ELEKTRONISCHES STEUERGERAET

Leistungshalbleitermodul mit zweiteiligem Gehäuse

Die Erfindung betrifft ein Leistungshalbleitermodul (1) zur Anordnung auf einem Kühlkörper (20), wobei das Leistungshalbleitermodul (1) Folgendes aufweist: mindestens ein Substrat (4), welches eine erste, für eine dem Kühlkörper (20) zugewandte Anordnung und zur thermischen leitfähigen Verbindung mit diesem bestimmte Seite aufweist; wenigstens ein auf einer der ersten gegenüberliegenden, zweiten Seite des Substrats (4) angeordnetes Leistungshalbleiterbauelement (14); und ein elektrisch isolierendes Gehäuse (2, 3), welches einen Hohlraum definiert in dem das Substrat (4) und das wenigstens eine Leistungshalbleiterbauelement (14) aufgenommen sind; wobei das Gehäuse (2, 3) einen Rahmen (2), welches das wenigstens eine Substrat (4) rahmenartig umgibt und eine am Kühlkörper (20) mit Befestigungsmitteln (11) zu befestigte Haube (3) aufweist, und wobei die Haube (2) wenigstens einen zur Anlage an das Substrat (4) vorgesehenen Druckstempel (7) aufweist, um wenigstens bei Befestigung des Leistungshalbleitermoduls ...

Heat-sink element for IC module

The heat sink element (1) has a rectangular flat plate with a cross-sectional area perpendicular to its thickness which is greater than that of the IC module (10) and provided with integral fixing elements (2) for holding it in thermal contact with the IC module. The fixing elements are positioned around the outside of the contact surface between the heat sink element and the IC module and secured to the printed circuit board (8) in which the IC module is mounted.

WÄRMETAUSCHER FÜR EINE DOPPELSEITIGE KÜHLUNG VON ELEKTRONIKMODULEN

Eine Wärmetauscheranordnung umfasst ein erstes und ein zweites Wärmeableitelement, die Fluidströmungskanäle einschließen, und eine Klemmvorrichtung. Die Wärmeableitelemente sind durch einen Raum getrennt, in dem mindestens eine wärmeerzeugende Elektronikkomponente liegt, wobei äußere Seitenflächen jeder Elektronikkomponente im Wärmekontakt mit den Wärmeableitelementen ist. Die Klemmvorrichtung umfasst ein erstes und zweites Federelement, die in Kontakt mit einer Außenfläche der Wärmeableitelemente angeordnet sind. Die Federelemente sind miteinander verbunden, um Druckkräfte auf die Wärmeableitelemente auszuüben und zu bewirken, dass die Elektronikkomponenten zwischen Wärmeableitelementen eingespannt sind. Jedes Federelement umfasst diskrete Kraftaufbringungsbereiche zum Aufbringen einer Kraft auf ein Wärmeableitelement und eine Mehrzahl von Befestigungsbereichen zum Komprimieren der Federelemente und Halten der Positionen der Federelemente relativ zu den Außenflächen der Wärmeableitelemente ...

Insulator for supporting thyristor heat dissipating members - has ribbed insulator embedded between tapped metal bush and outer metal ring

The insulator suitable for carrying heat dissipating members for a disc shaped thyristor contains a metal bush (1) into which screws a rod. The bush is mounted on a lower member, and the rod passes through an upper member and carries members which hold down the upper member. The metal bush has a bottom flange (1b), and the whole is embedded in insulating material (3). This material extends above the bush and includes external cooling ribs (3b), while the base is stepped to match the bush inside. This includes a larger diameter portion (3d) which carries an outer metal ring (2) which assists its keying into the lower member. Its top surface is flush with that of the lower member, and the cooling ribs are above it. The metal parts are of non-magnetic metal and the insulating material may be of ceramic or a glass fibre reinforced substance.

Cooling assembly for an integrated circuit

The assembly includes an engaging plate (24) mounted on a fin (21) of each of the two outermost opposite rows of fins of a finned plate (2). Each engaging plate includes at least one first slot (241) for releasably engaging with an associated protrusion (12) on a pin seat (11) and a second slot (242). A cam plate (25) is mounted adjacent each engaging plate and includes an eccentric hole (251). A screw (23) is extended through the eccentric hole of each cam plate, the second slot of the associated engaging plate, and a hole (22) of the associated fin. When the cam plate is rotated about the screw to bear against a lip (243) formed at the top of the associated engaging plate, the engaging plate is moved upwardly such that the first slot of the engaging plate firmly engages with the associated protrusion.

Demountable hybrid assemblies with microwave-bandwidth interconnects

ASSEMBLY-HEAT SINK FOR SEMICONDUCTOR DEVICES

Engagement assembly for connecting a heat dissipation device to an integrated circuit

Electronic assembly and socket therefor

IMPROVEMENTS IN DIAMOND HEATSINK ASSEMBLIES

CIRCUIT BOARD INSTALLATION

TIGHTENER FOR AT LEAST A THERMAL AND ELECTRICAL PRINTINGCONTACTED SEMICONDUCTOR COMPONENT IN DISK CELLULAR CONSTRUCTION WAY

HEAT SINK FUER AN ELECTRONIC ELEMENT.

TIGHTENER FUER AT LEAST THERMALLY AND ELECTRICAL A PRINTINGCONTACTED SEMICONDUCTOR COMPONENT IN DISK CELLULAR CONSTRUCTION WAY

RADIATOR BOX FOR AN ELECTRONIC ELEMENT, DEVICE AND A PROCEDURE FOR ITS PRODUCTION

ASSEMBLY-HEAT SINK FOR SEMICONDUCTOR DEVICES

HEAT SINK FOR SOLID STATE DEVICES CONNECTED TO A CIRCUIT BOARD

HEAT SINK FOR SOLID STATE DEVICES CONNECTED TO A CIRCUIT BOARD The present invention removably mounts a plurality of solid state devices and a circuit board to a chassis heat sink by utilizing a heat conductive device formed with a base and a leg portion with the leg portion extending from the base and having a first relatively flat surface and an angled end portion. The base of the device is adapted to be mounted to a chassis heat sink and the relatively flat surface is adapted to contact one side of each of the plurality of solid state devices. A number of cap members having an inverted L-shaped cross section, with first leg portions and second leg portions are provided with an angled surface for mating with the angled end portion such that the first leg portions are substantially parallel to the first relatively flat surface. Means are provided for urging the first leg portions of the cap member toward the first relatively flat surface for sandwiching the plurality of solid state devices ...

HEAT SINK

Low thermal resistance coupling is provided between electronic components and a main heat sink by the expedient of providing individual, adjustable height pillars between them. Each pillar comprises a bifurcated body and a detachable head. The head is attached to the hot component by means of silver loaded epoxy. The height of the pillar may subsequently be adjusted, the component attached to a circuit board, and the pillar secured by establishing an interference fit between the pillar and the walls of its mounting hole. Thermal resistances of less than 6.5.degree.C/Watt are achieved between a semiconductor junction and a heat sink coupled in this way.

Verfahren zum Herstellen eines gut wärmeleitenden und elektrisch gut leitenden Kontaktes zwischen zwei Körpern, welche mit zwei angepassten Flächen aufeinandergepresst werden

Verwendung von anodisch oxydierten Aluminiumscheiben

Boîtier de dispositif semi-conducteur, notamment de diode ou thyristor

HALTER MIT MINDESTENS EINEM SCHEIBENFOERMIGEN HALBLEITERELEMENT.

Flanschkühler für ein Leistungs-Halbleiterventil

Halbleiterbaueinheit für die Erregung bürstenloser elektrischer Maschinen

Halbleitereinheit und Verfahren zur Herstellung derselben

Halbleiter-Bauelement

Vorrichtung mit von dieser gehaltenen Kühlkörpern für Halbleiterbauelemente

Halter für mindestens ein scheibenförmiges Halbleiterelement

Semiconductor device

使用波动焊接工艺固定母板芯片组散热器

... 提供一种电子器件和用于从产热部件交换热量的方法，该产热部件具有正面和背面，正面与背面相对设置，并且正面固定到包括多个孔的基板上。热界面材料设置在产热部件的背面上。包括对应基板中的多个孔的多个固定管脚的散热器设置在热界面材料上，以便固定管脚穿过这些孔设置。热界面材料熔化和湿润，以便在通过波动焊接机的预热器上时在背面和散热器之间形成热耦合。此外，当从波动焊接机中的焊接波上穿过时，焊接固定管脚，以便在各个固定管脚和基板之间形成焊接头，由此在热界面材料的预热期间形成的热耦合中锁定，以便提供低成本热解决方案。 ...

Clamp for disc shaped semiconductor components - has two pressure plates between which component is held

DEVICE OF PARALLELIZATION OF ELECTRONICS COMPONENTS OF POWER

Fastening electrical components, in particular semiconductor, in a cylindrical housing

WASTEFUL WHOLE OF HEAT, IN PARTICULAR FOR CIRCUITS PRINT

Connecting structure for heat sink and integrated CPU circuit

Cet ensemble, prévu pou circuit intégré 1 monté sur un siège à ergots 11 comportant deux parties en saillie 12 et pour un dispositif de dissipation thermique comportant des ailettes 21 et deux trous 22 pratiqués dans deux ailettes extérieures, comprend une plaquette de venue en prise 24 montée sur chaque ailette trouée et comprenant une première fente 241 dans sa partie inférieure pour venir en prise sur une partie en saillie 12, une seconde fente 242 dans sa partie intermédiaire et une lèvre 243 à sa partie supérieure, une plaquette de pression 25 montée à l'extérieur de chaque plaquette de venue en prise et comportant un trou excentré 251, et un élément de positionnement 23 traversant le trou excentré, la seconde fente et le trou de l'ailette. Lorsqu'on fait pivoter la plaquette de pression d'un angle préfixé autour de l'élément de positionnement de façon qu'elle vienne en appui sur la lèvre de la plaquette de venue en prise, cette dernière est déplacée vers le haut d'une façon telle ...

Apparatus and method for establishing a thermal link between a semiconductor package and the cooling plate and an electrical link between the conductors of the package, and a printed circuit board.

MONTAGE FORMANT RADIATEUR DE CHALEUR POUR DISPOSITIFS SEMI-CONDUCTEURS

LE MONTAGE DESTINE A L'ASSEMBLAGE DE DISPOSITIFS SEMI-CONDUCTEURS COMPORTE, SELON LA PRESENTE INVENTION, UN ELEMENT DE BASE METALLIQUE 10 ET UN ELEMENT DE RECOUVREMENT OU ELEMENT SUPERIEUR 36 QUI ENFERMENT LES DISPOSITIFS SEMI-CONDUCTEURS DANS UNE CAVITE CYLINDRIQUE QU'ILS FORMENT. CES ELEMENTS SONT ISOLES ELECTRIQUEMENT DES DISPOSITIFS SEMI-CONDUCTEURS DONT ILS ASSURENT UN REFROIDISSEMENT EFFICACE. DES MOYENS SONT PREVUS POUR LA CONNEXION DES DISPOSITIFS SEMI-CONDUCTEURS AVEC LES CIRCUITS EXTERIEURS.

Method of controlling a display panel by capacitive coupling

A method comprising emission periods during which a predetermined emission voltage Vprog-data, which presents a first polarity, is applied and sustained at the control terminal of at least one driver 1,1' of said panel, and depolarization periods during which a predetermined depolarization voltage Vprog-pol, which presents a second polarity, opposite to the first polarity, is applied and sustained at the control terminal of at least one driver of said panel, the address signals of the circuits of said panel being transmitted by capacitive coupling of the address electrodes XD to the control terminals C of these circuits 1,1'. The invention makes it possible to use conventional and inexpensive means of controlling the address electrodes XD.

Heat dissipation apparatus

Mounting structure with heat sink for electronic component and female securing member for same

A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.

PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER

In some embodiments, an integrated circuit package includes a substrate and a heat spreader coupled to the substrate by fasteners. Thermal interface material thermally couples the die to the heat spreader. The heat spreader is provided over the die and is attached to the substrate with fasteners rather than a sealant-adhesive. Some examples of suitable fasteners may include rivets, barbed connectors, and gripping clips.

Circuit board having heat dissipation through holes

A circuit board having heat dissipation through holes, wherein a plurality of through holes are provided in the perimeter of the chip on the circuit board, and heat conduction elements are utilized to connect the heat dissipater and auxiliary heat dissipater provided on two sides of the circuit board. The heat conduction element may be the heat conduction column or heat pipe made of copper or aluminum, and is used to connect the heat dissipater and auxiliary heat dissipater with the shortest distance, thus achieving the speedy transfer of heat generated by the chips and raising the heat dissipation efficiency significantly.

Electronics module heat sink with quick mounting pins

A heat sink for a computer chip is adapted for mounting to a heat exchange plate that has elongate slots with limited clearance on the other side. Mounting apparatus includes latch pins with an elongate knob at the end to have a T-shape with a reduced shaft to define a shank and collar that are so sized as to control the projection of the knob beyond the slot. Specially bent flexible members are preferably interposed between the collar and heat sink to force intimate engagement with the heat exchange plate.

Cooling cap method and apparatus for tab packaged integrated circuit

The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate ...

Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom

An integrated circuit package having a die supported on a ball grid array substrate and wire bonds electrically connecting the die to the substrate. Supported on the substrate is a lock ring having a threaded opening encircling the die. Encapsulant covers the die and the wire bonds and adheres the lock ring to the substrate. A heat sink having a threaded portion can be threaded into the lock ring into an operative cooling position relative to the die and subsequently to an unthreaded removed position. When in the latter position, a repair station can be positioned over the package and the solder balls are accessible for hot gas melting thereof for removal (or replacement) of the package from the underlying motherboard.

Support for mounting the electronic components of a single phase unit for an inverter

A support for mounting the electronic components of a single phase unit for an inverter, of the type having an H-shaped cross-section in at least one plane disposed perpendicular to the longitudinal axis thereof. The support includes a planar center plate member, and a pair of planar end plate members coupled to the center plate member and disposed in spaced-apart parallel relationship transversely with respect to the plane of the center plate member. The support is self-supporting, and has an H-shaped cross-section in each of the planes thereof disposed perpendicular to the longitudinal axis of the support.

Transistor clamping device

A transistor-clamping device for a transistor is provided with a holding block and a spring. The holding block engages over the transistor, so that the spring is pre-tensioned. A pressure plate is provided between the holding block and the transistor. The spring fixes the pressure plate on the transistor, so that a uniform pressure is applied to the transistor via the pressure plate, and, at the side facing away from the pressure plate, the latter accordingly provides a good thermal conduction to a cooling element.

Thermal management device attachment

A thermal management device attachment apparatus may be used to thermally couple a thermal management device to a heat generating component on a circuit board. The attachment apparatus may include a support member mounted on the same side of the circuit board as the heat generating component and extending around at least a portion of the component. The support member may include a circuit board mounting portion, a thermal management mounting portion and a side portion extending between the circuit board mounting portion and the thermal management mounting portion. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

LID COVER SPRING DESIGN

A module package can include a substrate; at least one device component configured to be positioned on the substrate; a module package lid configured to be positioned over the at least one device component and on the substrate, the module package lid exhibiting a plateau portion; and at least one mounting spring configured to be positioned on the module package lid, wherein the at least one mounting spring is configured to be mechanically coupled with a mounting surface and further positionally secure the module package lid and the at least one device component. Each mounting spring can include a middle portion; an end portion having a mounting hole; and a curved section between the middle portion and the end portion, the middle portion arranged to mate with the plateau portion of the module package lid when the end portion are secured to the substrate, the curved section being configured to prevent contact with a first corner portion of the module package lid.

Fixing device for double sided heat sink and associated heat dissipating system

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of ...

Heatsink and stiffener mount with integrated alignment

A mount for connecting a heat sink to a PCB may include a threaded post extending along an axis, a first barrel adjacent to the post along an axis and having a larger axial cross-section than the post, and a threaded second barrel defining an opposite end of the mount from the post and having a larger axial cross-section than the first barrel.

Circuit carrier arrangement and method for producing such a circuit carrier arrangement

A method provides a circuit carrier arrangement that includes: a cooling plate (1) which has spacer and fastening elements (3) for connection to a printed circuit board (2) in a spaced-apart manner; a printed circuit board (2) which has bores (4) for receiving spring element sleeves (9); at least one power semiconductor component (10) which is connected by a soldered connection to the printed circuit board (2) and fastening elements (3) in the state in which it is fitted with the cooling plate (1) by means of plug-in connections (11) of spring-action configuration; and at least one spring element (5) having at least two spring element sleeves (9) between which a web (6) that is connected to the spring element sleeves (9) extends, and supporting elements (7) arranged on either side of said web and at least one spring plate (8) being arranged on said web.

COOLING ARRANGEMENT HAVING A SEMICONDUCTOR COMPONENT

GIMBALLED ATTACHMENT FOR MULTIPLE HEAT EXCHANGERS

Improved device for clamping together a semiconductor and its related heat sink

Improved device for clamping together a semiconductor and its related heat sink, characterised by the fact that it is constituted by a pair of bar clamps, provided with packs of calibrated springs, which clamp the radiator onto the semiconductor with the desired uniform pressure, requiring for mounting the removal of only two small areas of the heat sink for the passage of the bar clamps.

