Heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet

Provided is a heat-expandable removable acrylic pressure-sensitive adhesive tape that has high normal-state adhesive power when bonded independently of whether the adherend has or does not have irregular surface and permits easy separation when the bonded region is separated and disassembled by lowering the adhesive power by heating, that permits easily separation-decomposition, even after long-term storage at high temperature. The heat-expandable removable acrylic pressure-sensitive adhesive tape or sheet according to the present invention includes at least a heat expanding agent-containing pressure-sensitive adhesive layer, and the tape or sheet has an initial 90° peel adhesive strength to a polycarbonate plate as adherend of 10 N/25 mm or more and a 90° peel adhesive strength after storage in an atmosphere at 80° C. for 2 months as bonded to the polycarbonate adherend and after heat expansion treatment of less than 10 N/25 mm.

Adhesive film for light emitting device and method of manufacturing led package using the same

Provided is an adhesive film for an LED chip, including: a double-sided adhesive layer having the LED chip adhered to an upper surface thereof and a lead frame adhered to a lower surface thereof; an ultraviolet (UV) cured layer adhered to one surface of the double-sided adhesive layer; and upper and lower cover layers respectively adhered to faces exposed to the exterior of the double-sided adhesive layer and the UV cured layer.

Compositions for polymer bonding

Compositions having a compound comprising at least one alkoxy silane moiety, and at least one moiety selected from a nitrosoaromatic or a nitrosoaromatic precursor and combinations thereof; and an aqueous or water containing carrier medium are provided for use in polymer bonding. The water may allow for substantial hydrolysis of the compound. Suitable polymers may have diene or allylic functionality within the polymer chain, for example an elastomer such as a natural or synthetic rubber. The polymers may be bonded to metals or substrates with hydroxylated surfaces such as glass. The nitrosobenzene precursor may be at least one of a quinone dioxime or a quinone oxime.

Adhesive fastening elements for holding a workpiece and methods of de-bonding a workpiece from an adhesive fastening element

An adhesive fastening element includes a first member and a second member adjacent to the first member and movable relative to the first member along a longitudinal axis of the adhesive fastening element, wherein a bond is formed by an adhesive between the workpiece and the first and second members of the adhesive fastening element. A method for debonding a workpiece from an adhesive fastening element includes moving the second member away from the workpiece and breaks the bond between the second member and the workpiece and moving the first and second members such that the second member moves towards the workpiece and applies a force to the workpiece so as to break the bond between the first member and the workpiece, and to de-bond the workpiece from the adhesive fastening element.

Method for fabricating display device

A method for fabricating a display device 1 includes a first step of attaching a display panel and a first substrate member to each other with a first adhesive sandwiched between the display panel and the first substrate member, and a second step of attaching a second substrate member to the first substrate member on a surface of the first substrate member opposite to the display panel with a second adhesive sandwiched between the first and second substrate members, where the second step is carried out subsequently to the first step. The second adhesive used in the second step has a glass transition point higher than a glass transition point of the first adhesive.

Polymer for pressure sensitive adhesive, pressure sensitive adhesive composition and heat-peelable pressure sensitive adhesive sheet

A pressure sensitive adhesive having tackiness sufficient for fixing an article even when heated and having adhesive strength that may be lowered when heated to a higher temperature is provided. The pressure sensitive adhesive polymer comprises a copolymer of a (meth)acrylic monomer represented by a general formula, CH 2 ═C(R1)COOR2 (wherein R1 is a hydrogen group or a methyl group and R2 is a hydrogen group or an alkyl group having of 1 to 20 carbon atoms) and a comonomer having a double bond copolymerizable with the (meth)acrylic monomer, in which the comonomer has a ring structure having two or more carbon atoms and one or more double bonds and containing one or more atoms other than carbon, and the polymer is obtained by copolymerizing 1 to 20 parts by weight of the monomer having a ring structure with 100 parts by weight of the (meth)acrylic monomer.

Component adhesive bonding structure and component separation method

A configuration includes the adhesive member to adhesively bond components together and a thermo-expandable material to expand upon being heated in the way of being disposed between at least one of the components adhesively bonded together by the adhesive member and the adhesive member and to push the adhesive member in a direction of getting apart from at least one of the components.

Activatable Adhesive, Labels, and Related Methods

An activatable adhesive that is formulated to readily absorb energy from a given radiation source, an activatable adhesive label that incorporates such an activatable adhesive, a system for activating such labels, and related methods and uses are described. The activatable adhesive includes a plasticizer, a tackifier, and an adhesive base polymer that includes butyl acrylate, styrene, methyl methacrylate, methacrylic acid, and acrylic acid.

Debondable adhesive article

An adhesive article is described that is debondable from substrates or adherends with the application of heat.

Non-Flowing Silicone Adhesive

Adhesive formulations are described that upon sufficient curing and drying, are not sticky or tacky at room temperature, yet can be heat bonded. The adhesives are particularly useful for use in bonding brake components together and find wide application in vehicle brake systems. When used in such systems, the adhesives do not flow in parking applications yet sufficiently dampen vibration in slowing or stopping applications to counter brake squeal. The adhesives can be provided in a tape form and used for bonding brake shims to brake pads in electronic parking brake systems.

Method of sticking together and un-sticking two parts by means of a filled adhesive

The invention provides a method of bonding a first part on a second part made of composite material by means of an adhesive, wherein said adhesive is filled with elements of shape memory alloy. The invention also provides a method of un-sticking the first part adhesively bonded on the composite material second part, said un-sticking method comprising a step of weakening the adhesive interface that consists in subjecting the adhesively bonded parts to heat treatment performed at a temperature that is lower or higher than the martensitic transformation temperature of the shape memory alloy elements.

PRESSURE-SENSITIVE ADHESIVE ARTICLES

Provided is an adhesive article which requires no separator and exhibits sufficient adhesive force without the need of any operation for adhesive-force development and in which the adhesive layer, even when in contact with itself, can be peeled off at the interface. The adhesive article includes an adhesive body including an adhesive layer, wherein the adhesive layer has a gel content of 5-70%, the adhesive article, through 7-day storage at 40° C., has a change in the gel content of the adhesive layer of −5% to 5%, and surface portions of the adhesive layer are in contact with each other. 1. An adhesive article comprising an adhesive body comprising an adhesive layer ,wherein the adhesive layer has a gel content of 5-70%,the adhesive article, through 7-day storage at 40° C., has a change in the gel content of the adhesive layer of −5% to 5%, andsurface portions of the adhesive layer are in contact with each other.2. An adhesive article comprising an adhesive body comprising an adhesive layer ,wherein the adhesive layer has a gel content of 5-70%,surface portions of the adhesive layer are in contact with each other, andthe portions of the adhesive layer which are in contact with each other are capable of being separated from each other at the interface therebetween after 7-day storage at 40° C.3. The adhesive article according to claim 1 , wherein the adhesive layer comprises at least one adhesive selected from the group consisting of acrylic adhesives claim 1 , urethane-based adhesives claim 1 , silicone-based adhesives claim 1 , rubber-based adhesives claim 1 , and polyester-based adhesives.4. The adhesive article according to claim 1 , wherein the adhesive layer comprises an acrylic adhesive.5. The adhesive article according to claim 1 , wherein the adhesive body is sheet-shaped.6. The adhesive article according to claim 5 , wherein the adhesive body further includes a substrate claim 5 , and the adhesive layer is disposed on at least one surface of the substrate. ...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material. 1. A method for manufacturing an electronic device , comprising at least:{'b': '1', 'claim-text': [ a base material layer;', 'an adhesive resin layer (A) for temporarily fixing an electronic component, which is provided on a first surface side of the base material layer; and', 'an adhesive resin layer (B) in which an adhesive force is decreased by an external stimulus, which is provided on a second surface side of the base material layer;, 'an adhesive film having, 'an electronic component attached to the adhesive resin layer (A) of the adhesive film; and', 'a support substrate attached to the adhesive resin layer (B) of the adhesive film;, 'a step () of preparing a structure having{'b': 2', '2', '1', '2', '2, 'at least one step () selected from a step (-) of decreasing water content in the adhesive film and a step (-) of decreasing water content in the structure; and'}{'b': '3', 'a step () of sealing the electronic component with a sealing material.'}2. The method for manufacturing an electronic device according to claim 1 ,{'b': 2', '2', '1, 'wherein the step () includes the step (-) of decreasing the water content in ...

Detachable adhesive composition systems and methods

A detachable adhesive composition for selectively adhering to an object and detaching therefrom, including an adhesive compound and a plurality of selectively activated particles. The composition is configured to adhere to an object when the selectively activated particles are inactive, and the plurality of selectively activated particles are configured to be activated upon exposure to and absorption of energy causing the selectively activated particles to flow and expand so as to form micro-cracks in the adhesive compound, flow into the micro-cracks, and react with the adhesive compound by at least one of at least partially chemically reacting with adhesive compound so as to at least partially digest the adhesive compound, and lubricating the adhesive compound so as to allow the detachable adhesive composition to detach from the object.

