УЛУЧШЕННЫЕ ГИДРОФИЛЬНЫЕ КОМПОЗИЦИИ

Настоящее изобретение относится к способу образования сшитого электронно-активного гидрофильного сополимера, смеси сомономеров и суперконденсатору. Указанный способ включает стадии: a. смешивание электронно-активного по своей природе материала и по меньшей мере одного соединения формулы (I) с водой для образования промежуточной смеси;b. добавление по меньшей мере одного гидрофильного мономера, по меньшей мере одного гидрофобного мономера и по меньшей мере одного сшивающего агента к промежуточной смеси для образования смеси сомономеров; c. полимеризация смеси сомономеров. Соединение формулы (I) представляет собой соединение, в котором R1и R2представляют собой независимо необязательно замещенный С1-С6алкил, где заместитель выбран из одного или более гидроксила, галогена, NH2, NO2, СН3О, CO2H, СОООН, NR, NRR', NHCOR и RSH, где R и R' представляют собой С1-С6алкил, X-представляет собой анион. Электронно-активный по своей природе материал выбран из полиэтилендиокситиофен:полистиролсульфоната ...

Verfahren fuer das Aufbringen einer Metallelektrode auf einen keramischen Stoff mit hoher Dielektrizitaetskonstante

Mehrschichtiger Keramikkondensator und Verfahren zum Herstellen eines mehrschichtigen Keramikkondensators

Es werden ein mehrschichtiger Keramikkondensator mit einer ausreichenden Lebensdauer bei hoher Temperaturbelastung sowie ein Verfahren zum Herstellen eines mehrschichtigen Keramikkondensators, durch das der mehrschichtige Keramikkondensator zuverlässig hergestellt werden kann, vorgesehen. Der mehrschichtige Keramikkondensator umfasst eine Innenelektrode, die mindestens eine Art von Metall A gewählt aus der Gruppe bestehend aus In, Ga, Zn, Bi und Pb und in Ni aufgelöst, um eine feste Lösung zu bilden, enthält. Die Innenelektrode weist in einer grenzflächennahen Region, die sich bei einer Tiefe von 2 nm von einer Oberfläche der Innenelektrode befindet, die einer entsprechenden dielektrischen Keramikschicht zugewandt ist, ein Verhältnis von A von 1,4 Atomprozent oder mehr zu einer Gesamtmenge von A und Ni auf. Eine Beziehung zwischen einem Wert X von Atomprozent, der das Verhältnis von A in der grenzflächennahen Region darstellt, und einem Wert Y von Atomprozent, der das Verhältnis von A in ...

Monolithic ceramic electronic component comprises a laminate consisting of ceramic layers obtained by sintering a ceramic raw material powder, and inner electrodes arranged between the ceramic layers and obtained by sintering a metal powder

Monolithic ceramic electronic component comprises a laminate consisting of a number of ceramic layers obtained by sintering a ceramic raw material powder, and a number of inner electrodes arranged between the ceramic layers and obtained by sintering a metal powder. The ceramic layer has a thickness of 3 mu m or less and contains ceramic grains having a particle diameter of more than 0.5 mu m. The particle diameter of the ceramic grains in the thickness direction of the ceramic layers is less than the thickness of each of the ceramic layers. Each of the inner electrodes has a thickness of 0.2-0.7 mu m.

EDELMETALLHALTIGE PULVER

NICKELPULVER ZUR VERWENDUNG ALS ELEKTRODEN IN KERAMISCHEN MEHRSCHICHT-GRUNDMETALLELKTRODEN-KONDENSATOREN

nehr feines Nickelpulver

VERFAHREN UND ZUSAMMENSETZUNG ZUM METALLISIEREN EINES TITANAT KERAMIKKOERPERS

NODULAR SILVER POWDER AND PROCESS FOR PREPARING SILVER POWDER

Method for manufacturing paste for electroconductive thick film

There is disclosed a method for manufacturing a paste for electroconductive thick film using a solid component, a diluting solvent, a dispersant, an organic resin component, and a main solvent, wherein the boiling point of the diluting solvent is lower than that of the main solvent by 100{C or more, and the diluting solvent is compatible with the organic resin component and the main solvent, the method comprising a first dispersion step for obtaining a first slurry by subjecting to a dispersion treatment, a first mill base prepared through mixing the solid component, the diluting solvent and the dispersant, a second dispersion step for obtaining a second slurry by subjecting to a dispersion treatment, a second mill base prepared through mixing the first slurry with the organic resin component and the main solvent, and a step for removing the diluting solvent from the second slurry.

Method for manufacturing paste for electroconductive thick film,paste for electroconductive thick film and laminated ceramic electronic part

COMPOSITIONS AND CERAMIC ARTICLES COMPRISTING THEM

Metalizing Compositions

... 1,187,360. Powder metallurgy. E.I. DU PONT DE NEMOURS & CO. March 28, 1968 [March 28, 1967; Feb.14, 1968], No.15048/68. Heading C7D. [Also in Divisions C1 and H1] A metallizing composition for screen-printing on ceramic dielectric comprises an inert vehicle having dispersed therein a powdered alloy consisting of at least three metals selected from Ru, Rh, Os, Ir, Pt, Pd, Ag, Au and Hg, each metal being present in an amount within the range 0À5 to 99% by weight. The inert vehicle, comprising 10 to 90% by weight of the composition, may be water, higher alcohol acetates or propionates, pine oil, -or # terpineol, solutions of lower alcohol polymethylmethacrylates or ethyl cellulose or the monobutyl ether of ethylene glycol mono-acetate, and may include waxes or thermoplastic resins. The composition may further comprise 1 to 95% by weight of total solids of an inorganic binder, e.g. a glass frit consisting of e.g. lead borate, lead silicate, lead borosilicate, cadmium borate, lead-cadmium borosilicate ...

Conductive paste and multilayer ceramic capacitor

NICKEL RHENIUM ALLOY POWDER AND THE NICKEL RHENIUM ALLOY POWDER CONTAINING CONDUCTING COMPOSITION

NICKEL POWDER FOR USE AS ELECTRODES IN CERAMIC MEHRSCHICHT GRUNDMETALLELKTRODEN CONDENSERS

NICKEL POWDER AND CONDUCTIVE PASTE

NOBLE-METALLIFEROUS RESINATE PASTE FOR THE PRODUCTION OF CERAMIC MULTILAYER CAPACITORS

Advanced Dielectric Energy Storage Device and Method of Fabrication

A Dense Energy Ultra Cell (DEUC), a dielectric energy storage device and methods of fabrication therefor are provided. A DEUC element is fabricated using print technologies that deposit dielectric energy storage layers (406) and insulating layers (404) together being interleaved between electrode layers (403). The dielectric energy storage layers are created from a proprietary solution to enable printing of dielectric energy storage layers with high permittivity and a high internal resistivity to retain charge. The insulating layers (404) can be applied within the dielectric energy storage layers (406) bifurcating the dielectric energy storage layers for increased resistivity. As part of the fabrication process, the material deposition printer can apply multiple print heads each with different inks and materials (1301, 1302) to form composite material (1303) in the printed layers. ELECTRODE TOP LAYER DIELECTRIC 402 ENERGY STORAGE 406 eI 4051 405b ELECTRODE 407 ELECTRODE COLLECTOR BOTTOM ...

AG/PD ELECTRODING POWDER AND METHOD FOR MAKING

Ag/Pd ELECTRODING POWDER AND METHOD FOR MAKING Pure silver and palladium powders were thoroughly mixed and dispersed by ball milling in a solution of a surfactant in a liquid vehicle. After drying and granulating, the resulting powder was heated to 500.degree.C, thereby first forming an Ag/Pd alloy powder and then causing palladium to precipitate from the interior of the alloy particles, so as to form a protective barrier of PdO on the alloy particle surfaces and to alter the alloy to 90Ag/l0Pd. This powder, when used to make a buried electrode in a ceramic capacitor, changes dimensions very little during the early stage of sintering of the ceramic up to 500.degree.C, below which temperature the ceramic is weakest and most subject to cleaving.

THICK FILM CONDUCTOR COMPOSITIONS

TITLE THICK FILM CONDUCTOR COMPOSITIONS Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.

MULTILAYER CERAMIC CAPACITOR AND METHOD OF TERMINATING

MULTILAYER CERAMIC CAPACITOR

MULTI-LAYER CERAMIC POLYMER CAPACITOR

A method of capacitor construction using ceramic powder with a polymer binding agent, in a multi-layered structure. Each layer has an electrode formed on a dielectric layer, which is then assembled such that each electrode layer has at least one dielectric layer separating an adjacent electrode. During manufacture the ceramic polymer dielectric is supported by a carrier layer forming part of the capacitor structure and often supporting the electrodes of the capacitor. The dielectric is composed of a principal ingredient, a fine dielectric powder and a second ingredient that acts as a binding agent. The construction is highly modified to that of a polymer film capacitor through the addition of high K ceramic polymer layers.

NICKEL-RHENIUM ALLOY POWDER AND CONDUCTOR PASTE CONTAINING THE SAME

This invention provides a nickel-rhenium alloy powder suitable particular ly for the formation of an internal electrode layer for a stacked ceramic el ectronic component. The nickel-rhenium alloy powder is characterized by comp rising nickel as a main component and further comprising 0.1 to 10% by weigh t of rhenium and 50 to 10,000 ppm, in terms of silicon atom, of silicon. The powder, optionally together with other additive(s), is homogeneously mixed and dispersed in an organic vehicle to prepare a conductor paste. The use of the nickel-rhenium alloy powder particularly for the formation of an intern al electrode for a stacked ceramic electronic component is advantageous in t hat, even in a very fine powder, the start and progress of sintering in a si ntering step are slow, and, thus, the sintering shrink behavior of the elect rode layer can be rendered similar to the sintering shrink behavior of the c eramic layer. Further, spheroidizing of the electrode attributable to oversi ntering ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

Multilayer ceramic capacitor

Multilayer ceramic electronic component

Carbon coated metal powder, containing carbon coated metal powder of the conductive paste and using the same laminated electronic component

Conductive slurry and laminated ceramic electronic element

CAPACITOR WITH COPPER CONTAINING ELECTRODE

Process of assembly of thin ceramics sections

PROCESS FOR MAKING CERAMIC CAPACITORS

Compositions of metallization

잉크젯용 잉크, 인쇄방법 및 세라믹 전자부품

... 잉크젯 인쇄 가능한 점도 특성, 안정 인쇄할 수 있는 침강 억제 특성, 인쇄 후에 번지기 어려운 특성과 같은 3가지 특성 모두를 만족하는 잉크젯용 잉크를 제공한다. 예를 들면 적층 세라믹 콘덴서(1)의 내부전극(4, 5)을 잉크젯 인쇄에 의해 형성할 때에 적합하게 사용될 수 있는 잉크이며, BET 환산 입경 50~1000㎚인 기능성 입자와, BET 환산 입경 4~40㎚인 리올로지 조정용 입자와, 유기 비이클을 포함하고, 전단 속도 1000s-1에서의 점도가 1~50mPa·s이면서, 전단 속도 0.1s-1에서의 점도가, 식: η=(D)2×ρ/104/2+80[단, η는 전단 속도 0.1s-1에서의 점도(mPa·s), D는 기능성 입자의 BET 환산 입경(㎚), ρ는 기능성 입자의 비중]에 의해 산출되는 점도η 이상이다.

PROCESS FOR PREPARING METAL POWDER

LAMINATED CERAMIC CONDENSER AND A MANUFACTURING METHOD THEREOF FOR PRODUCING A PLURALITY OF LAMINATED CERAMIC CONDENSERS BY PRINTING A STRIPPED INNER ELECTRODE PATTERN

PURPOSE: A laminated ceramic condenser and a manufacturing method thereof are provided to obtain the connectivity of patterns since an inner electrode pattern is formed to cover a dielectric layer when the inner electrode pattern of a thin film and a ceramic green sheet are laminated. CONSTITUTION: A plurality of dielectric layers is laminated on a main body. First and second outer electrodes are respectively formed on a first side surface and a third side surface. A first internal electrode pattern(30A) maintains a predetermined interval from the third side surface. A second internal electrode pattern(30B) maintains a predetermined interval from the first side surface. First and second side part are formed on the second side surface and a fourth side surface which face each other by respectively spraying ceramic slurry. COPYRIGHT KIPO 2012 ...

A META POWDER HAVING A VITREOUS THIN LAYER ON THE SURFACE THREROF AND METHOD OF PRODUCING IT, AND CONDUCTOR PASTE COMPRISING SAID POWDER, AND CERAMIC ELECTRONIC COMPONENT AND A MULTILAYER CERAMIC SUBTRATE COMPRISING SAID A CONDUCTOR LAYER

복합 산화물 피복 금속 분말, 그 제조 방법, 복합 산화물 피복 금속 분말을 사용한 도전성 페이스트, 및 적층 세라믹 전자 부품

... 매우 균일하게 복합 산화물로 피복된 복합 산화물 피복 금속 분말을 제조하는 방법을 제공한다. 본 발명에 따른 제조 방법은, 수계 용매하에서 수용성인 금속 화합물의 가수분해 반응에 의해 금속 분말을 금속 산화물로 피복하는 제1공정과, 금속 산화물을 복합 산화물화하는 제2공정을 포함한다. 제1공정에서는, 적어도 물을 포함하는 용매에 분산시킨 금속 분말을 포함하는 슬러리에, 상기 용매에 용해되는 4가 금속 원소를 포함하는 수용성인 금속 화합물을 첨가하고, 4가 금속 원소를 포함하는 금속 산화물을 석출시킴으로써, 금속 분말의 표면 중 적어도 일부에 금속 산화물이 피복된 금속 산화물 피복 금속 분말의 슬러리를 얻는다. 제2공정에서는, 금속 산화물 피복 금속 분말의 슬러리에, 적어도 1종의 2가 원소를 포함하는 용액 또는 분말을 첨가하고, 금속 산화물 피복 금속 분말에서의 금속 분말의 표면에 존재하는 금속 산화물과 2가 원소를 반응시켜, 복합 산화물 피복 금속 분말을 얻는다.

CONDUCTIVE POWDER AND CAPACITOR FOR INTERNAL ELECTRODE

An embodiment of the present invention provides conductive powder for an internal electrode, which includes: metal particles; and a graphene layer having a positive charge or an oxide graphene layer having a negative charge which is arranged on at least a part of a surface of the metal particle, wherein the metal particles and the graphene layer form a core-shell structure. Tg/D is equal to or less than 0.1 when D is a diameter of the metal particle, and Tg is a thickness of the graphene layer. Accordingly, the shrinkage is delayed in a calcination step during a manufacturing process of the capacitor. COPYRIGHT KIPO 2018 ...

DIELECTRIC PASTE FOR SPACER LAYER OF MULTILAYER CERAMIC ELECTRONIC COMPONENT

Disclosed is a dielectric paste for spacer layers of multilayer ceramic electronic components which does not dissolve a binder contained in a layer adjoining to a spacer layer in a multilayer ceramic electronic component and thus is capable of effectively preventing occurrence of defects in the multilayer ceramic electronic component. The dielectric paste for spacer layers contains a butyral resin as a binder, and also contains at least one solvent selected from the group consisting of dihydroterpinyl oxyethanol, terpinyl oxyethanol, d-dihydrocarveol, I- citroneol, I-perillyl alcohol and acetoxy-methoxyethoxy-cyclohexanol acetate. © KIPO & WIPO 2007 ...

