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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 2423. Отображено 100.
27-09-2012 дата публикации

High-frequency coupling testing device by coupling effect

Номер: US20120242360A1
Автор: Chao-Ping Hsieh, Chih-Hao Ho, Keng-Yi HUANG, Wei-Cheng Ku
Принадлежит: MPI Corp

Method for transmitting a high-frequency signal by a coupling effect includes receiving a high-frequency signal by a high-frequency circuit and coupling the high-frequency signal to a coupling circuit by the coupling effect to output a high-frequency coupled signal, and adjusting a filter between the coupling circuit and the high-frequency circuit formed by the coupling effect for adjusting transmission frequency of the high-frequency coupled signal; upon when the high-frequency circuit includes a high-frequency metal probe, the coupling circuit comprises a coupling transmission wire. Meanwhile, upon when the high-frequency circuit includes the coupling transmission wire, the coupling circuit includes the high-frequency metal probe. Further, the filter between the coupling circuit and the high-frequency circuit can be adjusted by changing the number of the coupling metal probes surrounding the high-frequency metal probe, or by changing the distances between the coupling metal probes and the high-frequency metal probes.

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Номер записи: 1
27-12-2012 дата публикации

Wiring board and method of manufacturing the same

Номер: US20120325529A1
Автор: Akinori Shiraishi, Hideaki Sakaguchi, Mitsutoshi Higashi
Принадлежит: Shinko Electric Industries Co Ltd

A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion.

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Номер записи: 2
10-01-2013 дата публикации

Probe card and method for testing magnetic sensors

Номер: US20130009659A1
Автор: Lianjun Liu, Phillip MATHER
Принадлежит: Everspin Technologies Inc

A probe card and method are provided for testing magnetic sensors at the wafer level. The probe card has one or more probe tips having a first pair of solenoid coils in parallel configuration on first opposed sides of each probe tip to supply a magnetic field in a first (X) direction, a second pair of solenoid coils in parallel configuration on second opposed sides of each probe tip to supply a magnetic field in a second (Y) direction orthogonal to the first direction, and an optional third solenoid coil enclosing or inscribing the first and second pair to supply a magnetic field in a third direction (Z) orthogonal to both the first and second directions. The first pair, second pair, and third coil are each symmetrical with a point on the probe tip array, the point being aligned with and positioned close to a magnetic sensor during test.

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Номер записи: 3
18-04-2013 дата публикации

VERTICAL PROBE ARRAY ARRANGED TO PROVIDE SPACE TRANSFORMATION

Номер: US20130093450A1
Автор: Kister January
Принадлежит: FORMFACTOR, INC.

Improved probing of closely spaced contact pads is provided by an array of vertical probes having all of the probe tips aligned along a single contact line, while the probe bases are arranged in an array having two or more rows parallel to the contact line. With this arrangement of probes, the probe base thickness can be made greater than the contact pad spacing along the contact line, thereby advantageously increasing the lateral stiffness of the probes. The probe tip thickness is less than the contact pad spacing, so probes suitable for practicing the invention have a wide base section and a narrow tip section. 1a plurality of probes, each probe comprising a base section and a tip section;said adjacent tip sections of said probes comprising a first center to center spacing;said adjacent base sections of said probes in each said row comprising a second center to center spacing; andsaid base sections comprising thicknesses greater than said center to center spacing of said adjacent tip sections.. A probe array comprising: This application is a continuation application of U.S. patent application Ser. No. 13/118,952 (now U.S. Pat. No. 8,324,923), entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed May 31, 2011, which is a continuation application of U.S. patent application Ser. No. 12/419,912 (now U.S. Pat. No. 7,952,377), entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed Apr. 7, 2009, which is a continuation application of U.S. patent application Ser. No. 11/786,107 (now U.S. Pat. No. 7,514,948) entitled “Vertical Probe Array Arranged to Provide Space Transformation”, to January Kister, filed on Apr. 10, 2007, and the specifications and claims of all the applications listed above are incorporated herein by reference.1. Field of the Invention (Technical Field)This invention relates to probe arrays for testing integrated electrical circuits.2. Description of Related ...

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Номер записи: 4
04-07-2013 дата публикации

Wiring board and probe card using the same

Номер: US20130169305A1
Автор: Kenji Terada, TAKAYUKI Taguchi
Принадлежит: Kyocera SLC Technologies Corp

A wiring board 3 according to the present invention includes a first resin layer 18 a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18 a ; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18 a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18 a.

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Номер записи: 5
12-09-2013 дата публикации

SHIELDED PROBE ARRAY

Номер: US20130234746A1
Автор: NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Shielded probe array. In accordance with a first embodiment, an article of manufacture includes a plurality of rows of electronic probes. Each row of probes is substantially in a plane. Each probe includes a metal signal layer and a ground layer, separated by an insulator. The article of manufacture also includes a space transformer for mechanically supporting the plurality of rows of electronic probes. The space transformer also provides an electrical path from each of the probe metal signal layers and the probe ground layers to a higher level electronic assembly. Each of the plurality of rows of electronic probes may include a handle including a substrate for handling the row of electronic probes. 1. An article of manufacture comprising: 'a metal signal layer and a ground layer, separated by an insulator;', 'a plurality of said electronic probes substantially in a plane, each said electronic probe comprising, 'a plurality of rows of electronic probes, each said row comprisinga space transformer for mechanically supporting said plurality of rows of electronic probes; andsaid space transformer also for providing an electrical path from each of said probe metal signal layers and said probe ground layer to a higher level electronic assembly.2. The article of manufacture of wherein each of said plurality of rows of electronic probes further comprises a handle comprising a substrate for handling said row of electronic probes.3. The article of manufacture of wherein said handle is configured for a die stacking apparatus to grasp and manipulate said row of electronic probes.4. The article of manufacture of wherein each said electronic probe further comprises a probe tip configured for contacting a test point of an integrated circuit.5. The article of manufacture of wherein said probe tip extends beyond a projection of said metal signal layer.6. The article of manufacture of wherein said rows of electronic probes are characterized as having a probe pitch claim 1 , and said ...

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Номер записи: 6
12-09-2013 дата публикации

FINE PITCH PROBE ARRAY FROM BULK MATERIAL

Номер: US20130234747A1
Автор: NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Each probe tip is mounted on a probe finger structure. All of the probe finger structures of the array have the same material grain structure. The probe fingers may have a non-linear profile and/or be configured to act as a spring. 1. An article of manufacture comprising: a probe tip, suitable for contacting an integrated circuit test point;', 'said probe tip mounted on a probe finger structure,, 'an array of probes, wherein each probe compriseswherein all said probe finger structures of said array have the same material grain structure.2. The article of manufacture of wherein said probe finger structure has a non-linear profile.3. The article of manufacture of wherein said probe finger structure is configured to act as a spring.4. The article of manufacture of further comprising a conductive metal coating on said probe finger structure claim 1 , wherein said coating is in electrical contact with said probe tip claim 1 ,5. The article of manufacture of wherein said probe tip comprises a noble metal excluding gold.6. The article of manufacture of wherein said probe tips of said array of probes are arranged on a grid of less than 50 μm.7. The article of manufacture of wherein said array of probes is functionally coupled to a space transforming substrate claim 1 , for transforming a pitch of said array of probes to a larger pitch.8. A method comprising:accessing a bulk material with first and second substantially parallel faces;forming a probe base on said first face;forming a probe tip suitable for contacting an integrated circuit test point on said probe base;mounting said second face to a carrier wafer;removing portions of said bulk material to form a probe finger structure coupled to said probe base and said probe tip; andcoating said ...

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Номер записи: 7
26-09-2013 дата публикации

Multifunction Test Instrument Probe

Номер: US20130249533A1
Автор: Chait Paul Nicholas, Chait Stanley
Принадлежит:

A multifunction test instrument probe includes a housing having a hollow bore with an open end. A clamp plunger is carried in the hollow bore, with a first end including a thumb press, and a second end including an alligator clamp having a pair of jaws, with a compression spring normally biasing the thumb press away from the housing, and normally biasing the alligator clamp substantially within the hollow bore proximate the open end. A point plunger is also carried in the bore, with a first end including a thumb press, and a second end terminating in a point, with a second compression spring normally biasing the thumb press away from the housing, and biasing the point within the hollow bore proximate the open end. When the clamp plunger is depressed, the alligator clamp is extended from the open end and the jaws are urged open by a jaw spring, and when the clamp plunger is released, the compression spring acts to retract the alligator clamp back towards the hollow bore and the jaws are urged closed by contact with the open end. When the point plunger is depressed, the point is extended from the open end. When the clamp plunger is again depressed, the point retracts into the housing. 1. A multifunction test instrument probe comprising:a housing having a hollow bore with an open end;a first plunger carried in said hollow bore, said first plunger having a first end including a thumb press portion, a second end terminating in an alligator clamp having a pair of jaws, and a first plunger compression spring normally biasing said first end thumb press away from said housing, and normally biasing said alligator clamp substantially within said hollow bore proximate said open end;a second plunger carried in said hollow bore, said second plunger having a first end including a thumb press portion, a second end terminating in a point, and a second plunger compression spring normally biasing said first end thumb press away from said housing, and biasing said point within said ...

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Номер записи: 8
31-10-2013 дата публикации

STIFFENER PLATE FOR A PROBECARD AND METHOD

Номер: US20130285690A1
Автор: Andberg John
Принадлежит: ADVANTEST (SINGAPORE) PTE LTD

A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include a main body and a plurality of mounting points, wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction significantly greater than in the lateral direction. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices. 1. A laterally extending stiffener plate adapted to provide stiffening for a probecard , comprising:a main body; anda plurality of mounting points;wherein at least one of the mounting points is flexibly connected to the main body by one or more laterally extending beams that has a section modulus normal to the lateral direction at least sixteen times greater than in the lateral direction.2. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least twenty-five times greater than in the lateral direction.3. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least thirty-six times greater than in the lateral direction.4. The laterally extending stiffener plate of claim 1 , wherein the one or more laterally extending beams has a section modulus normal to the lateral direction at least forty-nine times greater than in the lateral direction.5. The laterally extending ...

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Номер записи: 9
28-11-2013 дата публикации

RESISTIVITY-MEASURING DEVICE

Номер: US20130314112A1
Автор: Lai Yankun, Li Minxuan, Yu Lewei
Принадлежит: TPK TOUCH SOLUTIONS (XIAMEN) INC.

A resistivity-measuring device comprising: a carrier platform used for loading a plurality of products under measure; a material-incoming conveyor, on which the carrier platform is disposed, and comprising a material-incoming guide wheel group for moving the carrier platform horizontally; a probe module, used for measuring the resistance of the products under measure; a probe position regulating mechanism, disposed on the material-incoming conveyor and connected to the probe module for elevating the probe module vertically and moving the probe module horizontally; a revolving machine, connected to the material-incoming conveyor for receiving and transferring a plurality of products under measure from the material-incoming conveyor, wherein a transferring direction of the revolving machine is adjustable; and a controller, electrically connected to the material-incoming conveyor, the probe module, the probe position regulating mechanism and the revolving machine. The resistivity-measuring device achieves automatic measuring resistivity, increases the efficiency of measurement, and reduces labor power cost. 1. A resistivity-measuring device , comprising:a carrier platform used for loading a plurality of products under measure;a material-incoming conveyor, on which the carrier platform is disposed, and the material-incoming conveyor comprises a material-incoming guide wheel group for moving the carrier platform horizontally;a probe module, used for measuring the resistance of the products under measure;a probe position regulating mechanism, disposed on the material-incoming conveyor and connected to the probe module for elevating the probe module vertically and moving the probe module horizontally;a revolving machine, connected to the material-incoming conveyor for receiving and transferring a plurality of products under measure from the material-incoming conveyor, wherein a transferring direction of the revolving machine is adjustable; anda controller, electrically ...

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Номер записи: 10
12-12-2013 дата публикации

Probe Card for Simultaneously Testing Multiple Dies

Номер: US20130328586A1
Автор: Chou You-Hua, LAI Yi-Jen
Принадлежит: Taiwan Semiconductor Manufacturing Company, Ltd.

In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure. 1. A probe card comprising:a contact pad interface comprising front side contacts and back side contacts electrically coupled together, the front side contacts being arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts being arranged to electrically couple respective contacts of a testing structure.2. The probe card of claim 1 , wherein the front side contacts are arranged to simultaneously electrically couple the respective bumps of all of the dies on the wafer.3. The probe card of claim 1 , wherein the testing structure comprises a docking board secured to the contact pad interface claim 1 , the docking board comprising a contact pad claim 1 , the contact pad comprising board contacts claim 1 , the board contacts being the contacts of the testing structure.4. The probe card of claim 3 , wherein the contact pad interface is secured to the docking board by a clamp.5. The probe card of claim 3 , wherein the contact pad interface is secured to the docking board by a vacuum system.6. The probe card of claim 1 , wherein the contact pad interface comprises:a substrate with a front side and a back side, the back side being opposite from the front, wherein the front side contacts are on the front side, and the back side contacts are on the back side;through substrate vias (TSVs) penetrating through the substrate and electrically coupling the front side contacts to respective back side contacts; andinterconnect structures on at least one of the front side and the back side electrically disposed between the ...

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Номер записи: 11
26-12-2013 дата публикации

Wafer Level Integrated Circuit Contactor and Method of Construction

Номер: US20130342233A1
Автор: Edwards Jathan, Halvorson Brian, Marks Charles
Принадлежит:

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crows () are maintained relatively coplanar by the engagement of at least one flang (-) against an up-stop surface of plate , thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainer by establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner. 1. A test contact pin assembly for temporary contact with a test pad on a wafer level integrated circuit device under test (DUT) comprising:a. at least one slideable upper terminal pin, further having, a top extension for contacting the DUT, portion, at least one lateral cross member flange and a contact surface; said upper pin being slideable between an out of test position and an in-test position;b. at least one lower terminal pin having a foot and a like contact surface;c. said upper and lower pins being held in contact by bias forces which maintain their respective contacts surfaces together but in a slideable relationship to each other;d. an elastomeric material of predetermined height when in an uncompressed state, said material surrounding the pins to create said bias force;e. a substantially rigid top pin guide surface located atop said elastomeric material, including a pair of spaced part parallel walls defining a guide channel for said flange, an upper wall between said parallel walls defining an up-stop surface for said pin and an aperture in said up-stop surface for receiving an extended portion of said upper pin which protrudes beyond said guide surface to make contact with said DUT, said channel being sized to be large ...

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Номер записи: 12
30-01-2014 дата публикации

PROBE CARD AND TESTING APPARATUS

Номер: US20140028341A1
Автор: KIKUCHI YOSHINORI, KUDO TOSHIYUKI, MIKUNI Katsushi, ONUMA Yoshihito
Принадлежит:

Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder. 1. A probe card comprising:a plurality of probes that come into contact with a plurality of electrodes of a device under test;a probe board that includes the plurality of probes provided thereon;a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon;a connector that includes a connection pin and a holder, the connection pin electrically connecting a line of the probe board and a line of the wiring board, and the holder holding the connection pin between the probe board and the wiring board; anda first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space, the mounting space being formed by a through hole or a recess provided in the holder.2. The probe card according to claim 1 , wherein the first electronic part is a relay switch that interrupts power supply to the device under test.3. The probe card according to claim 1 , wherein a second electronic part is mounted at a position facing the first electronic part on a wiring board side surface of the probe board.4. The probe card according to claim 3 , ...

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Номер записи: 13
06-02-2014 дата публикации

Method for fabricating a through wire interconnect (twi) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer

Номер: US20140038406A1
Автор: Alan G. Wood, David R Hembree
Принадлежит: Micron Technology Inc

A method for fabricating a through wire interconnect for a semiconductor substrate having a substrate contact includes the steps of: forming a via through the semiconductor substrate from a first side to a second side thereof; placing a wire in the via having a first end with a bonded connection to the substrate contact and a second end proximate to the second side; forming a first contact on the wire proximate to the first side; forming a second contact on the second end of the wire; and forming a polymer layer on the first side at least partially encapsulating the wire while leaving the first contact exposed.

