Устройство для измерения температуры расплавленных материалов

Полезная модель устройства для измерения температуры расплавленных материалов относится к измерительной технике. Устройство для осуществления измерения температуры расплава содержит погружной зонд с огнеупорным кварцевым световодом, установленным в огнеупорную втулку, запрессованную в картонную трубку. При этом конец кварцевого световода выступает из керамической втулки на определенную длину и его кончик покрыт огнеупорным оптически не прозрачным материалом с известным коэффициентом теплового излучения. Перед измерением зонд надевается на полый металлический жезл, внутри которого расположена оптоволоконная линия, соединяющая внутренний торец световода с приемником излучения. При погружении зонда в емкость с расплавом в течение короткого времени расплав разогревает кончик кварцевого световода и его тепловое излучение через световод и оптоволоконную линию передается к приемнику излучения. Технический результат - повышение точности измерения температуры расплава различных веществ вне зависимости от их коэффициента теплового излучения. 1 ил. РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 189 043 U1 (51) МПК G01J 5/08 (2006.01) G01K 1/12 (2006.01) G01K 11/32 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ПОЛЕЗНОЙ МОДЕЛИ К ПАТЕНТУ (52) СПК G01K 1/12 (2013.01); G01K 11/32 (2013.01); G01J 5/004 (2013.01); G01J 5/0818 (2013.01); G01J 5/0821 (2013.01); G01J 5/048 (2013.01) (21) (22) Заявка: 2018127168, 24.07.2018 (24) Дата начала отсчета срока действия патента: (73) Патентообладатель(и): Забродин Александр Николаевич (RU), Гордеев Юрий Витальевич (RU) Дата регистрации: 07.05.2019 (56) Список документов, цитированных в отчете о поиске: US 9243958 B2, 26.01.2016. US 2016216162 A1, 28.07.2016. US 9671291 B2, 06.06.2017. US 5180228 A, 19.01.1993. US 8876372 B2, 04.11.2014.. (45) Опубликовано: 07.05.2019 Бюл. № 13 1 8 9 0 4 3 R U (54) Устройство для измерения температуры расплавленных материалов (57) Реферат: Полезная модель устройства для измерения ...

Infrared detector comprising a package integrating at least one diffraction grating

The infrared detector includes a sensitive retina capable of detecting a radiation in the wavelength range between 8 and 14 micrometers; and a package containing the sensitive retina and including a window located opposite to the retina, said window comprising a substrate at least partially transparent in the wavelength range between 2 and 14 micrometers; and a set of optical filters formed on the window to attenuate an incident radiation on the retina in a wavelength range between 2 and 8 micrometers, and respectively an optical filter formed on a first surface of the window and attenuating the incident radiation in a first interval of the wavelength range between 2 and 8 micrometers, and a periodic diffraction grating formed on a second surface of the window and attenuating the incident radiation in a second interval of the wavelength range between 2 and 8 micrometers, different from the first interval.

WIRE-TYPE WAVEGUIDE FOR TERAHERTZ RADIATION

In order to guide electromagnetic waves in the terahertz range over long distances of several meters with low bending losses and large bandwidth, a device, a system and a method are provided such that electromagnetic waves in the terahertz range can be coupled into a wire having a core structure and at least one confinement structure, wherein the confinement structure extends continuously along a length of the wire. 1. (Currently Amended) A device for guiding electromagnetic waves in the terahertz range , comprising:{'b': 100', '10', '21', '22, 'a wire () having a core structure () and at least one confinement structure (, ),'}{'b': 21', '22', '100', '21', '10', '22', '100', '10, 'wherein the confinement structure (, ) extends continuously along a length of the wire () and includes at least one groove () formed in the core structure () and/or at least one rib () formed along the wire () prominent from the core structure ().'}2102122100102122100100. The device according to claim 1 , wherein the core structure () and the at least one confinement structure ( claim 1 , ) of the wire () are integrally formed and/or wherein the core structure () and the at least one confinement structure ( claim 1 , ) of the wire () are made of the same material and/or wherein the wire () is a profiled wire.3102122. The device according to claim 1 , wherein the core structure () has a substantially circular cross-section and/or the confinement structure ( claim 1 , ) has a substantially triangular and/or rectangular cross-section.42122212210. The device according to any one of the preceding claims claim 1 , wherein at least one dimension of the confinement structure ( claim 1 , ) has sub-wavelength dimension and/or wherein dimensions of the confinement structure ( claim 1 , ) are smaller than the diameter of the core structure ().5102122. The device according to claim 1 , wherein the core structure () and/or the confinement structure ( claim 1 , ) is made of a conducting material claim 1 ...

SENSOR DEVICE

A sensor device has an optical waveguide containing an electro-optic crystal for propagating light, a coupler provided adjacent to the optical waveguide to propagate a terahertz wave generated from the electro-optic crystal as a result of the propagation of light in the optical waveguide, and a detector for detecting the terahertz wave propagating through the coupler or the light propagating through the optical waveguide. The terahertz wave is totally reflected in a section of the coupler opposite to a section where the coupler is adjacent to the optical waveguide while passing through and propagating in the optical waveguide, and in the total reflection section, the terahertz wave interacts with a subject placed close to the total reflection section. 1. A sensor device comprising:an optical waveguide containing an electro-optic crystal for propagating light;a coupler provided adjacent to the optical waveguide to propagate a terahertz wave generated from the electro-optic crystal as a result of propagation of light in the optical waveguide; anda detector for detecting the terahertz wave propagating through the coupler or the light propagating through the optical waveguide,wherein the terahertz wave is totally reflected in a section of the coupler opposite to a section where the coupler is adjacent to the optical waveguide while passing through and propagating in the optical waveguide, and in the total reflection section, the terahertz wave interacts with a subject placed close to the total reflection section.2. The sensor device according to claim 1 , wherein the sensor device is so designed that a terahertz wave generated from the electro-optic crystal will not interfere with a terahertz wave reflected in the total reflection section.3. The sensor device according to claim 1 , further comprising a laser for emitting a ultrashort pulse in femtoseconds as a source of light propagating in the optical waveguide.4. The sensor device according to claim 1 , wherein among ...

TERAHERTZ-WAVE ELEMENT, TERAHERTZ-WAVE DETECTING DEVICE, TERAHERTZ TIME-DOMAIN SPECTROSCOPY SYSTEM, AND TOMOGRAPHY APPARATUS

A terahertz-wave element includes a waveguide () that includes an electro-optic crystal and allows light to propagate therethrough, and a coupling member () that causes a terahertz wave to enter the waveguide (). The propagation state of the light propagating through the waveguide () changes as the terahertz wave enters the waveguide () via the coupling member (). 1. A terahertz-wave element comprising:a waveguide that includes an electro-optic crystal and allows light to propagate therethrough; anda coupling member that causes a terahertz wave to enter the waveguide,wherein a propagation state of the light propagating through the waveguide changes as the terahertz wave enters the waveguide via the coupling member,wherein the waveguide includes a core layer serving as a core for the light and a cladding layer serving as cladding for the light,wherein the cladding layer is interposed between the coupling member and the core layer, and{'sub': eq', 'eq, 'sup': '2', 'wherein a Подробнее

INFRARED THERMOMETER

The present invention relates to an infrared thermometer () able to project the detected temperature directly on the surface () of the body () to be measured. The determination of the ideal distance of the thermometer from the body, necessary for the correct detection of the temperature thereof, being visually identifiable by means of the relative position of luminous shapes () projected on the body to be measured (). 1. An infrared thermometer comprising:a casing having a control portion, a grip portion and a pointing and detection portion;at least one pointing device operatively arranged in the pointing and detection portion of the casing to emit at least two or more light beams whose projections define, on a respective destination surface of a body whose temperature is to be determined, respective luminous shapes, the pointing device being provided with an optical mechanism that causes the displacement of a luminous shape with respect to the other as a result of the approach or of the removal of the thermometer to/from the destination surface of the body to be measured between a series of search positions, each relating to an unsuitable distance for the correct detection of the temperature of the body to be measured by the infrared thermometer and at least one detection position indicative of an ideal distance for the detection of the temperature of the body to be measured by the infrared thermometer;at least one infrared temperature detector operatively arranged at the pointing and detection portion of the casing, the infrared temperature detector detecting the temperature of the destination surface of the body at least when the luminous shapes defined by the projection of the light beams on said destination surface are in the detection position;at least one programmable electronic unit arranged inside the casing and connected to at least the infrared temperature detector, the programmable electronic unit being programmed to calculate the real temperature of the ...

TERAHERTZ DETECTION ASSEMBLY AND METHODS FOR USE IN DETECTING TERAHERTZ RADIATION

A terahertz detection assembly generally has a light generating apparatus configured to generate at least one illuminating light pattern and a substrate member positioned proximate to the light generating apparatus. The substrate member includes a semiconductive portion configured to receive at least a portion of the illuminating light pattern such that a conductive path is defined within the semiconductive portion. At least one waveguide is coupled to the semiconductive portion such that the waveguide is adjacent to the conductive path. The waveguide is configured to receive at least a portion of the illuminating light pattern such that the pattern is moving along the waveguide. The waveguide is further configured to receive a plurality of terahertz electromagnetic waves that are transmitted within the waveguide in the same direction as the motion of the illuminating light pattern to facilitate the detection and characterization of the terahertz electromagnetic waves. 1. A terahertz detection assembly comprising:a light generating apparatus configured to generate at least one illuminating light pattern; and a semiconductive portion configured to receive at least a portion of the at least one illuminating light pattern such that a conductive path is defined within said semiconductive portion; and', 'at least one waveguide coupled to said semiconductive portion such that said at least one waveguide is adjacent to the conductive path, said at least one waveguide is configured to receive at least a portion of the at least one illuminating light pattern such that the at least one illuminating light pattern is moving along said at least one waveguide, said at least one waveguide is further configured to receive a plurality of terahertz electromagnetic waves that are transmitted within said at least one waveguide in the same direction as the motion of the at least one illuminating light pattern from said light generating apparatus to facilitate the detection and ...

MULTIPLEXED PATHLENGTH RESOLVED NONINVASIVE ANALYZER APPARATUS WITH NON-UNIFORM DETECTOR ARRAY AND METHOD OF USE THEREOF

A noninvasive analyzer apparatus and method of use thereof is described comprising a near-infrared source, a non-uniform detector array, and a photon transport system configured to direct photons from the source to the detector via an analyzer-sample optical interface. The non-uniform detector array provides a multitude of distinguishable optical pathlengths, couples to a plurality of optical transmission filters, couples to a plurality of light directing micro-optics, and/or couples to an array of light-emitting diodes. 1. An apparatus for noninvasively determining an analyte concentration of a subject , comprising: a near-infrared source;', 'a sample interface configured to proximately contact the subject during use; and', 'at least three detector elements positioned along a curved path, said at least three detector elements electrically linked for readout in series,', 'a non-uniform detector array, said non-uniform detector array comprising], 'a near-infrared noninvasive analyzer, comprisingwherein photons from said near-infrared source arrive at said non-uniform detector array via said sample interface.2. The apparatus of claim 1 , said non-uniform detector array further comprising:a first set of detector elements forming a first arc at a first distance from a center of said sample interface; anda second set of detector elements forming a second arc at a second distance from the center of said sample interface.3. The apparatus of claim 2 , said first arc forming a first ring of detector elements about the center of said sample interface claim 2 , said second arc forming a second ring of detector elements about the center of said sample interface.4. The apparatus of claim 2 , further comprising:a first optical filter comprising a first fifty percent transmission cut-on wavelength optically coupled to said first set of detector elements; anda second optical filter comprising a second fifty percent transmission cut-on wavelength optically coupled to said second set ...

