Thermal marking systems and methods of control

A target marking system includes a light source emitting a thermal beam and an optics assembly directing the thermal beam to impact a target, the target directing radiation to the optics assembly in response to the impact. The target marking system further includes a detector, and an optics assembly optically connected to the detector.

Chemical Leak Inspection System

A method of visually detecting a leak of a chemical emanating from a component includes aiming a passive infrared camera system towards the component; filtering an infrared image with an optical bandpass filter, the infrared image being that of the leak; after the infrared image passes through the lens and optical bandpass filter, receiving the filtered infrared image with an infrared sensor device; electronically processing the filtered infrared image received by the infrared sensor device to provide a visible image representing the filtered infrared image; and visually identifying the leak based on the visible image. The passive infrared camera system includes: a lens; a refrigerated portion including the infrared sensor device and the optical bandpass filter (located along an optical path between the lens and the infrared sensor device). At least part of a pass band for the optical bandpass filter is within an absorption band for the chemical.

Welding systems having non-contact temperature measurement systems

Welding systems including welding torch assemblies are provided. The welding torch assembly may include a welding torch adapted to be utilized in a welding operation to establish a welding arc between the welding torch and a workpiece. Shielding gas may be supplied to the welding torch for establishment of a gas shielding area around a weld pool. The welding torch assembly may also include a temperature sensing system having a non-contact temperature sensor coupled to the welding torch and adapted to sense a temperature of the workpiece at a location outside of the molten weld pool.

HEATED RADIATION SENSOR

A heater () for a sensor () comprises a substrate (), an electrically conductive heating structure () on the substrate (), and one or more connecting portions () for electrically connecting the heating structure () to one or more outside terminals () of the sensor (). The substrate () is rigid and can comprise ceramics, preferably alumina ceramics. 1. A heater for a sensor , comprising:a substrate;an electrically conductive heating structure on the substrate; andone or more connecting portions for electrically connecting the heating structure to one or more outside terminals of the sensor.2. The heater of claim 1 , adapted to heat the sensor to a predetermined temperature or temperature range claim 1 , which may be a predetermined amount below an expected temperature of a radiation source and/or a predetermined amount above an expected ambient temperature of the sensor.3. The heater of claim 1 , comprising a control circuit for controlling the temperature of the heater.4. The heater of claim 3 , comprising a circuit terminal adapted to receive a temperature signal from the inside of the sensor claim 3 , and/or comprising a temperature sensor.5. The heater of claim 1 , wherein the conductive structure is an electrically resistive heater of a resistance that is constant over temperature or that is rising with rising temperature.6. The heater of claim 1 , wherein the conductive structure comprises a printed structure.7. The sensor of claim 1 , wherein the conductive structure comprises a trimmable structure.8. The heater of claim 1 , wherein the substrate comprises one or more holes respectively adapted to accommodate an external terminal of the sensor.9. The heater of claim 8 , wherein the internal wall of one or more of the holes comprises a metallization connected to a circuit element and/or to the conductive structure on the substrate.10. A heater for a sensor claim 8 , comprising:a substrate;an electrically conductive heating structure on the substrate; andone or ...

Infrared-Based Vehicle Component Imaging and Analysis

An improved system for evaluating one or more components of a vehicle is provided. The system includes a set of imaging devices configured to acquire image data based on infrared emissions of at least one vehicle component of the vehicle as it moves through a field of view of at least one of the set of imaging devices. An imaging device in the set of imaging devices can include a linear array of photoconductor infrared detectors and a thermoelectric cooler for maintaining an operating temperature of the linear array of detectors at a target operating temperature. The infrared emissions can be within at least one of: the mid-wavelength infrared (MWIR) radiation spectrum or the long wavelength infrared (LWIR) radiation spectrum.

Infrared Contrasting Color Emissivity Measurement System

Devices and corresponding methods can be provided to measure temperature and/or emissivity of a target. Emissivity of the target need not be known or assumed, and any temperature difference between a sensor and the target need not be zeroed or minimized. No particular bandpass filter is required. Devices can include one or two sensors viewing the same target as the target views different respective viewed temperatures. The respective viewed temperatures can be sensor temperatures, and a single sensor can be set to each of the respective viewed temperatures at different times. An analyzer can determine the temperature and/or emissivity of the target based on the respective viewed temperatures and on plural net heat fluxes detected by the sensors and corresponding to the respective viewed temperatures.

THERMAL DETECTION SYSTEMS, METHODS, AND DEVICES

Systems, methods, and devices for thermal detection. A thermal detection device includes a visual sensor, a thermal sensor (e.g., a thermopile array), a controller, a user interface, a display, and a removable and rechargeable battery pack. The thermal detection device also includes a plurality of additional software and hardware modules configured to perform or execute various functions and operations of the thermal detection device. An output from the visual sensor and an output from the thermal sensor are combined by the controller or the plurality of additional modules to generate a combined image for display on the display. 1. A thermal detection device comprising:an outer housing;a visual camera configured to generate a first signal related to a visual image of a scene;a first thermopile array including a first plurality of pixels;an array of temperature sensors positioned around the first thermopile array;a first control unit including a processor and a first memory, the first control unit connected to the first thermopile array and configured to generate a second signal related to a thermal image of the scene, the second signal associated with a temperature sensed by at least one of the first plurality of pixels in the first thermopile array; receive the second signal from the first control unit,', 'receive one or more output signals from the array of temperature sensors related to a temperature of the first thermopile array,', 'generate a thermal map of the first plurality of pixels in the first thermopile array based on the one or more output signals from the array of temperature sensors, the thermal map related to how each pixel of the first thermopile array is affected by variations in temperature, and', 'compensate the second signal based on the thermal map, and, 'a second control unit including a processor and a second memory, the second control unit electrically connected to the visual camera and the first control unit, the second control unit ...

THERMOELECTRIC DEVICE

A thermoelectric device () comprising a frame (), a membrane () made of thermoelectric material, and an element () for absorbing or releasing energy. The element () is supported to the frame () solely by the membrane (). 1. A thermoelectric device comprisinga frame,a membrane made of thermoelectric material, andan element for absorbing or releasing energy, the element being supported to the frame solely by the membrane.2. A thermoelectric device as claimed in claim 1 , wherein the membrane comprises at least one n-type region and/or at least one p-type region.3. A thermoelectric device as claimed in claim 1 , wherein the membrane comprises at least one n-type region claim 1 , at least one p-type region and at least one contacting region for contacting at least one region with at least one another region.4. A thermoelectric device as claimed in claim 1 , wherein the membrane is patterned to comprise at least one first beam and at least one second beam claim 1 , the at least one first beam comprising at least one n-type region and/or at least one p-type region claim 1 , and the at least one second beam comprising at least one n-type region and/or at least one p-type region claim 1 , the at least one first beam and the at least one second beam arranged to support the element to the frame.5. A thermoelectric device as claimed in claim 2 , wherein the at least one n-type region and/or the at least one p-type region are formed of amorphous claim 2 , single crystalline or polycrystalline silicon.6. A thermoelectric device as claimed in claim 5 , wherein a concentration of electrons or holes is at least 1E18/cm.7. A thermoelectric device as claimed in claim 2 , wherein thickness of the n-type region and/or the p-type region is less than 50 nm claim 2 , preferably less than 40 nm claim 2 , more preferably less than 20 nm.8. A thermoelectric device as claimed in claim 1 , wherein the thermoelectric device comprises at least one strain tuning layer for retaining the membrane ...

COOLED DETECTING DEVICE

A detection device for infrared radiation has a detection circuit of infrared radiation equipped with at least one photodetector. A readout circuit is electrically connected to the detection circuit, and is configured to process the signal emitted by the detection circuit. A Joule-Thomson cooler cools a cold table thermally and mechanically connected to the detection circuit and the readout circuit. The cold table including an internal cavity supplied with gaseous mixture. A relief port of the gas mixture is arranged at an input in the internal cavity. An output of the compressor feeds the relief port in a gaseous mixture. The input of the compressor receives the relaxed gaseous mixture from an output of the internal cavity. 18-. (Canceled)9. Device for detection of infrared radiation comprising:a detection circuit of said infrared radiation provided with at least one photodetector,a readout circuit electrically connected to the detection circuit and configured to process an electrical signal emitted by the detection circuit, a cold table thermally and mechanically connected to the detection circuit and the readout circuit, the cold table comprising an internal cavity,', 'a relief port arranged at an input of the internal cavity,', 'a compressor with an outlet supplying the relief port with gas and an input receiving said relaxed gas from an output of the internal cavity., 'a Joule-Thomson cooler fitted with'}10. Detection device according to comprising an exchanger configured to cool the gas at the outlet of the compressor by means of the relaxed gas at the output of the internal cavity.11. Detection device according to wherein the exchanger is a countercurrent exchanger.12. Detection device according to wherein the compressor is configured to generate a pressure gradient between 2 and 15 bar.13. Detection device according to wherein the detection device is devoid of a pre-cooling module of the gas.14. The cooling process of a detection device of infrared radiation ...

DETECTION DEVICE COMPRISING AN IMPROVED COLD FINGER

The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy. 1. A detection device comprising:a readout circuit formed in a first semiconductor substrate, a detection circuit hybridized on a first main surface of the readout circuit,a cooling system thermally connected to the detection circuit and to the readout circuit,a cold finger configured to enable cooling of the readout circuit by the cooling system,wherein the cold finger comprises at least one side wall defining a confinement channel of a cooling gas originating from the cooling system, said at least one side wall being at least partially formed by an area made from amorphous metal alloy so as to form a thermal insulator.2. The detection device according to claim 1 , wherein the area made from amorphous metal alloy forms a ring.3. The detection device according to claim 2 , wherein the at least one side wall is completely formed by an amorphous metal alloy.4. The detection device according to claim 3 , wherein the cold finger comprises a top formed from crystalline metal and connected to the readout circuit.5. The detection device according to claim 1 , wherein the amorphous metal alloy is chosen from Zirconium/Aluminium/Nickel/Copper alloys claim 1 , Zirconium/Titanium/Copper/Nickel/Beryllium alloys claim 1 , Iron/Nickel/Phosphorus/Boron alloys claim 1 , Iron/Boron alloys claim 1 , Iron/Nickel/Chromium/Phosphorus/Boron alloys claim 1 , Palladium/Nickel/Copper/Phosphorus alloys claim 1 , Palladium/Nickel/Phosphorus alloys claim 1 , Iron/Cobalt/Yttrium/Boron alloys claim 1 , and Cobalt/Nickel/Iron/Silicon/Boron alloys.6. The detection device according to claim 5 , wherein the amorphous metal alloy is chosen from Zr55AL10NI5Cu30 alloys claim 5 ...

DETECTION DEVICE COMPRISING AN IMPROVED COLD FINGER

The detection device comprises a cold finger which performs the thermal connection between a detector and a cooling system. The cold finger comprises at least one side wall at least partially formed by an area made from the amorphous metal alloy. Advantageously, the whole of the cold finger is made from the amorphous metal alloy. 2. The detection device according to claim 1 , wherein the area made from amorphous metal alloy forms a ring.3. The detection device according to claim 2 , wherein the at least one side wall is completely formed by an amorphous metal alloy.4. The detection device according to claim 3 , wherein the cold finger comprises a top formed from crystalline metal and connected to the readout circuit.5. The detection device according to claim 1 , wherein the amorphous metal alloy is chosen from Zirconium/Aluminium/Nickel/Copper alloys claim 1 , Zirconium/Titanium/Copper/Nickel/Beryllium alloys claim 1 , Iron/Nickel/Phosphorus/Boron alloys claim 1 , Iron/Boron alloys claim 1 , Iron/Nickel/Chromium/Phosphorus/Boron alloys claim 1 , Palladium/Nickel/Copper/Phosphorus alloys claim 1 , Palladium/Nickel/Phosphorus alloys claim 1 , Iron/Cobalt/Yttrium/Boron alloys claim 1 , and Cobalt/Nickel/Iron/Silicon/Boron alloys.6. The detection device according to claim 5 , wherein the amorphous metal alloy is chosen from ZrAlNiCualloys claim 5 , ZrTiCuNiBealloys claim 5 , FeBalloys claim 5 , FeNiPBand FeNiCrPBalloys claim 5 , PdNiCuPalloys claim 5 , PdNiPalloys claim 5 , Fe/Co/Y/Bor Fe/Co/Cr/Mo/C/B/Yor (Fe/Cr/Co/Mo/Mn/C/B)/Yalloys claim 5 , and CoNFeSiBalloys. This is a continuation of application Ser. No. 14/335,073 filed Jul. 18, 2014, and claims the benefit of French Application No. 1301711 filed Jul. 18, 2013. The entire disclosures of the prior applications are hereby incorporated by reference in their entirety.The invention relates to a detection device comprising a cold finger forming a cooling support of an infrared detector.In the field of detection devices, ...

Reduced dark current photodetector with charge compensated barrier layer

A photodetector comprising a photoabsorber, comprising a doped semiconductor, a contact layer comprising a doped semiconductor and a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, the barrier layer disposed between the photoabsorber and contact layers. The relationship between the photo absorbing layer and contact layer valence and conduction band energies and the barrier layer conduction and valance band energies is selected to facilitate minority carrier current flow while inhibiting majority carrier current flow between the contact and photo absorbing layers.

Pressure Vessel with High-Pressure Window

The present invention relates to a pressure vessel (1) having a pressure vessel wall (1a) which completely surrounds a reaction chamber (2) as a pressure space for the initiation and/or promotion of chemical and/or physical pressure reactions of a sample (P) to be heated which is accommodated in the reaction chamber (2), wherein the pressure vessel wall (1a) has an infrared-permeable high-pressure window (30) which extends away outward in a direction from the reaction chamber (2) and which is supported in the pressure vessel wall (1a) with respect to a pressure in the reaction chamber (2), wherein the pressure vessel (1) furthermore has an infrared to temperature sensor (40) which is situated directly opposite the high-pressure window (30), in order to measure the temperature of a sample (P), accommodated in the reaction chamber (2), during a pressure reaction through the high-pressure window (30).

