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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Применить Всего найдено 2316. Отображено 100.
26-07-2012 дата публикации

Wafer level testing structure

Номер: US20120187972A1
Автор: Wen-Tsung Lee
Принадлежит: Chunghwa Precision Test Technology Co Ltd

A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober.

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Номер записи: 1
02-08-2012 дата публикации

Probe card wiring structure

Номер: US20120194210A1
Автор: Wensen Hung, Yung-Hsin Kuo
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provides a probe card for wafer level testing. The probe card includes a space transformer having first power/ground lines and first signal lines embedded therein, wherein the first power/ground and signal lines are configured to have a first wiring pitch on a first surface and a second wiring pitch on a second surface, the second wiring pitch being substantially less than the first wiring pitch; a printed circuit board bonded to the first surface of the space transformer, wherein the printed circuit board includes second power/ground lines and second signal lines embedded in the printed circuit board and coupled to the first power/ground and signal lines; and conductive lines configured to a surface of the printed circuit board remote to the first surface of the space transformer, wherein each of the conductive lines includes a first end coupled to one of the second signal lines and a second end coupled to a different location of the printed circuit board.

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Номер записи: 2
20-09-2012 дата публикации

Wireless probe card verification system and method

Номер: US20120239339A1
Автор: Susumu Kaneko
Принадлежит: Formfactor Inc

A probe card assembly can include a wireless link to an external verifier (e.g., debugger). The wireless link can interface to a boundary scan interface of a controller on the probe card assembly. The wireless link can allow for verification of the probe card assembly while it is installed within a prober.

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Номер записи: 3
15-11-2012 дата публикации

3D IC Testing Apparatus

Номер: US20120286814A1
Автор: Chih-Chia Chen, Ching-Nen Peng, Hao Chen, Hung-Chih Lin, Mill-Jer Wang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A three dimensional (3D) integrated circuit (IC) testing apparatus comprises a plurality of connection devices. When a device under test (DUT) such as an interposer or a 3D IC formed by a plurality of 3D dies operates in a testing mode, the 3D IC testing apparatus is coupled to the DUT via a variety of interface channels such as probes. The connection devices and a variety of through silicon vias (TSVs) in the DUT form a TSV chain so that a electrical characteristic test of the variety of TSVs can be tested all at once.

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Номер записи: 4
24-01-2013 дата публикации

Wafer prober integrated with full-wafer contacter

Номер: US20130021052A1
Автор: Morgan T. Johnson
Принадлежит: Advanced Inquiry Systems Inc

Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober, removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.

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Номер записи: 5
07-02-2013 дата публикации

Probing device

Номер: US20130033283A1
Автор: Chien-Chou Wu, Chung-Che LI, Ming-Chi Chen
Принадлежит: MPI Corp

A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.

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Номер записи: 6
30-05-2013 дата публикации

Hybrid Electrical Contactor

Номер: US20130135001A1
Автор: Keith J. Breinlinger
Принадлежит: Formfactor Inc

An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

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Номер записи: 7
04-07-2013 дата публикации

Wiring board and probe card using the same

Номер: US20130169305A1
Автор: Kenji Terada, TAKAYUKI Taguchi
Принадлежит: Kyocera SLC Technologies Corp

A wiring board 3 according to the present invention includes a first resin layer 18 a formed of a thermoplastic resin; a conductive layer 16 formed partially on the first resin layer 18 a ; a through hole P for insertion of a screw formed in a region where the conductive layer 16 is not formed and penetrating through the first resin layer 18 a in a thickness direction thereof; and a dummy via hole D formed in a region between the through hole P and the conductive layer 16 and penetrating through the first resin layer 18 a.

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Номер записи: 8
12-09-2013 дата публикации

TRANSFERRING ELECTRONIC PROBE ASSEMBLIES TO SPACE TRANSFORMERS

Номер: US20130234748A1
Автор: CROS Florent, NAMBURI Lakshmikanth
Принадлежит: ADVANTEST CORPORATION

Transferring electronic probe assemblies to space transformers. In accordance with a first method embodiment, a plurality of probes is formed in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes. The tips of the plurality of probes are formed adjacent to the sacrificial substrate and the remaining structure of the plurality of probes extends outward from the sacrificial substrate. The sacrificial material comprising the plurality of probes is attached to a space transformer. The space transformer includes a plurality of contacts on one surface for contacting the plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than the probe pitch, wherein each of the second plurality of contacts is electrically coupled to a corresponding one of the plurality of probes. The sacrificial substrate is removed, and the sacrificial material is removed, leaving the plurality of probes intact. 1. A method comprising:forming a plurality of probes in a sacrificial material on a sacrificial substrate via microelectromechanical systems (MEMS) processes,wherein tips of said plurality of probes are formed adjacent to said sacrificial substrate and the remaining structure of said plurality of probes extends outward from said sacrificial substrate;attaching said sacrificial material comprising said plurality of probes to a space transformer,wherein said space transformer comprises a plurality of contacts on one surface for contacting said plurality of probes at a probe pitch and a corresponding second plurality of contacts on another surface at a second pitch, larger than said probe pitch, wherein each of said second plurality of contacts is electrically coupled to a corresponding one of said plurality of probes;removing said sacrificial substrate; andremoving said sacrificial material, while leaving said plurality of probes intact.2. The method of wherein said ...

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Номер записи: 9
26-12-2013 дата публикации

PROBE CARD AND MANUFACTURING METHOD

Номер: US20130342232A1
Автор: Park Young Geun
Принадлежит: M2N INC.

There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips. 1. A probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies , the probe card comprising:a printed circuit board on which a plurality of pads are formed;a block plate having a plurality of grooves and attached to the printed circuit board;a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; anda plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.2. The probe card of claim 1 , a body part having a plurality of slits that define a space transformation path; and', 'a plurality of micro pins that are inserted into the plurality of slits to electrically connect the printed circuit board to the sub-probe units., 'wherein the interposer/space transformer unit comprises3. The probe card of claim 2 ,wherein one of the interposer/space ...

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Номер записи: 10
06-03-2014 дата публикации

Space Transformation Methods

Номер: US20140062522A1
Автор: Armen Y. Balian, Erkan Acar, Ethan Caughey, Pooya Tadayon
Принадлежит: Intel Corp

A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

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Номер записи: 11
27-03-2014 дата публикации

Fine pitch interposer structure

Номер: US20140084955A1
Автор: Kai-Chieh Hsieh, Wen-Tsung Lee, Yuan-Chiang Teng
Принадлежит: Chunghwa Precision Test Technology Co Ltd

A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate.

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Номер записи: 12
03-04-2014 дата публикации

FINE PITCH INTERFACE FOR PROBE CARD

Номер: US20140091826A1
Автор: Chui Ka Ng
Принадлежит:

A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit. 1. A probe card interface comprising:an impedance control element to interface a first set of pins of a probe head with a first circuit, wherein the impedance control element is configured to control the impedance of the first set of pins; anda printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit, wherein the PCB is coupled to provide at least one of power or ground to the second set of pins.2. The probe card interface of claim 1 , wherein the impedance control circuitry comprises a dielectric substrate coupled between two ground planes claim 1 , and wherein the first set of pins is disposed claim 1 , at least in part claim 1 , within the dielectric substrate.3. The probe card interface of claim 2 , wherein one or more of the pins of the first set of pins comprises a conductive wire.4. The probe card interface of claim 2 , wherein the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer.5. The probe card interface of claim 4 , wherein the first conductive layer is coupled to ground claim 4 , and wherein the second conductive layer is coupled to a ...

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Номер записи: 13
05-01-2017 дата публикации

PROBE MODULE SUPPORTING LOOPBACK TEST

Номер: US20170003319A1
Автор: HO CHIH-HAO, Ku Wei-Cheng, LAI JUN-LIANG, Wei Hao
Принадлежит: MPI corporation

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes an adapter, two probes, two inductive components provided at the adapter, and a capacitive component. The adapter has two connecting circuits. An end of each of the probes is connected to one of the connecting circuits, while another end thereof, which is a tip, contacts the DUT. Each of the inductive components has an end electrically connected to one of the connecting circuits, and another end electrically connected to the PCB through a conductive member, which is provided at the adapter, wherein two ends of the capacitive component are electrically connected to one of the connecting circuits, respectively. Whereby, the signal paths are changed by the differences between frequencies of signals, and the transmission path of high-frequency signals is effectively shortened. 1. A probe module , which is provided between a printed circuit board (PCB) and a device-under-test (DUT) to perform a loopback test , comprising:an adapter, which has a surface, and is provided with two connecting circuits;two probes, wherein each of which has an end electrically connected to one of the connecting circuits, while another end thereof, which is a tip, contacts a tested pad on the DUT;two inductive components provided at the surface of the adapter, wherein each of the inductive components has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the PCB through a conductive member; anda capacitive component provided at the surface of the adapter, wherein the capacitive component has two ends, and one of the ends is electrically connected to one of the connecting circuits, while the other one of the ends is electrically connected to the other one of the connecting circuits.2. The probe module of claim 1 , wherein the adapter has a first surface claim 1 , a second surface opposite to the first ...

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Номер записи: 14
04-01-2018 дата публикации

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES, FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20180003737A1
Автор: Johnson Morgan T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package. 125-. (canceled)26. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side site.27. The apparatus of claim 26 , wherein the nanospikes are made of a material selected from a group consisting of tantalum nitride claim 26 , tungsten carbide claim 26 , hafnium carbide claim 26 , titanium carbide claim 26 , titanium diboride claim 26 , molybdenum carbide claim 26 , rhenium diboride claim 26 , and a combination thereof.28. The apparatus of claim 26 , wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 26 , triangular claim 26 , convex claim 26 , and a combination thereof.29. The apparatus of claim 26 , wherein a shape of the nanospikes is selected from a group consisting of a star claim 26 , a blade claim 26 , a cross claim 26 , a spike claim 26 , and a combination thereof.30. The apparatus of claim 26 , wherein the nanospikes comprise a cover material.31. The apparatus of claim 26 , wherein the nanospikes are approximately 0 ...

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Номер записи: 15
03-01-2019 дата публикации

TESTING APPARATUS AND METHOD FOR MICROCIRCUIT TESTING WITH CONICAL BIAS PAD AND CONDUCTIVE TEST PIN RINGS

Номер: US20190004093A1
Автор: Andres Michael, Campion Dan, DeBauche John, Eshult Brian, Halvorson Brian, Rott Steve, Sherry Jeffrey
Принадлежит:

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections. 1. A test system for testing integrated circuits (IC) comprising:a. an upper probe guide plate having an array of spaced apart upper apertures for receiving a test probe;b. an anti-intrusion layer proximate said upper probe guide plate, said layer having a like array of spaced apart lower apertures, collinearly aligned with the apertures of said upper guide, or receiving a test probe;c. an elastomeric block have a like a like array of spaced apart apertures, collinearly aligned with the passages of said upper guide, for receiving a test probe;d. a plurality of elongated test probes having a probe tip at its distal end and a connecting end at its proximal end, and a cross member extending generally orthogonally from each of said probes, said cross member being of such extent that it cannot pass through said upper apertures or said passages in said elastomeric material;e. said test probes passing through said upper and lower apertures and said passages, with said cross member located between said upper probe guide plate and said anti-intrusion later, so that the bias force of the elastomer drives said probes upwardly thorough said upper plate to a stop where said cross member engages said upper plate;f. said proximal ends of said test probes being group into a plurality of subgroups, each of the ends in said subgroup having the same height as measured from the lower probe ...

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Номер записи: 16
20-01-2022 дата публикации

Probe unit

Номер: US20220018877A1
Автор: Shuji Takahashi, Tsuyoshi Inuma
Принадлежит: NHK Spring Co Ltd

A probe unit includes: a first contact probe configured to come in contact with a signal electrode; a second contact probe configured to come in contact with a ground electrode; a probe holder including a first holder hole through which the first contact probe passes, and a second holder hole through which the second contact probe passes; and a conductive floating member including a first through hole to which the first contact probe is inserted and the signal electrode is inserted, and a second through hole to which the second contact probe is inserted and the ground electrode is inserted. The probe holder is configured such that at least an inner circumferential surface of the first holder hole has an insulating property, and the probe unit has a coaxial structure in which central axes of the first contact probe and the first through hole are aligned with each other.

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Номер записи: 17
10-01-2019 дата публикации

Test Fixture with Sintered Connections Between Mother Board and Daughter Board

Номер: US20190011497A1
Автор: Randal LeRay Newby
Принадлежит: Texas Instruments Inc

A test fixture includes a mother board that has test signal lines configured to couple to a test station. The mother board includes a recessed region with contact pads coupled to the test signal lines. A daughter board is engaged with the recessed region such that a top surface of the daughter board is approximately coplanar with a top surface of the mother board. The daughter board includes test signal lines coupled to contact pads on the daughter board. The contact pads on the daughter board align with the contact pads on the mother board and are permanently coupled by sintered bonds.

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Номер записи: 18
15-01-2015 дата публикации

Probe module supporting loopback test

Номер: US20150015290A1
Автор: Chan Hung Huang, Hsin Hsiang Liu, Jun-Liang Lai, Kuang Chung Chou, Wei Chen, Wei-Cheng Ku
Принадлежит: MPI Corp

A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.

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Номер записи: 19
03-02-2022 дата публикации

Connecting device for inspection

Номер: US20220034821A1
Автор: Minoru Sato
Принадлежит: Micronics Japan Co Ltd

A connecting device for inspection includes optical probes, and a probe head including a plurality of guide plates. The probe head includes a first guide plate, and a second guide plate arranged movably with respect to the first guide plate in a radial direction of the penetration holes in a state in which the optical probes are inserted to the respective penetration holes. The probe head holds the optical probes by inner wall surfaces of the penetration holes of the first guide plate and inner wall surfaces of the penetration holes of the second guide plate in a state in which the positions of the central axes of the penetration holes of the first guide plate are shifted in the radial direction from the positions of the central axes of the penetration holes of the second guide plate.

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Номер записи: 20
03-02-2022 дата публикации

Probe head for a testing apparatus of electronic devices with enhanced filtering properties

Номер: US20220034966A1
Автор: Flavio Maggioni
Принадлежит: Technoprobe SpA

A probe head comprises a plate-shaped support including respective pluralities of guide holes, a plurality of contact probes being slidingly housed in the respective pluralities of guide holes and including at least a first group of contact probes being apt to carry only one type of signal chosen between ground and power supply signals, a conductive portion realized on the support and including a plurality of the guide holes housing the contact probes of the first group, and at least one filtering capacitor having at least one capacitor plate being electrically connected to the conductive portion, the conductive portion electrically connecting the contact probes of the first group.

