BEHANDLUNG VON KUPFERBLAETTERN.

Verfahren zum Beschichten von Bleigitterbändern, daraus hergestellte Bleigitter und deren Verwendung

Verfahren zur Beschichtung von Bleigitterbändern für Elektroden von Bleibatterien, hergestellt nach dem Gießwalz- oder dem Conroll-Verfahren oder aus gewalztem Bleiwerkstoffband, das nachträglich durch Stanzen, nach dem Streckmetallverfahren oder einem anderen strukturierenden Verfahren weiterverarbeitet worden ist, dadurch gekennzeichnet, dass das Bleigitterband kontinuierlich durch ein galvanisches Bad oder mehrere nacheinander angeordnete galvanische Bäder geführt wird, in dem beziehungsweise in denen Bleilegierungen enthalten sind, die auf dem Band als einlagige oder mehrlagige Schicht niedergeschlagen werden.

Nickel or copper film with an electrolytic coating of

To obtain better adhesion of Ni or Cu or their alloy films to resin plates used for printed circuits the metal films are plated with Ni from a solution containing 3.5-25 g Ni per ltr. (water soluble Ni salt) from 20g/ltr. to saturated NH4 ions, having pH values from 1-9, at temp. from freezing to room temp., at a current density from 0.05-0.3 A/cm2 for 0.2-about 3 min. the Ni being deposited in a chamois leather type of structure, followed by immersion in a chromate bath. When films are pressed onto a resin panel using a binding agent very good adhesion is obtained.

VERFAHREN ZUM VERBESSERN DER BINDEFESTIGKEIT VON KUPFERFOLIE

Galvanisches Verfahren und Vorrichtung zur Durchführung des Verfahrens sowie dessen Verwendung zum galvanischen oder chemischen Behandeln, insbesondere zum kontinuierlichen Aufbringen metallischer Schichten auf einen Körper

SELECTIVE ELECTRO PLATING OR ETCHING PROCESS

ELECTRO-DEPOSITING NICKEL-ZINC ALLOYS ONTO IRON OR STEEL STRIP SUBSTRATES

Process for galvanic depositing of a dispersion layer on a work piece surface

Electro-co-deposition of corrosion resisant zinc alloys onto iron or steel substrates

Novel plating baths and the processes for plating therewith are disclosed which provide corrosion-resistant nickel/zinc alloy coatings containing 13-15 weight/% of nickel for iron or steel substrates. The novel baths have combined nickel and zinc contents in the range of 14 to 24 ounces of metal per gallon with the ratio of nickel to zinc maintained in the range 0.1:0.4. These baths permit satisfactory plating of the alloy to be achieved at current densities in the range 30 to 120 amperes per square foot. At alloy coating thicknesses in the range 0.00005 to 0.0005 inches, a salt spray corrosion resistance in excess of 0.5 hours per microinch is afforded. Additionally, by coating the substrate, before alloy plating, with a substantially pure nickel priming layer, the corrosion resistance rate can be effectively doubled. Apparatus for the continuous plating of the priming layer and the corrosion-resistant alloy layer is also described.

Method of forming a pressure vessel

A method of forming a pressure vessel comprising forming a metallic layer 103, such as a copper layer of between 1µm and 300µm, on a removable mandrel 101 with an electrodeposition process, treating the surface of the metallic layer to increase at least one of its surface roughness and surface area, forming a composite layer 105, such as a fibre-reinforced resin layer on the treated surface of the metallic layer, and removing the mandrel from the formed vessel to form an internal cavity having the desired vessel configuration.

PROCEDURE AND DEVICE FOR THE CONTINUOUS ELECTROPLATING, IN PARTICULAR FOR GALVANIZING OR TIN

PRODUCTION OF SILK-MATTE METAL SURFACES

SURFACE-TREATED KUPFERFOLIE AND YOUR PRODUCTION AND COPPER-COVERED LAMINATE FROM IT

VERFAHREN ZUM GALVANISCHEN ABSCHEIDEN EINER DISPERSIONSSCHICHT AUF EINER OBERFLÄCHE EINES WERKSTÜCKES

VERFAHREN UND VORRICHTUNG ZUR KONTINUIERLICHEN ELEKTROPLATTIERUNG, INSBESONDERE ZUM VERZINKEN ODER VERZINNEN

VERFAHREN ZUM GALVANISCHEN BESCHICHTEN EINER SICH IM WESENTLICHEN ÜBER EINEN HALBKREIS ERSTRECKENDEN, ZYLINDRISCHEN INNENFLÄCHE EINES WERKSTÜCKES

VERFAHREN ZUM GALVANISCHEN ABSCHEIDEN EINER DISPERSIONSSCHICHT AUF EINER OBERFLÄCHE EINES WERKSTÜCKES

ANTIFRETTINGSCHICHT

VERFAHREN ZUR HERSTELLUNG VON NANOSTRUKTURIERTEN CHROMSCHICHTEN AUF EINEM SUBSTRAT

ARTICLE CONSISTING OF A FINE-GRAINED ONE, A METALLIC MATERIAL AND A POLYMER MATERIAL

KRYO ELECTROPLATING.

PRODUCTION MATS OF A SURFACE ON A LAYER OF METAL.

PROCEDURE FOR GALVANIC APPLYING OF A SURFACE COATING

Electrolytic copper foil having a modified shiny side

DENDRITIC ELECTRICAL CONTACTS AND CONNECTORS

DENDRITIC ELECTRICAL CONTACTS AND CONNECTORS An electrical contact is provided by forming on a contact pad or contact surface a bunch of tiny resilient metal projections by a dendritic growth thereon of conductive metal crystals. A separable or disconnectable electrical connection is provided by urging the dendritic projections on mating contacts into intermeshing or interwedging engagement. Good quality submillimeter size electrical contacts are readily fabricated and are particularly useful for providing low cost spaceefficient multipoint connector systems for large-scale integration (LSI) circuit modules, printed circuit cards and boards and other modern day electronics hardware.

CELL FOR CONTINUOUS ELECTROLYTIC DEPOSITION TREATMENT OF BARS

Cell for continuous electrolytic deposition treatment of bars or the like The cell for continuous electrolytic deposition treatment of bars or the like according to the invention comprises a closed vessel containing at least one tubular anode through which a bar for electrolytic processing can be conveyed in the axial direction, the bar being inserted into the vessel and leaving the vessel through respective inlet, and outlet mouthpieces equipped with scaling means, means being present for supplying a flow of electrolytic bath to the anode or anodes and transferring the bath from the anode to the vessel, producing a flow of the bath inside the anode and parallel to the bar to be processed, dielectric spacing means also being present between the bar inlet mouthpiece and the end of the adjacent anode and adapted to define a zone of controlled chemical attack before electroplating begins.

SATIN COPPER BATH AND METHOD OF DEPOSITING A SATIN COPPER LAYER

An aqueous acidic copper electroplating bath that produces a satin deposit includes a source of copper ions, an acid, a satin additive, and optionally one or more acidic copper electroplating bath additive(s), wherein the satin additive includes a block copolymer with the structure of RO(EO)m(PO)nH.

STEEL SHEET FOR CANS, AND PRODUCTION METHOD THEREFOR

Provided are: a steel sheet for cans which exhibits excellent weldability; and a production method therefore. This steel sheet for cans has, provided to the surface of a steel sheet in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The deposited amount of the chromium metal layer is 50-200 mg/m2. The deposited amount of the hydrous chromium oxide layer in terms of chromium is 3-30 mg/m2. The chromium metal layer includes: a base part having a thickness of 7.0 nm or higher; and granular protrusions which are provided on the base part, have a maximum grain size of 200 nm or lower, and have a number density per unit area of at least 30 per µm2.

METHODS AND COMPOSITIONS FOR ELECTROCHEMICAL DEPOSITION OF METAL RICH LAYERS IN AQUEOUS SOLUTIONS

Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.

ENHANCED TECHNIQUES FOR PRODUCTION OF GOLDEN BRONZE BY INTER-DIFFUSION OF TIN AND COPPER UNDER CONTROLLED CONDITIONS

Golden bronze appearance article, multiple-layer substrate, related methods and uses thereof, particularly for coinage blanks. Methods of producing an article having a golden bronze appearance include annealing a multiple-layer substrate at an annealing temperature for an annealing residence time. The multiple-layer substrate includes a 10 core, contiguous to a copper layer and subsequent tin layer. The annealing temperature and annealing residence time are controlled in accordance with each other for allowing diffusion of the tin layer into the copper layer and producing an annealed substrate comprising an inter-diffused outer bronze layer having a golden appearance. The tin layer thickness is in accordance to the copper layer thickness such that the inter-diffused outer bronze layer has a tin content between about 8%wt. and about 15.8%wt. The core has a sufficiently low content of nickel to reduce or prevent formation of intermetallic compound comprising tin and nickel proximate to the ...

ELECTRODE FOR ELECTROLYTE CELL, USE THEREOF AND PROCESS

L'électrode est placée dans une enveloppe définissant une chambre (78) et dont une paroi est formée d'une membrane (77) permettant le passage d'ions à travers celle-ci. L'enveloppe présente une ouverture ( 100) pour alimenter la chambre d'un électrolyte et une ouverture (101) pour évacuer de la chambre de l'électrolyte. Une telle électrode est utile dans des procédés et/ou installations pour le dépôt ou l'élimination électrolytique continu d'une couche de métal pour une bande (3).

Feuille de cuivre laminée et procédé de fabrication de cette feuille

PROCEDE ET APPAREIL DE DEPOT ELECTROLYTIQUE.

Installation redresseuse triphasée pour alimenter un appareil de traitement électrolytique et utilisation de cette installation

Procédé d'électrodéposition de métal et dispositif pour sa mise en oeuvre

Plaque d'impression et procédé de fabrication de cette plaque

Procédé de revêtement électrolytique et pièce revêtue selon ce procédé

Verfahren zum galvanischen Aufbringen einer Oberflächenbeschichtung.

Construction unit from two actuated connected workpieces.

Bei einem Bauteil (10) aus zwei über Fügeflächen (11, 21) kraftschlüssig verbundenen Werkstücken (10, 20) weist wenigstens eine Oberfläche im Fügebereich der Werkstücke (10) eine Oberflächenstruktur mit Strukturerhebungen (14) und Strukturtälern (16) auf. Zur Verminderung einer Relativbewegung der beiden Werkstücke (10, 20) ist eine der Fügeflächen (11) der beiden Werkstücke (10) von einer galvanisch abgeschiedenen und eine Vielzahl von Strukturerhebungen (14) aufweisenden Hartchromschicht (12) gebildet, wobei die Spitzen der Strukturerhebungen (14) in die unbeschichtete Fügefläche (21) des anderen Werkstücks (20) eingepresst sind.

Component, in particular a timepiece with a surface topology and method for the production thereof

L'invention concerne un composant (1) destiné à être en contact par frottement avec un autre composant, ledit composant (1) étant revêtu d'une couche électriquement conductrice (4) d'un seul tenant couvrant au moins partiellement chacune des surfaces du composant (1), le frottement s'établissant sur au moins une de ces surfaces, dite surface fonctionnelle (2), ladite surface fonctionnelle (2) étant encadrée d'une pluralité de surfaces latérales (3), le composant (1) présentant sur sa surface fonctionnelle (2) une texture formée d'une succession de creusures (2a) revêtues avec ladite couche électriquement conductrice (4), lesdites creusures (2a) s'étendant chacune entre deux surfaces latérales (3) de manière à maintenir la couche (4) d'un seul tenant sur tout le composant (1) malgré l'usure causée par le frottement sur la surface fonctionnelle (2). Elle se rapporte également au procédé de fabrication par gravure ionique réactive profonde (DRIE) du composant (1), les défauts de surface sur ...

ELECTRO-DEPOSITION OF NANO TWINNED COPPER STRUCTURES

A copper structure having a high density of nano twins is deposited on a substrate. Electroplating conditions for depositing a nano twinned copper structure may include applying a pulsed current waveform that alternates between a constant current and no current, where a duration of no current being applied is substantially greater than a duration of a constant current being applied. In some implementations, the nano twinned copper structure is deposited by applying a pulsed current waveform followed by a constant current waveform. In some implementations, the nano twinned copper structure is deposited on a highly-oriented base layer, where an electroplating solution contains an accelerator additive. In some implementations, the nano twinned copper structure is deposited on a non-copper seed layer. In some implementations, the nano twinned copper structure is deposited at a relatively low flow rate.