Friction and wear reduction in cryogenic mechanisms and other systems

An apparatus includes a first component having a first surface and a second component having a second surface. The first surface includes sputtered gold, and the second surface includes a stainless steel alloy. The first surface is configured to contact the second surface, and one of the components is configured to move against another of the components. The stainless steel alloy could consist of a UNS 21800/AISI Type S21800 metal. The sputtered gold could include ion sputtered gold, and the sputtered gold could have a thickness of about 1 micron. The first component could include a first blade of an adjustable aperture mechanism, where the adjustable aperture mechanism also includes a second blade. The second component could include a first plate of the adjustable aperture mechanism, where the adjustable aperture mechanism further includes a second plate. The blades can be configured to move within a space between the plates.

Systems and methods for thermal imaging systems

A thermal imaging system for use in maintaining a turbine assembly includes a case, a single pixel detector positioned within the case, at least one optical transportation device, and a prism. The optical transportation device is coupled to the case and configured to direct electromagnetic radiation to the single pixel detector. The prism is coupled to the optical transportation device and configured to direct electromagnetic radiation into the optical transportation device and to the single pixel detector. At least the prism and the optical transportation device are inserted into the turbine assembly and the single pixel detector acquires images of the turbine assembly.

SYSTEM AND METHOD FOR DISPOSABLE IMAGING SYSTEM

An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter. 1. An imaging device comprising:a plurality of electronic components configured to collect data, said plurality of electronic components having a predetermined temperature parameter;a phase change material, said plurality of electronic components disposed within said phase change material, said phase change material having a first material phase and a second material phase, said phase change material configured to absorb heat through changing from the first material phase to the second material phase; anda heat transfer structure disposed within said phase change material, said heat transfer structure configured to conduct heat within said phase change material, wherein said phase change material and said heat transfer structure are further configured to regulate a temperature of said electronic components below the predetermined temperature parameter.2. The imaging device in accordance with claim 1 , further comprising an insulation material claim 1 , said plurality of electronic components disposed within said ...

Systems And Methods For Thermal Processing And Temperature Measurement Of A Workpiece At Low Temperatures

Systems and methods for thermal processing of a workpiece at low temperatures are disclosed. In one example implementation, a thermal processing apparatus includes a processing chamber having a workpiece support. The workpiece support can be configured to support a workpiece. The apparatus can include one or more heat sources configured to emit electromagnetic radiation in a first wavelength range to heat the workpiece to a processing temperature. The processing temperature can be in the range of about 50° C. to 150° C. The apparatus can include one or more sensors configured to obtain a measurement of electromagnetic radiation in a second wavelength range when the workpiece is at the processing temperature. The second wavelength range can be different from the first wavelength range. 1. A thermal processing apparatus , comprising:a processing chamber having a workpiece support, the workpiece support configured to support a workpiece;one or more heat sources configured to emit electromagnetic radiation in a first wavelength range to heat the workpiece to a processing temperature, wherein the processing temperature is from about 50° C. to about 150° C.; andone or more sensors configured to obtain a measurement of electromagnetic radiation in a second wavelength range when the workpiece is at the processing temperature, wherein the second wavelength range is different than the first wavelength range.2. The thermal processing apparatus of claim 1 , comprising one or more processors configured to determine a temperature of the workpiece based at least in part on the measurement of electromagnetic radiation obtained by the one or more sensors.3. The thermal processing apparatus of claim 1 , wherein the one or more heat sources emit electromagnetic radiation in a narrow band infrared range.4. The thermal processing apparatus of claim 1 , wherein the first wavelength range is in a range from about 850 nanometers to about 950 nanometers.5. The thermal processing apparatus ...

SHIELD PLATE AND MEASUREMENT APPARATUS

A shield plate that is used for non-contact measurement of a temperature of a measurement target is provided. The shield plate includes a base of which a temperature is adjustable. The base includes a central shield portion that is formed in the shield plate, an opening that is formed around the central shield portion, and a blackbody surface that is formed on one surface of the base to include a portion opposite to the opening with the central shield portion interposed therebetween and to radiate infrared rays. 1: A shield plate used for non-contact measurement of a temperature of a measurement target , the shield plate comprising a base of which a temperature is adjustable , a shield portion formed in the shield plate;', 'an opening formed around the shield portion; and', 'a blackbody portion formed on one surface of the base to comprise a portion opposite to the opening with the shield portion interposed therebetween and to radiate infrared rays., 'wherein the base comprises2: The shield plate according to claim 1 , wherein the opening is formed around the shield portion to be odd-fold rotationally symmetrical around the shield portion.3: The shield plate according to claim 1 , wherein the opening is formed in an annular shape around the blackbody portion.4: The shield plate according to claim 1 , wherein the opening is formed to decrease in size from the one surface of the base to the other surface of the base.5: A measurement apparatus for performing non-contact measurement of a temperature of a measurement target claim 1 , the measurement apparatus comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the shield plate according to disposed such that one surface of the base is opposite to the measurement target;'}an optical system configured to guide infrared rays passing through the opening of the shield plate;an infrared detector optically coupled to the optical system, configured to detect the guided infrared rays, and output a detection signal;a ...

Device For Securing An Infrared Radiation Detector From Unwanted Infrared Radiation And Heat

A device is provided for securing a plurality of infrared radiation detectors from unwanted infrared radiation. The device includes a structure supporting the plurality of infrared radiation detectors. A plurality of nanowires are positioned adjacent to each other so as to define a layer. The layer has an inner surface positioned adjacent an outer surface of the structure and an outer surface directable towards a source of unwanted infrared radiation. The plurality of IR radiation detectors are aligned with a desired field of view so as to receive IR radiation radiating from any objects in the field of view such that a first portion of the IR radiation engages and is absorbed by IR radiation detectors, while a second portion of the IR radiation engages and is absorbed by IR radiation detector is absorbed by layer. 1. A device for securing an infrared radiation detector from unwanted infrared radiation , comprising:a housing defining a cavity therein configured for receiving the infrared radiation detector therein, the housing having an outer surface and a forward wall with an aperture extending through; anda plurality of nanowires positioned adjacent to each other so as to define a layer, the layer having an inner surface positioned adjacent the outer surface of the housing and an outer surface directable towards a source of unwanted infrared radiation.2. The device of wherein the housing includes a rear wall claim 1 , the rear wall configured to support the infrared radiation detector thereon.3. The device of wherein each nanowire of the plurality of nanowires is fabricated from silicon impregnated with silver nanoparticles.4. The device of wherein each nanowire of the plurality of nanowires includes a terminal first end partially defining the inner surface of the layer and a second end.5. The device of wherein the second end of each nanowire of the plurality of nanowires has a generally conical configuration and terminates at a tip.6. The device of wherein the tip ...

MULTI-REFERENCE CORRELATED DOUBLE SAMPLING DETECTION METHOD AND MICROBOLOMETER USING THE SAME

Disclosed is a multi-reference correlated double sampling detection method including generating, by a plurality of unit reference cells, reference signals, receiving, by a plurality of unit active cells having absorbed an infrared signal, sensing signals, and detecting a pure infrared signal on a basis of the sensing signals and active cell values processed using the reference signals, wherein the unit reference cells do not react to the infrared signal and are configured of blind cells having identical electrical and thermal characteristics to the unit active cells. Accordingly, a self-heating effect of an active cell may be accurately cancelled out, the method is robust to common noise such as power supply noise, and fixed pattern noise occurring in a sensing circuit and including incoherence between skimming cells may be removed. Furthermore, the method may improve efficiency and greatly reduce complexity of analog and digital correction, and remove a thermo-electro cooler and shutter. 1. A multi-reference correlated double sampling detection method comprising:generating, by a plurality of unit reference cells, reference signals;receiving, by a plurality of unit active cells having absorbed an infrared signal, sensing signals; anddetecting a pure infrared signal on a basis of the sensing signals and active cell values processed using the reference signals,wherein the unit reference cells do not react to the infrared signal and are configured of blind cells having identical electrical and thermal characteristics to the unit active cells.2. The multi-reference correlated double sampling detection method of claim 1 , wherein the plurality of unit reference cells are configured of an n×m array claim 1 , where n and m are natural numbers.3. The multi-reference correlated double sampling detection method of claim 2 , wherein the active cell value is a value obtained by calculating an average value of reference output signals output from n unit reference cells present ...

SYSTEM AND METHOD FOR COOLING COMPONETS IN AN IMAGING SYSTEM

An imaging system based on an imaging device and/or a cooling system is provided. The imaging system may include a control module, an imaging device, and/or a cooling system. The imaging device may include a first portion and a second portion. The cooling system may include a cooling module configured to generate a cooling medium, and/or a cooling medium passage configured to spread the cooling medium. The cooling medium passage may belong to a closed loop. At least part of the cooling system may be located within the imaging device such that the cooling medium may be in direct contact with the at least part of the imaging device. 116-. (canceled)17. An imaging system , comprising:an imaging device; a cooling module configured to generate a cooling medium;', 'a cooling medium passage configured to spread the cooling medium to the at least one target portion of the imaging device; and', 'at least one hollow chamber configured to house at least a portion of the at least one target portion of the imaging device., 'a cooling system configured to cool at least one target portion of the imaging device, including18. The system of claim 17 , wherein the imaging device includes a plurality of detector units claim 17 , and the at least one target portion of the imaging device includes at least one of the plurality of detector units.19. The system of claim 18 , wherein each of the at least one hollow chamber is configured to accommodate one or more of the plurality of detector units.20. The system of claim 17 , wherein the imaging device includes a plurality of electronics units claim 17 , and the at least one target portion of the imaging device includes at least one of the plurality of electronics units.21. The system of claim 20 , wherein each of the at least one hollow chamber is configured to accommodate one or more of the plurality of electronics units.22. The system of claim 17 , wherein each of the at least one hollow chamber includes an inlet hole and an outlet hole ...

Systems and Methods for Thermal Radiation Detection

Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

EVAPORATIVE-COOLED SOLID-STATE BOLOMETER AND SINGLE-PHOTON DETECTOR

An evaporatively cooled device and a system including the same. In some embodiments, the system includes an oligolayer conductive sheet; a superconductor; a tunneling barrier, between the oligolayer conductive sheet and the superconductor; and a bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor. 1. A system , comprising:an oligolayer conductive sheet;a superconductor;a tunneling barrier, between the oligolayer conductive sheet and the superconductor; anda bias circuit, configured to apply a bias voltage across the tunneling barrier, the bias voltage being less than a gap voltage of the superconductor and greater than one-half of the gap voltage of the superconductor.2. The system of claim 1 , wherein the tunneling barrier comprises an oligolayer insulating sheet.3. The system of claim 2 , wherein the oligolayer insulating sheet has fewer than 10 atomic layers.4. The system of claim 2 , wherein the oligolayer insulating sheet is a monolayer insulating sheet.5. The system of claim 2 , wherein the oligolayer insulating sheet is composed of hexagonal boron nitride.6. The system of claim 1 , wherein the tunneling barrier comprises an oligolayer semiconductor sheet.7. The system of claim 6 , wherein the tunneling barrier is composed of molybdenum disulfide.8. The system of claim 1 , wherein the oligolayer conductive sheet has fewer than 10 atomic layers.9. The system of claim 1 , wherein the oligolayer conductive sheet is a monolayer sheet.10. The system of claim 1 , wherein the oligolayer conductive sheet is composed of graphene.11. The system of claim 1 , wherein the superconductor is amorphous.12. The system of claim 1 , wherein the superconductor is crystalline.13. The system of claim 1 , comprising: the oligolayer conductive sheet,', 'the superconductor, and', 'the tunneling barrier; and, 'a first normal- ...

Infrared detection module and associated infrared viewing device

The invention relates to an infrared detection module ( 4 ) comprising: a detection portion ( 7 ) comprising an infrared detector ( 16 ) and a detector housing ( 11 ) suitable for containing the infrared detector; a cold-production portion ( 8 ) comprising a refrigerating machine ( 39 ) for cooling the detector ( 16 ) and a refrigerating-machine casing ( 12 ) suitable for containing the refrigerating machine ( 39 ); and an attachment device ( 56 ) for attaching the detector casing ( 11 ) to the refrigerating-machine casing ( 12 ), the attachment device ( 56 ) comprising a nut ( 57 ) suitable for being screwed onto the detector housing ( 11 ) and/or onto the refrigerating-machine casing ( 12 ) so as to rigidly connect the casings to one another.

Infrared detection device

There is provided an infrared detection device including an infrared detector and a fixing tool. The infrared detector includes an infrared detection element and a metal case. The fixing tool includes a first plate, a second plate, a third plate, and an amplification substrate. The infrared detector is held by the first plate and the second plate. The second plate is electrically connected to the third plate. The third plate is electrically connected to an analog ground portion of the amplification substrate. A potential of the metal case is the same as an analog ground potential of the analog ground portion of the amplification substrate.

Impact Resistant Heated Window Mount for Thermal Camera

The present disclosure relates to optical systems, vehicles, and methods for providing improved mechanical performance of a camera and corresponding optical elements. An example optical system includes an outer housing and an inner support member. The optical system also includes an optical window coupled to the outer housing and the inner support member. The optical window is configured to be temperature-controllable. The optical system also includes a camera coupled to the inner support member. The camera is optically coupled to the optical window. Additionally, the outer housing, the optical window, and the camera are configured to be impact resistant. 1. An optical system comprising:an outer housing;an inner support member;an optical window coupled to the outer housing and the inner support member, wherein the optical window is configured to be temperature-controllable; anda camera coupled to the inner support member, wherein the camera is optically coupled to the optical window, wherein the outer housing, the optical window, and the camera are configured to be impact resistant.2. The optical system of claim 1 , further comprising a pressure-sensitive adhesive (PSA) claim 1 , wherein the outer housing is coupled to the optical window by way of the pressure-sensitive adhesive.3. The optical system of claim 1 , wherein an impact force applied to the optical window is distributed via a primary load path and a secondary load path claim 1 , wherein the primary load path comprises the optical window and the outer housing claim 1 , wherein the secondary load path comprises the optical window and the inner support member.4. The optical system of claim 1 , wherein the camera comprises a thermal infrared camera.5. The optical system of claim 1 , wherein the inner support member comprises a thermal baffle and a preload foam.6. The optical system of claim 1 , further comprising a window heater element claim 1 , wherein the window heater element comprises a flexible heater ...

