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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2560. Отображено 100.
08-03-2012 дата публикации

Socket for electrical parts

Номер: US20120058683A1
Автор: Satoru Suzuki, Shin Kobayashi, Yuki Ueyama
Принадлежит: Enplas Corp

A socket for an electrical part to prevent a bad electrical connection with a circuit by preventing a deformation of a tip of a contact pin. The contact pin of the present invention comprises one terminal contacts to a terminal of the electrical part and the other terminal contacts to the circuit. When a tip of the other terminal is pressed to a substrate under a state that first and second holes of first and second holding plates are shifted each other, an upper terminal of the held portion of the other terminal contacts to a lower surface of the second holding plate, and makes the second holding plate to separate from the first holding plate against a spring force of a urging member. At this time, the portion projecting from the lower surface of the first holding plate toward the substrate moves into the first hole.

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Номер записи: 1
10-05-2012 дата публикации

Socket for a semiconductor device

Номер: US20120115366A1
Автор: Katsumi Suzuki, Takeyuki Suzuki
Принадлежит: Yamaichi Electronics Co Ltd

A device, wherein, at cells 10 ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20 S of contact terminals 20 ai that have the same structure as each other, and wherein, at the cells 10 ai that correspond to ground lines, contact points 20 CT 2 of the contact terminals 20 ai are inserted in through-holes 12 ai of the lower housing 12, and their contact points 20 CT 1 are inserted into small diameter holes 22 b of conductive collars 22 that touch the inner surfaces of the cells 10 ai.

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Номер записи: 2
06-06-2013 дата публикации

Contactor and semiconductor test apparatus comprising the same

Номер: US20130141129A1
Автор: Tae-Youn LIM
Принадлежит: SAMSUNG ELECTRONICS CO LTD

Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position.

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Номер записи: 3
18-07-2013 дата публикации

Handler apparatus and test method

Номер: US20130181733A1
Автор: Hiroyuki Kikuchi, Mitsunori Aizawa
Принадлежит: Advantest Corp

Provided is a handler apparatus which can connect devices under test to sockets of a test apparatus quickly and with low power consumption. The handler apparatus for conveying and connecting a plurality of devices under test to a plurality of sockets provided on a test head of a test apparatus, includes a position adjusting section that moves each of the plurality of devices under test on the test tray and adjusts the position thereof to a corresponding one of the plurality of sockets; and a device mounting section that mounts the plurality of devices under test whose positions have been adjusted by the position adjusting section, to the plurality of sockets

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Номер записи: 4
16-01-2014 дата публикации

SOCKET FOR TESTING A SEMICONDUCTOR DEVICE AND TEST EQUIPMENT INCLUDING THE SAME

Номер: US20140015559A1
Автор: Lee Youngchul
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A test socket has a housing with an inlet configured to receive a substrate. A plurality of terminals are coupled to the housing, and a plurality of sliding pins are coupled to the terminals. The pins are configured to make contact with respective pads or terminals of the substrate to be tested. The pins have different lengths or positions to send and receive test signals. 1. A test socket , comprising:a socket housing with an inlet configured to receive a substrate;a plurality of terminals coupled to the socket housing; anda plurality of sliding pins coupled to the terminals, the plurality of sliding pins including a first number of the sliding pins having a first length and a second number of sliding pins having a second length different from the first length.2. The test socket of claim 1 , wherein the first number is different from the second number.3. The test socket of claim 1 , wherein:the first number of sliding pins extend from the terminals toward the inlet by a first distance; andthe second number of sliding pins extend from the terminals toward the inlet by a second distance, wherein the second number of sliding pins are provided between and spaced apart from the second number of first sliding pins in a pattern, and the second distance is greater than the first distance.4. The test socket of claim 3 , wherein the pattern is an alternating pattern.5. The test socket of claim 1 , wherein the socket housing comprises a lower housing supporting the terminals and an upper housing coupled to the lower housing.6. The test socket of claim 5 , wherein the upper housing comprisesone or more spacers separating the first number of sliding pins from the second number of sliding pins.7. The test socket of claim 6 , further comprising:one or more guide blocks coupled to the upper housing,the one or more guide blocks extending from the one or more spacers to an outside of the inlet and including at least one surface to guide the substrate into the inlet.8. The test ...

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Номер записи: 5
10-04-2014 дата публикации

TEST SOCKET WITH LOWER AND UPPER RETAINING COVER

Номер: US20140099816A1
Автор: HSIEH Wen-Yi
Принадлежит: HON HAI PRECISION INDUSTRY CO., LTD.

A test socket includes an insulating seat defining a package-receiving room and loaded with a plurality of terminals, a retaining member retained on the insulating seat, a first cover and a second cover. The retaining member defines a first end and a second end. The first cover is assembled to the first end of the retaining member via a pivot pin at a lower end thereof The second cover is assembled to the second end of the retaining member via a second pivot pin at a lower end thereof The second cover presses against the first cover and is locked after the two covers rotate to close the package-receiving room. The first cover defines a pair of wheels at an upper end thereof and rolling along the second cover during the covers rotate downwards. 1. A test socket adapted for connecting an electronic package with a circuit substrate , comprising:an insulating seat defining a package-receiving room for receiving the electronic package and loaded with a plurality of terminals with contacting portions exposed to the package-receiving room;a retaining member retained on the insulating seat and surrounding the plurality of terminals, the retaining member defining a first end and a second end opposite to the first end;a first cover assembled to the first end of the retaining member via a pivot pin at a lower end thereof;a second cover assembled to the second end of the retaining member via a second pivot pin at a lower end thereof, the second cover pressing against the first cover and be locked after said two covers rotate to close the package-receiving room; whereinthe first cover defines a pair of wheels at an upper end thereof and rolling along the second cover during said covers rotate downwards.2. The test socket as claimed in claim 1 , wherein the first cover is assembled with a third pivot pin at the upper end thereof claim 1 , said pair of wheels is disposed at two opposite ends of the third pivot pin.3. The test socket as claimed in claim 2 , wherein the retaining ...

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Номер записи: 6
02-01-2020 дата публикации

TESTING SOCKET AND TESTING APPARATUS

Номер: US20200003802A1
Автор: Chao Ying-Tang, Lee Ping-Che
Принадлежит: POWERTECH TECHNOLOGY INC.

A testing socket including a circuit board having a by-pass circuit and testing pins is provided. The circuit board includes a core dielectric layer, a power plane, and a ground plane. The core dielectric layer has a first surface and a second surface opposite to the first surface. The power plane is located on the first surface of the core dielectric layer, and the power plane is electrically connected to the by-pass circuit. The ground plane is located on the second surface of the core dielectric layer. The testing pins penetrates the circuit board, wherein two ends of each the testing pins are protruding out of the circuit board, a first group of the testing pins are electrically connected to the power plane, and a second group of the testing pins are electrically isolated from the power plane. 1. A testing socket , comprising: a core dielectric layer, having a first surface and a second surface opposite to the first surface;', 'a power plane, located on the first surface of the core dielectric layer, the power plane being electrically connected to the by-pass circuit; and', 'a ground plane, located on the second surface of the core dielectric layer; and, 'a circuit board having a by-pass circuit, the circuit board comprisingtesting pins, penetrating the circuit board, wherein two ends of each the testing pins are protruding out of the circuit board, a first group of the testing pins are electrically connected to the power plane, and a second group of the testing pins are electrically isolated from the power plane.2. The testing socket of claim 1 , wherein the power plane comprises at least one first through hole claim 1 , the ground plane comprises at least one second through hole claim 1 , the at least one first through hole and the at least one second through hole are concentric claim 1 , and a diameter of the at least one first through hole is less than a diameter of the at least one second through hole.3. The testing socket of claim 2 , wherein the testing ...

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Номер записи: 7
03-01-2019 дата публикации

Contact probe and inspection jig

Номер: US20190004090A1
Автор: Tsugio Yamamoto
Принадлежит: Yokowo Co Ltd

A contact probe includes a first plunger, a second plunger, and a coil spring. The coil spring is disposed outside the first plunger, and urges the first plunger and the second plunger in a direction away from each other. The first plunger and the second plunger are fitted to each other so as to be slidable with respect to each other. The first plunger includes a large diameter pail, and a small diameter part provided on a proximal end side of the large diameter part. The small diameter part is fitted into the second plunger. The coil spring includes a close winding part on a side of the second plunger. Adjacent lines of the close winding parts are brought into close contact with each other and come into electrical contact with each other at least in a compressed state of the coil spring.

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Номер записи: 8
13-01-2022 дата публикации

Test carrier and carrier assembling apparatus

Номер: US20220011340A1
Автор: Kazuya Ohtani, Toshiyuki Kiyokawa
Принадлежит: Advantest Corp

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes a through-hole for sucking the DUT that is provided to face the DUT and penetrating through the lid member.

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Номер записи: 9
13-01-2022 дата публикации

Test carrier and carrier assembling apparatus

Номер: US20220011343A1
Автор: Kazuya Ohtani, Toshiyuki Kiyokawa
Принадлежит: Advantest Corp

A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT; and a lid member that covers the DUT and is attached to the carrier body. The lid member includes: a plate-like main body; and a pusher protruding from the main body in a convex shape.

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Номер записи: 10
02-01-2020 дата публикации

ELECTRICAL CONTACT AND ELECTRIC COMPONENT SOCKET

Номер: US20200006882A1
Автор: ISAGODA Satoru
Принадлежит: Enplas Corporation

An electrical contact and an electric component socket, in which a plurality of protruding portions come in contact with a terminal of an electric component, ensuring to prevent the defect of a large flaw formed on the terminal as well as improve durability of the electrical contact. An electrical contact includes a contacting portion which comes in contact with a terminal of an electric component . The contacting portion includes a plurality of convex portions around a center of a tip portion of the contacting portion . The convex portion has a plurality of protruding portions on a tip of a mountain-shaped portion of the convex portion . The electrical contact is configured to bring the plurality of protruding portions into contact with the terminal to achieve the electrical connection to the electric component 1. An electrical contact comprising:a contacting portion that comes in contact with a terminal of an electric component,wherein the contacting portion includes a plurality of convex portions provided around a center of a tip portion of the contacting portion,the convex portion includes a plurality of protruding portions, each protruding portion being formed on a tip of a mountain-shaped portion of the convex portion, andthe protruding portions come in contact with the terminal to be electrically connected to the electric component.2. The electrical contact according to claim 1 ,wherein a first valley-shaped portion is provided between the convex portions,the two protruding portions are formed on a tip of the mountain-shaped portion of the convex portion, anda second valley-shaped portion at a depth position shallower than the first valley-shaped portion is provided between the protruding portions.3. The electrical contact according to claim 2 , wherein each of the two protruding portions formed on the tip of the mountain-shaped portion of one of the convex portions is formed to have a different height of each mountain-shaped portion of the protruding ...

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Номер записи: 11
09-01-2020 дата публикации

PROBE SOCKET

Номер: US20200011895A1
Автор: Jeong Jae-Hwan
Принадлежит:

A probe socket for inspecting electric characteristics of an object to be tested. The probe socket includes a plurality of power pins for applying power to the object to be tested, a plurality of ground pins arranged in parallel with the power pins, a support block for accommodating and supporting the plurality of power pins or ground pins in parallel, and a conductive plate arranged inside the support block in a direction transverse to lengthwise directions of the power pin and the ground pin and having at least one of a power connection pattern for electrically connecting the plurality of power pins in common and a ground connection pattern for electrically connecting the plurality of ground pins in common. 1. A probe socket for inspecting electric characteristics of an object to be tested , the probe socket comprising:a plurality of power pins configured to be in contact with power terminals of the object to be tested;a support block configured to accommodate and support the plurality of power pins in parallel; anda conductive plate arranged inside the support block in a direction transverse to a lengthwise direction of the power pin and having a power connection pattern to electrically connect the plurality of power pins in common.2. The probe socket according to claim 1 , further comprising a plurality of ground pins configured to be in contact with ground terminals of the object to be tested claim 1 , and supported in the support block claim 1 ,wherein the conductive plate is arranged inside the support block in a direction transverse to a lengthwise direction of the ground pin and having a ground connection pattern to electrically connect the plurality of ground pins in common.3. The probe socket according to claim 2 , wherein the power connection pattern or the ground connection pattern is arranged on an insulation sheet.4. The probe socket according to claim 2 , wherein the conductive plate comprises a first conductive plate having the power connection ...

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Номер записи: 12
15-01-2015 дата публикации

On-Center Electrically Conductive Pins For Integrated Testing

Номер: US20150015293A1
Автор: Andres Michael, Johnson David, Nelson John, Patel Sarosh
Принадлежит:

A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper () and lower () section and a hinge in between which allow flex of both upper and lower contact () which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability. It also includes a structure and method for removing upper pins by use of a modified hinge . In an alternate embodiment, the lower section includes a leg extension and a sliding contact land which slides against an aperture in the housing. A spacer provides space for decoupling components on the load board. The hinge may include a truncated cylinder which is configured to permit remove of the upper pin without removal of the lower. 1. A socket for making electrical connection between an integrated circuit device under test (DUT) having a plurality of contacts and a load board having a plurality of contact pads so that a signal may be transmitted therebetween wherein said contact and its corresponding pad are generally vertically aligned along a contact axis , comprising:a. a housing having a top and bottom, said guide being interposed between said contacts and said pads and including a plurality of spaced apart insulating and separating plates thereby defining a plurality of slots for receiving pin pairs; with said slots being generally at least partially axially aligned along said contact axis; said guide further including a longitudinal bore substantially orthogonal to said axis and extending through at least some of said plates thereby creating a cavity for an elastomer;b. an elongated elastomer sized to be received within said bore;c. a multi-piece pin pair including:a first upper pin leg having a contact tip at its distal end, an upper body portion extending from said tip and a upper hinge part at its proximal end;a second lower pin leg having a load board ...

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Номер записи: 13
15-01-2015 дата публикации

Test Socket With Hook-Like Pin Contact Edge

Номер: US20150015294A1
Автор: TAN Hui Li Natali, TAN Hui Shan Melisa
Принадлежит: Test Max Manufacturing Pte Ltd

The present invention provides a test socket adaptable for testing different Integrated Circuit (IC) pad size during an IC testing. The test socket comprising a molded socket having an inner space and a plurality of through-apertures disposed on its surface; and a plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end; wherein each pin contact edge extends through the through-apertures of the molded socket; wherein each pin contact edge provides a linear surface area for contact with the DUT's lead; and wherein each pin contact edge provides a large contact area for various DUT's lead size. 1. A test socket adaptable for testing a Device Under Test (DUT) with leads , the test socket comprising:a molded socket having an inner space and a plurality of through-apertures disposed on its surface;a floating nest supported by a plurality of springs on top of the molded socket, Wherein the DUT is placed onto the floating nest during test; anda plurality of contact elements disposed within the inner space of the molded socket, each contact element has a pin contact edge and a pin-end,wherein each pin contact edge extends through the through-apertures of the molded socket for contacting with the DUT during test;wherein each pin contact edge defines a linear surface area for contacting with the DUT's lead; andwherein each pin contact edge provides a large contact area relative to contact top for various DUT's lead size.2. The test socket according to claim 1 , wherein the contact elements are aligned together in pairs in consecutive rows claim 1 , each pair positioned to contact a corresponding DUT's lead.3. The test socket according to claim 2 , wherein each pair of the contact elements are in a mirror image configuration.4. The test socket according to claim 1 , wherein the pin contact edge is alike a sharp arrow angled at least 45° diagonally upwards.5. (canceled)6. (canceled)7. (canceled ...