Multilayer Ceramic Capacitor

In a multilayer ceramic capacitor, when a cross-section obtained by cutting a multilayer body at a position at a central portion in a length direction and defined in a width direction and a layering direction is viewed, a variation in distance in the width direction from a straight line that connects ends of two internal electrodes located outermost in the layering direction to each other to respective ends of internal electrodes is not larger than about 0.2, a first ridgeline portion connecting the straight line that connects the ends of the two internal electrodes to each other to one main surface of the multilayer body has a first curve, a second ridgeline portion that connects one main surface to one side surface of the multilayer body has a second curve, and the first curve is larger in radius of curvature than the second curve.

Thick-film dielectric and conductive compositions

Dielectric powder and thick-film paste compositions are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. Conductive powder and paste compositions are formed having desirable electrical and physical properties. The dielectric powder and thick-film paste compositions can be used in combination with the conductive powder and paste compositions to form capacitors and other fired-on-foil passive circuit components.

Method for producing a liquid dispersion substantially containing submicron sized metal particles

A continuous method for generating substantially submicron sized metal particles in a liquid dispersion of known viscosity. Metal carbonyl gas and an inert carrier gas, with an optional dilutant gas, are introduced into a heated liquid bath wherein the metal carbonyl decomposes into submicron sized pure metal particles. The particles are suspended in the liquid. The liquid is processed to form slurries and pastes.

CERAMIC LAMINATED DEVICE AND METHOD FOR MANUFACTURING SAME

A ceramic laminated device is composed of a dielectric ceramic and an Ag electrode. In the dielectric ceramic which can be sintered at a low temperature and has a high specific permittivity and a high Q value, reaction of the ceramic to Ag is suppressed low at the time of being sintered, and furthermore, a filter having a high Q value and a low loss is stably obtained by controlling segregation of a specific element in the vicinity of an electrode. In a ceramic laminated body composed of at least a ceramic and a glass containing Si, a ratio A/B of a Si element concentration (A), which is a concentration within a range at a distance of 5μm or less from the Ag electrode, to a Si element concentration (B), which is a concentration within a range at a distance of more than 5μm from the Ag electrode, is 2 or less.

BASE METAL ELECTRODE MULTILAYER CAPACITOR WITH LOCALIZED OXIDIZING SOURCE

A ceramic capacitor is disclosed. The capacitor comprises a plurality of base metal inner electrode layers, a plurality of ceramic dielectric layers between the inner electrode layers, and external electrodes in electrical conductivity with the inner electrode layers. At least one secondary component having an intentionally added chemistry is dispersed in the inner electrode layers and/or the dielectric layers. The chemistry evolves an oxidizing species in a controlled manner, such that it offsets localized highly reducing atmospheres that are present when the capacitor is fired in a reducing atmosphere, thereby promoting enhanced electrode connectivity in thin layer base metal multilayer capacitors.

PROCESS OF MANUFACTURING A MULTI-LAYER DEVICE AND DEVICE MANUFACTURED THEREBY

A process for forming a multilayer ceramic capacitor. The process includes depositing a ceramic precursor on a substrate and an electrode ink in a predetermined pattern on the ceramic precursor to form a green sheet. The electrode ink has an adhesion promoter incorporated therein. The green sheet is overlayed with at least one second green sheet to form a layered green sheet which is then fused under pressure.

CONDUCTIVE PASTE FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING MULTILAYER UNIT FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT

Disclosed are a conductive paste for multilayer ceramic electronic components and a method for producing a multilayer unit. Specifically disclosed is a conductive paste with good printability which is prepared to include a binder containing an ethyl cellulose having a weight-average molecular weight (MWL) and another ethyl cellulose having a weight-average molecular weight (MWH) at a weight ratio of X:(1 - X) (in this connection, MWL, MWHand X satisfy X * MWL + (1 - X) * MWH = 145,000-215,000), and at least one solvent selected from the group consisting of isobornyl acetate, dihydroterpinyl methyl ether, terpinyl methyl ether, α-terpinyl acetate, I-dihydrocarvyl acetate, I-menthone, I-menthyl acetate, I-perillyl acetate and I-carvyl acetate.

METAL POWDER

La présente invention concerne une poudre de métal capable d'empêcher le délaminage dans la mesure ou cette poudre confère, d'une part un excellent comportement de frittage pendant le processus de production d'un condensateur céramique monolithique, et d'autre part un excellent pouvoir dispersant pendant la formation d'une colle électroconductrice. Cette poudre de métal s'obtient en mettant un chlorure de métal gazeux en contact avec un gaz réducteur dans une zone où la température se prête aux réactions de réduction, puis en utilisant un tensioactif non ionique pour effectuer un traitement de surface par voie humide ou sèche, jusqu'à obtenir la poudre de métal finale.

STACKED-TYPE COMPONENT AND METHOD FOR THE MANUFACTURE OF SAME

Method for the manufacture of a stacked-type capacitor and/or resistance consisting of alternating dielectric layers and conducting layers. The dielectric layers are deposited by polymerization of the elements derived from the dissociation, by remote nitrogen plasma, of an organo-siliceous or organo-germanium gas. The conducting layers are formed simultaneously by the deposition of a conducting polymer derived from the dissociation, by remote nitrogen plasma, of hydrogen sulphide or sulphur dichloride. The dielectric and conducting layers are deposited on a dielectric substrate placed on the surface of a rotating drum, the rotation being such that the same portion of dielectric substrate is successively opposite at least one dielectric deposition device and at least one conducting polymer deposition device, each dielectric or conducting deposition being preceded by masking of the areas where no layer is to be deposited.

Method of forming an electronic component using ink

The present invention relates to an ink for electronic component used in various electronic appliances such as laminate ceramic capacitor, LC filter, and complex high frequency component, a manufacturing method of electronic component by using this ink for electronic component, and an ink jet device, and is intended to present an ink for electronic component capable of re-dissolving and baking a ceramic green sheet, a manufacturing method of electronic component by using this ink for electronic component, and an ink jet device. To achieve this object, by manufacturing an electronic component by an ink jet method using an ink for electronic component comprising water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 mum or more to 10 mum or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less, the invention presents an ink for electronic ...

MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

A monolithic ceramic electronic component having outer electrodes that include an inorganic substance containing at least Si, a crystal phase C containing at least Si, Ti, and Ba at the interfaces to a ceramic layer in peripheral end portions of the outer electrodes. A value of the crystal phase area ratio indicating the relationship between the area of the crystal phase C and the area of a glass phase G, which are formed at the interface to the ceramic layer, in a region within 5 μm from the peripheral end portion of the outer electrode is within a range of 75% to 98%.

Process for manufacture of ceramic capacitors using ink jet printing

A process for forming a multilayer ceramic device. The device includes forming a ceramic precursor layer followed by ink jet printing in alternating order an electrode precursor in a predetermined pattern on the ceramic precursor layer to form an electrode and a ceramic ink on the electrode. The ceramic precursor is then sintered.

AEROSOL METHOD AND APPARATUS, PARTICULATE PRODUCTS, AND ELECTRONIC DEVICES MADE THEREFROM

Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator (106) including a plurality of ultrasonic transducers (120) underlying and ultrasonically energizing a reservoir of liquid feed (102) which forms droplets of the aerosol. Carrier gas (104) is delivered to different portions of the reservoir by a plurality of gas delivery ports (136) delivering gas from a gas delivery system. The aerosol is pyrolyzed to form particles, which are then cooled and collected. The invention also provides powders made by the method and devices made using the powders.

ELECTRICAL DEVICE HAVING OHMIC OR LOW LOSS CONTACTS

Paste for forming internal electrode in a ceramic element

The present invention provides a paste for forming an internal electrode in a ceramic element. The paste causes no sudden heat generation from an organic vehicle contained therein during a degreasing step and allows Pd or Ag/Pd serving as an internal electrode to expand freely as a result of oxidation during a firing step, to thereby prevent structural defects of the ceramics such as delamination, when used for the formation of internal electrodes in a ceramic element such as a laminated ceramic capacitor. The paste contains a metal powder of Pd or Ag/Pd, Pd resinate, Cr resinate and an organic vehicle. Preferably, the Pd resinate contains sulfur in the molecule. Also preferably, the paste contains the Pd resinate in an amount of about 2.0-3.0 parts by weight as Pd, based on 100 parts by weight of Pd in the metal powder, and the Cr resinate in an amount of about 0.03-0.12 parts by weight as Cr2O3, based on 100 parts by weight of the metal powder.

Manufacturing process of conductive composition and a manufacturing process of conductive paste

A manufacturing method of conductive paste comprising arranging process (S20 to S23) of ceramics particles, arranging process (S10 to S14) of wetted metal particles, forming process (S30) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S32) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S12) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S18) of adding surfactant, a process (S14) of separating water from the metal particles and a process (S15) of adding acetone or the other second solvent.

CONDUCTIVE PASTE FOR INTERNAL ELECTRODES, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND METHOD OF MANUFACTURING THE SAME

There are provided a conductive paste for internal electrodes, a multilayer ceramic electronic component including the same, and a method of manufacturing the same. The conductive paste for internal electrodes including: a nickel (Ni) powder; a nickel oxide (NiO) powder having a content of 5.0 to 15.0 parts by weight based on 100 parts by weight of the nickel powder; and an organic vehicle.

Laminated ceramic electronic component

A laminated ceramic electronic component having excellent mechanical characteristics and internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, and low defective rate includes a laminate having a plurality of laminated ceramic layers and a plurality of Al/Cu alloy-containing internal electrodes at specific interfaces between ceramic layers; where the Al/Cu ratio of the Al/Cu alloy is 80/20 or more.

ELECTRICALLY CONDUCTIVE PASTE

The present invention provides an electrically conductive paste including inorganic components and organic components. The inorganic components include an electrically conductive powder and a dielectric powder. The organic components include a dispersing agent and a vehicle. The dispersing agent includes a dispersing agent having an acid value. When the total acid value of the organic components per unit mass of the electrically conductive paste is taken as X (mg KOH) and the total specific surface area of the inorganic components per unit mass of the electrically conductive paste is taken as Y (m2), the X and the Y satisfy the following formula: 5.0×10−2≤(X/Y)≤6.0×10−1.

Conductive Pattern Incorporated in a Multilayered Substance, Multilayered Substance Incorporating a Conductive Pattern, and a Method of Fabricating a Multilayered Substrate

The present invention provides a conductive pattern that has low electric resistivity, is superior in adhesion to a substrate and does not cause substrate cracking during plating, a multilayered substrate incorporating such a conductive pattern, and a fabricating method for a multilayered substrate. At first, a conductive composition including a metal powder containing not less than 95 mass % of Ag, a sintering restrainer containing Cr and/or Cr compound, a dielectric loss conditioner containing Mn and/or Mn compound, and a vehicle is prepared. Next, electrodes made of the conductive composition are formed on a plurality of green sheets. The plurality of green sheets formed with the electrodes are then laminated to form a laminated product, whereafter the laminated product is sintered.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a body including a dielectric layer, first and second internal electrodes, a stacked portion including first and second surfaces opposing each other in a stacking direction of the first and second internal electrodes, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first and second surfaces, connected to the third and fourth surfaces, and opposing each other, and a coating layer disposed on the first to sixth surfaces of the stacked portion and having first and second connection portions; and first and second external electrodes connected to the first and second internal electrodes, respectively, and arranged on the third and fourth surfaces of the body, wherein the first and second internal electrodes are respectively connected to the first and second external electrodes through the first and second connection portions.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic electronic component includes a ceramic body, including dielectric layers and internal electrodes, and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes. Each of the internal electrodes includes a nickel-cobalt (Ni—Co) alloy, and a content of the cobalt (Co) is 0.01 at % to 10 at % based on 100 at % of the nickel (Ni).

Electrode additives including compositions and structures formed using the same

The present invention is directed to electrode additives, electrode compositions including the additives, capacitor structures formed using the electrode compositions, and methods of forming the electrode additives, the electrode compositions and the capacitor structures. For example, the electrode composition may be used to form electrode layers in electronic devices, such as multi-layer ceramic capacitors (MLCCs). The electrode composition is particularly well-suited for use with MLCCs that have base metal (e.g., nickel) electrodes.

MULTI-ELEMENT ALLOY POWDER CONTAINING SILVER AND AT LEAST TWO NON-SILVER CONTAINING ELEMENTS

METHOD FOR MANUFACTURING HIGH PERFORMANCE MULTI LAYER CERAMIC CAPACITORS

METHOD FOR PRODUCING METAL POWDER

Method of manufacturing laminated ceramic capacitor

AEROSOL METHOD AND APPARATUS, PARTICULATE PRODUCTS, AND ELECTRONIC DEVICES MADE THEREFROM

NICKEL POWDER AND PRODUCTION THEREOF

PROBLEM TO BE SOLVED: To restrain sintering of nickel powder in low temp. and to obtain a conductive film having high electric conductivity even in the case of being thin film thickness by forming a composite oxide layer containing lantanium and nickel on at least a part of the surface of nickel powder. SOLUTION: As the composite oxide, material having a structure such as LaNiO3, La2NiO4 is given. The sintering of the nickel powder having this composite oxide on the surface is restrained at the low temp. range and the sintering is delayed to near starting temp. of the sintering of ceramic according to the oxide quantity and the excess sintering is prevented. Therefore, the rising of resistance or disconnection of conductor, the increase of film thickness, the delamination, etc., caused by discrepancy of shrinkage at the time of simultaneously sintering of the conductive layer and the ceramic layer, are prevented and the thin nickel conductor having good electric conductivity and stickines ...

УЛУЧШЕННЫЕ ГИДРОФИЛЬНЫЕ КОМПОЗИЦИИ

Beschichtetes Metallpulver und Verfahren seiner Herstellung durch Zersetzung

Keramikmaterial und elektronische Vorrichtung

Ein Keramikmaterial hat eine Perowskitstruktur und wird durch die Formel (1 – x)ABO3 – xYZO3 dargestellt. In der Formel ist „x” eine reelle Zahl die größer als 0 und kleiner als 1 ist, sowohl „A”, „B”, „Y” als auch „Z” sind eines oder mehrere ausgewählt aus einer Gruppe von Metallionen M außer einem Pb-Ion und Alkalimetallionen, wobei „A” bivalent ist, „B” tetravalent ist, „Y” trivalent oder eine Kombination von trivalenten Metallionen ist und „Z” bivalente und/oder trivalente Metallionen oder bivalente und/oder pentavalente Metallionen ist.

KERAMIKKOERPER MIT EINER METALLISIERTEN SCHICHT

SILVER COMPOSITIONS

... 1309601 Fired silver coatings EI DU PONT DE NEMOURS & CO 21 July 1970 35360/70 Headings C7D and C7F [Also in Division H1] A capacitor is made by coating a reduced titanate ceramic substrate with a mixture of Ag powder and bismuth resinate in an inert vehicle and firing the coating. The coating mixture preferably contains by weight 40-75% Ag of particle size 0À01-10Á1-30% bismuth resinate and 10-70% inert vehicle. The mixture may septionally contain 0À01-10% of a glass frit containing 25-50% PbO, 50-75% Bi 2 O 3 and 1-10% B 2 O 3 ...