СИСТЕМА ТЕПЛОВОГО ИЗЛУЧЕНИЯ

Изобретение относится к системам теплового излучения. Сущность изобретения: система теплового излучения содержит крепежную пластину для крепления к теплоотводу шести переключающих устройств, установленных в линию на печатной плате. Печатная плата изготавливается из одной металлической пластины и имеет базовый участок, выполненный удлиненным в направлении, в котором размещаются переключающие устройства, и три прижимающих устройство участка, выполненные на одной стороне базового участка, отстоящих друг от друга и соединяемых через соединительные части с базовым участком; причем прижимающий устройство участок имеет ширину в продольном направлении базового участка для прижимания двух переключающих устройств в виде пары и имеет сквозное отверстие для винта, образованное в середине его продольной ширины для размещения переключающего устройства между прижимающим устройство участком и теплоотводом и винтового присоединения переключающего устройства к теплоотводу; и при этом соединительная часть ...

Kühlvorrichtung und Montageverfahren dafür

HEAT RADIATOR ASSEMBLY FOR COOLING ELECTRONIC PARTS

Leistungshalbleitermodulanordnung mit eindeutig und verdrehsicher auf einem Kühlkörper montierbarem Leistungshalbleitermodul und Montageverfahren

Leistungshalbleitermodulsystem mit einem Leistungshalbleitermodul (1) und einem Kühlkörper (2), sowie mit wenigstens einem Befestigungsmittel (7), mittels dem das Leistungshalbleitermodul (1) fest mit dem Kühlkörper (2) verbunden werden kann, wobei das Leistungshalbleitermodul (1) eine Unterseite (12) mit einer ersten Wärmekontaktfläche (13) aufweist; der Kühlkörper (2) eine Oberseite (21) mit einer zweiten Wärmekontaktfläche (23) aufweist; das Leistungshalbleitermodul (1) eine Anzahl von N1 1 erster Positionierelemente (14, 15a, 15b, 15c, 16a, 16b, 16c, 17a, 17b, 17c, 18, 19) und der Kühlkörper (2) eine Anzahl von N2 1 zweiter Positionierelemente (24, 25a, 25b, 25c, 26a, 26b, 26c, 27a, 27b, 27c, 28, 29) aufweist, wobei jedes der ersten Positionierelemente mit einem der zweiten Positionierelemente korrespondiert und mit diesem ein Paar ((14, 24); (15a, 25a); (15b, 25b); (15c, 25c); (16a, 26a); (16b, 26b); (16c, 26c); (17a, 27a); (17b, 27b); (17c, 27c); (18, 28); (19; 29)) bildet; das Leistungshalbleitermodul ...

Befestigung von elektrischen Bauteilen, wie Halbleiterbauelementen, mit einem zylindrischen Gehaeuse

VORRICHTUNG ZUR BEFESTIGUNG VON HALBLEITERBAUTEILEN AUF EINEM KUEHLKOERPER

Leistungsmodul und Leistungsumrichtervorrichtung

Gemäß der vorliegenden Erfindung umfasst ein Leistungsmodul ein Isoliersubstrat, ein Halbleiterbauelement, das an dem Isoliersubstrat vorhanden ist, einen Innenanschluss, der an dem Isoliersubstrat vorhanden ist und elektrisch mit dem Halbleiterbauelement verbunden ist, ein Abdichtmaterial, das den Innenanschluss, das Halbleiterbauelement und das Isoliersubstrat abdeckt, so dass ein Endabschnitt des Innenanschlusses freigelegt ist, ein Gehäuse, das getrennt von dem Abdichtmaterial ist und das Abdichtmaterial abdeckt, und ein elastisches Element, das das Gehäuse und den Endabschnitt des Innenanschlusses verbindet.

Cooling apparatus and assembling method thereof

A cooling body has a plurality of fins (13) arrayed in parallel on, and fixed by brazing to, a metal flat plate (12), each of the fins (13) having notches (13d) and projections (13f). The notch (13d) of one fin (13) engages with the projection (13f) of the next fin (13) when the fins (13) are arranged in parallel on the metal flat plate (12). The fins are assembled on bolts passes through holes (13e) in the fins (13). Various designs of fins are described. ...

A cooling fin or plate for a diode comprising a semiconductor junction

... 895,231. Releasable fastenings. HACKBRIDGE & HEWITTIC ELECTRIC CO. Ltd., WELLS, R., and FRICKER, D. J. July 21, 1960 [Aug. 11, 1959], No. 27423/59. Class 44. [Also in Group XXXVI] A cooling plate or pin for a semiconductor diode consists of a plate having horizontally extending open-ended slots in the two vertical sides of the plate with intermediate vertical extensions provided in the slots. Fig. 3 shows two such plates carrying a diode, the plate being supported by insulating rods 23, 24 which pass through the vertical extensions. Alternatively the plate may be suspended from the bolts attached to a bus-bar. Specification 895,232 is referred to.

Assembly-heat sink for semiconductor devices

The present invention is directed to an assembly-heat sink for semiconductor fusions. The fusions are disposed within the assembly-heat sink between cylindrical metal members which both cool the fusions and facilitate making electrical contact to the fusions. Top and bottom members of the assembly-heat sink, which entirely enclose the cylindrical members and the fusions are comprised entirely of metal permitting the assembly-heat sink to be cooled from three sides. The fusions are electrically insulated from the top and bottom members of the assembly-heat sink.

PRESSURE MOUNTING ASSEMBLIES

KÜHLANORDNUNG MIT EINEM HALBLEITERBAUELEMENT

The invention relates to a cooling arrangement having a semiconductor component (1), which comprises a top and a bottom, wherein a bearing surface (9) that gives off heat is arranged on the bottom, said bearing surface being thermally connected to a cooling body (2), and wherein the semiconductor component (1) comprises at least one fastening hole (10), the axis of which is arranged substantially orthogonal to the bearing surface (9) of the semiconductor component (1). To this end, a bushing (3), made of electrically insulating material, is provided, which is guided through the fastening hole (10) and rests on the fastening hole edge with a collar on the top of the semiconductor component (1), wherein the bushing (3) projects over the bottom of the semiconductor component (1), and furthermore wherein the cooling body (2) is exposed over said projecting part of the bushing (3) and wherein a fastening element (4) is provided, which is connected to the bushing (3) and supported on the cooling ...

COOLING ARRANGEMENT WITH A SEMICONDUCTOR COMPONENT

CLAMPING CONSTRUCTION UNIT FOR PRESSING IN SLIGHTLY ACHIEVEMENT ELEMENTS AT A HEAT SINK

CARRIER ARRANGEMENT FOR SEMICONDUCTOR COMPONENTS.

SPANNVORRICHTUNG FUER MINDESTENS EINTHERMISCH UND ELEKTRISCH DRUCKKONTAKTIERTES HALBLEITERBAUELEMENT IN SCHEIBENZELLENBAUWEISE

OWNER FUR AT LEAST A BETWEEN DRUCKSTUCKEN CLAMPED SEMICONDUCTOR COMPONENT

RADIATOR BOX WITH COOLING LAMELLA AND ATTACHMENT THE SAME

Heat sink assembly with evenly distributed compression force

METHOD AND APPARATUS FOR TIGHTENING A POWER SEMICONDUCTOR CAN BETWEEN TWO HEAT SINKS

L'invention concerne un procédé pour le serrage d'un boîtier de semi-conducteur de puissance monté entre deux radiateurs et le dispositif de serrage correspondant. Le boîtier est serré entre ses deux radiateurs et au moyen de deux plateaux circulaires orientables et à pivots centraux. Le système comporte trois pièces de serrage, chacune comprenant deux tiges filetées et réunies entre elles par un moulage isolant, ainsi que des rondelles élastiques tarées. Application au montage des semi-conducteurs pour matériel embarqué de traction.

HEAT SINK MOUNTING

HEAT SINK MOUNTING Disclosed are methods and apparatus for attaching a heat sink mounted semiconductor case to a circuit board employing a stud with a flange near one end. The longer shank is threaded and at least the shorter shank or head stud is tin-plated. The stud may be swaged into a mounting hole in the heat sink and the heat sink and semiconductor case pre-assembled. The pre-assembled unit may then be mounted and soldered to the circuit board along with other circuit components.

ELECTRICALLY INSULATED HEAT SINK ASSEMBLIES AND INSULATORS USED THEREIN

Supporting Member for Cooling Means and Electronic Package Using the Same

High heat dissipation CPU

Radiating device

The invention relates to a radiating device, which comprises a radiator and a plurality of buckling pieces, wherein the buckling pieces are arranged on the radiator; the radiator comprises a base; the base is reserved with a plurality of installing holes which respectively correspond to the plurality of buckling pieces; each buckling piece comprises a buckling rod, a sleeve barrel sleeved on the buckling rod and a fastening piece arranged on the buckling rod; one end of each buckling rod and each sleeve barrel are accommodated in the corresponding installing holes of the base; the fastening pieces are butted at the outer edges of the corresponding installing holes of the base; the diameter of one end of each buckling rod accommodated in the installing hole is greater than the inner diameter of each sleeve barrel; and the buckling rods can move to the outside of the installing holes relative to the base to extrude the sleeve barrels along the radial direction, so that the sleeve barrels ...

DISPOSITIF DE MISE EN PARALLELE DE COMPOSANTS ELECTRONIQUES DE PUISSANCE

DISPOSITIF CONSTITUE D'UN EMPILAGE COMPRENANT UNE PLAQUE SUPPORT 1 SUR LAQUELLE SONT FIXES LES COMPOSANTS 2-6 DE MANIERE QUE LEURS PATTES SOIENT DIRIGEES VERS LE CENTRE DE LA CONFIGURATION CIRCULAIRE OU POLYGONALE, AU MOINS UNE PLAQUE DE CONNEXION 7 CONNECTANT UNE DES PATTES E DES COMPOSANTS ET UNE PLAQUE COUVERCLE 8 SERVANT DE CONNEXION A UNE AUTRE DES PATTES B DES COMPOSANTS. LE CORPS DES COMPOSANTS MAINTIENT LA PLAQUE COUVERCLE 8 ISOLEE DE LA PLAQUE SUPPORT 1. DES CONDUCTEURS TRAVERSENT LES PLAQUES DE CONNEXION ET COUVERCLE.

ELECTRONIC EQUIPMENT OF DISTRIBUTION IN PARTICULAR FOR the LIGHTING OF INTERNAL COMBUSTION ENGINES

Improvements with the coolers of semiconductors

ATTACH TIGHTENING OF PRECISION, AND PROCEEDED OF TIGHTENING, THYRISTORS AND SIMILAR ELECTRONICS COMPONENTS OF POWER

L'invention utilise une bride (20) qui remplit une fonction élastique additionnelle et donc participe à la mesure de la force de serrage mais sans interférence mécanique, en coopération avec une tête de structure simplifiée. Cette conception permet d'intégrer un capteur (16) de précision, notamment à mesure de grandeur électrique, effectuant une mesure directe, et permet de serrer tout composant nécessitant un serrage sous effort défini. Précision du serrage très élevée et reproductible (précision d'environ +- 1%), et possibilité de serrer dans une plage étendue de forces avec une seule bride (ou un seul dispositif en " U " - clamp -) sans nouveau tarage.

A method for carrying out a contact having a good calorific and electric conductibility

Case for devices electrically conducting releasing from heat

Squanderer of heat for transistors and analogues

TOGETHER OF SETTING IN CATCH ALLOWING TO FIX A THERMAL DEVICE OF DISSIPATION ON AN INTEGRATED CIRCUIT

Device for putting electronic power components in parallel

CASE FOR ELECTRONICS COMPONENT OF THE TYPE HAS SIMPLE LINE AND ITS MANUFACTORING PROCESS

High power semiconductor electric control - has several semiconductor elements clamped between two pressure pieces

SEMICONDUCTOR RECTIFIER ASSEMBLIES

CLAMPING MEMBER FOR PRESSING POWER ELEMENTS AGAINST A COOLING SURFACE

Heat spreader with mechanically secured heat coupling element

A heat spreader for dissipating heat generated by at least one heat-generating power semiconductor device. Such a heat spreader comprises a base plate ( 11 ) which is connectable in a heat-conducting manner to the at least one power semiconductor device ( 2 ), and at least one heat coupling element ( 4 ) which is connected in a heat conducting manner to the at least one power semiconductor device ( 2 ) on the one hand and to the base plate ( 11 ) on the other hand and comprises at least one elastic layer ( 5 ). The heat coupling element ( 4 ) comprises at least one holding element for mechanically fixing the heat coupling element ( 4 ) relative to a plane defined by the base plate ( 11 ).

Heat Sink Adaptor

An adaptor is provided for use with the heat sink, said heat sink comprising a base for contacting a heat source and a plurality of protrusions extending from said base. The adaptor itself comprises a base and a structure projecting therefrom. The structure is arranged to mate with one or more protrusions on the heat sink to enable heat transfer by conduction from the heat sink to the adaptor.

Structure for fixing electric part for motor-driven compressor

An electric part fixing structure for a motor-driven compressor includes an electric part having a plurality of leads and a guide member for positioning the leads. The guide member is made of a plastic and has a guide hole through which the lead is passed.

Integrated circuit retention mechanism with retractable cover

A computer processor retention device comprises a load frame, a load plate, and a pair of retractable cover members. The load frame may be secured to a circuit board around a processor mounting site. The load plate is pivotally coupled to the load frame and is pivotable between being open for receiving a processor at the processor mounting site and closed in engagement with a periphery of the received processor. The load plate has a window that is open to the processor mounting site when the load plate is closed. The retractable cover members span the window and are alternately movable along a track toward one another to cover the processor mounting site and away from one another to expose the processor mounting site.

SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor module having a wiring board, semiconductor assemblies that include a multilayer substrate on which semiconductor elements are mounted, and a sealing part; a cooler; and a heat conduction sheet which is placed between the semiconductor module and the mounting surface of the cooler and which is in contact with the bottom surfaces of the multilayer substrates. The heat conduction sheet has recesses corresponding to at least parts of the outer edges of second electrically conductive plates provided on the bottoms of the multilayer substrates. 1. A semiconductor device comprising:a semiconductor module having at least one semiconductor assembly composed of a multilayer substrate which has an electrically conductive plate provided on a bottom surface side of an insulating substrate and a semiconductor element mounted on the multilayer substrate, and a sealing part which seals the at least one semiconductor assembly except a bottom part of the electrically conductive plate;a cooler which has a mounting surface on which the semiconductor module is mounted; anda heat conduction sheet which is placed between the semiconductor module and the mounting surface of the cooler and is in contact with a bottom surface of the multilayer substrate,wherein the heat conduction sheet has a recess corresponding to at least a part of an outer edge of the bottom part of the electrically conductive plate.2. The semiconductor device according to claim 1 ,wherein the semiconductor module has an M number (M: even number) of the semiconductor assemblies,each of the electrically conductive plates of the M number of semiconductor assemblies has an edge that extends in a lateral direction of the semiconductor module, andthe recess has a shape that corresponds to the edges of the electrically conductive plate of the semiconductor assembly, the edges opposing each other.3. The semiconductor device according to claim 2 ,wherein the mutually opposing ...

Semiconductor device

A semiconductor device includes a supporting plate including a first surface, a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface; and a semiconductor unit fixed to the first surface. The semiconductor unit includes an insulating plate, a circuit plate fixed to a front surface of the insulating plate, a semiconductor chip fixed to the circuit plate, and a protruding metal block fixed to a rear surface of the insulating plate and penetrating through the through hole to extend to the second surface.

PLACEMENT BASE FOR SEMICONDUCTOR DEVICE AND VEHICLE EQUIPMENT

A placement base () of a semiconductor device () comprises a body () on which the semiconductor device () is disposed, and a fixing unit () for fixing the semiconductor device () to the body (). The body () has a supporting unit () and a bottom surface () placed in an inner periphery of the supporting unit () and placed lower than the supporting unit (). A difference in height ΔH between the supporting unit () and the bottom surface () is larger than a sum (H1+H2) of a calculated or measured maximum upward warp H1 of the bottom surface () and a calculated or measured maximum downward warp H2 of a base of the semiconductor device (). 1. A placement base of a semiconductor device comprising:a body on which the semiconductor device is disposed, and the body having a supporting unit being configured to support at least a part of a periphery of the semiconductor device, and a bottom surface being placed in an inner periphery of the supporting unit and being placed lower than the supporting unit; anda fixing unit, which is provided to the supporting unit, for fixing the semiconductor device to the body; andwherein a difference in height ΔH between the supporting unit and the bottom surface is larger than a sum (H1+H2) of a calculated or measured maximum upward warp H1 of the bottom surface and a calculated or measured maximum downward warp H2 of a base of the semiconductor device.2. The placement base of the semiconductor device according to claim 1 ,wherein the semiconductor device has a substantially quadrilateral shape, when seen from above, andwherein the supporting unit is configured to support four sides of the semiconductor device.3. The placement base of the semiconductor device according to claim 1 ,wherein the fixing unit has two fixing holes for inserting and fixing a fastener member being configured to fasten the semiconductor device andwherein two fixing holes are provided diagonally.4. The placement base of the semiconductor device according to claim 1 , ...

