ВЫСОКОДИСПЕРСНЫЕ ЩЕЛОЧНОЗЕМЕЛЬНЫЕ ТИТАНАТЫ И СПОСОБЫ ИХ ПОЛУЧЕНИЯ С ИСПОЛЬЗОВАНИЕМ ЧАСТИЦ ОКИСИ ТИТАНА

... 1. Способ получения щелочноземельных титанатов путем реакции обмена щелочноземельных металлических соединений с частицами двуокиси титана в твердотельной реакции, отличающийся тем, что частицы двуокиси титана имеют удельную поверхность (ВЕТ) свыше 50 м/г, и обмен осуществляют при температурах ниже 700°С.2. Способ по п.1, отличающийся тем, что щелочноземельным соединением является гидроксид бария.3. Способ по п.2, отличающийся тем, что обмен осуществляют при 450°С, предпочтительно в интервале 350-450°С.4. Способ по п.1, отличающийся тем, что щелочноземельным соединением является нитрат бария.5. Способ по п.4, отличающийся тем, что обмен осуществляют при температурах ниже 650°С, предпочтительно в интервале 550-650°С.6. Способ по одному или нескольким из предыдущих пунктов, отличающийся тем, что частицы двуокиси титана содержат менее 1000 частиц на миллион галогенидов относительно TiO.7. Способ по п.1, отличающийся тем, что частицы двуокиси титана содержат менее 1000 частиц на миллион углерода ...

Wassergekuehlter Keramikrohrkondensator

Verfahren zur Herstellung duennwandiger Keramikkoerper

BEI NIEDRIGER TEMPERATUR GESINTERTER KERAMISCHER KONDENSATOR MIT HOHEM WIDERSTAND UND BIEGEFESTIGKEIT, UND VERFAHREN ZU SEINER HERSTELLUNG.

Verfahren zur Herstellung eines Filmkondensators.

DIELEKTRISCHE ZUSAMMENSETZUNG.

Dielelektrisches Keramikmaterial und monolithisches keramisches Elektronikelement

Dielektrisches keramisches Material, das BaTiO¶3¶ als Primärbestandteil und ein Seltenerdelement als Zusatzbestandteil enthält, worin das Material der Relation 0,7 M/N entspricht, so daß die Dichte des Seltenerdmetalls zwischen den Kristallkörnern einheitlich wird, und das Material der Relation 0,8 L/M entspricht, so daß die Dichte des Seltenerdmetalls in einem Kristallkorn einheitlich wird. In diesen Relationen bezeichnet N die Anzahl der der Relation 0,5 D¶i¶/D entsprechenden Kristallkörner, N bezeichnet die Anzahl der das Keramikmaterial bildenden Kristallkörner und L bezeichnet die Anzahl der den Relationen 0,5 D¶i¶/D und S¶i¶/D¶i¶ 0,3 entsprechenden Kristallkörner, worin D¶i¶ die mittlere Dichte des Seltenerdelements in einem beliebigen Kristallkorn i, D die mittlere Dichte des Seltenerdelements im gesamten Keramikmaterial und S¶i¶ die Standardabweichung der Dichte des Seltenerdelements im Kristallkorn i bezeichnet.

Stoff zur Herstellung dielektrischer Filme

Dielectric ceramic composition for production of laminated capacitors

Dielectric composition for production of laminated capacitors having formula: (Ba1-xCaxO)mTiO2 + alpha Re2O3 + beta MgO + psi MnO Re2O3 is at least one or more of compounds Y2O3, Gd2O3, TbO3, Dy2O3, Ho2O3, Er2O3 and Yb2O3, alpha , beta , psi , m and x are molar ratio where 0.10 \- alpha \- 0.001, 0.12 \- beta \- 0.001, 0.12 \- psi \- 0.001, 1.035 \- m \> 1.000 and 0.22 \- x \> 0.005, and contains 0.2 - 5.0 parts by weight of first component of Li2O-(Si,Ti)O2-MO based oxide where MO is Al2O3 or ZrO2, and second sub-component of SiO2-TiO2-XO based oxide where XO is BaO, CaO, SrO, MgO, ZnO or MnO.

Elektrisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines elektrischen Bauelements sowie einer Bauelementanordnung

Es wird ein elektrisches Bauelement (1) zur Einbettung in einen Träger (9) angegeben. Das Bauelement weist einen keramischen Grundkörper (2), eine elektrisch isolierende Passivierungsschicht (4), die auf dem Grundkörper (2) aufgebracht ist, und wenigstens eine Innenelektrode (3) auf. Zudem weist das Bauelement (1) eine Außenelektrode (5) auf, die mit der Innenelektrode (3) verbunden ist, wobei die Außenelektrode (5) eine erste Elektrodenschicht (6) aufweisend ein Metall und eine darauf angeordnete zweite Elektrodenschicht (7) aufweisend Kupfer aufweist.

LOW TEMPERATURE SINTERED CERAMIC CAPACITOR WITH HIGH DC BREAKDOWN VOLTAGE, AND METHOD OF MANUFACTURE

Dielectric material and capacitor comprising the dielectric material

A dielectric material suitable for use in an electronic component includes bismuth ferrite (BiFeO3); strontium titanate (SrTiO3) and an additive of barium titanate (BaTiO3). The barium titanate reduces the temperature capacitance change of the dielectric material and allows for increased working voltages. The material is useful for the construction of capacitors, and particularly capacitors intended for use at high temperatures. Also provided are a capacitor including the dielectric material, methods of manufacturing the dielectric material and the capacitor, and the use of an additive to improve the lifetime and/or reduce the dissipation factor of a capacitor. The capacitor 100 comprises a first electrode 12, a second electrode 14 and a capacitive layer 16 of the dielectric material. The dielectric material can be formed into the capacitive layer 16 by sintering a powder or sintering a slurry containing the powder.

Improvements in and relating to electric condensers

... 648,866. Condensers; electrophoretic coating. DENES, P. Dec. 31, 1947, No. 35379. Convention date, May 11, 1943. [Classes 37 and 41] [Also in Group VIII] A condenser is made by coating a metal with a layer of finely-distributed ceramic material of very low vitrification and with a sintering temperature lower than the melting point of the metal foil and by sintering together the foil and ceramic layer. The sintering is effected in vacuo, in a neutral or reducing atmosphere at atmospheric or higher temperature or in an atmosphere containing 4 per cent of oxygen, or at atmosphoric or increased pressure. The foil is a metal or alloy of low permeability, e.g. iron, nickel, cobalt or chromium and the ceramic which may consist wholly or mainly of rutile or of zirconium dioxide, magnesium titanate or steatite, is applied by spraying or electrophoresis. Three metal ribbons may be passed each under a roller in the same or separate basins containing a ceramic suspension. Each ribbon passes between ...

Dielectric ceramic composition and monolithic ceramic component

Microwave dielectric composition

A low temperature sintering microwave dielectric composition which can be sintered at a temperature of below 1250* superscript 0 *C includes a composition of xLiO 1/2 -yCaO- z SmO 3/2 -wTiO 2 -qBO 3/2 where 13.OO* less than or equal to *x* less than or equal to *16.00, 11* less than or equal to *y* less than or equal to *13.OO, 18.OO* less than or equal to *z* less than or equal to *21.OO, 45.00* less than or equal to *w* less than or equal to *51.00 and 0 Подробнее

Glass compositions and capacitors employing the compositions

A glass consists essentially, in per cent by weight, of: PbO, 30-50; SiO2, 23-36; B2O3, 4-13; K2O, 3.5-6.5; Na2O, 2-5; TiO2, 2-6; ZnO, 1-6; BaO, 2-10; Al2O3, 0-5; Li2O, 0-5; V2O5, 0-3; As2O3, 0-1; Co2O3, 0-0.1. If Co2O3 is present, the glass is blue. The glass may be formed into plates or rods or coated on sheets, e.g. of metal, as thin films. Silver electrodes may be painted on to discs of he glass. Sheets, e.g. of Al, may be dipped into a slip of fine particles of the glass in a volatile liquid vehicle, e.g. alcohol, and fired at 600 DEG C. A second coating may then be applied. The slip is formed by pouring the molten glass into water or air to form a frit, which is then ball-milled in the vehicle. A capacitor 10 may be constructed from two core assemblies 11, 12, formed from Al plates 13, 14 with coatings 15, 16 of the glass. A portion of each plate 13, 14 is left uncoated, and terminal tabs may be attached thereto, or, as shown, uncoated terminal tabs 17, 18 may ...

Process film for use in producing ceramic green sheet and method for production thereof

A process film for use in producing a ceramic green sheet having a base film, an under coating layer and a cured layer, characterized in that the under coating layer comprises a condensation polymer of a metal alkoxide and/or a partially hydrolyzed product of a metal alkoxide, and the cured layer is prepared by heating an addition reaction type silicone resin composition containing a light sensitizer being applied at a rate of 0.01 to 0.3 g/m<2> in terms of solids at a temperature of 40 to 120{C and then curing the resultant layer by an ultraviolet ray irradiation. The process film, which is suitably used in producing a ceramic green sheet for a ceramic condenser, a laminated inductor element or the like, has a cured layer of a silicon resin composition exhibiting good adhesion to a base film, is excellent in the applicability of a ceramic slurry and the releasability of a ceramic green sheet, and exhibits a high degree of flatness which has not seen conventionally and improved antistatic ...

Dielectric ceramic composition and laminated ceramic condenser

Dielectric ceramic composition and capacitor using the same

Monolithic ceramic electronic component and ceramic paste

A process for producing a monolithic ceramic electronic components, e.g. a capacitor or inductor includes: forming a plurality of composite structures 6 each comprising a ceramic green sheet 2 produced by shaping a ceramic slurry, internal circuit element films 1 formed by applying a conductive paste partially onto a main surface of the sheet so as to provide step-like sections defining spaces, and a ceramic green layer 5, the layer being formed by applying the ceramic paste onto the surface of the sheet to compensate for the spaces; forming a green laminate from the structures and firing the laminate. The ceramic paste comprises a ceramic powder, an organic solvent and a binder which is a mixture of a cellulose ester and a polyacrylate.

Wound ceramic capacitor

A wound ceramic capacitor is produced by the process of forming first 23 and second 24 inner electrodes alternately and separated by insulating gaps 22 on one surface of a single ceramic green sheet 27, rolling the ceramic green sheet with the inner electrodes formed thereon, whereby the first and second inner electrodes oppose each other with the ceramic green sheet intervening therebetween, firing the rolled ceramic green sheet, and electrically connecting first and second outer terminals to the first and second inner electrodes, respectively. The ceramic capacitor can attain small size for large capacitance. ...

Monolithic ceramic electronic component and production process therefor, and ceramic paste and production process therefor

Lightning energy storage system

A system for collecting and/or storing electrical energy in lightning comprises a lightning rod, a wire 102, a lightning energy harvester, and a ground rod 104. The lightning rod is configured to attract lightning and transfer electrical energy. The lightning energy harvester incorporates at least one magnetic capacitor 200 and a switch 2602. The ground rod is connected to the wire. A control signal controls the switch to direct the electrical energy to ground through the ground rod or to direct the electrical energy to charge the magnetic capacitor, in response to a charging state of the magnetic capacitor. A transformer 2603 may be provided to adjust the voltage of the electrical energy to charge the magnetic capacitor. A detector 2601 may be provided to detect the charging state of the capacitor and issue a control signal accordingly. A plurality of capacitors may be provided, connected in parallel.

An electric capacitor

An electrical capacitor comprises a ceramic disc shaped dielectric body (1) having a corrugated centre region (2) on which two metal coating layers (4,5) are formed, one on each side of the dielectric body (1), the coating layers being separated from each other by a metal-free bead-like edge (3) of the dielectric body (1). ...

Termination of hermetically sealed glass-encapsulated ceramic capacitors

An improved hermetically sealed glass encapsulated monolithic ceramic capacitor in which a metallurgical bond between the capacitor termination and the end cap of its lead is effected by means of brazing.

Method for producing barium titanate powder

Dielectric ceramic composition and laminated ceramic capacitor using the same

MULTI-LAYER CERAMIC CAPACITOR AND PROCEDURE FOR THE CONTROLLING THE EQUIVALENTS OF THE PRE-RESISTOR

FIXED CAPACITOR AND ITS MANUFACTURING PROCESSES

ELECTRONIC EQUIPMENT, DIELECTRIC CERAMIC COMPOSITION AND PROCEDURE FOR THE PRODUCTION

KONDENSATORDIELEKTRIKUM MIT INNEREN SPERR- SCHICHTEN UND VERFAHREN ZU SEINER HERSTELLUNG

CERAMIC COMPONENT ELEMENT AND MANUFACTURING PROCESS FOR IT

DIELECTRI CERAMIC COMPOSITION, CONDENSER THIS USING AND MANUFACTURING PROCESSES

CERAMIC(S) CHIP ARRANGEMENT

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE

FERROUSELECTRICAL CERAMIC MATERIAL.

PROCEDURE FOR THE PRODUCTION OF METALLIC POWDER BY THERMAL DECOMPOSITION

CONDUCTIVE PASTE FOR TERMINAL ELECTRODE OF A CERAMIC MULTI-LAYER ELECTRONICS CONSTRUCTION UNIT

ELECTRO-CHEMICAL ENERGY DEVICE WITH LEADING CERAMIC FIBERS

Annular capacitor RF, microwave and MM wave systems

The present invention includes a method for creating an annular capacitor adjacent to via or imbedded metal structure allowing for device to be made in close proximity to the via connecting to a ground plane. The annular capacitor in close proximity to the metal filled via or imbedded metal structure allows the construction of capacitors, filters, or active devices enabling a smaller RF device and/or to shunt a signal to the integrated ground plane. This reduces the RF, Electronic noise and results in a reduced device size.

A method for forming ceramic film capacitors

Electrical energy devices using conductive ceramic fibers

THIN TAPE FOR DIELECTRIC MATERIALS

An improved, flexible, strong, thin precursor green tape for dielectric ceramics is described. The tape is prepared from a cellulosic resin of specific characteristics. The tape is especially useful in the preparation of multilayer capacitors and related electronic devices. 32,773A-F ...

DIELECTRIC COMPOSITION

DIELECTRIC COMPOSITIONS A high capacitance dielectric powder composition consisting essentially of finely divided particles of (a) 92-99% w BaTiO3 and (b) 8-1% wt. of a sintering aid consisting essentially of Pb or Li fluoride and optionally one or more oxides of Bi, Zn and Pb or precursors thereof.

