy group, an amino group, a thiol group, and a carboxyl group.4. The composition for forming an adhesive layer of a dicing film according to claim 3 ,wherein the organic solvent is selected from alcohols, ethers, acetates, or ketones.5. The composition for forming an adhesive layer of a dicing film according to claim 1 ,{'sup': 2', '2, 'wherein the silicon compound oil comprising at least one reactive functional group has a viscosity of 10 mm/s to 20,000 mm/s at 25° C.'}6. The composition for forming an adhesive layer of a dicing film according to claim 1 ,wherein the adhesive binder includes a (meth)acrylate polymer or a (meth)acrylate copolymer unsubstituted or substituted with at least one functional group selected from the group consisting of a hydroxyl group, an isocyanate group, a vinyl group, and a (meth)acrylate group.7. The composition for forming an ...

COMPOSITION FOR FORMING ADHESIVE LAYER OF DICING FILM, AND DICING FILM

There are provided a composition for forming an adhesive layer of a dicing film, including: a polymer additive including at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group; an adhesive binder; and a photoinitiator, wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%, a dicing film including an adhesive layer including the composition, a dicing die bonding film including the dicing film, and a method for dicing a semiconductor wafer using the dicing die bonding film. 1. A composition for forming an adhesive layer of a dicing film , comprising:a polymer additive comprising at least one polymer selected from the group consisting of a polymer containing a (meth)acrylate-based functional group and a non-polar functional group, a (meth)acrylate-based polymer containing at least one fluorine, and a silicon-modified (meth)acrylate-based polymer containing a reactive functional group;an adhesive binder; anda photoinitiator,wherein a weight ratio of the polymer additive to the adhesive binder is 0.01% to 4.5%.3. The composition for forming an adhesive layer of a dicing film according to claim 1 ,wherein the (meth)acrylate-based polymer containing at least one fluorine includes a (meth)acrylate-based polymer substituted with a perfluoroalkyl group having a carbon number of 1 to 10 or a fluorinated alkenyl group having a carbon number of 1 to 10.4. The composition for forming an adhesive layer of a dicing film according to claim 1 ,wherein the silicon-modified (meth)acrylate-based polymer containing a reactive functional group includes silicon-modified (meth)acrylate-based polymer substituted with at least one reactive functional group selected from the group consisting of a hydroxyl group ...

Hot-melt adhesive agent

The present invention provides a hot-melt adhesive agent which is capable of applying at low temperature, and has an excellent adhesiveness to a polyolefin substrate, and a disposable product obtained by employing the hot-melt adhesive agent. A hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s; and (A2) a styrene block copolymer having a styrene content of less than 30% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of more than 250 mPa·s.

RESIN COMPOSITION, TONER FOR ELECTROPHOTOGRAPHY AND HOT MELT COMPOSITION

Provided is a resin composition which contains (A) a polyethylene wax satisfying the requirements (i)-(iv) described below and (B) at least one resin selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the mass ratio of (A) to (B) is from 0.1/99.9 to 50/50. This resin composition is useful for providing a toner which can be fixed by means of a relatively-low-temperature heating body and has good offset resistance, and which is suppressed in increase of particle diameters even if the toner is stored for a long period of time. (i) The weight average molecular weight (Mw) is within the range from 400 to 1,500. (ii) The molecular weight distribution (Mw/Mn) is within the range from 1.2 to 2.5. (iii) The penetration as measured at 25° C. is 5 dmm or less. (iv) The melting point (Tm) is within the range from 50° C. to 110° C. 1. A resin composition comprising:a polyethylene wax (A) which satisfies requirements (i) to (iv) below:(i) a weight average molecular weight (Mw) of 400 to 1,500 as measured by GPC,(ii) a molecular weight distribution (Mw/Mn) of 1.2 to 2.5 as measured by GPC,(iii) a penetration index of 5 dmm or less as measured in accordance with JIS K 2207 at 25° C., and(iv) a melting point (Tm) of 50 to 110° C. as measured by differential scanning calorimetry (DSC); andat least one resin (B) selected from the group consisting of a thermoplastic resin and a thermosetting resin,wherein a mass ratio of (A) to (B) ((A)/(B)) is 0.1/99.9 to 50/50.2. The resin composition according to claim 1 , wherein the polyethylene wax (A) further satisfies requirement (v) below:{'sub': −50', 'all, '(v) a fraction of a heat of fusion (ΔH) derived from a peak at 50° C. or lower, relative to total heat of fusion (ΔH) derived from all peaks, being 1.0% to 5.0% as measured by differential scanning calorimetry (DSC).'}3. The resin composition according to claim 1 , wherein the polyethylene wax (A) further satisfies requirement (vi) below:(vi) a ...

ANTISTATIC ADHESIVE COMPOSITION AND POLARIZING PLATE MANUFACTURED USING SAME

An antistatic adhesive composition includes a polyalkyleneglycol compound having one or more carboxyl group or thiol group in a molecule, an acryl copolymer, a cross-linking agent, and an antistatic agent. The antistatic composition exhibits excellent antistatic property, as well as significantly improving adhesiveness, thus to exhibit superior durability even at a high temperature. A polarizing plate fabricated using the antistatic composition is also provided. 1. An adhesive composition , comprising:a polyalkyleneglycol compound having at one of a carboxyl group or a thiol group in a molecule;an acryl copolymer;a cross-linking agent; andan antistatic agent.4. The adhesive composition according to claim 2 , wherein the polyalkyleneglycol compound is polyethyleneglycol bis(carboxymethyl) ether having a weight average molecular weight ranging from 100 to 1 claim 2 ,000.5. The adhesive composition according to claim 2 , wherein the polyalkyleneglycol compound is any one selected from the group consisting of polyethyleneglycol methyletherthiol having a weight average molecular weight ranging from 500 to 1 claim 2 ,200 claim 2 , polyethyleneglycol dithiol having a weight average molecular weight ranging from 500 to 1 claim 2 ,500 claim 2 , and a mixture thereof.6. The adhesive composition according to claim 1 , wherein the polyalkyleneglycol compound is included in an amount of 0.1 to 10 parts by weight relative to 100 parts by weight of the acryl copolymer based on solid content.7. The adhesive composition according to claim 1 , wherein the antistatic agent is at least one of bis(fluorosulfonyl)imide potassium (KN(FSO)) or bis(fluorosulfonyl)imide sodium (NaN(FSO)).8. An adhesive sheet comprising an adhesive layer formed of the adhesive composition according to .9. A polarizing plate comprising an adhesive layer formed of the adhesive composition according to on at least one surface thereof.10. The polarizing plate according to claim 9 , further comprising a polarizer ...

