СПОСОБ ХИМИЧЕСКОЙ ОБРАБОТКИ И ГАЛЬВАНИЧЕСКОГО НАНЕСЕНИЯ ПОКРЫТИЯ НА ДЕТАЛИ И АВТОМАТИЧЕСКАЯ КАМЕРА ОСУЩЕСТВЛЕНИЯ ЭТОГО СПОСОБА

Группа изобретений относится к способу химической обработки и гальванического нанесения покрытия на детали и автоматической камере для химической обработки и гальванического нанесения покрытия на детали упомянутым способом. В способе детали загружают внутрь ванн, размещенных в герметизируемой камере, и выполняют технологические операции при погружении деталей в соответствующий раствор, барботируемый инертным газом. Перед всеми операциями осуществляют вытеснение инертным газом воздуха из камеры с обеспечением одновременного полного связывания остатков кислорода атмосферы внутри камеры при подаче дождем нагретого раствора сульфитов щелочных металлов, и осуществляют циркуляцию обескислороженного инертного газа путем его откачки из упомянутой камеры и возврата в ванны для барботажа, при этом давление в камере поддерживают на уровне давления вне камеры за счет восполнения утечки инертного газа из камеры. Выполнение всех операций в ваннах осуществляют без переноса деталей при последовательной ...

СПОСОБ ПОЛУЧЕНИЯ ЗАЩИТНОГО ПОКРЫТИЯ

Изобретение относится к области машиностроения, а именно к способам получения гальванических покрытий с последующей термообработкой для защиты от коррозии стальных изделий. Способ включает последовательное электролитическое нанесение на деталь цинкового слоя, а затем оловянного слоя с последующей термической обработкой детали, при этом на упомянутый оловянный слой дополнительно наносят цинковый слой или цинковый слой и последующий оловянный слой, а термическую обработку детали проводят в одну стадию при температуре не менее чем на 18,5°С ниже температуры плавления цинк-оловянной эвтектики. Техническим результатом изобретения является повышение защитной способности покрытия и предотвращение образования продуктов коррозии. 4 з.п. ф-лы, 2 табл., 1 ил., 5 пр.

МЕТАЛЛИЧЕСКАЯ ПРОВОЛОКА ДЛЯ АРМИРОВАНИЯ ИЗДЕЛИЙ, ИЗГОТАВЛИВАЕМЫХ ИЗ ЭЛАСТОМЕРНОГО МАТЕРИАЛА, ИЗДЕЛИЕ ИЗ СМЕСИ СЕТЧАТЫХ ЭЛАСТОМЕРНЫХ МАТЕРИАЛОВ, СОДЕРЖАЩЕЕ АРМИРУЮЩУЮ МЕТАЛЛИЧЕСКУЮ ПРОВОЛОКУ С ПОКРЫТИЕМ, И АВТОМОБИЛЬНАЯ ШИНА, СОДЕРЖАЩАЯ АРМИРУЮЩУЮ МЕТАЛЛИЧЕСКУЮ ПРОВОЛОКУ С ПОКРЫТИЕМ

Изобретение относится к металлической проволоке для армирования изделий, изготовляемых из эластомерных материалов, особенно, шин для транспортных средств. Проволока, о которой идет речь, имеет покрытие, образованное двумя концентрическими слоями сплавов цинка с никелем и цинка с кобальтом, и внутренний слой покрытия имеет содержание цинка большее, чем 90%, в то время, как наружный слой имеет содержание никеля или кобальта большее, чем 50%. 2 с. и 11 з.п. ф-лы, 5 табл.

Способ получения композиционного металл-дисперсного покрытия, дисперсная система для осаждения композиционного металл-дисперсного покрытия и способ ее получения

Изобретение относится к получению композиционного металл-дисперсного покрытия, а также к дисперсной системе и ее получению и может быть использовано в медицинской деятельности, транспорте, атомной, военной, авиационной и космической областях. Способ получения указанного покрытия включает осаждение как минимум одного слоя металлической пленки посредством химического или электрохимического осаждения из раствора или электролита соответственно, содержащего источник ионов осаждаемого вещества и дисперсную систему. До и после осаждения каждого из слоев проводят обработку поверхности промывкой водой, сушкой, обработкой химическими веществами, механической обработкой, термической обработкой или несколькими из них. Дисперсная система состоит из смеси жидкой дисперсной среды в виде воды, твердой дисперсной фазы и стабилизатора. В качестве твердой дисперсной фазы используют смесь как минимум двух веществ в виде диспергированных частиц, выбранных из группы, содержащей углерод, силицид, карбид, нитрид ...

Композиционное металл-алмазное покрытие, способ его получения, алмазосодержащая добавка электролита и способ ее получения

Изобретение относится к области получения металл-алмазного покрытия путем химического или электрохимического осаждения из раствора или электролита, содержащего источник ионов осаждаемого металла и алмазосодержащую добавку. Покрытие выполнено в виде двухслойной металлической пленки и содержит первый слой осажденного металла, выбранного из определенной группы, и нанесенный на него второй слой из металла указанной группы с диспергированными в ней частицами синтетического углеродного алмазосодержащего вещества. Покрытие получают путем осаждения первого слоя посредством химического или электрохимического осаждения из раствора или электролита, содержащего источник ионов осаждаемого металла. Затем осаждают второй слой путем электрохимического осаждения из электролита, содержащего источник ионов осаждаемого металла и дисперсную систему, состоящую из смеси жидкой дисперсной среды, твердой дисперсной фазы и стабилизатора. В результате повышаются эксплуатационно-технические характеристики покрытия ...

Способ получения углеграфитового композиционного материала

Изобретение относится к области металлургии, а именно к созданию композиционных материалов пропиткой пористого каркаса, имеющих высокую электропроводность, антифрикционные свойства, стойкость в агрессивных средах. Технический результат достигается в способе получения углеграфитового композиционного материала, включающем вакуумную дегазацию пористой углеграфитовой заготовки в растворе электролита, нанесение на пористую заготовку медьсодержащего гальванического покрытия, ее пропитку в камере пропитки расплавом матричного сплава сурьмы под воздействием избыточного давления за счет термического расширения расплава свинца в камере давления при нагреве на 100°С выше температуры ликвидус матричного сплава одновременно с расплавом свинца, при этом в качестве раствора электролита используют состав, содержащий 40 г/л сернокислой меди, 40 г/л сернокислого олова, 8 г/л фенола, 70 г/л серной кислоты, 0,0005 г/л тиомочевины, и наносят гальваническое покрытие, состоящее из 80% меди и 20% олова. Техническим ...

Многослойные магниторезистивные нанопроволоки

Изобретение относится к области материалов для использования в магнитосенсорных и магнитометрических устройствах, устройствах записи-считывания информации. Многослойные магниторезистивные нанопроволоки состоят из чередующихся ферромагнитных и медных слоев, при этом в качестве ферромагнитных слоев используются слои никель-железо с толщинами 10-30 нм, а толщины медных слоев – 2-5 нм и суммарное количество пар слоев от 100 до 10 000. Технический результат - получение многослойных магниторезистивных нанопроволок NiFe/Cu с коэффициентами ГМР -18.4…-19.2% и величиной поля насыщения ГМР эффекта 0,001-0,0015 Тл. 3 пр., 3 ил.

МЕТАЛЛИЧЕСКИЕ МАТЕРИАЛЫ С ВНЕДРЕННЫМИ ЛЮМИНЕСЦЕНТНЫМИ ЧАСТИЦАМИ

... 1. Способ осаждения металлического слоя, содержащего внедренные люминесцентные частицы, на металлическую положку, включающий:- смешивание люминесцентных частиц с металлическим материалом для получения раствора для нанесения покрытия;- помещение металлической подложки в раствор для нанесения покрытия; и- осуществление процесса нанесения покрытия для покрытия металлической подложки металлическим слоем, при этом металлический слой содержит внедренные люминесцентные частицы.2. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом нанесения покрытия способом химического восстановления.3. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом нанесения покрытия погружением.4. Способ по п.1, отличающийся тем, что процесс нанесения покрытия является процессом электроосаждения.5. Способ по п.4, отличающийся тем, что процесс электроосаждения включает вращающийся барабан, в котором находится металлическая подложка при помещении в раствор для ...

СЛОИСТЫЙ КОМПОЗИТНЫЙ МАТЕРИАЛ ДЛЯ ЭЛЕМЕНТОВ СКОЛЬЖЕНИЯ, СПОСОБ ЕГО ПРОИЗВОДСТВА И ЕГО ПРИМЕНЕНИЯ

... 1. Слоистый композитный материал для элементов скольжения, состоящий из несущего слоя, наносимый на поверхность элемента скольжения, выполненный из сплава, включающего медь или алюминий, и слой скольжения, расположенный поверх вышеупомянутого слоя, причем слой скольжения включает 90-99,6 мас.% олова или оловянного сплава с долей олова более 60 мас.% и 0,2-6 мас.% частиц твердой смазки, имеющей твердость по Моосу ≤ 3 и размер частиц ≤ 10 мкм, причем частицы твердой смазки представляют собой комбинацию частиц сульфида олова(IV) и частиц графита, частиц сульфида олова(IV) и частицы сульфида молибдена(IV) или частиц графита и частиц сульфида молибдена(IV).2. Слоистый композитный материал по п.1, отличающийся тем, что слой скольжения дополнительно содержит 0,2-4 мас.% частиц твердого материала, имеющего твердость по Моосу ≥ 8 и размер частиц ≤ 5 мкм.3. Слоистый композитный материал по п.1 или 2, отличающийся тем, что слой скольжения состоит из 90-99,6 мас.% олова или оловянного сплава с долей ...

Verfahren zum elektrochemischen Beschichten und Einbau von Partikeln in die Schicht

Verfahren zum Beschichten eines Werkstücks (11), auf dem elektrochemisch eine Schicht (26) hergestellt wird, in die Partikel (27, 30) eines Feststoffes eingebaut werden, dadurch gekennzeichnet, dass die einzubauenden Partikel (27, 30) mit einem thermischen Spritzverfahren auf das Werkstück (11) aufgebracht werden und anschließend durch das elektrochemische Beschichten in die Schicht (26) eingebaut werden, wobei die Schicht (26) in mehreren Lagen (28) hergestellt wird, indem das thermische Spritzverfahren und das elektrochemische Beschichten mehrfach im Wechsel durchgeführt werden.

BEHANDLUNG VON KUPFERBLAETTERN.

Verfahren zum Beschichten von Bleigitterbändern, daraus hergestellte Bleigitter und deren Verwendung

Verfahren zur Beschichtung von Bleigitterbändern für Elektroden von Bleibatterien, hergestellt nach dem Gießwalz- oder dem Conroll-Verfahren oder aus gewalztem Bleiwerkstoffband, das nachträglich durch Stanzen, nach dem Streckmetallverfahren oder einem anderen strukturierenden Verfahren weiterverarbeitet worden ist, dadurch gekennzeichnet, dass das Bleigitterband kontinuierlich durch ein galvanisches Bad oder mehrere nacheinander angeordnete galvanische Bäder geführt wird, in dem beziehungsweise in denen Bleilegierungen enthalten sind, die auf dem Band als einlagige oder mehrlagige Schicht niedergeschlagen werden.

VERFAHREN ZUR HEISSPRESSBEARBEITUNG VON EINEM PLATTIERTEN STAHLPRODUKT

Verbessertes, korrosionsbeständiges, oberflächenbeschichtetes Stahlblech.

Formstuecke mit Edelmetallueberzuegen

VERFAHREN ZUM VERBESSERN DER BINDEFESTIGKEIT VON KUPFERFOLIE

GRADIERTE METALLKOMPONENTE FÜR EINE ELEKTROCHEMISCHE ZELLE

HOCHPRÄZIONS-MEHRKORN-SCHNEIDMESSER

Verfahren zum Herstellen von Gleitlager-Schichtwerkstoff oder Gleitlager-Schichtwerkstücken

Sliding engine component

PLATED STEEL PRODUCTS

Process for Covering Radio-Active Balls with metal, and Radio-Active Balls Covered with Metal by this process

... 1,183,159. Radio-active sources. R. CARDIS. 5 Nov., 1968 [7 Nov., 1967], No. 52332/68. Heading G6R. Balls of radio-active material are covered with metal by first applying one or more metal coatings and then applying further metal layers in a series of electrodeposition operations between each of which the previous layer is decontaminated. Glass or ceramic balls containing Cs 137 may be coated with silver by spraying and then carrying out the electrodeposition, using new silver salt solutions for each stage, and washing with dilute acid between the stages. The radio-active balls may be used in a tubular support together with non-radio-active balls to form mobile trains for medical and other use.

Improvements in or relating to the production of bright coatings of tin or tin alloys on iron and steel

... 448,288. Electrodeposition of tin and tin alloys. THOMAS & CO., Ltd., R., Bush House, Aldwych, and KIEFT, A. W., Kendale, Hampstead Lane, both in London, and MEHL, E., 6, Claremont Villas, Mumbles, and SMETANA, O., 126, Eaton Crescent, both in Swansea. March 7, 1935, No. 7146. [Class 41] A thin layer of tin or a tin alloy is deposited on iron or steel strips or other articles; this is then heated above the melting point and quenched and a further thicker layer of the metal is deposited. Heating may be effected in oil, a molten salt mixture or a suitable gas. In an example the base metal is degreased electrolytically in an alkaline bath, pickled in 10 per cent sulphuric acid at 50‹ C. and a deposit of tin of 3 gms. per sq. metre is applied electrolytically. This is heated to 280‹ C. in a flux of zinc chloride and ammonium chloride and quenched in hot water and a further deposit of tin of 6 gms. per sq. metre is applied. This is also melted.

METHOD OF MAKING A PLAIN BEARING SLIDING LAYER

DIFFUSION CLADDING FE-CONTAINING BASE MATERIAL

STRIP/WIRE MATERIAL

Sliding member

Strip or wire material

Band or wire shaped material consisting of a metal alloy containing at least phosphorus and tin, for example, phosphor bronze or a similar material, and comprisng an outer coating made of a tin-lead alloy. When the phosphorus content of the metal alloy ranges from 0.03 to 0.13 percent by weight, and preferably from 0.05 to 0.06 percent by weight, the tin content of the metal alloy is greater than or equal to 7 percent by weight. When the tin content amounts to less than 7 percent by weight of the metal alloy, the phosphorus content is greater than 0.13 percent by weight of the alloy, and preferably is between 0.27 and 0.35 percent by weight of the alloy.

AN ELECTRONIC CONDUIT AND A METHOD OF MANUFACTURING IT

ZINC COATED WIRE

Ferrous base article and method of making same

A steel tyre bead reinforcing wire has the following percentage compositions:-C 0.65; Mn 0.8; P 0.015; S 0.025; Si 0.095; Fe Balance. Specification 425,297 is referred to.

METHOD OF PLATING METALS

... 1525868 Multiple metal coatings on Zn or Al STAUFFER CHEMICAL CO 26 Feb 1976 [18 April 1975] 7613/76 Headings C7B and C7F An Al or Zn substrate has an intermediate metal coating 0À005-3 mils thick diffusion bonded both to the substrate and to an outer metal coating of Cu or Ni. The intermediate layer comprises 0À01- 99À99% Cu and/or Ni and 99À99-0À01% Sn and may optionally contain Zn. A final outer layer e.g. Cr may be applied. Any coating method is useful. Diffusion is effected by heating after plating the metals. The intermediate layer may be applied as single metal layers in thicknesses corresponding to the desired composition in the final layer. A stannate bath for activating Al prior to electroless Ni plating contains K 2 S n O 3 . 3H 2 O, Na gluconate and KOH.

Method of forming a pressure vessel

A method of forming a pressure vessel comprising forming a metallic layer 103, such as a copper layer of between 1µm and 300µm, on a removable mandrel 101 with an electrodeposition process, treating the surface of the metallic layer to increase at least one of its surface roughness and surface area, forming a composite layer 105, such as a fibre-reinforced resin layer on the treated surface of the metallic layer, and removing the mandrel from the formed vessel to form an internal cavity having the desired vessel configuration.

PROCEDURE FOR THE TREATMENT OF HOT-PRESSING OF A PLATED STEEL PRODUCT

MEHRSCHICHTLAGER

SLIDING ELEMENT

VERFAHREN ZUR HERSTELLUNG EINES MIT KAUTSCHUK VERBINDBAREN VERSTAERKUNGSDRAHTES

VERFAHREN ZUR HERSTELLUNG VON BAND- BZW. DRAHTFOERMIGEM MATERIAL

PROCEDURE FOR THE PRODUCTION OF A CAMP GLIDE LAYER

PROCEDURE FOR THE ELECTROLYTIC SEPARATION SHEET ZINC COATED BY MAGNESIUM OR MAGNESIUM ZINC ON

ANTIFRETTINGSCHICHT

ELEKTROCHEMISCHES BESCHICHTUNGSVERFAHREN

The electrochemical coating process for depositing layers on a metallic or non-metallic workpiece with a metallic coating in a deposition bath, comprises applying 2-12 layers on a workpiece surface with different processes in a deposition sequence (P), which is repeated once. Different single sequences (A, B, C) are provided within the deposition sequence with different deposition processes. Each single sequence has a specific deposition process. The deposition sequence comprises a direct current deposition followed by a pulsed deposition. The layer is applied using a plasma oxide process. The electrochemical coating process for depositing layers on a metallic or non-metallic workpiece with a metallic coating in a deposition bath, comprises applying 2-12 layers on a workpiece surface with different processes in a deposition sequence (P), which is repeated once. Different single sequences (A, B, C) are provided within the deposition sequence with different deposition processes. Each single ...