HEAT DISSIPATING STRUCTURE FOR ELECTRONIC UNITS AND DISPLAY DEVICE COMPRISING SAME

Provided are a heat dissipating structure with which stress on an electronic unit that generates heat can be reduced, and a display device comprising the same. The heat dissipating structure comprises: at least two electronic units, e.g. electronic units, that are provided on a circuit hoard, differ from one another in height from the circuit board, and generate heat; a dissipating member for dissipating heat generated from the electronic units; and heat conducting members that are sandwiched between the electronic units and the heat dissipating member so as to conduct heat, wherein the heat conducting members provided between the electronic units and the heat dissipating member have the same thickness. 1. A heat dissipating structure comprising:a circuit board;at least two or more electronic units generating heat, the electronic units being arranged on the circuit board and having different heights from the circuit board from each other;a heat dissipating member configured to dissipate heat generated by the electronic units; andheat transfer members arranged closely between the electronic units and the heat dissipating member and configured to conduct the heat, whereinthe heat transfer members arranged between the electronic units and the heat dissipating member have the same thickness.2. The heat dissipating structure according to claim 1 , wherein an abutment surface of the heat dissipating member abutting against the heat transfer members is formed into a concave portion.3. The heat dissipating structure according to claim 1 , wherein an abutment surface of the heat dissipating member abutting against the heat transfer members is formed into a protruding portion.4. The heat dissipating structure according to claim 3 , comprising a positioning portion formed to protrude from the abutment surface on an outer periphery of the abutment surface.5. The heat dissipating structure according to claim 1 , wherein a surface of the heat dissipating member is covered with an ...

ELECTRONIC CONTROL UNIT AND ELECTRIC POWER STEERING DEVICE USING THE SAME

An electronic control unit includes: a substrate; a plurality of heat generating components that are provided on one surface of the substrate and generate heat during operation; a heat conducting component that is formed of a material having a heat conductivity equal to or higher than a predetermined value and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components; and a controller that is provided on the substrate and controls the operation of each of the plurality of heat generating components to control the object to be controlled. 1. An electronic control unit that is configured to control an object to be controlled , the electronic control unit comprising:a substrate;a plurality of heat generating components that are provided on one surface of the substrate, and generate heat during operation;a heat conducting component that is formed of a material having a heat conductivity equal to or higher than a predetermined value, and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components; anda controller that is provided on the substrate, and is configured to control the operation of each of the plurality of heat generating components to control the object to be controlled, whereinthe plurality of heat generating components and the heat conducting component are provided in one region of the substrate, and the controller is provided in an other region of the substrate opposite to the one region.2. The electronic control unit according to claim 1 , whereinthe heat conducting component is provided such that at least a part of the heat conducting component surrounds at least one of the heat generating components.3. The electronic control unit according to claim 1 , further comprising:{'b': '30', 'a wire () that is provided on the one surface of the ...

SEMICONDUCTOR DEVICE

A control terminal of a semiconductor device has a recessed portion . A resin case is provided with a fixing member engaging with and fixing a recessed portion of a control terminal . The fixing member is constituted by a resin block portion having a step portion engaging with the recessed portion , a nut-housing portion , and a beam portion integrated by linking the resin block portion and the nut-housing portion . A resin case main body to which the fixing member is fixed is provided with a hollow portion enabling insertion of the resin block portion . The nut-housing portion of the fixing member and the resin block portion are attached to the resin case main body from one direction. 1. A semiconductor device comprising:a main terminal and a control terminal each connected to a multi-layered substrate; anda resin case having an opening penetrated by the control terminal and covering the multi-layered substrate,wherein the control terminal comprises a recessed portion between the multi-layered substrate and the opening of the resin case,wherein the resin case comprises a fixing member and a resin case main body to which the fixing member can be attached,wherein the fixing member comprises a resin block portion comprising a projecting step portion engaging with a recessed portion of the control terminal, a nut-housing portion comprising a nut embedded to be aligned to the main terminal, and a beam portion integrated by linking the resin block portion and the nut-housing portion,wherein the resin case main body comprises a hollow portion capable of insertion of the resin block portion and enables the nut-housing portion and resin block portion to be attached from one direction.2. The semiconductor device according to claim 1 , wherein the resin block portion of the fixing member comprises a protrusion engaging with the resin case main body.3. The semiconductor device according to claim 1 , wherein the hollow portion of the resin case main body comprises a trench ...

PACKAGE STRUCTURE

A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread. 1. A package structure , comprising:a bottom plate;a wafer level package, disposed over the bottom plate, and the wafer level package comprising and insulating encapsulant, at least one die encapsulated by the insulating encapsulant and at least one device stacked over the at least one die;a top plate, disposed over the wafer level package, and the top plate comprising an internal thread in a screw hole of the top plate;a buffer layer, disposed between the wafer level package and the top plate, wherein the buffer layer comprises an opening aligned with the screw hole of the top plate;a first thermal interface material (TIM) disposed between the at least one device and the top plate, wherein the first TIM is embedded in and in contact with the buffer layer; anda screw, penetrating through the bottom plate, the wafer level package and the screw hole of the top plate, and the screw comprising an external thread engaged to the internal thread of the top plate.2. The package structure as claimed in claim 1 , wherein the buffer layer is in contact with the at least one device claim 1 , and the buffer layer is not in contact with the insulating encapsulant.3. The package structure as claimed in claim 1 , wherein the screw further comprises a main portion and a head portion connected to the main portion claim 1 , the external thread is on an external surface of the main ...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

A semiconductor device includes: a wiring board including an insulating board and a wiring layer, the insulating board having an element mounting surface, which is a first main surface, and a back surface, which is a second main surface on the opposite side of the element mounting surface, the wiring layer being formed on the back surface and including a wiring portion and a heat dissipation portion; a power element that is a semiconductor element, is mounted on the element mounting surface of the wiring board, and is connected to the wiring portion; a spacer that is interposed between the power element and the element mounting surface of the wiring board and is connected to the back-surface-side heat dissipation portion; and a heatsink that sandwiches, together with the spacer, the power element and is secured to the spacer. 1. A semiconductor device comprising:a wiring board that includes an insulating board and a wiring layer, the insulating board having a first main surface and a second main surface, which is on an opposite side of the first main surface, the wiring layer being formed on the second main surface and including a wiring portion and a back-surface-side heat dissipation portion;a semiconductor element that is mounted on the first main surface of the wiring board and is connected to the wiring portion;a spacer that is interposed between the semiconductor element and the first main surface of the wiring board and is connected to the back-surface-side heat dissipation portion; anda heatsink that sandwiches, together with the spacer, the semiconductor element and is secured to the spacer.2. The semiconductor device according to claim 1 , whereinthe spacer includes a projection that passes through the wiring board and projects to the second main surface side, andthe projection is connected to the back-surface-side heat dissipation portion.3. The semiconductor device according to claim 1 , whereinthe wiring layer includes a front-surface-side heat ...

ELECTRONIC DEVICE INCLUDING INTERPOSER

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals. 1. An electronic device comprising:a housing;a first printed circuit board disposed in an internal space of the housing and comprising a plurality of first conductive terminals; anda second printed circuit board disposed parallel to the first printed circuit board in the internal space and comprising a plurality of second conductive terminals electrically connected to the plurality of first conductive terminals, at least some conductive terminals of the plurality of second conductive terminals, or', 'at least one connection failure prevention structure disposed around the at least some conductive terminals of the plurality of second conductive terminals., 'wherein the second printed circuit board comprises2. The electronic device of claim 1 , wherein the connection failure prevention structure comprises at least one conductive support terminal stacked on at least one surface of the plurality of second conductive terminals.3. The electronic device of claim 2 ,wherein the at least one conductive support terminal includes different sizes, andwherein the at least one conductive support terminal is formed in at least two layers in each of the plurality of second conductive terminals.4. The electronic device of claim 1 , wherein the at least one connection failure prevention structure comprises an overflow preventing portion ...

Circuit Carrier Arrangement And Method For Producing Such A Circuit Carrier Arrangement

A circuit carrier arrangement includes: a cooling plate () which has spacer and fastening elements () for connection to a printed circuit board () in a spaced-apart manner; a printed circuit board () which has bores () for receiving spring element sleeves (); at least one power semiconductor component () which is connected by a soldered connection to the printed circuit board () and fastening elements () in the state in which it is fitted with the cooling plate () by means of plug-in connections () of spring-action configuration ; and at least one spring element () having at least two spring element sleeves () between which a web () that is connected to the spring element sleeves () extends, and supporting elements () arranged on either side of said web and at least one spring plate () being arranged on said web. 1. A circuit carrier arrangement comprising:{'b': 1', '3', '2, 'a cooling plate () which has spacer and fastening elements () for connection to a printed circuit board () in a spaced-apart manner,'}{'b': 2', '4', '9, 'a printed circuit board () which has bores () for receiving spring element sleeves (),'}{'b': 10', '2', '3', '1', '11, 'at least one power semiconductor component () which is connected by a soldered connection to the printed circuit board () on its side that faces the spacer and fastening elements () in the state in which it is fitted with the cooling plate () by means of plug-in connections () of spring-action configuration, and'}{'b': 5', '9', '6', '9', '7', '9', '8, 'at least one spring element () which is formed with at least two spring element sleeves () between which a web () that is connected to the spring element sleeves () extends, and supporting elements () that extend perpendicularly in relation to the longitudinal direction of the spring element sleeves () being arranged on either side of said web and at least one spring plate () being arranged on said web,'}{'b': 1', '12', '4', '2, 'wherein the cooling plate (), in the fitted ...

HEAT DISSIPATION STRUCTURE OF SEMICONDUCTOR DEVICE

A heat dissipation structure of a semiconductor device is provided, the semiconductor device including: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface. The heat dissipation surface makes contact with a heat spreader via a conductive TIM while the heat spreader makes contact with a heat sink via an insulating TIM. A surface of the heat spreader facing the semiconductor device includes a recess part formed in at least one part in a vicinity of an outer periphery of the semiconductor device. 1. A heat dissipation structure of a semiconductor device , the semiconductor device comprising: an electrical bonding surface electrically connected to a substrate; and a heat dissipation surface as an opposite side of the electrical bonding surface ,wherein the heat dissipation surface makes contact with a high-heat-transferring conductive member via a non-insulating member,wherein the high-heat-transferring conductive member makes contact with a heat dissipation component via an insulating member, andwherein a surface of the high-heat-transferring conductive member facing the semiconductor device includes a recess part formed in at least a part in a vicinity of an outer periphery of the semiconductor device.2. The heat dissipation structure of a semiconductor device according to claim 1 ,wherein the substrate is fixed to the high-heat-transferring conductive member by a conductive fixing material so that at least a part of a pattern on the substrate is conducted to the high-heat-transferring conductive member.3. The heat dissipation structure of a semiconductor device according to claim 1 ,wherein the substrate is further fixed to the high-heat-transferring conductive member by an insulating fixing material.4. The heat dissipation structure of a semiconductor device according to claim 2 ,wherein the substrate is further fixed to the high-heat-transferring conductive member ...

High impact resistant heat sink

A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

CONFIGURABLE MOUNTING HOLE STRUCTURE FOR FLUSH MOUNT INTEGRATION WITH VAPOR CHAMBER FORMING PLATES

Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures. 1. A vapor chamber , comprising: an exterior surface of the top plate;', 'an interior surface of the top plate, wherein the interior surface of the top plate is enclosed;', 'a first aperture having a first diameter, wherein the first aperture extends from the exterior surface of the top plate to the interior surface of the top plate;', 'a thickness of the top plate around the first aperture;, 'a top plate, the top plate comprising an exterior surface of the bottom plate;', 'an interior surface of the bottom plate, wherein the interior surface of the bottom plate is enclosed;', 'a second aperture having a second diameter, wherein the second aperture extends from the exterior surface of the bottom plate to the interior surface of the bottom plate;', 'a thickness of the bottom plate around the second aperture; and, 'a bottom plate, the bottom plate comprising a body disposed between the top plate and the bottom plate, wherein the body has a height equal to a distance between the top plate and the bottom plate;', 'a top flange connected to the top of ...

CHIP PACKAGE FABRICATION KIT AND CHIP PACKAGE FABRICATING METHOD THEREOF

A chip package fabricating kit includes a metal cover, at least one screw, and at least one screw cap. The metal cover includes a cap portion and at least one leg. The cap portion substantially presses against the BGA package. The leg substantially presses a PCB board that loads the BGA package. The leg forms a concave space with the metal cover for substantially encompassing the BGA package. Each the screw screws through a corresponding leg from top to bottom. Each the screw screws the PCB board at a first side. The screw cap respectively corresponds to the screw and one leg. The screw cap caps and fixes a tail of its corresponding screw for affixing the PCB board. A height of the concave space is dynamically adjusted by adjusting a degree that the screw screws with the screw cap. Such that the concave space substantially clamps the BGA package. 1. A chip package fabricating kit , comprising:a metal cover, comprising:a cap portion, configured to substantially press against at least one ball grid array (BGA) package; andat least one leg, configured to substantially press a printed circuit board (PCB) board that loads the BGA package, and configured to form a concave space with the metal cover for substantially encompassing the at least one BGA package;at least one screw, each of which is configured to screw through a corresponding leg of the metal cover from top to bottom and to screw the PCB board at a first side of said PCB board; andat least one screw cap respectively corresponding to one of the at least one screw and one of the at least one leg of the metal cover, configured to cap and fix a tail of its corresponding screw for affixing the PCB board;wherein a height of the concave space is dynamically adjusted by adjusting a degree that the at least one screw screws with the at least one screw cap, such that the concave space substantially clamps the BGA package.2. The chip package fabricating kit of claim 1 , further comprising:at least one buffer pad ...

POWER-MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE

A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the first aluminum layer and bonded on the other surface of the ceramic substrate and a second copper layer made from a same material as the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding, in which a thickness t of the first copper layer is 1.7 mm to 5 mm, a sum of the thickness t of the first copper layer and a thickness t of the second copper layer is 7 mm or smaller, and a ratio tt is larger than 0 and 1.2 or smaller except for a range of 0.6 to 0.8. 1. A power-module substrate comprising a circuit layer which is stacked on one surface of a ceramic substrate and a metal layer which is stacked on the other surface of the ceramic substrate , whereinthe circuit layer comprises a first aluminum layer which is bonded on the one surface of the ceramic substrate and a first copper layer which is bonded on the first aluminum layer by solid-phase-diffusion bonding,the metal layer comprises a second aluminum layer which is made from a same material as that of the first aluminum layer and bonded on the other surface of the ceramic substrate, and a second copper layer which is made from a same material as that of the first copper layer and bonded on the second aluminum layer by solid-phase-diffusion bonding,{'b': '1', 'a thickness t of the first copper layer is 1.7 mm or larger and 5 mm or smaller,'}{'b': 1', '2, 'a sum of the thickness t of the first copper layer and a thickness t of the second copper layer is 7 mm or smaller,'}{'b': 2', '1', '1', '2, 'a ratio t/t between the thickness t of the first copper layer and the thickness t of the second copper layer is in a range larger than 0 and 1.2 or smaller except for a range of 0.6 or ...

ELECTRIONIC DEVICES WITH INTERPOSER AND REDISTRIBUTION LAYER

In one example, an electronic device comprises a base substrate comprising a base substrate conductive structure, a first electronic component over a first side of the base substrate, an encapsulant over the first side of the base substrate, wherein the encapsulant contacts a lateral side of the electronic component, an interposer substrate over a first side of the encapsulant and comprising an interposer substrate conductive structure, and a vertical interconnect in the encapsulant and coupled with the base substrate conductive structure and the interposer substrate conductive structure. A first one of the base substrate or the interposer substrate comprises a redistribution layer (RDL) substrate, and a second one of the base substrate or the interposer substrate comprises a laminate substrate. Other examples and related methods are also disclosed herein.

ELECTRONIC DEVICE

An electronic device includes: a circuit board having a mounting face, on which an electronic component is mounted; a heat receiver including a heat receiving plate opposed to the electronic component; and a fastening mechanism that fixes the heat receiver to the circuit board. The fastening mechanism includes a receiver having a proximal end and a distal end, the receiver having a mounting hole penetrating from the proximal end to the distal end; and a fastener that is inserted into the mounting hole for fastening to the receiver to press the heat receiver. The receiver is surface-mounted on the mounting face by soldering with the proximal end facing the mounting face.

Adjustable heat sink fin spacing

A heat sink includes a heat sink base/riser, a first fin, and a second fin. The spacing between the base/riser and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base/riser relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

HEAT SPREADER WITH FLEXIBLE TOLERANCE MECHANISM

A semiconductor device packaging system includes a substrate, a heat spreader, a stiffener attached to the substrate, and at least one die electrically coupled to the substrate and thermally coupled to the heat spreader. The semiconductor device packaging system further includes at least one stud coupled to one of the stiffener and the heat spreader and at least one orifice formed through one of the stiffener and the heat spreader. In addition, the at least one orifice is aligned with the at least one stud. 1. A semiconductor device packaging system comprising:a substrate;a heat spreader;a stiffener attached to the substrate;at least one die electrically coupled to the substrate and thermally coupled to the heat spreader;an interposer electrically coupled to the substrate, wherein the interposer is displaced between the substrate and the at least one die;at least one stud coupled to one of the stiffener and the heat spreader; andat least one orifice formed through one of the stiffener and the heat spreader, the at least one orifice aligned with the at least one stud.2. The system of wherein an air gap is disposed between the stiffener and the heat spreader.3. The system of wherein the interposer provides power connectivity and signal connectivity between the substrate and the at least one die.4. The system of wherein the interposer is one of a passive circuit device and an active circuit device.5. The system of wherein the at least one stud and the at least one orifice enables alignment of the heat spreader claim 1 , the stiffener claim 1 , and the least one die; anda thermal interface material is disposed between the at least one die and the heat spreader.6. The system of wherein the thermal interface material is compressed between the at least one die and the heat spreader.7. The system of wherein the at least one stud includes a plated layer claim 1 , wherein the plated layer establishes a bond between the at least one stud and the heat spreader when subjected to ...