Metalizing Compositions

... 1,152,502. Coating with glass-metal mixtures. E. I. DU FONT DE NEMOURS & CO. 31 May, 1967 [31 May, 1966], No. 25193/67. Heading C1M. [Also in Division C7] A metallizing composition used in producing a fired coating on a ceramic comprises by weight (a) 60-95% of at least one of Ag, Pd, Pt, Au powders; (b) 4-35% of an inorganic binder powder; (c) at least 0À1% of at least one Rh, Ir, Ru, Cu, Si, SiC, BN as powders with a particle size of 0À05 to 44 microns with at least 80% in the range 0À05 to 5 microns. Components (a) and (b) have a particle size of 0À1 to 10 microns and the composition preferably contains 0À1-7% of component (c). The inorganic binder component (b) may be a glass frit such as lead borate, lead borosilicate, lead bismuth borosilicate, lead fluoborate, cadmium borate and alkali metal cadmium borate and borosilicate types, e.g. sodium cadmium borosilicate containing 63À1% CdO, 7À3% Na 2 O, 16À9% B 2 O 3 , 12À7% SiO 2 . The metallizing composition is dispersed in an organic ...

NICKEL VERBUNDPULVER AND PROCEDURE OF ITS PRODUCTION

ELECTRICAL MULTILAYER ELEMENT AND PROCEDURE FOR ITS PRODUCTION

NICKEL POWDER AND PRODUCTION METHOD THEREFOR

... ²²²² A nickel powder exhibits superior oxidation behavior, reduction behavior ²and sintering behavior in a production process for a multilayer ceramic ²capacitor ²and is suitable for the capacitor; a production method therefor is also ²provided. ²The nickel powder, which may be used as a raw material, is treated with a ²sulfur-containing compound, and the sulfur-containing compound is coated on ²the surface thereof, or alternatively, a nickel-sulfur compound layer is ²formed on ²the surface thereof.² ...

CAPACITOR METALLIZATIONS

FAILURE RESISTANT CERAMIC POLYMER CAPACITOR

A failure resistant capacitor, using ceramic polymer as the dielectric in a capacitor structure. The capacitor is made using at least one failure resistant electrode forming one polarity of electrode in capacitor. The dielectric layers separating the electrodes are composed at least partly of a high K ceramic material with a polymer binding agent. Each layer of the capacitor has an electrode on one side of a dielectric layer, which is then assembled such that there is at least one alternating failure resistant electrode with at least one dielectric layer separating an adjacent opposite polarity electrode. The failure resistant electrode is designed to be capable of disconnecting a defect in the dielectric layer from the rest of the capacitor structure. Alternately, the capacitor may be constructed with an electrode structure that limits the energy discharged through a defect in the dielectric layer to an amount predefined by the electrode construction. The dielectric layer is composed of ...

THICK FILM CONDUCTOR COMPOSITIONS

NICKEL-RHENIUM ALLOY POWDER AND CONDUCTOR PASTE CONTAINING THE SAME

A nickel-rhenium alloy powder comprising nickel as a main component, 0.1 to 10% by weight of rhenium, and having an average particle size of 0.05 to 1.0 µm is provided. The nickel-rhenium alloy powder has a surface oxide film containing a nickel oxide and a rhenium oxide, and the amount of oxygen in the surface oxide film is 0.1 to 3.0% by weight relative to the total weight of the powder. The nickel-rhenium alloy powder is suitable, in particular, for forming internal electrode layers of a multilayer ceramic electronic component. The obtained powder is homogeneously mixed and dispersed in an organic vehicle, together with other additives as needed, to prepare a conductor paste. The surface oxide film allows bringing the sintering shrinkage behavior of electrode layers and ceramic layers closer to each other when the nickel-rhenium alloy powder is used, in particular, for forming internal electrodes of a multilayer ceramic electronic component. Moreover, there occurs no electrode spheroidizing ...

NICKEL ULTRAFINE POWDER

A nickel ultrafine powder which is characterized by having an average particle diameter of 0.2 to 0.6 .mu.m and containing coarse particles whose particle diameter is larger than 2.5 times the average particle diameter in an amount less than 0.1% in terms of number-size distribution. It is produced from nickel chloride vapor by reduction with hydrogen in the gas phase. It gives thin internal electrodes (which contributes to high capacity) with only a few short circuits across them.

METAL NICKEL POWDER

A metal nickel powder which can deliver an excellent sintering behavior during a monolithic ceramic capacitor production process and displays an excellent dispersibility when a conductive paste is formed to thereby prevent delamination; specifically, a metal nickel powder which contains 0.1 to 2.0 wt.% of oxygen, has not absorption peak in a 3600 to 3700 cm-1 wave number region of infrared absorption spectra and is generated by bringing a nickel chloride gas into contact with a reducing gas in a reducing reaction temperature region.

AEROSOL METHOD AND APPARATUS, PARTICULATE PRODUCTS, AND ELECTRONIC DEVICES MADE THEREFROM

Provided is an aerosol method, and accompanying apparatus, for preparing powdered products of a variety of materials involving the use of an ultrasonic aerosol generator (106) including a plurality of ultrasonic transducers (120) underlying and ultrasonically energizing a reservoir of liquid feed (102) which forms droplets of the aerosol. Carrier gas (104) is delivered to different portions of the reservoir by a plurality of gas delivery ports (136) delivering gas from a gas delivery system. The aerosol is pyrolyzed to form particles, which are then cooled and collected. The invention also provides powders made by the method and devices made using the powders.

Multi-layer ceramic capacitor and method of producing a multi-layer ceramic capacitor

Electronic assembly

Nickel powder and process for preparing same

表面处理的超细金属粉末及其制法、该粉末的导电金属膏和利用该膏的多层陶瓷电容器

... 本发明改进了用作多层陶瓷电容器内电极的超细金属粉末的防氧化性能，并且抑制形成金属内电极膜时熔融金属在表面张力下的球化所致的金属内电极膜厚度的增加。该超细金属粉末颗粒的表面上存在不少于一种元素的含硫化合物，所述元素选自Y、Zr和La组成的组中。通过使超细金属粉末分散于浆液中的超细金属粉末纯化步骤、将含有Y、Zr和La中不少于一种元素的硫酸盐水溶液加入浆液中以在金属颗粒的表面上形成化合物的表面处理步骤、过滤步骤以及干燥步骤制造了超细金属粉末。 ...

Ceramic dielectric material matched with nickel inner electrode and production method of capacitor produced by ceramic dielectric material

Electric condensers and compositions being used for their manufacture

Compositions in paste containing noble metals

Manufactoring process of component of the piled up type

L'invention concerne la fabrication de condensateur et/ou de résistance de type empilé(e) constitué(e) d'une alternance de couches diélectriques et de couches conductrices. Les couches diélectriques sont déposées par polymérisation d'éléments issus de la dissociation par plasma différé d'azote d'un gaz organo-silicé ou organo-germané et les couches conductrices sont réalisées simultanément par dépôt de polymère conducteur issu de la dissociation par plasma différé d'azote d'hydrogène sulfureux ou de dichlorure de soufre. Les dépôts diélectriques et conducteurs sont effectués sur un substrat diélectrique placé à la surface d'un tambour en rotation, la rotation s'effectuant de façon qu'une même portion du substrat diélectrique se trouve successivement en regard d'au moins un dispositif de dépôt de diélectrique et d'au moins un dispositif de dépôt de polymère conducteur, chaque dépôt de diélectrique ou de conducteur étant précédé d'un masquage des zones où ledit dépôt n'est pas autorisé.

CONDENSATEUR MONOLITHIQUE EN CERAMIQUE

L'invention concerne un condensateur en céramique monolithique à plusieurs couches, comprenant des couches de diélectrique en céramique et des couches d'électrodes disposées alternativement. Les couches d'électrodes sont fabriquées en un mélange de poudres de métal, en général d'un métal précieux, et d'un matériau céramique ayant la même composition chimique que le matériau avec lequel sont réalisées les couches diélectriques, la quantité, en poids, de la poudre de matériau céramique dans ce mélange étant comprise entre 10 et 35 % et la grandeur des grains de cette poudre, exprimée par le diamètre substitutif, ne dépassant pas 2 mu m. Application à l'optimalisation des paramètres électriques des condensateurs monolithiques.

적층 세라믹 전자부품

... 세라믹 소체의 측면에 대한 외부전극의 랩 어라운드부의 선단 영역과 세라믹 소체의 표면을 구성하는 세라믹의 계면이 도금액에 침식되기 어렵고, 신뢰성이 높은 적층 세라믹 전자부품을 제공한다. 외부전극의 랩 어라운드부의 선단 영역과 세라믹 소체의 표면을 구성하는 세라믹의 계면에, SiO2를 26㏖% 이상 45㏖% 미만 함유하면서, (TiO2+ZrO2)/(SiO2+TiO2+ZrO2)로 표시되는 몰비의 값이 0.154 이상인 무기 물질이 존재하거나, 또는 SiO2를 45㏖% 이상 함유하면서, (TiO2+ZrO2)/(SiO2+TiO2+ZrO2)로 표시되는 몰비의 값이 0.022 이상인 무기 물질이 존재하는 바와 같은 구성으로 한다. 또한 무기 물질에, B2O3을 SiO2와의 몰비가 0.25≤B2O3/SiO2≤0.5의 범위가 되도록 함유시킨다.

적층 세라믹 콘덴서

... 구조 결함이 없고, 내부전극이 유전체 세라믹층을 피복하고 있는 비율인 내부전극의 커버리지의 저하가 적은, 신뢰성이 높은 적층 세라믹 콘덴서를 제공한다. 복수의 유전체 세라믹층과, 유전체 세라믹층을 통해서 적층된 복수의 내부전극을 가지는 세라믹 적층체를 포함한 적층 세라믹 콘덴서에 있어서, 유전체 세라믹층(11)은, Ba와 Ti을 가지는 페로브스카이트형 화합물을 포함하고, 내부전극(12)은, (a) Ni를 주성분으로 하고, (b) 내부전극에 매몰하는 것과 같은 모양으로 내부전극 안에 점재하는, Ba와 Ti을 가지는 페로브스카이트형 화합물을 포함하는 편석물(20a)을 2% 이상의 비율로 함유하고, (c) 내부전극을 한쪽 주면측으로부터 다른 쪽 주면측에 관통하는, Ba와 Ti을 가지는 페로브스카이트형 화합물을 포함하는 기둥 형상의 편석물(20b)을 5% 이하의 비율로 함유하거나 또는 함유하지 않는 구성으로 한다. 또한, 내부전극의 평균 두께를 0.4㎛ 이하로 한다.

Multilayer Ceramic Capacitor

Conductor paste for rapid firing

The present invention provides a conductor paste for rapid firing that is applied to a ceramic green sheet and is fired along with the green sheet under high-rate temperature rise conditions at a high heating rate of at least 600° C./hr from room temperature to the maximum firing temperature. The paste includes as a conductor-forming powder material: a conductive metallic powder comprising, as a main component, nickel powder; and barium titanate ceramic powder with a mean particle diameter of 10 nm to 80 nm as an additive. The ceramic powder content is 5 to 25 mass parts per 100 mass parts of the conductive metallic powder.

Silver powder and method for producing same

After a reducing agent is added to a water reaction system containing silver ions to deposit silver particles by reduction, the silver particles are dried to obtain a silver powder which is heat-treated at a temperature of higher than 100° C., and lower than 400° C. The silver powder thus heat-treated has a maximum coefficient of thermal expansion of not greater than 1.5% at a temperature of 50° C. to 800° C., and has no heating peak when the silver powder is heated from 50° C. to 800° C. The silver powder has an ignition loss of not greater than 1.0% when the silver powder is ignited until the weight of the silver powder is constant at 800° C. The silver powder has a tap density of not less than 2 g/cm 3 and a BET specific surface area of not greater than 5 m 2 /g.

Inner electrode, and multilayered ceramic capacitor comprising the inner electrode

Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.

Metal powder, method for preparing the same, and multilayered ceramic capacitor including inner electrode made of metal powder

A metal powder including a graphene layer irregularly formed on a surface of the metal powder, a method for preparing the same, and a multilayered ceramic capacitor including an inner electrode using the metal powder. By using the metal powder having the graphene irregularly formed on the surface thereof as the inner electrode material of the multilayered ceramic capacitor, and allowing the necking phenomenon to occur on only the surface where the graphene is not formed, the necking of the metal powder is delayed and the shrinkage of the inner electrode is controlled, so that reduction of the thickness of the inner electrode and disconnection/crack can be prevented.

Nanostructured dielectric materials for high energy density multilayer ceramic capacitors

A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially titanium dioxide dielectric layer has an average grain size of between about 200 and about 400 nanometers, wherein each respective substantially titanium dioxide dielectric layer has maximum particle size of less than about 500 nanometers. Typically, each respective substantially titanium dioxide dielectric layer further includes at least one dopant selected from the group including P, V, Nb, Ta, Mo, W, and combinations thereof, and the included dopant is typically present in amounts of less than about 0.01 atomic percent.

Dielectric composition and ceramic electronic component including the same

There is provided a dielectric composition including: a base powder; a first accessory component including a content (x) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 5.0 at % of an oxide or a carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a donor element; and a fourth accessory component including a sintering aid.

METHOD OF MANUFACTURING THIN FILM CAPACITOR AND THIN FILM CAPACITOR

A method of manufacturing a thin film capacitor, having: a base electrode; dielectric layers consecutively deposited on the base electrode; an internal electrode deposited between the dielectric layers; an upper electrode deposited opposite the base electrode with the dielectric layers and the internal electrode being interposed therebetween; and a cover layer deposited on the upper electrode, has depositing an upper electrode layer which is to be the upper electrode, and a cover film which is to be the cover layer on the unsintered dielectric film which is to be the dielectric layer, to fabricate a lamination component, and sintering the lamination component. 1. A thin film capacitor , having a base electrode , a dielectric layer deposited on the base electrode , an upper electrode deposited opposite the base electrode with the dielectric layer being interposed therebetween , and a cover layer deposited on the upper electrode ,wherein the thin film capacitor is formed by sintering a lamination component; andwherein the lamination component is formed by depositing an upper electrode layer which is to be the upper electrode and a cover film which is to be the cover layer on a sintered dielectric film which is to be the dielectric layer.2. The thin film capacitor according to claim 1 , wherein the cover layer comprises material of the same composition as the dielectric layer.3. The thin film capacitor according to claim 1 , further comprising a terminal electrode claim 1 , which is provided after patterning the sintered lamination component. This is a Division of application Ser. No. 12/731,398 filed Mar. 25, 2010. The disclosure of the prior application is hereby incorporated by reference herein in its entirety.1. Field of the InventionThis invention relates to a method of manufacturing a thin film capacitor, and to a thin film capacitor.2. Related Background ArtThin film capacitors are for example placed in electrical circuits which operate at high speeds, and are ...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer. 1. An electronic component , comprising:a ceramic sintered body having a plurality of internal electrodes formed therein; andexternal electrodes formed on an outer surface of the ceramic sintered body,wherein each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.2. The electronic component of claim 1 , wherein the alloy layer includes nickel (Ni).3. The electronic component of claim 1 , wherein the plating layer includes bismuth (Bi).4. A manufacturing method of an electronic component claim 1 , the manufacturing method comprising:preparing a ceramic sintered body;forming at least one electrode layer on an outer surface of the ceramic sintered body;forming an alloy layer by a primary dipping process of dipping the electrode layer in a first molten solder; andforming a plating layer by a secondary dipping process of dipping the alloy layer in a second molten solder.5. The manufacturing method of claim 4 , wherein the electrode layer is formed of copper (Cu).6. The manufacturing method of claim 4 , wherein the first molten solder is formed of a composition including nickel (Ni) claim 4 , copper (Cu) claim 4 , and tin (Sn).7. The manufacturing method of claim 6 , wherein the alloy layer is formed of a copper (Cu)-tin (Sn) alloy including nickel (Ni).8. ...

