HOCHFREQUENZ-BAUELEMENT

HIGH FREQUENCY TRANSFORMER

Electrical coils arrangement e.g. for systems with two parallel coils, has parallel connected coils each laid out as two series-connected coils with center tap and bridge

Electrical systems using a parallel arrangement of electrical coils, particularly two parallel coils for the purpose of redundancy, can result in a considerable reduction in power with the breakdown of a coil. To minimize the power loss, the parallel connected coils (1;2) are each designed as two series-connected coils (1-1) (1-2)/(2-1) (2-2) with a center tap (4) and connected via a bridge (3).

Balanced, symemetrical coil

A coil device includes a first conductor on a first layer and arranged in a first spiral shape, a second conductor on a second layer and arranged in a second spiral shape, a transition that connects the first conductor and the second conductor in series, a first terminal connected to an end of the first conductor, and a second terminal connected to an end of the second conductor. The first terminal and the second terminal are outside of the first conductor and the second conductor when viewed in plan. The first conductor and the second conductor each include a plurality of in-plane traces connected in parallel with each other.

Magnetic inductor stacks with multilayer isolation layers

A magnetic laminating structure includes alternating layers of a magnetic material (112) and a multilayered insulating material, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer (114A) abutting at least on additional insulating layer (114B), and wherein the first insulating layer (114A) and the at least one additional insulating layer (114B) comprise different dielectric materials and/or are formed by a different deposition process.

Variable inductance tuning device

... 449,110. High-frequency transformers. HAZELTINE CORPORATION, 15, Exchange Place, Jersey City, New fersey, U.S.A.- (Assignees of Johnson, J. K. ; 723, Cummings Avenue, Kenilworth, Illinois, U.S.A.) March 29, 1935, No. 9913. Convention date, May 5, 1934. [Class 38 (ii)] [See also Groups XXXVI and XL] In a multi-winding high-frequency transformer comprising at least two single layer secondaries spaced on a support, the secondaries of lower inductance have increased sectional areas. In the form shown, a transformer for an " all wave set " has in addition to the largest inductance winding 7, windings 8, 9, 10 of which the gauge and pitch increases with decreasing inductance and three such transformers each with a screening can and rotary switch 34 can be combined in a unit with a single switch operating spindle as indicated for example in Fig. 4. Successive windings on the former can be separated by short-circuiting rings 29. Specification 444,608 is referred to.

Improvements in or relating to methods of winding inductance coils having two or more electrically symmetrical windings

... 918,699. Inductances and transformers. TELEFONAKTIEBOLAGET L. M. ERICSSON. Feb. 15, 1960 [March 4, 1959], No. 5314/60. Class 38 (2). A coil for use in a ferrite pot core and having two or more electrically symmetrical windings wound about a straight axis has all the windings wound simultaneously so that equally dimensioned portions of the windings are disposed in each layer of the coil, any two adjacent portions in all layers being wound so as to progress in opposite axial directions of the coil and, in at least one layer, the windings, or adjacent windings, being wound axially towards each other and, on meeting, continuing each in the same direction in the next layer. Fig. 2 shows a coil with two branches and Fig. 3 a coil with four branches.

LAMINATED SYMMETRY TRANSDUCER

SPIRALLED PRINTED INDUCTANCE

The printed inductance comprises at least a first conductive spiral which is supported by one of the faces of a flexible insulating supporting-plate. The supporting-plate is folded back through 180.degree. along an axis passing through the geometric origin of the spiral which coincides with the internal connecting terminal of the conductive spiral, so as to produce a magnetic field coplanar to the folded supporting-plate. A second conductive sprial may be supported by the other face of the supporting-plate. The first and second spirals are identical and symmetrical with respect to the fold axis. A hole having metallized walls connects the internal terminals of the spirals therebetween. A flat magnetic element and/or an insulating insert may be sandwiched by the inside facing half-faces of the supporting-plate. The printed inductance may be used in a magnetic transcription device.

Anordnung für die Wellenbereichumschaltung von Funkgeräten.

Spulenanordnung.

Elektrische Spule für die elektrische Nachrichtentechnik.

Einlagige Hochfrequenzdrossel in Ultrakurzwellengeräten.

Spulenanordnung in einem Gerät der Hochfrequenztechnik.

Mehrphasen-Goniometer.

Verfahren zur Erhöhung der Selbstinduktion von elektrischen Leitern, Spulen usw. bei Frequenzen oberhalb 109 Hertz.

Induktive Vorrichtung mit einer elektrischen Wicklung

APPARATUS WITH 3D WIREWOUND INDUCTOR INTEGRATED WITHIN A SUBSTRATE

Improvements with electric rollings up

COMPOSANT ELECTRONIQUE INDUCTIF POUR LE REPORT A PLAT

LA PRESENTE INVENTION CONCERNE UN COMPOSANT ELECTRONIQUE INDUCTIF POUR LE REPORT A PLAT, COMPORTANT UNE POULIE CONSTITUEE DE DEUX JOUES 2, 3 SOLIDAIRES D'UN MANDRIN 1 SUR LEQUEL EST BOBINE UN ENROULEMENT ELECTRIQUE DONT LES EXTREMITES 13, 14 SONT RESPECTIVEMENT RELIEES A UNE ELECTRODE 4, 5, UNE RESINE 11 ENROBANT L'ENROULEMENT SENSIBLEMENT JUSQU'A HAUTEUR DES JOUES 2, 3. SELON L'INVENTION, LES JOUES 2, 3 SONT RECOUVERTES EXCLUSIVEMENT SUR LEUR FACE EXTERIEURE D'UNE COUCHE CONDUCTRICE FORMANT ELECTRODE 4, 5. CHAQUE JOUE 2, 3 ET SA COUCHE CONDUCTRICE COMPORTENT UNE GORGE 6, 7 S'ETENDANT PARALLELEMENT AU MANDRIN 1 AU MOINS JUSQU'AU PROLONGEMENT DE CELUI-CI AU NIVEAU DES JOUES 2, 3. CHAQUE EXTREMITE 13, 14 DE L'ENROULEMENT EST RESPECTIVEMENT FIXEE DANS CHAQUE GORGE 6, 7, PAR L'INTERMEDIAIRE D'UNE BRASURE ELECTRIQUEMENT CONDUCTRICE ASSURANT LE CONTACT ELECTRIQUE ENTRE LES ELECTRODES 13, 14 ET LES EXTREMITES DE L'ENROULEMENT, LADITE BRASURE REMPLISSANT AU MOINS PARTIELLEMENT CHACUNE DES GORGES ...

Improvements in the construction and the assembly of the inductance coils in the apparatuses of T.S.F.

INDUCTIVE ELECTRONICS COMPONENT FOR THE CARRYFORWARD FLAT

Mode of realization of inductances and industrial products new resulting from its application

Electronic component

To provide an electronic component which is capable of achieving good direct current superposition characteristics. A laminate (12) is configured by laminating magnetic layers and a non-magnetic layer (20) and has a rectangular parallelepiped shape. A coil conductor (16) is a linear conductor which is laminated together with the magnetic layers and the non-magnetic layer (20) and connects end faces (S3, S4) of laminates (12) that face each other in the x-axis direction. The length (L2) of the end faces (S3, S4) in the z-axis direction is shorter than the length (L1) of the end faces (S3, S4) in the y-axis direction.

HIGH-FREQUENCY TRANSFORMER, HIGH-FREQUENCY COMPONENT AND COMMUNICATION TERMINAL DEVICE

A first inductor and a second inductor are constituted from conductor patterns formed over a plurality of layers; conductor patterns (L1a,L1b,L1c,L1d) of the first inductor and conductor patterns (L2a,L2b,L2c) of the second inductor have respective coil-winding axes oriented in the layering direction and respective coil apertures disposed so as to be divided into two locations (coil apertures) of a first coil aperture (CA1) and a second coil aperture (CA2); the conductor patterns of the first inductor and the conductor patterns of the second inductor are respectively linked while alternating between the two locations of the first coil aperture (CA1) and the second coil aperture (CA2); and, in a state where a current is passed between a first input/output port (P1) and a third input/output port (P3), a magnetic flux generated in the first coil aperture by the first inductor and the second inductor forms a closed loop.

INDUCTOR BRIDGE AND ELECTRONIC DEVICE

An inductor bridge (101) is provided with an element (10) that is flexible and that has a flat plate shape, a first connector (51), and a second connector (52). An inductor section (30) is configured inside of the element (10). The inductor section (30) is configured from a spiral-shaped conductor pattern (31). The first connector (51) is provided to the element (10) and is connected to a first circuit. The second connector (52) is provided to the element (10) and is connected to a second circuit.

Planar coil element and method for producing the same

In a planar coil element and a method for producing the same, a metal magnetic powder-containing resin containing an oblate or needle-like first metal magnetic powder contains a second metal magnetic powder having an average particle size (1 μm) smaller than that (32 μm) of the first metal magnetic powder, which significantly reduces the viscosity of the metal magnetic powder-containing resin. Therefore, the metal magnetic powder-containing resin is easy to handle when applied to enclose a coil unit, which makes it easy to produce the planar coil element.

MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE MOUNTING STRUCTURE, METHOD OF MANUFACTURING MULTILAYER SUBSTRATE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

SKEWED CO-SPIRAL INDUCTOR STRUCTURE

A skewed, co-spiral inductor structure may include a first trace arranged in a first spiral pattern that is supported by a substrate. The skewed, co-spiral inductor structure may also include a second trace arranged in a second spiral pattern, in which the second trace is coupled to the first trace. The first trace may overlap with the second trace in orthogonal overlap areas. In addition, each orthogonal overlap area may have a size defined by a width of the first trace and the width of the second trace. Also, parallel edges of the first trace and the second trace may be arranged to coincide.

Semiconductor package and method for fabricating base for semiconductor package

The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

COMMON MODE FILTER

A common mode filter is disclosed. The common mode filter provided by the present invention includes: a magnetic substrate; a coil layer formed on the magnetic substrate and including a coil pattern; an external electrode formed on the coil layer so as to be electrically connected with the coil pattern; a ground electrode formed on the coil layer and configured to discharge static electricity brought in to the external electrode; a post formed on each of the external electrode and the ground electrode; and an electrostatic discharge member formed between the external electrode and the ground electrode so as to cover a side surface of the post and configured to discharge static electricity brought in to the external electrode to the ground electrode.

ПЛОСКАЯ КАТУШКА ИНДУКТИВНОСТИ С ПОВЫШЕННОЙ ДОБРОТНОСТЬЮ

Изобретение относится к области электротехники и может использоваться в устройствах, в которых необходимы катушки индуктивности. Достигаемый технический результат - повышение добротности без увеличения плотности магнитного потока или индуктивности. Плоская катушка индуктивности с повышенной добротностью, вблизи которой размещен слой магнитного материала, характеризуется тем, что слой магнитного материала, значение относительного тангенса магнитных потерь которого <10, расположен вплотную к внешней и/или внутренней границе, причем размеры вышеупомянутого слоя магнитного материала находятся в следующих пределах: высота h слоя магнитного материала, по меньшей мере, вдвое больше, чем толщина d катушки, а ширина w слоя магнитного материала составляет 5-10% от внутреннего радиуса b катушки. 1 табл., 3 ил.

VARIABLE INTEGRIERTE INDUKTIVITÄT

Fahrzeuginterner motorbetriebener Verdichter

Ein fahrzeuginterner motorbetriebener Verdichter umfasst eine Gleichtaktdrosselspule. Die Gleichtaktdrosselspule umfasst einen ringförmigen Kern, der ein Durchgangsloch aufweist, eine erste Wicklung und eine zweite Wicklung, die um den Kern herum gewickelt sind, und einen beschichteten leitfähigen Draht. Die zweite Wicklung ist zu der ersten Wicklung gegenüberliegend, während sie von der ersten Wicklung beabstandet ist. Der beschichtete leitfähige Draht ist um den Kern gewickelt, um die erste Wicklung, die zweite Wicklung und den Kern zu umgeben. Der beschichtete leitfähige Draht weist Abschnitte auf, die zueinander mit dem Durchgangsloch dazwischen gegenüberliegend sind. Ein elektrischer Draht des beschichteten leitfähigen Drahts ist mit mehreren Windungen um den Kern herumgewickelt, um zumindest teilweise die ersten und zweiten Wicklungen zu überlappen. Beide Enden des elektrischen Drahts sind elektrisch miteinander verbunden. Der Kern umfasst einen freigelegten Abschnitt, der nicht mit ...

Flat coils

The coil comprises a plurality of coil conductors 3, 7, 11, 15 which are connected to each other using no through holes. The coil conductor's are formed on surfaces of insulating sheets 1, 5, 9. 13 so that terminal portions 3a, 3b, 7a, 7b, 11a, 11 b, 15a, 1 5b thereof project from edges of the insulating sheets. The insulating sheets are stacked so that the aligned terminal portions are connected by spot welding or the like. The coil comprises a primary winding 8 and a secondary winding 16 mounted between ferrite cores 17, 19. In a modification, the windings have an air core and are mounted in a resin frame. ...

Improvements in and relating to dual wave inductance coils

... 401,899. Inductances. WATERS, F. N., 23, Caversham Road, Reading, Berkshire. Dec. 12, 1932, No. 35151. [Class 37.] A dual-wave inductance comprising long - wave, reaction and mediumwave windings located in peripheral grooves in a square block has a core section of half - an - inch square for the long wave coil and one of threequarters of an inch for the remaining coils. The reaction coil R is spaced one-eighth of an inch from the long and medium wave coils L, M. The coil L is wound in a groove one-quarter of an inch wide and deep and the coils R, M in grooves one-eighth of an inch deep. The former is one inch square and is enclosed in a screen 7 having a friction-tight lid 8.

Transformer and common mode choke component

An electromagnetic component, or a method of making such a component, comprises winding coils on a magnetic core to provide a transformer and a common mode choke. A first winding may be arranged around a portion of a toroidal magnetic core to provide a secondary coil of a transformer and a second winding is wound on the said core to provide a primary coil of the transformer. The wire ends extending from the said primary coil may be twisted together and wound on to the said core to provide a common mode choke. The core may be made of a homogeneous magnetic material or a composite of materials. The wire ends extending from the secondary coil of the transformer may also be twisted together and wound on the core to provide a further common mode choke. The primary and secondary coil wires of the transformer may also be twisted together prior to winding on the core. The said transformer windings may be formed with the same helical winding sense and they may include tapping means.

Magnetic inductor stacks with multilayer isolation layers

A magnetic laminating structure includes alternating layers of a magnetic material (112) and a multilayered insulating material, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer (114A) abutting at least on additional insulating layer (114B), and wherein the first insulating layer (114A) and the at least one additional insulating layer (114B) comprise different dielectric materials and/or are formed by a different deposition process.