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Номер записи: 14
03-02-2022 дата публикации

Hybrid automated testing equipment for testing of optical-electrical devices

Номер: US20220034750A1
Автор: Chris Barnard, Piotr Myslinski, Roberto Marcoccia, Steven William Keck, Theodore J. Schmidt
Принадлежит: Juniper Networks Inc

A hybrid optical-electrical automated testing equipment (ATE) system can implement an optical test assembly that includes an electrical interface and an optical interface with an optical-electrical device under test. The optical assembly can include a socket on which the device is placed by the ATE system to connect electrical and optical connections. The optical connections can couple light through the socket and the optical assembly to one or more testing devices to perform efficient testing of optical devices, such as high-speed optical transceivers.

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Номер записи: 15
19-01-2017 дата публикации

SYSTEMS AND METHODS FOR GENERATING AND PRESERVING VACUUM BETWEEN SEMICONDUCTOR WAFER AND WAFER TRANSLATOR

Номер: US20170016954A1
Автор: EKSTROM DAVID, Johnson Morgan T., Kalnin Nikolai, Lane Christopher T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies on a wafer includes a wafer translator having a wafer-side facing toward the wafer, and an inquiry-side facing away from the wafer-side. The wafer has an active side facing the translator. The apparatus includes a peripheral seal configured to seal a space between the wafer translator and the wafer, and a valve in a fluidic communication with the space between the wafer translator and the wafer. 1. An apparatus for testing semiconductor dies on a wafer , comprising:a wafer translator having a wafer-side facing toward the wafer, and an inquiry-side facing away from the wafer-side;the wafer having an active side facing the translator;a peripheral seal configured to seal a space between the wafer translator and the wafer; anda valve in a fluidic communication with the space between the wafer translator and the wafer.2. The apparatus of claim 1 , wherein the valve is a first valve configured for supplying an inert gas claim 1 , the apparatus further comprising a second valve configured for evacuating the inert gas from the space between the wafer translator and the wafer.3. The apparatus of claim 2 , further comprising a third valve in the fluidic communication configured for supplying air to the space between the wafer translator and the wafer.4. The apparatus of claim 3 , wherein at least one of the first claim 3 , the second claim 3 , and the third valve is a MEMS based valve.5. The apparatus of claim 4 , further comprising a MEMS based pump integrated with the MEMS based valve.6. The apparatus of claim 1 , wherein the valve is configured at least partially within a wafer translator substrate.7. The apparatus of claim 1 , wherein the valve is configured apart from the wafer translator.8. The apparatus of claim 1 , wherein the valve is an opening in the wafer translator claim 1 , the apparatus further ...

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Номер записи: 16
17-04-2014 дата публикации

Ground contact of an integrated circuit testing apparatus

Номер: US20140103952A1
Автор: FOONG Wei Kuong, GOH Kok Sing, Shamal Mundiyath
Принадлежит: JF Microtechnology Sdn Bhd

A ground electrical contact for an integrated circuit (IC) testing apparatus that comprises: a rigid bottom member having two planar surfaces that slope towards each other, so that the bottom member forms a partial wedge shape with the top end of the wedge being narrower than the bottom end; a flexible top member having two arms extending over said bottom member such that the top member forms an inverted U-shape, said two arms having an inwards bias such that an inner surface of each arm is pressed in contact with each planar surface; and a compressible member located between the narrower end of said bottom member and a bifurcation inner surface, which is an inner surface where the two arms bifurcate in the top member. The bottom member and top member are made of an electrically conductive material.

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Номер записи: 17
21-01-2021 дата публикации

Integrated circuit contact test apparatus with and method of construction

Номер: US20210018533A1
Автор: Jeffrey Sherry, Joel Erdman
Принадлежит: Johnstech International Corp

A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base ( 16 ) with apertures ( 30 ) for insertion of test pin insert blocks ( 28 ). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins ( 32 ) from the housing.

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Номер записи: 18
22-01-2015 дата публикации

SYSTEMS AND METHODS FOR CONFORMING TEST TOOLING TO INTEGRATED CIRCUIT DEVICE PROFILES WITH COAXIAL SOCKET

Номер: US20150022226A1
Автор: Barabi Nasser, Ho Chee Wah, Kryachek Oksana, Nazarov Elena V., Tienzo Joven R.
Принадлежит:

A coaxial socket useful in association with an integrated circuit (IC) device tester and having a conducting pin surrounded by an insulating layer and embedded in a conducting base. This coaxial pin configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits. 1. A thermal control unit (TCU) is used in association with an IC tester. The TCU is configured to maintain a set point temperature on an IC device under test (DUT) and operatively coupled to a test socket assembly. The TCU comprises;a pedestal assembly with a heat-conductive pedestal having a bottom end configured to contact the die of the DUT;a temperature-control fluid circulation block;a thermally-conductive heater having a fuse coupled to a heating element;a substrate pusher configured to contact the substrate of the DUT; anda controllable force distributor for receiving a force and controllably distribute such force between the pedestal assembly and the substrate pusher.2. A coaxial test socket assembly useful in association with an integrated circuit (IC) device tester , the coaxial socket assembly comprising:a socket contactor frame with an opening configured to accommodate an IC device under test (DUT);a heat transfer plate made of a material having high thermal conductivity; a spring-loaded metallic plunger', 'a metallic barrel wherein the spring-loaded metallic plunger can move inside the metallic barrel under the poll or push of the spring;', 'an insulating layer surrounding the metallic barrel;, 'an array of coaxial pins having good thermal conductivity and good electrical signal transmission is configured to contact the DUT. The coaxial pin comprisesa socket base hosting the top part of the array of coaxial pins;a socket bottom hosting the bottom part of the array of coaxial pins.3. The coaxial pin of is configured to efficiently transfer heat to the IC device under test.4. The coaxial pin of is configured to ...

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Номер записи: 19
21-01-2021 дата публикации

Spring Pin-Based Electrical Interconnect System

Номер: US20210021072A1
Автор: Nelson Larre H.
Принадлежит:

A spring pin-based electrical interconnect system with a non-conductive socket body, a spring pin located in part in the socket body and defining two ends, an anisotropically-conductive elastomeric sheet with first and second opposed surfaces wherein the first surface is in contact with a first end of the spring pin. A PCB is in contact with the second surface of the elastomeric sheet. 1. A spring pin-based electrical interconnect system , comprising:a non-conductive socket body;a spring pin located in part in the socket body and defining two ends;an anisotropically-conductive elastomeric sheet with first and second opposed surfaces, wherein the first surface is in contact with a first end of the spring pin; anda PCB in contact with the second surface of the elastomeric sheet.2. The system of claim 1 , wherein the spring pin comprises a top plunger and a bottom plunger and an exterior spring.3. The system of claim 2 , wherein the socket body defines a cavity in which the spring pin is at least in part located.4. The system of claim 3 , wherein the top plunger and the bottom plunger each comprise a flange located in the socket body cavity.5. The system of claim 3 , wherein the top plunger comprises a flange located in the socket body cavity claim 3 , and the bottom plunger comprises a flange that sits on the elastomeric sheet.6. The system of claim 1 , wherein the elastomeric sheet is configured to facilitate electrical connection between the spring pin and an electrical contact on the PCB.7. A spring pin claim 1 , comprising:a top plunger element defining an electrical contact at one end, and a plunger at an opposed end;a bottom barrel element that defines a cavity with an open top, wherein the plunger of the top plunger element is located and able to move up and down within the cavity, and a bottom tip with a through-hole that communicates with the cavity; anda spring located outside of the top and bottom elements, the spring configured to produce a force that ...

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Номер записи: 20
26-01-2017 дата публикации

LOST MOTION GASKET FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20170023642A1
Автор: Buck Doug, Gardiner Mark, Johnson Morgan T., Kalnin Nikolai, Lane Christopher T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies includes a semiconductor wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer-side. The apparatus also includes a flexible arm peripherally connected to the wafer translator, and an evacuation opening within the flexible arm or within the wafer translator. The evacuation opening is open to a flow of a gas in a first position of the flexible arm, and closed to a flow of the gas in a second position of the flexible arm. 1. An apparatus for testing semiconductor dies , comprising:a semiconductor wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer-side;a flexible arm peripherally connected to the wafer translator; andan evacuation opening at least partially disposed within the flexible arm or within the wafer translator2. The apparatus of wherein the evacuation opening is open to a flow of a gas in a first position of the flexible arm claim 1 , and closed to the flow of the gas in a second position of the flexible arm.3. The apparatus of claim 2 , further comprising a vent seal at least partially disposed inside the evacuation opening claim 2 , wherein the vent seal closes the evacuation opening in the second position of the flexible arm.4. The apparatus of claim 2 , further comprising a vent seal at least partially disposed over an opening of the evacuation opening claim 2 , wherein the vent seal closes the evacuation opening in the second position of the flexible arm.5. The apparatus of wherein the flexible arm comprises an elastomer.6. The apparatus of wherein the flexible arm is attached to a chuck attachment.7. The apparatus of wherein the wafer translator is in contact with a semiconductor wafer in the second position of the flexible arm.8. The ...

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Номер записи: 21
25-01-2018 дата публикации

TEST SYSTEMS WITH A PROBE APPARATUS AND INDEX MECHANISM

Номер: US20180024165A1
Автор: Dunklee John L., Funk William A., Root Bryan J.
Принадлежит:

A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder. 1. A system for testing a semiconductor device comprising:a circuit board having a pattern of signal contacts and a pattern of guard contacts, the circuit board is configured as a plate having a top side, a bottom side, and an opening through the top and bottom sides;a probe card including a wire guide, a probe tile connected with the wire guide, a plurality of probe wires supported by the wire guide and probe tile, the probe wires are positioned through the wire guide and the probe tile, the probe wires includes a probe tip extending through the probe tile, the probe tips forming an array to probe a device under test, each probe wire includes a signal transmitting portion and a guard portion exposed from the wire guide, the signal transmitting portions and the guard portions form a contact pattern and, with the array, are disposed on one side of the probe card, and a retainer member is disposed on another side of the probe card;a holder having multiple probe card stations, the probe card stations have a connector structure to connect to and disconnect from the retainer member of the probe card, and to allow the probe card to both contact the circuit board and a device under test; anda ...

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Номер записи: 22
10-02-2022 дата публикации

SOCKET

Номер: US20220043026A1
Автор: UEYAMA Yuki
Принадлежит:

This socket is provided with: a socket body in which a to-be-inspected member is housed and which also has a to-be-locked part; a cover which is disposed at the upper side of the socket body; and a locking member which is supported by the cover and which has a shaft part extending in the vertical direction and a locking part extending in a direction intersecting with the vertical direction, wherein the cover becomes fixed to the socket body when the locking member is rotated about an axial line thereof and the locking part engages the to-be-locked part. 1. A socket , comprising:a socket body in which an inspected member is housed and which includes a locked portion;a cover placed on an upper side of the socket body; anda locking member which is supported by the cover and includes a shaft portion extending in a vertical direction and a locking portion extending in a direction intersecting the vertical direction, whereinthe cover is fixed with respect to the socket body by rotation of the locking member about its own axis to engage with the locked portion.2. The socket according to claim 1 , whereinthe cover includes a through hole penetrating in the vertical direction, andthe locking portion is inserted into the through hole.3. The socket according to claim 1 , whereinthe locking portion includes a first locking portion and a second locking portion each extending laterally from the shaft portion.4. The socket according to claim 1 , wherein a frame body including a hole which allows the locking portion to enter the hole; and', 'a placing portion which is surrounded by the frame body and on which the inspected member is placed, and, 'the socket body incudesthe hole includes a small diameter hole and a large diameter hole which is connected to the small diameter hole, anda surface which connects between a surface defining the small diameter hole and a surface defining the large diameter hole functions as the locked portion.5. The socket according to claim 1 , further ...

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Номер записи: 23
04-02-2016 дата публикации

SOCKET FOR TESTING SEMICONDUCTOR DEVICE

Номер: US20160033551A1
Автор: KANG Seung Nam, YUN Chae Young
Принадлежит:

A socket for testing a semiconductor to electrically connect electrodes of a test device and contact balls of a semiconductor device with each other, including: contactors each of which has an upper end portion protruding to one side from a vertical line and a lower end portion protruding to the other side in such a way as to have elasticity by a structure that the upper end portion and the lower end portion are symmetric with each other; insulation parts each of which is made of an insulating elastic material and is formed integrally with the contactor to absorb the force generated when coming in contact with the contactor; and guide films each of which is made with an insulating elastic body and is formed on an upper layer of the insulation part in order to align the contact balls of the semiconductor device and the contactors. 1. A socket for testing a semiconductor device to electrically connect electrodes of a test device and contact balls of a semiconductor device with each other comprising:contactors each of which has an upper end portion protruding to one side from a vertical line and a lower end portion protruding to the other side so as to have elasticity by a structure that the upper end portion and the lower end portion are symmetric with each other, thereby transferring a force vertically generated to a Z-axis direction and coming into elastic contact with the electrodes of the test device and the contact balls of the semiconductor device;insulation parts each of which is made of an insulating elastic material and is formed integrally with the contactor to absorb the force generated when coming in contact with the contactor; andguide films each of which is made with an insulating elastic body and is formed on the insulation part in order to align the contact balls of the semiconductor device and the contactors.2. The socket according to claim 1 , wherein the upper end portion protruding to one side from the vertical line and the lower end portion ...

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Номер записи: 24
30-01-2020 дата публикации

SYSTEM AND METHOD OF TESTING A SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

Номер: US20200033389A1
Автор: Cho Yongho, KIM Junbae
Принадлежит:

A semiconductor device test system may include a body providing an internal space, in which a test device is loaded, and a cover coupled to the body to cover the internal space. The cover may include a first cover including first openings two-dimensionally arranged and a second cover including second openings two-dimensionally arranged. An arrangement of the first openings may be different from an arrangement of the second openings. 1. A semiconductor device test system , comprising:a body including an internal space, in which a test device is loaded; anda cover coupled to the body to cover the internal space,wherein the cover comprises:a first cover including first openings; anda second cover including second openings, andan arrangement of the first openings is different from an arrangement of the second openings.2. The semiconductor device test system of claim 1 , wherein the first openings are offset from the second openings claim 1 , respectively claim 1 , when viewed in a plan view.3. The semiconductor device test system of claim 1 , wherein centers of the first openings are offset from centers of the second openings claim 1 , respectively claim 1 , when viewed in a plan view.4. The semiconductor device test system of claim 1 , wherein claim 1 , when viewed in a plan view claim 1 , a first region claim 1 , which is defined by a line connecting centers of outermost ones of the first openings claim 1 , is overlapped with a second region claim 1 , which is defined by a line connecting centers of outermost ones of the second openings.5. The semiconductor device test system of claim 4 , wherein claim 4 , when viewed in a plan view claim 4 , the first region has a smaller area than the test device claim 4 , and the test device has a smaller area than the second region.6. The semiconductor device test system of claim 1 , wherein distances from centers of two adjacent openings of the first openings to one of the second openings adjacent thereto are substantially equal ...