PRINTED CIRCUIT COMPRISING AT LEAST ONE CERAMIC COMPONENT

L'invention concerne un circuit imprimé comportant un support (1 ) sur lequel est fixé au moins un composant céramique (2, 3, 4) de façon à permettre l'évacuation de la chaleur produite par le composant céramique (2, 3, 4), et à éviter les fissures dans le composant céramique (2, 3, 4) et dans le support (1 ). Pour ce faire, le composant céramique (2, 3, 4) est fixé au support (1 ) par l'intermédiaire de deux connecteurs (5, 6) en matériau composite à matrice métallique. Ces deux connecteurs sont en outre de préférence incisés pour permettre un report des contraintes mécaniques qui s'exercent dans le support dans les connecteurs.

MULTI-LAYERED CERAMIC ELEMENTS AND METHOD FOR PRODUCING SAME

A multi-layered ceramic element which comprises a plurality of films or thin plates of ceramic and a plurality of inner electrodes which are alternatively arranged in layers, wherein the ends of the inner electrodes are exposed at side end faces of the multi-layered assembly and only the exposed portions of the inner electrodes and the ceramic surface in the vicinity of the exposed portions of the electrodes are covered with an insulating layer which comprises a polyimide resin having repeating units represented by the following general formula (I): ( I ) wherein X represents a tetravalent group selected from the group consisting of tetravalent phenyl groups; tetravalent biphenyl groups; and tetravalent polyphenyl and polybiphenyl groups in which at least one of either the phenyl groups or biphenyl groups are bonded through at least one member selected from the group consisting of O, CO, S, SO2, CH2, C(CH3)2 and C(CF3)2 and Y represents a bivalent group selected from the group consisting ...

Elektrische Kondensatoreinrichtung.

Wassergekühlter Keramikkondensator

Condensateur électrique

Verfahren zur Herstellung eines glasartigen Dielektrikums

Condenser

Multilayer ceramic capacitor

Multilayer ceramic capacitor and circuit board for mounting the same

A multilater ceramic capacitor includes: a ceramic body in which a plurality of dielectric layers are laminated; and an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layer interposed therebetween, and forming capacitance. An upper cover layer is formed on an upper portion of the active layer; a lower cover layer is formed on a lower portion of the active layer and having a thickness greater than that of the upper cover layer. First and second external electrodes cover both end surfaces of the ceramic body. Specific sizing of ceramic body and electrodes is defined.

COMPOSITE ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND POWER SMOOTHER INCLUDING THE SAME

Electronic-component production method and electronic-component production device

Ceramic electronic component and manufacturing method thereof

Comprising at least a ceramic printed circuit board

Carbon coated metal powder, containing carbon coated metal powder of the conductive paste and using the same laminated electronic component

The multi-layer ceramic electronic part and its preparation method

Multilayer ceramic electronic component, manufacturing method thereof and circuit board with same

Electronic component

Method for manufacturing multilayer electronic component

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

Improvements brought to the electric condensers

잉크젯용 잉크, 인쇄방법 및 세라믹 전자부품

... 잉크젯 인쇄 가능한 점도 특성, 안정 인쇄할 수 있는 침강 억제 특성, 인쇄 후에 번지기 어려운 특성과 같은 3가지 특성 모두를 만족하는 잉크젯용 잉크를 제공한다. 예를 들면 적층 세라믹 콘덴서(1)의 내부전극(4, 5)을 잉크젯 인쇄에 의해 형성할 때에 적합하게 사용될 수 있는 잉크이며, BET 환산 입경 50~1000㎚인 기능성 입자와, BET 환산 입경 4~40㎚인 리올로지 조정용 입자와, 유기 비이클을 포함하고, 전단 속도 1000s-1에서의 점도가 1~50mPa·s이면서, 전단 속도 0.1s-1에서의 점도가, 식: η=(D)2×ρ/104/2+80[단, η는 전단 속도 0.1s-1에서의 점도(mPa·s), D는 기능성 입자의 BET 환산 입경(㎚), ρ는 기능성 입자의 비중]에 의해 산출되는 점도η 이상이다.

MULTILAYER CERAMIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Package type multi layer thin film capacitor for high capacitance

적층 세라믹 전자부품, 그 제조방법 및 전자부품이 실장된 회로기판

... 본 발명의 일 실시형태는 유전체층 및 내부전극을 포함하며, 제1 방향으로 서로 마주보는 제1 면 및 제2 면, 제2 방향으로 서로 마주보는 제3 면 및 제4 면, 제3 방향으로 서로 마주보는 제5 면 및 제6 면을 갖는 세라믹 본체, 상기 내부전극과 연결되는 메인부 및 상기 메인부로부터 연장되는 연장부를 포함하는 바탕 전극층 및 상기 연장부의 단부가 노출되도록 상기 바탕 전극층 상에 배치되는 수지 전극층을 포함하며, 상기 연장부의 폭은, 상기 연장부의 폭 방향과 평행한 방향으로 측정한 상기 연장부가 배치된 세라믹 본체 외면의 폭보다 작은 적층 세라믹 전자부품을 제공한다.

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

적층 세라믹 콘덴서, 적층 세라믹 콘덴서의 실장구조 및 테이핑 연속 전자부품

... 적층된 복수의 유전체층과 복수의 내부전극을 포함하는 적층체와, 한 쌍의 외부전극을 포함한다. 적층체에 있어서, 폭치수는 두께치수보다도 크고, 길이치수는 0.4㎜ 이하이며, 폭치수는 0.15㎜ 이상 0.35㎜ 이하이고, 두께치수는 0.2㎜ 이하이며, 내부전극은 Cu 또는 Ag를 주성분으로 하여 내부전극의 폭치수가 적층체의 폭치수의 60% 이상이다.

복합 전자 부품

... 접합되는 복수의 전자 부품 중 기판형의 전자 부품에서의 상면 도체끼리의 절연 저항의 저하를 억제할 수 있는 복합 전자 부품을 제공한다. 복합 전자 부품(1A)은 제1 전자 소자(20A)와, 제2 전자 소자(10)와, 접합재(31)를 포함한다. 제1 전자 소자(20A)는, 기부(21)와 기부(21)의 상면(21a)에 마련된 상면 도체(24A)를 갖는다. 제2 전자 소자(10)는, 기부(21)의 상면(21a)에 대향하는 하면(11a)을 갖는 소자 본체(11)와, 소자 본체(11)의 하면(11a)에 마련된 단자 도체(14A)를 갖는다. 접합재(31)는 상면 도체(24A)와 단자 도체(14A)를 접합한다. 상면 도체(24A)는, 중량비에서 최대의 금속 성분이 Ag인 도전층(24a)을 포함한다. 도전층(24a)의 측면(24a1)은, 보호 금속막으로서의 도전층(24b, 24c)에 의해 덮이고, 보호 금속막으로서의 도전층(24b, 24c)에 함유된 중량비에서 최대의 금속 성분은 Ag 및 Cu 이외이다.

LAMINATED CERAMIC CONDENSER AND A MANUFACTURING METHOD THEREOF FOR PRODUCING A PLURALITY OF LAMINATED CERAMIC CONDENSERS BY PRINTING A STRIPPED INNER ELECTRODE PATTERN

PURPOSE: A laminated ceramic condenser and a manufacturing method thereof are provided to obtain the connectivity of patterns since an inner electrode pattern is formed to cover a dielectric layer when the inner electrode pattern of a thin film and a ceramic green sheet are laminated. CONSTITUTION: A plurality of dielectric layers is laminated on a main body. First and second outer electrodes are respectively formed on a first side surface and a third side surface. A first internal electrode pattern(30A) maintains a predetermined interval from the third side surface. A second internal electrode pattern(30B) maintains a predetermined interval from the first side surface. First and second side part are formed on the second side surface and a fourth side surface which face each other by respectively spraying ceramic slurry. COPYRIGHT KIPO 2012 ...

적층 세라믹 콘덴서 및 그 제조 방법

... 본 발명은, 내부 전극 간의 쇼트의 발생을 억제할 수 있는 적층 세라믹 콘덴서 및 그 제조 방법을 제공하는 것을 과제로 한다. 적층체와 사이드 마진부를 갖는 적층 세라믹 콘덴서는, 오프셋부를 구비한다. 상기 적층체는, 교대로 적층된 내부 전극과 유전체층을 갖는다. 상기 사이드 마진부는, 유전체에 의해 구성되고, 상기 적층체의 측면을 덮도록 형성되어 있다. 상기 오프셋부는, 비정질 영역 또는 공극 영역을 포함한다. 상기 오프셋부는, 상기 내부 전극의 상기 측면측의 단부를 상기 측면으로부터 상기 적층체의 내측 방향으로 오프셋시키도록, 상기 내부 전극과 상기 사이드 마진부의 사이에 형성되어 있다.

EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART

DIELECTRIC PASTE FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING MULTILAYER UNIT FOR MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

STACKED CERAMIC CONDENSOR

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT

The present invention provides a dielectric ceramic composition including a first main composition represented as a composition formula, (Ba_1-x-y, Ca_x, A1_y)_m(Ti_1-z-a, Zr_z, B1_a)O_3; a second main composition represented as a composition formula, (Ba_1-α, A2_α)_n(Ti_1-β, B2_β)O_3; and a first auxiliary ingredient consisting of bismuth oxide. A configuration of each main composition, a ratio of content of the first main composition and the second main composition, and content of the first auxiliary ingredient are within a specific range. The purpose of the present invention is to provide a dielectric ceramic composition having high relative dielectric constant and alternating current breakdown voltage, low dielectric loss, and excellent temperature properties and sinterability. COPYRIGHT KIPO 2016 ...

MULTI-LAYERED CERAMIC ELECTRONIC PART

According to an embodiment of the present invention, provided is a multi-layered ceramic electronic part, comprising: a ceramic body in which a plurality of internal electrodes and a plurality of dielectric layers are laminated alternatively in a thickness direction; and an external electrode comprising an electrode layer formed on the outer surface of the ceramic body to be connected to the internal electrode, a conductive resin layer including a metal particle and a base resin formed on the electrode layer, and a plating layer formed on the conductive resin layer. Wherein, the minimum distance of an external surface of the external electrode from a point connecting the external electrode and the electrode layer arranged on the outermost layer in the laminated direction of the internal electrode is a. The length of a region passing through the conductive resin layer among the straight lines at the time of assuming a virtual straight line for forming the minimum distance is b. The length ...

CAPACITOR

The present invention relates to a capacitor. Especially, the capacitor includes an electrode layer which includes a first electrode layer and a second electrode layer formed on a dielectric layer. The first electrode layer and the second electrode layer are separated from each other. At least part of the first electrode layer and the second electrode layer is arranged on the same surface. Thereby, the capacitor can facilitate a process of applying electricity. The capacitor can be easily manufactured by allowing the first and second electrode layers to function as electrodes charged with different polarities. The capacitor of a simple structure can be obtained. COPYRIGHT KIPO 2016 ...

연속식 열처리로 및 그것을 사용한 세라믹 전자 부품의 제조 방법

... 연속식 열처리로(HF1)에서는 반송 방향(b)을 따라 워크의 열처리를 행하는 열처리 영역(H)이 형성되어 있다. 워크는 열처리 영역(H)을 반송하면서 열처리된다. 워크를 반송하기 위한 워크 반송 기구(100)는 상방에 개구부를 갖는 상자형상의 베이스 프레임(1)과, 다공질 플레이트(2)와, 다공질 플레이트(2)가 베이스 프레임(1)의 개구부를 덮음으로써 형성된 기실(3)과, 기실(3)과 연통하고, 다공질 플레이트(2)를 투과해서 유출하는 기체(g)를 기실(3)에 공급하는 기체 공급 수단(4)을 구비하고 있다. 다공질 플레이트(2)는 상면(2a)이 워크의 반송 방향을 향해서 내리막 경사가 되도록 배치되어 있으며, 또한 상면(2a)에 워크(W)의 반송 방향을 따른 홈(2t1~2t10)이 형성되어 있다.

MULTILAYER CAPACITOR AND MANUFACTURING METHOD THEREOF

The present invention relates to a multilayer capacitor with improved capacitance and a manufacturing method thereof. According to the present invention, the multilayer capacitor comprises: a first group electrode including n + 1 (wherein, n is a natural number of two or more) capacitor electrodes overlapped with each other along a first direction to be stacked and connected with each other in a first side part which is one end part of a second direction intersecting the first direction; a second group electrode including n capacitor electrodes placed between two capacitor electrodes of the first group electrode faced with each other and connected with each other in a second side part facing the first side part in the second direction; and a dielectric layer filling all separation areas where the first and the second group electrode are faced with each other. COPYRIGHT KIPO 2016 ...

Multi-layered ceramic electronic component

MULTI-LAYERED CERAMIC CAPACITOR

MULTI-LAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

CERAMIC CAPACITOR AND METHODS OF MANUFACTURE

MULTILAYER CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

The present invention relates to a multilayer ceramic electronic component capable of improving breakdown voltage (BDV), controlling relaxation time, having high capacity, and being miniaturized. The multilayer ceramic electronic component comprises: a ceramic body in which a first dielectric layer having one side on which a first inner electrode is disposed and a second dielectric layer having one side on which a second inner electrode is disposed are alternately laminated; a first outer electrode disposed on a first surface of the ceramic body and connected with the first inner electrode; and a second outer electrode disposed on a second surface of the ceramic body and connected with the second inner electrode. The first inner electrode is exposed to the first surface of the ceramic body. The second inner electrode is exposed to the second surface of the ceramic body. The first inner electrode and the second electrode are not overlapped in a direction in which the first dielectric layer ...

MULTI-LAYER CERAMIC ELECTRONIC DEVICE

Multi-layered ceramic electronic component and method for manufacturing the same

Multi-layered ceramic electronic component

MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND CIRCUIT BOARD MOUNTING ELECTRONIC COMPONENT

According to an embodiment of the present invention, provided is a multi-layered ceramic electronic component which comprises: a ceramic main body including a dielectric layer and an inner electrode, and having first and second surfaces facing each other in a first direction, third and fourth surfaces facing each other in a second direction, and fifth and sixth surfaces facing each other in a third direction; a bottom electrode layer including a main unit arranged in an outer surface of the ceramic main body, and including an extension unit extended from the main unit; a resin electrode layer arranged on the bottom electrode layer to expose an end unit of the extension unit. The width of the extension unit is smaller than the width of the outer surface of the ceramic main body where the extension unit measured in a direction parallel to a width direction of the extension unit is arranged. COPYRIGHT KIPO 2016 ...

Ceramic electronic component and wiring board

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Ceramic electronic component

A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thickness direction. The volume proportion of the plurality of first reinforcement layers in a region of the ceramic body in which the plurality of first reinforcement layers are provided is greater than the volume proportion of the first and second internal electrodes in an effective portion.