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Номер записи: 14
27-02-2014 дата публикации

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

Номер: US20140055157A1
Автор: Higashi Mitsutoshi, Sakaguchi Hiedeaki, Shiraishi Akinori
Принадлежит: SHINKO ELECTRIC INDUSTRIES CO., LTD.

A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. 1. A probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject , the probe card comprising:a substrate body including a first surface, which is located to face toward the test subject, and a second surface, which is opposite to the first surface; a through electrode extending through the substrate body between the first surface and the second surface;an elastic body filled in an accommodating portion formed, in the substrate body, extending from the first surface toward the second surface, wherein the contact bump is formed on the elastic body;a support body arranged, in the elastic body, extending from the first surface toward the second surface of the substrate body; anda contact bump formed in correspondence with the electrode pad, connected to an end of the support body, and electrically connected to the through electrode.2. The probe card according to claim 1 , wherein the accommodating portion is a through hole extending through the substrate body between the first surface and the second surface.3. The probe card according to claim 1 , wherein the support body extends through the elastic body and serves as the through electrode.4. The probe card according to claim 1 , wherein the probe card electrically connects the electrode pad of the test subject to a ...

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Номер записи: 15
20-03-2014 дата публикации

TEST AND CONNECTION APPARATUS ARRANGEMENT, AND CONNECTION APPARATUS

Номер: US20140077832A1
Автор: Hackemack Frank, Jaschke Bernhard, Richts Joerg
Принадлежит:

A testing arrangement is provided for testing the electrical circuits of an assembly of terminal blocks arranged in side-to-side relation, each of the terminal blocks including two mutually-insulated collinearly-arranged horizontal bus bar sections that are normally electrically connected by first and second pairs of leaf spring contacts arranged above and below the bus bar sections, respectively. During the testing operation, the testing device may be arranged either above or below the assembly, and an insulating test plug on the testing device is inserted either vertically downwardly from above, or upwardly from below, the terminal block, thereby to disengage one pair of contacts. A dummy plug is vertically inserted in the opposite direction to disengage the other pair of contacts. The remote ends of the bus bar sections are provided with clamping devices for connection with the bare ends of insulated conductors, respectively. 1. (canceled)2. (Canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. (canceled)9. (canceled)10. (canceled)11. (canceled)12. (canceled)13. (canceled)1432. A testing arrangement for testing the electrical circuits of a terminal block assembly () by means of a testing device () , comprising:{'b': '300', 'claim-text': [{'b': 6', '8, '(1) a pair of horizontal bus bar sections (, ) arranged in collinear longitudinally-spaced mutually-insulated relation in a chamber contained in said terminal block body;'}, {'b': 5', '7', '9', '10, '(2) a pair of conductor clamping devices (, ) connected with the remote ends of said bus bar sections, respectively, said clamping devices being operable to connect the bare ends of insulated conductors with said bus bar sections, respectively, said terminal block body upper wall containing access openings (, ) arranged above said clamping devices, respectively;'}, {'b': 15', '16', '15', '16', '19, 'i': b,', 'b', 'a,', 'a', 'a, '(3) an upper first pair of leaf spring electrical contacts () ...

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Номер записи: 16
01-01-2015 дата публикации

SPACE TRANSFORMER AND PROBE CARD

Номер: US20150002180A1
Автор: Endo Naoki, Kaneda Noriyoshi, Miyaji Shinya
Принадлежит: NHK SPRING CO., LTD.

A space transformer includes: a ceramic substrate that contains enstatite and boron nitride as components; a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction; conductive material provided inside the through hole; and a wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface. 1. A space transformer comprising:a ceramic substrate that contains enstatite and boron nitride as components;a through hole running through in a thickness direction with respect to a sintered body in which the boron nitride is oriented in one direction;conductive material provided inside the through hole; anda wiring pattern including a plurality of electrodes provided on each of two principal surfaces, wherein a wiring pitch in the wiring pattern on one principal surface is different from a wiring pitch in the wiring pattern on the other principal surface.2. The space transformer according to claim 1 , further comprising a thin film of polyimide stacked and firmly fixed on at least one principal surface of the ceramic substrate claim 1 , andwherein the wiring pattern is provided inside or on a surface of the thin film.3. The space transformer according to claim 1 , wherein the ceramic substrate has an orientation index K=|log{(I/I)///(I/I)⊥}| equal to or higher than 0.8 that is calculated based on a ratio (I/I)// between intensity of X-ray diffraction Ialong a (002) plane of a crystal of the boron nitride and intensity of X-ray diffraction Ialong a (100) plane thereof when irradiated with an X-ray in the orientation direction of the boron nitride and a ratio (I/I)⊥ between the intensity of X-ray diffraction Ialong the (002) plane and the intensity of X-ray diffraction Ialong the (100) plane when irradiated with ...

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Номер записи: 17
05-01-2017 дата публикации

BALUNLESS TEST FIXTURE

Номер: US20170003317A1
Автор: GEORGE Ian Robert, Hammond, JR. Bernard Harold, White Gordon John
Принадлежит:

A test fixture and method of its use are disclosed. The test fixture includes a test fixture frame including a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis, and a second test fixture mount having a second test head mounted thereon that is slidable along a second axis perpendicular to the first axis. The test fixture further includes a first test plate holder mounted to the first test head and including a clamping mechanism, as well as a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism and including a plurality of radially-disposed probe receptacles. The test fixture includes a plurality of probe assemblies received in corresponding probe receptacles, each including a probe extending at least partially through the probe mounting plate, each electrically connecting to a design under test. 1. A test fixture for electrical equipment , the test fixture comprising: a first test fixture mount having a first test head mounted thereon, the first test head slidable along a first axis; and', 'a second test fixture mount having a second test head mounted thereon, the second test head slidable along a second axis perpendicular to the first axis;, 'a test fixture frame includinga first test plate holder mounted to the first test head, the first test plate holder including a clamping mechanism;a probe mounting plate mounted to the first test plate holder and retained by the clamping mechanism, the probe mounting plate including a plurality of radially-disposed probe receptacles;a plurality of probe assemblies received in corresponding probe receptacles, each of the probe assemblies including a probe extending at least partially through the probe mounting plate, each probe electrically connecting to a design under test.2. The test fixture of claim 1 , further comprising:a second test plate holder mounted to the second test head, the second test plate holder ...

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Номер записи: 18
02-01-2020 дата публикации

DIAGNOSTIC METHOD FOR INSPECTION DEVICE AND INSPECTION SYSTEM

Номер: US20200003860A1
Автор: Ueda Masanori
Принадлежит:

An inspection device includes a stage for mounting thereon a substrate, an attachment part to which a probe card that brings probes into contact with devices formed on the substrate is attached, a tester for applying electrical signals to the devices through the probe card to inspect electrical characteristics of the devices, and a connection member having multiple connectors to electrically connect the multiple connectors with the tester and the probe card while being disposed between the tester and the probe card. A diagnostic method for the inspection device performing a self-diagnosis of the multiple connectors includes attaching a diagnosis substrate instead of the probe card, performing a stabilization process for stabilizing a contact between the diagnosis substrate and the connectors of the connection member after the diagnosis substrate is attached, and diagnosing the connectors after the stabilization process. 1. A diagnostic method for an inspection device , wherein the inspection device includes a stage for mounting thereon a substrate , an attachment part , to which a probe card that brings probes of the probe card into contact with devices formed on the substrate is attached , a tester for applying electrical signals to the devices formed on the substrate through the probe card attached to the attachment part to inspect electrical characteristics of the devices , and a connection member having multiple connectors to electrically connect the multiple connectors with the tester and the probe card while being disposed between the tester and the probe card , the diagnostic method for the inspection device performing a self-diagnosis of the multiple connectors , comprising:attaching a diagnosis substrate instead of the probe card;performing a stabilization process for stabilizing a contact between the diagnosis substrate and the multiple connectors of the connection member after the diagnosis substrate is attached; anddiagnosing the multiple connectors ...

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Номер записи: 19
08-01-2015 дата публикации

ELECTRIC CONNECTING APPARATUS

Номер: US20150008945A1
Автор: ARAI Osamu, Inoue Tatsuo, KIYOFUJI Hidehiro, SASAKI Kenji
Принадлежит:

An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads. 1. An electric connecting apparatus having a working table holding on a working surface thereof a device under test having a plurality of electrodes and heating or cooling the device under test and electrically connecting the plurality of electrodes to a tester , comprising:a probe card having a probe board provided with a first surface thereof opposed to the tester and having formed therein a conductive path to be electrically connected to the tester and a plurality of probes provided on a second surface of the probe board to be connected to the conductive path so as to enable to respectively contact the plurality of electrodes of the device under test on the working table and moving relatively to the working table; andone or a plurality of elastic heat conducting member(s) arranged between the working surface of the working table or the device under test on the working surface and the probe board,wherein the elastic heat conducting member enables to abut on the working surface of the working table or the device under test on the working surface and the probe board in a state in which the plurality of probes do not abut on the plurality of respective corresponding electrodes and is elastically deformable not to ...

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Номер записи: 20
12-01-2017 дата публикации

PROBE CARD, THERMAL INSULATION COVER ASSEMBLY FOR PROBE CARD, AND SEMICONDUCTOR DEVICE TEST APPARATUS INCLUDING THE SAME

Номер: US20170010306A1
Автор: KIM Min-Gu, NA Young-Mi
Принадлежит:

A probe card includes a circuit substrate to transmit an electrical signal for testing a semiconductor device, a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes, and a thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space. 1. A probe card , comprising:a circuit substrate to transmit an electrical signal for testing a semiconductor device;a probe block on a lower surface of the circuit substrate, the probe block having a plurality of probes; anda thermal insulation cover assembly on an upper surface of the circuit substrate, the thermal insulation cover assembly covering at least a portion of the circuit substrate and defining a heat receiving space, the thermal insulation cover assembly retaining heat applied to the circuit substrate within the heat receiving space.2. The probe card as claimed in claim 1 , wherein the thermal insulation cover assembly includes:an inner cover having a dome shape to cover at least the portion of the upper surface of the circuit substrate; andan outer cover spaced apart from the inner cover, a thermal insulating space being defined between the inner and outer covers.3. The probe card as claimed in claim 2 , further comprising a connection portion connecting a lower portion of the inner cover and a lower portion of the outer cover to each other.4. (canceled)5. The probe card as claimed in claim 2 , wherein the thermal cover assembly further comprises a flange fixing a lower portion of the inner cover and a lower portion of the outer cover to the upper surface of the circuit substrate.6. The probe card as claimed in claim 5 , wherein the flange includes a plurality of recesses in a lower surface of the flange claim 5 ...

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Номер записи: 21
10-01-2019 дата публикации

METHOD FOR PRODUCING PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS

Номер: US20190011484A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. 1. A method , comprising:inserting a probe body made electrically conductive materials in an opening of a support such that an end of the probe body is exposed from said opening;polishing the exposed end of the probe body;depositing an electrically conductive contact region having a first hardness value equal to or greater than 300 HV to the polished exposed end of the probe body.2. The method of claim 1 , wherein depositing comprises forming a conductive layer directly on said polished exposed end of the probe body.3. The method of claim 2 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 2 , manganese claim 2 , palladium claim 2 , cobalt claim 2 , rhodium claim 2 , iron claim 2 , molybdenum claim 2 , iridium claim 2 , ruthenium claim 2 , tungsten claim 2 , rhenium and alloys thereof.4. The method of claim 1 , wherein depositing comprises:forming at least one support conductive layer directly on said polished exposed end of the probe body; andforming a conductive layer directly on said at least one support conductive layer.5. The method of claim 4 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 4 , manganese claim 4 , palladium claim 4 , cobalt claim 4 , rhodium claim 4 , iron claim 4 , molybdenum claim 4 , iridium claim ...

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Номер записи: 22
10-01-2019 дата публикации

Modular rail systems, rail systems, mechanisms, and equipment for devices under test

Номер: US20190011498A1
Автор: Bryan J. Root, John L. Dunklee, William A. Funk
Принадлежит: Celadon Systems Inc

The systems, apparatuses, and methods herein can provide a multi-site positioning mechanism suitable for long-term testing of a device(s) under test (DUT) (e.g. semiconductor wafers) across a range of temperatures with or without a controlled environment. The systems, apparatuses, and methods herein include mounting components, mechanisms, and structures that can provide excellent mechanical stability, permit relatively close working distance optics with high resolution, enable fine positioning at elevated temperature in a controlled environment with minimal thermal perturbation. The systems, apparatuses, and methods herein can be provided with modularity, for example as modular with rails and test sites that can be easily added or removed, and that can permit access to probe modules in a densely packed array.

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Номер записи: 23
09-01-2020 дата публикации

PROBE HEAD WITH LINEAR PROBE

Номер: US20200011898A1
Автор: Chen Tzu Yang, Wei Chia Ju
Принадлежит: MPI corporation

A probe head includes a linear probe which is flattened at at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape. 1. A probe head comprising:a linear probe comprising a tail portion, a body portion and a head portion extending along a longitudinal axis in order, at least one of the tail portion, the body portion and the head portion being flattened and thereby defined with a first width axis perpendicular to the longitudinal axis and a second width axis perpendicular to the longitudinal axis and the first width axis, each of the tail portion, the body portion and the head portion being defined with a first width along the first width axis and a second width along the second width axis, the first width and the second width of the body portion being respectively larger than and smaller than the first width and the second width of at least one of the tail portion and the head portion;a lower die unit having a lower installation hole, the head portion of the linear probe being inserted through the lower installation hole, the lower installation hole being defined with a first central axis; andan upper die unit having an upper installation hole, the tail portion of the linear probe being inserted through the upper installation hole, the upper installation hole being defined with a ...

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Номер записи: 24
09-01-2020 дата публикации

INSPECTION SYSTEM

Номер: US20200011925A1
Автор: KAGAMI Tetsuya
Принадлежит:

An inspection system includes a plurality of prober units each configured to bring probes of a probe card into contact with devices formed on a substrate on a stage, and a tester configured to apply electrical signals to the devices on the substrate through the probe card to inspect electrical characteristics of the devices. The plurality of prober units are arranged such that a plurality of units each of which has the prober units stacked in multiple stages are arranged in multiple rows in a horizontal direction, and at least one test unit constituting a main part of the tester is arranged to a side of a predetermined prober unit among the plurality of prober units. 1. An inspection system comprising:a plurality of prober units, each configured to bring probes of a probe card into contact with devices formed on a substrate on a stage; anda tester configured to apply electrical signals to the devices on the substrate through the probe card to inspect electrical characteristics of the devices,wherein multiple units, each of which includes the prober units stacked in multiple stages, are arranged in multiple rows in a horizontal direction, andat least one test unit constituting a main part of the tester is disposed at a side of a predetermined prober unit among the prober units.2. The inspection system of claim 1 , wherein the test unit is disposed between adjacent prober units in the horizontal direction among the prober units.3. The inspection system of claim 1 , wherein the tester includes one or more tester module boards claim 1 , each of which is configured to apply electrical signals to the devices formed on the substrate to measure electrical characteristics of the devices claim 1 , and one or more tester motherboards claim 1 , each of which serves as an interface between the probe card and one of the tester module boards connected thereto claim 1 ,the test unit includes the tester module boards, and a controller and a power supply for the tester module boards, ...

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Номер записи: 25
15-01-2015 дата публикации

Probe module supporting loopback test

Номер: US20150015290A1
Автор: Chan Hung Huang, Hsin Hsiang Liu, Jun-Liang Lai, Kuang Chung Chou, Wei Chen, Wei-Cheng Ku
Принадлежит: MPI Corp

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.