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Номер записи: 21
17-01-2019 дата публикации

TEST SOCKET ASSEMBLY

Номер: US20190018045A1
Автор: Jeong Jae-Hwan
Принадлежит:

A test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit. The test socket assembly includes: a plurality of signal probes; a socket block including a bottom surface facing toward the testing circuit, a top surface facing toward the test object, a plurality of probe holes for accommodating the plurality of signal probes to be parallel with one another while opposite ends of the signal probes are exposed from the top surface and the bottom surface, and a recessed portion recessed from at least partial area of the top surface and the bottom surface excluding a circumferential area of the probe holes; and an elastic grounding member accommodated in the recessed portion and made of a conductive elastic material to come into contact with at least one of the test object and the testing circuit. 1. A test socket assembly for electrically connecting a contact point to be tested in a test object and a contact point for testing in a testing circuit , the test socket assembly comprising:a plurality of signal probes;a socket block comprising a bottom surface facing toward the testing circuit, a top surface facing toward the test object, a plurality of probe holes for accommodating the plurality of signal probes to be parallel with one another while opposite ends of the signal probes are exposed from the top surface and the bottom surface, and a recessed portion recessed from at least partial area of the top surface and the bottom surface excluding a circumferential area of the probe holes; andan elastic grounding member accommodated in the recessed portion and made of a conductive elastic material to come into contact with at least one of the test object and the testing circuit.2. The test socket assembly according to claim 1 , wherein the socket block comprises an isolation column surrounding an upper end area of the probe and protruding from a lower surface of the recessed portion.3. ...

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Номер записи: 22
26-01-2017 дата публикации

CONTACT-DISTANCE TRANSFORMER, ELECTRICAL TESTING DEVICE, AND METHOD FOR PRODUCING A CONTACT-DISTANCE TRANSFORMER

Номер: US20170023615A1
Автор: Ekin Cetin
Принадлежит: FEINMETALL GMBH

A contact-distance transformer of an electric testing device for testing an electric specimen such as a wafer, for reducing a distance between neighboring electric contacts, the transformer having a non-electrically conductive supporting structure with a first side with first electric contacts positioned apart a first distance and a second side with second electric contacts positioned apart a second, smaller distance. The first contacts are connected to the second contacts by electric connections passing through the support structure and/or which are positioned on the support structure. 125-. (canceled)26. A contact-distance transformer of an electric testing device for testing an electric specimen ,a non-electrically conductive supporting structure provided with a first side and a second side, the first side having first electric contacts positioned at a first contact distance to each other, the second side having second electric contacts positioned at a contact distance to each other which is smaller than the first contact distance, the first electric contacts connected to the second electric contacts by electric connections passing through the support structure and/or positioned on the support structure,wherein both the support structure and the electric connections are formed as 3D-printed components, andwherein the contact-distance transformer is used to reduce a distance between neighboring electric contacts.27. The contact-distance transformer according to claim 26 , wherein the first and/or second electric contacts are also formed as 3D-printed components.28. The contact-distance transformer according to claim 26 , wherein at least a first and/or at least a second contact are formed by the front surface of at least one of the electric connections.29. The contact-distance transformer according to claim 26 , wherein the transformer is formed exclusively of 3D-printed components.30. The contact-distance transformer according to claim 26 , wherein the ...

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Номер записи: 23
26-01-2017 дата публикации

INTERDIGITIZED POLYSYMMETRIC FANOUTS, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20170023616A1
Автор: Johnson Morgan T.
Принадлежит: Translarity, Inc.

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies includes a wafer translator having a wafer-side facing the dies and an inquiry-side facing away from the wafer-side. The inquiry-side of the wafer translator carries a first and a second plurality of inquiry-side contact structures. The first plurality of the inquiry-side contact structures is interleaved with the second plurality of the inquiry-side contact structures. 1. An apparatus for testing semiconductor dies , comprising: a wafer-side facing the dies, wherein the wafer-side of the wafer translator carries a first and a second plurality of wafer-side contact structures, wherein the first plurality of the wafer-side contact structures is configured to face die contacts of a first die, and wherein the second plurality of the wafer-side contact structures is configured to face the die contacts of a second die;', 'an inquiry-side facing away from the wafer-side, wherein the inquiry-side of the wafer translator carries a first and a second plurality of inquiry-side contact structures; and', 'conductive traces connecting the first plurality of the wafer-side contact structures with the first plurality of inquiry-side contact structures, and the second plurality of the wafer-side contact structures with the second plurality of inquiry-side contact structures,, 'a wafer translator having'}wherein the first plurality of the inquiry-side contact structures is interleaved with the second plurality of the inquiry-side contact structures.2. The apparatus of wherein the wafer-side contact structures have a first scale claim 1 , wherein the inquiry-side contact structures have a second scale claim 1 , and wherein the first scale is smaller than the second scale.3. The apparatus of wherein the inquiry-side contact structures of the first plurality of the wafer-side contact structures are arranged in a first pattern ...

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Номер записи: 24
26-01-2017 дата публикации

SHAPING OF CONTACT STRUCTURES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20170023617A1
Автор: Aitken Thomas, Lane Christopher T., Preston Douglas A., Ruffler Jens
Принадлежит: Translarity, Inc.

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for adjusting a wafer translator for testing semiconductor dies includes the semiconductor wafer translator having a wafer translator substrate with a wafer-side configured to face the dies. A plurality of wafer-side contact structures is carried by the wafer-side of the wafer translator. The apparatus also includes a shaping wafer having a shaping wafer substrate, and a plurality of cavities in the shaping wafer substrate. The wafer-side contact structures are shaped by contacting surfaces of the cavities of the shaping wafer substrate. 1. An apparatus for adjusting a wafer translator for testing semiconductor dies , comprising: a wafer translator substrate having a wafer-side configured to face the dies, and an inquiry-side facing away from the wafer-side, and', 'a plurality of wafer-side contact structures carried by the wafer-side of the wafer translator; and, 'the semiconductor wafer translator comprising a shaping wafer substrate, and', 'a plurality of cavities in the shaping wafer substrate, wherein individual cavities face individual wafer-side contact structures, and wherein the wafer-side contact structures are shaped by contacting surfaces of the cavities of the shaping wafer substrate., 'a shaping wafer comprising2. The apparatus of claim 1 , further comprising inquiry-side contact structures claim 1 , wherein the wafer-side contact structures have a first scale claim 1 , wherein the inquiry-side contact structures have a second scale claim 1 , and wherein the first scale is smaller than the second scale.3. The apparatus of claim 1 , wherein the cavities of the shaping wafer are arranged in a first pitch claim 1 , wherein the wafer-side contact structures are arranged in a second pitch claim 1 , and wherein the first pitch and the second pitch are the same.4. The apparatus of claim 1 , wherein the wafer-side contact ...

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Номер записи: 25
26-01-2017 дата публикации

LOST MOTION GASKET FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20170023642A1
Автор: Buck Doug, Gardiner Mark, Johnson Morgan T., Kalnin Nikolai, Lane Christopher T., Preston Douglas A.
Принадлежит: Translarity, Inc.

Systems and methods for testing semiconductor wafers using a wafer translator are disclosed herein. In one embodiment, an apparatus for testing semiconductor dies includes a semiconductor wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer-side. The apparatus also includes a flexible arm peripherally connected to the wafer translator, and an evacuation opening within the flexible arm or within the wafer translator. The evacuation opening is open to a flow of a gas in a first position of the flexible arm, and closed to a flow of the gas in a second position of the flexible arm. 1. An apparatus for testing semiconductor dies , comprising:a semiconductor wafer translator having a wafer-side positioned to face toward a device under test, and an inquiry-side facing away from the wafer-side;a flexible arm peripherally connected to the wafer translator; andan evacuation opening at least partially disposed within the flexible arm or within the wafer translator2. The apparatus of wherein the evacuation opening is open to a flow of a gas in a first position of the flexible arm claim 1 , and closed to the flow of the gas in a second position of the flexible arm.3. The apparatus of claim 2 , further comprising a vent seal at least partially disposed inside the evacuation opening claim 2 , wherein the vent seal closes the evacuation opening in the second position of the flexible arm.4. The apparatus of claim 2 , further comprising a vent seal at least partially disposed over an opening of the evacuation opening claim 2 , wherein the vent seal closes the evacuation opening in the second position of the flexible arm.5. The apparatus of wherein the flexible arm comprises an elastomer.6. The apparatus of wherein the flexible arm is attached to a chuck attachment.7. The apparatus of wherein the wafer translator is in contact with a semiconductor wafer in the second position of the flexible arm.8. The ...

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Номер записи: 26
25-01-2018 дата публикации

CONTACT PROBE AND CORRESPONDING TESTING HEAD

Номер: US20180024166A1
Автор: Acconcia Daniele, VALLAURI Raffaele
Принадлежит:

It is described a contact probe for a testing head for a testing apparatus of electronic devices, the probe comprising a probe body extended in a longitudinal direction between respective end portions adapted to contact respective contact pads, the second end being a contact tip adapted to abut onto a contact pad of the device under test, the body of each contact probe having a length of less than 5000 μm, and including at least one pass-through opening extending along its longitudinal dimension. Conveniently, the at least one pass-through opening is filled by a filling material, in order to define at least one first and one second lateral portions in the body, being parallel and joined to each other by a connecting central portion realized by the filling material at the pass-through opening, the connecting central portion made of the filling material acting as a strengthening element. 1. A contact probe of a testing head for a testing apparatus of electronic devices comprising:a probe body having a length of less than 5000 μm;a first end portion being a contact tip of the contact probe and configured to abut onto a contact pad of a device under test;a second end portion being a contact head of the contact probe and configured to abut onto a contact pad of a space transformer;the probe body extending in a longitudinal direction between the end portions and comprising a pass-through opening, extending along a longitudinal dimension of the probe body,wherein the pass-through opening is filled by a filling material defining first and second lateral portions in the probe body,the first and second lateral portions being parallel and joined to each other by a connecting central portion of the filling material at the first pass-through opening, andthe connecting central portion of the filling material acting as a first strengthening element of the contact probe.2. The contact probe of claim 1 , wherein:the pass-through opening is one of a plurality of pass-through openings ...

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Номер записи: 27
25-01-2018 дата публикации

PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES WITH ENHANCED FILTERING PROPERTIES

Номер: US20180024167A1
Автор: MAGGIONI Flavio
Принадлежит:

A probe card for a testing apparatus of electronic devices comprises at least one testing head housing a plurality of contact probes, each contact probe having at least one contact tip abutting onto contact pads of a device under test, as well as at least one space transformer realizing a spatial transformation of the distances between contact pads made on its opposite sides and connected by means of suitable conductive tracks or planes, as well as a plurality of filtering capacitors provided between the space transformer and a PCB, which comprises direct conductive tracks or planes contacting conductive portions of the filtering capacitors. 1. A probe card for a testing apparatus of electronic devices comprises:a testing head housing a plurality of contact probes having respective contact tips configured to abut onto contact pads of a device under test, and first contact pads made on a first side of the space transformer;', 'second contact pads made on a second side, opposite to the first side, of the space transformer; and', 'conductive tracks or planes connecting at least some of the first contact pads to the second contact pads,', 'the space transformer realizing a spatial transformation of distances between the first contact pads and distances between the second contact pads,, 'a space transformer comprisinga printed circuit board (PCB),a first plurality of filtering capacitors provided between the space transformer and the PCB,wherein the PCB comprises direct conductive tracks or planes electrically contacting conductive portions of the filtering capacitors.2. The probe card of claim 1 , wherein at least some of the the conductive tracks or planes of the space transformer electrically contact the conductive portions of the filtering capacitors claim 1 , a combination of the conductive tracks or planes of the space transformer claim 1 , the direct conductive tracks or planes of the PCB claim 1 , and the conductive portions allowing a signal transmission between ...

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Номер записи: 28
23-01-2020 дата публикации

High density and fine pitch interconnect structures in an electric test apparatus

Номер: US20200025801A1
Автор: Joe Walczyk, Mark Bohr, Pooya Tadayon
Принадлежит: Intel Corp

An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

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Номер записи: 29
28-01-2021 дата публикации

METHOD FOR ELECTRICALLY CONNECTING A TEST PIECE TO AN ELECTRICAL TEST DEVICE

Номер: US20210025920A1
Автор: Böhm Gunther
Принадлежит:

The invention relates to a test card () for electrically connecting a test piece () to an electrical test device (), having at least one holding element () and having a plurality of electrically conductive contact devices () which are guided and supported by the holding element (), wherein the holding element () has a plurality of openings () for guiding and/or supporting the contact devices () through which openings in each case one of the contact devices () extends. According to the invention, the holding element () has a three-dimensional structure. 1123459454598945. A test card () for electrically connecting a test piece () to an electrical test device () , having at least one holding element ( , ) and having a plurality of electrically conductive contact devices () guided and/or supported by the holding element ( , ) , the holding element ( , ) for guiding and/or supporting the contact devices () having a plurality of openings () through which one of the contact devices () extends , characterized in that the holding element ( , ) has a three-dimensional structure.245. The test card according to claim 1 , characterized in that the holding element ( claim 1 , ) is a three-dimensionally structured glass claim 1 , in particular a quartz glass.345. The test card according to claim 1 , characterized in that the holding element ( claim 1 , ) is a three-dimensionally structured ceramic element.49. The test card according to claim 1 , characterized in that the respective contact device () is designed as a needle-shaped contact element claim 1 , in particular a contact needle or bendable needle claim 1 , or as a spring contact pin.545679817. The test card according to claim 1 , characterized in that the holding element ( claim 1 , ) is designed as a guide plate ( claim 1 , ) for the contact devices () claim 1 , the openings () being designed as microbores () having a course deviating from a cylinder in their longitudinal extent.6171819. The test card according to claim 1 ...