Reduction-resistant dielectric composition and ceramic electronic component including the same

There are provided a reduction-resistant dielectric composition and a ceramic electronic component including the same. The reduction-resistant dielectric composition may include a BaTiO 3 -based matrix powder, 0.1 to 1.0 moles of a transition metal oxide or transition metal carbonates, based on 100 moles of the matrix powder, and 0.1 to 3.0 moles of a sintering aid including silicon oxide (SiO 2 ). The ceramic electronic component including the reduction-resistant dielectric composition may have a high capacitance and superior reliability.

Dielectric ceramic and laminated ceramic capacitor

A dielectric ceramic and a laminated ceramic capacitor using the dielectric ceramic are achieved which provide favorable thermal shock resistance without damaging properties or characteristics such as dielectric properties, insulation properties, temperature characteristics, and characteristics in high temperature loading, even when the dielectric layers are reduced in thickness and the number of stacked layers increased. The dielectric ceramic contains, as its main constituent, a barium titanate based compound represented by the general formula ABO 3 , and a crystalline oxide containing Al, Mg, and Si is present as secondary phase grains in the dielectric ceramic.

Laminate type ceramic electronic component and manufacturing method therefor

In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %.

Stacked structure and method of manufacturing the same

[Problem to be Solved] A problem to be solved is to provide a stacked structure and a method of manufacturing the same that make generation of insulation breakdown unlikely, while providing a high dielectric constant and a high quality. [Means for Solving Problem] A stacked structure according to the present invention is a stacked structure in which a dielectric layer 3 is provided between a first conductive layer 1 and a second conductive layer 2 . The dielectric layer 3 includes a dielectric film 31 formed on the first conductive layer 1 , and a dielectric particle film 32 formed by applying a dispersion solution containing dielectric particles onto the dielectric film 31 . A method of manufacturing the stacked structure according to the present invention includes a dielectric layer forming step of forming the dielectric layer 3 on the first conductive layer 1 , and a conductive layer forming step of forming the second conductive layer 2 on the dielectric layer 3 . The dielectric layer forming step includes a dielectric film forming step of forming the dielectric film 31 on the first conductive layer 1 , and a particle film forming step of forming the dielectric particle film 32 by applying a dispersion solution containing dielectric particles onto the dielectric film 31.

Dielectric composition having high dielectric constant, multi layered ceramic condensers comprising the same, and method of preparing for multi layered ceramic condensers

A dielectric composition having a high dielectric constant, multi layered ceramic condensers comprising the same, and a method of preparing for multi layered ceramic condensers. The dielectric composition includes: a compound represented by general formula (Ba 1-X Ca x ) m (Ti 1-y Zr y )O 3 (0.995≦m≦1.010, 0.001≦x≦0.10, 0.001, 0.001≦y≦0.20) as a main component; an Al oxide as a first sub-component; at least one metal selected from a group consisting of Mg, Sr, Ba, Ca, and Zr and the salt thereof, as a second sub-component; at least one metal selected from a group consisting of Sc, Y, La, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu and the salt thereof, as a third sub-component; at least one metal selected from a group consisting of Cr, Mo, W, Mn, Fe, Co, and Ni and the salt thereof, as a fourth sub-component; and a fifth sub-component selected from Si containing glass forming compounds.

Conductor paste for rapid firing

The present invention provides a conductor paste for rapid firing that is applied to a ceramic green sheet and is fired along with the green sheet under high-rate temperature rise conditions at a high heating rate of at least 600° C./hr from room temperature to the maximum firing temperature. The paste includes as a conductor-forming powder material: a conductive metallic powder comprising, as a main component, nickel powder; and barium titanate ceramic powder with a mean particle diameter of 10 nm to 80 nm as an additive. The ceramic powder content is 5 to 25 mass parts per 100 mass parts of the conductive metallic powder.

Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component using the same

Disclosed are a method of manufacturing multilayer ceramic electronic components and a multilayer ceramic electronic component using the same. There is provided a method of preparing a plurality of ceramic layers including a first side, a second side, a third side, and a fourth side; printing a first inner electrode pattern and a second inner electrode pattern on the ceramic layers, the first inner electrode pattern and the second inner electrode pattern being exposed to the first side or the third side and having concave portions in the second side and fourth side directions; and stacking and compressing the plurality of ceramic layers printed with the first inner electrode pattern and the second inner electrode pattern.

Multilayer ceramic condenser and method of manufacturing the same

A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.

Electronic Device and Method for Manufacturing the Same

A highly reliable electronic device that prevents entry of a plating solution via an external electrode and entry of moisture of external environment inside thereof, and generates no soldering defects or solder popping defects which are caused by precipitation of a glass component on a surface of the external electrode. The electrode structure of the electronic device is formed of Cu-baked electrode layers primarily composed of Cu, Cu plating layers formed on the Cu-baked electrode layers and which are processed by a recrystallization treatment, and upper-side plating layers formed on the Cu plating layers. After the Cu plating layers are formed, a heat treatment is performed at a temperature in the range of a temperature at which the Cu plating layers are recrystallized to a temperature at which glass contained in a conductive paste is not softened, so that the Cu plating layers are recrystallized.

Dielectric protective layer for a self-organizing monolayer (sam)

The invention relates to a dielectric protective layer in which nanoparticles are integrated to increase the dielectric constants. Said nanoparticles are surrounded by a protective shell to prevent agglomeration in order to maintain the small particle size for the depositioning of extra-thin film.

Method for producing perovskite type composite oxide

A method is provided which includes a reaction step of reacting at least titanium oxide, a calcium compound, and barium hydroxide in a slurry solution so as to produce a perovskite-type composite oxide. The perovskite-type composite oxide is represented by (Ba 1-x Ca x ) m TiO 3 , and x is within a range of 0<x≦0.125. In addition, the method provides a perovskite-type composite oxide in which a water-soluble calcium compound is used as the calcium compound, and when the perovskite-type composite oxide is represented by (Ba 1-x Ca x ) m TiO 3 , x is within a range of 0<x≦0.20.

Nanomaterial-based films patterned using a soluble coating

A film can be patterned with a nanomaterial. Such patterning can, in various embodiments, be performed by applying a uniform mixture of a solute in a solvent to a surface of the film to form a coating of a soluble material on the surface of the film in a pre-defined pattern that defines coated parts of the film and uncoated parts of the film, depositing an aqueous dispersion, including the nanomaterial and a surfactant, on the defined coated and uncoated parts of the film, washing the film to remove the coating of the soluble material and the nanomaterial from the defined coated parts of the film, but not removing the nanomaterial from the defined uncoated parts of the film, along with removing the surfactant from the defined coated and uncoated parts of the film, and leaving a pattern of the nanomaterial on the defined uncoated parts of the film.

Multilayer ceramic capacitor and method of manufacturing the same

The present invention relates to a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side; a plurality of inner electrodes formed within the ceramic body and having respective one ends exposed to the third side and the fourth side; and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A shortest distance from distal edges of an outermost inner electrode among the plurality of inner electrodes to the first side or the second side is smaller than a shortest distance from distal edges of a central inner electrode to the first side or the second side.

Multilayer ceramic capacitor and method of manufacturing the same

Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a multilayer ceramic capacitor, including: preparing a plurality of dielectric layers including a first ceramic powder and a first binder; applying an electrode paste including a conductive powder and a second binder to the plurality of dielectric layers to form a plurality of first inner electrode patterns and second inner electrode patterns exposed to different surfaces of the plurality of dielectric layers; forming a multilayer body by stacking the plurality of dielectric layers; and applying ceramic slurry including a second ceramic powder and a solvent without compatibility with the first binder or the second binder to at least one surface of the multilayer body to form a margin part.

Multilayer ceramic electronic component

A multilayer ceramic electronic component that is small, that has high electrical strength, and that is resistant to separation between ceramic layers includes a ceramic sintered body having a substantially rectangular parallelepiped shape and a plurality of first and second internal electrodes. The plurality of first and second internal electrodes are alternately arranged so as to face each other. The first and second internal electrodes are parallel or substantially parallel to first and second major surfaces. The first and second internal electrodes are exposed to at least one of the fifth and sixth surfaces and are not exposed to the third or fourth surface. No bends exist in any of the ends of each of the first and second internal electrodes adjacent to the third and fourth surfaces.

Dielectric ceramic composition and ceramic electronic device

A dielectric ceramic composition comprises barium titanate as a main component, and as subcomponents, 1.00 to 2.50 moles of an oxide of Mg, 0.01 to 0.20 mole of an oxide of Mn and/or Cr, 0.03 to 0.15 mole of an oxide of at least one element selected from a group consisting of V, Mo and W, 0.20 to 1.50 mole of an oxide of R1 where R1 is at least one selected from a group consisting of Y and Ho, 0.20 to 1.50 mole of an oxide of R2 where R2 is at least one selected from a group consisting of Eu, Gd and Tb and 0.30 to 1.50 mole of an oxide of Si and/or B, in terms of each oxide with respect to 100 moles of the barium titanate.

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius.

Electronic component

A laminated ceramic capacitor includes a rectangular solid-shaped electronic component element. External electrodes of terminal electrodes are disposed at one end surface and the other end surface of the electronic component element. First plated films including a Ni plating are disposed on the surfaces of external electrodes. On the surfaces of the first plated films, second plated films containing Sn are disposed as Sn-plated films defining outermost layers of the external electrodes. The second plated films have a polycrystalline structure, and flake-shaped Sn—Ni alloy grains are located at a Sn crystal grain boundary and within a Sn crystal grain, respectively.

High dielectric film

The present invention provides a high dielectric film comprising: a film-forming resin (A); and inorganic particles (B), wherein the film-forming resin (A) contains a vinylidene fluoride resin (a1), an amount of the inorganic particles (B) is not less than 0.01 parts by mass and less than 10 parts by mass for each 100 parts by mass of the film-forming resin (A), and the inorganic oxide particles (B) is at least one selected from the group consisting of: (B1) inorganic oxide particles of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table, or inorganic oxide composite particles of these; (B2) inorganic composite oxide particles represented by formula (1): M 1 a1 N b1 O c1 wherein M 1 represents a metallic element of Group 2, N represents a metallic element of Group 4, a1 represents 0.9 to 1.1, b1 represents 0.9 to 1.1, c1 represents 2.8 to 3.2, and the numbers of M 1 and N each may be more than 1; and (B3) inorganic oxide composite particles of an oxide of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table and silicon oxide. The film has improved volume resistivity while maintaining a high dielectric constant owing to a VdF resin.

Multilayered ceramic electronic component

There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor. The capacitor includes: a multilayer body having a dielectric layer; and first and second internal electrodes disposed in the multilayer body, the dielectric layer being disposed between the first and second internal electrodes, wherein, in a cross-section taken in a width-thickness direction of the multilayer body, an offset portion is defined as a portion where adjacent first and second internal electrodes do not overlap with each other, and a ratio (t 1/ td) of a width t 1 of the offset portion to a thickness td of the dielectric layer is 1 to 10.

Chip type laminated capacitor

There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.

Multi-layered ceramic electronic component

There is provided a multi-layered ceramic electronic component including: a ceramic main body including a dielectric layer; and inner electrode layers disposed to face each other, with the dielectric layer interposed therebetween, in the ceramic main body, wherein when an average thickness of the dielectric layer is defined as t d , the average thickness t d is t d ≧15 μm, and the number of dielectric grains per 10 μm within the dielectric layer is 15 or greater. Since a uniform, thick dielectric layer can be obtained with fine dielectric powder, a high voltage multi-layered ceramic electronic component having excellent withstand voltage characteristics can be implemented.

Inner electrode, and multilayered ceramic capacitor comprising the inner electrode

Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes.

Multilayer ceramic condenser and method for manufacturing the same

Disclosed herein are a multilayer ceramic condenser and a method for manufacturing the same. The multilayer ceramic condenser includes inner metal electrode layers formed within a magnetic layer, and conductive layers each formed between the inner metal electrode layers, and a method for manufacturing the same. According to the present invention, a contact between the inner metal electrode layers in the multilayer ceramic condenser can be prevented, thereby reducing the manufacturing loss due to occurrence of short circuits and improving thermal stability, by forming an ultrathin conducting layer with a thickness of about 10 nm or less between the inner metal electrode layers. Therefore, the multilayer ceramic condenser can be ensured to have excellent reliability to meet the demands of markets requesting a high-capacity multilayer ceramic condenser (MLCC) having high performance, small size, and light weight.

Metal powder, method for preparing the same, and multilayered ceramic capacitor including inner electrode made of metal powder

A metal powder including a graphene layer irregularly formed on a surface of the metal powder, a method for preparing the same, and a multilayered ceramic capacitor including an inner electrode using the metal powder. By using the metal powder having the graphene irregularly formed on the surface thereof as the inner electrode material of the multilayered ceramic capacitor, and allowing the necking phenomenon to occur on only the surface where the graphene is not formed, the necking of the metal powder is delayed and the shrinkage of the inner electrode is controlled, so that reduction of the thickness of the inner electrode and disconnection/crack can be prevented.

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including respective lead-out portions exposed to a first surface of the ceramic body and a third or fourth surface thereof connected to the first surface and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; first and second external electrodes extended from the first surface of the ceramic body to the third or fourth surface thereof connected to the first surface and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and the third and fourth surfaces thereof connected to the first surface.

Method for manufacturing multilayer ceramic electronic component

A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.

Method for forming a capacitor dielectric and method for manufacturing a capacitor using the capacitor dielectric

A method for forming a capacitor dielectric includes depositing a zirconium oxide layer, performing a post-treatment on the zirconium oxide layer such that the zirconium oxide layer has a tetragonal phase, and depositing a tantalum oxide layer over the zirconium oxide layer such that the tantalum oxide layer has a tetragonal phase.

Metal powder production method, metal powder produced thereby, conductive paste and multilayer ceramic electronic component

Fine, highly-crystallized metal powder is produced at low cost and high efficiency by a method involving: ejecting raw material powder composed of one or more kinds of thermally decomposable metal compound powders into a reaction vessel through a nozzle together with a carrier gas and producing a metal powder by heating the raw material powder at a temperature T 2 which is higher than the decomposition temperature of the raw material powder and not lower than (Tm−200)° C. where Tm is the melting point (° C.) of the metal to be produced, while allowing the raw material powder to pass through the reaction vessel in a state where the raw material powder is dispersed in a gas phase at a concentration of 10 g/liter or less, wherein an ambient temperature T 1 of a nozzle opening part is set to a temperature of 400° C. or higher and lower than (Tm−200)° C.