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Номер записи: 25
24-02-2022 дата публикации

CONDUCTIVE PARTICLE AND TESTING SOCKET COMPRISING THE SAME

Номер: US20220057434A1
Автор: KIM Gyu Sun
Принадлежит:

An embodiment of the present invention provides a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle comprises a plurality of protrusions formed at equal intervals along a circumference. 1. A conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board , wherein the conductive particle comprises a plurality of protrusions formed at equal intervals along a circumference.2. The conductive particle of claim 1 , wherein the protrusion is formed with a first protrusion to a fourth protrusion having a square shape.3. The conductive particle of claim 2 , wherein an end of the protrusion is formed to be curved.4. The conductive particle of claim 1 , wherein the protrusion is formed with a first protrusion to a third protrusion having a square shape.5. The conductive particle of claim 4 , wherein an edge of the protrusion is formed to be curved.6. The conductive particle of claim 1 , wherein the conductive particle has a predetermined thickness t and a predetermined diameter d claim 1 , and the thickness t is 90% or less of the diameter d.7. The conductive particle of claim 6 , wherein the thickness t is greater than or equal to 10% and less than or equal to 90% of the diameter d.8. The conductive particle of claim 7 , wherein the thickness t is greater than or equal to 30% and less than or equal to 70% of the diameter d.9. The conductive particle of claim 7 , wherein the thickness t is greater than or equal to 10 μm and less than or equal to 50 μm.10. A testing socket comprising the conductive particle of claim 1 , comprising:a conductive portion electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device ...

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Номер записи: 26
19-02-2015 дата публикации

Universal watthour meter socket/adapter for field testing

Номер: US20150048857A1
Автор: Joseph P. Joyce, Robert L. Kindschi
Принадлежит: RADIAN RESEARCH Inc

A universal meter socket for portable test equipment has low insertion and extraction forces. The universal meter socket is durable and light in weight, providing a long service life. The universal meter socket contains field-cleanable terminals with replaceable wear components. The universal meter socket also optimizes short current paths for the high current section of the meter, further reducing equipment weight by reducing wire weight and volt-ampere (hereinafter sometimes VA) drive requirements for test equipment. The universal meter socket complies with ANSI C12.7-2005 REQUIREMENTS FOR WATTHOUR METER SOCKETS. The universal meter socket is generally intended for use with electricity meters that comply with ANSI C12 requirements.

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Номер записи: 27
16-02-2017 дата публикации

SOCKET APPARATUS FOR SEMICONDUCTOR DEVICE TEST

Номер: US20170045551A1
Автор: Hwang Dong Weon, Hwang Jae Baek, HWANG Jae Suk
Принадлежит:

Disclosed a socket apparatus for a semiconductor device test, the apparatus including: body elements () into which contacts () are inserted; movable elements () on which a semiconductor device (IC) is seated; a socket cover () assembled to the movable elements () and resiliently assembled to the body elements (); and a semiconductor device pressing part () pressing and fixing the semiconductor device (IC) seated on the movable elements (), wherein the semiconductor device pressing part () includes: a pusher plate () having an opening cam () and coming into surface contact with an upper surface of the semiconductor device (IC) and applies pressure thereto; a latch () of which ends are hingedly assembled to the socket cover () and the pusher plate (); and a link () of which ends are hingedly assembled to the socket body () and the latch (). 1. A socket apparatus for a semiconductor device test , the socket apparatus comprising:{'b': 100', '101, 'a socket body () provided with a plurality of first receiving holes () for receiving contacts therein;'}{'b': 200', '100', '200', '201', '200', '101', '400, 'a lower plate () provided in a lower portion of the socket body (), the lower plate () being provided with a plurality of second receiving holes () that is formed through the lower plate () and respectively communicates with the first receiving holes () such that lower contact portions of the contacts () come into electric contact with leads of a printed circuit board (PCB);'}{'b': 300', '1', '100', '300', '301', '300, 'a floating plate () supported by a plurality of first elastic materials (S) at an upper location of the socket body () so as to be movable up and down, the floating plate () having an upper surface serving as a seating surface to seat a semiconductor device thereon, and a plurality of through holes () where upper contact portions of the contacts are held therein while passing through the floating plate ();'}{'b': 400', '101', '201', '400', '400', '301, ' ...

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Номер записи: 28
06-02-2020 дата публикации

ELECTRICAL CONTACT AND ELECTRIC COMPONENT SOCKET

Номер: US20200044378A1
Автор: ISAGODA Satoru, KANESASHI Hokuto, Miura Akira
Принадлежит: Enplas Corporation

An electrical contact and an electric component socket configured to be electrically connected to an electric component, wherein the electrical contact is capable of preventing a defect that a contacting portion of the electrical contact bites into a terminal of the electric component, leaving an indentation or giving rise to a state where burrs are liable to occur. An electrical contact has a contacting portion that comes in contact with a terminal of an electric component, the contacting portion includes a plurality of convex portions provided around a center in a tip portion of the contacting portion, the convex portions have flat portions on an outer circumferential side, and peak-shaped portions extending from the flat portions toward the center to come in contact with the terminal, and the contacting portion includes valley-shaped portions, each valley-shaped portion being formed between the respective convex portions in the plurality of convex portions. 1. An electrical contact comprising:a contacting portion that comes in contact with a terminal of an electric component,wherein the contacting portion includes a plurality of convex portions provided around a center of a tip portion of the contacting portion,the convex portions have flat portions on an outer circumferential side, and peak-shaped portions extending from the flat portions toward the center to come in contact with the terminal, andthe contacting portion has a plurality of valley-shaped portions, each valley-shaped portion being formed between respective convex portions of the plurality of convex portions.2. The electrical contact according to claim 1 , wherein the plurality of valley-shaped portions comprise a combination of the valley-shaped portions having different valley depths.3. The electrical contact according to claim 2 , wherein each valley-shaped portion comprises a valley bottom portion claim 2 , and at least a part of the valley bottom portion has a flat strip shape.4. The electrical ...

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Номер записи: 29
03-03-2022 дата публикации

Electronics tester

Номер: US20220065921A1
Автор: Jovan Jovanovic, Kenneth W. Deboe, Scott E. Lindsey, Steven C. Steps
Принадлежит: Aehr Test Systems Inc

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

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Номер записи: 30
14-02-2019 дата публикации

ELECTRICAL TESTING JIG

Номер: US20190049487A1
Автор: Chen Han, Ni Zhuoyan, NING Peihuan, QIAO Kai, Sun Wei, WAN Bin, ZENG Weiquan, Zhu Shilin
Принадлежит:

An electrical testing jig includes: a substrate; a first bracket on the substrate, the first bracket having a first step extending in a first direction on a top of the first bracket; and a second bracket on the substrate, the second bracket being spaced apart from the first bracket in a second direction perpendicular to the first direction and having two second steps spaced apart from each other in the first direction on a top of the second bracket. Each of the second steps is angular. 1. An electrical testing jig for carrying and positioning a touch screen , comprising:a substrate;a first bracket on the substrate, the first bracket having a first step extending in a first direction on a top thereof; anda second bracket on the substrate, the second bracket being spaced apart from the first bracket in a second direction perpendicular to the first direction and having two second steps spaced apart from each other in the first direction on a top of the second bracket, each of the second steps being angular.2. The electrical testing jig according to claim 1 , wherein the substrate is provided with a first slideway extending in the second direction claim 1 , and the first bracket cooperates with the first slideway slidably.3. The electrical testing jig according to claim 1 , wherein the substrate is provided with a first slideway extending in the second direction claim 1 , and the second bracket cooperates with the first slideway slidably.4. The electrical testing jig according to claim 1 , wherein two positioning blocks spaced apart from each other in the first direction are provided on the top of the second bracket claim 1 , each of the positioning blocks having an angular notch claim 1 , and the second steps are respectively formed at two angular notches.5. The electrical testing jig according to claim 4 , wherein a second slideway extending in the first direction is provided on the top of the second bracket claim 4 , and at least one of the two positioning blocks ...

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Номер записи: 31
25-02-2016 дата публикации

Socket for semiconductor chip test and method of manufacturing the same

Номер: US20160054384A1
Автор: Dong Ho Ha, Jong Cheon SHIN
Принадлежит: Individual

Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

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Номер записи: 32
13-02-2020 дата публикации

CONTACT AND SOCKET DEVICE FOR TESTING SEMICONDUCTOR

Номер: US20200049736A1
Автор: Hwang Dong Weon, Hwang Jae Baek, Hwang Logan Jae
Принадлежит:

Disclosed are a hybrid-type contact and a socket device for testing a semiconductor device, in which the hybrid-type contact includes a first contact unit integrally configured by rolling a predetermined shaped strip pattern formed by blanking a metal plate into a cylindrical shape, a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit, and a molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together, so as to compensate the disadvantages of conventional pin-type and rubber-type test socket devices, whereby it is easy to optimize the mechanical and electrical properties according to the requirements of the test device, and it is suitable for testing a fine pitch device. 1. A hybrid-type contact comprising:a first contact unit integrally configured by rolling a strip pattern formed by blanking a metal plate into a cylindrical shape;a second contact unit with conductivity and elasticity configured to be inserted into the first contact unit; anda molding portion of insulating elastic material configured to integrally fix the first contact unit and the second contact unit together.2. The hybrid-type contact of claim 1 , wherein the second contact unit is in a cylindrical shape of elastic material mixed with conductive particles.3. The hybrid-type contact of claim 1 , wherein the second contact unit is a coil spring.4. The hybrid-type contact of claim 1 , wherein the second contact unit is integrally configured by blanking a metal plate and rolling the metal plate into a cylindrical shape.5. The hybrid-type contact of further comprising a third contact unit with conductivity and elasticity configured to be inserted into the second contact unit and be integrally fixed by the molding portion.6. The hybrid-type contact of claim 5 , wherein the third contact unit is disposed on at least one of upper and lower portions of the second contact unit. ...

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Номер записи: 33
22-02-2018 дата публикации

TEST HANDLER HEAD HAVING REVERSE FUNNEL DESIGN

Номер: US20180052188A1
Автор: Bettendorf Tyler, Du Thanh, Duffy James, Mandafe Jay Gem, Mulle Julius, Rowe David
Принадлежит: Delta Design, Inc.

A test head for a semiconductor device handler includes a plunger; and a funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert. The plunger includes a projecting portion that extends through the channel of the funnel insert. When the spring is in an uncompressed state, a distal end of the funnel insert extends past a distal end of the projecting portion of the plunger. 1. A test head for a semiconductor device handler , the test head comprising: a funnel alignment portion including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the plunger and configured to contact upper edges of a semiconductor device to center the semiconductor device in the plunger,', 'wherein a channel extends through the plunger, including the funnel alignment portion; and, 'a plunger includinga vacuum pad extending through the channel of the plunger and the funnel alignment portion, the vacuum pad being configured to contact an upper surface of the semiconductor device and supply a vacuum to hold the semiconductor device in the test head.2. A test head for a semiconductor device handler , the test head comprising:a plunger; anda funnel insert attached to the plunger via a funnel insert spring, the funnel insert having a channel extending axially therethrough, and the funnel insert including a plurality of sloped inner walls that are sloped outwardly in a distal direction of the funnel insert and configured to contact upper edges of a semiconductor device to center the semiconductor device in the funnel insert,wherein the plunger includes a projecting portion that extends through the channel of the funnel insert, andwherein, when ...

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Номер записи: 34
15-05-2014 дата публикации

Pin for a semiconductor chip test, and socket for a semiconductor chip test including same

Номер: US20140134899A1
Автор: Gyeong-Hwa Na
Принадлежит: Individual

This patent is about “A New Test Socket Pin & Socket Design for Semiconductor Chip Test”. According to the present invention, there is huge improvement on pin movement with different types of shape and materials. It makes better and stable contact between chip and PCB pad thanks to pivot shaft and rectangle elastomers. So it finally improves reliability of testing. In addition, there is cost reduction effect as we use the pin twice. Once the first contact terminal(Left side of pin) is worn out, the pin can be rotated to its other contact terminal(Right side) and reuse the opposite terminal.

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Номер записи: 35
03-03-2016 дата публикации

TEST SOCKET FOR SEMICONDUCTOR DEVICE AND TEST DEVICE INCLUDING THE SAME

Номер: US20160061861A1
Автор: HAN Jong-won, KIM Mi-So
Принадлежит:

Provided are a test socket for a semiconductor device and a test device including the test socket. The test device includes a test socket including terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device and a ground line extending along at least one row of two-dimensional array; and a substrate electrically connected to the test socket so as to transmit and receive a test signal. The test socket includes a ground line extending along at least one row of the two-dimensional array. 1. A test device , comprising:a test socket having a first surface that comes in contact with a semiconductor device to be tested, a second surface opposite the first surface, and a two-dimensional array of terminals that correspond to terminals of the semiconductor device, the test socket including a ground line extending along at least one row of the terminals in the two-dimensional array of the terminals; anda substrate electrically connected to the test socket so as to transmit and receive a test signal.2. (canceled)3. The test device as claimed in claim 1 , wherein the two-dimensional array has an external square shape claim 1 , and the ground line extends along at least a part of the external square shape of the two-dimensional array.4. The test device as claimed in claim 3 , wherein the ground line surrounds the external square shape of the two-dimensional array.5. The test device as claimed in claim 3 , wherein the ground line includes a first portion positioned along at least a part of the external square shape of the two-dimensional array and a second portion branching from the first portion and extending in a non-parallel direction with the first portion.6. The test device as claimed in claim 5 , wherein the ground line includes two or more second portions.7. The test device as claimed in claim 5 , wherein the second portion branches perpendicularly from the first portion.8. The test device as claimed in claim 5 , wherein the ...

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Номер записи: 36
02-03-2017 дата публикации

COAXIAL INTEGRATED CIRCUIT TEST SOCKET

Номер: US20170059611A1
Автор: Lesnikoski Ronald
Принадлежит:

Embodiments are described for integrating full-coaxial signal pins in an integrated circuit (IC) test socket. The socket can be made of a conductive metal (e.g., aluminum), and can be drilled with a large number of holes for conductive pins to interface between a printed circuit board (on which the socket is mounted) and an IC being tested. The pins can include ground pins, low-speed signal (and/or power) pins, and coaxial pin assemblies for high-speed signals (HSS). Each coaxial pin assembly can include a conductive HSS pin, having a HSS probe disposed in a spring-loaded HSS barrel, and an insulative bushing. The HSS pin is surrounded by the insulative bushing, which is disposed in a hole of the conductive socket body, thereby forming a full coaxial pin with controlled impedance characteristics. 1. An integrated circuit (IC) test socket comprising:a conductive metal IC socket body comprising a plurality of holes; and a conductive high-speed signal (HSS) pin comprising a HSS probe disposed in a spring-loaded HSS barrel; and', 'an insulative bushing disposed in the first hole and surrounding the HSS pin in such a way as to form a controlled spacing between an outer surface of the HSS pin and an inner surface of the first hole., 'a coaxial pin assembly installed in a first of the holes and comprising2. The IC test socket of claim 1 , wherein:each hole has a height defined according to a thickness of the IC socket body through which the hole is drilled; andthe insulative bushing extends over substantially the height of the first hole.3. The IC test socket of claim 1 , further comprising:a ground pin assembly comprising a conductive ground pin having a ground probe disposed in a spring-loaded ground barrel,wherein the ground pin assembly is installed in a second of the holes in such a way as to form substantial electrical contact between an outer surface of the ground pin and an inner surface of the second hole.4. The IC test socket of claim 1 , further comprising: a ...