2-CYANOACRYLATE ADHESIVE COMPOSITION

Provided is an adhesive composition which exhibits excellent water resistance and warm-water resistance without impairing instantaneous adhesiveness. The 2-cyanoacrylate adhesive composition contains a 2-cyanoacrylic acid ester, and a specific phthalic anhydride derivative, in which the content of the phthalic anhydride derivative is from 0.01 to 5% by mass, relative to the total amount of the adhesive composition. Preferably, the adhesive composition further contains an elastomer. 2. The 2-cyanoacrylate adhesive composition according to claim 1 , which further comprises (c) an elastomer claim 1 , wherein a content of the elastomer is from 1 to 30% by mass relative to the total amount of the adhesive composition.3. The 2-cyanoacrylate adhesive composition according to claim 2 , wherein the elastomer (c) is a copolymer made from a monomer capable of forming a polymer poorly soluble to 2-cyanoacrylic acid ester and a monomer capable of forming a polymer soluble to 2-cyanoacrylic acid ester.4. The 2-cyanoacrylate adhesive composition according to claim 2 , wherein the elastomer (c) is a copolymer made from a monomer capable of forming a polymer poorly soluble to 2-cyanoacrylic acid ester claim 2 , a monomer capable of forming a polymer soluble to 2-cyanoacrylic acid ester claim 2 , and a monomer containing a carboxyl group.5. The 2-cyanoacrylate adhesive composition according to claim 3 , the monomer capable of forming a polymer poorly soluble to 2-cyanoacrylic acid ester is at least one selected from the group consisting of ethylene claim 3 , propylene claim 3 , isoprene and butadiene claim 3 , and the monomer capable of forming a polymer soluble to 2-cyanoacrylic acid ester is at least one selected from the group consisting of acrylic acid esters and methacrylic acid esters.6. The 2-cyanoacrylate adhesive composition according to claim 4 , wherein the monomer capable of forming a polymer poorly soluble to 2-cyanoacrylic acid ester is at least one selected from the ...

ELASTIC ATTACHMENT HOT MELT ADHESIVE COMPOSITION AND A DISPOSABLE ABSORBENT ARTICLE MADE WITH THE SAME

The invention features a hot melt adhesive composition based on olefin polymers that can be used for elastic attachment in the manufacture of a disposable article. The hot melt adhesive includes from about 3 to about 10% by weight of a first propylene-based copolymer having a melt index measured by ASTM D1238 (190° C., 2.16 kg) of no greater than about 5, a second propylene-based polymer with a viscosity at 190° C. of no greater than about 5000 cps, a first tackifying agent having a softening point of at least about 90° C. and from about 5% by weight to about 20% by weight of a plasticizer. 1. A hot melt adhesive composition comprising:a. from about 3 to about 10% by weight of a first propylene-based copolymer having a melt index measured by ASTM D1238 (190° C., 2.16 kg) of no greater than about 5,b. a second propylene-based polymer with a viscosity at 190° C. of no greater than about 5000 cps,c. a first tackifying agent having a softening point of at least about 90° C. andd. from about 5% by weight to about 20% by weight of a plasticizer.2. The hot melt adhesive composition of wherein the first tackifying agent is present at from about 20% to about 70% by weight.3. The hot melt adhesive composition of wherein the first tackifying agent has a softening point of at least about 110° C.4. The hot melt adhesive composition of wherein the first propylene-based copolymer has an ethylene content of no less than about 10.5. The hot melt adhesive composition of wherein the first propylene-based copolymer is present at from about 3% by weight to about 7% by weight.6. The hot melt adhesive composition of wherein the second propylene-based polymer has a viscosity at 190° C. of no greater than about 3 claim 1 ,000 cps.7. The hot melt adhesive composition of wherein the second propylene-based polymer has a viscosity at 190° C. of no greater than about 2 claim 1 ,000 cps.8. The hot melt adhesive composition of wherein the second propylene-based polymer is present at from about 7% ...

NEW HOT MELT ADHESIVE FOR CONSTRUCTION OF DISPOSABLE NONWOVEN HYGIENE PRODUCT

Hot melt adhesive composition comprising: —from 30% to 55% of a composition (A) consisting of 2 copolymers of propylene and ethylene (A1) and (A2), with Mw of less than 100,000 Da, wherein: —(A1) is an essentially amorphous copolymer, with a DSC melt enthalpy of 10 less than 30 J/g; —(A2) is a semicrystalline copolymer with a DSC melt enthalpy of more than 30 J/g; and —the ratio:weight of (A2)/weight of (A1) is from 0.2 to 1.5; —from 20% to 50% of a tackifying resin (B); and 1—from 2% to 25% of a plasticizer (C) consisting of a liquid polybutene oligomer. 2) Process of manufacturing an assembly product, preferably a disposable nonwoven absorbent article, implementing said hot melt adhesive composition. 115-. (canceled)16. Hot melt adhesive composition comprising: (A1) is an essentially amorphous copolymer, with a DSC melt enthalpy of less than 30 J/g;', '(A2) is a semicrystalline copolymer with a DSC melt enthalpy of more than 30 J/g; wherein a ratio of weight of (A2)/weight of (A1) is from 0.2 to 1.5;, 'from 30% to 55% of a composition (A) comprising 2 thermoplastic unimodal copolymers of propylene and ethylene (A1) and (A2), each having a weight average molecular weight (Mw) of less than 100,000 Da, whereinfrom 20% to 50% of a tackifying resin (B); andfrom 2% to 25% of a plasticizer (C) comprising a liquid polybutene oligomer.17. Hot melt adhesive composition according to claim 16 , wherein (A1) and (A2) are random copolymers of propylene and ethylene having from about 70% by weight to about 99% by weight of propylene.18. Hot melt adhesive composition according to claim 16 , wherein each of (A1) and (A2) include an isotactic polypropylene chain sequence.19. Hot melt adhesive composition according to claim 16 , wherein the weight average molecular weight of (A1) is from about 5 claim 16 ,000 to 60 claim 16 ,000 Da and the weight average molecular weight of (A2) is from about 10 claim 16 ,000 g/mole to about 100 claim 16 ,000 Da.20. Hot melt adhesive composition ...

Pressure-Sensitive Adhesive, and Self-Adhesive Products and Composites Comprising the Latter

The invention relates to a block copolymer-containing pressure-sensitive adhesive comprising e) 52% by weight to 65% by weight, preferably 55% by weight to 62% by weight, of an elastomer component, f) 30% by weight to 45% by weight, preferably 35% by weight to 42% by weight, of at least one bonding resin, g) 0% by weight to 15% by weight, preferably to 10% by weight, of at least one softening resin and h) 0% by weight to 18% by weight, preferably to 10% by weight, of further additives, where the elastomer component (a) consists to an extent of at least 90% by weight of polyvinylaromatic-polybutadiene block copolymers, where the polyvinylaromatic-polybutadiene block copolymers include at least one type of diblock copolymer (a1) and at least one type of tri- or multiblock copolymer (a2), the at least one diblock copolymer (a1) has a vinylaromatic content of 15% by weight to 45% by weight, within the elastomer component (a) the proportion of tri- or multiblock copolymer (a2) is between 25% by weight and 50% by weight, preferably between 30% by weight and 45% by weight, the tri- or multiblock copolymer (a2) has a molar mass of at least 125 000 g/mol and a vinylaromatic content of 15% to 45% by weight, and one kind of the tri- or multiblock copolymer is preferably a multi-arm (radial) block copolymer. 1. A block copolymer-containing pressure-sensitive adhesive comprising:a) 52 wt % to 65 wt %, of an elastomer component,b) 30 wt % to 45 wt %, of at least one tackifier resin,c) 0 wt % to 15 wt %, of at least one plasticizing resin, and wherein the elastomer component (a) is at least 90 wt % of polyvinylaromatic-polybutadiene block copolymers, the polyvinylaromatic-polybutadiene block copolymers comprising at least one kind of a diblock copolymer (a1) and at least one kind of a triblock or multiblock copolymer (a2),', 'the at least one diblock copolymer (a1) has a vinylaromatic fraction of 15 wt % to 45 wt %, within the elastomer component (a) the fraction of triblock or ...