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Номер записи: 26
15-01-2015 дата публикации

CANTILEVER PROBE CARD FOR HIGH-FREQUENCY SIGNAL TRANSMISSION

Номер: US20150015291A1
Автор: HO CHIH-HAO, HUANG Chun-Chung, Hung Jing-Zhi, Ku Wei-Cheng, LAI JUN-LIANG, Wu Yung Nan
Принадлежит: MPI corporation

A cantilever probe card, which is provided between a device under test (DUT) and a tester, includes a carrier board, a probe base, two probes, and a transmission device. The carrier board is provided with through holes. The probe base is provided on the carrier board, and the probes are mounted to the probe base. Each probe has a tip to contact a test pad of the DUT. The transmission device is flexible, and has signal circuits. The transmission device passes through the through hole on the carrier board, and the signal circuits connect the probes to the tester respectively. 1. A cantilever probe card , which is provided between a device under test (DUT) and a tester , comprising:a carrier board having a first side and a second side, wherein the first side faces the tester, and the second side faces the DUT;a probe base provided on the second side of the carrier board, wherein the probe base is insulating;two probes each having a tip and a cantilever, wherein the probes are conductive; the cantilever is connected to the tip; and the tip contacts a test pad of the DUT; anda transmission device provided on the carrier board and electrically connected to the cantilevers of the probes respectively, wherein the transmission device is flexible, and has signal circuits; each of the signal circuits transmits test signals between one of the probes and the tester.2. The cantilever probe card of claim 1 , wherein the transmission device has a flexible printed circuit board claim 1 , on which the signal circuits are provided.3. The cantilever probe card of claim 1 , wherein the transmission device has a plurality of coaxial cables claim 1 , and cores of the coaxial cables are the signal circuits.4. The cantilever probe card of claim 1 , wherein the carrier board is provided with a through hole claim 1 , through which the transmission device is provided claim 1 , so that the transmission device has an end extending out from the first side of the carrier board to have the signal ...

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Номер записи: 27
03-02-2022 дата публикации

Connecting device for inspection

Номер: US20220034821A1
Автор: Minoru Sato
Принадлежит: Micronics Japan Co Ltd

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

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Номер записи: 28
03-02-2022 дата публикации

MEASURING SYSTEM AND METHOD

Номер: US20220034941A1
Автор: Bresser Gerd, Reich Friedrich
Принадлежит:

A measuring system for measuring signals with multiple measurement probes comprises a multi probe measurement device comprising at least two probe interfaces that each couple the multi probe measurement device with at least one of the measurement probes, a data interface that couples the multi probe measurement device to a measurement data receiver, and a processing unit coupled to the at least two probe interfaces that records measurement, values via the at least two probe interfaces from the measurement probes, wherein the processing unit is further coupled to the data interface and provides the recorded measurement values to the measurement data receiver, and a measurement data receiver comprising a data interface, wherein the data interface of the measurement data receiver is coupled to the data interface of the multi probe measurement device. 120-. (cancelled)21. A measuring system for measuring signals with multiple measurement probes , the measuring system comprising:a measurement data receiver comprising analog input channels for recording measured analog signals of a device under test,multiple measurement probes which are configured to measure signals of the external device under test, which are different to the analog signals, at least two probe interfaces which are connectable or connected to corresponding ones of the measurement probes and which are configured to receive the measured signals,', 'a processing unit coupled to the at least two probe interfaces and configured to record measurement values contained in the measured signals, wherein the processing unit is further coupled to the first data interface and is further configured to provide the recorded measurement values to the measurement data receiver, and, 'a multi probe measurement device coupled to the measurement data receiver and comprisingwherein the multi probe measurement device in combination with the measurement data receiver are arranged and configured such to perform a timely aligned ...

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Номер записи: 29
03-02-2022 дата публикации

MULTI-PROBER CHUCK ASSEMBLY AND CHANNEL

Номер: US20220034960A1
Автор: Lee Kwang Hee, Lee Seung Joon, NAM Kyung Tae
Принадлежит:

A multi-prober chuck assembly and channel are provided. The multi-prober chuck assembly, according to one embodiment of the present invention, comprises: a chuck for supporting a wafer; a probe card structure coupled to the top part of the chuck; a heater for heating the chuck under the chuck; a conductive guard plate spaced apart from the heater below the heater; and a body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part, wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure. 1. A multi-prober chuck assembly , comprising:a chuck for supporting a wafer;a probe card structure coupled to the top part of the chuck;a heater for heating the chuck under the chuck;a conductive guard plate spaced apart from the heater below the heater; anda body part positioned under the chuck so that the heater and the guard plate are positioned inside the body part,wherein the probe card structure and the body part are coupled mechanically to form a cartridge-type structure.2. The chuck assembly of claim 1 , further comprising an insulating member disposed between the heater and the chuck.3. The chuck assembly of claim 1 , further comprising a thermal insulating member disposed between the lower portion of the heater and the conductive guard plate.4. The chuck assembly of claim 1 , wherein the heater is shielded by a conductive metal plate and connected to an AC power.5. The chuck assembly of claim 1 , wherein the conductive guard plate is formed in two or more claim 1 , and the two or more conductive guard plates are disposed spaced apart side by side from each other claim 1 , and the chuck and the conductive guard plate are electrically separated and spaced apart by an insulating non-conductor.6. The chuck assembly of claim 1 , wherein the probe card structure comprises a substrate; a probe formed on the substrate and disposed to face the wafer on the chuck; and a ...

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Номер записи: 30
21-01-2016 дата публикации

PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF

Номер: US20160018439A1
Автор: HO CHIH-HAO, Ku Wei-Cheng, LAI JUN-LIANG, Wei Hao
Принадлежит: MPI corporation

A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end.

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Номер записи: 31
17-01-2019 дата публикации

PROBER

Номер: US20190019711A1
Автор: Tamura Hiroo
Принадлежит:

Abbe error that needs to be considered in high accuracy positioning of a device to be maintained, is suppressed. A prober includes: a plurality of measurement sections arranged between a conveyance area and a maintenance area, each of the measurement sections having a device to be maintained which is used for inspection of a semiconductor element formed on a wafer, and a draw-out mechanism configured to draw out the device to be maintained to a side of the maintenance area; a conveyance unit configured to convey an object to be conveyed to a destination measurement section; and a loading part configured to load the object to be conveyed from the side of the maintenance area to the measurement section. The object to be conveyed is loadable into the measurement section from a conveyance area side and the maintenance area side. 1. A prober comprising:a plurality of measurement sections arranged between a conveyance area and a maintenance area, each of the measurement sections having a device to be maintained which is used for inspection of a semiconductor element formed on a wafer, and a draw-out mechanism configured to draw out the device to be maintained to a side of the maintenance area;a conveyance unit configured to convey an object to be conveyed to a measurement section being a conveyance destination; anda loading part configured to load the object to be conveyed from the side of the maintenance area to the measurement section, whereinthe plurality of measurement sections are configured such that the object to be conveyed is loadable from a side of the conveyance area and the side of the maintenance area.2. The prober according to claim 1 , whereinthe conveyance unit loads the object to be conveyed into the measurement section if the object to be conveyed is used for inspection of the semiconductor element, andthe loading part loads the object to be conveyed into the measurement section if the object to be conveyed is used for calibration of a position of the ...

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Номер записи: 32
10-02-2022 дата публикации

CONTROL METHOD OF INSPECTION APPARATUS AND INSPECTION APPARATUS

Номер: US20220043055A1
Автор: Akiyama Naoki, NAKAYAMA Hiroyuki
Принадлежит:

A control method of an inspection apparatus including a mounting stage on which a substrate having a plurality of inspection objects is mounted, a plurality of sections being formed with respect to the mounting stage and a heater controllable to heat for each of the sections includes when inspecting a first inspection object to be inspected among the plurality of inspection objects, causing the heater to heat a section corresponding to the first inspection object and a section corresponding to a second inspection object to be inspected next. 1. A control method of an inspection apparatus includinga mounting stage on which a substrate having a plurality of inspection objects is mounted, a plurality of sections being formed with respect to the mounting stage anda heater controllable to heat for each of the sections,wherein the control method comprises:when inspecting a first inspection object to be inspected among the plurality of inspection objects, causing the heater to heat a section corresponding to the first inspection object and a section corresponding to a second inspection object to be inspected next.2. The control method of the inspection apparatus according to claim 1 , wherein the second inspection object is arranged next to the first inspection object on the substrate.3. The control method of the inspection apparatus according to claim 1 ,wherein the inspection apparatus includes a temperature sensor configured to detect a temperature of an inspection object, andwherein when heating a section corresponding to the inspection object, the heater is controlled so that the temperature of the inspection object becomes a target temperature based on the temperature of the inspection object detected by the temperature sensor.4. The control method of the inspection apparatus according to claim 3 , further comprising:upon an elapse of a threshold time after the temperature of the inspection object has stabilized at the target temperature, determining that ...

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Номер записи: 33
29-01-2015 дата публикации

HIGH FREQUENCY PROBE CARD FOR PROBING PHOTOELECTRIC DEVICE

Номер: US20150028911A1
Автор: Chang Chia-Tai, YANG Hui-Pin
Принадлежит:

A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission. 1. A high frequency probe card for probing a photoelectric device , the high frequency probe card comprising:a substrate having a first opening for light transmission, and at least one first through hole;an interposing plate disposed on the substrate and provided with a second opening communicated with the first opening for light transmission, and at least one second through hole communicated with the at least one first through hole;a circuit board having a top surface, a bottom surface disposed on the interposing plate, at least one ground pad and at least one signal pad arranged on the top surface, a third opening penetrating through the top and bottom surfaces and being communicated with the second opening for light transmission, and at least one third through hole penetrating through the top and bottom surfaces and being communicated with the at least one second through hole; anda probe module mounted to the substrate and provided with at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure, the signal transmitting structure and the grounding ...

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Номер записи: 34
31-01-2019 дата публикации

Probe Card System for Testing an Integrated Circuit

Номер: US20190033343A1
Автор: Alexander N. Pronin, Joseph A. Peters, Vladimir V. Genkin
Принадлежит: Keithley Instruments LLC

A system for testing an integrated-circuit wafer, the system including a probe card having a probe needle and a probe body enclosing a pressure chamber. The probe body includes a unitary sidewall, a first end cap substantially closing a first end of the probe body, except for an outlet passage in the first end cap, and an inlet passage configured to introduce compressed gas into the pressure chamber. The probe needle is within the pressure chamber and is supported by the probe body. A free end of the probe needle extends through the outlet passage. The ends of the probe needle are separated by a first bend in the probe needle, which has a center of curvature that is located between the probe needle and a longitudinal centerline of the unitary sidewall. Methods of using a probe card are also disclosed.

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Номер записи: 35
30-01-2020 дата публикации

PROBE HOLDER AND PROBE UNIT

Номер: US20200033380A1
Автор: Sakaguchi Tsukasa, Souma Kazuya
Принадлежит: NHK SPRING CO., LTD.

A probe holder holds contact probes each of which comes in contact with one electrode of a contact target on one end portion side in a longitudinal direction. The probe holder includes a plate in which holder holes configured to hold the respective contact probes are formed and penetrate the probe holder. Each of the holder holes includes a first hole portion disposed on one end of a penetrating direction and extending in the penetrating direction, a large diameter portion connected to the first hole portion and extending in the penetrating direction, the large diameter portion being larger than a diameter of the first hole portion, and a second hole portion disposed on another end of the penetrating direction, connected to the large diameter portion, and extending in the penetrating direction, the second hole portion being smaller than a diameter of the large diameter portion. 1. A probe holder for holding contact probes each of which comes in contact with one electrode of a contact target on one end portion side in a longitudinal direction , the probe holder comprisinga plate in which holder holes configured to hold the respective contact probes are formed and penetrate the probe holder, wherein a first hole portion disposed on one end of a penetrating direction and extending in the penetrating direction,', 'a large diameter portion connected to the first hole portion and extending in the penetrating direction, the large diameter portion being larger than a diameter of the first hole portion, and', 'a second hole portion disposed on another end of the penetrating direction, connected to the large diameter portion, and extending in the penetrating direction, the second hole portion being smaller than a diameter of the large diameter portion., 'each of the holder holes includes'}2. The probe holder according to claim 1 , wherein D=Dand 0.50≤D/D≤0.95 are satisfied where Dis a diameter of the first hole portion claim 1 , Dis a diameter of the large diameter portion ...

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Номер записи: 36
30-01-2020 дата публикации

Integrated circuit device structures and double-sided fabrication techniques

Номер: US20200035560A1
Автор: Bruce Block, Doug Ingerly, Kevin O'Brien, Kimin Jun, Patrick Morrow, Rishabh Mehandru, Szyua S. LIAO, Valluri R. Rao
Принадлежит: Intel Corp

Integrated circuit cell architectures including both front-side and back-side structures. One or more of back-side implant, semiconductor deposition, dielectric deposition, metallization, film patterning, and wafer-level layer transfer is integrated with front-side processing. Such double-side processing may entail revealing a back side of structures fabricated from the front-side of a substrate. Host-donor substrate assemblies may be built-up to support and protect front-side structures during back-side processing. Front-side devices, such as FETs, may be modified and/or interconnected during back-side processing. Back-side devices, such as FETs, may be integrated with front-side devices to expand device functionality, improve performance, or increase device density.

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Номер записи: 37
09-02-2017 дата публикации

PROBE COVER

Номер: US20170038412A1
Автор: MIKI Katsuo, MIYASHITA Yoshiji, NAGATA Takahiro, OOKAWARA Kazumi, SAMATA Isao
Принадлежит: YOKOWO CO., LTD.

A probe cover which is to be attached to a socket that is configured to support a plurality of contact probes, includes: a base; two positioning pins which are disposed on the base; and at least one supporting member which is disposed on the base. The two positioning pins and the supporting member are capable of positioning the base in a state where the base is separated from the socket by a predetermined distance, and a mutual separation distance between the two positioning pins is changeable. 1. A probe cover which is to be attached to a socket that is configured to support a plurality of contact probes , the prove cover comprising:a base;two positioning pins which are disposed on the base; andat least one supporting member which is disposed on the base, whereinthe two positioning pins and the supporting member are capable of positioning the base in a state where the base is separated from the socket by a predetermined distance, anda mutual separation distance between the two positioning pins is changeable.2. The probe cover according to claim 1 , wherein the mutual separation distance is selectable from continuous values.3. The probe cover according to claim 1 , wherein the base includes guiding portions which are configured to slidably support the two positioning pins claim 1 , respectively.4. The probe cover according to claim 3 , wherein both the guide portions are disposed on a same linear line.5. The probe cover according to claim 3 , further comprising: a locking unit which is configured to lock one of the two positioning pins at an arbitrary sliding position.6. The probe cover according to claim 1 , wherein the base has a plurality of mounting holes claim 1 , and the supporting member is attachable to an arbitral one of the mounting holes.7. The probe cover according to claim 1 , wherein two supporting members are included claim 1 , and the two supporting members are placeable respectively on both sides of a linear line passing through the two positioning ...

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Номер записи: 38
24-02-2022 дата публикации

SENSOR DEVICE, WATER AMOUNT MEASUREMENT DEVICE, WATER AMOUNT MEASUREMENT METHOD, INFORMATION PROCESSING DEVICE, AND INFORMATION PROCESSING METHOD

Номер: US20220057435A1
Автор: HIROI Toshiyuki, IIDA Sachio, Kobayashi Seiji, Mita Hiroyuki, Yamada Atsushi, YOSHIMITSU Kyohei
Принадлежит:

A sensor device according to an embodiment of the present technology includes a sensor head and a measurement unit. The sensor head includes a first probe and a second probe, the first probe including a first antenna section used for transmission, the second probe including a second antenna section used for reception, the second probe being situated at a specified distance from the first probe and facing the first probe. The measurement unit includes a signal generator that generates a measurement signal that includes information regarding characteristics of a propagation of an electromagnetic wave in a medium between the first and second antenna sections. 1. A moisture sensing device , comprising:a first arm;a second arm;a coupling portion disposed between the first arm and the second arm, wherein the coupling portion maintains a distance between the first arm and the second arm;first wiring layers that are provided in the first arm, wherein the first wiring layers include a first stripline or a first microstripline including a first surface layer and a first internal layer;second wiring layers that are provided in the second arm, wherein the second wiring layers include a second stripline or a second microstripline including a second surface layer and a second internal layer;a first electromagnetic wave absorption layer covering a part of the first wiring layers;a second electromagnetic wave absorption layer covering a part of the second wiring layers;a transmitting antenna section including a part of the first wiring layers;a reception antenna section including a part of the second wiring layers; anda measurement unit, wherein the measurement unit generates a measurement signal regarding the characteristics of a propagation of an electromagnetic wave between the transmission antenna section and the reception antenna section,wherein the transmitting antenna section and the reception antenna section face each other.2. The moisture sensing device according to claim ...