Plain Bearing Element

Die Erfindung betrifft ein Gleitlagerelement (1) umfassend eine Stützschicht (2) und eine Gleitschicht (3), wobei die Gleitschicht (3) aus Silber oder aus Silber mit einem Maximalgehalt an weiteren Metallen von 5 Gew.-%, ausgewählt aus einer Gruppe bestehend aus Cu, Sb, Mo, Co, besteht, wobei die Gleitschicht (3) eine Mikrostruktur mit Körnern (6, 7) aufweist und eine Gleitschichtdicke (12) hat, wobei sich die Mikrostruktur über die Gleitschichtdicke (12) von einem globularen Habitus der Körner (7) im Bereich einer der Stützschicht (2) näheren zweiten Oberfläche (9) der Gleitschicht (3) in einen zumindest annähernd stengeligen Habitus mit einer Längserstreckung (10) der Körner (7) im Bereich einer der Stützschicht (2) entfernteren ersten Oberfläche (8) der Gleitschicht (3) ändert.

PROCEDURE FOR THE PRODUCTION OF A PLATED THROUGH PRINTED CIRCUIT BOARD

ELECTRICAL CONTACT COATED WITH AN AMORPHOUS TRANSITION ALLOY THE EVEN COATED WITH A GOLD FILM IS.

FLEXIBLE GRAVURE SLEEVE.

METAL WIRE WITH TWO COAT LAYERS FOR REINFORCING ARTICLES FROM ELASTOMEREM MATERIAL AS WELL AS SUCH REINFORCED ARTICLES

PRODUCTION MATS OF A SURFACE ON A LAYER OF METAL.

ENDOPROSTHESIS WITH GALVANIC SILVER LAYER

Threaded joint for steel tubes

Metal material for electronic components and method for producing same

Provided are: a metal material for electronic components, which has low insertion/removal resistance, low occurrence of whiskers and high durability; and a method for producing the metal material for electronic components. A metal material (10) for electronic components, which is provided with: a base (11); a layer A (14) that constitutes the outermost layer of the base (11) and is formed of Sn, In or an alloy of these elements; and a layer B (13) that is arranged between the base (11) and the layer A (14) so as to constitute an intermediate layer and is formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy of these elements. The outermost layer (the layer A (14)) has a thickness of 0.002-0.2 m, and the intermediate layer (the layer B (13)) has a thickness of 0.001-0.3 m.

Optically transparent films for measuring optically thick fluids

A multilayered film and a method for performing spectroscopic measurements in a fluid are provided. The multilayered film includes a substrate; a porous layer adjacent to the substrate; and a reflective layer formed on the porous layer, wherein the porous layer selectively allows a component of a fluid to be optically measured when the multilayered film is immersed in the fluid. A sensor for spectroscopic measurements in crude oil samples including a multilayered film as above is also provided. A method of manufacturing a multilayered film for spectroscopic measurements in fluids as above is also provided.

Article, method, and apparatus for electrochemical fabrication

Electrolytic copper foil having a modified shiny side

TIN-ELECTROPLATED STEEL SHEETS

PERFORATED METAL PRODUCT OBTAINED BY ETCHING, PROCESS FOR FORMING STARTING MATERIAL THEREFOR AND ETCHING PROCESS

METHOD FOR ELECTROCHEMICAL FABRICATION INCLUDING ENHANCED DATA MANIPULATION

HIGH PRECISION MULTI-GRIT SLICING BLADE

An abrasive cutting blade is provided to achieve high-quality surface finishes at high feed rates. The blade is fabricated by electroplating fine abrasive onto a steel cathode disc to form a first layer, followed by electroplating a second layer of coarser abrasive onto the first layer. A third layer of fine abrasive is then electroplated onto the second layer. The resulting composite is then removed from the cathode disc to form a multi-grit, multi-layer, hub- less blade.

METALLIC STRUCTURES WITH VARIABLE PROPERTIES

Variable property deposit, at least partially of fine-grained metallic material, optionally containing solid particulates dispersed therein, is disclosed. The electrodeposition conditions in a single plating cell are suitably adjusted to once or repeatedly vary at least one property in the deposit direction. In one embodiment denoted multidimension grading, property variation along the length and/or width of the deposit is also provided. Variable property metallic material deposits containing at least in part a fine-grained microstructure and variable property in the deposit direction and optionally multidimensionally, provide superior overall mechanical properties compared to monolithic fine-grained (average grain size: >20 micron) or entirely amorphous metallic material deposits.

FLEXIBLE GRAVURE SLEEVE

A flexible gravure sleeve. A flexible thinwalled sleeve for gravure printing is provided, which, going from inside to outside, essentially consists of 1) a slightly conical layer of nickel to provide mechanical strength, 2) a layer of copper, having the structure of high-gloss copper and which is essentially free of internal stresses, said layer having a cylindrical outer surface, 3) a thin, cylindrical layer of hard copper having a structure suitable for electronic engraving and having a gravure pattern on its outer surface, and if desired, 4) a thin protective layer of chrome. These layers are all firmly adhered to each other and especially the two layers of copper cannot be separated by peeling off.Since a high-gloss copper layer, which is free of internal stresses, has been found unsuitable for electronic engraving, and since the layer of hard copper, suitable for electronic engraving, has been found to have internal stresses, which would be unacceptable in the first layer of copper ...

CHROMATE-TREATED ZINC-PLATED STEEL STRIP AND METHOD FOR MAKING

... 28 A chromate-treated steel strip comprising a chromate film on a zinc plated steel strip is improved in corrosion resistance and coating adherence by forming the chromate film of three layer structure consisting of a metallic Cr layer, a Cr3+ oxide layer, and an outermost surface layer of SiO2 and Cr3+ oxide plus Cr6+ oxide. The three layered chromate film is deposited on a zinc plated steel strip by effecting cathodic electrolysis in a bath containing hexavalent chromium, colloidal silica, optional alumina sol, and a fluoride, by supplying electricity at a specific current density to a controlled quantity.

HIGH CORROSION RESISTANT PLATED COMPOSITE STEEL STRIP AND METHOD OF PRODUCING SAME

An electroplated composite steel strip having a high corrosion resistance comprises a steel strip substrate and a corrosion resistant coating layer which comprises at least a base plating layer comprising a zinc-based metal matrix, a number of corrosionpreventing fine solid particles consisting essentially of core fine particles of, for example, chromate, phosphate or aluminum, molybdenum or titanium compounds, and encapsulated by very thin coating membranes consisting of, for example, SiO2 , Al2O3 , ZrO2 or TiO2 , and optionally a number of additional fine particles consisting essentially of, for example, SiO2 , TiO2 , Cr2O3 , Al2O3 , ZrO2 , SnO2 or Sb2O5.

CONTINUOUS GALVANIZING AND DRAWING PROCESS

ANTICORROSIVE OVERLAP-COATED IRON OR STEEL MATERIAL

METHOD OF MAKING ABRASION RESISTANT COATING FOR ALUMINUM BASE ALLOY

ELECTROPLATED CORROSION RESISTANT STEELS AND METHOD FOR MANUFACTURING SAME

LIFT PLUNGERS WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND METHODS FOR PRODUCING THE SAME

Described herein are coated lift plungers, which have improved hardness, durability, and corrosion resistance, as well as methods of making, reworking, and using the same.

SATIN COPPER BATH AND METHOD OF DEPOSITING A SATIN COPPER LAYER

An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.

A PRESS HARDENING METHOD

The present invention relates a press hardening method comprising the provision of a carbon steel sheet coated with a barrier pre-coating comprising nickel and chromium wherein the weight ratio Ni/Cr is between 1.5 and 9.

METHODS AND COMPOSITIONS FOR ELECTROCHEMICAL DEPOSITION OF METAL RICH LAYERS IN AQUEOUS SOLUTIONS

Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.

COMPOSITE METALLIC MATERIALS, USES THEREOF AND PROCESS FOR MAKING SAME

A lightweight, high strength and corrosion resistant composite metallic m aterial is disclosed herein. The composite metallic material typically compr ises a high-to-weight ratio, low density core material; and a corrosion resi stant protective refractory metal layer. The method for making the composite metallic material comprises the steps of surface activating the core materi al and forming a refractory metal on the surface of the surface activated co re material by physical, chemical or electrochemical processes. Such a compo site material is suitable for making biomaterials, corrosion resistant equip ment and industrial electrodes.

PLATED POLYMER COMPRESSOR

Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric material of the polymeric substrate may be structurally reinforced with materials that may include carbon, metal, or glass. The polymeric substrate may also include a plurality of layers to form a composite layup structure.

TOOLING HAVING A DURABLE METALLIC SURFACE OVER AN ADDITIVELY FORMED POLYMER BASE AND METHOD OF FORMING SUCH TOOLING

A tool and a method for forming a tool are disclosed. The tool has a base layer additively formed from a polymer material in a desired tool shape. In addition, a sealant layer is formed over an outer surface the base layer. The sealant is a low- modulus material such as a silicone rubber or an elastomer. In one embodiment, the sealant is made electrically conductive by the addition of a filler to the low-modulus material. The filler material may be one of carbon black, carbon fibers, graphene, carbon nanotubes, and metallic whiskers, for example. In another embodiment, the sealant is not electrically conductive and an electrically conductive layer is formed over the sealant layer. Finally, a metallic coating, preferably multilayer, is formed over the sealant layer by electroplating or electrodeposition.

ENHANCED TECHNIQUES FOR PRODUCTION OF GOLDEN BRONZE BY INTER-DIFFUSION OF TIN AND COPPER UNDER CONTROLLED CONDITIONS

Golden bronze appearance article, multiple-layer substrate, related methods and uses thereof, particularly for coinage blanks. Methods of producing an article having a golden bronze appearance include annealing a multiple-layer substrate at an annealing temperature for an annealing residence time. The multiple-layer substrate includes a 10 core, contiguous to a copper layer and subsequent tin layer. The annealing temperature and annealing residence time are controlled in accordance with each other for allowing diffusion of the tin layer into the copper layer and producing an annealed substrate comprising an inter-diffused outer bronze layer having a golden appearance. The tin layer thickness is in accordance to the copper layer thickness such that the inter-diffused outer bronze layer has a tin content between about 8%wt. and about 15.8%wt. The core has a sufficiently low content of nickel to reduce or prevent formation of intermetallic compound comprising tin and nickel proximate to the ...

ELECTRODE FOR ELECTROLYTE CELL, USE THEREOF AND PROCESS

L'électrode est placée dans une enveloppe définissant une chambre (78) et dont une paroi est formée d'une membrane (77) permettant le passage d'ions à travers celle-ci. L'enveloppe présente une ouverture ( 100) pour alimenter la chambre d'un électrolyte et une ouverture (101) pour évacuer de la chambre de l'électrolyte. Une telle électrode est utile dans des procédés et/ou installations pour le dépôt ou l'élimination électrolytique continu d'une couche de métal pour une bande (3).

ELECTROPLATED STEEL SHEET HAVING A PLURALITY OF COATINGS, EXCELLENT IN WORKABILITY, CORROSION RESISTANCE AND WATER-RESISTANT PAINT ADHESIVITY

COPPER WIRE AND PROCESS FOR MAKING COPPER WIRE

This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177 ~C for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration ...

Verfahren zum Versilbern von Metallgegenständen, insbesondere von Tafelgeräten, Besteckteilen etc.

Verfahren zur Gewinnung einer starken galvanischen Goldauflage auf einer Unterlage.

Verfahren zur elektrolytischen Auftragung von Rhenium auf einen metallenen Untergrund und nach diesem Verfahren erhaltener Rheniumüberzug.

Elektrische Entladungsröhre mit vergoldeten Kontaktorganen

Verfahren zum Verbleien von metallischen Gegenständen.

Procédé de protection des métaux contre la corrosion

Procédé de fabrication de dispositifs magnétiques de mémoire

Procédé pour gainer de métal une bille de matériau radio-actif, bille de matériau radio-actif gainée de métal par la mise en oeuvre de ce procédé et utilisation de telles billes

Verzinnungsverfahren, insbesondere für Lötstellen

Procédé de revêtement électrolytique

Objet et procédé de fabrication de celui-ci

Gold plating metal substrates for semi- - conductor element casings

Several Au layers are consecutively applied to a metal substrate, partic, semi-conductor material, such as Si, starting with a first thin adherent, dense Au intermediate layer, pref. applied after pickling, and pref. deposited from acid electrolyte contg. brightener, followed by electrodeposition of thicker pure Au top layer, pref. >=2 mu m thick, which is deposited from alkaline electrolyte pref. with high CN content, advantageously with Alu:CN (free) ratio =1. Pref. current density in electrolyte is so low that deposition rate is 3-6 mu m/hr.

Procédé de revêtement électrolytique et pièce revêtue selon ce procédé

Gold-plated article

For electrolytic gold-plating of a metal article, a barrier layer made of tungsten/cobalt or tungsten/nickel alloy is first deposited by electrolysis of a neutral bath containing sodium tungstate, cobalt or nickel sulphate, ammonium citrate and aminotrimethylphosphonic acid as chelating agent. This barrier layer effectively counteracts the diffusion of the base metal into the gold coating, the thickness of which is less than 1.25 mu , when the gold-plated article is heated.

[...][...] LE [...][...] D'UN [...] DE [...][...][...] -OR.

PROCEDURE FOR THE SURFACE PRETREATMENT THE OF MERCURY NOT WETTABLE METALS OR YOUR ALLOYS BEFORE THE AMALGAMIEREN.

PROCEDURE FOR OCCUPYING AN AUSTENITIC STAINLESS ONE OF STEEL MATERIAL WITH AN ALLOY ON BASIS BY OUTER ONES, PT AND/OR PD.

METHOD OF DIFFUSION CLADDING FE-CONTAINING BASE MATERIAL

PROCEDURE FOR APPLYING COATINGS.

Silver plating of electrical sliding contact to give long-term self-lubrication and cold welding resistance

In multi-stage silver plating of electrical sliding contacts, involving pretreatment, including pre-electroplating with silver, and then dispersion electroplating in a silver bath, dispersed ion-active organic components are added to the silver bath. Independent claims are also included for (a) the silver bath used; and (b) contacts produced in this way.

A method of manufacturing a decorative element of a watch strap and said member.

La présente invention concerne un procédé de fabrication dun élément décoratif (10) dun bracelet de montre comprenant des maillons articulés, ledit élément décoratif (10) étant destiné à prendre place sur une articulation entre deux maillons. Ledit procédé comprend les étapes suivantes: préparation dun moulage sacrificiel (14) correspondant à la forme de lélément décoratif (10), dépôt dau moins une couche dun matériau métallique recouvrant lensemble du moulage (14), élimination du moulage sacrificiel (14) pour former un élément décoratif (10) comprenant un corps creux, formation de deux orifices (12) destinés au passage dun élément de fixation de lélément décoratif (10), et éventuellement, traitement de surface de lélément décoratif (10) obtenu.

Printed circuit board and method of manufacturing the same

Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a first circuit layer including a first metal layer and a first plating layer provided on an outer side of the first metal layer and embedded in one surface of the insulating layer; a second circuit layer including a second metal layer and a second plating layer provided on an outer side of the second metal layer and embedded in the other surface of the insulating layer; and a bump interconnecting the first circuit layer and the second circuit layer while penetrating through the insulating layer. The bump is used, such that there is no need to perform hole plating. Therefore, an increase in the surface plating thickness due to the hole plating is previously prevented.

Mechanisms for forming copper pillar bumps using patterned anodes

The mechanisms of preparing bump structures described by using patterned anodes may simplify bump-making process, reduce manufacturing cost, and improve thickness uniformity within die and across the wafer. In addition, the mechanisms described above allow forming bumps with different heights to allow bumps to be integrated with elements on a substrate with different heights. Bumps with different heights expand the application of copper post bumps to enable further chip integration.

Electrolytic gold or gold palladium surface finish application in coreless substrate processing

Electronic assemblies including coreless substrates having a surface finish, and their manufacture, are described. One method includes electrolytically plating a first copper layer on a metal core in an opening in a patterned photoresist layer. A gold layer is electrolytically plated on the first copper layer in the opening. An electrolytically plated palladium layer is formed on the gold layer. A second copper layer is electrolytically plated on the palladium layer. After the electrolytically plating the second copper layer, the metal core and the first copper layer are removed, wherein a coreless substrate remains. Other embodiments are described and claimed.

Metal cord, rubber-cord complex and pneumatic tire using the same

Rubber-cord complex 9 having improved wet heat adhesive property between rubber and cord. The rubber-cord complex includes cord 10 comprising drawn plated wire 17 prepared by providing brass plated layer 16 E on surface of element wire 15 and drawing the resulting plated wire and rubber 12 vulcanized and bonded to cord 10 . The rubber-cord complex 9 has adhesion reaction layer 25 (formed by cross-linking sulfur and copper) between rubber 12 and brass plated layer 16 E. Adhesion reaction layer 25 has average thickness of 50-1,000 nm. Interface S between adhesion reaction layer 25 and the rubber has a fractal dimension of 1.001-1.300 in a wet heat deterioration state after being subjected to vulcanization to bond rubber 12 thereto and being held at a temperature of 50-100° C. and a humidity of 60-100% for one hour to 20 days.

Process for the electrolytic copper plating of zinc diecasting having a reduced tendency to blister formation

In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150° C.

Method for Electrochemical Fabrication

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors

A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

Housing and manufacturing method

A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.

