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Небесная энциклопедия

Космические корабли и станции, автоматические КА и методы их проектирования, бортовые комплексы управления, системы и средства жизнеобеспечения, особенности технологии производства ракетно-космических систем

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Мониторинг СМИ

Мониторинг СМИ и социальных сетей. Сканирование интернета, новостных сайтов, специализированных контентных площадок на базе мессенджеров. Гибкие настройки фильтров и первоначальных источников.

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Поддерживает ввод нескольких поисковых фраз (по одной на строку). При поиске обеспечивает поддержку морфологии русского и английского языка
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Применить Всего найдено 11115. Отображено 100.
23-02-2012 дата публикации

Reactor

Номер: US20120044033A1
Автор: Hajime Kawaguchi
Принадлежит: Sumitomo Electric Industries Ltd

A reactor that is fabricated with high productivity is provided. The reactor 1 includes an annular magnetic core 11 , a coil molded product 12 A, and an external resin portion 13 . The coil molded product 12 A is disposed around an outer periphery of the magnetic core 11 , the external resin portion 13 covers an outer periphery of an assembly 10 of the magnetic core 11 and the coil molded product 12 A. The magnetic core 2 includes a plurality of core pieces that are combined so as to form an annular shape. The magnetic core 2 is fixed in the annular shape using the external resin portion 13 that covers the magnetic core without use of adhesive. The coil molded product 12 A includes a coil 12 formed of a helically wound wire 12 w and an internal resin portion 12 c that maintains the coil 12 in a compressed state. Since the magnetic core 11 is formed without adhesive, a bonding step is not required. Due to use of the coil molded product 12 A, the coil 12 needs not be compressed while forming the reactor 1 . Thus, the reactor 1 is fabricated with high productivity.

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Номер записи: 1
22-03-2012 дата публикации

Gradient Coil Sub-Assemblies

Номер: US20120068708A1
Автор: Allen Raymond Camp
Принадлежит: Tesla Engineering Ltd

An MRIS gradient coil sub-assembly comprising a first coil layer comprising a first conducting coil portion, a second coil layer comprising a second conductive coil portion electrically connected with the first conductive coil portion so that the first and second conductive coil portions act together as one winding, and a B-stage material consolidation layer sandwiched between the first and second coil layers.

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Номер записи: 2
12-04-2012 дата публикации

Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof

Номер: US20120086102A1
Автор: Alexander Glas, Carsten Ahrens, Renate Hofmann, Wolfgang Klein
Принадлежит: INFINEON TECHNOLOGIES AG

In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.

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Номер записи: 3
14-06-2012 дата публикации

Transformer with bypass capacitor

Номер: US20120146741A1
Автор: Chin-Wei Kuo, HO-HSIANG Chen, Hsiao-Tsung Yen, Ying-Ta Lu, Yu-Ling Lin
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

An electronic device comprises first, second and third inductors connected in series and formed in a metal layer over a semiconductor substrate. The first and second inductors have a mutual inductance with each other. The second and third inductors having a mutual inductance with each other. A first capacitor has a first electrode connected to a first node. The first node is conductively coupled between the first and second inductors. A second capacitor has a second electrode connected to a second node. The second node is conductively coupled between the second and third inductors.

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Номер записи: 4
26-07-2012 дата публикации

Multilayer electronic component and mounted structure of electronic component

Номер: US20120188028A1
Автор: Masaaki Togashi
Принадлежит: TDK Corp

A ferrite bead inductor comprises a ferrite bead element body having magnetic layers and inner electrodes stacked therein, and first and second outer electrodes arranged on first and second side faces of the ferrite bead element body. The inner electrode extends in the direction of shorter sides which are shorter than longer sides, so as to connect with the first and second outer electrodes. The ferrite bead element body has an interstice for allowing the magnetic layers adjacent to each other in the stacking direction to join together within an inner electrode region adapted to form the inner electrode on the magnetic layer.

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Номер записи: 5
26-07-2012 дата публикации

Inductor structure having increased inductance density and quality factor

Номер: US20120188047A1
Автор: Arvind Narayanan, Robert A. Groves, Venkata N.R. Vanukuru
Принадлежит: International Business Machines Corp

Disclosed is an inductor structure. The inductor structure includes a base material, at least one bottom spiral conductor disposed on the base material, a middle spiral conductor disposed on the bottom spiral conductor, a top spiral conductor disposed on the middle spiral conductor, and dielectric material separating the bottom, middle and top spiral conductors. The at least one bottom spiral conductor is connected electrically in parallel to the middle spiral conductor and the middle spiral conductor is connected electrically in series to the top spiral conductor. The top spiral conductor is thicker, narrower and less tightly wound than the middle spiral conductor and the bottom spiral conductor.

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Номер записи: 6
02-08-2012 дата публикации

Power module and the method of packaging the same

Номер: US20120194148A1
Автор: Bai-Yao Lou, Chien-Hung Liu, Ho-Yin Yiu, Wei-Chung Yang
Принадлежит: XinTec Inc

A power module includes a substrate; a conductive path layer formed on the substrate with a specific pattern as an inductor; a connection layer being formed on the substrate and electrically connected to a first terminal of the inductor; and a first transistor, electrically mounted on the substrate through the connection layer.

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Номер записи: 7
13-09-2012 дата публикации

Method of manufacturing inductor

Номер: US20120227250A1
Автор: Kazuhiko Yamano
Принадлежит: Murata Manufacturing Co Ltd

A method of manufacturing an inductor includes a lamination step, a division step, a firing step, and a plating step. In the lamination step, a laminate including an insulator, a coil body, and external electrodes is formed. That is, in the lamination step, insulating layers having wide filling conductors, insulating layers having narrow filling conductors, and conductor patterns having external electrode patterns are laminated. As a result, the conductor patterns form the coil body, and the wide filling conductors, the narrow filling conductors, and the external electrode patterns form the external electrodes. The narrow filling conductors have a width that is less than the widths of the wide filling conductors and the external electrode patterns, and recesses and projections are provided in the external electrodes.

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Номер записи: 8
13-09-2012 дата публикации

Design support apparatus for semiconductor device, design support program, and layout information generating method

Номер: US20120233581A1
Автор: Kyou Suzuki
Принадлежит: Renesas Electronics Corp

A design support apparatus according to an aspect of the present invention includes: a terminal position setting unit that obtains, from a floor plan result generated from circuit design information, positional information on first and second connection terminals of a connection target circuit area to be connected to an inductor to be generated, and sets third and fourth connection terminals at respective positions where the first and third connection terminals and the second and fourth connection terminals can be respectively connected by a shortest wiring, the third and fourth connection terminals connecting the inductor to another circuit; and a pattern generation unit that generates a wiring pattern of the inductor based on the positions of the third and fourth connection terminals, and generates layout information on the inductor based on the wiring pattern.

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Номер записи: 9
20-09-2012 дата публикации

Composite electronic component

Номер: US20120236459A1
Автор: Hirofumi Yamaguchi, Naoto Ohira, Natsumi Shimogawa, Tsutomu Nanataki
Принадлежит: NGK Insulators Ltd

The present invention relates to a composite electronic component having a dielectric body portion inside of which a conductive body is provided, and a magnetic body portion inside of which a conductive body is provided. In the present invention, a layer made of a metal material is arranged between the dielectric body portion and the magnetic body portion as an intermediate layer.

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Номер записи: 10
29-11-2012 дата публикации

Multilayer substrate

Номер: US20120300416A1
Автор: Gohki NISHIMURA, Naoyuki Tasaka, Tetsuo Saji
Принадлежит: TAIYO YUDEN CO LTD

A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

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Номер записи: 11
13-12-2012 дата публикации

Laminated electronic component equipped with inductor

Номер: US20120313743A1
Автор: Isao Abe, Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki
Принадлежит: TDK Corp

A laminated electronic part comprises a first laminate, and a second laminate including a front wiring layer and bonded to the first laminate. Wiring layers of the first laminate and second laminate are orthogonal to each other. The first laminate has a first inductor conductor disposed on a first wiring layer, and a second inductor conductor disposed on a second wiring layer. The second laminate has a connection conductor for electrically connecting an end of the first inductor conductor with an end of the second inductor conductor on a surface thereof to which the first laminate is bonded, such that the first inductor conductor and the second inductor conductor form a coil-shaped inductor.

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Номер записи: 12
20-12-2012 дата публикации

Flexible circuit assembly and method thereof

Номер: US20120320532A1
Автор: James Jen-Ho Wang
Принадлежит: Power Gold LLC

An embedded device 105 is assembled within a flexible circuit assembly 30 with the embedded device mid-plane intentionally located in proximity to the flexible circuit assembly central plane 115 to minimize stress effects on the embedded device. The opening 18 , for the embedded device, is enlarged in an intermediate layer 10 to enhance flexibility of the flexible circuit assembly.

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Номер записи: 13
27-12-2012 дата публикации

Inductor Structure

Номер: US20120326826A1
Автор: Anthony Lawrence Mcfarthing, Johan Lucas Gertenbach
Принадлежит: Cambridge Silicon Radio Ltd

An inductor structure includes a first inductor and a second inductor. The second inductor includes a loop that surrounds the first inductor. The first inductor includes a first loop and a second loop, and a crossover section coupling the first loop to the second loop so as to cause current flowing through the first inductor to circulate around the first loop in a first rotational direction and around the second loop in a second rotational direction opposite to the first rotational direction; wherein the first and second inductors are arranged in an equilibrated configuration about a first axis that bisects the inductor structure such that the first loop is on one side of the first axis and the second loop is on a second side of the first axis, such that the magnetic interaction between the inductors due to current flow in the inductors is cancelled out.

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Номер записи: 14
21-02-2013 дата публикации

Inductive Battery Charger System with Primary Transformer Windings Formed in a Multi-Layer Structure

Номер: US20130043836A1
Автор: Shu-Yuen Ron Hui
Принадлежит: City University of Hong Kong CityU

There is provided a power system designed to enable electronic devices to be powered. The system includes a planar surface on which a device to be powered is placed. Within the power system and substantially parallel to the planar surface are multiple primary transformer windings formed in a multi-layer structure that couple energy inductively to a secondary winding formed in the device to be powered. A winding of a second layer is offset relative to a winding of a first layer.

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Номер записи: 15
28-03-2013 дата публикации

Modularized signal filter

Номер: US20130076455A1
Автор: Shao Pai Chen
Принадлежит: Individual

A signal filter includes a main ferrite core module and a sub ferrite core module. The main ferrite core module having a first base, a first cover, a plurality of first ferrite cores, a plurality of first terminals and a recess disposed inside. The sub ferrite core module having a second base, a second cover, a plurality of second ferrite cores, and a plurality of second terminals, capable of being assembled with the main ferrite core module. The signal filter is assembled with the main and sub ferrite core module, and first and second terminals are parallel disposed on two sides.

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Номер записи: 16
28-03-2013 дата публикации

Common mode filter with multi spiral layer structure and method of manufacturing the same

Номер: US20130076456A1
Автор: Cheng Yi Wang, Chi Long Lin, Shin Min Tai, Yu Chia Chang
Принадлежит: Inpaq Technology Co Ltd

A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

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Номер записи: 17
28-03-2013 дата публикации

Common mode filter with multi-spiral layer structure and method of manufacturing the same

Номер: US20130076474A1
Автор: Cheng Yi Wang, Shin Min Tai, Yu Chia Chang
Принадлежит: Inpaq Technology Co Ltd

A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

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Номер записи: 18
02-05-2013 дата публикации

Method for making inductor coil structure

Номер: US20130106562A1
Автор: Brett Jelkin, Timothy M. Shafer
Принадлежит: Vishay Dale Electronics LLC

An electrical component is disclosed. The electrical component includes a current conducting coil having inside and outside surface and terminal ends that are configured for connection to an electrical circuit and compressed iron particles that form a body which completely contacts the inside and outside surfaces of the coil for magnetically shielding the coil and leaving the terminal ends exposed for connection to the electrical circuit.

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Номер записи: 19
11-07-2013 дата публикации

Inductor with laminated yoke

Номер: US20130176095A1
Автор: Bucknell C. Webb, Eugene J. O'Sullivan, Lubomyr T. Romankiw, Naigang Wang, Philipp Herget, Robert E. Fontana, Jr., William J. Gallagher
Принадлежит: International Business Machines Corp

A thin film inductor having yokes, one or more of which is laminated, and one or more conductors passing between the yokes. The laminated yoke or yokes help reduce eddy currents and/or hysteresis losses.