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Номер записи: 37
04-03-2021 дата публикации

TESTING MODULE AND TESTING METHOD USING THE SAME

Номер: US20210063471A1
Автор: Chen Hao, Wang Mill-Jer
Принадлежит: Taiwan Semiconductor Manufacturing Co., Ltd.

A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors. 1. A testing module for a semiconductor wafer-form package , comprising:a circuit board structure, comprising two edge regions and a main region located therebetween;first connectors, located over the edge regions and connected to the circuit board structure;a first connecting structure, located over and distant from the circuit board structure;second connectors and third connectors, located over and connected to the first connecting structure, wherein the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region; anda first bridge connector, electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.2. The testing module of claim 1 , wherein the first bridge connector comprises a plurality of parallel conductive wires.3. The testing module of claim 1 , wherein the first connecting structure comprises a circuit board or a plurality of parallel conductive wires.4. The testing ...

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Номер записи: 38
04-03-2021 дата публикации

Socket for Electrical Component

Номер: US20210066871A1
Автор: HACHUDA Osamu
Принадлежит: Enplas Corporation

To provide a socket for electrical component that allows an electric component to be pushed down adequately in accordance with the kind of the contact pins or the terminal of the electrical component. An IC socket for electrical component comprising: a socket body accommodating an IC package a cover member for pressing the accommodated IC package and a lever member for pressing the cover member A long hole is provided on the socket body to movably support the cover member a third shaft supported by the long hole is provided on the cover member and the cover member is configured to be closed so that the cover member is pushed down along the long hole 1. A socket for electrical component comprising: a socket body accommodating an electrical component; a cover member for pressing the accommodated electrical component; and a lever member for pressing the cover member ,wherein a long hole is provided on the socket body to movably support the cover member,a locking element supported by the long hole is provided on the cover member, andthe cover member is configured to be closed so that the cover member is pushed down along the long hole.2. The socket for electrical component according to claim 1 , wherein a cover proximal end of the cover member includes the locking element which is rotatably supported by the long hole claim 1 , and a cover distal end of the cover member in a closed state is in contact with a distal end support portion of the socket body in a direction of opening and the cover distal end is displaceably supported by the distal end support portion of the socket body.3. The socket for electrical component according to claim 1 , wherein the cover proximal end is coupled through the lever member and a link member.4. The socket for electrical component according to claim 1 , wherein the long hole is formed in a straight line along a contact direction set on the contact pin of the socket body.5. The socket for electrical component according to claim 1 , wherein ...

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Номер записи: 39
28-02-2019 дата публикации

Socket

Номер: US20190064214A1
Автор: Hideki Sano, Hideyuki Takahashi
Принадлежит: Sensata Technologies Inc

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.

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Номер записи: 40
11-03-2021 дата публикации

Contact Probe and Inspecting Socket Including the Same

Номер: US20210072284A1
Автор: SUZUKI Katsumi, Yamamoto Seiya
Принадлежит:

The contact probe comprises a barrel , an inspection device side terminal , a test board side terminal , and a spring disposed in a state of being in contact with the test board side terminal and the inspection device side terminal , the test board side terminal includes a stop portion that can abut on the caulked portion in the barrel and a terminal body that projects from the other end of the barrel , and the terminal body includes, in order from a tip end, a first shaft section , a second shaft section having a diameter larger than a diameter of the first shaft section , and a third shaft section having a diameter smaller than the diameter of the second shaft section and having at least a part that can be housed in the barrel 1. A contact probe that electrically connects a test board to an inspection device , the contact probe comprising:a barrel formed in a cylindrical shape having opposite ends opened, extending in an axial direction and including a caulked portion formed to reduce an inner diameter;an inspection device side terminal having a base end side fixed to a side of one end of the barrel and having a tip end in contact with the inspection device;a test board side terminal housed, on a side of the other end of the barrel, to be movable forward and backward and having a tip end in contact with the test board; anda spring disposed in the barrel in a state of being in contact with the test board side terminal and the inspection device side terminal, wherein the test board side terminal includes a stop portion that is to abut on the caulked portion in a direction from the one end side of the barrel toward the other end side in the barrel, and a terminal body that projects from the other end of the barrel, andthe terminal body includes, in order from the tip end, a first shaft section that is arranged to come in contact with the test board, a second shaft section having a diameter larger than a diameter of the first shaft section, and a third shaft section ...

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Номер записи: 41
07-03-2019 дата публикации

FORCE DEFLECTION AND RESISTANCE TESTING SYSTEM AND METHOD OF USE

Номер: US20190072585A1
Автор: Adams Lynwood, LEWIS Jack
Принадлежит:

A testing system for electrical interconnects having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. An actuator is also presented that presses the device under test into the electrical interconnect at increments where tests are performed on one, some or all of the contact points of the electrical interconnect. This information is then analyzed and graphed to assist with determine the optimum force and/or height to use during actual use. 1. A method of testing an electrical interconnect , the steps comprising:providing an electrical interconnect testing device;providing an electrical interconnect having a plurality of contact points;attaching the electrical interconnect to the electrical interconnect testing device;providing a device under test having a plurality of contact points;placing the device under test in the electrical interconnect after the electrical interconnect has been attached to the printed circuit board such that the plurality of contact points of the device under test connect with the plurality of contact points of the electrical interconnect;providing a actuator configured to press on the device under test in the electrical interconnect;moving the actuator in a plurality of increments thereby pressing the device under test into the electrical interconnect;taking at least one resistance measurement at the plurality of increments.2. The method of further comprising the step of taking a force measurement at the plurality of increments.3. The method of wherein the resistance measurement is taken on one of the plurality of contact points of the electrical interconnect.4 ...

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Номер записи: 42
16-03-2017 дата публикации

PROBE PIN AND ELECTRONIC DEVICE USING SAME

Номер: US20170074903A1
Автор: Sakai Takahiro, Teranishi Hirotada
Принадлежит: Omron Corporation

In a probe pin including a coil spring, and first and second plungers, when the first and second plungers are respectively inserted from both ends of the coil spring toward an inside thereof, the first and second plungers are disposed in a reciprocable manner along an axis center of the coil spring while slide contact surfaces thereof are in slide contact with each other, and the first and second plungers are formed so that the coil spring can be held between a body portion of the first plunger and a body portion of the second plunger. The first and second plungers are formed so that the first and second plungers are close to each other and a contact area where the slide contact surface of the first plunger is in contact with the slide contact surface of the second plunger is tilted with respect to the axis center. 1. A probe pin comprising:a coil spring; andfirst and second plungers each provided with a body portion and a sliding piece that extends from the body portion and has a slide contact surface,the first and second plungers being respectively inserted from both ends of the coil spring toward an inside of the coil spring, and the slide contact surfaces being disposed in a reciprocable manner along an axis center of the coil spring while being in slide contact with each other, and the coil spring being held between the body portion of the first plunger and the body portion of the second plunger,the first and second plungers being close to each other, and a contact area where the slide contact surface of the first plunger is in contact with the slide contact surface of the second plunger being tilted with respect to the axis center,when the coil spring is compressed by external force to apply loads of pressing forces in directions of the axis center to the first and second plungers, resultant forces of component forces of the pressing forces in the directions of the axis center, the component forces being generated between the slide contact surfaces by spring ...

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Номер записи: 43
14-03-2019 дата публикации

Test socket of flexible semiconductor chip package and bending test method using the same

Номер: US20190079114A1
Автор: Dong Keun Lee, Jae Sik Choi, Jin Won JEONG, Young Sug SEONG
Принадлежит: MagnaChip Semiconductor Ltd

A test socket of a flexible semiconductor chip package includes a first bending jig having a convex contour, a second bending jig having a concave contour, and a semiconductor chip package. The second bending jig is disposed to matingly engage the first bending jig. The semiconductor chip package is disposed between the first bending jig and the second bending jig, and includes a flexible tape and a semiconductor chip. The semiconductor chip is disposed on a surface of the flexible tape. Each of the first and second bending jigs has a horizontal length longer than a length of the semiconductor chip and less than a length of the flexible tape.

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Номер записи: 44
31-03-2022 дата публикации

TEST SOCKET AND TEST APPARATUS HAVING THE SAME

Номер: US20220099730A1
Автор: Oh Chang Su
Принадлежит:

The present disclosure discloses a test socket according to the present disclosure including an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; and an electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer. 1. A test socket comprising;an inelastic electro-conductive housing formed of an inelastic electro-conductive material and provided with a plurality of housing holes passing therethrough in the thickness direction, each housing hole being formed at a position corresponding to each terminal of a device under test; andan electro-conductive part formed to have a configuration in which a plurality of electro-conductive particles are oriented in the thickness direction in an elastic insulating material, and comprising an electro-conductive part for grounding, an electro-conductive part for signal, and an electro-conductive part for power disposed in the housing holes, respectively, the electro-conductive part for signal and the electro-conductive part for power being insulated by an insulating layer,wherein a ground-connecting end part is provided in the housing hole in which the electro-conductive part for grounding is disposed, provided between an upper and lower end portions of the housing hole, and formed by protruding the inelastic electro-conductive housing from an inner wall forming the housing hole.2. The ...

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Номер записи: 45
02-04-2015 дата публикации

PERFORMANCE ENHANCED SEMICONDUCTOR SOCKET

Номер: US20150091600A1
Автор: Rathburn James
Принадлежит:

A test socket for IC devices includes a multi-layered socket housing with at least one center layer and first and second surface layers. The first and second surface layers have a thickness and dielectric constant less than that of the center layers. A plurality of contact members are located in center openings in the center layer with distal ends extending into openings in the first and second layers. The distal ends of the contact members having at least one dimension greater than the openings in the first and second surface layers to retain the contact members in the socket housing. The contact members include center portions with major diameters less than the diameters of the center openings, such that an air gap is maintained between the contact members and the center layer. 1. A test socket of IC devices comprising: at least one center layer comprising first and second major surfaces, a center layer thickness, a plurality of center layer openings having center layer opening diameters, and a center layer dielectric constant;', 'a first surface layer located on the first major surface of the center layer, the first surface layer comprising a first surface layer thickness less than the center layer thickness, a plurality of first surface layer openings aligned with the center layer openings, the first surface layer openings having first surface layer opening diameters less than the center layer opening diameters, the first surface layer comprising a first surface layer dielectric constant less than the center layer dielectric constant;', 'a second surface layer located on the second major surface of the center layer, the second surface layer comprising a second surface layer thickness less than the center layer thickness, a plurality of second surface layer openings aligned with the center layer openings, the second surface layer openings having second surface layer opening diameters less than the center layer opening diameters, the second surface layer ...

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Номер записи: 46
19-06-2014 дата публикации

SEMICONDUCTOR DEVICE TESTING APPARATUS

Номер: US20140167806A1
Автор: JU Chul Won, KANG Dong Min, Kim Seong-il, LEE Sang-Heung, LIM Jong-Won, MUN Jae Kyoung, Nam Eun Soo, Yoon Hyung Sup
Принадлежит: Electronics and Telecommunications Research Institute

Provided is a semiconductor device testing apparatus including a first socket configured to load a package, on which a semiconductor device to be tested may be mounted, and a second socket coupled to the first socket. The first socket may include an upper part including a hole configured to accommodate the package and a terminal pad provided at both side edges of the hole to hold input and output terminals of the package, and a lower part including a heating room, in which a heater and a temperature sensing part may be provided, the heater being configured to heat the semiconductor device and the temperature sensing part being configured to measure temperature of the semiconductor device. The second socket may include a probe card with a pattern that may be configured to receive test signals from an external power source. 1. A semiconductor device testing apparatus , comprising:a first socket configured to load a package, on which a semiconductor device to be tested is mounted; anda second socket coupled to the first socket,wherein the first socket comprises:an upper part including a hole configured to accommodate the package and a terminal pad provided at both side edges of the hole to hold input and output terminals of the package; anda lower part including a heating room, in which a heater and a temperature sensing part are provided, the heater being configured to heat the semiconductor device and the temperature sensing part being configured to measure temperature of the semiconductor device,wherein the second socket comprises a probe card with a pattern that is configured to receive test signals from an external power source.2. The semiconductor device testing apparatus of claim 1 , wherein the terminal pad is formed of an insulating material exhibiting a heat-resistance property under temperature of about 200-250° C.3. The semiconductor device testing apparatus of claim 1 , wherein the temperature sensing part comprises a thermocouple.4. The semiconductor ...

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Номер записи: 47
05-05-2022 дата публикации

Contact pin and socket

Номер: US20220137093A1
Автор: Yuki Ueyama
Принадлежит: Enplas Corp

A contact pin includes: a first plunger including a first contact portion provided at an upper end, and a hollow body portion provided below the first contact portion; a second plunger including: a second contact portion provided at a lower end; a first taper portion that is provided above the second contact portion and enlarges in diameter toward the second contact portion; a small diameter portion provided above the first taper portion; and a large diameter portion that is provided above the small diameter portion and is inserted into the body portion to abut on an inner wall surface of the body portion; and a spring for energizing the first and second contact portions to be separated from each other. The first taper portion is capable of abutting on a lower end of the body portion in a case where the first and second contact portions approach each other.

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Номер записи: 48
19-03-2020 дата публикации

IMPEDANCE CONTROLLED TEST SOCKET

Номер: US20200088763A1
Автор: Deford Kevin, Liu Dexian, Shi Bo, Spooner Jim, Zhou Jiachun
Принадлежит:

Methods, systems, and apparatus for electrical connector assemblies. The assemblies include a socket defining a signal cavity, the socket having a first socket opening and a second socket opening. The assemblies include a signal contact probe located within the signal cavity. The signal contact probe includes a first plunger received in the shell cavity and extending through a first shell opening and located in the first socket opening. The signal contact probe includes a second plunger received in the shell cavity and extending through a second shell opening and located in the second socket opening. The assemblies include an end insulation ring located in the second socket opening and around the second plunger, the end insulation ring configured to facilitate substantially constant impedance through the signal spring probe, and configured to restrict lateral movement of the second plunger within the second socket opening. 1. An electrical contactor assembly comprising:a socket defining a signal cavity, the socket having a first socket opening at a first socket end and a second socket opening at a second socket end opposite the first socket end; a shell having a body defining a shell cavity, the shell having a first shell opening at a first end of the shell and a second shell opening at a second end of the shell opposite the first end of the shell,', 'a first plunger received in the shell cavity and extending through the first shell opening and located in the first socket opening, and', 'a second plunger received in the shell cavity and extending through the second shell opening and located in the second socket opening; and, 'a signal contact probe located within the signal cavity, the signal contact probe comprisingan end insulation ring located in the second socket opening and around the second plunger, the end insulation ring configured to facilitate a substantially constant impedance through the signal contact probe, and configured to restrict lateral movement ...

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Номер записи: 49
05-04-2018 дата публикации

TEST SOCKET ASSEMBLY AND RELATED METHODS

Номер: US20180096917A1
Автор: Mroczkowski Jason, Nelson Mitchell, Treibergs Valts
Принадлежит: XCERRA CORPORATION

A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough. 1. A test socket assembly comprising:a housing;a leadframe assembly having impedance controlled microwave structures and a flexible signal and ground plane, the leadframe assembly disposed within the housing; anda spacer adjacent the leadframe assembly and supporting the leadframe assembly.2. The test socket assembly as recited in claim 1 , wherein the spacer is resilient to the ground and microwave structures.3. The test socket assembly as recited in claim 1 , further comprising an outer metal housing having one or more mounting connectors claim 1 , where the lead frame assembly is disposed within the outer metal housing.4. The test socket assembly as recited in claim 1 , further comprising an outer a plastic housing claim 1 , the lead frame assembly is disposed within the plastic housing and having surface-mount connectors are positioned directly on the leadframe assembly.5. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines claim 1 , and the signal lines are in a coplanar waveguide transmission line structure.6. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase to a prescribed amount at a prescribed frequency.7. The test socket assembly as recited in claim 1 , wherein the leadframe assembly has signal lines with split signals claim 1 , and the split signals shift phase of 180 degrees.8. The test socket assembly as recited in claim 6 , wherein a resultant output of the split ...

