Verfahren zur Vorbehandlung von Kunststoffsubstraten.

VERFAHREN ZUR VERBESSERUNG DER HAFTFESTIGKEIT VON STROMLOS ABGESCHIEDENEN METALLSCHICHTEN AUF KUNSTSTOFFOBERFLAECHEN.

The bonding of metal layers, deposited without current onto synthetic surfaces, is improved by treating the surface with a non-etching activator compsn. contg. as binder a copolymer of (a) 5-80 wt.% of a monomer contg. CN, (b) 5-40% of (methyl)styrene (opt. ring-substd.) and/or (c) 5-40% of a (meth)acrylic acid ester and/or (d) an unsatd. carboxylic acid or deriv. The substrate may be glass, quartz, ceramic, enamel, paper, polyethylene, polypropylene, epoxy resin, polyester, polycarbonates, polyamide, polyimide, polyhydantoin, ABS, silicone, polyvinyl halides or polyvinylidene fluoride, as plates, films, paper and fleeces. Substrates for printed circuits, e.g. phenol resin paper, epoxide plates, reinforced with glass fibre, polyester or polyimide films, and ceramics are pref. Metallising may be with Ni, Co, Fe, Cu, Ag, Au and/or Pd.

VERFAHREN ZUR VORBEHANDLUNG VON ISOLIERENDEN TRAEGERN VOR DER STROMLOSEN METALLABSCHEIDUNG

Colloidal tin-palladium solution for - chemically plating non-conductors

A palladium salt is dissolved in hydrochloric acid and sufficient stannous salt added with agitation to reduce the salt to palladium metal. Sufficient stannous salt to provide a protective colloid for the palladium is separately dissolved in hydrochloric acid and the two solutions mixed. Preferred ingredients are palladium chloride, which is reduced with stannous chloride, while the protective agent is a mixture of sodium stannate and stannous chloride. The solution may be used in the production of printed circuit boards or of decorated plastics.

Loesungen zum Sensibilisieren beliebiger Oberflaechen und Verfahren zur Herstellung derartiger Loesungen und ihrer Komponenten

INITIATION OF ELECTROLESS NICKLE PLATING

CATALYST

PROCESS FOR THE CHEMICAL METALLIZING OF TEXTILE MATERIAL

Method of applying metallic coatings to solid materials and fuel cells employing such coating materials

Surfaces of porous and non-porous solid bodies generally non-metallic and non-conducting are coated with metal, said surfaces having reactive groups chemically and/or physically bound thereto and capable of forming a deposit of first-metal on said surface on contact with a solution of a metal salt; said first metal forming catalyst metal sites being capable of catalysing the reduction of a second metal salt in the presence of a reducing agent to form a thin continuous metal coating. The reactive groups consist of groups for reversible oxidation-reduction reactions contained in suitable organic compounds adsorbed on the solid surface. The first metal forming the catalyst metal sites is formed by treating the reactive surface with a salt of Ag, Au, Pt or Pd. Groups for reversible oxidation-reduction reactions may be formed chemically thereon, or adsorbed as with dyes and consist of, e.g. benzenoids. Suitable dyes for irreversible adsorption of oxidation-reduction units are the water-soluble ...

Accelerating solution and its use in a process for treating polymeric substrates prior to plating

A process for treating a polymeric plastic substrate to render it receptive to electroless plating including the steps of etching the substate, rinsing and activating the etched substrate with an acidic tin-palladium complex, rinsing and thereafter accelerating the activated substrate employing an improved aqueous accelerating solution containing an aqueous soluble compatible substituted alkyl amine. The improved accelerating solution is stable, easy to control, tolerant to metallic impurities present in the solution, inhibits rack plating and is of versatile use.

Method of forming a metal layer on a substrate

... 1,149,703. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORP. Oct.5, 1967 [Dec.29, 1966], No.45430/67. Heading C7F. Prior to coating a substrate, which may be a plastic coated metal plate, with a metal by e.g. electroless plating, vapour deposition or sputtering, the surface is coated with a solution containing a metal salt and a plastics material, e.g. a polyimide, and the metal salt is reduced. The metal salt may be nickel hexachloropalladate, palladium nitride or palladium trimethylbenzyl ammonium nitride. The salt is reduced by heating in e.g. hydrogen or argon or dipping in sodium hypophosphite. A layer of Ni or Cu may then be electroless plated on the palladium. The coated substrate may be heated. A Ni-Fe or Cu layer may be electro-plated on the electroless layer.

ELECTROLESS METAL PLATING

... 1463803 Photographic processes producing metal images IMPERIAL CHEMICAL INDUSTRIES Ltd 16 Jan 1974 [1 Feb 1973] 5091/73 Heading G2C [Also in Division C7] A metal plated image on a substrate is made by (a) exposing imagewise to sensitizing radiation a substrate bearing a coating of a water soluble quaternized bipyridilium compound dissolved or dispersed in a water permeable film forming matrix, (b) contacting the exposed substrate with an HCL solution of Pd Cl 2 , (c) further contacting the substrate with an aqueous reducing agent solution (formaldehyde excluded) and (d) electroless plating a metal thereon from an aqueous bath. The substrate may be an oriented polyethylene terephthalate film, etched with o-chlorophenol and subbed with PVC-PVA copolymer and gelatine containing HCHO. The quaternary compound may be N, N'-bis(4-cyanophenyl)-4, 4'-bipyridilium dichloride or N, N'-dimethyl-4, 4'-bipyridilium dimethosulphate, both of which are sensitive to UV. The matrix may be PVA containing glyoxal ...

VERFAHREN ZUR HERSTELLUNG VON METALLISIERTEN KUNSTSTOFFEN SOWIE ZUR METALLISIERUNG VON KERAMISCHEN MATERIALIEN

VERPACKUNG FUR ELEKTRISCHE EINZELTEILE

VERFAHREN ZUR HERSTELLUNG VON INSBESONDERE ALS LEITERMUSTER FUR GEDRUCKTE SCHALTUNGEN DIENENDEN MUSTERN AUF UNTERLAGEN

PROCEDURE FOR DEAD METALLIZING

PROCEDURE FOR THE IMPROVEMENT OF THE ADHESIVE STRENGTH OF DEAD SOLITARY LAYERS OF METAL ON PLASTIC SURFACES.

PROCEDURE FOR THE ACTIVATION OF SUBSTRATE SURFACES FOR THE DEAD METALLIZATION.

PROCEDURE FOR THE METALLIZATION OF NON CONDUCTIVE SUBSTRATES

Solution and procedure for the direct activation of plastic surfaces for the following chemical metallization

PROCEDURE FOR THE PRODUCTION OF IN PARTICULAR AS LEADER SAMPLE FUR PRINTED CIRCUITS SERVING SAMPLES ON DOCUMENTS

Procedure for the pretreatment of plastic surfaces for metallizing

Procedure for sensitizing surfaces intended for the dead metal separation

Procedure for manufacturing printed circuits

Procedure for the production of a bath for chemical nickel plating and procedure for nickel plating of non-metallic workpieces

ACTIVATOR SOLUTIONS

CONDUCTING OR CATALYSING A CHEMICAL REACTION ON A SURFACE ESPECIALLY ELECTROLESS METAL DEPOSITION AND CATALYST SYSTEMS USED THEREIN

Method for preparing an organic film at the surface of a solid substratein non-electrochemical conditions, solid substrate thus formed and preparation kit

The present invention relates to a method for preparing an organic film at the surface of a solid substrate, comprising a step of contacting said surface with a liquid solution containing (i) at least one solvent, at least one adhesion primer in non-electrochemical conditions and for generating radicalar entities from the adhesion primer. The liquid solution may further include (iii) at least one monomer different from the adhesion primer and polymerisable in a radicalar manner. The present invention also relates to an electrically non-conductive solid substrate on which an organic film is grafted according to said method, and to a kit for preparing an essentially polymeric organic film at the surface of the solid substrate.

PROCESS FOR TREATING SURFACES OF PLASTIC MATERIALS

METHOD OF DEPOSITING A METAL ON A SURFACE

METHOD OF IMPROVING THE BOND STRENGTH OF ELECTROLESSLY DEPOSITED METAL LAYERS ON PLASTIC- MATERIAL SURFACES

Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces Activator formulations which contain copolymers of (meth)acrylonitrile, styrenes, acrylates and/or unsaturated acids as binders are excellently suitable for preparing nonmetallic substrate surfaces for electroless metallization. The metal deposits produced are notable for good bond strength.

LIFE EXTENSION OF CATALYST PREDIP BATHS

LIFE EXTENSION OF CATALYST PREDIP BATHS A method and apparatus for extending the useful life of an acqueous acid chloride solution that serves as a protective bath for an activator dip bath such as used in electroless copper plating. Means are provided for recirculating the acidic chloride solution over metallic tin to precipitate copper ions from the solution. The precipitated copper is filtered from the solution to extend its useful life.

METHOD AND COMPOSITION FOR TREATING POLYMERIC SUBSTRATES PRIOR TO PLATING

The present invention is directed to a process and composition effective prior to the electroless plating of polymeric substrates to substantially completely remove hexavalent chromium ions present in the aqueous acidic solution utilized to etch the plastic part. This novel result is accomplished by treating the polymeric substrate with a hydroxylamine salt in an acidic solution which may contain hydrochloric acid, sulfuric acid or partially neutralized acidic salts. The process and compositions of this invention may be employed as a neutralized prior to the activating step or subsequent thereto as an accelerator, or at both location in the process for maximum effectiveness.

PROCESS FOR THE ADHESION-ACTIVATION OF POLYAMIDE SUBSTRATES FOR ELECTROLESS METALLISATION

Procédé pour la métallisation d'une surface en un matériau plastique.

Verfahren zum Metallisieren einer Oberfläche.

Procédé de métallisation du verre ou de la céramique vitrifée au moyen de métaux précieux et produits obtenus par ce procédé

Verfahren zum Herstellen gedruckter Schaltungen

Verfahren zum Metallisieren, insbesondere mit Nickel, von nichtmetallischen Erzeugnissen

Verfahren zum Herstellen gedruckter Schaltungen

Method of electroless plating

An electroless plating solution contains H2O, H2O-sol. metal salt (pref. =80 gm. metal ion/100 ml), an acid component (pref. >1 gm. acid/100 ml) and >=5gm/100 ml H2O-sol carbohydrate (5 - 80 gm/100 ml. preferably 15 - 20 gm/100 ml.), and pref. 0.001 - 0.1 gm. phytol or guanylic acid being preferably included. The carbohydrate is preferably a mono-, di- or poly-saccharides, particular sucrose. The pH is pref. 1-4. The solution is used to plate metals (steel), plastic and ceramic materials. A uniform coating is obtained, even on irregular surfaces.

Electroless metal-plating of semiconduc - tors

One step catalytically initiated chemical plating process is for Bi-Tl-Se or Bi-Tl-Sb semiconductors in which the semiconductor is immersed in a Ni or Co plating soln. in contact with a solid gp. VIII metal catalyst pref. a Ni plate, to initiate deposition. After plating the semiconductor is pref. heated to is approx. 150 degrees C to improve adhesion and structure of the plate. The process specif. uses a standard NiCl2/Na hypophosphite plating soln.

Procédé pour déposer des métaux sur des objets solides

Procédé pour décaper, activer et sensibiliser la surface d'une matière non conductrice de l'électricité en vue d'une déposition subséquente de métal sans recours au courant électrique

Verfahren zur Herstellung von gut haftenden Metallschichten auf der glatten Oberfläche einer Kunstharz-Trägerschicht

Verfahren zur Herstellung von Rahmengittern, insbesondere für Elektronenröhren

Verfahren zum Belegen eines nichtleitenden Materials mit einer Kupferschicht und nach diesem Verfahren mit einer Kupferschicht belegtes nichtleitendes Material

Procédé de métallisation d'un article diélectrique

Verfahren zum Sensibilisieren von zur stromlosen Metallabscheidung bestimmten metallischen und nichtmetallischen Oberflächen und Sensibilisierungslösung zur Durchführung des Verfahrens

Verfahren zur Aktivierung von Kunststoffoberflächen

Procédé de traitement d'un produit en matière plastique de la classe des polycarbonates, en vue de l'application ultérieure d'un dépôt métallique

Verfahren zur Herstellung eines magnetischen Aufzeichnungsträgers und nach diesem Verfahren hergestellter magnetischer Aufzeichnungsträger

Verfahren zur stromlosen Herstellung eines Kupferüberzuges auf Eisen und Eisenlegierungen

Verfahren zum stromlosen Metallisieren von Gegenständen

Verfahren zur chemischen Vernickelung

PROCEDURE FOR CATALYTIC SENSITIZING OF SURFACES FOR THE FOLLOWING, DEAD METALLIZATION.