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Номер записи: 20
18-07-2013 дата публикации

Magnetite-containing resin and electronic component

Номер: US20130182460A1
Автор: Akio Hagiya, Hiroshi Marusawa
Принадлежит: Murata Manufacturing Co Ltd

This disclosure provides a magnetic material-containing resin to be used for coating and forming cores. A magnetite-containing resin of the present invention includes a magnetite having a residual magnetic flux density of less than 15 Am 2 /kg and a coercive force of less than 12 kA/m. A coil is provided that has a structure in which by coating a winding with the magnetite-containing resin, a magnetite-containing resin layer is formed.

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Номер записи: 21
29-08-2013 дата публикации

Method For Making Magnetic Components With M-Phase Coupling, And Related Inductor Structures

Номер: US20130222099A1
Автор: Angel Gentchev, Charles R. Sullivan, Jieli Li
Принадлежит: Volterra Semiconductor LLC

An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg.

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Номер записи: 22
29-08-2013 дата публикации

Ferrite clamp

Номер: US20130222103A1
Автор: Hideharu Kawai
Принадлежит: Kitagawa Industries Co Ltd

A ferrite clamp includes a pair of divided cores, each being formed in an open circular shape; and a pair of case parts, each being adapted to hold each of the divided cores. When the case parts are assembled with each other, the pair of divided cores held by the case parts constitute a circular magnetic core having an insertion hole to insert an electric cable therethrough. The case part includes, in a portion thereof to hold an outer peripheral surface of the divided core, a protruding portion which is outwardly convex.

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Номер записи: 23
05-09-2013 дата публикации

Network transformer module and magnetic element thereof

Номер: US20130229255A1
Автор: Hua-Sheng Shih, Tong-Liang NI, Yi-Sheng Chen, Ying-Chian Kang, Yu-sen Lin
Принадлежит: Delta Electronics Inc

A network transformer module includes a first magnetic element, a second magnetic element, and a connection board. The first magnetic element includes a first winding set and a first core, and the first winding set is wound around the first core. The second magnetic element includes a second winding set and a second core, and the second winding set is wound around the second core. The first winding set of the first magnetic element is independent from the second winding set of the second magnetic element, and the first winding set is not wound around the second core. The connection board electrically couples the first winding set with the second winding set. A magnetic element is also disclosed herein.

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Номер записи: 24
19-09-2013 дата публикации

System and Method for Integrated Inductor

Номер: US20130239404A1
Автор: Carsten Ahrens, Gunther Mackh, Klemens Pruegl
Принадлежит: INFINEON TECHNOLOGIES AG

In one embodiment, an inductor has a substrate, a conductor disposed above the substrate and a seamless ferromagnetic material surrounding at least a first portion of the conductor.

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Номер записи: 25
19-09-2013 дата публикации

Electromagnetic shield for a passive electronic component in an active medical device implantable lead

Номер: US20130245413A1
Автор: Albert C. Lardo, Henry R. Halperin, Holly Noelle Moschiano, Kishore Kumar Kondabatni, Robert A. Stevenson, Robert Shawn Johnson, Warren S. Dabney
Принадлежит: Greatbatch Ltd

A shielded component or network for an active medical device (AMD) implantable lead includes (1) an implantable lead having a length extending from a proximal end to a distal end, all external of an AMD housing, (2) a passive component or network disposed somewhere along the length of the implantable lead, the passive component or network including at least one inductive component having a first inductive value, and (3) an electromagnetic shield substantially surrounding the inductive component or the passive network. The first inductive value of the inductive component is adjusted to a account for a shift in its inductance to a second inductive value when shielded.

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Номер записи: 26
03-10-2013 дата публикации

Power line filter for multidimensional integrated circuits

Номер: US20130257564A1
Автор: Bo-Jr Huang, Chin-Chou Liu, Kuan-Yu Lin, Yi-Wei Chen
Принадлежит: Taiwan Semiconductor Manufacturing Co TSMC Ltd

An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The interposer has successive tiers including silicon, metal and dielectric deposition layers. The decoupling network for a conductor has at least one and preferably two reactive transmission lines. A transmission line has an inductor in series with the conductor and parallel capacitances at the inductor terminals. The inductors are formed by traces in spaced metal deposition layers forming coil windings and through vias connecting between layers to permit conductor crossovers. The capacitances are formed by MOScaps in the interposer layers. An embodiment has serially coupled coils with capacitances at the input, output and junction between the coils, wherein the coils are magnetically coupled to form a transformer.

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Номер записи: 27
10-10-2013 дата публикации

Electronic component and method for manufacturing the same

Номер: US20130265131A1
Автор: Ju Hwan Yang, Sang Moon Lee, Sung Kwon Wi, Young Seuck Yoo
Принадлежит: Samsung Electro Mechanics Co Ltd

The present invention relates to an electronic component having a primary coil pattern and a secondary coil pattern with at least one selected from a dielectric and an insulator interposed therebetween, which includes at least one discharge terminal for discharging overvoltage or overcurrent applied to the primary coil pattern or the secondary coil pattern, and a method for manufacturing the same. Since it is possible to efficiently discharge overvoltage or overcurrent applied to an electronic component, it is possible to improve reliability of various electronic devices to which the electronic component in accordance with an embodiment of the present invention is applied as well as to extend lifespan of the electronic component itself.

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Номер записи: 28
24-10-2013 дата публикации

Method for making surface mount inductor

Номер: US20130276298A1
Автор: Chien Chih Liu
Принадлежит: Mag Layers Scientific Technics Co Ltd

A method for manufacturing an inductor includes a mold device having a mold cavity, disposing a coil member above the mold cavity of the mold device, filling metallic particles into the mold cavity of the mold device, forcing the coil member into the metallic particles to form a base member, applying two conductive coating members onto the base member and electrically connecting to the terminals of the coil member respectively, and attaching two conductive coverings onto the conductive coating members respectively and electrically connecting to the conductive coating members respectively for allowing the inductors to be quickly manufactured in a mass production.

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Номер записи: 29
14-11-2013 дата публикации

Coil structure and electromagnetic component using the same

Номер: US20130300529A1
Автор: Chia-Chi Wu, Jih-Hsu Yeh, Lang-Yi Chiang, Tsung-Chan Wu, Wei-Chien Chang
Принадлежит: Cyntec Co Ltd

An electromagnetic component including a multi-layer, spiral coil structure embedded in a molded body is disclosed. Each layer of the coil structure makes approximately one and a quarter turns of a winding. Each layer of the coil structure has a loose middle segment, two slim end segments overlapping each other with a spacing therebetween, and tapered neck segments respectively connecting the loose middle segment with the two slim end segments.

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Номер записи: 30
12-12-2013 дата публикации

Method of manufacturing magnetic element and magnetic element

Номер: US20130328656A1
Автор: Shinichi Sakamoto
Принадлежит: Sumida Corp

The magnetic element has a first core member, a winding part, and a second core member, and is manufactured by way of at least a winding part placement step of placing the winding part on the face of the first core member on the side on which the core part is provided, such that the core part is positioned within the inner periphery of the winding part, and an injection molding step of injection molding so as to surround the first core member and the winding part with resin material, and in the winding part placement step, the winding part is placed on the face of the first core member on the side on which the core part is provided, with at least a portion of the inner peripheral face of the winding part distanced from the outer peripheral face of the core part.

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Номер записи: 31
19-12-2013 дата публикации

Electromagnetic component and fabrication method thereof

Номер: US20130335186A1
Автор: Chia-Chi Wu, Jih-Hsu Yeh, Lang-Yi Chiang, Tsung-Chan Wu, Wei-Chien Chang
Принадлежит: Cyntec Co Ltd

An electromagnetic component includes a coil portion with a multi-layer stack structure, a molded body encapsulating the coil portion, and two electrodes respectively coupled to two terminals of the coil portion. The coil portion is fabricated using plating, laminating and/or pressing manufacturing techniques.

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Номер записи: 32
06-03-2014 дата публикации

Plated lamination structures for integrated magnetic devices

Номер: US20140061853A1
Автор: Bucknell C. Webb
Принадлежит: International Business Machines Corp

Semiconductor integrated magnetic devices such as inductors, transformers, etc., having laminated magnetic-insulator stack structures are provided, wherein the laminated magnetic-insulator stack structures are formed using electroplating techniques. For example, an integrated laminated magnetic device includes a multilayer stack structure having alternating magnetic and insulating layers formed on a substrate, wherein each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by an insulating layer, and a local shorting structure to electrically connect each magnetic layer in the multilayer stack structure to an underlying magnetic layer in the multilayer stack structure to facilitate electroplating of the magnetic layers using an underlying conductive layer (magnetic or seed layer) in the stack as an electrical cathode/anode for each electroplated magnetic layer in the stack structure.

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Номер записи: 33
06-03-2014 дата публикации

Thin film type common mode filter

Номер: US20140062644A1
Автор: Eun Ha Kim, Ho Jin YUN, Jin Hyuck Yang, Jong Yun Lee, Ju Hwan Yang, Kang Heon Hur, Sung Kwon Wi, Young Do Kweon, Young Seuck Yoo
Принадлежит: Samsung Electro Mechanics Co Ltd

Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.

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Номер записи: 34
06-01-2022 дата публикации

A VERTICAL MAGNETIC STRUCTURE FOR INTEGRATED POWER CONVERSION

Номер: US20220005640A1
Автор: "ODriscoll Seamus", "OMathuna Cian", McCloskey Paul, Pavlovic Zoran, Smallwood Daniel, Smiddy Hugh
Принадлежит: University College Cork - National University of Ireland, Cork

The present invention provides an inductor device comprising one or more interconnected columns of conductive material embedded in a supporting structure, wherein the one or more columns comprise an input terminal and an output terminal; and wherein each column is surrounded by a first magnetic layer. 1. A transformer or coupled inductor device comprising:two interconnected columns of conductive material embedded in a supporting structure, the two interconnected columns comprising a first column and a second column spaced apart from the first column, each column comprising an inner column portion and an outer column portion concentric with the inner column portion,the outer column portion and the inner column portion each having a first end and a second end, wherein the first end of the first inner column portion and the first outer column portion each comprise an input terminal or an output terminal and the first end of the second inner column portion and the second outer column portion each comprise an input terminal or an output terminal, and wherein the second end of the first inner column portion is conductively coupled to the second end of the second inner column portion by an inner interconnecting track of conductive material, and wherein the second end of the first outer column portion is conductively coupled to the second end of the second outer column portion by an outer interconnecting track of conductive material.2. A transformer or coupled inductor device comprising:three or more interconnected spaced apart columns of conductive material embedded in a supporting structure, the three of more columns comprising an input column, an output column, and at least one intermediate column, each column comprising an inner column portion and an outer column portion concentric with the inner column portion, the outer column portion and the inner column portion each having a first end and a second end, wherein the first end of each intermediate inner column portion ...

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Номер записи: 35
02-01-2020 дата публикации

MAGNETIC DEVICE WITH MAGNETIC STRUCTURE AND MICRO-FLUIDIC STRUCTURE

Номер: US20200003851A1
Автор: "ODONNELL Alan J.", Calpe Maravilla Javier, ENGLISH Eoin E., FITZGERALD Padraig L., GUYOL Robert, Kubik Jan, Lynch Michael P., MARTINEZ Maria Jose
Принадлежит:

A magnetic device may include a magnetic structure, a device structure, and an associated circuit. The magnetic structure may include a patterned layer of material having a predetermined magnetic property. The patterned layer may be configured to, e.g., provide a magnetic field, sense a magnetic field, channel or concentrate magnetic flux, shield a component from a magnetic field, or provide magnetically actuated motion, etc. The device structure may be another structure of the device that is physically connected to or arranged relative to the magnetic structure to, e.g., structurally support, enable operation of, or otherwise incorporate the magnetic structure into the magnetic device, etc. The associated circuit may be electrically connected to the magnetic structure to receive, provide, condition or process of signals of the magnetic device. 1. (canceled)2. A magnetic device comprising:a micro-fluidic channel embedded in a multi-layer structure, the micro-fluidic channel comprising an inlet arranged to receive a fluid that includes different types of particles; anda magnetic structure embedded in the multi-layer structure, the magnetic structure positioned about the micro-fluidic channel, and the magnetic structure arranged to produce a magnetic field to cause the different types of particles in the fluid to be separated in the micro-fluidic channel.3. The magnetic device of claim 2 , wherein the magnetic structure includes patterned layers on opposing sides of the micro-fluidic channel claim 2 , the patterned layers comprising material configured to produce the magnetic field.4. The magnetic device of claim 3 , further comprising conductive coils electrically connected to the patterned layers.5. The magnetic device of claim 2 , wherein the multi-layer structure comprises a plurality of layers on a substrate.6. The magnetic device of claim 2 , wherein the multi-layer structure comprises a plurality of substrates.7. The magnetic device of claim 2 , wherein the ...