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Номер записи: 50
28-03-2019 дата публикации

High Isolation Contactor with Test Pin and Housing For Integrated Circuit Testing

Номер: US20190097333A1
Автор: Andres Michael, Sherry Jeffrey
Принадлежит:

A test socket () for a testing an integrated circuit () with controlled impedance while maintaining the structural integrity of the test pins (). The pin () can have a sidewall with a thick portion and a thinner portion () along the length of the pin. The pin can have projections () which provide a standoff from the slot (). The sidewalls themselves can have projections or lands () which extend into the slot and provide stability for the pin (). 11224. An apparatus for electrically connecting a lead of an integrated circuit () device to be tested to a corresponding terminal of a load board () at a test site , comprising:{'b': 14', '12, 'a. a housing () having upper and lower surfaces, a first surface approachable by an integrated circuit device under test () to be tested and a second surface proximate the load board;'}b. a slot extending through said housing from the first surface to the second surface, said slot including parallel spaced apart opposing first and second inner walls thereby defining a space between said sidewall;{'b': 20', '40, 'c. a contact pin () having first and second sidewalls and being slideably receivable in said slot (), said pin having a first end engagable by the lead and a second end in engagement with the terminal, said pin filling only a portion of said slot thereby leaving a gap between said pin sidewalls and said slot inner walls;'}{'b': 61', '60', '47', '42', '43', '34, 'd. a first projection (, , , , , ) filling a portion of said gap adjacent said first inner wall and a second projection filling a portion of said gap adjacent said second inner wall; said projections providing longitudinal stability for said pin as it is engaged by the device under test and allowing air to provide a dielectric around said projections in said gap.'}2. The apparatus of wherein said projections extend from said pin toward said inner wall.3. The apparatus of wherein housing includes tubular elastomeric resilient element and wherein said pin includes an ...

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Номер записи: 51
08-04-2021 дата публикации

CONTACTOR WITH ANGLED DEPRESSIBLE PROBES IN SHIFTED BORES

Номер: US20210102972A1
Автор: Barabi Nasser, Ho Chee Wah, Kryachek Oksana, Tienzo Joven R.
Принадлежит:

A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis. 1. A slanted probe contactor for providing electrical contact between an array of contacts of an IC device under test (DUT) and a test board , the contactor comprising:a body portion having substantially parallel top and bottom faces defining a contactor interface wall which lies in an x-y plane and which has a perpendicular z-axis, the top face of said contactor interface wall being configured to receive a DUT which is placed contacts down on the top face, wherein the body portion includes a main block having a plurality of main slanted probe cavities, each main slanted probe cavity having a main bore axis being angled relative to the z-axis of the interface wall, and wherein the body portion also includes an upper block having a corresponding plurality of upper slanted probe cavities;a plurality of depressible probes extending through said contactor interface wall, the depressible probes having probe tips and being angled relative to the z-axis of the interface wall such that the probe tips emerge from the top and bottom faces thereof, and wherein the depressible probes are arranged in different arrays of depressible probes, the depressible probes of one array of depressible probes ...

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Номер записи: 52
08-04-2021 дата публикации

SPRING CONTACT AND TEST SOCKET WITH SAME

Номер: US20210102973A1
Автор: Hwang Dong Weon, Hwang Jae Baek, Hwang Logan Jae
Принадлежит:

The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts () each of which includes an upper contact pin () and a lower contact pin () that are assembled cross each other, and a spring () supporting the upper and lower contact pins ( and ); a main plate () having a plurality of accommodating holes () in which the respective spring contacts () are accommodated, with first openings (); and a film plate () provided on a lower portion of the main plate (), and having second openings (). 1. A test socket with spring contacts , the test socket comprising:a plurality of spring contacts each of which includes an upper contact pin, and a lower contact pin assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a spring elastically supporting the upper contact pin and the lower contact pin;{'b': 2', '1, 'a main plate having a plurality of accommodating holes in which the respective spring contacts are accommodated, with first openings each having a diameter (d) smaller than a diameter (d) of each of the accommodating holes formed to support each of the respective upper contact pins by a stepped portion protruding horizontally from an upper opening end of each of the accommodating holes; and'}{'b': 3', '1, 'a film plate provided on a lower portion of the main plate, and having second openings each formed at a position corresponding to each of the accommodating holes to have a diameter (d) smaller than the diameter (d) of the accommodating hole to support each of the respective lower contact pins.'}2. A test socket with spring contacts , the test socket comprising:a plurality of ...

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Номер записи: 53
26-04-2018 дата публикации

Electric component socket and manufacturing method for the same

Номер: US20180115101A1
Автор: Takahiro Oda
Принадлежит: Enplas Corp

An electric component socket in which a first electric component is housed in a first plate, a second plate is disposed to face the second electric component, a third plate is disposed at a middle position between the first and the second plates, and a plurality of electric contacts are used to electrically connect the first and second electric components, the electric contact includes: a spring part that is inserted into an insertion hole in the third plate; first and second contact parts extending from both terminals of the spring part, and inserted into insertion holes in the first and second plates to be in contact with electrodes of the first and second electric components.

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Номер записи: 54
07-05-2015 дата публикации

Semiconductor transporting and testing fixture

Номер: US20150123686A1
Автор: Fumiaki Nanami, Shinichi Nakamura
Принадлежит: UNITECHNI Inc, Unitechno Inc

The semiconductor transporting and testing fixture according to the present invention comprises: a frame portion ( 21 ) adapted to receive therein an IC ( 5 ) having an external connection terminal, the frame portion having an inner peripheral wall; a bottom surface sheet ( 25 ) pasted on a bottom surface of the frame portion, the bottom surface sheet having an IC side pad ( 26 ) formed on a front surface thereof and a socket side pad ( 27 ) formed on a rear surface thereof, the IC side pad being adapted to contact the external connection terminal, the socket side pad electrically connected with the corresponding IC side pad and being adapted to contact a testing socket, wherein the frame portion ( 21 ) is provided with a retaining latch ( 23 ) protruding therefrom toward above the IC ( 5 ) when the IC ( 5 ) is received in the inner peripheral wall ( 22 ) of the frame portion ( 21 ).

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Номер записи: 55
13-05-2021 дата публикации

CONTACT AND TEST SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE

Номер: US20210140997A1
Автор: Hwang Dong Weon, Hwang Jae Baek, HWANG Jae Suk
Принадлежит:

The present invention relates to a contact and a socket device for testing a semiconductor device. The contact of the present invention is a spring contact which is integrally formed by blanking and bending a metal plate member and includes an elastic portion made of various strips of certain pattern and a tip provided at both ends of the elastic portion. Preferably, an inner volume of the contact is filled with a filler having conductivity and elasticity, whereby durability and electrical characteristics are excellent. Further, the test socket according to the present invention is a rubber type employing the above-mentioned contact and has an advantage that it is suitable for testing a fine pitch device. 115-. (canceled)16. A contact , integrally formed by blanking a metal plate member and rolling the metal plate member into a cylindrical shape , the contact comprising:a first elastic portion formed by connecting a plurality of closed-loop strips of an identical size in series by using a first portion and by bending the closed-loop strips into a cylindrical shape;a second elastic portion formed by connecting a plurality of closed-loop strips of the size identical to the size of the closed-loop strips of the first elastic portion in series by using a second portion and by bending closed-loop strips into a cylindrical shape;a bent portion having a width and a length larger than widths and lengths of the first portion and the second portion and connecting the closed-loop strips in a lowermost end and an uppermost end of the first elastic portion and the second elastic portion in series;an upper head portion having an upper indented portion protruding upwards and extending from the uppermost end of the first elastic portion, and being bent into a cylindrical shape; anda lower head portion having a lower indented portion protruding downwards and extending from the lowermost end of the second elastic portion, and being bent into a cylindrical shape.17. The contact of ...

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Номер записи: 56
13-05-2021 дата публикации

Electrical connection device

Номер: US20210140999A1
Автор: Kenichi Tsuruta, Koichiro Tokumaru, Miyuki TOMOOKA, Takayuki Hayashizaki
Принадлежит: Micronics Japan Co Ltd

An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.

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Номер записи: 57
27-04-2017 дата публикации

MANUFACTURING METHOD OF TEST SOCKET AND TEST METHOD FOR SEMICONDUCTOR PACKAGE

Номер: US20170118846A1
Автор: Min Young-gi, SHIN Doug-uhn, SONG Jae-Ho, Yamada Daisuke
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other. 1. A method of manufacturing a test socket , the method comprising:preparing a test socket, the test socket including a base material and a first conductive portion in the base material, the first conductive portion extending in a thickness direction of the base material; andforming a second conductive portion by printing conductive ink on the first conductive portion.2. The method of claim 1 , wherein claim 1 ,the first conductive portion includes a top surface,the top surface of the first conductive portion includes a surface depression, andthe method further includes forming the second conductive portion based on filling the surface depression with the conductive ink.3. The method of claim 2 , further comprising:cleaning the top surface of the first conductive portion prior to forming the second conductive portion on the first conductive portion.4. The method of claim 1 , wherein the second conductive portion includes a top surface claim 1 , and the top surface of the second conductive portion includes a concave portion.5. The method of claim 1 , wherein the second conductive ...

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Номер записи: 58
05-05-2016 дата публикации

Adaptor structure and apparatus for testing a semiconductor package including the same

Номер: US20160124042A1
Автор: Bo-Seong Park, Hyun-Guen Iy
Принадлежит: SAMSUNG ELECTRONICS CO LTD

An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

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Номер записи: 59
03-05-2018 дата публикации

QUICK CHANGE SMALL FOOTPRINT TESTING SYSTEM AND METHOD OF USE

Номер: US20180120352A1
Автор: Adams Lynwood, LEWIS Jack
Принадлежит:

A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms. 1. A testing system , comprising:a frame member;the frame member extending a length from a first side to a second side;the frame member extending a depth from first end to a second end;a plurality of locking posts operably connected to the frame member;wherein the plurality of locking posts are configured to rotate between a disengaged position and an engaged position;a printed circuit board (PCB);the PCB having an upper surface and a lower surface;a plurality of electrical contacts positioned in the lower surface of the PCB;a top plate;the top plate having a plurality of cam members;wherein the plurality of cam members are configured to receive the plurality of locking posts;the cam members having a cam surface;a plurality of electrical testing boards operably connected to the frame member;wherein when the PCB is placed on top of the frame member and the top plate is placed on top of the PCB, and the locking posts are rotated from a disengaged position to an engaged position, operative electrical contact is made between the PCB and the plurality of electrical testing boards.2. The system of claim 1 , wherein the frame is approximately square or rectangular in shape when viewed from above ...

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Номер записи: 60
14-05-2015 дата публикации

INTEGRATED CIRCUIT (IC) TEST SOCKET WITH FARADAY CAGE

Номер: US20150130487A1
Автор: Landa Victor
Принадлежит: Titan Semiconductor Tool, LLC

An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing. The test socket base is grounded, and a ground current runs through the base and into conductive strips. The configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference. The compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip. 1. A test socket for a microchip , comprising:a base including a plurality of aligning through holes for securing the base to a handler,a well centrally disposed within the base including a plurality of electrical contacts, the well sized to receive a microchip;a recess on an upper surface of the base enclosing the well; anda conductive shield disposed in the recess, the conductive recess adapted to draw electrical charge away from the microchip.2. The test socket of claim 1 , wherein the shield is octagonal shaped.3. The test socket of claim 1 , wherein the shied is comprised of four discrete plates.4. The test socket of claim 1 , wherein the shield is made of a metal mesh.5. The test socket of claim 1 , wherein the shield is adapted to be seated between the base and a lid of a handler.6. The test socket of claim 1 , wherien the shield provides a spacer between the base and the lid of a handler.7. The test socket of claim 1 , wherein the base and the shield form a Faraday cage about the microchip when the base is seated on a grounded circuit board.8. The test socket of claim 1 , wherein the shield surrounds the well on the base.9. The test socket of claim 1 , wherein the shield sits partially in the recess and partially above the recess. The present invention relates to sockets that electrically connects an integrated circuit with an IC ...

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Номер записи: 61
14-05-2015 дата публикации

Assembly For Testing Semiconductor Devices

Номер: US20150130495A1
Автор: Artur Darbinyan, Dale Lee Anderson
Принадлежит: Texas Instruments Inc

A testing assembly for testing a plurality of semiconductor devices comprising a carrier assembly adapted to hold the plurality of semiconductor devices at predetermined locations therein that is operably connectable with a plurality of different socket assemblies. A universal socket assembly is also described.

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Номер записи: 62
14-05-2015 дата публикации

Electrical Test Socket

Номер: US20150130497A1
Автор: KIM Gi Min
Принадлежит:

Provided is an electrical test socket that is arranged between a terminal of a test target device and a pad of test equipment in order to electrically connect the terminal and the pad, the electrical test socket including: a socket body including a central hole at a center thereof in order to house the test target device inside; a pin connection member comprising a plurality of conductive pins that are arranged on locations corresponding to the terminal of the test target device housed in the central hole of the socket body, and whose upper end contacts the terminal of the test target device, and a housing having penetration holes into which the conductive pins are inserted to support the conductive pins; and a sheet-type connection member in which a plurality of conductive parts are arranged on locations corresponding to the conductive pins, wherein the plurality of conductive parts are arranged on a bottom portion of the pin connection member, exhibit conductivity only in a thickness direction, and are elastically deformed in the thickness direction, wherein the conductive pins have a rectangular pillar shape. 1. An electrical test socket that is arranged between a terminal of a test target device and a pad of test equipment in order to electrically connect the terminal and the pad , the electrical test socket comprising:a socket body comprising a central hole at a center thereof in order to house the test target device inside;a pin connection member comprising a plurality of conductive pins that are arranged on locations corresponding to the terminal of the test target device housed in the central hole of the socket body, and whose upper end contacts the terminal of the test target device, and a housing having penetration holes into which the conductive pins are inserted to support the conductive pins; anda sheet-type connection member in which a plurality of conductive parts are arranged on locations corresponding to the conductive pins, wherein the plurality of ...