Method of making inductance coils

... 592,512. Transformers. THOMSON, A. Feb. 10, 1944, No. 554/45. Convention date, Dec. 8, 1942. Divided out of 592,491. Drawings to Specification. [Class 38 (ii)] The invention comprises the method of winding the inductance coils described in Specification 592,491.

ELECTRICAL HIGH FREQUENCY TRANSDUCER.

Winding out of clover with cells or cells multiple allowing one or more couplings of secondaries on a single primary education

Improvements with the inductance coils

Impedance for electrical circuits

INDUCTANCE IMPRIMEE SPIRALEE

... a. Inductance imprimée comprenant au moins une première spirale conductrice 1 supportée par l'une des faces d'une plaque-support isolante 3. b. La plaque-support est repliée à 180 degrés suivant un axe de pliage X'X passant par l'origine 33 de la première spirale en vue de produire un champ magnétique coplanaire à la plaque-support repliée. Une seconde spirale 2 symétrique de première 1 et reliée au trou d'origine métallisé 33 peut être supportée par l'autre face de la plaque-support Les faces de la plaque-support peuvent entretoiser après pliage un élément magnétique plat et/ou un intercalaire isolant. c. Application aux têtes de transcription magnétiques.

SPIRAL PRINTED INDUCTANCE

복합 전자 부품

... 본 발명은 외측에 제1 및 제2 외부 전극이 배치되고, 유전체를 포함하는 바디; 상기 유전체의 내측에 배치되며, 상기 제1 및 제2 외부 전극과 각각 전기적으로 연결되는 복수의 제1 및 제2 전극; 상기 유전체의 상부에 배치되며, 상기 제1 및 제2 외부 전극과 각각 전기적으로 연결되는 제3 및 제4 전극; 상기 제3 및 제4 전극 사이에 배치되는 간극; 상기 간극의 하부에 배치되는 홈; 및 상기 간극에 배치되는 ESD 방전층;을 포함하는 복합 전자 부품에 관한 것이다.

회로 보호 소자

... 본 발명은 복수의 자성체 시트가 적층되어 형성된 제 1 자성층과, 복수의 자성체 시트가 적층되어 형성된 제 2 자성층과, 복수의 비자성체 시트가 적층되어 형성되며 제 1 및 제 2 자성층 사이에 마련된 비자성층을 포함하고, 상기 비자성층 내에 복수의 코일 패턴을 포함하는 노이즈 필터부가 형성된 회로 보호 소자를 제시한다.

전자 부품 및 그의 제조 방법

... 본 발명의 목적은, 금속 자성분을 포함하는 절연체를 사용한 전자 부품이며, 해당 절연체 위에 수지의 코팅막을 갖는 전자 부품 및 그의 제조 방법을 제공하는 것이다. 전자 부품(1)은, 절연체를 포함하는 본체(10)와, 본체(10)를 덮는 코팅막(9)과, 본체(10)의 내부에 위치하는 회로 소자(30)와, 외부 전극(20, 25)을 구비하고 있다. 절연체는 금속 자성분을 포함하고 있다. 코팅막(9)은 수지 및 절연체에 포함되는 양이온성의 원소에 의해 구성되어 있다.

STACKED COMMON MODE FILTER

A second coil faces a first coil in a first direction. The first coil and the second coil are located between a first conductor and a second conductor. The first conductor is adjacent to the first coil in the first direction and overlaps a part of the first coil seen in the first direction. The second conductor is adjacent to the second coil in the first direction and overlaps a part of the second conductor seen in the first direction. The first conductor and the second conductor show a shape elongated on a line. The internal area of the first coil and the second coil include an area not overlapping the first conductor and the second conductor seen in the first direction. COPYRIGHT KIPO 2017 ...

PRINTED CIRCUIT BOARD WITH INTEGRATED COIL, AND MAGNETIC DEVICE

This printed circuit board (3) with an integrated coil is provided with the following: coil patterns (4a through 4e) formed on a plurality of layers (L1 through L3); through-hole groups (9a through 9d) that electrically connect coil patterns (4a through 4e) on different layers (L1 through L3) to each other; and heat-dissipating pins (7a through 7f), pads (8c), and through-holes (8d) that thermally connect the coil patterns (4a through 4d) on a top outer layer (L1) and an inner layer (L2) to a bottom outer layer (L3). Enlarged regions (4t1 through 4t6) are provided in locations offset from the current pathways of the aforementioned coil patterns (4a through 4d), and heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provided on the bottom outer layer (L3) so as to correspond to said coil patterns (4a through 4d). The enlarged regions (4t1 through 4t6) of said coil patterns (4a through 4d) are thermally connected to the corresponding heat-dissipating patterns (5a7 through 5a9 ...

Chip-type coil component

There is provided a chip-type coil component, including: a body formed by laminating a plurality of magnetic layers, and having a lower surface provided as a mounting area, an upper surface corresponding thereto, two end surfaces, and two lateral surfaces; conductor patterns formed on the magnetic layers, respectively, and connected to each other to have a coil structure; and external electrodes formed on at least one external surface of the body, and electrically connected to the conductor patterns, the external electrodes each being formed on the lower surface and spaced apart from edges thereof. Short circuits between electronic components may be prevented and sticking strength between the chip-type coil component and a substrate may be increased.

Noise filter and electronic device using noise filter

Comprising a magnetic member 32 formed by laminating magnetic sheets 24, 28, 30, 31 a first impedance element 21 formed in the magnetic member 32, and a second impedance element 25 formed above the first impedance element 21, the first impedance element 21 includes a first normal impedance element 22 and a first common impedance element 23, and the second impedance element 25 includes a second common impedance element 26 and a second normal impedance element 27.

Layered transformer coil having conductors projecting into through holes

A layered coil, having high connection reliability, formed by alternately stacking a plurality of coil conductors and insulators. Outlet portions of the of coil conductors are connected with each other without using through holes. The coil conductors are formed on surfaces of insulating sheets so that the outlet portions of the coil conductors project from edges of the insulating sheets. The insulating sheets are stacked so that the outlet portions of the coil conductors can be connected, by spot welding or the like, with each other or with terminals in portions projecting from surfaces of the layered product.

COMMON MODE FILTER AND POWER SUPPLY DEVICE HAVING THE SAME

A common mode filter and a power supply device having the same are provided. The common mode filter includes a first inductor having a first winding number, a second inductor facing the first inductor and having a second winding number, a first intermediate terminal branching from an intermediate portion of a coil of the first inductor, and a second intermediate terminal branching from an intermediate portion of a coil of the second inductor. The effects of two filters are obtained from one common mode filter and the volume is reduced, so that a light, thin, short, and short module is provided.

MULTILAYERED POWER INDUCTOR AND METHOD FOR PREPARING THE SAME

Disclosed herein are a multilayered power inductor including an inner electrode coil pattern formed on a ceramic substrate; an outer electrode layer; and a magnetic layer made of a metal powder insulated along a grain interface of the metal powder included in a part or the whole of a chip, and a method for preparing the same. According to the exemplary embodiments of the present invention, the magnetic layer made of the metal powder insulation-coated with the ceramic material along the grain interface of the magnetic metal powder can be used for a part or the whole of the chip, thereby increasing the filling ratio of the magnetic metal powder to 90% within the magnetic layer. Therefore, a high-capacity power inductor can be implemented to effectively improve efficiency characteristics.

Printed circuit board and method for producing the same

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, a conductive pattern that is stacked on at least one surface side of the base film and that includes a plurality of wiring portions arranged adjacent to one another, and an insulating layer that covers outer surfaces of the base film and the conductive pattern. The plurality of wiring portions have an average spacing of 1 μm or more and 20 μm or less and an average height of 30 μm or more and 120 μm or less. A filling area ratio of the insulating layer between the plurality of wiring portions adjacent to one another in sectional view is 95% or more.

INDUCTIVE ELECTRONIC COMPONENT FOR TRANSMISSION BY FLAT CONTACTS

Noise reduction device for telephone appts.

The device comprises a high frequency noise reduction coil (15, 20, 25) having a stray capacitance smaller or equal 0.3 pF. The coil is provided in at least one selected section, between a telephone main body (1) and a pertinent external conductor (5), between an exchange module and an external conductor (5), between the telephone main body and the exchange module, or between the telephone main body and the associated handset apparatus (10). The coil may comprise either a core former device (16,21,26,30) or a coil holder, which is fabricated in a material with a dielectric constant K of 10 or less. A winding (17) is wrapped around the core former or the spool holder.

HALBLEITERVORRICHTUNG MIT EINER IN EINER UMVERTEILUNGSSCHICHT AUSGEBILDETEN PASSIVEN KOMPONENTE

Eine Vorrichtung umfasst einen Halbleiterchip, eine Vielzahl von ebenen Metallisierungsschichten, die über einer Hauptfläche des Halbleiterchips angeordnet sind, und eine passive Komponente, die Wicklungen umfasst, wobei jede der Wicklungen in einer der Vielzahl von ebenen Metallisierungsschichten gebildet wird.

Improvements in or relating to inductance coils

... 540,770. Inductors. SULLIVAN, Ltd., H. W., and GRIFFITHS, W. H. F. May 1, 1940, No. 7814. [Class 38 (ii)] [Also in Group XL] The value of an inductance 27 at high frequencies shows an increment, due to distributed capacity effectively in shunt with the inductance, amounting to p2L 0 C 0 where p is the pulsatance, Lo is the inductance at low frequencies, and Co is the distributed capacity of the coil. In order to obtain coils of constant inductance at various frequencies the effective inductance is reduced below Lo by tapping off a portion of the coil, by means of a switch 24 for instance, and is then raised to the value L o at a given frequency by means of a variable condenser 36 which is shunted across either the tapped-off portion or the whole coil. Each of the tappings is used for a different range of frequencies and the condenser 36 is graduated in terms of frequency for each range. The Specification describes several variations in the number and arrangement of the tappings ...

Improvements relating to tools for the manipulation of connections or instruments ofsensitive electrical apparatus and in the manufacture thereof

Tools such as screw-drivers, pin spanners, &c. for manipulating connections of electrical apparatus are moulded wholly, or wholly except for small keying or engaging parts, of an electrically inert substance such as one of the synthetic resins loaded with cellulose, flock or other fibrous filling to add torsional strength. Fig. 1 shows a screw-driver formed wholly of such material comprising handle a with hand grip ribbed part d, stem b and flats e terminating in driver tip c. Fig. 4 shows a pin-spanner moulded of similar material except for the steel pins g.

Improvements in or relating to wheatstone and similar bridge circuits

... 671,506. Impedance networks. MARCONI'S WIRELESS TELEGRAPH CO., Ltd. Nov. 16, 1950 [March 28, 1950], No. 7780/50. Class 40 (viii). In a bridge circuit having reactances in the arms, the desired inductance resistance ratio for the coils is obtained by winding at least one of its coils with some of its turns in opposition to the remainder. The arrangement may be applied to the crystal filter bridge shown wherein the input is through a transformer coupling 2 and the output is taken from the terminals marked out. The arms of the bridge include inductances 4, 5, 7 and 10, and crystals 9 and 12 shunted by capacities. Normally a resistance 13 is required to balance the resistances of the inductance coils. The above method enables this resistance to be dispensed with.

HIGH FREQUENCY ELEMENT.

Inductive coupler for power line communications, having a member for maintaining an electrical connection

Thin film inductor and power switching circuit

INDUCTIVE ELECTRONICS COMPONENT FOR THE CARRYFORWARD FLAT

Agreement by permeability, with reaction and device for its obtaining

Process of assembly of rollings up of goniometers Bi and polyphase

Improvements with the devices to transport, convert and couple electrical energy and analogues

Improvements brought to the electromagnetic elements such as reels, drivers, etc

Reels of radiogoniometers for systems of radio guidance

Mode of realization of inductances and industrial products new resulting from its application

THIN FILM COIL AND ELECTRONIC DEVICE HAVING THE SAME

MOUNTING SUBSTRATE AND ELECTRONIC DEVICE USING SAME

A mounting substrate according to an embodiment of the present disclosure includes a substrate body, a solder resist layer which is arranged on the upper side of the substrate body, and a groove part which is formed from the upper side to the inner side of the solder resist layer. The mounting substrate includes the groove part, thereby reducing a tilt fault in a chip component mounting process. Therefore, adhesion strength is improved. COPYRIGHT KIPO 2017 ...

PLANAR TRANSFORMER HAVING Y-CAPACITOR

Inductance element

This invention provides an inductance element which prevents saturation of magnetic flux and flux leakage around a coil winding, to facilitate miniaturization. The inductance element (10) contains a core portion (2) and two flange portions (3, 4) which are integrally formed into a drum type core (1). A coil winding (5) is wound around the core portion (2) of the drum type core (1), and a magnetic gap (20) is formed between the upper flange portion (3) and a lower flange portion (4). The magnetic gap (20) is filled with a rubber like ring (6) in which a magnetically permeable powder is mixed. The rubber like ring (6) has protruded portion (6a) mounted around a region of a side peripheral surface of the upper flange portion (3) of the drum type core (21) by abutting the region with its own rubbery elastic force, and an insert portion (6b) tightly inserted in the magnetic gap (20) with its own elastic force; the rubber like ring (6) is integrally formed with the protruded portion (6a) and ...

LAMINATED CIRCUIT SUBSTRATE

A laminated circuit substrate (101) in which a capacitor (C1) and a coil (L1) are provided, and which is manufactured by laminating sheets (11-15), and using an implement (90) to pressure bond the sheets from the vertical lamination direction while heating. The capacitor (C1) comprises a first conductive pattern (32A) and a second conductive pattern (33A) which oppose one another by sandwiching thermoplastic resin layers (22, 23). With respect to the laminated circuit substrate (101), a roughening process is performed on: a first main surface (91) of the first conductive pattern (32A), said first main surface opposing the second conductive pattern (33A); and a second main surface (92) of the second conductive pattern (33A), said second main surface opposing the first conductive pattern (32A).

PLASMA TREATMENT DEVICE

... [Problem] To adjust or optimize a resonant frequency by arbitrarily shifting same without reducing impedance functionality or withstand-voltage characteristics with respect to high-frequency noise entering lines such as power-feeding lines or signal wires from high-frequency electrodes and/or other electrical members inside a treatment vessel when making use of multiple-parallel resonance characteristics of distributed-parameter lines to reject said high-frequency noise. [Solution] In this filter unit, solenoid coils (104(1), 104(2)) are divided into a plurality of segments (K1, K2, …) in a coil-axis direction and a separate winding pitch (pi) is selected for each segment (Ki, with i = 1, 2, …). Comb teeth (M) that fit between the windings of said solenoid coils (104(1), 104(2)) are formed on the inside surfaces of a plurality of rod-shaped comb-tooth members (114) provided around the solenoid coils (104(1), 104(2)).