Ephemeral bonding

Compositions suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate, are disclosed. Methods of temporarily bonding two surfaces, such as the active side of a wafer and a substrate using the compositions disclosed herein are also provided.

Rubber-metal adhesive

A rubber metal adhesive can be coated by screen printing, and can be effectively used for metal surface treatment at the time of forming a rubber-metal complex excellent in water resistance and heat resistance. The rubber metal adhesive comprises an organometallic compound, silica, magnesium silicate hydrate, and an organic solvent represented by the following general formula (I): R—O—(CH2)2OH  General formula (I) [wherein R represents an alkyl group having 3 or more carbon atoms or an aryl group.]

Adhesive tape with polyurethane carrier

The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation Fto breaking force Fof not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fto breaking force Fof less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation Fto breaking force Fof not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fto breaking force Fof less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices. 1. An adhesive tape having a thickness of 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond , comprising{'sub': ['400%', 'break'], '#text': 'at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not ...

FILM FOR MANUFACTURING SEMICONDUCTOR PARTS

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating. 1. A film for manufacturing a semiconductor part used in a method for manufacturing a semiconductor part comprising:a base layer; and an adhesive layer disposed on one surface side of the base layer,{'sub': E', 'E, 'wherein the ratio R(=E′(160)/E′(−40)) of the elastic modulus E′(160) of the base layer at 160° C. to the elastic modulus E′(−40) of the base layer at −40° C. is such that R≥0.01, and the elastic modulus E′(−40) is 10 MPa or more and less than 1000 MPa.'}2. The film for manufacturing a semiconductor part according to claim 1 , wherein the base layer includes a thermoplastic polyester-based elastomer and/or a thermoplastic polyamide-based elastomer.3. The film for manufacturing a semiconductor part according to claim 1 , wherein the base layer has a thickness of 50 μm or more and 200 μm or less.4. The film for manufacturing a semiconductor part according to claim 1 , wherein the adhesive layer has a thickness of 1 μm or more and 40 μm or less.5. The film for manufacturing a semiconductor part according to claim 1 , wherein the adhesive layer has an adhesive force of 0.1 to 10 N/25 mm which is ...

Label Assembly and Method for Affixing a Label to a Surface Using the Same

A label assembly and a method for affixing a label to a surface, the label assembly comprising: a label support liner having a label receiving surface comprising a release coating, the label support liner including a main liner portion and a removable liner portion separable from the main liner portion; and a label layer extending over the label receiving surface, the label layer including: a label releasably affixed to the label receiving surface, the label including a first label portion overlapping the main liner portion and a second label portion overlapping the removable liner portion such that separating the removable liner portion from the main liner portion and moving the removable liner portion away from the label receiving surface peels the first label portion away from the main liner portion while the second label portion remains affixed to the removable liner portion. 1. A label assembly comprising:a label support liner having a label receiving surface comprising a release coating, the label support liner including a main liner portion and a plurality of removable liner portions individually separable from the main liner portion; and 'a plurality of labels releasably affixed to the label receiving surface, each label including a first label portion overlapping the main liner portion and a second label portion overlapping a corresponding one of the removable liner portions such that separating the corresponding one of the removable liner portions from the main liner portion and from the other ones of the removable liner portions and moving the corresponding one of the removable liner portions away from the label receiving surface peels the first label portion away from the main liner portion while the second label portion remains affixed to the corresponding one of the removable liner portions.', 'a label layer extending over the label receiving surface, the label layer including2. The label assembly as claimed in claim 1 , wherein the label support liner ...

Method for manufacturing electronic component

Provided is a method of manufacturing an electronic part including fixing a hard and brittle substrate to a support and separating the hard and brittle substrate from the support, the method being capable of preventing the hard and brittle substrate from being damaged during the separation of the hard and brittle substrate from the support. The method of manufacturing an electronic part of the present invention is a method of manufacturing an electronic part including processing a workpiece fixed onto a support, the method including: fixing the workpiece by arranging at least one heat-peelable layer between the support and the workpiece; processing a surface of the fixed workpiece on an opposite side to the heat-peelable layer; and separating the workpiece from the support by heating the heat-peelable layer after the processing.

Protective sheet

Provided is a Low-E glass plate protective sheet that can have protective properties for a Low-E glass plate as an object to be protected and can maintain good removability while preventing or inhibiting surface contamination of the object to be protected even when prolongedly adhered thereto. The Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer comprises at least 95% base polymer by weight.

METHOD FOR PREPARING PRESSURE-SENSITIVE ADHESIVE COMPOSITION, METHOD FOR PRODUCING PROTECTIVE SHEET AND METHOD FOR PRODUCING GLASS UNIT

Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 μS/cm or (b) having a chloride ion concentration below 35 μg/mL. 142-. (canceled)43. A method for producing a glass unit , the method comprising:a step (A) of obtaining a Low-E glass plate that comprises a glass substrate and a Low-E layer placed on the glass substrate;a step (B) of applying a protective sheet to a surface of the Low-E layer of the Low-E glass plate;an optional step (C) of subjecting the Low-E glass plate with the protective sheet applied thereon to at least one process selected from the group consisting of transportation, storage, processing, washing and handling;a step (D) of removing the protective sheet from the Low-E glass plate; anda step (E) of assembling a glass unit using the Low-E glass plate;wherein, the protective sheet comprises a pressure-sensitive adhesive layer,the pressure-sensitive adhesive layer is formed from a pressure-sensitive adhesive composition, and a step of obtaining an aqueous liquid, and', 'a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer;', 'wherein the aqueous liquid satisfies at least one of the following:', '(a) having an electrical conductivity below 300 μS/cm, and', '(b) having a chloride ion concentration below 35 μg/mL., 'the pressure-sensitive adhesive composition is prepared by a method comprising44. The method according to claim 43 , wherein the Low-E glass plate has a width of 1 m or greater.45. The method according to claim 43 , wherein the Low-E glass plate has a width of 2 m or greater.46. The method according to claim ...

Modification of siloxane polyoxamide copolymers with ultraviolet light

Methods of modifying polymeric compositions include exposing a polydiorganosiloxane polyoxamide copolymer composition to UV radiation at or below the B spectral range to effect de-polymerization of at least a portion of the polydiorganosiloxane polyoxamide copolymer. The polydiorganosiloxane polyoxamide copolymer composition may include additional components and the modified polydiorganosiloxane polyoxamide copolymer compositions can be included into articles.

Self-adhesive slot-closing device for an electric machine

A slot-closing device for closing a slot in a stator or a rotor of an electric machine includes a closure element which contains a ferromagnetic material. An adhesive layer disposed on the closure element is designed to expand and harden when heated. The adhesive layer contains a thermally activatable blowing agent configured as an expansion element which contains a closed cavity filled with gas. The cavity is partially enclosed by a thermoplastic resin in the expansion element

Fabric for interconnecting two surfaces

A fabric for interconnecting two opposite outer sheet layers and comprising two foam layers, each facing one of the opposite outer sheet layers, and an adhesive layer between each foam layer and the corresponding outer layer and a lateral foil, a foil being disposed between the two foam layers, such that the fabric is adapted to be torn apart so as to separate the two opposite layers from each other.

FUNCTIONALLY OPTIMIZED ADHESIVE BEADS

A method of making a roof assembly includes bringing first and second adhesive beads into contact with a roof panel and a roof stiffener to thereby define a chamber. The first adhesive bead forms a continuous perimeter around a first vacuum aperture in the roof stiffener to thereby define a first vacuum chamber. The second adhesive bead defines a second continuous perimeter around a second vacuum aperture in the roof stiffener to thereby define a second vacuum chamber. A vacuum is created in each of the first and second vacuum chambers. An outer periphery of each of the first and second adhesive beads is in direct fluid communication with the surrounding atmosphere through a perimeter opening of the chamber. 1. A method of applying an adhesive to a vehicle roof comprising:providing a roof panel including a first side opposite a second side;providing a roof stiffener including a first side opposite a second side, the roof stiffener including at least a first vacuum aperture and a second vacuum aperture each extending through the roof stiffener from the first side of the roof stiffener to the second side of the roof stiffener;applying a first adhesive bead to the first side of the roof panel or the first side of the roof stiffener;applying a second adhesive bead to the first side of the roof panel or the first side of the roof stiffener; andpositioning the first side of the roof panel facing the first side of the roof stiffener to define a chamber therebetween,wherein the roof stiffener or the roof panel includes an outer perimeter that defines an opening to the chamber,wherein the first adhesive bead and the second adhesive bead contact the roof panel and the roof stiffener, the first adhesive bead defines a first continuous perimeter around the first vacuum aperture, and the second adhesive bead defines a second continuous perimeter around the second vacuum aperture,wherein the first adhesive bead incudes an inner periphery and an outer periphery and the second ...