Solutions for activating surfaces

PROCEDURE FOR THE PRODUCTION OF FILLERS FUER OF INSULANTS AFFECTING THE DEAD METAL SEPARATION CATALYTIC.

Process for producing a solids preparation giving, after dispersing or dissolution, a sensitising solution or dispersion

PROCEDURE FOR DEAD METALLIZING.

СПОСОБ МЕТАЛЛИЗАЦИИ ПОЛИЭФИРНОГО ВОЛОКНА И МЕТАЛЛИЗИРОВАННОЕ ПОЛИЭФИРНОЕ ВОЛОКНО

Настоящее изобретение относится к способу металлизации полиэфирного волокна, согласно которому полиэфирное волокно обрабатывают щелочным раствором, обрабатывают по меньшей мере одним соединением, содержащим по меньшей мере одну функциональную группу, которую выбирают из группы, включающей первичный амин, вторичный амин, тиол, сульфид и олефин, при этом указанное соединение содержит поперечные связи, обработанное полиэфирное волокно обрабатывают раствором, содержащим по меньшей мере одну соль металла, которую выбирают из группы, включающей соль серебра, соль меди и соль никеля, и по меньшей мере один комплексообразователь, и обрабатывают по меньшей мере одним восстановителем. Настоящее изобретение относится также к полиэфирным волокнам, металлизированным указанным способом, а также к их применению для антибактериальной обработки жидкости в системах транспортировки жидкостей или для изготовления чулочно-носочных изделий, стелек, одежды, чехлов для мебели для сидения или матрацев. Кроме того ...

Plating method, method for forming metal thin film, and plating catalyst liquid

Disclosed is a plating method characterized by comprising (a) a step for applying a plating catalyst liquid containing a catalyst element and an organic solvent onto an object to be plated, which has a surface having a functional group that is interactive with the catalyst element, and (b) a step for plating the object to which the plating catalyst liquid is applied.

PROCESS OF TREATMENT OF POLYMERIC SUBSTRATES BEFORE THE NONELECTROLYTIC COATING

METHOD FOR METALLIZING SUBSTRATES BY REDUCING A METAL OXIDE AND A PARTIAL PRODUCT RESULTING THEREFROM.

PROCESS FOR DEPOSITING COPPER LAYERS ON SHAPED ARTICLES OF A POLYIMIDE

CATALYTIC SOLUTION TO SENSITIZE SURFACES TO BE COVERED BY CHEMICAL PLATING

Process for the catalytic sensitization of non-metallic surfaces for subsequent electroless metallization

METHOD OF ACTIVATING A POLYMER SURFACE AND RESULTANT ARTICLE

Proceeded of treatment of the waste water which appears in the activation of the synthetic breadths of substrates

L'invention concerne un procédé de traitement des eaux usées qui apparaissent lors de l'activation en une étape, à base de solutions de palladium/étain, de substrats de matières synthétiques riches en surface, caractérisé en ce qu'on ajoute à la solution d'activation usée un concentré de chlorure de palladium (II) et de chlorure de sodium, en ce qu'on ajoute à nouveau à cette charge un sel solide d'étain (II), puis en ce qu'on laisse reposer aux fins de mûrissement la solution concentrée en ions palladium (II) et étain (II), et en ce qu'on la réutilise comme nouvelle solution d'activation prête à l'emploi.

METHOD OF PREPARATION OF SURFACES OF SUBSTRATES FOR A CHEMICAL PLATING

Method of electroless plating

formulation for use nip polymeric materials prior to coating thereof

COATED PARTICLE OXIDE FUEL FOR NUCLEAR REACTORS

ACCELERATING SOLUTION AND ITS USE IN A PROCESS FOR TREATING POLYMERIC SUBSTRATES PRIOR TO PLATING

Forming method of soldering metal layer for optical fiber array base

The present invention is related to a forming method of the soldering metal layer for optical fiber array base. At first, plural optical fiber array bases having v-shaped grooves are formed on the surface of the substrate (such as silicon substrate or pyrex glass) as shown in figure 1. Then, a soldering metal layer is formed on the entire surface of substrate through the use of chemical deposition method. After that, a dicing process is conducted to form plural optical fiber bases having the soldering metal layer. The method for chemically depositing the metal layer contains the following steps: forming plural grooves on one surface of the substrate; depositing a layer of nickel/chrome (Ni/Cr) or aluminum metal through vapor deposition or sputtering deposition method in the environment containing inert gas; processing the substrate surface, which has plural grooves, through the use of the sensitization solution containing deionized (DI) water and SnCl2; processing the sensitized substrate ...

ELECTROLESS PLATING PREPROCESSING SOLUTION AND METAL CONDUCTOR LAYER FORMING METHOD USING SUCH SOLUTION

An electroless plating preprocessing solution and a metal conductor layer forming method using such preprocessing solution are provided for providing a resin circuit board having excellent heat resistance and reliability at high temperature and high humidity. The preprocessing solution includes an inclusion compound, including metal catalyst ions, and a binder resin. The metal conductor layer forming method includes a process of applying the electroless plating preprocessing solution, which includes the inclusion compound having the metal catalyst ions included therein and the binder resin, on the surface of a base body, prior to performing electroless plating.

PROCESS FOR METALLIZING NON-CONDUCTIVE SUBSTRATES

Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.

HORIZONTAL METHOD OF ELECTROLESS METAL PLATING OF SUBSTRATES WITH IONIC CATALYSTS

Horizontal methods of electroless metal plating with ionic catalysts have improved plating performance by reducing undesired foaming. The reduced foaming prevents loss of ionic catalyst from the catalyst bath and prevents scum formation which inhibits catalyst performance. The horizontal methods also inhibit ionic catalyst precipitation and improve adhesion of the ionic catalyst to the substrate. The horizontal method can be used to plate through-holes and vias of various types of substrates.

Method of forming a tin-cuprous colloidal wetting sensitizer

A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

Aqueous solution for activation accelerating treatment

An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.

Electroless plating method with inspection for an unbroken layer of water prior to plating

Improvements are disclosed in the method of electroless deposition of a metal on a nonconductive surface wherein the surface is sequentially contacted with a tin salt solution, a palladium salt solution, and an electroless plating bath containing said metal. The improvement relates to preparing the surface to produce an unbroken layer of water adhering thereto upon dipping said surface in deionized water. The improvement further contemplates removing the surface from the electroless plating bath after formation of the visible amount of metal, inspecting the surface for imperfections, removing the metal, and recleaning the surface to remove imperfections. Finally, the activation steps are repeated followed by contacting the surface with an electroless plating bath to plate the desired quantity of metal thereon in a manner wherein uniformity and adhesion are improved.

METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS

A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.

Metal plating process

A process for the formation of a plated through-hole printed circuit board comprising treating a circuit board base material as follows: 1. condition with an oxidant solution; 2 (A). contact with a copper etchant that etches copper and neutralizes oxidant residues on the surface to be plated; and 2 (B). contact with a conditioner that conditions the board surface for enhanced catalyst adsorption; or 2 (A). contact with a neutralizer for oxidant residues that neutralizes said residues and conditions the board surface for enhance catalyst asdorption; and 2 (B). contact with a copper etchant; and 3. catalyze the board; and 4. plate electroless metal onto catalyzed surfaces from a plating solution containing a source of halide ions in a concentration of at least 0.1 moles per liter of solution. The process is characterized by the absence of a step of acceleration and contains fewer processing steps than prior art processes.

Process for manufacturing printed circuit boards

Verfahren zum galvanischen Abscheiden einer magnetisierbaren Schicht

PRETREATING CIRCUIT BOARDS FOR ELECTROLESS COATING

During the treatment of plastic-metal laminates which are to used as electric printed circuit boards, the catalytically treated surface are subjected to treatment with an accelerator followed by a reducing agent and finally heat treated over a certain time period before being subjected to electroless metal plating. Pref. the reducing agent is selected from alkylaminoboranes and alkali metal borhydrides. The plastic surface is catalytically treated with an acid Pd-Sn catalyst and the reducing agent is DMAB or sodium borhydride. The accelerator is an acid solution. When using 10 g/l aqueous DMAB solution as reducing agent the pH is approx. 11.

PRECIOUS METAL SENSITIZING SOLUTIONS

The solution contains a double-metal complex compound ABC. A represents one or more noble metals, B is tin and C at least one anion which is able to form stable compounds with tin in both oxidation states. The solution contains a stabiliser from the group comprising ammonia, amines, phenols, amides, thioamides, thiols, thiophenols and glycols. A fluorinated hydrocarbon is optionally added as a wetting agent. The solution is prepared by heating the three components which form the complex compound; the stabiliser can be added before or after heating.

Method for manufacturing sensing electrical device and sensing electrical device

A method for manufacturing a sensing electrical device includes the following steps; (a) forming a conductive trace on an insulating substrate; (b) placing the insulating substrate with the conductive trace in a mold cavity of a mold; (c) injecting an insulating material into the mold cavity to encapsulate the conductive trace to form an injection product; and (d) removing the injection product from the mold cavity.

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE STRUCTURE ON A NON-CONDUCTIVE SUBSTRATE MATERIAL, AND ADDITIVE AND SUBSTRATE MATERIAL INTENDED THEREFOR

A method for producing an electrically conductive structure, e.g., a conducting track, on a non-conductive substrate material, having an additive () having at least one metal compound. The substrate material may be irradiated using a laser to selectively activate the metal compounds, for example inorganic metal compounds, contained in the additive (). The metal seeds formed by the activation are then metallized to create the electrically conductive structure on the substrate material. Because the additive () has a preferably full-surface coating before the additive is introduced into the substrate material, such that the additive () is reduced and the coating is oxidized by the laser activation, the reaction partners necessary for the required chemical reaction with the additive () are provided by the coating. Because of the thereby significantly reduced interaction with the substrate material, the limitation to certain plastics or plastic groups also is lifted. 1. A method for producing an electrically conductive structure on a non-conductive substrate material , the method comprising:irradiating, using a laser, the substrate material, which comprises an additive comprising a first region, comprising a metal compound, and a second region, thereby selectively activating the metal compound in the additive;forming catalytically active seeds in regions, which are laser activated;reducing an oxidation number of a metal in a different chemical composition in the second region, which is laser activated; andthen, metallizing the regions comprising catalytically active seeds, thereby creating the electrically conductive structure on the non-conductive substrate material.2. The method of claim 1 , wherein the metal compound forms core of the additive claim 1 , andwherein the core is surrounded at least in portions by the second region.3. The method of claim 1 , wherein the metal compound is penetrated at least in portions by the second region.4. The method of claim 1 , ...

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines. 1. A display device , comprising:a display substrate including a display area for displaying an image and a pad region disposed at a side of the display area;a first pad portion including a plurality of first pad terminals, the first pad portion being disposed in the pad region, the plurality of first pad terminals being arranged in a first direction; anda printed circuit board (PCB) including a base film and a second pad portion, wherein the second pad portion is disposed at a side of the base film and is electrically connected to the first pad portion, a plurality of second pad terminals electrically connected to the plurality of first pad terminals; and', 'a plurality of first test lines,', 'wherein the plurality of second pad terminals includes a plurality of sub-pad terminals,', 'wherein one of the plurality of first test lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first test lines, and, 'wherein the second pad portion includeswherein each of the plurality ...

METHOD OF DEPOSITING A METAL LAYER ON AN ELECTRICALLY NON-CONDUCTIVE PLASTIC MEMBER, AND HOUSING FOR A MOBILE DEVICE

A method of depositing a metal layer on an electrically non-conductive plastic member includes: mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member; irradiating a part of a surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region; forming an activating layer on the roughened region; and forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member. This method is suitable for making a housing for a mobile device. 1. A method of depositing a metal layer on an electrically non-conductive plastic member , comprising the steps of:(a) mixing a plastic material and a laser-sensitive additive to form a mixture, followed by injection molding the mixture to form an electrically non-conductive plastic member that has a surface;(b) irradiating a part of the surface of the electrically non-conductive plastic member with laser to engrave the electrically non-conductive plastic member so as to form a roughened region in the electrically non-conductive plastic member;(a) forming an activating layer on the roughened region of the electrically non-conductive plastic member for metalizing the roughened region in the electrically non-conductive plastic member; and(d) forming a metal layer on the activating layer on the roughened region of the electrically non-conductive plastic member.2. The method as claimed in claim 1 , wherein in step (c) claim 1 , the activating layer is made of palladium.3. The method as claimed in claim 2 , wherein in step (c) claim 2 , a tin-palladium alloy layer is formed on the roughened region of the electrically non-conductive plastic member by deposition claim 2 , followed by removing tin ion from the tin-palladium alloy layer by acid pickling so that palladium remains on the ...

