Improvements in indicating system for ovens

... 547,625. Signalling. WILCOLATOR CO. Aug. 12, 1941, No. 10238. Convention date, Sept. 25, 1940. [Class 118 (ii)] A gas oven or other heating appliance is fitted with an indicating device comprising a thermostat placed near the flame and operating a lamp switch whereby a light is shown when the gas is burning, a second thermostat, partially shielded by the first, operating a second light only when the flame is high. The thermostats 38, 38a, operated by radiation from the burner 11, are carried in a casing 40 fitted with a spherical part 47 adjustably held in a bracket 48 on the oven wall. The oven may be fitted with a regulator as described in Specification 492,687, [Group XXIX], and with a safety pilot, as described in U.S.A. Specification 2,064,909.

Micromachined infrared sensitive pixel and infrared imager including same

Appareil thermométrique.

Process and attack force by the calorific rays of the thermostats thermal switches

System of detection of radiant energy

THERMO-MECHANICAL INFRARED DETECTOR WITH OPTICAL READING

Détecteur infrarouge comprenant un ou plusieurs pixels (10) formés sur un substrat (120), où chaque pixel comprend : - un élément d'absorption (110), monté suspendu au-dessus du substrat, apte à s'échauffer en réaction l'absorption d'un rayonnement infrarouge ; - un élément de soutien (130) pour maintenir l'élément d'absorption suspendu au-dessus du substrat, qui comprend au moins un élément de déformation mécanique (133) qui est en contact thermique avec l'élément d'absorption et apte à se fléchir en réaction à un échauffement ; - une source lumineuse (140) et un photo-détecteur (150) agencés sous l'élément d'absorption (110), dans ou sur le substrat (120); et - une première surface réfléchissante (190), pour réfléchir vers le photo-détecteur au moins une partie d'un rayonnement lumineux émis par la source lumineuse, et solidaire de l'élément de déformation mécanique. Le détecteur selon l'invention forme un détecteur infrarouge thermomécanique à lecture optique, offrant une grande compacité et de faibles contraintes d'alignement. Infrared detector comprising one or more pixels (10) formed on a substrate (120), where each pixel comprises: - an absorption element (110), mounted suspended above the substrate, capable of heating up in reaction absorption of infrared radiation; - a support element (130) for holding the absorption element suspended above the substrate, which comprises at least one mechanical deformation element (133) which is in thermal contact with the absorption element and capable of flex in response to heating; - a light source (140) and a photo-detector (150) arranged under the absorption element (110), in or on the substrate (120); and - a first reflecting surface (190), for reflecting towards the photo-detector at least part of a light radiation emitted by the light source, and integral with the mechanical deformation element. The detector according to the invention forms a thermomechanical ...

RADIATION DETECTING DEVICE

Radiation-detection devices

Radiation detectors are disclosed that include at least one element (pixel). In a pixel, a desired positional relationship between two "effecting" elements is maintained regardless of changes in temperature or other prevailing variable. The detectors can be "electrical capacitance" or "optical-readout" types. A pixel of the electrical capacitance type includes two electrodes (reference electrode and response electrode) that face each other and have a set gap therebetween. The electrodes are attached to respective displaceable members (configured as thermal bimorphs) having identical structures. A pixel of the optical readout type includes a half-mirror and a reflector that face each other and have a set gap therebetween. The half-mirror and reflector are attached to respective displaceable members. Radiation is absorbed by a radiation absorber that transfers the heat to certain displaceable members that bend to tilt accordingly. Other displaceable members are not heated and do not bend.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Thermal Imager Using Metamaterials

An apparatus and method are disclosed for detecting terahertz radiation at room temperature. A detecting pixel includes a sub-wavelength split-ring resonator, and is mechanically coupled to (but thermally decoupled from) a substrate via a cantilever formed from two materials that have a significant mismatch in their thermal expansion coefficients. Incident radiation causes the split-ring resonator to resonate, thereby generating heat that is transferred to the cantilever, causing the cantilever to flex. An optical readout system includes a secondary light source, such as a laser, that shines on a reflective surface on the pixel, whereby a photodiode detects the reflected light and permits calculation of a relative deflection of the pixel in the nanometer range. An exemplary detector has a noise equivalent power rating of approximately 60 pW/Hz.

Apparatus and method for detecting electromagnetic radiation using electron photoemission in a micromechanical sensor

Integrated calorimetric spectrometer

Radio-pyrometer with dilation

DEVICE AND SYSTEM OF MEASUREMENT OF the POWER Of a THERMAL RADIATION

Energy detector system

DEVICE AND SYSTEM OF MEASUREMENT OF the POWER Of a THERMAL RADIATION

Le dispositif de mesure de puissance d'un rayonnement thermique comprend unélément sensible tel qu'un filament électroconducteur 6 monté de façon à pouvoir exécuter un mouvement à une vitesse stabilisée dans le rayonnemnt thermique 4. Ledit élément sensible est relié à un appareil 7 enregistrant ses variations dues aux variations de la température provoquées par l'action du rayonnement thermique. Le système de mesure de la puissance d'un rayonnement thermique est constitué par au moins trois dispositifs de mesure 36 de puissance de rayonnement thermique du type ci-dessus. L'invention peut être appliquée dans différentes branches de la technique, par exemple à la mesure de la température de flammes, de flux de plasma, dejets de gaz et de liquide, et à la mesure de la puissance de rayonnements laser. The device for measuring the power of thermal radiation comprises a sensitive element such as an electrically conductive filament 6 mounted so as to be able to perform a movement at a stabilized speed in the thermal radiation 4. Said sensitive element is connected to an apparatus 7 recording its measurements. variations due to temperature variations caused by the action of thermal radiation. The thermal radiation power measuring system consists of at least three thermal radiation power measuring devices 36 of the above type. The invention can be applied in various branches of the art, for example to the measurement of the temperature of flames, of plasma flow, of gas and liquid jets, and to the measurement of the power of laser radiation.

Infrared imaging apparatus

A representative embodiment of the invention provides an infrared (IR) imaging system adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates, (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

ELECTROMAGNETIC AND NUCLEAR RADIATION DETECTOR USING MICROMECHANICAL SENSORS

Electromagnetic and nuclear radiation is detected by micromechanical sensors (20) that can be coated with various interactive materials. As the micromechanical sensors (20) absorb radiation, the sensors (20) bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be detected with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers (20) coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers (20) from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever (20) bends due to stress and its resonance frequency shifts due to changes ...

BOLOMETER PIXEL TRIGGER

A bolometer pixel trigger array includes a substrate, an electrically conductive contact pad formed on the substrate, and bolometer formed on the substrate. The bolometer includes at least one thermally conductive trigger arm having a fixed end coupled to a portion of the bolometer and an electrically conductive free end configured to deflect with respect to the fixed end. At least one trigger arm establishes different operating states of the bolometer pixel trigger in response to the at least one trigger arm realizing different temperatures. The different operating states are configured to change an electrical connection between the at least one trigger arm and the contact pad.

Durch Waermestrahlung betaetigte elektrische Kontaktvorrichtung

MICRO-SYSTEM-TECHNICAL ELEMENT WITH A UNDER THE INFLUENCE OF CHANGES OF TEMPERATURE DUCTILE MECHANISM

Micromechanical device for infrared sensing

本发明描述了一微机械装置，它包括一改进的传感元件和一个改进的弯曲元件。传感元件包括比相关技术更薄、更轻、更扁平的多层结构。弯曲元件包括由分别响应红外光源照明以致扭曲该传感元件的结构。微机械像素可以设置形成两维的红外感光像素阵列。微机械象素的阵列可以应用到安全和监视、消防、汽车安全系统和工业监测领域的成像装置。

Photo-sensitive mems structure

Thermal transducer for silencers or catalytic pots - enables motor vehicle pollution to be controlled by temp control

BOLOMETER HAS FREQUENTIAL DETECTION

Bolomètre (2) comportant au moins un microsystème ou nanosystème électromécanique, ledit microsystème ou nanosystème comportant un support (8) et une masse mobile (4) suspendue par des poutres (6) au dessus du support (8), ladite masse mobile formant un absorbeur d'un flux optique (F), des électrodes d actionnement (12) destinées à mettre en vibration la masse mobile (4) et disposées latéralement par rapport à la masse mobile et des électrodes de détection (14) de la variation de la fréquence de vibration de ladite masse mobile (4) disposées latéralement par rapport à la mase mobile (4). Bolometer (2) comprising at least one microsystem or electromechanical nanosystem, said microsystem or nanosystem comprising a support (8) and a mobile mass (4) suspended by beams (6) above the support (8), said mobile mass forming a absorber of an optical flux (F), actuation electrodes (12) for vibrating the moving mass (4) and arranged laterally with respect to the moving mass and detection electrodes (14) of the variation of the vibration frequency of said mobile mass (4) arranged laterally with respect to the mobile mase (4).

