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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Форма поиска

Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 2007. Отображено 100.
17-05-2012 дата публикации

3d optoelectronic packaging

Номер: US20120120978A1
Автор: Frank R. Libsch, Paul Fortier, Russell A. Budd
Принадлежит: International Business Machines Corp

An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

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Номер записи: 1
09-08-2012 дата публикации

Connector assemblies having flexible circuits configured to dissipate thermal energy therefrom

Номер: US20120202370A1
Автор: Jason M'Cheyne Reisinger, Richard Elof Hamner, Robert Neil Mulfinger
Принадлежит: Tyco Electronics Corp

A connector assembly that includes a communication connector comprising a base frame and a moveable side that is supported by the base frame. The moveable side has a mating array of terminals thereon and is configured to move with respect to the base frame between retracted and engaged positions to engage a communication component. The connector assembly also includes a flexible circuit including a flex interconnect that has opposite exterior surfaces. The flexible circuit is coupled to the moveable side. The connector assembly also includes a plurality of heat-dissipation elements that are attached to the flex interconnect and project away from one of the exterior surfaces. The heat-dissipation elements are configured to conduct thermal energy from the flex interconnect and transfer the thermal energy to an ambient environment.

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Номер записи: 2
11-07-2013 дата публикации

Modularized server

Номер: US20130176748A1
Автор: Chao-Wei Li, Cheng-Da Shaw, Chun-Hsing Lee, Hsin-Yun Tsai, Hung-Lieh Hu, Ya-Hui Chiang
Принадлежит: Industrial Technology Research Institute ITRI

A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.

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Номер записи: 3
05-09-2013 дата публикации

Chip assembly configuration with densely packed optical interconnects

Номер: US20130230272A1
Автор: David K. McElfresh, Dawei Huang, Kannan Raj, Nicholas E. Aneshansley, Theresa Sze
Принадлежит: Oracle International Corp

A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

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Номер записи: 4
10-10-2013 дата публикации

Opto-electronic device assembly

Номер: US20130266274A1
Автор: An-Jen Yang, Gang Paul Chen, JI Li, Jie Zheng, Jim Zhao, jun-bin Huang, Terrance F. Little, Yuan-Chieh Lin
Принадлежит: Hon Hai Precision Industry Co Ltd

An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

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Номер записи: 5
24-10-2013 дата публикации

Optical transceiver implementing with flexible printed circuit connecting optical subassembly to circuit board

Номер: US20130279862A1
Автор: Hiromi Kurashima, Kuniyuki Ishii, Michio Suzuki, Nobuyuki Shimizu, Noriyuki Hirakata, Toshiaki Kihara, Toshio Takagi, Yasushi Fujimura
Принадлежит: Sumitomo Electric Device Innovations Inc, Sumitomo Electric Industries Ltd

An optical transceiver is disclosed, where the optical transceiver includes an optical subassembly (OSA) with a bottom plate for dissipating heat and connected to an electronic circuit with a flexible printed circuit (FPC). The FPC is soldered with the side electrodes of the OSA as forming a solder fillet in the plane electrode, or the FPC is soldered with the plane electrodes of the OSA as forming the solder fillet in the side electrodes, and leaving a limited room for receiving the curved FPC in peripheries of the OSA.

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Номер записи: 6
09-01-2014 дата публикации

Metal strain relief device for use in an optical communications system, an optical fiber cable that employs the strain relief device, and a method

Номер: US20140010514A1
Автор: Laurence R. McColloch
Принадлежит: Avago Technologies General IP Singapore Pte Ltd

A strain relief device and method are provided for use with an optical fiber cable of an optical communications system. The strain relief device comprises a plurality of metal wires, or rods, grouped into a bundle of parallel metal wires and a clamping mechanism for clamping first and second ends of the metal wires to an optical fiber cable. The clamped bundle of metal wires forms a spring having a spring constant that provides it with a desired stiffness and a desired flexibility.

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Номер записи: 7
30-01-2014 дата публикации

Photonic package architecture

Номер: US20140029639A1
Автор: Debendra Mallik, Edward A. Zarbock
Принадлежит: Intel Corp

A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

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Номер записи: 8
06-03-2014 дата публикации

Methods and systems for dissipating heat in optical communications modules

Номер: US20140063743A1
Автор: David J.K. Meadowcroft, Seng-Kum Chan
Принадлежит: Avago Technologies General IP Singapore Pte Ltd

Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.

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Номер записи: 9
27-03-2014 дата публикации

OPTICAL MODULE

Номер: US20140086541A1
Автор: Arao Hajime
Принадлежит:

In an optical module in which a connector unit is provided at an end portion of an optical cable including an optical fiber the connector unit includes an inner housing accommodating a circuit substrate to which an electrical connector is connected at a front end portion, and an outer housing covering an outside of the inner housing A step portion is provided on the inner housing an internal space S on a side of the front end portion from the step portion of the inner housing is narrower than an internal space S on a side of a rear end portion from the step portion and a predetermined gap is formed between the inner housing and the outer housing 1. An optical module comprising:an optical cable including an optical fiber; anda connector unit provided at an end portion of the optical cable, an inner housing accommodating a circuit substrate in an internal space of the inner housing,', 'an optical element which is provided on the circuit substrate, and is optically connected to the optical fiber an electrical connector connected to a front end portion of the circuit substrate; and', 'an outer housing covering an outside of the inner housing,, 'wherein the connector unit includes,'}wherein a step portion is provided on the inner housing,wherein the internal space on a side of the front end portion from the step portion is narrower than the internal space on a side of a rear end portion from the step portion, andwherein a predetermined gap is formed between the inner housing and the outer housing.2. The optical module according to claim 1 ,wherein an optical coupling member is provided on the circuit substrate, and the optical coupling member optically connects the optical fiber and the optical element,wherein an optical axis direction of the optical fiber is different from an optical axis direction of the optical element, andwherein the height of the optical coupling member is greater than the distance between the circuit substrate and the inner housing on the side of ...

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Номер записи: 10
06-01-2022 дата публикации

Optical and thermal interface for photonic integrated circuits

Номер: US20220003945A1
Автор: Brian R. Koch, Gregory Alan Fish
Принадлежит: Aurrion Inc

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.

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Номер записи: 11
02-01-2020 дата публикации

Transceiver and interface for ic package

Номер: US20200003976A1
Автор: Brian R. Vicich, Eric J. Zbinden, Jean-Marc A. VERDIELL, John A. MONGOLD, Keith R. GUETIG, Randall E. MUSSER
Принадлежит: Samtec Inc

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

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Номер записи: 12
20-01-2022 дата публикации

OPTICAL TRANSCEIVER WITH VERSATILE POSITIONING

Номер: US20220019039A1
Автор: ZBINDEN Eric
Принадлежит:

An optical transceiver can include a transmitter and a receiver. The optical transceiver is configured to mate with an electrical connector in first and second orientations that are opposite each other. In certain examples, a thermally conductive surface of the transceiver is configured to be placed in thermal communication with a heat dissipation member in one or both of the first and second orientations. Further examples of optical transceivers can be mounted to a base and placed in electrical communication with an electrical connector. A lid provides a compressive force that simultaneously makes electrical contact between the transceiver and a host printed circuit board (PCB) and provides a low impedance heat transfer path to dissipate heat generated during transceiver operation. 1. A transceiver comprising:a transceiver housing defining a first side and a second side opposite the first side along a lateral direction, a first end and a second end opposite the first end along a longitudinal direction, and a first surface and a second surface opposite the first surface along a transverse direction;a plurality of electrical contacts having mating ends disposed at the first and second sides of the transceiver housing; andthe second side of the transceiver housing is arranged to attach and detach at least one optical fiber or electrical cable to the transceiver.2. The transceiver as recited in wherein the first surface is a heat dissipation surface.3. The transceiver as recited in wherein the mating ends are planar.4. The transceiver as recited in wherein the mating ends disposed at the first side are arranged along a first common plane and the mating ends disposed at the second side are arranged along a second common plane.5. The transceiver as recited in wherein the first and second common planes are oriented perpendicular to the transverse direction.6. The transceiver as recited in wherein the at least one optical fiber is a plurality of optical fibers arranged in ...

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Номер записи: 13
20-01-2022 дата публикации

Optical communication system

Номер: US20220019040A1
Автор: Che-Shou Yeh, Hsiang-Jen LU, Ming-You Lai
Принадлежит: Prime World International Holdings Ltd

An optical communication system includes a light source module, a circuit board, a light emitter and a ROSA. The circuit board is disposed in the light source module. The light emitter is disposed in the light source module and electrically connected to the circuit board. The ROSA is located outside the light source module, and the ROSA is optically coupled to the light emitter.

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Номер записи: 14
02-01-2020 дата публикации

Thermal management with variable conductance heat pipe

Номер: US20200008321A1
Автор: Brian Robert Koch, Christopher Paul Wyland, Gregory Alan Fish, Robert S. Guzzon, Roberto Marcoccia, Theodore J. Schmidt
Принадлежит: Juniper Networks Inc

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

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Номер записи: 15
11-01-2018 дата публикации

Optical module

Номер: US20180011266A1
Автор: Hiroki Irie, Koichi Omori, Tetsuya Aoki
Принадлежит: Oclaro Japan Inc

The invention provides an optical module which is less likely to be damaged, and can be assembled at low cost. The optical module comprises a housing having an electrical signal port for inputting and/or outputting an electrical signal and an optical signal port for inputting and/or outputting an optical signal, a first substrate arranged in the housing so as to connect to the electrical signal port, an optical fiber arranged in the housing so as to connect to the optical signal port, and a second substrate provided with an optical device which connects to the optical fiber to input the optical signal from the optical fiber and output the optical signal to the optical fiber, and arranged in the housing so as to electrically connect to the first substrate, and to be inclined with respect to a base plane of the housing.

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Номер записи: 16
11-01-2018 дата публикации

Chip on leadframe optical subassembly

Номер: US20180011267A1
Автор: Paul Thien Vui Chia, Tat Ming Teo, Wendy Pei Fen Lau, Yew-Tai Chieng, Yunpeng Song
Принадлежит: Finisar Corp

One example embodiment includes an optical subassembly (OSA). The OSA includes a leadframe circuit, an optical port, and an active optical component subassembly. The active optical component subassembly is mounted to the leadframe circuit. The optical port is mechanically coupled to the leadframe circuit.

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Номер записи: 17
15-01-2015 дата публикации

Optical module

Номер: US20150016772A1
Автор: Atsushi Suzuki, Hajime Arao, Mitsuaki Tamura, Toshihisa Yokochi
Принадлежит: Sumitomo Electric Industries Ltd

An optical module ( 1 ) of the invention includes a circuit substrate ( 24 ) on which light receiving and emitting elements ( 52 ) are mounted, a connector component ( 54 ) for holding optical fibers ( 7 ), and a lens array component ( 55 ) which is fixed on the circuit substrate ( 24 ) and optically connects the optical fibers ( 7 ) to the light receiving and emitting elements ( 52 ) on the circuit substrate ( 24 ), and the circuit substrate ( 24 ) has a lens array mounting region (A 1 ) in which the lens array component ( 55 ) is fixed and a connector component opposed region (A 2 ) opposed to the connector component ( 54 ), and thermal insulation space is formed between the connector component ( 54 ) and the connector component opposed region (A 2 ).

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Номер записи: 18
17-01-2019 дата публикации

MODULE BOARD COUPLING

Номер: US20190018199A1
Автор: GANTA Sunil, Leigh Kevin B., MEGASON George D., NORTON John
Принадлежит:

In one example, a system for a module board coupling includes a module bracket coupled to a plate, a module board coupled to the plate, a number of frame pins coupled to the module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate. 1. A system for a module board coupling , comprising:a module bracket coupled to a plate;a module board coupled to the plate;a number of frame pins coupled to a module frame to slide under the plate when a back spring coupled to the module bracket is depressed, wherein the module board is engaged with a socket when the number of frame pins slide under the plate.2. The system of claim 1 , comprising a number of plate springs to push the module board to the socket when the back spring is depressed.3. The system of claim 2 , wherein the plate springs push the module board in a substantially vertical direction.4. The system of claim 1 , wherein the modular board is engaged with the socket via blind-mate alignment features.5. The system of claim 1 , comprising a cage coupled to the socket to receive the module bracket.6. The system of claim 5 , wherein the cage receives the module bracket to depress the back spring.7. The system of claim 5 , comprising a latch to lock the module bracket to the cage.8. A module board coupling claim 5 , comprising:a plate coupled to a module board, wherein the plate includes a number of grooves;a number of frame pins coupled to a module frame;a back spring to position the number of frame pins within the number of grooves; anda plate spring coupled to the plate to vertically position the module board when the number of frame pins are within the number of grooves.9. The module board coupling of claim 8 , wherein the number of frame pins are positioned between the plate and the module board.10. The module board coupling of claim 8 , wherein the module board is coupled to ...

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Номер записи: 19
26-01-2017 дата публикации

INDEXING SIGNAL DETECTION MODULE

Номер: US20170023743A1
Автор: HAGEN Norbert D., OPALSKY David
Принадлежит:

An indexing signal detection module is configured to index one or more signal detectors past each of a plurality of sources of detectable signal emissions to detect or measure a signal emitted by each source. A plurality of signal transmission conduits transmit signal emitted by the sources from a first end of each conduit to a second end of each conduit where the signal may be detected by a signal detector. A conduit reformatter is configured to secure the first ends of the respective signal transmission conduits in a first spatial arrangement corresponding to a spatial arrangement of the signal emission sources and to secure the second ends of the respective signal transmission conduits in a second spatial arrangement different from the first spatial arrangement. 1. An apparatus for transmitting a signal emission from each of a plurality of potential signal emission sources , said apparatus comprising:a plurality of signal transmission conduits, each signal transmission conduit being configured to transmit a signal emitted by one or more of the signal emission sources between a first end and a second end thereof; anda conduit reformatter constructed and arranged to secure the first ends of the respective signal transmission conduits in a first spatial arrangement corresponding to a spatial arrangement of the signal emission sources, such that the first end of each signal transmission conduit is positioned to receive an emission signal emitted by one or more of the signal emission sources, and to secure the second ends of the respective signal transmission conduits in a second spatial arrangement different from the first spatial arrangement.2. The apparatus of claim 1 , wherein the signal emission is an optical signal and the signal transmission conduits comprise optical fibers.3. The apparatus of claim 1 , wherein the first spatial arrangement is rectangular and comprises two or more rows claim 1 , each row including two or more of the first ends of the signal ...