REDUCED DARK CURRENT PHOTODETECTOR WITH CHARGE COMPENSATED BARRIER LAYER

A photodetector comprising a photoabsorber, comprising a doped semiconductor, a contact layer comprising a doped semiconductor and a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, the barrier layer disposed between the photoabsorber and contact layers. The relationship between the photo absorbing layer and contact layer valence and conduction band energies and the barrier layer conduction and valance band energies is selected to facilitate minority carrier current flow while inhibiting majority carrier current flow between the contact and photo absorbing layers. 17-. (canceled)8. A photodetector comprising:a photo absorbing layer comprising a doped semiconductor exhibiting a valence band energy and a conducting band energy during operation of the photo-detector;a contact layer comprising a p-type doped semiconductor exhibiting a valence band energy and a conducting band energy during operation of the photo-detector;a barrier layer comprising a charge carrier compensated semiconductor, the barrier layer having an energy band gap and associated conduction and valence band energies, the barrier layer being compensated by doping impurities such that it exhibits a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting a significant band gap in relation to the conduction band of the photo absorbing layer, a first side of the barrier layer adjacent a first side of the photo absorbing layer, and the contact layer being adjacent a second side of the barrier layer opposing the first side;wherein the relationship between the photo absorbing layer ...

INTEGRATED SUBSTRATE TEMPERATURE MEASUREMENT ON HIGH TEMPERATURE CERAMIC HEATER

Embodiments described herein include integrated systems used to directly monitor a substrate temperature during a plasma enhanced deposition process and methods related thereto. In one embodiment, a substrate support assembly includes a support shaft, a substrate support disposed on the support shaft, and a substrate temperature monitoring system for measuring a temperature of a substrate to be disposed on the substrate support. The substrate temperature monitoring system includes a optical fiber tube, a light guide coupled to the optical fiber tube, and a cooling assembly disposed about a junction of the optical fiber tube and the light guide. Herein, at least a portion of the light guide is disposed in an opening extending through the support shaft and into the substrate support and the cooling assembly maintains the optical fiber tube at a temperature of less than about 100° C. during substrate processing. 1. A method of processing a substrate , comprising:positioning a substrate on a substrate receiving surface of a substrate support assembly disposed in a processing volume of a processing chamber;measuring a temperature of the substrate using an optical fiber tube, wherein the temperature of the substrate exceeds about 110° C.;maintaining the optical fiber tube at a temperature of temperature less than about 100° C.; anddepositing a material layer on the substrate.2. The method of claim 1 , wherein the temperature of the substrate exceeds about 250° C.3. The method of claim 1 , further comprising:flowing one or more processing gases into the processing volume; andforming a plasma of the one or more processing gases.4. The method of claim 3 , further comprising monitoring the measured substrate temperature and changing one or more processing conditions responsive to determining that the substrate temperature exceeds a threshold value.5. The method of claim 1 , wherein the substrate support assembly comprises:a support shaft;a substrate support disposed on the ...

INFRARED CAMERA

An infrared camera includes a lens unit including a lens and a lens barrel, a heater that is provided at the lens unit and heats the lens, an infrared image sensor that captures an image using infrared light focused by the lens, a chassis that is fixed to an external surface side of the lens barrel while being thermally insulated from the lens unit and contains the infrared image sensor, and a light-blocking member that is located between the lens barrel and the infrared image sensor inside the chassis as viewed in a direction of an optical axis of the lens and blocks infrared light radiated toward the infrared image sensor and coming without passing through the lens, thus reducing the influence of infrared light coming without passing through the lens on capturing of an image. 1. An infrared camera comprising:a lens unit including a lens that focuses infrared light and a lens barrel that holds the lens;a heater that is provided at the lens unit and heats the lens;an infrared image sensor that captures an image using infrared light focused by the lens;a chassis that is fixed to an external surface side of the lens barrel while being thermally insulated from the lens unit and contains the infrared image sensor; anda light-blocking member that is located between the lens barrel and the infrared image sensor inside the chassis as viewed in a direction of an optical axis of the lens and blocks infrared light radiated toward the infrared image sensor and coming without passing through the lens.2. The infrared camera according to claim 1 , wherein the light-blocking member blocks infrared light radiated from the lens barrel and the chassis.3. The infrared camera according to claim 1 , wherein the chassis is made from a heat-insulating member.4. The infrared camera according to claim 1 , wherein the chassis is made from a heat-conducting member claim 1 , and is mounted at the external surface side of the lens barrel via a heat-insulating member.5. The infrared camera ...

DETECTING DEVICE

A device for detecting at least one thermographic image including a thermal camera sensitive to infrared radiation for acquiring the thermographic image; a protective case, inside which the thermal camera is inserted, having a window through which the thermal camera is able to acquire the thermographic image; a screen, positioned outside the protective case and movable between a first operating position at which it is superposed on the window to protect it from environmental disturbances and a second operating position wherein it is shifted from the window, allowing the thermal camera to acquire the thermographic image; a pneumatic system for supplying air inside the protective case having an inlet outside the protective case; a computerised command and control unit; the pneumatic system includes means for adjusting and distributing the air operating inside the protective case and in communication with the external inlet controlled by the computerised command and control unit. 1. A detecting device of at least a thermographic image , comprisinga thermal camera sensitive to infrared radiation for acquiring the thermographic image;a protective case internally of which the thermal camera is inserted,the protective case exhibiting a window through which the thermal camera is able to acquire the thermographic image,the device comprisinga screen arranged externally of the protective case and mobile between a first operating position in which it is superposed on the window so as to protect it from environmental disturbances and a second operating position in which it is shifted from the window so as to enable the thermal camera to acquire the thermographic image,a pneumatic air supply system internally of the protective case having an inlet that is external of the protective case,wherein the pneumatic system comprises adjusting and distributing means of the air operatively active internally of the protective case and in communication with the external inlet, the means for ...

COOLING DEVICE INTENDED TO EQUIP AN INFRARED VISION DEVICE WITH A DEFORMABLE ELEMENT

The present invention relates to a cooling device () comprising: —a housing (); —a crank () rotationally movable relative to the housing (); —a piston (); —a coupling component () rotationally mounted on the crank (), the coupling component () having a first edge () facing the piston () and a second edge () opposite the first edge (); —a deformable element () integrated in the coupling component () and integrated in the piston (), the deformable element () being configured to translationally move the piston () relative to the housing while deforming, when the crank () is rotated relative to the housing (), the deformable element () being integrated in the second edge () of the coupling component (). 1. cooling device comprising:a casing,a crank movable in rotation relative to the casing,a piston,a coupling member mounted in rotation on the crank, the coupling member having a first edge facing the piston and a second edge opposite the first edge,a deformable element embedded in the coupling member and embedded in the piston, the deformable element being configured to move the piston in translation relative to the casing while deforming, when the crank is rotated relative to the casing,the cooling device characterized in that the deformable element is embedded in the second edge of the coupling member, and in that the deformable element comprises:a first portion extending along the second edge of the member parallel to an axis of rotation of the crank,a second portion lengthening the first portion and extending toward the piston,a third portion lengthening the second portion and extending parallel to the axis of rotation of the crank, so that the three portions form a U overlapping the coupling member.2. The cooling device according to claim 1 , wherein the deformable element has a shape adapted to bypass the coupling member without touching the first edge during the rotation of the crank relative to the casing.3. The cooling device according to any claim 1 , wherein ...

WARM FILTER CONFIGURATION FOR REDUCING EFFECTS OF REFLECTED INFRARED RADIATION SYSTEMS AND METHODS

Various techniques are disclosed to reduce the effect of reflected infrared radiation on cooled thermal imaging systems. In one example, a system includes an integrated dewar cooler assembly (IDCA) configured to maintain an interior volume at a constant temperature. The system also includes a thermal imager disposed within the interior volume and configured to capture thermal images. The system also includes an optical element external to the IDCA and configured to provide reflected infrared radiation in a uniform distribution over a field of view of the thermal imager in response to emitted infrared radiation from the thermal imager. Additional methods, devices, and systems are also provided. 1. A system comprising:an integrated dewar cooler assembly (IDCA) configured to maintain an interior volume at a constant temperature;a thermal imager disposed within the interior volume and configured to capture thermal images; andan optical element external to the IDCA and configured to provide reflected infrared radiation in a uniform distribution over a field of view of the thermal imager in response to emitted infrared radiation from the thermal imager.2. The system of claim 1 , wherein the distribution of the reflected infrared radiation reduces a narcissus reflection of the thermal imager in the thermal images.3. The system of claim 1 , wherein:the optical element comprises a curved concave surface configured to reflect the emitted infrared radiation to provide the reflected infrared radiation in the uniform distribution;the optical element is a curved filter configured to pass filtered infrared radiation from an external scene to the thermal imager to be captured in the thermal images; andthe filter is configured to be selectively replaced to pass different filtered infrared radiation corresponding to different wavelength ranges.4. The system of claim 3 , wherein the curved concave surface exhibits a spherical contour.5. The system of claim 3 , wherein:the filter ...

Device and Method For Process Control For Surfaces With A Low, Unknown, And/Or Variable Emissivity

Devices and corresponding methods can be provided to monitor or measure temperature of a target or to control a process. Targets can have low, unknown, or variable emissivity. Devices and corresponding methods can be used to measure temperatures of thin film, partially transparent, or opaque targets, as well as targets not filling a sensor's field of view. Temperature measurements can be made independent of emissivity of a target surface by, for example, inserting a target between a thermopile sensor and a background surface maintained at substantially the same temperature as the thermopile sensor. In embodiment devices and methods, a sensor temperature can be controlled to match a target temperature by minimizing or zeroing a net heat flux at the sensor, as derived from a sensor output signal. Alternatively, a target temperature can be controlled to minimize the heat flux. 1. A device for process control , the device comprising:a radiation sensor configured to be set to a control temperature; anda web target configured to be viewed by the radiation sensor as the web target passes the radiation sensor and to be thermally controlled to minimize a net heat flux at the radiation sensor.2. The device of claim 1 , wherein the control temperature is less than about 200° C.3. The device of claim 1 , wherein the web target is a thin film target.4. The device of claim 1 , wherein the web target is partially transparent.5. The device of claim 1 , wherein the target has an emissivity that is low claim 1 , unknown claim 1 , or variable.6. The device of claim 1 , further comprising a background surface filling a field of view of the radiation sensor in a background behind the target claim 1 , and wherein at least a portion of the background surface within the field of view has high reflectivity in an infrared spectrum.7. The device of claim 1 , further comprising a background surface filling a field of view of the radiation sensor in a background behind the target claim 1 , and ...

Hyper-Spectral and Hyper-Spatial Search, Track and Recognition Sensor

A hyper-spectral and hyper-spatial sensor system is disclosed. A micro-channel plate array imaging sensor is provided for imaging a scene of interest and cooperates with a passive imaging system which may comprise a system having a responsivity to the visible electromagnetic spectrum. Image data from the dual-sensor systems is received and processed at high processing speeds using a massively parallel image processing architecture for the detection of salient scene features in the scene.

SUSPENDED-MEMBRANE THERMAL DETECTOR COMPRISING A DEFORMABLE ABSORBER

A thermal detector including a three-dimensional structure adapted for detecting electromagnetic radiation, suspended above and thermally insulated from a substrate, including a membrane and an absorber, the latter being formed on the basis of a shape-memory alloy and being adapted to have a flat detection configuration when its temperature is less than or equal to Tand a cooling curve configuration when its temperature is above an austenite start temperature A. 111-. (canceled)13. The thermal detector according to claim 12 , wherein the shape-memory alloy has a volume fraction χof the martensitic phase claim 12 , and has the flat detection configuration when the volume fraction χis greater than or equal to 0.95 claim 12 , and has the cooling curve configuration when the volume fraction χis less than 0.95.14. The thermal detector according to claim 12 , wherein the shape-memory alloy has a volume fraction χof the martensitic phase claim 12 , and has a volume fraction χless than or equal to 0.05 when its temperature is greater than or equal to an austenite finish temperature A claim 12 , said austenite finish temperature Abeing below a predetermined threshold temperature Tfor protection of the thermometric transducer.15. The thermal detector according to claim 12 , wherein the deformable absorber comprises a fixed part resting in contact with the membrane claim 12 , and a free part configured to deform as a function of the temperature of the deformable absorber and extending from the fixed part and spaced from the membrane.16. The thermal detector according to claim 12 , wherein the shape-memory alloy is a metal alloy based on NiTi.17. The thermal detector according to claim 12 , wherein the shape-memory alloy is a metal alloy selected from TiNiHfwith x>50 at % claim 12 , TiNiZrwith x>49 at % claim 12 , TiNiZrCuCowith x>10 at % claim 12 , TiNiPtwith x<25 at % claim 12 , TiNiPd claim 12 , TiNiCu claim 12 , TiNiCuwith x>7.5 at % claim 12 , or an alloy based on ...

LEVEL SHIFT CIRCUIT AND DRIVE CIRCUIT

A level shift circuit includes: an electrothermal converter converting a first electric signal with a first reference potential as a reference to heat; a thermoelectric converter converting the heat from the electrothermal converter to a second electric signal with a second reference potential which is different from the first reference potential as a reference; and an insulating region electrically insulating the electrothermal converter from the thermoelectric converter. 1. A level shift circuit comprising:an electrothermal converter converting a first electric signal with a first reference potential as a reference to heat;a thermoelectric converter converting the heat from the electrothermal converter to a second electric signal with a second reference potential which is different from the first reference potential as a reference; andan insulating region electrically insulating the electrothermal converter from the thermoelectric converter.2. The level shift circuit according to claim 1 , wherein the electrothermal converter claim 1 , the thermoelectric converter and the insulating region are provided in a single chip.3. The level shift circuit according to claim 2 , wherein the electrothermal converter and the thermoelectric converter are respectively provided in two semiconductor regions insulated from each other by the insulating region.4. The level shift circuit according to claim 2 , wherein one of the electrothermal converter and the thermoelectric converter is provided in a semiconductor region claim 2 , the other one is provided in a laminated region on the semiconductor region claim 2 , and the semiconductor region and the laminated region are insulated from each other by the insulating region.5. A drive circuit driving a switching device claim 2 , comprising:a primary-side circuit outputting the first electric signal in accordance with an input signal;{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the level shift circuit according to ; and'}a ...