Universal radiometer

Radio pyrometer expansion

THERMO-OPTIC INFRARED PIXEL AND FOCAL PLANE ARRAY

A surface plasmon polariton (SPP) pixel structure is provided. The SPP pixel structure includes a coupling structure that couples the probing light into the SPP mode by matching the in-plane wave vector by changing the refractive index of the coupling structure using thermo-optic effects to vary the coupling strength of the probing light into the SPP mode. An absorber layer is positioned on the coupling structure for absorbing incident infrared/thermal radiation being detected.

Thermal isolation using vertical structures

This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

On-board radiation sensing apparatus

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter ...

THERMO-OPTIC INFRARED PIXEL AND FOCAL PLANE ARRAY

A surface plasmon polariton (SPP) pixel structure is provided. The SPP pixel structure includes a coupling structure that couples the probing light into the SPP mode by matching the in-plane wave vector by changing the refractive index of the coupling structure using thermo-optic effects to vary the coupling strength of the probing light into the SPP mode. An absorber layer is positioned on the coupling structure for absorbing incident infrared/thermal radiation being detected.

DETECTEUR THERMIQUE A MEMBRANE SUSPENDUE COMPORTANT UNE PARTIE DEFORMABLE DE COURT-CIRCUIT THERMIQUE

L'invention porte sur un détecteur thermique comportant un substrat (10), une membrane absorbante (20) comportant une partie fixe (21) et une partie déformable (30), celle-ci comportant un alliage A mémoire de forme, et étant disposée vis-à-vis du substrat de sorte que son extrémité libre (32) est au contact du substrat (1o) A la température de contact T c supérieure A la température austénitique initiale A s.

For imaging system passive detector

THERMAL SENSOR FOR DETECTING ELECTROMAGNETIC RADIATION

Capteur thermique pour saisir un rayonnement électromagnétique , notamment un rayonnement thermique comportant une matrice de pixels (1) composée d'un grand nombre de pixels (10), ayant un matériau de substrat (11) et un matériau absorbant (12) sur le matériau de substrat (11). Le capteur thermique comporte un premier bras de bimétal (13) fixé par un premier point de fixation (15) à la surface du matériau de substrat (11) et un second bras de bimétal (14) fixé en un second point de fixation (16) à la surface du matériau absorbant (12), ces points de fixation (15, 16) se trouvant dans la région du centre de gravité surfacique (S) du pixel (10).

Compensated infrared ray detector

Imaging detector array with optical readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Sensors based on surface plasmon resonance

Тепловой детектор с подвешенной мембраной, содержащий деформируемую часть для обеспечения теплового короткого замыкания

РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2019 138 079 A (51) МПК H01L 35/00 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ЗАЯВКА НА ИЗОБРЕТЕНИЕ (21)(22) Заявка: 2019138079, 26.11.2019 (71) Заявитель(и): Комиссариат а л'энержи атомик э о энержи альтернатив (FR) Приоритет(ы): (30) Конвенционный приоритет: 30.11.2018 FR FR1872140 Адрес для переписки: 191036, Санкт-Петербург, а/я 24, "НЕВИНПАТ", А.В. Поликарпову Стр.: 1 A 2 0 1 9 1 3 8 0 7 9 R U A (57) Формула изобретения 1. Тепловой детектор (1), выполненный с возможностью детектирования электромагнитного излучения, содержащий: подложку (10), мембрану (20), поглощающую электромагнитное излучение, теплоизолированную от подложки (10) и содержащую: зафиксированную детектирующую часть (21), содержащую термометрический преобразователь (26), деформируемую часть (30), обеспечивающую тепловое короткое замыкание, - содержащую зафиксированный конец (31), прикрепленный к зафиксированной детектирующей части (21), и противоположный свободный конец (32), - выполненную с возможностью деформации под воздействием изменения температуры поглощающей мембраны (20) таким образом, что свободный конец (32) деформируемой части (30) вступает в контакт с подложкой (10) при температуре TC контакта поглощающей мембраны (20), отличающийся тем, что деформируемая часть (30): содержит сплав с памятью формы, имеющий обратное мартенситное превращение мартенситной фазы в аустенитную фазу указанного сплава между температурами начала AS и конца AF аустенита, и прямое мартенситное превращение аустенитной фазы в мартенситную фазу между температурами начала MS и конца MF мартенсита, при этом температура конца AF аустенита выше температуры начала MS мартенсита, и расположена относительно подложки (10) таким образом, что свободный конец (32) находится в контакте с подложкой (10), когда температура TC контакта выше температуры начала AS аустенита. 2 0 1 9 1 3 8 0 7 9 (54) Тепловой детектор с подвешенной мембраной, содержащий деформируемую ...

APPARATUS AND SYSTEM FOR MEASURING POWER OF HEAT RADIATION

APPARATUS AND SYSTEM FOR MEASURING POWER OF HEAT RADIATION Abstract of the Disclosure An apparatus for measuring the power of a heat radia-tion, comprising a sensitive element implemented, for exam-ple, as an electrically conductive filament adapted to be displaced in a heat radiation flux at a stabilized speed. Connected to the sensitive element is a meter for register-ing the variations of the temperature of the sensitive ele-ment, resulted from the heat radiation. A system for measuring the power of a heat radiation, comprising at least three such apparatuses. The invention provides for a continuous operation of the proposed apparatus.

Improvements to radiation sensitive devices

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

Imaging Detector Array with Optical Readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Bi-material cantilevers with flipped over material sections and structures formed therefrom

A structure formed from one or more bi-material cantilevers, having a first portion and a second portion positioned end-to-end, wherein the first portion comprises a first material positioned on top of a second material, and wherein the second portion comprises the second material positioned on top of the first material.

MICROSYSTEM COMPONENT WITH A DEVICE DEFORMABLE UNDER THE INFLUENCE OF TEMPERATURE CHANGES

Improvements in or relating to Pyrometers.

30,478. Foster, C. E. Feb. 10, [Convention date]. Pyrometers.-The sensitive device 4 and the aperture 2 of the casing 3 are at conjugate foci of the condenser 6 so that, if when properly directed on the hot body x y this completely fills the aperture, no focusing is required. The device 4 may be shielded from direct rays by an interposed strip 7; and a ring 15 encircles the casing 1 at the point z where rays proceeding from the perimeter of the aperture to that of the condenser cross. A bimetallic strip cr mercury thermometer may be used instead of the thermo-couple as the sensitive member, which in some cases is situated at the side of the casing.

THERMAL DETECTOR WITH SUSPENDED MEMBRANE COMPRISING A DEFORMABLE PORTION OF A SHORT THERMAL CIRCUIT

Relay sensitive to the light

Calorimeter with radiations

Improvements brought to the means allowing to detect a radiant energy likely to be absorptive by a thermal switch, in particular a calorific energy

THERMAL SENSOR FOR DETECTING ELECTROMAGNETIC RADIATION

Capteur thermique pour capter le rayonnement électromagnétique , notamment le rayonnement thermique, comportant une matrice de pixels composée d'un ensemble de pixels (10), ayant un matériau de substrat (11) et une plaque absorbante (12), portée au-dessus du matériau de substrat (11) par des bras de bimétal (13, 14). Une bobine électrique (15) est prévue dans le montage sur le matériau de substrat (11), et la variation de la distance (d) entre la plaque absorbante (12) et le matériau de substrat (11) modifie une caractéristique électrique de la bobine (15). A thermal sensor for sensing electromagnetic radiation, including heat radiation, comprising a pixel array of a plurality of pixels (10), having a substrate material (11) and an absorbing plate (12), carried over the substrate material (11) by bimetal arms (13, 14). An electrical coil (15) is provided in the mounting on the substrate material (11), and the variation of the distance (d) between the absorber plate (12) and the substrate material (11) modifies an electrical characteristic of the coil (15).

INFRARED IMAGING APPARATUS WITH THERMALLY DISPLACABLE DETECTOR IPIXEL ARRAY AND OPTICAL INTERROGATION SYSTEM

Imaging detector array with optical readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Optical detectors using nulling for high linearity and large dynamic range

An infrared radiation detector includes a bolometer or micro-cantilever detector device which functions as a null detector in conjunction with electronic circuitry. The electronic circuitry senses a change in an output signal of the detector as the detector responds to infrared radiation incident upon the detector and provides a signal to a control element which provides a stimulus to the detector device to maintain the detector output signal at the same level. The element may be a piezoelectric element, a heater or a pair of electrodes and the corresponding stimulus may be stress, heat, or electrostatic change. The stimulus compensates for the effect of the infrared radiation and maintains the chosen detector output level at the same level. The nulling circuitry improves the linearity and dynamic range of the detector device.

PHOTO-SENSITIVE MEMS STRUCTURE

A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.

