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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2183. Отображено 100.
05-01-2012 дата публикации

Electrical connecting apparatus and contacts used therefor

Номер: US20120003864A1
Автор: Kenji Sasaki, Satoshi Narita
Принадлежит: Micronics Japan Co Ltd

An electrical connecting apparatus 10 comprises: a base plate 16 provided on its underside 14 with a plurality of pedestals 12 at intervals in a front-back direction; and multiple contact groups, each of which has a first contact 18 and a second contact 19. Each first contact 18 includes a needle body portion 24 having a rear end portion 20 supported on the pedestal 12 and a front end portion 22 which is a free end and extending leftward. Each second contact 19 includes a needle body portion 25 having a rear end portion 21 supported on the pedestal 12 and a front end portion 23 which is a free end and extending rightward. When the first contact 18 is broken, the second contacts 19 can be used.

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Номер записи: 1
02-02-2012 дата публикации

Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies

Номер: US20120023730A1
Автор: Anna Litza, Douglas L. McKay, Erh-Kong Chieh, Fu Chiung Chong, Roman L. Milter, SHA Li, W.R. Bottoms
Принадлежит: Individual

Enhanced microfabricated spring contact structures and associated methods, e.g. such as for electrical contactors and interposers, comprise improvements to spring structures that extend from the substrate surface, and/or improvements to structures on or within the support substrate. Improved spring structures and processes comprise embodiments having selectively formed and etched, coated and/or plated regions, which are optionally further processed through planarization and/or annealment. Enhanced solder connections and associated processes provide a gap between substrates for componentry, and or improved manufacturing techniques using distributed spacers. Enhanced probe card assembly structures and processes provide improved planarization adjustment and thermal stability.

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Номер записи: 2
09-02-2012 дата публикации

In-process electrical connector

Номер: US20120032694A1
Автор: Imran Khan, James Hinkle, Modesto Sanchez, Thomas Truman
Принадлежит: Individual

Characteristics of partially assembled photovoltaic modules can be determined using electrical connection apparatuses and methods.

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Номер записи: 3
24-01-2013 дата публикации

Wafer prober integrated with full-wafer contacter

Номер: US20130021052A1
Автор: Morgan T. Johnson
Принадлежит: Advanced Inquiry Systems Inc

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

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Номер записи: 4
07-02-2013 дата публикации

Probing device

Номер: US20130033283A1
Автор: Chien-Chou Wu, Chung-Che LI, Ming-Chi Chen
Принадлежит: MPI Corp

A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

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Номер записи: 5
30-05-2013 дата публикации

Hybrid Electrical Contactor

Номер: US20130135001A1
Автор: Keith J. Breinlinger
Принадлежит: Formfactor Inc

An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

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Номер записи: 6
08-08-2013 дата публикации

Methods and Systems for Cleaning Needles of a Probe Card

Номер: US20130200914A1
Автор: Hwang In-Seok, KANG Sang-Boo, KIM Do-Yun
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles. 1. A method of cleaning needles of a probe card in a test system , the method comprising:mounting the probe card having a plurality of device under tests (DUTs) and needles in a card mounting part;scanning the DUTs and needles using a camera positioned in the test system to provide a scan result;focusing a laser beam on at least one of the needles based on the scan result; andirradiating the laser beam on the at least one of the needles to clean the at least one of the needles.2. The method of claim 1 , wherein the laser beam comprises a plurality of laser beams and the at least one needle comprises a plurality of needles and wherein focusing the laser beams comprises comparing the scan result with a stored image corresponding a case where the laser beams are focused on the needles and moving the laser beams or the probe card to focus the laser beams on the needles based on the comparison of the scan result and the stored image.3. The method of claim 2 , wherein irradiating the laser beams is followed by scanning the cleaned needles using the camera to provide a cleaning result image.4. The method of claim 3 , wherein scanning the cleaned needles is followed by:identifying ones of the needles that are not yet clean based on the cleaning result image; andrepeating focusing the laser beams and irradiating the laser beams to clean the identified ones of the needles that are not yet cleaned.5. The method of claim 4 , wherein identifying ones of the needles includes displaying the cleaning result ...

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Номер записи: 7
29-08-2013 дата публикации

WIRING BOARD AND PROBE CARD USING THE SAME

Номер: US20130222003A1
Автор: TAGUCHI Takayuki, TERADA Kenji
Принадлежит: KYOCERA SLC TECHNOLOGIES CORPORATION

A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability. 1. A wiring board comprising:a core substrate; anda buildup layer formed on the core substrate, a plurality of resin layers laminated on the core substrate;', 'a plurality of pads formed on a topmost layer of the resin layers and to which a plurality of probes are respectively connected;', 'a plurality of wiring conductors formed on either the resin layers or the core substrate and electrically connecting the plurality of pads individually to an external circuit;', 'a via conductor penetrating through the resin layer in a thickness direction thereof and electrically connecting the pad and the wiring conductor together; and', 'a dummy via conductor penetrating through the resin layer in the thickness direction thereof without electrically connecting the pad and the wiring conductor together,, 'wherein the buildup layer includeswherein the via conductor and the dummy via conductor are arranged immediately below each of the pads,the pads include a first pad with at least one of the dummy via conductors arranged immediately therebelow, and a second pad with only the via conductor arranged immediately therebelow, andwherein a total amount of the dummy via conductors and a quantity of the via conductors formed immediately below the first pad is equal to an amount of the via conductors formed immediately below the second pad.2. The wiring board according to claim 1 ,wherein the plurality of wiring conductors include a first wiring conductor electrically connected to the first pad, and a second wiring conductor positioned in a layer different from a layer in which the first wiring conductor is positioned and electrically connected to the second pad.3. The wiring board according to claim 1 ,wherein the first dummy via conductor and the first via conductor formed immediately below the first pad are distanced away from each other with the resin layer ...

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Номер записи: 8
10-10-2013 дата публикации

Probe Card And Manufacturing Method Therefor

Номер: US20130265073A1
Автор: Matsuda Kazuhiro, Nakano Hirofumi, Uemura Taishi
Принадлежит: Japan Electronic Materials Corporation

The present invention provides a ST board that is formed with an lower surface electrode ; a unit attachment plate that is fastened on the ST board and formed with an opening part exposing the lower surface electrode ; a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on the unit attachment plate ; and an electrically conductive wire that connects the lower surface electrode and the probe electrode to each other through the opening part . The probe unit can be fastened on the ST board with the unit attachment plate intervening, and through the opening part of the unit attachment plate , the probe electrode and the lower surface electrode can be electrically connected to each other. 1. A probe card comprising:a wiring substrate that is formed with an electrode terminal;a unit attachment plate that is fastened on said wiring substrate and formed with an opening part exposing said electrode terminal;a probe unit that includes a probe substrate formed with a contact probe and a probe electrode and is fastened on said unit attachment plate; andan electrically conductive wire that connects said electrode terminal and said probe electrode to each other through said opening part.2. The probe card according to claim 1 , wherein:two or more said electrode terminals are exposed from said opening part in common; andtwo or more said probe electrodes on said probe unit are respectively connected to corresponding ones of said electrode terminals through two or more electrically conductive wires passing through said opening part in common.3. The probe card according to claim 2 , wherein:two or more probe units are arranged on said unit attachment plate in common; andsaid opening part has a long narrow shape that extends along outer edge parts of said probe units.4. A probe card manufacturing method comprising:a step of fastening a probe substrate formed with a contact probe and a probe electrode on a unit attachment plate ...

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Номер записи: 9
17-10-2013 дата публикации

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

Номер: US20130271175A1
Автор: Powell Shawn
Принадлежит: FORMFACTOR, INC.

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. 1. A process for providing a custom electrically conductive terminal on a first surface of a wiring substrate , wherein said wiring substrate comprises electrically conductive vias from said first surface to an opposite surface of said wiring substrate , said process comprising:forming a hole at a first one of said vias from said first surface into said wiring substrate and thereby removing all electrically conductive material of said first via in a gap from said first surface into said wiring substrate;depositing an electrically insulating material into said hole such that said electrically insulating material is disposed between all remaining electrically conductive material of said first via and said first surface of said wiring substrate; andproviding on said first surface of wiring substrate and said insulating material said custom terminal such that said custom terminal overlaps said first via and a second one of said vias that is adjacent to said first via without electrically contacting said first via.2. The process of claim 1 , wherein said custom terminal overlaps said first via and said second via and a third one of said vias.3. The process of ...

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Номер записи: 10
24-10-2013 дата публикации

METHOD FOR THERMAL STABILIZATION OF PROBE CARD AND INSPECTION APPARATUS

Номер: US20130278279A1
Автор: ISHII Kazunari, Koizumi Shinya, Matsuzaki Koichi, Watanabe Tetsuji
Принадлежит: TOKYO ELECTRON LIMITED

In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable. 1. A method for thermal stabilization of a probe card by using an inspection apparatus including: a horizontally and vertically movable mounting table; a probe card having a plurality of probes , disposed above the mounting table; a vertical drive mechanism configured to vertically move the mounting table; a temperature control unit configured to control a temperature of the mounting table; and a control unit configured to control the vertical drive mechanism and the temperature control unit , wherein before inspecting electrical characteristics of an inspection target at a predetermined temperature , the probe card is thermally stabilized by mounting a heat transfer substrate on the mounting table , adjusting the probe card to a predetermined temperature through the heat transfer substrate on the mounting table of which temperature is adjusted by the temperature control unit , and controlling a contact load between the heat transfer substrate and the probes to a predetermined target load by vertically moving the mounting table through the vertical drive mechanism , the method comprising:a first step of mounting the heat ...

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Номер записи: 11
16-01-2014 дата публикации

HIGH FREQUENCY PROBE CARD

Номер: US20140015561A1
Автор: Chang Chia-Tai, CHANG Keng-Shieng, CHEN Chiu-Kuei, HUANG Yun-Ru, LAI Chien-Chang, TSAI Chin-Yi, Yang Chin-Tien, YANG Hui-Pin, YU Chen-Chih
Принадлежит:

A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. 1. A high frequency probe card comprising:at least one substrate each having at least one first opening;an interposing plate disposed on the at least one substrate and provided with at least one second opening corresponding to the at least one first opening respectively;a circuit board disposed on the interposing plate and provided with a third opening corresponding to the at least one first opening and the at least one second opening; and at least one N-type ground probe; and', an N-type signal probe; and', 'a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe; wherein an insulation layer is disposed between the N-type signal probe and the first conductor., 'at least one high frequency signal probe penetrating through the corresponding at least one substrate and the interposing plate, passing through the third opening and being electrically connected with the circuit board; each said high frequency signal probe comprising], 'at least one probe module disposed on the at least one substrate ...

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Номер записи: 12
30-01-2014 дата публикации

Probe Card Assemblies And Probe Pins Including Carbon Nanotubes

Номер: US20140028342A1
Автор: Brandorff Alexander
Принадлежит:

A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes. 1. A probe card assembly for testing circuit boards comprising:a multi-layered dielectric plate aligned with an integrated circuit, said integrated circuit having arrayed upon its surface a first plurality of electrical contacts arranged in a pattern, said dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching said first plurality of electrical contacts;a carbon nanotube interposer interposed between said dielectric plate and said integrated circuit, said nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on said integrated circuit and said dielectric plate; anda plurality of substantially non-compliant vertical probes arrayed in a pattern upon said nanotube interposer and joined with said nanotubes, said vertical probes making electrical contact with said first plurality of electrical contacts and said second plurality of electrical ...

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Номер записи: 13
27-02-2014 дата публикации

Integrated Circuit Die Having Input and Output Circuit Pads, Test Circuitry, and Multiplex Circuitry

Номер: US20140055158A1
Автор: Hales Alan, Whetsel Lee D.
Принадлежит: TEXAS INSTRUMENTS INCORPORATED

Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible. 1. An integrated circuit die comprising:A. input and output circuit pads;B. core circuits having core input leads and core output leads coupled with the input and output circuit pads; i. a core input lead;', 'ii. a first circuit pad lead connected with a first circuit pad;', 'iii. a second circuit pad lead connected with a second circuit pad;', 'iii. a tristate output buffer having an input connected with the core input lead, an output connected with the first circuit pad lead, and a control input;', 'iv. compare circuitry having a first input connected with the core input lead, a second input connected with the first circuit pad lead, a third input coupled with the second circuit pad lead, a scan input, a scan output, and a scan control input; and, 'C. test circuitry havingD. multiplex circuitry having inputs connected to core output leads of the core circuits, a core select input, and a selected core output connected to the core input lead of the compare circuitry.2. The integrated ...

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Номер записи: 14
03-04-2014 дата публикации

PROBE CARD FOR CIRCUIT-TESTING

Номер: US20140091827A1
Автор: HUNG Chien-Yao
Принадлежит: Hermes-Epitek Corp.

A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes. 1. A probe card for circuit-testing c comprising:a testing print circuit board;a probe head having a plurality of probes provided with a fine pitch arrangement and held inside; anda silicon interposer substrate for conveying signals between said probes and said test PCB, wherein the interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process; a plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate; the pitch between said upper terminals is larger than the pitch between said lower terminals; and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes.2. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon interposer substrate comprises:a silicon substrate with a TSV conductive structure; anda redistribution layer arranged on the upper surface of said silicon substrate, wherein said upper terminals are arranged on the upper surface of said redistribution layer.3. The probe card for circuit-testing as claimed in claim 1 , wherein said silicon ...

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Номер записи: 15
05-01-2017 дата публикации

ORGANIC PROBE SUBSTRATE

Номер: US20170003318A1
Автор: Audette David M., CHEY Sukjay J., Cordes Steven A., FORTIN Anthony D., Gardell David L., III Frederick H., III John R., Maher, RAJALINGAM Sankeerth, ROY
Принадлежит:

An organic probe substrate structure includes a daughter card; an organic laminate attached to the daughter card; and multiple probes built onto a top surface of the organic laminate. 1. A method of manufacturing an organic probe substrate structure comprising:attaching an organic laminate to a daughter card;planarizing a top surface of the organic laminate after attaching the organic laminate to the daughter card; andbuilding a plurality of probes on top of the organic laminate.2. The method of claim 1 , wherein planarizing the top surface of the organic laminate comprises milling a sacrificial layer on the top surface of the organic laminate.3. The method of claim 2 , wherein the top surface is planar.4. The method of claim 1 , wherein the daughter card includes a ledge on each side claim 1 , each of which includes a fastening hole claim 1 , wherein when mounted claim 1 , the daughter card is unsupported at corners of the daughter card.5. The method of claim 1 , wherein the attaching the organic laminate to the daughter card is through solder connection.6. The method of claim 5 , further comprising applying soldering paste on a bottom surface of the organic laminate and a top surface of the daughter card claim 5 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter cards via the solder paste.7. The method of claim 6 , further comprising applying a filling material between the organic laminate claim 6 , the daughter card claim 6 , and about a plurality of solder connections.8. The method of claim 1 , wherein attaching the organic laminate to the daughter card further comprises attaching the organic laminate to the daughter card using a solder reflow process.9. The method of claim 1 , wherein the daughter card includes a plurality of through vias.10. The method of claim 9 , wherein the organic laminate includes a plurality of probe vias on a pitch that is less than a pitch of the through vias ...

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Номер записи: 16
02-01-2020 дата публикации

Probe Card Support Apparatus for Automatic Test Equipment

Номер: US20200003803A1
Автор: Nelson Scott
Принадлежит:

Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other. 1. A test head comprising:a probe card support apparatus;wherein the probe card support apparatus is configured to be positioned over a device under test (DUT) area of a probe card and provide stiffening support and planarization to the DUT area of the probe card; andwherein the test head is configured to be used with an automated test unit to test electronic components.2. The test head of comprising a probe card locking frame claim 1 , wherein the probe card support apparatus is positioned in a center area of the probe card locking frame.3. The test head of wherein the probe card support apparatus is configured to be connected to the probe card over the DUT area.4. The test head of wherein the probe card support apparatus comprises a fastener configured to be positioned over the DUT area of the probe card and connect the probe card support apparatus to the probe card.5. The test head of wherein the probe card support apparatus comprises a planar surface configured to contact an opposing planar surface on the probe card and planarize the test head relative to the probe card.6. The test head of wherein the test head comprises a fastener configured to connect the test head to a wafer prober.7. The test head of wherein the test head includes a planar surface configured to contact an opposing planar surface on the wafer prober to planarize the test head relative to ...