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Номер записи: 20
26-01-2017 дата публикации

Optoelectronic Module With Improved Heat Management

Номер: US20170023751A1
Автор: Andersson Magnus, Steijer Odd Robert
Принадлежит: TYCO ELECTRONICS SVENSKA HOLDINGS AB

An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner. 1. An optoelectronic module , comprising:an optical connector;a contact;an opto-electric assembly having a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable; anda casing at least partially enclosing the opto-electric assembly, the optical connector, and the contact, an inner surface of a wall of the casing attached to the carrier in a thermally conductive manner.2. The optoelectronic module of claim 1 , wherein the opto-electric assembly has an optical transducer converting optical signals into electrical signals and electrical signals into optical signals.3. The optoelectronic module of claim 2 , wherein the optical connector is optically connected to a mating optical ferrule.4. The optoelectronic module of claim 3 , wherein the contact is electrically connected to a mating electrical connector.5. The optoelectronic module of claim 4 , wherein the carrier is thermally connected to the inner surface of the wall by a thermal bridge.6. The optoelectronic module of claim 5 , wherein the thermal bridge is integrally formed with the casing.7. The optoelectronic module of claim 5 , wherein the thermal bridge is attached to the casing by a rigid thermal interface joint.8. The optoelectronic module of claim 5 , wherein the thermal bridge is attached to the carrier by a thermally conductive casting compound.9. The optoelectronic module of claim 8 , wherein ...

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Номер записи: 21
24-01-2019 дата публикации

OPTICAL MODULE

Номер: US20190025528A1
Автор: Chen Long, LEE Weilong, SUN Yuzhou, YU Dengqun
Принадлежит:

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface. 1. An optical module , comprising:a housing;a heat sink arranged in the housing;a laser emitter arranged on the heat sink;a printed circuit board (PCB) partially arranged on the heat sink; andan optical system arranged in the housing,whereinthe optical module has an optical interface on one end and an electrical interface on the other end,the optical system is arranged between the laser emitter and the optical interface,the PCB is constructed as a rigid board,the laser emitter is electrically connected to the PCB,one end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface, andthe optical system transmits light emitted from the laser emitter to the optical interface.2. The optical module according to claim 1 , whereinthe optical module further comprises an assembly tolerance absorbing assembly arranged at the optical interface,the assembly tolerance absorbing assembly transmits light emitted from the laser emitter through the optical system to a center of the optical interface or to an external connector connected to the optical module, or the assembly tolerance absorbing assembly transmits light emitted from the laser emitter to the optical system.3. The optical module according to claim 2 , whereinthe assembly tolerance ...

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Номер записи: 22
24-01-2019 дата публикации

SPOILER HEAT SINK DEVICE IN BELLY-TO-BELLY TRANSCEIVER

Номер: US20190025529A1
Автор: Chen Chao-Jung, HUANG Yu-Nien, LEE Kuo-Wei, WU Kuen-Hsien
Принадлежит:

A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material. 1. An optical switch , comprising:a first transceiver cage having an open front end and an opposite rear end, the open front end operable to receive an inserted optical transceiver;a printed circuit board having a connector circuit operable to connect to the optical transceiver;a forward heat sink mounted over the first transceiver cage, the forward heat sink in contact with the inserted optical transceiver;a rear heat sink in proximity to the rear end of the first transceiver cage, the rear heat sink having a beveled surface facing the rear end of the first transceiver cage; anda heat pipe coupling the forward and rear heat sink together.2. The optical switch of claim 1 , wherein the forward heat sink includes a thermal interface material to contact the transceiver when the transceiver is inserted in the first transceiver cage.3. The optical switch of claim 2 , wherein a metal foil is coated over the thermal interface material.4. The optical switch of claim 3 , wherein the metal foil is copper.5. The optical switch of claim 2 , wherein the forward heat sink includes a slot that holds a cam structure moveable between a forward position and a rear position.6. The optical switch of claim 5 , wherein the forward heat sink holds a stop and a spring between the stop and the cam structure.7. ...

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Номер записи: 23
23-01-2020 дата публикации

Transmission device and plug-in unit

Номер: US20200027816A1
Автор: Hirofumi Imabayashi, Kenji Joko, Minoru Fujii, Shota Morimoto
Принадлежит: Fujitsu Ltd

A transmission device includes a first substrate on which a heat generation component is arranged, a heat sink that is placed on the heat generation component, a second substrate that is arranged above a surface of the first substrate on which the heat generation component is arranged and a pressing mechanism that presses the heat sink against the heat generation component arranged on the first substrate from the second substrate side.

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Номер записи: 24
02-02-2017 дата публикации

OPTICAL AND THERMAL INTERFACE FOR PHOTONIC INTEGRATED CIRCUITS

Номер: US20170031112A1
Автор: Fish Gregory Alan, KOCH Brian R.
Принадлежит:

Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC. 1an optical interface unit; a bottom side, wherein the optical interface unit is disposed on the bottom side;', 'a top side including a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side;', 'an emitter to emit light through the PIC out of the bottom side to the optical interface unit; and', 'an alignment feature corresponding to the emitter and formed with the emitter to be offset by a predetermined distance value, wherein the PIC comprises a processing feature to image the alignment feature from the bottom side; and, 'a photonic integrated circuit (PIC), includinga heat spreader layer surrounding the optical interface unit and disposed on the bottom side of the PIC to spread heat from the PIC.. An apparatus comprising: This application is a continuation of U.S. application Ser. No. 14/611,392, filed Feb. 2, 2015, which application claims the benefit of priority to U.S. Provisional Patent Application entitled “Optical and Thermal Interface for Photonic Integrated Circuits,” Ser. No. 61/943,108, filed Feb. 21, 2014, which is hereby incorporated ...

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Номер записи: 25
01-02-2018 дата публикации

SEALED FIBER OPTIC/ELECTRICAL DISTRIBUTION DEVICE

Номер: US20180031788A1
Автор: Duran Christian Shane, Keenum John Austin, Reed Edward Joseph, Tenholder Rodger Alan
Принадлежит:

A fiber optic/electrical distribution device having a housing defining an interior volume is disclosed. An electrical cable port extends into the interior volume and is accessible externally from the housing, wherein the electrical cable port is sealed to prevent ingress of dust and water into the interior volume. A fiber optic cable port extends into the interior volume and is accessible externally from the housing. The fiber optic cable port is sealed to prevent ingress of dust and water into the interior volume. A conversion assembly having a printed circuit board (PCB) and fiber optic cable tray supported in stacked alignment with the PCB is positioned in the interior volume. The PCB has an optical/electrical converter and an electrical power circuit. A defined spacing is maintained between the PCB and the fiber optic cable tray, and the PCB and the fiber optic cable tray are maintained in lateral alignment. 1. A fiber optic/electrical distribution device , comprising:a housing defining an interior volume;an electrical cable port extended into the interior volume and accessible externally from the housing, wherein the electrical cable port is sealed to prevent ingress of dust and water into the interior volume;a fiber optic cable port extended into the interior volume and accessible externally from the housing, wherein the fiber optic cable port is sealed to prevent ingress of dust and water into the interior volume; and a printed circuit board (PCB) comprising an optical/electrical converter and an electrical power circuit;', 'a fiber optic cable tray supported in stacked alignment with the PCB;, 'a conversion assembly positioned in the interior volume, wherein the conversion assembly compriseswherein a defined spacing is maintained between the PCB and the fiber optic cable tray, and wherein the PCB and the fiber optic cable tray are maintained in lateral alignment.2. The fiber optic/electrical distribution device of claim 1 , further comprising a plurality of ...

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Номер записи: 26
01-05-2014 дата публикации

Printed Circuit Board Assembly and a Method for Manufacturing the Printed Circuit Board Assembly

Номер: US20140119689A1
Автор: Stricot Yves, Yabre Gnitaboure
Принадлежит: FCI

Printed circuit board assembly including an optical subassembly having a carrying face for carrying at least one optoelectronic component in a such way that light emitted from/directed to is transmitted through the optical subassembly; a printed circuit board having a supporting area for supporting the optical subassembly; wherein the printed circuit board supporting area includes a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area. 1. Printed circuit board assembly comprising: an optical engine having a carrying face for carrying at least one optoelectronic component; the opto-electronic component being fixed to the carrying face in a such way that light emitted from/directed to is transmitted through the optical engine; a printed circuit board having a supporting area for supporting the optical engine; wherein the printed circuit board supporting area comprises a hole lodging at least one part of the optoelectronic component and wherein at least one part of the carrying face is fixed by flip-chip bonding to at least one part of the supporting area.2. Printed circuit board assembly according to claim 1 , wherein an assembling face of the optoelectronic component being fixed to the optical engine and wherein a first heat dissipator is attached to a back face of the optoelectronic component; the back face being the face opposite to the assembling face of the optoelectronic component.3. Printed circuit board assembly according to claim 2 , wherein at least one part of the first heat dissipator is lodged into the hole of the printed circuit board.4. Printed circuit board assembly according to claim 1 , wherein the hole is a through hole.5. Printed circuit board assembly according to claim 2 , wherein the printed circuit board comprises a cavity mouthing in said hole; said cavity being configured for accommodating the first heat ...

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Номер записи: 27
02-02-2017 дата публикации

SCREWLESS HEAT SINK ATTACHMENT

Номер: US20170034951A1
Автор: Moore Joshua John Edward, Wang William H.
Принадлежит:

An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing. 1. An optoelectronic system comprising:an optoelectronic module that includes a housing and first and second housing slide locks that extend outward from opposite sides of the housing; and the heat sink bottom is configured to be in thermal contact with a housing top of the housing of the optoelectronic module; and', 'each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing., 'a heat sink that includes a heat sink bottom and first and second heat sink slide locks that extend inward from first and second heat sink legs that extend downward from opposite ends of the heat sink bottom, wherein2. The optoelectronic system of claim 1 , wherein:the first housing slide lock includes a bottom with a first contour;the second housing slide lock includes a bottom with a second contour;the first heat sink slide lock includes a top with a third contour that is complementary to the first contour of the bottom of the first housing slide lock; andthe second heat sink slide lock includes a top with a ...

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Номер записи: 28
30-01-2020 дата публикации

THERMAL INTERFACE

Номер: US20200033541A1
Автор: Chiang Troy Wy Piew, Koh Julia, Teo Tat Ming, Wang William H.
Принадлежит:

A thermal interface may include a thermally conductive cap. The thermally conductive cap may include a base, a finger, and an extension. The base may define a plurality of cap openings. The finger may extend from the base. The extension may extend from the base. The thermal interface may also include a gasket defining a plurality of gasket openings. The gasket may be located on the base of the cap such that the gasket openings are positioned over the cap openings. 1. A thermal interface comprising: a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and, 'a thermally conductive cap includinga gasket defining a plurality of gasket openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings.2. The thermal interface of claim 1 , further comprising a pad including a pliant thermal interface material.3. The thermal interface of claim 1 , further comprising an adhesive located between the gasket and the base of the cap.4. The thermal interface of claim 1 , wherein the gasket openings are smaller than the cap openings.5. The thermal interface of claim 1 , wherein the finger is a first finger and the cap includes a plurality of fingers claim 1 , including the first finger.6. The thermal interface of claim 1 , wherein the extension has a length greater than a length of the finger.7. The thermal interface of claim 1 , wherein the cap is configured to be positioned at an end face of a header of an optical subassembly claim 1 , and the finger and the extension are configured to be positioned at a side of the header.8. The thermal interface of claim 1 , wherein the cap includes copper.9. An optoelectronic module comprising:a shell including a seat;an optical subassembly including a header having a plurality of leads; [ a base defining a plurality of cap openings;', 'a finger extending from the base; and', 'an extension extending from the base; and ...

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Номер записи: 29
08-02-2018 дата публикации

METHODS FOR DETERMINING RECEIVER COUPLING EFFICIENCY, LINK MARGIN, AND LINK TOPOLOGY IN ACTIVE OPTICAL CABLES

Номер: US20180041272A1
Автор: CORNELIUS Joshua R., KOZLOVSKY William J., LANGSAM David A., ZBINDEN Eric J.
Принадлежит:

A method for determining receiver coupling efficiency includes varying optical power inputted into a half active optical cable to determine a maximum optical power at which the TIA squelches and determining a receiver coupling efficiency by calculating a ratio of a threshold optical power to the maximum optical power at which the TIA squelches. A method of determining link loss in a channel includes varying optical power of a light source to determine the maximum optical power at which the TIA squelches and determining the link loss in the channel by subtracting the maximum optical power from the threshold optical power. A method of determining link topology includes selecting a pattern of optical powers and matching a pattern of squelched and non-squelched outputs with the pattern of optical power. An active optical cable includes memory storing a value related to an initial link loss of the active optical cable. 1. A method of determining link topology of a communication system including channels connecting corresponding transmitters and receivers , each of the channels including a light source , a photodetector optically connected to the light source , and a transimpedance amplifier connected to an output of the photodetector , wherein the transimpedance amplifier squelches its output when optical power detected by the photodetector is below a threshold optical power , the method comprising:selecting a pattern of optical powers of the light sources in a test transmitter to be either above the threshold optical power or below the threshold optical power; anddetermining which receiver is connected to the test transmitter by matching a pattern of squelched and non-squelched transimpedance amplifier outputs in the receiver with the pattern of optical powers of the light sources in the test transmitter.2. The method of claim 1 , wherein the communication system includes an active optical cable.3. The method of claim 2 , wherein the active optical cable is a multi- ...

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Номер записи: 30
09-02-2017 дата публикации

HYBRID THERMAL MANAGEMENT OF ELECTRONIC DEVICE

Номер: US20170042063A1
Автор: Chanu Marcel, Turgeon Guillaume
Принадлежит:

An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide over the top of the passive heat sink and having a front wall forming a plurality of air intake ports, and a plurality of blowers mounted inside the cold skin for drawing air into the cold skin though the air intake ports and then directing the air through the passive heat sink. In one implementation, the passive heat exchanger includes multiple thermally conductive fins adjacent to the electronic device and extending rearwardly from the intake ports, the fins being spaced apart from each other for conducting heat away from the electronic device. The blowers preferably direct air rearwardly from the intake ports in the front wall into the spaces between the thermally conductive fins. 112-. (canceled)13. An enclosure with hybrid thermal management for a heat-generating electronic device , said enclosure comprisinga passive heat sink for conducting heat away from said electronic device, wherein said passive heat sink has a removed section that forms a step,a cold skin adapted to slide over the top of said passive heat sink and having a front wall forming a plurality of air intake ports, anda plurality of blowers mounted inside said step of said passive heat sink for drawing air into said cold skin though said air intake ports and then directing said air through said passive heat sink.14. The enclosure of in which said passive heat sink includes multiple thermally conductive fins adjacent to said electronic device and extending rearwardly from said intake ports claim 13 , said fins being spaced apart from each other for conducting heat away from said electronic device and wherein said step of said passive heat sink is a removed section of said multiple thermally conductive fins.15. The enclosure of in which said blowers direct air from said intake ports into said spaces ...

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Номер записи: 31
06-02-2020 дата публикации

OPTICAL MODULE

Номер: US20200041729A1
Автор: Akieda Shinichiro, DAIKUHARA Osamu, MORIYAMA Satoshi
Принадлежит:

An optical module includes a board having a first surface and a second surface, an electronic device mounted on the first surface, a first cover that covers the first surface of the board, a second cover that covers the second surface of the board, a first heat dissipation member disposed between the board and the second cover, and a second heat dissipation member disposed between the first cover and the second cover. 1. An optical module comprising:a board having a first surface and a second surface;an electronic device mounted on the first surface;a first cover that covers the first surface of the board;a second cover that covers the second surface of the board;a first heat dissipation member disposed between the board and the second cover; anda second heat dissipation member disposed between the first cover and the second cover.2. The optical module according to claim 1 , wherein a heat sink is disposed on an outer surface of the first cover.3. The optical module according to claim 1 , wherein one end of the board is fixed to the second cover with a fixing member and another end of the board is fixed by being interposed between the first cover and the second cover.4. The optical module according to claim 1 , wherein the first cover and the second cover have contact surfaces in contact with the second heat dissipation member claim 1 , one of the contact surfaces has a projection claim 1 , and another one of the contact surfaces has a recess having a shape corresponding to a shape of the projection. This application is based on and claims priority to Japanese Patent Application No. 2018-143695, filed on Jul. 31, 2018, the entire contents of which are incorporated herein by reference.The disclosures herein generally relate to an optical module.A quad small form-factor pluggable (QSFP) optical module in compliance with the QSFP standard, which is an interface standard for optical communications, includes an optical module in which a light emitter and a light receiver ...