Control of electromagnetic signals of coins through multi-ply plating technology

The present invention relates to novel metallic composites that are useful as coinage materials. These composites are produced through a multi-ply plating process and are designed to overcome difficulties associated with calibrating vending machines that can result in fraud. In one embodiment, the metallic composite comprises a steel core over which nickel and then a non-magnetic metal such as copper, brass or bronze is deposited as a layered pair. The magnetic and non-magnetic metals may also be applied in the reverse order, with the copper, brass or bronze applied directly over the steel and then covered by the nickel. The electromagnetic signature (EMS) of the composite is controlled by defining the thickness of the deposited metal layers. Advantageously, the invention overcomes problems associated when different coins are made from the same alloy and have similar sizes, and therefore cannot be distinguished by vending machines.

Electroplating method for depositing continuous thin layers of indium or gallium rich materials

An electrochemical deposition method to form uniform and continuous Group IIIA material rich thin films with repeatability is provided. Such thin films are used in fabrication of semiconductor and electronic devices such as thin film solar cells. In one embodiment, the Group IIIA material rich thin film is deposited on an interlayer that includes 20-90 molar percent of at least one of In and Ga and at least 10 molar percent of an additive material including one of Cu, Se, Te, Ag and S. The thickness of the interlayer is adapted to be less than or equal to about 20% of the thickness of the Group IIIA material rich thin film.

Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part

A silver-coated composite material for movable contact parts, which has: an underlying layer composed of any one of nickel, cobalt, a nickel alloy, and a cobalt alloy at least provided on a part of the surface of a stainless steel substrate; an intermediate layer composed of copper or a copper alloy provided thereon; and a silver or silver alloy layer provided thereon as an outermost layer, wherein a thickness of the intermediate layer is 0.05 to 0.3 μm, and wherein an average grain size of the silver or silver alloy provided as the outermost layer is 0.5 to 5.0 μm.

Templated circuitry fabrication

A method of making templated circuitry employs a template system that includes a template of an insulator material on a carrier having a conductive surface. The template includes multiple levels and multiple regions, wherein a first level exposes the conductive surface of the carrier. A first metal is electrochemically deposited on the conductive surface in first regions of the first level. A circuit material is deposited to cover the first metal. The template is etched until a second level of the template exposes the conductive surface in second regions on opposite sides of the first regions. A second metal is electrochemically deposited on the conductive surface in the second regions. The template of deposited materials is transferred from the carrier to a substrate.

Method of plating stainless steel and plated material

The method of plating a stainless steel substrate including depositing a first plating metal layer over the stainless steel substrate), forming an interdiffusion layer in which elements of the stainless steel substrate and elements of the first plating metal layer interdiffuse, by applying a heat treatment to the stainless steel substrate coated by the first plating metal layer, and coating a second plating metal layer over the surface of the stainless steel substrate over which the interdiffusion layer is coated.

Method for Manufacturing Resonance Tube, Resonance Tube, and Filter

A method for manufacturing a resonance tube includes: mixing powder materials, to form homogeneous powder particles, where the powder materials comprise iron powder with a weight proportion of 50% to 90%, at least one of copper powder and steel powder with a weight proportion of 1% to 30%, and an auxiliary material with a weight proportion of 1% to 20%; pressing and molding the powder particles, to form a resonance tube roughcast; sintering the resonance tube roughcast in a protective atmosphere, to form a resonance tube semi-finished product; and electroplating the resonance tube semi-finished product, to form the resonance tube. In the method, the resonance tube, and the filter according to embodiments of the present invention, the resonance tube is manufactured by using multiple powder materials.

Metal Surface and Process for Treating a Metal Surface

An article having a metal surface is treated to have one or more desired effects, such as desired functional properties or a desired cosmetic appearance. The surface is anodized to create an oxide layer having pores therein and a metal deposition process is performed to deposit multiple different metals within the pores. A pretreatment act, such as degreasing, chemical etching, chemical polishing, and desmutting can also be conducted on the surface prior to anodization. The surface can also be dyed, sealed, and polished.

Incorporating High-Purity Copper Deposit As Smoothing Step After Direct On-Barrier Plating To Improve Quality Of Deposited Nucleation Metal In Microscale Features

Techniques disclosed herein a method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a substrate. Techniques include creating a separation or smoothing layer between a nucleation layer process and a metallization or gapfill process. The addition of such a separation layer avoids dissolving a seed layer and gapfill complications from remnant organic material. Techniques include adding a conformal copper smoothing layer step after applying a direct on-barrier nucleation layer. The smoothing layer adds a sufficient thickness so that the gapfill chemistry does not erode the nucleation layer. The smoothing layer can also provide a high-purity copper film that will not detrimentally interact with the TSV gapfill chemistry. This smoothing layer can also provide a surface with consistent roughness to allow uniform adhesion of the organic additives in the TSV gapfill chemistry to create a filling profile that is void-free. 1. A method for coating surfaces of microscale features fabricated into a substantially planar upper surface of a substrate , the method comprising:providing a substrate having a barrier layer that conforms to both an upper planar surface of said substrate and conforms to surfaces of microscale features fabricated into said upper planar surface of said substrate, wherein said barrier layer comprises a metal-containing film that inhibits metal diffusion into said substrate;plating a nucleation layer directly onto said barrier layer on said surfaces of said microscale features by exposing said substrate to a first liquid-phase plating chemistry containing a metal for metal plating, and causing said first liquid-phase plating chemistry to fully contact said surfaces of said microscale features, said first liquid-phase plating chemistry causing deposition and adhesion of the metal directly onto said barrier layer within said microscale features, the deposition and adhesion yielding a ...

ADHESION PROMOTION OF CYANIDE-FREE WHITE BRONZE

White bronze is electroplated from a cyanide-free tin/copper bath onto a void inhibiting layer coating a copper underlayer. The void inhibiting metal layer includes one or more void inhibiting metals. 1. A method comprising:a) depositing a metal layer comprising one or more void inhibiting metals adjacent a copper containing layer; andb) electroplating a tin/copper alloy layer from a cyanide-free tin/copper electroplating bath adjacent the metal layer comprising the one or more void inhibiting metals.2. The method of claim 1 , wherein the one or more void inhibiting metals are chosen from zinc claim 1 , zinc alloy claim 1 , bismuth claim 1 , bismuth alloy and nickel.3. The method of claim 2 , wherein the zinc alloy comprises at least 4% zinc.4. The method of claim 2 , wherein the bismuth alloy comprises at least 10% bismuth.5. The method of claim 1 , wherein the metal layer comprising the one or more void inhibiting metals is at least 0.02 μm thick.6. The method of claim 5 , wherein the metal layer has a thickness of 0.05 μm to 10 μm.7. The method of claim 1 , wherein the tin/copper layer is at least 0.01 μm to 20 μm thick.8. An article made according to the method of .9. The article of claim 8 , wherein the article is a component of an electronic device or a decorative part. This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Application No. 61/529,088, filed Aug. 30, 2011, the entire contents of which application are incorporated herein by reference.The present invention is directed to adhesion promotion of cyanide-free white bronze on a copper or copper alloy underlayer. More specifically, the present invention is directed to adhesion promotion of cyanide-free white bronze on a copper or copper alloy underlayer where the white bronze is electroplated from a cyanide-free white bronze electroplating bath onto a metal layer containing void inhibiting metals coating the copper or copper alloy underlayer.Methods for ...

Fuel cell separator material, and fuel cell stack using the same

Provided are: a separator material for a fuel cell, in which a uniform first Au-plated layer having a thickness of 0.5 - 4 nm is formed on one surface of a metal thin plate and a uniform second Au-plated layer having a larger thickness than that of the first Au-plated layer is formed on the other surface of the metal base material, wherein the covering rate of each of the cross-sections of the first Au-plated layer and the second Au-plated layer is 80% or more as observed on a transmission electron microscope, and which can have excellent corrosion resistance even when the thicknesses of the Au-plated layers formed on the surface of the base material are small, and can be produced at reduced cost; and a separator for a fuel cell and a fuel cell stack, each of which is produced using the separator material.

Method to realize flux free indium bumping

A method to realize flux free indium bumping process includes several steps including substrate metallization, contact holes opening, underbump metallization (UBM) layer thickening, indium bump preparation and Ag layer coating. The method can be used in the occasion for some special application, e.g., the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, where the usage of flux is prohibited.

Lithium-ion secondary battery, electrode for the secondary battery, and electrolytic copper foil for electrode for the secondary battery

To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm 2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 10 17 to 5×10 20 atoms/cm 3 , and sulfur (S) and nitrogen (N) each in a concentration of 10 15 to 10 19 atoms/cm 3 .

Secondary battery

A secondary battery including a circuit board unnecessitating a cut-out portion is provided. The secondary battery includes a battery cell having a cell tab, a protective circuit module electrically connected to the cell tab and having a circuit pattern formed therein, and a connection tab attached to the protective circuit module and electrically connected to the circuit pattern, wherein the connection tab includes a conductive layer adhered to the protective circuit module and including a first plating layer formed on the conductive layer and a second plating layer formed on the first plating layer, and the cell tab is welded to the connection tab.

Edgeless pulse plating and metal cleaning methods for solar cells

A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.

PROCESS FOR CORROSION PROTECTION OF IRON CONTAINING MATERIALS

The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved. 1. A process for corrosion protection of an iron-containing substrate comprising , in this order , the steps of(i) providing a substrate made of an iron-containing material,(ii) electroplating onto said substrate a first zinc-nickel alloy layer having a nickel concentration in the range of 6 to 15 wt.-%,(iii) thereon, electroplating a second zinc-nickel alloy layer having a nickel concentration in the range of 12 to 30 wt.-% onto the first zinc-nickel alloy layer with the proviso that the concentration of nickel in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer, and(iv) depositing a black passivation layer onto the second zinc-nickel alloy layer.2. The process for corrosion protection of a substrate according to wherein the substrate is made of cast iron.3. The process for corrosion protection of a substrate according to wherein the concentration of nickel in the first zinc-nickel alloy layer ranges from 10 to 15 wt.-%.4. The process for corrosion protection of a substrate according to wherein the concentration of nickel in the first zinc-nickel alloy layer ranges from 12 to 15 wt.-%.5. The process for corrosion protection of a substrate according to wherein the concentration of nickel in the second zinc-nickel alloy layer ranges from 13 to 20 wt.-%.6. The process for corrosion protection of a substrate according to wherein the concentration of nickel in the second zinc-nickel ...

HARD ALUMINUM FILMS FORMED USING HIGH CURRENT DENSITY PLATING

The described embodiments relate generally to aluminum films and methods for forming aluminum films. Methods involve providing aluminum films having increased hardness. Methods involve using higher than conventional current densities during plating of aluminum on substrates. The higher current density plating creates aluminum films with grain structures that are different from conventional plated aluminum films. In some embodiments, the average grain sizes are smaller in the hard aluminum films than conventional plated aluminum films. In some embodiments, the plated aluminum layer is anodized. In some embodiments, a multi-layered aluminum coating is formed using a combination of high current density and low current density plating. In some embodiments, a current filter is used to provide uniform plating across a part. 1. A method of forming a multi-layered aluminum coating on a substrate , the method comprising:electrodepositing a first portion of the aluminum layer on the substrate using a first current density causing the first portion to have a first average grain size; andelectrodepositing a second portion of the aluminum layer on the first portion of the aluminum layer using a second current density, lower than the first current density, causing the second portion of the aluminum layer to have a second average grain size larger than the first average grain size.2. The method of claim 1 , further comprising:converting at least part of the second portion to an aluminum oxide layer.3. The method of claim 2 , further comprising:converting least part of the first portion to a second aluminum oxide layer.4. The method of claim 1 , wherein the first average grain size ranges from about0.1 and about 4.0 micrometers.5. The method of claim 1 , wherein the first portion is characterized as having a hardness value greater than a hardness value of the second portion.6. The method of claim 1 , wherein the second portion is optically brighter than the first portion.7. The ...

Selective Solar Absorber Having a Thick Corrosion-Resistant Passivation and Thermal Barrier Layer for High Temperature Applications and its Process of Preparation

A selective solar thermal absorber capable of operating at high temperatures in a corrosive environment, including, successively stacked, a substrate, a selective solar coating, configured in order to absorb a large part of the solar radiation while re-emitting as little as possible of thermal infrared radiation at high temperatures when it is not corroded, and a corrosion-resistant barrier layer. The corrosion-resistant barrier layer is a thick passivation layer which is thermally stable, which has a low optical refractive index and which is optically transparent to solar radiation, the thickness being adjusted as a function of the operating temperature and of the effectiveness of the third material in order to prevent the diffusion of constituent components of the corrosive environment. 1. Selective solar thermal absorber capable of operating at high temperatures in a corrosive environment , comprising , successively stacked:a substrate composed of a first material,a selective solar coating composed of a second material,a corrosion-resistant barrier layer composed of a third material,characterized in that:the corrosion-resistant barrier layer is a passivation layer having an optical refractive index of less than or equal to 2 over the range of wavelengths between 0.3 μm and 10 μm and being transparent to the radiation of the solar spectrum for which the wavelength is between 0.3 μm and 2.5 μm,and in that the thickness of the said corrosion-resistant barrier is greater than or equal to 0.5 μm.2. Selective solar thermal absorber according to claim 1 , wherein said corrosion-resistant barrier layer is also transparent to the radiation for which the wavelength is between 2.5 μm and 10 μm.3. Selective solar thermal absorber according to claim 1 , wherein the said corrosion-resistant barrier layer exhibits a transmittance of greater than or equal to 90%.4. Selective solar thermal absorber according to claim 1 , wherein claim 1 , the said selective solar coating ...

COIL UNIT FOR THIN FILM INDUCTOR, MANUFACTURING METHOD OF COIL UNIT FOR THIN FILM INDUCTOR, THIN FILM INDUCTOR AND MANUFACTURING METHOD OF THIN FILM INDUCTOR

A coil unit for the thin film inductor includes an insulating material and a coil pattern. The coil pattern includes an inner plating layer embedded in the insulating layer, a growth conductive layer formed on a surface of the inner plating layer and formed on a top surface and a bottom surface of the insulating layer and an outer plating layer formed on the top surface and the bottom surface of the insulating material by plating and growing based on the growth conductive layer. 1. A coil unit for a thin film inductor comprising:an insulating material and a coil pattern,wherein the coil pattern includes:an inner plating layer embedded in the insulating layer;a growth conductive layer formed on a surface of the inner plating layer and formed on a top surface and a bottom surface of the insulating layer; andan outer plating layer formed on the top surface and the bottom surface of the insulating material by plating and growing based on the growth conductive layer.2. The coil unit for the thin film inductor according to claim 1 , wherein the inner plating layer includes:a first inner plating layer embedded from the bottom surface of the insulating material; anda second inner plating layer embedded from the top surface of the insulating layer.3. The coil unit for the thin film inductor according to claim 2 , wherein at least one of the first and the second inner plating layers is formed of a plurality of plating layers.4. The coil unit for the thin film inductor according to claim 1 , wherein the outer plating layer is formed by anisotropic plating.5. The coil unit for the thin film inductor according to claim 1 , wherein the outer plating layer is formed by unidirectional plating.6. The coil unit for the thin film inductor according to claim 1 , wherein a width of the growth conductive layer is smaller than a width of the inner plating layer.7. The coil unit for the thin film inductor according to claim 1 , wherein further comprises:an insulating resist formed on the ...

METALLIC FOAM BODY WITH CONTROLLED GRAIN SIZE ON ITS SURFACE, PROCESS FOR ITS PRODUCTION AND USE THEREOF

The invention relates to a metallic foam body, comprising 1. A metallic foam body , comprising(a) a metallic foam body substrate made of at least one metal or metal alloy A; and(b) a layer of a metal B present on at least a part of the surface of the metallic foam body substrate (a),wherein A and B differ in the grain size of the metal or metal alloy, wherein the grain size of the metal or metal alloy A is in the range of 1 μm to 100 μm and/or the grain size of the metal B is in the range of 1 nm to 50 μm; andwherein the metal B is silver and the metal or metal alloy A is selected from a group consisting of Ni, Cr, Co, Cu, Ag, and any alloy thereof; (i) provision of a porous organic polymer foam;', '(ii) deposition of at least one metal or metal alloy A on the porous organic polymer foam;', '(iii) burning off of the porous organic polymer foam to obtain the metallic foam body substrate (a); and', '(iv) deposition by electroplating of the metallic layer (b) of a metal or metal alloy B at least on a part of the surface of the metallic foam body (a);, 'obtainable by a process comprising the steps'} (ii1) deposition of a first metallic layer containing a metal or metal alloy A1 by a chemical or physical vapor deposition method; and', '(ii2) deposition of a second metallic layer containing a metal or metal alloy A2 by electroplating;, 'wherein step (ii) comprises the steps'}wherein the metal or metal alloy A1 is selected from a group consisting of Ni, Cr, Co, Cu, Ag, and any alloy thereof and wherein A2 and B are silver.2. A metallic foam body according to claim 1 , wherein A and B differ in the crystal grain size of the metal or metal alloy.3. A metallic foam body according to claim 1 , wherein the average thickness of the first metallic layer is up to 0.1 μm and the average thickness of the second metallic layer is from 5 to 50 μm.4. A metallic foam body according to claim 1 , wherein the porous organic polymer foam is selected from the group consisting of polyurethane ...