TERAHERTZ-WAVE ELEMENT, TERAHERTZ-WAVE DETECTING DEVICE, TERAHERTZ TIME-DOMAIN SPECTROSCOPY SYSTEM, AND TOMOGRAPHY APPARATUS

A terahertz-wave element includes a waveguide () that includes an electro-optic crystal and allows light to propagate therethrough, and a coupling member () that causes a terahertz wave to enter the waveguide (). The propagation state of the light propagating through the waveguide () changes as the terahertz wave enters the waveguide () via the coupling member (). 1. A terahertz-wave detecting device comprising:a first waveguide that includes an electro-optic crystal and allows light to propagate therethrough;a second waveguide that includes an electro-optic crystal and allows light to propagate therethrough;a coupling member that causes a terahertz wave to enter the first waveguide;a detecting unit configured to detect the light propagating through the first waveguide and the light propagating through the second waveguide.3. The terahertz-wave detecting device according to claim 1 , further comprising a branch section configured to branch a waveguide into the first waveguide and the second waveguide.4. The terahertz-wave detecting device according to claim 1 , further comprising a coupler configured to couple the first waveguide and the second waveguide.5. The terahertz-wave detecting device according to claim 1 , wherein the detecting unit detects interference light between the light propagating through the first waveguide and the light propagating through the second waveguide. This application is a continuation of prior application Ser. No. 13/979,624, filed on Jul. 12, 2013, that is a national phase application of international application PCT/JP2012/050660 filed on Jan. 10, 2012 which are hereby incorporated by reference herein in their entirety. This application also claims the benefit of Japanese Patent Application No. 2011-006123 filed Jan. 14, 2011 and No. 2011-230004 filed Oct. 19, 2011, which are hereby incorporated by reference herein in their entirety.The present invention relates to terahertz-wave elements, terahertz-wave detecting devices, terahertz ...

THERMOPILE INFRARED SENSOR STRUCTURE WITH A HIGH FILLING LEVEL

Thermopile infrared sensor structure with a high filling level in a housing filled with a medium (), consisting of a carrier substrate () which has electrical connections (′) to the outside and is closed with an optical assembly (), wherein a sensor chip () is applied to the carrier substrate () in the housing, which chip has a plurality of thermoelectric sensor element structures (), the so-called “hot contacts” () of which are located on individual diaphragms () which are stretched across a respective cavity () in a silicon carrying body () with good thermal conductivity, wherein the “cold contacts” () are located on or in the vicinity of the silicon carrying body (). The problem addressed by the invention is that of specifying a thermopile infrared array sensor (sensor cell) which, with a small chip size, has a high thermal resolution and a particularly high filling level. This sensor is preferably intended to be operated in gas with a normal pressure or a reduced pressure and is intended to be able to be mass-produced in a cost-effective manner under ultra-high vacuum without complicated technologies for closing the housing. This is achieved by virtue of the fact that a radiation collector structure () is located above each individual diaphragm () of the sensor element structures () which spans a cavity (). 1. A thermopile infrared sensor structure with a high filling level in a housing filled with a medium , consisting of a baseplate , which has electrical connections to the outside and which is closed with an optical assembly , and wherein a sensor chip is applied on the baseplate in the housing , said chip carrying a plurality of thermoelectric sensor element structures , the so-called “hot contacts” of which are situated on individual membranes stretched across a respective cavity in a silicon carrying body having good thermal conductivity , wherein the “cold contacts” are situated on or in the vicinity of the silicon carrying body , characterized in that a ...

GRAPHENE-BASED INFRARED SINGLE PHOTON DETECTOR

A detector for detecting single photons of infrared radiation. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be adjacent a graphene sheet and configured so that evanescent waves from the waveguide overlap the graphene sheet. The graphene sheet has two contacts connected to an amplifier, a power detector, and a pulse detector. An infrared photon absorbed by the graphene sheet from the evanescent waves heats the graphene sheet, which increases the Johnson noise generated at the contacts. The Johnson noise is amplified and the absorption of a photon is detected by the power detector and pulse detector. 1. A photon detector comprising:a waveguide configured to guide infrared electromagnetic waves, in a mode having an evanescent field extending outside of the waveguide; to be coupled to the evanescent field; and', 'to undergo, when a photon is absorbed by the graphene sheet, an increase in temperature and a subsequent decrease in temperature, resulting in a corresponding increase in thermal noise at the two contacts and a subsequent decrease in thermal noise at the two contacts; and, 'a graphene sheet having two contacts and configureda circuit connected to the two contacts, the circuit configured to detect the increase in thermal noise.2. The photon detector of claim 1 , wherein the graphene sheet has an electron mobility of more than 100 claim 1 ,000 cm/V/s.3. The photon detector of claim 1 , wherein the graphene sheet substantially has the shape of a rectangle claim 1 , the rectangle having a length and a width claim 1 , the length being greater than or equal to the width.4. The photon detector of claim 3 , wherein the length of the rectangle is less than 20 microns.5. The photon detector of claim 3 , wherein the product of the length of the rectangle and the width of the rectangle is less than 1000 square microns.6. The photon detector of claim 3 , wherein the waveguide has a curved section claim 3 , the curved section having ...

CONTINUOUS SPECTRA TRANSMISSION PYROMETRY

An apparatus for processing substrates includes a continuum radiation source, a source manifold optically coupled to the continuum radiation source and comprising: a plurality of beam guides, each having a first end that optically couples the beam guide to the continuum radiation source; and a second end. The apparatus also includes a detector manifold to detect radiation originating from the source manifold and transmitted through a processing area, and one or more transmission pyrometers configured to analyze the source radiation and the transmitted radiation to determine an inferred temperature proximate the processing area. 1. A method comprising: heating the calibration substrate to a plurality of known temperatures; and', 'measuring a transmitted power spectrum at the known temperatures;, 'constructing a calibration curve for a calibration substrate disposed in a processing chamber by sequentiallymeasuring a test transmitted power spectrum of a test substrate at an unknown temperature; andusing the calibration curve and the test transmitted power spectrum to determine the unknown temperature.2. The method of claim 1 , wherein measuring the transmitted power spectrum at the known temperatures comprises:generating source radiation using a continuum radiation source;directing the source radiation to a receiving surface of the calibration substrate; anddetecting transmitted radiation from an emitting surface of the calibration substrate, the emitting surface being opposite of the receiving surface.3. The method of claim 2 , wherein the continuum radiation source has an emission spectrum comprising wavelengths from about 1000 nm to about 1700 nm.4. The method of claim 2 , wherein the continuum radiation source is a quantum emission source.5. The method of claim 2 , wherein directing the source radiation to the receiving surface of the calibration substrate comprises directing the source radiation through a source manifold to the receiving surface of the calibration ...

Systems and methods for thermal imaging systems

A thermal imaging system for use in maintaining a turbine assembly includes a case, a single pixel detector positioned within the case, at least one optical transportation device, and a prism. The optical transportation device is coupled to the case and configured to direct electromagnetic radiation to the single pixel detector. The prism is coupled to the optical transportation device and configured to direct electromagnetic radiation into the optical transportation device and to the single pixel detector. At least the prism and the optical transportation device are inserted into the turbine assembly and the single pixel detector acquires images of the turbine assembly.

Method and System for Measuring Radiation and Temperature Exposure of Wafers Along a Fabrication Process Line

A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. 1. A measurement wafer apparatus comprising:a wafer assembly; anda detector assembly, the detector assembly including one or more light sensors, the detector assembly configured to perform at least one of a direct measurement of the intensity of ultraviolet light from a process environment incident on at least one surface of the wafer assembly or an indirect measurement of the intensity of ultraviolet light from the process environment incident on the at least one surface of the wafer assembly.2. The apparatus of claim 1 , wherein the wafer assembly comprises:a substrate; anda cover operably coupled to a portion of the substrate.3. The apparatus of claim 1 , wherein the detector assembly includes:one or more photoluminescent elements configured to convert ultraviolet light to visible light, wherein the one or more light sensors are configured to perform an indirect measurement of the intensity of ultraviolet light incident on the one or more photoluminescent elements by measuring the intensity of visible light emitted by the one or more photoluminescent elements.4. The apparatus of claim 3 , wherein the detector assembly includes:one or more light guiding elements, wherein the one or more light guiding elements are configured to transmit visible light emitted by the one or more photoluminescence elements to the one or more light sensors.5. The apparatus of claim 1 , wherein the one or more light sensors are configured to perform a direct measurement of the intensity of ultraviolet light incident on the one or more light sensors.6. The ...

VISION ACCESSORY IN SUB-CEILING LAYER FOR AN INFRARED DETECTOR

An optical device for arrangement on a detector provided with an infrared sensor in order to modify the visual field of the detector. The device includes primary and secondary conical mirrors. The primary mirror collects the infrared radiation coming from a sub-ceiling layer around the device for returning it onto the secondary mirror which, itself, reflects it to the infrared sensor. 1. An optical device , intended to be arranged on a detector equipped with an infrared sensor in order to modify a field of view of the detector , comprising:a primary mirror of frustoconical overall shape, comprising a circular opening at its center,a secondary mirror of conical overall shape,at least one connecting means for connecting the primary mirror and the secondary mirror, so that a reflective surface of the primary mirror is arranged facing a reflective surface of the secondary mirror,the primary and secondary mirrors being designed to reflect radiation in the infrared; andthe primary and secondary mirrors being configured to define a field of view of the device, to form an afocal system and to form a continuous image of a periphery of the device, a center of the image being hidden by the secondary mirror.2. The optical device as claimed in claim 1 , wherein the angle α of the field of view of the device is comprised between 5° and 10°.3. The optical device as claimed in claim 1 , wherein the optical device consists of a single piece of injection-molded plastic claim 1 , at least the surfaces of the primary mirror and of the secondary mirror being metalized.4. The optical device as claimed in claim 1 , wherein a maximum diameter of the primary mirror is less than 100 mm claim 1 , and a height of the device in a direction of an axis of a cone defining the reflective surface of the primary mirror is less than 40 mm.5. An infrared detector comprising an optical device as claimed in claim 1 , arranged in such a way as to form the image on the infrared sensor of the detector.6. ...

THERMAL RADIATION SENSOR AND THERMAL IMAGE CAPTURING DEVICE INCLUDING SAME

A thermal radiation sensor may include a thermal absorption layer, an optical resonator surrounding the thermal absorption layer, and a plasmonic absorber provided on the thermal absorption layer, and thus, the thermal radiation sensor may have high sensitivity and may be miniaturized. 1. A thermal radiation sensor comprising:a post;a thermal absorption layer disposed on the post;an optical resonator around the thermal absorption layer;a plasmonic absorber disposed on the thermal absorption layer; anda waveguide coupler disposed separately from the optical resonator.2. The thermal radiation sensor of claim 1 , wherein the plasmonic absorber includes a metal.3. The thermal radiation sensor of claim 2 , wherein the plasmonic absorber includes one or more of titanium (Ti) claim 2 , gold (Au) claim 2 , silver (Ag) claim 2 , platinum (Pt) claim 2 , copper (Cu) claim 2 , aluminum (Al) claim 2 , nickel (Ni) claim 2 , and chromium (Cr).4. The thermal radiation sensor of claim 1 , wherein the plasmonic absorber includes at least one nanorod or at least one nanoparticle.5. The thermal radiation sensor of claim 1 , wherein the plasmonic absorber has a cylindrical shape or a hemispherical shape.6. The thermal radiation sensor of claim 1 , wherein the plasmonic absorber is arranged in a polygonal shape.7. The thermal radiation sensor of claim 1 , wherein the thermal absorption layer is formed of one of silica and silicon nitride.8. The thermal radiation sensor of claim 7 , wherein the plasmonic absorber is formed of one of glass claim 7 , silicon dioxide (SiO) claim 7 , and silicon nitride (SiN).9. The thermal radiation sensor of claim 1 , wherein the optical resonator has a circular tube shape.10. The thermal radiation sensor of claim 1 , wherein the thermal absorption layer has a circular shape.11. The thermal radiation sensor of claim 10 , wherein the thermal absorption layer has a radius of 20 μm to 120 μm.12. The thermal radiation sensor of claim 1 , wherein the optical ...

