ELEKTROOPTISCHER HOCHGESCHWINDIGKEITS SIGNALWANDLER

Optical device for geometric shaping of light beam profile e.g. for coupling laser radiation emitted by laser diode with input end of optical fibre

The optical device (10) has 2 successive lenses, used for increasing or reducing the beam profile of the light beam by respective factors in 2 directions perpendicular to the light propagation direction. A deflection mirror is positioned in the light beam path between the lenses for deflecting the light beam through an angle, the first lens and the deflection mirror mounted on a common transparent carrier through which the light beam passes to the second lens (20). An Independent claim for a method for manufacturing an optical device for geometric shaping of a light beam profile is also included.

HALBLEITERSCHEIBENGROSSE INTEGRIERTE OPTISCHE ELEMENTE

Anordnung zur Verbindung von integriert-optischen Komponenten und Verwendung der Anordnung

Integrated-optical components 11, 21 are connected together on different substrates 10, 20, wherein the substrates 10, 20 lie on top of each other. At their ends the components to be connected 11, 21 have inclined lateral surfaces 12, 22 in such a way that light from the first component 11 is reflected at the lateral surface 12, impinges on the second lateral surface 22 and is then reflected into the second component 21 there. The arrangement may be used in a bidirectional transmission system with optical fibre amplifier.

Anschlusssockel mit darin eingeschobenem Halbleiterbauteil für photoelektrische Elemente

Ein auf einer Leiterplatte (1), in die Wellenleiter (2) eingegraben sind, montierter elektrischer Anschlusssockel (3) mit einem darin eingeschobenen Halbleiterbauteil (11), das photoelektrische Elemente (12) und einen elektrischen Anschluss (14) hat, wobei der Sockel (3) mit den im Halbleiterbauteil (11) installierten photoelektrischen Elementen (12) so verbunden ist, dass die photoelektrischen Elemente (12) mit den Wellenleitern (2) der Leiterplatte (11) kommunizieren können, wobei der Sockel (3) umfasst: eine auf der Leiterplatte (1) liegende Basis (8); äußere gegenüberliegende Wände (7), die sich von der Basis (8) aus senkrecht erstrecken, um einen Raum zur Aufnahme des Halbleiterbauteils (11) zu formen, und einen elektrischen Sockelanschluss (4) auf der Basis (8) zur Verbindung mit dem elektrischen Anschluss (14) des Halbleiterbauteils (11).

KOMPAKTE TERAHERTZMODULE MIT FASERANSCHLUSS

Optische Wellenleitervorrichtung und deren Herstellungsverfahren

Arrangement for coupling optical transmitting or receiving elements to an optical waveguide

Arrangement for coupling optical transmitting or receiving elements to an optical waveguide

Optical semiconductor device and method of manufacturing thereof

MANUFACTURING PROCESS FOR A OPTOELEKTRI HYBRID PLATE

PROCEDURE FOR OBTAINING SEVERAL INTEGRATED OPTICAL HEADS

Parallel optical interconnect

Optical component for free-space optical propagation between waveguides

Integrated beam shaper and use thereof

Integrated photodetector for vcsel feedback control

INTEGRATION OF ARRAY OF NON-ROD SHAPED OPTICAL ELEMENTS WITH ARRAY OF FIBERS IN A STRUCTURE AND ASSOCIATED METHODS

... ▓▓▓Arrays of non-rod shaped optical elements may be integrated with fiber arrays ▓arranged in a positioning structure. The use of non-rod shaped optical ▓elements allow the elements to be lithographically created already accurately ▓aligned relative to one another. This also allows for simultaneous alignment ▓of the array of optical elements with the array of fibers. The arrays may be ▓one or two dimensional. The support structure for the fibers may be any ▓desired structure. The fiber endfaces may be angled. The array of optical ▓elements may include more than one substrate bonded together. Passive ▓alignment features, including visual alignment mark and/or mechanical mating ▓features, may be provided on the arrays.▓ ...

INTEGRATED OPTICAL APPARATUS PROVIDING SEPARATED BEAMS ON A DETECTOR AND ASSOCIATED METHODS

An integrated optical apparatus includes an optically transparent substrate (21) with a light source (15) and a detector (17) mounted adjacent thereto. The substrate includes an optical element in a transmit path from the light source to a remote target. The optical element splits the light into more than one beam. A detector receives beams reflected by the target. All optical elements needed to create the more than one beam, direct the more than one beam onto the target and direct the more than one beam from the target to the detector are on the substrate and/or any structure bonded to the substrate. Preferably, the optical element provides sufficient separation between the more than one beam such that each beam is delivered to a unique respective light detecting element of the detector. The return path from the remote target to the detector may include an optical element for each beam or no optical elements. An additional substrate (11) may be included and bonded to the substrate. The ...

OPTICALLY ENABLED HYBRID SEMICONDUCTOR PACKAGE

OPTICAL WAVEGUIDE DEVICE AND MANUFACTURING METHOD FOR OPTICAL WAVEGUIDE DEVICE

To obtain an optical waveguide device capable of improving mounting accuracy and productivity for correcting misalignment of alignment marker caused by distortion due to a substrate stressed and distorted. An optical waveguide device includes an optical waveguide section, including a waveguide core formed on a substrate, and an optical device (LD) mounted on the substrate to correspond the optical waveguide section, both of which are coupled at a light end face and mounted by hybrid mounting. LD side alignment markers are provided in both sides of an active line in the optical device. Substrate side alignment markers are provided at positions where centers thereof and those of the optical device side markers are matched when the optical device is mounted on the corresponding substrate. Fiducial markers are provided and a relative positional relationship with the waveguide core on the substrate becomes stably. Thus, a misalignment amount is detected.

OPTO-ELECTRONIC HYBRID INTEGRATION PLATFORM, OPTICAL SUB-MODULE, OPTO-ELECTRONIC HYBRID INTEGRATION CIRCUIT, AND PROCESS FOR FABRICATING PLATFORM

An opto-electronic hybrid integrated circuit of the present invention satisfy a low-loss optical waveguide function, an optical bench function and a high-frequency electrical wiring function. The circuit includes a substrate such as a silicon substrate, a dielectric optical waveguide part arranged in a recess of the substrate, and an optical device mounting part formed on a protrusion of the substrate. An electrical wiring part is disposed on the dielectric layer. The optical device is mounted on the substrate. An optical sub-module includes the optical device which is possible to mount on the substrate.

DEVICE FOR INJECTING THE LIGHT ENERGY OF A LASER BEAM INTO A FIBRE-OPTIC OPTICAL WAVEGUIDE AND A METHOD FOR ADJUSTING AND MONITORING THE POSITION OF THE END OF THE FIBRE-OPTIC OPTICAL WAVEGUIDE

... 47-17775/= Device for injecting the light energy of a laser beam into a fibre-optic optical waveguide and a method for adjusting and monitoring the position of the end of the fibre-optic optical waveguide In a device for injecting the light energy of a laser beam into a multimode fibre-optic optical waveguide (2) a small part of the light emerging from the end face of the optical waveguide (2) is projected through a beam splitting cube (7) and a reproducing lens (21) onto a display screen (1), so that an image (24) of the end face of the optical waveguide (2) can be observed on the display screen (1). The arrangement is such that the system is correctly focused only when the distance between the optical waveguide (2) and afocusing point of the laser beam (12) reaches an intended value. The light spot of the laser beam on the end face of the optical waveguide (2) is clearly visible on the display screen (1) so that an optimum positioning and adjustment can be readily effected. Fig. 1 ...

DEVICE FOR INJECTING THE LIGHT ENERGY OF A LASER BEAM INTO AFIBRE-OPTIC OPTICAL WAVEGUIDE AND A METHOD FOR ADJUSTING AND MONITORING THEPOSITION OF THE END OF THE FIBRE-OPTIC OPTICAL WAVEGUIDE

In a device for injecting the light energy of a laser beam into a multimode fibre-optic optical waveguide (2) a small part of the light emerging from the end face o f the optical waveguide (2) is projected through a beam splitting cube (7) and a reproduci ng lens (21) onto a display screen (1), so that an image (24) of the end face of the optical waveguide (2) can be observed on the display screen (1). The arrangement is such that the system is correctly focused only when the distance between the optical waveguide (2) a nd a focusing point of the laser beam (12) reaches an intended value. The light spot of the laser beam on the end face of the optical waveguide (2) is clearly visible on the display screen (1) so that an optimum positioning and adjustment can be readily effected. ...

OPTICAL WAVEGUIDE DEVICE AND METHOD OF PRODUCING THE SAME

An optical waveguide device is provided which comprises an optical waveguide chip (10) constructed by forming an optical waveguide (2) embedded in a clad layer (3) and alignment marks (4a, 4b) on the surface of a silicon single crystal board by the use of the etching technique and film forming technique; a device substrate (5) constructed by forming V grooves (5a, 5c) and alignment marks (4a', 4b') on the surface of a silicon single crystal board by the use of the etching technique and film forming technique, the optical waveguide chip and the device substrate being aligned with each other with reference to the respective alignment marks (4a, 4b) and (4a', 4b') and joined 'together; and optical fibers (8a, 8c) fitted and fixed in the V grooves (5a, 5c).

OPTICAL WIRING LAYER, OPTOELECTRIC WIRING SUBSTRATE, MOUNTEDSUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME

A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.

Electro-optical conductor plate manufacturing method for e.g. mirror module, involves applying and structuring mantle layer such that mantle layer does not cover non-transparent surface, and removing material from surface to form mark

The method involves forming a non-transparent surface on a substrate (1) e.g. polyimide. An underlayer (2) is applied on the substrate, and the underlayer is structured such that the underlayer does not cover the non-transparent surface. A core layer (4) is applied, where the core layer and the underlayer cover the non-transparent surface. A mantle layer (5) is applied and structured such that the mantle layer does not cover the non-transparent surface. Material is removed from the non-transparent surface within a structured area to form a reference mark (30).

Procedure for the production of an electrooptical printed circuit board with fibre optics structures.

Eine elektro-optische Leiterplatte enthält einerseits elektrische Leiterbahnen und andererseits Lichtwellenleiterstrukturen. Die Lichtwellenleiterstrukturen umfassen eine Unterschicht (2), eine Kernschicht (4) und eine Mantelschicht (5). Auf der Leiterplatte werden sichtbare Flächen (3) aufgebracht und später die Kernschicht (4) sowohl auf die Unterschicht als auch auf die Flächen (3) aufgetragen und sowohl auf der Unterschicht (2) als auch auf den Flächen (3) strukturiert. Anschliessend wird diese Struktur in die Flächen übertragen, beispielsweise durch Ätzen. Auf diese Weise entstehen Referenzmarken (30), die die Information über die tatsächliche Lage der Lichtwellenleiterstrukturen enthalten.

Procedure for the production of an electrooptical printed circuit board with fibre optics structures.

Die Erfindung betrifft ein Verfahren zur Herstellung einer elektro-optischen Leiterplatte, welche einerseits elektrische Leiterbahnen und andererseits Lichtwellenleiterstrukturen enthält. Die Lichtwellenleiterstrukturen umfassen eine Unterschicht (2), eine Kernschicht (4) und eine Mantelschicht (5). Auf der Leiterplatte werden sichtbare Flächen aufgebracht und später die Kernschicht (4) sowohl auf die Unterschicht als auch auf die Flächen aufgetragen und sowohl auf der Unterschicht (2) als auch auf den Flächen strukturiert. Anschliessend wird diese Struktur in die Flächen übertragen, beispielsweise durch Ätzen. Auf diese Weise entstehen Referenzmarken (30), die die Information über die tatsächliche Lage der Lichtwellenleiterstrukturen enthalten. The invention relates to a method for producing an electro-optical circuit board, which contains on the one hand electrical conductor tracks and on the other hand optical waveguide structures. The optical waveguide structures comprise a lower layer (2), a core layer (4) and a cladding layer (5). Visible surfaces are applied to the circuit board and later the core layer (4) is applied to both the underlayer and the surfaces and patterned on both the underlayer (2) and on the surfaces. Subsequently, this structure is transferred into the surfaces, for example by etching. In this way, reference marks (30) are generated which contain the information about the actual position of the optical waveguide structures.

Photoelectricity combination substrate and manufacturing method thereof

OPTICAL WAVEGUIDE DEVICE AND MANUFACTURING METHOD FOR OPTICAL WAVEGUIDE DEVICE

장착 정밀도 및 생산성을 향상시킬 수 있고 스트레스를 받아 변형된 기판에 기인한 변형에 의해서 유발되는 정렬 마커의 오정렬을 보정하는 광 도파관 소자를 얻기 위한 것이다. 광 도파관 소자는, 광단부면에서 결합되고 하이브리드 장착에 의해서 장착된, 기판 상에 형성된 도파관 코어를 포함하는 광 도파관 섹션과, 광 도파관 섹션에 대응하도록 기판 상에 장착된 광 소자(LD)를 포함한다. LD측 정렬 마커는 광 소자의 활성 라인의 양측에 제공된다. 기재측 정렬 마커는, 광 소자가 대응하는 기판 상에 장착될 때, 이의 중심과 광 소자측 마커의 중심이 서로 정합되는 위치에 제공된다. 기준 마커가 제공되고 기재 상의 도파관 코어와의 상대적인 위치 관계가 안정되게 된다. 따라서, 오정렬량이 검출된다. It is to obtain an optical waveguide device that can improve mounting precision and productivity and corrects misalignment of alignment markers caused by deformation caused by a substrate deformed under stress. The optical waveguide element comprises an optical waveguide section comprising a waveguide core formed on a substrate, coupled at an optical end face and mounted by hybrid mounting, and an optical element LD mounted on a substrate to correspond to the optical waveguide section. . LD side alignment markers are provided on both sides of an active line of the optical element. The substrate side alignment marker is provided at a position where the center of the optical element side marker and the center of the optical element side marker match with each other when the optical element is mounted on the corresponding substrate. A fiducial marker is provided and the relative positional relationship with the waveguide core on the substrate is stabilized. Thus, the misalignment amount is detected. 장착 정밀도, 도파관 코어, 광 소자, 하이브리드 장착, 정렬 마커 Mounting Precision, Waveguide Cores, Optical Elements, Hybrid Mount, Alignment Markers

OPTICAL WIRING LAYER, OPTOELECTRIC WIRING SUBSTRATE, MOUNTED SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME

The laser module

Optical module and optical coupling method using the same

An optical module is disclosed, the optical communication module comprises a substrate, a lens carrier and a ferrule, the substrate has at least two LD/PD chips, which have a plurality of optical units thereon, each optical unit has an optical signature, the lens carrier has a frame and a lens array, the lens array comprises a plurality of lens units, wherein each optical unit of the substrate is corresponding to a lens unit of the lens carrier, when the lens carrier couples with the substrate, the optical signature of each optical unit is used to be aimed to the corresponding lens unit, so as to precisely aligned the lens carrier with the substrate, and then couples the ferrule with the lens carrier to form a precisely optical pathway.

OPTOELECTRONIC SUBSTRATE, CIRCUIT BOARD, AND METHOD OF MANUFACTURING OPTOELECTRONIC SUBSTRATE

L'invention concerne un substrat opto-électronique qui comprend un substrat (12) de câblage pourvu de conducteurs (120, 121, 122, 123) de connexion et une couche (11) de connexion optique empilée sur le substrat (12) et pourvue, à l'avant, d'un élément optique. La couche (11) comprend une âme (111) guidant la lumière, une gaine (113) entourant l'âme (111), et un miroir (115) réfléchissant la lumière propagée à travers l'âme (111) en direction de l'élément optique monté au-dessus de la couche (11) de connexion optique ou réfléchissant, dans l'âme (111), la lumière émanant de l'élément optique. Le substrat (12) comporte des moyens permettant de relier électriquement l'élément optique (22) aux conducteurs (120, 121, 122, 123) de connexion. Lesdits moyens, pourvus de l'élément optique à une extrémité, pénètrent dans le substrat et la couche (11) de connexion optique.

