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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 17786. Отображено 100.
26-01-2012 дата публикации

Inspection systems and methods for blow-molded containers

Номер: US20120018925A1
Автор: Georg V. Wolfe, William E. Schmidt
Принадлежит: AGR International Inc

Systems and methods for in-line inspection of plastic blow molded containers. The inspection system may comprise a plurality of emitter assemblies arranged in a vertical array. Each emitter assembly may cyclically emit light energy in at least two different narrow wavelength bands at a container as the container passes through an inspection area. The system may also comprise a plurality of broadband photodetectors arranged in a vertical array, each photodetector facing at least one of the emitter assemblies with the inspection area therebetween such that the photodetectors are capable of sensing light energy that passes through the container when it is in the inspection area. The system may also comprise a processor in communication with the photodetectors for determining a characteristic of the container based on signals from the photodetectors.

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Номер записи: 1
26-01-2012 дата публикации

In-line metrology system

Номер: US20120021539A1
Автор: Arnold Allenic, Chong Lim, II Stephan Paul George, Oleh Karpenko, Sreenivas Jayaraman
Принадлежит: Individual

A metrology system for gauging and spatially mapping a semiconductor material on a substrate can be used in controlling deposition and thermal activation processes.

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Номер записи: 2
23-02-2012 дата публикации

Position-sensitive metrology system

Номер: US20120045855A1
Автор: Erel Milshtein, Markus E. Beck
Принадлежит: Individual

A metrology system for analyzing a semiconductor device on a substrate can include a metrology sensor.

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Номер записи: 3
19-04-2012 дата публикации

Precision solder resist registration inspection method

Номер: US20120092488A1
Автор: Mark Lawrence Delaney
Принадлежит: Mitutoyo Corp

A method is disclosed for operating a machine vision inspection system to determine a fluorescent imaging height for acquiring a fluorescent image for repeatably determining the location of a feature within the fluorescent material. The height of an exposed workpiece portion exposed outside of the fluorescent material is determined (e.g., using a height sensor or autofocus operations). The determined height is repeatable. The exposed portion has a characteristic height relative to the fluorescent material and/or features located therein. The fluorescent imaging height, which may be inside the fluorescent material, is determined relative to the determined height of the exposed portion. The fluorescent imaging height is determined such that it enhances the detection of the desired feature located within the fluorescent material in the resulting fluorescent image. For a variety of workpieces, the method provides automatic acquisition of appropriately focused fluorescent image more reliably than previously known methods.

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Номер записи: 4
07-06-2012 дата публикации

Method for measuring the film element using optical multi-wavelength interferometry

Номер: US20120140235A1
Автор: Cheng-Chung Lee, Kai Wu
Принадлежит: National Central University

A method for measuring the film element using optical multi-wavelength interferometry is revealed. The invention uses reflection coefficients of thin films at different wavelengths to measure the thickness and optical constants of thin films. The phase difference coming from the phase difference between test and reference surfaces is distinguished from the phase difference from the spatial path difference between reference and test beams by doing measurements on different wavelengths, because they change in different ways as the measuring wavelength changes. The phase is then acquired. Combining with the measured reflectance of thin film, the reflection coefficient of thin film is obtained. Collecting the reflection coefficients of each point, the thin film thickness and optical constants distribution in 2 dimensions are calculated. The surface profile is known through the spatial path differences between reference and test beams. These can be measured in a interferometer to avoid the vibration influence.

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Номер записи: 5
30-08-2012 дата публикации

Method and apparatus for performing film thickness measurements using white light scanning interferometry

Номер: US20120218560A1
Автор: Ki-Nam JOO
Принадлежит: Mitutoyo Corp

The invention relates to a method and an apparatus for measuring the thickness of a transparent film by broad band interferometry, comprising the steps of preparing a correlogram of the film by an interferometer, applying a Fourier transformation to said correlogram to obtain a Fourier phase function, removing a linear component thereof, applying a second integral transformation to the remaining non-linear component to obtain an integral amplitude function of said non-linear component, identifying the peak location of said integral amplitude function and determining the thickness of the film as the double value of the abscissa at said peak location considering a refractive index of a film which is dependent on wavelength. The last two steps may be replaced by identifying the peak locations of said integral amplitude function and determining the thickness of the films as the double values of the abscissas at the peak locations.

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Номер записи: 6
15-11-2012 дата публикации

Pattern inspection method and device for same

Номер: US20120287426A1
Автор: Hideaki Sasazawa, Kiyotaka HORIE, Shigeru Serikawa, Takenori Hirose
Принадлежит: Hitachi High Technologies Corp

In an optical inspection for patterned media for hard disks, a pattern inspection device is provided for inspecting patterns without being susceptible to variations in film thickness and film quality of an underlying film, the device includes optical characteristics detection means for detecting optical characteristics of multilayers by processing, upon the reflected light being dispersed and detected by the spectroscopic detection means, the reflected light from a non-patterned region on the substrate, and processing a detection signal corresponding to, and detecting optical characteristics of, the reflected light from the patterns including the multilayers; and pattern inspection means for inspecting the patterns formed on the multilayers, by viewing, upon the detection of the optical characteristics by the optical characteristics detection means, information on the optical characteristics of the reflected light from the multilayers, and processing information on the optical characteristics of the reflected light from the patterns including the multilayers.

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Номер записи: 7
20-12-2012 дата публикации

Optical measuring device for monitoring a joint seam, joining head and laser welding head with same

Номер: US20120318775A1
Автор: Joachim Schwarz
Принадлежит: Precitec KG

An optical measuring device for monitoring a joint seam, joining head and laser welding head. The optical measuring device monitors a joining region in a workpiece and has at least one light-section device with a first light source for casting a light fan in the direction of the workpiece to be joined, making a triangulation light line within the joining region which intersects a joint seam. An illumination device with a second light source homogeneously illuminates the joining region. A first optical sensor with a first observation beam path for spatially resolved imaging of the triangulation light line is projected onto the joint seam. A second optical sensor with a second observation beam path for spatially resolved imaging of the joint seam is coaxially coupled with the first observation beam path. The readout rate of the first and second optical sensors is >1 kHz and <500 Hz, respectively.

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Номер записи: 8
03-01-2013 дата публикации

Shape measurement method and shape measurement apparatus for tires

Номер: US20130002856A1
Автор: Akinobu Mizutani, Akira Togii, Daisuke Kato, Kenichi Okude
Принадлежит: Bridgestone Corp

A shape measurement method for a tire includes: detecting an outer surface shape data and an inner surface shape of the tire from image data of the outer surface and the inner surface; subjecting irregularities along the tire circumferential direction around the tire in the outer surface shape data and in the inner surface shape data to Fourier transformation to take out primary waveform components respectively; adjusting the tire circumferential positions of both of the waveform components to adjust the tire circumferential positions thereof; adjusting the tire radial direction cross section positions of the outer surface shape data and the inner surface shape data from information about the placement angles and the positions of the first camera and the second camera; and synthesizing the outer surface shape data and the inner surface shape data based on the adjusted tire circumferential positions and the tire radial direction cross section positions.

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Номер записи: 9
10-01-2013 дата публикации

Method for measuring height, non-transitory computer readable medium storing a program for measuring height, and height measuring apparatus

Номер: US20130010107A1
Автор: Masaya Yamaguchi, Yasuo Suzuki
Принадлежит: Nikon Corp

There are provided a method for measuring a height by a height measuring apparatus including: obtaining, in advance, a height correction value depending on an inclination angle of a surface of the object as an angle correction data; obtaining, from the height value of each pixel of the imaging device, the inclination angle of the surface of the object which corresponds to each pixel position of the imaging device; obtaining the height correction value, which corresponds to the inclination angle obtained, from the angle correction data; and correcting the height value of the surface of the object, which corresponds to each pixel of the imaging device, by using the height correction value obtained.

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Номер записи: 10
10-01-2013 дата публикации

Atmospheric molecular contamination control with local purging

Номер: US20130010311A1
Автор: Hidong Kwak, Jagjit Sandhu, Ning-Yi Neil Wang, Torsten Kaack, Ward Dixon
Принадлежит: KLA Tencor Corp

A local purging tool for purging a portion of a surface of a wafer with purging gas is disclosed. The purging tool includes a purging chamber configured to contain purging gas within a cavity of the purging chamber, a permeable portion of a surface of the purging chamber configured to diffuse purging gas from the cavity of the chamber to a portion of a surface of a wafer, and an aperture configured to transmit illumination received from an illumination source to a measurement location of the portion of the surface of the wafer and further configured to transmit illumination reflected from the measurement location to a detector.

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Номер записи: 11
14-03-2013 дата публикации

Die inspection method

Номер: US20130063725A1
Автор: Hidekazu Hayashi, Takao Imaoku
Принадлежит: Sharp Corp

A method is disclosed for inspecting a mold which has a porous alumina layer over its surface. The method includes providing, based on a relationship between a first parameter indicative of a thickness of the porous alumina layer and a color parameter indicative of a color of reflected light from the porous alumina layer, first color information which represents a tolerance of the first parameter of a porous alumina layer which has an uneven structure that is within a tolerance; providing a mold which is an inspection subject, the mold having a porous alumina layer over its surface; obtaining a color parameter which is indicative of a color of reflected light from the porous alumina layer of the inspection subject mold; and determining a suitability of the first parameter of the inspection subject mold based on the obtained color parameter and the first color information.

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Номер записи: 12
14-03-2013 дата публикации

Method for evaluating thin-film-formed wafer

Номер: US20130063733A1
Автор: Kuwabara Susumu
Принадлежит: SHIN-ETSU HANDOTAI CO., LTD.

A method for evaluating a thin-film-formed wafer, being configured to calculate a film thickness distribution of a thin film of the thin-film-formed wafer having the thin film on a surface of a substrate, wherein light having a single wavelength λ is applied to a partial region of a surface of the thin-film-formed wafer, reflected light from the region is detected, reflected light intensity for each pixel obtained by dividing the region into many pieces is measured, a reflected light intensity distribution in the region is obtained, and the film thickness distribution of the thin film in the region is calculated from the reflected light intensity distribution. The method enables a film thickness distribution of the micro thin film (an SOI layer) that affects a device to be measured on the entire wafer surface at a low cost with a sufficient spatial resolution in a simplified manner. 19-. (canceled)10. A method for evaluating a thin-film-formed wafer , the method being configured to calculate a film thickness distribution of a thin film of the thin-film-formed wafer having the thin film on a surface of a substrate ,wherein light having a single wavelength λ is applied to a partial region of a surface of the thin-film-formed wafer, reflected light from the region is detected, reflected light intensity for each pixel obtained by dividing the region into many pieces is measured, a reflected light intensity distribution in the region is obtained, and the film thickness distribution of the thin film in the region is calculated from the reflected light intensity distribution.11. The method for evaluating a thin-film-formed wafer according to claim 10 , wherein the wavelength λ is selected in such a manner that reflectance (R) of irradiation light calculated from a film thickness set value of the thin film of the thin-film-formed wafer becomes 0.2 or above and an absolute value of a reflectance fluctuation coefficient (ΔR/R) with respect to the film thickness of the thin ...

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Номер записи: 13
28-03-2013 дата публикации

LEVEL SENSOR, LITHOGRAPHIC APPARATUS, AND SUBSTRATE SURFACE POSITIONING METHOD

Номер: US20130077079A1
Автор: Benschop Jozef Petrus Henricus, BRINKHOF Ralph, Den Boef Arie Jeffrey, KHUAT DUY Laurent, Macht Lukasz Jerzy, Sarri Dimitra, Venema Willem Jurrianus
Принадлежит: ASML Netherlands B.V.

A level sensor for measuring a position of a surface of a substrate includes a projection unit including an emitter for emitting a radiation beam towards the substrate and a projection grating including a measurement grating and an aperture, such that the radiation beam incident on the projection grating is divided into a measurement radiation beam and a capture radiation beam. The level sensor further includes a detection unit including a first and second measurement detector, a first and second capture detector, a detection grating, and a first and second optical unit. The detection grating includes a ruled grating with multiple rules, which direct radiation towards the first and second measurement detector via the first and second optical unit, and a capture element directing radiation towards the first and second capture detector via the first and second optical unit. 2. A level sensor according to claim 1 , wherein the first capture facet has the same orientation as the first measurement facet claim 1 , and wherein the second capture facet has the same orientation as the second measurement facet.3. A level sensor according to claim 1 , wherein the aperture and capture element are configured such that a width of the capture radiation beam is smaller than the width of the capture element claim 1 , such that the capture radiation beam is not able to illuminate the entire first and second capture facet.4. A level sensor according to claim 1 , wherein the radiation emitted by the light source comprises radiation having a wavelength of less than 400 nm.5. A level sensor according to claim 1 , wherein each rule of the multiple rules of the ruled grating of the detection grating comprises a third measurement facet claim 1 , wherein the detection unit comprises a third measurement detector and a third optical unit claim 1 , wherein the third measurement facet is configured to refract radiation of the measurement radiation beam incident on said third measurement facet ...

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Номер записи: 14
18-04-2013 дата публикации

System and method for measuring layer thickness and depositing semiconductor layers

Номер: US20130095577A1
Автор: Erel Milshtein
Принадлежит: First Solar Inc

Described herein is a method and apparatus for measuring the thickness of a deposited semiconductor material. A colorimeter has an optical source that illuminates a portion of a deposited semiconductor material with optical radiation, a sensor that collects and measures color information related to reflected radiation from the deposited semiconductor material, and a processor that receives the color information related to the reflected radiation from the sensor and calculates a thickness of the semiconductor material. The processor may control a semiconductor material deposition apparatus.

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Номер записи: 15
25-04-2013 дата публикации

TRIBOMETER

Номер: US20130098139A1
Автор: ADAMS, Jr. Robert C.
Принадлежит: TRIBIS ENGINEERING, INC.

A test apparatus and methods of measuring wear of a material with a laser displacement measurement apparatus based upon displacement of a test sample of the material or the wear of a testing surface and a specimen. A lubricant test method and apparatus measures the thickness of a lubricant film between two test surfaces by comparing the location of the test surfaces at rest and dynamically. 1. An apparatus for measuring wear of a test specimen , comprising:a support structure;a test surface supported by the support structure;a test specimen supported by a retainer on the support structure to engage the test surface;a drive operatively engaging at least one of the test surface and the test specimen to move the other of the test surface and the test specimen relative thereto;a laser displacement measurement apparatus supported by the support structure that reflects a laser off of a surface of one of the retainer and the test specimen to measure the displacement of the test specimen.2. The apparatus of wherein the laser displacement measurement apparatus is a first laser displacement apparatus and a second laser displacement apparatus is supported by the support structure that reflects a second laser off of the test surface of the disk claim 1 , wherein the displacement measured by the first and second laser are compared to correct for noise factors in displacement measurements.3. The apparatus of wherein the second laser displacement measurement apparatus is supported by the support structure that reflects a second laser off of a wear track formed on the test surface of the disk by the test specimen claim 2 , wherein the second laser displacement apparatus measures the thickness of a film transferred from the test specimen to the test surface claim 2 , and wherein the displacement measurement can be corrected by adjusting for the film thickness.4. The apparatus of wherein an optical profiling system may be used to determine the profile of the wear track including the ...

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Номер записи: 16
23-05-2013 дата публикации

Level Sensor, a Method for Determining a Height Map of a Substrate, and a Lithographic Apparatus

Номер: US20130128247A1
Автор: Erik Johan Koop, Laurent Khuat Duy, Lukasz Jerzy MACHT, Martinus Cornelis Reijnen
Принадлежит: ASML Netherlands BV

The invention provides a level sensor configured to determine a height level of a surface of a substrate, comprising a detection unit arranged to receive a measurement beam after reflection on the substrate, wherein the detection unit comprises an array of detection elements, wherein each detection element is arranged to receive a part of the measurement beam reflected on a measurement subarea of the measurement area, and is configured to provide a measurement signal based on the part of the measurement beam received by the respective detection element, and wherein the processing unit is configured to calculate, in dependence of a selected resolution at the measurement subarea, a height level of the measurement subarea, or to calculate a height level of a combination of multiple measurement subareas.