Conductive adhesive tape using compressible conductive powder and manufacturing method thereof

Provided are a conductive adhesive tape including a compressible conductive powder, which is manufactured by applying a conductive adhesive prepared by mixing a conductive powder having a conductive metal-coated outer surface and an adhesive resin at a certain ratio on one surface or both surfaces of a conductive substrate and is easily and evenly attached to an attachment surface by preventing a protrusion phenomenon through deformable characteristics with respect to pressing, and a manufacturing method thereof.

CURABLE COMPOSITION AND ADHESIVE

A curable composition includes 100 parts by mass of a flexible epoxy resin (A), 1 to 150 parts by mass of polymer fine particles (B), and 1 to 200 parts by mass of an epoxy curing agent (C). The flexible epoxy resin (A) has an epoxy equivalent of 350 to 4000 g/eq. The polymer fine particles (B) have a core-shell structure and comprise a core layer and a shell layer. The core layer has a glass transition temperature (Tg) of more than 0° C. as calculated by the formula: 1/Tg=Σ(M/Tg), where Mrepresents a mass fraction of a monomer unit i and Tgrepresents a glass transition temperature (K) of a homopolymer composed of the monomer unit i. A cured product obtained by curing the curable composition has a type A durometer hardness of 5 to 95 at 23 CC as measured by the method of JIS K6253-3. 1. A curable composition comprising:100 parts by mass of a flexible epoxy resin (A);1 to 150 parts by mass of polymer fine particles (B); and1 to 200 parts by mass of an epoxy curing agent (C),wherein the flexible epoxy resin (A) has an epoxy equivalent of 350 to 4000 g/eq,wherein the polymer fine particles (B) have a core-shell structure and comprise a core layer and a shell layer, {'br': None, 'i': Tg', 'M', '/Tg, 'sub': i', 'i, '1/=Σ()'}, 'wherein the core layer has a glass transition temperature (Tg) of more than 0° C. as calculated by the following numerical formula{'sub': i', 'i, 'wherein Mrepresents a mass fraction of a monomer unit i selected from a butadiene unit and a non-crosslinking monomer unit constituting the core layer, and Tgrepresents a glass transition temperature (K) of a homopolymer composed of the monomer unit i, and'}wherein a cured product obtained by curing the curable composition has a type A durometer hardness of 5 to 95 at 23° C. as measured by the method of JIS K6253-3.2. The composition according to claim 1 , wherein the glass transition temperature of the core layer is of 15 to 150° C.3. The composition according to claim 1 , wherein the core layer ...

Starch-Based Hot Melt Adhesive

An exemplary embodiment of the present invention provides starch-based hot melt adhesive comprised of a composition including starch, a thermoplastic polymer, a tackifier, a plasticizer, and an adhesion promoter. The hot melt adhesive according to the exemplary embodiment of the present invention contains about 25 to 55 weight % of the starch which is infinitely renewable biomass, and, thus, it is less harmful and more eco-friendly and has a reduced manufacturing costs and is less sensitive to exhaustion of petroleum-based resources, as compared with the conventional hot melt adhesive mainly containing a petroleum-based material. Further, the hot melt adhesive according to the exemplary embodiment of the present invention imparts excellent adhesion strength and workability at the time of adhesion between different kinds of adherends such as a hydrophobic adherend and a hydrophilic adherend and can be applied to various fields such as packaging, bookbinding, construction, woodworking, and textile fields.

HYDROXYL FUNCTIONALIZED POLYBUTADIENE POLYURETHANE HOTMELT PREPOLYMER

A hydroxyl-functionalized polybutadiene polyurethane hotmelt prepolymer that comprises the chemical reaction product of at least one polybutadiene diol, at least one chain extender having a hydroxyl functionality of two and a molecular weight of less than or equal to 300 g/mol and optionally at least one polybutadiene polyol that has a number-average mean functionality between greater than 2.0 and less than or equal to 3.0 with at least one aliphatic or alicyclic diisocyanate, is thermally vulcanizable, and at room temperature is sufficiently solid or high-viscosity that it can be rolled into a roll as a film applied to a carrier without flowing out or being squeezed out on the side. 1. A hydroxyl-functionalized polybutadiene polyurethane hotmelt prepolymer , comprising the chemical reaction product of at least one polybutadiene diol , at least one chain extender having a hydroxyl functionality of two and a molecular weight of less than or equal to 300 g/moland optionally at least one polybutadiene polyol with a number-average mean functionality between greater than 2.0 and less than or equal to 3,0 with at least one aliphatic or alicyclic diisocyanate.2. The hydroxyl-functionalized polybutadiene polyurethane hotmelt prepolymer according to claim 1 , wherein the at least one polybutadiene diol has a number-average mean molecular weight between greater than 1 claim 1 ,000 g/mol and less than 5 claim 1 ,000 g/mol.3. The hydroxyl-functionalized polybutadiene polyurethane hotmelt prepolymer of claim 1 , includes the at least one polybutadiene polyol which has a number-average mean functionality between greater than 2.0 and less than or equal to 3.0 and has a number-average mean molecular weight between greater than 1 claim 1 ,000 g/mol and less than 5 claim 1 ,000 g/mol.4. The hydroxyl-functionalized polybutadiene polyurethane hotmelt prepolymer according to claim 1 , wherein the numerical proportion of the hydroxyl groups introduced for forming the hydroxyl- ...