METHOD AND DEVICE FOR INSTALLING LIGHT EMITTING ELEMENT

... [PROBLEMS] A light emitting element installation method capable of highly accurately positioning and mounting a light emitting element on an object by using the optical axis of the element as a standard. [MEANS FOR SOLVING PROBLEMS] A suction head is inserted between a first camera and a second camera that are arranged in a positional relationship where their optical axes are opposed and relatively fixed, a head standard mark is imaged by the first camera, an end face of a light emitting element sucked to the suction head is imaged by the second camera, and the optical axis of light emitted by the light emitting element is imaged by a third camera. Then, a stage is inserted between the first camera and the second camera, a substrate held on the stage is imaged by the first camera, and a stage standard mark is imaged by the second camera. Relative positions of the light emitting element and the suction head and relative positions of the substrate and the stage are calculated using image ...

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

An optoelectronics chip-to-chip interconnects system is provided, including at least one packaged chip to be connected on the printed-circuit-board with at least one other packaged chip, optical-electrical (O-E) conversion mean, waveguide-board, and (PCB). Single to multiple chips interconnects can be interconnected provided using the technique disclosed in this invention. The packaged chip includes semiconductor die and its package based on the ball-grid array or chip-scale-package. The O-E board includes the optoelectronics components and multiple electrical contacts on both sides of the O-E substrate. The waveguide board includes the electrical conductor transferring the signal from O-E board to PCB and the flex optical waveguide easily stackable onto the PCB to guide optical signal from one chip-to-other chip. Alternatively, the electrode can be directly connected to the PCB instead of including in the waveguide board. The chip-to-chip interconnections system is pin-free and compatible ...

OPTICAL WAVEGUIDE MODULE

An optical waveguide module includes an optical waveguide sheet including multiple optical waveguides, and a light-emitting device and a light-receiving device each positioned over a surface of the optical waveguide sheet. At least one of the optical waveguides includes a first mirror, a second mirror, and a slit. The first mirror is configured to reflect light entering the corresponding optical waveguide from its first end to the light-receiving device or to reflect light emitted from the light-emitting device toward the first end of the corresponding optical waveguide. The second mirror is configured to reflect light entering the corresponding optical waveguide from its second end toward the surface of the optical waveguide sheet. The slit is provided between the second mirror and the second end of the corresponding optical waveguide. The corresponding optical waveguide is discontinuous across the slit. 1. An optical waveguide module , comprising:an optical waveguide sheet including a plurality of optical waveguides;a light-emitting device positioned over a first surface of the optical waveguide sheet;a light-receiving device positioned over the first surface of the optical waveguide sheet;,a first mirror formed in at least one of the plurality of optical waveguides and configured to reflect light entering from a second surface of the optical waveguide sheet opposite to the first surface toward the optical waveguide; anda second mirror formed in the optical waveguide and configured to reflect the light reflected from the first mirror and propagating through the optical waveguide toward the first surface of the optical waveguide sheet.2. The optical waveguide module as claimed in claim 1 , whereinthe plurality of optical waveguides include a dummy optical waveguide that does not propagate an optical signal, andthe first mirror and the second mirror are formed in the dummy optical waveguide.3. The optical waveguide module as claimed in claim 1 , whereinthe plurality ...

Submount and connector assembly for active fiber needle

A connector assembly includes an active fiber needle 1 having a passive or active optical device 6 connected to an end face 7 of a thick metallized coating 4 and a cup-shaped mount 10 for hermetically enclosing the optical device. The mount 10 hermetically encloses the optical device 6 and provides heat dissipation and electrical connections for optical device 6. The cup-shaped mount may include a ceramic tubular sleeve hermetically sealed to the metal coating 4 on the fiber needle 1 about a central bore 12A thereof. Electrical connections between the optical device 6 and devices external to the mount may preferably be provided through a spring contact 18 which is soldered to terminals on device 6 and has at least one leg 18A, 18B extending through the hermetically sealed cup-shaped housing 10. Other embodiments of electrical lead connections may be provided by wire bonds 24 between device 6 and external metallization surfaces 26A.

Multi-level waveguide

A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.

Method for fabricating a hybrid optical integrated circuit employing SOI optical waveguide

The present invention relates to an optical integrated circuit; and, more particularly, to a method for preparing an improved hybrid optical integrated circuit which is capable of accommodating optical waveguides, optical devices, such as light emitting devices and light receiving devices, and optical fibers in an effective manner. The present invention has the advantages of minimizing horizontal misalignment error between the SOI waveguide rib area, the V-groove etch window and the alignment marks, decreasing the manufacturing cost by passively aligning the waveguides, the optical devices and the optical fibers on a single substrate. Also, the present invention has an effect of reducing fresnel reflection loss by providing the LPCVD silicon nitride layer capable of being used as an anti-reflection coating layer at both ends of the waveguide.

Semiconductor parts and semiconductor mounting apparatus

To provide a package structure for securing a satisfactory optical coupling between an optical device arranged beforehand on a printed board and an optical device newly mounted on the particular printed board. Positioning LDs 41a and 41b are arranged on a printed board 1. A sensing PD 42a for receiving the optical signal emitted from the positioning LD 41a and a sensing PD 42b for receiving the optical signal emitted from the positioning LD 41b are arranged in an OEIC package 11 mounted on the printed board.

OPTICAL COMPONENT, METHOD FOR MANUFACTURING OPTICAL COMPONENT, AND OPTICAL CONNECTOR CABLE

An optical component including an optical device, a substrate, and a lens component is disclosed. The substrate has a mounting surface on which the optical device is mounted and at least two reference marks are provided. The lens component is disposed on the substrate. The lens component includes a first surface, a second surface, a lens, at least two first transmission regions formed on the first surface, and at least two second transmission regions formed in positions facing the first transmission regions on the second surface. Each of the second transmission regions is smaller than the corresponding first transmission region. The lens component is attached to the substrate so that each of the second transmission regions is located within the corresponding first transmission region and each of the reference marks is located within the corresponding second transmission region when viewed along an observation direction orthogonal to the first surface.

Optically enabled hybrid semiconductor package

The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

MULTI-CHANNEL RECEIVER OPTICAL SUB-ASSEMBLY AND MANUFACTURING METHOD THEREOF

Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring board

An optical-electric printed wiring board includes an electric wiring substrate having electric interconnects, and an optical wiring layer stacked on the electric wiring substrate and having a surface on which an optical part is mounted. The optical wiring layer includes a core for propagating light, a clad for sandwiching the core, and a mirror for reflecting light propagating in the core toward an optical part mounted on the optical wiring layer, or reflecting light from an optical part into the core. The electric wiring substrate includes conductive setting portions each of which extends through the optical wiring layer in the direction of stacking and has an end face on which an optical part is set. These conductive setting portions obtain electrical conduction between the optical part and the electric interconnects.

Alignment assembly for multifiber or single fiber optical cable connector

The present invention provides a precise optical fiber cable connector (10) for aligning and connecting ends of a pair of cables. The connector (10) has a fiber alignment block (12) having a fiber receiving surface (14) and a connector engagement surface (18). First and second openings (44,46) are provided in the connector engagement surface (18). An alignment ball (62) is provided and is retained in the first opening (44). The alignment ball (62) is for aligning the connector (10) with another like connector, and specifically, for aligning optical fibers carried on the connector alignment assemblies.

Fiber assembly alignment using fiducials

An assembly (210, 410A) and an optical element (220, 420A) have fiducials (212, 414) for alignment of multiple beam paths during fabrication of an optical device. In an assembly including a substrate (215) with machined grooves (116) for optical fibers (112) , a fiducial can be a carbon-coated fiber (212) or other object disposed in one of the grooves. In an assembly including a collimator array (410A), a fiducial can be an opaque collimator lens (414). Alternatively, photolithographic processes can provide the required positional accuracy for fiducials (212' and/or 222) on the assembly and/or the optical element During alignment, a computer-controllable process can use machine vision or distance measurements to identify the position and the orientation of the assembly relative to the optical element. Based on the identified position and orientation, the process moves the assembly to the target position and orientation that provide sufficient optical power flow through the optical element ...

OPTICAL COMPONENT HAVING POSITIONING MARKERS AND METHOD FOR MAKING THE SAME

The fabrication of an optical component comprising an optical waveguide and positioning marker on a same substrate is facilitated, and the yield of the fabrication process for such an optical component is increased. By forming the core segment of the optical waveguide and the positioning marker in a same step, the positional accuracy between the core segment and the positioning marker can be improved without requiring a high level of expertise or expensive equipment such as a photographic exposure device. In the optical component comprising an optical waveguide and positioning marker on a substrate, the positioning marker is provided with rounded corners or a curved profile whereby it is possible to avoid the stress concentration which would otherwise develop due to the difference in thermal expansion between the various layers at the time of thermal processing, and the cracks which would otherwise develop in the positioning marker and the surrounding layers.

Opto-electronic hybrid integration platform, optical sub-module, opto-electronic hybrid integration circuit, and process for fabricating platform

Coupling structure between optical semiconductor and optical waveguide, and coupling method of the same

SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR MOUNTING DEVICE

PROBLEM TO BE SOLVED: To improve positioning accuracy between a light transmission path on a printed circuit board side and an optical device on a semiconductor component side by installing a socket for receiving a semiconductor component, including a photoelectric element on the printed circuit board and prescribing a position at which the semiconductor component is mounted on the printed circuit board. SOLUTION: A connector socket 3 on a printed circuit board 1 receives an OEIC package 11 composed by electrically connecting an optical device array 12 to an electrical circuit chip 13 via ball bumps 15 and sealing them together. Light signals between the OEIC package 11 and electronic components on the printed circuit board 1 are transmitted via waveguide paths 2, embedded in the printed circuit board 1 corresponding to respective elements of the optical device array 12. In addition, a power source voltage and a grounding voltage are supplied from terminals 4 of the connector socket 3 to ...

Laserdioden-Modul und Kopplungsmethode

Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform

Optical semiconductor device and method of manufacturing thereof

Semiconductor laser module and method of assembly

In a semiconductor laser module, a semiconductor laser element (3) is disposed on a side surface of a submount (2) perpendicular to a front surface of a pedestal (1) and the the submount (2) with the laser element (3), a lens (6), and an optical fiber (9) are positioned on the front surface of the pedestal (1) so that laser light emitted from the semiconductor laser element (3) is applied through the lens (6) to a prescribed portion of the optical fiber (9) with high reliability. Accurate alignment of the laser may be obtained by using a marker on the submount, or a projecting alignment pillar on the pedestal (fig 5), or by means of steps on the laser and the submount (fig. 4). Therefore, the positioning of the laser element (3) in the direction perpendicular to the front surface of the pedestal (1) is facilitated, and the positioning accuracy is improved, resulting in a low-cost and high-performance semiconductor laser module. ...

Optical module for coupling an optical fibre and method of producing it

OPTICAL-LEADING LAYER, OPTOELEKTRISCHLEITENDES SUBSTRATE, INSTALLED SUBSTRATE AND THEIR MANUFACTURING PROCESSES

ARRANGEMENT FOR IN AND UNCOUPLING FROM LIGHT IN TRANSVERSE ELECTROMAGNETIC WAVE AND METHOD TO THEIR PRODUCTION

INTEGRATED OPTICAL EQUIPMENT FOR THE PRODUCTION OF SEPARATE JETS ON A DETECTOR, AND ASSOCIATED ONE PROCEDURE

INTEGRATED RADIATION MOLDER AND ITS USE

An optical coupling mount

Vision-based passive alignment of an optical fiber subassembly to an optoelectronic device

A vision-based passive alignment approach to optically couple input/output of optical fibers in optical alignment to optoelectronic components that are supported on a substrate. An optical bench supporting an optical fiber is physically and optically coupled to an optoelectronic device mounted on a submount via an optically transparent alignment block. The transparent alignment block having a first set of optical fiducials for aligning optical fiducials defined on the optical bench with the alignment block, and a second set of optical fiducials for aligning the alignment block with optical fiducials defined on the submount.

ELECTRO-OPTIC INTERCONNECT CIRCUIT BOARD

A method and apparatus are provided for aligning a plurality of transmission paths of an array of optical devices (22) with a plurality of optical fibers (56). The method includes the steps of disposing the optical array (14) on a first side of the transparent substrate (20) with the plurality of optical transmission paths passing directly through the substrate (20), disposing a signal processor (16) on the first side of the transparent substrate (20) adjacent the array (14) of optical devices (22), disposing a set of aligning guides (19) on a second side of the transparent substate (20) parallel to th e plurality of transmission paths for aligning the plurality of optical fibers (56) with the plurality of transmission paths and coupling a plurality of signals processed by the processor (16) through the plurality of transmissio n paths between the optical array (14) and plurality of optical fibers (56).</ SDOAB>

VISION-BASED PASSIVE ALIGNMENT OF AN OPTICAL FIBER SUBASSEMBLY TO AN OPTOELECTRONIC DEVICE

A vision-based passive alignment approach to optically couple input/output of optical fibers in optical alignment to optoelectronic components that are supported on a substrate. An optical bench supporting an optical fiber is physically and optically coupled to an optoelectronic device mounted on a submount via an optically transparent alignment block. The transparent alignment block having a first set of optical fiducials for aligning optical fiducials defined on the optical bench with the alignment block, and a second set of optical fiducials for aligning the alignment block with optical fiducials defined on the submount.

PARALLEL OPTICAL INTERCONNECTS

An optical interconnect is disclosed that couples multiple optical fibers (135) to an array of optoelectronic device. The interconnect includes a multiple optical fiber connector (150) and an optoelectronic board (100). The multiple fiber connector ( 150) can be mechanically attached to or detached from the board (100).

OPTICAL MINIATURE CAPSULE

Optoelectronic active/passive components are directly mounted to a front surface of a capsule of an electrically isolating, opaque material. The surface on which the components are mounted is retracted in relation to other parts of the front surface where holes for guide pins of a connectable coupling device for optical fibers are provided. The components are electrically connected to, e.g. by means of loose wires, conductor paths also arranged on the retracted front surface part. In a particular designed mounting method the optical components may be provided in the shape of a plate having its electric terminals at its rear side. On the electric terminals isles, e.g. of tin solder, are placed, the plate is placed at the front side of the capsule, where holes are provided extending into the capsule up to electric conductive paths inside the capsule, and the soldering isles are heated so that the tin solder flows into the holes and contacts the electric conductors therein.

INTEGRATED BEAM SHAPER AND USE THEREOF

A substrate having an optical element on an input surface thereof receives a light beam not having a desired beam shape and shapes the light beam into a predetermined intensity distribution. The substrate may further include a second optical element for providing a predetermined phase pattern to the light beam provided by the first optical element. The first optical element may, for example, circularize an elliptical light beam using a soft aperture for differential power attenuation or by altering the divergence of the light beam along the different axes of the light beam. When the divergence angles are altered and the collimating optical element is provided on the output surface, the thickness of the transparent substrate is determined in accordance with a resultant difference in the divergence and/or with the initial difference in beam size along each axis and with a required circularity. A light source is mounted close to the first optical element in order to minimize the amount of ...

WAFER LEVEL INTEGRATION OF MULTIPLE OPTICAL ELEMENTS

Integrated multiple optical elements may be formed by bonding substrates (10, 12) containing such optical elements together or by providing optical elements (22, 28) on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. A seal (16) for each die preventing the dicing slurry from getting between the wafers is desirable. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

SURFACE-MOUNTED MODULE AND A METHOD OF PRODUCING THE SAME

A surface mount module (1) comprising an optical semiconductor device (5) and an optical fiber (6) on a substrate (2), and a production method of the module (1). The substrate (2) comprises a base (3) formed by a precision transfer technique and having positioning marks (3b) for the optical semiconductor device and a positioning portion (3c) for the optical fiber; and a molded article (4) integrated with the base.