Thermostat

Thermal imaging detector array with optial readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Transducer apparatus for measuring variations in a physical variable

... 1,070,954. Measuring apparatus using radiation sensitive devices. INDUSTRIAL NUCLEONICS CORPORATION. May 21, 1964 [May 27, 1963], No. 21115/64. Heading G1A. Transducer apparatus for measuring variations in a physical variable includes means for effecting changes in the amount of radiation from a radioactive source reflected back to a detector in accordance with the variations. In one embodiment a radio-active source 28 mounted in a screening block 30 radiates towards a diaphragm 40. Energy reflected (or possibly back-scattered) from the diaphragm passes through a plurality of apertures 38 in a disc 32 supporting block 30 and falls on ionization chamber 34. The electrical output of the detector develops a voltage across resistor 44 which is amplified and indicated on meter 12. Movement of diaphragm 40 in accordance with the physical variable to be measured will produce a corresponding indication at 12. Figure 1 shows the diaphragm being flexed in accordance with fluid pressure applied through ...

Improvement with the infra-red detectors of rays with thermal switches

BOLOMETER SENSING FREQUENCY

SUSPENDED­MEMBRANE THERMAL DETECTOR COMPRISING A DEFORMABLE PART FOR THERMAL SHORT­CIRCUIT

BOLOMETER HAVING FREQUENCY DETECTION

Bolomètre (2) comportant au moins un microsystème ou nanosystème électromécanique, ledit microsystème ou nanosystème comportant un support (8) et une masse mobile (4) suspendue par des poutres (6) au dessus du support (8), ladite masse mobile formant un absorbeur d'un flux optique (F), des électrodes d'actionnement (12) destinées à mettre en vibration la masse mobile (4) et disposées latéralement par rapport à la masse mobile et des électrodes de détection (14) de la variation de la fréquence de vibration de ladite masse mobile (4) disposées latéralement par rapport à la mase mobile (4).

Infrared light detection array and method of producing the same

An infrared light detection array with a plurality of infrared light detectors, said infrared light detectors each comprising: a supporting leg fixed to said substrate at one end, having a laminated structure of an insulation layer and a wiring layer; and a heat insulation structure portion supported by said supporting leg, comprising an insulation layer having a first surface to serve as a surface of incidence for infrared light to impinge on and a second surface to serve as a surface of incidence for reading light to impinge on, a reflection film which is formed on said second surface of said insulation layer, and a resistor connected with said wiring layer, and as said supporting legs heated up to a detection temperature by said infrared light reversibly warp, said infrared light detectors change the reflection direction of said reading light impinging upon said reflection films.

Electromagnetic and nuclear radiation detector using micromechanical sensors

Electromagnetic and nuclear radiation is detected by micromechanical sensors that can be coated with various interactive materials. As the micromechanical sensors absorb radiation, the sensors bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be imaged with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever bends due to stress and its resonance frequency shifts due to changes in elastic properties, based on cantilever shape and properties of the coating.

BOLOMETER PIXEL TRIGGER

A bolometer pixel trigger array includes a substrate, an electrically conductive contact pad formed on the substrate, and bolometer formed on the substrate. The bolometer includes at least one thermally conductive trigger arm having a fixed end coupled to a portion of the bolometer and an electrically conductive free end configured to deflect with respect to the fixed end. At least one trigger arm establishes different operating states of the bolometer pixel trigger in response to the at least one trigger arm realizing different temperatures. The different operating states are configured to change an electrical connection between the at least one trigger arm and the contact pad.

APPARATUS AND SYSTEM FOR MEASURING POWER OF HEAT RADIATION

NETWORK OF DETECTION OF RADIATION INFRA-RED AND METHOD FOR MANUFACTURING SUCH A NETWORK

Ce réseau pourvu de détecteurs de rayonnement infrarouge (100) situé sur un substrat (1) comprend un bras de support (20) fixé au substrat et portant une structure stratifiée d'une couche isolante (23) et d'une couche de câblage (24), une structure d'isolation thermique (30) portée par le bras et comprenant une couche isolante (31) portant un film réfléchissant (33), et une résistance (32) raccordée à la couche de câblage (24), les bras de support (20) fléchissant de façon réversible lorsqu'ils sont chauffés jusqu'à une température de détection et fléchissant de façon non réversible lorsque les bras (20) sont chauffés à une température supérieure à la température de détection. Application notamment aux systèmes de détection de rayonnement infrarouge.

Imaging Detector Array with Optical Readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Thermischer Sensor zur Erfassung von elektromagnetischer Strahlung

Die Erfindung betrifft einen thermischen Sensor zur Erfassung von elektromagnetischer Strahlung, insbesondere Wärmestrahlung, umfassend ein Pixelarray (1) mit einer Vielzahl von Pixeln (10), wobei die Pixel (10) ein Substratmaterial (11) und eine Absorberplatte (12) aufweisen, wobei die Absorberplatte (12) an Bimetallarmen (13, 14) über dem Substratmaterial (11) haltend aufgenommen ist. Erfindungsgemäß ist wenigstens eine elektrische Spule (15, 16, 17, 18, 19, 20) in Anordnung am Substratmaterial (11) vorgesehen, wobei wenigstens eine elektrische Eigenschaft der Spule (15, 16, 17, 18, 19, 20) durch eine Änderung des Abstandes (d) der Absorberplatte (12) zum Substratmaterial (11) änderbar ist.

Thermischer Sensor zur Erfassung von elektromagnetischer Strahlung

Die Erfindung betrifft einen thermischen Sensor zur Erfassung von elektromagnetischer Strahlung, insbesondere Wärmestrahlung, umfassend ein Pixelarray (1) mit einer Vielzahl von Pixeln (10), wobei die Pixel (10) ein Substratmaterial (11) und ein Absorbermaterial (12) aufweisen, welches auf dem Substratmaterial (11) angeordnet ist. Erfindungsgemäß sind zwei Bimetallarme (13, 14) vorgesehen, wobei ein erster Bimetallarm (13) in einem ersten Anbindungspunkt (15) auf der Oberfläche des Substratmaterials (11) angebunden ist und wobei ein zweiter Bimetallarm (14) in einem zweiten Anbindungspunkt (16) auf der Oberfläche des Absorbermaterials (12) angebunden ist, wobei die Anbindungspunkte (15, 16) im Bereich des Flächenschwerpunktes (S) des Pixels (10) angeordnet sind.

Improvements in or relating to light responsive devices for controlling electrical circuits

... 702,588. Thermal switches. SVENSKA AKTIEBOLAGET GASACCUMULATOR. March 17, 1952 [March 20, 1951], No. 6856/52. Class 38(5) A micro switch 5 is arranged between a pair of rectangular bi-metal plates 1, 2 and is normally held closed thereby. Plate 1 is made light-absorptive and plate 2 light-reflective so that on a certain increase of illumination, the centres of the plates deflect downwardly to different extents so that the' switch is opened. The plates 1, 2 are supported at their corners by points 3 against which they are pressed by clamps 4. The points 3 are mounted on spacing blocks 9 carried by blade springs 10 on supports 11. In order to equalize the resilience of individual plates, a spring 12 may be used. Ambient temperature changes cause equal downward deflection of plates 1 and 2 so that the switch is not operated. The whole device is enclosed in a transparent housing.

Improvements in or relating to radiation pyrometers

... 280,454. Schwartz, A. May 27, 1927. Pyrometers. - In a radiation pyrometer employing a bimetallic spiral to receive the radiation, errors due to variations in atmospheric temperature are automatically compensated by means of a second bimetallic spiral arranged to displace either the scale or the support for the measuring spiral when such variations occur. In the form shown the bimetallic, spiral E receiving the focussed radiation carries a pointer H moving over a scale F which is rotatably supported on a holder C. The compensating coil A is secured at one end within the telescope tube G and at its free end B engages in a notch in the scale F so that its expansion and contraction with variations in atmospheric temperature cause the scale to rotate. The object glass of the telescope may be surrounded by an annular window through which some of the rays from the source of radiation pass in order to illuminate the scale.

Infrared imager using room temperature capacitance sensor

Thermal transducer for silencers or catalytic pots - enables motor vehicle pollution to be controlled by temp control

A transducer (2) comprising a reservoir (10) or bulb is placed in the environment which it is required to measure. The reservoir is closed and made of conducting material which is earthed (T) to the exhaust pipe or chassis. It contains a substance (C) of variable conductivity into which an electrode (20) is inserted. The electrode is connected to a battery (14) in series with a current detector (30) which is connected via an amplifier (40) to a transmitter (50). This transmits a current flow signal to a control unit (60) which enables the correct temperature to be maintained. The substance (C) typically changes state at a set temperature to cause a change in conductivity.