ADHESIVE COMPOSITION COMPRISING EUTECTIC METAL ALLOY NANOPARTICLES

Provided herein is conductive adhesive composition comprising at least one epoxy resin, at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals, at least one melamine resin, a plurality of eutectic metal alloy nanoparticles, and at least one solvent. Also provided herein is an electronic device comprising a substrate, conductive features disposed on the substrate, a conductive electrical component disposed over the conductive features, and a conductive adhesive composition disposed between the conductive features and the conductive electrical component. Further disclosed herein are methods of making a conductive adhesive composition. 1. A conductive adhesive composition comprising:at least one epoxy resin;at least one polymer chosen from polyvinyl phenols and polyvinyl butyrals;at least one melamine resin;a plurality of eutectic metal alloy nanoparticles; andat least one solvent.2. The conductive adhesive composition of claim 1 , wherein the plurality of eutectic metal alloy nanoparticles comprise Field's metal.3. The conductive adhesive composition of claim 1 , wherein the plurality of eutectic metal alloy nanoparticles further comprise at least one organoamine stabilizer selected from the group consisting of butylamine claim 1 , octylamine claim 1 , 3-methoxypropylamine claim 1 , pentaethylenehexamine claim 1 , 2 claim 1 ,2-(ethylenedioxy)diethylamine claim 1 , tetraethylenepentamine claim 1 , triethylenetetramine claim 1 , and diethylenetriamine.4. The conductive adhesive composition of claim 1 , having a solids content ranging from about 20% to about 80% claim 1 , based on a total weight of the conductive adhesive composition.5. The conductive adhesive composition of claim 1 , wherein at least one solvent is selected from the group consisting of propylene glycol methyl ether acetate claim 1 , di(propylene glycol) methyl ether acetate claim 1 , (propylene glycol)methyl ether claim 1 , di(propylene glycol)methyl ether claim 1 , methyl isobutyl ...

ADHESIVE FILM THAT CAN BE WOUND AND STAMPED

The invention relates to an adhesive film that can be wound and stamped, having an epoxy-based adhesive compound that can be activated by UV radiation, characterized in that the adhesive compound comprises: a) 2-40 wt % of film former, b) 10-70 wt % of aromatic epoxy resins, c) cycloaliphatic epoxy resins, the cycloaliphatic epoxy resins not exceeding 35 wt %, d) 0.5-7 wt % of cationic initiators, e) 0-50 wt % of epoxy-enhanced polyether compounds, and f) 0-20 wt % of polyol, the proportions adding up to 100%, and the adhesive compound having an open time of 10 seconds to 60 minutes after the UV activation, during which open time the film has a pressure-sensitive adhesive characteristic. 2. The adhesive film of claim 1 , wherein the adhesive film has a time until handling strength that does not exceed triple the open time.3. The adhesive film of claim 1 , wherein a share of an epoxy equivalent of the epoxy-enhanced polyether compounds in the epoxy equivalent of all the epoxy resins is between 0 and 40%.4. The adhesive film of claim 1 , wherein a share of an epoxy equivalent of the cyclo-aliphatic epoxy resins in the epoxy equivalent of all epoxy resins is between 0 and 33%.5. The adhesive film of claim 1 , wherein a share of an epoxy equivalent of the aromatic epoxy resins in the epoxy equivalent of all epoxy resins is above 60%.6. The adhesive film of claim 1 , wherein a film former comprises polymers of ethylene vinyl acetate (EVA) claim 1 , polyamide (PA) claim 1 , polyurethane (PU) claim 1 , acrylate or a phenoxy resin.7. The adhesive film of claim 1 , wherein the cationic initiator includes a cross-link initiating cationic initiators selected from arvlsulfonium salts claim 1 , iodonium salts claim 1 , thioxanthenium salts claim 1 , and triarylsulfonium salts.8. The adhesive film of claim 1 , wherein the cationic initiator is activated by UV light.9. The adhesive film of claim 1 , wherein the film is adapted for structural bonding of metals claim 1 , glass claim ...

Systems and Methods for Unifying Assemblies that Share Common Taggant Identifier Data

The present invention describes systems and methods for embedding authentication data into a quality control tamper evidence adhesive sealant material used to mark a system of parts and assemblies, creating a unified and traceable layer of security data to identify unauthorized modifications to manufactured systems.

DISPLAY DEVICE

A display device is disclosed. The display device includes a display panel configured to display an image, an optical member under the display panel, and a support member under the optical member. The display device further includes a first adhesive member between the display panel and the optical member, and a second adhesive member between the optical member and the support member. The first adhesive member has higher transmittance than the second adhesive member. 1. A display device , comprising:a display panel configured to display an image;an optical member under the display panel;a support member under the optical member;a first adhesive member between the display panel and the optical member; anda second adhesive member between the optical member and the support member,wherein the first adhesive member has higher transmittance than the second adhesive member.2. The display device of claim 1 , wherein the second adhesive member is configured to scatter light.3. The display device of claim 2 , wherein the second adhesive member includes scattering bodies.4. The display device of claim 3 , wherein the second adhesive member further includes a same material as the first adhesive member.5. The display device of claim 3 , wherein the scattering bodies include at least one of ZnO claim 3 , TiO claim 3 , and polystyrene beads.6. The display device of claim 1 , wherein a width of the second adhesive member is larger than a width of the first adhesive member.7. The display device of claim 1 , wherein the display panel is a liquid crystal display panel claim 1 , and the optical member is a glass diffusion plate.8. The display device of claim 7 , wherein the glass diffusion plate includes:a glass substrate;a first sheet at a first surface of the glass substrate, the first sheet including anisotropic refractive index layers and isotropic refractive index layers alternately laminated; anda second sheet at a second surface of the glass substrate opposite the first surface, ...

ADHESION METHOD EMPLOYING POLYMER MICROPARTICLE-CONTAINING CURABLE RESIN COMPOSITION HAVING EXCELLENT WORKABILITY, AND LAMINATE OBTAINED USING SAID ADHESION METHOD

One or more embodiments of the present invention provide an adhesion method that provides excellent workability by using a curable resin composition whose viscosity has low temperature dependence. The method of adhesion includes a step of applying a curable resin composition, a step of spreading the curable resin composition, and a step of curing the curable resin composition. The curable resin composition contains specific amounts of an epoxy resin, fine polymer particles whose shell layers have a cyano group in a specific amount, and blocked urethane. 1. A method of adhesion comprising:(i) heating a curable resin composition to a first temperature and applying the curable resin composition to a first adherend so as to have a first thickness;(ii) spreading, to a second thickness, the curable resin composition that has been applied, wherein the spreading is performed in an environment at a second temperature, and wherein the spreading is performed prior to or simultaneously with affixing a second adherend to the first adherend; and(iii) curing the curable resin composition sandwiched between the first adherend and the second adherend that have been affixed to each other,wherein the first temperature is higher than the second temperature, and the second thickness is less than the first thickness,wherein the curable resin composition comprises:an epoxy resin (A);fine polymer particles (B) that have a core-shell structure including a core layer and a shell layer, the shell layer having a cyano group; andblocked urethane (C),wherein the fine polymer particles (B) are comprised in an amount of 1 part by mass to 100 parts by mass with respect to 100 parts by mass of the epoxy resin (A), the blocked urethane (C) is comprised in an amount of 1 part by mass to 100 parts by mass with respect to 100 parts by mass of the epoxy resin (A),wherein a ratio (W1/W2) of a mass (W1) of the fine polymer particles (B) to a mass (W2) of the blocked urethane (C) is 0.1 to 10.0, andwherein ...