OPTICAL WIRING LAYER, OPTOELECTRIC WIRING SUBSTRATE, MOUNTED SUBSTRATE, AND METHODS FOR MANUFACTURING THE SAME

A first clad layer is formed on a smooth support substrate via a release layer. On the first clad layer, a core through which light propagates and alignment marks are simultaneously formed. Further, these layers are covered with a second clad to obtain an optical wiring layer. Then, the optical wiring layer is released from the support substrate and stuck to a substrate having an electric wiring. Subsequently, on the resulting substrate are formed a mirror for reflecting light propagating through the core, pads for installing optical parts or the like, and via holes for electrically connecting the electric wiring on the substrate to the pads. For this formation, the alignment marks are used as references.

Tunable optical instruments

Optical module and optical module manufacturing method

Optical waveguide device and manufacturing method for the same

ACTIVE FIBER NEEDLE

An optical connection for connecting an active optical device (6, 52) or a passive optical device (41, 63) to an optical fiber (3), having a thick metal coating (2) deposited circumferentially around the fiber. In this optical connection the device (6, 52, 41, 63) is bonded to the polished endface of the fiber (5), with particular use being made of the thick metal surface (7) on the endface of the fiber. In another embodiment, the optical fiber (3) is etched to form various surfaces (31, 32, 33) for optical coupling. This etching also allows for accurate passive alignment of an etched active device (52) or a passive device (42, 63) with the optical fiber.

High speed electro-optical signal translator

An electro-optical signal translator, signal translator design features, methods of fabrication, alignment techniques and alignment apparatus that utilize, with the exception of output optical fiber to transmitter module coupling, passive assembly techniques that are compatible with assembly line operations to produce high performance electro-optical signal translators.

Customer interface module

An optical amplifier assembly comprises a Customer Interface module and a plurality of other amplifier modules. The Customer Interface module includes: (i) a customer interface configured to interact with other devices and (ii) optical and electrical connectors, connecting at least one of the other optical amplifier modules to the customer interface. According to one embodiment of the present invention the Customer Interface module ...

Multi-level waveguide

A multi-level waveguide to transmit light through a series of substrates. The multi-level waveguide is made up of stacked substrates, each containing a two dimensional array of transparent material filled vias. Transparent materials such as optical fiber, cladding, and gas may be used to provide a pathway for light. Optionally, a conductive layer may be deposited on a substrate in the multi-level waveguide. The conductive layer can then interact with the multi-level waveguide through light detecting devices such as photodetectors.

Photo-electronic device and method of producing the same

A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.

Optical module and method for manufacturing the optical modules

In an optical module such as an optical branching and multiplexing device used in an optical communication system, optical waveguides are formed on a surface of an optical waveguide substrate and optical fibers are held by arranging guide grooves on an optical fiber arranging substrate. The optical waveguide substrate has positioning guide grooves which can engage with the arranging guide grooves. The pitch of the optical waveguides on end faces of the optical waveguide substrate coincide with the pitch of the arranging guide grooves, so that the optical fibers and the optical waveguides are coupled accurately without any adjustment.

Methods and apparatus to mount a waveguide to a substrate

Methods and apparatus to mount an optical waveguide to a substrate are disclosed. A disclosed method involves providing a substrate having a first layer and a second layer. The first layer includes at least one alignment fiducial and the second layer covers the at least one fiducial. At least a portion of the second layer is removed to render the fiducial visible and a waveguide is automatically aligned with the first fiducial. The waveguide is then fixed to the substrate.

METHOD FOR MANUFACTURING OPTICAL CIRCUIT BOARD

A method for manufacturing an optical circuit board includes: forming an optical waveguide having a structure that a core is sandwiched between a lower clad layer and an upper clad layer so as to extend along an upper surface of a glass plate; forming a glass plate-side positioning mark composed of the same material as the core, between the lower clad layer and the upper clad layer in a region other than the core; forming a reflection surface at a part of the core; preparing a wiring board having a board-side positioning mark; and mounting the glass plate having the optical waveguide formed thereon so that the glass plate-side positioning marks and the board-side positioning mark are superimposed on each other. 1. A method for manufacturing an optical circuit board , comprising:forming an optical waveguide having a structure that a core is sandwiched between a lower clad layer and an upper clad layer so as to extend along an upper surface of a glass plate, and forming a glass plate-side positioning mark composed of a same material as the core, between the lower clad layer and the upper clad layer in a region other than the core;forming a reflection surface at a part of the core by cutting the core, the reflection surface being constituted by a cut surface that is perpendicular to an extension direction of the optical waveguide, has a certain angle with respect to the upper surface, and extends from an upper surface of the core to a lower surface of the core;preparing a wiring board having, on an upper surface thereof, a board-side positioning mark corresponding to the glass plate-side positioning mark; andmounting the glass plate having the optical waveguide formed thereon on the upper surface of the wiring board so that the glass plate-side positioning mark and the board-side positioning mark are superimposed on each other.2. The method for manufacturing an optical circuit board according to claim 1 , further comprising forming claim 1 , on the upper surface of the ...

Tunable optical instruments

An optical instrument including: a thermo-optically tunable, thin film, free-space interference filter having a tunable passband which functions as a wavelength selector, the filter including a sequence of alternating layers of amorphous silicon and a dielectric material deposited one on top of the other and forming a Fabry-Perot cavity structure having: a first multi-layer thin film interference structure forming a first mirror; a thin-film spacer layer deposited on top of the first multi-layer interference structure, the thin-film spacer layer made of amorphous silicon; and a second multi-layer thin film interference structure deposited on top of the thin-film spacer layer and forming a second mirror; a lens for coupling an optical beam into the filter; an optical detector for receiving the optical beam after the optical beam has interacted with the interference filter; and circuitry for heating the thermo-optically tunable interference filter to control a location of the passband.

Vertically integrated optical devices coupled to optical fibers

Integrated optical devices in which one or more optical fibers are vertically integrated with other optical components in a multilayer arrangement. Optical components include lenses, etalons that may be passive or actuable, WDM filters and beamsplitters, for example. One vertically integrated optical device comprises a fiber socket layer comprising a plurality of sockets including a first socket and second socket arranged proximate to each other, and a lens that has a central axis offset from the cores of the first and second fibers. Optical devices include filters, variable optical attenuators, and switches, for example. A component layer may comprise a spacer layer that provides a predetermined opening that is hermetically sealed to protect sensitive components, such as MEMS devices. Also, a method of forming a socket layer using a two-sided etching process is disclosed. Furthermore, an integrated laser device is disclosed that includes a laser layer.

Optical module for connecting optical element and optical fiber

An optical module includes a mounting board, an optical element, an optical fiber having an optical axis, the optical fiber inserted in the mounting board to align the optical axis with the optical element, and a positioning mark provided to position the optical element on the mounting board. The mounting board has a groove provided in the middle of the mounting board and extending in a direction of the optical axis of the optical fiber, the groove enclosing the optical fiber when inserted. The groove has a vertical wall which is perpendicular to the direction of the optical axis and confronts a leading edge of the optical fiber when inserted. The positioning mark is located adjacent to an internal edge of the groove where the vertical wall is provided on the mounting board.

Optical device with alignment compensation

An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device. The alignment compensation module removes residual alignment errors of the optical device.

SYSTEM AND METHOD FOR MARKING AT OPTICAL FILM

Disclosed is a system and method for marking at a partial area of an optical film material. The system for marking at an optical film includes a feed roll configured to feed an optical film material in a first direction, a marking unit configured to mark a nulling mark or material information in a marking area of the optical film material fed in the first direction, other than a valid area which is attached to a display panel, a light source unit having a light source member configured to supply a marking laser light to the marking unit, and a receiving roll configured to collect the optical film material.

Optical fibre alignment device

Method for manufacturing laser diode chip

An optical device and its production method

On one principal plane of a silicon substrate 1, a silicon oxide film 2 having an opening 2a is formed, and a silicon nitride film 3 having an opening 3b overlapping the opening 2a and a recessed marker 3b is stacked on the silicon oxide film 2. Next, the substrate 1 is etched through the openings 2a, 3a to provide an alignment groove la for an optical waveguide, and an electrode pattern 5 is formed. Light of which wavelength transmits through the substrate 1 and the silicon oxide film 2 is radiated from the other principal plane of the substrate 1, and the optical element is assembled with the marker 3b serving as the reference while the marker 3b and the optical element are monitored.

Optical and/or electrooptical connection and process for its fabrication

Connecting optical or electro-optical waveguide structures The connection includes e.g. a semiconductor laser (10) and a fibre (13) each incorporating an optical waveguide (11,14). Both components are mounted on the surface (16) of a supporting plate (15) with spot welds (17,18) produced by electromagnetic radiation at a wavelength of preferably 1.06 mu m. The radiation is directed vertically through the upper surfaces of both components. The welding involves no use of auxiliary or intermediate supports and the volume of material melted can be very small. There need be no grooves in the supporting plate.

OPTICAL ELEMENT, METHOD OF MOUNTING THE SAME, AND OPTICAL MODULE

PROBLEM TO BE SOLVED: To provide an optical element which can be mounted with a high precision independently of dimensions of an effective diameter and to provide a method of mounting the same and an optical module having the optical element mounted with a high precision. SOLUTION: A lens element 1 comprises an optical substrate and has a lens part 2, two adaptation parts 4a and 4b, and a handling part 6. The adaptation parts 4a and 4b are placed in the right and the left apart from the lens part 2 and have approximately semicylindrical shapes protruding downward from the handling part 6 and partially form cylindrical shapes having major axes parallel with the optical axis of the lens part 2. Dimensions of outside diameters of arcuate shapes of adaptation parts 4a and 4b are equal to those of an optical fiber to which the lens element 1 is optically coupled. When the lens element 1 is mounted on a support substrate having grooves for mounting, the adaptation parts 4a and 4b are brought ...

PASSIVE METHOD FOR FITTING OPTICAL ELEMENT TO OPTICAL INTEGRATED CIRCUIT AND TEMPLATE FOR IMPLEMENTING THE SAME

PROBLEM TO BE SOLVED: To provide an accurate and inexpensive passive method for fitting a connector an the optical element together with an optical integrated circuit, and a template for the above method. SOLUTION: The output terminal and/or input terminal of each element is positioned almost in level with the input terminal and/or output terminal of the optical integrated circuit 26 which is positioned on the same plane (xoz). In this case, the circuit 25 is positioned on a template 35 having a pattern for precisely matching the input terminal and/or output terminal of the circuit 26 with the optical element, and a block 30, which contains the optical element is positioned on the template 35 and fixed to the circuit; and the template is removed, and the optical element is positioned at each block which is matched with the input terminal and/or output terminal of the circuit. COPYRIGHT: (C)1999,JPO ...

RECEPTACLE TYPE OPTICAL TRANSMITTER-RECEIVER AND PRODUCTION THEREFOR

PROBLEM TO BE SOLVED: To provide an optical transmitter-receiver module capable of shortening the time required for positioning a semiconductor laser element. SOLUTION: In a receptacle optical type transmitter-receiver module having a semiconductor laser element 1 and a glass lod 6 performing a physical contact with an optical fiber ferrule in order to guide the exciting light of the laser element 1, the image of the marker of the surface 6a of the physical contact and the image of the emitted light from the semiconductor laser element 1 are picked up by an infrared camera 31 by forming the marker for the positioning of the optical axis of the semiconductor laser element 1 on the surface 6a of the physical contact of the glass contact 6 and also by making the laser element 1 emit the light and the positional deviation of the optical axis of the laser element 1 is detected by applying a two-dimensional image processing to the images in an image processor 32 and the positioning in a direction ...

チップ組立ての方法とデバイス

... 少なくとも1個の光活性表面を有するチップの構造体を簡単にしおよび光ファイバと光学的に活性な表面との間に最良の光透過を得るために前記チップを光小型カプセルに対して正しい位置に配置する本発明により、少なくとも1個の導電体(4)を有しおよび前記チップをフォイル基板の上の正しい位置に配置するためおよび前記フォイル基板/チップ組立体をカプセルの上の正しい位置に配置するための整合マークおよび/または案内装置(8)を備えた前記フォイル基板(9)の上に、前記チップ(1)が固定される。前記チップが前記フォイル基板の上に固定された後、前記チップを備えた前記フォイルを前記カプセルに容易に固定することができ、そして前記装置により前記チップが前記カプセルに固定されるであろう。前記カプセルの上の例えば接触素子案内ピンのような案内装置を用いることにより、前記接触素子の中の光ファイバの端部が前記チップの前記光学的に活性な表面に対向しおよび接触しそれによりそれらの間で最良の光透過が得られるように、前記カプセルに対して正しい位置に前記フォイル基板/チップ組立体を配置しすることができる。 ...

Patent RU2016149987A3

7 ВУ’” 2016149987” АЗ Дата публикации: 07.02.2019 Форма № 18 ИЗ,ПМ-2011 Федеральная служба по интеллектуальной собственности Федеральное государственное бюджетное учреждение ж 5 «Федеральный институт промышленной собственности» (ФИПС) ОТЧЕТ О ПОИСКЕ 1. . ИДЕНТИФИКАЦИЯ ЗАЯВКИ Регистрационный номер Дата подачи 2016149987/28(080271) 26.05.2015 РСТЛ52015/032471 26.05.2015 Приоритет установлен по дате: [ ] подачи заявки [ ] поступления дополнительных материалов от к ранее поданной заявке № [ ] приоритета по первоначальной заявке № из которой данная заявка выделена [ ] подачи первоначальной заявки № из которой данная заявка выделена [ ] подачи ранее поданной заявки № [Х] подачи первой(ых) заявки(ок) в государстве-участнике Парижской конвенции (31) Номер первой(ых) заявки(ок) (32) Дата подачи первой(ых) заявки(ок) (33) Код страны 1. 62/002,772 23.05.2014 05 Название изобретения (полезной модели): [Х] - как заявлено; [ ] - уточненное (см. Примечания) ОСНОВАННАЯ НА ВИЗУАЛЬНОМ НАБЛЮДЕНИИ ПАССИВНАЯ ЮСТИРОВКА ОПТОВОЛОКОННОГО УЗЛА ОТНОСИТЕЛЬНО ОПТОЭЛЕКТРОННОГО УСТРОЙСТВА Заявитель: НАНОПРЕСИЖЕН ПРОДАКТС, ИНК., 05 2. ЕДИНСТВО ИЗОБРЕТЕНИЯ [Х] соблюдено [ ] не соблюдено. Пояснения: см. Примечания 3. ФОРМУЛА ИЗОБРЕТЕНИЯ: [Х] приняты во внимание все пункты (см. п см. Примечания [ ] приняты во внимание следующие пункты: [ ] принята во внимание измененная формула изобретения (см. Примечания) 4. КЛАССИФИКАЦИЯ ОБЪЕКТА ИЗОБРЕТЕНИЯ (ПОЛЕЗНОЙ МОДЕЛИ) (Указываются индексы МПК и индикатор текущей версии) С 02В 6/42 (2006.01) С02В 6/36 (2006.01) 5. ОБЛАСТЬ ПОИСКА 5.1 Проверенный минимум документации РСТ (указывается индексами МПК) 002В 6/00-6/54 5.2 Другая проверенная документация в той мере, в какой она включена в поисковые подборки: 5.3 Электронные базы данных, использованные при поиске (название базы, и если, возможно, поисковые термины): Е-Габгагу, ЕАРАТГУ, Езрасепеё, Соое, Соозе Реп, 7-Р1а Ра, КТРК5, РАТЕМТСОРЕ, Ра еагсь, КОРТО, ОЗРТО 6. ДОКУМЕНТЫ, ОТНОСЯЩИЕСЯ К ПРЕДМЕТУ ПОИСКА Кате- ...