Method for producing electroconductive laminate, laminate, and electroconductive laminate

An object of the present invention is to provide a method for producing an electroconductive laminate, which is capable of forming a metal layer having low resistance at a position corresponding to a patterned plated layer, a laminate, and an electroconductive laminate. The method for producing an electroconductive laminate of the present invention includes: a step of forming a plated layer forming layer on a base material using a predetermined plated layer forming composition; a step of subjecting the plated layer forming layer to a patternwise exposure treatment and a development treatment to form a patterned plated layer containing a portion having a line width of less than 3 μm; a step of applying a plating catalyst or a precursor thereof to the patterned plated layer using an alkaline plating catalyst-applying liquid containing the plating catalyst or the precursor thereof; and a step of subjecting the patterned plated layer to which the plating catalyst or the precursor thereof has been applied to a plating treatment using a plating liquid containing aminocarboxylic acids to form a metal layer on the patterned plated layer.

PROCESS FOR METALLIZING NONCONDUCTIVE PLASTIC SURFACES

The present invention relates to a process for metallizing nonconductive plastics using etching solutions free of hexavalent chromium. The etching solutions are based on permanganate solutions. After the treatment of the plastics with the etching solutions, the plastics are metallized by means of known processes. 2. Process according to claim 1 , wherein process step A) comprises the following steps:A i) treating the plastic surface with an acidic etching solution, andA ii) treating the plastic surface with an alkaline etching solution.3. Process according to claim 1 , wherein process step A) is preceded by performance of the following further process step:pretreatment step: treating the plastic surface in an aqueous solution comprising at least one glycol compound.5. Process according to claim 1 , wherein the source for permanganate ions in the etching solutions in process step A) is selected independently from the group of alkali metal permanganates comprising potassium permanganate and sodium permanganate.6. Process according to claim 5 , wherein the source for permanganate ions in the etching solutions in process step A) is independently present in a concentration between 30 g/l and 250 g/l.7. Process according to claim 1 , wherein the acidic etching solution in process step A) further comprises an inorganic acid.8. Process according to claim 7 , wherein the inorganic acid is present in the acidic etching solution in process step A) in a concentration of 0.02-0.6 mol/l based on a monobasic acid.9. Process according to claim 1 , wherein the alkaline etching solution in process step A) further comprises a hydroxide ion source.10. Process according to claim 9 , wherein the hydroxide ion source is present in the alkaline etching solution in process step A) in a concentration between 1 g/l and 100 g/l.11. Process according to claim 1 , wherein the plastic surface has been manufactured from at least one electrically nonconductive plastic and the at least one ...

SILVER-COATED PARTICLE AND METHOD OF PRODUCING SAME

A silver-coated particle (P) is provided. The silver-coated particle (P) includes a core particle () made of a resin particle or an inorganic particle and a silver coating layer () formed on a surface of the core particle (), wherein, an amount of silver contained in the silver coating layer () is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle (P), a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle (P); and irradiating X-ray in a range of 2θ/θ=30 to 120 deg., is in a range of 35 nm to 200 nm. 1. A silver-coated particle comprising a core particle made of a resin particle or an inorganic particle and a silver coating layer formed on a surface of the core particle , wherein ,an amount of silver contained in the silver coating layer is 5 to 90 parts by mass with respect to 100 parts of the silver-coated particle,a crystallite diameter of the silver, which is calculated from a diffraction line obtained by filling a sample holder belonging to an X-ray diffraction apparatus with the silver-coated particle; and irradiating X-ray in a range of 2θ/θ=30 to 120 deg., is in a range of 35 nm to 200 nm.2. A method of producing a silver-coated particle comprising the steps of:forming a tin absorbing layer on a surface of a core particle by adding the core particle made of a resin particle or an inorganic particle to an aqueous solution of a tin compound;preparing a silver-coated particle precursor, which contains a silver coating layer on the surface of the core particle, by performing electroless plating on the tin absorbing layer, which is formed on the surface of the core particle, by using a reducing agent; andsetting a crystallite diameter of the silver, which is measured by X-ray diffraction method, to 35 nm to 200 nm by sintering silver constituting the silver coating layer by heat treating the silver- ...

Method for electroless plating

The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

COATED OPTICAL FIBRES HAVING IMPROVED FEATURES

A waveguide for high efficiency transmission of high energy light useful in ablation procedures at predetermined bandwidths over predetermined distances comprising: an optical fiber core; a silanization agent; layered cladding surrounding the optical fiber core comprising: a first thin metal layer comprising at least two types of metals the first thin metal layer covalently bonded to the core and a second thin metal layer bonded to the second metal layer, and a catalyst component; wherein the silanization agent comprising organofunctional alkoxysilane molecule, such as 3-aminopropyltriethoxysilane (APTS), is a self supporting bridge between the surface of the optical fiber and the first metal layer; the first metal layer is uniformly chemisorbed onto the surface of the optical fiber by means of covalent Si—O—Si bonds with the optical fiber; further wherein the catalyst component derived from an activation solution for enhancing the layered cladding upon the optical fiber. 157-. (canceled)58. A waveguide for high efficiency transmission of high energy light for ablation procedures at predetermined bandwidths over predetermined distances , comprising:a. an optical fibre core;b. an alkoxysilane bridge derived from 3-aminopropyltriethoxy-silane, immobilized onto the optical fibre core via covalent Si—O—Si bonds with said optical fibre core, and capable of binding metals with its amino functional group; and i. a first thin metal layer comprising at least two types of metals, said first thin metal layer of up to 3 microns in thickness bound to said core; and', 'ii. a second thin metal layer of up to 3 microns in thickness bound to said first metal layer;, 'c. a metal-layered cladding bound to the alkoxysilane bridge, thereby coating said optical fibre core with metals, said metal-layered cladding comprisingwherein (i) said layered cladding has a thickness between 0.25 to about 5 micron, and (ii) said waveguide has a bending radius in a range of 8 mm to 12 mm without ...

METHOD FOR PROMOTING ADHESION BETWEEN DIELECTRIC SUBSTRATES AND METAL LAYERS

The present invention relates to novel processes for metallization of dielectric substrate surfaces applying organosilane compositions followed by oxidative treatment. The method results in metal plated surfaces exhibiting high adhesion between the substrate and the plated metal while at the same time leaves the smooth substrate surface intact. 1. A method for treating a surface of a dielectric substrate to prepare said surface for subsequent wet chemical metal plating , such method comprising in this order the steps of(i) treating said surface with a solution comprising at least one organosilane compound;(ii) treating said surface with a solution comprising an oxidizing agent selected from aqueous acidic or alkaline solutions of a permanganate salt.2. Method according to wherein the concentration of permanganate salt ranges from 20-100 g/l.3. Method according to wherein the organosilane compound is selected from the group represented by the formula{'br': None, 'sub': (4-x)', 'x, 'ASiB'}whereineach A is independently a hydrolyzable group,x is 1 to 3, and{'sub': 1', '20, 'claim-text': {'br': None, 'sub': n', '2n, 'CHX,'}, 'each B is independently selected from the group consisting of C-Calkyl, aryl, amino aryl and a functional group represented by the formula'}whereinn is from 0 to 15, preferably 0 to 10 even more preferably 1 to 8, most preferably 1, 2, 3, 4 and{'sub': 3', '1', '5, 'X is selected from the group consisting of amino, amido, hydroxy, alkoxy, halo, mercapto, carboxy, carboxy ester, carboxamide, thiocarboxamide, acyl, vinyl, allyl, styryl, epoxy, epoxycyclohexyl, glycidoxy, isocyanato, thiocyanato, thioisocyanato, ureido, thioureido, guanidino, thioglycidoxy, acryloxy, methacryloxy groups; or X is a residue of a carboxy ester; or X is Si(OR), and wherein R is a C-Calkyl group.'}4. Method according to wherein the hydrolyzable group A is selected from the group consisting of —OH claim 3 , —ORand wherein Ris C-Calkyl claim 3 , —(CH)ORand wherein y is 1 ...

DOPED TIN OXIDE AND METHOD FOR SELECTIVE METALLIZATION OF INSULATING SUBSTRATE

Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %. 1. A doped tin oxide , comprisinga tin oxide, andat least one oxide of a doping element,wherein the doping element comprises at least one of vanadium and molybdenum, andan amount of the tin oxide ranges from 90 mol % to 99 mol %, and an amount of the at least one oxide ranges from 1 mol % to 10 mol %.2. The doped tin oxide according to claim 1 , wherein the amount of the tin oxide ranges from 92 mol % to 98 mol % claim 1 , and the amount of the at least one oxide ranges from 2 mol % to 8 mol %.3. The doped tin oxide according to claim 1 , wherein the doped tin oxide comprises oxide particles having an average volume diameter ranging from 50 nm to 10 μm.4. A polymer article claim 1 , comprising:a base polymer; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'at least one metal compound dispersed in the base polymer, wherein the metal compound comprises the doped tin oxide according to .'}5. The polymer article according to claim 4 , further comprising an amount of the metal compound ranging from 1 wt % to 3 wt % claim 4 , and an amount of the base polymer ranging from 97 wt % to 99 wt %.6. A method for selective metallization of a surface of a polymer article claim 4 , wherein the polymer article is one according to claim 4 , and the method comprises:vaporizing at least a part of the surface of the polymer article by irradiating the surface with an energy source; andforming at least one metal layer on the surface of the polymer article by chemical plating.7. The method according to claim 6 , wherein the energy source comprises at least one selected from a laser claim 6 , an ...

FORMULATION FOR THE ETCHING OF POLYMER MATERIALS PRIOR TO COATING OF THE MATERIALS

A new formulation of treatment baths for the etching of polymers prior to metallization or coating of the polymer using known technologies described in the state of the art, which are based on the use of salts and/or complexes of the Cr(III) cation, where the formulation includes a salt and/or Cr(III) complex in which the Cr(III) is coordinated to at least one or several mono, bi, tri, tetra, penta, hexadentate or bridging ligands that are coordinated to the chromium by the oxygen, sulfur or nitrogen atom or several of these atoms of the ligands, such that after the polymer piece has been etched with the Etching formulation described above, the metal coating is carried out by means of the application of chemical and electrolyte baths in the case of metallization, or by means of the application of paint or another organic coating. 1. An acid etching bath formulation comprising an acid and Cr(III) coordination complexes wherein the acid concentration in the etching bath is from 20 wt. % to 98 wt. %.2. The formulation according to claim 1 , wherein the Cr (III) coordination complexes comprise one or more ligands selected from mono claim 1 , bi claim 1 , tri claim 1 , tetra claim 1 , penta claim 1 , hexadentate or bridging ligands that are coordinated to the chromium by an oxygen claim 1 , sulfur or nitrogen atom or a combination thereof.3. The formulation according to claim 2 , wherein the ligands are selected from formate claim 2 , acetate claim 2 , propanoate claim 2 , butanoate claim 2 , benzoate claim 2 , phenylacetate claim 2 , phenylpropionate claim 2 , cyanamate claim 2 , alkylbenzoates claim 2 , pyruvate claim 2 , levulinate claim 2 , citrate claim 2 , isocitrate claim 2 , aconitate claim 2 , trimellitate claim 2 , glycinate claim 2 , valinate claim 2 , leucinate claim 2 , threoninate claim 2 , lysinate claim 2 , tryptophanate claim 2 , histidinate claim 2 , phenylalaninate claim 2 , isoleucinate claim 2 , argininate claim 2 , methioninate claim 2 , alaninate ...