POWER SEMICONDUCTOR MODULE AND VEHICLE

A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions. 1. A power semiconductor module comprising a cooling apparatus and a power semiconductor device mounted on the cooling apparatus , wherein a ceiling plate that has a bottom surface;', 'a case that has a coolant flow-through portion and an outer edge portion surrounding the coolant flow-through portion, with the coolant flow-through portion being arranged on the bottom surface side of the ceiling plate in firm contact, either directly or indirectly, with the bottom surface of the ceiling plate at the outer edge portion; and', 'a cooling fin that is arranged in the coolant flow-through portion,, 'the cooling apparatus includesthe ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner,the power semiconductor device includes a circuit substrate and a terminal case,the fastening portions protrude farther outward than a periphery of the ceiling plate, andthe terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of ...

SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRICATING METHOD OF THE SAME

A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern. 1. A semiconductor device , comprising:a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die comprising a thermal enhancement pattern; anda heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader comprising a flow channel and a cooling liquid in the flow channel, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern, wherein outer sidewalls of the heat spreader are substantially aligned with outer sidewalls of the insulating encapsulant.2. The semiconductor device as claimed in claim 1 , wherein the semiconductor die comprises a back surface claim 1 , and the thermal enhancement pattern comprises at least one recess distributed on the back surface of the semiconductor die.3. The semiconductor device as claimed in further comprising a thermal conductive material on the back surface of the semiconductor die and covering the at least one recess.4. The semiconductor device as claimed in claim 3 , wherein the thermal conductive material is embedded in the at least one recess.5. The semiconductor device as claimed in claim 3 , wherein the thermal conductive material comprises at least one first portion in the at least one recess and at least one second portion located outside the at least one recess.6. The semiconductor device as claimed in claim 1 , wherein the ...

Component coupled to heat dissipation unit

A component coupled to a heat dissipation unit, allowing a screwing element to be pivotally coupled to a heat dissipation unit, includes a body, a stop portion, a first inner engagement portion, a second inner engagement portion and a first outer engagement portion. The body has a first part and a second part and forms therein a through hole which extends axially. The stop portion is circumferentially disposed at the rim of the first or second part. The first inner engagement portion has checking plates and corresponds in position to the stop portion. The second inner engagement portion has stop blocks disposed at the first or second part. The first outer engagement portion is disposed at the rim of the body and opposite the stop portion. The screwing element is fixed to the heat dissipation unit temporarily but firmly, thereby preventing disintegration and disconnection during transport.

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor device includes: a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers; a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit; a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; and a pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion. 1. A semiconductor device comprising:a stacked unit including a semiconductor module and a plurality of coolers each having a flow passage through which a coolant flows, the semiconductor module being disposed between the coolers;a coolant supply-discharge pipe configured to supply the coolant to the coolers or discharge the coolant from the coolers, the coolant supply-discharge pipe being passed through the stacked unit in a stacking direction of the stacked unit;a displacement restricting member provided at a first end portion of the coolant supply-discharge pipe, the displacement restricting member being configured to restrict displacement of the stacked unit in the stacking direction of the stacked unit; anda pressurizing member provided at a second end portion of the coolant supply-discharge pipe, the pressurizing member being configured to apply force to the stacked unit in a direction toward the first end portion.2. The semiconductor device according to claim 1 , whereinthe coolant supply-discharge pipe includes a thread formed on an outer ...

FASTENING STRUCTURE AND POWER CONVERSION APPARATUS USING FASTENING STRUCTURE

A member to be fastened on one side of which a member to be fixed is placed; a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened; a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein; a supporting column which is provided on the support and bends toward the member to be fastened; a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; and a fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole. 110-. (canceled)11. A fastening structure comprising:a member to be fastened on one side of which a member to be fixed is placed;a plate-shaped holding spring member which is disposed on the member to be fixed on one side thereof opposite to the member to be fastened;a support which extends outward of an end part of a longitudinal central part of the plate-shaped holding spring member and which has a through hole formed therein;a supporting column which is provided on the support and bends toward the member to be fastened;a fixing screw hole which is provided in the member to be fastened and disposed at a position corresponding to the through hole of the support so as to have the same axial center as the through hole; anda fixing screw which is inserted into the through hole of the support and screwed to the fixing screw hole.12. The fastening structure according to claim 11 , wherein the supporting column is disposed on the support at a position around the through hole claim 11 , and a tip part of the bending supporting column is brought into contact with the member to be fastened.13. The fastening structure according to claim 11 , wherein the support of the plate-shaped holding spring ...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches. 1. A semiconductor device , comprising:a package, comprising a first die having an active surface and a rear surface opposite to the active surface, wherein the rear surface has a cooling region and a peripheral region enclosing the cooling region, and the first die comprises micro-trenches located in the cooling region of the rear surface; anda cooling cover stacked on the first die, wherein the cooling cover comprises a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.2. The semiconductor device of claim 1 , further comprising a seal ring located over the peripheral region claim 1 , wherein the seal ring seals a space between the cooling cover and the micro-trenches.3. The semiconductor device of claim 2 , wherein the seal ring comprises an adhesive material claim 2 , and the cooling cover is adhered to the first die through the seal ring.4. The semiconductor device of claim 1 , wherein the cooling cover further comprises a fluid inlet channel and a fluid outlet channel claim 1 , the fluid inlet channel is connected to the fluid inlet port and the fluid outlet channel is connected to the fluid outlet port claim 1 , the fluid inlet port and the fluid outlet port respectively extend along a first direction claim 1 , and the fluid inlet channel and the fluid outlet channel respectively extend along a second direction perpendicular to the first direction.5. The ...

Power Semiconductor Module Having a Two-Part Housing

A power semiconductor module includes a substrate having a first side for being arranged to face a heat sink and for being thermally conductively connected to the heat sink, a power semiconductor component arranged on an opposing second side of the substrate, and an electrically insulating housing defining a cavity in which the substrate and the power semiconductor component are accommodated. The housing includes a frame which surrounds the substrate in a frame-like manner, and a hood for being fastened to the heat sink by way of fastening means. The hood includes a pressing die for making contact with the substrate so as to pre-stress the substrate elastically against the heat sink by means of the hood and the pressing die at least when the power semiconductor module is fastened on the heat sink. The frame accommodates the substrate in an interlocking manner and/or is fastened to the substrate. 1. A power semiconductor module for being arranged on a heat sink , the power semiconductor module comprising:a substrate having a first side for being arranged to face the heat sink and for being thermally conductively connected to the heat sink;a power semiconductor component arranged on a second side of the substrate opposite the first side; andan electrically insulating housing which defines a cavity in which the substrate and the power semiconductor component are accommodated,wherein the housing comprises a frame which surrounds the substrate in a frame-like manner, and a hood for being fastened to the heat sink by way of fastening means,wherein the hood comprises a pressing die for making contact with the substrate so as to pre-stress the substrate elastically against the heat sink by means of the hood and by means of the pressing die at least when the power semiconductor module is fastened on the heat sink,wherein the frame accommodates the substrate in an interlocking manner and/or is fastened to the substrate.2. The power semiconductor module of claim 1 , wherein ...

Switching Device with Free-Wheeling Diode

The disclosure provides a switching device with a free-wheeling diode, including a switching tube; a heat radiating substrate is arranged on the drain electrode of the switching tube; the switching device further includes a heat radiating component, which is connected with the heat radiating substrate of the switching tube by contact; the free-wheeling diode is a compression joint type diode; the anode end face of the free-wheeling diode is abutted against the heat radiating component, and is electrically connected with the drain electrode of the switching tube via the heat radiating component, which not only realizes the heat radiation function by using the heat radiating component, but also realizes the electric connection to the heat radiating substrate by using the electrical conductivity of the heat radiating component.

Heat spreader with flexible tolerance mechanism

A semiconductor device packaging system includes a substrate, a heat spreader, a stiffener attached to the substrate, and at least one die electrically coupled to the substrate and thermally coupled to the heat spreader. The semiconductor device packaging system further includes at least one stud coupled to one of the stiffener and the heat spreader and at least one orifice formed through one of the stiffener and the heat spreader. In addition, the at least one orifice is aligned with the at least one stud.

Adjustable heat sink fin spacing

A heat sink includes a first fin and a second fin. The spacing between the first fin and the second fin may be adjusted by a threaded rod. The threaded rod includes a first portion that is engaged with the first fin and a second portion that is engaged with the second fin. The thread pitch of the first portion and the second portion may differ. For example, the pitch of a first internal thread of the first fin may be smaller than the pitch of a second internal thread of the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

SEMICONDUCTOR DEVICE

A base plate, and a plurality of unit structures formed on the base plate are provided. Each of the unit structures including an insulating substrate fixed on the base plate, a metal pattern formed on the insulating substrate, a semiconductor element electrically connected to the metal pattern, and a main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate. 1. A semiconductor device comprising:a base plate formed into a rectangular shape as viewed in plan; anda plurality of unit structures formed nearer to a first side of the base plate and a plurality of unit structures formed nearer to a second side of the base plate opposite from the first side, each of the unit structures including:an insulating substrate fixed on the base plate;a metal pattern formed on the insulating substrate;a semiconductor element electrically connected to the metal pattern; anda main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate.2. A semiconductor device comprising:a base plate formed into a rectangular shape as viewed in plan; anda plurality of unit structures formed on the base plate, each of the unit structures including:an insulating substrate fixed on the base plate;a metal pattern formed on the insulating substrate;a semiconductor element electrically connected to the metal pattern; anda main electrode having an upper end portion exposed to the outside and a lower end portion connected to a peripheral portion of the metal pattern closest to an outer edge of the base plate, whereinthe plurality of unit structures include a first unit structure formed on a first side of the base plate, and a second unit structure formed on a second side of the base plate opposite from the first side, andthe main electrode includes a first ...

ELECTRIC POWER CONVERTER AND METHOD FOR MANUFACTURING THE SAME

An electric power converter includes a laminated semiconductor unit, a beam member that supports the laminated semiconductor unit from a rear end in a laminating direction, a frame, and a plurality of pressing plates. The frame that accommodates the laminated semiconductor unit, and has an insertion opening in a rear thereof in the laminating direction into which the laminated semiconductor unit can be inserted. The plurality of pressing plates are accommodated between a front wall portion of the frame and the laminated semiconductor unit, and the pressing plates press the laminated semiconductor unit in a direction from the front toward the rear. The plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction. The beam member is fixed to the frame. 1. An electric power converter comprising:a laminated semiconductor unit formed by laminating semiconductor modules and cooling pipes that cool the semiconductor modules, the laminated semiconductor unit having a length in a laminating direction, and one end of the length is defined as a first end, while an opposite end is defined as a second end;a beam member that supports the laminated semiconductor unit from the second end in a laminating direction;a frame that accommodates the laminated semiconductor unit, and has an insertion opening in a second end side thereof in the laminating direction into which the laminated semiconductor unit can be inserted; anda plurality of pressing plates that are accommodated between a wall portion disposed in a first end side of the frame and the laminated semiconductor unit, the pressing plates pressing the laminated semiconductor unit in a direction from the first end toward the second end; wherein,the plurality of pressing plates are laminated in the laminating direction with each other, and are compressed and elastically deformed in the laminating direction; andthe beam member is ...

SEMICONDUCTOR DEVICE

Provided is a technique for improving product attachment. In a semiconductor device, the following expression is satisfied by an angle A formed by an imaginary line connecting two attachment holes together and an imaginary line connecting together a lowest point of one of two projections positioned in a surrounding portion of one of the two attachment holes and a contact point between a bulge and a heat sink, with a screw fastened to the heat sink through the one attachment hole, where M represents a vertical direction between the lower end of a body and the lower end of a case, where W represents a bulge amount of the bulge, where T represents a height of the projection, where L represents a horizontal distance from the outer peripheral end of the case to the outer peripheral end of the heat dissipation plate: 0 Подробнее

POWER MODULE ASSEMBLY WITH REDUCED INDUCTANCE

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures. 1. A power module assembly comprising:a plurality of electrically conducting layers including a first layer and a third layer;one or more electrically insulating layers operatively connected to each of the plurality of electrically conducting layers,wherein the one or more electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers;wherein the first layer is configured to carry a first current flowing in a first direction;wherein the third layer is configured to carry a second current flowing in a second direction opposite to the first direction;wherein the first, second, third, fourth and fifth layers are configured to be thermally conducting such that heat from the first layer is conducted to the fifth layer, via each of the second, third and fourth layers; andwherein the fifth layer includes a plurality of pins configured to dissipate the heat.2. The assembly of claim 1 , wherein:the plurality of electrically ...

POWER SEMICONDUCTOR MODULE WITH CLAMPING DEVICE

A power semiconductor module includes: a carrier; a plurality of semiconductor dies attached to a first side of the carrier and electrically connected to form a circuit or part of a circuit; a cooling device at a second side of the carrier opposite the first side; a clamping device attached to the cooling device and pressing the carrier toward the cooling device such that the second side of the carrier is in thermal contact with the cooling device without having an intervening base plate between the carrier and the cooling device; and a first sensor device embedded in the clamping device or attached to an interior surface of the clamping device. 1. A power semiconductor module , comprising:a carrier;a plurality of semiconductor dies attached to a first side of the carrier and electrically connected to form a circuit or part of a circuit;a cooling device at a second side of the carrier opposite the first side;a clamping device attached to the cooling device and pressing the carrier toward the cooling device such that the second side of the carrier is in thermal contact with the cooling device without having an intervening base plate between the carrier and the cooling device; anda first sensor device embedded in the clamping device or attached to an interior surface of the clamping device.2. The power semiconductor module of claim 1 , wherein the carrier is a direct bonded copper (DBC) substrate comprising a ceramic base claim 1 , a first metallization at a first side of the ceramic base and a second metallization at a second side of the ceramic base opposite the first side of the ceramic base claim 1 , wherein the semiconductor dies are attached to the first metallization of the DBC substrate claim 1 , and wherein the second metallization of the DBC substrate is in thermal contact with the cooling device.3. The power semiconductor module of claim 1 , wherein the clamping device comprises a mold compound claim 1 , and wherein the first sensor device is embedded in ...

IPD Modules with Flexible Connection Scheme in Packaging

A package includes a first package and a second package over and bonded to the first package. The first package includes a first device die, and a first encapsulant encapsulating the first device die therein. The second package includes an Independent Passive Device (IPD) die, and a second encapsulant encapsulating the IPD die therein. The package further includes a power module over and bonded to the second package. 1. A package comprising: a first device die; and', 'a first encapsulant encapsulating the first device die therein;, 'a first package comprising an Independent Passive Device (IPD) module comprising a plurality of IPD dies identical to each other, wherein each of the plurality of IPD dies is physically joined to respective neighboring IPD dies in the plurality of IPD dies; and', 'a second encapsulant encapsulating the IPD die therein; and, 'a second package over and bonded to the first package, the second package comprisinga power module over and bonded to the second package.2. (canceled)3. The package of claim 1 , wherein the plurality of IPD dies are electrically interconnected.4. The package of claim 1 , wherein each of the plurality of IPD dies comprises a passive device claim 1 , and the IPD die is free from active devices and additional passive devices.5. The package of claim 1 , wherein the second package and the power module form a package stack claim 1 , and the package further comprises a plurality of package stacks identical to the package stack over and bonded to the first package.6. The package of claim 5 , wherein the package stack and the plurality of package stacks in combination form an array.7. The package of further comprising:a metallic brace over and contacting the second package;a screw penetrating through the first package; anda bolt, wherein the bolt and the screw secure the metallic brace on the first package.8. The package of further comprising:a first plurality of solder regions bonding the first package to the second package; ...

ELECTRICALLY ISOLATED POWER SEMICONDUCTOR PACKAGE WITH OPTIMIZED LAYOUT

A packaged power semiconductor device is provided with voltage isolation between a metal backside and terminals of the device. The packaged power semiconductor device is arranged in an encapsulant defining a hole for receiving a structure for physically coupling the device to an object. A direct-bonded copper (“DBC”) substrate is used to provide electrical isolation and improved thermal transfer from the device to a heatsink. At least one power semiconductor die is mounted to a first metal layer of the DBC substrate. The first metal layer spreads heat generated by the semiconductor die. In one embodiment, the packaged power semiconductor device conforms to a TO-247 outline and is capable of receiving a screw for physically coupling the device to a heatsink. 120-. (canceled)21. A method of manufacturing a packaged power semiconductor device , comprising:forming an amount of encapsulant over a semiconductor die, a substrate and a portion of each of a plurality of electrically conductive leads such that the amount of encapsulant does not cover a major surface of the substrate thereby leaving a portion of the substrate exposed on a lower surface of the packaged power semiconductor device, wherein the amount of encapsulant that is formed includes an extended region of encapsulant that extends away from the plurality of electrically conductive leads, wherein the extended region has an upper surface, a lower surface, an end surface opposite the electrically conductive leads, and a pair of side surfaces, wherein a protrusion of encapsulant extends downward from the lower surface of the extended region at a location on the lower surface adjacent to the end surface, and wherein the amount of encapsulant defines a hole that extends from the upper surface of the extended region to the lower surface of the extended region and does not extend through any part of the substrate.22. The method of claim 21 , wherein the protrusion of encapsulant has a substantially rectangular shape. ...