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Номер записи: 39
06-02-2020 дата публикации

CLEANING METHODS FOR PROBE CARDS

Номер: US20200041552A1
Автор: LAI Chih-Chiang
Принадлежит:

A testing system for testing a device under test including a plurality of circuits under test includes a probe card, testing apparatus, and a controller. The probe card includes a plurality of probes temporarily coupled to the circuits under test. The testing apparatus holds the probe card and tests the circuits under test through tine probe card. The controller controls the testing apparatus and executes a testing procedure that includes: measuring the contact resistance values between the probe card and each of the circuits under test; determining a statistical value of the contact resistance values; determining whether the statistical value exceeds a first threshold; when the statistical value does not exceed the first threshold, setting a clean flag to be in a first state; otherwise, setting the clean flag to be in a second state; and performing a clean operation on the probes according to the clean flag. 1. A testing system for testing a device under test , wherein the device under test comprises a plurality of circuits under test , comprising:a probe card, comprising a plurality of probes, wherein the probes are configured to be temporarily coupled to the circuits under test;testing equipment, holding the probe card and testing the circuits under test through the probe card; and measuring contact resistance values between the probe card and each of the circuits under test;', 'determining a statistical value of the contact resistance values;', 'determining whether the statistical value exceeds a first threshold;', 'when the statistical value does not exceed the first threshold, setting a cleaning flag to be in a first state;', 'when the statistical value exceeds the first threshold, setting the cleaning flag to be in a second state; and', 'performing a cleaning operation on the probes according to the cleaning flag., 'a controller, controlling the testing equipment and executing a testing method, wherein the testing method comprises2. The testing system of ...

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Номер записи: 40
18-02-2021 дата публикации

PROBER AND PROBE CARD PRECOOLING METHOD

Номер: US20210048475A1
Автор: FUJIHARA Jun
Принадлежит:

A prober includes a plurality of inspection chambers, each of the plurality of inspection chambers including: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a wafer on the chuck top; a seal mechanism configured to form a sealed space between the probe card holder and the chuck top; a temperature adjustor configured to adjust a temperature of the chuck top; and a gas supplier configured to supply a dry gas to the sealed space, and wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor. 1. A prober comprising a plurality of inspection chambers , each of the plurality of inspection chambers comprising:a probe card having a plurality of probes;a probe card holder configured to hold the probe card;a chuck top configured to place a wafer on the chuck top;a seal mechanism configured to form a sealed space between the probe card holder and the chuck top;a temperature adjustor configured to adjust a temperature of the chuck top; anda gas supplier configured to supply a dry gas to the sealed space,wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor.2. The prober of claim 1 , wherein at least one of the probe card and the chuck top includes a gap adjustor configured to maintain a gap between the probe card and the chuck top to be constant claim 1 , andwherein, after the sealed space is purged with the dry gas in a state in which the probe card and the chuck top are not in contact with each other via the gap adjustor, the chuck top is raised toward the probe card, and the precooling is performed in a state in which the ...

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Номер записи: 41
18-02-2016 дата публикации

Probe card and test equipment with the same

Номер: US20160047843A1
Автор: Chia-Tai Chang, Hsiu-Wei Lin, HUNG-YI LIN
Принадлежит: MPI Corp

A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.

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Номер записи: 42
03-03-2022 дата публикации

PROBE POSITION MONITORING STRUCTURE AND METHOD OF MONITORING POSITION OF PROBE

Номер: US20220065925A1
Автор: Torii Yasunobu
Принадлежит:

A probe position monitoring structure includes a first common line and a contact portion configured for being directly contacted with a probe. The contact portion includes a first zigzag structure, and a first end of the first zigzag structure is directly connected with the first common line. A method of monitoring a position of a probe includes the following steps. The probe position monitoring structure is provided. The first zigzag structure is directly contacted with a first probe. A resistance measurement is performed to measure a resistance of a portion of the first zigzag structure located between the first probe and the first end for monitoring a position of the first probe. 1. A probe position monitoring structure , comprising:a first common line; anda contact portion configured for being directly contacted with a probe, wherein the contact portion comprises a first zigzag structure, and a first end of the first zigzag structure is directly connected with the first common line.2. The probe position monitoring structure according to claim 1 , wherein the first zigzag structure comprises:first sections, wherein each of the first sections is elongated in a first direction; andsecond sections, wherein each of the second sections is elongated in a second direction different from the first direction and directly connected with two of the first sections located adjacent to each other.3. The probe position monitoring structure according to claim 2 , wherein a width of each of the first sections is less than a width of the first common line.4. The probe position monitoring structure according to claim 3 , wherein a ratio of the width of the first common line to the width of each of the first sections ranges from 5 to 200.5. The probe position monitoring structure according to claim 1 , wherein the contact portion further comprises a second zigzag structure claim 1 , and a pattern of the second zigzag structure is identical to a pattern of the first zigzag structure. ...

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Номер записи: 43
26-02-2015 дата публикации

Electromagnetic shield for testing integrated circuits

Номер: US20150054538A1
Автор: Alberto Pagani
Принадлежит: STMICROELECTRONICS SRL

A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal.

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Номер записи: 44
13-02-2020 дата публикации

Probe card assembly

Номер: US20200049738A1
Автор: David L. Gardell, David M. Audette, Dustin FREGEAU, Frederick H. Roy, III, Grant W. WAGNER, Peter W. NEFF
Принадлежит: International Business Machines Corp

A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.

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Номер записи: 45
22-02-2018 дата публикации

Multi-Pin Dense Array Resistivity Probe

Номер: US20180052189A1
Автор: Fan Zhang, Haiyang You, Jianli Cui, Jianou Shi, Lu Yu, NanChang Zhu, Walter H. Johnson, III, Xianghua Liu, Zhu-bin Shi, Zhuoxian Zhang
Принадлежит: KLA Tencor Corp

Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

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Номер записи: 46
13-02-2020 дата публикации

Wiring board design support apparatus, method for wiring board via arrangement and storage medium recording program for wiring board via arrangement

Номер: US20200050732A1
Автор: Akitsugu Yamaguchi, Katsushi MIKUNI, Ryuichi Yagisawa
Принадлежит: Micronics Japan Co Ltd

To improve wiring housing property, with preferable work efficiency, without deviation in the vertical direction or the horizontal direction, without expanding via arrangement areas. A wiring board design support apparatus of the present disclosure is a wiring board design support apparatus arranging a plurality of vias on a wiring board, and includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

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Номер записи: 47
05-03-2015 дата публикации

VERTICAL PROBE CARD FOR MICRO-BUMP PROBING

Номер: US20150061719A1
Автор: LEE Jae Hwan, PARK Sang Jin, YOON Ki Chea
Принадлежит: soulbrain ENG Co., Ltd.

The present invention relates to a probe card, and more particularly a probe card that can provide fine pitch for micro-bump probing, can be manufactured at a low cost for a short time through a simple manufacturing process, and can have excellent electric characteristics because it can have the components and a thin film resistance therein. 1. A probe card comprising:a printed circuit board;a space transformer substrate that has a first side facing the printed circuit board and a second side opposite to the first side, has first circuit patterns on the second side, and has conductive signal transmitting portions that are filled in a plurality of through-holes formed through the first side and the second side and are connected with the first circuit pattern;a plurality of connectors that connect the printed circuit board with the signal transmitting portions of the space transformer substrate; andprobe tips that have one end that can be brought in contact with an object to be tested and the other end that is connected to the first circuit patterns of the space transformer substrate.2. The probe card of claim 1 , wherein the space transformer substrate is made of ceramic.3. The probe card of claim 1 , further comprising a multilayer ceramic substrate disposed away from the printed circuit board and composed of several pattern layers claim 1 ,wherein the multilayer ceramic substrate have second circuit patterns formed on the side facing the printed circuit board, andthe connectors connect the second circuit patterns with the printed circuit board.4. The probe card of claim 1 , wherein the connectors are any one of metal rods or metal wires or combinations of both of metal rods and metal wires.5. The probe card of claim 1 , wherein the first circuit patterns are formed in a shape corresponding to the probe tips claim 1 , depending on any one or both of the arrangement of the probe tips and gaps therebetween.6. The probe card of claim 1 , wherein the first circuit ...

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Номер записи: 48
04-03-2021 дата публикации

INSPECTION JIG, AND INSPECTION DEVICE INCLUDING THE SAME

Номер: US20210063438A1
Автор: OTA Norihiro
Принадлежит:

An inspection jig includes a support member that supports a probe. The support member includes an inspection side plate-shaped body arranged on one end portion side, and an electrode side plate-shaped body arranged on the other end portion side of the support member. A probe support hole into which one end portion of the probe is inserted and supported is formed in the inspection side plate-shaped body. A probe insertion hole into which the other end portion of the probe is inserted is formed in the electrode side plate-shaped body. The probe is supported while the one end portion of the probe abuts on an inner wall of the probe support hole in a state in which a contact portion provided at the one end portion of the probe is not in contact with an inspected portion to be inspected. 1. An inspection jig comprising:a probe that includes a cylindrical body which includes a spiral spring portion and is made of a conductive member, and a rod-shaped body which is inserted into the cylindrical body and is made of a conductive member; anda support member that supports the probe,whereinthe support member includes an inspection side plate-shaped body arranged on one end portion side, and an electrode side plate-shaped body arranged on the other end portion side of the support member,a probe support hole into which one end portion of the probe is inserted and supported is formed in the inspection side plate-shaped body,a probe insertion hole into which the other end portion of the probe is inserted is formed in the electrode side plate-shaped body, andthe probe is installed while being inclined at a constant angle with respect to a reference line extending in an axial direction of the probe insertion hole, and is supported while the one end portion of the probe abuts on an inner wall of the probe support hole in a state in which a contact portion provided at the one end portion of the probe is not in contact with an inspected portion to be inspected.2. The inspection jig ...

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Номер записи: 49
04-03-2021 дата публикации

TEST SOCKET AND METHOD OF MANUFACTURING THE SAME

Номер: US20210063442A1
Автор: FUKUI YASUKI, HARA NARUKI, TAMAKI Kazuo, YAMASHITA MASATAKA
Принадлежит:

A first base plate includes a plurality of first positioning hole portions, an accommodation portion that accommodates an optical module, a first opening portion, a first pressing portion, and a first engagement portion. A second base plate has a second positioning hole portion that is disposed at a position corresponding to the first positioning hole portion, a second opening portion that is disposed at a predetermined positional relationship with respect to the second positioning hole portion, a second holding portion, a conduction portion, a second pressing portion, a substrate portion, a cover portion, a second hinge portion, and a second engagement portion. 1. A test socket for an optical module , the test socket comprising:a first base plate that accommodates the optical module; anda second base plate that is detachably attached to the first base plate and sandwiches the optical module between the first base plate and the second base plate, wherein a plurality of first positioning hole portions,', 'an accommodation portion that has a first holding portion disposed in a predetermined positional relationship with respect to the plurality of first positioning hole portions, and accommodates the optical module,', 'a first opening portion that is formed in the accommodation portion,', 'a first pressing portion that protrudes from the first opening portion and presses the optical module toward a side of the second base plate,', 'a first hinge portion that rotatably attaches the second base plate, and', 'a first engagement portion that is disposed at a position different from a position of the first hinge portion and engages with the second base plate, and, 'the first base plate has'} a plurality of second positioning hole portions that are arranged at positions corresponding to the plurality of first positioning hole portions of the first base plate,', 'a second opening portion that is disposed at a predetermined positional relationship with respect to the plurality ...

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Номер записи: 50
04-03-2021 дата публикации

PROBER AND PROBE CARD CLEANING METHOD

Номер: US20210063443A1
Автор: FUJIHARA Jun
Принадлежит:

There is provided a prober provided with a plurality of inspection chambers. Each inspection chambers includes: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a cleaning wafer thereon; an aligner configured to drive the chuck top in a vertical direction when the probe card is cleaned using the cleaning wafer; a seal mechanism configured to allow a sealed space to be provided between the probe card holder and the chuck top; a pressure sensor configured to detect an internal pressure of the sealed space, which fluctuates with an operation of the chuck top driven by the aligner; and an electro-pneumatic regulator configured to control the internal pressure of the sealed space by performing an intake or exhaust operation with respect to the sealed space based on the internal pressure detected by the pressure sensor. 1. A prober comprising a plurality of inspection chambers ,wherein each of the plurality of inspection chambers comprises:a probe card provided with a plurality of probes;a probe card holder configured to hold the probe card;a chuck top configured to place a cleaning wafer thereon;an aligner configured to drive the chuck top in a vertical direction when the probe card is cleaned using the cleaning wafer;a seal mechanism configured to allow a sealed space to be provided between the probe card holder and the chuck top;a pressure sensor configured to detect an internal pressure of the sealed space, which fluctuates with an operation of the chuck top driven by the aligner; andan electro-pneumatic regulator configured to control the internal pressure of the sealed space by performing an intake or exhaust operation with respect to the sealed space based on the internal pressure detected by the pressure sensor.2. The prober of claim 1 , further comprising:a check valve configured to exhaust the sealed space when the internal pressure of the sealed space exceeds a preset pressure.3. ...

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Номер записи: 51
12-03-2015 дата публикации

POGO PIN AND PROBE CARD, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

Номер: US20150070038A1
Автор: JOO Sung-Ho, KIM Joon-yeon, KIM Yu-Kyum
Принадлежит:

A pogo pin may include a housing, a resilient connecting member and a switching unit. The housing may be arranged between a printed circuit board (PCB) and a probing head. The resilient connecting member may be arranged in the housing to electrically connect the PCB with the probing head. The switching unit may be provided in the housing to selectively cut off an electrical connection between the PCB and the probing head. Thus, because the PCB may not require additional switching substrates, the PCB may have a small size so that the probe card may also have a small size. A semiconductor device may be manufactured using the probe card. 1. A probe card comprising:a printed circuit board (PCB) having a circuit pattern through which a test current passes;a probing head arranged under the PCB, the probing head including circuitry through which the test current passes;a plurality of needles provided to the probing head to supply the test current to an object; anda plurality of pogo pins positioned between the PCB and the probing head, each pogo pin including a housing arranged between the PCB and the probing head, a resilient connecting member arranged in the housing to electrically connect the PCB with the probing head, and a switching unit provided in the housing to selectively cut off an electrical connection between the PCB and the probing head.2. The probe card of claim 1 , further comprising claim 1 , for each pogo pin:a first connecting pin at a first end of the resilient connecting member; anda second connecting pin at a second, opposite end of the resilient connecting member,wherein the switching unit electrically disconnects the first connecting pin from the second connecting pin.3. The probe card of claim 2 , wherein:the switching unit includes an actuator connected to a disconnecting member, the actuator configured to move the disconnecting member so as to electrically disconnect the first connecting pin from the second connecting pin.4. The probe card of ...