DISPOSITIF ET SYSTEME DE MESURE DE LA PUISSANCE D'UN RAYONNEMENT THERMIQUE

Le dispositif de mesure de puissance d'un rayonnement thermique comprend unélément sensible tel qu'un filament électroconducteur 6 monté de façon à pouvoir exécuter un mouvement à une vitesse stabilisée dans le rayonnemnt thermique 4. Ledit élément sensible est relié à un appareil 7 enregistrant ses variations dues aux variations de la température provoquées par l'action du rayonnement thermique. Le système de mesure de la puissance d'un rayonnement thermique est constitué par au moins trois dispositifs de mesure 36 de puissance de rayonnement thermique du type ci-dessus. L'invention peut être appliquée dans différentes branches de la technique, par exemple à la mesure de la température de flammes, de flux de plasma, dejets de gaz et de liquide, et à la mesure de la puissance de rayonnements laser.

HEAT TYPE DISPLACEMENT ELEMENT AND RADIATION DETECTION APPARATUS USING THE SAME

PROBLEM TO BE SOLVED: To solve various kinds of inconveniences that have occurred conventionally due to the initial curving in a displacement section. SOLUTION: A section 2 to be supported that is supported by a board 1 has first displacement sections 5 and 6, heat separation sections 7 and 8, and second displacement sections 9 and 10 that are connected successively from the side of the board 1 to a reflection plate 12. All the displacement sections 5, 6, 9, and 10 are made of a double film of a lower SiN film and an upper Al film. The length from the starting to ending points in the displacement sections 5, 6, 9, and 10 is equal one another. A direction from the starting point of the displacement sections 5 and 6 to the ending point is opposite to that from the starting point of the displacement sections 9 and 10 to the ending point. When infrared rays enter an infrared absorption film on the lower surface of the reflection board 12, the reflection board 12 is inclined according to the ...

APPARATUS AND SYSTEM FOR MEASURING POWER OF HEAT RADIATION

RADIANT ENERGY IMAGER USING NULL SWITCHING

In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. In an aspect, the sensor device also includes a null-sensing circuit coupled to a switch contact on or near the substrate, which senses when the micro- cantilever reaches its null location, by electrical connection with an upper switch contact on the micro-cantilever. Other embodiments are also described.

Thermisches Verschiebungselement und Strahlungsdetektor, der dieses verwendet

Apparatus and system for measuring power of heat radiation

An apparatus for measuring the power of a heat radiation comprises a disc 5 bordered by a heat sensitive element such as an electrically conductive filament (6). Part of the filament 6 is positioned in a heat radiation flux or jet (4) and the disc is rotated at a stabilized speed. Connected to the sensitive element is a meter (7, Fig, 1, not shown) for registering the variations of the conductivity, that is the temperature. A system may comprise at least three apparatuses (36, Figs. 13 & 14 not shown) spaced around the flux or jet. In an alternative configuration to that shown in Fig. 2 a heat sensitive wire filament is threaded back and forth in a zig-zag fashion between two spaced discs (Figs. 7 & 8 not shown). A bimetallic strip may replace the disc and filament. Any resulting deflection is measured by a pickup 26, Fig. 9 or by means of mirrors 31 positioned on the end of the strip so as to reflect light from a source 33 onto a scale 35. ...

Electromagnetic and nuclear radiation detector using micromechanical sensors

RADIANT ENERGY IMAGER USING NULL SWITCHING

In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. In an aspect, the sensor device also includes a null-sensing circuit coupled to a switch contact on or near the substrate, which senses when the micro- cantilever reaches its null location, by electrical connection with an upper switch contact on the micro-cantilever. Other embodiments are also described.

Thermal isolation using vertical structures

INTEGRATED CALORIMETRIC SPECTROMETER

Selon cette invention, un micro-instrument destiné à la détection d'un composé chimique est formé sur un substrat de semi-conducteur de la taille d'une pièce de monnaie. Un guide d'ondes est formé par une couche semi-conductrice disposée sur le substrat. Le guide d'onde sur couche semi-conductrice possède une encoche formant une ouverture d'entrée dans laquelle pénètre le rayonnement polychromatique. Un émetteur infrarouge disposé dans l'encoche sert à générer le rayonnement polychromatique. Un réseau de détecteurs thermiques micromécaniques peut être formé intégralement avec le substrat. Chacun des détecteurs thermiques possède un paramètre physique caractéristique mesurable et comporte un revêtement manifestant une adsorption préférentielle pour au moins un composant chimique à détecter. Un réseau de réflexion autofocalisé est formé intégralement avec la couche semi-conductrice de guide d'onde; il sert à diriger un spectre monochromatique sur le réseau en réponse au rayonnement polychromatique ...

MICROMACHINED INFRARED SENSITIVE PIXEL AND INFRARED IMAGER

An infrared (IR) sensitive pixel (20) and an IR imager (100) including the same. According to one embodiment, the pixel includes a substrate assembly (24) having a cavity (26) defined by at least one sidewall (33) and a cantilevered beam (22) connected to the substrate assembly and disposed in the cavity. The cantilevered beam includes a first spring portion (28) and a first capacitor plate portion (30), wherein the first spring portion includes at least two materials having different coefficients of thermal expansion. The pixel further includes a second capacitor plate portion (30, 34), such that incident IR radiation causes the first spring portion of the cantilevered beam to move laterally relative to the sidewall, thereby creating a variable capacitance between the first capacitor plate portion of the cantilevered beam and the second capacitor plate portion.

Micromechanical thermal sensor

A radiation sensor that can operate in the THz regime comprising: a micro antenna, which may comprise a two-dimensional patterned thin-film metallizations on a thin dielectric pellicle fabricated by micro machining of a silicon wafer; a thermally isolated microstructure; a coupling mechanism for coupling the energy from the micro antenna to the microstructure, the coupling mechanism providing high thermal isolation between the micro antenna and the microstructure; a temperature signal detector on the microstructure; and signal processing electronics for receiving the temperature signal and processing it into useful data.

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical three applied to the resonator member; and', 'a thermal insulating member configured to thermally insulate the resonator member from the unpowered detector member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2. The device of . wherein the photon detector is configured to detect thermal infrared energy having a wavelength m a range of about 2 micrometers to 25 micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein ...

INFRARED IMAGER USING ROOM TEMPERATURE CAPACITANCE SENSOR

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor is composed of a bi-material strip (110) which changes the position of one plate (100) of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip (110) is composed of two materials with a large difference in thermal expansion coefficients.

Micromechanical thermal sensor

A radiation sensor that can operate in the THz regime comprising: a micro antenna, which may comprise a two-dimensional patterned thin-film metallizations on a thin dielectric pellicle fabricated by micro machining of a silicon wafer; a thermally isolated microstructure; a coupling mechanism for coupling the energy from the micro antenna to the microstructure, the coupling mechanism providing high thermal isolation between the micro antenna and the microstructure; a temperature signal detector on the microstructure; and signal processing electronics for receiving the temperature signal and processing it into useful data.

WAERMESTRAHLUNGSMESSER UND WAERMESTRAHLUNGSMESSSYSTEM

INFRARED IMAGING APPARATUS WITH THERMALLY DISPLACABLE DETECTOR IPIXEL ARRAY AND OPTICAL INTERROGATION SYSTEM

A representative embodiment of the invention provides an infrared (IR) imaging system (300) adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates (304,306), (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object. COPYRIGHT KIPO & WIPO 2010 ...

INTEGRATED CALORIMETRIC SPECTROMETER

Selon cette invention, un micro-instrument destiné à la détection d'un composé chimique est formé sur un substrat de semi-conducteur de la taille d'une pièce de monnaie. Un guide d'ondes est formé par une couche semi-conductrice disposée sur le substrat. Le guide d'onde sur couche semi-conductrice possède une encoche formant une ouverture d'entrée dans laquelle pénètre le rayonnement polychromatique. Un émetteur infrarouge disposé dans l'encoche sert à générer le rayonnement polychromatique. Un réseau de détecteurs thermiques micromécaniques peut être formé intégralement avec le substrat. Chacun des détecteurs thermiques possède un paramètre physique caractéristique mesurable et comporte un revêtement manifestant une adsorption préférentielle pour au moins un composant chimique à détecter. Un réseau de réflexion autofocalisé est formé intégralement avec la couche semi-conductrice de guide d'onde; il sert à diriger un spectre monochromatique sur le réseau en réponse au rayonnement polychromatique ...