Optoelektronische Hybridintegrationsplattform, optisches Untermodul, optoelektronische hybridintegrierte Schaltung, und Herstellungsverfahren der Plattform

Optoelektronische Hybridintegrationsplattform und optisches Sub-Modul

Base for positioning semiconductor device on circuit board

A semiconductor component (13) is inserted into the base on the circuit board (1). The semiconductor component includes photoelectric devices for optical communication with an optical device. Several optical devices may be provided on the circuit board for communicating with the photoelectric devices. The positioning device may detect the output level of the photodetectors. Independent claims are also included for: (a) a semiconductor component (b) a circuit board (c) a circuit board unit (d) a positioning device (e) a method of mounting a semiconductor component on a circuit board.

Optical elements, method of replicating optical elements, particularly on a wafer level, and optical devices

Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

Optical module and method of manufacturing optical module

A method of manufacturing an optical module includes the steps of applying the invisible light onto the resin member and the optical device, observing, with use of a camera, a part of the resin member located at the optical fiber coupling plane and an image formed at the optical fiber coupling plane by the optical device active layer while applying the invisible light onto the resin member and the optical device, aligning positions of the resin member and the circuit board with respect to each other while observing the part of the resin member located at the optical fiber coupling plane and the image formed at the optical fiber coupling plane, and fixing the resin member to the circuit board while maintaining the aligned positions of the resin member and the circuit board.

Optical and thermal interface for photonic integrated circuits

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

LENS ARRAY OPTICAL COUPLING TO PHOTONIC CHIP

A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide. 1. A photonic integrated circuit apparatus comprising:a photonic chip including a waveguide comprising at least one slot; anda lens array coupling element mounted on a top surface of the photonic chip, said coupling element including a lens array and including an overhang on a side of the coupling element that opposes the lens array, said overhang including a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide and a surface of the lens array coupling element with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide, wherein the overhang further comprises at least one reference feature that protrudes from the vertical stop surface and has sidewalls that are not perpendicular to a bottom reference feature surface.2. The apparatus of claim 1 , wherein the overhang includes a second surface having a height configured to effect the vertical alignment with the focal points and the edge of the waveguide.3. The apparatus of claim 1 , wherein said at least one slot and reference feature are configured to provide a ...

DIRECT COUPLING FIBER-DEVICE STRUCTURE

A direct coupling fiber-device structure including an optical fiber and a micro device is provided. The optical fiber has a first end, a second end opposite to the first end, and an inner cavity recessed from the first end. The micro device is in the inner cavity. The micro device has a first surface and a second surface. The first surface is substantially facing away from the first end. The second surface is opposite to the first surface and facing toward the first end. 1. A direct coupling fiber-device structure , comprising:an optical fiber having a first end, a second end opposite to the first end, and an inner cavity recessed from the first end; anda micro device in the inner cavity and having a first surface substantially facing away from the first end and a second surface opposite to the first surface and facing toward the first end.2. The direct coupling fiber-device structure of claim 1 , further comprising a base portion in contact with the first end claim 1 , wherein the micro device is between the first end and the base portion.3. The direct coupling fiber-device structure of claim 2 , wherein the base portion is in contact with the first surface of the micro device.4. The direct coupling fiber-device structure of claim 2 , further comprising a supporting element connecting the optical fiber and the base portion claim 2 , wherein the supporting element is in contact with an outer periphery of the optical fiber.5. The direct coupling fiber-device structure of claim 1 , further comprising a transparent layer in the inner cavity and between the micro device and the first end claim 1 , wherein a refractive index of the transparent layer is greater than 1.6. The direct coupling fiber-device structure of claim 5 , wherein the refractive index of the transparent layer is smaller than a refractive index of the micro device.7. The direct coupling fiber-device structure of claim 1 , wherein the micro device is a micro light emitting device.8. The direct coupling ...

Assembly comprising a substrate and two components including optical waveguides, as well as method for production

An assembly may include at least one camera and a controllable mechanical handling device. The system may further include a first component, including a first optical waveguide and a second component, including a second optical waveguide. The first component and the second component are fixedly connected to a substrate and arranged directly next to one another on the substrate and relative to one another in such a way that a coupling side of the first component and a coupling side of the second component are situated opposite each other on a first and second side of a coupling plane. The optical waveguides of the first and second component each end at a first coupling surface or a second coupling surface. The first and second coupling sides are aligned, and optically coupled with one another at a first and second end face.

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC. 1an optical interface unit; a bottom side, wherein the optical interface unit is disposed on the bottom side;', 'a top side including a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side;', 'an emitter to emit light through the PIC out of the bottom side to the optical interface unit; and', 'an alignment feature corresponding to the emitter and formed with the emitter to be offset by a predetermined distance value, wherein the PIC comprises a processing feature to image the alignment feature from the bottom side; and, 'a photonic integrated circuit (PIC), includinga heat spreader layer surrounding the optical interface unit and disposed on the bottom side of the PIC to spread heat from the PIC.. An apparatus comprising: This application is a continuation of U.S. application Ser. No. 14/611,392, filed Feb. 2, 2015, which application claims the benefit of priority to U.S. Provisional Patent Application entitled “Optical and Thermal Interface for Photonic Integrated Circuits,” Ser. No. 61/943,108, filed Feb. 21, 2014, which is hereby incorporated ...

PHOTONIC INTERFACE FOR ELECTRONIC CIRCUIT

A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit. 120-. (canceled)21. A photonic interface assembly for providing communication between at least one optical fiber and an electronic circuit , comprising:a substrate including: at least one of a first and a second port, and at least one of a first and a second electrical connection electrically connected to the first and second ports, respectively, for electrically connecting to the electronic circuit; at least one optical port for optically coupling to the at least one optical fiber for outputting a first optical signal and/or for receiving a second optical signal;', 'a third electrical connection electrically connected to the first port for receiving a first electrical signal from the electronic circuit and/or a fourth electrical connection electrically connected to the second port for coupling a second electrical signal to the electronic circuit; and', 'at least one of a laser and an optical modulator for modulating an optical carrier wave with the first electrical signal to provide the first optical signal, and/or a photodetector for providing the second electric signal in response to the second signal; and, 'a photonic integrated circuit mounted on the substrate comprisinga fiber support attached to the photonic integrated circuit for optically aligning the at least one optical fiber with the at least one optical port.22. The photonic interface assembly of claim 21 , wherein the photonic integrated circuit comprises a silicon photonic chip.23. ...

CONNECTOR DEVICE AND PLUG CONNECTOR

A plug connector is provided with a photoelectric conversion portion, a first electric connector and a first lock portion. The first electric connector inputs and outputs electric signals into and from the photoelectric conversion portion. The first lock portion and the first electric connector are apart from each other by a first distance. A receptacle connector is provided with a second lock portion and a second electric connector. When the plug connector and the receptacle connector are mated with each other, the second lock portion engages with the first lock portion, and the second electric connector is connected to the first electric connector. The second lock portion and the second electric connector are apart from each other by a second distance. A difference between the first distance and the second distance is equal to or less than an effective contact length between the first electric connector and the second electric connector. 1. A connector device comprising a plug connector and a receptacle connector which are mateable with each other along a mating direction , wherein:the plug connector comprises a cable-holding portion, a photoelectric conversion portion, a first electric connector and a first lock portion;the cable-holding portion holds an optical fiber cable which transmits an optical signal;the first electric connector inputs and outputs electric signals into and from the photoelectric conversion portion;the photoelectric conversion portion converts the optical signal and the electric signal to each other;the first lock portion and the first electric connector are apart from each other by a first distance in the mating direction;the receptacle connector comprises a second lock portion and a second electric connector;the second lock portion engages with the first lock portion when the plug connector and the receptacle connector are mated with each other;the second electric connector is connected to the first electric connector when the plug ...

ALIGNING AND DIRECTLY OPTICALLY COUPLING PHOTODETECTORS TO OPTICAL DEMULTIPLEXER OUTPUTS IN A MULTICHANNEL RECEIVER OPTICAL SUBASSEMBLY

A multi-channel receiver optical subassembly (ROSA) such as an arrayed waveguide grating (AWG), with outputs directly optically coupled to respective photodetectors such as photodiodes. In one embodiment, an AWG may be configured such that optical components of the AWG do not interfere with direct optical coupling, and the wire bonding points on the photodiodes may also be configured such that wire bonding does not interfere with direct optical coupling. The photodetectors may also be mounted on a photodetector mounting bar with a pitch sufficiently spaced to allow connection to floating grounds. A passive alignment technique may be used to determine the mounting locations on the photodetector mounting bar such that the photodetectors are aligned with the optical outputs. 1. A method of aligning photodetectors to optical outputs of an optical demultiplexer in a multi-channel receiver optical subassembly (ROSA) , the method comprising:mounting an optical demultiplexer on a ROSA housing base portion, wherein the optical demultiplexer includes alignment markings indicating locations of optical outputs of the optical demultiplexer along a first axis, wherein the optical demultiplexer is spaced from a photodetector mounting bar;measuring at least first and second distances from the ROSA housing base portion to the optical demultiplexer at respective first and second sides of the optical demultiplexer;displaying an alignment line on the photodetector mounting bar for indicating a photodetector position along a second axis, the alignment line extending between first and second points on the photodetector mounting bar corresponding to the first and second distances measured at the first and second sides of the optical demultiplexer; andmounting photodetectors on the photodector mounting bar, wherein each of the photodectors is aligned along the first axis with the one of the alignment markings and aligned along the second axis with the alignment line such that the ...

Edge construction on optical devices

A method of forming an optical device includes forming a waveguide mask on a device precursor. The device precursor includes a waveguide positioned on a base. The method also includes forming a facet mask on the device precursor such that at least a portion of the waveguide mask is between the facet mask and the base. The method also includes removing a portion of the base while the facet mask protects a facet of the waveguide. The portion of the base that is removed can be removed such that a recess is defined in the base and/or a shelf is defined on the device precursor. A light source such as an optical fiber or laser can be received in the recess and/or positioned over the shelf such that the light source is optically aligned with the facet of the waveguide.

OPTICAL CONNECTOR AND METHOD FOR PRODUCING OPTICAL CONNECTOR

An optical connector includes an optically-transparent substrate, a first optical component mounted on a first surface of the substrate, and a second optical component mounted on a second surface of the substrate. The substrate includes a marker that is formed on one of the first surface and the second surface and recognizable from the other one of the first surface and the second surface. 1. An optical connector , comprising:an optically-transparent substrate;a first optical component mounted on a first surface of the substrate; anda second optical component mounted on a second surface of the substrate,wherein the substrate includes a marker that is formed on one of the first surface and the second surface and recognizable from another one of the first surface and the second surface.2. The optical connector as claimed in claim 1 , further comprising:a metal film formed on the substrate,wherein the marker is formed in the metal film.3. The optical connector as claimed in claim 2 , whereinan opening having a width that is wider than a width of the marker is formed in the substrate at a position corresponding to the marker.4. The optical connector as claimed in claim 1 , whereinthe first optical component is an optical device;the second optical component is an optical waveguide; andthe optical device and the optical waveguide are optically connected to each other via a light passage formed in the substrate.5. A method for producing an optical connector claim 1 , the method comprising:forming a marker and a positioning part in a first surface of an optically-transparent substrate by using a same mask;forming a light passage in the substrate with reference to the positioning part; andmounting a first optical component on the first surface of the substrate and mounting a second optical component on a second surface of the substrate with reference to the marker such that the first optical component and the second optical component are optically connected to each other via ...

MULTI-CHANNEL RECEIVER OPTICAL SUB-ASSEMBLY AND MANUFACTURING METHOD THEREOF

Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded. 1. A multi-channel receiver optical sub-assembly comprising:a PLC (Planar Lightwave Circuit) chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle;a PD (Photo-Diode) carrier bonded onto the PLC chip and made of a glass material; andan SI-PD (Surface-Illuminated Photo-Diode) bonded onto the PD carrier, a lens being integrated therein,wherein the PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.2. The multi-channel receiver optical sub-assembly according to claim 1 , wherein the PLC chip is an AWG (Arrayed Waveguide Grating) PLC chip or a PLC chip on which a multi-channel straight waveguide is formed.3. The multi-channel receiver optical sub-assembly according to claim 1 , wherein the PLC chip further comprises a metal coated layer formed on the inclined surface.4. The multi-channel receiver optical sub-assembly according to claim 3 , wherein the metal coated layer comprises any one of Cr/Au claim 3 , Cr/Ni/Au claim 3 , and Ti/Pt/Au.5. The multi-channel receiver optical sub-assembly according to claim 1 , wherein the PD carrier comprises any one of quartz claim 1 , sodalime glass claim 1 , and BK7 glass.6. The multi- ...

OPTOELECTRONIC DEVICE WITH A SUPPORT MEMBER

Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member. 3. The optoelectronic device of claim 1 , wherein the support member is dimensioned to straddle opposing sides of the interposer.5. The optoelectronic device of claim 1 , wherein the optical component comprises a lens and wherein the optical socket aligns the ferrule and the lens when the ferrule is received therein and the optical socket is mounted on the substrate.6. The optoelectronic device of claim 1 , wherein the substrate is disposed over a circuit board and the support member is bonded to the circuit board.7. The optoelectronic device of claim 1 , wherein the support member is constructed out of one or more of sheet metal claim 1 , plastic claim 1 , or a material able to withstand multiple solder reflow temperature cycles.8. The optoelectronic device of claim 1 , wherein the optical socket is removable from the support member without damaging one or both of the optical interposer and optical component.9. The optoelectronic device of claim 1 , wherein the support member is soldered to the substrate or adhered to the substrate with an adhesive.10. The optoelectronic device of claim 1 , wherein the support member is adhered to the optical socket with an adhesive or bonded to the optical socket by localized melting of a portion of the socket or support member.11. The optoelectronic device of claim 1 , wherein the support member comprises a substantially U-shaped ...

OPTICAL WAVEGUIDE MODULE

An optical waveguide module includes an optical waveguide sheet including multiple optical waveguides, and a light-emitting device and a light-receiving device each positioned over a surface of the optical waveguide sheet. At least one of the optical waveguides includes a first mirror, a second mirror, and a slit. The first mirror is configured to reflect light entering the corresponding optical waveguide from its first end to the light-receiving device or to reflect light emitted from the light-emitting device toward the first end of the corresponding optical waveguide. The second mirror is configured to reflect light entering the corresponding optical waveguide from its second end toward the surface of the optical waveguide sheet. The slit is provided between the second mirror and the second end of the corresponding optical waveguide. The corresponding optical waveguide is discontinuous across the slit. 1an optical waveguide sheet including a plurality of optical waveguides;a light-emitting device positioned over a surface of the optical waveguide sheet;a light-receiving device positioned over the surface of the optical waveguide sheet;a mirror formed in at least one of the plurality of optical waveguides, the mirror being configured to reflect light propagating through the optical waveguide toward the surface of the optical waveguide sheet; anda recognition mark provided on the mirror.. An optical waveguide module, comprising: The present application is a division of U.S. patent application Ser. No. 15/012,987, filed on Feb. 2, 2016, which is based upon and claims priority to Japanese Patent Application No. 2015-022621, filed on Feb. 6, 2015. The disclosures of the prior applications are hereby incorporated herein in their entirety by reference.1. Field of the InventionThe present invention relates to optical waveguides.2. Description of the Related ArtOptical waveguide modules for optical communications, in which a light-emitting device and a light-receiving ...

Wavelength division multi-channel optical module and manufacturing method thereof

Provided herein is an optical module including: an optical receptacle including a first lens and a second lens; a lens module including a lens unit facing the second lens of the optical receptacle; and an optical element configured to receive a beam emitted from the lens module or form a beam to be emitted to the lens module. A horizontal length and a vertical length of a cross-section of the first lens may differ from each other, and a horizontal length and a vertical length of a cross-section of the second lens may differ from each other.