COAXIAL FIBER OPTICAL PYROMETER WITH LASER SAMPLE HEATER

An optical pyrometer having a coaxial light guide delivers laser radiation through optics to heat a localized area on a sample, and simultaneously collects optical radiation from the sample to perform temperature measurement of the heated area. Inner and outer light guides can comprise the core and inner cladding, respectively, of a double-clad fiber (DCF), or can be formed using a combination of optical fibers in one or more coaxial bundles. Coaxial construction and shared optics facilitate alignment of the centers of the heated and observed areas on the sample. The heated area can be on the order of micrometers when using a single-mode optical fiber core as the inner light guide. The system can be configured to heat small samples within a vacuum system of charged-particle beam microscopes such as electron microscopes. A method for using the invention in a microscope is also provided. 1. A pyrometer for use in a charged-particle beam microscope , the pyrometer comprising:a bidirectional light guide having a proximal end and a distal end, the bidirectional light guide further comprising an inner light guide and an outer light guide, the outer light guide surrounding the inner light guide and coaxial therewith;a directional coupler having a laser port, an analyzer port, and a distal port, the distal port optically coupled to the proximal end of the bidirectional light guide, the directional coupler configured to direct a backward-propagating light emitted from a sample and entering the distal port to exit at the analyzer port, and to direct a forward-propagating light entering the laser port to exit at the distal port;a laser optically coupled to the laser port of the directional coupler to provide forward-propagating laser light;focusing optics optically coupled to the distal end of the light guide and configured to focus the forward-propagating laser light onto the sample;collection optics optically coupled to the distal end of the light guide and configured to ...

Systems and methods for high-contrast, near-real-time acquisition of terahertz images

A cw terahertz image beam is upconverted by a nonlinear optical process (e.g., sum- or difference-frequency generation with a near IR cw upconverting beam). The upconverted image is acquired by a near IR image detector. The bandwidths and center wavelengths of the terahertz image beam and the upconverting beam are such that wavelength filtering can be employed to permit an upconverted image beam to reach the detector while blocking or substantially attenuating the upconverting beam. 1. A method for acquiring an upconverted terahertz image of an object , the method comprising:(a) illuminating the object with a continuous-wave terahertz imaging beam characterized by a terahertz frequency between about 0.05 THz and about 10 THz, a terahertz bandwidth, and a terahertz average power;(b) collecting at least a portion of the terahertz imaging beam, transmitted by or around the object or reflected or scattered from the object, and directing that portion to propagate as a terahertz image beam through a nonlinear optical medium, wherein the terahertz image beam is characterized by a terahertz image beam size at the nonlinear optical medium;(c) directing a continuous-wave upconverting beam to propagate through the nonlinear optical medium, wherein the upconverting beam at least partly spatially overlaps the terahertz image beam in the nonlinear optical medium and is characterized by an upconverting wavelength, an upconverting bandwidth, an upconverting average power, and an upconverting beam size at the nonlinear optical medium;(d) upconverting, by nonlinear optical interaction of the terahertz image beam and the upconverting beam in the nonlinear optical medium, at least a portion of the terahertz image beam to form an upconverted image beam characterized by one or both wavelengths produced by sum- or difference-frequency generation between the terahertz image beam and the upconverting beam;(e) receiving at least a portion of the upconverted image beam using an image detector ...

Body core temperature measurement

An apparatus for measuring body core temperature includes a light guide. The light guide can be coupled to an earpiece, or it can be a standalone device. The apparatus also includes a sensor positioned at one end of the light guide, and a processor coupled to the sensor. The sensor is operable to sense infrared radiation from an infrared source at the opposite end of the light guide. The processor is operable to determine a temperature of the infrared source at the opposite end of the light guide via a transfer function that correlates a measurement of the infrared radiation observed by the sensor and an effect of radiation of the light guide.

BODY CORE TEMPERATURE MEASUREMENT

A device for measuring body core temperature includes a light guide. The light guide is coupled to an earpiece. A first sensor is positioned at a first end of the light guide, and a second sensor is positioned at a second end of the light guide. A processor is coupled to the first sensor and the second sensor. The first sensor senses infrared radiation from an infrared source at the second end of the light guide, and the second sensor measures a temperature of the light guide at the second end of the light guide. The processor determines a temperature of the infrared source at the second end of the light guide by compensating for infrared radiation due to a thermal gradient of the light guide via a regression analysis across a range of ambient temperatures of the light guide. 1. An apparatus for measuring body core temperature comprising:a light guide comprising an internally reflective tube, the light guide coupled to an earpiece, the light guide having a first end and a second end;a first sensor positioned at the first end of the light guide;a second sensor positioned at the second end of the light guide; anda processor coupled to the first sensor and the second sensor;wherein the first sensor is operable to sense infrared radiation from an infrared source at the second end of the light guide;wherein the second sensor is operable to measure a temperature of the light guide at the second end of the light guide; andwherein the processor is operable to determine a temperature of the infrared source at the second end of the light guide by compensating for infrared radiation due to a thermal gradient of the light guide via a regression analysis across a range of ambient temperatures of the light guide.2. The apparatus of claim 1 , wherein the first sensor comprises a thermopile and the second sensor comprises a thermocouple.3. The apparatus of claim 2 , wherein the regression analysis comprises determining coefficients associated with a hot junction of the thermopile ...

SYSTEMS, METHODS, AND APPARATUS FOR RADIATION DETECTION

A radiation detection technique employs field enhancing structures and electroluminescent materials to converts incident Terahertz (THz) radiation into visible light and/or infrared light. In this technique, the field-enhancing structures, such as split ring resonators or micro-slits, enhances the electric field of incoming THz light within a local area, where the electroluminescent material is applied. The enhanced electric field then induces the electroluminescent material to emit visible and/or infrared light via electroluminescent process. A detector such as avalanche photodiode can detect and measure the emitted light. This technique allows cost-effective detection of THz radiation at room temperatures. 1a conductive structure defining a first gap to receive and trap the electromagnetic radiation so as to generate an enhanced electric field in response to the first spectral component;an electroluminescent (EL) material disposed at least partially within the first gap to emit light in response to the enhanced electric field; anda silicon oxide layer, disposed between the conductive structure and the EL material, to electrically insulate the-conductive structure from the EL material.. An apparatus for detecting electromagnetic radiation including a first spectral component having a first frequency within a range of about 100 GHz to about 100 THz, the apparatus comprising: This application claims priority to U.S. application Ser. No. 15/061,308, filed Mar. 4, 2016, entitled “SYSTEMS, METHODS, AND APPARATUS FOR RADIATION DETECTION.” U.S. application Ser. No. 15/061,308 claims priority to U.S. provisional application Ser. No. 62/129,105, filed Mar. 6, 2015, entitled “SCINTILLATOR FOR IMAGING TERAHERTZ LIGHT”, U.S. provisional application Ser. No. 62/201,274, filed Aug. 5, 2015, entitled “SCINTILLATOR FOR IMAGING TERAHERTZ LIGHT”, and U.S. provisional application Ser. No. 62/216,583, filed Sep. 10, 2015, entitled “SCINTILLATOR FOR IMAGING TERAHERTZ LIGHT.” Each of ...

Temperature probe

The present invention includes a temperature probe and use thereof. The temperature probe is configured to obtain a temperature of a blow molding preform, especially a temperature of an inside surface of the blow molding preform. In this manner, effectiveness of heating the preform can be evaluated, the presence of one or more temperature gradients ascertained, and the blow molding process can be optimized for a given preform.

Plasmonically enhanced, ultra-sensitive bolometric mid-infrared detector

The present invention features a novel design for a bolometric infrared detector focused on LWIR range for human body high-resolution temperature sensing, The present invention incorporates an efficient plasmonic absorber and VO 2 nanobeam to facilitate improvement in both aspects—thermal resolution and spatial resolution. The present invention significantly improves the detectivity, NETD, and responsivity for a smaller form-factor detector active area.

INTEGRATED SUBSTRATE TEMPERATURE MEASUREMENT ON HIGH TEMPERATURE CERAMIC HEATER

Embodiments described herein include integrated systems used to directly monitor a substrate temperature during a plasma enhanced deposition process and methods related thereto. In one embodiment, a substrate support assembly includes a support shaft, a substrate support disposed on the support shaft, and a substrate temperature monitoring system for measuring a temperature of a substrate to be disposed on the substrate support. The substrate temperature monitoring system includes a optical fiber tube, a light guide coupled to the optical fiber tube, and a cooling assembly disposed about a junction of the optical fiber tube and the light guide. Herein, at least a portion of the light guide is disposed in an opening extending through the support shaft and into the substrate support and the cooling assembly maintains the optical fiber tube at a temperature of less than about 100° C. during substrate processing. 1. A method of processing a substrate , comprising:positioning a substrate on a substrate receiving surface of a substrate support assembly disposed in a processing volume of a processing chamber;measuring a temperature of the substrate using an optical fiber tube, wherein the temperature of the substrate exceeds about 110° C.;maintaining the optical fiber tube at a temperature of temperature less than about 100° C.; anddepositing a material layer on the substrate.2. The method of claim 1 , wherein the temperature of the substrate exceeds about 250° C.3. The method of claim 1 , further comprising:flowing one or more processing gases into the processing volume; andforming a plasma of the one or more processing gases.4. The method of claim 3 , further comprising monitoring the measured substrate temperature and changing one or more processing conditions responsive to determining that the substrate temperature exceeds a threshold value.5. The method of claim 1 , wherein the substrate support assembly comprises:a support shaft;a substrate support disposed on the ...

GRAPHENE-BASED BOLOMETER

A bolometer. In one embodiment a graphene sheet is configured to absorb electromagnetic waves. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Electromagnetic power in the evanescent electromagnetic waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of electromagnetic wave power absorbed by the graphene sheet. 1. A bolometer comprising: to be coupled to received electromagnetic waves;', 'to have a temperature, when electromagnetic power in the received electromagnetic waves is absorbed by the graphene sheet, corresponding to the amount of electromagnetic power absorbed by the graphene sheet; and', 'to generate thermal noise at the first pair of contacts at a level corresponding to the temperature; and, 'a graphene sheet having a first pair of contacts and a second pair of contacts and being configureda circuit connected to the first pair of contacts, the circuit configured to measure the thermal noise level, a first contact of the second pair of contacts,', 'the graphene sheet, and', 'a second contact of the second pair of contacts, 'wherein'}together form a part of a microstrip transmission line.2. The bolometer of claim 1 , wherein: a second end of the microstrip transmission line is coupled to ground, or', 'a portion of the microstrip transmission line, including a second end of the microstrip transmission line, forms a quarter-wave open stub connected to the graphene sheet., 'a first end of the microstrip transmission line is coupled to an antenna, and3. A bolometer comprising: to be coupled to received electromagnetic waves;', 'to have a temperature, when electromagnetic power in the received electromagnetic waves is absorbed ...