Electromagnetic and nuclear radiation detector using micromechanical sensors

Electromagnetic and nuclear radiation is detected by micromechanical sensors that can be coated with various interactive materials. As the micromechanical sensors absorb radiation, the sensors bend and/or undergo a shift in resonance characteristics. The bending and resonance changes are detected with high sensitivity by any of several detection methods including optical, capacitive, and piezoresistive methods. Wide bands of the electromagnetic spectrum can be imaged with picoJoule sensitivity, and specific absorptive coatings can be used for selective sensitivity in specific wavelength bands. Microcantilevers coated with optical cross-linking polymers are useful as integrating optical radiation dosimeters. Nuclear radiation dosimetry is possible by fabricating cantilevers from materials that are sensitive to various nuclear particles or radiation. Upon exposure to radiation, the cantilever bends due to stress and its resonance frequency shifts due to changes in elastic properties, based ...

Measuring and control apparatus

TEMPERATURMESSER

Photo-sensitive MEMS structure

A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.

Radiant energy imager using null switching

In some aspects, the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. In an aspect, the sensor device also includes a null-sensing circuit coupled to a switch contact on or near the substrate, which senses when the micro-cantilever reaches its null location, by electrical connection with an upper switch contact on the micro-cantilever. Other embodiments are also described.

Mems optical device comprising a mems magnetic sensing mechansim and mems light absorbing structure

A MEMS optical device and an array composed thereof are disclosed herein, wherein the MEMS optical device comprises a light absorbing element, a deforming element, and a magnetic detector, wherein the magnetic detector comprises a magnetic source and a magnetic sensor.

Passive detectors for imaging systems

Passive detector structures for imaging systems are provided, which are based on a coefficient of thermal expansion (CTE) framework. With such framework, a CTE-based passive detector structure includes a detector member that is configured to expand or contract in response to thermal heating resulting from photon exposure. The expanding/contracting CTE detector structure is configured to exert mechanical forces on resistor and/or capacitor circuit elements, which are part of an oscillator circuit, to vary the resistance and capacitance of such circuit elements and change a frequency or period of oscillation of an output signal of the oscillator circuit. The change in the frequency or period of oscillation of the output signal of the oscillator circuit is utilized to determine an amount of photon exposure of the CTE-based detector.

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical force applied to the resonator member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2. The device of claim 1 , wherein the photon detector is configured to detect thermal infrared energy having a wavelength in a range of about 2 micrometers to 25 micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein the unpowered detector member comprises a ribbon member claim 1 , and wherein the ribbon member is suspended above ...

PASSIVE DETECTORS FOR IMAGING SYSTEMS

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum. 1. A device , comprising:a substrate; a resonator member configured to generate an output signal having a frequency or period of oscillation;', 'an unpowered detector member, wherein the unpowered detector member is configured for photon exposure, wherein the unpowered detector member comprises a material having a thermal coefficient of expansion that causes the unpowered detector member to distort due to said photon exposure, wherein the unpowered detector member is further configured to apply a mechanical force to the resonator member due to said distortion of the unpowered detector member, and cause a change in the frequency or period of oscillation of the output signal generated by the resonator member due to said mechanical force applied to the resonator member; and, 'a photon detector formed on the substrate, wherein the photon detector comprisesdigital circuitry configured to (i) determine the frequency or period of oscillation of the output signal generated by the resonator member as a result of the mechanical force applied to the resonator member by the unpowered detector member, and to (ii) determine an amount of said photon exposure based on the determined frequency or period of oscillation of the output signal generated by the resonator member.2225. The device of claim 1 , wherein the photon detector is configured to detect thermal infrared energy having a wavelength in a range of about micrometers to micrometers.3. The device of claim 1 , wherein the photon detector further comprises a first support member claim 1 , wherein the unpowered detector member comprises a ribbon member claim 1 , and wherein the ribbon member is suspended above ...

Fabrication method for micromechanical sensors

In one approach, a method of fabricating radiation detection devices includes: forming a structural layer overlying a frontside of a substrate; forming a metallic layer overlying the structural layer; releasing each of a plurality of devices on the substrate by etching a backside of the substrate, wherein each device comprises a plate and legs attached to the plate, the legs comprising at least a portion of the metallic layer; and sealing each of the plurality of devices, the sealing comprising: attaching a transparent cavity cap to the frontside of the substrate; and attaching a radiation-transparent substrate to the backside of the substrate.

ON-BOARD RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface;a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or', 'enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector., 'an enclosure, either configured to2. The radiation sensing apparatus of claim 1 , wherein the enclosure ...

SEQUENTIAL BEAM SPLITTING IN A RADIATION SENSING APPARATUS

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. An apparatus comprising:a plurality of mirrors;a sensor having a surface to receive light rays reflected from the mirrors; andat least one beamsplitter located between the mirrors and the sensor, wherein the beamsplitter comprises at least one partially-reflective surface configured to partially reflect light rays towards the mirrors.2. The apparatus of claim 1 , wherein the at least one partially-reflective surface includes first and second partially-reflective surfaces aligned in sequence.3. The apparatus of claim 2 , wherein a first beamsplitter comprises the first partially-reflective surface claim 2 , and a second beamsplitter comprises the second partially-reflective surface.4. The apparatus of claim 3 , wherein the first and second beamsplitters are positioned side by side.5. The apparatus of claim 1 , wherein each mirror comprises a light reflecting surface on one side of the mirror claim 1 , and a radiation absorption surface on an ...

Infrared radiation sensors and methods of manufacturing infrared radiation sensors

An infrared radiation sensor comprises a substrate, a membrane formed in or at the substrate, a first counter electrode, a second counter electrode, and a composite comprising at least two layers of materials having different coefficients of thermal expansion. At least a portion of the membrane forms a deflectable electrode and the deflectable electrode is electrically floating. A first capacitance is formed between the deflectable electrode and the first counter electrode, and a second capacitance is formed between the deflectable electrode and the second counter electrode. The membrane comprises the composite or is supported at the substrate by the composite. The membrane comprises an absorption region configured to cause deformation of the composite by absorbing infrared radiation, the deformation resulting in a deflection of the deflectable electrode, which causes a change of the first and second capacitances.

MICRO-BOLOMETER HAVING AN ADJUSTABLE DYNAMIC RANGE

In some aspects the present invention embodies both the method and apparatus for converting a pattern of irradiation to a visible image. An embodiment of the present invention provides an array of micro-electro-mechanical sensors with each sensor includes a deflectable micro-cantilever, responsive to absorbed incident radiation and to an applied repulsive electrostatic field. Associated circuitry senses a change in an output signal of the sensor as it responds to incident radiation incident upon the cantilever and provides a biasing force to deflect the cantilever and maintain the detector output signal at a desirable level. The biasing element may be a piezoelectric element, a heater or a pair of electrodes and the corresponding biasing stimulus may be stress (expansion), heat, or electrostatic change. The stimulus compensates for the effect of the infrared radiation and maintains the chosen detector output level at the same level. 1. An apparatus , comprising:(a) a deflectable bi-material micro-cantilever, said micro-cantilever being deflectable in response to each of incident infrared radiation and a further stimulus, and having a reference position relative to the substrate when not exposed to said infrared radiation and said further stimulus;(b) a biasing mechanism to apply said further stimulus operatively coupled to the micro-cantilever, said biasing mechanism comprising a first and second conductive element with a piezoelectric element disposed there between;(c) a contact tip disposed adjacent one end of the micro-cantilever and in electrical communication with a power source;(d) a contact plate positioned on the substrate beneath the contact tip with a predetermined space there between with the micro-cantilever is in the reference position; and(e) a spacer between the micro-cantilever and the substrate.(f) wherein the piezoelectric element expands when a current is applied to at least one of the first and second conductive elements, said expansion causing ...

Sequential Beam Splitting in a Radiation Sensing Apparatus

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces. 1. A radiation sensing apparatus , comprising:a micro-mirror chip comprising a plurality of light reflecting surfaces;an image sensor comprising an imaging surface; and the beamsplitter unit comprising a plurality of beamsplitters that are positioned side by side along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface, and', 'each beamsplitter of the plurality of beamsplitters including a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip and extends across more than half the height of the beamsplitter., 'a beamsplitter unit located between the micro-mirror chip and the image sensor,'}2. The radiation sensing apparatus of claim 1 , wherein there is only one layer of beamsplitters between the micro-mirror chip and the image sensor.3. The radiation sensing apparatus of claim 1 , wherein each light reflecting surface of the plurality of light reflecting surfaces includes a ...