Electronic component

In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.

Multilayered ceramic component

Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is within 30% of an average particle size of the metal powders. According to the first exemplary embodiment of the present invention, the particle size and the added amount of common material squeezed out from the internal electrode layer at the time of firing at a high temperature are controlled, thereby making it possible to improve the connectivity of the internal electrode.

Ceramic electronic component

In a ceramic electronic component, a section of a first extraction section located closer to a first end surface defines a first thick section. The first thick section is at least about 1.5 times as thick as a first central section of a first opposed section in a direction. The length of the first thick section is within the range of about ¼ to about ¾ of a distance from a tip of a second opposed section closer to the first end surface, to the first end surface in the direction.

CARBON-COATED METAL POWDER, CONDUCTIVE PASTE CONTAINING CARBON-COATED METAL POWDER AND MULTILAYER ELECTRONIC COMPONENT USING SAME, AND METHOD FOR MANUFACTURING CARBON-COATED METAL POWDER

This invention aims at providing a carbon-coated metal powder having few impurities, a narrower particle size distribution, and sintering properties particularly suitable as a conductive powder of a conductive paste for forming internal conductors in a ceramic multilayer electronic component obtained by co-firing multilayered ceramic sheets and internal conductor layers; a conductive paste containing the carbon-coated metal powder; a multilayer electronic component using the conductive paste; and a method for manufacturing the carbon-coated metal powder. The carbon-coated metal powder has specific properties in TMA or ESCA measurements. The carbon-coated metal powder can be obtained by melting and vaporizing a metallic raw material in a reaction vessel, conveying the generated metal vapor into a cooling tube and rapidly cooling the metal vapor by endothermically decomposing a carbon source supplied into the cooling tube, and forming a carbon coating film on metal nuclei surfaces in parallel with generation of the metal nuclei. 2. The carbon-coated metal powder according to claim 1 , wherein when the temperature width of 200° C. giving the Xis taken as not less than T° C. to not more than (T+200)° C. claim 1 , T° C.>400° C.3. The carbon-coated metal powder according to claim 1 , wherein X′ represented by X′ (%)=(X′/X)×100 is 30 or less claim 1 , when X′is a maximum shrinkage percentage in a range of from a room temperature to 400° C.4. The carbon-coated metal powder according to claim 1 , wherein the metal powder includes at least one of nickel and copper.5. A carbon-coated metal powder comprising a nickel-based powder consisting essentially of nickel only or comprising nickel as a main component claim 1 , and a carbon coating film that covers the nickel-based powder claim 1 , wherein{'sup': '2', 'an oxygen content in a weight proportion of an oxygen component to the carbon-coated metal powder of a unit weight is 1500 ppm or less per specific surface area of 1 m/g of ...

Electronic component

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers laminated alternately on each other, and external electrode layers on both end surfaces of the multilayer body in a length direction orthogonal or substantially orthogonal to a lamination direction, and each connected to the internal electrode layers. The dielectric layers each include at least one of Ca, Zr, or Ti, the internal electrode layers each include Cu, and the external electrode layers each include a sintered electrode layer in which dielectric particles including at least one of Ca, Zr, or Ti are included in a metal including Ni, and at least one of a Cu-plated layer, a Ni-plated layer, and a Sn-plated layer on an outer side of the sintered electrode layer.

Dielectric ceramic composition and multilayer ceramic capacitor containing the same

A dielectric ceramic composition and a multilayer ceramic capacitor containing the same are provided. The dielectric ceramic composition contains a base material powder represented by (1−x)BaTiO 3 −xPbTiO 3 containing a first main ingredient represented by BaTiO 3 and a second main ingredient represented by PbTiO 3 , wherein x satisfies 0.0025≦x≦0.4. The multilayer ceramic capacitor includes a ceramic body in which dielectric layers containing the dielectric ceramic composition are alternately stacked with first and second internal electrodes, and first and second external electrodes formed on both end portions of the ceramic body and respectively electrically connected to the first and second internal electrodes.

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, and a content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region.

Composite electronic component and board having the same

A composite electronic component includes a multilayer ceramic capacitor including a ceramic body in which dielectric layers and internal electrodes are alternately disposed, and first and second external electrodes disposed on a lower surface of the ceramic body; a tantalum capacitor including a body portion containing a sintered material of a tantalum powder and a tantalum wire having a portion embedded in the body portion, and disposed on the multilayer ceramic capacitor; and an encapsulant part enclosing the tantalum capacitor and the multilayer ceramic capacitor, wherein the internal electrodes are led to the lower surface of the ceramic body.

Mlcc module and method of manufacturing the same

A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.

CAPACITOR COMPONENT

A capacitor component includes a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element, and an external electrode disposed on the body to be connected to the internal electrode. The internal electrode includes an alloy region and an alloying element region. 1. A capacitor component comprising:a body including a dielectric layer and an internal electrode, the internal electrode including nickel and an alloying element; andan external electrode disposed on the body to be connected to the internal electrode,wherein the internal electrode includes an alloy region and an alloying element region.2. The capacitor component of claim 1 , wherein the alloy region includes an alloy of nickel and the alloying element.3. The capacitor component of claim 1 , wherein the alloying element region is a region in which the alloying element is used as a main ingredient.4. The capacitor component of claim 1 , wherein the alloying element is a period 3 element claim 1 , a period 4 element claim 1 , or one or more of group 4 to 11 elements on the periodic table of elements.5. The capacitor component of claim 1 , wherein the alloying element includes at least one of silicon (Si) claim 1 , aluminum (Al) claim 1 , magnesium (Mg) claim 1 , iron (Fe) claim 1 , phosphorus (P) claim 1 , tin (Sn) claim 1 , zinc (Zn) claim 1 , dysprosium (Dy) claim 1 , copper (Cu) claim 1 , or alloys thereof.6. The capacitor component of claim 1 , wherein the alloying element includes two or more of silicon (Si) claim 1 , aluminum (Al) claim 1 , magnesium (Mg) claim 1 , iron (Fe) claim 1 , phosphorus (P) claim 1 , tin (Sn) claim 1 , zinc (Zn) claim 1 , dysprosium (Dy) claim 1 , copper (Cu) claim 1 , or alloys thereof.7. The capacitor component of claim 1 , wherein the alloying element region satisfies an area fraction of 5% to 60% relative to the entire internal electrode.8. The capacitor component of claim 1 , wherein a weight of the alloying ...

PASSIVE ELECTRONICS COMPONENTS COMPRISING COATED NANOPARTICLES AND METHODS FOR PRODUCING AND USING THE SAME

The present invention provides various passive electronic components comprising a layer of coated nanoparticles, and methods for producing and using the same. Some of the passive electronic components of the invention include, but are not limited to conductors, resistors, capacitors, piezoelectronic devices, inductors and transformers. 129.-. (canceled)30. A passive electronics component comprising an electrode layer of electric conducting nanoparticles that are coated with a thin film of oxidation-resistant material , wherein said thin film of oxidation-resistant material prevents oxidation of said nanoparticles , and wherein a function of said electrode layer is substantially the same to a similar electrode layer of electric conducting nanoparticles in the absence of said thin film of oxidation-resistant material.31. The passive electronics component of claim 30 , wherein said thin film of oxidation-resistant material provides no significant additional resistivity to said nanoparticles.32. The passive electronics component of claim 30 , wherein said thin film of oxidation-resistant material does not significantly affect the sintering of said nanoparticles.33. The passive electronics component of claim 30 , wherein said thin film of oxidation-resistant material comprises a thin film of wide bandgap material.34. The passive electronics component of claim 33 , wherein said thin film of wide bandgap material comprises a thin film of a material selected from the group consisting of aluminum oxide claim 33 , hafnium oxide claim 33 , zirconium oxide claim 33 , silicon oxide claim 33 , boron oxide claim 33 , aluminum nitride claim 33 , gallium nitride claim 33 , boron nitride claim 33 , silicon carbide claim 33 , boron carbide claim 33 , or a combination thereof.35. The passive electronics component of claim 33 , wherein the thickness of said thin film of wide bandgap material is 5.5 nm or less.36. The passive electronics component of claim 30 , wherein said thin film of ...

Energy storage devices having coated passive components

The present invention provides various passive electronic components comprising a layer of coated particles, and methods for producing and using the same. Some of the passive electronic components of the invention include, but are not limited to conductors, resistors, current collectors, capacitors, piezoelectronic devices, inductors and transformers. The present invention also provides energy storage devices and electrode layers for such energy storage devices having passive, electrically-conductive particles coated with one or more thin film materials.

Electronic Component Structures with Reduced Microphonic Noise

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

COMPOSITE OXIDE-COATED METAL POWDER, PRODUCTION METHOD THEREFOR, CONDUCTIVE PASTE USING COMPOSITE OXIDE-COATED METAL POWDER, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT

A method for producing a composite oxide-coated metal powder that includes a first step of coating a metal powder with a metal oxide by a hydrolysis reaction of a water-soluble metal compound in an aqueous solvent, and a second step of turning the metal oxide into a composite oxide. In the first step, the water-soluble metal compound containing a tetravalent metal element dissolved in a solvent including at least water is added to a slurry including the metal powder dispersed in the solvent to deposit the metal oxide containing the tetravalent metal element and produce a metal oxide-coated metal powder slurry. In the second step, a solution or powder containing at least one divalent element is added to the metal oxide-coated metal powder slurry to react the metal oxide present on the surface of the metal powder with the divalent element, thereby providing the composite oxide-coated metal powder. 1. A method for producing a composite oxide-coated metal powder , the method comprising:adding a water-soluble metal compound containing a tetravalent metal element to a first slurry including a metal powder having a metal element dispersed in a solvent including at least water so as to deposit a metal oxide containing the tetravalent metal element at least partially on a surface of the metal powder thereby providing a second slurry containing a metal oxide-coated metal powder; andadding a solution or a powder containing at least one divalent element to the second slurry to react the metal oxide on the surface of the metal powder with the divalent element so as to produce the composite oxide-coated metal powder.2. The method for producing a composite oxide-coated metal powder according to claim 1 , wherein the metal powder has a ratio of the metal element in a hydroxide state within a range of 30% to 100% claim 1 , the ratio being obtained by peak separation of the metal element in a metal state claim 1 , the metal element in an oxide state claim 1 , and the metal element in ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a body including a dielectric layer, and first and second internal electrodes with the dielectric layer interposed therebetween, and a first through-electrode passing through the body and connected to the first internal electrode; a second through-electrode passing through the body and connected to the second internal electrode; first and second external electrodes formed on the first and second surfaces and connected to the first through-electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the second through-electrode, wherein the first to fourth external electrodes are sintered electrodes including nickel, and each comprises a first plating layer and a second plating layer sequentially stacked on the sintered electrodes.

Multilayer ceramic capacitor

A multilayer ceramic capacitor that has alternately stacked dielectric layers containing, as their main constituent, a barium titanate based compound that has a perovskite-type crystal structure; and internal electrode layers with electrode defects. The internal electrode layers are 0.6 μm or less in thickness. The electrode defects have electrode defects containing an Al—Si based oxide mainly containing Al and Si. The number of the electrode defects containing the Al—Si based oxide is 30% or more in number ratio to the total number of electrode defects in the internal electrodes.

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREFOR

A multilayer ceramic capacitor having a multilayer ceramic element with internal electrodes opposed to each other and dielectric ceramic layers interposed therebetween, and external electrodes on a surface of the multilayer ceramic element and electrically connected to the internal electrodes. The external electrodes contain a first non-precious metal as a first conductive component, and glass containing BaO and/or SrO, where a total content of the BaO and/or the SrO is 34 mol % or more. The internal electrodes have a second non-precious metal different from the first non-precious metal included in the external electrodes. A glass layer is formed at interfacial parts between the ceramic layers and the external electrodes, and a diffusion length thereof is within a range of 1 μm to 5 μm from joint interfaces between the external electrodes and the internal electrodes at the joints. 1. A multilayer ceramic capacitor comprising:a multilayer ceramic element having internal electrodes opposed to each other with dielectric ceramic layers interposed therebetween;external electrodes on a surface of the multilayer ceramic element and electrically connected to the internal electrodes; anda glass layer at interfaces between the dielectric ceramic layers and the external electrodes, wherein:(a) the external electrodes contain a first non-precious metal as a first conductive component; and glass containing BaO and/or SrO, and a total content of the BaO and/or the SrO is 34 mol % or more with respect to a total amount of the glass;(b) the internal electrodes contain, as a second conductive component, a second non-precious metal different from the non-precious metal in the external electrodes; and(c) the first non-precious metal is diffused into the internal electrodes at joints between the external electrodes and the internal electrodes, and a diffusion length thereof is within a range of 1 μm to 5 μm from joint interfaces between the external electrodes and the internal ...

An electrode structure and preparation methods thereof

An electrode structure and preparation methods thereof, the electrode structure includes a substrate and a sintered body, wherein the sintered body is formed on the surface of the substrate, and the sintered body is provided with cracks that are formed after the hydration treatment of the sintered body. The continuity of cracks of the electrode structure was good, and the preparation method is suitable for industrial production. The electrode structure with cracks can effectively increase the bending strength and reduce the stress during the winding process of the electrode structure, thereby reducing the risk of fracture during the application process. It can also improve the flexural strength of the electrode structure while maintaining the original high electrostatic capacity and lower leakage current value of the electrode structure, without negatively affecting the performance of the electrode structure.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF

There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers; internal electrodes disposed to face each other, having the dielectric layers therebetween; and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the internal electrodes include a first ceramic powder formed of barium titanate (BaTiO) and having a particle diameter corresponding to 70% to 100% of a thickness of the respective internal electrodes. According to the present invention, disconnection generated due to differences in contraction and extension between the internal electrodes and the dielectric layers may be improved, whereby the multilayered ceramic electronic component having excellent capacitance and reliability may be implemented. 1. A multilayer ceramic electronic component comprising:a ceramic body including dielectric layers;internal electrodes disposed to face each other, having the dielectric layers therebetween; andexternal electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes,{'sub': '3', 'wherein the internal electrodes include a first ceramic powder formed of barium titanate (BaTiO) and having a particle diameter corresponding to 70% to 100% of a thickness of the respective internal electrodes.'}2. The multilayer ceramic electronic component of claim 1 , wherein the first ceramic powder has a particle diameter of 300 nm to 400 nm.3. The multilayer ceramic electronic component of claim 1 , wherein the first ceramic powder is included in an amount of 2 wt % to 10 wt % of the internal electrodes.4. The multilayer ceramic electronic component of claim 1 , wherein the internal electrodes include a second ceramic powder formed of barium titanate (BaTiO) and having a particle diameter corresponding to 1% to 20% of the respective internal electrodes.5. The multilayer ceramic electronic component of claim 4 ...