INFRARED TEMPERATURE SENSOR

An infrared temperature sensor includes a sensor case, a heat conversion film configured to absorb infrared rays and to convert the infrared rays into heat, a sensor cover that is disposed to face the sensor case through the heat conversion film, and an infrared detection element and a temperature compensation element that are disposed on the heat conversion film. The sensor case includes a case base portion that includes a front surface and a rear surface, a light guiding region that is provided to penetrate through the front surface and the rear surface of the case base portion, and a light shielded region that is provided inside a light shielding dome erected from the front surface side of the case base portion. 1. An infrared temperature sensor that detects temperature of a detection object in a non-contact manner , the infrared temperature sensor comprising:a sensor case including a light guiding region that guides infrared rays entering from an entrance window, and a light shielded region that is adjacent to the light guiding region and is closed from surroundings;a film that is disposed to face the light guiding region and the light shielded region and is configured to absorb the infrared rays reaching through the light guiding region and to convert the infrared rays into heat;a sensor cover that is disposed to face the sensor case through the film;an infrared detection element that is disposed at a part of the film corresponding to the light guiding region; anda temperature compensation element that is disposed at a part of the film corresponding to the light shielded region, whereinthe sensor case includes a case base portion that includes a front surface and a rear surface, the light guiding region that is provided to penetrate through the front surface and the rear surface of the case base portion, and the light shielded region that is provided inside a light shielding dome erected from the front surface of the case base portion, andthe sensor cover ...

THERMAL IMAGING WITH AN INTEGRATED PHOTONICS CHIP

An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers. 1. An integrated photonics chip for thermal imaging , the integrated photonics chip comprising: a first grating coupler optically coupled to a first waveguide filter, wherein the first grating coupler is configured to receive a first wavelength of light at a given angle, and the first waveguide filter is configured to pass the first wavelength of light; and', 'a second grating coupler optically coupled to a second waveguide filter, wherein the second grating coupler is configured to receive a second wavelength of light at the given angle, and the second waveguide filter is configured to pass the second wavelength of light;, 'a photonics substrate including a plurality of receiver elements, each of the receiver elements comprisingwherein each of the receiver elements is configured to receive the wavelengths of light from an object of interest that emits the light due to blackbody radiation;wherein each of the receiver elements is configured to receive the wavelengths of light at respectively different angles from the object ...

Systems and methods for high-contrast, near-real-time acquisition of terahertz images

A terahertz image beam is upconverted by a nonlinear optical process (e.g., sum- or difference-frequency generation with a near IR upconverting beam). The upconverted image is acquired by a near IR image detector. The terahertz image beam and upconverting beam comprise trains of picosecond pulses. The bandwidths and center wavelengths of the terahertz image beam and the upconverting beam are such that wavelength filtering can be employed to permit an upconverted image beam to reach the detector while blocking or substantially attenuating the upconverting beam. 1. A method for acquiring an upconverted terahertz image of an object , the method comprising:(a) illuminating the object with a terahertz imaging beam characterized by a terahertz frequency between about 0.1 THz and about 10 THz, a terahertz bandwidth, a terahertz average power, a terahertz peak power, a terahertz pulse duration, and a pulse repetition rate;(b) collecting at least a portion of the terahertz imaging beam, transmitted by or around the object or reflected or scattered from the object, and directing that portion to propagate as a terahertz image beam through a nonlinear optical medium, wherein the terahertz image beam is characterized by a terahertz image beam size at the nonlinear optical medium;(c) directing an upconverting beam to propagate through the nonlinear optical medium, wherein the upconverting beam at least partly spatially overlaps the terahertz image beam in the nonlinear optical medium and is characterized by an upconverting wavelength, an upconverting bandwidth, an upconverting average power, an upconverting peak power, the pulse rate, and an upconverting beam size at the nonlinear optical medium;(d) upconverting, by nonlinear optical interaction of the terahertz image beam and the upconverting beam in the nonlinear optical medium, at least a portion of the terahertz image beam to form an upconverted image beam characterized by one or both wavelengths produced by sum- or ...

METHOD AND DEVICE OF ENHANCING TERAHERTZ WAVE SIGNALS BASED ON HOLLOW METAL WAVEGUIDE OPTICAL FIBER

A device and method of enhancing terahertz wave signals based on a hollow metal waveguide are disclosed. Simple devices such as a beam splitter, multiple plane mirrors, a beam combiner and an adjustable delay system are used. Two laser beams having a wavelength of 800 nm split by the beam splitter generate a fixed time phase delay, and are converged in the hollow metal waveguide to sequentially overlap with pulse of a laser having a wavelength of 400 nm for nonlinear interaction to ionize gas in the optical fiber to generate terahertz waves. The hollow metal waveguide can converge and transmit the generated terahertz waves due to its total reflection characteristics. 1setting up a device of enhancing terahertz wave signals based on the hollow metal waveguide;splitting an incident laser with a wavelength of 800 nm emitted by a laser source into a first laser beam as transmitted laser and a second laser beam as reflected laser;sequentially reflecting the transmitted laser with a wavelength of 800 nm by a group of plane mirrors and converging by a first convex lens to enter into a BBO crystal and partially converted into a laser with a wavelength of 400 nm; wherein lasers output from the BBO crystal have wavelengths of both 800 nm and 400 nm; the reflected laser with a wavelength of 800 nm passes through a first plane mirror, an adjustable delay system, a second plane mirror and a second convex lens, and generates a fixed time phase delay with the lasers having wavelengths of 800 nm and 400 nm output from the BBO crystal; all the reflected lasers with a wavelength of 800 nm and the lasers having wavelengths of 800 nm and 400 nm pass through a beam-combination mirror to be converged into the hollow metal waveguide filled with dry gas; focuses of the transmitted laser and the reflected laser converged by the first and second convex lenses are located at an entrance of the hollow metal waveguide; terahertz waves output from the hollow metal waveguide are collected by a ...

Temperature Measuring Device and Temperature Measuring Method for Measuring Temperature of Molten Metals

The disclosure includes a temperature measuring device and a temperature measuring method for measuring the temperature of molten metals. The temperature measuring device includes a temperature sensing element, a support tube, a connecting tube and an exhaust structure. The temperature sensing element is a cermet tube with a closed end and an open end, and can sense the temperature of a molten metal and emit stable thermal radiation energy based on the blackbody cavity principle when being extended into the molten metal. The open end of the cermet tube is fixedly connected to one end of the support tube, the cermet tube is communicated with the support tube, and the other end of the support tube is fixedly connected with the connecting tube. The exhaust structure is used to discharge the smoke inside the cermet tube and the support tube. 1. A temperature measuring device for measuring the temperature of molten metals , comprising:a temperature sensing element,a support tube,a connecting tube, andan exhaust structure,wherein the temperature sensing element comprises a cermet tube with a closed end and an open end, the wall thickness of the cermet tube is smaller than the wall thickness of the support tube, and the cermet tube is configured to sense the temperature of molten metals and emit stable thermal radiation energy based on the blackbody cavity principle when being extended into the molten metals;the open end of the cermet tube is fixedly connected to one end of the support tube, the cermet tube is communicated with the support tube, and the other end of the support tube is fixedly connected with the connecting tube; andthe exhaust structure is configured to discharge the smoke inside the cermet tube and the support tube.2. The temperature measuring device as claimed in claim 1 , wherein the wall thickness d of the cermet tube is 1.0 mm to 10.0 mm.3. The temperature measuring device as claimed in claim 1 , wherein L/Φis 1.0 to 20.0 claim 1 , wherein the Lis a ...

Near-field optical sensing system

This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for sensing touch and/or gestures in the near-field area overlying a light-guiding layer within a device or other optical sensing system. In one aspect, modulated infrared light is emitted into the overlying area, and the light reflected by objects within the overlying area is redirected through the light-guiding layer to infrared sensors. In one aspect, a masking structure can be located between the light-guiding layer and the infrared sensors. In some aspects, probability mapping or backtracing can be used to estimate the locations of objects within the overlying area.

Wearable Body Temperature Monitoring Device and Method Thereof

The present disclosure illustrates a wearable body temperature monitoring device and a method thereof. The wearable body temperature monitoring device includes a hollow shell member and a circuit board. The hollow shell member includes a sensing surface and an outer surface opposite to each other, and the sensing surface is provided with hole. The circuit board is accommodated in the hollow shell member and includes a first side surface corresponding to the sensing surface and a second side surface corresponding to the outer surface. The circuit board is provided with a non-contact temperature sensor, a wireless transmission module, a processing unit, and a battery, and the non-contact temperature sensor is disposed at the first side surface and aligned with the hole of the sensing surface. The wearable body temperature monitoring device can respond the variation of the body temperature in real time when being attached on clothes. 1. A wearable body temperature monitoring device , comprising:a hollow shell member comprising a sensing surface and an outer surface, wherein the sensing surface and the outer surface are two side surfaces opposite to each other, and the sensing surface is provided with a hole; anda circuit board accommodated in the hollow shell member and comprising a first side surface corresponding in position to the sensing surface and a second side surface corresponding in position to the outer surface, wherein the circuit board is provided with a non-contact temperature sensor, a wireless transmission module, a processing unit, and a battery, and the non-contact temperature sensor is disposed at the first side surface and aligned with the hole of the sensing surface.2. The wearable body temperature monitoring device according to claim 1 , wherein the wireless transmission module is disposed at the second side surface.3. The wearable body temperature monitoring device according to claim 1 , wherein the circuit board comprises a power switch disposed ...

Photo detector

A photo detector is disclosed. The photo detector comprises a substrate, a flat metal layer, a dielectric layer, a patterned metal layer, and a semiconductor film. The flat metal layer is formed on the substrate. The dielectric layer is formed on the flat metal layer. The patterned metal layer is, formed on the dielectric layer. The patterned metal layer comprises a first interdigitated electrode and a second interdigitated electrode. The first interdigitated electrode is adjacent to the second interdigitated electrode. The semiconductor film is formed on the dielectric layer and covering the first interdigitated electrode and the second interdigitated electrode. When the semiconductor film receives an incident light, the flat metal layer and the patterned metal layer are operated in a localized surface plasmon mode or a waveguide mode for absorbing a certain narrow bandwidth radiation light of the incident light. Therefore, the electrical conductivity of the semiconductor film is changed and the optical energy absorbed by the photo detector is determined.

Mems infrared sensor including a plasmonic lens

A portable thermal imaging system includes a portable housing configured to be carried by a user, a bolometer sensor assembly supported by the housing and including an array of thermal sensor elements and at least one plasmonic lens, a memory including program instructions, and a processor operably connected to the memory and to the sensor, and configured to execute the program instructions to obtain signals from each of a selected set of thermal sensor elements of the array of thermal sensor elements, assign each of the obtained signals with a respective color data associated with a temperature of a sensed object, and render the color data.