Zinc-based electroplated steel sheet

표면-처리된 구리 호일

... 본 개시는 개선된, 부식 및 변색에 저항성인 표면-처리된 구리 호일에 관한 것이다. 보다 구체적으로, 표면-처리된 구리 호일은 크롬을 미포함하며, (a) 구리 호일; 선택적으로, (b) 구리 호일의 일면 또는 양면 상의 장벽층으로서, Ni, Zn, Co, Mn, Sn 또는 이들의 혼합물을 포함하는, 장벽층; 및 (c) 구리 호일의 일면 또는 양면 또는 하나 또는 양쪽의 장벽층(들)에 커플링된 유기층을 포함하고, 유기층의 N, S, 및 Si 원소의 총합은 5 정규화 원소% 초과이다.

나노트윈드 구리의 전착을 위한 조성물 및 방법

... 구리 염, 할라이드 이온의 공급원, 및 선형 또는 분지형 폴리하이드록실을 포함하는 구리 전기도금 용액. 구리 전기도금 용액을 사용하여 고밀도의 나노트윈드 원주형 구리 입자를 갖는 구리를 기판 상에 증착한다. 선형 또는 분지형 폴리하이드록실은 2,3-에폭시-1-프로판올과 아민계 알코올 또는 암모늄 알코올의 반응 생성물을 포함할 수 있다.

Multi-layered anisotropic conductive adhesive having conductive fabric and the preparation thereof

The present invention provides a multi-layered anisotropic conductive adhesive comprising upper conductive adhesive layer, conductive fabric with two sides and lower conductive adhesive layer; wherein, the one side of the conductive fabric is electrodeposited with metal, and the thickness of the multi-layered anisotropic conductive adhesive is 40 to 60 [mu]m. In the flexible printed circuit application, the consolidated parts, formed from laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, could effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, nice directly grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present invention has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The invention further provides the method of producing multi-layered anisotropic conductive ...

Copper foil for high frequency circuit and method of manufacturing the same

Surface-treated steel sheet, method for manufacturing the same, and resin-covered steel sheet using the same

Provided are a Cr-free surface-treated steel sheet that has excellent humid resin adhesion and corrosion resistance and that exhibits no streak-like surface defects, a method for manufacturing such a surface-treated steel sheet, and a resin-covered steel sheet using such a surface-treated steel sheet. A surface-treated steel sheet includes a steel sheet; a corrosion-resistant coating, on at least one side thereof, that is composed of at least one layer selected from a Ni layer, a Sn layer, an FeNi alloy layer, an FeSn alloy layer, and an FeNiSn alloy layer; and an adherent coating, on the corrosion-resistant coating, that contains Zr and at least one species selected from P derived from a phosphoric acid and C derived from a phenolic resin in a total mass ratio to Zr of 0.01 to 10.

Physiological characteristic sensors and methods for forming such sensors

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode and applying a non-pulsed continuous signal to the sensor electrode to form a platinum deposit on the sensor electrode.

Substrate coated with highly diffusive metal surface layer

A method is disclosed for the production of highly diffusive or absorptive metal surfaces. A dendritic crystal structure surface layer of metal is electrodeposited on a substrate, using a bipolar pulse plating technique. This metal surface layer may then be oxidized to provide a highly anti-reflective surface.

Probe card assembly and kit, and methods of using same

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly thereto (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are "stacked up" so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's ...

Method for surface treatment of copper foil

Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.

Methods and materials for controlling the electrochemistry of analyte sensors

Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

ЦИНКОВАНИЕ АЛЮМИНИЯ

FIELD: manufacturing technology. SUBSTANCE: invention relates to coin workpiece processing containing aluminium or aluminium alloy. Applying zinc coating first layer onto coin workpiece using immersion zinc plating in coatings application drum. Removing zinc coating first layer. Applying zinc coating second layer onto coin workpiece using immersion zinc plating in coatings application drum. Removing zinc coating second layer. Applying zinc coating third layer onto coin workpiece using immersion zinc plating in coatings application drum. Coating coin workpiece with one or more metal or metal alloys layers in absence of cyanide. Performing annealing to create metal diffusion between coin workpiece and one or more coating layers, in order to facilitate adhesion. EFFECT: result is durable and safe coins with multilayer coating. 24 cl, 21 dwg, 6 tbl

ELECTROLYTIC BATH FOR THE DEPOSITION AND PENETRATION OF METALLIC COATINGS ON METALLIC SUBSTRATES

OBERFLÄCHENBEHANDELTE KUPFERFOLIE UND IHRE HERSTELLUNGSMETHODE

Coins coated with nickel, copper and nickel and process for making such coins

COPPER FOIL SUITABLE FOR USE IN MAKING PRINTED CIRCUITS

METHOD FOR THE ELECTROLYTIC DEPOSITION OF COPPER ON ALUMINIUM AND ITS ALLOYS AND THE PRODUCTS OBTAINED THEREWITH

... 1423928 Electro-depositing copper on anodized aluminium R COLALE 9 July 1974 [9 July 1973] 30275/74 Heading C7B An A1 or A1 alloy body e.g. plate is electroplated with Cu by immersing the degreased and pickled body in an electrolyte bath containing Cu (and preferably K 4 ) pyrophosphate with pH between 8À2 and 9À7 and temperature between 50 and 65‹C, first as anode then as cathode by reversing polarity without withdrawing the body from the bath, the counter-electrode being at least one Cu plate or bar, and regulating the voltage so that a CD of between 1À6 and 2À4 A/dm2 of body surface passes during anodizing, and of between 0À2 and 0À9 rising to a maximum of between 5 and 10 A/dm2 of body surface during electro-plating, the voltage being reduced to between 0À3 and 0À7V at the end of the first stage. For offset printing, A1 cylinders electro-plated with Cu as above may be further electro-plated with Ni and/or Cr; for electronics, the Cu electro-plate may be coated with ...

METHOD FOR ELECTROLYTIC DEPOSITION

... 1406081 Electro-depositing metal AGENCE NATIONALE DE VALORISATION DE LA RECHERCHE 9 June 1972 [9 June 1971] 27136/72 Heading C7B Metal is electro-deposited by arranging an anode at least 0.1mm. from a cathode, applying a cathode current density of 5 to 500A/dm2, and circulating an electrolyte longitudinally between the electrodes at a speed of at least 100m./min, the electrolyte having suspended therein up to 200g/l of particles of diameter less than 1mm. The particles may be of the metal to be deposited, e.g. Cu, Ag, Au, Ni, Cr, Sn, or non-conductive e.g. microspheres of glass or plastics material. Superposed layers with or without subsequent diffusion may be obtained: e.g. successive layers of Cu, Ag and Au and Cu, Ni and Cr. As shown, sheet, strip or wire 1 to be coated, e.g. of light metal.Al, Cu, stainless steel or refractory metal Mo, W, Ta, Ti or Ti alloy is advanced first through pre-treatment enclosure 3, for sanding, brushing, microbeading or degreasing, then as cathode ...

Improvements relating to the electrolytic production of copper foils

... 757,892. Electrodeposited copper foils. FERRANTI, Ltd. Nov. 9, 1963 [Nov. 8, 1952], No. 28201/52. Class 41. Copper foil having a rough surface suitable for bonding by adhesive to a phenolic resinbonded laminated sheet is produced by copperplating on a metal base member in an acid copper bath with agitation at a cathode current density of 80 to 110 amps./sq. ft. for a period of 5 to 17 minutes, cleansing the deposited surface, and plating on said deposited surface in a cyanide copper bath without agitation at a cathode current density of 45 to 50 amps./sq. ft. until the desired total thickness of foil resulting from both plating steps is reached, e.g. for 10 to 12 minutes. The metal base member may be a copper foil which is then incorporated in the final foil or a sheet of brass dipped successively in silver cyanide and iodine so that the deposited copper foil may be detached from it.

DENDRITIC SURFACE TREATMENT OF METAL LAYERS

COINS COATED WITH NICKEL,COPPER AND NICKEL AND PROCESS FOR MAKING SUCH COINS

PROCEDURE FOR CONTINUOUS NICKEL PLATING OF AN ALUMINUM CONDUCTOR AND A DEVICE FOR IT

SURFACE-TREATED KUPFERFOLIE AND YOUR MANUFACTURING METHOD

VERFAHREN ZUM GALVANISCHEN BESCHICHTEN EINER SICH IM WESENTLICHEN ÜBER EINEN HALBKREIS ERSTRECKENDEN, ZYLINDRISCHEN INNENFLÄCHE EINES WERKSTÜCKES

Multilayer plain bearing element

Mehrschichtgleitlagerelement (1) umfassend eine Stützschicht (3) und zumindest eine Gleitschicht (4), wobei die Gleitschicht (4) in einer Umfangsrichtung (6) verlaufende Kanten und eine Schichtdicke (14) in radialer Richtung aufweist, wobei die Schichtdicke (14) der Gleitschicht (4) im Bereich zumindest einer der Kanten kleiner ist als in einem Bereich neben den Kanten, und die Gleitschicht (4) zumindest als Hauptbestandteil aus einer metallischen Legierung besteht, die ein erstes, eine Matrix bildendes Element und zumindest ein zweites Element aufweist, und wobei das zweite Element ein kleineres Stromäquivalent bzw. elektrochemisches Äquivalent hat als das erste Element und/oder wobei das zweite Element oder daraus gebildete intermetallische Phasen eine höhere Dichte hat/haben, als das erste Element, dadurch gekennzeichnet, dass das zweite Element mit einem in einer Axialrichtung (8) verlaufenden Konzentrationsgradienten enthalten ist, wobei der Anteil des zweiten Elementes in der Legierung ...

GRAUSTICHIGE CHROME SURFACES

ANTIFRETTINGSCHICHT

Procedure and device for continuous pre-treating in particular for the production lithographic photolithography plates of a serving metal foil volume

PROCEDURE FOR THE PRODUCTION OF PROTHETI SHAPED PARTS FOR DENTALBEREICH AND PROTHETI SHAPED PART

STEEL SHEET HAVING SEPARATED TIN "ISLANDS" AND COVERED WITH CHROMATE COATING

ELECTROPLATED TIN-NICKEL ON STEEL STRIP

PROCESS FOR FUSION OF A CONDUCTIVE ELEMENT IN SOLUTION INTO A MATRIX OF A CONDUCTIVE ELEMENT

A process for the fusion of second conductive element into the matrix of a first conductive element is provided in which the second element as a dissociable solution is placed in contact with the first conductive element and subjected to an interrupted electrical signal of a predetermined frequency. Solutions for carrying out the process are disclosed and products produced by the process.

STEEL SHEET FOR CANS AND PRODUCTION METHOD FOR STEEL SHEET FOR CANS

Provided is a steel sheet for cans that has excellent weldability and an excellent surface appearance. Also provided is a production method for the steel sheet for cans. The steel sheet for cans has, on the surface thereof, in order from the steel sheet side, a chromium metal layer and a hydrous chromium oxide layer. The chromium metal layer is deposited in an amount of 50-200 mg/m2, and the hydrous chromium oxide layer is deposited in an amount of 3-15 mg/m2 in terms of chromium. The chromium metal layer includes: a flat chromium metal layer that has a thickness of at least 7 nm; and a granular chromium metal layer that includes granular protrusions that are formed on the surface of the flat chromium metal layer. The maximum grain size of the granular protrusions is 150 nm or smaller. The number density of the granular protrusions per unit area is 10/µm 2 or higher.

METHOD OF COATING A METALLIC ARTICLE WITH A SURFACE OF TAILORED WETTABILITY

A method of coating a metallic article having an at least part-metallic s urface comprising a first metal, with a surface having a pre-determined wett ability, the method at least comprising the steps of: (a) coating at least a part of the metallic article with a layer of a second metal to provide a me tal-metal bonded surface, said surface being rough either prior to or becaus e of step (a); and (b) contacting the metal-metal bonded surface of step (a) with a material to provide the surface having the pre-determined wettabilit y. The first metal may be one or more of the group comprising: iron, zinc, c opper, tin, nickel and aluminium, and alloys thereof including steel, brass, bronze and nitinol for example. Preferably, the second metal is coated onto the first metal using electroless Galvanic deposition. The nature of the co ated metallic article is non-limiting, as the ability of the present inventi on is to provide a tailored surface with a pre-determined wettability thereo n, including ...

TILTING MULTIPLIER

A tilting carrier assembly for a finishing process includes a load bar configured to convey a work piece relative to a work station. A skid is configured to receive the work piece. Each of a pair of links is pivotally coupled to the load bar at a first end and pivotally coupled to the skid at an opposite second end. A horizontal span between the first ends of the pair of links is substantially greater than a horizontal span between the second ends of the pair of links.

COINS COATED WITH NICKEL, COPPER AND NICKEL AND PROCESS FOR MAKING SUCH COINS

This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. Preferably an outer layer of nickel is applied, also at an initial low current density , followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.