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Номер записи: 32
15-02-2018 дата публикации

THERMALLY CONDUCTIVE CLOSURE FOR ELECTRONICS

Номер: US20180045906A1
Автор: CAMS Eddy Luc, DE JAEGERE Nicolas, DIEPSTRATEN Patrick Jacques, Standish Ian Miles
Принадлежит:

A closure () facilitates upgrading a network to extend optical fibers closer to, or all the way to, the subscribers by facilitating the transition between optical signals to electrical signals. The closure includes a base () and a cover () defining an interior; and a circuit board () disposed within the interior. A management tray () can be coupled to the base. The circuit board () includes the optoelectronic circuitry. The management tray () includes a platform () disposed between the circuit board () and the cover (). Various types of fiber and electrical cable sub-assemblies () can be received at a port () defined in the closure. 1. A closure for optoelectronic circuitry comprising:a base having a sidewall extending upwardly from a bottom, the sidewall defining a cable port;cooling pads are disposed at the bottom of the base;a cover that attaches to the base to close an interior of the closure; anda circuit board disposed within the interior of the closure, the circuit board including the optoelectronic circuitry.2. The closure of claim 1 , further comprising a cable sub-assembly configured to be sealingly coupled to the closure at the cable port claim 1 , the cable sub-assembly including an optical fiber cable and an electrical cable.3. The closure of claim 2 , wherein the cable sub-assembly includes a plurality of electrical cables.4. The closure of claim 2 , wherein the cable sub-assembly includes:an optical fiber cable including an optical fiber within a jacket, the optical fiber cable extending between a first end and a second end;a plurality of electrical cables including twisted pair conductors within jackets, the electrical cables extending between first and second ends; anda sealing arrangement disposed at an intermediate location along the cables, the sealing arrangement including a body and a gasket that to seal between the jackets of the cables and the body, the sealing arrangement also being configured to seal to a closure at a port defined by the ...

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Номер записи: 33
03-03-2022 дата публикации

ELECTRONIC ASSEMBLY AND OPTICAL COMMUNICATION COMPONENT

Номер: US20220066108A1
Автор: Chen Hsinyu, SUNG TAI-JUNG
Принадлежит:

An electronic assembly including first circuit board, second circuit board, and optical communication component. First circuit board includes first board and first connector. First connector is fixed on first board. Second circuit board includes second board and second connector. Second connector is fixed on second board. Optical communication component includes first communication card, first light-emitting component, second communication card, first photodetector and optical-fiber cable. First communication card is plugged into first connector. First light-emitting component is fixed on and electrically connected to first communication card. Second communication card is plugged into second connector. First photodetector is fixed on and electrically connected to second communication card. Two opposite ends of optical-fiber cable are respectively fixed to first communication card and second communication card to respectively be optically coupled to first light-emitting component and first photodetector.

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Номер записи: 34
13-02-2020 дата публикации

SHIELD CAGE ASSEMBLY

Номер: US20200049912A1
Автор: LU You-Qian
Принадлежит:

A shield cage assembly of the present disclosure comprises a metal shield shell and a heat dissipating module. The metal shield shell comprises a plurality of walls and an accommodating space defined by the plurality of walls, and the accommodating space has a front end port. The heat dissipating module is assembled to one of the walls of the metal shield shell, and the heat dissipating module comprises a heat dissipating base member, a first heat dissipating member provided to the heat dissipating base member and at least one clip sandwiched between the heat dissipating base member and the first heat dissipating member, and the clip engages with the metal shield shell, a bottom of the heat dissipating base member covers the wall of the metal shield shell to which the heat dissipating module is assembled. 1. A shield cage assembly , comprising:a metal shield shell composed of a metal plate, and the metal shield shell comprising a plurality of walls and an accommodating space defined by the plurality of walls and extending in a front-rear direction, the accommodating space having a front end port facing forwardly; anda heat dissipating module assembled to one of the plurality of walls of the metal shield shell, and the heat dissipating module comprising a heat dissipating base member, a first heat dissipating member provided to a top of the heat dissipating base member and at least one clip which is sandwiched between the heat dissipating base member and the first heat dissipating member and limited in position, and the clip engaging with the metal shield shell, a bottom of the heat dissipating base member covering the wall of the metal shield shell to which the heat dissipating module is assembled.2. The shield cage assembly of claim 1 , whereinthe wall of the metal shield shell to which the heat dissipating module is assembled is formed with an opening communicated with the accommodating space,the heat dissipating module further comprises a heat source contact ...

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Номер записи: 35
10-03-2022 дата публикации

OPTICAL TRANSCEIVER

Номер: US20220075133A1
Автор: LIN Jhen, SHIU Hsuan-Chen, YEH Che-Shou
Принадлежит:

An optical transceiver includes a housing, a heat dissipation module and an optical communication module. The heat dissipation module includes a first heat conductive component and a second heat conductive component accommodated in the housing. The first heat conductive component and the second heat conductive component are two independent components, and the first heat conductive component thermally contacts the second heat conductive component. The optical communication module is accommodated in the housing and thermally contacts the heat dissipation module. 1. An optical transceiver , comprising:a housing;a heat dissipation module comprising a first heat conductive component and a second heat conductive component accommodated in the housing, the first heat conductive component and the second heat conductive component being two independent components, and the first heat conductive component thermally contacting the second heat conductive component;an optical communication module accommodated in the housing and thermally contacting the heat dissipation module; andwherein a protrusion of the first heat conductive component extends toward a protrusion of the second heat conductive component, the protrusion of the second heat conductive component extends toward the protrusion of the first heat conductive component, and the protrusion of the first heat conductive component thermally contacts the protrusion of the second heat conductive component.2. The optical transceiver according to claim 1 , wherein the housing comprises an upper cover and a lower cover assembled together claim 1 , the first heat conductive component is located between the second heat conductive component and part of the upper cover claim 1 , the second heat conductive component is located between the first heat conductive component and part of the lower cover claim 1 , and the second heat conductive component thermally contacts the lower cover.3. The optical transceiver according to claim 2 , ...

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Номер записи: 36
03-03-2016 дата публикации

Connector For Receiving Plug and Connector Assembly

Номер: US20160062065A1
Автор: Benson Lucas A., Briant Eric David, Lu Jian, Sarraf David Bruce, WU HONGHAO, Xue Zaohai
Принадлежит:

A connector is provided and includes a cage, a plurality of partition devices, and a heat dissipation device. The cage includes a plurality of plug receiving units that are arranged in at least a two columns by two rows arrangement. The plurality of partition devices include an upper partition plate and a lower partition plate and is positioned between two adjacent plug receiving units of the plurality of plug receiving units. The heat dissipation device includes a heat conduction block positioned between the upper partition plate and the lower partition plate, and a heat conduction pipe that contacts the heat conduction block and extends beyond a rear wall of the cage. 1. A connector , comprising:a cage having a plurality of plug receiving units arranged in at least a two column by two row arrangement;a plurality of partition devices having an upper partition plate and a lower partition plate and positioned between two adjacent plug receiving units of the plurality of plug receiving units; anda heat dissipation device having:a heat conduction block positioned between the upper partition plate and the lower partition plate; anda heat conduction pipe contacting the heat conduction block and extending beyond a rear wall of the cage.2. The connector according to claim 1 , wherein the heat dissipation device includes a radiator rearward mounted on the outside of the cage and connected to the heat conduction pipe.3. The connector according to claim 2 , wherein the upper partition plate and the lower partition plate include an opening.4. The connector according to claim 3 , wherein upper and lower surfaces of the heat conduction block include a protrusion that passes through the opening and extends outside the upper partition plate and the lower partition plate.5. The connector according to claim 1 , wherein the heat conduction pipe contacts a side surface of the heat conduction block.6. The connector according to claim 5 , wherein the heat dissipation device further ...

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Номер записи: 37
03-03-2016 дата публикации

Cooling device, cooling structure, image projection device, and electronic device

Номер: US20160062219A1
Автор: Akihisa Mikawa, Hideo Kanai, Jun Mashimo, Satoshi Tsuchiya, Tetsuya Fujioka, Yasunari Mikutsu, Yukimi Nishi
Принадлежит: Ricoh Co Ltd

Disclosed is a cooling device including a blower including an exhaust port; and a radiator including heat radiation fins, wherein the heat radiation fins include a first heat dissipation area and a second heat dissipation area, wherein a first surface area of the heat radiation fins disposed in the first heat dissipation area is greater than that of the heat radiation fins disposed in the second heat dissipation area, wherein the exhaust port of the air blowing part includes first and second exhaust areas for exhausting cooling air, wherein an amount of the cooling air exhausted from the second exhaust area is greater than that of the first exhaust area, and wherein the first heat dissipation area is disposed in the first exhaust area, and the second heat dissipation area is disposed in the second exhaust area.

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Номер записи: 38
02-03-2017 дата публикации

OPTICAL MODULE

Номер: US20170059797A1
Автор: FUJISAKU Yoshiharu, TANABE Hiroyuki, UMEZAWA Masaaki
Принадлежит: FUJIKURA LTD.

An optical module includes: a butterfly-type optical device including a body that contains a heating element in an interior space, a lid body that puts a lid on the interior space, and a plurality of pins; a substrate including a connecting surface to which the plurality of pins are connected; and a heat-dissipating component arranged to the connecting surface side, wherein the optical device is connected to the connecting surface with a heat-dissipating surface, of a part that has been arranged with the heating element, oriented to the heat-dissipating component side, and with a gap provided to a side of the lid body opposite to a side of the interior space. 1. An optical module comprising: a body that contains a heating element in an interior space,', 'a lid body that puts a lid on the interior space, and', 'a plurality of pins;, 'a butterfly-type optical device including'}a substrate including a connecting surface to which the plurality of pins are connected; anda heat-dissipating component arranged to the connecting surface side, with a heat-dissipating surface, of a part that has been arranged with the heating element, oriented to the heat-dissipating component side, and', 'with a gap provided to a side of the lid body opposite to a side of the interior space., 'wherein the optical device is connected to the connecting surface'}2. An optical module according to claim 1 ,wherein an elastic member that dissipates heat is provided to be in contact with the heat-dissipating component between the heat-dissipating component and the heat-dissipating surface.3. An optical module according to claim 2 ,wherein a positioning part that positions the elastic member in a direction along the contacting surface is included.4. An optical module according to claim 2 ,wherein the body of the optical device is fixed with a screw from the heat-dissipating surface side, anda gap is provided between the screw and the heat-dissipating component.5. An optical module according to claim ...

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Номер записи: 39
17-03-2022 дата публикации

HEAT EXCHANGE ASSEMBLY FOR A PLUGGABLE MODULE

Номер: US20220082771A1
Автор: Galbraith Zachary, HARMON, III Dean Marlin, RITTER CHRISTOPHER DAVID, Sharf Alex Michael
Принадлежит:

A pluggable module includes a housing having a top wall including an opening above a module cavity. The pluggable module includes a heat exchange assembly separate and discrete from the housing extending into the module cavity through the opening. The heat exchange assembly includes a thermal bridge having an upper thermal interface and a lower thermal interface. The thermal bridge includes a plurality of interleaved plates arranged in a plate stack with the plates being movable relative to each other in the plate stack. The lower thermal interface is in thermal communication with the electrical component to dissipate heat from the electrical component. The thermal bridge extends through the opening with the upper thermal interface exposed from above for dissipating heat from the heat exchange assembly. 1. A pluggable module configured to be plugged into a cage of receptacle assembly , the pluggable module comprising:a housing having a top wall, a bottom wall and sidewalls between the top wall and the bottom wall, the housing forming a module cavity, the top wall having an opening above the module cavity, the housing having a mating end configured to be mated with a communication connector of the receptacle assembly;a module circuit board received in the module cavity, the module circuit board having an electrical component mounted to an upper surface of the module circuit board; anda heat exchange assembly separate and discrete from the housing, the heat exchange assembly being received in the opening and extending into the module cavity, the heat exchange assembly including a thermal bridge having an upper thermal interface and a lower thermal interface, the thermal bridge including a plurality of interleaved plates arranged in a plate stack with the plates being movable relative to each other in the plate stack, the lower thermal interface being in thermal communication with the electrical component to dissipate heat from the electrical component, the thermal ...

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Номер записи: 40
28-02-2019 дата публикации

Optical connector, electronic apparatus and optical interconnection system

Номер: US20190064458A1
Автор: Eiji Otani, Hiizu Ootorii, Shuichi Oka
Принадлежит: Sony Corp

An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.

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Номер записи: 41
08-03-2018 дата публикации

METHOD OF COOLING STACKED, PLUGGABLE OPTICAL TRANSCEIVERS

Номер: US20180067274A1
Автор: MACK Bonnie Lynne
Принадлежит:

An optical transceiver cooling assembly includes stacked cages mounted to a PCB. A heat radiator also is mounted on the PCB. Cooling devices (e.g., heat pipes) are coupled to the heat radiator and at least one of the cages. In some embodiments, the cages may include a divider that extends beyond the cage and is coupled to at least one of the cooling devices outside the cage. In some embodiments, the cooling devices extend into the cage and may be coupled together. 1. An assembly for cooling an optical transceiver , comprising:an optical transceiver cage having a first side wall, a second side wall, a back wall, and a vertical divider, the vertical divider extending from the first side wall to the second side wall;a thermally conductive device having a first end and a second end, wherein the first end of the first thermally conductive device is coupled to the vertical divider within the optical transceiver cage; anda heat radiator spaced from the optical transceiver cage, wherein the second end of the thermally conductive device is coupled to the heat radiator.2. The assembly of claim 1 , wherein the thermally conductive device is a heat pipe.3. The assembly of claim 2 , wherein the heat pipe is a solid composition.4. The assembly of claim 2 , wherein the heat pipe is partially solid and partially liquid.5. The assembly of claim 1 , wherein the heat radiator is a fin radiator.6. The assembly of claim 1 , wherein the heat radiator further comprises a first surface and a second surface opposite the first surface.7. The assembly of claim 6 , wherein the second end of the thermally conductive device is coupled to the first surface of the heat radiator.8. The assembly of claim 1 , wherein the thermally conductive device extends through at least one of the first side wall and the second side wall of the optical transceiver cage.9. The assembly of claim 8 , wherein the vertical divider extends outside the optical transceiver cage beyond at least one of the first side wall ...