PROJECTION SYSTEM WITH SAFETY DETECTION

A projection system is disclosed including a safety detection system for a protected space, said projection system including a projection light source, a projection imaging system, a projection lens system, a detection source comprising at least of a detection light source and a detection camera comprising at least of a detection sensor, characterized by the fact that the optical axis of the projection source is identical to the optical axis of the detection source and the detection camera at least in the protected space. 1. A projection system including a safety detection system for a protected space , said projection system including a projection light source , a projection imaging system , a projection lens system , a detection light source and a detection sensor , wherein the optical axis of the projection light source is identical to the optical axis of the detection light source and the detection sensor at least in the protected space , and further comprising means to combine the optical axes of the detection sensor and detection light source with the optical axis of the projection light source within the projection lens system.2. The projection system according to claim 1 , wherein the detection sensor is a Time of Flight sensor.3. The projection system according to claim 1 , wherein the detection light source is an Infra-Red light source.411-. (canceled)12. The projection system according to claim 1 , further comprising a detection subsystem having the means for combining the optical axis of the detection source and the optical axis of the detection camera and the detection camera and detection light source.13. The projection system according to claim 12 , wherein said means for combining the optical axis of the detection source and the optical axis of the detection sensor is a beam splitter.14. The projection system according to claim 12 , wherein said means for combining the optical axis of the detection source and the optical axis of the detection sensor ...

Sensor device

Systems and techniques are provided for sensor device. A sensor device may include a housing, a lens inserted into a first opening of the housing, a metal mask covering a portion of the interior of the lens, a passive infrared (PIR) sensor underneath the lens and the metal mask, and a light pipe around the PIR sensor, the lens, and the metal mask. Part of the light pipe may be positioned above an activation mechanism for a button. An airflow gasket may be around the PIR sensor. A filter circuit board may be under the PIR sensor and connected to leads of the PIR sensor. A control circuit board may include the activation mechanism for the button. A backplate may include a slot for attachment to a snap of a magazine in the housing of the sensor device.

Infrared temperature sensor

To provide an infrared temperature sensor that is corrected in detected temperature while ensuring high responsiveness. An infrared temperature sensor 10 according to the present invention includes a heat conversion film 40 , an infrared detection element 43 held by the heat conversion film 40 , a temperature compensation element 45 that is provided adjacently to the infrared detection element 43 and is held by the heat conversion film 40 , a light guide part 59 that guides entered infrared rays toward the infrared detection element 43 , and a blocking part 27 that blocks the infrared rays from being incident on the temperature compensation element 45 , in which an inner surface of the light guide part 59 configures an irradiation surface 57 to be irradiated with the infrared rays, and the irradiation surface 57 includes a correction region 58 that is different in emissivity of the infrared rays from surroundings.

BOLOMETER, METHOD OF FABRICATING THE SAME, AND BOLOMETRIC METHOD

Various aspects of this disclosure provide a bolometer including a substrate and a ring resonator structure over the substrate. The bolometer may also include a silicon oxide layer in thermal contact with the ring resonator structure. The bolometer may further include a first waveguide over the substrate and coupled to the ring resonator structure, the first waveguide configured to couple an infrared light to the ring resonator structure so that the infrared light generates a temperature increase in the silicon oxide layer. The bolometer may additionally include a second waveguide over the substrate and coupled to the ring resonator structure, the second waveguide configured to couple a probe light input to the ring resonator structure so that a probe light output is generated from the probe light input, the probe light output having a change in a characteristic from the probe light input based on the temperature increase. 1. A bolometer comprising:a substrate;a ring resonator structure over the substrate;a silicon oxide layer in thermal contact with the ring resonator structure;a first waveguide over the substrate and coupled to the ring resonator structure, the first waveguide configured to couple an infrared light to the ring resonator structure so that the infrared light is trapped in the ring resonator structure and generates a temperature increase in the silicon oxide layer; anda second waveguide over the substrate and coupled to the ring resonator structure, the second waveguide configured to couple a probe light input to the ring resonator structure so that a probe light output is generated from the probe light input, the probe light output having a change in a characteristic from the probe light input based on the temperature increase.2. The bolometer of claim 1 ,wherein the silicon oxide layer is provided below the ring resonator structure.3. The bolometer of claim 1 ,wherein the silicon oxide layer is provided on top of the ring resonator structure.4. The ...

In-situ temperature measurement in a noisy environment

Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. One or more lift pins has a light pipe disposed therein to collect radiation emitted or transmitted by the substrate when the lift pin contacts the substrate surface.

MEASUREMENT DEVICE AND MEASUREMENT METHOD FOR MEASURING TEMPERATURE AND EMISSIVITY OF A MEASURED SURFACE

The present application discloses a measurement device and a measurement method for measuring a temperature and an emissivity of a measured surface. The measurement device comprises a reflection converter, an optical receiver and a data processor, wherein the reflection converter comprises a reflector and an absorber tube, the reflector has a through hole, and the absorber tube may be shifted between a first measurement position and a second measurement position relative to the reflector. In the first measurement position, the light incident end of the absorber tube approaches or contacts the measured surface, such that the optical receiver receives inherent radiation light emitted from the measured surface and forms a first electrical signal. In the second measurement position, the light incident end of the absorber tube is located at the through hole or outside the through hole of the reflector, such that the optical receiver receives the inherent radiation light emitted from the measured surface and reflective radiation light between a reflection surface of the reflector and the measured surface and forms a second electrical signal. The data processor is configured to determine a temperature and an emissivity of the measured surface according to the first electrical signal and the second electrical signal. 1. A measurement device for measuring a temperature and an emissivity of a measured surface , comprising:a reflection converter, an optical receiver and a data processor, wherein the optical receiver is coupled to the reflection converter and is configured to receive radiation light emitted from a measured surface and passing through the reflection converter and convert the radiation light into an electrical signal, and wherein the data processor is coupled to the optical receiver and is configured to receive the electrical signal and to determine a temperature and an emissivity of the measured surface according to the electrical signal;wherein the reflection ...

Device for measuring temperature of turbine wheel in turbocharger and engine control method using temperature measurement device for turbine wheel

A device for measuring temperature of a turbine wheel in a turbocharger includes: a guide that passes infrared ray generated from the turbine wheel and includes a coolant path; a protection unit that protects an optical head which senses the infrared ray; and a signal processing unit that measures a temperature of the turbine wheel by processing a signal corresponding to the sensed infrared ray.

GRAPHENE-BASED INFRARED BOLOMETER

An infrared bolometer. In one embodiment a waveguide configured to transmit infrared radiation is arranged to be adjacent a graphene sheet and configured so that evanescent waves from the waveguide overlap the graphene sheet. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Infrared electromagnetic power in the evanescent waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of infrared power propagating in the waveguide. 1. An infrared bolometer comprising:a waveguide configured to guide infrared electromagnetic waves, in a mode having an evanescent field extending outside of the waveguide; to be coupled to the evanescent field;', 'to have a temperature, when electromagnetic power in the evanescent field is absorbed by the graphene sheet, corresponding to the amount of electromagnetic power absorbed by the graphene sheet; and', 'to generate thermal noise at the two contacts at a level corresponding to the temperature; and, 'a graphene sheet having two contacts and configureda circuit connected to the two contacts, the circuit configured to measure the thermal noise level.2. The bolometer of claim 1 , further comprising a refrigerator configured to cool the graphene sheet to a temperature below 4 K.3. The bolometer of claim 2 , wherein the refrigerator is a pulse tube refrigerator.4. The bolometer of claim 2 , wherein the refrigerator is a Gifford-McMahon cooler.5. The bolometer of claim 1 , wherein the graphene sheet substantially has the shape of a rectangle claim 1 , the rectangle having a length and a width claim 1 , the length being greater than or equal to the width.6. The bolometer of claim 5 , wherein the length of the rectangle ...

GRAPHENE-BASED BOLOMETER

A bolometer. In one embodiment a graphene sheet is configured to absorb electromagnetic waves. The graphene sheet has two contacts connected to an amplifier, and a power detector connected to the amplifier. Electromagnetic power in the evanescent electromagnetic waves is absorbed in the graphene sheet, heating the graphene sheet. The power of Johnson noise generated at the contacts is proportional to the temperature of the graphene sheet. The Johnson noise is amplified and the power in the Johnson noise is used as a measure of the temperature of the graphene sheet, and of the amount of electromagnetic wave power absorbed by the graphene sheet. 1. A bolometer comprising: to be coupled to received electromagnetic waves;', 'to have a temperature, when electromagnetic power in the received electromagnetic waves is absorbed by the graphene sheet, corresponding to the amount of electromagnetic power absorbed by the graphene sheet; and', 'to generate thermal noise at the first pair of contacts at a level corresponding to the temperature, 'a graphene sheet having a first pair of contacts and configureda Fabry-Perot resonator comprising two mirrors, the graphene sheet being between the two mirrors; anda circuit connected to the first pair of contacts, the circuit configured to measure the thermal noise level.2. The bolometer of claim 1 , further comprising a refrigerator configured to cool the graphene sheet to a temperature below 4 K.3. The bolometer of claim 2 , wherein the refrigerator is a pulse tube refrigerator.4. The bolometer of claim 2 , wherein the refrigerator is a Gifford-McMahon cooler.5. The bolometer of claim 1 , wherein the graphene sheet substantially has the shape of a rectangle claim 1 , the rectangle having a length and a width claim 1 , the length being greater than or equal to the width.6. The bolometer of claim 5 , wherein the length of the rectangle is less than 20 microns.7. The bolometer of claim 5 , wherein the product of the length of the ...

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to an fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Planar thermopile infrared microsensor

An IR sensor comprises a heat sink substrate (10) having portions (12) of relatively high thermal conductivity and portions (14) of relatively low thermal conductivity and a planar thermocouple layer (16) having a hot junction (18) and a cold junction (20), with the hot junction (18) located on a portion (14) of the heat sink substrate with relatively low thermal conductivity. A low thermal conductivity dielectric layer (22) is provided over the thermocouple layer (16), and has a via (24) leading to the hot junction (18). An IR reflector layer (26) covers the low thermal conductivity dielectric layer (22) and the side walls of the via (24). An IR absorber (30; 30') is within the via. This structure forms a planar IR microsensor which uses a structured substrate and a dielectric layer to avoid the need for any specific packaging. This design provides a higher sensitivity by providing a focus on the thermocouple, and also gives better immunity to gas conduction and convection.

Apparatus for thermal sensing during additive manufacturing and methods that accomplish the same

An additive manufacturing apparatus includes a laser and a detection system. The laser emits a laser beam to heat a powder bed to form a melt pool, and the melt pool emits light proportional to a temperature of the melt pool. The detection system includes a spectral disperser and one of a) two or more on-axis sensors or b) a line scanner. The two or more on-axis sensors or the line scanner are/is located along an axis of the emitted light, the detection system receives the emitted light from the melt pool, and an intensity of the emitted light detected by the a) two or more on-axis sensors or the b) line scanner is compared with a blackbody spectral map at a particular wavelength of the emitted light to determine a temperature of the melt pool.

In situ optical surface temperature measuring techniques and devices

A temperature sensor that has a thermally conducting contact with a surface that emits electromagnetic radiation in proportion to the temperature of the contact is disclosed. The sensor has a resilient member attached to the contact and configured to extend the contact toward the object to be measured. A first light waveguide is attached to the contact and is configured to transmit the electromagnetic radiation from the contact. The sensor has a guide with a bore formed therein that the first waveguide is insertable into. When the contact is moved, the first waveguide moves within the bore. A second waveguide is attached to the guide such that a variable gap is formed between the ends of the first waveguide and the second waveguide. Electromagnetic energy from the first waveguide traverses the gap and can be transmitted by the second waveguide. The guide allows the first waveguide to move with the contact in order to ensure that the contact is fully engaged with the surface of the object.