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Номер записи: 17
20-01-2022 дата публикации

INSPECTION APPARATUS AND CONTROL METHOD FOR INSPECTION APPARATUS

Номер: US20220018889A1
Автор: NAKAYAMA Hiroyuki
Принадлежит:

An inspection apparatus includes a stage on which a substrate having an inspection target is placed, a probe card, a light irradiator, and a controller. The probe card has probes that supply a current to the inspection target. The light irradiator irradiates light to heat the substrate. The controller controls the light irradiator to excecute uniformly heating the inspection target by the light from the light irradiator, and heating an outer peripheral portion of the inspection target by the light from the light irradiator. 1. An inspection apparatus comprising:a stage on which a substrate having an inspection target is placed;a probe card having probes that supply a current to the inspection target;a light irradiator to irradiate light to heat the substrate; and uniformly heat the inspection target by the light from the light irradiator, and', 'heat an outer peripheral portion of the inspection target by the light from the light irradiator., 'a controller to control the light irradiator configured to2. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on heat generation of the inspection target.3. The inspection apparatus of claim 1 , wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on an internal variables for controlling the light irradiator.4. The inspection apparatus of claim 1 , further comprising:a tester connected to the probe card to inspect the inspection target,wherein the uniformly heating of the inspection target is switched to the heating of the outer peripheral portion of the inspection target by the controller based on a signal from the tester that indicates start of the inspection of the inspection target.5. The inspection apparatus of claim 1 , further comprising:a tester connected to the ...

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Номер записи: 18
08-01-2015 дата публикации

ELECTRIC CONNECTING APPARATUS

Номер: US20150008946A1
Автор: ARAI Osamu, Inoue Tatsuo, KIYOFUJI Hidehiro
Принадлежит:

An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

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Номер записи: 19
10-01-2019 дата публикации

METHOD FOR PRODUCING PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS

Номер: US20190011484A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. 1. A method , comprising:inserting a probe body made electrically conductive materials in an opening of a support such that an end of the probe body is exposed from said opening;polishing the exposed end of the probe body;depositing an electrically conductive contact region having a first hardness value equal to or greater than 300 HV to the polished exposed end of the probe body.2. The method of claim 1 , wherein depositing comprises forming a conductive layer directly on said polished exposed end of the probe body.3. The method of claim 2 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 2 , manganese claim 2 , palladium claim 2 , cobalt claim 2 , rhodium claim 2 , iron claim 2 , molybdenum claim 2 , iridium claim 2 , ruthenium claim 2 , tungsten claim 2 , rhenium and alloys thereof.4. The method of claim 1 , wherein depositing comprises:forming at least one support conductive layer directly on said polished exposed end of the probe body; andforming a conductive layer directly on said at least one support conductive layer.5. The method of claim 4 , wherein said conductive layer is formed by a conductive layer made of a material selected from the group consisting of nickel claim 4 , manganese claim 4 , palladium claim 4 , cobalt claim 4 , rhodium claim 4 , iron claim 4 , molybdenum claim 4 , iridium claim ...

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Номер записи: 20
15-01-2015 дата публикации

SIGNAL PATH SWITCH AND PROBE CARD HAVING THE SIGNAL PATH SWITCH

Номер: US20150015295A1
Автор: Chen Wei, Chou Kuang-Chung, HUANG Chun-Chung, Ku Wei-Cheng, LAI JUN-LIANG, Liu Hsin-Hsiang
Принадлежит: MPI corporation

A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively. 1. A signal path switch , which is provided between a tester and two probes , comprising:two first electrical lines electrically connected to the probes respectively;two second first electrical lines electrically connected to the first electrical lines respectively;two inductive elements, each of which is electrically connected each of the first electrical lines and the tester respectively; anda capacitor having opposite ends electrically connected to the second first electrical lines respectively.2. The signal path switch of claim 1 , further comprising a substrate claim 1 , wherein the substrate is provided with the first electrical lines claim 1 , the second electrical lines claim 1 , the inductive elements claim 1 , and the capacity.3. The signal path switch of claim 2 , wherein the substrate has a first board and a second board; the first board is provided with the first electrical lines claim 2 , the second electrical lines claim 2 , and the capacity claim 2 , and the second board is provided with the inductive elements; the first board is connected to the second board.4. The signal path switch of claim 2 , wherein the inductive elements are embedded in the substrate.5. The signal path switch of claim 2 , wherein the capacitor is embedded in the substrate.6. The signal path switch of claim 2 , wherein the inductive elements are fixed to a surface of the substrate by welding.7. The signal path switch of ...

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Номер записи: 21
03-02-2022 дата публикации

Connecting device for inspection

Номер: US20220034821A1
Автор: Minoru Sato
Принадлежит: Micronics Japan Co Ltd

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

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Номер записи: 22
03-02-2022 дата публикации

METHOD AND APPARATUS FOR JUDGING ABNORMALITY OF PROBE CARD

Номер: US20220034939A1
Автор: YANG Cheng-Jer
Принадлежит: CHANGXIN MEMORY TECHNOLOGIES, INC.

A method for judging abnormality of a probe card includes: a unit failure rate of chips at the same test position in each measurement unit is obtained, and whether the unit failure rate of the chips at the same test position respectively meets the first abnormality condition is judged; when the unit failure rate of the chips at the same test position of each measurement unit meets a first abnormality condition, whether a test sequence for the measurement units meeting the first abnormality condition meets a second abnormality condition is judged; and when the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, it is determined that the probe card is abnormal. 1. A method for judging abnormality of a probe card , comprising:selecting measurement units, and obtaining a unit failure rate of chips at a same test position in each measurement unit respectively;judging whether the unit failure rate of the chips at the same test position of each measurement unit respectively meets a first abnormality condition;when the unit failure rate of the chips at the same test position of any one measurement unit meets the first abnormality condition, judging whether a test sequence for measurement units meeting the first abnormality condition meets a second abnormality condition; andwhen the test sequence for the measurement units meeting the first abnormality condition meets the second abnormality condition, determining that the probe card is abnormal.2. The method for judging the abnormality of the probe card of claim 1 , wherein said selecting the measurement units and obtaining the unit failure rate of the chips at the same test position in each measurement unit respectively comprises:selecting the measurement units and detecting failed chips in each measurement unit respectively;obtaining a number of the failed chips at the same test position in each measurement unit; andcalculating the unit failure rate of the ...

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Номер записи: 23
03-02-2022 дата публикации

Inspection method and inspection system

Номер: US20220034959A1
Автор: Hiroshi Kamiya, Osamu Arai
Принадлежит: Micronics Japan Co Ltd

An inspection method includes a step S20 of electrically connecting electrical signal terminals of a semiconductor device to electric connectors, and optically connecting optical signal terminals of the semiconductor device to optical connectors, a step S30 of measuring a test light output signal output from a monitoring element provided in an inspection object in response to a test input signal having been input to the monitoring element while adjusting conditions of a position and an inclination of the inspection object, and extracting conditions in which an optical intensity of the test light output signal is a predetermined determination value or greater as inspection conditions, and a step S40 of inspecting the semiconductor device under the inspection conditions.

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Номер записи: 24
18-01-2018 дата публикации

Prober

Номер: US20180017594A1
Автор: Hiroo Tamura
Принадлежит: Tokyo Seimitsu Co Ltd

Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo frame attached to a head stage. A wafer chuck is moved toward a probe card while being fixed to a Z-axis movement-rotation unit in a detachable manner, and the wafer chuck is drawn toward the probe card by reducing pressure in an air-tight space formed between the wafer chuck and the probe card using a pressure reducing unit. Then, an electrical inspection of a wafer is performed while the test head, the pogo frame, the probe card, and the wafer chuck are integrated with respect to the head stage.

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Номер записи: 25
18-01-2018 дата публикации

APPARATUS FOR CLAMPING A PROBE CARD AND PROBE CARD INCLUDING THE SAME

Номер: US20180017595A1
Автор: JOO Jae-Hoon, KANG Sang-Boo, KIM Jae-Geun, KIM Sung-Hyup, Na Jeong-min, Park Jae-Hyoung, Park Sung-Yong, YOO Sang-Kyu
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased. 1. An apparatus configured to clamp a probe card , the apparatus comprising:a body portion between a printed circuit board (PCB) of the probe card and a test head;an inner clamping portion integrally formed with an upper surface of the body portion and configured to affix a central portion of the PCB to the test head; anda plurality of outer clamping portions integrally formed with a side surface of the body portion to affix a portion of the PCB to the test head, the plurality of outer clamping portions configured to surround the central portion of the PCB.2. The apparatus of claim 1 , wherein the inner clamping portion includes a protrusion configured to protrude from the side surface of the body portion claim 1 , the protrusion having a slant lower surface.3. The apparatus of claim 2 , wherein the inner clamping portion has a gradually decreasing thickness in a radius direction of the body portion.4. The apparatus of claim 1 , wherein the plurality of outer clamping portions are configured to radially extend from a center point of the body portion.5. The apparatus of claim 1 , wherein at least two of the plurality of outer clamping portions are spaced apart from each other by a substantially similar angle.6. The apparatus of claim 1 , ...

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Номер записи: 26
17-01-2019 дата публикации

SUBSTRATE FOR MOUNTING LIGHT EMITTING DIODES WITH TESTING CAPABILITIES

Номер: US20190018057A1
Автор: Pappas Ilias
Принадлежит:

Embodiments relate to testing LEDs by applying a voltage difference between anode electrodes and cathode electrodes of the LEDs using transistors and probe pads and determining whether the LEDs satisfy a threshold level of operability. A final substrate has transistors that apply the voltage difference to the LEDs via conductive traces and probe pads during testing mode. A gate voltage is applied to gate terminals of the transistors, a first voltage is applied to anode electrodes of the LEDs, and a second voltage is applied to cathode electrodes of the LEDs. After applying the voltages, turning on of the LEDs is observed. Embodiments also relate to testing current leakage in the final substrate with the transistors and the LEDs. 1. A method comprising:picking up at least one light emitting diode (LED) from a first substrate;placing the at least one LED onto a second substrate with one or more cathode electrodes and one or more anode electrodes of the at least one LED connected to conductive components on the second substrate;applying a voltage difference between the one or more anode electrodes and the one or more cathode electrodes of the at least one LED placed on the second substrate via one or more transistors and one or more conductive traces in the second substrate; anddetermining whether the at least one LED satisfies a threshold level of operability responsive to applying the voltage difference.2. The method of claim 1 , wherein applying the voltage difference comprises:applying a gate voltage to one or more first probe pads on the second substrate to turn on the one or more transistors;applying a first voltage to the one or more anode electrodes of the at least one LED via one or more second probe pads on the second substrate and the one or more transistors; andapplying a second voltage to the one or more cathode electrodes of the at least one LED via one or more third probe pads on the second substrate, the second voltage lower than the first voltage.3. ...

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Номер записи: 27
16-01-2020 дата публикации

Intermediate Connection Member and Inspection Apparatus

Номер: US20200018778A1
Автор: FUJIHARA Jun, Sakamoto Hiroaki
Принадлежит:

There is provided an intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals, respectively, the intermediate connection member including: a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; and a pogo frame having an insertion hole into which the pogo block is inserted, wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, and wherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole. 1. An intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals , respectively , the intermediate connection member comprising:a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; anda pogo frame having an insertion hole into which the pogo block is inserted,wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, andwherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole.2. The intermediate connection member of claim 1 , wherein the pogo block is formed in a rectangular shape having a long side and a short side in a plan view claim 1 , andwherein the positioning ...

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Номер записи: 28
16-01-2020 дата публикации

PROBE, INSPECTION JIG, AND INSPECTION APPARATUS

Номер: US20200018779A1
Автор: Chia Matthias Joseph Chin Chieh, Hayashi Akio, Kato Minoru, MIYATAKE Tadakazu, NAGANUMA Masaki, Ong Cheng Ghee, Singh Raminderjit
Принадлежит:

A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe. 1. A probe having a bar-like shape , comprising:a distal end portion with a columnar shape adapted to be in contact with an inspection point provided on a device under test;a base end portion on an opposite side of the distal end portion; anda main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion,wherein the distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.2. The probe according to claim 1 , wherein claim 1 , on both edge portions on lateral sides of the distal end surface claim 1 , chamfered surfaces that communicate with a circumferential surface of the distal end portion and that are tapered are formed.3. The probe according to claim 1 , wherein a width direction of the distal end surface and a width direction of the main body portion formed in the ribbon shape are in an equal direction.4. The probe according to claim 1 , wherein a width direction of the distal end surface and a width direction of the main body portion formed in the ribbon shape are perpendicular to each other.5. The probe according to claim 1 , wherein the main body portion is curved to protrude in a direction perpendicular to a wide width surface formed in the ribbon shape.6. An inspection jig comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a plurality of probes each of which ...

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Номер записи: 29
19-01-2017 дата публикации

MULTILAYER CIRCUIT BOARD AND PROBE CARD INCLUDING THE SAME

Номер: US20170019990A1
Автор: OTSUBO Yoshihito, TAKEMURA Tadaji
Принадлежит:

A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers, a resin multilayer body on the ceramic multilayer body that is a stack of multiple resin layers, conductive vias in the uppermost ceramic layer, and conductive vias in the lowermost resin layer. The upper end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body. The lower end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body and directly connected to the upper end faces of the conductive vias in the uppermost ceramic layer. The lower end faces of the conductive vias on the resin layer side are within the upper end faces of the conductive vias on the ceramic layer side in plan view. 1. A multilayer circuit board comprising:a ceramic multilayer body comprising a stack of a plurality of ceramic layers;a resin multilayer body on the ceramic multilayer body, the resin multilayer body comprising a stack of a plurality of resin layers;a first interlayer coupling conductor in an uppermost one of the ceramic layers, an upper end face thereof being exposed on an interface between the ceramic and resin multilayer bodies; anda second interlayer coupling conductor in a lowermost one of the resin layers, a lower end face thereof being exposed on the interface between the ceramic and resin multilayer bodies and directly connected to the upper end face of the first interlayer coupling conductor,wherein the lower end face of the second interlayer coupling conductor is within the upper end face of the first interlayer coupling conductor in plan view.2. The multilayer circuit board according to claim 1 , further comprising a circuit layer between any two of the resin layers claim 1 , the circuit layer having a planar electrode pattern that overlaps the resin multilayer body in plan view except at a periphery of the resin multilayer body.3 ...

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Номер записи: 30
26-01-2017 дата публикации

CONTACT-DISTANCE TRANSFORMER, ELECTRICAL TESTING DEVICE, AND METHOD FOR PRODUCING A CONTACT-DISTANCE TRANSFORMER

Номер: US20170023615A1
Автор: Ekin Cetin
Принадлежит: FEINMETALL GMBH

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure. 125-. (canceled)26. A contact-distance transformer of an electric testing device for testing an electric specimen ,a non-electrically conductive supporting structure provided with a first side and a second side, the first side having first electric contacts positioned at a first contact distance to each other, the second side having second electric contacts positioned at a contact distance to each other which is smaller than the first contact distance, the first electric contacts connected to the second electric contacts by electric connections passing through the support structure and/or positioned on the support structure,wherein both the support structure and the electric connections are formed as 3D-printed components, andwherein the contact-distance transformer is used to reduce a distance between neighboring electric contacts.27. The contact-distance transformer according to claim 26 , wherein the first and/or second electric contacts are also formed as 3D-printed components.28. The contact-distance transformer according to claim 26 , wherein at least a first and/or at least a second contact are formed by the front surface of at least one of the electric connections.29. The contact-distance transformer according to claim 26 , wherein the transformer is formed exclusively of 3D-printed components.30. The contact-distance transformer according to claim 26 , wherein the ...