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Номер записи: 42
11-03-2021 дата публикации

Systems and methods for providing heat-rejecting media on a cable assembly

Номер: US20210072472A1
Автор: Corey Dean Hartman, Jonathan Foster Lewis, Robert B. Curtis
Принадлежит: Dell Products LP

An active device module may include an active device, a housing configured to house the active device, and heat-rejecting media thermally coupled to the active device and mechanically coupled to the housing such that when the active device module is coupled to an input/output interface of an information handling system, at least a portion of the heat-rejecting media resides external to a chassis enclosing components of the information handling system such that physical shape and size of the heat-rejecting media is not constrained by the chassis.

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Номер записи: 43
11-03-2021 дата публикации

THERMAL MANAGEMENT OF PLUGGABLE OPTICAL TRANSCEIVER

Номер: US20210072473A1
Автор: JR. Franklin, WALL
Принадлежит:

Systems and devices for providing heat relief to an optical transceiver device are disclosed. The optical transceiver device includes a heat transfer structure that includes a heat slug connected to a high heat generating circuit in the optical transceiver device. The heat slug has a structure that allows heat to flow anisotropically from one surface of the heat slug that contacts the heat generating circuit to a second surface of the heat slug that is thermally coupled to a heat transfer device such as a heat sink. The perimeter of the heat slug is enclosed by an insulation frame. The insulation frame is configured to thermally isolate the heat slug by reducing heat transfer from the heat slug to other components of the optical transceiver device. 1. An apparatus comprising:a plurality of circuit regions comprising a first circuit region and a second circuit region operable to generate more heat than the first circuit region;a heat slug disposed above the second circuit region, the heat slug extending from the second circuit region to an exterior surface of the apparatus; andan insulation frame surrounding the heat slug adjacent to the exterior surface of the apparatus and configured to reduce heat transfer from the heat slug and second circuit region to the first circuit region.2. The apparatus of claim 1 , wherein a surface of the insulation frame is recessed from a surface of the heat slug.3. The apparatus of claim 1 , wherein a surface of the insulation frame is recessed from a surface of the heat slug by 120-130 micrometers.4. The apparatus of claim 1 , wherein:the heat slug comprises at least one of copper and tungsten; andthe heat slug is configured to transfer heat away from the second circuit region to another device having a temperature lower than a temperature of the second circuit region.5. The apparatus of claim 1 , wherein the heat slug is a heat spreader comprising an anisotropic carbon material that has a z-axis conductivity greater than a x-y plane ...

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Номер записи: 44
19-03-2015 дата публикации

OPTICAL TRANSMISSION MODULE

Номер: US20150078711A1
Автор: Ootorii Hiizu
Принадлежит:

An optical transmission module includes: a main substrate having a front surface and a back surface; an optical connector having a connector substrate; a first transparent substrate disposed between the connector substrate and the main substrate; a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate; one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate; a first special region preventing the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; and a second special region providing a function of transferring the heat generated from the heat source element and the first transparent substrate. 1. An optical transmission module comprising:a main substrate having a front surface and a back surface;an optical connector having a connector substrate;a first transparent substrate disposed between the connector substrate and the main substrate;a heat source element disposed between the connector substrate and the back surface of the main substrate, and electrically connected to the main substrate;one or a plurality of wirings electrically connecting the heat source element to the main substrate, and each configured to transfer heat generated from the heat source element and the first transparent substrate, to the main substrate;a first special region provided between the connector substrate and the first transparent substrate to prevent the heat generated from the heat source element and the first transparent substrate, from being transferred to the connector substrate; anda second special region provided between the heat source element and the back surface of the main substrate to provide a function of transferring the ...

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Номер записи: 45
16-03-2017 дата публикации

SLIDING THERMAL CONTACT FOR PLUGGABLE OPTIC MODULES

Номер: US20170075083A1
Автор: Flockton Dean, Moore David
Принадлежит:

Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules. 120-. (canceled)21. A cage assembly comprising:a cage for receiving an optical module; and a thermally conductive heat sink separated from the optical module by a gap; and', 'the thermal interface being mounted within an opening in a wall of the cage.', 'a thermal interface including thermally conductive fibers for extending into contact with the optical module,'}], 'a heat sink assembly, mounted on the cage, comprising22. The cage assembly of claim 21 , wherein the thermal interface is mounted on an underside of the thermally conductive heat sink.23. The cage assembly of claim 21 , further comprising:an insulating coating located on the thermally conductive fibers.24. The cage assembly of claim 21 , wherein the heat sink assembly covers at least half of the opening.25. The cage assembly of claim 21 , wherein the opening has an area of at least half of an area of the wall.26. The cage assembly of claim 21 , further comprising:an electrical connector mountable on a printed circuit board for electrically connecting the optical module to the printed circuit board.27. The cage assembly of claim 21 , further comprising:a plurality of additional cages for receiving a plurality of additional optical modules, respectively, 'a plurality of additional thermal interfaces, each of the plurality of additional thermal interfaces including thermally conductive fibers for extending into contact with a ...

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Номер записи: 46
07-03-2019 дата публикации

Connector system with thermal surface

Номер: US20190074618A1
Автор: Kent E. Regnier
Принадлежит: MOLEX LLC

A module can be configured to mate with a receptacle. The module includes a body with a thermal surface that is coupled to thermally active circuitry supported by the body. The receptacle is configured to allow air to flow over the thermal surface so as to dissipate thermal energy from the circuitry.

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Номер записи: 47
24-03-2022 дата публикации

Stacked-type optical communication module and manufacturing method thereof

Номер: US20220094138A1
Автор: Dae Seon KIM, Eun Kyoung JEON, Eun Kyu Kang, Jong Jin Lee, Kwon Seob Lim, Sang Jin Kwon, Soo Yong Jung, Won Bae KWON
Принадлежит: Electronics and Telecommunications Research Institute ETRI

A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.

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Номер записи: 48
12-06-2014 дата публикации

OPTICAL MODULE

Номер: US20140161408A1
Автор: Aoki Shinichi
Принадлежит: FUJITSU OPTICAL COMPONENTS LIMITED

An optical module includes a wiring board on which a first opening and a second opening are provided having, between the first and second openings, a traversing portion on which a signal wire is arranged, an optical component that is mounted on a first plane side of the first opening and the second opening of the wiring board and that generates heat, a heat sink arranged on a second plane side, which is on a reverse of the first plane side, of the first opening and the second opening of the wiring board, and an anisotropic heat dissipation sheet that is provided between the traversing portion and the heat sink, and the optical component, and that has a thermal conductivity higher in second directions, which cross the traversing portion in a plane orthogonal to first directions, than in the first directions, which are thickness directions of the wiring board. 1. An optical module , comprising:a wiring board on which a first opening and a second opening are provided having, between the first and second openings, a traversing portion on which a signal wire is arranged;an optical component that is mounted on a first plane side of the first opening and the second opening of the wiring board and that generates heat;a heat sink arranged on a second plane side, which is on a reverse of the first plane side, of the first opening and the second opening of the wiring board; andan anisotropic heat dissipation sheet that is provided between the traversing portion and the heat sink, and the optical component, and that has a thermal conductivity higher in second directions, which cross the traversing portion in a plane orthogonal to first directions, than in the first directions, which are thickness directions of the wiring board.2. The optical module according to claim 1 , wherein:the heat sink includes a first projection part inserted into the first opening of the wiring board and a second projection part inserted into the second opening of the wiring board.3. The optical module ...

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Номер записи: 49
12-06-2014 дата публикации

Thermally isolated multi-channel transmitter optical subassembly and optical transceiver module including same

Номер: US20140161457A1
Автор: Chong Wang, I-Lung Ho, Jun Zheng
Принадлежит: Applied Optoelectronics Inc

A thermally isolated multi-channel transmitter optical subassembly (TOSA) may be used in a multi-channel optical transceiver. The multi-channel TOSA generally includes an array of lasers optically coupled to an arrayed waveguide grating (AWG) to combine multiple optical signals at different channel wavelengths. The lasers, and possibly other components, are wire bonded to a thermal isolation bar. The thermal isolation bar provides an electrical connection to external circuitry and is thermally coupled to a temperature control device, such as a thermoelectric cooler (TEC). Thus, the thermal isolation bar electrically connects the lasers to the circuitry while preventing external heat from being conducted to the lasers from outside the TOSA. The optical transceiver may be used in a wavelength division multiplexed (WDM) optical system, for example, in an optical line terminal (OLT) in a WDM passive optical network (PON).

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Номер записи: 50
14-03-2019 дата публикации

METHOD OF MEASURING A TIME-VARYING SIGNAL EMISSION

Номер: US20190079248A1
Автор: HAGEN Norbert D., OPALSKY David
Принадлежит:

A method of measuring a time-varying signal emission, the method including subjecting the contents of a receptacle to a thermal cycling process. During the thermal cycling process, measuring a signal emission from the contents of the receptacle at regular time intervals and recording the measured signal emission and a time stamp at each time interval. Also during the thermal cycling process, determining a temperature of the thermal cycling process at regular time intervals and recording the determined temperature and a time stamp at each time interval. The measured signal emissions are synchronized with a specific temperature of the thermal cycling process by comparing the time stamps of the measured emission signals with the time stamps of the determined temperatures. 1. A method of measuring a time-varying signal emission , comprising:(a) subjecting the contents of a receptacle to a thermal cycling process;(b) during step (a), measuring a signal emission from the contents of the receptacle at regular time intervals and recording the measured signal emission and a time stamp at each time interval;(c) during step (a), determining a temperature of the thermal cycling process at regular time intervals and recording the determined temperature and a time stamp at each time interval; and(d) synchronizing the measured signal emissions with a specific temperature of the thermal cycling process by comparing the time stamps of the measured signal emissions with the time stamps of the determined temperatures.2. The method of claim 1 , wherein thermal cycling process is a PCR process.3. The method of claim 2 , wherein the thermal cycling process includes an annealing temperature and a denaturation temperature.4. The method of claim 3 , wherein the specific temperature is the denaturation temperature.5. The method of claim 4 , wherein the specific temperature is 95° C.6. The method of claim 2 , wherein each cycle of the thermal cycling reaction is a 60 second cycle.7. The ...

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Номер записи: 51
26-03-2015 дата публикации

Connector for plug, connector and heat conduction apparatus

Номер: US20150087180A1
Автор: Alex Cai, Helena Sun, Honghao Wu, Jason Yang, Tim Xue
Принадлежит: Tyco Electronics Shanghai Co Ltd

A connector for receiving a plurality of plugs is provided. The connector includes a cage, a plurality of partition plates, a plurality of partition sections, and a heat conduction apparatus. The cage includes a plurality of plug receiving passageways arranged along two rows stacked on top of each other. Each of the plurality of partition plates is positioned between two laterally adjacent plug receiving passageways of the plurality of plug receiving passageways, while each of the plurality of partition sections is positioned between two adjacent plug receiving passageways of the plurality of plug receiving passageways. The heat conduction apparatus penetrates through the plurality of partition sections along a width thereof.

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Номер записи: 52
24-03-2016 дата публикации

INTEGRATED CHIP PACKAGE WITH OPTICAL INTERFACE

Номер: US20160085038A1
Автор: Decker Patrick J., Hilton-Nickel Alan T., Raj Kannan
Принадлежит:

A chip package includes an integrated circuit and an optical integrated circuit (such as a hybrid integrated circuit) with an optical source and/or an optical receiver. The integrated circuit and the optical integrated circuit may be proximate to each other on opposite sides of an interposer in the chip package. Moreover, the integrated circuit may include a driver circuit of electrical signals for the optical source and/or a receiver circuit of electrical signals from the optical receiver. Furthermore, the optical integrated circuit may be positioned in a hole or an etch pit in a substrate, and an alignment feature may mechanically couple the substrate to an optical-fiber assembly, so that the optical-fiber assembly is positioned relative to the interposer and the optical integrated circuit. In particular, the optical-fiber assembly may partially overlap the interposer, so that optical signals are provided and/or received from the optical integrated circuit through the interposer. 1. A chip package , comprising:an integrated circuit having an end and a front surface with an integrated-circuit connector pad, wherein the integrated circuit includes at least one of: a driver circuit of an electrical signal for an optical source in an optical integrated circuit, and a receiver circuit of a second electrical signal from an optical receiver in the optical integrated circuit;an integrated-circuit electrical connector electrically coupled to the integrated-circuit connector pad;an interposer having an end, a top surface and a bottom surface, wherein the end of the interposer is horizontally displaced from the end of the integrated circuit, wherein the top surface faces the front surface and has a first interposer connector pad electrically coupled to the integrated-circuit electrical connector, and wherein the bottom surface is on an opposite side of the interposer from the top surface and has a second interposer connector pad electrically coupled to the first interposer ...

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Номер записи: 53
31-03-2022 дата публикации

HEAT SINK FOR PLUGGABLE OPTICAL MODULE WITH COMPRESSIBLE THERMAL INTERFACE MATERIAL

Номер: US20220099903A1
Автор: CHEN Yong Guo, TSAI Yao Tsan, YANG Hua
Принадлежит:

Aspects described herein include an apparatus comprising a receptacle comprising a cage dimensioned to receive a pluggable optical module into an interior volume, An opening is defined in an exterior surface of the cage. The apparatus further comprises a heat sink assembly rigidly attached to the cage. The heat sink assembly comprises a thermal interface material extending through the opening into the interior volume. The thermal interface material is configured to compress when the pluggable optical module is received into the interior volume and contacts the thermal interface material. 1. An apparatus comprising:a receptacle comprising a cage dimensioned to receive a pluggable optical module into an interior volume, wherein an opening is defined in an exterior surface of the cage; anda heat sink assembly rigidly attached to the cage, wherein the heat sink assembly comprises a thermal interface material extending through the opening into the interior volume, wherein the thermal interface material is configured to compress when the pluggable optical module is received into the interior volume and contacts the thermal interface material.2. The apparatus of claim 1 , wherein the heat sink assembly further comprises:a base attached to the thermal interface material, wherein the base is contoured such that the base extends through the opening into the interior volume when the heat sink assembly is rigidly attached to the cage.3. The apparatus of claim 1 , wherein the heat sink assembly further comprises:a base attached to the thermal interface material,wherein a surface area of the thermal interface material in an uncompressed state is greater than a surface area of the opening, andwherein lateral portions of the thermal interface material are compressed between the base and the cage when the heat sink assembly is rigidly attached to the cage.4. The apparatus of claim 1 , further comprising:one or more additional receptacles each configured to receive a respective ...