Laminated ceramic electronic component and manufacturing method therefor

A method for manufacturing a laminated ceramic electronic component enables formation of a plating film as at least a portion of an external electrode which connects exposed ends of internal electrodes. A component main body including a plurality of ceramic layers and a plurality of internal electrodes partially exposed from the component main body is prepared such that the component main body has a conductive region formed by diffusion of a conductive component included in the internal electrodes at the end surfaces of the ceramic layers located between adjacent exposed ends of the plurality of internal electrodes. The ceramic layers are preferably composed of a glass ceramic containing a glass component of about 10 weight % or more. A plating film is formed directly on the component main body by growing the exposed ends of the internal electrodes and the conductive region as nucleuses for plating deposition.

Nanostructured dielectric materials for high energy density multilayer ceramic capacitors

A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially titanium dioxide dielectric layer has an average grain size of between about 200 and about 400 nanometers, wherein each respective substantially titanium dioxide dielectric layer has maximum particle size of less than about 500 nanometers. Typically, each respective substantially titanium dioxide dielectric layer further includes at least one dopant selected from the group including P, V, Nb, Ta, Mo, W, and combinations thereof, and the included dopant is typically present in amounts of less than about 0.01 atomic percent.

CERAMIC BODY AND METHOD FOR PRODUCING THE SAME

A ceramic body including therein conductors more effectively prevents ingress of moisture into voids between the conductors and the ceramic body. A supercritical fluid containing a monomer flows in the voids between internal electrode layers and a ceramic laminated body. Then, the voids between the internal electrode layers and the ceramic laminated body are filled with a polymer by the polymerization of the monomer. 1. A ceramic component comprising:a ceramic body;an conductor located in the ceramic body;a void located between the conductor and the ceramic body; anda polymer located in the void between the conductor and the ceramic body.2. The ceramic component according to claim 1 , wherein the ceramic body is a multilayered laminated ceramic body including a plurality of stacked ceramic layers and conductor layers interposed between the plurality of ceramic layers.3. The ceramic component according to claim 1 , wherein the ceramic component is one of a capacitor claim 1 , an inductor claim 1 , a piezoelectric element claim 1 , a multilayer ceramic substrate claim 1 , and a thermistor.4. The ceramic component according to claim 1 , wherein the conductor includes an end surface exposed at an external surface of the ceramic body.5. The ceramic component according to claim 4 , further comprising an external electrode located on the ceramic body so as to be electrically connected to the conductor.6. The ceramic component according to claim 5 , further comprising first and second plating layers located on the external electrode.7. The ceramic component according to claim 1 , wherein the void is completely filled with the polymer.8. The ceramic component according to claim 1 , wherein the void is a nano-level void.9. The ceramic component according to claim 1 , wherein the polymer is made of a polymerized monomer.10. The ceramic component according to claim 1 , wherein the polymer is made of a polyimide.11. The ceramic component according to claim 1 , further comprising ...

Dielectric composition and ceramic electronic component including the same

There is provided a dielectric composition including: a base powder; a first accessory component including a content (x) of 0.1 to 1.0 at % of an oxide or a carbonate including transition metals, based on 100 moles of the base powder; a second accessory component including a content (y) of 0.01 to 5.0 at % of an oxide or a carbonate including a fixed valence acceptor element, based on 100 moles of the base powder; a third accessory component including an oxide or a carbonate including a donor element; and a fourth accessory component including a sintering aid.

MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, so as to cause a short-circuit. The inner conductor is printed such that the center of each via conductor is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability of a short-circuit is minimized. 1preparing a plurality of ceramic green sheets;forming an inner conductor having openings on a specific one of the plurality of ceramic green sheets by printing an electrically conductive paste; andforming via conductors in positions in a pattern of the inner conductor corresponding to the openings such that the via conductors extend through the specific one of the plurality of ceramic green sheets in a thickness direction; whereinin the step for forming the inner conductor, the inner conductor is formed in such a manner that a center of each of the via conductors is deviated from a center of the opening in a direction in which the electrically conductive paste is printed.. A method for manufacturing a monolithic ceramic electronic component comprising the steps of: 1. Field of the InventionThe present invention relates to a monolithic ceramic electronic component and a method for manufacturing the monolithic ceramic electronic component. In particular, the present invention relates to a monolithic ceramic electronic component including a ceramic body having inner conductors and via conductors, and to a method for ...

Multilayered ceramic electronic component and fabrication method thereof

There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.

MULTILAYER CERAMIC CAPACITOR

There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA/CA) of MA to CA is between 0.07 and 0.20, wherein CA represents an area of the multilayer body in a cross section of the multilayer body taken in a length and thickness direction, and MA represents an area of a first margin part in the cross section of the multilayer body taken in the length and thickness direction, the first margin part being a portion of the multilayer body, other than a first capacitance forming part thereof in which the first and second inner electrodes overlap in the thickness direction. 116-. (canceled)181111. The multilayer ceramic capacitor of claim 17 , wherein a ratio (MA/CA) of MA to CA is between 0.07 and 0.20 claim 17 ,{'b': '1', 'wherein CA represents an area of the multilayer body in a cross section of the multilayer body taken in a length and thickness direction, and'}{'b': '1', 'MA represents an area of a first margin part in the cross section of the multilayer body taken in the length and thickness direction, the first margin part being a portion of the multilayer body, other than a first capacitance forming part thereof in which the first and second inner electrodes overlap in the thickness direction in the cross section of the multilayer body taken in the length and thickness direction.'}192222. The multilayer ceramic capacitor of claim 17 , wherein a ratio (MA/CA) of MA to CA is between 0.10 and 0.28 claim 17 ,{'b': '2', 'wherein CA represents an area of the multilayer body in a cross section of the multilayer body taken in a width and thickness direction, and'}{'b': '2', 'MA represents an area of a second margin part in the cross section of the multilayer body taken in the width and thickness direction, the ...

CHIP TYPE LAMINATED CAPACITOR

There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less. 1. A chip type laminated capacitor comprising:a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less;first and second outer electrodes formed at both ends of the ceramic body and having different polarities;a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; anda second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode,the first and second margins having different widths under a condition that they are 200 μm or less.2. The chip type laminated capacitor of claim 1 , wherein the first and second outer electrodes include first and second band parts formed to have different widths on an L-T plane of the ceramic body claim 1 , and {'br': None, 'i': X=|M', 'A', 'M', 'A', 'M', 'A', 'M', 'A, '5%≦1/1−2/2|/ave(1/1,2/2)≦40%\ ...

MULTI-LAYER CERAMIC CAPACITOR

An object of the present invention is to provide a multi-layer ceramic capacitor that includes a laminated block formed by laminating ceramic dielectric layers and internal electrodes alternately, a pair of cover layers laminated on top and bottom of the laminated block, a ceramic body formed on both side surfaces of the laminated block , and a pair of external electrodes electrically connected to the internal electrodes and that can effectively prevent an occurrence of a crack. In the multi-layer ceramic capacitor , a silicate crystal made of an oxide including Ba and Si or a silicate crystal made of an oxide including Ti and Si is formed in boundary portions between the laminated block and the ceramic bodies 1. A multi-layer ceramic capacitor , comprising:a laminated block formed by laminating ceramic dielectric layers and internal electrodes alternately;a pair of cover layers laminated on top and bottom of the laminated block;a ceramic body formed on both side surfaces of the laminated block; anda pair of external electrodes electrically connected to the internal electrodes,wherein a silicate crystal made of an oxide including Ba and Si or a silicate crystal made of an oxide including Ti and Si is formed in a boundary portion between the laminated block and the ceramic body.2. The multi-layer ceramic capacitor according to claim 1 , wherein the silicate crystal made of an oxide including Ba and Si or the silicate crystal made of an oxide including Ti and Si is BaTiSiO.3. The multi-layer ceramic capacitor according to claim 1 , wherein an average grain size of BaTiOthat is added to a conductive paste for the internal electrodes including nickel is less than 100 nm.4. The multi-layer ceramic capacitor according to claim 1 , wherein a glass component content in a dielectric that forms the ceramic body is higher than a glass component content in a dielectric that forms the ceramic dielectric layers. The present application claims priority to Patent Application No. ...

Ceramic electronic component and manufacturing method thereof

A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.

MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; and first and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes, wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%. 1. A multilayer ceramic electronic part , comprising:a ceramic element having a plurality of dielectric layers laminated therein;first and second internal electrodes formed on at least one surface of each of the plurality of dielectric layers within the ceramic element and exposed through one surface of the ceramic element; andfirst and second external electrodes formed on one surface of the ceramic element and electrically connected to the first and second internal electrodes through exposed portions of the respective first and second internal electrodes,wherein a ratio of an area of the first or second external electrode to an area of one surface of the ceramic element is 10 to 40%.2. The multilayer ceramic electronic part of claim 1 , wherein the first and second external electrodes have equal areas.3. The multilayer ceramic electronic part of claim 1 , wherein the first and second external electrodes have unequal areas.4. The multilayer ceramic electronic part of claim 1 , wherein a distance between the first external electrode and an end of the ceramic element is equal to a distance between the second external electrode and an opposite end of the ceramic element.5. The multilayer ceramic electronic part of claim 1 , wherein a distance between the first external ...

CHIP ELECTRONIC DEVICE

Provided is a chip electronic device that has an increased reliability with a small size. A chip electronic component has a main body made of a ceramic having an internal electrode therein. Provided on the main body is an external electrode that is made of a first electrode layer on the main body, a conductive protective layer on the first electrode layer, and a second electrode layer on the conductive protective layer formed by electrolytic plating. The conductive protective layer prevents hydrogen from diffusing into the main body during the electrolytic plating. 1. A chip electronic device , comprising:a main body that is made of a ceramic and that has an internal electrode therein; andan external electrode formed on an outer surface of the main body, the external electrode including:a first electrode layer formed on the outer surface of the main body;a conductive protective layer formed on an outer surface of the first electrode layer by a physical vapor deposition method or a chemical vapor deposition method, the conductive protective layer substantially preventing hydrogen from diffusing into the main body form an exterior during electrolytic plating to be performed thereafter; anda second electrode layer formed on an outer surface of the conductive protective layer by electrolytic plating, the second electrode layer being made of one or more layers.2. The chip electronic device according to claim 1 , wherein the conductive protective layer includes first metal grains and second metal grains claim 1 , the first metal grain having a higher hydrogen storage capacity than that of Ni claim 1 , the second metal grain having a lower hydrogen diffusion coefficient than that of Ni.3. The chip electronic device according to claim 2 , wherein the conductive protective layer includes Pd as the first metal grains claim 2 , and one or both of Cu and Au as the second metal grains.4. The chip electronic device according to claim 3 , wherein the conductive protective layer ...

LAMINATED CERAMIC ELECTRONIC COMPONENT

Provided is a laminated ceramic electronic component which has excellent mechanical characteristics, internal electrode corrosion resistance, high degree of freedom in ceramic material design, low cost, low defective rate, and various properties. The laminated ceramic electronic component includes: a laminate which has a plurality of laminated ceramic layers and Al/Si alloy-containing internal electrodes at a plurality of specific interface between ceramic layers; and an external electrode formed on the outer surface of the laminate, wherein the Al/Si ratio of the Al/Si alloy is 85/15 or more. 1. A laminated ceramic electronic component comprising a laminate comprising a plurality of laminated ceramic layers and Al/Si alloy-containing internal electrodes at a plurality of specific interfaces between ceramic layers , wherein the Al/Si atomic ratio in the Al/Si alloy is 85/15 or more.2. The laminated ceramic electronic component according to claim 1 , wherein at least one internal electrode has a layer of AlOon its surface.3. The laminated ceramic electronic component according to claim 2 , wherein the AlOconstitutes 0.25% to 10% of the thickness of the internal electrode.4. The laminated ceramic electronic component according to claim 3 , wherein the ceramic comprises a titanate claim 3 , zirconate claim 3 , glass ceramic claim 3 , ferrite or transition element oxide ceramic.5. The laminated ceramic electronic component according to claim 4 , further comprising at least one external electrode on an outer surface of the laminate.6. The laminated ceramic electronic component according to claim 3 , further comprising at least one external electrode on an outer surface of the laminate.7. The laminated ceramic electronic component according to claim 2 , further comprising at least one external electrode on an outer surface of the laminate.8. The laminated ceramic electronic component according to claim 1 , further comprising at least one external electrode on an outer ...

DIELECTRIC CERAMIC, LAMINATED CERAMIC CAPACITOR, METHOD FOR PRODUCING THE DIELECTRIC CERAMIC, AND METHOD FOR MANUFACTURING THE MULTILAYER CERAMIC CAPACITOR

Provided is a laminated ceramic capacitor which produces excellent lifetime characteristics in a high-temperature loading test even when dielectric layers are reduced in thickness. The dielectric ceramic contains, as its main constituent, a compound represented by the general formula (BaCaRe)(TiM)O(where Re is at least one or more elements selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and M is at least one or more elements selected from among Mg, Mn, Al, Cr, and Zn), 0≦x≦0.2, 0.002≦y≦0.1, and 0.001≦z≦0.05. This dielectric ceramic has crystal grains of 20 nm or more and 150 nm or less in average grain size. 1. A dielectric ceramic comprising , as its main constituent , a compound represented by the general formula (BaCaRe)(TiM)Oin which Re is at least one element selected from the group consisting of La , Ce , Pr , Nd , Sm , Eu , Gd , Tb , Dy , Ho , Er , Tm , Yb , Lu , and Y , and M is at least one element selected from the group consisting of Mg , Mn , Al , Cr , and Zn , 0≦x≦0.2 , 0.002≦y≦0.1 , and 0.001≦z≦0.05 , and having crystal grains of 20 nm or more and 150 nm or less in average grain size.2. The dielectric ceramic according to claim 1 , wherein the average grain size is 20 nm or more and less than 100 nm.3. The dielectric ceramic according to claim 2 , wherein 0.004≦y claim 2 , and 0.0015≦z≦0.04.4. The dielectric ceramic according to claim 3 , wherein x is O.5. The dielectric ceramic according to claim 3 , wherein x is greater than 0.6. A laminated ceramic capacitor comprising: a laminated body including a plurality of stacked dielectric layers and a plurality of internal electrodes disposed at interfaces between dielectric layers; and a plurality of external electrodes on an outer surface of the laminated body and electrically connected to the internal electrodes claim 3 ,{'claim-ref': {'@idref': 'CLM-00003', 'claim 3'}, 'wherein the dielectric layers are composed of the dielectric ceramic according to .'}7. A laminated ...