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Номер записи: 63
04-05-2017 дата публикации

TEST SOCKET

Номер: US20170122977A1
Автор: Park Sang-Duck
Принадлежит:

Disclosed is a test socket for inspecting an electronic device that is particular about properties. 1. A test socket for inspecting electric properties of a subject , the test socket comprising:a plurality of probes configured to be retractable in an inspection direction;a probe supporter configured to support the plurality of probes so that first ends of the plurality of probes protrudes to contact with an object contact point of a subject; anda printed circuit board (PCB) configured to be placed beneath the probe supporter, be mounted with electronic parts, comprise at least one first pad with which at least one second end of the plurality of probes comes into contact and at least one second pad formed on an opposite side to the first pad, and be formed with electric paths extended from the first pad and the second pad and connected to the mounted electronic parts.2. The test socket according to claim 1 , further comprising:a lower supporter configured to be placed beneath the printed circuit board (PCB) and comprise at least one first conductive portion making contact with the at least one second pad.3. The test socket according to claim 2 , wherein the printed circuit board (PCB) is formed with at least one first hole through which a second end of the rest of the probe excepting the at least one probe contacted with the first pad passes; andthe lower supporter comprises at least one second hole through which the second end of the probe passed through the first hole passes.4. The test socket according to claim 2 , wherein the printed circuit board (PCB) is formed with at least one first hole through which a second end of the rest of the probe excepting the at least one probe contacted with the first pad passes; andthe lower supporter comprises at least one second conductive portion with which the second end of the probe passed through the first hole contacts.5. The test socket according to claim 1 , wherein the printed circuit board (PCB) comprises at least one ...

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Номер записи: 64
25-04-2019 дата публикации

Method for Testing Semiconductor Devices

Номер: US20190120874A1
Автор: Anderson Dale Lee, DARBINYAN Artur
Принадлежит:

A method of testing semiconductor devices includes placing a plurality of semiconductor devices in a carrier assembly and performing at least one testing operation on the plurality of semiconductor devices while they remain inside the carder assembly, 118-. (canceled)19. A method of testing semiconductor devices comprising:placing a plurality of loose semiconductor devices in a carder assembly;preconditioning the semiconductor devices in the carrier assembly;performing at least one pre-stress electrical test on the semiconductor devices in the carrier assembly;performing at least one bias-stress test on the semiconductor devices in the carrier assembly;performing at least one post-stress electrical test on the semiconductor devices in the carder assembly.20. The method of further comprising unloading the semiconductor devices in the carrier assembly.21. The method of further comprising performing failure analysis on at least one semiconductor device unloaded from the carrier assembly.2223-. (canceled)24. The method of wherein the placing the semiconductor devices in the carder assembly comprises placing the semiconductor devices at predetermined locations in the carrier assembly.25. The method of wherein the predetermined locations each includes structures adapted to perform the at least one testing operation.26. The method of further comprising cleaning and drying the semiconductor devices while the devices remain inside the carrier assembly.29. The method of further comprising baking and cleaning the semiconductor devices while the devices remain inside the carrier assembly.27. The method of wherein the at least one testing operation includes a B HAST test.28. A method of testing semiconductor devices comprising:placing a plurality of loose semiconductor devices in a carrier assembly;performing at least one pre-stress electrical test on the semiconductor devices in the carrier assembly;performing at least one bias-stress test on the semiconductor devices in the ...

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Номер записи: 65
27-05-2021 дата публикации

CONTACT PROBE AND PROBE UNIT

Номер: US20210156887A1
Автор: Hironaka Kohei, Soma Kazuya
Принадлежит:

A contact probe includes: a cylindrical pipe member; a collar including a hollow portion and fixed to an inner circumferential side of at least one end in a longitudinal direction of the pipe member; and an inner conductor including a flange configured to abut on a stepped portion formed by the pipe member and the collar, the inner conductor being expandable and contractible along the longitudinal direction and penetrating the pipe member. 1. A contact probe comprising:a cylindrical pipe member;a collar including a hollow portion and fixed to an inner circumferential side of at least one end in a longitudinal direction of the pipe member; andan inner conductor including a flange configured to abut on a stepped portion formed by the pipe member and the collar, the inner conductor being expandable and contractible along the longitudinal direction and penetrating the pipe member.2. The contact probe according to claim 1 , wherein the pipe member includes an insulating pipe made of an insulating material.3. The contact probe according to claim 2 , wherein the pipe member further includes conductive coating layers provided on an inner circumference and an outer circumference of the insulating pipe.4. The contact probe according to claim 1 , wherein the pipe member is made of a conductive material.5. The contact probe according to claim 1 , wherein the pipe member includes:an outer circumferential pipe and an inner circumferential pipe forming a double-pipe structure; andinsulating members provided between the outer circumferential pipe and the inner circumferential pipe at both ends in an axial direction of the pipe member, andan air layer is formed by the outer circumferential pipe, the inner circumferential pipe, and the insulating members.6. The contact probe according to claim 1 , wherein the collar is made of a conductive material.7. The contact probe according to claim 1 , wherein the collar is provided at each of both ends of the pipe member.8. A probe unit ...

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Номер записи: 66
27-05-2021 дата публикации

Semiconductor test socket with a floating plate and latch for holding the semiconductor device

Номер: US20210156906A1
Автор: Hideharu Furukawa
Принадлежит: Sensata Technologies Inc

A test socket assembly for a semiconductor device used for burn-in testing comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for the retention and movement of the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upstanding flex arms. In addition, the floating plate and the latch assembly move to a test position for accommodating a varying height of the semiconductor device when mating with a test fixture while the latch still effectively retains the semiconductor device. Lastly, the floating plate is held in a fixed load position due to the support provided by the upstanding flex arms when inserting the semiconductor device into the test socket.

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Номер записи: 67
12-05-2016 дата публикации

Storage Device Calibration Methods and Controlling Device Using the Same

Номер: US20160132379A1
Автор: Chun-Liang Chen
Принадлежит: MediaTek Inc

A calibration method includes transmitting first data comprising a calibration data and a first checksum to the storage device according to each of a plurality of training parameter sets; recording a plurality of error indicators respectively which are corresponding to the plurality of training parameter sets and from the storage device; and identifying one of the plurality of training parameter sets as a predetermined parameter set according to the plurality of error indicators respectively corresponding to the plurality of training parameter sets; wherein each error indicator indicates whether transmitting the first data according to the corresponded training parameter set is successful.

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Номер записи: 68
30-04-2020 дата публикации

DEVICE AND METHOD FOR TESTING SEMICONDUCTOR DEVICE AND TEST HANDLER

Номер: US20200132753A1
Автор: LIM TAE YOUN
Принадлежит:

A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors. 1. A device for testing a semiconductor device , comprising:a blade comprising one or more outer blade conductors disposed on one or more side surfaces of the blade;a socket comprising one or more outer socket conductors disposed on one or more side surfaces of the socket,wherein the one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade; anda test board that transfers a test signal to the one or more outer socket conductors.2. The device of claim 1 , further comprising:a test signal providing circuit that provides a test signal to the test board while the blade is moved from a first position to a second position; anda test signal detecting circuit that detects whether the test signal provided from the test signal providing circuit reaches the one or more outer blade conductors.3. The device of claim 2 ,wherein the blade has a cross-sectional surface having a rectangular shape taken in a direction perpendicular to a direction in which the blade is moved from the first position to the second position,wherein the one or more outer blade conductors are formed on at least two or more edges among four edges forming the rectangular shape or on two or more corners among four corners forming the rectangular shape.4. The device of claim 1 ,wherein each of the ...

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Номер записи: 69
09-05-2019 дата публикации

CONTACT PIN AND TEST BASE HAVING CONTACT PINS

Номер: US20190137545A1
Автор: Huber Ludwig, REISCHL Stefan
Принадлежит:

A contact pin () for electrically connecting a first electrical contact area (), which is arranged on a device under test () to be surveyed, and a second electrical contact area (), which is arranged in a test base (′), has an elongate central region () which is mechanically connected to the test base (′), has a first spring arm (), the first end () of which is connected to a first end () of the central region () and the second end () of which has a first contact region () for electrical contact-connection to the first electrical contact area (), and has a second spring arm (), the first end () of which is connected to a first or second end () of the central region () and the second end () of which has a second contact region () for electrical contact-connection to the second electrical contact area (). The first and the second spring arm () are each oriented, in the region of their first end (), at an angle (ϕ) in relation to a longitudinal axis () of the central region (), which angle is smaller than or equal to 90°. 119.-. (canceled)20. A contact , comprising:an interconnect portion comprising a first end region and a second end region;a first spring arm connected to said first end region on a first side of said interconnect portion and comprising a first contact surface;a second spring arm connected to said second end region on a second side of said interconnect portion and comprising a second contact surface; anda third arm connected to said first side of said interconnect portion, whereinin a first state of said contact, said third arm does not constitute part of a first signal path from said first contact surface to said second contact surface, andin a second state of said contact, said third arm constitutes part of a second signal path from said first contact surface to said second contact surface that is shorter than said first signal path.21. The contact of claim 20 , wherein:said third arm is connected to said second end region of said interconnect ...

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Номер записи: 70
14-08-2014 дата публикации

TEST SYSTEMS WITH A PROBE APPARATUS AND INDEX MECHANISM

Номер: US20140225636A1
Автор: Dunklee John L., Funk William A., Root Bryan J.
Принадлежит: CELADON SYSTEMS, INC.

A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder. 1. A system for testing a semiconductor device comprising:a circuit board having a pattern of signal contacts and a pattern of guard contacts, the circuit board is configured as a plate having a top side, a bottom side, and an opening through the top and bottom sides;a probe card including a wire guide, a probe tile connected with the wire guide, a plurality of probe wires supported by the wire guide and probe tile, the probe wires are positioned through the wire guide and the probe tile, the probe wires include a probe tip extending through the probe tile, the probe tips forming an array to probe a device under test, each probe wire includes a signal transmitting portion and a guard portion exposed from the wire guide, the signal transmitting portions and the guard portions form a contact pattern and, with the array, are disposed on one side of the probe card, and a retainer member is disposed on another side of the probe card;a holder having multiple probe card stations, the probe card stations have a connector structure to connect to and disconnect from the retainer member of the probe card, and to allow the probe card to both contact the circuit board and a device under test; anda carriage ...

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Номер записи: 71
10-06-2021 дата публикации

Test methods, tester, load board and test system

Номер: US20210173008A1
Автор: Chia-Chi Hsu
Принадлежит: Changxin Memory Technologies Inc

The present invention provides a test method, a tester, a load board and a test system. The test method includes: outputting, through a first input/output (I/O) port of a tester, a first test signal to a first channel of a load board, wherein the first test signal is used to generate a second test signal and a third test signal; receiving, through the first I/O port, a third feedback signal returned from the first channel, wherein the third feedback signal is generated based on a first feedback signal and a second feedback signal; and determining whether a first chip and a second chip are operating normally based on the third feedback signal. Solutions provided in the present invention are capable of increasing the number of chips that can be tested at a single time.

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Номер записи: 72
09-05-2019 дата публикации

Electrical characteristics inspection method

Номер: US20190139468A1
Автор: Linhong LV
Принадлежит: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd

An electrical characteristics inspection method is provided. A pixel compensation circuit of a display panel comprises a plurality of thin film transistors. The method comprises steps of: removing a film layer above a drain electrode of the thin film transistor; cutting the connection between the thin film transistor and the other thin film transistors in the pixel compensation circuit using a first laser, cutting the connection between the thin film transistor and the other pixel circuits using the first laser; inserting a probe into a probing location, and supplying a predetermined voltage to the probe for measuring the electrical characteristics of the thin film transistor. This method allows the probe to more precisely touch the metal layer in the display area. It can test and analyze the electrical characteristics in the dense display area more easily. And further can avoid the electrical effects from other thin film transistors.

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Номер записи: 73
07-05-2020 дата публикации

Systems and Methods for Depopulating Pins from Contactor Test Sockets for Packaged Semiconductor Devices

Номер: US20200141974A1
Автор: Ata Hisashi, Shwe Thiha, Tong Kay Chan
Принадлежит:

A reduced pin count (RPC) device includes an electrical circuitry in a package with uniformly distributed leads, a subset of the leads being electrically disconnected form the circuitry. A contactor pin block with sockets corresponding to the uniformly distributed leads has the sockets corresponding to the leads with electrical connections filled with test pins suitable for contacting respective leads, and the sockets corresponding to the electrically disconnected leads voided of test pins. Dummy plugs are inserted into the voided sockets to block the sockets and prevent accidental insertions of test pins. 1. A method , comprising:providing a semiconductor device including a circuitry in a package, the package having leads, a first subset of the leads being electrically disconnected from the circuitry, a second subset of the leads having electrical connections to the circuitry;providing a contactor pin block having sockets corresponding to the leads, a first subset the sockets corresponding to the first subset of the leads without being filled with test pins, a second subset of the sockets filled with test pins for contacting the second subset of leads; andinserting dummy plugs into the first subset of the sockets.2. The method of claim 1 , further comprising:placing a transparent mask over the contactor pin block, the mask having marks highlighting the positions of the first subset of the sockets corresponding to the first subset of the leads.3. The method of claim 2 , wherein the marks each having a donut shape.4. The method of claim 1 , wherein the first subset of the leads are attached with solder balls.5. The method of claim 1 , further comprisingaligning the leads with the corresponding sockets of the contactor pin block;contacting the first subset of the leads with the corresponding test pins; andinitiating a testing process associated with the first subset of the leads while blocking the second subset of the leads from accessing the testing process.610-. ( ...

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Номер записи: 74
07-05-2020 дата публикации

MICRO-COAXIAL WIRE INTERCONNECT ARCHITECTURE

Номер: US20200141979A1
Автор: Acar Erkan, Huttula Justin M, Kirby Ronald Michael, Oh Youngseok, Prabhugoud Mohanraj, Walczyk Joe
Принадлежит:

A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing. 126-. (canceled)27. An apparatus , comprising: a first formed conductive member extending from a first contact at a first end to a first slot near a second end, wherein the first slot is configured to align with a first contact of a device under test, wherein the first formed conductive member includes a coaxial conductor having a flexible bend; and', 'a second formed conductive member, different from the first formed conductive member, extending from a second contact to a second slot near a second end, wherein the second slot is configured to align with a second contact of the device under test, wherein the second formed conductive member has a flexible bend., 'a test socket interconnect array comprising28. The apparatus of claim 27 , wherein the second formed conductive member is a bare wire.29. The apparatus of claim 28 , wherein the test socket interconnect array further comprises:a first conductive layer to contact a shield of the first formed conductive member near the first end; anda second conductive layer to contact the shield of the first formed conductive member near the second end.30. The apparatus of claim 29 , wherein the test socket interconnect array further comprises a routed printed circuit board trace coupling the first conductive layer to a ground node.31. The apparatus of claim 27 , wherein the test socket interconnect array further comprises a ball guide layer having slots to guide the first contact to contact to the first formed conductive member and to guide the second contact of the device under test to contact the second formed conductive member.32. The apparatus of claim 28 , wherein the second formed conductive ...

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Номер записи: 75
07-06-2018 дата публикации

Structure and Method of Making Circuitized Substrate Assembly

Номер: US20180156841A1
Автор: Lauffer John, Neely Matthew D.
Принадлежит: i3 Electronics, Inc.

A structure and method for a circuitized substrate assembly that provides interface capability with high-density I/O devices, such as semiconductor devices, said structure and method providing enhanced capability for direct chip attach technology and for device interface board that perform functional and operational testing capability for semiconductor devices having an interconnect pitch down to 50 um or smaller. 1. A modularized circuitized substrate assembly for interfacing with one or more semiconductor devices or packages comprising:a first circuitized substrate subassembly having a first array of pads on a first plane, internal interconnections between a first plane and a second plane, said second plane having a second array of pads;a first z-axis interconnect layer comprised of dielectric and conductive bonding material;a second circuitized substrate subassembly having a third array of pads on a first plane, internal interconnections between a first plane and a second plane, said second plane having a fourth array of pads;wherein said third array of pads on said first plane of said second circuitized substrate subassembly and said second array of pads on said second plane of said first circuitized substrate subassembly align with one another.2. The invention as defined in claim 1 , wherein said first circuitized substrate subassembly is composed of either glass reinforced epoxy dielectric claim 1 , or a multilayer organic substrate materials from the group: Thermount™ claim 1 , metal core claim 1 , Kapton™ claim 1 , liquid crystal polymer (LCP) claim 1 , RCC claim 1 , or homogenous thin glass core.3. The invention as defined in claim 1 , said first array of pads on a first plane of said first circuitized substrate subassembly have a pad to pad pitch from about 300 microns to about 1000 microns claim 1 , and preferably from about 300 microns to about 500 microns.4. The invention as defined in claim 2 , wherein said first array on a first plane of said first ...