METHOD FOR III-V/SILICON HYBRID INTEGRATION

A method of transfer printing. The method comprising: providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region; providing a transfer die, said transfer die including one or more alignment marks; aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; and bonding at least a part of the transfer die to the bonding region. 1. A method of transfer printing , comprising:providing a precursor photonic device, comprising a substrate and a bonding region, wherein the precursor photonic device includes one or more alignment marks located in or adjacent to the bonding region;providing a transfer die, said transfer die including one or more alignment marks;aligning the one or more alignment marks of the precursor photonic device with the one or more alignment marks of the transfer die; andbonding at least a part of the transfer die to the bonding region.2. The method of claim 1 , wherein the precursor photonic device claim 1 , or the transfer die claim 1 , or both claim 1 , include one or more metal patches covering the respective alignment marks.3. The method of claim 2 , wherein the at least one or more alignment marks located in or adjacent to the bonding region or the at least one of the one or more alignment marks included in the transfer die claim 2 , or both claim 2 , include one or more trenches etched to surround the alignment marks and covered by the metal patch.4. The method of any preceding claim claim 2 , wherein the precursor photonic device includes a first waveguide and the transfer die includes a second waveguide claim 2 , and claim 2 , once bonded claim 2 , an interface between the first waveguide and the second waveguide is angled relative to a guiding direction of the first waveguide or second waveguide.5. The method of claim 4 , wherein ...

TRANSMITTING OPTICAL MODULE IMPLEMENTING OPTICAL WAVEGUIDE DEVICE

A transmitting optical module that includes multi-laser diode (LDs) and a planar lightwave circuit (PLC) to multiplex optical beams each output from the optical sources is disclosed. The PLC is mounted on a carrier through a WG carrier in upside down arrangement. The LDs are also mounted on the carrier through an LD carrier. The LDs and the PLC are optical coupled with two lenses each having respective optical axes offset from the other such that the optical coupling of the optical beam inputting the PLC becomes a maximum. 1. An optical module , comprising:a laser diode (LD) that outputs an optical beam;a waveguide device including an optical waveguide in a primary surface thereof, optical waveguide optically coupling with the LD; anda carrier that mounts the waveguide device as interposing a waveguide (WG) carrier and the LD as interposing laser diode (LD) carrier,wherein the waveguide device is mounted on the WG carrier as a surface thereof providing the optical waveguide faces the WG carrier.2. The optical module of claim 1 ,wherein the WG carrier has a mark aligned with the optical waveguide of the waveguide device, the mark being provided in a bottom surface of the carrier, the bottom surface being opposite to a surface facing and in contact to the primary surface of the waveguide device.3. The optical module of claim 2 ,wherein the LD is optically coupled with the waveguide device through a first lens and a second lens, the first lens being disposed closer to the LD and the second lens being disposed closer to the waveguide device, andwherein the first lens has an optical axis vertically offset from an optical axis of the second lens.5. The optical module of claim 3 ,wherein the first lens makes a gap against the carrier equal to a gap between the second lens and the carrier.6. The optical module of claim 3 ,wherein the first lens is a collimating lens that collimates an optical beam output from the LD and the second lens is a concentrating lens that ...

HYBRID INTEGRATION OF EDGE-COUPLED CHIPS

A technique for fabricating a hybrid optical source is described. During this fabrication technique, a III-V compound-semiconductor active gain medium is integrated with a silicon-on-insulator (SOI) chip (or wafer) using edge coupling to form a co-planar hybrid optical source. Using a backside etch-assisted cleaving technique, and a temporary transparent substrate with alignment markers, a III-V compound-semiconductor chip with proper edge polish and coating can be integrated with a processed SOI chip (or wafer) with accurate alignment. This fabrication technique may significantly reduce the alignment complexity when fabricating the hybrid optical source, and may enable wafer-scale integration. 1. A method for fabricating a co-planar hybrid optical source , wherein the method comprises:disposing a temporary substrate having alignment markers on a first optical device having a first semiconductor substrate, wherein the alignment markers are aligned with a first optical waveguide in the first optical device;attaching a second optical device having a second semiconductor substrate to the temporary substrate, wherein the alignment markers are used to align the first optical waveguide with a second optical waveguide in the second optical device, and wherein the second semiconductor substrate is different than the first semiconductor substrate;coupling the first optical device and the second optical device to a substrate; andremoving the temporary substrate.2. The method of claim 1 , wherein the temporary substrate includes one of:photoresist, and epoxy.3. The method of claim 1 , wherein the temporary substrate is optically transparent.4. The method of claim 1 , wherein the first optical waveguide is optically butt coupled to the second optical waveguide.5. The method of claim 1 , wherein at least one of the first optical waveguide and the second optical waveguide includes a spot-size converter to expand an optical mode of an optical signal conveyed in the first optical ...

METHOD FOR MANUFACTURING ACTIVE OPTICAL CABLE

A method for manufacturing an active optical cable comprises (a) flip-chip packaging chips onto a circuit board to form a OE circuit board, (b) integrating the OE circuit board onto an optical bench to form a OE bench, (c) integrating the OE bench onto a printed circuit board to form a OE module, (d) molding encapsulant onto the OE bench, (e) coupling a hybrid cable onto the OE module, and (f) utilizing low temperature, low pressure injection molding process to form the active optical cable. 1. A method for manufacturing an active optical cable , comprising:flip-chip packaging a chip on a circuit board to form an optoelectronic circuit board;configuring said optoelectronic circuit board on an optical bench to form an optoelectronic bench;configuring said optoelectronic bench on a printed circuit board to form an optoelectronic module;encapsulating said optoelectronic module by an encapsulant; andengaging optical fibers or an opto-electric cable with said optoelectronic module to form a photoelectric conversion assembly.2. The method of claim 1 , wherein said photoelectric module comprises:said circuit board having conductive trace formed on said circuit board;at least one optical element flip-chip configuring on said circuit board to couple to said conductive trace of said circuit board; andsaid optical bench having a first configuration region for supporting said printed circuit board and a second configuration region for supporting said circuit board;wherein said optical bench includes at least one lens array and a mirror, wherein one of said at least one lens array is configured to align said at least one optical element.3. The method of claim 2 , wherein said at least one optical element is a light source chip claim 2 , a photo diode chip claim 2 , a photo detector chip or a photosensitive chip.4. The method of claim 1 , wherein said opto-electric cable is composed of optical fibers and electrical wires claim 1 , wherein said optical fibers are coupled to said ...

PASSIVE ALIGNMENT OPTICAL CONNECTOR

A system, apparatus, or method may include an optical connector that is configured to be fixed to a substrate including an optical waveguide. The substrate may also include a reference mark spaced away from the optical waveguide and extending from a substrate edge. The optical connector may define a first alignment aperture and a second alignment aperture through which the optical connector may be aligned with the substrate (e.g., the optical waveguide). The first alignment aperture may be configured to be aligned with the reference mark and the second alignment aperture may be configured to be aligned with the substrate edge. 1. A system comprising:a substrate comprising an optical waveguide extending along a longitudinal direction from a substrate edge and a reference mark spaced away from the optical waveguide and extending from the substrate edge; andan optical connector defining a first alignment aperture and a second alignment aperture, and the optical connector defining a top surface and a bottom surface opposing the top surface, each of the first and second alignment apertures define a bottom opening at the bottom surface and a top opening at the top surface, the first alignment aperture is configured to be aligned with the reference mark and the second alignment aperture is configured to be aligned with the substrate edge.2. The system of claim 1 , wherein the first alignment aperture defines a first alignment center point and the reference mark intersects the substrate edge to define an intersection claim 1 , wherein the first alignment center point is configured to be aligned with the intersection.3. The system of claim 1 , wherein the bottom surface faces the substrate claim 1 , wherein a bottom diameter of the bottom opening is smaller than a top diameter of the top opening.4. The system of claim 3 , wherein the optical connector comprises a first lens positioned in the first alignment aperture on or adjacent the top surface and a second lens positioned ...

Systems, devices, and methods for improved optical waveguide transmission and alignment

Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed.

Method for forming a package structure for optical fiber

A method for forming a package structure is provided. The method includes disposing an optical component and a waveguide over a substrate, forming a passivation layer over the substrate and covering the optical component and the waveguide, and forming a reflector including a metal layer and a first semiconductor layer on the passivation layer, wherein the metal layer and the first semiconductor layer are in contact with the passivation layer.

PHOTONIC INTERFACE FOR ELECTRONIC CIRCUIT

A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit. 1. A photonic interface assembly configured to provide communication between an optical fiber and an electronic circuit , the photonic interface assembly comprising:a printed circuit board (PCB) including a first electrical port, and a first electrical connection electrically connected to the first port for electrically connecting to the electronic circuit; an optical port for optically coupling to the optical fiber for outputting a first optical signal;', 'a second electrical connection electrically connected to the first electrical port for receiving a first electrical signal from the electronic circuit; and', 'at least one of a laser and an optical modulator electrically connected to the second electrical connection configured for modulating an optical carrier wave with the first electrical signal to provide the first optical signal., 'a photonic integrated circuit mounted on the PCB comprising2. The photonic interface assembly according to claim 1 , further comprising a fiber support mounted on the photonic integrated circuit for optically aligning the optical fiber with the optical port.3. The photonic interface assembly according to claim 1 , wherein the photonic integrated circuit comprises a silicon photonic chip.4. The photonic interface assembly according to claim 2 , wherein the fiber support includes at least one groove of holding the optical fiber in a defined location.5. The photonic interface assembly according to claim 4 , wherein ...

Optical axis adjustment method for optical interconnection, and optical interconnection substrate

An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores.

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC. 1. An optical apparatus comprising:an optical interface unit;a substrate; anda photonic integrated circuit between the optical interface unit and the substrate, the photonic integrated circuit having a first side connected to the substrate and a second side that is opposite of the first side that is connected to the optical interface unit, the first side of the photonic integrated circuit comprising an alignment feature that is offset from a light emitter pathway in the photonic integrated circuit that transmits light from a light emitter through the photonic integrated circuit to the optical interface unit, the photonic integrated circuit further comprising a hole extending from the first side to provide a line of sight to the alignment feature via the second side that is connected to the optical interface unit, the alignment feature offset from the light emitter by a predetermined distance value.2. The optical apparatus of claim 1 , wherein the photonic integrated circuit comprises an additional alignment feature that is smaller in size than the alignment feature claim 1 , the photonic ...

OPTICAL WAVEGUIDE MODULE

An optical waveguide module includes an optical waveguide sheet including multiple optical waveguides, and a light-emitting device and a light-receiving device each positioned over a surface of the optical waveguide sheet. At least one of the optical waveguides includes a first mirror, a second mirror, and a slit. The first mirror is configured to reflect light entering the corresponding optical waveguide from its first end to the light-receiving device or to reflect light emitted from the light-emitting device toward the first end of the corresponding optical waveguide. The second mirror is configured to reflect light entering the corresponding optical waveguide from its second end toward the surface of the optical waveguide sheet. The slit is provided between the second mirror and the second end of the corresponding optical waveguide. The corresponding optical waveguide is discontinuous across the slit. 1. An optical waveguide module , comprising:an optical waveguide sheet including a plurality of optical waveguides;a light-emitting device positioned over a surface of the optical waveguide sheet; anda light-receiving device positioned over the surface of the optical waveguide sheet,wherein 'a first mirror configured to reflect light entering the corresponding optical waveguide from a first end thereof to the light-receiving device or to reflect light emitted from the light-emitting device toward the first end of the corresponding optical waveguide;', 'at least one of the plurality of optical waveguides includes'} 'a slit provided between the second mirror and the second end of the corresponding optical waveguide, wherein the corresponding optical waveguide is discontinuous across the slit.', 'a second mirror configured to reflect light entering the corresponding optical waveguide from a second end thereof opposite to the first end toward the surface of the optical waveguide sheet; and'}2. An optical waveguide module , comprising:an optical waveguide sheet ...

OPTICAL MODULE IMPLEMENTING WITH OPTICAL SOURCE, OPTICAL MODULATOR, AND WAVELENGTH DETECTOR, AND A METHOD TO ASSEMBLE THE SAME

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination. 119.-. (canceled)20. An optical module , comprising:an optical source mounted on a first thermo-electric cooler (TEC) as interposing a first carrier therebetween, the optical source generating a continuous wave (CW) beam, the first carrier providing marks thereon;an optical modulator mounted on a second TEC as interposing a base therebetween, the second TEC being independent of the first TEC, the optical modulator modulating the CW beam; andan input unit configured to couple the CW beam with the optical modulator, the input unit being mounted on the base as interposing a second carrier therebetween, the second carrier providing marks thereon,wherein the marks on the second carrier for the input unit are aligned with the marks on the first carrier for the optical source.21. The optical module of claim 20 ,wherein the second carrier PM for the input unit provides the marks thereof in a side facing the optical source, and the first carrier for the optical source provides the marks thereof in a side facing the input unit.22. The optical module of claim 20 ,wherein the marks on the first carrier for the optical source and the ...

OPTICAL MODULE IMPLEMENTING WITH OPTICAL SOURCE, OPTICAL MODULATOR, AND WAVELENGTH DETECTOR, AND A METHOD TO ASSEMBLE THE SAME

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination. 1. A process of assembling an optical module that installs a laser unit , a modulator unit , and a detector unit enclosed within a housing , the laser unit including a semiconductor laser diode (LD) having a front facet that outputs a first continuous wave (CW) beam and a rear facet that outputs a second CW beam , the modulator unit that modulates the first continuous wave (CW) beam and includes an input unit and an output unit , the detector unit that determines a wavelength of the second CW beam , the housing including a first output port and a second output port , the method comprising steps of:installing a first thermo-electric cooler (TEC), a second TEC, and a third TEC within the housing;mounting the laser unit on the first TEC, the modulator unit on the second TEC, and the detector unit on the third TEC, respectively;optically coupling one of the first CW beam with the first output port of the housing through the modulator unit and the second CW beam with the second output port of the housing through the detector unit: andoptically coupling another of the first CW beam with the first output port of the housing ...

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC. 1. An optical apparatus comprising:an optical interface unit; anda photonic integrated circuit (PIC) including an emitter and an alignment feature on a first side of the PIC, the optical interface unit disposed on a second side of the PIC that is opposite of the first side, the emitter to emit light through the PIC out of the second side to the optical interface unit, the alignment feature offset from the emitter on the first side by a predetermined distance value.2. The optical apparatus of claim 1 , wherein the PIC comprises a processing feature to image the alignment feature from the second side.3. The optical apparatus of claim 2 , wherein the processing feature of the PIC comprises a hole etched to provide a line of sight to the alignment feature via the bottom side of the PIC.4. The optical apparatus of claim 3 , wherein the hole comprises an air gap and is further aligned with one or more components of the PIC to provide thermal isolation to the one or more components.5. The optical apparatus of claim 3 , further comprising:a spacer material to fill the hole of the PIC.6. The ...

OPTICAL DIELECTRIC WAVEGUIDE SUBASSEMBLY STRUCTURES

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers. 1. An optical subassembly comprisinga substrate; a repeated stack of two or more SiON layers, wherein the two or more layers comprise layers having different indexes of refraction,', 'wherein each layer of the buffer layer and the layers of the repeated stack comprises a stoichiometry of Si, O, and N to provide a stress having a magnitude less than or equal to 20 MPa,', 'wherein each layer of the buffer layer and the layers of the repeated stack comprises a level of impurity or a level of homogeneity to provide an optical loss less than or equal to 1 dB/cm.', 'wherein a patterning of the buffer layer and the repeated stack to form the waveguide comprises a level of uniformity to provide an optical loss less than or equal to 1 dB/cm;, 'a waveguide disposed on the substrate, wherein the waveguide comprises a buffer layer comprising SiON;'}a device aligned with the waveguide.2. An optical subassembly as inwherein the substrate comprises etched visual fiducials or stop features for alignment of the device.3. An optical sub-assembly as inwherein the substrate comprises a fiducial or a mechanical feature to provide a reference for the coupling of the ...