Shapeable short circuit resistant capacitor

A ceramic short circuit resistant capacitor that is bendable and/or shapeable to provide a multiple layer capacitor that is extremely compact and amenable to desirable geometries. The capacitor that exhibits a benign failure mode in which a multitude of discrete failure events result in a gradual loss of capacitance. Each event is a localized event in which localized heating causes an adjacent portion of one or both of the electrodes to vaporize, physically cleaning away electrode material from the failure site. A first metal electrode, a second metal electrode, and a ceramic dielectric layer between the electrodes are thin enough to be formed in a serpentine-arrangement with gaps between the first electrode and the second electrode that allow venting of vaporized electrode material in the event of a benign failure.

LAMINATED CERAMIC ELECTRONIC COMPONENT

A laminated ceramic electronic component includes a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers, and an external electrode located on an outer surface of the laminated body. In the laminated ceramic electronic component, the ceramic layers have a composition including a main constituent of a barium titanate-based compound and BiO, and the internal electrodes have a main constituent of Al. 1. A laminated ceramic electronic component comprising:a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers; andan external electrode located on an outer surface of the laminated body; wherein{'sub': 2', '3, 'the ceramic layers have a composition including a main constituent of a barium titanate-based compound and BiO; and'}the internal electrodes have a main constituent of Al.2. The laminated ceramic electronic component according to claim 1 , wherein a content of the BiOwith respect to 100 parts by weight of the main constituent in the ceramic layers is about 1 part by weight or more and about 20 parts by weight or less.3. The laminated ceramic electronic component according to claim 1 , wherein the ceramic layers further include CuO at about 0.01 parts by weight or more and about 1 part by weight or less with respect to 100 parts by weight of the main constituent.4. The laminated ceramic electronic component according to claim 2 , wherein the ceramic layers further include CuO at about 0.01 parts by weight or more and about 1 part by weight or less with respect to 100 parts by weight of the main constituent.5. The laminated ceramic electronic component according to claim 1 , wherein an oxide layer containing Al and Bi is located at interfaces between the ceramic layers and the internal electrodes.6. The laminated ceramic electronic component according to claim 2 , ...

POLYVINYL ACETAL RESIN, SLURRY COMPOSITION PREPARED THEREFROM, CERAMIC GREEN SHEET, AND MULTILAYER CERAMIC CAPACITOR

According to the present invention, provided is a polyvinyl acetal resin capable of obtaining a ceramic green sheet that has sufficient mechanical strength, in which the dimensional change in the storage of ceramic green sheet is small, and the delamination hardly occurs in the delipidation. 2. The polyvinyl acetal resin according to claim 1 , wherein the degree of polymerization is from 1500 to 4500.3. The polyvinyl acetal resin according to claim 1 , wherein the polyvinyl acetal resin is obtained by a process comprising acetalizing a polyvinyl alcohol resin with aldehyde comprising 3-methylbutanal.5. The polyvinyl acetal resin according to claim 1 , wherein the polyvinyl acetal resin comprises the structural unit of formula (1) in a content of at least 30 mol % relative to a total molar amount of acetalized structural units.6. A slurry composition claim 1 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polyvinyl acetal resin according to ;'}a ceramic powder; andan organic solvent.7. A ceramic green sheet claim 6 , obtained by a process comprising producing the ceramic green sheet from the slurry composition according to .8. A conductive paste claim 6 , comprising:{'claim-ref': {'@idref': 'CLM-00001', 'claim 1'}, 'the polyvinyl acetal resin according to ; and'}a conductive powder.9. A laminated ceramic capacitor claim 7 , obtained by a process comprising producing the laminated ceramic capacitor from the ceramic green sheet according to .10. A laminated ceramic capacitor claim 8 , obtained by a process comprising producing the laminated ceramic capacitor from the conductive paste according to .11. The polyvinyl acetal resin according to claim 2 , wherein the degree of polymerization is from 2000 to 3500.12. The polyvinyl acetal resin according to claim 1 , wherein the content percentage of vinylester unit is from 0.5 to 20 mol %.13. The polyvinyl acetal resin according to claim 1 , wherein the degree of acetalization is from 65 to 80 mol %.14. ...

Multilayer ceramic capacitor

There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L 2 and a width of a portion of a margin portion M in each dielectric layer is defined as a maximum width M 2 , the portion of the margin portion M having no internal electrode layer present thereon and corresponding to the ends of each internal electrode layer in the length direction, a ratio of M 2 to L 2 (M 2 /L 2 ) ranges from 0.2 to 0.3.

Multilayer ceramic electronic component and fabrication method thereof

A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T 1 , 0.5≦|T 1 /Tc|≦1.0 is satisfied.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D) of ceramic grains in a cover area is smaller than an average diameter (D) of ceramic grains in the active area, and when a thickness of the cover area is expressed by Tc, 9 um≦Tc≦25 um and Tc/Dc≧55 are satisfied. A multilayer ceramic capacitor having excellent moisture-resistance properties may be obtained. 1. A multilayer ceramic electronic component , comprising:a ceramic body;external electrodes formed on outer surfaces of the ceramic body; andinternal electrodes laminated with ceramic layers each interposed therebetween in the ceramic body,wherein the ceramic body includes an active area from an uppermost internal electrode to a lowermost internal electrode and a cover area formed above or below the active area,{'sub': c', 'a, 'an average diameter (D) of ceramic grains in the cover area formed above or below the active area is smaller than an average diameter (D) of ceramic grains in the active area, and'}{'sub': c', 'c', 'c', 'c, 'when a thickness of the cover area is expressed by T, 9 um≦T≦25 um and T/D≧55 are satisfied.'}2. The multilayer ceramic electronic component of claim 1 , wherein the average diameter (D) of ceramic grains in the cover area is an average diameter of the ceramic grains in the cover area in a thickness direction of the ceramic body.31. The multilayer ceramic electronic component of claim claim 1 , wherein 1.1≦D/D≦4.4 is satisfied.4. The multilayer ceramic electronic component of claim 1 , wherein the ceramic body includes a dielectric material.5. The multilayer ceramic electronic component of claim 4 , wherein the dielectric material includes barium titanate or strontium titanate.6. The multilayer ceramic electronic component of claim 1 , wherein the number of the internal electrodes laminated in the ceramic body is 250 or greater.7. The multilayer ceramic electronic component of claim 1 , wherein the ...

GLASS COMPOSITIONS, DIELECTRIC COMPOSITIONS AND MULTILAYER CERAMIC CAPACITOR HAVING HIGH CAPACITANCE USING THE SAME

Disclosed are a glass composition and a dielectric composition enabling low temperature sintering, and a high capacitance multilayer ceramic capacitor using the same. In the glass composition used for sintering, the glass composition may be formed of a formula, aRO-bCaO-cZnO-dBaO-eBO-fAlO-gSiO, and the formula may satisfy a+b+c+d+e+f+g=100, 0≦a≦7, 1≦b≦3, 1≦c≦15, 10≦d≦20, 3≦e≦10, 0≦f≦3, and 55≦g≦72. Through this, when manufacturing the high capacity multilayer ceramic capacitor, the dielectric substance may enable the lower temperature sintering, thereby enhancing a capacitance and a reliability of the high capacitance multilayer ceramic capacitor. 1. A glass composition used for sintering , wherein the glass composition is formed of a formula , aRO-bCaO-cZnO-dBaO-eBO-fAlO-gSiO , and the formula satisfies a+b+c+d+e+f+g=100 , 0≦a≦7 , 1≦b≦3 , 1≦c≦15 , 10≦d≦20 , 3≦e≦10 , 0≦f≦3 , and 55≦g≦72.2. The glass composition of claim 1 , wherein the glass composition corresponds to a spherical nano powder having an average grain size of 30 nm to 200 nm.3. The glass composition of claim 2 , wherein the spherical nano powder is spheroidized or vaporized by performing thermal plasma processing of a glass powder having a size of 0.2 μm to 30 μm.4. The glass composition of claim 3 , wherein a temperature of the thermal plasma processing is 3000° C. to 8000° C.5. The glass composition of claim 4 , wherein a radio frequency (RF) plasma torch is used for the thermal plasma processing. This application claims the benefit of Korean Patent Application No. 10-2010-0086481, filed on Sep. 3, 2010, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference.1. Field of the InventionThe present invention relates to a glass composition, a dielectric composition, and a high capacitance multilayer ceramic capacitor using the same, and more particularly, to a glass composition and a dielectric composition enabling low temperature sintering, and a high ...

LAMINATED CERAMIC CAPACITOR

A laminated ceramic capacitor includes multiple dielectric layers, internal electrodes having Cu as the primary component and embedded between the dielectric layers, and external electrodes. The dielectric layers contain a primary component comprised of a CaZrOcompound and auxiliary components that include Mn, B, Si, and Li wherein a primary phase comprised of the primary component, segregation phases containing Ca and at least one of the auxiliary components, and secondary phases containing at last Ca and Zr are formed. The ratio of Ca to Zr in the secondary phases is smaller than the ratio of Ca to Zr in the primary phase, and the number of secondary phases with a diameter of 100 nm or greater in a cross section of the dielectric layers averages 30 or less per 10 square μm. 1. A laminated ceramic capacitor having multiple dielectric layers , internal electrodes which are embedded between the dielectric layers and whose primary component is Cu , and external electrodes which are electrically connected to one end of each of the internal electrodes , said laminated ceramic capacitor characterized in that the dielectric layers contain a primary component constituted by a CaZrOcompound as well as auxiliary components including Mn , B , Si , and Li; formed in the dielectric layers are a primary phase constituted by the primary component , segregation phases which contain Ca and at least one of the auxiliary components , and secondary phases which contain at least Ca and Zr; a ratio of Ca to Zr in the secondary phases is smaller than a ratio of Ca to Zr in the primary phase; and there are no more than 30 secondary phases on average per 10-μm square in a cross-section of each of the dielectric layers sandwiched between the internal electrodes when those having a diameter of 100 nm or larger are counted.2. A laminated ceramic capacitor according to claim 1 , characterized in that the primary component of the dielectric layers claim 1 , constituted by a CaZrOcompound claim ...

Laminated Ceramic Capacitor and Manufacturing Method Therefor

A laminated ceramic capacitor that includes a laminated body including dielectric ceramic layers having crystal grains and crystal grain boundaries, and including internal electrode layers. An external electrode is formed on a surface of the laminated body, and is electrically connected to the internal electrode layers exposed at the surface of the laminated body. The laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, and further including Mn, Sr, and Si. When the laminated body is dissolved, the Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, and the molar ratio of Mn to Sr is 0.3 or more and 3.2 or less. 1. A laminated ceramic capacitor comprising:a laminated body comprising dielectric ceramic layers including crystal grains and crystal grain boundaries, and comprising internal electrode layers; andan external electrode on a surface of the laminated body, and electrically connecting the internal electrode layers exposed at the surface of the laminated body,wherein the laminated body has a composition including a calcium zirconate based perovskite-type compound as a main constituent, andfurther including Mn, Sr, and Si, andwhen the laminated body is dissolved,Si contained therein is 0.1 parts by mol or more and 10 parts by mol or less with respect to 100 parts by mol of Zr, anda molar ratio of Mn to Sr is 0.3 or more and 3.2 or less.2. The laminated ceramic capacitor according to claim 1 , wherein a main constituent of the internal electrode layers is Cu.3. The laminated ceramic capacitor according to claim 1 , wherein the internal electrode layers include a plurality of first internal electrodes layers and a plurality of second internal electrode layers claim 1 , the external electrode is a first external electrode electrically connected to the plurality of first internal electrode layers claim 1 , and the laminated ceramic ...

Chip-type ceramic electronic component and producing method thereof

The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz 1 and Rz 2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2<3.2 μm, wherein Rz 1 is a ten-point average surface roughness of a first region of a surface of the ceramic base body to which the tip portion is bonded, and Rz 2 is a ten-point average surface roughness of a second region of the surface of the ceramic base body where the external electrode is not formed.

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE

A dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-DOhaving tungsten bronze-type structure and an oxide of “M”. “A” is at least one selected from Ba, Ca, Sr and Mg, “D” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, “x” and “y” satisfies 00, respectively and said “M” is at least one selected from Al, Si, B and Li. It is preferable to further comprise Mg oxide. 1. A dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-DOhaving tungsten bronze-type structure and an oxide of “M” ,wherein “A” is at least one selected from Ba, Ca, Sr and Mg, “D” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, “x” and “y” satisfies 00, respectively and said “M” is at least one selected from Al, Si, B and Li.2. The dielectric ceramic composition as set forth in further comprising Mg oxide.3. The dielectric ceramic composition as set forth in further comprising an oxide of at least one selected from Ti and Zr.4. The dielectric ceramic composition as set forth in further comprising an oxide of at least one selected from Ti and Zr.5. The dielectric ceramic composition as set forth in wherein content of the above “M” oxide with respect to 100 moles of said compound is 0.5 to 5.0 moles in terms of element.6. The dielectric ceramic composition as set forth in wherein content of the above “M” oxide with respect to 100 moles of said compound is 0.5 to 5.0 moles in terms of element.7. The dielectric ceramic composition as set forth in wherein content of the above “M” oxide with respect to 100 moles of said compound is 0.5 to 5.0 moles in terms of element.8. The dielectric ceramic composition as set forth in wherein content of the above “M” oxide with respect to 100 moles of said compound is 0.5 to 5.0 moles in terms of ...

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE

Dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-BOand has a tungsten bronze-type structure. In the formula, “A” is at least one selected from a group comprising Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said “x” and “y” satisfies 0 Подробнее

LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR

As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol, the Si content n meets 0.5≦n≦10 in terms of parts by mol, the Mn content u meets 0.5≦u≦10 in terms of parts by mol, and the Al content w meets 0.02≦w≦4 in terms of parts by mol, m and n satisfying −0.4≦100(m−1)−n≦3.9. 1. A laminated ceramic capacitor comprising:a laminated body including a plurality of stacked dielectric layers, and a plurality of internal electrodes along interfaces between the stacked dielectric layers; anda plurality of external electrodes on an outer surface of the laminated body, each of the plurality of external electrodes electrically connected to different sets of electrodes of the plurality of internal electrodes,wherein the laminated body has a composition containing, as a main constituent thereof, a perovskite-type compound containing Ca and Zr, and further containing Si, Mn, and Al, andwhen a total content of Zr is 100 parts by mol,a total content (100×m) of Ca meets 1.002≦m≦1.100 in terms of parts by mol,the Si content n meets 0.5≦n≦10 in terms of parts by mol,the Mn content u meets 0.5≦u≦10 in terms of parts by mol, andthe Al content w meets 0.02≦w≦4 in terms of parts by mol,m and n satisfying −0.4≦100(m−1)−n≦3.9.2. The laminated ceramic capacitor according to claim 1 , wherein the perovskite-type compound further contains at least one selected from the group consisting of Sr claim 1 , Ba claim 1 , and Ti claim 1 , andwhen the total content of Zr and Ti is regarded as 100 parts by mol,the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol,a molar ratio s of Ti/( ...