LAMINATED INDUCTOR ELEMENT AND PRODUCTION METHOD THEREFOR

A laminated body (12) including a magnetic layer (12a) and non-magnetic layers (12b, 12c) formed on both main surfaces of the magnetic layer (12a) . Linear conductors (16, 16 …, 18, 18, …) form part of an inductor having the longitudinal direction of the laminated body (12) as the winding shaft thereof, and are formed on both main surfaces of the magnetic layer (12a). Pad electrodes (14a, 14a, …) are formed on the upper surface of the laminated body (12) and pad electrodes (14b, 14b, …) are formed on the lower surface of the laminated body (12) so as to be symmetrical to the pad electrodes (14a, 14a, …). Two mutually different points of the inductor are each electrically connected to two different pad electrodes (14a, 14a).

COIL COMPONENT

A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; a coil portion buried in the body, and having first and second lead-out portions; first and second external electrodes disposed on the bottom surface of the body and spaced apart from each other; via electrodes penetrating through the body and connecting the first and second lead-out portions and the first and second external electrodes to each other; a third external electrode including a pad portion disposed on the bottom surface of the body, and a connection portion extending to portions of the plurality of walls of the body, and spaced apart from the first and second external electrodes; a shielding layer including a cap portion disposed on the other surface of the body, and side wall portions respectively disposed on the plurality of walls of the body, and connected to the third external ...

MULTILAYER BEAD AND BOARD HAVING THE SAME

A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided. 1. A multilayer bead comprising:a body in which a plurality of ceramic layers are stacked;a plurality of internal electrode patterns formed on the plurality of ceramic layers; andfirst and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively,wherein a stacking direction of the plurality of ceramic layers is perpendicular to both end surfaces of the body on which the first and second external electrodes are formed, anda coil axis of the internal coil is parallel to a mounting surface of the body.2. The multilayer bead of claim 1 , wherein a marking pattern is provided on at least one surface of the body.3. The multilayer bead of claim 2 , wherein the marking pattern is provided on at least one of two outermost ceramic layers disposed in outermost positions of the body among the plurality of ceramic layers stacked in the body.4. The multilayer bead of claim 2 , wherein the marking pattern is provided on any one of two outermost ceramic layers disposed in outermost positions of the body among the plurality of ceramic layers stacked in the body claim 2 , and a minimum separation distance between the internal coil and an ...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE

The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME

Disclosed herein is a common mode filter, inlcuding: an external magnetic layer; an insulating layer formed on the external magnetic layer and having coil electrodes therein; a protecting layer formed on the insulating layer; an internal magnetic layer formed inside an opening part formed in one surface of the protecting layer; and external electrode terminals passing through the protecting layer and connected with end portions of the coil electrodes, so that there can be provided a common mode filter having excellent durability, moisture resistance, and heat resistance.

Fabrication of multi-dimensional microstructures

A method for forming a multi-dimensional microstructure, such as but not limited to a three dimensional (3-D) microstructure coil for use in a data transducer of a data storage device. In accordance with some embodiments, the method generally includes providing a base region comprising a first conductive pathway embedded in a first dielectric material; etching a plurality of via regions in the first dielectric material that are each partially filled with a first seed layer that contacts the embedded first conductive pathway; and using the first seed layer to form a conductive pillar in each of the plurality of via regions, wherein each conductive pillar comprises a substantially vertical sidewall that extends to a first distance above the base region.

PLANAR COIL, AND TRANSFORMER, WIRELESS TRANSMITTER, AND ELECTROMAGNET PROVIDED WITH PLANAR COIL

A planar coil (10) of the present disclosure includes a base (1) having a first surface (1a) and including a magnet material, and a first metal layer (2a) located on the first surface (1a) and having voids (3).

電子部品

КАТУШКА ПЕРЕМЕННОЙ ИНДУКТИВНОСТИ В ИНТЕГРАЛЬНОМ ИСПОЛНЕНИИ

Изобретение относится к электротехнике и может быть использовано в управляемом напряжением генераторе для многодиапазонной передающей электростанции, в нагрузке перестраиваемого усилителя, сети согласования полных сопротивлений, генераторе с цифровым управлением или частотно-избирательной индуктивно-емкостной связи. Технический результат состоит в расширении диапазона регулирования. Катушка переменной индуктивности имеет значение индуктивности, которое может быть переключено между двумя или более значениями. Она включает в себя многоконтурную первичную катушку индуктивности, которая электромагнитно связана с парой вторичных катушек индуктивности. Вторичные катушки индуктивности соединены друг с другом для формирования замкнутого контура, в пределах которого они имеют изменяемую топологию, переключаемую между последовательным и параллельным соединениями для изменения значения индуктивности, обеспечиваемого многоконтурной первичной катушкой индуктивности. 4 н. и 17 з.п. ф-лы, 15 ил.

Сигнальный трансформатор

Полезная модель относится к электротехнике, а именно к железнодорожной автоматике, в частности к устройствам преобразования напряжения в сигнальных и блокировочных цепях, и может быть применена в транспортной промышленности. Технический результат заключается в повышении надежности полимерного корпуса сигнального трансформатора. Сигнальный трансформатор содержит полимерный корпус с контактной панелью, внутри которого установлен магнитопровод с обмотками, подключенный к контактной панели. Корпус выполнен в виде стакана из акрилонитрил бутадиен стирола, при этом в местах соединения стенок корпуса выполнены скругления. 1 ил.

КАТУШКА ПЕРЕМЕННОЙ ИНДУКТИВНОСТИ В ИНТЕГРАЛЬНОМ ИСПОЛНЕНИИ

... 1. Катушка переменной индуктивности в интегральном исполнении, включающая в себя: ! многоконтурную первичную катушку индуктивности; и ! пару вторичных катушек индуктивности, свзанных с упомянутой многоконтурной первичной катушкой индуктивности электромагнитным способом, причем упомянутые вторичные катушки индуктивности соединены друг с другом для формирования замкнутого контура, в пределах которого упомянутые вторичные катушки индуктивности имеют изменяемую топологию, которая может быть переключена между последовательным соединением и параллельным соединением, для изменения значения индуктивности, выводимого упомянутой многоконтурной первичной катушкой индуктивности. ! 2. Катушка переменной индуктивности в интегральном исполнении по п.1, в которой, если упомянутая пара вторичных катушек индуктивности соединена последовательно, то изменения в значении индуктивности, обеспечиваемом упомянутой многоконтурной первичной катушки индуктивности, отсутствуют. ! 3. Катушка переменной индуктивности ...

Rechteckiger Wechselstromleiter mit konstanter Hoehenabmessung

Magnetic inductor stacks with multilayer isolation layers

Radio-frequency transformers

... 827,506. Transformers. LONDON, PRINCIPAL SECRETARY OF STATE FOR FOREIGN AFFAIRS OF. Sept. 27, 1957 [Sept. 28, 1956], No. 29631/56. Class 38 (2). A radio frequency transformer comprises a primary winding P formed from a copper tape 2 attached to a polystryrene tape 8 by transparent adhesive tape 10 wound on to the centre rod 6 of Ferroxcube pot core assembly and a secondary winding S wound as a helical winding coaxial with winding S and insulated therefrom by part of the tape 8. An electrostatic earthed screen 14 may be interposed between the two windings, or the outer turn of the primary winding may be earthed. The windings are surrounded by the pot-type core which may be potted in resin or contained in moulded polythene.

Balanced, symetrical coil

Improvements relating to electrical oscillation circuits

... 380,597. Condensers. RENSIN, J., 31, Laxenburgerstrasse, FRANEK, R., 23, Mohsgasse, both in Vienna, LEUZENDORF, R., 17, Trostgasse, Baden, near Vienna, and WEISSBERG, J., 5, Girzenberggasse, Vienna. Sept. 18, 1931, No. 26188. Convention date, Feb. 17. [Class 38 (ii).] An oscillatorv circuit comprises an inductance coil and a further coil as capacity wound with two or more wires independent of the inductance wire. The Figure shows the capacity formed by 'wires g h and the inductance consisting of a winding b. Tuning is effected by removing the end turns of either winding. The capacity wires may be twisted together or one wire may be closely spiralled round the other or they may be laid parallel to one another and secured by spirals of insulating threads. The windings may be impregnated with. insulating compositions such as cellulose esters. The insulating material may be allowed to run on during winding or the wire may be drawn through, or the coils immersed in, a bath of the insulating ...

Chip type wire wound choke coil

Improvements in or relating to inductive electrical conductors

... 615,477. Transformers and inductances. PHILIPS LAMPS, Ltd. May 17, 1946, No. 14973. Convention date, April 29, 1940. Drawings to Specification. [Class 38 (ii)] [Also in Group XXXVI] A conductor such as a metallic plate, coil or straight wire which may be of constantan or iron, or a conductively-coated insulator, retains an inductance of high value at frequencies exceeding 109 by virtue of the provision on the surface of the conductor or insulator of a layer of ferromagnetic material of such nature that it presents a metallic appearance even under strong magnification. The coating may be applied by electrolysis, a suitable example of which is described (see Group XXXVI), by cathodic disintegration, or by electrophoresis, as described in Specifications 226,531 and 325,317, [both in Class 41]. One or more coated supports may be incorporated in a core or a coated wire may be used as a loaded conductor. Specification 238,559, [Class 38 (ii)], also is referred to.

Ceramic electronic component

A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thickness direction. The volume proportion of the plurality of first reinforcement layers in a region of the ceramic body in which the plurality of first reinforcement layers are provided is greater than the volume proportion of the first and second internal electrodes in an effective portion.

Coil-type electronic component and its manufacturing method

A coil-type electronic component has a coil inside or on an outer surface of its base material and is characterized in that: the base material is constituted by a group of grains of a soft magnetic alloy containing iron, silicon and other element that oxidizes more easily than iron; the surface of each soft magnetic alloy grain has an oxide layer formed on its surface as a result of oxidization of the grain; the oxide layer contains the other element that oxidizes more easily than iron by a quantity larger than that in the soft magnetic alloy grain; and grains are bonded with one another via the oxide layer.

Stacked inductor using magnetic sheets, and method for manufacturing same

The present invention relates to a multilayered chip power inductor with high direct current superposition characteristics and high-frequency characteristics, particularly to a multilayered chip power inductor using as magnetic materials a magnetic sheet filled up with soft magnetic metal powder and a magnetic core. The present invention is to provide a multilayered chip power inductor achieving high inductance and direct current superposition characteristics. In order to achieve the objective, the present invention provides a multilayered chip power inductor using a magnetic sheet, characterized in that a plurality of magnetic sheets are laminated, wherein an electrical conductive circuit is formed on the surfaces of said sheets; that a terminal is formed at an outermost part; that said electrical conductive circuit and said terminal are electrically connected through via holes, and form a circuit in the form of a coil; and that a magnetic core is inserted into said circuit, and a method for manufacturing the same.

Transformer with bypass capacitor

An electronic device comprises first, second and third inductors connected in series and formed in a metal layer over a semiconductor substrate. The first and second inductors have a mutual inductance with each other. The second and third inductors having a mutual inductance with each other. A first capacitor has a first electrode connected to a first node. The first node is conductively coupled between the first and second inductors. A second capacitor has a second electrode connected to a second node. The second node is conductively coupled between the second and third inductors.

Wireless Electroluminescent Device

An electroluminescent device ( 100 ) comprising a top electrode layer ( 102 ) and a bottom electrode layer ( 104 ), an electroluminescent layer ( 106 ) and an interconnection ( 108 ), the interconnection connecting the top and the bottom electrode layers, wherein the two electrode layers ( 102,104 ) are structured as windings; the electroluminescent layer ( 106 ) is located between the two electrode layers; and the interconnection ( 108 ) forms an electrical connection between a first end of the top electrode layer and a second end of the bottom electrode layer.

Multilayer electronic component and mounted structure of electronic component

A ferrite bead inductor comprises a ferrite bead element body having magnetic layers and inner electrodes stacked therein, and first and second outer electrodes arranged on first and second side faces of the ferrite bead element body. The inner electrode extends in the direction of shorter sides which are shorter than longer sides, so as to connect with the first and second outer electrodes. The ferrite bead element body has an interstice for allowing the magnetic layers adjacent to each other in the stacking direction to join together within an inner electrode region adapted to form the inner electrode on the magnetic layer.

Inductor structure having increased inductance density and quality factor

Disclosed is an inductor structure. The inductor structure includes a base material, at least one bottom spiral conductor disposed on the base material, a middle spiral conductor disposed on the bottom spiral conductor, a top spiral conductor disposed on the middle spiral conductor, and dielectric material separating the bottom, middle and top spiral conductors. The at least one bottom spiral conductor is connected electrically in parallel to the middle spiral conductor and the middle spiral conductor is connected electrically in series to the top spiral conductor. The top spiral conductor is thicker, narrower and less tightly wound than the middle spiral conductor and the bottom spiral conductor.

Power module and the method of packaging the same

A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.

Method of manufacturing inductor

A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.

Composite electronic component

The present invention relates to a composite electronic component having a dielectric body portion inside of which a conductive body is provided, and a magnetic body portion inside of which a conductive body is provided. In the present invention, a layer made of a metal material is arranged between the dielectric body portion and the magnetic body portion as an intermediate layer.

Integrated inductor device with high inductance, for example for use as an antenna in a radiofrequency identification system

An embodiment of integrated inductor device, comprising a plurality of modules overlaid to each other, each module including at least one coil of conducting material. The directly overlaid pairs of coils are coiled in opposite directions. The directly overlaid modules are mechanically coupled through first adhesive conductive regions and the coils of the directly overlaid modules are electrically coupled to each other through second adhesive conductive regions. The first and the second adhesive conductive regions coupling directly overlaid modules are formed in the same step of the process, are of the same material and are arranged at a same level.

Laminated electronic component equipped with inductor

A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.

Laminated ceramic electronic component

In a laminated ceramic electronic component, a first functional portion and a second functional portion are disposed within a ceramic element body so as to be adjacent to each other along a height direction, first and second internal electrodes face each other through a ceramic layer in the first functional portion, and third and fourth internal electrodes whose number of laminated layers is different from the number of laminated layers of the first and second internal electrodes face each other through the ceramic layer in the second functional portion. A marking internal conductor is disposed on the same plane as the first internal electrode and/or the second internal electrode, a marking external conductor is disposed on the side surface of the ceramic element body so as to link a plurality of exposed marking internal conductors such that it is possible to recognize vertical directionality.

Inductive Battery Charger System with Primary Transformer Windings Formed in a Multi-Layer Structure

There is provided a power system designed to enable electronic devices to be powered. The system includes a planar surface on which a device to be powered is placed. Within the power system and substantially parallel to the planar surface are multiple primary transformer windings formed in a multi-layer structure that couple energy inductively to a secondary winding formed in the device to be powered. A winding of a second layer is offset relative to a winding of a first layer.

Method for manufacturing multilayer ceramic electronic component

A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.