나노쌍정된 (nanotwinned) 구리 피처 및 비나노쌍정 (non-nanotwinned) 구리 피처의 전기도금

... 나노쌍정된 구리 및 비나노쌍정된 구리는 2-in-1 구리 비아 및 RDL 구조체들 또는 2-in-1 구리 비아 및 필라 구조체들과 같은 혼합된 결정 구조체들을 형성하도록 전기 도금될 수도 있다. 나노쌍정된 구리는 산화제 또는 다른 화학적 시약으로 비나노쌍정된 구리 층의 표면을 전처리함으로써 비나노쌍정된 구리 층 상에 전기 도금될 수도 있다. 대안적으로, 나노쌍정된 구리는 유전체 층의 리세스를 부분적으로 충진하도록 전기 도금될 수도 있고, 비나노쌍정된 구리는 리세스를 충진하도록 나노쌍정된 구리 위에 전기 도금될 수도 있다. 구리 오버버든이 후속하여 제거될 수도 있다.

APERFEICOAMENTOS EM PROCESSO PARA REVESTIMENTO CERAMICO DIRETO DE UMA PECA DE TRABALHO DE FERRO RICO EM CARBONO E PROCESSO APERFEICOADO PARA PREPARACAO DA DITA PECA PARA TAL REVESTIMENTO

caps and coatings for corrosion protection to the nanolaminadaseletrodepositadas

Steel sheet for cans and method of manufacturing the same

Indium electroplating compositions containing amine compounds and methods of electroplating indium

Surface-treated copper foil and method for producing the same

The purpose of the present invention is to provide a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil, and is employed in order to enhance the adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, the surface of copper foil has an anti-corrosion treatment, in which the treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil, and forming an electroplated chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electroplated chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying to manufacture the surface-treated copper foil for printed circuit board.

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatus for electroplating material onto a substrate are provided. In many cases the material is metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. Typically, the embodiments herein utilize a porous ionically resistive plate positioned near the substrate, the plate having a plurality of interconnecting 3D channels and creating a cross flow manifold defined on the bottom by the plate, on the top by the substrate, and on the sides by a cross flow confinement ring. During plating, fluid enters the cross flow manifold both upward through channels in the plate, and laterally through a cross flow side inlet positioned on one side of the cross flow confinement ring. The flow paths combine in the cross flow manifold and exit at the cross flow exit, which is positioned opposite the cross flow inlet. These combined flow paths result in improved plating uniformity.

OPTICAL DIFFUSING FILMS AND METHODS OF MAKING SAME

Optical diffusing films are made by microreplication from a structured surface tool. The tool is made using a 2-part electroplating process, wherein a first electroplating procedure forms a first metal layer with a first major surface, and a second electroplating procedure forms a second metal layer on the first metal layer, the second metal layer having a second major surface with a smaller average roughness than that of the first major surface. The second major surface can function as the structured surface of the tool. A replica of this surface can then be made in a major surface of an optical film to provide light diffusing properties. The structured surface and/or its constituent structures can be characterized in terms of various parameters such as optical haze, optical clarity, Fourier power spectra of the topography along orthogonal in-plane directions, ridge length per unit area, equivalent circular diameter (ECD), and/or aspect ratio.

Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy

An aqueous indium or indium alloy plating bath comprising a source of indium ions, an acid, a source of halide ions, a surfactant according to formula (I) wherein A is selected from branched or unbranched C10-C15-alkyl; B is selected from the group consisting of hydrogen and alkyl; m is an integer ranging from 5 to 25; each R is independently from each other selected from hydrogen and methyl; and a dihydroxybenzene derivative according to formula (II) wherein each X is independently selected from fluorine, chlorine, bromine, iodine, alkoxy, and nitro; n is an integer ranging from 1 to 4, and a process for deposition of indium or an indium alloy wherein the disclosed bath is used.

Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring Board

... which is determined, after laminating one surface to each of both surfaces of a polyimide resin substrate, removing the copper foil on each of both surfaces by etching, and photographing a printed matter with a linear mark, from the resulting observation spot versus brightness graph; and the surface treated other surface of the copper foil has a TD ten-spot average roughness Rz measured with a laser microscope using laser light having a wavelength of 405 nm, of 0.35 μm or more.

ANTIVIRAL AND ENVIRONMENT-FRIENDLY COMPOSITE PLATING LAYER, PREPARATION METHOD THEREOF AND ANTIVIRAL AND ENVIRONMENT-FRIENDLY PRODUCT

The present application relates to an antiviral and environment-friendly composite plating layer, a preparation method thereof and an antiviral and environment-friendly product. The antiviral and environment-friendly composite plating layer comprises: a semi-bright nickel layer, a microporous nickel layer and an environment-friendly black chromium composite antiviral layer; the semi-bright nickel layer is adapted to be positioned on a substrate having an antiviral requirement; the microporous nickel layer is disposed on the surface of a side of the semi-bright nickel layer away from the substrate; the environment-friendly black chromium composite antiviral layer is disposed on the surface of a side of the microporous nickel layer away from the substrate; the environment-friendly black chromium composite antiviral layer has a nano-needle structure, and is formed by a composite raw material containing antiviral ammonium salt, and the concentration of the antiviral ammonium salt in the composite ...

ЦИНКОВАНИЕ АЛЮМИНИЯ

FIELD: manufacturing technology. SUBSTANCE: invention relates to coin workpiece processing containing aluminium or aluminium alloy. Applying zinc coating first layer onto coin workpiece using immersion zinc plating in coatings application drum. Removing zinc coating first layer. Applying zinc coating second layer onto coin workpiece using immersion zinc plating in coatings application drum. Removing zinc coating second layer. Applying zinc coating third layer onto coin workpiece using immersion zinc plating in coatings application drum. Coating coin workpiece with one or more metal or metal alloys layers in absence of cyanide. Performing annealing to create metal diffusion between coin workpiece and one or more coating layers, in order to facilitate adhesion. EFFECT: result is durable and safe coins with multilayer coating. 24 cl, 21 dwg, 6 tbl РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 610 811 C2 (51) МПК C25D 5/44 (2006.01) C23C 22/05 (2006.01) C23F 1/44 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ФОРМУЛА (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ 2014113212, 11.09.2012 (24) Дата начала отсчета срока действия патента: 11.09.2012 Дата регистрации: (72) Автор(ы): ЦЗЯН Тайсян (CA), ЛИ Сяньяо (CA), ТРУОНГ Сеу Цун (CA) Приоритет(ы): (30) Конвенционный приоритет: 13.09.2011 US 16/534,334; 14.09.2011 US 61/534,654 (43) Дата публикации заявки: 20.10.2015 Бюл. № 29 (45) Опубликовано: 15.02.2017 Бюл. № 5 2100489 C1, 27.12.1997. RU 2082837 C1, 27.06.1997. WO 2004101854 A2, 25.11.2004. (85) Дата начала рассмотрения заявки PCT на национальной фазе: 14.04.2014 (86) Заявка PCT: CA 2012/050645 (11.09.2012) 2 6 1 0 8 1 1 (56) Список документов, цитированных в отчете о поиске: US 5139886 A, 18.08.1992. RU R U (73) Патентообладатель(и): МОННЕ РУАЯЛЬ КАНАДЬЕН/КОРОЛЕВСКИЙ КАНАДСКИЙ МОНЕТНЫЙ ДВОР (CA) 15.02.2017 2 6 1 0 8 1 1 R U WO 2013/037071 (21.03.2013) Адрес для переписки: 191002, Санкт-Петербург, а/я 5, ООО "Ляпунов и партнеры" (54) ...

СПОСОБ ЭЛЕКТРОЛИТИЧЕСКОГО ПОКРЫТИЯ МЕТАЛЛИЧЕСКОЙ ПОДЛОЖКИ ДЛЯ ДОСТИЖЕНИЯ ЖЕЛАТЕЛЬНОЙ ШЕРОХОВАТОСТИ ПОВЕРХНОСТИ

PLATTIERTER ROHLING FUER MUENZEN UND DERGLEICHEN UND VERFAHREN ZU SEINER HERSTELLUNG

Verfahren zum kantenlosen Pulse Plating und Säubern des Metalls von Solarzellen

Ein Verfahren zum Aufbringen von Metall auf eine Solarzelle wird offenbart. Dieses Verfahren beinhaltet das Aufbringen einer Metallschicht nur auf die Oberfläche der Solarzelle ohne Aufbringen von Metall entlang der Seitenkanten durch Durchleiten eines ersten Stroms in eine erste Richtung in einem Galvanisierungsbad, Ausscheiden von Metall aus der Metallschicht durch Durchleiten eines zweiten Stroms in einer zweiten Richtung und Aufbringen von zusätzlichem Metall auf die Metallschicht durch Durchleiten eines dritten Stroms in der ersten Richtung. Der erste, zweite und dritte Strom können alternierend aufgebracht werden. Nach einem Galvanisierprozess erfolgt ein Ultraschallreinigungsprozess an der Solarzelle, um eventuell überschüssiges aufgebrachtes Metall auf der Oberfläche und an den Kanten der Solarzelle zu entfernen.

Nickel-plated steel sheet and process for producing battery can using the nickel-plated steel sheet

A Ni-plated steel sheet is provided in which thee occurrence of scratches at the time of forming a battery can is suppressed. Also provided is a method which includes a step where a surface of a steel sheet is plated with Ni in a Ni adhesion amount of 0.3-2 μm, a step where the Ni-plated steel sheet is heated to 600-800° C. to form an Fe−Ni diffusion layer as an outermost surface layer, and a step where the steel sheet is rolled by temper rolling so as to adjust the Fe−Ni diffusion layer so that the steel sheet has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm. A Ni-plated steel sheet which includes an Fe−Ni diffusion layer as an outermost surface layer and in which the diffusion layer has the surface roughness Ra of 0.9-2.0 μm and the surface roughness Ry of 4.0-15 μm and the diffusion layer has such an Fe/Ni ratio that the Fe accounts for 20-50% in Auger analysis is subjected to drawing using a water-soluble liquid which contains water-soluble emersion as a press lubricant.

Porous three dimensional copper, tin, copper-tin, copper-tin-cobalt, and copper-tin-cobalt-titanium electrodes for batteries and ultra capacitors

A method and apparatus for forming a reliable and cost efficient battery or electrochemical capacitor electrode structure that has an improved lifetime, lower production costs, and improved process performance are provided. In one embodiment a method for forming a three dimensional porous electrode for a battery or an electrochemical cell is provided. The method comprises depositing a columnar metal layer over a substrate at a first current density by a diffusion limited deposition process and depositing three dimensional metal porous dendritic structures over the columnar metal layer at a second current density greater than the first current density.

Copper Foil for Printed Circuit

Disclosed is a copper foil for printed circuits prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer; in which the average particle size of the primary particle layer is 0.25 to 0.45 μm, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 μm. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Methods and Electrolytes for Electrodeposition of Smooth Films

Electrodeposition involving an electrolyte having a surface-smoothing additive can result in self-healing, instead of self-amplification, of initial protuberant tips that give rise to roughness and/or dendrite formation on the substrate and/or film surface. For electrodeposition of a first conductive material (C1) on a substrate from one or more reactants in an electrolyte solution, the electrolyte solution is characterized by a surface-smoothing additive containing cations of a second conductive material (C2), wherein cations of C2 have an effective electrochemical reduction potential in the solution lower than that of the reactants.

Copper alloy sheet with sn coating layer for a fitting type connection terminal and a fitting type connection terminal

A copper alloy sheet with a Sn coating layer comprises a base material made of Cu—Ni—Si system copper alloy. Formed on the base material is a Ni coating layer having an average thickness of 0.1 to 0.8 μm. Formed on the Ni coating layer is a Cu—Sn alloy coating layer having an average thickness of 0.4 to 1.0 μm. Formed on the Cu—Sn alloy coating layer is an Sn coating layer having average thickness of 0.1 to 0.8 μm. A material surface is subject to reflow treatment and has arithmetic mean roughness Ra of 0.03 μm or more and less than 0.15 μm in both a direction parallel to the rolling direction and a direction perpendicular to the rolling direction. An exposure rate of the Cu—Sn alloy coating layer to the material surface is 10 to 50%. A fitting type connection terminal requiring low insertion force can be obtained at a low cost.

Lithium-ion secondary battery, electrode for the secondary battery, and electrolytic copper foil for electrode for the secondary battery

To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N/mm 2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 10 17 to 5×10 20 atoms/cm 3 , and sulfur (S) and nitrogen (N) each in a concentration of 10 15 to 10 19 atoms/cm 3 .

Edgeless pulse plating and metal cleaning methods for solar cells

A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.