Debondable Adhesive Article and Methods of Making and Using the Same

A heat-debondable adhesive article having two opposing sides is pro vided that includes a shape-memory polymer sheet in its temporary strained shape that includes a plurality of slits therein and a first ad hesive on one opposing side of the polymer sheet and a second adhe sive on the other opposing side of the polymer sheet. The provided ar ticle, optionally, includes a first substrate in contact with the first ad hesive and a second substrate in contact with the second adhesive. The article can be debonded by heating the article to a temperature equal to or greater than a transition temperature for the shape-mem

Temporary adhesion of chemically similar substrates

A temporary adhesive for reversibly bonding a silicon wafer to a silicon support contains a crosslinkable organopolysiloxanes composition and a fatty acid or salt thereof or fatty acid ester as a release regulator having a density different from the crosslinkable organopolysiloxanes composition of at least 0.1 g/cm 3 , which upon parting of the wafer from the substrate, the adhesive remains substantially adhered to the substrate.

UV DEBONDABLE PRESSURE SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE TAPE

The present invention provides a UV debondable pressure sensitive adhesive composition and an adhesive tape comprising the same. The UV debondable pressure sensitive adhesive composition comprises a polyacrylate pressure sensitive adhesive, a UV-light polymerizable polyurethane oligomer, a cationic photoinitiator and a free radical photoinitiator, wherein polymerization monomers of the polyacrylate pressure sensitive adhesive comprise an acrylic monomer having an epoxy functional group. The UV debondable pressure sensitive adhesive composition has a bonding force dropping significantly upon UV irradiation, and leaves no residual adhesive. 1. A UV debondable pressure sensitive adhesive composition , the UV debondable pressure sensitive adhesive comprising:20 to 80 parts by weight of a polyacrylate pressure sensitive adhesive, polymerization monomers of the polyacrylate pressure sensitive adhesive comprising an acrylic monomer having an epoxy functional group;20 to 80 parts by weight of a UV-light polymerizable polyurethane oligomer, the UV-light polymerizable polyurethane oligomer having a glass transition temperature upon UV polymerization of 60° C. or more;0.1 to 5 parts by weight of a cationic photoinitiator; and0.1 to 5 parts by weight of a free radical photoinitiator.2. The UV debondable pressure sensitive adhesive composition according to claim 1 , wherein the UV-light polymerizable polyurethane oligomer has a glass transition temperature upon UV polymerization of 90° C. or more.3. The UV debondable pressure sensitive adhesive composition according to claim 1 , wherein the acrylic monomer having an epoxy functional group accounts for 0.1 wt % to 10 wt % of the polymerization monomers of the polyacrylate pressure sensitive adhesive.4. The UV debondable pressure sensitive adhesive composition according to claim 1 , wherein the acrylic monomer having an epoxy functional group comprises acrylic glycidyl ether or methacrylic glycidyl ether.5. The UV debondable ...

READILY ADHESIVE POLYESTER FILM AND METHOD FOR PRODUCING SAME

This invention provides a readily adhesive polyester film that has fewer flaws and in which no appearance defects occur due to tight winding during the storage of rolled products, and a method for efficiently producing the readily adhesive polyester film. More specifically, this invention provides a readily adhesive polyester film comprising a polyester film as a base film and a readily adhesive layer on at least one side of the base film, wherein the base film contains particles with an average particle diameter of 0.1-2 μm or more in an amount of 1 mass % or less based on the mass of the base film, and the readily adhesive layer is a cured product of a composition comprising a copolymerized polyester resin (A), a blocked isocyanate group-containing urethane resin (B), and a silicone surfactant (C). This invention also provides a method for producing a readily adhesive polyester film.

TACK REDUCTION FOR SILICONE GEL SEALS

Disclosed herein is a silicone gel having a surface treated with an additive. The additive comprises a synthetic, micronized hydrocarbon wax selected from a polyethylene, a polytetrafluoroethylene, a polypropylene, an amide wax, and any combination thereof. Alternatively, the additive comprises a micronized metallic stearate. The additive has a melting point of at least 90° C., or from about 90° C. to about 160° C.

PORTABLE INFORMATION DEVICE AND DOUBLE-SIDED ADHESIVE TAPE

A portable information device includes: a chassis; a decorative plate fixed to a part of an outer face of the chassis with stretch releasable double-sided adhesive tape; and a cover member that covers the outer face and the decorative plate. The double-sided adhesive tape has: an adhesive portion including adhesive layers on first and second faces of a substrate for adhesively fixing between the decorative plate and the outer face; and a tab including release paper partially covering the adhesive layers to let a user hold the tab for stretch release of the adhesive portion from between the decorative plate and the outer face. The double-sided adhesive tape has a first groove and a second groove on the first face and the second face, respectively, that are positioned not to overlap in a thickness direction of the substrate.

BACK GRINDING ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

Provided is a back grinding adhesive sheet which can adequately protect protrusions provided to a semiconductor wafer, and with which back grinding can be adequately performed. The present invention provides a back grinding adhesive sheet for a semiconductor wafer having protrusions, the back grinding adhesive sheet comprising a non-adhesive cushion layer, and an adhesive layer provided on the cushion layer. The adhesive layer has an opening with a smaller diameter than the diameter of the semiconductor wafer, and the outer edge of the semiconductor wafer is adhered to the adhesive layer such that the protrusions on the semiconductor wafer are positioned inside the opening. The protrusions are protected by the cushion layer when the semiconductor wafer is in the state of being adhered to the adhesive layer. The adhesive sheet satisfies at least one of the following conditions (1)-(2). (1) When the cushion layer is cut out using the dumbbell from JISZ1702 and is stretched 25% at a gauge length of 40 mm and a tensile speed of 300 mm/min, the tensile stress is 2-30N/10 mm. (2) The cushion layer is formed from a thermoplastic resin that has a melt flow rate (JISK7210, 125° C./10.0 kg load) of 0.2-30 g/10 min, and a melting point of 60-110° C. 1. An adhesive sheet for back grinding of a semiconductor wafer having convex portions , comprising a non-adhesive cushion layer and an adhesive layer provided on the cushion layer ,wherein the adhesive layer comprises an opening with a diameter smaller than a diameter of the semiconductor wafer,the adhesive layer is configured to be attached to an outer periphery of the semiconductor wafer so that the convex portions of the semiconductor wafer are placed in the opening, whereby the convex portions are protected by the cushion layer in a state where the semiconductor wafer is attached to the adhesive layer, and (1) tensile stress of the cushion layer punched out by using a dumbbell according to JISZ1702 is 2 to 30N/10 mm when the ...

SYSTEMS FOR INDUCING AND INDICATING DEACTIVATION OF ADHESIVE DRAPES

Provided herein are systems and methods for controlling, inducing, and indicating adhesive deactivation of adhesive drape systems. One aspect provides a system comprising a drape, a photosensitive adhesive layer, and a release agent, where the system is adapted to be coupled to a tissue site and released therefrom after exposure to an external stimulus, such as light. The system may have one or more photosensitive pigment areas that provide a visual indication based on exposure to the light. Another aspect provides a method for controlling the adhesion of a drape by application of a low-tack substance to one or more areas of a drape adhesive. The low-tack substance may be configured to produce a visual indication to distinguish areas where the low-tack substance has been applied. Such systems and methods enable a user to control properties of the drape adhesive and determine the various adhesive states via a visual indication. 1. A light deactivated adhesive drape system configured to be coupled to tissue , the system comprising: a photosensitive adhesive layer having at least one release agent, wherein the at least one release agent is configured to weaken a bond of the adhesive layer to the tissue upon exposure to at least one of a plurality of light wavelengths; and', 'a photosensitive pigment layer having at least one photo initiator, wherein the at least one photo initiator is configured to change a color of the photosensitive pigment layer upon exposure to the at least one of the plurality of light wavelengths., 'a drape having an acrylic and/or polyurethane film, the film comprising2. The system of claim 1 , wherein the photosensitive pigment layer includes at least one of a dye and an ink claim 1 , and wherein the at least one release agent claim 1 , the at least one photo initiator claim 1 , or both are disposed within the photosensitive pigment layer.3. The system of claim 1 , wherein the at least one photo initiator is configured to change from a first ...

Anisotropic conductive adhesive

Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles solder particles and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

PRESSURE-SENSITIVE ADHESIVE SHEET AND USE THEREOF

Provided is a PSA sheet having a PSA layer. The PSA layer has a multilayer structure comprising a layer A forming one face of the PSA layer and a layer B placed on the backside of the layer A. The layer B is a photo-crosslinkable PSA layer comprising a photo-crosslinkable polymer. 1. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer , whereinthe pressure-sensitive adhesive layer has a multilayer structure comprising a layer A forming one face of the pressure-sensitive adhesive layer and a layer B placed on the backside of the layer A, andthe layer B is a photo-crosslinkable pressure-sensitive adhesive layer comprising a photo-crosslinkable polymer.2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the layer B comprises claim 1 , as the photo-crosslinkable polymer claim 1 , a polymer (PB) having side-chain benzophenone structures.3. The pressure-sensitive adhesive sheet according to claim 1 , wherein the layer B comprises claim 1 , as the photo-crosslinkable polymer claim 1 , a polymer (PD) having carbon-carbon double bonds.4. The pressure-sensitive adhesive sheet according to claim 1 , wherein the layer B comprises 40 μmol/g or less of a polyfunctional monomer having two or more ethylenically unsaturated groups.5. The pressure-sensitive adhesive sheet according to claim 1 , wherein the layer A comprises a hydrophilicity enhancer.6. The pressure-sensitive adhesive sheet according to claim 1 , having a 40% or higher reduction rate of water-peel force claim 1 , determined from peel strength N0 and N2 by the next equation:{'br': None, 'i': N', 'N, 'Reduction rate of water-peel force (%)=(1−(2/0))×100'}wherein the peel strength N0 and N2 are determined by the following procedures:[procedure for measuring peel strength N0]the layer A side of the pressure-sensitive adhesive sheet is press-bonded to a corona-treated polarizing plate with a 2 kg rubber roller moved back and forth once;subsequently, the resultant is autoclaved ...