PRINTING PLATE, LAMINATED CERAMIC ELECTRONIC COMPONENT PRODUCING METHOD, AND PRINTER

A print pattern of a printing plate used in intaglio printing includes plural partition walls and a groove-shaped cell unit. The plural partition walls are continuously extended in a printing direction, and arranged at predetermined intervals in an orthogonal direction. The cell unit is formed between the partition walls adjacent to each other, and a printing paste (conductive paste) is retained in the cell unit. Plural printing direction walls that are arranged in a zigzag manner in the printing direction are coupled to each other by a coupling walls that are arranged in the printing direction walls adjacent to each other in the printing direction, thereby forming the partition wall. 1. A printing plate for intaglio printing that obtains a predetermined graphic pattern by printing a printing paste on an article to be printed , said printing plate comprisinga plurality of print patterns corresponding to a graphic pattern to be printed being formed in a surface of a plate material,a predetermined direction along the surface of the plate material being configured to correspond to a printing direction of the article to be printed, andeach of the plurality of print patterns including a plurality of partition walls and a groove-shaped cell unit, and each of the plurality of partition walls including a plurality of printing direction walls and a coupling wall,the plurality of partition walls being arranged at predetermined intervals in a direction orthogonal to the printing direction,the plurality of printing direction walls being arranged in a zigzag manner in the printing direction,the coupling wall being arranged so as to couple the printing direction walls adjacent to each other in the printing direction,the groove-shaped cell unit in which the printing paste is to be retained being provided between the partition walls adjacent to each other.2. The printing plate according to claim 1 , wherein the plurality of printing direction walls are arranged parallel to each ...

CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component that includes a ceramic insulator and an inner conductor layer disposed in the ceramic insulator. The inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from Ti, Mg, and Zr, first insulator regions that contain at least one second metal element selected from Ti, Mg, and Zr and that are discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer, and a second insulator region containing a third metal element the same as the second metal element contained in the first insulator regions and present around the inner conductor layer. 1. A ceramic electronic component comprising:a ceramic insulator; andan inner conductor layer disposed in the ceramic insulator, wherein the inner conductor layer contains a metal and a metal oxide containing at least one first metal element selected from a group consisting of Ti, Mg, and Zr;first insulator regions that contain at least one second metal element selected from a group consisting of Ti, Mg, and Zr, the first insulator regions being discontinuous from the ceramic insulator and present in a dispersed state in the inner conductor layer; anda second insulator region containing a third metal element that is the same as the second metal element contained in the first insulator regions, the second insulator region located around the inner conductor layer.2. The ceramic electronic component according to claim 1 , wherein the ceramic insulator contains a fourth metal element that is the same as the second metal element contained in the first insulator regions and the third metal element contained in the second insulator region.3. The ceramic electronic component according to claim 2 , wherein a first concentration of the fourth metal element contained in the ceramic insulator is lower than a second concentration of the second metal element in the first insulator regions and a concentration of the third ...

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MAKING MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes a multilayer body that includes ceramic layers and inner conductor layers arranged in a stacking direction and that includes a first surface in which the inner conductor layers are exposed, and an outer electrode on the first surface of the multilayer body. The inner conductor layers contain Ni. The outer electrode includes a base layer that directly covers at least a portion of the first surface and is connected to the inner conductor layers. The base layer contains a metal and glass and includes a Ni diffusion portion connected to the inner conductor layers, the Ni diffusion portion containing Ni. A ratio of a diffusion depth of the Ni diffusion portion to a thickness of the base layer is smaller on two of the inner conductor layers that are located outermost than on other inner conductor layers. 2. The method for making a multilayer ceramic capacitor according to claim 1 , wherein claim 1 , in the step of baking the conductive paste claim 1 , water is added in a later stage of a period during which the peak temperature is maintained.3. The method for making a multilayer ceramic capacitor according to claim 1 , wherein the conductive paste further contains glass claim 1 , and the average particle diameter of the Cu powder is smaller than an average particle diameter of the glass. This application claims the benefit of priority to Japanese Patent Application 2015-142235 filed Jul. 16, 2015, the entire contents of which application are hereby incorporated by reference.The present invention relates to a multilayer ceramic capacitor and a method for making a multilayer ceramic capacitor.A multilayer ceramic capacitor includes a multilayer body, which is obtained by alternately stacking dielectric ceramic layers and inner conductor layers and baking the resulting stack, and outer electrodes formed on surfaces of the multilayer body. With this structure, a small capacitor with a large capacitance can be obtained. Thus, this type ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other; a plurality of internal electrodes disposed in the ceramic body; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein the ceramic body includes an active portion, and cover portions disposed on upper and lower surfaces of the active portion, each of the first and second side margin portions is divided into a first region and a second region, each of the cover portions is divided into a first region and a second region, and contents of magnesium (Mg) contained in the second regions of the cover portions and the first and second side margin portions are larger than those of magnesium (Mg) contained in the first regions thereof, respectively. 1. A multilayer ceramic capacitor comprising:a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and each having one end exposed to the third or fourth surface; anda first side margin portion and a second side margin portion disposed on end portions of the internal electrodes exposed to the first and second surfaces, respectively,wherein the ceramic body includes an active portion including the plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween and forming capacitance, and cover portions disposed on upper and lower surfaces of the active portion,each of the first and second side margin portions is divided into a first region adjacent to an outer surface of the first and second side margin portions and a second region ...

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes; and first and second side margin portions disposed on end portions of the internal electrodes exposed to the first and second surfaces, wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, and a content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region. 1. A multilayer ceramic capacitor comprising:a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and each having one end alternately exposed to the third and fourth surface; andfirst and second side margin portions disposed on the first and second surfaces,wherein each of the first and second side margin portions is divided into a first region adjacent to an outer side surface of the side margin portion and a second region adjacent to the internal electrodes exposed to the first and second surfaces, anda content of magnesium (Mg) contained in the second region is higher than a content of magnesium (Mg) contained in the first region.2. The multilayer ceramic capacitor of claim 1 , wherein the content of magnesium (Mg) contained in the second region is in a range from 10 moles to 30 moles based on 100 moles ...

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and having first and second surfaces opposing each other in a width direction, third and fourth surfaces connecting the first and second surfaces in a length direction, and fifth and sixth surfaces opposing each other in a thickness direction, internal electrodes disposed inside the ceramic body, exposed through the first and second surfaces, and having one end portion exposed through the third or fourth surface, and first and second side margin portions disposed on edges of the internal electrodes, exposed through the first and second surfaces. In a cross-section cut along a width-thickness plane of the ceramic body, an area of an oxide region disposed on the edges of the internal electrodes is less than 10% of an overall area of the internal electrodes exposed through the first and second surfaces. 1. A multilayer ceramic capacitor comprising:a ceramic body including a dielectric layer and having first and second surfaces opposing each other in a width direction of the ceramic body, third and fourth surfaces connecting the first and second surfaces in a length direction of the ceramic body, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a thickness direction of the ceramic body;internal electrodes disposed inside the ceramic body, exposed through the first and second surfaces, and having one end portion exposed through the third or fourth surface; andfirst and second side margin portions disposed on edges of the internal electrodes, exposed through the first and second surfaces,wherein in a cross-section cut along a width-thickness plane of the ceramic body, an area of an oxide region disposed on the edges of the internal electrodes is less than 10% of an overall area of the internal electrodes exposed through the first and second surfaces.2. The multilayer ceramic capacitor of claim 1 , wherein the first side margin portion ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder. 1. A method of manufacturing a multilayer ceramic electronic component , the method comprising:preparing a ceramic green sheet; 'forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon; and', 'forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet;'}forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure,wherein a content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.2. The method of claim 1 , wherein the ceramic green sheet has a thickness equal to or less than 0.6 μm and the internal electrode pattern has a thickness equal to or less than 0.5 μm.3. The method of claim 1 , wherein the coating layer further includes at least one selected from the group of tungsten (W) claim 1 , molybdenum (Mo) claim 1 , chromium (Cr) claim 1 , and cobalt (Co).4. The method of claim 1 , wherein the coating layer further includes tin (Sn).5. The method of claim 1 , wherein the coating layer is formed using an atomic layer deposition (ALD) process.6. The method of claim 1 , wherein the Ni powder further includes an alloy of ...

Multilayer ceramic capacitor and method of manufacturing the same

A multilayer ceramic capacitor includes a ceramic body including an active portion that includes a dielectric layer and a plurality of internal electrodes overlapping other across the dielectric layer, and cover portions formed above and below the active portion, and including first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, and first and second side margin portions disposed on the first and second surfaces. In a cross-section of the ceramic body in a length-thickness (L-T) direction, a ratio Sd/Sc of an area Sd of a region except for the active portion to an overall area Sc of the section is greater than 27%.

Multilayer electronic component

A multilayer electronic component that includes a stacked body having therein a plurality of dielectric layers including a CZ-based perovskite phase and an element M1, a plurality of internal electrode layers including Cu, and an interface layer including the element M1 in at least a portion of an interface with the plurality of internal electrode layers. Element M1 is an element that has a binding energy between CZ and Cu via the element M1 of less than or equal to −9.8 eV by first-principles calculation using a pseudopotential method. When amounts of elements included in the dielectric layers are expressed as parts by mol, a ratio m1 of an amount of the element M1 to an amount of the Zr in the interface layer is 0.03≤m1≤0.25.

Multilayer ceramic capacitor

A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body.

Leadless Multi-Layered Ceramic Capacitor Stacks

A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode. 128-. (canceled)29. A method of forming an electrical part comprising:providing multilayered ceramic capacitors wherein each multilayered ceramic capacitor of said multilayered ceramic capacitors comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode of said first electrodes and an adjacent second electrode of said second electrodes wherein said first electrodes terminate at a first side and said second electrodes terminate at a second side;stacking said multilayered ceramic capacitors such that each said first side is parallel and each said second side is parallel;forming a first layer of a first component of a transient liquid phase sintering conductive layer;forming a second layer of said first component of said transient liquid phase sintering conductive layer;contacting said first layer and said second layer with a second component of said transient liquid phase sintering conductive layer;heating to a first temperature sufficient to form a first transient liquid phase sintering conductive layer comprising said first component and said second component wherein said first transient liquid phase sintering conductive layer is in electrical contact with said first electrodes and forming a second transient liquid phase sintering conductive layer ...

COMPOSITE SHEET, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE MULTILAYER CERAMIC ELECTRONIC COMPONENT

A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions. 1. A method for manufacturing a multilayer ceramic electronic component , comprising:a step of preparing a plurality of composite sheets each including a ceramic green sheet having a lengthwise dimension extending in a lengthwise direction, and a conductor film printed on the ceramic green sheet, wherein the conductor film includes a plurality of thickness-varied regions arranged in a row extending along the lengthwise direction while being dispersed in the lengthwise direction, the thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions;a step of stacking the plurality of composite sheets on top of one another to obtain a multilayer body;a step of cutting the multilayer body into multilayer pieces forming individual multilayer ceramic electronic components; anda step of sintering the multilayer pieces forming the individual multilayer ceramic electronic components to obtain sintered ceramic compacts each including a plurality of internal electrodes formed by sintering the conductor films.2. The method according to claim 1 , wherein the multilayer ceramic electronic component is a multilayer ceramic capacitor.3. The method according to claim 1 , wherein the thickness-varied regions have a dot ...

ELECTRONIC COMPONENT

An electronic component includes a laminate in which a plurality of dielectric layers and a plurality of internal electrodes are alternately laminated and external electrodes electrically connected to the internal electrodes. A side margin portion as a region in which the plurality of internal electrodes is not provided when a section of the laminate having the length direction and the width direction is viewed from the laminating direction includes a plurality of side margin layers laminated in the width direction. An outer layer portion as a region in which the plurality of internal electrodes is not provided except for the side margin portion when a section of the laminate including the laminating direction and the width direction is viewed from the length direction includes a plurality of layer-margin layers laminated in the laminating direction. 1. An electronic component comprising:a laminate including a plurality of dielectric layers and a plurality of internal electrodes that are alternately laminated; andan external electrode electrically connected to the internal electrodes; wherein a first main surface and a second main surface opposing each other in a laminating direction;', 'a first side surface and a second side surface opposing each other in a width direction perpendicular or substantially perpendicular to the laminating direction; and', 'a first end surface and a second end surface opposing each other in a length direction perpendicular or substantially perpendicular to the laminating direction and the width direction;, 'the laminate includesa side margin portion includes a plurality of side margin layers laminated in the width direction, the side margin portion being a region in which the plurality of internal electrodes are not provided when a cross section of the laminate having the length direction and the width direction is viewed from the laminating direction; andan outer layer portion includes a plurality of layer-margin layers laminated in ...

MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD OF THE SAME

A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces; external electrodes including a ground layer and a plated layer, the ground layer extending from the two end faces to at least one face of four faces of the multilayer chip, the plated layer being provided on the ground layer, a part of the plated layer contacting the at least one face; and a dummy layer that is provided between a capacity region and the at least one face and intersects with a region in which the plated layer contacts the multilayer chip without the ground layer, a main component of the dummy layer being a metal or an alloy including at least Ni. 1. A multilayer ceramic capacitor comprising:a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the plurality of internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic;a pair of external electrodes including a ground layer and a plated layer, the ground layer extending from the two end faces to at least one face of four faces of the multilayer chip other than the two end faces, the plated layer being provided on the ground layer, a part of the plated layer contacting the at least one face; anda dummy layer that is provided between a capacity region and the at least one face and intersects with a region in which the plated layer contacts the multilayer chip without the ground layer, a main component of the dummy layer being a metal or an alloy including at least Ni, the capacity region being a region in which a set of the internal electrode layers connected to one of the end faces face another set of the internal electrode layers ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING OF THE SAME

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass. 1. A multilayer ceramic electronic component comprising:a ceramic body including a dielectric layer;first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body; andfirst and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively,wherein:at least one selected from the group of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass, andthe first glass contains barium-zinc (Ba—Zn) and the second glass contains silicon (Si).2. The multilayer ceramic electronic component of claim 1 , wherein the first glass comprises a larger amount of barium-zinc (Ba—Zn) than the second glass claim 1 , and the second glass comprises a larger amount of silicon (Si) than the first glass.3. The multilayer ceramic electronic component of claim 1 , wherein:the second electrode layer comprises at least one selected from the group of zirconium (Zr) and dysprosium (Dy).4. The multilayer ceramic electronic component of claim 1 ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes an internal electrode layer including, on a same ceramic layer, a peripheral internal electrode having a frame shape and an inside internal electrode located inside the peripheral internal electrode. A metallic species included in the peripheral internal electrode is different from a metallic species included in the inside internal electrode. The metallic species included in the peripheral internal electrode includes more than or equal to about 50% of a metallic species different from the metallic species included in the inside internal electrode. In a width direction, a dimension a of a width of the peripheral internal electrode is about 5 μm Подробнее

Multilayer electronic component

A multilayer electronic component includes an element body having internal electrode layers and dielectric layers. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces oppositely facing in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. End portions in the first axis direction of the internal electrode layers are recessed from end portions in the first axis direction of the dielectric layers to an inner side along the first axis direction. The retraction distances are varied at a predetermined range in each layer of the internal electrode layers.