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Номер записи: 17
23-05-2013 дата публикации

INTERFERENCE OPTICAL SYSTEM, SUBSTRATE PROCESSING APPARATUS, AND MEASURING METHOD

Номер: US20130128275A1
Автор: MATSUDO Tatsuo, NAGAI Kenji
Принадлежит: TOKYO ELECTRON LIMITED

The interference optical system includes a light source, a collimator, a light-receiving element, a tunable filter, and a calculation apparatus. The collimator emits measuring light from the light source to a first main surface of the object, and receives reflected light from the first main surface and a second main surface. The light-receiving element acquires an intensity of light from the collimator. The tunable filter sweeps a wavelength of the light incident to the light-receiving element. The calculation apparatus measures an interference intensity distribution that has wavelength dependence and is an intensity distribution of the reflected light from the first main surface and the second main surface, and measures the thickness or the temperature of the object based on a waveform obtained by Fourier transforming the interference intensity distribution. 1. An interference optical system for measuring a thickness or a temperature of an object which has a first main surface and a second main surface opposite to the first main surface , the interference optical system comprising:a light source which emits measuring light having a wavelength transmitting through the object;a collimator which is connected to the light source to emit the measuring light from the light source to the first main surface of the object, and receive reflected light from the first main surface and the second main surface;a single light-receiving element which receives the light from the collimator to obtain an intensity of the light;a sweeping unit which sweeps a wavelength of the light incident to the light-receiving element;is a spectrum acquisition unit which measures an interference intensity distribution that has wavelength dependence and is an intensity distribution of the reflected light from the first main surface and the second main surface, by using the sweeping unit and the light-receiving element; anda measuring unit which measures the thickness or the temperature of the object ...

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Номер записи: 18
20-06-2013 дата публикации

Film thickness monitor

Номер: US20130155390A1
Автор: Earl Jensen, Farhat Quli, Kevin O&#39;Brien, Mei Sun
Принадлежит: Individual

A measurement unit comprising a light source and a photodetector may be formed in a cavity in a substrate. The light source produces light that impinges a material layer and is reflected back to the photodetector. Through methods such as interferometry and ellipsometry, the thickness of the material layer may be calculated from the light intensity data measured by the photodetector. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

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Номер записи: 19
20-06-2013 дата публикации

HEIGHT-MEASURING METHOD AND HEIGHT-MEASURING DEVICE

Номер: US20130155415A1
Автор: Nishikawa Takashi
Принадлежит: NIKON CORPORATION

A height-measuring device () in which the focal position of an image-forming optical system () is moved in relative fashion in the direction of an optical axis with respect to an object () to be measured; scanning is performed; images of the object () to be measured, which are formed by the image-forming optical system (), are obtained in order; and the focal position for individual pixels of the images is found, thereby yielding a relative height value of the object to be measured () at positions corresponding to the pixels; wherein a second function (g) is defined on the basis of a first function (f) fitted to a numerical value sequence comprising a coordinate value on the optical axis and a light intensity value for the pixels of a plurality of the images obtained by the scanning, or the coordinate value and a numerical value obtained by processing the light intensity value; and positions on the optical axis at which a correlation value between the numerical value sequence and the second function (g) becomes a maximum value or a minimum value serve as the relative height values of the object to be measured at the positions corresponding to the pixels. 1. A height-measuring method comprising: moving an optical system relative to be measured along an optical axis of the optical system; forming an image of the object to be measured on a surface; measuring a relative height of the object based on a change in brightness in the surface , andfinding a correlation between a first property indicative of the change in brightness with respect to the relative movement of the optical system based on a portion of the first property where the change in brightness with respect to the relative movement of the optical system is large and a second property indicative of the change in brightness with respect to the relative movement of the optical system, and finding the relative height based on the correlation.2. The height-measuring method according to claim 1 , further comprising ...

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Номер записи: 20
20-06-2013 дата публикации

Authentication of articles

Номер: US20130155421A1
Автор: Robert Stewart, Stephen Langstaff
Принадлежит: Individual

The present invention provides a method of authenticating the provenance of an article marked with a transparent polymer film comprising measuring the thickness of the film or of a layer within in the film by white light interferometry and/or by birefringence.

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Номер записи: 21
18-07-2013 дата публикации

DEVICE FOR MONITORING THICKNESS REDUCTION OF INNER SURFACE IN HEAT TRANSFER TUBE OR INNER SURFACE IN EVAPORATION TUBE

Номер: US20130182265A1
Автор: Ikeda Tetsuya, Kagawa Seiji, OKAMOTO Takuya, Okino Susumu
Принадлежит: MITSUBISHI HEAVY INDUSTRIES, LTD.

There is provided a device for monitoring a thickness reduction of an inner surface in a heat transfer tube or an inner surface in an evaporation tube, the device including: a movement unit which moves along a fin tube; a laser measurement unit which is provided in the movement unit and measures the thickness reduction of the inner surface by a laser; a cable which includes a light guiding path for introducing a laser into the laser measurement unit and a light deriving path for transmitting reflected light; and a thickness reduction determining unit which compares the laser measurement data with past data or standard data and determines the current thickness reduction. 1. A device for monitoring a thickness reduction of an inner surface in a heat transfer tube or an inner surface in an evaporation tube comprising:a movement unit adapted to move along the inner surface in the heat transfer tube or the inner surface in the evaporation tube;a laser measurement unit provided in the movement unit for measuring the thickness reduction of the inner surface in the heat transfer tube or the inner surface in the evaporation tube by a laser;a cable including a light guiding path for introducing a laser into the laser measurement unit and a light deriving path for transmitting reflected light; anda thickness reduction determining unit for comparing data of the laser measurement unit with past data or standard data so as to determine the current thickness reduction, wherein 'a sensor head having a laser displacement sensor; and', 'the laser measurement unit includesa prism or mirror for shortening a focal distance of the laser,the laser measurement unit is configured to guide the laser emitted from the laser displacement sensor, emit the laser in a direction perpendicular to the inner surface, move a reflection surface of the laser by 360° in a peripheral wall surface and continuously read a position of the reflection surface through the laser displacement sensor, so as to ...

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Номер записи: 22
29-08-2013 дата публикации

Systems For And Methods Of Characterizing The Thickness Profile Of Laminated Glass Structures

Номер: US20130221238A1
Автор: Li Ming-Jun, Liu Anping
Принадлежит: CORNING INCORPORATED

Systems for and methods of characterizing the thickness profile of laminated glass structures are disclosed, wherein the laminated glass structure has at least one gradual transition region between adjacent glass layers. The method includes sequentially focusing laser light at different focuses along a line within the laminated glass structure. The sequentially formed focuses define corresponding micro-volumes from which fluorescent light emanates due to a multiphoton process. The variation in the intensity of the detected fluorescent light from each micro-volume as a function of distance into the laminated glass structure is used to determine the relative locations of the multiple layers and the at least one gradual transition region. 1. A method of characterizing a thickness profile of a laminated glass structure having a first surface , a body comprising multiple layers and at least one gradual transition region between adjacent layers , comprising:focusing laser light of a first wavelength within the body of the laminated glass structure through the first surface at a surface location and sequentially at different focuses at different distances along a line into the body to cause an emission of fluorescent light of a second wavelength from respective micro-volumes within the body;detecting an intensity of the fluorescent light for each of the micro-volumes; anddetermining relative locations of the multiple layers and the at least one gradual transition region based on a variation in the intensities of the detected fluorescent light as a function of the focus distances.2. The method according to claim 1 , wherein the focuses have a diameter in a range from 1 micron to 10 microns.3. The method according to claim 1 , wherein the relative locations are determined to a resolution R in the range 0.5 micron R 5 microns.4. The method according to claim 1 , wherein each micro-volume has a volume in the range from 10 femtoliters to 3 claim 1 ,500 femtoliters.5. The method ...

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Номер записи: 23
19-09-2013 дата публикации

Methods and apparatus for spectral luminescence measurement

Номер: US20130242300A1
Автор: Romain Sappey
Принадлежит: KLA Tencor Corp

One embodiment relates to a computer-implemented method of processing spectral luminescence mapping data obtained from a substrate, the substrate having an epitaxial layer stack that includes a multiple quantum well. A spectral luminescence and an epi thickness at a location on the substrate are obtained. A spectral modulation for the location may be computed given the epi thickness and material indices of refraction. The underlying luminescence spectrum may then be generated by dividing the measured spectral luminescence by the spectral modulation. Subsequently, a peak wavelength and other parameters may be obtained from the underlying luminescence spectrum. In another embodiment, the underlying luminescence spectrum may be determined, without the epi thickness measurement, using a self-consistent technique. Another embodiment relates to an apparatus for spectral luminescence mapping and epitaxial thickness measurement. Other embodiments, aspects and features are also disclosed.

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Номер записи: 24
26-09-2013 дата публикации

METHOD AND APPARATUS FOR MORPHOLOGICAL ANALYSIS

Номер: US20130253884A1
Автор: Aizenberg Gustavo, Pincu David
Принадлежит: G & D INNOVATIVE ANALYSIS, LTD.

An apparatus arranged to analyze a structure, the apparatus comprising: a control unit; a light source arranged to irradiate a target area of the structure; and a light detector in communication with said control unit, and arranged to detect said irradiated light from said light source after interaction with the target area, said control unit arranged to: transform amplitudes of the detected light to the optical thickness domain, said transform comprising a bilinear transform; determine morphological information of the target area responsive to said performed transform. The determined morphological information is optionally displayed within a three dimensional view of the target area. 1. An apparatus arranged to analyze a structure , the apparatus comprising:a control unit;a target focusing functionality;a light source in optical communication with said target focusing functionality, said light source arranged, in cooperation with said target focusing functionality, to irradiate a plurality of target areas of the structure, each target area comprising a particular area of at least the surface layer of the structure; anda light detector in communication with said control unit, and arranged to detect said irradiated light from said light source after interaction with each target area, control said target focusing functionality such that the target area is irradiated by said light source and said light detector detects said irradiated light from said light source after interaction with the target area;', 'transform the amplitude of the detected light to the optical thickness domain, said transform comprising, for each wave number of the detected light, the equation (1+R)/(1−R), wherein R represents the amplitude of the detected light;', 'determine morphological information of the target area responsive to said performed transform; and', 'output said determined morphological information., 'said control unit arranged, for each of a plurality of target areas of the ...

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Номер записи: 25
10-10-2013 дата публикации

SURFACE TREATMENT STATUS MONITORING DEVICE

Номер: US20130265587A1
Автор: GOTO Hiroomi, KATO Rui, NAGUMO Yuzo
Принадлежит: SHIMADZU CORPORATION

A measurement light having a predetermined wavelength bandwidth from a light source is radiated onto the structure to be measured in a specimen light reflected from a first plane and second plane of the structure to be measured is made to interfere in an optical fiber, and a spectrum of the interference light is generated. This interference light spectrum is acquired by a spectrometric unit at two time points separated in time, and in data processing unit, absolute difference area computation unit determines the absolute difference area of the difference spectrum. This absolute difference area changes periodically each time the dimension of the structure to be measured changes by λ/4, making it possible to determine the dimension of the structure to be measured based on that change. 1. A surface treatment status monitoring device which measures a dimension of a structure to be measured , such as the depth or level difference of a hole or groove formed on a substrate through surface treatment , or the increasing or decreasing thickness of a film layer or substrate , and which includes a light source which generates measurement light having a predetermined wavelength bandwidth , an interference optical system which generates interference of light reflected respectively from a first plane and a second plane of the structure to be measured , a spectrometric unit which disperses wavelength of the interference light generated by the interference optical system , and a detection unit which detects the intensity of each wavelength of light dispersed by the spectrometric unit and generates a spectrum , the device comprising:a) a spectrum acquisition unit which acquires the spectrum of interference light with said detection unit at two time points separated in time;b) a difference area computation unit which determines the absolute difference area of two spectra obtained by said spectrum acquisition unit; andc) an analysis unit which determines the dimension of the structure ...

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Номер записи: 26
10-10-2013 дата публикации

CONTAINER THICKNESS MEASURING SYSTEMS AND METHODS

Номер: US20130268237A1
Автор: Fisher Edward J., Peterson Jeffery A., Schmidt William E., Wolfe Georg V.
Принадлежит:

Various embodiments are directed to systems and methods for measuring a thickness of a container. For example, a control device may receive data indicating a surface topology of the container and based on the surface topology of the container, instruct a multi-axis positioning system to position a sensor relative to a first point of the container such that: a distance from the sensor to a surface at the first point is about equal to a predetermined distance; and the sensor direction is about normal to the surface at the first point. Data indicating the thickness at the first point may be received from the sensor. 1. A system for measuring a thickness of a container , the system comprising:a sensor to receive a reflection of illumination from the container, wherein the sensor is sensitive along a sensor direction; anda multi-axis positioning system mechanically coupled to the sensor; and receive data indicating a surface topology of the container;', a distance from the sensor to the surface at the first point is about equal to a predetermined distance; and', 'the sensor direction is about normal to the surface at the first point., 'based on the surface topology of the container, instruct the multi-axis positioning system to position the sensor relative to a first point of the container such that], 'a control device comprising at least one processor and operatively associated data storage, wherein the data storage comprises instructions that, when executed by the at least one processor, cause the control device to2. The system of claim 1 , wherein the data storage further comprises instructions that claim 1 , when executed by the at least one processor claim 1 , cause the control device to:receive from the sensor data indicating a thickness of the container at the first point of the container; a distance from the sensor to the surface at the second point is about equal to the predetermined distance; and', 'the sensor direction is about normal to the surface at the ...

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Номер записи: 27
14-11-2013 дата публикации

Defect inspection method and defect inspection apparatus

Номер: US20130301042A1
Автор: Toshifumi Honda, Yukihiro Shibata, Yuta Urano
Принадлежит: Hitachi High Technologies Corp

A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.

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Номер записи: 28
28-11-2013 дата публикации

LIGHT INTERFERENCE SYSTEM AND SUBSTRATE PROCESSING APPARATUS

Номер: US20130314713A1
Автор: NAGAI Kenji
Принадлежит:

A light interference system and a substrate processing apparatus can suppress loss of reflection spectrum. The light interference system 1 includes a light source a coupler multiple collimators A and B, a collimator a mirror a spectrometer and an operation unit The collimator and the mirror are provided at a side of multiple input terminals except a first input terminal and configured to send reflected lights from multiple output terminals to the multiple output terminals again. 1. A light interference system of measuring a thickness or a temperature of a measurement target object having a first main surface and a second main surface facing the first main surface , the light interference system comprising:a light source configured to emit a measurement light having a wavelength that transmits the measurement target object;a coupler having multiple input terminals and multiple output terminals corresponding to the multiple input terminals, at least one of the multiple input terminals serving as a first input terminal configured to receive the measurement light from the light source;multiple first collimators respectively connected to the multiple output terminals of the coupler, each being configured to emit the measurement light to the first main surface of the measurement target object and to receive reflected lights from the first main surface and the second main surface;a transmission device provided at a side of the multiple input terminals except the first input terminal and configured to send the reflected lights from the multiple output terminals to the multiple output terminals again;a spectrometer connected to the first input terminal and configured to measure an interference intensity distribution that is an intensity distribution of the reflected lights from the first main surface and the second main surface, the interference intensity distribution being dependent on a wavelength; anda measurement unit connected to the spectrometer and configured to ...

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Номер записи: 29
05-12-2013 дата публикации

REAL-TIME TEMPERATURE, OPTICAL BAND GAP, FILM THICKNESS, AND SURFACE ROUGHNESS MEASUREMENT FOR THIN FILMS APPLIED TO TRANSPARENT SUBSTRATES

Номер: US20130321805A1
Автор: Barlett Darryl, II Charles A, Taylor, Wissman Barry D.
Принадлежит: K-SPACE ASSOCIATES, INC.

A method and apparatus () used in connection with the manufacture of thin film semiconductor materials () deposited on generally transparent substrates (), such as photovoltaic cells, for monitoring a property of the thin film (), such as its temperature, surface roughness, thickness and/or optical absorption properties. A spectral curve () derived from diffusely scattered light (′) emanating from the film () reveals a characteristic optical absorption (Urbach) edge. Among other things, the absorption edge is useful to assess relative surface roughness conditions between discrete material samples () or different locations within the same material sample (). By comparing the absorption edge qualities of two or more spectral curves, a qualitative assessment can be made to determine whether the surface roughness of the film () may be considered of good or poor quality. 1. A method for assessing at least the surface roughness of a thin film applied to a generally transparent substrate , said method comprising the steps of:a) providing a generally transparent substrate;b) depositing a thin film of material onto the substrate; the film material composition exhibiting an optical absorption (Urbach) edge; the film having an upper exposed surface with a measurable surface roughness;c) interacting white light with the film deposited on the substrate to produce diffusely scattered light;d) detecting the diffusely scattered light emanating from the film with a detector spaced apart from the film;e) collecting the detected light in a spectrometer; using the spectrometer to produce spectral data in which the detected light is resolved into discrete wavelength components of corresponding light intensity;f) identifying the optical absorption (Urbach) edge in the spectral data; andg) determining a relative surface roughness of the film as a function of the absorption edge.2. The method of wherein said step of determining the surface roughness includes computing the area under the ...