Printed circuit board

A printed circuit board includes metallization layers are stacked along a vertical direction and separated mechanically from one another by electrically insulating layers. A coil extends along a vertical winding axis and has turns formed by conductive tracks made in respective metallization layers, the turns being electrically connected to one another by pads going through at least one of the electrically insulating layers. A superimposition, in a plane parallel to the metallization layers, of the conductive tracks of the coil, made in a first metallization layer and a second metallization layer, that are immediately consecutive in the vertical direction, forms a pattern having two axial symmetries relative to X and Y axes orthogonal to each other and parallel to the metallization layers. The conductive tracks of each of the superimposed metallization layers are devoid, of themselves, of axial symmetry relative to the X or Y axes.

Laminated ceramic electronic component and manufacturing method therefor

A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.

System Using Multi-Layer Wire Structure for High Efficiency Wireless Communication

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

CERAMIC BODY AND METHOD FOR PRODUCING THE SAME

A ceramic body including therein conductors more effectively prevents ingress of moisture into voids between the conductors and the ceramic body. A supercritical fluid containing a monomer flows in the voids between internal electrode layers and a ceramic laminated body. Then, the voids between the internal electrode layers and the ceramic laminated body are filled with a polymer by the polymerization of the monomer. 1. A ceramic component comprising:a ceramic body;an conductor located in the ceramic body;a void located between the conductor and the ceramic body; anda polymer located in the void between the conductor and the ceramic body.2. The ceramic component according to claim 1 , wherein the ceramic body is a multilayered laminated ceramic body including a plurality of stacked ceramic layers and conductor layers interposed between the plurality of ceramic layers.3. The ceramic component according to claim 1 , wherein the ceramic component is one of a capacitor claim 1 , an inductor claim 1 , a piezoelectric element claim 1 , a multilayer ceramic substrate claim 1 , and a thermistor.4. The ceramic component according to claim 1 , wherein the conductor includes an end surface exposed at an external surface of the ceramic body.5. The ceramic component according to claim 4 , further comprising an external electrode located on the ceramic body so as to be electrically connected to the conductor.6. The ceramic component according to claim 5 , further comprising first and second plating layers located on the external electrode.7. The ceramic component according to claim 1 , wherein the void is completely filled with the polymer.8. The ceramic component according to claim 1 , wherein the void is a nano-level void.9. The ceramic component according to claim 1 , wherein the polymer is made of a polymerized monomer.10. The ceramic component according to claim 1 , wherein the polymer is made of a polyimide.11. The ceramic component according to claim 1 , further comprising ...

Common mode filter with multi spiral layer structure and method of manufacturing the same

A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

Common mode filter with multi-spiral layer structure and method of manufacturing the same

A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

Multilayered ceramic electronic component and fabrication method thereof

There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.

CORE ASSEMBLY FOR WIRELESS POWER COMMUNICATION, POWER SUPPLYING DEVICE FOR WIRELESS POWER COMMUNICATION HAVING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

Disclosed herein are a core assembly for wireless power communication, a power supplying device for wireless power communication having the same, and a method for manufacturing the same. The core assembly for wireless power communication includes: a plate shaped core including concave parts disposed in a main surface thereof and made of a magnetic material; a plurality of winding type coils received in the concave parts and partially overlapping each other; and a circuit board connected to both ends of each of the coils which controls application of a power to the coils. 1. A core assembly for wireless power communication comprising:a plate shaped core comprising concave parts disposed in a main surface thereof and made of a magnetic material; anda plurality of winding type coils received in the concave parts and partially overlappinq each other.2. The core assembly for wireless power communication of claim 1 , wherein the concave parts comprise:a first concave part formed at a first depth; anda second concave part formed to be in communication with the first concave part and having a second depth shallower than the first depth.3. The core assembly for wireless power communication of claim 2 , wherein the concave parts have a contour in the shape of a closed curve claim 2 , andthe first and second concave parts are recessed in a form in which two small closed curves inscribed in the contour of the concave parts partially overlap each other.4. The core assembly for wireless power communication of claim 3 , wherein portions at which the small closed curves partially overlap each other are recessed at the first depth.5. The core assembly for wireless power communication of claim 3 , wherein the closed curve of the contour of the concave parts has an oval shape.6. The core assembly for wireless power communication of claim 1 , wherein the concave parts comprise a bottom and a sidewall claim 1 , andthe concave parts are recessed at a size allowing an outer circumference ...

Ceramic electronic component and manufacturing method thereof

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.

Antenna, antenna apparatus, and communication apparatus

The claimed invention discloses an antenna including: a magnetic core ( 11 ); a coil winding section ( 14 a , 14 b ) in which a conductive wiring line is wound around the magnetic core; and an adjustment section ( 13 ) connected to one end of the coil winding section. The adjustment section ( 13 ) is disposed at an end part of the magnetic core ( 11 ) and includes a plurality of adjustable conductive wiring lines ( 13 b - 13 d ) formed by dividing a conductive wiring line connected to one end of the coil winding section ( 14 a , 14 b ) into multiple conductive wiring lines in a direction intersecting with a winding axis direction of the coil winding section ( 14 a , 14 b ).

COMMON MODE NOISE FILTER

Disclosed herein is a common mode noise filter including: a plurality of insulation layers configuring a laminated body formed on a substrate; internal electrode coils included in the plurality of insulation layers; external electrode terminals connected to an end portion of the internal electrode coils; and a magnetic layer formed on a surface of the laminated body. According to the present invention, the common mode noise filter has the magnetic layer including the conductive metal on the uppermost layer thereof, such that the permeability of the ferrite composite may be increased and the ferrite powder may be effectively compensated for the eddy current loss of the internal electrode coil, thereby making it possible to improve the impedance characteristics of the common mode noise filter. 1. A common mode noise filter comprising:a plurality of insulation layers configuring a laminated body formed on a substrate;internal electrode coils included in the plurality of insulation layers;external electrode terminals connected to an end portion of the internal electrode coils; anda magnetic layer formed on a surface of the laminated body.2. The common mode noise filter according to claim 1 , wherein the magnetic layer includes a ferrite powder claim 1 , a polymer binder claim 1 , and a conductive metal.3. The common mode noise filter according to claim 2 , wherein the ferrite powder is at least one kind selected from a group consisting of FeO claim 2 , NiO claim 2 , CuO claim 2 , ZnO claim 2 , MnO claim 2 , CoO claim 2 , BiO claim 2 , and Ti.4. The common mode noise filter according to claim 2 , wherein the polymer binder is at least one kind selected from a group consisting of an epoxy resin claim 2 , a polyimide resin claim 2 , a polyamide resin claim 2 , and a polyaniline resin.5. The common mode noise filter according to claim 2 , wherein the conductive metal is at least one kind selected from a group consisting of Fe claim 2 , FeNi claim 2 , FeCo claim 2 , FeAl ...

ELECTRIC CIRCUIT CHIP AND METHOD OF MANUFACTURING ELECTRIC CIRCUIT CHIP

An electric circuit chip includes: a substrate made of glass or a semiconductor; and a circuit which is disposed in an inside of the substrate, has a first end portion and a second end portion exposed at specific surfaces of the substrate, and includes a spiral inductor. 1. An electric circuit chip comprising:a substrate made of glass or a semiconductor; anda circuit which is disposed in an inside of the substrate, has a first end portion and a second end portion exposed at specific surfaces of the substrate, and comprises a spiral inductor.2. The electric circuit chip according to claim 1 ,wherein external electrode terminals are provided at the first end portion and the second end portion.3. The electric circuit chip according to claim 1 , wherein the inductor has a spiral shape that follows a virtual column claim 1 , ellipticalcolumn, or circular ring.4. The electric circuit chip according to claim 1 , wherein the inductor is constituted by a continuous curve.5. The electric circuit chip according to claim 1 ,wherein a core made of a magnetic body is provided in a space surrounded by the inductor.6. The electric circuit chip according to claim 1 ,wherein the first end portion and the second end portion are provided on the same surface of the substrate.7. The electric circuit chip according to claim 1 ,wherein the substrate has a first surface and a second surface which is located on an opposite side of the first surface,the first end portion is provided on the first surface, andthe second end portion is provided on the second surface.8. A method of manufacturing an electric circuit chip comprising:irradiating an inside of a substrate made of glass or a semiconductor with laser light and scanning a focal point at which the laser light is collected, thereby forming spiral modified regions;carrying out an etching treatment on the substrate in which the modified regions are formed and removing the modified regions, thereby forming spiral micropores; andfilling the ...

Multilayered inductor and method of manufacturing the same

There is provided a multilayered inductor, including: an inductor body; a coil part formed on the inductor body and having a conductive circuit and a conductive via; and external electrodes formed on both end surfaces of the inductor body, wherein the inductor body includes 65 to 95 wt % of a metallic magnetic material and 5 to 35 wt % of an organic material.

Electronic component and method for producing the same

A multilayer body includes a plurality of insulator layers that are stacked together and has top and bottom surfaces that oppose each other in a stacking direction and side surfaces that connect the top and bottom surfaces to each other. A coil is incorporated in the multilayer body. A connecting conductor is provided on the top surface of the multilayer body so as not to be in contact with the side surfaces of the multilayer body. An outer electrode is provided on the top surface of the multilayer body so as to cover the connecting conductor. A via-hole conductor connects an end portion of the coil and the connecting conductor to each other and extends through at least one of the insulator layers in the stacking direction.

MONOLITHIC CERAMIC ELECTRONIC COMPONENT

A monolithic ceramic electronic component includes at least two types of stacked ceramic layers having different dielectric constants and also includes internal electrodes partially disposed along boundaries between the ceramic layers having different dielectric constants. The internal electrodes include an additive component common to a component included in at least one of the ceramic layers adjacent to each other with the internal electrodes placed therebetween. 1. A monolithic ceramic electronic component comprising:at least two types of stacked ceramic layers having different dielectric constants; andinternal electrodes at least partially disposed along boundaries between the ceramic layers having different dielectric constants; whereinthe internal electrodes include an additive component common to a component included in at least one of ceramic layers of the at least two types of stacked ceramic layers that are adjacent to each other with the internal electrodes disposed therebetween.2. The monolithic ceramic electronic component according to claim 1 , wherein the additive component is common to a component included in both of the adjacent ceramic layers.3. The monolithic ceramic electronic component according to claim 1 , wherein the additive component is common to a major component of a ceramic material included in the ceramic layers.4. The monolithic ceramic electronic component according to claim 3 , wherein the additive component is common to a major component of a ceramic material included in some of the ceramic layers that have a higher dielectric constant.5. The monolithic ceramic electronic component according to claim 4 , wherein the major component of the ceramic material included in the ceramic layers having a higher dielectric constant and the additive component are a Ba—Nd—Ti oxide.6. The monolithic ceramic electronic component according to claim 3 , wherein the additive component is common to a major component of a ceramic material included in ...

Chip inductor and method for manufacturing the same

The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.

COIL PARTS AND METHOD OF MANUFACTURING THE SAME

The present invention discloses a coil part including: a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern; a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; and a ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside. 1. A coil part comprising:a first coil body including a first magnetic substrate, a first coil pattern provided on the first magnetic substrate, and a first insulating layer covering the first coil pattern;a second coil body including a second magnetic substrate corresponding to the first magnetic substrate, a second coil pattern provided on the second magnetic substrate to correspond to the first coil pattern, and a second insulating layer covering the second coil pattern; anda ferrite composite interposed between the first insulating layer and the second insulating layer to couple the first coil body and the second coil body and having a spacer ball inside.2. The coil part according to claim 1 , wherein a first alignment hole is formed in the first magnetic substrate and a second alignment hole corresponding to the first alignment hole is formed in the second magnetic substrate so that the first coil body and the second coil body are coupled by the ferrite composite in a state of being aligned through the first alignment hole and the second alignment hole.3. The coil part according to claim 1 , wherein each of the first magnetic substrate and the second magnetic substrate is formed with a size of 4 to 8 inches and a thickness of 0.2 to 1 mm.4. The coil part according to claim 1 ...

Integrated inductors

Multiple-inductor embodiments for use in substrates are provided herein.

ELECTRONIC COMPONENT

A multilayer body is formed of a plurality of insulator layers that are stacked on top of one another. A coil is a helical coil provided in the multilayer body and includes a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together. The path includes corners that project outward and corners that project inward. Each of the via hole conductors are provided at one of the corners, which project outward. 1. An electronic component comprising:a multilayer body; anda coil that is a helical coil provided in the multilayer body, the coil including a plurality of coil conductor layers that are superposed with one another so as to form a ring-shaped path when seen in plan view from a stacking direction and a plurality of via hole conductors that connect the plurality of coil conductor layers together,wherein the ring-shaped path includes a plurality of first corners that project outward of the ring-shaped path and a second corner that projects inward of the ring-shaped path, andwherein all of the via hole conductors are provided at the respective first corners.2. The electronic component according to claim 1 , further comprising:a conductor part provided in the multilayer body and provided outside of the ring-shaped path when seen in plan view from the stacking direction,wherein the ring-shaped path avoids contacting the conductor part at the second corner.3. The electronic component according to claim 2 ,wherein the multilayer body is formed by a plurality of insulator layers each having a rectangular shape stacked on top of one another,wherein the conductor part is an outer electrode provided at a corner of at least one of the insulator layers,wherein the ring-shaped path has a substantially rectangular shape including four straight lines that extend along respective four sides of ...

TRANSMISSION-LINE TRANSFORMER IN WHICH SIGNAL EFFICIENCY IS MAXIMISED

Provided is a transmission line transformer having increased signal efficiency. The transmission line transformer is formed on an integrated circuit (IC), wherein a first transmission line disposed in one direction. Second and third transmission lines have same length direction as the first transmission line and are spaced apart from each other in a lateral direction above or below the first transmission line. Accordingly, an area of the first transmission line and areas of the second and third transmission lines, which face each other, are increased, thereby improving a coupling factor. Also, since a secondary transmission line is divided into two regions and uses the second and third transmission lines that have narrower widths than the first transmission line, parasitic capacitance components generated between the first through third transmission lines and a semiconductor substrate may be decreased. 1. A transmission line transformer formed on an integrated circuit (IC) , the transmission line transformer comprising:a first transmission line disposed in one direction; andsecond and third transmission lines having same length direction as the first transmission line and spaced apart from each other in a lateral direction above or below the first transmission line.2. The transmission line transformer of claim 1 , wherein a width of the first transmission line is equal to a sum of a width of the second transmission line claim 1 , a width of the third transmission line claim 1 , and a distance between the second and third transmission lines.3. The transmission line transformer of claim 1 , wherein one end of the first transmission line in a width direction is disposed in a region between two ends of the second transmission line claim 1 , and another end of the first transmission line in the width direction is disposed in a region between two ends of the third transmission line.4. The transmission line transformer of claim 1 , wherein the first transmission line forms ...