BI-MATERIAL TERAHERTZ SENSOR AND TERAHERTZ EMITTER USING METAMATERIAL STRUCTURES

Bi-material terahertz (THz) sensors with metamaterial structures are described. In one embodiment, MEMS fabrication-friendly SiOand Al are used to maximize the bi-material effect and metamaterial absorption at 3.8 THz, the frequency of a quantum cascade laser illumination source. Sensors with different configurations were fabricated and the measured absorption is near 100% and responsivity is around 1.2 deg/μW. Fabrication and use of the sensors in focal plane arrays for real time THz imaging is described. In a further embodiment, the metamaterial structure is utilized as a THz emitter when heated by an external source. 1. A bi-material terahertz (THz) sensor comprising:a metamaterial absorber;a first bi-material leg connected to the metamaterial absorber;a second bi-material leg connected to the metamaterial absorber;one or more anchor structures connecting the first bi-material leg and the second bi-material leg to a substrate; anda substrate.2. The bi-material THz sensor of wherein the metamaterial absorber comprises:an electrically conductive ground plane layer;an electrically insulating dielectric layer in communication with the electrically conductive ground plane layer; anda plurality of electrically conductive surface elements formed on the dielectric layer and in communication with the dielectric layer.3. The bi-material THz sensor of wherein the ground plane is reflective to allow external optical readout.4. The bi-material THz sensor of wherein the one or more anchor structures thermally insulate the first and second bi-material legs from the substrate.5. The bi-material THz sensor of wherein the one or more anchor structures have a lower thermal conductance than the first and second bi-material legs.6. The bi-material THz sensor of wherein the one or more anchor structures comprise:an anchor structure, wherein the anchor structure is connected to the first bi-material leg and the second bi-material leg and to the substrate.7. The bi-material THz sensor ...

Passive detectors for imaging systems

Passive detector structures for imaging systems are provided which implement unpowered, passive front-end detector structures with direct-to-digital measurement data output for detecting incident photonic radiation in various portions (e.g., thermal (IR), near IR, UV and visible light) of the electromagnetic spectrum.

Thermal displacement element and radiation detector using the same

Cantilever and its manufacture

(57)【要約】 【課題】 温度分布や熱伝導率分布の計測の精度及び分 解能を高める。探針及び支持体を可撓性プレートに対し て反対方向に突出させ、共振周波数を高めて高速走査を 可能とする。 【解決手段】 カンチレバーは、可撓性プレート４１ と、該可撓性プレート４１の先端側領域の下面に突設さ れた探針４２と、可撓性プレート４１の基端側領域の上 面に接合された絶縁材料からなる支持体４３とを備え る。探針４２に、金属膜４４，４５の接合からなる熱電 対が設けられる。金属膜４４は、熱電対の部分から連続 して可撓性プレート４１の支持体４３側の面に形成され る。金属膜４５は、熱電対の部分から連続して可撓性プ レート４１の探針４１側の面に形成される。

Power distribution board having optical temperature sensor

본 발명은 광온도센서가 적용된 온도감지형 수배전반에 관한 것으로서, 수배전반 내 전원 연결부위에 설치된 광온도센서에서 출력되는 정보로부터 온도를 산출하는 온도 산출부를 구비하고, 광온도센서는 베이스 부분에 대해 제1 및 제2지지부가 상호 돌출되게 형성된 메인 하우징과, 일단이 제1지지부에 지지되게 설치되어 타단으로부터 전송된 광을 출사하는 제1입력단 광섬유로부터 출사된 광을 전송할 수 있도록 일단이 제1입력단 광섬유에 대향되게 이격되어 제2지지부에 지지되게 설치된 제1출력단 광섬유와, 온도변화에 따라 제1입력단 광섬유로부터 제1출력단 광섬유로 전송되는 광빔의 전송 궤도 내로 진입되어 광차폐영역을 가변시키면서 제1출력단 광섬유로 전송되는 광량이 가변되게 메인 하우징에 유동될 수 있게 설치된 바이메탈 소자를 갖는 광간섭부와, 메인 하우징에 결합되어 일단은 제1입력단 광섬유의 타단까지 연장되고 타단은 제1출력단 광섬유의 타단까지 연장된 레퍼런스 광섬유와, 제1입력단 광섬유와 레퍼런스광섬유를 상호 결속시키는 제1결속부재와, 제1출력단 광섬유와 레퍼런스광섬유를 상호 결속시키는 제2결속부재를 구비한다. 이러한 광온도센서를 내장한 온도감지형 수배전반에 의하면, 광섬유를 통해 전송되는 전송광의 광량변동을 이용하여 바이메탈소자에 의한 차폐광량 정보로부터 온도를 산출함으로써 측정 정밀도를 높일 수 있고 구조가 간단한 장점을 제공한다. The present invention relates to a temperature sensing type switchgear to which an optical temperature sensor is applied, and includes a temperature calculator configured to calculate a temperature from information output from an optical temperature sensor installed at a power connection part in the switchgear. The first and second support optical fibers are formed so that the first and second support portions protrude from each other, and one end of the first input optical fiber transmits light emitted from the first input optical fiber which is installed to be supported by the first support portion and outputs light transmitted from the other end. The first output stage optical fiber installed to be supported by the second support unit and spaced apart from each other, and the first output stage entering the transmission trajectory of the light beam transmitted from the first input optical fiber to the first output optical fiber according to the temperature change to vary the light shielding area. The bimetal element is installed so that the amount of light transmitted to the optical fiber can flow in the main housing. Is coupled to the optical interference part, the main housing, one end of which extends to the other end of the first input end optical fiber and the other end of which ...

Imaging detector array with optical readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Uncooled ir detector array having improved temperature stability and reduced fixed pattern noise

An infrared radiation detector array for providing an image signal of a scene is provided including a plurality of infrared radiation detectors having infrared radiation responsive elements. Each one of the plurality of infrared radiation detectors provides a proportionate electrical signal in response to infrared radiation of the scene incident thereto. At least one blind infrared radiation detector having a radiation responsive element is provided and shielded from infrared radiation of the scene. The blind infrared radiation detector provides a proportionate electrical signal in response to infrared radiation incident thereto. The blind infrared radiation detector is configured to provide a signal indicating thermal distortion of the infrared radiation detector array.

Micromechanical thermal sensor

A radiation sensor (200) that can operate in the THz regime comprising: a micro antenna (206), which may comprise a two-dimensional patterned thin-film metallizations on a thin dielectric pellicle fabricated by micro machining. of a silicon wafer; a thermally isolated microstructure (215); a coupling mechanism for coupling the energy from the micro antenna to the microstructure, the coupling mechanism providing high thermal isolation between the micro antenna and the microstructure; a temperature signal detector on the microstructure; and signal processing electronics for receiving the temperature signal and processing it into useful data.

Infrared imager using room temperature temperature capacity sensor

(57)【要約】 室温で作動するアレイ状の容量センサを含む赤外線イメージャである。各赤外線容量センサは、バイマテリアルストリップ（１１０）から構成されおり、吸収された入射熱放射線による温度変化に応じてセンシングコンデンサの一つの板（１００）の位置を変化する。バイマテリアルストリップ（１１０）は熱膨張率の大きく異なる二つの材料から構成されている。

Tunable Microcantilever Infrared Sensor

An electromagnetic radiation sensor that exhibits improved performance by virtue of an ability to tune its sensitivity is disclosed. The electromagnetic radiation sensor incorporates thermal actuators that act in opposition to one another, but which have a slight difference in responsivity. A temperature controller is used to tune the sensitivity of the electromagnetic radiation sensor by controlling the temperature of the substrate on which the sensor is formed.

Chitin-based cantilever bimorphs and readout devices

An infrared sensor with at least one cantilever beam functionalized with chitin, chitosan or their derivatives that can be tailored to be sensitive to certain IR bands for detection and does not require cooling is described. The functional layers expand differently than the structural layer of the cantilever beam causing the beam to bend in response to exposure to infrared radiation. The sensor can be adapted to optical, piezoresistive, capacitive and piezoelectric methods of detect beam deflection. Sensitivity can be increased with a reflective layer to increase the absorption of infrared radiation by the functional layer.

Microcantilever Infrared Sensor Array

A radiation sensor array that exhibits improved fill factor is disclosed. The radiation sensor array incorporates sensors having support arms that are nested in vertical fashion with the support arms of neighboring sensors. This vertically-nested structure enables the radiation-sensing portions of the sensors to be more closely-packed.

Chitin-based cantilever bimorphs and readout devices

An infrared sensor with at least one cantilever beam functionalized with chitin, chitosan or their derivatives that can be tailored to be sensitive to certain IR bands for detection and does not require cooling is described. The functional layers expand differently than the structural layer of the cantilever beam causing the beam to bend in response to exposure to infrared radiation. The sensor can be adapted to optical, piezoresistive, capacitive and piezoelectric methods of detect beam deflection. Sensitivity can be increased with a reflective layer to increase the absorption of infrared radiation by the functional layer.

Thermal displacement element and radiation detector using the element

A thermal displacement element comprises a substrate, and a supported member supported on the substrate. The supported member includes first and second displacement portions, a heat separating portion exhibiting a high thermal resistance and a radiation absorbing portion receiving the radiation and converting it into heat. Each of the first and second displacement portions has at least two layers of different materials having different expansion coefficients and stacked on each other. The first displacement portion is mechanically continuous to the substrate without through the heat separating portion. The radiation absorbing portion and the second displacement portion are mechanically continuous to the substrate through the heat separating portion and the first displacement portion. The second displacement portion is thermally connected to the radiation absorbing portion. A radiation detecting device comprises a thermal displacement element and a displacement reading member fixed to the second displacement portion of the thermal displacement element and used for obtaining a predetermined change corresponding to a displacement in the second displacement portion.