PREPARATION METHOD OF CONDUCTIVE SPONGE HAVING EFFECT OF SHIELDING ELECTROMAGNETIC WAVE

A preparation method of a conductive sponge includes the following steps. First, a sponge substrate is dipped in a metal solution and then taken out. A first drying process is performed. Next, the sponge substrate plated with metal particles is dipped in a carbon nanomaterial suspension and then taken out. Then, a second drying process is performed. 1. A preparation method of a conductive sponge , comprising:dipping a sponge substrate in a metal solution and then taking out the sponge substrate;performing a first drying process on the sponge substrate dipped in the metal solution;dipping the sponge substrate in a carbon nanomaterial suspension after the first drying process and then taking out the sponge substrate; andperforming a second drying process on the sponge substrate dipped in the carbon nanomaterial suspension.2. The preparation method of a conductive sponge of claim 1 , wherein a material of the sponge substrate comprises melamine or polyurethane.3. The preparation method of a conductive sponge of claim 1 , wherein the metal solution comprises a silver ion solution claim 1 , a nickel ion solution claim 1 , an iron ion solution claim 1 , or a cobalt ion solution.4. The preparation method of a conductive sponge of claim 1 , wherein the metal solution comprises a silver nitrate solution claim 1 , a nickel nitrate solution claim 1 , or a copper nitrate solution.5. The preparation method of a conductive sponge of claim 1 , wherein a solute of the carbon nanomaterial suspension comprises carbon black claim 1 , carbon nanotube claim 1 , graphene claim 1 , or carbon aerogel.6. The preparation method of a conductive sponge of claim 1 , further comprising claim 1 , before the sponge substrate is dipped in the metal solution claim 1 , performing a sensitizing treatment.7. The preparation method of a conductive sponge of claim 6 , further comprising claim 6 , after the sensitizing treatment is performed and before the sponge substrate is dipped in the metal solution ...

PRINTED CIRCUIT BOARD PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

A display device includes a display substrate including a display area and a pad region, a first pad portion including a plurality of first pad terminals, the plurality of first pad terminals being arranged in a first direction, and a printed circuit board (PCB) including a base film and a second pad portion. The second pad is electrically connected to the first pad portion. The second pad portion includes a plurality of second pad terminals electrically connected to the plurality of first pad terminals, and a plurality of first test lines. The plurality of second pad terminals includes a plurality of sub-pad terminals. One of the plurality of first lines is connected to a first sub-pad terminal of the plurality of sub-pad terminals, and a second sub-pad terminal of the plurality of sub-pad terminals is not connected to any of the plurality of first lines. 1. A printed circuit board (PCB) package , comprising:a base film;a first test pad portion electrically connected to a plurality of second pad terminals; anda second pad portion disposed on a first side of the base film, the second pad portion including the plurality of second pad terminals, wherein the plurality of second pad terminals is arranged along a first direction,wherein the plurality of second pad terminals includes a plurality of first sub-pad terminals, andwherein the first test pad portion is electrically connected to some of the plurality of first sub-pad terminals.2. The PCB package of claim 1 , wherein the plurality of first sub-pad terminals includes:a plurality of third-row sub-pad terminals arranged along a first virtual line which forms a first inclination angle with respect to the first direction, wherein a pair of the plurality of third-row sub-pad terminals extend parallel to each other; anda plurality of fourth-row sub-pad terminals separated from the third-row sub-pad terminals, wherein the plurality of fourth-row sub-pad terminals is arranged along a second virtual line which forms a ...

FORMULATION FOR THE ETCHING OF POLYMER MATERIALS PRIOR TO COATING OF THE MATERIALS

A new formulation of treatment baths for the etching of polymers prior to metallization or coating of the polymer using known technologies described in the state of the art, which are based on the use of salts and/or complexes of the Cr(III) cation, where the formulation includes a salt and/or Cr(III) complex in which the Cr(III) is coordinated to at least one or several mono, bi, tri, tetra, penta, hexadentate or bridging ligands that are coordinated to the chromium by the oxygen, sulfur or nitrogen atom or several of these atoms of the ligands, such that after the polymer piece has been etched with the Etching formulation described above, the metal coating is carried out by means of the application of chemical and electrolyte baths in the case of metallization, or by means of the application of paint or another organic coating. 1. A use of a formulation of acid etching of thermoplastic , thermostable or elastomeric polymer materials , by means of a chemical process based on the use of Cr(III) coordination complexes and whose purpose is the subsequent metallization of the materials , by means of the application of chemical baths or organic coating , the concentration of acid in the etching bath may be from 10% to 98%.2. The use of a formulation of acid etching baths of polymer materials to achieve the subsequent metallization or organic coating thereof according to claim 1 , wherein the chromium (III) complex is based on the use of at least one or several mono claim 1 , bi claim 1 , tri claim 1 , tetra claim 1 , penta claim 1 , hexadentate or bridging ligands that are coordinated to the chromium by the oxygen claim 1 , sulfur or nitrogen atom or several of these atoms.3. The use of a formulation according to claim 2 , wherein the ligands are among formate claim 2 , acetate claim 2 , propanoate claim 2 , butanoate claim 2 , benzoate claim 2 , phenylacetate claim 2 , phenylpropionate claim 2 , cyanamate claim 2 , alkylbenzoates claim 2 , pyruvate claim 2 , levulinate ...

Thermoplastic resin composition, method of preparing the same, and molded part manufactured using the same

Disclosed are a thermoplastic resin composition, a method of preparing the same, and a molded part manufactured using the same, wherein the thermoplastic resin composition includes a-1) 1 to 30% by weight of a first graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.05 μm or more and less than 0.2 μm; a-2) 5 to 45% by weight of a second graft polymer obtained by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto a conjugated diene rubber having an average particle diameter of 0.2 to 0.5 μm; b) 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer; and c) 1 to 10% by weight of a (meth)acrylic acid alkyl ester polymer.

Electroless metallization of dielectrics with alkaline stable pyrazine derivative containing catalysts

Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants.

Treated polymer production method, polymer, metal-plated polymer, and adhesion laminate

To provide a treated polymer production method which can be performed in a simplified manner and at low cost. In order to achieve the object, the treated polymer production method according to the present invention includes: reacting a surface of a polymer with a halogen oxide radical to surface-treat the polymer. The treated polymer is a metal-plated polymer, and the method further includes plating, with a metal, the surface of the polymer after the surface-treating, or the treated polymer is an adhesion laminate of the polymer and an adherend, and the method further includes adhering the adherend to the surface of the polymer after the surface-treating.

POLYMER ARTICLES, INK COMPOSITIONS, AND METHODS FOR SELECTIVELY METALIZING POLYMER ARTICLES

Embodiments of the present disclosure are directed to a polymer article. The polymer article includes a polymer matrix and a metal compound dispersed in the polymer matrix. The metal compound is a compound represented by formula (I): ACu(PO)(I). In formula (I), A represents at least one element selected from Group IIA of the periodic table of elements, x/y=0.1 to 20, x+y=3. 1. A polymer article comprising a polymer matrix and at least one metal compound dispersed in the polymer matrix , wherein the at least one metal compound is a compound represented by formula (I) ,{'br': None, 'sub': x', 'y', '4', '2, 'ACu(PO)\u2003\u2003(I),'}wherein in formula (I), A represents at least one element selected from Group IIA of the periodic table of elements, x/y=0.1 to 20, x+y=3.2. The polymer article according to claim 1 , wherein of the total content of the polymer article claim 1 , the content of the at least one metal compound ranges from 1 wt % to 40 wt %.3. The polymer article according to claim 1 , wherein claim 1 , in formula (I) claim 1 , A represents at least one element selected from a group including Ca claim 1 , Mg claim 1 , Ba claim 1 , Sr claim 1 , or a combination thereof.4. The polymer article according to claim 3 , wherein the at least one metal compound is selected from a group including CuMg(PO) claim 3 , CuMg(PO) claim 3 , CuBaSr(PO) claim 3 , CuMg(PO) claim 3 , CuCa(PO) claim 3 , CuCa(PO) claim 3 , CuBa(PO) claim 3 , CuSr(PO) claim 3 , CuSr(PO) claim 3 , or a combination thereof.5. An ink composition comprising at least one metal compound and at least one binder claim 3 , wherein the at least one metal compound is a compound represented by formula (I) claim 3 ,{'br': None, 'sub': x', 'y', '4', '2, 'ACu(PO)\u2003\u2003(I),'}wherein in formula (I), A represents at least one element selected from Group IIA of the periodic table of elements, x/y=0.1 to 20, x+y=3.6. The ink composition according to claim 5 , wherein with respect to 100 weight parts of the at ...

Methods of generating managese (iii) ions in mixed aqueous acid solutions using ozone

Manganese-(III) species is generated and regenerated in a mixed aqueous acid solution containing manganese-(II) species by injecting ozone gas in the mixed aqueous acid solution such that ozone oxidizes at least some of the manganese-(II) species to the manganese-(III) species with at least 60% Mn(III) generation efficiency. The acids include sulfuric acid and an alkane sulfonic acid. The aqueous acid solution containing manganese-(III) and manganese-(II) species is used to etch polymer materials. The etch is a chrome-free etch method.

Method for producing plated component, plated component, catalytic activity inhibitor and composite material for electroless plating

A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.

METALLIZED PLASTIC ARTICLE AND METHOD FOR SELECTIVELY METALLIZING A SURFACE

A metalized plastic article and a method for selectively metallizing a surface of a plastic substrate are provide. The metalized plastic article includes a plastic substrate and a metal plating layer formed on the surface of the plastic substrate. At least a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition. The plastic composition includes a base resin and a doped tin oxide. A doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum. The metalized plastic article of the present disclosure has a good light absorption performance and a high chemical plating activity. 1. A metalized plastic article comprising:a plastic substrate; anda metal plating layer formed on a surface of the plastic substrate; a base resin; and', 'a doped tin oxide; and', 'wherein a doping element of the doped tin oxide is at least one selected from a group consisting of cerium, lanthanum, fluorine and tantalum., 'wherein a surface layer of the plastic substrate covered by the metal plating layer is formed by a plastic composition, the plastic composition comprises2. The metalized plastic article of claim 1 , wherein the metal plating layer has a thickness of about 0.1 μm to about 10 μm.3. The metalized plastic article of claim 1 , wherein based on total molar quantity of tin element and the doping element of the doped tin oxide claim 1 , the tin element has a content of about 90 mol % to about 99.9 mol % claim 1 , and the doping element has a content of about 0.1 mol % to about 10 mol %.4. The metalized plastic article of claim 1 , wherein the doped tin oxide includes cerium doped tin oxide claim 1 , lanthanum doped tin oxide claim 1 , fluorine doped tin oxide claim 1 , or tantalum doped tin oxide.5. The metalized plastic article of claims 1 , wherein the doped tin oxide has a volume average particle size of about 50 nm to about 10 μm.6. The metalized plastic ...

Metal-graphene structures

A structure includes a metal layer and a graphene sheet having at least one hole. The graphene sheet is contained at least partly within the metal layer.

PLATING PERFORMANCE USING COMBINATION METAL OXIDE AND METAL POWDER AS ADDITIVES

The present disclosure relates to blended thermoplastic compositions comprising: a) from about 20 wt % to about 80 wt % of a polycarbonate polymer component; b) from about 5 wt % to about 30 wt % of a polycarbonate-polysiloxane copolymer component; c) from about 1 wt % to about 20 wt % of a laser direct structuring additive component; and d) from about 0.02 wt % to about 5 wt % of a metal component; wherein the combined weight percent value of all components does not exceed about 100 wt %; and wherein all weight percent values are based on the total weight of the composition. 1. A blended thermoplastic composition comprising:a. from about 20 wt % to about 80 wt % of a polycarbonate polymer component;b. from about 5 wt % to about 30 wt % of a polycarbonate-polysiloxane copolymer component;c. from about 1 wt % to about 20 wt % of a laser direct structuring additive component; andd. from about 0.02 wt % to about 5 wt % of a metal component;wherein the combined weight percent value of all components does not exceed about 100 wt %, and wherein all weight percent values are based on the total weight of the composition.2. The blended thermoplastic composition of claim 1 , wherein the blended thermoplastic composition is capable of being plated.3. The blended thermoplastic composition of claim 2 , wherein the blended thermoplastic composition has a plating index from about 0.7 to about 2.0 when determined in accordance with ASTM B568.4. The blended thermoplastic composition of claim 1 , wherein the polycarbonate polymer component comprises repeating units derived from bisphenol A.5. The blended thermoplastic composition of claim 1 , wherein the polycarbonate polymer component has a weight average molecular weight from about 15 claim 1 ,000 to about 50 claim 1 ,000 grams/mole claim 1 , as measured by gel permeation chromatography using BPA polycarbonate standards.6. The blended thermoplastic composition of claim 1 , wherein the polycarbonate component comprises a first ...