INFRARED SENSOR AND METHOD FOR COOLING BOLOMETER INFRARED RAY RECEIVER OF INFRARED SENSOR

An infrared sensor comprises a base substrate including a recess, a bolometer infrared ray receiver, and a Peltier device. The bolometer infrared ray receiver comprises a resistance variable layer, a bolometer first beam, and a bolometer second beam. The Peltier device comprises a Peltier first beam formed of a p-type semiconductor material and a Peltier second beam formed of an n-type semiconductor material. The Peltier device is in contact with a back surface of the bolometer infrared ray receiver. One end of each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam is connected to the base substrate. The bolometer infrared ray receiver and the Peltier device are suspended above the base substrate. Each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam has a phononic crystal structure including a plurality of through holes arranged regularly. 1. An infrared sensor comprising:a base substrate including a recess;a bolometer infrared ray receiver; anda Peltier device, wherein a resistance variable layer in which resistance varies upon absorption of an infrared ray,', 'a bolometer first beam electrically connected to the resistance variable layer, and', 'a bolometer second beam electrically connected to the resistance variable layer,, 'the bolometer infrared ray receiver comprises'}the Peltier device is interposed between the bolometer infrared ray receiver and the recess,a front surface of the bolometer infrared ray receiver is irradiated with the infrared ray,the Peltier device comprises a Peltier first beam formed of a p-type semiconductor material, and a Peltier second beam formed of an n-type semiconductor material,the Peltier device is in contact with a back surface of the bolometer infrared ray receiver,one end of the bolometer first beam, one end of the bolometer second beam, one end of the Peltier first beam, and one end of the Peltier second beam ...

MEASURING PROBE HEAD

A measuring probe head having a housing, which defines a receiving space and at least one coolant fluid supply channel fluidically connected thereto, and at least one sensor which is received, or is capable of being received, in the receiving space, wherein at least one partial region of the housing enclosing the receiving space has a porosity which defines a plurality of coolant fluid passage openings. 19.-. (canceled)10. A measuring-probe head , comprising:a housing, which defines an accommodating space and at least one cooling-fluid feed channel fluidically connected thereto, andat least one sensor, which is or can be accommodated in the accommodating space,wherein at least one sub-region which forms part of the housing, and encloses the accommodating space, has a porosity which defines a multiplicity of cooling-fluid through-passage openings, wherein the porosity-containing sub-region of the housing is produced by additive manufacturing.11. The measuring-probe head as claimed in claim 10 ,wherein the porosity of the sub-region of the housing is formed by a three-dimensional lattice structure.12. The measuring-probe head as claimed in claim 10 ,wherein at least the porosity-containing sub-region of the housing is produced from a metallic material.13. The measuring-probe head as claimed in claim 10 ,wherein the housing has at least two housing parts, which are connected to one another and of which one housing part forms the porosity-containing sub-region.14. The measuring-probe head as claimed in claim 10 ,wherein the pores have a pore size ranging from 50 μm to 3 mm.15. The measuring-probe head as claimed in claim 10 ,wherein cables of the at least one sensor are guided through the at least one cooling-fluid feed channel.16. A measuring method for sensing at least one measured value claim 10 , comprising:{'claim-ref': {'@idref': 'CLM-00010', 'claim 10'}, 'arranging the measuring-probe head as claimed in in a region of a turbomachine which has a working medium ...

COOLING SYSTEMS FOR IMAGING DEVICES

An imaging assembly includes a base member defining an expansion chamber therein, the base member defining a gas inlet for receiving a compressed gas and a gas outlet for expelling expanded gas, and a focal plane array assembly mounted to the base member including a sensor and a lens. 1. An imaging assembly , comprising:a base member defining an expansion chamber therein, the base member defining a gas inlet for receiving a compressed gas and a gas outlet for expelling expanded gas; anda focal plane array assembly mounted to the base member including a sensor and a lens.2. The imaging assembly of claim 1 , wherein the gas inlet defines a canister receiver for receiving a neck portion of a gas canister.3. The imaging assembly of claim 2 , wherein the gas inlet includes a neck extending from the expansion chamber to the canister receiver.4. The imaging assembly of claim 1 , wherein the gas outlet includes a plurality of outlet holes defined in a side of the base member.5. The imaging assembly of claim 4 , wherein the plurality of outlet holes are defined on an opposite side of the base member relative to the gas inlet.6. The imaging assembly of claim 1 , wherein the base member includes internal webbing disposed within the expansion chamber for defining a gas expansion path.7. The imaging assembly of claim 6 , wherein the internal webbing defines an alternating path that routes expanding gas between opposing boundaries of the expansion chamber to maximize travel time through the base member.8. The imaging assembly of claim 1 , wherein the base member includes at least one through hole for receiving a port of the focal plane array assembly.9. A system claim 1 , comprising: a base member defining an expansion chamber therein, the base member defining a gas inlet for receiving a compressed gas and a gas outlet for expelling expanded gas wherein the gas inlet defines a canister receiver for receiving a neck portion of a gas canister; and', 'a focal plane array assembly ...

INFRARED SENSOR AND METHOD FOR COOLING BOLOMETER INFRARED RAY RECEIVER OF INFRARED SENSOR

An infrared sensor comprises a base substrate including a recess, a bolometer infrared ray receiver, and a Peltier device. The bolometer infrared ray receiver comprises a resistance variable layer, a bolometer first beam, and a bolometer second beam. The Peltier device comprises a Peltier first beam formed of a p-type semiconductor material and a Peltier second beam formed of an n-type semiconductor material. The Peltier device is in contact with a back surface of the bolometer infrared ray receiver. One end of each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam is connected to the base substrate. The bolometer infrared ray receiver and the Peltier device are suspended above the base substrate. Each of the bolometer first beam, the bolometer second beam, the Peltier first beam, and the Peltier second beam has a phononic crystal structure including a plurality of through holes arranged regularly. 1. An infrared sensor comprising:a base substrate including a recess;a thermopile infrared ray receiver; anda Peltier device, wherein an infrared ray absorption layer,', 'a thermopile first beam thermally connected to the infrared ray absorption layer and formed of a first p-type semiconductor material, and', 'a thermopile second beam thermally connected to the infrared ray absorption layer and formed of first n-type semiconductor material,, 'the thermopile infrared ray receiver comprises'}the Peltier device is interposed between the thermopile infrared ray receiver and the recess,a front surface of the bolometer infrared ray receiver is irradiated with the infrared ray,the Peltier device comprises a Peltier first beam formed of a second p-type semiconductor material and a Peltier second beam formed of a second n-type semiconductor material,the Peltier device is in contact with a back surface of the thermopile infrared ray receiver,one end of the thermopile first beam, one end of the thermopile second beam, one end ...

IMAGING DEVICE WITH SHUTTERLESS NON-UNIFORMITY CORRECTION

An imaging device including a focal plane array and capable of providing non-uniformity correction (NUC) without using a shutter outside the focal plane array. In one example, the imaging device includes a focal plane array that comprises an array of pixels arranged in rows and columns, the array of pixels corresponding to an imaging area of the focal plane array, the plurality of pixels including a first plurality of imaging pixels and a second plurality of reference pixels. The first plurality of imaging pixels are configured to receive incident electromagnetic radiation from a viewed scene and provide image signals, and the second plurality of reference pixels are shielded from receiving the incident electromagnetic radiation and are configured to produce non-uniformity correction signals. 1. An imaging device comprising:a focal plane array comprising an array of pixels arranged in rows and columns, the array of pixels corresponding to an imaging area of the focal plane array, the plurality of pixels including a first plurality of imaging pixels and a second plurality of reference pixels;wherein the first plurality of imaging pixels are configured to receive incident electromagnetic radiation from a viewed scene and provide image signals; andwherein the second plurality of reference pixels are shielded from receiving the incident electromagnetic radiation and are configured to produce non-uniformity correction signals.2. The imaging device of claim 1 , further comprising optics configured to focus the incident electromagnetic radiation onto the imaging area of the focal plane array.3. The imaging device of claim 2 , wherein the optics includes a lens having an f/#=1.4. The imaging device of claim 1 , further comprising a substrate claim 1 , wherein the focal plane array is disposed over the substrate.5. The imaging device of claim 4 , wherein the substrate is a ceramic substrate.6. The imaging device of claim 4 , further comprising a thermocooler positioned ...

INFRARED IMAGING DEVICE

An infra-red imaging device comprising: a cryostat (), an infra-red detector () arranged inside the cryostat () to receive an optical signal coming from outside the imaging device, a linear polarizer configured to polarize the optical signal along a variable direction of polarization, before the optical signal reaches the infra-red detector (), the linear polarizer comprising: a first polarizing element () arranged outside the cryostat () and movable in rotation with respect to the cryostat (), and a second polarizing element () arranged inside the cryostat () between the first polarizing element () and the infra-red detector ()and fixed with respect to the cryostat (). 19-. (canceled)10. An infra-red imaging device comprising:a cryostat,an infra-red detector arranged inside the cryostat to receive an optical signal coming from outside the infra-red imaging device, a first polarizing element arranged outside the cryostat and movable in rotation with respect to the cryostat, and', 'a second polarizing element arranged inside the cryostat between the first polarizing element and the infra-red detector and fixed with respect to the cryostat., 'a linear polarizer configured to polarize the optical signal along a variable direction of polarization, before the optical signal reaches the infra-red detector, wherein the linear polarizer comprises11. The device according to claim 10 , wherein the first polarizing element is a half-wave plate.12. The device according to claim 10 , wherein the first polarizing element is movable in rotation with respect to the cryostat about an axis perpendicular to an incident surface of the infra-red detector through which the infra-red detector receives the optical signal.13. The device according to claim 10 , wherein the second polarizing element is at a distance from the infra-red detector.14. The device according to claim 10 , wherein the second polarizing element is attached to an incident surface of the infra-red detector.15. The ...

CRYOCOOLER CONTROLLER SYSTEMS AND METHODS

Techniques are disclosed for systems and methods to control operation of a cryocooler/refrigeration system to provide cryogenic and/or general cooling of a device or sensor system. A cryocooler controller includes a motor driver controller configured to generate motor driver control signals based on operational parameters corresponding to operation of a cryocooler controlled by the controller, and a motor driver configured to generate corresponding drive signals to drive a motor of the cryocooler. The motor driver includes a first stage with a first pair of switches coupled serially between an input of the motor driver and a ground of the motor driver, a second pair of switches coupled serially between an output of the first stage and the ground of the motor driver, and an inductor coupled between the first and second pairs of switches, where operation of each switch is independently controlled by the motor driver control signals. 1. A cryocooler controller comprising:a motor driver controller configured to receive operational parameters corresponding to operation of a cryocooler controlled by the cryocooler controller and generate motor driver control signals based, at least in part, on the received operational parameters; and the motor driver comprises a first stage comprising a first pair of switches coupled serially between an input of the motor driver and a ground of the motor driver, a second pair of switches coupled serially between an output of the first stage and the ground of the motor driver, and an inductor coupled between the first and second pairs of switches, and', 'operation of each switch of the first and second pairs of switches is independently controlled by the motor driver control signals generated by the motor driver controller., 'a motor driver configured to receive the motor driver control signals from the motor driver controller and generate drive signals based, at least in part, on the motor driver control signals, to drive a motor of the ...

INFRARED ABSORPTIVE MATERIAL, INFRARED SENSOR, WAVELENGTH SELECTIVE LIGHT SOURCE, AND RADIATION COOLING SYSTEM

Provided is an infrared absorptive material having a high refractive index layer that has a refractive index of 3.0 or higher for infrared light at any wavelength in the wavelength range of 2 μm to 50 μm and has a thickness of 8 nm to 15,000 nm; and a reflective layer positioned on one face of the high refractive index layer. 1. An infrared absorptive material comprising:a high refractive index layer having a refractive index of 3.0 or higher for infrared light at a wavelength of 2 μm to 50 μm and having a thickness of 8 nm to 15,000 nm; anda reflective layer positioned on one face of the high refractive index layer.3. The infrared absorptive material according to claim 2 ,wherein m=0.4. The infrared absorptive material according to claim 1 ,wherein the high refractive index layer contains a binder and flat metal particles, the value obtainable by dividing an average particle size of the flat metal particles by an average thickness is 5 or greater, principal planes of the flat metal particles are planarly oriented in a range of 0° to 30° with respect to a surface of the high refractive index layer, a volume fraction of the flat metal particles in the high refractive index layer is 30% by volume or more, and the flat metal particles are laminated in two or more layers.5. The infrared absorptive material according to claim 4 ,wherein the flat metal particles are randomly arranged in a surface direction of the high refractive index layer.6. The infrared absorptive material according to claim 4 ,wherein the flat metal particles contain at least silver.7. The infrared absorptive material according to claim 4 ,wherein the shape of the principal planes of the flat metal particles is a polygonal shape such as a hexagonal shape or higher polygonal shape, or a circular shape.8. The infrared absorptive material according to claim 1 ,wherein the refractive index of the high refractive index layer for infrared light at a wavelength of 2 μm to 50 μm is 5.0 to 30.9. An infrared ...

DUAL-BAND PASSIVELY ATHERMAL OPTICAL LENS SYSTEM

An optical lens system for focusing light on a focal plane for detection by a detector device. The optical lens system comprises a series of optical materials including first and last optical materials with a plurality of other optical materials located therebetween. A housing accommodates the series of optical materials, and each of the optical materials is spaced a desired distance from one another. An external entrance pupil supplies infrared light to the series of optical materials of the optical lens system, and the entrance pupil is located in front of the first optical material. A Dewar window and a filter are located between the last optical material and the focal plane. The optical materials are selected and arranged to focus simultaneously both mid-wave infrared light and long-wave infrared light on the focal plane over a wide temperature range. 1. An optical system comprising:at least one beam of infrared light;an external entrance pupil for infrared light to be shown through;a transparent formed material through which the at least one beam of infrared light travels;a series of optical materials spaced at varying distances from one another;a Dewar window; anda filter.2. The optical system according to claim 1 , wherein the at least one beam of infrared light passes through the series of optical materials claim 1 , the optical materials shaped in varying thicknesses and varying curvature claim 1 , the infrared light refracting through the transparent formed material claim 1 , optical materials claim 1 , and the filter resulting in varying wavelengths of light appearing on the focal plane.3. An optical lens system for receiving light claim 1 , via an entrance pupil claim 1 , and focusing light on a focal plane for detection by a detector device claim 1 , the optical lens system comprising:a series of optical materials comprising a first optical material and a last optical material with a plurality of other optical materials located between the first optical ...