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Номер записи: 52
29-05-2014 дата публикации

PROBE APPARATUS AND TEST APPARATUS

Номер: US20140145742A1
Автор: Sugai Katsushi
Принадлежит: ADVANTEST CORPORATION

A probe apparatus providing an electrical connection between a device under test and a test apparatus body, comprising a device-side terminal unit including a flexible sheet and device-side connection terminals passing through the sheet and connected to the device under test; an intermediate substrate provided on the test apparatus body side of the device-side terminal unit and including device-side intermediate electrodes electrically connected to the device-side connection terminals and tester-side intermediate electrodes electrically connected to the test apparatus body; a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, tester-side electrodes electrically connected to the test apparatus body; and a contact section provided between the intermediate substrate and the tester-side substrate and including first pins connected to the tester-side intermediate electrodes and second pins connected to the tester-side electrodes. 1. A probe apparatus that provides an electrical connection between a device under test and a test apparatus body , comprising:a device-side terminal unit that includes a flexible sheet and a plurality of device-side connection terminals passing through the sheet and connected to the device under test;an intermediate substrate that is provided on the test apparatus body side of the device-side terminal unit and includes a plurality of device-side intermediate electrodes electrically connected to the device-side connection terminals and a plurality of tester-side intermediate electrodes electrically connected to the test apparatus body;a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, a plurality of tester-side electrodes electrically connected to the test apparatus body; anda contact section that is provided between the ...

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Номер записи: 53
28-02-2019 дата публикации

LOW INDUCTANCE ELECTRICAL CONTACT ASSEMBLY

Номер: US20190067861A1
Автор: FOONG Wei Kuong, GOH Kok Sing, LEE Eng Kiat, MUNDIYATH Shamal
Принадлежит: JF MICROTECHNOLOGY SDN. BHD.

An electrical contact test assembly that has a small size, a very low inductance, is able to handle high frequency and high current testing, and one that is easy to assemble, handle and maintain. An electrical contact assembly that comprises a shorter length of contact achieved by sandwiching an inner holder in between two rows of contacts and keeping them together via an adhesive between each of the two rows of contacts and the inner holder. In this way, very small sizes of contacts are more easily assembled and handled. The low inductance then allows for high frequency testing. An electrical contact assembly that comprises a one-piece contact without the complexity of other designs such as screws, springs, etc, allowing higher currents and tri-temperature testing. 1. An electrical contact assembly for use in a testing apparatus , comprising:a plurality of inner pins arranged in a row, each inner pin having a vertical section;a plurality of outer pins arranged in a row, each outer pin having a vertical section;an inner holder located in between said plurality of inner pins and said plurality of outer pins, said inner holder having a C-shaped cross-section, whereby an inner surface of the inner holder is adapted to receive a back side of said vertical section of said plurality of inner pins, and an outer surface of the inner holder is adapted to be received by a front side of said vertical section of said plurality of outer pins; andan outer holder having an inner surface adapted to receive a back side of said plurality of outer pins.2. An electrical contact assembly for use in a testing apparatus according to claim 1 , wherein an adhesive is applied between said inner holder inner surface and said inner pin vertical section claim 1 , such that the plurality of inner pins are joined to said inner holder.3. An electrical contact assembly for use in a testing apparatus according to claim 1 , wherein an adhesive is applied between said inner holder outer surface and ...

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Номер записи: 54
19-03-2015 дата публикации

Sort Probe Over Current Protection Mechanism

Номер: US20150077150A1
Автор: Dryfuse Mark W., Norris Benjamin J., Tadayon Pooya
Принадлежит:

An apparatus includes a probe card, a plurality of sort probes coupled to the probe card and detector circuitry to detect a real time over current occurrence at the sort probes. 1. An apparatus comprising:a probe card;a plurality of sort probes coupled to the probe card; anda shunting fuse coupled between the one or more of the plurality of sort probes and a power supply to protect the one or more of the plurality of sort probes against an over current event.2. The apparatus of wherein the shunting fuse comprises a comparator to compare a received voltage to a reference voltage and generate a reference signal upon detecting that the received voltage is greater than the reference voltage.3. The apparatus of wherein the shunting fuse further comprises a transistor to shunt the power supply to ground in response to receiving the reference signal.4. The apparatus of wherein the shunting fuse further comprises:a resistor to convert a load current to a small voltage; anda current sense amplifier to amplify the small voltage to the received voltage.5. The apparatus of further comprising a thermal fuse to disconnect the one or more of the plurality of sort probes from the power supply upon the occurrence of an excessive current.6. The apparatus of wherein the thermal fuse is a fast response fuse.715-. (canceled)16. A test system comprising:an automated test equipment (ATE) system;a probe card coupled to the ATE system;a plurality of sort probes coupled to the probe card; andan integrated circuit (IC) device coupled the probe card via the plurality of sort probes; anda shunting fuse coupled between the one or more of the plurality of sort probes and the ATE system to protect the one or more of the plurality of sort probes against an over current event.17. The test system of wherein the shunting fuse comprises a comparator to compare a received voltage to a reference voltage and generate a reference signal upon detecting that the received voltage is greater than the reference ...

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Номер записи: 55
17-03-2016 дата публикации

PROBE CARD ASSEMBLY

Номер: US20160077129A1
Автор: Audette David M., Fregeau Dustin, Gardell David L., III Frederick H., Neff Peter W., ROY, Wagner Grant W.
Принадлежит:

A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate 1. A probe card assembly , comprising:an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board;an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof; anda spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate.2. The probe card assembly of claim 1 , further comprising a mechanism which prevents rotation of the inner gimbal bearing about a vertical axis with respect to the outer gimbal bearing.3. The probe card assembly of claim 2 , wherein the mechanism comprises a depressed area provided on one of the spring plate and the inner gimbal bearing which engages with a raised area of another of the spring plate and the inner gimbal bearing to prevent rotation of the substrate about a Z-axis.4. The probe card assembly of claim 2 , wherein the mechanism includes a flexible tab extending between the inner gimbal bearing and the outer gimbal bearing.5. The probe card assembly of claim 2 , wherein the mechanism includes slots provided on the spring plate engaging with at least one set screw provided as an assembly with the inner gimbal bearing.6. The probe card assembly of claim 5 , wherein the at least one set screw has a wedge shape which engages with a slotted pattern ...

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Номер записи: 56
07-03-2019 дата публикации

Semiconductor device test apparatuses

Номер: US20190072608A1
Автор: James M. Derderian, Jaspreet S. Gandhi, Michel Koopmans
Принадлежит: Micron Technology Inc

Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture.

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Номер записи: 57
05-03-2020 дата публикации

Multi-Pin Dense Array Resistivity Probe

Номер: US20200072869A1
Автор: Cui Jianli, III Walter H., Johnson, Liu Xianghua, Shi Jianou, Shi Zhu-bin, You Haiyang, Yu Lu, Zhang Fan, Zhang Zhuoxian, Zhu Nanchang
Принадлежит:

Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate. 1. A resistivity probe comprising:a substrate defining a top surface; anda plurality of probes extending from the substrate, wherein each of the probes curves from the substrate to a tip of the probe such that each of the elements is non-parallel to the top surface of the substrate.2. The resistivity probe of claim 1 , wherein each of the probes includes two layers of material claim 1 , wherein each of the two layers have different stresses thereby causing the curve.3. The resistivity probe of claim 1 , wherein the substrate includes a support region that matches a curve of the probes claim 1 , and wherein the support region of the substrate is etched away.4. The resistivity probe of claim 1 , wherein the spacing between the probes is less than 1 micron.5. The resistivity probe of claim 1 , wherein the probes each have a width of less than 1 micron.6. The resistivity probe of claim 1 , wherein the probes are fabricated of a metal or a metal alloy.7. The resistivity probe of claim 1 , wherein the substrate is fabricated of silicon.8. The resistivity probe of claim 1 , wherein the tip of one of the probes is curved 90 degrees from the top surface of the substrate.9. The resistivity probe of claim 1 , wherein the tips of the probes include non-conductive support materials.10. The resistivity probe of claim 1 , wherein the plurality of the probes includes four of the probes. ...

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Номер записи: 58
05-03-2020 дата публикации

PROBE CARD AND TEST DEVICE INCLUDING THE SAME

Номер: US20200072870A1
Автор: JANG Tae Yong
Принадлежит:

There are provided a probe card and a test device including the same. The probe card may include a probe substrate, a plurality of cables on the probe substrate, a plurality of pins on the probe substrate, the plurality of pins being electrically connected to the plurality of cables, and a conductive line on the probe substrate, the conductive line being connected to a ground line. 1. A probe card comprising:a probe substrate;a plurality of cables on the probe substrate;a plurality of pins on the probe substrate, the plurality of pins being electrically connected to the plurality of cables; anda conductive line on the probe substrate, the conductive line being connected to a ground line.2. The probe card of claim 1 , wherein the conductive line is formed along an edge of the probe substrate.3. The probe card of claim 2 , wherein the conductive line has a closed curve shape.4. The probe card of claim 3 , wherein the plurality of cables are located in an area surrounded by the conductive line.5. The probe card of claim 1 , wherein each of the plurality of cables comprises:a conductive core;a first protective layer on the conductive core;an intermediate layer on the first protective layer;a second protective layer on the intermediate layer; anda jacket on the second protective layer.6. The probe card of claim 5 , wherein the conductive core is directly connected to the probe substrate.7. A test device comprising:a probe station for fixing an object to be measured;a probe card configured to be attached to the probe station to be electrically connected to the object to be measured; anda measurer configured to be connected to the probe card for measuring an electrical characteristic of the object to be measured, a probe substrate;', 'a plurality of cables on the probe substrate, and configured to be connected to the measurer;', 'a plurality of pins on the probe substrate and electrically connected to the plurality of cables; and', 'a conductive line on the probe substrate ...

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Номер записи: 59
24-03-2016 дата публикации

APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS

Номер: US20160084905A1
Автор: Derderian James M., Gandhi Jaspreet S., Koopmans Michel
Принадлежит:

Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture. 1. A semiconductor device test apparatus , comprising:at least one substrate comprising at least one test site including an array of pockets configured for at least partially receiving conductive elements protruding from a semiconductor device to be tested; anda conductive contact within each pocket coupled to a conductive trace extending to a conductive pad offset from the array of pockets.2. The apparatus of claim 1 , wherein the at least one substrate is selected from the group consisting of semiconductor material claim 1 , glasses claim 1 , and ceramics.3. The apparatus of claim 1 , wherein the at least one substrate comprises one of a semiconductor wafer and a segment of a semiconductor wafer.4. The apparatus of claim 3 , wherein the at least one substrate comprises a segment of a semiconductor wafer in the form of a strip of semiconductor material having at least one row of test sites thereon.5. The apparatus of claim 4 , wherein the at least one substrate comprises a number of substrates claim 4 , and further comprising a fixture configured with a number of recesses claim 4 , each recess sized and configured to at least partially receive a substrate of the number of substrates claim 4 , at least some of the recesses having a substrate at least partially received therein.6. The ...

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Номер записи: 60
25-03-2021 дата публикации

Probing apparatus and method of operating the same

Номер: US20210088581A1
Автор: Choon Leong Lou, Yi Ming Lau
Принадлежит: STAr Technologies Inc

A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.

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Номер записи: 61
19-06-2014 дата публикации

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Номер: US20140167799A1
Автор: Ching-Nen Peng, Hao Chen, Hung-Chih Lin, Mill-Jer Wang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

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Номер записи: 62
12-05-2022 дата публикации

CONTACT PROBE AND SIGNAL TRANSMISSION METHOD

Номер: US20220146552A1
Автор: Soma Kazuya, Takahashi Masahiro, Takahashi Shuji
Принадлежит: NHK SPRING CO., LTD.

A contact probe includes a first plunger, a second plunger, a coil spring, and a pipe; the first plunger includes a first slide portion that slides along the inner periphery of the pipe; the second plunger includes a second slide portion that slides along the inner periphery of the pipe; and the coil spring includes: a first attachment portion that is attached to the first plunger and tightly wound; a second attachment portion that is attached to the second plunger and tightly wound; a coarsely wound portion; a first contact portion including one end connected to the first attachment portion and another end connected to the coarsely wound portion and contacting the pipe; and a second contact portion including one end connected to the coarsely wound portion and another end connected to the second attachment portion and contacting to the pipe. 1. A contract probe for contacting with electrodes at both ends of a longitudinal length of the contact probe and transmitting a signal , the contact probe comprising:a first plunger configured to contact a first electrode at one end of the longitudinal length;a second plunger configured to contact a second electrode different from the first electrode at another end of the longitudinal length;a coil spring connected to the first plunger at one end of the coil spring and connected to the second plunger at another end of the coil spring; anda pipe provided inside the coil spring, whereinthe first plunger includes a first slide portion provided at another end of the first plunger opposite to the one end of the first plunger contacting the first electrode, the first slide portion being configured to slide along an inner periphery of the pipe,the second plunger includes a second slide portion provided at another end of the second plunger opposite to the one end of the second plunger contacting the second electrode, the second slide portion being configured to slide along the inner periphery of the pipe, and a first attachment portion ...

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Номер записи: 63
14-04-2016 дата публикации

CIRCUIT BOARD TESTING APPARATUS AND CIRCUIT BOARD TESTING METHOD

Номер: US20160103172A1
Автор: Yamashita Munehiro
Принадлежит:

In a circuit board testing apparatus for performing a four-terminal measurement method on a wiring pattern formed of a plurality of wires on a circuit board, a control part connects in series contact probes to be connected to upstream-side voltage detection terminals or downstream-side voltage detection terminals, via connection terminals, allows a power supply part to apply power between the test points with which the contact probes connected in series are in contact, allows a voltage detection part to detect a voltage between the test points, and makes a determination as to conductive contact states of the contact probes with the test points, based on the detected voltage. 1. A circuit board testing apparatus for measuring at least one electrical characteristic of a wiring pattern formed of a plurality of wires on a circuit board , the wiring pattern having at least two test points defined thereon , the apparatus comprising: an upstream power terminal having a switchable connection to an upstream side of a power supply part,', 'a downstream power terminal having a switchable connection to a downstream side of the power supply part,', 'an upstream voltage detection terminal having a switchable connection to an upstream side of a voltage detection part,', 'a downstream voltage detection terminal having a switchable connection to a downstream side of the voltage detection part, and', 'a switchable connection terminal; and, 'at least two pairs of contact probes each of the pairs of contact probes configured to establish electrical contact with one of said test points, each contact probe comprising, respectivelya control part configured to perform a measurement of a first value related to the at least one electrical characteristic of the wiring pattern, based on a determination of a second value related to a contact state of the at least two pairs of contact probes to the two respective test points.2. The circuit board testing apparatus of wherein the measurement of ...

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Номер записи: 64
12-05-2022 дата публикации

CONTACTOR BLOCK OF SELF-ALIGNING VERTICAL PROBE CARD AND MANUFACTURING METHOD THEREFOR

Номер: US20220149555A1
Автор: CHO Yong Ho, LEE Jong Myeon
Принадлежит:

A contactor block of a self-aligning vertical probe card according to the present invention comprises: at least one vertical contactor array in which a plurality of vertical contactors manufactured by a MEMS process and extending in the longitudinal direction are arranged side by side in the horizontal direction; and a molding layer that exposes the upper and lower ends of the plurality of vertical contactors constituting the vertical contactor array and surrounds and supports the plurality of vertical contactors. 1. A contactor block of a self-aligning vertical probe card , comprising:one or more vertical contactor arrays which are manufactured through a micro-electro mechanical system (MEMS) process and in which a plurality of vertical contactors extending in a longitudinal direction are arranged parallel to a horizontal direction; anda molding layer which exposes upper ends and lower ends of a plurality of vertical contactors included in the vertical contactor array and surrounds and supports the plurality of vertical contactors.2. The contactor block of claim 1 , further comprising base guide plates in which the vertical contactor array and the molding layer are integrally formed claim 1 ,wherein the plurality of base guide plates are stacked in layers on a mounting base to form a contactor block, andthe contactor block is separated from the base guide plates using a laser cutting process.3. The contactor block of claim 2 , wherein:a plurality of support rods having a predetermined height are formed to protrude from a flat plate shaped body of the mounting base; anda plurality of insertion holes passing through the base guide plate are fitted onto the support rods of the mounting base so that the plurality of vertical contactor arrays are arranged.4. The contactor block of claim 2 , wherein claim 2 , in a case in which a molding restriction member for restricting a molding portion is formed on the base guide plate claim 2 , when a molding process is completed ...