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Номер записи: 54
12-03-2020 дата публикации

Optical module

Номер: US20200081205A1
Автор: Dengqun Yu, Long Chen, Weilong Lee, Yuzhou SUN
Принадлежит: Innolight Technology Suzhou Ltd

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

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Номер записи: 55
12-03-2020 дата публикации

EMBEDDABLE MODULE FOR HIGH OUTPUT LED

Номер: US20200081241A1
Автор: Cook Michael, Davis Thomas, Epstein Michael S., Jones Carlton, Leo David, Root Thomas V.
Принадлежит:

In one aspect, a light module is disclosed, which includes a housing providing a hollow chamber extending from a proximal end to a distal end, and a lens positioned in the hollow chamber, where the lens has a lens body comprising an input surface for receiving light from a light source and an output surface through which light exits the lens body, said lens further comprising a collar at least partially encircling said lens body. The light module further includes at least one shoulder on which the lens collar can be seated for positioning the lens within the housing. A light source, e.g., an LED, is coupled to the hollow chamber, e.g., at its proximal end, for providing light to the lens. 144.-. (canceled)45. An adapter configured for removable and replaceable coupling to a light module , comprising:a housing having a plurality of external threads for engaging with a plurality of internal threads disposed at an end of the light module for coupling the adapter to the light module,said housing of the adapter having a central hollow channel for receiving at least a portion of a light guide.46. The adapter of claim 45 , wherein said housing further comprises an opening on a lateral surface thereof.47. The adapter of claim 46 , further comprising a retaining pin configured for being received in said opening for securing the light guide within the adapter.48. The adapter of claim 45 , wherein said hollow channel is substantially cylindrical.49. The adapter of claim 45 , wherein said light guide comprises an optical fiber.50. The adapter of claim 45 , wherein said light guide comprises a bundle of optical fibers.51. The adapter of claim 45 , wherein said light guide comprises a liquid light guide.52. The adapter of claim 45 , wherein said light module comprises a retaining window.53. The adapter of claim 52 , wherein said retaining window comprises a plurality of internal threads for engaging with said external threads of the housing of the adapter for coupling the adapter ...

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Номер записи: 56
23-03-2017 дата публикации

STACKED CAGE HAVING DIFFERENT SIZE PORTS

Номер: US20170085035A1
Автор: Briant Eric David, Shankar Nikhil
Принадлежит:

An electrical connector assembly includes a cage member having walls defining an upper port and a lower port configured to receive pluggable modules therein through a front end of the cage member. The cage member houses a communication connector at a rear of the cage member configured to be electrically connected to the pluggable modules received in the upper and lower ports. The walls are manufactured from a conductive material and providing electrical shielding for the pluggable modules. The plurality of walls include side walls, a top wall between the side walls, a bottom wall between the side walls and a divider wall between the side walls. The divider wall separates the upper port from the lower port. The divider wall is positioned closer to the top wall than the bottom wall such that the lower port is taller than the upper port. 1. An electrical connector assembly comprising:a cage member having a plurality of walls defining an upper port and a lower port configured to receive identical pluggable modules therein through a front end of the cage member, the cage member housing a communication connector at a rear of the cage member configured to be electrically connected to the pluggable modules received in the upper and lower ports, the walls being manufactured from a conductive material and providing electrical shielding for the pluggable modules;the plurality of walls comprising side walls, a top wall between the side walls, a bottom wall between the side walls and a divider wall between the side walls, the divider wall separating the upper port from the lower port, the divider wall being positioned closer to the top wall than the bottom wall such that the lower port is taller than the upper port.2. The electrical connector assembly of claim 1 , wherein the lower port allows more airflow therethrough than the upper port.3. The electrical connector assembly of claim 1 , wherein the divider wall is positioned a first distance from the bottom wall and a second ...

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Номер записи: 57
25-03-2021 дата публикации

Apparatus and method for thermal dissipation of photonic transceiving module

Номер: US20210088738A1
Автор: Brian Taylor, Chris Togami, Gary Sasser, Radhakrishnan L. Nagarajan
Принадлежит: Inphi Corp

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

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Номер записи: 58
25-03-2021 дата публикации

APPARATUS AND METHOD FOR THERMAL DISSIPATION OF PHOTONIC TRANSCEIVING MODULE

Номер: US20210088739A1
Автор: Nagarajan Radhakrishnan L., SASSER Gary, Taylor Brian, Togami Chris
Принадлежит:

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet. 1. An apparatus for dissipating heat from a photonic module comprising:a top-plate member disposed in a length direction of a package for the photonic module;multiple fins with one length formed on the top-plate member along the length direction of the package for the photonic module from a backend position of the multiple fins near a middle of the top-plate member to a frontend position except that an elongated void is formed from the backend position of the multiple fins to one backend of at least one fin of the multiple fins with a shorter length;a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of a backend of the horizontal sheet; anda spring loaded in the elongated void between the flange and the one backend of the at least one fin of the multiple fins for naturally pushing the cover member to slide backward beyond the backend position of the multiple fins until the backend of the horizontal sheet is stopped against an internal thermal dissipation equipment.2. The apparatus of ...

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Номер записи: 59
31-03-2016 дата публикации

System and method of fiber distribution

Номер: US20160091684A1
Автор: Dirk Kempeneers, Gerd Van Cauteren
Принадлежит: TYCO ELECTRONICS RAYCHEM BVBA

A closure ( 15 ) is installed at a network distribution point to facilitate upgrading a subscriber network ( 10 ) to extend optical fibers closer to the subscribers ( 18 ). The closure ( 15 ) may include active equipment to convert optical signals to electrical signals. The closure ( 15 ) enables a plug-and-play connection to the active equipment to facilitate installing and/or upgrading active equipment at the closure ( 15 ). The closure ( 15 ) also is expandable to enable drop cables (or other optical cable) to be routed from the closure ( 15 ) towards the subscribers ( 18 ).

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Номер записи: 60
05-05-2022 дата публикации

Device for Transferring Heat Between a First Module and a Second Module

Номер: US20220137311A1
Автор: Fredrik Ohlsson
Принадлежит: Huawei Technologies Co Ltd

The disclosure relates to a device for transferring heat between a second module, for example an optical transceiver module, and a first module, for example a heat sink. The device comprises a holder for holding the second module, a first unit configured to be thermally coupled to the first module, and a second unit which is urged against the second module placed in the holder by a biasing apparatus. The first and second units are thermally coupled to one another through a plurality of protrusions of the first or second unit and a plurality of complementary cavities of the other of the first and second unit.

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Номер записи: 61
05-05-2022 дата публикации

HEAT SINK FOR OPTICAL MODULE

Номер: US20220141990A1
Автор: Emmareddy Narasimha Reddy, Giobbio Giovanni, Gupta Rohit Dev, Shivashankara Manjunatha Reddy, Vadivazhagan Suresh Kumar
Принадлежит: CISCO TECHNOLOGY, INC.

In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

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Номер записи: 62
19-03-2020 дата публикации

Optical power transfer devices with an embedded active cooling chip

Номер: US20200091677A1
Автор: Christopher Valdivia, Denis Masson, Ercan M. Dede, Karin Hinzer, Matthew Wilkins, Philippe-Olivier Provost, Simon Fafard
Принадлежит: Broadcom Inc, Toyota Motor Engineering and Manufacturing North America Inc, UNIVERSITY OF OTTAWA

An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.

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Номер записи: 63
19-03-2020 дата публикации

TELECOMMUNICATIONS ENCLOSURE WITH SEPARATE HEAT SINK ASSEMBLY

Номер: US20200093034A1
Автор: Murray David Patrick, Taylor Christopher Charles, Thomas David
Принадлежит:

Disclosed herein is a telecommunications enclosure. The telecommunications enclosure includes a housing defining an interior and including at least one cable port. The telecommunications enclosure also includes a printed circuit board in the interior of the housing and heat generating components on the printed circuit board. The telecommunications enclosure further includes a heat sink assembly in the interior of the housing. The heat sink assembly includes a thermally conductive plate mounted to transfer heat to the housing; and heat sink components extending from a first face of the thermally conductive plate. Each heat sink component corresponds to and is in alignment with one of the heat generating components. The heat sink assembly is a separate component from the housing. 1. A telecommunications enclosure , comprising:a housing defining an interior and including at least one cable port;a printed circuit board in the interior of the housing;heat generating components on the printed circuit board; and 'a thermally conductive plate mounted to transfer heat to the housing;', 'a heat sink assembly in the interior of the housing, the heat sink assembly comprising 'heat sink components extending from a first face of the thermally conductive plate, each heat sink component corresponding to and being in alignment with one of the heat generating components,', 'and'}wherein the heat sink assembly is a separate component from the housing.2. The telecommunications enclosure of claim 1 , wherein the thermally conductive plate is in contact with the housing.3. The telecommunications enclosure of claim 1 , wherein a heat pad is located between each heat generating component and each heat sink component and is in contact with the heat generating component and the heat sink component.4. The telecommunications enclosure of claim 1 , wherein the housing is sealed from an external environment.5. The telecommunications enclosure of claim 1 , wherein the housing has a construction ...

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Номер записи: 64
26-03-2020 дата публикации

Optical Module Structure and Fabrication Method for Optical Module Structure

Номер: US20200096715A1
Автор: DONG Zhen, Liu Jun, Song Xiaolu, Zeng Li, Zhao Qing
Принадлежит:

An optical module structure includes a substrate, an optical chip and an electrical chip that are fixedly coupled to the substrate. The optical module structure further includes an optical coupling structure fixedly coupled to the optical chip. A side of the optical chip that faces the substrate has a first reference plane, and at least one first alignment mark is provided on the first reference plane. The optical coupling structure has a second reference plane, and at least one second alignment mark is provided on the second reference plane. The first reference plane is aligned with the second reference plane, and the first alignment mark is aligned with the second alignment mark. 1. An optical module structure , comprising:a substrate;an optical chip fixedly coupled to the substrate wherein a first side of the optical chip facing the substrate comprises a first reference plane that comprises a first alignment mark;an electrical chip fixedly coupled to the substrate; andan optical coupling structure fixedly coupled to the optical chip, wherein the optical coupling structure comprises a second reference plane that is aligned with the first reference plane and that comprises a second alignment mark that is aligned with the first alignment mark.2. The optical module structure of claim 1 , wherein the optical coupling structure further comprises a first vertical plane perpendicular to the second reference plane claim 1 , wherein the optical chip is optically coupled to the optical coupling structure claim 1 , and wherein the first vertical plane is aligned with an end face on a second side of the optical chip facing the optical coupling structure.3. The optical module structure of claim 2 , wherein the optical coupling structure and the optical chip are coupled using evanescent wave coupling claim 2 , edge coupling claim 2 , or vertical coupling.4. The optical module structure of claim 3 , wherein the optical coupling structure and the optical chip are coupled using ...

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Номер записи: 65
08-04-2021 дата публикации

COMMUNICATION MODULE ENGAGEMENT

Номер: US20210103108A1
Автор: Gavrilovic Paul, JR. Franklin, Shakespeare Walter, WALL
Принадлежит:

An optical transceiver having a locking assembly that prevents undesirable movement of the optical transceiver when engaged with another device is described. The locking assembly includes a slide with a projection, lift, and weighted stops. In a first configuration, the slide and weighted stops can sustain contact between a thermal interface material of the optical transceiver and the other device while locking the optical transceiver to prevent movement. In a second configuration mode, the locking assembly disengages the thermal interface material from the other device and unlocks the weighted stops to permit disconnection from the other device. 1. A device comprising:a shell configured to provide a cover for the device and comprising a projection receptacle;a slide configured to slide along a surface of the shell and comprising a projection that is configured (i) to be located in the projection receptacle in a first mode in which a thermal interfacing structure is contacting a heat-transferring device, and (ii) to be located outside the projection receptacle in a second mode in which the thermal interfacing structure is not contacting the heat-transferring device; anda lift disposed on the slide and configured to be separated by a distance from the heat-transferring device in the first mode and to be elevated to contact the heat-transferring device in the second mode.2. The device of claim 1 , further comprising:a cam lever having a first position corresponding to the first mode and a second position corresponding to the second mode,wherein a first portion of the slide is attached to the cam lever and a second portion of the slide is configured to adjust an elevation level of the lift.3. The device of claim 2 , wherein:the first position of the cam lever is substantially perpendicular to the second position of the cam lever; andin the second mode, a top surface of the lift is higher than a top surface of the thermal interfacing structure relative to the surface of ...

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Номер записи: 66
21-04-2016 дата публикации

OPTICAL MODULE WITH GLASS SLIDE

Номер: US20160109665A1
Автор: CHANG CHUN-YI, LIU JIA-HAU
Принадлежит:

An optoelectronic assembly includes a printed circuit board (PCB), a glass carrier positioned upon the PCB and equipped with thereon an active component and an Integrated Circuit (IC) linked to each other via the flip chip technology, an optical waveguide embedded within the PCB, and a ferrule located around the optical waveguide to couple an external optical device thereto for optical transmission therebetween. 1. An optoelectronic assembly comprising:a printed circuit board (PCB);a carrier mounted upon the PCB in a vertical direction;an active component for optoelectronic conversion mounted upon the carrier with a heat dissipation surface opposite to the PCB and exposed to an exterior; andan integrated circuit (IC) mounted upon the carrier and electrically connected to the active component via conductive traces.2. The optoelectronic assembly as claimed in claim 1 , wherein the carrier is equipped with a first lens aligned with the active component in the vertical direction claim 1 , and a second lens is formed on the PCB aligned with the first lens in the vertical direction for light transmission therebetween.3. The optoelectronic assembly as claimed in claim 2 , wherein the PCB is equipped with an optical waveguide extending along a horizontal direction perpendicular to said vertical direction claim 2 , and said waveguide is coupled to the second lens via a reflector embedded within a recess of the PCB.4. The optoelectronic assembly as claimed in claim 3 , wherein a ferrule is provided on one end of the PCB around said waveguide to form an optical connection port.5. The optoelectronic assembly as claimed in claim 4 , wherein the PCB forms conductive pads as an electrical connection port which is opposite to an optical connection port wherein6. The optoelectronic assembly as claimed in claim 1 , wherein the carrier is made from glass.7. The optoelectronic assembly as claimed in claim 1 , wherein the carrier and the IC are mounted upon the carrier via soldering.8. ...

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Номер записи: 67
21-04-2016 дата публикации

Methods for determining receiver coupling efficiency, link margin, and link topology in active optical cables

Номер: US20160109667A1
Автор: David A. Langsam, Eric Jean ZBINDEN, Joshua R. CORNELIUS, William J. Kozlovsky
Принадлежит: Samtec Inc

A method for determining receiver coupling efficiency includes varying optical power inputted into a half active optical cable to determine a maximum optical power at which the TIA squelches and determining a receiver coupling efficiency by calculating a ratio of a threshold optical power to the maximum optical power at which the TIA squelches. A method of determining link loss in a channel includes varying optical power of a light source to determine the maximum optical power at which the TIA squelches and determining the link loss in the channel by subtracting the maximum optical power from the threshold optical power. A method of determining link topology includes selecting a pattern of optical powers and matching a pattern of squelched and non-squelched outputs with the pattern of optical power. An active optical cable includes memory storing a value related to an initial link loss of the active optical cable.