FE-NI-P ALLOY MULTI-LAYER STEEL SHEET AND MANUFACTURING METHOD THEREFOR

The present disclosure relates to an Fe—Ni—P alloy multilayered steel sheet and a method of manufacturing the same. 1. An Fe—Ni—P alloy multilayered steel sheet comprising:an Fe—Ni alloy layer including 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole; andan Fe—P alloy layer including 6 wt % to 12 wt % of P, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole,wherein the Fe—Ni alloy layer and the Fe—P alloy layer are alternately laminated on each other several times.2. The Fe—Ni—P alloy multilayered steel sheet of claim 1 , wherein the Fe—P alloy layer has an amorphous base structure claim 1 , and includes claim 1 , with respect to the total volume 100% of microstructures of the alloy layer claim 1 , less than 5% of an FeP phase claim 1 , an FeP phase claim 1 , or a combination thereof.3. The Fe—Ni—P alloy multilayered steel sheet of claim 2 , wherein the Fe—P alloy layer includes less than 50% of crystal grains having a grain size of 10 nm or less claim 2 , with respect to the total volume 100% of microstructures of the Fe—P alloy layer.4. The Fe—Ni—P alloy multilayered steel sheet of claim 3 , wherein the Fe—Ni alloy layer has an amorphous base structure claim 3 , and includes less than 50% of crystal grains having a grain size of 10 nm or less claim 3 , with respect to the total volume 100% of microstructures of the Fe—Ni alloy layer.5. The Fe—Ni—P alloy multilayered steel sheet of claim 1 , wherein the Fe—Ni alloy layer and the Fe—P alloy layer are alternately laminated on each other one time to ten times.6. A method of manufacturing an Fe—Ni—P alloy multilayered steel sheet claim 1 , the method comprising:preparing an electroforming substrate;electrodepositing an Fe—Ni alloy layer on a surface of the electroforming substrate;electrodepositing an Fe—P alloy layer on a surface of the Fe—Ni alloy layer;laminating the two kinds of alloy layers in multiple layers by ...

Optically Transparent Films for Measuring Optically Thick Fluids

A multilayered film for performing spectroscopic measurements in a fluid are provided. The multilayered film includes a substrate; a porous layer adjacent to the substrate; and a reflective layer formed on the porous layer, wherein the porous layer selectively allows a component of a fluid to be optically measured when the multilayered film is immersed in the fluid. A sensor for spectroscopic measurements in crude oil samples including a multilayered film as above is also provided. A method of manufacturing a multilayered film for spectroscopic measurements in fluids as above is also provided.

Plated instrumentation probes and sensors

A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.

METHOD FOR PRODUCING MATT COPPER DEPOSITS

The present invention relates to a method for deposition of a matte copper coating wherein a first copper layer is deposited from an aqueous copper electrolyte which does not contain an organic compound comprising divalent sulfur. A second copper layer is then deposited onto the first copper layer from an aqueous copper electrolyte comprising a first and a second water soluble sulfur-containing additive wherein the first water soluble sulfur-containing compound is an alkyl sulfonic acid derivative and the second water soluble sulfur-containing additive is an aromatic sulfonic acid derivative. The method provides copper layers with a homogeneous and adjustable matte appearance for decorative applications. 2. The method for deposition of a matte copper coating according to wherein the at least one polyether compound in the first electrolyte is selected from the group consisting of polyalkylene glycols and polyglycerines.3. The method for deposition of a matte copper coating according to wherein the at least one polyether compound in the first electrolyte is selected from the group consisting of poly(1 claim 1 ,2 claim 1 ,3-propantriol) claim 1 , poly(2 claim 1 ,3-epoxy-1-propanol) and derivatives thereof.5. The method for deposition of a matte copper coating according to wherein the molecular weight of the compounds according to formulae (1) claim 4 , (2) and (3) ranges from 160 to 6000 g/mol.6. The method for deposition of a matte copper coating according to wherein the concentration of the at least one polyether compound in the first electrolyte ranges from 0.005 g/l to g/l.7. The method for deposition of a matte copper coating according to wherein the first water soluble sulfur-containing additive in the second electrolyte is selected from the group consisting of compounds according to formulae (4) and (5):{'br': None, 'sup': 1', '2, 'sub': 2', 'n', '3, 'RS—(CH)—SOR\u2003\u2003(4)'}{'br': None, 'sup': 3', '3, 'sub': 3', '2', 'm', '2', 'm', '3, 'RSO—(CH)—S—S—(CH)— ...

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

A bonding wire for a semiconductor device includes a Cu alloy core material and a Pd coating layer formed on a surface thereof, and the boding wire contains one or more elements of As, Te, Sn, Sb, Bi and Se in a total amount of 0.1 to 100 ppm by mass. The bonding longevity of a ball bonded part can increase in a high-temperature and high-humidity environment, improving the bonding reliability. When the Cu alloy core material further contains one or more of Ni, Zn, Rh, In, Ir, Pt, Ga and Ge in an amount, for each, of 0.011 to 1.2% by mass, it is able to increase the reliability of a ball bonded part in a high-temperature environment of 170° C. or more. When an alloy skin layer containing Au and Pd is further formed on a surface of the Pd coating layer, wedge bondability improves.

GROWTH METHOD OF DENDRITIC CRYSTAL STRUCTURE THAT PROVIDES DIRECTIONAL HEAT TRANSFER

A growth method of dendritic crystal structure that provides directional heat transfer, including the steps: A. providing a substrate, whereby the substrate is provided with a plurality of crystal defects; B. depositing a plurality of metal ions on the substrate using a deposition method, whereby the metal ions on the crystal defects enable the growth of dendritic crystals. Moreover, an interspace is provided between each of the dendritic crystals. Hence, when the substrate is in contact with a heat source, heat energy is transferred from the substrate in the growth direction of the dendritic crystals; or, when the dendritic crystals are disposed at the position of a heat source, heat provided by the heat source is transferred from the dendritic crystals in a direction toward the substrate. Accordingly, the fractal structure of the dendritic crystals is used to provide ample heat dissipation areas and contact areas. 1. A growth method of dendritic crystal structure that provides directional heat transfer , comprising the following steps:a) providing a substrate, whereby the substrate is provided with a plurality of crystal defects separated at intervals;b) depositing a plurality of metal ions on the substrate using a deposition method, whereby the metal ions on the crystal defects enable the growth of dendritic crystals, and an interspace is provided between each of the dendritic crystals.2. The growth method of dendritic crystal structure that provides directional heat transfer according to claim 1 , wherein in step (a) claim 1 , processing is carried out on the substrate to form the crystal defects.3. The growth method of dendritic crystal structure that provides directional heat transfer according to claim 2 , wherein the processing includes a cutting process.4. The growth method of dendritic crystal structure that provides directional heat transfer according to claim 1 , wherein in step (a) claim 1 , the substrate is plated with a whisker layer claim 1 , and ...

MATERIAL AND PROCESS FOR ELECTROCHEMICAL DEPOSITION OF NANOLAMINATED BRASS ALLOYS

Described herein are methods of preparing nanolaminated brass coatings and components having desirable and useful properties. Also described are nanolaminated brass components and plastic and polymeric substrates coated with nanolaminated brass coatings having desirable and useful properties. 157.-. (canceled)58. An article , comprising: a nanolaminated brass coating comprising periodic layers of electrodeposited species , microstructures , or both , the nanolaminated brass coating having a first thickness and a first composition ,wherein the nanolaminated brass coating has an ultimate tensile strength, a flexural modulus, a modulus of elasticity, a stiffness ratio, or a combination thereof that is greater than an ultimate tensile strength, a flexural modulus, a modulus of elasticity, a stiffness ratio, or a combination thereof of a homogenous brass coating having a second thickness that is substantially equivalent to the first thickness and a second composition that is substantially equivalent to the first composition.59. The article of claim 58 , further comprising a mandrel that is separable from the nanolaminated brass coating.60. The article of claim 58 , further comprising a polymeric substrate that has been rendered conductive.61. The article of claim 60 , wherein the polymeric substrate comprises ABS claim 60 , ABS/polyamide blend claim 60 , ABS/polycarbonate blend claim 60 , a polyamide claim 60 , a polyethylene imine claim 60 , a poly ether ketone claim 60 , a poly ether ether ketone claim 60 , a poly aryl ether ketone claim 60 , an epoxy claim 60 , an epoxy blend claim 60 , a polyethylene claim 60 , a polycarbonate claim 60 , or a combination thereof.62. The article of claim 60 , wherein the polymeric substrate comprises glass or mineral fillers claim 60 , or is reinforced by carbon fiber or glass fiber claim 60 , or a combination thereof.63. The article of claim 60 , wherein the flexural modulus of the nanolaminated brass coating exhibits about a three- ...

Surface-treated steel sheet, metal container, and method for producing surface-treated steel sheet

There is provided a surface-treated steel sheet ( 1 ) comprising: a tin-plated steel sheet ( 10 ) obtained by tin-plating a steel sheet ( 11 ); a phosphate compound layer ( 20 ) containing tin phosphate formed on the tin-plated steel sheet ( 10 ); and an aluminum-oxygen compound layer ( 30 ) formed on the phosphate compound layer ( 20 ), a main constituent of the aluminum-oxygen compound layer being an aluminum-oxygen compound.

Low stress property modulated materials and methods of their preparation

The technology described herein sets forth methods of making low stress or stress free coatings and articles using electrodeposition without the use of stress reducing agents in the deposition process. The articles and coatings can be layered or nanolayered wherein in the microstructure/nanostructure and composition of individual layers can be independently modulated.

TIN-PLATED STEEL SHEET AND METHOD FOR MANUFACTURING THE SAME

A method of manufacturing a tin-plated steel sheet includes forming an Sn-containing plating layer on at least one surface of a steel sheet so that the mass per unit area of Sn is 0.05 to 20 g/m; forming a first chemical conversion coating by immersing the steel sheet in a first chemical conversion solution containing tetravalent tin ions and phosphate ions or cathodically electrolyzing the steel sheet in the first chemical conversion solution; forming a second chemical conversion coating after forming the first chemical conversion coating without drying the steel sheet by immersing the steel sheet in a second chemical conversion solution containing 5 to 200 g/L of aluminum phosphate monobasic and having a pH of 1.5 to 2.4 or cathodically electrolyzing the steel sheet in the second chemical conversion solution; and drying the steel sheet. 1. A method of manufacturing a tin-plated steel sheet comprising:{'sup': '2', 'forming an Sn-containing plating layer on at least one surface of a steel sheet so that the mass per unit area of Sn is 0.05 to 20 g/m;'}forming a first chemical conversion coating by immersing the steel sheet in a first chemical conversion solution containing tetravalent tin ions and phosphate ions or cathodically electrolyzing the steel sheet in the first chemical conversion solution;forming a second chemical conversion coating after forming the first chemical conversion coating without drying the steel sheet by immersing the steel sheet in a second chemical conversion solution containing 5 to 200 g/L of aluminum phosphate monobasic and having a pH of 1.5 to 2.4 or cathodically electrolyzing the steel sheet in the second chemical conversion solution; anddrying the steel sheet.2. The method according to claim 1 , wherein the drying is performed at a temperature lower than 60° C.3. The method according to claim 1 , further comprising removing excess first chemical conversion solution prior to forming the second conversion coating.4. The method according ...

Electrodeposited, Nanolaminate Coatings and Claddings for Corrosion Protection

Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings. 1112-. (canceled)113. An electrodeposition method for producing a corrosion resistant multilayer coating or cladding for protecting a substrate from corrosion caused by oxidation or reduction , comprising:a) placing a mandrel or a substrate to be coated in a first electrolyte containing zinc ions and one or more of: Fe ions, Mn ions, Ti ions, Mg ions, Ni ions, ceramic particles, polymer particles, or a combination thereof;b) applying electric current and varying in time one or more of: the amplitude of the electrical current, electrolyte temperature, electrolyte additive concentration, or electrolyte agitation, in order to produce multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited species microstructures, wherein variations in said nanoscale layers of said electrodeposited species or electrodeposited species microstructure result in galvanic interactions between the layers; andc) growing a multilayer coating under such conditions until the desired thickness of the multilayer coating is achieved; andwherein said nanoscale layers are continuous layers that are all less noble than the substrate; andwherein the layer thickness of at least one of the nanoscale layers of alloys is selected from the group consisting of between 5 and 25 nanometers, 25 nanometers and 100 nanometers, and between 100 nanometers and 400 nanometers.114. The method of claim 113 , wherein all of the layers that periodically vary comprise Zn and Fe; or wherein all of the layers that periodically vary comprise Zn and Ni.115. The method according to claim 113 , ...

TERMINAL PAIR AND CONNECTOR PAIR INCLUDING TERMINAL PAIR

A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions. 110-. (canceled)11. A terminal pair comprising a first terminal provided with a first contact portion and a second terminal provided with a second contact portion , and being configured to be used by bringing the first contact portion and the second contact portion into contact with each other , whereinthe first contact portion comprises a composite covering layer formed over a first base material made of a metal, the composite covering layer comprising two phases that are a Sn—Pd based alloy phase and a Sn phase, one of the two phases being dispersed in the other of the two phases,the first contact portion has a surface including the Sn—Pd based alloy phase and the Sn phase,the second contact portion comprises a Cu—Sn alloy layer formed over a second base material made of a metal and a Sn layer covering part of the Cu—Sn alloy layer,the second contact portion has a surface including a Cu—Sn alloy region and a Sn region, the Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer, the Sn region corresponding to an exposed portion of the Sn layer, anda coefficient of friction for ...

TIN ALLOY ELECTROPLATING SOLUTION FOR SOLDER BUMPS INCLUDING PERFLUOROALKYL SURFACTANT

Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps. 1. A tin-based electroplating solution , comprising:tin methanesulfonate in such an amount that the tin content of the plating solution is from 40 to 105 g/L;silver methanesulfonate, as an optional component, in such an amount that the silver content of the plating solution is from 0.40 to 3.0 g/L;70 to 210 g/L of methanesulfonic acid;0.01 to 100 mg/L of a fluorinated surfactant;0.5 to 60 g/L of an aromatic polyoxyalkylene ether; andwater.2. The electroplating solution according to claim 1 , wherein the electroplating solution contains 0.05 to 10 mg/L of the fluorinated surfactant.3. The electroplating solution according to claim 1 , wherein the fluorinated surfactant is selected from an alkali perfluoroalkyl phosphate salt claim 1 , a perfluoroalkyl sulfate claim 1 , a perfluoroalkyl sulfonate salt claim 1 , and mixtures thereof.7. A method of forming solder bumps for a flip chip claim 1 , comprising:electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer; and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, ' ...

Plated Material and Manufacturing Method Therefor

An electroplated article includes a base member that includes one or more base member-metallic elements; and an electroplated layer that is formed directly on the base member. The electroplated layer includes at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element. The second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements. A ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer. Alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer. 1. An electroplated article comprising:a base member that includes one or more base member-metallic elements; andan electroplated layer that is formed directly on the base member, the electroplated layer including at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element, whereinthe second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements,a ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer, andalloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.2. The electroplated article according to claim 1 ...

Controlled grain size structures

A structure includes a first substrate and a variable grain layer disposed on or formed into the first substrate. The variable grain layer includes a first grain portion having a first grain size and second grain portion having a second grain size. The first grain size is smaller than the second grain size.

CONNECTION TERMINAL AND METHOD FOR PRODUCING CONNECTION TERMINAL

A connection terminal in which alloy particles made of an intermetallic compound containing tin and palladium are exposed on an outermost surface of a contact configured to electrically contact a mating conductor and distributed on a surface of a base material at least in the contact, wherein: a tin part made of pure tin or an alloy having a higher ratio of tin to palladium than the intermetallic compound is not exposed on a plane passing through a point where a height of the alloy particles from the surface of the base material is highest. 1. A connection terminal in which alloy particles made of an intermetallic compound containing tin and palladium are exposed on an outermost surface of a contact configured to electrically contact a mating conductor and distributed on a surface of a base material at least in the contact , wherein:a tin part made of pure tin or an alloy having a higher ratio of tin to palladium than the intermetallic compound is not exposed on a plane passing through a point where a height of the alloy particles from the surface of the base material is highest.2. A connection terminal according to claim 1 , wherein the tin part is not present around the alloy particles.3. A connection terminal according to claim 1 , wherein the surface of the base material is exposed between the alloy particles.4. A connection terminal according to claim 1 , wherein:the base material includes a layer of nickel or nickel alloy; and{'sub': 0.4', '0.6', '4, 'the intermetallic compound has a composition of (NiPd)Sn.'}5. A connection terminal according to claim 1 , wherein a ratio of an area occupied by the alloy particles in the contact is 30% or higher.6. A connection terminal according to claim 1 , wherein a dynamic friction coefficient between the contact and the mating conductor having a tin layer exposed on an outermost surface is 0.4 or lower.7. A connection terminal according to claim 1 , wherein an average thickness of a layer occupied by the alloy particles ...

Method and apparatus for continuous electrochemical production of three-dimensional structures

The invention provides a device and a method for manufacturing 3D metal structures by a sequence of electroplating steps, each step adding a cross-section layer of the 3D structure via anodes, selected from a planar 2D anode grid array and forming a pattern template, creating a deposition image on a cathode plate.

METALIZATION OF SURFACES

There is disclosed a method for application of a metal on a substrate, comprising the steps: a) contacting at least a part of the surface of the substrate with at least one selected from: i) at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, and ii) a polymer comprising at least one charged group. The contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate. Subsequently a metal layer is produced on the surface. Advantages include that the compactness of the applied metal layer increases compared to similar methods according to the prior art. 1. A method for application of a metal on a substrate , wherein the substrate surface comprises abstractable hydrogens and/or unsaturations said method comprising the steps of: 'at least one initiator, and a polymerizable unit with the ability to undergo a chemical reaction to form a polymer, said polymer comprising at least one charged group, wherein said contacting is achieved by contacting a pad with a plate comprising the at least one substance and subsequently contacting the pad with the surface of the substrate, thereby transferring the at least one substance to the surface of the substrate,', 'a) contacting at least a part of the surface of the substrate with'}b) initiating a polymerisation reaction of polymerizable units if present, to obtain a polymer comprising at least one charged group, so that the resulting polymer chains will be covalently bound to the surface by reaction with abstractable hydrogens and/or unsaturations on the substrate surface,c) depositing a second metal on an already applied first metal to obtain a metal coating, i) addition of ions of at least one first metal and reducing said ions to metal, ...