Method of peeling electronic member and laminate

Provided is a method of peeling an electronic member from a laminate composed of the electronic member adhered to a supporting substrate via an adhesive film having a self-peeling adhesive layer in a defined location and having an exposed region A. The method includes the steps of: reducing adhesive strength between the supporting substrate and the self-peeling adhesive layer in the region A by applying energy on the region A; removing the supporting substrate from the laminate by further applying energy on the region and thus further reducing the adhesive strength reduced in the prior step between the supporting substrate and the self-peeling adhesive layer from a starting point of the interface between the supporting substrate and the self-peeling adhesive layer; and peeling the electronic member from the laminate by removing the adhesive film from the electronic member.

Floor covering with universal backing and methods of making and recycling

A dimensionally stable universal floor covering includes a tufted textile having stitches and a reinforcement layer operatively connected to the stitches to provide dimensional stability for the entire floor covering. The reinforcement layer is made of fibers and adhesive that are formed into a reinforcement layer of laminated fibers that is operatively connected to the stitches and/or the fibers and adhesive are formed into a layer of fibers and adhesive that is contained within the stitches. The fibers and adhesive are mixed and then moved by an applicator toward the stitches. A curved slip path is formed on a curved portion of the applicator to improve the movement of the fibers and adhesive toward the stitches. A removable tip portion on the end of the curved portion of the applicator improves the penetration of the adhesive and provides compression of the fibers towards the ends of the stitches. A releasable adhesive cover system is provided to cover the layer of fibers for providing additional strength and stability and for providing a releasable attachment of the universal floor covering to a supporting surface.

SHAPING-STAGE ADHESIVE SHEET AND LAMINATION SHAPING DEVICE

A pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having an adhesive strength reducible by an adhesive strength-reducing action. For example, the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer (), and the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer (). This pressure-sensitive adhesive sheet for build stage use is suitable for allowing an object to be formed over a build stage of an additive manufacturing apparatus to be attached to the build stage during building up, and to be readily detached from the build stage after building up. An additive manufacturing apparatus can employ the pressure-sensitive adhesive sheet for build stage use and includes a build stage, and adhesive strength-reducing means for performing an adhesive strength-reducing action to a pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet for build stage use affixed to the stage. 1. A pressure-sensitive adhesive sheet for build stage use comprisinga pressure-sensitive adhesive layer including a pressure-sensitive adhesive and having an adhesive strength capable of being reduced by an adhesive strength-reducing action.2. The pressure-sensitive adhesive sheet for build stage use according to claim 1 ,wherein the pressure-sensitive adhesive layer is a thermally releasable pressure-sensitive adhesive layer, andwherein the adhesive strength-reducing action is heating of the pressure-sensitive adhesive layer.3. The pressure-sensitive adhesive sheet for build stage use according to claim 2 ,wherein the thermally releasable pressure-sensitive adhesive layer comprises a thermal expansion agent.4. The pressure-sensitive adhesive sheet for build stage use according to claim 3 ,wherein the thermal expansion agent is a thermally expandable microsphere comprising:a component that gasifies by heating; anda shell that includes the component and is capable of undergoing at ...

CONFORMABLE, STRETCH RELEASEABLE ADHESIVE ARTICLES

The present disclosure generally relates to conformable stretch release adhesive and/or stretch-releasable, adhesive articles that are capable of attaching or adhering to a substrate and that can be removed from the substrate without causing damage to the substrate. The present disclosure also generally relates to methods of making and using such adhesive articles 1. A stretch releasable adhesive article , comprising:a multilayer carrier including a first major surface and a second major surface, the multilayer carrier including a core layer and a polymeric layer, and wherein the adhesive article and/or core layer has a compression stress relaxation between about 10% and about 100% after 10 seconds as measured by texture analysis;a stretch releasable adhesive directly adjacent to at least a portion of the first major surface of the multilayer carrier.2. The stretch releasable adhesive article of claim 1 , wherein the adhesive article and/or the core layer has a compression stress relaxation between 20% and about 80% after 10 seconds as measured by texture analysis.3. The stretch releasable adhesive article of claim 1 , wherein the multilayer carrier includes a core layer and one or more polymeric film layers adjacent to the core layer.4. The stretch releasable adhesive article of claim 1 , wherein the multilayer carrier includes a core layer claim 1 , and the core layer is a pressure sensitive adhesive.5. The stretch releasable adhesive article of claim 1 , wherein the multilayer carrier includes a core layer claim 1 , and the core layer includes at least one of polymers of one or more monomers containing one or more (meth)acryloyl groups; vinylaromatic or olefinic block copolymers; vinylaromatic or olefinic block copolymers; silicone elastomers; monomers containing one or more (meth)acryloyl groups and vinylaromatic or olefinic block copolymers; gradient or random vinylaromatic or olefinic copolymers; vinylaromatic or olefinic or (meth)acrylic polymers or ...

METHOD FOR SEPARATING ADHESIVES

The present invention relates to a method in which an adhesive bond is brought into contact with a supercritical fluid, characterized in that the adhesive bond is based on one or more adhesives comprising crosslinked polymers, where the crosslinked polymers have at least one oxygen atom in the polymer chain and have been crosslinked via urethane bridges or —O—CH—CH(OH)—CH—O— bridges or molecular chains having corresponding bridges, and in that after bringing the adhesive bond into contact with the supercritical fluid, at least one of the parameters pressure, volume, amount of substance or temperature is changed such that the fluid transitions from the supercritical state into a different state, and also to the use of this method as at least a substep in a method for separating adhesive bonds of components. 1. A method in which an adhesive bond is brought into contact with a supercritical fluid , wherein the adhesive bond is based on one or more adhesives comprising crosslinked polymers , where the crosslinked polymers have at least one oxygen atom in the polymer chain , and the crosslinked polymers have been crosslinked via urethane bridges or —O—CH—CH(OH)—CH—O— bridges or molecular chains having corresponding bridges , and in that after bringing the adhesive bond into contact with the supercritical fluid , at least one of the parameters pressure , volume , amount of substance or temperature is changed such that the fluid transitions from the supercritical state into a different state.2. The method according to claim 1 , wherein the supercritical fluid is supercritical carbon dioxide.3. The method according to claim 1 , wherein the crosslinked polymers are based on polyether polyols and/or polyester polyols.4. The method according to claim 1 , wherein the crosslinked polymers have been crosslinked via urethane bridges or molecular chains having corresponding bridges and not via —O—CH—CH(OH)—CH—O— bridges or molecular chains having corresponding bridges.5. The method ...

Method for bonding a cover material to a shaped article

Method for bonding a sheetlike cover material to a shaped article, using an adhesive film comprising at least one layer of a heat-activatedly bondable adhesive, where the adhesive film is disposed, over the full area or a partial area, between the cover material and the shaped article, the heat-activatedly bondable adhesive as yet not adhering to the shaped article, wherein the cover material is pulled onto the shaped article under tension, so that the layer of the heat-activatedly bondable adhesive contacts the shaped article, and the activation of the heat-activatedly bondable adhesive is brought about by means of the pressure resulting exclusively from the tension, and optionally of heat introduced by means of external energy supply, whereby the heat-activatedly bondable adhesive adheres to the shaped article and a durable connection of the cover material to the shaped article is produced.