High Density Multi-Component Packages

Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially. 1. A high density multi-component package comprising:at least two electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination;at least one interposer between adjacent electronic components and attached to said interposer by an interconnect wherein said interposer is selected from an active interposer and a mechanical interposer; andwherein said adjacent electronic components are connected serially.219-. (canceled)2018. The high density multi-component package of claim wherein said secondary electrical component is in electrical parallel with at least two said electronic components.21. The high density multi-component package of wherein said secondary electrical component is selected from a secondary active interposer a secondary mechanical interposer.2229-. (canceled)30. The high density multi-component package of comprising at least three terminals.31. The high density multi-component package of further comprising a substrate.32. The high density multi-component package of wherein said substrate comprises at least two circuit traces.33. The high density multi-component package of wherein said substrate comprises at least three circuit traces.34. The high density multi-component package of wherein said electronic components form at least two stacks.35. The high density ...

HEAT DISSIPATION COMPONENT AND TERMINAL DEVICE INCLUDING HEAT DISSIPATION COMPONENT

A heat dissipation component includes a plate that presses a heat receiving portion against a heat generating portion, and a heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion, wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate, an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, and the heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate. 1. A heat dissipation component comprising:a plate that presses a heat receiving portion against a heat generating portion; anda heat pipe installed at a first surface side of the plate to be in contact with the heat receiving portion,wherein the plate has a shape of an equilateral triangle in plan view from a normal direction of the first surface of the plate,an outer circumferential portion of the plate, except for a portion between each two vertexes of the equilateral triangle, is bent to the first surface side of the plate, andthe heat pipe extends to an outside of the plate through a non-bent portion in the outer circumferential portion of the plate.2. The heat dissipation component according to claim 1 , wherein the heat pipe is in contact with a first surface of the heat receiving portion claim 1 ,the heat receiving portion has a recess formed on the first surface of the heat receiving portion,the plate has a through hole formed therethrough and a fixing portion that presses the heat receiving portion against the heat generating portion,the heat receiving portion is disposed within the through hole,a height of the first surface of the heat receiving portion and a height of a first surface of the fixing portion are substantially equal to each other, anda second surface opposite to the first surface of the ...

HEAST SINK FASTENING SEAT FOR USE WITH ELECTRICAL CONNECTOR

An electrical connector assembly includes an electrical connector mounted upon a printed circuit board, and a heat sink fastening seat mounted upon the printed circuit board and beside the connector. The heat sink fastening seat includes a pair of metallic mounting bars spaced from each other and located by two lateral sides of the connector in the transverse direction. A pair of alignment posts are formed on the corresponding mounting bars, respectively. A pair of metallic spring blades are respectively, in the vertical direction, aligned with and mounted upon the corresponding mounting bars for cooperation with the corresponding components of the heat sink for fastening. 1. An electrical connector assembly comprising:a printed circuit board defining opposite top and bottom surfaces in a vertical direction;an electrical connector mounted upon the top surface of the printed circuit board and including an insulative housing defining a receiving cavity upwardly communicating with an exterior in said vertical direction for receiving a CPU (Central Processing Unit) to a plurality of contacts retained in the housing;a pair of mounting bars being discrete and spaced from each other in a transverse direction perpendicular to the vertical direction and respectively located by two sides of the housing in said transverse direction and secured to the top surface of the printed circuit board, each of said mounting bars extending along a front-to-back direction perpendicular to both the vertical direction and the transverse direction;a pair of spring blades secured to the corresponding mounting bars, respectively; whereinsaid pair of spring blades are configured to be adapted to be engaged with a heat sink assembly when the CPU is received within the receiving cavity, or a dust cover when no CPU is received within the receiving cavity.2. The electrical connector assembly as claimed in claim 1 , wherein the pair of mounting bars respectively forms a pair of alignment posts ...

PACKAGE STRUCTURE

A package structure including a reconstructed wafer, a heat dissipation substrate, a semiconductor device, and a fixing mechanism is provided. The heat dissipation substrate is disposed on a side of the reconstructed wafer and includes an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate. The connection member has an inclined fluid channel that descends from the inlet to the base plate. The semiconductor device is disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer. The fixing mechanism fixes the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together. 1. A package structure , comprising:a reconstructed wafer;a heat dissipation substrate disposed on a side of the reconstructed wafer and comprising an inlet, a base plate located between the inlet and the reconstructed wafer, and a connection member located and coupled between the inlet and the base plate, wherein the connection member has an inclined fluid channel that descends from the inlet to the base plate;a semiconductor device disposed on another side of the reconstructed wafer, wherein the heat dissipation substrate and the semiconductor device are respectively located on opposite sides of the reconstructed wafer; anda fixing mechanism fixing the reconstructed wafer, the heat dissipation substrate, and the semiconductor device together.2. The package structure as claimed in claim 1 , wherein the connection member further comprises a plurality of longitudinal fluid channels coupled between the inclined fluid channel and the base plate and substantially perpendicular to the base plate.3. The package structure as claimed in claim 1 , wherein the heat dissipation substrate further comprises an outlet coupled to the base plate claim 1 , and ...

PACKAGE STRUCTURE

A structure including a wiring substrate, an interposer disposed on and electrically connected to the wiring substrate, a semiconductor die disposed on and electrically connected to the interposer, a first insulating encapsulation disposed on the interposer, a second insulating encapsulation disposed on the wiring substrate, and a lid is provided. The semiconductor die is laterally encapsulated by the first insulating encapsulation. The semiconductor die and the first insulating encapsulation are laterally encapsulated by the second insulating encapsulation. A top surface of the first insulating encapsulation is substantially leveled with a top surface of the second insulating encapsulation and a surface of the semiconductor die. The lid is disposed on the semiconductor die, the first insulating encapsulation and the second insulating encapsulation. 1. A structure , comprising:a wiring substrate;a device comprising a semiconductor die laterally encapsulated by a first insulating encapsulation, the semiconductor die being disposed on and electrical connected to the wiring substrate;a second insulating encapsulation disposed on the wiring substrate, wherein the device is laterally encapsulated by the second insulating encapsulation; anda lid disposed on the device and the second insulating encapsulation, wherein a top surface of the first insulating encapsulation is substantially level with a top surface of the second insulating encapsulation.2. The structure as claimed in further comprising:an adhesive disposed between the second insulating encapsulation and the lid; anda thermal interface material disposed between the semiconductor die and the lid.3. The structure as claimed in further comprising:a first metallic layer disposed between the thermal interface material and the semiconductor die; anda second metallic layer disposed between the thermal interface material and the lid.4. The structure as claimed in claim 1 , wherein the lid comprises an inlet claim 1 , an ...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided. 1. A semiconductor device comprising:a semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof;a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole; anda screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw.2. The semiconductor device according to claim 1 , wherein the plurality of cooling fins are formed of a plurality of pin fins while the fixing cooling fin is formed of a boss.3. The semiconductor device according to claim 1 , wherein the distal end portion is housed in a counterbore formed in an inner wall surface of the cooling jacket claim 1 , the semiconductor device further comprising an O-ring provided between the distal end portion and a bottom surface of the counterbore.4. The semiconductor device according to claim 1 , wherein an annular groove surrounding the plurality of cooling fins and the fixing cooling fin is formed in a surface of the cooling jacket opposed to the semiconductor module claim 1 , the semiconductor device further comprising an O-ring provided in the groove claim 1 , ...

Cooling device

A cooling device includes: a fan motor including a rotation shaft, an impeller supported by the rotation shaft, and a sleeve bearing unit pivotally supporting the rotation shaft; and a heat sink including heat radiation pins extending from a base portion. The fan motor is placed on the heat sink. The impeller includes a blade support element supported by the rotation shaft and a fan blade extending from the blade support element in an outer peripheral direction of the rotation shaft. The heat radiation pins extend from the base portion toward the sleeve bearing unit in a direction along the rotation shaft. The impeller is spaced apart from the heat radiation pins between the sleeve bearing unit and the heat radiation pins. The blade support element and at least one of the heat radiation pins overlap with each other as viewed in a direction of the rotation shaft.

SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME

A semiconductor device includes a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; and a heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern. 1. A semiconductor device , comprising:a chip package comprising a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die having an active surface, a back surface opposite to the active surface, and a thermal enhancement pattern on the back surface; anda heat dissipation structure connected to the chip package, the heat dissipation structure comprising a heat spreader having a flow channel for a cooling liquid, and the cooling liquid in the flow channel being in contact with the thermal enhancement pattern.2. The semiconductor device as claimed in claim 1 , wherein the thermal enhancement pattern comprises at least one recess distributed on the back surface of the semiconductor die.3. The semiconductor device as claimed in further comprising a thermal conductive material on the back surface of the semiconductor die and covering the at least one recess.4. The semiconductor device as claimed in claim 3 , wherein the thermal conductive material embedded in the at least one recess.5. The semiconductor device as claimed in claim 3 , wherein the thermal conductive material comprises at least one first portion in the at least one recess and at least one second portion located outside the at least one recess.6. The semiconductor device as claimed in claim 1 , wherein the thermal enhancement pattern comprises at least one protrusion protruding from the back surface of the semiconductor die toward the ...

SEMICONDUCTOR PACKAGE AND RELATED METHODS

Implementations of semiconductor packages may include: a substrate comprising a first side and a second side and a hole in the substrate. The hole extending from the first side to the second side of the substrate and positioned in a center of the substrate. The semiconductor packages may also include a bushing around the hole to the first side of the substrate. The semiconductor packages may also include a plurality of pin holders arranged and coupled on the substrate. The semiconductor package may also include a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders. 1. A semiconductor package comprising:a substrate comprising a first side and a second side;a hole in the substrate extending from the first side to the second side and positioned in a center of the substrate;a bushing around the hole to the first side of the substrate;a plurality of pin holders arranged and coupled on the substrate;a molding compound at least partially encapsulating the substrate, encapsulating a side surface of the bushing, and encapsulating a plurality of side surfaces of the plurality of pin holders.2. The semiconductor package of claim 1 , wherein the plurality of pin holders have a height that is the same as a height of the bushing.3. The semiconductor package of claim 1 , wherein the bushing comprises one of copper claim 1 , steel and any combination thereof.4. The semiconductor package of claim 1 , wherein the bushing and the plurality of pins holders are each coupled to the substrate through solder.5. The semiconductor package of claim 1 , wherein the pin holders comprise copper.6. The semiconductor package of claim 1 , furthering comprising one or more die coupled to the first side of the substrate.7. A semiconductor package comprising:a substrate comprising a first surface and a second surface, the second surface opposing the first surface;two ...

HEAST SINK FASTENING SEAT FOR USE WITH ELECTRICAL CONNECTOR

An electrical connector assembly for connecting the CPU and the printed circuit board, includes an electrical connector and a back plate respectively mounted upon two opposite surfaces of the printed circuit board. A fastening seat partially surrounds the connector for securing a heat sink which is downwardly seated upon the CPU for heat dissipation. The back plate forms a plurality of securing studs extending through the fastening seat. The heat sink further includes a plurality of tubular securing nuts respectively surrounded by the corresponding coil springs and secured to the corresponding securing studs in an adjustable manner so as to impose the downward force upon the heat sink to urge the heat sink to abut downwardly against the CPU for heat dissipation of the CPU. 1. An electrical connector assembly comprising:a printed circuit board defining opposite top surface and undersurface thereon in a vertical direction;an electrical connector and a metallic fastening seat beside the connector commonly mounted upon the top surface;a stiff metallic back plate positioned on the undersurface;an electronic package received in the electrical connectora heat sink positioned upon the electronic package; anda securing device securing the heat sink and the back plate together in a vertical direction with a coil spring thereon to downwardly press the heat sink against the electronic package in the vertical direction.2. The electrical connector assembly as claimed in claim 1 , wherein said securing device includes an upward securing screw riveted on the back plate claim 1 , and a securing nut fixed to a top end of the securing screw claim 1 , and a top end of the coil spring upwardly abuts against a head of the securing nut.3. The electrical connector assembly as claimed in claim 2 , wherein a gasket is attaché on a bottom end of the securing nut to upward abut against an undersurface of the heat sink so as to prevent upward withdrawal of the securing nut from the heat sink.4. ...

HEAT SINK HOLD DOWN SYSTEM FOR DIRECT ATTACHMENT TO PRINTED CIRCUIT BOARD

In one embodiment, an apparatus for holding down a heat sink on a printed circuit board comprises a pair of hold down clips, each of the hold down clips comprising a first end for attachment to the heat sink, a resiliently compressible arm, and a retaining finger at a second end for insertion into an opening in the printed circuit board. The retaining finger is configured to exert a spring force against a lower surface of the printed circuit board when inserted into the opening to securely hold down the heat sink on an upper surface of the printed circuit board. 1. An apparatus for holding down a heat sink on a printed circuit board , the apparatus comprising: a first end for attachment to a first corner of the heat sink;', 'a resiliently compressible arm for extending along a majority of a length of the heat sink adjacent to fins of the heat sink; and', 'a retaining finger at a second end of the hold down clip for insertion into an opening in the printed circuit board adjacent to a second corner of the heat sink;, 'a pair of hold down clips, each of the hold down clips comprisingwherein the retaining finger is configured to exert a spring force against a lower surface of the printed circuit board when inserted into said opening to securely hold down the heat sink on an upper surface of the printed circuit board.2. The apparatus of wherein the pair of hold down clips are configured for attachment to opposite corners of the heat sink and insertion into said openings located adjacent to remaining opposite corners of the heat sink.3. The apparatus of wherein the hold down clips comprise wires.4. The apparatus of wherein the resiliently compressible arm is formed from a wire having a generally round cross section and the retaining finger is formed from a flattened wire.5. The apparatus of wherein the retaining finger comprises an L-shaped member.6. The apparatus of wherein the retaining finger comprises a J-shaped member.7. The apparatus of wherein the retaining finger ...

BACK PLATE ASSEMBLY AND ELECTRONIC DEVICE

A back plate assembly includes a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction, and an arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction. A pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove. 1. A back plate assembly , comprising:a base plate formed with a groove having a bottom wall and a pair of side walls opposite to each other in a first horizontal direction; andan arch plate assembled into the groove and having a pair of opposite ends in the first horizontal direction, a pair of end surfaces of the ends of the arch plate abut against the side walls and a part of a middle portion of the arch plate between the ends is not in contact with the bottom wall of the groove.2. The back plate assembly of claim 1 , wherein the ends of the arch plate abutting the side walls transfer a vertical loading force applied on the arch plate into a horizontal tension applied on the base plate.3. The back plate assembly of claim 1 , wherein the back plate assembly supports an electronic component mounted and pressed on the arch plate.4. The back plate assembly of claim 1 , wherein claim 1 , in an initial state of the arch plate in which no external force is applied thereon claim 1 , a distance between the end surfaces of the ends of the arch plate is equal to claim 1 , slightly smaller than claim 1 , or slightly greater than a distance between the side walls of the groove.5. The back plate assembly of claim 1 , wherein a size of the arch plate in a second horizontal direction perpendicular to the first horizontal direction is equal to the size of the groove in the second horizontal direction.6. The back plate assembly of claim 1 , wherein the groove runs throughout the base plate in a second ...

ELECTRONIC DEVICE

An electronic device includes: a substrate having an upper surface (front surface) on which a semiconductor chip is mounted, and a lower surface (back surface) opposite to the upper surface; and a housing (case) fixed to the substrate through an adhesive material. The housing has through-holes each formed on one short side and the other short side in an X direction. The substrate is disposed between the through-holes. A part of the upper surface of the substrate is fixed so as to face a part of a stepped surface formed at a height different from that of a lower surface of the housing. Further, an interval (distance) between a part (stepped surface) extending along a short side of the housing in the stepped surface and the upper surface of the substrate is larger than an interval (distance) between a part (stepped surface) extending along a long side of the housing in the stepped surface and the upper surface of the substrate. 1. An electronic device comprising:a substrate having: a first front surface on which a first pattern made of metal is formed; and a first back surface that is opposite to the first front surface and on which a second pattern made of metal is formed;a plurality of semiconductor chips mounted on a second front surface of the first pattern;a case fixed to the first front surface of the substrate through an adhesive material; anda sealing material sealing the first front surface of the substrate and the plurality of semiconductor chips,wherein the second pattern of the substrate has a second back surface facing the same side as the first back surface of the substrate,in a plan view, the case has: a first long side extending in a first direction; a second long side extending in the first direction and positioned opposite the first long side; a third long side extending in the first direction and positioned between the first long side and the second long side; a fourth long side extending in the first direction and positioned between the third long ...