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Номер записи: 30
01-02-2018 дата публикации

COMMON BOARD OF AN ADAPTOR FOR A TESTER, ADAPTOR FOR A TESTER, AND TESTER INCLUDING THE COMMON BOARD

Номер: US20180031607A1
Автор: JANG Yong-Chul, SHIN Hee-Jung
Принадлежит:

A common board of an adaptor for a tester may include a common insulating plate, a common test signal line, a common power line, and a common ground line. The common test signal line may be arranged in the common insulating plate to provide at least one object with a test signal. The common power line may be arranged in the common insulating plate to provide the object with power. The common ground line may be arranged in the common insulating plate to ground the object. Therefore, when one kind of object may be changed into other different kinds of objects, only the adapting board may be replaced with a new adapting board corresponding to the other kinds of the objects without changing of the entire adaptor. 1. A common board of an adaptor for a tester , the common board comprising:a common insulating plate;a common test signal line arranged in the common insulating plate to provide at least one object with a test signal;a common power line arranged in the common insulating plate to provide the at least one object with power; anda common ground line arranged in the common insulating plate to ground the at least one object.2. The common board of claim 1 , wherein the common power line comprises an electromagnetic band gap (EBG) structure.3. The common board of claim 2 , wherein the EBG structure comprises:at least one dielectric layer; anda conductive line arranged at each side of the at least one dielectric layer.4. The common board of claim 3 , wherein the at least one dielectric layer and associated conductive lines include units that are repeatedly arranged in lengthwise and breadthwise directions.5. The common board of claim 3 , wherein the at least one dielectric layer is a part of the common insulating plate.6. The common board of claim 1 , wherein the common ground line comprises an electromagnetic band gap (EBG) structure.7. The common board of claim 6 , wherein the EBG structure comprises:at least one dielectric layer; anda conductive line arranged at each ...

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Номер записи: 31
30-01-2020 дата публикации

SPACE TRANSFORMER AND MANUFACTURING METHOD THEREOF

Номер: US20200033381A1
Автор: Hu Dyi-Chung
Принадлежит:

A space transformer for connecting a signal source and probing a semiconductor wafer and a manufacturing method thereof are provided. The space transformer includes a circuit board including a wiring structure, a redistribution structure bonded to the circuit board and including second contact pads configured to probe the semiconductor wafer, a conductive through via penetrating through the circuit board and providing a vertical conductive path between the circuit board and redistribution structure. A plurality of first contact pads of the wiring structure is configured to connect the signal source. The redistribution structure is thinner than the circuit board, wherein a pitch of the adjacent second contact pads is finer than that of the adjacent first contact pads. 1. A space transformer for connecting a signal source and probing a semiconductor wafer , the space transformer comprising:a circuit board comprising a wiring structure, a plurality of first contact pads of the wiring structure configured to connect the signal source;a redistribution structure bonded to the circuit board and comprising a plurality of second contact pads, the second contact pads configured to probe the semiconductor wafer, the redistribution structure being thinner than the circuit board, wherein a pitch of the adjacent second contact pads is finer than that of the adjacent first contact pads; anda conductive through via penetrating through the circuit board and providing a vertical conductive path between the circuit board and redistribution structure.2. The space transformer according to claim 1 , wherein the redistribution structure further comprises a patterned dielectric layer having an outer surface substantially leveled with outer surfaces of the second contact pads.3. The space transformer according to claim 1 , wherein the wiring structure of the circuit board comprises a first conductive via connected to the first contact pads claim 1 , the redistribution structure comprises a ...

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Номер записи: 32
08-02-2018 дата публикации

Test probing structure

Номер: US20180038894A1
Автор: Chao-Yang Yeh, Chin-Chou Liu, Ching-Fang Chen, Chung-Sheng Yuan, Hung-Chih Lin, Mill-Jer Wang, Sandeep Kumar Goel, Yun-Han Lee
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

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Номер записи: 33
07-02-2019 дата публикации

Wafer Level Integrated Circuit Probe Array and Method of Construction

Номер: US20190041429A1
Автор: Edwards Jathan, Halvorson Brian, Marks Charles
Принадлежит:

A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin () are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide () is maintained in alignment with the retainer by establishing a registration corner () and driving the guide into the corner by elastomers in at least one diagonally opposite corner. 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. (canceled)7. (canceled)8. A contact pin array assembly for making temporary contact of test pad integrated circuit device under test (DUT) comprising: i. a tip;', 'ii. longitudinal upper portion, having a tip and a bottom end;', 'iii. a pair of laterally extending flanges, having a predetermined width and an upper edge, said flanges extending from said bottom end of said upper portion, and', 'iv. a lower portion extending from said flanges;, 'a. an upper contact pin, configured to move downwardly along a Z-axis when in contact with said pads, the pin having;'}b. a lower pin in slideable contact with the upper pin at said lower portion; i. said guide plate has apertures therethrough size to receive said upper contact pin in slideably therein', 'ii. wherein said longitudinal upper portion is tapered as it approaches its tip so that insertion of the upper pin into the guide plate is eased by said taper., 'c. an guide plate wherein9. (canceled)10. (canceled)11. A method of providing a plurality of coplanar contact pin crowns for test pads on a wafer level integrated circuit , comprising:a. forming a pin guide plate with apertures for said pins, so that said crowns protrude from said apertures;b. forming a stop flange element on each ...

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Номер записи: 34
07-02-2019 дата публикации

TEST DEVICE

Номер: US20190041430A1
Автор: Park Ung-gi
Принадлежит:

A test device for testing electric characteristics of an object to be tested. The test device includes: a first support member comprising a plurality of guide holes; a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member; a plurality of main contact probes; and a plurality of sub contact probes arranged to be adjacent to the main contact probes along a lengthwise direction. According to the present disclosure, contact reliability is improved by multi contact with the terminal of the test circuit board (interposer) and/or the object to be tested. 1. A test device for testing electric characteristics of an object to be tested , the test device comprising:a first support member comprising a plurality of guide holes;a second support member comprising a plurality of terminal holes and arranged to be spaced apart from and in parallel with the first support member;a plurality of main contact probes each comprising a main sliding contact portion to be slidably inserted in the guide hole, a main terminal contact portion to be inserted in the terminal hole, and a main elastic deformation portion connecting the main sliding contact portion and the main terminal contact portion and elastically deformed by compression of a lengthwise direction; anda plurality of sub contact probes each comprising a sub sliding contact portion to be adjacent to the main sliding contact portion and slidably inserted in the guide hole, a sub terminal contact portion to be adjacent to the main terminal contact portion and inserted in the terminal hole, and a sub elastic deformation portion connecting the sub sliding contact portion and the sub terminal contact portion, arranged to be adjacent to the main elastic deformation portion and elastically deformed by compression of a lengthwise direction.2. The test device according to claim 1 , wherein the main terminal contact portion and the sub terminal contact ...

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Номер записи: 35
18-02-2021 дата публикации

PROBE HEAD FOR HIGH FREQUENCY SIGNAL TEST AND MEDIUM OR LOW FREQUENCY SIGNAL TEST AT THE SAME TIME

Номер: US20210048451A1
Автор: Chen Tsung-Yi, Chen Yu-Hao, Hsieh Shang-Jung, LYU JHIN-YING, Yang Chin-Tien, YANG Hui-Pin
Принадлежит: MPI corporation

A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled. 1. A probe head for transmitting a first test signal and a second test signal higher in frequency than the first test signal , the probe head comprising:a probe seat comprising an upper die, a middle die and a lower die, each of the upper die, the middle die and the lower die having a top surface and a bottom surface, which face toward opposite directions, the middle die being disposed between the bottom surface of the upper die and the top surface of the lower die;an electrically conductive layer disposed on one of the upper die, the middle die and the lower die and located inside the probe seat;a first spring probe penetrating through the upper die, the middle die and the lower die for transmitting the first test signal; andat least two second spring probes penetrating through the lower die for transmitting the second test signal, each of the second spring probes being shorter than the first spring probe and having a top end located inside the probe seat, two said second spring probes being electrically connected with each other in a way that the top ends of ...

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Номер записи: 36
19-02-2015 дата публикации

HIGH FREQUENCY PROBING STRUCTURE

Номер: US20150048861A1
Автор: Hung Wensen, Kuo Yung-Hsin
Принадлежит:

A probe card for wafer level test includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes a first surface having a first pitch and a second surface having a second pitch substantially less than the first pitch, a printed circuit board configured approximate the first surface of the space transformer, a first power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line to the printed circuit board, and a second power plane disposed on a surface of the printed circuit board and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, wherein the second power plane is in electrical connection with the first power plane. 1. A probe card for wafer level test , comprising:a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes a first surface having a first pitch and a second surface having a second pitch substantially less than the first pitch;a printed circuit board configured approximate the first surface of the space transformer;a first power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line to the printed circuit board; anda second power plane disposed on a surface of the printed circuit board and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, wherein the second power plane is in electrical connection with the first power plane.2. The probe card of claim 1 , further comprising solder balls configured to couple the signal lines of the space transformer to the printed circuit board.3. The probe card of claim 1 , further comprising an interposer disposed between the space transformer and the printed circuit board claim 1 , the interposer for coupling the power and ...

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Номер записи: 37
03-03-2022 дата публикации

Probe card testing device

Номер: US20220065897A1
Автор: John Hon-Shing Lau, Kuo Ching Tien, Ra-Min Tain, Tzyy-Jang Tseng
Принадлежит: Unimicron Technology Corp

A probe card testing device includes a first sub-circuit board, a second sub-circuit board, a connecting structure layer, a fixing plate, a probe head and a plurality of conductive probes. The first sub-circuit board is electrically connected to the second sub-circuit board by the connecting structure layer. The fixing plate is disposed on the second sub-circuit board and includes an opening and an accommodating groove. The opening penetrates the fixing plate and exposes a plurality of pads on the second sub-circuit board. The accommodating groove is located on a side of the fixing plate relatively far away from the second sub-circuit board and communicates with the opening. The probe head is disposed in the accommodating groove of the fixing plate. The conductive probes are set on the probe head and in the opening of the fixing plate. One end of the conductive probes is in contact with the corresponding pads, respectively.

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Номер записи: 38
26-02-2015 дата публикации

WIRING BOARD FOR TESTING LOADED PRINTED CIRCUIT BOARD

Номер: US20150054539A1
Автор: Koolis Stephen J., Snyder Kenneth R., SWART Mark A., Tackett Douglas W.
Принадлежит:

A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin having a swaged head electrically connected to the external analyzer. 1. A wiring board for transmission of test signals between test point locations on a circuit board under test and an external test analyzer comprising:a non-conductive board having a conductive circuit layer positioned on a top surface, the conductive circuit layer having a first pad and a trace extending to a second pad having a hole for receipt of an interface pin extending through the non-conductive board; anda complaint contact making electrical contact with the test point locations and the first pad of the circuit layer.2. The wiring board of claim 1 , wherein there are multiple conductive circuits on the non-conductive board.3. The wiring board of claim 1 , wherein there is a compliant contact and an interface pin for each conductive circuit.4. The wiring board of claim 1 , wherein the second pad is a via.5. The transfer board of claim 1 , wherein the interface pin extends through the via.6. The transfer board of claim 1 , wherein a short headless pin extends through the via for the sole purpose of connecting the pad on one layer to another layer.7. The wiring board of claim 1 , wherein the via has at least one flap around an opening which engages the interface pin.8. The wiring board of claim 6 , wherein vias on successive layers have at least one flap rotated with respect to adjacent layers.9. The wiring board of claim 1 , wherein the interface pin has a smooth round portion for contacting the pad at the middle or end of a trace.10. The wiring board of claim 1 , wherein the pad is a via.11. The wiring board of claim 1 , wherein the interface pin has a swaged or ...

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Номер записи: 39
25-02-2021 дата публикации

CONNECTOR HAVING CONTACT MEMBERS

Номер: US20210055329A9
Автор: Williams John
Принадлежит: GITech Inc.

An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. The plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape. 1. An electrical connector comprising: a bottom conductive layer; and', 'a bottom insulation layer;, 'a bottom assembly extending along a first direction, the bottom assembly comprising'}a first contact assembly comprising a first plurality of contact members; a first substrate layer;', 'a first conductive layer; and', 'a first encapsulation layer;, 'a first substrate assembly comprising'}a second contact assembly comprising a second plurality of contact members; a second encapsulation layer;', 'a second conductive layer; and', 'a second substrate layer;, 'a second substrate assembly comprising'}a third contact assembly comprising a third plurality of contact members; and a top insulation layer; and', 'a top conductive layer; and, 'a top assembly comprising'}a plurality of conductive vias;wherein the bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order in a second direction perpendicular to the first direction; andwherein the plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly.2. ...

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Номер записи: 40
10-03-2022 дата публикации

Electrical connecting device

Номер: US20220074971A1
Автор: Akihiro SHUTO
Принадлежит: Micronics Japan Co Ltd

An electrical connecting device includes an insulating probe (10) including a bottom-side plunger (11), a top-side plunger (12), and a barrel (13), and a probe head (30) including a combined guide plate (30A) having a conductive region (301) made of a conductive material and an insulating region (302) made of an insulating material arranged adjacent to each other in a planar view. The bottom-side plunger (11) and the top-side plunger (12) are electrically connected to each other inside the barrel (13), and the bottom-side plunger (11) and the top-side plunger (12) are electrically insulated from the barrel (13). The probe head (30) holds the insulating probe (10) in a state in which the barrel (13) penetrates through the conductive region (301). The barrel (13) of the insulating probe (10) is connected to a ground potential via the conductive region (301) when an inspection object (4) is measured.

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Номер записи: 41
21-02-2019 дата публикации

PLANE CORRECTING DEVICE AND SEMICONDUCTOR TESTING APPARATUS INCLUDING THE SAME

Номер: US20190056430A1
Автор: CHEN Wei-Ting, KU Po-Ju
Принадлежит:

A plane correcting device comprises a first base disposed on a test head of a semiconductor testing apparatus; a second base disposed on the prober stage of the semiconductor testing apparatus and opposite to the first base; a plurality of correcting rods disposed between the first base and the second base, wherein a protruding height of each correcting rods may be adjusted to correct the prober stage to a predetermined plane; and a plurality of fixing units disposed on the first base or the second base to fix relative position of the prober stage and the test head. The present invention also provides a semiconductor testing apparatus including the plane correcting device. 1. A plane correcting device comprisinga first base disposed on a test head of a semiconductor testing apparatus;a second base disposed on a prober stage of the semiconductor testing apparatus and opposite to the first base;a plurality of correcting rods disposed between the first base and the second base, wherein a protruding height of each correcting rod is adjustable to align the prober stage to a predetermined plane, wherein the protruding height of each correcting rod is a length of each correcting rod extends between the first base and the second base; anda plurality of fixing units disposed on the first base or the second base for fixing the relative position of the prober stage and the test head.2. The plane correcting device according to claim 1 , wherein each correcting rod has a screw thread on the outer surface thereof.3. The plane correcting device according to claim 1 , wherein the first base extends out of edges of the test head to form extension portions claim 1 , and wherein the plurality of correcting rods penetrates the extension portions and presses against the second base.4. The plane correcting device according to claim 1 , wherein the plurality of fixing units is disposed on the second base.5. The plane correcting device according to claim 1 , wherein the plurality of fixing ...