测量反应器内部温度的装置

使用光学高温计测量气化反应器温度的装置，包括一个可接纳光导管的供料喷射器。喷射器(2)包括有一开口的喷射器头(6)。喷射器头与供料进口(8)和法兰连接器(4)流体相通法兰连接器(4)与喷射器头的开口光学对齐。一个盲法兰装在供料喷射器的法兰接头上形成一个耐气压的密封。压力密封装置(12)装在盲法兰中使光导管(22a，22b)可穿过盲法兰，光导管的接收端延伸入供料喷射器中使光导管的光接收端与喷射器头的开口光学对齐。一个光接头(26a，26b)起到光导管的传光端到光缆及到光学高温计的光连接。

近场光学感测系统

本发明提供用于感测遮盖装置或其它光学感测系统内的光导引层的近场区域中的触摸和/或手势的系统、方法及设备，包含在计算机存储媒体上编码的计算机程序。在一个方面中，将经调制红外光发射到所述遮盖区域中，并且将所述遮盖区域内的物体反射的光重新引导通过所述光导引层到红外传感器。在一个方面中，掩蔽结构可以位于所述光导引层与所述红外传感器之间。在一些方面中，可以使用概率映射或回溯来评估所述遮盖区域内的物体的所述位置。

Flash thermography borescope

본 발명은 터빈 내부에 로케이팅된 복수의 회전 터빈 컴포넌트들 각각의 적외선 이미지를 생성하기 위한 플래시 서모그래피 디바이스에 관한 것이다. 디바이스는 각각의 컴포넌트에 의해 방사되는 열 에너지를 검출하기 위한 적외선 센서를 포함한다. 디바이스는 또한 보어스코프를 포함하며, 보어스코프는 보어스코프의 길이방향 축 상에 로케이팅된 뷰잉 단부를 갖는다. 보어스코프는, 적어도 하나의 컴포넌트가 뷰잉 단부의 시야 내에 있도록 뷰잉 단부를 터빈 내부에 로케이팅시키기 위해 검사 포트 내에 포지셔닝된다. 게다가, 디바이스는 회전자의 단일 회전 동안에 회전하는 컴포넌트들의 개수에 대응하는 복수의 광 펄스들을 생성하는 플래시 소스를 포함하며, 광 펄스들은 길이방향을 실질적으로 가로질러 배향된다. 각각의 컴포넌트로부터 방사되는 열 에너지는 보어스코프를 통해 적외선 센서에 전달되어 적외선 이미지들의 생성을 가능하게 한다. The present invention relates to a flash thermography device for generating an infrared image of each of a plurality of rotating turbine components located within a turbine. The device includes an infrared sensor for detecting the thermal energy radiated by each component. The device also includes a borescope, the borescope having a viewing end located on the longitudinal axis of the borescope. The borescope is positioned within the inspection port to locate the viewing end inside the turbine such that at least one component is within the view of the viewing end. In addition, the device includes a flash source that generates a plurality of light pulses corresponding to the number of rotating components during a single rotation of the rotor, the light pulses being oriented substantially across the longitudinal direction. The thermal energy radiated from each component is transferred to the infrared sensor through the borescope to enable the generation of infrared images.

Laser beam adjustment means

Temperature measuring device using an infrared thermometer

公开了一种使用红外温度计(1)来检测来自希望得知其温度的患者的身体的红外辐射的强度，从而测量患者温度的设备(100)；该设备还包括：将所述温度发送到存储器(38)的室温传感器。处理单元(33)接收室温信号(B)和与红外辐射成比例的温度信号(A)作为输入，该室温信号(B)能使处理单元(33)确定校正参数，以便修正由传感器元件(7)检测的温度(A)并且确定患者的实际温度。本发明可以解决因为温度计环境的不稳定性所导致的问题。

Simultaneous measurement method of emissivity, transmissivity, and reflectivity properties for transparent or semitransparent materials under high temperature

본 발명의 일실시예에 따른 고온 반투명 또는 투명시료의 복사율, 투과율, 반사율 특성 동시 측정 방법은, 흑체의 복사량(L b )에 의거하여 실험장치의 민감도(R)를 산출하는 단계; 고복사율을 가지는 기판 물질(A)의 복사율(ε A ) 및 저복사율을 가지는 기판 물질(B)의 복사율(ε B )을 산출하는 단계; 상기 고복사율을 가지는 기판 물질(A)을 반투명 또는 투명시료의 뒷면에 위치하게 하여 소정 온도(T)에서의 반투명 또는 투명시료의 복사량(S A )을 산출하는 단계; 상기 저복사율을 가지는 기판 물질(B)을 상기 반투명 또는 투명시료의 뒷면에 위치하게 하여 상기 소정 온도(T)에서의 반투명 또는 투명시료의 복사량(S B )을 산출하는 단계; 상기 산출된 상기 실험장치의 민감도(R), 상기 고복사율 기판 물질(A)의 복사율(ε A ), 상기 저복사율 기판 물질(B)의 복사율(ε B ), 상기 고복사율 기판 물질(A)에 대한 상기 소정 온도(T)에서의 시료의 복사량(S A ), 및 상기 저복사율 기판 물질(B)에 대한 상기 소정 온도(T)에서의 시료의 복사량(S B )를 이용하여 상기 반투명 또는 투명시료의 투과율(t S )을 산출하는 단계; 상기 산출된 상기 투과율(t S )을 이용하여 상기 반투명 또는 투명시료의 복사율(ε S )을 산출하는 단계; 및 상기 산출된 상기 투과율(t S ) 및 상기 복사율(ε S )을 이용하여 상기 반투명 또는 투명시료의 반사율(r S )을 산출하는 단계를 포함한다. Simultaneously measuring the emissivity, transmittance, and reflectance characteristics of a high-temperature translucent or transparent sample according to an embodiment of the present invention, calculating the sensitivity (R) of the experimental apparatus based on the radiation amount (L b ) of the black body; Calculating the radiation rate ε A of the substrate material A having a high radiation rate and the radiation rate ε B of the substrate material B having a low radiation rate; Calculating a radiation amount (S A ) of the translucent or transparent sample at a predetermined temperature (T) by placing the substrate material (A) having the high radiation rate on the back side of the translucent or transparent sample; Calculating a radiation amount (S B ) of the translucent or transparent sample at the predetermined temperature (T) by placing the substrate material (B) having the low radiation rate on the back side of the translucent or transparent sample; The calculated sensitivity R of the experimental apparatus, the emissivity of the high emissivity substrate material A, ε A of the low emissivity substrate material B , and the high emissivity substrate material A radiation of the sample at the predetermined temperature (T) for (S a ...

Optical devices and optical component

本发明的光学构件具备反射散射部(11)，反射散射部(11)具备对例如可见光(102)进行反射并使例如红外光(101a)透射的选择反射部(13)、至少设置在选择反射部的第一侧(视觉辨认侧)并使可见光(102)散射的散射部(12)，光学构件对于红外光(101a)的直进透射率为75％以上。散射部(12)也可以是具备具有衍射构造的结构、在选择反射部(13)具有的反射构件的第一侧表面上形成的凹凸面、微粒子含有树脂层的结构。选择反射部(13)的反射构件也可以是电介质多层膜或胆甾相液晶层。而且，反射散射部(11)也可以具备在面内具有取向轴不同的多个区域的胆甾相液晶层。

Measuring tip for a radiation thermometer

본 발명은 측정될 적외선이 도파관(12)에 의해 방사 센서(14)에 안내되는 방사 체온계용의 탐침 팁에 관한 것이다. 상기 센서는 입사 방사선을 전기적 출력 신호로 변환시킨다. 목표 온도는 위치 결정된 하류 전자 측정 시스템에 의해 상기 신호로부터 측정된다. 센서(14) 내의 온도 구배를 줄이기 위해, 센서 하우징(16)은 열 결합 장치(24, 28, 30)에 의해 도파관(12)에 열적으로 결합되므로, 도파관(12)은 방사에 면한 센서 하우징의 상부면 및 그 대향 바닥면과 직접 열 접촉하게 배치된다. 바람직하게는, 열 전도율이 우수한 재료로 제조된 열 결합 장치(24, 28, 30)는 센서 하우징(16)의 상응하는 면들의 전체 표면을 덮는다. 또한, 본 발명은 방사 센서(14)의 하우징의 온도 구배를 줄이기 위한 방법에 관한 것이다. 본 발명에 따른 탐침 팁(10)에 의해, 온도 상승이 불규칙한 경우에도 정확한 온도 측정이 가능하다. 또한, 상기 팁은 작고 경량이며 컴팩트하므로, 귀 안쪽의 온도를 측정하는 데 통상 사용되는 것과 같은 취급 및 사용이 용이한 방사 체온계의 제조를 가능하게 한다. The present invention relates to a probe tip for a radiation thermometer in which the infrared to be measured is guided to the radiation sensor 14 by the waveguide 12. The sensor converts incident radiation into an electrical output signal. The target temperature is measured from the signal by a positioned downstream electronic measurement system. In order to reduce the temperature gradient in the sensor 14, the sensor housing 16 is thermally coupled to the waveguide 12 by means of thermal coupling devices 24, 28, 30, so that the waveguide 12 is formed of the sensor housing facing radiation. It is arranged in direct thermal contact with the top surface and its opposite bottom surface. Preferably, the thermal coupling devices 24, 28, 30 made of a material having good thermal conductivity cover the entire surface of the corresponding faces of the sensor housing 16. The invention also relates to a method for reducing the temperature gradient of the housing of the radiation sensor 14. The probe tip 10 according to the present invention enables accurate temperature measurement even when the temperature rise is irregular. In addition, the tip is small, lightweight and compact, allowing the manufacture of an easy to handle and use radiation thermometer such as those commonly used to measure the temperature inside the ear.

Method and apparatus for measuring substrate temperatures

A method of correcting a temperature probe reading in a thermal processing chamber for heating a substrate, including the steps of heating the substrate to a process temperature and using a first, a second and a third probe to measure the temperature of the substrate. The first probe has a first effective reflectivity and the second probe has a second effective reflectivity. The first probe produces a first temperature indication, the second probe produces a second temperature indication and the third probe produces a third temperature indication. The first and second effective reflectivities may be different. From the first and second temperature indications, a corrected temperature reading for the first probe may be derived, wherein the corrected temperature reading is a more accurate indicator of an actual temperature of the substrate than an uncorrected readings produced by both the first and second probes. A corrected temperature reading for the third probe may be derived by adjusting the temperature correction calculated for the first probe according to the measured emissivity sensitivity associated with the environment of the third probe to provide a corrected temperature reading that is a more accurate indicator of an actual temperature of the substrate in the environment of the third probe. An apparatus for carrying out the method is also disclosed.

Self-calibrating temperature probe

A probe for measuring the temperature of a substrate in a substrate processing chamber. The probe includes a light pipe, one end of which is inserted into the processing chamber. The other end of the light pipe is connected to a bifurcated optical fiber. A light source is optically coupled to one branch of the optical fiber, and a pyrometer is optically coupled to another branch. To self-calibrate the probe, an object of stable reflectivity, e.g., a gold-plated wafer, is inserted into the chamber, the light source is activated, and the intensity of light reflected from the object is measured by the pyrometer.