THERMOPLASTIC RESIN COMPOSITION, RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE HAVING A PLATED LAYER

Provide is a thermoplastic resin composition from which a resin molded article having high whiteness and mechanical strength can be obtained while retaining the plating properties of the resin molded article. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive, 0.1 to 20 parts by weight of a titanium oxide and 10 to 230 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive has an L value of 50 or more, and the glass fiber comprises SiOand AlOin a proportion of 60 to 70% by weight of SiOand 20 to 30% by weight of AlO. 114-. (canceled)15. A thermoplastic resin composition comprising a thermoplastic resin , and 1 to 30 parts by weight of a laser direct structuring additive , 0.1 to 20 parts by weight of a titanium oxide and 10 to 910 parts by weight of a glass fiber per 100 parts by weight of the thermoplastic resin , wherein the laser direct structuring additive has an L value of 50 or more , and the glass fiber comprises SiOand AlOin a proportion of 60 to 70% by weight of SiOand 20 to 30% by weight of AlO.16. The thermoplastic resin composition according to claim 15 , wherein the laser direct structuring additive is an oxide containing antimony and tin.17. The thermoplastic resin composition according to claim 16 , wherein the laser direct structuring additive contains tin in excess of antimony.18. The thermoplastic resin composition according to claim 15 , wherein the glass fiber has a tensile modulus of elasticity of 80 GPa or more.19. The thermoplastic resin composition according to claim 15 , wherein the glass fiber comprises S-glass.20. The thermoplastic resin composition according to claim 15 , wherein the thermoplastic resin is a polyamide resin.21. The thermoplastic resin composition according to claim 16 , wherein the glass fiber has a tensile modulus of elasticity of 80 GPa or more.22. The ...

ELECTROLESS NICKEL PLATING OF SILICONE RUBBER

According to the present disclosure, a method for coating nickel on an organosiloxane polymer is provided. A nickel organosiloxane polymer composite is also provided. 1. A nickel organosiloxane polymer composite comprising:a transition metal oxide layer formed on the organosiloxane polymer; anda positively charged species attached on the transition metal oxide layer with nickel coated on the positively charged species.2. The nickel organosiloxane polymer composite according to claim 1 , wherein the nickel organosiloxane polymer further comprises a trace amount of Sn—Pd catalyst under the nickel coated on the positively charged species.3. The nickel organosiloxane polymer composite according to claim 1 , wherein the organosiloxane polymer is selected from the group consisting of polydimethylsiloxane claim 1 , vinyl methyl polysiloxane claim 1 , phenyl methyl polysiloxane claim 1 , phenyl vinyl methyl polysiloxane claim 1 , fluoro vinyl methyl polysiloxane and derivatives of silicone rubber claim 1 , wherein the polysiloxane comprises a quaternary silicon.4. The nickel organosiloxane polymer composite according to claim 1 , wherein the transition metal oxide layer comprises titanium oxide.5. The nickel organosiloxane polymer composite according to claim 4 , wherein the transition metal oxide layer is selected from the group consisting of titanium oxide claim 4 , zirconium oxide claim 4 , vanadium oxide claim 4 , hafnium oxide claim 4 , niobium oxide and tantalum oxide.6. The nickel organosiloxane polymer composite according to claim 1 , wherein the positively charged species is selected from the group consisting of positively charged nanoparticles or nanocolloids claim 1 , dendrimers comprising nitrogen claim 1 , polymers having at least one primary amine claim 1 , secondary amine claim 1 , tertiary amine claim 1 , pyridinyl claim 1 , quaternized amine and/or quaternized pyridinyl and their mixtures thereof.7. The nickel organosiloxane polymer composite according to ...

Conductive member

A conductive member includes a conductive fabric containing warp and weft as well as a support, includes at least one linear bend, and is imparted with electrical conductivity across the linear bend. In the conductive member, an angle formed between the linear bend and one of the warp and the weft is 5 to 45°. The conductive fabric is preferably a conductive fabric obtained by layering a metal coating, formed by a wet plating method, on a fabric including a synthetic fiber.

Linear shape member and producing method therefor

A linear shape member is composed of a linear shape electrical insulating body comprising irregularities on a surface, and a plating layer coating the surface of the electrical insulating body. An average irregularities spacing Sm of the irregularities is not more than 20.0 μm.

Depositing a structurally hard, wear resistant metal coating onto a substrate

An example method of coating a substrate involves cleaning the substrate and, after cleaning the substrate, sensitizing the substrate using a sensitizing solution including tin chloride and hydrochloric acid. The method also involves, after sensitizing the substrate, activating the substrate in an activating solution including palladium chloride and hydrochloric acid. Further, the method involves subsequently neutralizing the substrate using a neutralizing solution including ammonium hydroxide. Still further, the method involves, after neutralizing the substrate, depositing an electroless nickel layer on the substrate. The method may then involve depositing an electrolytic nickel layer on top of the electroless nickel layer, and depositing an outer layer of metallic material, ceramic material, polymeric material, or any combination thereof on top of the electrolytic nickel layer.

PLATING METHOD, PLATING APPARATUS AND RECORDING MEDIUM

A substrate W having a non-plateable material portion and a plateable material portion formed on a surface thereof is prepared, and then, a catalyst is imparted selectively to the plateable material portion by supplying a catalyst solution N onto the substrate W. Thereafter, a plating layer is selectively formed on the plateable material portion by supplying a plating liquid M onto the substrate W. A pH of the catalyst solution N is previously adjusted such that the plating layer is suppressed from being precipitated on the non-plateable material portion while being facilitated to be precipitated on the plateable material portion 1. A plating method , comprising:preparing a substrate having a non-plateable material portion and a plateable material portion formed on a surface thereof;imparting a catalyst selectively to the plateable material portion by supplying a catalyst solution onto the substrate; andforming a plating layer selectively on the plateable material portion by supplying a plating liquid onto the substrate,wherein a pH of the catalyst solution is previously adjusted such that the plating layer is suppressed from being precipitated on the non-plateable material portion while being facilitated to be precipitated on the plateable material portion.2. The plating method of claim 1 ,{'sub': '2', 'wherein the non-plateable material portion is made of SiOas a main component,'}the plateable material portion is made of SiN as a main component, andthe pH falls within a range from 2 to 3.3. The plating method of claim 1 ,wherein the substrate includes a base member made of the plateable material portion and a core member which is protruded from the base member and is made of the non-plateable material portion.4. A plating apparatus claim 1 , comprising:a substrate holding unit configured to hold a substrate having a plateable material portion and a non-plateable material portion on a surface thereof;a catalyst imparting unit configured to impart a catalyst ...

Oxidation-resistant hybrid structure comprising metal thin film layer coated on exterior of conductive polymer structure, and preparation method therefor

The present disclosure relates to an oxidation-resistant and/or corrosion-resistant hybrid structure including a metal layer (thin film layer) coated on the exterior of a conductive polymer structure, and a preparation method for the hybrid structure.

Process for metallizing nonconductive plastic surfaces

The present invention relates to a process for metallizing nonconductive plastics using an etching solution free of hexavalent chromium. The etching solution is based on an sulphuric acidic solution comprising a source of chlorate ions and a vanadium compound. After the treatment of the plastics with the etching solution, the plastics are metallized by means of known processes.

METHOD FOR FINE LINE MANUFACTURING

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 μm. 1. Process for the manufacturing of fine line circuitry on a transparent substrate , the process comprises the following steps in the given order(i) providing a transparent substrate having a front side and a back side;(ii) providing a pattern of light-shielding activation layer on the front side of said substrate;(iii) placing a photosensitive composition on the front side of the substrate including the pattern of light-shielding activation layer;(iv) photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation;(v) removing any uncured remnants of the photosensitive composition; and thereby selectively exposing recessed structures on the pattern of light-shielding activation layer; and(vi) depositing of at least one metal or metal alloy into the thus formed recessed structures by an electroless plating process.2. The process according to claim 1 , characterized in that the pattern of light-shielding activation layer in step (ii) is provided by depositing a treatment solution on the front ...

WIRING PATTERN PRODUCTION METHOD AND TRANSISTOR PRODUCTION METHOD

A wiring pattern production method includes forming, on a substrate, a precursor film for a plating base film including a first formation material having an amino group protected by a photoreactive protecting group, forming a photoresist layer including a photoresist material on a surface of the precursor film, exposing the photoresist layer with a desired pattern of light, exposing the precursor film with a desired pattern of light to form the plating base film, developing the exposed photoresist layer, removing a deprotected protecting group, and depositing an electroless plating catalyst on the exposed surface of the plating base film. 1. A wiring pattern production method comprising:forming, on a substrate, a precursor film for a plating base film including a first formation material having an amino group protected by a photoreactive protecting group;forming a photoresist layer including a photoresist material on a surface of the precursor film;exposing the photoresist layer with a desired pattern of light;exposing the precursor film with a desired pattern of light to form the plating base film;developing the exposed photoresist layer and removing a deprotected protecting group; anddepositing an electroless plating catalyst on the exposed surface of the plating base film.2. The wiring pattern production method according to claim 1 , wherein the exposing of the photoresist layer and the exposing of the precursor film are simultaneously performed.3. The wiring pattern production method according to claim 1 , wherein claim 1 , after removing the photoresist layer claim 1 , the exposed plating base film is further exposed.4. The wiring pattern production method according to claim 1 , wherein the protecting group is an o-nitrobenzyl group or a group having an o-nitrobenzyl skeleton.5. The wiring pattern production method according to claim 1 , wherein the amino group is a group represented by —NH.6. The wiring pattern production method according to claim 1 , wherein ...

Electroless nickel plating of silicone rubber

According to the present disclosure, a method for coating nickel on an organosiloxane polymer wherein the said method comprises the steps of; forming a transition metal oxide on the organosiloxane polymer; etching the transition metal oxide with a basic solution; contacting the organosiloxane polymer comprising the etched transition metal oxide with an aqueous solution comprising a positively charged species to attach the positively charged species on the etched transition metal oxide; depositing a metal catalyst on the positively charged species; and treating the metal catalyst with an acidic solution to develop an activated organosiloxane polymer before transferring the activated organosiloxane polymer to a solution comprising nickel and/or nickel derivatives. A nickel organosiloxane composite is provided herein comprising a transition metal oxide layer and a positively charged species attached on the said oxide layer with nickel coated in the said positively charged species.

Laser direct structuring layer-forming composition, kit, and method for manufacturing resin molded article with plated layer

To form a plated layer on a surface of the resin molded article without adding the LDS additive to the thermoplastic resin composition. The laser direct structuring layer-forming composition contains a curable compound, an organic solvent, and a laser direct structuring additive.

METHOD FOR FORMATION of ELECTRO-CONDUCTIVE TRACES ON POLYMERIC ARTICLE SURFACE

The present invention relates to a production of electro-conductive traces on the surface of polymeric articles using laser excitation for the areas to be metallised, followed by activation of the laser-treated areas with a metal salt solution, the article is later rinsed in distilled water, and the activated areas are metallised in the chemical plating bath. The aims of the invention are to produce cost-effective conductive traces of the circuits for the application in 3D moulded interconnect devices, to increase the quality of the circuit traces improving the selective metallization process. An irradiation dose and scanning parameters for the surface excitation are chosen experimentally, provided that a negative static charge appears on the surface of the laser-irradiated areas. The chosen parameters ensure that any surface degradation of the polymer is avoided. The activation solution used in the method is aqueous solution consisting of one chosen salt comprising: silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), zinc (Zn), chrome (Cr), tin (Sn) salt.

[UNK]

Novel metal accelerator

A process for metal plating characterized by use of an accelerator solution of a metal reducible by stannous tin between a step of catalysis and metal deposition.

還元微粒子触媒金属

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Method for conditioning a surface of a dielectric substrate for electroless plating

Method for electroless plating metals, such as copper, onto non-conductive substrate surfaces. The method comprises bringing the surfaces into contact with an aqueous composition containing H 2 SO 4 and a multifunctional cationic copolymer containing at least two available cationic moieties and then activating the surfaces by treating them with a colloidal solution containing palladium chloride, stannous chloride and HCl. The inventive method is particularly useful in processes for producing metal circuits on substrates of glass, thermoplastics and thermosetting resins, such as epoxy cards and boards. The method is also applied in reworking substrates having already undergone copper plating and having been rejected due to failures.