SYSTEMS, DEVICES, AND METHODS FOR IMPROVED OPTICAL WAVEGUIDE TRANSMISSION AND ALIGNMENT

Provided herein are systems, devices, and methods for improved optical waveguide transmission and alignment in an analytical system. Waveguides in optical analytical systems can exhibit variable and increasing back reflection of single-wavelength illumination over time, thus limiting their effectiveness and reliability. The systems are also subject to optical interference under conditions that have been used to overcome the back reflection. Novel systems and approaches using broadband illumination light with multiple longitudinal modes have been developed to improve optical transmission and analysis in these systems. Novel systems and approaches for the alignment of a target waveguide device and an optical source are also disclosed. 157-. (canceled)58. A system for optical analysis , the system comprising:an optical source, the optical source configured to emit an optical excitation beam into free space, and at least one optical coupler, the at least one optical coupler configured to receive the optical excitation beam through free space from the optical source;', 'at least one optical waveguide, the at least one optical waveguide comprising a first end; wherein the first end of the optical waveguide is configured to receive an optical excitation signal from the at least one optical coupler;', 'at least one reaction region, the at least one reaction region optically coupled to the at least one waveguide; and', 'at least one detector region, the at least one detector region optically coupled to the at least one reaction region and configured to detect an optical alignment signal from the at least one reaction region;, 'a removable target waveguide device, comprisingwherein either the target waveguide device or the optical excitation beam is movable relative to other; andwherein the system is configured to monitor the optical alignment signal and to move either the target waveguide device or the optical excitation beam relative to one another to increase the optical ...

Method of adjusting the parallelism of a fiber block with a chip surface

A method of adjusting the parallelism of a surface of a block of optical fibers with a surface of a semiconductor chip or wafer laid on an XY table, including the steps of: a) providing a sensor rigidly attached to the XY table and a handling arm supporting the block, said surface facing the XY table; b) for each of three non-aligned points of the surface of the block, displacing with respect to each other the XY table and the block in the X and/or Y directions to place the sensor opposite the point, and estimating, with the sensor, the distance along the Z direction between the point and the sensor; and c) modifying the orientation of the block by means of the handling arm to provide the desired parallelism.

Photonic interface for electronic circuit

A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.

OPTO-ELECTRIC HYBRID BOARD AND PRODUCTION METHOD THEREFOR

An opto-electric hybrid board according to the present invention includes a substrate including an insulation layer and a metal reinforcement layer. An electric circuit part is provided on the front surface of the substrate, and an optical waveguide part is provided on the back surface thereof. The metal reinforcement layer includes an optical coupling through hole and an alignment through hole. The electric circuit part includes an electrical interconnect line, an optical element, a first alignment mark for positioning of a mirror part, and a second alignment mark for positioning of the optical element. The mirror part of the optical waveguide part is positioned with respect to the first alignment mark visually recognized through the alignment through hole, and the optical element of the electric circuit part is positioned with respect to the second alignment mark. 1. An opto-electric hybrid board comprising:a substrate including an insulation layer having transparency and a metal reinforcement layer provided on the back surface of the insulation layer;an electric circuit part formed on the front surface of the substrate; andan optical waveguide part formed on the back surface of the substrate,wherein the metal reinforcement layer includes an optical coupling through hole,wherein the electric circuit part includes an electrical interconnect line including an optical element mounting pad and an optical element mounted on the pad,wherein the optical waveguide part includes an optical waveguide and a mirror part for optical coupling, the optical waveguide including an under cladding layer having transparency, a core for an optical path, and an over cladding layer having transparency,wherein the optical element on the front surface of the substrate and the optical waveguide on the back surface of the substrate are optically coupled to each other through the mirror part,wherein a first alignment mark for positioning of the mirror part and a second alignment mark for ...

MIRROR DEVICE WITH VISUAL INDICATOR TO ENABLE IDENTIFICATION OF HIGHLY-REFLECTIVE REGION TO ENSURE CORRECT ORIENTATION OF THE SAME WHEN DISPOSED IN AN OPTICAL SUBASSEMBLY

A mirror device for use in an optical subassembly is disclosed that includes at least one surface with a visible indicator to allow a technician to differentiate a highly-reflective surface from relatively less reflective (e.g., un-coated) surfaces. The mirror device may be formed using known approaches, such as through the deposition of a metallic material on to a surface of the mirror device followed by one or more optional coating layers. Before, or after, forming the highly-reflective surface, a visual indicator may be introduced on to a surface of the mirror device that is opposite the highly-reflective surface. The visual indicator may comprise, for example, random scratches/scoring etched from a wire brush or tool, paint, epoxy, ink, or any other indicator that allows a technician to visually differentiate the portion of the mirror device having the visual indicator from the highly-reflective portion. 1. A mirror device for use in an optical subassembly module , the mirror device comprising:an opaque base portion providing a first surface opposite a second surface;a layer of metallic material disposed on the first surface of the base portion to provide a highly-reflective surface to reflect at least a portion of incident channel wavelengths; anda visual indicator disposed on the second surface of the base portion to indicate a position of the highly-reflective surface.2. The mirror device of claim 1 , wherein the highly-reflective surface has a reflectivity of at least 98% percent for associated channel wavelengths.3. The mirror device of claim 1 , wherein the visual indicator causes the second surface to have an overall reflectivity that is less than the overall reflectivity of the highly-reflective surface.4. The mirror device of claim 1 , wherein the visual indicator comprises a plurality of random scratches disposed on the second surface.5. The mirror device of claim 1 , wherein the visual indicator comprises a primary marking and a second marking claim 1 ...

Optical fiber splicing tray

An optical fiber splicing tray is disclosed. The optical fiber splicing tray may include: an optical fiber splicing tray body; and a marker detachably connected to the optical fiber splicing tray body, where the marker is arranged at a position facilitating observation and identification of the marker when a plurality of optical fiber splicing trays are stacked.

OPTICAL INTERCONNECTION SUBSTRATE

An optical axis adjustment method for optical interconnection, includes: providing, on a substrate, an optical transmitter including light sources and a mark for acquiring a position of each of the light sources; providing, on the substrate, an optical waveguide including cores each allowing light emitted from the respective light sources to propagate through the core; determining a first position based on the mark as a position of each of the light sources; and forming, at a second position in the optical waveguide corresponding to the first position, first mirrors configured to reflect the light emitted from the respective light sources and make the light propagate through the respective cores. 110-. (canceled)11. An optical interconnection substrate comprising:a substrate;an optical transmitter provided on the substrate and including light sources and a mark for acquiring a position of each of the light sources;an optical waveguide provided on the substrate and including cores each allowing light emitted from the respective light sources to propagate through the core; andfirst mirrors each formed at a second position which is in the optical waveguide and corresponds to a first position based on the mark, and configured to reflect light emitted from the respective light sources and make the light propagate through the respective cores.12. The optical interconnection substrate according to claim 11 , wherein the mark is a dummy pattern formed together with a wiring pattern of each of the light sources.13. The optical interconnection substrate according to claim 11 , wherein the substrate has a cavity at a position corresponding to at least one of the light sources.14. The optical interconnection substrate according to claim 11 , further comprising:an optical receiver provided on the substrate and including light receiving units each configured to receive light propagated through the respective cores; anda second mirror formed in the optical waveguide and configured ...

CALIBRATION VALIDATION IN GALVANOMETRIC SCANNING SYSTEMS

Some embodiments may include a method of generating assessment data in a system including a galvanometric scanning system (GSS) having a laser device to generate a laser beam and an X-Y scan head module to position the laser beam on a work piece. The method may include selecting a dimension based on a desired accuracy for validation (and/or a characteristic of an imaging system in embodiments that utilize an imaging system). The method may include commanding the GSS to draw a mark based on a polygon or ellipse of the selected dimension around a predetermined target point associated with the work piece to generate assessment data, and following operation of the GSS based on said commanding, validating a calibration of the GSS using the assessment data (or an image thereof in embodiments that utilize an imaging system). Other embodiments may be disclosed and/or claimed.

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC. 1. (canceled)2. A device , comprising:a photonic integrated circuit having a first side and a second side opposite the first side;an optical interface positioned on the first side;an electrical interface positioned proximate the second side to electrically couple the photonic integrated circuit to a substrate;a light emitter positioned on the second side to emit light through the photonic integrated circuit to the optical interface; andan alignment feature corresponding to the light emitter and formed with the light emitter, the alignment feature being offset from the light emitter by a predetermined distance and configured to align the light emitter with the optical interface.3. The device of claim 2 , wherein the alignment feature and the light emitter are formed during a same processing step.4. The device of claim 2 , wherein the alignment feature and the light emitter are positioned on the second side of the photonic integrated circuit.5. The device of claim 2 , wherein the alignment feature is a visual marker positioned on the second side of the photonic integrated circuit and visible ...

BIDIRECTIONAL OPTICAL TRANSCEIVER MODULE

A compact bidirectional optical transceiver module is provided that has a bidirectional optical subassembly (BOSA) that includes a stamped metal optic that folds the optical pathway, alignment features that enable the optoelectronic components of the electrical subassembly (ESA) to be precisely aligned with the BOSA in all dimensions, and features that reduce the capacitance of the driver circuitry to improve signal integrity and widen the eye opening. 1. A bidirectional optical transceiver module , comprising:a module housing comprising an upper body portion and a lower body portion, the lower body portion including a metal leadframe having a stamped optic formed therein;a module circuit board secured to the metal leadframe;a first integrated circuit (IC) chip mounted on a surface of the circuit board and electrically interconnected with the circuit board;a cathode-driven laser disposed within the module housing in alignment with the stamped metal optic, the cathode-driven laser being electrically coupled with the first IC chip;at least a first photodetector disposed within the module housing, the first photodetector being electrically coupled with the first IC chip; anda bidirectional optical subassembly (BOSA) disposed within the upper body portion in alignment with the first photodetector and the stamped metal optic, the BOSA being optically aligned with the stamped metal optic and being configured to direct light output by the cathode-driven laser and directed to the BOSA by the stamped metal optic into an end of an optical waveguide held in a receptacle of the module housing and to direct light passing out of the end of the optical waveguide onto a light-receiving surface of the first photodetector.2. The bidirectional optical transceiver module of further comprising:a submount device mounted on a surface of the metal lead frame, wherein the cathode-driven laser is mounted on the submount device.3. The bidirectional optical transceiver module of claim 1 , ...

Optical receiver with photodiode disposed directly on a planar lightwave circuit

An optical receiver may include a planar lightwave circuit with an optical path and a tapered reflection surface to direct an optical beam toward a top surface of the planar lightwave circuit. The optical receiver may include a photodiode disposed onto the top surface of the planar lightwave circuit such that a receive portion of the photodiode is aligned to the optical path, wherein a gap between the photodiode and the planar lightwave circuit is less than 5 microns.

OPTICAL MODULE IMPLEMENTING WITH OPTICAL SOURCE, OPTICAL MODULATOR, AND WAVELENGTH DETECTOR, AND A METHOD TO ASSEMBLE THE SAME

An optical module and a method of assembling the optical module are disclosed. The optical module comprises a laser unit, a modulator unit, and a detector unit mounted on respective thermo-electric coolers (TECs). The modulator unit, which is arranged on an optical axis of the first output port from which a modulated beam is output, modulates the continuous wave (CW) beam output from the laser unit. On the other hand, the laser unit and the detector unit are arranged on another optical axis of the second output port from which another CW beam is output. The method of assembling the optical module first aligns one of the first combination of the laser unit and the modulator unit with the first output port and the second combination of the laser unit and the detector unit, and then aligns another of the first combination and the second combination. 127.-. (canceled)28. An optical module comprising:an optical source that generates a beam with an optical axis;an optical component optically coupled with the optical source, the optical component having another optical axis offset from the optical axis of the beam;a housing having a bottom, the housing being configured to dispose the optical source and the optical component on the bottom thereof; anda beam shifter interposed between the optical source and the optical component, wherein the beam shifter aligns the optical axis of the beam measured from the bottom of the housing with the another optical axis of the optical component measured from the bottom of the housing29. The optical module of claim 28 ,further comprising a collimating lens configured to collimate the beam output from the optical source,wherein the beam shifter levels an optical axis of a collimated beam output from the collimating lens measured from the bottom of the housing to the another optical axis of the optical component measured from the bottom of the housing.30. The optical module of claim 28 ,further comprising a concentrating lens disposed ...

SILICA-ON-SILICON-BASED HYBRID INTEGRATED OPTOELECTRONIC CHIP AND MANUFACTURING METHOD THEREFOR

Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (), wherein the surface of the silicon substrate () is provided with a platform (), lug bosses () and a groove (); a silica waveguide element () is arranged in the groove (), the lug bosses () are protruded from the surface of the platform (), and the surface of the platform () is provided with a discontinuous metal electrode layer (); and the surface of the metal electrode layer () is provided with solder bumps (), and an active optoelectronic chip () is arranged above the solder bumps () and the lug bosses (). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas () is manufactured between the alignment lug bosses (). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips. 1. A silica-on-silicon-based hybrid integrated optoelectronic chip , characterized in that it comprises a silica substrate , the surface of the silicon substrate is provided with a platform , lug bosses and a groove , a silica waveguide element is arranged in the groove , the lug bosses are protruded from the surface of the platform , the surface of the platform is provided with a discontinuous metal ...

Optoelectronic module for a contactless free-space optical link, associated multichannel modules, associated interconnection system, method of production and connection to a board

An optoelectronic module, intended to provide a conversion of an electrical signal from an electronic board into an optical signal propagated in free space or vice versa, includes the following stack: an electronic board, intended to act as an interface with an electronic application board; an electronic control component suitable for controlling an optoelectronic component, the electronic component being attached directly onto the electronic board and electrically connected to the electronic circuit; an optoelectronic component suitable for transmitting or receiving a light signal via its upper surface, the optoelectronic component being attached directly on the top of the electronic control component and electrically connected to the electronic component; an optical device suitable for transmitting an optical signal; an optical device support, the support being attached, preferably by gluing or brazing, directly onto the electronic board so as to ensure the mechanical alignment between the optical device and the optoelectronic component.

Compact fiber pigtailed terahertz modules

An industrially hardened terahertz electromagnetic transmitter and receiver module ( 29 ) is disclosed. The electromagnetic wave module has an optic ( 30 ) which relays an optical pulse from the delivery fiber ( 32 ) to the terahertz device. The relay optic ( 30 ) allows for a greatly reduced optical spot size as compared to the output of the optical fiber. Thus, the sensitivity of the overall system is enhanced by improving the efficiency of the terahertz device. The relay optic ( 30 ) allows the small spot of light to be aligned to the electromagnetic transmitter or receiver with sub-micron precision.

Coaxial laser weld through the lid of a photonics package

A process for fabricating a photonics package includes securing a ferrule to an optical fiber, inserting the ferrule through a movable flange into a photonics housing containing a photodiode, adjusting the ferrule longitudinally within the flange to position the end of the optical fiber with respect to the surface of the photodiode and welding the ferrule to the flange. Thereafter, the ferrule and flange assembly is adjusted laterally with respect to the photodiode and the lower end of the flange is secured to the housing using hot gas injection or laser soldering which allows lateral adjustment of the fiber during the solder cooling process for final positioning with respect to the photodiode.