Photo-sensitive MEMS structure

A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.

Contact device activated by electromagnetic radiation or light radiation

Optically readable radiation-displacement-conversion devices and methods, and image-rendering apparatus and methods employing same

Optically readable radiation-displacement conversion devices and image-rendering apparatus that incorporate same are disclosed. Also disclosed are related methods for detecting images and rendering images using such devices and apparatus. Such devices, apparatus and methods allow improved accuracy and sensitivity of radiation detection without having to use a cooler. A representative conversion device includes a substrate and a suspended portion attached to the substrate via a leg portion. The conversion device includes a radiation-absorbing film that receives and absorbs and incident invisible radiation (e.g., UV, IR, or X-rays) and generates heat from the absorbed radiation. The suspended portion includes a displaceable member that exhibits a displacement with respect to the substrate. The displacement also imparts a change to an incident readout light flux in accordance with the magnitude of the displacement. The change to the readout light is detected and used to form an image.

Thermal displacement element and radiation detector using the element

Uncooled Cantilever Microbolometer Focal Plane Array with Mk Temperature Resolutions and Method of Manufacturing Microcantilever

A microbolometer sensor has a first cantilever supported above a substrate and formed of a bimaterial so as to deform in a first direction in response to incident radiation, and a second cantilever supported above the substrate and formed of a bimaterial so oriented as to cause the second cantilever to deflect oppositely to the first cantilever in response to radiation. The first and second cantilevers have a spacing therebetween that varies as a function of radiation incident on said first and second cantilevers. Means for sensing the deflection of the first and second cantilevers to provide an indication of the incident radiation is provided. A process of forming a micromechanical cantilever structure is also providing by irradiating a cantilever with an ion beam, whereby the cantilever is flattened. Also, the cantilever can be annealed in a rapid thermal annealing process to flatten the cantilever.

Infrared imaging apparatus with thermally displacable detector ipixel array and optical interrogation system

A representative embodiment of the invention provides an infrared (IR) imaging system (300) adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates (304,306), (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object.

Suspended-membrane thermal detector comprising a deformable part for thermal short-circuit

A thermal detector including a substrate, an absorbent membrane including a fixed part and a deformable part, the latter including a shape-memory alloy, and being arranged with respect to the substrate in such a way that its free end is in contact with the substrate at the contact temperature T c above the austenite start temperature A s .

Thermal imaging detector array with optial readout

The present invention relates to thermal detectors and the application of such to devices and methods of detecting the infrared images using thermal detectors. For example, by using optical measuring systems in combination with at least one light source to measure changes position of a movable anchored surface coupled to an absorption surface such that the movable anchored surface changes position due to absorption of infrared radiation by the absorption surface. In another example, by combining a detector pixel (infrared radiation sensitive) with an optical measuring device such as an interferometer.

Apparatus and method for detecting electromagnetic radiation using electron photoemission in a micromechanical sensor

A micromechanical sensor and method for detecting electromagnetic radiation involve producing photoelectrons from a metal surface in contact with a semiconductor. The photoelectrons are extracted into the semiconductor, which causes photo-induced bending. The resulting bending is measured, and a signal corresponding to the measured bending is generated and processed. A plurality of individual micromechanical sensors can be arranged in a two-dimensional matrix for imaging applications.

Infrared radiation sensors and methods of manufacturing infrared radiation sensors

An infrared radiation sensor comprises a substrate, a membrane formed in or at the substrate, a first counter electrode, a second counter electrode, and a composite comprising at least two layers of materials having different coefficients of thermal expansion. At least a portion of the membrane forms a deflectable electrode and the deflectable electrode is electrically floating. A first capacitance is formed between the deflectable electrode and the first counter electrode, and a second capacitance is formed between the deflectable electrode and the second counter electrode. The membrane comprises the composite or is supported at the substrate by the composite. The membrane comprises an absorption region configured to cause deformation of the composite by absorbing infrared radiation, the deformation resulting in a deflection of the deflectable electrode, which causes a change of the first and second capacitances.

Apparatus and method to adjust sensitivity in measuring electromagnetic radiation using micro mirrors

Systems, methods, and apparatuses having an array of micro mirrors that rotate according to absorbed radiation and reflect light to generate light spots. In a first setting, a processor obtains an image of the light spots, determines positions of the light spots using a computationally efficient but less accurate method to calculate the intensities of radiation directed at the micro mirrors, and provides the calculated radiation. In a second setting, the processor does not determine the position; and the image is transmitted to a separate computing device to determine positions of the light spots using a computationally intensive but more accurate method to calculate the intensities of radiation directed at the micro mirrors. The system can dynamically switch between the first setting and second setting without a need to adjust hardware.

Infrared imager using room temperature capacitance sensor

An infrared imager includes an array of capacitance sensors that operate at room temperature. Each infrared capacitance sensor includes a deflectable first plate which expands due to absorbed thermal radiation relative to a non-deflectable second plate. In one embodiment each infrared capacitance sensor is composed of a bi-material strip which changes the position of one plate of a sensing capacitor in response to temperature changes due to absorbed incident thermal radiation. The bi-material strip is composed of two materials with a large difference in thermal expansion coefficients.

Passive detection device for imaging system

撮像システムのための受動型検出構造が提供され、電磁スペクトルの様々な部分（熱ＩＲ、近ＩＲ、ＵＶおよび可視光など）における入射フォトン放射を検出するためのダイレクトデジタル測定データ出力を有する、動力を使用しない、受動型フロントエンド検出構造を実施する。

Infrared pixel structure, manufacturing method thereof and hybrid image device

The present invention provides an infrared pixel structure and a hybrid imaging device which use comb-shaped top plates and bottom plates to form capacitors. The upper electrode has a non-fixed end such that the infrared sensitive element in the upper electrode generates thermal stress and deforms when absorbing the infrared light, which changes the capacitance of the capacitors formed by the top plates and the bottom plates to achieve infrared detection and increase the device sensitivity. Furthermore, the infrared pixel structure can be used in an infrared light and visible light hybrid imaging device to achieve visible light imaging and infrared imaging in a same silicon substrate, so as to increase the imaging quality.

Microsystem component with a device deformable under the effect of temperature changes

A microsystem component with a device ( 3 ) deformable under the influence of temperature changes is disclosed. The device comprises at least one first ( 4, 5 ) and second ( 8 ) element with differing thermal expansion coefficients and different thermal conductivities. The elements ( 4, 5; 8 ) are physically separate and arranged and connected to each other such that the device ( 3 ) assumes flexure states which are dependent on the temperature.

Infreared imaging device

本发明的典型实施例提供了一种红外(IR)成像系统(300)，适于：(i)将对象的IR像转换成多个可移动板(304、306)的机械位移；(ii)使用该机械位移来将相应的空间相位调制图案施加到可见光的光束上；以及(iii)应用空间滤波以将空间相位调制图案转换成对象的可见像。

Infrared-detecting element and infrared image sensor using the same

An infrared-detecting element includes: a substrate; a laminated body; an anchor coupling a part of the laminated body with the substrate and supporting the laminated body with a gap above the substrate; and an amplifier provided on the substrate and connected to at least one of the lower electrode and the upper electrode. The laminated body has a lower electrode, an upper electrode, and a piezoelectric film made of aluminum nitride which is provided between the lower electrode and the upper electrode and in which a c-axis is oriented almost perpendicularly to a film plane. The amplifier has a circuit performing conversion into voltage according to a charge generated in the laminated body.

Mikrosystemtechnisches bauelement mit einer unter dem einfluss von temperaturänderungen verformbaren einrichtung

Micro mirror arrays for measuring electromagnetic radiation

A radiation imaging apparatus includes an imaging surface; a light source; and an array of micro mirrors that rotate via radiation absorbed in the micro mirrors and reflect light from the light source to generate a distribution of reflected light on the imaging surface. The array first micro mirrors and second micro mirrors. The first micro mirrors have a first structure and the second micro mirrors have a second structure different than the first structure. The second structure is configured to correct for one or more environmental influences on the radiation imaging apparatus. A photodetector captures an image of the distribution of reflected light on the imaging surface. A processor is coupled to the photodetector. A communication interface is coupled with the processor; and a computing device is located separately from the radiation imaging apparatus and in communication with the communication interface.