OPTICAL APPARATUS AND SIGHT TUBE FOR INSPECTING TURBINE ENGINE COMPONENTS

An apparatus for insertion through an opening in an outer casing of a gas turbine engine and inspection of internal turbine components at elevated temperatures having an optical sight tube configured to optically communicate with an interior of gas turbine engine via a distal end disposed at the interior and a proximal end disposed exterior of the internal turbine components and defined by a first longitudinal wall, at least one lens at the distal end of the optical sight tube adjacent to the longitudinal wall; and at least one longitudinal cooling groove in the longitudinal wall for flowing a cooling medium from a location external to the turbine to cool the optical sight tube at a location at least adjacent the distal end. 1. An apparatus for insertion through an opening in an outer casing of a turbine engine and inspection of internal turbine components at elevated temperatures comprising:an optical sight tube configured to optically communicate with an interior of gas turbine engine via a distal end disposed at the interior and a proximal end disposed exterior of the internal turbine components and defined by a first longitudinal wall;at least one lens at the distal end of the optical sight tube adjacent to the longitudinal wall; andat least one longitudinal cooling groove in the longitudinal wall for flowing a cooling medium from a location external to the turbine to cool the optical sight tube at a location at least adjacent the distal end.2. The apparatus of further comprising a plurality of holes in the longitudinal wall adjacent the lens to direct cooling medium from the at least one groove toward the lens to purge the lens.3. The apparatus of comprising a plurality of longitudinal cooling grooves.4. The apparatus of comprising a plurality of grooves in the at least one lens.5. The apparatus of further comprising a second longitudinal wall concentric to the first longitudinal wall.6. The apparatus of wherein the at least one longitudinal cooling groove is a ...

FLEXIBLE PRINTED CIRCUIT HAVING A LOW EMISSIVITY

A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks. 19-. (canceled)10. Flexible printed circuit comprising:first and second electric connectors; anda flexible central portion extending between the first and second electric connectors and comprising electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second electric connectors, wherein the flexible central portion is at least partly covered with a heat shield made of a material having an emissivity smaller than the emissivity of the polymer material and the emissivity of the electrically-conductive tracks.11. Flexible printed circuit according to claim 10 , wherein the material of the heat shield has an emissivity smaller than 0.05.12. Flexible printed circuit according to claim 10 , wherein the heat shield has a thickness in the range from 50 to 200 nm.13. Flexible printed circuit according to claim 10 , wherein the flexible central portion comprises a first and a second opposite main faces claim 10 , each covered with a heat shield.14. Flexible printed circuit according to claim 10 , wherein the material of the heat shield is electrically conductive.15. Flexible printed circuit according to claim 14 , wherein the material of the heat shield is selected from among gold claim 14 , silver claim 14 , copper claim 14 , and tungsten.16. Flexible printed circuit according to claim 14 , comprising an electric interconnection between one of the conductive tracks and the heat shield.17. Infrared detector comprising a hot source claim 10 , a cold source ...

TEMPERATURE SENSOR FOR A HIGH SPEED ROTATING MACHINE

Infra-red sensors are often used in turbo molecular pumps to detect the temperature of the rotor or other mechanical parts and therefore indicate imminent, or potential, running failures. 1. A method of measuring the initial emissivity , E , of a surface and comparing it with an expected emissivity , E , using an infrared temperature sensor system , the system comprising an infrared temperature sensor directed at the surface to be measured and a heater , located proximate to the infrared sensor , for heating the sensor , the method comprising the steps of:i. raising the temperature of the heater to heat the infrared sensor without significantly heating the surface;{'sub': 'G', 'ii. measuring the voltage generated, V, by heating the infrared sensor;'}{'sub': 'E', 'iii. comparing the voltage generated by the infrared sensor with an expected voltage, V; and'}{'sub': I', 'I', 'E', 'G', 'E, 'iv. calculating the initial emissivity of the surface, E, according to the equation E=E(V/V).'}2. A method of testing the operational status of an infrared sensor system , the system comprising an infrared sensor; and a heater , located proximate to the infrared sensor , for heating the infrared sensor; said method comprising the steps of:i. directing the infrared sensor at a surface of an object external to the infrared sensor, the surface having an emissivity E;ii. raising the temperature of the heater to heat the infrared sensor without significantly heating the object surface;{'sub': 'G', 'iii. measuring the voltage generated, V, by heating the infrared sensor; and'}{'sub': 'E', 'iv. comparing the voltage generated by the infrared sensor with an expected voltage, V.'}3. The method of testing the operational status of an infrared sensor system according to ; wherein said method comprises the additional step of:{'sub': G', 'E, 'v. if Vdoes not substantially equal Vdetermining that the infrared system is not at ideal operational status.'}4. The method of testing the operational ...

INFRARED (IR) PHOTON-SENSITIVE SPECTROMICROSCOPY IN A CRYOGENIC ENVIRONMENT

A system designed to suppress thermal radiation background and to allow IR single-photon sensitive spectromicroscopy of small samples by using both absorption, reflection, and emission/luminescence measurements. The system in one embodiment includes: a light source; a plurality of cold mirrors configured to direct light along a beam path; a cold or warm sample holder in the beam path; windows of sample holder (or whole sample holder) are transparent in a spectral region of interest, so they do not emit thermal radiation in the same spectral region of interest; a cold monochromator or other cold spectral device configured to direct a selected fraction of light onto a cold detector; a system of cold apertures and shields positioned along the beam path to prevent unwanted thermal radiation from arriving at the cold monochromator and/or the detector; a plurality of optical, IR and microwave filters positioned along the beam path and configured to adjust a spectral composition of light incident upon the sample under investigation and/or on the detector; a refrigerator configured to maintain the detector at a temperature below 1.0K; and an enclosure configured to: thermally insulate the light source, the plurality of mirrors, the sample holder, the cold monochromator and the refrigerator. 1. A photon-sensitive infrared (IR) spectromicroscopy system , comprising:a light source;a plurality of cold mirrors configured to direct light emitted from the light source along a beam path;a cold or warm sample holder positioned in the beam path and having portions transparent in at least the spectral range of interest, so light in the spectral range of interest is not absorbed and not emitted by portions;a spectral device configured to direct a selected wavelength of light, polarization of light, and/or plurality thereof onto a detector;a plurality of cold apertures and a plurality of shields positioned along the beam path, the cold apertures and shields being configured to prevent ...

COLD STAGE ACTUATION OF OPTICAL ELEMENTS

A cold stage actuation system employs an optical assembly having an adapter ring mounted to a flange connected to a cold finger which extends into a dewar. The flange supports a detector array. A resilient cold shield extends from the adapter ring to a lens holder, the lens holder connected to the resilient cold shield distal from the adapter ring. The lens holder supports a lenslet array. An optical light shield extends from the lens holder oppositely from the resilient cold shield to proximate a window in the dewar. A motor is supported within the dewar. An insulating translation arm connects the motor to the optical light shield, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis. 1. A cold stage actuation system comprising: an adapter ring mounted to a flange connected to a cold finger extending into a dewar, the flange supporting a detector array;', 'a resilient cold shield extending from the adapter ring to a lens holder supported by the cold-shield, said cold shield transmitting thermal energy from the cold finger;', 'said lens holder connected to the resilient cold shield distal from the adapter ring, said lens holder supporting a lenslet array wherein the cold-shield acts as a path to cool the lenslet array;, 'an optical assembly having'}a motor;an insulating translation arm connected to the motor and connected to the lens holder, whereby operation of the motor induces the insulating translation arm to extend or retract the optical assembly concentric with an optical axis.2. The cold stage actuation system of further comprising:an optical light shield extending from the lens holder oppositely from the resilient cold shield to proximate a window in the dewar, the optical light shield conductively cooled by the cold finger through the resilient cold shield, said insulating translation arm connected through the optical light shield to the lens holder3. The cold stage ...

Ir sensor system, ir sensor module, temperature detection module and corresponding calibration method

An IR sensor system, an IR sensor module, a temperature detection module and a corresponding calibration method are provided. The IR sensor system has an IR sensor module including a pixelated IR detection area, which has a first control unit for controlling an IR measuring operation and a calibration operation, and a storage unit connected to it, and including a temperature detection module which is detectable in a pixel subarea of the IR detection area, the temperature detection module having a temperature sensor device and a second control unit connected to it. The geometric position of the pixel subarea on the IR detection area is storable in the storage unit.

Method For Temperature Measurements Of Surfaces With A Low, Unknown And/Or Variable Emissivity

Devices and corresponding methods can be provided to monitor or measure temperature of a target or to control a process. Targets can have low, unknown, or variable emissivity. Devices and corresponding methods can be used to measure temperatures of thin film, partially transparent, or opaque targets, as well as targets not filling a sensor's field of view. Temperature measurements can be made independent of emissivity of a target surface by, for example, inserting a target between a thermopile sensor and a background surface maintained at substantially the same temperature as the thermopile sensor. In embodiment devices and methods, a sensor temperature can be controlled to match a target temperature by minimizing or zeroing a net heat flux at the sensor, as derived from a sensor output signal. Alternatively, a target temperature can be controlled to minimize the heat flux. 1. A method of monitoring a temperature of a target , the method comprising:viewing a target with a radiation sensor, the target being situated between the radiation sensor and a closed background surface filling a field of view of the radiation sensor, the background surface and the radiation sensor being maintained at substantially the same temperature; andadjusting a relative temperature between the radiation sensor and the target to minimize a net heat flux at the radiation sensor.2. The method of claim 1 , wherein the substantially the same temperature is less than about 200° C.3. The method of claim 1 , wherein viewing the target comprises viewing a thin film target.4. The method of claim 1 , wherein viewing the target comprises viewing a partially transparent target.5. The method of claim 1 , wherein viewing the target comprises viewing an opaque target.6. The method of claim 1 , further comprising employing a high-reflectivity portion of the background surface within the field of view to increase thermal radiation at the radiation sensor.7. The method of claim 1 , further comprising ...

RUGGEDIZED DEWAR UNIT FOR INTEGRATED DEWAR DETECTOR ASSEMBLY

An Integrated Dewar Detector Assembly (IDDA) is presented. The IDDA comprises: a cold finger base; an elongated Dewar envelope having a proximal end associated with the cold finger base and a distal end comprising an optical window; an elongated tubular cold finger located inside said elongated Dewar envelope and having a proximal end at the cold finger base and a distal end for carrying a detector so as to expose the detector to incoming radiation through said optical window; an internal front support member extending from an inner surface of the Dewar envelope at its distal end to the distal end of the cold finger; and at least one wideband dynamic vibration absorber assembly located outside the Dewar envelope and attached to at least one location on an exterior surface of the Dewar envelope, said dynamic vibration absorber thereby attenuating vibration of the cold finger and the detector. 1. An Integrated Dewar Detector Assembly (IDDA) , comprising:a cold finger base;an elongated Dewar envelope having a proximal end associated with the cold finger base and a distal end comprising an optical window;an elongated tubular cold finger located inside said elongated Dewar envelope and having a proximal end at the cold finger base and a distal end for carrying a detector so as to expose the detector to incoming radiation through said optical window;an internal front support member extending from an inner surface of the elongated Dewar envelope at the distal end thereof to the distal end of the cold finger; andat least one wideband dynamic vibration absorber assembly located outside the elongated Dewar envelope and attached to at least one location on an exterior surface of the elongated Dewar envelope, said at least one dynamic vibration absorber thereby attenuating vibration of the elongated tubular cold finger and the detector.2. The IDDA according to claim 1 , wherein the at least one wideband dynamic absorber is configured as a heavily damped mass-spring mechanical ...

INFRARED TEMPERATURE MEASUREMENT AND STABILIZATION THEREOF

Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. An overmolded sensor assembly may include an IR sensor, which may include a sensing element or IR element and a circuit or signal processor. The IR element may be thermally bonded with a frame or conductive top hat. 1. An infrared (IR) temperature monitoring system , comprising:a sensor assembly encased by an overmolding material, the overmolded sensor assembly having an open end and closed end, the sensor assembly comprising:an IR temperature sensor having a sensor housing which encases an IR element, wherein the overmolding material encases the IR temperature sensor and the sensor housing; anda metallic frame, wherein the metallic frame encompasses a transmissive window in the closed end of the sensor assembly, wherein the metallic frame provides a stable temperature around the transmissive window.2. The system of claim 1 , wherein the IR element is positioned on a signal processor.3. The system of claim 1 , wherein the metallic frame is a conductive top hat.4. The system of claim 1 , wherein the overmolding material is plastic.5. The system of claim 1 , wherein the metallic frame is formed of copper claim 1 , aluminum claim 1 , or other thermally conductive material.6. The system of claim 1 , wherein the sensor housing is formed of plastic that acts as a lens arranged at one end of the IR element and a baseplate mounted to the other end of the IR element.7. The system of claim 1 , comprising one or more glass fillers that hermetically seal one or more leads traversing through a baseplate of the IR element.8. A method for infrared (IR) temperature monitoring claim 1 , comprising:encasing an IR element of an IR temperature sensor with a sensor housing;encasing the IR temperature sensor and the sensor housing ...

PHOTONIC- AND PHONONIC-STRUCTURED PIXEL FOR ELECTROMAGNETIC RADIATION AND DETECTION

A thermal pixel configured as an electromagnetic emitter and/or an electromagnetic detector. The thermal pixel comprises a micro-platform suspended with semiconductor nanowires from a surrounding support platform. The nanowires comprise phononic structure providing a decrease in thermal conductivity. In some embodiments, the pixel is structured for operation within a broad bandwidth or a limited bandwidth. Metamaterial and/or photonic crystal filters provide pixel operation over a limited bandwidth. In some other embodiments, the micro-platform comprises a nanotube structure providing a broadband emission/absorption spectral response. 1. An electromagnetic thermal pixel (ETP) including photonic structure and phononic structure , the ETP comprising:a substrate having a substantially planar surface;a cavity formed from the substrate;a thermal micro-platform disposed within the cavity and suspended from the substrate by a plurality of nanowires; wherein,the phononic structure comprises:(i) a first layer of semiconductor disposed within at least one of the nanowires of the plurality, the first layer providing electrical conductivity;(ii) a phononic scattering structure and/or phononic resonant structure providing a reduction in thermal conductivity;the photonic structure comprises:(i) photonic nonresonant structure and/or photonic resonant structure providing emissivity and/or absorptivity of electromagnetic radiation within a range of one or more of visible, NIR, MWIR, LWIR, and millimeter wavelengths, andwherein the ETP further comprises at least one of a temperature sensor, a resistive heater, an infrared radiation source, a Peltier cooler, and a self-cooling micro-refrigerator.2. The ETP of wherein the ETP is disposed in an array of ETPs.3. The ETP of wherein the phononic scattering structure comprises scattering sites separated by distances less than a mean-free-path of heat-conducting phonons.4. The ETP of comprising porous silicon.5. The ETP of wherein the ...