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 μm or more and less than 45 μm. 1. A multilayer ceramic capacitor comprising:a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface;a first side margin portion and a second side margin portion disposed, on the first and second surfaces of the ceramic body, respectively, to contact side portions of the internal electrodes exposed to the first and second surfaces, respectively;an adhesive disposed between each of the first and second side margin portions and the respective first and second surfaces of the ceramic body; andfirst and second external electrodes disposed on the third and fourth surfaces of the ceramic body, respectively, and each extending onto surfaces of the first and second side margin portions other than surfaces of the first and second side margin portions contacting the adhesive, wherein a thickness of each of the first and second side margin ...

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces. A thickness of each of the first and second side margin portions is 10 μm or more and less than 45 μm. 1. A multilayer ceramic capacitor comprising:a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;a plurality of internal electrodes disposed in the ceramic body, exposed to the first and second surfaces, and each having one end exposed to the third or fourth surface;a first side margin portion and a second side margin portion disposed, respectively, on side portions of the internal electrodes exposed to the first and second surfaces; andfirst and second external electrodes in direct contact with outer surfaces of the first and second margin portions opposite inner surfaces of the first and second margin portions facing the first and second surfaces,wherein a thickness of each of the first and second side margin portions is 10 μm to 45 μm, anda ratio of a thickness between the inner and outer surfaces of the first or second margin portion in a region thereof in contact with an edge of the fifth or sixth surface of the ceramic body, to a thickness between the inner and outer surfaces of the first ...

Capacitor component

A capacitor component includes: a body including first and second internal electrodes alternately disposed in a first direction; first and second connection electrodes extending in the first direction in the body, respectively connected to the first and second internal electrodes, and opposing each other in a second direction; and first and second external electrodes disposed on one surface of the body and respectively connected to the first and second connection electrodes and each include an extended pattern disposed at one end portion on the one surface in the second direction and extending in a third direction, and a connection pattern extending, in the second direction, from a region spaced apart from both ends of the extended pattern in the third direction and connected to one of the first and second connection electrodes in a region spaced apart from opposite ends of the extended pattern in the third direction.

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively. 1. A multilayer ceramic electronic component comprising:a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and including dielectric layers and a plurality of internal electrodes disposed to face each other in the first direction with each of the dielectric layers interposed therebetween; andmulti-layer external electrodes disposed on the third and fourth surfaces of the ceramic body and electrically connected to the internal electrodes, respectively,wherein the ceramic body includes an active portion in which capacitance is formed by including the plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween and cover portions disposed on upper and lower surfaces of the active portion in the first direction, respectively,the multi-layer external electrodes each including an electrode layer electrically connected to the plurality of internal electrodes, respectively, and an outermost layer formed as an outermost conductive resin layer disposed on the electrode layer, each outermost conductive resin layer extending onto the first and second surfaces of the ceramic body, anda ...

Ceramic capacitor and method of manufacturing the same

A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces of the ceramic body, wherein a metal or a metal oxide is disposed in each of the first and second side margin portions, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less.

MULTILAYER ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the ceramic body and electrically connected to the internal electrodes, respectively, wherein the external electrodes including, respectively, electrode layers electrically connected to the internal electrodes, respectively, and conductive resin layers disposed on the electrode layers, respectively. 1. A multilayer ceramic electronic component comprising:a ceramic body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, and including dielectric layers and a plurality of internal electrodes disposed to face each other in the first direction with each of the dielectric layers interposed therebetween; andmulti-layer external electrodes disposed on the third and fourth surfaces of the ceramic body and electrically connected to the internal electrodes, respectively,wherein the ceramic body includes an active portion in which capacitance is formed by including the plurality of internal electrodes disposed to face each other with each of the dielectric layers interposed therebetween and cover portions disposed on upper and lower surfaces of the active portion in the first direction, respectively,the multi-layer external electrodes each including an electrode layer electrically connected to the plurality of internal electrodes, respectively, and a conductive resin layer disposed on the electrode layer, the each conductive resin layer extending onto the first and second surfaces of the ceramic body, anda ratio of a thickness of each of the cover ...

MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME

A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an inner half adjacent to the active portion and an outer half adjacent to the edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half. 1. A multilayer ceramic capacitor comprising:a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked in a thickness direction and a margin portion disposed on outer surfaces of the active portion; andexternal electrodes disposed on outer surfaces of the ceramic body,wherein the margin portion includes an inner half adjacent to the active portion and an outer half adjacent to an edge of the ceramic body, and a porosity of the inner half is greater than a porosity of the outer half, and the porosity of the inner half is 0.06% to 2.0%, and the porosity of the outer half is 0.05% or less.2. The multilayer ceramic capacitor of claim 1 , wherein a size of each pore in the inner half is 0.05 μm to 0.1 μm.3. The multilayer ceramic capacitor of claim 1 , wherein a size of each pore in the outer half is 0.015 μm to 0.03 μm.4. The multilayer ceramic capacitor of claim 1 , wherein in margin portions disposed on upper and lower surfaces of the active portion in the thickness direction claim 1 , sizes of dielectric grains of the inner half and the outer half are different from each other.5. A board having a multilayer ceramic capacitor claim 1 , comprising:a printed circuit board on which a plurality of electrode pads are disposed; andthe multilayer ceramic capacitor installed on the printed circuit board,wherein the multilayer ceramic capacitor includes a ceramic body including an active portion ...

MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces, a pair of end faces, and a pair of side faces, wherein the multilayer ceramic capacitor is such that: external electrodes are formed on the pair of end faces and one principle face of the element body; and on a cross section taken in parallel with one end face of the multilayer ceramic capacitor near the end face, the ratio of area A constituted by the internal electrode layers connected to the external electrode on this end face side and the dielectric layers present between the internal electrode layers, and area B covering the part of the section excluding the external electrodes, A/B, is 0.92 or more. 1. A multilayer ceramic capacitor having an element body of roughly rectangular solid shape which is constituted by dielectric layers alternately stacked with internal electrode layers having different polarities and which has a pair of principle faces , a pair of end faces , and a pair of side faces , wherein:external electrodes are formed on the pair of end faces and one principle face of the element body, thereby each constituting an L-shaped two-face electrode; andon a cross section taken in parallel with one end face of the multilayer ceramic capacitor in a manner passing through a midpoint between the one end face and ends of the internal electrode layers near the one end face where the internal electrode layers connected to the external electrode on the other end face side do not extend, a ratio of area A, which is constituted by cross sectional areas of the internal electrode layers connected to the external electrode on the one end face side and cross sectional areas of the dielectric layers present between the internal electrode layers, and area B, which is an entire cross sectional area of the element body ...

COMPOSITION FOR CERAMIC SUBSTRATES AND CERAMIC CIRCUIT COMPONENT

A composition for ceramic substrates that includes a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder contains 4% to 8% by weight BO, 38% to 44% by weight SiO, 3% to 10% by weight AlO, and 40% to 48% by weight MO, where MO is at least one selected from CaO, MgO, and BaO. The mixing proportions of the borosilicate glass powder and the ceramic powder are 50% to 56% by weight the borosilicate glass powder and 50% to 44% by weight the ceramic powder. The ceramic powder has an average particle diameter D50 of 0.4 to 1.5 μm. 1. A composition for ceramic substrates , the composition comprising:a mixture of 50% to 56% by weight of borosilicate glass powder and 50% to 44% by weight of ceramic powder, [{'sub': 2', '3, '4% to 8% by weight BO,'}, {'sub': '2', '38% to 44% by weight SiO,'}, {'sub': 2', '3, '3% to 10% by weight AlO, and'}, '40% to 48% by weight MO, where MO is at least one selected from CaO, MgO, and BaO, and, 'wherein the borosilicate glass powder containswherein the ceramic powder has an average particle diameter D50 of 0.4 to 1.5 μm.2. The composition according to claim 1 , wherein the ceramic powder is alumina powder.3. The composition according to claim 1 , further comprising a crystallinity modifier.4. The composition according to claim 3 , wherein the crystallinity modifier is a crystallization accelerator.5. The composition according to claim 3 , wherein the crystallinity modifier is crystallized wollastonite.6. The composition according to claim 5 , wherein a quantity of the crystallized wollastonite is in a range of 0.005 to 0.1 parts by weight when a total quantity of the borosilicate glass powder and the ceramic powder is 100 parts by weight.7. The composition according to claim 5 , wherein a quantity of the crystallized wollastonite is in a range of 0.005 to 0.04 parts by weight when a total quantity of the borosilicate glass powder and the ceramic powder is 100 parts by weight.8. The composition according to ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, base electrode layers respectively provided on both end surfaces of the multilayer body in a length direction intersecting a lamination direction, and each connected to the internal electrode layers and each including glass and copper, and plated layers respectively provided on an outer side of the base electrode layers. A protective layer including sulfur is provided between the glass included in the base electrode layers and the plated layers.

Advanced dielectric energy storage device and method of fabrication

A Dense Energy Ultra Cell (DEUC), a dielectric energy storage device and methods of fabrication therefor are provided. A DEUC element is fabricated using print technologies that deposit dielectric energy storage layers (406) and insulating layers (404) together being interleaved between electrode layers (403). The dielectric energy storage layers are created from a proprietary solution to enable printing of dielectric energy storage layers with high permittivity and a high internal resistivity to retain charge. The insulating layers (404) can be applied within the dielectric energy storage layers (406) bifurcating the dielectric energy storage layers for increased resistivity. As part of the fabrication process, the material deposition printer can apply multiple print heads each with different inks and materials (1301, 1302) to form composite material (1303) in the printed layers.

Ceramic electronic component and manufacturing method therefor

A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes.

MEDIUM AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT

A medium is accommodated in a container together with an electronic component body including an underlying electrode layer. The medium treats a surface of the underlying electrode layer while vibration is applied to the container. The medium is spherical or substantially spherical. The medium has a diameter not smaller than about 0.2 mm and not greater than about 2.0 mm. The medium contains tungsten. 1. A method of manufacturing an electronic component comprising:introducing a plurality of multilayer bodies and media into a container, the plurality of multilayer bodies each including a first end surface and a second end surface opposed to each other in a direction of length, a first side surface and a second side surface opposed to each other in a direction of width perpendicular or substantially perpendicular to the direction of length, and a first main surface and a second main surface opposed to each other in a direction of height perpendicular or substantially perpendicular to the direction of length and the direction of width, the first end surface being provided with a first baked electrode layer, and the second end surface being provided with a second baked electrode layer; andapplying vibration energy to the plurality of multilayer bodies and the media by applying vibration to the container, the container including a bottom portion and a circumferential wall portion connected to a circumferential edge of the bottom portion; whereinwhen an annular virtual axis circumferentially surrounding a central axis of the bottom portion is assumed in a state before vibration of the container, in the applying vibration energy to the plurality of multilayer bodies and the media, vibration is applied to the multilayer bodies and the media such that the multilayer bodies and the media follow a helical trace helically surrounding the virtual axis along an axial direction of the virtual axis.2. The method of manufacturing an electronic component according to claim 1 , wherein ...

Multilayer capacitor and method of manufacturing the same

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer.

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed on top of a first principal surface. The third portion is disposed on top of a second principal surface. The fourth portion is disposed on top of a first side surface. The fifth portion is disposed on top of a second side surface. 1. A ceramic electronic component comprising:a ceramic body including a first principal surface and a second principal surface that extend in a length direction and in a width direction, a first side surface and a second side surface that extend in the length direction and in a thickness direction, and a first end surface and a second end surface that extend in the width direction and in the thickness direction; andan outer electrode disposed on the ceramic body and including a fired electrode layer disposed on the ceramic body; wherein a first portion disposed on the first end surface;', 'a second portion disposed on the first principal surface; and', 'a third portion disposed on the second principal surface;, 'the fired electrode layer includeswhen viewed in a cross section along the length direction and the thickness direction, the first portion and the second portion are not directly connected to each other, and are separate from each other; andwhen viewed in a cross section along the length direction and the thickness direction, the first portion and the third portion are not directly connected to each other, and are separate from each other.2. The ceramic electronic component according to claim 1 , wherein the outer electrode further includes a Cu plating layer arranged to cover the first portion claim 1 , the second portion claim 1 , and the third portion.3. The ceramic electronic component according to claim 2 , wherein the Cu plating layer ...

Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metalurgical Bonds

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode. 1. A method for forming a capacitor comprising:providing an aluminum containing anode with an aluminum oxide dielectric thereon;forming a cathode on a first portion of said aluminum oxide dielectric;bonding an anode lead to said aluminum anode on a second portion of said aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding said aluminum anode to said anode lead; andbonding a cathode lead to said cathode.2. The method for forming a capacitor of wherein said transient liquid phase sintered conductive material has at least 90 wt % metal.3. The method for forming a capacitor of wherein said transient liquid phase sintered conductive adhesive has at least 95 wt % metal.4. The method for forming a capacitor of wherein said bonding of said anode lead includes heating to a first temperature followed by heating to a second temperature.5. The method for forming a capacitor of wherein said metallurgical bond comprises a copper aluminum alloy.6. The method for forming a capacitor of wherein said transient liquid sintering material comprises a high melting temperature component and a low melting temperature component.7. The method for forming a capacitor of wherein said high melting temperature component of the transient liquid phase sintering material comprises at least one member selected from the group consisting of copper claim 6 , silver claim 6 , aluminum claim 6 , gold claim 6 , ...

CONDUCTIVE POWDER FOR INTERNAL ELECTRODE AND CAPACITOR COMPONENT INCLUDING THE SAME

A conductive powder for an internal electrode includes a metal particle and a graphene oxide disposed on at least a portion of a surface of the metal particle. A content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle. 1. A conductive powder for an internal electrode , the conductive powder comprising:a metal particle; anda graphene oxide disposed on at least a portion of a surface of the metal particle,wherein a content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle.2. The conductive powder of claim 1 , wherein the metal particle and the graphene oxide constitute a core-shell structure.3. The conductive powder of claim 1 , wherein the graphene oxide has a C/O within a range from 1 to 1.2 claim 1 , the C/O being a ratio of carbon atoms to oxygen atoms.4. The conductive powder of claim 1 , wherein the graphene oxide includes at least two layers.5. The conductive powder of claim 1 , wherein the graphene oxide covers an entire surface of the metal particle.6. The conductive powder of claim 1 , wherein the metal particle includes at least one metal selected from the group consisting of nickel (Ni) claim 1 , copper (Cu) claim 1 , cobalt (Co) claim 1 , iron (Fe) claim 1 , platinum (Pt) claim 1 , gold (Au) claim 1 , aluminum (Al) claim 1 , chromium (Cr) claim 1 , magnesium (Mg) claim 1 , manganese (Mn) claim 1 , molybdenum (Mo) claim 1 , rhodium (Rh) claim 1 , silicon (Si) claim 1 , tantalum (Ta) claim 1 , titanium (Ti) claim 1 , tungsten (W) claim 1 , uranium (U) claim 1 , vanadium (V) claim 1 , and zirconium (Zr).7. A capacitor component comprising:a body including a dielectric layer and a plurality of internal electrodes alternately disposed to face each other with the dielectric layer interposed therebetween, the body having first and second surfaces disposed to oppose each other, third and fourth surfaces connected to the first and second surfaces and disposed to oppose each ...