Apparatus for substrate temperature measurement using a reflecting cavity and detector

A temperature sensor for measuring a temperature of a substrate in a thermal processing chamber is described. The chamber includes a reflector forming a reflecting cavity with a substrate when the substrate is positioned in the chamber. The temperature sensor includes a probe having an input end positioned to receive radiation from the reflecting cavity, and a detector optically coupled to an output end of the probe. The radiation entering the probe includes reflected radiation and non-reflected radiation. The detector measures an intensity of a first portion of the radiation entering the probe to generate a first intensity signal and measures an intensity of a second portion of the radiation entering the probe to generate a second intensity signal. The detector is configured so that a ratio of the reflected radiation to the non-reflected radiation is higher in the first portion than the second portion. The two intensity signals are used to calculate the temperature and emissivity of the substrate.

Thermopile infrared sensor structure with a high filling level

填充有介质(15)的外壳中的具有高填充水平的热电堆红外线传感器结构由承载基板(11)构成，所述承载基板(11)具有至外部的电连接件(28,28’)并且用光学组件(13)进行密封，其中，对所述外壳中的所述承载基板(11)施加传感器芯片(14)，所述芯片具有多个热电传感器元件结构(16)，所述多个热电传感器元件结构(16)的所谓的“热接触件”(10)位于跨过具有良好导热性的硅承载体(24)中的各个腔体(9)伸展的单独的薄膜(3)上，其中，“冷接触件”(25)位于所述硅承载体(24)上或者所述硅承载体(24)的附近。本发明要解决的问题是详细说明一种热电堆红外线阵列传感器(传感器单元)，该传感器具有小芯片尺寸，具有高的热分辨和特别高的填充水平。该传感器优选地意在工作在具有正常压力或者减小的压力的气体中，并且意在能够在无需用于密封外壳的复杂技术的情况下在超高真空下以划算的方式大量生产。这凭借如下事实得以实现：辐射收集器结构(17)位于跨越腔体(9)的传感器元件结构(16)的每个单独的薄膜(3)的上方。

A safety system for a laser-beam utilising facility

Method for measuring temperature of furnace wall in coke carbonizing chamber

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Device for in-situ temperature measurement of a sample in the pressure vessel

pressure vessel

Druckbehälter (1) zur Aufnahme von zu beheizenden Proben (P), wobei der Druckbehälter (1) eine verschließbare Reaktionskammer (2) als Druckraum zum Auslösen und/oder Fördern chemischer und/oder physikalischer Druckreaktionen aufweist, und wobei der Druckbehälter (1) einen Mikrowellen-durchlässigen Bereich (80) aufweist, über den Mikrowellen in die Reaktionskammer (2) eingekoppelt werden können, dadurch gekennzeichnet, dass sich ein hohles Lichtleitrohr (70) von dem Mikrowellendurchlässigen Bereich (80) zu einem außerhalb des Druckraumes angeordneten Infrarotsensor (90) erstreckt, über das die von den beheizten Proben (P) in der Reaktionskammer (2) emittierte Infrarotstrahlung während einer Druckreaktion zum Infrarotsensor (90) geleitet wird, und in dem Mikrowellen-durchlässigen Bereich (80) zwischen Reaktionskammer (2) und Lichtleitrohr (70) und vorzugsweise an der Reaktionskammer (2) anliegend ein infrarotdurchlässiges Druckaufnahmeteil (71) vorgesehen ist, um das Lichtleitrohr (70) im Mikrowellen-durchlässigen Bereich (80) abzustützen. Pressure vessel (1) for receiving samples to be heated (P), wherein the pressure vessel (1) has a closable reaction chamber (2) as a pressure chamber for triggering and / or conveying chemical and / or physical pressure reactions, and wherein the pressure vessel (1) Microwave-permeable region (80) can be coupled via the microwaves in the reaction chamber (2), characterized in that a hollow Lichtleitrohr (70) from the microwave transparent region (80) to an out of the pressure chamber arranged infrared sensor (90) extends, over which the infrared radiation emitted from the heated samples (P) in the reaction chamber (2) is passed during a pressure reaction to the infrared sensor (90), and in the microwave-transmissive region (80) between the reaction chamber (2) and Lichtleitrohr (70 ) and preferably to the reaction chamber (2) adjacent an infrared-transmitting pressure receiving part (71) is provided to the light guide tube (70) in ...

Pressure vessel

The tank (1) has a closable reaction chamber (2) formed as a pressure chamber for triggering and/or conveying chemical and/or physical pressure reactions at samples (P) to be heated. A hollow light tube (70) extends from a microwave-permeable region (80) to an infrared sensor (90) that conveys infrared radiation emitted by heated samples in the chamber during a pressure reaction at the sensor. An infrared-permeable pressure receiving part (71) is provided in the microwave-permeable region between the chamber and light tube, lies against the chamber and supports the tube in the region.

Pressure vessel

Die Erfindung betrifft einen Druckbehälter (1) zur Aufnahme von zu beheizenden Proben (P), wobei der Druckbehälter (1) eine verschließbare Reaktionskammer (2) als Druckraum zum Auslösen und/oder Fördern chemischer und/oder physikalischer Druckreaktionen aufweist, und wobei der Druckbehälter (1) einen Mikrowellen-durchlässigen Bereich (80) aufweist, über den Mikrowellen in die Reaktionskammer (2) eingekoppelt werden können, dadurch gekennzeichnet, dass sich ein hohles Lichtleitrohr (70) von dem Mikrowellen-durchlässigen Bereich (80) zu einem außerhalb des Druckraumes angeordneten Infrarotsensor (90) erstreckt, über das die von den beheizten Proben (P) in der Reaktionskammer (2) emittierte Infrarotstrahlung während einer Druckreaktion zum Infrarotsensor (90) geleitet wird, und in dem Mikrowellen-durchlässigen Bereich (80) zwischen Reaktionskammer (2) und Lichtleitrohr (70) und vorzugsweise an der Reaktionskammer (2) anliegend ein infrarotdurchlässiges Druckaufnahmeteil (71) vorgesehen ist, um das Lichtleitrohr (70) im Mikrowellen-durchlässigen Bereich (80) abzustützen. Ferner betrifft die Erfindung einen vergleichbaren Druckbehälter, in dem auch auf andere Weise die Proben erhitzt werden können sowie Verfahren zur Temperaturmessung von in einem Druckbehälter aufgenommenen, zu beheizenden Proben. The invention relates to a pressure vessel (1) for receiving samples (P) to be heated, wherein the pressure vessel (1) has a closable reaction chamber (2) as a pressure chamber for triggering and / or conveying chemical and / or physical pressure reactions, and wherein the pressure vessel (1) has a microwave-transmissive region (80), can be coupled via the microwaves in the reaction chamber (2), characterized in that a hollow Lichtleitrohr (70) from the microwave-transmissive region (80) to one outside the Pressure chamber disposed infrared sensor (90), via which the infrared radiation emitted by the heated samples (P) in the reaction chamber (2) is passed during a pressure ...

Process for measuring or regulating the temperature of a graphite tube

Infrared sensor and radiation thermometer

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to an fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Device for measuring the temperature inside the reactor

Apparatus for measuring temperature inside reactors

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using a n optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) ca n pass through the blind flange and that the receiving end of the light conduit extends into th e feed injector such that the light receiving end of the light conduit is in optical alignme nt with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to a fiber optic cab le (28a or 28b) and thus to an optical pyrometer.

APPARATUS FOR MEASURING INTERNAL TEMPERATURE IN REACTORS

APPARATUS FOR MEASURING TEMPERATURE INSIDE REACTORS.

Un aparato para medir la temperatura del interior de un reactor, que comprende: un inyector (2) de alimentación que incluye una punta (6) del inyector de alimentación que tiene una abertura, estando la punta del inyector de alimentación en comunicación de fluido con una entrada (8) de alimentación y un conectador (4) de brida, estando el conectador de brida en alineación óptica con la abertura de la punta (6) del inyector alimentación; una brida ciega (10) dimensionada para ajustarse sobre el conectador de brida del inyector de alimentación y de esta manera formar una junta resistente a la presión de gas; un primer conducto de luz (22), teniendo el primer conducto de luz un extremo de recepción de luz y un extremo de transmisión de luz (24).

Device for temperature measurement inside reactors

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to a fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Flame sensor

本发明涉及一种火焰传感器。提供了一种火焰传感器设备，其包括用于感测燃烧室内的火焰的具体特征的传感器。传感器包括碳化硅光电二极管，并且传感器与燃烧室间隔开一距离。另外，光纤线缆组件在传感器与燃烧室之间延伸。光纤线缆组件可将火焰的具体特征从燃烧室传送至传感器。光纤线缆组件包括为填充有惰性气体的密封阵列的一部分。另外，还提供了一种感测火焰的具体特征的方法。

Apparatus for measuring temperature in a pressurized reactor

OPTICAL TEMPERATURE SENSOR.

L'invention concerne un capteur optique agencé de façon à minimiser les erreurs de mesure résultant du rayonnement thermique émis par des organes internes du capteur. Le capteur comporte une sonde tubulaire (1) dont l'extrémité avant contient un élément en saphir (24) dans une chambre de stagnation (23) où le gaz chaud à mesurer circule et chauffe un revêtement thermiquement émetteur (25) dudit élément (24). Une lentille (36) focalise le rayonnement sur une extrémité d'un câble à fibres optiques (2) logé dans l'arrière de la sonde et refroidi par de l'air comprimé circulant dans la sonde. Cet air s'échappe par un orifice (35) situé en arrière d'une barrière thermique transparente (31) qui protège l'élément en saphir (24) contre le refroidissement. Application à la mesure de température dans une turbine à gaz. The invention relates to an optical sensor arranged to minimize measurement errors resulting from thermal radiation emitted by internal components of the sensor. The sensor comprises a tubular probe (1) whose front end contains a sapphire element (24) in a stagnation chamber (23) where the hot gas to be measured circulates and heats a thermally emitting coating (25) of said element (24). ). A lens (36) focuses the radiation on one end of an optical fiber cable (2) housed in the rear of the probe and cooled by compressed air flowing through the probe. This air escapes through an orifice (35) located behind a transparent thermal barrier (31) which protects the sapphire element (24) against cooling. Application to temperature measurement in a gas turbine.

Apparatus for measuring temp. inside reactor

使用光学高温计测量气化反应器温度的装置,包括一个可接纳光导管的供料喷射器。喷射器(2)包括有一开口的喷射器头(6)。喷射器头与供料进口(8)和法兰连接器(4)流体相通,法兰连接器(4)与喷射器头的开口光学对齐。一个盲法兰装在供料喷射器的法兰接头上形成一个耐气压的密封。压力密封装置(12)装在盲法兰中使光导管(22a,22b)可穿过盲法兰,光导管的接收端延伸入供料喷射器中使光导管的光接收端与喷射器头的开口光学对齐。一个光接头(26a,26b)起到光导管的传光端到光缆及到光学高温计的光连接。

APPARATUS FOR MEASURING INTERNAL TEMPERATURE IN REACTORS

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to an fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to a fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Apparatus for measuring temperature inside reactors

An apparatus for measuring the temperature of a gasification reactor using an optical pyrometer is disclosed. In one embodiment the apparatus may include a feed injector adapted to receive light conduits. The feed injector (2) includes a feed injector tip (6) having an opening, the feed injector tip being in fluid communication with a feed inlet (8) and a flange connector (4), the flange connector being in optical alignment with the opening of the feed injector tip. A blind flange (10) should be sized to fit on the flange connector of the feed injector and thereby form a gas pressure resistant seal. A pressure sealing gland (12) is fitted in the blind flange such that a light conduit (22a or 22b) can pass through the blind flange and that the receiving end of the light conduit extends into the feed injector such that the light receiving end of the light conduit is in optical alignment with the opening of the feed injector tip. An optical coupler (26a or 26b) functions as an optical connection between the light transmitting end of the light conduit to a fiber optic cable (28a or 28b) and thus to an optical pyrometer.