THERMAL DETECTOR ARRAY CONFIGURED TO DETECT THERMAL RADIATION FROM THE INTEGRATED CIRCUIT

An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing. 12-. (canceled)3. An apparatus comprising:an integrated circuit substrate;an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;a thermal detector array substrate;a thermal detector array configured to detect thermal radiation from the integrated circuit, wherein the thermal detector array is disposed on a bottom surface of the thermal detector array substrate; andone or more spacers disposed on the top surface of the integrated circuit substrate;wherein the one or more spacers are disposed between the top surface of the integrated circuit substrate and the bottom surface of the thermal detector array substrate.4. The apparatus of claim 3 , wherein a distance between a top surface of the integrated circuit and a bottom surface of the thermal detector array is within a range of distances between twenty micrometers and one-thousand micrometers.5. An apparatus comprising:an integrated circuit substrate;an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;a thermal detector array substrate;a thermal detector array configured to detect thermal radiation from the integrated circuit; andone or more conductive couplings disposed between the integrated circuit substrate and the thermal detector array substrate;wherein the one or more conductive couplings are configured to conduct a thermal detection signal from the thermal detector array substrate to the integrated circuit substrate, ...

RADIATION SHIELD FOR NEAR-INFRARED DETECTORS

A radiation shield for near-infrared detectors of the type used in Raman spectroscopic systems comprises a chamber enclosing the detector and a cooling device in thermal contact with the chamber and the detector to reduce the level of unwanted radiation to which the detector would otherwise be exposed. The chamber may include a window in optical alignment with the detector, and the window may include one or more coatings to pass wavelengths in a range of interest or block radiation at wavelengths outside of this range. The shield may be enclosed in an evacuated dewar having a window which may also include one or more coatings to favor the wavelength range. 1. A radiation shield for a near-infrared detector , comprising:a chamber including an aperture and a near-infrared detector having at least one detector element, the chamber composed of a thermally conductive material, the detector disposed within the chamber and opposite the aperture; anda cooling device in thermal contact with the chamber and structured to lower the temperature of the chamber to reduce the emission from the chamber of unwanted radiation incident upon the detector,wherein the aperture is sized relative to a distance from the detector to an optic of a spectrograph such that only a desired solid angle is incident upon the detector, enabling the detector to receive electromagnetic signals in a desired spatial range from the spectrograph and attenuating non-signal bearing electromagnetic radiation from incidence upon the detector.2. The radiation shield of claim 1 , wherein in the desired operational wavelength range is 0.4 to 2.5 microns claim 1 , and the electromagnetic signals are Raman signals.3. The radiation shield of claim 1 , the radiation shield further comprising a window covering the aperture in the chamber claim 1 , wherein the window is composed of glass claim 1 , glass-ceramic claim 1 , diamond claim 1 , crystalline quartz claim 1 , silicon claim 1 , germanium claim 1 , gallium nitride ...

Infrared focal plane array heat spreaders

In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

DIAGNOSTIC CLOSED CYCLE COOLER CONTROLLERS AND SYSTEMS

A dewar cooler control module can include a cooldown module configured to receive sensor signals from one or more temperature sensors of an imaging assembly having a dewar cooler system, receive a time from a clock module, and determine a cooldown time to a predetermined temperature to output a cooldown time, wherein the cooldown module is configured to output the cooldown time for determining a health of the dewar cooler system and/or component thereof. The cooldown module can be configured to send a command to a cooler of the dewar cooler system to cause the cooler to provide maximum cooling to a dewar of the dewar cooler system. 1. A dewar cooler control module , comprising: receive sensor signals from one or more temperature sensors of an imaging assembly having a dewar cooler system;', 'receive a time from a clock module; and', 'determine a cooldown time to a predetermined temperature to output a cooldown time, wherein the cooldown module is configured to output the cooldown time for determining a health of the dewar cooler system and/or component thereof., 'a cooldown module configured to2. The control module of claim 1 , wherein the cooldown module is configured to send a command to a cooler of the dewar cooler system to cause the cooler to provide maximum cooling to a dewar of the dewar cooler system.3. The control module of claim 2 , wherein the cooldown module is configured to control a power supply of the dewar cooler system.4. The control module of claim 1 , further comprising a health monitoring module configured to receive cooldown time from the cooldown module and to determine a health of the dewar cooler system as a function of cooldown time.5. The control module of claim 1 , further comprising a vibration monitoring module configured to receive vibration sensor signals from one or more vibration sensors in one or more locations of the imaging assembly.6. The control module of claim 4 , further comprising a health monitoring module configured to ...

SYSTEM FOR DETECTING ELECTROMAGNETIC RADIATION

An electromagnetic-radiation detection system is equipped with an electromagnetic-radiation sensor, which has a plurality of detectors sensitive to electromagnetic radiation, allowing images composed of pixels to be obtained, each pixel being represented by at least one value issuing from at least one detector of the sensor. These sensors should generally be cooled. Because of dispersion of the individual responses of each detector of a sensor, each detector of said sensor is calibrated for gain and offset value. A calibration of a detector includes acquiring at least two values issuing from said detector in order to estimate a gain and an offset value to be applied to the values issuing from said detector. A bandpass electromagnetic-radiation filter may have a predefined transmission coefficient in said system in order to vary the electromagnetic radiation reaching said sensor and thus to obtain, for each detector, the two values necessary for implementing calibration. 1. An electromagnetic-radiation detection system comprising:a casing defining an enclosure in which a partial vacuum prevails, comprising a window transparent to said electromagnetic radiation;a cold finger having a side wall closed at one end by an end wall situated in line with the window;a sensor, mounted on the end wall, having a flat top surface disposed facing the window comprising detectors sensitive to electromagnetic radiation and cooled by the cold finger, said sensor defining an optical axis perpendicular to the flat top surface and centred with respect thereto;a cold screen surrounding the sensor, substantially in the form of a dome, mounted on the cold finger and generated by rotation about the optical axis, and comprising a top end, disposed between the window and the sensor, defining a circular-shaped diaphragm centred on the optical axis and a side wall connecting a base of the cold screen to the top end having an internal face with its concavity turned towards the optical axis;at ...

DIRECT MOUNTING OF FILTERS OR OTHER OPTICAL COMPONENTS TO OPTICAL DETECTORS USING FLEXURES

An apparatus includes an optical detector configured to detect at least a portion of incoming radiation. The apparatus also includes an optical component configured to provide at least the portion of the incoming radiation to the optical detector. The apparatus further includes at least one flexure that mounts the optical component to the optical detector. Each flexure is configured to deform in response to expansion or contraction of at least one of the optical component and the optical detector. Each flexure may include a side surface that is flexible in a first dimension and rigid in second and third dimensions, where the dimensions are orthogonal to each other. The optical component may include at least one of a filter, a lens, a polarizer, an aperture, and a cover. 1. An apparatus comprising:an optical detector configured to detect at least a portion of incoming radiation;an optical component configured to provide at least the portion of the incoming radiation to the optical detector; andat least one flexure that is coupled to the optical component and the optical detector and that mounts the optical component to the optical detector, each flexure configured to deform laterally in response to lateral expansion or contraction of at least one of the optical component and the optical detector.2. The apparatus of claim 1 , wherein each flexure is further configured to transfer heat from the optical component to the optical detector.3. The apparatus of claim 1 , wherein:the apparatus comprises multiple flexures; anddifferent flexures are coupled to different sides of the optical detector and to different sides of the optical component.4. The apparatus of claim 1 , wherein each flexure comprises:a side surface that is flexible in a first dimension and rigid in second and third dimensions, the dimensions being orthogonal to each other; andarms projecting from the side surface, the arms configured to contact the optical component and the optical detector.5. The ...

Device for measuring temperature of turbine wheel in turbocharger and engine control method using temperature measurement device for turbine wheel

A device for measuring temperature of a turbine wheel in a turbocharger includes: a guide that passes infrared ray generated from the turbine wheel and includes a coolant path; a protection unit that protects an optical head which senses the infrared ray; and a signal processing unit that measures a temperature of the turbine wheel by processing a signal corresponding to the sensed infrared ray.

WELDING SYSTEMS HAVING NON-CONTACT TEMPERATURE MEASUREMENT SYSTEMS

Welding systems including welding torch assemblies are provided. The welding torch assembly may include a welding torch adapted to be utilized in a welding operation to establish a welding arc between the welding torch and a workpiece. Shielding gas may be supplied to the welding torch for establishment of a gas shielding area around a weld pool. The welding torch assembly may also include a temperature sensing system having a non-contact temperature sensor coupled to the welding torch and adapted to sense a temperature of the workpiece at a location outside of the molten weld pool. 1. A welding system , comprising:a welding torch configured to be utilized in a welding operation to establish a welding arc between the welding torch and a workpiece;a temperature sensing system comprising a temperature sensor coupled to the welding torch and configured to sense a temperature of the workpiece, wherein the temperature sensing system is configured to be adjusted between multiple positions to position the temperature sensor in a variety of configurations with respect to the welding torch.2. The welding system of claim 1 , wherein the temperature sensing system is configured to be manually adjusted by an operator into the multiple positions.3. The welding system of claim 1 , wherein the temperature sensing system is coupled to the welding torch via an adjustable gooseneck configured to be manually adjusted by an operator.4. The welding system of claim 1 , wherein the temperature sensor comprises a non-contact temperature sensor.5. The welding system of claim 4 , wherein the non-contact temperature sensor comprises a radiation thermometer configured to detect infrared radiation from the workpiece and to determine the temperature of the workpiece based on the detected infrared radiation.6. The welding system of claim 5 , wherein the radiation thermometer comprises a sensor configured to convert the detected infrared radiation into a digital or analog signal corresponding to ...

MICROBOLOMETER AND METHOD OF MANUFACTURING

A microbolometer for measuring thermal radiation comprises an electrical circuit on a perforated plastic substrate. The electrical circuit comprises at least one thermistor having a temperature dependent electric resistance, wherein the thermistor is arranged to receive the thermal radiation for changing its temperature depending on a flux of the received thermal radiation. The electrical circuit is configured to measure the electric resistance of the thermistor for calculating the thermal radiation. The microbolometer is configured to cause a gas flow through the perforations for improving thermal characteristics. 1. A microbolometer for measuring thermal radiation the microbolometer comprising an electrical circuit , wherein the electrical circuit comprises:at least one thermistor having a temperature dependent electric resistance, wherein the at least one thermistor is arranged to receive the thermal radiation for changing its temperature depending on the received thermal radiation;at least one pair of electrodes;a plastic substrate; anda pump,wherein the at least one thermistor is electrically connected into the electrical circuit via the at least one pair of electrodes,wherein the electrical circuit is configured to measure the temperature dependent electric resistance of the at least one thermistor via the at least one pair of electrodes for calculating the thermal radiation;wherein the at least one thermistor and at least a sub-length of the at least one pair of electrodes are disposed on the plastic substrate,wherein the plastic substrate comprises one or more perforations there through, andwherein the pump is configured to cause a gas flow through the one or more perforations during and or in between measuring the temperature dependent electric resistance of the at least one thermistor via the electrodes for calculating the thermal radiation.2. The microbolometer according to claim 1 , wherein the at least one thermistor comprises a plurality of thermistors ...

THERMO-MECHANICAL FATIGUE SYSTEM FOR STATIC COMPONENTS

According to an aspect of this disclosure, a system of applying thermal loads may include at least one laser module, and a plurality of optical components fixed to the at least one laser module and directing a plurality of laser beams from the plurality of optical components towards a surface. Further, the plurality of laser beams apply radiative heating to the surface in accordance with the system. The system also includes at least one infrared camera measuring thermal conditions of the surface, and a controller coordinating operation of the at least one laser module and the at least one infrared camera. 1. A system of applying thermal loads , comprising:at least one laser module; 'wherein the plurality of laser beams apply radiative heating to the surface;', 'a plurality of optical components fixed to the at least one laser module and directing a plurality of laser beams from the plurality of optical components towards a surface;'}at least one infrared camera measuring thermal conditions of the surface; anda controller coordinating operation of the at least one laser module and the at least one infrared camera.2. The system of claim 1 , wherein the controller turns off the at least one laser module when the at least one infrared camera measures the thermal conditions of the surface.3. The system of claim 2 , wherein the surface is on a component of a gas turbine engine and thermal conditions of the surface are cycled.4. The system of claim 1 , wherein the plurality of optical components direct the plurality of laser beams towards the surface according to a pattern mapped across the surface.5. The system of claim 4 , wherein the pattern is a three-dimensional pattern of loci on the surface.6. The system of claim 5 , wherein the three-dimensional pattern of loci on the surface corresponds to the plurality of laser beams.7. The system of claim 6 , wherein a plurality of optical waveguides correspond to the plurality of optical components; andwherein the plurality of ...

Thermal ranging devices and methods

An embodiment of a device is disclosed. The device includes a lens, operative in the infrared, configured to receive an image of a field of view of the lens, a microlens array, operative in the infrared, optically coupled to the lens and configured to create an array of light field images based on the image, a photodetector array comprising a plurality of non-silicon photodetectors, photosensitive in at least part of the thermal spectrum from 3 microns to 14 microns, the photodetector array being optically coupled to the microlens array and configured to generate output signals from the non-silicon photodetectors based on the array of light field images, and a read-out integrated circuit (ROIC) communicatively coupled to the photodetector array and configured to receive the signals from the photodetector array, convert them to digital signals and to output digital data.