Electronic device with plated electrical contact

An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.

SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS

Semiconductor packages having variable redistribution layer thicknesses are described. In an example, a semiconductor package includes a redistribution layer on a dielectric layer, and the redistribution layer includes first conductive traces having a first thickness and second conductive traces having a second thickness. The first thickness may be different than the second thickness, e.g., the first thickness may be less than the second thickness. 1. A method , comprising:depositing a patterned plating resist on a metal seed layer formed on a back surface of a dielectric layer, wherein a first region of the metal seed layer is exposed through the patterned plating resist, and wherein the patterned plating resist covers a second region of the metal seed layer;forming a plurality of first conductive traces having a first thickness on the first region; andremoving the metal seed layer from a first subregion of the second region to form a plurality of second conductive traces having a second thickness on the second region, wherein the first thickness is different than the second thickness.2. The method of further comprising applying a patterned protective resist on a second subregion of the second region prior to removing the metal seed layer from the first subregion of the second region to form the plurality of second conductive traces.3. The method of further comprising:removing the patterned plating resist from the second region; andforming an additional sub-layer on the second conductive traces.4. The method of further comprising depositing a patterned protective resist on the first conductive traces prior to forming the additional sub-layer on the second conductive traces.5. The method of further comprising forming the additional sub-layer on the first conductive traces concurrently with forming the additional sub-layer on the second conductive traces.6. The method of claim 1 , wherein the first conductive traces are formed in a first regular pattern having a ...

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

To provide a method for manufacturing a multilayer wiring substrate, in which an insulating layer and a metal foil provided thereon are integrally laminated on an inner layer material having a wiring formed thereon, in which a hole for via hole is formed in the metal foil and the insulating layer, and in which the hole for via hole is filled with an electrolytic filled plating layer after a base electroless plating layer is formed, the method being featured in that, after the base electroless plating layer is formed, first, an electrolysis filled plating layer is formed to the extent that the hole for via hole is not completely filled, and then, after the surface of the electrolytic filled plating layer is etched, the hole for via hole is completely filled by an electrolytic filled plating layer. 1. A method for manufacturing a multilayer wiring substrate including:{'b': '1', 'step () of integrally laminating an inner layer material having an inner layer wiring formed thereon, an insulating layer, and a metal foil for upper layer wiring, and providing, in the metal foil for upper layer wiring and the insulating layer, a hole for via hole extending from the metal foil for upper layer wiring to reach the inner layer wiring;'}{'b': '2', 'step () of forming a base electroless plating layer in the hole for via hole and on the metal foil for upper layer wiring, and then filling the hole for via hole by forming an electrolytic filled plating layer, and forming a via hole connecting the metal foil for upper layer wiring and the inner layer wiring; and'}{'b': '3', 'step () of forming an upper layer wiring by forming, after forming the electrolytic filled plating layer, the metal foil for upper layer wiring into a wiring,'}{'b': '2', 'wherein, in step (), filling of the hole for via hole is separately performed twice or more by forming the electrolytic filled plating layer, and'}the electrolytic filled plating layer, formed in the hole for via hole and on the metal foil for ...

NEAR FIELD TRANSDUCERS INCLUDING ELECTRODEPOSITED PLASMONIC MATERIALS AND METHODS OF FORMING

Methods of forming near field transducers (NFTs) including electrodepositing a plasmonic material. 1. A method of forming a lollipop type near field transducer (NTL) , the method comprising the steps:forming a rod, wherein the rod is electrically grounded;forming a photoresist mask, the photoresist mask forming at least one opening, wherein the rod is situated at least partially within the at least one opening;electrodepositing material within the at least one opening; andremoving the photoresist mask.2. The method according to claim 1 , wherein more than one material is deposited within the at least one opening before the photoresist mask is removed.3. The method according to claim 2 , wherein a diffusion barrier material is electrodeposited within the at least one opening.4. The method according to claim 3 , wherein the diffusion barrier material comprises rhodium (Rh) claim 3 , tungsten (W) claim 3 , tantalum (Ta) claim 3 , tantalum nitride (TaN) claim 3 , ruthenium (Ru) claim 3 , titanium (Ti) claim 3 , titanium nitride (TiN) claim 3 , or combinations thereof.5. The method according to further comprising electrodepositing a plasmonic material on the diffusion barrier material.6. The method according to claim 5 , wherein the plasmonic material comprises gold (Au) claim 5 , silver (Ag) claim 5 , copper (Cu) claim 5 , alloys thereof claim 5 , or combinations thereof.7. A method of forming a lollipop type near field transducer (NTL) claim 5 , the method comprising the steps:electrodepositing a sheet of a first plasmonic material;forming a photoresist mask, the photoresist mask forming at least one opening;electrodepositing a second plasmonic material at least in the at least one opening of the photoresist mask;removing the photoresist mask; andforming a rod, wherein the rod is formed from at least a portion of the first plasmonic material.8. The method of claim 7 , wherein the first and the second plasmonic material are the same.9. The method according to further ...

Method of forming a composite material and apparatus for forming a composite material

A method of forming a composite material is provided. The method may include: arranging a suspension in physical contact with a carrier, wherein the suspension may comprise an electrolyte and a plurality of particles of a first component of the composite material; causing the particles of the first component of the composite material to sediment on the carrier, wherein a plurality of spaces may be formed between the sedimented particles; and forming by electroplating a second component of the composite material from the electrolyte in at least a fraction of the plurality of spaces.

METHOD FOR MANUFACTURING A PRINTHEAD OF AN ELECTROCHEMICAL ADDITIVE MANUFACTURING SYSTEM

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane. 1. A method for manufacturing a printhead of an electrochemical additive manufacturing system , comprising: [ an array of row traces;', 'an array of column traces;', 'a row driver circuit coupled electrically to said row traces; and', 'a column driver circuit coupled electrically to said column traces;, 'a grid control circuit comprising'}, 'a power distribution circuit;', said power distribution circuit;', 'an associated row trace of said row traces; and', 'an associated column trace of said column traces;, 'an array of deposition control circuits aligned with a deposition grid, wherein each deposition control circuit of said array of deposition control circuits is coupled electrically to'}, 'wherein said first insulating layer does not cover a contact pad associated with each deposition control circuit of said array of deposition control circuits;, 'depositing a first insulating layer onto a backplane, wherein said backplane comprises 'each deposition anode of said array of deposition anodes comprises an insoluble conductive ...

COMPOSITE CERAMIC COATINGS FOR ANTI-CORROSION PROTECTION

In some embodiments, an anti-corrosive composite ceramic coating includes an inner metal layer formed on the surface of a metal object to be protected and an outer composite ceramic layer formed on the inner metal layer. 1. An anti-corrosive composite ceramic coating comprising:an inner metal layer formed on the surface of a metal object to be protected; andan outer composite ceramic layer formed on the inner metal layer.2. The coating of claim 1 , wherein the inner metal layer is a zinc or zinc alloy layer.3. The coating of claim 1 , wherein the inner metal layer is approximately 4 to 300 μm thick.4. The coating of claim 1 , wherein the composite ceramic layer contains zinc and silicon.5. The coating of claim 1 , wherein the composite ceramic layer is a hydrous zinc silicate layer.6. The coating of claim 5 , wherein the hydrous zinc silicate layer is made of ZnSiO(OH).7. The coating of claim 1 , wherein the composite ceramic layer is approximately 40 to 300 μm thick.8. A coated metal object protected by an anti-corrosive composite ceramic coating claim 1 , the coated metal object comprising:a steel body having a surface; andan anti-corrosive composite ceramic coating formed on body, the coating including an inner metal layer formed on the surface and an outer composite ceramic layer formed on the inner metal layer.9. The object of claim 8 , wherein the inner metal layer is a zinc or zinc alloy layer.10. The object of claim 8 , wherein the composite ceramic layer is a hydrous zinc silicate layer.11. A method for forming an anti-corrosive coating on a metal object claim 8 , the method comprising:electrolytically plating the surface of the object with a metal to form an inner layer; andelectrolytically depositing a composite ceramic layer on top of the inner layer.12. The method of claim 11 , wherein electrolytically plating the surface of the object comprises electrolytically plating the surface with zinc or a zinc alloy.13. The method of claim 11 , wherein ...

COIL PATTERN, METHOD FOR FORMING SAME, AND CHIP DEVICE INCLUDING SAME

Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating. 1. A method of forming a coil pattern on at least one surface on a substrate , the method comprising:forming a seed layer on at least one surface of a substrate; andforming at least two or more plating layers to cover the seed layer, whereinthe two or more plating layers are formed through anisotropic plating.2. The method of claim 1 , wherein the seed layer is formed in a spiral shape.3. The method of claim 2 , wherein said at least two or more plating layers are formed after at least two or more photosensitive film patterns are respectively formed on the substrate so as to be spaced apart from innermost and outer most sides of the seed layer.4. The method of claim 3 , wherein a ratio of a height of said at least two or more photosensitive film patterns to a total width of said at least two or more plating layers is approximately 1:0.5 to 1:2.5. The method of claim 3 , wherein the coil pattern is formed in an aspect ratio of approximately 2 to approximately 10.6. The method of claim 5 , wherein the coil pattern has at least one region formed in a different width.7. The method of claim 6 , wherein the coil pattern is formed to have a width gradually increasing or decreasing from an innermost side toward an outermost side.8. The method of claim 7 , wherein the coil pattern has at least one region formed to have widths different from each other in lower end portion claim 7 , middle portion claim 7 , and upper end portion of the region.9. A coil pattern formed by the method set forth in claim 1 , and comprising:a seed layer formed on at least one surface of a substrate; andat least two or more plating layers formed to cover the seed layer and formed ...

MATRIX-CONTROLLED PRINTHEAD FOR OF AN ELECTROCHEMICAL ADDITIVE MANUFACTURING SYSTEM

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane. 1. A matrix-controlled printhead for an electrochemical additive manufacturing system , comprising:{'claim-text': ['a grid x resolution defined as a number of grid regions along the x-axis direction;', 'a grid y resolution defined as a number of grid regions along the y-axis direction;', 'a grid x pitch defined as a length of a grid region of said grid regions along the x-axis direction;', 'a grid y pitch defined as a length of a grid region of said grid regions along the y-axis direction;', 'a grid pitch defined as a minimum of said grid x pitch and said grid y pitch; and', 'a grid region area defined as a geometric area of said grid region;', 'a grid control circuit comprising:', 'an array of row traces;', 'an array of column traces;', 'a row driver circuit coupled electrically to said row traces; and', 'a column driver circuit coupled electrically to said column traces;'], '#text': 'a deposition grid partitioned into grid regions along an x-axis direction and along a y- axis direction, said deposition grid comprising:'}a power ...

MATRIX-CONTROLLED PRINTHEAD FOR OF AN ELECTROCHEMICAL ADDITIVE MANUFACTURING SYSTEM

Process for manufacturing a printhead for a 3D manufacturing system that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane. 1. A method for manufacturing a printhead of an electrochemical additive manufacturing system , the method comprising steps of:{'claim-text': [{'claim-text': ['an array of row traces;', 'an array of column traces;', 'a row driver circuit coupled electrically to the row traces; and', 'a column driver circuit coupled electrically to the column traces;'], '#text': 'a grid control circuit comprising:'}, 'a power distribution circuit;', {'claim-text': ['the power distribution circuit;', 'an associated row trace of the row traces; and', 'an associated column trace of the column traces,'], '#text': 'an array of deposition control circuits aligned with a deposition grid, wherein each deposition control circuit of the array of deposition control circuits is coupled electrically to:'}, 'wherein the insulating layer does not entirely cover contact pads and each one of the contact pads is associated with a corresponding deposition control circuit of the array of deposition control circuits; and'], '#text': 'depositing an insulating layer onto ...

REACTOR FOR LAYER DEPOSITION BY CONTROLLABLE ANODE ARRAY

An apparatus and method for electrochemically depositing a layer using a reactor configured to contain an electrolyte solution with an anode array containing a plurality of independently electrically controllable anodes arranged in a two-dimensional array, a cathode, an addressing circuit for receiving a signal containing anode address data, and for outputting a signal causing an anode array pattern; in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer corresponding to the anode array pattern signal received from the addressing circuit. 1. An apparatus comprising:(a) a reactor configured to contain an electrolyte solution;(b) an anode array containing a plurality of independently electrically controllable anodes stationary with respect to one another and the plurality of anodes arranged in a two-dimensional array, the anode array configured to be immersed in the electrolyte solution such that each of the plurality of anodes is in fluid contact with the other anodes in the plurality through the electrolyte solution;(c) a cathode disposed in the reactor such that the cathode is configured to be in fluid contact with the plurality of anodes through the electrolyte solution;(d) an anode addressing circuit for receiving a signal containing anode address data and for outputting a signal causing an anode array pattern;(e) a current controller to control a flow of current to the anode array; and,(e) a second controller in communication with the addressing circuit, the current controller and the anode array, the second controller operable to communicate with the current controller to command the flow of current to each anode in the anode array thereby causing an electrochemical reaction at the cathode to deposit a layer ...

HYDROSTATIC PROFILED RAIL GUIDE

A hydrostatic profiled rail guide, having a guide carriage () which is arranged on a guide rail () so as to be longitudinally slidable and is hydrostatically mounted on said guide rail, wherein the guide carriage has pressure pockets and pocket surfaces arranged around the pressure pockets, and wherein the guide rail on the faces thereof facing towards the pressure pockets has rail running surfaces () for hydrostatic mounting of the guide carriage on the guide rail, wherein the pocket surfaces formed on the guide carriage have a first coating formed of a Cu/Sn alloy. 1. A hydrostatic profiled rail guide comprising a hydrostatically supported guide carriage arranged to slide longitudinally on a guide rail , the guide carriage includes pressure pockets and pocket surfaces arranged around the pressure pockets , and rail running surfaces are located on sides of the guide rail that face the pressure pockets for hydrostatic support of the guide carriage on the guide rail , and the pocket surfaces formed on the guide carriage are provided with a first coating formed of a Cu/Sn alloy.2. The hydrostatic profiled rail guide according to claim 1 , wherein whose Cu/Sn alloy is made from Cu with 12 to 14 weight percent Sn.3. The hydrostatic profiled rail guide according to claim 1 , wherein the guide carriage has a supporting body formed from steel with the pocket surfaces formed on the supporting body claim 1 , the first coating is deposited on a second coating made from Cu that is deposited on the steel of the supporting body.4. The hydrostatic profiled rail guide according to claim 3 , wherein the first coating and the second coating together have a layer thickness from 14 μm up to and including 16 μm.5. The hydrostatic profiled rail guide according to claim 1 , wherein the first coating is deposited galvanically.6. The hydrostatic profiled rail guide according to claim 3 , wherein the second coating is deposited galvanically.7. A method for producing a hydrostatic profiled ...

PROCESSES FOR PROVIDING LAMINATED COATINGS ON WORKPIECES, AND ARTICLES MADE THEREFROM

Methods for providing laminated coatings on metal articles using electroplating methods such as barrel plating, vibratory plating, rocker plating or other non-rack methods that involve movement of articles to be plated in a containment apparatus, as well as articles made from such processes. Embodiments of such processes involve mass-transfer modulation to provide compositionally modulated coatings. 1. A method for producing a plurality of articles by electroplating a batch of workpieces , the method comprising:contacting at least a portion of a batch of workpieces with an electrodeposition bath in contact with at least a portion of a containment apparatus, the electrodeposition bath comprising at least a first and second electrodepositable material;moving the portion of the batch of workpieces by moving the containment apparatus in a predetermined motion;electrodepositing a first identifiable layer onto at least a portion of the workpieces in the batch by applying a first electric current for a first amount of time via at least two cathode contacts that make at least intermittent electrical contact with the portion of the batch of workpieces, the first identifiable layer comprising at least the first and second electrodepositable materials; andelectrodepositing a second identifiable layer onto the portion of the workpieces in the batch by applying a second electric current for a second amount of time via the cathode contacts, the second identifiable layer comprising at least the first and second electrodepositable materials, the composition, grain size, structure, or thickness, or combinations thereof, of the second identifiable layer being different from that of the first identifiable layer.2. The method according to claim 1 , wherein the containment apparatus is a barrel-plating apparatus claim 1 , a vibratory basket plating apparatus claim 1 , or a rocker plating apparatus.3. The method according to claim 1 , further comprising electrodepositing an additional ...

ELECTROCHEMICAL ADDITIVE MANUFACTURING METHOD USING DEPOSITION FEEDBACK CONTROL

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations. 1. An electrochemical additive manufacturing method using deposition feedback control , comprising:placing a surface of a cathode into an electrolyte solution, wherein an object to be manufactured is constructed by electrochemically depositing material onto the cathode; the anode array comprises a plurality of deposition anodes; and', 'each deposition anode of the plurality of deposition anodes is configured to provide current that flows from the deposition anode to the cathode through the electrolyte solution, resulting in deposition of the material onto the cathode;, 'placing an anode array in contact with the electrolyte solution, whereinobtaining a build plan that comprises a layer description of a layer of the object to be manufactured, wherein the layer description comprises one or more process parameter values that affect a manufacturing process for the layer; and transmitting control signals to the anode array based on the layer description of the layer;', 'measuring one or more feedback signals;', 'analyzing ...