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Номер записи: 36
07-01-2016 дата публикации

Inductor and method of manufacturing the same

Номер: US20160005520A1
Автор: Chang Mao Cheng
Принадлежит: Individual

An inductor and a method of manufacturing the same are disclosed. The inductor comprises: a magnetic core; at least a set of conducting coils, sleeved on the magnetic core, each of the conducting coils including a toroidal coil portion and two extending portions extending from two ends of the toroidal coil portion towards a same direction; the magnetic cover body, hermetically covering and fixing to peripherals of the conducting coil and the magnetic core; and an upper lid and the lower lid; wherein the magnetic core, the conducting coil, the magnetic cover body, the upper lid and the lower lid are integrally formed. Each of the magnetic core, the magnetic cover body, the upper lid and the lower lid includes components of an iron powder, a phosphoric acid, and a resin. When a coil turn number of the conducting coil exceeds a predetermined value, the toroidal coil portion includes at least two layers of parallelly disposed coil windings. The disclosure is adapted to a power supply, an uninterruptable power supply, an air-conditioner frequency converter and power inverter and has a lower cost and better inductance characteristics.

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Номер записи: 37
13-01-2022 дата публикации

COIL COMPONENT

Номер: US20220013271A1
Автор: Kim Jae Hun, Moon Byeong Cheol
Принадлежит:

A coil component includes a body having one end and the other end opposing each other, a support substrate disposed inside the body, a coil portion, disposed on at least one surface of the support substrate, in which an end portion of an outermost turn is disposed closer to the one surface of the body than to the other surface of the body, a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body, and an anchor portion connected to the lead-out portions and including a via pad disposed between the lead-out portion and the coil portion inside the body. 1. A coil component comprising:a body having one surface and the other surface opposing each other;a support substrate disposed inside the body;a coil portion disposed on at least one surface of the support substrate, an end portion of an outermost turn of the coil portion disposed closer to the one surface of the body than to the other surface of the body;a lead-out portion connected to the outermost turn of the coil portion and exposed to the one surface of the body; andan anchor portion connected to the lead-out portion and including a via pad disposed between the lead-out portion and the coil portion inside the body.2. The coil component of claim 1 , wherein the lead-out portion includes a lead-out pattern and an auxiliary lead-out pattern exposed to the one surface of the body claim 1 , andthe anchor portion includes a first via pad and a second via pad, respectively disposed to correspond to the one surface and the other surface of the support substrate, and a connection via penetrating through the support substrate to be connected to the first via pad and the second via pad.3. The coil component of claim 2 , wherein the first via pad and the second via pad are in contact with claim 2 , and connected to claim 2 , the lead-out pattern and the auxiliary lead-out pattern claim 2 , respectively.4. The coil component of claim 3 , wherein a groove is disposed in ...

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Номер записи: 38
13-01-2022 дата публикации

COIL COMPONENT

Номер: US20220013281A1
Автор: Jo Sung Young, Lee Jae Wook, SHIN Sung Sik
Принадлежит:

A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface, a winding coil disposed in the body and having a lead-out portion exposed to the one end surface of the body, a first insulating layer disposed on the one end surface of the body and having one region and the other region spaced apart from each other in the other direction, perpendicular to the one direction, an external electrode having a connection portion, disposed between the one region and the other region of the first insulating layer to be connected to the lead-out portion, and an extension portion extending from the connection portion to the one surface of the body, and a second insulating layer covering the first insulating layer and the connection portion on the one end surface of the body. 1. A coil component comprising:a body having a first surface and a second surface, opposing each other in a first direction, and a first end surface connecting the first surface and the second surface;a winding coil disposed in the body and having a lead-out portion exposed to the first end surface of the body;a first insulating layer disposed on the first end surface of the body and having a first region and a second region spaced apart from each other in a second direction, perpendicular to the first direction;an external electrode having a connection portion, disposed between the first region and the second region of the first insulating layer to be connected to the lead-out portion, and an extension portion extending from the connection portion to the first surface of the body; anda second insulating layer covering the first insulating layer and the connection portion on the first end surface of the body.2. The coil component of claim 1 , wherein a ratio of a length of the connection portion in the second direction to a sum of lengths of the first region and the second region of the ...

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Номер записи: 39
13-01-2022 дата публикации

Method For Manufacturing Electronic Component With Coil

Номер: US20220013285A1
Автор: MALCOLM Douglas James, Sakamoto Shinichi
Принадлежит:

An inductor includes an air-core coil assembled with a T-shaped core and a composite magnetic material and resin mixture embedding the T-shaped core and the air-core coil. The air-core coil has: a coil member having a coil axis and first and second sides opposite to each other; and first and second leads that are integrally connected to the coil member. The first and second leads respectively have: first and second bent members at the first side; first and second ends at the second side; and first and second bottom extensions respectively connected between the first and second bent members and the first and second ends. The first and second bent members extend in a first direction parallel to the coil axis, the first and second ends extend in a second direction parallel to the coil axis, and the first and second bottom extensions extend perpendicular to the coil axis. 1. An inductor comprising:a T-shaped core; a coil member that is formed by winding a flat rectangular wire, the coil member having first and second sides opposite to each other, the coil member having a coil axis; and', first and second bent members at the first side;', 'first and second ends at the second side; and', 'first and second bottom extensions respectively connected between the first and second bent members and the first and second ends; and, 'first and second leads that are formed by the flat rectangular wire and that are integrally connected to the coil member, the first and second leads respectively having], 'an air-core coil that is assembled with the T-shaped core, the air-core coil havinga mixture of a composite magnetic material and a resin, the mixture embedding the T-shaped core and the air-core coil, whereinthe first and second bent members extend in a first direction parallel to the coil axis,the first and second ends extend in a second direction parallel to the coil axis, andthe first and second bottom extensions extend perpendicular to the coil axis.2. The inductor according to ...

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Номер записи: 40
04-01-2018 дата публикации

CHIP PARTS

Номер: US20180005732A1
Автор: KONDO YASUHIRO, MATSUURA Katsuya, SHIMOICHI Takuma, TORII Takamichi, WATANABE Keishi
Принадлежит: ROHM CO., LTD.

A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode. 1. A chip transformer including:a substrate that has an element formation surface;a primary coil formation trench and a secondary coil formation trench that are formed in the substrate by digging down from the element formation surface and that are formed in the shape of a spiral in a plan view when seen in a normal direction perpendicular to the element formation surface;a primary coil that is formed with a first conductive member embedded within the primary coil formation trench; anda secondary coil that is formed with a second conductive member embedded within the secondary coil formation trench.2. The chip transformer described in further including:a first electrode and a second electrode which are disposed on the element formation surface, one end portion of the primary coil connected to the first electrode and an opposite end portion of the primary coil connected to the second electrode; anda third electrode and a fourth electrode which are disposed on the element formation surface, one end portion of the secondary coil connected to the third electrode and an opposite end portion of the secondary coil connected to the fourth electrode.3. A chip transformer described in further including:an insulating film ...

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Номер записи: 41
04-01-2018 дата публикации

COMMON MODE CHOKE COIL

Номер: US20180005752A1
Автор: IKEMOTO Kiyomi, IMANISHI Yoshihiro, ISHIWATA Yu, TAKAYAMA Kota
Принадлежит: MURATA MANUFACTURING CO., LTD.

Three or more of n inductors are arranged inside an insulating member. Inside the insulating member, each of the inductors includes coil conductors that are contained in respective coil conductor layers that are stacked in a first direction and via conductors, each of which connects the coil conductors that are contained in the coil conductor layers adjoining in the first direction. Each of the coil conductor layers contains the n coil conductors of the inductors, and a pattern formed of the coil conductors contained in each of the coil conductor layers has n-fold rotational symmetry. 1. A common mode choke coil , comprising:an insulating member; andthree or more of n inductors arranged inside the insulating member,wherein inside the insulating member, each of the inductors includes coil conductors that are contained in respective coil conductor layers that are stacked in a first direction and via conductors, each of which connects the coil conductors that are contained in the coil conductor layers adjoining in the first direction, andwherein each of the coil conductor layers contains the n coil conductors of the inductors, and a pattern formed of the coil conductors contained in each of the coil conductor layers has n-fold rotational symmetry.2. The common mode choke coil according to claim 1 ,wherein the n coil conductors contained in each of the coil conductor layers form respective arc patterns having the same center and the same radius.3. The common mode choke coil according to claim 1 ,wherein the number of the inductors arranged inside the insulating member is three.4. The common mode choke coil according to claim 1 , further comprising:outer electrodes arranged on a surface of the insulating member; andlead conductors, each of which connects each of the outer electrodes to the corresponding one of the n inductors. This application claims benefit of priority to Japanese Patent Application 2016-131193 filed Jul. 1, 2016, the entire content of which is ...

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Номер записи: 42
07-01-2021 дата публикации

COIL COMPONENT AND METHOD FOR FABRICATING THE SAME

Номер: US20210005376A1
Автор: JANG Jin Hyuk
Принадлежит:

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove. 1. A coil component , comprising:a body comprising:a support member including a through hole;a coil disposed on at least one of an upper surface and a lower surface of the support member, the coil including a coil pattern; anda magnetic material encapsulating the coil and the support member, and filling the through hole; andan external electrode connected to the coil,wherein at least one of the upper surface and the lower surface of the support member includes a groove defined therein, anda depth of the groove formed on the upper surface of the support member is different from the depth of the groove formed on the lower surface of the support member,the groove has a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.2. The coil component of claim 1 , wherein the groove is formed to have a spiral shape.3. The coil component of claim 1 , wherein the groove is formed in the upper surface and the lower surface claim 1 , and a depth of the groove formed in the upper surface is greater than a depth of the groove formed in the lower surface.4. The coil component of claim 1 , wherein the coil pattern includes a first coil pattern and a second coil pattern directly adjacent to the first coil pattern claim 1 , each disposed on the upper surface claim 1 , the second coil pattern being connected ...

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Номер записи: 43
07-01-2021 дата публикации

Coil component

Номер: US20210005379A1
Автор: Byeong Cheol MOON, Jeong Gu Yeo, Young Il Lee
Принадлежит: Samsung Electro Mechanics Co Ltd

A coil component includes a body having a molded portion and a cover portion disposed on one surface of the molded portion, and including magnetic metal powder; a winding coil disposed between one surface of the molded portion and the cover portion and embedded in the body, and including a coating layer surrounding a surface of each of a plurality of turns; and a first protective film disposed between the one surface of the molded portion and the cover portion and between at least a portion of the surface of the winding coil and the cover portion.

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Номер записи: 44
02-01-2020 дата публикации

STACKED SPIRAL INDUCTOR

Номер: US20200005980A1
Автор: DONG Congying
Принадлежит: CSMC TECHNOLOGIES FAB2 CO., LTD.

A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer. 1. A stacked spiral inductor , comprising: a substrate , and multiple stacked insulating layers and inductive metal layers formed on the substrate via a semiconductor process;wherein an inductive metal layer comprises a conductive coil in a shape of a spiral, and a through hole area configured to connect two adjacent inductive metal layers, and the conductive coils of the inductive metal layers have a common coil center; andwherein in two adjacent inductive metal layers, a conductive coil of a lower inductive metal layer is retracted towards the coil center with respect to a conductive coil of an upper inductive metal layer.2. The stacked spiral inductor of claim 1 , wherein retracted distances of the conductive coils of the inductive metal layers are equal to each other claim 1 , or the retracted distances of the conductive coils of the inductive metal layers form an arithmetic progression.3. The stacked spiral inductor of claim 1 , wherein a retracted distance of each conductive coil of the inductive metal layers ranges from 2 μm to 3 μm.4. The stacked spiral inductor of claim 1 , wherein the conductive coil of each inductive metal layer comprises a lead end and an opening end opposite to the lead end;an inductive metal layer located on a top is a first inductive metal layer, an inductive metal layer arranged adjacent to the first inductive metal layer is a ...

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Номер записи: 45
02-01-2020 дата публикации

COIL COMPONENT

Номер: US20200005981A1
Автор: KOBAYASHI Kohei, Takezawa Kaori
Принадлежит: MURATA MANUFACTURING CO., LTD.