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Номер записи: 30
19-12-2013 дата публикации

THICKNESS MONITORING DEVICE, ETCHING DEPTH MONITORING DEVICE AND THICKNESS MONITORING METHOD

Номер: US20130334422A1
Автор: GOTO Hiroomi, KATO Rui, NAGUMO Yuzo
Принадлежит:

A thickness monitoring device capable of performing thickness measurement of an object of measurement in real time even when using a relatively narrow band light source. This etching monitoring device (thickness monitoring device) includes a light source which produces measurement light having a predetermined wavelength bandwidth; an array detector which detects, for each wavelength, interference light of measurement light reflected from mask, whereof the thickness changes over time; and data processing unit which computes the thickness of the mask based on change over time of a plurality of single-wavelength components of the interference light detected by the array detector. 1. A thickness monitoring device comprising:a light source which produces a measurement light having a predetermined wavelength bandwidth;a detection unit which detects, for each wavelength, interference light of said measurement light reflected from an object of measurement whereof the thickness changes over time; anda thickness computation unit which computes the thickness of said object of measurement based on change over time of a plurality of single-wavelength components of the interference light detected by said detection unit.2. A thickness monitoring device as described in claim 1 , wherein said object of measurement is an etching mask whereof the thickness changes during etching; andsaid detection unit is configured to detect, for each wavelength, interference light of reflected light from the top surface of said etching mask and reflected light which is reflected from the boundary surface on the side opposite to said etching mask.3. A thickness monitoring device as described in claim 1 , wherein said thickness computation unit is configured to detect the phase of each wavelength component at a predetermined time based on change over time of said plurality of single-wavelength components claim 1 , and to compute the thickness of said object of measurement at said predetermined time ...

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Номер записи: 31
19-12-2013 дата публикации

METHOD OF AUTHENTICATING A POLYMER FILM

Номер: US20130335732A1
Автор: Stewart Robert Laird
Принадлежит: INNOVIA FILMS SARL

A method of authenticating a polymer film comprises measuring the thickness of a layer therein by white light interferometry and/or measuring the birefringence of a layer therein. The method, and devices to carry out the method, may be used in security applications, for example to test for counterfeit bank notes. 1. A method of authenticating a polymer film comprising measuring the birefringence of a layer therein.2. The method according to claim 1 , wherein the film is a multi-layer film.3. The method according to claim 2 , wherein birefringence measurement is made on a core layer of the film.4. The method according to claim 1 , additionally comprising measuring the thickness of a layer therein by white light interferometry.5. The method according to claim 4 , wherein the measurement of thickness by white light interferometry is made on a core layer of the film.6. The method according to claim 1 , wherein measurement is carried out on more than one layer.7. The method according to claim 1 , wherein the measurement is carried out using a pulsed light source.8. The method according to claim 1 , wherein the measurement is carried out using a detuned light source.9. The method according to claim 1 , wherein the measurement is carried out using an LED light source.10. The method according to claim 1 , wherein the film comprises at least one clarifying agent.11. The method according to claim 1 , wherein the film is prepared by a bubble process.12. The method according to claim 1 , wherein the film comprises a layer of biaxially oriented polypropylene (BOPP).13. The A method according to claim 1 , wherein the film comprises a monoweb of three or more polymeric layers.14. The A method according to claim 1 , wherein the film comprises a double web of five or more polymeric layers.15. The A method according to claim 1 , wherein the method differentiates between films made by a bubble process and films made by a different process.16. A method of authenticating an object claim ...

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Номер записи: 32
19-12-2013 дата публикации

METHOD AND APPARATUS FOR DETERMINING A PROPERTY OF A SURFACE

Номер: US20130335747A1
Автор: HAITJEMA Han, QUAEDACKERS Johannes Anna
Принадлежит:

Method of determining a property of a sample from a correlogram obtainable by scanning of a surface of the sample through a focal plane of an objective using broad-band interferometry is provided. The correlogram may be displaying interference radiation intensity as a function of the scanning distance from the surface. The correlogram may be correlated with a secondary correlogram to obtain a cross correlogram or with the same correlogram to obtain an autocorrelogram. A property of the sample may be determined from the auto or cross correlogram. 1. A method for determining a property of a sample from a correlogram obtainable by scanning of a surface of the sample through a focal plane of an objective while applying broad-band interferometry , the sample including a film transparent for the broadband radiation used in the broad-band interferometry , the method comprising:receiving a correlogram having interference radiation intensity as a function of the scanning distance from the surface;autocorrelating the received correlogram with itself to calculate an autocorrelogram as a cross correlogram; anddetermining the property of the sample from the autocorrelogram as the cross correlogram.2. The method according to claim 1 , wherein the determining the property of the sample comprises determining a thickness of the film from the autocorrelogram.3. The method according to claim 1 , wherein the determining the property of the sample comprises determining a refractive index of the film from the autocorrelogram.4. The method according to claim 1 , further comprising fitting a physical model to the autocorrelogram.5. The method according to claim 1 , further comprising:storing a plurality of reference autocorrelograms with their related property in a memory to provide a lookup table;iteratively comparing the calculated autocorrelogram with reference autocorrelograms from the lookup table to find the stored reference autocorrelogram which fits the autocorrelogram the best; ...

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Номер записи: 33
26-12-2013 дата публикации

VISION TESTING DEVICE USING MULTIGRID PATTERN

Номер: US20130342677A1
Автор: Kim Sung Hyun, Koo Ja Myoung, Oh Sang Min, Park Chan Wha
Принадлежит: Mirtec Co. Ltd

Provided is a vision testing device using a multigrid pattern for determining good or bad of a testing object by photographing the testing object assembled or mounted during the component assembly process and comparing the photographed image with a previously inputted target image, comprising: a stage part for fixing or transferring the testing object to the testing location; a lighting part for providing lighting to the testing object located on an upper portion of the stage part; a center camera part for obtaining a 2-dimensional image of the testing object located in a center of the lighting part; a irradiating part placed on a side section of the center camera part; a vision processing unit for reading the image photographed by the center camera part and determining good or bad of the testing object; and a control unit for controlling the stage part, the grid pattern irradiating part, the center camera part, wherein the grid pattern irradiating part irradiates grid patterns having periods of different intervals. 1. A vision testing device using a multigrid pattern for determining good or bad of a testing object by photographing a testing object assembled or mounted during the component assembly process and comparing the photographed image with a previously inputted target image , comprising:a stage part for fixing or transferring the testing object to a testing location;a lighting part for providing lighting to the testing object located on an upper portion of the stage part;a center camera part for obtaining a 2-dimensional image of the testing object located in a center of the lighting part;a grid pattern irradiating part placed on a side section of the center camera part;a vision processing unit for reading the image photographed by the center camera part and determining good or bad of the testing object; anda control unit for controlling the stage part, the grid pattern irradiating part, the center camera part, wherein the grid pattern irradiating part ...

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Номер записи: 34
26-12-2013 дата публикации

System and method for improved visual detection of protective coatings

Номер: US20130342824A1
Автор: Sergey G. Ponomarev
Принадлежит: Boeing Co

The present disclosure provides a system and method for providing an improved protective coating for a substrate that may be inspected using the unaided eye or other apparatus under available light. The protective coating is mixed with an additive comprising flakes or particles that, when applied to the substrate as part of the protective coating, allow the user to empirically determine if the surface has received an adequate protective coat. The determination of whether or not any defects exist may include comparing the observed appearance of the specialty pigment particles with a comparative standard.

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Номер записи: 35
09-01-2014 дата публикации

System and method for rigging a control surface of an aircraft

Номер: US20140007397A1
Автор: Denis OEGRETICI, Frank DIERENFELDT, Gerd Stahl
Принадлежит: AIRBUS OPERATIONS GMBH

A system for rigging a control surface of an aircraft, wherein the control surface is movable relative to a reference structure of the aircraft by means of at least one actuator, comprises a mobile control unit having being connectable to at least one actuator, an input means for commanding a deflection of the control surface, and an optical rigging apparatus having a first rigging component and a second rigging component. The first rigging component is adapted for being mounted on a reference structure to which the control surface is swivably attached and the second rigging component is adapted for being mounted on the control surface itself. Thereby an accurate rigging may be conducted with a clearly reduced number of personnel and a clearly reduced time for completion.

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Номер записи: 36
16-01-2014 дата публикации

OPTICAL FILM THICKNESS MEASURING DEVICE AND THIN FILM FORMING APPARATUS USING THE OPTICAL FILM THICKNESS MEASURING DEVICE

Номер: US20140016139A1
Автор: Jiang Yousong, Ozawa Kenji, Sai Kyokuyo
Принадлежит: SHINCRON CO., LTD.

An optical film thickness measuring device, enabling direct measurement of a film thickness of a product in real time accurately without a monitor substrate, includes: a projector, a light receiver, inner beam splitters disposed in a base substrate holder to reflect a measurement beam to a base substrate, an inner optical reflector that totally reflects a measurement beam from the closest inner beam splitter, external beam splitters the measurement beam from the inner beam splitters toward the light receiver, and an outer optical reflector that reflects the measurement beam from the optical reflector toward the light receiver. The measurement beam reflected by the inner beam splitters and the inner optical reflector is passed through the base substrate and then reflected by the external beam splitters and the outer optical reflector to be guided to the light receiver, so that the measurement beam is received by the light receiver. 1. An optical film thickness measuring device for an optical thin film forming apparatus including a rotating base substrate holder , comprising:a projector that projects a measurement beam from one side of an axial line of a rotating shaft of the rotating base substrate holder toward an inside of the base substrate holder,a light receiver that receives the measurement beam from the projector,a plurality of inner beam splitters that is provided inside the base substrate holder so as to reflect the measurement beam projected from the projector to a base substrate,an inner optical reflector that is provided inside the base substrate holder so as to totally reflect a measurement beam from a closest inner beam splitter among the plurality of inner beam splitters,a plurality of external beam splitters that is provided outside the base substrate holder so as to reflect the measurement beam from the plurality of inner beam splitters toward the light receiver, andan outer optical reflector that is provided outside the base substrate holder so as ...

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Номер записи: 37
23-01-2014 дата публикации

FILM THICKNESS MEASURING DEVICE AND FILM THICKNESS MEASURING METHOD

Номер: US20140022564A1
Автор: KAWAI Shingo, YAMADA Takeo, YAMAMOTO Takeshi
Принадлежит: NIRECO CORPORATION

A film thickness measuring device includes a spectroscopic sensor and a data processor, wherein the spectroscopic sensor measures spectroscopic data of a film coated on a substrate and the data processor obtains measured color characteristic variables from the measured spectroscopic data, compares the measured color characteristic variables with plural sets of theoretical color characteristic variables corresponding to plural sets of values, each set including one of plural values of thickness and one of plural values of index of refraction of the film, determines index of refraction of the film using the set of values corresponding to the set of theoretical color characteristic variables which minimizes a difference between the set of theoretical color characteristic variables and the measured color characteristic variables, and determines thickness of the film using the index of refraction of the film. 1. A film thickness measuring device comprising a spectroscopic sensor and a data processor ,wherein the spectroscopic sensor measures spectroscopic data of a film coated on a substrate and the data processor obtains measured color characteristic variables from the measured spectroscopic data, compares the measured color characteristic variables with plural sets of theoretical color characteristic variables corresponding to plural sets of values, each set including one of plural values of thickness and one of plural values of index of refraction of the film, determines index of refraction of the film using the set of values corresponding to the set of theoretical color characteristic variables which minimizes a difference between the set of theoretical color characteristic variables and the measured color characteristic variables, and determines thickness of the film using the index of refraction of the film.2. A film thickness measuring device according to claim 1 , wherein the spectroscopic sensor measures transmittance distribution of the film coated on the ...

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Номер записи: 38
30-01-2014 дата публикации

WEB THICKNESS MEASURING EQUIPMENT AND METHOD

Номер: US20140028999A1
Автор: Jun Pilgoo, KIM Cheolhong, Lee Junsub, Sim Youngcheol
Принадлежит: Samsung SDI Co., Ltd.

A web thickness measuring equipment and a method of measuring a web thickness. A web thickness measuring equipment includes: a roller that is rotatable and configured to wind a web; a detection unit that detects a light amount on an outer circumferential surface of the roller or an external surface of the web wound on the roller, and detects a magnetic field of an internal surface of the web opposite to the external surface; and a processor unit configured to obtain a thickness of the web by generating profile data of the outer circumferential surface of the roller, generating displacement amount data of a target external surface of the web, generating displacement amount data of a target internal surface of the web, and comparing the displacement amount data of the target external surface of the web with the displacement amount data of the target internal surface of the web. 1. A web thickness measuring equipment comprising:a roller that is rotatable and configured to wind a web on the roller and move the web in a rotating direction of the roller;a detection unit that detects a light amount on an outer circumferential surface of the roller or an external surface of the web wound on the roller, and detects a magnetic field of an internal surface of the web opposite to the external surface; anda processor unit configured to obtain a thickness of the web by generating profile data of the outer circumferential surface of the roller using a light amount detection signal of the outer circumferential surface of the roller, generating displacement amount data of a target external surface of the web moving in real time using a light amount detection signal of the target external surface of the web, generating displacement amount data of a target internal surface of the web using a magnetic field detection signal of the target internal surface of the web, and comparing the displacement amount data of the target external surface of the web with the displacement amount data of ...

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Номер записи: 39
27-02-2014 дата публикации

Analysis apparatus for contactless analysis of the shape of a transparent body, and method for carrying out the contactless analysis

Номер: US20140055568A1
Автор: Carsten ETZOLD, Friedrich Neuhaeuser-Wespy
Принадлежит: HAMILTON BONADUZ AG

The invention relates to an analysis apparatus for the contactless analysis of the shape of a transparent body, in particular of a substantially spherical active substance bead, having at least one support for the body and at least one image recording apparatus, wherein the support has a test image, in particular a test grid, and at least one detection means is provided in order to detect, using the detection means, the three-dimensional shape and/or contour of the body and/or the test image which is modulated by the optical properties of the body, in particular the test grid. The invention also relates to a method for the contactless analysis of the shape of the transparent body.

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Номер записи: 40
06-03-2014 дата публикации

Apparatus and method for contactless thickness measurement

Номер: US20140061475A1
Автор: Han-Cheol Ryu, Hyunsung Ko, Jeong Woo Park, Kyung Hyun Park, Namje Kim, Sang-Pil Han
Принадлежит: Electronics and Telecommunications Research Institute ETRI

A contactless thickness measuring apparatus is provided which includes an terahertz transmitter configured to receive the first optical path signal from the coupler and to generate a terahertz continuous wave using the first optical signal and an applied bias; an optical delay line configured to delay the second optical path signal output from the coupler; and an terahertz receiver configured to receive the terahertz continuous wave penetrating a sample and to detect an optical current using the terahertz continuous wave and the second optical path signal delayed. A thickness of the sample is a value corresponding to the optical current which phase value becomes a constant regardless of a plurality of measurement frequencies.

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Номер записи: 41
20-03-2014 дата публикации

METHOD AND DEVICE FOR DETECTING DOUBLE PARTS

Номер: US20140078520A1
Автор: ARMINGEON Matthias, MANZ Joachim, WALCH Friedbert
Принадлежит: ROLAND ELECTRONIC GMBH

The invention relates to the positioning of an additional photo receiver in addition to the known laser sensors for detecting double parts during transport and during the loading of machines, which are situated opposite each other. The additional photo receiver receives the laser beam from a laser sensor located opposite, exactly when there is no material in the measuring gap and the two laser sensors are precisely aligned. This arrangement makes it possible to improve the measuring process and the analysis of the measurement, and thereby increases process reliability during the monitoring of transport and the loading of machines. 1. A method for detecting double parts during transport and during the loading of machines by means of two laser sensors situated opposite each other , each having a laser source and a detector , between which the parts pass , wherein the distances between the respective laser sensor and the surface of the part facing it are measured and the thickness of the part is ascertained from the difference between the distance of the laser sensors from each other and the sum of the distances measured by the two laser sensors , wherein the relevant laser beam is detected by means of a photo receiver situated opposite one of the two laser sources , and thus the detection process is monitored by the laser sensors.2. The method according to claim 1 , wherein it is determined by means of the photo receiver whether there is no part located between the laser sensors.3. The method according to claim 1 , wherein the alignment of the two laser sensors relative to each other is checked if there is no part between the laser sensors.4. The method according to any claim 1 , wherein a measurement of parts is only performed if the laser beam from the one laser source located opposite it is received by the photo receiver prior to the measurement of the distances by the laser sensors.5. The method according to claim 4 , wherein the measurement of the distances by ...