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Номер записи: 68
21-04-2016 дата публикации

Optical Module Heat Dissipation Structure and Electronic Product

Номер: US20160109670A1
Автор: Huang Shuliang, Liu Zaomeng, Zhai Liqian
Принадлежит:

An optical module heat dissipation structure, disposed inside an enclosure, where the optical module heat dissipation structure includes an optical module, an elastic component, a fixed wall, and a heat dissipation wall, where the fixed wall and the heat dissipation wall are both connected to the enclosure, the optical module is disposed between the fixed wall and the heat dissipation wall, the elastic component elastically abuts between the fixed wall and the optical module, and elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure. An electronic product is further provided where the electronic product includes the optical module heat dissipation structure. 1. An optical module heat dissipation structure , disposed inside an enclosure , wherein the optical module heat dissipation structure comprises:an optical module;an elastic component;a fixed wall; anda heat dissipation wall,wherein the fixed wall and the heat dissipation wall are both connected to the enclosure,wherein the optical module is disposed between the fixed wall and the heat dissipation wall,wherein the elastic component elastically abuts between the fixed wall and the optical module, andwherein elasticity of the elastic component makes the optical module tightly cling to the heat dissipation wall, to improve the heat dissipation efficiency of the optical module heat dissipation structure.2. The optical module heat dissipation structure according to claim 1 , wherein a joint portion is provided at a front end of the optical module claim 1 , wherein a first lamination portion is provided at a back end of the optical module claim 1 , wherein the joint portion penetrates the fixed wall to extend out of the enclosure claim 1 , and wherein the first lamination portion tightly clings to the heat dissipation wall.3. The optical module heat dissipation structure ...

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Номер записи: 69
20-04-2017 дата публикации

PHOTONIC PACKAGE ARCHITECTURE

Номер: US20170108655A1
Автор: Mallik Debendra, Zarbock Edward A.
Принадлежит:

A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described. 1. A method , comprising:forming a photon emitter on the front side of a die; andforming a beam path on the front side of the die and positioned to direct a beam of photons from the photon emitter on the front side of the die, through the semiconductor material of the body of the die, and to the backside of the die.2. The method of wherein the beam path forming includes forming a first mirror on the front side of the die and positioned to reflect a beam of photons from the photon emitter on the front side of the die claim 1 , through the semiconductor material of the body of the die claim 1 , and to the backside of the die.3. The method of wherein the photon emitter forming includes doping semiconductor regions on the front side of the die.4. The method of wherein the first mirror forming includes etching a beveled surface at the front side of the die and depositing photon reflective metal on the beveled surface.5. The method of wherein the photon emitter is a laser.6. A method claim 1 , comprising:coupling an optical coupler to the backside of a first die having a photon emitter on the front side of the first die, and a beam path on the front side of the first die and positioned to direct a beam of photons from the photon emitter on the front side of the first die, and through the semiconductor material of the body of the first die, and to the backside of the first die;wherein said coupling includes positioning the optical coupler to receive the beam of photons from the backside of the first die.7. The method of wherein the beam path of the first die includes a first mirror on the front side of the ...

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Номер записи: 70
02-04-2020 дата публикации

OPTICAL TO ELECTRICAL CONVERSION MODULE

Номер: US20200107087A1
Автор: Berkram Daniel Alan, Morris Terrel, NORTON John
Принадлежит:

A pluggable module is provided for converting an optical signal to a plurality of electrical signals. The pluggable module may include a printable circuit board (PCB) and an optical connector disposed on a first side of the PCB. The optical connector may route any received optical signal to an optical to electrical transceiver. The optical to electrical transceiver may convert the optical signal to an electrical signal and route the electrical signal to an electrical connector mounted on a second, opposite side of the PCB. 1. A pluggable module comprising:a printable circuit board (PCB);an optical connector mounted on a first side of the PCB, the optical connector configured to receive a plurality of optical signals, and to route the signals to an optical to electrical transceiver via a photonic cable across the first side of the PCB;the optical to electrical transceiver configured to receive the plurality of optical signals and convert the optical signals into split electrical signals; anda plurality of electrical connectors disposed on a second side of the PCB opposite the first side, each electrical connector configured to receive at least some of the split electrical signals from the optical to electrical transceiver and to absorb heat generated by the optical to electrical transceiver.2. The pluggable module of claim 1 , wherein the optical to electrical transceiver is mounted on the first side of the PCB.3. (canceled)4. The pluggable module of claim 3 , wherein the PCB further includes a via that extends through the PCB from the first side to the second side of the PCB and is disposed adjacent to a first electrical connector of the electrical connectors to transfer heat from the optical to electrical transceiver to the first electrical connector.5. The pluggable module of claim 1 , wherein the electrical connectors are Quad Small Form-factor Pluggable (QSFP) connectors including a plurality of channels.6. The pluggable module of claim 1 , further comprising a ...

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Номер записи: 71
09-06-2022 дата публикации

HEAT DISSIPATION IN AN OPTICAL DEVICE

Номер: US20220179055A1
Автор: Ferrara James, LIN Sen
Принадлежит:

A thermal-optical phase shifter includes a substrate layer, a cladding layer, and a beam in the cladding layer. The thermal-optical phase shifter includes a waveguide and a heating element disposed in the beam. The thermal-optical phase shifter includes a thermally conductive structure disposed on the cladding layer to disperse heat from the beam. The thermally conductive structure may include a metal strip disposed longitudinally along the beam, may include thermally conductive pads, and/or may include thermally conductive vias coupled between the cladding layer and the substrate layer. The thermal-optical phase shifter may be incorporated into light detection and ranging (LIDAR) devices, telecommunications devices, and/or computing devices. 1. A thermal-optical phase shifter comprising:a beam formed in a cladding layer and suspended over a cavity;a waveguide at least partially disposed in the beam;a heating element at least partially disposed in the beam; anda thermally conductive strip disposed on the beam, wherein the thermally conductive strip is arranged to disperse heat from the beam.2. The thermal-optical phase shifter of further comprising:a plurality of lateral arms configured to suspend the beam over the cavity, wherein each of the plurality of lateral arms is coupled between the beam and a remaining portion of the cladding layer.3. The thermal-optical phase shifter of claim 2 , wherein at least two of the plurality of lateral arms on a first side of the beam are isolated by first openings in the cladding layer claim 2 , wherein at least two of the plurality of lateral arms on a second side of the beam are isolated by second openings in the cladding layer claim 2 , wherein each of the plurality of lateral arms is formed in the cladding layer.4. The thermal-optical phase shifter of further comprising:a plurality of thermally conductive pads disposed on the cladding layer; anda plurality of thermally conductive fingers respectively coupled between the ...

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Номер записи: 72
09-06-2022 дата публикации

PHOTONIC COMPUTING PLATFORM

Номер: US20220179159A1
Автор: Chen Hui, Chen Junjie, Meng Huaiyu, Shen Yichen, Su Zhan, Wu Jianhua
Принадлежит:

A method for assembling a photonic computing system includes attaching a photonic source to a support structure, and attaching a photonic integrated circuit to the support structure. The photonic source includes a first laser die on a substrate configured to provide a first optical beam, and a second laser die on the substrate configured to provide a second optical beam. The photonic integrated circuit includes a first waveguide and a first coupler coupled to the first waveguide, and a second waveguide and a second coupler coupled to the second waveguide. The method includes attaching a plurality of beam-shaping optical elements to the support structure, the substrate, or the photonic integrated circuit, in which the attaching includes aligning a first beam-shaping optical element during attachment so that the first optical beam is coupled to the first coupler, and aligning a second beam-shaping optical element during attachment so that the second optical beam is coupled to the second coupler. 1. A method for assembling a photonic computing system , the method comprising: a first laser die on a substrate and configured to provide a first optical beam, and', 'a second laser die on the substrate and configured to provide a second optical beam;, 'attaching a photonic source to a support structure, the photonic source comprising a first waveguide and a first coupler coupled to the first waveguide, and', 'a second waveguide and a second coupler coupled to the second waveguide; and, 'attaching a photonic integrated circuit to the support structure, the photonic integrated circuit comprising providing, using the first laser die, the first optical beam,', 'aligning a first beam-shaping optical element during attachment so that the first optical beam is coupled to the first coupler, and', 'providing, using the second laser die, the second optical beam,', 'aligning a second beam-shaping optical element during attachment so that the second optical beam is coupled to the second ...

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Номер записи: 73
27-04-2017 дата публикации

Extension Device For Transceiver

Номер: US20170115460A1
Автор: KIM Byung In, PARK Sang Cheon
Принадлежит:

Some embodiments of the present disclosure provide a transceiver extension device. A transceiver extension device is provided for connection with an enclosure including a cage for a circuit board and a transceiver. The transceiver extension device includes an extension cage configured to accommodate the transceiver, an extension connector configured to be inserted into the cage of the enclosure, and an extension circuit board configured to transmit a signal of a second transceiver to the circuit board in the enclosure. 1. A transceiver extension device for connection with an enclosure including a cage for a circuit board and a transceiver , the transceiver extension device , comprising:an extension cage configured to accommodate the transceiver;an extension connector configured to be inserted into the cage of the enclosure; andan extension circuit board configured to transmit a signal of the transceiver to a second circuit board in the enclosure.2. The transceiver extension device of claim 1 , wherein the extension circuit board is configured to have a pluggable connector in an electrical connection claim 1 , andwherein the pluggable connector is disposed inside the extension cage and is configured to be connected to the transceiver.3. The transceiver extension device of claim 1 , wherein the extension connector comprises:an insertion portion to be inserted into the cage of the enclosure; anda base portion configured to be fixedly coupled with the extension cage.4. The transceiver extension device of claim 3 , wherein the base portion of the extension connector envelopes the left and right sides and the bottom of the extension cage claim 3 , andwherein the extension circuit board is located under the extension cage and between the extension cage and the base portion.5. The transceiver extension device of claim 3 , wherein the extension circuit board extends from the base portion to the insertion portion so as to deliver a signal of the transceiver to the second ...

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Номер записи: 74
18-04-2019 дата публикации

Integrated Heat Sink and Optical Transceiver Including the Same

Номер: US20190113698A1
Автор: Chen Jianhua, Cui Ping, Huang Yu, Tian Chao, WAINWRIGHT Wayne, ZHANG Shengzhong
Принадлежит: SOURCE PHOTONICS, INC.

Embodiments of the disclosure pertain to an optical or optoelectronic transceiver comprising an optical or optoelectronic receiver, an optical or optoelectronic transmitter, a plurality of electrical devices, a housing, and a heat sink having a non-planar surface. The optical or optoelectronic receiver includes a receiver optical subassembly (ROSA). The optical or optoelectronic transmitter includes a transmitter optical subassembly (TOSA). The electrical devices are configured to provide or control one or more functions of the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing is over and/or enclosing the optical or optoelectronic receiver and the optical or optoelectronic transmitter. The housing includes a first section and a second section, and is configured to (a) be removably insertable into a cage or socket of a host device and (b) position the first section of the housing outside the cage or socket when the housing is inserted in the cage or socket. The heat sink is over or adjacent to the first section of the housing and is in thermal contact with the housing. 1. An optical or optoelectronic transceiver , comprising:an optical or optoelectronic receiver, comprising a receiver optical subassembly (ROSA);an optical or optoelectronic transmitter, comprising a transmitter optical sub assembly (TOSA);a plurality of electrical devices, each configured to provide or control one or more functions of the optical or optoelectronic receiver and the optical or optoelectronic transmitter;a small form factor-compliant housing over and/or enclosing the optical or optoelectronic receiver and the optical or optoelectronic transmitter, the small form factor-compliant housing having a first section and a second section and being configured to (a) be removably insertable into a cage or socket of a host or storage device and (b) position the first section of the small form factor-compliant housing outside the cage or socket when the ...

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Номер записи: 75
07-05-2015 дата публикации

OPTICAL TRANSMISSION DEVICE AND MANUFACTURING METHOD THEREOF

Номер: US20150125123A1
Автор: Hoshiyama Naoto, Yoshizumi Takahisa
Принадлежит: FUJITSU LIMITED

An optical transmission device includes: a first cage and a second cage provided in parallel on a top surface of a substrate, into which modules connectable to an optical transmission path are inserted, respectively; a first heat sink including: a first main body arranged along surfaces of the first cage and the second cage at the opposite side to the substrate, and a first plate member rising from a bottom surface of the first main body which faces the substrate, and arranged between the first cage and the second cage. 1. An optical transmission device comprising:a first cage and a second cage provided in parallel on a top surface of a substrate, into which modules connectable to an optical transmission path are inserted, respectively;a first heat sink including:a first main body arranged along surfaces of the first cage and the second cage at the opposite side to the substrate, anda first plate member rising from a bottom surface of the first main body which faces the substrate, and arranged between the first cage and the second cage.2. The optical transmission device according to claim 1 , further comprising:a heat transfer plate having a first surface on which the substrate is arranged in a state where the first surface faces a bottom surface of the substrate at the opposite side to the top surface of the substrate; anda first guide pin and a second guide pin provided, on the first surface of the heat transfer plate, on both end portions of the heat transfer plate which exclude a region where the substrate is arranged, rising from the first surface, and being longer than a separation distance from the top surface of the substrate to the surfaces of the first cage and the second cage at the opposite side to the substrate,wherein the first heat sink further includes a first pedestal portion rising from the bottom surface of the first main body at one end portion of the first main body in a direction perpendicular to the first plate member, and a second pedestal ...

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Номер записи: 76
13-05-2021 дата публикации

CONNECTOR ASSEMBLY

Номер: US20210141175A1
Автор: Duan Bai-Yu, Wang Xiao-Kai, Wu Xiao-ping, Zhang You-Rui
Принадлежит: Dongguan Luxshare Technologies Co., Ltd

A connector assembly includes housing and one or more light guide members. Each light guide member includes a tube body, an extension column, a positioning member, and a fixing member. The tube body is located on the housing. The extension column extends downward from the tube body to a rear side of the housing. The positioning member is located on the extension column and inserted into a rear wall of the housing. The fixing member is located on the extension column and inserted into the rear wall. The fixing member includes a first bump protruding from the extension column toward the rear wall and a hook structure located on the first bump. When each light guide member is assembled onto the housing, the first bump is inserted into the rear wall, and the hook structure is hooked into the rear wall. 1. A connector assembly , comprising:a housing having an insertion cavity; andat least one light guide member, each comprising:a tube body located on the housing;an extension column extending downward from the tube body to a rear side of the housing;a positioning member located on the extension column and inserted into a rear wall of the housing; anda fixing member located on the extension column and inserted into the rear wall of the housing, wherein the fixing member comprises a first bump protruding from the extension column toward the rear wall of the housing and a hook structure located on the first bump, and when each of the at least one light guide member is assembled onto the housing, the first bump is inserted into the rear wall of the housing, and the hook structure is hooked into the rear wall of the housing.2. The connector assembly according to claim 1 , wherein the extension column of each of the at least one light guide member has a single one of the fixing member.3. The connector assembly according to claim 1 , wherein the positioning member of each of the at least one light guide member does not have the hook structure.4. The connector assembly according ...