Plated instrumentation probes and sensors

A component comprises a non-metallic core having an outer surface, a first catalyst deposited onto at least a first portion of the outer surface of the non-metallic core, a second catalyst deposited onto at least a second portion of the outer surface of the non-metallic core, an electrical interface, and a metallic coating. The electrical interface is plated onto the first catalyst, and includes a first interface layer electroless plated onto the first catalyst. The metallic coating is plated onto the second catalyst.

Plating film, method of manufacturing plating film, and plated product

There are provided a plating film having high durability and high reliability, a method of manufacturing the plating film, and a plated product using the plating film. The plating film according to the disclosure is formed with use of a solvent in which a metallic salt is dissolved and a compound having functionality is dissolved or colloidally dispersed, and the metal and the compound having the functionality are homogenously dispersed and joined.

Compositions and Methods for the Electrodeposition of Nanotwinned Copper

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.

Muting glucose sensor oxygen response and reducing electrode edge growth with pulsed current plating

The invention disclosed herein includes amperometric glucose sensors having electrodes formed from processes that electrodeposit platinum black in a manner that produces relatively smooth three dimensional metal architectures, ones that contribute to sensor reliability and stability. Embodiments of the invention provide analyte sensors having such uniform electrode architectures as well as methods for making and using these sensor electrodes. A number of working embodiments of the invention are shown to be useful in amperometric glucose sensors worn by diabetic individuals.

Copper foil structure having blackened ultra-thin foil and manufacturing method thereof

A copper foil structure having blackened ultra-thin copper foil of the instant disclosure includes a carrier foil, a blackened layer, a release layer, and an ultra-thin copper foil. The carrier foil includes a matte surface and a shiny surface wherein the blackened layer is disposed thereon. The release layer is disposed on the blackened layer formed with one selected from the group: copper, cobalt, nickel, and manganese while the release layer is formed with one selected from the group: molybdenum, nickel, chromium, and potassium. Successively, the ultra-thin copper foil is disposed on the release layer. Laser drilling can apply to the blackened ultra-thin copper foil on the inner layers of a high density multi-layer printed wiring board, thus eliminating the traditional blackening or browning chemical process. The blackened ultra-thin copper foil in combination with a polyimide thin (PI) or other substrate materials displays desirable appearance.

Micro-roughened electrodeposited copper foil and copper foil substrate

A micro-roughened electrodeposited copper foil and a copper foil substrate are provided. The micro-roughened electrodeposited copper foil includes a micro-rough surface. The micro-rough surface has a plurality of peaks, a plurality of V-shaped grooves and a plurality of micro-crystal clusters. Each of the V-shaped grooves is defined by adjacent two of the peaks and has an average depth less than 1 μm. The micro-crystal clusters are correspondingly located on the tops of the peaks and each thereof has an average height less than 1.5 μm. The micro-rough surface of the micro-roughened electrodeposited copper foil has an Rlr value less than 1.06.

ROUGHENED NICKEL-PLATED MATERIAL AND METHOD FOR MANUFACTURING SAME

[Object] 1. A roughened nickel-plated material comprising:a base material that is a metal; anda roughened nickel plated layer formed on at least one surface of the base material,wherein SRzjis of the surface of the roughened nickel plated layer is equal to or more than 2 μm, and, '(i) a length of the valley region B in a rolling direction or a plate passing direction of the base material is less than 40 μm in a direct distance.', 'letting a maximum height of the roughened nickel plated layer be SRz, a valley region B in a given virtual planer region A as observed at a height position of SRz×0.25 satisfies the following (i)2. The roughened nickel-plated material according to claim 1 , wherein a maximum CLmax of a circumferential length CL of the valley region B is less than 500 μm.3. A roughened nickel-plated material comprising:a base material that is a metal; anda roughened nickel plated layer formed on at least one surface of the base material,wherein Str of three-dimensional surface property parameters of the surface of the roughened nickel plated layer is equal to or more than 0.1.4. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Sk of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 1.0 to 4.0 μm.5. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Vvc of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 0.6 to 3.0 μm3/μm2.6. The roughened nickel-plated material according to claim 3 , wherein claim 3 , further claim 3 , Vmc of the three-dimensional surface property parameters of the surface of the roughened nickel plated layer is 0.45 to 2.0 μm3/μm2.7. The roughened nickel-plated material according to claim 1 , wherein the base material is a steel sheet.8. The roughened nickel-plated material according to claim 1 , wherein brightness of color of the surface ...

Tin-plated product and method for producing same

After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm 2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

Compositions and Methods for the Electrodeposition of Nanotwinned Copper

A copper electroplating solution comprising a copper salt, a source of halide ions, and a linear or branched polyhydroxyl. The copper electroplating solution is used to deposit copper having a high density of nanotwinned columnar copper grains on a substrate. The linear or branched polyhydroxyl may comprise a reaction product between 2,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol. 1. (canceled)2. The method according to claim 10 , wherein the copper salt is copper sulfate.3. The method according to claim 10 , wherein the copper electroplating solution further comprises an acid claim 10 , wherein the acid comprises sulfuric acid or methane sulfonic acid.4. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises poly(2 claim 10 ,3-epoxy-1-propanol).5. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises a reaction product between 2 claim 10 ,3-epoxy-1-propanol and aminic alcohol or ammonium alcohol.6. The method according to claim 10 , wherein the linear or branched polyhydroxyl comprises at least one nitrogen atom.7. The method according to claim 5 , wherein the aminic alcohol or the ammonium alcohol is selected from the group consisting of ethanolamine claim 5 , diethanolamine claim 5 , triethanolamine claim 5 , propanolamine claim 5 , isopropanolamine claim 5 , diisopropanolamine claim 5 , triisopropanolamine claim 5 , N-methyl diethanolamine claim 5 , N-ethyl diethanolamine claim 5 , N-propyl diethanolamine claim 5 , methyl monoethanolamine claim 5 , N claim 5 ,N-dimethyl ethanolamine claim 5 , N claim 5 ,N-diethyl ethanolamine claim 5 , N-propyl monoethanolamine claim 5 , N-propyl diethanolamine claim 5 , N-butyl ethanolamine claim 5 , N-butyl diethanolamine claim 5 , N claim 5 ,N-dibutyl ethanolamine claim 5 , hydroxy ethyl morpholine claim 5 , 2-piperidino ethanol claim 5 , diethanol isopropanolamine claim 5 , N-(2-hydroxyethyl) pyrrolidine claim 5 , choline chloride claim 5 , b- ...

High-strength single-crystal like nanotwinned nickel coatings and methods of making the same

A high-strength coatings and methods of fabrication to yield single-crystal-like nickel containing nanotwins and stacking faults.

Plated polymer aviation components

Aviation components comprising a polymeric substrate having an outer surface wherein a metal is plated onto the outer surface to form a plated layer are disclosed. A method to make aviation components comprising a polymeric substrate having an outer surface and where a metal is plated onto the outer surface is disclosed. An over-plated heating element for shedding ice from an aircraft component having a polymeric substrate with a pocket to receive a heating element, a metal deposited onto the substrate, a heating element positioned within the pocket and a covering layer deposited onto the heating element and the plated layer is disclosed.

SURFACE-TREATED COPPER FOIL, AND COPPER-CLAD LAMINATE AND CIRCUIT BOARD USING SAME

Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm. 1. A surface-treated copper foil comprising a roughened surface formed by subjecting a surface to a roughening treatment , wherein when measured using a three-dimensional roughness meter , the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nmto less than 0.0300 nm.2. The surface-treated copper foil according to claim 1 , wherein the roughened surface has a surface skewness Ssk within a range of from −0.300 to less than −0.100 and an arithmetic mean summit curvature Ssc within a range of from 0.0250 nmto less than 0.0300 nm.3. A copper-clad laminate comprising the surface-treated copper foil according to .4. A copper-clad laminate comprising the surface-treated copper foil according to .5. The copper-clad laminate according to claim 3 , comprising the surface-treated copper foil and a resin base material laminated on the roughened surface of the surface-treated copper foil claim 3 , the resin base material containing a liquid crystal polymer.6. The copper-clad laminate according to claim 4 , comprising the surface-treated copper foil and a resin base material laminated on the roughened surface of the surface-treated copper foil claim 4 , the resin base material containing a liquid crystal polymer.7. A circuit board comprising the copper-clad laminate according to .8. A circuit board comprising the copper-clad laminate according to .9. A circuit board comprising the copper-clad laminate according to .10. A ...

PREPARATION METHOD OF MINIATURE INTELLIGENT CALCIUM ALGINATE HYDROGEL END OPERATOR

A preparation method of a miniature intelligent calcium alginate hydrogel end operator based on different microelectrodes is introduced. The method includes an electrodeposition step of depositing a deposition solution under the action of a non-uniform magnetic field to form an anode surface; a processing step of transferring obtained hydrogel microstructures to a calcium chloride solution, making the hydrogel microstructure self-wind sufficiently; and a pickup step of collecting a self-winding single-layer film alginate microstructure in a culture dish, and placing it in specific environment for preservation. The preparation method can provide a degradable and convenient micro-operator, which could be locally prepared into different function components. 1. A preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator , comprising: electrodeposition , processing and pickup.2. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that: the electrodeposition step further comprises:a1: coating a photoresist on an FTO glass by a spin coater, and forming a concave pattern with a specific shape on the FTO glass as an anode;a2: filling a deposition solution between two electrodes and maintaining the deposition solution by insulating spacers with a height of 1 mm;a3: applying direct voltage to the electrodes for 1 to 5 seconds; anda4: washing the anode in an HEPES buffer solution for 5 minutes until all hydrogel microstructures are separated from the FTO glass.3. The preparation method of a degradable and self-winding miniature intelligent calcium alginate hydrogel end operator according to claim 1 , characterized in that the electrodeposition step further comprises:a1: coating the photoresist on the FTO glass by the spin coater, and forming the concave pattern with the specific shape on the FTO glass as the anode;a2: ...

Method of forming asper-silver on a lead frame

A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.

ELECTRICITY STORAGE DEVICE, METHOD FOR PRODUCING ELECTRICITY STORAGE DEVICE, AND ELECTROLYTIC PLATING METHOD

An electricity storage device includes a stack of bipolar electrodes each including a steel sheet, and a plating layer provided on a surface of the steel sheet. The plating layer includes a base nickel-plating layer provided on the surface of the steel sheet, and a surface nickel-plating layer provided on the base nickel-plating layer, and having a surface roughness greater than that of the base nickel-plating layer. 13.-. (canceled)4. An electricity storage device comprising a stack of electrodes each including a steel sheet , and a plating layer provided on a surface of the steel sheet , wherein a base nickel-plating layer provided on the surface of the steel sheet, and', 'a surface nickel-plating layer provided on the base nickel-plating layer and having a plurality of protrusions protruding in a direction intersecting with a direction in which the surface of the steel sheet extends, and, 'the plating layer includes'}at least some of the protrusions are each provided with an enlarged portion positioned nearer to a tip end of each of the protrusions rather than a base end of each of the protrusions.5. The electricity storage device according to claim 4 , further comprising a resin spacer disposed along a peripheral portion of each of the electrodes and in contact with the plating layer claim 4 , whereina part of the resin spacer is interposed between adjacent two of the protrusions, at least one of which has the enlarged portion, across a range from the tip ends to the base ends thereof.6. The electricity storage device according to claim 4 , wherein an average height of the protrusions is equal to or greater than 15 μm and equal to or smaller than 30 μm.7. The electricity storage device according to claim 4 , wherein at least one of the plurality of protrusions has a plurality of built-up metal deposits.8. The electricity storage device according to claim 7 , wherein each of the metal deposits has a spherical shape.9. The electricity storage device according to ...

Plated terminal for connector, and terminal pair

It is aimed to provide a plated terminal for connector and a terminal pair having a tin layer on an outermost surface and achieving both a reduction of a terminal insertion force and a reduction of a contact resistance. The plated terminal for connector includes a coating layer containing tin and a hard metal harder than tin at a contact portion to be brought into contact with another electrical conductive member, and both an area where tin is exposed on an outermost surface and an area where the hard metal is exposed on the outermost surface or an area where the hard metal is coated with a tin layer thinner than in other parts are included in the contact portion. Such a material can be obtained, for example, by forming a tin layer on a surface of a base material having an uneven structure on a surface of which a hard metal layer is formed.

Plasma frequency trigger

An exothermic reaction assembly includes a reaction chamber and a generator operative to generate an AC electrical signal and apply the signal to the reaction chamber by superimposing the AC signal over a DC signal. A gas manifold and controller is operative to connect a vacuum pump and one or more gas chambers to the reaction chamber and to control a pressure of the reaction chamber. The signal generator is operative to create a plasma in the reaction chamber by superimposing the AC electrical signal to the reaction chamber over the DC signal. The gas manifold and controller are operative to adjust the pressure within the reaction chamber to achieve a predetermined plasma frequency.

Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil

The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 μm or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Manufacturing method of circuit board assembly for high frequency signal transmission

A manufacturing method of copper foil and circuit board assembly for high frequency transmission are provided. Firstly, a raw copper foil having a predetermined surface is produced by an electrolyzing process. Subsequently, a roughened layer including a plurality of copper particles is formed on the predetermined surface by an arsenic-free electrolytic roughening treatment and an arsenic-free electrolytic surface protection treatment. Thereafter, a surface treatment layer is formed on the roughened layer, and the roughened layer is made of a material which includes at least one kind of non-copper metal elements and the concentration of the non-copper metal elements is smaller than 400 ppm. By controlling the concentration of the non-copper elements, the resistance of the copper foil can be reduced.

Printed circuit board for memory card and method of manufacturing the same

Provided is a printed circuit board for a memory card and a method of manufacturing the same, the printed circuit board for the memory card, including: an insulating layer; a mounting unit formed on a first surface of the insulating layer and electrically connected to a memory device; a terminal unit formed on a second surface of the insulating layer and electrically connected to electronic apparatuses of an outside; and metal layers formed at the mounting unit and the terminal unit and made of the same material.

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, And Method For Manufacturing Electronic Device

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil comprises a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein an aspect ratio of roughening particles of the roughening treatment layer satisfies one or more of the following items (1) and (2), the aspect ratio being a height of the roughening particles/a thickness of the roughening particles: (1) the aspect ratio of the roughening particles is 3 or less, (2) the aspect ratio of the roughening particles satisfies any one of the following items (2-1) or (2-2): (2-1) the aspect ratio of the roughening particles is 10 or less in the case that the height of the roughening particles is more than 500 nm and 1000 nm or less, (2-2) the aspect ratio of the roughening particles is 15 or less in the case that the height of the roughening particles is 500 nm or less; and a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin Layer, Copper Foil With Carrier, Laminate, Method For Manufacturing Printed Wiring Board, Heat Dissipation Substrate, And Method For Manufacturing Electronic Device

The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and (1-1) a roughness Ra is 0.08 to 0.20 μm, (1-2) a roughness Rz is 1.00 to 2.00 μm, (1-3) a roughness Sq is 0.16 to 0.30 μm, (1-4) a roughness Ssk is −0.6 to −0.35, (1-5) a roughness Sa is 0.12 to 0.23 μm, (1-6) a roughness Sz is 2.20 to 3.50 μm, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

Conductive member, and production method therefor

[Problem] To provide a conductive member capable of suppressing an increase in contact resistance, and a production method therefor. [Solution] To solve the problem by providing a conductive member having a Ni plating layer 3 on the surface of contact parts 2 provided on a substrate 1 , an arithmetic average roughness Sa of the surface of the Ni plating layer 3 being 20 nm or more. In the Ni plating layer 3 , the full width half maximum of a peak at the position of a Ni (200) plane in an x-ray diffraction diagram is preferably 0.6 or less, and an indentation hardness H IT of the Ni plating layer 3 is preferably 5000 n/mm 2 or less.

Physiological characteristic sensors and methods for forming such sensors

A physiological characteristic sensor, a method for forming a physiological characteristic sensor, and a method for forming a platinum deposit having a rough surface are presented here. The method for forming a physiological characteristic sensor includes immersing a sensor electrode in a platinum electrolytic bath. Further, the method includes performing an electrodeposition process by sequentially applying a pulsed signal to the sensor electrode and applying a non-pulsed continuous signal to the sensor electrode to form a platinum deposit on the sensor electrode.

Articles including adhesion enhancing coatings and methods of producing them

Certain embodiments are described herein that are directed to articles comprising textured coatings that can enhance adhesion of a surface coating. In some examples, the textured coating comprises at least one metal or metallic compound present in a plurality of individual microstructures which can be positioned in different planes in different heights with respect to a reference zero point in the textured coating. In some configurations, a surface coating comprising a repellent material can be disposed onto the textured coating and may infuse into or grip the textured coating to enhance adhesion of the surface coating.

Process to minimize and/or eliminate conductive material coating over the top surface of a patterned substrate

A layer structure usable in manufacturing an integrated circuit is made, in a single apparatus, by a particular process in which a patterned substrate is provided. An electrolyte solution, out of which a conductive material can be plated under an applied potential, is supplied over a surface of the patterned substrate, and a potential is applied so as to deposit a film of the conductive material out of the electrolyte solution and over the surface of the patterned substrate. The film of conductive material is preferably polished as it is deposited. The conductive material is then removed from field regions of the patterned substrate, while deposits of the conductive material are left in features defined in the patterned substrate. The deposits of the conductive material are then electrically isolated, resulting in the layer structure.

Method for filling recessed micro-structures with metallization in the production of a microelectronic device

A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed micro-structures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties.

Method for filling recessed micro-structures with metallization in the production of a microelectronic device

A method for filling recessed micro-structures at a surface of a semiconductor wafer with metallization is set forth. In accordance with the method, a metal layer is deposited into the micro-structures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed micro-structures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties.

Submicron metallization using electrochemical deposition

Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating solutions. In accordance with one embodiment, the method includes making contact between the surface of the microelectronic workpiece and an electroplating solution in an electroplating cell that includes a cathode formed by the surface of the microelectronic workpiece and an anode disposed in electrical contact with the electroplating solution. Next, an initial film of the metal is deposited into the micro-recessed structure using at least a first electroplating waveform having a first current density. The first current density of the first electroplating waveform is provided to enhance the deposition of the metal at a bottom of the micro-recessed structure. After this initial plating, deposition of the metal is continued using at least a second electroplating waveform having a second current density. The second current density of the second electroplating waveform is provided to assist in reducing the time required to substantially complete filling of the micro-recessed structure.

Matt zinc coating and method for the electrodeposition of matt zinc coatings

Zinc coatings with an average surface roughness (RMS) of 10-150 nm. Independent claims are included for (1) electrolytes for the deposition of matt zinc coatings on a substrate, containing delustering agent(s) as well as a source of zinc ions (2) a method for the deposition of matt zinc coatings by pre-treatment of the substrate surface followed by contact with the above electrolytes .

METAL AIR FILTER

The present disclosure relates to a metal air filter including: a filter which is formed of a metallic material by electrodeposition and has a nano branch structure; an ionizer which conducts particles to be captured by the filter with negative charges; and a power supply which supplies a positive voltage for conducting the filter with positive charges and a negative voltage for the ionizer. The filter can be more simply manufactured at a lower cost than a conventional process. 1. A metal air filter comprising:a filter which is formed of a metallic material by electrodeposition and has a nano branch structure;an ionizer which conducts particles to be captured by the filter with negative charges; anda power supply which supplies a positive voltage for conducting the filter with positive charges and a negative voltage for the ionizer.2. The metal air filter of claim 1 , wherein the filter is formed by electrodeposition according to electrolysis in an electrolytic tank which comprises a metal mesh attached to a cathode electrode claim 1 , a metal plate attached to an anode electrode claim 1 , and an aqueous solution claim 1 , and wherein the filter has a nano branch structure.3. The metal air filter of claim 2 , wherein the filter is formed by additionally performing a hydrochloric acid washing process.4. The metal air filter of claim 2 , wherein the positive voltage is 10 V.5. The metal air filter of claim 2 , wherein the aqueous solution comprises a halogen element claim 2 , and wherein a voltage which is applied between the cathode electrode and the anode electrode is 0.7 V.6. The metal air filter of claim 2 , wherein the aqueous solution comprises copper sulfate and sulfuric acid claim 2 , and wherein a voltage which is applied between the cathode electrode and the anode electrode is 2.4 V.7. The metal air filter of claim 2 , wherein only one of both sides of the metal plate within the electrolytic tank is opened such that only the one of both sides of the metal ...

Metallic articles with hydrophobic surfaces

Articles containing fine-grained and/or amorphous metallic coatings/layers on at least part of their exposed surfaces are imprinted with surface structures to raise the contact angle for water in the imprinted areas at room temperature by equal to or greater than 10°, when compared to the flat and smooth metallic material surface of the same composition.

低温铜-铜直接接合

低温下铜‑铜直接接合通过在衬底上电镀铜特征接着电平坦化这些铜特征而实现。在使纳米孪晶铜结构形成的条件下，将铜特征电镀在衬底上。电平坦化铜特征通过使衬底阳极偏置并使铜特征与电解液接触而将铜电化学移除来执行。该电化学移除以一定方式执行，使得粗糙度在铜特征中减小且实质的共平面性在铜特征之间实现。具有纳米孪晶铜结构、减小粗糙度、及较佳共平面性的铜特征实现低温下的铜‑铜直接接合。

引线框架、引线框架封装、以及它们的制造方法

本发明提供一种具备引线框架主体和其表面上的镀膜的引线框架的制造方法。该制造方法具有如下的镀敷工序：以与引线框架主体的第一主面相对的方式配置与极性反转电源连接的第一电极，并且以与第一主面相反侧的第二主面相对的方式配置与脉冲电源连接的第二电极，进行镀敷处理，在第一主面、第二主面、以及引线框架主体的侧面上形成镀膜。

Surface-treated copper foil and copper clad laminate and printed wiring board using the same

본 발명의 표면 처리 동박(11)은, 동박 기체의 적어도 한쪽의 면에, 조화 입자(111)가 형성된 조화 처리 표면을 적어도 포함하는 표면 처리 피막을 갖는다. 당해 표면 처리 동박(11)의 단면을, 주사형 전자 현미경에 의해 관찰할 때, 표면 처리 피막의 표면에 있어서, 조화 입자(111)의 입자 높이의 표준 편차가 0.16㎛ 이상 0.30㎛ 이하이고, 또한, 조화 입자(111)의 입자 폭에 대한 입자 높이비(입자 높이/입자 폭)의 평균값이 2.30 이상 4.00 이하이다. The surface-treated copper foil 11 of the present invention has a surface-treated film at least including a roughened surface on which the roughened particles 111 are formed on at least one surface of the copper foil substrate. When the cross section of the surface-treated copper foil 11 is observed with a scanning electron microscope, the standard deviation of the particle height of the roughened particles 111 on the surface of the surface-treated film is 0.16 µm or more and 0.30 µm or less, and , the average value of the particle height ratio (particle height/particle width) to the particle width of the roughened particles 111 is 2.30 or more and 4.00 or less.

引线框架、引线框架封装、以及它们的制造方法

本发明提供一种具备引线框架主体和其表面上的镀膜的引线框架的制造方法。该制造方法具有如下的镀敷工序：以与引线框架主体的第一主面相对的方式配置与极性反转电源连接的第一电极，并且以与第一主面相反侧的第二主面相对的方式配置与脉冲电源连接的第二电极，进行镀敷处理，在第一主面、第二主面、以及引线框架主体的侧面上形成镀膜。

Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method

동박을 에칭으로 제거한 후의 수지의 투명성이 우수한 표면 처리 동박을 제공한다. 표면 처리 동박은 일방의 표면 및 타방의 표면에 각각 표면 처리가 실시되어 있다. 일방의 표면측으로부터 폴리이미드 수지 기판의 양면에 첩합한 후, 에칭으로 양면의 동박을 제거하고, 라인상의 마크를 인쇄한 인쇄물을 촬영했을 때, 얻어진 관찰 지점-명도 그래프에 있어서, 하기 (1) 식으로 정의되는 Sv 가 3.5 이상이 되고, Sv = (ΔB × 0.1)/(t1 - t2) (1) 타방의 표면 처리가 된 동박 표면의 레이저 광의 파장이 405 ㎚ 인 레이저 현미경으로 측정한 TD 의 10 점 평균 조도 Rz 가, 0.35 ㎛ 이상인 표면 처리 동박. A surface-treated copper foil excellent in transparency of a resin after removal of the copper foil by etching is provided. The surface-treated copper foil is subjected to surface treatment on one surface and the other surface, respectively. (1) in a obtained observation point-lightness graph obtained when a printed material on which a mark on a line was printed was obtained by removing the copper foil on both sides by etching after being attached to both surfaces of the polyimide resin substrate from one surface side of the polyimide resin substrate, Sv = (DELTA Bx0.1) / (t1 - t2) (1) The TD of the surface of the copper foil subjected to the surface treatment on the other side is measured by a laser microscope having a wavelength of 405 nm. A surface treated copper foil having a 10-point average roughness Rz of 0.35 탆 or more.