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Номер записи: 76
18-06-2015 дата публикации

Coaxial Impedance-Matched Test Socket

Номер: US20150168450A1
Автор: IVANKOV Sergey, WOODEN Tim
Принадлежит:

A coaxial impedance-matched test socket having a socket body with a structure similar to a system of redistributed coaxial cable inserts, where the core of each insert comprises a pogo pin, a metal layer that surrounds the pogo pin functions as a shielding element of the core, and an air gap and an insulation filling between the pogo pin and the shielding metal part function as an isolator. For higher system efficiency in matching impedances between the pogo pins and the test object, the insulation fillings, which are placed between the outer surfaces of the control pogo pins and the inner surfaces of the metal layers, are made from a dielectric material of low dielectric permittivity. By selecting specific dielectric materials with the required dielectric parameters, full matching can be provided. 1. A coaxial impedance-matched test socket for testing electrical circuits and elements of an electrical or electronic device with lead contacts , the test socket comprising:an upper probe retainer, a lower probe retainer, and a metallic probe holder sandwiched between the upper probe retainer and the lower probe retainer, wherein both the upper probe retainer and the lower probe retainer comprise a double-sided laminated plate made from a dielectric material and covered from the top and bottom with a thin metal layer, and wherein the upper probe retainer, the lower probe retainer, and the probe holder have through holes that have inner walls and are aligned with each other;a test board that supports the lower probe retainer and comprises contact pads for connection to respective measurement instruments for measuring the electrical signals obtained during testing of the object; andpogo pins that are divided into pogo pins of a first type and pogo pins of a second type, wherein pogo pins of the first type have electrical contact with the inner walls of the holes of the probe retainer, and the pogo pins of the second type do not have electrical contact with the inner walls ...

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Номер записи: 77
07-06-2018 дата публикации

Integrated circuit (ic) chip socket

Номер: US20180159259A1
Автор: Dolores Babaran Milo, Michael Flores Milo
Принадлежит: Texas Instruments Inc

An integrated circuit (IC) chip socket that can include a non-conductive housing and moveable pogo pins positioned within the non-conductive housing. The moveable pogo pins can include active pogo pins, each active pogo pin being positioned to a corresponding lead of an IC chip insertable into the IC chip socket. Moveable pogo pins can also include an inactive pogo pin positioned to avoid contacting each lead of the IC chip insertable into the IC chip socket.

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Номер записи: 78
08-06-2017 дата публикации

CHIP ATTACH FRAME

Номер: US20170162534A1
Автор: ECKERT Martin, Torreiter Otto, Trianni Quintino L.
Принадлежит:

A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads. 113.-. (canceled)14. A chip attach frame for attaching an integrated circuit chip to a chip carrier , comprising:a frame block having a generally rectangular socket with two adjacent alignment edges forming an orthogonal reference corner, the socket being larger than the integrated circuit chip and located such that pads of the chip carrier are accessible through the socket when said frame block is placed on the chip carrier, said frame block being movable in at least first and second non-parallel directions along the chip carrier;first means for adjusting a position of said frame block relative to the chip carrier along the first direction;second means for adjusting the position of said frame block relative to the chip carrier along the second direction; andplunger means for securing the integrated circuit chip in forcible engagement with the chip carrier.15. The chip attach frame of wherein said plunger means includes:a pressure plate which contacts an upper surface of the integrated circuit chip;one or more elastomeric strips interposed between said pressure plate and an upper surface of said frame block;a plunger block which drives ...

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Номер записи: 79
24-06-2021 дата публикации

ELECTRICAL CONNECTION SOCKET

Номер: US20210190820A1
Автор: Koshiishi Kazutaka, NARUMI Keiichi
Принадлежит:

This electrical connection socket for relaying exchange of electrical signals between a first electrical component and a second electrical component, is provided with: a signal pin which is inserted in a communication hole of a metallic casing so as to form a coaxial line path between the inner wall surface of the communication hole and the outer circumferential surface of the signal pin so that one end of the signal pin is electrically connected to a terminal of the first electrical component while the other end is electrically connected to a terminal of the second electrical component; and a holding member which holds the signal pin in the communication hole such that the outer circumferential surface of the signal pin is separated from the inner wall surface of the communication hole, wherein the characteristic impedance of a signal path formed by the signal pin in a first region where the signal pin is held by the holding member is smaller than a predetermined characteristic impedance which is a reference, and the characteristic impedance in a second region adjacent to the first region is larger than the predetermined characteristic impedance. 1. An electrical connection socket for relaying transmission and reception of an electrical signal between a first electrical component and a second electrical component , the electrical connection socket comprising:a metal housing including a communication hole for communicating between an upper surface of the metal housing and a lower surface of the metal housing, the metal housing being disposed such that the first electrical component is disposed at the lower surface, and that the second electrical component is disposed at the upper surface;a signal pin configured to be inserted into the communication hole such that a coaxial line is formed with an inner wall surface of the communication hole, the signal pin being configured such that one end of the signal pin is electrically connected to a terminal of the first ...

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Номер записи: 80
24-06-2021 дата публикации

Contact device for electrical test

Номер: US20210190823A1
Автор: Young Bae Chung
Принадлежит: ISC Co Ltd

The disclosure includes a contact device for electrical test, the contact device for electrical test including a second body portion, a first body portion stacked above the second body portion, a middle portion stacked above the first body portion, and having a first protrusion that is sharp and has a first apex portion, the first protrusion being formed on an upper side of the middle portion, and the first body portion, the middle portion, and the contact portion are sequentially and upwardly stacked, the middle portion and the contact portion include materials different from each other, and a first protrusion is provided inside the second protrusion.

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Номер записи: 81
14-06-2018 дата публикации

UNIVERSAL TEST MECHANISM FOR SEMICONDUCTOR DEVICE

Номер: US20180164343A1
Автор: Chen Hao, Lin Hung-Chih, Wang Mill-Jer, Wu Chi-Che
Принадлежит:

A semiconductor device includes a circuit board, a semiconductor package, and a contact interface. The semiconductor package is mounted on the circuit board. The semiconductor package includes a plurality of conductive bumps with a first pitch. The contact interface is electrically connected to the circuit board. The contact interface includes a plurality of first contact pads with a second pitch substantially the same as the first pitch. The first contact pads are separated from the conductive bumps. 1. A semiconductor device , comprising:a circuit board;a semiconductor package mounted on the circuit board, wherein the semiconductor package comprises a plurality of conductive bumps with a first pitch; anda contact interface electrically connected to the circuit board, wherein the contact interface comprises a plurality of first contact pads with a second pitch substantially the same as the first pitch, and wherein the first contact pads are separated from the conductive bumps.2. The semiconductor device of claim 1 , wherein the circuit board comprises a plurality of second contact pads claim 1 , and wherein the first contact pads are electrically connected to the second contact pads in a one-to-one manner.3. The semiconductor device of claim 1 , wherein the circuit board comprises a plurality of second contact pads claim 1 , and wherein the semiconductor device further comprises:a plurality of signal channels respectively connecting the second contact pads to the first contact pads, wherein the signal channels have substantially the same length.4. The semiconductor device of claim 1 , further comprising:a connector laterally extending from the circuit board to the contact interface.5. The semiconductor device of claim 1 , further comprising:a connector protruding from a sidewall of the circuit board to the contact interface.6. The semiconductor device of claim 1 , further comprising:a connector connected between the circuit board and the contact interface; anda ...

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Номер записи: 82
14-06-2018 дата публикации

SEMICONDUCTOR INSPECTION JIG

Номер: US20180164344A1
Автор: Ikeda Daisuke, KITAGAWA Tetsuya, KOBAYASHI Yuji, Koyanagi Motoyoshi, Kubota Masayuki, SASANO Kazuhiro, TANIUCHI Tomohito
Принадлежит: Mitsubishi Electric Corporation

A semiconductor inspection jig includes: a base on which a semiconductor device is placed; and a substrate provided on the base and including a conductive pattern, wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead. 1. A semiconductor inspection jig comprising:a base on which a semiconductor device is placed; anda substrate provided on the base and including a conductive pattern,wherein the conductive pattern intersects with a lead of the semiconductor device placed on the base from a direction other than a horizontal direction with respect to the lead, and is in contact with an intermediate part of the lead without being in contact with a leading end of the lead.2. A semiconductor inspection jig comprising:a base on which a semiconductor device is placed;a substrate provided on the base and including a first conductive pattern not being in contact with a lead of the semiconductor device placed on the base; anda contact sheet including a second conductive pattern,wherein when the semiconductor device is placed on the base and the lead and the substrate are covered with the contact sheet, the second conductive pattern is brought into contact with an intermediate part of the lead without being in contact with a leading end of the lead, and the lead and the first conductive pattern are connected via the second conductive pattern.3. The semiconductor inspection jig according to claim 2 , wherein the contact sheet includes a hole having a shape that matches an outer diameter size of a body part of the semiconductor device claim 2 , andthe contact sheet is positioned in such a manner that the body part penetrates through the hole in the contact sheet.4. A semiconductor inspection jig comprising:a base on which a semiconductor device is ...

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Номер записи: 83
30-05-2019 дата публикации

Integrated Modular Integrated Circuit Test Fixture and Handler Interface

Номер: US20190162755A1
Автор: Rose Larry R., ZHANG WENSHUI
Принадлежит:

A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler. 1. An integrated circuit test fixture comprising:a plurality of sockets;an alignment plate coupled to the sockets and configured to provide alignment between an integrated circuit handler and the integrated circuit test fixture; andone or more manual test lids removably coupled to the alignment plate, the one or more manual test lids coupled to the alignment plate for manual testing one or more integrated circuits, the manual test lids removed from the alignment plate for use of the integrated circuit test fixture with the integrated circuit handler.2. The integrated circuit test fixture claim 1 , as recited in claim 1 , wherein the one or more manual test lids are removably coupled to the alignment plate with spring-loaded latches.3. The integrated circuit test fixture claim 1 , as recited in claim 1 , further comprising: a daughter card printed circuit board (PCB);', 'the plurality of sockets electrically coupled to the daughter card PCB;', 'the alignment plate;, 'a first subassembly including,'}a daughter card stiffener into which the first subassembly ...

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Номер записи: 84
25-06-2015 дата публикации

Transport Apparatus for Moving Carriers of Test Parts

Номер: US20150177318A1
Автор: Di Stefano Peter T., Di Stefano Thomas H.
Принадлежит:

One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously. 1. An apparatus for transporting carriers of devices , the apparatus comprising:a track with two or more rails adapted to support carriers moveably;a first pin attached to a trolley and a second pin attached to a trolley, each of which pins is adapted to engage a feature in each of the carriers;a first actuator adapted to raise and lower the first pin that may engage and release, respectively, the feature in the first carrier and a second actuator adapted to raise and lower the second pin that may engage and release, respectively, the feature in the second carrier simultaneously; anda linear actuator adapted to move the trolley along a direction parallel to the track so that activation of the linear actuator when the first and second pins are engaged moves the first carrier onto a test site and moves the second carrier off the test site simultaneously.2. The apparatus of wherein the carrier comprises:a frame supported on the rails;a tray with apertures for holding the devices, which tray is resiliently coupled to the frame so the tray is adapted to move resiliently with respect to the rails and the frame.3. The apparatus of wherein a test head juxtaposed with a contactor is movable toward the contactor claim 2 , thereby urging the devices ...

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Номер записи: 85
30-05-2019 дата публикации

TEST INTERFACE BOARD AND SYSTEM INCLUDING THE SAME

Номер: US20190164851A1
Автор: HWANG DAEHA, KIM Jongkook, Min Young-gi, PARK Sooyong, YOO JONGWOON
Принадлежит:

A test system includes automatic test equipment configured to test a device under test, and a test interface board configured to measure a second voltage applied to the device under test based on a first voltage supplied from the automatic test equipment. The test interface board includes a sensing wiring configured to transmit the measured second voltage to the automatic test equipment. The second voltage is measured at an interior location of the device under test. 1. A test system , comprising:an automatic test equipment configured to test a device under test; anda test interface board configured to measure a second voltage applied to the device under test based on a first voltage supplied from the automatic test equipment,wherein the test interface board comprises a sensing wiring configured to transmit the measured second voltage to the automatic test equipment,wherein the second voltage is measured at an interior location of the device under test.2. The test system of claim 1 , wherein the test interface board further comprises:a feedback voltage output terminal configured to transmit the measured second voltage to the automatic test equipment,wherein the sensing wiring is disposed between and connects a sensing point at the interior location of the device under test and the feedback voltage output terminal,wherein the sensing point corresponds to the interior location at which the second voltage is measured.3. The test system of claim 2 , wherein the device under test comprises:a first power terminal;a second power terminal; anda channel configured to merge a voltage received from the first power terminal and a voltage received from the second power terminal,wherein the sensing point is disposed on the channel, and the sensing wiring is connected to the sensing point through a third power terminal of the device under test.4. The test system of claim 1 , wherein the automatic test equipment is configured to supply the first voltage to the test interface board ...

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Номер записи: 86
01-07-2021 дата публикации

LOCKING MECHANISM FOR A PRESS HEAD AND ELECTRONIC DEVICE TESTING APPARATUS COMPRISING THE SAME

Номер: US20210199690A1
Автор: Chen Chien-Ming, Ouyang Chin-Yi, SU Bo-An, WANG Yu-Hsuen
Принадлежит:

The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism. 1. A press head locking mechanism for locking a press head and a test socket substrate , comprising:an actuator disposed on at least one of the press head and the test socket substrate;a slider disposed on at least one of the press head and the test socket substrate, the slider being connected to the actuator; anda locking pin disposed on at least one of the press head and the test socket substrate;wherein, when the press head is engaged with the test socket substrate, the actuator drives the slider to move in a predetermined direction to secure the locking pin, so that the press head and the test socket substrate are securely locked and prevented from being separated from each other.2. The press head locking mechanism according to claim 1 , wherein the actuator and the slider are disposed on the press head claim 1 , a lower surface of the press head is provided with an insertion hole claim 1 , the locking pin protrudes from an upper surface of the test socket substrate claim 1 , the slider has a slot configured to receive the locking pin through ...