Multi-layer-multi-turn high efficiency inductors for an induction heating system

A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer. 1. A ceramic electronic component comprising:a ceramic body;a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body;at least one coating layer covering a portion of the surface of the ceramic body on which the plurality of internal electrodes are exposed, the at least one coating layer being made of a glass medium or resin medium in which metal powder particles are dispersed; andat least one electrode terminal provided directly on the at least one coating layer and including a plating film; whereinthe metal powder particles define conduction paths electrically connecting the plurality of internal electrodes with the at least one electrode terminal;the metal powder particles have an elongated shape as viewed in cross section along a direction of thickness of the at least one coating layer; andthe metal powder particles defining the conduction paths have a maximum diameter equal to or larger than a thickness of the at least one coating layer.2. The ceramic electronic component according to claim 1 , wherein the metal powder particles are in flake form.3. The ceramic ...

Laminated inductor

A laminated inductor includes a laminate constituted by multiple insulator layers, and a coil conductor formed in a spiral shape inside the laminate; wherein the coil conductor has conductor patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns; wherein conductor patterns formed on some insulator layers each represent a C-shaped pattern that includes the four corners and has an open part on one side, of a roughly rectangular shape, while a conductor pattern formed on other insulator layer(s) represents a line-shaped pattern corresponding to the open part of one side of the aforementioned C-shaped pattern of the roughly rectangular shape; and wherein an insulator layer on which the C-shaped pattern is formed, and insulator layer(s) on which the line-shaped pattern is formed, adjoin each other at least in one part of the laminate.

LAMINATED INDUCTOR

A laminated inductor includes: a laminate constituted by multiple insulator layers; external electrodes formed on the outside of the laminate; and a coil conductor formed spirally inside the laminate, wherein the coil conductor has leaders that electrically connect to the external electrodes and a coil body other than the leaders, wherein the coil conductor has conductive patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns, wherein all of the conductor patterns constituting the coil body are either a C-shaped pattern or line-shaped pattern, wherein the coil body has a partial structure where two or more C-shaped pattern layers are stacked together successively, and wherein the number of C-shaped patterns in the coil body is greater than that of line-shaped patterns. 1. A laminated inductor comprising:a laminate constituted by multiple insulator layers;external electrodes formed on the outside of the laminate; anda coil conductor formed spirally inside the laminate;wherein the coil conductor has leaders that electrically connect to the external electrodes and a coil body other than the leaders;wherein the coil conductor has conductive patterns formed on the insulator layers, and via hole conductors that penetrate through the insulator layers and electrically connect the multiple conductor patterns;wherein a conductor pattern formed on some insulator layers represents a C-shaped pattern that includes the four corners, and has an open part on one side, of a roughly rectangular shape, and a conductor pattern formed on other insulator layer(s) is a line-shaped pattern corresponding to the open part of one side of the C-shaped pattern of the roughly rectangular shape;wherein all of the conductor patterns constituting the coil body are either the C-shaped pattern or line-shaped pattern;wherein the coil body has a partial structure where two or more C-shaped ...

Multi-layer-multi-turn high efficiency inductors for electrical circuits

A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Method for operation of multi-layer-multi-turn high efficiency inductors with cavity structure

A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.

Method For Making Magnetic Components With M-Phase Coupling, And Related Inductor Structures

An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg.

COMMON MODE CHOKE COIL AND METHOD FOR MANUFACTURING THE SAME

There is provided a common mode choke coil in which a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer and two facing conductive coils are included in the non-magnetic layer, the non-magnetic layer is formed of sintered glass ceramics, the conductive coils and are formed of a conductor containing copper, and at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing FeO, MnO, NiO, ZnO and CuO. The sintered ferrite material has an FeO-reduced content of 25 to 47 mol % and a MnO-reduced content of 1 to 7.5 mol %, or FeO-reduced content of 35 to 45 mol % and a MnO-reduced content of 7.5 to 10 mol %, and a CuO reduced content of 5 mol %. 1. A common mode choke coil comprising a non-magnetic layer and a second magnetic layer stacked on a first magnetic layer , and two conductive coils facing one another included in the non-magnetic layer ,{'sub': 2', '3', '2', '3', '2', '3', '2', '3', '2', '3', '2', '3, 'wherein the non-magnetic layer is formed of sintered glass ceramics, the conductive coil is formed of a conductor containing copper, at least one of the first magnetic layer and the second magnetic layer is formed of a sintered ferrite material containing FeO, MnO, NiO, ZnO and CuO, and the sintered ferrite material has an FeO-reduced content of not less than 25 mol % but not more than 47 mol % and a MnO-reduced content of 1 mol % or more and less than 7.5 mol %, or FeO-reduced content of not less than 35 mol % but not more than 45 mol % and a MnO-reduced content of not less than 7.5 mol % but not more than 10 mol %, and a CuO reduced content of 5 mol %.'}2. The common mode choke coil according to claim 1 , wherein the first magnetic layer and the second magnetic layer are connected through inner coil parts of the two conductive coils disposed in the non-magnetic layer.3. A method of manufacturing a common mode choke coil in which a non-magnetic layer and a second magnetic ...

LAMINATED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT

A laminated electronic component includes a first magnetic material portion, a low-magnetic-permeability portion laminated on the first magnetic material portion, a second magnetic material portion laminated on the low-magnetic-permeability portion, at least one annular or spiral coil disposed within the low-magnetic-permeability portion, and a plurality of columnar magnetic material portions disposed within the low-magnetic-permeability portion so as to extend through inside of the coil and connecting the first magnetic material portion to the second magnetic material portion. 1. A laminated electronic component comprising:a first magnetic material portion;a low-magnetic-permeability portion laminated on the first magnetic material portion;a second magnetic material portion laminated on the low-magnetic-permeability portion;at least one annular or spiral coil disposed within the low-magnetic-permeability portion; anda plurality of columnar magnetic material portions disposed within the low-magnetic-permeability portion so as to extend through inside of the coil and connect the first magnetic material portion to the second magnetic material portion.2. The laminated electronic component according to claim 1 , wherein the coil includes a pair of coils which are electromagnetically coupled to each other to constitute a common mode choke coil.3. The laminated electronic component according to claim 1 , wherein each of the columnar magnetic material portions has a circular transverse section.4. The laminated electronic component according to claim 2 , wherein each of the columnar magnetic material portions has a circular transverse section.5. A method of manufacturing a laminated electronic component claim 2 , the method comprising the steps of:preparing a plurality of magnetic material sheets;preparing a plurality of low-magnetic-permeability sheets;forming, in the low-magnetic-permeability sheets, a plurality of holes extending through the low-magnetic-permeability ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9≦T/T≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained. 1. A multilayer ceramic electronic component , comprising:a ceramic body having external electrodes; andinternal electrodes disposed between ceramic layers within the ceramic body,when a direction in which the external electrodes are connected and extended is denoted as a ┌width direction┘; a direction in which the internal electrodes are laminated is denoted as a ┌thickness direction┘; and a direction perpendicular to the width direction and the thickness direction is denoted as a ┌length direction┘, the ceramic body having a width smaller than a length thereof,the number of the internal electrodes laminated being 250 or more,{'sub': d', 'e', 'e', 'd, 'when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and'}{'sub': m', 'a', 'a', 'm, 'when the thickness of a central portion in a width direction of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, in a cross section in a width-thickness direction of the ceramic body, 0.9≦T/T≦0.97.'}2. The multilayer ceramic electronic component of claim 1 , wherein the central portion in the width direction of the ceramic body is within sections inside 15% of ...

THIN FILM TYPE COMMON MODE FILTER

The present invention relates to a common mode filter and a method of manufacturing the same and provides a thin film type common mode filter including: a first magnetic substrate; a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode; a core magnetic layer disposed on the first laminate; a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; and a second magnetic substrate disposed on the second laminate. 1. A thin film type common mode filter comprising:a first magnetic substrate;a first laminate disposed on the first magnetic substrate and including a primary coil pattern electrode;a core magnetic layer disposed on the first laminate;a second laminate disposed on the core magnetic layer and including a secondary coil pattern electrode; anda second magnetic substrate disposed on the second laminate.2. The thin film type common mode filter according to claim 1 , wherein the first laminate is formed by laminating at least one insulation sheet having an internal electrode on one surface.3. The thin film type common mode filter according to claim 2 , wherein when the insulation sheets are at least two claim 2 , the internal electrodes formed on the respective insulation sheets are connected through a via-hole to form the primary coil pattern electrode.4. The thin film type common mode filter according to claim 1 , wherein the second laminate is formed by laminating at least one insulation sheet having an internal electrode on one surface.5. The thin film type common mode filter according to claim 4 , wherein when the insulation sheets are at least two claim 4 , the internal electrodes formed on the respective insulation sheets are connected through a via-hole to form the secondary coil pattern electrode.6. The thin film type common mode filter according to or claim 4 , wherein the internal electrode is formed by one method of photolithography claim 4 , E-beam or focused ...

System and Method for Integrated Inductor

In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seamless ferromagnetic material surrounding at least a first portion of the conductor.

PARALLEL STACKED SYMMETRICAL AND DIFFERENTIAL INDUCTOR

A parallel stacked symmetrical and differential inductor and manufacturing method of the same is disclosed. The parallel stacked symmetrical and differential inductor is disposed on a substrate and comprises at least one first conductive layer () disposed on an insulating layer and at least one subsequent conductive layer () disposed on a plurality of insulating layers stacked under the at least one first conductive layer (). The at least one first conductive layer () and each of the at least one subsequent conductive layer () are electrically connected by a first plurality of conductive plugs () in a winding region (). Each of the at least one subsequent conductive layer () are electrically connected by a second plurality of conductive plugs () in a bridge region (). 1. A parallel stacked symmetrical and differential inductor , disposed on a substrate , comprising{'b': 202', '204, 'at least one first conductive layer (, ) disposed on at least one insulating layer;'}{'b': 206', '208', '202', '204, 'at least one subsequent conductive layer (, ) disposed on at least one insulating layer stacked under the at least one first conductive layer (, );'}characterized in that{'b': 202', '204', '206', '208', '214', '104, 'the at least one first conductive layer (, ) and the at least one subsequent conductive layer (, ) are electrically connected by a first plurality of conductive plugs () in a winding region (); and'}{'b': 206', '208', '212', '102, 'each of the at least one subsequent conductive layer (, ) are electrically connected by a second plurality of conductive plugs () in a bridge region ().'}2202204110112114116120122124126104117118119102. A parallel stacked symmetrical and differential inductor according to wherein claim 1 , the at least one first conductive layer ( claim 1 , ) further comprises a first and a second symmetrical winding portion comprising a plurality of concentrically arranged semi-circular traces ( claim 1 , claim 1 , claim 1 , claim 1 , claim 1 , ...

Multilayer coil component

A multilayer coil component has an element body, a coil, a pair of first external electrodes, a pair of second external electrodes, a first connection conductor, and a second connection conductor. The coil is composed of a plurality of internal conductors arranged in the element body and connected to each other. The first external electrodes are arranged on a first principal face of the element body. The second external electrodes are arranged on the first principal face. The first connection conductor is arranged between the coil and the first external electrodes in the element body and is connected to one end of the coil and to the first external electrodes. The second connection conductor is arranged between the coil and the second external electrodes in the element body and is connected to the other end of the coil and to the second external electrodes.

INTEGRATED CIRCUIT INDUCTORS

In order to reduce the inter-path capacitance of an inductor, an integrated circuit inductor design is provided in which the path crossings are designed such that the voltage differences between the adjacent paths in the loops are (in total) minimised. 1. An inductor comprising a conducting track arranged in loops , each loop comprising at least two concentric paths , wherein the track length comprises tap regions at the ends of the tracks and a central track region which comprises the concentric paths of the loops , wherein the central track region comprises a sequence of track sections , each comprising a loop half turn , and crossings between tracks sections , with the crossings spaced along the central track region by one or two track sections , wherein the central track section has a parameter p defined as:p=the sum of squares of normalised differences in track section sequence number for all adjacent pairs of track sections in each loop,wherein the path crossings are at locations such that the parameter p is the minimum possible value of p.2. An inductor as claimed in claim 1 , comprising a figure of eight track with n concentric paths per loop claim 1 , and p=(n−1)(2n−1)/6n.3. An inductor as claimed in claim 2 , wherein the track comprises a figure of eight with two concentric paths in each of the two loops claim 2 , and p=¼.4. An inductor as claimed in claim 3 , wherein there are two crossings claim 3 , one at the top and one at the bottom of the figure of eight shape.5. An inductor as claimed in claim 3 , wherein a tap area is provided symmetrically between the two loops.6. An inductor as claimed in claim 2 , wherein the track comprises a figure of eight with three concentric paths in each loop claim 2 , and p= 5/9.7. An inductor as claimed in claim 6 , wherein there are four crossings claim 6 , one at the top and one at the bottom of the figure of eight shape between the outermost pair of concentric paths claim 6 , and two at the crossing area claim 6 , ...

Electronic component and method for manufacturing the same

The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself.

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE

A wiring substrate includes a first insulating layer, a first magnetic layer that is a first plating film formed on the first insulating layer, a flat coil formed on the first magnetic layer, and a second magnetic layer that is a second plating film formed on the flat coil. 1. A wiring substrate comprising:a first insulating layer;a first magnetic layer that is a first plating film formed on the first insulating layer;a flat coil formed on the first magnetic layer; anda second magnetic layer that is a second plating film formed on the flat coil.2. The wiring substrate as claimed in claim 1 , further comprising:an insulating film formed between the flat coil and the first magnetic layer.3. The wiring substrate as claimed in claim 1 , wherein the flat coil is a third plating film.4. The wiring substrate as claimed in claim 1 , further comprising:an insulating part;wherein the flat coil includes a coil part having one or more coils,wherein the insulating part is formed in a space between the one or more coils of the coil part from a plan view.5. The wiring substrate as claimed in claim 1 , further comprising:a second insulating layer formed on the second magnetic layer;a first wiring part formed on the second insulating layer; anda first via that penetrates the second insulating layer and the second magnetic layer;wherein the flat coil has one end that is connected to the first wiring part by the first via.6. The wiring substrate as claimed in claim 5 , further comprising:a second wiring part formed on the second insulating layer; anda second via that penetrates the second insulating layer;wherein the flat coil has another end that is connected to the second wiring part by the second via.7. The wiring substrate as claimed in claim 5 , wherein the second magnetic layer includes an opening to which the first via is inserted.8. The wiring substrate as claimed in claim 5 , further comprising an insulating film formed between the second magnetic layer and the second ...