Bolometer pixel trigger

A bolometer pixel trigger array includes a substrate, an electrically conductive contact pad formed on the substrate, and bolometer formed on the substrate. The bolometer includes at least one thermally conductive trigger arm having a fixed end coupled to a portion of the bolometer and an electrically conductive free end configured to deflect with respect to the fixed end. At least one trigger arm establishes different operating states of the bolometer pixel trigger in response to the at least one trigger arm realizing different temperatures. The different operating states are configured to change an electrical connection between the at least one trigger arm and the contact pad.

Optical sensor element, thermal image sensor and method of detecting thermal radiation

An optical sensor element (1) for sensing thermal radiation comprises a light emitter (10) having a cavity (11), the light emitter (10) being configured to emit coherent electromagnetic radiation through an emission surface (12) and to undergo self-mixing interference, SMI, caused by reflected electromagnetic radiation reinjected into the cavity (11). A micro-opto-mechanical transducer (20) is arranged distant from the emission surface (12), the transducer (20) being configured to undergo mechanical deflection according to thermal radiation absorbed by the transducer (20), and to reflect the electromagnetic radiation emitted by the light emitter (10) back into the cavity (11) for generating the SMI. A detection unit (30) is configured to detect a degree of the generated SMI, determine from the detected degree a deflection of the transducer (20), and generate an output signal indicating the determined deflection.

机载辐射感测设备

用于在辐射感测设备中使用光束分离来提供机载电磁辐射感测的系统、方法和设备。所述设备可以包括具有多个光反射表面的微镜芯片。所述设备还可以包括具有成像表面的图像传感器。所述设备还可以包括位于微镜芯片和图像传感器之间的光束分离器单元。所述光束分离器单元可以包括光束分离器，所述光束分离器包括倾斜于成像表面和微镜芯片的部分反射表面。所述设备可以包括被配置为至少包围光束分离器和光源的外壳。利用该设备，光源可以被附接到印刷电路板。另外，所述外壳可以包括具有成角度的反射表面的内表面，所述成角度的反射表面被配置为在朝向光束分离器的方向上反射来自光源的光。

On-board radiation sensing apparatus

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beam splitter unit located between the micro-mirror chip and the image sensor. The beam splitter unit can include a beam splitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can include an enclosure configured to enclose at least the beam splitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board. Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beam splitter.

Imaging device and method of multi-spectral imaging

An imaging device (1) is specified, the imaging device comprising: - a detector array (2) a plurality of pixels (25), the pixels (25) comprising a plurality of subpixel types (21), - a micromirror array (3) with a plurality of mirror elements (31), and - an internal light source (4), wherein - at least one of the subpixel types (21) is configured to detect a first radiation (R1); - the mirror elements (31) are configured to deflect in response to a second radiation (R2), - the internal light source (4) is configured to illuminate the detector array (2) with a third radiation (R3); - at least one of the subpixel types (21) is configured to detect the third radiation (R3) deflected by the micromirror array (3). Furthermore, a method of multi-spectral imaging is specified.

Apparatus and Method for Electromagnetic Radiation Sensing

Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

Micro mirror arrays for measuring electromagnetic radiation

A radiation imaging apparatus includes an imaging surface; a light source; and an array of micro mirrors that rotate via radiation absorbed in the micro mirrors and reflect light from the light source to generate a distribution of reflected light on the imaging surface. The array first micro mirrors and second micro mirrors. The first micro mirrors have a first structure and the second micro mirrors have a second structure different than the first structure. The second structure is configured to correct for one or more environmental influences on the radiation imaging apparatus. A photodetector captures an image of the distribution of reflected light on the imaging surface. A processor is coupled to the photodetector. A communication interface is coupled with the processor; and a computing device is located separately from the radiation imaging apparatus and in communication with the communication interface.

Radiation sensing apparatus and method of sensing radiation

A radiation sensing apparatus is provided, the radiation sensing apparatus comprising a radiation source, an optical element, an array of mirrors that are arranged on a carrier, an actuator that is connected with the carrier, and a radiation sensor, wherein the optical element is configured to direct electromagnetic radiation emitted by the radiation source towards the array of mirrors, and the radiation sensor is configured to detect electromagnetic radiation reflected by the array of mirrors. Furthermore, a method of sensing radiation is provided.

Thermal Imaging with Scanning at Sub-Pixel Levels

A thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.

Gesamtstrahlungsmesser mit einem Bimetallthermometer als Waermeempfaenger

On-board radiation sensing apparatus

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. The light source can be attached to a printed circuit board. Optionally, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

オンボード放射線感知装置

【課題】放射線感知装置においてビームスプリッティングを使用して、オンボード電磁放射線感知を提供するためのシステム、方法、及び装置。【解決手段】本放射線感知装置は、複数の光反射面を含むマイクロミラーチップを含み得る。本装置はまた、撮像面を含むイメージセンサを含み得る。本装置はまた、マイクロミラーチップとイメージセンサとの間に配置されたビームスプリッタユニットを含み得る。ビームスプリッタユニットは、撮像面及びマイクロミラーチップに対して傾斜している部分反射性表面を含むビームスプリッタを含み得る。本装置はまた、少なくともビームスプリッタ及び光源を囲むように構成されたエンクロージャを含み得る。本装置では、光源をプリント回路基板（ＰＣＢ）に取り付けることができる。また、エンクロージャは、光源からの光をビームスプリッタへ向かう方向に反射するように構成された角度付き反射性表面を有する内面を含み得る。【選択図】図１

Apparatus and method for electromagnetic radiation sensing

Systems, methods, and apparatus for providing electromagnetic radiation sensing. The apparatus includes a radiation detection sensor including a plurality of micromechanical radiation sensing pixels having a reflecting top surface and configured to deflect light incident on the reflective surface as a function of an intensity of sensed radiation. In some implementations, the apparatus has equal sensitivities for at least some of the sensing pixels. In some implementations, the apparatus can provide adjustable sensitivity and measurement range. The apparatus can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

一种疫情防控体温检测方法、装置及相关设备

本发明涉及一种疫情防控体温检测方法、装置及相关设备，疫情防控体温检测方法包括云平台接收用户终端发送的访问请求，并根据访问请求中的识别标签判断访问主体；若判断为辅助检测人员，所述云平台向对应的所述用户终端发送测温可控指令；所述用户终端根据测温可控指令控制所述测温模块对访客进行测温操作，并将测温结果上传至所述云平台；所述云平台保存对应访客的访客记录。辅助检测人员在有访客到来时，可以通过远程控制测温模块对访客进行测温操作，不用近距离接触访客，保障了疫情期间的安全。

Thermal imaging with scanning at sub-pixel levels

It is disclosed a thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.

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Micromachined infrared sensitive pixel and infrared imager

Bi-material cantilevers with flipped over material sections and structures formed therefrom

A structure formed from one or more bi-material cantilevers, having a first portion and a second portion positioned end-to-end, wherein the first portion comprises a first material positioned on top of a second material, and wherein the second portion comprises the second material positioned on top of the first material.

Thermostat control

Micro Mirror Arrays for Measuring Electromagnetic Radiation

A radiation imaging apparatus includes an imaging surface; a light source; and an array of micro mirrors that rotate via radiation absorbed in the micro mirrors and reflect light from the light source to generate a distribution of reflected light on the imaging surface. The array first micro mirrors and second micro mirrors. The first micro mirrors have a first structure and the second micro mirrors have a second structure different than the first structure. The second structure is configured to correct for one or more environmental influences on the radiation imaging apparatus. A photodetector captures an image of the distribution of reflected light on the imaging surface. A processor is coupled to the photodetector. A communication interface is coupled with the processor; and a computing device is located separately from the radiation imaging apparatus and in communication with the communication interface.

lnfrarotstrahlungssensoren und Verfahren zum Herstellen von lnfrarotstrahlungssensoren

Ein Infrarotstrahlungssensor weist folgende Merkmale auf: ein Substrat mit einer Hauptoberfläche, die eine Substratebene definiert, eine Membran, die in oder an dem Substrat gebildet ist, wobei zumindest ein Abschnitt der Membran eine ablenkbare Elektrode bildet, und eine Gegenelektrode. Die ablenkbare Elektrode und die Gegenelektrode sind einander in Bezug auf die Substratebene seitlich zugewandt, wobei zwischen der ablenkbaren Elektrode und der Gegenelektrode eine Kapazität gebildet ist. Die Membran weist eine Zusammensetzung auf, die zumindest zwei Schichten aus Materialien mit unterschiedlichen Wärmeausdehnungskoeffizienten aufweist. Die Zusammensetzung weist eine Absorptionsregion auf, die konfiguriert ist, um durch Absorbieren von Infrarotstrahlung eine Verformung der Zusammensetzung zu verursachen, wobei die Verformung zu einer in Bezug auf die Substratebene vertikalen Ablenkung der ablenkbaren Elektrode relativ zu der Gegenelektrode führt, die eine Änderung der Kapazität verursacht.

Sequential beam splitting in a radiation sensing apparatus

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

Light responsive relay