Power Module

The present disclosure relates to power modules. The teachings thereof may be embodied in a power unit and/or a drive unit for driving the power unit, along with methods for producing a power module. For example, a power module may include: a power unit including a heat sink; a power device disposed on the heat sink; an insulating layer covering the heat sink and the power device; and a drive unit for driving the power unit, the drive unit comprising a contact element corresponding to the contact area of the power unit. An underside of the power unit is defined by an underside of the heat sink. A top side of the power unit is defined by a contact area thermally and/or electrically coupled to the power device and a surface of the insulating layer surrounding the contact area. The contact element may be disposed abutting the contact area of the power unit for making electrical and/or thermal contact with the power device.

Conductive lid and semiconductor device package

A conductive lid includes a body including a first portion extended from the body and bent toward a first direction; a second portion extended from the body and bent toward the first direction; and a third portion extended from the second portion and bent toward a second direction different from the first direction.

Mechanical Part for Fastening Processor, Assembly, and Computer Device

In a processor fastening structure, when a compression spring () is compressed by shortening a distance between the other end of a screw () and a heat sink base (), the compression spring () provides elastic force for both the screw () and the heat sink base (). In addition, because the screw () passes through the compression spring () to connect to a fastening assembly (), the elastic force of the compression spring () is converted into pressure from the heat sink base () to a CPU. 1. A mechanical part for fastening a processor on a printed circuit board (PCB) , the mechanical part comprising:a heat sink base;a fastening assembly;a compression spring disposed on the heat sink base and comprising a compression spring inner diameter;a first via provided on the heat sink base; and a first screw tail end passing through the compression spring and the first via to connect to the fastening assembly, and', 'a first screw head end comprising a first screw head end diameter that is greater than the compression spring inner diameter,, 'a first screw disposed on the heat sink base and comprisingwherein the compression spring is located between the first screw head end and the heat sink base.2. The mechanical part of claim 1 , wherein the fastening assembly is configured to connect to the printed circuit board claim 1 , and wherein the mechanical part further comprises heat sink fins disposed on the heat sink base.3. The mechanical part of claim 1 , wherein the first via comprises a first via diameter claim 1 , and wherein the compression spring further comprises a compression spring outer diameter that is greater than the first via diameter.4. The mechanical part of claim 3 , further comprising:a washer disposed between the compression spring and the heat sink base, wherein the washer is sheathed over the first screw, and wherein the washer comprises a washer diameter that is greater than the first via diameter; anda second via provided on the washer and comprising a second ...

Thermosiphon Systems for Electronic Devices

A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation. 1. (canceled)2. A method of assembling a thermosiphon system , comprising:providing a condenser, an evaporator, and a condensate line; andsimultaneously brazing the condenser, the evaporator, and the condensate line to form a unitary body in a single brazing process.3. The method of claim 2 , wherein the condenser claim 2 , the evaporator claim 2 , and the condensate line comprise aluminum.4. The method of claim 2 , wherein the condenser and the condensate line comprise aluminum claim 2 , and the evaporator comprises a copper evaporator pan.5. The method of claim 2 , wherein the single brazing process comprises heating the condenser claim 2 , the evaporator claim 2 , and the condensate line simultaneously to a temperature of between about 580 and 620° C.6. The method of claim 2 , wherein the condenser comprises a body having a first side with an opening claim 2 , a second side on the opposite side of the body from the first side claim 2 , a cavity claim 2 , and a plurality of walls that divide the cavity into a central channel and a plurality of parallel chambers.7. The method of claim 6 , wherein the central channel extends from the opening toward the second side claim 6 , the plurality of parallel chambers extend laterally from the central channel claim 6 , a plurality of heat conducting fins projecting outwardly and vertically from the body claim 6 , and the walls extend upwardly from a floor of the ...

SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOMATION DEVICE TO A HEAT SINK

A system includes a heat sink, a semiconductor device, a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, and a fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device. The fastener system includes a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device. 1. A system , comprising:a heat sink;a semiconductor device;a thermal interface material (TIM) disposed between the heat sink and the semiconductor device, wherein the TIM is configured to facilitate dissipation of heat generated by the semiconductor device via the heat sink during operation of the semiconductor device; anda fastener system that couples the semiconductor device, the layer of TIM, and the heat sink together, wherein the fastener system comprises a first Belleville-type washer configured to cooperate with the TIM, which flows when heated beyond a threshold temperature, to maintain a substantially constant coupling force between the semiconductor device and the heat sink during operation of the semiconductor device.2. The system of claim 1 , wherein the fastener system comprises a second Belleville-type washer.3. The system of claim 2 , wherein each of the first and second Belleville-type washers includes a first side and a second side claim 2 , wherein the first side has a larger diameter than the second side.4. The system of claim 3 , wherein the first side of the first Belleville-type washer is positioned against a head of a fastener of the fastener system claim 3 , and wherein the second side of the second Belleville-type washer is positioned ...

Semiconductor package and manufacturing method thereof

A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIPATING SYSTEM

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier. The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side. 1. A system , comprising:a carrier including opposed first and second carrier sides;a first cooling portion mounted adjacent the first carrier side of the carrier;a second cooling portion mounted adjacent the second carrier side of the carrier; anda heat transfer member coupled to the first cooling portion and the second cooling portion, the heat transfer element configured to transfer heat between the first and second cooling portions, the heat transfer member configured to straddle the first and second carrier sides of the carrier.2. The system of including a fixing device for coupling the first cooling portion to the second cooling portion.3. The system of wherein the fixing device comprises:a first holder mounted relative to the first cooling portion and extending through the carrier; anda second holder mounted relative to the second cooling portion and cooperatively engaging the first holder to secure the first and second holders to each ...

LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND HEAT DISSIPATION SYSTEM USING SAME

The present invention relates to a lightweight liquid-cooling-plate assembly having a plastic frame and a heat dissipation system using the same. The liquid-cooling-plate assembly includes a plastic frame and at least one coolant chamber unit. The plastic frame includes a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements. The lateral walls are connected with each other to form and define the at least one accommodation opening. The fastening elements are disposed on a part of the lateral walls. The coolant chamber unit is connected with the plastic frame and embedded in the at least one accommodation opening, and includes at least one surface exposed. 1. A liquid-cooling-plate assembly comprising:a plastic frame including a plurality of lateral walls, at least one accommodation opening, and a plurality of fastening elements, wherein the lateral walls are connected with each other to form and define the at least one accommodation opening, and the fastening elements are disposed on a part of the lateral walls, wherein the lateral walls of the plastic frame comprises a first lateral wall and a second lateral wall, and the first lateral wall is opposite to the second lateral wall, wherein the first lateral wall of the plastic frame comprises an outer side including a plurality of first position recesses, and the second lateral wall of the plastic frame comprises an outer side including a plurality of second position recesses, wherein the first position recesses are aligned with the second position recesses; andat least one coolant chamber unit connected with the plastic frame, embedded in the at least one accommodation opening, and including at least one surface exposed.2. The liquid-cooling-plate assembly according to claim 1 , wherein the plastic frame is connected with the coolant chamber unit by an adhesive layer.3. The liquid-cooling-plate assembly according to claim 1 , wherein the plastic frame is directly ...

Socket connector assembly for an electronic package

A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

SEMICONDUCTOR PACKAGE DEVICE

A semiconductor package device includes a package substrate, an interposer on the package substrate, a semiconductor package on the interposer, and an under-fill between the interposer and the semiconductor package. The interposer includes at least one first trench at an upper portion of the interposer that extends in a first direction parallel to a top surface of the package substrate. The at least one first trench vertically overlaps an edge region of the semiconductor package. The under-fill fills at least a portion of the at least one trench. 1. A semiconductor package device , comprising:a package substrate;an interposer on the package substrate;a semiconductor package on the interposer; andan under-fill between the interposer and the semiconductor package,wherein the interposer is provided with at least one first trench at an upper portion of the interposer, the at least one first trench extending in a first direction parallel to a top surface of the package substrate,wherein the at least one first trench vertically overlaps an edge region of the semiconductor package, andwherein the under-fill fills at least a portion of the at least one first trench.2. The semiconductor package device of claim 1 , a silicon substrate;', 'a wiring layer on the silicon substrate; and', 'a pad on the wiring layer,, 'wherein the interposer includeswherein the wiring layer includes a dielectric layer and a wiring structure in the dielectric layer,wherein the wiring structure includes a via part in contact with the pad, andwherein a depth of the first trench is less than a thickness of the via part.3. The semiconductor package device of claim 2 ,wherein the dielectric layer includes an epoxy compound and fiberglass impregnated in the epoxy compound.4. The semiconductor package device of claim 2 ,wherein the wiring structure further includes a line part connected to the via part, andwherein the line part is disposed lower than a bottom surface of the first trench.5. The ...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge. 1. A semiconductor device comprising:an insulated circuit board on which a semiconductor chip is mounted; anda housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.2. The semiconductor device according to claim 1 , wherein a warpage amount of the insulated circuit board achieved by the arc-shapes of the joint edges is greater than zero micrometer and equal to or less than 100 micrometers.3. The semiconductor device according to claim 2 , wherein the housing has a rectangular-parallelepiped topology claim 2 , and the joint edges are provided on shorter side-walls of the housing.4. The semiconductor device according to claim 3 , further comprising a pair of attachment-members configured to be attached to a cooler claim 3 , the attachment-members are provided on longer side-walls of the housing claim 3 , respectively.5. The semiconductor device according to claim 4 , wherein a warpage of the insulated circuit board achieved by the arc-shapes implements an proximity area claim 4 , which is defined an area proximate to the cooler in a gap between the insulated circuit board ...

HIGH-FREQUENCY AMPLIFIER UNIT AND HIGH-FREQUENCY POWER AMPLIFICATION APPARATUS

A cooler including a first surface on which a first high-frequency amplifier is installed in intimate contact therewith and a second surface which is opposite to the first surface and on which a second high-frequency amplifier is installed in intimate contact therewith. The first high-frequency amplifier amplifies a high-frequency signal and outputs an amplified high-frequency signal from an output terminal thereof. The second high-frequency amplifier amplifies a high-frequency signal and outputs an amplified high-frequency signal from an output terminal thereof. The cooler includes, on a third surface thereof, a first cooler terminal through which refrigerant flows into the cooler and a second cooler terminal through which the refrigerant flows out of the cooler. The third surface intersects the first surface and the second surface 111-. (canceled)12: A high-frequency amplifier unit comprising:a cooler having a first surface on which a first high-frequency amplifier is installed in intimate contact therewith and a second surface which is opposite to the first surface and on which a second high-frequency amplifier is installed in intimate contact therewith, the first high-frequency amplifier configured to amplify a high-frequency signal inputted from a first high-frequency signal input terminal thereof and output an amplified high-frequency signal from a first high-frequency signal output terminal thereof, the second high-frequency amplifier configured to amplify a high-frequency signal inputted from a second high-frequency signal input terminal thereof and output an amplified high-frequency signal from a second high-frequency signal output terminal thereof,the cooler including, on a third surface thereof, a first cooler terminal through which refrigerant flows into the cooler and a second cooler terminal through which the refrigerant flows out of the cooler, the third surface intersecting the first surface and the second surface,the first high-frequency signal ...

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described. 1. A system comprising:a mainboard comprising a processor socket and a bolster plate;an integrated circuit component physically coupled to the processor socket;a heat sink in contact with a surface of the integrated circuit component; anda load plate in contact with the integrated circuit component, wherein the load plate is fastened to the bolster plate with one or more fasteners,wherein the heat sink and the load plate apply a force on the integrated circuit component to press the integrated circuit component into the processor socket.2. The system of claim 1 , wherein the heat sink comprises a rectangular heat sink base claim 1 , wherein the heat sink is fastened to the bolster plate with one or more additional fasteners claim 1 , wherein each fastener fastening the heat sink to the bolster plate is positioned near the middle of an edge of the rectangular heat sink base.3. The system of claim 1 , wherein the heat sink comprises a rectangular heat sink base wherein the heat sink is fastened to the load plate with one or more additional fasteners claim 1 , wherein each fastener fastening the heat sink to the load plate is positioned near the middle of an edge of the rectangular heat sink base.4. The system of ...

SEMICONDUCTOR DEVICE, AND ON-BOARD POWER CONVERSION DEVICE

Provided is a semiconductor device capable of improving heat-radiating performance of a heating element. The semiconductor device of the present invention includes: a heating element (); a heat-radiating member () including an element contact portion () which is held surface contact with a mounting surface (); a first pressing member () and a second pressing member () held in contact with the heating element (); and a fixation screw () for fixing the first pressing member () to the heat-radiating member () through a through hole () formed through the first pressing member (). The first pressing member () and the second pressing member () each include an inclined surface formed so that a component force of an axial force of a tightening force of the fixation screw () is generated in a vertical direction with respect to the mounting surface ().

Heat Exchanger For Dual-Sided Cooling of Electronic Modules

A heat exchanger assembly has first and second heat sink elements enclosing fluid flow passages, and a clamping assembly. The heat sink elements are separated by a space in which at least one heat-generating electronic component is located, with outer side surfaces of each electronic component being in thermal contact with the heat sink elements. The clamping assembly has first and second spring elements arranged in contact with an outer surfaces of the heat sink elements. The spring elements are joined together to apply compressive forces to the heat sink elements and to cause the electronic components to be clamped between the heat sink elements. Each spring element has discrete force application regions for applying force to a heat sink element, and a plurality of fastening regions for compressing and maintaining the positions of the spring elements relative to the outer surfaces of the heat sink elements. 1. A heat exchanger assembly comprising:a first heat sink element and a second heat sink element separated by a space, wherein the first heat sink element defines a first fluid flow passage and the second heat sink element defines a second fluid flow passage, and wherein the first and second heat sink elements are parallel to one another;at least one heat-generating electronic component located in said space and sandwiched between the first and second heat sink elements, wherein each said heat-generating electronic component has a first side surface in thermal contact with an inner surface of the first heat sink element and an opposite side surface in thermal contact with the inner surface of the second heat sink element; anda clamping assembly, comprising:(a) a first spring element arranged in contact with an outer surface of the first heat sink element; and(b) a second spring element arranged in contact with an outer surface of the second heat sink element;wherein the first and second heat sink elements are sandwiched between the first and second spring ...

SEMICONDUCTOR DEVICE

A base plate () made of a metal has a through-hole (). An insulating substrate () is provided on the base plate (). A semiconductor chip () is provided on the insulating substrate (). A case () has a screwhole () communicating with the through-hole (), covers the insulating substrate () and the semiconductor chip (), and is disposed on the base plate (). A screw () made of a metal is inserted into the through-hole () and the screw-hole () to fix the case () to the base plate (). A flexible material () having flexibility is filled in a cavity between a bottom surface of the screwhole () in the case () and a distal end of the screw (). 1. A semiconductor device comprising:a base plate made of a metal and having a through-hole;an insulating substrate on the base plate;a semiconductor chip on the insulating substrate;a case having a screw-hole communicating with the through-hole, covering the insulating substrate and the semiconductor chip, and disposed on the base plate;a screw made of a metal and inserted into the through-hole and the screw-hole to fix the case to the base plate; anda flexible material having flexibility, compressed and filled in a cavity between a bottom surface of the screw-hole in the case and a distal end of the screw,wherein volume of the uncompressed flexible material is larger than that of the cavity.2. (canceled)3. The semiconductor device of claim 1 , wherein the flexible material has a heat resistance higher than maximum operative temperature of the semiconductor device.4. The semiconductor device of claim 1 , wherein the flexible material has an insulation higher than that of an air.5. The semiconductor device of claim 1 , further comprising a conductive coat applied to a side surface and the bottom surface of the screw-hole in the case.6. The semiconductor device of claim 1 , wherein the flexible material is a material having conductivity.7. The semiconductor device of claim 1 , wherein the semiconductor chip is formed by a wide-band gap ...

Floating Heat Sink and Elastic Support Thereof

A floating heat sink includes an elastic support and a heat dissipating piece. The elastic support is integrally formed and includes at least two fasteners and at least two elastic arms. The fasteners are configured to mount the heat dissipating piece. All the fasteners and all the elastic arms are arranged around the heat dissipating piece. Two ends of the elastic arm are both connected to the fastener, and the two ends of the elastic arm are arranged in a circumferential direction of the heat dissipating piece. A middle part of the elastic arm is configured to be connected to a board in a fastened manner, and the middle part of the elastic arm is bent toward the board. 1. An elastic support comprising: mount a heat dissipating piece, and', 'arrange around the heat dissipating piece; and, 'fasteners comprising a first fastener and a second fastener configured toelastic arms arranged around the heat dissipating piece and comprising a first elastic arm and a second elastic arm, wherein the first elastic arm comprises a first elastic arm end, an elastic arm middle part, and a second elastic arm end, wherein the first elastic arm end and the second elastic arm end are connected to the fasteners and configured to arrange in a circumferential direction of the heat dissipating piece, wherein the elastic arm middle part is configured to bend toward a board and connect to the board in a fastened manner,wherein the elastic support is integrally formed and configured to be used in a floating heat sink.2. The elastic support of claim 1 , wherein the first fastener is a strip-shaped fastener that is configured to be disposed along an edge of the heat dissipating piece.3. The elastic support of claim 2 , wherein the fasteners are sequentially connected to form a ring.4. The elastic support of claim 1 , wherein the first fastener comprises a first fastener side configured to:position close to the heat dissipating piece; andbend away from the board in a step-shaped manner.5. The ...