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Номер записи: 87
01-07-2021 дата публикации

PROBE PIN HAVING OUTER SPRING

Номер: US20210199692A1
Автор: Choi Won Ho, JUN Jin Kook, PYO Eun Hyeong
Принадлежит:

There is provided a probe pin for performing an electrical inspection between a contact pad of a test apparatus and a conductive ball of a semiconductor device, the probe pin including a cylinder-type bottom plunger connected to the contact pad and configured to slide vertically, a piston-type top plunger connected to the conductive ball and configured to slide vertically, and an outer spring configured to provide an elastic force between the bottom plunger and the top plunger. According to the configuration of the present invention, it is possible to perform a stable inspection process by using the outer spring despite pin miniaturization. 1. A probe pin for performing an electrical inspection between a contact pad of a test apparatus and a conductive ball of a semiconductor device , the probe pin comprising:a cylinder-type bottom plunger connected to the contact pad and configured to slide vertically;a piston-type top plunger connected to the conductive ball and configured to slide vertically; andan outer spring configured to provide an elastic force between the bottom plunger and the top plunger.2. The probe pin of claim 1 , wherein the bottom plunger comprises:a pad connection tip brought into direct contact with the contact pad;a pad fastening pole extending forward from the pad connection tip; anda barrel functioning as a cylinder and installed integrally with or separately from the pad fastening pole.3. The probe pin of claim 2 , wherein the top plunger comprises:a ball connection tip brought into direct contact with the conductive ball;a ball fastening pole extending backward from the pad connection tip; anda rod functioning as a piston and extending integrally with the ball fastening pole.4. The probe pin of claim 3 , wherein the pad fastening pole and the ball fastening pole has a cylindrical shape with a stepped portion claim 3 , and the outer spring is fixed on the stepped portion.5. The probe pin of claim 2 , wherein the pad fastening pole is formed ...

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Номер записи: 88
21-06-2018 дата публикации

Contactor with angled depressible probes

Номер: US20180172730A1
Автор: Chee-Wah Ho, Nasser Barabi, Oksana Kryachek
Принадлежит: Essai Inc

A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

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Номер записи: 89
04-06-2020 дата публикации

Bga socket device for testing bga ic

Номер: US20200176910A1
Автор: Dong Weon Hwang, Jae Baek Hwang, Logan Jae Hwang
Принадлежит: Individual

Disclosed is a BGA socket device used for testing a BGA IC and having a dual pinch type contact. The BGA socket device includes: contacts each including a fixed terminal and a movable terminal and configured such that respective upper ends of the fixed and movable terminals are offset from each other with respect to each solder ball of the IC; a main body in which the contact is provided and fixed; a cover supported on an upper surface of the main body and configured to be movable up and down; and a slider provided between the main body and the cover and configured to slide left and right, thus opening and closing the movable terminal in a horizontal direction, the slider having a fixed terminal receiving hole and a movable terminal receiving hole in which the fixed and movable terminals of the contact are received, respectively, by passing therethrough.

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Номер записи: 90
05-07-2018 дата публикации

STACKED INSTRUMENT ARCHITECTURE FOR TESTING AND VALIDATION OF ELECTRONIC CIRCUITS

Номер: US20180188288A1
Автор: Acar Erkan, Detofsky Abram M., PAN Jin
Принадлежит: Intel Corporation

In one embodiment, a device to test one or more electronic components comprises a first card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card and a second card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card. The at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first test device and the second test device that is not routed via a backplane. Other embodiments may be described. 1. A device to test one or more electronic components , comprising:a first instrument card comprising a first test device communicatively coupled to at least a first connector assembly positioned on the first card; anda second instrument card comprising a second test device communicatively coupled to at least a second connector assembly positioned on the second card,wherein the at least a first connector assembly is directly communicatively coupled to the at least a second connector assembly to provide a direct communication interface between the first instrument card and the second instrument card that is not routed via a backplane.2. The device of claim 1 , wherein:the first instrument card comprises a first plurality of connector assemblies arranged in predetermined locations with respect to a central position on the first instrument card; andthe second instrument card comprises a second plurality of connector assemblies arranged in corresponding predetermined locations with respect to a central position on the second instrument card.3. The device of claim 2 , wherein the first plurality of connector assemblies comprises:a first connector set positioned in a first corner of the first instrument card;a second connector set positioned in a second corner of the first instrument card;a third connector set positioned in a ...

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Номер записи: 91
16-07-2015 дата публикации

Chip attach frame

Номер: US20150201537A9
Автор: Martin Eckert, Otto Torreiter, Quintino L. Trianni
Принадлежит: International Business Machines Corp

A chip attach frame is used to align pins of an integrated circuit chip with pads on a chip carrier. A frame block has a socket defining two alignment edges that form a reference corner. The chip is lowered into the socket, and the chip carrier is inclined while it supports the frame block and chip until the chip moves under force of gravity to the reference corner. Once located at the reference corner, the chip position is carefully adjusted by moving the frame block in the x- and y-directions until the pins are aligned with the pads. The frame block is spring biased against movement in the x- and y-directions, and the position of the frame block is adjusted using thumbscrews. A plunger mechanism can be used to secure the integrated circuit chip in forcible engagement with the chip carrier once the pins are aligned with the pads.

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Номер записи: 92
20-06-2019 дата публикации

TESTING DEVICE

Номер: US20190187177A1
Автор: Shin Jung-chul
Принадлежит:

Disclosed is a testing device. The testing device includes a testing socket configured to support a plurality of probes, a testing-circuit substrate which includes a contact point to contact the probe, a slider which makes the testing socket be coupled to and separated from the testing-circuit substrate, and a slider operator which includes a main body arranged on the testing socket, and a slider pressing portion up/down-movably supported on the main body and moving down from the main body toward the slider so that the slider can slide along a surface direction of the testing socket. 1. A testing device comprising:a testing socket configured to support a plurality of probes;a testing-circuit substrate which comprises a contact point to contact the probe;a slider which makes the testing socket be coupled to and separated from the testing-circuit substrate; anda slider operator which comprises a main body arranged on the testing socket, and a slider pressing portion up/down-movably supported on the main body and moving down from the main body toward the slider so that the slider can slide along a surface direction of the testing socket.2. The testing device according to claim 1 , wherein the slider pressing portion comprises an inward pressing portion for making the slider move toward an inside of the testing socket claim 1 , and an outward pressing portion for making the slider move toward an outside of the testing socket.3. The testing device according to claim 1 , whereinthe slider comprises an first inclined surface inclined upward from an outside of the testing socket to an inside, and a second inclined surface spaced apart from the first inclined surface and inclined upward from the inside of the testing socket to the outside,the inward pressing portion comprises a third inclined surface to be in contact with the first inclined surface, andthe outward pressing portion comprises a fourth inclined surface to be in contact with the second inclined surface.4. The ...

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Номер записи: 93
23-07-2015 дата публикации

Testing jig

Номер: US20150204905A1
Автор: Chia-Nan Chou, Chih-Hao Ho, Hao Wei, Wei-Cheng Ku
Принадлежит: MPI Corp

A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.

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Номер записи: 94
30-07-2015 дата публикации

ELECTRICAL INTERCONNECT ASSEMBLY

Номер: US20150212111A1
Автор: FOONG Wei Kuong, GOH Kok Sing, LEE Eng Kiat, MUNDIYATH Shamal
Принадлежит:

An electrical test contact electrically connects a test terminal of an Integrated Circuit (IC) test assembly with an IC terminal of an IC device in an electrical interconnect assembly. The test contact is formed of electrically conductive material and includes a head portion and a foot portion. The head portion includes a first electrical contacting portion for electrically engaging an IC terminal of an IC device during use, and the foot portion includes a second electrical contacting portion for electrically engaging a test terminal of a test assembly during use. The head portion includes a head receiving portion that receives a first resiliently biasing member to retain the first resiliently biasing member in contact with the test contact. The first resiliently biasing member biases the first electrical contacting portion against the IC terminal of the IC device during use. An electrical interconnect assembly having multiple test contacts is also disclosed. 1. An electrical test contact for electrically connecting a test terminal of an IC test assembly with an IC terminal of an IC device in an electrical interconnect assembly , comprising:a first electrical contacting portion for electrically engaging said IC terminal of an IC device during use;a second electrical contacting portion fixed to said first electrical contacting portion for electrically engaging said test terminal of a test assembly during use, said second electrical contacting portion having a curved surface for rotably engaging said test terminal during use;a first resiliently biasing member adapted to engage with said first electrical contacting portion; anda second resiliently biasing member adapted to engage with said second electrical contacting portion and to decelerate a force exerted on the test terminal of the test assembly by the second electrical contacting portion during use.2. An electrical test contact for electrically connecting a test terminal of an IC test assembly with an IC terminal ...

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Номер записи: 95
21-07-2016 дата публикации

Quick change small footprint testing system and method of use

Номер: US20160209443A1
Автор: Jack Lewis, Lynwood Adams
Принадлежит: Modus Test Automation LLC

A testing system for semiconductor chips having a removable device under test printed circuit board (DUT PCB) that electrically connects with the electrical testing components of the system. A removable top plate is placed on top of the DUT PCB and is locked in place by a plurality of locking posts that selectively connect to cam surfaces in the top plate that pull the top plate down sandwiching the DUT PCB between the top plate and the electrical testing components of the system. The DUT PCB is quickly and easily removed and replaced by moving the locking posts between an engaged position and a disengaged position. In this way, a single testing system can be used to test a great variety of semiconductor chips thereby reducing capital equipment costs and space needed in cleanrooms.

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Номер записи: 96
29-07-2021 дата публикации

SEMICONDUCTOR DEVICE TEST SOCKET

Номер: US20210231705A1
Автор: CHO Yong Ho, PARK Sang Hee
Принадлежит: Micro Friend Co., Ltd

An embodiment of the present invention provides a test socket for a semiconductor device, comprising: a base layer having a first surface and a second surface opposite to the first surface, and having, on the second surface, an external connection pad formed at a pitch corresponding to an electrode terminal of a test board; a plurality of circuit patterns formed to be partially exposed on the surface of the base layer and rearranged at a pitch corresponding to the external connection pad; a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and an external connection terminal of a semiconductor device, and arranged at a pitch corresponding to the external connection terminal; and an elastic layer covering the electrode patterns such that the electrode patterns are partially exposed. 1. A test socket for electrical connection between a semiconductor device and a test board , the test socket comprising:a base layer having a first surface and a second surface opposing the first surface, and including external connection pads formed at a pitch corresponding to electrode terminals of the test board on the second surface;a plurality of circuit patterns formed to be partially exposed onto a surface of the base layer and rearranged at a pitch corresponding to the external connection pads;a plurality of electrode patterns formed on the first surface to be electrically connected to the circuit patterns and external connection terminals of the semiconductor device, and disposed at a pitch corresponding to the external connection terminals; andan elastic layer surrounding the electrode patterns so that portions of the electrode patterns are exposed.2. The test socket for a semiconductor device of claim 1 , wherein the base layer is formed of a polyimide material.3. The test socket for a semiconductor device of claim 1 , wherein the circuit patterns include:first circuit patterns rearranged to be electrically ...

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Номер записи: 97
04-07-2019 дата публикации

CONTACTORS WITH SIGNAL PINS, GROUND PINS, AND SHORT GROUND PINS

Номер: US20190204357A1
Автор: Ata Hisashi, Hsu Jonathan, MARTINEZ Felix, Shwe Thiha, Tong Kay Chan
Принадлежит:

A system comprises: a contactor having a first surface, a second surface, a first hole, a second hole parallel to the first hole, and a third hole parallel to the first hole; a first signal pin held in the first hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor; a first short ground pin held in the second hole of the contactor, extending to at least the second surface of the contactor, and extending within the first surface of the contactor; and a ground pin held in the third hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor. 1. A system comprising:a contactor having a first surface, a second surface, a first hole, a second hole parallel to the first hole, and a third hole parallel to the first hole;a first signal pin held in the first hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor; anda ground pin held in the third hole of the contactor, extending to at least the second surface of the contactor, and extending to at least the first surface of the contactor.2. The system of claim 1 , wherein the contactor comprises a plate to receive an integrated circuit package.3. The system of claim 1 , wherein the second hole is separated from the first hole by not more than 100 microns.4. The system of claim 1 , further comprising a circuit board claim 1 , the circuit board comprising:a signal pad in electrical contact with the first signal pin;a first ground pad in electrical contact with the first short ground pin; anda second ground pad in electrical contact with the ground pin.5. The system of claim 4 , further comprising:a ground at ground potential, the ground in electrical contact with the second ground pad of the circuit board.6. The system of claim of claim 5 , further comprising:a radio ...

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Номер записи: 98
04-07-2019 дата публикации

SYSTEM AND METHODS FOR SEMICONDUCTOR BURN-IN TEST

Номер: US20190204378A1
Автор: Gopal Ballson, Killion Jesse
Принадлежит: KES SYSTEMS, INC.

Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus () may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor device(s) for burn-in testing. The apparatus may include a thermal control unit to regulate testing temperature and/or drive electronics for powering the socket. The apparatus may include an inlet for gas pressure from a pressure source. The apparatus may include a lid covering the aperture when a tile/wafer is at the test socket. The apparatus may include a seal carrier in the aperture to form a pressure chamber with a surface of the tile. The pressure chamber may pneumatically couple with the inlet. Pressure of the pressure chamber may act upon the tile/wafer to urge a device under testing into thermal and/or electrical contact with the socket for conducting the burn-in test. 1. A burn-in test apparatus for semiconductor devices , the test apparatus comprising:an outer housing forming an aperture with a test socket to receive a tile, the tile comprising at least one semiconductor device for burn-in testing;a thermal control unit configured to regulate temperature associated with the burn-in testing;an inlet for gas pressure from a pressure source;a lid to cover the aperture when a tile is at the test socket; anda seal carrier located within the aperture to form a pressure chamber with a first surface of the tile, the pressure chamber pneumatically coupled with inlet.2. The burn-in test apparatus of wherein the seal carrier comprises a flange with a flexible seal claim 1 , the flexible seal extending from the flange for contacting the first surface of the tile.3. The burn-in test apparatus of wherein the flexible seal comprises a perimeter skirt for engaging a perimeter of the tile when the tile is in the test socket.4. The burn-in test apparatus of further comprising a lid seal claim 1 , the lid seal configured to maintain a pressure ...

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Номер записи: 99
11-07-2019 дата публикации

HIGH INSERTION COUNT TEST SOCKET

Номер: US20190212362A1
Автор: COLE Adam, McCallion Jeffrey
Принадлежит:

A test socket and method for using the same are disclosed herein. In one embodiment, the test socket comprises a base having a top loading area, an actuator rotatably coupled to the base, and a pushing device rotatably coupled to the actuator, where the pushing device is pressed against a semiconductor device when the semiconductor device is placed onto the top loading area and the actuator is moved to a first position (e.g., a test position). 1. A socket comprising:a base having a top loading area;an actuator rotatably coupled to the base; anda pushing device rotatably coupled to the actuator, wherein the pushing device is pushed against a semiconductor device when the semiconductor device is placed onto the top loading area and the actuator is moved to a first position.2. The socket defined in wherein a flat portion of a surface of the pushing device is operable to make contact across a top surface the semiconductor device when the pushing device contacts the semiconductor device as the actuator is moved into the first position.3. The socket defined in wherein the surface comprises a pattern operable to prevent a vacuum seal from occurring between the surface and the top surface of the semiconductor device.4. The socket defined in wherein the surface comprises a knurl patterned surface.5. The socket defined in wherein the knurl patterned surface comprises an electrostatic discharge material.6. The socket defined in wherein the actuator is movable to a second position at which the pushing device is positioned outside of an area above the top loading area.7. The socket defined in wherein the pushing device has an I-beam shape.8. The socket defined in further comprising a spring positioned between the actuator and the base claim 1 , the spring being in a first compressed state and applying force to cause the pushing device to press against the semiconductor device when the semiconductor device is placed onto the top loading area and the actuator is moved to a first ...

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Номер записи: 100