A coil component includes a drum core and first and second wires. The first wire includes a first extending portion. The second wire includes a third extending portion. The first and third extending portions are not in contact with each other. Each of the first and second wires includes a coat including a first region and a second region. The coat in the first and third extending portions is the second region at least in part. The coat is the first region at a contacting point where the first and second wires are in contact for the first time from a first flange portion in the drum core. 1. A coil component comprising:a drum core including a winding core portion extending in an axial direction, a first flange portion, and a second flange portion, the first and second flange portions being disposed on opposite end portions of the winding core portion;a first wire and a second wire each including a linear central conductor and a coat made of resin and covering a peripheral surface of the central conductor;a first terminal electrode and a third terminal electrode disposed on the first flange portion; anda second terminal electrode and a fourth terminal electrode disposed on the second flange portion,whereinthe first wire includes a first connection portion connected to the first terminal electrode, a first winding portion wound around the winding core portion, a second connection portion connected to the second terminal electrode and being opposite to the first connection portion, a first extending portion between the first connection portion and the first winding portion, and a second extending portion between the second connection portion and the first winding portion,the second wire includes a third connection portion connected to the third terminal electrode, a second winding portion wound around the winding core portion, a fourth connection portion connected to the fourth terminal electrode and being opposite to the third connection portion, a third extending ...

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Номер записи: 46
02-01-2020 дата публикации

Thin Film Inductor, Power Conversion Circuit, and Chip

Номер: US20200005985A1
Автор: Heqian YANG, Shijun Yang, Wei Chen, Yongfa Zhu
Принадлежит: Huawei Technologies Co Ltd

A thin film inductor includes a first magnetic thin film and a second magnetic thin film that are adjacent, the first magnetic thin film is nested in the second magnetic thin film, and a relative magnetic permeability of the first magnetic thin film is less than a relative magnetic permeability of the second magnetic thin film, and a difference between the relative magnetic permeability of the first magnetic thin film and the relative magnetic permeability of the second magnetic thin film is greater than or equal to a first threshold, where when a magnetic induction intensity of the second magnetic thin film reaches a saturated magnetic induction intensity of the second magnetic thin film, a magnetic induction intensity of the first magnetic thin film is less than or equal to a saturated magnetic induction intensity of the first magnetic thin film.

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Номер записи: 47
02-01-2020 дата публикации

Integrated magnetic core inductors on glass core substrates

Номер: US20200005989A1
Автор: Adel Elsherbini, Krishna Bharath
Принадлежит: Intel Corp

A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

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Номер записи: 48
02-01-2020 дата публикации

Substrate assembly with encapsulated magnetic feature

Номер: US20200005994A1
Автор: Cheng Xu, Ji Yong Park, Junnan Zhao, Kyu-Oh Lee, Rahul Jain, Sai Vadlamani, Seo Young Kim
Принадлежит: Individual

Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

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Номер записи: 49
03-01-2019 дата публикации

INDUCTOR AND POWER AMPLIFIER MODULE

Номер: US20190006075A1
Автор: OKABE Takeyuki, TANGE Eigo, TSUTSUI Takayuki
Принадлежит:

An inductor includes first and second wirings respectively formed in a substantially spiral shape on first and second surfaces of a multilayer substrate. The multilayer substrate includes plural dielectric layers stacked on each other in a predetermined direction. The multilayer substrate includes a first layer having the first surface, which is an end surface in the predetermined direction, and a second layer having the second surface within the multilayer substrate. The width of the second wiring is smaller than that of the first wiring. The first and second wirings are electrically connected in parallel with each other. The inductance of the first wiring and that of the second wiring are substantially equal to each other. When the first and second wirings are projected on the first surface in the predetermined direction, entirety of a projected image of the second wiring is contained within that of the first wiring. 1. An inductor comprising:a first wiring that is formed in a substantially spiral shape on a surface of a first dielectric layer of a multilayer substrate; anda second wiring that is formed in a substantially spiral shape on a surface of a second dielectric layer of the multilayer substrate, wherein:the multilayer substrate comprises the first dielectric and the second dielectric layer, the first dielectric layer and the second dielectric layer being stacked on each other in a predetermined direction, the surface of the first dielectric layer being an end surface in the predetermined direction, and the surface of the second dielectric layer being within the multilayer substrate,a width of the second wiring is less than a width of the first wiring,the first wiring and the second wiring are electrically connected in parallel with each other, andwhen the first wiring and the second wiring are projected in the predetermined direction, a projected image of the first wiring completely overlaps a projected image of the second wiring.2. The inductor according ...

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Номер записи: 50
03-01-2019 дата публикации

Inductor module

Номер: US20190006076A1
Автор: Hirokazu Yazaki
Принадлежит: Murata Manufacturing Co Ltd

An inductor module includes an insulating flexible substrate including a thermoplastic resin, an IC element included in the flexible substrate, chip capacitors included in the flexible substrate, a chip inductor that includes a magnetic-material body and is located on a first main surface of the flexible substrate, and input and output terminals on a second main surface of the flexible substrate. The IC element may be a switching IC element, the chip inductor may be a choke coil, and the inductor module may be a DC/DC converter module.

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Номер записи: 51
03-01-2019 дата публикации

Coil component and lc composite component

Номер: US20190006095A1
Автор: Akihiro Harada, Kyohei Takahashi, Tomoya HANAI, Yoshihiro Shinkai
Принадлежит: TDK Corp

A coil component includes a coil and a composite magnetic material containing magnetic particles. The magnetic particles have an average minor-axis length of more than 5.0 nm and 50 nm or less and an average aspect ratio of 2.0 or more and 10.0 or less. The magnetic particles are orientated substantially perpendicularly to a central axis of the coil and are orientated randomly within a perpendicular plane to the central axis of the coil. The composite magnetic material has a saturation magnetization σs of 80.0 emu/g or more.

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Номер записи: 52
03-01-2019 дата публикации

COIL COMPONENT AND METHOD FOR MANUFACTURING THE SAME

Номер: US20190006100A1
Автор: BONG Kang Wook, JANG Jin Hyuk, Kim Boum Seock, Moon Byeong Cheol, Ryu Joung Gul
Принадлежит:

A coil component includes a magnetic body and an external electrode disposed on an external surface of the magnetic body. The magnetic body includes a support member including a through hole, filled with a magnetic material, and a via hole, a coil disposed on at least one surface of the support member, and a magnetic material encapsulating the coil and the support member. A first conductive layer is disposed on a side surface of the via hole formed in the support member and the at least one surface of the support member. The via hole is filled with a portion of the second conductive layer disposed on the first conductive layer. 1. A coil component , comprising: a support member including a through hole, filled with a magnetic material, and a via hole;', 'a coil disposed on at least one surface of the support member, the coil including a first conductive layer and a second conductive layer disposed on the first conductive layer; and', 'the magnetic material encapsulating the support member, the first conductive layer and the second conductive layer; and', 'an external electrode disposed on an external surface of the magnetic body, the external electrode being connected to the coil,', 'wherein the first conductive layer is continuously disposed on a side surface of the via hole and the at least one surface of the support member,', 'the second conductive layer includes a central plating layer disposed inside the via hole and a coil layer disposed above or below the central plating layer, and', 'the central plating layer is integrally formed with the coil layer to be a single structure., 'a magnetic body, the magnetic body including2. The coil component of claim 1 , wherein the central plating layer and the coil layer have no interface therebetween.3. The coil component of claim 1 , wherein a difference between an average thickness of a portion of the first conductive layer disposed on the at least one surface of the support member and an average thickness of another ...

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Номер записи: 53
02-01-2020 дата публикации

EMBEDDED MAGNETIC INDUCTOR

Номер: US20200006464A1
Автор: BROWN Andrew J., Jain Rahul, Li Sheng, Vadlamani Sai, Zhang Chong
Принадлежит:

An apparatus and method of forming a magnetic inductor circuit. A substrate is provided and a first magnetic layer is formed in contact with one layer of the substrate. A conductive trace is formed in contact with the first magnetic layer. A sacrificial cooper layer protects the magnetic material from wet chemistry process steps. A conductive connection is formed from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection formed by in-layer plating A second magnetic layer is formed in contact with the conductive trace. Instead of a horizontal connection, a vertical conductive connection can be formed that is perpendicular to the magnetic layers, by drilling a first via in a second of the magnetic layers, forming a buildup layer, and drilling a second via through the buildup layer, where the buildup layer protects the magnetic layers from wet chemistry processes. 1. A semiconductor circuit comprising:a substrate that includes a plurality of parallel layers;a first magnetic material in contact with one layer a first layer of the plurality of parallel layers;a second magnetic material in contact with a second layer of the plurality of parallel layer;a conductive trace embedded within one of more of the first magnetic material or the second magnetic material;a conductive connection from the conductive trace to the outside substrate, the conductive connection comprising a horizontal connection.2. The semiconductor circuit of further comprising a conductive pad spaced horizontally from the conductive trace and in contact with the conductive connection.3. The semiconductor circuit of claim 1 , wherein conductive trace is contained within the first layer and extends vertically into the first magnetic material from an interface between the first layer and the second layer.4. The semiconductor circuit of further comprising a conductive connection between the conductive pad and the outside substrate.5. The semiconductor ...

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Номер записи: 54
11-01-2018 дата публикации

Coil component and method for manufacturing the same

Номер: US20180012696A1
Автор: Han Kim, Min Ki Jung, Sang Jong Lee, Su Bong Jang
Принадлежит: Samsung Electro Mechanics Co Ltd

A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at least one each of the first and second coil patterns may be formed, and the plurality of coils may be connected in parallel to each other.

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Номер записи: 55
11-01-2018 дата публикации

Coil device

Номер: US20180012699A1
Автор: Akiumi OBA, Kazunori Arimitsu, Shunpei KIKUCHI
Принадлежит: TDK Corp

At the position where the lead art of the wire is projecting out from the outer face of the core part and spaced apart from the side face, the bonding part between the lead part and the terminal electrode is formed. The terminal electrode comprises the terminal body installed along the side face of the core body, and the lead supporting part bended from the terminal body towards the bonding part at the near position where the lead part projects out from the side face of the core part. The crossing angle of the lead supporting part with respect to the side face of the core body is less than 90 degrees.

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Номер записи: 56
10-01-2019 дата публикации

MULTILAYER BEAD AND BOARD HAVING THE SAME

Номер: US20190013121A1
Автор: HA Young Jin, IM Jeong Hwan, JUN So Young, PARK Sung Jin
Принадлежит:

A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided. 1. A multilayer bead comprising:a body in which a plurality of ceramic layers are stacked;a plurality of internal electrode patterns formed on the plurality of ceramic layers; andfirst and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively,wherein a stacking direction of the plurality of ceramic layers is perpendicular to both end surfaces of the body on which the first and second external electrodes are formed, anda coil axis of the internal coil is parallel to a mounting surface of the body.2. The multilayer bead of claim 1 , wherein a marking pattern is provided on at least one surface of the body.3. The multilayer bead of claim 2 , wherein the marking pattern is provided on at least one of two outermost ceramic layers disposed in outermost positions of the body among the plurality of ceramic layers stacked in the body.4. The multilayer bead of claim 2 , wherein the marking pattern is provided on any one of two outermost ceramic layers disposed in outermost positions of the body among the plurality of ceramic layers stacked in the body claim 2 , and a minimum separation distance between the internal coil and an ...

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Номер записи: 57
10-01-2019 дата публикации

COIL COMPONENT

Номер: US20190013133A1
Автор: SASAKI Katsufumi
Принадлежит: MURATA MANUFACTURING CO., LTD.

A coil component includes a first magnetic body, an insulator stacked on the first magnetic body, a second magnetic body stacked on the insulator, and a coil which is disposed in the insulator and which includes a first coil conductor layer and a second coil conductor layer that are arranged in the stacking direction of the first magnetic body, the insulator, and the second magnetic body. In a cross section in the stacking direction, the shapes of the first coil conductor layer and the second coil conductor layer are polygonal, and regarding opposing portions of the first coil conductor layer and the second coil conductor layer that face each other, one opposing portion is a side and the other opposing portion is a vertex. 1. A coil component comprising:a first magnetic body;an insulator stacked on the first magnetic body;a second magnetic body stacked on the insulator; anda coil which is disposed in the insulator and includes a first coil conductor layer and a second coil conductor layer that are arranged in a stacking direction of the first magnetic body, the insulator, and the second magnetic body,wherein,in a cross section in the stacking direction, shapes of the first coil conductor layer and the second coil conductor layer are polygonal, andregarding opposing portions of the first coil conductor layer and the second coil conductor layer that face each other, one opposing portion is a side and an other opposing portion is a vertex.2. The coil component according to claim 1 , wherein a number of vertices of a polygon with respect to each of the first coil conductor layer and the second coil conductor layer is an odd number.3. The coil component according to claim 1 , wherein the vertices of a polygon with respect to each of the first coil conductor layer and the second coil conductor layer are curved.4. The coil component according to claim 1 , wherein claim 1 , in a cross section in the stacking direction claim 1 , at least part of the second coil conductor ...

