18-06-2020 дата публикации
Номер: US20200190423A1
Принадлежит:
Disclosed is a cutting oil composition, which is vastly superior in view of layer separation, dispersibility, viscosity, ingot-cleaning time after sawing, and wafer warpage after sawing, compared to conventional cutting oil compositions, and which includes mineral oil that is highly hydrogenated, as represented by Chemical Formulas 1 to 3, bentonite clay as a thickener, and glycerol trioleate as a dispersant. A cutting method using the cutting oil composition is also provided. 1. A cutting oil composition , comprising mineral oil represented by Chemical Formula 1 , Chemical Formula 2 and Chemical Formula 3 below:{'br': None, 'i': n', 'n', 'a, 'R1-(CH2-4)-R2\u2003\u2003[Chemical Formula 1]'}{'br': None, 'i': n', 'n', 'b, 'R3-(CH2-2)-R4\u2003\u2003[Chemical Formula 2]'}{'br': None, 'i': n', 'n', 'c, 'R5-(CH2)-R6\u2003\u2003[Chemical Formula 3]'}wherein n is 5 or 6, and R1, R2, R3, R4, R5 and R6 are each H or OH.2. The cutting oil composition of claim 1 , wherein a is 7 to 20 claim 1 , b is 39 to 52 claim 1 , and c is 39 to 41.3. The cutting oil composition of claim 1 , further comprising a thickener and a dispersant.4. The cutting oil composition of claim 3 , wherein the thickener is bentonite clay and the dispersant is glycerol trioleate.5. The cutting oil composition of claim 4 , comprising 65 to 93 wt % of mineral oil claim 4 , 0.7 to 3 wt % of bentonite claim 4 , and 5 to 35 wt % of glycerol trioleate.6. The cutting oil composition of claim 5 , comprising 70 to 90 wt % of mineral oil claim 5 , 1 to 2 f bentonite claim 5 , and 9 to 29 wt % of glycerol trioleate.7. A cutting method using the cutting oil composition of . The present invention relates to a cutting oil composition for use in a wiresaw cutting process. In particular, the present invention relates to a wiresaw cutting oil composition including a highly hydrogenated hydrocarbon distillate, a thickener and a dispersant.Wiresaw cutting is the main process of slicing ingots to manufacture thin wafers for use ...
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