Complexing agent for the treatment of metal and plastic surfaces

Die Erfindung betrifft eine Zusammensetzung zur Oberflächenbehandlung von Metallen sowie zur Abscheidung von Metallen oder Metallegierungen auf Kunststoffoberflächen, enthaltend DOLLAR A a) mindestens ein Polymer als Komponente A, enthaltend wenigstens eine Struktureinheit der Formel (I) DOLLAR F1 wobei diese Struktureinheit ein Teil einer Polymerhauptkette sein kann oder über eine Ankergruppe an eine Polymerhauptkette gebunden sein kann, und DOLLAR A M Wasserstoff oder ein Ammonium- oder Metallkation ist; DOLLAR A b) Wasser oder ein anderes Lösungsmittel, das geeignet ist, das Polymer (Komponente A) zu lösen, zu dispergieren, suspendieren oder zu emulgieren als Komponente B; DOLLAR A c) gegebenenfalls oberflächenaktive Verbindungen, Dispergiermittel, Suspendiermittel und/oder Emulgiermittel als Komponente C; DOLLAR A entweder DOLLAR A d) gegebenenfalls ein Salz, eine Säure oder eine Base, basierend auf Übergangsmetallkationen, Übergangsmetalloxoanionen, Fluorometallaten oder Lantanioden als Komponente D, und/oder DOLLAR A e) mindestens eine Säure, ausgewählt aus der Gruppe, bestehend aus Phosphorsäure, Schwefelsäure, Sulfonsäuren, Salpetersäure, Flußsäure und Salzsäure als Komponente E, oder eine Base DOLLAR A und/oder DOLLAR A f) mindestens ein Metalloxid und/oder Metallsalz als Komponente F. DOLLAR A Des weiteren betrifft die Erfindung ein Verfahren zur Oberflächenbehandlung von Metallen sowie ein Verfahren zur Abscheidung von Metallen oder Metallegierungen auf einer Metall- oder Kunststoffoberfläche, worin die Metall- oder ... The invention relates to a composition for the surface treatment of metals and for the deposition of metals or metal alloys on plastic surfaces, containing DOLLAR A a) at least one polymer as component A, containing at least one structural unit of the formula (I) DOLLAR F1, this structural unit being part of a main polymer chain may or may be attached to a polymer backbone via an anchor group and DOLLAR AM is hydrogen or an ammonium or ...

Patterning method

A method of preparing a substrate material such that it is capable of sponsoring a catalytic reaction over a pre-determined area of its surface comprising coating some or all of the substrate material with a catalytic material which is capable, once the coated substrate is introduced into a suitable catalytic reaction environment, of sponsoring a catalytic reaction over the coated areas of the substrate wherein the catalytic material is printed onto the substrate by a pattern transfer mechanism.

Method of manufacture of additive printed circuitboards using permanent resist mask

Circuit boards for electronic equipment are produced in which the circuit-forming conductor metal is deposited on a suitably catalyzed and masked resin substrate by all-electroless deposition techniques, wherein the characterizing feature of the invention is the use of a separate acceleration step after catalyzing and prior to application of a resist mask, supplementary of the usual post-masking accelerating step. Improved surface resistivity or insulation resistance in the printed circuit board and improved adhesion of the electrolessly deposited metal are achieved.

Catalytic process and systems

Method for electroplating non-metallic surfaces

The object is provided at least temporarily, with an electrically connecting surface adjacent, but outside, the area to be plated, and is also provided in the area to be plated with nuclei or particles consisting of, or containing, a metal (A) different from that (B) to be electrodeposited. The area to be plated, and at least part of the electrically connecting surface, are introduced into a plating bath having a counter-electrode and containing in solution the metal (B), with predetermined conductivity and also containing at least one component (C) which causes preferential deposition of (B) in nuclei or particles of (A) compared with deposition on surfaces consisting of (B).

Verfahren zum galvanischen metallisieren von gegenstaenden

Electroplating non-metallic surfaces

Method for electroplating non-metallic surfaces

ABSTRACT Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated with an electroplating bath comprising a component which causes the plating to preferentially occur at these sites as opposed to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out. The metal deposited is different from the metal existing at the deposition surface.

Patent DE3323476C2

Fremgangsmaade til elektroplettering af ikke-metalliske overflader

Electroplating non-metallic surfaces

In a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component (e.g. a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to the plating on surfaces of the same metal as the one plated out whereby an increased rate of plating on the site surfaces is achieved with respect to the plating reaction on a surface consisting of the metal to be plated out. The method allows non-metallic surfaces to be rapidly and uniformly electroplated, without the need to electrolessly plate the surfaces first.

IMPROVED PROCESS FOR THE ELECTROLYTIC COATING OF NON-METALLIC SURFACES

Electroplating non-metallic surfaces

Method for electroplating non-metallic surfaces

[UNK]

Metodo perfezionato di elettroplaccatura di superfici non metalliche

Werkwijze voor het elektrisch bekleden van niet-metallieke oppervlakken.

Saett att galvaniskt metallisera foeremaal med minst en icke-metallisk yta.

METHOD FOR PRODUCING PRINTED CIRCUITS

Novel precious metal sensitizing solutions

OPTICALLY CLEAR SENSITIZING SOLUTIONS FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ADHERENT ELECTROLESS METAL COMPRISE WATER AND A METAL COMPLEX CONSISTING OF (A) A PRECIOUS METAL SELECTED FROM A GROUP CONSISTING OF THE PRECIOUS METALS OF THE FIFTH AND SIXTH PREROIDS OF GROUPS VII AND I-B OF THE PERIODIC TABLE OF ELEMENTS, (B) A GROUP VI METAL OF THE PERIODIC TABLE OF ELEMENTS WHICH IS CAPABLE OF TWO VALENCE STATES AND (C) AN ANION CAPABLE FO FORMING A STABLE MOIETY WITH BOTH VALENCE STATES OF THE GROUP IV METAL, IN WHICH THE MOLAR RATIO OF (A) TO (B) TO (C) IS FROM ABOUT 1:1:3 TO 1:6.24. THE SOLUTIONS CAN BE PREPARED DIRECTLY FROM THE COMPONENTS OR, PREFERABLY BY DILUTING A CONCENTRATE. THE SOLUTIONS CAN BE STABILIZED AGAINST PRECIOU METAL SEPARATION BY ADDING AN ORGANIC MONO-OL, DIOL OR POLYOL, A FLUORINATED HYDROCARBON WETTING AGENT OR HYDROGEN FLYORIDE. PROCESS FOR RENDERING SURFACES RECEPTIVE TO THE DEPOSITION OF AN ELECTROLESS METAL ARE ALSO PROVIDED IN WHIC THERE ARE EMPLOYED THE NEW SENSITIZING SOLUTIONS.

Patent FR2122456B1

Verfahren zum galvanischen metallisieren von gegenstaenden

IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES

PERFECTED METHOD OF ELECTROPLATING OF NON METALLIC SURFACES

METHOD FOR METALLIZING A NON-METALLIC SURFACE BY ELECTROLYTIC PLATING

IMPROVED PROCESS FOR ELECTROLYTICALLY COATING NON-METALLIC SURFACES

L'INVENTION CONCERNE UN PROCEDE POUR REVETIR ELECTROLYTIQUEMENT DES SURFACES NON METALLIQUES. DES SITES METALLIQUES SONT FORMES SUR LA SURFACE A REVETIR ET CELLE-CI EST SOUMISE A UNE GALVANOPLASTIE DANS UN BAIN CONTENANT UN COMPOSANT FAISANT EN SORTE QUE LES DEPOTS SE PRODUISENT PREFERENTIELLEMENT SUR LESDITS SITES. POUR SELECTIONNER LA COMPOSITION DU BAIN, ON PEUT UTILISER LES COURBES COURANT-POTENTIEL RELATIVES AU METAL DE DEPOT 1 ET AU METAL 2 UTILISE POUR LES SITES METALLIQUES. APPLICATION: METALLISATION DE CIRCUITS IMPRIMES. THE INVENTION RELATES TO A PROCESS FOR ELECTROLYTICALLY COATING NON-METALLIC SURFACES. METAL SITES ARE FORMED ON THE SURFACE TO BE COVERED AND THIS IS SUBJECTED TO GALVANOPLASTY IN A BATH CONTAINING A COMPONENT ENSURING THAT DEPOSITS PREFERENTIALLY OCCUR ON SUCH SITES. TO SELECT THE COMPOSITION OF THE BATH, THE CURRENT-POTENTIAL CURVES RELATING TO DEPOSIT METAL 1 AND METAL 2 USED FOR METAL SITES CAN BE USED. APPLICATION: METALLIZATION OF PRINTED CIRCUITS.

Electroplating non-metallic surfaces

SET TO ELECTROPLETATE NON-METALLIC SURFACES

In a method for electroplating non-metallic surfaces on a substrate (e.g., of plating hole walls in metal clad laminates), metallic sites are formed on the surface to be plated and the resulting site-containing surface is electroplated by means of an electroplating bath comprising a component (e.g. a dye, surfactant, chelating agent, brightener, levelling agent or pyrophosphate ions) which causes the plating to preferentially occur at the sites in comparison to the plating on surfaces of the same metal as the one plated out; whereby an increased rate of plating on the site surfaces is achieved with respect to the plating reaction on a surface consisting of the metal to be plated out. The method allows non-metallic surfaces to be rapidly and uniformly electroplated, without the need to electrolessly plate the surfaces first.

Sett att elektropletera icke-metalliska ytor

Electroplating non-metallic surfaces

PROCEDURE FOR ELECTROPLETING NON-METALLIC SURFACES

Method of rendering a non-wettable surface wettable

Aqueous wetting solutions comprise stable colloids, the solid phase of which is a hydrous oxide of one or more selected elements. The solid, particulate phase of the colloid is produced by a controlled hydrolysis and nucleation reaction which continues until solid phase particles having appropriate size and surface chemistry result. Application of the wetting solutions to any known non-wettable surface renders such surface wettable, via deposition of the particles of the solid phase onto the surfaces by short order forces. The rendering of the surfaces wettable is accomplished without effecting a physical or chemical change of the surface.

Composition for bonding electroconductive metal coating to electrically nonconductive material

This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet-curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This composition is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.

Catalytic process and systems

A process is provided for conducting or catalyzing a chemical reaction on a surface by depositing on the surface an adherent monolayer of positively charged polymer particles containing an active agent distributed throughout the polymer and contacting the deposited adherent monolayer with a suitable reactant. The positively charged polymer particles have diameters of less than about 3 micrometers and preferably less than 1 micrometer. The polymer particles are suspended in water to form an aqueous colloidal dispersion. The dispersion is useful as a stable catalyst system and particularly useful for complete electroless deposition of a conductive metal on printed circuit board surfaces and the walls of throughholes formed therein.

Catalytic metal of reduced particle size

A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms and the organic suspending agent is one capable of complexing with ions of the catalytic metal. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Primer for metallising substrates

Catalytic process and systems

내용 없음. No content.