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Номер записи: 58
10-01-2019 дата публикации

COIL COMPONENT

Номер: US20190013145A1
Автор: ARATA Masazumi, EDA Hokuto, Kawahara Takahiro, OHKUBO Hitoshi, TSUJIAI Hiroki
Принадлежит: TDK Corporation

In a planar coil element, a dead space in a non-overlapping region is reduced by designing a total width of a first resin wall and a first turn located in the non-overlapping region to be narrow, more specifically, by designing the total width to be narrower than a total width of a second turn outside the first turn and a second resin wall located inside the turn and also than a total width of a third turn on the outer side and a third resin wall located inside the turn. As a result, a volume of a magnetic element body in a magnetic core portion of a coil can be increased, and an, inductance value, which is a magnetic characteristic, can also be improved. 1. A coil component comprising:an insulating substrate having a through-hole;a coil having a first coil conductor pattern formed around the through-hole on one surface of the insulating substrate, a second coil conductor pattern formed around the through-hole on the other surface of the insulating substrate and wound in a winding direction opposite to that of the first coil conductor pattern when seen in a thickness direction of the insulating substrate, and a through-hole conductor provided to pass through the insulating substrate and configured to connect ends of the first coil conductor pattern and the second coil conductor pattern on the through-hole side;resin walls disposed between turns of each of the first coil conductor pattern and the second coil conductor pattern and disposed on an inner side of an innermost turn and on an outer side of an outermost turn of each of the first coil conductor pattern and the second coil conductor pattern; anda magnetic element body provided on one surface and the other surface of the insulating substrate to cover the first coil conductor pattern, the second coil conductor pattern and the resin wall and configured to fill inner sides of the through-hole of the insulating substrate, the first coil conductor pattern and the second coil conductor pattern,wherein there is a non- ...

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Номер записи: 59
10-01-2019 дата публикации

COIL COMPONENT

Номер: US20190013148A1
Автор: ARATA Masazumi, EDA Hokuto, Kawahara Takahiro, OHKUBO Hitoshi, TSUJIAI Hiroki
Принадлежит: TDK Corporation

In a planar coil element, since an overlapping portion of a fourth resin wall of a first conductor pattern protrudes from an end surface of a main body portion, restriction on a width of the overlapping portion is relaxed, and the wide overlapping portion is realized. Therefore, an improvement in a withstand voltage between the second external terminal electrode formed on the end surface and an outermost turn of the first conductor pattern is realized. Similarly, regarding the second conductor pattern, the improvement in the withstand voltage between the first external terminal electrode formed on the end surface and an outermost turn of the second conductor pattern is realized. 1. A coil component comprising a main body portion having a first end surface and a second end surface facing each other , and a first external terminal electrode and a second external terminal electrode respectively formed on the first end surface and the second end surface of the main body portion ,wherein the main body portion comprisesan insulating substrate configured to extend in a direction in which the first end surface and the second end surface face each other;a coil having a first coil conductor pattern formed on one surface of the insulating substrate and having an outer end portion extending to the first end surface and connected to the first external terminal electrode, a second coil conductor pattern formed on the other surface of the insulating substrate, extending to the second end surface to be connected to the second external terminal electrode and wound in a winding direction opposite to that of the first coil conductor pattern when seen in a thickness direction of the insulating substrate, and a through-hole conductor provided to pass through the insulating substrate and configured to connect inner ends of the first coil conductor pattern and the second coil conductor pattern;resin walls between turns of each of the first coil conductor pattern and the second coil ...

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Номер записи: 60
14-01-2021 дата публикации

INDUCTOR DEVICE

Номер: US20210012946A1
Автор: Chan Ka-Un, Yen Hsiao-Tsung
Принадлежит:

An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner. 1. An inductor device , comprising:a first trace disposed in a first area;a second trace disposed in a second area; anda double ring inductor disposed at an outside of the first trace and the second trace, wherein the double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.2. The inductor device of claim 1 , wherein the double ring inductor comprises:a third trace disposed in the first area, and coupled to the first trace in an interlaced manner; anda fourth trace disposed in the second area, and coupled to the second trace in an interlaced manner.3. The inductor device of claim 2 , wherein the third trace and the fourth trace are coupled to each other at a junction of the first area and the second area.4. The inductor device of claim 3 , wherein the first trace and the third trace are coupled to each other in an interlaced manner at a side which is opposite to the junction.5. The inductor device of claim 4 , wherein the second trace and the fourth trace are coupled to each other in an interlaced manner at the junction.6. The inductor device of claim 5 , wherein the double ring inductor further comprises:a first connector coupled to the third trace and the fourth trace at a first side of the inductor device.7. The inductor device of claim 6 , wherein the double ring inductor further comprises:a first input/output terminal disposed in the third trace.8. The inductor device of claim 7 , wherein the first trace claim 7 , the second trace claim 7 , the third trace claim 7 , and the fourth trace are disposed on a first layer.9. The inductor ...

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Номер записи: 61
14-01-2021 дата публикации

COMMON MODE CHOKE COIL

Номер: US20210012949A1
Автор: Miyamoto Masashi
Принадлежит: MURATA MANUFACTURING CO., LTD.

A common mode choke coil is configured in which end portions of first and second wires are connected to first and second terminal electrodes, end portions of third and fourth wires are connected to third and fourth terminal electrodes, and at least a part of each of the first, third, fourth and second wires is wound around a winding core portion to form first, second, third and fourth layers. Also, a common mode choke coil is configured in which end portions of first and second wires are connected to first and second terminal electrodes, end portions of a third wire are connected to third and fourth terminal electrodes, and at least a part of each of the first, third, and second wires is wound around a winding core portion to form first, second, and third layers. 1. A common mode choke coil comprising:a core including a winding core portion, a first flange portion provided on a first end side in an axial direction of the winding core portion, and a second flange portion provided on a second end side in the axial direction of the winding core portion opposite to the first end side;a first wire, a second wire, a third wire, and a fourth wire each wound helically around the winding core portion;a first terminal electrode and a third terminal electrode provided on the first flange portion; anda second terminal electrode and a fourth terminal electrode provided on the second flange portion,wherein each of end portions of the first wire and the second wire at the first end side is connected to the first terminal electrode, and each of end portions of the first wire and the second wire at the second end side is connected to the second terminal electrode,each of end portions of the third wire and the fourth wire at the first end side is connected to the third terminal electrode, each of end portions of the third wire and the fourth wire at the second end side is connected to the fourth terminal electrode,at least a part of the first wire is wound around the winding core ...

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Номер записи: 62
14-01-2021 дата публикации

COIL COMPONENT

Номер: US20210012954A1
Автор: Ishida Takuya, SHINOHARA Gota
Принадлежит: MURATA MANUFACTURING CO., LTD.

A coil component includes a magnetic portion that includes metal particles and a resin material, a coil conductor embedded in the magnetic portion, and outer electrodes electrically connected to the coil conductor. The average particle diameter of the metal particles in the magnetic portion is 1 μm or more and 5 μm or less, and the CV value of the metal particles is 50% or more and 90% or less. 1. A coil component comprising:a magnetic portion that includes metal particles and a resin material;a coil conductor embedded in the magnetic portion and being wound in an α-winding form; andouter electrodes electrically connected to the coil conductor,wherein a magnetic base including a base portion and a protrusion portion disposed on an upper surface of the base portion, the protrusion portion having a portion located in a core portion of the coil conductor and including the metal particles and the resin material, and the protrusion portion extending from the base portion and including an end positioned a spaced distance from the base portion, and', 'a magnetic outer coating covering the end of the protrusion portion,, 'the magnetic portion includes'}a filling factor of the metal particles in the magnetic base is from 75% to 85%,a filling factor of the metal particles in the magnetic outer coating is from 65% to 90%,the coil conductor is made of a rectangular wire, and a thickness of the rectangular wire is 0.13 mm or less,a length of the coil component is 1.8 mm or less, anda width of the coil component is 1.0 mm or less.2. The coil component according to claim 1 , whereinthe magnetic base contains the metal particles being formed of a metal material, the metal material being Fe—Si alloys.3. The coil component according to claim 2 , whereinthe magnetic base further contains the metal particles being formed of a metal material, the metal material being iron.4. The coil component according to claim 3 , whereinthe metal particles of iron are crystalline particles.5. The ...

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Номер записи: 63
09-01-2020 дата публикации

INSULATING INDUCTOR CONDUCTORS WITH AIR GAP USING ENERGY EVAPORATION MATERIAL (EEM)

Номер: US20200013551A1
Автор: SINGH Jagar, Singh Sunil K.
Принадлежит: GLOBALFOUNDRIES INC.

A first layer on a substrate includes an insulator material portion adjacent an energy-reactive material portion. The energy-reactive material portion evaporates upon application of energy during manufacturing. Processing patterns the first layer to include recesses extending to the substrate in at least the energy-reactive material portion. The recesses are filled with a conductor material, and a porous material layer is formed on the first layer and on the conductor material. Energy is applied to the porous material layer to: cause the energy to pass through the porous material layer and reach the energy-reactive material portion; cause the energy-reactive material portion to evaporate; and fully remove the energy-reactive material portion from an area between the substrate and the porous material layer, and this leaves a void between the substrate and the porous material layer and adjacent to the conductor material. 1. An integrated circuit structure comprising:a substrate;a first layer on the substrate; anda porous material layer on the first layer, first electrical conductors comprising an inductor structure;', 'a void adjacent to the first electrical conductors of the inductor structure; and', 'an insulator material portion bordering the inductor structure,, 'wherein the first layer includeswherein the insulator material portion includes second electrical conductors comprising electrical connectors separate from the inductor structure, andwherein the void extends between the substrate and the porous material layer.2. The integrated circuit structure according to claim 1 , wherein the porous material layer has pores capable of allowing ultraviolet light to pass through.3. The integrated circuit structure according to claim 1 , wherein the porous material layer has pores capable of allowing an evaporated energy-reactive material portion to pass through.4. The integrated circuit structure according to claim 1 , further comprising an insulator layer on the porous ...

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Номер записи: 64
09-01-2020 дата публикации

RESONANT CIRCUIT ELEMENT AND CIRCUIT MODULE

Номер: US20200014361A1
Автор: IKEMOTO Kiyomi
Принадлежит: MURATA MANUFACTURING CO., LTD.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern. 1. A resonant circuit element comprising:a flexible film made from a dielectric material;a first conductive pattern made from a conductive material and formed on a first surface that is one surface of the flexible film;an adhesive layer disposed on a second surface opposite to the first surface of the flexible film; anda pair of first outer electrodes configured to generate an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and to cause an electric current to flow through the first conductive pattern.2. The resonant circuit element according to claim 1 , wherein each of the first outer electrodes of the pair includes a portion formed on a corresponding end face of the composite member.3. The resonant circuit element according to claim 1 , further comprising:a second conductive pattern made from a conductive material and formed on the first surface; anda pair of second outer electrodes configured to cause an electric current to flow through the second conductive pattern and to generate an electric field in an in-plane direction of the composite member, wherein the first conductive pattern and the second conductive pattern constitute a choke coil.4. The resonant circuit element according to claim 1 , wherein the adhesive layer is formed from a thermosetting or photo-curable adhesive.5. The resonant circuit element according to claim 2 , further comprising:a second conductive pattern made from a conductive ...

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Номер записи: 65
10-01-2019 дата публикации

Composite component-embedded circuit board and composite component

Номер: US20190014655A1
Автор: Hirokazu Yazaki, Keito Yonemori
Принадлежит: Murata Manufacturing Co Ltd

A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.

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Номер записи: 66
09-01-2020 дата публикации

Package substrate inductor having thermal interconnect structures

Номер: US20200015348A1
Автор: Anne AUGUSTINE, Huong T. Do, Michael J. Hill
Принадлежит: Intel Corp

Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.

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Номер записи: 67
03-02-2022 дата публикации

HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION

Номер: US20220037076A1
Автор: ZABACO Jorge
Принадлежит: Futurewei Technologies, Inc.

An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil. 1. A smartphone , comprising:a housing; anda wireless charging coil, the coil including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises:a first layer including a first electrically conductive trace comprising a first turn and a second turn adjacent to the first turn;a second layer including a second electrically conductive trace comprising a third turn and a fourth turn adjacent to the third turn; anda plurality of vias coupling the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed along a length of the first turn, each of the first via, the second via and the third via electrically connecting the first turn and the third turn, wherein the plurality of the vias further include a fourth via, a fifth via, and a sixth via distributed along a length of the second turn, each of the fourth via, fifth via, and sixth via electrically connecting the second turn and the fourth turn, wherein the first via, the second via , the third via, the fourth via, the fifth via, and the sixth via are distributed separately in locations other than locations of taps of the first and second trace.2. The smartphone of claim 1 , wherein the second via is neighboring to both the first via and third via claim 1 , wherein the fifth via is neighboring to both the fourth via and the sixth via claim 1 , wherein the ...