Laminated Ceramic Electronic Component and Manufacturing Method Therefor

A laminated ceramic capacitor including a laminated body having a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The internal electrodes have a plurality of ceramic columnar members formed therein, which project into the internal electrodes from interfaces between the ceramic layers and the internal electrodes, but do not penetrate in the thickness direction of the internal electrodes. 1. A laminated ceramic electronic component comprising:a laminated body having a plurality of stacked ceramic layers and internal electrode layers between the ceramic layers,wherein the internal electrode layers have a plurality of ceramic columnar members contained therein, the columnar members having base ends located at an interface between the ceramic layers and the internal electrode layers, and having tips located within the internal electrode layers, andwhen an observation is made with the use of an electron microscope while focusing on a polished cross section of the laminated body in a stacking direction, with the internal electrode layers exposed at the cross section and then dissolved and removed by chemical etching,(1) the columnar members have the base ends joined with the ceramic layers, and have the tips located in a range of 20% or more and 90% or less of a thickness of the internal electrode layers,(2) the columnar members have a width of 0.8 μm or less in 50% or more from the base end to the tip, and(3) the columnar members are present at a rate of one or more per 10 μm in length of the internal electrode layers.2. The laminated ceramic electronic component according to claim 1 , further comprising ceramic penetrating members penetrating through the internal electrode layers claim 1 , and a ratio of an area occupied by the penetrating members to an area occupied by the internal electrode layers is 3% or less.3. The laminated ceramic electronic component according to claim 2 , wherein a main constituent of the columnar ...

DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE

Dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-BOand has a tungsten bronze-type structure. In the formula, “A” is at least one selected from a group comprising Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and said “x” and “y” satisfies 01.000, respectively. The dielectric ceramic composition further comprises an oxide of at least one selected from V, Mo, Fe, W, Mn and Cr. 1. A dielectric ceramic composition comprising a compound shown by a general formula {A(RE)}-BOhaving tungsten bronze-type structure ,wherein “A” is at least one selected from Ba, Ca, Sr and Mg, “B” is at least one selected from Nb and Ta, “RE” is at least one selected from Sc, Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu, and “x” and “y” satisfies 01.000, respectively.2. The dielectric ceramic composition as set forth in further comprising an oxide of at least one selected from V claim 1 , Mo claim 1 , Fe claim 1 , W claim 1 , Mn and Cr.3. An electronic device comprising a dielectric layer constituting dielectric ceramic composition as set forth in and an internal electrode mainly composed of a base metal.4. An electronic device comprising a dielectric layer constituting dielectric ceramic composition as set forth in and an electrode. 1. Field of the InventionThe present invention relates to a dielectric ceramic composition and electronic device wherein said dielectric ceramic composition is applied to its dielectric layer. More precisely, the present invention relates to a dielectric ceramic composition having good characteristics under a high electric field intensity, and to an electronic device, wherein said dielectric ceramic composition is applied to dielectric layer, having an electrode.2. Description of the Related ArtIn recent years, a demand for a high reliability of electronic device is high. ...

Method for producing slurry composition

The present invention provides a method for producing a slurry composition which realizes excellent dispersibility through simple steps and can maintain high dispersibility over a long term. In addition, the present invention provides a slurry composition produced using this method. The present invention provides s method for producing a slurry composition containing an inorganic powder, a polyvinyl acetal resin, and an organic solvent, the method comprising the steps of: mixing an inorganic powder, a mixed polyvinyl acetal resin (A) and an organic solvent for inorganic dispersion to prepare an inorganic dispersion; mixing a polyvinyl acetal resin (B) and an organic solvent for resin solution to prepare a resin solution; and adding the resin solution to the inorganic dispersion, the mixed polyvinyl acetal resin (A) including a polyvinyl acetal resin (a1) having a hydroxy group content of 20 to 40 mol % and a polyvinyl acetal resin (a1) having a hydroxy group content of 28 to 60 mol %, the polyvinyl acetal resin (a1) and the polyvinyl acetal resin (a2) being in a relation represented by the following formula (1): Y−X ≧5   (1) wherein X represents the hydroxy group content (mol %) in the polyvinyl acetal resin (a1), and Y represents the hydroxy group content (mol %) in the polyvinyl acetal resin (a2), the polyvinyl acetal resin (B) having a polymerization degree of 800 to 4200, and an amount of the mixed polyvinyl acetal resin (A) used in the step of preparation of the inorganic dispersion being 0.1 to 20 parts by weight relative to 100 parts by weight of the inorganic powder.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and when the thickness of a central portion of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, 0.9≦T/T≦0.97, and thus, a multilayer ceramic electronic component having low equivalent series inductance (ESL) may be obtained. 1. A multilayer ceramic electronic component , comprising:a ceramic body having external electrodes; andinternal electrodes disposed between ceramic layers within the ceramic body,when a direction in which the external electrodes are connected and extended is denoted as a ┌width direction┘; a direction in which the internal electrodes are laminated is denoted as a ┌thickness direction┘; and a direction perpendicular to the width direction and the thickness direction is denoted as a ┌length direction┘, the ceramic body having a width smaller than a length thereof,the number of the internal electrodes laminated being 250 or more,{'sub': d', 'e', 'e', 'd, 'when the thickness of the ceramic layer is denoted by Tand the thickness of the internal electrode is denoted by T, 0.5≦T/T≦2.0, and'}{'sub': m', 'a', 'a', 'm, 'when the thickness of a central portion in a width direction of the ceramic body is denoted by Tand the thickness of each of side portions of the ceramic body is denoted by T, in a cross section in a width-thickness direction of the ceramic body, 0.9≦T/T≦0.97.'}2. The multilayer ceramic electronic component of claim 1 , wherein the central portion in the width direction of the ceramic body is within sections inside 15% of ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively. 1. A multilayer ceramic electronic component , comprising:a ceramic sintered body having a plurality of dielectric layers laminated therein;first and second internal electrodes having first and second capacitance portions and first and second lead-out portions, respectively, the first and second capacitance portions being formed on surfaces of the dielectric layers to be spaced apart from both side surfaces of the ceramic sintered body, and the first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other in a length direction of the dielectric layers;sealing parts enclosing both end portions and corner portions of the ceramic sintered body; andfirst and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.2. The multilayer ceramic electronic component of claim 1 , wherein a ratio of an exposed length of the first and second lead-out portions to a width of the ceramic ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L is length from either end of the ceramic main body in the length direction in a region in which the cover layer adjoins a margin part of the ceramic main body to an end of the first layer formed on an upper or lower surface of the ceramic main body, and Lm is length of the margin part, Tc≦70 μm and L Подробнее

MULTILAYER CERAMIC ELECTRONIC COMPONENT

There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T is a thickness of the first layer, and T is a thickness of the second layer, Tc≦70 μm, T≧(1.5)T and L<(1.5)Tc are satisfied, thus providing excellent reliability. 1. A multilayer ceramic electronic component , comprising:a ceramic main body having internal electrodes laminated therein; andexternal electrodes formed on both ends of the ceramic main body in a length direction thereof,wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and{'b': 1', '1', '2', '2', '1', '1, 'when Tc is a thickness of a cover layer of the ceramic main body, L is a length from either end of the ceramic main body in the length direction thereof to an end of the first layer formed on an upper surface or a lower surface of the ceramic main body, T is a thickness of the first layer at either end of the ceramic main body in a thickness direction thereof, and T is a thickness of the second layer at either end of the ceramic main body in the thickness direction thereof, Tc≦70 μm, T≧(1.5)T, and L<(1.5)Tc are satisfied.'}2. The multilayer ceramic electronic component of claim 1 , wherein the multilayer ceramic electronic component is 1005-sized or ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

A multilayer ceramic electronic component includes a ceramic main body having internal and floating electrode layers laminated therein and spaced apart from each other; and external electrodes formed on ends of the ceramic main body and including a first layer including a conductive metal and a second layer formed on the first layer and including a conductive resin. When Tc is thickness of a cover layer, G is gap between internal electrodes, L is length from either end of the ceramic main body in a length direction thereof to an end of the first layer formed on the upper or lower surface of the ceramic main body, Te is thickness of the internal electrode, Td is distance between internal and floating electrode layers, Lm is length of a margin part of the floating electrode layer, and L is length of the ceramic main body, Tc≦80 μm, (1.5)Lm≦G≦(L−2Lm), and L Подробнее

Multi-layer ceramic electronic component and method of manufacturing the same

There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT

A conductive fine powder includes flat metal/alloy fine particles. The flat metal/alloy fine particles have a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix. The flat metal/alloy fine particles have a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and contain a high-melting-point metal and a low-melting-point metal. 1. A conductive fine powder comprising flat metal/alloy fine particles , the flat metal/alloy fine particles having a nanocomposite structure in which crystalline or non-crystalline nanoparticles are mixed or formed in a matrix , the flat metal/alloy fine particles having a maximum thickness of 50 nm or less and a maximum diameter at least twice the thickness and containing a high-melting-point metal and a low-melting-point metal.2. The conductive fine powder claimed in claim 1 , wherein in the nanocomposite structure claim 1 , the nanoparticles are dispersed in structures of the matrix claim 1 , or the nanoparticles are dispersed in grain boundaries between structures of the matrix claim 1 , or the nanoparticles are dispersed in grain boundaries between structures of the matrix as well as in the structures of the matrix.3. The conductive fine powder claimed in claim 1 , wherein the matrix and the nanoparticles contain any of a single metal claim 1 , an alloy claim 1 , an oxide claim 1 , a sulfide claim 1 , a silicide claim 1 , a carbide and a chloride.4. The conductive fine powder claimed in claim 3 , wherein the matrix and the nanoparticles contain at least one element selected from the group consisting of Ni claim 3 , Cr claim 3 , Ag claim 3 , Cu claim 3 , Au claim 3 , Pt claim 3 , Pd claim 3 , Sn claim 3 , In claim 3 , Bi claim 3 , Ga and Sb.5. A conductive paste comprising a conductive fine powder and an organic vehicle claim 1 , the conductive fine powder being claimed in and dispersed in the organic vehicle.6. A conductive paste comprising a ...

Dielectric Ceramic Material and Multilayer Ceramic Capacitor Using the Same

A dielectric ceramic material comprises a primary component of barium titanate (BaTiO 3 ) and at least one additive component. The additive component has a mole percentage from 1% to 50% and is selected from the group consisting of lithium tantalite (LiTaO3), barium cerate (BaCeO 3 ), sodium metaniobate (NaNbO 3 ) and the combinations thereof.

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF

There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented. 1. A multilayer ceramic electronic component comprising:a ceramic main body in which internal electrodes and dielectric layers are alternately laminated;external electrodes formed on outer surfaces of the ceramic main body;intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; andplating layers formed on the intermediate layers.2. The multilayer ceramic electronic component of claim 1 , wherein the external electrodes include one or more selected form the group consisting of nickel and copper.3. The multilayer ceramic electronic component of claim 1 , wherein the intermediate layers have an average thickness of 20 nm to 1000 nm.4. The multilayer ceramic electronic component of claim 1 , wherein the intermediate layers have an average thickness of 500 nm or less.5. The multilayer ceramic electronic component of claim 1 , wherein a ratio of an average thickness of the intermediate layers to an average thickness of the external electrodes is 1 or less.6. The multilayer ceramic electronic component of claim 1 , wherein a ratio of an average thickness of the intermediate layers to an average thickness of the external electrodes is 0.1 or less.7. The multilayer ceramic electronic component of claim 1 , wherein the plating layers include a nickel layer claim 1 , and a tin layer or a tin-alloy layer ...

Ceramic powder and multi-layer ceramic capacitor

A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate particles having twin defects in the barium titanate powder is 13% or more as measured by TEM observation and that its crystal lattice c/a is 1.0080 or more. The ceramic powder has a wide range of optimum sintering temperatures and thus offers excellent productivity and is particularly useful in the formation of thin dielectric layers of 1 μm or less.

CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR

A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the the barium titanate powder is such that the percentage of barium titanate particle having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more. The ceramic powder is particularly useful in the formation of thin dielectric layers of 1 μm or less and can be used to manufacture MLCCs having both desired capacity and longevity traits. 1. A ceramic powder that contains , as a main composition , barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation , wherein the barium titanate powder is such that the percentage of barium titanate particles having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more.2. A ceramic powder according to claim 1 , wherein the percentage of barium titanate particles having twin defects in the barium titanate powder is 5 to 9%.3. A ceramic powder according to claim 1 , wherein the crystal lattice c/a of the barium titanate powder is 1.0075 to 1.0104.4. A ceramic powder according to claim 2 , wherein the crystal lattice c/a of the barium titanate powder is 1.0075 to 1.0104.5. A ceramic powder according to claim 1 , wherein the average particle size of the barium titanate powder is 80 to 150 nm.6. A ceramic powder according to claim 2 , wherein the average particle size of the barium titanate powder is 80 to 150 nm.7. A ceramic powder according to claim 3 , wherein the average particle size of the barium titanate powder is 80 to 150 nm.8. A ceramic powder according to claim 4 , wherein the average particle size of the barium titanate powder is 80 to 150 nm.9. A multi- ...

Pzt-based ferroelectric thin film and method of manufacturing the same

A PZT-based ferroelectric thin film formed on a lower electrode of a substrate having the lower electrode in which the crystal plane is oriented in a (111) axis direction, having an orientation controlling layer which is formed on the lower electrode and has a layer thickness in which a crystal orientation is controlled in a (111) plane preferentially in a range of 45 nm to 270 nm, and a film thickness adjusting layer which is formed on the orientation controlling layer and has the same crystal orientation as the crystal orientation of the orientation controlling layer, in which an interface is formed between the orientation controlling layer and the film thickness adjusting layer.

Metal paste manufacturing method for internal electrode of multi layer ceramic capacitor

A method of manufacturing a metal paste for an internal electrode according to the present invention includes preparing each of a metal powder and an organic vehicle; preparing a ceramic inhibitor powder in which a nano glass added with a rare-earth element is mixed; manufacturing a primary mixture by mixing the metal powder of 70 to 95 wt % and the ceramic inhibitor powder of 5 to 30 wt % when each of the metal powder, the organic vehicle, and the ceramic inhibitor powder in which the nano glass added with the rare-earth element is mixed is prepared; manufacturing a secondary mixture by mixing the primary mixture of 50 to 70 wt % and the organic vehicle of 30 to 50 wt % when the primary mixture is manufactured; and manufacturing the metal paste for the internal electrode by filtering the secondary mixture when the secondary mixture is manufactured.