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Номер записи: 42
03-04-2014 дата публикации

METHOD AND DEVICE FOR MEASURING GAS COMPONENT CONCENTRATION INSIDE A GLASS UNIT

Номер: US20140092379A1
Автор: Launo Erno, Niiranen Kai
Принадлежит:

A non-invasive method for determining a concentration of a gas component in a gas mixture contained in a spacing of a glass unit having at least two glass sheets spaced apart from each other and forming the spacing. One or more light beams is applied at an angle to the surface of the glass unit, wherein the wavelength of the emitted light beam is varied around or over the at least one absorption line of the interest gas component. The light beams transmitted through or reflected from at least one surface or interface locating at the opposite side of the spacing are collected by a detector and non-linear variations in the intensity of the transmitted or reflected light beams over an absorption line of the interest gas is then component determined. The concentration of the gas component to be measured is determined based on the non-linear variations in the intensity. 1. A non-invasive method for determining a concentration of a gas component in a gas mixture contained in a spacing of a glass unit having at least two glass sheets spaced apart from each other and forming said spacing , the method comprising:applying one or more light beams at an angle to the surface of said glass unit, wherein the wavelength of the emitted light beam is varied around or over the at least one absorption line of the interest gas component,collecting by a detector the light beams transmitted through or reflected from at least one surface or interface locating at the opposite side of the spacing,determining non-linear variations in the intensity of the transmitted or reflected light beams over an absorption line of the interest gas component to be determined, anddetermining the concentration of the gas component based on said non-linear variations in the intensity.2. The method of claim 1 , wherein the concentration determination is implemented by comparing the quantity of the non-linear intensity variations to reference intensity variations claim 1 , such as the intensity variations of ...

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Номер записи: 43
05-01-2017 дата публикации

APPARATUS FOR REAL-TIME NON-CONTACT NON-DESTRUCTIVE THICKNESS MEASUREMENT USING TERAHERTZ WAVE

Номер: US20170003116A1
Автор: Yahng Ji Sang, Yee Dae-Su
Принадлежит:

Provided is an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, and more particularly, an apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave, which is capable of measuring a thickness of a sample by irradiating a terahertz continuous wave, which is generated from a wavelength-fixed laser and a wavelength-swept laser and of which the frequency is changed at a high speed, to the sample and measuring the terahertz wave transmitting or reflected from the sample. 1. An apparatus for real-time non-contact non-destructive thickness measurement using a terahertz wave , comprising:{'sub': '1', 'a wavelength-fixed laser generating first laser light having a first fixed wavelength λ;'}{'sub': '2', 'a wavelength-swept laser generating second laser light having a second wavelength λchanged from a preset minimum wavelength to a preset maximum wavelength at a high speed for one period;'}a driver applying a voltage modulated at the same frequency as a wavelength sweep rate to the wavelength-swept laser to change the second wavelength from the minimum wavelength to the maximum wavelength for the one period;a coupler coupling the first laser light with the second laser light to form mixed light and splitting the mixed light into first mixed light and second mixed light;{'sub': THz', '1', '2', '1', '1', '1', '2', '2', '2, 'an emitter receiving the first mixed light split from the coupler to output a terahertz wave having a frequency f=|f−f| corresponding to a difference between a frequency f=c/λ(c is the speed of light in vacuum) corresponding to the first wavelength λand a frequency f=c/λcorresponding to the second wavelength λ;'}a sample irradiated with the terahertz wave output from the emitter;a detector receiving the second mixed light split from the coupler and the terahertz wave transmitting or reflected from a sample to generate a photocurrent;a data acquisition unit converting the ...

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Номер записи: 44
05-01-2017 дата публикации

Optical sensor, and devices incorporating the same

Номер: US20170003266A1
Автор: Fumikazu Hoshi, Kazuma Goto, Yoshihiro Oba
Принадлежит: Individual

An optical sensor including an abutment part configured to abut one edge of an object to be measured, a wall extending along a side of the object to be measured and having a first opening to pass light emitted to the object to be measured, and a first concave portion formed between the first opening and the abutment part on a side of the wall to position the object to be measured. A paper-type discrimination device including the optical sensor, and a controller configured to discriminate a paper type of the object using the reflection light from the object measured by the optical sensor. An image forming apparatus including the optical sensor or the paper-type discrimination device.

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Номер записи: 45
07-01-2016 дата публикации

Signal Response Metrology Based On Measurements Of Proxy Structures

Номер: US20160003609A1
Автор: Dziura Thaddeus Gerard, Pandev Stilian Ivanov, Poslavsky Leonid, Shchegrov Andrei V.
Принадлежит:

Methods and systems for estimating values of parameters of interest of actual device structures based on optical measurements of nearby metrology targets are presented herein. High throughput, inline metrology techniques are employed to measure metrology targets located near actual device structures. Measurement data collected from the metrology targets is provided to a trained signal response metrology (SRM) model. The trained SRM model estimates the value of one or more parameters of interest of the actual device structure based on the measurements of the metrology target. The SRM model is trained to establish a functional relationship between actual device parameters measured by a reference metrology system and corresponding optical measurements of at least one nearby metrology target. In a further aspect, the trained SRM is employed to determine corrections of process parameters to bring measured device parameter values within specification. 1. A method comprising:receiving reference values of one or more parameters of interest of one or more actual device structures repeatedly fabricated over a range of values of one or more process variables, wherein the reference values are measured by a reference metrology system;receiving a first amount of measurement data associated with measurements of one or more metrology targets disposed nearby the one or more actual device structures, wherein the first amount of measurement data is derived from measurements performed by at least one optical metrology technique; andtraining a measurement model based on the first amount of measurement data and the reference values of the one or more parameters of interest.2. The method of claim 1 , wherein the training of the measurement model involves:determining a mapping between each of the one or more process variables and the reference values of the one or more parameters of interest of the one or more actual device structures.3. The method of claim 1 , wherein the training of the ...

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Номер записи: 46
04-01-2018 дата публикации

Test system and method for examining a hollow body

Номер: US20180003474A1
Автор: Florian Bader, Gerhard Aufschlager, Marc Kesting, Ralf Vollinger, Wolfgang Ullrich
Принадлежит: Sturm Maschinen und Anlagenbau GmbH

A test system for examining a hollow body, in particular a cylinder bore in an engine block, comprises a measuring apparatus comprising an elongate body and a plurality of sensors which are connected to the body and are set up to carry out a distance measurement. The test system also comprises electronic control means which are set up to move the measuring apparatus into a hollow body to be examined and to determine an internal diameter of the hollow body on the basis of distance measurement data from the sensors. In order to examine hollow bodies of different diameters, at least some of the sensors are in the form of movable sensors which can be moved relative to the elongate body of the measuring apparatus. The electronic control means are also set up to select a measuring position of the movable sensors relative to the elongate body on the basis of a hollow body to be examined. A calibration station is provided and the electronic control means are set up to carry out a calibration process for the movable sensors. A corresponding method is also disclosed.

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Номер записи: 47
13-01-2022 дата публикации

NANOPORE FABRICATION

Номер: US20220009034A1
Автор: GILBOA Tal, GIRSAULT Arik, Meller Amit, ZREHEN Adam, ZVULONI Eran
Принадлежит:

Systems comprising a light source, thin membrane immersed in an aqueous solution and a system to direct and focus light from the light source to a spot on the membrane are provided. Methods of thinning and etching a membrane are also provided, as are membranes comprising a nanopore with a Gaussian curve shaped cross-section. 1. A method of thinning a membrane comprising shining pulsed laser light on a spot on said membrane or wherein said membrane comprises a first layer comprising an index of refraction of greater than 2.0 and shining focused light on a spot on said first layer , thereby thinning said membrane.2. The method of claim 1 , wherein said focused light is laser light and said laser light is at a wavelength of between 300 and 600 nm.3. The method of claim 1 , wherein said lighta. is within the purple, blue or green spectrum;b. comprises an intensity of at least 100 μW;c. comprises an intensity of between 1 and 45 mW; ord. is continuous-wave laser light or pulsed laser light; ore. a combination thereof.4. The method of claim 1 , wherein said membrane comprises a first layer and wherein said first layera. comprising an index of refraction of greater than 2.20;{'sub': 'x', 'b. comprises silicon nitride (SiN);'}{'sub': 'x', 'c. comprises SiNcomprising an average silicon to nitrogen ratio of greater than 0.75; or'}d. a combination thereof.5. The method of claim 1 , wherein said membranea. is a freely standing membrane, covered by an aqueous solution on both sides;b. comprises a second layer refractory to thinning by said focused light when not layered on said first layer, wherein said second layer is a dielectric layer or a layer of metal oxide, and wherein said second layer is layered onto said first layer;c. comprises a second layer comprising metal oxide and wherein said metal oxide is titanium oxide (TiO2), aluminum oxide (AlO2) or hafnium oxide (HfO2);d. does not comprise a thickness of less than 20 nm;e. is immersed in ultrapure water or salt buffer ...

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Номер записи: 48
02-01-2020 дата публикации

SINGLE WAVELENGTH REFLECTION FOR LEADFRAME BRIGHTNESS MEASUREMENT

Номер: US20200003548A1
Автор: CHIU Tse-Tsun, CHOU Hung-Yu, LEE Fu-Kang, SU Liang-Kang, Wang Chien-Hao
Принадлежит:

A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source. 120-. (canceled)21. A method of manufacturing a packaged device , the method comprising:mounting a semiconductor chip on a leadframe responsive to a determination that a brightness ratio of a predetermined area on a surface of the leadframe is within a predetermined range;electrically connecting pads on the semiconductor chip with pads on the leadframe;applying a molding compound on the semiconductor chip and the leadframe and curing the molding compound; andsingulating each of a plurality of the leadframes of a leadframe sheet to manufacture a plurality of packaged devices.22. The method of manufacturing the packaged device according to claim 21 , further comprising:positioning the leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor;irradiating the predetermined area on the surface of the leadframe with the light having the single predetermined wavelength from the light source;receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, ...

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Номер записи: 49
04-01-2018 дата публикации

LIQUID SURFACE INSPECTION DEVICE, AUTOMATED ANALYSIS DEVICE, AND PROCESSING DEVICE

Номер: US20180003728A1
Автор: Abe Yuichi, SATOU Yoshimichi, SUZUKI Yoichiro
Принадлежит: HITACHI HIGH-TECHNOLOGIES CORPORATION

Provided are a liquid surface inspection device, an automated analysis device, and a liquid surface inspection method with which instances of contamination can be minimized and the accuracy of the manner in which the surface conditions, such as bubbles or the like, of a liquid substance are detected can be enhanced. The device has: a light illumination unit for illuminating a container holding a liquid substance, as well as the surface of the liquid substance, with light; an image capture unit for acquiring a video image having at least color information and brightness information of light from the container and the liquid substance which are illuminated by the light illumination unit; and a detection unit for using the color information and brightness information in the video image captured by the image capture unit to detect the condition of the liquid surface. 1. A liquid surface condition detector comprising:an irradiation unit for irradiating with light a container storing a liquid substance and a liquid surface of the liquid substance from above;an imaging unit for capturing, from above, an image of the liquid substance subjected to light irradiation by the irradiation unit;a first liquid surface detector for detecting a condition of the liquid surface of the liquid substance using color information contained in the image; anda second liquid surface detector for detecting a condition of the liquid surface of the liquid substance by calculating a brightness gradient in a direction along an inner wall surface configuration of the container from the image.2. The liquid surface condition detector according to claim 1 , further comprisinga mode selector for selecting, by use of the color information contained in the image, which of the first and second liquid surface detectors will be used.3. (canceled)4. The liquid surface condition detector according to claim 1 , wherein the first liquid surface detector detects bubbles on the surface on the basis of the number ...

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Номер записи: 50
07-01-2021 дата публикации

MEASUREMENT METHOD FOR RESIN STATE OF PREPREG SURFACE AND MEASUREMENT DEVICE THEREFOR

Номер: US20210003387A1
Автор: HOSOKAWA Naofumi, Saotome Tsuyoshi, TSUMURA Yusuke, Yamasaki Masaaki
Принадлежит:

To measure a thickness or a coverage of a resin present at a surface layer of a prepreg in a non-contact manner using a simple technique, a measurement method for a resin state which is a method for measuring a state of a resin present at a surface layer of a prepreg impregnated with the resin in an unidirectional reinforced fiber base material includes: irradiating the surface layer of the prepreg with light from an irradiation source; receiving reflected light from the surface layer of the prepreg by a sensor; and calculating at least one of a thickness or a coated state of the resin present at the surface layer of the prepreg from intensity of the reflected light. 114-. (canceled)15. A measurement method for a resin state , which is a method of measuring a state of a resin present at a surface layer of a prepreg impregnated with the resin in an unidirectional reinforced fiber base material , the method comprising:irradiating the surface layer of the prepreg with light from an irradiation source;receiving reflected light from the surface layer of the prepreg by a sensor; andcalculating at least one of a thickness or a coated state of the resin present at the surface layer of the prepreg from intensity of the reflected light.16. A measurement method for a resin state , which is a method of measuring a state of a resin present at a surface layer of a prepreg impregnated with the resin in an unidirectional reinforced fiber base material , the method comprising:irradiating the surface layer of the prepreg with light from an irradiation source;receiving reflected light from the surface layer of the prepreg by a sensor; andcalculating a thickness and a coated state of the resin present at the surface layer of the prepreg from intensity of the reflected light.17. The measurement method for a resin state according to claim 15 , wherein the irradiation source is arranged in a direction perpendicular to an orientation direction of continuous fibers constituting the ...

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Номер записи: 51
07-01-2021 дата публикации

HYBRID METROLOGY METHOD AND SYSTEM

Номер: US20210003508A1
Автор: Barak Gilad, HAINICK YANIR, OREN Yonatan
Принадлежит:

A method and system are presented for use in measuring characteristic(s) of patterned structures. The method utilizes processing of first and second measured data, wherein the first measured data is indicative of at least one Raman spectrum obtained from a patterned structure under measurements using at least one selected optical measurement scheme each with a predetermined configuration of illuminating and/or collected light conditions corresponding to the characteristic(s) to be measured, and the second measured data comprises at least one spectrum obtained from the patterned structure in Optical Critical Dimension (OCD) measurement session. The processing comprises applying model-based analysis to the at least one Raman spectrum and the at least one OCD spectrum, and determining the characteristic(s) of the patterned structure under measurements.

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Номер записи: 52
03-01-2019 дата публикации

HEIGHT MEASUREMENT APPARATUS

Номер: US20190003824A1
Автор: Li Jian, Li Zhibin, WANG Yingnan, ZHENG Yunjiao
Принадлежит:

A height measuring apparatus. The height measuring apparatus includes a frame; a driving mechanism including a driving body that is connected with and movable along the frame and a moving part that is vertically movable with respect to the driving body. The driving body includes an altitude detector configured to detect an altitude of the moving part; a force transfer rod connected with the moving part to form a lever structure; a touching head connected with a first end of the force transfer rod; a dynamometer connected with a second end of the force transfer rod; a controller configured to stop the moving part from moving in response to the value of the force detected by the dynamometer reaching a predetermined force value; and a location detector configured to detect a location of a foreign object and send the detected location of the foreign object to the controller. 1. A height measuring apparatus , comprising:a frame;a driving mechanism comprising a driving body that is connected with and movable along the frame and a moving part, wherein the moving part is vertically movable with respect to the driving body, and wherein the driving body comprises an altitude detector configured to detect an altitude of the moving part;a force transfer rod connected with the moving part to form a lever structure;a touching head connected with a first end of the force transfer rod;a dynamometer connected with a second end of the force transfer rod;a controller configured to stop the moving part from moving in response to the value of the force detected by the dynamometer reaching a predetermined force value; anda location detector configured to detect a location of a foreign object and send the detected location of the foreign object to the controller.2. The height measuring apparatus according to claim 1 , wherein the force transfer rod comprises a first rod body and a second rod body claim 1 , and wherein a length of the first rod body is greater than a length of the second ...

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Номер записи: 53
13-01-2022 дата публикации

Paint and other materials including a taggant

Номер: US20220010145A1
Автор: Henry Guy Stevens
Принадлежит: Individual

There is provided a paint including a pigment, a carrier liquid, a binder, one or more additives, and a taggant corresponding to the one or more additives. The taggant is provided in an amount up to substantially 0.1% by weight of the paint. The taggant is excitable by infra-red or UV light at one wavelength to emit light at one or more other wavelengths, the emission wavelength or spectrum of the taggant being indicative of the additive(s) in the paint. A method of authenticating the paint on a substrate is also provided.

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Номер записи: 54
07-01-2021 дата публикации

Metrology System and Method For Determining a Characteristic of one or More Structures on a Substrate

Номер: US20210003924A1
Автор: COENE Willem Marie Julia Marcel, Den Boef Arie Jeffrey, KOOLEN Armand Eugene Albert, PANDEY Nitesh, TENNER Vasco Tomas, TINNEMANS Patricius Aloysius Jacobus, WARNAAR Patrick
Принадлежит: ASML Netherlands B.V.