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Номер записи: 31
25-01-2018 дата публикации

PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES WITH ENHANCED FILTERING PROPERTIES

Номер: US20180024167A1
Автор: MAGGIONI Flavio
Принадлежит:

A probe card for a testing apparatus of electronic devices comprises at least one testing head housing a plurality of contact probes, each contact probe having at least one contact tip abutting onto contact pads of a device under test, as well as at least one space transformer realizing a spatial transformation of the distances between contact pads made on its opposite sides and connected by means of suitable conductive tracks or planes, as well as a plurality of filtering capacitors provided between the space transformer and a PCB, which comprises direct conductive tracks or planes contacting conductive portions of the filtering capacitors. 1. A probe card for a testing apparatus of electronic devices comprises:a testing head housing a plurality of contact probes having respective contact tips configured to abut onto contact pads of a device under test, and first contact pads made on a first side of the space transformer;', 'second contact pads made on a second side, opposite to the first side, of the space transformer; and', 'conductive tracks or planes connecting at least some of the first contact pads to the second contact pads,', 'the space transformer realizing a spatial transformation of distances between the first contact pads and distances between the second contact pads,, 'a space transformer comprisinga printed circuit board (PCB),a first plurality of filtering capacitors provided between the space transformer and the PCB,wherein the PCB comprises direct conductive tracks or planes electrically contacting conductive portions of the filtering capacitors.2. The probe card of claim 1 , wherein at least some of the the conductive tracks or planes of the space transformer electrically contact the conductive portions of the filtering capacitors claim 1 , a combination of the conductive tracks or planes of the space transformer claim 1 , the direct conductive tracks or planes of the PCB claim 1 , and the conductive portions allowing a signal transmission between ...

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Номер записи: 32
10-02-2022 дата публикации

PROBE MODULE HAVING MICROELECTROMECHANICAL PROBE AND METHOD OF MANUFACTURING THE SAME

Номер: US20220043027A1
Автор: HSU Ming-Ta, HSU Yu-Chen, KU Ya-Fan, LIU Bang-Shun, TANG Fuh-Chyun, Wang Yu-Wen, WEI Shao-Lun
Принадлежит: MPI corporation

A probe module includes a circuit board and at least one probe formed on a probe installation surface of the circuit board by a microelectromechanical manufacturing process and including a probe body and a probe tip. The probe body includes first and second end portions and a longitudinal portion having first and second surfaces facing toward opposite first and second directions. The probe tip extends from the probe body toward the first direction and is processed with a gradually narrowing shape by laser cutting. The first and/or second end portion has a supporting seat protruding from the second surface toward the second direction and connected to the probe installation surface, such that the longitudinal portion and the probe tip are suspended above the probe installation surface. The probe has a tiny pinpoint for detecting tiny electronic components, and its manufacturing method is time-saving and high in yield rate. 1. A probe module comprising:a circuit board having a probe installation surface; andat least one microelectromechanical probe formed on the probe installation surface of the circuit board by a microelectromechanical manufacturing process, the microelectromechanical probe comprising a probe body and a probe tip, the probe body comprising a first end portion, a second end portion, a longitudinal portion extending from the first end portion to the second end portion along a longitudinal axis, and a probe tip seat having a top surface, the longitudinal portion having a first surface facing toward a first direction substantially perpendicular to the longitudinal axis and a second surface facing toward a second direction opposite to the first direction, the probe tip extending from a part of the top surface of the probe tip seat of the probe body toward the first direction and being processed with a gradually narrowing shape by laser cutting in a way that the probe tip has a pinpoint, and a slot is formed on the top surface of the probe tip seat adjacent ...

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Номер записи: 33
24-01-2019 дата публикации

PROBER AND PROBER OPERATION METHOD

Номер: US20190025342A1
Автор: MORI Toshiro, NISHIDA TOMOYA
Принадлежит:

A prober for preventing a collision between a probe and a probe position detecting camera and a prober operation method are provided. A prober that performs an inspection by bringing a probe into contact with an electrode of a wafer W includes: a probe position detecting camera for detecting the position of the tip of the probe to perform relative positional alignment between the electrode of the wafer W and the probe; a probe height detector, provided separately from the probe position detecting camera, for detecting the height of the tip of the probe from a reference plane serving as a reference for the height of the probe position detecting camera; and a first height adjusting mechanism for changing the height of the probe position detecting camera from the reference plane, based on the detection result of the probe height detector. 1. A prober for performing an inspection by bringing a probe into contact with an electrode of a wafer arranged to face the probe , the prober comprising:a probe position detecting camera configured to detect positions of a tip of the probe including a position in a direction on a horizontal plane and a height position in a direction perpendicular to the horizontal plane, at a position facing the probe; anda probe height detector provided integrally with the probe position detecting camera and configured to detect a height position of the tip of the probe, at a position facing the probe.2. The prober according to claim 1 , further comprisinga height adjusting mechanism configured to change the height of the probe position detecting camera from a reference plane serving as a reference for a height of the probe position detecting camera, based on a detection result by the probe height detector.3. The prober according to claim 1 ,wherein the probe height detector includes a variable differential transformer configured to detect contact of the tip of the probe.4. The prober according to claim 1 ,wherein the probe height detector is a ...

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Номер записи: 34
29-01-2015 дата публикации

PROBE APPARATUS

Номер: US20150028907A1
Автор: Inomata Isamu, KATO Yoshiyasu, NAGASAKA Munetoshi, SHINOHARA Eiichi, Yano Kazuya
Принадлежит:

A probe apparatus of inspecting electrical characteristics of a power device having electrodes on both sides of a substrate at wafer level can reduce and uniformize a contact resistance between the electrode on a rear surface of the substrate and a mounting surface conductor of a chuck top. In the probe apparatus, an attracting device supports a semiconductor wafer W on the chuck top and has many vertical fine holes in a pattern (diameter φ and pitch p) that satisfies the condition of φ Подробнее

Номер записи: 35
23-01-2020 дата публикации

High density and fine pitch interconnect structures in an electric test apparatus

Номер: US20200025801A1
Автор: Joe Walczyk, Mark Bohr, Pooya Tadayon
Принадлежит: Intel Corp

An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

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Номер записи: 36
28-01-2021 дата публикации

Evaluation Apparatus for Semiconductor Device

Номер: US20210025936A1
Автор: FUJIMURA Toru, HIRANO Ryo, KAGEYAMA Akira, KATO Shigehiko, KOMORI Masaaki, Mizuno Takayuki, Nara Yasuhiko, OHKI Katsuo, Ohtaki Tomohisa
Принадлежит:

As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology. 1. An evaluation apparatus for a semiconductor device , comprising:an electron source; anda plurality of probes, whereinthe plurality of probes are arranged in a fan shape.2. The evaluation apparatus for a semiconductor device according to claim 1 , whereinthe number of the probes is four.3. The evaluation apparatus for a semiconductor device according to claim 2 , whereintips of the four probes are arranged in a fan shape.4. The evaluation apparatus for a semiconductor device according to claim 1 , whereinthe plurality of probes are tungsten probes.5. The evaluation apparatus for a semiconductor device according to claim 1 , further comprising:a sample holder, whereinthe sample holder fixes a semiconductor wafer with an electrostatic chuck.6. An evaluation apparatus for a semiconductor device claim 1 , comprising:an electron source; andon one surface of a cantilever, a protrusion including a first metal surface and a first wiring connected to the first metal surface; and a probe including a conductive layer on the other surface of the cantilever.7. The evaluation apparatus for a semiconductor device according to claim 6 , whereinthe protrusion includes a second metal surface ...

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Номер записи: 37
02-02-2017 дата публикации

PROBE CARD FOR TESTING INTEGRATED CIRCUITS

Номер: US20170030966A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

A probe card is adapted for testing at least one integrated circuit that integrated on a corresponding at least one die of a semiconductor material wafer. The probe card includes a board adapted for the coupling to a tester apparatus. Several probes are coupled to the board. The probe card includes replaceable elementary units, wherein each unit includes at least one probe for contacting externally-accessible terminals of an integrated circuit under test. The replaceable elementary units are arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested. 1. An apparatus , comprising:a probe test circuit formed by a semiconductor die diced from a semiconductor wafer, said semiconductor die having a first surface and a second surface opposite the first surface, and a probe disposed on the first surface,wherein the second surface of said semiconductor die is configured for attachment to a probe card; andan electrical connection provided to electrically connect said probe to said probe card.2. The apparatus of claim 1 , wherein the electrical connection is a via extending through the semiconductor die from the first surface to the second surface.3. The apparatus of claim 1 , wherein the probe comprises a Micro Electro Mechanical Systems cantilever probe disposed on the first surface.4. The apparatus of claim 1 , wherein said second surface is configured for flip-chip mounting to a printed circuit board of said probe card.5. The apparatus of claim 1 , wherein said second surface is configured for mounting to a printed circuit board of said probe card with a wire bond.6. An apparatus claim 1 , comprising:a printed circuit board;a semiconductor die diced from a semiconductor wafer having a first surface and a second surface opposite the first surface;a plurality of probes disposed on the first surface;wherein said semiconductor die is mounted to the printed circuit board; andmeans for ...

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Номер записи: 38
17-02-2022 дата публикации

PROBE CARD AND MANUFACTURING METHOD THEREFOR

Номер: US20220050126A1
Автор: Ahn Bum Mo, Byun Sung Hyun, Park Seung Ho
Принадлежит:

Proposed are a probe card for performing a circuit test of a wafer and a manufacturing method therefor. More particularly, proposed are a probe card and a manufacturing method therefor, in which the process of inserting probe pins is eliminated. 1. A probe card comprising:a probe pin including a horizontal portion and a vertical portion; anda probe pin support member including an anodic aluminum oxide film sheet supporting the horizontal portion from a top surface thereof, and a through-hole allowing the vertical portion to pass therethrough.2. The probe card of claim 1 , wherein the vertical portion protrudes over a bottom portion of the probe pin support member.3. The probe card of claim 1 , wherein the vertical portion has a smaller width than the through-hole.4. The probe card of claim 1 , further comprising:a space transformer including a connection pad,wherein the connection pad is electrically connected to the horizontal portion.5. The probe card of claim 4 , wherein the space transformer is formed by stacking a plurality of anodic aluminum oxide film sheets.6. A method of manufacturing a probe card claim 4 , the method comprising:a first step of etching at least a portion of an anodic aluminum oxide film sheet to form a first hole;a second step of forming a vertical portion by charging a conductive material in the first hole;a third step of forming a horizontal portion on a top surface of the anodic aluminum oxide film sheet so as to be connected to the vertical portion; anda fourth step of etching a portion of a bottom surface of the anodic aluminum oxide film sheet to allow the vertical portion to protrude over the anodic aluminum oxide film sheet, and removing a portion of the anodic aluminum oxide film sheet existing around the etched vertical portion to form a second hole.7. The method of claim 6 , further comprising: a fifth step of joining a space transformer including a connection pad to the horizontal portion.8. The method of claim 7 , wherein the ...

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Номер записи: 39
17-02-2022 дата публикации

TEST APPARATUS

Номер: US20220050136A1
Автор: Sato Shigeyuki, Utsumi Ryoichi, WATANABE Naoyoshi
Принадлежит:

A test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. In the test process, a magnetic field application apparatus applies a magnetic field Bto the wafer under test. A test probe card is used in the test process. Multiple magnetization detection units are formed on a diagnostic wafer. In a diagnostic process of the test apparatus, the diagnostic wafer is mounted on the stage instead of the wafer under test. Each magnetization detection unit is capable of measuring a magnetic field Bgenerated by the magnetic field application apparatus. In the diagnostic process, the diagnostic probe card is used instead of the test probe card. 1. A test apparatus structured to test a wafer under test on which devices under test each comprising magnetoresistive memory or a magnetic sensor are formed , the test apparatus comprising:a test head;a stage on which the wafer under test is to be mounted in a test process;a magnetic field application apparatus structured to apply a magnetic field to the wafer under test in the test process;a test probe card structured to make probe contact with the wafer under test in the test process;a diagnostic wafer structured to be mounted on the stage instead of the wafer under test in a diagnostic process of the test apparatus, wherein a plurality of magnetization detection units are formed on the diagnostic wafer, and the diagnostic wafer is structured to measure a magnetic field generated by the magnetic field application apparatus by means of each magnetization detection unit in the diagnostic process; anda diagnostic probe card structured to be used in the diagnostic process instead of the test probe card, and structured to make probe contact with the diagnostic wafer.2. The test apparatus according to claim 1 , further comprising a connection unit arranged between the test probe card or the ...

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Номер записи: 40
31-01-2019 дата публикации

MAGNET EXTENSION

Номер: US20190033344A1
Автор: Funk William A., Root Bryan J.
Принадлежит:

A magnet extension, magnetic test assembly, and probe card assembly are disclosed. The magnet extension includes a magnet having a first end and a second end, the first end of the magnet being geometrically configured to provide a selected magnetic field. A resilient member is disposed around the magnet between the first end and the second end. A retaining member is disposed between the first end and the second end. The retaining member surrounds at least a portion of the resilient member. 1. A magnet extension for a magnetic test assembly , comprising:an extension member having a first end and a second end, the first end of the extension member being geometrically configured to provide a selected magnetic field;a resilient member disposed around the extension member between the first end and the second end; anda retaining member disposed between the first end and the second end, wherein the retaining member surrounds at least a portion of the resilient member.2. The magnet extension according to claim 1 , wherein the resilient member is a spring.3. The magnet extension according to claim 1 , further comprising a spacer claim 1 , the spacer being one or more of thermally insulating and electrically insulating.4. The magnet extension according to claim 3 , wherein the spacer is color coded to identify a geometry of the extension member.5. The magnet extension according to claim 1 , wherein the retaining member is ball shaped and the retaining member is one or more of thermally insulating and electrically insulating.6. The magnet extension according to claim 1 , wherein the retaining member is made of polytetrafluoroethylene (PTFE).7. The magnet extension according to claim 1 , wherein the extension member is a magnet.8. The magnet extension member according to claim 1 , wherein the extension member is made of a ferromagnetic material.9. A magnetic test assembly claim 1 , comprising:a magnet; and an extension member having a first end and a second end, the first end ...

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Номер записи: 41
30-01-2020 дата публикации

DETECTION DEVICE AND CONTACT METHOD

Номер: US20200033404A1
Автор: FUJIHARA Jun, HYAKUDOMI Takanori, KONISHI Kentaro, Ueda Masanori
Принадлежит:

An inspection device includes a chuck top that holds a wafer, a probe card disposed to face the wafer held by the chuck top and having a plurality of contact probes on a surface facing the wafer, a pogo frame that holds the probe card, a bellows that surrounds the probe card and the contact probes and forms a sealed space when the wafer is close to or in contact with the contact probes, a gas exhaust path configured to depressurize the pressure in the sealed space, and a mechanical stopper that is provided between the pogo frame and the chuck top and restricts the vertical inclination of the chuck top when a predetermined contact is made between the wafer and the contact probes. 1. An inspection device for bringing multiple contact probes into contact with a substrate in a depressurized state to inspect electrical characteristics of devices formed on the substrate , the inspection device comprising:a substrate holding member configured to hold the substrate;a probe card disposed to face the substrate held by the substrate holding member and having the contact probes on a surface facing the substrate;a support member configured to support a surface of the probe card which is opposite to a surface facing the substrate;a bellows that surrounds the probe card and the contact probes and forms a sealed space together with the support member and the substrate holding member when the substrate is close to or in contact with the contact probes;a gas exhaust path configured to depressurize the sealed space to form a depressurized space; andan inclination restriction mechanism disposed between the support member and the substrate holding member and configured to restrict vertical inclination of the substrate holding member when a predetermined contact is made between the substrate and the contact probes.2. The inspection device of claim 1 , wherein the inclination restriction mechanism includes mechanical stoppers disposed around the bellows.3. The inspection device of claim 2 ...