INTEGRATED TEMPERATURE SENSOR ON LEAD SELENIDE PLATE DETECTOR ASSEMBLY

An improved infrared-based gas detector apparatus is described in which a substantial improvement in temperature measurement and tracking accuracy is achieved by combining a temperature sensing element such as a Thermistor to the body of a Lead Selenide (PbSe) plate detector. This allows for as close to possible measurement of the actual Lead Selenide film temperature without coming directly in physical contact with the film surface itself. 1. An infrared radiation detector with integrated temperature sensor comprising:a substrate;an infrared radiation sensitive film layer disposed on the substrate, the film layer having two ends;a conductive electrode disposed on one end of the film layer;a conductive ground electrode disposed on the other end of the film layer;a temperature sensor disposed in electrical and thermal communication with the conductive ground electrode;an electrical IR detector signal lead disposed in electrical communication with the conductive electrode andan electrical temperature signal lead disposed in electrical communication with the temperature sensor.2. The infrared radiation detector of claim 1 , wherein the infrared radiation sensitive film layer comprises a lead selenide (PbSe) film layer.3. The infrared radiation detector of claim 1 , further comprising:a current source disposed in electrical communication with the temperature sensor, wherein the temperature sensor is a thermistor.4. The infrared radiation detector of claim 1 , wherein the substrate is quartz.5. The infrared radiation detector of claim 1 , wherein the electrode and the ground electrode are gold plated claim 1 , and further wherein the temperature sensor is a chip thermistor having a conductive pad disposed in electrical contact with the ground electrode and a second conductive pad connected to the electrical temperature signal lead claim 1 , such that the chip thermistor is disposed between the ground electrode and the electrical temperature signal lead.6. The infrared ...

THERMAL MARKING SYSTEMS AND METHODS OF CONTROL

A target marking system includes a light source emitting a thermal beam and an optics assembly directing the thermal beam to impact a target, the target directing radiation to the optics assembly in response to the impact. The target marking system further includes a detector, and an optics assembly optically connected to the detector. 1. A target marking system , comprising:a plurality of light sources, each light source of the plurality of light sources configured to generate a respective beam of thermal radiation; andan optics assembly configured to form an emitted beam from the respective beams and to direct the emitted beam toward the target.2. The system of claim 1 , wherein the light sources comprise quantum cascade lasers.3. The system of claim 1 , wherein each of the respective beams of thermal radiation have a different wavelength.4. The system of claim 1 , wherein each of the respective beams of thermal radiation have a different polarization.5. The system of claim 1 , wherein the emitted beam comprises each of the respective beams of thermal radiation aligned collinearly.6. The system of claim 1 , wherein the optics assembly comprises a wavelength beam combiner arranged optically downstream from a collimating lens and a mirror.7. The system of claim 1 , wherein emitted beam comprises each of the respective beams of thermal radiation arranged noncollinearly and overlapping upon impinging the target.8. The system of claim 1 , wherein the optics assembly comprises a first polarization beam combiner optically downstream from a first collimating lens.9. The system of claim 8 , further comprising a second polarization beam combiner optically downstream from a second collimating lens; the first polarization beam combiner directing an output beam to the second polarization beam combiner.10. The system of claim 1 , wherein the optics assembly comprises a diffraction grating optically downstream from a plurality of collimating lens claim 1 , the diffraction ...

INFRARED DEVICE

An infrared device comprises a substrate (), and arranged on or in the substrate () a configuration () for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration () comprising a pattern made from an electrically conducting material on a first level (L), an electrically conducting film () on a second level (L), and a dielectric layer () between the pattern and the film (). One or more of a heater () for heating the configuration (), and a thermal sensor () arranged for sensing the selective infrared radiation of the band absorbed by the configuration () on or in the substrate. 1. Infrared device , comprisinga substrate,a recess in the substrate,a membrane spanning at least a portion of the recess, andsupported by the substrate:a configuration for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration being arranged on or in the membrane and comprising: a pattern made from an electrically conducting material on a first level; an electrically conducting film on a second level; and a dielectric layer between the pattern and the film; andone or more of a heater arranged for heating the configuration to emit the infrared radiation of the band, and a thermal sensor arranged for sensing the selective infrared radiation of the band absorbed by the configuration,whereinthe heater if available, and/or the thermal sensor if available are/is arranged on or in the membrane,the film at least extends over an area of the second level that is defined by a projection of the pattern and gaps in the pattern onto the second level, anda thickness of the dielectric layer between the pattern and the film is less than a center wavelength of the band.231- (canceled)32. The infrared device according to claim 1 , wherein said configuration and said one or more of the heater and the thermal sensor form part of a CMOS-compatible layer stack that is supported by the substrate.33. The infrared device ...

THERMAL PATTERN SENSOR

A thermal pattern sensor comprising a plurality of pixels, each pixel comprising at least one pyroelectric capacitor formed by at least one portion of pyroelectric material arranged between a lower electrode and an upper electrode, in which one of the lower and upper electrodes corresponds to an electrode for reading the pixel and in which a heating element that can heat the portion of pyroelectric material of the pyroelectric capacitor of the pixel by Joule effect during a measurement of the thermal pattern by the pyroelectric capacitor of the pixel is formed by the other of the lower and upper electrodes. 114-. (canceled)15. A thermal pattern sensor comprising a plurality of pixels , each pixel comprising at least one pyroelectric capacitance formed by at least one portion of pyroelectric material arranged between a lower electrode and an upper electrode , in which one of the lower and upper electrodes corresponds to an electrode for reading the pixel and in which a heating element that can heat the portion of pyroelectric material of the pyroelectric capacitance of said pixel by Joule effect during a measurement of the thermal pattern by the pyroelectric capacitance of said pixel is formed by the other of the lower and upper electrodes.16. The thermal pattern sensor according to claim 15 , in which the pyroelectric material comprises PVDF and/or P(VDF-TrFE) and/or PZT.17. The thermal pattern sensor according to claim 15 , further comprising a substrate on which are arranged the pyroelectric capacitances of the pixels claim 15 , the lower electrode of the pyroelectric capacitance of each pixel being arranged between the substrate and the portion of pyroelectric material of the pyroelectric capacitance of the pixel claim 15 , and in which the upper electrode of the pyroelectric capacitance of each pixel forms the heating element of said pixel.18. The thermal pattern sensor according to claim 15 , in which the electrodes of the pyroelectric capacitances of the ...

UNRELEASED THERMOPILE INFRARED SENSOR USING MATERIAL TRANSFER METHOD

An unreleased thermopile IR sensor and method of fabrication is provided which includes a new thermally isolating material and an ultra-thin material based sensor which, in combination, provide excellent sensitivity without requiring a released membrane structure. The sensor is fabricated using a wafer transfer technique in which a substrate assembly comprising the substrate and new thermally isolating material is bonded to a carrier substrate assembly comprising a carrier substrate and the ultra-thin material, followed by removal of the carrier substrate. As such, temperature restrictions of the various materials are overcome. 1. An unreleased thermopile infrared sensor comprising:a substrate having a bottom surface and a top surface;a thermally isolating material disposed on at least a portion of the top surface of the substrate, the thermally isolating material having a bottom surface and a top surface; andan ultra-thin material disposed on at least a portion of the top surface of the thermally isolating material;wherein the thermally isolating material is stable at temperatures up to 450° C., andwherein the ultra-thin material is selected from materials having a thickness of less than or equal to 200 nm, and are deposited by methods requiring a heightened temperature of greater than 450° C.2. The unreleased thermopile infrared sensor of claim 1 , wherein the thermally isolating material is selected from Parylene claim 1 , benzocyclobutene (BCB) claim 1 , amorphous fluoropolymers claim 1 , poly(methyl methacrylate) claim 1 , SU-8 photo-resists claim 1 , and other polymers.3. The unreleased thermopile infrared sensor of claim 1 , wherein the ultra-thin material is selected from 2D materials.4. The unreleased thermopile infrared sensor of claim 3 , wherein the ultra-thin material is selected from the group consisting of graphene claim 3 , MoS claim 3 , SnSe claim 3 , black phosphorus (BP) claim 3 , thin poly-silicon claim 3 , SiGe (silicon germanium) claim 3 , Ge ( ...

INFRARED TEMPERATURE-MEASUREMENT PROBE

An infrared temperature-measurement probe, including: a probe housing; a reflector; and a reflector adjusting mechanism. The probe housing includes an inner wall, an outer wall, a cooling channel sandwiched between the inner wall and the outer wall, a chamber surrounded by the inner wall, and a light transmission hole communicating with the chamber. The reflector includes a mirror and a mirror frame. The reflector adjusting mechanism includes a motion controller, a drive coupling, and three control rods. The reflector and the three control rods are disposed in the chamber of the probe housing. The motion controller is disposed outside the chamber of the probe housing. The drive coupling is disposed between the motion controller and the three control rods, and the motion controller is adapted to move each of the three control rods via the drive coupling. The mirror is imbedded in and is supported by the mirror frame. 1. An infrared temperature-measurement probe , the probe comprising:a probe housing, the probe housing comprising an inner wall, an outer wall, a cooling channel sandwiched between the inner wall and the outer wall, a chamber surrounded by the inner wall, and a light transmission hole communicating with the chamber;a reflector, the reflector comprising a mirror and a mirror frame;a reflector adjusting mechanism, the reflector adjusting mechanism comprising a motion controller, a drive coupling, and three control rods;wherein:the reflector and the three control rods are disposed in the chamber of the probe housing;the motion controller is disposed outside the chamber of the probe housing;the drive coupling is disposed between the motion controller and the three control rods, and the motion controller is adapted to move each of the three control rods via the drive coupling;each of the three control rods is movable;the mirror is imbedded in and supported by the mirror frame;the mirror frame comprises ball joints, and the three control rods are connected to ...

STRUCTURALLY REINFORCED COMPOSITE COLD SHIELD FOR USE IN INFRARED SENSORS OR OTHER DEVICES

An apparatus includes a top surface configured to couple to a variable aperture mechanism (VAM), where the top surface has an opening configured to align with an aperture of the VAM. The apparatus also includes a bottom portion configured to couple to a cooled object and a contact portion configured to couple to a strut, where the top surface, bottom portion, and contact portion form a continuous body. The apparatus further includes a plurality of baffles within the continuous body, where each of the baffles has an opening configured to align with the aperture of the VAM. In addition, the apparatus includes a reinforcement ring comprised in or within the continuous body and disposed to be aligned with the strut when the strut is coupled to the continuous body. 1. A method comprising:forming a support member having a disc encased by a support ring;positioning the support member within a mandrel such that the support member is disposed to align with a strut position, the strut position comprising a location to couple to a strut member; andforming a cold shield by electroplating metal over the mandrel and a portion of the support member.2. The method of claim 1 , wherein forming the support member comprises electroplating a second metal different from the first metal to form the disc and the support ring.3. The method of claim 1 , further comprising:dissolving the mandrel.4. The method of claim 1 , wherein the cold shield comprises a continuous body.5. The method of claim 1 , wherein the mandrel is configured to form a plurality of baffles.6. The method of claim 5 , wherein the support member comprises a baffle disposed within the plurality of baffles.7. The method of claim 5 , wherein forming the cold shield comprises electroplating the metal to form each of the plurality of baffles.8. A system comprising:an infrared detector;one or more strut members; anda cold shield coupled to the infrared detector and to each of the one or more strut members, the cold shield ...

System and Method for Monitoring Hot Glass Containers to Enhance Their Quality and Control the Forming Process

A system and method are disclosed for monitoring hot glass containers at the hot end as they stream from an I.S. machine manufacturing them to enable their quality to be monitored, enhanced, and controlled. The system monitors radiation from the hot glass containers, extracts images of each hot glass container, analyzes the images of the hot glass containers, and provides the images of the hot glass containers together with information indicative of the quality thereof to a display screen viewable by an operator to enable the quick identification of glass forming process deviations and to occasion continuous improvements in glass container quality. The system and method are independent of conditions and parameters that have hampered previously known attempts to monitor hot glass containers, and make possible the production of glass containers of both high quality and substantially increased consistency.

BOLOMETER AND METHOD FOR MANUFACTURING SAME

An object of the present invention is to provide a bolometer having a high TCR value and a low resistance, and a method for manufacturing the same.

TEMPERATURE MONITORING

In some examples, an array sensor temperature control system is provided. The system may include an array sensor for generating a two-dimensional image, the two-dimensional image including a plurality of pixels or cells indicative of a temperature of a monitored component; a controller for controlling a heating or cooling device to adjust the temperature of the monitored component; and an array sensor controller activated by a power source and being in communication with the array sensor and controller. 1. A temperature control system comprising:an array sensor to generate a two-dimensional image, the two-dimensional image including a plurality of pixels indicative of a temperature of a component;a controller to control a heating or cooling device to adjust the temperature of the component; andan array sensor controller activated by a power source and in communication with the array sensor and controller.2. The system of claim 1 , wherein the two-dimensional image includes a representation of the component.3. The system of claim 2 , wherein the two-dimensional image includes one or more zones.4. The system of claim 3 , wherein the component is one of a plurality of components; andwherein each zone of the one or more zones corresponds to a component in the plurality of monitored components.5. The system of claim 3 , wherein each zone of the one or more zones includes pixels associated with a specific component represented in each zone.6. The system of claim 3 , wherein each zone of the one or more zones includes pixels associated with a specific component in a specific thermal area of a zone.7. The system of claim 4 , wherein the one or more zones are associated with a size claim 4 , area claim 4 , or location of the component in the plurality of components.8. The system of claim 3 , wherein a zone of the one or more zones is associated with the controller.9. The system of claim 8 , wherein the component is one of a plurality of components; andwherein the controller ...