Mold and method of producing the same

(1) Alignment mark transfer portion(s) is/are formed on the transfer molding surface of a mold that is used for press-molding a optical element fixing member and having alignment marks; (2) alignment mark(s) is/are formed on the mold material by dry-etching, and the mold material is worked using the alignment mark(s) as a reference to form the transfer molding surface constituted by a plurality of transfer patterns, in order to obtain a mold for press-molding; and (3) the transfer patterns are formed by dry-etching, or a transfer molding bare surface for transfer patterns is formed by dry-etching and a mold release film is formed thereon to reflect the shape of the transfer molding base surface, in order to obtain a mold for press-molding.

Methods and apparatus to mount a waveguide to a substrate

Methods and apparatus to mount an optical waveguide to a substrate are disclosed. A disclosed method involves providing a substrate having a first layer and a second layer. The first layer includes at least one alignment fiducial and the second layer covers the at least one fiducial. At least a portion of the second layer is removed to render the fiducial visible and a waveguide is automatically aligned with the first fiducial. The waveguide is then fixed to the substrate.

光結合モジュールおよびその製造方法

(57)【要約】 【課題】 アライメント作業が容易であり、製造コスト の低減を図ることができる光通信端末局として用いるの に好適な光結合モジュールを提供する。 【解決手段】 鏡面処理を受けた表面１４ａを有し該表 面上に光機能素子１１がその光機能面１１ａを表面１４ ａとほぼ平行にかつ該光機能面と反対側の裏面を表面１ ４ａに向けて搭載される半導体基板１４と、該半導体基 板の前記表面１４ａ上に前記光機能素子１１に光学的に 結合されるべく支持される光学装置１５とを含む。

Based on visual observation passive adjustment of a fibre-optic node relative to an optoelectronic device

FIELD: optics. SUBSTANCE: group of inventions relates to optical connections of optical fibres with optoelectronic devices. Connection structure with passive adjustment between optical bench and optoelectronic device contains optically transparent adjustment unit, optical bench and base. Optical bench supporting optical fibre is physically and optically connected to optoelectronic device mounted on substrate through optically transparent adjustment unit. Transparent alignment unit has a first set of optical reference points for aligning optical reference points given on the optical bench relative to the adjustment unit, and a second set of optical reference points for adjustment of the adjustment unit relative to the optical reference points given on the substrate. EFFECT: technical result consists in improvement of efficiency, technological effectiveness, functionality and reliability of optical connections of optical fibres with optoelectronic components supported on the base. 15 cl, 10 dwg РОССИЙСКАЯ ФЕДЕРАЦИЯ (19) RU (11) (13) 2 698 945 C2 (51) МПК G02B 6/42 (2006.01) G02B 6/36 (2006.01) ФЕДЕРАЛЬНАЯ СЛУЖБА ПО ИНТЕЛЛЕКТУАЛЬНОЙ СОБСТВЕННОСТИ (12) ОПИСАНИЕ ИЗОБРЕТЕНИЯ К ПАТЕНТУ (52) СПК G02B 6/42 (2019.05); G02B 6/36 (2019.05) (21)(22) Заявка: 2016149987, 26.05.2015 (24) Дата начала отсчета срока действия патента: Дата регистрации: 02.09.2019 23.05.2014 US 62/002,772 (43) Дата публикации заявки: 25.06.2018 Бюл. № 18 (45) Опубликовано: 02.09.2019 Бюл. № 25 (85) Дата начала рассмотрения заявки PCT на национальной фазе: 23.12.2016 (56) Список документов, цитированных в отчете о поиске: WO 01/27676 A1, 19.04.2001. US 2013/ 0294732 A1, 07.11.2013. US 2004/0091215 A1, 13.05.2004. US 2006/0274997 A1, 07.12.2006. US 2005/0117833 A1, 02.06.2005. 2 6 9 8 9 4 5 (73) Патентообладатель(и): НАНОПРЕСИЖЕН ПРОДАКТС, ИНК. (US) Приоритет(ы): (30) Конвенционный приоритет: R U 26.05.2015 (72) Автор(ы): ЛИ Шухи (US), КЛОТЦ Грегори Л. (US), БАРНОСКИ Майкл К. (US), ВАЛЛАНСЕ Роберт Риан ( ...

Method for relaxing mechanical tolerance in an opto-electronic unit

An optical device has a mating piece constructed to accept and mate with a commercially available optical connector (100), an optical module (102), and a spacer (104) located between the mating piece and the optical module, the spacer maintaining the mating piece and the optical module in alignment relative to each other in at least the Z direction and one other direction.

Optical assembly and method for producing the same

An optical assembly (90) is disclosed where the optical assembly provides an optical device (3) and a holder (1) including a sleeve (10), a skirt (20), and a lens (30). The sleeve has a bore (11), into which an external optical fiber (2a) is set to couple with the optical device, providing a target surface (13) in an end thereof. The target surface includes an aiming index(16) to indicate the axis (L) of the lens.

Optical module including photoreception device

光接收器件包括一个在半导体衬底(3)上的倾斜面(3A),此倾斜面使入射到该面上的光束偏折到光探测区域(7),此光探测区域是在半导体衬底的第一侧上,用于检测偏折过来的光束,光探测区域包括第一电极(8),其中光接收器件还包括在半导体衬底第二侧上,即相对一侧上的第二电极(11),它用于给光探测区域加偏置电压。

Optical fiber assembly and its manufacture, and receptacle type optical module using optical fiber assembly

(57)【要約】 【課題】 本発明は光ファイバアセンブリに係り、製造 コストの低減を可能とすることを課題とする。 【解決手段】 フェルール４１と、レーザダイオード搭 載基板組立体４２とを有する。フェルール４１は、ジル コニアセラミック製であり、端面４１ｂ寄りの部位に、 研磨して形成された基板取付け用平面部４１ｅを有す る。レーザダイオード搭載基板組立体４２は、シリコン 製の基板４５と、この基板４５上にＡｕＳｎ半田で固定 してあるレーザダイオード４６とよりなる。基板４５が 平面部４１ｅに搭載されて位置決めされてＡｕＳｎ半田 で固定してある。光ファイバ４３の端面４１ｃとレーザ ダイオード４６の発光する部分とが１μｍ程度と小さい 誤差で対向している。レーザダイオード４６とフェルー ル４１の端面４１ｂ（光ファイバ４４の端４４ａ）との 間に４７は屈折率整合剤４７が充填してある。

Electrooptical module monted on leadframe

Electro-optical module has electrical connection pins (711,712), plug holder (413) for plug with insertion direction transverse to the pin length and electro-optic component (14) acting as transducer and optically coupled to plug holder. Metal carrier or lead frame extending in the connection pin longitudinal direction is integral with connection pins and mechanically rigidly connected to end plate (310) with holder (313) for socket (413) rigidly held by lead frame, which adjustably holds the electro-optical component.

Optical assembly and manufacturing method thereof

Optical device

(57)【要約】 【課題】 光学的結合が比較的容易かつ高精度で行い得 る光学装置を提供する。 【解決手段】 レンズ素子１３が形成された光学基板１ １と、前記レンズ素子に光学的に結合される光学素子１ ５、１６、２３が設けられ、光学基板１１が実装される 支持基板１２とを含む光学装置１０。支持基板１２は、 前記光学素子が支持され部分的にエッチング処理を受け る表層１２ｃと、該表層下にあって該表層のためのエッ チング媒体に関してエッチングストッパとして機能する エッチングストッパ層１２ｂとを備える積層構造を有す る。前記エッチング処理により前記表層から露出した前 記エッチングストッパ層上に前記光学基板が載置されて いる。

A kind of coupling process and its optical transceiver module of composition of SIP chips and laser

本发明提供一种SIP芯片与激光器的耦合方法及其组成的光收发模块，包括采用使激光器(6)与SIP芯片(3)要求的偏振方向对齐的方法，具体为：先用图像视觉系统找到SIP芯片耦合端口的X轴和Y轴的十字线，将激光器芯片(6‑2)的发光端面(6‑2‑1)的X轴和Y轴构成的十字线等效标记到封装激光器芯片的TO管座底面上，然后将图像视觉系统对着激光器的TO管座底面，调节激光器的位置，使TO管座底面上的十字线与图像视觉系统上的十字线对齐。本发明光模块耦合过程中采取图像视觉系统进行无源耦合，生产效率高，易于大规模生产操作；光模块结构简单，体积小，可封装在小型可插拔结构(SFP)中；结构一体化，不易断纤；散热性好，具有高可靠性。

Devices for emitting radiation with a high efficiency and a method for fabricating such devices

The present invention aims to disclose radiation, preferably light emitting, devices with a high radiation emission efficiency. The invention further aims at disclosing radiation, preferably light, emitting devices that can be fabricated as small devices in an array of such devices. In a first object of the invention, the radiation, preferably light, emitting devices can be placed in dense arrays. In a second object of the invention, the radiation, preferably light, outcoupling efficiency of the devices is improved, which leads to a reduced power consumption for a given radiation output power. In a third object of the invention, the speed of the radiation, preferably light, emitting devices is increased, hence the serial bandwidth per optical channel is increased. The invention further aims to disclose light emitting devices that exhibit uniform radiation emission characteristics. The light emitting devices (diodes, LEDs) of the present invention can be used for applications wherein two-dimensional LED arrays, particularly low-power arrays, are useful, such as in display technology. Active matrix displays relying on liquid crystals (e.g. integrated on CMOS circuitry) could be replaced by LED arrays. Dense and bright one-dimensional LED arrays are useful for example for printing and copying. Also for single LED applications it is important to have a maximum of photons escaping from the light emitting surface. Firstly, the intensity of light per unit area (the brightness) is larger, and this is useful in many applications. Furthermore, the packaging cost can be reduced. Indeed, in order to achieve a large global efficiency, many conventional LEDs need an elaborate package that includes a cavity with mirrors, because the light is emitted from more than one surface of the LED.

Device for introducing laser radiation into fiber light guide and method of aligning and checking location of fiber light guide input edge

Использование: волоконно-оптические системы , медицинска  техника Сущность изобретени : , устройство содержит делитель луча, линзовое фокусирующее устройство, котировочное .средство дл  перемещени  входногЬ торца световода, экран линзовое устройство отображени . Делитель луча установлен с возможностью его введени  и выведени  с оси световода Линзовое устройство отображени  установлено на рассто нии до экрана, обеспечивающем резкое изображение входного торца на экране при установке входного торца световода на рассто нии до линзового фокусирующего устройства обеспечивающем диамерт лазерного излучени  на торце световода меньше диаметра сердечника световода, но больше диаметра лазер- ного излучени  в плоскости перет жки. Способ состоит в том. что на экране наблюдают два изображени  входного торца световода, юстировку входного торца осуществл ют до получени  двух резких концентрических изображений, первое из которых получают за счет отраженного от входного торца световода излучени  а второе - большего ра и меньшей  ркости - за счет отраженного от выходного торца излучени . 2 ел ф-лы, 2 ил. Usage: fiber optic systems, medical technology SUMMARY OF THE INVENTION: the device comprises a beam splitter, a lens focusing device, a quotation device. Means for moving the input end of the optical fiber, a screen is a lens imaging device. The beam splitter is installed with the possibility of introducing and removing it from the axis of the fiber The lens display device is installed at a distance to the screen, which provides a sharp image of the input end face on the screen when the input end of the fiber is installed at a distance to the lens focusing device, which ensures the laser radiation diameter at the fiber end less than the diameter fiber core, but larger than the diameter of the laser radiation in the plane of the waist. The way is. that two images of the input end of the fiber are observed on the screen, the input end is aligned until two sharp concentric images are ...

Laser light source

Optical assembly and method for producing the same

公开了一种光学组件（90），其中，所述光学组件提供光学器件（3）和保持器（1），所述保持器包括套筒（10）、裙座（20）和透镜（30）。所述套筒具有孔（11），外光纤（2a）安置在所述孔（11）中以与所述光学器件耦合，所述孔在其端部中提供目标表面（13）。所述目标表面包括指示透镜的轴线（L）的瞄准位标（16）。

Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom

A device for emitting radiation at a predetermined wavelength is presented. This device has a cavity with an active layer in which said radiation is generated by charge carrier recombination. The edges of the device define the region or space for radiation and/or charge carrier confinement. At least one of the edges of this cavity has a substantially random grating structure. The edge of the device has substantially random grating structure and can extend as at least one edge of a waveguide forming part of this radiation emitting device. The radiation emitting device of the present invention can have a cavity comprising a radiation confinement space that includes confinement features for the charge carriers confining the charge carriers to a subspace being smaller than the radiation confinement space within the cavity. The emitting device can comprise at least two edges forming, in cross-section, a substantially triangular shape. The angle between these two edges is smaller than 45°. At least one of the two edges has a transparent portion. the devices according to the present invention can be arranged in arrays.

Wavelength-variable semiconductor laser, optical integrated device utilizing the same, and production method thereof

A wavelength-variable semiconductor laser includes: a submount; and a semiconductor laser chip being mounted onto the submount and having at least an active layer region and a distributed Bragg reflection region, wherein the semiconductor laser chip is mounted onto the submount in such a manner that an epitaxial growth surface thereof faces the submount and a heat transfer condition of the active layer region is different from a heat transfer condition of the distributed Bragg reflection region. Moreover, an optical integrated device includes at least a semiconductor laser and an optical waveguide device both mounted on a submount, wherein the semiconductor laser is the wavelength-variable semiconductor laser as set forth above.

Optical device

An optical device is provided which includes a plurality of optical modules. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device.

Optical subassembly

An optical subassembly includes an opto-electronic device (14), an optics block (20) and a spacer (15), separate from the optics block (20) and providing spacing between the opto-electronic device (14) and the optics blo ck (20). The opto-electronic device (14), the optics block (20) and the spacer (15) are aligned and bonded together. This subassembly is particularly usefu l when coupling light between the opto-electronic device (14), and a fiber (10 ). The optical subassembly may also include an opto-electronic device (14), an optics block (20) and a sealing structure surrounding the opto-electronic device (14). The opto-electronic device (14), the optics block (20) and the sealing structure are aligned and bonded together.

OPTOELECTRONIC MODULE FOR MECHANICAL CONTACTLESS OPTICAL LINK, MODULE ASSEMBLY, INTERCONNECTION SYSTEM, METHOD FOR MAKING AND CONNECTING TO AN ASSOCIATED CARD

OPTOELECTRONIC MODULE FOR MECHANICAL CONTACTLESS OPTICAL LINK, MODULE ASSEMBLY, INTERCONNECTION SYSTEM, METHOD FOR MAKING AND CONNECTING TO AN ASSOCIATED CARD

L'invention concerne un module optoélectronique (M), destiné à assurer une conversion d'un signal électrique depuis une carte électronique en un signal optique ou vice-versa , comprenant l'empilement suivant: - une carte électronique (1) destinée à servir d'interface avec une carte électronique d'application; - un composant électronique de commande (2) adapté pour réaliser la commande d'un composant optoélectronique, le composant électronique étant fixé directement sur la carte électronique et relié électriquement au circuit électronique; - un composant optoélectronique (3) adapté pour émettre ou recevoir un signal lumineux par sa surface supérieure, le composant optoélectronique étant fixé directement sur le dessus du composant électronique et relié électriquement au composant électronique; - un dispositif optique (9) adapté pour transmettre un signal optique; - un support (10) de dispositif optique, le support étant fixé directement sur la carte électronique de sorte à assurer l'alignement mécanique entre le dispositif optique et le composant optoélectronique. The invention relates to an optoelectronic module (M) for converting an electrical signal from an electronic card into an optical signal or vice versa, comprising the following stack: an electronic card (1) intended to serve interfacing with an application electronic card; an electronic control component (2) adapted to carry out the control of an optoelectronic component, the electronic component being fixed directly on the electronic card and electrically connected to the electronic circuit; an optoelectronic component (3) adapted to emit or receive a light signal by its upper surface, the optoelectronic component being fixed directly on top of the electronic component and electrically connected to the electronic component; an optical device (9) adapted to transmit an optical signal; an optical device support (10), the support being fixed directly on the electronic card so as to ...