Pressure-Sensitive Adhesive Sheet and Method for Peeling Pressure-Sensitive Adhesive Sheet

Provided is a PSA sheet having a PSA layer. The PSA layer includes a layer A forming at least one surface thereof. The PSA sheet has an adhesive strength N0 of 2.0 N/10 mm or greater, after one day at room temperature following application of the layer A side to a surface of an alkaline float glass plate as an adherend having a contact angle of 5°-10° with distilled water; has an N1 to N0 reduction rate of 30% or lower, wherein N1 is a water-resistant adhesive strength measured after stored at room temperature for one day, immersed in water for 30 minutes, taken out from the water and then residual water is wiped off; and has an N2 to N0 reduction rate of 40% or higher, wherein N2 is a water-peel strength measured after stored at room temperature for one day, 20 μL distilled water is dropped onto the adherend and is allowed to enter a PSA layer/adherend interfacial edge. N2 is measured at a tensile speed of 300 mm/min at a peel angle of 180°. 1. A pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer , whereinthe pressure-sensitive adhesive layer comprises a layer A forming at least one surface of the pressure-sensitive adhesive layer; and an adhesive strength N0 of 2.0 N/10 mm or greater, after one day at room temperature following application of the layer A side to a surface of an alkaline glass plate as an adherend fabricated by a float method, the surface of the glass plate has a contact angle of 5° to 10° with distilled water;', 'a water-resistant adhesive strength reduction rate of 30% or lower, determined by the next formula (1−(N1/N0))×100 based on its water-resistant adhesive strength N1 (N/10 mm) and the adhesive strength N0 (N/10 mm), wherein N1 is measured after the layer A side is applied to a surface of an alkaline glass plate as an adherend fabricated by a float method with the surface of the glass plate having a contact angle of 5° to 10° with distilled water, and the resultant is stored at room temperature for one day, ...

Laser-debondable composition, laminate thereof, and laser-debonding method

A laser-debondable composition includes an acrylic resin, a light-shielding material, an additive, and a solvent. Wherein, the acrylic resin includes at least one nitrogen-containing organic group selected from a group consisting of tertiary amino groups and secondary amino groups, an organic group having a cyclic ether group, and an organic group having a hydroxyl group, and the additive includes at least one adhesion promoter. The laser-debondable composition has excellent adhesion ability to a substrate, attachability, and solvent resistance.

Method for Peeling Pressure-Sensitive Adhesive Sheet

Provided is a method for peeling a PSA sheet adhered on a polarizing plate. The PSA sheet has a PSA layer. The PSA layer includes a layer A forming at least one surface of the PSA layer. Of the polarizing plate, the surface to which the PSA sheet is adhered is corona-treated or plasma-treated. The peeling method includes a water-peel step in which the PSA sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the PSA sheet at the front line of peeling the PSA sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line. 1. A method for peeling a pressure-sensitive adhesive sheet adhered on a polarizing plate , whereinthe pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer includes a layer A forming at least the polarizing plate side surface of the pressure-sensitive adhesive layer;of the polarizing plate, the surface to which the pressure-sensitive adhesive sheet is adhered is corona-treated or plasma-treated; andthe peeling method includes a water-peel step in which the pressure-sensitive adhesive sheet is peeled from the polarizing plate, in a state where an aqueous liquid exits at the interface between the polarizing plate and the pressure-sensitive adhesive sheet at the front line of peeling the pressure-sensitive adhesive sheet from the polarizing plate, with the aqueous liquid allowed to further enter the interface following the movement of the peel front line.2. The pressure-sensitive adhesive sheet peeling method according to claim 1 , wherein the peel front line is allowed to move at a speed of at least 10 mm/min in the water-peel step.3. The pressure-sensitive adhesive sheet peeling method according to claim 1 , wherein the layer A comprises a hydrophilicity enhancer.4. The pressure-sensitive adhesive sheet peeling method according to ...

Recycling compatible psa label

The invention relates to a label which is attachable to object surfaces and to a manufacturing method thereof, the label comprising a pressure sensitive adhesive layer having a coat weight equal to or higher than 10 g/m 2 and wherein the adhesive layer has a composition which is free of alkylphenol ethoxylate and has been selected to comprise emulsion polymerized, water-dispersible acrylate polymer and non-ionic copolymer based on polyethylene glycol and polypropylene glycol such that when the adhesive layer is subjected to paper recycling process conditions, the adhesive layer resists disintegration into small fragments.

Bundling of containers

The present invention relates to a container pack comprising a first group of containers and a second group of containers, wherein the first group of containers and the second group of containers each comprise at least one individual container, and wherein each individual container of the first group of containers and second group of containers, is bonded by means of at least one spot of hot melt adhesive to opposing sides of a substrate located between the first group of containers and the second group of containers, wherein the substrate is perforated such that each spot of hot melt adhesive on the substrate is enclosed by a perforation line.

Polymer compound peeling agent, adhesive material, and method of using adhesive materials

The present invention provides a polymer compound peeling agent usable for peeling as many types of polymer compounds as possible and capable of reducing a burden required for a peeling treatment when a polymer compound having adhered to an adhesion object is peeled. The polymer compound peeling agent for peeling a polymer compound having adhered to an adhesion object contains a photoresponsive liquid crystal material having a phase structure reversibly transitioning between an isotropic phase and a liquid crystal phase due to photoisomerization based on irradiation lights of different wavelengths. When the polymer compound is adhered to the adhesion object, the photoresponsive liquid crystal material is contained in the polymer compound with the phase structure set to the isotropic phase, and the phase structure of the photoresponsive liquid crystal material is allowed to transition from the isotropic phase to the liquid crystal phase by photoisomerization based on the light irradiation.

Hot melt adhesive compositions containing propylene copolymers and methods for using the same

A hot melt adhesive composition, which may be used as a construction adhesive in hygiene articles, comprises a first polymer comprising a unimodal copolymer of propylene and ethylene and having a weight average molecular weight of between about 5,000 and 60,000 daltons; a second polymer comprising a copolymer of propylene and ethylene and having a weight average molecular weight of at least 100,000 daltons; a tackifying resin having a Ring & Ball softening point of at most 115° C.; and a plasticizer. The composition demonstrates good peel strength and good shear resistance and is sprayable, with a sufficiently low viscosity, at low application temperatures, such as at about 121° C.

ADHESIVE COMPOSITION, ADHESIVE SHEET, AND ADHERED BODY

The present invention relates to an adhesive composition containing at least a polymer and an ionic liquid, in which when an adhesive layer is formed of a composition composed of components other than the ionic liquid among components contained in the adhesive composition, the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz, after being left to stand in an environment of 22° C. and 20% RH for 3 days. 1. An adhesive composition comprising:a polymer; andan ionic liquid, whereinwhen an adhesive layer is formed of a composition composed of components other than the ionic liquid among components contained in the adhesive composition, the adhesive layer has a relative permittivity of 5 or more at a frequency of 100 Hz after being left to stand in an environment of 22° C. and 20% RH for 3 days.2. An adhesive composition comprising:a polymer; andan ionic liquid, wherein{'sup': '2', 'when an adhesive layer is formed of the adhesive composition, the adhesive layer has a capacitance per unit area of an interface between the adhesive layer and the aluminum plate of 0.9 μF/cmor more, and has an ionic conductivity of 10 μS/m or more after being adhered to an aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in an environment of 22° C. and 15% RH for 7 days.'}3. The adhesive composition according to claim 2 , wherein{'sup': '2', 'when the adhesive layer is formed of the adhesive composition, the adhesive layer has a capacitance per unit area of the interface between the adhesive layer and the aluminum plate of 1.2 μF/cmor more, and an ionic conductivity of 20 μS/m or more after being adhered to the aluminum plate made of A5052P H32 in JIS H4000:2014 and left to stand in the environment of 22° C. and 15% RH for 7 days.'}4. The adhesive composition according to claim 1 , further comprising:an ionic solid.5. The adhesive composition according to claim 1 , whereinthe polymer includes an ionic polymer.6. The adhesive composition ...

Reversible Networks in Polymeric Materials

A polymeric material comprising from about 5% to about 60% of a Diels-Alder additive, wherein the additive crosslinks at a temperature below 100° C., an adhesive or sealant component, wherein the viscosity of the adhesive or sealant is reduced by at least about 5%, at least about 30%, at least about 80%, or even at least about 100% when combined with the Diels-Alder additive.

Laser-releasable bonding materials for 3-d ic applications

Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

Hardware assembly with reversible dry adhesive

A hardware assembly is provided with a rigid hardware component. A flexible substrate is mounted to the rigid hardware component. A reversible dry adhesive is spread across an application surface of the flexible substrate to mount the hardware assembly to a support surface. The flexible substrate permits compliance between the reversible dry adhesive and the rigid hardware component to minimize nonconformance of the reversible dry adhesive upon the support surface. A method of installing the hardware assembly provides a flexible substrate with a rigid hardware component upon one side of the flexible substrate, and a reversible dry adhesive upon another side of the flexible substrate. The rigid hardware component is pressed towards a support surface to engage the reversible dry adhesive with the support surface while deforming the flexible substrate to minimize nonconformance of the reversible dry adhesive and the support surface.

Heat-Resistant Weld Backing Tape For Double-Sided Welding Of Grooved Joint Preparations

A weld backing tape for double-sided arc welding of double-groove joint preparations. The weld backing tape includes a flexible tape substrate supporting a centrally-disposed heat-resistant material flanked by adhesive material on each side. The weld backing tape is bendable into a folded shape, the heat-resistant material being on the convex side of the fold for seating in a back-side groove of the weld preparation, with an apex of the heat-resistant material substantially packing an apex of the back-side groove to block weld pool material introduced into a front-side groove of the weld preparation. The back-side groove is defined by a pair of side walls extending from the groove apex to a rear surface of the workpiece. The heat-resistant material has a maximum width selected to leave part of each side wall exposed for engagement by the adhesive material to retain the heat-resistant material in position in the back-side groove during welding.