Described is a metrology system for determining a characteristic of interest relating to at least one structure on a substrate, and associated method. The metrology system comprises a processor being configured to computationally determine phase and amplitude information from a detected characteristic of scattered radiation having been reflected or scattered by the at least one structure as a result of illumination of said at least one structure with illumination radiation in a measurement acquisition, and use the determined phase and amplitude to determine the characteristic of interest. 1. A metrology apparatus for determining a characteristic of interest relating to at least one structure on a substrate , the metrology apparatus comprising:an illumination branch configured to direct illumination radiation at the substrate;a detection branch configured to detect scattered radiation from the at least one structure on the substrate; and computationally determine phase and amplitude information from an electric field of the scattered radiation in a measurement acquisition, and', 'computationally re-image the measurement acquisition of the at least one structure subsequent to a measurement to obtain at least one computationally re-imaged image., 'a processor configured to2. The metrology apparatus of claim 1 , wherein the processor is further configured to use prior knowledge of the at least one structure to optimize the phase and amplitude of the electric field.3. The metrology apparatus of claim 2 , wherein the processor is further configured to use at least a part of the prior knowledge of the at least one structure as a regularization to or a constraint on the optimization of the phase and amplitude of the electric field.4. The metrology apparatus of claim 1 , wherein the processor is further configured to use the determined phase and amplitude to determine a characteristic of interest.5. The metrology apparatus of claim 1 , wherein computationally re-imaging the ...

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Номер записи: 55
04-01-2018 дата публикации

CHEMICAL MECHANICAL POLISHING AUTOMATED RECIPE GENERATION

Номер: US20180005842A1
Автор: CHUI David, DATAR Shuchivrat, Garretson Charles C., Heung King Yi, Lau Eric, Osterheld Thomas H., Qian Jun
Принадлежит:

A method for polishing dies locations on a substrate with a polishing module. A thickness at selected locations on the substrate is premeasured at a metrology station, each location corresponding to a location of a single die. The thickness obtained by the metrology station for the selected locations of the substrate is provided to a controller of a polishing module. The thickness corrections for each selected location on the substrate are determined. A polishing step in a polishing recipe is formed from the thickness correction for each selected location. A polishing parameter for each die location is calculated for the recipe. 1. A method of polishing a substrate , comprising:premeasuring thickness at selected locations on the substrate at a metrology station, each location corresponding to a location of a single die;providing the thicknesses obtained using the metrology station for the selected locations of the substrate to a controller of a polishing module;determining thickness corrections for each selected location on the substrate;forming a step in a polishing recipe from the thickness corrections for each selected location; andcalculating a polishing parameter for each selected location.2. The method of claim 1 , further comprising:polishing each die location with a respective step in the polishing recipe associated with that die location.3. The method of claim 2 , further comprising:polishing a second die location on the substrate with a second step.4. The method of claim 1 , wherein the calculating the polishing time comprises:comparing the die corrections to a removal rate curve to determine the polishing parameter inclusive of one or more of polishing time, polishing pressure, and oscillation speed.5. The method of further comprising:measuring the substrate at a metrology station post polishing; andadjusting the removal rate curve to reflect the post polishing measurement and the polishing time used to polish the die location.6. The method of claim 4 , ...

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Номер записи: 56
02-01-2020 дата публикации

AN APPARATUS AND METHOD FOR ELECTRICAL TEST PREDICTION

Номер: US20200006165A1
Автор: TUROVETS Igor
Принадлежит:

A test site and method are herein disclosed for predicting E-test structure (in-die structure) and/or device performance. The test site comprises an E-test structure and OCD-compatible multiple structures in the vicinity of the E-test structure to allow optical scatterometry (OCD) measurements. The OCD-compatible multiple structures are modified by at least one modification technique selected from (a) multiplication type modification technique, (b) dummification type modification technique, (c) special Target design type modification technique, and (d) at least one combination of (a), (b) and (c) for having a performance equivalent to the performance of the E-test structure. 1. A method for predicting E-test structure (in-die structure) and/or device performance comprising:providing an E-test structure and OCD-compatible multiple structures in the vicinity of said E-test structure to allow optical scatterometry (OCD) measurements;(ii) conducting optical scatterometric (OCD) measurements on said multiple structures;(iii) conducting electrical measurements on said E-test structure;(iv) establishing correlations between an OCD measurement data obtainable via said OCD measurements on said multiple structures and electrical parameters obtainable via said electrical measurements on said E-test structure; and(v) using said correlations for predicting the performance of said E-test structure.2. The method of comprising modifying said OCD-compatible multiple structures by applying at least one modification technique selected from:(a) multiplication type modification technique;(b) dummification type modification technique;(c) special Target design type modification technique; and(d) at least one combination of (a), (b) and (c).3. The method of claim 2 , wherein modifying said OCD-compatible multiple structures by said multiplication type modification technique comprising creating multiple structures identical to and in the vicinity of said E-test structure.4. The method of ...

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Номер записи: 57
08-01-2015 дата публикации

Measurement apparatus and method, tomography apparatus and method

Номер: US20150008324A1
Автор: Takeaki Itsuji
Принадлежит: Canon Inc

An apparatus configured to obtain a physical property of an object by time-domain spectroscopy includes: a detection unit; a delay unit configured to adjust a time difference between generation and detection; a shaping unit configured to collect the electromagnetic wave pulses; a waveform obtaining unit configured to construct a time waveform of the electromagnetic wave pulses; and a collecting position adjusting unit configured to adjust a collecting position. When the collecting position is moved, an amount of adjustment when the collecting position matches first and second reflection portions, respectively, of the object, and a difference by the delay unit required for detecting first and second pulses of the time waveform are obtained, and from an amount of change of the amount of adjustment and the difference, a thickness and a refractive index of a region between the first and second reflection portions of the object are calculated.

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Номер записи: 58
08-01-2015 дата публикации

MEASUREMENT OF OBJECT TO BE MEASURED

Номер: US20150008346A1
Автор: Graeffe Jussi, Keränen Heimo, Kurki Lauri, MÄNTYLÄ Markku, Niemelä Karri, Suopajärvi Pekka
Принадлежит:

A measuring device includes a first optical sensor row and a second optical sensor row between which a planar object to be measured is placed. The direction of the first sensor row and the direction of the second sensor row differ from one another. Each sensor of the first sensor row forms data representing a distance between the object to be measured and the sensor. Each sensor of the second sensor row forms data representing a distance between the object to be measured and the sensor in order to determine at least one property of the object to be measured on the basis of the data. 1. A measuring device for measuring at least one property of an object to be measured , whereinthe measuring device comprises a first optical sensor row and a second optical sensor row between which a planar object to be measured is arranged to be placed;the direction of the first sensor row and the direction of the second sensor row differ from one another for measuring the object two-dimensionally;each sensor of the first sensor row is arranged to form data representing a distance between the object to be measured and the sensor; andeach sensor of the second sensor row is arranged to form data representing a distance between the object to be measured and the sensor in order to determine at least one property of the object to be measured on the basis of said data.2. A measuring device as claimed in claim 1 , wherein each sensor of the first sensor row is arranged to form the data representing the distance between the object to be measured and the sensor from a surface of a first side of the planar object to be measured;each sensor of the second sensor row is arranged to form the data representing the distance between the object to be measured and the sensor from a surface of an opposite side of the planar object to be measured in order to determine an inclination angle of the surface of the first side of the object to be measured in the direction of one dimension and in order to ...

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Номер записи: 59
20-01-2022 дата публикации

LAMINATED COATING LAYER, METHOD FOR MANUFACTURING SAME, AND METHOD FOR DETERMINING LAMINATED STRUCTURE

Номер: US20220018020A1
Автор: HIROSE Fumihiko, KANOMATA Kensaku, KUBOTA Shigeru, MIURA Masanori, YOSHIDA Kazuki
Принадлежит:

The disclosed laminated coating layer includes a metal oxide film formed on a processing target through low-temperature atomic layer deposition. The coating layer includes at least one set of at least two layers of an adhesion layer, a moisture-proof layer, and a waterproof layer, stacked from the surface of the processing target in this order. The adhesion layer is formed of at least one film selected from a metal oxide film and a resin film; the moisture-proof layer is a film containing alumina as a predominant ingredient; and the waterproof layer is formed of at least one film of a resin film and a metal oxide film which is selected from among a silica film, a niobium oxide film, and a zirconium oxide film. 1. A laminated coating layer , which is a coating layer including a metal oxide film formed on a processing target through low-temperature atomic layer deposition , wherein the coating layer comprises at least one set of at least two layers of an adhesion layer , a moisture-proof layer , and a waterproof layer , stacked from the surface of the processing target in this order;the adhesion layer is formed of at least one film selected from a metal oxide film and a resin film;the moisture-proof layer is a film containing alumina as a predominant ingredient; andthe waterproof layer is formed of at least one film of a resin film and a metal oxide film which is selected from among a silica film, a niobium oxide film, and a zirconium oxide film.2. The laminated coating layer according to claim 1 , wherein the surface of the processing target is a hydrophilic surface claim 1 , and the adhesion layer is formed of a silica film.3. The laminated coating layer according to claim 1 , wherein the surface of the processing target is a non-flat surface claim 1 , and the adhesion layer is formed of the resin film.4. The laminated coating layer according to claim 1 , wherein the moisture-proof layer is a single layer of an alumina film having a thickness of 50 nm or less claim ...

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Номер записи: 60
12-01-2017 дата публикации

AUTOMATED APPARATUS TO IMPROVE IMAGE QUALITY IN X-RAY AND ASSOCIATED METHOD OF USE

Номер: US20170007196A1
Автор: Clayton William, Don Steven, MacDougall Robert
Принадлежит:

A system or method for improving quality in projection and tomographic x-ray, which includes a depth sensing device to measure a depth of at least one body part of a patient from the depth sensing device and a control unit to calculate a thickness and/or circumference of the body part using the depth information. The calculated thickness and circumference information is used to determine an optimal level of x-ray exposure for the body part. The system or method also includes a camera to identify the body part that needs to be examined and to detect any motion of the identified body part. 1. A system for improving quality in projection and tomographic x-ray imaging comprising:an x-ray tube emitting x-rays;a depth sensing device measuring a depth of at least one body part of a patient, wherein the depth represents a distance between said depth sensing device and the body part; anda control unit comprising a memory, wherein said memory stores depth reference data that represents the distance between said depth sensing device and the body part, wherein said depth reference data is used to calculate one of a thickness of the body part and a circumference of the body part, wherein the calculated thickness or circumference is used to determine an optimal level of x-ray exposure for the body part.2. The system for improving quality in projection and tomographic x-ray according to claim 1 , wherein the circumference of the body part is used to determine an optimal level of x-ray exposure for the body part when using a CT scanner.3. The system for improving quality in projection and tomographic x-ray according to claim 1 , wherein the optimal level of x-ray exposure for the body part is used for determining a patient geometry when using a fluoroscopy claim 1 , wherein the patient geometry is further used for determining at least one of a patient entrance exposure and a peak skin dose.4. The system for improving quality in projection and tomographic x-ray imaging according to ...

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Номер записи: 61
20-01-2022 дата публикации

MEASUREMENT OF THICKNESS OF THERMAL BARRIER COATINGS USING 3D IMAGING AND SURFACE SUBTRACTION METHODS FOR OBJECTS WITH COMPLEX GEOMETRIES

Номер: US20220018651A1
Автор: BRITZ David Alexander, Raghavan Kamala Chakravarthy
Принадлежит:

Embodiments described herein relate to a non-destructive measurement device measurement device and a non-destructive measurement method for determining coating thickness of a three-dimensional (3D) object. In one embodiment, at least one first 3D image of an uncoated surface of the object and at least one second 3D image of a coated surface of the object are collected and analyzed to the determine the coating thickness of the object. 1. A method of determining a thickness of an object coating , comprising:positioning a surface of an object in a field view of the at least one image sensor system in a non-destructive measurement device, the object having one or more surfaces;reading a Quick Response (QR) code corresponding to at least one part coordinate or an alignment position of the surface in the non-destructive measurement device, the QR code disposed on the object:collecting a 3D image of the surface without chemically or physically changing the one or more surfaces of the object corresponding to the at least one part coordinate or the aligned surface of the object at the alignment position; andanalyzing the 3D.2. The method of claim 1 , wherein the surface includes an uncoated portion and a coated portion claim 1 , and the 3D image corresponds to a first surface profile of the uncoated portion and a second surface profile of the coated portion claim 1 , the analyzing the second 3D image and the first 3D image comprises:removing outliers of the first surface profile and the second surface profile;filtering the first surface profile and the second surface profile;overlapping the first surface profile and the second surface profile; andsubtracting the second surface profile from the first surface profile to obtain a thickness of a coating of the object.3. The method of claim 2 , wherein the analyzing the first 3D image and the second 3D image further comprises:mirroring the first 3D image and the second 3D image; andselecting a first area of the first 3D image and ...

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Номер записи: 62
08-01-2015 дата публикации

INTERFEROMETRIC MATERIAL SENSING APPARATUS INCLUDING ADJUSTABLE COUPLING AND ASSOCIATED METHODS

Номер: US20150009506A1
Автор: Carmean Randy L., IV Charles Franklin, Middleton, Montgomery Robert M., Tonti James G.
Принадлежит:

A material sensing apparatus comprises an excitation source configured to induce waves in a workpiece, and an optical waveguide interferometer configured to sense the induced waves in the workpiece. The optical waveguide interferometer comprises a probe segment having a probe segment end, and an adjustable coupler configured to permit setting a gap between the probe segment end and the workpiece. A controller is coupled to the adjustable coupler and configured to set the gap between the probe segment end and the workpiece. 122-. (canceled)23. A material sensing apparatus comprising:an excitation source configured to induce waves in a workpiece; and a laser source,', 'a probe segment having a probe segment end to be positioned adjacent the workpiece and defining a gap therebetween,', 'a photodetector,', 'an optical coupler operatively connecting said laser source, said photodetector, and said probe segment, and', adjust the wavelength of said laser source so that a desired multiple of the wavelength equals the gap between the probe segment end and the workpiece, and', 'generate workpiece data based upon the sensed induced waves., 'a controller coupled to said laser source and said photodetector, and configured to'}], 'an optical waveguide interferometer configured to sense the induced waves in the workpiece and comprising'}24. The material sensing apparatus of claim 23 , wherein said controller generates the workpiece data to represent at least one of a density claim 23 , a thickness claim 23 , and a composition of the workpiece.25. The material sensing apparatus of claim 23 , wherein said probe end comprises an optical fiber with an angled endface.26. The material sensing apparatus of claim 23 , wherein said excitation source comprises at least one pulsed laser.27. A material sensing apparatus comprising:an excitation source configured to induce waves in a workpiece; and a laser source,', 'a probe segment having a probe segment end comprising an optical fiber with ...

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Номер записи: 63
08-01-2015 дата публикации

TRANSPARENT SUBSTRATE MONITORING APPARATUS AND TRANSPARENT SUBSTRATE METHOD

Номер: US20150009509A1
Автор: EOM Tae-Bong, JIN Jong-Han, KANG Chu-Shik, KIM Jae-Wan, KIM Jong-Ahn
Принадлежит:

Provided are a transparent substrate monitoring apparatus and a transparent substrate monitoring method. The transparent substrate monitoring apparatus includes a light emitting unit emitting light; a double slit disposed on a plane defined in a first direction and a second direction intersecting a propagation direction of incident light and includes a first slit and a second slit spaced apart from each other in the first direction to allow the light to pass therethrough; an optical detection unit measuring an intensity profile or position of an interference pattern formed on a screen plane; and a signal processing unit receiving a signal from the optical detection unit to calculate an optical phase difference or an optical path difference. 1. A transparent substrate monitoring apparatus comprising:a light emitting unit emitting light;a double slit disposed on a plane defined in a first direction and a second direction intersecting a propagation direction of incident light and includes a first slit and a second slit spaced apart from each other in the first direction to allow the light to pass therethrough;an optical detection unit measuring an intensity profile or position of an interference pattern formed on a screen plane by first light transmitting a first position of a transparent substrate disposed between the light emitting unit and the double slit and passing through the first slit and second light transmitting a second position of the transparent substrate and passing through the second slit; anda signal processing unit receiving a signal from the optical detection unit to calculate an optical phase difference or an optical path difference caused by the first position and the second position of the transparent substrate.2. The transparent substrate monitoring apparatus of claim 1 , wherein the signal processing unit calculates the optical path difference using a moving position of the interference pattern in the first direction.3. The transparent substrate ...