Copper foil for printed circuit, copper-clad laminate, printed wiring board, printed circuit board, and electronic equipment

表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法

本发明公开了表面处理铜箔及使用其的积层板、印刷配线板、电子机器、以及印刷配线板的制造方法。具体地，本发明提供一种与树脂良好地附着，且经蚀刻除去铜箔后的树脂透明性优异的表面处理铜箔及使用其的积层板。本发明的表面处理铜箔至少于一铜箔表面上通过粗化处理而形成粗化粒子，关于粗化处理表面之上述粗化粒子，长径为100nm以下的粗化粒子于每单位面积中形成有50个/μm 2 以上，粗化处理表面的MD的60度光泽度为76～350％。

Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method

수지와 양호하게 접착하고, 또한 수지 너머로 관찰했을 때, 우수한 시인성을 실현하는 표면 처리 동박을 제공한다. 일방의 표면 및 타방의 표면에 각각 표면 처리가 실시된 표면 처리 동박으로서, 표면 처리 동박과, 동박에 접착하기 전의 하기 ΔB (PI) 가 50 이상 65 이하인 폴리이미드를 적층하여 구성한 구리 피복 적층판에 있어서의, 폴리이미드 너머의 표면의 JIS Z8730 에 기초하는 색차 ΔE*ab 가 50 이상이 된다. 동박을 표면 처리가 실시되어 있는 표면측으로부터 적층시킨 상기 폴리이미드 너머로 CCD 카메라로 촬영했을 때, 관찰 지점-명도 그래프에 있어서, ΔB (ΔB = Bt - Bb) 가 40 이상이 된다. 표면 처리 동박의 타방의 표면 처리가 된 동박 표면의 레이저광의 파장이 405 ㎚ 인 레이저 현미경으로 측정한 TD 의 10 점 평균 조도 Rz 가 0.35 ㎛ 이상이다. Provided is a surface-treated copper foil that can be adhered well to a resin, and when observed over a resin, realizes excellent visibility. A surface-treated copper foil having a surface treated on one surface and the other surface, the surface-treated copper foil being a laminate of a surface-treated copper foil and polyimide having a? B (PI) of 50 or more and 65 or less before adhering to the copper foil The color difference? E * ab based on JIS Z8730 of the surface beyond the polyimide is 50 or more. When the copper foil is photographed with a CCD camera over the polyimide laminated from the surface side on which the surface treatment is performed,? B (? B = Bt - Bb) is 40 or more in the observation point-lightness graph. The 10-point average roughness Rz of TD measured by a laser microscope with a laser beam wavelength of 405 nm on the surface of the copper foil subjected to the other surface treatment of the surface-treated copper foil is 0.35 탆 or more.

表面处理铜箔及使用其的积层板、铜箔、印刷配线板、电子机器、以及印刷配线板的制造方法

本发明涉及一种与树脂良好地接着、且经蚀刻除去铜箔后的树脂透明性优异的表面处理铜箔及使用其的积层板。表面处理铜箔的铜箔表面通过粗化处理而形成粗化粒子，粗化处理表面的TD的平均粗糙度Rz为0.20～0.80μm，粗化处理表面的MD的60度光泽度为76～350％，且上述粗化粒子的表面积A与自上述铜箔表面侧俯视上述粗化粒子时所得的面积B之比A/B为1.90～2.40。

表面处理铜箔、覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法

本发明提供一种利用蚀刻去除铜箔后的树脂的透明性优异的表面处理铜箔。本发明的表面处理铜箔在一个表面及另一个表面分别进行表面处理。自一个表面侧贴合于聚酰亚胺树脂基板的两面后，利用蚀刻去除两面的铜箔，对印刷有线状标记的印刷物进行摄影时，在获得的观察地点－亮度图表中，下述(1)式定义的Sv为3.5以上，Sv＝(ΔB×0.1)/(t1－t2) (1)另一经表面处理的铜箔表面的利用雷射光波长为405nm的雷射显微镜所测得的TD的十点平均粗糙度Rz为0.35μm以上。

Printed circuit board and method of manufacturing the same

본 발명은 간단한 방법으로, 회로 패턴을 형성하기 위한 금속박과 폴리머막과의 접합력을 향상시킬 수 있도록 한 것으로, 이를 위하여, 제1금속막과, 상기 제1금속막의 일면에 위치하는 폴리머막과, 상기 제1금속막과 폴리머막의 사이에 개재되고, 상기 제1금속막을 향한 제1면과 상기 폴리머막을 향한 제2면을 구비하며, 상기 제2면의 표면이 상기 제1면의 표면보다 거칠게 구비된 제2금속막을 포함하는 인쇄회로기판 및 그 제조방법을 제공한다. The present invention provides a method for improving bonding strength between a metal foil and a polymer film for forming a circuit pattern, comprising: a first metal film; a polymer film disposed on one surface of the first metal film; A first surface facing the first metal film and a second surface facing the polymer film, the surface of the second surface being rougher than the surface of the first surface; And a method for manufacturing the printed circuit board.

Lithium-ion battery

描述了一种锂-离子电池(20)，所述锂-离子电池具有包括纳米线(10)的阵列的阳极，所述纳米线(10)电化学涂覆有聚合物电解质(14)且被阴极基质(16)包围，从而形成互穿电极，其中显著缩短了Li + 离子的扩散长度，这导致更快的充电/放电、更强的可逆性和更长的电池寿命。所述电池的设计适用于多种电池材料。还描述了用于在室温下从水溶液直接电沉积Cu 2 Sb的方法，所述方法使用柠檬酸作为络合剂来形成阳极的纳米线的阵列。还描述了固态电解质的通过电还原聚合到膜和高长径比的纳米线阵列上形成的聚-[Zn(4-乙烯基-4’-甲基-2，2’-联吡啶) 3 ](PF 6 ) 2 的保形涂层，正如多种乙烯基单体的还原电聚合，例如包含丙烯酸酯官能团的那些乙烯基单体。这种材料显示了有限的导电性，但显著的锂离子传导性。阴极材料可包括氧化物，举例来说，诸如锂钴氧化物、锂镁氧化物或锂锡氧化物，或磷酸盐，举例来说，诸如LiFePO 4 。

Method for manufacturing painless injection needle and the painless injection needle

본 발명은 무통 주사바늘 제조방법 및 그 무통 주사바늘에 관한 것으로서, 더욱 상세하게는 일반적으로 외경이 0.2mm 이하인 무통 주사바늘을 프로그레시브 스탬핑 금형(Progressive Stamping Die)공정과 도금(Plating)공정에 의해 제조하는 방법 및 이에 의해 제조된 무통 주사바늘에 관한 것이다. 본 발명은 무통 주사바늘 제조방법은, (a) 얇은 판재의 가장자리에서 모양을 잘라내는 1차 가노칭에 의해 선단부가 뾰족한 판재가 되도록 하는 단계; (b) 상기 1차 가노칭된 판재를 단조가공하여 판재의 두께를 얇게 함과 동시에 가공경화에 의해 강도를 높이는 단계; (c) 상기 (b)단계에서 단조에 의해 더 넓어진 면적을 원래의 치수대로 모양을 잘라내는 2차 본노칭을 하는 단계; 및 (d) 상기 (c)단계에서 2차 본노칭에 의해 잘려진 날카로운 선단부의 뾰족한 테이퍼부를 모따기하여 둥글게 라운딩하는 단계; (e) 상기 모따기된 판재를 포밍하여 원통형상으로 성형하는 단계; 를 포함하여 구성된다. The present invention relates to a painless injection needle manufacturing method and the painless injection needle, and more particularly, a painless injection needle having an outer diameter of 0.2 mm or less in general is manufactured by a progressive stamping die process and a plating process. It relates to a method and a painless injection needle manufactured thereby. The present invention provides a method for manufacturing a painless injection needle, comprising the steps of: (a) making the tip of a thin plate a pointed plate by primary tentative notching; (b) reducing the thickness of the plate by forging the first tentatively notched plate material and increasing the strength by working hardening; (c) performing secondary bone notching in which the larger area by forging in step (b) is cut out to the original dimensions; And (d) chamfering the sharp tapered portion of the sharp tip cut by secondary bone notching in step (c) and rounding it. (e) forming the chamfered plate into a cylindrical shape; Consists of including.

Copper foil with minimized bagginess, wrinkle and tear, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same

본 발명의 일 실시예는, 구리층을 포함하며, 29 내지 65 kgf/mm 2 의 인장강도, 18 내지 148㎛의 조도 프로파일 요소 평균 간격(mean width of roughness profile elements)(Rsm) 및 0.52 이하의 집합조직계수 바이어스[TCB(220)]를 갖는 동박을 제공한다. An embodiment of the present invention includes a copper layer and has a tensile strength of 29 to 65 kgf / mm 2 , a mean width of roughness profile elements (Rsm) of 18 to 148 μm, And a texture coefficient bias [TCB (220)].

用于在水溶液中电化学沉积富金属层的方法和组合物

提供了用于通过将反应性金属络合物与吸电子剂组合来电沉积混合金属反应性金属层的方法和组合物。改变一种反应性金属络合物与另一种反应性金属络合物的比并且改变电流密度可以被用于改变基底上的金属层的形态。

Electrode grid

본 발명은 격자 부재(1)와, 이 격자 부재(1)상에 접착, 갈바니 증착되는 멀티-층 코팅(2)으로 구성하되, 상기 격자 부재는 납 또는 납 합금으로 제조되고, 상기 멀티-층 코팅은 서로 다른 조성을 갖는 적어도 2개 이상의 층으로 구성되며, 하나의 층(A)은 순수 납을 갈바닉 증착하여 형성되고, 격자 부재로부터 시작하여 상기 층(A)에 걸쳐 배열되는 다른 하나의 층(B)은 최저 0.5중량%와 최대 2.0중량%의 주석이 함유된 납을 갈바닉 증착하여 형성된 것을 특징으로 하는 납 축전지용 전극 격자에 관한 것이다. The present invention consists of a grating member 1 and a multi-layer coating 2 which is adhered and galvanically deposited on the grating member 1, wherein the grating member is made of lead or a lead alloy, and the multi-layer The coating consists of at least two layers with different compositions, one layer (A) is formed by galvanic deposition of pure lead, and the other layer (starting from the lattice member and arranged over the layer (A) B) relates to an electrode grid for lead storage batteries, characterized in that it is formed by galvanic deposition of lead containing tin at least 0.5% by weight and at most 2.0% by weight. 전극 격자, 격자 부재, 납 축전지, 갈바닉, 납, 멀티-층 코팅 Electrode Grating, Grating Member, Lead Acid Battery, Galvanic, Lead, Multi-Layer Coating

Copper foil and manufacturing method thereof

electrodeposited compositions and nanolaminated alloys for articles prepared by means of additive manufacturing processes

resumo "composições eletrodepositadas e ligas nanolaminadas para os artigos preparados por meio dos processos de fabricação aditiva" trata-se de artigos preparados através da fabricação aditiva das pré-formas que são revestidas por meio de eletrodeposição dos materiais nanolaminados e métodos de sua produção são descritos. modalidades da presente divulgação fornecem métodos para a produção de artigos. o primeiro envolve formar uma pré-forma por meio da fabricação aditiva como, por exemplo, uma impressão tridimensional (3d). as pré-forma são, então, submetidas aos processos eletroquímicos que fornecem um revestimento metálico nanolaminado que possui propriedades químicas, físicas e/ou mecânicas.

Surface treated copper foil and fabrication method thereof

본 발명은 적어도 한쪽면에 표면처리층이 형성된 표면 처리 동박에 관한 것이다. 본 발명에 따르면 표면처리층이 Ni x -Zn y -P 1-x-y (0.1 ≤ x ≤ 0.7, 0.30 ≤ y ≤ 0.85, 0.4≤ x+y〈1)를 함유한 합금에 의해 형성된 것을 특징으로 하는 표면 처리 동박이 개시된다. This invention relates to the surface-treated copper foil in which the surface treatment layer was formed in at least one surface. According to the present invention, the surface treatment layer is formed by an alloy containing Ni x -Zn y -P 1-xy (0.1 ≦ x ≦ 0.7, 0.30 ≦ y ≦ 0.85, 0.4 ≦ x + y <1). Surface-treated copper foil is disclosed.

Lithium ion battery

Copper foil for printing circuit

동박 표면에, 구리의 1 차 입자층을 형성한 후, 그 1 차 입자층 위에, 구리, 코발트 및 니켈로 이루어지는 3 원계 합금의 2 차 입자층을 형성한 인쇄 회로용 동박으로서, 조화 처리면의 일정 영역의 레이저 현미경에 의한 2 차원 표면적에 대한 3 차원 표면적의 비가 2.0 이상 2.2 미만인 것을 특징으로 하는 인쇄 회로용 동박. 상기 구리의 1 차 입자층의 평균 입자 직경이 0.25－0.45 ㎛ 이며, 구리, 코발트 및 니켈로 이루어지는 3 원계 합금으로 이루어지는 2 차 입자층의 평균 입자 직경이 0.35 ㎛ 이하인 것을 특징으로 하는 청구항 1 에 기재된 인쇄 회로용 동박.