LEAD FRAME, PACKAGE FOR LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

A lead frame includes a base material and two or more silver-containing layers. The base material is composed of a metal. The two or more silver-containing layers are stacked on the base material. The two or more silver-containing layers includes an uppermost silver-containing layer containing sulfur, and a lower silver-containing layer. The lower silver-containing layer contains no selenium or the lower silver-containing layer is composed substantially only of silver. A method for manufacturing a light emitting device includes: preparing a lead frame; preparing a package including the lead frame; and mounting a light emitting element on the package. The lead frame is prepared by: providing a base material; forming an underlying metal on the base material by plating to form an underlayer; and forming two or more silver-containing stacked layers on the underlayer, the two or more silver-containing stacked layers including an uppermost silver-containing layer containing sulfur. 1. A lead frame comprising:a base material composed of a metal; and an uppermost silver-containing layer containing sulfur, and', 'a lower silver-containing layer, with the lower silver-containing layer containing no selenium or the lower silver-containing layer being composed substantially only of silver., 'two or more silver-containing layers stacked on the base material, the two or more silver-containing layers including'}2. The lead frame according to claim 1 , whereina concentration of elemental sulfur in the uppermost silver-containing layer is 20 ppm to 250 ppm by weight,3. The lead frame according to claim 1 , whereina glossiness in the uppermost silver-containing layer is from 0.3 to 1.4.4. The lead frame according to claim 1 , whereina total thickness of the two or more silver-containing layers is 0.05 μm to 5 μm, and a ratio of the uppermost silver-containing layer and the lower silver-containing layer is 1:1 to 1:99.5. The lead frame according to claim 1 , further comprisingan ...

WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer. 1. A wiring board comprising:a first insulating layer; and a first magnetic layer formed on the first insulating layer and formed by a plating layer,', 'a coil portion formed on the first magnetic layer,', 'a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and', 'a second magnetic layer formed on the second insulating layer and formed by a plating layer., 'a coil formed on the first insulating layer and including'}2. The wiring board according to claim 1 , wherein an upper surface of the second insulating layer is a flat surface.3. The wiring board according to claim 2 , wherein the coil further includes a third insulating layer formed on the second insulating layer claim 2 , and the second magnetic layer is formed on an upper surface of the second insulating layer via the third insulating layer.4. The wiring board according to claim 1 , wherein the second insulating layer is formed by resin.5. The wiring board according to claim 4 , wherein the resin includes magnetic filler.6. The wiring board according to claim 1 , wherein the coil portion is formed by a plating layer.7. The wiring board according to claim 1 , wherein the coil includes a fourth insulating layer formed between the first insulating layer and the first magnetic layer.8. A method of manufacturing a wiring board claim 1 , comprising: forming a first magnetic layer on the first insulating layer by a plating process,', 'forming a coil portion on the first magnetic layer,', ' ...

MANUFACTURING METHOD OF INDIUM TIN OXIDE

The present disclosure provides a manufacturing method of indium tin oxide, including: providing a first electrolyte including choline chloride, urea, indium chloride, boric acid, and ascorbic acid; disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte; heating the first electrolyte to 60° C.-95° C.; applying a first operating current to electroplate indium onto the workpiece; providing an second electrolyte including choline chloride, urea, tin chloride, boric acid, and ascorbic acid; disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electroplate; heating the second electroplate to 60° C.-95° C.; applying a second operating current to electroplate tin onto the workpiece; and annealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment. 1. A manufacturing method of indium tin oxide , comprising:providing a first electrolyte comprising choline chloride, urea, indium chloride, boric acid, and ascorbic acid;disposing a workpiece, wherein at least a part of the workpiece is in contact with the first electrolyte;heating the first electrolyte to within 60° C. to 95° C.;applying a first operating current to electroplate indium onto the workpiece;providing a second electrolyte comprising choline chloride, urea, tin chloride, boric acid, and ascorbic acid;disposing the indium-coated workpiece, wherein at least a part of the workpiece is in contact with the second electrolyte;heating the second electrolyte to within 60° C. to 95° C.;applying a second operating current to electroplate tin onto the workpiece; andannealing the indium and tin on the workpiece to form indium tin oxide in an oxygen environment.2. The manufacturing method of indium tin oxide of claim 1 , wherein in the step of annealing the workpiece claim 1 , 1 sccm to 40 sccm of oxygen gas is introduced to anneal the workpiece in the oxygen environment.3. The ...

PLATED MEMBER, PLATED TERMINAL FOR CONNECTOR, METHOD FOR PRODUCING PLATED MEMBER AND METHOD FOR PRODUCING PLATED TERMINAL FOR CONNECTOR

It is aimed to provide a plated member and a plated terminal for connector, to which a large current can be applied and which have both a low friction coefficient and high heat resistance, at low cost and provide a method for producing such a plated member and a method for producing such a plated terminal for connector. A silver-tin alloy layer for coating a surface of a base material made of copper or copper alloy and a silver coating layer for coating the silver-tin alloy layer and to be exposed on an outermost surface are simultaneously formed by heating to obtain a plated member after tin and silver plating layers are alternately laminated on the surface of the base material with the outermost surface formed by the silver plating layer. 1. A plated member , comprising: a base material made of copper or copper alloy; a silver-tin alloy layer coated on a surface of the base material; and a silver coating layer coated on a surface of the silver-tin alloy layer so that the silver coating layer is exposed on an outermost surface.2. The plated member of claim 1 , further comprising an underplating made of nickel or copper formed in contact with the surface of the base material claim 1 , and the silver-tin alloy layer being formed on a surface of the underplating.3. The plated member of claim 1 , wherein the silver coating layer is thinner than the silver-tin alloy layer.4. The plated member of claim 3 , wherein a thickness of the silver-tin alloy layer is in a range of 1 to 45 μm and a thickness of the silver coating layer is in a range of 0.5 to 15 μm.5. A plated terminal for connector claim 1 , comprising the plated member of .6. A method for producing a plated member claim 1 , comprising: providing a base material made of copper or copper alloy; coating a silver-tin alloy layer on a surface of a base material; and forming a silver coating layer on the silver-tin alloy layer and to be exposed on an outermost surface by heating after tin and silver plating layers are ...

SLIDING MEMBER

[Object] Provided is a technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. 1. A sliding member comprising:an overlay including an alloy plating film of Bi and Sb;a lining including an Al alloy;a first intermediate layer including Cu as a main component, and laminated on the lining; anda second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.2. The sliding member according to claim 1 , whereinthe second intermediate layer includes pure Ag or Ag—Sn. The present invention relates to a sliding member including an overlay of an alloy plating film of Bi and Sb.A sliding member is known that includes an overlay including a coating layer of Bi and an intermediate layer of Ag (see Patent Literature 1). In Patent Literature 1, the size of a crystal grain of Ag in the intermediate layer is adjusted to improve the interlayer adhesion in the overlay. Furthermore, the size of a crystal grain of Bi in the coating layer is adjusted to improve the interlayer adhesion and the fatigue resistance in the overlay.Patent Literature 1: Japanese Patent No. 3693256However, in Patent Literature 1, there has been a problem that in the case that an Al alloy is formed into a bearing alloy layer, delamination occurs between the bearing alloy layer of the Al alloy and the intermediate layer of Ag. This is because the adhesion between the Al alloy and the Ag plating film is poor.Furthermore, there has been a problem that use of a configuration in which Cu and Sb coexist in an overlay layer as in Patent Literature 1 leads to formation of a Cu—Sb compound in the overlay layer, and the Cu—Sb compound causes deterioration of the fatigue resistance.The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a technique capable of reducing the possibility of generation of a Cu—Sb ...

Fabricating Porous Metallic Coatings Via Electrodeposition and Compositions Thereof

A method is provided for creating a porous coating on a surface of a substrate by electrodeposition. The substrate is a part of the cathode. An anode is also provided. A coating is deposited or disposed on the surface by applying a voltage that creates a plurality of porous structures on the surface to be coated. Continuing to apply a voltage creates additional porosity and causes portions of the attached porous structures to detach. A covering layer is created by applying a voltage that creates a thin layer that covers the attached porous structures and the detached portions which binds the porous structures and detached portions together. 1. An article , comprising: a surface having at least one region; and a porous coating on said at least one region of said surface , wherein the coating comprises a plurality of porous structures attached to said at least one region of said surface and at least one layer covering said porous structures.2. The article of wherein between said coating and said surface claim 1 , additionally applying one or more intermediate bonding layers between said coating and said surface.3. The article of wherein said coating and said surface are different materials claim 2 , and said one or more bonding layers are made of materials different from the materials of said coating and said surface.4. The article of claim 1 , wherein said coating is applied to said surface by electrodeposition5. The article of wherein said porous structures and said covering layer are separately selected from metals claim 1 , metal alloys claim 1 , metallic compounds claim 1 , conductive polymers or any combination thereof.6. The article of wherein said surface is a metal claim 1 , metal alloy claim 1 , metallic compound claim 1 , conductive polymer or any combination thereof.7. The article of wherein said coating and said surface are the same material.8. The article of wherein said coating and said surface are different materials.9. The article of wherein said ...

TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer is formed on a substrate of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 μm by electroplating, a tin-copper plating layer containing tin mixed with a copper-tin alloy is formed thereon so as to have a thickness of 0.6 to 10 μm by electroplating using a tin-copper plating bath which contains 5 to 35% by weight of copper with respect to the total amount of tin and copper, and then, a tin layer is formed thereon so as to have a thickness of 1 μm or less by electroplating if necessary. 1. A method for producing a tin-plated product , the method comprising the steps of:preparing a tin-copper plating bath; andforming a tin-copper plating layer, which contains tin mixed with a copper-tin alloy, on a substrate of copper or a copper alloy by electroplating using the tin-copper plating bath.2. A method for producing a tin-plated product as set forth in claim 1 , wherein said tin-copper plating bath contains 5 to 35% by weight of copper with respect to the total amount of tin and copper claim 1 , and wherein said electroplating is carried out so that said tin-copper plating layer has a thickness of 0.6 to 10 μm.3. A method for producing a tin-plated product as set forth in claim 1 , which further comprises the step of forming a tin layer by electroplating after said tin-copper plating layer is formed.4. A method for producing a tin-plated product as set forth in claim 3 , wherein said electroplating for forming said tin layer is carried out so that said tin layer has a thickness of 1 μm or less.5. A method for producing a tin-plated product as set forth in claim 1 , which further comprises the step of forming a nickel layer by electroplating before said tin-copper plating layer is formed.6. A method for producing a ...

METHOD AND DEVICE FOR ELECTROPLATING IN CYLINDRICAL GEOMETRY

A method and device for electrodeposition in cylindrical geometry. A method for electrochemically depositing a thin layer on a flexible substrate, comprising: providing, in an electrolysis bath, a first closed cylinder in a second hollow cylinder, applying the flexible substrate to one of the surfaces chosen from the outer surface of the first cylinder and the inner surface of the second, the flexible substrate forming a first electrode, providing, in the electrolysis bath, a second electrode, and applying a potential difference between the first electrode and the second electrode in order to electrodeposit the thin layer on the flexible substrate. 1. A method for plating a thin layer on a flexible substrate , by electrochemistry , comprising:providing, in an electrolytic bath, a first closed cylinder inside a second hollow cylinder,applying the flexible substrate on one surface among an outer surface of the first cylinder and an inner surface of the second cylinder, said flexible substrate forming a first electrode,providing, in said electrolytic bath, at least one second electrode, andapplying a potential difference between the first electrode and the second electrode to electroplate the thin layer on the flexible substrate.2. The method of claim 1 , further comprising;rotating the first cylinder around an axis thereof during electroplating.3. The method of claim 1 , further comprising:rotating the second electrode.4. The method of claim 1 , further comprising:providing a first, closed cylinder coaxial with the second, hollow cylinder.5. The method of claim 1 , wherein another surface among the outer surface of the first cylinder and the inner surface of the second cylinder is the second electrode.6. The method of claim 1 , further comprising:providing a second soluble electrode.7. The method of claim 1 , further comprising:applying the flexible substrate on the outer surface of the first cylinder, andproviding a mobile carrier arm connected to the first cylinder. ...

COATING SURFACES WITH NANOSTRUCTURES

At least one substrate part for is provided for coating. A first deposition is provided on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel and alloys comprising these, from at least one first compound which provides the at least one first substance. A second deposition is provided on the at least one support part as a nano-structuring of at least one second substance chosen from a group comprising rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold and/or alloys thereof, of at least one second compound which provides the at least one second substance, in a solution. 117.-. (canceled)18. A process for coating surfaces with nanostructures , comprising:providing at least one support part to be coated;providing a first deposition on the at least one support part as microstructuring of at least one first substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, tin, zinc, copper, cobalt, lead, nickel, and alloys comprising these, from at least one first compound which provides the at least one first substance;providing a second deposition as nanostructuring of at least one second substance selected from the group consisting of rhenium, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, gold, and alloys comprising these, from at least one second compound which provides the at least one second substance, in a solution.19. The process as claimed in claim 18 , wherein the second deposition is carried out electrochemically or by colloid synthesis.20. The process as claimed in claim 18 , wherein at least one reducing agent is used for the second deposition.21. The process as claimed in claim 20 , wherein at least one of formic acids claim 20 , borohydride claim 20 , hydrazine ...

ALUMINUM PLATING FILM AND METHOD FOR PRODUCING ALUMINUM PLATING FILM

An aluminum plating film contains aluminum as a main component. The aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum. 1. An aluminum plating film comprising aluminum as a main component ,wherein the aluminum plating film has, between coating surfaces at both ends in a thickness direction, an intervening layer that contains a metal having a lower ionization tendency than aluminum or an intervening layer that contains an alloy of aluminum and a metal having a lower ionization tendency than aluminum.2. The aluminum plating film according to claim 1 , wherein the aluminum plating film has an elongated sheet-like shape.3. The aluminum plating film according to claim 1 , wherein the aluminum plating film forms a skeleton of a metal porous body claim 1 , the skeleton having a three-dimensional network structure.4. The aluminum plating film according to claim 3 , wherein the metal porous body has an elongated sheet-like shape.5. The aluminum plating film according to claim 1 , wherein the aluminum plating film has a plurality of the intervening layers in the thickness direction of the aluminum plating film.6. The aluminum plating film according to claim 1 , wherein the metal having a lower ionization tendency than aluminum is at least one selected from the group consisting of iron claim 1 , zinc claim 1 , zirconium claim 1 , manganese claim 1 , nickel claim 1 , and copper.7. The aluminum plating film according to claim 1 , wherein the aluminum plating film has a thickness of 10 μm or more and 1 claim 1 ,000 μm or less.8. A method for producing the aluminum plating film according to claim 1 , the method comprising:a first electrolytic treatment step of forming a pre-aluminum plating film by subjecting a substrate, at least a ...

Electrical connector electroplating process

An electrical connector electroplating process includes: performing a pre-treatment of an electrical connector to remove grease; performing an activation treatment of the electrical connector to activate an oxide film on a surface of the electrical connector; plating a layer of bottom coating on the surface of the electrical connector; plating a layer of silver film coating on a surface of the bottom coating; plating a layer of gold film coating on a surface of the silver film coating; plating a layer of platinum or rhodium film coating on a surface of the gold film coating; performing a post-treatment including surface pore sealing, water washing, and baking/drying of a surface of the platinum or rhodium film coating.

Electrochemical additive manufacturing of interconnection features

A system and method of using electrochemical additive manufacturing to add interconnection features, such as wafer bumps or pillars, or similar structures like heatsinks, to a plate such as a silicon wafer. The plate may be coupled to a cathode, and material for the features may be deposited onto the plate by transmitting current from an anode array through an electrolyte to the cathode. Position actuators and sensors may control the position and orientation of the plate and the anode array to place features in precise positions. Use of electrochemical additive manufacturing may enable construction of features that cannot be created using current photoresist-based methods. For example, pillars may be taller and more closely spaced, with heights of 200 μm or more, diameters of 10 μm or below, and inter-pillar spacing below 20 μm. Features may also extend horizontally instead of only vertically, enabling routing of interconnections to desired locations.

SUPERCONFORMAL FILLING COMPOSITION AND SUPERCONFORMALLY FILLING A RECESSED FEATURE OF AN ARTICLE

Superconformally filling a recessed feature includes: contacting the recessed feature with superconformal filling composition that includes: Au(SO) anions; SO anions; and Bi cations; convectively transporting Au(SO) and Bi to the bottom member of the recessed feature; subjecting the recessed feature to an electrical current to superconformally deposit gold from the Au(SO) on the bottom member relative to the sidewall and the field, the electrical current providing a cathodic voltage; and increasing the electrical current subjected to the field and the recessed feature to maintain the cathodic voltage between −0.85 V and −1.00 V relative to the SSE during superconformally depositing gold on the substrate to superconformally fill the recessed feature of the article with gold as a superconformal filling of gold, the superconformal filling being void-free and seam-free. 1. A process for superconformally filling a recessed feature of an article with gold , the process comprising: a substrate;', 'a field disposed on the substrate;', a bottom member;', 'a sidewall that separates the bottom member from the field,', 'the recessed feature having an aspect ratio of a depth to a width from 0.5 to 100 before superconformally filling the recessed feature, the aspect ratio increasing during superconformally filling the recessed feature; and, 'the recessed feature disposed on the substrate and surrounded by the field, the recessed feature comprising, 'an overlayer disposed on the article such that the field and the recessed feature are fully metallized for contact with a superconformal filling composition;', [{'sub': 3', '2, 'sup': '3−', 'a plurality of Au(SO) anions as a source of gold for superconformally depositing gold in the recessed feature;'}, {'sub': '3', 'sup': '2−', 'a plurality of SO anions; and'}, {'sup': '3+', 'a plurality of Bi cations as a brightener and an accelerator for superconformally depositing gold in the recessed feature;'}], 'contacting the field and the ...