MULTILAYER ELECTRONIC COMPONENT

A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately stacked with one of the dielectric layers interposed therebetween; and external electrodes disposed on external surfaces of the body and connected to the internal electrodes. One of the internal electrodes includes a plurality of conductive particles and conductive nanowires each of which having a shape different from a shape of the plurality of conductive particles and being connected to at least one of the plurality of conductive particles. 1. A multilayer electronic component comprising:a body including dielectric layers and internal electrodes alternately stacked with one of the dielectric layers interposed therebetween; andexternal electrodes disposed on external surfaces of the body and connected to the internal electrodes,wherein one of the internal electrodes includes a plurality of conductive particles and conductive nanowires, the conductive nanowires having a shape different from a shape of the plurality of conductive particles and being connected to at least one of the plurality of conductive particles.2. The multilayer electronic component of claim 1 , wherein the conductive nanowire connects adjacent particles among the plurality of conductive particles.3. The multilayer electronic component of claim 2 , wherein claim 2 , among the plurality of conductive particles claim 2 , particles connected to different conductive nanowires claim 2 , respectively claim 2 , are adjacent to each other and spaced apart from each other.4. The multilayer electronic component of claim 1 , wherein one of the conductive nanowires connects one or more of the plurality of conductive particles to one of the external electrodes.5. The multilayer electronic component of claim 4 , wherein claim 4 , among the plurality of conductive particles claim 4 , the one or more particles connected to the one of the conductive nanowires are spaced apart from the one of the ...

MULTILAYER CERAMIC CAPACITOR

A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately exposed to opposing surfaces of the body in a length direction with respective dielectric layers interposed therebetween, and first and second external electrodes disposed at opposing ends of the body in the length direction and connected to the first and second internal electrodes, respectively. The plurality of first and second internal electrodes include nickel (Ni) and antimony (Sb) or germanium (Ge). 1. A multilayer capacitor comprising:a body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately exposed to opposing surfaces of the body in a length direction with respective dielectric layers interposed therebetween; andfirst and second external electrodes disposed at opposing ends of the body in the length direction and connected to the first and second internal electrodes, respectively,wherein the plurality of first and second internal electrodes include nickel (Ni) and antimony (Sb).2. The multilayer capacitor of claim 1 , whereina content of Sb in the plurality of first and second internal electrodes is within a range from 0.01 at % to 5 at %, based on a total content of the first and second internal electrodes.3. The multilayer capacitor of claim 2 , whereinthe content of Sb in the plurality of first and second internal electrodes is within a range from 0.1 at % to 1 at %, based on the total content of the first and second internal electrodes.4. The multilayer capacitor of claim 1 , whereinthe plurality of first and second internal electrodes further include germanium (Ge).5. The multilayer capacitor of claim 4 , whereina content of Ge in the plurality of first and second internal electrodes is within a range from 0.01 at % to 5 at %, based on a total content of the first and second internal electrodes.6. The multilayer capacitor of claim 5 , whereinthe ...

ELECTRONIC COMPONENT

An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μmor larger. 1. An electronic component comprising:an electronic component body including first and second main surfaces extending in a length direction and a width direction, first and second side surfaces extending in the length direction and a thickness direction, and first and second end surfaces extending in the width direction and the thickness direction;a first outer electrode that extends from the first end surface to the first main surface and the second main surface; anda second outer electrode that extends from the second end surface to the first main surface and the second main surface; whereina dimension of the electronic component in the length direction is about 0.6 mm to about 1.0 mm, a dimension of the electronic component in the width direction is about 0.3 mm to about 0.5 mm, and a dimension of the electronic component in the thickness direction is about 0.07 mm to about 0.15 mm;{'sup': '2', 'an area of a first triangle that is defined by, when the electronic component is projected from the first side surface or the second side surface, a first hypothetical straight line that is in contact with a top of a portion of the ...

THREE-TERMINAL CAPACITOR

A three-terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers within the capacitor element. A height H is greater than a height H, where the height H represents a higher one of a height at a center of a portion of the first-side outer electrode on the fifth surface and a height at a center of a portion of the first-side outer electrode on the sixth surface, and the height H represents a height at a center of a portion of the first-side outer electrode on the third surface, wherein the height H and the height H extend in the thickness direction. 1. A three-terminal capacitor comprising:a capacitor element including first and second surfaces extending in a length direction and in a width direction, third and fourth surfaces extending in the width direction and in a thickness direction, and fifth and sixth surfaces extending in the length direction and in the thickness direction;a first-side outer electrode that is disposed at a first end portion of the first surface in the length direction and on predetermined areas of the third, fifth, and sixth surfaces;a second-side outer electrode that is disposed at a second end portion of the first surface in the length direction and on portions of the fourth, fifth, and sixth surfaces;a center outer electrode that is disposed at a portion of the first surface between the first-side outer electrode and the second-side outer electrode in the length direction and on portions of the fifth and sixth surfaces; anda plurality of conductor layers including a plurality of first conductor layers and a plurality of second conductor layers that are stacked in the width direction; whereineach of the plurality of first conductor layers is disposed within the capacitor element, electrically connected to the center outer electrode via a first extending portion at ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a ceramic multilayer body including dielectric ceramic layers and inner electrodes laminated with the dielectric ceramic layers interposed therebetween, wherein the dielectric ceramic layers include a perovskite compound containing Ba and Ti, and the inner electrodes (a) contain Ni as a main component, (b) include segregation with the perovskite compound containing Ba and Ti, which is scattered in the inner electrodes and embedded in the inner electrodes, in amount equal to or higher than about 2%, and (c) include columnar segregation with the perovskite compound containing Ba and Ti, which penetrates through the inner electrodes from one main surface side to the other main surface side, in an amount equal to or lower than about 5%, or do not include the columnar segregation. Further, an average thickness of the inner electrodes is equal to or smaller than about 0.4 μm.

Low temperature co-fired ceramic substrate with embeded capacitors

The present invention relates to a low temperature co-fired ceramic substrate with embedded capacitors. According to an embodiment of the present invention, the low temperature co-fired ceramic substrate with embedded capacitors is able to prevent diffusion, peeling or loss of electrodes after low temperature firing by controlling composition ratio of various metals included in the substrate, resulting in good adhesion between the ceramic substrate and the capacitor.

MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF PRODUCING THE SAME

A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit and a cover. The capacitance forming unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers and mainly containing nickel. The cover covers the capacitance forming unit from the first direction. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The internal electrodes each include an oxidized area adjacent to the side margin and intensively including a metal element that forms an oxide together with nickel. The capacitance forming unit includes a first portion adjacent to the cover and a second portion adjacent to the first portion in the first direction and including the oxidized area having a smaller dimension in the second direction than that of the oxidized area of the first portion. 1. A method of producing a multi-layer ceramic capacitor , comprising: [ ceramic layers laminated in a first direction, and', 'internal electrodes disposed between the ceramic layers and mainly containing nickel,, 'a capacitance forming unit including'}, 'a cover that covers the capacitance forming unit from the first direction, and', 'a side surface that is oriented in a second direction orthogonal to the first direction, the internal electrodes being exposed to the side surface;, 'producing an unsintered multi-layer chip including'}producing an unsintered body by covering the side surface from the second direction by a side margin, the side margin containing a metal element that be capable to form an oxide together with nickel, the metal element having a concentration lower than a concentration of a metal element of the cover; andsintering the unsintered body.2. The method of producing a multi-layer ceramic capacitor according to claim 1 , wherein the cover has a thickness of 15 μm or less in the first direction claim 1 , andthe ...

Module

The present invention relates to a module (1) which comprises a power semiconductor device (2) and a ceramic capacitor (3) which is configured for cooling the power semiconductor device (2).

PRIMARY NANOPARTICLE FABRICATION

According to a novel fabrication method, a new composition of matter includes a large percentage (e.g., 75% or higher percentage) of primary nanoparticles in the new composition of matter. The novel fabrication method reduces the size of nanoparticle clusters in material of the new composition of matter, allows fabrication of specific nanoparticle cluster sizes, and allows fabrication of primary nanoparticles. This new composition of matter can include a high permittivity and high resistivity dielectric compound. This new composition of matter, according to certain examples, has high permittivity, high resistivity, and low leakage current. In certain examples, the new composition of matter constitutes a dielectric energy storage device that is a battery with very high energy density, high operating voltage per cell, and an extended battery life cycle. 1. A method of fabrication of material that includes reduced size of nanoparticle grouping , the method comprises:subjecting one or more calcine heated nanoparticle groupings to a dissolving pH solution, where the pH of the dissolving pH solution is adjusted to dissolve nanoparticle interconnections at interfaces of a plurality of nanoparticles in the one or more nanoparticle groupings;agitation of the plurality of nanoparticles in the dissolving pH solution;separating the plurality of nanoparticles from the dissolving pH solution;placing the plurality of nanoparticles in a pH matching solution, where a pH of the pH matching solution is adjusted to match an iso-electric point of the plurality of nanoparticles;adding a surfactant to the pH matching solution with the plurality of nanoparticles to separate the plurality of nanoparticles, coat with the surfactant the separated plurality of nanoparticles, and maintain nanoparticle separation in the separated plurality of nanoparticles; andagitation of the plurality of nanoparticles and surfactant in the pH matching solution to yield at least one of clustered nanoparticles ...

Multilayer ceramic capacitor

A multilayer ceramic capacitor includes a multilayer body in which dielectric layers are laminated, first and second internal electrode layers extending to both end surfaces of the multilayer body, first and second external electrodes connected to the first internal electrode layer and disposed on both end surfaces, and third and fourth external electrodes connected to the second internal electrode layer and disposed on both side surfaces. A number of the first internal electrode layers is greater than a number of the second internal electrode layers, and at least two first internal electrode layers are continuously laminated. In the first internal electrode layer, a recess is provided so as not to overlap the third and fourth external electrodes on a portion of both principal surfaces when the multilayer ceramic capacitor is viewed from a height direction.

ELECTRONIC COMPONENT

An element body includes a first function portion including a first material, a second function portion including a second material different from the first material, and an intermediate portion placed between the first function portion and the second function portion. The intermediate portion includes a first component included in the first material, and a second component included in the second material. A side surface of the element body includes surfaces of the first function portion, the second function portion, and the intermediate portion. Each of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion. An insulating layer is formed on the side surface in such a manner as to be in contact with at least a region exposed from the electrode portions between the electrode portions in the surface of the intermediate portion. 1. An electronic component comprising:an element body including a side surface;a plurality of terminal electrodes disposed on the element body; andan insulating layer disposed on the element body,wherein the element body includesa first function portion including a first material,a second function portion including a second material different from the first material, andan intermediate portion that includes a first component included in the first material and a second component that is included in the second material and that is different from the first component, the intermediate portion being placed between the first function portion and the second function portion,the side surface includes surfaces of the first function portion, the second function portion, and the intermediate portion,each of the plurality of terminal electrodes includes electrode portion formed on the side surface across the surfaces of the first function portion, the second function portion, and the intermediate portion, andthe insulating layer ...

ELECTRONIC COMPONENT

An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend. 1. An electronic component comprising:a capacitor array including first and second multilayer capacitors disposed in a vertical direction, the first and second multilayer capacitors including opposing external electrodes including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area larger than an area of a band portion disposed on a further surface other than the bonding surface; anda pair of metal frames, each including a vertical portion bonded to a head portion of a respective one of the external electrodes of the first multilayer capacitor and a mounting portion bent at a lower end of the vertical portion.2. The electronic component of claim 1 , wherein the band portion disposed on the bonding surface includes an extending portion claim 1 , extending in a length direction.3. The electronic component of claim 1 , further comprising a conductive bonding portion disposed between the head portion of the respective external electrode of the first multilayer capacitor and the vertical portion.4. The electronic component of claim 1 , wherein the mounting portion is spaced apart from a lower end of the capacitor array.5. The electronic component of claim 1 , wherein each of the ...

Multilayer electronic component

A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween, and an external electrode disposed on the body and connected to the internal electrodes . An end portion of at least one of the internal electrodes in a longitudinal direction of the body is thicker than a central portion of the internal electrode, and a ratio t 2 /t 1 of a thickness t 2 of the end portion to a thickness t 1 of the central portion satisfies 1.1≤t 2 /t 1 ≤1.5.

Conductive powder for internal electrode and capacitor component including the same

A conductive powder for an internal electrode includes a metal particle and a graphene oxide disposed on at least a portion of a surface of the metal particle. A content of the graphene oxide is less than 1.0 weight percent, based on a weight of the metal particle.

Ceramic electronic device and manufacturing method of the same

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer structure. A bent portion, in which the plurality of dielectric layers in a substantially same position along a stacking direction project along the stacking direction, is formed in the multilayer chip. In the bent portion, a through-hole is formed in two or more of the plurality of internal electrode layers. The through-hole is a defect portion in a first direction in which the first end face faces with the second end face and in a second direction that is vertical to the first direction in a plane of the plurality of internal electrode layers.

Composite electronic component and board having the same

A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.

Ceramic electronic device and manufacturing method of ceramic electronic device

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A main component of the plurality of dielectric layers is a ceramic having a perovskite structure of which an A site includes at least Ba and of which an AB ratio is 0.980 or less. The plurality of internal electrode layers include a co-material. A total amount of Ti, Zr and Hf is 90 mol % or more in metal elements included in the co-material and an amount of Ba is 10 mol % or less in the metal elements.

CAPACITOR COMPONENT

A capacitor component includes a body including dielectric layers and first and second internal electrodes disposed to face each other while having the dielectric layer interposed therebetween; and first and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively. The body includes a capacitance forming portion including the first and second internal electrodes disposed to face each other while having the dielectric layer interposed therebetween and in which capacitance is formed, and cover portions formed on upper and lower surfaces of the capacitance forming portion, and hardness of the cover portions is GPa or more and GPa or less. 1. A capacitor component comprising:a body including dielectric layers and first and second internal electrodes disposed to face each other while having the dielectric layers interposed therebetween, and including first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; andfirst and second external electrodes disposed on an external surface of the body and electrically connected to the first and second internal electrodes, respectively,wherein the body includes a capacitance forming portion including the first and second internal electrodes disposed to face each other while having the dielectric layers interposed therebetween and in which capacitance is formed, and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively, andhardness of the cover portions is 9.5 GPa or more and 14 GPa or less.2. The capacitor component of claim 1 , wherein the cover portions have the hardness greater than that of the dielectric layers of the capacitance forming portion.3. The capacitor component of claim 1 , further comprising margin ...