COMPOSITIONS AND ADHESIVE ARTICLES INCLUDING POROUS POLYMERIC PARTICLES AND METHODS OF COATING SUBSTRATES

Compositions are provided that include a coating and porous polymeric particles disposed in the coating. Adhesive articles are also provided including a substrate and a composition disposed on a first major surface of the substrate. The composition includes an adhesive and porous polymeric particles disposed in the adhesive. Further, a method of coating a substrate is provided including providing a composition, providing a substrate having a surface, and applying the composition on the surface of the substrate. The compositions and adhesive articles can be applied to wet substrates or dry substrates. 1. A composition comprising 1) a coating; and 2) porous polymeric particles disposed in the coating , wherein the porous polymeric particles comprise a polymerized product of a reaction mixture comprising: {'br': None, 'sub': 2', 'n, 'HO(—CH—CH(OH)—CH2-O)—H\u2003\u2003 (I)'}, 'i) a compound of Formula (I)'}, 'a) a first phase comprising'} 'ii) a nonionic surfactant;', 'wherein n is an integer equal to at least 1; and'} {'br': None, 'sub': 2', '2', '2', 'p', '2, 'sup': 1', '1, 'CH═C(R)—(CO)—O[—CH—CH—O]—(CO)—C(R)═CH\u2003\u2003 (II)'}, 'i) a monomer composition comprising a monomer of Formula (II)'}, 'b) a second phase dispersed in the first phase, wherein a volume of the first phase is greater than a volume of the second phase and wherein the second phase comprises'}whereinp is an integer equal to at least 1;{'sup': '1', 'claim-text': 'ii) a poly(propylene glycol) having a weight average molecular weight of at least 500 grams/mole, wherein the poly(propylene glycol) is removed from the polymerized product to provide the porous polymeric particles.', 'Ris a hydrogen or alkyl; and'}2. The composition of claim 1 , wherein the coating comprises an adhesive.3. The composition of claim 1 , wherein the porous polymeric particles are free of a coating applied to an exterior surface of the porous polymeric particles claim 1 , are free of an active loaded into the porous polymeric ...

ADHESIVE RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESIVE FILM FOR SEMICONDUCTOR, AND DICING DIE BONDING FILM

The present invention relates to an adhesive resin composition for a semiconductor, including: a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less; a curing agent including a phenol resin having a softening point of 100° C. or higher; and an epoxy resin, wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight, an adhesive film for a semiconductor including the above adhesive resin composition for a semiconductor, a dicing die bonding film including an adhesive layer including the adhesive film for a semiconductor, and a method for dicing a semiconductor wafer using the dicing die bonding film. 1. An adhesive resin composition for a semiconductor , comprising: a curing agent including a phenol resin having a softening point of 100° C. or higher; and', 'an epoxy resin,', 'wherein the content of a (meth)acrylate-based functional group containing an aromatic functional group in the (meth)acrylate-based resin is 2 to 40% by weight., 'a (meth)acrylate-based resin including a (meth)acrylate-based repeating unit containing an epoxy-based functional group and a (meth)acrylate-based repeating unit containing an aromatic functional group, the (meth)acrylate-based resin having a hydroxyl equivalent weight of 0.15 eq/kg or less;'}2. The adhesive resin composition for a semiconductor of claim 1 , whereina weight ratio of the (meth)acrylate-based resin relative to the total weight of the (meth)acrylate-based resin, the epoxy resin, and the phenol resin is 0.55 to 0.95.3. The adhesive resin composition for a semiconductor of claim 1 , wherein the (meth)acrylate-based resin contains 3 to 30% by weight of the (meth)acrylate-based functional group ...

TAPE OR SHEET FOR SKIN ATTACHMENT

A tape or sheet for sticking to skin, which includes a base material and an adhesive layer laminated on at least one surface of the base layer, wherein the adhesive layer contains an acrylic copolymer obtained by copolymerizing a monomer mixture including a (meth)acrylic acid alkyl ester monomer and an alkoxy group-containing ethylenically unsaturated monomer, a component that is liquid or paste-like at room temperature, and a tackifier, and wherein the tackifier includes a rosin ester.

OPTICALLY CLEAR ADHESIVE SHEET, METHOD FOR PRODUCING OPTICALLY CLEAR ADHESIVE SHEET, LAMINATE, AND DISPLAY DEVICE HAVING TOUCH PANEL ATTACHED THERETO

The present invention provides an optically clear adhesive sheet with excellent transparency using a thermosetting polyurethane composition that has excellent flexibility and is capable of giving a thick film. The optically clear adhesive sheet of the present invention contains: a cured product of a thermosetting polyurethane composition, the thermosetting polyurethane composition containing a polyol component, a polyisocyanate component, and a tackifier, the thermosetting polyurethane composition having a tackifier content of 5 to 21 wt %. 1. An optically clear adhesive sheet comprising a cured product of a thermosetting polyurethane composition ,the thermosetting polyurethane composition containing a polyol component, a polyisocyanate component, and a tackifier,the thermosetting polyurethane composition having a tackifier content of 5 to 21 wt %.2. The optically clear adhesive sheet according to claim 1 ,wherein the optically clear adhesive sheet has a haze of 5% or lower which is a value calculated with the thickness of the sheet set to 1000 μm.3. The optically clear adhesive sheet according to claim 1 ,wherein the polyol component includes a hydrophobic polyol.4. The optically clear adhesive sheet according to claim 1 ,wherein the polyisocyanate component includes a hydrophilic polyisocyanate.5. The optically clear adhesive sheet according to claim 1 ,wherein the tackifier includes a hydrogenated petroleum resin.6. The optically clear adhesive sheet according to claim 1 ,wherein the tackifier includes an alicyclic saturated hydrocarbon resin.7. A method for producing the optically clear adhesive sheet according to claim 1 , the method comprising the steps of:preparing the thermosetting polyurethane composition by mixing the polyol component, the polyisocyanate component, and the tackifier with stirring; andcuring the thermosetting polyurethane composition.8. A laminate comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the optically clear adhesive ...