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Номер записи: 68
03-02-2022 дата публикации

COIL COMPONENT

Номер: US20220037082A1
Автор: KIM Hwi Dae, Lee Dong Hwan, LEE Dong Jin, PARK Sang Soo, YOO Hye Mi, YOON Chan
Принадлежит:

A coil component includes a body having a core, a coil portion disposed in the body and having a central portion in which the core is disposed, a first external electrode and a second external electrode, each connected to the coil portion, a third external electrode spaced apart from each of the first and second external electrodes, and a noise removal portion disposed to at least partially surround the coil portion between a surface of the body and the core and having both end portions, each connected to the third external electrode. 1. A coil component comprising:a body including a core;a coil portion disposed in the body and having a central portion in which the core is disposed;a first external electrode and a second external electrode, each connected to the coil portion;a third external electrode spaced apart from each of the first and second external electrodes; anda noise removal portion disposed to at least partially surround the coil portion and having both end portions, each connected to the third external electrode.2. The coil component of claim 1 , wherein the noise removal portion comprises a first noise removal portion and a second noise removal portion claim 1 , spaced apart from each other between the surface and the core of the body claim 1 , each disposed to at least partially surround the coil portion claim 1 , andeach of the first and second removal portions has both end portions connected to the third external electrode.3. The coil component of claim 2 , wherein the body has a first surface and a second surface claim 2 , opposing each other claim 2 , and a first side surface and a second side surface claim 2 , each connecting the first surface and the second surface to each other claim 2 , opposing each other claim 2 , andthe first and second noise removal portions are disposed to be spaced apart from each other between the first side surface and the core.4. The coil component of claim 2 , wherein the body has a first surface and a second ...

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Номер записи: 69
21-01-2016 дата публикации

Two-stage noise filter and electronic device including the same

Номер: US20160020745A1
Автор: Jin-Hyung Lee, Sung-Yong Joo
Принадлежит: SAMSUNG ELECTRONICS CO LTD

Disclosed are a two-stage noise filter, in which two filters are integrated, and an electronic device including the same. The two-stage noise filter includes a core configured to include a primary side and a secondary side opposite to the primary side; a first filter configured to include a first coil wound on the primary side of the core and a second coil wound on the secondary side of the core; a second filter configured to include a third coil wound on the primary side of the core in series with the first coil and a fourth coil wound on the secondary side of the core in series with the second coil; and an impedance balancer configured to keep a balance of impedance between the first and second filters.

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Номер записи: 70
18-01-2018 дата публикации

Passive Chip Device and Method of Making the Same

Номер: US20180019296A1
Автор: Hsiao Min-Ho, Lee Pang-Yen, Tseng Yen-Hao
Принадлежит:

A passive chip device includes a chip body, a conductive coil and a surface-mount contact unit. The chip body is in the form of a single piece, and has two opposite end faces and a first surface which is between the end faces. The conductive coil is deposited on and surrounding the chip body. The surface-mount contact unit includes two spaced apart conductive terminal contacts. Each of the terminal contacts extends from a respective one of the end faces to the first surface and connects to a respective one of end portions of the coil. The method of making the passive chip device is also disclosed. 1. A passive chip device comprising:a chip body which is in the form of a single piece, which extends in an axial direction, and which has two opposite end faces and a first surface, said end faces being opposite to each other in said axial direction, said first surface extending along said axial direction between said end faces;a conductive coil deposited on and surrounding said chip body for generating inductance, said conductive coil having two opposite end portions; anda surface-mount contact unit including two spaced apart conductive terminal contacts, each of which extends from a respective one of said end faces to said first surface, and each of which contacts a respective one of said end portions of said coil.2. The passive chip device of claim 1 , wherein said conductive terminal contacts of said surface-mount contact unit are made from a material containing Ni and a metal selected from the group consisting of Au and Sn claim 1 , said chip body being made from a magnetic material or a non-magnetic material claim 1 , said magnetic material being magnetic metal or magnetic ceramic claim 1 , said non-magnetic material being a Si-based material or non-magnetic metal.3. The passive chip device of claim 2 , further comprising an insulator layer formed on said chip body claim 2 , said chip body being made from said magnetic metal or said non-magnetic metal claim 2 , said ...

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Номер записи: 71
17-01-2019 дата публикации

Coil component

Номер: US20190019607A1
Автор: Hidehiko Oikawa, Keisuke AKAKI, Masahiro Kondo, Takashi Yanbe, Takuya ENDOU, Yuki Abe
Принадлежит: Tokin Corp

A coil component includes a coil having inner and outer circumferential surfaces, a pair of end surfaces, and a core surrounding at least a part of a periphery of the core. A cross section is where the coil component is cut by a plane, when each of coil sections is divided into eight regions by four straight lines extending along the inner circumferential surface, the outer circumferential surface and the end surfaces. In the cross section, first core members positioned at four corner regions, second core members positioned at an inner side of the inner circumferential surface and an outer side of the outer circumferential surface, and third core members, positioned at outer sides of the end surfaces form the core. At least one of the second and third core members has a magnetic permeability lower than that of the first core member in a zero magnetic field.

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Номер записи: 72
16-01-2020 дата публикации

RF DAMPING STRUCTURE IN INDUCTIVE DEVICE

Номер: US20200020474A1
Автор: Kim Daniel Daeik, KOO Bonhoon, Nejati Babak
Принадлежит:

A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge. 1. A spiral inductor comprising:a spiral trace; anda plurality of first projections extending along a first edge of the spiral trace.2. The spiral inductor of claim 1 , wherein the plurality of first projections extend horizontally from the first edge of the spiral trace.3. The spiral inductor of claim 1 , wherein each of the plurality of first projections has a rectangular shape.4. The spiral inductor of claim 1 , wherein each of the plurality of first projections extends from the first edge by a length at least equal to a spacing between adjacent first projections.5. The spiral inductor of claim 2 , further comprising a plurality of second projections extending along and horizontally from a second edge of the spiral trace claim 2 , the second edge being opposite the first edge.6. The spiral inductor of claim 5 , wherein each of the plurality of first projections and each of the plurality of second projections has a rectangular shape.7. The spiral inductor of claim 5 , wherein each of the plurality of first projections extends from the first edge by a first length at least equal to a first spacing between adjacent first projections claim 5 , and each of the plurality of second projections extends from the second edge by a second length at least equal to a second spacing between adjacent second projections.8. The spiral inductor of claim 7 , wherein the first spacing is equal to the second spacing.9. The spiral inductor of claim 7 , wherein the first length is equal to the second length.10. The spiral inductor of claim 5 , wherein the spiral trace has a first turn and a second turn claim 5 , wherein the plurality of first projections along the first turn are interlaced ...

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Номер записи: 73
26-01-2017 дата публикации

Noise filter implementation structure

Номер: US20170026018A1
Автор: Kota TAKAYAMA, Shingo UDA, Yoshihiro Imanishi
Принадлежит: Murata Manufacturing Co Ltd

A transmission line includes three wires formed on a substrate. Each of the transmission lines transmits a three-level signal. A common-mode choke coil is inserted into the transmission line. The common-mode choke coil includes three coils coupled to one another and three pairs of outer electrodes, each of the three pairs being connected to the corresponding two ends of the coils. The outer electrodes of the common-mode choke coil are connected to the transmission line such that the three coils are serially inserted into the respective three wires.

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Номер записи: 74
25-01-2018 дата публикации

Coil component and method of manufacturing coil component

Номер: US20180025831A1
Автор: Shin Hasegawa, Shinya Hirai, Tatsuya Sasaki
Принадлежит: Murata Manufacturing Co Ltd

A coil component includes: a core having an annular shape; a coil wound around the core; and an electrode terminal for mounting the coil component. The electrode terminal is connected to the coil and has a mounting surface. The coil is formed by connecting a plurality of wire members. The electrode terminal has a recessed portion indented toward a back surface on a side opposite to the mounting surface. The wire member of the coil is connected to a back surface of a bottom portion of the recessed portion.

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Номер записи: 75
25-01-2018 дата публикации

Embedded Passive Chip Device and Method of Making the Same

Номер: US20180026090A1
Автор: Hsiao Min-Ho, Lee Pang-Yen, Tseng Yen-Hao
Принадлежит:

An embedded passive chip device includes a chip body and a functional layered structure. The chip body has a circuit-forming surface that is formed with a recess. The functional layered structure is formed on the chip body and includes a conductive layer that has at least a portion which covers at least partially the circuit-forming surface, and a magnetic layer that is disposed within the recess and that is inductively coupled to the conductive layer for generating inductance. A method of making the embedded passive chip device is also disclosed. 1. An embedded passive chip device comprising:a chip body having a first circuit-forming surface that is formed with a first recess; anda first functional layered structure formed on said chip body and including a first conductive layer that has at least a portion which covers at least partially said first circuit-forming surface, and a first magnetic layer that is disposed within said first recess and that is inductively coupled to said first conductive layer for generating inductance.2. The embedded passive chip device of claim 1 , wherein said chip body is made from a Si-based material or metal.3. The embedded passive chip device of claim 3 , wherein said first conductive layer is in the form of a coil claim 3 , and is disposed around said chip body.4. The embedded passive chip device of claim 3 , wherein said first recess is defined by a recess-defining surface that contacts said magnetic layer and that has a base portion and a surrounding portion which is disposed between and interconnects said base portion and said first circuit-forming surface claim 3 , said first conductive layer having a spiral part that is formed on said base portion and that contacts and is covered by said magnetic layer claim 3 , and an extending part that extends from said spiral part and that further extends on and contacts said surrounding portion and said first circuit-forming surface.5. The embedded passive chip device of claim 4 , wherein ...

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Номер записи: 76
29-01-2015 дата публикации

High frequency component and filter component

Номер: US20150028969A1
Автор: Kunihiro Watanabe
Принадлежит: Murata Manufacturing Co Ltd

A high frequency component includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, linear conductors extending along the insulating layers, interlayer connection conductors extending through at least one of the insulating layers, and planar conductors extending along the insulating layers. The high frequency component further includes transverse coils and internal capacitors. Each of the transverse coils includes the linear conductors and the interlayer connection conductors spirally wound in a plane in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction. Each of the internal capacitors includes the planar conductors being opposed to each other such that at least one of the insulating layers is disposed therebetween, the internal capacitor being arranged within a coil opening of the transverse coil when viewed along the winding axis of the transverse coil.

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Номер записи: 77
10-02-2022 дата публикации

Common-mode choke coil

Номер: US20220044857A1
Автор: Atsuo Hirukawa, Hiroshi Ueki, Kouhei MATSUURA
Принадлежит: Murata Manufacturing Co Ltd

A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.4 mm. The respective lower-face electrode portions of the terminal electrodes each have an area of less than or equal to 0.034 μm2.

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Номер записи: 78
10-02-2022 дата публикации

COMMON-MODE CHOKE COIL

Номер: US20220044858A1
Автор: HIRUKAWA Atsuo, MATSUURA Kouhei, UEKI Hiroshi
Принадлежит: MURATA MANUFACTURING CO., LTD.

A common-mode choke coil includes a multilayer body, a first coil, and a second coil. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first coil has a path length L, the second coil has a path length L, and the sum of the path length L and the path length L is less than or equal to 3.30 mm. The first coil has a first coil conductor, and the second coil has a second coil conductor. The first coil conductor and the second coil conductor have a spacing D between each other of greater than or equal to 6 μm and less than or equal to 26 μm (i.e., from 6 μm to 26 μm) in the stacking direction of the non-conductor layers. 1. A common-mode choke coil comprising:a multilayer body including a plurality of non-conductor layers, the plurality of non-conductor layers being stacked and each made of a non-conductor, and the plurality of non-conductor layers including a first plurality of non-conductor layers and a second plurality of non-conductor layers;{'b': 1', '2', '1', '2, 'a first coil and a second coil that are incorporated in the multilayer body, the first coil having a path length L and including a first coil conductor disposed along a first interface which is an interface between the first plurality of non-conductor layers, the second coil having a path length L and including a second coil conductor disposed along a second interface which is an interface between the second plurality of non-conductor layers and different from the first interface along which the first coil conductor is disposed, a sum of the path length L and the path length L being less than or equal to 3.30 mm, and the first coil conductor and the second coil conductor having a spacing between each other of from 6 μm to 26 μm in a direction in which the plurality of non-conductor layers are stacked;'}a first terminal electrode and a second terminal electrode that are provided on an outer surface of the multilayer body, the ...

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Номер записи: 79
10-02-2022 дата публикации

COMMON-MODE CHOKE COIL

Номер: US20220044862A1
Автор: HIRUKAWA Atsuo, MATSUURA Kouhei, UEKI Hiroshi
Принадлежит: MURATA MANUFACTURING CO., LTD.