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Номер записи: 64
12-01-2017 дата публикации

High throughput triangulation system

Номер: US20170010093A1
Автор: Gilad Tomer, KOREN SHIMON
Принадлежит:

A system for measuring heights of multiple structures of an object, the system may include an illumination module that is configured to illuminate the object by a light strip that is spatially incoherent; multiple cameras; a collection module that is configured to collect light that is reflected from the object and to distribute the light to the multiple cameras; wherein the collection module has an elongated field of view that has a longitudinal axis that is parallel to the light strip; wherein the multiple cameras are configured to generate, during a height measurement process, detection signals indicative of heights of the multiple structures; a mechanical stage for introducing a movement, during the height measurement process, between the object and each one of the illumination module and the collection module; and a processor that is configured to process the detection signals to determine the heights of the multiple structures. 1. A system for measuring heights of multiple structures of an object , said system comprising:an illumination module that is configured to illuminate the object by a light strip that is spatially incoherent;multiple cameras; wherein the collection module has an elongated field of view that has a longitudinal axis that is parallel to the light strip;', 'wherein the multiple cameras are configured to generate, during a height measurement process, detection signals indicative of heights of the multiple structures;, 'a collection module that is configured to collect light that is reflected from the object and to distribute the light to the multiple cameras;'}a mechanical stage for introducing a movement, during the height measurement process, between the object and each one of the illumination module and the collection module; anda processor that is configured to process the detection signals to determine the heights of the multiple structures.2. The system according to wherein during the height measurement process claim 1 , fields of view ...

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Номер записи: 65
14-01-2016 дата публикации

Method for the measurement of an object

Номер: US20160010976A1
Автор: Achim Nübling, Carsten Ehrler, Thorsten Harter
Принадлежит: SICK AG

A method for the measurement of an object by means of a laser scanner is described, wherein the laser scanner detects at least a first type of measurement values and a second type of measurement values. In this respect, a resultant value is calculated in that measurement values of the first type are weighted by measurement values of the second type.

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Номер записи: 66
08-01-2015 дата публикации

Thickness measuring apparatus and thickness measuring method

Номер: US20150012246A1
Автор: Chu-Shik Kang, Jae-Wan Kim, Jong-ahn Kim, Jong-Han Jin
Принадлежит: Korea Research Institute of Standards and Science KRISS

Provided are a thickness measuring apparatus and a thickness measuring method. The thickness measuring method includes irradiating first laser beam of a first wavelength λ 1 to a transparent substrate and measuring intensity of first laser beam transmitting the transparent substrate; irradiating second laser beam of a second wavelength λ 2 to the transparent substrate and measuring intensity of second laser beam transmitting the transparent substrate; and extracting a rotation angle on a Lissajous graph using the first and second laser beams transmitting the transparent substrate. A phase difference between adjacent rays by multiple internal reflection of the first laser beam and a phase difference between adjacent ray by multiple internal reflection of the second laser beam is maintained at π/ 2.

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Номер записи: 67
11-01-2018 дата публикации

MEASUREMENT APPARATUS

Номер: US20180010904A1
Автор: Hotta Hiroyuki
Принадлежит: FUJI XEROX CO., LTD.

A measurement apparatus includes: 1. A measurement apparatus comprising:a light emitting unit that projects irradiation light to an object;a first lens that changes a divergence degree of the irradiation light emitted from the light emitting unit;an aperture stop unit that stops down the irradiation light projected from the first lens;a second lens that condenses the irradiation light passing through the aperture stop unit and projects the irradiation light to the object in a first direction;a transmission unit that is provided in a focal plane of the second lens and transmits therethrough a part of reflected light, which is generated as the irradiation light is projected to the object, reflected by the object, and transmitted through the second lens;a first light receiving unit that includes a light receiving surface that receives the part of the reflected light transmitted through the transmission unit; anda measurement unit that measures a height of a surface of the object by using a position of the part of the reflected light on the light receiving surface.2. The measurement apparatus according to claim 1 , whereinthe aperture stop unit is formed with a first opening that is provided in the focal plane of the second lens to stop down the irradiation light, andthe transmission unit is a second opening that is provided at a part of the aperture stop unit.3. The measurement apparatus according to claim 1 , whereinthe light emitting unit includes a plurality of light emitting elements arranged in a second direction intersecting the first direction, and projects a plurality of the irradiation lights to different positions on the object by causing the plurality of light emitting elements to sequentially emit light, and', 'measures a height distribution of the surface of the object in the second direction by using positions, on the light receiving surface, of a plurality of the reflected lights which are generated as the plurality of the irradiation lights are ...

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Номер записи: 68
11-01-2018 дата публикации

METHOD AND COATING SYSTEM FOR COATING CAVITY WALLS

Номер: US20180010905A1
Автор: BERNWINKLER Fabian, KESTING Marc, Schütz Wolfgang, VÖLLINGER Ralf, WIMMER Patrick
Принадлежит: STURM MASCHINEN- & ANLAGENBAU GMBH

The invention relates to a method for coating cavity walls, in particular cylinder bores of engine blocks, In the method, a coating is applied to a cavity wall using a coating lance. In addition, a cavity diameter is measured using a measuring apparatus. According to the invention, the method is characterized in that at least a plurality of diameter values of a first cavity are measured at different heights of the first cavity using the measuring apparatus, and in that a coating of variable thickness is applied to a wall of the first or a second cavity using the coaling lance, the thickness of said coating of variable thickness being dependent on the determined diameter values. The invention additionally describes a corresponding coating system. 2. Method according to claim 1 ,characterized in that{'b': 1', '2', '1', '5, 'the several diameter values (D, D) are measured on the first cavity () before a coating () is applied thereto, and'}{'b': 5', '1, 'in that the variable-thickness coating () is applied to the same first cavity ().'}3. Method according to or claim 1 ,characterized in that{'b': 3', '4', '1', '5', '2, 'the several diameter values (D, D) are measured on the first cavity () after a coating () has been applied to its wall () and'}{'b': 5', '2', '1, 'in that the variable-thickness coating (A) is applied to a wall (A) of the second cavity (A).'}4. Method according to any one of to claim 1 ,characterized in that{'b': 6', '5, 'a thickness () of the variable-thickness coating () is chosen the thicker at a particular height the larger the measured diameter value for this height is.'}5. Method according to any one of to claim 1 ,characterized in that{'b': 5', '6', '1', '2', '3', '4, 'the variable-thickness coating () is applied such that its variable thickness () compensates at least partially for differences of the diameter values (D, D; D, D) at different heights.'}6. Method according to any one of to claim 1 ,characterized in that{'b': 5', '2', '1, 'the ...

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Номер записи: 69
11-01-2018 дата публикации

Optical measurement apparatus

Номер: US20180010962A1
Автор: Tomonori Kondo, Yoshihiro Kanetani, Yuta Suzuki
Принадлежит: Omron Corp

The optical measurement apparatus includes an interface unit and a measuring unit. The interface unit is configured to receive a synchronization signal transmitted from a PLC to a fieldbus at a constant communication cycle, and output, in synchronization with the synchronization signal, a result of measurement (a measured value) by the optical measurement apparatus and a synchronization supervisory signal. The measuring unit is configured to execute optical measurement at a measurement cycle irrelevant to the communication cycle and generate a result of the measurement and a synchronization supervisory signal. The measuring unit sets the synchronization supervisory signal into an ON state in synchronization with receipt of the synchronization signal by the interface unit after start of the measurement, and sets the synchronization supervisory signal into an OFF state in synchronization with receipt of the synchronization signal by the interface unit when the interface unit outputs the measurement result.

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Номер записи: 70
09-01-2020 дата публикации

MEASURING DEVICE, WEB PROCESSING DEVICE, FIBER FEEDSTOCK RECYCLING DEVICE, AND MEASURING METHOD

Номер: US20200011010A1
Автор: KOBAYASHI Nao
Принадлежит:

The thickness of accumulated fiber can be appropriately measured when accumulating and processing fiber. A measuring device includes a distributor that disperses material containing fiber; a mesh belt that accumulates material dispersed by the distributor a roller unit that compresses a second web W accumulated on the mesh belt and a measurement device that measures the thickness of the second web W after compression by the roller unit 1. A measuring device comprising:a distributor configured to disperse material containing fiber;an accumulator configured to accumulate the material dispersed by the distributor;a compression device configured to compress accumulated material accumulated on the accumulator; anda measurement device configured to measure a thickness of the accumulated material compressed by the compression device.2. The measuring device described in claim 1 , wherein:the measurement device measures a thickness of the accumulated material after the accumulated material is compressed by the compression device.3. The measuring device described in claim 2 , wherein:the compression device includes a pressure roller that contacts the accumulated material and applies pressure to the accumulated material, and a displacement member enabling the pressure roller to move according to the thickness of the accumulated material; andthe measurement device measures displacement of the pressure roller.4. The measuring device described in claim 3 , wherein:the distributor has a case, and a configuration that disperses the material inside the case; andthe pressure roller is disposed to a discharge exit through which the accumulated material is conveyed out from the case.5. The measuring device described in claim 2 , wherein:the compression device has a suction device configured to suction air through the accumulated material; andthe measurement device measures a thickness of the accumulated material suctioned and compressed by the suction device.6. The measuring device ...

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Номер записи: 71
10-01-2019 дата публикации

OBJECT POSITION INDEPENDENT METHOD TO MEASURE THE THICKNESS OF COATINGS DEPOSITED ON CURVED OBJECTS MOVING AT HIGH RATES

Номер: US20190011251A1
Автор: KOROTKOV Roman Y., MOELLER Gunter E., Smith Ryan C.
Принадлежит:

Methods and apparatus for measuring a thickness of a coating on an moving object are provided. Light is directed toward the object at a predetermined location on the object such that a portion of the light interacts with the object. A I D and/or 2D maximum intensities for at least one wavelength channel is captured that is produced by the portion of the light interacting with the object. A measured average intensity of the wavelength channel and/or intensities and their arithmetic derivatives of multi wavelength channel geometries is converted into I D (averaged) and/or 2D thickness values. Based on these values an acceptability of the coating is evaluated and thickness calculated. 1. An apparatus for measuring distance to object independent thickness of a coating on an object , the apparatus comprising:at least one light source configured to direct light toward the object at a predetermined location on the object, a portion of the light interacting with the object;a wavelength detector configured to capture an intensity signal comprising at least one channel produced by the portion of the light interacting with the object; and determine intensities of light of the at least one channel based on an average maximum peak intensity captured by each channel of the at least one channel; and', 'determine at least one of the thickness or an acceptability of the coating on the object based on the determined intensities., 'a measurement device coupled to the wavelength detector configured to2. An apparatus for measuring thickness of a coating on an object comprising:at least one light source directed at an object;a multi-wavelength detector comprising of at least 2 wavelength channels configured to receive a portion of the light reflected by or transmitted through a surface of the object; anda measurement device coupled to the wavelength detector, the measurement device configured to determine the thickness of the coating based on arithmetic manipulations of the maximum ...

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Номер записи: 72
10-01-2019 дата публикации

OPTICAL METHOD TO MEASURE THE THICKNESS OF COATINGS DEPOSITED ON SUBSTRATES

Номер: US20190011252A1
Автор: MOELLER Gunter E.
Принадлежит:

Methods and apparatus for measuring a thickness of a coating on an object are provided. Light is directed toward the object at a predetermined location on the object such that a portion of the light interacts with the object. An image having at least two wavelength channels (e.g., color channels) is captured that is produced by the portion of the light interacting with the object. A relative shift is determined between each of the at least two wavelength channels, based on a histogram of each wavelength channel of the at least two wavelength channels. At least one of the thickness or an acceptability of the coating on the object is determined based on the determined relative shift. 1. An apparatus for measuring a thickness of a coating on an object , the apparatus comprising:at least one light source configured to direct light toward the object at a predetermined location on the object, a portion of the light interacting with the object; a detector configured to capture an image comprising at least two wavelength channels produced by the portion of the light interacting with the object; and a measurement device coupled to the detector configured to:determine a relative shift between each of the at least two wavelength channels based on a histogram of each wavelength channel of the at least two wavelength channels, and determine at least one of the thickness or an acceptability of the coating on the object based on the determined relative shift.2. The apparatus of claim 1 , wherein each of the at least two wavelength channels is a color channel and the relative shift is a relative color shift.3. The apparatus of claim 1 , further comprising a display configured to display at least one of the determined thickness claim 1 , an indication that the determined thickness is acceptable claim 1 , or an indication the determined thickness is not acceptable.4. The apparatus of claim 1 , wherein the measurement device is configured to:compare a characteristic of each histogram ...

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Номер записи: 73
14-01-2021 дата публикации

Calibration for laser inspection

Номер: US20210010804A1
Автор: Gordon A. Perrett
Принадлежит: Raytheon Technologies Corp

A method of calibrating a laser measurement device includes positioning a calibration part, having known geometric specifications, at varying distances from the laser measurement device (within a measurement depth-of-field of the laser measurement device). The detected geometric specifications, measured at these different positions, are compared with the known specification(s) of the calibration part in order to improve the accuracy of the calibration. A calibration standoff fixture having a plurality of adjustable legs may be used in conjunction with the method to facilitate changing the position of the calibration part relative to the laser measurement device.

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Номер записи: 74
09-01-2020 дата публикации

Dual-Interferometry Wafer Thickness Gauge

Номер: US20200011654A1
Автор: SAFRANI Avner
Принадлежит:

A thickness measurement system may include an illumination source, a beam splitter to split illumination from the illumination source into two beams, a translation stage configured to translate a reference sample along a measurement direction, a first interferometer to generate a first interferogram between a first surface of a test sample and a first surface of the reference sample, and a second interferometer to generate a second interferogram between a second surface of the test sample and a second surface of the reference sample. A thickness measurement system may further include a controller to receive interference signals from the first and second interferometers as the translation stage scans the reference sample, and determine a thickness of the test sample based on the thickness of the reference sample and a distance travelled by the translation stage between peaks of envelopes of the interference signals. 1. A system comprising: receive a first interference signal from the first interferometer, wherein the first interferometer generates a first interferogram between a first surface of a test sample and a first surface of a reference sample having a known thickness with a first illumination beam as at least one of the test sample or the reference sample is scanned along a measurement direction, the first illumination beam including a first portion of an illumination beam from a beamsplitter;', 'receive a second interference signal from the second interferometer, wherein the second interferometer generates a second interferogram between a second surface of the test sample and a second surface of the reference sample with a second illumination beam, the second illumination beam including a second portion of the illumination beam from the beamsplitter; and', 'determine a thickness of the test sample along the measurement direction based on the thickness of the reference sample and a distance travelled by the translation stage between peaks of envelopes of the ...

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Номер записи: 75
09-01-2020 дата публикации

LIVE CELL IMAGING SYSTEMS AND METHODS TO VALIDATE TRIGGERING OF IMMUNE RESPONSE

Номер: US20200011868A1
Автор: NIAZI Kayvan, RABIZADEH Shahrooz, Witchey Nicholas J.
Принадлежит:

Systems and methods for predicting an immune response against a tumor in a patient having the tumor are provided. The relative mass or changes of mass of tumor cells or immune cell in the tumor can be ex vivo observed, and an immune status of the tumor can be determined based on the mass of tumor cells or immune cell. The immune status can provide a guidance to predict the immune response against the tumor in the patient. 1. A method of predicting an immune response against a tumor in a patient having the tumor , comprising:obtaining, prior to an immunotherapeutic treatment, a tumor sample from a patient;determining, within the tumor sample, at least one of a mass of a tumor cell and a mass of an immune competent cell using live cell interferometry;using the at least one of the mass of the tumor cell and the mass of the immune competent cell to determine an immune status of the tumor sample; andusing the immune status to predict the immune response against the tumor in the patient.2. The method of claim 1 , further comprising a step of identifying a type of the immune competent cell.3. The method of claim 1 , wherein the determining the at least one of the mass of the tumor cell and the mass of the immune competent cell comprises measuring changes over a period of time in the at least one of the mass of the tumor cell and the mass of the immune competent cell.4. The method of claim 1 , wherein the mass of the tumor cell is compared with an average mass of other tumor cells in the tumor sample.5. The method of claim 1 , wherein the mass of the immune competent cell is compared with an average mass of immune competent cells in the tumor sample.6. The method of claim 1 , wherein the tumor cell is located proximal to the immune competent cell.7. The method of claim 1 , further comprising contacting the tumor sample with an immune stimulatory cytokine claim 1 , a checkpoint inhibitor claim 1 , or an immunotherapeutic agent.8. (canceled)9. (canceled)10. The method of ...