ADHESIVE COMPOSITION FOR BASE WITH LOW-ENERGY SURFACE

The present invention provides a stable organic solvent solution-type adhesive composition that is in a solution state even at low temperatures and that has excellent adhesion to polyolefin base materials, in particular polyethylene substrates (both LDPE and HDPE). The invention provides an adhesive resin composition comprising a modified polyethylene copolymer (component A) having a melting point of less than 80° C., a terpene-based tackifier (component B), and an organic solvent (component C), wherein component B is contained in an amount of 30 to 100 parts by weight, per 100 parts by weight of component A. 2. The adhesive composition according to claim 1 , wherein the terpene-based tackifier (component B) is a terpene phenol resin.3. The adhesive composition according to claim 1 , wherein the organic solvent (component C) is an alicyclic hydrocarbon compound and/or an aromatic hydrocarbon compound.4. The adhesive composition according to claim 1 , wherein the weight percentage of component A and component B is 20 wt % or less claim 1 , based on the total weight of component A claim 1 , component B claim 1 , and component C.5. The adhesive composition according to claim 1 , further comprising a polypropylene-based resin (component D) in an amount of less than 15 parts by weight claim 1 , per 100 parts by weight of component A.6. The adhesive composition according to claim 2 , wherein the organic solvent (component C) is an alicyclic hydrocarbon compound and/or an aromatic hydrocarbon compound.7. The adhesive composition according to claim 2 , wherein the weight percentage of component A and component B is 20 wt % or less claim 2 , based on the total weight of component A claim 2 , component B claim 2 , and component C.8. The adhesive composition according to claim 3 , wherein the weight percentage of component A and component B is 20 wt % or less claim 3 , based on the total weight of component A claim 3 , component B claim 3 , and component C.9. The adhesive ...

VARIABLE RATIO ADHESIVE APPLICATION

A process for adhering a window to a frame comprising the steps of: providing a frame for a window having a peripheral surface for mating to an outer peripheral surface of a window; applying a bead of curable adhesive at least partially around the peripheral surface of the frame or on the outer peripheral surface of the window; and adding a boosting agent to the bead of curable adhesive at preselected areas of the peripheral surface of the frame or of the outer peripheral surface of the window for securely holding the window in place upon assembly of the window into the frame. 1. A process for adhering a window to a frame comprising the steps of:providing a frame for a window having an inner peripheral surface defining an opening in the frame and an outer peripheral surface of the frame, wherein the inner peripheral surface and the outer peripheral surface have two or more mating corners;applying a bead of curable adhesive at least partially around the opening in the frame on a flange between the inner peripheral surface and the outer peripheral surface, wherein applying the bead of curable adhesive further includes applying to at least two or more preselected areas located at the two or more mating corners and a boosting agent that is added to the curable adhesive for securely holding the window in place upon assembly of the window into the frame;providing a window having an edge;placing the window on the frame such that a portion of the inside surface of the window extends over the flange and the edge aligns with the outer peripheral surface of the frame wherein the bead of curable adhesive and the boosting agent is positioned between an inside surface of the window and the flange of the frame.2. The process of further comprising assembling the window into the frame and the window is held in the frame at the pre-selected areas during the curing of the curable adhesive.3. The process of wherein the bead of adhesive is applied over the entire flange of the frame or ...

Honeycomb Core Splice Adhesive with Improved Fire Retardancy

The invention relates to a heat-activatable foamable honeycomb core splice adhesive having improved fire retardancy, particularly with respect to smoke toxicity and smoke opacity (smoke density). 1. A heat-activatable foamable adhesive comprisinga) a curable polymer;b) a curing agent for the curable polymer;c) a blowing agent; and (i) an ammonium polyphosphate and', '(ii) a metal hydroxide; and, 'd) a fire retardant comprising a combination of'} (i) an elastomer, preferably a nitrile rubber; and/or', '(ii) fibers, preferably aramid fibers; and/or', '(iii) clay, preferably sepiolite, smectite, or a combination thereof., 'e) an anti-sagging agent comprising2. The adhesive according to claim 1 , wherein the ammonium polyphosphate has an average molecular weight within the range of from about 500 g/mol to about 5000 g/mol claim 1 , more preferably about 1000 g/mol to about 3500 g/mol claim 1 , still more preferably about 1500 g/mol to about 3000 g/mol.3. The adhesive according to claim 1 , wherein the ammonium polyphosphate (i) has a phosphorous content of at least about 15% claim 1 , more preferably at least about 20% claim 1 , still more preferably at least about 25% claim 1 , or at least about 30%; and/or (ii) has a nitrogen content of at least about 4% claim 1 , more preferably at least about 7% claim 1 , still more preferably at least about 10% claim 1 , or at least about 13%.46-. (canceled)7. The adhesive according to claim 2 , wherein the metal hydroxide is aluminum trihydroxide.811-. (canceled)12. The adhesive according to claim 3 , wherein the total content of fire retardants and smoke suppressors claim 3 , preferably being independently from one another selected from ammonium polyphosphates claim 3 , metal hydroxides claim 3 , and expandable graphites claim 3 , is not more than about 60 wt.-% claim 3 , more preferably not more than about 50 wt.-% claim 3 , still more preferably not more than about 45 wt.-% claim 3 , yet more preferably not more than about 40 ...

ADHESIVE ELEMENT, OPENING CLOSED OFF WITH THE ADHESIVE ELEMENT, SUCH AS A CONSTRUCTION HOLE, A BODY HOLE, A PAINT DRAIN HOLE AND/OR A PAINT DRAIN OPENING, AND SYSTEM CONSISTING OF THE ADHESIVE ELEMENT AND A CARRIER ELEMENT

An adhesive element including a cover layer and a self-adhering sealant, wherein the self-adhering sealant is a thermoactive or thermoactivated rubber compound. 1. An adhesive element comprisinga covering layer anda self-adhesive sealing composition,wherein the self-adhesive sealing composition is a thermoactive or thermoactivated rubber composition.2. The adhesive element as claimed in claim 1 , wherein the covering layer comprises a metal layer.3. The adhesive element as claimed in claim 1 , wherein the rubber composition is configured so that it is converted into a thermoactivated state by means of heating above a temperature threshold for a residence time.4. The adhesive element as claimed in claim 1 , wherein a thermoactive rubber composition comprises a first type of rubber claim 1 , a second type of rubber claim 1 , a hydrocarbon resin claim 1 , an organic crosslinker claim 1 , a catalyst claim 1 , a dye claim 1 , a thermal stabilizer and/or a moisture remover.5. The adhesive element as claimed in claim 1 , wherein the thermoactive rubber composition comprises a filler.6. The adhesive element as claimed in claim 1 , wherein a ratio of a proportion of rubber to the proportion of the fillers assumes a value in the range from 0.3 to 0.8.7. The adhesive element as claimed in claim 4 , whereina proportion of the first type of rubber assumes a value in the range from 5 to 25%,a proportion of the second type of rubber assumes a value in the range from 10 to 45%, and/ora proportion of the filler assumes a value in the range from 40% to 70%.8. The adhesive element as claimed in claim 1 , wherein the adhesive element displays a penetration force of from 300 to 1200 N.9. The adhesive element as claimed in claim 1 , wherein the rubber composition is sulfur-free.10. A process for producing an adhesive element claim 1 , as claimed in claim 1 , comprising the steps:provision of an adhesive element comprising a covering layer and a self-adhesive sealing composition ...