A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L the second coil has a path length L and the sum of the path length L and the path length L is less than or equal to 3.5 mm The non-conductor layers each have a relative permittivity of less than or equal to 11. 1. A common-mode choke coil comprising:a multilayer body including a plurality of non-conductor layers, the plurality of non-conductor layers being stacked and each made of a non-conductor, and the plurality of non-conductor layers including a first plurality of non-conductor layers and a second plurality of non-conductor layers, and the plurality of non-conductor layers each having a relative permittivity of less than or equal to 11;{'b': 1', '2', '1', '2, 'a first coil and a second coil that are incorporated in the multilayer body, the first coil having a path length L and including a first coil conductor disposed along a first interface which is an interface between the first plurality of non-conductor layers, the second coil having a path length L and including a second coil conductor disposed along a second interface which is an interface between the second plurality of non-conductor layers and different from the first interface along which the first coil conductor is disposed, and a sum of the path length L and the path length L being less than or equal to 3.5 mm;'}a first terminal electrode and a second terminal electrode that are provided on an outer surface of the multilayer body, the first terminal electrode being electrically connected to a first ...

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Номер записи: 80
24-01-2019 дата публикации

COIL COMPONENT

Номер: US20190027288A1
Автор: KOBAYASHI Satoshi, SATO Natsuko, TOKUNAGA Satoshi
Принадлежит:

One object is to provide a magnetic coupling coil component having an improved coupling coefficient. A coil component according to one embodiment of the present invention includes: an insulator body; and first and second coil conductors embedded in the insulator body and wound around a coil axis. A first coil surface of the first coil conductor is opposed to a second coil surface of the second coil conductor. The insulator body includes: an intermediate portion disposed between the first coil surface and the second coil surface; a core portion disposed inside the first and second coil conductors; and an outer peripheral portion disposed outside the first and second coil conductors. A magnetic permeability of the intermediate portion in a direction perpendicular to the coil axis is smaller than those of the core portion and the outer peripheral portion in a direction parallel to the coil axis. 1. A coil component , comprising:an insulator body;a first coil conductor embedded in the insulator body and wound around a coil axis; anda second coil conductor embedded in the insulator body and wound around the coil axis,wherein a first coil surface of the first coil conductor is opposed to a second coil surface of the second coil conductor, an intermediate portion disposed between the first coil surface and the second coil surface;', 'a core portion disposed inside the first coil conductor and the second coil conductor; and', 'an outer peripheral portion disposed outside the first coil conductor and the second coil conductor, and, 'the insulator body includesa magnetic permeability of the intermediate portion in a direction perpendicular to the coil axis is smaller than those of the core portion and the outer peripheral portion in a direction parallel to the coil axis.2. The coil component of claim 1 , wherein the intermediate portion is made of a non-magnetic material.3. The coil component of claim 1 , wherein the intermediate portion is made of an anisotropic magnetic ...

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Номер записи: 81
23-01-2020 дата публикации

Inductor component

Номер: US20200027637A1
Автор: Rikiya SANO, Tomonori Sakata
Принадлежит: Murata Manufacturing Co Ltd

An inductor component comprising an element body formed by laminating a plurality of insulating layers, and a helically wound coil disposed in the element body. The insulating layer contains a base material and a crystal, wherein a refractive index of each of the base material and the crystal is 1.8 or less for at least one wavelength of 350 nm or more and 450 nm or less (i.e., from 350 nm to 450 nm). The coil includes a coil wiring wound along a plane, and the coil wiring is made up of one coil conductor layer or a plurality of coil conductor layers laminated in surface contact with each other. Also, the aspect ratio of the coil conductor layer is 1.0 or more.

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Номер записи: 82
23-01-2020 дата публикации

INDUCTOR COMPONENT

Номер: US20200027638A1
Автор: HAMADA Akinori, TAGUCHI Yoshinori, YOSHIOKA Yoshimasa
Принадлежит: MURATA MANUFACTURING CO., LTD.

An inductor component comprising a magnetic layer containing a magnetic powder and a resin containing the magnetic powder, a first spiral wiring and a second spiral wiring disposed on the same plane in the magnetic layer and adjacent to each other, and an insulating layer disposed between the first spiral wiring and the second spiral wiring and containing no magnetic substance. The first spiral wiring includes a first side surface facing the second spiral wiring, and at least a portion of the first side surface is in contact with the magnetic layer. 1. An inductor component comprising:a magnetic layer containing a magnetic powder and a resin containing the magnetic powder;a first spiral wiring and a second spiral wiring disposed on the same plane in the magnetic layer and adjacent to each other; andan insulating layer disposed between the first spiral wiring and the second spiral wiring and containing no magnetic substance, whereinthe first spiral wiring includes a first side surface facing the second spiral wiring, andat least a portion of the first side surface is in contact with the magnetic layer.2. The inductor component according to claim 1 , wherein the insulating layer is disposed at a position including a region in which a distance is minimum between the first spiral wiring and the second spiral wiring.3. The inductor component according to claim 1 , whereinthe insulating layer is in contact with a portion of the first side surface, anda second side surface on the side opposite to the first side surface of the first spiral wiring is in contact with the magnetic layer.4. The inductor component according to claim 1 , wherein the magnetic layer is interposed between the insulating layer and the first side surface.5. The inductor component according to claim 1 , wherein the thickness of the insulating layer is larger than the thickness of the first spiral wiring.6. The inductor component according to claim 1 , further comprisinga plurality of external terminals ...

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Номер записи: 83
23-01-2020 дата публикации

Coil Component

Номер: US20200027650A1
Автор: Jae Hun Kim, Joung Gul Ryu
Принадлежит: Samsung Electro Mechanics Co Ltd

A coil component includes a body including a coil and an external electrode disposed on an external surface of the body to be connected to the coil. The body includes a support member, disposed to support the coil, having a via hole spaced apart from a through-hole. The coil includes a coil body and a coil lead-out portion disposed to connect the coil body and the external electrode to each other. A first support layer is disposed between one surface of the support member and one surface of the coil lead-out portion, and a second support layer is disposed on the first support layer.

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Номер записи: 84
23-01-2020 дата публикации

Magnetic coupling coil element and method of manufacturing the same

Номер: US20200027653A1
Автор: Atsuko KASAHARA, Naoya Terauchi, Natsuko Sato, Takayuki Arai
Принадлежит: TAIYO YUDEN CO LTD

A magnetic coupling coil element in one embodiment includes a magnetic base body that includes an intermediate magnetic layer, a first magnetic layer disposed over the intermediate magnetic layer, and a second magnetic layer disposed under the intermediate magnetic layer; a first coil conductor provided in the first magnetic layer; and a second coil conductor provided in the second magnetic layer. The intermediate magnetic layer has a saturation magnetic flux density lower than saturation magnetic flux densities of the first magnetic layer and the second magnetic layer in a first region that overlaps with the first coil conductor and the second coil conductor in plan view.

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Номер записи: 85
23-01-2020 дата публикации

INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT

Номер: US20200027789A1
Автор: Huang Shih-Han, Kao Min-Feng, LIN Hsing-Chih, Liu Jen-Cheng, Wang Ching-Chun, Yaung Dun-Nian
Принадлежит:

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first plurality of conductive interconnect layers arranged within a first inter-level dielectric (ILD) structure disposed on a first surface of a first substrate. A second plurality of conductive interconnect layers are arranged within a second ILD structure disposed on a first surface of a second substrate. The second substrate is separated from the first substrate by the first ILD structure. The first plurality of conductive interconnect layers and the second plurality of conductive interconnect layers define an inductor having one or more turns. 1. An integrated chip , comprising:a first plurality of conductive interconnect layers arranged within a first inter-level dielectric (ILD) structure disposed on a first surface of a first substrate;a second plurality of conductive interconnect layers arranged within a second ILD structure disposed on a first surface of a second substrate, the second substrate separated from the first substrate by the first ILD structure; andwherein the first plurality of conductive interconnect layers and the second plurality of conductive interconnect layers define an inductor having one or more turns.2. The integrated chip of claim 1 ,wherein the first plurality of conductive interconnect layers defining the inductor comprise a first via having a top surface that is narrower than a bottom surface; andwherein the second plurality of conductive interconnect layers defining the inductor comprise a second via having a top surface that is wider than a bottom surface.3. The integrated chip of claim 1 , wherein the inductor wraps around an axis that is oriented in parallel to the first surface of the first substrate.4. The integrated chip of claim 1 , wherein the second substrate is separated from the first substrate by the second ILD structure.5. The integrated chip of claim 1 , further comprising:a passivation layer disposed along a ...

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Номер записи: 86
23-01-2020 дата публикации

INDUCTOR STRUCTURE FOR INTEGRATED CIRCUIT

Номер: US20200027790A1
Автор: Huang Shih-Han, Kao Min-Feng, LIN Hsing-Chih, Liu Jen-Cheng, Wang Ching-Chun, Yaung Dun-Nian
Принадлежит:

The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a first conductive wire within a first dielectric structure formed on a first surface of a first substrate. A through-substrate-via (TSV) is formed to extend though the first substrate. A second conductive wire is formed within a second dielectric structure formed on a second surface of the first substrate opposing the first surface. The TSV electrically couples the first conductive wire and the second conductive wire. The first conductive wire, the second conductive wire, and the TSV define an inductor that wraps around an axis. 1. A method of forming an integrated chip , comprising:forming a first conductive wire within a first dielectric structure formed on a first surface of a first substrate;forming a through-substrate-via (TSV) extending though the first substrate;forming a second conductive wire within a second dielectric structure formed on a second surface of the first substrate opposing the first surface, wherein the TSV electrically couples the first conductive wire and the second conductive wire; andwherein the first conductive wire, the second conductive wire, and the TSV define an inductor that wraps around an axis.2. The method of claim 1 , further comprising:forming a third conductive wire within a third dielectric structure on a first surface of a second substrate; andbonding the first substrate to the second substrate.3. The method of claim 2 , wherein the first substrate is bonded to the second substrate along an interface between the first dielectric structure and the third dielectric structure.4. The method of claim 2 , further comprising:thinning the first substrate after bonding the first substrate to the second substrate and prior to forming the TSV.5. The method of claim 4 , further comprising:forming the second conductive wire after thinning the first substrate.6. The method of claim 4 , wherein the first ...

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Номер записи: 87
28-01-2021 дата публикации

Coil electronic component

Номер: US20210027926A1
Автор: Hyung Jin Jeon, Seon Woo OH, Soon Kwang Kwon
Принадлежит: Samsung Electro Mechanics Co Ltd

A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

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Номер записи: 88
28-01-2021 дата публикации

Inductor component

Номер: US20210027937A1
Автор: Kenta Kondo, Rikiya SANO, Yoshiyuki Oota
Принадлежит: Murata Manufacturing Co Ltd

An inductor component includes an element assembly formed of an insulator material and an inner electrode arranged in the element assembly. The insulator material contains a base material formed of an amorphous material containing B, Si, O, and K and a crystalline filler and includes a filler-poor glass portion in a region along the inner electrode. The content of the crystalline filler in the filler-poor glass portion is lower than the content of the crystalline filler in the element assembly excluding the filler-poor glass portion.

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Номер записи: 89
23-01-2020 дата публикации

NOVEL INDUCTOR CIRCUIT AND WIRELESS COMMUNICATION DEVICES

Номер: US20200028536A1
Автор: Liu Wen-Shun
Принадлежит:

An inductor circuit includes first inductive circuit, second inductive circuit, and third inductive circuit. First inductive circuit at receiver side has a first end coupled to a first port of an antenna and a second end coupled to an input port of a receiving circuit. Second inductive circuit at transmitter side has a first end and a second end respectively coupled to output ports of a power amplifier. Third inductive circuit at antenna side has a first end coupled to a first port of the antenna and having a second end. Second inductive circuit and the third inductive circuit are disposed on an outer ring to form a ring shape and the third inductive circuit is disposed on an inner ring within the outer ring to form a spiral shape. Third inductive circuit is disposed between the second inductive circuit and the first inductive circuit. 1. An inductor circuit , comprising:a first inductive circuit at a receiver side, having a first end coupled to a first port of an antenna and a second end coupled to an input port of a receiving circuit;a second inductive circuit at a transmitter side, having a first end and a second end respectively coupled to output ports of a power amplifier; anda third inductive circuit at an antenna side, having a first end coupled to a first port of the antenna and having a second end;wherein the second inductive circuit and the third inductive circuit are disposed on an outer ring to form a ring shape and the third inductive circuit is disposed on an inner ring within the outer ring to form a spiral shape; and, the third inductive circuit is disposed between the second inductive circuit and the first inductive circuit.2. The inductor circuit of claim 1 , wherein the inductor circuit includes at least a top layer and a bottom layer.3. The inductor circuit of claim 2 , wherein each of the second conductive circuit and the third conductive circuit comprises an inner wire and an outer wire claim 2 , and wherein the inner wire and the outer wire ...