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Номер записи: 77
18-04-2019 дата публикации

CONNECTOR SYSTEM WITH THERMAL MANAGEMENT

Номер: US20190115677A1
Автор: Kachlic Jerry D.
Принадлежит: Molex, LLC

A connector system includes a cage with an intermediate section. The cage support a connector and the resulting connector system includes an upper port and a lower port. A heat sink is provided in the intermediate section that is configured to cool a module inserted into the lower port. Apertures can allow air to flow through the connector system so as to allow for improved cooling by more directly cooling the inserted module. The heat sink can be urged into the lower port by a biasing element. 1. A connector system , comprising:a cage with a front face, a rear face and two opposing sides that extend between the front and rear face, the cage including an intermediate section that includes an upper wall and a lower wall, the upper and lower walls helping to define an upper port and a lower port in the cage, the lower wall including a hole formed therein so that the intermediate section is in communication with the lower port;a connector positioned in the cage, the connector including a first row of cantilevered contacts in the upper port and a second row of cantilevered contacts in the lower port; anda biased heat sink disposed in the intermediate section between the upper and lower ports, the biased heat sink extending through the hole into the lower port, wherein a mounting bracket is disposed on the heat sink and is configured to engage the upper wall in urging the heat sink against the lower wall.2. The connector system of claim 1 , wherein the mounting bracket is attached to the heat sink.3. The connector system of claim 2 , wherein the mounting bracket includes a biasing element that urges the heat sink into the lower port.4. The connector system of claim 1 , wherein the biased heat sink includes a flat surface that is urged into the lower port.5. The connector system of claim 4 , wherein the biased heat sink includes a plurality of fins claim 4 , the fins arranged in a plurality of pillars.6. The connector system of claim 1 , wherein the intermediate section ...

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Номер записи: 78
18-04-2019 дата публикации

Cage receptacle assembly with heat dissipation units

Номер: US20190115684A1
Автор: Ayal SHABTAY, Aziz MAZBAR, Beeri HALACHMI, Kfir Katz, Michal SHLOMAI, Nimer Khazen, Oren WELTSCH, Tom David, Yaniv Kazav
Принадлежит: MELLANOX TECHNOLOGIES LTD

Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions of the top cage member, and the bottom cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the bottom cage member, and the heat dissipation unit includes one or more heat dissipation elements allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.

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Номер записи: 79
05-05-2016 дата публикации

OPTICAL CONNECTION TECHNIQUES AND CONFIGURATIONS

Номер: US20160124166A1
Автор: Braunisch Henning, Chang Peter L., Liff Shawna M.
Принадлежит:

Embodiments of the present disclosure provide optical connection techniques and configurations. In one embodiment, an apparatus includes a receptacle for mounting on a surface of a package substrate, the receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned with one or more optical apertures of an optoelectronic assembly that is configured to emit and/or receive light using the one or more optical apertures in a direction that is substantially perpendicular to the surface of the package substrate when the optoelectronic assembly is affixed to the package substrate. Other embodiments may be described and/or claimed. 1. A method , comprising:depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate; an optoelectronic assembly configured to emit and/or receive optical signals in the form of light for a processor, the optoelectronic assembly having one or more optical apertures that emit and/or receive the light in a direction that is substantially perpendicular to the surface of the package substrate, and', 'a receptacle having a pluggable surface to receive an optical coupler plug such that an optical coupler plug is optically aligned to route the light to or from the one or more optical apertures of the optoelectronic assembly when the, 'positioning the components for attachment to the package substrate, the components including at least'}optical coupler plug is plugged into the receptacle; andreflowing the deposited solder interconnect material to form a bond between the components and the package substrate.2. The method of claim 1 , wherein depositing the solder interconnect material includes depositing solder interconnect material on the surface of the package substrate.3. The method of claim 1 , wherein positioning the components is performed using a pick-and-place process.4. The method of claim 1 , wherein reflowing the deposited ...

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Номер записи: 80
09-04-2020 дата публикации

Optical transceiver and housing thereof

Номер: US20200112373A1
Автор: Chien-Te Lin, Ming-Hsing Chung, Ming-You Lai
Принадлежит: Prime World International Holdings Ltd

An optical transceiver includes a housing and an optical transceiving module. The housing includes a main body and a heat conductive component. The heat conductive component is disposed on the main body, and a thermal conductivity of the heat conductive component is larger than a thermal conductivity of the main body. The optical transceiving module is disposed in an accommodation space of the main body of the housing.

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Номер записи: 81
03-05-2018 дата публикации

Devices with Optical Ports in Fan-Out Configurations

Номер: US20180120524A1
Автор: Mathai Sagi, Rosenberg Paul Kessler, Tan Michael Renne Ty
Принадлежит:

Examples herein relate to devices with optical ports in fan-out configurations. An electrical device may have a substrate with an electrical port on a first face of the substrate and a plurality of optical ports on a second face of the substrate. The plurality of optical ports may be positioned in a fan-out configuration on the second face of the substrate. The electrical device may also have an integrated circuit with an electrical connection and a plurality of optical connections. A first face of the integrated circuit may be coupled to the substrate. The electrical connection of the integrated circuit may be communicatively coupled to the electrical port of the substrate, and the plurality of optical connections may be communicated coupled to the plurality of optical ports of the substrate. 1. An electrical device , comprising:a substrate comprising an electrical port on a first face of the substrate and a plurality of optical ports on a second face of the substrate, wherein the second face is opposite that of the first face; andan integrated circuit comprising an electrical connection and a plurality of optical connections, wherein a first face of the integrated circuit is coupled directly to the second face of the substrate, and wherein the electrical connection is communicatively coupled to the electrical port of the substrate and the plurality of optical connections are communicatively coupled to the plurality of optical ports of the substrate;wherein the plurality of optical ports are positioned in a fan-out configuration on the second face of the substrate such that the plurality of optical ports are positioned to surround the integrated circuit.2. The electrical device of claim 1 , the substrate further comprising a plurality of monolithically integrated optical waveguides communicatively coupling the plurality of optical connections of the integrated circuit with the plurality of optical ports of the substrate.3. The electrical device of claim 2 , wherein ...

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Номер записи: 82
03-05-2018 дата публикации

Multi-Chip Module

Номер: US20180120525A1
Автор: Leigh Kevin, Megason George, NORTON John
Принадлежит:

One example of a multi-chip module includes a substrate, a semiconductor chip, and an optical transceiver. The substrate has a first side and a second side opposite the first side. The semiconductor chip is electrically coupled to the first side of the substrate. The optical transceiver is electrically coupled to the second side of the substrate. 1. A multi-chip module comprising:a substrate having a first side and a second side opposite the first side;a semiconductor chip electrically coupled to the first side of the substrate; andan optical transceiver electrically coupled to the second side of the substrate.2. The multi-chip module of claim 1 , further comprising:optical connectors on the second side of the substrate to optically connect the optical transceivers to a socket of a system board.3. The multi-chip module of claim 1 , further comprising:a ground island within the substrate; anda heat curtain thermally coupled to the ground island and extending from the second side of the substrate.4. The multi-chip module of claim 1 , further comprising:a ground island within the substrate; anda heat rod thermally coupled to the ground island and extending from the second side of the substrate.5. The multi-chip module of claim 1 , further comprising:a first heat sink thermally coupled to the semiconductor chip on the first side of the substrate; anda second heat sink thermally coupled to the optical transceiver on the second side of the substrate.6. A multi-chip module comprising:a substrate comprising a plurality of layers;a semiconductor chip electrically coupled to a top layer and inner layers of the substrate;a plurality of optical transceivers electrically coupled to a bottom layer and inner layers of the substrate;wherein an inner layer of the substrate comprises a plurality of ground islands interconnected via ground bridges, one of the plurality of ground islands aligned with the semiconductor chip and each of the remaining ground islands of the plurality of ...

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Номер записи: 83
24-07-2014 дата публикации

Projector with heat sinks and single fan module

Номер: US20140204345A1
Автор: Chien-Fu Chen, Zhi-Hao Wu
Принадлежит: Hon Hai Precision Industry Co Ltd, Hongfujin Precision Industry Shenzhen Co Ltd

An image projector in a case, having a light engine, a circuit board, a heat sink assembly, and a fan assembly, has one or more heat sinks and heat pipes shaped to gather heat from all heat-generating components within the projector and a single air passage to receive the heated air combined from all components, allowing the employment of a single fan module in sucking cool air from the exterior and exhausting heated air through the single air passage.

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Номер записи: 84
04-05-2017 дата публикации

Optical Integrated Circuit Package

Номер: US20170123173A1
Автор: Cho Keun-yeong, Ji Ho-Chul, JOE In-sung
Принадлежит:

An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface. 1. An optical integrated circuit (IC) package comprising:an optical IC comprising an optical IC substrate;an electrical integrated circuit device (EICD) on the optical IC substrate;at least one optical device on the optical IC substrate and spaced apart from the EICD;an optical interface on a first side of the optical IC substrate;an electrical interface on a second side of the optical IC substrate; andan encapsulation member that encapsulates the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.25.-. (canceled)6. The package of claim 1 , wherein the electrical interface comprises a flexible printed circuit board (FPCB).7. The package of claim 1 , wherein the optical IC comprises an optical waveguide and an optical coupler on the optical IC substrate.812.-. (canceled)13. The package of claim 1 , wherein the optical interface comprises a receptacle connector and an alignment device.14. The package of claim 1 , further comprising a heat sink that contacts a lower portion of the optical IC substrate.1518.-. (canceled)19. An optical integrated circuit (IC) package comprising:an optical IC comprising an optical IC substrate;an electrical integrated circuit device (EICD) on the optical IC substrate and electrically connected to an interconnection line in the optical IC substrate;at least one optical device ...

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Номер записи: 85
04-05-2017 дата публикации

HEAT DISSIPATION CLAMP AND METHODS, DEVICES AND SYSTEMS FOR FACILITATING HEAT DISSIPATION IN OPTICAL COMMUNICATIONS MODULES

Номер: US20170123174A1
Автор: McColloch Laurence R.
Принадлежит:

A heat dissipation system for an optical communications module is provided that includes a heat dissipation clamp having a plurality of force-application devices for applying respective, precisely-controlled forces to respective optical communications modules of an array to maintain electrical interconnectivity between the modules of the array and respective electrical sockets. The force-application devices are independent of one another such that the respective electrical interconnectivity forces applied to the respective modules are independent of one another. This independence ensures that the proper amount of electrical interconnectivity force is applied to each module of the array, which ensures that the planarity of the system PCB is maintained without the need for a backing, or bolstering, plate. Inner walls of the heat dissipation clamp are in contact with the modules so that heat generated by the modules is transferred into the heat dissipation clamp where some or all of the heat is dissipated. 1. A heat dissipation system for dissipating heat generated by a plurality of optical communications modules installed in respective sockets that are disposed on a surface of a system circuit board , the heat dissipation system comprising:at least a first heat dissipation clamp comprising a body and N force-application devices mechanically coupled to the body, where N is a positive integer that is greater than or equal to 2, the body being mechanically coupled to the system circuit board and being made of a thermally-conductive material, each force-application device applying a respective force against a respective optical communications module that aids in maintaining electrical interconnections between the module and the respective socket.2. The heat dissipation system of claim 1 , wherein the forces that are applied by the respective force-application devices against the respective modules are independent of one another.3. The heat dissipation system of claim 2 , ...

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Номер записи: 86
25-08-2022 дата публикации

Thermal Optimizations for OSFP Optical Transceiver Modules

Номер: US20220269019A1
Автор: Beauchemin Melanie, Centola Federico Pio, Edwards, IYENGAR Madhusudan K., JR. WILLIAM F., Lau Michael Chi Kin, Lee Justin Sishung, Lee Timothy Conrad, Shen Zuowei
Принадлежит:

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed. 1an octal small form factor pluggable (OSFP) module comprising a data connector;a first heatsink having a top surface and an opposed bottom surface facing toward the OSFP module;. An assembly comprising: The present application is a continuation of U.S. patent application Ser. No. 17/122,658 filed on Dec. 15, 2020, which claims the benefit of the filing date of U.S. Provisional Patent Application No. 63/047,410 filed on Jul. 2, 2020, the disclosures of which are hereby incorporated herein by reference.Octal Small Formfactor Pluggable (OSFP) is a module and interconnect system with a pluggable form factor with eight high speed electrical lanes. OSFP was designed to initially support 400 Gbps (8 lanes×50G per lane) optical data links. Compared to other form factors, such as QSFP, OSFP is slightly wider and deeper but still supports 36 ports per 1U front panel, which enables a theoretical 400G bitrate through an OSFP module. The OSFP has several advantages, including that it is reverse compatible with QSFP formats through simple adapters. The OSFP continues to become more common in supporting optics technologies for datacenter and other data transfer applications.Current OSFP modules consume roughly 10-15 watts to achieve a 400G bitrate. However, as the throughput requirements on the OSFP module increase, the wattage requirements also increase. This in turn increases the thermal load and electromagnetic interference on the OSFP. With the current standard OSFP form factor, these effects lead to issues in operating the OSFP modules at higher bit rates or throughputs due to thermal and electrical effects.Further, as the ...

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Номер записи: 87
25-04-2019 дата публикации

SCREWLESS HEAT SINK ATTACHMENT

Номер: US20190121039A1
Автор: Moore Joshua John Edward, Wang William H.
Принадлежит:

An optoelectronic system includes an optoelectronic module and a heat sink. The optoelectronic module includes a housing and first and second housing slide locks. The first and second housing slide locks extend outward from opposite sides of the housing. The heat sink includes a heat sink bottom, first and second heat sink legs, and first and second heat sink slide locks. The first and second heat sink legs extend downward from opposite ends of the heat sink bottom. The first and second heat sink slide locks extend inward from the first and second heat sink legs. The heat sink bottom is configured to be in thermal contact with a housing top of the housing. Each of the first and second heat sink slide locks is configured to be respectively disposed beneath the first and second housing slide locks when the heat sink is removably secured to the housing. 19-. (Canceled)10. A retention clip to removably secure a heat sink to an optoelectronic module , the retention clip comprising:one or more cross springs configured to be received between a pair of fins of the heat sink, each of the one or more cross springs having a front end and a rear end opposite the front end;a first projection that extends downward from the front end of the one or more cross springs and that is configured to be positioned proximate to a fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the retention clip; anda second projection that extends downward from the rear end of the one or more cross springs and that is configured to be positioned proximate to a rear side of the optoelectronic module opposite the fiber side of the optoelectronic module when the heat sink is removably secured to the optoelectronic module by the retention clip;wherein at least one of the first projection or the second projection is configured to selectively engage the optoelectronic module to removably secure the heat sink to the optoelectronic module.11. The ...

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Номер записи: 88
16-04-2020 дата публикации

HORIZONTAL FLEX CIRCUIT WITH RESISTANCE WELDABLE COVER

Номер: US20200116961A1
Автор: Amirkiai Maziar, Deng Hongyu, Ding Frank Lei, Mu Jianwei, Wu Tao
Принадлежит:

A resistance weldable cover for an OSA may include multiple walls, one or more supports, and an opening disposed in one of the walls. The walls may define an interior cavity within the walls. The one or more supports may extend from one or more of the walls. Each of the one or more supports may be weldable to a heat sink stiffener. The opening may be sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel. 1. A cover comprising:a plurality of walls that defines an interior cavity within the plurality of walls;one or more supports that extend from one or more walls of the plurality of walls, each of the one or more supports weldable to a heat sink stiffener; andan opening disposed in a wall of the plurality of walls, the opening sized and shaped to receive at least a portion of a barrel such that optical signals are transmittable between the interior cavity and the barrel.2. The cover of claim 1 , wherein each of the one or more supports is tapered.3. The cover of claim 1 , wherein the one or more supports include a welding surface that is weldable to the heat sink stiffener.4. The cover of claim 3 , wherein each of the one or more supports is tapered such that a first portion of the one or more supports is narrower than a second portion of the one or more supports claim 3 , the first portion more proximate to the welding surface than the second portion.5. The cover of claim 3 , wherein the welding surface of the one or more supports is perpendicular to each wall of the plurality of walls.6. The cover of claim 3 , wherein the welding surface of the one or more supports does not exceed one or more respective planes defined by the plurality of walls.7. The cover of claim 1 , further comprising a gap disposed between the one or more supports and the plurality of walls claim 1 , the gap sized and shaped to receive a portion of a flex circuit into the interior cavity.8. The cover of ...