Arrangement for aligning optical components

An arrangement for coupling light into or coupling light out of waveguides includes a base plate with thereon attached mirror mount and reflecting surface, at least one waveguide, as well as a holding device for holding optical or optoelectronic components. The mirror mount and the holding device contain alignment marks, which snap together so that an alignment occurs in a direction (x-direction) that is parallel to the longitudinal extension of the waveguide. The holding device and the base plate contain further alignment marks, which ensure an alignment in a direction (y-direction) that is perpendicular to the longitudinal extension of the waveguide.

Method and device for installing light emitting element

目的:提供发光元件的安装方法，该方法作为标准能够参照发光元件的光轴精确地对物体进行定位，并安装元件。解决的手段:在第一照相机和第二照相机之间插入吸附机头，它们的光轴彼此正相对且保持固定的空间关系，用第一照相机拍摄吸附机头的机头基准标记，用第二照相机拍摄由吸附机头所吸附的发光元件的末端表面，用第三照相机拍摄由发光元件所发出的光轴。然后，在第一照相机和第二照相机之间插入工作台，使用第一照相机拍摄该工作台上所固定的基板，用第二照相机拍摄工作台的工作台基准标记。使用来自这些照相机的图像信息来计算发光元件与吸附机头之间的相对位置以及在板与工作台之间的相对位置，把吸附机头和工作台移向安装位置，用第一和第二照相机来识别机头基准标记和工作台基准标记，并且基于相对位置信息使吸附机头和工作台经受位置补正和被安装。

ASSEMBLY OF AN OPTICAL INTEGRATED CIRCUIT CHIP ON A FIBER OPTIC CONNECTION PLATFORM TO FORM A MINIATURE OPTICAL COMPONENT

hybrid optical coupling module and manufacturing method thereof

본 발명은 광을 전송하는 광학부와 광신호를 전기신호로 변환하는 전기부를 효율적으로 광결합하기 위하여 광학부와 전기부를 별도 제작한 후 결합한 것을 하이브리드 광결합 모듈 및 그 제조방법에 관한 것으로, 광신호를 전송하는 광전송수단과, 상기 광전송수단의 광신호가 출력되는 지점에 접합되어 출력된 광을 집속하는 어레이 렌즈를 포함하는 광학부와, 상기 어레이렌즈를 통해 집속된 광신호를 수신하여 전기신호로 변환하는 전기부를 포함하되, 상기 광전송수단과 상기 어레이 렌즈에는 상기 어레이 렌즈가 상기 광전송수단의 광이 출력되는 지점에 접합되도록 정렬마크(Align mark)를 형성한다. The present invention relates to a hybrid optical coupling module and a method of manufacturing the optical coupling module, wherein the optical section and the electric section are separately manufactured and then combined to optically couple the optical section for transmitting light and the electric section for converting an optical signal into an electric signal, An optical unit that includes an optical transmission unit that transmits a signal and an array lens that focuses the light output from the optical transmission unit and outputs an optical signal; and an optical unit that receives the optical signal focused through the array lens, And an alignment mark is formed on the optical transmission means and the array lens so that the array lens is bonded to a point where light of the optical transmission means is output.

PASSIVE METHOD OF CONNECTORING OPTICAL ELEMENTS WITH AN INTEGRATED OPTICAL CIRCUIT AND TEMPLATE FOR IMPLEMENTING THE METHOD

L'invention concerne un procédé de connectorisation d'éléments optiques avec un circuit en optique intégrée (26) consistant à connecter à ce circuit au moins un élément optique de façon à ce que les sorties et/ ou les entrées respectives soient situées sensiblement dans un même plan (xoz) que des entrées et/ ou des sorties de ce circuit en optique intégrée (26) situées également dans un même plan (xoz). Ce procédé comporte les étapes suivantes : - on positionne le circuit (26) sur un gabarit (35) ayant des motifs aptes à permettre un alignement précis ultérieur des éléments optiques avec les entrées et/ ou les sorties du circuit (26); - on positionne au moins un bloc (29, 30), apte à recevoir le ou les éléments optiques, sur le gabarit en regard des entrées et/ ou des sorties du circuit (26), et on le fixe au circuit (26);- on retire le gabarit et on dispose le ou les éléments optiques dans chaque bloc (29, 30), ceux-ci étant alors alignés avec les entrées et/ ou les sorties du circuit (26). The invention relates to a method for connecting optical elements with an integrated optical circuit (26) comprising connecting at least one optical element to this circuit so that the respective outputs and / or inputs are located substantially in a same plane (xoz) as inputs and / or outputs of this integrated optical circuit (26) also located in the same plane (xoz). This method comprises the following steps: positioning the circuit (26) on a jig (35) having patterns able to allow a precise subsequent alignment of the optical elements with the inputs and / or the outputs of the circuit (26); positioning at least one block (29, 30) capable of receiving the optical element (s) on the template facing the inputs and / or outputs of the circuit (26) and is fixed to the circuit (26); the template is removed and the optical element (s) are placed in each block (29, 30), these being then aligned with the inputs and / or outputs of the circuit (26).

METHOD FOR ADJUSTING THE PARALLELISM OF A FIBER BLOCK WITH A SURFACE OF A CHIP

L'invention concerne un procédé de réglage du parallélisme d'une face (17) d'un bloc (13) de fibres optiques (15) avec une face d'une puce ou tranche semiconductrice posée sur une table XY (5), comprenant les étapes suivantes : a) prévoir un capteur (9) solidaire de la table XY et un bras manipulateur (7) portant le bloc, ladite face (17) étant tournée vers la table XY ; b) pour chacun de trois points non alignés de la face (17) du bloc (13), effectuer un déplacement l'un par rapport à l'autre de la table XY (5) et du bloc (13) dans les directions X et/ou Y pour mettre le capteur (9) en regard du point, et évaluer, avec le capteur (9), la distance en Z entre le point et le capteur ; et c) modifier l'orientation du bloc (13) au moyen du bras manipulateur (7) pour assurer le parallélisme recherché.

ASSEMBLY OF AN OPTICAL INTEGRATED CIRCUIT CHIP ON A FIBER OPTIC CONNECTION PLATFORM TO FORM A MINIATURE OPTICAL COMPONENT

L'invention concerne un composant optique miniature formé par assemblage d'une puce de circuit intégré optique (1) comportant des guides d'ondes (2), sur une plate-forme (3) de connexion à des fibres optiques (5', 5"), les fibres étant positionnées et alignées dans des sillons parallèles (4', 4 ") creusés dans la plate-forme. L'invention prévoit que : - la surface de la plate-forme (3) est creusée de microstructures femelles (30) en forme de boutonnières axiales de dimensions sub-millimétriques et en ce que,- la face de la puce (1) comporte des microstructures mâles saillantes (10) formées par dépôt métallique, aptes à s'emboîter et à coulisser axialement dans les microstructures femelles (30), lors de l'assemblage du composant. L'invention prévoit encore un procédé d'assemblage d'une tel composant optique miniature et un procédé de fabrication matriciel d'une plate-forme ainsi qu'un dispositif de matrice. The invention relates to a miniature optical component formed by assembling an optical integrated circuit chip (1) comprising waveguides (2), on a platform (3) for connection to optical fibers (5 ', 5 "), the fibers being positioned and aligned in parallel grooves (4 ', 4") dug in the platform. The invention provides that: - the surface of the platform (3) is hollowed out of female microstructures (30) in the form of axial buttonholes of sub-millimeter dimensions and in that, - the face of the chip (1) comprises protruding male microstructures (10) formed by metal deposition, able to fit together and slide axially in the female microstructures (30), during assembly of the component. The invention also provides a method for assembling such a miniature optical component and a method for manufacturing a matrix of a platform as well as a matrix device.

Optical device

An optical device includes a fixed reference. A first optical module has a first optical component prealigned with respect to a reference feature, the first optical module is subsequently mounted to a first predetermined location on the fixed reference. A second optical module has second optical component prealigned with respect to a reference feature, the second optical module mounted to a second predetermined location on the fixed reference.

Manufacturing method of opto-electric hybrid module and opto-electric hybrid module obtained thereby

Low profile optical subassembly

There is disclosed, an optical subassembly (10) includes a platform (12) on which a laser (18) and photodiode (14) are mounted. The laser (18) has a rear facet (42) through which passes a small portion of the light emitted by the laser (18). The photodiode (14) is mounted on the surface of the platform with a light admitting facet (44) for receiving a portion of the light emitted from the rear facet (42) of the laser being substantially perpendicular to the light emitting facet (42) of the laser. The surface of the platform may include a channel (34). The channel (34) may be tapered from a narrower end (36) near the laser (18) to a wider end (38) near the photodiode (14), and may be coated with a light-reflective material.

Optical subassembly

Laser and planar optical waveguide hybrid integrated structure and manufacturing method thereof

本发明涉及一种激光器与平面光波导混合集成结构及其制造方法，该结构包含一热沉(1)、至少一路分立激光器芯片(2)，一平面光波导芯片(3)。所述热沉(1)上制作有支撑凸台(11)，所述热沉(1)上还制作有电极(15)和对准标记(14)，所述电极(15)上还有焊料凸点(13)。所述激光器芯片(2)倒扣在所述热沉的支撑凸台(11)上，形成多路激光器阵列。所述多路激光器阵列与所述平面光波导芯片(3)耦合对准并固定。本发明降低了多路激光器与平面光波导芯片封装难度，提高封装效率。

Optical waveguide board having guided structure and method of manufacturing the same, and method of manufacturing optical-electrical hybrid board

In the optical waveguide board, simultaneously with pattern formation of mirror members at arbitrary positions on a clad layer 11 , guiding patterns 14 having convex shapes are formed respectively at arbitrary positions on peripheral parts of mirror patterns 13 , and the mirror patterns 13 are worked into tapered shapes. Next, in a state that a mask member 100 having through holes at desired positions, and the guiding patterns 14 are guided by mating, a metal film is formed on surfaces of slope parts 22 of the mirror patterns and the guiding patterns 14 . Furthermore, in a state that the guiding patterns 14 and the photomask 16 are guided, wiring core patterns 20 are formed on the clad layer 11 adjacent to the mirror patterns 13.

Calibration validation using geometric features in galvanometric scanning systems

Some embodiments may include a method of generating assessment data in a system including a galvanometric scanning system (GSS) having a laser device to generate a laser beam and an X-Y scan head module to position the laser beam on a work piece. The method may include selecting a dimension based on a desired accuracy for validation (and/or a characteristic of an imaging system in embodiments that utilize an imaging system). The method may include commanding the GSS to draw a mark based on a polygon or ellipse of the selected dimension around a predetermined target point associated with the work piece to generate assessment data, and following operation of the GSS based on said commanding, validating a calibration of the GSS using the assessment data (or an image thereof in embodiments that utilize an imaging system). Other embodiments may be disclosed and/or claimed.

Echo cancel device

(57)【要約】 【課題】 本発明の課題は、高効率で光導波路と受光素 子とを結合することができ、受光素子の動作速度を向上 可能な光検出器モジュールを提供することである。 【解決手段】 光検出器モジュールは主面を有する支持 基板と、支持基板上に搭載された、光ビームを第１の光 路に沿って出射させる端面を有する光導波路と、光導波 路の端面から出射された光ビームが入射されるように支 持基板上に搭載された、入射した光ビームに応答する受 光部を有する受光素子とを含んでいる。光検出器モジュ ールは更に、第１の光路の光ビームを第２の光路に反射 する受光素子の基板に形成された第１斜面と、第２の光 路の光ビームを受光部と概略垂直な第３の光路に全反射 する第２斜面とを含んでいる。

Lens system and optoelectric alignment apparatus

The optoelectric alignment apparatus and lens system includes a glass ball positioned to receive light from a light source along an optical axis. A second lens is positioned to receive light from the glass ball and to supply the received light to a light receiving structure. The glass ball provides most of the optical power of the lens system so that the second lens provides only minor optical correction. The lens system is mounted by means of a molded plastic body that extends axially along the optical axis with the second lens molded into the body. The body includes a light inlet end and a light outlet in a surface lateral to the optical axis and defines a glass ball receiving cavity adjacent the light inlet end fixedly gripping the glass ball.

Semiconductor component and semiconductor mounting apparatus

Alignment of an optical component

A method of positioning an optical component (1) on an optical by: forming alignment marks (3a-3H) on the chip and positioning the component (1) in alignment with the marks (3a-3H), the alignment marks (3A-3H) comprising mini alignment V-grooves formed in the chip. A photodiode (1) may be aligned with a V-groove (5) in which an optical fibre (6) is located, both types of V-grooves (3A-3H; 5) being formed in the same lithographic step. The photodiode (1) is located over a reflective facet (5A) at the end of the V-groove (5) but does not overlap the end of the fibre (6).

Chip mounting method and device

적어도 하나의 광 능동면을 갖는 칩 장치를 단순화하고, 광섬유와 상기 광 능동면간의 최적의 광전송을 위해 광 소형 캡슐에 대하여 정확한 위치에 상기 칩을 실장하고자, 상기 칩(1)은, 적어도 하나의 도체(4)를 가지며 상기 박막기판 상의 정확한 칩 실장 및 상기 캡슐상의 정확한 박막기판/칩 어셈블리 실장을 위한 정렬표시 및/또는 안내 수단(8)이 구비된 박막기판(9)상에 고정된다. 박막기판상에 칩을 고정시킨 후, 상기 칩이 실장된 박막이 용이하게 캡슐에 고정될 수 있어, 이로써 상기 칩이 캡슐에 고정되게 된다. 캡슐상의 접촉 소자 안내핀과 같은 안내 수단을 사용함으로써, 박막기판/칩 어셈블리가 상기 캡슐에 대해 정확하게 실장되어, 상기 접촉 소자내의 광섬유의 단부가 상기 칩의 광 반응면과 접촉하여 이것과 마주보게 놓임으로써 최적의 광전송을 제공할 수 있다. In order to simplify the chip device having at least one optically active surface and to mount the chip in the correct position with respect to the optical miniature capsule for optimal optical transmission between the optical fiber and the optically active surface, the chip 1 is provided with at least one It is fixed on a thin film substrate 9 having conductors 4 and having alignment marks and / or guiding means 8 for accurate chip mounting on the thin film substrate and accurate thin film substrate / chip assembly mounting on the capsule. After fixing the chip on the thin film substrate, the thin film on which the chip is mounted can be easily fixed to the capsule, thereby fixing the chip to the capsule. By using guiding means such as encapsulated contact element guide pins, the thin film substrate / chip assembly is accurately mounted to the capsule so that the end of the optical fiber in the contact element is placed in contact with and facing the optical reaction surface of the chip. As a result, it is possible to provide an optimal optical transmission.

Index tunable thin film interference coatings

According to various embodiments and aspects of the present invention, there is provided a dynamically tunable thin film interference coating including one or more layers with thermo-optically tunable refractive index. Tunable layers within thin film interference coatings enable a new family of thin film active devices for the filtering, control, modulation of light. Active thin film structures can be used directly or integrated into a variety of photonic subsystems to make tunable lasers, tunable add-drop filters for fiber optic telecommunications, tunable polarizers, tunable dispersion compensation filters, and many other devices.

Optical module and method of packaging the same

An optical module is configured with a combination of a single-mode oscillating light source and an optical filter. In this optical module, the single-mode oscillating light source outputs a single-mode, frequency-modulated signal. Further, the optical filter converts the frequency modulation to an amplitude modulation. And, the single-mode oscillating light source and the optical filter are packaged without active alignment on the same substrate. Accordingly, it is possible to realize an optical module in a simple and low-cost configuration by packaging the single-mode oscillating light source and the optical filter by passive alignment, without active alignment, on the same substrate, and by using a simple optical filter such as a waveguide ring resonator, which converts a frequency modulation to an amplitude modulation.