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE USING THE SAME

A semiconductor module internally includes semiconductor elements and multilayer substrates on which the semiconductor elements are arranged. The semiconductor module further includes, in a case, fastening portions for fastening a cooler such as conductive radiating fins or water-cooling jackets, for example. In the semiconductor module, side faces of heat radiating plates formed on the rear surface sides of the multilayer substrates are electrically connected to the fastening portions in the case by conductive connectors. 1. A semiconductor module , comprising:a multilayer substrate including an insulating board, a conductive board formed on a front surface of the insulating board, and a heat radiating plate formed on a rear surface of the insulating board;a semiconductor element arranged on the conductive board;a case that houses at least the semiconductor element and a front surface of the multilayer substrate and includes a fastening portion to receive an electrically conductive fastener; anda connector electrically connecting a side face of the heat radiating plate to the fastening portion so as to make electrical contact with the electrically conductive fastener when the fastening portion receives the electrically conductive fastener.2. The semiconductor module according to claim 1 , wherein the connector is electrically and mechanically connected to the side face of the heat radiating plate and to the fastening portion.3. The semiconductor module according to claim 1 , wherein the connector is made of an elastic material.4. The semiconductor module according to claim 1 , wherein a rear surface of the heat radiating plate is exposed from a bottom surface of the case.5. The semiconductor module according to claim 4 , wherein the rear surface of the heat radiating plate protrudes out from the bottom surface of the case claim 4 , and at least a portion of the side face of the heat radiating plate is exposed from the case.6. The semiconductor module according to ...

CIRCUIT ASSEMBLY

Provided is a circuit assembly including: a circuit board; a bus bar having a top face fixed to a bottom face of the circuit board; an electronic component disposed on a top face of the bus bar; a heat dissipation member disposed on a bottom face of the bus bar; a heat transfer member interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; and a screw extending through a stack of the circuit board and the bus bar, the screw screwed to the heat dissipation member, fixing the stack to the heat dissipation member; and a spacer interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform. 1. A circuit assembly comprising:a circuit board;a bus bar having a top face that is fixed to a bottom face of the circuit board;an electronic component that is disposed on a top face of the bus bar;a heat dissipation member that is disposed on a bottom face of the bus bar;a heat transfer member that is interposed between the bus bar and the heat dissipation member, to transfer heat of the bus bar to the heat dissipation member; anda screw that extends through a stack of the circuit board and the bus bar, the screw being screwed to the heat dissipation member, fixing the stack to the heat dissipation member; anda spacer that is interposed between the circuit board and the heat dissipation member, the spacer surrounding at least a portion of an outer circumference of a shaft portion of the screw, and maintaining a thickness of the heat transfer member substantially uniform.2. The circuit assembly according to claim 1 , whereinthe spacer is constituted by a separate member that is independent of the heat dissipation member.3. The circuit assembly according to claim 2 , whereinthe heat dissipation member includes a positioning recess ...

MOUNTING AN LED ELEMENT ON A FLAT CARRIER

A lighting device and a method of manufacturing a lighting device are described. A lighting device includes a flat carrier that has a front surface and a rear surface opposite the front surface. The flat carrier includes a cutout and multiple carrier-side electrical contacts on the rear surface. A mounting element is provided on the rear surface of the flat carrier and includes multiple mount-side electrical contacts electrically coupled to the multiple carrier-side electrical contacts and an elevated portion projecting into the cutout. Multiple LED elements are provided on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts. A heat sink element is thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier. 1. A lighting device comprising:a flat carrier comprising a front surface and a rear surface opposite the front surfaces, said flat carrier comprising a cutout and multiple carrier-side electrical contacts on the rear surface;a mounting element on the rear surface of the flat carrier, the mounting element comprising multiple mount-side electrical contacts electrically coupled to said multiple carrier-side electrical contacts and an elevated portion projecting into said cutout;a plurality of LED elements on the elevated portion of the mounting element and electrically coupled to the mounting element on the same side as the multiple mount-side side electrical contacts; andand a heat sink element thermally coupled to the mounting element on a side of said mounting element opposite the flat carrier.2. (canceled).3. The lighting device according to claim 1 , wherein:the multiple carrier-side electrical contacts comprise at least a first carrier-side electrical contact and a second carrier-side electrical contact,the multiple mount-side electrical contacts comprise at least a first mount-side electrical contact and a ...

SYSTEM, DEVICE AND METHODS OF MANUFACTURE

Systems, devices and methods of manufacturing a system on silicon wafer (SoSW) device and package are described herein. A plurality of functional dies is formed in a silicon wafer. Different sets of masks are used to form different types of the functional dies in the silicon wafer. A first redistribution structure is formed over the silicon wafer and provides local interconnects between adjacent dies of the same type and/or of different types. A second redistribution structure may be formed over the first redistribution layer and provides semi-global and/or global interconnects between non-adjacent dies of the same type and/or of different types. An optional backside redistribution structure may be formed over a second side of the silicon wafer opposite the first redistribution layer. The optional backside redistribution structure may provide backside interconnects between functional dies of different types. 1. A method comprising:forming a first semiconductor die of a first type in a silicon substrate;forming a second semiconductor die of a second type in the silicon substrate, the second type being different from the first type;without singulating the first semiconductor die from the second semiconductor die, forming a local interconnect between the first semiconductor die and the second semiconductor die; andforming a semi-global interconnect over the local interconnect.2. The method of claim 1 , further comprising forming a third semiconductor die of a third type in the silicon substrate claim 1 , the third semiconductor die being separated from the first semiconductor die by the second semiconductor die and the third type being different from the first type and being different from the second type.3. The method of claim 2 , wherein the forming the semi-global interconnect further comprises forming the semi-global interconnect between the first semiconductor die and the third semiconductor die.4. The method of claim 1 , further comprising forming through ...

CRIMPING POWER MODULE

A crimping power module includes a shell (), a cover (), and an electric insulation substrate () crimped to a heat dissipation device. The cover and the substrate are respectively mounted to a first surface () and a second surface () of the shell. The second surface defines an annular slot () in a position facing sides of the substrate. The slot is embedded with a first elastic member () elastically abutted against the substrate. The elastic member is higher than the second surface, allowing the shell to adjust a pressure flexibly applied on the heat dissipation device by the substrate. An elastic buffer is provided through defining the slot embedded with the elastic member, to prevent the substrate from fracturing, and adjust the pressure to ensure tight crimping between the substrate and the heat dissipation device, which decreases thermal resistance, and increases heat dissipation efficiency. 1. A crimping power module , comprising:a shelf comprising a first surface and a second surface;a cover mounted to the first surface; andan electric insulation substrate mounted to the second surface and to be crimped to a heat dissipation device;wherein the second surface defines an annular slot in a position facing sides of the electric insulation substrate, the annular slot is embedded with a first elastic member elastically abutted against the electric insulation substrate, the first elastic member extends out of the second surface, to allow the shell to adjust a pressure flexibly crimped to the heat dissipation device by the electric insulation substrate.2. The crimping power module of claim 1 , wherein the first surface of the shell defines a plurality of accommodation grooves each embedded with a second elastic member elastically supported between the cover and the shell.3. The crimping power module of claim 2 , wherein a pressure applied on the electric insulation substrate is controlled by deformation quantity of the first elastic member and deformation quantity of ...

FIXING DEVICE FOR DOUBLE SIDED HEAT SINK AND ASSOCIATED HEAT DISSIPATING SYSTEM

Embodiments of the present disclosure relate to a fixing device for a double-sided heat sink and an associated heat dissipating system. There is exemplarily provided a fixing device for mounting the double-sided heat sink on a carrier, The fixing device comprises: a first holder including a first cylindrically-shaped rod, wherein the first cylindrically-shaped rod can pass through a first cooling portion of the double-sided heat sink and a mounting hole of the carrier to fix the first cooling portion to a first side of the carrier, and the first cylindrically-shaped rod comprises a through-hole extending along a longitudinal direction; and a second holder including a second cylindrically-shaped rod, wherein the second cylindrically-shaped rod can pass through a mounting hole of a second cooling portion of the double-sided heat sink and the through-hole of the first holder, such that the second holder is coupled with the first holder to fix the second cooling portion to a second side of the carrier opposite to the first side. 1100200300. A fixing device () for mounting a double-sided heat sink () on a carrier () , comprising:{'b': 110', '111', '111', '210', '200', '300', '210', '310', '300', '111', '112, 'a first holder () comprising a first cylindrically-shaped rod (), wherein the first cylindrically-shaped rod () can pass through a first cooling portion () of the double-sided heat sink () and a mounting hole of the carrier () to fix the first cooling portion () to a first side () of the carrier (), and the first cylindrically-shaped rod () comprises a through-hole () extending along a longitudinal direction (z); and'}{'b': 120', '121', '121', '220', '200', '112', '110', '120', '110', '220', '320', '300', '310, 'a second holder () comprising a second cylindrically-shaped rod (), wherein the second cylindrically-shaped rod () can pass through a mounting hole of a second cooling portion () of the double-sided heat sink () and the through-hole () of the first holder ...

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate. 1. An electronic package , comprising:a first package substrate;a second package substrate attached to the first package substrate;a die attached to the second package substrate; anda plurality of photonic engines attached to a first surface and a second surface of the first package substrate, wherein the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.2. The electronic package of claim 1 , wherein the plurality of photonic engines surround a perimeter of the die.3. The electronic package of claim 1 , wherein the die comprises four edges claim 1 , and wherein four photonic engines are adjacent to each of the four edges.4. The electronic package of claim 3 , wherein a first two of the four photonic engines are on the first surface of the first package substrate claim 3 , and wherein a second two of the four photonic engines are on the second surface of the first package substrate.5. The electronic package of claim 1 , wherein photonic engines on the first surface of the first package substrate are each directly above photonic engines on the second surface of the first package substrate.6. The electronic package of claim 1 , wherein the photonic engines convert optical signals to electrical signals and/or convert electrical signals to optical signals.7. The electronic package of claim ...

Semiconductor device

A semiconductor device includes a semiconductor element having a front surface and a rear surface, a pair of heat sinks disposed facing each other so as to sandwich the semiconductor element, and attached respectively to the front surface and the rear surface, and a fastening screw fastening the pair of the heat sinks in the facing direction, the fastening screw having insulation property. Threads are arranged on at least a part of the fastening screw in an axis direction of the fastening screw between the pair of the heat sinks.

SYSTEMS AND METHODS FOR COUPLING A SEMICONDUCTOR DEVICE OF AN AUTOMATION DEVICE TO A HEAT SINK

A system includes a heat sink, a semiconductor device, and a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device. The TIM may facilitate dissipation of heat generated by the semiconductor device via the heat sink. The system also includes a fastener system that couples the semiconductor device to the heat sink about the layer of TIM. The system also includes one or more washers of the fastener system that maintain a coupling force between the semiconductor device and the heat sink after the TIM flows. 1. A system , comprising:a heat sink;a semiconductor device;a layer of thermal interface material (TIM) disposed between the heat sink and the semiconductor device, wherein the TIM is configured to facilitate dissipation of heat generated by the semiconductor device via the heat sink;a fastener system configured to couple the semiconductor device to the heat sink about the layer of TIM; andone or more washers of the fastener system that are configured to maintain a coupling force between the semiconductor device and the heat sink after the TIM flows.2. The system of claim 1 , wherein the washers comprise Belleville-type washers.3. The system of claim 1 , wherein the washers comprise a plurality of washers claim 1 , wherein each washer of the plurality of washers is positioned in an opposite direction of an adjacent washer.4. The system of claim 3 , wherein a first washer of the plurality of washer is positioned against a head of a fastener in the fastener system claim 3 , wherein a first side of the first washer having a larger diameter than a second side of the first washer is positioned against the head of the fastener; andwherein a second washer of the plurality of washers is positioned against the second side of the first washer, wherein a first side of the second washer having a smaller diameter than a second side of the second washer is positioned against the second side of the first washer.5. The system of claim ...

SEMICONDUCTOR MODULE WITH PACKAGE EXTENSION FRAMES

A semiconductor package includes a semiconductor module, a first package extension frame, a second package extension frame, and a plurality of fasteners. The semiconductor module includes a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface. The first package extension frame is configured to attach to the first side surface. The second package extension frame is configured to attach to the second side surface. The plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface. 1. A semiconductor package comprising:a semiconductor module comprising a first side surface, a second side surface, a first major surface, and a second major surface on an opposite side of the semiconductor module from the first major surface;a first package extension frame configured to attach to the first side surface;a second package extension frame configured to attach to the second side surface; anda plurality of fasteners configured to mechanically couple the first package extension frame and the second package extension frame to one or more of a circuit board arranged on the first major surface and/or a heat sink arranged on the second major surface.2. The semiconductor package of claim 1 , wherein the plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to the circuit board.3. The semiconductor package of claim 1 , wherein the plurality of fasteners are configured to mechanically couple the first package extension frame and the second package extension frame to the heat sink.4. The semiconductor package of claim 1 , wherein the plurality of fasteners are configured to mechanically couple the ...

INTEGRATED CIRCUIT PACKAGE AND METHOD

In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure. 1. A device comprising:an integrated circuit die;a redistribution structure over a front-side surface of the integrated circuit die;a socket over the redistribution structure;a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening;a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; anda bolt extending through the mechanical brace and the redistribution structure.2. The device of further comprising:a thermal interface material on a back-side surface of the integrated circuit die; anda thermal module thermally and physically coupled to the back-side surface of the integrated circuit die with the thermal interface material, the bolt extending through the thermal module and the thermal interface material.3. The device of further comprising:a second standoff screw disposed in the edge regions of the mechanical brace, the second standoff screw physically contacting the socket, the second standoff screw extending a second distance between the socket and the mechanical brace, the ...

Semiconductor device and semiconductor module

A semiconductor device includes a base plate, a semiconductor chip, a case, a heat dissipation member, and a plurality of attachment portions. The semiconductor chip is held on a front surface side of the base plate. The case is provided on a front surface of the base plate so as to house the semiconductor chip inside. The heat dissipation member is provided on a back surface of the base plate and contactable with a heat sink for cooling the semiconductor chip. The plurality of attachment portions have a function of attaching the case to the heat sink. Ends of the heat dissipation member in a direction extending along a long side of a plurality of sides that form a shape defined by connecting positions of the plurality of attachment portions in plan view are located between the two attachment portions that form the long side.

Electronic Device and Method for Fabricating an Electronic Device

An electronic device includes a semiconductor chip including an electrode, a substrate element and a contact element connecting the electrode to the substrate element. The electronic device further includes an encapsulant configured to leave the contact element at least partially exposed such that a heatsink may be connected to the contact element. 1. An electronic through-hole device , comprising:a semiconductor chip comprising a first electrode on a first surface of the semiconductor chip;an encapsulant encapsulating the semiconductor chip;a first substrate element; anda contact element configured to connect the first electrode to the first substrate element;wherein the encapsulant is configured to at least partially expose the contact element.2. The electronic through-hole device of claim 1 , further comprising a heatsink thermally connected to the contact element.3. The electronic through-hole device of claim 2 , wherein the heatsink is mechanically fixed on the contact element via one or more of a screw and a clamp.4. The electronic through-hole device of claim 1 , wherein the encapsulant comprises a step on a front-side of the encapsulant comprising the at least partially exposed contact element.5. The electronic through-hole device of claim 1 , wherein the contact element comprises a contact clip.6. The electronic through-hole device of claim 5 , wherein the contact clip is one contiguous part.7. The electronic through-hole device of claim 5 , wherein the contact clip comprises more than one part.8. The electronic through-hole device of claim 1 , wherein the first electrode is a source electrode or an emitter electrode.9. The electronic through-hole device of claim 1 , wherein the first substrate element comprises a first lead of the electronic through-hole device.10. The electronic through-hole device of claim 1 , wherein the first surface of the semiconductor chip comprises four edges and the contact element traverses at least two of the four edges.11. The ...

CONDUCTIVE STRESS-RELIEF WASHERS IN MICROELECTRONIC ASSEMBLIES

Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation. 1. A microelectronic device assembly , comprising:a first substrate;a second substrate including one or more integrated circuit (IC) components electrically coupled to the second substrate;a screw affixing the second substrate to the first substrate; andan electrically and thermally conductive pad between a head of the screw and a metal feature on the first or second substrate, wherein the pad is deformed by a force maintained by the screw.2. The assembly of claim 1 , wherein the pad comprises a material having a hardness below 50 Shore C.3. The assembly of claim 1 , wherein the pad comprises a material having a thermal conductivity of at least 1 W/m-K4. The assembly of claim 1 , wherein the pad comprises a material having a volume resistivity no more than 1.0×10Ω-cm5. The assembly of claim 1 , wherein the pad has a thickness no greater than 1 mm and an outer diameter (OD) no more than 2 mm.6. The assembly of claim 5 , wherein the pad OD is no larger than an OD of the screw head.7. The assembly of claim 1 , wherein the pad comprises a material having:a hardness no more than 50 Shore A;a thermal conductivity of at least 30 W/m-K; anda volume resistivity no more than 500 Ω-cm.8. The assembly of claim 1 , wherein the pad comprises a material loaded with a conductive filler.9. The ...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE HAVING COOLING FINS

A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided. 1. A semiconductor device comprising:a semiconductor module having a plurality of cooling fins; anda cooling jacket having a cooling medium passage in which the plurality of cooling fins are housed,wherein a snap-fitting mechanism for fixing the semiconductor module to the cooling jacket is formed on the semiconductor module and the cooling jacket.2. The semiconductor device according to claim 1 , wherein the snap-fitting mechanism includes:a hook formed on the semiconductor module so as to extend in the same direction as the plurality of cooling fins; anda hook groove formed in the cooling jacket so as to have a shape for snap-fit fixing to the hook.3. The semiconductor device according to claim 2 , wherein a base end portion of the hook is tapered.4. The semiconductor device according to claim 1 , wherein the semiconductor module includes:a first semiconductor module fixed to the cooling jacket at the upper surface side of the same by the snap-fitting mechanism; anda second semiconductor module fixed to the cooling jacket at the lower surface side of the same by the snap-fitting mechanism.5. The semiconductor device according to claim 1 , comprising a plurality of the semiconductor modules and a plurality of the cooling jackets claim 1 , wherein the plurality of cooling jackets are connected so as to form one continuous cooling medium passage. The present application is a Divisional ...