LAMINATED SEMICONDUCTOR CERAMIC CAPACITOR WITH VARISTOR FUNCTION AND METHOD FOR MANUFACTURING THE SAME

A laminated semiconductor ceramic capacitor with a varistor function includes a component body having a plurality of semiconductor ceramic layers formed of a SrTiO-based grain boundary insulated semiconductor ceramic and a plurality of internal electrode layers predominantly composed of Ni, and external electrodes on both ends of the component body. The external electrodes are electrically connected to the internal electrode layers. A thickness of each of the semiconductor ceramic layers, excluding the outermost semiconductor ceramic layers, is 20 μm or more, and an average grain diameter of crystal grains in the semiconductor ceramic layers is 1.5 μm or less. When a central part or the vicinity of the central part in a laminating direction of the semiconductor ceramic layer is analyzed by a WDX method, a ratio x/y of the intensity x of the Ni element to the intensity y of the Ti element is 0.06 or less. 1. A laminated semiconductor ceramic capacitor with a varistor function comprising:{'sub': '3', 'a laminated sintered body having a plurality of semiconductor ceramic layers of a SrTiO-based grain boundary insulated semiconductor ceramic and a plurality of internal electrode layers predominantly composed of Ni; and'}external electrodes on opposed ends of the laminated sintered body, the external electrodes electrically connected to the internal electrode layers,wherein a thickness of each of the semiconductor ceramic layers is 20 μm or more, and an average grain diameter of crystal grains in the semiconductor ceramic layers is 1.5 μm or less.2. The laminated semiconductor ceramic capacitor with a varistor function according to claim 1 , wherein a ratio x/y of an intensity x of the Ni to an intensity y of the Ti is 0.06 or less.3. The laminated semiconductor ceramic capacitor with a varistor function according to claim 2 , wherein the ratio x/y is determined by an elemental analysis of a central part or a vicinity of the central part in a laminating direction of the ...

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor exhibits superior life characteristics in a high temperature load test despite the use of very thin dielectric layers. As a dielectric ceramic constituting a dielectric layer of the multilayer ceramic capacitor, a perovskite-type compound is used and contains Ba and Ti (a portion of Ba can be replaced with at least one of Ca and Sr, and a portion of Ti can be replaced with Zr) as a main component, and including La within the range of 2-6 parts by mole, Mg within the range of 3-5 parts by mole, and Mn within the range of 1.5-3 parts by mole in a case where a total content of Ti and Zr is 100 parts by mole. 115-. (canceled)16. A multilayer ceramic capacitor , comprising:a multilayer body including a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along interfaces between the dielectric layers; anda plurality of external electrodes located on an outer surface of the multilayer body and electrically connected to the internal electrodes; whereina composition of the multilayer body includes, as a main component, a perovskite-type compound containing Ba and Ti, where a portion of Ba can be replaced with at least one of Ca and Sr, and a portion of Ti can be replaced with Zr, and further includes La, Mg, and Mn; andwhen the multilayer body is dissolved by a solvent, and in a case where a total content of Ti and Zr is 100 parts by mole, contents of elements are:La: 2-6 parts by mole;Mg: 3-5 parts by mole; andMn: 1.5-3 parts by mole.17. The multilayer ceramic capacitor according to claim 16 , wherein La is 4-6 parts by mole.18. The multilayer ceramic capacitor according to claim 16 , wherein claim 16 , in a case where a content of La is 100 parts by mole claim 16 , a total content of Ce claim 16 , Pr claim 16 , and Nd is less than or equal to 20 parts by mole including 0 part by mole.19. The multilayer ceramic capacitor according to claim 16 , wherein claim 16 , in a case where a content of La is 100 parts ...

Electronic component

In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.

LAMINATED CERAMIC CAPACITOR

Provide is a laminated ceramic capacitor which can suppress the decrease in dielectric constant even when ceramic layers are further reduced in thickness. The laminated ceramic capacitor includes a laminate having a plurality of stacked ceramic layers stacked and a plurality of internal electrodes formed along interfaces between the ceramic layers; and a plurality of external electrodes formed on the outer surface of the laminate and electrically connected to the internal electrodes ceramic grains in contact with both of adjacent internal electrodes adjacent with a ceramic layer interposed therebetween are present in the ceramic layers and the internal electrodes are 0.60 μm or less in thickness. 1. A laminated ceramic capacitor comprising a laminate having a plurality of stacked ceramic layers and a plurality of internal electrodes disposed at interfaces between ceramic layers; and a plurality of external electrodes disposed on an outer surface of the laminate and electrically connected to internal electrodes ,wherein ceramic layers have ceramic grains in contact with both of the adjacent internal electrodes with a ceramic layer interposed therebetween, andthe internal electrodes are 0.60 μm or less in thickness.2. The laminated ceramic capacitor according to claim 1 , wherein of 100 lines drawn perpendicular to the internal electrodes at an interval of the average grain size of the ceramic grains in a cross section of the ceramic layer claim 1 , the percentage of the number of lines on which ceramic grains are present in contact with both of the adjacent internal electrodes is 5 to 20%.3. The laminated ceramic capacitor according to claim 2 , wherein the ceramic layers contain claim 2 , as their main constituent claim 2 , a perovskite-type compound containing Ba and Ti claim 2 , in which some of Ba is optionally substituted with at least one of Ca and Sr claim 2 , and some of Ti is optionally substituted with Zr.4. The laminated ceramic capacitor according to ...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; and first and second inner electrode layers formed within the ceramic body, wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first or second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td<0.30 are satisfied. According to the present invention, a large-capacity multilayer ceramic electronic component capable of improving withstand voltage characteristics and having excellent reliability can be realized by improving uniformity in the thickness of the inner electrode layers. 118-. (canceled)19. A multilayer ceramic electronic component , comprising:a ceramic body including a dielectric layer; andfirst and second inner electrode layers formed within the ceramic body,wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first electrode layer or the second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td≦0.30 are satisfied.20. The multilayer ceramic electronic component of claim 19 , wherein the thickness of the dielectric layer is measured by scanning a cross section in a length-thickness (L-T) direction claim 19 , which is cut in a central portion in a width (W) direction of the ceramic body.21. The multilayer ceramic electronic component of claim 19 , wherein claim 19 , when a thickness of the first inner electrode layer or the second inner electrode layer is defined as te claim 19 , te≦0.6 μm is satisfied.22. The multilayer ceramic electronic component of claim 21 , wherein the thickness of the first inner electrode layer or the second inner electrode layer is measured by scanning a cross section in a length-thickness (L-T) direction claim 21 , which is cut in a central portion in a width (W) direction of the ceramic body. ...

METHOD FOR MANUFACTURING A CAPACITIVE STORAGE ELEMENT, STORAGE ELEMENT AND ITS USE

A method for manufacturing a capacitive storage element having a layer system on one side of a porous substrate, which is designed as a conductive substrate or has a conductive surface layer at least on the one side, the layer system having a layer sequence of a dielectric titanate layer and an electrically conductive layer. It is provided that to form a closed titanate layer having an adjustable minimum layer thickness, an external electrical field is applied in the direction of the layer sequence, and when the field is applied, a fluid containing titanate particles is applied to the substrate. A corresponding capacitive storage element and the use of a capacitive storage element as a storage element of an electrical energy storage unit for supplying energy to an electric drive or hybrid drive of a motor vehicle are also described. 112-. (canceled)13. A method for manufacturing a capacitive storage element having a layer system on one side of a porous substrate , which is designed as a conductive substrate or has a conductive surface layer at least on the one side , the layer system having a layer sequence of a dielectric titanate layer and an electrically conductive layer , the method comprising:forming a closed titanate layer having an adjustable minimal layer thickness by applying an external electrical field in a direction of the layer sequence, and when the field is applied, applying a fluid containing titanate particles to the substrate.14. The method as recited in claim 13 , wherein the storage element is a storage element for an electrical energy storage unit for supplying energy to an electric drive or hybrid drive of a motor vehicle claim 13 , the layer thickness of the closed titanate layer being set at ≧0.2 μm at each point in the layer.15. The method as recited in claim 13 , wherein the forming closed titanate layer is heated to 700° C. to 900° C. while the field continues to be applied.16. The method as recited in claim 13 , further comprising: ...

CONDUCTIVE PASTE FOR INNER ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING THE SAME

Disclosed are a conductive paste for an inner electrode and a multilayer ceramic electronic component having the same. There is provided a conductive paste for an inner electrode, including: a conductive metal powder for manufacturing the inner electrode for multilayer ceramic electronic component; an organic binder including at least one selected from a group consisting of acryl-based resin, butyral-based resin, and a cellulose-based resin to disperse the conductive metal powder; and a solvent including eucalyptol. 1. A conductive paste for an inner electrode , comprising:a conductive metal powder;an organic binder including at least one selected from a group consisting of an acryl-based resin, a butyral-based resin, and a cellulose-based resin; anda solvent including eucalyptol.2. The conductive paste for an inner electrode of claim 1 , wherein the solvent further includes dihydroxy terephthalic acid.3. The conductive paste for an inner electrode of claim 2 , wherein the solvent further includes at least one selected from a group consisting of p-cymene claim 2 , α-pinene claim 2 , and d-limonene.4. The conductive paste for an inner electrode of claim 3 , wherein the content of eucalyptol is 30 to 60 parts by weight claim 3 , the content of dihydroxy terephthalic acid is 20 to 30 parts by weight claim 3 , and the content of at least one selected from a group consisting of p-cymene claim 3 , α-pinene claim 3 , d-limonene is 20 to 40 parts by weight claim 3 , per 100 parts by weight of solvent.5. The conductive paste for an inner electrode of claim 4 , wherein the solvent includes p-cymene and the content of p-cymene is 30 to 40 parts by weight per 100 parts by weight of solvent.6. The conductive paste for an inner electrode of claim 1 , wherein the conductive metal powder is at least one selected from a group consisting of Ni powder claim 1 , Ag powder claim 1 , Cu powder claim 1 , and Pd powder.7. The conductive paste for an inner electrode of claim 1 , wherein the ...

Multilayered ceramic component

Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is within 30% of an average particle size of the metal powders. According to the first exemplary embodiment of the present invention, the particle size and the added amount of common material squeezed out from the internal electrode layer at the time of firing at a high temperature are controlled, thereby making it possible to improve the connectivity of the internal electrode.

MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

A multilayer ceramic capacitor includes a multilayer body including a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along interfaces between the dielectric layers, and a plurality of external electrodes located on an outer surface of the multilayer body and electrically connected to the internal electrodes. A main component of the internal electrodes is Ni, and the internal electrodes also contain Sn. 1. (canceled)2. A multilayer ceramic capacitor , comprising:a multilayer body including a plurality of laminated dielectric layers and a plurality of internal electrodes arranged along interfaces between the dielectric layers; anda plurality of external electrodes located on an outer surface of the multilayer body and electrically connected to the internal electrodes; whereina thickness of each of the dielectric layers is less than or equal to about 2.5 μm; andeach of the internal electrodes contains Ni as a main component and contains Sn, and a molar ratio of Sn with respect to a sum of Ni and Sn in each of the internal electrodes is greater than or equal to about 0.001 and less than or equal to about 0.1.3. The multilayer ceramic capacitor according to claim 2 , wherein each of the dielectric layers includes claim 2 , as a main component claim 2 , a perovskite-type compound containing Ba and Ti claim 2 , and a portion of Ba can be replaced with Ca claim 2 , and a portion of Ti can be replaced with Zr.4. The multilayer ceramic capacitor according to claim 2 , wherein the plurality of external electrodes are made of Ag and Cu as main components.5. The multilayer ceramic capacitor according to claim 2 , wherein Sn is in a form of an alloy containing Sn and Ni or an intermetallic compound containing Sn and Ni.6. The multilayer ceramic capacitor according to claim 2 , wherein each of the dielectric layers includes a subcomponent of a rare earth element and/or Mn claim 2 , Mg and Si.7. A method for manufacturing a multilayer ...

METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT

In a ceramic electronic component, a first internal electrode includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section is connected to a first external electrode. The number of cross-linked sections per unit area in the first extraction section is less than the number of cross-linked sections per unit area in the first opposed section. 1. A method for manufacturing a ceramic electronic component including a ceramic body including first and second principal surfaces , first and second side surfaces , and first and second end surfaces , a first internal electrode provided in the ceramic body , the first internal electrode extending in a direction from the first end surface , a second internal electrode provided in the ceramic body to be opposed to the first internal electrode with a ceramic layer interposed therebetween , the second internal electrode extending in the direction from the second end surface , a first external electrode provided on the first end surface and connected to the first internal electrode , and a second external electrode provided on the second end surface and connected to the second internal electrode , wherein the ceramic body includes a cross-linked section penetrating through the first internal electrode , and providing a cross-linkage for the ceramic layers adjacent with the first internal electrode interposed therebetween , the method comprising:a step of preparing a green sheet laminated body by stacking a plurality of ceramic green sheets including a ceramic green sheet for forming the ceramic body, the ceramic green sheet including, on a surface thereof, a conductive paste layer for forming the first or second internal electrode; anda firing step of preparing the ceramic body by firing ...

CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT FABRICATED USING THE SAME

There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin. 1. A conductive paste composition for an external electrode , comprising:a conductive metal powder; anda resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin.2. The conductive paste composition for an external electrode of claim 1 , wherein the resin mixture is included in an amount of 6 to 18 parts by weight based on 100 parts by weight of the conductive metal powder.3. The conductive paste composition for an external electrode of claim 1 , wherein the polyvinyl formal resin is included in an amount of 5 wt % to 20 wt % in the resin mixture.4. The conductive paste composition for an external electrode of claim 1 , wherein the epoxy-based resin is included in an amount of 24.0 wt % to 28.5 wt % in the resin mixture.5. The conductive paste composition for an external electrode of claim 1 , wherein the phenoxy-based resin is included in an amount of 56.0 wt % to 66.5 wt % in the resin mixture.6. The conductive paste composition for an external electrode of claim 1 , wherein the conductive metal powder is formed of at least one selected from a group consisting of silver (Ag) claim 1 , copper (Cu) claim 1 , nickel (Ni) claim 1 , and sliver-palladium (Ag—Pd).7. A multilayer ceramic electronic component claim 1 , comprising:a ceramic body including a dielectric layer;first and second internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween;a first external electrode electrically connected to the first ...