Copper foil with carrier, laminate, method for manufacturing printed wiring board and method for manufacturing electronic device

미세 회로 형성성이 양호한 캐리어 부착 동박을 제공한다. 캐리어, 중간층, 및 극박 구리층을 이 순서로 구비한 캐리어 부착 동박으로서, 캐리어 부착 동박을 극박 구리층측으로부터 비스말레이미드트리아진 수지 기판에 압력: 20kgf/㎠, 220℃에서 2시간의 조건하에서 가열 프레스함으로써 맞붙인 후, 캐리어를 벗기고, 계속해서 에칭으로 극박 구리층을 제거함으로써 노출시킨 수지 기판 표면의 레이저 현미경으로 측정되는 ISO 25178에 준거한 최대 골(谷) 깊이 Sv가 0.181~2.922㎛인 캐리어 부착 동박.

Method for producing plated article

本发明提供一种镀品的制造方法，其特征在于，将由导电性金属构成的基材浸渍在镀液中，对该基材实施电镀而形成镀层，上述镀液是含有0.01～1mol/L的Ni离子的pH为6以上的液体，以10A/dm 2 以上的阴极电流密度实施上述电镀，形成多孔质Ni镀层。由此，能够简单地制造在基材表面上形成有均质的多孔质Ni镀层的镀品。

Roughened copper foil, copper-clad laminate and printed wiring board

Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

수지와 양호하게 접착하고, 또한 동박을 에칭으로 제거한 후의 수지 투명성이 우수한 표면 처리 동박 및 그것을 사용한 적층판을 제공한다. 표면 처리 동박은, 동박 표면에 조화 처리에 의해 조화 입자가 형성되고, 조화 처리 표면의 TD 의 평균 조도 Rz 가 0.20 ∼ 0.80 ㎛ 이며, 조화 처리 표면의 MD 의 60 도 광택도가 76 ∼ 350 ％ 이고, 상기 조화 입자의 표면적 A 와, 상기 조화 입자를 상기 동박 표면측으로부터 평면에서 보았을 때에 얻어지는 면적 B 의 비 A/B 가 1.90 ∼ 2.40 이다. A surface-treated copper foil excellent in resin transparency after being adhered well to a resin and having removed the copper foil by etching, and a laminated board using the same. The surface-treated copper foil is such that roughened particles are formed on the copper foil surface by roughening treatment, the average roughness Rz of the TD of the roughened surface is 0.20 to 0.80 mu m, the 60 degree glossiness of the MD of the roughened surface is 76 to 350% , The ratio A / B of the surface area A of the above-mentioned coarse particles to the area B obtained when the above-mentioned coarse particles are viewed from the plane of the surface of the copper foil is 1.90 to 2.40.

Method for anisotropic plating and thin- film coil

(과제) 애스펙트비(比)가 높고 매우 좁은 피치의 라인 앤드 스페이스 패턴을 확실하게 형성하는 것이 가능한 이방성 도금 방법을 제공한다. (해결 수단) 전류를 인가하여 피막을 형성하는 이방성 도금 방법에 있어서, 도금 형성용의 전극막 혹은 당해 전극막의 표면에 형성된 피막의 표면에 발생한 도금액(21)의 금속 이온 희박층(17) 중, 선택적으로 도금 성장시키고 싶은 방향으로 존재하는 당해 금속 이온 희박층(17)을 도금액(21)의 교반에 의해 부분적으로 파괴하면서 피막을 형성한다. [PROBLEMS] To provide an anisotropic plating method capable of reliably forming a line-and-space pattern having a high aspect ratio and a very narrow pitch. (17) of a plating solution (21) formed on a surface of a plating film or an electrode film for forming a plating film, the plating solution (21) The metal ion lean layer 17, which is selectively present in a direction in which plating is desired to be grown, is partially broken by stirring of the plating liquid 21 to form a coating film.

The copper alloy lath of the belt surface coating of excellent heat resistance

一种耐热性优异的带表面被覆层的铜合金板条，其特征在于，以铜合金板条作为母材，在表面按顺序形成有由Ni层、Cu‑Sn合金层和Sn层构成的表面被覆层，所述Ni层的平均厚度为0.1～3.0μm，所述Cu‑Sn合金层的平均厚度为0.2～3.0μm，所述Sn层的平均厚度为0.05～5.0μm，并且所述Cu‑Sn合金层为1)由η相构成，或2)由ε相和η相构成，所述ε相存在于所述Ni层与η相之间，所述ε相的平均厚度对于所述Cu‑Sn合金层的平均厚度的比率为30％以下，所述ε相的长度对于所述Ni层的长度的比率为50％以下，在所述表面被覆层的最表面所述Cu‑Sn合金层的一部分露出，其表面露出面积率为3～75％，所述表面被覆层的表面粗糙度中，至少一个方向的算术平均粗糙度Ra为0.15μm以上，并且全部的方向的算术平均粗糙度Ra为3.0μm以下。

Method for preparing surface treated copper foil

아연-동-니켈의 3원합금 도금 방청층을 가지는 동박에 사용하는 실레인 카플링제의 효과를 최대한으로 꺼내는 것으로, 0.2mm 폭 동박회로에서 10% 이하의 내염산성 열화율을 확보할 수 있으며, 더욱이, 내습성이 우수한 표면처리 동박의 공급을 목적으로 한다. 그 목적을 달성하기 위하여, 동박 표면에 대한 조화처리와 방청처리를 한 표면처리 동박이고, 상기 방청처리는, 동박 표면에 아연-동-니켈의 3원합금 도금 방청층을 형성하며, 상기 방청도금층의 표면에 전해 크로메이트도금층을 형성하고, 상기 방청도금층 위에 실레인 커플링제 흡착층을 형성하여 전해동박 자체의 온도를 105℃∼200℃의 범위로 하여 2∼6초간 건조시키는 것에 의해 얻어지는 프린트 배선판용 표면처리 동박 등에 의한다. By maximizing the effect of the silane coupling agent used for copper foil having a zinc-copper-nickel ternary alloy plating rustproof layer, a hydrochloric acid resistance degradation rate of 10% or less can be secured in a 0.2mm width copper foil circuit. Moreover, it aims at supplying the surface-treated copper foil excellent in moisture resistance. In order to achieve the object, it is a surface-treated copper foil subjected to the roughening treatment and the rust-preventing treatment on the surface of the copper foil, wherein the rust-preventing treatment forms a ternary alloy plated rustproof layer of zinc-copper-nickel on the surface of the copper foil; The surface for a printed wiring board obtained by forming an electrolytic chromate plated layer on the surface of the film, forming a silane coupling agent adsorption layer on the rust preventive plated layer, and drying the temperature of the electrolytic copper foil itself in the range of 105 ° C to 200 ° C for 2 to 6 seconds. Processed copper foil or the like. 실레인 커플링(silane coupling), 3원합금, 조화(粗化)처리, 축합(縮合)결합, 관능기(官能基), 상태(常態), 벌크 동박, 전해동박 Silane coupling, ternary alloy, roughening treatment, condensation bonding, functional group, state, bulk copper foil, electrolytic copper foil

Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes

描述了通过添加制造通过电沉积纳米叠层材料来涂覆的预成型件而制备的制品及其生产方法。本公开的实施方案提供了用于生产制品的方法。此类方法包括至少两个步骤。第一步骤涉及通过添加制造例如三维(3D)打印形成预成型件。然后使预成型件经受电化学工艺，其提供具有期望的化学、物理和/或机械性质的纳米叠层金属涂层。

Process for the electrochemical coating or stripping of components

Es wird ein Verfahren zum elektrochemischen Be- oder Entschichten von Bauteilen (1) zur Verfügung gestellt, in dem das Bauteil (1) als Elektrode dient und in dem zwischen dem Bauteil (1) und einer Gegenelektrode (3) ein elektrisches Feld aufgebaut wird, welches zum Abscheiden eines in einem Elektrolyten gelösten Beschichtungsmaterials oder zum Abtragen eines auf der Bauteiloberfläche (2) befindlichen Beschichtungsmaterials (11) führt. Das Bauteil (1) ist während des Abscheidens bzw. während des Abtragens von Strukturen (5) aus einem elektrisch isolierenden Material überzogen. A method is provided for electrochemically coating or stripping components (1), in which the component (1) serves as an electrode and in which an electric field is built up between the component (1) and a counterelectrode (3). which leads to the deposition of a coating material dissolved in an electrolyte or to the removal of a coating material (11) located on the component surface (2). The component (1) is coated during the deposition or during the removal of structures (5) made of an electrically insulating material.

CORROSION RESISTANT MULTILAYER COATING AND ELECTRODEPOSITION METHOD

coberturas e revestimentos nanolaminadas eletrodepositadas para proteção à corrosão a presente invenção refere-se à cobertura e revestimento de multicamadas resistente à corrosão que compreende camadas múltiplas em nanoescalas, que variam periodicamente em espécies eletrodepositadas ou microestruturas eletrodepositadas. os revestimentos podem compreender metais eletrodepositados, cerâmicas, polímeros ou combinações dos mesmos. também são aqui descritos métodos para a preparação das coberturas e revestimentos. electroplated nano-laminated covers and coatings for corrosion protection the present invention relates to the corrosion resistant multilayer covering and coating comprising multiple layers in nanoscales, which vary periodically in electrodeposited species or electrodeposited microstructures. coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. methods for preparing covers and coatings are also described herein.

Electrolytic copper foil for printed wiring boards and manufacturing method thereof

본 발명은 프린트배선판에 사용되는 전해구리박 및 그제조방법에 관한 것으로서, 배선패턴형성시의 에칭특성 및 고주파특성에 뛰어나고, 절연신뢰성에 뛰어난 초미세패턴용도에 적합한 프린트배선판용 전해구리박과 그 제조방법을 제공하는 것을 과제로 한 것이며, 그 해결수단으로써 전해구리박의 혹붙임처리전의 조면쪽의 표면조도가 1.5㎛이하이고, 상기 조면위에 상기 혹붙임처리한 후의 표면조도가 1.5∼2.0㎛인 것을 특징으로 하는 전해구리박 및 전해구리박의 조면쪽을 버프에 의해 연마해서 혹붙임처리전의 표면조도를 1.5㎛이하로 하고 상기 조면쪽위에 상기 혹붙임처리해서 표면조도를 1,5∼2.0㎛으로 하는 것을 특징으로 한 프린트배선판용 전해구리박의 제조방법을 제공한다. BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an electrolytic copper foil for use in printed wiring boards and a method for manufacturing the same. The object of the present invention is to provide a manufacturing method. As a solution, the surface roughness of the surface of the electrolytic copper foil before roughening is 1.5 µm or less, and the surface roughness after the roughening on the rough surface is 1.5 to 2.0 µm. The rough surface side of the electrolytic copper foil and the electrolytic copper foil which are characterized by being buffed by buffing, the surface roughness before the roughening process is 1.5 µm or less, and the roughness is treated on the roughened surface and the surface roughness is 1,5 to 2.0. Provided is a method for producing an electrolytic copper foil for a printed wiring board, characterized in that it is set to µm.

Method for roughing electrolytic copper foil for circuit board

PURPOSE: Provided is a method for roughing an electrolytic copper foil for a printed circuit board, which can improve the adhesive strength of the electrolytic copper foil to an insulating substrate. CONSTITUTION: The method comprises the steps of: installing a diaphragm(6) with slits(5) between an anode plate(3) and the electrolytic copper foil(4) as a cathode; applying direct current, thereby generating the direct current and pulse current from the anode plate(3) through the slits(5) of the diaphragm(6) to form a nodule layer on the electrolytic copper foil(4). The method is performed at an electrolyte(1) temperature of 15-70deg.C for 3-15 seconds under the current density of 10-150A/dm¬2.

Surface-treated copper foil, copper-clad laminate and printed wiring board

銅箔２と、銅箔２の一方の面に形成された第一表面処理層３とを有する表面処理銅箔１である。この表面処理銅箔１の第一表面処理層３は、ＣＩＥ Ｌ*ａ*ｂ*表色系のＬ*が４４．０〜８４．０である。また、銅張積層板１０は、表面処理銅箔１と、表面処理銅箔１の第一表面処理層３と反対側の面に接着された絶縁基材１１とを備える。 A surface-treated copper foil 1 having a copper foil 2 and a first surface-treated layer 3 formed on one surface of the copper foil 2. The first surface-treated layer 3 of the surface-treated copper foil 1 has a CIE L * a * b * color system L * of 44.0 to 84.0. Further, the copper-clad laminate 10 includes a surface-treated copper foil 1 and an insulating base material 11 adhered to a surface of the surface-treated copper foil 1 opposite to the first surface-treated layer 3.