用於印刷電路板和通孔的無電極金屬化的環保穩定催化劑

催化劑包含催化金屬奈米粒子及澱粉作為穩定劑，其莫耳比能夠在存儲期間及在無電極金屬電鍍期間實現所述催化劑的穩定。所述催化劑為環保的且不含錫。所述催化劑良好黏附至包含通孔壁的印刷電路板的介電材料。

Precoating substrates before currentless wet-chemical metallising - by spraying with powder mixt. contg. non-conducting powder and (semi)precious metal cpd., and stoving to form a thin coating

Powder mixts. (I) are claimed, which are sprayed onto substrate surfaces and stoved to give a pre-coating which facilitates the deposition of adherent metal layers by a current-less wet chemical metallising process. Essential components of (I) are a non-conducting powder (II) and 0.1-10 wt.% (semi)precious metal cpd. (III), w.r.t. (I) and calcd. as metal. More specifically, (III) are complexes or inorganic salts of Cu, Au, Ag, Pt, Pd or Ru, in amts. of 0.2-8 (pref. 0.25-5) wt.%, pref. bis-(acetonitrile)-PdCl2, (Ph2P)4PD0, (Ag(NH3)2)+ complex or Ag salts such as Ag2SO4, AgNO2, AgOAc or AgMnO4. (II) is a mixt. contg. (a) a polymer, (b) 5-20 (pref. 10-15) wt.% pigment, (c) 0-70 (pref. 5-35) wt.% fillers and (d) 0-5 wt.% charge control agents (w.r.t. I). Pref. (a) is styrene/(meth)acrylaye or styrene/ethylhexyl acrylate, or a polyester from tere- or iso-phthalic acid and Bisphenol A, hexanediol or neopentyl glycol. (b) is carbon black and/or an inorganic or organic pigment, and (d) is a quat. ammonium salt. (II) has particle size 5-90 (pref. 5-50, esp. pref. 10-40) microns. USE/ADVANTAGE - (I) are useful for pretreating surfaces (e.g. of plastics) prior to metallising the surface in a current-less metallising bath. Pretreatment with (I) enables the prodn. of adherent metal coatings without pre-etching the surface with oxidising agents and without using solvents (contrast prior-art methods of pretreatment). The metallised substrates are useful, e.g. for electromagnetic screen

形成表面接枝体的方法，形成导电薄膜的方法，形成金属模的方法，形成多层线路板的方法，表面接枝材料和导电材料

本发明提供了一种形成接枝聚合物的方法，包括向含有聚酰亚胺的底物表面施加能量，所述聚酰亚胺其骨架中具有的聚合反应启动部分，在底物表面产生活性部位，并从该活性部位出发，产生直接与底物表面键合的拥有极性基团的接枝聚合物，从而获得一种表面接枝材料。本发明还提供了一种形成导电薄膜的方法，包括向含有聚酰亚胺的底物表面施加能量，所述聚酰亚胺的骨架中具有聚合反应启动部分，在底物表面产生活性部位，并从活性部位出发，产生拥有极性基团，直接与底物表面键合的接枝聚合物，使导电材料和接枝聚合物粘合，并由此获得一种导电材料。

Material for electroless plating, coating liquid for catalyst adhesion, electroless plating method, and plating method

본 발명은 촉매 부착성이 양호하고, 또한, 촉매 부착공정, 현상공정, 기타 공정에 있어서, 촉매 부착층이 비도전성 기재로부터 박리되거나 도금액에 용출되지 않고, 또한 도금층의 촉매 부착층과의 계면이 변색되는 경우가 없는 무전해 도금 형성재료를 제공하는 것을 과제로 한다. The present invention is based on the finding that the catalyst adherence is good and that the catalyst adherence layer is not peeled off from the non-conductive base material or eluted into the plating solution in the catalyst adhering step, the developing step, And an object of the present invention is to provide an electroless plating forming material which is not discolored. 상기 과제를 해결하기 위해 본 발명은, 비도전성 기재 상에 촉매 부착층을 갖는 무전해 도금 형성재료에 있어서, 상기 촉매 부착층이 비수용성 폴리에스테르 수지를 포함하고, 또한 상기 촉매 부착층 표면의 순수에 대한 접촉각이 60도 이하가 되도록 구성하는 것을 특징으로 한다. In order to solve the above problems, the present invention provides an electroless plating forming material having a catalyst adhering layer on a non-conductive substrate, wherein the catalyst adhering layer contains a water-insoluble polyester resin, Is 60 degrees or less.

Material to be plated by electroless plating and method of electroless plating on the same

본 발명은 촉매 부착성이 양호하고, 또한, 촉매 부착공정, 현상공정 및 기타 공정에 있어서, 비도전성 기재로부터 촉매 부착층이 박리하지 않는 무전해 도금 형성재료를 제공하는 것을 과제로 한다. An object of the present invention is to provide an electroless plating forming material having good catalyst adhesion, and in which the catalyst adhesion layer does not peel off from the non-conductive substrate in the catalyst deposition step, the development step, and other steps. 상기 과제를 해결하는 본 발명의 무전해 도금 형성재료는, 비도전성 기재 상에 촉매 부착층을 갖는 무전해 도금 형성재료에 있어서, 상기 촉매 부착층을 수산기를 함유해서 되는 친수성 및/또는 수용성 수지로 형성하고, 상기 기재와 상기 촉매 부착층 사이에, 수산기를 갖는 수지 및 이소시아네이트계 화합물로 형성되어 되는 경화층을 설치한다. 바람직하게는, 상기 경화층 중의 이소시아네이트계 화합물의 이소시아네이트기가 잔존하고 있는 중에, 상기 촉매 부착층을 형성하도록 구성한다. In the electroless plating forming material of the present invention which solves the above-mentioned problems, in the electroless plating forming material having a catalyst adhesion layer on a non-conductive substrate, the catalyst adhesion layer is formed of a hydrophilic and / or water-soluble resin containing a hydroxyl group. And a hardened layer formed of a resin having a hydroxyl group and an isocyanate compound between the substrate and the catalyst adhesion layer. Preferably, while the isocyanate group of the isocyanate compound in the said hardened layer remains, it is comprised so that the said catalyst adhesion layer may be formed.

Способ формирования рисунка

ÐÎÑÑÈÉÑÊÀß ÔÅÄÅÐÀÖÈß (19) RU (51) ÌÏÊ 7 (11) (13) 2003 135 208 A C 23 C 18/00 ÔÅÄÅÐÀËÜÍÀß ÑËÓÆÁÀ ÏÎ ÈÍÒÅËËÅÊÒÓÀËÜÍÎÉ ÑÎÁÑÒÂÅÍÍÎÑÒÈ, ÏÀÒÅÍÒÀÌ È ÒÎÂÀÐÍÛÌ ÇÍÀÊÀÌ (12) ÇÀßÂÊÀ ÍÀ ÈÇÎÁÐÅÒÅÍÈÅ (21), (22) Çà âêà: 2003135208/02, 23.05.2002 (71) Çà âèòåëü(è): ÊÂÈÍÅÒÈÊ ËÈÌÈÒÅÄ (GB) (30) Ïðèîðèòåò: 04.06.2001 GB 0113408.9 29.11.2001 GB 0128571.7 (43) Äàòà ïóáëèêàöèè çà âêè: 10.05.2005 Áþë. ¹ 13 (74) Ïàòåíòíûé ïîâåðåííûé: Ìèö Àëåêñàíäð Âëàäèìèðîâè÷ (87) Ïóáëèêàöè PCT: WO 02/09916 (12.12.2002) Àäðåñ äë ïåðåïèñêè: 129010, Ìîñêâà, óë. Á.Ñïàññêà , 25, ñòð.3, ÎÎÎ "Þðèäè÷åñêà ôèðìà Ãîðîäèññêèé è Ïàðòíåðû", ïàò.ïîâ. À.Â.Ìèö R U Ôîðìóëà èçîáðåòåíè 1. Ñïîñîá ïîëó÷åíè ìàòåðèàëà ïîäëîæêè, îáëàäàþùåãî ñïîñîáíîñòüþ ñîäåéñòâîâàòü êàòàëèòè÷åñêîé ðåàêöèè íà çàäàííîé îáëàñòè ñâîåé ïîâåðõíîñòè, â êîòîðîì ïîêðûâàþò âåñü èëè ÷àñòü ìàòåðèàëà ïîäëîæêè êàòàëèòè÷åñêèì âåùåñòâîì, ñïîñîáíûì ïðè ââåäåíèè ïîêðûòîé ïîäëîæêè â ïîäõîä ùóþ äë êàòàëèòè÷åñêîé ðåàêöèè ñðåäó ñîäåéñòâîâàòü êàòàëèòè÷åñêîé ðåàêöèè íà ïîêðûòûõ îáëàñò õ ïîäëîæêè, ïðè÷åì êàòàëèòè÷åñêîå âåùåñòâî îòïå÷àòàíî íà ïîäëîæêó óñòðîéñòâîì ïåðåíîñà ðèñóíêà. 2. Ñïîñîá ïî ï.1, â êîòîðîì óñòðîéñòâî ïåðåíîñà ðèñóíêà ïðåäñòàâë åò ñîáîé ñòðóéíóþ ïå÷àòü. 3. Ñïîñîá ïî ëþáîìó èç ïï.1 è 2, â êîòîðîì êàòàëèòè÷åñêèé ðåàãåíò ñîäåðæèòñ â ñîñòàâå ïå÷àòíîé êðàñêè. 4. Ñïîñîá ïî ï.3, â êîòîðîì ðåöåïòóðà ïå÷àòíîé êðàñêè ñîäåðæèò äîïîëíèòåëüíûå ñâ çóþùèå âåùåñòâà è/èëè íàïîëíèòåëè, êîòîðûå ìîæíî èñïîëüçîâàòü äë óñèëåíè êàòàëèòè÷åñêîé ðåàêöèè. 5. Ñïîñîá îñàæäåíè ìàòåðèàëà íà ïîäëîæêó â âèäå çàäàííîãî ðèñóíêà ñ ïîìîùüþ êàòàëèòè÷åñêîé ðåàêöèè, âêëþ÷àþùèé ñòàäèè: (i) ïîëó÷åíè ïîäëîæêè, ñïîñîáíîé ñîäåéñòâîâàòü êàòàëèòè÷åñêîé ðåàêöèè, ïî ëþáîìó èç ïï.1-4, è (ii) âîçäåéñòâè íà ïîëó÷åííóþ ïî ñòàäèè (i) ïîäëîæêó ïîäõîä ùåé ðåàãåíòíîé ñðåäîé ñ îñàæäåíèåì ñ ïîìîùüþ êàòàëèòè÷åñêîé ðåàêöèè ìàòåðèàëà íà ïîâåðõíîñòü ïîäëîæêè. 6. Ñïîñîá ïî ï.5, â êîòîðîì ñòàäèè (i) è (ii) ïîâòîð þò äë îñàæäåíè ìíîæåñòâà ñëîåâ ìàòåðèàëà íà ïîäëîæêó. Ñòðàíèöà: 1 A 2 0 0 3 1 3 5 2 0 8 A (54) ÑÏÎÑÎÁ ...

비전도성 플라스틱 표면들을 금속화하기 위한 프로세스

본 발명은 금속화 6가 크롬이 없는 에칭 용액을 사용하여 비전도성 플라스틱들을 금속화하기 위한 프로세스에 관한 것이다. 에칭 용액은 염소산염 이온들 및 바나듐 화합물의 소스를 포함하는 황산 용액에 기초된다. 에칭 용액으로의 플라스틱의 처리 후에, 플라스틱들은 공지된 프로세스들에 의해 금속화된다.

一种非钯活化镀铜工艺及其敏化剂、活化剂

本发明提供一种非钯活化镀铜工艺，包括以下步骤：步骤S1：除油；步骤S2：粗化：采用粗化液对工件进行粗化，然后进行超声水洗；步骤S3：敏化：将水洗后的工件放入敏化剂中敏化，敏化剂包括以下组分和浓度配比：甲基磺酸锡5‑100g/L、酒石酸1‑50g/L、抗坏血酸1‑10g/L、柠檬酸5‑50g/L、2,4‑氨基吡啶1‑20g/L、氨基硅烷偶联剂1‑10ml/L、表面活性剂1‑10ml/L；步骤S4：活化：将敏化后的工件放入活化剂中活化，活化剂包括以下组分和浓度配比：硝酸银1‑20g/L、氨水1‑50ml/L、EDTA1‑50g/L、三乙醇胺1‑20ml/L、2,4‑氨基吡啶0.5‑5g/L、磷酸酯表面活性剂0.1‑10ml/L；步骤S5：预铜；步骤S6：厚铜。本发明提供一种生产成本低、镀层结合结合力好、绿色环保的非钯活化镀铜工艺及其敏化剂、活化剂。

Thermoplastic resin composition, resin molded product, and method for producing resin molded product with plating layer

Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes

촉매는 몰비 안정제로서 촉매성 금속 및 말토덱스트린의 나노입자를 포함하며, 이는 저장 동안에, 그리고 무전해 금속 도금 동안에 촉매를 안정화한다. 촉매는 환경 친화적이고, 틴 프리(tin free)이다. 촉매는 쓰루-홀 벽을 포함하는 인쇄 회로 기판의 유전성 물질에 잘 부착된다. The catalyst comprises a catalytic metal and a nanoparticle of maltodextrin as a molar ratio stabilizer, which stabilizes the catalyst during storage and during electroless metal plating. The catalyst is environmentally friendly and tin-free. The catalyst adheres well to the dielectric material of the printed circuit board including the through-hole walls.