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Номер записи: 42
08-02-2018 дата публикации

Test probing structure

Номер: US20180038894A1
Автор: Chao-Yang Yeh, Chin-Chou Liu, Ching-Fang Chen, Chung-Sheng Yuan, Hung-Chih Lin, Mill-Jer Wang, Sandeep Kumar Goel, Yun-Han Lee
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

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Номер записи: 43
24-02-2022 дата публикации

ANODIC ALUMINUM OXIDE MOLD, MOLD STRUCTURE INCLUDING SAME, METHOD OF MANUFACTURING MOLDED ARTICLE USING ANODIC ALUMINUM OXIDE MOLD, AND MOLDED ARTICLE MANUFACTURED THEREBY

Номер: US20220056606A1
Автор: Ahn Bum Mo, Byun Sung Hyun, Park Seung Ho
Принадлежит:

Proposed are an anodic aluminum oxide mold capable of manufacturing a molded article having at least a portion with a dimensional range of several tens of μm, and a mold structure including the same. Additionally, proposed are a method of manufacturing a molded article with a dimensional range of several tens of μm using the anodic aluminum oxide mold, and a molded article manufactured thereby. 1. An anodic aluminum oxide mold made of an anodic aluminum oxide film and provided with an opening.2. The anodic aluminum oxide mold of claim 1 , comprising an island provided in the opening and made of an anodic aluminum oxide film.3. The anodic aluminum oxide mold of claim 1 , wherein a metal filler is provided in the opening to become a probe pin.4. A mold structure comprising:an anodic aluminum oxide mold made of an anodic aluminum oxide film and provided with an opening; anda support member provided under the anodic aluminum oxide mold.5. The mold structure of claim 4 , further comprising:a metal layer provided between the anodic aluminum oxide mold and the support member.6. The mold structure of claim 5 , wherein the metal layer is exposed through the opening.7. The mold structure of claim 5 , wherein the metal layer serves as a plating seed layer for a metal filler formed in the opening.8. A method of manufacturing a molded article claim 5 , the method comprising:providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and provided with an opening;forming a metal filler in the opening; andremoving the anodic aluminum oxide mold.9. The method of claim 8 , wherein the forming of the metal filler in the opening comprises performing plating while a metal layer provided under the anodic aluminum oxide mold and exposed through the opening serves as a seed layer.10. The method of claim 8 , wherein the molded article is a probe pin. The present application claims priority to Korean Patent Application No. 10-2020-0103897, filed on Aug. 19, 2020, the entire ...

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Номер записи: 44
07-02-2019 дата публикации

TEST DEVICE

Номер: US20190041430A1
Автор: Park Ung-gi
Принадлежит:

A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested. 1. A test device for testing electric characteristics of an object to be tested , the test device comprising:a first support member comprising a plurality of guide holes;a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member;a plurality of main contact probes each comprising a main sliding contact portion to be slidably inserted in the guide hole, a main terminal contact portion to be inserted in the terminal hole, and a main elastic deformation portion connecting the main sliding contact portion and the main terminal contact portion and elastically deformed by compression of a lengthwise direction; anda plurality of sub contact probes each comprising a sub sliding contact portion to be adjacent to the main sliding contact portion and slidably inserted in the guide hole, a sub terminal contact portion to be adjacent to the main terminal contact portion and inserted in the terminal hole, and a sub elastic deformation portion connecting the sub sliding contact portion and the sub terminal contact portion, arranged to be adjacent to the main elastic deformation portion and elastically deformed by compression of a lengthwise direction.2. The test device according to claim 1 , wherein the main terminal contact portion and the sub terminal contact ...

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Номер записи: 45
18-02-2016 дата публикации

Probe card and test equipment with the same

Номер: US20160047843A1
Автор: Chia-Tai Chang, Hsiu-Wei Lin, HUNG-YI LIN
Принадлежит: MPI Corp

A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.

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Номер записи: 46
18-02-2016 дата публикации

PROBE CARD STRUCTURE, ASSEMBLING METHOD THEREOF AND REPLACING METHOD THEREOF

Номер: US20160047844A1
Автор: CHIU Sheng-Hsun, HSU WEN-YUAN, Wang Tzu-Chien
Принадлежит:

The present invention provides a probe card structure, an assembling method thereof and a replacing method thereof. The probe card structure comprises a circuit board and a probe head assembly. The circuit board includes a first side and a second side opposite the first side. The circuit board also has at least one first connecting part and a containing hole penetrating the first side and the second side of the circuit board. The probe assembly, which is partially disposed in the containing hole, further comprises a fixing part and a probe head. The fixing part includes at least one second connecting part corresponding to the at least one first connecting part. The fixing part is detachably connected with the circuit board through the connection of the second connecting part and the first connecting part. The probe head is integrally formed with or detachably connected with the fixing part. 1. A probe card structure , comprising:a circuit board having a first side and a second side opposite said first side and also having at least one first connecting part and a containing hole, wherein said containing hole penetrates said first side and said second side; and a fixing part having at least one second connecting part corresponding to said at least one first connecting part and detachably connected with said circuit board through connection of said at least one second connecting part and said at least one first connecting part; and', 'a probe head detachably connected or integrally formed with said fixing part., 'a probe head assembly partially received by said containing hole and including2. The probe card structure according to claim 1 , wherein said probe head assembly has a first maximum width claim 1 , and said containing hole has a second maximum width claim 1 , and wherein said first maximum width is greater than said second maximum width.3. The probe card structure according to claim 2 , wherein said first side of said circuit board has a special shape defining ...

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Номер записи: 47
15-02-2018 дата публикации

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROBE CARD

Номер: US20180045756A1
Автор: Saito Takashi
Принадлежит:

Reliability of an electrical test of a semiconductor wafer is improved. A method of manufacturing a semiconductor device includes a step of performing an electrical test of a semiconductor element by allowing contact portions (tips) of a force terminal (contact terminal) and a sense terminal (contact terminal) held by a probe card (first card) to come into contact with an electrode terminal of a semiconductor wafer. In the step of performing the electrical test, the contact portions of the force terminal and the sense terminal move in a direction away from each other after coming into contact with the first electrode terminal. 1. A method of manufacturing a semiconductor device , comprising:(a) fixing a semiconductor wafer onto a wafer holding stage, the semiconductor wafer including a chip region and an electrode terminal formed in the chip region, the electrode terminal being exposed from a first surface of the semiconductor wafer;(b) arranging a probe card including a first contact terminal and a second contact terminal so as to face the probe card and the semiconductor wafer with each other; and(c) performing an electrical test of the semiconductor wafer while the first contact terminal and the second contact terminal are in contact with the electrode terminal,wherein the first contact terminal includes a first base end portion and a first tip portion at an opposite end of the first base end portion;wherein the second contact terminal includes a second base end portion and a second tip portion at an opposite end of the second base end portion;wherein the first contact terminal is held at the first base end portion on the probe card such that a distance between a second surface of the probe card and the first contact terminal increases from the first base end portion to the first tip portion;wherein the second contact terminal is held at the second base end portion on the probe card such that a distance between the second surface and the second contact terminal ...

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Номер записи: 48
15-02-2018 дата публикации

ELECTRIC CONTACT DEVICE

Номер: US20180045774A1
Автор: SCHMID Rainer
Принадлежит: FEINMETALL GMBH

A contact device for an electric contact for electrically testing an electric test object, comprising a contact head and at least one printed circuit board. The contact head has a plurality of guide bores in which elongated contact elements that buckle elastically in a lateral direction upon contacting the test object are mounted in a longitudinally movable manner. One end of the contact element is used to contact the test object and the other end is in contact with first contact surfaces which are arranged in a specified pattern and which are located on a face of the printed circuit board in a first, central region of the printed circuit board face. Second contact surfaces are arranged in a further specified pattern, are electrically connected to the first contact surfaces through the printed circuit board, and lie on the other face of the printed circuit board in a second, central region of the printed circuit board face. Third contact surfaces lie on the other face of the printed circuit board in at least one first peripheral portion of the printed circuit board face. At least some of the second contact surfaces are electrically connected to at least some of the third contact surfaces by bonded bonding wires. At least some of the first contact surfaces and/or at least some of the second contact surfaces are each electrically connected to one another by severable conductors, and at least one of which is severed. 119-. (canceled)20. A contact device for an electric contact for electrically testing an electric test object , the contact device comprising:at least one printed circuit board;a contact head having a plurality of guide bores, in which elongated contact elements that buckle elastically in a lateral direction upon contacting the test object, are mounted in a longitudinally movable manner; one end of the contact element used to contact the test object and another end of the contact element in contact with first contact surfaces which are arranged in a ...

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Номер записи: 49
03-03-2022 дата публикации

Probe card testing device

Номер: US20220065897A1
Автор: John Hon-Shing Lau, Kuo Ching Tien, Ra-Min Tain, Tzyy-Jang Tseng
Принадлежит: Unimicron Technology Corp

A probe card testing device includes a first sub-circuit board, a second sub-circuit board, a connecting structure layer, a fixing plate, a probe head and a plurality of conductive probes. The first sub-circuit board is electrically connected to the second sub-circuit board by the connecting structure layer. The fixing plate is disposed on the second sub-circuit board and includes an opening and an accommodating groove. The opening penetrates the fixing plate and exposes a plurality of pads on the second sub-circuit board. The accommodating groove is located on a side of the fixing plate relatively far away from the second sub-circuit board and communicates with the opening. The probe head is disposed in the accommodating groove of the fixing plate. The conductive probes are set on the probe head and in the opening of the fixing plate. One end of the conductive probes is in contact with the corresponding pads, respectively.

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Номер записи: 50
26-02-2015 дата публикации

METHOD OF MEASURING AND ASSESSING A PROBE CARD WITH AN INSPECTION DEVICE

Номер: US20150054534A1
Автор: Olmstead Greg
Принадлежит:

A method of assessing functionality of a probe card includes providing a probe card analyzer without a probe card interface, removably coupling a probe card having probes to a support plate of the probe card analyzer, aligning a sensor head of the probe card analyzer with the probe card, and measuring a component of the probes with the sensor head. 1. A method of assessing functionality of a probe card , comprising:providing a probe card analyzer without a probe card interface;removably coupling a probe card having probes to a support plate of the probe card analyzer;aligning a sensor head of the probe card analyzer with the probe card; andmeasuring a characteristic of a component with the sensor head.2. The method of claim 1 , further comprising:mounting an adapter to the support plate, wherein the adapter is configured to accommodate the mounting of various probe card configurations; andremovably coupling the probe card to support plate with the adapter.3. The method of claim 1 , wherein the probe card is removably coupled directly to the support plate.4. The method of claim 1 , further comprising:rotating the support plate to position the probe card to an upward facing orientation.5. The method of claim 1 , wherein aligning the sensor head includes repositioning the sensor head in along an XY plane.6. The method of claim 1 , wherein the component of the probes is assessed at a first service interval.7. The method of claim 1 , wherein measuring a component includes contacting tips of the probes of the probe card against a check plate of the sensor head.8. The method of claim 1 , wherein a post of the sensor head is configured to measure a force exerted between the post and the probe.9. The method of claim 1 , wherein a post of the sensor head is movable along a z-axis.10. A method of assessing a probe card claim 1 , comprising:providing a probe card analyzer including a support plate and a sensor head;coupling an adapter to the support plate;coupling a probe card ...

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Номер записи: 51
26-02-2015 дата публикации

Large-Area Probe Card and Method of Manufacturing the Same

Номер: US20150054541A1
Автор: Jung Hee seok, LEE Kyu Han
Принадлежит:

A large-area probe card and method of manufacturing the same including an insulation plate including at least one contactor formed thereon, a main substrate disposed below the insulation plate, and a flexible signal connector vertically passing through the insulation plate and disposed between the at least one contactor and the main substrate to electrically connect the at least one contactor with the main substrate. 1. A large-area probe card comprising:an insulation plate including at least one contactor;a main substrate disposed below the insulation plate; anda flexible signal connector vertically passing through the insulation plate and disposed between the at least one contactor and the main substrate to electrically connect the at least one contactor with the main substrate,wherein the signal connector comprises:a slit vertically formed in the insulation plate; anda flexible circuit board fitted in the slit, one end of which is electrically connected to the at least one contactor and the other end of which is electrically connected to the main substrate.2. The large-area probe card according to claim 1 , wherein the insulation plate comprises a ceramic substrate.3. The large-area probe card according to claim 1 , wherein the flexible circuit board serves as a space transformer compensating for the difference between a pitch of the at least one contactor and a pitch of pads of the main substrate.4. The large-area probe card according to claim 1 , wherein the insulation plate includes a contactor mounting region and an edge region surrounding the contactor mounting region and constituting a periphery of the insulation plate claim 1 , andwherein the slit is formed on the contactor mounting region.5. The large-area probe card according to claim 1 , wherein the slit is arranged along the circumference and a length of the at least one contactor and has a predetermined length along the length of the at least one contactor.6. The large-area probe card according to ...

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Номер записи: 52
25-02-2021 дата публикации

PLATINUM-NICKEL-BASED ALLOYS, PRODUCTS, AND METHODS OF MAKING AND USING SAME

Номер: US20210054480A1
Автор: Bowen Patrick, Smith Edward
Принадлежит:

Platinum-nickel-based ternary or higher alloys include platinum at about 65-80 wt. %, nickel at about 18-27 wt. %, and about 2-8 wt. % of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/or Ta. These alloys are age-hardenable, provide hardness greater than 580 Knoop, ultimate tensile strength in excess of 320 ksi, and elongation to failure of at least 1.5%. The alloys may be used in static and moveable electrical contact and probe applications. The alloys may also be used in medical devices. 1. A platinum and nickel-based ternary or higher alloy , comprising:a) platinum at about 65 to about 80 wt. % of the alloy;b) nickel at about 18 to about 27 wt. % of the alloy; and 'wherein the alloy is free of Co.', 'c) one or more ternary or higher additions totaling about 2 to about 8 wt. % of the alloy, wherein the one or more ternary or higher additions comprise one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, Ta, or any combination thereof;'}2. The alloy of claim 1 , wherein the platinum forms about 68 to about 80 wt % of the alloy.3. The alloy of claim 1 , wherein the one or more ternary or higher additions comprise one or more of Ir claim 1 , Pd claim 1 , Rh claim 1 , Ru claim 1 , Nb claim 1 , Mo claim 1 , Re claim 1 , Ta claim 1 , or any combination thereof.4. The alloy of claim 3 , wherein the platinum forms about 68 to about 80 wt % of the alloy.5. The alloy of claim 1 , wherein the alloy is substantially free of Ti claim 1 , V claim 1 , Cr claim 1 , Mn claim 1 , Fe claim 1 , Co claim 1 , Cu claim 1 , and Zn.6. The alloy of claim 1 , wherein the alloy is age hardened.7. The alloy of claim 1 , wherein the alloy is annealed to a straightness of better than about 0.030 in curvature per linear inch of length of wire and maintains an ultimate tensile strength of about 240 ksi or greater.8. A guidewire comprising at least one of a core or a tip utilizing the alloy of .9. A platinum and nickel-based ternary or higher alloy claim 1 , ...