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Номер записи: 89
27-05-2021 дата публикации

INDEXING SIGNAL DETECTING MODULE

Номер: US20210157060A1
Автор: HAGEN Norbert D., OPALSKY David
Принадлежит: GEN-PROBE INCORPORATED

An apparatus for detecting an emission signal from each of a plurality of emission signal sources includes one or more excitation sources configured to generate an excitation light of an excitation wavelength and one or more associated emission detectors configured to detect light of an emission wavelength. A transmission fiber is associated with each of the emission signal sources. A carrier is configured to move the one or more excitation sources and the one or more emission detectors relative to the transmission fibers to sequentially place each emission detector and associated excitation source in an operative position with respect to each transmission fiber. Each transmission fiber transmits both the excitation light from the excitation source and the corresponding emission light to the associated emission detector. 1. An apparatus for detecting an emission signal from each of a plurality of emission signal sources , wherein each emission signal source comprises a substance that emits light of a predetermined emission wavelength when subjected to an excitation signal of a predetermined excitation wavelength , said apparatus comprising:one or more excitation sources configured to generate an excitation signal that is directed at an emission signal source, wherein each excitation source is configured to generate an excitation light of a predetermined excitation wavelength;one or more emission detectors, each emission detector being associated with at least one excitation source and being configured to detect an emission signal emitted by an excitation source and excited by the excitation signal generated by the associated excitation signal source, wherein each associated emission detector is configured to detect light of a predetermined emission wavelength;a transmission fiber associated with each of the emission signal sources; anda carrier configured to move each of the one or more excitation sources and the associated emission detector relative to the ...

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Номер записи: 90
27-05-2021 дата публикации

HEATSINK WITH GRAPHENE COATING AND AN OPTICAL TRANSMITTER OR TRANSCEIVER IMPLEMENTING SAME

Номер: US20210157074A1
Автор: CAI Ziliang, CHENG Hao-Chiang, LIN Kai-Sheng
Принадлежит:

The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation. 1. An optical device capable of transmitting multiple channel wavelengths , the optical device comprising:a housing having at least first and second sidewalls that extend from an electrical coupling end to an optical coupling end and define a cavity therebetween;an optical component disposed within the housing, the optical component in thermal communication with the housing to communicate generated heat;at least a first heatsink disposed on the first sidewall of the housing; andat least one layer of graphene disposed on the first heatsink, the at least one layer of graphene comprising 50-100% graphene by weight % to increase thermal dissipation of heat generated by the optical component.2. The optical device of claim 1 , wherein the first heatsink includes a plurality of projections that extend from a surface defining the first sidewall.3. The optical device of claim 2 , wherein the at least one layer of graphene is disposed on the plurality of projections.4. The optical device of claim 1 , wherein the first heatsink includes a plurality of cross-cut channels to allow for airflow to enter the first heatsink from multiple directions.5. (canceled)6. The optical device of claim 1 , wherein the at ...

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Номер записи: 91
27-05-2021 дата публикации

Connector

Номер: US20210157075A1
Автор: Bai-Yu Duan, Xiao-Kai Wang, xiao-ping Wu
Принадлежит: Dongguan Luxshare Technology Co Ltd

A connector includes a cage and a heat-radiation element. A top wall of the cage includes an opening, and first engaging structures extending from the top wall of the cage toward an outside of the cage at a periphery of the opening. The heat-radiation element is disposed on the cage corresponding to the opening, and first notches corresponding to the first engaging structures are disposed on side walls of the heat-radiation element. Each first engaging structure passes through the corresponding first notch to engage the heat-radiation element on the cage. The cage has a receiving cavity and supporting structure at a bottom of the receiving cavity. When a mating connector is inserted into the receiving cavity, a bottom of the mating connector is supported by the supporting structure, a top of the mating connector abuts against the heat-radiation element through the opening, and the heat-radiation element remains substantially stationary.

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Номер записи: 92
10-05-2018 дата публикации

Optic module cage assembly utilizing a stationary heatsink

Номер: US20180129001A1
Автор: Adrianus Van GAAL
Принадлежит: Ciena Corp

An optic module cage assembly includes an optic module cage body configured to receive and retain one or more optic modules; a stationary heatsink fixedly attached to the optic module cage body; one or more spring members configured to bias the one or more optic modules towards the stationary heatsink when the one or more optic modules are retained in the optic module cage assembly; and one or more floating connectors configured to make electrical connections with the one or more optic modules when the optic modules are retained in the optic module cage assembly.

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Номер записи: 93
18-05-2017 дата публикации

OPTICAL FIBER CONNECTION UNIT HAVING CIRCULATION PATH FOR ALLOWING COOLANT TO CIRCULATE

Номер: US20170139164A1
Автор: Izumi Takashi
Принадлежит: FANUC Corporation

An optical fiber connection unit able to efficiently remove heat generated in the optical fiber connection unit. The optical fiber connection unit includes a closed circulation path, through which coolant for eliminating heat generated in the optical fiber connection unit by a laser beam propagating through the optical fiber connection unit circulates, and a coolant circulation device for causing the coolant to flow and circulate in the circulation path. 1. An optical fiber connection unit which receives a laser beam and relays the laser beam to an optical fiber , comprising:a closed circulation path, through which a coolant for removing heat generated in the optical fiber connection unit due to the laser beam propagating through the optical fiber connection unit circulates; anda coolant circulation device which flows the coolant so as to circulate in the circulation path.2. An optical fiber connection unit according to claim 1 , further comprising a main body which holds an optical member which condenses the laser beam claim 1 ,wherein the circulation path is defined by a hole formed at the main body or a pipe attached to the main body.3. An optical fiber connection unit according to claim 1 , further comprising a heat radiation fin arranged to be adjacent to the circulation path.4. An optical fiber connection unit according to claim 1 , further comprising a fan which generates airflow which removes heat from the optical fiber connection unit.5. The optical fiber connection unit according to claim 4 , further comprising:a temperature detecting part which detects a temperature of the optical fiber connection unit; anda fan controller which controls the fan based on the temperature detected by the temperature detecting part.6. An optical fiber connection unit according to claim 4 , further comprising a fan controller which controls the fan based on a laser oscillation command transmitted from a laser oscillator controller to a laser oscillator.7. The optical fiber ...

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Номер записи: 94
30-04-2020 дата публикации

OPTOELECTRONIC DEVICE WITH A SUPPORT MEMBER

Номер: US20200132953A1
Автор: Mathai Sagi, Rosenberg Paul Kessler, Tan Michael Renne Ty
Принадлежит:

Optoelectronic devices with a support member and methods of manufacturing or assembling the same are provided. An example of an optoelectronic device according to the present disclosure includes a substrate and an optical component and an electronic component disposed thereon or therein. The optoelectronic device further includes a ferrule coupled to the optical fiber and an optical socket receiving the ferrule therein. The optoelectronic device includes a support member disposed between the substrate and the optical socket such that the optical socket is spaced from the substrate by the support member. 3. The optoelectronic device of claim 1 , wherein the support member is dimensioned to straddle opposing sides of the interposer.5. The optoelectronic device of claim 1 , wherein the optical component comprises a lens and wherein the optical socket aligns the ferrule and the lens when the ferrule is received therein and the optical socket is mounted on the substrate.6. The optoelectronic device of claim 1 , wherein the substrate is disposed over a circuit board and the support member is bonded to the circuit board.7. The optoelectronic device of claim 1 , wherein the support member is constructed out of one or more of sheet metal claim 1 , plastic claim 1 , or a material able to withstand multiple solder reflow temperature cycles.8. The optoelectronic device of claim 1 , wherein the optical socket is removable from the support member without damaging one or both of the optical interposer and optical component.9. The optoelectronic device of claim 1 , wherein the support member is soldered to the substrate or adhered to the substrate with an adhesive.10. The optoelectronic device of claim 1 , wherein the support member is adhered to the optical socket with an adhesive or bonded to the optical socket by localized melting of a portion of the socket or support member.11. The optoelectronic device of claim 1 , wherein the support member comprises a substantially U-shaped ...

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Номер записи: 95
24-05-2018 дата публикации

Single line passive optical network converter module

Номер: US20180145769A1
Автор: David Brown, David Mather, Jan Jozef Julia Maria ERREYGERS, Joris Franckx, Robert Neil Shaddock, William Atley WEEKS
Принадлежит: CommScope Connectivity Belgium BVBA, Commscope Connectivity UK Ltd, CommScope Technologies LLC

A single line converter module comprises a housing; an environmentally hardened fiber optic connector located in the housing and configured to be optically coupled to a service terminal for receiving downstream optical frames; a single electrical connector located in the housing and coupled over a metallic medium to a network terminal providing a service to respective customer premise equipment (CPE); and an optical-to-electrical (O/E) converter located in the housing and configured to convert the downstream optical frames to an electrical signal for transmission over the metallic medium to the network terminal.

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Номер записи: 96
24-05-2018 дата публикации

THERMALLY CONFIGURED CONNECTOR SYSTEM

Номер: US20180146576A1
Автор: Regnier Kent E.
Принадлежит: Molex, LLC

A connector system with improved thermal management is provided. A module includes a thermal dissipation system. A receptacle is provided that has a cage with thermal channels that allow air passing through the receptacle to directly remove thermal energy from the thermal dissipation system and carry the thermal energy out of the cage. 1. A receptacle , comprising:a housing having a first card slot;a cage positioned around the housing and defining a first port aligned with the card slot, the cage having a first side opening, the first port including four walls that are aligned with the first card slot, the first port further including a first vent wall at a rear of the first port, wherein the first port is configured so that air may flow directly from a front face of the first port through the vent wall and out the side opening.2. The receptacle of claim 1 , wherein the housing includes a second card slot and the cage includes a second port aligned with the second card slot claim 1 , the second port including a second vent wall claim 1 , the cage having a second side opening in communication with the second vent wall claim 1 , the cage configured so that air may flow in past the front face of respective port claim 1 , out the corresponding vent wall and out the corresponding side opening.3. The receptacle of claim 1 , wherein the port includes a rail extending along one of the walls. This application claims priority to U.S. application Ser. No. 15/035,532, filed May 10, 2016, now U.S. Pat. No. 9,877,413, which is a national phase of PCT Application No. PCT/US2014/065236, filed Nov. 12, 2014, which in turn claims priority to U.S. Provisional Application No. 61/903,097, filed Nov. 12, 2013, which is incorporated herein by reference in its entirety.This disclosure relates to the field of connectors, more specifically to connector systems suitable to manage thermal energy.As data rates have increased, powered cable assembles have become increasingly important. At lower ...

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Номер записи: 97
15-09-2022 дата публикации

DETERMINING TEMPERATURE-VARYING SIGNAL EMISSIONS DURING AUTOMATED, RANDOM-ACCESS THERMAL CYCLING PROCESSES

Номер: US20220291454A1
Автор: Buse David, Combs David, HAGEN Norbert D., Moore Tyler, Moravick Keith, OPALSKY David, Prasad Anita, Richardson Bruce
Принадлежит: GEN-PROBE INCORPORATED

A first time/temperature data set includes temperatures and time stamps recorded at time intervals during a first thermal cycling process and a time stamp for each time interval, and a second time/temperature data set includes temperatures and time stamps recorded at time intervals during a second thermal cycling process. Signal emissions at different signal detecting positions are sequentially measured at different time intervals to generate first and second time/signal emission data sets for receptacles subject to the first and second thermal cycling processes, respectively. Signal emissions of receptacles subject to the first thermal cycling process are synchronized with specific temperatures of the first thermal cycling process by comparing time stamps of the first time/signal emission data set for each receptacle with the time stamps of the first time/temperature data set that correspond with the specific temperature. Signal emissions of receptacles subject to the second thermal cycling process are synchronized with specific temperatures of the second thermal cycling process by comparing time stamps of the second time/signal emission data set for each receptacle with the time stamps of the second time/temperature data set that correspond with the specific temperature. 1. A method of determining temperature-varying signal emissions during automated , random-access thermal cycling processes , comprising the automated steps of:(a) transferring a first set of one or more receptacles to a first receptacle holder;(b) subjecting the contents of each receptacle of the first set of receptacles to a first thermal cycling process and recording a temperature at regular time intervals during the first thermal cycling process and recording a time stamp for each time interval to generate a first time/temperature data set;(c) transferring a second set of one or more receptacles to a second receptacle holder;(d) subjecting the contents of each receptacle of the second set of ...

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Номер записи: 98
16-05-2019 дата публикации

Transceiver Module

Номер: US20190146167A1
Автор: George D Megason, John Norton, Kevin B Leigh
Принадлежит: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

One example of a system includes a system board including first contacts, a cage attached to the system board over the first contacts, and a removable transceiver module including second contacts. The transceiver module is installable in the cage in response to a lateral movement of the transceiver module with respect to the cage to align the second contacts with the first contacts and a vertical movement of the transceiver module with respect to the cage to electrically connect the first contacts to the second contacts.

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Номер записи: 99
07-05-2020 дата публикации

HEAT RADIATING ASSEMBLY AND CONNECTOR

Номер: US20200142142A1
Автор: LUO Zhen, WANG Xiaokai
Принадлежит: Dongguan Luxshare Technologies Co., Ltd

Disclosed are a heat radiating assembly and a connector. The heat radiating assembly is disposed on the connector used to mate with a docking connector having a heat generating portion. The heat radiating assembly includes a heat radiating member and a heat conduction member. The heat radiating member is provided with a trough. The heat conduction member is disposed in the trough and is configured to transfer heat of the heat generating portion to the heat radiating member, allowing the heat to be radiated through the heat radiating member. The connector includes the heat radiating assembly. 1. A heat radiating assembly , disposed on a connector used to mate with a docking connector having a heat generating portion , the heat radiating assembly comprising:a heat radiating member provided with a trough and configured to radiate heat; anda heat conduction member disposed in the trough and configured to transfer heat of the heat generating portion to the heat radiating member.2. The heat radiating assembly of claim 1 , further comprising:a heat radiating block disposed between the heat conduction member and the heat generating portion and configured to transfer the heat of the heat generating portion to the heat conduction member.3. The heat radiating assembly of claim 1 , wherein the heat radiating member is a heat radiating fin claim 1 , and the heat conduction member is partially attached to a trough wall of the trough.4. The heat radiating assembly of claim 1 , wherein the heat conduction member is a heat pipe or a vapor chamber.5. The heat radiating assembly of claim 2 , wherein the material of the heat radiating block is a metal.6. A connector claim 2 , used to mate with a docking connector having a heat generating portion claim 2 , the connector comprising: a heat radiating member provided with a trough and configured to radiate heat; and', 'a heat conduction member disposed in the trough and configured to transfer heat of the heat generating portion to the heat ...

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Номер записи: 100