Synthesis of surface controlled nickel-diamond composite powders by electroless plating method

본 발명은 무전해도금법에 의한 니켈-다이아몬드 복합분말의 표면형상 제어 방법에 관한 것으로서, 그 목적은 다이아몬드 표면에 연속적인 침상의 형상과 균일하며 밀착성이 뛰어난 코팅층을 갖는 니켈-다이아몬드 복합분말 제조기술을 확립하기 위한 무전해 니켈도금법을 제공하는데 있다. The present invention relates to a method for controlling the surface shape of a nickel-diamond composite powder by an electroless plating method. The object of the present invention is to provide a nickel-diamond composite powder manufacturing technique having a continuous needle shape on the diamond surface and a coating layer having excellent uniformity and adhesion. To provide an electroless nickel plating method to establish. 본 발명의 구성은 합성다이아몬드 입자 표면에 니켈이 코팅된 복합분말을 제조하는 방법에 있어서, 전처리된 다이아몬드를 NiSO 4 · 6H 2 O, Na acetate 및 Acetic acid가 용해된 황산니켈염 코팅용액이 장입된 항온반응조에 첨가한 후 pH를 염산으로 조절하여 교반시키며 가열하는 단계와, 설정한 반응온도에 도달하면 Sodium hypophosphate와 Citric acid를 함유한 환원용액을 주기적으로 변화시키면서 일정속도로 주입하면서 반응시키는 환원반응단계로 이루어진 것을 특징으로 한다. The composition of the present invention is a method for producing a nickel-coated composite powder on the surface of the synthetic diamond particles, the nickel sulfate salt coating solution containing NiSO 4 · 6H 2 O, Na acetate and Acetic acid is charged After adding to the incubator, adjusting the pH with hydrochloric acid, stirring and heating, and reducing the reaction by injecting at a constant rate while periodically reducing the reducing solution containing sodium hypophosphate and citric acid. Characterized in consisting of steps. 복합분말, 합성 다이아몬드, 전처리, 무전해 니켈도금법, 차아인산 Composite powder, synthetic diamond, pretreatment, electroless nickel plating method, hypophosphorous acid

Metal coating method for plastic material and modeling plastic material thereof

PURPOSE: A method for plating a plastic extruded product and moldings thereof are provided to improve workability, to reduce a nickel plating process by shortening whole paltering process, and to obtain adhesion of a metal planting film. CONSTITUTION: A method for plating a plastic extruded product comprises the following steps: a step(S1) etching the plastic extruded product after degreasing the plastic extruded product; a step(S2) performing a first activation process and a second activation process; a step(S3) converting the surface of the plastic extruded product into a conductive material by plating the surface to form a conductive film; a step(S4) electrically plating the plastic extruded product after washing the product with acid; a step(S5) coating the plastic extruded product with chromic acid after washing the plastic extruded product; and a step(S6) coating the surface of the plastic extruded product with urethane-based transparent paint.

Conductive material precursor and production method for conductive material

본 발명은 미세한 도전성 패턴이라도, 충분한 전체 광선 투과율을 가진 데다가 양호한 도전성을 갖는 도전성 패턴을 형성하는 것이 가능하고, 또한 밀착성이 우수한 도전성 패턴을 형성하는 것이 가능한 도전성 재료 전구체 및 높은 생산성으로 도전성 재료를 제조하는 것이 가능한 도전성 재료의 제조 방법을 제공한다. 본 발명은 지지체와, 수용성 고분자 화합물, 가교제 및 금속 황화물을 함유하는 하지층과, 감광성 레지스트층을 이 순서로 적층하여 갖는 도전성 재료 전구체 및 지지체와, 수용성 고분자 화합물, 가교제 및 금속 황화물을 함유하는 하지층과, 감광성 레지스트층을 이 순서로 적층하여 갖는 도전성 재료 전구체의 감광성 레지스트층 면을 임의의 패턴상으로 노광 후, 현상하고, 노광한 패턴의 레지스트 화상을 형성하는 공정, 레지스트 화상을 형성한 면에 무전해 도금을 행하여 레지스트 화상에 피복되어 있지 않은 하지층 위에 도전성 패턴을 형성하는 공정, 그 후 레지스트 화상을 제거하는 공정을 포함하는 도전성 재료의 제조 방법에 관한 것이다. The present invention relates to a conductive material precursor capable of forming a conductive pattern having a sufficient total light transmittance and having a good conductivity even in the case of a fine conductive pattern and having a good adhesion property and a conductive material precursor capable of forming a conductive material with high productivity And a method of manufacturing a conductive material. The present invention relates to a conductive film comprising a support, a conductive material precursor having a water-soluble polymer compound, a crosslinking agent and a ground layer containing a metal sulfide, a photosensitive resist layer laminated in this order, and a support, and a base material containing a water-soluble polymer compound, A step of exposing and developing the surface of the photosensitive resist layer of the conductive material precursor having the conductive material precursor laminated in this order to form a resist image of an exposed pattern, A step of forming a conductive pattern on a base layer not covered with the resist image by electroless plating, and a step of removing the resist image thereafter.

镀覆部件的制造方法、镀覆部件、催化活性妨碍剂及无电解镀用复合材料

本发明提供镀覆部件的制造方法，其能够通过简易的制造工艺，抑制在规定图案以外的镀膜的生成，仅在规定图案上形成镀膜。所述镀覆部件的制造方法包括：在基材的表面形成包含具有酰胺基和氨基中的至少一者的聚合物的催化活性妨碍层；将形成了上述催化活性妨碍层的上述基材的表面的一部分进行加热或光照射；在进行了加热或光照射的上述基材的表面赋予无电解镀催化剂；使无电解镀液与赋予了上述无电解镀催化剂的上述基材的表面接触，在上述表面的加热部分或光照射部分形成无电解镀膜。

비전도성 플라스틱 표면의 금속화 방법

본 발명은 6 가 크롬이 없는 엣칭 용액을 이용한 비전도성 플라스틱의 금속화 방법에 관한 것이다. 엣칭 용액은 과망간산염 용액을 기재로 한다. 플라스틱을 엣칭 용액으로 처리한 후, 플라스틱을 공지된 방법을 수단으로 하여 금속화한다.

Electroless plating primer including hyperbranched polymer and metallic microparticles

[과제] 환경을 배려하여, 적은 공정수로 간편하게 처리할 수 있고, 또한 저비용화를 실현할 수 있는, 무전해 도금의 전처리 공정으로서 이용되는 새로운 하지제를 제공한다. [해결수단] 기재 상에 무전해 도금 처리에 의해 금속 도금막을 형성하기 위한 하지제에 있어서, 암모늄기를 분자 말단에 가지며 또한 중량평균 분자량이 500 내지 5,000,000인 하이퍼브랜치 폴리머, 및 금속 미립자를 포함하는 하지제. [PROBLEMS] To provide a new base material used as a pretreatment step for electroless plating, which can be easily treated with a small number of process water by considering the environment and can realize a low cost. [MEANS FOR SOLVING PROBLEMS] An antistatic agent for forming a metal plating film by electroless plating on a base material, comprising: a hyperbranched polymer having an ammonium group at the molecular end and having a weight average molecular weight of 500 to 5,000,000; My.

Pretreatment in the electroless plating of the polycarbonate and resins including the great part of polycarbonate for screening electromagnetic wave

Method for pretreatment of electroless plating for shielding electro-magnetic wave of polycarbonate and above 70% of polycarbonate contain-ing resin product is described. Thus, polycarbonate or above 70% of polycarbonate containing resin product is treated with mixed solution of 56 wt.% of 1,3-dichloro-2-propanol, 8 wt.% of sodium alkylnaphtha-lene sulfate and 36 wt.% of distilled water and water at the ratio of 4 : 6 at 43-50 deg.C for 1-6 min, etched with 400 g/l of anhydrous chromic acid and 200-250 g/l of sulfuric acid at 60-65 deg,C for 3-8 min, washed, treated with 2.5 wt.% of neutralizer which is mixed 18 wt.% of hydroxylamine sulfate and 82 wt.% of distilled water, and 8.7 wt.% of hydrochroric acid at 48-60 deg.C for 2-4 min, washed, mixed with 7 wt.% of mixed liquid of 80 wt.% of ethylenediamine and 20 wt.% of distilled water, 7 wt.% of hydrochloric acid(35%) and 86 wt.% of water at 37-39 deg.C for 1-2 min, and washed.

Method for metal plating on synthetic resin product

중금속이 포함되지 않은 합성수지제품의 표면에 다양한 패턴(pattern)으로 형성 가능하고, 밀착력이 우수한 도금층을 형성하는, 합성수지제품 도금 방법이 개시된다. 개시된 합성수지제품 도금 방법은, 합성수지제품 표면의 도금 영역에 레이저(laser)를 조사(照射)하여 표면에 미세 기공(氣孔)을 형성하는 레이저 활성 단계, 합성수지제품의 표면에 금속 촉매 흡착을 촉진하는 흡착 촉진 물질이 부착되도록 촉진 용액에 합성수지제품을 침지(浸漬)하는 촉매 흡착 촉진 단계, 합성수지제품을 금속 촉매 용액에 침지하여 금속 촉매를 합성수지제품의 표면에 흡착시키는 금속 촉매 흡착 단계, 합성수지제품을 에칭 용액에 침지하여, 합성수지제품 표면에서 흡착 촉진 물질을 제거하고 도금 영역 이외의 합성수지제품 표면에서 금속 촉매를 제거하는 에칭 단계, 및 금속 촉매를 시드(seed)로 하여 도금 영역에 금속을 무전해 도금하는 무전해 도금 단계를 구비한다. Disclosed is a synthetic resin product plating method capable of forming a plating layer having excellent adhesion, which can be formed in various patterns on the surface of a synthetic resin product containing no heavy metal. The disclosed synthetic resin product plating method includes a laser activation step of forming a fine pore on a surface by irradiating a laser to a plating area on the surface of a synthetic resin product, an adsorption step of promoting the adsorption of the metal catalyst on the surface of the synthetic resin product A catalyst adsorption step of immersing the synthetic resin product in a promoting solution so as to adhere the promoter, a metal catalyst adsorption step of adsorbing the metal catalyst on the surface of the synthetic resin product by dipping the synthetic resin product in the metal catalyst solution, An etching step of removing the adsorption promoting material from the surface of the synthetic resin product to remove the metal catalyst from the surface of the synthetic resin product other than the plating area and a step of electroless plating the metal in the plating area using the metal catalyst as a seed, And a plating step.

Method for producing catalysts consisting of metal of the platinum group by means of electroless deposition and the use thereof for the direct synthesis of hydrogen peroxide.

Conductive metal plated polyimide substrate including coupling agent and method for producing the same

본 발명에 따른 커플링 에이전트를 포함하는 전도성 금속 도금 폴리이미드 기판은 표면의 이미드 링이 에칭되어 개열된 폴리이미드막층; 및 상기 폴리이미드막에 무전해 도금 방식으로 형성된 제 1 전도성 금속박막, 및 상기 제 1 전도성 금속 박막 상에 전해 도금 방식으로 형성된 제 2 전도성 금속 박막을 포함하는 전도성 금속 박막층;을 포함한다. 여기서, 상기 개열된 이미드 링에 소정의 커플링 에이전트가 결합되어, 상기 폴리이미드막층에 극성이 부여되어 있다. A conductive metal plated polyimide substrate comprising a coupling agent according to the present invention comprises: a polyimide film layer in which an imide ring on a surface is etched and cleaved; And a conductive metal thin film layer including a first conductive metal thin film formed on the polyimide film by an electroless plating method, and a second conductive metal thin film formed on the first conductive metal thin film by an electrolytic plating method. Here, a predetermined coupling agent is bonded to the cleaved imide ring, and polarity is given to the polyimide membrane layer. 폴리이미드, 구리, FCCL, COF, FPCB Polyimide, copper, FCCL, COF, FPCB

Metal plating method

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Method of producing adherent metallic film

A method of producing an adherent metallic film for a thermoplastic or thermoset polymeric substrate to provide radio frequency shielding of electromagnetic interference. The polymeric substrate is prepared for application of the metallic film by application of a primer. The primer is an organic-based coating having a dispersion of silica gel to enhance the microscopic surface area and improve adhesion. The silica gel has an average particle size of approximately 20 microns and forms 2-10% of the mixture by weight. A catalyst may be added to the primer to promote curing. The metallic film is preferably zinc and may be applied by either flame or arc spraying technique, or electroless plating of the primed surface.