SEMICONDUCTOR DEVICE

A semiconductor device includes semiconductor modules disposed on a support member via a cooling plate; and a metal plate which supports a control board for controlling the semiconductor modules, wherein the metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules. 1. A semiconductor device , comprising:semiconductor modules disposed on a support member via a cooling plate; anda metal plate which supports a control board for controlling the semiconductor modules, whereinthe metal plate, being supported by the support member, covers the semiconductor modules, and also fixes the control board opposite the installation surfaces of the semiconductor modules.2. The semiconductor device according to claim 1 , whereinthe metal plate, together with the cooling plate, is jointly fastened to the support member maintained at a ground potential.3. The semiconductor device according to claim 2 , whereinthe cooling plate and the metal plate are jointly fastened to the support member with screws, and the head bearing surfaces of the screws are provided in positions one step lower than the upper surface of the metal plate and close to the cooling plate.4. The semiconductor device according to claim 2 , whereinthe metal plate is in contact with the semiconductor modules.5. The semiconductor device according to claim 2 , whereinthe metal plate has a rigidity and has a structure in which to press the semiconductor modules against the cooling plate.6. The semiconductor device according to claim 4 , whereinthe metal plate has a rigidity and has a structure in which to press the semiconductor modules against the cooling plate.7. The semiconductor device according to claim 2 , whereinthe metal plate has through holes, and signal terminal pins of the semiconductor modules are connected to the control board through the through holes.8. The semiconductor device ...

Power Semiconductor Module

A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region. 1. A power semiconductor module comprising:a baseplate comprising a first side, a second side opposite the first side, and an edge side connecting the first side and the second side, wherein the baseplate comprises a first region at the first side located adjacent to the edge side of the baseplate and proceeding in a first plane; andan encapsulation material covering portions of the baseplate, wherein the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material;wherein the baseplate at its first side is configured for being provided with an electric circuit;wherein the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region; andwherein, at the edge side, the encapsulation material has a first area of cross section proceeding parallel to the first plane and has a second area of cross section in a second plane proceeding parallel to the first plane and being different from the first plane, wherein the first area of cross section is closer to the first plane compared to the second area of cross section, and wherein the first area of ...

Integrated electronic device

An electronic device with heat sink is provided. The heat sink includes a base and fins. One side of the base has a first placement plane and a second placement plane. The electronic device includes a circuit board, a power module and transistors. The power module includes a power body and soldering legs, and the power body is attached to the first placement plane. The transistor has a transistor body and pins, and the transistor body is attached to the second placement plane. The circuit board is disposed at one side of the base formed with the first placement plane, and soldering legs of the power module and pins of the transistor are inserted on the circuit board. Thereby the heat sinks and the space which the circuit board occupied will be reduced for increasing the power density of the heat sink.

SEMICONDUCTOR DEVICE

Provided is a semiconductor device having a small footprint, where the semiconductor device includes multiple power modules and a cooling structure for these power modules. The semiconductor device includes: a first power module on a first top plate of a coolant jacket; and a second power module on a second top plate of the coolant jacket, where the second top plate face the first top plate. The coolant jacket includes a first fin in contact with the first top plate in a passage, and a second fin in contact with the second top plate in the passage. The power modules face each other through the top plates and the fins. 1. A semiconductor device comprising:a coolant jacket comprising a passage through which a coolant flows inside said coolant jacket;a first power module mounted on a first-surface member of said coolant jacket; anda second power module mounted on a second-surface member of said coolant jacket, said second-surface member facing said first-surface member, a first fin in contact with said first-surface member in said passage;', 'a second fin in contact with said second-surface member in said passage;', 'an intake opening through which said coolant is taken in from an outside;', 'an intake header configured to send said coolant entering from said intake opening to said first fin and said second fin;', 'a discharge opening through which said coolant is discharged to said outside; and', 'a discharge header configured to send, to said discharge opening, said coolant passing through said first fin and said second fin, and, 'wherein said coolant jacket compriseswherein said first power module and said second power module face each other through said first-surface member and said second-surface member, and through said first fin and said second fin.2. The semiconductor device according to claim 1 , wherein said coolant jacket further comprises a partition plate partitioning said first fin and said second fin in said passage.3. The semiconductor device according ...

ELECTRONIC ASSEMBLY, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

A package structure includes at least one semiconductor die, a plurality of hollow cylinders, an insulating encapsulant, a redistribution layer and through holes. The plurality of hollow cylinders is surrounding the at least one semiconductor die. The insulating encapsulant has a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders. The redistribution layer is disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die. The through holes are penetrating through the plurality of hollow cylinders. 1. A package structure , comprising:at least one semiconductor die;a plurality of hollow cylinders surrounding the at least one semiconductor die;an insulating encapsulant having a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders;a redistribution layer disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die; andthrough holes penetrating through the plurality of hollow cylinders.2. The package structure according to claim 1 , wherein a height of the plurality of hollow cylinders is equal to a height of the insulating encapsulant.3. The package structure according to claim 2 , wherein the through holes are penetrating through the plurality of hollow cylinders and the redistribution layer.4. The package structure according to claim 1 , wherein a height of the plurality of hollow cylinders is equal to a sum of a height of the insulating encapsulant and a height of the redistribution layer.5. The package structure according to claim 4 , wherein the insulating encapsulant and the redistribution layer are surrounding the plurality of hollow cylinders.6. The package structure according to claim 1 , further comprising:a thermal module ...

Heat Sink, Heat Dissipation Apparatus, Heat Dissipation System, And Communications Device

One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips. 1. A heat sink , comprising: the heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, wherein the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board; and', 'the heat dissipation substrate comprises a first heat dissipation substrate and a second heat dissipation substrate, wherein the first heat dissipation substrate and the second heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip, wherein different heat conduction surfaces correspond to different chips, wherein a first end of the connector is fastened to the first heat dissipation substrate, wherein a second end of the connector suspends on an outer side of the second heat dissipation substrate, and wherein the fastener presses against an outer side of the first heat dissipation substrate to prevent the first heat dissipation substrate from moving far away from the second heat dissipation substrate., 'a heat dissipation substrate, a connector, and a fastener, wherein2. The heat sink according to claim 1 , wherein the heat conduction surfaces of the first heat dissipation substrate and the second heat dissipation substrate are both in a same plane.3. The heat sink according to claim 2 , wherein the connector is of an elongated shape.4. The heat ...

Power semiconductor module having a pressure application body and arrangement therewith

A power semiconductor module having a pressure application body, a circuit carrier, which is embodied with a first conductor track, a power semiconductor element arranged thereon and an internal connecting device, and also having a housing which is embodied with a guide device arranged therein, with a connecting element. The connecting element is embodied as a bolt with first and second end sections and an intermediate section therebetween, wherein the first end section rests on the circuit carrier and is electrically conductively connected thereto; the second end section projects out of the housing through a cutout; and wherein the connecting element is arranged in the assigned guide device. The pressure application body has a first rigid partial body and a second elastic partial body, wherein the second partial body protrudes out of the first partial body in the direction of the housing. 1. A power semiconductor module comprising:a pressure application body having a first rigid partial body and a second elastic partial body;a circuit carrier having at least one conductor track;a power semiconductor component arranged on said at least one conductor track;an internal connecting device for connecting said power semiconductor component and said at least one conductor track; anda housing having a guide device arranged therein, a cutout therein and a connecting element;wherein said connecting element is embodied as a bolt with first and second end sections and an intermediate section therebetween;wherein said first end section is disposed on said circuit carrier and is electrically conductively connected thereto;wherein said second end section projects out of said cutout;wherein said connecting element is arranged in said guide device; andwherein said second partial body of said pressure application body protrudes out of said first partial body towards said housing and is configured to apply pressure to a circuit board when the circuit board is arranged between said ...

BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM

A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board. 1. A circuit board comprising:a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism creating an asymmetrical downward force for coupling the heatsink to the circuit board; anda second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism.2. The circuit board of claim 1 , wherein the asymmetrical downward force is asymmetrical relative to an application specific integrated circuit (ASIC) covered by the heatsink.3. The circuit board of claim 1 , wherein the first coupling mechanism comprises a plurality of first coupling components claim 1 , anda partial downward force created by at least one of the plurality of first coupling components when the heatsink is coupled to the circuit board results in the asymmetrical downward force.4. The circuit board of claim 3 , wherein the second coupling mechanism is configured to create a force equal and counter to the partial downward force created by the at least one of the plurality of first coupling components.5. The circuit board of claim 4 , wherein the second coupling mechanism is configured to couple the heatsink to the circuit board at a center of the heatsink.6. The circuit board of claim 3 , wherein the second coupling mechanism comprises a plurality of second coupling components.7. The circuit board of claim 6 , wherein the heatsink comprises a base having a first set of ...

Integrated Circuit Package and Method

In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component. 1. A device comprising:a package component comprising integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure;a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets;a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; andbolts extending through the thermal module, the mechanical brace, and the package component.2. The device of claim 1 , wherein the openings are squares.3. The device of claim 1 , wherein the openings are circles.4. The device of claim 1 , wherein the openings are irregular polygons.5. The device of claim 1 , wherein the openings and the bolts have a layout with a regular pattern.6. The device of claim 1 , wherein the openings and the bolts have a layout with a symmetrical irregular pattern.7. The device of claim 1 , wherein the openings and the bolts have a layout with an asymmetrical irregular pattern.8. A device comprising:a package component comprising an integrated circuit die, a redistribution structure over the integrated circuit die, and a socket over the redistribution structure;a mechanical brace attached to a first side of the ...

HEAT SINK WITH INTEGRATED THREADED LID

A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion. The module lid is thermally interfaced to a die by use of a thermal interface material. The heat sink is then screwed onto a module lid, where the heat sink includes a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink. 1. A method of affixing a heat sink to a module lid , the method comprising:mounting a module lid to a substrate by use of a lid adhesive, wherein the module lid has a threaded exterior portion;thermally interfacing the module lid to a die by use of a thermal interface material; andscrewing a heat sink onto the module lid, wherein the heat sink comprises a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink.2. The method of claim 1 , wherein the module lid has a polygonal shape that has corners claim 1 , and wherein the threaded exterior portion of the module lid is only at the corners of the module lid.3. The method of claim 1 , wherein the airflow from the air moving device is parallel to vanes of the heat sink when a thread engagement between the heat sink and the module lid mechanically and thermally couples the heat sink to the module lid. The present disclosure relates to the field of electronic circuits, and specifically to cooling devices used in electronic circuits. Still more ...

HOLDING DEVICE FOR SEMICONDUCTOR ELEMENT, AND POWER CONVERSION DEVICE USING HOLDING DEVICE

A problem to be solved by the present invention is to prevent smoke emission and ignition of a power semiconductor element that is installed inside a power conversion device connected to a battery in the field of power electronics, for example. A semiconductor holding device according to the present invention includes: a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package; a plate covering a second surface opposing the first surface of the package; and a pressing member pressing the plate against the package. 110.-. (canceled)11. A semiconductor element holding device comprising:a package which houses a power semiconductor element therein and dissipates heat to a cooler from a first surface of the package;a plate covering a second surface opposing the first surface of the package; anda pressing member pressing the plate against the package.12. The semiconductor element holding device according to claim 11 , whereinthe package is fixed to the cooler by the pressing member.13. The semiconductor element holding device according to claim 11 , whereinthe plate has an area larger than an area of the second surface.14. The semiconductor element holding device according to claim 12 , whereinthe plate has an area larger than an area of the second surface.15. The semiconductor element holding device according to claim 13 , whereina surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package.16. The semiconductor element holding device according to claim 14 , whereina surface standing perpendicularly from the plate along an outer peripheral portion of the plate is engaged with a side surface of the package.17. The semiconductor element holding device according to claim 13 , whereinthe second surfaces of a plurality of the packages are covered by the plate.18. The semiconductor element holding device according to claim 14 , ...

SEMICONDUCTOR DEVICE

A semiconductor device includes: a first chip to restrict current flow in a first direction through a current path; a second chip to restrict the current flow in a second direction opposite to the first direction, through the current path; a wiring having one end connected to the first chip and the other end connected to the second chip, and provided as a part of the current path by relaying the first chip and the second chip; a lead frame having a first lead arranged and fixed with the first chip and a second lead is arranged and fixed with the second chip; and molding resin sealing the first chip, the second chip, the wiring and the lead frame. The wiring is a shunt resistor having a resistive body. The lead frame further has a sense terminal to detect a voltage drop across the resistive body. 1. A semiconductor device connected to a current path through which a current flows bidirectionally and provided as a part of the current path , the semiconductor device comprising:a first chip that has a first switching element to restrict current flow in a first direction through the current path when the first switching element is turned off;a second chip that has a second switching element to restrict the current flow in a second direction, which is opposite to the first direction, through the current path when the second switching element is turned off;a wiring that has one end connected to the first chip and another end connected to the second chip, and that is provided as a part of the current path by relaying the first chip and the second chip;a lead frame that includes a first lead arranged and fixed with the first chip and a second lead arranged and fixed with the second chip, and that provides the current path; andmolding resin that integrally seals the first chip, the second chip, the wiring and the lead frame, wherein:the wiring is a shunt resistor that has a resistive body to detect the current flowing through the current path, and that is extended in an ...

Power conversion apparatus

To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.

SEMICONDUCTOR DEVICE

A semiconductor device () includes a metallic base plate () provided with an upper surface () and a lower surface (), a plurality of insulating substrates () provided on the upper surface (), and a plurality of semiconductor elements () and () mounted side by side on the respective insulating substrates (). Annular grooves () and () for storing insulating grease are provided on the lower surface () of the base plate (). A surface () of a cooling fin () is superimposed on the lower surface () with insulating grease () interposed therebetween and insides of the annular grooves () and () are filled with the insulating grease (). 1. (canceled)2. (canceled)3. (canceled)4. (canceled)5. (canceled)6. A semiconductor device comprising:a base plate having an upper surface and a lower surface; anda plurality of planar semiconductor elements provided side by side on the upper surface side,wherein the lower surface of the base plate is provided with a groove region where a plurality of grooves are continuously provided so as to spread and overlap with the plurality of semiconductor elements, grooves of the groove region in the center of the base plate are deeper than grooves of the groove region on distal end sides of the base plate.7. (canceled)8. (canceled)9. The semiconductor device according to claim 6 , further comprising a cooling fin having a flat surface claim 6 , the flat surface being superimposed on the lower surface claim 6 ,wherein insulating grease is provided between the lower surface and the flat surface, anda sealing member is provided so as to seal the insulating grease along an edge of the base plate.10. The semiconductor device according to claim 6 , wherein a semiconductor material of the semiconductor element is silicon carbide. The present invention relates to a semiconductor device.Conventionally, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-168772, semiconductor devices are known which are each provided with a groove ...

COOLING DEVICE AND LIQUID DISCHARGE APPARATUS

A cooling device includes a metal member, a cooling member, and a sheet-shaped thermal conductive member. The metal member thermally couples with an element that generates heat. The cooling member includes a channel for refrigerant to flow. The thermal conductive member includes an adhesive surface adhered to the metal member and a non-adhesive surface pressed against and thermally coupled in contact with the cooling member. The thermal conductive member and the cooling member are separable. 1. A cooling device comprising:a metal member configured to thermally couple with an element that generates heat;a cooling member including a channel for refrigerant to flow; anda sheet-shaped thermal conductive member between the metal member and the cooling member, an adhesive surface adhered to the metal member; and', 'a non-adhesive surface pressed against and thermally coupled in contact with the cooling member, the thermal conductive member and the cooling member being separable., 'the thermal conductive member including2. The cooling device according to claim 1 ,wherein the thermal conductive member and the metal member are substantially a same size.3. The cooling device according to claim 1 ,wherein the metal member is concave.4. The cooling device according to claim 1 , further comprising a fastening member claim 1 ,wherein the metal member has a first face and a second face that is lower than the first face,wherein the first face and the cooling member are fastened with the fastening member, and the metal member is pressed against the second face.5. A liquid discharge apparatus comprising the cooling device according to .6. A cooling device comprising:a metal member configured to thermally couple with an element that generates heat;a cooling member including a channel for refrigerant to flow; anda sheet-shaped thermal conductive member between the metal member and the cooling member, an adhesive surface adhered to the cooling member; and', 'a non-adhesive surface ...