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Номер записи: 42
01-03-2018 дата публикации

Semiconductor micro probe array having compliance

Номер: US20180059138A1
Автор: Eugene R. Atwood
Принадлежит: International Business Machines Corp

A die probe including a probe tip operably connected to a first surface of a thin film; a metal trace, wherein a first portion of the metal trace is operably connected to a second surface of the thin film, the second surface of the thin film opposite the first surface of the thin film; and an upper space transformer, wherein a second portion of the metal trace is operably connected to the upper space transformer, wherein a pressurized liquid and/or gas is configured to expand a space between the second surface of the thin film and the upper space transformer.

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Номер записи: 43
01-03-2018 дата публикации

PROBE DEVICE OF VERTICAL PROBE CARD

Номер: US20180059140A1
Автор: HSIEH Kai Chieh, LI Wen Tsung
Принадлежит: CHUNGHWA PRECISION TEST TECH. CO., LTD.

A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction. 1. A probe device of a vertical probe card , comprising: a first die having at least one upper opening which penetrates vertically through the first die;', 'a second die having at least one lower opening which penetrates vertically through the second die, and the at least one lower opening being disposed corresponding to the at least one upper opening; and', 'a middle die disposed between the first die and the second die and having at least one middle opening which penetrates vertically through the middle die; and, 'a die assembly, comprisingat least one pin assembly having a first pin, a second pin, and at least one electrical connector,wherein the at least one electrical connector is connected to the first pin and the second pin, the at least one pin assembly is inserted in the die assembly and passes through the at least one upper opening, the at least one middle opening, and the at least one lower opening, the at least one pin assembly is electrically contacted with at least one contact pad of a device under test, the at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction, which is perpendicular to a surface of the at least one contact pad of the device under test.2. The probe ...

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Номер записи: 44
21-02-2019 дата публикации

Interposer Test Structures and Methods

Номер: US20190057912A1
Автор: Hou Shang-Yun, Hu Hsien-Pin, Jeng Shin-Puu, LIU Tzuan-Horng, Wang Tzu-Yu, WU Wei-Cheng, Yu Chen-Hua
Принадлежит:

An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and at least a portion of the test structure is in a first redistribution element. The first redistribution element is on a first surface of a substrate of the interposer. The test structure is intermediate and electrically coupled to at least two probe pads. 1. A method of forming a semiconductor device , the method comprising:forming a first metallization pattern in a first insulating layer over a substrate, the first metallization pattern having a first testing portion in an inner seal ring, a first end portion in an outer seal ring, a first intermediate portion interposed between the first testing portion and the first end portion, a second end portion in the outer seal ring, and a second intermediate portion interposed between the first testing portion and the second end portion;forming a second metallization pattern and a third metallization pattern in a second insulating layer over the first insulating layer, wherein the second metallization pattern is electrically coupled to the third metallization pattern through the first metallization pattern, the second metallization pattern and the third metallization pattern being in the outer seal ring;forming a first probe pad in the outer seal ring over the second metallization pattern, wherein the first probe pad is electrically coupled to the first metallization pattern through the second metallization pattern; andforming a second probe pad in the outer seal over the third metallization pattern, wherein the second probe pad is electrically coupled to the first metallization pattern through the third metallization pattern.2. The method of claim 1 , further comprising:forming a conductive feature in the outer seal ring, wherein the conductive feature extends around the first probe pad in a plan view, wherein the first intermediate portion extends through an ...

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Номер записи: 45
02-03-2017 дата публикации

Testing apparatus and method for microcircuit testing with conical bias pad and conductive test pin rings

Номер: US20170059616A1
Автор: Brian Eshult, Brian Halvorson, Dan Campion, Jeffrey Sherry, John DeBauche, Michael Andres, Steve Rott
Принадлежит: Johnstech International Corp

The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.

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Номер записи: 46
20-02-2020 дата публикации

PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES

Номер: US20200057095A1
Автор: Liberini Riccardo
Принадлежит:

A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support. 1. A probe card comprising:a plurality of contact probes;a probe head housing the plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto a contact pad of a device under test;a main support;a space transformer connected to the main support and adapted to realize a spatial transformation of distances between contact pads on opposite sides of the space transformer;a first connecting element that links the space transformer and the main support, and the connecting element has a substantially rod-like body, a first end portion, and a second end portion,', 'the space transformer has a first housing', 'the first end portion includes a terminal section engaged in the first housing of the space transformer, and', 'the second end portion abuts onto the abutment element linked to the main support., 'an abutment element linked to the main support, wherein2. The probe card of claim 1 , wherein the abutment element rests on the main support.3. The probe card of claim 1 , wherein the abutment element is glued to the main support.4. The probe card ...

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Номер записи: 47
04-03-2021 дата публикации

SMALL PITCH INTEGRATED KNIFE EDGE TEMPORARY BONDING MICROSTRUCTURES

Номер: US20210063439A1
Автор: Brewer Peter, Daniel Erik S., Lopez Aurelio
Принадлежит: HRL LABORATORIES, LLC

A temporary bond method and apparatus for allowing wafers, chips or chiplets. To be tested, the temporary bond method and apparatus comprising: a temporary connection apparatus having one of more knife-edged microstructures, wherein the temporary connection apparatus serves, in use, as a probe device for probing the chiplets, each chiplet including a die having one or more flat contact pads which mate with the one of more knife-edged microstructures of the temporary connection apparatus; a press apparatus for applying pressure between the one or more flat contact pads on the chiplet with the one of more knife-edged microstructures of the temporary connection apparatus thereby forming a temporary bond between the temporary connection pad with the knife-edged microstructure in contact with the one or more flat wafer pads; the press being able to apply a pressure to maintain the temporary bond connection during or prior to testing of the chiplet. 1. An apparatus for making temporary bonds to connection pads on wafers , chips or chiplets during testing of same , the apparatus comprising:a probe head having a plurality of probes associated therewith, the plurality of probes each having sloping sidewalls that converge towards or arrive at at least one point, ridge and/or other contact region, the probe head serving, in use, as a probe device for probing said wafers, chips or chiplets during the testing of same, each wafer, chip or chiplet including a surface with a plurality of connection pads thereon which each mate, during said testing, with a corresponding one or ones of the point(s), ridge(s) or other contact region(s) of the plurality of probes associated with the probe head; anda press apparatus for applying pressure between the plurality of connection pads on a wafer, chip or chiplet to be tested with the one of more probes of the probe head thereby forming a temporary bond connection between each of the plurality of connection pads and corresponding one or ones of ...

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Номер записи: 48
22-05-2014 дата публикации

TEST APPARATUS HAVING A PROBE CORE WITH A TWIST LOCK MECHANISM

Номер: US20140139248A1
Автор: Funk William A., Root Bryan J.
Принадлежит: CELADON SYSTEMS, INC.

A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core. 1. A probe apparatus for testing a semiconductor device comprising:a circuit board having a pattern of signal contacts and a pattern of guard contacts, the circuit board configured as a plate having a top side, a bottom side, and an opening through the top and bottom sides; anda probe core insertable into the opening and configured to be connected and disconnected with the circuit board, the probe core having a frame, a probe tile and a wire guide that support a plurality of probe wires, the plurality of probe wires having an end configured to probe a semiconductor device, and the plurality of probe wires such that each wire has a signal transmitting portion that matches a portion of a respective signal contact in the pattern of signal contacts, and such that each wire has a guard portion that matches a portion of a respective guard contact in the pattern of signal contacts; anda lock mechanism supported on the frame of the probe core,wherein the probe core is lockable onto the circuit board.2. The test apparatus of claim 1 , wherein the probe core is rotatably-lockable onto the circuit board claim 1 , the frame being rotatable relative to the wire guide ...

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Номер записи: 49
28-02-2019 дата публикации

PROBING DEVICE

Номер: US20190064218A1
Автор: TSUJI Yukihiro
Принадлежит: Sumitomo Electric Industries, Ltd.

A probing device includes: a first probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion; a second probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion; a supporting member including an insulating base having a principal face and a back face, and the first probing needle and the second probing needle being supported by the insulating base on the back face; and a holder holding the first portions of the first and second probing needles, and the holder being apart from the probing tip of the first probing needle and the probing tip of the second probing needle. 1. A probing device comprising:a first probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion;a second probing needle including a first portion, a bent portion and a second portion, the first portion having a probing tip, and the bent portion connecting the first portion with the second portion;a supporting member including an insulating base, the insulating base having a principal face and a back face, the principal face being opposite to the back face, and the first probing needle and the second probing needle being supported by the insulating base on the back face; anda holder holding the first portion of the first probing needle and the first portion of the second probing needle, the holder electrically isolating the first probing needle from the second probing needle, and the holder being apart from the probing tip of the first probing needle and the probing tip of the second probing needle.2. The probing device according to claim 1 , wherein the holder has a first opening and a second opening ...

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Номер записи: 50
28-02-2019 дата публикации

Probe card, test apparatus including the probe card, and related methods of manufacturing

Номер: US20190064219A1
Автор: Chang-Keun Kim, Dong-uk Kwon, Duke Kimm, In-Kyu Park, Jae-Hong Kim, Ji-Nyeong Yun, Jun-Bo Yoon, Min-woo Rhee, Seung-Hwan Kim, Yong-Hoon Yoon
Принадлежит: Korea Advanced Institute of Science and Technology KAIST, SAMSUNG ELECTRONICS CO LTD

Provided are improved manufacturing methods of semiconductor devices, probe cards, test apparatuses including the probe card, and methods for manufacturing probe cards. The probe card includes a circuit board, a support located under the circuit board, and a plurality of probe needles located on a bottom surface of the support. Each of the probe needles has a tip configured to contact a side surface of a bump included in a test target. The support may include a stress absorption layer located on a bottom surface to which the probe needles are connected. Manufacturing of semiconductor devices may comprise forming elongated conductive bumps on a body of a semiconductor device, testing the semiconductor device by contacting tips of the probe needles to sides surfaces of the bumps and packaging of the semiconductor device.

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Номер записи: 51
28-02-2019 дата публикации

Vertical probe array having a tiled membrane space transformer

Номер: US20190064220A1
Автор: Coussens Jeffrey, Eldridge Benjamin N., Kuhnert Scott, Watanabe Masanori
Принадлежит:

Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array. 1. A vertical probe head comprising:two or more vertically separated guide plates;two or more vertical probes, wherein each of the two or more vertical probes is disposed in a corresponding set of holes in the two or more vertically separated guide plates;a membrane space transformer configured to provide electrical contact between the two or more vertical probes and a test instrument;wherein each of the two or more vertical probes has a base configured to electrically contact the membrane space transformer and a tip configured to electrically contact a device under test;wherein the membrane space transformer is configured as two or more space transformer sections laterally tiled with respect to each other to cover a lateral area of the vertical probe array;wherein electrical and mechanical contact between bases of the vertical probes and the membrane space transformer is a non-permanent pressure contact.2. The vertical probe head of claim 1 , further comprising one or more metal ground planes;3. The vertical probe head of claim 2 , wherein the one or more metal ground planes are configured as metal traces disposed on at least one of the two or more vertically separated guide plates.4. The vertical probe head of claim 2 , wherein the one or more metal ground planes are configured as one or more metal plates disposed parallel to the two or more ...

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Номер записи: 52
27-02-2020 дата публикации

PROBE CARD BOARD, PROBE CARD, AND INSPECTION APPARATUS

Номер: US20200064375A1
Автор: Imai Tomohiro
Принадлежит:

A probe card board in the present disclosure includes a plurality of through holes designed to receive a probe brought into contact with a measurement object. The probe card board is composed of silicon nitride based ceramics. The probe card board includes a first surface opposed to the measurement object and a second surface located opposite to the first surface. The probe card board contains a plurality of crystal phases of metal silicide. Metal constituting the metal silicide is at least one kind selected from among molybdenum, chrome, iron, nickel, manganese, vanadium, niobium, tantalum, cobalt and tungsten. 1. A probe card board , comprising:a plurality of through holes designed to receive a probe brought into contact with a measurement object, whereinthe probe card board further comprises silicon nitride based ceramics, anda first surface opposed to the measurement object and a second surface located opposite to the first surface; andthe probe card board contains a plurality of crystal phases of metal silicide, andmetal constituting the metal silicide is at least one kind selected from among molybdenum, chrome, iron, nickel, manganese, vanadium, niobium, tantalum, cobalt and tungsten.2. The probe card board according to claim 1 , wherein a granular body composed of only metal constituting the metal silicide is not exposed onto the first surface.3. The probe card board according to claim 1 , wherein the first surface contains melilite whose content is 5 mass % or less.4. The probe card board according to claim 1 , wherein the first surface comprises void holes having a maximum length of 94 μm or less.5. The probe card board according to claim 1 , wherein the silicon nitride based ceramics contains at least 50 mass % or more of silicon nitride relative to 100 mass % of all ingredients constituting ceramics.6. The probe card board according to claim 1 , wherein kurtosis (Rku) of the first surface obtainable from a roughness curve is 2 to 16.7. The probe card ...

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Номер записи: 53
09-03-2017 дата публикации

Wiring Substrate With Filled Vias To Accommodate Custom Terminals

Номер: US20170067937A1
Автор: Shawn Powell
Принадлежит: Formfactor Inc

A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

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Номер записи: 54
07-03-2019 дата публикации

PROBE CARD DEVICE AND RECTANGULAR PROBE THEREOF

Номер: US20190072584A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

A rectangular probe of a probe card device includes a metallic pin and a metallic reinforcing body. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment extending from the first connecting segment in a direction away from the middle segment, and a second contacting segment extending from the second connecting segment in a direction away from the middle segment. The metallic reinforcing body is integrally formed on the middle segment. The Young's modulus of the metallic reinforcing body is larger than that of the metallic pin. The electric conductivity of the metallic pin is larger than that of the metallic reinforcing body. An outside diameter jointly formed by the metallic reinforcing body and the middle segment is larger than an outside diameter of the second connecting segment. 1. A probe card device , comprising:an upper die having a plurality of first thru-holes, wherein each of the first thru-holes has a first aperture;a lower die having a plurality of second thru-holes and substantially parallel to the upper die, wherein the second thru-holes are respectively corresponding in position to the first thru-holes, and each of the second thru-holes has a second aperture smaller than the first aperture; and a middle segment arranged between the upper die and the lower die;', 'a first connecting segment extending from an end of the middle segment and arranged in the corresponding first thru-hole;', 'a second connecting segment extending from the other end of the middle segment and arranged in the corresponding second thru-hole;', 'a first contacting segment extending from the first connecting segment and arranged outside the corresponding first thru-hole; and', 'a second contacting segment extending from the second connecting segment and arranged outside the corresponding second thru-hole;, "a plurality of rectangular ...