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Номер записи: 90
31-01-2019 дата публикации

REDUCTION OF ENDOSCOPE HIGH FREQUENCY LEAKAGE CURRENT USING A COMMON-MODE CHOKE

Номер: US20190029499A1
Автор: Blair Bryan E., Petersen Alan W., Polonsky Andrey
Принадлежит: INTUITIVE SURGICAL OPERATIONS, INC.

An endoscope includes a body and a circuit board mounted within the body. A cable couples the circuit board to an imaging system. A common-mode choke is mounted within the body and is configured to electrically isolate the cable from the body at cautery frequencies. A method includes twisting a plurality of wires together to form a twisted set of wires. The twisted set of wires is wound around a core so that windings do not overlap, and so that a first winding and a last winding are separated from each other. Wires in the twisted set of wires are coupled to a plurality of wires in the cable. Also, these wires in the twisted set of wires are also coupled to the circuit board. 1. An imaging apparatus comprising:a cable, an imaging system, and an endoscope;the cable being configured to be connected to the imaging system and to the endoscope;the cable including a first plurality of wires; and a body;', 'a circuit board mounted within the body; and', 'a common-mode choke mounted in the body, the common-mode choke being coupled to the first plurality of wires and being coupled to the circuit board., 'the endoscope being configured to be connected to the cable, the endoscope comprising2. The apparatus of claim 1 , the cable further comprising a shield claim 1 , the first plurality of wires being enclosed in the shield claim 1 , the shield being connected to the common-mode choke and being electrically isolated from the body by the common-mode choke.3. The apparatus of claim 1 , the common-mode choke having a first winding and a last winding claim 1 , the first winding not overlapping with and separated from the last winding.4. The apparatus of claim 1 , the common-mode choke having a plurality of non-overlapping windings.5. The apparatus of claim 4 , the plurality of non-overlapping windings including a first winding and a last winding claim 4 , the first winding not overlapping with and separated from the last winding.6. The apparatus of claim 1 , the common-mode choke ...

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Номер записи: 91
28-01-2021 дата публикации

COMMON MODE NOISE FILTER

Номер: US20210028752A1
Автор: ISHIDA NARIAKI, KAWASHIMA TAKUJI, TANAKA Hideki
Принадлежит:

The present disclosure provides a common mode noise filter that can improve attenuation characteristics of common mode noise over a wide frequency range. The common mode noise filter of the present disclosure includes: two magnetic sections and each of which is made of a magnetic material; and non-magnetic section disposed between magnetic sections in a stacking direction, non-magnetic section being made of a non-magnetic material. Moreover, the common mode noise filter further includes two coils and metal layer. Coils are disposed inside non-magnetic section while facing each other. Metal layer is formed inside at least one of two magnetic sections while being connected to the ground. Metal layers are positioned closer to a lower surface of magnetic section than an upper surface of magnetic section and closer to an upper surface of magnetic section than a lower surface of magnetic section. 1. A common mode noise filter comprising:two magnetic sections, each of the two magnetic sections having a layer containing a magnetic material;a non-magnetic section having a layer containing a non-magnetic material;two coils disposed inside the non-magnetic section; anda metal layer disposed inside at least one of the two magnetic sections, the metal layer being grounded,whereinthe non-magnetic section is disposed between the two magnetic sections in a stacking direction of stacking the two magnetic sections and the non-magnetic section,each of the two coils includes a central section and a conductive wire wound in a plane around the central section,the plane of each of the two coils is disposed along a layer containing the non-magnetic material,the two coils face each other,each of the two magnetic sections has an interface to the non-magnetic section and a surface opposite to the interface in the stacking direction, andthe metal layer is disposed closer to the surface opposite to the interface than the interface.2. The common mode noise filter according to claim 1 , whereina ...

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Номер записи: 92
01-02-2018 дата публикации

COIL SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Номер: US20180033549A1
Автор: TANIGUCHI Hirotaka
Принадлежит: IBIDEN CO. , LTD.

A coil substrate includes insulating layers, and conductive layers laminated on the insulating layers in a plate thickness direction of the insulating layers, respectively. The conductive layers include three or more conductive layers and a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on the opposite end side in the plate thickness direction and that the set of conductive layers includes coil portions each having a spiral form respectively and aligned in the plate thickness direction. 1. A coil substrate , comprising:a plurality of insulating layers; anda plurality of conductive layers laminated on the insulating layers in a plate thickness direction of the plurality of insulating layers, respectively,wherein the plurality of conductive layers comprises at least three conductive layers and includes a set of conductive layers such that the set of conductive layers includes a first outermost conductive layer on one end side in the plate thickness direction and does not include a second outermost conductive layer on an opposite end side in the plate thickness direction and that the set of conductive layers includes a plurality of coil portions each having a spiral form respectively and aligned in the plate thickness direction.2. A coil substrate according to claim 1 , wherein the plurality of conductive layers is formed such that the plurality of conductive layers does not have a conductive layer interposed between the set of conductive layers.3. A coil substrate according to claim 1 , wherein the plurality of insulating layers includes a core substrate claim 1 , a plurality of first interlayer insulating layers formed on a first surface of the core substrate claim 1 , and a plurality of second interlayer insulating layers formed on a second surface of the core substrate claim 1 , and the plurality of ...

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Номер записи: 93
01-02-2018 дата публикации

Coil component and method for manufacturing same

Номер: US20180033550A1
Автор: Ju Hwan Yang, Seok Il Hong, Young Seuck Yoo
Принадлежит: Samsung Electro Mechanics Co Ltd

A coil component includes an insulating layer and a coil pattern provided inside the insulating layer. A lower surface and a side surface of the coil pattern form an acute angle, in a longitudinal cross section of the coil pattern. In particular, a side surface of the coil pattern includes a foot part located in a lower portion of the side surface and an upper part located above the foot part in the side surface, and an angle between the lower surface and the upper part of the side surface of the coil pattern is larger than the acute angle between the lower surface and the foot part of the side surface of the coil pattern. A method of manufacturing the coil component is also provided.

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Номер записи: 94
01-02-2018 дата публикации

Method for manufacturing electronic component with coil

Номер: US20180033551A1
Автор: Douglas James Malcolm, Shinichi Sakamoto
Принадлежит: Sumida Corp

A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm 2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

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Номер записи: 95
30-01-2020 дата публикации

LAMINATED MAGNETIC INDUCTOR STACK WITH HIGH FREQUENCY PEAK QUALITY FACTOR

Номер: US20200032383A1
Автор: "OSullivan Eugene J.", Deligianni Hariklia, Doris Bruce B., Wang Naigang
Принадлежит:

Embodiments are directed to a method of forming a magnetic stack arrangement of a laminated magnetic inductor having a high frequency peak quality factor (Q). A first magnetic stack is formed having one or more magnetic layers alternating with one or more insulating layers in a first inner region of a laminated magnetic inductor. A second magnetic stack is formed opposite a surface of the first magnetic stack in an outer region of the laminated magnetic inductor. A third magnetic stack is formed opposite a surface of the second magnetic stack in a second inner region of the laminated magnetic inductor. The insulating layers are formed such that a thickness of an insulating layer in the second magnetic stack is greater than a thickness of an insulating layer in the first magnetic stack. 1. A laminated magnetic inductor comprising:a first inner region comprising one or more magnetic layers alternating with one or more insulating layers;an outer region comprising one or more magnetic layers alternating with one or more insulating layers, the outer region formed opposite a surface of the first inner region; anda second inner region comprising one or more magnetic layers alternating with one or more insulating layers, the second inner region formed opposite a surface of the outer region.2. The laminated magnetic inductor of claim 1 , wherein a thickness of an insulating layer in the outer region is greater than a thickness of an insulating layer in either the first or second inner regions.3. The laminated magnetic inductor of claim 2 , further comprising:a substrate;a first dielectric layer positioned between the substrate and the first inner region;a second dielectric layer formed opposite a surface of the second inner region; anda conductive coil helically wrapping through portions of the first and second dielectric layers.4. The laminated magnetic inductor of claim 2 , wherein the one or more insulating layers in the first inner region each comprise a thickness of ...

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Номер записи: 96
01-02-2018 дата публикации

Multilayer filter

Номер: US20180034436A1
Автор: Hiroshi Masuda, Rumiko YUASA
Принадлежит: Murata Manufacturing Co Ltd

A multilayer filter includes dielectric layers, a first terminal, a second terminal, a first inductor, a second inductor, and first to fifth capacitors. In a stacking direction of the dielectric layers, at least one of a first air-core portion defined by the first inductor and a second air-core portion defined by the second inductor includes, in a region from the first inductor layer to the second inductor layer, a region enabling magnetic flux to pass therethrough without being obstructed by the first to fifth capacitors and the third inductor.

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Номер записи: 97
17-02-2022 дата публикации

ELECTRONIC COMPONENT

Номер: US20220051843A1
Автор: HAN Ji Hye, KANG Byung Woo, Koo Bon Seok, Koo Kun Hoi
Принадлежит: SAMSUNG ELECTRO-MECHANICS CO., LTD.

An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode. 1. An electronic component comprising:an internal electrode;an external electrode connected to the internal electrode; anda connection layer disposed between the internal electrode and the external electrode,wherein the external electrode includes a conductive layer having a porous structure, and a resin filled in voids in the porous structure,wherein the conductive layer contains an Ag—Sn based alloy, so that the external electrode has a continuous network structure including intermetallic compounds, andwherein the connection layer includes an intermetallic compound, and the intermetallic compound of the connection layer and the intermetallic compound of the external electrode are in direct contact with each other.2. The electronic component of claim 1 , wherein the Ag—Sn based alloy is AgSn.3. The electronic component of claim 1 , wherein the conductive layer forms a continuous network structure extending from an internal side to an external side of the external electrode.4. The electronic component of claim 1 , wherein the resin is a thermosetting resin.5. The electronic component of claim 1 , wherein the connection layer is formed of a Cu—Sn compound.6. The electronic component of claim 5 , wherein the connection layer is a double layer including a first connection layer adjacent to the external electrode and a second connection layer adjacent to the internal electrode.7. The electronic component of claim 6 , wherein the first connection layer is formed of a CuSnalloy.8. The electronic component of claim 6 , wherein the second connection layer is formed of a CuSn alloy.9. The ...

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Номер записи: 98
17-02-2022 дата публикации

ELECTRONIC COMPONENT

Номер: US20220051844A1
Автор: SHIMODA Yuta, Yamauchi Mitsuru
Принадлежит: MURATA MANUFACTURING CO., LTD.

An electronic component includes an element body including two end surfaces opposite to each other and a bottom surface connected between the two end surfaces. A coil is provided in the element body and an external electrode is provided in the element body. In a first cross-section intersecting with the two end surfaces and the bottom surface of the element body, the external electrode has a first portion extending along a first surface that is one of the end surface and the bottom surface of the element body. The coil is disposed such that an outer circumferential edge of the coil faces the first surface of the element body. A shortest distance between the outer circumferential edge of the coil and the first surface of the element body is smaller than a minimum width of the first portion in a direction orthogonal to the first surface. 1. An electronic component comprising:an element body including a first end surface and a second end surface opposite to each other and a bottom surface connecting to the first end surface and the second end surface;a coil provided in the element body; anda first external electrode and a second external electrode provided in the element body and electrically connected to the coil,wherein the coil includes coil conductor layers that are electrically connected to each other along a lamination direction,wherein in a first cross-section intersecting with the first end surface, the second end surface, and the bottom surface of the element body:the first external electrode has a first portion extending along the bottom surface of the element body and a second portion extending along the first end surface of the element body, the first portion of the first external electrode and the second portion of the first external electrode being embedded in the element body,the second external electrode has a first portion extending along the bottom surface of the element body and a second portion extending along the second end surface of the element ...

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Номер записи: 99
31-01-2019 дата публикации

Inductor and method of manufacturing the same

Номер: US20190035533A1
Автор: Yong Sam LEE
Принадлежит: Samsung Electro Mechanics Co Ltd

An inductor includes a body including an insulating portion formed of a plurality of layers and a magnetic portion surrounding the insulating portion and external electrodes disposed on external surfaces of the body, and a method of manufacturing the same. A coil portion is embedded in the insulating portion, and has a structure in which coil patterns formed on a plurality of layers are stacked while being connected to each other.

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Номер записи: 100