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Номер записи: 53
03-03-2022 дата публикации

TEST HEAD CONNECTION METHOD

Номер: US20220068726A1
Автор: LIN Ching-Li, YANG Kao-Shan
Принадлежит:

Herein disclosed is a test head connection method, the method comprises the following steps. First, a load board and a card holder are provided between a test head and a probing machine, the card holder is disposed in the probing machine, and the card holder is used to accommodate the load board. A vacuum function of the test head is activated, and the test head is moved to align the card holder. The test head is moved to touch the load board in the card holder. At least one clamping piece is used to fix the test head and the card holder. Wherein the load board and a wafer are connected by direct probing. 1. A test head connection method for connecting a test head and a probing machine , comprising:disposing a load board and a test fixture between the test head and the probing machine;activating a vacuum function of the test head;moving the test head to align the test fixture;moving the test head until touching the load board in the test fixture; andfixing the test head and the test fixture by at least one engaging member;wherein the test fixture is disposed in the probing machine, and the test fixture is used to accommodate the load board;wherein the load board is configured to connect a wafer by direct probing.2. The test head connection method according to claim 1 , wherein the test fixture defines a first upper surface claim 1 , the first upper surface defines a first accommodating space claim 1 , and the first accommodating space is used for accommodating the load board.3. The test head connection method according to claim 2 , wherein when the load board is accommodated in the first accommodating space claim 2 , the load board and the first upper surface form a coplanar surface.4. The test head connection method according to claim 2 , further comprising:providing a fixing plate detachably locked to the probing machine;wherein a second upper surface of the fixing plate defines a second accommodating space, and the second accommodating space is used for ...

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Номер записи: 54
25-02-2016 дата публикации

PROBE ALIGNMENT

Номер: US20160054356A1
Автор: Carvalho Valquirio N.
Принадлежит:

A probe for automatic test equipment (ATE) includes: an outer shroud including a course alignment feature configured to receive a target device and to guide the target device into an interior of the outer shroud, where the target device includes exposed electrical leads; and an inner structure that is at least partly inside the outer shroud. The inner structure includes electrical contacts for making an electrical connection to the exposed electrical leads, and also includes a fine alignment feature configured to guide the target device towards the electrical contacts to make the electrical connection. 1. A probe for automatic test equipment (ATE) comprising:an outer shroud comprising a course alignment feature configured to receive a target device and to guide the target device into an interior of the outer shroud, the target device comprising exposed electrical leads; andan inner structure that is at least partly inside the outer shroud, the inner structure comprising electrical contacts for making an electrical connection to the exposed electrical leads, the inner structure comprising a fine alignment feature configured to guide the target device towards the electrical contacts to make the electrical connection.2. The probe of claim 1 , further comprising:a probe card comprising a circuit board, the outer shroud and the inner structure being arranged relative to the probe card, the inner structure comprising one or more springs between the inner structure and the outer shroud to enable the outer shroud to move relative to the inner structure.3. The probe of claim 2 , wherein the inner structure comprises one or more springs between the outer shroud and the probe card to enable the outer shroud to move relative to the probe card.4. The probe of claim 2 , further comprising posts on which the outer shroud is mounted to enable to outer shroud to move relative to the probe card.5. The probe of claim 1 , wherein the electrical contacts comprise pins for making the ...

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Номер записи: 55
25-02-2016 дата публикации

PROBE DEVICE

Номер: US20160054357A1
Автор: KATO Yoshiyasu, NAGASAKA Munetoshi, SHINOHARA Eiichi
Принадлежит:

A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a connection conductor arranged at a side of the mounting table and electrically connected to a mounting table electrode formed on a mounting surface of the mounting table, and a cleaning mechanism including a polishing unit for polishing a contact portion of the connection conductor, a brush cleaning unit for performing a brush-cleaning of the contact portion, and a contact resistance measuring unit for measuring a contact resistance of the contact portion. The mounting table electrode is in contact with a backside electrode of a semiconductor device of the semiconductor wafer. When the connection conductor is connected to the electrode plate, a backside electrode formed on a backside of the semiconductor device and the tester are electrically connected to each other. 1. A probe device which is electrically connected to a semiconductor device formed on a semiconductor wafer and performs an electrical test of the semiconductor device by a tester , the probe device comprising:a mounting table configured to mount thereon the semiconductor wafer;a mounting table electrode formed on a mounting surface of the mounting table on which the semiconductor wafer is mounted, the mounting table electrode being in contact with a backside electrode formed on a backside of the semiconductor device;a probe card arranged above the mounting table, the prove card having a plurality of probes electrically connected to the tester;a driving mechanism configured to drive the mounting table to make the probes contact with electrodes of the semiconductor device of the semiconductor wafer mounted on the mounting table;an electrode plate arranged above the mounting table and electrically connected to the tester;a connection conductor arranged at a side of the mounting table and electrically connected to the mounting table electrode, the ...

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Номер записи: 56
25-02-2021 дата публикации

Probe cards, system for manufacturing semiconductor device, and method of manufacturing semiconductor device

Номер: US20210055328A1
Автор: Gyeongwon PARK, Gyuyeol KIM, Ikbum LIM, Sungho JOO
Принадлежит: SAMSUNG ELECTRONICS CO LTD

A probe card, a system for manufacturing a semiconductor device, and a method of manufacturing a semiconductor device are provided. A probe card includes a first probe configured to contact a first ground pad of a device under test, a reference resistor including a first terminal and a second terminal and connected to the first probe, and a second probe configured to contact a second ground pad of the device under test, wherein the second probe is further configured to be connected to a ground node for applying a reference potential, and the first terminal of the reference resistor is configured to be connected to the first probe and the second terminal of the reference resistor is configured to receive an input potential.

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Номер записи: 57
13-02-2020 дата публикации

PROBE APPARATUS, PROBE INSPECTION METHOD, AND STORAGE MEDIUM

Номер: US20200049762A1
Автор: Ishii Atsushi, Koizumi Shinya, MIYAZONO Mitsuyoshi, OTA Tomohiro, TASAKI Takashi
Принадлежит:

In a probe apparatus for performing an electrical measurement by bringing a probe into contact with an inspection target substrate, a transfer table is provided with a needle mark transfer member to which a needle mark of the probe is transferred by a contact with the probe. The needle mark transfer member includes a polyimide resin. A movement mechanism is able to move the needle mark transfer member provided on the transfer table to a contact position where the needle mark transfer member is brought into contact with the probe. 1. A probe apparatus for performing an electrical measurement by bringing a probe provided on a probe card into contact with a substrate placed on a placement table , the probe apparatus comprising:a transfer table provided with a needle mark transfer member to which a needle mark of the probe is transferred and configured to bring the probe into contact with the needle mark transfer member, instead of bringing the probe into contact with the substrate; anda mover configured to move an arrangement position of at least one of the transfer table and the probe card between a contact position where the needle mark transfer member is brought into contact with the probe and a separation position where the needle mark transfer member is separated from the contact position,wherein the needle mark transfer member includes a polyimide resin.2. The probe apparatus according to claim 1 , wherein the polyimide resin included in the needle mark transfer member has a thermo-plasticity claim 1 , and the transfer table includes a heater configured to heat the needle mark transfer member to a temperature at which the polyimide resin is deformable accompanied by the contact with the probe.3. The probe apparatus according to claim 2 , wherein the heater heats the needle mark transfer member such that with respect to a peak temperature Tat which a loss tangent (tan δ) of the polyimide resin peaks claim 2 , a temperature t of the needle mark transfer member ...

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Номер записи: 58
22-02-2018 дата публикации

TESTING HEAD COMPRISING VERTICAL PROBES FOR REDUCED PITCH APPLICATIONS

Номер: US20180052190A1
Автор: Perego Daniele, Todaro Simone
Принадлежит:

A testing head for testing the working of a device under test comprises a plurality of contact probes, each contact probe having a rod-like body of a predetermined length that extends between a first end and a second end and being housed in respective guide holes made in at least one plate-like lower guide and one plate-like upper guide that are parallel to each other and spaced apart by a bending zone. Suitably, at least one of the lower guide and upper guide is equipped with at least one recessed portion formed at a plurality of those guide holes and realizing lowered portions thereof adapted to reduce a thickness of the plurality of those guide holes. 1. A testing head comprising:a plurality of contact probes, each contact probe having a rod-like body, a first end and a second end, the rod-like body having a predetermined length and extending between the first and second ends; andat least one lower guide and at least one upper guide with guide holes for housing the plurality of contact probes, wherein:the lower and upper guides are parallel to each other and spaced apart by a bending zone; andat least one of the lower guide and upper guide comprises a recessed portion formed at a plurality of the guide holes and realizing corresponding lowered portions of reduced thickness at the plurality of guide holes.2. The testing head according to claim 1 , wherein the recessed portion and lowered portions have a thickness equal to 20-80% of a thickness of the at least one of the lower guide and upper guide wherein the lowered portions are made.3. The testing head according to claim 2 , wherein the thickness of the recessed portion and lowered portions has a value between 80 μm and 150 μm at the plurality of the guide holes claim 2 , in which the contact probes slide.4. The testing head according to claim 1 , wherein the lower and upper guides both comprise guide holes provided with respective lowered portions made at respective recessed portions.5. The testing head ...

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Номер записи: 59
13-02-2020 дата публикации

Wiring board design support apparatus, method for wiring board via arrangement and storage medium recording program for wiring board via arrangement

Номер: US20200050732A1
Автор: Akitsugu Yamaguchi, Katsushi MIKUNI, Ryuichi Yagisawa
Принадлежит: Micronics Japan Co Ltd

To improve wiring housing property, with preferable work efficiency, without deviation in the vertical direction or the horizontal direction, without expanding via arrangement areas. A wiring board design support apparatus of the present disclosure is a wiring board design support apparatus arranging a plurality of vias on a wiring board, and includes a design information storage unit that stores design information of vias and wirings to be arranged on the wiring board, and a wiring board via arrangement unit that moves, on a basis of the design information, positions of lattice points arranged with same intervals in vertical and horizontal directions by a given moving amount in a vertical direction and a horizontal direction while alternately changing a moving direction in the horizontal direction of the lattice points for each row of the lattice and alternately changing a moving direction in the vertical direction of the lattice points for each column of the lattice, so as to arrange vias at positions of the lattice points after movement.

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Номер записи: 60
05-03-2015 дата публикации

WAFER-LEVEL TESTING METHOD FOR SINGULATED 3D-STACKED CHIP CUBES

Номер: US20150061718A1
Автор: CHAN Kun-Chih, CHEN Shin-Kung, Lin Sheng-Chi
Принадлежит: POWERTECH TECHNOLOGY INC.

Disclosed is a wafer level testing method for testing a plurality of singulated 3D-stacked chip cubes by utilizing adjustable wafer maps to adjust the pick-and-place positions of the cubes on a carrier wafer. The wafer maps have a plurality of probe-card activated regions each including a plurality of component-attaching regions. Two wafer-level testing steps are performed on the cubes disposed on the carrier wafer according to the wafer maps. By analyzing the electrical testing results of the trial-run wafer-level testing step from the original wafer map, some prone-to-overkill component-attaching regions are confirmed and to create a corrected wafer map which the prone-to-overkill component-attaching regions are excluded from probe-card activated regions. Then, according to the corrected wafer map, cubes are disposed on the carrier wafer without disposing in the prone-to-overkill component-attaching regions. Accordingly, the real-production wafer-level testing step can be run smoothly without unnecessary shut down of adjustment or repair leading to the maximum productivity without overkill issues. 1. A wafer-level testing method for testing a plurality of singulated 3D-stacked chip cubes comprising the steps of:providing a carrier wafer with the same dimension as a semiconductor wafer for loading in a wafer tester;attaching a plurality of first 3D-stacked chip cubes onto the carrier wafer according to a first wafer map, wherein the first wafer map defines a plurality of first probe card activated regions, each being corresponding to a probe card in the wafer tester and including a plurality of first component-attaching regions to constitute a M-by-N matrix, wherein each first component-attaching region is one-to-one corresponding to one of the first 3D-stacked chip cubes on the carrier wafer and is one-to-one corresponding to one of a plurality of component probing units of the probe card;proceeding a first wafer-level testing in the wafer tester, including ...

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Номер записи: 61
10-03-2022 дата публикации

PROBE STATION

Номер: US20220074972A1
Автор: FANG Jhih-Wei, Giessmann Sebastian, HSU Yu-Hsun
Принадлежит:

A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length. 1. A probe station , comprising:a base;at least one adaptor having a first connecting portion and a second connecting portion away from the first connecting portion towards a first direction by a first length, the first connecting portion connecting to the base;at least one probe holder connecting to the second connecting portion and at least partially extending towards a second direction opposite to the first direction by a second length; andat least one probe connecting to an end of the probe holder away from the second connecting portion and at least partially extending towards the second direction by a third length,wherein a product of a first thermal coefficient of the adaptor and the first length is equal to a first sum of a product of a second thermal coefficient of the probe holder and the second length and a product of a third thermal coefficient of the probe and the third length, andwherein a first variation of the first length of the adaptor towards the first direction is equal to a second sum of a second variation of the second length of the probe holder towards the second direction and a third variation of the third length of the probe towards the second direction, such that a probe tip of the probe maintains at ...

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Номер записи: 62
01-03-2018 дата публикации

SOLDER BUMP ARRAY PROBE TIP STRUCTURE FOR LASER CLEANING

Номер: US20180059141A1
Автор: Audette David M., Bronson, Comeau Joseph K. V., Fregeau Dustin M., Gardell David L., III Frederick H., III James R., JR. Dennis M., ROY, Salimeno, Sullivan Timothy D.
Принадлежит:

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package. 1. A probe tip structure for a test application of solder on a ball grid array package , the probe tip structure comprising:an array of probe tips, each probe tip having an inner core;an interfacial layer, wherein the interfacial layer includes Ta, bonded to the inner core; andan outer layer, wherein the outer layer includes TaN, bonded to the interfacial layer, wherein the outer layer has a melting point higher than a melting point of the inner core.2. The probe tip structure of claim 1 , wherein the inner core of each of the probe tips comprises a layer of high conductivity metal.3. The probe tip structure of claim 2 , wherein the high conductivity metal includes Cu.4. The probe structure of claim 1 , wherein the melting point of the outer layer is six to ten times higher than the melting point of the inner core.5. The probe tip structure of claim 1 , wherein the interfacial layer includes Ni.6. The probe tip structure of claim 1 , wherein the interfacial layer comprises a first interfacial layer and a second interfacial layer.7. The probe tip structure of claim 1 , wherein the probe tips have tapered side walls.8. A solder bump array probe comprising:a substrate;an array of probe tips directly on a substrate, the probe tips having an inner core;an interfacial layer bonded to the inner core, wherein the interfacial layer includes Ta; andan outer layer bonded to the interfacial layer, wherein the outer layer includes TaN and is resistant to adherence of a solder;wherein the inner core comprises a ...

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Номер записи: 63
20-02-2020 дата публикации

PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES

Номер: US20200057095A1
Автор: Liberini Riccardo
Принадлежит:

A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support. 1. A probe card comprising:a plurality of contact probes;a probe head housing the plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto a contact pad of a device under test;a main support;a space transformer connected to the main support and adapted to realize a spatial transformation of distances between contact pads on opposite sides of the space transformer;a first connecting element that links the space transformer and the main support, and the connecting element has a substantially rod-like body, a first end portion, and a second end portion,', 'the space transformer has a first housing', 'the first end portion includes a terminal section engaged in the first housing of the space transformer, and', 'the second end portion abuts onto the abutment element linked to the main support., 'an abutment element linked to the main support, wherein2. The probe card of claim 1 , wherein the abutment element rests on the main support.3. The probe card of claim 1 , wherein the abutment element is glued to the main support.4. The probe card ...