LAMINATED-TYPE ELECTRONIC COMPONENT

A laminated-type electronic component including: plural magnetic material layers; plural conductive patterns; a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns; a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; and at least one magnetic gap formed in the laminated layer body, wherein the magnetic gaps are formed of a compound of Ni and Cu. 1. A laminated-type electronic component comprising:plural magnetic material layers;plural conductive patterns;a laminated layer body formed by laminating the plural magnetic material layers and the plural conductive patterns;a coil formed in the laminated layer body by connecting the conductive patterns between the magnetic material layers; andat least one magnetic gap formed in the laminated layer body, whereinthe magnetic gaps are formed of a compound of Ni and Cu.2. The laminated-type electronic component according to claim 1 , whereinthe magnetic material layers are formed of ferrite containing Ni.3. The laminated-type electronic component according to claim 1 , wherein{'sub': 2', '2', '3 :, 'the magnetic material layers are formed of Ni—Cu—Zn-based ferrite made by adding SnOof 0.6 to 1.5 wt % to a ferrite material containing NiO: 19 to 45 mol %, ZnO: 1 to 25 mol %, CuO: 6 to 10 mol %, and FeO47 to 49 mol %.'}4. The laminated-type electronic component according to claim 1 , whereina ratio of Ni to Cu is 2:8 to 8:2.5. The laminated-type electronic component according to claim 1 , whereinplural magnetic gaps are formed in the laminated layer body. This application is based upon and claims the benefit of priority from the prior Japanese Patent Applications No. 2012-91657 filed on Apr. 13, 2012 and No. 2012-262071 filed on Nov. 30, 2012, the entire contents of which are incorporated herein by reference.1. Field of the InventionThe present invention relates to a laminated-type electronic component in ...

LAMINATED INDUCTOR ELEMENT

A laminated inductor element includes a laminated substrate including a plurality of layers including a magnetic layer, an inductor including coil conductors provided between layers of the laminated substrate and connected in a lamination direction of the laminated substrate, and a pair of non-magnetic layers laminated on the laminated substrate so as to sandwich the laminated substrate in the lamination direction. The non-magnetic layers include cover layers made of low temperature co-fired ceramics.

CHIP INDUCTOR AND METHOD OF MANUFACTURING THE SAME

Disclosed herein are a chip inductor and a method of manufacturing the same. The chip inductor includes: a laminate in which a magnetic sheet having a C-pattern electrode formed thereon and a magnetic sheet having an I-pattern electrode formed thereon are alternately laminated; a via penetrating through the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; and an external electrode terminal provided at either side portion of the laminate. 1. A chip inductor , comprising:a laminate in which a magnetic sheet having a C-pattern electrode formed thereon and a magnetic sheet having an I-pattern electrode formed thereon are alternately laminated;a via penetrating through the magnetic sheet and connecting the C-pattern electrode and the I-pattern electrode; andan external electrode terminal provided at either side portion of the laminate.2. The chip inductor according to claim 1 , wherein the via includes:a first via formed on the magnetic sheet on which the C-pattern electrode is formed and connecting one end of the C-pattern electrode to one end of the I-pattern electrode; anda second via formed on the magnetic sheet on which the I-pattern electrode is formed and connecting the other end of the I-pattern electrode to the other end of the C-pattern electrode.3. The chip inductor according to claim 1 , wherein a pattern line of the C-pattern electrode is a circle claim 1 , an ellipse or a quadrangle.4. The chip inductor according to claim 1 , wherein a gap between the ends of the C-pattern electrode is between 5 μm and 100 μm.5. The chip inductor according to claim 4 , wherein a length of the I-pattern electrode is greater than the gap between the ends of the C-pattern electrode.6. The chip inductor according to claim 5 , wherein a ratio of the length of the I-pattern electrode to the gap between the ends of the C-pattern electrode is between 1.1 and 1.3.7. The chip inductor according to claim 1 , wherein claim 1 , assuming the magnetic ...

LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF

A laminated inductor element is configured to prevent warpage of the entire element with a structure in which a non-magnetic ferrite layer on an upper surface side is reduced in thickness to achieve a reduction in height of the entire element, a non-magnetic ferrite layer on a lower surface side is increased in thickness to be thicker than the non-magnetic ferrite layer so as to prevent a metal component diffused from a magnetic ferrite layer from coming into electrical contact with a land electrode of a mounting substrate, and an inductor is disposed toward the lower surface side across a non-magnetic ferrite layer. 1. (canceled)2. A laminated inductor element comprising:a plurality of magnetic layers each defined by a lamination of a plurality of magnetic sheets;a plurality of non-magnetic layers each defined by a lamination of a plurality of non-magnetic sheets; andan inductor including coils provided between the sheets and connected in a lamination direction; whereinthe non-magnetic layers define outermost layers and an intermediate layer of the laminated inductor element;the non-magnetic layer on the outermost layer on a first surface side and the non-magnetic layer on the outermost layer on a second surface side are different in thickness; andthe inductor is disposed toward either one of the first and second surface sides in the lamination direction across the non-magnetic layer defining the intermediate layer.3. The laminated inductor element described in claim 2 , whereinthe first surface side is mounted with an electronic component defining an electronic component module, and the second surface side is provided with a terminal electrode to be connected to a land electrode of a mounting substrate which is mounted with the electronic component module; andthe non-magnetic layer on the first surface side is thinner than the non-magnetic layer on the second surface side.4. The laminated inductor element described in claim 2 , further comprising internal ...

CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC APPARATUS

A ceramic electronic component includes a ceramic element, a first inner electrode, a second inner electrode, an outer electrode, and a first auxiliary electrode. The first auxiliary electrode extends to a first surface of the ceramic element. The first inner electrode extends along a first direction on the first surface. The first auxiliary electrode extends outward from the region where the first inner electrode is disposed in the first direction on the first surface. The outer electrode covers the first inner electrode and the first auxiliary electrode. 1. A ceramic electronic component comprising:a ceramic element;at least one first inner electrode disposed inside the ceramic element and extending to a first surface of the ceramic element;a second inner electrode disposed inside the ceramic element, facing the at least one first inner electrode, and extending to an opposite surface of the ceramic element, the opposite surface being opposed to the first surface;an outer electrode arranged on the first surface of the ceramic element, connected to the at least one first inner electrode, and including a plated film; anda first auxiliary electrode disposed inside the ceramic element and extending to the first surface of the ceramic element; whereinthe at least one first inner electrode extends along a first direction on the first surface;the first auxiliary electrode extends outward from a region where the at least one first inner electrode is disposed in the first direction on the first surface; andthe outer electrode covers the at least one first inner electrode and the first auxiliary electrode.2. The ceramic electronic component according to claim 1 , wherein the at least one first inner electrode includes a plurality of first inner electrodes extending along a second direction perpendicular or substantially perpendicular to the first direction; andthe first auxiliary electrode is positioned between the plurality of first inner electrodes.3. The ceramic ...

Inductor and method of manufacturing the same

Disclosed herein are an inductor and a method of manufacturing the same. More specifically, in the inductor according to the present invention, a coil with a fine pattern may be formed, and an insulating resin composite including liquid crystal oligomer for reducing occurrence of deformation of the coil may be used for an insulating substrate.

Magnetic module for power inductor, power inductor, and manufacturing method thereof

There is provided a power inductor including: a main body; and first and second external electrodes formed on both end portions of the main body, wherein the main body includes: upper and lower cover layers; at least one coil support layer having a through hole formed in a center thereof, at least one first recess portion formed in both lateral surfaces thereof and a plurality of second recess portions formed in respective corners thereof, and disposed between the upper and lower cover layers; and first and second coil layers formed on both surfaces of the coil support layer and having respective one ends thereof connected to the first and second external electrodes.

CHIP DEVICE, MULTI-LAYERED CHIP DEVICE AND METHOD OF PRODUCING THE SAME

There is provided a multi-layered chip device, including: a multi-layered body in which a plurality of inner magnetic layers are stacked; an inner electrode layer formed within the multi-layered body; an outer magnetic layer stacked on at least one of an upper surface and a lower surface of the multi-layered body; and external electrodes formed on outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer, wherein a length of the outer magnetic layer is shorter than the inner magnetic layer. 1. A multi-layered chip device , comprising:a multi-layered body including a plurality of inner magnetic layers stacked therein;an inner electrode layer formed within the multi-layered body;an outer magnetic layer stacked on at least one of an upper surface and a lower surface of the multi-layered body; andexternal electrodes formed on outside of the multi-layered body and the outer magnetic layer and electrically connected to the inner electrode layer,a length of the outer magnetic layer being shorter than the inner magnetic layer.2. The multi-layered chip device of claim 1 , wherein a thickness of the outer magnetic layer is 0.9 to 1.1 times of that of the external electrode formed on the outside of the outer magnetic layer.3. The multi-layered chip device of claim 1 , wherein a thickness of the outer magnetic layer is equal to that of the external electrode formed on the outside of the outer magnetic layer.4. The multi-layered chip device of claim 1 , wherein a length and a width of the multi-layered chip device have a range of 2.5±0.1 mm and 2.0±0.1 mm.5. The multi-layered chip device of claim 1 , wherein the outer magnetic layer includes the same material as the inner magnetic layer.6. The multi-layered chip device of claim 1 , further comprising a non-magnetic layer formed in the multi-layered body.7. The multi-layered chip device of claim 1 , wherein the inner electrode layer includes silver (Ag).8. The multi- ...

CONDUCTIVE PASTE FOR INTERNAL ELECTRODES, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF MANUFACTURING THE SAME

There are provided a conductive paste for internal electrodes, a multilayer ceramic electronic component including the same, and a method of manufacturing the same. The conductive paste for internal electrodes including: a nickel (Ni) powder; a nickel oxide (NiO) powder having a content of 5.0 to 15.0 parts by weight based on 100 parts by weight of the nickel powder; and an organic vehicle. 1. A conductive paste for internal electrodes comprising:a nickel (Ni) powder;a nickel oxide (NiO) powder having a content of 5.0 to 15.0 parts by weight based on 100 parts by weight of the nickel powder; andan organic vehicle.2. The conductive paste of claim 1 , wherein the nickel powder has an average particle size of 80 nm to 200 nm.3. The conductive paste of claim 1 , wherein the nickel oxide powder has an average particle size of 10 nm to 50 nm.4. The conductive paste of claim 1 , wherein the organic vehicle includes an ethyl cellulose-based binder and terpineol.5. A multilayer ceramic electronic component comprising:a ceramic body in which a plurality of dielectric layers are stacked; anda plurality of internal electrodes formed on at least one surfaces of the plurality of dielectric layers,wherein the plurality of internal electrodes are formed of a conductive paste including a nickel (Ni) powder, a nickel oxide (NiO) powder having a content of 5.0 to 15.0 parts by weight based on 100 parts by weight of the nickel powder, and an organic vehicle.6. The multilayer ceramic electronic component of claim 5 , wherein the nickel powder has an average particle size of 80 nm to 200 nm.7. The multilayer ceramic electronic component of claim 5 , wherein the nickel oxide powder has an average particle size of 10 nm to 50 nm.8. The multilayer ceramic electronic component of claim 5 , wherein the organic vehicle includes an ethyl cellulose-based binder and terpineol.9. The multilayer ceramic electronic component of claim 5 , wherein a shrinkage initiation temperature of the internal ...

LAMINATED INDUCTOR

A laminated inductor having an internal conductor forming region, as well as a top cover region and bottom cover region formed in a manner sandwiching the internal conductor forming region between top and bottom; wherein the internal conductor forming region has a magnetic part formed with soft magnetic alloy grains, as well as helical internal conductor embedded in the magnetic part; and at least one of the top cover region and bottom cover region (or preferably both) is/are formed with soft magnetic alloy grains whose average grain size is greater than that of grains in the internal conductor forming region including the soft magnetic alloy grains constituting the magnetic part. 1. A laminated inductor comprising:an internal conductor forming region comprising a magnetic part formed with soft magnetic alloy grains, as well as internal conductor embedded in layers in the magnetic part; anda top cover region and a bottom cover region formed on a top and bottom of and in contact with the internal conductor forming region, respectively, to cover the internal conductor forming region as top and bottom layers,wherein the top cover region and bottom cover region are constituted by a magnetic body without internal conductors,at least one of the top cover region and bottom cover region is formed with soft magnetic alloy grains whose average grain size is greater than that of grains in the internal conductor forming region comprising the soft magnetic alloy grains constituting the magnetic part, andat least some of the soft magnetic alloy grains of the at least one of the top cover region and bottom cover region are bonded together via an insulating material.2. A laminated inductor according to claim 1 , wherein the at least some of the soft magnetic alloy grains of the at least one of the top cover region and bottom cover region are bonded together via an oxide film claim 1 , and some of the soft magnetic alloy grains of the at least one of the top cover region and bottom ...

Plated lamination structures for integrated magnetic devices

Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by an insulating layer, and a local shorting structure to electrically connect each magnetic layer in the multilayer stack structure to an underlying magnetic layer in the multilayer stack structure to facilitate electroplating of the magnetic layers using an underlying conductive layer (magnetic or seed layer) in the stack as an electrical cathode/anode for each electroplated magnetic layer in the stack structure.

Multi-layered chip electronic component

There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40≦Ai:Ao≦1.03 is satisfied.

Thin film type common mode filter

Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.

Electronic component and method for producing same

An electronic component comprises: a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers. A plurality of first lead-out conductors are exposed between the insulator layers at the mounting surface. A first external electrode covers the first lead-out conductors at the mounting surface. The first external electrode is located at a first formation area at the mounting surface. The first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, is curved so as to bulge at a center of the formation area relative to opposite ends thereof.

ASSEMBLED CIRCUIT AND ELECTRONIC COMPONENT

An assembled circuit is disclosed, wherein the assembled circuit comprises an inductor having a top surface, a bottom surface and side surfaces, wherein each of a plurality of conductors extends from the top surface to the bottom surface via one of the side surfaces of the inductor, wherein a circuit board is disposed over the top surface of the first electronic component and electrically connected to the plurality of conductors and a plurality of pins disposed on the bottom surface of the inductor for connecting to another circuit board. 1. An assembled circuit , comprising:a first electronic component having a top surface, a bottom surface and side surfaces connecting the top surface and the bottom surface;at least one conductor, each of the at least one conductor extending from the top surface to the bottom surface via one of the side surfaces;a first carrier, disposed over the top surface of the first electronic component and electrically connected to the at least one conductor; anda plurality of pins disposed on the bottom surface of the electronic component, wherein at least one portion of the pins is electrically connected to the at least one conductor.2. The assembled circuit as claimed in claim 1 , wherein the first electronic component is an inductor.3. The assembled circuit as claimed in claim 1 , further comprising a second carrier claim 1 , wherein the first electronic component is disposed between the first carrier and the second carrier claim 1 , wherein the second carrier is electrically connected to the plurality of pins.4. The assembled circuit as claimed in claim 1 , further comprising a capacitor mounted on the first carrier.5. The assembled circuit as claimed in claim 4 , further comprising a semiconductor device mounted on the first carrier.6. The assembled circuit as claimed in claim 2 , wherein the inductor is a co-fired magnetic material inductor.7. The assembled circuit as claimed in claim 2 , wherein the inductor is a wire wound compressed ...