Temperature measuring method of combustion chamber in coke oven

Infrared camera and method for reading alternations in respective resistance of passive radiation-sensitive units

FIELD: optical instruments. SUBSTANCE: device has focal-plane matrix of temperature-sensitive elements in vacuum unit with inexpensive thermoelectric temperature stabilization. Stabilization temperature is chosen by designer or by user. Preferably, stabilization temperature is expected to be room temperature. Temperature-sensitive elements are passive. Reading method involves scanning matrix by bias current shaped as short- duration high-level pulses. EFFECT: increased sensitivity. 18 cl, 6 dwg Ээ9дрстс ПЧ ГЭ РОССИЙСКОЕ АГЕНТСТВО ПО ПАТЕНТАМ И ТОВАРНЫМ ЗНАКАМ (19) (51) МПК 13) ВИ "” 2 121 766. Н 04 М 5/33 СЛ 12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ РОССИЙСКОЙ ФЕДЕРАЦИИ (21), (22) Заявка: 94046326/09, 15.06.1993 (30) Приоритет: 19.06.1992 Ш$ 07/901.437 (46) Дата публикации: 10.11.1998 (56) Ссылки: 9$ 4163602 04.03.82. СВ 2162715, 05.02.86. ЕК 251497, 22.04.83. 5 1358110, 07.12.87. (71) Заявитель: Ханивелл Инк. (1$) (72) Изобретатель: Р.Эндрю Вуд (1$) (73) Патентообладатель: Ханивелл Инк. (0$) (54) ИНФРАКРАСНАЯ КАМЕРА И СПОСОБ СЧИТЫВАНИЯ ИЗМЕНЕНИЙ УДЕЛЬНОГО СОПРОТИВЛЕНИЯ ПАССИВНЫХ ПРИНИМАЮЩИХ ИЗЛУЧЕНИЕ ЭЛЕМЕНТОВ (57) Реферат: Система камеры, главным образом, предназначенная для инфракрасного излучения, имеющая матрицу фокальной плоскости из элементов микроболометров в вакуумном блоке С неоднородной термоэлектрической стабилизацией температуры. Температуру стабилизации может выбирать конструктор или пользователь В широком диапазоне температур, но, главным образом, ожидается использование комнатной — температуры. Микроболометры представляют пассивные элементы, а схема считывания включает в себя развертывание матрицы током смещения в виде импульсов малой длительности С ВЫСОКИМ уровнем. Техническим результатом является повышение чувствительности. 3 с. и 15 3.п.Фф-лы, 6 ил. —00 я Фиг.1 2121766 С1 КО Ээ9дрстс ПЧ ГЭ КУЗЗАМ АСЕМСУ ГОК РАТЕМТ$ АМО ТКАОЕМАКК$ (19) ВИ "” 2 121 766. 13) СЛ (51) п. С1.6 Н 04 М 5/33 12) АВЗТКАСТ ОЕ 1МУЕМТОМ (21), (22) АррИсаНоп: 94046326109, 15.06.1993 ( ...

Automatic focus and emissivity measurements for a substrate system

An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.

Automatic focus and emissivity measurements for a substrate system

An apparatus for thermally processing a substrate includes a first radiation source configured to heat a substrate and emit radiation at a heating wavelength, focusing optics configured to direct radiation from the first radiation source to the substrate, and a second radiation source configured to emit radiation at a second wavelength different from the heating wavelength and at a lower power than the first radiation source. Radiation from the second radiation source is directed onto the substrate. The apparatus further includes a first detector configured to receive reflected radiation at the second wavelength and a computer system configured to receive an output from the first detector and adjust a focus plane of the first radiation source relative to the substrate. The second radiation source is configured to have substantially the same focus plane as the first radiation source.

Method for measuring temperature of furnace wall in coke carbonizing chamber

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Temperature compensating type photo detector

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Methods for performing inspections and detecting chemical leaks using an infrared camera system

A method of visually detecting a leak of a chemical emanating from a component. The method includes: aiming a passive infrared camera system towards the component; filtering an infrared image with an optical bandpass filter, the infrared image being that of the leak; after the infrared image passes through the lens and optical bandpass filter, receiving the filtered infrared image with an infrared sensor device; electronically processing the filtered infrared image received by the infrared sensor device to provide a visible image representing the filtered infrared image; and visually identifying the leak based on the visible image. The passive infrared camera system includes: a lens; a refrigerated portion including therein the infrared sensor device and the optical bandpass filter (located along an optical path between the lens and the infrared sensor device). At least part of a pass band for the optical bandpass filter is within an absorption band for the chemical.

Infrared sensor and radiation thermometer

Apparatus and method for recognizing motion using temperature information

온도 정보를 포함하는 열 적외선 영상과 깊이 정보를 포함하는 3차원 영상을 사용하여 사용자의 동작을 인식하는 장치 및 방법이 개시된다. 동작 인식 장치는 열 적외선 영상에서 주변 배경과 사용자 간의 온도 차를 사용하여 사용자를 검출하는 사용자 검출부; 및 3차원 영상에서 깊이 정보를 사용하여 사용자의 동작을 인식하는 동작 인식부를 포함할 수 있다. An apparatus and method for recognizing a user's motion using a thermal infrared image including temperature information and a three-dimensional image including depth information are disclosed. The gesture recognition apparatus may include: a user detector configured to detect a user using a temperature difference between a surrounding background and a user in a thermal infrared image; And a motion recognition unit that recognizes a user's motion by using depth information in the 3D image.

Method for monitoring and control of torrefaction temperature

Temperature measurement in a gasification reactor

A gasification reactor (1) for the partial combustion of a carbonaceous feed comprising a gasifier (3), and a method of measuring a temperature in a gasifier. One or more pyrometers (15) outside the gasifier are directed to a translucent leaktight viewport in a wall (8) of the gasifier. The translucent viewport may comprise a tubular body (13) bridging the gasifier wall and a pressure vessel (2) encasing the gasifier. The tubular body can be closed off with a translucent pane. The tubular body may comprise a cooling sleeve and can, e.g., be purged to prevent slag formation on the viewport.

Thermowell with infrared sensor

A thermowell assembly for measuring a process temperature includes an elongate thermowell having a proximal end and a distal end. A bore extends between the two ends with the thermowell assembly configured to extend into a process fluid. An infrared sensor detects infrared radiation from the distal end through the bore of the thermowell and responsively provides a sensor output. A configuration is provided in which infrared radiation received by the infrared sensor from a wall of the bore is reduced and or radiation received from the distal end of the bore is increased.

Apparatus for measuring temperature in a pressurized reactor

OPTICAL TEMPERATURE SENSOR.

L'invention concerne un capteur optique agencé de façon à minimiser les erreurs de mesure résultant du rayonnement thermique émis par des organes internes du capteur. Le capteur comporte une sonde tubulaire (1) dont l'extrémité avant contient un élément en saphir (24) dans une chambre de stagnation (23) où le gaz chaud à mesurer circule et chauffe un revêtement thermiquement émetteur (25) dudit élément (24). Une lentille (36) focalise le rayonnement sur une extrémité d'un câble à fibres optiques (2) logé dans l'arrière de la sonde et refroidi par de l'air comprimé circulant dans la sonde. Cet air s'échappe par un orifice (35) situé en arrière d'une barrière thermique transparente (31) qui protège l'élément en saphir (24) contre le refroidissement. Application à la mesure de température dans une turbine à gaz. The invention relates to an optical sensor arranged to minimize measurement errors resulting from thermal radiation emitted by internal components of the sensor. The sensor comprises a tubular probe (1) whose front end contains a sapphire element (24) in a stagnation chamber (23) where the hot gas to be measured circulates and heats a thermally emitting coating (25) of said element (24). ). A lens (36) focuses the radiation on one end of an optical fiber cable (2) housed in the rear of the probe and cooled by compressed air flowing through the probe. This air escapes through an orifice (35) located behind a transparent thermal barrier (31) which protects the sapphire element (24) against cooling. Application to temperature measurement in a gas turbine.

Infrared detector

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Integrating sphere with temperature control system

The present invention has been made to solve the above problems, more specifically, the hollow spherical body; A light source support having one end fixedly coupled to an upper inner side of the main body and the other end positioned at an inner central part of the main body; A light source installed at the other end of the light source support to emit light to the inner side of the main body; A temperature sensor installed at one side of the light source support to sense a temperature of an inner side of the main body; A pair of integrating sphere temperature controllers respectively installed opposite to the lower end of the inner part of the main body and controlling the inner temperature of the main body by heating or cooling air in the inner part of the main body according to the inner temperature of the main body detected by the temperature sensor; And an integrating sphere temperature control unit which is installed to face the lower end of the inner side of the main body and controls the flow of heated or cooled air through the integrating sphere temperature adjusting unit. It is done. According to the present invention as described above, by installing a temperature control means and a ventilation device in the interior of the integrating sphere made to insulate the outer surface using a heat insulator, the light source is made to change the temperature inside the integrating sphere effectively according to the ambient temperature The optical characteristics can be observed in detail, and the integrating sphere temperature control unit installed inside the integrating sphere can form a heating device and a cooling device, respectively, to effectively raise or lower the integrating sphere internal temperature above the ambient atmospheric temperature. There is an effect that can be maintained at a constant temperature by using a temperature sensor.

Infrared measurement of temperature, and its stabilisation

FIELD: measurement equipment. SUBSTANCE: invention relates to measurement equipment and can be used for temperature measurement of the object. The invention presents versions of an infrared (IR) temperature measurement system. This invention performs active stabilisation of temperature of objects nearby and on the way between an infrared (IR) sensor and the target object. In order to control the power supplied to resistive temperature transducers (RTD), a temperature meter and control that controls current force supplied to RTD is used. As a result, temperatures of objects visible in IR range can be stabilised in an active manner at changes, for example changes in environmental temperature, which leads to effective and accurate readings of temperature. EFFECT: improving accuracy of obtained data. 15 cl, 16 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 567 095 C2 (51) МПК G01J 5/00 (2006.01) G05D 23/20 (2006.01) G01D 3/028 (2006.01) G12B 7/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ (21)(22) Заявка: ИЗОБРЕТЕНИЯ К ПАТЕНТУ 2013104964/28, 07.07.2011 (24) Дата начала отсчета срока действия патента: 07.07.2011 (72) Автор(ы): МЭСТОН Роберт (US) (73) Патентообладатель(и): СВГ МЕНЕДЖМЕНТ КОРПОРЕЙШН (US) Приоритет(ы): (30) Конвенционный приоритет: R U 08.07.2010 US 61/362,623; 07.07.2011 US 13/178,077 (43) Дата публикации заявки: 20.08.2014 Бюл. № 23 (56) Список документов, цитированных в отчете о поиске: US 6921895 B1, 26.07.2005. US 20100027583 A1, 04.02.2010. US 20080224817 A1, 18.09.2008. US 20090296775 A1, 03.12.2009. US 5826982 A1, 27.10.1998. DE 10341142 A1 A1, 31.03.2005. (86) Заявка PCT: C 2 C 2 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 08.02.2013 US 2011/043188 (07.07.2011) (87) Публикация заявки PCT: 2 5 6 7 0 9 5 WO 2012/006420 (12.01.2012) R U 2 5 6 7 0 9 5 (45) Опубликовано: 27.10.2015 Бюл. № 30 Адрес для переписки: 123242, Москва, Кудринская площадь, 1, а/я 35, "Михайлюк, Сороколат и партнеры-патентные ...

Cooling device

Infrared ray detecting sensor with getter partition

An infrared ray detecting sensor having an infrared ray detecting element located in the cool chamber of a Dewar structure comprising inner and outer cylindrical members. The chamber is evacuated to vacuum level and a getter is arranged in the chamber for ensuring the vacuum level in the chamber. A partition is arranged in the chamber between the inner end of the inner cylindrical member and the getter for forming a restricted passage and allowing communication of a gas between the getter and the infrared ray detecting element and obstructing a stray ray generated upon a radiation of the getter toward the infrared ray detecting element. The restricted passage is formed such that a ray generated upon radiation of the getter is reflected many times at the restricted passage and is dampened. The partition is roughened and colored in black.

Producing and maintaining a vacuum space in an infrared detector or other device with a getter

Actively driven thermal radiation shield

A thermal radiation shield for cooled portable gamma-ray spectrometers. The thermal radiation shield is located intermediate the vacuum enclosure and detector enclosure, is actively driven, and is useful in reducing the heat load to mechanical cooler and additionally extends the lifetime of the mechanical cooler. The thermal shield is electrically-powered and is particularly useful for portable solid-state gamma-ray detectors or spectrometers that dramatically reduces the cooling power requirements. For example, the operating shield at 260K (40K below room temperature) will decrease the thermal radiation load to the detector by 50%, which makes possible portable battery operation for a mechanically cooled Ge spectrometer.

Infrared camera with thermoelectric temperature stabilization

적외선 방사선용 카메라 시스템은 값싼 열전 온도 안정장치를 갖는 진공패키지내에 마이크로보로메타 소자의 초점면 어레이를 갖는다. 안정화 온도는 넓은 온도범위에 걸쳐 설계자 또는 사용자에 의해 선택될 수 있지만, 주로 실온에서 사용된다. 마이크로보로메타는 수동소자이고, 정복판독 구조는 짧은 구간 펄스의 고레벨 바이어스 전류로 어레이의 스위프를 포함한다. Infrared radiation camera systems have an array of focal planes of microborometa elements in a vacuum package with inexpensive thermoelectric temperature stabilizers. The stabilization temperature can be selected by the designer or user over a wide temperature range, but is mainly used at room temperature. The microboromete is a passive element, and the readout structure contains the sweep of the array with a high level bias current of short duration pulses.

Veiling glare apparatus and measuring system for the function of cold shield of infrared detector using the same

이미지의 대비를 감소시키는 불필요한 빛을 발생시키는 베일링 글레어 장치의 특성을 향상시키고 또한 이를 이용하여 적외선 검출기를 냉각시키기 위한 콜드실드의 기능을 확인하는 측정 시스템을 제공한다. 그 시스템은 외부의 이미지를 전기적인 신호로 구현하는 적외선 검출기를 향하여 이미지의 대비를 감소시키는 불필요한 빛을 방출하는 베일링 글레어 장치를 포함한다. 또한 적외선 검출기를 감싸면서 적외선 검출기와 베일링 글레어 장치 사이에 배치되며, 불필요한 빛을 트랩시켜 제거하는 콜드실드를 포함한다. 베일링 글레어, 적외선 검출기, 콜드실드, 냉각부

A kind of kiln temperature measuring equipment

本发明公开了一种窑炉测温装置，包括测温碳管、碳管安装座、观孔座和红外测温仪，测温碳管、碳管安装座和观孔座相互连接且内部形成一测温通道，测温碳管的一端伸向窑炉的待测位置，另一端安装在碳管安装座上，该碳管安装座的另一端与观孔座的一端连接，观孔座的另一端安装有透镜，红外测温仪设置在透镜的一侧。本发明的窑炉测温装置可以在不打开窑炉的情况下实现炉芯的在线实时测温，通过与炉壳连接处的散热处理，将炉内高温与炉外作业环境隔离开来，通过在测温装置的末端设置向透镜倾斜的气孔，既能及时冲刷透镜表面的积尘，同时也能消除测量通道内部的烟尘，使测量通道保持透明，较好地提高了红外测温仪的测量精度。