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Номер записи: 64
04-03-2021 дата публикации

ELECTRICAL CONNECTING DEVICE, INSPECTION APPARATUS, AND METHOD FOR ELECTRICAL CONNECTION BETWEEN CONTACT TARGET AND CONTACT MEMBER

Номер: US20210063465A1
Автор: Mochizuki Jun
Принадлежит:

An electrical connecting device having one or more contact members to be in contact with a contact target is provided. The electrical connecting device includes a main body having one or more recesses on a surface thereof opposed to the contact target, and a flexible portion that covers the recesses to form sealed spaces. The main body includes a gas exhaust passage and an air supply passage provided for each of the sealed spaces to adjust a pressure in each of the sealed spaces, and the contact members are respectively disposed to be opposed to the recesses with the flexible portion interposed therebetween. 1. An electrical connecting device having one or more contact members to be in contact with a contact target , the electrical connecting device comprising:a main body having one or more recesses on a surface thereof opposed to the contact target; anda flexible portion that covers the recesses to form sealed spaces,wherein the main body includes a gas exhaust passage and an air supply passage provided for each of the sealed spaces to adjust a pressure in each of the sealed spaces, andwherein the contact members are respectively disposed to be opposed to the recesses with the flexible portion interposed therebetween.2. The electrical connecting device of claim 1 , wherein contact and non-contact between the contact members and the contact target are switched depending on deformation of the flexible portion due to the adjustment of the pressure in each of the sealed spaces.3. An inspection apparatus for inspecting an inspection target substrate claim 1 , comprising:a substrate support on which the inspection target substrate is supported, and{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the electrical connecting device described in .'}4. An inspection apparatus for inspecting an inspection target substrate claim 1 , comprising:a substrate support on which the inspection target substrate is supported, and{'claim-ref': {'@idref': 'CLM-00002', 'claim 2'}, 'the ...

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Номер записи: 65
12-03-2015 дата публикации

TEST INTERFACE BOARD AND TEST SYSTEM INCLUDING THE SAME

Номер: US20150070041A1
Автор: Song Ki-Jae, Yoo Jong-Woon
Принадлежит:

A test interface board includes a substrate including a power plane electrically connected to at least one power terminal of a semiconductor device under test, and a ground plane electrically connected to at least one ground terminal of the semiconductor device under test, and a voltage regulator arranged on the substrate and configured to supply, via the power plane and the ground plane, to the semiconductor device under test, a driving voltage. 1. A test interface board , comprising:a substrate including a power plane electrically connected to at least one power terminal of a semiconductor device under test, and a ground plane electrically connected to at least one ground terminal of the semiconductor device under test; anda voltage regulator arranged on the substrate and configured to supply, via the power plane and the ground plane, to the semiconductor device under test, a driving voltage.2. The test interface board of claim 1 , wherein the voltage regulator is electrically connected to a power supply claim 1 , and the voltage regulator comprises:an input terminal to which a power voltage of the power supply is applied;a ground terminal electrically connected to a ground of the power supply and to the ground plane; andan output terminal electrically connected to the power plane.3. The test interface board of claim 2 , wherein:the voltage regulator further comprises a reference voltage input terminal to which a reference voltage is applied, andthe output terminal of the voltage regulator is configured to supply, via the power plane, to the semiconductor device under test, the driving voltage based at least on the reference voltage.4. The test interface board of claim 3 , wherein the voltage regulator further comprises:a comparison unit configured to compare the reference voltage and the driving voltage, and to output a control signal; andan output unit configured to supply the driving voltage and an associated current to the power plane based at least on the ...

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Номер записи: 66
28-02-2019 дата публикации

MEMS PROBE AND TEST DEVICE USING THE SAME

Номер: US20190064215A1
Автор: Park Ung-gi
Принадлежит:

A microelectromechanical system (MEMS) probe for electric connection between a tested contact point of an object to be tested and a testing contact point of a test circuit. The MEMS probe includes: a first terminal contact portion; a second terminal contact portion movable close to and away from the first terminal contact portion; and an elastic connecting portion connecting the first terminal contact portion and the second terminal contact portion, elastically deformed by an approach of the second terminal contact portion and comprising a plurality of plating layers stacked in the elastic deformation direction. According to the present disclosure, the MEMS probe includes a plurality of plating layers stacked in the elastic deformation direction, thereby decreasing fatigue failure and improving durability. 1. A microelectromechanical system (MEMS) probe for testing electric characteristics of an object to be tested , the MEMS probe comprising:a first terminal contact portion;a second terminal contact portion being opposite to the first terminal contact portion; andan elastic connecting portion elastically deformed between the first terminal contact portion and the second terminal contact portion and comprising a plurality of plating layers stacked in the deformation direction.2. The MEMS probe according to claim 1 , wherein the elastic connecting portion is previously curved in a predetermined direction.3. The MEMS probe according to claim 2 , wherein the plurality of plating layers is stacked along the predetermined direction.4. The MEMS probe according to claim 1 , wherein the plurality of plating layers comprises an elastic plating layer claim 1 , and a conductive plating layer having a lower elastic coefficient and higher electric conductivity than the elastic plating layer.5. The MEMS probe according to claim 1 , wherein the plurality of plating layers comprises an insulation coating layer at an outmost side.6. A method of fabricating a microelectromechanical ...

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Номер записи: 67
28-02-2019 дата публикации

PROBING DEVICE

Номер: US20190064218A1
Автор: TSUJI Yukihiro
Принадлежит: Sumitomo Electric Industries, Ltd.

A probing device includes: a first probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion; a second probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion; a supporting member including an insulating base having a principal face and a back face, and the first probing needle and the second probing needle being supported by the insulating base on the back face; and a holder holding the first portions of the first and second probing needles, and the holder being apart from the probing tip of the first probing needle and the probing tip of the second probing needle. 1. A probing device comprising:a first probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion;a second probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion;a supporting member including an insulating base, the insulating base having a principal face and a back face, the principal face being opposite to the back face, and the first probing needle and the second probing needle being supported by the insulating base on the back face; anda holder holding the first portion of the first probing needle and the first portion of the second probing needle, the holder electrically isolating the first probing needle from the second probing needle, and the holder being apart from the probing tip of the first probing needle and the probing tip of the second probing needle.2. The probing device according to claim 1 , wherein the holder has a first opening and a second opening ...

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Номер записи: 68
28-02-2019 дата публикации

Probe card, test apparatus including the probe card, and related methods of manufacturing

Номер: US20190064219A1
Автор: Chang-Keun Kim, Dong-uk Kwon, Duke Kimm, In-Kyu Park, Jae-Hong Kim, Ji-Nyeong Yun, Jun-Bo Yoon, Min-woo Rhee, Seung-Hwan Kim, Yong-Hoon Yoon
Принадлежит: Korea Advanced Institute of Science and Technology KAIST, SAMSUNG ELECTRONICS CO LTD

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

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Номер записи: 69
28-02-2019 дата публикации

SEMICONDUCTOR TEST EQUIPMENT

Номер: US20190064251A1
Автор: YOSHIDA Mitsuru
Принадлежит:

A semiconductor test equipment can conduct a burn-in test, and has a testing table capable of aligning a plurality of contact units formed of a probe card having a plurality of contact probes each corresponding to each of a plurality of semiconductor chips formed on a semiconductor wafer to contact with the semiconductor wafer, and a holding tool for holding the semiconductor wafer and the probe card in a contacted state; a voltage application circuit having connection wiring lines provided in a manner capable of parallel connection of the plurality of contact units aligned on the testing table, and a plurality of connection units to apply a testing voltage to the semiconductor wafer held on each of the plurality of contact units; and a characteristic measuring circuit for measuring characteristics of the plurality of semiconductor chips formed on the semiconductor wafer according to application of the testing voltage. 1. A semiconductor test equipment , comprising:a testing table capable of aligning a plurality of contact units each formed of a probe card having a plurality of contact probes each corresponding to each of a plurality of semiconductor chips formed on a semiconductor wafer to contact with the semiconductor wafer, and a holding tool for holding the semiconductor wafer and the probe card in a contacted state;a voltage application circuit having a connection wiring line and a plurality of connection units provided in a manner capable of parallel connection of the plurality of contact units aligned on the testing table so as to apply a testing voltage to the semiconductor wafer held to each of the plurality of contact units; anda characteristic measuring circuit for measuring characteristics of the plurality of semiconductor chips formed on the semiconductor wafer according to application of the testing voltage.2. The semiconductor test equipment according to claim 1 , wherein each of the plurality of connection units is connected to the contact unit ...

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Номер записи: 70
29-05-2014 дата публикации

PROBE CARD AND INSPECTION DEVICE

Номер: US20140145741A1
Автор: FUJITA Hirose, KIKUCHI YOSHINORI, NAKATA Yoshiro
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

A probe card comes in touch with a test object to perform an inspection. The probe card contains: a probe substrate provided with a plurality of probes on the first surface and a plurality of anchor receiving portions on the second surface; and a supporting body disposed to support the periphery of the probe substrate, with at least a plurality of anchor receiving portions located within a probe existence region being arranged regularly and at an equal distance from each other on the second surface of the probe substrate. 1. A probe card to perform an inspection by coming in contact with a test object , comprising:a probe substrate having a plurality of probes on a first surface thereof, and a plurality of anchor receiving portions on a second surface thereof; anda supporting body disposed to support a periphery of the probe substrate,wherein, on the second surface of the probe substrate, at least some of the plurality of anchor receiving portions are arranged within a probe existence region and are disposed regularly and at equal distances from each other.2. The probe card according to claim 1 , wherein at least two unit shapes exist claim 1 , with the unit shapes being formed by the plurality of the anchor receiving portions claim 1 , which are disposed regularly and at equal distances in a radial direction from a center of the probe substrate and which are neighboring with each other.3. The probe card according to claim 2 , wherein the unit shapes formed by the three neighboring anchor receiving portions have an equilateral triangle shape.4. The probe card according to claim 2 , wherein the unit shapes formed by the four neighboring anchor receiving portions have a square shape.5. The probe card according to claim 1 , wherein one of the plurality of anchor receiving portions is disposed in the center of the probe substrate.6. The probe card according to claim 2 , wherein one of the plurality of anchor receiving portions is disposed in the center of the probe ...

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Номер записи: 71
27-02-2020 дата публикации

WAFER PROBE CARD INTEGRATED WITH A LIGHT SOURCE FACING A DEVICE UNDER TEST SIDE AND METHOD OF MANUFACTURING

Номер: US20200064397A1
Автор: LAM Jeffery Chor-Keung, SEAH Meng Yew, Tan Shyue Seng, Wang Lanxiang
Принадлежит:

An integrated wafer probe card with a light source facing a device under test (DUT) side and enabling methodology are provided. 1. A wafer probe card integrated with a light source facing a device under test (DUT) side.2. The wafer probe card according to claim 1 , wherein the light source has a light control circuitry integrated in a printed circuit board of the wafer probe card claim 1 , and wherein the light control circuitry controls the light source and intensity.3. The wafer probe card according to claim 1 , wherein the light source is positioned approximately at a center of the wafer probe card.4. The wafer probe card according to claim 1 , wherein the light source is positioned above the DUT at a distance range of 1 millimeter (mm) to 5 mm.5. The wafer probe card according to claim 1 , wherein the light source generates a light of a wavelength range from 400 nanometer (nm) to 700 nm.6. The wafer probe card according to claim 5 , wherein the light has an intensity range of 5 claim 5 ,000 millicandelas (mcd) to 50 claim 5 ,000 mcd.7. A wafer tester comprising a light source integrated onto a probe card and facing a device under test (DUT) side claim 5 , wherein the light source and intensity can be controlled.8. The wafer tester according to claim 7 , wherein the light source has a light control circuitry integrated in a printed circuit board of the probe card.9. The wafer tester according to claim 7 , wherein the light source is positioned approximately at a center of the probe card.10. The wafer tester according to claim 7 , wherein the light source is positioned above the DUT at a distance range of 1 millimeter (mm) to 5 mm.11. The wafer tester according to claim 7 , wherein the light source generates a light of a wavelength range from 400 nanometer (nm) to 700 nm.12. The wafer tester according to claim 11 , wherein the light has an intensity range of 5 claim 11 ,000 millicandelas (mcd) to 50 claim 11 ,000 mcd.13. A method comprising:mounting and ...

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Номер записи: 72
09-03-2017 дата публикации

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

Номер: US20170067937A1
Автор: Shawn Powell
Принадлежит: Formfactor Inc

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

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Номер записи: 73
19-03-2015 дата публикации

SUBSTRATE INSPECTION APPARATUS

Номер: US20150077152A1
Автор: Morita Shingo, Murata Michio, Narikawa Kenichi
Принадлежит:

A substrate inspection apparatus can efficiently inspect electric characteristics of the semiconductor device. A prober includes a probe card having a multiple number of probe needles to be brought into contact with electrodes of a semiconductor device formed on a wafer W; and a test box electrically connected to the probe card . A card-side inspection circuit of the probe card reproduces a circuit configuration on which the semiconductor device is to be mounted after separated from the wafer W, e.g., the circuit configuration of a function extension card, and a box-side inspection circuit of the test box reproduces a circuit configuration on which the semiconductor device is to be mounted, e.g., a part of the circuit configuration of the mother board. 1. A substrate inspection apparatus , comprising:a probe card including a plurality of probes to be brought into contact with electrodes of a semiconductor device formed on a substrate; anda test box electrically connected to the probe card,wherein the probe card and the test box are configured to reproduce a circuit configuration on which the semiconductor device is to be mounted after separated from the substrate.2. The substrate inspection apparatus of claim 1 ,wherein the probe card is configured to reproduce a circuit configuration of a function extension card on which the semiconductor device is to be mounted, and the test box is configured to reproduce a circuit configuration of a mother board to which the function extension card is connected.3. The substrate inspection apparatus of claim 2 ,wherein the semiconductor device is a MPU (Main Processing Unit), an APU (Accelerated Processing Unit), a GPU (Graphics Processing unit), or a RF tuner, andthe function extension card is a card on which one of the MPU, the APU, the GPU and the RF tuner is to be mounted.4. The substrate inspection apparatus of claim 1 , further comprising:a loader configured to load the substrate,wherein the loader includes a basic unit ...

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Номер записи: 74
17-03-2016 дата публикации

PROBES FOR TESTING INTEGRATED ELECTRONIC CIRCUITS AND CORRESPONDING PRODUCTION METHOD

Номер: US20160077130A1
Автор: PAGANI Alberto
Принадлежит: STMICROELECTRONICS S.R.L.

Cantilever probes are produced for use in a test apparatus of integrated electronic circuits. The probes are configured to contact corresponding terminals of the electronic circuits to be tested during a test operation. The probe bodies are formed of electrically conductive materials. On a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region is formed having a first hardness value equal to or greater than 300 HV; each contact region and the respective probe body form the corresponding probe. 1. A method for producing probes for use in test apparatus of integrated electronic circuits , the probes being configured to contact during the test corresponding terminals of the electronic circuits to be tested , the method comprising:forming probe bodies of electrically conductive materials; andforming on a lower portion of each probe body that, in use, is directed to the respective terminal to be contacted, an electrically conductive contact region having a first hardness value equal to or greater than 300 HV, each contact region and the respective probe body forming the corresponding probe.2. The method according to claim 1 , wherein the step of forming the electrically conductive contact region further comprises:covering at least part of the probe body with a protection;forming the electrically conductive contact region on an active end of said lower portion not covered by the protection, andremoving the protection from the probe body.3. The method according to claim 2 , wherein the step of forming the electrically conductive contact region further comprises:planarizing through a lapping operation at least part of the lower portion of the probe body in order to obtain such active end of the probe body, andforming the electrically conductive contact region directly on said active end of the probe body.4. The method according to claim 3 , wherein said electrically conductive contact ...