INDUCTION DEVICE

The induction device includes a magnetic core and a coil. The coil is formed around the magnetic core by laminating and electrically connecting together a plurality of multilayer wiring boards. Each multilayer wiring board has a hole through which the magnetic core is inserted. Each multilayer wiring board includes a first outer conductor, an inner conductor and a second outer conductor that are laminated together with an insulating layer disposed between the first outer conductor and the inner conductor and also the insulating layer disposed between the inner conductor and the second outer conductor. The first outer conductor, the inner conductor and the second outer conductor are formed around the hole of the multilayer wiring board. The first outer conductor and the second outer conductor are connected to the inner conductor. 1. An induction device comprising:a magnetic core; anda coil formed around the magnetic core by laminating and electrically connecting together a plurality of multilayer wiring boards, each multilayer wiring board having a hole through which the magnetic core is inserted, wherein each multilayer wiring board includes a first outer conductor, an inner conductor and a second outer conductor that are laminated together with an insulating layer disposed between the first outer conductor and the inner conductor and also the insulating layer disposed between the inner conductor and the second outer conductor, wherein the first outer conductor, the inner conductor and the second outer conductor are formed around the hole of the multilayer wiring board, wherein the first outer conductor and the second outer conductor are connected to the inner conductor.2. The induction device according to claim 1 , wherein at least two of the multilayer wiring boards are connected in series.3. The induction device according to claim 1 , wherein at least two of the multilayer wiring boards are connected in parallel.4. The induction device according to claim 1 , ...

MAGNETIC MATERIAL HAVING COATED FERROMAGNETIC FILLER PARTICLES

A magnetic material may be fabricated with a plurality of magnetic filler particles dispersed within a carrier material, wherein at last one of the magnetic filler particles may comprise a ferromagnetic core coated with an inert material to form a shell surrounding the ferromagnetic core. Such a coating may allow for the use of ferromagnetic materials for forming embedded inductors in package substrates without the risk of being incompatible with fabrication processes used to form these package substrates. 1. An inductor , comprising:an inductor metallization; anda magnetic material structure proximate the inductor metallization, wherein the magnetic material structure comprises a carrier material and a plurality of magnetic filler particles within the carrier material;wherein at least one magnetic filler particle comprises a magnetic core and a shell surrounding the magnetic core; andwherein the magnetic core comprises a ferromagnetic material.2. The inductor of claim 1 , wherein the ferromagnetic material comprises an iron.3. The inductor of claim 1 , wherein the at least one magnetic filler particle of the plurality of magnetic filler particles has an effective permeability of between about 4 and 2400.4. The inductor of claim 1 , wherein the magnetic core is substantially spherical.5. The inductor of claim 4 , wherein the magnetic core has a diameter of between about 1 and 10 microns.6. The inductor of claim 1 , wherein the shell comprises an electrically non-conductive material.7. The inductor of claim 1 , wherein the shell comprises an inert material.8. The inductor of claim 7 , wherein the inert material comprises silica.9. The inductor of claim 1 , wherein the shell has a thickness of between about 5 and 50 nm.10. The inductor of claim 1 , wherein the carrier material comprises a polymer resin.11. The inductor of claim 10 , wherein the polymer resin comprises epoxy.12. An electronic structure claim 10 , comprising;a substrate having at least one dielectric ...

A VERTICAL MAGNETIC STRUCTURE FOR INTEGRATED POWER CONVERSION

The present invention provides an inductor device comprising one or more interconnected columns of conductive material embedded in a supporting structure, wherein the one or more columns comprise an input terminal and an output terminal; and wherein each column is surrounded by a first magnetic layer. 1. A transformer or coupled inductor device comprising:two interconnected columns of conductive material embedded in a supporting structure, the two interconnected columns comprising a first column and a second column spaced apart from the first column, each column comprising an inner column portion and an outer column portion concentric with the inner column portion,the outer column portion and the inner column portion each having a first end and a second end, wherein the first end of the first inner column portion and the first outer column portion each comprise an input terminal or an output terminal and the first end of the second inner column portion and the second outer column portion each comprise an input terminal or an output terminal, and wherein the second end of the first inner column portion is conductively coupled to the second end of the second inner column portion by an inner interconnecting track of conductive material, and wherein the second end of the first outer column portion is conductively coupled to the second end of the second outer column portion by an outer interconnecting track of conductive material.2. A transformer or coupled inductor device comprising:three or more interconnected spaced apart columns of conductive material embedded in a supporting structure, the three of more columns comprising an input column, an output column, and at least one intermediate column, each column comprising an inner column portion and an outer column portion concentric with the inner column portion, the outer column portion and the inner column portion each having a first end and a second end, wherein the first end of each intermediate inner column portion ...

MAGNETIC DEVICE WITH MAGNETIC STRUCTURE AND MICRO-FLUIDIC STRUCTURE

A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device. 1. (canceled)2. A magnetic device comprising:a micro-fluidic channel embedded in a multi-layer structure, the micro-fluidic channel comprising an inlet arranged to receive a fluid that includes different types of particles; anda magnetic structure embedded in the multi-layer structure, the magnetic structure positioned about the micro-fluidic channel, and the magnetic structure arranged to produce a magnetic field to cause the different types of particles in the fluid to be separated in the micro-fluidic channel.3. The magnetic device of claim 2 , wherein the magnetic structure includes patterned layers on opposing sides of the micro-fluidic channel claim 2 , the patterned layers comprising material configured to produce the magnetic field.4. The magnetic device of claim 3 , further comprising conductive coils electrically connected to the patterned layers.5. The magnetic device of claim 2 , wherein the multi-layer structure comprises a plurality of layers on a substrate.6. The magnetic device of claim 2 , wherein the multi-layer structure comprises a plurality of substrates.7. The magnetic device of claim 2 , wherein the ...

Module and method for manufacturing the module

A module includes an insulating layer, a ring-shaped magnetic core built in the insulating layer, a coil electrode disposed in the insulating layer so as to spirally wind around the magnetic core, and heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer. Building the magnetic core into the insulating layer as described above eliminates the need to provide the principal face of the insulating layer with a large mounting area for mounting a coil formed by the magnetic core and the coil electrode. This allows the area of the principal face of the insulating layer to be reduced to achieve miniaturization of the module. The presence of the heat-dissipating metal bodies respectively disposed outside and inside the magnetic core within the insulating layer improves dissipation of the heat generated from the coil.

COIL COMPONENT

A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface, a winding coil disposed in the body and having a lead-out portion exposed to the one end surface of the body, a first insulating layer disposed on the one end surface of the body and having one region and the other region spaced apart from each other in the other direction, perpendicular to the one direction, an external electrode having a connection portion, disposed between the one region and the other region of the first insulating layer to be connected to the lead-out portion, and an extension portion extending from the connection portion to the one surface of the body, and a second insulating layer covering the first insulating layer and the connection portion on the one end surface of the body. 1. A coil component comprising:a body having a first surface and a second surface, opposing each other in a first direction, and a first end surface connecting the first surface and the second surface;a winding coil disposed in the body and having a lead-out portion exposed to the first end surface of the body;a first insulating layer disposed on the first end surface of the body and having a first region and a second region spaced apart from each other in a second direction, perpendicular to the first direction;an external electrode having a connection portion, disposed between the first region and the second region of the first insulating layer to be connected to the lead-out portion, and an extension portion extending from the connection portion to the first surface of the body; anda second insulating layer covering the first insulating layer and the connection portion on the first end surface of the body.2. The coil component of claim 1 , wherein a ratio of a length of the connection portion in the second direction to a sum of lengths of the first region and the second region of the ...

CHIP PARTS

A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode. 1. A chip transformer including:a substrate that has an element formation surface;a primary coil formation trench and a secondary coil formation trench that are formed in the substrate by digging down from the element formation surface and that are formed in the shape of a spiral in a plan view when seen in a normal direction perpendicular to the element formation surface;a primary coil that is formed with a first conductive member embedded within the primary coil formation trench; anda secondary coil that is formed with a second conductive member embedded within the secondary coil formation trench.2. The chip transformer described in further including:a first electrode and a second electrode which are disposed on the element formation surface, one end portion of the primary coil connected to the first electrode and an opposite end portion of the primary coil connected to the second electrode; anda third electrode and a fourth electrode which are disposed on the element formation surface, one end portion of the secondary coil connected to the third electrode and an opposite end portion of the secondary coil connected to the fourth electrode.3. A chip transformer described in further including:an insulating film ...

COIL COMPONENT AND METHOD FOR FABRICATING THE SAME

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove. 1. A coil component , comprising:a body comprising:a support member including a through hole;a coil disposed on at least one of an upper surface and a lower surface of the support member, the coil including a coil pattern; anda magnetic material encapsulating the coil and the support member, and filling the through hole; andan external electrode connected to the coil,wherein at least one of the upper surface and the lower surface of the support member includes a groove defined therein, anda depth of the groove formed on the upper surface of the support member is different from the depth of the groove formed on the lower surface of the support member,the groove has a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.2. The coil component of claim 1 , wherein the groove is formed to have a spiral shape.3. The coil component of claim 1 , wherein the groove is formed in the upper surface and the lower surface claim 1 , and a depth of the groove formed in the upper surface is greater than a depth of the groove formed in the lower surface.4. The coil component of claim 1 , wherein the coil pattern includes a first coil pattern and a second coil pattern directly adjacent to the first coil pattern claim 1 , each disposed on the upper surface claim 1 , the second coil pattern being connected ...

STACKED SPIRAL INDUCTOR

A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer. 1. A stacked spiral inductor , comprising: a substrate , and multiple stacked insulating layers and inductive metal layers formed on the substrate via a semiconductor process;wherein an inductive metal layer comprises a conductive coil in a shape of a spiral, and a through hole area configured to connect two adjacent inductive metal layers, and the conductive coils of the inductive metal layers have a common coil center; andwherein in two adjacent inductive metal layers, a conductive coil of a lower inductive metal layer is retracted towards the coil center with respect to a conductive coil of an upper inductive metal layer.2. The stacked spiral inductor of claim 1 , wherein retracted distances of the conductive coils of the inductive metal layers are equal to each other claim 1 , or the retracted distances of the conductive coils of the inductive metal layers form an arithmetic progression.3. The stacked spiral inductor of claim 1 , wherein a retracted distance of each conductive coil of the inductive metal layers ranges from 2 μm to 3 μm.4. The stacked spiral inductor of claim 1 , wherein the conductive coil of each inductive metal layer comprises a lead end and an opening end opposite to the lead end;an inductive metal layer located on a top is a first inductive metal layer, an inductive metal layer arranged adjacent to the first inductive metal layer is a ...

Thin Film Inductor, Power Conversion Circuit, and Chip

A thin film inductor includes a first magnetic thin film and a second magnetic thin film that are adjacent, the first magnetic thin film is nested in the second magnetic thin film, and a relative magnetic permeability of the first magnetic thin film is less than a relative magnetic permeability of the second magnetic thin film, and a difference between the relative magnetic permeability of the first magnetic thin film and the relative magnetic permeability of the second magnetic thin film is greater than or equal to a first threshold, where when a magnetic induction intensity of the second magnetic thin film reaches a saturated magnetic induction intensity of the second magnetic thin film, a magnetic induction intensity of the first magnetic thin film is less than or equal to a saturated magnetic induction intensity of the first magnetic thin film.

Integrated magnetic core inductors on glass core substrates

A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

Substrate assembly with encapsulated magnetic feature

Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

INDUCTOR AND POWER AMPLIFIER MODULE

An inductor includes first and second wirings respectively formed in a substantially spiral shape on first and second surfaces of a multilayer substrate. The multilayer substrate includes plural dielectric layers stacked on each other in a predetermined direction. The multilayer substrate includes a first layer having the first surface, which is an end surface in the predetermined direction, and a second layer having the second surface within the multilayer substrate. The width of the second wiring is smaller than that of the first wiring. The first and second wirings are electrically connected in parallel with each other. The inductance of the first wiring and that of the second wiring are substantially equal to each other. When the first and second wirings are projected on the first surface in the predetermined direction, entirety of a projected image of the second wiring is contained within that of the first wiring. 1. An inductor comprising:a first wiring that is formed in a substantially spiral shape on a surface of a first dielectric layer of a multilayer substrate; anda second wiring that is formed in a substantially spiral shape on a surface of a second dielectric layer of the multilayer substrate, wherein:the multilayer substrate comprises the first dielectric and the second dielectric layer, the first dielectric layer and the second dielectric layer being stacked on each other in a predetermined direction, the surface of the first dielectric layer being an end surface in the predetermined direction, and the surface of the second dielectric layer being within the multilayer substrate,a width of the second wiring is less than a width of the first wiring,the first wiring and the second wiring are electrically connected in parallel with each other, andwhen the first wiring and the second wiring are projected in the predetermined direction, a projected image of the first wiring completely overlaps a projected image of the second wiring.2. The inductor according ...

Inductor module

An inductor module includes an insulating flexible substrate including a thermoplastic resin, an IC element included in the flexible substrate, chip capacitors included in the flexible substrate, a chip inductor that includes a magnetic-material body and is located on a first main surface of the flexible substrate, and input and output terminals on a second main surface of the flexible substrate. The IC element may be a switching IC element, the chip inductor may be a choke coil, and the inductor module may be a DC/DC converter module.

ARRAYED EMBEDDED MAGNETIC COMPONENTS AND METHODS

Disclosed are apparatus and methods for arrayed embedded magnetic components that include magnetic devices that have a core that is embedded between two or more substrates and a winding pattern surrounding the core that is implemented on and through the two or more substrates. The winding pattern is operable to induce a magnetic flux within the core when energized by a time varying voltage potential. The winding pattern may be implemented by printed circuit layers, plated vias, other electrically conductive elements, and combinations thereof. Arrayed embedded magnetic components include two or more electrically interconnected magnetic devices positioned side-by-side in a horizontal integration, positioned top-to-bottom in a vertical integration, or combinations thereof. The magnetic devices may have a magnetic functionality such as, but not limited to, a transformer, inductor, and filter. Disclosed magnetic components and methods provide for low cost construction, consistent performance, and a low profile form, among other benefits. 1. A magnetic component comprising:a first magnetic device including a first winding pattern implemented as a first second substrate conductive pattern, a first third substrate conductive pattern and first plated through holes that are electrically interconnected with the first second substrate conductive pattern and the first third substrate conductive pattern, the first winding pattern surrounding a first core, the first core defining a toroidal shape and the first winding pattern defining a complementary toroidal shape, wherein the first winding pattern defines one or more electric circuits that surround the first core thereby forming a winding-type relationship so as to induce a magnetic flux within the first core when the one or more electric circuits are energized by a time varying voltage potential, wherein the first magnetic device further comprises:a first base substrate defining a first base substrate first surface and a first ...