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Номер записи: 65
12-04-2018 дата публикации

ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS

Номер: US20180100876A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

A probe card includes a number probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. The probes include at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. The probe card further includes at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal. 1. A probe card , comprising a plurality of probes , wherein said plurality of probes includes:a first probe configured to contact a corresponding terminal of a circuit integrated in a die location of a semiconductor material wafer during a test phase of the wafer;wherein said first probe is configured to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase; anda plurality of second probes forming an electromagnetic shield structure, the plurality of second probes arranged to surround said first probe in positions aligned with a scribe line delimiting said die location for at least partially shielding an electromagnetic field irradiated by said first probe when providing and/or receiving the radio frequency test signal.2. The probe card of claim 1 , wherein said plurality of probes are connected to the probe card by means of a supporting element configured in such a way to face a wafer surface during the test phase claim 1 , said plurality of second probes extending from the supporting element toward the wafer surface.3. The probe card of claim 1 , wherein said plurality of second probes are conductive probes.4. The probe card of claim 3 , wherein said plurality of second probes are configured to be ...

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Номер записи: 66
28-03-2019 дата публикации

WIRING SUBSTRATE FOR ELECTRONIC COMPONENT INSPECTION APPARATUS

Номер: US20190098769A1
Автор: HATTORI Masaomi, NASU Takakuni
Принадлежит:

A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and the flange portion has a truncated conical shape and the outside surface from which the bolt portion protrudes, such that the outside surface slopes from the proximal end side of the bolt portion toward the peripheral edge of the flange portion and gradually approaches the inside surface of the flange portion. 1. A wiring substrate for electronic component inspection apparatus comprising a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface , and a plurality of studs joined to the back surface of the first laminate ,the wiring substrate for electronic component inspection apparatus being characterized in thateach of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion or a nut tube portion which perpendicularly extends from a center portion of an outside surface of the flange portion; andthe flange portion has a truncated conical shape and the outside surface from which the bolt portion or the nut tube portion protrudes, such that the outside surface slopes from a proximal end side of the bolt portion or a proximal end side of the nut tube portion toward a peripheral edge of the flange portion and gradually approaches an inside surface of the flange portion.2. The wiring substrate for electronic component inspection apparatus according to claim 1 , wherein claim 1 , in a vertical cross section along an axial direction of the bolt portion or the nut tube portion claim 1 , the ...

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Номер записи: 67
28-03-2019 дата публикации

WIRING SUBSTRATE FOR ELECTRONIC COMPONENT INSPECTION APPARATUS

Номер: US20190098770A1
Автор: NASU Takakuni
Принадлежит:

A wiring substrate for electronic component inspection apparatus includes a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface, and a plurality of studs joined to the back surface of the first laminate, wherein each of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion which perpendicularly extends from a center portion of an outside surface of the flange portion; and in a vertical cross section along an axial direction of the bolt portion, the outside surface from which the bolt portion protrudes has a curved surface which is convex toward an inside surface of the flange portion facing the back surface of the first laminate. 1. A wiring substrate for electronic component inspection apparatus comprising a first laminate which is formed by stacking a plurality of ceramic layers and which has a front surface and a back surface , and a plurality of studs joined to the back surface of the first laminate ,the wiring substrate for electronic component inspection apparatus being characterized in thateach of the studs is composed of a flange portion which is circular in bottom view, and a bolt portion or a nut tube portion which perpendicularly extends from a center portion of the flange portion; andin a vertical cross section of the flange portion along an axial direction of the bolt portion or the nut tube portion, an outside surface of the flange portion from which the bolt portion or the nut tube portion protrudes is defined by a curve which is convex toward an inside surface of the flange portion facing the back surface of the first laminate.2. The wiring substrate for electronic component inspection apparatus according to claim 1 , wherein claim 1 , in the vertical cross section along the axial direction of the bolt portion or the nut tube portion claim 1 , the outside surface of the flange portion of the stud is defined by a curve having a single ...

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Номер записи: 68
26-03-2020 дата публикации

Hardware Timed Over-the-Air Antenna Characterization

Номер: US20200096554A1
Автор: Deckert Thomas, Grosz Karl F., Lange Johannes D. H., Orozco Valdes Gerardo, White Christopher N.
Принадлежит:

Antenna characterization systems and methods are described for hardware-timed testing of integrated circuits (IC) with integrated antennas configured for over-the-air transmission and/or reception. An IC to be tested (e.g., the device under test (DUT)) may be mounted to an adjustable positioner in an anechoic chamber. Radio frequency (RF) characteristics (e.g., including transmission characteristics, reception characteristics, and/or beamforming characteristics) of the IC may be tested over-the-air using an array of antennas or probes within the anechoic chamber while continually transitioning the adjustable positioner through a plurality of orientations. Counters and reference trigger intelligence may be employed to correlate measurement results with orientations of the DUT. 1. An antenna characterization system (ACS) , comprising:a computer comprising a processor coupled to a non-transitory memory medium;a chamber;a radio frequency (RF) measurement system coupled to the computer, wherein the RF measurement system is configured to perform RF measurements of a device under test (DUT); and position the DUT within the chamber according to a plurality of orientations;', 'automatically transmit one or more signals to the computer in response to the adjustable positioner positioning the DUT according to each of the plurality of orientations,, 'an adjustable positioner positioned within the chamber and coupled to the computer, wherein the adjustable positioner is configured to in response to receiving the signals from the adjustable positioner, transmit a plurality of acquisition triggers to the RF measurement system to acquire a plurality of RF measurements of the DUT;', 'receive results of the plurality of RF measurements from the RF measurement system;', 'generate antenna characterization information based at least in part on the signals received from the adjustable positioner and the results of the plurality of RF measurements., 'wherein the computer is configured to2 ...

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Номер записи: 69
23-04-2015 дата публикации

Test probe card

Номер: US20150109016A1
Автор: Choon Leong Lou, Ho Yeh Chen
Принадлежит: STAr Technologies Inc

A test probe card adapted for testing a plurality of chips of a wafer is provided. The test probe card includes a substrate, a plurality of light-guiding elements, a plurality of lens units and a plurality of probes. The substrate has a plurality of through holes. Each of the through holes has a light entrance opening and a light exit opening. The light-guiding elements are disposed at the through holes, respectively. The lens units are disposed at the light exit openings, respectively. One end of each of the probes is electrically connected to the substrate and another end of each of the probes is adapted for electrically contacting one of the image sensing chips. Light emitted from a light source passes through one of the light-guiding elements and the lens element corresponding thereto in order and then is projected to one of the image sensing chips.

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Номер записи: 70
08-04-2021 дата публикации

ADJUSTABLE PROBE DEVICE FOR IMPEDANCE TESTING FOR CIRCUIT BOARD

Номер: US20210102992A1
Автор: Chen Chien-Hsun, CHENG YANG-HUNG, CHOU CHIA-NAN, Huang Chung-Yen, LO YA-HUNG, TANG Fuh-Chyun, TSAI SHOU-JEN
Принадлежит: MPI corporation

An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards. 1. An adjustable probe device for impedance testing for a circuit board , the adjustable probe device comprising:a fixed probe and a movable probe, each of the fixed probe and the movable probe comprising a ground unit for being electrically connected to ground potential, at least one of the fixed probe and the movable probe further comprising a core relatively fixed to and insulated from the ground unit for transmitting test signal, the movable probe being linearly slidable relative to the fixed probe along a first axis in a way that the ground unit of the movable probe is abutted against the ground unit of the fixed probe.2. The adjustable probe device as claimed in claim 1 , wherein the movable probe is movable relative to the fixed probe along a second axis perpendicular to the first axis.3. The adjustable probe device as claimed in claim 1 , wherein the fixed probe comprises an electrically conductive frame and a needle; the electrically conductive frame comprises a frame body; the needle comprises the core claim 1 , an insulating layer surrounding the core claim 1 , and an electrically conductive layer surrounding the ...

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Номер записи: 71
21-04-2016 дата публикации

SEMICONDUCTOR PACKAGE TEST BLADE AND SEMICONDUCTOR PACKAGE TEST APPARATUS INCLUDING THE SAME

Номер: US20160109512A1
Автор: Kim Suk-lae, Roh Dong-joo
Принадлежит:

A semiconductor package test blade and a semiconductor package test apparatus may prevent damage to a semiconductor package and occurrence of failures in the semiconductor package during a pass/fail test on the semiconductor package. The semiconductor package test blade includes a blade body formed at a lower end portion of a pusher for testing a semiconductor package, the blade body having a first surface contacting the semiconductor package and a groove dented upward from the first surface, a vacuum suction picker configured to penetrate a central portion of the blade body and suck and pick up the semiconductor package in vacuum, and a flexible silicone layer filling the groove. A bottom surface of the flexible silicone layer may be positioned at substantially the same level as the first surface of the blade body. 1. A semiconductor package test blade comprising:a blade body at a lower end portion of a pusher for testing a semiconductor package, the blade body having a first surface contacting the semiconductor package and a groove dented upward from the first surface to provide a second surface at a higher level than the first surface and opposite to the first surface;a vacuum suction picker configured to penetrate a central portion of the blade body and suck and pick up the semiconductor package by using a vacuum; anda flexible silicone layer filling the groove and being in contact with the second surface of the blade body,wherein a bottom surface of the flexible silicone layer is at substantially a same level as the first surface of the blade body.2. The semiconductor package test blade of claim 1 , wherein the flexible silicone layer is formed of flexible silicone having a hardness of 1 to 10.3. The semiconductor package test blade of claim 1 , wherein the flexible silicone layer comprises flexible silicone claim 1 , or flexible silicone rubber.4. The semiconductor package test blade of claim 1 , wherein the flexible silicone layer has a smaller planar area ...

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Номер записи: 72
19-04-2018 дата публикации

Jig for sample for solar photovoltaic device and solar simulator including the same

Номер: US20180106440A1
Автор: Ahn Se-Jin, AHN Seung-kyu, Cho Ara, Cho Jun-Sik, Eo Young-Joo, Gwak Jihye, KIM Kihwan, Park Joo-Hyung, Yoo Jin-Su, Yun Jae-Ho
Принадлежит:

A jig for a sample for a solar photovoltaic device is disclosed. The jig includes a cradle unit supporting the sample and a contact unit including at least one probe pin coming into contact with a busbar of the sample located in the cradle unit. The contact unit includes a coupling plate coupled with the cradle unit and at least one contact bar including a PCB and connected to the coupling plate, the contact bar having at least one probe pin aligned with the busbar of the sample with interposition of a probe pin connecting block. the jig includes a rotation support unit coupled with the cradle unit by a rotation shaft to allow the cradle unit to be rotated at an angle of 180° or greater so that upper and lower surfaces of the sample supported by the cradle unit are reversed. 1. A jig for a sample for a solar photovoltaic device , the jig comprising:a cradle unit supporting the sample for the solar photovoltaic device; anda contact unit including at least one probe pin coming into contact with a busbar of the sample located at the cradle unit, a coupling plate coupled with the cradle unit; and', 'at least one contact bar composed of a PCB (Printed Circuit Board) and being connected to the coupling plate, the contact bar having the at least one probe pin arranged and fixed at the contact bar to be aligned with the busbar of the sample with interposition of at least one probe pin connecting block,, 'wherein the contact unit includesthe jig further comprising:a rotation support unit coupled with the cradle unit by a rotation shaft so as to allow the cradle unit to be rotated at an angle equal to or greater than 180% so that upper and lower surfaces of the sample supported by the cradle unit are reversed.2. The jig of claim 1 , wherein the probe pin connecting block is provided with a hole at one end thereof to allow the probe pin to be inserted into the hole claim 1 , and a connection part at an opposite end thereof to be electrically connected with the contact bar.3. ...

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Номер записи: 73
20-04-2017 дата публикации

WAFER PROBE ALIGNMENT

Номер: US20170108547A1
Автор: APPINGER Joerg G., DENGLER Eberhard, Dieterle Roland, ECKERT Martin, KUCZERA Gabriele, Tomaschko Siegfried, Torreiter Otto, Trianni Quintino Lorenzo
Принадлежит:

A wafer probe alignment system and method for aligning a probe to a chip wafer for testing a chip on the wafer are provided. At least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe. The alignment approach includes providing a grid of signal pins for corresponding contact pads of the chip under test, determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force, and adjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test. 1. A method for aligning a probe to a chip wafer for testing a chip on the wafer , wherein at least two corners of the probe are adjustable in a same direction in relation to a primary corner of the probe , the method comprising:providing a grid of signal pins for corresponding contact pads of the chip under test;determining for each signal pin whether an electrical contact is established to a corresponding contact pad of the chip under contact force; andadjusting a position of each of the at least two corners by a corner individual delta position value with respect to the direction depending on a result of the determining in order to establish an electrical contact between each of the pins and the corresponding contact pads of the chip under test.2. The method of claim 1 , wherein the determining and the adjusting are performed in a repetitive manner until an electrical contact is established between each of the signal pins and the corresponding contact pads of the chip under test claim 1 , thereby adjusting the position of each of the at least two corners at each incremental step.3. The method of claim 1 , further comprising pre-aligning the grid of signal pins to the signal ...

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Номер записи: 74
10-07-2014 дата публикации

REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELECTRICAL CONDUCTORS PROJECTING FROM A SUPPORT STRUCTURE

Номер: US20140191775A1
Автор: Beaman Brian Samuel, Fogel Keith Edward, Lauro Paul Alfred, Liao Yun-Hsin, Morris Daniel Peter, Shih Da-Yuan
Принадлежит: INTERNATIONAL BUSINESS MACHINES CORPORATION

The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe. 160-. (canceled)61. A structure comprising:a substrate having a surface;a plurality of elongated electrical conductors extending away from said surface;each of said elongated electrical conductors having a first end affixed to said surface and a second end projecting away from said surface;said elongated electrical conductor having a dielectric coating disposed thereon so that said second end is not coated with said dielectric coating;a coating of an electrically conductive material disposed on said dielectric coating and on said surface to form a plurality of coaxial elongated electrical conductors having electrically common outer conductors.62. A structure comprising:a substrate having a surface;a plurality of elongated electrical conductors extending away from said surface;each of said elongated electrical conductors having a first end affixed to said surface and a second end projecting away from said surface;said elongated electrical conductor having a dielectric coating disposed thereon so that said second end is not coated with said dielectric coating;a sheet of material having a plurality of through-holes therein;said sheet of material is disposed so that said second ends extend through said through-holes;a coating of a first electrically conductive material disposed on said dielectric coating;said sheet of material ...

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Номер записи: 75
26-04-2018 дата публикации

LIMITING TRANSLATION FOR CONSISTENT SUBSTRATE-TO-SUBSTRATE CONTACT

Номер: US20180113150A1
Автор: Jovanovic Jovan, Lindsey Scott E., Malathong Seang P., Yeh Junjye
Принадлежит: AEHR TEST SYSTEMS

A method of testing an integrated circuit of a device is described. Air is allowed through a fluid line to modify a size of a volume defined between the first and second components of an actuator to move a contactor support structure relative to the apparatus and urge terminals on the contactor support structure against contacts on the device. Air is automatically released from the fluid line through a pressure relief valve when a pressure of the air in the fluid line reaches a predetermined value. The holder is moved relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially stationary relationship with one another. A connecting arrangement is provided including first and second connecting pieces with complementary interengaging formations that restricts movement of the contactor substrate relative to the distribution board substrate in a tangential direction. 145-. (canceled)46. A method of testing integrated circuits of devices , comprising:holding the first device against a surface of a holder;moving a contactor board assembly relative to the holder to bring terminals of the contactor board assembly into contact with contacts on the first device;allowing air through a fluid line to modify a size of a volume defined between the first and second portions of the actuator, thereby actuating first and second portions of an actuator to move a contactor support structure relative to an apparatus frame and urge terminals on the contactor support structure against contacts on the first device;providing signals through the terminals and contacts to an integrated circuit of the first device;reducing a pressure in the internal volume while maintaining the terminals in contact with the contacts;moving the holder relative to the apparatus frame to disengage the terminals from the contacts while maintaining the first and second components of the actuator in a substantially ...