Composition for Removing Polymer

Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound. 1. A composition for removing a polymer , the composition comprising: a fluorinated alkyl compound; a polar aprotic solvent; and an amine compound , wherein the amine compound includes an acyclic secondary amine compound or an acyclic tertiary amine compound.4. The composition according to claim 1 , wherein the polar aprotic solvent includes at least one solvent selected from the group consisting of ketone-based claim 1 , acetate-based claim 1 , amide-based claim 1 , pyridine-based claim 1 , morpholine-based claim 1 , pyrrolidone-based claim 1 , urea-based claim 1 , phosphate-based claim 1 , sulfoxide-based claim 1 , nitrile-based claim 1 , carbonate-based claim 1 , oxazolidone-based claim 1 , and piperazine-based solvents.5. The composition according to claim 1 , wherein the amine compound includes at least one compound selected from the group consisting of tripropylamine claim 1 , tributylamine claim 1 , tripentylamine claim 1 , triisobutylamine claim 1 , dimethyloctylamine claim 1 , diethylbutylamine claim 1 , diisobutylamine claim 1 , N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetramethyl-1 claim 1 ,3-diaminopropane claim 1 , N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetramethyl-1 claim 1 ,4-diaminobutane claim 1 , and N claim 1 ,N claim 1 ,N′ claim 1 ,N′-tetramethyl-1 claim 1 ,6-diaminohexane.6. The composition according to claim 1 , wherein the amine compound has a boiling point in a range of 140° C. to 300° C.7. The composition according to claim 1 , wherein the composition is used to remove silicone-based polymers.8. The composition according to claim 1 , wherein the composition contains 0.1 to 20% by weight of the fluorinated alkyl compound claim 1 , 60 to 99.89% by weight of the polar aprotic solvent claim 1 , and 0.01 to 20% by weight of the amine compound claim 1 , with respect to the ...

ADHESIVE EXAMINATION MARKER

An adhesive examination marker includes a base film having a front surface and a rear surface facing away from the front surface, a pressure-sensitive adhesive layer disposed on the rear surface of the base film, and a support attached to the front surface of the base film and having a shape along at least a part of a periphery of the base film as viewed perpendicular to the front surface of the base film, the support including a band-like portion that connects two points on the periphery of the base film which face each other across a central portion of the base film. 1. An adhesive examination marker , comprising:a base film having a front surface and a rear surface facing away from the front surface;a pressure-sensitive adhesive layer disposed on the rear surface of the base film; anda support attached to the front surface of the base film and having a shape along at least a part of a periphery of the base film as viewed perpendicular to the front surface of the base film, the support including a band-like portion that connects a first point and a second point on the periphery of the base film, the first and second points facing each other across a central portion of the base film.2. The adhesive examination marker of claim 1 , wherein the support has one of a polygonal shape entirely surrounding the central portion of the base film claim 1 , a polygonal line shape surrounding the central portion except at a part of the periphery of the base film claim 1 , a circular shape entirely surrounding the central portion claim 1 , and an arc shape surrounding the central portion except at a part of the periphery of the base film.3. The adhesive examination marker of claim 1 , wherein the support includes a weakened portion that is more easily broken than portions of the support other than the weakened portion.4. The adhesive examination marker of claim 3 , wherein the weakened portion is comprised of perforations.5. The adhesive examination marker of claim 3 , whereinthe ...

Double-sided adhesive sheet, joined body comprising double-sided adhesive sheet, and method for joining/separating adherends

A double-sided adhesive sheet has a laminate structure including a first adhesive layer containing an electrolyte, a second adhesive layer, and a conduction substrate. A double-sided adhesive sheet joined body includes, for example, an adhesive sheet having such a laminate structure, a first conductive adherend to which the first adhesive layer adheres, and a second adherend to which the second adhesive layer adheres. A method for joining/separating adherends includes joining first and second adherends to each other via the adhesive sheet, then applying a voltage to the first adhesive layer so as to generate a potential difference in a thickness direction of the first adhesive layer, and separating the first and second adherends from each other.

Semiconductor processing sheet

The semiconductor processing sheet of the present invention is a semiconductor processing sheet including a base material and a pressure sensitive adhesive layer provided on one surface of the base material, wherein the pressure sensitive adhesive layer contains an acrylic polymer (A) having a molecular weight distribution of 3.0 or less and an acrylic polymer (B) having a molecular weight distribution of more than 3.0; and a gel fraction of the pressure sensitive adhesive layer is 50 to 70%, and a number average molecular weight of a sol content thereof is 60,000 or more.

Surface covering system and method and apparatus for covering a surface

A surface covering system, a method of covering a surface, and an apparatus for covering a surface. The surface may be a floor, a wall, or a ceiling. In one embodiment, the surface covering system includes a plurality of panels and an adhesive tape that is configured to detachably couple the panels to the surface. The adhesive tape may include a substrate-side adhesive component, a panel-side adhesive component, and a release component between the substrate-side and panel-side adhesive components. The panels may be detachably coupled to the substrate by the adhesive tape such that at least one adhesive layer of the substrate-side adhesive component is adhered to the substrate, at least one adhesive layer of the panel-side adhesive component is adhered to the rear surfaces of the panels, and the release component is between the substrate-side adhesive component and the panel-side adhesive component.

1K High Temperature Debondable Adhesive

The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UVNis/LED or thermal or combined and is cured faster requiring lower energy. The present disclosure also provides assemblies including such an adhesive and methods of using the adhesives.

Processing of thin films using ultraviolet or thermal release tape as carrier

A method for processing a thin film layer, for example to form an ink jet printhead, can include the use of an adhesive layer that can be converted from a first state having a first adhesive force to a second state having a second adhesive force, where the first state is stronger than the second state. Conversion from the first state to the second state can be performed using a suitable treatment. In an embodiment, the adhesive layer may be a thermal release material that is converted during a heat treatment. In another embodiment, the adhesive layer may be a layer that is sensitive to ultraviolet (UV) light, and is converted during exposure to UV light emitted by a UV light source.

Thin gel gasket and a method of making and using the same

A thin, cured gel gasket is disclosed, including methods of making the thin gel gasket and the use of the thin gel gasket in an aircraft joint. In one embodiment, the thin gel gasket has no skeleton or other structure and is comprised of only a cured polyurethane gel and has a thickness of less than about 12 mill. It is manufactured using a release film that is adapted in a number of ways to make release from the gel prior to use easier. In one method of making and using the thin gel gasket. it is applied to a joint which is subject to compression, in one embodiment, a lap joint of an aircraft fuselage.

Object with Selectable Adhesion

A surface with selectable adhesion is achieved by a shape memory alloy that is at least partly coated with a polymer forming a surface structure, thus allowing the adhesion force of the surface to be controlled.

Process for manufacturing vehicle headliners

Manufacturing process for vehicle headliners comprising a substrate and at least one decorative lining extending along one of the faces of said substrate, joined to each other through a layer of adhesive, which specifically comprises the union of the decorative lining to the previously shaped substrate using a thermosetting adhesive with a high viscosity.

ANISOTROPIC CONDUCTIVE FILM AND FABRICATING METHOD THEREOF

The anisotropic conductive film of the present invention includes a resin base tape and a plurality of composite fibers disposed laterally in the resin base tape, wherein each of the composite fibers includes an electrically insulating fiber and a plurality of conductive rings circling the electrically insulating fiber, the conductive rings including a plurality of conductive particles collectively surrounding the electrically insulating fiber by adsorption, wherein the plurality of composite fibers are periodically arranged in the resin base tape along the extending direction of the resin base tape, and the plurality of conductive rings on each of the composite fibers are periodically arranged along the axial direction of the electrically insulating fiber thereof. 1. An anisotropic conductive film , comprising a resin base tape and a plurality of composite fibers disposed laterally in the resin base tape periodically along an extending direction of the resin base tape ,wherein each of the composite fibers comprises an electrically insulating fiber and a plurality of conductive rings circling the electrically insulating fiber and arranged along an axial direction of the electrically insulating fiber, andthe conductive rings comprise a plurality of conductive particles collectively surrounding the electrically insulating fiber by adsorption.2. The anisotropic conductive film according to claim 1 , further comprising a separation layer disposed on upper and lower surfaces of the resin base tape claim 1 , wherein the separation layer has a thickness of 2-3 μm.3. The anisotropic conductive film according to claim 1 , wherein each of the conductive particles has a shape of a sphere claim 1 , a cuboid or a cone having an equivalent particle diameter of 5 to 100 nm.4. The anisotropic conductive film according to claim 1 , wherein the electrically insulating fiber has a length of 10-5000 μm.5. The anisotropic conductive film according to claim 1 , wherein each of the ...