LAMINATED CERAMIC ELECTRONIC COMPONENT

A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 μm or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 μm or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured. 10.1 μm or less.. A laminated ceramic electronic component having ceramic layers and electrode layers stacked with the ceramic layers , wherein a thickness of each electrode layer is 0.5 μm or less and an average size of crystal grains constituting the electrode layer is2. A laminated ceramic electronic component according to claim 1 , wherein a surface roughness based on a maximum height of an interface between each ceramic layer and each electrode layer is one-third the thickness of the electrode layer or less.3. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is one-half the thickness of the ceramic layer or less.4. A laminated ceramic electronic component according to claim 1 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.5. A laminated ceramic electronic component according to claim 2 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.6. A laminated ceramic electronic component according to claim 3 , wherein the thickness of the electrode layer is 0.5 μm or less and 0.4 μm or more.7. A laminated ceramic electronic component according to claim 1 , wherein each electrode layer is comprised of continuous portions and discontinuous portions along an extending direction as viewed in a cross section claim 1 , wherein the total length of the continuous portions is more than 80% but less than 100% of the length of the electrode layer.8. A multilayer ceramic capacitor comprising ceramic ...

DIELECTRIC CERAMIC, METHOD OF MANUFACTURING DIELECTRIC CERAMIC, AND MULTILAYER CERAMIC CAPACITOR

A dielectric ceramic whose primary component is an ABOcompound (A contains Ba and B contains Ti) has a per-layer thickness of approx. 0.5 μm or less, where the volume ratio to all dielectric sintered grains of those whose grain size is in a range of 0.02 μm to 0.15 μm is adjusted to a grain size distribution of 1% to 10%. High dielectric constant and high reliability can be achieved at the same time with the dielectric ceramic. 1. A dielectric ceramic whose primary component is an ABOcompound (A contains Ba (barium) and B contains Ti (titanium)) and which is constituted by dielectric sintered grains , where a volume ratio to total dielectric sintered grains of those whose grain size is in a range of 0.02 μm to 0.15 μm is 1% to 10%.2. A dielectric ceramic according to claim 1 , wherein an average grain size of total sintered grains is in a range of 0.13 μm to 0.25 μm.3. A method of manufacturing a dielectric ceramic claim 1 , comprising:{'sub': '3', 'preparing dielectric green sheets by adding an auxiliary component of 0.1 μm or less in grain size to a material powder for primary component constituted by an ABOcompound (A contains Ba (barium) and B contains Ti (titanium)) and having a grain size of 0.05 μm to 0.12 μm; and'}sintering the dielectric green sheets so that a volume ratio to total dielectric sintered grains of those whose grain size is in a range of 0.02 μm to 0.15 μm becomes 1% to 10%.4. A method of manufacturing a dielectric ceramic according to claim 3 , wherein an average grain size of total sintered grains constituting the dielectric ceramic is in a range of 0.13 μm to 0.25 μm.5. A multilayer ceramic capacitor formed by alternately stacking dielectric layers constituted by dielectric sintered grains claim 3 , and electrode layers claim 3 , wherein:a thickness of each dielectric layer is 0.5 μm or less; and{'sub': '3', 'a primary component of the dielectric layer is an ABOcompound (A contains Ba (barium) and B contains Ti (titanium)) and a volume ratio ...

MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes and on outer surfaces of the multilayer body. The composition of the multilayer body includes a perovskite-type compound containing Ba and Ti (where a part of Ba may be substituted by Ca, and a part of Ti may be substituted by Zr) as a primary ingredient, and further includes M (where M is at least one of Cu, Zn, Li, K, and Na) and Bi. The total content of M and Bi is equal to or greater than 3 molar parts when the total content of Ti and Zr is 100 molar parts. The crystal particle size of the dielectric ceramic is 30 nm or more and 150 nm or less. 1. A multilayer ceramic capacitor comprising a multilayer body having a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes 'wherein the dielectric comprises a perovskite-type compound containing Ba and Ti in which a part of Ba may be substituted by Ca, and a part of Ti may be substituted by Zr as a primary ingredient, and further includes Bi and one of M and Q, in which M is at least one member of the group consisting of Cu, Zn, Li, K, and Na, and Q is at least one member of the group consisting of Ba, Ca and Sr,', 'at different interfaces between said dielectric ceramic layers; and external electrodes on an outer surface of said multilayer body,'}the total content of M, Q and Bi is equal to or greater than 3 molar parts when the total content of Ti and Zr is 100 molar parts, andthe crystal particle size of said dielectric is 30 nm or more and 150 nm or less.2. The multilayer ceramic ...

LAMINATED CERAMIC CAPACITOR

A dielectric ceramic composition is represented by BaTiO+aReO+bMnO+cVO+dMoO+eCuO+fBO+gLiO+xSrO+yCaO (wherein Re represents one or more elements selected from among Eu, Gd, Dy, Ho, Er, Yb, and Y; and a-h each represents the mole number of each component with respect to 100 mol of the main component that is composed of BaTiO). When the molar ratio of (Ba+Sr+Ca)/Ti contained in the dielectric ceramic composition is represented by m, the 0.10≦a≦0.50, 0.20≦b≦0.80, 0≦c≦0.12, 0≦d≦0.07, 0.04≦c+d≦0.12, 0≦e≦1.00, 0.50≦f≦2.00, 0.6≦(100(m−1)+2g)/2f≦1.3, and 0.5≦100(m−1)/2g≦5.1 are satisfied. 1. A dielectric ceramic composition constituted by a primary component constituted by BaTiOand auxiliary components constituted by Re , Mn , V , Mo , Cu , B , Li , Ca , and Sr , wherein it is expressed by BaTiO+aReO+bMnO+cVO+dMoO+eCuO+fBO+gLiO+xSrO+yCaO (where Re represents at least one type of element selected from Eu , Gd , Dy , Ho , Er , Yb , and Y , and a to g , x , and y represent mol numbers relative to 100 mol of the primary component constituted by BaTiO) and , when a mol ratio of (Ba+Sr+Ca)/Ti contained in the dielectric ceramic composition is given by m , 0.10≦a≦0.50 , 0.20≦b≦0.80 , 0≦c≦0.12 , 0≦d≦0.07 , 0.04≦c+d≦0.12 , 0≦e≦1.00 , 0.50≦f≦2.00 , 0.6≦(100(m−1)+2g)/2f≦1.3 , 0.5≦100(m−1)/2g≦5.1 , 0≦x≦1.5 , and 0≦y≦1.5.2. A dielectric ceramic composition according to claim 1 , wherein Si contained as impurity accounts for 1.0 mol or less in equivalent SiOrelative to 100 mol of the primary component constituted by BaTiO.3. A dielectric ceramic composition according to claim 1 , wherein it is expressed by (BaSrCa)TiO+aReO+bMnO+cVO+dMoO+eCuO+fBO+gLiO+xSrO+yCaO claim 1 , where 0≦x+v×100≦1.5 and 0≦y+w×100≦1.5.4. A dielectric ceramic composition according to claim 1 , wherein it can be made denser at a sintering temperature of 1030° C. or below.5. A laminated ceramic capacitor comprising multiple dielectric ceramic layers as well as internal electrodes formed between the dielectric ceramic ...

Electronic component

A mounting structure includes an electronic component mounted on a circuit board. Land electrodes are disposed on a board body and are connected to outer electrodes of the electronic component through solders, respectively. A distance from each of the land electrodes to a top of the corresponding solder is not larger than about 1.27 times a distance from each of the land electrodes to an exposed portion of a capacitor conductor exposed at an end surface of the electronic component, the capacitor conductor being positioned closest to the circuit board.

LAMINATED CERAMIC CAPACITOR

A laminated ceramic capacitor has multiple layered dielectric ceramic layers of a dielectric ceramic constituted by primary phase grains whose primary component is BaTiO, secondary phase grains containing at least Re (Re represents at least one of Eu, Gd, Dy, Ho, Er, Yb, and Y), Ba, and Ti, and grain boundary phase containing at least one of B and Li or both; and internal electrodes which are made of Cu or Cu alloy. When a thickness of the dielectric ceramic layer is given by t, and when grain sizes at cumulative 20%, cumulative 50%, and cumulative 95% points of a cumulative count distribution of the primary phase grains are given by D20, D50, and D95, respectively, D20≦D50×70%, D50≦t/4, D95≦t/2, and CV value ((standard deviation between D20 and D95)/D50)<40% are satisfied. 1. A laminated ceramic capacitor having: a ceramic laminate of roughly rectangular solid shape constituted by multiple layered dielectric ceramic layers which in turn are constituted by a dielectric ceramic constituted by primary phase grains whose primary component is BaTiO , secondary phase grains containing at least Re (Re represents at least one of Eu , Gd , Dy , Ho , Er , Yb , and Y) , Ba , and Ti , and grain boundary phase containing at least one of B (boron) and Li (lithium) or both; internal electrodes which are made of Cu or Cu alloy and formed in a manner opposing each other via the dielectric ceramic and lead out alternately to different end faces; and external electrodes which are formed on both end faces of the dielectric ceramic layers and connected electrically to the internal electrodes led out to the end faces ,wherein when a thickness of the dielectric ceramic layer sandwiched between the internal electrodes is given by t, and when grain sizes at cumulative 20%, cumulative 50%, and cumulative 95% points of a cumulative count distribution obtained by measuring sizes of the primary phase grains in the dielectric ceramic layer are given by D20, D50, and D95, respectively, D20≦D50× ...

Electronic component

A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR

Provided in a dielectric ceramic having flat capacitance characteristics and a high dielectric constant, and a multilayer ceramic electronic component (such as a multilayer ceramic capacitor) in which the dielectric ceramic is used. A multilayer ceramic capacitor includes a multilayer body having a plurality of dielectric ceramic layers and a plurality of internal electrodes, and external electrodes formed on the multilayer body. The composition of the multilayer body includes any of a bismuth layered compound containing Sr, Bi and Ti, a bismuth layered compound containing Sr, Bi and Nb, and a bismuth layered compound containing Ca, Bi and Ti as a primary ingredient, Bi and at least one of Cu, Ba, Zn and Li, and satisfies the conditions that if the Ti content is 400 molar parts or the Nb content is 200 molar parts, then (Bi content-Ti content) or (Bi content-Nb content) is equal to or greater than 1 molar part and less than 7.5 molar parts and the total content of Cu, Ba, Zn and Li is equal to or greater than 1 molar part and less than 10 molar parts. 1. A multilayer ceramic component comprising:a multilayer body having a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes each disposed at an interface between said dielectric ceramic layers; andan external electrode disposed on an outer surface of said multilayer body and electrically connected to an internal electrode,wherein the composition of said dielectric ceramic layer comprises one of a bismuth layered compound containing Sr, Bi, and Ti or Nb, and a bismuth layered compound containing Ca, Bi and Ti as a primary ingredient, Bi and at least one member of the group consisting of Cu, Ba, Zn and Li, andwherein if the Ti content is 400 molar parts or the Nb content is 200 molar parts, then (Bi content-Ti content) or (Bi content-Nb content) is equal to or greater than 1 molar part and less than 7.5 molar parts and the total content of Cu, Ba, Zn and Li is equal to or greater than ...

Multilayered ceramic electronic component and manufacturing method of the same

There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; an a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body.

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME

There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied. 1. A laminated ceramic electronic component , comprising:a ceramic body including a dielectric layer; andfirst and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body,wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied.2. The laminated ceramic electronic component of claim 1 , wherein in a case in which the cover layer is divided into three equal parts in a thickness direction claim 1 , when an average particle diameter of a dielectric grain in an outermost part among the three equal parts is Dc1 and an average particle diameter of a dielectric grain in an intermediate ...

METHOD FOR MANUFACTURING HIGH PERFORMANCE MULTILAYER CERAMIC CAPACITORS

The invention relates to a method for manufacturing a high performance multi layer ceramic capacitor, comprising the steps of: a) providing a substrate having a first edge and a second edge arranged opposite to the first edge, b) depositing a bottom electrode layer onto the substrate using a thick-film and/or thin-film deposition method such that the electrode layer extends all the way from the first edge towards the second edge of the substrate such that a trench free of the bottom electrode layer is provided adjacent in between the deposited bottom electrode layer and the second edge of the substrate, d) depositing a high-k dielectric ceramic layer onto the electrode layer using a thick-film and/or thin-film deposition method such that the high-k dielectric ceramic layer extends all the way to the first edge and to the second edge of the substrate, f) depositing a low-k dielectric layer comprising silicon nitride, silicon dioxide and/or aluminum oxide onto the high-k dielectric ceramic layer using a thin-film deposition method such that the low-k dielectric layer extends all the way to the first edge and to the second edge of the substrate, h) depositing another electrode layer onto the low-k dielectric layer using a thick-film and/or thin-film deposition method such that the another electrode layer extends all the way to the first edge and to the second edge of the substrate, j) etching the capacitor for cutting a trench through the another electrode layer and through the low-k dielectric layer deposited during steps f) and h) such that the trench is arranged distant to second edge of the substrate, m) cutting the capacitor on both edge sides through the extension of the trenches perpendicular to the extension of the substrate, and n) metalizing both cuffed sides of the capacitor by using a thick-film deposition method. 1. Method for manufacturing a high performance multilayer ceramic capacitor , comprising the steps of:a) providing a substrate having a first ...

LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME

There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented. 1. A laminated ceramic electronic component , comprising:a ceramic body including a dielectric layer; andfirst and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body,when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 being satisfied.2. The laminated ceramic electronic component of claim 1 , wherein an average thickness td of the dielectric layer satisfies 0.1 μm≦td≦0.5 μm.3. The laminated ceramic electronic component of claim 1 , wherein the average thickness td of the dielectric layer and D50 in a value of 50% in the cumulative distribution of dielectric grains by an average particle diameter thereof satisfy the relationship of td/8≦D50≦td/3.41. The laminated ceramic electronic component of claim claim 1 , wherein when an average roughness of the dielectric layer on a central line thereof is Ra claim 1 , 5 nm≦Ra≦30 nm is satisfied.5. The laminated ceramic electronic component of claim 1 , wherein a ceramic powder used for ...

Ceramic electronic component, method of manufacturing the same, and collective component

A collective component has a first region that intersects with a conductive film for external terminal electrodes in a break line in which break leading holes are arranged and a second region that does not intersect with the conductive film for external terminal electrodes in the break line. The plurality of break leading holes includes at least one extending break leading hole located so as to extend over the first region and the second region.