PLATING APPARATUS

A plating apparatus including a plating bath, a substrate holder to be arranged in the plating bath and adapted to hold a substrate, an anode for generating an electric field between the substrate and the anode, and at least one electric field shielding body for shielding the substrate holder and a part or the whole of the electric field, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other. 1. A plating apparatus comprising:a plating bath;a substrate holder to be arranged in the plating bath and adapted to hold a substrate;an anode arranged so as to face the substrate holder; andat least one electric field shielding body for shielding a part of an electric field from the anode to the substrate, wherein the electric field shielding body has an opening portion for allowing the electric field between the substrate and the anode to pass therethrough, and is configured so as to be capable of adjusting an opening size in a first direction of the opening portion and an opening size in a second direction of the opening portion independently of each other.2. The plating apparatus according to claim 1 , wherein the electric field shielding body includes one or more first shielding members and one or more second shielding members claim 1 , the one or more first shielding members being arranged on at least one side of first and second end portions in the first direction of the opening portion claim 1 , the one or more second shielding members being arranged on at least one side of third and fourth end portions in the second direction of the opening portion.3. The plating apparatus according to claim 2 , wherein the one or more first shielding members are arranged on both sides ...

ALLOYING INTERLAYER FOR ELECTROPLATED ALUMINUM ON ALUMINUM ALLOYS

An aluminum alloy component is protected by an electrodeposited aluminum coating. An electrodeposited intermediate aluminum-transition metal alloy and/or rare earth metal alloy layer between the aluminum alloy substrate and the protective coating enhances coating adhesion and corrosion resistance. The intermediate layer is formed by room temperature electrodeposition in ionic liquids. 1. A coated metal component comprising:an aluminum alloy substrate;an electrodeposited intermediate aluminum alloy interlayer on the substrate; andan electrodeposited aluminum protective coating on the intermediate interlayer.2. The coated component of claim 1 , wherein the electrodeposited intermediate aluminum alloy interlayer comprises an alloy of Al and at least one metal selected from the group consisting of transition metals and rare earth metals.3. The coated component of claim 2 , wherein the transition metals are selected from the group consisting of Sc claim 2 , Ti claim 2 , V claim 2 , Cr claim 2 , Mn claim 2 , Fe claim 2 , Co claim 2 , Ni claim 2 , Cu claim 2 , Zn claim 2 , Y claim 2 , Zr claim 2 , Nb claim 2 , Mo claim 2 , Tc claim 2 , Ru claim 2 , Rh claim 2 , Pd claim 2 , Ag claim 2 , Cd claim 2 , La claim 2 , Hf claim 2 , Ta claim 2 , W claim 2 , Re claim 2 , Os claim 2 , Ir claim 2 , Pt claim 2 , and Au and wherein the rare earth metals are selected from the group consisting of Ce claim 2 , Pr claim 2 , Nd claim 2 , Pm claim 2 , Sm claim 2 , Eu claim 2 , Gd claim 2 , Tb claim 2 , Dy claim 2 , Ho claim 2 , Er claim 2 , Tm claim 2 , Yb and Lu.4. The coated component of claim 2 , wherein the interlayer comprises a multilayer structure.5. The coated component of claim 4 , wherein the multilayer structure comprises a plurality of aluminum alloy layers of different composition.6. The coated component of claim 5 , wherein the multilayer structure has a graded composition.7. The coated component of claim 6 , wherein the graded composition comprises a transition metal and/or ...

Metallic Coating With Macro-Pores

The present disclosure relates to coatings. For example, some embodiments may include methods for producing a coating comprising: depositing a metallic matrix on a substrate by electrochemical deposition using a deposition bath including carbon comprising particles and oxide particles dispersed therein; wherein the carbon comprising particles are embedded into the metallic matrix and pores are distributed in the coating; wherein at least 80% of the pores have a pore diameter in a range from 3 to 30 μm; wherein oxide particles are incorporated into and fixed in the pores during deposition and the oxide particles remain partially uncoated by the material of the metallic matrix.

Electroplating Method and Device

A method includes: agitating base members that has been immersed in an electrolytic solution inside of an electroplating tank so as to flow in a circumference direction along an inner wall of the electroplating tank; and electroplating the base members flowing along the circumference direction in the electrolytic solution inside of the electroplating tank. The flow of the base members along the circumference direction is caused by a flow of magnetic media along the circumference direction in the electrolytic solution inside of the electroplating tank or is caused by rotation of an agitation unit provided at a bottom side of the electroplating tank. At least one of the base members touches a bottom cathode, and a base member positioned upward relative to the base member touching the bottom cathode is electrically connected to the bottom cathode via at least the base member touching the bottom cathode.

Partial heat-treatment method using double metal layer

Disclosed herein is a partial heat treatment method using a double metal layer, in which a surface of a workpiece is hardened by heat treatment, including the steps of: primarily plating the surface of the workpiece with a first metal layer; secondarily plating the surface of the first metal layer with a second metal layer; partially stripping the first metal layer and the second metal layer to expose a part of the surface of the workpiece; heat-treating the workpiece to harden the exposed surface of the workpiece; and removing the first metal layer and the second metal layer remaining on the surface of the workpiece.

Multi-Layer Structures and Methods for Forming

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. 1. A method for forming a three-dimensional structure , comprising: (i) depositing a first of the at least two materials;', '(ii) depositing a second of the at least two materials;', '(iii) planarizing the first of the at least two materials and the second of the at least two materials to set a boundary level for the layer; and, '(A) forming a plurality of successively formed layers, wherein each successively formed layer comprises at least two materials and is formed on and adhered to a previously formed layer, one of the at least two materials is a structural material and the other of the at least two materials is a sacrificial material, and wherein each successively formed layer defines a successive cross-section of the three-dimensional structure, and wherein the forming of each of the plurality of successively formed layers comprises(B) after the forming of the plurality of successively formed layers, separating at least a portion of the sacrificial material from multiple layers of the structural material to reveal the three-dimensional structure,wherein the forming of each of at least one given layer of the layers additionally comprises planarizing the first of the at least two materials prior to depositing the second of the at least two materials, andwherein during formation of the at least one given layer, the step of depositing the first of the at least two materials comprises depositing a sacrificial material.2. The method of wherein the first of ...

3d metal printhead assembly method of manufacture

3D metal printhead assembly method of manufacture that uses metal electrodeposition to construct parts. The printhead may be constructed by depositing layers on top of a backplane that contains control and power circuits. Deposited layers may include insulating layers and an anode layer that contain deposition anodes that are in contact with the electrolyte to drive electrodeposition. Insulating layers may for example be constructed of silicon nitride or silicon dioxide; the anode layer may contain an insoluble conductive material such as platinum group metals and their associated oxides, highly doped semiconducting materials, and carbon based conductors. The anode layer may be deposited using chemical vapor deposition or physical vapor deposition. Alternatively in one or more embodiments the printhead may be constructed by manufacturing a separate anode plane component, and then bonding the anode plane to the backplane.

Copper Electroplating Solution and Copper Electroplating Process

The present disclosure relates to a copper electroplating solution and a copper electroplating process. The solution includes following components: 20 to 240 g/L of copper sulfate pentahydrate, 20 to 300 g/L of sulfuric acid, 25 to 120 mg/L of chlorine ion, 0.1 to 20 mg/L of a brightener, 1 to 2000 mg/L of an inhibitor, and the balance is deionized water; The brightener is selected from two of the group consisting of alkyl sulfonic acid thiols and derivatives thereof; the inhibitor is selected from one or more compounds of non-ionic surfactants. The solution of this disclosure can greatly improve the current density of plating and the throwing power (TP) of electroplating of the through hole of flexible boards, wherein the TP value can reach more than 200%, and the electroplating deposited copper layer in the hole is flat and the quality thereof meets the requirements of the flexible board.

METHOD FOR PRODUCING A STEEL STRIP WITH IMPROVED BONDING OF METALLIC HOT-DIP COATINGS

A cold- or hot-rolled steel strip with a metallic coating, the steel strip having iron as the main constituent and, in addition to carbon, an Mn content of 8.1 to 25.0 wt. % and optionally one or more of the alloying elements Al, Si, Cr, B, Ti, V, Nb and/or Mo. The uncoated steel strip is first cleaned, a layer of pure iron is applied to the cleaned surface, an oxygen-containing, iron-based layer containing more than five mass percent of oxygen is applied to the layer of pure iron. The steel strip is then annealed and is reduction-treated in a reducing furnace atmosphere during the annealing treatment to obtain a surface consisting mainly of metallic iron. The steel strip is then hot-dip coated with the metallic coating. This creates uniform and reproducible bonding conditions for the coating on the steel strip surface. 120.-. (canceled)21. A method for producing a cold-rolled or hot-rolled steel strip having a metallic coat , where the steel strip comprises iron as a main constituent and , in addition to carbon , an Mn content of 8.1 to 25.0 wt. % and optionally one or more of the alloy elements Al , Si , Cr , B , Ti , V , Nb and/or Mo , said method comprising:cleaning the surface of the uncoated steel strip;applying a layer of pure iron with an average iron content of more than 96 wt. % onto the cleaned surface;applying onto the layer of pure iron an oxygen-containing, iron-based layer, which layer contains more than 5 mass percent of oxygen;subjecting the steel strip together with the oxygen-containing, iron-based layer to annealing treatment, wherein during the course of the annealing treatment the steel strip is reduction-treated in a reducing furnace atmosphere; andhot-dip coating the steel strip with a metallic coat after the steel strip has been subjected to the annealing treatment and reduction-treated.22. The method as claimed in claim 21 , wherein an average thickness of the pure iron layer is formed to be 0.05 to 0.6 μm and an average thickness of the ...

SYNTHESIS OF SUPERCONDUCTING NB-SN

A method comprising: 1. A method comprising:{'sub': 2', '5, 'electrodepositing a film comprising a Nb—Sn material onto a copper substrate surface from an electrolyte bath comprising (a) SnCl, (b) NbCl, and (c) (i) 1-Ethyl-3-methylimidazolium chloride (EMIC), (ii) 1-Butyl-3-methylimidazolium chloride (BMIC), or (iii) a mixture thereof.'}2. The method of claim 1 , wherein the bath comprises (a) SnCl claim 1 , (b) NbCl claim 1 , and (c) 1-Butyl-3-methylimidazolium chloride (BMIC).3. The method of claim 1 , wherein prior to initiation of electrodeposition (a) is present in an amount of 1 mol % to 50 mol % claim 1 , (b) is present in an amount of 1 mol % to 50 mol % claim 1 , and (c) is present in an amount of 1 to 99 mol %.4. The method of claim 1 , wherein the film comprises NbSn.5. The method of claim 1 , wherein the electrodeposition occurs at 1 to 1000 mA/cmand 0 to 150° C. for 1 to 7200 seconds.6. The method of claim 1 , wherein the Nb—Sn film has a structure of cubic NbSn claim 1 , orthorhombic NbSn claim 1 , η CuSnand ε CuSn.7. A method comprising:electrodepositing a seed copper layer onto a surface of a Nb substrate;electrodepositing a tin layer onto the seed copper layer;electrodepositing a copper barrier layer onto the tin layer to form an intermediate construct; and{'sub': '3', 'heating the intermediate construct to form a NbSn coating.'}8. The method of claim 7 , wherein the heating of the intermediate construct is from 10 to 90° C.9. The method of claim 7 , wherein the NbSn coating has a structure of cubic NbSn claim 7 , orthorhombic NbSn claim 7 , η CuSnand ε CuSn. This application claims the benefit of U.S. Provisional Application No. 62/190,199, filed Jul. 8, 2015, which is incorporated herein by reference.The NbSn intermetallic compound is a high performing superconductive material which finds wide application in Nuclear Resonance Magnetic devices, high field lab magnets, but also fusion and accelerator magnets.Manufacturing a film-based superconducting ...

Metal Three-Dimensional Printing without Sintering using Concurrent Particle Deposition and Electroplating

A system is provided for use with a volume of metal particles suspended in electroplating solution. The system includes: a positional tip operable to have a positive electrical bias; a dispenser operable to dispense at least one of the metal particles and the electroplating solution; a metal base depositing system operable to deposit a metal base; a controller operable to control the positional tip to move and to control the dispenser to dispense the at least one of the metal particles and the electroplating solution; and a voltage controller operable to provide the positive electrical bias to the positional tip and to provide a negative electrical bias to the metal base so as to electroplate metal onto the metal base from the particles suspended in the electroplating solution and so as to three-dimensionally print a metal shape. 1. A system for use with a volume of metal particles suspended in electroplating solution , said system comprising:a positional tip operable to have a positive electrical bias;a dispenser operable to dispense at least one of the metal particles and the electroplating solution;a metal base depositing system operable to deposit a metal base;a controller operable to control said positional tip to move and to control said dispenser to dispense the at least one of the metal particles and the electroplating solution; anda voltage controller operable to provide the positive electrical bias to said positional tip and to provide a negative electrical bias to said metal base so as to electroplate metal onto said metal base from the metal particles suspended in the electroplating solution and so as to three-dimensionally print a metal shape.2. The system of claim 1 , wherein said positional tip and said dispenser are a unitary device.3. The system of claim 2 , wherein said controller is operable to control said positional tip to move and to control said dispenser to dispense the metal particles suspended in the electroplating solution.4. The system of ...

CONNECTING COMPONENT MATERIAL

Disclosed is a connection component material that can be used, for example, for electrical contact components, such as connectors, lead frames, and harness plugs, used in electrical devices, electronic devices, etc. The connection component material comprises a Cu plating layer formed on a surface of a stainless steel plate, and a Sn plating layer formed on the Cu plating layer, the connection component material being characterized in that: the amount of adhesion of the Cu plating layer is from 1.5 to 45 g/m; the amount of adhesion of the Sn plating layer is from 1.5 to 15 g/m; and the surface hardness of the stainless steel plate is from 200 to 400 HV. 1. A material for a connecting member used as a raw material of a connecting member , comprising a Cu plating layer formed on a surface of a stainless steel plate , and a Sn plating layer formed on the Cu plating layer , wherein the deposition amount of the Cu plating layer is 1.5 to 45 g/m; the deposition amount of the Sn plating layer is 1.5 to 15 g/m; and the surface hardness of the stainless steel plate is 200 to 400 HV.2. A process for producing for a connecting member used as a raw material of a connecting member , comprising: forming a Cu plating layer on a surface of a stainless steel plate having a surface hardness of 200 to 400 HV so that the deposition amount of the Cu plating layer is 1.5 to 45 g/m , and forming a Sn plating layer on the Cu plating layer so that the deposition amount of the Sn plating layer is 1.5 to 15 g/m. The present invention relates to a connecting component material. More specifically, the present invention relates to a material for a connecting member which can be suitably used in, for example, electrical contact members such as a connector, a lead frame and a harness plug, which are used in an electrical instrument, an electronic instrument, and the like. The material for a connecting member of the present invention makes it possible to suppress increase in contact resistance, ...

2-shot molded article with multiple electrical current pathways

A molded article includes a first plateable region spaced apart from a second plateable region the first plateable region by a barrier of electrically insulating material. Each of the plateable regions include an associated plateable layer of electrically conductive material for being electroplated with a different plateable finish. Several different geometries and configurations of the barrier and/or the plateable regions are provided to prevent migration of plating material from one of the plateable regions acting as bipolar electrode while another one of the plateable regions is being electroplated. A non-plateable insert may be disposed between the plateable regions to prevent migration of plating material from one of the plateable regions onto the other one of the plateable regions. A conducive robber in electrical communication with one of the one of the plateable regions, and which may be removable, may also be used to prevent migration of plating material.

RUST PREVENTION MEMBER AND METHOD FOR PRODUCING SAME

As a rust prevention member that has excellent corrosion resistance, while being provided with a coating film that contains Si, a rust prevention member which is provided with a base material, a zinc-based plating layer that is provided on the base material, and a chemical conversion coating film that contains Si and is provided on the zinc-based plating layer is described. This rust prevention member is characterized in that the chemical conversion coating film has an Si-rich region on the surface side, said Si-rich region having an atomic ratio of the Si content to the Zn content of 1 or more, while having a thickness of 100 nm or more. 1. A rust prevention member comprising:a base material;a zinc-based plating layer provided on the base material; anda chemical conversion coating film provided on the zinc-based plating layer and containing Si, whereinthe chemical conversion coating film has a Si-rich region in which an atomic ratio of a Si content to a Zn content is 1 or more on a surface layer side with a thickness of 100 nm or more.2. The rust prevention member according to claim 1 , wherein the chemical conversion coating film has a gradient region in which the Zn content increases toward the zinc-based plating layer between the Si-rich region and the zinc-based plating layer.3. The rust prevention member according to claim 2 , wherein a thickness of the gradient region is 50 nm or more.4. The rust prevention member according to claim 2 , wherein the Si-rich region and the gradient region are continuous in a thickness direction.5. The rust prevention member according to claim 1 , wherein the chemical conversion coating film further contains one or more elements selected from the group consisting of Cr claim 1 , P claim 1 , B claim 1 , C claim 1 , S claim 1 , O claim 1 , Li claim 1 , Ca claim 1 , Mg claim 1 , Mo claim 1 , V claim 1 , Nb claim 1 , Ta claim 1 , W claim 1 , Zr claim 1 , Fe claim 1 , Ni claim 1 , Co claim 1 , Cu claim 1 , Si claim 1 , Ti claim 1 , ...