Hot Melt Adhesive Composition

A hot-melt adhesive composition includes a styrene-butadiene-styrene triblock copolymer and a styrene-isoprene-styrene triblock copolymer. The hot-melt adhesive composition enables melt processing at a relatively low temperature because of having a low viscosity property and thus exhibits excellent adhesive strength and heat resistance while improving the processability. In particular, the melt adhesive composition has excellent mechanical properties after curing, and thus can be used in various industrial fields. 1. A hot melt adhesive composition comprising:A1) a styrene-butadiene-styrene triblock copolymer, whereina1) a content of the styrene-based unit is 30 to 50 wt %,a2) a diblock content is at least 55% by weight, anda3) a melt flow index measured according to ASTM D1238 is 30 g/10 min or more;A2) a styrene-isoprene-styrene triblock copolymer, whereina21) a content of the styrene-based unit is 30 to 50 wt %, anda22) a diblock content is less than 5% by weight;B) a tackifier; andC) a plastic oil,wherein the hot melt adhesive composition has a softening point measured according to the ASTM D36 standard of 85° C. or higher.2. The hot melt adhesive composition according to claim 1 , wherein the hot melt adhesive composition has a melt viscosity at 140° C. of 7000 cPs or less claim 1 , and a viscosity change rate at 160° C. of 15% or less.3. The hot melt adhesive composition according to claim 1 , wherein the styrene-isoprene-styrene triblock copolymer has a melt flow index measured according to the ASTM D1238 standard of 30 to 50 g/10 min.4. The hot melt adhesive composition according to claim 1 , wherein the hot melt adhesive composition preferably has a tensile strength value of 1 N/mmor more when preparing a test specimen according to the ASTM D638 standard.5. The hot melt adhesive composition according to claim 1 , wherein the styrene-isoprene-styrene triblock copolymer is included in an amount of 1 to 30 parts by weight claim 1 , based on 100 parts by weight ...

All-Weather Pressure-Sensitive Adhesive

The present invention provides a non-cured-in-place waterproofing pressure-sensitive adhesive having a microfibrillar additive for achieving ideal balance between sag resistance at elevated temperatures and good adhesion at low temperatures. Waterproofing membranes comprising a carrier sheet and pressure-sensitive adhesive layer are also described, along with methods of manufacture. 1. A composition for a pressure-sensitive adhesive , comprising:at least one elastomer;at least one tackifier or bitumen;at least one plasticizer; anda microfibrillar rheology-modifying agent,wherein the composition is non-cured-in-place and is substantially devoid of structural diluents, radical addition diluents, curatives, cross-linkers, and liquid reactive oligomers.2. The composition of claim 1 , wherein the at least one elastomer is selected from the group consisting of butyl rubber claim 1 , polyisobutylene claim 1 , vinyl ethers claim 1 , styrene-isoprene-styrene block copolymers claim 1 , styrene-ethylene-butylene-styrene block copolymers claim 1 , styrene-butadiene-styrene block copolymers claim 1 , styrene-butadiene rubber claim 1 , ethylene vinyl acetate copolymers claim 1 , polyisoprene claim 1 , polybutadiene claim 1 , polychloroprene claim 1 , natural rubber claim 1 , and mixtures thereof.3. The composition of claim 1 , wherein the at least one tackifier is selected from the group consisting of rosin esters claim 1 , hydrogenated rosin esters claim 1 , dimerized rosin resins claim 1 , modified rosin resins claim 1 , aliphatic (C-5 resins) hydrocarbon resins claim 1 , hydrogenated aliphatic resins claim 1 , aromatic (C-9 resins) hydrocarbon resins claim 1 , hydrogenated aromatic resins claim 1 , mixed aliphatic/aromatic (mixed C-5/C-9 resins) hydrocarbon resins claim 1 , terpene resins claim 1 , terpene phenolic resins claim 1 , and mixtures thereof.4. The composition of claim 1 , wherein the at least one plasticizer is selected from the group consisting of paraffinic oils ...

Liquid Adhesive Concentrate

Provided herein are compositions and methods of preparing a liquid adhesive concentrate and a liquid adhesive formulation for use as an adhesive in installing insulation on the outside or inside surface of a duct or ductwork. 1. A liquid adhesive concentrate , comprising: a polyvinyl alcohol-stabilized vinyl acetate-ethylene copolymer dispersion in a range from about 50% to about 90%,', 'a dry polymer in a range from about 10% to about 40%,', 'a surfactant in a range from about 0.3% to about 1.2%,', 'a defoamer in a range from about 0.1% to about 0.5%,', 'a biocide in a range from about 0.1% to about 0.3%, and', 'a dispersant in a range from about 0.3% to about 1.2%., 'a solid content, the solid content comprising,'}2. The liquid adhesive concentrate of claim 1 , further comprising vinyl acetate-ethylene in a range from about 10% to about 40%.3. The liquid adhesive concentrate of claim 1 , wherein the solid content is in a range from about 70% to about 80%.4. The liquid adhesive concentrate of claim 1 , wherein the solid content is 80% polyvinyl alcohol-stabilized vinyl acetate-ethylene copolymer dispersion claim 1 , 0.4% surfactant claim 1 , 0.3% defoamer claim 1 , 0.2% biocide claim 1 , 0.3% dispersant claim 1 , and 18% dry polymer.5. The liquid adhesive concentrate of claim 1 , wherein the dry polymer is selected from the group consisting of acrylic claim 1 , vinyl acetate-ethylene claim 1 , DP-2903 claim 1 , 2894 claim 1 , CPS 785A claim 1 , dry latex powders claim 1 , 5044 claim 1 , 5010 claim 1 , 4016 claim 1 , and a combination thereof.6. The liquid adhesive concentrate of claim 1 , wherein the surfactant is selected from the group consisting of non-ionic surfactants claim 1 , ethoxylate-based surfactants claim 1 , NP-40S claim 1 , 15-S-7 claim 1 , X-405 claim 1 , EH-9 claim 1 , CO-897 claim 1 , polymeric surfactants claim 1 , L-101 claim 1 , 502W claim 1 , nonylphenol ethoxylate surfactants claim 1 , and a combination thereof.7. The liquid adhesive ...

HOT MELT ADHESIVE

One aspect of the present invention resides in a hot melt adhesive including a thermoplastic polymer and a tackifier, wherein the tackifier includes an acid-modified tackifier that is modified by at least one of maleic acid and maleic anhydride, and by at least one selected from the group consisting of acrylic acid, methacrylic acid, an acrylic acid ester, and a methacrylic acid ester. 1. A hot melt adhesive comprising a thermoplastic polymer and a tackifier , whereinthe tackifier includes an acid-modified tackifier that is modified by at least one of maleic acid and maleic anhydride, and by at least one selected from the group consisting of acrylic acid, methacrylic acid, an acrylic acid ester, and a methacrylic acid ester.2. The hot melt adhesive according to claim 1 , wherein the acid-modified tackifier is a terpene-based resin that is modified by at least one of maleic acid and maleic anhydride claim 1 , and by at least one selected from the group consisting of acrylic acid claim 1 , methacrylic acid claim 1 , an acrylic acid ester claim 1 , and a methacrylic acid ester.3. The hot melt adhesive according to claim 2 , wherein the terpene-based resin before modification in the acid-modified tackifier is at least one selected from the group consisting of a hydrogenated aromatic modified terpene resin claim 2 , an aromatic modified terpene resin claim 2 , and a hydrogenated terpene resin.4. The hot melt adhesive according to claim 1 , wherein the acid-modified tackifier is a hydrogenated petroleum-based resin that is modified by at least one of maleic acid and maleic anhydride claim 1 , and by at least one selected from the group consisting of acrylic acid claim 1 , methacrylic acid claim 1 , an acrylic acid ester claim 1 , and a methacrylic acid ester.5. The hot melt adhesive according to claim 4 , wherein the hydrogenated petroleum-based resin before modification in the acid-modified tackifier is at least one selected from the group consisting of a hydrogenated ...