ELECTRONIC DEVICE

An electronic device includes a component body and a terminal electrode formed on a mounting surface of the component body. The chamfered part is formed at an intersection between the mounting surface and a side surface of the component body. An edge of the terminal electrode becomes thinner toward the chamfered part. 1. An electronic device , comprising:a component body; anda terminal electrode formed on a mounting surface of the component body,wherein a chamfered part is formed at an intersection between the mounting surface and a side surface of the component body, andwherein an edge of the terminal electrode becomes thinner toward the chamfered part.2. The electronic device according to claim 1 , wherein the chamfered part is formed by an R-plane or a C-plane.3. An electronic device claim 1 , comprising:a component body containing an element; anda terminal electrode formed on a mounting surface of the component body,wherein a chamfered part is formed at an intersection between the mounting surface and a side surface of the component body,wherein the element is connected with the terminal electrode, andwherein an edge of the terminal electrode becomes thinner toward the chamfered part.4. The electronic device according to claim 3 , wherein the chamfered part is formed by an R-plane or a C-plane.5. The electronic device according to claim 3 , wherein the edge of the terminal electrode is continuously connected with a chamfered surface of the chamfered part.6. The electronic device according to claim 4 , wherein the edge of the terminal electrode is continuously connected with a chamfered surface of the chamfered part. The present invention relates to an electronic device used as a chip component.In an electronic device such as a chip component, a terminal electrode is formed continuously even on a side surface together with a mounting surface, in order to form a solder filet on the side surface of the terminal electrode.In this type of electronic devices, however, ...

Coil component and lc composite component

A coil component includes a coil and a composite magnetic material containing magnetic particles. The magnetic particles have an average minor-axis length of more than 5.0 nm and 50 nm or less and an average aspect ratio of 2.0 or more and 10.0 or less. The magnetic particles are orientated substantially perpendicularly to a central axis of the coil and are orientated randomly within a perpendicular plane to the central axis of the coil. The composite magnetic material has a saturation magnetization σs of 80.0 emu/g or more.

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer. 1. A coil component , comprising: a support member including a through hole, filled with a magnetic material, and a via hole;', 'a coil disposed on at least one surface of the support member, the coil including a first conductive layer and a second conductive layer disposed on the first conductive layer; and', 'the magnetic material encapsulating the support member, the first conductive layer and the second conductive layer; and', 'an external electrode disposed on an external surface of the magnetic body, the external electrode being connected to the coil,', 'wherein the first conductive layer is continuously disposed on a side surface of the via hole and the at least one surface of the support member,', 'the second conductive layer includes a central plating layer disposed inside the via hole and a coil layer disposed above or below the central plating layer, and', 'the central plating layer is integrally formed with the coil layer to be a single structure., 'a magnetic body, the magnetic body including2. The coil component of claim 1 , wherein the central plating layer and the coil layer have no interface therebetween.3. The coil component of claim 1 , wherein a difference between an average thickness of a portion of the first conductive layer disposed on the at least one surface of the support member and an average thickness of another ...

AUTO-BALANCING TRANSFORMERS

Auto balancing transformers are disclosed for balancing a multi-phase electrical system by varying the degree of electromagnetic coupling between primary and secondary winding. The auto-balancing transformer includes a movable to selectively couple primary phases with two or fewer phases of the secondary system. 1. A transformer , comprising:a first number of primary windings connectable to at least two phases of an electrical system;a second number of secondary windings correctable to an electrical load, wherein the second number is less than or equal to the first number;a yoke supporting the first number of primary windings and the second number of secondary windings; anda movable armature to selectively electromagnetically couple the second number of secondary windings to one or more of the first number of primary windings in response to at least one of an imbalance condition between the phases and a loss of at least one phase of the electrical system.2. The transformer of claim 1 , further comprising a controller configured to receive one or more inputs regarding the imbalance condition and provide an output that positons the armature to vary the electromagnetic coupling between the second number of secondary windings and the first number of primary windings.3. The transformer of claim 1 , wherein the first number is at least two and the second number is one.4. The transformer of claim 3 , wherein the first number is three.5. A transformer claim 3 , comprising;a yoke;a secondary limb and at least two primary limbs peripherally spaced from the secondary limb, the secondary limb and the at least two primary limbs extending from the yoke;at least two primary windings extending about respective ones of the at least two primary limbs;a secondary winding extending about the secondary limb; andan armature opposite the yoke and extending outwardly from the secondary limb, the armature being movable to selectively couple the secondary winding with one or more of the at ...

EMBEDDED MAGNETIC INDUCTOR

An apparatus and method of forming a magnetic inductor circuit. A substrate is provided and a first magnetic layer is formed in contact with one layer of the substrate. A conductive trace is formed in contact with the first magnetic layer. A sacrificial cooper layer protects the magnetic material from wet chemistry process steps. A conductive connection is formed from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection formed by in-layer plating A second magnetic layer is formed in contact with the conductive trace. Instead of a horizontal connection, a vertical conductive connection can be formed that is perpendicular to the magnetic layers, by drilling a first via in a second of the magnetic layers, forming a buildup layer, and drilling a second via through the buildup layer, where the buildup layer protects the magnetic layers from wet chemistry processes. 1. A semiconductor circuit comprising:a substrate that includes a plurality of parallel layers;a first magnetic material in contact with one layer a first layer of the plurality of parallel layers;a second magnetic material in contact with a second layer of the plurality of parallel layer;a conductive trace embedded within one of more of the first magnetic material or the second magnetic material;a conductive connection from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection.2. The semiconductor circuit of further comprising a conductive pad spaced horizontally from the conductive trace and in contact with the conductive connection.3. The semiconductor circuit of claim 1 , wherein conductive trace is contained within the first layer and extends vertically into the first magnetic material from an interface between the first layer and the second layer.4. The semiconductor circuit of further comprising a conductive connection between the conductive pad and the outside substrate.5. The semiconductor ...

Stacked coil structure and electronic device including the same

An electronic device is provided. The electronic device includes a coil unit, a power transmission circuit electrically connected to the coil unit, and a control circuit configured to wirelessly transmit power using the coil unit, and the coil unit may include a first coil. The first coil may include a first layer wound in a first shape by a first number of turns, and a second layer extending from the first layer and wound in a second shape by a second number of turns, and the second layer may be disposed above the first layer to overlap the first layer.

INTEGRATED MAGNETIC ASSEMBLY

An electronic device includes a multilevel package substrate, conductive leads, a die, and a package structure. The multilevel package substrate has a first level, a second level, and a third level, each having patterned conductive features and molded dielectric features. The first level includes a first patterned conductive feature with multiple turns that form a first winding. The second level includes a second patterned conductive feature, and the third level includes a third patterned conductive feature with multiple turns that form a second winding. A first terminal of the die is coupled to the first end of the first winding, a second terminal of the die is coupled to the second end of the first winding, and a third terminal of the die is coupled to a first conductive lead. The package structure encloses the first die, the second die, and a portion of the multilevel package substrate. 1. An electronic device , comprising:a multilevel package substrate having a first level, a second level, and a third level; the first, second, and third levels each having patterned conductive features and molded dielectric features; the first level including a first patterned conductive feature with multiple turns that form a first winding having a first end and a second end; the second level including a second patterned conductive feature; and the third level including a third patterned conductive feature with multiple turns that form a second winding having a first end and a second end;conductive leads;a die having first, second, and third terminals, the first terminal of the die coupled to the first end of the first winding, the second terminal of the die coupled to the second end of the first winding, and the third terminal of the die coupled to a first conductive lead; anda package structure that encloses the die and a portion of the multilevel package substrate.2. The electronic device of claim 1 , comprising a second die having first claim 1 , second claim 1 , and third ...

Coil component and method for manufacturing the same

A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at least one each of the first and second coil patterns may be formed, and the plurality of coils may be connected in parallel to each other.

COIL COMPONENT

A coil component includes a first magnetic body, an insulator stacked on the first magnetic body, a second magnetic body stacked on the insulator, and a coil which is disposed in the insulator and which includes a first coil conductor layer and a second coil conductor layer that are arranged in the stacking direction of the first magnetic body, the insulator, and the second magnetic body. In a cross section in the stacking direction, the shapes of the first coil conductor layer and the second coil conductor layer are polygonal, and regarding opposing portions of the first coil conductor layer and the second coil conductor layer that face each other, one opposing portion is a side and the other opposing portion is a vertex. 1. A coil component comprising:a first magnetic body;an insulator stacked on the first magnetic body;a second magnetic body stacked on the insulator; anda coil which is disposed in the insulator and includes a first coil conductor layer and a second coil conductor layer that are arranged in a stacking direction of the first magnetic body, the insulator, and the second magnetic body,wherein,in a cross section in the stacking direction, shapes of the first coil conductor layer and the second coil conductor layer are polygonal, andregarding opposing portions of the first coil conductor layer and the second coil conductor layer that face each other, one opposing portion is a side and an other opposing portion is a vertex.2. The coil component according to claim 1 , wherein a number of vertices of a polygon with respect to each of the first coil conductor layer and the second coil conductor layer is an odd number.3. The coil component according to claim 1 , wherein the vertices of a polygon with respect to each of the first coil conductor layer and the second coil conductor layer are curved.4. The coil component according to claim 1 , wherein claim 1 , in a cross section in the stacking direction claim 1 , at least part of the second coil conductor ...

COIL COMPONENT

In a planar coil element, since an overlapping portion of a fourth resin wall of a first conductor pattern protrudes from an end surface of a main body portion, restriction on a width of the overlapping portion is relaxed, and the wide overlapping portion is realized. Therefore, an improvement in a withstand voltage between the second external terminal electrode formed on the end surface and an outermost turn of the first conductor pattern is realized. Similarly, regarding the second conductor pattern, the improvement in the withstand voltage between the first external terminal electrode formed on the end surface and an outermost turn of the second conductor pattern is realized. 1. A coil component comprising a main body portion having a first end surface and a second end surface facing each other , and a first external terminal electrode and a second external terminal electrode respectively formed on the first end surface and the second end surface of the main body portion ,wherein the main body portion comprisesan insulating substrate configured to extend in a direction in which the first end surface and the second end surface face each other;a coil having a first coil conductor pattern formed on one surface of the insulating substrate and having an outer end portion extending to the first end surface and connected to the first external terminal electrode, a second coil conductor pattern formed on the other surface of the insulating substrate, extending to the second end surface to be connected to the second external terminal electrode and wound in a winding direction opposite to that of the first coil conductor pattern when seen in a thickness direction of the insulating substrate, and a through-hole conductor provided to pass through the insulating substrate and configured to connect inner ends of the first coil conductor pattern and the second coil conductor pattern;resin walls between turns of each of the first coil conductor pattern and the second coil ...

INDUCTOR DEVICE

An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner. 1. An inductor device , comprising:a first trace disposed in a first area;a second trace disposed in a second area; anda double ring inductor disposed at an outside of the first trace and the second trace, wherein the double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.2. The inductor device of claim 1 , wherein the double ring inductor comprises:a third trace disposed in the first area, and coupled to the first trace in an interlaced manner; anda fourth trace disposed in the second area, and coupled to the second trace in an interlaced manner.3. The inductor device of claim 2 , wherein the third trace and the fourth trace are coupled to each other at a junction of the first area and the second area.4. The inductor device of claim 3 , wherein the first trace and the third trace are coupled to each other in an interlaced manner at a side which is opposite to the junction.5. The inductor device of claim 4 , wherein the second trace and the fourth trace are coupled to each other in an interlaced manner at the junction.6. The inductor device of claim 5 , wherein the double ring inductor further comprises:a first connector coupled to the third trace and the fourth trace at a first side of the inductor device.7. The inductor device of claim 6 , wherein the double ring inductor further comprises:a first input/output terminal disposed in the third trace.8. The inductor device of claim 7 , wherein the first trace claim 7 , the second trace claim 7 , the third trace claim 7 , and the fourth trace are disposed on a first layer.9. The inductor ...

INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATION MATERIAL (EEM)

A first layer on a substrate includes an insulator material portion adjacent an energy-reactive material portion. The energy-reactive material portion evaporates upon application of energy during manufacturing. Processing patterns the first layer to include recesses extending to the substrate in at least the energy-reactive material portion. The recesses are filled with a conductor material, and a porous material layer is formed on the first layer and on the conductor material. Energy is applied to the porous material layer to: cause the energy to pass through the porous material layer and reach the energy-reactive material portion; cause the energy-reactive material portion to evaporate; and fully remove the energy-reactive material portion from an area between the substrate and the porous material layer, and this leaves a void between the substrate and the porous material layer and adjacent to the conductor material. 1. An integrated circuit structure comprising:a substrate;a first layer on the substrate; anda porous material layer on the first layer, first electrical conductors comprising an inductor structure;', 'a void adjacent to the first electrical conductors of the inductor structure; and', 'an insulator material portion bordering the inductor structure,, 'wherein the first layer includeswherein the insulator material portion includes second electrical conductors comprising electrical connectors separate from the inductor structure, andwherein the void extends between the substrate and the porous material layer.2. The integrated circuit structure according to claim 1 , wherein the porous material layer has pores capable of allowing ultraviolet light to pass through.3. The integrated circuit structure according to claim 1 , wherein the porous material layer has pores capable of allowing an evaporated energy-reactive material portion to pass through.4. The integrated circuit structure according to claim 1 , further comprising an insulator layer on the porous ...

RESONANT CIRCUIT ELEMENT AND CIRCUIT MODULE

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern. 1. A resonant circuit element comprising:a flexible film made from a dielectric material;a first conductive pattern made from a conductive material and formed on a first surface that is one surface of the flexible film;an adhesive layer disposed on a second surface opposite to the first surface of the flexible film; anda pair of first outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and to cause an electric current to flow through the first conductive pattern.2. The resonant circuit element according to claim 1 , wherein each of the first outer electrodes of the pair includes a portion formed on a corresponding end face of the composite member.3. The resonant circuit element according to claim 1 , further comprising:a second conductive pattern made from a conductive material and formed on the first surface; anda pair of second outer electrodes configured to cause an electric current to flow through the second conductive pattern and to generate an electric field in an in-plane direction of the composite member, wherein the first conductive pattern and the second conductive pattern constitute a choke coil.4. The resonant circuit element according to claim 1 , wherein the adhesive layer is formed from a thermosetting or photo-curable adhesive.5. The resonant circuit element according to claim 2 , further comprising:a second conductive pattern made from a conductive ...

Composite component-embedded circuit board and composite component

A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.

Package substrate inductor having thermal interconnect structures

Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

Wiring on Curved Surfaces

A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

Laminated coil component and method for manufacturing it

A laminated coil component has a laminated body which is formed by laminating a plurality of ferrite layers, a helical coil which is provided in the laminated body, and a plurality of external electrodes which are provided on the surface of the laminated body and are electrically connected to the helical coil and are mainly composed of Cu. The ferrite layers have an exposed region exposed from the surface of the laminated body without being covered with the external electrodes. A surface resistivity of the exposed region of the ferrite layers is more than 10 4 Ω and less than 10 7 Ω.