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Номер записи: 55
07-03-2019 дата публикации

PROBE ASSEMBLY AND PROBE STRUCTURE THEREOF

Номер: US20190072586A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

The instant disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a metal main portion, a covering layer and an insulating layer. The metal main portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first and the second end portions and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion. The covering layer includes a first covering layer disposed on a surrounding surface located on the first end portion, a second covering layer disposed on a surrounding surface located on the second end portion and a third covering layer disposed on a surrounding surface located on the connecting portion. The insulating layer is disposed on the third covering layer for exposing the first and second covering layer. 1. A probe assembly , including:a metal main portion having a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first end portion and the second end portion, and a surrounding surface surrounding the first end portion, the second end portion and the connecting portion;a covering layer including a first covering layer disposed on the surrounding surface located on the first end portion, a second covering layer disposed on the surrounding layer located on the second end portion and a third covering layer disposed on the surrounding surface located on the connecting portion; andan insulating layer disposed on the first covering layer for exposing the first covering layer and the second covering layer.2. The probe structure according to claim 1 , wherein the insulating layer has a resistivity of more than or equal to 10Ωm.3. The probe structure according to claim 2 , wherein the metal main portion has conductivity claim 2 , and the resistivity of the metal main portion is less than 5×10Ωm.4. The probe structure according to ...

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Номер записи: 56
05-03-2020 дата публикации

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FOR FINE PITCH APPLICATIONS

Номер: US20200072871A1
Автор: Marting Keith J., Tadayon Pooya, Walczyk Joe F.
Принадлежит: Intel Corporation

Space transformation technology for probe cards at sort is disclosed. In one example, a space transformer transforms a pitch of electrical contacts from a first distribution to a second distribution. The space transformer comprises a substrate with opposite first and second sides; and vias extending through the substrate between the first and second sides and oriented at different angles with respect to one another. In one example, a tester system or probe card for a die comprises a printed circuit board (PCB) with pads having a pad pitch; and a space transformer operatively coupled to the PCB, and having vias extending from the pads of the PCB through the space transformer at different angles with respect to one another and configured to electrically connect to contacts on the die having a contact pitch different than the pad pitch. 1. A space transformer device configured for transforming a pitch of electrical contacts from a first distribution to a second distribution , the device comprising:a substrate with opposite first and second sides; andvias extending through the substrate between the first and second sides and oriented at different angles with respect to one another.2. The space transformer device of claim 1 , wherein the vias are linear.3. The space transformer device of claim 1 , wherein the vias are non-linear.4. The space transformer device of claim 1 , wherein the vias are multi-angled with multiple angles in each via at an obtuse angle with respect to one another.5. The space transformer device of claim 1 , wherein the vias are arcuate.6. The space transformer device of claim 1 , wherein the vias form an array or grid on each side of the substrate.7. The space transformer device of claim 1 , wherein the vias transform a pitch of the second distribution to less than three-quarters of a pitch of the first distribution.8. The space transformer device of claim 1 , wherein the vias transform a pitch of the second distribution to less than half of a pitch ...

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Номер записи: 57
22-03-2018 дата публикации

TESTING SYSTEM AND METHOD

Номер: US20180080978A1
Автор: Brown Benjamin, Maassen Howard, McConnell David, Rangwala Niraj
Принадлежит:

A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, and monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages. The plurality of monitored current values are stored. 1. An automated test platform for testing at least one device under test , the automated test platform comprising:a test head configured to receive the at least one device under test; provide a voltage signal having a plurality of voltages to the at least one device under test,', 'monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and', 'store the plurality of monitored current values., 'a processing system configured to2. The automated test platform of further comprising:an interconnection platform configured to couple the processing system and the test head.3. The automated test platform of further comprising:an adapter board configured to couple the at least one device under test to the test head.4. The automated test platform of wherein the at least one device under test includes a plurality of devices under test.5. The automated test platform of wherein the adapter board is configured to couple the plurality of devices under test to the test head.6. The automated test platform of wherein the processing system includes:a variable voltage source configured to provide the voltage signal having the plurality of voltages to the at least one device under test.7. The automated test platform of wherein the processing ...

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Номер записи: 58
22-03-2018 дата публикации

TESTING SYSTEM AND METHOD

Номер: US20180080979A1
Автор: Brown Benjamin, HO PETER, Maassen Howard, McConnell David, Rangwala Niraj
Принадлежит:

A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds. 1. An automated test platform for testing at least one device under test , the automated test platform comprising:a test head configured to receive the at least one device under test; provide a voltage signal having a plurality of voltages to the at least one device under test,', 'monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and', 'determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds., 'a processing system configured to2. The automated test platform of further comprising:an interconnection platform configured to couple the processing system and the test head.3. The automated test platform of further comprising:an adapter board configured to couple the at least one device under test to the test head.4. The automated test platform of wherein the at least one device under test includes a plurality of devices under test.5. The automated test platform of wherein the adapter board is configured to couple the plurality of devices under test to the test head.6. The automated test platform of further comprising:a switching system associated with the at least one device under ...

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Номер записи: 59
26-03-2015 дата публикации

3D IC Testing Apparatus

Номер: US20150087089A1
Автор: Chen Chih-Chia, Chen Hao, Lin Hung-Chih, Peng Ching-Nen, Wang Mill-Jer
Принадлежит:

A method comprises connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test and conducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup. 1. A method comprising:connecting a testing setup having a plurality of probes to a device under test having a plurality of vias, wherein a probe is aligned with a corresponding via of the device under test; andconducting a plurality of via electrical characteristic tests through a conductive path comprising the vias, the probes and a plurality of conductive devices, each of which connects two adjacent probes, wherein the conductive devices are in the testing setup.2. The method of claim 1 , further comprising:connecting a first terminal of a first probe to a first terminal of a first via through a first flip chip bump; andconnecting a first terminal of a second probe to a first terminal of a second via through a second flip chip bump, wherein a first conductive device is coupled between a second terminal of the first probe and a second terminal of the second probe, wherein the first conductive device is in the testing setup.3. The method of claim 2 , further comprising:a third via; anda dummy die coupled between the second via and the third via, wherein an external connection device is formed on the dummy die and electrically connects the second via with the third via.4. The method of claim 3 , wherein:the first via, the first probe, the first conductive device, the second probe, the second via, the external connection device and the third via form a conductive chain.5. The method of claim 1 , wherein:the testing setup is an automatic testing equipment (ATE) board.6. The method of claim 1 , further ...

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Номер записи: 60
23-03-2017 дата публикации

GUIDE PLATE FOR A PROBE CARD AND PROBE CARD PROVIDED WITH SAME

Номер: US20170082657A1
Автор: FAN Liwen, KIMURA Teppei
Принадлежит:

It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate for a probe card includes a metal base first insulation layers and metal layers The metal base has a plurality of through holes to receive probes therethrough, and inner walls of the through holes The first insulation layers are of tuboid shape and provided on the respective inner walls of the through holes of the metal base The metal layers are provided on the first insulation layers 1. A method of manufacturing a guide plate for a probe card , the method comprising:forming insulation films on respective outer surfaces of a plurality of posts of prism shape;forming a plated layer such that the posts and the insulation films are embedded in the plated layer; andeliminating the posts such that the plated layer has through holes at portions where the posts have been eliminated.2. The method according to claim 1 , whereinthe posts are provided on a sacrificial layer of copper,the forming of the plated layer includes giving electroplating over the sacrificial layer to form thereon the plated layer with the posts and the insulation films embedded in the plated layer, andthe method further includes removing the sacrificial layer together with the removal of the posts.3. The method according to claim 1 , whereinthe plated layer has a thickness in a first direction and a main surface on one side in the first direction,the posts have end faces on the one side in the first direction,the insulation films have end faces on the one side in the first direction, andthe method further comprises, before the removal of the posts, grinding the main surface of the plated layer, the end faces of the posts, and the end faces of the insulation films so as to expose the end faces of the posts out of the main surface of the plated layer and form the insulation films into tubular shapes.4. The method according to claim 2 , whereinthe ...

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Номер записи: 61
12-03-2020 дата публикации

PROBE AND A PROBE CARD INCLUDING THE SAME

Номер: US20200081035A1
Автор: Kim Byoung-Joo, LEE MI-RYE, LEE Sung-Hoon, Lee Tae-Jong, YEO HWANG-JIN
Принадлежит: SAMSUNG ELECTRONICS CO., LTD.

A probe includes a probe body for providing an object with a test signal; a tip arranged on an end of the probe body to make contact with the object; and an alignment key protruded from a side of the probe body. 1. A probe comprising:a probe body for providing an object with a test signal;a tip arranged on an end of the probe body to make contact with the object; andan alignment key protruded from a side of the probe body.2. The probe of claim 1 , wherein the probe body extends in a first horizontal direction and the alignment key extends in a second horizontal direction substantially perpendicular to the first horizontal direction.3. The probe of claim 1 , wherein the tip extends from the end of the probe body in a vertical direction.4. The probe of claim 1 , wherein the alignment key has an angular shape.5. The probe of claim 1 , wherein the alignment key has a rectangular parallelepiped shape.6. The probe of claim 1 , wherein the alignment key is integrally formed with the probe body.7. The probe of claim 1 , wherein the probe body comprises:a vertical beam extended in a vertical direction; anda horizontal beam extended from the vertical beam in a first horizontal direction, wherein the alignment key protrudes from the horizontal beam.8. The probe of claim 1 , wherein the probe body comprises:a vertical beam extended in a vertical direction; anda horizontal beam extended from the vertical beam in a first horizontal direction; andan alignment beam extended from the vertical beam in the first horizontal direction, wherein the alignment key protrudes from the alignment beam.9. The probe of claim 8 , wherein the alignment beam is positioned over the horizontal beam.10. The probe of claim 8 , wherein the alignment beam is shorter than the horizontal beam.11. The probe of claim 1 , wherein the probe body comprises:a beam extended in a first horizontal direction, wherein the alignment key protrudes from the beam and the tip is arranged on the beam; anda post extended ...

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Номер записи: 62
25-03-2021 дата публикации

High density and fine pitch interconnect structures in an electric test apparatus

Номер: US20210088554A1
Автор: Joe Walczyk, Mark Bohr, Pooya Tadayon
Принадлежит: Intel Corp

An electrical-test apparatus is provided, which includes a MEMS array. In an example, the MEMS array comprises a plurality of tester interconnect structures cantilevered from first terminals on a first side of a substrate. The tester interconnect structures may have a first diameter. In an example, the MEMS array comprises a plurality of through-substrate vias that extend through the substrate, the vias having a second diameter larger than the first diameter. In an example, individual ones of the vias electrically couple individual ones of the tester interconnect structures to corresponding ones of second terminals on a second side of the substrate.

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Номер записи: 63
19-06-2014 дата публикации

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Номер: US20140167799A1
Автор: Ching-Nen Peng, Hao Chen, Hung-Chih Lin, Mill-Jer Wang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

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Номер записи: 64
29-03-2018 дата публикации

PROBE, PROBE CARD AND CONTACT INSPECTION DEVICE

Номер: US20180088150A1
Автор: KUGA Tomoaki
Принадлежит: KABUSHIKI KAISHA NIHON MICRONICS

A probe includes: a probe base body having a first end as a portion that contacts a test object in an inspection and a second end that contacts a contact point member; a covering member that covers the probe base body between the first end and the second end; and an enlarged diameter portion provided at an exposed portion on the second end side of the probe base body. The probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device. The second end of the probe base body is pressed against a contact point of the contact point member by opposing force due to the pressing. 1. A probe that is attached to a contact inspection device and used for a contact inspection by being pressed against a test object , the probe comprising:a probe base body having a first end as a portion that contacts the test object set in an inspection and a second end that contacts an electrical contact point of the contact inspection device; anda covering member that covers the probe base body between the first end and the second end, whereinthe probe is attached in a bent-deformed state by pressing a terminal portion on the first end side of the covering member against a base portion of the contact inspection device,the second end of the probe base body is pressed against the contact point by opposing force due to the pressing, anda portion exposed from the covering member on the second end side of the probe base body is provided with an enlarged diameter portion.2. The probe according to claim 1 , whereinthe enlarged diameter portion is formed by adhesion of plating on the second end of the probe base body.3. The probe according to claim 2 , whereina material for the enlarged diameter portion is a conductive material, andthe probe base body contacts the contact point by the enlarged diameter portion.4. The probe according to claim 1 , whereina material for the probe base body is ...

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Номер записи: 65
21-03-2019 дата публикации

PROBE CARD DEVICE AND ROUND PROBE THEREOF

Номер: US20190086443A1
Автор: HSIEH CHIH-PENG, SU WEI-JHIH
Принадлежит:

A round probe of a probe card device includes a metallic pin and insulating latch. The outside diameter of the metallic pin is smaller than or equal to 40 μm. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments in two opposite directions away from the middle segment. The insulating latch is formed on a part of the first contacting segment, and an end portion of the first contacting segment protruding from the insulating latch is defined as a protrusion. A maximum distance between an outer surface of the insulating latch and an adjacent outer surface of the metallic pin is smaller than or equal to the outside diameter of the metallic pin. 1. A probe card device , comprising:an upper die having a plurality of first thru-holes, wherein each of the first thru-holes has a first aperture;a lower die having a plurality of second thru-holes and substantially parallel to the upper die, wherein the second thru-holes respectively correspond in position to the first thru-holes, and each of the second thru-holes has a second aperture smaller than the first aperture; and a middle segment arranged between the upper die and the lower die;', 'a first connecting segment extending from an end of the middle segment and arranged in the corresponding first thru-hole;', 'a second connecting segment extending from the other end of the middle segment and arranged in the corresponding second thru-hole;', 'a first contacting segment extending from the first connecting segment and arranged outside the corresponding first thru-hole; and', 'a second contacting segment extending from the second connecting segment and arranged outside the corresponding second thru-hole;, 'a plurality of round probes respectively passing through the first thru-holes ...

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Номер записи: 66
05-05-2022 дата публикации

BOARD-LIKE CONNECTOR, DUAL-RING BRIDGE OF BOARD-LIKE CONNECTOR, AND WAFER TESTING ASSEMBLY

Номер: US20220137095A1
Автор: CHENG MENG-CHIEH, HSIEH KAI-CHIEH, LIU CHAO-CHIANG, SU WEI-JHIH
Принадлежит:

A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.