LIGHT-RESPONSIVE PRESSURE SENSITIVE ADHESIVES FOR WOUND DRESSINGS

Disclosed are photo-responsive pressure sensitive adhesives, wound dressings that contain the photo-responsive pressure sensitive adhesives, and methods to remove the wound dressing. The photo-responsive pressure sensitive adhesive comprises a viscoelastic polymeric matrix. The viscoelastic polymeric matrix comprises a polymer that includes at least a first polymeric segment and at least a second polymeric segment that are each covalently linked together through a photo-cleavable moiety. The photo-cleavable moiety is capable of photolytic cleavage of the covalent bonds formed between the moiety and the first and/or second polymeric segments, respectively, in response to electromagnetic radiation. 1. A photo-responsive pressure sensitive adhesive comprising:a viscoelastic polymeric matrix of a polymer that includes at least a first polymeric segment and at least a second polymeric segment that are each covalently linked together through a photo-cleavable moiety.2. The photo-responsive pressure sensitive adhesive of claim 1 , wherein the photo-cleavable moiety is capable of photolytic cleavage of the covalent bonds formed between the moiety and the first and/or second polymer segments claim 1 , respectively claim 1 , in response to electromagnetic radiation having a wavelength of 300 nm to 500 nm.3. The photo-responsive pressure sensitive adhesive of claim 2 , wherein the wavelength is 300 nm to 400 nm claim 2 , or preferably about 365 nm.4. The photo-responsive pressure sensitive adhesive of any one of claim 1 , wherein photo-cleavable moiety is a substituted aromatic nitro compound.7. The photo-responsive adhesive of claim 5 , wherein the photolytic cleavage breaks the R—O bond and/or the R—O bond.8. The photo-responsive pressure sensitive adhesive of claim 1 , wherein the first polymeric segment and the second polymeric segment each individually have a molecular weight of 10 claim 1 ,000 g/mol to 1 claim 1 ,000 claim 1 ,000 g/mol.9. The photo-responsive pressure ...

Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device

Provided is: a layered body wherein a sheet surface has slight adhesiveness, enabling easy temporary securing of a semiconductor chip, or the like, that has been diced, onto a semiconductor substrate, and wherein permanent adhesion to an adhered object is expressed through post-curing; a layered body that includes the same; a semiconductor device that uses the same; and a method for manufacturing the semiconductor device. A silicone-based adhesive sheet is disclosed herein, wherein, prior to heating, the delamination mode of the adhesive surface from a non-adhesive substrate is interfacial delamination, and after heating of the adhesive surface in a range of between 50 and 200° C., the delamination mode of the adhesive surface from another non-adhesive substrate changes to cohesive fracturing, and exhibits permanent adhesion.

Reusable attaching apparatus and methods of making and using a reusable attaching apparatus

A reusable attaching apparatus includes (a) a reversible adhesive comprising a shape memory polymer and (b) a mounting structure bonded to the reversible adhesive. The shape memory polymer has a glass transition temperature (T g ) and comprises a deformable state at temperatures above the T g and a rigid state at temperatures below the T g .

Thermally releasable adhesive member and display apparatus including the same

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

Clamping apparatus for cleaving a bonded wafer structure and methods for cleaving

Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.

Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheet

As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.

Thermally releasable adhesive member and display apparatus including the same

A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.

Method for improving the operability of an olefin polymerization reactor

Feeding a supported antistatic compound that does not comprise a transition-metal-based catalyst component to an olefin polymerization reactor allows avoiding the formation of polymer agglomerates in the reactor while at the same time minimizing negative effects on catalyst yield.

Method for improving the operability of an olefin polymerization reactor

The present technology relates to a method of introducing a supported antistatic compound that does not comprise a transition-metal-based catalyst component for use in an olefin polymerization reactor. In some embodiments, the methods disclosed herein avoid the formation of polymer agglomerates in the reactor and minimize potentially negative effects on catalyst yield.

Method for detachable gluing for porous materials

The invention relates to a method for detachably gluing at least one porous substrate to another material using at least one layer of a detachable adhesive comprising an ungluing admixture adapted for generating gases which, by gas expansion or gas migration towards at least one of the interfaces of the detachable adhesive layer, weakens the adhesive bond when heated by a detaching control, said method comprising, before gluing, applying a metal sealing coating onto at least one of the substrates.

Method for bonding together two substrates, method for disassembling said bonded assembly and primer therefor

The invention concerns a method for assembling a first substrate (10) and a second substrate (12) by bonding with a joint (14). The invention is characterized in that it consists in successively performing the following steps: applying on the first substrate (10) an adhesive primer (18) with controlled disassembling capacity comprising a polymer base and at least one agent for degrading the bonding of said primer with the first substrate or for degrading the primer in the volume; providing a polymer material joint between the first and the second substrate (12); pressing the two substrates (10, 12) against each other; and polymerizing the joint (14) to obtain a bonded assembly of the two substrates (10, 12). The invention also concerns the related primer.

Method of assembling two substrates by means of bonding and method of disassembling said bonded assembly by means of migration

The invention relates to a method of assembling a first substrate (10) and a second substrate (12) by means of bonding with at least one joint (14). The invention is characterised in that it comprises the following successive steps consisting in: positioning at least one polymer joint (14) between the first (10) and second (12) substrates, said at least one joint comprising at least one migrating agent which can migrate to at least one of the interfaces of the at least one joint in order to generate a layer with low cohesion; pressing the two substrates (10, 12) against one another; and polymerising the at least one joint (14) in order to obtain a bonded assembly comprising said two substrates (10, 12).

Process for recycling electronic components

Prozess zum Recyceln elektrischer oder elektronischer Bauteile, gekennzeichnet durch einen Verfahrensschritt, bei welchem eine mittels einer Haftklebemasse bewirkte Verklebung zweier Komponenten des Bauteils gelöst wird, indem sich in der Haftklebemasse befindliche expandierbare Partikel durch Zufuhr von Energie ausdehnen und dabei den Verklebeverbund aufsprengen. Process for recycling electrical or electronic components, characterized by a method step in which an adhesion of two components of the component caused by a pressure-sensitive adhesive is achieved by expanding expandable particles in the pressure-sensitive adhesive by supplying energy and thereby bursting the adhesive bond.

Method for separating adhesive bonded composites

The invention relates to the reversible separation of adhesive bonded composites by applying electromagnetic alternating fields. The adhesive bonded composite comprises at least one primer coating which contains nanoscale sized particles having ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric characteristics. Large amounts of heat are generated locally in the primer coat pertaining to the adhesive bonded composites by applying electromagnetic alternating fields. Such local heat generation in bordering thermoplastic adhesive layers causes a softening of the thermoplastic binding agent. If duroplastic adhesives border on the boundary layer to the then the large amount of local heat generated causes a resplitting of the cross-linked structure of the binding agent matrix. In both cases strong local heating of the boundary layer enables quasi-adhesive substrate separation at low energy inputs.

Detachable adhesive compounds

This invention relates to adhesive compositions of which the binder system contains nanoscale particles with ferromagnetic, ferrimagnetic, superparamagnetic or piezoelectric properties. The invention also relates to dissolvable adhesive bonds and to a process for dissolving adhesive bonds.

Composition

RESIN COMPOSITION FOR PROVISIONAL FIXATION, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE AND METHOD FOR PRODUCING ELECTRONIC DEVICE

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

Acrylic Emulsion Pressure-Sensitive Adhesive Composition

An acrylic emulsion pressure-sensitive adhesive composition is provided. More particularly, an acrylic emulsion pressure-sensitive adhesive composition that may become easily removable when being impregnated with water in a water-borne removal process while being able to realize excellent tacky/adhesive strength for a substrate to be adhered is provided. 2. The acrylic emulsion pressure-sensitive adhesive composition of claim 1 , wherein the alkyl (meth)acrylate-based monomer includes one or more selected from the group consisting of methyl (meth)acrylate claim 1 , ethyl (meth)acrylate claim 1 , propyl (meth)acrylate claim 1 , isopropyl (meth)acrylate claim 1 , butyl (meth)acrylate claim 1 , isobutyl (meth)acrylate claim 1 , t-butyl (meth)acrylate claim 1 , pentyl (meth)acrylate claim 1 , hexyl (meth)acrylate claim 1 , heptyl (meth)acrylate claim 1 , octyl (meth)acrylate claim 1 , isooctyl (meth)acrylate claim 1 , 2-ethylhexyl (meth)acrylate claim 1 , decyl (meth)acrylate claim 1 , isodecyl (meth)acrylate claim 1 , dodecyl (meth)acrylate claim 1 , isobornyl (meth)acrylate claim 1 , and lauryl (meth)acrylate.3. The acrylic emulsion pressure-sensitive adhesive composition of claim 1 , wherein the unsaturated carboxylic acid-based monomer includes one or more selected from the group consisting of acrylic acid claim 1 , methacrylic acid claim 1 , fumaric acid claim 1 , maleic acid claim 1 , itaconic acid claim 1 , citraconic acid claim 1 , mesaconic acid claim 1 , glutaconic acid claim 1 , and allylmalonic acid.4. The acrylic emulsion pressure-sensitive adhesive composition of claim 1 , wherein the acrylic emulsion pressure-sensitive adhesive composition includes 0.1 parts by weight to 10 parts by weight of the second repeating unit with respect to 100 parts by weight of the first repeating unit.5. The acrylic emulsion pressure-sensitive adhesive composition of claim 1 , wherein the acrylic emulsion pressure-sensitive adhesive composition includes 1 part by weight to 30 ...