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Номер записи: 75
07-03-2019 дата публикации

PROBE ASSEMBLY AND PROBE STRUCTURE THEREOF

Номер: US20190072586A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

The instant disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a metal main portion, a covering layer and an insulating layer. The metal main portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first and the second end portions and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion. The covering layer includes a first covering layer disposed on a surrounding surface located on the first end portion, a second covering layer disposed on a surrounding surface located on the second end portion and a third covering layer disposed on a surrounding surface located on the connecting portion. The insulating layer is disposed on the third covering layer for exposing the first and second covering layer. 1. A probe assembly , including:a metal main portion having a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first end portion and the second end portion, and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion;a covering layer including a first covering layer disposed on the surrounding surface located on the first end portion, a second covering layer disposed on the surrounding layer located on the second end portion and a third covering layer disposed on the surrounding surface located on the connecting portion; andan insulating layer disposed on the first covering layer for exposing the first covering layer and the second covering layer.2. The probe structure according to claim 1 , wherein the insulating layer has a resistivity of more than or equal to 10Ωm.3. The probe structure according to claim 2 , wherein the metal main portion has conductivity claim 2 , and the resistivity of the metal main portion is less than 5×10Ωm.4. The probe structure according to ...

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Номер записи: 76
05-03-2020 дата публикации

MANUFACTURING METHOD OF A MULTI-LAYER FOR A PROBE CARD

Номер: US20200072873A1
Автор: CRIPPA Roberto, MAGGIONI Flavio, VALLAURI Raffaele
Принадлежит:

A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths. 1. A manufacturing method of manufacturing a multi-layer for a probe card , comprising:providing a plurality of dielectric layers starting from a first dielectric layer to a last dielectric layer;providing a first plurality of contact pads realized on a first face of the multi-layer in correspondence of an exposed face of the first dielectric layer;providing a second plurality of contact pads realized on an opposite, second face of the multi-layer, in correspondence of an exposed face of the last dielectric layer;realizing, by laser ablation, in each dielectric layer of the plurality of dielectric layer a plurality of pass-through structures occurring in matching number in each dielectric layer, the matching number of pass-through structures being adapted to put into communication opposite faces of each dielectric layer;filling the plurality of pass-through structures with a conductive material to realize in each dielectric layer a plurality of conductive structures; andsuperimposing the plurality of dielectric layers in a way that each conductive structure of the plurality of conductive ...

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Номер записи: 77
18-03-2021 дата публикации

Integrated Optical/Electrical Probe Card for Testing Optical, Electrical, and Optoelectronic Devices in a Semiconductor Die

Номер: US20210080295A1
Автор: Edward Preisier, Yasir Qamar
Принадлежит: Newport Fab LLC

A test system includes a semiconductor die and an integrated optical/electrical probe card. Electrical, optical, and optoelectronic devices reside in the semiconductor die. Electrical pads in the semiconductor die connect to the electrical and optoelectronic devices. Grating couplers in the semiconductor die connect to the optical device and optoelectronic devices. The electrical pads and grating couplers are interspersed in substantially a single line in the semiconductor die. The integrated optical/electrical probe card interfaces with the electrical pads by electrical needles, and concurrently interfaces with the grating couplers by optical fibers.

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Номер записи: 78
05-03-2020 дата публикации

WIRING BOARD

Номер: US20200077512A1
Автор: HATTORI Masaomi, JIN Guangzhu, KAGA Atsushi, KIMATA Kouta, KONDOU Yousuke, NASU Takakuni
Принадлежит:

A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering. 1. A wiring board comprising:a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer;a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; anda metal member mounted to the second resin board,wherein:the first resin board is superposed to a first surface of the ceramic board;the second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board;the second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal; andthe metal member is joined to the joint pad by brazing or soldering.2. The wiring board according to claim 1 , wherein the resin insulator layers of the first resin board and the second resin board are mainly composed of polyimide.3. The wiring board according to claim 1 , wherein the ceramic insulator layer is mainly composed of alumina or low temperature co-fired ceramic.4. The wiring board according to claim 1 , wherein the metal ...

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Номер записи: 79
31-03-2022 дата публикации

PROBE SUBSTRATE AND ELECTRICAL CONNECTING APPARATUS

Номер: US20220099702A1
Автор: ABE Shintaro, AKINIWA TAKASHI, Goto Kazuya, Kondo Takeshi, OMORI Toshinori, OSANAI YASUAKI, SUGISAWA TAKEKI, WATANABE Maki
Принадлежит:

An object is to enhance the durability of substrates of a probe substrate and/or the probe substrate and a member to be joined. 1. A probe substrate comprising:a plurality of electrical contactors respectively brought into electrical contact with a plurality of electrode terminals of a member to be inspected,wherein a joint portion for a member to be joined is provided on one or each of a first surface and a second surface of the probe substrate and the member to be joined is joined to the joint portion with a metal layer that includes, in a metal component, at least 70 atomic percent or more of a transition metal and that is formed by sintering, and/or in a joining surface between a plurality of substrates of the probe substrate, the substrates are joined together with the metal layer formed by sintering,in the metal layer formed by sintering, a plurality of organic component parts and/or voids formed by heating an adhesive composition including a thermoplastic resin are left anda plurality of the organic component parts and/or the voids included in the metal layer formed by sintering have 5 to 80 area percent in a vertical cross section of the metal layer formed by sintering.2. The probe substrate according to claim 1 , comprising:a plurality of anchor members arranged on the first surface of the probe substrate; anda plurality of support members respectively arranged on a plurality of the anchor members,wherein the member to be joined is each of the anchor members, and each of the anchor members is joined, with the metal layer formed by sintering, to a joining position of each of the anchor member on the first surface of the probe substrate.3. The probe substrate according to or claim 1 ,wherein the electrical contactors are arranged on a plurality of connection terminals formed on the second surface of the probe substrate, andthe member to be joined is each of the electrical contactors, and each of the electrical contactors is joined, with the metal layers ...

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Номер записи: 80
31-03-2022 дата публикации

INTEGRATED CIRCUIT DEVICE TEST TOOLING WITH DUAL ANGLE CAVITIES

Номер: US20220099733A1
Автор: Barabi Nasser, Ho Chee Wah, Kryachek Oksana, Tienzo Joven R.
Принадлежит:

A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block. 1. A test probe assembly useful for testing a packaged integrated circuit (IC) device under test (DUT) , the test probe assembly comprising:a main block having a plurality of main slanted probe cavities oriented at a first acute angle to a vertical axis of the test probe assembly;an upper block having a plurality of upper slanted probe cavities oriented at a second acute angle to the vertical axis, and wherein the first acute angle and the second acute angle are offset relative to each other by a small delta angle;a plurality of slanted compressible probes configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force, each of the probes having a probe barrel which is contained within its probe retention cavity and oppositely extending probe tips, the oppositely extending probe tips of each of the probes being depressible in the probe barrela lower block having a plurality of slanted cylindrical channels oriented at a third acute angle to a vertical axis; anda PCB having a corresponding plurality of pads configured to support the plurality of probes.2. The test probe assembly of wherein as each of the probes is loaded by positioning the test probe assembly against a termination board claim 1 , a side force due to angular positioning of each of the probes causes a movement of the probe barrel towards and establishing an initial contact with a lower region of a corresponding main slanted probe ...

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Номер записи: 81
12-03-2020 дата публикации

PROBE AND A PROBE CARD INCLUDING THE SAME

Номер: US20200081035A1
Автор: Kim Byoung-Joo, LEE MI-RYE, LEE Sung-Hoon, Lee Tae-Jong, YEO HWANG-JIN
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A probe includes a probe body for providing an object with a test signal; a tip arranged on an end of the probe body to make contact with the object; and an alignment key protruded from a side of the probe body. 1. A probe comprising:a probe body for providing an object with a test signal;a tip arranged on an end of the probe body to make contact with the object; andan alignment key protruded from a side of the probe body.2. The probe of claim 1 , wherein the probe body extends in a first horizontal direction and the alignment key extends in a second horizontal direction substantially perpendicular to the first horizontal direction.3. The probe of claim 1 , wherein the tip extends from the end of the probe body in a vertical direction.4. The probe of claim 1 , wherein the alignment key has an angular shape.5. The probe of claim 1 , wherein the alignment key has a rectangular parallelepiped shape.6. The probe of claim 1 , wherein the alignment key is integrally formed with the probe body.7. The probe of claim 1 , wherein the probe body comprises:a vertical beam extended in a vertical direction; anda horizontal beam extended from the vertical beam in a first horizontal direction, wherein the alignment key protrudes from the horizontal beam.8. The probe of claim 1 , wherein the probe body comprises:a vertical beam extended in a vertical direction; anda horizontal beam extended from the vertical beam in a first horizontal direction; andan alignment beam extended from the vertical beam in the first horizontal direction, wherein the alignment key protrudes from the alignment beam.9. The probe of claim 8 , wherein the alignment beam is positioned over the horizontal beam.10. The probe of claim 8 , wherein the alignment beam is shorter than the horizontal beam.11. The probe of claim 1 , wherein the probe body comprises:a beam extended in a first horizontal direction, wherein the alignment key protrudes from the beam and the tip is arranged on the beam; anda post extended ...

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Номер записи: 82
25-03-2021 дата публикации

High density and fine pitch interconnect structures in an electric test apparatus

Номер: US20210088554A1
Автор: Joe Walczyk, Mark Bohr, Pooya Tadayon
Принадлежит: Intel Corp

An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

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Номер записи: 83
25-03-2021 дата публикации

Probing apparatus and method of operating the same

Номер: US20210088581A1
Автор: Choon Leong Lou, Yi Ming Lau
Принадлежит: STAr Technologies Inc

A probing apparatus includes a chuck supporting a DUT, and a platform with an opening above the chuck. The probing apparatus further includes first and second rails positioned at first and second sides of the platform, respectively. The probing apparatus further includes a probing device, the probing device includes a probing module slidably along the first and second rails, and a first motor system configured to automatically align a probe card with the DUT. The probing module includes a third rail with two ends slidably attached to the first and second rails, respectively, a probing stage slidably attached to the third rail, and the probe card attached to the probing stage. The first motor system includes a first motor configured to control movement of the probing stage along the third rail, and a second motor configured to control movement of the probing module along the first and second rails.

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Номер записи: 84
05-05-2022 дата публикации

INSPECTION JIG

Номер: US20220137094A1
Автор: KAIDA Michio
Принадлежит:

An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.

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Номер записи: 85
19-03-2020 дата публикации

Probe card testing device and testing device

Номер: US20200088764A1
Автор: Kai-Chieh Hsieh, Wen-Tsung Lee
Принадлежит: Chunghwa Precision Test Technology Co Ltd

A probe card testing device includes a testing circuit board, a signal transmission board, an electrical connecting module, and a probe head. The testing circuit board has metal pads spaced apart from each other. The signal transmission board has internal pads arranged on a bottom surface thereof and spaced apart from each other. The electrical connecting module includes a spacer having thru-holes and elastic arms positioned on the spacer. The spacer is sandwiched between the testing circuit board and the signal transmission board. The metal pads respectively face the internal pads through the thru-holes. A part of each elastic arm is arranged in one of the thru-holes, and is detachably compressed by one of the metal pads and the corresponding internal pad so as to be elastically deformed to establish an electrical transmission path. The probe head is disposed on a top surface of the signal transmission board.

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Номер записи: 86
19-03-2020 дата публикации

FALSE DETECTION METHOD FOR LOADING PROBE CARD

Номер: US20200088788A1
Автор: HUANG CHIEN-FANG, WANG Chia-Wei, YANG Wei-Jr
Принадлежит:

A method for loading a probe card into a prober is provided. The method includes placing a probe card on a carrier plate and analyzing signals produced by two detection sensors. The detection sensor produces the correct signal when the probe card is placed in a normal state, and produces a false signal when the probe card is placed in an abnormal state. In addition, the method includes sending the probe card into the prober in response to the correct signals produced by both detection sensors. Alternatively, the method includes removing the probe card from the carrier plate and placing the probe card on the carrier plate again after adjustment of the probe card in response to a false signal produced by either of the detection sensors. 1. A method for loading a probe card into a prober , comprising:placing a probe card on a carrier plate of the prober;analyzing signals produced by two detection sensors after the probe card is placed on the carrier plate, wherein the detection sensor produces a correct signal in response to the probe card being located over the corresponding detection sensor in a normal state, and the detection sensor produces a false signal in response to the probe card being located over the corresponding detection sensor in an abnormal state;in response to the correct signals produced by both detection sensors, sending the probe card into the prober; andin response to a false signal produced by either of the detection sensors, removing the probe card from the carrier plate and placing the probe card on the carrier plate again after adjustment of the probe card.2. The method as claimed in claim 1 , wherein adjustment of the probe card comprises:placing the probe card upside down in response to false signals produced by both detection sensors.3. The method as claimed in claim 1 , wherein adjustment of the probe card comprises:flipping the probe card left to right in response to a correct signal produced by one of the detection sensors and a false ...

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Номер записи: 87
19-03-2020 дата публикации

PROBE CARD INSPECTION WAFER, PROBE CARD INSPECTION SYSTEM, AND METHOD OF INSPECTING PROBE CARD

Номер: US20200088827A1
Автор: Ji Joon-su, JUNG JIN-WOO, Kim Dany, Nam Han-jik
Принадлежит:

A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected. 1. A probe card inspection system comprising:a base wafer; andfirst and second probe card inspection chips on the base wafer and spaced apart from each other,wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions,wherein the first and second probe card inspection chips comprise:first pad arrays on the probe vertical-level inspection region, the first pad arrays being configured for inspecting vertical levels of first and second alternating-current AC probes of a probe card to be inspected; andsecond pad arrays on the probe vertical-level inspection region, the second pad arrays being configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.2. The probe card inspection system of claim 1 , wherein the first and second probe card inspection chips are substantially identical to each other.3. The probe card inspection system of claim 1 , wherein each of the first and second AC probes and the first and second VSS probes does not comprise a ...

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Номер записи: 88
19-03-2020 дата публикации

WAFER TESTING APPARATUS AND METHOD OF DIAGNOSING WAFER TESTING APPARATUS

Номер: US20200088828A1
Автор: KUREBAYASHI Shinya
Принадлежит:

A wafer testing apparatus according to an embodiment includes a tester configured to apply electrical signals to a semiconductor device fabricated on a wafer, a prober configured to cause the semiconductor device to be electrically coupled to the tester, a tester controller configured to control an operation of the tester, and a prober controller configured to control an operation of the prober, wherein the tester controller and the prober controller communicate with each other when diagnosing a state of the tester. 1. A wafer testing apparatus , comprising:a tester configured to apply electrical signals to a semiconductor device fabricated on a wafer;a prober configured to cause the semiconductor device to be electrically coupled to the tester;a tester controller configured to control an operation of the tester; anda prober controller configured to control an operation of the prober,wherein the tester controller and the prober controller communicate with each other when performing a diagnostic process for diagnosing a state of the tester.2. The wafer testing apparatus as claimed in claim 1 , wherein the tester controller and the prober controller perform the diagnostic process when one of the tester controller and the prober controller receives operational input for starting the diagnostic process.3. The wafer testing apparatus as claimed in claim 1 , further comprising a control apparatus configured to communicate with the tester controller and the prober controller claim 1 ,wherein the tester controller and the prober controller perform the diagnostic process when the control apparatus receives operational input for starting the diagnostic process.4. The wafer testing apparatus as claimed in claim 1 , wherein the diagnostic process is a process involving loading of a diagnostic board to the tester.5. The wafer testing apparatus as claimed in claim 1 , wherein the tester controller notifies the prober controller of a content of the diagnostic process upon ...

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Номер записи: 89
26-06-2014 дата публикации

PROBE CARD CAPABLE OF TRANSMITTING HIGH-FREQUENCY SIGNALS

Номер: US20140176177A1
Автор: Ku Wei-Cheng, LAI JUN-LIANG
Принадлежит:

A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough. 1. A probe card capable of transmitting high-frequency signals provided by a device under test (DUT) , wherein the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively , the probe card comprising:a first signal pin group, which is made of a conductive material, for contacting the output pin group of the DUT;a second signal pin group, which is made of a conductive material, for contacting the input pin group of the DUT; anda multiband circuit, which is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough, and signals beyond the first and the second bandwidths are attenuated or filtered out; wherein, a lowest frequency of the first bandwidth is 0 Hz, and a highest frequency of the first bandwidth is lower than a lowest frequency of the second band; the high-frequency signals for transmission are within the second bandwidth;whereby, once the output pin group of the DUT sends the high-frequency signals, the high-frequency signals are transmitted to the multiband circuit through the first signal pin group, and then transmitted to the input pin group of the DUT through ...