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Номер записи: 76
17-07-2014 дата публикации

CURRENT-DIVERTING GUIDE PLATE FOR PROBE MODULE AND PROBE MODULE USING THE SAME

Номер: US20140197860A1
Автор: FAN Horng-Kuang, HSU Hsien-Ta
Принадлежит: MPI corporation

A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current. 1. A current-diverting guide plate for insertion of probes of a probe module , comprising:a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces for insertion of the probes of the probe module;a plurality of conducting layers each provided at a periphery wall of one of the through holes of the plate body; anda current-diverting circuit trace disposed on the first surface of the plate body and electrically connected with the conducting layers.2. The current-diverting guide plate as claimed in claim 1 , wherein the current-diverting circuit trace comprises at least one primary branch connected between two adjacent said conducting layers.3. The current-diverting guide plate as claimed in claim 2 , wherein the current-diverting circuit trace comprises at least one secondary branch connected between the two adjacent conducting layers.4. The current-diverting guide plate as claimed in claim 1 , wherein each of the conducting layers is a composite conducting layer comprising a metal base layer and a metal coating coated on a surface of the metal base layer.5. The current-diverting guide plate as claimed in claim 4 , ...

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Номер записи: 77
07-05-2015 дата публикации

METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE

Номер: US20150123691A1
Автор: NAKATANI Goro, NIINO Koichi, SAKURAGI Masahiro
Принадлежит: ROHM CO., LTD.

Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board. 1. A probe card comprising:a board;a plurality of probes on one surface side of the board and brought in contact with external terminals of a semiconductor device;a plurality of through-holes formed in correspondence to the respective probes and penetrating between the one surface of the board and another surface of the board;through electrodes embedded in the respective through-holes and conductively connected to the probes in the respective through-holes; anda wiring on the other surface side of the board and conductively connected to the through electrodes.2. The probe card according to claim 1 , wherein the through electrodes and the wiring are made of copper.3. The probe card according to claim 1 , wherein the through electrodes and the wiring are fabricated integrally with the board.4. The probe card according to claim 1 , wherein the board includes a silicon-based board.5. The probe card according to claim 1 , wherein the probe card inspects electrical characteristics of a plurality of semiconductor devices in a batch.6. The probe card according to claim 1 , comprising a gap between the plurality of probes and the board.7. The probe card according to claim 1 , comprising a substrate wiring formed selectively over ...

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Номер записи: 78
18-04-2019 дата публикации

Measuring system and method

Номер: US20190113538A1
Автор: Friedrich Reich, Gerd Bresser
Принадлежит: Rohde and Schwarz GmbH and Co KG

A measuring system for measuring signals with multiple measurement probes comprises a multi probe measurement device comprising at least two probe interfaces that each couple the multi probe measurement device with at least one of the measurement probes, a data interface that couples the multi probe measurement device to a measurement data receiver, and a processing unit coupled to the at least two probe interfaces that records measurement values via the at least two probe interfaces from the measurement probes, wherein the processing unit is further coupled to the data interface and provides the recorded measurement values to the measurement data receiver, and a measurement data receiver comprising a data interface, wherein the data interface of the measurement data receiver is coupled to the data interface of the multi probe measurement device.

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Номер записи: 79
13-05-2021 дата публикации

PROBE CARD, SEMICONDUCTOR MEASURING DEVICE, AND SEMICONDUCTOR MEASURING SYSTEM

Номер: US20210140998A1
Автор: MATSUBAYASHI Hiroto, Matsumoto Takayuki, NAKAMURA Tomoaki
Принадлежит: Mitsubishi Electric Corporation

A probe card has an edge sensor. The edge sensor has a first needle and a second needle. The first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other. The probe card has a resistor connected between the first needle and the second needle. 1. A probe card comprising an edge sensor having a first needle and a second needle , whereinthe first needle and the second needle are in contact with each other when the first needle and a wafer are not in contact with each other, and the first needle and the second needle are not in contact with each other when the first needle and the wafer are in contact with each other,the probe card further comprising a variable resistor connected between the first needle and the second needle.2. (canceled)3. The probe card according to claim 1 , whereinthe probe card is connectable to a semiconductor measuring device which determines that the first needle and the wafer are not in contact with each other if R=Rth is satisfied, where R is a resistance value of the edge sensor and Rth is a threshold value, and{'b': 1', '2', '1', '1', '2', '1', '1', '2', '2', '2, 'where R is a resistance value of the variable resistor and R is a resistance value of the edge sensor in a state in which the first needle and the second needle are in contact with each other and the variable resistor is removed, R satisfies a condition of R>=Rth if R<=Rth is satisfied, and R satisfies a condition of Rth<=RRth is satisfied.'}4. A semiconductor measuring device connectable to the probe card according to claim 1 , whereinthe semiconductor measuring device is capable of setting a resistance value of the variable resistor.5. The ...

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Номер записи: 80
03-05-2018 дата публикации

MODULE STATUSES CORRESPONDING TO SLOT LOCATIONS

Номер: US20180120351A1
Автор: Gaide Benjamin Thomas
Принадлежит:

An example device in accordance with an aspect of the present disclosure includes a plurality of pins coupled to a controller to receive a plurality of module statuses corresponding to slot locations of the enclosure at various proximity tiers relative to the module. The controller is to check a first pin of the plurality of pins to identify whether a first proximity tier relative to the module is occupied, regardless of a slot location of the module in the enclosure. 1. A module for use in an enclosure , comprising:a controller; anda plurality of pins coupled to the controller to receive a plurality of module statuses, respectively, corresponding to slot locations of the enclosure at various proximity tiers relative to the module;wherein the controller is to check a first pin of the plurality of pins to identify whether a first proximity tier relative to the module is occupied, regardless of a slot location of the module in the enclosure.2. The module of claim 1 , wherein the plurality of pins of the module are to receive the plurality of respective module statuses as a function of the slot location of the module claim 1 , such that the plurality of pins are to receive different respective module statuses based on which slot location of the enclosure the module is to occupy.3. The module of claim 1 , wherein the plurality of pins of the module are to indicate module statuses of a corresponding plurality of modules according to a hierarchy of proximity tiers claim 1 , wherein the hierarchy of proximity tiers claim 1 , relative to a given slot location of the module claim 1 , remains unchanged regardless of which slot location the module is to occupy.4. The module of claim 3 , wherein a given proximity tier includes a number of slot locations falling within a corresponding binary value of slot location(s) claim 3 , such that a given proximity tier n includes 2slot location(s) relative to the module.5. The module of claim 3 , wherein the hierarchy of proximity tiers ...

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Номер записи: 81
14-05-2015 дата публикации

Cable interface for coaxial cables

Номер: US20150130491A1
Автор: Adjan Kretz
Принадлежит: Huber and Suhner AG

The invention relates to a cable interface ( 1 ) for operatively connecting a plurality of coaxial cables ( 11 ). A main body ( 2 ) has a first side face and an opposing second side face ( 3, 4 ) with a plurality of blind holes ( 5 ) arranged in a pattern in the first side face ( 3 ). An internal conductor opening ( 7 ) is formed at the bottom ( 6 ) of each blind hole ( 5 ) and arranged substantially coaxial with the blind hole ( 5 ), which is likewise coated with an electrically conductive material and is used for operatively connecting an internal conductor ( 17 ) of the coaxial cable ( 11 ). The blind holes ( 5 ) cooperate with at least one first bore ( 8 ), which extends from the second side face ( 4 ) into the main body ( 2 ) and is coated with an electrically conductive material.

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Номер записи: 82
14-05-2015 дата публикации

SYSTEMS FOR PROBING SEMICONDUCTOR WAFERS

Номер: US20150130498A1
Автор: Chen Hao, Lin Hung-Chih, Peng Ching-Nen, Wang Mill-Jer
Принадлежит:

A wafer probing system includes a plurality of contacting pins connected to a test head. The system further includes a probe card electrically connectable with the test head, where the probe card includes a circuit board having a plurality of contact pads on opposite sides of the circuit board. 1. A wafer probing system comprising:a plurality of contacting pins connected to a test head; 'a circuit board comprising a plurality of contact pads on opposite sides of the circuit board.', 'a probe card electrically connectable with the test head, wherein the probe card comprises2. The system of claim 1 , wherein each contact pad of the plurality of contact pads on a first side of the opposite sides is electrically connected to a corresponding contact pad of the plurality of pads on a second side of the opposite sides.3. The system of claim 2 , further comprising a plurality of probe pins extending downward from a side of the circuit board claim 2 , wherein each probe pin of the plurality of probe pins is electrically connected to a corresponding contact pad of the plurality of pads on the second side of the opposite sides.4. The system of claim 3 , further comprising a holder claim 3 , wherein the holder is configured to move at least one probe pin of the plurality of probe pins.5. The system of claim 1 , whereinthe test head is configured for measuring time-domain reflectometry (TDR) time values for at least one of:calibrating the wafer probing system,checking continuity between conductive pads of a wafer under test and respective probe pins, oridentifying if a fault exists with an interconnect structure in the wafer under test.6. The system of claim 1 , further comprising a chuck for supporting a wafer under test claim 1 , wherein the chuck is configured to be moveable with respect to the probe card.7. The system of claim 1 , wherein the test head and the probe card are moveable relative to each other.8. The system of claim 1 , wherein the test head and the probe card ...

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Номер записи: 83
25-04-2019 дата публикации

Probe card and signal path switching module assembly

Номер: US20190120877A1
Автор: Chia-An YU, Chia-Nan Chou, Chien-Chiao CHEN, Hao Wei, Yu-Hao Chen
Принадлежит: MPI Corp

A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

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Номер записи: 84
27-05-2021 дата публикации

PROBER

Номер: US20210156901A1
Автор: ARUGA Mamoru, YASUTA Katsuo
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

An object of the present invention is to provide a prober that is able to carry out accurate inspection of semiconductor device in wafer state by reducing the effect of the external noises and the leakage of current and further by eliminating the stray capacitance of the chuck stage against the prober housing. The present invention attains this object by providing a prober comprising a chuck cover conductor that comprises a bottom conductor and a side conductor and an open top, wherein a chuck stage can be contained within a space surrounded by the bottom conductor and the side conductor; an upper cover conductor which has opening through which the conducting support members of the probe for front-side electrodes and the probe for back-side electrodes can be passed, and which is large enough to cover, in a plane view, at least the open top of the chuck cover conductor when the contact member of the probe for front-side electrodes moves relatively within a wafer under inspection; and, a conducting means that brings the chuck cover conductor and the upper cover conductor into contact and makes them electrically continuous. 1. A prober which comprises the following (1) to (7);(1) a chuck stage that comprises a conductive wafer holding area and a conductive probe contact area on the upper side of the chuck stage, wherein the conductive probe contact area is electrically continuous with the wafer holding area;(2) a probe for front-side electrodes and a probe for back-side electrodes placed above the upper surface of the chuck stage, each of which comprises a conducting support member and a contacting member that is electrically connected to the conducting support member;(3) an inductance cancel bar that is a conductive bar that connects between the conducting support member and the contacting member of the probe for front-side electrodes or between the supporting conductive member and the contacting member of the probe for back-side electrodes, which is placed parallel ...

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Номер записи: 85
12-05-2016 дата публикации

ASSEMBLING DEVICES FOR PROBE CARD TESTING

Номер: US20160131702A1
Автор: Sinsheimer Roger Allen
Принадлежит:

An example process places dice that have been cut from a first semiconductor wafer on a second wafer. The example process includes arranging the dice in a pattern on a the second wafer, where the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice; and using a probe card that is matched to a pattern of dice in connection with the second wafer. 112-. (canceled)13. Automatic test equipment (ATE) comprising:a probe card configured to contact, for testing, dice that have been cut from a first semiconductor wafer, the dice being on a second wafer; anda processing device to execute instructions to control testing performed by the probe card;wherein the second wafer has a coefficient of thermal expansion that has substantially a same coefficient of thermal expansion as the dice.14. The ATE of claim 13 , further comprising an adhesive between the second wafer and the dice claim 13 , the adhesive holding the dice on the second wafer.15. The ATE of claim 13 , wherein the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to heat.16. The ATE of claim 13 , wherein the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to ultraviolet light.17. The ATE of claim 13 , wherein a material of which the second wafer is formed comprises silicon having a coefficient of thermal expansion that matches a coefficient of thermal expansion of the dice or that is within a predefined range around the coefficient of thermal expansion of dice.18. The ATE of claim 13 , wherein the second wafer comprises glass on which an adhesive is disposed claim 13 , and the adhesive has a composition that causes the adhesive to decrease in adhesiveness in response to ultraviolet light.19. The ATE of claim 13 , wherein the dice were in a same pattern in the first semiconductor wafer as the dice are arranged on the second wafer.20. The ATE of claim 13 , ...

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Номер записи: 86
31-07-2014 дата публикации

TEST APPARATUS HAVING A PROBE CARD AND CONNECTOR MECHANISM

Номер: US20140210501A1
Автор: Dunklee John L., Funk William A., Root Bryan J.
Принадлежит: CELADON SYSTEMS, INC.

A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder. 13-. (canceled)4. A test apparatus for testing a semiconductor device comprising:a circuit board having a pattern of signal contacts and a pattern of guard contacts, the circuit board is configured as a plate having a top side, a bottom side, and an opening through the top and bottom sides; anda probe card including a wire guide, a probe tile connected with the wire guide, a plurality of probe wires supported by the wire guide and probe tile, each probe wire is positioned through the wire guide and the probe tile, each probe wire includes a probe tip extending through the probe tile, the probe tips forming an array to probe a device under test, each probe wire includes a signal transmitting portion and a guard portion exposed from the wire guide, the signal transmitting portions and the guard portions form a contact pattern and, with the array, are disposed on one side of the probe card, and a retainer member is disposed on another side of the probe card,wherein the probe tile is insertable into the opening of the circuit board to allow the array to probe a device under test, and the contact pattern of the probe card is contactable with the pattern of signal contacts and guard contacts on the ...

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Номер записи: 87
23-04-2020 дата публикации

ELECTRICAL CONNECTION DEVICE

Номер: US20200124640A1
Автор: ITO Tatsuya
Принадлежит:

An electrical connection device includes: a plurality of probes () in which distal end portions contact an inspection object () during measurement; and a space transformer () including a plurality of connection wirings (), in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes () is arranged on a first main surface (), and a second terminal is exposed to a second main surface (), and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring (), proximal end portions of a plurality of same-potential probes () set at a same potential during measurement among the plurality of probes (). 1. An electrical connection device for use in measuring electrical characteristics of an inspection object , comprising:a plurality of probes in which distal end portions contact the inspection object during measurement; anda space transformer including a plurality of connection wirings, in each of which a first terminal electrically connected to any of proximal end portions of the plurality of probes is arranged on a first main surface, and a second terminal is exposed to a second main surface, and having a short-circuit wiring pattern formed on the first main surface, the short-circuit wiring pattern electrically connecting, to the same connection wiring, proximal end portions of a plurality of same-potential probes set at a same potential during measurement among the plurality of probes.2. The electrical connection device according to claim 1 , wherein the short-circuit wiring pattern connects a plurality of the adjacent same-potential probes to each other.3. The electrical connection device according to claim 1 , wherein there are a plurality of the connection wirings which electrically connect to the single short-circuit wiring pattern.4. The electrical connection device according to claim 1 , wherein an interval between ...