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Номер записи: 76
14-01-2021 дата публикации

Method of inspecting a semiconductor processing chamber using a vision sensor, and method for manufaturing a semiconductor device using the same

Номер: US20210013074A1
Автор: Byeongsang KIM, Keonho Lee, Kyungwon Yun, Namyoung Cho, Sangil Im, Sung Chai KIM, Taehyoung Lee, Wooram KIM
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

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Номер записи: 77
15-01-2015 дата публикации

ELECTRONIC COMPONENT THICKNESS MEASUREMENT METHOD, METHOD FOR MANUFACTURING A SERIES OF ELECTRONIC COMPONENTS USING THE MEASUREMENT METHOD, A SERIES OF ELECTRONIC COMPONENTS MANUFACTURED BY THE MANUFACTURING METHOD, AND ELECTRONIC COMPONENT INSPECTION APPARATUS

Номер: US20150016071A1
Автор: HARUKI Masayoshi, NISHIOKA Yoshinao
Принадлежит:

An electronic component thickness measurement method includes extracting, from a plurality of second reference lines in first image data and a plurality of second reference lines in second image data, only a second reference line at which a difference in intensity peak between respective second reference lines at a same position in the first image data and the second image data is smallest, and forming third image data including a first reference line and the extracted second reference line, and calculating a thickness of the electronic component from a distance between the first reference line and the second reference line in the third image data. 1. An electronic component thickness measurement method comprising the steps of:applying a first electromagnetic wave from obliquely above to an electronic component and a transparent plate on which the electronic component is mounted;receiving reflected waves of the first electromagnetic wave and forming first image data including a first reference line representing an intensity peak of a reflected wave reflected from an upper surface of the electronic component and a plurality of second reference lines representing respective intensity peaks of a plurality of reflected waves reflected from the transparent plate;applying a second electromagnetic wave, which is different from the first electromagnetic wave in a direction of polarization, from obliquely above and at a same angle as the first electromagnetic wave, to a position on the electronic component and the transparent plate identical or substantially identical to a position to which the first electromagnetic wave is applied;receiving reflected waves of the second electromagnetic wave and forming second image data including a first reference line representing an intensity peak of a reflected wave reflected from the upper surface of the electronic component and a plurality of second reference lines representing respective intensity peaks of a plurality of reflected ...

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Номер записи: 78
03-02-2022 дата публикации

DEVICE AND METHOD FOR DETECTING AN OBJECT

Номер: US20220034648A1
Автор: Sikora Harald
Принадлежит: Sikora AG

A device for detecting an object conveyed through a measuring region comprises a transmission apparatus configured to emit measuring radiation onto the outer contour of the object. The measuring radiation comprises a frequency in a range of one of gigahertz and terahertz. A protective mesh is positioned between the measuring region and at least one of the transmission apparatus and the receiving apparatus. The protective mesh is transparent for the measuring radiation and permeable to as gas. 114-. (canceled)15. A device for detecting an object conveyed through a measuring region , the device for detecting the object comprising:a transmission apparatus configured to emit measuring radiation onto an Outer contour of the object, wherein the measuring radiation comprises a frequency in a range of one of gigahertz and terahertz;a receiving apparatus configured to receive the measuring radiation reflected by the object; anda protective mesh positioned between the measuring region and at least one of the transmission apparatus and the receiving apparatus, wherein the protective mesh is transparent to the measuring radiation and permeable to a gas.16. The device according to claim 15 , wherein the transmission apparatus and the receiving apparatus are formed by a transceiver.17. The device according to claim 15 , wherein the protective mesh comprises a glass fiber fabric.18. The device according to claim 15 , wherein the transmission apparatus and the receiving apparatus are arranged in a housing defining a housing opening that faces the measuring region claim 15 , and wherein the protective mesh covers the housing opening.19. The device according claim 15 , further comprising a flushing apparatus configured to flush the protective mesh with a flushing gas.20. The device according to wherein the flushing apparatus is configured to continuously flush the protective mesh with the flushing gas at at least one of: (1) a time before; (2) a time during; and (3) a time after a ...

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Номер записи: 79
03-02-2022 дата публикации

SHAPE MEASURING METHOD

Номер: US20220034650A1
Автор: ARAI Hideyuki, REDLARSKI Lukasz
Принадлежит: MITUTOYO CORPORATION

A shape measuring apparatus applies, to a light beam, a periodic pattern having periodicity in a direction perpendicular to an optical axis and displaceable in the direction perpendicular to the optical axis, relatively displaces a focal point of an objective lens in a direction parallel to the optical axis, and calculates, based on amplitude of intensity of the light beam detected by a photodetector, face shape data on the object to be measured. Then, a top surface measuring step of acquiring face shape data on a top surface of the object to be measured, and a bottom surface measuring step of acquiring face shape data on a bottom surface of the object to be measured by transmitting through the top surface of the object to be measured and aligning the focal point of the objective lens on the bottom surface of the object to be measured are performed. 1. A shape measuring method using a shape measuring apparatus comprising:a light source;a periodic pattern applying means for applying, to a light beam from the light source, a periodic pattern having periodicity in a direction perpendicular to an optical axis and displaceable in the direction perpendicular to the optical axis;an objective lens configured to irradiate an object to be measured with the light beam to which the periodic pattern is applied;a focus drive unit configured to displace a focal point of the objective lens relatively to the object to be measured in a direction parallel to the optical axis;a photodetector configured to detect the light beam reflected by the object to be measured;a face shape calculation unit configured to calculate, based on amplitude of intensity of the light beam detected by the photodetector, face shape data on the object to be measured; anda shape analysis unit configured to analyze, from the face shape data calculated by the face shape calculation unit, a shape of the object to be measured,the shape measuring method comprising:a top surface measuring step of acquiring, by the ...

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Номер записи: 80
09-01-2020 дата публикации

COMPONENT MOUNTING SYSTEM AND ADHESIVE INSPECTION DEVICE

Номер: US20200015396A1
Автор: Futamura Ikuo, Kikuchi Kazuyoshi, Ohyama Tsuyoshi, Sakaida Norihiko
Принадлежит: CKD CORPORATION

A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder. 1. A component mounting system comprising:a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, wherein the electronic component is fixed to the substrate with a thermosetting adhesive; andan adhesive inspection device, wherein sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and', 'mounts the electronic component at the target mounting height,, 'the component mounting machine an ideal mounting height based on design data; or', 'a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder;, 'wherein the target mounting height is measures a height of the adhesive relative to the substrate;', 'determines a quality of the adhesive based on the height of the adhesive; and', ' ...

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Номер записи: 81
03-02-2022 дата публикации

THIN FILM SPECTROELLIPSOMETRIC IMAGING

Номер: US20220034791A1
Автор: Zhang Aizhong
Принадлежит:

A method and device of thin film spectroellipsometric imaging are disclosed. The device comprises an illuminator to direct light through a polarization generator system toward an extended area of a sample; an imaging system to form images; a detection system to record in a plurality of spectral channels; a computer to display and analyze the recorded images; and at least one reference phantom with known optical properties to replace the sample for calibration. The method comprises directing light from an illuminator through a polarization generator system toward an extended area of a sample having a geometrical shape; forming images with an imaging system; adjusting a polarization generator system and a polarization analyzer system to obtain a series of polarimetric setups; recording the images with a detection system in a plurality of spectral channels; replacing the sample with at least one reference phantom; and analyzing the recorded images with a computer. 1. A thin film spectroellipsometric imaging device , comprising:an illuminator to direct light through a polarization generator system toward an extended area of a sample, wherein said illuminator is broadband, covering visible and infrared spectra, wherein said polarization generator system generates a plurality of polarization states, wherein said sample has a geometrical shape;an imaging system to form images of said extended area of said sample, wherein said imaging system comprises a polarization analyzer system;a detection system to record said images, wherein said detection system comprises a plurality of spectral channels, covering visible and infrared spectra;a computer to display and analyze said recorded images from said detection system; andat least one reference phantom with known optical properties to replace said sample for calibration, wherein said at least one reference phantom has the same or substantially similar geometrical shape as of said sample or a segment of said sample.2. (canceled)3 ...

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Номер записи: 82
15-01-2015 дата публикации

Film-thickness measuring apparatus, film-thickness measuring method, and polishing apparatus having the film-thickness measuring apparatus

Номер: US20150017880A1
Автор: Katsuhide Watanabe, Takeshi Iizumi, Toshikazu Nomura, Yoichi Kobayashi
Принадлежит: Ebara Corp

A film-thickness measuring apparatus and a film-thickness measuring method capable of improving an accuracy of the film-thickness measurement are disclosed. The film-thickness measuring apparatus includes a substrate stage configured to support a substrate horizontally, a rinsing water supply structure configured to supply rinsing water onto an entire surface of the substrate on the substrate stage, a film-thickness measuring head configured to transmit light to a measurement area of the surface of the substrate on the substrate stage, produce a spectrum of reflected light from the measurement area, and determine a film thickness of the substrate from the spectrum, and a fluid supply structure configured to form a flow of a gas on a path of the light and supply the flow of the gas onto the measurement area.

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Номер записи: 83
03-02-2022 дата публикации

Adaptive Focusing System for a Scanning Metrology Tool

Номер: US20220034820A1
Автор: Laredo Gilad
Принадлежит:

An adaptive focusing system including an optics module, an optics module height positioner (OMHP), a position sensor operative to generate a position output indicating a height of the optics module, a predictive height estimator operative to generate an estimated height value of a sample at each site of a plurality of sites, and generate a desired optics module height output for each of the sites, a regulator operative to generate, at least partially based on the desired optics module height output and a known height of the optics module, a sequence of optics module height control instructions for the plurality of sites, a driver operative to provide a sequence of control outputs to the OMHP and a model predictive controller (MPC) operative to monitor differences between a reported height of the optics module and an MPC-expected height of the optics module, thereby to generate system amelioration values. 1. An adaptive focusing system for a scanning metrology tool , the adaptive focusing system comprising:an optics module comprising at least one optical component;an optics module height positioner (OMHP);a position sensor operative to generate a position output indicating a height of said optics module; generate an estimated height value of a sample at each site of a plurality of sites, said plurality of sites being located along a path defined by a movement of said optics module relative to said sample; and', 'generate a desired optics module height output for each of said sites, said desired optics module height output being based at least partially on said estimated height value at said site;, 'a predictive height estimator (PHE) operative toa regulator operative to generate, at least partially based on said desired optics module height output and a known height of said optics module, a sequence of optics module height control instructions for said plurality of sites;a driver operative to provide a sequence of control outputs to said OMHP, said sequence of ...

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Номер записи: 84
15-01-2015 дата публикации

POLISHING APPARATUS AND POLISHED-STATE MONITORING METHOD

Номер: US20150017887A1
Автор: KINOSHITA Masaki, Kobayashi Yoichi, SHIOKAWA Yoichi, WATANABE KATSUHIDE, YAGI Keita
Принадлежит:

A polishing apparatus capable of achieving a highly-precise polishing result is disclosed. The polishing apparatus includes an in-line film-thickness measuring device configured to measure a film thickness of the substrate in a stationary state, and an in-situ spectral film-thickness monitor having a film thickness sensor disposed in a polishing table, the in-situ spectral film-thickness monitor being configured to subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value, add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and monitor a progress of polishing of the substrate based on the monitoring film thickness. 1. A polishing apparatus , comprising:a polishing table for supporting a polishing pad;a top ring configured to press a substrate against the polishing pad;an in-line film-thickness measuring device configured to measure a film thickness of the substrate when the substrate is in a stationary state; andan in-situ spectral film-thickness monitor having a film thickness sensor disposed in the polishing table, subtract an initial film thickness, measured by the in-situ spectral film-thickness monitor before polishing of the substrate, from an initial film thickness, measured by the in-line film-thickness measuring device before polishing of the substrate, to determine a correction value,', 'add the correction value to a film thickness that is measured when the substrate is being polished to obtain a monitoring film thickness, and', 'monitor a progress of polishing of the substrate based on the monitoring film thickness., 'the in-situ spectral film-thickness monitor being configured to'}2. A polished-state monitoring method , comprising:measuring an ...

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Номер записи: 85
19-01-2017 дата публикации

PECVD PROCESS

Номер: US20170016118A1
Автор: AYOUB Mohamad A., Balasubramanian Ganesh, BANSAL Amit Kumar, BUDIARTO Edward, Chen Jian J., Egan Todd, HAN Xinhai, Jiang Zhijun, Kim Bok Hoen, LEE Jeongmin, Lee Terrance Y., Nowak Thomas, Ogata Masaki, PANASYUK Dmitriy, PARK Heung Lak, Rajagopalan Nagarajan, REILLY Patrick, Rocha-Alvarez Juan Carlos, Sankarakrishnan Ramprakash, SHAIKH Shahid, STARIK Sergey, TSIANG Michael Wenyoung, ZHOU Jianhua
Принадлежит:

A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants. 1. A semiconductor processing apparatus , comprising:a chamber with a side wall and a floor; a gas distributor having a plurality of gas flow openings; and', 'a metrology device that directs and receives light through one of the gas flow openings; and, 'a lid coupled to the side wall, and together with the side wall and floor defining an internal volume, the lid comprisinga substrate support disposed in the internal volume.2. The apparatus of claim 1 , wherein the metrology device directs light toward the substrate support and receives light reflected from inside the internal volume.3. The apparatus of claim 1 , wherein the lid further comprises a zoned plate having a gas flow opening aligned with a gas flow opening of the gas distributor claim 1 , wherein the metrology device directs and receives light through the gas flow openings of the zoned plate and the gas distributor.4. The apparatus of claim 3 , wherein the lid further comprises a second zoned plate and the metrology device includes a collimator that fits an opening in the second zoned plate.5. The apparatus of claim 4 , wherein the collimator does not contact the second zoned plate when disposed in the opening of the second zoned plate.6. The apparatus of claim 3 , further comprising an electrode between the gas distributor and the side wall.7. The apparatus of claim 6 , wherein ...

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Номер записи: 86
19-01-2017 дата публикации

Optical Metrology Tool Equipped with Modulated Illumination Sources

Номер: US20170016815A1
Автор: Brady Gregory, Peterlinz Kevin, Rotter Lawrence D., Shaughnessy Derrick A., Shchegrov Andrei V., Veldman Andrei, Wang David Y.
Принадлежит:

The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulses trains for use in multi-wavelength time-sequential optical metrology. 1. An optical metrology tool , comprising:a first illumination source configured to generate illumination of a first wavelength;at least one additional illumination source configured to generate illumination of an additional wavelength, the additional wavelength different from the first wavelength, the first illumination source and the at least one additional illumination source configured to illuminate a surface of a sample disposed on a sample stage;a set of illumination optics configured to direct illumination of the first wavelength and illumination of the at least one additional wavelength from the first illumination source and the at least one additional illumination source to the surface of the sample;a set of collection optics;a detector configured to detect at least a portion of illumination emanating from a surface of the sample, wherein the set of collection optics is configured to direct illumination emanating from the surface of the sample to the detector; anda modulation control system ...

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Номер записи: 87
19-01-2017 дата публикации

OPTICAL PHASE MEASUREMENT METHOD AND SYSTEM

Номер: US20170016835A1
Автор: Barak Gilad, Berlatzky Yoav, Grossman Danny, HAINICK YANIR, SHAFIR DROR
Принадлежит: NOVA MEASURING INSTRUMENTS LTD.

A measurement system for use in measuring parameters of a patterned sample is presented. The system comprises: a broadband light source; an optical system configured as an interferometric system; a detection unit; and a control unit. The interferometric system defines illumination and detection channels having a sample arm and a reference arm comprising a reference reflector, and is configured for inducing an optical path difference between the sample and reference arms; the detection unit comprises a configured and operable for detecting a combined light beam formed by a light beam reflected from said reflector and a light beam propagating from a sample's support, and generating measured data indicative of spectral interference pattern formed by at least two spectral interference signatures. The control unit is configured and operable for receiving the measured data and applying a model-based processing to the spectral interference pattern for determining one or more parameters of the pattern in the sample. 1. A measurement system for use in measuring parameters of a patterned sample , the system comprising: a broadband light source; an optical system configured as an interferometric system; a detection unit; and a control unit; wherein the interferometric system defines illumination and detection channels having a sample arm and a reference arm comprising a reference reflector , and is configured for inducing an optical path difference between the sample and reference arms; the detection unit comprises a configured and operable for detecting a combined light beam formed by a light beam reflected from said reflector and a light beam propagating from a sample's support , and generating measured data indicative of spectral interference pattern formed by at least two spectral interference signatures; and said control unit is configured and operable for receiving the measured data and applying a model-based processing to the spectral interference pattern for ...

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Номер записи: 88
21-01-2016 дата публикации

THICKNESS MEASUREMENT APPARATUS AND THICKNESS MEASUREMENT METHOD

Номер: US20160018213A1
Автор: MIKI Yutaka
Принадлежит: MITUTOYO CORPORATION

A thickness measurement apparatus includes a light source emitting light; an optical system focusing the light emitted from the light source onto an optical axis; a reflector reflecting light focused by the optical system; a detector detecting intensity of the reflected light according to a position on the optical axis where the light passing through the optical system is in focus; and a calculator calculating thickness of a measured object using a refractive index of the measured object and an amount of displacement between a first focus position and a second focus position.