CERAMIC ELECTRONIC COMPONENT

A ceramic electronic component includes a body including a dielectric layer, and a first internal electrode and a second internal electrode opposing each other with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a first external electrode including a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, and disposed on the third surface of the body, and a second external electrode including a second electrode layer connected to the second internal electrode, and a second conductive resin layer disposed on the second electrode layer, and disposed on the fourth surface of the body. 1. A ceramic electronic component , comprising:a body comprising a dielectric layer, and a first internal electrode and a second internal electrode opposing each other with the dielectric layer interposed therebetween, and having first and second surfaces opposing each other, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other;a first external electrode comprising a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, and disposed on the third surface of the body; anda second external electrode comprising a second electrode layer connected to the second internal electrode, and a second conductive resin layer disposed on the second electrode layer, and disposed on the fourth surface of the body,wherein tb is less than 80 μm, and (ta+tb)/L*50 is 1 or greater, in which L is a distance between the third and fourth surfaces of the body, to is a ...

THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT

A thin film capacitor is provided with a lower electrode made of a metal foil containing many metal grains, a dielectric thin film formed on an upper surface of the lower electrode, and an upper electrode formed on an upper surface of the dielectric thin film. A lower surface of the lower electrode is an etched surface from which cross sections of the metal grains appear. The height difference between the cross sections of adjacent metal grains in the etched surface is 1 μm or more and 8 μm or less. 1. A thin film capacitor comprising:a lower electrode made of a metal foil containing many metal grains;a dielectric thin film formed on an upper surface of the lower electrode; andan upper electrode formed on an upper surface of the dielectric thin film, whereina lower surface of the lower electrode is an etched surface from which cross sections of the metal grains appear, anda height difference between the cross sections of adjacent metal grains in the etched surface is 1 μm or more and 8 μm or less.2. The thin film capacitor as claimed in claim 1 , wherein{'sub': '111', 'a number of the metal grains each of whose cross section of (111) plane ±20° appears from the etched surface is N,'}{'sub': '100', 'a number of the metal grains each of whose cross section of (100) plane ±20° appears from the etched surface is N,'}{'sub': '110', 'a number of the metal grains each of whose cross section of (110) plane ±20° appears from the etched surface is N, and'}{'sub': 111', '100', '110, 'a relationship: N>N>Nis satisfied.'}3. The thin film capacitor as claimed in claim 1 , whereinan average grain size of the metal grains is 10 μm or more and 25 μm or less.4. The thin film capacitor as claimed in claim 1 , whereinthe metal foil is an Ni foil, and the metal grains are Ni grains.5. The thin film capacitor as claimed in claim 1 , whereina side surface of the lower electrode is the etched surface from which the cross sections of the metal grains appear like the lower surface of the ...

Conductive powder for inner electrode and capacitor

A conductive powder for an internal electrode includes a metal particle; and a graphene layer or an oxidized graphene layer disposed on at least a portion of a surface of the metal particle.

Capacitors and radio frequency generators and other devices using them

Certain configurations of a stable capacitor are described which comprise electrodes produced from materials comprising a selected coefficient of thermal expansion to enhance stability. The electrodes can be spaced from each other through one of more dielectric layers or portions thereof. In some instances, the electrodes comprise integral materials and do not include any thin films. The capacitors can be used, for example, in feedback circuits, radio frequency generators and other devices used with mass filters and/or mass spectrometry devices.

Multi-layered ceramic capacitor

A multi-layered ceramic capacitor capable of realizing an improved process yield and miniaturization while having an overvoltage protection function may be provided. The multi-layered ceramic capacitor may include a ceramic body including a first internal electrode, a second internal electrode, a dielectric layer, and an overvoltage protection layer; and an external electrode disposed at both ends of the ceramic body, wherein the overvoltage protection layer may be disposed between the first internal electrode and the second internal electrode.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer including a grain and first and second internal electrodes stacked in a third direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in a third direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a first direction; and first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, and a ratio, G/I, of a particle size, G, of a grain of the dielectric layer to a thickness, I, of each of the first and second internal electrodes is 0.3 or more and 0.5 or less.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax) (Ti1-y(Zr, Hf)y)O3 (where, 0≤x≤1, 0≤y≤0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.

CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked. A discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure. An Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity. 1. A ceramic electronic device comprising:a multilayer structure in which each of a plurality of dielectric layers including Ba and Ti and each of a plurality of internal electrode layers including Ni and Sn are alternately stacked,wherein a discontinuity is formed in at least one of the plurality of internal electrode layers, the discontinuity being a break in a cross section including a stacking direction of the multilayer structure, andwherein an Sn high concentration portion, of which an Sn concentration is higher than an average Sn concentration of the one of the internal electrode layers, is formed on a part of a surface of the at least one of the internal electrode layers, the part of the surface being exposed to the discontinuity.2. The ceramic electronic device as claimed in claim 1 , wherein the Sn high concentration portion extends from the part of the surface exposed to the discontinuity to an interface between the one of the internal electrode layers and a dielectric layer next to the one of the internal electrode layers.3. The ceramic electronic device as claimed in claim 2 ,wherein the one of the internal electrode layers has two or more of discontinuities from which Sn high concentration portions extend, andwherein the Sn high ...

LOW-TEMPERATURE SINTERING DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR FORMED THEREOF

A low-temperature sintering dielectric composition contains barium titanate (BaTiO) as a main ingredient and accessory ingredients including 1.0 to 2.0 mol % of barium carbonate (BaCO), 0.5 to 1.0 mol % of at least one rare earth oxide selected from the group consisting of YO, HoO, DyO, and YbO, 0.1 to 1.0 mol % of manganese oxide (MnO), and 1.0 to 2.0 mol % of borosilicate based glass, based on 100 mol % of the main ingredient. 1. A low-temperature sintering dielectric composition comprising:{'sub': '3', 'barium titanate (BaTiO) as a main ingredient and accessory ingredients,'}{'sub': '3', 'wherein the accessory ingredients include 1.0 to 2.0 mol % of barium carbonate (BaCO), 0.5 to 1.0 mol % of a rare earth oxide, 0.1 to 1.0 mol % of manganese oxide (MnO), and 1.0 to 2.0 mol % of borosilicate based glass, based on 100 mol % of the main ingredient, and'}{'sub': 2', '3', '2', '3', '2', '3', '2', '3, 'the rare earth oxide is at least one selected from the group consisting of YO, HoO, DyO, and YbO.'}2. The low-temperature sintering dielectric composition of claim 1 , wherein a ratio between the barium carbonate (BaCO) and the borosilicate based glass is in a range of 0.5 to 2.0.3. The low-temperature sintering dielectric composition of claim 2 , wherein the ratio between the barium carbonate (BaCO) and the borosilicate based glass is in a range of 0.5 to 1.5.4. The low-temperature sintering dielectric composition of claim 1 , wherein an average particle size of barium titanate (BaTiO) is 100 nm to 200 nm.5. The low-temperature sintering dielectric composition of claim 1 , wherein the borosilicate based glass contains boron oxide (BO) and silicon dioxide (SiO) as basic ingredients claim 1 , and further contains alkali-borosilicate based glass containing an alkali oxide claim 1 , and at least one of an alkali-earth metal oxide and an alkali-earth metal fluoride claim 1 , and{'sub': 2', '3', '2, 'when the sum of the number of moles of respective ingredients of the ...

Ceramic laminate and multilayer ceramic capacitor

A method of manufacturing a multilayer ceramic capacitor includes preparing a laminate by providing ceramic layers and internal electrode layers arranged in a stacking direction, and providing two or more exposure regions at which the internal electrode layers and the ceramic layer interposed between the internal electrode layers are both exposed, and transferring a first conductive paste to the laminate. In the preparing, forming the laminate to have a rectangular parallelepiped configuration or shape and to include two longitudinal end surfaces, and four surfaces orthogonal to the end surfaces and, on at least one of the four surfaces, a protrusion in which the exposure region protrudes outward. In the transferring, the first conductive paste is applied to a transfer jig including a groove, and the first conductive paste in the groove is transferred to a surface of the protrusion.

Multilayer ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

Ceramic capacitor and method for manufacturing same

A ceramic capacitor includes first and second first internal electrodes respectively including first and second extended portions that respectively include a plurality of ceramic columns penetrating the first and the second extended portions, respectively, in a thickness direction. The first extended portion includes a first high ceramic-column density portion in which ceramic columns are provided at intervals of about 20 μm or less along the length direction of the extended portion. The second extended portion includes a second high ceramic-column density portion in which ceramic columns are provided at intervals of about 20 μm or less along the length direction of the extended portion.

Ceramic electronic device and manufacturing method of ceramic electronic device

A ceramic electronic device includes a plurality of dielectric layers of which a main component is a ceramic having a perovskite structure, and a plurality of internal electrode layers, each of which is stacked through each of the plurality of dielectric layers and includes a co-material which is inactive against the main component of the plurality of dielectric layers.

Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon

There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Thin film capacitor

A thin film capacitor includes a body including a dielectric layer, a first internal electrode layer and a second internal electrode layer, a melting point of a material included in the first internal electrode layer being lower than a melting point of a material included in the second internal electrode layer, and a first external electrode and a second external electrode disposed on an upper surface of the body, the second internal electrode layer being disposed on an upper surface of the first internal electrode layer and a lower surface of the first internal electrode layer opposing the upper surface of the first internal electrode layer.

MULTILAYER CAPACITOR

A multilayer capacitor includes a body including a plurality of first and second internal electrodes alternately disposed with respective to dielectric layers interposed therebetween and having first to sixth surfaces, the first internal electrode being exposed to the third, fifth, and sixth surfaces of the body, and the second internal electrode being exposed to the fourth, fifth, and sixth surfaces of the body; first and second side portions disposed on the fifth and sixth surfaces of the body, respectively, and including first and second metal layers disposed therein; and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. 1. A multilayer capacitor comprising: a plurality of dielectric layers, and', 'a plurality of first and second internal electrodes alternately disposed with respect to dielectric layers interposed therebetween and having', 'first and second surfaces opposing each other,', 'third and fourth surfaces connected to the first and second surfaces and opposing each other, and', 'fifth and sixth surfaces connected to the first and second surfaces and the third and fourth surfaces and opposing each other;, 'a body includingwherein the first internal electrode is exposed to the third, fifth, and sixth surfaces of the body;the second internal electrode is exposed to the fourth, fifth, and sixth surfaces of the body;first and second side portions disposed on the fifth and sixth surfaces of the body, respectively, and including first and second metal layers disposed therein; andfirst and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively.2. The multilayer capacitor of claim 1 , wherein the first and second metal layers are formed of one or more metals having oxygen or moisture affinity claim 1 , selected from the ...

CAPACITOR COMPONENT

A capacitor component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween; a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth and sixth surfaces of the body, and respectively disposed on the fifth and sixth surfaces of the body; a first external electrode disposed on the third surface of the body and connected to the first internal electrode and the first margin electrode; and a second external electrode disposed on the fourth surface of the body and connected to the second internal electrode and the second margin electrode. 1. A capacitor component comprising:a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction, and including a first dielectric layer, and a first internal electrode and a second internal electrode disposed to oppose each other in the first direction with the first dielectric layer interposed therebetween;a first side margin portion and a second side margin portion, respectively including a second dielectric layer, a first margin electrode, and a second margin electrode, disposed in parallel with the fifth ...

Ceramic electronic device and manufacturing method of ceramic electronic device

A ceramic electronic device includes: a multilayer chip including a multilayer structure and cover layers, the multilayer structure having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic, the cover layers being provided on an upper face and a lower face of the multilayer structure in a stacking direction; and a pair of external electrodes that are formed on the two edge faces, wherein each of the external electrodes has a smaller thickness on a corner portion of the cover layers, has a crook toward the internal electrode layers, and has a larger thickness on an area of the two edge faces where the internal electrode layers are extracted.

DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME

A dielectric composition and a multilayer ceramic capacitor containing the same are provided. The dielectric composition contains an oxide of Ba and Ti as a main ingredient, and the main ingredient is represented by (Ba), (Na, Ca))TiO, where 0.005≦x≦0.035 and 0.994<(Ba(Na, Ca))/Ti<1.003. 1. A dielectric composition comprising an oxide of Ba and Ti as a main ingredient ,{'sub': 1-x', 'x', '3', '1-x', 'x, 'wherein the main ingredient is represented by (Ba(Na, Ca))TiO, where 0.005≦x≦0.035 and 0.994<(Ba(Na, Ca))/Ti<1.003.'}2. The dielectric composition of claim 1 , further comprising 0.1 to 1.0 mol % of a first accessory ingredient based on 100 mol % of the main ingredient claim 1 , wherein the first accessory ingredient is an oxide or carbonate of at least one among Mn claim 1 , V claim 1 , Cr claim 1 , Fe claim 1 , Ni claim 1 , Co claim 1 , Cu claim 1 , and Zn.3. The dielectric composition of claim 2 , further comprising 0.1 to 1.0 mol % of a second accessory ingredient based on 100 mol % of the main ingredient claim 2 , wherein the second accessory ingredient is an oxide or carbonate of at least one of Mg and Al.4. The dielectric composition of claim 3 , further comprising 0.1 to 1.0 mol % of a third accessory ingredient based on 100 mol % of the main ingredient claim 3 , wherein the third accessory ingredient is an oxide or carbonate of at least one among Ce claim 3 , Nb claim 3 , La claim 3 , and Sb.5. The dielectric composition of claim 4 , further comprising 0.1 to 1.0 mol % of a fourth accessory ingredient based on 100 mol % of the main ingredient claim 4 , wherein the fourth accessory ingredient is an oxide or carbonate of at least one of Si claim 4 , Ba claim 4 , Ca claim 4 , and Al.6. The dielectric composition of claim 4 , further comprising 0.1 to 1.0 mol % of a fourth accessory ingredient based on 100 mol % of the main ingredient claim 4 , wherein the fourth accessory ingredient is a glass compound containing Si.7. A multilayer ceramic capacitor comprising ...

ELECTRONIC COMPONENT

An electronic component is provided with an element body and terminal electrodes. The terminal electrodes include sintered metal layers and conductive resin layers. A first length, which is a length of the sintered metal layers in a first direction at end portions of a side surface in a second direction, is shorter than a second length, which is a length of the sintered metal layers in the first direction at central portions of the side surface in the second direction. A third length, which is a length of the conductive resin layers in the first direction at the end portions, is shorter than a fourth length, which is a length of the conductive resin layers in the first direction at the central portions. A difference between the fourth length and the third length is larger than a difference between the second length and the first length. 1. An electronic component , comprising:an element body which has a rectangular parallelepiped shape and includes a pair of end surfaces opposing each other and a side surface connecting the end surfaces to each other, in which internal conductors are exposed at the pair of the end surfaces; anda pair of terminal electrodes separated from each other in a first direction where the pair of end surfaces oppose and connected to the internal conductors, wherein sintered metal layers disposed at the end surfaces and the side surface, and', 'conductive resin layers entirely covering the sintered metal layers,, 'the terminal electrodes include'}a first length, which is a length of the sintered metal layers in the first direction at end portions of the side surface in a second direction orthogonal to the first direction, is shorter than a second length, which is a length of the sintered metal layers in the first direction at central portions of the side surface in the second direction,a third length, which is a length of the conductive resin layers in the first direction at the end portions, is shorter than a fourth length, which is a length ...