ADHESIVE SHEET

Provided is a pressure-sensitive adhesive sheet capable of allowing a small electronic part (e.g., a chip having a size of 50 μm/□ or less) to be temporarily fixed in a satisfactory manner and satisfactorily peeled. The pressure-sensitive adhesive sheet of the present invention includes a gas-generating layer configured to generate a gas by being irradiated with laser light, wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1): 1. A pressure-sensitive adhesive sheet , comprising a gas-generating layer configured to generate a gas by being irradiated with laser light , wherein a modulus of elasticity Er(gas) [unit: MPa] of the gas-generating layer measured by a nanoindentation method and a thickness h(gas) [unit: μm] thereof satisfy the following expression (1).{'br': None, 'i': Er', 'h, 'sup': 6', '−0.116, 'Log((gas)×10)≥8.01×(gas)\u2003\u2003(1)'}2. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive sheet has a transmittance of from 0% to 40% for light having a wavelength of 360 nm.3. The pressure-sensitive adhesive sheet according to claim 1 , wherein the pressure-sensitive adhesive sheet has a transmittance of from 10% to 100% for light having a wavelength of 380 nm.4. The pressure-sensitive adhesive sheet according to claim 1 ,wherein the gas-generating layer contains a UV absorber, andwherein the UV absorber has a maximum absorption wavelength of 360 nm or less.5. The pressure-sensitive adhesive sheet according to claim 1 , wherein the gas-generating layer is a cured product of an active energy ray-curable composition.6. The pressure-sensitive adhesive sheet according to claim 1 , wherein the gas-generating layer contains an acrylic polymer.7. The pressure-sensitive adhesive sheet according to claim 1 , further comprising a gas barrier layer on at least one side of the ...

Photosensitive resin composition, method of manufacture thereof and articles including the same

Provided herein is a photosensitive resin composition which is patternable and exhibits adhesion even after being crosslinked. The photosensitive resin composition includes a (meth)acryl-based polymer having a carboxyl group and a reactive double bond on a side chain and having a specific acid value and a specific content of reactive double bond, and a photopolymerization initiator.

Roofing underlayment using a pressure sensitive adhesive and methods for making and using the same

A roofing underlayment capable of adhering to a roof deck comprising: (a) a roofing membrane having a first and a second major surface; and (b) a pressure-sensitive adhesive disposed on the first major surface of the roofing membrane and comprising: (i) at least one of butyl rubber or polyisobutylene; (ii) a first liquid plasticizer, preferably polybutene; and (iii) a tackifier, wherein the Tg of the adhesive is at most about 100 C. The adhesive provides high bond strength and excellent long-term heat aging, weathering resistance, as well as good low temperature properties while providing a moisture proof seam. A method for making the roofing underlayment includes applying the adhesive to the membrane then applying a release liner over the adhesive layer. A method for using the roofing underlayment comprises removing the release liner then adhering the underlayment to the roof deck by contacting the first to the roof deck.

Semiconductor devices, their manufacturing methods, and laminates

A microwave removable coating

Protective tapes, articles therefrom, and methods of making and using same

An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.

Easy de-glazing reactive hot melt adhesive

High green strength reactive hot melt adhesives that allow for easy deglazing of windows are provided.

Method for improving the operability of an olefin polymerization reactor

粘合带

本发明涉及粘合带，制造其的方法及其用途。更具体地，本发明涉及一种粘合带，其本身可以用来连接两个实体各自的表面和/或将实体连接到基材表面上，同时剥离粘性降低，即如果需要可以容易地去除粘合带。该粘合带包括：可热收缩聚合物层，所述层具有彼此相对的两个表面，在所述两个表面之一上的压敏粘合剂组合物层，所述压敏粘合剂组合物包括无定形聚合物和可热膨胀颗粒和/或至少一种封端异氰酸酯化合物。

Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, polyimide copolymer, polyimide mixed resin, and resin composition

본 발명은, 내열성이 우수하고, 1종류의 접착제층으로 반도체 회로 형성 기판과 지지 기판을 접착하고, 반도체 장치 등의 제조 공정을 통해서도 접착력이 변화되지 않고, 그 후, 실온에서 온화한 조건에서 박리할 수 있는 가부착용 접착제와, 이를 사용한 반도체 장치의 제조 방법을 제공한다. 본 발명은, 적어도 산 2무수물 잔기와 디아민 잔기를 갖고, 디아민 잔기에, (A1) 일반식 (1)로 표시되는 n이 1 이상 15 이하의 자연수인 폴리실록산계 디아민의 잔기 및 (B1) 일반식 (1)로 표시되는 n이 16 이상 100 이하의 자연수인 폴리실록산계 디아민의 잔기의 양쪽을 포함하는 폴리이미드 공중합체이며, (A1)의 잔기를 40 내지 99.99몰% 함유하고 (B1)의 잔기를 0.01 내지 60몰% 함유하는 폴리이미드 공중합체인 것을 특징으로 하는 가부착용 접착제이다. The present invention has excellent heat resistance and adheres a semiconductor circuit forming substrate and a support substrate with one type of adhesive layer, the adhesive strength does not change even through the manufacturing process of a semiconductor device, etc., and then peels off under mild conditions at room temperature. It provides an adhesive for temporary attachment that can be used, and a method for manufacturing a semiconductor device using the same. The present invention has at least an acid dianhydride residue and a diamine residue, and in the diamine residue, (A1) a residue of a polysiloxane-based diamine in which n represented by the general formula (1) is a natural number of 1 or more and 15 or less, and (B1) General formula It is a polyimide copolymer containing both residues of polysiloxane-based diamine in which n represented by (1) is a natural number of 16 or more and 100 or less, 40 to 99.99 mol% of the residues of (A1), and the residues of (B1) It is an adhesive for temporary attachment, characterized in that it is a polyimide copolymer containing 0.01 to 60 mol%.

Method for improving the operability of an olefin polymerization reactor

The present technology relates to a method of introducing a supported antistatic compound that does not comprise a transition-metal-based catalyst component for use in an olefin polymerization reactor. In some embodiments, the methods disclosed herein avoid the formation of polymer agglomerates in the reactor and minimize potentially negative effects on catalyst yield.

用于提高烯烃聚合反应器的可操作性的方法

将不包含过渡金属基催化剂组分的负载型抗静电化合物进料至烯烃聚合反应器中能够避免在反应器中形成聚合物团块，同时还使对催化剂产率的负面影响降至最低。

临时粘接用粘合剂、粘合剂层、晶片加工体及使用其的半导体器件的制造方法

本申请涉及临时粘接用粘合剂、粘合剂层、晶片加工体及使用其的半导体器件的制造方法。本发明提供临时粘接用粘合剂、和使用其的半导体器件的制造方法，所述临时粘接用粘合剂的耐热性优异，能够利用1种粘合剂层将半导体电路形成基板与支承基板粘接，即使经过半导体器件等的制造工序、粘合力也不发生变化，并且之后能于室温以温和的条件进行剥离。本发明为临时粘接用粘合剂，其特征在于，其为下述聚酰亚胺共聚物，所述聚酰亚胺共聚物至少具有酸二酐残基和二胺残基，在二胺残基中包含(A1)以通式(1)表示且n为1以上15以下的自然数的聚硅氧烷系二胺的残基、及(B1)以通式(1)表示且n为16以上100以下的自然数的聚硅氧烷系二胺的残基这两者。

Method for improving the operability of an olefin polymerization reactor

Feeding a supported antistatic compound that does not comprise a transition- metal-based catalyst component to an olefin polymerization reactor allows avoiding the formation of polymer agglomerates in the reactor while at the same time minimizing negative effects on catalyst yield.

用于提高烯烃聚合反应器的可操作性的方法

将不包含过渡金属基催化剂组分的负载型抗静电化合物进料至烯烃聚合反应器中能够避免在反应器中形成聚合物团块，同时还使对催化剂产率的负面影响降至最低。

Method for improving the operability of an olefin polymerization reactor

Feeding a supported antistatic compound that does not comprise a transition- metal-based catalyst component to an olefin polymerization reactor allows avoiding the formation of polymer agglomerates in the reactor while at the same time minimizing negative effects on catalyst yield.

method for improving the operability of an olefin polymerization reactor

alimentar um composto antiestático suportado que não inclua um componente catalisador à base de metal de transição em um reator de polimerização de olefinas permite evitar a formação de aglo-merados de polímero no reator e, ao mesmo tempo, minimizar os efeitos negativos no rendimento do catalisador. Feeding a supported antistatic compound that does not include a transition metal-based catalyst component in an olefin polymerization reactor avoids the formation of polymer agglomerates in the reactor while minimizing negative effects on catalyst performance. .