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Номер записи: 89
18-01-2018 дата публикации

DEVICE AND METHOD FOR DETERMINING THE LOSS ON IGNITION OF AT LEAST PART OF AN IRON AND STEEL PRODUCT

Номер: US20180017374A1
Автор: CHAN Yuen Yee, MAGALHAES Jean-Luc
Принадлежит:

Disclosed is a method and device for determining the loss on ignition of at least part of an iron and steel product during passage through a furnace upstream of a descaler. The device includes electromagnetic sensors, with at least one arranged to scan the product's lower surface near the furnace outlet, the sensor oriented so the scanning plane of the electromagnetic radiation from the sensor is perpendicular to a direction of movement; a set of at least two electromagnetic sensors upstream of the descaler, oriented so their scanning planes are substantially on a single plane perpendicular to the direction of movement of the at least part of the product; and at least two electromagnetic sensors downstream of the descaler, oriented so their scanning planes are substantially on a single plane perpendicular to the product's movement direction. The sensors determine the height of the product upstream and downstream of the descaler. 1548362030314041. A device for determining the scale loss of at least one part of a steel product () , referred to as product , during the passage thereof through a reheating furnace () located upstream of a descaler ) , the product preferably moving on roller tables ( , ) , said device comprising a set of electromagnetic sensors ( , , , , ) , which set comprises:{'b': 20', '50', '5', '4', '20, 'at least one electromagnetic sensor () of said set being arranged in order to scan, along a scanning plane, at least in part, the lower face () of the product () in the vicinity of the outlet of the furnace (), said electromagnetic sensor being oriented so that said scanning plane (P) of the electromagnetic radiation of said sensor is perpendicular to a run direction of the product,'}{'b': 30', '31', '8', '30', '31', '32', '3', '40', '41', '8', '40', '41', '42', '6', '30', '31', '40', '41, 'a set of at least two electromagnetic sensors (, ) placed upstream of the descaler () and oriented so that the scanning planes (P, P) of the electromagnetic ...

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Номер записи: 90
18-01-2018 дата публикации

SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE

Номер: US20180017375A1
Автор: LIU Xiang, SHI Yunyu, XIA Yongxiang
Принадлежит:

The present invention relates to a parallel image measurement method oriented to the insulating layer thickness of a radial symmetrical cable section. The method conducts the non-contact high-accuracy measurement based on the machine vision and the image analysis, adopts a GPU multi-core parallel platform for the high-speed measurement, extracts the useful information from the section image of the radial symmetrical cable, and then measures the insulating layer thickness. Compared with the prior art, the present patent can lower the time consumed for the accurate measurement, fill in the blank of the high-accuracy parallel image measurement of the insulating layer thickness of the radial symmetrical cable section in the domestic cable industry, break down the monopoly and technology blockade by related foreign manufacturers and improve the technology level of on-line testing of product quality in China, expedite the production automation progress of domestic manufacturer. 1. A parallel image measurement method oriented to the insulating layer thickness of a radial symmetrical cable section , characterized in that said method conducts the non-contact high-accuracy measurement based on the machine vision and the image analysis , adopts a GPU multi-core parallel platform for the high-speed measurement , extracts the useful information from an image of said radial symmetrical cable section and then measures said insulating layer thickness.2. The parallel image measurement method oriented to the insulating layer thickness of a radial symmetrical cable section according to claim 1 , characterized in that said method comprises the following steps:1) Reading an image shot, calibrated by an industrial CCD camera;2) Extracting an inner and an outer contour of said radial symmetrical cable section from said image and calculating a mass center of said cable section;3) Subjecting the pixels of said inner contour to the sub-pixel pinpointing, connecting said mass center and said ...

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Номер записи: 91
21-01-2016 дата публикации

FOCUS METROLOGY METHOD AND PHOTOLITHOGRAPHY METHOD AND SYSTEM

Номер: US20160018743A1
Автор: KUO Hung-Ming, Lee Yung-Yao, Liu Heng-Hsin, Peng Jui-Chun
Принадлежит:

The present disclosure provides a focus metrology method and photolithography method and system. The focus metrology method includes recognizing at least one relevant region and at least one irrelevant region on a workpiece surface, measuring a height of the relevant region and determining a focal length for an exposure process based on the measured height of the relevant region.

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Номер записи: 92
18-01-2018 дата публикации

METHOD FOR PREDICTING FRICTIONAL RESISTANCE OF ROUGH SURFACE, AND APPARATUS FOR ESTIMATING SURFACE PERFORMANCE

Номер: US20180017482A1
Автор: MIENO Hirohisa
Принадлежит: CHUGOKU MARINE PAINTS, LTD.

The invention provides a method which predicts a ratio of the increase in frictional resistance of a rough surface in a simple manner, quickly and without variations in predicted results among individuals. The method for predicting the frictional resistance of a rough surface having a variation in roughness wavelength, and being in contact with a fluid flowing at varied velocities includes evaluating the total projected area of all prominent peaks standing out above the viscous sublayer thickness per unit area, and calculating the friction increase ratio FIR (%) or the frictional resistance increase Δτ. 1: A method for predicting the frictional resistance of a rough surface having a variation in roughness wavelength , and being in contact with a fluid flowing at varied velocities , the method comprising evaluating the total projected area A of all prominent peaks standing out above the viscous sublayer thickness per unit area (hereinafter , written as the “prominent peak projected area A”) , and calculating the friction increase ratio FIR (%) using Equation (1) below or the frictional resistance increase Δτ using Equation (2) below:{'br': None, '[Math. 1]'}{'br': None, 'i': 'C×A', 'FIR (%)=\u2003\u2003(1)'}{'br': None, '[Math. 2]'}{'br': None, 'i': C', 'AV, 'sub': 'r', 'sup': '2', 'Δτ=1/2ρ\u2003\u2003(2)'}{'sub': r', '0', 'r', '0', '0, '(in Equation (1), the coefficient C is a constant dependent on the prominent peak projected area A and is determined by performing a frictional resistance test beforehand in which the frictional resistance is measured with respect to a plurality of rough surfaces differing in the degree of roughness while changing the flow velocity V and the friction increase ratios FIR (%) of the rough surfaces are calculated wherein the friction increase ratios FIR (%) are percentages of the difference τ−τbetween the frictional resistance τof the rough surface and the frictional resistance τof a smooth surface, divided by τ, and'}{'sub': r', 'r', ' ...

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Номер записи: 93
18-01-2018 дата публикации

Laminate substrate measurement method, laminate substrate and measurement apparatus

Номер: US20180017484A1
Автор: Kenji Kasahara, Taiki Yamamoto, Taketsugu Yamamoto
Принадлежит: Sumitomo Chemical Co Ltd

A measurement method for a laminate substrate is provided. The laminate substrate has: a base substrate; an absorption layer; and a measurement-target layer in this order. The measurement-target layer has a single measurement-target monolayer or a plurality of measurement-target monolayers. The method includes: emitting incident light including light with a wavelength shorter than a threshold wavelength from a side on which the measurement-target layer is positioned, and measuring reflected light and acquiring mutually independent 2n (n is a layer count of the measurement-target monolayers included in the measurement-target layer and is an integer equal to one or larger) or more reflected light-related values for wavelengths equal to the threshold wavelength or shorter; and calculating values related to the measurement-target monolayers for each measurement-target monolayer included in the measurement-target layer using the 2n or more reflected light-related values.

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Номер записи: 94
18-01-2018 дата публикации

A DETECTION SYSTEM FOR DETECTING AND DETERMINING AN INTEGRITY OF PHARMACEUTICAL/PARAPHARMACEUTICAL ARTICLES

Номер: US20180017506A1
Автор: MONTI Giuseppe
Принадлежит:

A detection system (S) for detecting and determining an integrity of pharmaceutical/parapharmaceutical articles includes a conveyor device (), for conveying and advancing articles having an advancement section () along which the articles are advanced on a flat plane, in a line one after another in an advancement direction (A). The system (S) has a processor (E) for data processing; at least one colour matrix video camera () for acquiring images of the articles advancing along the advancement section, a laser projector (P) able to emit and project a laser beam (L) so that the laser beam (L) crosses the advancement section () and a high-speed linear three-dimensional video camera () for acquiring the images of the cut profiles of the articles crossing the laser beam. 1. A detection system for detecting and determining an integrity of pharmaceutical/parapharmaceutical articles , comprising:a conveyor device, for conveying and advancing articles, the conveyor device comprising an advancement section in which the articles are advanced on a flat plane, in a line one after another in an advancement direction;a processor for data processing;at least a colour matrix video camera connected to the processor and arranged above the advancement section of the conveyor device and arranged so that the lens thereof is facing towards the advancement section so that the visual field thereof for capturing the images is at the advancement section, along which the articles are advanced in a line, one after another, so that the colour matrix video camera can capture a series of images of an outline and a colour of each article, during the advancement thereof along the advancement section across the visual field of the colour matrix video camera, the processor being programmed to receive the images captured by the colour matrix video camera and to process the images so as to supply, for each article, a first datum relative to the effective shape of the outline and colour of the article;a ...

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Номер записи: 95
03-02-2022 дата публикации

METROLOGY AND PROCESS CONTROL FOR SEMICONDUCTOR MANUFACTURING

Номер: US20220036218A1
Автор: BRINGOLTZ BARAK, BROITMAN ARIEL, Cohen Oded, Kandel Daniel, KIM YONGHA, RABINOVICH EYLON, ROTHSTEIN EITAN, RUBINOVICH ILYA, TAL NOAM, YOGEV SHAY, ZAHARONI TAL
Принадлежит:

A semiconductor metrology system including a spectrum acquisition tool for collecting, using a first measurement protocol, baseline scatterometric spectra on first semiconductor wafer targets, and for various sources of spectral variability, variability sets of scatterometric spectra on second semiconductor wafer targets, the variability sets embodying the spectral variability, a reference metrology tool for collecting, using a second measurement protocol, parameter values of the first semiconductor wafer targets, and a training unit for training, using the collected spectra and values, a prediction model using machine learning and minimizing an associated loss function incorporating spectral variability terms, the prediction model for predicting values for production semiconductor wafer targets based on their spectra. 1. A semiconductor metrology method comprising:collecting, using a spectrum acquisition tool and in accordance with a first measurement protocol, a baseline set of spectra on a first set of semiconductor wafer targets;collecting, using a reference metrology tool and in accordance with a second measurement protocol, values of predefined parameters of the first set of semiconductor wafer targets;for each of one or more predefined sources of spectral variability, collecting a variability set of spectra using the spectrum acquisition tool, and in accordance with the first measurement protocol, on a second set of semiconductor wafer targets corresponding to the first set of semiconductor wafer targets, wherein the variability set of spectra embodies the spectral variability;creating a training set of data from the collected sets of spectra and parameter values;using one or more generative models to increase the size of the training set of data; and wherein the prediction model is configured to be used to predict values for any of the predefined parameters using production spectra of a third set of semiconductor wafer targets, wherein the production spectra ...

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Номер записи: 96
19-01-2017 дата публикации

HYBRID METROLOGY TECHNIQUE

Номер: US20170018069A1
Автор: Bozdong Cornel, Osorio Cermen, Sendelbach Matthew J., Tsai Jamie, Vaid Alok, Wolfling Shay
Принадлежит:

A computerized system and method are provided for use in measuring at least one parameter of interest of a structure. The system comprises a server utility configured for data communication with at least first and second data provider utilities. The server utility receives, from the server provider utilities, measured data comprising first and second measured data pieces of different types indicative of parameters of the same structure; and is capable of processing the first and second measured data pieces for optimizing one or more first parameters values of the structure in one of the first and second measured data pieces by utilizing one or more second parameters values of the structure of the other of said first and second measured data pieces. 1. A computerized system for use in measuring at least one parameter of interest of a structure , the system comprising:a server utility configured for data communication with at least first and second data provider utilities, for receiving therefrom measured data comprising first and second measured data pieces of different types indicative of parameters of the same structure, said server utility being configured and operable for concurrently processing said first and second measured data pieces for optimizing one or more first parameters values of the structure in one of the first and second measured data pieces by utilizing one or more second parameters values of the structure of the other of said first and second measured data pieces.2. The system of claim 1 , wherein the server utility comprises:a first processing utility connected to the first data provider for receiving the first measured data piece and determining said one or more first parameters values;a second processing utility connected to the second data provider for receiving the second measured data piece and determining said one or more second parameters values; anda hybrid co-optimization utility connected to the first and second processing utilities, ...

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Номер записи: 97
17-01-2019 дата публикации

FILM THICKNESS MEASURING METHOD AND FILM THICKNESS MEASURING DEVICE

Номер: US20190017807A1
Автор: ARAMAKI Hirokatsu, IWAMOTO Katsuya, Kondo Koji, OKADA Naoto
Принадлежит: TOYOTA JIDOSHA KABUSHIKI KAISHA

A signal waveform of an estimation signal and a signal waveform of the reflected light intensity signal are coordinated with each other such that a time point when a film thickness is equal to zero in the signal waveform of the estimation signal and a base point in the signal waveform of the reflected light intensity signal coincide with each other. A film thickness corresponding to that estimated value of a signal intensity of a reflected light which corresponds to a film thickness range corresponding to a time range in the signal waveform of the estimation signal and coincides with the signal intensity of the reflected light at a desired time point is set as a film thickness of a thin film at the desired time point. 1. A film thickness measuring method comprising:arranging a volatile light-permeable film to be measured on a substrate, and irradiating the light-permeable film with light from a light source until an end of evaporation of the light-permeable film;receiving reflected light of the light-permeable film in a regular reflection direction by a light receiving element, acquiring a reflected light intensity signal that is a time-series signal of a signal intensity of the reflected light until the end of evaporation of the light-permeable film, the reflected light intensity signal indicating a change of the signal intensity, and saving the acquired reflected light intensity signal into a storage device;estimating the signal intensity of the reflected light that is obtained by irradiating the light-permeable film with light from the light source, based on a spectroscopic intensity of the light source, a spectroscopic sensitivity of the light receiving element, and an optical constant of the light-permeable film, and acquiring an estimation signal indicating a change of an estimated value of the signal intensity of the reflected light as a film thickness of the light-permeable film changes;specifying a time range where a desired time point exists, based on the ...

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Номер записи: 98
17-01-2019 дата публикации

FILM-THICKNESS MEASURING APPARATUS, POLISHING APPARATUS, AND POLISHING METHOD

Номер: US20190017808A1
Автор: KIMBA Toshifumi
Принадлежит:

A film-thickness measuring apparatus includes: a light source; an illuminating fiber coupled to the light source and having a distal end disposed at a predetermined position in a wafer supporting structure; a spectrometer configured to decompose reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths; a first light-receiving fiber having a distal end disposed at the predetermined position; a second light-receiving fiber having a distal end which is disposed at the predetermined position and is adjacent to the distal end of the first light-receiving fiber; a processor configured to determine a film thickness of the wafer based on a spectral waveform indicating a relationship between the intensity of the reflected light and the wavelength; and an optical-path selecting mechanism configured to optically connect and disconnect the second light-receiving fiber and the spectrometer. 1. A film-thickness measuring apparatus comprising:a light source;an illuminating fiber coupled to the light source and having a distal end disposed at a predetermined position in a wafer supporting structure, the illuminating fiber not projecting from a surface of the wafer supporting structure;a spectrometer configured to decompose reflected light from a wafer in accordance with wavelength and measure an intensity of the reflected light at each of wavelengths;a first light-receiving fiber having a distal end disposed at the predetermined position, the first light-receiving fiber being coupled to the spectrometer;a second light-receiving fiber having a distal end which is disposed at the predetermined position and is adjacent to the distal end of the first light-receiving fiber;a processor configured to determine a film thickness of the wafer based on a spectral waveform indicating a relationship between the intensity of the reflected light and the wavelength; andan optical-path selecting mechanism configured to ...

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Номер записи: 99
21-01-2021 дата публикации

APPARATUS FOR INSPECTING SUBSTRATE AND METHOD THEREOF

Номер: US20210018314A1
Автор: CHOI Jeong Hun, Hong Deok Hwa, HONG Young Joo, KIM Min Kyu
Принадлежит: KOH YOUNG TECHNOLOGY INC.

A substrate inspection apparatus is disclosed. The substrate inspection apparatus includes: a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments; a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate; a processor configured to derive one region among a plurality of regions of the substrate based on the 2D image; a second light source configured to radiate a laser light onto the one region; and a second light detector configured to obtain optical interference data generated from the one region by the laser light, wherein the processor is configured to derive a thickness of the coated film of the one region based on the optical interference data. 1. A substrate inspection apparatus comprising:a first light source configured to radiate an ultraviolet light onto a coated film of a substrate, the coated film being mixed with fluorescent pigments;a first light detector configured to capture fluorescence generated from the coated film onto which the ultraviolet light is radiated, and to obtain a two-dimensional (2D) image of the substrate;{'b': '120', 'a memory () configured to store information indicating a predetermined region of interest on the substrate;'}a processor configured to determine a first region among a plurality of regions of the substrate based on the 2D image and the information indicating the region of interest;a second light source configured to radiate a laser light onto the first region; anda second light detector configured to obtain optical interference data generated from the first region by the laser light,wherein the processor is configured to derive a thickness of the coated film of the first region based on the optical interference data.2. The substrate inspection apparatus of claim 1 , wherein the processor ...

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Номер записи: 100