COMPOSITE AND LAMINATE ARTICLES AND POLYMERIZABLE SYSTEMS FOR PRODUCING THE SAME

A composite material comprises a reinforcing material carried in a polymer matrix material which is the polymerization product of a polymerizable composition comprising a di-activated vinyl compound, with the proviso that the di-activated vinyl compound is not a cyanoacrylate. The reinforcing materials may be a wide variety of substrates including thermally sensitive materials. Exemplary composites can be molded and cured at ambient temperatures. Also disclosed are laminate materials having layered materials adhered by curing a di-activated vinyl polymerizable composition. 1. A composite material comprising:a polymer material; anda reinforcing or filler material;wherein the polymer material comprises a polymerization product of a polymerizable composition comprising a di-activated vinyl compound, with the proviso that the di-activated vinyl compound is not a cyanoacrylate.2. The composite material according to claim 1 , wherein the di-activated vinyl compound comprises at least one member of the group consisting of a methylene malonate claim 1 , a methylene betaketoester claim 1 , a methylene betadiketone.3. The composite material according to claim 2 , wherein the methylene malonate monomer claim 2 , wherein the methylene malonate monomer is represented by the formula: R—O—C(O)—C(═CH)—C(O)—O—R claim 2 , wherein R claim 2 , Rare independently C1-C15 alkyl claim 2 , C2-C15 alkenyl claim 2 , halo-(C1-C15 alkyl) claim 2 , C3-C6 cycloalkyl claim 2 , halo-(C3-C6 cycloalkyl) claim 2 , heterocyclyl claim 2 , heterocyclyl-(C1-C15 alkyl) claim 2 , aryl-(C1-C15 alkyl) claim 2 , heteroaryl or heteroaryl-(C1-C15 alkyl) claim 2 , or alkoxy-(C1-15 alkyl) claim 2 , each of which may be optionally substituted by C1-C15 alkyl claim 2 , halo-(C1-C15 alkyl) claim 2 , C3-C6 cycloalkyl claim 2 , halo-(C3-C6 cycloalkyl) claim 2 , heterocyclyl claim 2 , heterocyclyl-(C1-C15 alkyl) claim 2 , aryl claim 2 , aryl-(C1-C15 alkyl) claim 2 , heteroaryl claim 2 , C1-C15 alkoxy claim 2 , C1-C15 ...

ADHESIVE COMPOSITIONS AND METHODS OF USING THE SAME

A composition comprising a base oil in an amount from 5 to 95 wt %, an ethylene vinyl acetate copolymer resin, and an ester-soluble tackifying resin; wherein the ethylene vinyl acetate copolymer resin is present in an amount from 5 to 95 wt % based on the total weight of the ethylene vinyl acetate copolymer resin and the ester-soluble tackifying resin is provided. Methods for assembling or lubricating turbine engines are also provided. 2. The composition according to claim 1 , wherein the base oil is selected from the group consisting of an alkylated naphthalene-based oil claim 1 , a polyol ester oil claim 1 , an olefin ester copolymer based oil claim 1 , a polyalphaolefinic oil and combinations thereof.3. The composition according to claim 1 , wherein the ester-soluble tackifying resin is a terpene phenolic resin.4. The composition according to claim 1 , wherein the composition exhibits a tackiness or adhesive ability such that a 10 mm diameter roller and a roller cage segment is held together by the composition against the force of gravity at 121° C. for a period of time equal to or greater than 4 minutes.5. The composition according to claim 1 , wherein the composition exhibits a tackiness or adhesive ability such that a 14 mm diameter roller and a roller cage segment is held together by the composition against the force of gravity at 121° C. for a period of time equal to or greater than 4 minutes.6. The composition according to claim 1 , wherein the composition is soluble in a SAE AS5780 qualified oil such that when 2 wt % of the composition is mixed into the SAE AS5780 qualified oil with stirring at 180° C. to form a mixture claim 1 , followed by cooling at room temperature claim 1 , the mixture will remain as one phase greater than 8 hours and with no precipitate for greater than 24 hours.7. The composition according to claim 1 , further comprising an additive selected from the group consisting of an antioxidant claim 1 , a friction modifier claim 1 , a ...

METHOD FOR ADHESIVELY BONDING RUBBER-BASED THERMOPLASTIC SUBSTRATES

A method for adhesively bonding two substrates by means of a moisture-curable adhesive composition, wherein at least one of the substrates includes at least 40 wt.-% of a mixture, said mixture consisting of: between 15 and 99 wt.-% of at least one thermoplastic polymer; between 1 and 85 wt.-% of at least one elastomer; and wherein the moisture-curable adhesive composition includes: at least one polymer containing silane groups; between 10 and 40 wt.-% of at least one polymeric plasticizer; between 0.1 and 5 wt.-% of at least one amino-functional alkoxysilane; between 0 and 5 wt.-% of at least one C1-C12-alkyl-functional alkoxysilane. The method yields adhesively bonded substrates without the requirements of using migrating plasticizers and pre-treating of the substrates. 2. The method according to claim 1 , wherein the at least one elastomer E2 is selected from the group consisting of butyl rubber and halogenated butyl rubber and/or the at least one thermoplastic polymer E1 is at least one thermoplastic polyolefin elastomer (TPE-O).3. The method according to claim 1 , wherein the thermoplastic polymer E1 and the elastomer E2 elastomer form a co-continuous phase.4. The method according to claim 1 , wherein the substrate S1 is a membrane or sheet having a thickness of at least 0.1 mm.5. The method according to claim 1 , wherein the substrate S1 is not pre-treated by a chemically reactive primer claim 1 , flame claim 1 , oxofluorination claim 1 , plasma claim 1 , or corona pre-treatment prior to step a).6. The method according to claim 1 , wherein the polymer P containing silane groups is an organic polymer containing silane groups.7. The method according to claim 1 , wherein the polymeric plasticizer PL is a polyether claim 1 , having end groups independently selected from hydrocarbon claim 1 , alkoxy claim 1 , hydroxyl claim 1 , or amino groups.8. The method according to claim 1 , wherein the moisture-curable adhesive composition A does not contain any further ...