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Номер записи: 88
23-04-2020 дата публикации

INSTRUMENT FOR TESTING TERMINAL CONNECTORS

Номер: US20200124654A1
Автор: Carnick Brian D., Gabriele Gregory A.
Принадлежит:

An instrument for testing the electric connection of a male terminal connector is provided. The instrument includes a female connector housing having a female board with a plurality of terminal cavities and a plurality of biasing contacts. The biasing contacts are configured to move between a first position and a second position. In the second position the head is depressed relative to the first position. Thus, the head is configured to engage a distal end of the male terminal blade so as to provide an electric connection. Further, the head is configured to give way to a misaligned male terminal blade. Accordingly, the instrument will maintain a predetermined surface contact with the male terminal blades and allow for misalignment of the male terminal blade with respect to the terminal cavity so as to reduce the occurrence of a faulty defect reading. 1. An instrument for testing the electric connection of a second connector housing having a plurality of terminal connectors , the instrument comprising:a first connector housing having a plurality of terminal cavities;a plurality of biasing contacts; each of the plurality of biasing contacts are configured to move between a first position and a second position, wherein in the second position a top surface of the biasing contact is depressed relative to the first position, accordingly, the testing instrument utilizes a contact between the biasing contacts and the terminal connector of the second connector housing to test an electric connection.2. The instrument as set forth in claim 1 , wherein each of the plurality of biasing contacts includes a testing wire.3. The instrument as set forth in claim 2 , further including a processing unit claim 2 , each of the testing wires are electrically coupled to the processing unit claim 2 , the processing unit configured to read the electric connection between the first connector housing and the second connector housing.4. The instrument as set forth in claim 1 , wherein each of ...

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Номер записи: 89
03-06-2021 дата публикации

Testing cable for voip, isdn, data, and analog communication

Номер: US20210165036A1
Автор: Oscar ARCIGA
Принадлежит: University of Southern California USC

A test cable is adapted to test punch down blocks used in voice or data communication wiring. The test cable includes a patch cable section having a plurality of wires surrounded by a sheath, a first adapter connected to an end of the patch cable section, a plurality of sub-cables that emerge from patch cable section, each sub-cable including a pair of wires continuing from the plurality of wires in the patch cable section, and a plurality of sub-cable adapters connected to the plurality of sub-cables. Characteristically, each sub-cable has a sub-cable adapted thereto. A method for applying the test cable is also provided.

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Номер записи: 90
18-05-2017 дата публикации

EVALUATION APPARATUS FOR SEMICONDUCTOR DEVICE AND EVALUATION METHOD FOR SEMICONDUCTOR DEVICE

Номер: US20170138984A1
Автор: NOGUCHI Takaya, Okada Akira
Принадлежит: Mitsubishi Electric Corporation

An evaluation apparatus for a semiconductor device includes: a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; and a plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from the surface of the chuck stage, and come into contact with an arrangement surface of the semiconductor device arranged in the chuck stage, wherein a height protruding from the surface of the chuck stage of at least one of the in-chuck probes is different from a height protruding from the surface of the chuck stage of the other in-chuck probe. 1. An evaluation apparatus for a semiconductor device comprising:a chuck stage that has a surface on which a plurality of probe holes are formed and sucks a semiconductor device; anda plurality of in-chuck probes that have first ends which are inserted into the respective probe holes, and second ends which protrude from said surface of said chuck stage, and come into contact with an arrangement surface of said semiconductor device arranged in said chuck stage, whereina height protruding from said surface of said chuck stage of at least one of said in-chuck probes is different from a height protruding from said surface of said chuck stage of other said in-chuck probe.2. The evaluation apparatus for a semiconductor device according to claim 1 , whereinheights protruding from said surface of said chuck stage of said in-chuck probes at a peripheral part of said chuck stage are higher than a height protruding from said surface of said chuck stage of said in-chuck probe at other part of said chuck stage.3. The evaluation apparatus for a semiconductor device according to claim 1 , whereina height protruding from said surface of said chuck stage of said in-chuck probe at the peripheral part of said chuck stage are lower than a height protruding from said surface of said chuck stage of said in-chuck probe at other part of ...

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Номер записи: 91
07-08-2014 дата публикации

System of redundant wires and connectors for picafina DBS and heart pacemaker electrical stimulating device implanted in animals including human animals

Номер: US20140222107A1
Автор: Chong Il Lee, Sergio Lara Pereira Monteiro
Принадлежит: Individual

A system to increase the reliability of the electrical connections between the electrodes and the battery/controlling electronics of an electrical stimulating device as DBS (Deep Brain Stimulator), heart pacemakers and the like. We disclose a redundant male/female connector and/or a set of redundant wires to improve the reliability of the connections between the electrodes at a first location and the battery/controlling electronics at a second location. The redundant male/female connector serves as a backup for a potential loss of electrical continuity due to the adverse effect of body fluids, and the redundant wires serve as a backup for potential loss of electrical continuity due to repetitive muscle movement causing wire movement and stress. DBS connecting wires, that ran behind the ear down the neck of the patient, are subjected to repetitive stresses due to neck twisting and therefore at high risk of breaking.

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Номер записи: 92
30-04-2020 дата публикации

TESTING DEVICE

Номер: US20200132723A1
Автор: Huang Chun-Yao, Lin Cheng-An
Принадлежит:

A testing device with enhanced accessibility for repair and replacement purposes includes a base, an upper seat, a test board and a needle seat. The upper seat is mounted on the base. The test board is sandwiched between the base and the upper seat. A receiving groove is defined on the upper seat. The receiving groove extends through the upper seat to partially expose the test board. The needle seat is detachably fixed to the upper seat. A lower part of the needle seat is received in the receiving groove and abuts against the test board. An upper portion of the needle seat protrudes from the upper seat and is configure for connecting connection terminals of a product to be tested. 1. A testing device , comprising:a base;an upper seat mounted on the base, wherein a receiving groove is defined on the upper seat;a test board sandwiched between the base and the upper seat; anda needle holder detachably fixed to the upper seat;wherein the receiving groove extends through the upper seat to partially expose the test board, a lower part of the needle holder is received in the receiving groove and abuts against the test board, and an upper portion of the needle holder protrudes from the upper seat and is configured for connecting connection terminals of a product to be tested.2. The testing device of claim 1 , wherein the receiving groove is U-shaped claim 1 , and is a concavity between adjacent side surfaces of the upper seat claim 1 , the receiving groove penetrates the upper seat.3. The testing device of claim 1 , wherein the needle holder comprises a fixing seat and a needle assembly claim 1 , the needle assembly is fixed to the upper seat by the fixing seat.4. The testing device of claim 3 , wherein the receiving groove is stepped claim 3 , and the fixing seat is fixed to a ladder surface in the receiving groove.5. The testing device of claim 4 , wherein the needle assembly comprises a fixing member claim 4 , an abutting member claim 4 , and a protruding member; the ...

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Номер записи: 93
09-05-2019 дата публикации

PROBE ASSEMBLY AND ENGAGED-TYPE CAPACITIVE PROBE THEREOF

Номер: US20190137544A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

The instant disclosure provides a probe assembly and an engaged-type capacitive probe thereof. The engaged-type capacitive probe includes a probe structure, a conductive structure and a dielectric structure. The probe structure has a probe body and a first engaging portion disposed on the probe body. The conductive structure is disposed on one side of the probe structure and has a second engaging portion corresponding to the first engaging portion. The conductive structure is disposed on the first engaging portion of the probe structure through the second engaging portion. The dielectric structure is disposed between the probe structure and the conductive structure. 1. An engaged-type capacitive probe , including:a probe structure having a probe body and a first engaging portion disposed on the probe body;a conductive structure disposed at one side of the probe structure, the conductive structure having a second engaging portion corresponding to the first engaging portion, the conductive structure being disposed on the first engaging portion of the probe structure through the second engaging portion; anda dielectric structure disposed between the probe structure and the conductive structure.2. The engaged-type capacitive probe according to claim 1 , wherein the probe structure has an exposed portion corresponding to the dielectric structure claim 1 , and the probe structure is electrically connected to the conductive structure through the exposed portion claim 1 , wherein the dielectric structure has a first surface in contact with the probe structure and a second surface in contact with the conductive structure.3. The engaged-type capacitive probe according to claim 1 , wherein the probe structure and the conductive structure are electrically insulated from each other claim 1 , and the dielectric structure has a first surface in contact with the probes structure and a second surface in contact with the conductive structure.4. The engaged-type capacitive probe ...

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Номер записи: 94
26-05-2016 дата публикации

CONTACT INSPECTION DEVICE

Номер: US20160146884A1
Автор: Nasu Mika
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

A contact inspection device includes: plural probes each having a first end to be brought into contact with a test object; a probe substrate including contact portions in contact with respective second ends of the probes; a probe head through which the probes extend and which is detachably attached to the probe substrate; and plural positioning members which are provided on a surface of the probe head facing the probe substrate and through which the probes extend. Each probe has a rotation restricted portion provided on the side of the second end. Each positioning member has rotation restricting portions adapted to engage the rotation restricted portions. When the positioning members are moved relative to each other, the rotation restricting portions align the probes and switch the probes from a rotation unrestricted state to a rotation restricted state. 1. A contact inspection device that performs contact inspection of a test object , comprising:plural probes each having a first end to be brought into contact with the test object;a probe substrate including contact portions in contact with respective second ends of the probes;a probe head through which the plural probes extend and which are detachably attached to the probe substrate; andplural positioning members which are provided on a surface of the probe head facing the probe substrate and through which the plural probes extend, whereineach of the probes has a rotation restricted portion provided on the side of the second end,each of the plural positioning members has rotation restricting portions adapted to engage the rotation restricted portions, andwhen the plural positioning members are moved relative to each other, the rotation restricting portions align the probes and switch the probes from a rotation unrestricted state to a rotation restricted state.2. The contact inspection device according to claim 1 ,wherein the rotation restricted portions have a polygonal shape, andwherein the rotation restricting ...

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Номер записи: 95
04-06-2015 дата публикации

Detection fixture for connector

Номер: US20150153403A1
Автор: Ju-Lan Hao
Принадлежит: Futaihua Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd

A detection fixture for a connector is provided. The fixture includes a first fixing block, a second fixing block fixed on the first fixing block, a probe, a probe cable, a controlling board coupled with the probe cable, and a computer device. The probe is coupled with the prove, includes a first portion fixed to the first fixing block and the second fixing block, and a second portion exposed to the first fixing block and contacting with a plurality of pins of the connector. The probe cable is fixed on the second fixing block and is coupled with the probe. The computer device is coupled with a connector cable of the connector, and is wirelessly coupled with probe.

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Номер записи: 96
10-06-2021 дата публикации

INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING

Номер: US20210175124A1
Автор: "OBrien Kevin", BLOCK Bruce, FISCHER Paul, INGERLY Doug, Jun Kimin, LIAO Szuya S., Mehandru Rishabh, MORROW Patrick, Rao Valluri R.
Принадлежит: Intel Corporation

Integrated circuit cell architectures including both front-side and back-side structures. One or more of back-side implant, semiconductor deposition, dielectric deposition, metallization, film patterning, and wafer-level layer transfer is integrated with front-side processing. Such double-side processing may entail revealing a back side of structures fabricated from the front-side of a substrate. Host-donor substrate assemblies may be built-up to support and protect front-side structures during back-side processing. Front-side devices, such as FETs, may be modified and/or interconnected during back-side processing. Electrical test may be performed from front and back sides of a workpiece. Back-side devices, such as FETs, may be integrated with front-side devices to expand device functionality, improve performance, or increase device density. 1. A method of electrical testing an integrated circuit (IC) die , the method comprising:aligning a back-side structure coupled through a back-side of the die to a first conductive pin of multiple conductive pins of a prober of an electrical test apparatus;contacting the first conductive pin to the back-side structure, wherein the back-side structure provides electrical coupling to a transistor terminal of a transistor device; andexecuting, while the first conductive pin is contacting the back-side structure, an electrical test algorithm on the die through at least the first conductive pin to generate electrical test data corresponding to the die.2. The method of claim 1 , further comprising:aligning a front-side structure coupled through a front-side of the die to a second conductive pin of multiple conductive pins of a second prober of the electric tester; andcontacting, while the first conductive pin is contacting the back-side structure, the second conductive pin to the front-side structure, wherein the front-side structure provides electrical coupling to a second transistor terminal of the transistor device and the ...

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Номер записи: 97
25-05-2017 дата публикации

Electronic test equipment

Номер: US20170146568A1
Автор: Cheng-Hui Lin, Chia-Pin Sun, Hsin-Chieh LU, Jun-Xian Liu
Принадлежит: WinWay Technology Co Ltd

An electronic test equipment is adapted to test an electronic component. The electronic component has a circuit body and a plurality of connectors that are electrically connected to the circuit body. The electronic test equipment includes a metallic test seat and a plurality of spring probes. The metallic test seat is adapted to support the circuit body thereon, and is formed with a plurality of spaced-apart probe holes extending therethrough and possessing diameters that are substantially the same. Each of the probe holes is adapted to receive a corresponding one of the connectors. The spring probes are respectively and entirely positioned within the probe holes, and are adapted to electrically contact the connectors.

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Номер записи: 98
07-05-2020 дата публикации

WIRING BOARD

Номер: US20200146146A1
Автор: JIN Guangzhu, KAMEGAI Masahiro, KIMATA Kouta, Kondo Yousuke, MATSURA Junya, NASU Takakuni, SHIRAKI Fumio, TANIMORI Kengo
Принадлежит:

A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer. 1. A wiring board comprising:an insulator layer composed mainly of ceramic;a conductor extending through the insulator layer in a thickness direction thereof; andan electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor,wherein:the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; andeach of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.2. The wiring board according to claim 1 , wherein the electrode pad further includes:a central part in which the through holes are formed; anda peripheral part surrounding the central part without involving the through holes.3. The wiring board according to claim 1 , wherein each of the through holes has quadrangular openings.4. The wiring board according to claim 1 , wherein the insulator layer is composed mainly of low temperature co-fired ceramic.5. The wiring board according to claim 1 , wherein:the insulator layer includes a void exposed on the first surface of the insulator layer; andone of the through holes is formed to overlap with the void in the thickness direction of the insulator layer. The present disclosure relates to a wiring board. Japanese Patent Application Publication 2009-74823 discloses a wiring board including a ceramic insulator layer and an electrode pad, wherein the electrode pad is disposed on a ...

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Номер записи: 99
09-06-2016 дата публикации

Wafer Level Integrated Circuit Contactor and Method of Construction

Номер: US20160161528A1
Автор: Edwards Jathan, Halvorson Brian, Marks Charles
Принадлежит:

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). The elastomer is precompressed from its natural rest state between a top () plate and a bottom (). Pre compression improves the resilient response of the pins. The pin crowns () are maintained relatively coplanar by the engagement of at least one flange (-) against an up-stop surface of plate thereby insuring coplanarity of the crowns. The pin guide () is maintained in alignment with the retainer by establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner. 1. A test contact pin assembly for temporary contact with a test pad on a wafer level integrated circuit device under test (DUT) comprising:a. at least one slideable upper terminal pin, further having, a top extension for contacting the DUT, portion, at least one lateral cross member flange and a contact surface; said upper pin being slideable between an out of test position and an in-test position;b. at least one lower terminal pin having a foot and a like contact surface;c. said upper and lower pins being held in contact by bias forces which maintain their respective contacts surfaces together but in a slideable relationship to each other;d. an elastomeric material of predetermined height when in an uncompressed state, said material surrounding the pins to create said bias force;e. a substantially rigid top pin guide surface located atop said elastomeric material, including a pair of spaced part parallel walls defining a guide channel for said flange, an upper wall between said parallel walls defining an up-stop surface for said pin and an aperture in said up-stop surface for receiving an extended portion of said upper pin which protrudes beyond said guide surface to make contact with said DUT, said channel being sized to be large ...

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Номер записи: 100