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Номер записи: 67
26-06-2014 дата публикации

PRE SPACE TRANSFORMER, SPACE TRANSFORMER MANUFACTURED USING THE PRE SPACE TRANSFORMER, AND SEMICONDUCTOR DEVICE INSPECTING APPARATUS INCLUDING THE SPACE TRANSFORMER

Номер: US20140176171A1
Автор: CHOI Yoon Hyuck, Kim Kuk Hyun, Oh Kwang Jae
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; and signal electrodes, power electrodes, and ground electrodes disposed on the first surface, wherein the signal electrodes, the power electrodes, and the ground electrodes are repeatedly disposed while configuring a unit pattern. 1. A pre space transformer comprising:a substrate having a first surface and a second surface, which is an opposite surface to the first surface; andindividual electrodes and common electrodes disposed on the first surface,wherein the individual electrodes and the common electrodes are repeatedly disposed while configuring a unit pattern.2. The pre space transformer according to claim 1 , wherein the individual electrodes include signal electrodes disposed so as to be spaced apart from each other on the same plane claim 1 , andthe common electrodes include power electrodes and ground electrodes disposed as to be spaced apart from each other on the same plane.3. The pre space transformer according to claim 1 , wherein the individual electrodes include signal electrodes having an island shape claim 1 , andthe common electrodes include power electrodes and ground electrodes having a plate shape so as to enclose the signal electrodes.4. The pre space transformer according to claim 1 , wherein the individual electrodes include signal electrodes and the common electrodes include power electrodes and ground electrodes claim 1 , andwherein the unit pattern includes three signal electrodes, one power electrode enclosing only any one of the three signal electrodes, and one ground electrode enclosing only another of the three signal electrodes, one power electrode and one ground electrode being provided in a form in which they enclose the other of the three signal electrodes.5. The pre space transformer according to claim 1 , further comprising a protective film covering at least one of the ...

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Номер записи: 68
26-06-2014 дата публикации

DESIGNED ASPERITY CONTACTORS, INCLUDING NANOSPIKES FOR SEMICONDUCTOR TEST, AND ASSOCIATED SYSTEMS AND METHODS

Номер: US20140176174A1
Автор: Johnson Morgan T., Preston Douglas A.
Принадлежит: ADVANCED INQUIRY SYSTEMS, INC.

Nano spike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a translator having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer-side sites are carried by the translator at the wafer side of the translator. The nanospikes can be attached to nanospike sites on a wafer side of a translator. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, the nanospikes can be formed by sputtering over a metal carrier with a photoresist mask. In particular embodiments, the nanospikes have generally conical cross-section. 1. An apparatus for testing semiconductor dies , comprising:a translator having a wafer side positioned to face toward a device under test, and an inquiry side facing away from the wafer side;a plurality of wafer-side contact sites carried by the translator at the wafer side of the translator; anda plurality of nanospikes carried by at least one wafer-side contact site.2. The apparatus of wherein the nanospikes are approximately 0.3-2 μm long.3. The apparatus of wherein the nanospikes are arranged in a grid with a spacing of approximately 0.3-2 μm from one nanospike to another.4. (canceled)5. The apparatus of wherein a cross-section of the nanospikes is selected from a group consisting of generally concave claim 1 , triangular claim 1 , convex claim 1 , and a combination thereof.6. The apparatus of wherein the nanospikes are generally perpendicular to the at least one wafer-side contact pad.7. The apparatus of wherein a shape of the nanospikes is selected from a group consisting of a star claim 1 , a blade claim 1 , a cross claim 1 , a spike claim 1 , and a combination thereof.8. The apparatus of wherein the nanospikes comprise a cover material.9. (canceled)10. The apparatus of claim 1 , further comprising:a ...

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Номер записи: 69
14-04-2016 дата публикации

Probe head assemblies, components thereof, test systems including the same, and methods of operating the same

Номер: US20160103153A1
Автор: Eric Hill, Koby Duckworth
Принадлежит: CASCADE MICROTECH INC

Probe head assemblies, components of probe head assemblies, test systems including the probe head assemblies and/or components thereof, and methods of operating the same. The probe head assemblies are configured to convey a plurality of test signals to and/or from a device under test and include a space transformer, a contacting assembly, and a riser that spatially separates the space transformer from the contacting assembly and conveys the plurality of test signals between the space transformer and the contacting assembly. The contacting assembly may include a frame that defines an aperture and has a coefficient of thermal expansion that is within a threshold difference of that of the device under test, a flexible dielectric body that is attached to the frame, maintained in tension by the frame, and extends across the aperture, and a plurality of conductive probes. The plurality of conductive probes may include a dual-faceted probe tip.

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Номер записи: 70
08-04-2021 дата публикации

Probe card

Номер: US20210102975A1
Автор: Bum Mo Ahn, Seung Ho Park, Sung Hyun BYUN
Принадлежит: Point Engineering Co Ltd

Proposed is a probe card for performing a circuit test on a wafer and, more particularly, a probe card capable of realizing a reduction in size and pitch of probe insertion holes.

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Номер записи: 71
21-04-2016 дата публикации

Three dimensional integrated circuit electrostatic discharge protection and prevention test interface

Номер: US20160113099A1
Автор: Ching-Nen Peng, Hao Chen, Hung-Chih Lin, Mill-Jer Wang
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection.

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Номер записи: 72
27-04-2017 дата публикации

MANIPULATOR IN AUTOMATIC TEST EQUIPMENT

Номер: US20170115327A1
Автор: Fowler Gary, Vayner Vladimir
Принадлежит: Teradyne, Inc.

An example manipulator for transporting a test head includes: a tower having a base and a track, with the track being vertical relative to the base; an arm to enable support for the test head, with the arm being connected to the track to move the test head vertically relative to the tower; one or more motors to drive movement of the arm along the track; and pneumatic cylinders to control movement of the arm to cause the test head to apply an amount of force to a peripheral device. 1. A manipulator for transporting a test head , comprising:a tower having a base and a track, the track being vertical relative to the base;an arm to enable support for the test head, the arm being connected to the track to move the test head vertically relative to the tower;one or more motors to drive movement of the arm along the track; andpneumatic cylinders to control movement of the arm to cause the test head to apply an amount of force to a peripheral device.2. The manipulator of claim 1 , wherein each pneumatic cylinder comprises:a housing to receive and to hold air generating air pressure; anda rod that is movable within the housing, movement of the rod being affected by the air pressure.3. The manipulator of claim 1 , further comprising:a controller that is settable to adjust the amount of force to be applied by the pneumatic cylinders by adjusting air pressure in one or more of the pneumatic cylinders.4. The manipulator of claim 3 , further comprising:one or more processing devices to receive input based on a setting of the controller, and to control the amount of air pressure in the one or more of the pneumatic cylinders.5. The manipulator of claim 1 , further comprising:a reservoir to receive a hose for supplying air, the reservoir comprising one or more conduits connecting the reservoir to the pneumatic cylinders for transferring the air to the pneumatic cylinders.6. The manipulator of claim 5 , wherein the reservoir comprises a check valve to receive the hose claim 5 , the ...

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Номер записи: 73
18-04-2019 дата публикации

PROBE CARD FOR ELECTRONIC DEVICES

Номер: US20190113539A1
Автор: CRIPPA Roberto, FELICI Stefano
Принадлежит:

A probe card for testing of electronic devices comprises a testing head with plural contact probes inserted into guide holes of an upper guide and a lower guide, and a space transformer, each of the contact probes having a first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested, and a second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a contact pad of the space transformer. The probe card comprises a spacer element interposed between the space transformer and the upper guide and removable to adjust the first length of the first terminal portion by changing the second length of the second terminal portion and approaching the upper guide and the space transformer. 1. A probe card for a testing equipment of electronic devices comprises:at least one space transformer provided with a plurality of contact pads; a plurality of contact probes;', 'at least one upper guide provided with guide holes for housing the plurality of contact probes; and', at least one first terminal portion projecting from the lower guide with a first length and ending with a contact tip adapted to abut onto a respective contact pad of a device to be tested; and', 'at least one second terminal portion projecting from the upper guide with a second length and ending with a contact head adapted to abut onto a respective contact pad of the space transformer; and, 'at least one lower guide provided with guide holes for housing the plurality of contact probes, a bending zone of the contact probes being defined between the upper and lower guides, each contact probe having], 'at least one testing head in turn includingat least one spacer element interposed between the space transformer and the upper guide of the testing head, the spacer element being removable to adjust the first length of the first terminal ...

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Номер записи: 74
13-05-2021 дата публикации

Electrical connection device

Номер: US20210140999A1
Автор: Kenichi Tsuruta, Koichiro Tokumaru, Miyuki TOMOOKA, Takayuki Hayashizaki
Принадлежит: Micronics Japan Co Ltd

An electrical connection device includes: a wiring board in which lands are arranged on a main surface; and probes. Each of the probes has a distal end portion that contacts an object to be measured and a proximal end portion that contacts the land. A material of a surface film of the proximal end portion, which contacts the land, is a metal material different in composition from a material of the land that contacts the surface film.

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Номер записи: 75
05-05-2016 дата публикации

Adaptor structure and apparatus for testing a semiconductor package including the same

Номер: US20160124042A1
Автор: Bo-Seong Park, Hyun-Guen Iy
Принадлежит: SAMSUNG ELECTRONICS CO LTD

An adaptor structure includes a main adaptor, a first sub-adaptor, a second sub-adaptor and a first driving mechanism. The main adaptor is over a socket. The main adaptor has an opening. The first sub-adaptor is movably received in the opening of the main adaptor in a first direction. The first sub-adaptor is configured to support a first side surface of the semiconductor package. The second sub-adaptor is movably received in the opening of the main adaptor in the first direction and a second direction. The second sub-adaptor faces the first sub-adaptor to support a second side surface of the semiconductor package. The first driving mechanism is configured to move the second sub-adaptor in the second direction. Thus, the adaptor structure can guide the semiconductor packages having different sizes to the socket.

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Номер записи: 76
03-05-2018 дата публикации

Probe connector for a probing pad structure around a thermal attach mounting hole

Номер: US20180120347A1
Автор: Naveen G, Navneet K. Singh, Vikas Rao
Принадлежит: Intel Corp

Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.

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Номер записи: 77
03-05-2018 дата публикации

METHOD FOR PRODUCING A CONTACT SPACING CONVERTER AND CONTACT SPACING CONVERTER

Номер: US20180120353A1
Автор: Böhm Gunther, BURGOLD Jörg, KÖNIG Christian, SCHÄFER Wolfgang
Принадлежит: FEINMETALL GMBH

A method for producing a contact spacing converter space transformer) which has electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different, second contact spacing of the electrical contacts including producing at least one base part from each of at least some of the electrical contacts. At least a section of the base part is produced from plastic. The method subsequently includes metallization of at least the section of the base part that is produced from plastic. 122.-. (canceled)239. A method for producing a contact spacing converter in the form of a space transformer having electrical contacts that form electrical paths and in which a first contact spacing of the contacts is converted into a comparatively different , second contact spacing of the electrical contacts () , with the following steps:{'b': '20', 'creation of at least one respective base part from at least several of the electrical contacts, with at least a portion of the base part () being made of plastic, and'}subsequent metallization of at least the portion of the base part that is made of plastic, wherein the production of the at least one portion of the base part that is made of plastic is performed through an additive production process.24. The method of claim 23 , wherein the additive production process is selected from a group consisting of a stereolithography process (SLA) claim 23 , a digital light process rapid prototyping method (DLP) claim 23 , a dip-in laser lithography process (DILL) claim 23 , and combinations thereof.25. The method of claim 23 , wherein the metallization is performed using at least one galvanic and/or chemical process.26. The method of claim 23 , wherein an entirety of the base part is made of plastic claim 23 , by the additive production process claim 23 , as a one-piece base part.27. The method of claim 23 , further comprising metallizing an entirety of the base part.28. The method ...

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Номер записи: 78
04-05-2017 дата публикации

TEST SOCKET

Номер: US20170122977A1
Автор: Park Sang-Duck
Принадлежит:

Disclosed is a test socket for inspecting an electronic device that is particular about properties. 1. A test socket for inspecting electric properties of a subject , the test socket comprising:a plurality of probes configured to be retractable in an inspection direction;a probe supporter configured to support the plurality of probes so that first ends of the plurality of probes protrudes to contact with an object contact point of a subject; anda printed circuit board (PCB) configured to be placed beneath the probe supporter, be mounted with electronic parts, comprise at least one first pad with which at least one second end of the plurality of probes comes into contact and at least one second pad formed on an opposite side to the first pad, and be formed with electric paths extended from the first pad and the second pad and connected to the mounted electronic parts.2. The test socket according to claim 1 , further comprising:a lower supporter configured to be placed beneath the printed circuit board (PCB) and comprise at least one first conductive portion making contact with the at least one second pad.3. The test socket according to claim 2 , wherein the printed circuit board (PCB) is formed with at least one first hole through which a second end of the rest of the probe excepting the at least one probe contacted with the first pad passes; andthe lower supporter comprises at least one second hole through which the second end of the probe passed through the first hole passes.4. The test socket according to claim 2 , wherein the printed circuit board (PCB) is formed with at least one first hole through which a second end of the rest of the probe excepting the at least one probe contacted with the first pad passes; andthe lower supporter comprises at least one second conductive portion with which the second end of the probe passed through the first hole contacts.5. The test socket according to claim 1 , wherein the printed circuit board (PCB) comprises at least one ...

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Номер записи: 79
04-05-2017 дата публикации

Wiring board for device testing

Номер: US20170122981A1
Автор: Guangzhu Jin, Kengo Tanimori, Kouta Kimata, Takakuni Nasu
Принадлежит: NGK Spark Plug Co Ltd

Disclosed is a wiring board for simultaneously testing of multiple semiconductor devices. The wiring board includes a multilayer ceramic substrate, an organic wiring structure arranged on the multilayer ceramic substrate, a plurality of capacitor connection pads formed on the organic wiring structure and a plurality of test pads formed on the organic wiring structure. The organic wiring structure has a plurality of inner conductor layers including first and second plane layers. Each of the first plane layers is divided in a plurality of regions. Each of the second plane layer(s) is placed in a different layer from the first plane layers and made larger in area than the first plane layers. At least a part of the test pads of each test pad group is electrically connected to at least a part of the connection pads via an outermost one of the first plane layers.