Device for temperature measurement inside reactors

Infrared radiation gauge

Probe for radiation thermometer

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Device for measuring temperature and method of measuring temperature of molten metal

FIELD: measuring equipment.SUBSTANCE: invention relates to measurement equipment and can be used for measuring temperature of molten metal. Disclosed is a temperature measurement device, which comprises a temperature-sensitive element, supporting tube (2), connection tube (4) and an exhaust structure. At that, temperature-sensitive element contains metal-ceramic tube (1), one end of which is closed, and the other one is open, wall thickness of metal-ceramic tube (1) is less than thickness of wall of supporting tube (2) and metal-ceramic tube (1) is configured to sense temperature of molten metal and emit stable heat energy of radiation based on the principle of cavity of absolutely black body when in molten metal. Open end of metal-ceramic tube (1) is rigidly connected to one end of supporting tube (2), metal-ceramic tube (1) is connected to supporting tube (2), and other end of supporting tube (2) is rigidly connected to connecting tube (4). Exhaust structure is configured to remove smoke contained inside metal-ceramic tube (1) and supporting tube (2). When the temperature of the molten metal is measured, the temperature measuring device is inserted into the molten metal to a depth greater than or equal to 8 times the outer diameter of the metal-ceramic tube.EFFECT: providing continuous measurement of molten metal temperature with high rate of response.15 cl, 10 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 722 479 C1 (51) МПК G01J 5/02 (2006.01) G01J 5/00 (2006.01) G01K 1/12 (2006.01) G01K 13/02 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК G01J 5/004 (2020.02); G01J 5/02 (2020.02); G01K 1/12 (2020.02); G01K 2013/026 (2020.02) (21)(22) Заявка: 2020103923, 30.06.2017 (24) Дата начала отсчета срока действия патента: Дата регистрации: 01.06.2020 (45) Опубликовано: 01.06.2020 Бюл. № 16 (56) Список документов, цитированных в отчете о поиске: CN 205861217 U, 04.01.2017. CN 2729672 Y, 28.09.2005. CN 2729668 Y, ...

Method for measuring temperature distribution in furnace in hot hydrostatic pressing apparatus

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Infrared temperature measurement meter and method for measuring temperature of energy area

本申请公开了一种红外测温仪以及一种用于测量能量区域的温度的方法。该红外测温仪包括：分束器，用于将来自于待测能量区域的入射光束分成红外光束和可见光束；红外检测器，用于检测所述红外光束并根据所检测的红外光束生成表示所述待测能量区域的温度的信号；以及瞄准器，其具有光学模组，所述光学模组用于生成反射的指示图像，并且透射所述可见光束以在观察窗处生成目标图像，其中所述瞄准器用于将所述指示图像重叠在所述观察窗处的目标图像上，以将所述红外检测器对准所述待测能量区域。本申请的红外测温仪和测量方法更便于操作人员对准待测能量区域，从而提高测量的准确性。

Device for measuring surface temperature distribution of rotor

(57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。

Radial thermometer

(57)【要約】 【課題】 低コストでありながらプローブカバーの装着 を確実に実行させることができる放射体温計を提供す る。 【解決手段】 体温計本体１に突設され、基部にフラン ジ部１１を有し、体温測定時にプローブカバー３０が装 着されるプローブ１０のフランジ部１１に、プローブカ バー装着を促す意味の標示４０（図４参照）を施した。

Planar thermopile infrared microsensor

An IR sensor comprises a heat sink substrate ( 10 ) having portions ( 12 ) of relatively high thermal conductivity and portions ( 14 ) of relatively low thermal conductivity and a planar thermocouple layer ( 16 ) having a hot junction ( 18 ) and a cold junction ( 20 ), with the hot junction ( 18 ) located on a portion ( 14 ) of the heat sink substrate with relatively low thermal conductivity. A low thermal conductivity dielectric layer ( 22 ) is provided over the thermocouple layer ( 16 ), and has a via ( 24 ) leading to the hot junction ( 18 ). An IR reflector layer ( 26 ) covers the low thermal conductivity dielectric layer ( 22 ) and the side walls of the via ( 24 ). An IR absorber ( 30; 30′ ) is within the via. This structure forms a planar IR microsensor which uses a structured substrate and a dielectric layer to avoid the need for any specific packaging. This design provides a higher sensitivity by providing a focus on the thermocouple, and also gives better immunity to gas conduction and convection.

Planar thermopile infrared microsensor

一种红外线传感器，包含一具有导热率相对较高部分(12)及导热率相对较低部分(14)的散热基材(10)及一具有热接点(18)及冷接点(20)的平面热电偶层(16)，其中热接点(18)位于散热基材的导热率相对较低的部分(14)上。低导热介电层(22)位于热电偶层(16)上方，且具有一通孔(24)通向热接点(18)。一红外线反射层(26)覆盖低导热介电层(22)及通孔(24)的侧壁。一红外线吸收器(30；30’)位于通孔中。此结构形成一平面红外线微传感器，其使用一结构化基材及一介电层，以避免需要任何特定封装。此设计通过聚焦于热电偶而具有较高的灵敏度，且对气体传导及对流有较佳的抗扰性。

Planar thermopile infrared sensor

Infrarotsensor, umfassend: – ein Wärmeableitersubstrat (10) mit Bereichen (12) relativ hoher thermischer Leitfähigkeit und Bereichen (14) relativ niedriger thermischer Leitfähigkeit; – eine ebene Thermoelementschicht (16) mit einem heißen Übergang (18) und einem kalten Übergang (20), welcher heiße Übergang (18) auf einem Bereich (14) des Wärmeableitersubstrats mit relativ niedriger thermischer Leitfähigkeit angeordnet ist; – eine dielektrische Schicht (22) mit niedriger thermischer Leitfähigkeit, die über der Thermoelementschicht (16) angeordnet ist und ein Durchgangsloch (24) aufweist, das zu dem heißen Übergang (18) führt; – eine IR-Reflektorschicht (26), welche die dielektrische Schicht (22) niedriger thermischer Leitfähigkeit und die Seitenwände des Durchgangslochs (24) abdeckt, wobei eine Öffnung in der IR-Reflektorschicht (26) an der Stelle des heißen Übergangs vorgesehen ist; – und einen IR-Absorber (30; 30') innerhalb des Durchgangslochs (24). An infrared sensor comprising: a heat sink substrate (10) having relatively high thermal conductivity regions (12) and relatively low thermal conductivity regions (14); A planar thermocouple layer (16) having a hot junction (18) and a cold junction (20), which hot junction (18) is disposed on a region (14) of the relatively low thermal conductivity heat sink substrate; A low thermal conductivity dielectric layer (22) disposed over the thermocouple layer (16) and having a through hole (24) leading to the hot junction (18); An IR reflector layer (26) covering the low thermal conductivity dielectric layer (22) and the sidewalls of the via (24) with an opening in the IR reflector layer (26) at the hot junction location; And an IR absorber (30; 30 ') within the through-hole (24).

Multichannel infrared detector with optical concentrators for each channel

The present invention comprises a system and method for detecting multiple wavelength bands of infrared radiation. The present invention incorporates an optical concentrator or "optical funnel" to increase the energy density on the detection elements and discrete filters mounted in the funnels and a mounting structure for individual detector elements. An apparatus in accordance with the present invention is an advance over conventional infrared detector assemblies in several areas. The apparatus in accordance with the present invention provides a unified means for mounting detectors, optical concentrators and infrared filters. It also provides an efficient means for electrical connection to the detector elements. The present invention provides a mounting structure for the detectors bonding them directly to the body of the optical funnel and passing light into them from the "backside" of the detector elements. The present invention prevents cross talk by mounting the detector elements at the focused end of individual optical concentrators.

Integrated light concentrator

An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.

Planar thermopile infrared sensor

Infrarotsensor umfassend: ein Wärmeableitersubstrat (10) mit Bereichen (12) relativ hoher thermischer Leitfähigkeit und Bereichen (14) relativ niedriger thermischer Leitfähigkeit; eine ebene Thermoelementschicht (16) mit einem heißen Übergang (18) und einem kalten Übergang (20), welcher heiße Übergang (18) auf einem Bereich (14) des Wärmeableitersubstrats mit relativ niedriger thermischer Leitfähigkeit angeordnet ist; eine dielektrische Schicht (22) mit niedriger thermischer Leitfähigkeit, die über der Thermoelementschicht (16) angeordnet ist und ein Durchgangsloch (24) aufweist, der zu dem heißen Übergang (18) führt; eine IR-Reflektorschicht (26), welche die dielektrische Schicht (22) niedriger thermischer Leitfähigkeit und die Seitenwände des Durchgangslochs (24) abdeckt, wobei eine Öffnung in der IR-Reflektorschicht (26) an der Stelle des heißen Übergangs vorgesehen ist; und einen IR-Absorber (30; 30') innerhalb des Durchgangskontaktes.

Planar thermopile infrared microsensor

一种红外线传感器，包含一具有导热率相对较高部分(12)及导热率相对较低部分(14)的散热基材(10)及一具有热接点(18)及冷接点(20)的平面热电偶层(16)，其中热接点(18)位于散热基材的导热率相对较低的部分(14)上。低导热介电层(22)位于热电偶层(16)上方，且具有一通孔(24)通向热接点(18)。一红外线反射层(26)覆盖低导热介电层(22)及通孔(24)的侧壁。一红外线吸收器(30；30’)位于通孔中。此结构形成一平面红外线微传感器，其使用一结构化基材及一介电层，以避免需要任何特定封装。此设计通过聚焦于热电偶而具有较高的灵敏度，且对气体传导及对流有较佳的抗扰性。

Planar Thermopile Infrared Microsensor

An IR sensor comprises a heat sink substrate ( 10 ) having portions ( 12 ) of relatively high thermal conductivity and portions ( 14 ) of relatively low thermal conductivity and a planar thermocouple layer ( 16 ) having a hot junction ( 18 ) and a cold junction ( 20 ), with the hot junction ( 18 ) located on a portion ( 14 ) of the heat sink substrate with relatively low thermal conductivity. A low thermal conductivity dielectric layer ( 22 ) is provided over the thermocouple layer ( 16 ), and has a via ( 24 ) leading to the hot junction ( 18 ). An IR reflector layer ( 26 ) covers the low thermal conductivity dielectric layer ( 22 ) and the side walls of the via ( 24 ). An IR absorber ( 30; 30′ ) is within the via. This structure forms a planar IR microsensor which uses a structured substrate and a dielectric layer to avoid the need for any specific packaging. This design provides a higher sensitivity by providing a focus on the thermocouple, and also gives better immunity to gas conduction and convection.

Thermopile infrared sensor structure with high fill level

具有高填充水平的热电堆红外线传感器结构。填充有介质(15)的外壳中的具有高填充水平的热电堆红外线传感器结构由承载基板(11)构成，所述承载基板(11)具有至外部的电连接件(28,28’)并且用光学组件(13)进行密封，其中，对所述外壳中的所述承载基板(11)施加传感器芯片(14)，所述芯片具有多个热电传感器元件结构(16)，所述多个热电传感器元件结构(16)的所谓的“热接触件”(10)位于跨过具有良好导热性的硅承载体(24)中的各个腔体(9)伸展的单独的薄膜(3)上，其中，“冷接触件”(25)位于所述硅承载体(24)上或者所述硅承载体(24)的附近。