LIFT PLUNGERS WITH ELECTRODEPOSITED COATINGS, AND SYSTEMS AND METHODS FOR PRODUCING THE SAME

Described herein are coated lift plungers, which have improved hardness, durability, and corrosion resistance, as well as methods of making, reworking, and using the same. 1. A method for preparing a coated lift plunger , the method comprising:applying a laminate coating on a surface of a plunger core that is substantially symmetrical about a longitudinal axis and has a first diameter and a plunger body, thereby forming the coated lift plunger.2. The method of claim 1 , wherein the plunger core includes a light-weighting feature.3. The method of claim 2 , wherein the light-weighting feature comprises:a first plurality of voids within the plunger core wherein each void independently has a volume;a second plurality of voids wherein a number of voids per unit volume of the plunger core varies in at least one dimension of the plunger core;a microcellular or nanocellular foam;a region devoid of material;a truss-like structure; ora combination thereof.4. The method of claim 3 , wherein the truss-like structure forms a network with a density that varies in one or more dimensions of the plunger core.5. The method of claim 3 , wherein the truss-like structure forms a network with a density that does not vary in one or more dimensions of the plunger core.6. The method of any one of - claim 3 , wherein the light-weighting feature has a void volume ranging from about 1% to about 99%.7. The method of any one of - claim 3 , wherein the light-weighting feature claim 3 , a length of the plunger core claim 3 , or a weight of the plunger core claim 3 , or a combination thereof is chosen based on a property of a petroleum well.8. The method of claim 7 , wherein the property of the petroleum well is liquid to gas ratio claim 7 , casing pressure claim 7 , tubing pressure claim 7 , line pressure claim 7 , plunger fall velocity claim 7 , or well depth.9. The method of any one of - claim 7 , wherein the light-weighting feature has a secondary function comprising liquid bypass or plunger ...

PLATED WIRE ROD

Provided is a plated wire rod having excellent salt water corrosion resistance, solder wettability, thermal peeling resistance, and fatigue resistance. A plated wire rod having a wire rod made of aluminum or an aluminum alloy, and a surface treatment coating which is constituted by one or more metal layers and with which the wire rod is coated, the plated wire rod comprising: a mixed layer in a boundary region between the wire rod and the surface treatment coating, the mixed layer containing a metal component of the wire rod, a metal component of the surface treatment coating, and an oxygen component, wherein the one or more metal layers constituting the surface treatment coating includes an innermost metal layer which is located closest to the wire rod among the one or more metal layers, the innermost metal layer being made of copper or a copper alloy. 1. A plated wire rod having a wire rod made of aluminum or an aluminum alloy , and a surface treatment coating which is constituted by one or more metal layers and with which the wire rod is coated , the plated wire rod comprising:a mixed layer in a boundary region between the wire rod and the surface treatment coating, the mixed layer containing a metal component of the wire rod, a metal component of the surface treatment coating, and an oxygen component, whereinthe one or more metal layers constituting the surface treatment coating includes an innermost metal layer which is located closest to the wire rod among the one or more metal layers, the innermost metal layer being made of copper or a copper alloy.2. The plated wire rod according to claim 1 , whereinthe mixed layer has an average thickness ranging from 1.00 nm to 40 nm, as measured at a transverse cross section of the plated wire rod.3. The plated wire rod according to claim 1 , whereinin an observation of a cross section of the plated wire rod, a linear analysis using a STEM-EDX is performed across an area from a portion of the wire rod to a portion of the ...

METHOD FOR PRODUCING A METAL COATING

Methods for electrochemical deposition of a metal coating on a metal substrate are described. The method may use an ionic liquid as an electrolyte, and the substrate may comprise a first metallic element. Method steps may include pretreating the substrate by etching in an ionic liquid containing metal ions of a second metallic element, removing metal ions of the first metallic element from the substrate, wherein the metal ions of the first metallic element are received by the ionic liquid, depositing a transition layer on the substrate from the ionic liquid, wherein metal ions of the first and second metallic elements are incorporated in the transition layer, and depositing a coating on the transition layer by electrochemical deposition from an ionic liquid containing ions of the second metallic element. 1. A method for electrochemical deposition of a metal coating on a metal substrate , wherein the substrate comprises a first metallic element as a main component , the method comprising:pretreating a surface of the substrate by subjecting the substrate to etching in an ionic liquid, wherein the ionic liquid contains metal ions of a second metallic element, during said etching removing metal ions of the first metallic element from the substrate, wherein the metal ions of the first metallic element are received by the ionic liquid,depositing a transition layer on the substrate by electrochemical deposition from said ionic liquid, wherein the ionic liquid contains metal ions of the first metallic element that were removed from the substrate during the etching and metal ions of the second metallic element, both metal ions from the first metallic element and metal ions of the second metallic element being incorporated in the transition layer that is deposited on the substrate,depositing a coating on the transition layer by electrochemical deposition from an ionic liquid containing ions of the second metallic element.2. The method according to claim 1 ,wherein the step of ...

OXYGEN ELECTRODE COMPRISING DUAL PLATING CATALYST, WATER ELECTROLYSIS DEVICE AND REGENERATIVE FUEL CELL COMPRISING THE SAME, AND METHOD FOR PREPARING THE OXYGEN ELECTRODE

The present disclosure relates to an oxygen electrode comprising a dual plating catalyst, a water electrolysis device and a regenerative fuel cell comprising the same, and a method for preparing the oxygen electrode. 1. An oxygen electrode , comprising:a substrate;a platinum (Pt) layer formed on the substrate by electroplating; andan iridium oxide layer formed on the Pt layer by electroplating.2. The oxygen electrode of claim 1 , wherein the oxygen electrode is for a water electrolysis device.3. The oxygen electrode of claim 1 , wherein the oxygen electrode is for regenerative fuel cells.4. The oxygen electrode of claim 1 , wherein the Pt layer comprises Pt particles adhered to the substrate.5. The oxygen electrode of claim 1 , wherein the iridium oxide layer comprises iridium oxide particles surrounding the Pt layer or Pt particles.6. The oxygen electrode of claim 1 , wherein the Pt layer has a weight of 0.05 mg/cmto 0.7 mg/cm.7. The oxygen electrode of claim 1 , wherein the Pt layer and iridium oxide layer have a total weight of 0.1 mg/cmto 1.0 mg/cm.8. The oxygen electrode of claim 1 , wherein the substrate is a titanium paper composed of titanium fibers.9. The oxygen electrode of claim 1 , wherein the oxygen electrode is used for a regenerative fuel cell operated at a current density of 0.1 A/cm.10. A water electrolysis device comprising the oxygen electrode according to .11. A regenerative fuel cell comprising the oxygen electrode according to .12. The regenerative fuel cell of claim 11 , wherein the regenerative fuel cell is a unitized regenerative fuel cell (URFC).13. A method for preparing the oxygen electrode according to claim 1 , comprising:forming a platinum (Pt) layer on a substrate by electroplating; andforming an iridium oxide layer on the Pt layer by electroplating.14. The method for preparing the oxygen electrode of claim 13 , wherein forming a Pt layer on the substrate by electroplating involves controlling at least one of a plating current and a ...

Rotogravure Cylinders, Intermediates and Methods

An intermediate rotogravure product has a cylindrical case onto which a circumferential copper layer extends, the circumferential copper layer having a characteristic surface roughness Rz and porosity. A copper engraving layer is on the circumferential copper layer. A method for engraving into adds a copper engraving layer, followed by engraving a predetermined pattern. A rotogravure cylinder product and method add a copper engraving layer on the circumferential copper layer that can be engraved in accordance with a predefined pattern and protected with a protection layer. 1. An intermediate product comprising a cylindrical base of aluminum onto which a circumferential copper layer extends , the base and the circumferential copper layer having a mutual interface , wherein the circumferential copper layer has a surface roughness Rz of less than 0.5 μm and a porosity of less than 1.0% , and wherein the intermediate product further comprises a copper engraving layer that is present on the circumferential copper layer.2. The intermediate product as claimed in claim 1 , wherein the porosity is less than 0.5%.3. The intermediate product as claimed in claim 1 , wherein the surface roughness Rz is between 0.2 and 0.4 μm.4. The intermediate product as claimed in claim 1 , wherein the circumferential copper layer has a thickness of at most 100 μm.5. The intermediate product as claimed in claim 4 , wherein the circumferential copper layer has a thickness of at most 50 μm.6. The intermediate product as claimed in claim 1 , wherein the interface between the base and the circumferential copper layer has a bond strength of more than 15 N.7. The intermediate product as claimed in claim 6 , wherein the bond strength is about 70 N.8. The intermediate product as claimed in claim 1 , wherein the circumferential copper layer is obtained by spraying of copper particles with a jet velocity of at least 1 claim 1 ,000 m/s.9. The intermediate product as claimed in claim 1 , wherein the ...

THREE DIMENSIONAL ADDITIVE MANUFACTURING OF METAL OBJECTS BY STEREO-ELECTROCHEMICAL DEPOSITION

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure. 1. An apparatus comprising:a reaction chamber configured to retain an ionic solution that can be decomposed by electrolysis;a plurality of anodes disposed in the reaction chamber and configured to be immersed in the ionic solution;a cathode disposed in the reaction chamber;a system for electro-mechanically positioning either the plurality of anodes, the cathode, or both; and (i) control the current applied to each anode of the plurality of anodes;', '(ii) control the electro-mechanical positioning of the plurality of anodes, or the cathode, or both., 'a microcontroller programmed to process a three dimensional model of an object into electrical signals which2. The apparatus of claim 1 , wherein the plurality of anodes comprises an anode array having a geometrical shape that is chosen from the group consisting of hexagonal claim 1 , rectangular claim 1 , square claim 1 , or circular geometrical shapes.3. The apparatus of claim 1 , wherein each of the plurality of anodes has an exposed surface having a geometric shape chosen from the group consisting of a hexagon claim 1 , a rectangle claim 1 , a triangle claim 1 , a square claim 1 , or a circle.4. The apparatus of claim 2 , wherein the anode array is constructed upon a printed circuit board claim 2 , doped or undoped semiconductor claim 2 , or other means of separating conductive elements from one another and aligning them in a pre-determined pattern.5. The apparatus of claim 2 , wherein the anode array is connected electrically to claim 2 , or disposed upon an integrated circuit claim 2 , semiconductor claim 2 , or combination of ...

Three dimensional additive manufacturing of metal objects by stereo-electrochemical deposition

An apparatus for stereo-electrochemical deposition of metal layers consisting of an array of anodes, a cathode, a positioning system, a fluid handling system for an electrolytic solution, communications circuitry, control circuitry and software control. The anodes are electrically operated to promote deposition of metal layers in any combination on the cathode to fabricate a structure.

METHOD FOR PRODUCING A METAL UNDERCOAT MADE FROM PLATINUM ON A METAL SUBSTRATE

A method is for producing a metal undercoat made from platinum on a metallic substrate. The method includes providing a metallic part forming a substrate, providing an electrolyte bath formed from an ionic liquid medium with one or more aluminium salts, depositing a first layer of a first metal on the substrate so as to obtain a substrate coated with the first metallic layer, depositing a second layer of a second metal on the first layer so as to obtain a substrate coated with the first metallic layer and the second metallic layer. One of the first metal and the second metal is a metal of the platinum group (platinoid) and the other from the first metal and the second metal is aluminium deposited by electroplating with the electrolyte bath formed from an ionic liquid medium. 1. A method for producing a metallic undercoat based on platinoid on a metallic substrate , comprising:a) providing a metallic part forming a substrate,b) providing an electrolyte bath formed from an ionic liquid medium with one or more aluminium salts,c) depositing a first layer of a first metal on the substrate so as to obtain a substrate coated with the first metallic layer,d) depositing a second layer of a second metal on the first layer so as to obtain a substrate coated with the first metallic layer and the second metallic layer,wherein one of the first metal and the second metal is a metal of the platinum group (platinoid),the other from the first metal and the second metal is aluminium deposited by electroplating with said electrolyte bath formed from an ionic liquid medium,and the aluminium layer has a thickness between 10 and 50 μm.2. The method according to claim 1 , wherein the method further comprises a diffusion heat treatment step of the coated substrate claim 1 , said diffusion heat treatment step being applied on the coated substrate of the first metallic layer and/or on the coated substrate of the first metallic layer and of the second metallic layer.3. The method according to ...

LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL

Certain embodiments herein relate to a method of electroplating copper into damascene features using a low copper concentration electrolyte having less than about 10 g/L copper ions and about 2-15 g/L acid. Using the low copper electrolyte produces a relatively high overpotential on the plating substrate surface, allowing for a slow plating process with few fill defects. The low copper electrolyte may have a relatively high cloud point. 1receiving a substrate having a seed thickness of about 200 nanometers, on average, or thinner;electrically biasing the substrate;immersing the substrate in an aqueous low copper acid-containing electrolyte comprising less than about 10 grams per liter copper ions and at least one suppressor compound, whereby the low copper electrolyte induces a cathodic overpotential on the seed sufficient to protect the seed from dissolution by acid in the electrolyte during immersion;{'sup': '2', 'electroplating copper into the features at a current density of about 3 mA/cmor less; and'}removing the substrate from the electrolyte.. A method of plating copper into damascene features, comprising: This application is a continuation of and claims priority to U.S. patent application Ser. No. 13/753,333 naming Zhou et al. as inventors, titled “LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL” filed Jan. 29, 2013, which is incorporated herein by reference in its entirety and for all purposes.The present disclosure relates generally to copper electroplating of damascene interconnects, and more specifically, to a low-copper, low acid electrolyte and a method for using the electrolyte under conditions that enhance suppression of copper plating to promote void-free fill of submicron damascene features.Electrolytes used in electroplating copper into damascene interconnects typically contain a copper salt, an acid, halide ions, an accelerator, a suppressor and a leveler. The copper salt is the copper source for the deposition. Acid is generally ...

METHOD FOR PREPARING POROUS WICK AND PRODUCT PREPARED BY THE SAME

The disclosure provides a method for preparing a porous wick, including the steps of: a) preparing an first electrolyte, which is an aqueous solution including 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate; b) preparing a second electrodeposition electrolyte, which is an aqueous solution including 0.2-0.9 mol/L sulfuric acid and 0.4-0.9 mol/L copper sulfate; c) cleaning the surface of a metal substrate with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid, and then rinsing; and d) carrying out a first elctrodeposition on the treated substrate in the first electrodeposition electrolyte, and then carrying out the second electrodeposition in the second electrodeposition electrolyte, wherein the second electrodeposition current density is smaller than the first electrodeposition current density. The porous structure of the disclosure with the specific arrangement, excellent capillary force and permeability is good for the transmission of the working liquid. 1. A method for preparing a porous wick , comprising the steps of:a) preparing an electrolyte, which is an aqueous solution comprising 0.5-1.8 mol/L sulfuric acid and 0.1-0.5 mol/L copper sulfate;b) preparing a second electrodeposition electrolyte, which is an aqueous solution comprising 0.2-0.9 mol/L sulfuric acid and 0.4-0.9 mol/L copper sulfate;c) cleaning the surface of a metal substrate with a mixed solution of a surfactant and a basic compound, activating with dilute hydrochloric acid, and then rinsing; andd) carrying out a first elctrodeposition on the treated substrate in the first electrodeposition electrolyte, and then carrying out the second electrodeposition in the second electrodeposition electrolyte, wherein the second electrodeposition current density is smaller than the first electrodeposition current density.2. The method for preparing a porous wick according to the claim 1 , wherein the molar concentration ratio of sulfuric acid to copper ...

CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof. 1. A chip electronic component comprising:a magnetic body including an insulating substrate;an internal coil part formed on at least one surface of the insulating substrate; andan external electrode formed on one end surface of the magnetic body and connected to the internal coil part,wherein the internal coil part includes a first coil pattern disposed on the insulating substrate, a second coil pattern disposed on the insulating substrate and covering at least a portion of the first coil pattern, and a third coil pattern disposed on the second coil pattern and covering at least a portion of the second coil pattern, andwherein the second and third coil patterns are coated with and are in contact with an insulating layer.2. The chip electronic component of claim 1 , wherein the second coil pattern covers upper and side surfaces of the first coil pattern.3. The chip electronic component of claim 1 , wherein the third coil pattern is substantially disposed only on an upper surface of the second coil pattern.4. The chip electronic component of claim 1 , wherein the second coil pattern is formed by isotropic plating claim 1 , and the third coil pattern is formed by anisotropic plating.5. The chip electronic component of claim 1 , wherein when a thickness of the second coil pattern from the one surface of the insulating substrate to a plating line of the second coil pattern is defined as A and a thickness of the third coil pattern from the plating line of the second coil pattern to a plating line of the third coil pattern is defined as B claim 1 , B/A is 0.1 to 20.0.6. The chip electronic ...

Plated polymer compressor

Plated polymeric gas turbine engine parts and methods for fabricating lightweight plated polymeric gas turbine engine parts are disclosed. The parts include a polymeric substrate plated with one or more metal layers. The polymeric material of the polymeric substrate may be structurally reinforced with materials that may include carbon, metal, or glass. The polymeric substrate may also include a plurality of layers to form a composite layup structure.

Forming cobalt interconnections on a substrate

A wafer electroplating system has at least one first electroplating chamber having a first electrolyte containing cobalt ions, and is adapted to electroplate a cobalt film onto a wafer at a first deposition rate. A second electroplating chamber has a second electrolyte containing cobalt ions, and is adapted to electroplate a cobalt film onto the wafer at a second deposition rate faster than the first deposition rate. The first and second electroplating chambers are within an enclosure of a processing system. A robot moves a wafer among the first and second electroplating chambers.

Plated polymer aviation components

Aviation components comprising a polymeric substrate having an outer surface wherein a metal is plated onto the outer surface to form a plated layer are disclosed. A method to make aviation components comprising a polymeric substrate having an outer surface and where a metal is plated onto the outer surface is disclosed. An over-plated heating element for shedding ice from an aircraft component having a polymeric substrate with a pocket to receive a heating element, a metal deposited onto the substrate, a heating element positioned within the pocket and a covering layer deposited onto the heating element and the plated layer is disclosed.