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Номер записи: 80
04-05-2017 дата публикации

PROBE HEAD RECEIVER AND PROBE CARD ASSEMBLY HAVING THE SAME

Номер: US20170122984A1
Автор: Hsu Ming-Cheng
Принадлежит:

The present disclosure relates to a probe head receiver, which includes: a first template, a guide plate and a spacer. The first template has a number of apertures of a first size. The guide plate has a number of apertures of a second size, each of the number of apertures of the first template is aligned with each of the number of apertures of the guide plate. The spacer is between the first template and the guide place. The second size is different from the first size. 1. A probe head receiver , comprising:a first template having a number of apertures of a first size;a guide plate having a number of apertures of a second size, each of the number of apertures of the first template being aligned with each of the number of apertures of the guide plate; anda spacer between the first template and the guide place,wherein the second size is different from the first size.2. The probe head receiver of claim 1 , wherein the second size is greater than the first size.3. The probe head receiver of claim 1 , wherein the guide plate is under the spacer.4. The probe head receiver of claim 3 , further comprising a second template under the guide plate.5. The probe head receiver of claim 1 , wherein the guide plate is over the spacer.6. The probe head receiver of claim 5 , further comprising a second template over the guide plate.7. The probe head receiver of claim 1 , wherein a width of each of the number of apertures of the guide plate is tapering downward.8. The probe head receiver of claim 1 , wherein each of the number of apertures of the guide plate has a first width on a top surface of the guide plate and a second width on a bottom surface of guide plate claim 1 , wherein the first width is greater than the second width.9. The probe head receiver of claim 8 , wherein each of the number of apertures of the first template has a third width on a top surface of the first template and a fourth width on a bottom surface of first template claim 8 , wherein the third width is ...

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Номер записи: 81
25-04-2019 дата публикации

PROBE CARD

Номер: US20190120875A1
Автор: Chang Wen-Yuan, Chen Wei-Cheng, Kung Chen-Yueh
Принадлежит: VIA TECHNOLOGIES, INC.

A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board. 1. A probe card , comprising:a circuit board; a body having a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface;', 'a plurality of first solder balls disposed on the first surface; and', 'a plurality of first contact points disposed on the second surface;, 'a transformer disposed on the circuit board, and includinga probe head disposed on the second surface, wherein the probe head is electrically connected to the first contact points, and is electrically connected to the circuit board through the first solder balls;a reinforcement structure disposed between the probe head and the circuit board, wherein the first solder balls are connected between the first surface and the circuit board, the reinforcement structure includes an encapsulant disposed on the first surface and the encapsulant only covers the first solder balls, a thickness of the encapsulant measured from the first surface is greater than half of a height of each of the first solder balls measured from the first surface, and the thickness of the encapsulant measured from the first surface is less than the height of each of the first solder balls measured from the first surface, and wherein the first contact points are a ...

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Номер записи: 82
25-04-2019 дата публикации

Direct Metalized Guide Plate

Номер: US20190120876A1
Автор: Cosman Jason William, Ebner John, Eldridge Benjamin N., Hill Eric, Sijercic Edin
Принадлежит:

Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces. 1. A guide plate for a probe array for testing electrical devices , the guide plate comprising:an electrically insulating ceramic substrate having a hole pattern corresponding to a predetermined probe pattern;a patterned metal layer disposed on the electrically insulating ceramic substrate such that at least two holes of the hole pattern are electrically connected to each other, and such that at least two holes of the hole pattern are electrically insulated from each other.2. The guide plate of claim 1 , wherein a thickness of the patterned metal layer is 10 microns or less.3. The guide plate of claim 1 , further comprising one or more passive component structures disposed to provide one or more compensating impedances between holes of the hole pattern.4. The guide plate of claim 3 , wherein the one or more passive component structures are selected from the group consisting of: integrated capacitors claim 3 , discrete component capacitors claim 3 , integrated inductors claim 3 , discrete component inductors claim 3 , integrated resistors claim 3 , and discrete component resistors.5. A probe array comprising:{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a top guide plate according to ;'}{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'a bottom guide plate according to ;'}a probe array including two or more probes, wherein each probe of the probe array passes through ...

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Номер записи: 83
25-04-2019 дата публикации

Probe card and signal path switching module assembly

Номер: US20190120877A1
Автор: Chia-An YU, Chia-Nan Chou, Chien-Chiao CHEN, Hao Wei, Yu-Hao Chen
Принадлежит: MPI Corp

A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.

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Номер записи: 84
16-04-2020 дата публикации

TEST INTERFACE SYSTEM AND METHOD OF MANUFACTURE THEREOF

Номер: US20200116755A1
Автор: Bae Raymond W.
Принадлежит:

A redistribution system includes: a probe support base; a homogenous dielectric structure formed on the probe support base; a probe head structure formed on the homogenous dielectric structure, including: a probe conductive connector partially embedded in and extending from the homogenous dielectric structure; a probe head support adjacent to the probe conductive connector and extending from the homogenous dielectric structure; and a deflectable probe head attached to the probe conductive connector and suspended over a deflection gap between the probe conductive connector probe head support. 1. A test interface system comprising:a probe support base;a homogenous dielectric structure formed on the probe support base; a probe conductive connector partially embedded in and extending from the homogenous dielectric structure;', 'a probe head support adjacent to the probe conductive connector and extending from the homogenous dielectric structure; and', 'a deflectable probe head attached to the probe conductive connector and suspended over a deflection gap between the probe conductive connector probe head support., 'a probe head structure formed on the homogenous dielectric structure, including2. The system of claim 1 , wherein the deflectable probe head is a conductive sheet.3. The system of claim 1 , wherein the probe head structure includes a support deflection gap between the probe head support and the deflectable probe head.4. The system of claim 1 , wherein the deflectable probe head is a multi-tiered probe head.5. The system of claim 1 , further comprising probe pin extending from the deflectable probe head.6. The system of claim 1 , wherein the probe head support is formed from a non-conductive material.7. The system of claim 1 , wherein a portion of the probe head support is embedded in the homogenous dielectric structure.8. The system of claim 1 , wherein the probe support base is a redistribution platform.9. The system of claim 1 , wherein the probe support ...

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Номер записи: 85
10-05-2018 дата публикации

MULTI-NODE TESTING SYSTEM AND METHOD

Номер: US20180128872A1
Автор: LIGGIERO RICHARD, PETROV TODOR K.
Принадлежит:

An automated microtester array, for simultaneously testing a plurality of devices under test, includes a plurality of automated microtesters, wherein each of the plurality of automated microtesters is configured to test a plurality of devices under test. A central computing system is configured to automate the testing of the plurality of devices under test coupled to the plurality of automated microtesters. 1. An automated microtester array , for simultaneously testing a plurality of devices under test , comprising:a plurality of automated microtesters, wherein each of the plurality of automated microtesters is configured to test a plurality of devices under test; anda central computing system configured to automate the testing of the plurality of devices under test coupled to the plurality of automated microtesters.2. The automated microtester array of wherein the central computing system is configured to execute an automated array process.3. The automated microtester array of wherein the automated array process is configured to control the plurality of automated microtesters.4. The automated microtester array of wherein the automated array process is configured to simultaneously test each of the plurality of devices under test.5. The automated microtester array of wherein each of the plurality of automated microtesters includes:a processing system including a plurality of processor assemblies;a plurality of test sites configured to releasably engage the plurality of devices under test; andan instrumentation system that is controllable by the processing system and configured to provide one or more input signals to the plurality of test sites and read one or more monitored signals from the plurality of test sites.6. The automated microtester array of wherein the processing system includes:a multicore processor.7. The automated microtester array of wherein the plurality of processor assemblies included within the processing system includes:a plurality of processor ...

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Номер записи: 86
10-05-2018 дата публикации

MULTI-NODE TESTING SYSTEM AND METHOD

Номер: US20180128873A1
Автор: LIGGIERO RICHARD, PETROV TODOR K.
Принадлежит:

An automated microtester, for simultaneously testing a plurality of devices under test, includes a processing system including a plurality of processor assemblies. A plurality of test sites are configured to releasably engage a plurality of devices under test. An instrumentation system is controllable by the processing system and is configured to provide one or more input signals to the plurality of test sites and read one or more monitored signals from the plurality of test sites. 1. An automated microtester , for simultaneously testing a plurality of devices under test , comprising:a processing system including a plurality of processor assemblies;a plurality of test sites configured to releasably engage a plurality of devices under test; andan instrumentation system that is controllable by the processing system and configured to provide one or more input signals to the plurality of test sites and read one or more monitored signals from the plurality of test sites.2. The automated microtester of wherein the processing system includes:a multicore processor.3. The automated microtester of wherein the plurality of processor assemblies included within the processing system includes:a plurality of processor cores included within the multicore processor.4. The automated microtester of wherein the plurality of test sites are configured to receive a plurality of adapter boards.5. The automated microtester of wherein the plurality of adapter boards are configured to releasably receive the plurality of devices under test.6. The automated microtester of wherein each of the plurality of adapter boards is configured to releasably receive a single device under test.7. The automated microtester of wherein each of the plurality of adapter boards is configured to releasably receive a plurality of devices under test.8. The automated microtester of wherein the processing system is configured to execute an automated test process.9. The automated microtester of wherein the automated ...

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Номер записи: 87
02-05-2019 дата публикации

MEMS Probe Card Assembly having Decoupled Electrical and Mechanical Probe connections

Номер: US20190128924A1
Автор: Kister January, Selvaraj Mukesh
Принадлежит:

Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for. 1. A probe array comprising:a space transformer;two or more probe carrier plates mechanically affixed to the space transformer, wherein each of the probe carrier plates has two or more probes mechanically affixed to it such that tips of the probes face away from the space transformer;wherein electrical connections between the probes and the space transformer are made by spring features of the probes that contact the space transformer without contacting the probe carrier plates.2. The probe array of claim 1 , wherein the probes include one or more posts configured to provide mechanical attachment points to the probe carrier plates.3. The probe array of claim 2 , wherein adjacent probes in the probe array have their respective posts staggered with respect to each other claim 2 , whereby a spacing between the adjacent probes can be reduced.4. The probe array of claim 1 , wherein the space transformer has a locally adjustable vertical displacement configured to make the tips of the probes coplanar for all probes of the probe array.5. The probe array of claim 4 , wherein the locally adjustable vertical displacement is provided by bonds between the carrier plates and the space transformer having a fabrication-adjustable bond thickness for each ...

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Номер записи: 88
23-04-2020 дата публикации

ELECTRICAL TEST APPARATUS HAVING ADJUSTABLE CONTACT PRESSURE

Номер: US20200124664A1
Автор: Kong Fook Seng Manfred, Sim Hock Soon
Принадлежит: KES SYSTEMS & SERVICE (1993) PTE, LTD.

A test assembly with adjustable contact pressure feature for test on wafer. The vertical type test assembly provides electrical contact pins where the force with which the pins press against the contacts is adjustable. This allows for easy correction of the contact force of the contact element with the wafer's test pad. 1. A test assembly having a probe head comprising:a plurality of guide plates at least one of which can be moved in a Z-direction compared with a plane of a substrate for a test assembly, wherein the plurality of guide plates each have a plurality of through holes;a plurality of probe needles, the probe needles extending from a substrate end of the test assembly toward a distal end, wherein the probe needles at the distal end are brought into contact with contact pads disposed on a wafer to be tested by the test assembly, thereby translating force to the probe needles in contact with contact pads disposed on the substrate;wherein the at least one guide plate moveable in the Z-direction can be moved closer to or further away from at least one other of the plurality of guide plates in the test assembly thereby adjusting a distance between the at least one guide plate moveable in the Z-direction and an opposing guide plate of the plurality of guide plates;wherein the distance between the guide plate moveable in the Z-direction and the at least one other guide plate determines a force with which the probe needles contact the contact pads on the wafer and contact pads on the substrate.2. The test assembly of wherein the substrate is one of a printed circuit board and a space transformer.3. The test assembly of wherein the probe needles extend through the through holes of the guide plates.4. The test assembly of wherein a portion of each of the plurality of probe needles are disposed in a sleeve of non-conducting electrical insulation.5. The test assembly of wherein the plurality of probe needles each have a first diameter and the portion of the probe ...

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Номер записи: 89
25-05-2017 дата публикации

PROBE GUIDE PLATE AND PROBE APPARATUS

Номер: US20170146569A1
Автор: Fujihara Kosuke, Mori Chikaomi, SHIMIZU Yuichiro, Yamasaki Tomoo
Принадлежит:

A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; and a protective insulating layer formed on the silicon oxide layer. The protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer. 1. A probe guide plate comprising:a silicon substrate comprising one surface and the other surface opposite to the one surface;a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate;a silicon oxide layer formed on the one surface of the silicon substrate, the other surface of the silicon substrate, and an inner wall surface of the through hole; anda protective insulating layer formed on the silicon oxide layer,wherein the protective insulating layer is formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer, and partially formed on the inner wall surface of the through hole via the silicon oxide layer,wherein the protective insulating layer formed on at least one of the one surface and the other surface of the silicon substrate via the silicon oxide layer is integrally formed with the protective insulating layer partially formed on the inner wall surface of the through hole via the silicon oxide layer.2. The probe guide plate of claim 1 , wherein a portion of the protective insulating layer partially formed on the inner wall surface of the through hole via the ...

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Номер записи: 90
16-05-2019 дата публикации

CONNECTOR PIN DEVICE FOR TESTING SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING SAME

Номер: US20190146005A1
Автор: LIM Kyungsook, OH Jaesuk
Принадлежит:

A connector pin device includes a test socket body made of a flexible insulating material and including a pin mounting part in which mounting holes have been formed and a support part supporting the pin mounting part, sliding contact pins respectively formed in the mounting holes and each including a first contact pin having a first end externally exposed and a second end located within the mounting hole and a second contact pin having a first end externally located on the side opposite the first end of the first contact pin and a second end located within the mounting hole, wherein the first and second ends of the first and the second contact pins are provided to slide and come into contact with each other, and an cavity portion formed in a portion where the second ends of the sliding contact pins in the mounting hole are located. 1. A connector pin device for testing a semiconductor chip , comprising:a test socket body made of a flexible insulating material and comprising a pin mounting part in which a plurality of mounting holes has been formed and a support part supporting the pin mounting part in a circumference of the pin mounting part;a plurality of sliding contact pins respectively formed in the plurality of mounting holes and each comprising a first contact pin having a first end externally exposed and a second end located within the mounting hole and a second contact pin having a first end externally located on a side opposite the first end of the first contact pin and a second end located within the mounting hole, wherein a middle part between the first and second ends of the first and the second contact pins is fixed to the pin mounting part, and the second ends of the first and the second contact pins slidingly come into contact with each other;a cavity portion formed in a portion where the second ends of the sliding contact pins in the mounting hole are located; anda support member supporting the second ends of the first and the second contact pins so ...