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Номер записи: 90
12-05-2022 дата публикации

ELECTRICAL CONNECTING APPARATUS

Номер: US20220149549A1
Автор: Fukami Yoshiyuki, HARAKO Shou, KAMIYA Hiroshi, MIZUTANI Shogo, OTABE Noboru
Принадлежит:

[Problem] To provide an electrical connecting apparatus that can realize a stable electrical connecting property by expanding a contact area between an electrode region of a wiring substrate and a connector as compared to the prior art, and suppressing contact resistance. 1. An electrical connecting apparatus characterized in comprising:a first electrode region in which a liquid metal is filled in a first recessed part that is capable of conducting with a substrate electrode of a first wiring substrate;a second electrode region in which a liquid metal is filled in a second recessed part that is capable of conducting with a substrate electrode of a second wiring substrate opposing the first wiring substrate; anda connector that causes conduction between the first electrode region and the second electrode region by bringing one end part into contact with the liquid metal of the first electrode region and bringing the other end part into contact with the liquid metal of the second electrode region.2. The electrical connecting apparatus according to claim 1 , characterized in that a length of the connector is smaller than the length of a distance between a bottom part of the first recessed part and a bottom part of the second recessed part in which the liquid metal is filled.3. The electrical connecting apparatus according to claim 1 , characterized in that both end parts of the connector contacting the liquid metal are floating.4. The electrical connecting apparatus according to claim 1 , characterized in that a contact expanding shape part for expanding a contact property with the liquid metal is provided for both end parts or one of the end parts of the connector.5. The electrical connecting apparatus according to claim 2 , characterized in that both end parts of the connector contacting the liquid metal are floating. The present application claims, under 35 USC 119, priority of Japanese Patent Application No. 2019-043733 filed on Mar. 11, 2019.The present disclosure ...

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Номер записи: 91
26-03-2020 дата публикации

PLATINUM-NICKEL-BASED ALLOYS, PRODUCTS, AND METHODS OF MAKING AND USING SAME

Номер: US20200095653A1
Автор: Bowen Patrick, Smith Edward
Принадлежит:

Platinum-nickel-based ternary or higher alloys include platinum at about 65-80 wt. %, nickel at about 18-27 wt. %, and about 2-8 wt. % of ternary or higher additions that may include one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, and/or Ta. These alloys are age-hardenable, provide hardness greater than 580 Knoop, ultimate tensile strength in excess of 320 ksi, and elongation to failure of at least 1.5%. The alloys may be used in static and moveable electrical contact and probe applications. The alloys may also be used in medical devices. 1. A platinum and nickel-based ternary or higher alloy , wherein the alloy can be age hardened to an ultimate tensile strength of at least 320 ksi or at least HK600 and comprises:a) platinum at about 65 to about 80 wt. % of the alloy;b) nickel at about 18 to about 27 wt. % of the alloy; andc) a ternary or higher addition totaling about 2 to about 8 wt. % of the alloy, wherein the ternary or higher additions comprise one or more of Ir, Pd, Rh, Ru, Nb, Mo, Re, W, Ta, or any combination thereof.2. The alloy of claim 1 , wherein nickel is present at about 19 to about 25 wt. % of the alloy claim 1 , the total ternary or higher additions is present at about 2 to about 7 wt. % of the alloy.3. The alloy of claim 1 , wherein the platinum is present at about 73 to about 80 wt. % of the alloy claim 1 , the nickel is present at about 18 to about 24 wt. % of the alloy claim 1 , and the total ternary or higher addition is present at about 2 to about 7 wt. % of the alloy.4. The alloy of claim 1 , wherein the platinum is present at about 68 to about 73 wt. % of the alloy claim 1 , the nickel is present at about 21 to about 26 wt. % of the alloy claim 1 , and the ternary or higher additions are present at about 2 to about 7 wt. % of the alloy.5. The alloy of claim 1 , wherein the alloy is substantially free of Ti claim 1 , V claim 1 , Cr claim 1 , Mn claim 1 , Fe claim 1 , Co claim 1 , Cu claim 1 , and/or Zn.6. The alloy of claim 1 , wherein the ...

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Номер записи: 92
26-03-2020 дата публикации

INSPECTION APPARATUS, INSPECTION SYSTEM, AND ALIGNING METHOD

Номер: US20200096560A1
Автор: FUJIHARA Jun, KONISHI Kentarou, Ueda Masanori
Принадлежит:

The present disclosure is provided with a probe card and a transfer stage for transferring an inspection target toward the probe card. The transfer stage is provided with a chuck top on which the inspection target is mounted, an aligner configured to be contacted to or separated from the chuck top, and an aligning mechanism for aligning the chuck top with the aligner. The aligning mechanism has radially-expandable positioning pins at a plurality of positions on the upper surface of the aligner, and pin insertion members at positions on the lower surface of the chuck top corresponding to the positioning pins, the pin insertion members having pin insertion holes of which diameters are larger than those of the positioning pins that are not radially expanded. The chuck top is aligned with the aligner by inserting the positioning pins into the pin insertion holes and radially expanding the positioning pins. 1. An inspection apparatus comprising:a probe card that has multiple contact probes to be in contact with an inspection target and that is connected to a tester to inspect electrical characteristics of the inspection target; anda transfer stage configured to transfer the inspection target toward the probe card,wherein the transfer stage includes:a chuck top configured to mount thereon the inspection target;an aligner configured to be brought into contact with the chuck top or separated from the chuck top and configured to move the chuck top; andan aligning mechanism configured to align the chuck top and the aligner,wherein the aligning mechanism has radially-expandable positioning pins disposed at a plurality of positions on one between a bottom surface of the chuck top and an upper surface of the aligner, and pin insertion members disposed on the other one between the bottom surface of the chuck top and the upper surface of the aligner which correspond to the positioning pins, each of the pin insertion members having a pin insertion hole of which diameter is greater ...

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Номер записи: 93
26-03-2020 дата публикации

INSPECTION APPARATUS AND INSPECTION METHOD

Номер: US20200096561A1
Автор: FUJIHARA Jun
Принадлежит:

An inspection apparatus includes: a stage on which an inspection target is mounted; a temperature adjustment mechanism configured to adjust a temperature of the stage; an inspecting part configured to exchange electrical signals for an electrical characteristics inspection with the inspection target; a probe card having terminals in contact with the inspection target; an intermediate connection member having connectors electrically connecting the inspecting part and the probe card; a position adjustment mechanism configured to adjust a relative position between the stage and the probe card; a temperature measurement member configured to measure a temperature of the intermediate connection member; a preliminary temperature adjusting part configured to adjust a temperature of the probe card prior to the electrical characteristics inspection; and a determining part configured to determine whether or not the temperature of the probe card is stabilized, based on the temperature of the intermediate connection member. 1. An inspection apparatus for inspecting an inspection target , the apparatus comprising:a stage on which the inspection target is mounted;a temperature adjustment mechanism installed in the stage and configured to adjust a temperature of the stage;an inspecting part configured to exchange electrical signals for an electrical characteristics inspection with the inspection target;a probe card having terminals in contact with the inspection target during the electrical characteristics inspection;an intermediate connection member having connectors electrically connecting the inspecting part and the probe card, the intermediate connection member being located between the inspecting part and the probe card;a position adjustment mechanism configured to adjust a relative position between the stage and the probe card;a temperature measurement member installed in the intermediate connection member and configured to measure a temperature of the intermediate connection ...

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Номер записи: 94
08-04-2021 дата публикации

HYBRID PROBE CARD FOR TESTING COMPONENT MOUNTED WAFER

Номер: US20210102974A1
Автор: IM Yunchang, LEE Jaebok, PARK Jaehoon
Принадлежит: TEPS CO., LTD.

Disclosed is a probe card including: first probes disposed above a first region and configured to contact with test electrodes in the first region to transfer electrical signals thereto; second probes disposed above a second region and configured to contact with test electrodes on a component mounted in the second region to transfer the electrical signals thereto; a first guide plate disposed to face a semiconductor wafer and formed with first probe holes into which one ends of the first and second probes are inserted; a second guide plate disposed on an upper portion of the first guide plate and formed with second probe holes into which the other ends of the first probes are inserted; and a third guide plate disposed on an upper portion of the first guide plate and formed with third probe holes into which the other ends of the second probes are inserted. 1. A probe card , which is configured to test a semiconductor wafer provided with a first region where a component is not mounted and a second region where a component is mounted , the probe card comprising:a plurality of first probes disposed above the first region and configured to come into contact with test electrodes in the first region to transfer electrical signals thereto;a plurality of second probes disposed above the second region and configured to come into contact with test electrodes on the component mounted in the second region to transfer the electrical signals thereto;a first guide plate disposed to face the semiconductor wafer and formed with a plurality of probe holes into which one ends of the first and second probes are inserted;a second guide plate disposed on an upper portion of the first guide plate and formed with a plurality of probe holes into which the other ends of the first probes are inserted; anda third guide plate disposed on an upper portion of the first guide plate and formed with a plurality of probe holes into which the other ends of the second probes are inserted,wherein a step ...

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Номер записи: 95
08-04-2021 дата публикации

Probe card

Номер: US20210102975A1
Автор: Bum Mo Ahn, Seung Ho Park, Sung Hyun BYUN
Принадлежит: Point Engineering Co Ltd

Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.

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Номер записи: 96
04-04-2019 дата публикации

PROBE ASSEMBLY AND CAPACITIVE PROBE THEREOF

Номер: US20190101568A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

The instant disclosure provides a probe assembly and a capacitive probe thereof. The capacitive probe includes a probe structure, a conductive structure and a dielectric structure. The probe structure includes a first end portion, a second end portion corresponding to the first end portion, and a connecting portion connected between the first end portion and the second end portion. The conductive structure is disposed on one side of the probe structure. The dielectric structure is disposed between the probe structure and the conductive structure. 1. A capacitive probe , comprising:a probe structure having a first end portion, a second end portion corresponding to the first end portion, and a connecting portion connected between the first end portion and the second end portion;a conductive structure disposed at one side of the probe structure; anda dielectric structure disposed between the probe structure and the conductive structure.2. The capacitive probe according to claim 1 , wherein the conductive structure has an accommodating space claim 1 , the dielectric structure is disposed on the second end portion of the probe structure claim 1 , and the second end portion of the probe structure and the dielectric structure are disposed in the accommodating space.3. The capacitive probe according to claim 2 , wherein the second end portion of the probe structure has an exposed portion corresponding to the dielectric structure claim 2 , and the probe structure is electrically connected to the conductive structure through the exposed portion claim 2 , wherein the dielectric portion has a first surface in contact with the probe structure and a second surface in contact with the conductive structure.4. The capacitive probe according to claim 2 , wherein the probes structure and the conductive structure are electrically insulated from each other and the dielectric structure has a first surface in contact with the probe structure and a second surface in contact with the ...

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Номер записи: 97
04-04-2019 дата публикации

LOW-PROFILE GIMBAL PLATFORM FOR HIGH-RESOLUTION IN SITU CO-PLANARITY ADJUSTMENT

Номер: US20190101570A1
Автор: DIGLIO PAUL J., Walczyk Joseph F.
Принадлежит: Intel Corporation

Planar error between a probe card and a semiconductor wafer may be reduced with a low-profile gimbal platform. The low-profile gimbal platform may be coupled between a probe card and a tester head. The low-profiled gimbal platform includes a number of linear actuators and pistons that are used to perform high-precision in situ planarity adjustments to the probe card to achieve co-planarity between the probe card and the semiconductor wafer. The in situ planarity adjustments may reduce the likelihood of malfunctions due to misalignment of the probe card. 1. A low-profile gimbal platform , comprising:a plate having a first surface and a second surface;a first linear actuator horizontally positioned within the plate between the first surface and the second surface, wherein the first linear actuator includes a first shaft that extends and retracts in parallel with the first surface;a first piston coupled to the first shaft, wherein the first piston extends or retracts perpendicularly to the first surface, in response to extension or retraction of the first shaft;a second linear actuator horizontally positioned within the plate between the first surface and the second surface, wherein the second linear actuator includes a second shaft that extends and retracts in parallel with the first surface; anda second piston coupled to the second shaft, wherein the second piston extends or retracts perpendicularly to the first surface, in response to extension or retraction of the second shaft.2. The low-profile gimbal platform of wherein a thickness of the plate is less than or equal to 13 millimeters.3. The low-profile gimbal platform of wherein one or more of the first linear actuator and the second linear actuator are one or more of: a piezoelectric actuator claim 1 , a hydraulic actuator claim 1 , a mechanical actuator claim 1 , a pneumatic actuator claim 1 , and an electro-mechanical actuator.4. The low-profile gimbal platform of wherein one or more of the first linear ...

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Номер записи: 98
02-06-2022 дата публикации

PROBE CARD AND MANUFACTURING METHOD THEREOF

Номер: US20220170961A1
Автор: Hung Chien-Kai, Lin Che-Wei, LIN Chin-Yi, WU Ting-Ju
Принадлежит: MPI corporation

A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component. 1. A probe card , comprising:a probe head;a first substrate comprising an upper surface, wherein the upper surface comprises a plurality of first contacts;a second substrate disposed between the probe head and the first substrate, and disposed on the upper surface of the first substrate, wherein the second substrate comprises a lower surface and a side surface; the lower surface of the second substrate faces the upper surface of the first substrate, the lower surface of the second substrate comprises a plurality of second contacts, and each of the second contacts is electrically connected to a corresponding first contact;a first elastic component disposed between the upper surface of the first substrate and the lower surface of the second substrate, and disposed at an outer side of the second contacts of the second substrate; anda first adhesive member disposed on the upper surface of the first substrate and annular arranged on the side surface of the second substrate, wherein the first adhesive member is disposed at an outer side of the first elastic component.2. The probe card according to claim 1 , wherein claim 1 ,the second substrate further comprises an upper ...

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Номер записи: 99
04-04-2019 дата публикации

PROBE ASSEMBLY AND CAPACITIVE SPACE TRANSFORMER THEREOF

Номер: US20190103850A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

The instant disclosure provides a probe assembly and a capacitive space transformer thereof. The probe assembly includes a space transformer and a plurality of probe structures. The space transformer includes a transfer board and a plurality of dielectric structures. The transfer board includes a plurality of conductive portions. Each of the dielectric structures is disposed on one side of the corresponding conductive portion and contacts the corresponding conductive portion. Each of the dielectric structures is disposed between the corresponding conductive portion and the corresponding probe structure. The probe structure includes a first end portion, a second portion, and a connecting portion connected between the first and second end portions. 1. A probe assembly , comprising:a space transformer including a transfer board and a plurality of dielectric structures, wherein the transfer board has a plurality of conductive portions, each of the dielectric structures being disposed on one side of the conductive portion corresponding thereto and contacting the conductive portion corresponding thereto; anda plurality of probe structures, each of the plurality of probe structures being disposed at one side of the dielectric structure corresponding thereto and contacting the dielectric structure corresponding thereto, wherein each of the dielectric structures is disposed between the conductive portion corresponding thereto and the probe structure corresponding thereto, and each of the probe structures has a first end portion, a second end portion corresponding to the first end portion, and a connecting portion connected between the first end portion and a second end portion.2. The probe assembly according to claim 1 , wherein the dielectric structure has an accommodating space claim 1 , the second end portions of each of the probe structures being disposed in the accommodating space of the dielectric structure corresponding thereto.3. The probe assembly according to claim ...

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Номер записи: 100