Method for producing surface-modified conductive material

Roughened copper foil, copper-clad laminate, and printed wiring board

本发明的课题在于提供一种能够显著地提升与低介电常数的热塑性树脂的耐热剥离强度的粗化处理铜箔。本发明的粗化处理铜箔是在至少一侧具有由包含氧化亚铜和/或氧化铜的针状结晶和/或板状结晶构成的粗化处理面的粗化处理铜箔，粗化处理面的通过连续电化学还原分析(SERA)确定的氧化亚铜厚度为71～300nm，并且通过连续电化学还原分析(SERA)确定的氧化铜厚度为0～20nm。

Muting glucose sensor oxygen response and reducing electrode edge growth with pulsed current plating

The invention disclosed herein includes amperometric glucose sensors having electrodes formed from processes that electrodeposit platinum black in a manner that produces relatively smooth three dimensional metal architectures, ones that contribute to sensor reliability and stability. Embodiments of the invention provide analyte sensors having such uniform electrode architectures as well as methods for making and using these sensor electrodes. A number of working embodiments of the invention are shown to be useful in amperometric glucose sensors worn by diabetic individuals.

Surface-treated copper foil, copper clad laminate and printed wiring board

동박(2)과, 동박(2)의 한쪽 면에 형성된 제1 표면 처리층(3)을 갖는 표면 처리 동박(1)이다. 이 표면 처리 동박(1)의 제1 표면 처리층(3)은, XPS의 뎁스 프로파일에 있어서, 스퍼터링레이트 2.5㎚/분(SiO 2 환산)으로 1분 스퍼터링을 행하였을 때의 C, N, O, Zn, Cr, Ni, Co, Si 및 Cu의 원소의 합계량에 대한 Ni 농도가 0.1 내지 15.0atm％이다. 또한, 동장 적층판(10)은, 표면 처리 동박(1)과, 표면 처리 동박(1)의 제1 표면 처리층(3)에 접착된 절연 기재(11)를 구비한다. It is the copper foil 2 and the surface-treated copper foil 1 which has the 1st surface-treated layer 3 formed in the one surface of the copper foil 2 . In the depth profile of XPS, the 1st surface-treated layer 3 of this surface-treated copper foil 1 WHEREIN: C, N, O at the time of sputtering for 1 minute at a sputtering rate 2.5 nm/min (SiO2 conversion). , Zn, Cr, Ni, Co, Si and the Ni concentration with respect to the total amount of the elements of Cu is 0.1 to 15.0 atm%. Moreover, the copper clad laminated board 10 is equipped with the surface-treated copper foil 1 and the insulating base material 11 adhere|attached to the 1st surface-treated layer 3 of the surface-treated copper foil 1 .

Copper foil with carrier, laminate, printed wiring board, and method for manufacturing printed wiring board

극박 구리층 표면의 회로 형성성이 양호한 캐리어 부착 동박을 제공한다. 캐리어 부착 동박은, 캐리어, 중간층, 극박 구리층을 이 순서로 갖는다. 극박 구리층 표면의 파장이 400 ㎚ 인 광의 흡수율이 85 ％ 이상이다. A copper foil with a carrier having excellent circuit forming property on the surface of a very thin copper layer is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order. The absorption rate of light having a wavelength of 400 nm on the surface of the ultra-thin copper layer is 85% or more.

Edgeless pulse plating and metal cleaning methods for solar cells

A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.

Enhanced technique for production of golden bronze by inter-diffusion of tin and copper under controlled conditions

FIELD: electrolytic methods. SUBSTANCE: invention relates to methods for producing a metal article with an outer bronze layer having the appearance of golden or red bronze and can be used for making coins. Multilayer substrate is provided, comprising a core having an outer contact surface, a copper layer electrolytically applied to the outer contact surface of the core, a tin layer electrolytically applied to the copper layer, and an upper metal layer electrolytically applied to the tin layer and containing copper and / or zinc, and annealing the multilayer substrate to enable the diffusion of the tin layer into the copper layer and the upper metal layer and obtaining an annealed substrate containing a bronze outer layer formed as a result of inter-diffusion, having the appearance of golden bronze with tin content between 8-15 wt%. Outer contact surface of the core is made without nickel to prevent formation of tin and nickel containing intermetallic compounds near the outer contact surface during annealing. Thickness of the upper metal layer is 0.1-4 mcm in accordance with the thickness of the copper layer and the thickness of the tin layer to prevent tin droplets from forming during the annealing process as a result of inter-diffusion of the outer layer of bronze. EFFECT: enabling production of improved articles having a decorative coating of bronze, having a yellow-golden colour, similar to a gold or red colour. 48 cl, 21 dwg, 4 ex РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 658 775 C2 (51) МПК C25D 5/10 (2006.01) C25D 5/50 (2006.01) C25D 7/06 (2006.01) B32B 15/01 (2006.01) A44C 21/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК C25D 5/10 (2006.01); C25D 5/50 (2006.01); C25D 7/06 (2006.01); B32B 15/01 (2006.01); A44C 21/00 (2006.01) (21)(22) Заявка: 2015118226, 08.11.2012 08.11.2012 Дата регистрации: Приоритет(ы): (22) Дата подачи заявки: 08.11.2012 (43) Дата публикации заявки: 27.12.2016 Бюл. № 36 (56) ...

Steel sheet for can and method for producing same

本发明提供焊接性优异的罐用钢板及其制造方法。上述罐用钢板在钢板的表面从上述钢板侧起依次具有金属铬层及水合氧化铬层，上述金属铬层的附着量为50～200mg/m 2 ，上述水合氧化铬层的铬换算附着量为3～30mg/m 2 ，上述金属铬层包含厚度为7.0nm以上的基部和在上述基部上设置的粒状突起，该粒状突起的最大粒径为200nm以下，且单位面积个数密度为30个/μm 2 以上。

Copper foil for chip-on-film

Surface-treated copper foil and laminated sheet, printed wiring board, and electronic device using same, as well as method for producing printed wiring board

수지와 양호하게 접착하고, 또한 동박을 에칭으로 제거한 후의 수지 투명성이 우수한 표면 처리 동박 및 그것을 사용한 적층판을 제공한다. 적어도 일방의 동박 표면에 조화 처리에 의해 조화 입자가 형성되고, 조화 처리 표면의 상기 조화 입자에 대하여 장경이 100 ㎚ 이하인 조화 입자가 단위 면적당 50 개/㎛ 2 이상 형성되어 있고, 조화 처리 표면의 MD 의 60 도 광택도가 76 ∼ 350 ％ 인 표면 처리 동박. A surface-treated copper foil excellent in resin transparency after being adhered well to a resin and having removed the copper foil by etching, and a laminated board using the same. At least is formed with conditioning particles by a roughening treatment to the copper foil surface of one, is formed in a long diameter of not more than 50 / ㎛ 2 area the roughening particles less than 100 ㎚ unit with respect to the conditioning particles of the roughened surface, the roughened surface MD Of 60 degree gloss of 76 to 350%.

Tin-plated copper terminal material, terminal and wire terminal part structure

本发明提供一种防腐蚀效果好并且接触电阻也低的镀锡端子材、由该端子材构成的端子以及使用该端子的电线终端部结构。该镀锡端子材具有：基材(2)，由铜或铜合金构成；锌层(4)，形成于基材(2)之上，并且由锌合金构成；及锡层(5)，形成于锌层(4)之上，并且由锡合金构成，在锌层(4)及锡层(5)整体中的每单位面积的锡量为0.30mg/cm 2 以上且7.00mg/cm 2 以下，每单位面积的锌量为0.07mg/cm 2 以上且2.00mg/cm 2 以下，在锡层(5)中的表面附近的锌含有率为0.2质量％以上且10质量％以下，锡层(5)的小倾角晶界长度相对于总晶界长度所占的比率为2％以上且30％以下。

Rolled copper foil or electrolytic copper foil for electronic circuit, method for forming electronic circuit and printed substrate using the rolled copper foil or electrolytic copper foil

에칭에 의해 회로를 형성하는 전자 회로용 압연 동박 또는 전해 동박에 있어서, 그 압연 동박 또는 전해 동박의 에칭면측에 형성된 아연 혹은 아연 합금 또는 이들의 산화물로 이루어지는 내열층, 및 그 내열층 상에 형성된 구리보다 에칭 레이트가 낮은 금속 또는 합금인 니켈 또는 니켈 합금층을 구비하고 있는 것을 특징으로 하는 전자 회로용 압연 동박 또는 전해 동박. 동장 적층판의 동박을 에칭에 의해 회로를 형성할 때에, 에칭에 의한 늘어짐을 방지하여, 목적으로 하는 회로폭이 균일한 회로를 형성할 수 있고, 에칭에 의한 회로 형성 시간을 가능한 한 단축시킴과 함께, 니켈 또는 니켈 합금층의 두께를 최대한 얇게 하는 것, 또한 열을 받은 경우에 산화를 억제하여, 통칭 「황변」이라고 불리는 변색을 방지함과 함께, 또한 패턴 에칭에서의 에칭성의 향상, 쇼트나 회로폭의 불량의 발생을 방지하는 것을 과제로 한다. In the rolled copper foil or electrolytic copper foil for an electronic circuit which forms a circuit by etching, the heat resistant layer which consists of zinc or a zinc alloy or these oxides formed in the etching surface side of this rolled copper foil or electrolytic copper foil, and the copper formed on this heat resistant layer Rolled copper foil or electrolytic copper foil for electronic circuits provided with the nickel or the nickel alloy layer which is a metal or alloy with a lower etching rate. When forming a circuit by copper foil of a copper clad laminated board, the sagging by an etching can be prevented, the circuit of which the target circuit width is uniform can be formed, and the circuit formation time by etching is shortened as much as possible, To reduce the thickness of the nickel or nickel alloy layer as much as possible, and also to suppress oxidation when subjected to heat, to prevent discoloration, commonly referred to as "yellowing," and to improve the etching property in pattern etching, and to short circuits and circuits. It is a problem to prevent the occurrence of a defective width.

Patent JPS5740918B2

Complex preparation method of metal and plastics and complex prepared by the same

一种金属与塑料的复合体，包括金属件与形成于金属件表面的塑料件，该金属件的表面通过镀覆处理形成有若干金属柱，塑料件填充于每二相邻的金属柱之间并覆盖于金属件的表面从而与金属件结合。本发明还提供多种金属与塑料的复合成型体的成型方法。

Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures

Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.

Methods and materials for controlling the electrochemistry of analyte sensors

Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

Muting glucose sensor oxygen response and reducing electrode edge growth with pulsed current plating

The invention disclosed is an amperometric glucose sensor having electrodes formed from processes that electrodeposit platinum black by using a pulsed plating process. This can produce relatively smooth three dimensional metal architectures, ones that contribute to sensor reliability and stability. Embodiments of the invention provide analyte sensors having such uniform electrode architectures as well as methods for making (and using) these sensor electrodes. Such electrodes can be used in amperometric glucose sensors worn by diabetic individuals.

Muting glucose sensor oxygen response and reducing electrode edge growth with pulsed current plating

The invention disclosed herein includes amperometric glucose sensors having electrodes formed from processes that electrodeposit platinum black in a manner that produces relatively smooth three dimensional metal architectures, ones that contribute to sensor reliability and stability. Embodiments of the invention provide analyte sensors having such uniform electrode architectures as well as methods for making and using these sensor electrodes. A number of working embodiments of the invention are shown to be useful in amperometric glucose sensors worn by diabetic individuals.

Method for performing an electrochemical reaction in an analyte sensor

Amperometric sensor electrodes

Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

Methods and materials for controlling the electrochemistry of analyte sensors

Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

Methods and materials for controlling the electrochemistry of analyte sensors

Embodiments of the invention provide electrochemical analyte sensors having elements designed to modulate their electrochemical reactions as well as methods for making and using such sensors.

Method of fabricating an interconnection element

Contact structures formed on an electronic component are useful for connecting the component to other electronic components. A contact tip structure can be formed on a sacrificial substrate, then combined with an interconnection element. A preferred contact structure includes some topography, generally in the form of certain raised features. These are formed by embossing depressed features into the sacrificial substrate upon which the contact tip structure is constructed. The contact tip structure can be optimized for making contact with another electrical component.