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Номер записи: 91
31-05-2018 дата публикации

PROBE CARD FOR TESTING SEMICONDUCTOR WAFERS

Номер: US20180149675A1
Автор: CHRASTECKY MICHAEL, IV RAUL RAMON, McQuade Francis T., MOLINA
Принадлежит: BUCKLINGBEAM

A probe card is disclosed. The probe card includes a first disc, a second disc, an alignment plate and multiple micro probes. One of the micro probes includes a linear segment and a curved segment connected to each other at an angle stop. The first disc includes a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. The second disc includes s a recessed area having multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. Placed within the recessed area of the second disc, the alignment plate includes multiple holes formed therein, wherein one of the holes is configured to receive the curved segment of the micro probe. 1. A probe card comprising:a plurality of micro probes, wherein one of said micro probes includes a linear segment and a curved segment connected to each other at an angle stop, wherein said linear segment is shorter than said curved segment;a first disc having a recessed area with a plurality of holes formed therein, wherein one of said holes is configured to receive said linear segment of said one micro probe;a second disc having a recessed area with a plurality of holes formed therein, wherein one of said holes is configured to receive said curved segment of said one micro probe, wherein said second disc is secured to said first disc; andan alignment plate placed within said recessed area of said second disc, wherein said alignment plate includes a plurality of holes formed therein, wherein one of said holes is configured to receive said curved segment of said one micro probe.2. The probe card of claim 1 , wherein said linear segment includes a first contact tip configured to provide electrical contact to an electronic test circuitry claim 1 , wherein said curved segment includes a second contact tip configured to provide electrical contact to a solder bump on a semiconductor wafer.3. The probe card ...

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Номер записи: 92
07-05-2020 дата публикации

Systems and Methods for Depopulating Pins from Contactor Test Sockets for Packaged Semiconductor Devices

Номер: US20200141974A1
Автор: Ata Hisashi, Shwe Thiha, Tong Kay Chan
Принадлежит:

A reduced pin count (RPC) device includes an electrical circuitry in a package with uniformly distributed leads, a subset of the leads being electrically disconnected form the circuitry. A contactor pin block with sockets corresponding to the uniformly distributed leads has the sockets corresponding to the leads with electrical connections filled with test pins suitable for contacting respective leads, and the sockets corresponding to the electrically disconnected leads voided of test pins. Dummy plugs are inserted into the voided sockets to block the sockets and prevent accidental insertions of test pins. 1. A method , comprising:providing a semiconductor device including a circuitry in a package, the package having leads, a first subset of the leads being electrically disconnected from the circuitry, a second subset of the leads having electrical connections to the circuitry;providing a contactor pin block having sockets corresponding to the leads, a first subset the sockets corresponding to the first subset of the leads without being filled with test pins, a second subset of the sockets filled with test pins for contacting the second subset of leads; andinserting dummy plugs into the first subset of the sockets.2. The method of claim 1 , further comprising:placing a transparent mask over the contactor pin block, the mask having marks highlighting the positions of the first subset of the sockets corresponding to the first subset of the leads.3. The method of claim 2 , wherein the marks each having a donut shape.4. The method of claim 1 , wherein the first subset of the leads are attached with solder balls.5. The method of claim 1 , further comprisingaligning the leads with the corresponding sockets of the contactor pin block;contacting the first subset of the leads with the corresponding test pins; andinitiating a testing process associated with the first subset of the leads while blocking the second subset of the leads from accessing the testing process.610-. ( ...

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Номер записи: 93
01-06-2017 дата публикации

Methods to manufacture semiconductor probe tips

Номер: US20170153273A1
Автор: Florent Cros
Принадлежит: Advantest America Inc

An apparatus for electrically testing a semiconductor device is disclosed. The apparatus comprises a probe card comprising a probe, wherein the probe comprises a probe tip. Further, the probe tip comprises a foot with an arbitrarily sized cross-section and an apex with an arbitrarily sized cross-section, wherein the cross-section of the foot is wider than the cross-section of the apex.

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Номер записи: 94
31-05-2018 дата публикации

THREE DIMENSIONAL INTEGRATED CIRCUIT ELECTROSTATIC DISCHARGE PROTECTION AND PREVENTION TEST INTERFACE

Номер: US20180153026A1
Автор: CHENG Hao, Lin Hung-Chih, Peng Ching-Nen, Wang Mill-Jer
Принадлежит:

The present disclosure provides a system and method for providing electrostatic discharge protection. A probe card assembly is provided which is electrically connected to a plurality of input/output channels. The probe card assembly can be contacted with a secondary assembly having an interposer electrically connected to one or more wafers each wafer having a device under test. Voltage can be forced on ones of the plural input/output channels of the probe card assembly to slowly dissipate charges resident on the wafer to thereby provide electrostatic discharge protection. A socket assembly adaptable to accept a 3DIC package is also provided, the assembly having a loadboard assembly electrically connected to a plurality of input/output channels. Once the 3DIC package is placed within the socket assembly, voltage is forced on ones of the input/output channels to slowly dissipate charges resident on the 3DIC package to thereby provide electrostatic discharge protection. 1. A system to provide electrostatic discharge protection to a wafer comprising:a probe card assembly electrically connected to a plurality of input/output channels , the probe card assembly comprising:a probe card printed circuit board (PCB),a probe card substrate adjacent the probe card PCB,a probe card head adjacent the probe card substrate and opposite the PCB, anda plurality of probe card pins connected to the probe card head; anda secondary assembly comprising an interposer electrically coupled to one or more wafers, each wafer comprising at least a device under test,wherein when the probe card pins couple probe pads on the wafer, voltage is forced on ones of the plurality of input/output channels to dissipate charges resident on the wafer to provide electrostatic discharge protection.2. The system of claim 1 , wherein the forced channel is selected from the group consisting of a ground channel having resistance and a power channel having resistance.3. The system of claim 1 , wherein the secondary ...

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Номер записи: 95
24-06-2021 дата публикации

CERAMIC, PROBE GUIDING MEMBER, PROBE CARD, AND SOCKET FOR PACKAGE INSPECTION

Номер: US20210188714A1
Автор: ETO Shunichi, MORI Kazumasa, YAMAGISHI Wataru
Принадлежит: FERROTEC MATERIAL TECHNOLOGIES CORPORATION

A ceramic contains, in mass percent: SiN: 20.0 to 60.0%, ZrO: 25.0 to 70.0%, and one or more oxides selected from MgO, YO, CeO, CaO, HfO, TiO, AlO, SiO, MoO, CrO, CoO, ZnO, GaO, TaO, NiO, and VO: 5.0 to 15.0%. The ceramic has a coefficient of thermal expansion as high as that of silicon and an excellent mechanical strength, allows fine machining with high precision, and prevents particles from being produced. 1. A ceramic containing , in mass percent:{'sub': 3', '4, 'SiN: 20.0 to 60.0%;'}{'sub': '2', 'ZrO: 25.0 to 70.0%; and'}{'sub': 2', '3', '2', '2', '2', '2', '3', '2', '3', '2', '3', '2', '5', '2', '5, 'one or more oxides selected from MgO, YO, CeO, CaO, HfO, TiO, AlO, SiO, MoO, CrO, CoO, ZnO, GaO, TaO, NiO, and VO: 5.0 to 15.0%.'}2. The ceramic according to containing claim 1 , in mass percent:{'sub': 2', '3', '2', '2, 'one or more oxides selected from MgO, YO, CeO, CaO, and HfO; and'}{'sub': 2', '2', '3', '2', '3', '2', '3', '2', '5', '2', '5, 'one or more oxides selected from TiO, AlO, SiO, MoO, CrO, CoO, ZnO, GaO, TaO, NiO, and VO.'}3. The ceramic according to claim 1 , wherein a crystal phase of ZrOis one of a crystal phase being a tetragonal crystal claim 1 , a crystal phase being a tetragonal crystal and a monoclinic crystal claim 1 , a crystal phase being a cubic crystal claim 1 , a crystal phase being a cubic crystal and a tetragonal crystal claim 1 , and a crystal phase being a cubic crystal and a monoclinic crystal.4. The ceramic according to claim 1 , wherein ZrOis a cubic crystal.5. The ceramic according to claim 1 , wherein the ceramic has a coefficient of thermal expansion at −50 to 500° C. ranging from 3.0×10to 6.0×10/° C. and has a three-point flexural strength of 700 MPa or more.6. A probe guiding member that guides probes of a probe card claim 1 , the probe guiding member comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'a plate-shaped main body that is made of the ceramic according to ; and'}the main body includes a plurality of ...

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Номер записи: 96
24-06-2021 дата публикации

PROBE CARD ASSEMBLY IN AUTOMATED TEST EQUIPMENT

Номер: US20210190827A1
Автор: Brecht Brian
Принадлежит: Teradyne, Inc.

Probe pin arrangements in a vertical-type probe card assembly for an automated test equipment (ATE) are disclosed. In some embodiments, one or more additional conductive regions are provided in between adjacent probe pins. The additional conductive regions may reduce spacing between probe pins connected to adjacent probe card pads, and may in turn reduce or adjust inductance between the two probe cards pads to provide improved signal impedance matching or lower power impedance. In one embodiment, the additional conductive region is a short probe pin. In another embodiment, the additional conductive region is a protrusion on a vertical probe pin. 1. A probe card assembly for testing a wafer having a plurality of wafer pads , the probe card assembly comprising:a board having a plurality of probe card pads on a surface;a first probe pin comprising a first conductive region in contact with a first probe card pad of the plurality of probe card pads and extending in a first direction perpendicular to the surface, the first probe pin configured to contact a wafer pad;a second conductive region adjacent the first conductive region and electrically connected to the first probe card pad, wherein the second conductive region is configured to be separated from the wafer pad by a dielectric material when the probe pin contacts the wafer pad.2. The probe card assembly of claim 1 , wherein:the second conductive region comprises a first end in contact with the probe card pad.3. The probe card assembly of claim 2 , wherein the second conductive region is a second probe pin shorter in length than the first probe pin claim 2 , and whereinthe first probe pin comprises a needle configured to contact the wafer pad, andthe second probe pin comprises a second end configured to face the wafer pad and be separated from the wafer pad by the dielectric material.4. The probe card assembly of claim 3 , further comprising a bridge connecting the second end of the second probe pin to the first ...

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Номер записи: 97
30-05-2019 дата публикации

Multilayer wiring board for inspection of electronic components

Номер: US20190162778A1
Автор: Junichirou KANEMATSU, Kenji Suzuki
Принадлежит: NGK Spark Plug Co Ltd

Provided is a multilayer wiring board for inspection of electronic components which has excellent reliability by improving the adhesiveness between a resin wiring portion and a ceramic wiring substrate. A multilayer wiring board 10 according to the present invention includes: a ceramic wiring substrate 20 having a substrate main surface 21 and a substrate rear surface 22; substrate-side conductive layers 32, 33 formed on the substrate main surface 21; and a resin wiring portion 40 stacked on the substrate main surface 21 so as to cover the substrate-side conductive layers 32, 33. Inspection pads 50, 51 for inspection of electronic components are formed on a front surface 49 of the resin wiring portion 40. End surfaces of the substrate-side conductive layers 33 are exposed from side surfaces 13 of the multilayer wiring board 10. An outer peripheral edge of a rear surface of the resin wiring portion 40 is in contact with the surfaces of the substrate-side conductive layers 33, and end surfaces of the resin wiring portion 40 and the end surfaces of the substrate-side conductive layers 33 are positioned closer to the center of the board than end surfaces 23 of the ceramic wiring substrate 20.

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Номер записи: 98
21-05-2020 дата публикации

PROBE CARD DEVICE AND MATCHING PROBE THEREOF

Номер: US20200158756A1
Автор: HSIEH KAI-CHIEH, LEE WEN-TSUNG, TSENG CHAO-HUI, WANG HSIEN-YU
Принадлежит:

A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole. 1. A probe card device , comprising:an upper die unit including a first die and a second die spaced apart from the first die, wherein the first die has at least one penetrating hole, and the second die has a circuit layer;an impedance adjusting member disposed on the second die and electrically coupled to the circuit layer;a lower die unit arranged at one side of the second die that is away from the first die, wherein a distance between the lower die unit and the second die is larger than a distance between the first die and the second die;a spacer sandwiched between the second die of the upper die unit and the lower die unit; anda plurality of conductive probes passing through the upper die unit, the spacer, and the lower die unit, wherein each of the conductive probes includes an upper contacting segment and a lower contacting segment that are respectively arranged at two opposite outer sides of the upper die unit and the lower die unit,wherein at least one of the conductive probes is defined as at least one matching probe including an extending arm connected to the upper contacting segment thereof, and wherein the extending arm of the at least one ...

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Номер записи: 99
15-06-2017 дата публикации

PRE SPACE TRANSFORMER, SPACE TRANSFORMER MANUFACTURED USING THE PRE SPACE TRANSFORMER, AND SEMICONDUCTOR DEVICE INSPECTING APPARATUS INCLUDING THE SPACE TRANSFORMER

Номер: US20170169931A1
Автор: CHOI Yoon Hyuck, KIM Ki Young, Oh Kwang Jae
Принадлежит:

Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern. 1. A pre space transformer comprising:a substrate having a first surface and a second surface, which is an opposite surface to the first surface;individual electrodes disposed on the first surface; andcommon electrodes disposed in the substrate,wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.2. The pre space transformer according to claim 1 , wherein the individual electrodes include signal/power electrodes and ground electrodes disposed so as to be spaced apart from each other on the same plane.3. The pre space transformer according to claim 1 , wherein the individual electrodes include signal/power electrodes and around electrodes claim 1 , andthe common electrodes include common ground electrodes electrically connected to the ground electrodes.4. The pre space transformer according to claim 1 , wherein the individual electrodes include signal/power electrodes and ground electrodes having an island-shaped transversal cross section claim 1 , andthe common electrodes include common ground electrodes having a plate shape.5. The pre space transformer according to claim 1 , wherein the unit pattern is provided in a grid shape in which it includes one signal/power electrode and one ground electrode that are disposed to be spaced apart from each other.6. The pre space transformer according to claim 1 , further comprising a protective film covering at least one of the first surface and the second surface.7. The pre space transformer according to claim 1 , further comprising a plurality of vias penetrating through the substrate claim 1 ,wherein the vies are disposed to form a grid ...

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Номер записи: 100